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Fujitsu fi-6140 fi-6240 消耗品替换与清洁指南说明书

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fi-6140/fi-6240 CONSUMABLE REPLACEMENT AND CLEANING INSTRUCTIONS Clean the Pick Rollers(5) by removing them from the scanner and cleaning with a lint free cloth moistend with F1 cleaner. Using the same lint free cloth moistend with F1 clean the Glass(4), Plastic Rollers(6) and Ultrasonic Sensor(7). Clean the paper path of any loose debris using a soft cloth0 CONSUMABLE REPLACEMENT AND CLEANING INSTRUCTIONS
Slide the worn Pick Roller (2)
from the Pick Roller Shaft (3)
while pulling up on the locking tab on the end of the pick roller (1).
fi-6140/fi-6240 CONSUMABLE REPLACEMENT AND CLEANING INSTRUCTIONS
fi-6140/fi-6240 CONSUMABLE REPLACEMENT AND CLEANING INSTRUCTIONS ADDENDUM
CG00002-013401 Revision A
REPLACING CONSUMABLES
From the [start] menu, select [All Programs] ([Scanner Utility for Microsoft Windows]([Software Operation Panel].

产品常见问题

产品常见问题书生卡问题1、书生卡驱动程序安装不上（“没找到相应硬件，请检查硬件是否插好”-）解决方法：1)我的电脑点击鼠标右键－属性－硬件－设备管理器，在有黄色警告的选项上点击鼠标右键－更新驱动程序（或选中PCI简易通讯控制器）2)选择从列表或指定位置安装3)不要搜索。

我要自己选择要安装的驱动程序。

4)选择硬件时，选择多功能卡，选中后，点右边的从磁盘安装5)在弹出的对话框中点浏览，找光盘中的文件6)继续安装后出现界面再点浏览，找win2000中的的文件 .2、书生卡安装错误报“名称已用作服务名或者服务显示名”1)把光盘下的win2000下的文件拷到电脑中，将文件的名字改为2)我的电脑点击鼠标右键－属性－硬件－设备管理器，在有黄色警告的选项上点击鼠标右键－更新驱动程序3)选择从列表或指定位置安装4)不要搜索。

我要自己选择要安装的驱动程序。

5)选择硬件时，选择多功能卡，选中后，点右边的从磁盘安装6)在弹出的对话框中点浏览，找光盘Win98下的文件7)继续安装后出现界面再点浏览，找电脑中改过名字的文件3、设备管理器右边书生卡的驱动显示为：PCI Multi-IO Controller正常显示为解决方法：重新更新书生卡驱动，步骤同问题14、设备管理器中书生卡驱动显示正常，但还是不能盖章等操作sep1程序：检查帮助菜单—关于，是否能够查到书生卡号，能看到卡号才是正常的。

若不正常，请用橡皮擦擦下书生卡金属片防止氧化或更换插槽、更换机器试下，如果还不可以，需要换卡。

sep2程序：检查C:\Program Files\Sursen\Sedcore里文件，获取书生卡硬件信息，看能不能识别到卡号。

若不正常，请用橡皮擦擦下书生卡金属片防止氧化或更换插槽、更换机器试下，如果还不可以，需要换卡。

5、飞天key-----手动删除的方法1）Program Files目录下如有ngsrv目录，删除。

2）system32目录下删除ng开头的文件。

柔性检查作用域套件-USB 产品说明书

lInstructions for Use: Flexible Inspection Scope Kit-USB Brand Name of ProductFlexible Inspection Scope Kit - USB Generic Name of ProductFlexible Inspection Scope Kit - USB Product Code Number(s)FIS-007U, FIS-007USK, FIS-007UB, CT-101, CT-102Intended UseFor visually inspecting items.Range of Applications for ProductEnhance visual inspection by providing lighted magnification, image capture and the option for documentation in hard-to-see crevices, channels, and lumens in areas of instruments that are not visible to the unaided eye.Key Specifications of Product Flexible Inspection Scope- FIS-007U∙CT-101 1.90 mm OD and 110 cm length∙CT-102 1.06 mm OD and 110 cm length∙Opticalo Resolution format:o CT-102 1.06 mm: 40,000 pixels (or 200- x 200 pixels)o CT-101 1.90 mm: 160,000 pixels (or 400- x 400 pixels)o Field of View: 120° in airo Angle of view: 0°USB Control Module: Control Module housing Camera processor and LEDillumination:∙Dimensions: 5.25- x 3.90- x 1.85 inches∙Weight: 1.20 pounds ∙Digital Inspection Scope Connection∙Illumination Control- LED in the Control Module∙Power Cycle∙USB Camera Cable∙Easily change from small and large diameter scopes.Light Settings:There are four light settings operated by one button.Blinking Light (Indicates transmitting video data):∙Splash proof (IPX5 Rating)∙No external power needed.Flexible Inspection Scope Software Requirements:∙Compatible with Windows 10 Operating systems.∙USB flash drive includes software.Unpacking Flexible Inspection Scope:Carefully inspect for shipping damage. If there is any damage contact the shipping carrier and Heatlhmarkcustomer service 800-521-6224 immediately.USB Control Module: (Fig. 1).1.Digital Inspection Scope Connection 2.Illumination Control 3.Power Cycle B (Type C) on the right side of the boxFigure 1Flexible Inspection Scope™: (Fig. 2).∙CT-101 1.90 mm O.D. and 110 cm length ∙CT-102 1.06 mm O.D. and 110 cm lengthLarge1.90 mmSmall 1.06 mmFigure 2Flexible Inspection Scope™ Features3214Light/Illumination Settings: (Fig. 3).∙Five (5) light settingso Light on control indicats setting levelo Fifth setting is OFF∙Press light button to advance to next setting.∙Fifth setting turns the light OFF.Figure 3Power Cycle ButtonPress button to RESET camera (Fig. 4).Figure 41.Flexible Inspection Scope™ Plug (Fig. 5).Contains camera video connection as well as LED Light for illumination.1Figure 52.Flexible Working Length (Fig. 6).The portion of the Flexible Inspection Scope™ that is inserted into an item during visual inspection.The measuring scale markings on the Flexible Working Length are in centimeters (accuracy = ± 0.5 cm)2Figure 63.Distal Camera (Fig. 7).Distal portion of Flexible Inspection Scope™ that contains the camera lens3Figure 7SOFTWARE INSTALLATION:Note: This section is done only once when connecting the scope to the computer for the first time.∙System Requirements: MS Windows 10∙Install the Flexible Inspection Scope™ Software from the USB flash drive on a computer.Note: If you have any IT policies that may block this installation, please contact your IT team to give access to Healthmark scope viewer to install.1. Insert the USB Flash drive into your computer, and double click on the Healthmark Scope Viewer installer package to begin installation.2. The “Welcome to the Healthmark Scope Viewer Setup Wizard” screen pops up. Click on Next.3. Select the first tab Typical or setup type of your choice, click Next.4. Click Install and wait for installation to complete.5. Click Finish.STARTING SOFTWARE & CONNECTING SCOPE TO PC:(Fig 8).1.Open the Windows PC viewer software.2.Connect the Control Module to PC using USB Cable.3.Plug the Flexible Inspection Scope into the Control Module.4.In the viewer software, click Settings and Select USB Video Device, click on the desiredresolution, select the preferred Video Output Format, and then Click OK.5.Press the Power Cycle Button.Figure 86.Now you can start using the scope.Verifing OperationFollowing the steps listed below will ensure the proper use and performance of the Flexible Inspection Scope™. The Flexile Inspection Scope™ can be checked for normal operation by connecting it as described in the Startup section of this IFU.Normal operation includes:∙An image appearing on your computer monitor or HDMI Monitor.∙ A blinking light on Control Module near the Power Cycle button that indicates the image feed is transmitting.∙White light emitting from the distal end of the Digital Inspection Scope.∙An LED light on the control module top panel that indicates the light intensity of the device. Using SoftwareHealthmark Scope Viewer Software (Fig. 9).1.Capture button: Captures a Reference Image and saves it to the Reference Image folder.2.Main Image Window: Displays the image from the camera.3.Reference Image Window: Displays a reference image.4.Clear Button: Removes the image from the Reference image window.5.Open Reference Image button: Allows selection of a reference image from the Reference Imagefolder.6.Settings Button: Click to select the video camera and resolution settings.7.File Location Button: Click to change location where captured images are being saved.8.File Location Window: Shows the file path where captured images are being saved currently.9.Capture Image Button: Captures images and adds them to the File Location selected by the user(as shown in the File Location Window).10.Capture Video button: Click to record video. Click again to stop recording video.11.File Prefix: Type in text that you would like included in the file name of Captured Images.Figure 9Selecting Video Device or CameraFollow the directions below to select the video device or camera used to capture images using the Flexible Inspection Scope™ Viewer Software. (Fig. 10).1.Click Settings button in the lower left of the Scope Viewer software to display a list of videodevices or cameras being detected by your computer2.Select a device for capturing images using the Scope Viewera.The example below shows a webcam and USB Video Device in the Settings box. Select theUSB Video Device for the Flexible Inspection Scope™.b.You can also select your preferred Video Output Format from the dropdown box3.Click OK to view the selected Video Device.231Figure 10Capturing Still PicturesFollow the instructions for capturing still pictures from the Main Image Window.Select the Capture Image button. (Fig. 11).Figure 11Note: When an image is captured, “Image Captured” in red text will flash on the lower portion of the screen and a new file will appear in the Files Location.Capturing Video ImagesFollow the instructions below for capturing video from the Main Image Window.1.Select the Capture Video Button (Fig. 12).Figure 122.When the video is recording “Recording…” in red text will appear toward the bottom of thesoftware window.3.To stop recording, click Stop Capture. (Fig. 13).Figure 13Setting File PrefixFollowing the steps below allows you to create a file prefix that will appear after the underscore of image file names save to the File Location specified by the user.1.Click in the field next to File Prefix.2.Enter the characters that you would like to be included in the file name. (Fig 14).Figure 14Setting Location for Saved FilesFollowing the steps below allows you to set the file location of saved images using the Scope Viewer software.1.Click the File Location button.2.Select the file location you want to save captured images. (Fig 15).Figure 15Displaying Reference ImageThere are two ways to display a still image in the Reference Image Window on the Scope Viewer software.1.To display an image currently being displayed in the Main Image Window, click the Capture button. Note: The images will be saved in a file folder titled Reference Images in the designated File Location that the user specified in the File Location field. (Fig. 16).Figure 162.To display a saved image in the Reference Image Window from your File Location:a.Click the Open Reference Image button (Fig. 16 above).b.Select the file you want to display (Fig. 17 below).c.Click the OK Button, to display the image in the Reference Image Window. (Fig. 17).Figure 17Switching to a Different Flexible Inspection Scope™ on the Control Module:1.Press the Power button on the Control Module once.2.Disconnect the current Flexible Inspection Scope from the Control Module.3.Repeat the steps in the “STARTING SOFTWARE & CONNECTING SCOPE TO PC” procedure.Inserting Scope in ItemFigure 1Rotating Device to Avoid ObstacleFigure 2 Performing InspectionWipe down the Flexible Inspection Scope™ with a compatible wipe. Follow the manufacturer’s (Mfr.’s)Instructions for Use (IFU) for appropriate wipe usage. Click here to see the Chemical Compatibility Chart(PDF) for approved cleaning.The Flexible Inspection Scope™ is made of the same material as other common endoscopes. Any wipe,solution, or low temperature (≤ 60 °C [140 °F]) method intended for the reprocessing of endoscopes is likelycompatible with the Generation II Flexible Inspection Scope™ Catheters if used according to the productlabeling.Solutions Containing (Flexible Inspection Scope Only)Alcohol Ethoxylates Neutral or Near-Neutral pH DetergentsEnzymatic Cleaning Solutions Enzymatic DetergentsSodium Borated, Decahydrate Tetrapotassium PyrophosphateFlexible Inspection Scope™ has a fluid ingress protection rating of IPX7 (Waterproof) and can withstandimmersion in fluid up to one (1)-meter in depth for up to 30 minutes.Control Module USB has a fluid ingress protection rating of IPX5 (Water resistant) and can withstand asustained, low pressure water jet spray for up to three minutes.For Thorough Cleaning: CablesFollow the cleaning agent Mfr.’s IFU.1.Unplug and disconnect all components from the Control box prior to cleaning.2.Do not submerge or soak the cable for disinfection (cable is not waterproof).3.Wipe thoroughly with non-linting wipe moistened with facility approved neutral detergent. Use theappropriate brushes with detergent solution to remove any residues from areas that cannot bereached with the wipes.For Thorough Cleaning: Control Module1.Unplug and disconnect all components from the Control box prior to cleaning.2.Do not submerge or soak the cable for disinfection (Control Box is not waterproof).3.Wipe thoroughly with non-linting wipe moistened with facility approved neutral detergent. Use theappropriate brushes with detergent solution to remove any residues from areas that cannot bereached with the wipes.Note: Do NOT soak. Control Module and cables are not waterproof and should not be immersed.N/ACleaning –AutomatedDisinfection Control Module and CablesThese may be cleaned with alcohol based disinfectant wipes.Compatible agents (wipes and solutions) for disinfecting Flexible Inspection Scope™ and ControlModule:∙Hydrogen peroxide∙Isopropyl alcohol (IPA)∙Sodium hypochlorite (Bleach)∙Ortho-phenylphenol∙Quaternary ammonium.High-Level Disinfection (Flexible Inspection Scope™ Only)∙Select only disinfecting solutions listed in the compatible disinfecting methods.∙Follow all recommendations regarding health-hazards, dispensing, measuring, and storage from the Mfr. of cleaning and disinfecting agents.∙Soak the Flexible Inspection Scope™ in selected disinfecting solution per Mfr.’s IFU.∙Rinse the Flexible Inspection Scope™ with critical (sterile) water, again, following the disinfecting solutions Mfr.’s instructions.Reprocessing Chemical Compatibility Chart (PDF): Click here.。

一致性测试系统 (T4010S)

是德科技 T4010S一致性测试系统技术概述Keysight T4010S 一致性测试系统包括 LTE 和 LTE-Advanced 载波聚合（CA ）、RF 和 RRM 一致性测试、窄带物联网射频（NB-IoT RF ），以及用于 LTE 和窄带物联网（NB-IoT ）设备设计验证和预认证测试的解决方案。

该系统除了提供 3GPP 定义的 LTE RF 和 RRM 一致性测试方案之外，还提供了广泛的补充测试方案，以满足网络运营商验收和其他应用的要求。

相比同类型的 LTE RF 和 RRM 测试系统，T4010S 是更容易使用的测试平台。

一致性测试T4010S 一致性测试系统可以满足用户设备和芯片制造实验室，以及第三方认证试验室的特殊需求。

它提供了全套工具，帮助您将被测用户设备的数据输入测试系统中，定义将要执行的测试计划，根据用户设备的特定特点配置系统进行测试，分析测试结果，并生成相关的测试报告。

随着频段和频率组合数量的不断增多，以及需要支持日益丰富的 GCF 和 PTCRB 测试方案，是德科技专注在该平台上持续开发一系列验证计划，使 Keysight T4010S 测试平台成为用户测试实验室中一个极其宝贵和高效的资产。

概述设计验证为了满足基带和射频硬件开发商的特殊测试需求，系统提供了全套符合 3G P P 36.521-1 规范的测试方案，能够立即用于对 LTE 和 NB-IoT 用户设备设计执行预认证的测试。

在开发初期，T4010S 设计与验证（DV ）系统能够让您创建或定制测试方案，以验证 LTE 和 NB-IoT 用户设备的射频参数设计特性，避免在项目后期发现设计问题而重新修改设计，以及由此带来的巨大损失。

它可以增强您对新 LTE 和 NB-IoT 用户设备设计的信心，并加速产品上市速度。

出色的模块化架构和灵活性使该系统成为质量保证与产品筛选的理想工具。

主要特性Keysight T4010S 一致性测试系统能够为您提供所需的功能，加快您的 LTE 和NB-IoT 用户设备设计的上市速度： –易于使用的测试项目管理环境可以通过设计验证、一致性测试和补充测试，显著优化测试执行和结果分析–降低运营和维护成本 ― 最高效的硬件体系结构，标配的硬件可以支持所有正在使用的 LTE 和 NB-IoT 频段和双工模式–射频路径补偿过程具备自动化和无人值守特性–清晰和即刻地访问测试结果，包括导出不同格式（html 、CSV 和 XML ），以进一步分析和归档–除了 3GPP 一致性标准规定的测试范围，还可以配置更多测试条件和 LTE 信令，从而轻松定制您的测试计划简化复杂测试从设计和验证阶段到最终产品的认证，包括运营商的验收测试计划，这种 RF 和 RRM 一站式综合解决方案都将发挥作用。

