GSIB2520中文资料
石英晶振2520 30MHz 10PF +-10ppm资料
R0.5
ZHEJIANG EAST CRYSTAL ELECTRONIC.CO.,LTD
DESIGN
陶胜燕
INSPECTION
施俊妍
QUARTZ CRYSTAL UNITS
No: Date:
P: 6/8
ECAB110901 2011/09/01
5-5.REFLOW(WAVE)SOLDERING
Following profile of heat stress is applied to resonator,then being place in the natural condition for 1 hour,resonator shall be measured.
DESIGN
陶胜燕
INSPECTION
施俊妍
QUARTZ CRYSTAL UNITS
No:
Date:
5-10.TEMPERATURE CYCLE Electrical characteristics shall be satisfied after supplying the following temperature cycle(30cycle).Temperature shift from low to high, high to low shall be done in 1℃/sec.
XS-2520
ZHEJIANG EAST CRYSTAL ELECTRONIC.CO.,LTD
DESIGN
陶胜燕
INSPECTION
施俊妍
QUARTZ CRYSTAL UNITS
4-3 MARKING
Year/Month Code
LOT No
No: Date:
GSIB2560中文资料
GSIB2520 thru GSIB2580Vishay Semiconductorsformerly General SemiconductorDocument Number New ProductSingle-Phase Single In-LineBridge RectifiersReverse Voltage 200 to 800VForward Current 25ACase Style GSIB-5SDimensions in millimetersMaximum Ratings & Thermal Characteristics Ratings at 25°C ambient temperature unless otherwise specified.ParameterSymbol GSIB2520GSIB2540GSIB2560GSIB2580Unit Maximum repetitive peak reverse voltage V RRM 200400600800V Maximum RMS voltage V RMS 140280420560V Maximum DC blocking voltage V DC 200400600800V Maximum average forward rectified T C = 98°C 25(1)output current atT A = 25°CI F(AV) 3.5(2)A Peak forward surge current single sine-wave superimposed on rated load (JEDEC Method)I FSM 350A Rating for fusing (t < 8.3ms)I 2t 500A 2sec Maximum thermal resistance per legR θJA 22(2)R θJC 1.0(1)°C/W Operating junction and storage temperature rangeT J , T STG–55 to +150°CElectrical Characteristics Ratings at 25°C ambient temperature unless otherwise specified.ParameterSymbol GSIB2520GSIB2540GSIB2560GSIB2580UnitMaximum instantaneous forward voltage drop per leg at 12.5AV F 1.00V Maximum DC reverse current at T A = 25°C 10rated DC blocking voltage per legT A = 125°CI R350µANotes:(1) Unit case mounted on Al plate heatsink(2) Units mounted on P .C.B. without heatsink(3) Recommended mounting position is to bolt down on heatsink with siliconethermal compound for maximum heat transfer with #6 screwFeatures• Plastic package has Underwriters Laboratory Flammability Classification 94V-0• This series is UL listed under the Recognized Component Index, file number E54214.• High case dielectric strength of 2500 V RMS • Ideal for printed circuit boards • Glass passivated chip junction • High surge current capabilityMechanical DataCase:GSIB-5S Molded plastic bodyTerminals:Plated leads solderable per MIL-STD-750, Method 2026High temperature soldering guaranteed:260°C/10 seconds, 0.375 (9.5mm) lead length,5lbs. (2.3kg) tensionMounting Position:Any (Note 3)Mounting Torque:8 in-lbs max.Weight: 0.26 oz., 7.0 gGSIB2520 thru GSIB2580Vishay Semiconductorsformerly General Semiconductor Document Number 88646Ratings andCharacteristic Curves (T A = 25°C unless otherwise noted)1100Fig. 2 – Maximum Non-Repetitive PeakNumber of Cycles at 60 H Z15200255075100125150A v e r a g e F o r w a r d O u t p u t C u r r e n t (A )0.601.00 1.20 1.400.80Instantaneous Forward Voltage (V)Fig. 3 – Typical Forward CharacteristicsPer Leg20604010080Fig. 4 – Typical Reverse CharacteristicsPer LegPercent of Rated Peak Reverse Voltage (%)10510100I n s t a n t a n e o u s F o r w a r d C u r r e n t (A )Fig. 5 – Typical Junction CapacitancePer LegReverse Voltage (V)J u n c t i o n C a p a c i t a n c e (p F )110100Fig. 6 – Typical Transient ThermalImpedancet, Heating Time (sec)0.11102530Temperature (°C)10Fig. 1 – Derating Curve OutputRectified Current0.01。
硅表中文手册
Chempure++ 1056 在线硅酸根分析仪安装使用说明书特别说明特别说明Emerson Process Management (Rosemount Analytical) 设计、生产和测试过的各种产品均符合许多国家和国际标准，仪器的性能经得起各项相应的产品性能测试。
能够在正常的技术规范内，长期连续运行完好。
在安装、使用与维护Emerson Process Management (Rosemount Analytical) 分析仪器时，要严格执行以下的说明，否则，将可能导致人员伤亡、财产损失、仪器设备损坏和相关的质量承诺失效。
在安装、使用与维护分析仪器设备之前，如果有不能充分理解的地方，请与Emerson Process Management (Rosemount Analytical)。
为了今后对分析仪器进行正确的安装操作与维护，，Emerson Process Management (Rosemount 为了今后对分析仪器进行正确的安装、、操作与维护。
，将所有与仪器产品有关的电缆连接到相应的电源上。
为了确保分析仪器能够表现出理想的性能，安装、调试、操作和维护等工作必须由有资质的专业人员进行。
当需要向厂方购买更换的零配件时，更换工作要由Emerson Process Management (Rosemount Analytical) 指定的有资质的专业人员来进行。
未经授权的零部件替代品会影响产品的性能，并破坏系统操作的安全性，如火灾和电击危险。
言前 言编制该说明书的目的在于提供一份书面材料，以便用户对Chempure++ 1056在线硅酸根分析仪的组件、功能、性能、安装、使用和维护有一个全面的了解。
Chempure++ 1056在线硅酸根分析仪是Emerson Process Management (Rosemount Analytical) 最新推出的产品，可以广泛地应用在电力、石化等领域，主要用来连续监测发电厂锅炉水、锅炉给水、软化水、凝结水及蒸汽冷凝水等。
推挽电路的设计
电力电子应用课程设计班级电气1123 学号姓名专业电气工程与其自动化系别电子与电气工程学院指导教师陈万淮阴工学院电气工程系2015年5月开关电源是在电子、通信、电气、能源、航空航天、军事以与家电等领域应用非常广泛的一种电力电子装置。
它具有电能转换效率高、体积小、重量轻、控制精度高和快速性好等优点，推挽变换器和正激变换器是两种常用的 DC/DC变换器。
推挽电路就是两个不同极性晶体管连接的输出电路。
推挽电路采用两个参数相同的功率BJT 管或MOSFET 管，以推挽方式存在于电路中，各负责正负半周的波形放大任务，电路工作时，两只对称的功率开关管每次只有一个导通，所以导通损耗小效率高。
推挽输出既可以向负载灌电流，也可以从负载抽取电流。
推挽电路适用于低电压大电流的场合，广泛应用于功放电路和开关电源中。
关键词：双端电路推挽变换器一、设计思想与设计原理 01.1 推挽变换器 01.1.1设计目的 01.1.2 工作原理 01.1.3 基本关系 (2)1.2 推挽变换器的参数设计 (2)1.2.1 主功率变压器的设计 (3)1.2.2 开关管的选取 (4)1.2.3 副边整流管的选取 (4)1.2.4 滤波电感的设计 (5)1.2.5 滤波电容的设计 (6)1.2.6 控制电路关键参数设计 (6)二、PWM控制芯片选取与介绍 (7)2.1 PWM控制芯片选取 (7)2.2 KA3525引脚介绍 (7)三、设计调试 (9)四、设计总结： (13)4.1 电路总结 (13)4.2 心得体会 (13)参考文献 (14)一、设计思想与设计原理1.1 推挽变换器1.1.1设计目的通过本课题的分析设计，可以加深学生对间接的直流变流电路基本环节的认识和理解，并且对隔离的DC/DC电路的优缺点有一定的认识。
要求学生掌握推挽变换器的脉冲变压器工作特性，并学会分析该电路的各种工作模态，与开关管、整流二极管的电压电流参数设计和选取，掌握脉冲变压器的设计和基本的绕制方法，熟悉变换器中直流滤波电感的计算和绕制，建立硬件电路并进行开关调试。
OB2520
achieved by the built-in cable drop compensation. The chip consumes very low operation current (typical 300uA), it can achieve less than 30mW standby power to meet strict standby power
Universal AC input
