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CONCEPTMay, 2011CONCEPT Product PortfolioCT-Concept Technologie AG© CT-Concept Technologie AG - SwitzerlandPage 1ContentsSCALE Drivers[ [ [Driver D i cores Plug-and-Play driver DC/DC power supplySCALE-2 Drivers[ [Driver cores Plug-and-Play driver© CT-Concept Technologie AG - SwitzerlandPage 2SCALE Driver Overview600V/1200V Driver cores 1700V 2500V/ 3300V 1200V SCALE Plug-and-Play driver 1700V 2500V/ 3300V 4500V/ 6500V 4500V DC/DC 6500V 10kV 12kV© CT-Concept Technologie AG - Switzerland Page 3SCALE Driver Cores2SD106AI/ 2SD106AI-17 2SD106AI 17 [ Compact dual driver [ 600V/1200V and 1700V IGBTs [ ±6A gate current, ±15V [ 1W per channel [ Short-circuit protection [ Under-voltage lockout [ Up to 100kHz [ Delay e ay t time e 300 300ns s [ 100kV/us [ -40°C…+85°C 6SD106EI/ 6SD106EI 6SD106EI-17 17 [ Compact 6-channel driver core [ 600V/1200V and 1700V IGBTs [ ±6A gate current, ±15V [ 1W per channel [ Short-circuit protection [ Under-voltage lockout [ Up to 100kHz [ Delay e ay t time e 300 300ns s [ 100kV/us [ -40°C…+85°C© CT-Concept Technologie AG - SwitzerlandPage 4SCALE Driver Cores2SD315AI [ Industry-standard dual driver [ 2SD315AI for 600V to 1700V IGBTs [ 2SD315AI-25 for 2500V IGBTs [ 2SD315AI-33 for 3300V IGBTs [ ±15A gate current, ±15V [ 3W per channel [ Short-circuit protection [ Under-voltage U de o tage lockout oc out [ Up to 100kHz [ Delay time 300ns [ 100kV/us [ -40°C…+85°C© CT-Concept Technologie AG - SwitzerlandPage 5SCALE Driver Cores1SD1548AI [ Single channel high-power driver [ IGBTs from 600V to 1700V [ ±48A gate current, ±15V [ 15W per channel [ Short-circuit protection [ Advanced active clamping option [ Under-voltage lockout [ Up to 150kHz 50 [ Delay time 335ns [ 100kV/us [ -40°C -40 C…+85 +85°C C© CT-Concept Technologie AG - SwitzerlandPage 6SCALE Driver CoresIHD260, IHD660 IHD260 [ Replacement of IHD215/280/680 [ Compact dual channel driver [ 1200V and 1700V IGBTs [ ±6A gate current, ±15V [ 1W or 3W per channel [ Short-circuit protection [ Under-voltage lockout [ Up to 100kHz 00 [ Delay time 315ns [ 100kV/us [ -40°C -40 C…+85 +85°C C IGD616 [ Replacement of IHD608/615 [ Compact single channel driver [ 1200V and 1700V IGBTs [ ±16A gate current, ±15V [ 6W per channel [ Short-circuit protection [ Under-voltage lockout [ Up to 150kHz 50 [ Delay time 315ns [ 100kV/us [ -40°C -40 C…+85 +85°C C© CT-Concept Technologie AG - SwitzerlandPage 7SCALE Driver Overview600V/1200V Driver cores 1700V 2500V/ 3300V 1200V SCALE Plug-and-Play driver 1700V 2500V/ 3300V 4500V/ 6500V 4500V DC/DC 6500V 10kV 12kV© CT-Concept Technologie AG - Switzerland Page 8SCALE Plug-and-Play Driver2SB315A/ 2SB315B [ Dual channel driver for 130mmx140mm IGBT dual modules [ IGBTs from 1200V to 1700V [ Fuji, ABB, Mitsubishi, Infineon, Dynex [ DIC-20 (A) or Fiber-optic (B) interface [ ±15A gate current, ±15V [ 3W per channel [ Active clamping [ Short-circuit S o t c cu t p protection otect o [ Under-voltage lockout [ Up to 20kHz [ Delay time 400ns [ 100kV/us [ -40°C…+85°C© CT-Concept Technologie AG - SwitzerlandPage 9SCALE Plug-and-Play Driver2SD316EI/6SD312EI [ 1200V and 1700V version [ +16A/-6A gate current, ±15V dual version [ +12A/-6A gate current, ±15V 6-pack version [ Infineon IGBT Modules 150A to 450A [ 3W per channel [ Active clamping [ Short-circuit protection [ Under-voltage U de o tage lockout oc out [ NTC output [ Up to 70kHz [ Delay time 360ns [ 100kV/us [ -40°C…+85°C© CT-Concept Technologie AG - SwitzerlandPage 10SCALE Plug-and-Play Driver1SD418F2 [ IGBTs from 1700V to 3300V [ Suitable for 130mmx140mm and 190mmx140mm IGBT Modules [ ABB Infineon, ABB, I fi Mitsubishi Mit bi hi [ ±18A gate current, ±15V [ 4W output power [ Advanced active clamping [ Short-circuit protection [ Under-voltage lockout [ Up to 6kHz [ Delay time 400ns [ -40°C…+85°C© CT-Concept Technologie AG - SwitzerlandPage 11SCALE Plug-and-Play Driver1SD536F2 [ IGBTs from 1200V to 3300V [ Suitable for 130mmx140mm and 190mmx140mm IGBT Modules [ F ji ABB, Fuji, ABB Infineon, I fi Mitsubishi, Mit bi hi Dynex, D Toshiba T hib [ ±36A gate current, ±15V [ 5W output power [ Advanced active clamping [ di/dt feedback during turn-off [ Short-circuit protection [ Under-voltage lockout [ Up to 8kHz [ Delay y time 400ns [ -40°C…+85°C© CT-Concept Technologie AG - SwitzerlandPage 12SCALE Plug-and-Play Driver1SD312F2 [ For 4500V IGBTs [ Suitable for 190mmx140mm IGBT Modules [ ABB Mitsubishi, ABB, Mit bi hi Dynex, D Hitachi, Hit hi Toshiba T hib [ +10A/-6A gate current, ±15V [ Output Power 3W [ Power Supply ISO3116I-45 [ Active clamping [ Short-circuit protection [ Under-voltage lockout [ Maximum 2…6kHz [ Delay y time 430ns [ -40°C…+85°C© CT-Concept Technologie AG - SwitzerlandPage 13SCALE Plug-and-Play Driver1SD210F2 [ IGBTs from 4500V to 6500V [ Suitable for 190mmx140mm IGBT Modules [ ABB Infineon, ABB, I fi Mitsubishi Mit bi hi [ +10A/-6A gate current, ±15V [ 2W output power [ External Power Supply ISO3116I-65 [ Active clamping [ Short-circuit protection [ Under-voltage lockout [ Up to 6kHz [ Delay y time 430ns [ -40°C…+85°C© CT-Concept Technologie AG - SwitzerlandPage 14SCALE Driver Overview600V/1200V Driver cores 1700V 2500V/ 3300V 1200V SCALE Plug-and-Play driver 1700V 2500V/ 3300V 4500V/ 6500V 4500V DC/DC 6500V 10kV 12kV© CT-Concept Technologie AG - Switzerland Page 15DC/DC Converters (Power Supplies)ISO3116I [ For SCALE driver 4.5kV and 6.5kV [ Up to 12kV operation voltage [ Di l t i test Dielectric t t voltage lt up to t 18kVAC [ +15V input [ 3W output power [ Coupling capacitance 3pf [ -40°C…+85°C© CT-Concept Technologie AG - SwitzerlandPage 16ContentsSCALE Drivers[ [ [Driver D i cores Plug-and-Play driver DC/DC power supplySCALE-2 Drivers[ [Driver cores Plug-and-Play driver© CT-Concept Technologie AG - SwitzerlandPage 17SCALE-2 Driver Overview600V/1200V Driver cores 1700V 3300V Automotive SCALE-2 Plug-and-Play driver 1200V 1700V 3300V 4500V/ 6500V DC/DC 4500V 6500V© CT-Concept Technologie AG - SwitzerlandPage 18SCALE-2 Driver Core Nomenclature 2 S C 0 1 0 8 T 2 A 0 -17Voltage Class A0: A=-25°C; B-40°C 2SC0108T A=-40°C Standard; -50°C 2SC=535 SCALE Generation 2: A=-25°C; B-40°C Insulation TechnologyC: Coreless (PCB) V: Versatile Fiber-optic P: Planar Core S: ST Fiber-optic T: Ring CoreOutput Current per Channel in A Output Power per Channel in W SCALE Driver FamilySC: Driver Cores SP: Plug and Play DriverNumber of Channels© Copyright by CT-Concept Technologie AG *Only for Plug and play drivers ** Only for Driver Cores Page 19SCALE-2 Driver Cores2SC0108T [ Ultra-compact dual channel driver core [ Short and Long Pin [ For IGBTs 600V to 1700V [ ±8A gate current, +15V/-8V [ 1W per channel [ Direct paralleling capability [ Regulated gate-emitter voltage [ Short-circuit protection [ Under-voltage d l lockout l k [ Up to 50kHz [ Delay time <100ns, jitter <± 4ns [ 75kV/us [ Safe isolation EN50178, reinforced insulation IEC60664-1 [ UL compliant p [ Two Types: 2SC0108T2Ax-17 (-20°C…+85°) 2SC0108T2Bx-17 (-40°C…+85°) © CT-Concept Technologie AG - SwitzerlandPage 20SCALE-2 Driver Cores2BB0108T[Basis board for 2SC0108T[For IGBTs 600V to 1700VAvailable as a product or as full documented design support [Available as a product or as full documented design support[Active clamping for 600V, 1200V or 1700V[Standard DIC-20 interfaceSafe isolation EN50178reinforced insulation IEC606641 [Safe isolation EN50178, reinforced insulation IEC60664-1[UL compliant[-40°C…+85°CSCALE-2 Driver Cores2SC0435T[Ultra-compact dual channel driver core.[Four Version. RoHS compined. No RoHS complined. Long and short pin.[For IGBTs 600V to 1700V[±35A gate current, +15V/-10V[4W per channelp g p y[Direct paralleling capability[Regulated gate-emitter voltage[Advanced active clampingShort-circuit protection[Short circuit protection[Under-voltage lockout[Up to 100kHzDelay time<100ns jitter<±[Delay time <100ns, jitter <±4ns[75kV/us[Safe isolation EN50178, reinforced insulation IEC60664-1[UL compliant[-40°C…+85°CSCALE-2 Driver Cores2BB0435T[Basis board for 2SC0435T[For IGBTs 600V to 1700VAvailable as a product or as full documented design support [Available as a product or as full documented design support[Active clamping for 600V, 1200V or 1700V[Standard DIC-20 interfaceSafe isolation EN50178[Safe isolation EN50178,reinforced insulation IEC60664-1[UL compliant[-40°C…+85°CSCALE-2 Driver Cores2SC0535T[Ultra-compact dual channel driver core for 3,3kV IGBT Modules [For IGBTs 1700V to 3300V±35A gate current+15V/-10V[±35A gate current, +15V/10V[4W per channel[Direct paralleling capabilityRegulated gate emitter voltage[Regulated gate-emitter voltage[Advanced active clamping[Short-circuit protectiond l l k[Under-voltage lockout[Up to 100kHz[Delay time <100ns, jitter <±4ns[Safe isolation EN50178, reinforced insulation IEC60664-1[EN50124 Traction applicationp[UL compliant[-55°C…+85°CSCALE-2 Driver Cores2SC0650P[Ultra-flat and highest power density dual channel driver core [For IGBTs and MOSFETs up to 1700V±50A gate current[±50A gate current[+15V/-10V IGBT mode, +10…20V/0V MOSFET mode[6W per channelDirect paralleling capability[Direct paralleling capability[Regulated gate-emitter voltage[Advanced active clampingh[Short-circuit protection[Under-voltage lockout[Up to 150kHz, delay time <80ns, jitter <±1ns[100kV/us[Safe isolation EN50178, reinforced insulation IEC60664-1p[UL compliant[-40°C…+85°CSCALE-2 Driver Cores1SC2060P[Ultra-flat and highest power density single channel driver core [For IGBTs and MOSFETs up to 1700V±60A gate current[±60A gate current[+15V/-10V IGBT mode; +10…20V/0V MOSFET mode[20W output powerDirect paralleling capability[Direct paralleling capability[Regulated gate-emitter voltage[Advanced active clampingh[Short-circuit protection[Under-voltage lockout[Up to 500kHz, delay time <80ns, jitter <±1ns[100kV/us[Safe isolation EN50178, reinforced insulation IEC60664-1p[UL compliant[-40°C…+85°CSCALE-2 Driver Cores2SD300C17[Second source for Infineon 2ED300C17-S (ST coating on request) [For IGBTs 600V to 1700V±30A gate current±15V[±30A gate current, ±15V[Gate output power 4W per channel[Advanced active clampingShort circuit protection[Short circuit protection[Soft turn-off after SC detection[Under-voltage lockoutk d l[Up to 50kHz, delay time 690ns[75kV/us[Safe isolation EN50178,Reinforced insulation IEC60664-1[UL compliant[-40°C…+85°CSCALE-2 Plug & Play Driver OverviewDriver cores600V/1200V1700V 3300V AutomotivePlug-and-Play driverSCALE-21200V 1700V 3300V 4500V/ 6500VDC/DC6500VDriver Nomenclature2 S P 03 2 0 T 2 A 0 -FF1000R17IE4Module Type Designation*/Voltage Class**Options A0: Standard (for others check web)check web)SCALE Generation 2: SCALE-2Insulation TechnologyC C l (PCB)C: Coreless (PCB)V: Versatile Fiber-optic P: Planar Core S: ST Fiber-optic p T: Ring CoreOutput Current per Channel in A Output Power per Channel in W p p SCALE Driver FamilySC: Driver Cores SP: Plug and Play Driver © Copyright by CT-Concept Technologie AGPage 29S ug a d ay eNumber of Channels*Only for Plug and play drivers2SP0115TSCALE-2 Plug-and-Play Driver[Dual channel driver for 17mm dual IGBTs [Infineon, Fuji, Mitsubishi IGBTs 600V to 1700V DIC-20interface [DIC 20 interface [1W output power per channel [Direct paralleling capability Regulated gate emitter voltage [Regulated gate-emitter voltage [Advanced active clamping [Short-circuit protection d l l k [Under-voltage lockout [Up to 30kHz, delay time <100ns, jitter <±4ns [NTC output [Safe isolation EN50178, reinforced insulation IEC60664-1[UL compliant [Two Types:2SP0115T2Ax (-20°C…+85°) yp ()2SP0115T2Bx (-40°C…+85°)SCALE-2 Plug-and-Play Driver2SP0320T [ Dual channel driver for PrimePACK™, Infineon, Fuji, Danfoss IGBTs 600V to 1700V [ DIC-20 or fiber-optic interface [ 3W output power per channel [ Direct paralleling capability [ Regulated gate-emitter voltage [ Advanced active clamping [ Short-circuit protection [ Under-voltage lockout [ Up to 30kHz k [ Safe isolation EN50178R [ Reinforced insulation IEC60664-1 [ UL compliant [ -40°C…+85°C© CT-Concept Technologie AG - SwitzerlandPrimePACK™ is a trademarked of Infineon Technology AG MunichPage 31SCALE-2 Plug-and-Play Driver1SP0635 ( (Master & Slave) ) [ IGBTs from 1200V to 3300V [ Suitable for 130mmx140mm and 190mmx140mm IGBT modules [ Fuji ABB, Fuji, ABB Infineon, Infineon Mitsubishi, Mitsubishi Dynex, Dynex Toshiba [ Master-slave operation for direct paralleling, up to three slaves [ 10W power supply on master [ Regulated gate-emitter gate emitter voltage [ Gate monitoring [ Advanced active clamping [ Short-circuit h protection [ Under-voltage lockout [ Safe isolation EN50178 [ Reinforced insulation IEC60664-1 [ UL compliant [ -40°C…+85°C© CT-Concept Technologie AG - SwitzerlandPage 32SCALE-2 Plug-and-Play Driver1SP0335 ( (Master & Slave) ) [ IGBTs from 3300V to 6500V [ Suitable for 190mmx140mm IGBT modules [ Master-slave Master slave operation for direct paralleling paralleling, up to three slaves [ ABB, Infineon, Mitsubishi [ 5W external power supply (ISO5125I) [ Regulated gate-emitter gate emitter voltage [ Gate monitoring [ Dynamic active clamping [ Short-circuit h protection [ Under-voltage lockout [ Safe isolation EN50178 [ Reinforced insulation IEC60664-1 [ UL compliant [ -40°C…+85°C© CT-Concept Technologie AG - SwitzerlandPage 33SCALE-2 Driver Overview600V/1200V Driver cores 1700V 3300V Automotive SCALE-2 Plug-and-Play driver 1200V 1700V 3300V 4500V/ 6500V DC/DC 6500V© CT-Concept Technologie AG - SwitzerlandPage 34DC/DC Converters (Power Supplies)ISO5125I [ For SCALE-2 driver 1SP0335 [ +15V input; +25V output [ U to Up t 12kV operation ti voltage lt [ Dielectric test voltage up to 18kVAC [ 3W output power [ Two connectors. [ Coupling capacitance 3pf [ -40°C…+85°C© CT-Concept Technologie AG - SwitzerlandPage 35SCALE-2 Driver Overview600V/1200V Driver cores 1700V 3300VAutomotive SCALE-2 Plug-and-Play driver 1200V 1700V 3300V 4500V/ 6500V DC/DC6500V© CT-Concept Technologie AG - SwitzerlandPage 36SCALE-2 Plug-and-Play Automotive DriverAutomotive Solution [ SCALE-2 gate driver for Fuji and Infineon automotive IGBT modules [ Tyco automotive interface [ Reinforced insulation IEC60664 IEC60664-1 1 [ UL compliant [ -40°C…+85°C© CT-Concept Technologie AG - SwitzerlandPage 37Many Thanks!© CT-Concept Technologie AG - SwitzerlandSeite 38。

