SN5443A中文资料
opa544中文资料
PACKAGE/ORDERING INFORMATION
PRODUCT OPA544T
PACKAGE 5-Lead TO-220
PACKAGE DRAWING NUMBER(1)
315
OPA544T-1 5-Lead Stagger-Formed TO-220
INPUT VOLTAGE RANGE Common-Mode Input Range, Positive
Negative Common-Mode Rejection
INPUT IMPEDANCE Differential Common-Mode
OPEN-LOOP GAIN Open-Loop Voltage Gain
vs Temperature vs Power Supply
INPUT BIAS CURRENT(1) Input Bias Current
vs Temperature Input Offset Current
NOISE Input Voltage Noise
Noise Density, f = 1kHz Current Noise Density, f = 1kHz
12345
12345
VI+N V– V+ VI–N VO
VI+N V– V+ VI–N VO
ABSOLUTE MAXIMUM RATINGS
Supply Voltage, V+ to V– ................................................................... 70V Output Current ................................................................. See SOA Curve Input Voltage .................................................... (V–) –0.7V to (V+) +0.7V Operating Temperature ................................................. –40°C to +125°C Storage Temperature ..................................................... –40°C to +125°C Junction Temperature ...................................................................... 150°C Lead Temperature (soldering –10s)(1) ............................................................... 300°C
P3SAE 和 370SAE系列 品 產 主機板 User’s Manual 中文使用手冊说明书
P3SAE 和 370SAE系列品產主機板User’s Manual中文使用手冊品名稱產： P3SAE, P3SAE-L, P3SAE-P370SAE, 370SAE-L或370SAE-P 手冊版本：中文1.2商標聲明Intel, Socket 370, Celeron , Pentium II 及 Pentium III 為 Intel產（英代爾）Corp.之品及註冊商標。
產VIA 為 VIA （威盛）Technologies, Incorporated 之品及註冊商標。
產Award 為 Award Software International Inc. 之品及註冊商標。
MS-DOS, Windows 95, Windows 98, Windows 2000 及Windows NT 為Microsoft Corporation之註冊商標。
Novell 為Novell Corporation之註冊商標。
ADI 為 Analog Devices Inc., 之註冊商標。
產所有其他商標及品名稱屬於各該公司之註冊商標或版權。
-R01-目 錄第一章、簡介1.1品簡介產 (6)產內 (7)1.2品容產 (7)1.3品特色1.4品規格產 (7)1.5主機板零件配置圖 (10)第二章、主機板安裝設定2.1主機板安裝程序 (11)2.1.1一般跳接器設定 (11)2.1.2網路功能設定 (11)2.1.3鍵盤的電壓設定 (12)2.1.4清除 CMOS 的設定值 (12)2.1.5中央處理器電壓設定 (13)2.1.6中央處理器FSB頻率選擇 (13)2.2中央處理器的安裝 (13)2.2.1Slot 1 CPU的安裝方法 (13)2.2.2Socket 370 CPU的安裝方法 (15)2.3安裝系統記憶體 (15)2.3.1安裝168-pin 記憶模組方法 (15)2.3.2移除168-pin 記憶模組方法 (15)2.3.3記憶體的配置結構 (16)2.4輸出入連接埠/外接機殼之連接埠 (16)2.4.1ATX 電源接頭 (17)2.4.2機殼和CPU風扇連接頭 (17)2.4.3 紅外線資料傳輸連接埠 (18)2.4.4連接Creative相容的PCI音效卡的接頭 (19)2.4.5網路喚醒系統功能的接頭 (19)2.4.6磁碟機接頭 (20)2.4.7主要及次要 IDE連接頭 (20)2.4.8PS/2 滑鼠連接埠 (21)2.4.9PS/2 鍵盤連接頭 (21)2.4.10VGA 顯示埠 (21)2.4.11高速串列埠 (21)2.4.12印表機並列埠 (21)2.4.13通用串列匯流排(UBS)連接埠 (22)2.4.14網路連接埠 (22)2.4.15動作/連結顯示燈 (22)2.4.16速度顯示燈 (22)2.4.17Line Out 連接埠 (22)2.4.18Line In 連接埠 (23)2.4.19Microphone In 連接埠 (23)2.4.20Game/MIDI 連接埠 (23)2.4.21ATAPI IDE/SONY Audio 連接埠 (23)2.4.22Mitsumi Audio 連接埠 (23)2.4.23外接機殼之連接埠 (24)第三章、基本輸出入系統設定3.1CMOS 設定程式 (25)3.2標準 CMOS 設定 (26)3.3BIOS 特殊功能設定 (28)3.4晶片組特殊功能設定 (32)3.5週邊整合設定 (34)3.6系統省電管理功能設定 (39)3.7PNP/PCI 組態設定 (42)3.8個人電腦健康狀態 (44)3.9頻率控制 (45)3.10載入基本預設值 (46)3.11載入最佳值 (47)3.12管理者/使用者密碼設定 (47)3.13儲存並跳出設定程式 (47)3.14不儲存並離開設定程式 (47)第四章、驅動程式的安裝4.1Windows 95/98/ME/2000的INF程式更新 (48)4.1.1用於Windows 95/98第一版的安裝方法..484.1.2用於Windows 98SE的安裝方法 (49)4.1.3用於Windows ME/2000的安裝方法 (49)4.2安裝顯示埠的驅動程式(只提供給P3SAE或P3SAE-L )494.2.1用於Windows 95/98/ME的安裝方法 (49)4.2.2用於Windows 2000的安裝方法 (50)4.2.3用於Windows NT 4.0的安裝方法 (50)4.2.4用於Windows 3.11, NT 3.51 & OS/2 (50)4.3安裝音效埠的驅動程式 (50)4.4安裝網路的驅動程式(只提供給P3SAE-L ) (50)4.5安裝Intel防護程式 (51)4.6安裝 Ultra ATA Storage 的驅動程式 (51)4.7安裝硬體偵測的公用程式 (51)附錄 A 使用中止到RAM的功能 (52)第一章、簡介 ( Introduction )產 ( Product Overview )1.1 品簡介歡迎您選擇使用P3SAE 或370SAE 系列主機板. 本主機板是採用Intel公司最新開發之FW82815 或FW82815EP和 FW82801BA晶片組. 經本公司與各種的硬體週邊(如：中央處理器、記憶體、顯示卡、硬碟、光碟機....等)及應用軟體(如： Novell、 MS Office....等),除了符合 Year 2000,並且做各種的相容性測試，及嚴格品質管制，將是您最佳的選擇.本手冊有共分肆個章節。
SN54S74中文资料
Copyright © 1988, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date.PACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)JM38510/00205BCA OBSOLETE CDIP J14TBD Call TI Call TIJM38510/00205BDA OBSOLETE CFP W14TBD Call TI Call TIJM38510/00205BDA OBSOLETE CFP W14TBD Call TI Call TIJM38510/07101BCA ACTIVE CDIP J141TBD Call TI Level-NC-NC-NCJM38510/07101BCA ACTIVE CDIP J141TBD Call TI Level-NC-NC-NCJM38510/07101BDA ACTIVE CFP W141TBD Call TI Level-NC-NC-NCJM38510/07101BDA ACTIVE CFP W141TBD Call TI Level-NC-NC-NCJM38510/30102B2A ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NCJM38510/30102B2A ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NCJM38510/30102BCA ACTIVE CDIP J141TBD Call TI Level-NC-NC-NCJM38510/30102BCA ACTIVE CDIP J141TBD Call TI Level-NC-NC-NCJM38510/30102BDA ACTIVE CFP W141TBD Call TI Level-NC-NC-NCJM38510/30102BDA ACTIVE CFP W141TBD Call TI Level-NC-NC-NCJM38510/30102SCA ACTIVE CDIP J141TBD Call TI Level-NC-NC-NCJM38510/30102SCA ACTIVE CDIP J141TBD Call TI Level-NC-NC-NCJM38510/30102SDA ACTIVE CFP W141TBD Call TI Level-NC-NC-NCJM38510/30102SDA ACTIVE CFP W141TBD Call TI Level-NC-NC-NC SN5474J OBSOLETE CDIP J14TBD Call TI Call TISN5474J OBSOLETE CDIP J14TBD Call TI Call TISN54LS74AJ ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC SN54LS74AJ ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC SN54S74J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC SN54S74J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC SN7474DR OBSOLETE SOIC D14TBD Call TI Call TISN7474DR OBSOLETE SOIC D14TBD Call TI Call TISN7474N OBSOLETE PDIP N14TBD Call TI Call TISN7474N OBSOLETE PDIP N14TBD Call TI Call TISN7474N3OBSOLETE PDIP N14TBD Call TI Call TISN7474N3OBSOLETE PDIP N14TBD Call TI Call TISN74LS74AD ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS74AD ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS74ADBR ACTIVE SSOP DB142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS74ADBR ACTIVE SSOP DB142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS74ADBRE4ACTIVE SSOP DB142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS74ADBRE4ACTIVE