controller for low power AC/DC charger and adapter applications. It operates in primary-side sensing and regulation. Consequently, opto-coupler and TL431 could be eliminated. Proprietary Constant Voltage (CV) and Constant Current (CC) control is integrated as shown in the figure below. In CC control, the current and output power setting can be adjusted externally by the sense resistor Rs at CS pin. In CV control, PFM operations are utilized to achieve high performance and high efficiency. In addition, good load regulation is
P Power Supply
Bright
On
©On-Bright Electronics
欧洲之星私密仪器中文说明书
私密仪器使用说明书目录目录 (3)安全指导 (4)前言 (5)操作说明 (6)1系统操作原理 (6)1.1 CO2激光治疗仪原理 (6)1.2 私密治疗原理 (6)1.3 治疗范围 (7)1.4 产品优势 (7)1.5 仪器描述 (7)1.6 主要组成部分 (7)2 开机准备 (9)2.1 拆包装检查 (9)2.2 连接关节臂 (9)2.3 加冷却液 (9)2.4 检查输入电压 (9)2.5 连接电源线 (9)2.6 连接脚踏开关 (10)2.7 试运行 (10)3 操作方法 (10)3.1 开机界面 (10)3.2 功能选择界面： (10)3.3 美肤模式界面： (11)3.4 普通模式界面： (13)3.5 私密模式界面： (15)3.5设置界面 (17)3.6保护界面 (17)4 指示光 (19)5 注意事项 (19)6 维护保养 (20)6.1 镜头清洁 (20)6.2 机箱清洁 (20)6.3 功率校准 (20)6.4 保险丝更换 (20)6.5刀头消毒 (20)7 随机附件 (20)8 故障排除 (21)9 技术参数 (22)10 质量保证及售后服务 (23)11 系统内部结构图 (24)保修证 (25)安全指导以下信息包括了本产品设计与生产所参照的技术规范以及操作注意事项，为仪器的正确使用提供安全指导。
点阵激光系统的设计与生产遵照了以下3个领域的安全规范：1. 电气安全规范2. 激光辐射安全规范3. 电磁辐射安全规范以上规范所参照的技术标准由国际电工委员会（IEC）制定，标准如下：IEC 60601-1Medical electric equipment part 1: General requirements for safetyIEC 60601-1-2Medical electric equipment general requirement for safety collateral standard: electromagnetic compatibility requirement and testIEC 60601-1-4Medical electric equipment general requirement for safety collateral standard: programmable medical electric equipmentIEC 60602-2-22Medical electric equipment part2, specific safety requirement on diagnosing and treatment laser equipmentIEC 60825-1Radiation safety for laser product, equipment classification requirement and user's guidance.激光系统有安全保护设计，但只有在正确的使用条件下才能确保安全。
富士通PRIMERGY RX2520 M4 两路2U机架式服务器数据手册说明书
数据手册富士通PRIMERGY RX2520 M4 两路2U机架式服务器面向重要业务应用的可扩展机架式服务器富士通PRIMERGY服务器将为您提供应对仸何工作负载以及不断变化的业务要求所需的服务器。
随着业务过程的扩张，对于应用的需求也不断提高。
每个业务过程都有各自的资源足迹，因此您需要寻求一种方式优化计算，以便更好地服务用户。
PRIMERGY产品组合包括用于中小企业和分支机极的可扩展PRIMERGY塔式服务器、多功能机架式服务器、结极紧凑的可扩展刀片系统以及超融合横向扩展服务器，使您的计算能力契合业务优先级。
这些服务器应用了大量技术创新，质量久经业务考验，枀高的敁率削减了运行成本和复杂性，提高了日常运行的灵活性，可实现无缝整合，有助于您把注意力集中在核心业务功能。
富士通PRIMERGY RX服务器系统作为机架优化的灵活服务器，具有一流的性能和能敁，从而成为各数据中心的“标准”。
与所有其他PRIMERGY系统一样，RX服务器融合了20多年的开发与专业生产知识，造就了低于市场平均水平的枀低敀障率，从而实现持续运行和出色的硬件可用性。
PRIMERGY RX2520 M4富士通PRIMERGY RX2520 M4是一款适合重要业务应用的高敁且可扩展的平台。
它是采用最新英特尔®至强®可扩展系列处理器的两路机架式服务器，具有高达384 GB RAM。
PRIMERGY RX2520性价比超高，非常适合基本数据中心工作负载，即协作平台或需要大量存储的应用。
结极紧凑的PRIMERGY 2U模块化机箱为存储要求严苛的应用和服务提供拥有最多12块3.5英寸或24块2.5英寸存储磁盘的强大环境。
另外，RX2520 M4还提供用于LAN、RAID和存储方面的其他各种模块化选项以及升级套件，可满足未来的个别需求。
敁率高达96%的电源装置结合改迚后的iRMC S5进程管理软件可以有敁降低运营成本。
特性与优势超高性价比⏹英特尔®至强®处理器可扩展系列CPU，最多拥有14个核心⏹高达384 GB DDR4 RAM（12个DIMM插槽）⏹最多6x PCIe插槽⏹最具性价比的处理器选择⏹内存和附加设备的可扩展性充裕，适合小规模虚拟化或协作平台灵活且可扩展的平台⏹存储磁盘数量庞大，最多12x 3.5英寸或24x 2.5英寸存储磁盘⏹支持M.2设备，适用于hypervisor安装或镜像⏹基础装置采用模块化理念，幵且可选配LAN控制器、RAID 控制器和电源⏹提供硬盘以及LTO磁带等备仹设备的升级套件⏹可扩展平台能够最好地满足日益增长的个别需求，经优化适合存储要求严苛的情境⏹高存储容量适用于存储要求严苛的应用和横向扩展情境⏹节约成本的初始配置：在同一系统内逐渐扩展⏹额外节省预算：升级套件可在企业增长时节省成本经济高敁地运行⏹板载LAN⏹iRMC S5附带全新的互动式网页用户界面，符合Redfish标准，可为异极环境提供统一的API⏹利用配置文件简化功率管理，实现”最低功率”和”低噪声”⏹可选冗余、热插拔PSU，敁率为96%（80Plus钛金）⏹富士通ServerView组件提供安装和部署、永久状态监测和控制的各种工具。
2015年台湾鸿星晶振2520贴片封装最新版石英晶振料号系列
型号厂商参数描述封装E2SB12.0000F8E11S鸿星晶振12MHZ 10PPM 8PF 20°C ~ 70°C 2.5*2.0mm E2SB13.0000F8E11S鸿星晶振13MHZ 10PPM 8PF 20°C ~ 70°C 2.5*2.0mm E2SB13.5600F8E11S鸿星晶振13.56MHZ 10PPM 8PF 20°C ~ 70°C 2.5*2.0mm E2SB14.1781F8E11S鸿星晶振14.1781MHZ 10PPM 8PF 20°C ~ 70°C 2.5*2.0mm E2SB16.0000F8E11S鸿星晶振16MHZ 10PPM 8PF 20°C ~ 70°C 2.5*2.0mm E2SB16.3840F8E11S鸿星晶振16.384MHZ 10PPM 8PF 20°C ~ 70°C 2.5*2.0mm E2SB16.9340F8E11S鸿星晶振16.934MHZ 10PPM 8PF 20°C ~ 70°C 2.5*2.0mm E2SB18.0000F8E11S鸿星晶振18MHZ 10PPM 8PF 20°C ~ 70°C 2.5*2.0mm E2SB18.4320F8E11S鸿星晶振18.432MHZ 10PPM 8PF 20°C ~ 70°C 2.5*2.0mm E2SB19.2000F8E11S鸿星晶振19MHZ 10PPM 8PF 20°C ~ 70°C 2.5*2.0mmE2SB22.1184F8E11S鸿星晶振22.1184MHZ 10PPM 8PF 20°C ~ 70°C 2.5*2.0mm E2SB22.5792F8E11S鸿星晶振22.5792MHZ 10PPM 8PF 20°C ~ 70°C 2.5*2.0mm E2SB24.0000F8E11S鸿星晶振24MHZ 10PPM 8PF 20°C ~ 70°C 2.5*2.0mm E2SB24.5790F8E11S鸿星晶振24.576MHZ 10PPM 8PF 20°C ~ 70°C 2.5*2.0mm E2SB25.0000F8E11S鸿星晶振25MHZ 10PPM 8PF 20°C ~ 70°C 2.5*2.0mm E2SB26.0000F8E11S鸿星晶振26MHZ 10PPM 8PF 20°C ~ 70°C 2.5*2.0mm E2SB27.0000F8E11S鸿星晶振27MHZ 10PPM 8PF 20°C ~ 70°C 2.5*2.0mm E2SB27.1200F8E11S鸿星晶振27.12MHZ 10PPM 8PF 20°C ~ 70°C 2.5*2.0mm E2SB28.63636F8E11S鸿星晶振28.63636MHZ 10PPM 8PF 20°C ~ 70°C 2.5*2.0mm E2SB30.0000F8E11S鸿星晶振30MHZ 10PPM 8PF 20°C ~ 70°C 2.5*2.0mmE2SB36.0000F8E11S鸿星晶振36MHZ 10PPM 8PF 20°C ~ 70°C 2.5*2.0mm E2SB37.4000F8E11S鸿星晶振37.4MHZ 10PPM 8PF 20°C ~ 70°C 2.5*2.0mm E2SB38.4000F8E11S鸿星晶振38.4MHZ 10PPM 8PF 20°C ~ 70°C 2.5*2.0mm E2SB40.0000F8E11S鸿星晶振40MHZ 10PPM 8PF 20°C ~ 70°C 2.5*2.0mm E2SB12.0000F8EG22S鸿星晶振12MHZ 20PPM 8.5PF -30°C ~ 85°C 2.5*2.0mm E2SB13.0000F8EG22S鸿星晶振13MHZ 20PPM 8.5PF -30°C ~ 85°C 2.5*2.0mm E2SB13.5600F8EG22S鸿星晶振13.56MHZ 20PPM 8.5PF -30°C ~ 85°C 2.5*2.0mm14.7456MHZ 20PPM 8.5PF -30°C ~ 85°E2SB14.7456F8EG22S鸿星晶振2.5*2.0mmCE2SB16.0000F8EG22S鸿星晶振16MHZ 20PPM 8.5PF -30°C ~ 85°C 2.5*2.0mmE2SB16.9340F8EG22S鸿星晶振16.934MHZ 20PPM 8.5PF -30°C ~ 85°C 2.5*2.0mm E2SB18.0000F8EG22S鸿星晶振18MHZ 20PPM 8.5PF -30°C ~ 85°C 2.5*2.0mm E2SB19.2000F8EG22S鸿星晶振19.2MHZ 20PPM 8.5PF -30°C ~ 85°C 2.5*2.0mm E2SB20.0000F8EG22S鸿星晶振20MHZ 20PPM 8.5PF -30°C ~ 85°C 2.5*2.0mm22.1184MHZ 20PPM 8.5PF -30°C ~ 85°E2SB22.1184F8EG22S鸿星晶振2.5*2.0mmCE2SB22.5792F8EG22S鸿星晶振22.5792MHZ 20PPM 8.5PF -30°C ~ 85°C 2.5*2.0mm E2SB24.0000F8EG22S鸿星晶振24MHZ 20PPM 8.5PF -30°C ~ 85°C 2.5*2.0mm E2SB24.5760F8EG22S鸿星晶振24.576MHZ 20PPM 8.5PF -30°C ~ 85°C 2.5*2.0mm E2SB25.0000F8EG22S鸿星晶振25MHZ 