K4000001中文资料
四硼酸钠化学品安全技术说明书
四硼酸钠化学品平安技术说明书说明书目录第一局部：化学品名称第二局部：成分/组成信息第三局部：危险性概述第四局部：急救措施第五局部：消防措施第六局部：泄漏应急处理第七局部：操作处置与储存第八局部：接触控制/个体防护第九局部：理化特性第十局部：稳定性和反响活性第十一局部：毒理学资料第十二局部：生态学资料第十三局部：废弃处置第十四局部：运输信息第十五局部：法规信息第十六局部：其他信息第一局部：化学品名称Cas No.：1303-96-4中文名称：四硼酸钠中文别名：硼砂;月石砂;黄月砂;硼砂(电容器级);四硼酸钠;硼砂(药用);硼酸钠;十水四硼酸钠英文名称：Sodium Tetraborate Decahydrate分子式：B4Na2O7`10H20分子量： 381.3721第二局部：成分/组成信息有害物成分含量 CAS No.四硼酸钠>= 99.01303-96-4第三局部：危险性概述GHS 危险性类别：警示词：危险信息：防说明预防措施：作业后彻底清洗，使用本产品时不要进食、饮水或吸烟。
事故响应：漱口。
如误吞咽：如感觉不适，呼叫中毒急救中心/医生。
平安储存：废弃处置：按照地方/区域/国家/国际规章处置装物/容器。
危害描述物理化学危险：第四局部：急救措施一般性建议：急救措施通常是需要的，请将本 SDS 出示给到达现场的医生。
皮肤接触：立即脱去污染的衣物。
用大量肥皂水和清水冲洗皮肤。
如有不适，就医。
眼睛接触：用大量水彻底冲洗至少 15 分钟。
如有不适，就医。
吸入：立即将患者移到新鲜空气处，保持呼吸畅通。
如果呼吸困难，给于吸氧。
如患者食入或吸入本物质，不得进展口对口人工呼吸。
如果呼吸停止。
立即进展心肺复术。
立即就医。
食入：禁止催吐，切勿给失去知觉者从嘴里喂食任何东西。
立即呼叫医生或中毒控制中心。
对保护施救者的忠告：去除所有火源，增强通风。
防止接触皮肤和眼睛。
防止吸入粉尘。
使用防护装备,包括呼吸面具。
对医生的特别提示：根据出现的病症进展针对性处理。
SN74LS674DWG4中文资料
Copyright © 1988, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date.Products conform to specifications per the terms of Texas Instrumentsstandard warranty. Production processing does not necessarily includetesting of all parameters.POST OFFICE BOX 655303 • DALLAS, TEXAS 752652POST OFFICE BOX 655303 • DALLAS, TEXAS 752653 POST OFFICE BOX 655303 • DALLAS, TEXAS 752654POST OFFICE BOX 655303 • DALLAS, TEXAS 752655 POST OFFICE BOX 655303 • DALLAS, TEXAS 752656POST OFFICE BOX 655303 • DALLAS, TEXAS 75265IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements, improvements,and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right,or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.Reproduction of this information with alteration is an unfair and deceptive business practice.TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications(such as life support)where a failure of the TI product would reasonably be expected to cause severe personal injury or death,unless officers of the parties have executed an agreement specifically governing such use.Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications,and acknowledge and agree that they are solely responsible for all legal,regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications,notwithstanding any applications-related information or support that may be provided by TI.Further,Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or"enhanced plastic."Only products designated by TI as military-grade meet military specifications.Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk,and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS16949requirements.Buyers acknowledge and agree that,if they use anynon-designated products in automotive applications,TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityLow Power /lpw Telephony /telephonyWirelessVideo&Imaging /videoWireless /wirelessMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2007,Texas Instruments IncorporatedIMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements, improvements,and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right,or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.Reproduction of this information with alteration is an unfair and deceptive business practice.TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications(such as life support)where a failure of the TI product would reasonably be expected to cause severe personal injury or death,unless officers of the parties have executed an agreement specifically governing such use.Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications,and acknowledge and agree that they are solely responsible for all legal,regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications,notwithstanding any applications-related information or support that may be provided by TI.Further,Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or"enhanced plastic."Only products designated by TI as military-grade meet military specifications.Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk,and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS16949requirements.Buyers acknowledge and agree that,if they use anynon-designated products in automotive applications,TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityLow Power /lpw Telephony /telephonyWirelessVideo&Imaging /videoWireless /wirelessMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2007,Texas Instruments IncorporatedIMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements, improvements,and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right,or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.Reproduction of this information with alteration is an unfair and deceptive business practice.TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications(such as life support)where a failure of the TI product would reasonably be expected to cause severe personal injury or death,unless officers of the parties have executed an agreement specifically governing such use.Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications,and acknowledge and agree that they are solely responsible for all legal,regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications,notwithstanding any applications-related information or support that may be provided by TI.Further,Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or"enhanced plastic."Only products designated by TI as military-grade meet military specifications.Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk,and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS16949requirements.Buyers acknowledge and agree that,if they use anynon-designated products in automotive applications,TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityLow Power /lpw Telephony /telephonyWirelessVideo&Imaging /videoWireless /wirelessMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2007,Texas Instruments IncorporatedIMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements, improvements,and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right,or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.Reproduction of this information with alteration is an unfair and deceptive business practice.TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications(such as life support)where a failure of the TI product would reasonably be expected to cause severe personal injury or death,unless officers of the parties have executed an agreement specifically governing such use.Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications,and acknowledge and agree that they are solely responsible for all legal,regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications,notwithstanding any applications-related information or support that may be provided by TI.Further,Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or"enhanced plastic."Only products designated by TI as military-grade meet military specifications.Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk,and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS16949requirements.Buyers acknowledge and agree that,if they use anynon-designated products in automotive applications,TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityLow Power /lpw Telephony /telephonyWirelessVideo&Imaging /videoWireless /wirelessMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2007,Texas Instruments IncorporatedIMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements, improvements,and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right,or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.Reproduction of this information with alteration is an unfair and deceptive business practice.TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications(such as life support)where a failure of the TI product would reasonably be expected to cause severe personal injury or death,unless officers of the parties have executed an agreement specifically governing such use.Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications,and acknowledge and agree that they are solely responsible for all legal,regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications,notwithstanding any applications-related information or support that may be provided by TI.Further,Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or"enhanced plastic."Only products designated by TI as military-grade meet military specifications.Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk,and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS16949requirements.Buyers acknowledge and agree that,if they use anynon-designated products in automotive applications,TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityLow Power /lpw Telephony /telephonyWirelessVideo&Imaging /videoWireless /wirelessMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2007,Texas Instruments IncorporatedIMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements, improvements,and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right,or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.Reproduction of this information with alteration is an unfair and deceptive business practice.TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications(such as life support)where a failure of the TI product would reasonably be expected to cause severe personal injury or death,unless officers of the parties have executed an agreement specifically governing such use.Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications,and acknowledge and agree that they are solely responsible for all legal,regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications,notwithstanding any applications-related information or support that may be provided by TI.Further,Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or"enhanced plastic."Only products designated by TI as military-grade meet military specifications.Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk,and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS16949requirements.Buyers acknowledge and agree that,if they use anynon-designated products in automotive applications,TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityLow Power /lpw Telephony /telephonyWirelessVideo&Imaging /videoWireless /wirelessMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2007,Texas Instruments Incorporated。