AZ AQUATAR家族产品系列介绍说明书

9F3C
1F3C
PFOS
CF2 CF2 CF2 SO3OH
CF2 CF2 CF2
PFOA
CF2 F3C
CF2 CF2 CF2
C8 Telomer
CF2 CF2 CF2 CH2CH2OH CF2 CF2 CF2 CF2
CF2
CF2
CF2
COOH
AZ Electronic Materials Confidential
(1.44/1.48/1.56)
(1.40/1.43/1.45)
AQUATAR-3S (1.42/1.44/1.49)
PFOS
AQUATAR-6 (1.40/1.43/1.45)
Fluoro Polymer
AQUATAR-8A (1.41/1.45/1.52)
AQUATAR-8B
for KrF “N” resist
4
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and S5pinfil are
registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow,
SWG, and TARP are trademarks of AZ Electronic Materials.
SWG, and TARP are trademarks of AZ Electronic Materials.
2.4 Resist swing reduction effect in 365nm application
Substrate TARC Develop
: Silicon with HMDS(90C/60s) : 64nm FT, NO PAB : AZ 300MIF(2.38%) , puddle 60s

AADE-14-FTCE-05

Copyright 2014, AADEThis paper was prepared for presentation at the 2014AADE Fluids Technical Conference and Exhibition held at the Hilton Houston North Hotel, Houston, Texas, April 15-16, 2014. This conference was sponsored by the American Association of Drilling Engineers. The information presented in this paper does not reflect any position, claim or endorsement made or implied by the American Association of Drilling Engineers, their officers or members. Questions concerning the content of this paper should be directed to the individual(s) listed as author(s) of this work.AbstractDuring cementing operation, it is critical to determine the flowing of cement slurry between the casing and formation, depth of the circulation losses and fluid loss, setting of cement in place and performance of the cement after hardening. Recent case studies on cementing failures have clearly identified some of these issues that resulted in various types of delays in the cementing operations. At present there is no technology available to monitor cementing operations in real time from the time of placement through the borehole service life. Also, there is no reliable method to determine the length of the competent cement supporting the casing.In this study oil well cement with better sensing properties, henceforth called smart cement, was used to verify that its behavior can be monitored at various stages of construction and during its service life. A series of experiments evaluated the smart well cement behavior with and without up to 0.3% sodium metasilicate (SMS) to determine the sensitivity of the electrical resistivity of cement from curing to hardened state was investigated. The test results showed that SMS reduced the electrical resistivity of the water and cement slurries based on the amount. The SMS up to 0.3% also affected the rheological properties, setting characteristics, and the piezoresistive properties of the smart cement. In a 24-hour period the maximum change in the electrical resistivity (RI24) for the cement without SMS (0.4 water-to-cement ratio) was 175%. The RI24for the cement with SMS varied with the amount of SMS. Addition of 0.2% SMS had a minimal effect on the compressive strength. The smart cement was piezoresistive with the addition of SMS but the sensitivity was decreased.IntroductionAs deepwater exploration and production of oil and gas expands around the world, there are unique challenges in well construction beginning at the seafloor. Recent case studies on cementing failures have clearly identified several issues that resulted in various types of delays in the cementing operations. Also preventing the loss of fluids to the formations and proper well cementing have become critical issues in well construction to ensure wellbore integrity because of varying down hole conditions (Labibzadeh et al., 2010; Eoff et al., 2009; Ravi et al,. 2007; Gill et al., 2005; Fuller et al., 2002). Moreover, the environmental friendliness of the cements is a critical issue that is becoming increasingly important (Dom et al., 2007; Thaemlitz et al., 1999; Durand et al., 1995). Lack of cement returns may compromise the casing support, and excess cement returns can cause problems with flow and control lines (Ravi et al. 2007; Gill et al. 2005; Fuller et al. 2002). Hence there is a need for monitoring the cementing operation in real time. At present there is no technology available to monitor the cementing operation real time from the time of placement through the entire service life of the borehole. Also, there is no reliable method to determine the length of the competent cement supporting the casing.In characterize the behavior of cementitious materials several methods such as X-ray diffraction, calorimetric analysis, scanning electron microscopy, and ultrasonic methods have been in used. Electrical resistivity measurement has been applied by many researches on concrete and other cementing applications (Taylor and Arulanandan, 1974; McCarter et al., 1998and 2006; Vipulanandan et al. 2006), but there are no reports in the literature of electrical resistivity measurements for characterizing oilwell cement. Electrical response characteristics measurement has appropriate sensitivity in monitoring the characteristics of cementitious materials (McCarter et al., 1998). The advantages in using this technique include its accuracy, ease of testing and procedures, and nondestructive characteristics (Vipulanandan et al., 2004-2013). Additionally, this method can be used for monitoring the long term behavior of cement in practice.Electrical resistivity of cement is affected by a number of factors, such as pore structure (continuity and tortuosity), pore solution composition, cementitious content, water-cement (w/c) ratio, moisture content, and temperature (Polder et al., 2001). Moreover, electrical resistivity of cement is dramatically affected by admixtures, due to the resistivity contrast between cement and the admixture substances. Vipulanandan et al. (2004, 2006-2013) have studied the change in electrical resistivity with applied stress, referred to as piezoresistive behavior of modified cementitious and polymer composites. The studies showed that the changes inAADE-14-FTCE-05Characterizing Smart Cement with Sodium Metasilicate for Real Time Monitoring of Ultra-Deepwater Oil Well Cementing ApplicationsCumaraswamy Vipulanandan and Kausar Ali, CIGMAT-University of Houston, Guido Narvaez, Baker Hughes; Donald A.Richardson and James M. Pappas, Research Partnership to Secure Energy for America2 C. Vipulanandan, K. Ali, G. Narvvaez, D. Richardson and J. Pappas AADE-14-FTCE-05resistivity with the applied stress were 30 to 50 times higher than the strain in the materials. Hence, the change in resistivity has the potential to be used to determine the integrity of the materials.Sodium metasilicate (SMS)From the initial use in the late 1800’s sodium silicate based compounds have been used in a number of applications including cementing, grouting, emulsifying, and in cleaning agents. Of the various forms of sodium silicate based compounds, sodium meta silicates (anhydrous) have been used in oil and gas industry related applications. Because of its emulsification and interfacial tension reduction characteristics, SMS has been used in alkaline flooding, a chemical recovery method to recover oil from various types of geological formations and sand (Larrondo et al. 1985).Based on the chemical composition of sodium metasilicate (Na2SiO3), it can react with the cement hydration products, forming various types of calcium silicate hydration gels. Fasesan et al. (2005) investigated the use of 0.5% of sodium metasilicate (by weight of cement) in 50:50 class H cement slurry to replace the 2% bentonite. The study showed that the sodium metasilicate was effective in controlling free water and fluid loss. In many parts of the world, severe lost circulation and weak formations with low fracture characteristics are common. These situations require the use of low-density cement systems that reduce the hydrostatic pressure of the fluid column during the cement placement process. Hence lightweight additives (also known as extenders) are used to reduce the weight of the slurry. Malyshev et al. (2013) used SMS as the extender for a lightweight cement system of density 1500 kg/m3 (12.6 ppg). Hence SMS has multifunctional ability to modify the oil well cement.ObjectivesThe overall objective of the study was to determine the effect of sodium metasilicate on the behavior of smart oil well cement. The specific objectives are as follows:(i) Effect of SMS on the rheological, curing, and electricalproperties of smart oil well cement.(ii) Effect of SMS on the piezoresistive behavior of hardened smart oil well cement.Materials and MethodsMaterialsSmart CementCommercially available oil well cement (Class H cement) was modified with additives to make it a piezoresistive material.Sodium MetasilicateSodium metasilicate, also known as disodium metasilicate, used in this study is a white, odorless, granular anhydrous powder. Based on the data sheet provided by the chemical manufacturer, it has a molecular weight of 122 g/mol, pH of12.5 at 10 g/l at 20 °C (68 °F), melting point of1,090 °C (1,994 °F), density of 2.61 g/cm3 at 20 °C (68 °F), and water solubility of 350 g/L at 20 °C (68 °F).MethodsSodium metasilicate (SMS) solutionThe samples were prepared by mixing selected amount of SMS powder (by weight of water) in water at room temperature. The mixture was blended using a table top blender and the pH was monitored at the end of mixing. Up to 5% SMS solution was prepared to characterize the electrical resistivity properties. Water with and without SMS was used to prepare the cement specimens.Cement MixtureThe samples were prepared according to the API standards. Smart cement with a cement-to-water ratio of 0.4 was used in this study. Two series of cement slurries were prepared with and without selected amount of SMS (0.2%). Cement Specimen PreparationAfter mixing, specimens were prepared using cylindrical molds with a diameter of 2 inches and a height of 4 inches. Two conductive wires were placed in all of the molds which were 5 cm apart. All specimens were capped to minimize moisture loss and were cured up to the day of testing for the piezoresisitivity under compressive loading. Rheological TestsRheological properties determine the ability of cement to be pumped. The rheology tests were performed by utilizing a rotational viscometer at room pressure and temperature at rpms ranging from 3 to 600, and related shear stresses were recorded. The viscometers were calibrated using several standard solutions.Electrical ResistivitySMS SolutionA commercially available conductivity probe was used to measure the conductivity (inverse of resistivity) of the fluids. The resistivity measuring range was from 0.1 Ω.mto10,000Ω.m.Cemen tBased on the results of past studies, electrical resistivity was selected as a monitoring parameter to quantify the performance of modified cement during the curing and hardening process (Vipulanandan et al.2004-2013). Electrical resistivity of the slurries was measured using an API standard resistivity meter. Further, electrical resistance was measured using an inductance –capacitance - resistance (LCR) meter during the curing time. To minimize the contact resistances, the resistance was measured at 300 kHz using the two-wireAADE-14-FTCE-05Characterizing Smart Cement with Sodium Metasilicate for Real Time Monitoring of Oil Well Cement 3method (Vipulanandan et al., 2013). The principle of measuring the resistance is shown in Figure1. Each specimen was calibrated to obtain the electrical resistivity (ρ) from the measured electrical resistance (R) based on the Eqn. (1).ρ = RA/L = R/(L/A) = R/K (1)where L is the distance between the wires, A is the cross-sectional area through which the current is flowing, and L/A is called the geometry factor K. Where parameter K=L/A, the ratio of the cross-sectional area and the length of the material is defined for a particular set-up. If we know the resistivity and the resistance of the material then from the relationship in Eqn. (1) we can determine the parameter K. The resistivity of each cement slurry was determined using the API resistivity meter. Figure 2 shows K values determine for four different cement slurries such as cement slurry with and without Sodium Meta-silicate (SMS). After about 5 hours (300 min), the K value stabilized and it was used to determine the resistivity of the hardened cement specimens. Compressive Strength Tests.Compressive strength of cement determines the ability of cement to stabilize casing in the wellbore. The cylindrical specimen was capped and tested at a predetermined controlled displacement rate. Compression tests were performed on cement samples after 2 and 7 days of curing using a hydraulic compression machine.Piezoresistivity Tests.Piezoresisitivity describes the change in electrical resistivity of a material under pressure. Since oil well cement serves as a pressure-bearing part of wells in real applications, the piezoresistivity of smart cement with and without SMS was investigated under compressive loading. During each compression test, electrical resistance was measured in the stress axis. To eliminate the polarization effect, alternating current (AC) resistance measurements were made using a LCR meter at a frequency of 300 KHz. Furthermore, changes in resistivity were related to the applied stress.Results and DiscussionsResultsThe average unit weight of the cement slurry was 121. 5 pcf.SMS SolutionpHAddition of SMS to the water increased the pH as shown in Figure 3. With the addition of 0.1% SMS, the water pH increased from 7.7 to 11.8, a 50% change in the pH. With the addition of 0.3% SMS the pH was 12.4.ResistivityThe resistivity of sodium metasilicate solution was determined with the conductivity probe. SMS solution was very sensitive to electrical resistivity. The resistivity of water decreased from 21Ω.m to 4.15 Ω.m with an addition of only 0.1% SMS (Figure 4), 80% reduction in resistivity. The addition of more SMS further reduced the resistivity of the solution. The following relationship is proposed based on the experimental results:ρ = ρo– S/(E +DS) (2)where:ρ = resistivity of the sodium metasilicate solutionρo = resistivity of tap water without sodium metasilicate(21 Ω.m)S = Concentration of sodium metasilicate (% byweight)Parameters E and D are model parameters: parameter E represent the initial rate of change and parameter D determines the ultimate resistivity. Experimental results matched very well with the proposed model with a coefficient of determination (R2) of 0.98, and parameters E and D were found as 0.0016/Ω.m and 0.047/Ω.m, respectively. Rheological propertiesGel StrengthFor the smart cement, after 10 seconds gel strength was 12 lb/100 ft2, and after 10 minutes gel strength was 14 lb/100 ft2.With the addition of 0.2% SMS to the cement the 10-second gel strength was 15 lb/100 ft2and the 10-minute gel strength was 17 lb/100 ft2. Hence, addition of 0.2 SMS increased the 10-second gel strength by 25% and the 10-minute gel strength by 21%.Effect of SMSIt was evident from the rheological tests on cement slurries with and without 0.2% SMS that the addition of SMS negatively affects the shear-thinning behavior of cement. Addition of SMS increased the viscous behavior of the cement. For instance, the viscosity of cement without SMS at a shear strain rate of 100 (1/sec) was 146 cP. At the same shear strain rate the 0.2 percent SMS sample had viscosity of 225 cP, a 54% increase in viscosity.ModelingDue to the shear-thinning behavior of the cement slurries the Bingham plastic model was not an accurate model to estimate the shear strain rate – shear stress relationship. To predict the shear strain rate - shear stress relationship, the Herschel-Bulkley model (Eqn.3) and hyperbolic model (Eqn.4) were used to predict the experimental data.The Herschel–Bulkley (H-B) model follows:τ = τo+ k γn (3)where:τ= shear stressγ= shear rateτo= yield stressk and n are model parameters.From the smart cement, the k and n were found to be4 C. Vipulanandan, K. Ali, G. Narvvaez, D. Richardson and J. Pappas AADE-14-FTCE-051.09 and 0.78, respectively (Figure 5). The coefficient of determination (R2) was 0.97. The yield stress was found as 1.87 lb/100 ft2.For the cement slurry with 0.2% sodium meta-silicate the k and n (for Herschel–Bulkley model)were found to be 0.61 and 0.88, respectively (Figure 6). The coefficient of correlation was 0.99. The yield stress was 13.8 lb/100 ft2, a notable increase in the yield stress with the addition of 0.2% SMS.The hyperbolic model is as follows:τ= τo + γ/(A+Bγ) (4)where.