20PPM 8.5PF -30°C ~ 85°C 2.5*2.0mmE2SB27.0000F8EG22S鸿星晶振27MHZ 20PPM 8.5PF -30°C ~ 85°C 2.5*2.0mm E2SB27.1700F8EG22S鸿星晶振27.12MHZ 20PPM 8.5PF -30°C ~ 85°C 2.5*2.0mm E2SB28.63636F8EG22S鸿星晶振28.63636MHZ 20PPM 8.5PF -30℃ ~ 85℃ 2.5*2.0mm E2SB30.0000F8EG22S鸿星晶振30MHZ 20PPM 8.5PF -30°C ~ 85°C 2.5*2.0mm E2SB32.0000F8EG22S鸿星晶振32MHZ 20PPM 8.5PF -30°C ~ 85°C 2.5*2.0mm E2SB36.0000F8EG22S鸿星晶振36MHZ 20PPM 8.5PF -30°C ~ 85°C 2.5*2.0mm E2SB40.0000F8EG22S鸿星晶振40MHZ 20PPM 8.5PF -30°C ~ 85°C 2.5*2.0mm E2SB48.0000F8EG22S鸿星晶振48MHZ 20PPM 8.5PF -30°C ~ 85°C 2.5*2.0mm E2SB50.0000F8EG22S鸿星晶振50MHZ 20PPM 8.5PF -30°C ~ 85°C 2.5*2.0mm E2SB12.0000F9M33S鸿星晶振12MHZ 30PPM 9PF 40°C ~ 85°C 2.5*2.0mmE2SB13.5600F9M33S鸿星晶振13.56MHZ 30PPM 9PF 40°C ~ 85°C 2.5*2.0mm E2SB14.7456F9M33S鸿星晶振14.7456MHZ 30PPM 9PF 40°C ~ 85°C 2.5*2.0mm E2SB16.0000F9M55S鸿星晶振16MHZMHZ 30PPM 9PF 40°C ~ 85°C 2.5*2.0mm E2SB16.3840F9M33S鸿星晶振16.384MHZ 30PPM 9PF 40°C ~ 85°C 2.5*2.0mm E2SB16.9340F9M33S鸿星晶振16.934MHZ 30PPM 9PF 40°C ~ 85°C 2.5*2.0mm E2SB18.0000F9M33S鸿星晶振18MHZ 30PPM 9PF 40°C ~ 85°C 2.5*2.0mm E2SB19.2000F9M33S鸿星晶振19.2MHZ 30PPM 9PF 40°C ~ 85°C 2.5*2.0mm E2SB20.0000F9M33S鸿星晶振20MHZ 30PPM 9PF 40°C ~ 85°C 2.5*2.0mm E2SB22.1184F9M33S鸿星晶振22.1184MHZ 30PPM 9PF 40°C ~ 85°C 2.5*2.0mm E2SB22.5792F9M33S鸿星晶振22.5792MHZ 30PPM 9PF 40°C ~ 85°C 2.5*2.0mmE2SB24.5760F9M33S鸿星晶振24.576MHZ 30PPM 9PF 40°C ~ 85°C 2.5*2.0mm E2SB25.0000F9M33S鸿星晶振25MHZ 30PPM 9PF 40°C ~ 85°C 2.5*2.0mm E2SB26.0000F9M33S鸿星晶振26MHZ 30PPM 9PF 40°C ~ 85°C 2.5*2.0mm E2SB27.0000F9M33S鸿星晶振27MHZ 30PPM 9PF 40°C ~ 85°C 2.5*2.0mm E2SB27.1200F9M33S鸿星晶振27.12MHZ 30PPM 9PF 40°C ~ 85°C 2.5*2.0mm E2SB28.63636F9M33S鸿星晶振28.63636MHZ 30PPM 9PF 40°C ~ 85°C 2.5*2.0mm E2SB30.0000F9M33S鸿星晶振30MHZ 30PPM 9PF 40°C ~ 85°C 2.5*2.0mm E2SB32.0000F9M33S鸿星晶振32MHZ 30PPM 9PF 40°C ~ 85°C 2.5*2.0mm E2SB36.0000F9M33S鸿星晶振36MHZ 30PPM 9PF 40°C ~ 85°C 2.5*2.0mm E2SB40.0000F9M33S鸿星晶振40MHZ 30PPM 9PF 40°C ~ 85°C 2.5*2.0mmE2SB50.0000F9M33S鸿星晶振50MHZ 30PPM 9PF 40°C ~ 85°C 2.5*2.0mm E2SB12.0000F10M55S鸿星晶振12MHZ 50PPM 10PF 40°C ~ 85°C 2.5*2.0mm E2SB13.0000F10M55S鸿星晶振13MHZ 50PPM 10PF 40°C ~ 85°C 2.5*2.0mm E2SB13.5600F10M55S鸿星晶振13.56MHZ 50PPM 10PF 40°C ~ 85°C 2.5*2.0mm E2SB14.7456F10M55S鸿星晶振14.7456MHZ 50PPM 10PF 40°C ~ 85°C 2.5*2.0mm E2SB16.0000F10M55S鸿星晶振16MHZ 50PPM 10PF 40°C ~ 85°C 2.5*2.0mm E2SB16.3840F10M55S鸿星晶振16.384MHZ 50PPM 10PF 40°C ~ 85°C 2.5*2.0mm E2SB16.9340F10M55S鸿星晶振16.934MHZ 50PPM 10PF 40°C ~ 85°C 2.5*2.0mm E2SB18.0000F10M55S鸿星晶振18MHZ 50PPM 10PF 40°C ~ 85°C 2.5*2.0mm E2SB18.4320F10M55S鸿星晶振18.432MHZ 50PPM 10PF 40°C ~ 85°C 2.5*2.0mmE2SB20.0000F10M55S鸿星晶振20MHZ 50PPM 10PF 40°C ~ 85°C 2.5*2.0mm E2SB22.1184F10M55S鸿星晶振22.1184MHZ 50PPM 10PF 40°C ~ 85°C 2.5*2.0mm E2SB22.5792F10M55S鸿星晶振22.5792MHZ 50PPM 10PF 40°C ~ 85°C 2.5*2.0mm E2SB24.0000F10M55S鸿星晶振24MHZ 50PPM 10PF 40°C ~ 85°C 2.5*2.0mm E2SB25.0000F10M55S鸿星晶振25MHZ 50PPM 10PF 40°C ~ 85°C 2.5*2.0mm E2SB26.0000F10M55S鸿星晶振26MHZ 50PPM 10PF 40°C ~ 85°C 2.5*2.0mm E2SB27.0000F10M55S鸿星晶振27MHZ 50PPM 10PF 40°C ~ 85°C 2.5*2.0mm E2SB27.1200F10M55S鸿星晶振27.12MHZ 50PPM 10PF 40°C ~ 85°C 2.5*2.0mm E2SB28.63636F10M55S鸿星晶振28.63636MHZ 50PPM 10PF 40℃ ~ 85℃ 2.5*2.0mm E2SB30.0000F10M55S鸿星晶振30MHZ 50PPM 10PF 40°C ~ 85°C 2.5*2.0mmE2SB36.0000F10M55S鸿星晶振26MHZ 50PPM 10PF 40°C ~ 85°C 2.5*2.0mm E2SB40.0000F10M55S鸿星晶振40MHZ 50PPM 10PF 40°C ~ 85°C 2.5*2.0mm E2SB48.0000F10M55S鸿星晶振48MHZ 50PPM 10PF 40°C ~ 85°C 2.5*2.0mm E2SB50.0000F10M55S鸿星晶振50MHZ 50PPM 10PF 40°C ~ 85°C 2.5*2.0mm E2SB12.0000F12EYYS鸿星晶振12MHZ 12PF 15PPM 20°C ~ 70°C 2.5*2.0mm E2SB13.0000F12EYYS鸿星晶振13MHZ 12PF 15PPM 20°C ~ 70°C 2.5*2.0mm E2SB13.5600F12EYYS鸿星晶振13.56MHZ 12PF 15PPM 20°C ~ 70°C 2.5*2.0mm E2SB14.7456F12EYYS鸿星晶振14.7456MHZ 12PF 15PPM 20°C ~ 70°C 2.5*2.0mm E2SB16.0000F12EYYS鸿星晶振16MHZ 12PF 15PPM 20°C ~ 70°C 2.5*2.0mm E2SB16.3840F12EYYS鸿星晶振16.384MHZ 12PF 15PPM 20°C ~ 70°C 2.5*2.0mmE2SB18.0000F12EYYS鸿星晶振18MHZ 12PF 15PPM 20°C ~ 70°C 2.5*2.0mm E2SB19.2000F12EYYS鸿星晶振19.2MHZ 12PF 15PPM 20°C ~ 70°C 2.5*2.0mm E2SB20.0000F12EYYS鸿星晶振20MHZ 12PF 15PPM 20°C ~ 70°C 2.5*2.0mm E2SB22.1184F12EYYS鸿星晶振22.1184MHZ 12PF 15PPM 20°C ~ 70°C 2.5*2.0mm E2SB22.5792F12EYYS鸿星晶振22.5792MHZ 12PF 15PPM 20°C ~ 70°C 2.5*2.0mm E2SB24.0000F12EYYS鸿星晶振24MHZ 12PF 15PPM 20°C ~ 70°C 2.5*2.0mm E2SB24.5760F12EYYS鸿星晶振24.576MHZ 12PF 15PPM 20°C ~ 70°C 2.5*2.0mm E2SB25.0000F12EYYS鸿星晶振25MHZ 12PF 15PPM 20°C ~ 70°C 2.5*2.0mm E2SB26.0000F12EYYS鸿星晶振26MHZ 12PF 15PPM 20°C ~ 70°C 2.5*2.0mm E2SB27.0000F12EYYS鸿星晶振27MHZ 12PF 15PPM 20°C ~ 70°C 2.5*2.0mmE2SB28.63636F12EYYS鸿星晶振28.63636MHZ 12PF 15PPM 20°C ~ 70°C 2.5*2.0mm E2SB30.0000F12EYYS鸿星晶振30MHZ 12PF 15PPM 20°C ~ 70°C 2.5*2.0mm E2SB32.0000F12EYYS鸿星晶振32MHZ 12PF 15PPM 20°C ~ 70°C 2.5*2.0mm E2SB36.0000F12EYYS鸿星晶振36MHZ 12PF 15PPM 20°C ~ 70°C 2.5*2.0mm E2SB40.0000F12EYYS鸿星晶振40MHZ 12PF 15PPM 20°C ~ 70°C 2.5*2.0mm E2SB42.0000F12EYYS鸿星晶振42MHZ 12PF 15PPM 20°C ~ 70°C 2.5*2.0mm E2SB50.0000F12EYYS鸿星晶振50MHZ 12PF 15PPM 20°C ~ 70°C 2.5*2.0mm E2SB12.0000F15MZZS鸿星晶振12MHZ 15PF 25PPM 40°C ~ 85°C 2.5*2.0mm E2SB13.0000F15MZZS鸿星晶振13MHZ 15PF 25PPM 40°C ~ 85°C 2.5*2.0mm E2SB13.5600F15MZZS鸿星晶振13.56,HZ 15PF 25PPM 40°C ~ 85°C 2.5*2.0mmE2SB16.0000F15MZZS鸿星晶振16MHZ 15PF 25PPM 40°C ~ 85°C 2.5*2.0mm E2SB16.3840F15MZZS鸿星晶振16.384MHZ 15PF 25PPM 40°C ~ 85°C 2.5*2.0mm E2SB16.9340F15MZZS鸿星晶振16.934MHZ 15PF 25PPM 40°C ~ 85°C 2.5*2.0mm E2SB18.0000F15MZZS鸿星晶振18MHZ 15PF 25PPM 40°C ~ 85°C 2.5*2.0mm E2SB19.2000F15MZZS鸿星晶振19.2MHZ 15PF 25PPM 40°C ~ 85°C 2.5*2.0mm E2SB20.0000F15MZZS鸿星晶振20MHZ 15PF 25PPM 40°C ~ 85°C 2.5*2.0mm E2SB22.1184F15MZZS鸿星晶振22.1184MHZ 15PF 25PPM 40°C ~ 85°C 2.5*2.0mm E2SB22.5792F15MZZS鸿星晶振22.5792MHZ 15PF 25PPM 40°C ~ 85°C 2.5*2.0mm E2SB24.0000F15MZZS鸿星晶振24MHZ 15PF 25PPM 40°C ~ 85°C 2.5*2.0mm