Fujitsu fi-4010CU 消耗品替换与清洁指南说明书

2K IT CONTENTSCotton Swabs Qty 1 100/packF1 CleanerIsopropyl AlcoholQty 1Cleaning Paper Qty 1 10/packLint FreeCleaning ClothsQty 2 20/pack Pad AssemblyQty 23C ONSUMABLES L ISTDescription Qty Life Fujitsu P/NPad Assembly 120,000 Pages CA06009-G009Note:Replacement Cycles are estimated guidelines established by testing with A4/Letter sized woodfree and wood based 17 lb paper. NCR or Carbonless paper has chemical composition which damages the Pad.Cleaning of the consumables and feed rollers will be required more frequently to avoid feed problems. Consumable life will be reduced ifNCR or Carbonless paper is scanned.C ONSUMABLES P AGE C OUNTDouble click the “Scanners and Cameras” Icon on the Control panel of the Host Computers Windows Operating System. Double click the “fi-4010CU” in the “Scanners and Cameras Properties” Display to display the Properties screen. Select the “Device Set” Tab.Pad Assembly4C ONSUMABLES P AGE C OUNT (CONTINUED)•Your computer will display the Properties for the fi-4010CU scanner.You can reset the Pad counter to 0 each time it is changed todetermine when it should be changed next.5R EPLACING THE P AD A SSEMBLYA defective or improperly installed Pad Assembly can cause misspicks,skew, or double fed documents. To replace the Pad Assembly perform the following steps.•Remove all documentsfrom the ADF PaperChute. Open the ADFby pulling the ADFbutton up.•Remove the PadAssembly by pressingboth sides of theclamp so the pad canbe pulled out.•Attach the new PadAssembly in reverse ofremoval. Be sure toseat the padcompletely to avoidjamming of paper being fed.Note:After replacement of any consumable reset the counter for that consumable by following the “Consumables Page Count” Section atthe front of these instructions to reset paper counts.6C LEANING L OCATIONS AND F REQUENCIESNote:The scanner will need to be cleaned every day (or possibly more than once a day) if the following paper is scanned.•Paper with special coating such as carbonless paper.•Paper with large amount of printing. (Heavy toner or ink)•Documents with toner that is not fused properly.C LEANING M ATERIALSFrequencyCottonSwabsF1 CleanerIsopropyl AlcoholCleaning PaperLint FreeCleaning Cloths7C LEANING THE R OLLERS WITH THE C LEANING P APER•Set the Hopper Guides tothe widest width possible.The cleaning papers are designed to remove only loose paper dust and ink from the rollers. Use the cleaning paper approximately every 1,000 sheets scanned. They are to be used in between the thorough cleanings of the scanner. Using the cleaning paper does not take the place of the more complete cleanings described later in this section•Spray the Cleaning Paper lightly with F1 Cleaner and place the Cleaningpaper against the right edge of the Hopper Guide. SCAN the cleaningpaper to feed it through the scanner’s ADF. Do Not Save These Images.This operation is used only to pass the cleaning paper through the paper feed path. Check the path to see if it needs further cleaning, if you find debris in the paper path perform this cleaning or the (C LEANING THE ADF WITH L INT -F REE C LOTHS ) in the following steps.•Place the Cleaning Paper against the Left Hopper Guide and perform theprevious step.8•Turn Scanner power off.•Open the ADF cover bypulling the ADF open.Disconnect the AC powerplug. Let the scanner cool forat least 15 minutes afteroperation. This is to preventburns to your skin as thelamps will heat the surface ofthe glass in the feed path.•Use F1 Cleaner (90% orhigher Isopropyl Alcohol) ona lint free cloth and clean theareas shown in the drawingbelow and to the right. (Seefollowing steps to cleanproperly)•Clean the Pad Assemblyusing a downward stroke inthe direction of documenttravel through the ADF(shown by the arrow in thedrawing to the right) with thelint free cloth moistenedlightly with F1 Cleaner (90%or higher Isopropyl Alcohol).C LEANING THE ADF WITH L INT-F REE C LOTHSNote:The glass surface inside the fi-4010CU ADF becomes hot during scanner operation. Before performing this cleaning turn off the scanner and disconnect the AC adapter from the power outlet, wait at least 15 minutes for the scanner to cool.C LEANING THE P AD A SSEMBLY.Pad Assembly9。

08-报关管理系统操作手册

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报关管理系统操作手册
2.2 通用界面和操作
2.2.1 通用编辑操作
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点击上图中的【新增】、【修改】按钮，会弹出相应的详细页面，可以进行新增、修改的编辑。在新增、修改编辑后只有点击【提交】按钮才能将信息保存到数据库，否则只是对页面进行的编辑。
北京络捷斯特科技发展有限公司
报关管理系统操作手册
拟制：审核：审核：批准：
日期：日期：日期：日期：
文档编号: Logis-czsc008
密级: 保密
报关管理系统操作手册
修订记录
日期 2006年 2007年 2008年 2009年修订版本 V1.0 V2.0 V3.0 V4.0 描述作者
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报关管理系统操作手册
4.3报关放行.............................................................................................................................. 26 5.报关系统维护............................................................................................................................ 26 5.1国家地区.............................................................................................................................. 27 5.2相关代码.............................................................................................................................. 27 6.LOGIS公司简介.......................................................................................................................... 28

