MM_CH04_2010_Spring

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XP正版序列号XP好用的正版序列号

XP正版序列号XP好用的正版序列号

XP正版序列号XP好⽤的正版序列号收集的XP正版序列号VOL版:DG8FV-B9TKY-FRT9J-6CRCC-XPQ4G(上海版)MRX3F-47B9T-2487J-KWKMF-RPWBY(⼯⾏版)QC986-27D34-6M3TY-JJXP9-TBGMD(⼴州版)QHYXK-JCJRX-XXY8Y-2KX2X-CCXGD(⼴州政府版)T72KM-6GWBP-GX7TD-CXFT2-7WT2B(上海版)2005年上海政府0686版谢谢⼤家的⽀持,帮我点下需要的⼴告谢谢我会更加努⼒整理我的百科服务⼤家 QC986-27D34-6M3TY-JJXP9-TBGMD(珆塆交⼤学⽣版)VMXC2-M9HKH-DRYGC-FHQ7H-BJY33(0408版)TDWGX-DMF97-BJYDQ-X9DJV-CYHWQ(不明)G6X78-XG4KV-3MXT7-FT8YM-F3YW3(不明)T8FMX-Q4HQJ-3JW77-JGPDC-FY9DG(不明)MFBF7-2CK8B-93MDB-8MR7T-4QRCQ(北京版)FCKGW-RHQQ2-YXRKT-8TG6W-2B7Q8(韩⽂版)DRXKM-94K47-38QVX-F8K7R-2H7CD(⽇⽂版)RFYPJ-BKXH2-26FWP-WB6MT-CYH2Y(英⽂版)7HPVP-8VHPV-G7CQ3-BTK2R-TDRF3(英⽂版)BCJTW-2M9JH-M8HHT-KWWWM-3444Y(英⽂版)CD87T-HFP4C-V7X7H-8VY68-W7D7M(英⽂版)OEM版:华硕:家庭版:KR63J-B34MB-CVP9K-T478G-8Y3XG联想:家庭版: PWBPT-6PGKF-TP6MY-299P4-CPXQG (XXXXX-119-0001544-XXXXX)专业版: FCDGH-QW3DJ-VBC6C-9BYTX-4GKQJ (XXXXX-119-0001553-XXXXX)VF4HT-MPWB8-TWV6R-K6QM4-W6JCMH3B8D-MQPF9-WQMFB-GV3R4-VTF7W(04年联想版)DELL:家庭版: RCBF6-6KDMK-GD6GR-K6DP3-4C8MT (XXXXX-119-0001024-XXXXX)专业版: XJM6Q-BQ8HW-T6DFB-Y934T-YD4YT (XXXXX-119-0001024-XXXXX)KG7G9-67KHV-4FQKV-4DYXK-BHQTJCOMPAQ: 家庭版: KG27H-JV9M6-2CXKV-GMP22-HF2BQ (XXXXX-119-0001015-XXXXX)专业版: KYKVX-86GQG-2MDY9-F6J9M-K42BQ (XXXXX-119-0001015-XXXXX)HP:家庭版: MK48G-CG8VJ-BRVBB-38MQ9-3PMFT (XXXXX-119-0001067-XXXXX)专业版: DMQBW-V8D4K-9BJ82-4PCJX-2WPB6 (XXXXX-119-0001067-XXXXX)P2BXT-D7Y8P-F6WF2-HYXYP-49TJDACER:家庭版: CXCY9-TTHBT-36J2P-HT3T3-QPMFB (XXXXX-119-0001006-XXXXX)专业版: BW2VG-XXDY6-VW3P7-YHQQ6-C7RYM (XXXXX-119-0001006-XXXXX)KDD3G-HGVGM-M24p4-6BMMY-9XHF8IBM:家庭版: DMY26-78CX9-Q89DP-Q8QK8-VF2B8 (XXXXX-119-0001076-XXXXX)专业版: HCBR8-FGC2K-RY7BM-HM3KT-BKVRW (XXXXX-119-0001076-XXXXX)清华同⽅:家庭版: KMHJF-9M82Y-YPFV7-YQHXH-F9JW8 (XXXXX-119-0001794-XXXXX)专业版: M68XC-TX2C9-PKK8H-GP8JH-RC8XB (XXXXX-119-0001805-XXXXX)TCL:家庭版: XPGYX-J7BF9-4YJVV-7MWK9-WQT3Y (XXXXX-119-0001607-XXXXX)七喜:家庭版: GJMY6-GMJHY-2VJ79-K67WT-KQHYT (XXXXX-119-0001661-XXXXX)Samsung:家庭版: XVX72-2WCXQ-48VWH-T66HT-C7R2B (XXXXX-119-0001085-XXXXX) TOSHIBA家庭版: WDHPC-6WQPF-W3R3K-J2VF4-JFP8W (XXXXX-119-0001114-XXXXX) SONY:专业版: K7RGC-CDXYJ-FTYH2-Y3VVV-KBYC7 (XXXXX-119-6385501-XXXXX)⽅正:家庭版:FK4VC-XP9C3-BD78M-68492-BP9BY (XXXXX-119-0002964-XXXXX)专业版:F4G2M-BH2JF-GTGJW-W82HY-VMRRQ (XXXXX-119-0002973-XXXXX)富⼠通:家庭版:JY6V8-QV6YB-BD3GX-67DC9-JT7WD (XXXXX-119-0001373-XXXXX) TOSHIBA:家庭版:WDHPC-6WQPF-W3R3K-J2VF4-JFP8W (XXXXX-119-0001114-XXXXX)惠普英⽂:KYKVX-86GQG-2MDY9-F6J9M-K42BQ(XXXXX-119-0001015-XXXXX)P2BXT-D7Y8P-F6WF2-HYXY9-49TJD序列号:6XKGD-PGHV3-D46CB-XQ8V3-V7FTJ法语专业版⼤量微软贵宾VIP序列号(1) H2HYJ-28PQM-6HGFG-CWMMD-V2C62M74XB-7K8Y4-YT6MY-B6XX4-PWBF4VVBQJ-VHP8J-7DHHP-FK68Y-YHY2VD2Q4M-M47JY-FVXFJ-JPRKR-6GG82RCB4W-27GPV-HKPF7-WH43D-V6XPDY88HJ-4K4VP-W6Y3H-BWH6M-43GCPM7D6F-3GY6B-PWXPF-JPPYD-8XD2JFWFX8-2VBWD-2K8T7-R26QW-93T3CPW2DM-BHPPK-YV8V3-VFYVY-VQFKD8W4DX-VDYKX-JYFYC-VY4Q3-YJ4PD93XDW-CQTX4-PJ2Y4-YHRW4-G4DBFD2H37-MCK77-8YW4V-7C3YQ-K98RJQ3MM2-PX8HT-DG34Y-MH7Q4-WDG3WTRHB3-TTDC6-QDTKW-8GRQY-G7H6M3VHPK-BYHDR-X63B6-8FFFM-P6TW2CB4F7-JHGCM-47K6G-PB7BY-BX2W3TMYYT-RYXXQ-BHJ78-F6TWC-97BXTYTTD2-BQHYG-8F4D2-WCVHC-64TTTGRPC7-FVKTR-MXVMJ-4TD33-JMDF8DXVWV-PDKBH-2PK6Y-YQWCP-GQ43TFWT4K-YXKYV-FTWJG-B6WJF-CB73X273M3-4KG6D-34MMY-XYFWF-2P4VYTC2PX-Y77HM-QJQ7X-BHVBT-QF9PC4MXCM-8R7Q8-V74VD-6PPWY-QQBPMF4K8K-K6XFX-K7M68-M6P4P-MVV6YWFMT2-DWMYG-JYHVK-DCXYD-7M84BBWWYK-6QF64-7KJPR-HJBJ7-JD9G9V3QXP-MBQPK-RQGB3-6XFJR-2P2BBQXYMP-G3WTH-DX3RT-VX8FR-7MDHH44V3B-JHRC3-T4PRP-C4GHK-FTT2F3TC47-R6GKX-KMM3V-37DR2-K3CGBX8CXT-B38P8-MR6CG-XGJ76-734BXMWXP3-28PMK-CQYD7-QV6VC-X7F66YTX4R-RPQJC-2FTT2-XGH23-KDPHDCJ78M-4DDKT-6CCQF-VFB7J-6HM9QGKH26-V6VWJ-3YYJY-QFF2P-PYXBHJP6M2-HJCFC-8KCJ6-M2KMW-69B9TW4DYV-RJ7VP-X78K7-7KF78-DT8JD3F276-7BYC6-WT46Q-JMR7W-KT9F6H7CJG-Y7HPQ-W3D2C-3H64M-6FVVCT3RMP-XXVR7-TGGMK-H74VG-Y3YQVPJCYY-P6TQ4-DMPY4-4WGXV-4DJRB74GFB-DDKVK-V3M28-73GYW-MTFJWDFHFT-4XQRX-4J76Q-PKPP8-72TT6G7HBY-RPXFX-JFTP2-YYVVX-8W9QD 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B8FTF-YGHBH-DJPJP-BH6TM-QDFHR DRCRH-7HPH4-MPKR7-RGKR7-GFVKMGK2MH-MFXGX-KWQBT-RWK8J-QGR8G MF7CF-3XXMG-7PP4Y-PYV83-2X7D3P87VW-YQ8J6-Y4QGP-JMKQ4-Q72W2V34JQ-DM8PH-YTCV7-FB738-GPBRH MGPD7-GF6VT-83YQD-422F8-GF3TK8R4KM-JQTQM-H8WGX-8F3MV-FCBCB FT627-G4XDP-4KDG8-66B4C-KC3T3W6JR7-V2FKM-6K2YV-FYQBW-X327M WGK4X-GHKXG-FFFKY-XDXV7-84PTQ HFBMY-QXQF2-F8RVK-JBPMR-Q3G6D 233WJ-DKFJ6-XK772-KRDKX-MR3J68VMPV-6C3HM-6XDBJ-XKC63-4P9V887G2P-DPQ4F-GTBB7-PCVXW-MVDKY KQF36-BJM8P-6JPWW-6W6H8-Y46TX22DVC-GWQW7-7G228-D72Y7-QK8Q37PJCG-CXBBM-WPRP3-JC348-D8WMGF38JH-BGF8G-G7GMW-XM4T6-VK3CK GKM3J-M2FQF-7JFKT-TPB84-RBJXP DRPK6-BDCB3-G2WXG-VWJ4V-829YH8VWCB-QMTHX-FVK2R-C6YJV-6TW8G6CGHB-GPMPR-42MGV-6PKB8-FV3V4 MGB64-RPKCV-3GKBC-PH8T4-YTXQ9Q6DJY-7DKTV-KQTFX-8X7WF-DWRW6 VCTQM-VTQ8Q-Q4GQ8-H3X8M-CQWT26YHC2-WW82B-C64DR-XXPDJ-C4P7M CRMCF-6BG6R-8G7HT-MYHWV-WCHV7 TTJ8X-K7G7K-TMW4F-6FPXH-C677H JYM4H-TMPVF-QCDPQ-HFRX2-2HFDTV66VK-XWC7M-VH3KR-JY6CV-HMYPQB6DBQ-MKKVX-VBYXJ-M373C-773HTRX2K6-XQDQT-FYXWY-8XWK8-9XTYD XWGPK-JRKGF-TGWKC-3T7M4-BGCBC YF8PG-GH747-DMTC3-2797D-6WBWM VTB7G-JDRHV-JRV7K-3BX4B-3TW6TFF7BH-G3TQF-GRQFX-PPF38-MH6MX CCYFQ-CYK72-HTB3Y-MF37F-DHXQK 4876D-XRHK2-PHG2T-JVJWY-72D6VPV77H-MCP3H-VBBJD-WQF8M-XK8DW⼤量微软VIP序列号(2)QYRY6-4Y3WR-QVR86-MDJMY-4C694 VGPT2-PV626-2X6T7-D7R6Q-7GRQJWF47Q-DGPDW-FMJBY-3RWY2-K3Y6D CWWQT-VQ3RH-TPWPQ-HRJRP-9P8FV 3WFVR-J3R6R-3TFVX-Y2GC8-VMP9Q47PQQ-D2F6R-FJ3QV-RV2GH-3JQBGGK2MH-MFXGX-KWQBT-RWK8J-QGR8G MPH32-4B3G8-2MVHQ-6V4QK-4VWG974GFB-DDKVK-V3M28-73GYW-MTFJW DFHFT-4XQRX-4J76Q-PKPP8-72TT6G7HBY-RPXFX-JFTP2-YYVVX-8W9QD VJGX6-R7VQ8-P6GW8-J6RPK-4QCB9 KMG2X-6D8XP-M23XR-6FWKX-B8JRH CRTGH-B68P2-XB6JC-44GCD-X9JHMP6PMF-2YWVR-XTHRJ-H2RM6-3BCVD VJGX6-R7VQ8-P6GW8-J6RPK-4QCB98Y32G-27HKV-TGGGM-4YDKG-DGKH2 CGXJJ-DXCMJ-7CD7D-7BMJT-PCCPH8GMVK-JGX6P-T36GY-P7K2Q-GD2MPT8WT3-VHMDT-JDHP2-KKGYH-7R4467VDYJ-3HYPJ-63CBQ-Y22QH-GM2B2 7777W-HB76V-68FBQ-PTHT6-PBHCH Windows XP PRO build 2600 or XP pro 2600 evaluation:7VF4T-D7QMK-CC87K-P2468-3M4PQX3BTD-7P44K-2FWW2-3DGB8-B88DJT3GXK-WDT8Y-XMKD3-Q6MQD-DT862 VG2PR-HTKCV-TC3D8-XVTDR-D2WHD PQQRK-GFPHC-QVJC8-6MTJQ-R8DKV J84TF-7CTBW-JH3TB-YXR3W-BJBRQJ84TF-7CTBW-JH3TB-YXR3W-BJBRQ 23QFT-DVY67-6G2VV-7JM76-BWQR3 68YG6-DCFRM-B7KYT-TJRMF-CXJKX 68YG6-DCFRM-B7KYT-TJRMF-CXJKX 87H3J-HD7TM-V66FW-PBDBX-HVH4R YG4WP-9YXKX-QM2YV-PR4X7-KDJTC CHXHP-PB2FG-B68BB-H8XGF-7V2PY K74GF-Y232R-PH3RR-YKB4H-PJCV3 BRJX8-FWBHG-2RXWK-H84W7-628J4 4V2YV-HHHX4-CKVDY-4R486-498V2G87BW-MYGY7-4FWGY-CCHQB-8FJ3B 6KM4D-2Q76R-278RX-QMXJD-88D7V4JRPY-6XGY7-2MY2V-BWRX7-YCHGP WMMJQ-8TKHC-MC7TJ-7WCF2-D8BRY RJQ6X-R4C2W-FFMT7-TGXVQ-9GTVG VM3QK-HYQ8B-VHVFB-DBQWP-XW83Y GYBRP-VG8CH-JRHTV-X8C7J-6GYMB F3RJW-XFQWM-4FH6Q-3CTMR-R82GR 8J8K6-GPMBM-RWVFV-2Y8VX-B66JY8J8K6-GPMBM-RWVFV-2Y8VX-B66JY 88F24-PGH68-DTMQM-8VV47-DG7283JJQX-H6YQB-CCX7K-6WXCK-Q6BYR XBB6Y-G6QWG-WPCFQ-F8B6B-HMCPW WYTDP-6YFYF-4KFGJ-GHRYY-9KPHH 6WF3Q-TRX4M-47PRY-MFQXV-86PJG F2R8R-QJJ3V-KJKMT-64T4T-B78YT BTHFD-Y6FCP-7KMCT-7JYXH-CBPFR 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BQ2014HSN;BQ2014HSNTR;BQ2014HSNTRG4;BQ2014HSNG4;BQ2014HEVM-001;中文规格书,Datasheet资料