E2SB24.5760F15MZZS鸿星晶振24.576MHZ 15PF 25PPM 40°C ~ 85°C 2.5*2.0mmE2SB26.0000F15MZZS鸿星晶振26MHZ 15PF 25PPM 40°C ~ 85°C 2.5*2.0mm E2SB27.0000F15MZZS鸿星晶振27MHZ 15PF 25PPM 40°C ~ 85°C 2.5*2.0mm E2SB27.1200F15MZZS鸿星晶振27.12MHZ 15PF 25PPM 40°C ~ 85°C 2.5*2.0mm E2SB28.63636F15MZZS鸿星晶振28.63636MHZ 15PF 25PPM 40°C ~ 85°C 2.5*2.0mm E2SB30.0000F15MZZS鸿星晶振30MHZ 15PF 25PPM 40°C ~ 85°C 2.5*2.0mm E2SB32.0000F15MZZS鸿星晶振32MHZ 15PF 25PPM 40°C ~ 85°C 2.5*2.0mm E2SB40.0000F15MZZS鸿星晶振40MHZ 15PF 25PPM 40°C ~ 85°C 2.5*2.0mm E2SB42.0000F15MZZS鸿星晶振45MHZ 15PF 25PPM 40°C ~ 85°C 2.5*2.0mm E2SB50.0000F15MZZS鸿星晶振50MHZ 15PF 25PPM 40°C ~ 85°C 2.5*2.0mm E2SB12.0000F16M22S鸿星晶振12MHZ 16PF 20PPM 40°C ~ 85°C 2.5*2.0mmE2SB13.5600F16M22S鸿星晶振13.56MHZ 16PF 20PPM 40°C ~ 85°C 2.5*2.0mm E2SB14.7456F16M22S鸿星晶振14.7456MHZ 16PF 20PPM 40°C ~ 85°C 2.5*2.0mm E2SB16.0000F16M22S鸿星晶振16MHZ 16PF 20PPM 40°C ~ 85°C 2.5*2.0mm E2SB16.3840F16M22S鸿星晶振16.384MHZ 16PF 20PPM 40°C ~ 85°C 2.5*2.0mm E2SB19.2000F16M22S鸿星晶振19.2MHZ 16PF 20PPM 40°C ~ 85°C 2.5*2.0mm E2SB20.0000F16M22S鸿星晶振20MHZ 16PF 20PPM 40°C ~ 85°C 2.5*2.0mm E2SB22.11184F16M22S鸿星晶振22.1184MHZ 16PF 20PPM 40°C ~ 85°C 2.5*2.0mm E2SB22.5792F16M22S鸿星晶振22.5792MHZ 16PF 20PPM 40°C ~ 85°C 2.5*2.0mm E2SB24.0000F16M22S鸿星晶振24MHZ 16PF 20PPM 40°C ~ 85°C 2.5*2.0mm E2SB24.5760F16M22S鸿星晶振24.576MHZ 16PF 20PPM 40°C ~ 85°C 2.5*2.0mmE2SB26.0000F16M22S鸿星晶振26MHZ 16PF 20PPM 40°C ~ 85°C 2.5*2.0mm E2SB27.0000F16M22S鸿星晶振27MHZ 16PF 20PPM 40°C ~ 85°C 2.5*2.0mm E2SB27.1200F16M22S鸿星晶振27.12MHZ 16PF 20PPM 40°C ~ 85°C 2.5*2.0mm E2SB28.63636F16M22S鸿星晶振28.63636MHZ 16PF 20PPM 40°C ~ 85°C 2.5*2.0mm E2SB30.0000F16M22S鸿星晶振30MHZ 16PF 20PPM 40°C ~ 85°C 2.5*2.0mm E2SB32.0000F16M22S鸿星晶振32MHZ 16PF 20PPM 40°C ~ 85°C 2.5*2.0mm E2SB40.0000F16M22S鸿星晶振40MHZ 16PF 20PPM 40°C ~ 85°C 2.5*2.0mm E2SB42.0000F16M22S鸿星晶振42MHZ 16PF 20PPM 40°C ~ 85°C 2.5*2.0mm E2SB48.0000F16M22S鸿星晶振48MHZ 16PF 20PPM 40°C ~ 85°C 2.5*2.0mm E2SB50.0000F16M22S鸿星晶振50MHZ 16PF 20PPM 40°C ~ 85°C 2.5*2.0mmE2SB13.0000F18M22S鸿星晶振13MHZ 18PF 20PPM 40°C ~ 85°C 2.5*2.0mm E2SB13.5600F18M22S鸿星晶振13.56MHZ 18PF 20PPM 40°C ~ 85°C 2.5*2.0mm E2SB14.7456F18M22S鸿星晶振14.7456MHZ 18PF 20PPM 40°C ~ 85°C 2.5*2.0mm E2SB16.0000F18M22S鸿星晶振16MHZ 18PF 20PPM 40°C ~ 85°C 2.5*2.0mm E2SB16.3840F18M22S鸿星晶振16.384MHZ 18PF 20PPM 40°C ~ 85°C 2.5*2.0mm E2SB16.9340F18M22S鸿星晶振16.934MHZ 18PF 20PPM 40°C ~ 85°C 2.5*2.0mm E2SB18.0000F18M22S鸿星晶振18MHZ 18PF 20PPM 40°C ~ 85°C 2.5*2.0mm E2SB19.2000F18M22S鸿星晶振19.2MHZ 18PF 20PPM 40°C ~ 85°C 2.5*2.0mm E2SB20.0000F18M22S鸿星晶振20MHZ 18PF 20PPM 40°C ~ 85°C 2.5*2.0mm E2SB22.1184F18M22S鸿星晶振22.1184MHZ 18PF 20PPM 40°C ~ 85°C 2.5*2.0mmE2SB24.0000F18M22S鸿星晶振24MHZ 18PF 20PPM 40°C ~ 85°C 2.5*2.0mm E2SB24.5760F18M22S鸿星晶振24.576MHZ 18PF 20PPM 40°C ~ 85°C 2.5*2.0mm E2SB25.0000F18M22S鸿星晶振25MHZ 18PF 20PPM 40°C ~ 85°C 2.5*2.0mm E2SB26.0000F18M22S鸿星晶振26MHZ 18PF 20PPM 40°C ~ 85°C 2.5*2.0mm E2SB27.0000F18M22S鸿星晶振27MHZ 18PF 20PPM 40°C ~ 85°C 2.5*2.0mm E2SB27.1200F18M22S鸿星晶振27.12MHZ 18PF 20PPM 40°C ~ 85°C 2.5*2.0mm E2SB28.63636F18M22S鸿星晶振28.63636MHZ 18PF 20PPM 40°C ~ 85°C 2.5*2.0mm E2SB30.0000F18M22S鸿星晶振30MHZ 18PF 20PPM 40°C ~ 85°C 2.5*2.0mm E2SB32.0000F18M22S鸿星晶振32MHZ 18PF 20PPM 40°C ~ 85°C 2.5*2.0mm E2SB40.0000F18M22S鸿星晶振40MHZ 18PF 20PPM 40°C ~ 85°C 2.5*2.0mmE2SB48.0000F18M22S鸿星晶振48MHZ 18PF 20PPM 40°C ~ 85°C 2.5*2.0mm E2SB50.0000F18M22S鸿星晶振50MHZ 18PF 20PPM 40°C ~ 85°C 2.5*2.0mm E2SB12.0000F20E11S鸿星晶振12MHZ 20PF 10PPM 20°C ~ 70°C 2.5*2.0mm E2SB13.0000F20E11S鸿星晶振13MHZ 20PF 10PPM 20°C ~ 70°C 2.5*2.0mm E2SB13.5600F20E11S鸿星晶振13.56MHZ 20PF 10PPM 20°C ~ 70°C 2.5*2.0mm E2SB14.7456F20E11S鸿星晶振14.7456MHZ 20PF 10PPM 20°C ~ 70°C 2.5*2.0mm E2SB16.0000F20E11S鸿星晶振16MHZ 20PF 10PPM 20°C ~ 70°C 2.5*2.0mm E2SB16.3840F20E11S鸿星晶振16.384MHZ 20PF 10PPM 20°C ~ 70°C 2.5*2.0mm E2SB16.9340F20E11S鸿星晶振16.934MHZ 20PF 10PPM 20°C ~ 70°C 2.5*2.0mm E2SB18.0000F20E11S鸿星晶振18MHZ 20PF 10PPM 20°C ~ 70°C 2.5*2.0mmE2SB20.0000F20E11S鸿星晶振20MHZ 20PF 10PPM 20°C ~ 70°C 2.5*2.0mm E2SB22.1184F20E11S鸿星晶振22.1184MHZ 20PF 10PPM 20°C ~ 70°C 2.5*2.0mm E2SB22.5792F20E11S鸿星晶振22.5792MHZ 20PF 10PPM 20°C ~ 70°C 2.5*2.0mm E2SB24.0000F20E11S鸿星晶振24MHZ 20PF 10PPM 20°C ~ 70°C 2.5*2.0mm E2SB24.5760F20E11S鸿星晶振24.576MHZ 20PF 10PPM 20°C ~ 70°C 2.5*2.0mm E2SB25.0000F20E11S鸿星晶振25MHZ 20PF 10PPM 20°C ~ 70°C 2.5*2.0mm E2SB26.0000F20E11S鸿星晶振26MHZ 20PF 10PPM 20°C ~ 70°C 2.5*2.0mm E2SB27.0000F20E11S鸿星晶振27MHZ 20PF 10PPM 20°C ~ 70°C 2.5*2.0mm E2SB27.1200F20E11S鸿星晶振27.12MHZ 20PF 10PPM 20°C ~ 70°C 2.5*2.0mm E2SB28.63636F20E11S鸿星晶振28.63636MHZ 20PF 10PPM 20°C ~ 70°C 2.5*2.0mmE2SB30.0000F20E11S鸿星晶振30MHZ 20PF 10PPM 20°C ~ 70°C 2.5*2.0mm E2SB32.0000F20E11S鸿星晶振32MHZ 20PF 10PPM 20°C ~ 70°C 2.5*2.0mm E2SB40.0000F20E11S鸿星晶振40MHZ 20PF 10PPM 20°C ~ 70°C 2.5*2.0mm E2SB42.0000F20E11S鸿星晶振42MHZ 20PF 10PPM 20°C ~ 70°C 2.5*2.0mm E2SB48.0000F20E11S鸿星晶振48MHZ 20PF 10PPM 20°C ~ 70°C 2.5*2.0mm E2SB50.0000F20E11S鸿星晶振50MHZ 20PF 10PPM 20°C ~ 70°C 2.5*2.0mm。
25255中文资料
NOTE: 1. θJA is measured with the component mounted on an evaluation PC board in free air.
Electrical Specifications
PARAMETER
VSUPPLY = ±15V
TEMP (°C)
Operating Conditions Temperature Range
HA-2520/2522-2 . . . . . . . . . . . . . . . . . . . . . . . . . -55°C to +125°C HA-2525-5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to +75°C
元器件交易网
®
Data Sheet
HA-2520, HA-2522, HA-2525
November 15, 2006
FN2894.8
20MHz, High Slew Rate, Uncompensated, High Input Impedance, Operational Amplifiers
All other trademarks mentioned are the property of their respective owners.
元器件交易网
HA-2520, HA-2522, HA-2525
Absolute Maximuion
*Pb-free PDIPs can be used for through hole wave solder processing only. They are not intended for use in Reflow solder processing applications.
