DuffCh05a - 3
NMR Solvent
show their degree of variability.Occasionally,in order to distinguish between peaks whose assignment was ambiguous,a further1-2μL of a specific substrate were added and the spectra run again.Table1.1H NMR Dataproton mult CDCl3(CD3)2CO(CD3)2SO C6D6CD3CN CD3OD D2O solvent residual peak7.26 2.05 2.507.16 1.94 3.31 4.79 H2O s 1.56 2.84a 3.33a0.40 2.13 4.87acetic acid CH3s 2.10 1.96 1.91 1.55 1.96 1.99 2.08 acetone CH3s 2.17 2.09 2.09 1.55 2.08 2.15 2.22 acetonitrile CH3s 2.10 2.05 2.07 1.55 1.96 2.03 2.06 benzene CH s7.367.367.377.157.377.33tert-butyl alcohol CH3s 1.28 1.18 1.11 1.05 1.16 1.40 1.24 OH c s 4.19 1.55 2.18tert-butyl methyl ether CCH3s 1.19 1.13 1.11 1.07 1.14 1.15 1.21 OCH3s 3.22 3.13 3.08 3.04 3.13 3.20 3.22 BHT b ArH s 6.98 6.96 6.877.05 6.97 6.92OH c s 5.01 6.65 4.79 5.20ArCH3s 2.27 2.22 2.18 2.24 2.22 2.21ArC(CH3)3s 1.43 1.41 1.36 1.38 1.39 1.40chloroform CH s7.268.028.32 6.157.587.90 cyclohexane CH2s 1.43 1.43 1.40 1.40 1.44 1.451,2-dichloroethane CH2s 3.73 3.87 3.90 2.90 3.81 3.78 dichloromethane CH2s 5.30 5.63 5.76 4.27 5.44 5.49diethyl ether CH3t,7 1.21 1.11 1.09 1.11 1.12 1.18 1.17 CH2q,7 3.48 3.41 3.38 3.26 3.42 3.49 3.56 diglyme CH2m 3.65 3.56 3.51 3.46 3.53 3.61 3.67 CH2m 3.57 3.47 3.38 3.34 3.45 3.58 3.61OCH3s 3.39 3.28 3.24 3.11 3.29 3.35 3.37 1,2-dimethoxyethane CH3s 3.40 3.28 3.24 3.12 3.28 3.35 3.37 CH2s 3.55 3.46 3.43 3.33 3.45 3.52 3.60 dimethylacetamide CH3CO s 2.09 1.97 1.96 1.60 1.97 2.07 2.08 NCH3s 3.02 3.00 2.94 2.57 2.96 3.31 3.06NCH3s 2.94 2.83 2.78 2.05 2.83 2.92 2.90 dimethylformamide CH s8.027.967.957.637.927.977.92 CH3s 2.96 2.94 2.89 2.36 2.89 2.99 3.01CH3s 2.88 2.78 2.73 1.86 2.77 2.86 2.85 dimethyl sulfoxide CH3s 2.62 2.52 2.54 1.68 2.50 2.65 2.71 dioxane CH2s 3.71 3.59 3.57 3.35 3.60 3.66 3.75 ethanol CH3t,7 1.25 1.12 1.060.96 1.12 1.19 1.17 CH2q,7d 3.72 3.57 3.44 3.34 3.54 3.60 3.65OH s c,d 1.32 3.39 4.63 2.47ethyl acetate CH3CO s 2.05 1.97 1.99 1.65 1.97 2.01 2.07C H2CH3q,7 4.12 4.05 4.03 3.89 4.06 4.09 4.14CH2C H3t,7 1.26 1.20 1.170.92 1.20 1.24 1.24 ethyl methyl ketone CH3CO s 2.14 2.07 2.07 1.58 2.06 2.12 2.19C H2CH3q,7 2.46 2.45 2.43 1.81 2.43 2.50 3.18CH2C H3t,7 1.060.960.910.850.96 1.01 1.26 ethylene glycol CH s e 3.76 3.28 3.34 3.41 3.51 3.59 3.65“grease”f CH3m0.860.870.920.860.88CH2br s 1.26 1.29 1.36 1.27 1.29n-hexane CH3t0.880.880.860.890.890.90CH2m 1.26 1.28 1.25 1.24 1.28 1.29HMPA g CH3d,9.5 2.65 2.59 2.53 2.40 2.57 2.64 2.61 methanol CH3s h 3.49 3.31 3.16 3.07 3.28 3.34 3.34 OH s c,h 1.09 3.12 4.01 2.16nitromethane CH3s 4.33 4.43 4.42 2.94 4.31 4.34 4.40 n-pentane CH3t,70.880.880.860.870.890.90CH2m 1.27 1.27 1.27 1.23 1.29 1.292-propanol CH3d,6 1.22 1.10 1.040.95 1.09 1.50 1.17 CH sep,6 4.04 3.90 3.78 3.67 3.87 3.92 4.02 pyridine CH(2)m8.628.588.588.538.578.538.52 CH(3)m7.297.357.39 6.667.337.447.45CH(4)m7.687.767.79 6.987.737.857.87 silicone grease i CH3s0.070.130.290.080.10 tetrahydrofuran CH2m 1.85 1.79 1.76 1.40 1.80 1.87 1.88 CH2O m 3.76 3.63 3.60 3.57 3.64 3.71 3.74 toluene CH3s 2.36 2.32 2.30 2.11 2.33 2.32CH(o/p)m7.177.1-7.27.187.027.1-7.37.16CH(m)m7.257.1-7.27.257.137.1-7.37.16 triethylamine CH3t,7 1.030.960.930.960.96 1.050.99 CH2q,7 2.53 2.45 2.43 2.40 2.45 2.58 2.57a In these solvents the intermolecular rate of exchange is slow enough that a peak due to HDO is usually also observed;it appears at2.81and3.30ppm in acetone and DMSO,respectively.In the former solvent,it is often seen as a1:1:1triplet,with2J H,D)1Hz. b2,6-Dimethyl-4-tert-butylphenol.c The signals from exchangeable protons were not always identified.d In some cases(see note a),the coupling interaction between the CH2and the OH protons may be observed(J)5Hz).e In CD3CN,the OH proton was seen as a multiplet atδ2.69,and extra coupling was also apparent on the methylene peak.f Long-chain,linear aliphatic hydrocarbons.Their solubility in DMSO was too low to give visible peaks.g Hexamethylphosphoramide.h In some cases(see notes a,d),the coupling interaction between the CH3and the OH protons may be observed(J)5.5Hz).i Poly(dimethylsiloxane).Its solubility in DMSO was too low to give visible peaks.Notes .Chem.,Vol.62,No.21,19977513.Chem.,Vol.62,No.21,1997NotesTable2.13C NMR Data aCDCl3(CD3)2CO(CD3)2SO C6D6CD3CN CD3OD D2O solvent signals77.16(0.0629.84(0.0139.52(0.06128.06(0.02 1.32(0.0249.00(0.01206.26(0.13118.26(0.02acetic acid CO175.99172.31171.93175.82173.21175.11177.21 CH320.8120.5120.9520.3720.7320.5621.03 acetone CO207.07205.87206.31204.43207.43209.67215.94 CH330.9230.6030.5630.1430.9130.6730.89 acetonitrile CN116.43117.60117.91116.02118.26118.06119.68 CH3 1.89 1.12 1.030.20 1.790.85 1.47 benzene CH128.37129.15128.30128.62129.32129.34tert-butyl alcohol C69.1568.1366.8868.1968.7469.4070.36 CH331.2530.7230.3830.4730.6830.9130.29 tert-butyl methyl ether OCH349.4549.3548.7049.1949.5249.6649.37 C72.8772.8172.0472.4073.1774.3275.62C C H326.9927.2426.7927.0927.2827.2226.60 BHT C(1)151.55152.51151.47152.05152.42152.85C(2)135.87138.19139.12136.08138.13139.09CH(3)125.55129.05127.97128.52129.61129.49C(4)128.27126.03124.85125.83126.38126.11CH3Ar21.2021.3120.9721.4021.2321.38C H3C30.3331.6131.2531.3431.5031.15C34.2535.0034.3334.3535.0535.36chloroform CH77.3679.1979.1677.7979.1779.44cyclohexane CH226.9427.5126.3327.2327.6327.961,2-dichloroethane CH243.5045.2545.0243.5945.5445.11 dichloromethane CH253.5254.9554.8453.4655.3254.78diethyl ether CH315.2015.7815.1215.4615.6315.4614.77 CH265.9166.1262.0565.9466.3266.8866.42 diglyme CH359.0158.7757.9858.6658.9059.0658.67 CH270.5171.0369.5470.8770.9971.3370.05CH271.9072.6371.2572.3572.6372.9271.63 1,2-dimethoxyethane CH359.0858.4558.0158.6858.8959.0658.67 CH271.8472.4717.0772.2172.4772.7271.49 dimethylacetamide CH321.5321.5121.2921.1621.7621.3221.09 CO171.07170.61169.54169.95171.31173.32174.57NCH335.2834.8937.3834.6735.1735.5035.03NCH338.1337.9234.4237.0338.2638.4338.76 dimethylformamide CH162.62162.79162.29162.13163.31164.73165.53 CH336.5036.1535.7335.2536.5736.8937.54CH331.4531.0330.7330.7231.3231.6132.03 dimethyl sulfoxide CH340.7641.2340.4540.0341.3140.4539.39 dioxane CH267.1467.6066.3667.1667.7268.1167.19 ethanol CH318.4118.8918.5118.7218.8018.4017.47 CH258.2857.7256.0757.8657.9658.2658.05 ethyl acetate C H3CO21.0420.8320.6820.5621.1620.8821.15 CO171.36170.96170.31170.44171.68172.89175.26CH260.4960.5659.7460.2160.9861.5062.32CH314.1914.5014.4014.1914.5414.4913.92 ethyl methyl ketone C H3CO29.4929.3029.2628.5629.6029.3929.49 CO209.56208.30208.72206.55209.88212.16218.43C H2CH336.8936.7535.8336.3637.0937.3437.27CH2C H37.868.037.617.918.148.097.87 ethylene glycol CH263.7964.2662.7664.3464.2264.3063.17“grease”CH229.7630.7329.2030.2130.8631.29n-hexane CH314.1414.3413.8814.3214.4314.45CH2(2)22.7023.2822.0523.0423.4023.68CH2(3)31.6432.3030.9531.9632.3632.73HMPA b CH336.8737.0436.4236.8837.1037.0036.46 methanol CH350.4149.7748.5949.9749.9049.8649.50c nitromethane CH362.5063.2163.2861.1663.6663.0863.22 n-pentane CH314.0814.2913.2814.2514.3714.39CH2(2)22.3822.9821.7022.7223.0823.38CH2(3)34.1634.8333.4834.4534.8935.302-propanol CH325.1425.6725.4325.1825.5525.2724.38 CH64.5063.8564.9264.2364.3064.7164.88 pyridine CH(2)149.90150.67149.58150.27150.76150.07149.18 CH(3)123.75124.57123.84123.58127.76125.53125.12CH(4)135.96136.56136.05135.28136.89138.35138.27 silicone grease CH3 1.04 1.40 1.38 2.10 tetrahydrofuran CH225.6226.1525.1425.7226.2726.4825.67 CH2O67.9768.0767.0367.8068.3368.8368.68 toluene CH321.4621.4620.9921.1021.5021.50C(i)137.89138.48137.35137.91138.90138.85CH(o)129.07129.76128.88129.33129.94129.91CH(m)128.26129.03128.18128.56129.23129.20CH(p)125.33126.12125.29125.68126.28126.29triethylamine CH311.6112.4911.7412.3512.3811.099.07 CH246.2547.0745.7446.7747.1046.9647.19 a See footnotes for Table1.b2J PC)3Hz.c Reference material;see text.。
phi29 DNA Polymerase产品说明书
phi29 DNA Polymerase产品编号 产品名称包装 D7053S phi29 DNA Polymerase 250U D7053M phi29 DNA Polymerase 1kU D7053L phi29 DNA Polymerase 5kU D7053XLphi29 DNA Polymerase20kU产品简介：碧云天生产的phi29 DNA Polymerase ，即phi29 DNA 聚合酶，是一种重组表达纯化的源于嗜热脂肪芽孢杆菌Bacillus subtilis 噬菌体phi29的DNA 聚合酶。
phi29 DNA 聚合酶具有DNA 链置换 (strand displacement) 活性和很强的DNA 连续合成能力(processive synthesis property)，可以合成超过70kb 的长度，常用于在体外进行不依赖于热循环的等温DNA 扩增(isothermal DNA amplification ，也常简称为等温扩增)。
phi29 DNA Polymerase 具有很强的链亲和力，单次聚合反应可以实现长度超过70kb 的连续聚合延伸，从而适合用于对全基因组进行稳定扩增。
phi29 DNA Polymerase 虽然可以扩增线状或者环状的双链DNA ，但其底物倾向于是单链DNA 或单链RNA 。
phi29 DNA Polymerase 具有3’→5’外切酶活性，因此可保证扩增反应的高保真性。
用途：phi29 DNA Polymerase 可用于高保真等温PCR 、滚环复制(Rolling Circle Replication ，RCA)，多重置换扩增(Multiple Displacement Amplification ，MDA)和单细胞、病原微生物以及宏基因组(metagenome)的全基因组扩增(Whole Genome Amplification ，WGA)、干血斑样本扩增DNA 、单细胞基因组扩增、SNP 基因分型和STR/微卫星分析等。
