HLMP-K105-LM0B2中文资料

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HMPU

HMPU-2通信管理机
一、系统描述
在以自动化为基础的变电站中，要实现少人或无人值班，微机保护监控系统及一些智能自动化测控装置在其中其着非常重要的作用，而各系统之间存在着信息交流的问题。

系统之间的信息交流减少了重复采样，节省和大大简化了二次的铺设和连接。

就目前变电站所用的自动化设备，不同的设备有着不同的通信规约，而这些设备的信息则需要收集、处理、汇总、转发，同时提供给当地监控和上一级调度中心，实时地监控各设备的运行状况。

在这种情况下，利用HMPU-200通信管理机，就能起到很好的承上启下的作用。

该装置采用双CPU组成，128X64图形液晶显示。

其中一个CPU管理8路RS-485现场总线，另一个CPU管理一路隔离RS-485总线和五路RS-232，具有强大的数据处理和采集能力。

支持多种远动规约。

装置具有GPS校时功能，时钟芯片自带锂电池，具有掉电不丢失的功能。

采用多种抗干扰措施，使装置的稳定性得到很大的提高，保证通讯的稳定。

二、系统基本功能
将采集的不同设备的数据转换成标准的转发通讯规约与上级调度和当地后台机通讯，接收上级的命令，转发成各种控制及采集命令。

通讯方式支持问答式和循环发送方式。

三、系统菜单结构
1、警铃。

广带LDMOS驱动芯片数据手册说明书

2 of 11
BLP10H605
Broadband LDMOS driver transistor
5. Recommended operating conditions
See application note AN11520 for more details.
150 Tcase (°C)
130
aaa-012031
Typ [1] 5.5
Unit K/W
7. Characteristics
Table 6. DC characteristics Tj = 25 C; unless otherwise specified.
Symbol Parameter
Conditions
V(BR)DSS drain-source breakdown voltage
Component layout
BLP10H605#4
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 4 — 1 September 2015
© Ampleon The Netherlands B.V. 2015. All rights reserved.
-
150 C
BLP10H605#4
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 4 — 1 September 2015
© Ampleon The Netherlands B.V. 2015. All rights reserved.

德国戴博热缩机参数

德国戴博热缩机参数
德国戴博热缩机作为具有一定竞争力的热缩包装机械，其技术参数如下：
1. 最大热缩尺寸：L+H≤600mm，W+H≤400mm
2. 最小热缩尺寸：L+H≥100mm，W+H≥60mm
3. 封包速度：15-25包/分钟
4. 热缩速度：0-1.5米/分钟
5. 适用薄膜材质：PVC、POF、PP等
6. 电源要求：220V/380V，50Hz/60Hz
7. 动力耗电：8.5kw(h)
从以上参数可以看出，德国戴博热缩机具有较高的封包速度和热缩速度，能够适应多种薄膜材质的包装需求。

同时，其最大热缩尺寸也比较大，可满足一些比较大型的产品包装要求。

除此之外，德国戴博热缩机还有以下优点：
1. 采用先进的进口电器元件和控制系统，性能稳定可靠。

2. 设计合理，操作方便，可实现自动化生产线操作。

3. 热缩效果好，包装外形美观，能够提高产品的形象和附加值。

4. 可以适应多种规格的产品包装，适用范围广泛。

5. 采用高品质材料，机器寿命长，维护简单方便。

德国戴博热缩机作为先进的热缩包装设备，可以提高生产效率，改善产品包装质量。

企业在选购时应结合自身产品特点和生产要求，综合考虑设备的技术参数、质量、效益等因素，选择合适的热缩机型号，以达到最佳的生产效果和节约成本的目的。

摩擦式输送机PLC自动控制系统说明书

广州本田汽车有限公司第二工厂INP、ENG摩擦输送线使用说明书承德威伯输送机械有限责任公司二OO六年七月目录1.前言2.设备的预防性维护3.为便于维修的几点要求4.润滑5.输送机轨道6.承载小车组7.道岔8.驱动装置9.定位装置10.升降机11.活动安全网12.气路控制系统摩擦式输送机使用维护说明1 前言1.1输送机是一种先进而复杂的物料输送设备，而且多和其他类型的输送设备一起，通过可编程控制器或计算机控制，成为高度机电一体化的物料储运系统。

因此，应对所有使用、管理输送机设备的工作人员进行有关机械、电气、计算机等方面的培训和安全生产教育，严格遵守有关操作规程。

1.2 应由专门人员管理输送设备、启动和停止输送机的运行。

1.3 应根据使用情况制定输送机设备小修、中修、大修计划，并认真详细地填写维修记录。

1.4 对负责输送机维修保养人员进行专门的培训，使之掌握设备结构特点、熟悉设备性能和控制原理。

2 设备的预防性维护设备的预防性维护的目的是系统地检查、保养设备，使之处于正常工作状态。

预防性维护可以早期发现设备的小毛病并及时加以处理，避免这些小毛病酿成大患，造成必须大修或更换主要零部件的后果。

预防性维护由设备维修保养人员进行。

为能使设备经常的处于正常的工作状态，应认真地填写《设备维修保养日志》（见表2-1 ）。

如果能认真、及时、正确地填写此表，将会得到一份有价值的设备运行、保养、维修档案，可以不断地积累经验，使各零部件能经常处于良好的工作状态，从而减少了维修时间和费用，保证了整个系统的正常运行。

表2-1 设备维护保养日志3 为便于维修的几点要求3.1 把所有的小车组按顺序编号。

这样做便于生产和维修人员识别“坏”小车组，并把它从系统中移走。

3.2 把所有的道岔、定位装置、升降机、信号设备按顺序编号。

3.3 把所有的驱动装置按顺序编号。

4 润滑4.1表4-1 是输送机主要零部件的润滑规则（润滑方式、润滑周期及推荐的润滑剂）。

LMK212BJ105KG中文资料

S52xxMLow Drop Output Voltage RegulatorDescriptionThe S52xxM is a u-cap 150mA linear voltage regulator in the SOT-25 package. This regulator has very low dropout voltage and very low ground current. It is designed especially for hand-sets, battery-powered devices and can be controlled by a CMOS or TTL. When the S52xxM is disabled, power consumption drops to nearly zero.Features• Low dropout voltage regulator• Low quiescent current and guaranteed 150mA output • Zero off-mode currentOrdering InformationType NO. Marking Package Code S52xxM5□□SOT - 25□□: V oltage CodeS e m i c o n d u c t o rAbsolute Maximum Ratings Ta=25°CUnitRatingsCharacteristic Symbol~+16 VInput supply voltage V IN -0.4Enable Input Voltage V EN -0.4~+16 VPower Dissipation Pd 500 mW~+125 °CJunction Temperature Range T j -40~+150 °CStorage Temperature Range T stg -60Lead Temperature Time T sol260 (5 Sec) °CElectrical Characteristics=(※V=V+1V; I = 100uA; C=4.7uF; V≥2.0V; T=25℃) Array *Note1 : Dropout V oltage is the difference between the input voltage and the output voltage at whitch point the regulatorstarts to fall out of regulation (this is the point when the output voltage decreases by 100mV).Table 1Electrical Characteristics TableTest Condition; V IN = V OUT(TYP) +1V , I OUT =100uA, T A =25℃, unless otherwise specified.Voltage Limit [V]Output Voltage[V] Voltage CodeMIN MAX1.5 15 1.440 1.560 1.8 18 1.728 1.8722.5 25 2.400 2.600 2.8 28 2.688 2.9123.0 30 2.880 3.120 3.3 33 3.168 3.432 5.0 504.8005.200■Typical ApplicationsElectrical Characteristic CurvesElectrical Characteristic Curves (Cont.)Shutdown (Dis/Enable) OperationThe S52xxM output can be turned off by applying 0.4V or less to the device’s Dis/Enable pin (pin3). In shutdown mode, the S52xxM draws less than 1uA quiescent current. The output of the S52xxM is enabled by applying 1.5V to 13V at the Dis/Enable pin. In applications were the S52xxM output will always remain enabled, the Dis/Enable pin may be connected to Vin(pin1). The S52xxM’s shutdown circuitry includes hysteresis, as such the device will operate properly even if a slow moving signal is applied to the Dis/Enable pin. The device’s shutdown pin includes a 2M Ω internal pull down resistor connected to ground.Short Circuit ProtectionThe S52xxM output can withstand momentary short circuit to ground. Moreover , the regulator can deliver very high output peak current due to its 1A instantaneous short circuit current capability.Noise Bypass CapacitorIn low noise applications, the self noise of the S52xxM can be decreased further by connecting a capacitor from the noise bypass pin (pin4) to ground (pin2). The noise bypass pin is a high impedance node as such care should be taken in printed circuit board layout to avoid noise pick-up from external sources. Moreover , the noise bypass capacitor should have low leakage. Noise bypass capacitors with a value as low as 470pF may be used. However , for optimum performance, use a 0.01uF or larger , ceramic chip capacitor . Note that the turn on and turn off response of the S52xxM is inversely proportional to the value of the noise bypass capacitor . For fast turn on and turn off, use a small value noise Bypass capacitor . In applications were exceptionally low output noise is not required, consider omitting the noise Bypass capacitor altogether .Output Capacitor SelectionAUK strongly recommends the use of low ESR(Equivalent series resistance) ceramic capacitors for Cout and C N . The S52xxM is stable with low ESR capacitor (as low as zero Ω). The value of the output capacitor should be 1uF or higher. Either ceramic chip or a tantalum capacitor may be used at the output. Use of ceramic chip capacitors offer significant advantages over tantalum capacitors. A Ceramic capacitor is typically cheaper than a tantalum capacitor, it usually has a smaller footprint, lower height, and lighter weight than a tantalum capacitor. Furthermore, unlike tantalum capacitors which are polarized and can be damaged if connected incorrectly, ceramic capacitors are non-polarized. Low value ceramic chip capacitors with X5R or X7R dielectric are available in the 100pF to 4.7uF range. Beware of using ceramic capacitors with Y5V dielectric since their ESR increases significantly at cold temperatures. Figure 9 shows a list of recommended ceramic capacitors for use at the output of S52xxM.If a tantalum output capacitor is used then for stable operation AUK recommends a low ESR tantalum capacitor with maximum rated ESR at or below 0.4Ω. Low ESR tantalum capacitors, such as the TPS series from AVX Corporation () or the T495 series from Kemet () may be used.In applications where a high output surge current can be expected, use a high value but low ESR output capacitor for superior load transient response. The S52xxM is stable with no load.Fig. 9C OUT Capacitor Size I OUT Dielectric Part Number Capacitor Vendor1µF 0805 0 to 150mA X5R C2012X5R1A105KT TDK′′0805 ′′X7R GRM40X7R105K010 muRata′′0805 ′′X7R LMK212BJ105KG Taiyo-Yuden ′′1206 ′′X7R GRM42-6X7R105K016 muRata′′1206 ′′X7R EMK316BJ105KL Taiyo-Yuden ′′1206 ′′X5R TMK316BJ105KL Taiyo-Yuden2.2µF 0805 0 to 150mA X5R GRM40X5R225K 6.3 muRata′′0805 ′′X5R C2012X5R0J225KT TDK′′1206 ′′X5R EMK316BJ225ML Taiyo-Yuden4.7µF 1206 0 to 150mA X5R GRM42-6X5R475K010 MuRata′′1206 ′′X7R LMK316BJ475ML Taiyo-Yuden。

