RXF datasheet 2014

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OVCP datasheet 2014

电池标称电压 Rated Voltage
标志 Marking
商标 Trademark
过高电压充电时，电池实时电压，待电池过充后由BMS判定后切断充电电路。 Over-Voltage Charging; then BMS manages and cuts off the charging circuit.
＋
－
SET 150℃ GP
OVCP 15A 36V 58
额定温度（温度保险丝）
Rated Functioning Temp. of Thermal-link
符合RoHS Compliant
型号说明 Part Number System
OVCP
15A
36V
开关电压 Threshold Voltage 工作电压 Rated Voltage 额定电流 Rated Current 类别 Type
194
过电压充电保护器 Over-Voltage Charging Protector (OVCP)
产品简介 Product Description
赛尔特的过电压充电保护器（OVCP），是一种新型的主动控制和被动控制相结合的保护器件，主要用于锂电池组异常过电压充电保护；当充电电压达到其设定阀值电压时可同时切断输入与输出回路；也可作为一次性主动保护装置，由电池管理系统（BMS）输出信号触发该保护器动作，实现主动保护的功能。 SET's Over Voltage Charging Protector（OVCP）is a New Device, which combines active and passive Protections for Battery Pack if abnormal over voltage charging happens. When the charging voltage reaches the given threshold value, OVCP cuts off both input and output circuits. Besides, OVCP can be an active protective device which is activated by Battery Management System(BMS).

FTLF8519F2GTL, 规格书,Datasheet 资料

Finisar Corporation October 6, 2005 Rev B
Page 1
芯天下--/
FTLF8519F2xTL 2x5 Pin SFF Product Specification – October 2005
I.
Pin Descriptions
Product Specification
2.125 Gb/s RoHS Compliant Short Wavelength 2x5 SFF Transceiver
FTLF8519F2xTL
PRODUCT FEATURES Up to 2.125 Gb/s bi-directional data links Standard 2x5 pin SFF footprint (MSA compliant) 850nm Oxide VCSEL laser transmitter Duplex LC connector RoHS compliant and Lead Free Up to 500m on 50/125µm MMF, 300m on 62.5/125µm MMF Metal enclosure, for lower EMI Single 3.3V power supply Low power dissipation <750mW Industrial operating temperature range: -40°C to 85°C Finisar’s FTLF8519F2xTL Small Form Factor (SFF) transceivers comply with the 2x5 standard package defined by the Small Form Factor Multi-Sourcing Agreement (MSA)1. They are simultaneously compatible with Gigabit Ethernet as specified in IEEE Std 802.32 and Fibre Channel FC- PI-2 Rev. 7.03. They are RoHS compliant and lead-free per Directive 2002/95/EC4 and Finisar Application Note AN-2038. PRODUCT SELECTION APPLICATIONS 1.25 Gb/s 1000Base-SX Ethernet Dual Rate 1.063/2.125 Gb/s Fibre Channel

Datasheet MLX90614 中文数据手册 rev008

MLX90614 系列
单区视场和双区视场 TO-39 封装红外温度传感器
特性和优点
尺寸小，成本低易集成在极宽温度范围内工作，带出厂校准：传感器工作温度范围：-40…+125˚C 被测目标温度范围：-70…+380˚C Ta 和 To 在 0 到 50° C 时，测量精度可达 0.5° C 高(医疗)精度校准测量值分辨率 0.02° C 单区视场和双区视场可选 SMBus 兼容数字接口可配置 PWM 连续输出 3V 或 5V 供电，也可使用 8…16V 供电调制支持睡眠模式适合不同应用领域的多种封装方式和测试方式车用级别标准
3901090614 Rev 008
第 2ห้องสมุดไป่ตู้/ 52 页
数据手册 2013/2/28
MLX90614 系列
单区视场和双区视场 TO-39 封装红外温度传感器
3 目录
1 功能图 ........................................................................................................................................................................................................ 1 2 概述 ......................................................................................................................................................................

东芝功放管资料

NEW
38
TIM1414-5-252
5
TIM1414-5L TIM1414-4UL NEW TIM1414-4LA TIM1414-4-252
TIM8596-4 TIM0910-4
NEW
TIM1213-4L TIM1011-4L TIM1011-4UL
NEW
36
TIM1213-4UL
TIM1011-2UL TIM8596-2 TIM0910-2 TIM1011-2L TIM1112-2
7
8
9
4
Output Power at 1dB Gain Compression (dBm)
40 Output Power at 1dB Gain Compression (W)
46
X-, Ku-band Internally Matched Power GaAs FETs/GaN HEMTs Pout vs. Frequency Map
5
■ GaN HEMTs
C-band Internally Matched Power GaN HEMT
BIAS CONDITIONS FREQUENCY BAND (GHz) 7.7-8.5
NEW 7-AA06A 7-AA04A
(Ta = 25 °C)
RF PERFORMANCE SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS ELECTRICAL CHARACTERISTICS (TYP.) Tch (°C) 250 VGSoff (V) – 4.0 PACKAGE CODE IDS (@Pin = 44.0 dBm) (A) TYP. 10.0 MAX. 12.0 G✽✽ (dB) MAX. ±0.8 Tch✽ (°C) MAX. 140 50 – 10 18.0

INA149AMDREP, 规格书,Datasheet 资料

ABSOLUTE MAXIMUM RATINGS(1)
Over operating free-air temperature range, unless otherwise noted.
Supply voltage Input voltage range Common-mode and differential, 10 s Maximum Voltage on REFA and REFB Input current on any input pin(2) Output short-circuit current duration Operating temperature range Storage temperature range Junction temperature
2
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
SUPPORTS DEFENSE, AEROSPACE, AND MEDICAL APPLICATIONS
• Controlled Baseline • One Assembly/Test Site • One Fabrication Site • Available in Military (–55°C/125°C)
INA149-EP

VRF150;中文规格书,Datasheet资料

The VRF150 is a gold-metallized silicon n-channel RF power transistor de-signed for broadband commercial and military applications requiring high power and gain without compromising reliability, ruggedness, or inter-modulationdistortion.FEATURES• Improved Ruggedness V (BR)DSS = 170V• 150W with 11dB Typical Gain @ 150MHz, 50V• 150W with 18dB Typical Gain @ 30MHz, 50V • Excellent Stability & Low IMD • Common Source Con ﬁ guration • Available in Matched Pairs• 30:1 Load VSWR Capability at Speci ﬁ ed Operating Conditions • Nitride Passivated• Refractory Gold Metallization• High Voltage Replacement for MRF150• RoHS CompliantSymbol ParameterVRF150(MP)Unit V DSS Drain-Source Voltage170V I D Continuous Drain Current @ T C = 25°C 16A V GS Gate-Source Voltage±40V P D Total Device dissipation @ T C = 25°C 300W T STG Storage Temperature Range -65 to 150°CT JOperating Junction Temperature200Maximum Ratings All Ratings: T C =25°C unless otherwise speci ﬁ edStatic Electrical CharacteristicsSymbol ParameterMin Typ MaxUnit V (BR)DSS Drain-Source Breakdown Voltage (V GS = 0V, I D = 100mA)170180V V DS(ON)On State Drain Voltage (I D(ON) = 10A, V GS = 10V) 2.03.0I DSS Zero Gate Voltage Drain Current (V DS = 100V, V GS = 0V) 1.0mA I GSS Gate-Source Leakage Current (V DS = ±20V, V DS = 0V) 1.0μA g fs Forward Transconductance (V DS = 10V, I D = 5A)4.5mhos V GS(TH)Gate Threshold Voltage (V DS = 10V, I D = 100mA)2.93.64.4VMicrosemi Website - 050-4936 R e v F 9-201Thermal CharacteristicsSymbol CharacteristicMin TypMax Unit R θJCJunction to Case Thermal Resistance0.60°C/WCAUTION:These Devices are Sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed./VRF150(MP)Dynamic CharacteristicsSymbol Parameter Test ConditionsMinTyp MaxUnitC ISS Input Capacitance V GS = 0V 420pFC oss Output CapacitanceV DS = 50V 210C rssReverse Transfer Capacitancef = 1MHz35Class A CharacteristicsSymbol Test Conditions Min Typ Max UnitG PS V DD = 50V, I DQ = 3A, P out = 150W PEP , f1 = 30MHz, f2 = 30.001MHz20dBIMD (d3)-50IMD (d9-d13)-75Functional CharacteristicsSymbol ParameterMinTyp Max Unit G PS f 1 = 30MHz, f 2 = 30.001MHz, V DD = 50V, I DQ = 250mA, P out = 150W PEP 18 dB G PS f = 150MHz, V DD = 50V, I DQ = 250mA, P out = 150W11ηD f 1 = 30MHz, f 2 = 30.001MHz, V DD = 50V, I DQ = 250mA, P out = 150W PEP 50%IMD (d3)f 1 = 30MHz, f 2 = 30.001MHz, V DD = 50V, I DQ = 250mA, P out = 150W PEP 1-32dBcIMD (d11)f 1 = 30MHz, f 2 = 30.001MHz, V DD = 50V, I DQ = 250mA, P out = 150W PEP -60ψf 1 = 30MHz, f 2 = 30.001MHz, V DD = 50V, I DQ = 250mA, P out = 150W PEP 30:1VSWR - All Phase AnglesNo Degradation in Output Power1. To MIL-STD-1311 Version A, test method 2204B, Two Tone, Reference Each ToneMicrosemi reserves the right to change, without notice, the speci ﬁ cations and information contained herein.050-4936 R e v F 9-20101110201 10 100 250101520253035101520253035110100V DS(ON ), DRAIN-TO-SOURCE VOLTAGE (V) FIGURE 1, Output CharacteristicsI D , D R A I N C U R R E N T (A )I D , D R A I N C U R R E N T (A )VDS , DRAIN-TO-SOURCE VOLTAGE (V) FIGURE 3, Capacitance vs Drain-to-Source VoltageC , C A P A C I T A N C E (p F )V DS , DRAIN-TO-SOURCE VOLTAGE (V) FIGURE 4, Forward Safe Operating AreaI D , D R A I N C U R R E N T (V )V GS , GATE-TO-SOURCE VOLTAGE (V) FIGURE 2, Transfer CharacteristicsTypical Performance Curves/−50−45−40−35−30−25−20VRF150(MP)50-4936 R e v F 9-20100.10.20.30.40.50.60.710-510-410-3 10-2 10 1.0Z θJ C , T H E R M A L I M P E D A N C E (°C /W )RECTANGULAR PULSE DURATION (seconds)Figure 5. Maximum Effective Transient Thermal Impedance Junction-to-Case vs Pulse Duration050100150200250300P out , OUTPUT POWER (WATTS PEP)Figure 6. IMD versus P OUTI M D , I N T E R M O D U L A T I O N D I S T O R T I O N (d B )O U T P U T P O W E R (W P E P )P out , INPUT POWER (WATTS PEP)Figure 7. P OUT versus P INTypical Performance Curves/050-4936 R e v F 9-2010RFC1RFC1, C2, C8 -- Arco 463 or equivalent C3 -- 25pF, Unelco C4 -- 0.1uF, CeramicC5 -- 1.0 uF, 15 WV Tantalum C6 -- 250pF, Unelco J101C7-- 25pF, Unelco J101C9 -- Arco 262 or equivalent C10 -- 0.05uF, CeramicC11 -- 15uF, 60WV Electrolytic+ 50VDBias 0-12VRF RF OutputC2, C5, C6 - C9 -- 0.1uF SMT C3 -- 200pF ATC 700C C4 -- 15pF, ATC 700CC10 -- 10uF, 100V ElectrolyticR1, R2 -- 51 7, 1 W Carbon R3 -- 3.3 7, 1 W Carbon T1 -- 9:1 Transformer T2 -- 1:9 Transformer30 MHz test Circuit150 MHz test Circuit/050-4936 R e v F 9-2010.5” SOE Package OutlineAll Dimensions are ± .005DIMINCHES MILLIMETERS MIN MAX MIN MAX A 0.0960.99024.3925.14B0.4650.51011.8212.95C 0.2290.275 5.82 6.98D 0.2160.235 5.49 5.96E0.0840.110 2.14 2.79H0.1440.178 3.66 4.52J 0.0030.0070.080.17K 0.43511.0M45° NOM 45° NOM Q 0.1150.130 2.93 3.30R 0.2460.255 6.25 6.47U0.7200.73018.2918.54Microsemi’s products are covered by one or more of U.S. patents 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522 5,262,336 6,503,786 5,256,5834,748,103 5,283,202 5,231,474 5,434,095 5,528,058 6,939,743, 7,352,045 5,283,201 5,801,417 5,648,283 7,196,634 6,664,594 7,157,886 6,939,743 7,342,262 and foreign patents. US and Foreign patents pending. All Rights Reserved.Adding MP at the end of P/N speci ﬁ es a matched pair where V GS(TH) is matched between the two parts. V TH values are marked on the devices per the following table.Code Vth Range Code 2Vth Range A 2.900 - 2.975M 3.650 - 3.725B 2.975 - 3.050N 3.725 - 3.800C 3.050 - 3.125P 3.800 - 3.875D 3.125 - 3.200R 3.875 - 3.950E 3.200 - 3.275S 3.950 - 4.025F 3.275 - 3.350T 4.025 - 4.100G 3.350 - 3.425W 4.100 - 4.175H 3.425 - 3.500X 4.175 - 4.250J 3.500 - 3.575Y 4.250 - 4.325K3.575 - 3.650Z4.325 - 4.400V TH values are based on Microsemi measurements at datasheet conditions with an accuracy of 1.0%./分销商库存信息: MICROSEMIVRF150。