腰果酚改性酚醛胺固化剂
腰果酚改性酚醛胺固化剂名称外观色度Gardner粘度(mPa.s，25℃)胺值(mgKOH/g)酸值(mgKOH/g)固体份（%）活泼氢当量（g/Eq）百克树脂(E-51)用量(Phr)凝胶时间(min@25℃,150g混合料)薄膜干燥时间(hr@25℃)用途DF4228棕红色透明液体＜18 1500-4000 285±15 N/A 90±3 110 90 45 9.5腰果壳油改性，耐化学腐蚀，柔韧性好，抗冲击力强，可潮湿固化等优点。
DF4229 ＜17 5000-10000 290±20 N/A 90±3 100 90 45 9.5 腰果壳油改性，耐化学腐蚀，柔韧性好，抗冲击力强，可潮湿固化等优点。
DF1228H ＜17 20000-50000 285±20 N/A ＞95 125 35 55 12.5 低温固化（－5℃），无毒，耐化学腐蚀，柔韧性好，抗冲击力强，可潮湿固化等优点。
DF1228 ＜17 7000-17000 285±20 N/A ＞85 100 35 70 12.5 低温固化（－5℃）以及常温固化，无毒，耐化学腐蚀，柔韧性好，抗冲击力强，可潮湿固化等优点。
配比范围宽，性价优异。
DF1226 ＜17 6000-9000 265±25 N/A 85±2 110 80 60 7.5 有优异的粘结性、柔韧性、绝缘性，耐水、耐化学腐蚀，可水下固化，配比范围宽。
DF1220 ≤17 6000-16000 200±20 N/A 75±3 150 40 70 11.5 有优异的粘结性、柔韧性、绝缘性，耐水、耐化学腐蚀，可水下固化，配比范围宽。
DF1230H ＜18 3000-6000 300±20 N/A ≥95 90 80 80 6.5 有优异的粘结性、柔韧性、绝缘性，耐水、耐化学腐蚀，可水下固化，配比范围宽。
AlphaScreen SureFire STAT3 (p-Tyr705) Assay Kits产品
AlphaScreen®SureFire®STAT3 (p-Tyr705) Assay KitsManualAssay Points Catalog #500TGRS3S50010 000TGRS3S10K50 000TGRS3S50KFor Research Use OnlyResearch Reagents for Research Purposes OnlyGeneral Information on the AlphaScreen® SureFire® p-STAT3 assayThe AlphaScreen® SureFire® p-STAT3 assay is used to measure the phosphorylation of endogenous STAT3αand STAT3βin cellular lysates. The assay is an ideal system for the screening of both modulators of receptor activation (e.g. agonists and antagonists) as well as agents acting intracellularly, such as small molecule inhibitors of upstream events. The assay will measure STAT3 phosphorylation by either cloned or endogenous receptors, and can be applied to primary cells.This assay eliminates the need for laborious techniques, such as Western blotting or conventional ELISA. It is a homogeneous assay, in that no sample washing steps are required, which allows for minimal handling, short assay times, and robotic operation if desired. The assay utilizes the bead-based Alpha Technology, and requires an Alpha Technology-compatible plate reader.Alpha Technology AlphaScreen® SureFire® Assay PrincipleAlphaScreen® SureFire® technology allows the detection of phosphorylated proteins in cellular lysates in a highly sensitive, quantitative and user friendly assay. In these assays, sandwich antibody complexes, which are only formed in the presence of analyte, are captured by AlphaScreen donor and acceptor beads, bringing them into close proximity. The excitation of the donor bead provokes the release of singlet oxygen molecules that triggers a cascade of energy transfer in the Acceptor beads, resulting in the emission of light at 520-620nm.Kit-Specificity informationThis assay kit contains antibodies which recognize the phospho-Tyr705-epitope, and a distal epitope on STAT3αand STAT3β. The proteins detected by this kit correspond to GenBank Accessions NP_644805 and NP_998827.These antibodies recognize STAT3 of human, mouse and rat origin. Other species should be tested on a case-by-case basis.Kit ContentsKit Size500 points10,000 points50,000 pointsLysis buffer (5X) 1 x 10 mL 4 x 60 mL 3 x 400 mL Activation buffer 1 x 2 mL 1 x 60 mL 1 x 300 mL Reaction buffer 1 x 2.6 mL 1 x 45 mL 1 x 225 mL Dilution buffer 1 x 1.5 mL1 x 25 mL2 x 60 mLPositive Control Lysate 1 tube to be re-dissolved in 250 µL H 2O Negative Control Lysate1 tube to be re-dissolved in 250 µL H 2OStorage conditions upon receiptThe kit buffers e.g. 5X Lysis buffer, Activation buffer and Reaction buffer should be stored at 4°C. DO NOT freeze the kit buffers – the Reaction buffer contains antibodies and freeze/thaw cycles can lead to a loss of activity.Materials Required But Not ProvidedThe AlphaScreen SureFire assay kits are optimized to work with AlphaScreen Protein A general IgG detection beads. These are available separately from PerkinElmer. The AlphaScreen Protein A general IgG detection kits contain a biotinylated rabbit IgG control, which can be used to test the instrument settings and bead performance.ItemSuggested source Catalog # Size Protein A general IgG detection kit(contains the Acceptor and Donor Beads) PerkinElmer Inc. 6760617C 6760617M 6760617R 500 pt 10,000 pt 50,000 pt Proxiplate™-384 Plus, white, shallow well assay platePerkinElmer Inc. 6008280 6008289 50/box 200/box Optiplate™-384 Plus, white, assay plate PerkinElmer Inc. 6007290 6007299 50/box 200/box TopSeal-A 384, clear adhesive sealing film PerkinElmer Inc. 6050185100/boxEnvision® or Enspire® Alpha-readerPerkinElmer Inc.--Buffer preparation and subsequent storage conditions5X Lysis bufferStore 5X Lysis buffer at 4°C. For assay, dilute 5-fold in water immediately prior to use. Discard unused buffer. Activation bufferPrecipitation will occur during storage 4°C. To re-dissolve, warm to 37°C and mix. Alternatively, Activation buffer can be stored at room temperature with no loss in activity.Reaction buffer*Keep on ice while in use. Do not freeze.Once diluted discard unused reaction buffer. AlphaScreen ® Protein A IgG KitStore at 4°C in the dark.Acceptor Mix(Reaction buffer + Activation buffer +AlphaScreen ® Acceptor beads)Immediately prior to use, dilute Activation buffer B 5-fold in Reaction buffer (e.g. take 98 μL Activation buffer and dilute in 392 μL Reaction buffer).Dilute Acceptor beads 50-fold in Acceptor mix (e.g. add10 μL Acceptor beads to 490 μL of premixed Reactionbuffer + Activation buffer).The Acceptor mix should be used immediately for best results. Excess mix should be discarded.Donor Mix**(Dilution buffer + AlphaScreen ®Donor beads)Immediately prior to use, dilute Donor beads 20-fold in Dilution buffer (e.g. add 10 μL Don or beads to 190 μLDilution buffer).The Donor mix should be used immediately for best results. Excess mix should be discarded.Assay Control lysateAfter reconstitution in 250 μL water, lysates should be frozen at -20°C in single use aliquots and used within 1 month.* Do not vortex the Reaction buffer, as vigorous mixing can damage some antibodies. ** Prepare and use Donor Mix under low-light conditions.Control Lysate informationControl lysates are prepared from A431 cells (ATCC #CRL-1555) at a concentration of approximately 1 mg/mL. The controls are supplied lyophilized, and should be reconstituted in either dd H 2O or MilliQ® H 2O. Once reconstituted, lysates should be stored frozen in single use aliquots.Negative Lysate: Prepared from A431 cells treated with EGF receptor inhibitor (2 μM AG1478)for 2 hours prior to lysis.Positive Lysate: Prepared from A431 cells treated with 200 ng/mL EGF for 10 minutes.p-STAT3 AlphaScreen® SureFire® Assay ProtocolsA. 2-Plate Assay - assay protocol for adherent cellsCell Seeding1. Seed cell s (200 μL of cells for 96 well plates, 50 μL for 384 well plates) in tissue culture plates. Incubate at 37°C overnight in serum-containing media.Cell Treatment2. Remove culture media, and stimulate the cells with 50 μL agonists prepared in serum-free media (25 µL for 384-well plates). (If testing antagonists, prior to stimulation remove culture medium and replace with 50 μL serum-free media containing antagonists (25 µL for 384-well plates)). Return cells to 37°C incubator for desired time. 1 hour is often sufficient for signal transduction inhibitors, and 5 minutes for receptor agonists.Note: Peptidic agonists and antagonists can often stick to plastic surfaces. To minimize this effect, dilute in serum-free media containing a suitable carrier protein (e.g. 0.1% IgG free BSA - Jackson Immunoresearch Cat #001-000-161).Lysate Preparation5. To lyse cells, remove medium from wells, and add freshly prepared 1X Lysis Buffer(50-100 μL fora 96 well plate, 25 μL for a 384 well plate). Agitate on a plate shaker (~350 rpm) for 10 minutes at room temperature.6. Take 4 μL of the lysate and transfer to a 384-well Proxiplate™ for assay. (Add 4 μL Control lysates to separate wells if required).SureFire Assay7. Add 5 μL of Acceptor Mix to wells. Seal plate with Topseal-A adhesive film, and incubate for 2 hours at room temperature.8. Add 2 μL of Donor Mix to wells under subdued light. Seal plate with Topseal-A adhesive film, and cover plate with foil. Incubate for 2 hours at room temperature.Note: Longer incubation may give greater sensitivity. Plates can be incubated overnight if required.9. Read plate on an Alpha Technology-compatible plate reader, using standard AlphaScreen settings.B. 1 Plate Assay - assay protocol for non-adherent cells, and for high-throughput applications. Note: the larger volumes required using this assay will result in achieving less assay points per kit. Cell Seeding1. Harvest cells by centrifugation, and re-suspend cells in HBSS at a suitable cell density. We recommend 107cells/mL as a starting point. Seed 4 μL of cells/well into a 384-well culture plate.2. If using test agents/inhibitors, add 2 μL/well of 4X inhibitors prepared in HBSS.Note: Peptidic agonists and antagonists can often stick to plastic surfaces. To minimize this effect, dilute in serum-free media containing a suitable carrier protein (e.g. 0.1% IgG free BSA - Jackson Immunoresearch Cat #001-000-161).3. Return cells to incubator at 37°C for 1-2 hours.Cell Treatment4. Stimulate cells with agonists by addition of 2 μL/well of 4X agonist stock in HBSS containing 0.1% BSA. The final volume in the wells should be 8 μL. (if no antagonists were used in step 2, stimulate the cells with 4 μL/well of 2X agonist, to give a final volume in the wells of 8 μL.)Lysate Preparation5. To lyse the cells, add 2 μL/well 5X Lysis buffer.