INA105KP,INA105BM,INA105KU2K5,INA105KU2K5E4,INA105KPG4,INA105KUE4,INA105AM, 规格书,Datasheet 资料

©1985 Burr-Brown Corporation PDS-617G Printed in U.S.A. August, 1993Precision Unity Gain DIFFERENTIAL AMPLIFIERCMR 86dB min OVER TEMPERATURE APPLICATIONSq DIFFERENTIAL AMPLIFIER q INSTRUMENTATION AMPLIFIER BUILDING BLOCK SBOS145芯天下--/SPECIFICATIONSELECTRICALAt +25°C, V CC = ±15V, unless otherwise noted.T Specification same as for INA105AM.NOTES: (1) Connected as difference amplifier (see Figure 4). (2) Nonlinearity is the maximum peak deviation from the best-fit straight line as a percent of full-scale peak-to-peak output. (3) 25kΩ resistors are ratio matched but have ±20% absolute value. (4) Maximum input voltage without protection is 10V more than either ±15V supply (±25V). Limit I IN to 1mA. (5) With zero source impedance (see “Maintaining CMR” section). (6) Referred to output in unity-gain difference configuration. Note that this circuit has a gain of 2 for the operational amplifier’s offset voltage and noise voltage. (7) Includes effects of amplifier’s input bias and offset currents. (8) Includes effects of amplifier’s input current noise and thermal noise contribution of resistor network.The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject to change without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant any BURR-BROWN product for use in life support devices and/or systems.®INA1052芯天下--/®INA1053PIN CONFIGURATIONSThis integrated circuit can be damaged by ESD. Burr-Brown recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.ABSOLUTE MAXIMUM RATINGSSupply ................................................................................................±18V Input Voltage Range ............................................................................±V S Operating Temperature Range: M ..................................–55°C to +125°CP, U................................–40°C to +85°CStorage Temperature Range: M .....................................–65°C to +150°C P, U .................................–40°C to +125°C Lead Temperature (soldering, 10s) M, P .......................................+300°C Wave Soldering (3s, max) U ..........................................................+260°C Output Short Circuit to Common..............................................ContinuousPACKAGE DRAWING TEMPERATUREPRODUCT PACKAGE NUMBER (1)RANGE INA105AM TO-99 Metal 001–40°C to +85°C INA105BM TO-99 Metal 001–40°C to +85°C INA105KP 8-Pin Plastic DIP 006–40°C to +85°C INA105KU8-Pin SOIC182–40°C to +85°CNOTE: (1) For detailed drawing and dimension table, please see end of data sheet, or Appendix C of Burr-Brown IC Data Book.PACKAGE/ORDERING INFORMATION芯天下--/®INA1054SMALL SIGNAL RESPONSE(No Load)Time (µs)Ou t p u t V o l t a g e (m V )0510+50–50STEP RESPONSETime (µs)O u t p u t V o l t a g e (V )–10 t o +100481216SMALL SIGNAL RESPONSE (R LOAD = , C LOAD = 1000pF)Time (µs)O u t p u t V o lt a g e (m V )510+50–50Ω∞MAXIMUM V OUT vs I OUT(Negative Swing)–I OUT (mA)V O U T (V )–17.5–15–12.5–10–7.5–5–2.50–2–4–6–8–10–12CMR vs FREQUENCYFrequency (Hz)10C M R (d B )110100908070601001k10k 100kAM, KP, UBMMAXIMUM V OUT vs I OUT(Positive Swing)I OUT (mA)V O U T (V )17.51512.5107.552.5061218243036TYPICAL PERFORMANCE CURVESAt T A = 25°C, V S = ±15V, unless otherwise noted.芯天下--/®INA1055COMMON-MODE INPUT RANGE vs SUPPLY (Difference Amplifier Connected, V OUT = 0)Supply Voltage (V)±3I n p u t R a n g e (V )363024181260±6±9±12±15±18±21POWER SUPPLY REJECTIONvs FREQUENCYFrequency (Hz)1P S R R (d B )140120100806040101001k 10k 100kV–V+TYPICAL PERFORMANCE CURVES (CONT)At T A = 25°C, V S = ±15V, unless otherwise noted.APPLICATION INFORMATIONFigure 1 shows the basic connections required for operation of the INA105. Power supply bypass capacitors should be connected close to the device pins.The differential input signal is connected to pins 2 and 3 as shown. The source impedances connected to the inputs must be nearly equal to assure good common-mode rejection. A 5Ω mismatch in source impedance will degrade the com-mon-mode rejection of a typical device to approximately 80dB. If the source has a known mismatch in source imped-ance, an additional resistor in series with one input can be used to preserve good common-mode rejection.The output is referred to the output reference terminal (pin 1) which is normally grounded. A voltage applied to the Ref terminal will be summed with the output signal. This can be used to null offset voltage as shown in Figure 2. The source impedance of a signal applied to the Ref terminal should be less than 10Ω to maintain good common-mode rejection.Do not interchange pins 1 and 3 or pins 2 and 5, even though nominal resistor values are equal. These resistors are laser trimmed for precise resistor ratios to achieve accurate gain and highest CMR. Interchanging these pins would not pro-vide specified performance.FIGURE 1. Basic Power Supply and Signal Connections.芯天下--/®INA1056FIGURE 2. Offset Adjustment.FIGURE 3. Precision Difference Amplifier.FIGURE 4. Precision Instrumentation Amplifier.FIGURE 5. Current Receiver with Compliance to Rails.芯天下--/®INA1057FIGURE 6. Precision Unity-Gain Inverting Amplifier.FIGURE 7. ±10V Precision Voltage Reference.FIGURE 8. ±5V Precision Voltage Reference.FIGURE 10. Pseudoground Generator.FIGURE 11. Precision Average Value Amplifier.芯天下--/®INA1058FIGURE 15. Precision Bipolar Offsetting.FIGURE 12. Precision (G = 2) Amplifier.FIGURE 16. Precision Summing Amplifier with Gain.FIGURE 13. Precision Summing Amplifier.FIGURE 14. Precision Gain = 1/2 Amplifier.芯天下--/®INA1059FIGURE 17. Instrumentation Amplifier Guard Drive Generator.FIGURE 18. Precision Summing Instrumentation Amplifier.芯天下--/FIGURE 21. Isolating Current Source.®INA10510芯天下--/FIGURE 25. Precision Voltage-Controlled Current Source with Buffered Differential Inputs and Gain.FIGURE 27. Boosting Instrumentation Amplifier Common-Mode Range From ±5 to ±7.5V with 10V Full-Scale Output.FIGURE 28. Precision Absolute Value Buffer.FIGURE 29. Precision 4-20mA Current Transmitter.Addendum-Page 1PACKAGING INFORMATIONOrderable DeviceStatus(1)Package Type PackageDrawingPins Package QtyEco Plan(2)Lead/Ball FinishMSL Peak Temp (3)Samples (Requires Login)INA105AM NRND TO-99LMC 820Green (RoHS & no Sb/Br)AU N / A for Pkg Type Samples Not Available INA105BM NRND TO-99LMC 81Green (RoHS & no Sb/Br)AUN / A for Pkg TypeSamples Not Available INA105KP ACTIVE PDIP P 850Green (RoHS & no Sb/Br)CU NIPDAU N / A for Pkg Type Contact TI Distributor or Sales Office INA105KPG4ACTIVE PDIP P 850Green (RoHS & no Sb/Br)CU NIPDAU N / A for Pkg Type Contact TI Distributor or Sales Office INA105KU ACTIVE SOIC D 875Green (RoHS & no Sb/Br)CU NIPDAU Level-3-260C-168 HR Contact TI Distributor or Sales Office INA105KU/2K5ACTIVE SOIC D 82500Green (RoHS & no Sb/Br)CU NIPDAU Level-3-260C-168 HR Purchase Samples INA105KU/2K5E4ACTIVE SOIC D 82500Green (RoHS & no Sb/Br)CU NIPDAU Level-3-260C-168 HR Purchase Samples INA105KUE4ACTIVESOICD875Green (RoHS & no Sb/Br)CU NIPDAU Level-3-260C-168 HRContact TI Distributor or Sales Office(1)The marketing status values are defined as follows:ACTIVE: Product device recommended for new designs.LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.(2)Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check /productcontent for the latest availability information and additional product content details.TBD: The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)(3)MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.芯天下--/Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.Addendum-Page 2芯天下--/TAPE AND REEL INFORMATION*All dimensions are nominalDevicePackage Type Package Drawing Pins SPQReel Diameter (mm)Reel Width W1(mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant INA105KU/2K5SOICD82500330.012.46.45.22.18.012.0Q1*All dimensions are nominalDevice Package Type Package Drawing Pins SPQ Length(mm)Width(mm)Height(mm)INA105KU/2K5SOIC D8*******.0367.035.0IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,enhancements,improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B.Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All semiconductor products(also referred to herein as“components”)are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its components to the specifications applicable at the time of sale,in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by applicable law,testing of all parameters of each component is not necessarily performed.TI assumes no liability for applications assistance or the design of Buyers’products.Buyers are responsible for their products and applications using TI components.To minimize the risks associated with Buyers’products and applications,Buyers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any patent right,copyright,mask work right,or other intellectual property right relating to any combination,machine,or process in which TI components or services are rmation published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI.Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.TI is not responsible or liable for such altered rmation of third parties may be subject to additional restrictions.Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.Buyer acknowledges and agrees that it is solely responsible for compliance with all legal,regulatory and safety-related requirements concerning its products,and any use of TI components in its applications,notwithstanding any applications-related information or support that may be provided by TI.Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures,monitor failures and their consequences,lessen the likelihood of failures that might cause harm and take appropriate remedial actions.Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications.In some cases,TI components may be promoted specifically to facilitate safety-related applications.With such components,TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements.Nonetheless,such components are subject to these terms.No TI components are authorized for use in FDA Class III(or similar life-critical medical equipment)unless authorized officers of the parties have executed a special agreement specifically governing such use.Only those TI components which TI has specifically designated as military grade or“enhanced plastic”are designed and intended for use in military/aerospace applications or environments.Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk,and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI has specifically designated certain components which meet ISO/TS16949requirements,mainly for automotive ponents which have not been so designated are neither designed nor intended for automotive use;and TI will not be responsible for any failure of such components to meet such requirements.Products ApplicationsAudio /audio Automotive and Transportation /automotiveAmplifiers Communications and Telecom /communicationsData Converters Computers and Peripherals /computersDLP®Products Consumer Electronics /consumer-appsDSP Energy and Lighting /energyClocks and Timers /clocks Industrial /industrialInterface Medical /medicalLogic Security /securityPower Mgmt Space,Avionics and Defense /space-avionics-defense Microcontrollers Video and Imaging /videoRFID OMAP Mobile Processors /omap TI E2E Community Wireless Connectivity /wirelessconnectivityMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2012,Texas Instruments Incorporated。