TAIYOIJR-4000FW100
TAIYO IJR-4000 FW100 FLEXIBLE INKJET LEGEND INKInkjet Application; Fast UV Set CureHigh Hardness after Thermal CureHalogen-free; Bright White ColorExcellent Adhesion to Semi- and Fully-Cured Solder Mask SurfacesRoHS & REACH CompliantHigh Opacity and Non-YellowingCompatible with Lead-Free ProcessingP ROCESSING P ARAMETERS FOR IJR-4000FW100IJR-4000 FW100 is a single component UV curable Inkjet Marking ink for Flexible Printed Circuit Boards. It is applied with a Piezo drop-on-demand (DOD) print head. IJR-4000 FW100 is fast curing and can be applied to both Semi and Fully cured solder mask. Environmental:All Taiyo America products comply with Directive 2002/95/EC of the European Parliament and of the Council of 27 January 2003 on the Restriction of the use of certain Hazardous Substances (RoHS) in electrical and electronic equipment. IJR-4000 FW100 contains no Substances of Very High Concern (SVHC) according to the latest list of substances from the European Chemicals Agency (ECHA) as of October 2010. See the Taiyo America website () for more specific documentation. This is a “halogen-free” material.IJR-4000FW100S PECIFICATIONS: IJR-4000 FW100Viscosity: < 15 cps (cone-plate type, 5 rpm, 35-40°C)Color: WhiteSpecific Gravity: 1.15Surface Tension: 22-24 mN/m at 22°CShelf Life: 3 Months provided the customer has, at alltimes, stored the ink in a dark place at atemperature at 10-20°C (50-68°F)M IXING/D ISPENSING: IJR-4000 FW100 is supplied in a 1 liter bottle containing 1 kg of ink. The ink should be gently stirred well prior to use to make it homogeneous.Do not shake the container as this will introduce bubbles into the ink andwill cause printing defects. No dilution is necessary or recommended.P RE-C LEANING: Prior to legend ink application, the surface of the panel needs to be free of contaminants. Our recommendation is to apply the legend ink on thecircuit board after developing the solder mask. If the legend ink isapplied after solder mask final cure, the surface needs to be cleanedchemically to make sure there are no contaminants on the surface. It isnot a good idea to mechanically scrub the solder mask prior to applyingthe legend ink.P ROCESSING P ARAMETERS FOR IJR-4000FW100I NKJET A PPLICATION: Method: Inkjet printers∙Surface: Semi-Cured or Fully Cured Solder MaskNOTE: Adhesion is affected by the degree of cure of the solder mask.Adhesion is best when the ink is applied to semi-cured soldermask (after development,) and co-cured with the solder mask.Adhesion is also dependent upon the exposure energy and levelof solder mask cure. Best adhesion is obtained with lowerexposure energy (< 600 mJ/cm2). Avoid any UV bump curebefore ink application.∙Typical coating thickness after curing is 10-15 µm. Thicker coatingsmay cause reduced adhesion, hardness and chemical resistance.F INAL C URE:∙Thermal Cure (semi-cure solder mask): 150°C for 55-60 minutes∙Thermal Cure (fully cure solder mask): 150°C for 30-60 minutesNOTE: When applying this product to semi-cured solder mask thelegend ink and solder mask should be co-cured at the sametime.For Process Optimization please contact your local Taiyo RepresentativeTaiyo warrants its products to be free from defects in materials and workmanship for the specified warranty period; IJR-4000 FW100 Warranty period is 3 Months provided the customer has, at all times, stored the ink in a dark place at a temperature of 10°C (50°F). TAIYO accepts no responsibility or liability for damages, whether direct, indirect, or consequential, resulting from failure in the performance of its products. If a TAIYO product is found to be defective in material or workmanship, its liability is limited to the purchase price of the product found to be defective. TAIYO MAKES NO OTHER WARRANTY, EXPRESS OR IMPLIED, AND MAKES NO WARRANTY OF MERCHANTABILITY OR OF FITNESS FOR ANY PARTICULAR PURPOSE. TAIYO'S obligation under this warranty shall not include any transportation charges or costs of installation or any liability for direct, indirect, or consequential damages or delay. If requested by TAIYO, products for which a warranty claim is made are to be returned transportation prepaid to TAIYO'S factory. Any improper use or any alteration of TAIYO'S product by the customer, as in TAIYO'S judgment affects the product materially and adversely, shall void this limited warranty.F INAL P ROPERTIES FOR IJR-4000FW100Test Test Method / Requirement Results Pencil Hardness Internal Test ≥ 3H Adhesion after Cure – Rigid Boards Cross Cut 10 X 10 Tape Test Pass Solder Heat Resistance Solder float test; No-clean Flux; 260 ± 5°C / 10 sec,3 cycles Pass Appearance/Color Visual Inspection Pass Solvent Resistance PGM-Ac, 20°C / 30 min, Tape Test PassAcid & Alkaline Resistance 10 vol.% H2SO4, 20°C / 30 min10 wt.% NaOH 20°C / 30 minPassPassReliabilityTest Test Method / Requirement Results Dielectric Strength Raise DC 500V/sec; 500V minimum Pass (1.3 KV) RoHS Approved 2005/618/EC(IEC62321 Edition 1.0:2008) Pass Halogen-Free JPCA-ES01-2003 PassInsulation Resistance1min in DC100V1min in DC100V after HASLPass – 5.2X1012ΩPass – 4.8X1011ΩMoisture and Insulation Resistance 1min in DC100V after 50°C x 24 hrs1min in DC100V 25-65°C, 85%RH, DC50V for 7daysPass – 3.8X1012ΩPass – 1.4X1011ΩElectromigration 85°C, 90%RH, DC10V for 165 hrsEvaluated by magnificationPassHydrolytic Stability97 ± 2°C, 90-98%RH for 28 daysEvaluated by macrography and ink surface rubPassThermal Shock -65°C for 15 min, to 125°C for 15 min, Transition is less than2 min, 100 cyclesPassCID A-A-56032D PERFORMANCE REQUIREMENTSTest A-A-56032DParagraphTest Method / Requirement ResultsAdhesion 3.7 Cured ink impressions shall not deterioratewhen subjected to trichloroethylene vaporsat 86.5o to 88o C for a period of not less thanthree minutes and not greater than sixminutes.PassElectrical Resistance (Type II) Before ConditioningAfter Conditioning 3.81 x 1012 ohms minimum1 x 1010 ohms minimum5.2 x 10121.4 x 1011Abrasion Resistance 3.9.1 Cured ink impressions shall retain theirlegibility after subjection to 300 to 303revolutions of the CS-10 abrasive wheelwhile under a minimum load of 2.2 poundsin accordance with ASTM D4060.PassChemical Resistance 3.9.2 Cured ink impressions shall retain theirlegibility when immersed for a minimum of30 minutes in water, denatured ethylalcohol, and non-ODC (Ozone DepletingChemical) cleaning solvent.PassChemical Resistance (Type II) 3.9.2.1 In addition to 3.9.2, Type II cured ink shallbe resistant to hot solder and solder flux.Pass Salt Spray Resistance 3.9.3 Cured ink impressions shall not deterioratewhen exposed to a 5 percent salt spraysolution at 33o to 37o C for a period of notless than 48 hours.PassLight Fastness 3.9.4 Cured ink impressions shall not fade andshall remain legible when tested by a lightfastness test. To determine conformance,one half of the surface of the test specimensshall be covered to obscure light, and theremaining half shall be exposed for 24 hoursto the light source outlined in ASTM G153using daylight filter and exposure cycle 7 orASTM G155 using window glass filter andexposure cycle 4.PassStability 3.9.5 Cured ink impressions shall not fade, chip,peel, or flow and shall remain legible whenexposed to a temperature of 118o to +/- 3o Cfor a period of not less than 24 hours.PassFungus Resistance 3.9.6 Cured ink impressions shall not supportfungi growth when inspected.Pass。
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2004-NORSOK-M501
Copyrights reserved
NORSOK standard M-501
Foreword
Introduction
1Leabharlann Scope2 2.1 2.2
Normative and informative references Normative references Informative references
• ISO 20340 has been adopted as pre-qualification test standard for coating systems; • fire testing of aged spray-on passive fire protection has been introduced; • minimum requirements with respect to coating products, number of coats and coating thickness have
4.11 Metal coating
4.12 Records and reports
5
Health, safety and environment
6 6.1 6.2 6.3
Surface preparation Pre-blasting preparations Blast cleaning Final surface condition
Standards Norway Strandveien 18, P.O. Box 242 N-1326 Lysaker NORWAY
Telephone: + 47 67 83 86 00 Fax: + 47 67 83 86 01 Email: petroleum@standard.no Website: www.standard.no/petroleum