SYN6288语音合成芯片-使用说明
北京宇音天下科技有限公司
地址：北京市海淀区上地高新技术区
010-62986600
010-62988818
第 1 页 / 共 39 页
2011 年 9 月 6 日更新
目录
SYN6288 中文语音合成芯片数据手册
1．概述 .....................................................................................................................................................................4
44命令帧举例441语音合成播放命令数据区数据区帧结构帧头长度命令字命令参数待发送文本异或校验宇音天下数据0xfd0x000x0b0x010x000xc10xd30xee0xd20xf40xcc0xec0xcf0xc2数据帧0xfd0x000x0b0x010x000xd30xee0xd20xf40xcc0xec0xcf0xc20xc1说明播放文本编码格式为gb2312的文本宇音天下不带背景音乐数据区数据区帧结构帧头长度命令字命令参数待发送文本异或校验宇音天下数据0xfd0x000x0b0x010x010xc00xd30xee0xd20xf40xcc0xec0xcf0xc2数据帧0xfd0x000x0b0x010x010xd30xee0xd20xf40xcc0xec0xcf0xc20xc0说明播放文本编码格式为gbk的文本宇音天下不带背景音乐数据区数据区帧结构帧头长度命令字命令参数待发送文本异或校验宇音天下数据0xfd0x000x0b0x010x020xbb0xa60x740xad0xb50xa40xd10xa40x55数据帧0xfd0x000x0b0x010x020xa60x740xad0xb50xa40xd10xa40x550xbb说明播放文本编码格式为big5的文本宇音天下不带背景音乐帧结构帧头数据区数据区第16页共40页2016年3月9日更新syn6288中文语音合成芯片数据手册长度命令字命令参数待发送文本异或校验宇音天下数据0xfd0x000x0b0x010x030xc30x8b0xed0x970xf30x590x290x4e0x0b数据帧0xfd0x000x0b0x010x030x8b0xed0x970xf30x590x290x4e0x0b0xc3说明播放文本编码格式为unicode的文本宇音天下不带背景音乐数据区数据区帧结构帧头长度命令字命令参数待发送文本异或校验宇音天下数据0xfd0x000x0b0x010x090xc80xd30xee0xd20xf40xcc0xec0xcf0xc2数据帧0xfd0x000x0b0x010x090xd30xee0xd20xf40xcc0xec0xcf0xc20xc8说明播放文本编码格式为gbk的文本宇音天下时同时播放背景音乐1数据区数据区帧结构帧头长度命令字命令参数待发送文本异或校验宇音天下数据0xfd0x000x0b0x010x790xb80xd30xee0xd2
DIN 25202-1992 中文版 铁路车辆.螺栓连接件的锁紧.预应力和紧固扭矩
w.
1.5 1.25 1.0 320 1.25 400 1.1
fx w.
它也可用于按 必须有规定的预应力 使用强度足够大的螺钉和螺母可达 以及必要时要用计算出的扭矩来拧紧 并要考虑摩擦系数 在低温或高温时 要考虑材料的机械特性与温度有关 螺纹额定直径 d × 拧紧系数 x 就必须用 表 1 测定最小拧入深度的拧紧系数 螺钉 强度等级 10.9 螺纹额定直径 d 标准螺纹 M8 M4 M5 M6 M8 细螺纹 M8 细螺纹 M8 拧紧系数 x 1.4 2.0 1.25 1.0 1.5 1.25 1.8 1.4 1.1 1.0 1.25 1.5 1.25 1.5 1.1 1.0
通过估计摩擦
c
装用精密螺丝刀 时用电子扭矩限 制器 较大的值用于 较大旋转角 也就 是有相对蠕变的连接 以及细螺纹 与
1) 给定扭曲的离散以%比给出 它表示所给定力矩与工具额定力矩的偏差 2) 由拧紧系数
A
确定的预应力 FM 的极限值在
预应力离散 red
一栏中以离散的百分比给出 见表 6 9 算出的
概述 一般
螺栓连接的紧固
螺栓连接的紧固用粘接材料
说明 本标准由 拧紧扭矩 本标准的技术细节可从 VDI 出版社获取 连接元件 KA 工作委员会 AA.1 基本标准和机械元件”分会制订,以保证统一预应力和
国际专利分类 B 61 D49/00, F 16 B 31/00, F 16 B39/00
ISO 米制螺纹 螺距 1
螺栓和螺母的选择系列和极艰尺寸
机械连接元件 供货技术条件 机械连接元件
有电镀层部分 不锈钢和耐酸腐蚀钢部分
用补充 ISO 3506 的供货技术条件
有内六角的圆柱头螺钉 ISO 4762 修改的 有螺杆的六角螺钉 金属材料的磷酸处理 连接元件的机械特性 机械连接元件 和C 螺纹 M 1.6 M 39 产品等级 A 和 B
富士施乐S2520说明书
No. 名 称功 能1 < 复印 > 键 使用复印功能时按此按键。
选择复印功能时，< 复印 > 键点亮。
2 < 身份证 /ID 卡复印 > 键 使用身份证 /ID 卡复印功能时按此按键。
选择身份证 /ID 卡复印功 能时，< 身份证 /ID 卡复印 > 键点亮。
3 显示屏显示操作菜单及机器状态的信息等。
4 < 作业确认 > 键 确认或取消等待执行及正在执行的作业。
5< >< >< >< > 键选择显示屏上显示的菜单或项目及更改数值。
补充 ·< > 键允许您选择前一个菜单项目。
·< > 键允许您选择下一个菜单项目。
·< > 键允许您进到下一个菜单画面。
·< > 键允许您选择前一个菜单画面。
6 <OK> 键 按此键和箭头键可更改设定。
7 < 登录 > 键 按此键进入或退出机器管理员模式或帐户管理模式。
处于机器管理 员模式时，< 登录 > 键点亮。
8 数字键 输入复印份数等数字或英文字母。
9 < 暂停 > 键 输入通信对象时在号码之间插入暂停等时按此按键。
10 < 机器确认 > 键 按此键可打印报告及检查机器的信息（如消耗品状态和机器的 IP 地 址等）。
11 < 节电 > 键 如果机器在一定时间内不使用，将进入节电模式降低电力消耗，这 时此键将点亮。
按此键可进入或退出节电模式。
12 < 停止 > 键 停止正在处理的作业或取消发生错误的作业时按此按键。
13 < 全部清除 > 键 将显示的各种功能的设定返回到默认值或清除用数字键所输入的全 部数值时按此按键。
设定将返回到与打开机器电源时相同的状态。
14 < 启动 > 键 开始扫描原稿或确定各种设定值时按此按键。
EKI-2541SI中文资料(Advantech)中文数据手册「EasyDatasheet - 矽搜」
EKI-2541M/ 2541S是一款增强型以太网光纤转换器.除它标准功能,多功能EKI-2541M/ 2541S还具备LFP（链路故障传递）功能.当链路一侧发生故障时,另一侧继续发送报文, 并等待从未到达从断开侧响应.使用内部跳线,使LFP功能,那么EKI-2541M/ 2541S将强制链接关闭,一旦发现其他线路故障,使应用软件来不及反应情况.
4,000 V 3,000 V
当下
0.9 A@ 12 V（可复位防护险丝）
环境
工作温度
宽温.模型
储存温度 工作湿度 存储湿度
MTBF
认证
安全
EMC
Shock
自由落体 振动
订购信息
EKI-2541M
EKI-2541MI
EKI-2541S
EKI-2541SI
-10 ~ 60° C (14 ~ 140° F) -40 ~ 75° C (-40 ~ 167° F) -40 ~ 85° C (-40 ~ 185° F) 5 ~ 95% (non-condensing) 0 ~ 95% (non-condensing) 577,175 hrs
芯片中文手册,看全文,戳
EKI-2541M系列 EKI-2541S系列
10/100TX到多模SC型光纤
光学工业媒体转换器
10/100TX到单模SC型光纤
光学工业媒体转换器
NEW
EKI-2541M
EKI-2541S
特征
Provides 1 x 10/100 Mbps Ethernet port with RJ45 connector
Up to 100 Mbps
介面
连接器
LED指 示 灯
2520不锈钢
2520不锈钢
2520不锈钢是中国不锈钢标准的一个缩写。
2520中国标准(GB)：0Cr25Ni20
美国标准（ASTM）:310S
美国标准（UNS）：S31008
韩国标准（KS）:STS310S
欧盟标准（BS EN）:1.4845
2520不锈钢(310S)是奥氏体铬镍不锈钢具有很好的抗氧化性、耐腐蚀性，因为有较高的铬含量和镍含量，使得拥有高温蠕变强度，在高温下能持续作业，具有良好的耐高温性。
因镍(Ni)、铬(Cr)含量高，具有良好耐氧化、耐腐蚀、耐酸咸、耐高温性能，耐高温钢管专用于制造电热炉管等场合，奥氏体型不锈钢中增加碳的含量后，由于其固溶强化作用使强度得到提高，奥氏体型不锈钢的化学成分特性是以铬、镍为基础添加钼、钨、铌和钛等元素，由于其组织为面心立方结构，因而在高温下有高的强度和蠕变强度。
简单介绍一下2520（310S）不锈钢板的成分及性能
1、概要25Cr-20Ni系的高合金不锈钢，耐高温氧化性优秀, 适合1000℃以下耐热部件。
2、特点
1）高温耐氧化性能优秀；
2）使用温度范围很广（1000度以下）；
3）固溶状态无磁性；
4）高温强度高。
2、适用范围
排气管道, 管, 热处理炉、热交换机、焚化炉等要求耐热性的钢种, 高热/高温接触部件。
SGW25N120
Fast IGBT in NPT-technology• 40% lower E off compared to previous generation • Short circuit withstand time – 10 µs • Designed for:- Motor controls - Inverter - SMPS• NPT-Technology offers:- very tight parameter distribution- high ruggedness, temperature stable behaviour - parallel switching capability• Complete product spectrum and PSpice Models : /igbt/Type V CE I C E off T j Package Ordering Code SGW25N1201200V25A2.9mJ150°CTO-247ACQ67040-S4277Maximum Ratings ParameterSymbol Value Unit Collector-emitter voltage VC E 1200V DC collector current T C = 25°C T C = 100°CI C4625Pulsed collector current, t p limited by T jmax I C p u l s 84Turn off safe operating area V CE ≤ 1200V, T j ≤ 150°C -84AGate-emitter voltageV G E ±20V Avalanche energy, single pulseI C = 25A, V CC = 50V, R GE = 25Ω, start at T j = 25°C E A S 130mJ Short circuit withstand time 1)V GE = 15V, 100V ≤V CC ≤1200V, T j ≤ 150°Ct S C 10µs Power dissipation T C = 25°CP t o t313WOperating junction and storage temperatureT j , T s t g -55...+150Soldering temperature, 1.6mm (0.063 in.) from case for 10s-260°CP-TO-247-3-1(TO-247AC)Thermal Resistance Parameter Symbol Conditions Max. ValueUnit CharacteristicIGBT thermal resistance,junction – case R t h J C 0.4Thermal resistance,junction – ambientR t h J ATO-247AC 40K/WElectrical Characteristic, at T j = 25 °C, unless otherwise specified ValueParameterSymbol Conditionsmin.typ.max.UnitStatic CharacteristicCollector-emitter breakdown voltage V (B R )C E S V G E =0V,I C =1500µA 1200--Collector-emitter saturation voltageV C E (s a t )V G E = 15V, I C =25A T j =25°C T j =150°C2.5-3.13.7 3.64.3Gate-emitter threshold voltage V G E (t h )I C =1000µA,V C E =V G E345VZero gate voltage collector currentI C E SV CE =1200V,V GE =0V T j =25°C T j =150°C----3501400µAGate-emitter leakage current I G E S V CE =0V,V GE =20V --100nA Transconductance g f s V C E =20V, I C =25A 20-S Dynamic Characteristic Input capacitance C i s s -21502600Output capacitanceC o s s -160190Reverse transfer capacitance C r s s V C E =25V,V G E =0V,f =1MHz-110130pFGate chargeQ G a t e V C C =960V, I C =25A V G E =15V -225300nC Internal emitter inductancemeasured 5mm (0.197 in.) from case L E TO-247AC-13-nH Short circuit collector current1)I C (S C )V G E =15V,t S C ≤10µs 100V ≤V C C ≤1200V,T j ≤ 150°C-240-ASwitching Characteristic, Inductive Load, at T j =25 °C ValueParameterSymbolConditionsmin.typ.max.UnitIGBT Characteristic Turn-on delay time t d (o n )-4560Rise timet r -4052Turn-off delay time t d (o f f )-730950Fall time t f -3039nsTurn-on energy E o n - 2.2 2.9Turn-off energy E o f f - 1.5 2.0Total switching energyE t sT j =25°C,V C C =800V,I C =25A,V G E =15V/0V,R G =22Ω,L σ1)=180nH,C σ1)=40pFEnergy losses include “tail” and diode reverse recovery.- 3.74.9mJ Switching Characteristic, Inductive Load, at T j =150 °C ValueParameterSymbolConditionsmin.typ.max.UnitIGBT Characteristic Turn-on delay time t d (o n )-5060Rise timet r -3643Turn-off delay time t d (o f f )-820990Fall time t f -4250nsTurn-on energy E o n - 3.8 4.6Turn-off energy E o f f - 2.9 3.8Total switching energyE t sT j =150°C V C C =800V,I C =25A,V G E =15V/0V,R G =22Ω,L σ1)=180nH,C σ1)=40pFEnergy losses include “tail” and diode reverse recovery.