105SL使用手册

斑马105SL打印机使用手册兴华科仪有限公司<<目录>>一、打印机电源二、打印机结构三、安装标签和色带的注意事项四、面板功能说明五、ZebraXIII打印机的简单调整和参数设置说明六、打印机的日常维护七、常见故障极其处理一、打印机电源电源开关位于打印机后面，打印机的电源是交流电压230V和110V自适应。

安装打印机时，请确保供电电压和打印机的工作电压相符，同时检查供电电源是否接安全地。

按住面板的某些按键，再打开电源开关，即进行特定用途的自检。

[千万注意]在插拔任何连线时，都应该关闭微机和打印机的电源。

否则易损坏打印机和微机的主板!某些外界的影响，如闪电，电源或信号线上的噪声也会使打印机出现误操作。

关掉打印机，再重新打开，可使打印机恢复正常。

二、打印机结构图1图2三、安装标签和色带的注意事项1、安装标签和色带时，按照打印机内的安装指示图即可。

注意：色带安装时，要分清色带的绕向，千万不能装反，否则会损害打印机的组件，安装时须将色带推到底。

ZEBRA打印机只可用外向色带。

标签安装时，要将“标签挡片”和“挡纸片”挡好，标签要从“压纸/反射片”下穿过，标签左侧靠着“导纸片”。

2、安装标签和色带时，注意不要划伤打印头。

比如戒指，工具等物品。

色带及标签勿沾有泥沙，灰尘杂物。

3、当第一次安装新的标签时，请做Media Clibration的工作。

方法如下：装好标签和色带，合上打印头，Power up，此时打印机会先慢速走多张再快速走几张，自动完成对标签长度的识别和存储（对不连续标签有效）。

注意：若走纸时无快慢现象，则说明未测到标签的长度。

请检查标签传感器的位置是否正确。

标签传感器有上下两个，分别位于标签的上下方，上方标签传感器应拔到标签中间部分，而下方标签传感器应随上方标签传感器的变动而变动。

一般来说，上方标签传感器应位于下方标签传感器的二个金色圆头的垂直平分线上，若标签太小，下方标签传感器则应尽量靠左侧。

HLMP-EG26-RU000中文资料

T-13/4 (5 mm) Precision Optical Performance AlInGaP LED LampsData SheetFeatures• Well Defined Spatial Radiation Patterns• Viewing Angles: 6°, 15°, 23°, 30°• High Luminous Output• Colors:590 nm Amber605 nm Orange615 nm Reddish-Orange626 nm Red• High Operating Temperature:T J LED=+130°C• Superior Resistance to Moisture• Package Options:With or Without Lead Stand-OffsBenefits• Viewing Angles Match Traffic Management Sign Requirements• Colors Meet Automotive and Pedestrian Signal Specifications• Superior Performance in Outdoor Environments• Suitable for Autoinsertion onto PC Boards Applications• Traffic Management:Traffic SignalsPedestrian SignalsWork Zone Warning LightsVariable Message Signs• Commercial OutdoorAdvertising:SignsMarquees• Automotive:Exterior and Interior LightsDescriptionThese Precision Optical Perform-ance AlInGaP LEDs providesuperior light output for excellentreadability in sunlight and areextremely reliable. AlInGaP LEDtechnology provides extremelystable light output over longperiods of time. Precision OpticalPerformance lamps utilize thealuminum indium gallium phos-phide (AlInGaP) technology.These LED lamps are untinted,nondiffused, T-13/4 packagesincorporating second generationoptics producing well definedspatial radiation patterns atspecific viewing cone angles.SunPower SeriesHLMP-ELxxHLMP-EJxxHLMP-EHxxHLMP-EGxxThese lamps are made with anadvanced optical grade epoxy,offering superior high tempera-ture and high moisture resistanceperformance in outdoor signaland sign applications. The highmaximum LED junction tempera-ture limit of +130°C enables hightemperature operation in brightsunlight conditions. The packageepoxy contains both uv-a anduv-b inhibitors to reduce theeffects of long term exposure todirect sunlight.These lamps are available in twopackage options to give thedesigner flexibility with devicemounting.Device Selection GuideTypicalViewing Color and Luminous Angle Dominant Lamps Without Standoffs Lamps With Standoffs Intensity Iv (mcd) [1,2] 2θ1/2Wavelength on Leads on Leads@ 20 mA (Deg.)[4](nm), Typ.[3] (Outline Drawing A)(Outline Drawing B)Min.Max.HLMP-EL08-VY000HLMP-EL10-VY000360013800HLMP-EL08-VYK00*360013800HLMP-EL08-VXK00*360010700HLMP-EL08-VX400**360010700HLMP-EL08-VX000360010700HLMP-EL08-WZ000HLMP-EL10-WZ000470018400HLMP-EL08-XZ400**620018400 Amber 590HLMP-EL08-XZ000620018400HLMP-EL08-XZK00*620018400HLMP-EL08-XY000620013800HLMP-EL08-XYK00*620013800HLMP-EL08-X1K00*620024100HLMP-EL08-X1000HLMP-EL10-X1000620024100 6°[5]HLMP-EJ08-WZ000HLMP-EJ10-WZ000470018400 Orange 605HLMP-EJ08-X1000HLMP-EJ10-X1000620024100HLMP-EJ08-Y2000HLMP-EJ10-Y2000800031000HLMP-EH08-UX000HLMP-EH10-UX000275010700HLMP-EH08-VY000HLMP-EH10-VY000360013800 Red-Orange 615HLMP-EH08-WZ000HLMP-EH10-WZ000470018400HLMP-EH08-X1000HLMP-EH10-X1000620024100HLMP-EH08-Y2000HLMP-EH10-Y2000800031000HLMP-EG08-VW00036008300HLMP-EG08-VY000HLMP-EG10-VY000360013800HLMP-EG08-WZ000HLMP-EG10-WZ000470018400 Red 626HLMP-EG08-X1000HLMP-EG10-X1000620024100HLMP-EG08-YZ000800018400HLMP-EG08-Y1000800024100HLMP-EG08-Y2000HLMP-EG10-Y2000800031000 Notes:1. The luminous intensity is measured on the mechanical axis of the lamp package.2.The optical axis is closely aligned with the package mechanical axis.3. The dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the color of the lamp.4. θ1/2 is the off-axis angle where the luminous intensity is one half the on-axis intensity.5.The intensity of narrow viewing angle lamps is measured at the intensity peak.Part numbers in bold are recommended for new designs.*HLMP-xLxx-xxK00 are selected to amber color bins 2 and 4 only.Device Selection Guide (Continued)TypicalViewing Color and Luminous Angle Dominant Lamps Without Standoffs Lamps With Standoffs Intensity Iv (mcd) [1,2] 2θ1/2Wavelength on Leads on Leads@ 20 mA (Deg.)[4](nm), Typ.[3] (Outline Drawing A)(Outline Drawing B)Min.Max.HLMP-EL15-PS000HLMP-EL17-PS0007652900HLMP-EL15-QR00010002200HLMP-EL15-QRK00*10002200HLMP-EL15-QS00010002900 Amber 590HLMP-EL15-QS400**10002900HLMP-EL15-QSK00*10002900HLMP-EL15-QT000HLMP-EL17-QT00010003700 15°HLMP-EL15-QTK00*10003700HLMP-EL15-RU000HLMP-EL17-RU00013004800HLMP-EJ15-PS0007652900 Orange 605HLMP-EJ15-RU000HLMP-EJ17-RU00013004800HLMP-EJ15-SV000HLMP-EJ17-SV00016506300 Red-Orange 615HLMP-EH15-QT000HLMP-EH17-QT00010003700HLMP-EH15-RU000HLMP-EH17-RU00013004800HLMP-EG15-PS0007652900 Red 626HLMP-EG15-QT000HLMP-EG17-QT00010003700HLMP-EG15-RU000HLMP-EG17-RU00013004800HLMP-EL24-MQ0004501730HLMP-EL24-NR000HLMP-EL26-NR0005902200HLMP-EL24-PS000HLMP-EL26-PS0007652900HLMP-EL24-PSK00*7652900HLMP-EL24-PR400**7652200HLMP-EL24-PQK00*7651730 Amber 590HLMP-EL24-QR00010002200HLMP-EL24-QRK00*10002200 23°HLMP-EL24-QS00010002900HLMP-EL24-QSK00*10002900HLMP-EL24-QS400**10002900HLMP-EL24-QT000HLMP-EL26-QT00010003700HLMP-EL24-QTK00*10003700 Notes:1. The luminous intensity is measured on the mechanical axis of the lamp package.2.The optical axis is closely aligned with the package mechanical axis.3. The dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the color of the lamp.4. θ1/2 is the off-axis angle where the luminous intensity is one half the on-axis intensity.5.The intensity of narrow viewing angle lamps is measured at the intensity peak.Device Selection Guide (Continued)TypicalViewing Color and Luminous Angle Dominant Lamps Without Standoffs Lamps With Standoffs Intensity Iv (mcd) [1,2] 2θ1/2Wavelength on Leads on Leads@ 20 mA (Deg.)[4](nm), Typ.[3] (Outline Drawing A)(Outline Drawing B)Min.Max.Orange 605HLMP-EJ24-QT000HLMP-EJ26-QT00010003700HLMP-EJ24-RU000HLMP-EJ26-RU00013004800HLMP-EH26-PS0007652900 Red-Orange 615HLMP-EH24-QT000HLMP-EH26-QT00010003700 23ºHLMP-EH24-RU000HLMP-EH26-RU00013004800HLMP-EG24-PS000HLMP-EG26-PS0007652900 Red 626HLMP-EG24-QT000HLMP-EG26-QT00010003700HLMP-EG24-RU000HLMP-EG26-RU00013004800HLMP-EL30-MQ000HLMP-EL32-MQ0004501730HLMP-EL30-NR000HLMP-EL32-NR0005902200HLMP-EL30-PQ0007651730HLMP-EL30-PQK00*7651730 Amber 590HLMP-EL30-PR0007652200HLMP-EL30-PR400**7652200HLMP-EL30-PRK00*7652200HLMP-EL30-PS000HLMP-EL32-PS0007652900HLMP-EL30-PSK00*7652900 30°HLMP-EJ30-MQ0004501730 Orange 605HLMP-EJ30-NR000HLMP-EJ32-NR0005902200HLMP-EJ30-PS000HLMP-EJ32-PS0007652900HLMP-EH30-MQ000HLMP-EH32-MQ0004501730 Red-Orange 615HLMP-EH30-NR000HLMP-EH32-NR0005902200HLMP-EH30-PS000HLMP-EH32-PS0007652900HLMP-EG30-KN0002701010HLMP-EG30-MQ000HLMP-EG32-MQ0004501730HLMP-EG30-NQ0005901730HLMP-EG30-NR000HLMP-EG32-NR0005902200 Red 626HLMP-EG30-PQ0007651730HLMP-EG30-PR0007652200HLMP-EG30-PS000HLMP-EG32-PS0007652900 Notes:1. The luminous intensity is measured on the mechanical axis of the lamp package.2.The optical axis is closely aligned with the package mechanical axis.3. The dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the color of the lamp.4. θ1/2 is the off-axis angle where the luminous intensity is one half the on-axis intensity.5.The intensity of narrow viewing angle lamps is measured at the intensity peak.Part Numbering SystemHLMP-x x xx-x x x xxMechanical Options00: Bulk PackagingDD: Ammo PackYY: Flexi-Bin; Bulk PackagingZZ: Flexi-Bin; Ammo PackColor Bin Selections0: No color bin limitation4: Amber color bin 4 onlyK: Amber color bins 2 and 4 onlyMaximum Intensity Bin0: No Iv bin limitationMinimum Intensity BinViewing Angle & Lead Stand Offs08: 6 deg without lead stand offs10: 6 deg with lead stand offs15: 15 deg without lead stand offs17: 15 deg with lead stand offs24: 23 deg without lead stand offs26: 23 deg with lead stand offs30: 30 deg without lead stand offs32: 30 deg with lead stand offsColorG: 626 nm RedH: 615 nm Red-OrangeJ: 605 nm OrangeL: 590 nm AmberPackageE: 5 mm RoundNOTES:1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).2. LEADS ARE MILD STEEL, SOLDER DIPPED.3. TAPERS SHOWN AT TOP OF LEADS (BOTTOM OF LAMP PACKAGE) INDICATE AN EPOXY MENISCUS THAT MAY EXTEND ABOUT 1 mm (0.040 in.) DOWN THE LEADS.4. RECOMMENDED PC BOARD HOLE DIAMETERS:• LAMP PACKAGE A WITHOUT STAND-OFFS: FLUSH MOUNTING AT BASE OF LAMP PACKAGE = 1.143/1.067 (0.044/0.042).• LAMP PACKAGE B WITH STAND-OFFS: MOUNTING AT LEAD STAND-OFFS = 0.965/0.889 (0.038/0.035).5. FOR DOME HEIGHTS ABOVE LEAD STAND-OFF SEATING PLANE, d, LAMP PACKAGE B, SEE TABLE.BPackage DimensionsA(0.039)(0.039)PART NO.d HLMP-XX1012.37 ± 0.25 (0.487 ± 0.010)HLMP-XX1712.42 ± 0.25 (0.489 ± 0.010)HLMP-XX2612.52 ± 0.25 (0.493 ± 0.010)HLMP-XX3211.96 ± 0.25 (0.471 ± 0.010)Electrical/Optical Characteristics at T A = 25°CParameter SymbolMin.Typ.Max.UnitsTest Conditions Forward VoltageI F = 20 mAAmber (λd = 590 nm) 2.02Orange (λd = 605 nm)V F 1.98 2.4VRed-Orange (λd = 615 nm) 1.94Red (λd = 626 nm) 1.90Reverse Voltage V R 520VI F = 100 µAPeak Wavelength:Peak of Wavelength of Amber (λd = 590 nm)592Spectral Distribution Orange (λd = 605 nm)λPEAK 609nmat I F = 20 mARed-Orange (λd = 615 nm)621Red (λd = 626 nm)635Spectral Halfwidth∆λ1/217nmWavelength Width at Spectral Distribution 1/2 Power Point at I F = 20 mASpeed of Response τs 20ns Exponential Time Constant, e -t/τCapacitanceC 40pF V F = 0, f = 1 MHzThermal Resistance R θJ-PIN240°C/WLED Junction-to-Cathode LeadLuminous Efficacy [1]Emitted LuminousAmber (λd = 590 nm)480Power/Emitted Radiant Orange (λd = 605 nm)ηv370lm/WPowerRed-Orange (λd = 615 nm)260Red (λd = 626 nm)150Note:Absolute Maximum Ratings at T A = 25°CDC Forward Current [1,2,3]............................................................50 mA Peak Pulsed Forward Current [2,3]..............................................100 mA Average Forward Current [3].........................................................30 mA Reverse Voltage (I R = 100 µA).........................................................5 V LED Junction Temperature..........................................................130°C Operating Temperature ..............................................-40°C to +100°C Storage Temperature ..................................................-40°C to +120°C Dip/Drag Soldering Temperature...........................260°C for 6 seconds Through-the-Wave Preheat Temperature......................................145°C Through-the-Wave Solder Temperature.................245°C for 3 seconds [1.59 mm (0.060 in.) below seating plane]Notes:1. Derate linearly as shown in Figure 4.2. For long term performance with minimal light output degradation, drive currentsbetween 10 mA and 30 mA are recommended. For more information on recommended drive conditions, please refer to Application Brief I-024 (5966-3087E).3. Operating at currents below 1 mA is not recommended. Please contact your local representative for further information.sFigure 2. Forward Current vs.Forward Voltage.Figure 3. Relative Luminous Intensity vs. Forward Current.Figure 4. Maximum Forward Current vs. Ambient Temperature. Derating Based on T JMAX = 130°C.Figure 1. Relative Intensity vs. Peak Wavelength.I F – F O R W A R D C U R R E N T – m AT A – AMBIENT TEMPERATURE – °CR E L A T I V E I N T E N S I T Y – %1000θ – ANGULAR DISPLACEMENT – DEGREES8060507020-20-15103040-1051015202590-25-5WAVELENGTH – nmR E L A T I V E I N T E N S I T YR E L A T I V E L U M I N O U S I N T E N S I T Y (N O R M A L I Z E D A T 20 m A )00I F – DC FORWARD CURRENT – mA 403.02.01.51.00.520602.5C U R R E NT – m AV F – FORWARD VOLTAGE – VBin Name Min.Max.K 310400L 400520M 520680N680880P 8801150Q 11501500R 15001900S 19002500T 25003200U 32004200V 42005500W 55007200X 72009300Y 930012000Z 12000160001160002100022100027000Intensity Bin Limits (mcd at 20 mA)Tolerance for each bin limit is ± 15%.Bin Name Min.Max.1584.5587.02587.0589.54589.5592.06592.0594.5Amber Color Bin Limits (nm at 20 mA)Tolerance for each bin limit is ± 0.5 nm.Note:1.Bin categories are established for classification of products. Products Figure 7. Representative Spatial Radiation Pattern for 23° Viewing Angle Lamps.R E L A T I V E I N T E N S I T Y – %1000θ – ANGULAR DISPLACEMENT – DEGREES806050702010304090-20-15-10510152025-25-5R E L A T I V E I N T E N S I T Y – %1000θ – ANGULAR DISPLACEMENT – DEGREES806050702010304090-20-15-10510152025-25-5R E L A T I V E I N T E N S I T Y – %1000θ – ANGULAR DISPLACEMENT – DEGREES806050702010304090-20-15-10510152025-25-5Figure 6. Representative Spatial Radiation Pattern for 15° Viewing Angle Lamps.Data subject to change.Copyright © 2001 Agilent Technologies, Inc. August 13, 2001。