τ= shear stressτo= yield stressA andB are model parameters.Here for the smart cement parameters A and B were found as 2.83(Pa.sec)-1and 0.001Pa-1,respectively, and the coefficient of determination (R2) was 0.97. The yield stress was 5.01 lb/100 ft2. The apparent viscosity at 600 RPM was 106 cP.For the smart cement with 0.2 SMS, the hyperbolic model parameters A and B were found as3.21(Pa.sec)-1and 0.0004Pa-1,respectively, and the coefficient of determination (R2) was found to be 0.99. The yield stress was17.4lb/100 ft2.With the addition of 0.2% SMS the apparent viscosity at 600 RPM was 136 cP, a 28% increase.Fluid LossFor the smart cement the total fluid loss was 137 cc. Smart cement (w/c ratio of 0.4) with the addition of 0.2% SMS had a fluid loss of 145 cc (Figure 7), hence a 6% increase in the fluid loss.Electrical ResistivityInitial ResistivityThe electrical resistivity of the cement slurry with and without SMS was determined. The initial resistivity of the smart cement slurry was 0.97 Ω.m, and it decreased with the addition of sodium metasilicate, as shown in Figure8. With the addition of 0.1% SMS the resistivity decreased to 0.92 Ω.m, a 5% reduction. With the addition of 0.2% and 0.3%SMS the resistivity were 0.9 Ω.m and 0.88 Ω.m. Hence the resistivity was sensitive to the concentration of SMS in the cement. Resistivity during Curing ProcessElectrical resistivity could be used as a fingerprint of the curing process. Figure 9 illustrates the change in electrical resistivity (ρ) during curing time for smart cement with and without SMS. It was observed that the curves of the different samples, with and without SMS, follow a similar trend with time. The electrical resistivity dropped to a minimum value, and then gradually increased with time. After initially mixing cement with water, resistivity decreased to a minimum value (ρmin), and the corresponding time to reach the minimum resistivity was t min. The decrease in resistivity immediately after mixing was due to dissolution of soluble ions from the cement particles after cement was mixed with water, and the dissolving process of the ions caused the resistivity decrease during early periods. The term t min can be used as an index of speed of chemical reactions and cement set times. With the formation of resistive solid hydration products that block the conduction path, resistivity increased sharply with curing time. The following increase in electrical resistivity was caused by the formation of a large amount of hydration products in the cement matrix. Finally, a relatively stable increasing trend was reached by the ion diffusion control of hydration process. Resistivity increased steadily up to 24 hours and reached a value of ρ24. Change in electrical resistivity with respect to minimum resistivity quantifies the formation of solid hydration products, which leads to the strength development in the curing cement. Therefore, by tracking the change in resistivity of oil well cement, a clear understanding of the hydration process and strength development can be obtained. Hence the Resistivity Index at 24 hours (RI24) is defined as the maximum change in resistivity in 24 hours to reflect the changes in resistivity.Variations in electrical resistivity with time for samples with different amounts of SMS are summarized in Table 1. Increasing SMS content decreased the minimum resistivity of cement (ρmin). This is another indicator of the increased chemical reaction between the cement and SMS. With 0.2 percent SMS the minimum resistivity of cement decreased from 0.81 Ω.m to 0.75 Ω.m,a 7.5% percent decrease. Also, addition of SMS increased both the t min, and the rate of change in resistivity. RI(24)for the smart cement was 175 percent (Table 1). With the addition of SMS, RI(24) varied from 178 to 196 (%). In general, higher change in electrical resistivity (ρ24–ρmin) indicates that increased hydration products are developed in the hydrating cement system.Compressive StrengthEffect of SMSThe compressive strength of smart cement without any SMS was 1.0 ksi and 2.5 ksi after 2 days and 7 days of curing, respectively. As shown in Figs. 10 and 11, the addition of 0.2% SMS did not affect the compressive strength of cement. PiezoresistivityThe piezoresistive behavior (compressive stress versus change in resistivity) of cement with and without SMS is shown in Figs. 10 and 11 after 2 days and 7 days curing, respectively. Electrical resistivity was sensitive to compressive stress. Figures 10 and 11 show that electrical resistivity increased during compressive loading. Addition of SMS reduced the piezoresistive response of smart cement. After two days of curing the smart cement failed at a resistivity change of 550 percent, while the 0.2 percent SMS added cement failed at a resistivity change of 150 percent. After seven days of curing the smart cement failed at a resistivity change of 800 percent, while the 0.2 percent SMS added cement failed at a resistivity change of 200 percent. The failure strain is 0.25 percent, and hence the change in the resistivity of cement with 0.2 percent of SMS was 800 times higher than the strain.AADE-14-FTCE-05Characterizing Smart Cement with Sodium Metasilicate for Real Time Monitoring of Oil Well Cement 5ConclusionsBased on this experimental and analytical study on smart cement with the addition of sodium metasilicate (SMS), the following conclusions are advanced:1)Addition of 0.1% SMS increased the pH and reducedthe resistivity of water by 50% and 80%,respectively. The change in resistivity of water withthe addition of SMS has been modeled.2)Addition of 0.2% SMS increased both the 10-secondand 10-minute gel strength by over 20%.3)Addition of 0.2% SMS increased the yield strength,viscosity, and fluid loss. Shear stress and shear strainrate relationships have been modeled.4)Electrical resistivity developments with hydrationtime of the cement with different amounts of SMSfollow a similar pattern: they first drop to a minimumpoint and then gradually increase with time. Theminimum resistivity decreased, and the time toachieve minimum resistivity (rate of change)increased with the addition of increasing SMS. Theresistivity index (RI(24)) of the cement with andwithout SMS were comparable.5)The smart cement showed piezoresistive behavior.Addition of SMS reduced the piezoresistive behaviorof the smart cement. Addition of 0.2% SMS did notaffect the compressive strength of the smart cement. AcknowledgementsThis study was supported by the Center for Innovative Grouting Materials and Technology (CIGMAT) at the University of Houston, Texas. Funding for the project (Project No. 10121-4501-01) is provided through the “Ultra-Deepwater and Unconventional Natural Gas and Other Petroleum Resources Research and Development Program” authorized by the Energy Policy Act of 2005. This program—funded from lease bonuses and royalties paid by industry to produce oil and gas on federal lands—is designed to assess and mitigate risk enhancing the environmental sustainability of oil and gas exploration and production activities. RPSEA is under contract with the U.S. Department of Energy’s National Energy Technology Laboratory to administer three areas of research. RPSEA is a 501(c) (3) nonprofit consortium with more than 180 members, including 24 of the nation's premier research universities, five national laboratories, other major research institutions, large and small energy producers and energy consumers. The mission of RPSEA, headquartered in Sugar Land, Texas, is to provide a stewardship role in ensuring the focused research, development and deployment of safe and environmentally responsible technology that can effectively deliver hydrocarbons from domestic resources to the citizens of theUnited States. Additional information can be found at .References1.API Recommended Practice 10B (1997),Recommended Practice for Testing Well CementsExploration and Production Department, 22nd Edition. 2.API Recommended Practice 65 (2002) CementingShallow Water Flow Zones in Deepwater Wells.3.Banthia, N. and Dubeau, S. (1994),”Carbon and SteelMicro-Fiber Reinforced Cement Based Compositesfor Thin Repairs,”Journal of Materials in CivilEngineering, Vol. 6, No. 1, pp. 88-99.4.Bao-guo, H. and Jin-ping, O. (2008). “Humiditysensing property of cements with added carbon," NewCarbon Materials, Vol: 23, 382-384.5.Chung, D. D. L (1995), "Strain Sensors Based onEl ectrical Resistance Change,” Smart MaterialsStructures, No. 4, pp. 59-61.6.Chung, D.D.L (2001), “Functional Properties ofcement-Matrix Composites,” Journal of MaterialScience, Vol. 36, pp. 1315-1324.7.Dom, P. B., S. Rabke, et al. (2007). "Development,verification, and improvement of a sediment-toxicitytest for regulatory compliance." SPE Drilling &Completion, Vol. 22(2), 90-97.8.Durand, C., T. Forsans, et al. (1995). "Influence ofClays on Borehole Stability - A Literature Survey"Revue De L Institut Francais Du Petrole , Vol. 50(2),187-218.9.Eoff, L. and Waltman, B. (2009) "Polymer TreatmentControls Fluid Loss While Maintaining HydrocarbonFlow,” Journal of Petroleum Technology, pp. 28-30. 10.Fasesan, O. A., Heinze, L. R., and Walser D. W.(2005) “Enhanced Properties and Cost EffectiveApplication With Incremental Improvements in 50;50Poz Cementing,” Proceedings, Canadian Internationalpetroleum Conference, Calgary, Alberta, Canada,paper 2005-201.11.Fuller, G., Souza, P., Ferreira, L., and Rouat, D.(2002). "High-Strength Lightweight Blend ImprovesDeepwater Cementing," Oil & Gas Journal, Vol. 100,No.8, pp. 86-95.12.Gill, C., Fuller, G. A., and Faul, R. (2005)"Deepwater Cementing Best Practices for theRiserless Section,” AADE-05-NTCE-70, pp. 1-14.13.Griffith, J. and Faul, R. (1997) "Mud ManagementSpecial Slurries Improve Deepwater CementingOperations,” Oil and Gas Journal, Vol. 95, No. 42, pp.49-51.14.Heidari, M., Vipulanandan, C., and Richardson, D.(2013), “Change in Resistance of Modified Oil WellCement with Silica Fume,”Proceedings, CIGMAT -2013,(/sites/cigmat/files/conference/poster/2013/10_2.pdf).15.John B. (1992). “Class G and H Basic Oil WellCements,” World Cement.6 C. Vipulanandan, K. Ali, G. Narvvaez, D. Richardson and J. Pappas AADE-14-FTCE-0516.Kim, J. and Vipulanandan, C. (2006)"Removal ofLead from Contaminated Water and Clay Soil Using a Biosurfactant," Journal of Environmental Engineering, Vol. 132, No. 7, pp.857-865.17.Kim, J. and Vipulanandan, C. (2003) "Effect of pH,Sulfate and Sodium on the EDTA titration of Calcium," Cement and Concrete Research, Vol. 33(5), pp. 621-627.bibzadeh, M., Zhhabizadeh, B., and Khajehdezfuly,A. (2010) "Early Age Compressive StrengthAssessment of Oil Well Class G Cement Due to Borehole Pressure and Temperature Changes,”Journal of American Science, Vol. 6, No.7, pp.38-47.rrondo, L. E., Urness, C. M., and Milosz, G. M.,.(1985) “Laboratory Evaluation of Sodium Hydroxide, Sodium Orthosilicate and Sodium Metasilicate as Alkaline Flooding Agents for a Western Canada R eservoir,” SPE 13577, Phoenix, Arizona.20.Liu, J., Vipulanandan, C., and Richardson, D. (2013),“Piezoresistive Behavior of Modified oil Well Cement with Nickel,” Proceedings, CIGMAT -2013 (/sites/cigmat/files/conference/poster/2013/7_2.pdf)21.Malyshev, A., Doronina, T. Popov, M. andRyabchikov, A.. (2013) “Optimizing Particle Size Distribution Lightweight Cement at low temperatures:Case Study from Eastern Siberia Russi a,” SPE 166849, Moscow, Russia.22.McCarter, W. J. (2006) “Monitoring the Influence ofWater and Ionic Ingress on Cover-Zone Concrete Subjected to Repeated Absorption,” Cement, C oncrete and Aggregates 18.23. McCarter, W. J.and Ezirim H. C. (1998) “Monitoringthe Early Hydration of Pozzolan-Ca(OH)2 Mixtures Using Electrical Methods”[J]. Advances in Cement Research, 10(4): 161-168.24.Mirza, J. et al. (2002) "Basic Rheological andmechanical properties of High Volume Fly Ash Grouts," Construction and Building Materials, Vol.16, pp.353-363.25.Park, J., Vipulanandan, C., Kim, J., and Oh, M. H.(2006) "Effect of Surfactants and Electrolyte Solutions on the Properties of Soils," Journal of Environmental Geology, Vol. 49, pp.977-989.26.Ravi, K. et al. (2007) "Comparative Study ofmechanical Properties of Density-reduced Cement Compositions,” SPE Drilling & Completion, Vol. 22, No. 2, pp. 119-126.27.Ramachandran, V. S. (1984) Concrete AdmixtureHandbook, Noyes Publication, Park Ridge, New Jersey, 628 pp.28.Taylor, M. A. and Arulanandan, K.. (1974)."Relationship Between Elecetrical and Physical properties of Cement paste, Cement and Concrete Research, Vol. 4, pp. 881.29.Thaemlitz, J., A. D. Patel, et al. (1999). "Newenvironmentally safe high-temperature water-baseddrilling-fluid system." SPE Drilling & Completion Vol. 14(3), 185-189.30.Vipulanandan, C. and Prashanth, P. (2013)"Impedance Spectroscopy Characterization of a Piezoresistive Structural Polymer Composite Bulk Sensor,”Journal of Testing and Evaluation, ASTM, Vol. 41, No. 6, pp. 898-904.31.Vipulanandan, C. and Garas, V. (2008) "ElectricalResistivity, Pulse Velocity and Compressive Properties of Carbon Fiber Reinforced Cement Mortar,” Journal of Materials in Civil Engine ering, Vol. 20, No. 2 , pp. 93-101.32.Vipulanandan, C. and Liu, J. (2005) "PolyurethaneBased Grouts for Deep Off-Shore Pipe-in-Pipe Application", Proceedings, Pipelines 2005, ASCE, Houston, TX, pp. 216-227.33.Vipulanandan, C.,and Garas, V. (2006),"Piezoresistivity of Carbon Fiber Reinforced Cement Mortar", Proceedings, Engineering, Construction and Operations in Challenging Environments,”Earth & Space 2006, Proceedings ASCE Aerospace Division, League City, TX, CD-ROM.34.Vipulanandan, C. and Sett, K. (2004) "Developmentand Characterization of Piezoresistive Smart Structural Materials," Proceedings, Engineering, Construction and Operations in Challenging Environments, Earth & Space 2004, ASCE Aerospace Division, League City, TX, pp. 656-663.35.Wang, S. Y. and Vipulanandan, C. (1996)"Leachability of Lead From Solidified Cement-Fly Ash Binders," Cement and Concrete Research, Vol.26, No. 6, pp. 895-905.36.Zhang M., Sisomphon K., Ng T.S, and Sun D.J.(2010). “Effect of superplasticizers on workability retention and ini tial setting time of cement pastes,”Construction and Building Materials 24, 1700–1707.37.Zhang J., Weissinger E.A, Peethamparan S., andScherer G.W. (2010). “Early hydration and setting of oil well cement,” Cement and Concrete research, Vol.40, 1023-1033.。