NSF14中文

元件認證指南目錄飲用水處理系統和元件認證指南章節-----------------------------------------------------------------------------------頁碼序--------------------------------------------------------------------------------------1-4 概況-----------------------------------------------------------------------------------5常見問題-----------------------------------------------------------------------------6-8 NSF標準規定-----------------------------------------------------------------------9-15 認證-----------------------------------------------------------------------------------15-18 與供應商合作-----------------------------------------------------------------------19詞彙表--------------------------------------------------------------------------------20-24 附錄A--------------------------------------------------------------------------------25附錄B--------------------------------------------------------------------------------26附錄C--------------------------------------------------------------------------------27-28 聯絡資訊-----------------------------------------------------------------------------29序NSF International（簡稱NSF）成立於1944年，為一個致力於公共衛生安全以及環境保護的機構。

datasheet_sar100_robust_gyro_sensor_ts1440_r4

Driver Power up control and clock generator Excitation control LNA
VDD AVDD
VSS AVSS
References, bias and PTAT
Oscillating mass
MUX
SPI serial interface
LOAD SCLK MOSI MISO
DATASHEET
1 FEATURES o Horizontal or vertical mounting o High reliability and robustness over long lifetime o Low vibration sensitivity o High overload and shock capability (5000 g) o Butterfly balanced design for high mechanical common mode rejection o Closed-loop force feedback operation with electrostatic frequency tuning o Low bias drift o Ideal mono crystalline Si material o Wafer level sealing with controlled Q-factor o Low power o Single supply +5 VDC o Fully digital with SPI communication and on chip OTP calibration o Digitally controlled sample rate up to 2000 SPS o Bandwidth defined by built in 4th order digital LP filter o Intrinsic continuous diagnostic monitoring o Temperature sensor o No external components required

XL1410原厂规格书(2014版)

Rev 1.0
Figure1. Package Type of XL1410
1

2A 380KHz 18V Buck DC to DC Converter
XL1410
Pin Configurations
NC 1
8 NC
VIN 2
7 EN
XL1410
SW 3
6 NC
GND 4
Vin = 12V, GND=0V, Vin & GND parallel connect a 220uf/50V capacitor; Iout=500mA, Ta = 25℃; the others floating unless otherwise specified.
Parameters
Symbol
LCD Monitor and LCD TV Digital Photo Frame Set-up Box ADSL Modem Telecom / Networking Equipment
General Description
The XL1410 is a 380KHz fixed frequency PWM buck (step-down) DC/DC converter, capable of driving a 2A load with high efficiency, low ripple and excellent line and load regulation. Requiring a minimum number of external components, the regulator is simple to use and include internal frequency compensation and a fixed-frequency oscillator.