HLMP-K105-JM000中文资料

AgilentT-13/4 (5 mm), T-1 (3 mm),High Intensity, Double Heterojunction AlGaAs Red LED LampsData SheetHLMP-D101/D105, HLMP-K101/K105DescriptionThese solid state LED lamps utilize newly developed doubleheterojunction (DH) AlGaAs/GaAs material technology. This LED material has outstanding lightoutput efficiency over a wide rangeFeatures• Exceptional brightness • Wide viewing angle• Outstanding material efficiency • Low forward voltage • CMOS/MOS compatible • TTL compatible • Deep red colorApplications• Bright ambient lighting conditions • Moving message panels • Portable equipment • General useof drive currents. The color is deep red at the dominantwavelength of 637 nanometres.These lamps may be DC or pulse driven to achieve desired light output.Package DimensionsA B CSelection GuideLuminous IntensityIv (mcd) at 20 mA2θ1/2[1]Package Package Description Device HLMP-Min.Typ.Max.Degree Outline T-1 3/4 Red Tinted Diffused D10135.270.0–65AD101-J00xx35.270.0–65AD101-JK0xx35.270.0112.865AT-1 3/4 Red Untinted Non-diffused D105138.0240.0–24BD105-M00xx138.0240.0–24BD105-NO0xx200.0290.0580.024BT-1 Red Tinted Diffused K10122.045.0–60CK101-100xx22.045.0–60CK101-IJ0xx22.045.070.460CT-1 Red Untinted Non-diffused K10535.265.0–45CK105-J00xx35.265.0–45CK105-KL0xx56.4110.0180.445CNote:1. θ1/2 is the off axis angle from lamp centerline where the luminous intensity is 1/2 the on-axis value.Part Numbering SystemHLMP - x x xx - x x x xxMechanical Option00: Bulk01: Tape & Reel, Crimped Leads02: Tape & Reel, Straight LeadsA1: Right Angle Housing, Uneven Leads, T1A2: Right Angle Housing, Even Leads, T1B1: Right Angle Housing, Uneven Leads, T-1 3/4B2: Right Angle Housing, Even Leads, T-1 3/4DD, UQ: Ammo PackColor Bin Options0: Full Color Bin DistributionMaximum Iv Bin Options0: Open (no max. limit)Others: Please refer to the Iv Bin TableMinimum Iv Bin OptionsPlease refer to the Iv Bin TableLens Type01: Tinted, Diffused05: Untinted, NondiffusedColor Options1: AlGaAs RedPackage OptionsD: T-1 3/4K: T-1Absolute Maximum Ratings at T A = 25°CParameter ValuePeak Forward Current[1,2]300 mAAverage Forward Current[2]20 mADC Current[3]30 mAPower Dissipation87 mWReverse Voltage (I R = 100 µA) 5 VTransient Forward Current (10 µs Pulse)[4]500 mALED Junction Temperature110°COperating Temperature Range-20 to +100°C Storage Temperature Range-55 to +100°C Wave Soldering Temperature [1.59 mm (0.063 in.) from body]250°C for 3 seconds Lead Solder Dipping Temperature [1.59 mm (0.063 in.) from body]260°C for 5 seconds Notes:1.Maximum I PEAK at f = 1 kHz, DF = 6.7%.2.Refer to Figure 6 to establish pulsed operating conditions.3.Derate linearly as shown in Figure 5.4.The transient peak current is the maximum non-recurring peak current the device can withstand without damaging the LED die and wire bonds. It isnot recommended that the device be operated at peak currents beyond the Absolute Maximum Peak Forward Current.Electrical/Optical Characteristics at T A = 25°CSymbol Description Min.Typ.Max.Unit Test ConditionV F Forward Voltage 1.8 2.2V I F = 20 mAV R Reverse Breakdown Voltage 5.015.0V I R = 100 µAλp Peak Wavelength645nm Measurement at Peakλd Dominant Wavelength637nm Note 1∆λ1/2Spectral Line Halfwidth20nmτS Speed of Response30ns Exponential TimeConstant, e-t/T SC Capacitance30pF V F = 0, f = 1 MHzRθJ-PIN Thermal Resistance260[3]°C/W Junction to Cathode Lead210[4]290[5]ηV Luminous Efficacy80Im/W Note 2Notes:1.The dominant wavelength, λd, is derived from the CIE chromaticity diagram and represents the color of the device.2.The radiant intensity, I e, in watts per steradian, may be found from the equation I e = l V/ηV, where I V is the luminous intensity in candelas and ηV isluminous efficacy in lumens/watt.3.HLMP-D101.4.HLMP-D105.5.HLMP-K101/-K105.Figure 3. Relative luminous intensity vs. dc forward current.Figure 4. Relative efficiency vs. peak forward current.Figure 7. Relative luminous intensity vs. angular displacement. HLMP-D101.Figure 8. Relative luminous intensity vs. angular displacement. HLMP-K101.Intensity Bin LimitsIntensity Range (mcd)Color Bin Min.Max.Red I24.839.6J39.663.4K63.4101.5L101.5162.4M162.4234.6N234.6340.0O340.0540.0P540.0850.0Q850.01200.0R1200.01700.0S1700.02400.0T2400.03400.0U3400.04900.0V4900.07100.0W7100.010200.0X10200.014800.0Y14800.021400.0Z21400.030900.0Maximum tolerance for each bin limit is ± 18%.Mechanical Option MatrixMechanical Option Code Definition00Bulk Packaging, minimum increment 500 pcs/bag01Tape & Reel, crimped leads, minimum increment 1300 pcs (T-1 3/4)/1800 pcs (T-1) 02Tape & Reel, straight leads, minimum increment 1300 pcs (T-1 3/4)/1800 pcs (T-1) A1Right Angle Housing, uneven leads, minimum increment 500 pcs/bagA2Right Angle Housing, even leads, minimum increment 500 pcs/bagB1Right Angle Housing, uneven leads, minimum increment 500 pcs/bagB2Right Angle Housing, even leads, minimum increment 500 pcs/bagDD Ammo Pack, straight leads in 2K incrementUQ Ammo Pack, horizontal leads in 2K incrementNote:All categories are established for classification of products. Products may not be available in all categories. Please contact your local Agilent representative for further clarification/information./semiconductors For product information and a complete list of distributors, please go to our web site.For technical assistance call:Americas/Canada: +1 (800) 235-0312 or (916) 788-6763Europe: +49 (0) 6441 92460China: 10800 650 0017Hong Kong: (+65) 6756 2394India, Australia, New Zealand: (+65) 6755 1939 Japan: (+81 3) 3335-8152 (Domestic/Interna-tional), or 0120-61-1280 (Domestic Only) Korea: (+65) 6755 1989Singapore, Malaysia, Vietnam, Thailand, Philippines, Indonesia: (+65) 6755 2044 Taiwan: (+65) 6755 1843Data subject to change.Copyright © 2004 Agilent Technologies, Inc. Obsoletes 5968-1440ENovember 12, 20045988-2230EN。