BQ2014HSN;BQ2014HSNTR;BQ2014HSNTRG4;BQ2014HSNG4;BQ2014HEVM-001;中文规格书,Datasheet资料

Features➤Accurate measurement of avail-able capacity in NiCd or NiMH batteries ➤Low-cost battery management so-lution for pack integration-As little as 12square inch of PCB for complete circuit -Low operating current (120µA typical)-Less than 100nA of data retention current➤High-speed (5kb/s) single-wire communication interface (HDQ bus) for critical battery parameters ➤Communication with an external charge controller such as the bq2004➤Direct drive of remaining capacity LEDs ➤Automatic rate and temperature compensation of measurements ➤16-pin narrow SOICGeneral DescriptionThe bq2014H NiCd/NiMH Gas Gauge IC is intended for battery-pack or in-system installation to maintain an accurate record of available battery capacity.The IC monitors a voltage drop across a sense resistor connected in series between the negative battery termi-nal and ground to d e t e r m i n e charge and discharge activity of the battery .Compensations for bat-tery temperature,self-discharge,and rate of discharge are applied to the charge counter to provide avail-able capacity information across a wide range of operating conditions.Battery capacity is automatically re-calibrated,or “learned,”in the course of a discharge cycle from full to empty .Nominal available capacity may be directly indicated using a five-segment LED display .The bq2014H also supports a simple single-linebidirectional serial link to an exter-nal processor (common ground).The 5kb/s HDQ bus interface reduces communications overhead in the external microcontroller.Internal registers include available capacity and energy,temperature,voltage and current,and battery status.The external processor may also overwrite some of the bq2014H gas gauge data registers.The bq2014H can operate from the batteries in the pack.The REF out-put and an external transistor allow a simple,inexpensive voltage regu-lator to supply power to the circuit from the cells.1bq2014HLCOMLED common outputSEG 1/PROG 1LED segment 1/program 1input SEG 2/PROG 2LED segment 2/program 2input SEG 3/PROG 3LED segment 3/program 3input SEG 4/PROG 4LED segment 4/program 4input SEG 5/PROG 5LED segment 5/program 5input DONECharge complete input1PN20140H..eps16-Pin Narrow SOIC234 5678161514131211109LCOMSEG 1/PROG 1SEG 2/PROG 2SEG 3/PROG 3SEG 4/PROG 4SEG 5/PROG 5DONE V SSV CC REF NC HDQ RBI SB DISP SRV SS System ground SR Sense resistor input DISP Display control input SB Battery sense input RBI Register backup input HDQ Serial communications input/output NC No connectREF V oltage reference output V CCSupply voltagePin Connections SLUS030A –JUNE 1999 - REVISED OCTOBER 2003Low-Cost NiCd/NiMH Gas Gauge ICPin NamesPin DescriptionsLCOM LED common outputOpen-drain output that switches V CC tosource current for the LEDs.The switch isoff during initialization to allow reading ofthe soft pull-up or pull-down program resis-tors.LCOM is also high impedance when thedisplay is off.SEG1–SEG5LED display segment outputs(dual func-tion with PROG1–PROG5)Outputs that each may activate an LED to sink the current sourced from LCOM.PROG1–PROG2Programmed full count selection inputs (dual function with SEG1–SEG2)Three-level input pins that define the pro-grammed full count(PFC)thresholds de-scribed in Table2.PROG3–PROG4Power gauge scale selection inputs(dual function with SEG3–SEG4)Three-level input pins that define the scale factor described in Table2.PROG5Self-discharge rate selection(dual func-tion with SEG5)Three-level input pin that defines theself-discharge and battery-compensation fac-tors as shown in Table1.DONE Charge complete inputCommunicates the status of an externalcharge-controller such as the bq2004Fast-Charge IC to the bq2014H.Note:This pinmust be pulled down to V SS using a200kΩresistor.V SS GroundSR Sense resistor inputThe voltage drop(V SR)across the sense re-sistor R S is monitored and integrated overtime to interpret charge and discharge activ-ity.V SR<V SS indicates discharge,and V SR>V SS indicates charge.The effective voltagedrop,V SRO,as seen by the bq2014H is V SR+V OS.DISP Display control inputDISP high disables the LED display.DISPtied to V CC allows PROG X to connect di-rectly to V CC or V SS instead of through apull-up or pull-down resistor.DISP floatingallows the LED display to be active duringcharge.DISP low activates the display.SeeTable1.SB Secondary battery inputMonitors the battery cell-voltage potentialthrough a high-impedance resistive dividernetwork for end-of-discharge voltage(EDV)thresholds and for battery-removeddetection.RBI Register backup inputProvides backup potential to the bq2014H reg-isters while V CC≤3V.A storage capacitor ora battery can be connected to RBI.HDQ Serial communication input/outputThis is the open-drain bidirectional commu-nications port.NC No connectREF Voltage reference outputREF provides a voltage reference output foran optional microregulator.V CC Supply voltage input2bq2014HFunctional DescriptionGeneral OperationThe bq2014H determines battery capacity by moni-toring the amount of current input to or removed from a rechargeable battery.The bq2014H mea-sures discharge and charge currents,measures bat-tery voltage,estimates self-discharge,monitors the battery for low battery-voltage thresholds,and com-pensates for temperature and charge/discharge rate. Current measurement is made by monitoring the voltage across a small-value series sense resistor be-tween the negative battery terminal and ground. The bq2014H compensates the nominal available capacity register for discharge rate and tempera-t u r e a n d r e p o r t s t h e c o m p e n s a t e d a v a i l a b l e capacity.The bq2014H uses the compensated availablecapacity to drive the LED display.In addition,the bq2014H estimates the available energy using the aver-age battery voltage during the discharge cycle and re-maining compensated available capacity.Figure1shows a typical battery pack application of the bq2014H using the LED display capability as a charge-state indicator.The bq2014H is configured to display capacity in relative display mode.The relative display mode uses the last measured discharge capacity of the battery as the battery“full”reference.A push-button display feature is available for momentarily enabling the LED display.The bq2014H monitors the charge and discharge cur-rents as a voltage across a sense resistor.(See R S in Fig-ure1.)A filter between the negative battery terminal and the SR pin is required.3Figure 1.Battery Pack Application Diagram—LED Displaybq2014HVoltage ThresholdsIn conjunction with monitoring V SR for charge/discharge currents,the bq2014H monitors the battery potential through the SB pin for the end-of-discharge voltage(EDV) thresholds.The EDV threshold levels are used to determine when the battery has reached an“empty”state.The EDV thresholds for the bq2014H are programmable with the default values fixed as follows:EDV1 (first) = 0.76VEDVF(final) = EDV1 - 0.025V = 0.735VThe battery voltage divider(RB1and RB2in Figure1)is used to scale these values to the desired threshold.If V SB is below either of the two EDV thresholds,the as-sociated flag is latched and remains latched,independ-ent of V SB,until the next valid charge.EDV monitoring is disabled if theisgreater than2C(OVLD Flag=1)and resumes second after the rate falls below2C.The V SB value isover the serial port.RBI InputThe RBI input pin is used with a storage capacitor or ex-ternal supply to provide backup potential to the internal bq2014H registers when V CC drops below3.0V.V CC is output on RBI when V CC is above3.0V.If using an exter-nal supply(such as the bottom series cell)as the backup source,an external diode is required for isolation.ResetThe bq2014H can be reset by removing V CC and ground-ing the RBI pin for15seconds or by commands over the serial port.The serial port reset command sequence re-quires writing00h to register PPFC(address=1Eh)and then writing00h to register LMD(address=05h). TemperatureThe bq2014H internally determines the temperature in 10°C steps centered from approximately-35°C to+85°C. The temperature steps are used to adapt charge and dis-charge rate compensations,self-discharge counting,and available charge display translation.The temperature range is available over the serial port in10°C increments,as shown in the following tableLayout ConsiderationsThe bq2014H measures the voltage differential between the SR and V SS pins.V OS(the offset voltage at the SR pin)is greatly affected by PC board layout.For optimal results,the PC board layout should follow the strict rule of a single-point ground return.Sharing high-current ground with small-signal ground causes undesirable noise on the small-signal nodes.Additionally:I The capacitors(C1and C2)should be placed asclose as possible to the V CC and SB pins, respectively,and their paths to V SS should be as short as possible.A high-quality ceramic capacitor of0.1µF is recommended for V CC.I The sense-resistor capacitor should be placed as closeas possible to the SR pin.I The sense resistor(R S)should be as close as possible tothe bq2014H.4TMP(hex)Temperature Range0x< -30°C1x-30°C to -20°C2x-20°C to -10°C3x-10°C to 0°C4x0°C to 10°C5x10°C to 20°C6x20°C to 30°C7x30°C to 40°C8x40°C to 50°C9x50°C to 60°CAx60°C to 70°CBx70°C to 80°CCx> 80°Cbq2014HGas Gauge OperationThe operational overview diagram in Figure2illustrates the operation of the bq2014H.The bq2014H accumu-lates a measure of charge and discharge currents,as well as an estimation of self-discharge.The accumu-lated charge and discharge currents are adjusted for temperature and rate to provide the indication of com-pensated available capacity to the host system or user. The main counter,Nominal Available Capacity(NAC), represents the available battery capacity at any given time.Battery charging increments the NAC register, while battery discharging and self-discharge decrement the NAC register and increment the DCR(Discharge Count Register).The Discharge Count Register is used to update the Last Measured Discharge(LMD)register only if a complete battery discharge from full to empty occurs without any partial battery charges.Therefore,the bq2014H adapts its capacity determination based on the actual condi-tions of discharge.The battery's initial capacity equals the Programmed Full Count(PFC)shown in Table2.Until LMD is up-dated,NAC counts up to but not beyond this threshold during subsequent charges.This approach allows the gas gauge to be charger-independent and compatible with any type of charge regime.st Measured Discharge(LMD)or learnedbattery capacity:LMD is the last measured discharge capacity of thebattery.On initialization(application of V CC or bat-tery replacement),LMD=PFC.During subsequentdischarges,the LMD is updated with the latestmeasured capacity in the Discharge Count Registerrepresenting a discharge from full to below EDV1.A qualified discharge is necessary for a capacitytransfer from the DCR to the LMD register.TheLMD also serves as the100%reference thresholdused by the relative display mode.5Figure 2.Operational Overviewbq2014H2.Programmed Full Count (PFC)or initial bat-tery capacity:The initial LMD and gas gauge rate values are pro-grammed by using PROG 1–PROG 4.The bq2014H is configured for a given application by selecting a PFC value from Table 2.The correct PFC may be determined by multiplying the rated battery capac-ity in mAh by the sense resistor value:Battery capacity (mAh)*sense resistor (Ω) =PFC (mVh)Selecting a PFC slightly less than the rated capac-ity provides a conservative capacity reference until the bq2014H “learns”a new capacity reference.Example:Selecting a PFC Value Given:Sense resistor =0.05ΩNumber of cells =10Capacity =3500mAh,NiMH Current range =50mA to 1A Relative display modeSelf-discharge=per day @25°CVoltage drop over resistor =2.5mV to 50mV Nominal discharge voltage =1.2V Therefore:3500mAh *0.05Ω= 175mVh6PROG x Pro-grammed Full Count (PFC)PROG 4= LPROG 4= Z or HUnits 12PROG 3= H PROG 3= Z PROG 3= L PROG 3= H PROG 3= Z PROG 3= L ---SCALE =1/80SCALE =1/160SCALE =1/320SCALE =1/640SCALE =1/1280SCALE =1/2560mVh/count H H 4915261430715476.838.419.2mVh H Z 4505656328214170.435.217.6mVh H L 4096051225612864.032.016.0mVh Z H 3686446123011557.628.814.4mVh Z Z 3379242221110653.026.413.2mVh Z L 3072038419296.048.024.012.0mVh L H 2764834617386.443.221.610.8mVh L Z 2560032016080.040.020.010.0mVh LL2252828214170.435.217.68.8mVh V SR equivalent to 2counts/s (nom.)904522.511.255.62.8mVTable 2.bq2014H Programmed Full Count mVh,V SR Gain SelectionsTable 1.Self-Discharge and Capacity Compensationbq2014HSelect:PFC=27648counts or173mVhPROG1=lowPROG2=highPROG3=floatPROG4=lowPROG5=lowThe initial full battery capacity is173mVh (3460mAh)until the bq2014H“learns”a new capac-ity with a qualified discharge from full to EDV1.3.Nominal Available Capacity(NAC):NAC counts up during charge to a maximum value of LMD and down during discharge and self-dis-charge to0.NAC is reset to0on initialization and on the first valid charge following discharge to EDV1.To prevent overstatement of charge during periods of overcharge,NAC stops incrementing when NAC=LMD or0.94∗LMD if T<0°C.4.Discharge Count Register(DCR):The DCR counts up during discharge independent of NAC and could continue increasing after NAC has decremented to0.Prior to NAC=0(empty battery),both discharge and self-discharge in-crement the DCR.After NAC=0,only discharge increments the DCR.The DCR resets to0when NAC≥0.94∗LMD and a discharge is detected.The DCR does not roll over but stops counting when it reaches FFh.The DCR value becomes the new LMD value on the first charge after a valid discharge to V EDV1if all the following conditions are met:I No valid charge initiations(charges greater than2NAC updates where V SRO>V SRQ)occurredduring the period between NAC≥0.94∗LMD andEDV1.I The self-discharge is less than6.25%of NAC.I The temperature is≥0°C when the EDV1levelis reached during discharge.I The discharge begins when NAC≥0.94∗LMD.I VDQ is set.The valid discharge flag(VDQ)indicates whether the present discharge is valid for LMD update.If the DCR update value is less than0.94∗LMD, LMD will only be modified by0.94∗LMD.This pre-vents invalid DCR values from corrupting LMD.5.Scaled Available Energy(SAE):SAE is useful in determining the available energy within the battery,and may provide a more usefulcapacity reference in battery chemistries withsloped voltage profiles during discharge.SAE maybe converted to an mWh value using the followingformula:E(mWh) =(SAEH SAEL)∗+∗25612.∗∗∗SCALE(R+R)R RB1B2S B2where R B1,R B2,and R S are resistor values inohms,as shown in Figure1.SCALE is the selectedscale from Table2.pensated Available Capacity(CACT)CACT counts similarly to NAC,but contains theavailable capacity compensated for discharge rateand temperature.Charge CountingCharge activity is detected based on a positive voltage on the SR input.If charge activity is detected,the bq2014H increments NAC at a rate proportional to V SR and,if enabled,activates the LED display.The bq2014H counts charge activity when the voltage at the SR input(V SRO)exceeds the minimum charge threshold(V SRQ).A valid charge is detected when NAC has been updated twice without discharging or reaching the digital magnitude filter time-out.Once a valid charge is detected,charge counting continues until V SR, including offset,falls below V SRQ.Discharge CountingDischarge activity is indicated by a negative voltage on the SR input.All discharge counts where V SRO is less than the minimum discharge threshold(V SRD)cause the NAC register to decrement and the DCR to increment.Self-Discharge CountingThe bq2014H continuously decrements NAC and incre-ments DCR for self-discharge on the basis of time and tem-perature.Charge/Discharge CurrentThe bq2014H current-scale registers,VSRH and VSRL, can be used to determine the battery charge or dis-charge current.See the Current Scale Register descrip-tion for details.7bq2014HCount CompensationsCharge CompensationTwo charge efficiency compensation factors are used for trickle and fast charge.Trickle charge is defined as a rate of charge<C/3.The compensation defaults to the fast-charge factor until the actual charge rate is determined. Temperature adapts the charge rate compensation fac-tors over two ranges between nominal and hot tempera-tures.The compensation factors are shown below.Charge Temperature Trickle-ChargeCompensationFast-ChargeCompensation< 40°C0.810.94> 40°C0.750.88 Compensated Available CapacityNAC is adjusted for rate of discharge and temperature to derive the CACD and CACT values.Corrections for the rate of discharge are made by adjust-ing an internal discharge compensation factor.The dis-charge factor is based on the discharge rate.This com-pensation is applied to NAC to derive the value in the CACD register.The compensation factors during discharge are:Approximate Discharge Rate Rate EfficiencyFactor< 2C100%> 2C95% Temperature compensation during discharge also takes place.At lower temperatures,the compensation factor increases by0.05for each10°C temperature range below 10°C.This compensation is applied to CACD to derive the value in the CACT register.The temperature com-pensation factor follows the equationTemperature Efficiency Factor = 1.00 - (0.05∗N) where N=number of10°C steps below10°C.For example,T>10°C:Nominal compensation,N=00°C<T<10°C:N=1(temperature efficiency=95%)-10°C<T<0°C:N=2(temperature efficiency=90%)-20°C<T<-10°C:N=3(temperature efficiency=85%)-20°C<T<-30°C:N=4(temperature efficiency=80%)Self-Discharge CompensationThe compensation isprogrammed for a nominal rate of*NAC per day,∗NAC per day,or disabled.the rate for within the 20°C–30°C temperature range(TMPGG=6x).This rate varies across8ranges from<10°C to>70°C,doublingwith each higher temperature step(10°C).See Table3. Digital Magnitude FilterThe bq2014H has a digital filter to eliminate charge and discharge counting below a set threshold.The threshold for both V SRD and V SRQ is250µV.8Table 3.Self-Discharge Compensationbq2014HError SummaryCapacity InaccurateThe LMD is susceptible to error on initialization or if no updates occur.On initialization,the LMD value in-cludes the error between the programmed full capacity and the actual capacity .This error is present until a valid discharge occurs and LMD is updated.(See the DCR description.)The other cause of LMD error is bat-tery wear-out.As the battery ages,the measured capac-ity must be adjusted to account for changes in actual battery capacity .A Capacity Inaccurate counter (CPI)is maintained and incremented each time a valid charge occurs (qualified by NAC;see the CPI register description).It is reset whenever LMD is updated from the DCR.The counter does not wrap around but stops counting at 255.The ca-pacity inaccurate flag (CI)is set if LMD has not been up-dated following 64valid charges.Current-Sensing ErrorTable 6shows the non-linearity and non-repeatability errors associated with the bq2014H current sensing.Table 7illustrates the current-sensing error as a func-tion of V OS .A digital filter prevents charge and dis-charge counts to the NAC register when V SRO is be-tween V SRQ and V SRD .Done InputA charge-control IC or a microcontroller uses the DONE input to communicate charge status to the bq2014H.When the DONE input is asserted high on charge com-pletion,the bq2014H sets NAC =LMD and VDQ =1.The DONE input should be maintained high as long as the charge controller or microcontroller keeps the bat-teries full;otherwise,the pin should be held low .Communicating with the bq2014HThe bq2014H includes a simple single-pin (HDQ plus re-turn)serial data interface.A host processor uses the in-terface to access various bq2014H registers.Battery characteristics may be easily monitored by adding a sin-gle contact to the battery pack.The open-drain HDQ pin on the bq2014H should be pulled up by the host sys-tem,or may be left floating if the serial interface is not used.The interface uses a command-based protocol,in which the host processor sends a command byte to the bq2014H.The command directs the bq2014H to either store the next eight bits of data received to a register specified by the command byte or output the eight bits of data specified by the command byte.(See Figure 4.)The communication protocol is asynchronous mand and data bytes consist of a stream of eight bits that have a maximum transmission rate of 5K bits/sec.The least-significant bit of a command or data byte is transmitted first.The protocol is simple enough that it can be implemented by most host proces-sors using either polled or interrupt processing.Data input from the bq2014H may be sampled using the pulse-width capture timers available on some microcon-trollers.If a communication error occurs (e.g.,t CYCB >250µs),the bq2014H should be sent a BREAK to reinitiate the serial interface.A BREAK is detected when the HDQ pin is driven to a logic-low state for a time,t B or greater.The HDQ pin should then be returned to its normal ready-high logic state for a time,t BR .The bq2014H is now ready to receive a command from the host proces-sor.9V OS (µV)Sense Resistor 2050100m Ω500.250.100.05%1000.500.200.10%1500.750.300.15%1800.900.360.18%Table 7.V OS -Related Current Sense Error(Current = 1A)Symbol ParameterTypical MaximumUnits NotesINL Integrated non-linearity error±2±4%Add 0.1% per °C above or below 25°C and 1% per volt above or below 4.25V .INRIntegrated non-repeatability error±1±2%Measurement repeatability given similar operating conditions.Table 6.bq2014H Current-Sensing Errorsbq2014HThe return-to-one data bit frame consists of three dis-tinct sections:1.The first section is used to start the transmissionby either the host or the bq2014H taking the HDQ pin to a logic-low state for a period,t STRH;B.2.The next section is the actual data transmission,where the data should be valid by a period,t DSU;B, after the negative edge used to start communica-tion.The data should be held for a period,t DH;DV, to allow the host or bq2014H to sample the data bit.3.The final section is used to stop the transmission byreturning the HDQ pin to a logic-high state by at least a period,t SSU;B,after the negative edge used to start communication.The final logic-high state should be until a period t CYCH;B,to allow time to en-sure that the bit transmission was stopped prop-erly.The timings for data and break communication are given in the serial communication timing speci-fication and illustration sections.Communication with the bq2014H is always performed with the bit transmitted first.Figure5shows an example of a communication sequence to read the bq2014H NACH register.bq2014H Command Code and RegistersThe bq2014H status registers are listed in Table8and de-scribed below.All registers are Read/Write in the bq2014H. Caution:When writing to bq2014H registers ensure that proper data are written.A write-verify read is recommended.Command CodeThe bq2014H latches the command code when eight valid command bits have been received by the bq2014H. The command code contains two fields:I W/R bitI Command addressThe W/R bit of the command code is used to select whether the received command is for a read or a write function:The W/R values areCommand Code Bits76543210W/R-------where W/R is0The bq2014H outputs the requested regis-ter contents specified by the address por-tion of command code.1The following eight bits should be writtento the register specified by the address por-tion of command code.The lower7-bit field of the command code contains the address portion of the register to be accessed:Command Code Bits76543210-AD6AD5AD4AD3AD2AD1AD0(LSB) Primary Status Flags Register(FLGS1)The FLGS1register(address=01h)contains the pri-mary bq2014H flags.The charge status flag(CHGS)is asserted when a valid charge rate is detected.Charge rate is deemed valid when V SRO>V SRQ.A V SRO of less than V SRQ or discharge activity clears CHGS.The CHGS values areFLGS1 Bits76543210 CHGS-------where CHGS is0Either discharge activity detected or V SRO ≤V SRQ1V SRO>V SRQThe battery replaced flag(BRP)is asserted whenever the bq2014H is reset either by application of V CC or by a serial port command.BRP is reset when either a valid charge action increments NAC to be equal to LMD,or a valid charge action is detected after the EDV1flag is as-serted.BRP=1signifies that the device has been reset. The BRP values areFLGS1 Bits76543210-BRP------where BRP is0Battery is charged until NAC=LMD or dis-charged until the EDV1 flag is asserted 1bq2014H is reset4-10 bq2014H分销商库存信息:TIBQ2014HSN BQ2014HSNTR BQ2014HSNTRG4 BQ2014HSNG4BQ2014HEVM-001。

