Fingerprint sensing circuit
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专利名称：Fingerprint sensing circuit
发明人：Richard Alex Erhart,Richard Brian Nelson,Erik
Thompson,Armando Leon Perezselsky
申请号：US13031557
申请日：20110221
公开号：US09666635B2
公开日：
20170530
专利内容由知识产权出版社提供
专利附图：
摘要：Fingerprint sensing circuit packages and methods of making such packages may comprise a first substrate having a top side and a bottom side; the top side comprising a fingerprint image sensing side over which a user's fingerprint is swiped; the bottom side
comprising a metal layer forming a fingerprint sensing circuit image sensor structure; and a sensor control circuit housed in a sensor control circuit package mounted on the metal layer. The sensor control circuit may comprise an integrated circuit die contained within the sensor control circuit package. The fingerprint sensing circuit package may also have a second substrate attached to the bottom side of the first substrate having a second substrate bottom side on which is placed connector members connecting the fingerprint sensing circuit package to a device using a fingerprint image generated from the fingerprint sensing circuitry contained in the fingerprint sensing circuitry package.
申请人：Richard Alex Erhart,Richard Brian Nelson,Erik Thompson,Armando Leon Perezselsky
地址：Tempe AZ US,Chandler AZ US,Phoenix AZ US,Mesa AZ US
国籍：US,US,US,US
代理机构：Leydig, Voit & Mayer, LTD
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