郎汉德PLC产品说明书

郎汉德PLC产品说明书LonHand-PLC文件版本：V1.0.2目录1.产品简介 (3)1.1产品概述 (3)1.2功能特点 (3)2.参数详情 (4)2.1电气参数 (4)2.2编程电缆参数 (5)2.3选型表 (6)2.4引脚定义 (8)2.4.1LH-M1410T(晶体管输出) (8)2.4.2LH-M1616T(晶体管输出) (9)2.4.3LH-M0808T(晶体管输出) (9)2.4.4LH-M1408R(继电器输出) (10)2.4.5LH-M0808R(继电器输出) (11)2.5PLC地址 (12)2.5.1PLC地址使用情况 (12)2.5.2特殊寄存器和位 (14)2.6模拟量转换 (18)2.7兼容三菱指令 (19)3.通信使用 (24)3.1串口通信配置 (24)3.2RS485通讯示例 (25)3.2.1PLC作为3U协议从站 (25)3.2.2PLC作为Modbus从站 (25)3.2.3PLC平时作为Modbus从站，临时切到3U下程序 (27)3.3自由通信协议ADPRW (28)3.3.1串口自由通信协议ADPRW指令使用 (28)3.3.2Modbus主站通信协议ADPRW指令使用 (30)4.售后 (32)5.更新历史 (32)1.产品简介1.1产品概述本PLC尺寸小巧，接口丰富，扩展性强，支持3U编程风格。

广泛应用于工业自动化领域。

1.2功能特点●极具有成本优势的高端PLC，支持3U编程风格；●外观紧凑，极省空间；可拔插压接端子，便于维护和调试；●直流供电，电源与外部隔离；●所有通讯口均隔离；●支持扩展，最大15个；●输出可支持NPN晶体管，继电器；●具有混合型主机以及混合型扩展模块，可有效节省模块数量；●最大编程步16K2.参数详情PLC 主机模块和PLC扩展模块的外观尺寸一致，如下图：2.1电气参数类别项目参数电气环境供电电源额定24V,12-32V 宽压输入范围;内部与外供电电气隔离工作温度-20~55°C湿度5%-95%RH (非结露)抗干扰性峰值:1500vp-p;幅度1uS;上升时间:30ms ;周期30-100HZ 抗震动符合IEC61121-2标准电气隔离性能通讯隔离性通讯口均与内部隔离电源隔离性内部5V、15V 之间隔离;与24V 输入隔离数字量量输入导通状态高于DC 15V,2.5mA 关断状态低于DC 7V,1mA晶体管输出响应时间ON->OFF20us以内OFF->ON50us以内输出电压范围DC5V~30V额定输出负载0.75A@DC24V继电器输出响应时间10ms以内输出电压范围DC5V-30或AC5V~250V 额定输出电压DC24V/2A或AC220V/2.0A 使用寿命机械1千万次电气10万次（额定负载）模拟量输出输出范围电压输出0~10V 电流输出0~20mA模拟量输入输入范围电流输入0-20mA或4-20mA 电压输入0-10V运动控制脉冲输出速度可达200KHZ 计数输入速度可200K以上2.2编程电缆参数本PLC对应的编程口为RS232通信。

MPU9250资料_功耗_数据手册

MPU-9250 Product Specification Revision1.1Page1of42CONTENTS1DOCUMENT INFORMATION (4)1.1R EVISION H ISTORY (4)1.2P URPOSE AND S COPE (5)1.3P RODUCT O VERVIEW (5)1.4A PPLICATIONS (5)2FEATURES (6)2.1G YROSCOPE F EATURES (6)2.2A CCELEROMETER F EATURES (6)2.3M AGNETOMETER F EATURES (6)2.4A DDITIONAL F EATURES (6)2.5M OTION P ROCESSING (7)3ELECTRICAL CHARACTERISTICS (8)3.1G YROSCOPE S PECIFICATIONS (8)3.2A CCELEROMETER S PECIFICATIONS (9)3.3M AGNETOMETER S PECIFICATIONS (10)3.4E LECTRICAL S PECIFICATIONS (11)3.5I2C T IMING C HARACTERIZATION (15)3.6SPI T IMING C HARACTERIZATION (16)3.7A BSOLUTE M AXIMUM R ATINGS (18)4APPLICATIONS INFORMATION (19)4.1P IN O UT AND S IGNAL D ESCRIPTION (19)4.2T YPICAL O PERATING C IRCUIT (20)4.3B ILL OF M ATERIALS FOR E XTERNAL C OMPONENTS (20)4.4B LOCK D IAGRAM (21)4.5O VERVIEW (22)4.6T HREE-A XIS MEMS G YROSCOPE WITH16-BIT ADC S AND S IGNAL C ONDITIONING (22)4.7T HREE-A XIS MEMS A CCELEROMETER WITH16-BIT ADC S AND S IGNAL C ONDITIONING (22)4.8T HREE-A XIS MEMS M AGNETOMETER WITH16-BIT ADC S AND S IGNAL C ONDITIONING (22)4.9D IGITAL M OTION P ROCESSOR (22)4.10P RIMARY I2C AND SPI S ERIAL C OMMUNICATIONS I NTERFACES (23)4.11A UXILIARY I2C S ERIAL I NTERFACE (23)4.12S ELF-T EST (24)4.13MPU-9250S OLUTION U SING I2C I NTERFACE (25)4.14MPU-9250S OLUTION U SING SPI I NTERFACE (26)4.15C LOCKING (26)4.16S ENSOR D ATA R EGISTERS (27)4.17FIFO (27)4.18I NTERRUPTS (27)4.19D IGITAL-O UTPUT T EMPERATURE S ENSOR (27)4.20B IAS AND LDO (28)4.21C HARGE P UMP (28)4.22S TANDARD P OWER M ODE (28)4.23P OWER S EQUENCING R EQUIREMENTS AND P OWER ON R ESET (28)5ADVANCED HARDWARE FEATURES (29)6PROGRAMMABLE INTERRUPTS (30)6.1W AKE-ON-M OTION I NTERRUPT (30)7DIGITAL INTERFACE (32)7.1I2C AND SPI S ERIAL I NTERFACES (32)7.2I2C I NTERFACE (32)7.3I2C C OMMUNICATIONS P ROTOCOL (32)7.4I2C T ERMS (35)7.5SPI I NTERFACE (36)8SERIAL INTERFACE CONSIDERATIONS (37)8.1MPU-9250S UPPORTED I NTERFACES (37)9ASSEMBLY (38)9.1O RIENTATION OF A XES (38)9.2P ACKAGE D IMENSIONS (38)10PART NUMBER PACKAGE MARKING (40)11RELIABILITY (41)11.1Q UALIFICATION T EST P OLICY (41)11.2Q UALIFICATION T EST P LAN (41)12REFERENCE (42)1Document Information 1.1Revision History1.2Purpose and ScopeThis document provides a description,specifications,and design related information on the MPU-9250 MotionTracking device.The device is housed in a small3x3x1mm QFN package.Specifications are subject to change without notice.Final specifications will be updated based upon characterization of production silicon.For references to register map and descriptions of individual registers, please refer to the MPU-9250Register Map and Register Descriptions document.1.3Product OverviewMPU-9250is a multi-chip module(MCM)consisting of two dies integrated into a single QFN package.One die houses the3-Axis gyroscope and the3-Axis accelerometer.The other die houses the AK89633-Axis magnetometer from Asahi Kasei Microdevices Corporation.Hence,the MPU-9250is a9-axis MotionTracking device that combines a3-axis gyroscope,3-axis accelerometer,3-axis magnetometer and a Digital Motion Processor™(DMP)all in a small3x3x1mm package available as a pin-compatible upgrade from the MPU-6515.With its dedicated I2C sensor bus,the MPU-9250directly provides complete9-axis MotionFusion™output.The MPU-9250MotionTracking device,with its9-axis integration,on-chip MotionFusion™,and run-time calibration firmware,enables manufacturers to eliminate the costly and complex selection,qualification,and system level integration of discrete devices,guaranteeing optimal motion performance for consumers. MPU-9250is also designed to interface with multiple non-inertial digital sensors,such as pressure sensors,on its auxiliary I2C port.MPU-9250features three16-bit analog-to-digital converters(ADCs)for digitizing the gyroscope outputs,three 16-bit ADCs for digitizing the accelerometer outputs,and three16-bit ADCs for digitizing the magnetometer outputs.For precision tracking of both fast and slow motions,the parts feature a user-programmable gyroscope full-scale range of±250,±500,±1000,and±2000°/sec(dps),a user-programmable accelerometer full-scale range of±2g,±4g,±8g,and±16g,and a magnetometer full-scale range of±4800µT.Other industry-leading features include programmable digital filters,a precision clock with1%drift from-40°Cto85°C,an embedded temperature sensor,and programmable interrupts.The device features I2C and SPI serial interfaces,a VDD operating range of2.4V to3.6V,and a separate digital IO supply,VDDIO from1.71Vto VDD.Communication with all registers of the device is performed using either I2C at400kHz or SPI at1MHz.For applications requiring faster communications,the sensor and interrupt registers may be read using SPI at 20MHz.By leveraging its patented and volume-proven CMOS-MEMS fabrication platform,which integrates MEMS wafers with companion CMOS electronics through wafer-level bonding,InvenSense has driven the package size down to a footprint and thickness of3x3x1mm,to provide a very small yet high performance low cost package.The device provides high robustness by supporting10,000g shock reliability.1.4Applications∙Location based services,points of interest,and dead reckoning∙Handset and portable gaming∙Motion-based game controllers∙3D remote controls for Internet connected DTVs and set top boxes,3D mice∙Wearable sensors for health,fitness and sports2Features2.1Gyroscope FeaturesThe triple-axis MEMS gyroscope in the MPU-9250includes a wide range of features:∙Digital-output X-,Y-,and Z-Axis angular rate sensors(gyroscopes)with a user-programmable full-scale range of±250,±500,±1000,and±2000°/sec and integrated16-bit ADCs∙Digitally-programmable low-pass filter∙Gyroscope operating current:3.2mA∙Sleep mode current:8µA∙Factory calibrated sensitivity scale factor∙Self-test2.2Accelerometer FeaturesThe triple-axis MEMS accelerometer in MPU-9250includes a wide range of features:∙Digital-output triple-axis accelerometer with a programmable full scale range of±2g,±4g,±8g and ±16g and integrated16-bit ADCs∙Accelerometer normal operating current:450µA∙Low power accelerometer mode current:8.4µA at0.98Hz,19.8µA at31.25Hz∙Sleep mode current:8µA∙User-programmable interrupts∙Wake-on-motion interrupt for low power operation of applications processor∙Self-test2.3Magnetometer FeaturesThe triple-axis MEMS magnetometer in MPU-9250includes a wide range of features:∙3-axis silicon monolithic Hall-effect magnetic sensor with magnetic concentrator∙Wide dynamic measurement range and high resolution with lower current consumption.∙Output data resolution of14bit(0.6µT/LSB)∙Full scale measurement range is±4800µT∙Magnetometer normal operating current:280µA at8Hz repetition rate∙Self-test function with internal magnetic source to confirm magnetic sensor operation on end products2.4Additional FeaturesThe MPU-9250includes the following additional features:∙Auxiliary master I2C bus for reading data from external sensors(e.g.pressure sensor)∙ 3.5mA operating current when all9motion sensing axes and the DMP are enabled∙VDD supply voltage range of2.4–3.6V∙VDDIO reference voltage for auxiliary I2C devices∙Smallest and thinnest QFN package for portable devices:3x3x1mm∙Minimal cross-axis sensitivity between the accelerometer,gyroscope and magnetometer axes∙512byte FIFO buffer enables the applications processor to read the data in bursts∙Digital-output temperature sensor∙User-programmable digital filters for gyroscope,accelerometer,and temp sensor∙10,000g shock tolerant∙400kHz Fast Mode I2C for communicating with all registers∙1MHz SPI serial interface for communicating with all registers∙20MHz SPI serial interface for reading sensor and interrupt registers∙MEMS structure hermetically sealed and bonded at wafer level∙RoHS and Green compliant2.5MotionProcessing∙Internal Digital Motion Processing™(DMP™)engine supports advanced MotionProcessing and low power functions such as gesture recognition using programmable interrupts∙Low-power pedometer functionality allows the host processor to sleep while the DMP maintains the step count.3Electrical Characteristics3.1Gyroscope SpecificationsTypical Operating Circuit of section4.2,VDD=2.5V,VDDIO=2.5V,T A=25°C,unless otherwise noted.Table1Gyroscope Specifications3.2Accelerometer SpecificationsTypical Operating Circuit of section4.2,VDD=2.5V,VDDIO=2.5V,T A=25°C,unless otherwise noted.Table2Accelerometer Specifications3.3Magnetometer SpecificationsTypical Operating Circuit of section4.2,VDD=2.5V,VDDIO=2.5V,T A=25°C,unless otherwise noted.3.4Electrical Specifications3.4.1 D.C.Electrical CharacteristicsTypical Operating Circuit of section4.2,VDD=2.5V,VDDIO=2.5V,T A=25°C,unless otherwise noted.Table3D.C.Electrical CharacteristicsNotes:1.Accelerometer Low Power Mode supports the following output data rates(ODRs):0.24,0.49,0.98,1.95,3.91,7.81,15.63,31.25,62.50,125,250,500Hz.Supply current for any update rate can becalculated as:Supply Current inµA=Sleep Current+Update Rate*0.3763.4.2 A.C.Electrical CharacteristicsTypical Operating Circuit of section4.2,VDD=2.5V,VDDIO=2.5V,T A=25°C,unless otherwise noted.Table4A.C.Electrical Characteristics3.4.3Other Electrical SpecificationsTypical Operating Circuit of section4.2,VDD=2.5V,VDDIO=2.5V,T A=25°C,unless otherwise noted.Table5Other Electrical Specifications万联芯城-电子元器件采购网，专为用户提供电子元器件配单服务，只需提交物料清单，即可获得报价，整单付款有优惠，价格明显看得见，满足客户物料需求，解决客户采购烦恼，为客户节省采购成本，点击查看完整版PDF数据手册：MPU9250。