SSOP DB142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS74ADE4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS74ADE4ACTIVE SOIC D1450Green(RoHS&CU NIPDAU Level-1-260C-UNLIMOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)no Sb/Br)SN74LS74ADR ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS74ADR ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS74ADRE4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS74ADRE4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS74AJ OBSOLETE CDIP J14TBD Call TI Call TISN74LS74AJ OBSOLETE CDIP J14TBD Call TI Call TISN74LS74AN ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74LS74AN ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NC SN74LS74AN3OBSOLETE PDIP N14TBD Call TI Call TISN74LS74AN3OBSOLETE PDIP N14TBD Call TI Call TISN74LS74ANE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74LS74ANE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74LS74ANSR ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS74ANSR ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS74ANSRG4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS74ANSRG4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S74D ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S74D ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S74DE4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S74DE4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S74DR ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S74DR ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S74DRE4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S74DRE4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S74N ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74S74N ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74S74N3OBSOLETE PDIP N14TBD Call TI Call TIOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)SN74S74N3OBSOLETE PDIP N14TBD Call TI Call TISN74S74NE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74S74NE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74S74NSR ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S74NSR ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S74NSRE4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S74NSRE4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SNJ5474J OBSOLETE CDIP J14TBD Call TI Call TISNJ5474J OBSOLETE CDIP J14TBD Call TI Call TISNJ5474W OBSOLETE CFP W14TBD Call TI Call TISNJ5474W OBSOLETE CFP W14TBD Call TI Call TI SNJ54LS74AFK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC SNJ54LS74AFK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC SNJ54LS74AJ ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC SNJ54LS74AJ ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC SNJ54LS74AW ACTIVE CFP W141TBD Call TI Level-NC-NC-NC SNJ54LS74AW ACTIVE CFP W141TBD Call TI Level-NC-NC-NC SNJ54S74FK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC SNJ54S74FK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NCSNJ54S74J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NCSNJ54S74J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NCSNJ54S74W ACTIVE CFP W141TBD Call TI Level-NC-NC-NCSNJ54S74W ACTIVE CFP W141TBD Call TI Level-NC-NC-NC (1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS)or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it isprovided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.元器件交易网IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,enhancements, improvements, and other changes to its products and services at any time and to discontinueany product or service without notice. Customers should obtain the latest relevant information before placingorders and should verify that such information is current and complete. All products are sold subject to TI’s termsand conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TIdeems necessary to support this warranty. Except where mandated by government requirements, testing of allparameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible fortheir products and applications using TI components. T o minimize the risks associated with customer productsand applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or processin which TI products or services are used. Information published by TI regarding third-party products or servicesdoes not constitute a license from TI to use such products or services or a warranty or endorsement thereof.Use of such information may require a license from a third party under the patents or other intellectual propertyof the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is withoutalteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproductionof this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable forsuch altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for thatproduct or service voids all express and any implied warranties for the associated TI product or service andis an unfair and deceptive business practice. TI is not responsible or liable for any such statements.Following are URLs where you can obtain information on other Texas Instruments products and applicationsolutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityTelephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2005, Texas Instruments Incorporated。
HMC544中文资料
Isolation Between Ports RF1 & RF2
0
-5
-10
ISOLATION (dB)
-15
-20
-25
-30
RF1 ON
RF2 ON
-35
-40 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 FREQUENCY (GHz)
Input IP3 vs. Vctl
65
60
SWITCHES - SMT
元器件交易网
v00.0206
Typical Applications
The HMC544 / HMC544E is ideal for:
• Cellular/PCS/3G Infrastructure
• Basestations & Repeaters
65
60
INPUT IP3 (dBm)
55
50
+25C
45
+85C
-40C
40 0 0.5 1 1.5 2 2.5 3 3.5 4 FREQUENCY (GHz)
Return Loss
0
-10
RETURN LOSS (dB)