08th 2009Spring Ch5 - VI Booch

08th 2009Spring Ch5 - VI Booch

宏观过程是增量式的。
XI’AN JIAOTONG UNIVERSITY
Booch 方法的两种过程 (续)
微观过程
微观过程由宏观过程中产生的场景流和体系结构来驱动。 微观过程反映单个开发者或小开发团队的日常活动。 微观过程同时适用于软件工程师和软件架构师。 微观过程有意模糊了分析与设计的界限。 微观过程的四个活动
XI’AN JIAOTONG UNIVERSITY
Booch 方法的六种图 (续)
类图 (续)
规格说明
规格说明的公共要素
名字 定义
类的规格说明 操作的规格说明
C lass nam e attributes operations() {constraints}
C la ss na m e a ttrib ute s o p e ra tio ns() { c o nstra ints}
Booch 方法的两种过程

宏观过程
宏观过程是微观过程的控制框架。 宏观过程主要关注风险和体系结构。 宏观过程反映整个开发团队的数周乃至数月活动。 宏观过程的五个活动
建立软件的核心需求(概念化) 建立系统期望行为的模型(分析) 创建实现时的体系结构(设计) 通过反复细化得到实现(演进) 管理交付后的演进(维护)
六种图
类图、对象图 交互图、状态迁移图 模块图、进程图
物理模型
XI’AN JIAOTONG UNIVERSITY
OOA/OOD,Grady Booch
Booch 方法概述 Booch 方法的两种过程 Booch 方法的四种模型 Booch 方法的六种图 Booch 方法小结
XI’AN JIAOTONG UNIVERSITY
Object name attributes active