AFG1022 双通道随机功能生成器数据手册说明书

Arbitrary Function GeneratorAFG1022 DatasheetThe AFG1022 Arbitrary Function Generator provides a waveform generation tool with the best price performance ratio. It includes dual channel, 25 MHz bandwidth and up-to 10 V p-p output amplitude. The four run modes, 50 built-in frequently-used waveforms and the built-in 200 MHz frequency counter cover most waveform generation needs in yourexperiment and test jobs. The 3.95-inch TFT LCD, short-cut buttons, USB interface and PC software provide the most intuitive ways to configure the instrument.Features and benefitsDual-channel, 25 MHz sine wave, and 12.5 MHz square/pulse wave provides a cost effective solution for basic education and other applications125 MS/s sampling rate and 14-bit vertical resolution enable great signal fidelity1 mV p-p to 10 V p-p output amplitude over the whole frequency range The intuitive user interface shortens the learning curve for students and other users2 to 8,192-point length of memory for user-defined arbitrary waveforms 64-MByte internal non-volatile memory for arbitrary waveform storage Standard USB host/device for memory expansion and remote control Continuous, sweeping, burst, and modulation modes covers most requirements for students and other users to get the experiments/test job doneBuilt-in 200 MHz counter with 6-digit resolution offers an easy and precise way of frequency/period/pulse width/duty cycle measurement Menu and online help are in English and Simplified ChineseCompact form factor for stacking on other bench instruments to save valuable bench spaceFree ArbExpress makes user defined waveforms editing extremely easyCompatible with TekSmartLab ™ for easy teaching and learningApplicationsElectric and electronics experiments Communications experiments Sensor simulation Functional testPerformance and features1 μHz to 25 MHz sine waveform range, with 12-digit or 1 μHz resolution and a ±1 ppm drift high stability time base, provides great signal fidelity in the frequency domain. With 1 mV p-p to 10 V p-p output amplitude range, and 14-bit or 1 mV p-p resolution over the whole frequency range, there is no need to compromise between output amplitude and frequency any more.Four different run modes and four modulation modes cover most use cases with a cost effective solution. 50 most-frequently used standard and arbitrary waveforms are built-in for easy access. Up to 8,192 pointsarbitrary waveforms memory enables users to replicate real world signals captured with a Tektronix oscilloscope or defined with ArbExpress. The built-in 200 MHz and 6 digit resolution frequency counter is an easy andprecise way to measure frequencies/periods/pulse widths/duty cycles.Ease of useThe high-resolution 3.95-inch color TFT display shows relevant settings and parameters in both text and graphic formats, which give users full confidence in their settings, and let them focus on the task at hand. The front panel shortcut buttons and rotary knob make accesses to most frequently used functions and settings with minimum effort and time. The built-in 64-MByte non-volatile memory together with USB stick memory interface, provide unlimited space for user-defined waveform storage.Software and solutionsCompatible with ArbExpress, the user-defined arbitrary waveforms generated by the free software can be loaded on the AFG1022 easily with a USB memory stick.As a building block of Tektronix educational solution, the AFG1022 can be embedded into TekSmartLab and enable a cost efficient and effective way of teaching, learning, and lab management.SpecificationsChannelsNumber of channels 2Built-in waveformsBuilt-in waveforms Sine, Square, Pulse, Ramp, Noise, and 45 frequently used arbitrary waveformsSine waveRange 1 μHz to 25 MHzSine wave in burst mode 2 mHz to 25 MHzEffective maximum frequency out25 MHzAmplitude flatness (1 V p-p)<10 MHz±0.2 dB10 MHz to 25 MHz±0.3 dBHarmonic distortion< -50 dBc, 1 V p-p, 1 μHz to 25 MHzTotal harmonic distortion< 0.2% (10 Hz to 20 kHz, 1 V p-p)Spurious< -45 dBc, 1 V p-p, 1 μHz to 25 MHzPhase noise 1 MHz: < -110 dBc/Hz at 10 kHz offset, 1 V p-p (typical)Residual clock noise-57 dBm (typical)DatasheetAFG1022 Arbitrary Function Generator Datasheet Square waveRange 1 μHz to 12.5 MHzRise/fall time< 12 nsJitter (rms)< 1 ns (typical)Overshoot<5%Ramp waveRange 1 μHz to1 MHzLinearity≤ 0.1% of peak output at 10% - 90% of amplitude range, at 1 kHz, 1 V p-p, 50% symmetry (typical)Symmetry0.0% to 100.0%Pulse waveRange 1 mHz to 12.5 MHzPulse width range40.00 ns to 999,000 sPulse width resolution10 ps or 5 digitsPulse duty<1 MHz, 0.001% to 99.999% (limitations of pulse duty width apply)1 MHz to 12.5 MHz, 50% fixedEdge transition time< 12 ns, fixedOvershoot< 5% (typical)Jitter (rms)< 1 ns (typical)NoiseNoise bandwidth (-3 dB)25 MHzNoise type White GausianDCRange-5 V to +5 V, 50 Ω load10 V to + 10 V, open circuit or high Z loadDatasheetArbitrary waveformRange 1 μHz to 10 MHzArbitrary waveform in burst mode 2 mHz to 10 MHzEffective analog bandwidth (-3 dB)30 MHzNon-volatile memory64 MByteMemoryLength 2 to 8,192: 125 MS/sSampling rate125 MS/sVertical resolution14 bitsRise and fall time< 10 nsJitter (rms)< 6 ns (typical)FrequencyResolution 1 μHz or 12 digitsInternal reference stability±1 ppm at 0 - 40 °CInternal reference aging±1 ppm per yearAmplitudeRange 1 mV p-p to 10 V p-p, 50 Ω load2 mV p-p to 20 V p-p, open circuit or high Z loadAccuracy±(1% of setting +1 mV p-p), (1 kHz sine waveform, 0 V offset)Resolution 1 mV p-p, 1 mV rms or 4 digitsUnits V p-p, V rmsOutput impedance50 Ω (typical)Local impedance setting Selectable: 50 Ω, 1 Ω to 10.000 kΩ, High Z (adjusts displayed amplitude according to selected load impedance) Isolation No floating ground, signal ground connected to chassis groundSignal output protection Short-circuit tolerance, main output automatically disabled when over currentAFG1022 Arbitrary Function Generator Datasheet DC offsetRange±(5 V pk – Amplitude pp/2), 50 Ω load±(10 V pk – Amplitude pp/2), open circuit or high Z loadAccuracy±(1% of |setting| + 1 mV + 0.5% of amplitude (V p-p))Resolution 1 mV or 4 digitsModulation 1Amplitude modulationCarrier waveforms Sine, square, ramp, arbitrary, except DC and noiseSource Internal / externalInternal modulatingSine, square, ramp, noise, arbitrarywaveformsInternal AM frequency 2 mHz to 20 kHzDepth0.0% to 100.0%Frequency modulationCarrier waveforms Sine, square, ramp, arbitrary, except DC and noiseSource Internal / externalSine, square, ramp, noise, arbitraryInternal modulatingwaveformsInternal modulating frequency 2 mHz to 20 kHzFrequency deviation 2 mHz to 12.5 MHzPhase modulationCarrier waveforms Sine, square, ramp, arbitrary, except DC and noiseSource Internal / externalSine, square, ramp, noise, arbitraryInternal modulatingwaveformsInternal PM frequency 2 mHz to 20 kHzPhase Deviation0° to 180°Frequency shift keyingCarrier waveforms Sine, square, ramp, arbitrary, except DC and noiseSource Internal / external50% duty cycle squareInternal modulatingwaveformsFSK rate 2 mHz to 100 kHz1Modulation, sweeping, and burst modes are only available in channel 1.Sweeping 1Carrier waveforms Sine, square, rampMinimum start-stop frequency 1 μHzMaximum start-stop frequency Sine: 25 MHzSquare: 12.5 MHzRamp: 1 MHzType Linear, logarithmicDirection Up / downSweep time 1 ms to 500 s ± 0.1%Trigger sources Internal, external, or manualBurst 1Waveforms Sine, square, ramp, pulse, arbitrary except DC and noise Types Count (1 to 50,000 cycles), infinite, gatedStart phase-360° to +360°Trigger sources Internal, external, or manualInternal trigger interval(40 ns or (cycles x period) to 500 s) ± 1%Gate source External triggerFrequency counterFunction Frequency, period, positive pulse width, duty cycleFrequency range100 mHz to 200 MHzFrequency resolution 6 digitsCoupling mode AC, DCVoltage Range and Sensitivity, DCcoupled (non-modulation signal)100 mHz to 100 MHz250 mV p-p to 5 V p-p (AC + DC)100 MHz to 200 MHz450 mV p-p to 3 V p-p (AC + DC)Voltage range and sensitivity, ACcoupled (non-modulation signal)1 Hz to 100 MHz250 mV p-p to 5 V p-p100 MHz to 200 MHz450 mV p-p to 4 V p-pPulse width and duty cycle measure 1 Hz to 10 MHzDatasheetInput impedance 1 M Ω in parallel with 100 pFHigh frequency noise restraint(HFR)On / Off (HFR frequency = 500 kHz) Sensitivity Low, middle, or highTrigger level range-2.5 V to +2.5 VAuxiliary inputs and outputsExternal modulation inputInput frequency range DC to 20 kHzInput voltage range All except FSK: ±1 V full scale, FSK: 3.3 V logic level Input impedance12 kΩ (typical)External trigger inputLevel TTL-compatibleSlope Rising or falling (selectable)Pulse Width>100 nsExternal reference clock input(Shared with Frequency Counter Input) Impedance400 Ω, AC coupledRequested Input voltageswing100 mV p-p to 5 V p-pLocking range10 MHz ±9 kHzExternal reference clock outputFrequency10 MHzImpedance50 Ω, DC coupledAmplitude 1.6 V p-p into 50 Ω loadCommunication interfaceUSB Host and device, USB TMC complianceDisplayDisplay type 3.95-inchDisplay resolution480 by 320Display colors65,536 AFG1022 Arbitrary Function Generator DatasheetFrequency counterDatasheetMenu and online help languagesMenu and online help languages English and Simplified ChinesePower sourceSupply220-240 VAC, 100-120 VAC, 50/60 Hz, CATⅡConsumption Less than 28 WFuse110 V: 250 V, F4AL220 V: 250 V, F2ALWarm-up time30 minutes (typical)Physical characteristicsDimensions (W, H, D)235 × 110 × 295 mm (9.2 × 4.33 × 11.61 in)WeightNet 3.4 kg (7.4 lbs)Shipping 4.7 kg (10.3 lbs)EMC environment and safetyTemperatureWorking0 ℃ to 40 ℃ (32 °F to 104 °F)Storage-20 ℃ to 60 ℃ (-4 °F to 144 °F)Relative humidity Operating: ≤ 80%, +0 °C to +40 °C (+32 °F to +104 °F)Non-operating: 5% to 90%, < +40 °C (+104 °F), non-condensingNon-operating: 5% to 80%, ≥ +40 °C (+104 °F) to ≤ +60 °C (+140 °F), non-condensingAltitude Operating: up to 3,000 m (9842 ft.)Non-operating: up to 12,000 m (39,368 ft)Cooling method Fan coolingEMC complianceEuropean Union EN 61326-1Australia/NZ CISPR 11, Class ASafety complianceEN61010-1IEC61010-1AFG1022 Arbitrary Function Generator Datasheet Ordering informationModelsAFG1022Arbitrary Function GeneratorInstrument optionsPower plug optionsOpt. A0North America power plug (115 V, 60 Hz)Opt. A1Universal Euro power plug (220 V, 50 Hz)Opt. A2United Kingdom power plug (240 V, 50 Hz)Opt. A3Australia power plug (240 V, 50 Hz)Opt. A5Switzerland power plug (220 V, 50 Hz)Opt. A6Japan power plug (100 V, 50/60 Hz)Opt. A10China power plug (50 Hz)Opt. A11India power plug (50 Hz)Opt. A12Brazil power plug (60 Hz)Opt. A99No power cordService optionsOpt. C3Calibration Service 3 YearsOpt. C5Calibration Service 5 YearsOpt. R5Repair Service 5 Years (including warranty)Opt. R5DW Repair Service Coverage 5 Years (includes product warranty period). 5-year period starts at time of instrument purchase Probes and accessories are not covered by the warranty and Service Offerings. Refer to the datasheet of each probe and accessory model for its unique warranty and calibration terms.AccessoriesStandard AccessoriesAFG1022 Arbitrary/Function Generator Safety and Compliance Instructions; printed document AFG1022 Documentation CD containing the following PDF documents:AFG1022 Arbitrary/Function Generators Quick Start User Manual, EnglishAFG1022 Arbitrary/Function Generators Quick Start User Manual, Simplified Chinese AFG1022 Arbitrary/Function Generators Programmer ManualAFG1022 Arbitrary/Function Generators Specifications and Performance Verification Manual Packing listPower cord, specified by country Certificate of calibration ; printed document USB cable x 1, Type A to Type B BNC cable x 2Tektronix Supplemental Information Sheet For the Peoples Republic of China: China RoHs; printed document Fuse, cartridge; 5 x 20 mm, 2 A, 250 V, time-delay Fuse, cartridge; 5 x 20 mm, 4 A, 250 V, time-delayWarrantyThree year warranty on parts and laborRecommended accessories174-4401-xx, USB cable, type A to type B cable – three feet 174-5194-xx, USB cable, type A to type B cable – six feet012-1732-xx, BNC cable assembly, 0 to 1 GHz, shielded – three feet 159-0107-xx, Fuse, cartridge; 5 x 20 mm, 2 A, 250 V, time-delay159-0397-xx, Fuse, cartridge; 5 x 20 mm, 4 A, 250 V, time-delayTektronix is registered to ISO 9001 and ISO 14001 by SRI Quality System Registrar.Product Area Assessed: The planning, design/development and manufacture of electronic Test and Measurement instruments.DatasheetAFG1022 Arbitrary Function Generator Datasheet 11DatasheetASEAN / Australasia (65) 6356 3900 Austria 00800 2255 4835*Balkans, Israel, South Africa and other ISE Countries +41 52 675 3777 Belgium 00800 2255 4835*Brazil +55 (11) 3759 7627 Canada180****9200Central East Europe and the Baltics +41 52 675 3777 Central Europe & Greece +41 52 675 3777 Denmark +45 80 88 1401Finland +41 52 675 3777 France 00800 2255 4835*Germany 00800 2255 4835*Hong Kong 400 820 5835 India 000 800 650 1835 Italy 00800 2255 4835*Japan 81 (3) 6714 3010 Luxembourg +41 52 675 3777 Mexico, Central/South America & Caribbean 52 (55) 56 04 50 90Middle East, Asia, and North Africa +41 52 675 3777 The Netherlands 00800 2255 4835*Norway 800 16098People's Republic of China 400 820 5835 Poland +41 52 675 3777 Portugal 80 08 12370Republic of Korea 001 800 8255 2835 Russia & CIS +7 (495) 6647564 South Africa +41 52 675 3777Spain 00800 2255 4835*Sweden 00800 2255 4835*Switzerland 00800 2255 4835*Taiwan 886 (2) 2656 6688 United Kingdom & Ireland 00800 2255 4835*USA180****9200* European toll-free number. If not accessible, call: +41 52 675 3777For Further Information. Tektronix maintains a comprehensive, constantly expanding collection of application notes, technical briefs and other resources to help engineers working on the cutting edge of technology. Please visit . Copyright © Tektronix, Inc. All rights reserved. Tektronix products are covered by U.S. and foreign patents, issued and pending. Information in this publication supersedes that in all previously published material. Specification andprice change privileges reserved. TEKTRONIX and TEK are registered trademarks of Tektronix, Inc. All other trade names referenced are the service marks, trademarks, or registered trademarks of their respective companies.09 Dec 2014 75W-30936-0 。

AD9914_CN

2012年7月—修订版0：初始版
DDS内核 ..................................................................................... 19 12位DAC输出............................................................................ 20 DAC校准输出............................................................................ 20 重构滤波器 ................................................................................ 20 时钟输入(REF_CLK/REF_CLK) ............................................ 21 PLL锁定指令.............................................................................. 22 输出幅度键控(OSK)................................................................. 22 数字斜坡发生器(DRG) ........................................................... 23 省电控制..................................................................................... 27 编程和功能引脚............................................................................. 28 串行编程 .......................................................................................... 31 控制接口——串行I/O.............................................................. 31 通用串行I/O操作...................................................................... 31 指令字节..................................................................................... 31 串行I/O端口引脚功能描述 .................................................... 31 串行I/O时序图 .......................................................................... 32 MSB/LSB传输 ............................................................................ 32 并行编程(8/16位)........................................................................... 33 寄存器图和位功能描述................................................................ 34 寄存器位功能描述 ................................................................... 39 外形尺寸 .......................................................................................... 45 订购指南..................................................................................... 45

常用的一些测试英语缩写

Full Name
Advanced Audio Distribution Profile Authentication, Authorization, and Accounting Advanced Audio Coding ATM Adaptation Layer type 1 Authentication Algorithm Number Activity-Based Buggeting Activity-Based Costing Activity-Base Management Available Bit Rate Alternating Current Audio Coder-3 Accept Anisotropic Conductive Film Advanced Configuration & Power Interface AT Command Interpreter Acknowledgement SMS Access Control List Add, Compare, Select Agency Dept. Automatic data capture Absolute Dimension Measurement Administration Function at the LIAN Audio Asymmetric Digital Subscriber Line Adaptive Dynamic Threshold Additional Elementary Functions Association for Electric Home Appliances Advance Encryption standard Alternative Frequency List Audio Frequency Control Annual Failure Rate Access Gateway Audio Gateway Anti-Glare Advanced Global Alignment Accelerated Graphics Port、Advanced Graphics Port Assisted Global Positioning System Auto Insertion Acquisition Indicatior Acquisition Indication Channel Article Inspection report Article Inspection report ATM Line Interface Module subrack alternate lighting of surfaces Accelerated Life Test General Administration Dept.