CY7C63723-PC中文资料

元器件交易网CY7C63743CY7C63722/23CY7C63743enCoRe™ USBCombination Low-Speed USB & PS/2Peripheral ControllerTABLE OF CONTENTS1.0 FEATURES (5)2.0 FUNCTIONAL OVERVIEW (6)2.1 enCoRe USB - The New USB Standard (6)3.0 LOGIC BLOCK DIAGRAM (7)4.0 PIN CONFIGURATIONS (7)5.0 PIN ASSIGNMENTS (7)6.0 PROGRAMMING MODEL (8)6.1 Program Counter (PC) (8)6.2 8-bit Accumulator (A) (8)6.3 8-bit Index Register (X) (8)6.4 8-bit Program Stack Pointer (PSP) (8)6.5 8-bit Data Stack Pointer (DSP) (9)6.6 Address Modes (9)6.6.1 Data (9)6.6.2 Direct (9)6.6.3 Indexed (9)7.0 INSTRUCTION SET SUMMARY (10)8.0 MEMORY ORGANIZATION (11)8.1 Program Memory Organization (11)8.2 Data Memory Organization (12)8.3 I/O Register Summary (13)9.0 CLOCKING (14)9.1 Internal/External Oscillator Operation (15)9.2 External Oscillator (16)10.0 RESET (16)10.1 Low-voltage Reset (LVR) (16)10.2 Brown Out Reset (BOR) (16)10.3 Watchdog Reset (WDR) (17)11.0 SUSPEND MODE (17)11.1 Clocking Mode on Wake-up from Suspend (18)11.2 Wake-up Timer (18)12.0 GENERAL PURPOSE I/O PORTS (18)12.1 Auxiliary Input Port (21)13.0 USB SERIAL INTERFACE ENGINE (SIE) (22)13.1 USB Enumeration (22)13.2 USB Port Status and Control (22)14.0 USB DEVICE (24)14.1 USB Address Register (24)14.2 USB Control Endpoint (24)14.3 USB Non-control Endpoints (25)14.4 USB Endpoint Counter Registers (26)15.0 USB REGULATOR OUTPUT (27)16.0 PS/2 OPERATION (27)17.0 SERIAL PERIPHERAL INTERFACE (SPI) (28)17.1 Operation as an SPI Master (29)17.2 Master SCK Selection (29)17.3 Operation as an SPI Slave (29)17.4 SPI Status and Control (30)17.5 SPI Interrupt (31)17.6 SPI Modes for GPIO Pins (31)18.0 12-BIT FREE-RUNNING TIMER (31)19.0 TIMER CAPTURE REGISTERS (32)20.0 PROCESSOR STATUS AND CONTROL REGISTER (35)21.0 INTERRUPTS (36)21.1 Interrupt Vectors (37)21.2 Interrupt Latency (37)21.3 Interrupt Sources (37)22.0 USB MODE TABLES (42)23.0 REGISTER SUMMARY (47)24.0 ABSOLUTE MAXIMUM RATINGS (48)25.0 DC CHARACTERISTICS (48)26.0 SWITCHING CHARACTERISTICS (50)27.0 ORDERING INFORMATION (55)28.0 PACKAGE DIAGRAMS (55)LIST OF FIGURESFigure 8-1. Program Memory Space with Interrupt Vector Table (11)Figure 8-2. Data Memory Organization (12)Figure 9-1. Clock Oscillator On-chip Circuit (14)Figure 9-2. Clock Configuration Register (Address 0xF8) (14)Figure 10-1. Watchdog Reset (WDR, Address 0x26) (17)Figure 12-1. Block Diagram of GPIO Port (one pin shown) (19)Figure 12-2. Port 0 Data (Address 0x00) (19)Figure 12-3. Port 1 Data (Address 0x01) (19)Figure 12-4. GPIO Port 0 Mode0 Register (Address 0x0A) (20)Figure 12-5. GPIO Port 0 Mode1 Register (Address 0x0B) (20)Figure 12-6. GPIO Port 1 Mode0 Register (Address 0x0C) (20)Figure 12-7. GPIO Port 1 Mode1 Register (Address 0x0D) (20)Figure 12-8. Port 2 Data Register (Address 0x02) (21)Figure 13-1. USB Status and Control Register (Address 0x1F) (23)Figure 14-1. USB Device Address Register (Address 0x10) (24)Figure 14-2. Endpoint 0 Mode Register (Address 0x12) (25)Figure 14-3. USB Endpoint EP1, EP2 Mode Registers (Addresses 0x14 and 0x16) (26)Figure 14-4. Endpoint 0,1,2 Counter Registers (Addresses 0x11, 0x13 and 0x15) (26)Figure 17-1. SPI Block Diagram (28)Figure 16-1. Diagram of USB-PS/2 System Connections (28)Figure 17-2. SPI Data Register (Address 0x60) (29)Figure 17-3. SPI Control Register (Address 0x61) (30)Figure 17-4. SPI Data Timing (31)Figure 18-1. Timer LSB Register (Address 0x24) (31)Figure 18-2. Timer MSB Register (Address 0x25) (32)Figure 18-3. Timer Block Diagram (32)Figure 19-1. Capture Timers Block Diagram (33)Figure 19-2. Capture Timer A-Rising, Data Register (Address 0x40) (33)Figure 19-3. Capture Timer A-Falling, Data Register (Address 0x41) (34)Figure 19-4. Capture Timer B-Rising, Data Register (Address 0x42) (34)Figure 19-5. Capture Timer B-Falling, Data Register (Address 0x43) (34)Figure 19-6. Capture Timer Status Register (Address 0x45) (34)Figure 19-7. Capture Timer Configuration Register (Address 0x44) (34)Figure 20-1. Processor Status and Control Register (Address 0xFF) (35)Figure 21-1. Global Interrupt Enable Register (Address 0x20) (38)Figure 21-2. Endpoint Interrupt Enable Register (Address 0x21) (39)Figure 21-3. Interrupt Controller Logic Block Diagram (40)Figure 21-4. Port 0 Interrupt Enable Register (Address 0x04) (40)Figure 21-5. Port 1 Interrupt Enable Register (Address 0x05) (40)Figure 21-6. Port 0 Interrupt Polarity Register (Address 0x06) (41)Figure 21-7. Port 1 Interrupt Polarity Register (Address 0x07) (41)Figure 21-8. GPIO Interrupt Diagram (41)Figure 26-1. Clock Timing (51)Figure 26-2. USB Data Signal Timing (51)Figure 26-3. Receiver Jitter Tolerance (52)Figure 26-4. Differential to EOP Transition Skew and EOP Width (52)Figure 26-5. Differential Data Jitter (52)Figure 26-7. SPI Slave Timing, CPHA = 0 (53)Figure 26-6. SPI Master Timing, CPHA = 0 (53)Figure 26-8. SPI Master Timing, CPHA = 1 (54)Figure 26-9. SPI Slave Timing, CPHA = 1 (54)LIST OF TABLESTable 8-1. I/O Register Summary (13)Table 11-1. Wake-up Timer Adjust Settings (18)Table 12-1. Ports 0 and 1 Output Control Truth Table (21)Table 13-1. Control Modes to Force D+/D– Outputs (24)Table 17-1. SPI Pin Assignments (31)Table 19-1. Capture Timer Prescalar Settings (Step size and range for FCLK = 6 MHz) (35)Table 21-1. Interrupt Vector Assignments (37)Table 22-1. USB Register Mode Encoding for Control and Non-Control Endpoints (42)Table 22-2. Decode table for Table 22-3: “Details of Modes for Differing Traffic Conditions” (44)Table 22-3. Details of Modes for Differing Traffic Conditions (45)Table 28-1. CY7C63722-XC Probe Pad Coordinates in microns ((0,0) to bond pad centers) (57)1.0 Features•enCoRe™ USB - enhanced Component Reduction—Internal oscillator eliminates the need for an external crystal or resonator—Interface can auto-configure to operate as PS/2 or USB without the need for external components to switch between modes (no GPIO pins needed to manage dual mode capability)—Internal 3.3V regulator for USB pull-up resistor—Configurable GPIO for real-world interface without external components•Flexible, cost-effective solution for applications that combine PS/2 and low-speed USB, such as mice, gamepads, joysticks, and many others.•USB Specification Compliance—Conforms to USB Specification, Version 2.0—Conforms to USB HID Specification, Version 1.1—Supports 1 Low-Speed USB device address and 3 data endpoints—Integrated USB transceiver—3.3V regulated output for USB pull-up resistor•8-bit RISC microcontroller—Harvard architecture—6-MHz external ceramic resonator or internal clock mode—12-MHz internal CPU clock—Internal memory—256 bytes of RAM—8 Kbytes of EPROM—Interface can auto-configure to operate as PS/2 or USB—No external components for switching between PS/2 and USB modes—No GPIO pins needed to manage dual mode capability•I/O ports—Up to 16 versatile General Purpose I/O (GPIO) pins, individually configurable—High current drive on any GPIO pin: 50 mA/pin current sink—Each GPIO pin supports high-impedance inputs, internal pull-ups, open drain outputs or traditional CMOS outputs —Maskable interrupts on all I/O pins•SPI serial communication block—Master or slave operation—2 Mbit/s transfers•Four 8-bit Input Capture registers—Two registers each for two input pins—Capture timer setting with 5 prescaler settings—Separate registers for rising and falling edge capture—Simplifies interface to RF inputs for wireless applications•Internal low-power wake-up timer during suspend mode—Periodic wake-up with no external components•Optional 6-MHz internal oscillator mode—Allows fast start-up from suspend mode•Watchdog Reset (WDR)•Low-voltage Reset at 3.75V•Internal brown-out reset for suspend mode•Improved output drivers to reduce EMI•Operating voltage from 4.0V to 5.5VDC•Operating temperature from 0 to 70 degrees Celsius•CY7C63723 available in 18-pin SOIC, 18-pin PDIP•CY7C63743 available in 24-pin SOIC, 24-pin PDIP•CY7C63722 available in DIE form•Industry standard programmer support2.0 Functional Overview2.1enCoRe USB - The New USB StandardCypress has re-invented its leadership position in the low-speed USB market with a new family of innovative microcontrollers. Introducing...enCoRe USB—“enhanced Component Reduction.” Cypress has leveraged its design expertise in USB solutions to create a new family of low-speed USB microcontrollers that enables peripheral developers to design new products with a minimum number of components. At the heart of the enCoRe USB technology is the breakthrough design of a crystal-less oscillator. By integrating the oscillator into our chip, an external crystal or resonator is no longer needed. We have also integrated other external components commonly found in low-speed USB applications such as pull-up resistors, wake-up circuitry, and a 3.3V regulator. All of this adds up to a lower system cost.The CY7C637xx is an 8-bit RISC One Time Programmable (OTP) microcontroller. The instruction set has been optimized specif-ically for USB and PS/2 operations, although the microcontrollers can be used for a variety of other embedded applications. The CY7C637xx features up to 16 general purpose I/O (GPIO) pins to support USB, PS/2 and other applications. The I/O pins are grouped into two ports (Port 0 to 1) where each pin can be individually configured as inputs with internal pull-ups, open drain outputs, or traditional CMOS outputs with programmable drive strength of up to 50 mA output drive. Additionally, each I/O pin can be used to generate a GPIO interrupt to the microcontroller. Note the GPIO interrupts all share the same “GPIO” interrupt vector. The CY7C637xx microcontrollers feature an internal oscillator. With the presence of USB traffic, the internal oscillator can be set to precisely tune to USB timing requirements (6 MHz ±1.5%). Optionally, an external 6-MHz ceramic resonator can be used to provide a higher precision reference for USB operation. This clock generator reduces the clock-related noise emissions (EMI). The clock generator provides the 6- and 12-MHz clocks that remain internal to the microcontroller.The CY7C637xx has 8 Kbytes of EPROM and 256 bytes of data RAM for stack space, user variables, and USB FIFOs.These parts include low-voltage reset logic, a watchdog timer, a vectored interrupt controller, a 12-bit free-running timer, and capture timers. The low-voltage reset (LVR) logic detects when power is applied to the device, resets the logic to a known state, and begins executing instructions at EPROM address 0x0000. LVR will also reset the part when V CC drops below the operating voltage range. The watchdog timer can be used to ensure the firmware never gets stalled for more than approximately 8 ms. The microcontroller supports 10 maskable interrupts in the vectored interrupt controller. Interrupt sources include the USB Bus-Reset, the 128-µs and 1.024-ms outputs from the free-running timer, three USB endpoints, two capture timers, an internal wake-up timer and the GPIO ports. The timers bits cause periodic interrupts when enabled. The USB endpoints interrupt after USB transactions complete on the bus. The capture timers interrupt whenever a new timer value is saved due to a selected GPIO edge event. The GPIO ports have a level of masking to select which GPIO inputs can cause a GPIO interrupt. For additional flexibility, the input transition polarity that causes an interrupt is programmable for each GPIO pin. The interrupt polarity can be either rising or falling edge.The free-running 12-bit timer clocked at 1 MHz provides two interrupt sources as noted above (128 µs and 1.024 ms). The timer can be used to measure the duration of an event under firmware control by reading the timer at the start and end of an event, and subtracting the two values. The four capture timers save a programmable 8 bit range of the free-running timer when a GPIO edge occurs on the two capture pins (P0.0, P0.1).The CY7C637xx includes an integrated USB serial interface engine (SIE) that supports the integrated peripherals. The hardware supports one USB device address with three endpoints. The SIE allows the USB host to communicate with the function integrated into the microcontroller. A 3.3V regulated output pin provides a pull-up source for the external USB resistor on the D– pin.The USB D+ and D– USB pins can alternately be used as PS/2 SCLK and SDATA signals, so that products can be designed to respond to either USB or PS/2 modes of operation. PS/2 operation is supported with internal pull-up resistors on SCLK and SDATA, the ability to disable the regulator output pin, and an interrupt to signal the start of PS/2 activity. No external components are necessary for dual USB and PS/2 systems, and no GPIO pins need to be dedicated to switching between modes. Slow edge rates operate in both modes to reduce EMI.3.0 Logic Block Diagram4.0 Pin Configurations5.0 Pin AssignmentsNameI/O CY7C63723CY7C63743CY7C63722Description18-Pin 24-Pin 25-Pad D–/SDATA,D+/SCLK I/O 121315161617USB differential data lines (D– and D+), or PS/2 clock and data signals (SDATA and SCLK)P0[7:0]I/O1, 2, 3, 4,15, 16, 17, 181, 2, 3, 4,21, 22, 23, 241, 2, 3, 4,22, 23, 24, 25GPIO Port 0 capable of sinking up to 50 mA/pin, or sinking controlled low or high programmable current.Can also source 2 mA current, provide a resistive pull-up, or serve as a high-impedance input. P0.0 and P0.1 provide inputs to Capture Timers A and B, respec-tively.P1[7:0]I/O5, 145, 6, 7, 8,17, 18, 19, 205, 6, 7, 8,18, 19, 20, 21IO Port 1 capable of sinking up to 50 mA/pin, or sinking controlled low or high programmable current. Can alsosource 2 mA current, provide a resistive pull-up, or serve as a high-impedance input.Wake-Up 12-bit Timer USB &D+,D–P1.0–P1.7Interrupt ControllerPort 0P0.0–P0.7GPIO8-bit RISC Xtal RAM 256 Byte EPROM 8K ByteCoreBrown-out Reset XcvrWatch Timer Dog 3.3V Port 1GPIO Capture TimersUSB Engine PS/2Internal Oscillator Oscillator Low ResetVoltage RegulatorTimerSPIXTALOUTXTALIN/P2.1VREG/P2.01234569111516171819202221P0.0P0.1P0.2P0.3P1.0P1.2VSS VREG/P2.0P0.6P1.5P1.1P1.3D+/SCLK P1.7D–/SDATA VCC14P0.710VPPXTALIN/P2.1XTALOUT121378P1.4P1.62423P0.4P0.524-pin SOIC/PDIPCY7C6374312346781011121315161817P0.0P0.1P0.2P0.3VSS VREG/P2.0P0.4P0.6P0.7D+/SCLK D–/SDATA VCC18-pin SOIC/PDIPP0.59VPPXTALIN/P2.1XTALOUTCY7C63723514P1.0P1.1Top View4 5 6 7 8 93 P 0.21 P 0.0 2 P 0.125 P 0.4 24 P 0.523 P 0.622 21 20 19 1811121314151617P0.3P1.0P1.2P1.4P1.6 VSS VSS V P P X T A L I N /P 2.1V R E G X T A L O U T V C C D -/S D A T A D+/SCLK P0.7P1.1P1.3P1.5P1.7CY7C63722-XCDIE106.0 Programming ModelRefer to the CYASM Assembler User’s Guide for more details on firmware operation with the CY7C637xx microcontrollers.6.1Program Counter (PC)The 14-bit program counter (PC) allows access for up to 8 Kbytes of EPROM using the CY7C637xx architecture. The program counter is cleared during reset, such that the first instruction executed after a reset is at address 0x0000. This instruction is typically a jump instruction to a reset handler that initializes the application.The lower 8 bits of the program counter are incremented as instructions are loaded and executed. The upper 6 bits of the program counter are incremented by executing an XPAGE instruction. As a result, the last instruction executed within a 256-byte “page”of sequential code should be an XPAGE instruction. The assembler directive “XPAGEON” will cause the assembler to insert XPAGE instructions automatically. As instructions can be either one or two bytes long, the assembler may occasionally need to insert a NOP followed by an XPAGE for correct execution.The program counter of the next instruction to be executed, carry flag, and zero flag are saved as two bytes on the program stack during an interrupt acknowledge or a CALL instruction. The program counter, carry flag, and zero flag are restored from the program stack only during a RETI instruction.Please note the program counter cannot be accessed directly by the firmware. The program stack can be examined by reading SRAM from location 0x00 and up.6.28-bit Accumulator (A)The accumulator is the general-purpose, do everything register in the architecture where results are usually calculated.6.38-bit Index Register (X)The index register “X” is available to the firmware as an auxiliary accumulator. The X register also allows the processor to perform indexed operations by loading an index value into X.6.48-bit Program Stack Pointer (PSP)During a reset, the program stack pointer (PSP) is set to zero. This means the program “stack” starts at RAM address 0x00 and “grows” upward from there. Note that the program stack pointer is directly addressable under firmware control, using the MOV PSP ,A instruction. The PSP supports interrupt service under hardware control and CALL, RET, and RETI instructions under firmware control.During an interrupt acknowledge, interrupts are disabled and the program counter, carry flag, and zero flag are written as two bytes of data memory. The first byte is stored in the memory addressed by the program stack pointer, then the PSP is incremented.The second byte is stored in memory addressed by the program stack pointer and the PSP is incremented again. The net effect is to store the program counter and flags on the program “stack” and increment the program stack pointer by two.The return from interrupt (RETI) instruction decrements the program stack pointer, then restores the second byte from memory addressed by the PSP . The program stack pointer is decremented again and the first byte is restored from memory addressed by the PSP . After the program counter and flags have been restored from stack, the interrupts are enabled. The effect is to restore the program counter and flags from the program stack, decrement the program stack pointer by two, and re-enable interrupts.The call subroutine (CALL) instruction stores the program counter and flags on the program stack and increments the PSP by two.XTALIN/P2.1IN 912136-MHz ceramic resonator or external clock input, or P2.1 inputXTALOUT OUT1013146-MHz ceramic resonator return pin or internal oscillator outputV PP 71011Programming voltage supply, ground for normal operation V CC111415Voltage supplyVREG/P2.0 81112Voltage supply for 1.3-k Ω USB pull-up resistor (3.3V nominal). Also serves as P2.0 input.V SS699, 10Ground5.0 Pin Assignments (continued)NameI/O CY7C63723CY7C63743CY7C63722Description18-Pin 24-Pin 25-PadThe return from subroutine (RET) instruction restores the program counter, but not the flags, from program stack and decrements the PSP by two.Note that there are restrictions in using the JMP, CALL, and INDEX instructions across the 4-KB boundary of the program memory. Refer to the CYASM Assembler User’s Guide for a detailed description.6.58-bit Data Stack Pointer (DSP)The data stack pointer (DSP) supports PUSH and POP instructions that use the data stack for temporary storage. A PUSH instruction will pre-decrement the DSP, then write data to the memory location addressed by the DSP. A POP instruction will read data from the memory location addressed by the DSP, then post-increment the DSP.During a reset, the Data Stack Pointer will be set to zero. A PUSH instruction when DSP equals zero will write data at the top of the data RAM (address 0xFF). This would write data to the memory area reserved for a FIFO for USB endpoint 0. In non-USB applications, this works fine and is not a problem.For USB applications, the firmware should set the DSP to an appropriate location to avoid a memory conflict with RAM dedicated to USB FIFOs. The memory requirements for the USB endpoints are shown in Section 8.2. For example, assembly instructions to set the DSP to 20h (giving 32 bytes for program and data stack combined) are shown below:MOV A,20h; Move 20 hex into Accumulator (must be D8h or less to avoid USB FIFOs)SWAP A,DSP; swap accumulator value into DSP register6.6Address ModesThe CY7C637xx microcontrollers support three addressing modes for instructions that require data operands: data, direct, and indexed.6.6.1DataThe “Data” address mode refers to a data operand that is actually a constant encoded in the instruction. As an example, consider the instruction that loads A with the constant 0x30:•MOV A, 30hThis instruction will require two bytes of code where the first byte identifies the “MOV A” instruction with a data operand as the second byte. The second byte of the instruction will be the constant “0xE8h”. A constant may be referred to by name if a prior “EQU” statement assigns the constant value to the name. For example, the following code is equivalent to the example shown above:•DSPINIT: EQU 30h•MOV A,DSPINIT6.6.2Direct“Direct” address mode is used when the data operand is a variable stored in SRAM. In that case, the one byte address of the variable is encoded in the instruction. As an example, consider an instruction that loads A with the contents of memory address location 0x10h:•MOV A, [10h]In normal usage, variable names are assigned to variable addresses using “EQU” statements to improve the readability of the assembler source code. As an example, the following code is equivalent to the example shown above:•buttons: EQU 10h•MOV A,[buttons]6.6.3Indexed“Indexed” address mode allows the firmware to manipulate arrays of data stored in SRAM. The address of the data operand is the sum of a constant encoded in the instruction and the contents of the “X” register. In normal usage, the constant will be the “base” address of an array of data and the X register will contain an index that indicates which element of the array is actually addressed:•array: EQU 10h•MOV X,3•MOV A,[x+array]This would have the effect of loading A with the fourth element of the SRAM “array” that begins at address 0x10h. The fourth element would be at address 0x13h.7.0 Instruction Set SummaryRefer to the CYASM Assembler User’s Guide for detailed information on these instructions. Note that conditional jump instructions (i.e., JC, JNC, JZ, JNZ) take 5 cycles if jump is taken, 4 cycles if no jump.MNEMONIC Operand Opcode Cycles MNEMONIC Operand Opcode Cycles HALT 007NOP 204ADD A,expr data014INC A acc214ADD A,[expr] direct026INC X x224ADD A,[X+expr] index037INC [expr] direct237ADC A,expr data044INC [X+expr] index248ADC A,[expr] direct056DEC A acc254ADC A,[X+expr] index067DEC X x264SUB A,expr data074DEC [expr] direct277SUB A,[expr] direct086DEC [X+expr] index288SUB A,[X+expr] index097IORD expr address295SBB A,expr data0A4IOWR expr address2A5SBB A,[expr] direct0B6POP A2B4SBB A,[X+expr] index0C7POP X2C4OR A,expr data0D4PUSH A2D5OR A,[expr] direct0E6PUSH X2E5OR A,[X+expr] index0F7SWAP A,X2F5AND A,expr data104SWAP A,DSP305AND A,[expr] direct116MOV [expr],A direct315AND A,[X+expr] index127MOV [X+expr],A index326XOR A,expr data134OR [expr],A direct337XOR A,[expr] direct146OR [X+expr],A index348XOR A,[X+expr] index157AND [expr],A direct357CMP A,expr data165AND [X+expr],A index368CMP A,[expr] direct177XOR [expr],A direct377CMP A,[X+expr] index188XOR [X+expr],A index388MOV A,expr data194IOWX [X+expr] index396MOV A,[expr] direct1A5CPL 3A4MOV A,[X+expr] index1B6ASL 3B4MOV X,expr data1C4ASR 3C4MOV X,[expr] direct1D5RLC 3D4reserved 1E RRC 3E4XPAGE 1F4RET 3F8MOV A,X404DI 704MOV X,A414EI 724MOV PSP,A604RETI 738CALL addr50 - 5F10JMP addr80-8F5JC addr C0-CF 5 (or 4) CALL addr90-9F10JNC addr D0-DF 5 (or 4)JZ addr A0-AF 5 (or 4)JACC addr E0-EF7JNZ addr B0-BF 5 (or 4)INDEX addr F0-FF148.0 Memory Organization8.1Program Memory Organization[1]After reset Address14 -bit PC0x0000Program execution begins here after a reset.0x0002USB Bus Reset interrupt vector0x0004128-µs timer interrupt vector0x0006 1.024-ms timer interrupt vector0x0008USB endpoint 0 interrupt vector0x000A USB endpoint 1 interrupt vector0x000C USB endpoint 2 interrupt vector0x000E SPI interrupt vector0x0010Capture timer A interrupt Vector0x0012Capture timer B interrupt vector0x0014GPIO interrupt vector0x0016Wake-up interrupt vector0x0018Program Memory begins here0x1FDF8 KB PROM ends here (8K - 32 bytes). See Note below Figure 8-1. Program Memory Space with Interrupt Vector TableNote:1.The upper 32 bytes of the 8K PROM are reserved. Therefore, the user’s program must not overwrite this space.8.2Data Memory OrganizationThe CY7C637xx microcontrollers provide 256 bytes of data RAM. In normal usage, the SRAM is partitioned into four areas: program stack, data stack, user variables and USB endpoint FIFOs as shown below:After reset Address8-bit DSP8-bit PSP0x00Program Stack Growth(User’s firmware movesDSP)8-bit DSP User Selected Data Stack GrowthUser Variables0xE8USB FIFO for Address A endpoint 20xF0USB FIFO for Address A endpoint 10xF8USB FIFO for Address A endpoint 0Top of RAM Memory0xFFFigure 8-2. Data Memory Organization8.3I/O Register SummaryI/O registers are accessed via the I/O Read (IORD) and I/O Write (IOWR, IOWX) instructions. IORD reads the selected port into the accumulator. IOWR writes data from the accumulator to the selected port. Indexed I/O Write (IOWX) adds the contents of X to the address in the instruction to form the port address and writes data from the accumulator to the specified port. Note that specifying address 0 with IOWX (e.g., IOWX 0h) means the I/O port is selected solely by the contents of X.Note:All bits of all registers are cleared to all zeros on reset, except the Processor Status and Control Register (Figure20-1). All registers not listed are reserved, and should never be written by firmware. All bits marked as reserved should always be written as 0 and be treated as undefined by reads.Table 8-1. I/O Register SummaryRegister Name I/O Address Read/Write Function Fig. Port 0 Data0x00R/W GPIO Port 012-2 Port 1 Data0x01R/W GPIO Port 112-3 Port 2 Data0x02R Auxiliary input register for D+, D–, VREG, XTALIN 12-8 Port 0 Interrupt Enable0x04W Interrupt enable for pins in Port 021-4 Port 1 Interrupt Enable0x05W Interrupt enable for pins in Port 121-5 Port 0 Interrupt Polarity 0x06W Interrupt polarity for pins in Port 021-6 Port 1 Interrupt Polarity 0x07W Interrupt polarity for pins in Port 121-7 Port 0 Mode0 0x0A W Controls output configuration for Port 012-4 Port 0 Mode10x0B W12-5 Port 1 Mode00x0C W Controls output configuration for Port 112-6 Port 1 Mode10x0D W12-7 USB Device Address0x10R/W USB Device Address register14-1 EP0 Counter Register0x11R/W USB Endpoint 0 counter register14-4 EP0 Mode Register0x12R/W USB Endpoint 0 configuration register14-2 EP1 Counter Register0x13R/W USB Endpoint 1 counter register14-4 EP1 Mode Register0x14R/W USB Endpoint 1 configuration register14-3 EP2 Counter Register0x15R/W USB Endpoint 2 counter register14-4 EP2 Mode Register0x16R/W USB Endpoint 2 configuration register14-3 USB Status & Control0x1F R/W USB status and control register13-1 Global Interrupt Enable0x20R/W Global interrupt enable register21-1 Endpoint Interrupt Enable0x21R/W USB endpoint interrupt enables21-2 Timer (LSB)0x24R Lower 8 bits of free-running timer (1 MHz)18-1 Timer (MSB)0x25R Upper 4 bits of free-running timer18-2 WDR Clear0x26W Watchdog Reset clear-Capture Timer A Rising0x40R Rising edge Capture Timer A data register19-2 Capture Timer A Falling0x41R Falling edge Capture Timer A data register19-3 Capture Timer B Rising0x42R Rising edge Capture Timer B data register19-4 Capture Timer B Falling0x43R Falling edge Capture Timer B data register19-5 Capture TImer Configuration0x44R/W Capture Timer configuration register19-7 Capture Timer Status0x45R Capture Timer status register19-6 SPI Data0x60R/W SPI read and write data register17-2 SPI Control0x61R/W SPI status and control register17-3 Clock Configuration0xF8R/W Internal / External Clock configuration register9-2 Processor Status & Control0xFF R/W Processor status and control20-1。

Datasheet MLX90614 中文数据手册 rev008

标准上，MLX90614 是按照目标物体发射率 1 进行校准的。客户可根据其目标物体的发射率进行修改，可修改范围为 0.1 至 1.0，修改后，客户也不需要用黑体进行校准。
10-位 PWM 输出模式是连续输出所测物体温度的标准配置，测量物体的温度范围为-20…120 °C，分辨率为 0.14 °C。PWM 通过修改 EEPROM 内 2 个单元的值，实际上可以根据需求调整至任何温度范围，而这对出厂校准结果并无影响。
传感器的测量结果均出厂校准化，数据接口为数字式的 PWM 和 SMBus(System Management Bus) 输出。
作为标准，PWM 为 10 位，且配置为-20˚C 至 120 ˚C 内，分辨率为 0.14 ˚C 的连续输出。
传感器出厂默认，上电复位时为 SMBus 通信。
3901090614 Rev 008
PWM 引脚也可配置为热继电器(输入是 To)，这样可以实现简单且性价比高的恒温控制器或温度报警(冰点/沸点)应用，其中的温度临界值是用户可编程的。在 SMBus 系统里，这个功能可以作为处理器的中断信号，以此触发读取主线上从动器的值，并确定精度条件。
传感器有两种供电电压选择：5V 或 3V(电池供电)。其中，5V 也可简便的从更高供电电压(例如 8 至 16V)上通过外接元件调制。(具体请参考“应用信息”)
MLX90614 connection to SMBus
图 1: 典型应用电路
2 概述
MLX90614 是一款用于非接触式的红外温度传感器，集成了红外探测热电堆芯片与信号处理专用集成芯片，全部封装在 TO-39。
低噪声放大器、17 位 ADC 和强大的 DSP 处理单元的全集成，使传感器实现了高精度，高分辨率的测量。