(Add 10 μL control lysates to separate wells if required)SureFire Assay6. Add 8 μL of Acceptor Mix to wells. Seal plate with Topseal-A adhesive film, and incubate for 2 hours at room temperature.7. Add 3 μL of Donor Mix to wells under subdued light. Seal plate with Topseal-A adhesive film, and cover plate with foil. Incubate for 2 hours at room temperature.Note: Longer incubation may give greater sensitivity. Plates can be incubated overnight if required.8. Read plate on an Alpha Technology-compatible plate reader, using standard AlphaScreen settings.Representative DataWestern blot analysis (35 μg protein/lane) of phospho-STAT3 in lysates generated from either unstimulated (-) or IL6-stimulated (+) THP-1 cells, or the AlphaScreen SureFire assay (3.5 μg protein/well), using the standard 2-plate protocol.THP-1 cells (ATCC Cat# TIB-202) were harvested from growing flasks, resuspended in HBSS, and seeded at 25K cells/well in 384-well microplates. Cells were incubated for 2 hours at 37°C, and stimulated with IL-6 for 10 minutes at room temperature (left) or pre-treated with JAK inhibitor I for 2 hours at 37°C, then stimulated with IL-6 (right). Cells were lysed with 5X Lysis buffer with shaking at RT for 10 minutes, and analyzed for phospho-STAT3 using the standard 1-plate protocol.Frequently Asked Questions & TroubleshootingFor comprehensive information on assay optimization and troubleshooting, please refer to the following resources:▪ Guide to AlphaScreen® SureFire ® assay optimization ▪ AlphaScreen® SureFire ® user guideTo download these resources, and other related technical information, visit /category/alpha-surefire-kitsFor general information on AlphaScreen® SureFire ® assays, visit - +Customer CareTo contact the customer care team, please visit /ServiceCallFor more information regarding related AlphaScreen® SureFire® products andprotocols refer to:PerkinElmer web site: TGR BioSciences website: FOR RESEARCH USE ONLY. NOT FOR USE IN DIAGNOSTIC PROCEDURES.This product is not for resale or distribution except by authorized distributors.LIMITED WARRANTY: PerkinElmer, Inc. warrants that, at the time of shipment, the products sold by it are free from defects in material and workmanship and conform to specifications which accompany the product. PerkinElmer Inc. makes no other warranty, express or implied with respect to the products, including any warranty of merchantability or fitness for any particular purpose. Notification of any breach of warranty must be made within 60 days of receipt unless provided in writing by PerkinElmer Inc. No claim shall be honored if the customer fails to notify PerkinElmer Inc. within the period specified. The sole and exclusive remedy of the customer for any liability of PerkinElmer Inc. of any kind including liability based upon warranty (express or implied whether contained herein or elsewhere), strict liability contract or otherwise is limited to the replacement of the goods or the refunds of the invoice price of goods. PerkinElmer Inc. shall not in any case be liable for special, incidental or consequential damages of any kind.。
CH系列高性能助剂在油墨中的应用
CH系列高性能助剂在油墨中的应用王正东陈腊琼上海三正高分子材料有限公司（上海 200233）随着科学技术的发展和人民生活水平的提高，人们对印刷品的要求越来越高。
提供多种多样的印刷承印物和与之相适应的油墨，并改善油墨的应用性能是适应这一要求的必然选择。
油墨助剂在保证产品质量、改善产品应用性能方面起着重要的作用，但是，助剂产品花样繁多，性能各异，如选用不当反而会对油墨产品产生负面影响。
上海三正高分子材料有限公司是一家民营科技企业，专业从事聚合物型助剂的研制、生产和销售。
针对油墨生产和应用中出现的颜料分散不良、流动性差以及乳化、结皮等问题，开发了CH系列助剂，在提高油墨生产效率和质量档次、改善油墨印刷适性等方面效果显著。
自产品投放市场以来赢得了不少油墨生产企业的好评。
目前，国内排名前二十位的油墨生产企业中，80%已应用了CH系列助剂。
CH系列助剂分为超分散剂、抗乳化剂、抗结皮剂三类，主要从颜料分散与油墨流变性质、胶印油墨油水平衡与抗乳化能力以及胶印油墨抗氧化抗结皮能力等方面改进油墨性能。
首先，油墨在制造和印刷过程中都必须有满意而严格的流变性，例如油墨应易于从墨斗倒出来，并传递、转移、分配、抵达印版上，直至最后转印到承印物表面。
而且，诸如飞墨、网点清晰度、密度、印刷一致性、渗透性、光泽、堆版等印刷效果也与油墨的流变性有关，而油墨的流变性很大程度上取决于颜料在粘结料中的分散状况。
CH系列产品中的超分散剂针对油墨体系颜料品种和溶剂品种的差异设计了不同分子结构的产品，以保证颜料在粘结料中的均匀分散且长期稳定，不会出现颜料絮凝、结固、返粗或油墨胶化等现象。
其次，胶印油墨的乳化会给印刷带来实地密度降低、网点扩大、油墨流动性变差、转移性变差、堆版、浮脏等毛病，如何控制乳化率、加快油墨油水平衡速度一直是油墨界技术人员普遍关心的问题。
CH系列产品中的抗乳化助剂能以较低的用量（0.2-0.4%）有效提高胶印油墨抗乳化能力，圆满地解决了胶印油墨的抗乳化问题。
改进Duff反应合成5硝基水杨醛
第２０卷第１２期２００６年１２月化工时刊ＣｈｅｍｉｃａｌＩｎｄｕｓｔｒｖＴｉｍｅｓＶ０１．２０，Ｎ０．１２Ｄｅｃ．１２．２００６改进Ｄｕｆｆ反应合成５一硝基水杨醛张维庆邹亮华周诗彪张儒祥（湖南文理学院化学化工系湖南常德４１５０００）摘要用多聚磷酸改进Ｄ心反应合成了５一硝基水杨醛，探讨了温度、时问、反应物用量等因素对５一硝基水杨醛产率的影响。
结果表明较佳反应条件是：在对硝基苯酚为３．５ｇ的情况下，７５％的多聚磷酸用量为３０ｚｌｌＬ，凡（六亚甲基四胺）：ｎ（对硝基苯酚）＝２：ｌ，反应时间为３．Ｏｈ，反应温度ｉ０５℃，５一硝基水杨醛的产率可达６８．１％。
并对产品进行了红外检测，符合文献值的要求。
关键词５一硝基水杨醛多聚磷酸甲酰化Ｄ皿反应ｈＩｌｐｒｏＶｅｓＵｌｅＭｅｔｈｏｄ０ｆｔｈｅＤｕｆｆＲｅｓｐｏＩｌｓｅｔｏＰｒｅｐａｒｅ５一ｎｉｔｒｏｓａｉｃｙｌ甜ｄｅｈｙｄｅＺｈａｎｇＷｅｉｑｉｎｇＺｏｕＬｉａｎｇｈｕａＺｈｏｕＳｈｉｂｉａｏＺｈａｎｇＲｕ）【ｉａｎｇ（Ｄｅｐａｒｔｍｅｎｔ《ＣｈｅＩＩｌｉｓ叼ａＩｌｄＣｈｅＩｌｌｉｃａｌＥｎ西ｎｅｅｒｉｎｇ，ＨｕｎａＩｌＵｎｉｙｅｒｓｉｔｙｏｆＡｒｔｓａｎｄＳｃｉｅｎｃｅ，ＨｌｌＩｌａｎＣｈａＩｌｇｄｅ４１５０００）Ａｂｓ仃ａｃｔＳｙｌｌｔｈｅｓｉｓｏｆ５一ｌｌｉｔｒｏｓａｉｃｙｌａｌｄｅｈｙｄｅｗａＳｓｔｕｄｉｅｄｂｙｔｈｅｉｍｐｍＶｅｄｍｅｔｈｏｄｏｆｔｈｅＤｕ行ｒｅｓｐｏｎｓｅｗｉ出ｐｏｌｙｐｈｏｓｐｈ耐ｃａｃｉｄ．１１１ｅｅ＆ｃｔｓ０ｆｒｅａｃｔｉｏｎｔｉｍｅａｒＩｄｔｅｍｐｅｍｔｕｒｅｅｔｃｏｎｔｈｅｙｉｅｌｄｏｆ５一ｎｉｔｒｏｓａｉｃｙｌａｌｄｅｈｙｄｅｗｅｒｅａｌｓｏｉｎｖｅｓ・ｔｉｇａｔｅｄ．孙ｅｓｔｕｄｉｅｓｓｈｏｗｅｄｔｈａｔｔｌｌｅ叩ｔｉ姗ｍｃ帆ｄｉｔｉｏ璐ｏｆｔｈｅｒｅａｅｔｉｏｎｗｅｒｅｔｈｅａｒＩｌｏｕｎｔｏｆｔｂｅ７５％ｇａｔｈｅ璐ｔｈｅｐｈｏｓｐｈ耐ｃａｃｉｄ３０ｒＴＩＬ，ｔｈｅｍｏｌｅｍｔｉｏｏｆｌｌｅ】【锄ｅｔｈｙｌｅｎｅｔｅｔｒａｌｌｌｉｎｅｔｏｎｉｔｍｐｈｅｎ０１ｗａｓ２：ｌ，ｔｈｅｒｅａｃｔｉｏｎｔｉｍｅｗ稻ａｂｏｕｔ３．Ｏｈｏｕｒｓ，ｔｈｅｒｅａｃｔｉｏｎｔｅｍｐｅｍｔｕｒｅｗ鹊ａｂｏｕｔ１０５℃．Ｕｎｄｅｒｔｈｅｏｐｔｉｒ眦ｍｃｏｎｄｉｔｉｏｎｓ，ｔｈｅｈｉｇｈｅｓｔｙｉｅｌｄｏｆ５一ｎｉｔｍｓａｉｃｙｌａｌｄｅｈｙｄｅｒｅａｃｈｅｄ６８．１％．强ｅｐＩ。
NI 9219 四通道多功能测试模块说明书
DAT ASHEETNI 92194 AI, 100 S/s/ch Simultaneous, Universal Measurements•Spring-terminal connectivity•Support for Thermocouple (50 S/s/ch), RTD, Resistance,Full-Bridge, Half-Bridge, Quarter-Bridge, V oltage, and Current Measurements•V oltage and current excitation•250 V AC, CAT II, channel-to-channel isolationThe NI 9219 is a universal C Series module designed for multipurpose testing in any NI CompactDAQ or CompactRIO chassis. With the NI 9219, you can measure several signals from sensors such as strain gages, RTDs, thermocouples, load cells, and other poweredsensors. The channels are individually selectable, so you can perform a different measurement type on each of the four channels. Measurement ranges differ for each type of measurement and include up to ±60 V for voltage and ±25 mA for current.Kit ContentsAccessories • NI 9219• NI 9219 Getting Started Guide • Spring-Terminal Tool• NI 9972 Backshell Connector KitNI C Series OverviewNI provides more than 100 C Series modules for measurement, control, and communication applications. C Series modules can connect to any sensor or bus and allow for high-accuracy measurements that meet the demands of advanced data acquisition and control applications.•Measurement-specific signal conditioning that connects to an array of sensors and signals •Isolation options such as bank-to-bank, channel-to-channel, and channel-to-earth ground •-40 °C to 70 °C temperature range to meet a variety of application and environmental needs•Hot-swappableThe majority of C Series modules are supported in both CompactRIO and CompactDAQ platforms and you can move modules from one platform to the other with no modification. CompactRIOCompactRIO combines an open-embedded architecturewith small size, extreme ruggedness, and C Seriesmodules in a platform powered by the NI LabVIEWreconfigurable I/O (RIO) architecture. Each systemcontains an FPGA for custom timing, triggering, andprocessing with a wide array of available modular I/O tomeet any embedded application requirement. CompactDAQCompactDAQ is a portable, rugged data acquisition platformthat integrates connectivity, data acquisition, and signalconditioning into modular I/O for directly interfacing to anysensor or signal. Using CompactDAQ with LabVIEW, youcan easily customize how you acquire, analyze, visualize, andmanage your measurement data.2| | NI 9219 DatasheetSoftwareLabVIEW Professional Development System for Windows•Use advanced software tools for large project development•Generate code automatically using DAQ Assistant and InstrumentI/O Assistant•Use advanced measurement analysis and digital signal processing•Take advantage of open connectivity with DLLs, ActiveX, and .NETobjects•Build DLLs, executables, and MSI installersNI LabVIEW FPGA Module•Design FPGA applications for NI RIO hardware•Program with the same graphical environment used for desktop andreal-time applications•Execute control algorithms with loop rates up to 300 MHz•Implement custom timing and triggering logic, digital protocols, andDSP algorithms•Incorporate existing HDL code and third-party IP including Xilinx IPgenerator functions•Purchase as part of the LabVIEW Embedded Control and MonitoringSuiteNI LabVIEW Real-Time Module•Design deterministic real-time applications with LabVIEWgraphical programming•Download to dedicated NI or third-party hardware for reliableexecution and a wide selection of I/O•Take advantage of built-in PID control, signal processing, andanalysis functions•Automatically take advantage of multicore CPUs or setprocessor affinity manually•Take advantage of real-time OS, development and debuggingsupport, and board support•Purchase individually or as part of a LabVIEW suiteNI 9219 Datasheet| © National Instruments| 3NI 9219 CircuitryCH0CH3•The NI 9219 is channel-to-channel isolated.