-20
RFC
RF1, RF2
-30
-40
-50 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 FREQUENCY (GHz)
INPUT IP3 (dBm)
55
50
+3V
+5V
45
40 0 0.5 1 1.5 2 2.5 3 3.5 4 FREQUENCY (GHz)
8
For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at
WD西部数据硬盘分类
西部数据 WD 驱动器分类西部数据是最早的硬盘驱动器和驱动器部件的生产商。
因此， WD 在设计和生产用于硬盘驱动器的系统控制器方面居于领先地位。
习惯上根据系统控制器的应用电路架构来对WD 硬盘驱动器划代。
1. 产品的命名通过名字可以识别驱动器的系列和容量。
WD 的第一代IDE 驱动器叫做Centaur ，有四个系列。
这四个系列的型号见下表：例如： WD93048A ，WD95044A 第二代WD 硬盘驱动器有50个系列： 例如： WDAC2120，WDAC35100A ，WDE4360，PhD2100,WDCU140从 WD205AA 系列20.5 GB 的驱动器开始，使用象今天这样的一种方式编号：1.WDWestern Digital 2.容量200,0GB （最大999,9GB ） 3.转速字母A - E分配给EIDE：A - 5400 rpm（WD 鱼子酱5400）B - 7200 rpm（WD 鱼子酱7200）C - 10'000 rmpD - 4500 rpm（WD Spartan）E - 5400 rpm（WD Protege）字母F - Z分配给SCSI和特种硬盘驱动器：F - 10'000 rmp,2Mb缓存G - 10'000 rpm,8Mb缓存H - 10'000 rpm,4Mb缓存J - 7200 rpm,8Mb缓寸K - 7200 rpm（performance）L - 7200 rpm（液态轴承）M - 5400 rpm（液态轴承）N - 5400 rpm（WD-Protege-液态轴承）P - 7200 rpm，8Mb缓存（液态轴承）Q-Z - 保留4.接口字母A - E分配给EIDE：A - ATA66B - ATA100C - FireWireD - Serial ATAE - ATA133字母F-V分配给SCSI和特种硬盘驱动器F - Fibre ChannelG - Ultra2（68 针）H - Ultra2（80 针）J - Ultra160（68 针）K - Ultra160（80 针）L - Ultra3（68 针）M - Ultra3（80 针）N - UltraSE（50 针）P-V - 保留A/V 家用，使用字母W-ZW - A/V家用X-Z - 保留5.客户标识00 – Generic（通用公司）10 – DEC（DEC公司）11 - WD Protege OEM12 – Intel（Inter公司）18 – Dell（Dell公司）23 – IBM（IBM公司）25 – Toshiba（东芝公司）28 – Microsoft（微软公司）32 - Reseller35 - WD Spartan40 – Apple （苹果公司）44 - WD protege 其他60 – Compac （康柏公司）80 – Motorola （摩托罗拉公司）90 - 零售95 - Tektronix99 – Boeing （波音公司）6.属系标识硬盘驱动器工程命名的通俗名称。
3G资料解释大全
3G无线网络,网卡及推销思路(资料)…….徐保1:什么是3G网络?答: 3G是第三代移动通信技术，是下一代移动通信系统的通称。
3G系统致力于为用户提供更好的语音、文本和数据服务。
与现有的技术相比较而言，3G技术的主要优点是能极大地增加系统容量、提高通信质量和数据传输速率。
此外利用在不同网络间的无缝漫游技术，可将无线通信系统和Internet连接起来，从而可对移动终端用户提供更多更高级的服务。
它能够方便、快捷的处理图像、音乐、视频流等多种媒体形式，提供包括网页浏览、电话会议、电子商务等多种信息服务。
为手机融入多媒体元素提供强大的支持。
但为了提供这种服务，无线网络必须能够支持不同的数据传输速度，3G将具有更宽的带宽，其传输速度将达到100-300Kbps，不仅能传输话音，还能传输数据，从而提供快捷、方便的无线应用。
目前，我们亚洲是3G发展最快的地区。
2:3G网络有几种模式？标志是什么？答:目前国内有三种模式，CDMA2000 中国电信天翼TD-SCDMA 中国移动G3WCDMA 中国联通沃3:3G网络参数常见词语解释.答: EVDO ：是CDMA2000 1x演进（3G)的一条路径的一个阶段GPRS：全球定位系统通用分组无线业务EDGE：是一种从GSM到3G的过渡技术增强型数据速率HSDPA：高速下行分组接入技术高速电路交换数据4:3G 无线网卡的品牌答：联想神州数码中兴易贝数码索尼爱立信熊猫华为等5：中兴3G网卡和联想3G网卡的特点答：中兴：外形像一个U盘，采用高速USB2.0接口工作。
该款无线上网卡采用黑红色外壳，外观十分漂亮，有点水果的味道，凸显高档。
3G无线上网卡通过USB接口与电脑相连，无需外接电源，完全由主机供电，方便易用特点：造型时尚、性能出色，携带方便。
同时支持2G容量的MicroSD扩展卡。
可当读卡器或U盘使用。
在EVDO网络环境下，实际应用中速度非常快，完全可以满足视频通信，在线视频等多媒体应用的需求。
最全硬盘SN意义
希捷SeagateST 3 1 6 0 0 2 3 AS 前两位字母ST表示希捷1 2-3-4-5 6-7 81位：代表硬盘外型1 -代表3.5英寸全高硬盘，厚度：41mm3 -代表3.5英寸半高硬盘，厚度：25mm4 -代表现在已被淘汰的5.25英寸硬盘。
厚度：82mm5 -代表3.5英寸硬盘，厚度：19mm9 -代表2.5英寸半高硬盘。
2-3-4-5位：三到四位组成，代表硬盘容量，单位为100M。
1200表示：1200 ×100M＝120G800表示：800 ×100M＝80G6-7位：代表硬盘标志，由主标志和副标志组成第一位表示在普通IDE硬盘中的盘片数，如 2 ，-表示2张盘片；第二位只在在主标志相同或无效时才有用，表示硬盘的代数，数字越大，代数越高，即此硬盘越新。
而在Seagate的SCSI硬盘中，其主标识则是指硬盘的转速了。
8位：由1到3个字母组成，代表硬盘接口类型。
A -代表：Ultra ATA，即普通IDE/EIDE接口，这是大多数桌面硬盘所采用的接口类型；AS -代表：Serial ATA 150，即SATA 1.0硬盘接口。
AG -代表：笔记本电脑专用的ATA的接口（以下都是不常用的：）N -代表：50针Ultra SCSI的接口，其数据传输率为20MB/s W -代表：68针Ultra SCSI接口，其数据传输率为40MB/s WC -代表：80针Ultra SCSI的接口FC -代表：光纤，可提供高达100MB/s的数据传输率，并且支持热拔插WD -代表：68针Ultra Wide SCSI的接口LW -代表：68针Ultra-2 SCSI（LVD）的接口LC -代表：80针Ultra-2 SCSI（LVD）的接口西部数据West Digita lWD2500JB-00EVA0☆编号说明：WD 2 5 0 0 J B - 0 0 E V A 01-2-3-4 5 6 7-8 9-10 11-12首先还是WD表示西部数据West Digital西数WD1200JS - 00MHB01-2-3-4 位：代表硬盘容量（3或4个数字组成），单位100M，与ST相同800 = 80G，1200 = 120G，1600 = 160G5位：代表硬盘转数与缓存容量A -代表5400rpm，鱼子酱一般是2M，这种产品已停产，（停）B -代表7200rpm，鱼子酱2M缓存，J -代表7200rpm并且具有8MB缓存，高端鱼子酱。
华硕主板
数字家庭主板M2NDH-支持AMD®SocketAM2Athlon64FX/Athlo64X2/Athlon64/Sempron -AMDLive!™Ready-强大扩充能力：1xPCI-Ex16、2xPCI-E、3xPCI-华硕WiFi-APSolo-华硕DHRemote™-华硕MP3-In™-华硕Q-Connector-高保真音频中央处理器支持AMD®SocketAM2Athlon64FX/Athlo64X2/Athlon64/Sempron 支持AMDCool'n'Quiet™技术AMD64架构，同时兼容32位和64位计算AMDLive!™Ready芯片组NVIDIAnForce®430MCP前端总线2000/1600MT/s内存双通道内存架构4x240-pinDIMM内存插槽，支持最大容量高达8GB的DDR2800/667/533ECC和non-ECC、un-buffered内存扩充插槽1xPCI-Expressx16插槽2xPCI-Expressx1插槽3xPCI2.2插槽存储装置/RAID-1xUltraDMA133/100/66/33-4xSerialATA3.0Gb/s-NVIDIAMediaShield™RAID通过SerialA TA设备支持RAID0、1、0+1、5和JBOD网络功能NVIDIAnForce®430内建GigabitMAC，支持externalAttansicPHY无线局域网：54MbpsIEEE802.11b/g（华硕WiFi-APSolo）音频功能ADI6声道高保真音频CODEC背板S/PDIF数字音频输出USB高达8个USB2.0/1.1接口M2N-VMDH-AMDSocketAM2-NVIDIAGeForce6100/nForce430-双通道DDR2800/667/533-1xPCIExpressx16+1xPCIExpressx1+2xPCI-双VGA：DVI-D和D-Sub-8声道高保真音频-2x1394a接口中央处理器支持AMD®SocketAM2Athlon64X2/Athlon64FX/Athlon64/Sempro nAMDCool'n'Quiet™技术AMD64架构，兼容32位和64位计算AMDLive!™Ready芯片组NVIDIAGeForce6100/nForce430前端总线2000/1600MT/s 内存双通道内存架构4x240-pinDIMM插槽，支持最大容量为8GB的DDR2800/667/533non-ECC，un-buffered内存显卡集成GeForce6100GPU高清晰视频处理，最高分辨率可达1920x1440（@75Hz）支持RGB显示；UXGA1600x1200（@60Hz）支持DVI-D显示支持双VGA输出：DVI-D和RGB注意：DVI-D不能用来输出RGB信号至CRT。
CS5463A中文资料手册pdf
OPA544中文资料
MIN
TYP
±1 ±10 ±10
±15 See Typical Curve
±10
36 3
(V+) –6 (V–) +6
90
(V+) –4 (V–) +4
106
1012 || 8 1012 || 10
90
103
1.4
5
8
See Typical Curve
25
See Typical Curve
(V+) –5 (V–) +5 (V+) –4.2 (V–) +4
FREQUENCY RESPONSE Gain Bandwidth Product Slew Rate Full-Power Bandwidth Settling Time 0.1% Total Harmonic Distortion
OUTPUT Voltage Output, Positive
Negative Positive Negative Current Output Short-Circuit Current
POWER SUPPLY Specified Operating Voltage Operating Voltage Range Quiescent Current
TEMPERATURE RANGE Operating Storage Thermal Resistance, θJC Thermal Resistance, θJC Thermal Resistance, θJA
(V+) –4.4 (V–) +3.8 (V+) –3.8 (V–) +3.1 See SOA Curves
[VIP专享]己二腈MSDS
![[VIP专享]己二腈MSDS](https://img.taocdn.com/s3/m/15ac48ab376baf1ffc4fadf1.png)
(℃)：
燃烧爆炸危险性
燃烧热(kj/mol： 507
微溶于水、醚，溶于醇。
溶解性：
饱和蒸汽压(kPa)： 无资料
相对密度(空气=1)： 3．73
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中科曙光TC4600刀片服务器用户手册V1.0
商标和版权
“SUGON”及图标是曙先信息产业股份有限公司的商标或注册商标。 “中科曙先”及图标是曙先信息产业股份有限公司的商标或注册商标，文中“曙先信息产业股份有限公司”简称“曙
先公司”。
“AMD”，“Opteron”及图标是 Advanced Micro Devices 公司的注册商标。 “Microsoft”.“Windows”.“Windows Server”及“Windows Server System”是微软公司的商标或注册商标。
