High performance LED package
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专利名称：High performance LED package
发明人：ハッセル， クリストファー ピー．,エマーソン，デイビッド ティー．,バーグマン， マイケル ジェ
イ．
申请号：JP2009546471
申请日：20080115
公开号：JP5431962B2
公开日：
20140305
专利内容由知识产权出版社提供
摘要：The resin package which demarcates the pit which does the three-dimensional polygon or another 3 dimensional three-dimensional shape is included, the light-emitting diode lamp is disclosed. The pit includes with two side walls which parallel to the side of the one whose each one of the floor face and the floor face is long and two edge walls which parallel to the side of the one whose each one of the floor face is short. Two side walls demarcate the angle which in at that time is larger than the 3 , two edge walls demarcate the angle which in at that time is larger than the 40 . The light-emitting diode tip/chip is located on the rectangular floor face of the package.
申请人：クリー インコーポレイテッド
地址：アメリカ合衆国 ノースカロライナ州 ２７７０３ ダラム シリコン ドライブ ４６００国籍：US
代理人：特許業務法人浅村特許事務所
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