artioscad 14使用手册

标题：深入了解ArtiosCAD 14：高效应用与技术指南在现代包装设计和制造行业中，ArtiosCAD 14无疑是一款备受青睐的软件。

作为一名制造商、设计师或工程师，了解如何高效地运用ArtiosCAD 14对于优化包装设计、提高生产效率至关重要。

本文将深入探讨ArtiosCAD 14的使用方法和技术指南，以帮助你更好地掌握该软件，提升工作效率。

一、ArtiosCAD 14简介ArtiosCAD 14是一款专业的三维包装设计软件，广泛应用于包装行业。

它提供了丰富的设计工具和功能，能够帮助用户快速、精准地创建各种类型的包装设计。

与之前版本相比，ArtiosCAD 14在性能和功能上都得到了显著提升，为用户带来更加高效、便捷的设计体验。

二、ArtiosCAD 14的基本操作1. 界面介绍ArtiosCAD 14的界面清晰简洁，主要分为菜单栏、工具栏、属性栏和绘图区域。

在开始使用时，首先需要熟悉各个界面元素的作用和功能，以便更好地进行操作。

2. 创建新设计在ArtiosCAD 14中，用户可以通过“新建”功能创建新的包装设计项目。

在创建新设计时，需要选择适合的包装类型和尺寸，以及相关的材质和厚度参数。

3. 绘制包装结构ArtiosCAD 14提供了丰富的绘图工具，用户可以根据需要绘制各种复杂的包装结构。

通过使用矩形、圆角矩形、多边形等基本形状工具，结合拖动、旋转、缩放等操作，可以轻松创建出符合要求的包装结构。

4. 添加图纸和文字在设计过程中，用户可以通过添加图纸和文字等元素，对包装设计进行补充和说明。

ArtiosCAD 14提供了丰富的文字编辑和排版功能，可以满足用户对于包装设计的各种要求。

5. 三维预览和导出在设计完成后，ArtiosCAD 14还支持对包装结构进行三维预览和导出。

用户可以通过不同角度观察包装设计的效果，并且将设计结果导出为3D模型文件，以便后续的生产和制造。

三、技术指南1. 最佳实践在使用ArtiosCAD 14进行包装设计时，需要遵循一些最佳实践，以确保设计的准确性和可制造性。

IAQG AS9104 产品质量管理系统标准说明书

¾ ISO/IEC Guide 62 General requirements for Bodies Operating Assessment and Certification/Registration of Quality Systems.
¾ IAF Guidance on the Application of ISO/IEC Guide 61.
Accredited CRBs
Qualified and
Approved Auditors
Use of International Aerospace
Standards
Global Acceptance
Controlled Use of Assessment Results
These requirements are applicable to IAQG Sector Schemes when making use of ABs, CRBs and their auditors, for the assessment and certification/registration of supplier quality systems in accordance with the
Definitions – AS9104 – Clause 3
3.6 Certification/Registration Body (CRB):
¾ A party that audits and certifies/registers the quality management system of organizations with respect to published quality management system standards and any supplementary documentation required under the system.