MSOP10中文资料

High EfficiencyWhite LED DriverMonolithic Power SystemsGeneral DescriptionThe MP1521 is a constant-current Boost Regulator. This IC has three individual current-sensing feedbacks, which are ideal for driving multiple strings of series connected LEDs. The OLS pin is designed for detecting loose or open LED connections.The IC uses a peak current, constant minimum off-time architecture. The feedback pins measure voltage across sense resistors in series with the LED strings. When supplying a bias current of 20mA, the voltage drop across the sense resistor is only 0.4V to minimize power loss. Either a DC voltage or a PWM signal at the BRT/PWM input can control the LED brightness.The MP1521 has an on board power MOSFET switch that is protected by current limit, open load shutdown, thermal shutdown, and under voltage lockout .Ordering InformationPart Number ∗ Package TemperatureMP1521EK MSOP10 -20° to +85°C MP1521EQ QFN16 (3x3) -20° to +85°C EV0005 MP1521EK Evaluation Board EV0021MP1521EQ Evaluation Board∗ For Tape & Reel, add suffix –Z (i.e., MP1521EK–Z) For Lead Free, add suffix –LF (i.e., MP1521EK–LF–Z)FeaturesOn Board Power MOSFETDrive 9 White LEDs from 2.7V Input Drive 15 White LEDs from 5V Input Up to 90% EfficiencyOver 80mA Output Current Capacity Open Load ShutdownLow Current Sensing Feedback Voltage Up to 3 String Current Sensing Feedback Analog and Digital PWM Brightness Control UVLO, Thermal Shutdown Soft StartInternal Current LimitAvailable in Compact MSOP10 and Tiny 3 mm x 3 mm QFN16 Package Evaluation Boards AvailableApplicationsHandheld Computers, Cell phones, PDAs,Digital and Video Cameras, Small LCD DisplaysLi Ion and NiMH Battery ApplicationsTypical Application Circuit (One String of Six (6) LEDs)Efficiency vs LED current, 1 string of 6 Using Toko D62CB 47µH Inductor5060708090100510152025LED Current (mA )E f f i c i e n c y (%)High EfficiencyWhite LED Driver Monolithic Power SystemsAbsolute Maximum Ratings Supply Voltage (V IN ) 28V Switch Voltage to GND -0.5V to 28VV EN , V REF , V BRT , V FB1, V FB2, V FB3 –0.3V to 6V Storage Temperature -55°C to +150°CRecommended Operating ConditionsSupply Voltage (V IN ) 2.7V to 25VOperating Temperature -20°C to +85°C Switch Voltage to GND -0.5V to 25VPackage Thermal CharacteristicsThermal Resistance, ΘJA (MSOP10) 150°C/WThermal Resistance, ΘJA (QFN16) 60°C/W Electrical Characteristics (V IN = 5.0V, T A = 25°C unless specified otherwise)Parameters Symbol Condition Min Typ Max Units Supply Current (shutdown)I IN (OFF) V EN <0.4V 1 3 µA Supply Current (quiescent) I IN (ON) V EN >1.5V, V BRT =0V, V FB =0V 550 700 µA Minimum Off Time, normal operationt OFF (NORMAL) V EN >1.5V, V BRT =0.6VV FB =0400 500 700 nSMinimum Off Time, start-up (Note 1) t OFF (START) V EN >1.5V, V BRT =0.6V,V FB =0V1.52.4 µSUVLOV IN RISING 2.1 2.6 V Under Voltage Lockout V IN FALLING1.92.4 VEnableThreshold 0.8 1.0 2.0 V Hysterisis 60 mV Leakage CurrentV EN =3V 1 µA Open Load Shutdown Threshold Measured at OLS Pin 26 29 V V OLS =15V 1 µALeakage CurrentV OLS =25V 45 70 µAReferenceOutput Voltage I REF =0A 1.20 1.235 1.27 V Load Regulation I REF =0 to 100µA 2.5 5 mV Line Regulation V IN =3 to 15V, I REF =0A 2.5 5 mV Feedback ComparatorThreshold V BRT =1.2V 380 400 420 mV Hysterisis (Note 2) V BRT = 1.2V 30 mV FB Input Bias Current V FB =0.2V -150 -50 0 nA PWM ModeOutput-Off Threshold 0.18 0.26 V BRT Input Bias V BRT =0.6V -100 -30 0 nA BRT Full Scale Threshold(Note 3)1.2 VOutput SwitchSwitch On Resistance (Note 2) R ON V IN =5.0V 0.5 0.6 Ω Switch Current Limit 300 400 mA Leakage Current V SW =25V 5 µA Thermal Shutdown (Note 2) 160 °CNotes:1) First 64 pulses after EN switches high. 2) Guaranteed by design.3) The output current is off when BRT is driven below the output-off threshold and full-scale when driven above the full-scale threshold. To PWM the output drive BRT above and below these thresholds.Monolithic Power SystemsPin DescriptionMSOP10 QFN16Part Marking: MP1521EK Part Marking: A1xxTable 1: MP1521 MSOP10 and QFN16 Pin AssignmentsMSOP Pin # QFN Pin# PinName Pin Function 1 16 IN Input supply pin. It can be connected to the regulator’s input supply, or to theoutput for boot-strapped operation (boot-strapped operation is required for V IN ofless than 3V). 2 2 ENRegulator On/Off control input. Logic high (V EN >1V) turns on IC, logic low puts itinto low current shutdown mode. Place a 100K Ω resistor in series with EN if it is connected to a voltage greater than 10V.3 4 REF 1.23V reference used for setting the analog control voltage at BRT input. Thisreference can supply up to 200µA to an external load. Do not connect any bypass capacitors to this pin. It is internally compensated.4 5 BRT Analog or PWM input for controlling LED brightness. When used in analogmode, apply a DC voltage of 0.3 to 1.2V. This input voltage is attenuated by 1/3 to set the voltage across sense resistors at FB1, FB2, and FB3. Maximum brightness (20mA) occurs with 1.2V applied. To control brightness in PWM mode, apply a PWM square wave with a minimum voltage less the 0.18V and a maximum greater than 1.2V. When a voltage less than 0.18V is applied to this pin, the output switch is turned off. The regulator operates at maximum brightness when more than 1.2V is applied. The frequency of the PWM signal must be between 100 to 400 Hz.5 6 7 7 8 9 FB3 FB2 FB1 Feedback input for measuring voltage across current-sense resistor that is in series with LED string. Unused feedback pins must be connected to any used feedback pin. 8 10 OLS Open Load Shutdown pin senses regulator output voltage to protect IC duringopen load operation. When this pin’s voltage exceeds 28V, the output switch is shut off. The output switch remains off until the IC is reset by cycling the enable pin (EN) or input supply (IN) pin.9 11, 12 GND Signal and power ground. Connect directly to ground plane. 10 14 SW Output switch pin, power DMOS low-side switch. - 1, 3, 6,13, 15N/C No Connect SW GND OLS FB1 FB2REF NC EN NC REFGND GND OLS FB1B R TN CF B 3F B 2I NN CS WN CMonolithic Power Systems Figure 2: MP1521 Functional Block DiagramMonolithic Power Systems Functional DescriptionOperationThe MP1521 utilizes a constant off-time control scheme (Refer to the Block Diagram). For maximum brightness, the BRT pin is biased at or above 1.2V. Its voltage is routed through the unity gain buffer whose the output of is clamped at 1.2V. A 20K/10K divider from the Buffer to the non-inverting input of the Feedback comparator divides the BRT voltage by three to set the current sense threshold. If any of the feedback pins FB1, FB2, or FB3 is lower than this threshold the Power FET is turned on. The Power MOSFET and inductor current increases until the current limit comparator trips at 0.5A turning off the MOSFET for 500ns. At the end of 500ns if any of the Feedback pins are still lower than the current sense threshold. The Power FET is again turned on. This cycle repeats itself until all three of the feedback pins exceed the threshold.Analog Brightness AdjustAnalog Brightness Adjust is accomplished by applying a voltage between 0.26V to 1.2V on the BRT pin. The 1.23V REF output can be used to bias a potentiometer whose wiper drives the BRT pin. PWM/ Brightness AdjustPWM Brightness Adjust is accomplishedby driving the BRT pin with a square wave whose low voltage is below 0.2V and whose high voltage is greater than 1.2V. A voltage below 0.2V forces the Power MOSFET off. A voltage greater than 1.2V will cause all three feedback pins to regulate at or above 0.4VOpen Load Shut-OffOpen Load Shut-Off is implemented by connecting the OLS pin to V OUT. In the fault condition where the connection to the LED’s is open, V OUT will rise up, as all the feedback pins are absent of voltage. Once V OUT exceeds 28V, the part will cease operation until the EN pin is cycled off and on. To disable the open load shut-off feature, connect the OLS pin to GND.Monolithic Power Systems Application CircuitsFigure 3: One String of Four (4) LEDsMonolithic Power SystemsApplication Circuits ContinuedFigure 5: Two Strings of Four (4) LEDs or Eight (8) LEDs TotalMonolithic Power SystemsPackage InformationMSOP10NOTE:1) Control dimension is in inches. Dimension in bracket is millimeters.QFN16 (3 x 3)Pin 1NOTE:1) Control dimension is in millimeters. Dimension in bracket is inch.NOTICE: MPS believes the information in this document to be accurate and reliable. However, it is subject to change without notice. Please contact the factory for current specifications. No responsibility is assumed by MPS for its use or fit to any application, nor for infringement of patent or other rights of third parties.MP1521 Rev 2.7Monolithic Power Systems, Inc. 8。