550种矿物分类 中英名称 缩写代号 分子式 产状 鉴定特征表
分类矿物名称缩写英文名字分子式晶系综合特征颜 色条痕透明度光泽解 理比 重硬 度01111岛状硅酸盐单个[SiO 4]4- 双四面体[Si 2O 7]6-0111锆石ZrnZircon Zr(SiO 4)四方晶形柱状，单形四方柱、四方双锥纯净无色，常呈黄、黄褐、褐黑色白色透明金刚不完全 4.6-4.77.0-8.00111钍石thorite Th(SiO 4)四方0111铀石Coffinite U(SiO 4)0111?硅锌矿belgiteZn 2[SiO 4 ]三方0111?钪钇石Thortveitite Sc 2[Si 2O 7]0111?赛黄晶danburite CaB 2[SiO 4]2正交0111?水硅铀矿??U[SiO 4 ]四方0112钙橄榄石kalkorthosilicat Ca 2[SiO 4 ]正交0112钙镁橄榄石MtcMonticellite CaMg[SiO 4]正交0112钙锰橄榄石calcioolivine CaMn[SiO 4]正交0112钙铁橄榄石kirschsteinite CaFé[SiO 4]正交0112橄榄石Ol Olivine(Mg,Fe)2[SiO 4]粒状或散粒状黄绿至黑绿白色透明玻璃不完全 3.2-4.4 6.5-7.00112钴橄榄石cobalt olivine Co 2[SiO 4]正交0112镁橄榄石FoForsterite Mg 2[SiO 4]正交0112锰橄榄石tdphroite Mn 2[SiO 4]正交0112锰铁橄榄石ferroknebelite MnFe[SiO 4]正交0112镍橄榄石liebenbergite Ni 2[SiO 4]正交0112铁橄榄石Fa Fayalite Fe 2[SiO 4]正交0113红柱石And Andalusite Al 2+Al 3+[SiO 4]O 正交晶体柱状，集合体呈放射状浅红色，风化为白、灰白白色透明玻璃中等，不完全3.1-3.2 6.5-7.50113空晶石Cht Chiastolite 含炭质包裹体的红柱石碳定向排列0113蓝晶石KyKyanite Al 2[SiO 4]O 三斜晶体呈板条状，集合体为放射状浅蓝色，灰白，绿，粉红色白色透明玻璃完全3.56-3.68平4.5垂60113锰红柱石Viridina (Al 2+,Mn)Al[SiO 4]O 0113矽线石Sil Sillimanite Al[AlSiO 5]正交针状、放射状、纤维状集合体透明，灰白色白色透明玻璃完全 3.23-3.277.001140石榴石石榴子石Grt Garnet (Mg 2+,Fe 2+)3(Al 3+,Fe 3+)2[SiO 4]3 X 3Y 2[SiO 4]3型晶形呈十二面体和四角三八面体，集合体为块状、粒状暗红色，红褐至黑色白色或淡黄色透明玻璃无 3.5-4.37.0-7.50114钙钒榴石GoldmaniteCa 3V 2[SiO 4]3 )立方无0114钙铬榴石绿榴石Uvt Uvarovite Ca 3Cr 2[SiO 4]3稀有，仅见于富含铬铁矿的超基性岩中，找矿翠绿 墨绿无0114钙铝榴石Grs Grossular Ca 3Al 2[SiO 4]3立方矽卡岩中，与白钨矿密切黄 白 红 绿 褐无0114钙铁榴石Adr Andradite Ca 3Fe 2[SiO 4]3立方常和钙铝类质同象，环带构造,产于矽卡岩中，黄 褐 红 褐黑 黑无0114黑榴石Men Melanite 含1-5%TiO 2的钙铁榴石是碱性火成岩的产物无0114镁铬榴石Knorringite Mg 3Cr 2[SiO 4]3无0114镁铝榴石Prp Pyrope Mg 3Al 2[SiO 4]3立方金刚石指示矿物粉红 血红 暗红无0114锰铝榴石SpsSpessartine Mn 3Al 2[SiO 4]3少见，锰矿床接触带或区域变质岩中暗红 黑无0114锰铁榴石Calderite Mn 3Fe 2[SiO 4]3无0114水钙铝榴石Hydrogrossular Ca 3Al 2[SiO 4]3-x (OH)4x0114水榴石(类)Hydrogarnet X 3Y 2[SiO 4]3-x (OH)4x 成份中SiO 2不足。
富通尼特、山东众海消防主机字库、汉字编码表
57016
高
57272
膏
57528
羔
57784
糕
58040
搞
58296
稿
58808
告
59064
哥
59320
歌
59576
戈
60088
鸽
60344
割
61112
革
61368
葛
61624
格
61880
阁
62392
隔
62648
个
63160
各
63416
给
63672
根
63928
耕
64440
更
64696
庚
64952
厂
42931
敞
43187
畅
43443
唱
43699
倡
43955
超
44211
抄
44467
钞
44723
朝
44979
潮
45491
巢
45747
吵
46003
炒
46259
车
46515
扯
46771
撤
47027
彻
47539
澈
47795
郴
48051
臣
48307
辰
48563
尘
48819
晨
49075
沉
49587
陈
49843
翻
44471
樊
44727
繁
45495
凡
45751
烦
46007
反
46263
数字电子技术基础第四版
各数位的权是16的幂
二. 数制与转换
数制 我们最熟悉十进制：十个码元0~9，逢十进一。任意 地，R进制有R个码元，逢R进一． 任意数制之间都可以进行转换，我们常用的是十进制与其 他进制之间的转换。 R进制转换为十进制：将R进制加权求和即可。
例1.1 （11001）2＝( ? )10
解：（11001）2＝1×24＋1×23＋0×22＋0×21＋1 ×20
1.1.2
一.数制
数制和码制
进位制：表示数时，仅用一位数码往往不够用，必须用进位计数的方法组 成多位数码。多位数码每一位的构成以及从低位到高位的进位规则称为进位计数 制，简称进位制。 基 数：进位制的基数，就是在该进位制中可能用到的数码个数。 位 权（位的权数）：在某一进位制的数中，每一位的大小都对应着该位上 的数码乘上一个固定的数，这个固定的数就是这一位的权数。权数是一个幂。
3、十进制数转换为二进制数
采用的方法 — 基数连除、连乘法
原理：将整数部分和小数部分分别进行转换。 整数部分采用基数连除法，小数部分 采用基数连乘法。转换后再合并。
整数部分采用基数连除法， 先得到的余数为低位，后 得到的余数为高位。
2 2 2 2 2 2 44 余数 低位
小数部分采用基数连乘法， 先得到的整数为高位，后 得到的整数为低位。
表1.1 常用的二——十进制编码
十进制数
8421码
0000 0001 0010 0011 0100 0101
余3码 0011
2421码 0000 0001 0010 0011 0100 0101 0110 0111 1110 1111 2421
右移码 00000 10000 11000 11100 11110 11111
K4T1G084QQ资料
1Gb Q-die DDR2 SDRAM Specification60FBGA & 84FBGA with Pb-Free & Halogen-Free(RoHS compliant)INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE.NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE,TO ANY INTELLECTUAL PROPERTY RIGHTS IN SAMSUNG PRODUCTS OR TECHNOLOGY. ALL INFORMATION IN THIS DOCUMENT IS PROVIDEDON AS "AS IS" BASIS WITHOUT GUARANTEE OR WARRANTY OF ANY KIND.1. For updates or additional information about Samsung products, contact your nearest Samsung office.2. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or similar applications where Product failure couldresult in loss of life or personal or physical harm, or any military or defense application, or any governmental procurement to which special terms or provisions may apply.* Samsung Electronics reserves the right to change products or specification without notice.Table of Contents1.0 Ordering Information (4)2.0 Key Features (4)3.0 Package Pinout/Mechanical Dimension & Addressing (5)3.1 x4/x8 package pinout (Top View) : 60ball FBGA Package (5)3.2 x16 package pinout (Top View) : 84ball FBGA Package (6)3.3 FBGA Package Dimension (x4/x8) (7)3.4 FBGA Package Dimension (x16) (8)4.0 Input/Output Functional Description (9)5.0 DDR2 SDRAM Addressing (10)6.0 Absolute Maximum DC Ratings (11)7.0 AC & DC Operating Conditions (11)7.1 Recommended DC Operating Conditions (SSTL - 1.8) (11)7.2 Operating Temperature Condition (12)7.3 Input DC Logic Level (12)7.4 Input AC Logic Level (12)7.5 AC Input Test Conditions (12)7.6 Differential input AC logic Level (13)7.7 Differential AC output parameters (13)8.0 ODT DC electrical characteristics (13)9.0 OCD default characteristics (14)10.0 IDD Specification Parameters and Test Conditions (15)11.0 DDR2 SDRAM IDD Spec Table (17)12.0 Input/Output capacitance (18)13.0 Electrical Characteristics & AC Timing for DDR2-800/667 (18)13.1 Refresh Parameters by Device Density (18)13.2 Speed Bins and CL, tRCD, tRP, tRC and tRAS for Corresponding Bin (18)13.3 Timing Parameters by Speed Grade (19)14.0 General notes, which may apply for all AC parameters (21)15.0 Specific Notes for dedicated AC parameters (23)Revision HistoryRevision Month Year History1.0September2007 - Initial Release1.01November2007 - Typo CorrectionSpeed DDR2-800 5-5-5DDR2-800 6-6-6DDR2-667 5-5-5Units CAS Latency 565tCK tRCD(min)12.51515ns tRP(min)12.51515ns tRC(min)57.56060nsNote :1. Speed bin is in order of CL-tRCD-tRP.2. RoHS Compliant.3. “H” of Part number(12th digit) stand for RoHS compliant and Halogen-free products.Org.DDR2-800 5-5-5DDR2-800 6-6-6DDR2-667 5-5-5Package 256Mx4K4T1G044QQ-HC(L)E7K4T1G044QQ-HC(L)F7K4T1G044QQ-HC(L)E660 FBGA 128Mx8K4T1G084QQ-HC(L)E7K4T1G084QQ-HC(L)F7K4T1G084QQ-HC(L)E660 FBGA 64Mx16K4T1G164QQ-HC(L)E7K4T1G164QQ-HC(L)F7K4T1G164QQ-HC(L)E684 FBGA•JEDEC standard 1.8V ± 0.1V Power Supply •VDDQ = 1.8V ± 0.1V•333MHz f CK for 667Mb/sec/pin, 400MHz f CK for 800Mb/sec/pin •8 Banks •Posted CAS•Programmable CAS Latency: 3, 4, 5, 6•Programmable Additive Latency: 0, 1, 2, 3, 4, 5•Write Latency(WL) = Read Latency(RL) -1•Burst Length: 4 , 8(Interleave/nibble sequential)•Programmable Sequential / Interleave Burst Mode •Bi-directional Differential Data-Strobe (Single-ended data-strobe is an optional feature)•Off-Chip Driver(OCD) Impedance Adjustment •On Die Termination•Special Function Support- PASR(Partial Array Self Refresh)- 50ohm ODT- High Temperature Self-Refresh rate enable •Average Refresh Period 7.8us at lower than T CASE 85°C, 3.9us at 85°C < T CASE < 95 °C •All of Lead-free products are compliant for RoHSThe 1Gb DDR2 SDRAM is organized as a 32Mbit x 4 I/Os x 8banks, 16Mbit x 8 I/Os x 8banks or 8Mbit x 16 I/Os x 8 banks device. This synchronous device achieves high speed double-data-rate transfer rates of up to 800Mb/sec/pin (DDR2-800) for general applications.The chip is designed to comply with the following key DDR2SDRAM features such as posted CAS with additive latency, write latency = read latency - 1, Off-Chip Driver(OCD) impedance adjustment and On Die Termination.All of the control and address inputs are synchronized with a pair of externally supplied differential clocks. Inputs are latched at the crosspoint of differential clocks (CK rising and CK falling). All I/Os are synchronized with a pair of bidirectional strobes (DQS and DQS) in a source synchronous fashion. The address bus is used to convey row, column, and bank address information in a RAS/CAS multiplexing style. For example, 1Gb(x8) device receive 14/10/3 addressing.The 1Gb DDR2 device operates with a single 1.8V ±0.1V power supply and 1.8V ±0.1V VDDQ.The 1Gb DDR2 device is available in 60ball FBGAs(x4/x8) and in 84ball FBGAs(x16).Note : The functionality described and the timing specifications included in this data sheet are for the DLL Enabled mode of operation.Note : This data sheet is an abstract of full DDR2 specification and does not cover the common features which are described in “DDR2 SDRAM Device Operation & Timing Diagram”.1.0 Ordering Information2.0 Key FeaturesNote:1. Pins B3 and A2 have identical capacitance as pins B7 and A8.2. For a read, when enabled, strobe pair RDQS & RDQS are identical in function and timing to strobe pair DQS & DQS and input masking function is disabled.3. The function of DM or RDQS/RDQS are enabled by EMRS command.4. VDDL and VSSDL are power and ground for the DLL.A B C D E F G H J K LVDD NU/VSSDQ6VSSQ VDDQ VDDQ VDDQ VSSQ VSSQ DQS DQS DQ7DQ0VDDQ DQ2VSSQ DQ5VSSDL VDD CK RAS CK CAS CS A2A6A4A11A8NCA13NCA12A9A7A5A0VDD A10/APVSSVDDQ VSSQ DQ1DQ3DQ4VDDLA1A3BA1VREF VSS CKEWE BA01 2 3 7 8 9VDDVSS ODTBA2Ball Locations (x4/x8): Populated Ball +: Depopulated BallTop View (See the balls through the Package)++++++++++++++++++++++++++++++123456789A B C D E F G H J K L++++++++DM /RDQSRDQS+3.1 x4/x8 package pinout (Top View) : 60ball FBGA Package3.0 Package Pinout/Mechanical Dimension & AddressingNote :1. VDDL and VSSDL are power and ground for the DLL.2. In case of only 8 DQs out of 16 DQs are used, LDQS, LDQSB and DQ0~7 must be used.A B C D E F G H J K L VDD NC VSS DQ14VSSQ UDM VDDQ VDDQ VDDQ VSSQ VSSQ UDQS UDQS DQ15DQ8VDDQ DQ10VSSQ DQ13VSSQ VDDQ RAS CK CAS CS A2A6A4A11A8NCNCNCA12A9A7A5A0VDDA10/APVSSVDDQ VSSQ DQ9DQ11DQ12VDD A1A3BA1NC VSS CKEWE BA0 1 