Thermo Scientific

DATA SHEET 2D Labtainer BioProcess Containers2D Labtainer BioProcess Container (BPC) systemsWhether in standard or customized configurations, Labtainer BPCs are ideal for:• Dispensing, packaging, and storing cell culture media, buffers, and process liquids• Delivery of cell culture media or process liquids to small-scale bioprocess systems• Bioreactor and fermentation feed, sampling, and harvest • Chromatography feed and fraction collection• Storage and transport of bulk intermediate products, process intermediates, vaccine conjugates, and other biological productsSmall-volume liquid handling systems for cell culture and bioprocessingThermo Scientific ™ Labtainer ™ BioProcess Containers (BPCs) effectively address small-volume liquid handling needs. They range in size from 50 mL to 50 L, with avariety of standard configurations to meet most application needs. These Labtainer BPCs are space efficient, ergonomic, and constructed of Thermo Scientific ™Aegis ™ 5-14 and CX5-14 films. Product configurations cover a range of industry-standard connection systems, and handling systems are available for transport and storage.Standard productsStandard Labtainer BPCs are stocked for immediate delivery and are fully supported by our process and product validation program. For more information on our validation program, please refer to our validation guides for Aegis5-14 and CX5-14 films. Additionally, standard Labtainer BPCs have validated liquid shipping configurations.Standard configurations can be customized for optimal fit, form, and function to address process-specific applications using one of the industry’s largest libraries of qualified components.2D Labtainer BPCs are available with the Thermo Scientific ™ BioTitan ™ Retention Device. This universaltubing retention solution was designed to provide the best method for retaining flexible tubing on a barbed fitting and helps eliminate the risk of leaks and failure of the tubingconnection point.Table 1. Chamber information.50 mL–2 L, 2-port Labtainer BPC 2 L–50 L, 3-port Labtainer BPC2 L–50 L: Polyethylene ports are welded into the BPC seam: one 1/4 in. ID and two 3/8 in. ID ports on standard chamber.Table 2. Custom BPC options.Tubing type C-Flex™ (animal origin–free), silicone, PharMed™, or AdvantaFlex™Tubing size Specific lengths of 3.18–25.4 mm ID (1/8–1 in.); specific length depends on type of tubing chosenConnectors • Luer: 3.18–6.35 mm (1/8–1/4 in.) ID• CPC quick-connect: 6.35–19 mm (1/4–3/4 in.) ID• Steam-in-place connector: 6.35–19 mm (1/4–3/4 in.) ID• Tri-clamp: 3.18–25.4 mm (1/8–1 in.) ID• Mini tri-clamp: 3.18–12.7 mm (1/8–1/2 in.) ID• Aseptic connection and aseptic disconnection devices: all available sizes of Colder AseptiQuik™, Pall™ Kleenpak™, Cytiva ReadyMate™ DACOthers • Needle-free sample port (SmartSite™ or Clave™ products)• Filter capsule (Millipore™, Pall™, Sartorius™, Parker Bioscience™, Meissner™ products)Table 3. Presentation (as dry BPC systems).Outer packaging Supplied “flat-packed”—two polyethylene outer layersLabel • Description• Product code• Lot number• Expiration date on outer packaging and shipping containerSterilization Irradiation (25–40 kGy) inner side of outer packaging Shipping container Durable cardboard cartonDocumentation • Certificate of Analysis provided with each batch for each delivery • Certificate of Irradiation2 portsPack of 10Line 1Luer lock body connection, polypropyleneTubing: C-Flex; 30 cm (12 in.) lengthID x OD: 3.18 x 6.35 mm (0.125 x 0.25 in.)Line 2Luer lock insert connection, polypropyleneTubing: C-Flex; 30 cm (12 in.) lengthID x OD: 3.18 x 6.35 mm (0.125 x 0.25 in.) Line 1Luer lock body connection, polypropyleneTubing: C-Flex; 8 cm (3 in.) lengthID x OD: 6.35 x 10.92 mm (0.25 x 0.43 in.)Line 2Luer lock insert connection, polypropyleneTubing: C-Flex; 8 cm (3 in.) lengthID x OD: 6.35 x 10.92 mm (0.25 x 0.43 in.)Line 1Luer lock body connection, polypropyleneTubing: C-Flex; 30 cm (12 in.) lengthID x OD: 3.18 x 6.35 mm (0.125 x 0.25 in.)Line 2MPC insert, polycarbonateTubing: C-Flex; 8 cm (3 in.) lengthID x OD: 3.18 x 6.35 mm (0.125 x 0.25 in.)2 portsPack of 10Pack of 10Line 1Luer lock insert connection, polypropyleneTubing: C-Flex; 30 cm (12 in.) length ID x OD: 6.35 x 9.7 mm (0.25 x 0.38 in.)Line 2Luer lock body connection, polypropylene Tubing: C-Flex; 30 cm (12 in.) length ID x OD: 6.35 x 9.7 mm (0.25 x 0.38 in.)Line 3Luer lock body connection, polypropylene Tubing: C-Flex; 30 cm (12 in.) lengthID x OD: 3.18 x 6.35 mm (0.125 x 0.25 in.)Line 1MPC insert, polycarbonateTubing: C-Flex; 61 cm (24 in.) length ID x OD: 9.7 x 15.9 mm (0.38 x 0.63 in.)Line 2MPC body, polycarbonateTubing: C-Flex; 61 cm (24 in.) length ID x OD: 9.7 x 15.9 mm (0.38 x 0.63 in.)Line 3Luer lock body connection, polypropylene Tubing: C-Flex; 61 cm (24 in.) length ID x OD: 3.18 x 6.35 mm (0.125 x 0.25 in.)Line 1MPC insert, polycarbonateTubing: C-Flex; 30 cm (12 in.) length ID x OD: 9.7 x 12.7 mm (0.38 x 0.5 in.)Line 2MPC insert, polycarbonateTubing: C-Flex; 30 cm (12 in.) length ID x OD: 9.7 x 12.7 mm (0.38 x 0.5 in.)Line 3End plug, polypropyleneTubing: C-Flex; 8 cm (3 in.) lengthID x OD: 6.35 x 10.92 mm (0.25 x 0.43 in.)3 portsSingle pack3 portsSingle packSingle pack—edge portsLine 1MPC insert, polycarbonateTubing: C-Flex; 8 cm (3 in.) lengthID x OD: 9.6 x 12.7 mm (0.378 x 0.50 in.)Line 2MPC insert, polycarbonateTubing: C-Flex; 8 cm (3 in.) lengthID x OD: 9.6 x 12.7 mm (0.378 x 0.50 in.)Line 3Injection portTubing: C-Flex; 8 cm (3 in.) lengthID x OD: 6.35 x 9.53 mm (0.25 x 0.375 in.)Note: Aegis5-14 film equivalents for this product areavailable as custom configurations.Line 1MPC insert, polycarbonateTubing: C-Flex; 46 cm (18 in.) lengthID x OD: 3.18 x 6.35 mm (0.125 x 0.25 in.)Line 2MPC body, polypropyleneTubing: C-Flex; 61 cm (24 in.) lengthID x OD: 9.53 x 15.875 mm (0.375 x 0.625 in.)Line 3Luer lock body connection, polypropyleneTubing: C-Flex; 61 cm (24 in.) lengthID x OD: 9.53 x 15.875 mm (0.375 x 0.625 in.)3 portsSingle pack—pillow design withpanel portsFind out more at /bpcFor Research Use or Further Manufacturing. Not for diagnostic use or direct administration into humans or animals.© 2021 Thermo Fisher Scientific Inc. All rights reserved. All trademarks are the property of Thermo Fisher Scientific and its subsidiaries unlessotherwise specified. C-Flex and PharMed are trademarks of Saint-Gobain Performance Plastics. AdvantaFlex is a trademark of NewAge Industries, Inc. AseptiQuik is a trademark of Colder Products Company. Pall and Kleenpak are trademarks of Pall Corporation. ReadyMate is a trademark of Cytiva. SmartSite is a trademark of Becton, Dickinson and Company. Clave is a trademark of Victus Inc. Millipore is a trademark of Merck KGaA, Darmstadt, Germany and/or its affiliates. Meissner is a trademark of Meissner Filtration Products. Parker Bioscience is a trademark of Parker Hannifin Corp. Rubbermaid is a trademark of Rubbermaid Incorporated. Sartorius is a trademark of Sartorius AG. Specifications, terms, and pricing are subject toIndustry-standard Rubbermaid ™ totes with corresponding lids are available. They can be used to protect Labtainer BPCs up to 20 L in size during use, transport, and storage. Use standard 50 L drums for 50 L Labtainer BPCs.Tray with lidFlat-bottom, linear low-density polyethylene (LLDPE) drum with lid。

产品图样及设计文件编号规则JB T5054.4

本标准由全国技术产品文件标准化技术委员会提出井归口。
本标准起草单位：中国机械工业标准化技术协会、机械科学研究院。
本标准主要起草人：杨东拜、孟宪培。
JB/T5054.4-2000 产品图样及设计文件编号原则
1 范围
本标准规定了机械工业产品图样及设计文件，包括 CAD 图和设计文件（以下简称图样和文件或 CAD 文件）编号的基本原则和要求。
※※ — ※※※※ —
※※※
零件、分部件序号（流水号）-识别号
部件序号-隶属号
产品代号
图2
7.2.1 零件、分部件序号，规定其中***—***（如 001～099）为分部件序号，***—*** （101～999）为零件序号。零件序号也可按材料性质分类编号。
7.2.2 零件、分部件序号，规定其中逢十的整数（如常 0、20、30、…）为分部件序号，余者为零件序号。
31
使用说明书
32
合格证（合格说明书）
33
质量证明书
34
装箱单
35
包装文件
36
早期故障分析报告
37
用户验收报告
注：通（借）用件汇总表可分为：
通用件汇总表
TY 通用
借用件说明
ZM
证明
ZM
证明
ZZ
质证
BZ
包装
ZG
早故
YY
用验
JB/T 8823-1998
机械工业企业计算机辅助管理信息分类编码导则
3 基本原则
3.1 图样和文件编号一般可采用下列字符：
——0～9 阿拉伯数字； ——A～Z 拉丁字母（O、I 除外）； ——短横线、·圆点、/斜线。 3.2 编号的基本原则 a）科学性选择事物或概念的最稳定的本质属性或特征作为信息分类的基础和依据。 b）系统性将选定的事物、概念的属性或特征按一定排列顺序予以系统化，并形成一个合理的科学分类体系。 c）唯一性一个代码只能唯一地标识一个分类对象。 d）可延性要设置收容类目，以便保证增加新的事物和概念时，不致打乱已建立的分类体系，同时，还应为下级信息管理系统在原有基础上的延拓、细化创造条件。 e）规范性同一层级代码的编写格式必须统一。 4 一般要求 4.1 每个产品、部件、零件的图样和文件均应有独立的代号。 4.1.1 采用表格图时，表中每种规格的产品、部件、零件都应标出独立的代号。 4.1.2 同一产品、部件、零件的图样用数张图纸绘制时，各张图样标注同一代号。 4.1.3 同一 CAD 文件使用两种以上的存储介质时，每种存储介质中的 CAD 文件都应标注同一代号。 4.1.4 通用件的编号应参照 JB/T5054.8 或按企业标准的规定。 4.1.5 借用件的编号应采用被借用件的代号。 4.2 图样和文件的编号一般有分类编号和隶属编号两大类。也可按各行业有关标准规定编号。 4.3 图样和文件的编号应与企业计算机辅助管理分类编号要求相协调。 5 分类编号分类编号，按对象（产品、零部件）功能、形状的相似性，采用十进位分类法进行编号。 5.1 分类编号其代号的基本部分由分类号（大类）、特征号{中类）和识别号（小类）三部分组成.中间以圆点或短横线分开，圆点在下方，短横线在中间。必要时可以在尾部加尾注号。 5.2 大、中、小类的编号按十进位分类编号法。每类的码位一般由 l～4 位数（如级、类、型、种）组成。每位数一般分为十挡，如十级（0～9），每级分十类（o～9），每类分十型（0～9）.每型分十种（0～9）等。