BP1048B2 数据手册说明书

目录1.概述 (1)2.结构示意图 (3)3.音频DSP信号处理框图 (4)4.引脚定义和描述 (5)5.GPIO引脚描述 (6)6.芯片电气特性 (8)6.1.芯片使用条件 (8)6.2.数字IO电特性 (8)6.3.音频性能 (9)7.运行频率和功耗 (11)7.1.典型模式下的功耗 (11)8.封装尺寸 (12)9.存储和焊接 (13)10.声明 (14)11.技术支持 (15)图图1.芯片结构示意图 (3)图2.音频DSP信号处理框图 (4)图3.芯片引脚定义 (5)图4.封装形式和尺寸 (12)表表1芯片引脚说明 (6)表2GPIO上电状态及电平 (7)表3芯片推荐使用条件 (8)表4数字IO直流特性 (8)表5数字IO驱动力和上下拉特性 (8)表6Audio DAC性能@44.1KHz (9)表7Audio ADC（LINEIN3通道）性能@44.1KHz (9)表8Audio ADC（LINEIN4/5通道）性能@44.1KHz (9)表9Audio ADC（MIC通道）性能@44.1KHz (10)表10典型模式下的功耗 (11)1.概述内核和存储高性能32位RISC 内核，最高频率288MHz ，支持DSP 指令，集成FPU 支持浮点运算 FFT 加速器：最大支持1024点复数FFT/IFFT 运算，或者是2048点的实数FFT/IFFT 运算集成320KB SRAM ，32KB I-Cache ，32KB D-Cache内置16Mbit FLASH ，存储代码及数据内置一次性烧录存储器可以保存用户密码 2线SDP （Serial Debug Port ）调试口，具备断点调试和代码追踪能力 40个中断向量4层中断优先级音频 4路16bit Audio-ADC ，SNR ≥94dBADC 采样率支持8KHz /11.025KHz /12KHz /16KHz /22.05KHz /24KHz /32KHz /44.1KHz 2路模拟麦克风，Audio /48KHz 支持4路数字麦克风或ADC 0通道带AGC 功能Audio LINE-IN 支持单端输入或差分输入 3路24bit DAC ，SNR ≥105dBDAC 采样率支持8KHz /11.025KHz /12KHz /16KHz /22.05KHz /24KHz /32KHz /44.1KHz /48KHz 支持直驱16Ω或32Ω耳机，最大输出功率40mW2个全双工I2S ，8~192KHz 采样率，最大有效位宽32bits1个S/PDIF 接口，支持接收或发送（半双工），支持HDMI 音频和ARC双模蓝牙V5.0，兼容蓝牙V4.2和V2.1+EDR 支持蓝牙Piconet 和Scatternet 组网协议最大发射功率10dBm ，支持class1、class2、class3蓝牙接收灵敏度（典型值）●DH1：-88dBm ●2DH5：-88dBm ●3DH5：-82dBm ●BLE ：-92dBm支持A2DP/AVRCP/HFP/HSP/OPP/HID/SPP/PBAP/GATT/SM 等协议支持PLC (Package Loss Concealment)电源、时钟和复位 DC 3.3V~5V 电源供电@LDOIN 内置（5V 转3.3V ，3.3V 转1.2V ）LDO RC 12MHz 时钟源和双PLL 锁相环时钟源 24MHz 晶体内置POR （Power on Reset ），LVD （低电压检测）和Watchdog 多种低功耗模式：●CPU 降频●●●系统降频休眠深度休眠外设 2个基本定时器（TIM1，TIM2） 4个通用定时器（TIM3，TIM4，TIM5，TIM6），带PWM 和PWC 功能多达28个GPIO所有GPIO 均可配置为外部中断输入和唤醒源GPIO可配置上拉、下拉、高阻、下拉电流源等功能USB2.0全速（OTG）控制器，支持6个端点，内置PHY1个标准SPI Master接口@max.60M1个SPI Slave接口@max.60M1个SDIO@max.30M2个全双工UART@max.3Mbps，其中UART0支持流控1个I2C主/从控制器@max.400K1个12-bit SAR-ADC（逐次逼近型ADC）@ max.450K采样率，可分配12个外部IO通道，2个内部电压采样通道1个IR接口，支持NEC或者SONY模式真随机数发生器DMA8通道DMA，全内存寻址，可分配给任意外设（OTG、IR和I2C除外）独特的内存与IO间自动发射和捕获机制（简称DMA-GPIO），可模拟多种通讯和控制时序软件开发支持音频算法支持列表：●解码：MP2,MP3,WMA,APE,FLAC,AAC,MP4,M4A,WAV（IMA-ADPCM&PCM）,AIF,AIFC●编码：MP2/MP3,IMA-ADPCM●音效：◆回声◆Plate Reverb◆3D环绕◆虚拟低音◆Professional Voice Changer支持‘电音/变调/变声’◆参量均衡器（EQ）◆动态范围压缩（DRC）◆回声消除（AEC）◆噪声抑制◆移频（防啸叫）◆啸叫侦测及抑制SDK（软件开发套件）内涵丰富。

海利普变频器说明书C100

● 变频器运转中请勿检查电路板上的信号，以免发生危险。 ● 变频器出厂时参数均已优化，请按所需功能适当调整。 ● 请务必考虑振动、噪音、电机轴承及机械装置所允许的速度范
围。
HLP-C100 系列使用说明书
系列
危险
● 变频器运转中严禁将电机机组投入或切离，否则会造成变频器过电流跳脱，甚至烧毁变频器主回路。
72
10.1 故障列表
72
10.2 操作异常及处理
73
第11章日常维护
75
11.1 注意事项
75
11.2 变频器存储和运输
75
第12章通讯协议
76
12.1 格式说明
76
12.2 线圈寄存器编址
76
12.3 读线圈状态
78
12.4 读保持寄存器
79
12.5 写单个线圈状态
79
12.6 写单个保持寄存器值 12.7 写多个线圈状态 12.8 写多个保持寄存器 12.9 读写数组参数 12.10 通信错误代码
系列
1 1 2 2 3 4 4 5 5 8 8 8 8 9 9 9 9 11 13 14 14 14 15 16 18 19 20 21 21 21 21
系列
5.4 正反转、点动
21
5.5 多段速
22
5.6 故障复位
23
第6章功能参数表
24
第7章参数详细说明
34
7.1 第00组参数：操作/显示
34
7.2 第01组参数：负载/电动机
36
7.3 第02组参数：制动功能
40
7.4 第03组参数：设定值/加减速
41
7.5 第04组参数：极限/警告设置