UMD-PP99-037 hep-ph9810442 Gaugino Mass without Singlets

UMD-PP99-037 hep-ph9810442 Gaugino Mass without Singlets
October 21, 1998
Gaugino Mass without Singlets
hep-ph/9810442 v2 22 Oct 1998
CERN-TH/98-337 LBNL-42419 UCB-PTH-98/50 UMD-PP99-037 hep-ph/9810442
Gian F. Giudicey, Markus A. Lutyz, Hitoshi Murayama , and Riccardo Rattazziy yTheory Division, CERN Geneva, Switzerland z Department of Physics, University of Maryland College Park, Maryland 20742, USA Department of Physics, University of California Berkeley, California 94720, USA
This work was supported in part by the U.S. Department of Energy under Contracts DE-AC0376SF00098, in part by the National Science Foundation under grants PHY-95-14797 and PHY-9802551, and by the Alfred P. Sloan Foundation.
1 Introduction
Supersymmetry (SUSY) is arguably the most attractive mechanism to stabilize the hierarchy between the fundamental scale (e.g. the Planck scale M 1018 GeV) and the electroweak scale (MW 100 GeV). However, superpartners of the standardmodel particles have not been observed up to energies of order MW , so SUSY must be broken at or above the weak scale. The phenomenology of SUSY depends crucially on the mechanism of SUSY breaking and the way that SUSY breaking is communicated to the observable sector. Communication of SUSY-breaking e ects by supergravity (SUGRA) interactions is in some ways the most attractive scenario. In models of this type, SUSY is broken in a hidden sector and gravitational-strength interactions communicate SUSY breaking to the observable sector. The main advantage of this scenario lies in its theoretical appeal: the key ingredients are either present of necessity (e.g. SUGRA) or very wellmotivated (e.g. hidden sectors are generically present in string theories). The main disadvantage of this scenario is that at present there is no convincing explanation for the degeneracy of squark masses required to avoid large avor-changing neutral current e ects. In the context of string theory and SUGRA models with singlets, there are also cosmological problems related to the existence of uncharged elds with almost at potentials and interactions suppressed by powers of the Planck scale. In order to explain the origin of the SUSY breaking scale (and hence the weak scale) the most attractive scenario is that SUSY is broken dynamically 1, 2, 3]. In recent years, it has been found that this occurs in many asymptotically-free supersymmetric gauge theories. In these models, dimensional transmutation generates the hierarchy between the SUSY breaking scale SUSY and the Planck scale, and the SUSY-breaking masses are of order 2 =M . The most important challenge of SUSY constructing phenomenologically viable models of dynamical SUSY breaking in the hidden sector is generating su ciently large gaugino masses 3, 4]. In models without gauge singlets in the hidden sector, the gaugino mass is conventionally believed to be extremely suppressed, at most of order 3 =M 2 ' 1 keV. There have been a variSUSY ety of solutions discussed in the literature 5, 6, 7], all of which involve gauge singlets with SUSY-breaking VEV's, and require more or less complicated model-building. It is not at all clear whether any of these solutions can work in the context of string theory, where one singlet eld, the dilaton, couples to all gauge kinetic terms. Obtaining realistic gaugino masses in string theory therefore appears to require a large F component for the dilaton (in addition to the usual dilaton stabilization problem),

Spring4基本使用

Spring4基本使用

Spring4基本使⽤前⾔虽然现在基本上是 springboot 的天下了,但是传统的 spring4 在⼴⼤的软件企业中仍然占据很⼤⽐例。

⼀上⼿能⽤,但是要让我从⽆到有搭⼀个spring4的开发环境出来,可能会磕磕碰碰,耽误不少时间,所以这⾥从⽆到有搭⼀个 spring4的开发环境出来,⼀步步完善,也复习下 spring 的基本⽤法,温故知新。

创建maven项⽬,引⼊spring4的⼀些核⼼包和常⽤扩展包。

我⽤的是spring4最新版本4.3.24.RELEASEpom.xmlxml version="1.0" encoding="UTF-8"><project xmlns="/POM/4.0.0" xmlns:xsi="/2001/XMLSchema-instance"xsi:schemaLocation="/POM/4.0.0 /xsd/maven-4.0.0.xsd"><modelVersion>4.0.0</modelVersion><groupId>com.hz</groupId><artifactId>admin</artifactId><version>1.0-SNAPSHOT</version><packaging>war</packaging><name>admin Maven Webapp</name><properties><project.build.sourceEncoding>UTF-8</project.build.sourceEncoding><piler.source>1.8</piler.source><piler.target>1.8</piler.target><spring.version>4.3.24.RELEASE</spring.version><junit.version>4.11</junit.version><jackson.version>2.9.8</jackson.version></properties><dependencies><!-- junit 测试 --><dependency><groupId>junit</groupId><artifactId>junit</artifactId><version>${junit.version}</version><scope>test</scope></dependency><!--spring 常⽤模块依赖 start--><dependency><groupId>org.springframework</groupId><artifactId>spring-beans</artifactId><version>${spring.version}</version></dependency><dependency><groupId>org.springframework</groupId><artifactId>spring-core</artifactId><version>${spring.version}</version></dependency><dependency><groupId>org.springframework</groupId><artifactId>spring-context</artifactId><version>${spring.version}</version></dependency><dependency><groupId>org.springframework</groupId><artifactId>spring-context-support</artifactId><version>${spring.version}</version></dependency><dependency><groupId>org.springframework</groupId><artifactId>spring-aop</artifactId><version>${spring.version}</version></dependency><dependency><groupId>org.springframework</groupId><artifactId>spring-aspects</artifactId><version>${spring.version}</version></dependency><dependency><groupId>org.springframework</groupId><artifactId>spring-jdbc</artifactId><version>${spring.version}</version></dependency><dependency><groupId>org.springframework</groupId><artifactId>spring-test</artifactId><version>${spring.version}</version></dependency><dependency><groupId>org.springframework</groupId><artifactId>spring-tx</artifactId><version>${spring.version}</version></dependency><dependency><groupId>org.springframework</groupId><artifactId>spring-web</artifactId><version>${spring.version}</version><!-- spring 常⽤模块依赖 end --><!-- jackson json转换配置,配置--><!-- 这个配置对应 RequestParams, RequestBody, ResponseBody 等注解,原始请求参数其实都在 HttpServletRequest 对象⾥,但实际上我们⽤spring的时候可以直接在controller⽅法参数⾥得到请求数据,String,Integer, Map, List 和⾃定义bean这个转换就要⽤到这个包,不引⼊这个包,使⽤RequestBody注解就会报错--><dependency><groupId>com.fasterxml.jackson.core</groupId><artifactId>jackson-databind</artifactId><version>${jackson.version}</version></dependency><dependency><groupId>com.fasterxml.jackson.core</groupId><artifactId>jackson-core</artifactId><version>${jackson.version}</version></dependency><dependency><groupId>com.fasterxml.jackson.core</groupId><artifactId>jackson-annotations</artifactId><version>${jackson.version}</version></dependency><!-- spring MVC 依赖 start--><dependency><groupId>org.springframework</groupId><artifactId>spring-webmvc</artifactId><version>${spring.version}</version></dependency><!-- spring MVC 依赖 end--></dependencies><build><finalName>admin</finalName><pluginManagement><!-- lock down plugins versions to avoid using Maven defaults (may be moved to parent pom) --><plugins><plugin><artifactId>maven-clean-plugin</artifactId><version>3.1.0</version></plugin><!-- see /ref/current/maven-core/default-bindings.html#Plugin_bindings_for_war_packaging --><plugin><artifactId>maven-resources-plugin</artifactId><version>3.0.2</version></plugin><plugin><artifactId>maven-compiler-plugin</artifactId><version>3.8.0</version><configuration><source>${piler.source}</source><target>${piler.target}</target></configuration></plugin><plugin><artifactId>maven-surefire-plugin</artifactId><version>2.22.1</version></plugin><plugin><artifactId>maven-war-plugin</artifactId><version>3.2.2</version></plugin><plugin><artifactId>maven-install-plugin</artifactId><version>2.5.2</version></plugin><plugin><artifactId>maven-deploy-plugin</artifactId><version>2.8.2</version></plugin><!-- jetty 插件--><plugin><groupId>org.eclipse.jetty</groupId><artifactId>jetty-maven-plugin</artifactId><version>9.4.18.v20190429</version><configuration><httpConnector><port>8082</port> <!-- 监听的http 端⼝,默认8080 --></httpConnector><scanIntervalSeconds>2</scanIntervalSeconds><webApp><contextPath>/</contextPath></webApp></configuration></plugin></plugins></pluginManagement></build></project>配置web.xmlweb.xml⽂件是web项⽬的启动⽂件,要想在web项⽬中使⽤spring,需要在这⾥配置spring<!DOCTYPE web-app PUBLIC"-//Sun Microsystems, Inc.//DTD Web Application 2.3//EN""/dtd/web-app_2_3.dtd" ><web-app><display-name>Archetype Created Web Application</display-name><!-- spring配置⽂件位置--><context-param><param-name>contextConfigLocation</param-name><param-value>classpath:/spring.xml</param-value> <!-- 这个⽂件主要配置spring beans,包括数据源,事务控制<!-- 启动web时加载spring的配置⽂件 --><listener><listener-class>org.springframework.web.context.ContextLoaderListener</listener-class></listener><!-- 添加springMVC⽀持,单独springMVC时也需要在web.xml⽂件中配置 --><servlet><servlet-name>dispatcher</servlet-name><servlet-class>org.springframework.web.servlet.DispatcherServlet</servlet-class><init-param><param-name>contextConfigLocation</param-name><param-value>classpath:/spring/spring-mvc.xml</param-value> <!-- spring-mvc.xml 主要配置mvc⽅⾯,包括controller注解扫描,视图解析器, controller参数绑定(这⾥就要⽤到pom⾥的jackson json依赖) --> </init-param><!-- 启动web时就加载springmvc的servlet,即启动时就加载springmvc的配置⽂件 --><load-on-startup>1</load-on-startup></servlet><servlet-mapping><servlet-name>dispatcher</servlet-name><!-- 拦截所有请求 --><url-pattern>/</url-pattern></servlet-mapping><welcome-file-list><!--指定欢迎页⾯--><welcome-file>login.html</welcome-file></welcome-file-list><error-page> <!--当系统出现404错误,跳转到页⾯nopage.html--><error-code>404</error-code><location>/nopage.html</location></error-page><error-page> <!--当系统出现ng.NullPointerException,跳转到页⾯error.html--><exception-type>ng.NullPointerException</exception-type><location>/error.html</location></error-page><session-config><!--会话超时配置,单位分钟--><session-timeout>360</session-timeout></session-config></web-app>配置mvcspring-mvc.xml<?xml version="1.0" encoding="UTF-8"?><beans xmlns="/schema/beans"xmlns:xsi="/2001/XMLSchema-instance"xmlns:context="/schema/context"xmlns:mvc="/schema/mvc"xmlns:p="/schema/p"xsi:schemaLocation="/schema/beans /schema/beans/spring-beans.xsd/schema/context /schema/context/spring-context-4.1.xsd/schema/mvc /schema/mvc/spring-mvc-4.1.xsd"><!-- spring扫描的包 --><context:component-scan base-package="com.hz.*.controller"/><!-- DispatcherServlet不处理静态资源,交给服务器默认的servlet处理 --><mvc:default-servlet-handler /><!-- 启⽤annotation --><mvc:annotation-driven /><!--json转换器配置, @ResponseBody,RequestBody 将请求参数转换成bean需要这个类 --><bean id="mappingJacksonHttpMessageConverter"class="org.springframework.http.converter.json.MappingJackson2HttpMessageConverter"><property name="supportedMediaTypes"><list><value>text/html;charset=UTF-8</value></list></property></bean><!-- 视图渲染器 ,如果搭建REST Web应⽤,可以不配置这个,具体REST-Web应⽤配置,后⾯再讲--><!-- 视图xxx 将对应访问/WEB-INF/page/xxx.jsp⽂件 --><bean class="org.springframework.web.servlet.view.InternalResourceViewResolver"id="internalResourceViewResolver"><!-- 前缀 --><property name="prefix" value="/WEB-INF/page/" /><!-- 后缀 --><property name="suffix" value=".jsp" /></bean></beans>项⽬结构测试Controllerpackage mon.controller;import org.springframework.stereotype.Controller;import org.springframework.web.bind.annotation.RequestMapping;import org.springframework.web.bind.annotation.ResponseBody;import java.util.HashMap;import java.util.Map;@Controller()@RequestMapping("test")public class TestController {@RequestMapping("/info")@ResponseBodypublic Object test(Integer val){// contentType=application/x-www-form-urlencoded System.out.println(val == null ? "null" : val.toString()); HashMap<String, Object> map = new HashMap<>(); map.put("prop", "value");map.put("prop1", "value1");return map;}}postman测试。