•Four 24-bit analog-to-digital converters (ADCs) simultaneously sample all four analog input channels.•The NI 9219 enables an excitation circuit for all input modes that require excitation.•The NI 9219 reconfigures the signal conditioning for each measurement type.Voltage Circuitry•The ADC measures voltage across the HI and LO terminals.•The NI 9219 has ±60 V, ±15 V, ±4 V, ±1 V, and ±125 mV voltage ranges.Current Circuitry4 | | NI 9219 DatasheetThe NI 9219 computes current from the voltage that the ADC measures across an internal shunt resistor.Thermocouple Circuitry•The NI 9219 uses the ±125 mV range of the ADC to return a voltage reading.•Each channel has a built-in thermistor for cold-junction compensation (CJC) calculations. 4-Wire Resistance and 4-Wire RTD CircuitryRTD/•The NI 9219 sources a current, which varies based on the resistance of the load, between the EX+ and EX- terminals. The NI 9219 computes measured resistance from theresulting voltage reading.•Lead wire resistance does not affect these measurement types because a negligible amount of current flows across the HI and LO terminals due to the high input impedance of the ADC.3-Wire RTD CircuitryRTDNI 9219 Datasheet| © National Instruments| 5•The NI 9219 sources a current, which varies based on the resistance of the load, between the EX+ and EX- terminals.•The NI 9219 compensates for lead wire resistance in hardware if all the lead wires have the same resistance.•The NI 9219 applies a gain of 2x to the voltage across the negative lead wire and the ADC uses this voltage as the negative reference to cancel the resistance error across the positive lead wire.2-Wire Resistance and Quarter-Bridge Circuitry•The NI 9219 sources a current, which varies based on the resistance of the load, between the HI and LO terminals.•The NI 9219 computes measured resistance from the resulting voltage reading.•2-Wire Resistance and Quarter-Bridge measurement types do not compensate for lead wire resistance.Full-Bridge Circuitry•The ADC reads the HI and LO inputs differentially.•The internal voltage excitation sets the input range of the ADC and returns voltage readings that are proportional to the excitation level. The internal excitation voltagevaries based on the resistance of the sensor.6| | NI 9219 DatasheetHalf-Bridge Circuitry•The HI input is referenced to EX-.•The internal voltage excitation sets the input range of the ADC and returns voltage readings that are proportional to the excitation level. The internal excitation voltagevaries based on the resistance of the sensor.Digital In Circuitry•The NI 9219 has a 60 V unipolar threshold that you can set in software.•The digital in measurement type is only supported in CompactRIO systems.Open Contact Circuitry•The NI 9219 sources a current between the HI and LO terminals and determines if the two terminals are open or closed based on the measured current through the terminals.•When the circuit is open, make sure no more than ±60 V is sourced across the switch.•The open contact measurement type is only supported in CompactRIO systems.NI 9219 Datasheet| © National Instruments| 7Timing ModesThe NI 9219 supports high-resolution, best 50 Hz rejection, best 60 Hz rejection, and high-speed timing modes. High-resolution timing mode optimizes maximum overall noise rejection and provides rejection of 50 Hz and 60 Hz noise . Best 50 Hz rejection optimizes 50 Hz noise rejection. Best 60 Hz rejection optimizes 60 Hz noise rejection. High-speed timing mode optimizes sample rate.NI 9219 SpecificationsThe following specifications are typical for the range -40 °C to 70 °C unless otherwise noted.Caution Do not operate the NI 9219 in a manner not specified in this document.Product misuse can result in a hazard. You can compromise the safety protectionbuilt into the product if the product is damaged in any way. If the product isdamaged, return it to NI for repair.Input CharacteristicsNumber of channels 4 analog input channelsADC resolution24 bitsType of ADC Delta-sigma (with analog prefiltering) Sampling mode SimultaneousType of TEDS supported IEEE 1451.4 TEDS Class 2 (Interface)8| | NI 9219 DatasheetTable 1. Input Ranges (Continued)Conversion time, all channelsNo channels configured as a thermocoupleHigh speed10 msBest 60 Hz rejection110 msBest 50 Hz rejection130 msHigh resolution500 msOne or more channels configured as a thermocoupleHigh speed20 msBest 60 Hz rejection120 msBest 50 Hz rejection140 msHigh resolution510 msOvervoltage protectionTerminals 1 and 2±30 V±60 VTerminals 3 through 6, across anycombinationInput impedanceV oltage and Digital In (±60 V, ±15 V,1 MΩ±4 V)Current< 40 ΩAll other measurement types>1 GΩNI 9219 Datasheet| © National Instruments| 9Table 2. Accuracy±1 °C typicalCold-junction compensation sensoraccuracy12-wire resistance accuracy assumes 0 Ω of lead wire resistance. 2-wire resistance accuracy depends on the lead wire resistance.10| | NI 9219 DatasheetTable 3. StabilityNI 9219 Datasheet| © National Instruments| 11Table 4. Input Noise in ppm of Range (Continued)Input bias current<1 nAINL±15 ppmCMRR (ƒin = 60 Hz)>100 dBNMRRBest 60 Hz rejection90 dB at 60 HzBest 50 Hz rejection80 dB at 50 HzHigh resolution65 dB at 50 Hz and 60 Hz2Excitation level is a characteristic and is not software-selectable.12| | NI 9219 DatasheetTable 5. Half-Bridge, Full-Bridge, Quarter-Bridge, Resistance, and RTD Excitation Level(Continued)MTBF384,716 hours at 25 °C; Bellcore Issue 2,Method 1, Case 3, Limited Part Stress Method Power RequirementsPower consumption from chassisActive mode750 mW maximumSleep mode25 µW maximumThermal dissipation (at 70 °C)Active mode625 mW maximumSleep mode25 µW maximumPhysical CharacteristicsIf you need to clean the module, wipe it with a dry towel.Tip For two-dimensional drawings and three-dimensional models of the C Seriesmodule and connectors, visit /dimensions and search by module number.Spring-terminal wiringGauge0.08 mm2 to 1.0 mm2 (28 AWG to 18 AWG)copper conductor wireWire strip length7 mm (0.28 in.) of insulation stripped from theend2Excitation level is a characteristic and is not software-selectable.NI 9219 Datasheet| © National Instruments| 13Temperature rating90 °C minimumWires per spring terminal One wire per spring terminalConnector securementSecurement type Screw flanges providedTorque for screw flanges0.2 N · m (1.80 lb · in.)Weight156 g (5.5 oz)Safety VoltagesConnect only voltages that are within the following limits.Channel-to-channelContinuous250 V AC, Measurement Category IIWithstand1,390 V AC, verified by a 5 s dielectricwithstand testChannel-to-earth groundContinuous250 V AC, Measurement Category IIWithstand2,300 V AC, verified by a 5 s dielectricwithstand testZone 2 hazardous locations applications in Europe60 VDC, Measurement Category IChannel-to-channel and channel-to-earth groundMeasurement Category I is for measurements performed on circuits not directly connected to the electrical distribution system referred to as MAINS voltage. MAINS is a hazardous live electrical supply system that powers equipment. This category is for measurements of voltages from specially protected secondary circuits. Such voltage measurements include signal levels, special equipment, limited-energy parts of equipment, circuits powered by regulated low-voltage sources, and electronics.Caution If using in Division 2 or Zone 2 hazardous locations applications, do notconnect the NI 9219 to signals or use for measurements within MeasurementCategories II, III, or IV.Note Measurement Categories CAT I and CAT O are equivalent. These test andmeasurement circuits are not