RF Power MOSFET ARF460A B 数据手册说明书

ARF460A/BDatasheet RF Power MOSFETFinalMay 2018Contents1Revision History (1)1.1Revision F (1)1.2Revision E (1)1.3Revision D (1)1.4Revision C (1)1.5Revision B (1)1.6Revision A (1)2Product Overview (2)2.1Features (2)2.2Characteristics (2)3Electrical Specifications (3)3.1Absolute Maximum Ratings (3)3.2Thermal and Mechanical Characteristics (3)3.3Electrical Performance (4)3.4Typical Performance Curves (5)3.5Typical Test Circuit (8)4Package Specification (9)4.1Package Outline Drawing (9)1Revision HistoryThe revision history describes the changes that were implemented in the document. The changes arelisted by revision, starting with the most current publication.1.1Revision FRevision F was published in May 2018. The following is a summary of the changes in revision F of thisdocument.Product Overview (see page 2)Updated image and features bulletThermal and Mechanical Characteristics (see page 3)Added sectionMaximum Transient Thermal Impedance (see page 5)Updated graphCapacitance vs. Drain-to-Source Voltage (see page 6)Updated graphThreshold Voltage vs. Temperature (see page 6)Updated graph1.2Revision ERevision E was published in October 2007. The following is a summary of the changes in revision E ofthis document.Updated to Microsemi formatChanged operating and storage junction temperature range from –55 °C to 175 °C to –55 °C to 150 °CChanged the GFS (VDS) from 15 V to 25 VFunctional Characteristics (see page 4)Changed the minimal values in the table1.3Revision DRevision D was published in August 2003. The following is a summary of the changes in revision D of thisdocument.Maximum Transient Thermal Impedance (see page 5)Updated graphAdded RC ladderUpdated patent information1.4Revision CRevision C was published in March 2002. The following is a summary of the changes in revision C of thisdocument.Updated to remove preliminary status1.5Revision BRevision B was published in November 2001. The following is a summary of the changes in revision B ofthis document.Dynamic Electrical Characteristics (see page 4)Updated capacitance values in the table1.6Revision ARevision A was published in December 2000. It is the first publication of this document.2Product OverviewThe ARF460A and ARF460B comprise a symmetric pair of common source RF power transistors designedfor push-pull scientific, commercial, medical, and industrial RF power amplifier applications up to65 MHz. They have been optimized for both linear and high-efficiency classes of operation.2.1FeaturesThe following are key features of the ARF460A/B devices:Low-cost common source RF packageLow Vth thermal coefficientLow thermal resistanceOptimized SOA for superior ruggednessRoHS compliant2.2CharacteristicsThe following are characteristics of the ARF460A/B devices at 125 V and 40.68 MHz:Output power: 150 WGain: 13 dB (Class AB)Efficiency: 75% (Class C)3Electrical SpecificationsThis section details the electrical specifications for the ARF460A/B devices.3.1Absolute Maximum RatingsThe following table shows the absolute maximum ratings for the ARF460A/B devices.All ratings at T = 25 °C unless otherwise specified.CTable 1 • Absolute Maximum RatingsSymbol Parameter Ratings UnitV DSS Drain-source voltage500VV DGO Drain-gate voltage500VI D Continuous drain current14AV GS Gate-source voltage±30VP D Total power dissipation250WRΘJC Junction-to-case thermal resistance0.40°C/WT, TJ STG Operating and storage junction temperature range–55 to 150°CT L Lead temperature 0.063 inches from case for 10 seconds300°C 3.2Thermal and Mechanical CharacteristicsThe following table shows the thermal and mechanical characteristics of the ARF460A/B device.Table 2 • Thermal and Mechanical CharacteristicsSymbol Characteristic Min Typ Max UnitRθJC Junction-to-case thermal resistance0.270.50°C/WT J Operating junction temperature–55175°CT stg Storage temperature–55175T L Soldering temperature for 10 seconds (1.6 mm from case)260Mounting torque, 6-32 or M3 screw10lbf-in1.1N-mWT Package weight0.22oz6.1g3.3Electrical PerformanceThe following table shows the static electrical characteristics of the ARF460A/B devices. These devicesare sensitive to electrostatic discharge. Proper handling procedures should be followed.Table 3 • Static Electrical CharacteristicsSymbol Parameter Min Typ Max UnitBV DSS Drain-source breakdown voltage (V = 0 V, I = 250 µA)GS D500VV DS(ON)On-state drain voltage(I = 7 A, V = 10 V)D(ON)GS4VI DSS Zero gate voltage drain current (V = V, V = 0 V)DS DSS GS25µAZero gate voltage drain current (V = 0.8 V, V = 0 V, T = 125 °C)DS DSS GS C250I GSS Gate-source leakage current (V = ±30 V, V = 0 V)DS DS±100nAg FS Forward transconductance (V = 25 V, I = 7 A)DS D 3.3 5.58mhosV GS(TH)Gate threshold voltage (V = V, I = 50 mA)DS GS D35V The following table shows the dynamic electrical characteristics of the ARF460A/B devices.Table 4 • Dynamic Electrical CharacteristicsSymbol Parameter Test Conditions Min Typ Max UnitC ISS Input capacitance V = 0 VGSV = 150 VDSf = 1 MHz 12001400pFC OSS Output capacitance150180 C RSS Reverse transfer capacitance6075t D(ON)Turn-on delay time V = 15 VGSV = 0.5 VDD DSSI = I at 25 °CD D[Cont.]R = 1.6 ΩG 7nst R Rise time6t D(OFF)Turn-off delay time20t F Fall time 4.07The following table shows the functional characteristics of the ARF460A/B devices.Table 5 • Functional CharacteristicsSymbol Characteristic Test Conditions Min Typ Max UnitG PS Common source amplifier power gain f = 40.68 MHzI = 50 mADQV = 125 VDDP = 150 WOUT 1315dBηDrain efficiency7075%ΨElectrical ruggedness VSWR 10:1No degradation in output powerNote: Pulse test: pulse width < 380 µs; duty cycle < 2%3.4Typical Performance CurvesThis section shows the typical performance curves for the ARF460A/B devices.Figure 1 • Maximum Transient Thermal ImpedanceFigure 2 • Transient Thermal Impedance ModelFigure 3 • Capacitance vs. Drain-to-Source Voltage Figure 4 • Drain Current vs. Gate-to-Source VoltageFigure 3 • Capacitance vs. Drain-to-Source Voltage Figure 4 • Drain Current vs. Gate-to-Source VoltageFigure 5 • Drain Current vs. Drain-to-Source Voltage Figure 6 • Threshold Voltage vs. TemperatureFigure 7 • Typical Output CharacteristicsThe following table shows the typical class AB large signal input and output impedance of the1. 2. 3. The following table shows the typical class AB large signal input and output impedance of the ARF460A/B devices, where I = 100 mA.DQ Table 6 • Typical Class AB Large Signal Input—Output ImpedanceFrequency (MHz)Z (Ω)IN Z (Ω)OL 2.020.9 - j 9.238 - j 2.613.5 2.4 - j 6.831 - j 14270.57 - j 2.619.6 - j 17.6400.31 - j 0.512.5 - j 15.8650.44 - j 1.96.0 - j 10.5Note :Gate shunted with 25 ΩI = 100 mADQ Conjugate of optimum load for 150 W output at V = 125 VDD3.5Typical Test CircuitThe following drawing shows the test circuit of the ARF460A/B devices.Figure 8 • 40.68 MHz Test CircuitThe following table shows the test circuit characteristics of the ARF460A/B devices.Table 7 • Test Circuit CharacteristicsComponent CharacteristicC12000 pF 100 V NPO chip mounted at gate leadC2–C5Arco 463 Mica trimmerC6–C80.1 µF 500 V ceramic chipC92200 pF 500 V chipL14t #20 AWG 0.25" ID 0.3" L approximately 80 nHL26t #16 AWG 0.312" ID 0.4" L approximately 185 nHL315t #24 AWG 0.25" ID approximately 0.85 µHL4VK200-4B ferrite choke 3 µHR1–R251 Ω 0.5 W carbonDUT ARF460A/B4Package SpecificationThis section outlines the package specification for the ARF460A/B device.4.1Package Outline DrawingThis section details the TO-247 package drawing of the ARF460A/B device. Dimensions are in millimetersand (inches).Figure 9 • Package Outline DrawingMicrosemi Corporate HeadquartersOne Enterprise, Aliso Viejo,CA 92656 USAWithin the USA: +1 (800) 713-4113Outside the USA: +1 (949) 380-6100Fax: +1 (949) 215-4996Email:***************************© 2018 Microsemi Corporation. All rights reserved. Microsemi and the Microsemi logo are trademarks of Microsemi Corporation. All other trademarks and service marks are the property of their respective owners.Microsemi makes no warranty, representation, or guarantee regarding the information contained herein or the suitability of its products and services for any particular purpose, nor does Microsemi assume any liability whatsoever arising out of the application or use of any product or circuit. The products sold hereunder and any other products sold by Microsemi have been subject to limited testing and should not be used in conjunction with mission-critical equipment or applications. Any performance specifications are believed to be reliable but are not verified, and Buyer must conduct and complete all performance and other testing of the products, alone and together with, or installed in, any end-products. Buyer shall not rely on any data and performance specifications or parameters provided by Microsemi. It is the Buyer's responsibility to independently determine suitability of any products and to test and verify the same. The information provided by Microsemi hereunder is provided "as is, where is" and with all faults, and the entire risk associated with such information is entirely with the Buyer. Microsemi does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other IP rights, whether with regard to such information itself or anything described by such information. Information provided in this document is proprietary to Microsemi, and Microsemi reserves the right to make any changes to the information in this document or to any products and services at any time without notice.Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for aerospace & defense, communications, data center and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world's standard for time; voice processing devices; RF solutions; discrete components; enterprise storage and communication solutions; security technologies and scalable anti-tamper products; Ethernet solutions; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services. Microsemi is headquartered in Aliso Viejo, California, and has approximately 4,800 employees globally. Learn more at .050-5966。