SAP常用T-Code汇总情况

MM常用T-CODEMM01 创建一般物料Create Material – GeneralMM02 修改一般物料Change MaterialMM03 显示一般物料Display Materialmm04 显示修改 Display modifyMK01 建立供应商Create vendor (Purchasing)MK02 修改供应商Change vendor (Purchasing)MK03 显示供应商Display vendor (Purchasing)Mk05 冻结供应商Block vendor (Purchasing)MK06 在供应商上作标记以备删除(采购) Mark vendor for deletion (purch.) ME11 建立采购信息记录Create Purchasing Info RecordME12 改变采购信息记录Change Purchasing Info RecordME13 显示采购信息记录Display Purchasing Info RecordME28 采购审批Release Purchase OrderME29N 采购审批（单个）Release Purchase Order(single)ME9F 消息输出: 采购订单Message Output: Purchase OrdersME51N 建立采购申请Create Purchase RequisitionME57 分配和处理申请Assign and Process RequisitionsME58 订单: 分配的请求Ordering: Assigned RequisitionsMIGO 库存运做StockMMBE 查询单个库存Stock OverviewMB51 进出库查询Stock viewMB52 查询批量库存Stock viewME1L 每供应商的信息记录Info Records Per VendorME2L 按供应商分类采购订单Purchase Orders by VendorME1M 每物料的信息记录Info Records Per MaterialME2M 按物料分类采购订单Purchase Orders by MaterialMB1A 发货MB1B 转仓MB1C 收货ME81N 订单值分析MCE1 采购组分析MCE3 供应商分析（采购）MCE5 物料组分析（采购）MB5B 库存按过帐日期MB90 来自货物移动的输出MB1B 输入转帐ME23N 显示采购订单MIGO 货物移动MBST 取消物料凭证ME2C 每个商品组的采购凭证ME2N 每个凭证号码的采购凭证MI01 创建实地盘存凭证MI02 改变实物盘存凭证MI03 显示实地盘点凭证MI04 输入库存计数MI05 改变库存计数MI06 显示库存计数MI07 库存差额总览计数MI09 输入无参考凭证计数MI20 库存差额清单MI21 打印库存盘点凭证MI22 显示物料的实际盘点凭证MI23 显示商品的库存盘点数据MI24 库存盘点清单MB54 显示供应商寄售库存MCBA 工厂分析MCBC 库存地分析MCBE 物料分析MCBR 批次分析MC.1 工厂分析：库存MC.2 工厂分析：收货/发货MB21 创建预留MB22 修改预留MB23 显示预留MB25 预留清单MBVR 管理预留与BOM相关CS00 BOM 菜单BOM MenuCS01 生成物料 BOM Create Material BOMCS02 更改物料 BOM Change MaterialCS03 显示物料 BOM Display Material BOMCS11 逐层显示 BOM Display BOM Level by LevelCS12 多层 BOM Multi-level BOMCS13 汇总 BOM Summarized BOMCS14 BOM 比较BOM ComparisonCS15 单层反查清单Single-Level Where-Used ListCS20 大量更改 : 初始屏幕Mass Change: Initial ScreenCS80 显示修改CSMB 物料BOM层次列印BOMCA21 生成定额工艺路线Create rate routingC223 创建生产版本Create Product verKKF6N 处理产品成本收集器Create Production Cost Collector与生产计划相关MDBT 后台定时运算MD01 前台运算MD02 MRP 运算单项, 多级MRP - Single-item, Multi-levelMD04 显示库存/需求状况Display Stock/Requirements Situation MF60 拉料单Pull listMF50 改变运行计划数量Change Run Schedule QuantitiesMD11 建立计划订单Create Planned OrderMD12 修改计划订单Change Planned OrderMD13 显示计划订单Display Planned OrderMMBE 库存总览Stock OverviewMFBF 反冲Backflush - Repetitive ManufaturingMF47 未清的再处理记录/每行Open Reprocessing Records / Pr.Line MD61 建立计划独立需求Create Planned Indep. RequirementsMD62 修改计划独立需求Change Planned Indep. RequirementsMD63 显示计划独立需求Display Planned Indep. Requirements与序列号相关IQ01 单个创建序列号Create material serial numberIQ02 修改物料系列号Change material serial numberIQ03 显示物料系列号Display material serial numberIQ04 批量创建物料系列号Create material serial numberIQ08 批量修改物料系列号Change material serial numberIQ09 批量显示物料系列号Display material serial numberSD常用T-CODE与客户相关VD01 建立客户Create customerVD02 更改客户Change customerVD03 显示客户Display customerVK11 创建条件Create ConditionVK12 修改条件Change ConditionVK13 显示条件Display ConditionVA21 创建报价Create QuotationVA22 更改报价Change QuotationVA23 显示报价Display QuotationVA01 创建销售订单Create Sales OrderVA02 修改销售订单Change Sales OrderVA03 显示销售订单Display Sales OrderVA05 销售订单清单List of Sales Orders发货单维护和查询VL01N 创建交货Create DeliveryVL02N 更改交货Change DeliveryVL03N 显示交货Display DeliveryVL06O 查询销售订单Query Sales OrderVLSP 拆分销售单Split Sales OrderVL22 拆分发货单Split DeliveryVL09 取消发货过账Cancel Goods Issue for Delivery Note VL10D STO发货单创建Extended Mult. Processing Deliveries VKM5 对因信用控制冻结的发货单解冻Block Delivery运单维护VT01N 创建发运Create shipmentVT02N 更改发运Change shipmentVT03N 显示发运Display shipmentMB5T 显示在途库存Stock view发票创建VF01 创建出具发票凭证Create Billing DocumentVF02 更改出具发票凭证Change Billing DocumentVF03 显示出具发票凭证Display Billing DocumentVF04 处理出具发票到期清单Process Billing Due ListVF11 取消出具发票凭证Cancel Billing DocumentSAP中的移动类型SAP系统中用于标志物料移动(收货/发货/转储/转储记帐)的三位的数字/字母通常分几大类:收货发货转储库房调整常用的有:收货类 (MB1C)101 采购订单收货 103 采购订单收货至冻结状态 122 无采购订单退货 161 按退货采购订单退货 131 从生产订单501 无采购订单收货 511 免费收货发货类(MB1A)201 成本中心消耗 261 内部订单消耗541 委外加工发货551 库房报损转储类(MB1B)301 工厂间转储(一步) 311 存储地点间转储 309 编码转换 321-325 库存类为冻结/质检状态的记帐修改移动调整类盘赢盘亏一般控制比较严通常我们说的移动类型是IM(库存管理)移动类型移动类型在重复制造模式企业的应用1/库房收货处唯一任务是收货按采购订单号码清点货物数量整理通知IQC准备质检101 按采购订单收货 MB01 没上WM会收到PO指定的存储地点有WM会收到收货区(是对应WM移动类型决定)使用QM模块并在主数据中设定必须做IQC的物料收货后自动转为质检库存类直到作出使用决定后再移动501 无采购订单收货511 免费收货 MIGO/MB1C2/库房材料库主要任务是WM转储/库存调拨/按生产订单投料/非生产消耗/盘库WM转库就不讲了库存调拨有工厂间调拨 301 存储地点间调拨 311 事务码都是MB1A还分一步和两步方法例如用 303+305 效果与301类似但两个工厂都需要做动作用内部订单控制月底结算双方对帐对特殊库存状态(special storage category)物料库存调拨需要用特殊移动类型质检料的转库 323 冻结料的转库 325对库存状态变化质检->自由库存 321 MB1B编码转换 309 MB1B由于生产方式是重复制造采用反冲方法将原材料转入supply area 通过生产线软件取数据自动confirm 生产订单然后反冲先根据order消耗然后发货到生产线收货区对材料 261消耗到订单对应前端MB1C 对半成品/成品 101收货对应前端MB31报损 551 MB1C 这里的移动原因一般是强制输入的以便月底报表区分各部门数据(供应商原因/研发原因/各生产线原因)借料系统里面没有拷一个出来就是自然是借到成本中心来控制月底盘库 701/702 Or 711/712 这个用户看不到对盘库差异清算自动产生3/库房发货处这里的移动类型也看不见对这里人员是根据delivery note和shipping noification发货601 销售出库633 寄售出库(总部->分公司)541 委外加工发货▲什么是Movement type ?1.物料的移动在SAP中的反映,也可以理解为物流业务在SAP中的反映2.移动类型可以根据物料类型的Quantity/Value属性,更新(数量(Stock)或价值(FI凭证/科目的确定)3.移动类型的字段显示(Screen)可以在IMG中设置4.MRP,ATP check 等计算的基础5.链接SAP各模块▲Movement typeMvt type Description1xx GR from Pur/Prd and return2xx GI for Consumption3xx,4xx Transfer5xx GR W/O ref to Pur/Prd Order6xx LE-SHP movement types7xx Physical inventory(IM:70x/WM:71x)8xx BrazilCustomer 9xx,Xxx,Yxx,Zxx▲T-Code: OMJJMenu path: IMG - Materials Management - Inventory Management and Physical Inventory – Movement type - Copy, ChangeMovement TypesGI: goods issue (consumption/usage, withdrawal) or goods receipt without reference;发料GR: goods receipt with reference to a purchase order or production orderGD: goods movement with reference to a delivery (from the Shipping component)RE: return delivery, return, reversalRE: returns reversalTP: transfer to company's own stockTF: transfer postingTR: reversal of transfer postingSLS: sales value receipt▲Movement type tablesCustomized tableT156 Movement Type - BWARTT156B Movement Types: Screen Selection (BWART+SOBKZ)Batch determinationT156SC Mvt Type: Qty/Value Posting: Customer Table; as of Rel. 4.6A ;QM.Inspection T156Q Movement Type: Material-Independent ControlT156X Trans./Event Key ModificationT156T Movement Type TextT158B Check Table: Movement Type for Transaction CodeT157H Help Texts for Movement TypesT157D Reason for MovementT156N Next Movement TypeTMCA Evaluating movement types for LIS updateSystem tableT156SY Mvt Type: Qty/Value Update: System Table; Rel. 4.6A;(SAP 快捷键F1 帮助F3 返回F4 选择输入项F5 新增F6 复制为。

唯智仓储管理系统功能白皮书

目录1VTRADEX ELOG SWMS® (3)1.1基础管理 (3)1.2人力资源管理 (5)1.3收货管理 (6)1.4发货管理 (8)1.5移位管理 (9)1.6补货管理 (10)1.7加工管理 (10)1.8作业单管理 (11)1.9库存管理 (11)1.10盘点管理 (16)1.11运输管理 (17)1.12财务管理 (17)1.13规则管理 (17)1.14审批管理 (20)1.15报表中心 (21)1.16系统管理 (22)vTradEx Confidential 第2 页共24页1vTradEx ELOG SWMS®ELOG SWMS®是基于先进互联网技术和供应链仓库管理技术设计开发的系统，是唯智公司vTradEx E-Logistics 供应链管理解决方案中的一个重要的部分。

它能够成功地帮助企业解决在供应链仓库运作管理过程中所面临的种种问题，诸如：如何有效管理仓储，如何和您的客户、以及供应商分享库存信息，如何产生高质量的库存分析报表等等。

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1.1 基础管理1.1.1仓库布局管理ELOG SWMS®的基础数据及参数是整个系统运行的根基，其中包含了商品、库位、货主、供应商、门店、上架策略等重要信息，更重要的是用户可以通过基础信息的灵活配置以提高系统对不同客户、不同货品业务处理要求的适应能力。

因为在一个仓库或者配送中心可能管理上百个不同的货主，每个货主有着各不相同管理要求，往往管理的货品种类成千上万；仓库内既有货架又有平面堆放区，货品包装方式形形色色，它们又具有不同的费收方式等。

品目8470所列其他机器的零附件(系指子目…(HS 847329)2017 俄罗斯(

按采购金额排序 Ranked by 5 6 7 8 9 公司名称/Company Name ООО "ДЖЕЙБИЛ " ООО <А -ТЕХНОЛОДЖИ > АО "ПАСИФИК М ИКРОЭЛЕКТРОНИКС М " ООО "А -ТЕХНОЛОДЖИ " ООО "НТЦ "ИЗМ ЕРИТЕЛЬ" ООО "ДЖЕЙБИЛ " ЗАО "ЭН . СИ . АР. , NCR А /О " ООО "ТАГО ГРУП " ООО "ВИНКОР НИКСДОРФ "
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俄罗斯 2017 年度真实买家/进口商/收货人/采购商排名 RUSSIA Active and Exact Importers 更多买家信息、采购信息、进出口交易记录、进出口贸易数据、真实交易记录、请与瀚闻资讯联系 Please visit our website to get more import and export trade information
全球最大的贸易统计数据库 – GTA2017 年终统计结果显示：2017 年 1-12 月品目 8470 所列其他机器的零附件（系指子目 847030、847040、847050 及 847090 所列机器的）（商品编码 847329）俄罗斯进口商共计 102 个 GTA (Global Trade Analysis System), the world's largest trade intelligence database shows that there are 102 RUSSIA Importers of OTHER THE MACHINE PARTS AND ACCESSORIES D D HEADING 8470. (HS CODE 847329) in 2017