intended for direct connection to the MAINS buildinginstallations of Measurement Categories CAT II, CAT III, or CAT IV. Measurement Category II is for measurements performed on circuits directly connected to the electrical distribution system. This category refers to local-level electrical distribution, such as that provided by a standard wall outlet, for example, 115 V for U.S. or 230 V for Europe.14| | NI 9219 DatasheetCaution Do not connect the NI 9219 to signals or use for measurements withinMeasurement Categories III or IV.Hazardous LocationsU.S. (UL)Class I, Division 2, Groups A, B, C, D, T4;Class I, Zone 2, AEx nA IIC T4Canada (C-UL)Class I, Division 2, Groups A, B, C, D, T4;Class I, Zone 2, Ex nA IIC T4Europe (ATEX) and International (IECEx)Ex nA IIC T4 GcSafety and Hazardous Locations StandardsThis product is designed to meet the requirements of the following electrical equipment safety standards for measurement, control, and laboratory use:•IEC 61010-1, EN 61010-1•UL 61010-1, CSA 61010-1•EN 60079-0:2012, EN 60079-15:2010•IEC 60079-0: Ed 6, IEC 60079-15; Ed 4•UL 60079-0; Ed 5, UL 60079-15; Ed 3•CSA 60079-0:2011, CSA 60079-15:2012Note For UL and other safety certifications, refer to the product label or the OnlineProduct Certification section.Electromagnetic CompatibilityThis product meets the requirements of the following EMC standards for sensitive electrical equipment for measurement, control, and laboratory use:•EN 61326 (IEC 61326): Class A emissions; Industrial immunity•EN 55011 (CISPR 11): Group 1, Class A emissions•AS/NZS CISPR 11: Group 1, Class A emissions•FCC 47 CFR Part 15B: Class A emissions•ICES-001: Class A emissionsNote For the standards applied to assess the EMC of this product, refer to theOnline Product Certification section.CE ComplianceThis product meets the essential requirements of applicable European Directives, as follows:•2014/35/EU; Low-V oltage Directive (safety)•2014/30/EU; Electromagnetic Compatibility Directive (EMC)•94/9/EC; Potentially Explosive Atmospheres (ATEX)NI 9219 Datasheet| © National Instruments| 15Online Product CertificationRefer to the product Declaration of Conformity (DoC) for additional regulatory compliance information. To obtain product certifications and the DoC for this product, visit / certification, search by model number or product line, and click the appropriate link in the Certification column.Shock and VibrationTo meet these specifications, you must panel mount the system.Operating vibrationRandom (IEC 60068-2-64) 5 g rms, 10 Hz to 500 HzSinusoidal (IEC 60068-2-6) 5 g, 10 Hz to 500 HzOperating shock (IEC 60068-2-27)30 g, 11 ms half sine; 50 g, 3 ms half sine;18 shocks at 6 orientations EnvironmentalRefer to the manual for the chassis you are using for more information about meeting these specifications.-40 °C to 70 °COperating temperature(IEC 60068-2-1, IEC 60068-2-2)-40 °C to 85 °CStorage temperature(IEC 60068-2-1, IEC 60068-2-2)Ingress protection IP40Operating humidity (IEC 60068-2-78)10% RH to 90% RH, noncondensing Storage humidity (IEC 60068-2-78)5% RH to 95% RH, noncondensing Pollution Degree2Maximum altitude2,000 mIndoor use only.Environmental ManagementNI is committed to designing and manufacturing products in an environmentally responsible manner. NI recognizes that eliminating certain hazardous substances from our products is beneficial to the environment and to NI customers.For additional environmental information, refer to the Minimize Our Environmental Impact web page at /environment. This page contains the environmental regulations and directives with which NI complies, as well as other environmental information not included in this document.16| | NI 9219 DatasheetWaste Electrical and Electronic Equipment (WEEE) EU Customers At the end of the product life cycle, all NI products must bedisposed of according to local laws and regulations. For more information abouthow to recycle NI products in your region, visit /environment/weee.电子信息产品污染控制管理办法（中国RoHS）中国客户National Instruments符合中国电子信息产品中限制使用某些有害物质指令(RoHS)。
聚氨酯催化剂产品大全
一、美国气体产品编号公司产品编号产品介绍胺类催化剂DABCO 33LVR A-33 33%三乙烯二胺的二丙二醇溶液，工业标准产品。
三乙烯二胺的化学结构很独特，是一种笼状化合物，两个氮原子上连接三个亚乙基。
这个双分子的结构非常密集和对称。
从结构式上可以看出来，N原子上没有位阻很大的取代基，它的一对空电子容易接近。
在发泡体系中，一旦氨基甲酸酯键生成后，它就会游离出来，有利于更进一步催化。
由于这个原因，虽然三乙烯二胺不是强碱，却对异氰酸酯基团和活泼氢化合物的反应表现出极高的催化活性。
是一种强凝胶催化剂。
其他公司相同产品牌号，美国GE：NIAX Catalyst A-33；日本东曹：TEDA L33；国内厂家一般用A-33作产品名。
DABCOR 1027 1027 改性三乙烯二胺，用于单乙醇聚酯及聚醚鞋底原液系统，能调整纤维及脱模时间。
DABCO 10281028 改性三乙烯二胺，用于1，4丁二醇聚酯及聚醚鞋底原液系统，能调整纤维及脱模时间。
DABCO 8154 8154 延迟性三乙烯二胺型催化剂，可改善泡沫流动性。
延迟性三乙烯二胺,可改善泡沫流动性. 配方需要一段延迟的起始时间，或配方需用大量传统催化剂才能获得完全得泡沫固化。
该催化剂的催化中心是由一种氨酸盐加以化学抑制，此项催化剂内含多种不同组合的氨酸盐，因而能提供规则的发泡曲线。
再者，此项产品的腐蚀性远较其它延迟作用催化剂为低。
用途：该产品适用于所有方便注模、合模，以及改良流程模塑泡沫用。
在此配方中的唯一氨基凝胶催化剂(或Y-33催化共享)。
因此，该催化能大大提高整模塑泡沫工序的加工效率。
在模塑及板材配方中，该催化剂可用作共催化。
在用的氨基催化剂中可加用此品高至 25％，以致更佳的固化而不影响前端的化学反DABCO B16 B16 改善表面固化，适用于模塑及其他自结皮系统。
DABCO BDMA BDMA 减低于高水份配方中产生之脆性及表面固化。
二甲基苄胺减低于高水份配方中产生之脆性及表面固化。
Compounds and methods for modulating cxcr3 functio
专利名称：Compounds and methods for modulating cxcr3 function发明人：THOMAS J. SCHALL,DANIEL J.DAIRAGHI,BRIAN E. MCMASTER申请号：AU7080500申请日：20000825公开号：AU7080500A公开日：20010326专利内容由知识产权出版社提供摘要：The invention provides compounds and compositions of the formula: wherein, the subscript n is an integer of from 0 to 4; Ar is a member selected from the group consisting of substituted or unsubstituted aryl and substituted or unsubstituted heteroaryl, R1 is a member selected from the group consisting of substituted or unsubstituted (C5-C15)alkyl and (C8-C14)acyl group; R2 is a member selected from the group consisting of substituted or unsubstituted (C1-C8)alkyl; each R3 is independently a substituent Y is a member selected from the group consisting of substituted or unsubstituted (C2-C8)alkylene and substituted or unsubstituted (C2-C8)heteroalkylene; Z is -NR4R5 R4 and R5 are independently selected from the group consisting of hydrogen and (C1-C8)alkyl or taken together with the nitrogen atom to which each is attached to form a heterocyclyl or heteroaryl; These compounds and compositions bind to the CXCR3 chemokine receptor and are useful for treating diseases and conditions responsive to the modulation of CXCR3 activity, such as multiple sclerosis, rheumatoid arthritis, psoriasis, cancer, infectious disease, angiogenesis, and graft rejection.申请人：CHEMOCENTRYX, INC.更多信息请下载全文后查看。
化学品英文名称
Filling material A AC 45 UBI / FR 310 5000 Acetic acid (5% at 20°C) Acetic acid (5% at 50°C) Acetic acid (at 40°C) Acetic acid (at 50°C) Acetic acid anhydride Acetoacetate, ethylAcetoacetate, methylAcetone Acetulan Acetyl chloride Acricid 40 EC Acricid liquid Acryl amide Acrylat 38092, solvent base Acrylic acid Acrylic Polymere RDZ 1263 Acrylic Polymere RDZ 2738 Acrylic Polymere RDZ 2771 Acrylic Polymere RDZ 958 Acrylic Polymere RZ 20810 Acrylic Polymere RZ 21376 Acrylic Polymere RZ 421 Activated carbon Activoll EFL Addipast 350 WD black Additol XK 391 Additol XK 406 Adhesion Promoter AMS 70 After Shave Afugan Aircraft fuel Aircraft fuel, Jet A1 Akypo RO 90 VG Akypo RO 90 VG Aldehyde C12 Aldehyde C8 Aldurol VUP 21 Aldurol VUP 51 Alkydal R 35 W Allylic heptylate
FTY720 (S)-Phosphate说明书
1. PRODUCT AND COMPANY IDENTIFICATION1.1 Product identifierProduct name :FTY720 (S)-Phosphate Catalog No. :HY-15382CAS No. :402616-26-61.2 Relevant identified uses of the substance or mixture and uses advised against Identified uses :Laboratory chemicals, manufacture of substances.1.3 Details of the supplier of the safety data sheetCompany:MedChemExpress USA Tel:609-228-6898Fax:609-228-5909E-mail:1.4 Emergency telephone numberEmergency Phone #:609-228-68982. HAZARDS IDENTIFICATION2.1 Classification of the substance or mixtureNot a hazardous substance or mixture.2.2 GHS Label elements, including precautionary statementsNot a hazardous substance or mixture.2.3 Other hazardsNone.3. COMPOSITION/INFORMATION ON INGREDIENTS3.1 SubstancesSynonyms:(S)-FTY720P; (S)-FTY720 phosphate Formula:C 19H 34NO 5P Molecular Weight:387.45CAS No. :402616-26-64. FIRST AID MEASURES4.1 Description of first aid measuresEye contactRemove any contact lenses, locate eye-wash station, and flush eyes immediately with large amounts of water. Separate eyelids with fingers to ensure adequate flushing. Promptly call a physician. Skin contactSafety Data SheetRevision Date:Feb.-22-2021Print Date:Jan.