- 6.78.4mJ 1)Leakage inductance L σ and stray capacity C σ due to dynamic test circuit in figure E.I C , C O L L E C T O R C U R R E N T10Hz100Hz 1kHz 10kHz 100kHz 0A 20A40A60A80A100AI C , C O L L E C T O R C U R R E N T1V 10V 100V 1000V0.1A1A10A100Af , SWITCHING FREQUENCYV CE , COLLECTOR -EMITTER VOLTAGE Figure 1. Collector current as a function of switching frequency(T j ≤ 150°C, D = 0.5, V CE = 800V,V GE = +15V/0V, R G = 22Ω)Figure 2. Safe operating area (D = 0, T C = 25°C, T j ≤ 150°C)P t o t , P O W E R D I S S I P A T I O N25°C50°C75°C100°C125°C0W 50W 100W 150W 200W 250W 300W 350W I C , C O L L E C T O R C U R R E N T25°C50°C 75°C 100°C 125°C0A10A20A30A40A50A60AT C , CASE TEMPERATURET C , CASE TEMPERATUREFigure 3. Power dissipation as a function of case temperature (T j ≤ 150°C)Figure 4. Collector current as a function of case temperature(V GE ≤ 15V, T j ≤ 150°C)I C , C O L L E C T O R C U R R E N T0V1V 2V 3V 4V 5V 6V 7V 0A 10A 20A 30A 40A 50A 60A70A 80AI C , C O L L E C T O R C U R R E N T0V1V 2V 3V 4V 5V 6V 7V0A 10A 20A 30A 40A 50A 60A70A 80AV CE , COLLECTOR -EMITTER VOLTAGEV CE , COLLECTOR -EMITTER VOLTAGEFigure 5. Typical output characteristics (T j = 25°C)Figure 6. Typical output characteristics (T j = 150°C)I C , C O L L E C T O R C U R R E N T3V4V 5V 6V 7V 8V 9V 10V 11V0A 10A 20A 30A 40A 50A 60A70A 80AV C E (s a t ), C O L L E C T O R -E M I T T E R S A T U R A T I O N V O L T A G E-50°C0°C 50°C 100°C150°C0V1V2V3V4V5V6VV GE , GATE -EMITTER VOLTAGET j , JUNCTION TEMPERATUREFigure 7. Typical transfer characteristics (V CE = 20V)Figure 8. Typical collector-emittersaturation voltage as a function of junction temperature (V GE = 15V)t , S W I T C H I N G T I M E S0A 20A 40A 60A10ns100ns1000nst , S W I T C H I N G T I M E S0Ω10Ω20Ω30Ω40Ω50Ω10ns100ns1000nsI C , COLLECTOR CURRENTR G , GATE RESISTORFigure 9. Typical switching times as a function of collector current (inductive load, T j = 150°C,V CE = 800V, V GE = +15V/0V, R G = 22Ω,dynamic test circuit in Fig.E )Figure 10. Typical switching times as a function of gate resistor (inductive load, T j = 150°C,V CE = 800V, V GE = +15V/0V, I C = 25A,dynamic test circuit in Fig.E )t , S W I T C H I N G T I M E S-50°C0°C 50°C 100°C 150°C10ns100ns1000nsV G E (t h ), G A T E -E M I T T E R T H R E S H O L D V O L T A G E-50°C0°C 50°C100°C 150°C0V1V2V3V4V5V6VT j , JUNCTION TEMPERATURET j , JUNCTION TEMPERATUREFigure 11. Typical switching times as a function of junction temperature (inductive load, V CE = 800V,V GE = +15V/0V, I C = 25A, R G = 22Ω,dynamic test circuit in Fig.E )Figure 12. Gate-emitter threshold voltage as a function of junction temperature (I C = 0.3mA)E , S W I T C H I N G E N E R G Y L O S S E S0A 20A 40A 60A0mJ5mJ10mJ15mJ20mJ 25mJE , S W I T C H I N G E N E R G Y L O S S E S0Ω10Ω20Ω30Ω40Ω50Ω0mJ2mJ4mJ6mJ8mJ10mJI C , COLLECTOR CURRENTR G , GATE RESISTORFigure 13. Typical switching energy losses as a function of collector current (inductive load, T j = 150°C,V CE = 800V, V GE = +15V/0V, R G = 22Ω,dynamic test circuit in Fig.E )Figure 14. Typical switching energy losses as a function of gate resistor (inductive load, T j = 150°C,V CE = 800V, V GE = +15V/0V,I C = 25A,dynamic test circuit in Fig.E )E , S W I T C H I N G E N E R G Y L O S S E S-50°C0°C 50°C 100°C 150°C0mJ 2mJ4mJ6mJ8mJZ t h J C , T R A N S I E N T T H E R M A L I M P E D A N C E1µs10µs100µs1ms10ms 100ms1s10-3K/W10-2K/W 10-1K/W T j , JUNCTION TEMPERATUREt p , PULSE WIDTHFigure 15. Typical switching energy losses as a function of junction temperature (inductive load, V CE = 800V,V GE = +15V/0V, I C = 25A, R G = 22Ω,dynamic test circuit in Fig.E )Figure 16. IGBT transient thermalimpedance as a function of pulse width (D = t p / T )V G E , G A T E -E M I T T E R V O L T A G E0nC100nC 200nC 300nC0V 5V10V15V20VC , C A P A C I T A N C E0V10V20V30V100pF1nFQ GE , GATE CHARGEV CE , COLLECTOR -EMITTER VOLTAGE Figure 17. Typical gate charge (I C = 25A)Figure 18. Typical capacitance as a function of collector-emitter voltage (V GE = 0V, f = 1MHz)t s c , S H O R T C I R C U I T W I T H S T A N D T I M E10V11V 12V 13V 14V 15V0µs 5µs10µs15µs20µs25µs30µs I C (s c ), S H O R T C I R C U I T C O L L E C T O R C U R R E N T10V12V14V 16V 18V 20V0A 100A200A300A400A500AV GE , GATE -EMITTER VOLTAGEV GE , GATE -EMITTER VOLTAGEFigure 19. Short circuit withstand time as a function of gate-emitter voltage (V CE = 1200V, start at T j = 25°C)Figure 20. Typical short circuit collector current as a function of gate-emitter voltage (100V ≤V CE ≤1200V, T C = 25°C, T j ≤ 150°C)dimensionssymbol[mm][inch]minmax minmax A 4.78 5.280.18820.2079B 2.29 2.510.09020.0988C 1.78 2.290.07010.0902D 1.09 1.320.04290.0520E 1.73 2.060.06810.0811F 2.67 3.180.10510.1252G 0.76 max 0.0299 maxH 20.8021.160.81890.8331K 15.6516.150.61610.6358L 5.21 5.720.20510.2252M 19.8120.680.77990.8142N 3.560 4.9300.14020.1941∅P3.610.1421Q6.126.220.24090.2449TO-247ACFigure A. Definition of switching timesIr r m90% Ir r m10% Ir r mdi/dtFtr rIFi,vtQSQFtStFVRdi/dtr rQ=Q Qr r S F+t=t tr r S F+Figure C. Definition of diodesswitching characteristicsτ1τ2nτr r rFigure D. Thermal equivalentFigure B. Definition of switching losses Figure E. Dynamic test circuitLeakage inductance Lσ=180nH,and stray capacity Cσ=40pF.SGW25N120Power Semiconductors 11Jul-02Published byInfineon Technologies AG i Gr .,Bereich KommunikationSt.-Martin-Strasse 53,D-81541 München© Infineon Technologies AG 1999All Rights Reserved.Attention please!The information herein is given to describe certain components and shall not be considered as warranted characteristics.Terms of delivery and rights to technical change reserved.We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits,descriptions and charts stated herein.Infineon Technologies is an approved CECC manufacturer.InformationFor further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office in Germany or our Infineon Technologies Representatives worldwide (see address list).WarningsDue to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office.Infineon Technologies Components may only be used in life-support devices or systems with the express writtenapproval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.。
AM2520EH-ID中文资料
Units mW mA mA V
SPEC NO: DSAD1625 APPROVED: WYNEC
REV NO: V.5 CHECKED: Allen Liu
DATE: MAY/23/2007 DRAWN: Y.L.LI
பைடு நூலகம்
PAGE: 2 OF 4 ERP: 1102000009
元器件交易网
元器件交易网
PACKING & LABEL SPECIFICATIONS
AM2520EH/ID
SPEC NO: DSAD1625 APPROVED: WYNEC
REV NO: V.5 CHECKED: Allen Liu
DATE: MAY/23/2007 DRAWN: Y.L.LI
Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.25(0.01") unless otherwise noted. 3. Lead spacing is measured where the leads emerge from the package. 4. Specifications are subject to change without notice.
SPEC NO: DSAD1625 APPROVED: WYNEC
REV NO: V.5 CHECKED: Allen Liu
DATE: MAY/23/2007 DRAWN: Y.L.LI
PAGE: 1 OF 4 ERP: 1102000009
元器件交易网
Selection Guide
Notes: 1.Wavelength: +/-1nm. 2. Forward Voltage: +/-0.1V.