卡林技术公司产品说明书

UL Recognized UL Standard 1077Component Recognition Program as Protectors,Supplementary (Guide QVNU2,File E75596)UL Standard 508Switches,Industrial Control (Guide NRNT2,File E148683)CSA CertifiedComponent Supplementary Protector under Class 3215 30,FIle 047848 0 000CSA Standard C22.2 No. 235VDE CertifiedEN60934,VDE 0642 under File No.10537Agency CertificationsNotes for T able A:1DC and 1Ø 277 Volt ratings are 1 or 2 poles breaking. 3Ø Ratings are 3 poles breaking.2 Requires branch circuit backup with a UL LISTED Type K5 or RK5 fuse rated 15A minimum and no more than 4 times full load amps not to exceed 150A for 250 Volt rating and 125A for 277and 480 Volt ratings.3 UL Recognition and CSA Certification at 480 Volts refers to 3 and 4 pole versions, used only in a 3Ø wye connected circuit or 2 pole versions connected with 2 poles breaking 1Ø and backedup with series fusing per note 2.Table A:Lists UL Recognized and CSA and VDE Certified configurations and performance capabilities as a Component Supplementary Protector.ElectricalCURRENT RA TINGCIRCUITMAX FULL LOAD WITH WITHOUT (Inc) WITH (Icn) WITHOUTCONFIGURA TIONRA TINGFREQUENCYPHASEAMPSBACKUP FUSEBACKUP FUSEBACKUP FUSEBACKUP FUSE65DC ---0.02 - 50 ---500050001500125/25050/60 1 and 30.02 - 50 ---3000 --- ---25050/60 1 and 30.02 - 505000 ---5000150027750/6010.02 - 505000 --- --- ---480 Y 50/60 1 and 30.02 - 305000---------65DC ---0.02 - 5025050/60 1 and 30.02 - 5027750/6010.02 - 50480 Y50/6030.02 - 30480 Y 50/6010.02 - 30SWITCH ONL Y UL / CSAVDED-SERIES TABLE A: COMPONENT SUPPLEMENTARY PROTECTORVOLT AGEINTERRUPTING CAPACITY (AMPS)SERIESDesigned for snap-on-back panel rail mounting on either a 35mm x 7.5mm, or a 35mm x 15mm Symmetrical Din Rail,allowing rapid and simple mounting and removal of the breaker.It features recessed, wire-ready, touch-proof, shock-resistant ter-minals, suitable for automatic screwdriver assembly, as well as "Dead Front" construction characteristics.Available with a Visi-Rocker two-color actuator, which can be specified to indicate either the ON or the TRIPPED/OFF mode,or solid color rocker or handle type actuators. All actuator types fit in the same industry standard panel cutouts.0.02 - 50 amps, up to 480 VAC or 65 VDC, 1 - 4 poles (Handle),1 - 3 poles (Rocker), with a choice of time delays.Number of PolesRocker Type: 1-3; Handle Type: 1-4 Internal Circuit Config. Switch Only and Series Trip with cur-rent or voltage trip coils.WeighApproximately 128 grams/pole (Approximately 4.57 ounces/pole)Standard Colors Housing - Black; Actuator - See Ordering Scheme.MountingMounts on a standard 35mmSymmetrical DIN Rail (35 x 7.5 or 35x 15mm per DIN EN5002).MechanicalElectricalPhysicalEndurance10,000 ON-OFF operations @ 6 per minute; with rated Current and Voltage.Trip FreeAll D-Series Circuit Breakers will trip on overload,even when actuator is forcibly held in the ON position.Trip IndicationThe operating actuator moves posi-tively to the OFF position when an overload causes the breaker to trip.Designed and tested in accordance with requirements of specifi-cation MIL-PRF-55629 & MIL-STD-202 as follows:Shock Withstands 100 Gs,6ms,sawtoothwhile carrying rated current per Method 213,Test Condition "I".Instantaneous and ultra-short curves tested @ 90% of rated current.Vibration Withstands 0.060" excursion from10-55 Hz,and 10 Gs 55-500 Hz,at rated current per Method 204C,Test Condition A. Instantaneous and ultra-short curves tested at 90% of rated current.Moisture Resistance Method 106D,i.e.,ten 24-hourcycles @ + 25°C to +65°C,80-98%RH.Salt Spray Method 101,Condition A (90-95%RH @ 5% NaCl Solution,96 hrs).Thermal Shock Method 107D,Condition A (Fivecycles @ -55°C to +25°C to +85°C to +25°C).Operating Temperature -40°C to +85°CEnvironmental020 0.0200250.0250300.0300500.050075 0.0750800.0800850.0852100.1002150.1502200.2002250.2502300.3002350.3502400.4002450.450250 0.5002550.5502600.6002650.6502700.7002750.7502800.8002850.850410 1.000512 1.250413 1.300414 1.400415 1.500517 1.750420 2.000522 2.250425 2.500527 2.750430 3.000532 3.250435 3.500436 3.600440 4.000445 4.500547 4.750450 5.000455 5.500460 6.000465 6.5004707.0005727.2504757.5004808.0004858.5004909.0004959.500610 10.00071010.50061111.00071111.50061212.00071212.50061313.00061414.000615 15.00061616.00061717.00061818.00061919.00062020.00062121.00062222.000623 23.00062424.00062525.00062626.00062727.00062828.00062929.00063030.00063232.00063535.00064040.00064545.00065050.000A06 6 DC, 5 DC A1212 DC, 10 DC A1818 DC, 15 DC A2424 DC, 20 DC A3232 DC, 25 DC A4848 DC, 40 DC A6565 DC, 55 DC J06 6 AC, 5 AC J1212 AC, 10 AC J1818 AC, 15 ACJ2424 AC, 20 AC J4848 AC, 40 AC K20120 AC, 65 AC L40240 AC, 130 AC10Agency Approval8Actuator Color8 ACTUATOR COLOR & LEGEND Actuator orVisi-Color Marking: Marking Color: Single Color Visi-Rocker Color:I-O ON-OFF Dual Rocker/Handle (Actuator Black)8White A B 1Black White Black C D 2White n/a Red F G 3White Red Green H J 4White Green Blue K L 5White Blue Y ellow M N 6Black Y ellow Gray P Q 7Black Gray OrangeRS8Black Orange10 AGENCY APPROVAL C UL Recognized & CSA Certified D VDE Certified, UL Recognized & CSA Certified9 MOUNTING/VOLTAGEMOUNTING STYLE VOLTAGE Threaded Insert 16-32 x 0.195 inches< 300C 96-32 X 0.195 inches ≥300 2ISO M3 x 5mm< 300D 9ISO M3 x 5mm ≥3007 TERMINAL1#10 Screw & Pressure Plate for Direct Wire Connection 2#10 Screw without Pressure Plate3 POLES 1One2Two 3Three4Four5 FREQUENCY & DELA Y 03DC 50/60Hz, Switch Only 105DC Instantaneous 11DC Ultra Short 12DC Short 14DC Medium 16DC Long20550/60Hz Instantaneous 2150/60Hz Ultra Short 2250/60Hz Short 2450/60Hz Medium2650/60Hz Long32DC, 50/60Hz Short 34DC, 50/60Hz Medium 36DC, 50/60Hz Long42650/60Hz Short, Hi-Inrush 44650/60Hz Medium, Hi-Inrush 46650/60Hz Long, Hi-Inrush 527DC, Short,Hi-Inrush 547DC,Medium, Hi-Inrush 567DC, Long, Hi-Inrush4 CIRCUITA0 Switch Only (No Coil) 4B0Series Trip (Current)C0Series Trip (Voltage)1 SERIES D6Current Rating4Circuit3Poles2Actuator9Mounting/Voltage7Terminal5Frequency & Delay1SeriesNotes:1 Handle breakers available up to four poles. Rocker breakers available up to three poles.2Actuator Code:A: Multi-pole units factory assembled with common handle tie.B: Handle location as viewed from front of breaker:2 pole - left pole3 pole - center pole4 pole - two handles at center poles3Multipole rocker breakers have one rocker per breaker, as viewed from the front of thepanel. Two pole - left pole. Three pole - center pole 4≤30A, select Current Rating code 630. 31-50A, select Current Rating code 650.5Voltage coil only available with delay codes 10 & 20.6Available to 50A max with circuit code BO only.7Available to 50A (UL/CSA), 30A (VDE) with circuit code BO only.8Color shown is visi and legend with remainder of rocker black.9≥300V: Three pole breaker 3Ø or 2 pole breaker 1Ø, UL/CSA limited to 30 FLA max.10VDE Approval requires Dual (I-O, ON-OFF) or I-O markings6 CURRENT RATING (AMPERES)OR VOLTAGE COIL (VOLTS, MIN. TRIP RATING)5P0LE 3P0LE 2P0LE 1SERIES TRIP (2 TERM'S.)LINELINEROCKER ACTUATOR INDICATE "ON"HANDLE ACTUATORSWITCH ONL Y (2 TERM'S.)#10-32 SCREW AND PRESSURE PLA TE PER TERMINAL"MULTI-POLE IDENTIFICATION SCHEMENotes:1All dimensions are in inches [millimeters].2T olerance ±.015 [.38] unless otherwise specified.3-POLE(DF3) 3-POLE(DC3)REMOVALASSEMBL YNotes:1All dimensions are in inches [millimeters].2T olerance ±.015 [.38] unless otherwise specified.3Dimensions apply to all variations shown. Notice that circuit breaker line and load termi-nal orientation on indicate OFF is opposite of indicate ON.4For pole orientation with horizontal legend, rotate front view clockwise 90°.Notes:1All dimensions are in inches [millimeters].2T olerance ±.010 [.25] unless otherwise specified.。

Fiberxon FTM-3012S-G Gigabit Interface Converters

FeaturesUp to 10Km bi-directional data links 2m~10Km with 9/125µm SMF 550m with 50/125 µm MMF 550m with 62.5/125 µm MMF 1310nm FP Laser TechnologyUp to 1.25Gbit/sec bi-directional data links Hot plug-and-play capability Low power dissipationExcellent EMI&ESD protectionExtended operate power supply +3.3 to 5.0VHorizontal or Vertical Installation Ease of configuration/field replaceable Serial ID and customized labelingStandardCompliant with IEEE802.3z Gigabit Ethernet (1000Base-LX/LH)SpecificationCompliant with GBIC Rev 5.5 standardsCompliant with 802.3z Gigabit Ethernet standards ITU G.957 Synchronous Digital Hierarchy standard Compliant with FCC 47 CFR Part 15, Class BCompliant with FDA 21 CFR 1040.10 and 1040.11, Class 1The Fiberxon FTM-3012S-G Gigabit Interface Converters (GBIC) is integrated fiber optic Transceiver that provides high-speed serial links at a signaling rate of 1250Mb/s.FTM-3012S-G GBIC provides high-speed bi-directional Gigabit Ethernet link at a signalling rate of 1.25Gbps, which is compliant with 802.3z Gigabit Ethernet standards (1000Base-LX/LH).FTM-3012S-GNovember, 2001 Members Of Flexon TM FamilyL ong wavelength Gigabit Interface ConvertersOverviewWith the exponential increase of the data traffic, the global optical transmission market booms very fast recent years. The most important elements of a transmission route. Facing the prospective marketing opportunity, Fiberxon Inc as a vendor in china develop and manufacture Flexon TM optical subsystem, include GBIC, SFP and Lambda GBIC, based on high speed communication applications.A Gigabit Interface Converter (GBIC) is an industry-standard modular transceiver that offers increased flexibility for Gigabit Ethernet or Fiber Channel connections.Product DescriptionFiberxon debuts Flexon TM family, which is a series of high performance optical modules suitable for the construction of high-speed communication networks. Based on its leading edge technology and state-of-the-art manufacturing, Fiberxon can offer this line of products, which covers Telecom, Datacom and CATV application.The GBIC convert electronic signals into optical signals and back to electronic signals are made for a wide range of networking applications requiring high data rates.The Flexon TM 1310nm GBIC transceivers are composed of the FTM-3010S-G, FTM-3020S-G transceiver for Fiber Channel applications and FTM-3012S-G transceiver for Gigabit Ethernet applications. which is compliant with the Gigabit Interface Convert GBIC Rev5.5 standards.The FTM-3012S-G long wavelength GBIC interfaces full comply with IEEE 802.3z 1000Base-LX standard, are used in the long distance connection in LAN and MAN environment.FTM-3012S-G GBIC has been developed with 1310nm wavelength FP Laser technology, it provides high-speed bi-directional serial link at a signalling rate of1250Mbps.FP Laser technologyFTM-3012S-G have been developed with high reliability 1310nm wavelength FP technology.Extend TemperatureFiberxon can give customers extra reliability and robustness by offering selectable operation voltages (3.1V to 5.5V) and a wide operation temperature range(-10℃to 70℃).Low Power DissipationBy utilizing the latest chipset technology, Fiberxon's GBIC realizes excellent power dissipation: Less than 250mA, at 3.3V operation, and only 0.825W power dissipation, while using only 17.5% of the maximum power allowed by the GBIC specification.FlexibilityFiberxon's patent pending mechanical design can guarantee excellent EMC/EMI performance. Fiberxon's innovative latch-arm design allows users to easily install and remove the GBIC transceiver by hand and with no tools.Fiberxon GBIC transceivers are hot pluggable which allow a suitably designed enclosure to be changed from one type of external interface to another simply by plugging in a GBIC having the alternative external interface.ApplicationsFTM-3012S-G GBIC is well-suited for Local Area Network (LAN), typically used in:Switch to Switch Switch to Router Server to Switch Switch to WDM system Router to WDM systemBlock DiagramIn LAN and SAN environment, the transceivers use lasers that enable cost-effective data transmission over optical fibers at distances of 550 meters with 62.5 µm and 550 meters with 50µm multimode fiber respectively.F i b e r C o n n e c t o rE l e c t r i c a l C o n n e c t o rFigure 1, GBIC Block DiagramRegulatory ComplianceThis product has been tested with respect to American and European product safety and electromagnetic compatibility regulations. For further information regarding regulatory certification, refer to the Flexon TM regulatory specification and safety guidelines, or contact with the Fiberxon, Inc America sales office listed at the end of documentation.See the table below to for the targeted typical and measured performance for these transceivers.Table 1 - Regulatory ComplianceFeature Test Method Targeted PerformanceElectrostatic Discharge (ESD) to the Electrical PinsMIL-STD-883C Method 3015.4Class 1 (>2000 V)Electrostatic Discharge (ESD) to the Duplex SC ReceptacleVariation of IEC 801-2 Typically withstand at least 15 kV without damage when port is contacted by a Human Body Model probe.Electromagnetic Interference (EMI)FCC Class B CENELEC EN55022 Class B (CISPR 22A) VCCI Class 1Margins are dependent oncustomer board and chassisdesign. ImmunityVariation of IEC 801-3Typically show no measurable effect from a 10 V/m field swept from 27 to 1000 MHz applied to the transceiver without a chassis enclosureLaser Eye SafetyFDA 21CFR 1040.10 and 1040.11and the IEC 825-1. AEL Class I, FDA/CDRH AEL Class 1, TUV Rheinland ofNorth AmericaComponent RecognitionUL and CSAAbsolute Maximum RatingsOperating of GBIC beyond the Absolute Maximum Conditions listed in T able 2 can degrade or damage the product.It’s not implied that the product would function above the recommended Operating Conditions;it’s possible to reduce the reliability and lifetime of device if Recommended Operating Conditionsare exceeded (see table 3).Table 2 – Absolute Maximum ConditionsMaximumUnitsMinimumParameter SymbolStorage Temperature T st -40 +85 ℃Operating Temperature T op 0 +70 ℃Supply Voltage V DD 0 6.0 VInput Voltage V in 0 V DD V Operating Humidity - 5 95 %mV PECLSwing - - 3000Table 3 - Recommended Operating ConditionsParameter Symbol Minimum Maximum UnitsOperating Temp T O 0 +70℃ Operating Voltage V O 3.15 5.5 V Ripple and Noise--100mVOptical CharacteristicsT able 4 describes the performance of the transmitter portion of the GBIC over the operating conditions. T able 5 describes the performance of the receiver portion of the GBIC over the operating conditions.Table 4 -Laser Transmitter Characteristics (T= 25°C) Parameter Symbol Min Typical Max UnitWavelengthλ 1280 13101340 nmSpectral Width – rms Δλ 2 5 nmOutput PowerP 0 -9.5 -3 dBm Rise/Fall Time (10-90%) T r T f 0.2 0.26 ns Extinction Ratio 9 10 dB Data Rate1250 Transmitter Differential Input Voltage6502000mV (p-p)Transmitter Optical Contributed Jitter (Total) T j 225 ps (p-p) Max. Pout TX_DISABLE Asserted-35dBmEye DiagramIEEE 802.3 compliantTable 5 – Receiver Characteristics (T= 25°C) Parameter Symbol Min Typical Max UnitWavelengthλ 1280 1340 n Average Optical Sensitivity -20 dm Average max Input Power -3 dmData Rate 1250Return Loss12 dm Rise/Fall Time (20%-80%) T r T f 100 350 psSignal Detect Threshold-Assertion -20 dBm Signal Detect Threshold - Deassertion -30 dBm Hysteresis 1 3 4 dBDuty Cycle Distortion 0.1 ns (p-p) Data Dependent Jitter0.1 ns (p-p) Signal Detect Timing-Assertion 100 µs Signal Detect Timing-Deassertion100µsElectrical CharacteristicsAll the signal interfaces are compliant with Rev. 5.5 of the GBIC specification. The high speed DATA interface is differential AC-coupled PECL level type. Thus, it can be connected to either 5 V or 3.3 V SERDES IC directly. All the low speed control and sense output signals are open collector TTL compatible. Therefore, proper pull-up resistor (4.7 K to 10 K ohm) is required.When the TX-DISABLE pin is at logic HIGH, the transmitter optical output is disabled (less than -35 dBm). The Loss of Signal detection circuitry in the receiver provides a logic LOW RX_LOS output over the specified range of usable input optical power .The current consumption of the GBIC is described in table 6 below. The surge current Id defined as the additional inrush due to hot plugging. The characteristics for the TTL signals are shown in Figure 4 and T able 7. Output TTL signals are all open-collector , and the levels indicated assuming 4.7k ohm pull-up resistor to Host_Vcc is present.v IL (max)v IL (min)v OH (max)v OH(min)v IH (max)v IH (min)v OL (max)v OL (min)Figure 3, TTL Signal CharacteristicsTable 6 –Signal CharacteristicsParameter Min Max UnitsV IH 2.0 Vcc+0.3V VV IL 0 0.8 VV OH Host_Vcc-0.5 Host_Vcc+0.3 V V OL 0 0.5 VTable 7 – Electrical CharacteristicsParameter Value UnitsCurrent I cc (Typ) 200 mACurrent I cc (Max) 300 mASurge Current (I surge ) <30 mA Slow-start time T ss <30 msPOR start Voltage 4.3 V POR timeout<300msT ables 8 and 9 indicate the voltage levels required to be delivered by the host to the PECL serial interface.Table 8 – Tx PECL Signals RequirementsParameter Min Max UnitsV I 650 2000 mVLine Impedance ZO 120 180 Ω Input Impedance RI 140 160 Ω Total Jitter - 0.24 UI (p-p) Mark Ratio 40 60 % Rise/fall time 100 350 ps Diff. Skew -20psTable 9 – Rx PECL Signals CharacteristicsParameter Min Max UnitsV O 370 2000 mVLine Impedance ZO 120 180 Ω Total Jitter - 0.60 UI (p-p) Mark Ratio4060%Diff.Skew - 205 psPin Connector CharacteristicsA brief description of all of the electrical connector pins as follows. The connector has staged contacts, so that hot-plugging can be performed. See Figures 4 and T able10.Figure 4, Pin out ViewThe ground, V CC and other pins designated as (1) engage first during hot-plugging. Sequence (2) pins connect second during hot-plugging.Conversely, when the module is unplugged from host system, (2) disengages before (1) disconnects.Inserting or removing the FTM-3012 will disrupt data transmission. This disruption occurs when the downstream receiver (e.g. deserializer phase-lock-loop) resynchronizes to a different bitstream signal. When this occurs, the downstream system will locate the associated error (e.g. comma detect, loss-of-light, disparity, CRC, and frame errors).If the GBIC is used in a point-to-point application, or a loop application without port bypass circuits (PBC), data transfer is completely disrupted until the module is installed and receives a valid optical bitstream.If a PBC is present in a loop application, the port where the GBIC was hot-unplugged from will bebypassed. The upstream device will be connected to the downstream device directly, maintaining loop integrity. In this case, a temporary disruption will be noted while the downstream device becomes resynchronized with its new input signal.When an FTM-3012 module is hot-plugged into this topology, there is a similar disruption when the PBC multiplexes the module into the loop and resynchronization to its optical signal occurs. It is the responsibility of the system integrator to assure that no thermal, energy, or voltage hazard exists during the hot-plug-unplug sequence. It is also the responsibility of the system integrator and end-user to minimize static electricity and the probability of ESD events by careful design.Table 10 – SCA-2 Host connector pin definitionPin No. Seq. Function Description1 2 RX_LOS Receiver Loss of Signal,TTL High, Open collectorGround2 2 GROUND ReceiverGround3 2 GROUND ReceiverLow4 2 MOD_DEF(0) TTL5 2 MOD_DEF(1) SCL Serial Clock Signal6 2 MOD_DEF(2) SDA Serial Data SignalDisable7 2 TX_DIS TransmitterGround8 2 GROUND TransmitterGround9 2 GROUNF TransmitterFault10 2 TX-FAULT TransmitterGround11 1 GROUNF Receiver12 1 -RX_DATA Receiver Data, Differential PECL, accoupled13 1 -RX_DATA Receiver Data, Differential PECL, accoupledGround14 1 GROUND Receiver15 2 V CC Receiver +5V supply16 2 V CC Transmitter +5V supplyGround17 1 GROUND Transmitter18 1 +TX_DATA Transmitter Data, Differential PECL,ac coupled19 1 -TX_DATA Transmitter Data, Differential PECL,ac coupledGround20 1 GROUND TransmitterInput DefinitionsV CC - Positive power supply to the GBIC.GROUND - Logic ground connection.ESD_GND - Logic ground connection, at the two ESD tabs on the 20-pin connector.+TX_DATA Active High input and –TX_DATA Active low - PECL-level serial input to the transmitter. They are internally AC-coupled into an equivalent load of RI differential. The maximum code imbalance, which is the ratio of "1"s to "0"s must be between 40% and 60%. If the signals are8B/10B encoded [6], this condition will be met.TX_DIS - Active high TTL input, with internal 4.7k ohm pull-up resistor to Vcc. Asserting thetransmitter disable will deactivate the laser within the assert time.LaserLogic H I DisableLogic L O ActivateLaserThe truth table shown describes the state of the module, and T able 11 indicates the timing ofTx_Dis.Table 11 – TX Dis/Fault CharacteristicsParameter Symbol Min Max UnitsTX_Dis assert time T off - 10 µsTX_Dis negate time T on - 1 msDis LD power - -35 dBmTX_Dis fault reset T reset 10 - µsTX_Dis fault assert time T fault - 100 µsOutput Definitions+RX_DATA Active High output and –RX_DATA - Active Low PECL serial output from the receiver.These are internally AC-coupled.RX_LOS - Active high open collector TTL output which indicates a loss-of-signal condition (LOS).When the average optical power received by the module is below the Assert Level, LOS isindicated according to the truth table below.conditionLogic H I LOSLogic L O Data is being receivedRx_LOS requires a 4.7k ohm pull-up resistor external to the module, i.e., in the host systemHost_Vcc. For example, in mixed-voltage environments, a host requiring 3.3-volt TTL logic levelsconnects the pull-up to 3.3 volts. The open collector drivers used for the Rx_LOS and Tx_FAULToutputs of the GBIC permits this technique.Table 12 – RX_LOS CharacteristicsMaxUnitsMinParameter Symbollevel - -30 -18 dBmAssertAssert time T loson - 100 µsNegate time T losoff - 100 µsHysteresis - 1 4 dBT X_FAULT - Active high open collector TTL output which indicates a fault in the module. This can be(1) failure of the laser driver, (2) end-of-life of the laser, or (3) V CC < V POR. Under these conditions,the laser will be deactivated within the assert time.Logic H I Low Vcc or LD failureOperationLogic L O NormalT x_FAULT also requires a 4.7k ohm pull-up resistor external to the module, i.e.in the host system Host_V cc. Conditions (1) and (2) are latched, and for diagnostic purposes only, may be reset by toggling Tx_DIS high for at least T reset .WaveformsEye patterns are from a typical GBIC link transmitting a 27 pseudorandom bit sequence.*****************/sec********************/secFigure 5, Typical Eye patternsOrdering informationPart No. Application Data Rate Laser Source Fiber Type FTM-3012S-G Gigable Ethernet 1.25G 1310nm FP Single-mode Related DocumentsFor further information of Flexon TM GBIC for Gigabit Ethernet and Fibre Channel applications, please refer to the following documents:Flexon TM GBIC Installation GuideFTM-8010 GBIC advanced datasheetFTM-8012 GBIC advanced datasheetFTM-8020 GBIC advanced datasheetFTM-3010 GBIC advanced datasheetFTM-3020 GBIC advanced datasheetFTM-5010 GBIC advanced datasheetFTM-5012 GBIC advanced datasheetFTM-5020 GBIC advanced datasheetFTM-5025 GBIC advanced datasheetObtaining DocumentYou can visit our website:Or contact with the Fiberxon, Inc America sales office listed at the end of documentation to get latest documents.© Copyright Fiberxon Inc. 2001All Rights ReservedAll information contained in this document is subject to change without notice. The products described in this document are NOT intended for use in implantation or other life support applications where malfunction may result in injury or death to persons.The information contained in this document does not affect or change Fiberxon’s product specifications or warranties. Nothing in this document shall operate as an express or implied license or indemnity under the intellectual property rights of Fiberxon or third parties. All information contained in this document was obtained in specific environments, and is presented as an illustration. The results obtained in other operating environment may vary.THE INFORMATION CONTAINED IN THIS DOCUMENT IS PROVIDED ON AN ”AS IS” BASIS. In no event will Fiberxon be liable for damages arising directly from any use of the information contained in this document.ContactU.S.A Headquarter:1600 Wyatt Drive, Suite 7Santa Clara, CA 95054Tel: (408) 988-2217Fax: (408) 988-2223Or visit our website: /。