HLMP-CM27-X10XX中文资料

Agilent HLMP-CxxxT-13/4 (5mm) Extra Bright Precision Optical Performance InGaN LED Lamps Data SheetDescriptionThese high intensity blue and green LEDs are based on the most efficient and cost effective InGaN material technology. The 470 nm typical dominant wave–length for blue and 525 nm typical wavelength for green is well suited to color mixing in full color signs. The 505 nm typical dominant wavelength for cyan is suitable for traffic signal application.These LED lamps are untinted, non-diffused, T-13/4 packagesFeatures•Well defined spatial radiationpattern•High luminous output•Available in blue, green, and cyancolor•Viewing angle: 15°, 23°and 30°•Standoff or non-standoff leads•Superior resistance to moistureApplications•Traffic signals•Commercial outdoor advertising•Front panel backlighting•Front panel indicator incorporating second generationoptics which produce well-definedspatial radiation patterns atspecific viewing cone angles.These lamps are made with anadvanced optical grade epoxy,offering superior temperatureand moisture resistance inoutdoor signal and signapplications. The high maximumLED junction temperature limitof +110°C enables hightemperature operation in brightsunlight conditions.HLMP-CB11, HLMP-CB12, HLMP-CM11, HLMP-CM12, HLMP-CE11,HLMP-CE12, HLMP-CB26, HLMP-CB27, HLMP-CM26, HLMP-CM27,HLMP-CE26, HLMP-CE27, HLMP-CB36, HLMP-CB37, HLMP-CM36,HLMP-CM37, HLMP-CE36, HLMP-CE37CAUTION: Devices are Class I ESD sensitive. Please observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional details.Package DimensionsPackage APackage B5.80 ± 0.20(0.228 ±∅ CATHODEFLATMIN.SQ. TYP.NOTES:1. MEASURED JUST ABOVE FLANGE.2. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).3. EPOXY MENISCUS MAY EXTEND ABOUT 1 mm (0.040") DOWN THE LEADS.4. IF HEAT SINKING APPLICATION IS REQUIRED, THE TERMINAL FOR HEAT SINK IS ANODE.Device Selection GuideTypicalViewing Angle,Intensity (cd) at 20 mA PackagePart Number Color2q1/2 (Degree)Min.Max.Standoff Dimension Lens HLMP-CB11-TW0xx Blue15 2.57.2No A Clear HLMP-CB11-UVAxx Blue15 3.2 5.5No A Clear HLMP-CB12-TW0xx Blue15 2.57.2Yes B Clear HLMP-CM11-Y20xx Green159.327.0No A Clear HLMP-CM11-Z1Cxx Green1512.021.0No A Clear HLMP-CM12-Y20xx Green159.327.0Yes B Clear HLMP-CE11-X10xx Cyan157.221.0No A Clear HLMP-CE12-X10xx Cyan157.221.0Yes B Clear HLMP-CB26-SV0xx Blue23 1.9 5.5No A Clear HLMP-CB26-TUDxx Blue23 2.5 4.2No A Clear HLMP-CB27-SV0xx Blue23 1.9 5.5Yes B Clear HLMP-CM26-X10xx Green237.221.0No A Clear HLMP-CM26-YZCxx Green239.316.0No A Clear HLMP-CM27-X10xx Green237.221.0Yes B Clear HLMP-CE26-WZ0xx Cyan23 5.516.0No A Clear HLMP-CE27-WZ0xx Cyan23 5.516.0Yes B Clear HLMP-CB36-QT0xx Blue30 1.15 3.2No A Clear HLMP-CB36-RSAxx Blue30 1.5 2.5No A Clear HLMP-CB37-RU0xx Blue30 1.5 4.2Yes B Clear HLMP-CB37-RSDxx Blue30 1.5 2.5Yes B Clear HLMP-CM36-X10xx Green307.221.0No A Clear HLMP-CM36-XYCxx Green307.212.0No A Clear HLMP-CM37-X10xx Green307.221.0Yes B Clear HLMP-CM37-XYCxx Green307.212.0Yes B Clear HLMP-CM37-XYDxx Green307.212.0Yes B Clear HLMP-CE36-WZ0xx Cyan30 5.516.0No A Clear HLMP-CE37-WZ0xx Cyan30 5.516.0Yes B ClearNotes:1.Tolerance for luminous intensity measurement is ±15%.2.The luminous intensity is measured on the mechanical axis of the lamp package.3.The optical axis is closely aligned with the package mechanical axis.4.LED light output is bright enough to cause injuries to the eyes. Precautions must be taken to prevent looking directly at the LED without propersafety equipment.5. 2q1/2 is the off-axis angle where the luminous intensity is 1/2 the on-axis intensity.Part Numbering SystemHLMP-x x xx-x x x xxMechanical Options00: BulkDD: Ammo PackColor Bin Options0: Full Color Bin DistributionA: Color Bin 1 and 2C: Color Bin 3 and 4D: Color Bin 4 and 5Maximum Intensity Bin0: No Maximum Intensity Bin LimitationOthers: Refer to Device Selection GuideMinimum Intensity BinRefer to Device Selection GuideViewing Intensity Bin11: 15° Without Standoff12: 15°With Standoff26: 23°Without Standoff27: 23°With Standoff36: 30°Without standoff37: 30°With StandoffColorB: Blue 470 nmM: Green 525 nmE: Cyan 505 nmPackageC: T-13/4 (5 mm) Round LampAbsolute Maximum Rating at T A = 25°CParameters Value UnitDC Forward Current [1]30mAPeak Pulsed Forward Current[3]100mAAverage Forward Current30mAPower Dissipation120mWLED Junction Temperature110°COperating Temperature Range–40 to +85°CStorage Temperature Range–40 to +100°CWave Soldering Temperature[2]250 for 3 secs°CNotes:1.Derate linearly as shown in Figure2.2.1.59 mm (0.060 inch) below body.3.Duty factor 10%, frequency 1 KHz.Electrical/Optical CharacteristicsT A = 25o CBlue Green CyanParameters Symbol Min.Typ.Max.Min.Typ.Max.Min.Typ.Max.Units Test Condition Forward Voltage V F 3.5 4.0 3.6 4.0 3.5 4.0V I F = 20 mA Reverse Voltage[1]V R 5.0 5.0 5.0V I R = 10 µA Thermal Resistance R q J-PIN240240240o C/W LED Junction toAnode Lead Dominant l d460470480520525540490505510nm I F = 20 mA Wavelength[2]Peak Wavelength l PEAK464516501nm Peak of Wavelengthof Spectral Distribu-tion at I F = 20 mA Spectral Half Width Dl1/2233230nm Wavelength Widthat Spectral Distribu-tion Power Pointat I F = 20 mA Luminous Efficacy[3]h v74484319lm/W Emitted LuminousPower/EmittedRadiant Power Notes:1.The reverse voltage of the product is equivalent to the forward voltage of the protective chip at I R = 10 µA.2.The dominant wavelength, l d, is derived from the Chromaticity Diagram and represents the color of the lamp.3.The radiant intensity, Ie in watts/steradian, may be found from the equation Ie = Iv/h v, where Iv is the luminous intensity in candelas and h v is theluminous efficacy in lumens/watt.Figure 5. Relative intensity vs. DC forward current.Figure 4. Relative dominant wavelength vs. DC forward current.DC FORWARD CURRENT – mAR E L A T I V E D O M I N A N T W A V E L E N G T H (N O R M A L I Z E D A T 20 m A )1020301.0250.9901.0151.0201.0101.0051.0000.995GREENBLUER E L A T I V E I N T E N S I T Y (N O R M A L I Z E D A T 20 m A )FORWARD CURRENT – mAFigure 1. Relative intensity vs. wavelength.Figure 3. Forward current vs. forward voltage.Figure 2. Forward current vs. ambient temperature.WAVELENGTH – nmR E L A T I V E I N T E N S I T Y1.0000.800.600.400.20030103.0202.01.0F O R W A R D C U R R E N T – m AFORWARD VOLTAGE – V 4.0CYANGREENBLUEI F – F O R W A R D C U R R E N T – m AV F – FORWARD VOLTAGE – VOLTSFigure 6. Spatial radiation pattern for Cx11 and Cx12.R E L A T I V E L U M I N O U S I N T E N S I T Y10ANGULAR DISPLACEMENT – DEGREES0.5-90-600-30306090Figure 7. Spatial radiation pattern for Cx26 and Cx27.Figure 8. Spatial radiation pattern for Cx36 and Cx37.R E L A T I V E L U M I N O U S I N T E N S I T Y10ANGULAR DISPLACEMENT – DEGREES0.5-90-600-30306090R E L A T I V E L U M I N O U S I N T E N S I T Y10ANGULAR DISPLACEMENT – DEGREES0.5-90-600-30306090Intensity Bin Limit TableIntensity (mcd) at 20 mA Bin Min MaxN680880P8801150Q11501500R15001900S1*******T25003200U32004200V42005500W55007200X72009300Y930012000Z1200016000 11600021000 Tolerance for each bin limit is ±15%.Blue Color Bin TableBin Min Dom Max Dom Xmin Ymin Xmax Ymax 1460.0464.00.14400.02970.17660.09660.18180.09040.13740.0374 2464.0468.00.13740.03740.16990.10620.17660.09660.12910.0495 3468.0472.00.12910.04950.16160.12090.16990.10620.11870.0671 4472.0476.00.11870.06710.15170.14230.16160.12090.10630.0945 5476.0480.00.10630.09450.13970.17280.15170.14230.09130.1327 Tolerance for each bin limit is ±0.5 nm.Cyan Color Bin TableBin Min Dom Max Dom Xmin Ymin Xmax Ymax 1490.0495.00.04540.29450.11640.38890.13180.3060.02350.4127 2495.0500.00.03450.41270.10570.47690.11640.38890.00820.5384 3500.0505.00.00820.53840.10270.55840.10570.47690.00390.6548 4505.0510.00.00390.65480.10970.62510.10270.55840.01390.7502 7498.0503.00.01320.48820.10280.52730.10920.44170.00400.6104 8503.0508.00.00400.61040.10560.60070.10280.52730.00800.7153 Tolerance for each bin limit is ±0.5 nm.Green Color Bin TableBin Min Dom Max Dom Xmin Ymin Xmax Ymax 1520.0524.00.07430.83380.18560.65560.16500.65860.10600.8292 2524.0528.00.10600.82920.20680.64630.18560.65560.13870.8148 3528.0532.00.13870.81480.22730.63440.20680.64630.17020.7965 4532.0536.00.17020.79650.24690.62130.22730.63440.20030.7764 5536.0540.00.20030.77640.26590.60700.24690.62130.22960.7543 Tolerance for each bin limit is ±0.5 nm./semiconductors For product information and a complete list of distributors, please go to our web site.For technical assistance call:Americas/Canada: +1 (800) 235-0312 or (916) 788-6763Europe: +49 (0) 6441 92460China: 10800 650 0017Hong Kong: (+65) 6756 2394India, Australia, New Zealand: (+65) 6755 1939 Japan: (+81 3) 3335-8152(Domestic/Interna-tional), or 0120-61-1280(Domestic Only) Korea: (+65) 6755 1989Singapore, Malaysia, Vietnam, Thailand, Philippines, Indonesia: (+65) 6755 2044 Taiwan: (+65) 6755 1843Data subject to change.Copyright © 2004 Agilent Technologies, Inc. December 7, 20045989-1022EN。

LPC1102简介

广州周立功单片机发展有限公司
LPC1102
LPC1100 系列 ARM Cortex-M0 系列微控制器
LPC1102——世界上最小的 32 位 ARM 微控制器
芯片特性
世界上最小的 32 位 ARM 微控制器仅 5mm2 的面积(2.17mm×2.32mm) 0.5mm 引脚间距极低功耗(正常工作 130μA/MHz) 16 位 Thumb 指令更高的代码密度——比传统 8/16-bit 微控制器代码量小 40%-50% 卓越的性能——具有超过 45DMIPS 的指令处理速度
硬件资源
片上 32KB Flash、8KB RAM 11 个 I/O 管脚均可设置为 GPIO 一个 5 通道 10 位 ADC 一个 RS-485/EIA-485 UART 一个 SPI(支持 SSP) 两个 32 位定时器两个 16 位定时器一个 24 位系统定时器串行 SWD 调试，支持 4 个断点和 2 个观察点
LPC1102 结构框图
©2010 Guangzhou ZLGMCU Development Co., LTD. 1

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