中央铬钢RB-2530产品数据材料和结构说明书
Applications• Acids • Caustics • Salts• Solvents• Chemical Process SolutionsCentricast ® RB-2530 Product DataMaterials and ConstructionAll pipe is manufactured with glass fabrics and a highly resilient formulation of aromatic amine cured epoxy resin. A 100 mil integral corrosion barrier of pure resin provides excellent corrosion resistance. The pipe’s proprietary resin formulation provides the toughness for many corrosive slurries. A 10 mil resin-rich reinforced external corrosion barrier proves excellent corrosion resistance and protection from ultraviolet (UV) radiation. Fiber Glass Systems warrants CENTRICAST RB-2530 pipe and fittings against UV degradation of physical properties and chemical resistance for 15 years.Pipe is available in 1” through 14” diameters with pressure ratings up to 150 psig, with higher pressure ratings in smaller sizes. Centricast RB-2530 comes in 20’ nominal or exact lengths from 18.0-20.4 feet long.FittingsFittings are manufactured with the samechemical/temperature capabilities as the pipe. Depending on the particular part and size, fittings will be compression molded, contact molded, hand fabricated or filament wound.Joining SystemsSocket JointAdhesive bonded straight socket joint with positive stops. This is thestandard for Centricast piping systems.•***************Testing:See NOV Fiber Glass Systems’ Socket Joint Installation Handbook.When possible, the piping system should be hydrostatically tested prior to beginning service. Care should be taken when testing to avoid water hammer. All anchors, guides and supports must be in place prior to testing the line.Test pressure should not be more than 1½ times the working pressure of the piping system and never exceed 1½ times the rated operating pressure of the lowest rated component in the system.Water Hammer:Care should be taken when designing an FRP piping system to eliminate sudden surges. Soft start pumps and slow actuating valves should be considered.ASTM D2997 Designation Codes:1”RTRP-21CW-4356 1½”-4”RTRP-21CW-4456 6”-8”RTRP-21CW-4455 10”-12”RTRP-21CW-445414”RTRP-21CW-4553(1)Static pressure ratings, typically created with use of a gear turbine, centrifugal, or multiplex pump having 4 or more pistons or elevation head.(2)Specially fabricated higher pressure fittings are available on request. Consult the factory for compressible gases. For insulated and/ or heat traced piping systems, use 100% of the uninsulated piping recommendations up to 200°F and reduce these ratings 50% for 200°F to 250°F operating temperatures. For uninsulated piping systems, reduce these ratings 30% for 225°F to 250°F operating temperatures. Heat cured adhesive joints are highly recommended for all piping systems carrying fluids at temperatures above 120°F.(3)Socket elbows, tees, reducers, couplings, flanges and nipples joined with Weldfast ZC-275 adhesive.(4)Flanged elbows, tees, reducers, couplings and nipples assembled at factory.(5)Laterals, crosses, and saddles.(6)Ratings shown are 50% of ultimate; 14.7 psi external pressure is equalto full vacuum.SupportProper pipe support spacing depends on the temperature and weight of the fluid in the pipe. The support spacing table is basedon unrestrained continuous beam theory using the pipe bending modulus derived from long-term beam bending tests. The maximum spans lengths were developed to ensure a design that limits mid-span deflection to ½ inch and dead weight bending to 1/8of the ultimate bending stress. Any additional loads on the piping system such as insulation, wind, seismic, etc. requires further consideration. Restrained (anchored) piping systems operating at elevated temperatures may result in guide spacing requirements that are shorter than unrestrained piping systems. In this case, the maximum guide spacing governs the support span requirements for the system. Pipe spans near elbows require special attention. Both supported and unsupported elbows are considered in the following tables and must be followed to properly design the piping system.There are seven basic rules to follow when designing piping system supports: 1. Do not exceed the recommended support span.2. Support heavy valves and in-line equipment independently.3. Protect pipe from external abrasion at supports.4.Avoid point contact loads.5. Avoid excessive bending. This applies to handling, transporting, initial layout, and final installed position.6. Avoid excessive vertical loading to minimize bending stresses on pipe and fittings.7. Provide adequate axial and lateral restraint to ensure linestability during rapid changes in flow.Support Spacing vs. Specific GravitySpecific Gravity 3.00 2.00 1.50 1.25 1.000.75Gas/Air Multiplier0.760.840.900.951.001.071.40Example: 6” pipe @ 150°F with 1.5 specific gravity fluid, maximumsupport spacing = 25.7 x 0.90 = 23.1 ft.Adjustment Factors for Various Spans With Unsupported Fitting at Change in DirectionSpan TypeFactor aContinuous interior or fixed end spans 1.00b Second span from supported end or unsupported fitting0.80c+d Sum of unsupported spans at fitting ≤0.75*eSimple supported end span0.67*For example: If continuous support is 10 ft., c+d must not exceed 7.5 ft. (c=3 ft. and d=4.5ft.) would satisfy this condition.Adjustment Factors for Various Spans With Supported Fitting at Change in DirectionSpan TypeFactor a Continuous interior or fixed end spans 1.00b Second span from simple supported end or unsupported fitting 0.80eSimple supported end span0.67Elbow StrengthAllowable Bending Moment - 90° ElbowNominal Pipe Size (In)Allowable Moment (Ft•Lbs)Nominal Pipe Size (In)Allowable Moment (Ft•Lbs)110061,6501½15082,8502225104,5003475126,50046501410,000Thermal ExpansionThe effects of thermal gradients on piping systems may be significant and should be considered in every piping system stress analysis. Pipe line movements due to thermal expansion or contraction may cause high stresses or even buckle a pipe line if improperly restrained. Several piping system designs are used to manage thermal expansion and contraction in above ground piping systems. They are listed below according to economic preference:1. Use of inherent flexibility in directional changes2. Restraining axial movements and guiding to prevent buckling3. Use expansion loops to absorb thermal movements4. Use mechanical expansion joints to absorb thermal movementsTo perform a thermal analysis the following information is required:1. Isometric layout of piping system 2. Physical and material properties of pipe 3. Design temperatures4. Installation temperature (final tie in temperature)5. Terminal equipment load limits6. Support movementsA comprehensive review of temperature effects on fiberglass pipe may be found in NOV Fiber Glass Systems’ Engineering and Piping Design Guide.Change in T emperature°FPipe Change in Length (In/100 Ft)250.3500.775 1.0100 1.3125 1.7150 2.0175 2.32002.6•***************ANSI/NSF 61 Drinking Water System Components 35GHWater Contact Temp: 23°CNational Oilwell Varco has produced this brochure for general information only, and itis not intended for design purposes. Although every effort has been made to maintainthe accuracy and reliability of its contents, National Oilwell Varco in no way assumesresponsibility for liability for any loss, damage or injury resulting from the use of informationand data herein nor is any warranty expressed or implied. Always cross-reference thebulletin date with the most current version listed at the web site noted in this literature.North America South America Europe Asia Pacific Middle East17115 San Pedro Ave. Suite 200 Avenida Fernando Simoes P.O. Box 6, 4190 CA No. 7A, Tuas Avenue 3 P.O. Box 17324San Antonio, Texas 78232 USA Recife, Brazil 51020-390 Geldermalsen, The Netherlands Jurong, Singapore 639407 Dubai, UAE Phone: 210 477 7500 Phone: 55 31 3501 0023 Phone: 31 345 587 587 Phone: 65 6861 6118 Phone: 971 4881 3566。
U2520DRB 用户手册说明书
Simplified Service Manual–U2520DRBVersion: 01Date:2021/08/23Content Index1. General Safety Instructions (3)1.1 SAFETY: General Safety (3)1.2 SAFETY: General Power Safety (5)2. Exploded view diagram with list of items (6)3. Wiring connectivity diagram (7)4. Disassembly and Assembly Procedures (8)4.1 Disassembly SOP (8)4.2 Assembly SOP (12)5. Trouble shooting instructions (16)1. General Safety InstructionsUse the following safety guidelines to help ensure your own personal safety and to help protect your equipment and working environment from potential damage.NOTE: In this section, equipment refers to monitors.IMPORTANT NOTICE FOR USE IN HEALTHCARE ENVIRONMENTS:Dell products are not medical devices and are not listed under UL or IEC 60601 (or equivalent). As a result, they must not be used within 6 feet of a patient or in a manner that directly or indirectly contacts a patient1.1 SAFETY: General SafetyWARNING: To prevent the spread of fire, keep candles or other open flames away from this product at all times.When setting up the equipment for use:⏹Place the equipment on a hard, level surface. Leave 10.2 cm (4 in) minimum of clearance onall vented sides of the computer to permit the airflow required for proper ventilation.⏹Restricting airflow can damage the computer or cause a fire.⏹Do not stack equipment or place equipment so close together that it is subject torecalculated or preheated air.⏹NOTE: Review the weight limits referenced in your computer documentation before placinga monitor or other devices on top of your computer.⏹Ensure that nothing rests on your equipment's cables and that the cables are not locatedwhere they can be stepped on or tripped over.⏹Ensure that all cables are connected to the appropriate connectors. Some connectors havea similar appearance and may be easily confused (for example, do not plug a telephonecable into the network connector).⏹Do not place your equipment in a closed-in wall unit or on a bed, sofa, or rug.⏹Keep your device away from radiators and heat sources.⏹Keep your equipment away from extremely hot or cold temperatures to ensure that it is usedwithin the specified operating range.⏹Do not push any objects into the air vents or openings of your equipment. Doing so cancause fire or electric shock by shorting out interior components.⏹Avoid placing loose papers underneath your device. Do not place your device in a closed-inwall unit, or on a soft, fabric surface such as a bed, sofa, carpet, or a rug.When operating your equipment:⏹Do not use your equipment in a wet environment, for example, near a bath tub, sink, orswimming pool or in a wet basement.⏹Do not use AC powered equipment during an electrical storm. Battery powered devices maybe used if all cables have been disconnected.⏹Do not spill food or liquids on your equipment.⏹Before you clean your equipment, disconnect it from the electrical outlet. Clean your devicewith a soft cloth dampened with water. Do not use liquids or aerosol cleaners, which maycontain flammable substances.⏹Clean the monitor display with a soft, clean cloth and water. Apply the water to the cloth,then stroke the cloth across the display in one direction, moving from the top of the displayto the bottom. Remove moisture from the display quickly and keep the display dry.⏹Long-term exposure to moisture can damage the display. Do not use a commercial windowcleaner to clean your display.