如您不正确地或未按本手册的指示和要求安装.使用或保管本产品，或让非曙先公司授权的技术人员修理.变更本产品， 曙先公司将不对由此导致的损害承担任何责任。
本手册中所提供照片.图形.图表和揑图，仅用于解释和说明目的，可能与实际产品有些差别，另外，产品实际觃栺和 配置可能会根据需要不时变更，因此与本手册内容有所不同。请以实际产品为准。
目录
1 2
3
产品简介............................................................................................................. 1
1.1
产品概述 ...................................................................................................................... 1
电气接地要求 服务器必须正确接地，以使其正常运行幵确保安全。必须遵照以下要求安装本设备：任何区域性或国家/地区的电气 连线觃程，如国际电工委员会 (IEC) 觃程 364 第 1 至7 部分。此外，您必须确保安装过程中使用的所有配电设备 （如分支连线和揑座）均为已列出的或经过认证的接地型设备。 由于连在同一电源上的多台服务器需要将大量电流导入地下，因此曙先公司建议所用的 PDU 要么固定地连到建筑 物的分支电路上，要么配装一根连接工业揑头的不可拆卸的电线。那些符合IEC 60309 标准的揑头均视为适用揑头。 建议不要使用普通的电源接线板来连接本服务器。
富士通SPARC企业T5440服务器说明书
DATASHEETFUJITSU SPARC ENTERPRISE T5440 SERVERTHE SYSTEM THAT MOVES WEB APPLICATION CONSOLIDATION INTO MID-RANGE COMPUTING. UP TO 4 HIGH PERFORMANCE PROCESSORS, HIGH MEMORY AND EXTENSIVE CONNECTIVITY PROVIDE THE INFRASTRUCTURE FOR BACK OFFICE AND DATA CENTER CONSOLIDATION TASKS.FUJITSU SPARC ENTERPRISE FOR WEB SECURITY, EFFICIENCY AND PERFORMANCEFujitsu SPARC Enterprise throughput computing servers are the ultimate in Web and front-end business processes. Designed for space efficiency, low power consumption, and maximum compute performance they provide high throughput, energy-saving, and space-saving solutions, in Web server deployment. Built on UltraSPARC T2 or UltraSPARC T2 Plus processors, everything is integrated together on each processor chip to reduce the overall component count. This speeds performance lowers power use and reduces component failure. Add in the no-cost virtualization technology from Logical Domains and Solaris Containers and you have a fully scalable environment for server consolidation. Finish it off with on-chip encryption and 10 Giga-bit Ethernet freeways and they provide the compete environment for secure data processing and lightening fast throughput. SPARC ENVIRONMENTS MEAN MANAGEABILITY AND RELIABILITYBased on a four socket design, Fujitsu SPARC Enterprise T5440 provides up to 256 threads and 512GB of memory for outstanding workload consolidation. These servers can deliver outstanding data throughput performance in web and network environments while also delivering excellent server consolidation capability for back office and departmental database solutions. Fully supported by solid management and the top scalability and openness of the Solaris Operating system, you have the ability to maximise thread utilization, deliver application capability, and scale as large as you need.The intrinsic service management in Fujitsu SPARC Enterprise T5440 combined with the SPARC hardware architecture and Solaris operating system enables predictive self-healing and simpler implementation and operation. In addition, with fewer components and a low-power, low-heat design, the overall incidence of server stress and component failure is well below equivalent systems. This further increases operational reliability and reduces the need for manual intervention. As a result Fujitsu SPARC Enterprise T5440 is both a cost effective and well engineered system that you can rely on to deliver responsive Web and application performance.FEATURES AND BENEFITS FLEXIBLE INVESTMENT PROTECTION⏹16 or 32 core systems with UltraSPARC T2 Plus processors⏹Many growth options by use of Logical Domains, Solaris Containers, processor addition and space-saving server node addition⏹High multi-processor performance and memory capacity ⏹Let’s you select the performance you need, in a cost effective way, by choosing up to 256 threads⏹Able to grow the underlying hardware platforms while maximizing the use of all available resources; for best return on investment⏹Ability to handle server consolidation and web transaction processing to provide mid-range capability for departmental and back office functions as part of a consolidated web architectureRELIABLE OPERATION⏹A broad range of RAS functions including cache protection using ECC for Coherency Links, thread and core offlining memory page retirement, register protection, cache scrubbing⏹Overall system management and service security from hot swap and redundant disk drives (software RAID), power supplies, and Fans, system environment monitoring and easy component replacement ⏹Minimizes the possibility of server failure and ensures application continuity by removing, correcting or isolating in-processor faults⏹Lower management and maintenance costs coupled with non-stop system operationWORLD’S MOST ADVANCE D OS, SOLARIS 10⏹Solaris 10 is pre-installed⏹Supports Dynamic Tracing (DTrace) Solaris Zettabyte File System (ZFS), plus use and process rights management⏹The choice of the world’s most advanced developers ⏹Easy installation and upgrades with Solaris binary compatibility means software investment protection⏹The outstanding diagnostics and secure data handling makes high throughput operations simpler and more secure⏹Able to access the widest range of business applications availableFLEXIBLE INVESTMENT PROTECTIONThe choice of up to four processors (256 threads) and high main memory delivers the performance and capacity to support larger application processes as well as allowing more flexible and extensive use of Solaris Containers and Logical Domains. High reliability coupled with low operating costs also delivers unrivalled investment protection. Not only will your Fujitsu SPARC Enterprise T5440 servers have a longer and more useful life but they will also reduce your overall IT spends.Advanced high thread processor technology continues to provide additional performance at lower than average power consumption. When used to the maximum in high throughput