nRF24L01P_Datasheet数据手册

All rights reserved.Reproduction in whole or in part is prohibited without the prior written permission of the copyright holder.September 2008nRF24L01+Single Chip 2.4GHz TransceiverProduct Specification v1.0Key Features•Worldwide 2.4GHz ISM band operation •250kbps, 1Mbps and 2Mbps on air data rates•Ultra low power operation•11.3mA TX at 0dBm output power •13.5mA RX at 2Mbps air data rate •900nA in power down •26µA in standby-I•On chip voltage regulator • 1.9 to 3.6V supply range •Enhanced ShockBurst™ •Automatic packet handling•Auto packet transaction handling • 6 data pipe MultiCeiver™•Drop-in compatibility with nRF24L01•On-air compatible in 250kbps and 1Mbps with nRF2401A, nRF2402, nRF24E1 and nRF24E2•Low cost BOM•±60ppm 16MHz crystal •5V tolerant inputs•Compact 20-pin 4x4mm QFN packageApplications•Wireless PC Peripherals•Mouse, keyboards and remotes •3-in-1 desktop bundles•Advanced Media center remote controls •VoIP headsets •Game controllers•Sports watches and sensors•RF remote controls for consumer electronics •Home and commercial automation •Ultra low power sensor networks •Active RFID•Asset tracking systems •ToysnRF24L01+ Product SpecificationLiability disclaimerNordic Semiconductor ASA reserves the right to make changes without further notice to the product to improve reliability, function or design. Nordic Semiconductor ASA does not assume any liability arising out of the application or use of any product or circuits described herein.All application information is advisory and does not form part of the specification.Limiting valuesStress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the specifications are not implied. Exposure to limiting values for extended periods may affect device reliability.Life support applicationsThese products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Nordic Semiconductor ASA cus-tomers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Nordic Semiconductor ASA for any damages resulting from such improper use or sale.Contact detailsVisit www.nordicsemi.no for Nordic Semiconductor sales offices and distributors worldwideMain office:Otto Nielsens vei 127004 TrondheimPhone: +47 72 89 89 00 Fax: +47 72 89 89 89www.nordicsemi.noData sheet statusObjective product specificationThis product specification contains target specifications for product development.Preliminary product specification This product specification contains preliminary data; supplementarydata may be published from Nordic Semiconductor ASA later.Product specification This product specification contains final product specifications. NordicSemiconductor ASA reserves the right to make changes at any time without notice in order to improve design and supply the best possibleproduct.nRF24L01+ Product Specification Writing ConventionsThis product specification follows a set of typographic rules that makes the document consistent and easy to read. The following writing conventions are used:•Commands, bit state conditions, and register names are written in Courier .•Pin names and pin signal conditions are written in Courier bold .•Cross references are underlined and highlighted in blue .Revision HistoryAttention!DateVersion DescriptionSeptember 2008 1.0Observe precaution for handling Electrostatic Sensitive Device. HBM (Human Body Model) > 1Kv MM (Machine Model) > 200VnRF24L01+ Product Specification Contents1Introduction (7)1.1Features (8)1.2Block diagram (9)2Pin Information (10)2.1Pin assignment (10)2.2Pin functions (11)3Absolute maximum ratings (12)4Operating conditions (13)5Electrical specifications (14)5.1Power consumption (14)5.2General RF conditions (15)5.3Transmitter operation (15)5.4Receiver operation (16)5.5Crystal specifications (19)5.6DC characteristics (20)5.7Power on reset (20)6Radio Control (21)6.1Operational Modes (21)6.1.1State diagram (21)6.1.2Power Down Mode (22)6.1.3Standby Modes (22)6.1.4RX mode (23)6.1.5TX mode (23)6.1.6Operational modes configuration (24)6.1.7Timing Information (24)6.2Air data rate (25)6.3RF channel frequency (25)6.4Received Power Detector measurements (25)6.5PA control (26)6.6RX/TX control (26)7Enhanced ShockBurst™ (27)7.1Features (27)7.2Enhanced ShockBurst™ overview (27)7.3Enhanced Shockburst™ packet format (28)7.3.1Preamble (28)7.3.2Address (28)7.3.3Packet control field (28)7.3.4Payload (29)7.3.5CRC (Cyclic Redundancy Check) (30)7.3.6Automatic packet assembly (31)7.3.7Automatic packet disassembly (32)7.4Automatic packet transaction handling (33)7.4.1Auto acknowledgement (33)7.4.2Auto Retransmission (ART) (33)nRF24L01+ Product Specification7.5Enhanced ShockBurst flowcharts (35)7.5.1PTX operation (35)7.5.2PRX operation (37)7.6MultiCeiver™ (39)7.7Enhanced ShockBurst™ timing (42)7.8Enhanced ShockBurst™ transaction diagram (45)7.8.1Single transaction with ACK packet and interrupts (45)7.8.2Single transaction with a lost packet (46)7.8.3Single transaction with a lost ACK packet (46)7.8.4Single transaction with ACK payload packet (47)7.8.5Single transaction with ACK payload packet and lost packet (47)7.8.6Two transactions with ACK payload packet and the firstACK packet lost (48)7.8.7Two transactions where max retransmissions is reached (48)7.9Compatibility with ShockBurst™ (49)7.9.1ShockBurst™ packet format (49)8Data and Control Interface (50)8.1Features (50)8.2Functional description (50)8.3SPI operation (50)8.3.1SPI commands (50)8.3.2SPI timing (52)8.4Data FIFO (55)8.5Interrupt (56)9Register Map (57)9.1Register map table (57)10Peripheral RF Information (64)10.1Antenna output (64)10.2Crystal oscillator (64)10.3nRF24L01+ crystal sharing with an MCU (64)10.3.1Crystal parameters (64)10.3.2Input crystal amplitude and current consumption (64)10.4PCB layout and decoupling guidelines (65)11Application example (66)11.1PCB layout examples (67)12Mechanical specifications (71)13Ordering information (73)13.1Package marking (73)13.2Abbreviations (73)13.3Product options (73)13.3.1RF silicon (73)13.3.2Development tools (73)14Glossary of Terms (74)Appendix A - Enhanced ShockBurst™ - Configuration and communication example (75)Enhanced ShockBurst™ transmitting payload (75)nRF24L01+ Product Specification Enhanced ShockBurst™ receive payload (76)Appendix B - Configuration for compatibility with nRF24XX (77)Appendix C - Constant carrier wave output for testing (78)Configuration (78)nRF24L01+ Product Specification1 IntroductionThe nRF24L01+ is a single chip 2.4GHz transceiver with an embedded baseband protocol engine (Enhanced ShockBurst™), suitable for ultra low power wireless applications. The nRF24L01+ is designed for operation in the world wide ISM frequency band at 2.400 - 2.4835GHz.To design a radio system with the nRF24L01+, you simply need an MCU (microcontroller) and a few exter-nal passive components.You can operate and configure the nRF24L01+ through a Serial Peripheral Interface (SPI). The register map, which is accessible through the SPI, contains all configuration registers in the nRF24L01+ and is accessible in all operation modes of the chip.The embedded baseband protocol engine (Enhanced ShockBurst™) is based on packet communication and supports various modes from manual operation to advanced autonomous protocol operation. Internal FIFOs ensure a smooth data flow between the radio front end and the system’s MCU. Enhanced Shock-Burst™ reduces system cost by handling all the high speed link layer operations.The radio front end uses GFSK modulation. It has user configurable parameters like frequency channel, output power and air data rate. nRF24L01+ supports an air data rate of 250 kbps, 1 Mbps and 2Mbps. The high air data rate combined with two power saving modes make the nRF24L01+ very suitable for ultra low power designs.nRF24L01+ is drop-in compatible with nRF24L01 and on-air compatible with nRF2401A, nRF2402,nRF24E1 and nRF24E2. Intermodulation and wideband blocking values in nRF24L01+ are much improved in comparison to the nRF24L01 and the addition of internal filtering to nRF24L01+ has improved the margins for meeting RF regulatory standards.Internal voltage regulators ensure a high Power Supply Rejection Ratio (PSRR) and a wide power supply range.nRF24L01+ Product Specification 1.1 FeaturesFeatures of the nRF24L01+ include:•RadioX Worldwide 2.4GHz ISM band operationX126 RF channelsX Common RX and TX interfaceX GFSK modulationX250kbps, 1 and 2Mbps air data rateX1MHz non-overlapping channel spacing at 1MbpsX2MHz non-overlapping channel spacing at 2Mbps•TransmitterX Programmable output power: 0, -6, -12 or -18dBmX11.3mA at 0dBm output power•ReceiverX Fast AGC for improved dynamic rangeX Integrated channel filtersX13.5mA at 2MbpsX-82dBm sensitivity at 2MbpsX-85dBm sensitivity at 1MbpsX-94dBm sensitivity at 250kbps•RF SynthesizerX Fully integrated synthesizerX No external loop filer, VCO varactor diode or resonatorX Accepts low cost ±60ppm 16MHz crystal•Enhanced ShockBurst™X1 to 32 bytes dynamic payload lengthX Automatic packet handlingX Auto packet transaction handlingX6 data pipe MultiCeiver™ for 1:6 star networks•Power ManagementX Integrated voltage regulatorX1.9 to 3.6V supply rangeX Idle modes with fast start-up times for advanced power managementX26µA Standby-I mode, 900nA power down modeX Max 1.5ms start-up from power down modeX Max 130us start-up from standby-I mode•Host InterfaceX4-pin hardware SPIX Max 10MbpsX3 separate 32 bytes TX and RX FIFOsX5V tolerant inputs•Compact 20-pin 4x4mm QFN packagenRF24L01+ Product Specification1.2 Block diagram ArrayFigure 1. nRF24L01+ block diagramnRF24L01+ Product Specification 2 Pin Information2.1 Pin assignment ArrayFigure 2. nRF24L01+ pin assignment (top view) for the QFN20 4x4 package2.2 Pin functionsPin Name Pin function Description1CE Digital Input Chip Enable Activates RX or TX mode2CSN Digital Input SPI Chip Select3 SCK Digital Input SPI Clock4MOSI Digital Input SPI Slave Data Input5 MISO Digital Output SPI Slave Data Output, with tri-state option6IRQ Digital Output Maskable interrupt pin. Active low7 VDD Power Power Supply (+1.9V - +3.6V DC)8VSS Power Ground (0V)9XC2Analog Output Crystal Pin 210XC1Analog Input Crystal Pin 111VDD_PA Power Output Power Supply Output (+1.8V) for the internalnRF24L01+ Power Amplifier. Must be connectedto ANT1 and ANT2 as shown in Figure 32.12ANT1RF Antenna interface 113ANT2RF Antenna interface 214VSS Power Ground (0V)15VDD Power Power Supply (+1.9V - +3.6V DC)16IREF Analog Input Reference current. Connect a 22kΩ resistor toground. See Figure 32.17VSS Power Ground (0V)18VDD Power Power Supply (+1.9V - +3.6V DC)19DVDD Power Output Internal digital supply output for de-coupling pur-poses. See Figure 32.20VSS Power Ground (0V)Table 1. nRF24L01+ pin function3 Absolute maximum ratingsNote: Exceeding one or more of the limiting values may cause permanent damage to nRF24L01+.Operating conditions Minimum Maximum Units Supply voltagesVDD-0.3 3.6V VSS0V Input voltageV I-0.3 5.25V Output voltageV O VSS to VDD VSS to VDDTotal Power DissipationP D (T A=85°C)60mW TemperaturesOperating Temperature-40+85°C Storage Temperature-40+125°CTable 2. Absolute maximum ratings4 Operating conditionsSymbol Parameter (condition)Notes Min.Typ.Max.Units VDD Supply voltage 1.9 3.0 3.6V VDD Supply voltage if input signals >3.6V 2.7 3.0 3.3V TEMP Operating Temperature -40+27+85ºCTable 3. Operating conditionsConditions: VDD = +3V, VSS = 0V, T A = - 40ºC to + 85ºC5.1 Power consumptionTable 4. Power consumptionSymbol Parameter (condition)NotesMin.Typ.Max.Units Idle modesI VDD_PD Supply current in power down900nA I VDD_ST1Supply current in standby-I modea a.This current is for a 12pF crystal. Current when using external clock is dependent on signal swing.26µA I VDD_ST2Supply current in standby-II mode 320µA I VDD_SU Average current during 1.5ms crystal oscillator startup 400µATransmitI VDD_TX0Supply current @ 0dBm output powerb b.Antenna load impedance = 15Ω+j88Ω..11.3mA I VDD_TX6Supply current @ -6dBm outputpowerb 9.0mA I VDD_TX12Supply current @ -12dBm outputpowerb 7.5mA I VDD_TX18Supply current @ -18dBm outputpowerb 7.0mA I VDD_AVG Average Supply current @ -6dBm out-put power, ShockBurst™c c.Antenna load impedance = 15Ω+j88Ω. Average data rate 10kbps and max. payload length packets.0.12mA I VDD_TXS Average current during TX settlingd d.Average current consumption during TX startup (130µs) and when changing mode from RX to TX (130µs).8.0mA ReceiveI VDD_2M Supply current 2Mbps 13.5mA I VDD_1M Supply current 1Mbps 13.1mA I VDD_250Supply current 250kbps12.6mA I VDD_RXSAverage current during RX settlinge e.Average current consumption during RX startup (130µs) and when changing mode from TX to RX (130µs).8.9mATable 5. General RF conditions5.3 Transmitter operationTable 6. Transmitter operationSymbol Parameter (condition)NotesMin.Typ.Max.Units f OP Operating frequencya a.Regulatory standards determine the band range you can use.24002525MHz PLL res PLL Programming resolution 1MHz f XTAL Crystal frequency16MHz Δf 250Frequency deviation @ 250kbps ±160kHz Δf 1M Frequency deviation @ 1Mbps ±160kHz Δf 2M Frequency deviation @ 2Mbps±320kHz R GFSKAir Data rateb b.Data rate in each burst on-air2502000kbps F CHANNEL 1M Non-overlapping channel spacing @ 250kbps/1Mbpsc c.The minimum channel spacing is 1MHz1MHz F CHANNEL 2M Non-overlapping channel spacing @ 2Mbpsc 2MHzSymbol Parameter (condition)Notes Min.Typ.Max.Units P RF Maximum Output Powera a.Antenna load impedance = 15Ω+j88Ω0+4dBm P RFC RF Power Control Range 161820dB P RFCR RF Power Accuracy±4dB P BW220dB Bandwidth for Modulated Carrier (2Mbps)18002000kHz P BW120dB Bandwidth for Modulated Carrier (1Mbps)9001000kHz P BW25020dB Bandwidth for Modulated Carrier (250kbps)700800kHz P RF1.21st Adjacent Channel Transmit Power 2MHz (2Mbps)-20dBc P RF2.22nd Adjacent Channel Transmit Power 4MHz (2Mbps)-50dBc P RF1.11st Adjacent Channel Transmit Power 1MHz (1Mbps)-20dBc P RF2.12nd Adjacent Channel Transmit Power 2MHz (1Mbps)-45dBc P RF1.2501st Adjacent Channel Transmit Power 1MHz (250kbps)-30dBc P RF2.2502nd Adjacent Channel Transmit Power 2MHz (250kbps)-45dBc5.4 Receiver operationTable 7. RX SensitivityTable 8. RX selectivity according to ETSI EN 300 440-1 V1.3.1 (2001-09) page 27Datarate Symbol Parameter (condition)Notes Min.Typ.Max.Units RX max Maximum received signal at <0.1% BER 0dBm 2Mbps RX SENS Sensitivity (0.1%BER) @2Mbps -82dBm 1Mbps RX SENS Sensitivity (0.1%BER) @1Mbps -85dBm 250kbpsRX SENSSensitivity (0.1%BER) @250kbps-94dBmDatarate Symbol Parameter (condition)Notes Min.Typ.Max.Units 2Mbps C/I CO C/I Co-channel7dBc C/I 1ST 1st ACS (Adjacent Channel Selectivity) C/I 2MHz 3dBc C/I 2ND 2nd ACS C/I 4MHz -17dBc C/I 3RD 3rd ACS C/I 6MHz-21dBc C/I Nth N th ACS C/I, f i> 12MHz-40dBc C/I Nth N th ACS C/I, f i> 36MHzaa.Narrow Band (In Band) Blocking measurements: 0 to ±40MHz; 1MHz step sizeFor Interferer frequency offsets n*2*fxtal, blocking performance is degraded by approximately 5dB com-pared to adjacent figures.