InterGraph产品介绍及其产品体系结构

主要技术特点 2. 2.主要技术特点
2.5 动态显示缓存（DDC技术）
Inte rGraph独有的高速动态显示缓存技术（ Dynamic Display Cac he，简称 DDC），可极大加速图形显示速度。使用 DDC技术搭建的分布式应用系统，各级用户访问数据的速度都不受网络质量的限制。目前此项技术主要应用于移动产品和 G/Te c hnology公用事业行业解决方案产品，用于解决数据量大、数据来源和种类广泛、网络资源分布在多个区域、不同的部门协同工作、大量的应用系统的接口等问题，对于分布式体系结构有独特的用处。
Internet / Intranet
3.GeoMeida 产品体系
Desktop clients Web browsers Handheld Foreign systems Presentation
Cradle
只读实时连接 CAD 文件用于查看 ,分析 ,表达和打印输出
Cradle
Wireless
INTERGRAPH公司创立于 1969 年，是一家全球性的公司，公司总部设在美国阿拉巴玛州汉斯威尔市，是世界上最大的交互式计算机图形系统公司，在世界上 60多个国家和地区设有分支机构现行组织机构分为两大部门：安全、政府及基础设施（ SG&I）和化工、电力及海洋（ PP&M）
安全、政府及基础设施（ SG&I ）部门为安全部门、军队和基础设施管理部门提供地理空间软件和服务，用于建立智能地图和地理信息系统，使客户能高效地管理资源和基础设施；化工、电力及海洋（ PP&M）提供行业领先的厂房和船只设计及信息管理软件。为世界范围的石油和天然气、电力、造船行业、化工和制药企业提供软件，设计厂房和船只，并且创建和管理这些厂房设施。

ExaGrid 产品规格介绍

ExaGrid 部分客户
Manufacturing/ Transportation/Retail Healthcare Banking/Insurance/ Law Business Services Government
2011 ExaGrid Systems, Inc. © 2011 ExaGrid Systems, Inc.
EX5000 “5TB” Example

储存库

磁头存放区= 5TB 储存库= 4.7TB 整体容量= 9.7TB

磁头存放区容量和储存库由系统控制

边界模糊，允许空间弹性变化，多点储存库/少点磁头存放区，相反亦然。从50MB到100MB数据段比较－文件一致的数据段为理想的重复数据删除；数据段大小提供最佳的性能优化每个备份程序
技术测试/认证
CA, CommVault, EMC, HP, IBM (TSM: Q4 ‘11), Microsoft (SQL dumps), Oracle (RMAN), Quest, Symantec, Veeam, VMware
2011 ExaGrid Systems, Inc. © 2011 ExaGrid Systems, Inc.
•ExaGrid 为客户带来最快的数据恢复性能
• •
•ExaGrid 拥有最优的性价比
•
•ExaGrid 重复数据删除产品中拥有最大的伸缩性
•
© 2011 ExaGrid Systems, Inc.
19

ExaGrid 第二代系统架构
•性能优化设计

磁头存放区（缓冲区）

以硬盘速度存放数据能保留数据一个星期以供即时访问最新版本以压缩格式存储的容量，且之前的版本作为字节级增量重复数据删除在这里进行

VSC8514評估板用戶指南说明书

VSC8514User Guide VSC8514 Evaluation BoardMarch 2014Contents1Revision History (1)1.1Revision 1.0 (1)2Introduction (2)3General Description (3)3.1Key Features (3)3.1.1Copper Port RJ45 Connections (3)3.1.2Zarlink ZL30343 SyncE G.8262/SETS (3)3.1.3External RefClk Option (4)3.1.4Recovered Clocks (4)4Quick Start (5)4.1Connecting the Power Supply (5)4.2PC Software Installation (5)4.3Connecting to the Board to the PC (5)4.3.1Changing the IP Address of the Board (5)4.4Using the Control Software (6)4.4.1Board Initialization (7)4.4.2Copper Media Operation (Auto-negotiation Enabled) (7)4.4.3Sync-E Operation (8)4.5Useful Registers (8)4.5.1Ethernet Packet Generator (8)4.5.2Copper PHY Error Counters (8)4.5.3Near-End Loopback (8)4.5.4Far-End Loopback (8)4.5.5QSGMII SerDes Loopback (8)5Additional Information (9)1Revision HistoryThe revision history describes the changes that were implemented in this document. The changes arelisted by revision, starting with the most current publication.1.1Revision 1.0Revision 1.0 of this datasheet was published in March 2014. This was the first publication of thedocument.2IntroductionThe VSC8514 device is a low-power, quad-port Gigabit Ethernet transceiver with copper mediainterfaces. The device includes an integrated quad two-wire serial multiplexer (MUX) to control powerover Ethernet (PoE) modules. It features low electromagnetic interference (EMI) line drivers andintegrated line side termination resistors that conserve both power and board space. Dual recoveredclock outputs are available to support Synchronous Ethernet (Sync-E) applications, each withprogrammable squelch options.This document describes the architecture and usage of the VSC8514 Evaluation Board (VSC8514EV). TheQuick Start section describes how to install and run the graphical user interface (GUI) to fully control theevaluation board.Figure 1 • VSC8514 Evaluation BoardAdditional VSC8514 collateral for both the VSC8514 device and VSC8514EV, including schematics,layout, GUI, and application notes can be found on the VSC8514 product web page at: https://www./products/product.php?number=VSC8514.3General DescriptionThe evaluation board, shown in Figure 1, provides the user a way to evaluate the VSC8514 device inmultiple configurations. Four RJ-45 connectors are provided for copper media interfaces. The MACinterface is exposed via SMA connectors.For access to all of the features of the device, an external microcontroller is used to configure the on-board clock chip via a two wire serial bus and the VSC8514 via the MDIO bus. The GUI enables the userto read and write device registers.3.1Key Features3.1.1Copper Port RJ45 ConnectionsPHY ports 2 and 3 use the UDE RTA 1648BAK1A with integrated magnetic while PHY ports 0 and 1 usegeneric RJ45 connectors with discrete Pulse H5008NL magnetics.SGMII/QSGMII MAC SMAThe QSGMII differential input port is available through SMA connectors J1 and J2, while the output portis available through SMA connectors J4 and J5. Both of them are AC coupled.Switch Block ControlSW1 controls COMA_MODE, CLK_SQUELCH_IN and REFCLKSEL_[1:0]. The default configuration is withall switches set to low as shown in the figure below.Figure 2 • SW1 Switch Control3.1.2Zarlink ZL30343 SyncE G.8262/SETSThe Silabs F311 micro-controller is pre-programmed to configure the Zarlink ZL30343 to provide a 125MHz differential LVPECL clock to the VSC8514 REFCLK input, either based on the 20 MHz on-boardcrystal, or RCVRDCLK1 from the VSC8514 (Sync-E mode). When RCVRDCLK1 is enabled to output aproper 125 MHz clock, the ZL30343 will generate a 125 MHz output clock synchronized to theRCVRDCLK1 and will switch from HOLDOVER mode to LOCK mode as indicated by LEDs D33 and D34 asshown in the figure below.The left side of the illustration shows the HoldOver mode and the right side shows the Lock mode.Figure 3 • ZL30343 LED Indication3.1.3External RefClk OptionThe user may choose to provide an external PHY REFCLK via SMA connections to J21 and J23 (as shownin Figure 3 above). To route the SMA signals to the device the user must reorient the zero ohm resistors,R151, and R152.3.1.4Recovered ClocksThere are two recovered clocks available from the VSC8514, through J22 and J24. In the defaultconfiguration, CLK_SQUELCH_IN is pulled down, which disables the clock squelching and RCVRDCLK1 isconnected to the Zarlink device while RCVRDCLK2 is connected to SMA connector J24. RCVRDCLK1 andRCVRDCLK2 connections can be reconfigured by replacing the zero ohm resistors, R19, and R22,respectively.Network Interface Microcontroller CardA “Rabbit” microcontroller card is included to facilitate a software interface to the registers on theVSC8514. The controller card has a hard coded static IP address. Refer to the label on the card for thevalue. This address is required by the user to initiate communications via the board and the GUI.10.9.70.193The factory programmed Rabbit board IP address is: .1. 2. 3. 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 4Quick Start This section shows the quick start for VSC8514.4.1Connecting the Power SupplyThe evaluation board uses 5 VDC to power the on-board regulators creating the 3.3 V, 2.5 V, and 1.0 V rails which drive the devices as well as modules. The evaluation board can be powered using the power pack which provides the 5 VDC. Simply plug the AC adaptor into a wall socket and the barrel end into J67 (see the upper right corner of Figure 1). Immediately the user should see several LEDs turn on.The user may alternately connect the board to a bench style power supply by connecting the red banana plug to 5 VDC and the black banana plug to ground. If the supply provides 3 A the board should come alive as described above.4.2PC Software InstallationDownload the ZIP file to the PC’s root directory, normally C:\.Extract to C:\Double click the icon to launch the GUI (It is acceptable to drag the icon to the desktop)4.3Connecting to the Board to the PCThe Rabbit board can interface with a PC either through a direct connection to the PC or if configured properly through a local area network. The latter option requires the user to configure the Rabbit’s IP address so as to properly reside on the user’s network.The IP address of the board should be written on the Rabbit network interface daughter board card. The default value should be 10.9.70.193. You will need to use this IP address to initially access the board for operation or to change its IP address.4.3.1Changing the IP Address of the BoardDetermine and write down the new unique IP address you wish to change the board to.Directly connect an Ethernet cable from a PC to the Rabbit board.: Some older PCs do not support auto-crossover on the Ethernet connection so a cross-over NOTE cable may be unch a DOS command window by clicking on the Start->Run button and typing “cmd”.Within the DOS command window type “Telnet”.In the Telnet window, connect to the Rabbit board’s address using the open command by typing open 10.9.70.193, as this is the factory default address.You should have a prompt and be able to type help to get a list of commands available on the Rabbit.a.) If you are unable to connect, then most likely you will need to change the IP address of the connected PC to have the first 3 octets similar to the board by following the subsequent steps.b.) On the PC under Windows -> Control Panel ->Network Connections -> Local Area Connection, right mouse click for Properties. Under the General tab highlight Internet Protocol (TCP/IP) and click on Properties. From there enter the new PC IP address such as 10.9.70.yyy where yyy is a unique value and NOT the same as the Rabbit board. Once complete, return to step 4.From the Telnet window, update the IP address by typing set ip <new IP address> <Enter>, where <new IP address> is in the form of xxx.xxx.xxx.xxx.After hitting <Enter> the IP address will change and the Rabbit will save the value and reboot which may take approximately 1 minute.The Telnet session will disconnect from the board.Change your PC IP address to the same IP network as the Rabbit board.Telnet to the Rabbit e the following commands to complete configuration of the Rabbit board configuration:a) set netmask xxx.xxx.xxx.xxx b) set gateway xxx.xxx.xxx.xxx c) save envPlease record and inform Microsemi of the new IP address of the board when you return so that11. 12. Please record and inform Microsemi of the new IP address of the board when you return so that Microsemi can connect to and reconfigure the board.Re-label the Rabbit board with the new IP.4.4Using the Control SoftwareConnect the VSC8514EV Rabbit microcontroller’s RJ-45 directly to the PC or through a network switch if properly configured. Apply 5 VDC to the EVB.Launch the GUI by double clicking the GUI shortcut located in C:\EliseGUI_4_67 or on the desktop if it has been moved there. The GUI connection window shown in the figure below should appear.Figure 4 • GUI Connection WindowTo make a connection to the EVB, click “Rabbit” and enter the IP address of the EVB, then click on “Connect”. The display next to the IP address window should change to “Connected”. If it does not, check the IP address, or your network configuration until the connection with the EVB can be successfully established.Double click on “MII Registers” and the window shown in the following figure should appear:1. Double click on “MII Registers” and the window shown in the following figure should appear:Figure 5 • MII Registers GUI WindowBe sure the device is up and running by reading MII Register 0. It should read back 0 × 1040. Reading back all 0’s or all 1’s indicates a problem. A checked box means the bit is set to “1,” if unchecked it is “0.”4.4.1Board InitializationOnce the evaluation board connectivity has been established and confirmed, the PHY should be initialized. Initialization can be accomplished by running an init-script sequence, such as performed by the pre- and post-reset functions of the PHY API standalone app.While the init-script sequence may not be required for specific operational modes, an init-script sequence is highly recommended to ensure correct performance over the greatest set of user scenarios for the PHY. After initialization is performed, refer to the PHY datasheet section on configuring the PHY and PHY Interfaces for the desired application.4.4.2Copper Media Operation (Auto-negotiation Enabled)A single register write and some external coax cables enables 1 G Ethernet traffic to be received by the VSC8514 RJ-45 port(s), routed through the VSC8514 and externally looped back via coax cables through the QSGMII interface and transmitted back to the traffic source on the same copper port(s).The following steps are used to setup an external QSGMII loopback:Set up the copper traffic source (i.e., IXIA or Smartbits)1. 2. 3. 4. 5. 6. 7. Set up the copper traffic source (i.e., IXIA or Smartbits)Connect Ethernet cable(s) to a single or multiple RJ-45 ports.Connect two matched coax cables, J1 - J4 and J2 - J5.Write using the "Micro Page Registers" window: 19'd 0 × 400F.Write using the "Micro Page Registers" window: 18'd 0 × 80E0.When "Micro Page" 18'd is read back, bit 15 will clear.Linkup bit is in MII Reg 1, bit 2 (MII 1.2), read twice to update.Traffic should be the following:4.4.3Sync-E OperationTo enable 12 MHz Sync-E operation on this evaluation board a few register writes are required. Write 0 × 8101 on register 23’d of the “Micro Page Registers” to enable RCVRDCLK1 with PHY0 as the clock source when PHY0’s link is up in a non-EEE mode and not 1000BT master or 10BT. To select a different port as the clock source or enable a recovered clock for EEE mode, refer to register 23 G in the datasheet for the programming detail. Set MII Reg.9 bit 12 to enable manual slave configuration then issue an auto negotiation restart through reg.0 bit 9.4.5Useful Registers 4.5.1Ethernet Packet GeneratorExtMII 29E is the Ethernet Packet Generator register. Refer to the datasheet for configuration options.A good CRC packet counter is in ExtMII 18.13:0. A read of the register reads back the good CRC packets and then clears the register so the subsequent reads will be 0 if no traffic has been received. If traffic has been received since the last read, bit 15 will be set.4.5.2Copper PHY Error CountersIdle errors = MII 10.7:0RX errors = MII 19.7:0False carrier = MII 20.7:0Disconnects = MII 21.7:0CRC errors = ExtMII 23.7:04.5.3Near-End LoopbackWhen the near-end loopback test feature is enabled, the transmitted data is looped back in the PCS block on the receive data signals. To enable the loopback, set register bit.0.14 to 1.4.5.4Far-End LoopbackWhen the far-end loopback test feature is enabled, incoming data from a link partner on the Copper interface to be transmitted back to the link partner on the Copper interface. To enable the loopback, set register bit.23.3 to 1.4.5.5QSGMII SerDes LoopbackThere are 3 different types of loopback that occurs in the SerDes block:Input loopback: loops serial data from TDP/N onto RDP/N by writing 0 × 9022 to reg.18G Facility loopback: loops de-serialized data from TDP/N back to the serialized data onto RDP/N by writing 0 × 9022 to reg.18G Equipment loopback: similar to far-end loop but occurs in the SerDes block, by writing 0 × 9042 to reg.18G5Additional InformationFor any additional information or questions regarding the devices mentioned in this document, contactyour local sales representative.Microsemi HeadquartersOne Enterprise, Aliso Viejo,CA 92656 USAWithin the USA: +1 (800) 713-4113Outside the USA: +1 (949) 380-6100Sales: +1 (949) 380-6136Fax: +1 (949) 215-4996Email:***************************© Microsemi. All rights reserved. Microsemi and the Microsemi logo are trademarks of Microsemi Corporation. All other trademarks and service marks are the property of their respective owners.Microsemi makes no warranty, representation, or guarantee regarding the information contained herein or the suitability of its products and services for any particular purpose, nor does Microsemi assume any liability whatsoever arising out of the application or use of any product or circuit. The products sold hereunder and any other products sold by Microsemi have been subject to limited testing and should not be used in conjunction with mission-critical equipment or applications. Any performance specifications are believed to be reliable but are not verified, and Buyer must conduct and complete all performance and other testing of the products, alone and together with, or installed in, any end-products. Buyer shall not rely on any data and performance specifications or parameters provided by Microsemi. It is the Buyer's responsibility to independently determine suitability of any products and to test and verify the same. The information provided by Microsemi hereunder is provided "as is, where is" and with all faults, and the entire risk associated with such information is entirely with the Buyer. Microsemi does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other IP rights, whether with regard to such information itself or anything described by such information. Information provided in this document is proprietary to Microsemi, and Microsemi reserves the right to make any changes to the information in this document or to any products and services at any time without notice.Microsemi, a wholly owned subsidiary of Microchip Technology Inc. (Nasdaq: MCHP), offers a comprehensive portfolio of semiconductor and system solutions for aerospace & defense, communications, data center and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world's standard for time; voice processing devices; RF solutions; discrete components; enterprise storage and communication solutions; security technologies and scalable anti-tamper products; Ethernet solutions; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services. Microsemi is headquartered in Aliso Viejo, California, and has approximately 4,800 employees globally. Learn more at www. .VPPD-03695。