2 3 7 8 9VDDVSSODTBA2Ball Locations (x16): Populated Ball +: Depopulated BallTop View (See the balls through the Package)M N P RDQ6VSSQ LDM VDDQ VDDQ VSSQ LDQS DQ7DQ0VDDQ DQ2VSSQ DQ5VSSDL VDD CK VDDQ VSSQ DQ1DQ3DQ4VDDLVREF VSS LDQS 123456789++++++++++++++++++++++++++++++++++++++++++++++++++A B C D E F G H J K L M N P R+3.2 x16 package pinout (Top View) : 84ball FBGA Package3.3 FBGA Package Dimension (x4/x8)A B CD E F H J K LG3.4 FBGA Package Dimension (x16)A B C D E FH J K L M N P RGSymbol Type FunctionCK, CK Input Clock:CK and CK are differential clock inputs. All address and control input signals are sampled on the crossing of the positive edge of CK and negative edge of CK. Output (read) data is referenced to the crossings of CK and CK (both directions of crossing).CKE Input Clock Enable: CKE HIGH activates, and CKE Low deactivates, internal clock signals and device input buffers and out-put drivers. Taking CKE Low provides Precharge Power-Down and Self Refresh operation (all banks idle), or Active Power-Down (row Active in any bank). CKE is synchronous for power down entry and exit, and for self refresh entry. CKE is asynchronous for self refresh exit. After V REF has become stable during the power on and initialization swquence, it must be maintained for proper operation of the CKE receiver. For proper self-refresh entry and exit, V REF must be maintained to this input. CKE must be maintained high throughout read and write accesses. Input buffers, excluding CK, CK, ODT and CKE are disabled during power-down. Input buffers, excluding CKE, are disabled during self refresh.CS Input Chip Select: All commands are masked when CS is registered HIGH. CS provides for external Rank selection on sys-tems with multiple Ranks. CS is considered part of the command code.ODT Input On Die Termination: ODT (registered HIGH) enables termination resistance internal to the DDR2 SDRAM. When enabled, ODT is only applied to each DQ, DQS, DQS, RDQS, RDQS, and DM signal for x4/x8 configurations. For x16 configuration ODT is applied to each DQ, UDQS/UDQS, LDQS/LDQS, UDM, and LDM signal. The ODT pin will be ignored if the Extended Mode Register (EMRS(1)) is programmed to disable ODT.RAS, CAS, WE Input Command Inputs: RAS, CAS and WE (along with CS) define the command being entered.DM Input Input Data Mask: DM is an input mask signal for write data. Input data is masked when DM is sampled HIGH coinci-dent with that input data during a Write access. DM is sampled on both edges of DQS. Although DM pins are input only, the DM loading matches the DQ and DQS loading. For x8 device, the function of DM or RDQS/RDQS is enabled by EMRS command.BA0 - BA2Input Bank Address Inputs: BA0, BA1 and BA2 define to which bank an Active, Read, Write or Precharge command is being applied. Bank address also determines if the mode register or extended mode register is to be accessed during a MRS or EMRS cycle.A0 - A13Input Address Inputs: Provided the row address for Active commands and the column address and Auto Precharge bit for Read/Write commands to select one location out of the memory array in the respective bank. A10 is sampled during a Precharge command to determine whether the Precharge applies to one bank (A10 LOW) or all banks (A10 HIGH). If only one bank is to be precharged, the bank is selected by BA0, BA1. The address inputs also provide the op-code dur-ing Mode Register Set commands.DQ Input/Out-putData Input/ Output: Bi-directional data bus.DQS, (DQS)(LDQS), (LDQS) (UDQS), (UDQS) (RDQS), (RDQS)Input/Out-putData Strobe: output with read data, input with write data. Edge-aligned with read data, centered in write data. For the x16, LDQS corresponds to the data on DQ0-DQ7; UDQS corresponds to the data on DQ8-DQ15. For the x8, an RDQS option using DM pin can be enabled via the EMRS(1) to simplify read timing. The data strobes DQS, LDQS, UDQS, and RDQS may be used in single ended mode or paired with optional complementary signals DQS, LDQS, UDQS, and RDQS to provide differential pair signaling to the system during both reads and writes. An EMRS(1) control bit enables or disables all complementary data strobe signals.In this data sheet, "differential DQS signals" refers to any of the following with A10 = 0 of EMRS(1)x4 DQS/DQSx8 DQS/DQS if EMRS(1)[A11] = 0x8 DQS/DQS, RDQS/RDQS, if EMRS(1)[A11] = 1x16 LDQS/LDQS and UDQS/UDQS"single-ended DQS signals" refers to any of the following with A10 = 1 of EMRS(1)x4 DQSx8 DQS if EMRS(1)[A11] = 0x8 DQS, RDQS, if EMRS(1)[A11] = 1x16 LDQS and UDQSNC No Connect: No internal electrical connection is present.V DD/V DDQ Supply Power Supply: 1.8V +/- 0.1V, DQ Power Supply: 1.8V +/- 0.1V V SS/V SSQ Supply Ground, DQ GroundV DDL Supply DLL Power Supply: 1.8V +/- 0.1VV SSDL Supply DLL GroundV REF Supply Reference voltage4.0 Input/Output Functional Description5.0 DDR2 SDRAM Addressing1Gb AddressingConfiguration256Mb x4128Mb x 864Mb x16 # of Bank888Bank Address BA0 ~ BA2BA0 ~ BA2BA0 ~ BA2Auto precharge A10/AP A10/AP A10/APRow Address A0 ~ A13A0 ~ A13A0 ~ A12Column Address A0 ~ A9,A11A0 ~ A9A0 ~ A9 * Reference information: The following tables are address mapping information for other densities.256MbConfiguration64Mb x432Mb x 816Mb x16 # of Bank444Bank Address BA0,BA1BA0,BA1BA0,BA1Auto precharge A10/AP A10/AP A10/APRow Address A0 ~ A12A0 ~ A12A0 ~ A12Column Address A0 ~ A9,A11A0 ~ A9A0 ~ A8512MbConfiguration128Mb x464Mb x 832Mb x16 # of Bank444Bank Address BA0,BA1BA0,BA1BA0,BA1Auto precharge A10/AP A10/AP A10/APRow Address A0 ~ A13A0 ~ A13A0 ~ A12Column Address A0 ~ A9,A11A0 ~ A9A0 ~ A92GbConfiguration512Mb x4256Mb x 8128Mb x16 # of Bank888Bank Address BA0 ~ BA2BA0 ~ BA2BA0 ~ BA2Auto precharge A10/AP A10/AP A10/APRow Address A0 ~ A14A0 ~ A14A0 ~ A13Column Address A0 ~ A9,A11A0 ~ A9A0 ~ A9 4GbConfiguration 1 Gb x4512Mb x 8256Mb x16 # of Bank888Bank Address BA0 ~ BA2BA0 ~ BA2BA0 ~ BA2Auto precharge A10/AP A10/AP A10/APRow Address A0 - A15A0 - A15A0 - A14 Column Address/page size A0 - A9,A11 A0 - A9 A0 - A9Note :1. Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.2. Storage Temperature is the case surface temperature on the center/top side of the DRAM.Symbol ParameterRating Units Notes V DD Voltage on V DD pin relative to V SS - 1.0 V ~ 2.3 V V 1V DDQ Voltage on V DDQ pin relative to V SS - 0.5 V ~ 2.3 V V 1V DDL Voltage on V DDL pin relative to V SS - 0.5 V ~ 2.3 V V 1V IN, V OUT Voltage on any pin relative to V SS - 0.5 V ~ 2.3 V V1T STGStorage Temperature-55 to +100°C 1, 2Note : There is no specific device V DD supply voltage requirement for SSTL-1.8 compliance. However under all conditions V DDQ must be less than or equalto V DD .1. The value of V REF may be selected by the user to provide optimum noise margin in the system. Typically the value of V REF is expected to be about 0.5 x V DDQ of the transmitting device and V REF is expected to track variations in V DDQ .2. Peak to peak AC noise on V REF may not exceed +/-2% V REF (DC).3. V TT of transmitting device must track V REF of receiving device.4. AC parameters are measured with V DD , V DDQ and V DDL tied together.Symbol ParameterRatingUnits NotesMin.Typ. Max.V DD Supply Voltage 1.7 1.8 1.9V V DDL Supply Voltage for DLL 1.7 1.8 1.9V 4V DDQ Supply Voltage for Output 1.7 1.8 1.9V 4V REF Input Reference Voltage 0.49*V DDQ 0.50*V DDQ0.51*V DDQ mV 1,2V TTTermination VoltageV REF -0.04V REFV REF +0.04V37.0 AC & DC Operating Conditions6.0 Absolute Maximum DC Ratings7.1 Recommended DC Operating Conditions (SSTL - 1.8)7.2 Operating Temperature Condition1.Operating Temperature is the case surface temperature on the center/top side of the DRAM.2.At 85 - 95 °C operation temperature range, doubling refresh commands in frequency to a 32ms period ( tREFI=3.9 us ) is required, and to enter to self refresh mode at this temperature range, an EMRS command is required to change internal refresh rate.7.3 Input DC Logic Level7.4 Input AC Logic Level7.5 AC Input Test ConditionsNote :1. Input waveform timing is referenced to the input signal crossing through the V IH/IL (AC) level applied to the device under test.2. The input signal minimum slew rate is to be maintained over the range from V REF to V IH (AC) min for rising edges and the range from V REF to V IL (AC)max for falling edges as shown in the below figure.3. AC timings are referenced with input waveforms switching from V IL (AC) to V IH (AC) on the positive transitions and V IH (AC) to V IL (AC) on the negative transitions.Symbol Parameter Rating UnitsNotesTOPEROperating Temperature0 to 95°C 1, 2Symbol Parameter Min.Max.Units NotesV IH (DC)DC input logic high V REF + 0.125V DDQ + 0.3V V IL (DC)DC input logic low- 0.3V REF - 0.125VSymbol ParameterDDR2-667, DDR2-800Units Min.Max.V IH (AC)AC input logic high V REF + 0.200V V IL (AC)AC input logic lowV REF - 0.200VSymbol Condition Value Units Notes V REF Input reference voltage0.5 * V DDQV 1V SWING(MAX)Input signal maximum peak to peak swing1.0V 1SLEWInput signal minimum slew rate1.0V/ns2, 3V DDQ V IH (AC) minV IH (DC) min V REFV IL (DC) max V IL (AC) maxV SS< AC Input Test Signal Waveform >V SWING(MAX)delta TRdelta TFV REF - V IL (AC) maxdelta TFFalling Slew =Rising Slew =V IH (AC) min - V REFdelta TRV DDQCrossing pointV SSQV TR V CPV IDV IX or V OX< Differential