-48dBc 1MbpsC/I CO C/I Co-channel 9dBc C/I 1ST 1st ACS C/I 1MHz 8dBc C/I 2ND 2nd ACS C/I 2MHz -20dBc C/I 3RD 3rd ACS C/I 3MHz -30dBc C/I Nth N th ACS C/I, f i> 6MHz-40dBc C/I Nth N th ACS C/I, f i> 25MHza-47dBc 250kbps C/I CO C/I Co-channel12dBc C/I 1ST 1st ACS C/I 1MHz -12dBc C/I 2ND 2nd ACS C/I 2MHz -33dBc C/I 3RD 3rd ACS C/I 3MHz -38dBc C/I Nth N th ACS C/I, f i> 6MHz-50dBc C/I Nth N th ACS C/I, f i> 25MHza-60dBcTable 9. RX selectivity with nRF24L01+ equal modulation on interfering signal. Measured usingPin = -67dBm for wanted signal.2MbpsC/I CO C/I Co-channel (Modulated carrier)11dBc C/I 1ST 1st ACS C/I 2MHz 4dBc C/I 2ND 2nd ACS C/I 4MHz -18dBc C/I 3RD 3rd ACS C/I 6MHz-24dBc C/I Nth N th ACS C/I, f i > 12MHz -40dBc C/I NthN th ACS C/I, f i > 36MHz a-48dBc 1MbpsC/I CO C/I Co-channel 12dBc C/I 1ST 1st ACS C/I 1MHz 8dBc C/I 2ND 2nd ACS C/I 2MHz -21dBc C/I 3RD 3rd ACS C/I 3MHz -30dBc C/I Nth N th ACS C/I, f i > 6MHz -40dBc C/I NthN th ACS C/I, f i > 25MHz a -50dBc 250kbpsC/I CO C/I Co-channel 7dBc C/I 1ST 1st ACS C/I 1MHz -12dBc C/I 2ND 2nd ACS C/I 2MHz -34dBc C/I 3RD 3rd ACS C/I 3MHz -39dBc C/I Nth N th ACS C/I, f i >6MHz -50dBc C/I NthN th ACS C/I, f i >25MHza -60dBca.Narrow Band (In Band) Blocking measurements: 0 to ±40MHz; 1MHz step sizeWide Band Blocking measurements: 30MHz to 2000MHz; 10MHz step size 2000MHz to 2399MHz; 3MHz step size 2484MHz to 3000MHz; 3MHz step size 3GHz to 12.75GHz; 25MHz step sizeWanted signal for wideband blocking measurements: -67dBm in 1Mbps and 2Mbps mode -77dBm in 250kbps modeFor Interferer frequency offsets n*2*fxtal, blocking performance are degraded by approximately 5dB compared to adjacent figures.If the wanted signal is 3dB or more above the sensitivity level then, the carrier/interferer ratio is indepen-dent of the wanted signal level for a given frequency offset.Note: Wanted signal level at Pin = -64 dBm. Two interferers with equal input power are used. Theinterferer closest in frequency is unmodulated, the other interferer is modulated equal with the wanted signal. The input power of interferers where the sensitivity equals BER = 0.1% is pre-sented. Table 10. RX intermodulation test performed according to Bluetooth Specification version 2.02Mbps P_IM(6Input power of IM interferers at 6 and 12MHz offset from wanted signal-42dBmP_IM(8)Input power of IM interferers at 8 and 16MHz offset from wanted signal-38dBmP_IM(10)Input power of IM interferers at 10 and 20MHz offset from wanted signal-37dBm1Mbps P_IM(3)Input power of IM interferers at 3 and 6MHz offset from wanted signal-36dBmP_IM(4)Input power of IM interferers at 4 and 8MHz offset from wanted signal-36dBmP_IM(5)Input power of IM interferers at 5 and 10MHz offset from wanted signal-36dBm250kbps P_IM(3)Input power of IM interferers at 3 and 6MHz offset from wanted signal-36dBmP_IM(4)Input power of IM interferers at 4 and 8MHz offset from wanted signal-36dBmP_IM(5)Input power of IM interferers at 5 and 10MHz offset from wanted signal-36dBm5.5 Crystal specificationsTable 11. Crystal specificationsThe crystal oscillator startup time is proportional to the crystal equivalent inductance. The trend in crystal design is to reduce the physical outline. An effect of a small outline is an increase in equivalent serialinductance Ls, which gives a longer startup time. The maximum crystal oscillator startup time, Tpd2stby = 1.5 ms, is set using a crystal with equivalent serial inductance of maximum 30mH. An application specific worst case startup time can be calculated as :Tpd2stby= Ls/30mH *1.5ms if Ls exceeds 30mH.Note: In some crystal datasheets Ls is called L1 or Lm and Cs is called C1 or Cm.Figure 3. Equivalent crystal componentsSymbol Parameter (condition)NotesMin.Typ.Max.Units Fxo Crystal Frequency 16MHz ΔF Tolerancea ba. Frequency accuracy including; tolerance at 25ºC , temperature drift, aging and crystal loading.b. Frequency regulations in certain regions set tighter requirements for frequency tolerance (For example, Japan and South Korea specify max. +/- 50ppm).±60ppm C 0Equivalent parallel capacitance 1.57.0pF Ls Equivalent serial inductance cc.Startup time from power down to standby mode is dependant on the Ls parameter. See Table 16. on page 24 for details.30mH C L Load capacitance81216pF ESREquivalent Series Resistance100ΩCoCs LsESR5.6 DC characteristicsTable 12. Digital input pinTable 13. Digital output pin5.7 Power on resetTable 14. Power on resetSymbol Parameter (condition)NotesMin.Typ.Max.Units V IH HIGH level input voltage 0.7VDD 5.25aa.If the input signal >3.6V, the VDD of the nRF24L01+ must be between 2.7V and 3.3V (3.0V±10%)V V ILLOW level input voltageVSS0.3VDD V SymbolParameter (condition)NotesMin.Typ.Max.Units V OH HIGH level output voltage (I OH =-0.25mA)VDD -0.3VDD V V OLLOW level output voltage (I OL =0.25mA)0.3VSymbol Parameter (condition)NotesMin.Typ.Max.Units T PUP Power ramp up time a a.From 0V to 1.9V.100ms T PORPower on resetbb.Measured from when the VDD reaches 1.9V to when the reset finishes.1100ms6 Radio ControlThis chapter describes the nRF24L01+ radio transceiver’s operating modes and the parameters used to control the radio.The nRF24L01+ has a built-in state machine that controls the transitions between the chip’s operating modes. The state machine takes input from user defined register values and internal signals.6.1 Operational ModesYou can configure the nRF24L01+ in power down, standby, RX or TX mode. This section describes these modes in detail.6.1.1 State diagramThe state diagram in Figure 4. shows the operating modes and how they function. There are three types of distinct states highlighted in the state diagram:•Recommended operating mode: is a recommended state used during normal operation.•Possible operating mode: is a possible operating state, but is not used during normal operation.•Transition state: is a time limited state used during start up of the oscillator and settling of the PLL. When the VDD reaches 1.9V or higher nRF24L01+ enters the Power on reset state where it remains in reset until entering the Power Down mode..Figure 4. Radio control state diagram6.1.2 Power Down ModeIn power down mode nRF24L01+ is disabled using minimal current consumption. All register values avail-able are maintained and the SPI is kept active, enabling change of configuration and the uploading/down-loading of data registers. For start up times see Table 16. on page 24. Power down mode is entered by setting the PWR_UP bit in the CONFIG register low.6.1.3 Standby Modes6.1.3.1 Standby-I modeBy setting the PWR_UP bit in the CONFIG register to 1, the device enters standby-I mode. Standby-I mode is used to minimize average current consumption while maintaining short start up times. In this mode only part of the crystal oscillator is active. Change to active modes only happens if CE is set high and when CE is set low, the nRF24L01 returns to standby-I mode from both the TX and RX modes.6.1.3.2 Standby-II modeIn standby-II mode extra clock buffers are active and more current is used compared to standby-I mode. nRF24L01+ enters standby-II mode if CE is held high on a PTX device with an empty TX FIFO. If a new packet is uploaded to the TX FIFO, the PLL immediately starts and the packet is transmitted after the nor-mal PLL settling delay (130µs).Register values are maintained and the SPI can be activated during both standby modes. For start up times see Table 16. on page 24.6.1.4 RX modeThe RX mode is an active mode where the nRF24L01+ radio is used as a receiver. To enter this mode, the nRF24L01+ must have the PWR_UP bit, PRIM_RX bit and the CE pin set high.In RX mode the receiver demodulates the signals from the RF channel, constantly presenting the demodu-lated data to the baseband protocol engine. The baseband protocol engine constantly searches for a valid packet. If a valid packet is found (by a matching address and a valid CRC) the payload of the packet is pre-sented in a vacant slot in the RX FIFOs. If the RX FIFOs are full, the received packet is discarded.The nRF24L01+ remains in RX mode until the MCU configures it to standby-I mode or power down mode. However, if the automatic protocol features (Enhanced ShockBurst™) in the baseband protocol engine are enabled, the nRF24L01+ can enter other modes in order to execute the protocol.In RX mode a Received Power Detector (RPD) signal is available. The RPD is a signal that is set high when a RF signal higher than -64 dBm is detected inside the receiving frequency channel. The internal RPD signal is filtered before presented to the RPD register. The RF signal must be present for at least 40µs before the RPD is set high. How to use the RPD is described in Section 6.4 on page 25.6.1.5 TX modeThe TX mode is an active mode for transmitting packets. To enter this mode, the nRF24L01+ must have the PWR_UP bit set high, PRIM_RX bit set low, a payload in the TX FIFO and a high pulse on the CE for more than 10µs.The nRF24L01+ stays in TX mode until it finishes transmitting a packet. If CE = 0, nRF24L01+ returns to standby-I mode. If CE = 1, the status of the TX FIFO determines the next action. If the TX FIFO is not empty the nRF24L01+ remains in TX mode and transmits the next packet. If the TX FIFO is empty the nRF24L01+ goes into standby-II mode. The nRF24L01+ transmitter PLL operates in open loop when in TX mode. It is important never to keep the nRF24L01+ in TX mode for more than 4ms at a time. If the Enhanced ShockBurst™ features are enabled, nRF24L01+ is never in TX mode longer than 4ms.6.1.6 Operational modes configurationThe following table (Table 15.) describes how to configure the operational modes.Table 15. nRF24L01+ main modes6.1.7 Timing InformationThe timing information in this section relates to the transitions between modes and the timing for the CE pin. The transition from TX mode to RX mode or vice versa is the same as the transition from the standby modes to TX mode or RX mode (max. 130µs), as described in Table 16.Table 16. Operational timing of nRF24L01+For nRF24L01+ to go from power down mode to TX or RX mode it must first pass through stand-by mode. There must be a delay of Tpd2stby (see Table 16.) after the nRF24L01+ leaves power down mode before the CE is set high.Note: If VDD is turned off the register value is lost and you must configure nRF24L01+ before enter-ing the TX or RX modes. ModePWR_UP register PRIM_RX register CE input pin FIFO state RX mode111-TX mode101Data in TX FIFOs. Will empty all levels in TX FIFOs a .a.If CE is held high all TX FIFOs are emptied and all necessary ACK and possible retransmits are car-ried out. The transmission continues as long as the TX FIFO is refilled. If the TX FIFO is empty whenthe CE is still high, nRF24L01+ enters standby-II mode. In this mode the transmission of a packet isstarted as soon as the CSN is set high after an upload (UL) of a packet to TX FIFO.TX mode10Minimum 10µs high pulse Data in TX FIFOs.Will empty one level in TX FIFOs b .b.This operating mode pulses the CE high for at least 10µs. This allows one packet to be transmitted.This is the normal operating mode. After the packet is transmitted, the nRF24L01+ enters standby-Imode.Standby-II101TX FIFO empty.Standby-I1-0No ongoing packet transmission.Power Down 0---Name nRF24L01+Notes Max.ments Tpd2stby Power Down Î Standby mode 150µsWith external clock a a.See Table 11. on page 19 for crystal specifications.1.5msExternal crystal, Ls < 30mH 3msExternal crystal, Ls = 60mH 4.5msExternal crystal, Ls = 90mH Tstby2a Standby modes Î TX/RX mode130µs Thce Minimum CE high10µs Tpece2csn Delay from CE positive edge to CSNlow 4µs。