AIAG五大工具手册订购单

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喷涂系统评估（Coating System Assessment）标准 CQI-12
特别针对喷涂特殊工艺的过程审核手册/2007年8月发布
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艾聚达智能AOI管理平台产品手册说明书

新智造艾聚达产品手册
赋能边缘技术，让数字产生力量
S m a r t A O I 管理平台
Smart AOI System Function 模型訓練Func. 1影像檢測使用紀錄訓練排程Func. 2Func. 3Func. 4
Function 1模型訓練
•Step1 Create Project
輸入專案名稱建立影像類別
選擇上傳檔案的方式選取已建立的類別
檔案上傳方式：
1.點擊上傳
2.拖拉上傳
可上傳檔案的格式：
1.影像檔：jpg/jpeg/png/bmp
2.壓縮檔：zip or 7z
＊壓縮檔裡面僅可存放影像檔，並且不能有多個資料夾
可以從其他專案匯入影像，減少重複匯入的動作
可刪除單張影像或修改影像類別
可自行設定訓練參數或直接使用預設的經驗值
按下一步之後即會依設定的參數進行訓練
•Step4 Training Management
成功加入訓練排程
等候主機進行訓練
檢視訓練使
用的參數與
資料集
從訓練成功的模型清單選取要Release檢測的模型
Release模型後即可使用該模型進行影像檢測「Inference」
Function 2影像檢測
選擇專案後系統會自動帶出Release模型的訓練準確度與類別
Function 3使用紀錄
•Func. 3 使用紀錄
選擇專案名稱後會帶出該專案模
型的檢測紀錄
Function 4訓練排程
•Func. 4 訓練排程
目前在GPU主機訓練排程內專案清單
新智造，新未来。

coreldraw14

coreldraw14CorelDRAW 14: A Comprehensive Guide to Graphic Design SoftwareIntroduction:CorelDRAW 14 is a powerful graphic design software that allows users to create stunning visual content for print and web. With its wide range of tools and features, CorelDRAW 14 has become a popular choice among designers and artists. In this comprehensive guide, we will explore the various capabilities of CorelDRAW 14 and provide you with valuable tips and tricks to enhance your design skills.Chapter 1: Getting Started1.1 System Requirements: Before diving into CorelDRAW 14, it is important to ensure that your computer meets the minimum system requirements for a smooth workflow.1.2 Installation: Learn how to download, install, and activate CorelDRAW 14 on your computer.1.3 Interface Overview: Get acquainted with the different components of the CorelDRAW 14 interface, including the toolbar, toolbox, property bar, and docker windows.Chapter 2: Basic Drawing Tools2.1 Shapes and Lines: Discover the various shape and line tools available in CorelDRAW 14, such as rectangles, circles, polygons, and Bézier curves.2.2 Fills and Outlines: Learn how to apply fills and outlines to your shapes, including solid colors, gradients, patterns, and textures.2.3 Object Manipulation: Explore techniques for selecting, resizing, rotating, and aligning objects in CorelDRAW 14.Chapter 3: Advanced Drawing Techniques3.1 Advanced Shape Editing: Master the use of the Shape tool and Node editing to create complex shapes and customize existing ones.3.2 Smart Drawing: Utilize CorelDRAW 14's intelligent drawing features, such as the Smart Drawing tool, which automatically recognizes and adjusts lines to desired shapes.3.3 Blend and Distort: Learn how to blend objects together to create smooth transitions and apply distortions for creative effects.Chapter 4: Text and Typography4.1 Text Basics: Discover how to add and format text in CorelDRAW 14, including adjusting font styles, sizes, alignment, and spacing.4.2 Text Effects: Explore the various text effects available in CorelDRAW 14, such as drop shadows, outlines, and 3D extrusions.4.3 Typography Tips: Learn about the principles of typography, including font pairing, hierarchy, and readability, to enhance your designs.Chapter 5: Advanced Tools and Features5.1 Image Editing: Understand how to edit and enhance images within CorelDRAW 14 using the integrated Photo-Paint application.5.2 Layout and Page Management: Discover techniques for organizing multiple pages and creating layouts for print or web.5.3 Color Management: Learn about color modes, palettes, and color management tools to ensure accurate and consistent color reproduction.Chapter 6: Working with Graphics and Effects6.1 Vector Graphics: Explore the advantages of working with vector graphics and learn how to create scalable and editable illustrations in CorelDRAW 14.6.2 Special Effects: Discover the various special effects available, including transparency, shadows, bevels, and gradients, to add depth and dimension to your designs.6.3 PowerClips and Blend Modes: Master the use of PowerClips to place one object inside another, and leverage blend modes for creative blending and compositing.Chapter 7: Output and Export7.1 Printing: Understand the crucial aspects of preparing your design for print, including color profiles, bleeds, and margins.7.2 Exporting for Web: Learn how to optimize your designs for web use, including saving in appropriate file formats and enhancing loading speed.Conclusion:CorelDRAW 14 offers a comprehensive set of tools and features to fulfill the design needs of both beginners and professionals. With this guide, you have gained a deeper understanding of the software's capabilities and learned valuable techniques to enhance your graphic design skills. Whether you are creating illustrations, logos, or promotional materials, CorelDRAW 14 empowers you to unleash your creativity and bring your ideas to life.。