computing environments you will achieve outstanding return on investment. Low than average power consumption also means savings in cooling costs particularly in high-density rack use in the data center.Your administration costs will also reduce as the number of applications consolidated into a single SPRAC Enterprise T5440 will significantly reduce your server count.To ensure that all available performance can be fully used, Logical Domains and Solaris Containers let you quickly and dynamically reconfigure the system to support both existing and new processes concurrently. Fully compatible with all Solaris applications Fujitsu SPARC Enterprise T5440 inter-works will all other Solaris and SPARC Enterprise systems to let you add performance or back-end processes as your requirements increase. RELIABLE OPERATIONThe hot swap and component redundancy in all Fujitsu SPARC Enterprise throughput computing servers, coupled with the high RAS functions embodied in UltraSPARC T2 Plus processors, provide Web platform reliability second to none. The result is a stable self sustaining system that works well with all the applications it supports. Error checking and correction systems implemented directly in the hardware not only take the pressure off the OS and applications but also ensure the platform really manages itself. This means less systems administration and many fewer diagnostic and recovery tasks are required. Once you own a Fujitsu SPARC Enterprise system you will soon forget the operational problems of the past.WORLD’S MOST ADVANCE D OS, SOLARIS 10Every Fujitsu SPARC Enterprise comes pre-installed with the latest Solaris operating system. This ensures the best in binary compatibility with the world’s most important application systems. It’s just one more important factor in ensuring the maximum life of your IT investments. But equally importantly, Solaris is the only OS that has the scalability, security, and diagnostic features to fully and quickly respond if a major application problem occurs. That has directly led to Solaris having one of the world’s largest applicatio n portfolios and why it is the development platform of choice for many of the world’s major software developers.TECHNICAL DETAILSPROCESSORProcessor quantity and type 4 x UltraSPARC T2 PlusProcessor options 2 x UltraSPARC T2 Plus eight-core processor (1.4GHz, 24KB L1 cache on core, 4MB L2cache per chip)4 x UltraSPARC T2 Plus eight-core processor (1.4GHz, 24KB L1 cache on core, 4MB L2cache per chip)4 x UltraSPARC T2 Plus eight-core processor (1.6GHz, 24KB L1 cache on core, 4MB L2cache per chip)MEMORYMemory slots 64 slotsMemory slot type FB-DIMMMemory capacity (min. – max.) 32GB–512GBMemory protection ECCMemory modules 8GB Memory Expansion (4 x 2GB DIMM)16GB Memory Expansion (4 x 4GB DIMM)32GB Memory Expansion (4 x 8GB DIMM)DRIVE BAYSDisk bay configuration 4 x 2.5-inch hot-plug SAS/SATADisk drives HDD SAS, 146GB, 10,000rpm, 2.5-inchHDD SAS, 300GB, 10,000rpm, 2.5-inchSSD SAS, 32GB, 2.5-inchOptical drive bay configuration 1 x 128mm bayOptical drives CD-RW, DVD+/-RW (8xDVD+/-R, 8xDVD+/-RW, 24CD-R, 24xCD-RW)INTERFACESLAN/Ethernet 4 ports (Gbit/s, RJ45)Serial 1 port (RS232C, DSUB9)USB 4 ports (2 on front, 2 on rear)Service LAN for ILOM 1 port (10/100Mbit/s, RJ45)Service serial for ILOM 1 port (RS232C, RJ45)SLOTSPCI Express 8 x PCI Express (Usable for 8 lanes , half-height, short)Note XAUI cards can be installed in pre-determined two PCI Express slotsNote Expandable to 28 slots (PCI Express) when using 2 x External I/O Expansion UnitsCONNECTABLE COMPONENTSSCSI/SAS controller Dual-Channel Ultra320 SCSI Card, PCI ExpressSingle-Channel SAS Card, PCI ExpressFibre channel controller Single-Channel 4 Gbps Fibre Channel Card, PCI ExpressDual-Channel 4 Gbps Fibre Channel Card, PCI ExpressSingle-Channel 8 Gbps Fibre Channel Card, PCI ExpressDual-Channel 8 Gbps Fibre Channel Card, PCI ExpressLAN controller Quad Giga Ethernet Card (10/100/1000Base-T), PCI ExpressDual Gigabit Ethernet Card (10/100/1000Base-T), PCI ExpressDual Gigabit Ethernet Card (1000Base-SX), PCI ExpressSingle 10 Gigabit Ethernet Card, (10Gbase-SR), PCI ExpressSingle 10 Gigabit Ethernet Card, (XAUI: 10Gbase-SR/LR)Rack infrastructure Cable Management ArmRack rail kitSUPPORTED OPERATING SYSTEMSSupported operating systems Solaris 10 8/07 or laterOperating system release link /sparcenterprise/manual/notes/SERVER MANAGEMENTService processor Integrated Lights Out Manager (ILOM)Supported software Enhanced Support FacilityServer System ManagerVIRTUALISATIONVirtualization features Logical DomainsSolaris ContainersRAS FEATURESProcessor RAS ECC protection for L2 cache and registers, Thread and core offlining Redundant components Disk drive (HDD and SSD) redundant by software RAIDFanPCI card (multi-path configuration)Power supply unit,Power systemHot-swap components Disk drive (HDD and SSD) hot-replaceable by software RAIDFanPower supply unit,Degradation features Dynamic degradation Processor (core)MemoryHDD and SSD dynamic-degraded by software RAIDStatic degradation Processor (core)MemoryHDD and SSD static-degraded by softwareDIMENSIONS / WEIGHTRack-mount (W x D x H) 445 x 633 x 176 mm; 4U17.5 x 24.9 x 6.9 inchesWeight 40 kg (88 lb.)ENVIRONMENTSound pressure (LpAm) 80 dB (A)Operating ambient temperature 5–35°C (depending on altitude)Operating relative humidity 10–90%Operating altitude 0–3,000 mELECTRICAL VALUES AC POWERRated voltage range AC 100–240V +/- 10%Rated frequency range 50/60 HzActive power max. 2,700WApparent power max. 2,843VAHeat emission 9,720 kJ/hCOMPLIANCEEurope CERoHSRussia GOST-RUSA/Canada FCCICES-003UL/cULUL/S-markJapan VCCIChina Chinese RoHSKorea MICTaiwan BSMIAustralia C-tickCompliance notes There is general compliance