FAIRCHILD

FAIRCHILD

74AC04, 74ACT04 Hex Inverter74AC04, 74ACT04 Hex InverterAbsolute Maximum RatingsStresses exceeding the absolute maximum ratings may damage the device. The device may not function or beoperable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only.Recommended Operating ConditionsThe Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend exceeding them or designing to absolute maximum ratings.Symbol ParameterRatingV CC Supply Voltage –0.5V to +7.0VI IKDC Input Diode Current V I = –0.5V V I = V CC + 0.5V–20mA +20mAV I DC Input Voltage –0.5V to V CC + 0.5VI OKDC Output Diode Current V O = –0.5V V O = V CC + 0.5V–20mA +20mAV O DC Output Voltage–0.5V to V CC + 0.5VI O DC Output Source or Sink Current ±50mA I CC or I GND DC V CC or Ground Current per Output Pin±50mAT STG Storage Temperature –65°C to +150°CT JJunction Temperature PDIP140°CSymbol ParameterRatingV CCSupply Voltage AC ACT2.0V to 6.0V 4.5V to 5.5V V I Input Voltage 0V to V CC V O Output Voltage 0V to V CCT A Operating Temperature–40°C to +85°C∆ V / ∆ t Minimum Input Edge Rate, AC Devices:V IN from 30% to 70% of V CC , V CC@ 3.3V , 4.5V , 5.5V 125mV/ns ∆V / ∆ tMinimum Input Edge Rate, ACT Devices: V IN from 0.8V to 2.0V , V CC@ 4.5V , 5.5V125mV/ns74AC04, 74ACT04 Hex InverterDC Electrical Characteristics for ACNotes:1.All outputs loaded; thresholds on input associated with output under test.2.Maximum test duration 2.0ms, one output loaded at a time.3.I IN and I CC @ 3.0V are guaranteed to be less than or equal to the respective limit @ 5.5V V CC .SymbolParameterV CC (V)ConditionsT A = +25°CT A = –40°C to +85°CUnitsTyp.Guaranteed LimitsV IHMinimum HIGH Level Input Voltage3.0V OUT = 0.1V or V CC – 0.1V1.52.12.1V4.5 2.25 3.15 3.155.5 2.75 3.85 3.85V ILMaximum LOW Level Input Voltage3.0V OUT = 0.1V or V CC – 0.1V1.50.90.9V4.5 2.25 1.35 1.355.5 2.75 1.65 1.65V OHMinimum HIGH Level Output Voltage3.0I OUT = –50µA2.99 2.9 2.9V 4.5 4.49 4.4 4.45.55.495.4 5.4V IN = V IL or V IH :3.0I OH = –12mA 2.56 2.464.5I OH = –24mA 3.86 3.765.5I OH = –24mA (1) 4.864.76V OLMaximum LOW Level Output Voltage3.0I OUT = 50µA0.0020.10.1V 4.50.0010.10.15.50.0010.10.1V IN = V IL or V IH3.0I OL = 12mA 0.360.444.5I OL = 24mA 0.360.445.5I OL = 24mA (1) 0.360.44I IN (3) Maximum Input Leakage Current 5.5V I = V CC , GND ±0.1±1.0µA I OLD Minimum Dynamic Output Current (2) 5.5V OLD = 1.65V Max.75mA I OHD 5.5V OHD = 3.85V Min.–75mA I CC (3)Maximum Quiescent Supply Current5.5V IN = V CCor GND2.020.0µA74AC04, 74ACT04 Hex InverterDC Electrical Characteristics for ACTNotes:4.All outputs loaded; thresholds on input associated with output under test.5.Maximum test duration 2.0ms, one output loaded at a time.SymbolParameterV CC (V)ConditionsT A = +25°CT A= –40°C to +85°C UnitsTyp.Guaranteed LimitsV IH Minimum HIGH Level Input Voltage 4.5V OUT = 0.1V or V CC – 0.1V 1.5 2.0 2.0V 5.5 1.5 2.0 2.0V IL Maximum LOW Level Input Voltage 4.5V OUT = 0.1V or V CC – 0.1V 1.50.80.8V 5.5 1.50.80.8V OHMinimum HIGH Level Output Voltage4.5I OUT = –50µA 4.49 4.4 4.4V5.55.495.4 5.4V IN = V IL or V IH :4.5I OH = –24mA 3.86 3.765.5I OH = –24mA (4) 4.864.76V OLMaximum LOW Level Output Voltage4.5I OUT = 50µA 0.0010.10.1V5.50.0010.10.1V IN = V IL or V IH :4.5I OL = 24mA 0.360.445.5I OL = 24mA (4)0.360.44I IN Maximum Input Leakage Current 5.5V I = V CC , GND ±0.1±1.0µA I CCT Maximum I CC /Input 5.5V I = V CC – 2.1V 0.61.5mA I OLD Minimum Dynamic Output Current (5) 5.5V OLD = 1.65V Max.75mA I OHD 5.5V OHD = 3.85V Min.–75mA I CCMaximum Quiescent Supply Current5.5V IN = V CC or GND4.040.0µA74AC04, 74ACT04 Hex InverterAC Electrical Characteristics for ACNote:6.Voltage range 3.3 is 3.3V ± 0.3V. Voltage range 5.0 is 5.0V ± 0.5V.AC Electrical Characteristics for ACTNote:7.Voltage range 5.0 is 5.0V ± 0.5V.CapacitanceSymbolParameterV CC (V)(6)T A = +25°C,C L = 50pFT A = –40°C to +85°C,C L = 50pF UnitsMin.Typ.Max.Min.Max.t PLH Propagation Delay 3.3 1.5 4.59.0 1.010.0ns 5.0 1.5 4.07.0 1.07.5t PHLPropagation Delay3.3 1.54.58.5 1.09.5ns5.01.53.56.51.07.0SymbolParameterV CC (V)(7)T A = +25°C,C L = 50pFT A = –40°C to +85°C,C L = 50pF UnitsMin.Typ.Max.Min.Max.t PLH Propagation Delay 5.0 1.0 6.08.5 1.09.0ns t PHLPropagation Delay5.01.05.58.01.08.5nsSymbolParameterConditionsTyp.UnitsC IN Input CapacitanceV CC = OPEN 4.5pF V CCPower Dissipation CapacitanceV CC = 5.0V30.0pFFigure 4. 14-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" WidePackage Number N14A74AC04, 74ACT04 Hex InverterThe following are registered and unregistered trademarks and service marks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks.ACEx ®Build it Now ™CorePLUS ™CROSSVOLT ™CTL™Current Transfer Logic™EcoSPARK ®®Fairchild ®Fairchild Semiconductor ®FACT Quiet Series™FACT ®FAST ®FastvCore ™FPS ™FRFET ®Global Power Resource SMGreen FPS ™Green FPS ™e-Series ™GTO ™i-Lo ™IntelliMAX ™ISOPLANAR ™MegaBuck™MICROCOUPLER ™MicroFET ™MicroPak ™MillerDrive™Motion-SPM™OPTOLOGIC ®OPTOPLANAR ®®PDP-SPM™Power220®Power247®POWEREDGE ®Power-SPM ™PowerTrench ®Programmable Active Droop ™QFET ®QS ™QT Optoelectronics ™Quiet Series ™RapidConfigure ™SMART START ™SPM ®STEALTH™SuperFET ™SuperSOT ™-3SuperSOT ™-6SuperSOT ™-8SyncFET™The Power Franchise ®TinyBoost ™TinyBuck ™TinyLogic ®TINYOPTO ™TinyPower ™TinyPWM ™TinyWire ™µSerDes ™UHC ®UniFET ™VCX ™DISCLAIMERFAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY,FUNCTION,OR DESIGN.FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN;NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS,NOR THE RIGHTS OF OTHERS.THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS,SPECIFICALLY THE WARRANTY THEREIN,WHICH COVERS THESE PRODUCTS.LIFE SUPPORT POLICYFAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.As used herein:1.Life support devices or systems are devices or systems which,(a)are intended for surgical implant into the body or (b)support or sustain life,and (c)whose failure to perform when properly used in accordance with instructions for use provided in the labeling,can be reasonably expected to result in a significant injury of the user.2.A critical component in any component of a life support,device,or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system,or to affect its safety or effectiveness.PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Product Status DefinitionAdvance Information Formative or In Design This datasheet contains the design specifications for productdevelopment.Specifications may change in any manner without notice.PreliminaryFirst ProductionThis datasheet contains preliminary data;supplementary data will be published at a later date.Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design.No Identification Needed Full ProductionThis datasheet contains final specifications.Fairchild Semiconductor。

AEC_Q002_Rev_A

AEC_Q002_Rev_A

AEC - Q002 Rev AAugust 25, 2000GUIDELINESFORSTATISTICAL YIELDANALYSISComponent Technical CommitteeAutomotive Electronics CouncilAEC - Q002 Rev AAugust 25, 2000 Automotive Electronics CouncilComponent Technical CommitteeAcknowledgmentAny document involving a complex technology brings together material and skills from many sources. The Automotive Electronics Council would especially like to recognize the following significant contributors to the development of this revision of this document:Majdi Mortazavi DaimlerChrysler (256)464-2249 msm11@Brian Jendro DaimlerChrysler (256)464-2980 bj5@Robert V. Knoell Visteon Corporation (313)248-1116 rknoell@Gerald E. Servais Delphi Delco Electronics Systems (765)451-7923 gerald.e.servais@Kevin Hankins Delphi Delco Electronics Systems (765)451-7670 kevin.t.hankins@Nick Lycoudes Motorola (408)413-3343 raqa01@Philippe Briot PSA, Peugeot, Citroën 33 01 41 36 7849 p-briot@calvanet.calvacom.frMark Gabrielle On Semiconductor (602)244-3115 mark.gabrielle@Component Technical CommitteeGUIDELINES FOR STATISTICAL YIELD ANALYSIS Text enhancements and changes made since the last revision of thisdocument are shown as underlined areas1.SCOPEThis guideline is intended for use as a method for detecting and removing abnormal lots of material and thus ensuring the quality and reliability of the ICs supplied as meeting AEC - Q100 or 101. The principles described in this guideline are applicable to packaged or unpackaged die.1.1PurposeThis guideline describes a method, utilizing statistical techniques, of identifying a wafer, wafer lot or assembly lot that exhibits an unusually low yield or an unusually high bin failure rate. Experience has shown that wafer and assembly lots exhibiting these abnormal characteristics tend to havegenerally poor quality and can result in significant system reliability and quality problems.Note: For best statistical yield limits (SYL) and statistical bin limits (SBL) results, use test limitsbased on PAT Limits as described in AEC Q001.1.2 ReferencesAEC - Q001 Guidelines For Part Average TestingAEC - Q100 Stress Test Qualification For Integrated CircuitsAEC - Q101 Stress Test Qualification For Discrete Semiconductors2.DEFINITIONS2.1PAT LimitsPart average test limits established per AEC - Q001.3.METHOD FOR ESTABLISHING STATISTICAL YIELD LIMITS (SYL) AND STATISTICAL BINLIMITS (SBL)3.1Detailed Description For Basic Wafer / Wafer Lot / Assembly Lot Level Yield LimitsCollect data from at least six lots and determine the mean and sigma value for the percentage ofdevices passing per lot and the percentage of devices failing each bin-out per lot (lot as used here could mean each wafer, a wafer lot or an assembly lot). Early in production of a part, when dataComponent Technical Committeefrom six lots is not available, data from characterization/matrix lots may be used. This data shallbe updated as soon as production data is available. This early data shall be reviewed and updated using current data at least every 30 days during the first 6 months of production. The current data used shall include the data available since the last update or at least the last 8 lots. Older data shall not be used. After the first 6 months of production the limits shall be updated on a quarterly (every3 months) basis. With this data determine the SYL and SBL (both on a wafer, wafer lot andassembly lot basis) as follows:SYL1 = Mean - 3 SigmaSBL1 = Mean + 3 SigmaSYL2 =Mean - 4 SigmaSBL2 = Mean + 4 SigmaAny wafer or lots that fall below SYL1 or exceed SBL1 shall be held for engineering review. Inaddition, lots that fall below SYL2 or exceed SBL2 may be impounded and require customernotification before release, if specified in the applicable procurement document. Analysis shall be performed on failures to determine the failure mechanism(s) causing these abnormal failure rates.3.2RecordsThe supplier shall maintain records on all wafers, wafer lots and assembly lots that fall below SYL1 or exceed SBL1. This data shall include the root cause for the yield problem and corrective action taken to prevent reoccurrence of the problem. It should also include any special testing or screens that were performed on the wafer, wafer lot or assembly lot and the customer that approved theshipment of the parts in question.4. CUSTOMER NOTIFICATION4.1Procedure For Customer NotificationBefore the customer is notified, the supplier shall have determined the failure mechanism(s) and,based on his experience, determine the corrective action required to prevent a reoccurrence of the condition in future product. The supplier shall also present data on a reasonable expectation of the seriousness of the failure mechanism(s) and it’s impact on quality and reliability. Included in this data should be a plan for additional tests and screens which could provide the user with reasonable certainty that the product he receives will be at least equal to normal product.4.2Customer ResponseThe customer reserves the right to reject material that falls below SYL2 or exceeds SBL2 if thesupplier data does not satisfy his concerns about the quality and reliability of the product.4.3 If Customer Is Not KnownIf the supplier does not know who the customer is and customer approval can not be obtained, the parts from the lots in question (lots falling below SYL2 or exceeding SBL2) shall not be supplied to distributors as meeting AEC - Q100 or Q101.Component Technical CommitteeRevision HistoryRev #Date of change Brief summary listing affected paragraph-July 31, 1997Initial releaseA Aug. 25, 2000Added Paragraph 1.2, Paragraph 1, 2.1, and 4.3 revised.。

LEE Spring零件编号指南

LEE Spring零件编号指南
HEFTY™ 模具弹簧概述 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . HEFTY™ 中负荷系列 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . HEFTY™ 中负荷+系列 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . HEFTY™ 中等重负荷系列 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . HEFTY™ 重负荷系列 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . HEFTY™ 超重负荷系列 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 仪表系列(英制) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 仪表系列(公制) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 标准系列(英制) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 标准系列(公制) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121 122 124 126 128 130 133 137 139 165