signal levels >7.6 Differential input AC logic LevelNote :1. V ID (AC) specifies the input differential voltage |V TR -V CP | required for switching, where V TR is the true input signal (such as CK, DQS, LDQS or UDQS) and V CP is the complementary input signal (such as CK, DQS, LDQS or UDQS). The minimum value is equal to V IH (AC) - V IL (AC).2. The typical value of V IX (AC) is expected to be about 0.5 * VDDQ of the transmitting device and V IX (AC) is expected to track variations in VDDQ . V IX (AC) indicates the voltage at which differential input signals must cross.7.7 Differential AC output parametersNote :1. The typical value of V OX (AC) is expected to be about 0.5 * VDDQ of the transmitting device and V OX (AC) is expected to track variations in VDDQ . V OX (AC) indicates the voltage at which differential output signals must cross.Symbol ParameterMin.Max.Units Notes V ID(AC)AC differential input voltage 0.5V DDQ + 0.6V 1V IX(AC)AC differential cross point voltage0.5 * VDDQ - 0.1750.5 * VDDQ + 0.175V2Symbol ParameterMin.Max.Units Note V OX (AC)AC differential cross point voltage0.5 * VDDQ - 0.1250.5 * VDDQ + 0.125V1Note : Test condition for Rtt measurementsMeasurement Definition for Rtt(eff):Apply V IH (ac) and V IL (ac) to test pin separately, then measure current I(V IH (ac)) and I( V IL (ac)) respectively. V IH (ac), V IL (ac), and VDDQ values defined in SSTL_18Measurement Definition for VM: Measure voltage (V M ) at test pin (midpoint) with no load.PARAMETER/CONDITIONSYMBOL MIN NOM MAX UNITS NOTES Rtt effective impedance value for EMRS(A6,A2)=0,1; 75 ohm Rtt1(eff)607590ohm 1Rtt effective impedance value for EMRS(A6,A2)=1,0; 150 ohm Rtt2(eff)120150180ohm 1Rtt effective impedance value for EMRS(A6,A2)=1,1; 50 ohm Rtt3(eff)405060ohm 1Deviation of VM with respect to VDDQ/2delta VM- 6+ 6%1Rtt(eff) =V IH (ac) - V IL (ac)I(V IH (ac)) - I(V IL (ac))delta VM =2 x Vm VDDQx 100%- 18.0 ODT DC electrical characteristicsNote :1. Absolute Specifications (0°C ≤ T CASE ≤ +95°C; VDD = +1.8V ±0.1V, VDDQ = +1.8V ±0.1V)2. Impedance measurement condition for output source dc current: VDDQ = 1.7V; VOUT = 1420mV; (VOUT-VDDQ)/Ioh must be less than 23.4 ohms for values of VOUT between VDDQ and VDDQ- 280mV. Impedance measurement condition for output sink dc current: VDDQ = 1.7V; VOUT = 280mV; VOUT/Iol must be less than 23.4 ohms for values of VOUT between 0V and 280mV.3. Mismatch is absolute value between pull-up and pull-dn, both are measured at same temperature and voltage.4. Slew rate measured from V IL (AC) to V IH (AC).5. The absolute value of the slew rate as measured from DC to DC is equal to or greater than the slew rate as measured from AC to AC. This is guaranteed by design and characterization.6. This represents the step size when the OCD is near 18 ohms at nominal conditions across all process and represents only the DRAM uncertainty. Output slew rate load :7. DRAM output slew rate specification applies to 667Mb/sec/pin and 800Mb/sec/pin speed bins.8. Timing skew due to DRAM output slew rate mis-match between DQS / DQS and associated DQs is included in tDQSQ and tQHS specification.DescriptionParameterMinNomMaxUnit Notes Output impedanceNormal 18ohmsSee full strength default driver characteristics ohms 1,2Output impedance step size for OCD calibration 0 1.5ohms 6Pull-up and pull-down mismatch 04ohms 1,2,3Output slew rateSout 1.55V/ns1,4,5,6,7,825 ohmsV TTOutput (V OUT)Reference Point9.0 OCD default characteristics(IDD values are for full operating range of Voltage and Temperature, Notes 1 - 5)Symbol Proposed Conditions Units NotesIDD0Operating one bank active-precharge current;t CK = t CK(IDD), t RC = t RC(IDD), t RAS = t RASmin(IDD); CKE is HIGH, CS\ is HIGH between valid commands;Address bus inputs are SWITCHING; Data bus inputs are SWITCHINGmAIDD1Operating one bank active-read-precharge current;IOUT = 0mA; BL = 4, CL = CL(IDD), AL = 0; t CK = t CK(IDD), t RC = t RC (IDD), t RAS = t RASmin(IDD), t RCD =t RCD(IDD); CKE is HIGH, CS\ is HIGH between valid commands; Address businputs are SWITCHING; Data pat-tern is same as IDD4WmAIDD2P Precharge power-down current;All banks idle; t CK = t CK(IDD); CKE is LOW; Other control and address bus inputs are STABLE; Data bus inputs are FLOATINGmAIDD2Q Precharge quiet standby current;All banks idle; t CK = t CK(IDD); CKE is HIGH, CS\ is HIGH; Other control and address bus inputsare STABLE; Databus inputs are FLOATINGmAIDD2N Precharge standby current;All banks idle; t CK = t CK(IDD); CKE is HIGH, CS\ is HIGH; Other control and address bus inputs are SWITCHING;Data bus inputs are SWITCHINGmAIDD3P Active power-down current;All banks open; t CK = t CK(IDD); CKE is LOW; Other control and address businputs are STABLE; Data bus inputs are FLOATINGFast PDN Exit MRS(12) = 0mASlow PDN Exit MRS(12) = 1mAIDD3N Active standby current;All banks open; t CK = t CK(IDD), t RAS = t RASmax(IDD), t RP = t RP(IDD); CKE is HIGH, CS\ is HIGH between valid commands; Other control and address bus inputs are SWITCHING; Data bus inputs are SWITCHINGmAIDD4W Operating burst write current;All banks open, Continuous burst writes; BL = 4, CL = CL(IDD), AL = 0; t CK = t CK(IDD), t RAS = t RASmax(IDD), t RP= t RP(IDD); CKE is HIGH, CS\ is HIGH between valid commands; Address bus inputs are SWITCHING; Data businputs are SWITCHINGmAIDD4R Operating burst read current;All banks open, Continuous burst reads, IOUT = 0mA; BL = 4, CL = CL(IDD), AL = 0; t CK = t CK(IDD), t RAS = t RAS-max(IDD), t RP = t RP(IDD); CKE is HIGH, CS\ is HIGH between valid commands; Address bus inputs are SWITCH-ING; Data pattern is same as IDD4WmAIDD5B Burst auto refresh current;t CK = t CK(IDD); Refresh command at every t RFC(IDD) interval; CKE is HIGH, CS\ is HIGH between valid com-mands; Other control and address bus inputs are SWITCHING; Data bus inputs are SWITCHINGmAIDD6Self refresh current;CK and CK\ at 0V; CKE ≤ 0.2V; Other control and address bus inputs areFLOATING; Data bus inputs are FLOATINGNormal mALow Power mAIDD7Operating bank interleave read current;All bank interleaving reads, IOUT = 0mA; BL = 4, CL = CL(IDD), AL = t RCD(IDD)-1*t CK(IDD); t CK = t CK(IDD), t RC= t RC(IDD), t RRD = t RRD(IDD), t FAW = t FAW(IDD), t RCD = 1*t CK(IDD); CKE is HIGH, CS\ is HIGH between valid commands; Address bus inputs are STABLE during DESELECTs; Data pattern is same as IDD4R; Refer to the fol-lowing page for detailed timing conditionsmA10.0 IDD Specification Parameters and Test ConditionsNote :1. IDD specifications are tested after the device is properly initialized2. Input slew rate is specified by AC Parametric Test Condition3. IDD parameters are specified with ODT disabled.4. Data bus consists of DQ, DM, DQS, DQS\, RDQS, RDQS\, LDQS, LDQS\, UDQS, and UDQS\. IDD values must be met with all combinations of EMRS bits 10 and 11.5. Definitions for IDD LOW is defined as Vin ≤ VILAC(max) HIGH is defined as Vin ≥ VIHAC(min)STABLE is defined as inputs stable at a HIGH or LOW level FLOATING is defined as inputs at VREF = VDDQ/2 SWITCHING is defined as:inputs changing between HIGH and LOW every other clock cycle (once per two clocks) for address and controlsignals, and inputs changing between HIGH and LOW every other data transfer (once per clock) for DQ signals not including masks or strobes.For purposes of IDD testing, the following parameters are utilizedDetailed IDD7The detailed timings are shown below for IDD7.Legend: A = Active; RA = Read with Autoprecharge; D = DeselectIDD7: Operating Current: All Bank Interleave Read operationAll banks are being interleaved at minimum t RC(IDD) without violating t RRD(IDD) and t FAW(IDD) using a burst length of 4. Control and address bus inputs are STABLE during DESELECTs. IOUT = 0mATiming Patterns for 8bank devices x4/ x8-DDR2-667 5/5/5 : A0 RA0 D A1 RA1 D A2 RA2 D A3 RA3 D D A4 RA4 D A5 RA5 D A6 RA6 D A7 RA7 D D-DDR2-800 6/6/6 : A0 RA0 D A1 RA1 D A2 RA2 D A3 RA3 D D D A4 RA4 D A5 RA5 D A6 RA6 D A7 RA7 D D D -DDR2-800 5/5/5 : A0 RA0 D A1 RA1 D A2 RA2 D A3 RA3 D D D A4 RA4 D A5 RA5 D A6 RA6 D A7 RA7 D D DTiming Patterns for 8bank devices x16-DDR2-667 5/5/5 : A0 RA0 D D A1 RA1 D D A2 RA2 D D A3 RA3 D D D A4 RA4 D D A5 RA5 D D A6 RA6 D D A7 RA7 D D D-DDR2-800 6/6/6 : A0 RA0 D D A1 RA1 D D A2 RA2 D D A3 RA3 D D D D A4 RA4 D D A5 RA5 D D A6 RA6 D D A7 RA7 D D D D -DDR2-800 5/5/5 : A0 RA0 D D A1 RA1 D D A2 RA2 D D A3 RA3 D D D D A4 RA4 D D A5 RA5 D D A6 RA6 D D A7 RA7 D D D DDDR2-800DDR2-800DDR2-667Units Parameter 5-5-56-6-65-5-5CL(IDD)565tCK t RCD(IDD)12.51515ns t RC(IDD)57.56060ns t RRD(IDD)-x4/x87.57.57.5ns t RRD(IDD)-x16101010ns t CK(IDD) 2.5 2.53ns t RASmin(IDD)454545ns t RP(IDD)12.51515ns t RFC(IDD)127.5127.5127.5ns(T A=0o C, VDD= 1.9V)Symbol256Mx4 (K4T1G044QQ)Unit Notes 800@CL=5800@CL=6667@CL=5CE7LE7CF7LF7CE6LE6IDD0757570mAIDD1858580mAIDD2P158158158mAIDD2Q303030mAIDD2N353535mAIDD3P-F353535mAIDD3P-S181818mAIDD3N555550mAIDD4W110110100mAIDD4R130130115mAIDD5140140135mAIDD6156156156mAIDD7245245225mA(T A=0o C, VDD= 1.9V)Symbol128Mx8 (K4T1G084QQ)Unit Notes 800@CL=5800@CL=6667@CL=5CE7LE7CF7LF7CE6LE6IDD0757570mAIDD1858580mAIDD2P158158158mAIDD2Q303030mAIDD2N353535mAIDD3P-F353535mAIDD3P-S181818mAIDD3N555550mAIDD4W115115105mAIDD4R135135120mAIDD5145145140mAIDD6156156156mAIDD7250250230mA11.0 