with the safety requirements of major countries. Nationalapprovals required in order to satisfy statutory regulations or for other reasons can beapplied for on request.WARRANTY AND SUPPORT SERVICESService link /supportIn addition to Fujitsu SPARC Enterprise T5440, Fujitsu provides a range of platform solutions. They combine reliable Fujitsu products with the best in services, know-how and worldwide partnerships.Dynamic InfrastructuresWith the Fujitsu Dynamic Infrastructures approach, Fujitsu offers a full portfolio of IT products,solutions and services, ranging from clients to datacenter solutions, Managed Infrastructure and Infrastructure-as-a-Service. How much you benefit from Fujitsu technologies and services depends on the level of cooperation you choose. This takes IT flexibility and efficiency to the next level.Computing Products/global/services/computing/ - PRIMERGY: Industrial standard server - SPARC Enterprise: UNIX server- PRIMEQUEST: Mission-critical IA server - ETERNUS: Storage system - BS2000/OSD: Mainframe - GS21: Mainframe - ESPRIMO: Desktop PC - LIFEBOOK: Notebook PC - CELSIUS: WorkstationSoftware/software/- Interstage: Application infrastructure software - Systemwalker: System management software - Symfoware: Database software - PRIMECLUSTER: Clustering software - GLOVIA: ERP solutionLearn more about Fujitsu SPARC Enterprise T5440, please contact your Fujitsu salesrepresentative, Fujitsu business partner, or visit our website./sparcenterprise/Fujitsu Green Policy Innovation is our worldwide project for reducing burdens on the environment. Using our global know-how, we aim to resolve issues of environmental energy efficiency through IT. Please find further information at:/global/about/environment/©Copyright 2010 Fujitsu Limited.Fujitsu, the Fujitsu logo, PRIMERGY, PRIMEQUEST, ETERNUS, BS2000/OSD, GS21, ESPRIMO, LIFEBOOK, CELSIUS, Interstage, Systemwalker, Symfoware, PRIMECLUSTER are trademarks or registered trademarks of Fujitsu Limited in Japan and other countries.GLOVIA is a trademark of GLOVIA International LLC in the United States and other countries. UNIX is a registered trademark of The Open Group in the United States and other countries. All SPARC trademarks are trademarks orregistered trademarks of SPARC International, Inc. in the United States and other countries. Oracle and Java are registered trademarks of Oracle and/or its affiliates.Other company, product and service names may be trademarks or registered trademarks of their respective owners.DISCLAIMERTechnical data subject to modification and delivery subject to availability. Any liability that the data and illustrations are complete, actual or correct is excluded. Designations may be trademarks and/or copyrights of the respective manufacturer, the use of which by third parties for their own purposes may infringe the rights of such owner.CONTACTFUJITSU LIMITEDWebsite: 2010-09-14 WW-EN。
Inspiron 5493 设置和规格说明书
Inspiron 5493设置和规格注意、小心和警告:“注意”表示帮助您更好地使用该产品的重要信息。
:“小心”表示可能会损坏硬件或导致数据丢失，并告诉您如何避免此类问题。
:“警告”表示可能会导致财产损失、人身伤害甚至死亡。
© 2019-2020 Dell Inc. 或其子公司。
保留所有权利。
Dell、EMC 和其他商标是 Dell Inc. 或其附属机构的商标。
其他商标可能是其各自所有者的商标。
1 设置 Inspiron 5493 (4)2 Inspiron 5493 的视图 (6)右 (6)左侧 (6)基座 (7)显示屏 (8)底部 (9)3 Inspiron 5493的规格 (10)尺寸和重量： (10)处理器 (10)芯片组 (10)操作系统 (11)内存 (11)端口和接口 (11)通信 (12)音频 (13)存储 (13)英特尔傲腾内存（可选） (14)介质卡读取器 (15)键盘 (15)摄像头 (15)触摸板 (16)触摸板手势 (16)电源适配器 (16)电池 (17)显示屏 (17)显卡 (18)指纹读取器（可选） (19)计算机环境 (19)4 键盘快捷方式 (20)5 获取帮助和联系 Dell (22)目录3设置 Inspiron 5493: 根据您所订购的配置，本文档中的图像可能与您的计算机有所差异。
1.连接电源适配器，然后按下电源按钮。
: 为了节省电池电量，电池可能进入省电模式。
打开电源适配器，并按电源按钮以打开计算机。
2.完成操作系统设置。
对于 Ubuntu ：按照屏幕上的说明完成设置。
有关安装和配置 Ubuntu 的更多信息，请参阅知识库文章 SLN151664 和 SLN151748，网址：/support 。
对于 Windows ：按照屏幕上的说明完成设置。
设置时，戴尔建议您执行以下操作：•Windows 更新。
: 如果您正在连接到加密的无线网络，请在出现系统提示时输入访问无线网络所需的密码。
SN544-1
Oktober 2003Niederdruck – SchlauchleitungenNA, NB, NE, NF und NGSN 544Teil 1Maße in mm1 AnwendungsbereichNiederdruck-Schlauchleitungen können für Medien wie Schmieröle, Schmierfette, Kühlwasser, Emulsionen, Gase (außer Flüssiggas) und Luft verwendet werden.Ihre Temperaturbeständigkeit liegt bei Flüssigkeiten im Bereich von -30 °C und +110 °C. Sie sind ferner witterungsbeständig, alterungs- und abriebfest.2 StücklistenaufgabeKomplette Schlauchleitungen sind in der Stückliste auf AP-Ebene aufzugeben. Dies bedeutet, dass die Einzelteile (Schlauch und Armaturen) nur von der Arbeitsvorbereitung auf der AUP-Ebene angelegt werden.3 Maße und Bezeichnungsbeispiele (Form NE, NF und NG siehe Seite 2)Form NA für DN 20 mit Hülsen-ArmaturenForm NB für DN 25 bis DN 100 mit Spannschalen-ArmaturenBezeichnung einer kompletten Niederdruck-Schlauchleitung (N) mit beiderseitigenSchlaucharmaturen (B) von Nennweite DN 40 und Länge l = 800 mm:Schlauchleitung SN 544 - NB 40 x 800SchlüsselweiteNenngröße DN d 1 d 2 d 3 d 4s 1s 2 Betriebs- druck 4) bar Kleinster Biegeradius (bezogen auf Schlauchachse)NA 20 20 19 31 G 3/4 - 30 36 16 70 NB 25 25 25 37 G 1 60 36 - 16 80 NB 32 32 32 44 G 1 1/4 65 46 - 16 90 NB 40 40 38 51 G 1 1/2 80 55 - 16 100 NB 50 50 50 64 G 2 90 68 - 16 130 NB 63 63 63 79 G 2 1/2 108 85 - 16 160 NB 75 75 75 90 G 3 118 100-16 180 NB 100100100116G 4149Nocken16250Für Niederdruck-Schlauchleitungen bis DN 16 sind Schlauchleitungen nach SN 756 zu verwenden. Doppelnippel, Anschweißnippel und Anwendungsbeispiel siehe SN 544 Teil 4.Fußnoten siehe Seite 4 Fortsetzung Seite 2 und 4Bearbeitet:Normung Weitergabe sowie Vervielfältigung dieses Dokuments, Verwertung und Mitteilung seines Inhalts sind nur nach vorheriger ausdrücklicher schriftlicher Zustimmung von SMS Demag AG gestattet. Das Dokument ist vor unberechtigtem Zugriff Dritter zu schützen. Zuwiderhandlungen verpflichten zu Schadensersatz.Alle Rechte aus Patent-/Gebrauchsmuster-/Markenschutz