-22-2023Inhibitors •Screening Libraries•ProteinsRinse skin thoroughly with large amounts of water. Remove contaminated clothing and shoes and call a physician.InhalationImmediately relocate self or casualty to fresh air. If breathing is difficult, give cardiopulmonary resuscitation (CPR). Avoid mouth-to-mouth resuscitation.IngestionWash out mouth with water; Do NOT induce vomiting; call a physician.4.2 Most important symptoms and effects, both acute and delayedThe most important known symptoms and effects are described in the labelling (see section 2.2).4.3 Indication of any immediate medical attention and special treatment neededTreat symptomatically.5. FIRE FIGHTING MEASURES5.1 Extinguishing mediaSuitable extinguishing mediaUse water spray, dry chemical, foam, and carbon dioxide fire extinguisher.5.2 Special hazards arising from the substance or mixtureDuring combustion, may emit irritant fumes.5.3 Advice for firefightersWear self-contained breathing apparatus and protective clothing.6. ACCIDENTAL RELEASE MEASURES6.1 Personal precautions, protective equipment and emergency proceduresUse full personal protective equipment. Avoid breathing vapors, mist, dust or gas. Ensure adequate ventilation. Evacuate personnel to safe areas.Refer to protective measures listed in sections 8.6.2 Environmental precautionsTry to prevent further leakage or spillage. Keep the product away from drains or water courses.6.3 Methods and materials for containment and cleaning upAbsorb solutions with finely-powdered liquid-binding material (diatomite, universal binders); Decontaminate surfaces and equipment by scrubbing with alcohol; Dispose of contaminated material according to Section 13.7. HANDLING AND STORAGE7.1 Precautions for safe handlingAvoid inhalation, contact with eyes and skin. Avoid dust and aerosol formation. Use only in areas with appropriate exhaust ventilation.7.2 Conditions for safe storage, including any incompatibilitiesKeep container tightly sealed in cool, well-ventilated area. Keep away from direct sunlight and sources of ignition.Recommended storage temperature:Powder-20°C 3 years* The compound is unstable in solutions, freshly prepared is recommended.Shipping at room temperature if less than 2 weeks.7.3 Specific end use(s)No data available.8. EXPOSURE CONTROLS/PERSONAL PROTECTION8.1 Control parametersComponents with workplace control parametersThis product contains no substances with occupational exposure limit values.8.2 Exposure controlsEngineering controlsEnsure adequate ventilation. Provide accessible safety shower and eye wash station.Personal protective equipmentEye protection Safety goggles with side-shields.Hand protection Protective gloves.Skin and body protection Impervious clothing.Respiratory protection Suitable respirator.Environmental exposure controls Keep the product away from drains, water courses or the soil. Cleanspillages in a safe way as soon as possible.9. PHYSICAL AND CHEMICAL PROPERTIES9.1 Information on basic physical and chemical propertiesAppearance SolidOdor No data availableOdor threshold No data availablepH No data availableMelting/freezing point No data availableBoiling point/range No data availableFlash point No data availableEvaporation rate No data availableFlammability (solid, gas)No data availableUpper/lower flammability or explosive limits No data availableVapor pressure No data availableVapor density No data availableRelative density No data availableWater Solubility No data availablePartition coefficient No data availableAuto-ignition temperature No data availableDecomposition temperature No data availableViscosity No data availableExplosive properties No data availableOxidizing properties No data available9.2 Other safety informationNo data available.10. STABILITY AND REACTIVITY10.1 ReactivityNo data available.10.2 Chemical stabilityStable under recommended storage conditions.10.3 Possibility of hazardous reactionsNo data available.10.4 Conditions to avoidNo data available.10.5 Incompatible materialsStrong acids/alkalis, strong oxidising/reducing agents.10.6 Hazardous decomposition productsUnder fire conditions, may decompose and emit toxic fumes.Other decomposition products - no data available.11.TOXICOLOGICAL INFORMATION11.1 Information on toxicological effectsAcute toxicityClassified based on available data. For more details, see section 2Skin corrosion/irritationClassified based on available data. For more details, see section 2Serious eye damage/irritationClassified based on available data. For more details, see section 2Respiratory or skin sensitizationClassified based on available data. For more details, see section 2Germ cell mutagenicityClassified based on available data. For more details, see section 2CarcinogenicityIARC: No component of this product present at a level equal to or greater than 0.1% is identified as probable, possible or confirmed human carcinogen by IARC.ACGIH: No component of this product present at a level equal to or greater than 0.1% is identified as a potential or confirmed carcinogen by ACGIH.NTP: No component of this product present at a level equal to or greater than 0.1% is identified as a anticipated or confirmed carcinogen by NTP.OSHA: No component of this product present at a level equal to or greater than 0.1% is identified as a potential or confirmed carcinogen by OSHA.Reproductive toxicityClassified based on available data. For more details, see section 2Specific target organ toxicity - single exposureClassified based on available data. For more details, see section 2Specific target organ toxicity - repeated exposureClassified based on available data. For more details, see section 2Aspiration hazardClassified based on available data. For more details, see section 2Additional informationThis information is based on our current knowledge. However the chemical, physical, and toxicological properties have not been completely investigated.12. ECOLOGICAL INFORMATION12.1 ToxicityNo data available.12.2 Persistence and degradabilityNo data available.12.3 Bioaccumlative potentialNo data available.12.4 Mobility in soilNo data available.12.5 Results of PBT and vPvB assessmentPBT/vPvB assessment unavailable as chemical safety assessment not required or not conducted.12.6 Other adverse effectsNo data available.13. DISPOSAL CONSIDERATIONS13.1 Waste treatment methodsProductDispose substance in accordance with prevailing country, federal, state and local regulations.Contaminated packagingConduct recycling or disposal in accordance with prevailing country, federal, state and local regulations.14. TRANSPORT INFORMATIONDOT (US)Proper shipping name: Not dangerous goodsUN number: -Class: -Packing group: -IMDGProper shipping name: Not dangerous goodsUN number: -Class: -Packing group: -IATAProper shipping name: Not dangerous goodsUN number: -Class: -Packing group: -15. REGULATORY INFORMATIONSARA 302 Components:No chemicals in this material are subject to the reporting requirements of SARA Title III, Section 302.SARA 313 Components:This material does not contain any chemical components with known CAS numbers that exceed the threshold (De Minimis) reporting levels established by SARA Title III, Section 313.SARA 311/312 Hazards:No SARA Hazards.Massachusetts Right To Know Components:No components are subject to the Massachusetts Right to Know Act.Pennsylvania Right To Know Components:CAS No.FTY720 (S)-Phosphate402616-26-6New Jersey Right To Know Components:CAS No.FTY720 (S)-Phosphate402616-26-6California Prop. 65 Components:This product does not contain any chemicals known to State of California to cause cancer, birth defects, or anyother reproductive harm.16. OTHER INFORMATIONCopyright 2023 MedChemExpress. The above information is correct to the best of our present knowledge but does not purport to be all inclusive and should be used only as a guide. The product is for research use only and for experienced personnel. It must only be handled by suitably qualified experienced scientists in appropriately equipped and authorized facilities. The burden of safe use of this material rests entirely with the user. MedChemExpress disclaims all liability for any damage resulting from handling or from contact with this product.Caution: Product has not been fully validated for medical applications. For research use only.Tel:609-228-6898Fax:609-228-5909E-mail:***********************Address: 1 Deer Park Dr, Suite Q, Monmouth Junction, NJ 08852, USA。
SpheripolΠ聚丙烯产品介绍-
H22S
38
在高速纺生产线生产的窄分子量分布牌号的低旦尼尔CF,用于纺粘,无纺布纤维用于农业,工业和医疗,用于家具和地毯工业的包装和背衬.
H39S
35
极低旦尼尔BCF,CF,适用于在短和长纺线上高速纺,具有极佳的抗气体褪色性能.捆束条,包装带和方向盘套.
MOPLEN 牌号多元共聚物嵌段—2
牌号
M．F．R
硬度平衡牌号，特别制定用于管道和波纹管；适用于其它的挤出技术，波纹管和片挤出；挤出吹塑；配件；汽车和仪表部件。
EPT30M
注塑玩具、体育用品、小型容器，家用器皿，盖和罩，汽车和仪表部件；热成型用挤出片材。
EPT30R
注塑桶、运输板条箱或具有高抗冲的冷藏容器；汽车和仪表部件；家具；座椅，玩具，衣箱；挤出的片材用于热成型。
Z30G
25
薄壁制品,一般包装材料;家庭用具,厨房用品;用于共混改性的基础聚合物.
H32GA
35
薄壁制品用于食品和化妆品工业;笔;磁带盒;设备;办公室辅助设施.
ADXP770
45
高刚性牌号,挠曲模量超过2000Mpa.薄壁注塑应用作为食品容器&盒.耐温机械上的部件.