DDR2 SDRAM IDD Spec Table(T A=0o C, VDD= 1.9V)Symbol64Mx16 (K4T1G164QQ)Unit Notes 800@CL=5800@CL=6667@CL=5CE7LE7CF7LF7CE6LE6IDD0909085mA IDD110010095mA IDD2P158158158mA IDD2Q303030mA IDD2N353535mA IDD3P-F353535mA IDD3P-S181818mA IDD3N555550mA IDD4W130130115mA IDD4R175175155mA IDD5145145140mA IDD6156156156mA IDD7265265245mASpeedDDR2-800(E7)DDR2-800(F7)DDR2-667(E6)UnitsBin (CL - tRCD - tRP)5-5-56-6-65 - 5 - 5Parameter min max min max min max tCK, CL=358--58ns tCK, CL=4 3.758 3.758 3.758ns tCK, CL=5 2.583838ns tCK, CL=6-- 2.58--ns tRCD 12.5-15-15-ns tRP 12.5-15-15-ns tRC 57.5-60-60-ns tRAS457000045700004570000ns ParameterSymbol DDR2-667DDR2-800Units Min Max Min Max Input capacitance, CK and CK CCK 1.0 2.0 1.0 2.0pF Input capacitance delta, CK and CK CDCK x 0.25x 0.25pF Input capacitance, all other input-only pins CI 1.0 2.0 1.0 1.75pF Input capacitance delta, all other input-only pins CDI x 0.25x 0.25pF Input/output capacitance, DQ, DM, DQS, DQS CIO 2.5 3.5 2.5 3.5pF Input/output capacitance delta, DQ, DM, DQS, DQSCDIOx0.5x0.5pF13.0 Electrical Characteristics & AC Timing for DDR2-800/667(0 °C < T OPER < 95 °C; V DDQ = 1.8V + 0.1V; V DD = 1.8V + 0.1V)13.1 Refresh Parameters by Device DensityParameterSymbol256Mb 512Mb 1Gb 2Gb 4Gb Units Refresh to active/Refresh command time tRFC 75105127.5195327.5ns Average periodic refresh intervaltREFI0 °C ≤ T CASE ≤ 85°C 7.87.87.87.87.8µs 85 °C < T CASE ≤ 95°C3.93.93.93.93.9µs13.2 Speed Bins and CL, tRCD, tRP, tRC and tRAS for Corresponding Bin 12.0 Input/Output capacitance。
杭州市在册市场主体的企业信息(杭州)
万户 万户 万户 万户 万户 万户 万户 万户 万户 万户 万户 万户 万户 万户 万户
对比项 累计比去年同期增长% 累计比去年同期增长% 累计比去年同期增长% 累计比去年同期增长% 累计比去年同期增长% 累计比去年同期增长% 累计比去年同期增长% 累计比去年同期增长% 累计比去年同期增长% 累计比去年同期增长% 累计比去年同期增长% 累计比去年同期增长% 累计比去年同期增长% 累计比去年同期增长% 累计比去年同期增长%
累计 累计 累计 累计 累计 累计 累计 累计 累计 累计 累计 累计 累计 累计 累计
频度 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1
地区代码 330100 330100 330100 330100 330100 330100 330100 330100 33100 330100 330100 330100 330100 330100 330100 330100 330100 330100 330100 330100 330100 330100 330100 330100 330100 330100
期别 202002 202001 201911 201912 201901 201903 201902 201904 201907 201906 201905 202003 201909 201910 201908 202002 202001 201911 201912 201901 201903 201902 201904 201907 201906 201905 202003 201909 201910 201908
编号 3835285 3835286 3835287 3835288 3835289 3835290 3835291 3835292 3835293 3835294 3835295 3835296 3835297 3835298 3835299 3835300 3835301 3835302 3835303 3835304 3835305 3835306 3835307 3835308 3835309 3835310 3835311 3835312 3835313 3835314
K4
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LC1K09004P7产品数据手册说明书
LC1K09004P7i s c l a i me r : T h i s d o c u m e n t a t i o n i s n o t i n t e n d e d a s a s u b s t i t u t ef o r a n d i s n o t t o b e u s e d f o r d e t e r m i n i ng s u i t a b i l i t y o r r e l i a b i l i t y o f th e s e p r o d u c t s f o r s p e ci f i c u s e r a p p l i c a t i o n sProduct datasheetCharacteristicsLC1K09004P7TeSys K contactor - 4P (4 NO) - AC-1 <= 440 V 20 A - 230 V AC coilMainRange of product TeSys K RangeTeSys Product or component type Contactor Product name TeSys K Device short name LC1K Device application Control Contactor applicationResistive loadComplementaryUtilisation category AC-1Poles description 4P Pole contact composition 4 NO[Ue] rated operational voltage 690 V AC 50/60 Hz for power circuit[Ie] rated operational current 20 A (<= 50 °C) at <= 440 V AC AC-1 for power circuit 16 A (<= 70 °C) at 690 V AC AC-1 for power circuit Control circuit type AC 50/60 Hz Control circuit voltage230 V AC 50/60 Hz [Uimp] rated impulse withstand voltage 8 kV Overvoltage categoryIII[Ith] conventional free air thermal current20 A at <= 50 °C for power circuitIrms rated making capacity 110 A AC for power circuit conforming to NF C 63-110110 A AC for power circuit conforming to IEC 60947Rated breaking capacity110 A at 415 V conforming to IEC 60947110 A at 440 V conforming to IEC 6094780 A at 500 V conforming to IEC 60947110 A at 220...230 V conforming to IEC 60947110 A at 380...400 V conforming to IEC 6094770 A at 660...690 V conforming to IEC 60947[Icw] rated short-time withstand current90 A <= 50 °C 1 s power circuit85 A <= 50 °C 5 s power circuit80 A <= 50 °C 10 s power circuit60 A <= 50 °C 30 s power circuit45 A <= 50 °C 1 min power circuit40 A <= 50 °C 3 min power circuit20 A <= 50 °C >= 15 s power circuitAssociated fuse rating25 A gG at <= 440 V for power circuit25 A aM for power circuitAverage impedance 3 mOhm at 50 Hz - Ith 20 A for power circuit[Ui] rated insulation voltage600 V for power circuit conforming to CSA C22.2 No 14690 V for power circuit conforming to IEC 60947-4-1600 V for power circuit conforming to UL 508Inrush power in VA30 VA at 20 °CHold-in power consumption in VA 4.5 VA at 20 °CHeat dissipation 1.3 WControl circuit voltage limits0.2...0.75 Uc at <= 50 °C drop-out0.8...1.15 Uc at <= 50 °C operationalConnections - terminals Screw clamp terminals 1 cable(s) 1.5...4 mm² - cable stiffness: solidScrew clamp terminals 1 cable(s) 0.75...4 mm² - cable stiffness: flexible - without cable endScrew clamp terminals 1 cable(s) 0.34...2.5 mm² - cable stiffness: flexible - with cable endScrew clamp terminals 2 cable(s) 1.5...4 mm² - cable stiffness: solidScrew clamp terminals 2 cable(s) 0.75...4 mm² - cable stiffness: flexible - without cable endScrew clamp terminals 2 cable(s) 0.34...1.5 mm² - cable stiffness: flexible - with cable end Operating rate3600 cyc/hSignalling circuit frequency<= 400 HzMounting support PlateRailTightening torque 1.3 N.m - on screw clamp terminals - with screwdriver Philips No 21.3 N.m - on screw clamp terminals - with screwdriver flat Ø 6 mmOperating time10...20 ms coil de-energisation and NO opening10...20 ms coil energisation and NO closingSafety reliability level B10d = 1369863 cycles contactor with nominal load conforming to EN/ISO 13849-1B10d = 20000000 cycles contactor with mechanical load conforming to EN/ISO 13849-1 Mechanical durability10 McyclesElectrical durability0.18 Mcycles 20 A AC-1 at Ue <= 440 VMechanical robustness Shocks contactor closed, on X axis 10 Gn for 11 ms IEC 60068-2-27Shocks contactor closed, on Y axis 15 Gn for 11 ms IEC 60068-2-27Shocks contactor closed, on Z axis 15 Gn for 11 ms IEC 60068-2-27Shocks contactor opened, on X axis 6 Gn for 11 ms IEC 60068-2-27Shocks contactor opened, on Y axis 10 Gn for 11 ms IEC 60068-2-27Shocks contactor opened, on Z axis 10 Gn for 11 ms IEC 60068-2-27Vibrations contactor closed 4 Gn, 5...300 Hz IEC 60068-2-6Vibrations contactor opened 2 Gn, 5...300 Hz IEC 60068-2-6Height58 mmWidth45 mmDepth57 mmProduct weight0.18 kgEnvironmentStandards BS 5424IEC 60947NF C 63-110VDE 0660Product certifications ULCSAIP degree of protection IP2x conforming to VDE 0106Protective treatment TC conforming to IEC 60068TC conforming to DIN 50016Ambient air temperature for operation-25...50 °CAmbient air temperature for storage-50...80 °COperating altitude2000 m without derating in temperatureFlame retardance V1 conforming to UL 94Requirement 2 conforming to NF F 16-101Requirement 2 conforming to NF F 16-102Offer SustainabilitySustainable offer status Green Premium productRoHS (date code: YYWW)Compliant - since 0633 - Schneider Electric declaration of conformity Schneider Electric declaration of conformity REAChReference not containing SVHC above the threshold Reference not containing SVHC above the threshold Product environmental profile AvailableProduct environmental Product end of life instructionsAvailableEnd of life manualContractual warrantyWarranty period18 monthsLC1K09004P7。
K文件—关键部件的信息情况
关键部件的信息情况1.B柱信息（右B柱的材料、部件、属性编号分别为2000158、2000137、2000186） 材料信息*MAT_PIECEWISE_LINEAR_PLASTICITY$HMNAME MATS 2000185MATL24_200032620001857.8900E-09 210000.0 0.3 400.0 0.0 0.0 0.080.0 4.5 2000006 0 0.0$$ HM Entries in Stress-Strain Curve = 80.0 0.0 0.0 0.0 0.0 0.0 0.0 0.00.0 0.0 0.0 0.0 0.0 0.0 0.0部件信息*part$HMNAME COMPS 2000157CH-B-PILLAR-I-L$HWCOLOR COMPS 2000157 13CH-B-PILLAR-I-L20001572000136 2000185 0 0 0 0 0 属性信息*SECTION_SHELL$HMNAME PROPS 2000136SectShll_20003262000136 2 0.0 3 0.0 0.0 01.328 1.328 1.328 1.328 0.0 0.0 0.0 02.A柱信息（右A柱的材料、部件、属性编号分别为2000150、2000128、2000177） 材料信息*MAT_PIECEWISE_LINEAR_PLASTICITY$HMNAME MATS 2000177MATL24_200031820001777.8900E-09 210000.0 0.3 400.0 0.0 0.0 0.080.0 4.5 2000006 0 0.0$$ HM Entries in Stress-Strain Curve = 80.0 0.0 0.0 0.0 0.0 0.0 0.0 0.00.0 0.0 0.0 0.0 0.0 0.0 0.0 0.0部件信息*part$HMNAME COMPS 2000149CH-A-PILLAR-I-L$HWCOLOR COMPS 2000149 64CH-A-PILLAR-I-L2000149 2000128 2000177 0 0 0 0 0 属性信息*SECTION_SHELL$HMNAME PROPS 2000128SectShll_2000318200012816 0.0 3 0.0 0.0 01.561 1.561 1.561 1.561 0.0 0.0 0.0 0 3.前围板信息材料信息*MAT_PIECEWISE_LINEAR_PLASTICITY$HMNAME MATS 2000211MATL24_200035220002117.8900E-09 210000.0 0.3 250.0 0.0 0.0 0.080.0 4.5 2000003 0 0.0$$ HM Entries in Stress-Strain Curve = 80.0 0.0 0.0 0.0 0.0 0.0 0.0 0.00.0 0.0 0.0 0.0 0.0 0.0 0.0 0.0部件信息*part$HMNAME COMPS 2000183CH-CBN-FIREWALL$HWCOLOR COMPS 2000183 6CH-CBN-FIREWALL20001832000162 2000211 0 0 0 0 0 属性信息*SECTION_SHELL$HMNAME PROPS 2000162SectShll_20003522000162 2 0.0 3 0.0 0.0 00.735 0.735 0.735 0.735 0.0 0.0 0.0 0 4.前纵梁信息（右A柱的材料、部件、属性编号分别为2000218、2000197、2000242） 材料信息*MAT_PIECEWISE_LINEAR_PLASTICITY$HMNAME MATS 2000240MATL24_200038920002407.8900E-09 210000.0 0.3 400.0 0.0 0.0 0.080.0 4.5 2000006 0 0.0$$ HM Entries in Stress-Strain Curve = 80.0 0.0 0.0 0.0 0.0 0.0 0.0 0.00.0 0.0 0.0 0.0 0.0 0.0 0.0 0.0部件信息*part$HMNAME COMPS 2000216CH-RAILS-FT-L-I$HWCOLOR COMPS 2000216 9CH-RAILS-FT-L-I20002162000195 2000240 0 0 0 0 0属性信息*SECTION_SHELL$HMNAME PROPS 2000195SectShll_20003892000195 2 0.0 3 0.0 0.0 01.895 1.895 1.895 1.895 0.0 0.0 0.0 0 5.保险杠信息材料信息*MAT_PIECEWISE_LINEAR_PLASTICITY$HMNAME MATS 2000189MATL24_200033020001897.8900E-09 210000.0 0.3 570.0 0.0 0.0 0.080.0 4.5 2000002 0 0.0$$ HM Entries in Stress-Strain Curve = 80.0 0.0 0.0 0.0 0.0 0.0 0.0 0.00.0 0.0 0.0 0.0 0.0 0.0 0.0 0.0 部件信息*part$HMNAME COMPS 2000161CH-BUMPER-FT-I$HWCOLOR COMPS 2000161 24CH-BUMPER-FT-I2000161 2000140 2000189 0 0 0 0 0 属性信息*SECTION_SHELL$HMNAME PROPS 2000140SectShll_20003302000140 7 0.0 3 0.0 0.0 01.956 1.956 1.956 1.956 0.0 0.0 0.0 0 6.前地板信息材料信息*MAT_PIECEWISE_LINEAR_PLASTICITY$HMNAME MATS 2000212MATL24_200035320002127.8900E-09 210000.0 0.3 330.0 0.0 0.0 0.080.0 4.5 2000005 0 0.0$$ HM Entries in Stress-Strain Curve = 80.0 0.0 0.0 0.0 0.0 0.0 0.0 0.00.0 0.0 0.0 0.0 0.0 0.0 0.0 0.0 部件信息*part$HMNAME COMPS 2000184CH-CBN-FLOORBRD-FT$HWCOLOR COMPS 2000184 7CH-CBN-FLOORBRD-FT20001842000163 2000212 0 0 0 0 0 属性信息*SECTION_SHELL$HMNAME PROPS 2000160SectShll_20003502000160 2 0.0 3 0.0 0.0 00.536 0.536 0.536 0.536 0.0 0.0 0.0 0。