IGLOO2 M2GL050 (T, TS) 设备 Errata 表说明书

IGLOO2 M2GL050 (T , TS) Device ErrataER0200 v1.3 April 2016April 2016This Errata sheet contains information about known Errata specific to the IGLOO ®2 M2GL050 (T, TS) device family and provides available fixes and solutions.Table of ContentsRevision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1Revisions Released per Device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1Errata for IGLOO2 M2GL050 (T, TS) All Temperature Grades . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2Summary of IGLOO2 M2GL050 (T,TS) Device Errata . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2Errata Descriptions and Solutions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3Usage Guidelines for IGLOO2 Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6Revision 0 and Revision 1 Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6Revision 2 Device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6Product Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7Table 1: Revision HistoryDate Version ChangesApril 2016 1.3Added Errata item 19.January 20161.2Updated Table 4 and Table 5: AutoProgramming and 2 Step IAP use SC_SPI programming interface.January 2016 1.1Added the following:•Information about Revision 2 of the M2GL050 device •Errata item 18.•Table 5June 20151.0Combined all M2GL050 (T,TS) device Errata.Table 2: Revisions Released per DeviceSilicon Devices Revisions Device Status M2GL050 (T, TS)All Temperature GradesProduction2IGLOO2 M2GL050 (T, TS) Device Errata ER0200 v1.3 April 2016Errata for IGLOO2 M2GL050 (T, TS) All Temperature GradesTable 3 lists the specific device Errata and the affected IGLOO2 M2GL050 (T, TS) revisions of all temperature grade devices .Table 3: Summary of IGLOO2 M2GL050 (T, TS) Device ErrataErrata No.ErrataSilicon Revisions M2GL050 (T, TS)Software ErrataRev (0, 1)Rev 21.MDDR and FDDR AXI interface does not support exclusive access X X –2.Apply DEVRST_N after ISP programmingX ––3.AXI wrap transfers with more than 32 bytes in burst mode are not supported for MDDR and FDDRX X –4.The MDDR/FDDR controller must be used with sequential burst mode with BL = 8 and PHY = 32, or PHY = 16X X –5.HPMS may reset when ENC_DATA_AUTHENTICATION or DEVICE_INFO STAPL commands are sentX ––6.VPP must be set to 2.5 V when programming/writing the eNVM at Industrial temperature rangeX ––7.Over-voltage support on MSIOs during Flash*Freeze mode X ––8.Verification of the FPGA fabric at junction temperatures higher than 50°C erroneously indicates a failureX ––9.DDR_OUT and I/O-Reg functional Errata due to a software bug ––X 10.Dedicated differential I/O driving the reference clock of the CCC may cause a functional failure due to a software bug––X 11.NVM Ready bit in eNVM Status register can generate a false READY signalX ––12.Power-up Digest is not supportedX ––13.Programming of the eNVM must only occur as part of a bitstream also containing the FPGA fabric––X 14.Updating eNVM from the FPGA fabric requires changes in the NV_FREQRNG registerX X –15.SYSCTRL_RESET_STATUS macro is not supported X X –16.Zeroization is not supportedX X –17.PCIe Hot Reset support requires a soft reset solutionX X –18.The DDR I/Os in M2GL050 (T, TS)-FG896 are non-compliant with the DDR3 standardX X –19.For S (security) grade devices, user must not enable write protection for Protected 4 K Regions, also known as Special Sectors in the eNVMXX–Note:Contact Microsemi SoC technical support , if you have additional questions. To order a specific die, contact your localMicrosemi sales office.IGLOO2 M2GL050 (T, TS) Device ErrataER0200 v1.3 April 20163Errata Descriptions and Solutions1.MDDR and FDDR AXI interface does not support exclusive accessThe MDDR and FDDR AXI interface in the M2GL050 device is compliant with AMBA AXI Protocol Specification v1.0, except for the exclusive access functionality. The future version of the Errata will have an updated information about the exclusive access functionality for the AXI interface.2.Apply DEVRST_N after ISP programmingM2GL050 devices support device programming in JTAG, Slave SPI, and ISP programming modes. However, after ISP programming, DEVRST_N needs to be asserted to reset the device or power cycle the device to run the new design.3.AXI wrap transfers with more than 32 bytes in burst mode are not supported for MDDR and FDDRDo not use wrap transfers with more than 32 bytes.4.The MDDR/FDDR controller must be used with sequential burst mode with BL = 8 and PHY = 32, or PHY = 16Though the MDDR and FDDR controllers in the M2GL050 devices support various burst modes/ lengths and PHY settings (as specified in the UG0446: SmartFusion2 and IGLOO2 FPGA High Speed DDR Interfaces User Guide), only a subset of these settings are supported.Recommendation:Only use sequential burst mode with BL = 8 for PHY16, or PHY32 modes for the MDDR or FDDR.5.HPMS may reset when ENC_DATA_AUTHENTICATION or DEVICE_INFO STAPL commands are sentThe HPMS resets after executing one of the following STAPL actions:•ENC_DATA_AUTHENTICATION •DEVICE_INFOAdditionally, if any of these actions are executed while a SmartDebug session is active, HPMS resets are observed.6.VPP must be set to 2.5 V when programming/writing the eNVM at Industrial temperature rangeVPP can be set to 2.5 V or 3.3 V. However, when writing or programming the eNVM of the M2GL050 devices below 0°C, VPP must be set to 2.5 V.Refer to the DS0128: IGLOO2 FPGA and SmartFusion2 SoC FPGA Datasheet for VPP minimum and maximum settings. Note that the eNVM reading with VPP set to 3.3 V or 2.5 V operates as intended.7.Over-voltage support on MSIOs during Flash*Freeze modeWhen the input voltage is driven above the reference voltage for that bank, additional current can be consumed in Flash*Freeze mode.4IGLOO2 M2GL050 (T, TS) Device Errata ER0200 v1.3 April 20168.Verification of the FPGA fabric at junction temperatures higher than 50°C erroneously indicates a failureStandalone verification (STAPL VERIFY action) must run at temperatures lower than 50°C. If aVERIFY action is run at temperatures higher than 50°C, a false verify failure may be reported. Note that the Check Digest system services can be used to confirm design integrity at temperatures within the recommended operation conditions.9.DDR_OUT and I/O-Reg functional Errata due to a software bugThis Errata is applicable only if you have created or updated the design using Libero ® SoC v11.1 SP1 or v11.1 SP2.The corresponding I/O does not function properly in the silicon due to the wrong software implementation of the I/O macro, if you have one of the following in the design:•If you use DDR_OUT macro in the design•If you combine an output or output enable register with an I/O using the PDC command set_io<portName> -register yesSolution:Both Errata are fixed in Libero SoC v11.1 SP3. Migrate the design to Libero SoC v11.1 SP3 or a newer version, and re-run Compile and Layout.10.Dedicated differential I/O driving the reference clock of the CCC may cause afunctional failure due to a software bugIf the design has a dedicated differential I/O pair driving the reference clock of the CCC, the input clock may not propagate to CCC due to a software bug and the device fails during silicon testing. There are several options to drive the ref clock of the CCC. One of the options is to drive from"Dedicated Input PAD x" (x = 0 to 3); this uses hardwired routing. In this option, choose single-ended I/O or differential I/O as the ref clock. This Errata exists when you choose the differential I/O option (dedicated differential I/O is used as CCC reference clock input).This Errata cannot be detected in any functional simulation, and can only be detected in silicon testing.Solution:The Errata is fixed in the Libero SoC 11.1 SP3. Migrate the design to Libero SoC 11.1 SP3 or newer version, and re-run Compile and Layout.11.NVM Ready bit in eNVM Status register can generate a false READY signalIf you send an instruction to the eNVM controller and then start polling the READY signal (bit0 of the eNVM Status register) to check when the eNVM controller is ready for the next function, the first assertion of the READY signal occurs when the eNVM controller is not yet ready, resulting in the generation of a false READY signal. However, the immediate next assertion of the READY signal correctly indicates that the eNVM controller is ready.Workaround:Add an extra eNVM Status bit read that polls/reads the eNVM Status bit twice as READY .12.Power-up Digest is not supportedWorkaround:Use NVM Data Integrity Check System service after the device is switched ON, and check the data integrity.IGLOO2 M2GL050 (T, TS) Device ErrataER0200 v1.3 April 2016513.Programming of the eNVM must only occur as part of a bitstream alsocontaining the FPGA fabricThe Bitstream Configuration Dialog Box in the Libero SoC allows the user to program eNVM and the FPGA fabric separately. However, for the current production of IGLOO2 FPGAs, the user needs to program the eNVM along with the FPGA fabric. The fabric can be programmed separately if needed.Solution:The Errata is fixed in the Libero SoC 11.1 SP3. Migrate the design to the Libero SoC 11.1 SP3 or newer version, and re-run Compile and Layout.14.Updating eNVM from the FPGA fabric requires changes in the NV_FREQRNGregisterWhen updating the eNVM from the FPGA fabric, NV_FREQRNG register must be changed from 0x07(default) to 0x0F, eNVM reads are not affected.15.SYSCTRL_RESET_STATUS macro is not supported 16.Zeroization is not supported17.PCIe Hot Reset support requires a soft reset solutionOn the IGLOO2 devices, a PCIe ® Hot Reset requires a soft FPGA logic reset scheme which clears the sticky bits of the PCI configuration space.Workaround:The application note AC437: Implementing PCIe Reset Sequence in SmartFusion2 and IGLOO2 Devices describes the PCIe Hot Reset reset scheme. However, this reset scheme causes PCIe violations in some cases.•At Gen1 rates, there are no violations.•At Gen2 rates, there are two PCIe CV violations.–Test case 1: TD_1_7 (Advanced Error Reporting Capability)–Test case 2: TD_1_41 (LinkCap2Control2Status2 Reg)18.The DDR I/Os in M2GL050 (T, TS)-FG896 are non-compliant with the DDR3standardThe DDR controller in the M2GL050-FG896 device is non-compliant with the DDR3 standard. Contact SoC tech support for additional information.19.For S (security) grade devices, user must not enable write protection forProtected 4 K Regions, also known as Special Sectors in the eNVMFor S (security) devices, there are two or four 4 KB regions per eNVM array that can be protected for read and write, these regions are known as Protected 4 K Regions or Special Sectors. If writeprotection is enabled for any of these regions, none of the locked pages inside the same eNVM block can be unlocked.6IGLOO2 M2GL050 (T, TS) Device Errata ER0200 v1.3 April 2016Usage Guidelines for IGLOO2 DevicesMicrosemi recommends the following conditions for the IGLOO2 device usage.1. Programming SupportThere may be package dependencies that may not expose certain programming interfaces. Refer to the DS0124: IGLOO2 Pin Descriptions Datasheet for device/package specific features.2. SHA-256 System ServiceMicrosemi recommends the message required to be on byte boundary when using SHA-256 System Service for the IGLOO2 devices.3. Accessing the PCIe Bridge Register in High-speed Serial InterfaceThe PCIe Bridge registers must not be accessed before the PHY is ready. Wait for the PHY_READY signal (which indicates when PHY is ready) to be asserted before updating the PCIe Bridge registers.The PHY_READY signal is normally asserted within 200 μs after the device is powered up. Wait for 200 μs before accessing the PCIe Bridge registers.Table 4: Revision 0 and Revision 1 DevicesProgramming Mode JTAG SPI Slave AutoProgramming Auto Update2 Step IAP Programming RecoveryProgramming Interface JTAG SC_SPI SC_SPI SPI_0SC_SPI SPI_0M2GL050 (T,TS)YesYesNoNoNoNoTable 5: Revision 2 DeviceProgramming Mode JTAG SPI Slave AutoProgramming Auto Update2 Step IAP Programming RecoveryProgramming Interface JTAG SC_SPI SC_SPI SPI_0SC_SPI SPI_0M2GL050 (T,TS)YesYesYesNoYesNoIGLOO2 M2GL050 (T, TS) Device ErrataER0200 v1.3 April 20167Product SupportMicrosemi SoC Products Group backs its products with various support services, including Customer Service, Customer Technical Support Center, a website, electronic mail, and worldwide sales offices. This appendix contains information about contacting Microsemi SoC Products Group and using these support services.Customer ServiceContact Customer Service for non-technical product support, such as product pricing, product upgrades, update information, order status, and authorization.From North America, call 800.262.1060From the rest of the world, call 650.318.4460Fax, from anywhere in the world 650. 318.8044Customer Technical Support CenterMicrosemi SoC Products Group staffs its Customer Technical Support Center with highly skilled engineers who can help answer your hardware, software, and design questions about Microsemi SoC Products. The Customer Technical Support Center spends a great deal of time creatingapplication notes, answers to common design cycle questions, documentation of known Errata and various FAQs. So, before you contact us, please visit our online resources. It is very likely we have already answered your questions.Technical SupportFor Microsemi SoC Products Support, visit/products/fpga-soc/design-support/fpga-soc-supportWebsiteYou can browse a variety of technical and non-technical information on the SoC home page , at /products/fpga-soc/fpga-and-soc .Contacting the Customer Technical Support CenterHighly skilled engineers staff the Technical Support Center. The Technical Support Center can be contacted by email or through the Microsemi SoC Products Group website.EmailYou can communicate your technical questions to our email address and receive answers back by email, fax, or phone. Also, if you have design problems, you can email your design files to receive assistance. We constantly monitor the email account throughout the day. When sending your request to us, please be sure to include your full name, company name, and your contact information for efficient processing of your request.The technical support email address is **********************.My CasesMicrosemi SoC Products Group customers may submit and track technical cases online by going to My Cases .Outside the U.S.Customers needing assistance outside the US time zones can either contact technical support via email(**********************) or contact a local sales office. Visit About Us for sales office listings and corporate contacts.8IGLOO2 M2GL050 (T, TS) Device Errata ER0200 v1.3 April 2016ITAR Technical SupportFor technical support on RH and RT FPGAs that are regulated by International Traffic in ArmsRegulations (ITAR), contact us via **********************. Alternatively, within My Cases, select Yes in the ITAR drop-down list. For a complete list of ITAR-regulated Microsemi FPGAs, visit the ITAR web page.Microsemi makes no warranty, representation, or guarantee regarding the information contained herein or the suitability of its products and services for any particular purpose, nor does Microsemi assume any liability whatsoever arising out of the application or use of any product or circuit. The products sold hereunder and any other products sold by Microsemi have been subject to limited testing and should not be used in conjunction with mission-critical equipment or applications. Any performance specifications are believed to be reliable but are not verified, and Buyer must conduct and complete all performance and other testing of the products, alone and together with, or installed in, any end-products. Buyer shall not rely on any data and performance specifications or parameters provided by Microsemi. It is the Buyer's responsibility to independently determine suitability of any products and to test and verify the same. The information provided by Microsemi hereunder is provided "as is, where is" and with all faults, and the entire risk associated with such information is entirely with the Buyer. Microsemi does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other IP rights, whether with regard to such information itself or anything described by such information. Information provided in this document is proprietary to Microsemi, and Microsemi reserves the right to make any changes to the information in this document or to any products and services at any time without notice.Microsemi Corporate Headquarters One Enterprise, Aliso Viejo,CA 92656 USAWithin the USA : +1 (800) 713-4113 Outside the USA : +1 (949) 380-6100Sales : +1 (949) 380-6136Fax : +1 (949) 215-4996E-mail: ***************************© 2016 Microsemi Corporation. All rights reserved. Microsemi and the Microsemi logo are trademarks of Microsemi Corporation. All other trademarks andservice marks are the property of their respective owners.Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for communications, defense & security, aerospace and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world’s standard for time; voice processing devices; RF solutions; discrete components; enterprise storage and communication solutions, security technologies and scalable anti-tamper products; Ethernet solutions; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services.Microsemi is headquartered in Aliso Viejo, Calif., and has approximately 4,800 employees globally. Learn more at .55900200-1.3/04.16。