MOPLEN/ADSTIF牌号均聚物双向拉伸膜-1
10
注塑容器，具有极好的透明度和光泽度，应用于食品、家用器皿、化妆品；各种容器的盖子和罩子。拉伸吹塑小/中型空心部件，可用于一单步和两步成型加工工艺。
EP2Z29G
25
透明度是首要要求的注塑制品，如：家用器皿，音像盒，奶制品的管和盒，盖。可用于一单步和两步成型加工拉伸吹塑的小/中型容器。
EP2H49G
FS FORTH-SYSTEME GmbH Mod520C_2 产品说明书
Mod520C_2P.O. Box 11 03l D-79200 Breisach, Germany Kueferstrasse 8l D-79206 Breisach, Germany (+49 (7667) 908-0 l Fax +49 (7667) 908-200 l e-mail:****************Mod520C_2© Copyright 2004:FS FORTH-SYSTEME GmbHPostfach 1103, D-79200 Breisach a. Rh., GermanyRelease of Document:May 27, 2004Filename:Mod520C_2.docAuthor:Hans-Peter SchneiderAll rights reserved. No part of this document may be copied or reproduced in any form or by any means without the prior written consent of FS FORTH-SYSTEME GmbH.2Mod520C_2 Table of Contents1.Introduction (4)2.Features (5)3.Functional Description (6)3.1.1.CPU AMD ÉlanSC520 (6)3.1.2.SDRAM stage (6)3.1.3.ROM stage (6)3.1.4.SRAM stage (6)3.1.5.32 I/O Ports (7)3.1.6.256 Byte EEPROM for BIOS and Applications on PIO30,31 (7)3.1.7.On-board Power Supply (7)3.1.8.Voltage Supervision, RESET Generation (7)3.1.9.Serial Ports (7)3.1.10.Fast Ethernet Controller Stage (8)3.1.11.Dual CAN Controller Stage (8)3.1.12.GP Bus used for ISA Bus (9)4.Connectors Of MOD520C (10)4.1.System Connector X2 (10)4.2.System Connector X4 (12)5.Application Notes (14)5.1.Power Supply (14)5.2.Important Signals (14)5.2.13.PCICLKRTN PCICLK PCICLKETHER (14)5.2.14.ISA-Bus Signals (14)5.2.15.CAN-Interrupt IRQ11 (15)6.Members of the MOD520C family (16)3Mod520C_21. IntroductionThe module MOD520C with its integrated and optional peripherals, based on the 32 Bit AMD ÉlanSC520 microcontroller, is designed for medium to high performance applications in telecommunication, data communication and information appliances on the general embedded market. It can easily be designed in customized boards.The AMD ÉlanSC520 microcontroller combines a low voltage 586 CPU running on 133 MHz, including FPU (Floating Point Unit) with a set of integrated peripherals: 32 Bit PCI controller, SDRAM controller for up to 256 MByte, GP (General Purpose) bus with programmable timing and ROM/Flash controller. Enhanced PC compatible peripherals like DMA controller, two UARTs and battery buffered RTC and CMOS, watchdog and software timers make this device a very fast system for both real time and PC/AT compatible applications. Insyde Software’s Mobile BIOS is available which offers serial and parallel remote features (video, keyboard, floppy). Furthermore FS FORTH-SYSTEME has adapted Datalight Sockets (TCP/IP Stack), ROM-DOS and the Flash File System FlashFX to this environment.The MOD520C offers the software engineer the possibility to reduce the time-to-market phase even more. FS FORTH-SYSTEME added several features on-board as SDRAM (up to 64 MByte), PCI Fast Ethernet controller to facilitate networking and remote control. A Strata-FLASH for booting and data is included on board. Two CAN Ports are additionally available for communication. 512 Kbyte SRAM is available for battery buffered data. The enhanced JTAG port for low-cost debugging is supported. This allows instruction tracing during execution. FS FORTH-SYSTEME has adapted Windows CE 3.0 to this platform and offers drivers and support. With Ethernet debugging the software designer has powerful means for fast debugging his applications.Due to the 16 MByte FLASH it is possible to build larger, complete systems on this module like Linux, QNX or VxWorks.4Mod520C_252. Features• 16 MByte STRATA-FLASH or 2 MByte AMD FLASH • 64 MByte or 16 MByte SDRAM • 512 KByte battery buffered SRAM• PCI Ethernet controller with EEPROM. Rx and Tx signals are providedon the System Connectors • Two CAN-Buses.• Enhanced JTAG port available on System Connector.• GP-Bus signals available on System Connector • PCI-Bus signals available on System Connector• BIOS for ÉlanSC520 by Insyde Software Inc. Including serial or parallelremote features (Video, Keyboard, Floppy).Mod520C_23. Functional Description3.1.1. CPU AMD ÉlanSC520The CPU AMD ÉlanSC520 is powered with 2.5V (core and analog path) and 3.3V (all other voltages) except VRTC, which is powered with about 3V either from battery or from on-board 3.3V. This voltage is limited to 3.3V, the other 3.3V power planes have a limit of 3.6V.The CPU is clocked with a 32.768 kHz quartz. An internal PLL derives from this frequency the RTC clock and DRAM refresh clock and the clocks for PC/AT compatible PIT (1.1882 MHz) and UARTs (18.432 MHz). All other stages (CPU, PCI, GP bus, GP DMA, ROM, SSI, timers) are fed from the second clock generator driven by a 33.33 MHz clock oscillator. SDRAM is clocked with 66.66 MHz.3.1.2. SDRAM stageThe SDRAM (up to 128 MByte on-board) has its own DRAM bus containing memory addresses MA0..12, memory data MD0..31 and control signals for up to four banks. Due to small load no buffering of clocks and signals is necessary.3.1.3. ROM stageROM or FLASH are driven by the general purpose address bus GPA0..25. It has three programmable chip selects with each up to 64 MByte range. The ROM Data bus is either the 32 bit general purpose bus GPD0..31 or the memory data bus MD0..31. Configuration pins decide, which bus at boot time is used. The bus size is selectable with 8, 16 or 32 bit. The MOD520C has a FLASH IC for up to 16 MByte 16 bit ROM or FLASH selected by BOOTCS# connected to MD0..15. 3.1.4. SRAM stageThe SRAM (512 KByte on-board) is buffered by VBAT. The Memory Location is defined in the System BIOS. ROMCS1# is used to access the SRAM.6Mod520C_23.1.5. 32 I/O PortsThe ÉlanSC520 CPU has 32 I/O ports. They have alternate functions. Most of them are control signals for GP bus (PIO0..26) used as ISA-bus. PIO27 (GPCS0#) is used as a programmable external chip select and PIO28,29 are not connected. PIO30,31 are used to drive a serial parameter EEPROM on-board. 3.1.6. 256 Byte EEPROM for BIOS and Applications on PIO30,31An on-board serial EEPROM with 256 byte and I2C bus is controlled by PIO30 (I2CDAT) and PIO31 (I2CCLK). 128 byte are used for non-volatile BIOS defaults, the remaining range may contain application specific data and parameters. The BIOS contains calls to read and write to this memory (see BIOS documentation).3.1.7. On-board Power SupplyThe 2.5V on-board voltage is generated from +5V.An external battery may be connected to the signal VBATIN. Battery status is controlled by BBATSEN, which sets a power fail bit in a status register for RTC, if BBATSEN is low at power-up.3.1.8. Voltage Supervision, RESET GenerationThree voltages are used on board: +2.5V, +3.3V and +5V. U2 controls +5V and U10 controls +3.3V. LBOUT or PWRGOOD will become low, if these voltages are out of tolerance. An external SRESET# is wired or-ed to U10. It can also be activated from extended JTAG signal SRESET# via X1. The wired OR of 1RESET# and 2RESET# control U10. Its output PWRGOOD is low (not active), if either the signals described above from U10 are low or +5V is out of tolerance. Typical length of PWRGOOD low is longer than 1 sec (minimum 790 msec).3.1.9. Serial PortsThe AMD ÉlanSC520 CPU has two internal asynchronous ports and one synchronous serial port. Both of this ports are available at the System Connectors.7Mod520C_23.1.10. Fast Ethernet Controller StageConnected to the PCI bus device 0 (REQ/GNT0#) of the Élan SC520 CPU, a Fast Ethernet Controller U7 supports 10/100Mbps transfer depending on driver software. X3 is a JST B5B-PH-SM3 5 pin connector. Parameters as physical address and power down modes are stored in a 64X16 bit Serial EEPROM controlled by U7. 2 status LEDs LE1, LE2 show the state of the Ethernet connection. For a more detailed hardware and software description see Intel 82559ER manual.3.1.11. Dual CAN Controller StageThe CAN Controller is selected via ROMCS1# and the Memory location is selectable in the BIOS Setup Screen. The CAN Interrupt provided by 82C900 is inverted by the onboard Lattice CPLD. Since the Interrupt asserted by the 82C900 is only a low active pulse of 0.2µs the CPLD holds the interrupt active until the software accesses the Memory at the location CAN-Base+1xxh. The BIOS routes this interrupt to IRQ11.8Mod520C_2 3.1.12. GP Bus used for ISA BusThe AMD ÉlanSC520 CPU contains an 8/16bit General Purpose Bus (GP bus) with 26 address lines (GPA0..25), 16 data lines (GPD0..15) and different control lines using PIO ports in their alternate GP bus function. Its timing is programmable for speeds up to 33MHz. This bus is to emulate a 16 bit ISA bus (PC/104) running with 8 MHz. ISA bus signal are connected without buffers directly to the lines of the CPU due to the 5V tolerance of the 3.3V signals.8 bit signals SMEMRD# and SMEMWR# (active only at addresses beyond 1 MByte) are not supported (GPMEM_RD# and GPMEM_WR# used).The AMD ÉlanSC520 CPU has only 4 DMA channels on GP bus. DMA channel 2 is used for Super-I/O (U2) on EVAMOD520. All four channels are connected to edge connector X2.Not supported ISA bus signals 0WS#, IOCHK#, IRQ15, REFRESH#, 8MHz and 14.318 MHz clocks, MASTER#.9Mod520C_24. Connectors Of MOD520C4.1. System Connector X2Pin Function I/O Pin Function I/O1+3.3V power2GND power 3+3.3V power4GND power 5GPD0I/O6TDP O7GPD1I/O8TDN O9GPD2I/O10not connected11GPD3I/O12RDP I13GPD4I/O14RDN I15GPD5I/O16not connected17GPD6I/O18DRQ0I19GPD7I/O20DRQ2I21GPD8I/O22DRQ5I23GPD9I/O24DRQ7I25GPD10I/O26DACK0#O27GPD11I/O28DACK2#O29GPD12I/O30DACK5#O31GPD13I/O32DACK7#O33GPD14I/O34GND power 35GPD15I/O36GPRESET O37GND power38GPIORD#O39GPA0O40GPIOWR#O41GPA1O42GPALE