notifier - rp-2002(e) agent release control panel

notifier - rp-2002(e) agent release control panel

RP-2002(E)Agent Release Control PanelDN-60240:C3R P 2002.j p gGeneralThe RP-2002 is a six-zone FACP for single and dual hazard agent releasing applications. The RP-2002 provides reliable fire detection, signaling and protection for commercial, indus-trial and institutional buildings requiring agent-based releasing.The RP-2002 is compatible with System Sensor’s i 3 detectors which are conventional smoke detectors that can transmit a maintenance trouble signal to the FACP indicating the need for cleaning and a supervisory ‘freeze’ signal when the ambient temperature falls below the detector rating of approximately 45°F (7.22°C). In addition, the control panel is compatible with conventional input devices such as two-wire smoke detectors,four-wire smoke detectors, pull stations, waterflow devices,tamper switches and other normally-open contact devices.Refer to the Notifier Device Compatibility Document for a com-plete listing of compatible devices.Four outputs are programmable as NACs (Notification Appli-ance Circuits) or releasing circuits. Three programmable Form-C relays (factory programmed for Alarm, Trouble and Supervisory) and 24 VDC special application resettable and non-resettable power outputs are also included on the main circuit board. The RP-2002 supervises all wiring, AC voltage,battery charger and battery level.Activation of a compatible smoke detector or any normally-open fire alarm initiating device will activate audible and visual signaling devices, illuminate an indicator, display alarm infor-mation on the panel’s LCD, sound the piezo sounder at the FACP , activate the FACP alarm relay and operate an optional module used to notify a remote station or initiate an auxiliary control function.The RP-2002E offers the same features as the RP-2002 but allows connection to 220/240 VAC. Unless otherwise speci-fied, the information in this data sheet applies to both the 110/120 VAC and 220/240 VAC versions of the panels.Features•Listed to UL Standard 864, 9th edition.•FM Approved.•Designed for agent releasing standards NFPA 12, 12A,12B, and 2001.•Meets International Building Code (IBC) seismic require-ments.•Disable/Enable control per input zone and output zone.•Extensive transient protection.•Dual hazard operation.•Adjustable pre-discharge, discharge and waterflow delay timers.•Cross-zone (double-interlock) capability.•Six programmable Style B (Class B) IDCs (Initiating Device Circuit).•System Sensor i 3 series detector compatible.•Four programmable Style Y (Class B) output circuits - (spe-cial application power).•Strobe synchronization:–System Sensor –Wheelock–Gentex –Faraday –Amseco•Three programmable Form-C relays.•7.0 amps total 24 VDC output current.•Resettable and non-resettable output power.•Built-in Programmer.•ANN-BUS connector for communication with optional devices (up to 8 total of any of the following):–N-ANN-80 Remote LCD Annunciator –N-ANN-I/O LED Driver–N-ANN-S/PG Printer Modules –N-ANN-RLY Relay Module–N-ANN-LED Annunciator Module •80-character LCD display (backlit).•Real-time clock/calendar with daylight savings time control.•History log with 256 event storage.•Piezo sounder for alarm, trouble and supervisory.•24 volt operation.•Low AC voltage sense.•Outputs Programmable for:–Releasing Circuits or NACS •NACs programmable for:–Silence Inhibit –Auto-Silence–Strobe Synchronization–Selective Silence (horn-strobe mute)–Temporal or Steady Signal–Silenceable or Non-silenceable –Release Stage Sounder•Automatic battery charger with charger supervision.•Optional Dress Panel DP-51050 (red).•Optional Trim Ring TR-CE (red) for semi-flush mounting the cabinet.•Optional N-CAC-5X Class A Converter Module for Outputs and IDCs.•Optional 4XTM Municipal Box Transmitter Module.•Optional Digital Alarm Communicators (411, 411UD, 411UDAC).•Optional ANN-SEC card for a secondary ANN-BUS.PROGRAMMING AND SOFTWARE:•Custom English labels (per point) may be manually entered or selected from an internal library file.•Programmable Abort operation.•Three programmable Form-C relay outputs.•Pre-programmed and custom application templates.•Continuous fire protection during online programming at the front panel.•Program Check automatically catches common errors not linked to any zone or input point.USER INTERFACE:•Integral 80-character LCD display with backlighting.•Real-time clock/calendar with automatic daylight savings adjustments.•ANN-Bus for connection to remote annunciators.•Audible or silent walk test capabilities.•Piezo sounder for alarm, trouble, and supervisory. Controls and IndicatorsLED INDICATORS•FIRE ALARM (red)•SUPERVISORY (yellow)•TROUBLE (yellow)•AC POWER (green)•ALARM SILENCED (yellow)•DISCHARGED (red)•PRE-DISCHARGE (red indicator)•ABORT (yellow indicator)CONTROL BUTTONS•ACKNOWLEDGE•ALARM SILENCE•SYSTEM RESET (lamp test)•DRILLAC Power – TB1•RP-2002: 120 VAC, 60 Hz, 3.66 amps.•RP-2002E: 240 VAC, 50/60 Hz, 2.085 amps.•Wire size: minimum #14 AWG (2.0 mm2) with 600V insula-tion.•Supervised, nonpower-limited.Battery (sealed lead acid only) – J12:•Maximum Charging Circuit - Normal Flat Charge: 27.6 **********.Supervised,nonpower-limited.•Maximum Charger Capacity: 26 Amp Hour battery (two18 Amp Hour batteries can be housed in the FACP cabinet.Larger batteries require separate battery box such as the BB-26 or NFS-LBBR).•Minimum Battery Size: 7 Amp Hour.Initiating Device Circuits - TB4 and TB6•Zones 1 - 5 on TB4.•Zone 6 on TB6.•Supervised and power-limited circuitry.•Style B (Class B) wiring with Style D (Class A) option.•Normal Operating Voltage: Nominal 20 VDC.•Alarm Current: 15 mA minimum.•Short Circuit Current: 40 mA max.•Maximum Loop Resistance: 100 Ohms.•End-of-Line Resistor: 4.7K Ohms, 1/2 watt (PN 71252).•Standby Current: 4 mA.Refer to the Notifier Device Compatibility Document for listed compatible devices.Notification Appliance and Releasing Circuit(s) - TB5 and TB7•Four Output Circuits.•Style Y (Class B) or Style Z (Class A) with optional con-verter module.•Special Application power.•Supervised and power-limited circuitry.•Normal Operating Voltage: Nominal 24 VDC.•Maximum Signaling Current: 7.0 amps (3.0 amps special application, 300 mA regulated maximum per NAC).•End-of-Line Resistor: 4.7K Ohms, 1/2 watt (PN 71252).•Max. Wiring Voltage Drop: 2 VDC.Refer to the Notifier Device Compatibility Document for com-patible listed devices.Form-C Relays - Programmable - TB8•Relay 1 (factory default programmed as Alarm Relay)•Relay 2 (factory default programmed as fail-safe Trouble Relay)•Relay 3 (factory default programmed as Supervisory Relay)•Relay Contact Ratings:–2 amps @ 30 VDC (resistive)–0.5 amps @ 30 VAC (resistive)Auxiliary Trouble Input – J6The Auxiliary Trouble Input is an open collector circuit which can be used to monitor external devices for trouble conditions. It can be connected to the trouble bus of a peripheral, such as a power supply, which is compatible with open collector cir-cuits.Special Application Resettable Power - TB9•Operating Voltage: Nominal 24 VDC.•Maximum Available Current: 500 mA - appropriate for powering 4-wire smoke detectors (see note).•Power-limited Circuitry.Refer to the Notifier Device Compatibility Document for com-patible listed devices.NOTE: Total current for resettable power, nonresettable power and Output Circuits must not exceed 7.0 amps.Special Application Resettable or Nonresettable Power -TB9•Operating Voltage: Nominal 24 VDC.•Maximum Available Current: 500 mA (see note 1).•Power-limited Circuitry.•Jumper selectable by JP31 for resettable or nonresettable power.Refer to the Notifier Device Compatibility Document for com-patible listed devices.Product Line InformationRP-2002: Six-zone, 24 volt Agent Release Control Panel (includes backbox, power supply, technical manual, and a frame & post operating instruction sheet) for single and dual hazard agent releasing applications.RP-2002E: Same as above but allows connection to 220/240 VAC.N-CAC-5X: Class A Converter Module can be used to convert the Style B (Class B) Initiating Device Circuits to Style D (Class A) and Style Y (Class B) Output Circuits to Style Z (Class A). NOTE: Two Class A Converter modules are required to convert all four Output Circuits and six Initiating Device Circuits.4XTM: Transmitter Module provides a supervised output for local energy municipal box transmitter and alarm and trouble reverse polarity. It includes a disable switch and disable trou-ble LED.N-ANN-80(-W): LCD Annunciator is a remote LCD annuncia-tor that mimics the information displayed on the FACP LCD display. Recommended wire type is un-shielded. (Basic model is black; order -W version for white; s ee DN-7114.)N-ANN-LED: Annunciator Module provides three LEDs for each zone: Alarm, Trouble and Supervisory. Ships with red or black enclosure (see DN-60242).N-ANN-RLED: Provides alarm (red) indicators for up to 30 input zones or addressable points. (See DN-60242).N-ANN-RLY: Relay Module, which can be mounted inside or outside the cabinet, provides 10 programmable Form-C relays. (See DN-7107).N-ANN-S/PG: Serial/Parallel Printer Gateway module pro-vides a connection for a serial or parallel printer. (See DN-7103).N-ANN-I/O: LED Driver Module provides connections to a user supplied graphic annunciator. (See DN-7105).ANN-SEC: Optional card for a secondary ANN-BUS. See #53944.NBG-12LR: Agent Release Pull Stations designed for use with Notifier Fire Alarm Control Panels with releasing capabili-ties.DP-51050: Dress panel (red) is available as an option. The dress panel restricts access to the system wiring while allow-ing access to the membrane switch panel.TR-CE: Trim-ring (red) is available as an option. The trim-ring allows semi-flushing mounting of the cabinet.BB-26: Battery box, holds up to two 26 Amp Hour batteries and CHG-75.NFS-LBBR: Battery box, houses two 55 Amp Hour batteries, red.SEISKIT-COMMENC: Seismic mounting kit; required for seis-mic-certified installations.BAT Series Batteries: Refer to DN-6933.PRN-6: UL-listed compatible event printer. Dot-matrix, tractor-fed paper, 120 VAC.PRN-7: UL-listed compatible event printer. Dot-matrix, tractor-fed paper, 120 VAC.PRT-PK-CABLE: Programming cable. Used to update the FACP’s flash firmware. (Also requires an RS485 to RS232 converter).System Capacity•Annunciators (8)Electrical Specifications•RP-2002 (FLPS-7 Power Supply): 120 VAC, 60 Hz, 3.66amps•RP-2002E (FLPS-7 Power Supply): 240 VAC, 50/60 Hz,2.085 amps•Wire size: minimum 14 AWG (2.0 mm²) with 600 V insula-tion, supervised, nonpower-limitedCabinet SpecificationsDoor: 19.26" (48.92 cm.) high x 16.82" (42.73 cm.) wide x 0.72" (1.82 cm.) deep. Backbox: 19.00" (48.26 cm.) high x 16.65" (42.29 cm.) wide x 5.25" (13.34 cm.) deep. Trim Ring (TR- CE): 22.00" (55.88 cm.) high x 19.65" (49.91 cm.) wide.Shipping SpecificationsWeight: 24.05 lbs. (10.9 kg)Dimensions:–Height 20.00" (50.80cm)–Width 22.50" (57.15cm)–Depth 8.50" (21.59cm)Temperature and Humidity RangesThis system meets NFPA requirements for operation at 0 –49°C/32 – 120°F and at a relative humidity 93% ± 2% RH (noncondensing) at 32°C ± 2°C (90°F ± 3°F). However, the useful life of the system's standby batteries and the electronic components may be adversely affected by extreme tempera-ture ranges and humidity. Therefore, it is recommended that this system and its peripherals be installed in an environment with a normal room temperature of 15 – 27°C/60 – 80°F.NFPA StandardsThe RP-2002(E) complies with the following NFPA 72 Fire Alarm Systems requirements:–NFPA 12 CO 2 Extinguishing Systems–NFPA 12A Halon 1301 Extinguishing Systems –NFPA 12B Halon 1211 Extinguishing Systems–NFPA 72 National Fire Alarm Code for Local Fire Alarm Systems and Remote Station Fire Alarm Systems (requires an optional Remote Station Output Module)–NFPA 2001 Clean Agent Fire Extinguishing SystemsAgency Listings and ApprovalsThe listings and approvals below apply to the basic RP-2002(E) control panels. In some cases, certain modules may not be listed by certain approval agencies, or listing may be in process. Consult factory for latest listing status. •UL: S635•FM approved•CSFM: 7165-0028:0245•MEA: 333-07-E•Seismic Listing: Reference certificiate of compliance VMA - 45894-01 by the VMC GroupNOTE: For ULC-listed model, see DN-60444.NOTIFIER® and System Sensor® are registered trademarks of Honeywell International Inc.©2017 by Honeywell International Inc. All rights reserved. Unauthorized useof this document is strictly prohibited.This document is not intended to be used for installation purposes. We try to keep our product information up-to-date and accurate. We cannot cover all specific applications or anticipate all requirements.All specifications are subject to change without notice.For more information, contact Notifier. Phone: (203) 484-7161, FAX: (203) 484-7118.SYSTEM SPECIFICATIONS。

奥林巴斯CHD型生物显微镜使用说明书

奥林巴斯CHD型生物显微镜使用说明书
. . Tension Adjustment of the Coarse Adjustment Knobs
III Locking of the Pre-focusing Lever 1m Use of Immersion Objectives
6. OPTICAL DATA
7. TROUBLE SHOOTING
@ Do not disassemble any part of microscope, since the integrated performance may be impaired.
@ When not in use, the microscope should be covered with the dust cover provided or contained in a storage case, and kept in a place free from humidity and mold.
fJ Main18nance and .;;.Sto..;..ra
_
CD Use a clean brush or lens tissue paper to clean the lens surfaces. If the lens surfaces are soiled with oil or
fingerprints, wipe them off carefully with gauze moistened with a small amount of alcohol and ether (3: 7) solution, or xylene.
1) Insert the screw into a flat washer and one of the two holes (8 mm dia.) in the base plate of the case as illustrated at the right.

BS4464-1969

BS4464-1969

This British Standard, having been approved by the Mechanical Engineering Industry Standards Committee, was published under the authority of the Executive Board on 19th May, 1969 © BSI 04-1999 The following BSI references relate to the work on this standard: Committee reference MEE/134 Draft for comment 68/22810 ISBN 580 05289 3
© BS 04-1999
i
BS 4464:1969
Foreword
A complete list of British Standards, numbering over 9,000, fully indexed and with a note of the contents of each, will be found in the BSI Catalogue which may be purchased from BSI Sales Department. The Catalogue may be consulted in many public libraries and similar institutions. This standard makes reference to the following British Standards: BS 21, Pipe threads. BS 427, Method for Vickers hardness test. BS 860, Tables for comparison of hardness scales. BS 970, Wrought steels in the form of bars, billets and forgings up to 6 in, ruling section for automobile and general engineering purposes. En series. BS 1449, Steel plate, sheet and strip. BS 1580, Unified screw threads. BS 1706, Electroplated coatings of cadmium and zinc on iron and steel. BS 1802, Steel spring washers for general engineering and automobile purposes. BS 2061, Phosphor bronze spring washers for general engineering purposes. BS 2870, Rolled copper and copper alloys. Sheet, strip and foil. BS 2873, Copper and copper alloys. Wire. BS 3643, ISO metric screw threads. BS 9001, Sampling procedures and tables for inspection by attributes for electronic parts of assessed quality. This British Standard Specification has been prepared under the authority of the Mechanical Engineering Industry Standards Committee as a result of the decision taken to adopt the ISO metric screw thread system in the United Kingdom (see Appendix A), and requests received from industry for the provision of a standard for metric series spring washers for general engineering and automobile purposes. Although at present there are no ISO Recommendations or draft Recommendations relating specifically to spring washers, account has been taken of current documentation being considered by ISO Committee ISO/TC 2, “Bolts, nuts and accessories”, and the following metric standards: German Standard DIN 127, “Spring washers” (rectangular section). German Standard DIN 7980, “Lock washers for fillister head cap screws” (square section). Indian Standard IS: 3063, “Spring washers for bolts, nuts and screws”. A rationalized selection of ISO metric nominal sizes have been included in this specification, for use where appropriate with products manufactured to the metric threaded fastener standards listed in Appendix B. The tolerances adapted in this specification are similar to those utilized in the above-mentioned German Standards, with the exception of the limiting dimensions for the inside diameter (d1). Concern has been expressed in British industry on the danger of spring washer failure due to “opening-out” under load, when the clearance between the inside diameter of the washer and the nominal thread size is too great. Accordingly it was decided to reduce the limiting dimensions and tolerances for the inside diameter compared with those quoted in the specifications listed above. Account has also been taken of the current British Standards (BS 18021) and BS 20612)), which deal with inch series products, and it was decided in this case to prepare a single specification covering mainly the dimensional and functional aspects of metric series spring washers, rather than a series of separate specifications differing only with regard to material requirements.