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E-mail: sales@URL: Ultrasonic Sonar Ranging IC - PW0268Features:SSOP20 z Operating V oltage: 6 – 10Vdc single sourcez Operating Frequency: broadband output ranging up to 250KHz z Variable R/C Oscillator: compensates for transducer resonate frequency drift due to temperature.z High Gain Amplifier: varies with time over 32 stepsz Integrated Band Pass Filter: reduces external component count z Bi-direction I/O Pin: simplifies the control function for transmitting a pulse and receiving an echoz An adjustable System Clock: enables the control of, the number of pulses transmitted, the slope of the variable gain amplifier, and the pulse repetition rate.z The PW0268 IC is suitable for use in car reversing aids, electronic tape measures and other sonar ranging applications.Description:The PW-0268 ultrasonic sonar ranging IC is ideally suited for echo ranging systems. This chip has many design features to enhance its performance and ease of use in this application.The externally tunable RC Oscillator automatically tracks and compensates for the shift of the resonate frequencyof the transducer due to temperature changes.The Fix Gain Preamplifier can be tailored to compensate for varying transducer sensitivities. The 32-step Time Controlled Variable Gain Amplifier slope can be modified by adjusting the frequency of the system clock.An onboard Comparator converts the analog signal of the returning echo to a TTL level digital signal for use with an external microprocessor.The integrated Band Pass Filters can be adjusted for custom applications by changing a few external components. The frequency of the System Clock can be adjusted to control other operating parameters of the chip including the transmit pulse width and sample rate.The I_O pin, (pin 1) is a bi-direction pin and is designed as an open collector connection with an internal pull high resistor. When the I_O pin is being pulled low by an external transistor, the RC oscillator generates a tone burst signal at DRIVER_0 (pin 11), the output driver stage for the transducer. After the transmit pulse, the I_O pin, (pin 1) will again go low if a valid echo signal is detected.The reflected echo signal is presented to the first stage pre-amplifier through ECHO (pin 10). The gain ofpre-amplifier can be adjusted to accommodate transducers with varying sensitivities by changing an external resistor between ECHO (pin 10) and GR_I (pin 9).The 32 steps time controlled variable gain amplifier input TCG_I (pin7) and output TCG_O (pin 6) is synchronized to start incrementing at the end of control pulse signal I-O, (pin 1) and is reset at the beginning of the next control pulse.Only a few passive components are needed for the active band pass filter. There are two stages, a low pass, LP_I (pin 5) and LP_O (pin 4) and upper band pass, HP_I (pin 3) to HP_O (pin 2). The center frequency and bandwidth of the filter are chosen based on the type of ultrasonic transducer being used and the specific application. The amplified echo signal after being filtered is routed to a comparator, which shapes and coverts the analog echo signal into digital signal outputted at I_O (pin 1) for further µP handling.The unique temperature compensating Ultrasonic R/C Oscillator circuitry tracks the resonant frequency drift of the transducer that is causes by environment temperature changes. Simply adding dual diodes and one resistor between DRIVER_O (pin 11) and Ftrace (pin 12) is all that is needed to complete this function.E-mail: sales@ URL: Block DiagramI_OHP_OLP_OHP_ILP_ITCG_OGR_OTCG_IGR_IECHOVref Vcc GND Vreg CLK ORC3ORC1ORC2Ftrace Driver_OPin AssignmentI_O HP_O HP_I LP_O LP_I TCG_O TCG_I GR_O GR_I ECHOVref Vcc Vreg GND CLK ORC3ORC2ORC1Ftrace Driver_OPW02681092019181716151413121187654321E-mail: sales@ URL: Specifications:Unless otherwise specified, all data measured under Vcc = 9V , F = 40KHzParameter Symbol Condition Min.Typ. Max.Unit Supply V oltage Vcc Vreg = 4V 5.5 11 V Supply Current Icc Vcc = 6 ~ 10V 8 11 14 mA Regulated V oltage Vreg Vcc = 6 ~ 10V 3.8 4 5 V Stability of Vreg Vlr Vcc = 6 ~ 10V , ± 3%-3.0 0 +3.0 % Reference V oltage Vref Vcc = 6 ~10V ,RL>2K Ω0.4 0.44 0.5 VregOp-Amp Slew Rate SR Vin = 3Vpp 5 - - V/µS Comparator TriggerLevel Tcomp Over Vref 300 350 400 mVSystem ClockFrequency CLKf R=33K Ω C=22pF 610 660 710 KHzSystem ClockFrequency Range CLKr 0.001- 1500KHzUltrasonic OscillationFrequencyFoscf R=5.6K C=1000pF 38 40 42 KHzUltrasonic OscillationFrequency Range Foscr 0.001- 500 KHz2nd Amp Gain GR 29 30 31 dB Min(1x, 0dB) -1 0 +1 dBTime Controlled Gain Amplifier TCGainMax(58x, 35.2dB) 34 35 36 dB Bandwidth of 2nd Amp GRbw Gain = 50dB 150 170 200 KHzIdrv Driver_O - 20 40 mADriving CurrentIsink Driver_O - -20 -80 I_OVIH - 0.3 0.4 VccInput V oltage LevelI_OVIL 0.15 0.2 -I_OVOH - 0.9 1 VccOutput V oltage Level I_OVOL 0 0.05 -Input Low LevelCurrentI_OIOL - -10 -20 mAI_O Internal Pull UpResistanceRup 3.5 5 6.5 K ΩAbsolute Maximum RatingsDescription Symbol Condition Min. Max. Unit Supply V oltage Vcc 0 12 VOperation Temperature Topr -40 +85Storage Temperature Tstg -65 +150I_O Vcc -0.3 Vcc+0.3VMax. Pin Input V oltage VimaxOthers -0.3 Vreg+0.3Max. Input Current Iimax * -10 +10 mA*To prevent latch up, the instantaneous input current should be no large than 100mA for each pins.E-mail: sales@URL: Pins Description:Pin Name Description Pin Name Descriptionoutput 1 I_O Input/Output 11Driver_O Transducerdriving2 HP_O High pass filter output 12Ftrace Frequency tracing input3 HP_I High pass filter input 13ORC1 RC oscillator: terminal 14 LP_O Low pass filter output 14ORC2 RC oscillator: terminal 25 LP_I Low pass filter input 15ORC3 RC oscillator: terminal 36 TCG_O Time controlled gain output 16CLK System clock7 TCG_I Time controlled gain input 17GND Ground8 GR_O External adjustable gain output 18Vreg Regulated voltage for internalanalogue devicesgain input 19Vcc Power supplyadjustable9 GR_I External10 ECHO Receiving echo input 20Vref Reference voltage output Application Circuit:for car reversing aids (values should be changed for other applications)VrefVccE-mail: sales@ URL: Application NoteThe circuit shown on page 4 is a typical circuit for car reversing aids. The RC Oscillator generates a tone burst when a low level pulse is applied to the I_O pin, (pin 1).To accommodate tolerance variations of transducers during manufacturing, a 1K-ohm variable resistor (R1) isprovided to trim the output operating frequency. The range of adjustment is from 38.0 – 42.0 KHz. and allows for a better match of the drive signal to the resonate frequency of the transducer.The active burst number (number of pulses transmitted) is controlled by the pulse width of the low level signal applied to the I_O pin, (pin 1).The tone burst output, Driver_O (pin 11), drives the transducer through a MOSFET transistor and impedance matching transformer IFT. The inductance in the secondary winding of the transformer is designed to tune out the reactance of the parallel capacitance of the transducer.The high output voltage of the tone burst is snubbed by two diodes and the returning echo signal is passed on to the first stage pre-amplifier. The signal is then passed on to the second stage fix gain amplifier and finally to the third stage 32-step time controlled variable gain amplifier. The gain of the pre-amplifier should be properly set to meet the sensitivity needs of the transducer and application requirements.The center frequency of band-pass filter should be chosen to exactly match the frequency of the RC Oscillator and considerations for the width of pass-band filter should be made based on actual application requirements. If the amplified echo signal from the output of the band pass filter exceeds 0.35V + Vref, the comparator will output a low pulse to the I_O pin, (pin 1). The width of the low level pulse is proportional to