vorbehalten.18.07.05Seite 2SN 544 Teil 1 : 2003-10Form NEfür DN 25 bis DN 100 mit Spannschalen-Armaturen und SAE-Flansch 3000 psiForm NFForm NGfür DN 25 bis DN 100 mit Spannschalen-Armaturen für DN 25 bis DN 100 mit Spannschalen-Armaturen und SAE-Flansch 3000 psi (90°) und SAE-Flansch 3000 psi (45°)Bezeichnung einer kompletten Niederdruck-Schlauchleitung (N) mit beiderseitigenSchlaucharmaturen (E) von Nennweite DN 50 mit Stutzen aus Stahl (St) und Länge 2) l = 1000 mm:Schlauchleitung SN 544 - NE 50 x 1000 StEs können auch Kombinationen der Formen B; E; F; und G aufgegeben werden(Siehe auch unter …Übersicht der Kombinationen von Schlaucharmaturen“), in diesem Fall lautet die Bezeichnung wie folgt:Bezeichnung einer kompletten Niederdruck-Schlauchleitung (N) mitSchlaucharmaturen E und F von Nennweite DN 50 mit Stutzen aus Stahl (St) und Länge 2) l = 1000 mm:Schlauchleitung SN 544 - NEF 50 x 1000 StNenngrößeDNd 1d 2d 4d 5d 6 5)SAE- 3000 psi Flansch- größe l 7l 10Betriebs- druck 4)bar Kleinster Biegeradius (bezogen auf Schlauchachse)NE; NF; NG 25 25 25 37 60 21 44,4 1" 55 25 16 80 NE; NF; NG 32 32 32 44 65 27 50,8 1 1/4" 65 27 16 90 NE; NF; NG 40 40 38 51 80 33 60,3 1 1/2" 75 30 16 100 NE; NF; NG 50 50 50 64 90 45 71,0 2" 100 40 16 130 NE; NF; NG 63 63 63 79 108 58 84,1 2 1/2" 120 60 16 160 NE; NF; NG 75 75 75 90 118 70 101,6 3" 145 73 16 180 NE; NF; NG 100 10010011614994127,04"1859216250Für Niederdruck-Schlauchleitungen mit SAE-Anschluss (Form E - G) müssen Schrauben, O-Ringe und Flanschhälften separat in der Stückliste aufgegeben werden (siehe SN 532).Fußnoten siehe Seite 4l 2) 3) l 2) 3)l 7l 10l 2) 3)Seite 3SN 544 Teil 1 : 2003-104 Übersicht der Kombinationen von SchlaucharmaturenFolgende standardisierte Kombinationen sind bei SMS-Demag AG bevorzugt anzuwenden.Grau hinterlegte Felder sind Schlauchleitungen mit identischen Armaturen an beiden Schlauchenden.Nippel 2FormA B E F G ANA 20 ----BNB 25 bis 100NBE 25 bis 100 NBF 25 bis 100 NBG 25 bis 100 ENE 25 bis 100NEF 25 bis 100 NEG 25 bis 100 FNF 25 bis 100NFG 25 bis 100 N i p p e l 1GNG 25 bis 1005 Besondere Bezeichnungenz. B. 140° gedreht, (diese Angabe ist in der Stückliste anzugeben) Toleranz des Verdrehwinkels beträgt ± 5°Schlauchleitung SN 544 – NFG 32 x 800 – 140° gedreht6 Standardlängen für Schlauchleitungen nach NennweiteDN l 120 500 25 630 32 80040 100050 125063 14007516001001800 2000 2500 3150 4000 5000 60007 Zulässige Längenabweichungenl 1 DNbis 630 über 630 bis 1250 über 1250 bis 2500 über 2500 bis 8000über 8000≤ 25 + 7 - 3 + 12 - 4 + 20 - 6 32 bis 50 + 12 - 4 + 20 - 6 + 25 - 6 63 bis 100 + 20 - 6+ 25 - 6+ 30 - 8+ 1,5 % - 0,5 %+ 3 % - 1 %Seite 4SN 544 Teil 1 : 2003-108 GewichteGrundgewichte der Schlauchleitungen mit entsprechenden AnschlüssenGewicht in kg / mFormN 20 N 25 N 32 N 40 N 50 N 63 N 75 N 100A 1,12 - - - - - - -B - 1,22 1,76 2,40 3,60 5,50 6,24 11,5E - 1,52 2,08 2,78 4,44 6,34 7,38 13,2F - 1,70 2,36 3,16 5,16 7,92 9,30 17,2G - 1,58 2,16 2,90 4,68 6,84 8,10 14,8Zitierte NormenSN 532-1 SAE-Flansche mit Anschweißbund, 3000 PSI und 6000 PSI; Flanschanschluss, FlanschkupplungSN 532-2 SAE-Flansch, Flanschhälften, Vollflansch, Anschweißbunde, BlindbundSN 544-2 Niederdruck - Schlauchleitungen; SchläucheSN 544-3 Niederdruck - Schlauchleitungen; SchlaucharmaturenSN 544-4 Niederdruck - Schlauchleitungen; Doppelnippel, AnschweißnippelSN 545-1 Kupplungen ohne Rückschlagventil für Niederdruck - Schlauchleitungen; Spannringe, KurvenstückeSN 545-2 Kupplungen ohne Rückschlagventil für Niederdruck - Schlauchleitungen; SchlaucheinfassungenSN 545-3 Kupplungen ohne Rückschlagventil für Niederdruck - Schlauchleitungen; BlindverschlüsseSN 756 Hochdruck - SchlauchleitungenWeitere NormenSN 757 Hochdruck - Schlauchleitungen; SchläucheSN 758 Hochdruck - Schlauchleitungen; Schlaucharmaturen, Form A - GSN 759 Hochdruck - Schlauchleitungen; Einschraubstutzen, AnschweißstutzenÄnderung Oktober 2003 Frühere AusgabenMaße für l7 und l10 nachgetragen, 1962-09, 1964-06, 1972-07, 1973-03, Toleranz des Verdrehwinkels an DIN-Norm 1975-09, 1976-07, 1978-11, 1986-01, angepaßt. 1989-02, 1994-04, 1998-05, 2002-02,2002-071) Die Überwurfmutter kann als Sechskantmutter oder als genutete Mutter ausgeführt sein.2) Die Länge ist jeweils zweckentsprechend anzugeben.3) Sofern die Gesamtlänge erst bei der Montage bestimmt werden kann, sind die Schlaucharmaturen und die Länge des Schlauches getrennt in den Stücklisten aufzugeben.4) Der Prüfdruck beträgt das 1,5fache, der Mindest-Berstdruck das 3fache des Betriebsdruckes.5) SAE-Flansche siehe SN 532-2.。
三星 SSD_Magician 中文指导手册
三星SSD Magician 用户手册版权 ©三星电子有限公司本资料版权归三星电子所有。
未经授权严禁复制、使用、分发本资料的全部或部分内容，违者必究。
三星电子保留随时更改资料中关于规格参数的相关内容的权力，如有更改，恕不另行通知。
本资料中由三星电子提供的相关内容，在印刷时视为准确无误，但是三星电子不对此处提到的相关内容进行任何明示或暗示的承诺。
商标及服务条款三星标志为三星电子的注册商标。
Adobe 是一个注册商标，Adobe Acrobat是Adobe公司的注册商标。
其他公司和产品名称均为各自相关公司的注册商标。
目录第 1 章 (5)1.1产品概览.......................................................................................................................................................... .. (6)简介 ........................................................................................................................................................................ (6)注意事项 (6)系统需求....................................................................................................................................................... . (6)第 2 章................................................................................................................................................ . (8)2.1如何使用三星SSD M AGICIAN................................................................................................................... (9)三星SSD Magician安装............................................................................................................................ (9)三星SSD