374体育

374体育

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jstd035声学扫描

jstd035声学扫描

JOINT INDUSTRY STANDARDAcoustic Microscopy for Non-HermeticEncapsulatedElectronicComponents IPC/JEDEC J-STD-035APRIL1999Supersedes IPC-SM-786 Supersedes IPC-TM-650,2.6.22Notice EIA/JEDEC and IPC Standards and Publications are designed to serve thepublic interest through eliminating misunderstandings between manufacturersand purchasers,facilitating interchangeability and improvement of products,and assisting the purchaser in selecting and obtaining with minimum delaythe proper product for his particular need.Existence of such Standards andPublications shall not in any respect preclude any member or nonmember ofEIA/JEDEC or IPC from manufacturing or selling products not conformingto such Standards and Publications,nor shall the existence of such Standardsand Publications preclude their voluntary use by those other than EIA/JEDECand IPC members,whether the standard is to be used either domestically orinternationally.Recommended Standards and Publications are adopted by EIA/JEDEC andIPC without regard to whether their adoption may involve patents on articles,materials,or processes.By such action,EIA/JEDEC and IPC do not assumeany liability to any patent owner,nor do they assume any obligation whateverto parties adopting the Recommended Standard or ers are alsowholly responsible for protecting themselves against all claims of liabilities forpatent infringement.The material in this joint standard was developed by the EIA/JEDEC JC-14.1Committee on Reliability Test Methods for Packaged Devices and the IPCPlastic Chip Carrier Cracking Task Group(B-10a)The J-STD-035supersedes IPC-TM-650,Test Method2.6.22.For Technical Information Contact:Electronic Industries Alliance/ JEDEC(Joint Electron Device Engineering Council)2500Wilson Boulevard Arlington,V A22201Phone(703)907-7560Fax(703)907-7501IPC2215Sanders Road Northbrook,IL60062-6135 Phone(847)509-9700Fax(847)509-9798Please use the Standard Improvement Form shown at the end of thisdocument.©Copyright1999.The Electronic Industries Alliance,Arlington,Virginia,and IPC,Northbrook,Illinois.All rights reserved under both international and Pan-American copyright conventions.Any copying,scanning or other reproduction of these materials without the prior written consent of the copyright holder is strictly prohibited and constitutes infringement under the Copyright Law of the United States.IPC/JEDEC J-STD-035Acoustic Microscopyfor Non-Hermetic EncapsulatedElectronicComponentsA joint standard developed by the EIA/JEDEC JC-14.1Committee on Reliability Test Methods for Packaged Devices and the B-10a Plastic Chip Carrier Cracking Task Group of IPCUsers of this standard are encouraged to participate in the development of future revisions.Contact:EIA/JEDEC Engineering Department 2500Wilson Boulevard Arlington,V A22201 Phone(703)907-7500 Fax(703)907-7501IPC2215Sanders Road Northbrook,IL60062-6135 Phone(847)509-9700Fax(847)509-9798ASSOCIATION CONNECTINGELECTRONICS INDUSTRIESAcknowledgmentMembers of the Joint IPC-EIA/JEDEC Moisture Classification Task Group have worked to develop this document.We would like to thank them for their dedication to this effort.Any Standard involving a complex technology draws material from a vast number of sources.While the principal members of the Joint Moisture Classification Working Group are shown below,it is not possible to include all of those who assisted in the evolution of this Standard.To each of them,the mem-bers of the EIA/JEDEC and IPC extend their gratitude.IPC Packaged Electronic Components Committee ChairmanMartin FreedmanAMP,Inc.IPC Plastic Chip Carrier Cracking Task Group,B-10a ChairmanSteven MartellSonoscan,Inc.EIA/JEDEC JC14.1CommitteeChairmanJack McCullenIntel Corp.EIA/JEDEC JC14ChairmanNick LycoudesMotorolaJoint Working Group MembersCharlie Baker,TIChristopher Brigham,Hi/FnRalph Carbone,Hewlett Packard Co. Don Denton,TIMatt Dotty,AmkorMichele J.DiFranza,The Mitre Corp. Leo Feinstein,Allegro Microsystems Inc.Barry Fernelius,Hewlett Packard Co. Chris Fortunko,National Institute of StandardsRobert J.Gregory,CAE Electronics, Inc.Curtis Grosskopf,IBM Corp.Bill Guthrie,IBM Corp.Phil Johnson,Philips Semiconductors Nick Lycoudes,MotorolaSteven R.Martell,Sonoscan Inc. Jack McCullen,Intel Corp.Tom Moore,TIDavid Nicol,Lucent Technologies Inc.Pramod Patel,Advanced Micro Devices Inc.Ramon R.Reglos,XilinxCorazon Reglos,AdaptecGerald Servais,Delphi Delco Electronics SystemsRichard Shook,Lucent Technologies Inc.E.Lon Smith,Lucent Technologies Inc.Randy Walberg,NationalSemiconductor Corp.Charlie Wu,AdaptecEdward Masami Aoki,HewlettPackard LaboratoriesFonda B.Wu,Raytheon Systems Co.Richard W.Boerdner,EJE ResearchVictor J.Brzozowski,NorthropGrumman ES&SDMacushla Chen,Wus Printed CircuitCo.Ltd.Jeffrey C.Colish,Northrop GrummanCorp.Samuel J.Croce,Litton AeroProducts DivisionDerek D-Andrade,Surface MountTechnology CentreRao B.Dayaneni,Hewlett PackardLaboratoriesRodney Dehne,OEM WorldwideJames F.Maguire,Boeing Defense&Space GroupKim Finch,Boeing Defense&SpaceGroupAlelie Funcell,Xilinx Inc.Constantino J.Gonzalez,ACMEMunir Haq,Advanced Micro DevicesInc.Larry A.Hargreaves,DC.ScientificInc.John T.Hoback,Amoco ChemicalCo.Terence Kern,Axiom Electronics Inc.Connie M.Korth,K-Byte/HibbingManufacturingGabriele Marcantonio,NORTELCharles Martin,Hewlett PackardLaboratoriesRichard W.Max,Alcatel NetworkSystems Inc.Patrick McCluskey,University ofMarylandJames H.Moffitt,Moffitt ConsultingServicesRobert Mulligan,Motorola Inc.James E.Mumby,CibaJohn Northrup,Lockheed MartinCorp.Dominique K.Numakura,LitchfieldPrecision ComponentsNitin B.Parekh,Unisys Corp.Bella Poborets,Lucent TechnologiesInc.D.Elaine Pope,Intel Corp.Ray Prasad,Ray Prasad ConsultancyGroupAlbert Puah,Adaptec Inc.William Sepp,Technic Inc.Ralph W.Taylor,Lockheed MartinCorp.Ed R.Tidwell,DSC CommunicationsCorp.Nick Virmani,Naval Research LabKen Warren,Corlund ElectronicsCorp.Yulia B.Zaks,Lucent TechnologiesInc.IPC/JEDEC J-STD-035April1999 iiTable of Contents1SCOPE (1)2DEFINITIONS (1)2.1A-mode (1)2.2B-mode (1)2.3Back-Side Substrate View Area (1)2.4C-mode (1)2.5Through Transmission Mode (2)2.6Die Attach View Area (2)2.7Die Surface View Area (2)2.8Focal Length(FL) (2)2.9Focus Plane (2)2.10Leadframe(L/F)View Area (2)2.11Reflective Acoustic Microscope (2)2.12Through Transmission Acoustic Microscope (2)2.13Time-of-Flight(TOF) (3)2.14Top-Side Die Attach Substrate View Area (3)3APPARATUS (3)3.1Reflective Acoustic Microscope System (3)3.2Through Transmission AcousticMicroscope System (4)4PROCEDURE (4)4.1Equipment Setup (4)4.2Perform Acoustic Scans..........................................4Appendix A Acoustic Microscopy Defect CheckSheet (6)Appendix B Potential Image Pitfalls (9)Appendix C Some Limitations of AcousticMicroscopy (10)Appendix D Reference Procedure for PresentingApplicable Scanned Data (11)FiguresFigure1Example of A-mode Display (1)Figure2Example of B-mode Display (1)Figure3Example of C-mode Display (2)Figure4Example of Through Transmission Display (2)Figure5Diagram of a Reflective Acoustic MicroscopeSystem (3)Figure6Diagram of a Through Transmission AcousticMicroscope System (3)April1999IPC/JEDEC J-STD-035iiiIPC/JEDEC J-STD-035April1999This Page Intentionally Left BlankivApril1999IPC/JEDEC J-STD-035 Acoustic Microscopy for Non-Hermetic EncapsulatedElectronic Components1SCOPEThis test method defines the procedures for performing acoustic microscopy on non-hermetic encapsulated electronic com-ponents.This method provides users with an acoustic microscopy processflow for detecting defects non-destructively in plastic packages while achieving reproducibility.2DEFINITIONS2.1A-mode Acoustic data collected at the smallest X-Y-Z region defined by the limitations of the given acoustic micro-scope.An A-mode display contains amplitude and phase/polarity information as a function of time offlight at a single point in the X-Y plane.See Figure1-Example of A-mode Display.IPC-035-1 Figure1Example of A-mode Display2.2B-mode Acoustic data collected along an X-Z or Y-Z plane versus depth using a reflective acoustic microscope.A B-mode scan contains amplitude and phase/polarity information as a function of time offlight at each point along the scan line.A B-mode scan furnishes a two-dimensional(cross-sectional)description along a scan line(X or Y).See Figure2-Example of B-mode Display.IPC-035-2 Figure2Example of B-mode Display(bottom half of picture on left)2.3Back-Side Substrate View Area(Refer to Appendix A,Type IV)The interface between the encapsulant and the back of the substrate within the outer edges of the substrate surface.2.4C-mode Acoustic data collected in an X-Y plane at depth(Z)using a reflective acoustic microscope.A C-mode scan contains amplitude and phase/polarity information at each point in the scan plane.A C-mode scan furnishes a two-dimensional(area)image of echoes arising from reflections at a particular depth(Z).See Figure3-Example of C-mode Display.1IPC/JEDEC J-STD-035April1999IPC-035-3 Figure3Example of C-mode Display2.5Through Transmission Mode Acoustic data collected in an X-Y plane throughout the depth(Z)using a through trans-mission acoustic microscope.A Through Transmission mode scan contains only amplitude information at each point in the scan plane.A Through Transmission scan furnishes a two-dimensional(area)image of transmitted ultrasound through the complete thickness/depth(Z)of the sample/component.See Figure4-Example of Through Transmission Display.IPC-035-4 Figure4Example of Through Transmission Display2.6Die Attach View Area(Refer to Appendix A,Type II)The interface between the die and the die attach adhesive and/or the die attach adhesive and the die attach substrate.2.7Die Surface View Area(Refer to Appendix A,Type I)The interface between the encapsulant and the active side of the die.2.8Focal Length(FL)The distance in water at which a transducer’s spot size is at a minimum.2.9Focus Plane The X-Y plane at a depth(Z),which the amplitude of the acoustic signal is maximized.2.10Leadframe(L/F)View Area(Refer to Appendix A,Type V)The imaged area which extends from the outer L/F edges of the package to the L/F‘‘tips’’(wedge bond/stitch bond region of the innermost portion of the L/F.)2.11Reflective Acoustic Microscope An acoustic microscope that uses one transducer as both the pulser and receiver. (This is also known as a pulse/echo system.)See Figure5-Diagram of a Reflective Acoustic Microscope System.2.12Through Transmission Acoustic Microscope An acoustic microscope that transmits ultrasound completely through the sample from a sending transducer to a receiver on the opposite side.See Figure6-Diagram of a Through Transmis-sion Acoustic Microscope System.2April1999IPC/JEDEC J-STD-0353IPC/JEDEC J-STD-035April1999 3.1.6A broad band acoustic transducer with a center frequency in the range of10to200MHz for subsurface imaging.3.2Through Transmission Acoustic Microscope System(see Figure6)comprised of:3.2.1Items3.1.1to3.1.6above3.2.2Ultrasonic pulser(can be a pulser/receiver as in3.1.1)3.2.3Separate receiving transducer or ultrasonic detection system3.3Reference packages or standards,including packages with delamination and packages without delamination,for use during equipment setup.3.4Sample holder for pre-positioning samples.The holder should keep the samples from moving during the scan and maintain planarity.4PROCEDUREThis procedure is generic to all acoustic microscopes.For operational details related to this procedure that apply to a spe-cific model of acoustic microscope,consult the manufacturer’s operational manual.4.1Equipment Setup4.1.1Select the transducer with the highest useable ultrasonic frequency,subject to the limitations imposed by the media thickness and acoustic characteristics,package configuration,and transducer availability,to analyze the interfaces of inter-est.The transducer selected should have a low enough frequency to provide a clear signal from the interface of interest.The transducer should have a high enough frequency to delineate the interface of interest.Note:Through transmission mode may require a lower frequency and/or longer focal length than reflective mode.Through transmission is effective for the initial inspection of components to determine if defects are present.4.1.2Verify setup with the reference packages or standards(see3.3above)and settings that are appropriate for the trans-ducer chosen in4.1.1to ensure that the critical parameters at the interface of interest correlate to the reference standard uti-lized.4.1.3Place units in the sample holder in the coupling medium such that the upper surface of each unit is parallel with the scanning plane of the acoustic transducer.Sweep air bubbles away from the unit surface and from the bottom of the trans-ducer head.4.1.4At afixed distance(Z),align the transducer and/or stage for the maximum reflected amplitude from the top surface of the sample.The transducer must be perpendicular to the sample surface.4.1.5Focus by maximizing the amplitude,in the A-mode display,of the reflection from the interface designated for imag-ing.This is done by adjusting the Z-axis distance between the transducer and the sample.4.2Perform Acoustic Scans4.2.1Inspect the acoustic image(s)for any anomalies,verify that the anomaly is a package defect or an artifact of the imaging process,and record the results.(See Appendix A for an example of a check sheet that may be used.)To determine if an anomaly is a package defect or an artifact of the imaging process it is recommended to analyze the A-mode display at the location of the anomaly.4.2.2Consider potential pitfalls in image interpretation listed in,but not limited to,Appendix B and some of the limita-tions of acoustic microscopy listed in,but not limited to,Appendix C.If necessary,make adjustments to the equipment setup to optimize the results and rescan.4April1999IPC/JEDEC J-STD-035 4.2.3Evaluate the acoustic images using the failure criteria specified in other appropriate documents,such as J-STD-020.4.2.4Record the images and thefinal instrument setup parameters for documentation purposes.An example checklist is shown in Appendix D.5IPC/JEDEC J-STD-035April19996April1999IPC/JEDEC J-STD-035Appendix AAcoustic Microscopy Defect Check Sheet(continued)CIRCUIT SIDE SCANImage File Name/PathDelamination(Type I)Die Circuit Surface/Encapsulant Number Affected:Average%Location:Corner Edge Center (Type II)Die/Die Attach Number Affected:Average%Location:Corner Edge Center (Type III)Encapsulant/Substrate Number Affected:Average%Location:Corner Edge Center (Type V)Interconnect tip Number Affected:Average%Interconnect Number Affected:Max.%Length(Type VI)Intra-Laminate Number Affected:Average%Location:Corner Edge Center Comments:CracksAre cracks present:Yes NoIf yes:Do any cracks intersect:bond wire ball bond wedge bond tab bump tab leadDoes crack extend from leadfinger to any other internal feature:Yes NoDoes crack extend more than two-thirds the distance from any internal feature to the external surfaceof the package:Yes NoAdditional verification required:Yes NoComments:Mold Compound VoidsAre voids present:Yes NoIf yes:Approx.size Location(if multiple voids,use comment section)Do any voids intersect:bond wire ball bond wedge bond tab bump tab lead Additional verification required:Yes NoComments:7IPC/JEDEC J-STD-035April1999Appendix AAcoustic Microscopy Defect Check Sheet(continued)NON-CIRCUIT SIDE SCANImage File Name/PathDelamination(Type IV)Encapsulant/Substrate Number Affected:Average%Location:Corner Edge Center (Type II)Substrate/Die Attach Number Affected:Average%Location:Corner Edge Center (Type V)Interconnect Number Affected:Max.%LengthLocation:Corner Edge Center (Type VI)Intra-Laminate Number Affected:Average%Location:Corner Edge Center (Type VII)Heat Spreader Number Affected:Average%Location:Corner Edge Center Additional verification required:Yes NoComments:CracksAre cracks present:Yes NoIf yes:Does crack extend more than two-thirds the distance from any internal feature to the external surfaceof the package:Yes NoAdditional verification required:Yes NoComments:Mold Compound VoidsAre voids present:Yes NoIf yes:Approx.size Location(if multiple voids,use comment section)Additional verification required:Yes NoComments:8Appendix BPotential Image PitfallsOBSERV ATIONS CAUSES/COMMENTSUnexplained loss of front surface signal Gain setting too lowSymbolization on package surfaceEjector pin knockoutsPin1and other mold marksDust,air bubbles,fingerprints,residueScratches,scribe marks,pencil marksCambered package edgeUnexplained loss of subsurface signal Gain setting too lowTransducer frequency too highAcoustically absorbent(rubbery)fillerLarge mold compound voidsPorosity/high concentration of small voidsAngled cracks in package‘‘Dark line boundary’’(phase cancellation)Burned molding compound(ESD/EOS damage)False or spotty indication of delamination Low acoustic impedance coating(polyimide,gel)Focus errorIncorrect delamination gate setupMultilayer interference effectsFalse indication of adhesion Gain set too high(saturation)Incorrect delamination gate setupFocus errorOverlap of front surface and subsurface echoes(transducerfrequency too low)Fluidfilling delamination areasApparent voiding around die edge Reflection from wire loopsIncorrect setting of void gateGraded intensity Die tilt or lead frame deformation Sample tiltApril1999IPC/JEDEC J-STD-0359Appendix CSome Limitations of Acoustic MicroscopyAcoustic microscopy is an analytical technique that provides a non-destructive method for examining plastic encapsulated components for the existence of delaminations,cracks,and voids.This technique has limitations that include the following: LIMITATION REASONAcoustic microscopy has difficulty infinding small defects if the package is too thick.The ultrasonic signal becomes more attenuated as a function of two factors:the depth into the package and the transducer fre-quency.The greater the depth,the greater the attenuation.Simi-larly,the higher the transducer frequency,the greater the attenu-ation as a function of depth.There are limitations on the Z-axis(axial)resolu-tion.This is a function of the transducer frequency.The higher the transducer frequency,the better the resolution.However,the higher frequency signal becomes attenuated more quickly as a function of depth.There are limitations on the X-Y(lateral)resolu-tion.The X-Y(lateral)resolution is a function of a number of differ-ent variables including:•Transducer characteristics,including frequency,element diam-eter,and focal length•Absorption and scattering of acoustic waves as a function of the sample material•Electromechanical properties of the X-Y stageIrregularly shaped packages are difficult to analyze.The technique requires some kind offlat reference surface.Typically,the upper surface of the package or the die surfacecan be used as references.In some packages,cambered packageedges can cause difficulty in analyzing defects near the edgesand below their surfaces.Edge Effect The edges cause difficulty in analyzing defects near the edge ofany internal features.IPC/JEDEC J-STD-035April1999 10April1999IPC/JEDEC J-STD-035Appendix DReference Procedure for Presenting Applicable Scanned DataMost of the settings described may be captured as a default for the particular supplier/product with specific changes recorded on a sample or lot basis.Setup Configuration(Digital Setup File Name and Contents)Calibration Procedure and Calibration/Reference Standards usedTransducerManufacturerModelCenter frequencySerial numberElement diameterFocal length in waterScan SetupScan area(X-Y dimensions)Scan step sizeHorizontalVerticalDisplayed resolutionHorizontalVerticalScan speedPulser/Receiver SettingsGainBandwidthPulseEnergyRepetition rateReceiver attenuationDampingFilterEcho amplitudePulse Analyzer SettingsFront surface gate delay relative to trigger pulseSubsurface gate(if used)High passfilterDetection threshold for positive oscillation,negative oscillationA/D settingsSampling rateOffset settingPer Sample SettingsSample orientation(top or bottom(flipped)view and location of pin1or some other distinguishing characteristic) Focus(point,depth,interface)Reference planeNon-default parametersSample identification information to uniquely distinguish it from others in the same group11IPC/JEDEC J-STD-035April1999Appendix DReference Procedure for Presenting Applicable Scanned Data(continued) Reference Procedure for Presenting Scanned DataImagefile types and namesGray scale and color image legend definitionsSignificance of colorsIndications or definition of delaminationImage dimensionsDepth scale of TOFDeviation from true aspect ratioImage type:A-mode,B-mode,C-mode,TOF,Through TransmissionA-mode waveforms should be provided for points of interest,such as delaminated areas.In addition,an A-mode image should be provided for a bonded area as a control.12Standard Improvement FormIPC/JEDEC J-STD-035The purpose of this form is to provide the Technical Committee of IPC with input from the industry regarding usage of the subject standard.Individuals or companies are invited to submit comments to IPC.All comments will be collected and dispersed to the appropriate committee(s).If you can provide input,please complete this form and return to:IPC2215Sanders RoadNorthbrook,IL 60062-6135Fax 847509.97981.I recommend changes to the following:Requirement,paragraph number Test Method number,paragraph numberThe referenced paragraph number has proven to be:Unclear Too RigidInErrorOther2.Recommendations forcorrection:3.Other suggestions for document improvement:Submitted by:Name Telephone Company E-mailAddress City/State/ZipDate ASSOCIATION CONNECTING ELECTRONICS INDUSTRIESASSOCIATION CONNECTINGELECTRONICS INDUSTRIESISBN#1-580982-28-X2215 Sanders Road, Northbrook, IL 60062-6135Tel. 847.509.9700 Fax 847.509.9798。