XX-OP-14-05 产品变更通知PCN及回执确认单 A0

拟制：
审核：
核准：
公司盖章：
以下为XXXXX公司填写
回执意见
□同意直接接受此变更。
□需要进行进一步变更验证，请提供：
□拒绝接受此变更。
□其他意见：
XXXXX工程师
签字确认：
以下为XXXXX公司填写
PCN确认
□接受变更。
□有条件接受。备注：
□拒绝接受此变更。
XXXXXX工程师
签字确认：
产品PCN文件编号：Fra bibliotekX-OP-14-05发布日期：年月日
致XXXXX公司：
我司深圳市XX有限公司以下型号的产品需要进行更改。详细信息如下。请贵司接收并予以评估、确认。
供应商联络人：
变更涉及
料号：
规格名称品名描述：
供应商原型号：
是否采用新型号：
（若型号较多，可采用附件形式清单）
变更描述
1)变更简述：
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4)变更目的：
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6)部品变更前：
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10)建议XXXXX采取如下验证和变更措施：
11)需要XXXXX反馈的验证数据：
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1)变更开始日期：
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物料处理意见
变更前物料处理：
1)对我司（指供应商）处库存物料，处理意见：
2)对在途物料：
3)对客户处库存物料：

AICC Combo Lock WTB 系列连接器应用指南说明书

TITLEPAGEREVISIONCombo Lock WTB connector1 of 121AUTHORIZED BYDATEArthur Zhao 2021/09/27CLASSIFICATIONUNRESTRICTED1.0 OBJECTIVEThis specification provides information and requirements regarding customer application of Combo lock WTB series connector. This specification is intended to provide general guidance for application processdevelopment. It is recognized that no single application process will work under all customer scenarios and that customers will develop their own application processes to meet their needs. However, if these application processes differ greatly from the one recommended, AICC cannot guarantee results.2.0 SCOPEThis specification provides information and requirements regarding customer application of Combo Lock WTB series connector . 3.0 GENERALThis document is meant to be an application guide. If there is a conflict between the product drawings and specifications, the drawings take precedence.4.0 DRAWINGS AND APPLICABLE DOCUMENTS• AFCI PRODUCT SPECIFICATION GS-12-1702 • AFCI PRODUCT DRAWINGS• APPLICATION MANUALS/INSTRUCTION SHEETS (IF NOT INCLUDED IN THIS DOCUMENT)Product drawings and AFCI’s GS-12-1702 Product Specification are available at www.fci .com In the event of a conflict between this application specification and the drawing, the drawing will take precedence. Customers are advised to refer to the latest revision level of AFCI product drawings for appropriate details.TITLEPAGEREVISIONCombo Lock WTB connector2 of 121AUTHORIZED BYDATEArthur Zhao 2021/09/27CLASSIFICATIONUNRESTRICTED5.0 APPLICATION REQUIREMENTSThe wires in Table 1 are qualified for use with Signal Terminal 10162696.Table 1AWG# Conductor (mm2)Insulation Diameter(mm)#24~#300.05~0.20.8~1.2The wires in Table 2 are qualified for use with Power Terminal 10162697.Table 2AWG# Conductor (mm2)Insulation Diameter(mm)#18~#260.13~0.81.3~2.46.0 APPLICATION TOOLINGApplication Tooling needed for installation of Combo lock WTB series connector is defined in Table 4:Table 3Designation Photo for information onlyMini applicator WTB AWG24~28For 10162696；Mini applicator WTB AWG18~26 For 10162697；Table 3(Continued)Designation Photo for information onlySpare parts for mini applicator WTB AWG24For 10162696-24AwgSpare parts for mini applicator WTB AWG30 For 10162696-30AwgSpare parts for mini applicator WTB AWG18 For 10162697-18AwgTITLEPAGEREVISIONCombo Lock WTB connector3 of 121AUTHORIZED BYDATEArthur Zhao 2021/09/27CLASSIFICATIONUNRESTRICTEDHand tool for mini applicator WTB AWG24For 10162696Part number:10164147-001LF(Please contact with AFCI for the information of business)Hand tool for mini applicator WTB AWG30For 10162696Hand tool for mini applicator WTB AWG18For 10162697Part number:10164148-001LF(Please contact with AFCI for the information of business)Hand tool for mini applicator WTB AWG 20For 101626977.0 POST-APPLICATION INSPECTION PROCEDURES7.1 Crimp height and width measurement:7.1.1 Use Crimp Height Type Micrometers to measure crimping height.7.1.2 Required crimping dimensions, crimp height and width for different wire AWG are defined in Table 4for 10162696 & table 5 for 10162697.TITLEPAGEREVISIONCombo Lock WTB connector4 of 121AUTHORIZED BYDATEArthur Zhao 2021/09/27CLASSIFICATIONUNRESTRICTEDTable 4 ( For signal terminal 10162696 )Wire GaugeConductor Crimp AreaInsulator Crimp AreaTerminal Tensile (AWG #) Width (CCW_1) (mm) Height (CCH_1) (mm)Extruded wire length A1(mm)Width (ICW_1) (mm) Height (ICH_1) (mm) Insulation skins (DIM.B1) (mm)Cut off C1 (mm) Strength (N) #24 1.20±0.04 0.58±0.03 0.5Max. 1.34±0.04 1.40±0.04 0.35 0.15Max 22.3Min. #26 1.10±0.040.53±0.031.34±0.041.40±0.040.15Max 15Min. #30TBD TBDTBD TBD 0.15Max6.7 Min.Table 5 ( For power terminal 10162697 )Wire GaugeConductor Crimp AreaInsulator Crimp AreaTerminal Tensile(AWG #) Width (CCW-2) (mm) Height (CCH-2) (mm) Extruded wire length A2(mm) Width (ICW-2) (mm) Height (ICH-2) (mm) Insulation skins (DIM.B2) (mm) Cut off C2 (mm) Strength (N) #182.20±0.041.30±0.030.5Max.2.47±0.042.78±0.040.350.15Max89Min.* When using hand crimping tool, crimping height in this table are reference only. Because the range of wires, strands, insulation OD will affect the actual crimping height.Note:1. Conductor crimp width. CCW ;2. Conductor crimp height. CCH ;3. Insulator crimp width. ICW ;4. Insulator crimp height. ICH ;5. Conductor wire shall be dimension long (mm) out A 1& A2;6. Naked part of sheathed wire must be located in the vicinity of center B1&B2;7. The Crimp mouth must be equipped like Shell;8. Cut off C1 & C2;TITLEPAGEREVISIONCombo Lock WTB connector5 of 121AUTHORIZED BYDATEArthur Zhao 2021/09/27CLASSIFICATIONUNRESTRICTED7.2 Crimping failure ( Including Signal terminal 10162696 & Power terminal 10162697 ):7.2.1. Bend Up : It may deteriorate insertion to housing and terminal retention force or cause contact failure.7.2.2. Bend Down : It may deteriorate insertion to housing and terminal retention force or cause contact failure.7.2.3. Twist: It may deteriorate insertion to housing and terminal retention force or cause contact failure.TITLEPAGEREVISIONCombo Lock WTB connector6 of 121AUTHORIZED BYDATEArthur Zhao 2021/09/27CLASSIFICATIONUNRESTRICTED7.2.4. Rolling: It may deteriorate insertion to housing and terminal retention force or cause contact failure.7.2.5. Crush and deformation: It may deteriorate insertion to housing and terminal retention force or cause contact failure.TITLEPAGEREVISIONCombo Lock WTB connector7 of 121AUTHORIZED BYDATEArthur Zhao 2021/09/27CLASSIFICATIONUNRESTRICTED8.0APPLICATION PROCEDURE 8.1 Strip the wire 8.2Crimp the wire8.3 Insert the wire into the housingNote:a) Make sure the Receptacle terminal is well oriented for the insertion to the housing. Insert the terminal intoHSG until the front is stopped by HSG. Then locking tab will be engaged the retention shoulder and prevent back out during mating. Pull back on the wire lightly and ensure the terminal is fully seated.Crimp the wire Insert the wire into the housing Insert directionTITLEPAGEREVISIONCombo Lock WTB connector8 of 121AUTHORIZED BYDATEArthur Zhao2021/09/27CLASSIFICATIONUNRESTRICTEDb) The following incorrect assembly method will result in failure to insert and terminal distortionError model_1: TiltError model_2: ReverseError model_3: RotaryLatch of housingTITLEPAGEREVISIONCombo Lock WTB connector9 of 121AUTHORIZED BYDATEArthur Zhao 2021/09/27CLASSIFICATIONUNRESTRICTED9. Instruction when mating with Plug assembly9.1. Mating process methodPlease set mating direction of receptacle housing and plug housing , and push both side of receptacle housing to pitch direction ( as shown with arrows) until both Conn. Complete mating position. After mating ,please comfirm that friction locks are fastened completely.10. REPAIR / REMOVAL PROCEDURERepairs are not recommended 11Insert straight Insert with an angle( RIGHT ANGLE & VERTICAL ) ( RIGHT ANGLE & VERTICAL )Instruction :• When mating, please do not push positive lock of cable housing. It might cause damage by being applied excessive load by correct movement of lock part riding up the catching part is prevented.•Please push cable housing and insert it straightly until they touch each other. Conn. Mating will end up straight direction even if it is inserted with an angle. However, if you insert it gradually with an angleintentionally, it may cause only one side locked as elastic cable housing is deformed during the insertion. ( Especially in multiple circuits )• If you can not insert smoothly , please insert again after confirming if there is no transformation of terminal And cable housing ect.TITLEPAGEREVISIONCombo Lock WTB connector10 of 121AUTHORIZED BYDATEArthur Zhao 2021/09/27CLASSIFICATIONUNRESTRICTED9.2. Recommended un-mating methodPlease hold wires all together lightly . After releasing lock completely by attaching fingers to the lock and push bar for releasing lock using flat part of finger, please withdraw cable housing slowly, axially and straightly . Please avoid withdrawing them with an angle and roughly. That might cause damage to connector.Instruction:• Please do not withdraw with holding only a few particular wires. As excessive force is applied to particular terminals, connector might be damaged or terminal might come off.•When releasing lock, please push bar for releasing lock with flat part of finger, not only with fingertip (nail tip). If finger nail is too long, it might catch lock protection wall.9.3 Wiring after matingInspection• If you plan on pulling around wires inside machine, please take measures to prevent force from applyingto connector directly, such as allowing wires to have enough flexibility.( Fig 9.3.1 )• When pulling wires around inside actual machine, please do not use under the condition that wires arebent excessively or tension is added. That might be reason for terminal to be pulled out because force is added to terminal crimping zone or terminal insertion portion of receptacle by wire tension. Especially, please prevent force from being applied to only a few particular wires. ( Fig 9.3.2 )• If force is added to one particular wire, wire ( crimp terminal ) might be pulled off.• Wire routing inside customer’s device needs to avoid excessive stress. Please avoid pulling them towardmore than two directions.(Fig 9.3.3)TITLEPAGEREVISIONCombo Lock WTB connector11 of 121AUTHORIZED BYDATEArthur Zhao 2021/09/27CLASSIFICATIONUNRESTRICTEDFig 9.3.1 Condition wires are curvedFig 9.3.2 Condition wires are bend excessively or tension is addedFig 9.3.3 Wiring toward more than 2 directionsTITLEPAGEREVISIONCombo Lock WTB connector12 of 121AUTHORIZED BYDATEArthur Zhao 2021/09/27CLASSIFICATIONUNRESTRICTED10. REPAIR / REMOVAL PROCEDURERepairs are not recommended11. RECORD RETENTIONREV PAGE DESCRIPTIONEC# DATE1 All Preliminary2021/Sep./27。

Microsemi USB50403C - USB50424C Transient Voltage

USB50403C – USB50424C
Available
Bidirectional TVS Array
DESCRIPTION
This USB50403C – USB50424C Transient Voltage Suppressor (TVS) family is packaged in a SOT-143 configuration giving protection to 1 bidirectional data or interface line. It is designed for use in applications where protection is required at the board level from voltage transients caused by electrostatic discharge (ESD) as defined in IEC 61000–4-2, electrical fast transients (EFT) per IEC 61000-4-4 and secondary effects of lightning. It is also available in RoHS compliant versions. These TVS arrays have a peak power rating of 500 watts for an 8/20 sec pulse. This array is suitable for protection of sensitive circuitry consisting of TTL, CMOS, DRAM’s, SRAM’s, HCMOS, HSIC microprocessors, and Universal Serial Bus (USB) and I/O transceivers.