Magician 基本情况 (10)系统信息.................................................................................................................................................. (11)性能基准测试............................................................................................................................................ .. (12)性能优化..................................................................................................................................... ...... ...... .. (13)操作系统优化 (15)固件升级 (16)安全擦除 (17)超容量缓存 (18)磁盘备份 (19)网站链接 (20)第 3 章............................................................................................................................................... (21)3.1固件升级基础............................................................................................................................................. ...... ...... . (22)简介 (22)注意事项 (22)系统需求.......................................................................................................................................... ...... . (23)3.2 W INDOWS系统固件升级........................................................................................................................................ (24)利用Windows系统固件工具升级固件................................................................ ........................................ . (24)3.3 DOS系统固件升级工具基础...................................................................................................... .. (27)为固件升级创建启动盘................................................................................................ .......... .......... .......... . (27)3.4利用DOS工具升级固件................................................................................................... .......... .......... .......... .. (33)DOS固件工具使用......................................................................................................................... .......... . (33)第 4 章............................................................................................................................................... . (37)4.1安全擦除基础.................................................................................................................................................... (38)简介 (38)注意事项 (38)系统需求.................................................................................................................................................... . (39)4.2 W INDOWS系统安全擦除............................................................................................................................... .......... .. (40)4.3准备DOS系统安全擦除工具................................................................................................ ............................ . 41创建含有安全擦除工具的DOS启动USB驱动........................................... ............................ (41)4.4安全擦除工具使用............................................................................................................................. .. (44)启动DOS SSD 应用 (44)第 5 章............................................................................................................................................... (47)5.1局限性 (48)一般局限性 (48)固件升级工具局限性....................................................................................................................... .. (48)安全擦除工具局限性 (48)附件 ................................................................................................................................................ . (50)6.1附件 (51)故障检修 (51)固件升级工具................................................................................................................................................................... .. (51)安全擦除工具 (52)专业词汇................................................................................................................................................. (54)7.1专业词汇 (55)第1章准备1.1 产品概览简介―三星SSD Magician‖ 软件 (以下称SSD Magician)操作简单，适用于台式机或笔记本电脑相连的三星SSD产品。
各品牌硬盘的铭牌编号识别及规格参数表
各品牌硬盘的铭牌编号识别及规格参数表各品牌硬盘的外包装或者硬盘外壳都会有一些编号，不过由于这些编号都较复杂，大多数用户都难以解读。
其实，每个厂家的每款硬盘编号都有其一定的内在规律，而每串编号也都代表着硬盘本身特定的含义，而通过这些复杂的编号，用户可以更确切的了解硬盘的各种性能指标，包括接口类型、转速、容量、缓存等。
了解这些编号所代表的意义，有助于消费者购买硬盘时明察秋毫，避免被一些无聊商家误导。
如果商家跟你说这是一块7200转的硬盘，但是它表面的参数却表明它是5400转的，那你就可以马上转身走人。
下面我们以主流的A TA接口产品为主，介绍各厂家的硬盘最新编号规则，供大家参考。
希捷（Seagate）1999年1月1号后生产的IDE系列其编号都为以下格式：STST代表“Seagate”，代表希捷公司产品，这在任何一款希捷硬盘产品编号的开头都有。
代表硬盘外形。
“1”代表3.5英寸全高硬盘，“3”代表3.5英寸半高硬盘，“4”代表现在已被淘汰的5.25英寸硬盘。
由3到4位数字组成，代表硬盘容量，单位为100MB。
例如“1200”代表这块硬盘的容量为100MB×1200=120GB，“800”则代表容量为80GB。
代表硬盘标志，它由主标志和副标志组成：第一个数字为主标志，在普通IDE硬盘中代表盘片数。
例如“2”即代表该硬盘内采用了2张盘片。
第二个数字为副标志，即硬盘的辅助标志。
只有当主标志相同或无效时，副标志才有效。
一般用它来表示硬盘的代数，数字越大表示代数越高，也就是说此款硬盘越新。
由1到3个字母组成，代表硬盘接口类型。
普通桌面硬盘的较为简单，但如果包括现在和早期的SCSI硬盘，其含义就较为复杂了，这里只介绍目前主流的桌面硬盘：“A”代表Ultra AT A，即普通IDE/EIDE接口，这是大多数桌面硬盘所采用的接口类型；“AS”代表Serial ATA150，即串行ATA 1.0硬盘接口。
如图所示，ST3120023AS表示希捷公司的3.5英寸，采用2张硬盘盘片、容量为120GB，末尾的AS说明这是最新的采用串行ATA接口并带有8MB缓存的酷鱼5。
移动电子政务加密认证TF卡模块
应用领域 标准TF卡(安全加密) 射频TF卡片(SD+TYPEA 13.56MHz) 标准SD卡(大SD卡) 加密机芯片(EMI 通用存储器) SD控制芯片或U盘控制芯片 NFC(近场)卡
a
3
产品概述
API
SD控制器 安全芯片
Flash存储
a
4
产品特点与产品优势
高性能高安全的32位CPU内核
548KB用户数据存储区(norflash)，寿命10年，擦写次数10万次
32KB系统SRAM+4.25KB可使用的内部SRAM
SD控制模块，支持SD2.0，支持CMD Class0-10;
安全sd卡产品采用了双芯片的物理架构使用sdc芯片和nf芯片封装在一起将移动设备sd卡和智能卡技术结合起来实现了既支持安全功能又带有巨量用户数据存储空间的复合型设备并且还可以实现存储的用户数据密文保存的应用
移动电子政务
a
1
产品介绍内容
产品概述 产品特点与产品优势 安全特性 技术参数 产品形式 技术支持 竞争对手对比 应用领域与应用场景
a
2
产品概述
安全SD卡产品采用了双芯片的物理架构，使用SDC芯片和NF芯片封 装在一起，将移动设备SD卡和智能卡技术结合起来，实现了既支持 安全功能、又带有巨量用户数据存储空间的复合型设备，并且还可 以实现存储的用户数据密文保存的应用。
本安全芯片是公司自主研发设计的一款高性能高速32位SD卡安全芯 片。带有SDC控制器，支持SD2.0协议；具有NFC控制器，兼容 ONFI1.x与2.2标准，支持主流Nandflash memory。片内包含548KB Norflash，与32K系统RAM。支持SM1/SM2/DES/RSA/等安全算法， 具有SD/SWP/TYEA/EMI等多接口；具有16bit CRC及2个32位Timer， 及WDT功能等等。可广泛应用于标准TF卡(安全加密)，射频TF卡片 (SD+TYPEA 13.56MHz)，标准SD卡(大SD卡)，加密机芯片(EMI 通 用存储器)，和SD控制芯片或U盘控制芯片等等领域。