StarTeam 14.3 发行说明说明书

发行说明Borland Software Corporation700 King Farm Blvd, Suite 400Rockville, MD 20850Copyright © Micro Focus 2014. All rights reserved. Portions Copyright © 1998-2009 BorlandSoftware Corporation (a Micro Focus company).MICRO FOCUS, the Micro Focus logo, and Micro Focus product names are trademarks orregistered trademarks of Micro Focus IP Development Limited or its subsidiaries or affiliatedcompanies in the United States, United Kingdom, and other countries.BORLAND, the Borland logo, and Borland product names are trademarks or registeredtrademarks of Borland Software Corporation or its subsidiaries or affiliated companies in theUnited States, United Kingdom, and other countries.All other marks are the property of their respective owners.2014-09-17ii内容StarTeam 发行说明 (5)新增功能 (6)14.3 (6)所有组件 (6)StarTeam Command Line Tools (6)StarTeam Cross-Platform Client (7)StarTeam Server (7)StarTeam Web Client (7)TeamInspector (7)14.2 (8)StarTeam Web Client (8)14.0 更新版本1 (8)StarTeam Command Line Tools (8)StarTeam Cross-Platform Client (9)StarTeam Datamart (9)StarTeam Layout Designer (10)StarFlow Extensions (10)StarTeam Notification Agent (10)StarTeam Server (10)StarTeam Workflow Designer (11)Borland Connect (11)系统需求 (12)StarTeam Cross-Platform Client 系统需求 (12)StarTeam Datamart 系统需求 (12)StarTeam Eclipse Client 系统需求 (13)StarTeamLayout Designer 系统需求 (14)StarTeamMPX 系统需求 (15)StarTeam Quality Center Synchronizer 系统需求 (16)StarTeam Server 系统需求 (16)操作系统 (16)数据库 (16)Web 浏览器 (17)第三方软件 (17)StarTeam Server 和Microsoft SQL Server Express 在同一台计算机上 (18)StarTeam Server 和数据库在不同计算机上 (18)数据库服务器系统需求 (18)大容量存储器支持 (19)Unicode 字符集 (19)Linux 的系统需求 (19)StarTeam Visual Studio Integration 系统需求 (19)StarTeam Web Client 系统需求 (20)StarTeam Web Server 系统需求 (20)StarTeam Workflow Extensions 系统需求 (20)TeamInspector 系统需求 (20)已知问题 (22)文档已知问题 (22)StarTeam 命令行已知问题 (22)StarTeam Cross-Platform Client 已知问题 (22)StarTeam Datamart 已知问题 (23)内容 | 3StarTeam Eclipse Client 已知问题 (24)StarTeamMPX 已知问题 (25)StarTeam SDK 已知问题 (25)StarTeam Server 已知问题 (25)StarTeam Quality Center Synchronizer 已知问题 (26)StarTeam Visual Studio Integration 已知问题和限制 (27)StarTeam Web Client 已知问题 (28)StarTeam Web Server 已知问题 (29)TeamInspector 已知问题 (29)联系Micro Focus (31)Micro Focus SupportLine 所需的信息 (31)Micro Focus SupportLine 所需的其他信息 (31)正在创建调试文件 (31)许可信息 (31)4 | 内容StarTeam 发行说明这些发行说明包含可能不会出现在“帮助”中的信息。

iPlanet BuyerXpert Version 4.5 用户指南说明书

Administrator’s GuideiPlanet BuyerXpert Version 4.5June 2002Copyright © 2002 Sun Microsystems, Inc. All rights reserved.Sun, Sun Microsystems, the Sun logo, iPlanet, Java and Solaris are trademarks or registered trademarks of Sun Microsystems, Inc. in the United States and other countries.Federal Acquisitions: Commercial Software—Government Users Subject to Standard License Terms and ConditionsThe product described in this document is distributed under licenses restricting its use, copying, distribution, and decompilation. No part of the product or this document may be reproduced in any form by any means without prior written authorization of the Sun Microsystems, Inc. and its licensers, if any.THIS DOCUMENTATION IS PROVIDED “AS IS” AND ALL EXPRESS OR IMPLIED CONDITIONS, REPRESENTATIONS AND WARRANTIES, INCLUDING ANY IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT, ARE DISCLAIMED, EXCEPT TO THE EXTENT THAT SUCH DISCLAIMERS ARE HELD TO BE LEGALLY INVALID._____________________________________________________________________________________Copyright © 2002 Sun Microsystems, Inc. Tous droits réservés.Sun, Sun Microsystems, et Sun logo, iPlanet, Java et Solaris sont des marques de fabrique ou des marques déposées de Sun Microsystems, Inc. aux Etats-Unis et d’autre pays.Le produit décrit dans ce document est distribué selon des conditions de licence qui en restreignent l'utilisation, la copie, la distribution et la décompilation. Aucune partie de ce produit ni de ce document né peut être reproduite sous quelque forme ou par quelque moyen que ce soit sans l’autorisation écrite préalable de Sun Microsystems, Inc. et, le cas échéant, de ses bailleurs de licence. CETTE DOCUMENTATION EST FOURNIE “EN L'ÉTAT”, ET TOUTES CONDITIONS EXPRESSES OU IMPLICITES, TOUTES REPRÉSENTATIONS ET TOUTES GARANTIES, Y COMPRIS TOUTE GARANTIE IMPLICITE D'APTITUDE À LA VENTE, OU À UN BUT PARTICULIER OU DE NON CONTREFAÇON SONT EXCLUES, EXCEPTÉ DANS LA MESURE OÙ DE TELLES EXCLUSIONS SERAIENT CONTRAIRES À LA LOI.ContentsList of Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 About This Document . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Audience . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 What’s in This Document . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Documentation Conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 The Document Online . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 How to Use the Online Help . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Related Documentation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Product Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 How to Report Problems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23Chapter 1 Overview of iPlanet BuyerXpert Administration . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 About iPlanet BuyerXpert Administration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Processes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Resources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Administration Tasks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Administration Tools . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 Stopping and Starting iPlanet BuyerXpert Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 Stopping the BuyerXpert System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 Starting/Restarting the BuyerXpert System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 Guidelines for Restoring Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 When to Restore the Oracle Database . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 When to Restore LDAP Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 When to Restore Customizations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 Administrator’s Role in Upgrading . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32 Administrator’s Role in Upgrading Software . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 333New Version Upgrade . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33Service Pack Upgrade . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 Administrator’s Role in Upgrading Hardware . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 Chapter 2 Configuring Access . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 About Configuring Access . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 Administrator’s Access Tasks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 Configuring iPlanet BuyerXpert for Outbound Documents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 Configuring iPlanet BuyerXpert for Inbound Documents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 Configuring ECXpert . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 Defining ECXpert Members . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40Defining Trading Partnerships . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41Setting Up Maps . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41Defining a Custom Service . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42Defining Service Lists . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 Access Business Rules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 EDI Sender Rule . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43EDI Receiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43EDI Document . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43Pre 4.1SP1 850 Order Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43Auto Submit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43XMIT Currency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 Requirements for Inbound EDI Documents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 Deployment Issues . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 iPlanet ECXpert and HTTPS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 Chapter 3 About iPlanet BuyerXpert Resources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 How Resources Work . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 Administrator Resource Privileges . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 Superadmin (super administrator) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48Orgadmin (organization administrator) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .49Selfadmin (self administrator) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49 Resource Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49 System Resources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49Organization Resources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 Membership Resources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 Member Relationships . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51Organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51Organizational Unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52User . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52User Group . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52Location . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 4iPlanet BuyerXpert Administrator’s Guide• June 2002Accounting Code Resources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 Accounting Code Segments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 Accounting Code Values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 Commodity Code Resources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 Commodity Code Segments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 Commodity Code Values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55 Additional Information Field (AIF) Resources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55 Units of Measure Resources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56 Unit Class . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56 Unit Conversion . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56 System-wide Units of Measure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57 Units of Measure for Organizations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57 Conversion Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58 Pricing Resources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58 Price List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58 Scenario I: Create Price List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59 Scenario II. Create Multi-Org Price List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 Pricing Adjustment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 Column Lookup Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61 Order Adjustments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62 Payment Resources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62 Payment Types and Subtypes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62 Payment Instruments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63 Payment Terms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63 Freight and Shipping Resources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63 Freight Terms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63 Shipping Methods . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64 Shipping Charges . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64 Approval Resources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64 Approval Delegation Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65 Approval Matrix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65 Approval Flow Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66 Multi-Organizational Structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66 Multi-Locale . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66 Multi-Currency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67 Chapter 4 Setting Up Resources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69 Administrator’s Resource Setup Tasks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70 Setting Up Membership . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71 Creating an Organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72 Creating an Organizational Unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72 Creating Users . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73 Creating a User Group . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 735Creating Locations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73 Setting Up Accounting Codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74 Creating Accounting Code Segment Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74Creating Accounting Code Values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74Setting Up Accounting Code Rules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74Creating External API Validation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75 Setting Up Commodity Codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75 Creating Commodity Code Segment Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76Creating Commodity Code Values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76 Setting Up an AIF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76 Creating an AIF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76Assigning AIFs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77 Setting Up Units of Measure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77 Creating System-wide Units of Measure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77Creating Units of Measure for Organizations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78Setting Up Conversion Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78 Setting Up Pricing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79 Creating a Price List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79Creating a Pricing Adjustment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79Creating Pricing Adjustment Rules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83Defining a Column Lookup Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83Creating a Column Lookup Table Adjustment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84Creating Price List Rules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86Creating Order Adjustments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86 Creating an Order-Level Adjustment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86Creating a Line-Level Adjustment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86 Setting Up Payment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87 Creating Payment Types and Subtypes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87Creating Default Payment Subtype Rule . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88Creating Payment Instruments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88Creating Payment Terms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89Creating a Default Payment Terms Rule . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89 Setting Up Freight and Shipping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90 Defining Freight Terms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90Creating a Freight Term Rule . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91Defining Shipping Methods . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92Creating a Default Shipping Method Rule . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92Creating Shipping (Freight) Adjustments and Rules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93 Overview of Process Manager . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93 Overview of Process Manager Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .94 Setting Up Approval . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94 Setting Up Approval Rules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95 Purchase Approval Rule . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95 6iPlanet BuyerXpert Administrator’s Guide• June 2002Escalation Model Rule . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96 Reminder Rule . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96 Approval Limit Rule . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96 Can Delete Approver Rule . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97 Can Escalate Approver Rule . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97 Approver Matrix Types Rule . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98 Can Receive Email Notification Rule . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98 Outstanding Requisition Approvals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99 Setting a Process Definition for an Organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99 Setting the Register Daemon . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99 Creating Approver Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99 Defining an Approval Delegation Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100 Creating an Approval Matrix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100 Setting Up an Approval Flow Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102 Setting Up a Multi-Org Environment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102 Creating the Organizations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103 Creating the Orgadmin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103 Creating People . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103 Creating User Groups . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104 Creating Accounting and Commodity Codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104 Creating Payment Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105 Creating Locations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105 Creating Business Rules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105 Creating Location Rules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105 Creating Order Processing Rules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106 Creating Shipping Rules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106 Creating Pricing Rules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106 Creating Approval Rules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107 Creating a Catalog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107 Approval . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108 Chapter 5 Setting Up Business Rules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109 About Business Rules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110 Rule Elements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110 Rule Name . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111 Applicability Condition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111 Business Roles . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111 Specified Value . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111 Conflict Resolution Strategies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111 Role Ordering Resolution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112 Inheritance Resolution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112 DAG Resolution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113 Duplicate Resolution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1137。

E4A使用手册资料

E4A使用手册资料概述：E4A使用手册是一份详细的指南，旨在帮助用户了解和使用E4A软件。

本文档将提供关于E4A软件的基本信息、安装和配置指南、功能和特性的详细说明，以及常见问题解答等内容。

通过阅读本使用手册，用户将能够充分利用E4A软件的各项功能，提高工作效率和准确性。

1. E4A软件简介1.1 软件概述E4A是一款功能强大的软件，用于数据分析和模型建立。

它提供了一系列的工具和功能，帮助用户处理和分析复杂的数据集，并生成高质量的模型和预测结果。

1.2 主要特性- 数据导入和处理：E4A支持各种数据格式的导入，包括CSV、Excel等。

用户可以通过简单的操作对数据进行清洗、转换和筛选。

- 模型建立和评估：E4A提供了多种建模方法和评估指标，用户可以根据需求选择合适的方法，并根据评估结果进行模型调整和优化。

- 可视化分析：E4A具备强大的可视化功能，用户可以通过图表、图形和地图等形式展示数据分析结果，更直观地理解数据的特征和趋势。

- 自动化和批处理：E4A支持自动化脚本和批处理功能，用户可以编写脚本来实现自动化的数据处理和模型建立，提高工作效率。

2. 安装和配置2.1 系统要求在安装E4A之前，请确保您的计算机满足以下最低系统要求：- 操作系统：Windows 7或更高版本- 处理器：Intel Core i3或更高- 内存：4GB或更多- 存储空间：至少100MB的可用空间2.2 安装步骤以下是安装E4A的基本步骤：1. 下载E4A安装程序。

2. 双击安装程序并按照提示进行安装。

3. 选择安装路径和其他相关设置。

4. 等待安装完成。

2.3 配置和许可证一旦安装完成，您需要进行以下配置和许可证激活步骤：1. 打开E4A软件。

2. 在首次运行时，您将被要求输入许可证信息。

请按照提示完成许可证激活步骤。

3. 如果您有许可证文件，请选择“导入许可证文件”选项，并选择相应的文件进行导入。

4. 完成许可证激活后，您可以根据需要进行其他配置，如语言设置、界面布局等。

爱克发数码工作流程与设备

Raster Preview Automation PDF
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ApogeeX
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爱克发带有数码菲林管理器的工作流程：
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主控端发送
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ApogeeX
jobId_2345.mjd
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Mime数据=色彩管理+RIP后数据 +指令
19
爱克发远程数码打样系统
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Agfa独有的最先进的远程数码打样功能, 其它供应商的远程数码打样是利用 PDF传送,而Agfa远程数码打样同时包含PDF传送和 MIME传送两中方法.
ApogeeX QMS专用质量管理软件, 这是所有其他供应商都无法提供的强大的质量管理软件包.