MT3336规格书

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MT3336 GPS Host-Based Solution Confidential A
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2014 LX商品说明书

1 LX shown in Starfire Pearl // Options shown.3LX shown in Silver Lining Metallic // Options shown.2DO EVERYTHING YOU CAN IMAGINE.AND A FEW MORE THINGS THAT YOU CAN’T. THE UNPARALLELED 2014 LX.4LX shown in Nebula Gray Pearl // Options shown.56LX shown in Parchment leather with Mahogany wood trim // Options shown.7EXCEPTIONALL8LX shown in Silver Lining Metallic // Options shown.910LX shown in Parchment leather with Mahogany wood trim // Options shown.11LX shown in Silver Lining Metallic // Options shown.13The available Wide-view Front Monitor 16 captures a broad view of the forward and peripheral surroundings, which then displays on the Navigation15403 lb-ftt orque @ 3,600 rpm 1290% of maximum torqueavailable @ 2,200 rpm7,000-poundt owing capacity 13,14G. Available Wide-view Front and Side Monitor system 4 H. Blackleather interior with Mahogany trim I. Available Rear-SeatEntertainment System (RSES ) J. Electroluminescent instrumentation with multi-information display K. Steering-wheel controls L. USB connectivity1716 A. Transfer case, Crawl Control,11 vehicle height andsuspension controls B. Parchment leather interior with Mahogany trim C. Power open/close rear door D. Subscription-free Lexus Enform App Suite 7 E. Versatile rear seating F. Three-row, eight-passenger seating20Four-zone automatic climate control with smog sensor and automatic circulation mode // Lexus Memory System // Power tilt-and-slide moonroof // Power rear door // Leather-trimmed interior // Mahogany interior trim // 10-airbag system 20 // Navigation System 17 // Lexus Enform 7 one-year trial subscription // Lexus Enform App Suite 7 // Full-timefour-wheel drive // Adaptive Variable Suspension (AVS ) with Active Height Control (X-AHC ) // Crawl Control 11 with T urn Assist // 14-way driver’s seat(including dual-function lumbar and cushion extender ) // Power-sliding,60/40-split middle-row seatwith 40/20/40-split seatback // Auto on/off High-Intensity Discharge (HID ) headlamps with Dual-swivel Adaptive Front Lighting System (AFS )21 // Wood- and leather-trimmed steering wheel and shift knob // Smart Stop technology 22 // T railer Sway Control 1820-in split-five-spoke alloy wheels 27 STANDARDKEYSTANDARD FEATURESPACKAGES WHEELS For complete list, visit /LX/featuresINDIVIDUAL OPTIONSMark Levinson 19-speaker 450-watt @ less than0.1% THD, 20–20,000 Hz 23 Reference Surround Sound Audio System 1 // Heated and ventilated front seats and heated second-row seats // Dual-screen DVD Rear-Seat Entertainment System (RSES )9 // Wide-view Front and Side Monitor system 4 with Intuitive Parking Assist // Pre-Collision System (PCS )15 and Dynamic Radar Cruise Control 24For complete list, visit /LX/options For complete list, visit /LX/packagesFor complete list of Genuine Lexus Accessories, visit /LX/accessoriesLUXURY PACKAGE WITH PRE-COLLISION SYSTEM AND DYNAMIC RADAR CRUISE CONTROLSemi-aniline leather-trimmed interior with contrast stitching // Heated steering wheel // Heated and ventilated front seats // Heated second-row seats // Mahogany-trimmed door switchplates and rear-center armrest cover // Front-seat cool box // SmartAccess 25,26 cardkeyLX shown in Silver Lining Metallic // Options shown.21HEIGHT 75.6 INKEY SPECS5.7L V87.5S12,28LX 570ENGINEPERFORMANCE12 / 17 / 1429FUEL ECONOMY, EPA-ESTIMATED RATINGS (CITY / HIGHWAY / COMBINED ) 4W D6-SPEEDSTANDARDDRIVETRAINSEQUENTIAL-SHIFT ELECTRONICALLY CONTROLLED TRANSMISSIONEST MPG0–60 INFor complete specs, visit /LX/specsWIDTH 77.6 INOVERALL LENGTH 197.0 INWHEELBASE 112.2 INHORSEPOWER383HP12TORQUE GROUND CLEARANCECARGO CAPACITY (MAX )TOWING CAPACITY403LB-FT 128.9IN83.1CU FT 57,000LB 13,1423EXTERIORSILVER LINING METALLIC STARFIRE PEARL NEBULA GRAY PEARLSATIN CASHMERE METALLICCLARET MICABLACK ONYX22INTERIOR BLACKLEATHERPARCHMENTLEATHERTRIMMAHOGANYFPOFSC Logo—, NOVEMBER 14, 2012“THE BIGGEST, MOST CAPABLE AND MOST OPULENT SPORT-UTILITY ON THE BLOCK.”WARRANTY Four-year/50,000-mile Lexus Limited Warranty. Six-year/70,000-mile Powertrain Warranty. Six-year/unlimited-mileage Corrosion Perforation Warranty. All warranties with zero deductible. See the LX Warranty and Services Guide at your Lexus dealer for details. DISCLOSURES 1. Mark Levinson ® is a registered trademark of Harman International Industries, Inc. 2. The LX 570 is designed to meet most off-road driving requirements. Abusive use may result in bodily harm or damage. Lexus encourages responsible operation to help protect you, your vehicle and the environment. Seatbelts should be worn at all times. Please do not allow passengers to ride in the cargo area. Tow hitch receivers/ball mount kits are not intended to provide crash protection. 3. The backup camera does not provide a comprehensive view of the rear area of the vehicle. Y ou should also look around outside your vehicle and use your mirrors to confirm rearward clearance. Cold weather may limit effectiveness and view may become cloudy. 4. The Wide-view Front and Side Monitor does not provide a comprehensive view of the front and side areas of the vehicle. Y ou should also look around outside your vehicle and use your mirrors to confirm clearance. Cold weather will limit effectiveness and view may become cloudy. 5. The Wide-view Side Monitor system does not provide a comprehensive view of the front passenger-side area of the vehicle. Y ou should also look around outside your vehicle and use your mirrors to confirm clearance. Cold weather will limit effectiveness and view may become cloudy. 6. Cargo and load capacity limited by weight and distribution. 7. Always drive safely, obey traffic laws & focus on the road while driving. Apps/services vary by phone/carrier; functionality depends on many factors. Select apps use large amounts of data, you are responsible for all charges. Apps/services are subject to change. Apps identified by ™ or ® are trademarks or registered trademarks of their respective companies. For enrollment, cost and more details, see /enform. 8. Contact with the response center may not be available in all areas. Service Agreements required. A variety of subscription terms available; charges will vary. See for details. 9. A single-disc DVD player is standard. A separate DVD player or game system utilizing the center console’s video/audio inputs is required in order to use the split-screen function of the dual-screen system. 10. Headphones are for passenger use only. Do not use while operating vehicle. 11. Crawl Control is designed for driving on difficult terrain at low speeds. It assists the driver by controlling acceleration and braking, allowing the driver to focus on steering. The LX 570 is designed to meet off-road driving requirements, but off-roading is inherently dangerous. Always wear seatbelts. 12. Ratings achieved using the required premium unleaded gasoline with an octane rating of 91 or higher. If premium fuel is not used, performance will decrease. 13. Before towing, confirm your vehicle and trailer are compatible, hooked up properly and you have any necessary additional equipment. If gross trailer weight is above 5,000 lb (2,268 kg ), it is necessary to use a weight-distributing hitch with sufficient capacity. Do not exceed any Weight Ratings and follow all instructions and cautions from your trailer-hitch manufacturer and vehicle Owner’s Manual . The maximum amount you can tow depends on the total weight of any cargo, occupants and available equipment. 14. Please consult your Lexus dealer or Owner’s Manual for towing and load specifications. 15. The Pre-Collision System is designed to help reduce the crash speed and damage in certain frontal collisions only. It is not a collision-avoidance system and is not a substitute for safe and attentive driving. System effectiveness depends on many factors, such as speed, driver input and road conditions. See Owner’s Manual for further information. 16. The Wide-view Front Monitor does not provide a comprehensive view of the front area of the vehicle. Y ou should also look around outside your vehicle and use your mirrors to confirm clearance. Cold weather will limit effectiveness and view may become cloudy. 17. Availability and accuracy of the information provided by the Navigation System or any SiriusXM™ and/or HD Radio™ services mentioned (if installed ) are dependent upon many factors. Use common sense when relying on information provided. Services not available in every city or roadway. Periodic Enform app updates do not include Navigation updates. Navigation updates are available at an additional cost from your local dealer. See Navigation Owner’s Manual or contact SiriusXM for details. 18. Trailer Sway Control (TSC ) is an electronic system designed to help the driver maintain vehicle control under adverse conditions. It is not a substitute for safe driving practices. Factors including speed, road conditions and driver steering input can all affect whether TSC will be effective in preventing a loss of control. See Owner’s Manual for details. 19. TORSEN ® is a registered trademark of Zexel Torsen, Inc. 20. All the airbag (AB ) systems are Supplemental Restraint Systems. All ABs are designed to inflate only under certain conditions and in certain types of severe collisions: frontal and knee ABs typically inflate in frontal collisions; side and side curtain ABs in side collisions; Roll-Sensing Curtain ABs at a severe tilt degree, roll or lateral G-force. In all other accidents, the ABs will not inflate. To decrease the risk of injury from an inflating AB, always wear seatbelts, sit upright in the middle of the seat as far back as possible and do not lean against the door. Do not put objects in front of an AB or around the seatback. Do not use a rearward-facing child seat in any front passenger seat. The force of an inflating AB may cause serious injury or death. See Owner’s Manual for further information/warnings. 21. The Adaptive Front Lighting System helps improve vision at night. Situations such as dirty windshield, rapidly changing light conditions or hilly terrain will limit effectiveness, requiring the driver to manually turn off. See Owner’s Manual for details. 22. Smart Stop Technology operates only in the event of certain simultaneous brake and accelerator pedal applications. When engaged, the system will reduce power to help the brakes bring the vehicle to a stop. Factors including speed, road conditions and driver input can all impact stopping distance. Smart Stop T echnology is not a substitute for safe and attentive driving and does not guarantee instant stopping. See Owner’s Manual for further details. 23. Continuous average power, all channels driven, at less than 0.1% THD; 20–20,000 Hz. 24. Dynamic Radar Cruise Control is designed to assist the driver and is not a substitute for safe and attentive driving practices. See Owner’s Manual for details. 25. The SmartAccess system may interfere with some pacemakers or cardiac defibrillators. If you have one of these medical devices, please talk to your doctor to see if you should deactivate this system. 26. The engine immobilizer is a state-of-the-art anti-theft system. When you insert your key into the ignition switch or bring a SmartAccess fob into the vehicle, the key transmits an electronic code to the vehicle. The engine will only start if the code in the transponder chip inside the key/fob matches the code in the vehicle’s immobilizer. Because the transponder chip is embedded in the key/fob, it can be costly to replace. If you lose a key or fob, your Lexus dealer can help. Alternatively, you can find a qualified independent locksmith to perform high-security key services by consulting your local Y ellow Pages or by contacting . 27. 20-in performance tires are expected to experience greater tire wear than conventional tires. Tire life may be substantially less than 20,000 miles, depending upon driving conditions. 28. Performance figures are for comparison only and were obtained with prototype vehicles by professional drivers using special safety equipment and procedures. Do not attempt. 29. 2014 EPA-estimated ratings. Actual mileage will vary.Lexus strives to build vehicles to match customer interest, and thus they typically are built with popular options and option packages. Not all options/packages are available separately, and some may not be available in all regions of the country. See for information about options/packages commonly available in your area. If you would prefer a vehicle without any or with different options, contact your dealer to check for current availability or the possibility of placing a special order. Specifications, features, equipment, technical data, performance figures, options, and color and trim are based upon information available at time of printing, are subject to change without notice, and are for mainland U.S.A. vehicles only. Some vehicles shown with available equipment. See your Lexus dealer for details. Lexus reminds you to wear seatbelts, secure children in rear seat, obey all traffic laws and drive responsibly. For more information, call 800-USA-LEXUS (872-5398) or visit . To learn more about your financing options, contact your Lexus dealer or call Lexus Financial Services at 800-874-7050. P4-021 (XX/13) 00217-LXBRO -14 Printed in U.S.A. (XXXM ) ©2013 Lexus.。