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For some people, difficulty is an excuse to give up, while for others。

DBL_5410_2010-08

DBL_5410_2010-08
Person in charge: Ulrich Remmele Plant 050; Dept.: PWT/VWK
Phone: +49 (0) 7031 90 44267
Supply Specification
Thermoplastic parts for control elements, bearing elements,
The latest version of this document is available through the standards information systems of Mercedes-Benz.
Changes
In comparison with DBL 5410, edition 2009-02, the following changes have been made:
Product versions for components made of POM for interiors added - PV 01 POM - PV 01 POM GF 30 - PV 01 POM PTFE 20 - PV 02 POM-I
No odor test is required for POM parts in interiors Formaldehyde emissions of POM: limit values reduced to </= 2 (natural) / </= 10 µg. Standard DIN 53 435 deleted Black standard temperature increased from 90°C to 100 ± 3 °C
Table 1 Product versions, overview................................................................................................................................ 3 1 Scope ..................................................................................................................................................................... 3 2 Normative references............................................................................................................................................. 4 3 Terms and definitions............................................................................................................................................. 4 4 General requirements ............................................................................................................................................ 4 5 Technical data........................................................................................................................................................ 4 6 Test methods and general requirements ............................................................................................................... 5 7 General properties of the materials, raw materials and supply condition .............................................................. 5 8 Sampling ................................................................................................................................................................ 5 Table 2 ............................................................................................................................................................................ 6
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4.1.2 Human Vision
The eye works like a camera, with the lens focusing an image onto the retina (upside-down and left-right reversed). The retina consists of an array of rods and three kinds of cones. The rods come into play when light levels are low and produce a image in shades of gray ("all cats are gray at night!"). For higher light levels, the cones each produce a signal. Because of their differing pigments, the three kinds of cones are most sensitive to red (R), green (G), and blue (B) light. It seems likely that the brain makes use of differences R-G, G-B, and B-R, as well as combining all of R, G, and B into a highlight-level achromatic channel.
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Fig. 4.2 shows the relative power in each wavelength interval for typical outdoor light on a sunny day. This type of curve is called a Spectral Power Distribution (SPD) or a spectrum.
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人类视觉模 型 R,G,B
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4.1.5 Camera System
Camera systems are made in a similar fashion; a studioquality camera has three signals produced at each pixel location (corresponding to a retinal position). Analog signals are converted to digital, truncated to integers, and stored. If the precision used is 8-bit, then the maximum value for any of R, G, B is 255, and the minimum is 0. However, the light entering the eye of the computer user is that which is emitted by the screen -- the screen is essentially a self-luminous source. Therefore we need to know the light E(λ) entering the eye.
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Spectral Sensitivity Functions
These spectral sensitivity functions are usually denoted by letters other than "R, G, B"; here let's use a vector function q (λ), with components
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Fig.4.3 shows the overall sensitivity as a dashed line – this important curve is called the luminous-efficiency function.
It is usually denoted V (λ) and is formed as the sum of the response curves for Red, Green, and Blue. The rod sensitivity curve looks like the luminous-efficiency function V (λ) but is shifted to the red end of the spectrum. The achromatic channel produced by the cones is approximately proportional to 2R+G+B/20.
Fundamentals of Multimedia
Chapter 4 Color in Image and Video
Ch4 Color in Image and Video
4.1 Color Science 4.2 Color Models in Images 4.3 Color Models in Video 4.4 Further Exploration 4.5 Brief Summary
The symbol for wavelength is λ. This curve is called E(λ).
Spectral power distribution 400 450 500 550 600 650 700 Wavelength(nm)
Fig. 4.2: Spectral r distribution of daylight.
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4.1 Color Science
4.1.1 Light and Spectra

Light is an electromagnetic wave. Its color is characterized by the wavelength content of the light.

(a) Laser light consists of a single wavelength: e.g., a ruby laser produces a bright, scarlet-red beam. (b) Most light sources produce contributions over many wavelengths. (c) However, humans cannot detect all light, just contributions that fall in the "visible wavelengths". (d) Short wavelengths produce a blue sensation, long wavelengths produce a red one.
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Fig. 4.4: Surface spectral reflectance functions S(λ) for objects.
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Image formation is thus: Light from the illuminant with SPD E(λ) impinges on a surface, with surface spectral reflectance function S(λ), is reflected, and then is filtered by the eye's cone functions q (λ). Reflection is shown in Fig. 4.5 below. The function C(λ) is called the color signal and consists of the product of E(λ), the illuminant, times S(λ), the reflectance:
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We can succinctly write down this idea in the form of an integral:
4.2
R E qR d G E qG d B E qB d


Spectrophotometer: a device used to measure visible light,
by reflecting light from a diffraction grating (a ruled surface) that spreads out the different wavelengths.
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4.1.3 Spectral Sensitivity of the Eye
The eye is most sensitive to light in the middle of the visible spectrum. The sensitivity of our receptors is also a function of wavelength (Fig. 4.3 below). The Blue receptor sensitivity is not shown to scale because it is much smaller than the curves for Red or Green -- Blue is a late addition, in evolution.
Only can be applied in a self-luminous object.
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4.1.4 Image Information
Surfaces reflect different amounts of light at different wave-lengths, and dark surfaces reflect less energy than light surfaces. Fig. 4.4 shows the surface spectral reflectance from (1) orange sneakers and (2) faded bluejeans. The reflectance function is denoted S(λ).
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