安捷伦纳米压痕仪G200用户手册说明书

Features and Benefits• Simple determination of indenter area function and frame stiffness• Accurate, repeatable results compliant with ISO 14577 standard• Electromagnetic actuation allows unparalleled dynamic range in force and displacement• Conﬁ gurable for routine testing or new applications• Modular options for high-speed, scratch, high-temperature, and dynamic testing• Outstanding software with real-time experimental control, easy test protocol development, and precision drift compensation Applications• Semiconductor, thin ﬁ lms,MEMs (wafer applications)• Hard coatings, DLC ﬁ lms• Composite materials,ﬁ bers, polymers• Metals, ceramics• Lead-free solder• Biomaterials, biological andartiﬁ cial tissue OverviewThe culmination of decades of research and development, the Agilent Nano Indenter G200 is the world’s most accurate, ﬂ exible, and user-friendly instrument for nanoscale mechanical testing. Electromagnetic actuation allows the Nano Indenter G200 to achieve unparalleled dynamic range in force and displacement.The Nano Indenter G200 enables users to measure Young’s modulus and hardness in compliance with ISO 14577. The G200 also enables measurement of deformation over six orders of magnitude (from nanometers to millimeters). Furthermore, modular options can be added to accommodate a variety of applications. The capabilities of the G200 can be extended to facilitate high-speed mechanical-properties mapping, frequency-speciﬁ c testing, quantitative scratch and wear testing, integrated probe-based imaging, high-temperature testing, expanded load capacity up to10N, and customizable test protocols. With the Nano Indenter G200, users are able to quantify the relationship between structure, properties, and performance of their materials quickly and easilywith minimal sample preparation.The user-friendly design of the G200 simpliﬁ es training requirements — standard tests can be run on the same day the instrument is installed. EveryG200 is backed by highly responsive Agilent Technologies customer service personnel. Knowledgeableand experienced regional applications engineers are available to guide users through more advanced testing, provide outstanding technical support, and offer unmatched applications expertise.Agilent Nano Indenter G200Data SheetPrecise mechanical testing in the micro- tonano-range of loads and displacements.Figure 1. Schematic diagram of the actuatingand sensing mechanisms of the NanoIndenter G200.2to enhance its actual displacementmeasurement capability. Using standard methods, the displacement resolution of the DCM II is 0.0002nm (0.2 picometers). Even more importantly, real-world testing shows that the noise levels are typically less than an angstrom, ensuring the best resolution of any indenter on the market today. The DCM II has the lowest noise ﬂ oor of any instrument of its type.Continuous StiffnessMeasurement (CSM) OptionIn conventional quasi-static indentation testing, the stiffness of contact is determined by analyzing the force vs. displacement curve during unloading. This depth-sensing method provides a single measurement for the given indentation depth. The AgilentContinuous Stiffness Measurement (CSM) technique, which is compatible with both the XP and the DCM II indentation heads, satisﬁ es application requirements that must take intoaccount dynamic effects, such as strain rate and frequency.The CSM option offers a means of separating the in-phase and out-of-phase components of the load-displacement history. This separation provides an accuratemeasurement of the location of initial surface contact and continuous measurement of contact stiffness asa function of depth or frequency, thus eliminating the need for unloading cycles.This makes CSM a powerful tool not only for stiff materials such as metals, alloys, and ceramics but also fortime-dependent materials like polymers, structural composites, and biomedical materials.The state-of-the-art CSM option provides the only means available to both fully characterize dynamic properties in the nanometer range and accurately characterize viscoelastic materials providing values such asstorage modulus. Indentation tests using CSM can be controlled with a constant strain rate, a critical test parameter for material systems such as pure metals or low-melting-point alloys, and polymer ﬁ lms and ﬁ lm / substrate systems.Ultra-Fast Express Test OptionDesigned for exclusive use with the G200, Agilent’s new Express Test option allows 100 indents to be performed at 100 different surface sites in 100 seconds! Highly versatile, easy-to-use Express Test methods are ideal forapplications that involve metals, glasses, ceramics, structural polymers, thin ﬁ lms, and low-k materials. And now with NanoSuite 6.2 users can automatically generate histograms and 3D mechanical-properties maps. Graphs and supporting data are easily exported to Excel. In order to achieve these revolutionary measurements, the G200 must be conﬁ gured with a DCM II indentation head, Agilent’s NanoVision stage option, and the new Express Test option.Lateral Force Measurement (LFM) OptionThere are several additionalperformance-extending Nano Indenter G200 options available for use with the standard XP indentation head. The Agilent Lateral Force Measurement(LFM) option provides three-dimensional quantitative analysis for scratch testing, wear testing, and MEMS probing. This option enables force detection in the XAdvanced DesignAll nanoindentation experiments rely on the accuracy of the fundamental load and the displacement data, requiring the highest precision control of load applied to the sample. The Nano Indenter G200 is powered by electromagnetic actuation-based force transducers to ensure precise measurements. The instrument’s unique design avoids lateral displacement artifacts.Among the many beneﬁ ts of the Nano Indenter G200 design are convenient access to the entire sample tray,excellent sample positioning accuracy, easy viewing of the sample position and the sample work area, and simplicity in sample height adjustment to speed test throughput. A modular controller design is optimized for future upgrading. In addition, the G200 conforms toISO 14577 to ensure data integrity, gives users the ability to program experiments with each force transducer and switch between them at any time, and has an optimized lateral footprint to conserve lab spaceNew Enhanced DynamicContact Module II OptionThe Nano Indenter G200 standard conﬁ guration utilizes the Agilent XP indentation head, which delivers <0.01nm displacement resolution and >500µm maximum indentation depth. To extend the range of load-displacement experimentation to the surface contact level, the G200 can be equipped with the new Agilent Dynamic Contact Module II (DCM II) option. This option offers all of the impressive performance afforded by Agilent’s original DCM option as well as several new advantages, including 3x higher loading capability (30mN max load), easy tip exchange for quick removal and installation of application-speciﬁ c tips, and a full 70µm range of indenter travel.With the DCM II option, researchers can study not only the ﬁ rst few nanometers of an indentation into the surface of a material, but even the pre-contact mechanics. At this scale, the noise level of the indentation system is optimizedFigure 2. This SEM image shows indents made at the base of a cantilever beam. The Nano Indenter G200 is uniquely suited for testing both MEMS and component materials for two reasons. First, the actuating and sensing mechanisms allow an unparalleled combination of range and resolution. Second, the controlling software is test-method based — there is no conﬁ guration or calibration of hardware.3and Y directions to examine shear forces. Tribological studies beneﬁ t greatly from the LFM option for determination of the critical load and coefﬁ cient of friction over the scratch length.High Load OptionThe capabilities of the Nano Indenter G200 can also be enhanced via the Agilent High Load option. Designed for use with the standard XP indentation head, this option expands the load capabilities of the Nano Indenter G200 up to 10N of force, allowing the complete mechanical characterization of ceramics, bulk metals, andcomposites. The High Load option has been engineered to avoid sacriﬁ cing the instrument’s load and displacement resolutions at low forces while seamlessly engaging at the point in the test protocol when extra force is required.Heating Stage Option This option, which is compatible with the standard XP indentation head, facilitates the study of materials of interest as they are heated from room temperature to as high as 350ºC. To ensure reliable data, the system’s software compensates for drift associated with heating.New Enhanced NanoSuite 6.2 Professional SoftwareEvery Nano Indenter G200 comes withAgilent NanoSuite 6.2 Professionalsoftware, a premium-performancepackage that gives researchers inscientiﬁ c and industrial settings anunprecedented combination of speed,ﬂ exibility, and ease of use. NanoSuite 6.2 offers a variety of prewritten testmethods, including an exclusivenanoindentation technique for makingsubstrate-independent measurements of thin ﬁ lm materials, several noveltechniques for testing polymers,and improved scratch test methods.Agilent’s ﬁ eld-proven method for testingin compliance with ISO 14577, theinternational standard for indentation testing, is provided as well.NanoSuite 6.2 includes a fully integrated tool that greatly simpliﬁ es thedetermination of indenter area functionand load-frame stiffness. Once a ratherinvolved and time-consuming endeavor,this process now requires only a coupleof mouse-clicks within the NanoSuite 6.2 program. Prewritten methods for testing gels (DCM II indentation head and CSM option required) and for measuring strain-rate sensitivity (XP indentationhead and CSM option required) areincluded in NanoSuite 6.2.Additional new capabilities allow a standard batch of tests comprising 25 or more samples to be set up in 5minutes or less, 2D and 3D graphs, and histograms to be plotted on-screenand exported directly to Microsoft Excel while preserving all labels and scales,and sample ﬁ les to be organized byproject and subproject. NanoSuite 6.2 also provides Microsoft Windows 7(32-bit) compliance for current systems and a convenient PDF printer to replace hardware printers.As in the package’s previous iteration, an intuitive interface allows users to set up and run experiments quickly— changing test parameters as often as desired — with just a few clicks. NanoSuite 6.2 offers support of small force/displacement measurements,surface topology, stiffness mapping, scratch tests, and more. Versatile imaging capabilities, a survey scanning option, and streamlined test method development help researchers get from testing to results in record time.NanoVision OptionThe Agilent NanoVision option for the Nano Indenter G200 is used to probe the surface of a sample, generating a 3D map of the surface. Backed by decades of nanomechanical testing experience, the NanoVision nanomechanical microscopy option delivers quantitative imaging by coupling a linear electromagnetic actuation-basedindentation head with a closed-loop nanopositioning stage. NanoVision allows users to create quantitative high-resolution images using a Nano Indenter G200, target indentation test sites with nanometer-scale precision, and examine residual impressions in order to quantify material response phenomena such as pile-up, deformed volume, and fracture toughness. This option also lets users target and characterize individual phases of complex materials.Nanoindentation instruments from Agilent Technologies conform to the ISO 14577 standard (Metallic materials — Instrumented indentation test forhardness and materials parameters), delivering conﬁ dence in test accuracy andrepeatability. These state-of-the-art solutions ensure reliable, high-precisionmeasurement of nanomechanical properties for research and industry.Figure 3. Fracture toughness by Nanoindentation. Left image: A 24 x 24µm scan of a 1200nm deep indent in silica. Crack features accentuated. Right image: An enlarged image of the indent taken straight from the NanoSuite 6.2 review page.Agilent Nano Indenter G200 SpecificationsStandard XP Indentation HeadDisplacement resolution <0.01nmTotal indenter travel 1.5mmMaximum indentation depth >500µmLoad application Coil / magnet assembly Displacement measurement Capacitance gaugeLoading capabilityMaximum load (standard) 500mNMaximum load with DCM II option 30mNMaximum load with High Load option 10NLoad resolution 50nNContact force <1.0µNLoad frame stiffness ~5 x 106N/mIndentation placementUseable surface area 100mm x 100mmPosition control Automated remote with mouse Positioning accuracy 1µmMicroscopeVideo screen 25x (x objective mag.)Objective 10x and 40xDCM II Indentation Head OptionDisplacement resolution 0.0002nm (0.2 picometers) Range of indenter travel 70µmLoading column mass <150mgLoad application Coil / magnet assembly Displacement measurement Capacitance gaugeTypical leaf spring stiffness ~100N/mTypical damping coefﬁ cient 0.02Ns/mTypical resonant frequency 120HzLateral stiffness 80,000N/mLoading capabilityMaximum load 30mN (13gm)Load resolution 3nN (0.3µgm)LFM OptionMaximum lateral force >250mNLateral resolution <2µNMaximum scratch distance >100mmScratch speed 100nm/s up to 2mm/sHigh Load OptionMaximum force 10NLoad resolution ≤1mNMaximum indentation depth ≥500µmDisplacement resolution 0.01nmFrame stiffness ≥5 x 106N/mNanoVision OptionX-Y scan range 100µm x 100µmZ scan range Indentation head dependent Positioning accuracy ≤2nmResonant frequency >120Hz Nano Mechanical Systems from Agilent TechnologiesAgilent Technologies, the premier measurement company, offers high-precision, modular nano-measurement solutions for research, industry, and education. Exceptional worldwide support is provided by experienced application scientists and technical service personnel. Agilent’s leading-edge R&D laboratories ensure the continued, timely introduction and optimization of innovative, easy-to-use nanomechanical system technologies. /find/nanoindenter AmericasCanada (877) 894 4414 Latin America 305 269 7500 United States (800) 829 4444Asia Paciﬁ cAustralia 1 800 629 485 China 800 810 0189Hong Kong 800 938 693India 1 800 112 929 Japan 0120 (421) 345 Korea 080 769 0800 Malaysia 1 800 888 848 Singapore 180****8100T aiwan 0800 047 866 Thailand 1 800 226 008 Europe & Middle EastAustria 43(0)136****1571 Belgium 32 (0) 2 404 93 40 Denmark 45 70 13 15 15 Finland 358 (0) 10 855 2100 France 0825 010 700**0.125 €/minute Germany 49 (0) 7031 464 6333 Ireland 1890 924 204Israel 972-3-9288-504/544 Italy 39 02 92 60 8484 Netherlands 31 (0) 20 547 2111 Spain 34 (91) 631 3300 Sweden 0200-88 22 55 Switzerland 0800 80 53 53 United Kingdom 44 (0) 118 9276201 Other European Countries:/ﬁ nd/contactus Product speciﬁ cations and descriptions in this document subject to change without notice.© Agilent Technologies, Inc. 2013 Printed in USA, March 1, 20135990-4172EN Rev.E。

ABB AB Jokab Safety SSR10 Sentry Safety Relay 说明书

[DE] Die komplette Originalbetriebsanleitung ist zu finden unter:[IT] Le istruzioni originali complete si trovano qui:[FR] La notice originale intégrale est disponible sur:[ES] La versión original de las instrucciones está disponible en:/jokabsafetyABB ABJokab SafetyVarlabergsvägen 11 SE-434 39 Kungsbacka Tel. +46 (0) 21-32 50 /jokabsafetyProduct descriptionSSR10 is a safety relay that has single sensor functions for the most common applications and limited configuration possibilities for automatic and manual reset.InstallationWARNING: The product must be installed by a trained electrician following applicable safety regulations, standards and the machinedirective.CAUTION: The safety relay shall be attached on a 35 mm DIN railin an enclosure that has at least protection class IP54.CAUTION: Make sure there is at least 10 mm distance between the safety relay and other non-Sentry safety relay units to preventuncontrolled heating.CAUTION: Make sure there is at least 50 mm distance above and below the safety relay and other units for correct air flow in the venting holes of the safety relay.ConnectionWARNING: The safety relay and the sensor device for monitoring must be connected to SELV/PELV power supply.A)B)D)E)C)F)A. Two signals from T1/T2, manual resetB. One signal from T1C. Two OSSD-signalsD. Two signals from +24VDCE. One Signal from +24VDCF. Automatic resetLED indicationCH1/MODE/CH2CommentActionoff/off/offThe safety relay is not powered.Check A1-A2 voltage and connections.green/green/greenCH1 and CH2 closed. Reset done and outputs activated.off/blue/off No channels closed.Check CH1 and CH2.green/blue/green CH1 and CH2 closed, the safety relay wait for reset.Check reset settings, wiring and reset circuit.red/flash fast red/redThe safety relay is in failsafe mode.Do a power cycling.Technical dataMeasurements Height/width/depth 120 mm/22.5 mm/120 mmPower supply Power supply type PELV/SELVOperating voltage +24 VDC +15 %, -20 %Consumption 8 WRequired fuse4 A gG (4 A according to UL 248)Relay output specification Maximum operating switching voltage250 VAC Overvoltage category IINO contactAC load (AC15, AC1), ratedoperational voltage, current 1/2/3 contact(s)250 VAC, 5 A/ 5 A/ 4.6 A DC load (DC13, DC1), ratedoperational voltage, current 1/2/3 contact(s)+24 VDC, 6 A/5.6 A/4.6 ARequired fuse 6.3 A gG, 1 kA short circuit protection (6 A according to UL248)NC contactAC load (AC15, AC1), rated operational voltage/current 250 VAC/0.5 A DC load (DC13, DC1), rated operational voltage/current+24 VDC/2 ARequired fuse4 A gG, 1 kA short circuit protection (4 A according to UL 248)Sensor interface specificationOutput T1 and T2Maximum output current 50mA, nom 24 VDC Input R1 and R2Maximum OSSD pulse length 1.0 msInput/output (I/O) X4Maximum output current (currently limited internally to typical 70 mA)50 mAConnection block and wire propertiesMaximum screw torque 0.8 NmSolid conductor, minimum1 x 24 AWG (0.2 mm 2), 2 x 24 AWG (0.2 mm 2)2TLC010006M0201 Rev BWhile every effort has been taken to ensure the accuracy of information contained in this book and any associated promotional and information material ABB JokabSafety cannot accept responsibility for errors or omissions and reserves the right to make any improvements without notice. It is the users responsibility to ensure that this equipment is correctly designed, specified, installed, cared for and operated to meet all applicable local, national and international codes/regulations. Technical data in our book is correct to the level of accuracy of ABB Jokab Safety´s test procedures as verified by various international approved bodies. Other information (such as application examples, wiring diagrams, operation or use) is intended solely to illustrate the various uses of our products. ABB Jokab Safety does not quarantee or imply that the product when used in accordance with such examples in a particular environment will fulfil any particular safety requirement and does not assume any responsibility or liability for actual use of the product based on the examples given.[DE] Die komplette Originalbetriebsanleitung ist zu finden unter:[IT] Le istruzioni originali complete si trovano qui:[FR] La notice originale intégrale est disponible sur:[ES] La versión original de las instrucciones está disponible en:/jokabsafetySolid conductor, maximum 1 x 12 AWG (3.31 mm 2), 2 x 16 AWG (1.31 mm 2)Conductor with crimp sleeve, minimum1 x 24 AWG (0.2 mm 2), 2 x 24 AWG (0.2 mm 2)Conductor with crimp sleeve, maximum 1 x 12 AWG (3.31 mm 2), 2 x 16 AWG (1.31 mm 2)Wire strip length6-7 mmMaximum response time Delay at power on1.5 s Response time at activation automatic reset/manual reset 50 ms/50ms Response time at deactivation 20 msElectrical operations life time Load Σlth² ≤ 64, AC1, AC15160 000 operations Load Σlth² ≤ 64, DC1, DC13100 000 operations Mechanical operations lifetime 107 operations Environmental data Protection class, safety relay IP20Protection class, enclosureAt least IP54Ambient temperature range foroperation within specified operation range-10°C – +65°C Humidity range for operation25 % ≤ Rh ≤ 90 %, non-condensing and without icingSuitable for use at ≤ 2000 metres above sea level.Standard compliance and approvals Functional safety standard complianceEN 61508-1:2010, up to SIL3 EN ISO 13849-1:2008, up to PLe/Cat.4EN 62061:2005, up to SILCL3 EN 61511-1:2003ApprovalsCE, TÜV SÜD, cULus Declaration of conformityCan be found at:/jokabsafety Information for use in USA/Canada Intended use Applications according to NFPA 79Power sourceA suitable isolating source in conjunction with a fuse in accordance with UL 248FuseThe fuse shall be rated max. 4 A and be installed in the +24 VDC power supply to the device in order to limit the available current.MaintenanceWARNING: The safety functions and mechanics shall be testedevery year to confirm that the safety functions work properly.WARNING: Repair and exchange of parts of the safety relay is not permitted since it may accidentally cause permanent damage to the product, imparing safety of the device which in turn could lead to serious injury to personnel. In case of breakdown or damage to the product contact ABB Jokab safety to replace the safety relay with a similar product.。