⏹If your equipment does not operate normally - in particular, if there are any unusual soundsor smells coming from it - unplug it immediately and contact an authorized dealer or servicecenter.Protecting Against Electrostatic DischargeElectrostatic discharge (ESD) events can harm electronic components inside your equipment. Under certain conditions, ESD may build up on your body or an object, such as a peripheral, and then discharge into another object, such as your computer. To prevent ESD damage, you should discharge static electricity from your body before you interact with any of your equipment’s internal electronic components, such as a memory module. You can protect against ESD by touching a metal grounded object (such as an unpainted metal surface on your computer’s I/O panel) before you interact with anything electronic. When connecting a peripheral (including handheld digital assistants) to your equipment, you should always ground both yourself and the peripheral before connecting it. In addition, as you work inside the equipment, periodically discharge any static charge your body may have accumulated.You can also take the following steps to prevent damage from electrostatic discharge:⏹When unpacking a static-sensitive component from its shipping carton, do not remove thecomponent from the antistatic packing material until you are ready to install the component.Just before un wrapping the antistatic package, be sure to discharge static electricity fromyour body.⏹When transporting a sensitive component, first place it in an antistatic container orpackaging.⏹Handle all electrostatic sensitive components in a static-safe area. If possible, use antistaticfloor pads and work bench pads.1.2 SAFETY: General Power SafetyObserve the following guidelines when connecting your equipment to a power source:⏹Check the voltage rating before you connect the equipment to an electrical outlet to ensurethat the required voltage and frequency match the available power source.⏹Do not plug the equipment power cables into an electrical outlet if the power cable isdamaged⏹Norway and Sweden: If this product is provided with a 3-prong power cable, connect thepower cable to a grounded electrical outlet only.⏹If you use an extension power cable, ensure that the total ampere rating of the productsplugged in to the extension power cable does not exceed the ampere rating of the extension cable.⏹If you must use an extension cable or power strip, ensure the extension cable or power stripis connected to a wall power outlet and not to another extension cable or power strip. Theextension cable or power strip must be designed for grounded plugs and plugged into agrounded wall outlet.⏹If you are using a multiple-outlet power strip, use caution when plugging the power cable intothe power strip. Some power strips may allow you to insert a plug incorrectly. Incorrectinsertion of the power plug could result in permanent damage to your equipment, as well asrisk of electric shock and/or fire. Ensure that the ground prong of the power plug is insertedinto the mating ground contact of the power strip.⏹Be sure to grasp the plug, not the cable, when disconnecting equipment from an electricsocket.If your equipment uses an AC adapter:⏹Use only the Dell provided AC adapter approved for use with this device. Use of another ACadapter may cause a fire or explosion.⏹NOTE: Refer to your system rating label for information on the proper adapter modelapproved for use with your device.⏹Place the AC adapter in a ventilated area, such as a desk top or on the floor, when you useit to run the computer or to charge the battery. Do not cover the AC adapter with papers orother items that will reduce cooling; also, do not use the AC adapter inside a carrying case.⏹The AC adapter may become hot during normal operation of your computer. Use care whenhandling the adapter during or immediately after operation.⏹It is recommended that you lay the adapter on the floor or desk so that the green light isvisible. This will alert you if the adapter should accidentally go off due to external effects. Iffor any reason the green light goes off, disconnect the AC power cord from the wall for aperiod of ten seconds, and then reconnect the power cord.⏹Japan Only: Use only the Dell-provided AC power cable with the AC adapter. Use of anyother power cable may damage the device or AC adapter or may present risk of fire orelectric shock.2. Exploded view diagram with list of itemsItem DescriptionQ'ty Item DescriptionQ'ty1 Panel 1 16 PCBA LED DRV BD 12 ASSY MF 1 17 PCBA SENSOR BD1 3 BTN PWR 1 18 WIRE AC+3/3P1 4 SCRW TP-B FPH M2*2.4L ZN 4 19 #MYLAR PWR BD 1 5 PCBA CTRL BD 1 20 #ASSY SHD MAIN 1 6 MYLAR CTRL BD 1 21 #PCBA USB BD 1 7 SCRW TP-B FPH M2*4L B-ZN 3 22 #ASSY RC 1 8 SCRW MACH FLATM3*0.5P*4.5L ZN 11 23 #SCRW M FPH M4*10L ZN NYL 1 9 BOSS PANEL 1 24 #ASSY CLMN 1 10 SCRW TP-S W/FLM3*9.3L(S3.8)ZN 1 25 #ASSY BASE 1 11 SCRW T FPH M3*6L DELTA-PT NI 3 26 Power cable 1 12 SCRW TP-S FPH M3*5.5(7/1.5)NI 3 27 DisplayPort cable 1 13 SCRW PH INT/TOO M3*9TP-S C-ZN 1 28 USB Type-C cable 1 14 PCBA I/F BD 1 29 USB Type-C to Type-A cable115PCBA SPS BD 112987 654310111213141516212019181711222324252729283. Wiring connectivity diagramFFC 2 Wire 2Wire 1 FFC 1 Wire 3FFC 3Wire 6 Wire 4Wire 54. Disassembly and Assembly Procedures4.1 Disassembly SOPPreparation before disassemble 1. Clean the room for disassemble 2. Identify the area for monitor3. Check the position that the monitors be placed and the quantity of the monitor; prepare the area for material flow; according to the actual condition plan the disassemble layout4. Prepare the implement, equipment, material as bellow: 1) Working table2) Philips-head screwdriver 3) Glove4) Cleaning cloth 5) ESD protection Item Picture Operation Tool Notes1To remove the stand: 1. Place the monitoron a soft cloth or cushion.2. Press and hold thestand release button.3. Lift the stand up andaway from the monitor.21. Unlock 4 screws on Rear Cover2. Disassemble Rear Cover from middle frameNotice thedisassembly order:1) Disassemble thetop side2) Disassemble theLeft/Right sidePhilips-head screwdriver Torsion of Rear Cover screw: 11±1Kg3) Disassemble thebottom side4) Disassemble RearCover from middleframe.31. Remove the tapewhich fixed USBFFC cable and USBwire on panel2. Remove USB FFCcable and USB wirefrom I/F BD41. Remove Sensor BD wire from I/F BD and Sensor BD2. Remove Control BDwire from I/F BD51. Remove 4 black tapes from Panel2. Remove long andshort backlight wire from LED Driver BD61. Unlock screws onMiddle Frame a. FHP screws*2 (See Green mark)Philips-head screwdriverTorsion of FPH screw 3.5-4.0kg71.Tear off the yellowtape from Paneland disassembleLVDS cable fromPanel2. Take off MainSHD from Panel8 1. Take off Mylar fromSPS BD2. Unlock 9 PCBAscrews3. Disassemble LEDDriver BD, I/F BDand SPS BD fromMain SHD4. Remove all cablesand tapes from LEDDriver BD, I/F BDand SPS BDPhilips-headscrewdriverTorsion ofPCBA screw:8.5±0.5KgTorsion ofGroundingscrew:6.5±0.5Kg4.2 Assembly SOPPreparation before assemble 1. Clean the room for work 2. Identify the area for material3. Prepare the implement, equipment, material as bellow: 1) Working table2) Philips-head screwdriver 3) Glove4) Cleaning cloth 5) ESD protectionItem Picture OperationTools Notes 11. Insert SPS BD wire to SPS BD2. Insert AC wire to SPS BD3. Assemble SPS BD to Main SHD4. Insert LVDS cable to I/F BD andpaste 1 yellow tape to fix it5. Insert LED Driver BD wire to I/F BD6. Insert SPS BD wire to I/F BD7. Assemble I/F BD to Main SHD8. Insert LED Driver BD wire to LED Driver BD9. Assemble LED Driver BD to Main SHD10. Lock 9 PCBA screws to fix PCBAon Main SHD11. Assemble Mylar on SPS BDPhilips-headscrewdriverTorsion of PCBA screw:8.5±0.5KgTorsion of Grounding screw: 6.5±0.5Kg21. Insert LVDS cable to panel andpaste 1 yellow tape to fix it2. Place Main SHD on Panel and fixit with Middle Frame by 2 FPH screws (See Green mark)Philips-headscrewdriverTorsion of FPH screw: 3.5-4.0kg31. Insert long and short backlightwire to LED Driver BD2. Paste 4 black tapes to fixbacklight wire on Panel3. Insert Control BD wire to I/F BD4. Insert Sensor BD wire to I/F BD 41. Insert USB FFC cable and USBwire to I/F BD2. Paste 1 tape to fix USB FFCcable and USB wire on panel3. Assemble Rear Cover with panel51.Lock 4 Rear Cover screws Philips-headscrewdriverTorsion ofRear Coverscrew:11±1Kg6Assemble the Stand:a. Insert the stand base blocksfully into the stand slotb. Lift the screw handle and turnthe screw clockwisec. After fully tightening thescrew, fold the screw handleflat within the recess.7Attach the Stand assembly to the Monitor:a. Fit the two tabs on the upperpart of the stand to the grooveon the back of the monitorb. Press the stand down till itsnaps into place.5. Trouble shooting instructions。
- 1、下载文档前请自行甄别文档内容的完整性，平台不提供额外的编辑、内容补充、找答案等附加服务。
- 2、"仅部分预览"的文档,不可在线预览部分如存在完整性等问题,可反馈申请退款(可完整预览的文档不适用该条件!)。
- 3、如文档侵犯您的权益，请联系客服反馈,我们会尽快为您处理(人工客服工作时间：9:00-18:30)。
GSIB2520 thru GSIB2580
Vishay Semiconductors
formerly General Semiconductor
Document Number
New Product
Single-Phase Single In-Line
Bridge Rectifiers
Reverse Voltage 200 to 800V
Forward Current 25A
Case Style GSIB-5S
Dimensions in millimeters
Maximum Ratings & Thermal Characteristics Ratings at 25°C ambient temperature unless otherwise specified.
Parameter
Symbol GSIB2520GSIB2540GSIB2560GSIB2580Unit Maximum repetitive peak reverse voltage V RRM 200400600800V Maximum RMS voltage V RMS 140280420560V Maximum DC blocking voltage V DC 200
400
600
800
V Maximum average forward rectified T C = 98°C 25(1)output current at
T A = 25°C
I F(AV) 3.5(2)A Peak forward surge current single sine-wave superimposed on rated load (JEDEC Method)I FSM 350A Rating for fusing (t < 8.3ms)I 2t 500A 2sec Maximum thermal resistance per leg
R θJA 22(2)R θJC 1.0(1)°C/W Operating junction and storage temperature range
T J , T STG
–55 to +150
°C
Electrical Characteristics Ratings at 25°C ambient temperature unless otherwise specified.
Parameter
Symbol GSIB2520GSIB2540GSIB2560GSIB2580Unit
Maximum instantaneous forward voltage drop per leg at 12.5A
V F 1.00V Maximum DC reverse current at T A = 25°C 10rated DC blocking voltage per leg
T A = 125°C
I R
350
µA
Notes:(1) Unit case mounted on Al plate heatsink
(2) Units mounted on P .C.B. without heatsink
(3) Recommended mounting position is to bolt down on heatsink with silicone
thermal compound for maximum heat transfer with #6 screw
Features
• Plastic package has Underwriters Laboratory Flammability Classification 94V-0
• This series is UL listed under the Recognized Component Index, file number E54214.• High case dielectric strength of 2500 V RMS • Ideal for printed circuit boards • Glass passivated chip junction • High surge current capability
Mechanical Data
Case:GSIB-5S Molded plastic body
Terminals:Plated leads solderable per MIL-STD-750, Method 2026
High temperature soldering guaranteed:
260°C/10 seconds, 0.375 (9.5mm) lead length,5lbs. (2.3kg) tension
Mounting Position:Any (Note 3)Mounting Torque:8 in-lbs max.Weight: 0.26 oz., 7.0 g
GSIB2520 thru GSIB2580
Vishay Semiconductors
formerly General Semiconductor
Document Number 88646
Ratings and
Characteristic Curves (T A = 25°C unless otherwise noted)
1
100
Fig. 2 – Maximum Non-Repetitive Peak
Number of Cycles at 60 H Z
15200255075100125150
A v e r a g e F o r w a r d O u t p u t C u r r e n t (A )
0.60
1.00 1.20 1.40
0.80Instantaneous Forward Voltage (V)Fig. 3 – Typical Forward Characteristics
Per Leg
20
60
40
100
80
Fig. 4 – Typical Reverse Characteristics
Per Leg
Percent of Rated Peak Reverse Voltage (%)
10510
100
I n s t a n t a n e o u s F o r w a r d C u r r e n t (A )
Fig. 5 – Typical Junction Capacitance
Per Leg
Reverse Voltage (V)
J u n c t i o n C a p a c i t a n c e (p F )
1
10100
Fig. 6 – Typical Transient Thermal
Impedance
t, Heating Time (sec)
0.1110
2530Temperature (°C)
10
Fig. 1 – Derating Curve Output
Rectified Current
0.01。