O43GPA2O44GPBHE#O45GPA3O46GPRDY I47GPA4O48GPAEN O49GPA5O50GPTC O51GPA6O52GPDBUFOE#O53GPA7O54GPIO_CS16#O55GPA8O56GPMEM_CS16#O57GPA9O58GPCS0#O59GPA10O60GPMEM_RD#O61GPA11O62GPMEM_WR#O63GPA12O64GND power 10Pin Function I/O Pin Function I/O65GPA13O66EXTRES#I67GPA14O68PWRGOOD O69BUFA15O70CLKTEST71BUFA16O72PRG_RESET73BUFA17O74GND power75BUFA18O76GPCS1#O77BUFA19O78GPCS2#O79BUFA20O80GPCS3#O81BUFA21O82GPCS4#O83BUFA22O84GPCS5#O85BUFA23O86GPCS6#O87BUFA24O88GPCS7#O89BUFA25O90VBATIN power91GND power92GND power93IRQ1I94RSTLD0I95IRQ3I96RSTLD1I97IRQ4I98RSTLD2I99IRQ5I100RSTLD3I101IRQ6I102RSTLD4I103IRQ7I104RSTLD5I105IRQ9I106RSTLD6I107IRQ10I108RSTLD7I109CANINT I110DBGDIS I111IRQ12I112INSTRC I113IRQ14I114DBGENTR I115SPEAKER O116not connected117+5V power118GND power119+5V power120GND power114.2. System Connector X4Pin Function I/O Pin Function I/O1PCICLKRTN I2GND power 3PCICLK O4PCICLKETHER I5AD0I/O6CBE0#I/O7AD1I/O8CBE1#I/O9AD2I/O10CBE2#I/O11AD3I/O12CBE3#I/O13AD4I/O14not connected15AD5I/O16not connected17AD6I/O18not connected19AD7I/O20not connected21AD8I/O22GND power 23AD9I/O24RXD1I25AD10I/O26TXD1O27AD11I/O28CTS1#I29AD12I/O30DCD1#I31AD13I/O32DSR1#I33AD14I/O34RIN1#I35AD15I/O36DTR1#O37AD16I/O38RTS1#O39AD17I/O40RXD2I41AD18I/O42TXD2O43AD19I/O44CTS2#I45AD20I/O46DCD2#I47AD21I/O48DSR2#I49AD22I/O50RIN2#I51AD23I/O52DTR2#O53AD24I/O54RTS2#O55AD25I/O56CANH1/TXD157AD26I/O58CANL1/RXD159AD27I/O60CANH2/TXD261AD28I/O62CANL2/RXD263AD29I/O64GND power 12Pin Function I/O Pin Function I/O65AD30I/O66SRESET#I67AD31I/O68GPRESET#O69GND power70TCK O71INTA#I72TMS73INTB#I74TDI I75INTC#I76TDO O77INTD#I78TRST#I79REQ0#I80CMDACK81REQ1#I82BR/TC83REQ2#I84GND Power85REQ3#I86STOP/TX87REQ4#I88TRIG/TRACE89GNT0#O90not connected91GNT1#O92ACTLED#O93GNT2#O94LILED#O95GNT3#O96SPEEDLED#O97GNT4#O98not connected99GND power100GND power101PAR I/O102SSI_CLK O103PERR#I/O104SSI_DO O105SERR#I106SSI_DI I107FRAME#I/O108not connected109TRDY#I/O110ISP_TDI I111IRDY#I/O112ISP_TDO O113STOP#I/O114ISP_TMS115DEVSEL#I/O116ISP_TCK I117RST#O118BSCAN#119GND power120GND power135. Application Notes5.1. Power SupplyThe MOD520C needs +3.3V and 5V power supply.3.3V worst case supply current is 1130 mA5V worst case supply current is 550 mABe sure to design your power supply for this current including large load transients.5.2. Important Signals5.2.13. PCICLKRTN PCICLK PCICLKETHERPCICLK is the clock source for the PCI-Bus. PCICLKETHER is the clock input for the Ethernet Controller. PCICLKRTN is the clock input of the AMD Élan Sc520. This pin is used to synchronize the CPU with the external PCI-Bus. Therefore it is important that all clock traces have the same length to provide each PCI-Target with the clock at the same time. Trace length of each of this clocks is 68mm on the module. If you do not plan to connect an additional PCI-Target on your board you just add a serial resistor 33R between PCICLK and PCICLKRTN and one between PCICLK and PCICLKETHER.5.2.14. ISA-Bus SignalsIf you use the ISA-Bus Signals you have to add some resistors to the following Signals:GPD0 – GPD15 4k7 pull upGPRDY1k pull downIRQ´s10k pull upDRQ´s10k pull down145.2.15. CAN-Interrupt IRQ11IRQ11 is used for the CAN-Controller 82C900 and is not sharable. Since the interrupt provided by 82C900 is a low active pulse with a length of 0.2µs the CPLD inverts this signal and holds it until the software acknowledges the interrupt. To acknowledge this interrupt the software has to access a memory location with the offset 1xxh to the CAN-Base. This memory access is just an access of the system memory, not an access of the CAN-Controller.156. Members of the MOD520C familyNumbe r Variant Flash SDRAM SRAM CAN CAN-DriverTemp.320MOD520C_0_V018M*16, Strata(=16 Mbyte)1*TM014452*4M*16(=16 Mbyte)2*TM01519512k*8Yes Yes0..70°321MOD520C_0_V021M*16, AMD(=2 Mbyte)1*TM015202*4M*16(=16 Mbyte)2*TM01519512k*8Yes Yes0..70°322MOD520C_0_V038M*16, Strata(=16 Mbyte)1*TM014452*16M*16(=64 Mbyte)2*TM01249512k*8Yes Yes0..70°334MOD520C_1_V01MOD520C_2_V018M*16, Strata(=16 Mbyte)1*TM014452*4M*16(=16 Mbyte)2*TM01519512k*8TM0Yes no0..70°335MOD520C_1_V02MOD520C_2_V021M*16, AMD(=2 Mbyte)1*TM015202*4M*16(=16 Mbyte)2*TM01519512k*8TM0Yes no0..70°336MOD520C_1_V03MOD520C_2_V038M*16, Strata(=16 Mbyte)1*TM014452*16M*16(=64 Mbyte)2*TM01249512k*8TM0Yes no0..70°184MOD520C_1_V048M*16, Strata(=16 Mbyte)1*TM014452*4M*16(=16 Mbyte)2*TM01519No No No0..70°16。
Duff反应
Duff反应（Duff reaction，达夫反应），又称“六亚甲基四胺甲酰化反应”
用六亚甲基四胺（乌洛托品）对芳香族化合物进行甲酰化。
[1][2][3][4][5][6]
此反应为亲电芳香取代，其中亲电试剂为乌洛托品衍生出的亚胺离子CH2+NR2。
一碳的甲酰基来源于六亚甲基四胺中甲醛单位的亚甲基。
反应最初产物为另一亚胺离子，经水解得到芳醛。
反应需要在芳环上有强活化基，如酚羟基。
醛基进入酚羟基的邻位或对位（如果邻位已有取代基）。
反应产率较低，但操作简便，产物也较纯净。
例如用此反应合成3,5-二叔丁基水杨醛：
反应机理
乌洛托品质子化、断裂产生亚胺离子，亚胺离子对芳环发生亲电芳香取代，经互变异构，生成一个苄胺衍生物。
接下来乌洛托品部分发生第二次质子化、断裂产生亚胺离子，然后进行分子内氧还作用，苄胺部分被氧化为亚苄基亚胺离子，它经过水解，即得到醛。
如有侵权请联系告知删除，感谢你们的配合！。
美国空气聚酰胺固化剂大全
聚酰胺及聚酰胺加成物：固化剂类型用途ANCAMD 221*70 聚酰胺溶剂型的船舶漆，防腐漆，混凝土的底漆，密封漆和面漆ANCAMD 221 聚酰胺溶剂型的船舶漆，防腐漆，混凝土的底漆，密封漆和面漆ANCAMD 350A 聚酰胺高固体份涂料，胶粘剂，封装，注塑料。
ANCAMD 2050 聚酰胺加成物高固体份涂料，混凝土底漆和涂料，密封剂和腻子，水池涂料，船舶涂料。
ANCAMD 2353 聚酰胺高固体份船舶和维护涂料，混凝土底漆和涂料。
Sunmide 305-70X 聚酰胺溶剂型防护涂料，例如：底漆，面漆和环氧煤焦油涂料。
Sunmide 305 聚酰胺溶剂型防护涂料，例如：底漆，面漆和环氧煤焦油涂料。
Sunmide 307D-60 聚酰胺通用型环氧涂料，富锌涂料和砂纸粘结剂Sunmide 328A 聚酰胺普通工业用和土木工程用粘接剂。
环氧内衬涂料和耐化性油漆Sunmide 315 聚酰胺涂料、密封剂、粘接剂。
Sunmide 153-60S 聚酰胺基胺通用性环氧漆和涂料Sunmide 381 聚酰胺加成物高固体份涂料，焦油环氧漆，储罐内衬涂料Sunmide 353N 聚酰胺加成物通用型涂料的底涂和中涂，重防腐涂料，快干型底漆和潮湿表面底漆。
Sunmide 350 聚酰胺加成物溶剂型防护涂料ANCAMD 2396 酰胺基胺混凝土底涂和粘结剂，自流平和磨光地坪，瓷砖灌浆和耐化性灌浆。
ANCAMD 2426 酰胺基胺高固体份和100%固体份涂料和底漆，符合FDA 21CFR 1 75.300标准，应用于酿酒和饮用水储罐内衬。
ANCAMD 501 酰胺基胺地坪涂料，修补材料，混凝土粘接。
ANCAMD 502 酰胺基胺地坪漆，混凝土修补，泥浆。
ANCAMD 503 酰胺基胺地坪涂料，混凝土修补。
ANCAMD 506 酰胺基胺土木工程应用，比ANCAMD 500有更长的可使用时间，湿法层压，玻璃钢缠绕用复合材料，电子灌封，高固体份涂料，对于脂环族胺固化剂可延长其使用时间。
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Focus of Attention Bias
• Arrows indicate visual focus of attention. • Following a conversation, observers attributed more influence to the speaker they faced than to the other speaker. • Observers on the side, attributed equal influence to both speakers.
THINK Social Psychology Kimberleycation, Inc. All rights reserved.
How can We be Accurate?
• Assume that others are similar to you
THINK Social Psychology Kimberley Duff
Copyright ©2012 by Pearson Education, Inc. All rights reserved.
The Self-Fulfilling Prophecy: How It Happens. We cause our own expectations to come true by acting in ways that elicit expected behavior from others.
What assumptions are you making about the person who lives here?
THINK Social Psychology Kimberley Duff
Copyright ©2012 by Pearson Education, Inc. All rights reserved.
• The speed of those gestures also reveals feelings
• The context of communication affects how gestures are perceived
THINK Social Psychology Kimberley Duff
We can actually cause beliefs about us to become true by behaving in a manner consistent with those beliefs
THINK Social Psychology Kimberley Duff
Copyright ©2012 by Pearson Education, Inc. All rights reserved.
THINK Social Psychology Kimberley Duff
Copyright ©2012 by Pearson Education, Inc. All rights reserved.
Emotional Expression (continued)
• What body gestures we use is important
THINK Social Psychology Kimberley Duff
Copyright ©2012 by Pearson Education, Inc. All rights reserved.
Emotional Expression
• Facial expressions, eye movements, and body gestures • Six facial expression are uniform across cultures (Ekman, 1994)
The Confirmation Bias
• We actively seek out data that support our beliefs • We actively disregard data the refute our beliefs • Belief perseverance
People maintain their original beliefs, even in the face of contradictory data
• Eye gaze and movement is especially telling
THINK Social Psychology Kimberley Duff
Copyright ©2012 by Pearson Education, Inc. All rights reserved.
Emotions Across Cultures. These faces are recognized as reflecting the same emotions across different cultures.
Nonverbal Communication: How do We Communicate Without Words?
• Nonverbal cues
Behaviors, gestures, and expressions that convey thought or emotion without words How do you feel when someone’s tone of voice does not match what they are saying? Do you ever smile when you are mad or sad?
THINK Social Psychology Kimberley Duff
Copyright ©2012 by Pearson Education, Inc. All rights reserved.
“Just go. It’s fine.” People’s nonverbal behaviors can communicate a wealth of information that may be contradictory to their words.
THINK Social Psychology Kimberley Duff
Copyright ©2012 by Pearson Education, Inc. All rights reserved.
The Confirmation Bias (continued)
• The self-fulfilling prophecy
That is only slightly better than guessing!
• Self-verification
Because we see ourselves as honest, we have trouble seeing others as dishonest
THINK Social Psychology Kimberley Duff
THINK Social Psychology Kimberley Duff
Copyright ©2012 by Pearson Education, Inc. All rights reserved.
Copyright ©2012 by Pearson Education, Inc. All rights reserved.
How to Detect Deception
• • • • Look for inconsistent facial expressions Look for fewer or inconsistent words Use cues from the story itself Have confidence in your ability to detect a lie • Detecting lies on the internet – a whole different game!
• Stay motivated to be accurate • Remember empathy – it leads to accurate assessments
THINK Social Psychology Kimberley Duff
Copyright ©2012 by Pearson Education, Inc. All rights reserved.
Copyright ©2012 by Pearson Education, Inc. All rights reserved.
Detecting Deception
• The assumption that people are honest makes us poor detectors of lies • People can correctly detect lies around 50% of the time