the echo signal strength.The above description is summarized in the signal timing charts illustrated below.MCU output: H: 1ms/Div., V: 2.0V/Div.Driver_O (Pin 11): H: 1ms/Div., V: 2.0V/Div.Transducer Oscillation: H: 1ms/Div., V: 50V/Div.HP_O (Pin 2): H: 1ms/Div., V: 2.0V/Div.Output at Pin 1 I_O: H: 1ms/Div., V: 5.0V/Div.The RC oscillator will be enabled in the duration of input pulse. The maximum pulse width is 396 F and any time longer than this upper limit will be ignored.The next input pulse will be ignored if the pulse repetition rate is shorter than 9900 F + pulse width.F: Frequency of system clockE-mail: sales@URL: The resonate frequency of ultrasonic piezo transducers varies in an inversely proportional relationship to temperature. The lower the temperature, the higher the resonate frequency, the higher the temperature the lower the resonate frequency.This property of piezo transducers may cause a mismatch between transducer and drive signal with changes in ambient temperature and reduces efficiency of the system when the frequency of the drive circuit remains constant and does not track the resonate frequency shift of the transducer.Therefore it is desirable to have the output frequency of the drive source track the resonate frequency of the transducer with changes in ambient temperature. The Auto Frequency Tracking circuitry between Ftrace, (pin 12), and Drive_O, (pin 11) is used to accomplish this task.The voltage change at Ftrace (pin 11) varies in proportion to the forward bias voltage change across diodes D1, D2. This change is caused by the negative temperature coefficient of the diodes and the ratio of the resistor circuitR2/R3.A lower temperature increases the voltage drop across the diodes. This intern accelerates the charge rate of an internal integrator circuit controlling the R/C Oscillator, ORC3, (pin15). The net result is the adjustment to theR/C Oscillator increases the resonate frequency of the output, Drive_O, (pin11).Conversely, a higher temperature decreases the voltage drop across the diodes. This slows the charge rate of the internal integrator circuit controlling the R/C Oscillator. The net result of this adjustment is to decrease the resonate frequency of the output Drive_O, (pin 11).Choose values for the components R1, R2, R3 and C1 that will best track the characteristic resonate frequency shift curves due to temperature for a specific transducer.Recommended values for the following transducers are listed below.Used Transducer R1(Ohm) R2(Ohm) R3(Ohm) C1(pF) 400EP14D 3,300 1,500 511 2,200400EP18A 3,300 1,500 604 2,200235AC130 2,000 0 2,100 220For a fixed output of 40KHz at Drive_O (pin 11) simply remove D1, D2 and R2 and set R1 = 4,500 Ohm, C1 = 2,200 pF, and R3 = 511 Ohm.The system clock CLK (pin 16) controls the maximum input pulse width, the slope of time controlled gain amplifier and pulse repetition rate.For example, as illustrated in the block diagram, if the system clock is set to 660KHz (C2: 22pF, R4: 47K Ohm), then:(1)The maximum input pulse width is 396/F = 396/660K = 0.6 ms and any duration longer than 0.6ms will beignored.(2)The step duration of the 32 step time controlled gain amplifier is equal to 220/F = 0.333 ms, starting fromthe end of the pulse on the I_O pin, (pin 1).(3)The minimum pulse repetition rate is 9900/F + pulse width = 9900/F + 0.5 ms (20 bursts of 40KHz) =9900/660K + 0.5 = 15.5 ms.For long distance measurements of 18 meters (one way distance), the system clock should be set as follows: Min. Pulse Repetition Rate = 9900/F + 0.75 = 166 mS (30 bursts of 40KHz)Frequency of System Clock F = 60 KHzFor additional information about an 18-meter tape measure circuit, please consult with the factory.E-mail: sales@ URL: Time Controlled Gain Amplifier051015202530354005101520253035StepsG a i n (d B )The time controlled gain amplifier is stepping up once the input pulse falling. The time duration can be calculated as:T = 220/F F: Frequency of System ClockE-mail: sales@URL: Package and Dimensions:20 Pins, SSOP (150mil)E-mail: sales@ URL: E-mail: sales@URL: Symbol Min. Nom.Max.A 0.053- 0.069A1 0.004- 0.010A2 0.049- 0.065b 0.008- 0.012b1 0.0080.0100.011c 0.006- 0.010c1 0.0060.0080.009BSCD 0.341BSCE 0.236BSCE1 0.154BASe 0.025L 0.016- 0.050L1 0.041REFBASL2 0.010R 0.003- -R1 0.003- -θ0°- 8°θ1 5°- 15°θ2 0°- -aaa 0.004bbb 0.008ccc 0.004ddd 0.007eee 0.004Pro-Wave Electronics Corp.Tel: 886-2-22465101Fax: 886-2-22465105E-mail: sales@URL: 11Notes:1.Dimensioning and tolerancing per ANSI Y14.5M-1982.2.Dimensions in inches (angles in degrees)3.Dimension D does not include mold flash, protrusions or gate burrs. Mold flash, protrusions orgate burrs shall not exceed 0.006” per end. Dimension E1 does not include interlead flash orprotrusions. Interlead flash or protrusions shall not exceed “0.006” per side. D1 and E1dimensions are determined at datum H.4.The package top may be smaller than the package bottom. Dimensions D and E1 are determinedat the outermost extremes of the plastic body exclusive of mold flash, tie bar burrs, gate burrsand interlead flash, but including any mismatch between the top and bottom of the plastic.5.Datum A and B to be determined at datum H.6.N is the maximum number of terminal position. (N=20)7.The dimensions apply to the flat section of the lead between 0.004 to 0.010 inches from the leadtip.8.Dimension b does not include dambar protrusion. Allowable dambar protrusion shall be 0.004”total in excess of b dimension at maximum material condition. The dambar can not be locatedon the lower radius of the foot.9.Refer to JEDEC MO-137 variation AD.JEDEC is the registered trademark of JEDEC SOLID STATE TECHNOLOGY ASSOCIATIONCopyright © 2004 Pro-Wave Electronics Corp. 9/15/2004Sonar Ranging Module SRM400The SRM400 is a sonar ranging module utilizing our new developed Sonar Ranging IC, PW-0268, which can work with all our PT or EP type transducers. SRM400 provides as a shortcut to develop car reversing systems or some other distance measurement systems for design engineers who are not very familiar with analog circuit and/or the operation of ultrasonic transducers. By using this module engineers can focus firstly on the other fields of digital circuit and software designs as well as some other mechanical issues. After first stage then you can either design your own analog circuit based on the module construction or consult with factory for making your own module for your special needs.Features:z Operating V oltage: 6 – 10Vdc single source z Operating Frequency: broadband output ranging up to 250KHzz Built-in variable RC oscillator matching transducers with different frequenciesz High Gain Amplifier: varies with time over 32 stepsz Integrated Band Pass Filter: reduces external component count,z Bi-direction I/O Pin: simplifies the control function for transmitting a pulse and receiving an echoz An adjustable System Clock: enables the control of, the number of pulses transmitted, the slope of the variable gain amplifier, and the pulse repetition ratez Board size: 27.9 * 18 mm (L*W)Specification:Operation voltage DC6 - 10V Operation current <20 mA DC10V Oscillation frequency Variable RC oscillator Amplifier gain Pre-Amplifier 14 dB 2nd Stage Amplifier 30 dB Time controlled 32 steps main amplifier 35 dB max. Fc: 38 KHzBandwidth: 20KHz Bandpass filter Insertion loss: 1 dBDriving voltage (no load) 130Vpp; pulse width 0.5ms Bi-directional I/OInput signal Open collector pull lowOutput 0..05*Vcc to 0.9*Vccdigital echo signalsMeasuring distance 25 – 150 cmSRM400 includes: 1. Module board2. 400EP14D enclosed type transducer of asymmetrical beam patterns, see detail specification of 400EP14D.3. Detail electrical schematicS. Square Enterprise Company Limited Pro-Wave Electronics CorporationP.O. Box 1-70 Chung Ho, Taiwan, ROC; E-mail: prowave@; Tel: 886-2-22465101(5 lines), 22459774; Fax: 886-2-22465105 ; Sonar Ranging ModuleSRM400Electronic Circuit DiagramWaveforms at different test points:works with transducer model 400EP14D against a hard target of size of 20cmL*20cmW*1cmT at distance of 50cm“A” Point: Control Pulse (from MCU) “B”Point: Tone bursts Signal H: 0.5ms/divV: 5V/div H: 0.5ms/div V: 5V/div“C” Point: Transducer loading “D” Point: 1st Pre-AmplifierH: 0.5ms/div V: 50V/div H: 0.5ms/div V: 20mV/div“E” Point: Main 32 Steps TCG Amplifier “F” Point: Digital Echo signal OutputH: 0.5ms/divV: 1V/divH: 0.5ms/div V: 5V/divRefer to PW-0268 Sonar Ranging IC for detail information.Model Number Nominal Frequency Hz Tolerance at 25 C PPM Temperature Stability –10 C to +70 C PPMLoad Capacitance pF Series Resistance Ohm Shunt Capacitance pF Drive LevelmW S40000 40,000 ±60 ±45 12.5 35,000 2.3 0.001S32768 32,768 ±20 ±30 12.5 35,000 2.3 0.001Matching TransformersSpecificationParts Number K4000001 K4000002 K4000003 K4000004 Operating Frequency40.0 KHz 40.0 KHz 40.0 KHz 40.0 KHz Variable Inductance (min.) 10.6 mH± 6%10.6 mH± 6%10.6 mH± 6% 10.6 mH± 6%Unloaded Q (min.) 70 100 25 47TurnRatio 1:10 1:10 1:10 1:10 Matching Transducer400EP14D 400EP14D (Temperature CompensatedType235SR130 400EP18AP.O. Box 1-70 Chung Ho, Taiwan, ROC;E-mail: prowave@;Tel: 886-2-22465101(5 lines), 22459774;Fax: 886-2-22465105 ; S. Square Enterprise Company Limited Pro-Wave Electronics Corporation。