GAFSafetyDataSheetSDS2175SDSDateDecember2014

GAFSafety Data SheetSDS # 2175SDS Date: September 2016_________________________________________________________________________ SECTION 1: PRODUCT AND COMPANY INFORMATIONPRODUCT NAME: LRF Adhesive O Part ATRADE NAME: N/ACHEMICAL NAME /SYNONYM:N/ACHEMICAL FAMILY: N/AMANUFACTURER: GAFADDRESS: 1 Campus Drive, Parsippany, NJ 0705424 HOUR EMERGENCYPHONE: (CHEMTREC) 800–424–9300INFORMATION ONLY:800–766–3411PREPARED BY:Corporate EHSAPPROVED BY: Corporate EHSSECTION 2: HAZARD IDENTIFICATIONNFPA and HMIS RATINGS:NFPA Hazard Rating HMIS Hazard RatingHealth 2 Health 2 Flammable 2Flammable 2Reactive 1Reactive 1 Special Hazards - Personal Protection XGHS LABEL ELEMENTS:GHS CLASSIFICATION: Eye Irritant - Category 2ASkin Irritant - Category 2Skin Sensitizer - Category 1Respiratory SensitizerTarget Organ (SE) - Category 3Target Organ (RE) - Category 2Acute Toxicity - Category 4ADDITIONAL HAZARD IDENTIFICATION INFORMATION:PRIMARY ROUTE OF EXPOSURE:Inhalation, Skin Contact, Eye Contact SIGNS & SYMPTONS OF EXPOSUREEYES:Contact may cause eye irritation. May result in corneal opacity (clouding of the eye surface).SKIN:Causes skin burns, irritation and possible allergic reaction. In those who have developed skin sensitization, these symptoms can develop as a result of contact with a very small amount of the liquid material.INGESTION:Harmful if swallowed. Can burn mouth, throat and stomach. Gastrointestinal symptoms include nausea, vomiting and abdominal pain.INHALATION:Inhalation of MDI vapors may cause irritation of the mucous membranes of the nose, throat or trachea, breathlessness, chest discomfort, difficult breathing and reduced pulmonary function.ACUTE HEALTH HAZARDS:See above. CHRONIC HEALTH HAZARDS:As a result of previous repeated overexposures or a single large dose, certain individuals will develop isocyanate sensitization (chemical asthma) which will cause them to react to a laterexposure to isocyanate at levels well below the PEL/TLV. These symptoms, which include chest tightness, wheezing, cough, shortness of breath, or asthmatic attack, could be immediate or delayed up to several hours after exposure. Chronic overexposure to isocyanates has also been reported to cause lung damage, including a decrease in lung function, which may be permanent. Sensitization may be either temporary or permanent. Prolonged contact can cause reddening, swelling, rash, scaling, or blistering. In those who have developed skin sensitization, these symptoms can develop as a result of contact with very small amounts of liquid material.GHS PICTOGRAMS:SIGNAL WORD: DangerHAZARDSTATEMENTS:May cause damage to organs through prolonged or repeated exposure Causes skin irritationCauses serious eye irritation May cause an allergic reactionMay cause allergy or asthma symptoms or breathing difficulties if inhaled Harmful if inhaledCARCINOGENICITY: None known.SECTION 2: COMPOSITION/INFORMATION ON INGREDIENTSOCCUPATIONAL EXPOSURE LIMITS CHEMICAL NAME CAS # % (BY WT) OSHA ACGIH OTHER Polymeric MDI 9016-87-9 <55 NE NE NEMethylene Bisphenol Isocyanate (MDI) 101-68-8 38 0.02 ppm –ceiling0.005 ppm 0.005 ppm; 0.02 ppm– ceiling (10 min.)MDI Mixed Isomers 26447-40-5 1 – 10 NE NE NENE = Not EstablishedSECTION 3: HAZARDS IDENTIFICATIONPRIMARY ROUTE OF EXPOSURE: Inhalation, Skin Contact, Eye ContactSIGNS & SYMPTONS OF EXPOSUREEYES: Contact may cause eye irritation. May result in corneal opacity(clouding of the eye surface).SKIN: Causes skin burns, irritation and possible allergic reaction. In thosewho have developed skin sensitization, these symptoms candevelop as a result of contact with a very small amount of the liquidmaterial.INGESTION: Harmful if swallowed. Can burn mouth, throat and stomach.Gastrointestinal symptoms include nausea, vomiting and abdominalpain.INHALATION: Inhalation of MDI vapors may cause irritation of the mucousmembranes of the nose, throat or trachea, breathlessness, chestdiscomfort, difficult breathing and reduced pulmonary function. ACUTE HEALTH HAZARDS: See above.CHRONIC HEALTH HAZARDS: As a result of previous repeated overexposures or a single largedose, certain individuals will develop isocyanate sensitization(chemical asthma) which will cause them to react to a laterexposure to isocyanate at levels well below the PEL/TLV. Thesesymptoms, which include chest tightness, wheezing, cough,shortness of breath, or asthmatic attack, could be immediate ordelayed up to several hours after exposure. Chronic overexposureto isocyanates has also been reported to cause lung damage,including a decrease in lung function, which may be permanent.Sensitization may be either temporary or permanent. Prolongedcontact can cause reddening, swelling, rash, scaling, or blistering.In those who have developed skin sensitization, these symptomscan develop as a result of contact with very small amounts of liquidmaterial.CARCINOGENICITY: None known.SECTION 4: FIRST AID MEASRURESFIRST AID PROCEDURESEYES: After initial flushing remove any contact lenses and continue to flush eyeswith water for at least 15 minutes while holding eyelids open. Seekmedical attention.SKIN: Remove contaminated clothing and shoes. Wash affected area withlarge amounts of soap and water. Seek medical attention.INHALATION: If inhaled, remove to fresh air. If not breathing, give artificial respiration.Get immediate medical attention.INGESTION: If the material is swallowed, give 2 glasses of water. Do not inducevomiting. Contact a physician for immediate medication attention. Nevergive anything by mouth to a victim who is unconscious convulsions.NOTES TO PHYSICIANS OR FIRST AID PROVIDERS: There is no antidote to counteract the effects of MDI. Care should be supportive and treatment should be based on the judgment of the physician in response to the action of the patient.SECTION 5: FIRE FIGHTING PROCEDURESSUITABLE EXTINGUISHING MEDIA: Water, CO2, foam or dry chemical. DO NOT use water jet. HAZARDOUS COMBUSTION PRODUCTS: Carbon monoxide and carbon dioxide.RECOMMENDED FIRE FIGHTING PROCEDURES: Firefighters should wear full protective clothing including self contained breathing apparatus.UNUSUAL FIRE & EXPLOSION HAZARDS: This product reacts with water producing carbon dioxide gas which may create excessive pressure in containers. Reacts exothermically with polyol and alcohols. Reacts exothermically and possibly violently with acids, amines and alkaline solutions.SECTION 6: ACCIDENTAL RELEASE MEASURESACCIDENTAL RELEASE MEASURES: Contain spilled material. Absorb spill with inert material. Place ina closed container, but do not seal. For larger spills, absorb withinert material, then place in a chemical waste container. Place in aclosed container, but do not seal. Neutralize spill with mixture of90% water, 3-8% ammonia and 2-7% detergent. Add at a 10 to 1ratio and let stand for 48 hours allowing CO2 to escape. Do notdischarge into drains, surface waters or groundwater.SECTION 7: HANDLING AND STORAGEHANDLING AND STORAGE: Recommended storage temperature is 55 – 85 °F. Shelf life is18 months at 85 °F. Avoid temperature extremes. Keepcontainers closed when not in use. Store in a cool, dry, wellventilated area between. Provide appropriate ventilation. Keepcontainers closed to avoid contamination. All handlingequipment should be electrically grounded.OTHER PRECAUTIONS: Avoid contact with eyes and skin. Protect from moisture. Do notreuse containers. Keep out of reach of children.SECTION 8: EXPOSURE CONTROLS/PERSONAL PROTECTIONENGINEERING CONTROLS / VENTILATION: Use process enclosures, local exhaust ventilation or other engineering controls to control airborne levels below exposure limits.RESPIRATORY PROTECTION: When there is potential for airborne exposures in excess ifapplicable limits, wear NIOSH/MSHA approved respiratoryprotection.EYE PROTECTION: Wear safety glasses or chemical goggles and add a face shield ifsplashing is possible.SKIN PROTECTION: Selection of specific items such as gloves, boots, apron or full bodysuit will depend on operation.OTHER PROTECTIVE EQUIPMENT: Facilities storing or utilizing this material should be equipped with aneye wash and safety shower.WORK HYGIENIC PRACTICES: Wash exposed skin prior to eating, drinking or smoking and at theend of each shift.SECTION 9: PHYSICAL AND CHEMICAL PROPERTIESAPPEARANCE & ODOR: Dark brown liquid with aromatic odor.FLASH POINT: > 220 °C LOWER EXPLOSIVE LIMIT: No Data METHOD USED: TCC UPPER EXPLOSIVE LIMIT: No DataEVAPORATION RATE: No Data BOILING POINT: > 300 °C @ 5mm Hg pH (undiluted product): No Data MELTING POINT: No Data SOLUBILITY IN WATER: Reacts with water SPECIFIC GRAVITY: 1.22 VAPOR DENSITY: No Data PERCENT VOLATILE: No Data VAPOR PRESSURE: No Data MOLECULAR WEIGHT: No Data VOC WITH WATER (LBS/GAL): No Data WITHOUT WATER (LBS/GAL): No DataSECTION 10: STABILITY AND REACTIVITYTHERMAL STABILITY: STABLE X UNSTABLE CONDITIONS TO AVOID (STABILITY): Avoid moisture, acids, alcohols, amines, ammonia, bases,metal compounds, and strong oxidizers.INCOMPATIBILITY (MATERIAL TO AVOID): Reacts with water, with formation of carbon dioxide. Risk of bursting. Reacts with alcohols, acids, alkalines and amines. Risk of exothermic reaction. Risk of violent reaction. Contact with certain rubbers and plastics can cause brittleness of the substance with subsequent loss in strength.HAZARDOUS DECOMPOSITION OR BY-PRODUCTS: Carbon monoxide, hydrogen cyanide, nitrogen oxides, aromatic isocyanates, gases/vapors.HAZARDOUS POLYMERIZATION: May occur.SECTION 11: TOXICOLOGICAL INFORMATIONTOXICOLOGICAL INFORMATION: Dermal LD50 Rabbit: > 2,000 mg/kgOral LD50 Rat: > 10,000 mg/kgInhalation LC50 Rat: 490 mg/m3 (aerosol)May cause allergic skin reaction. May cause allergic respiratoryresponse. Tissue injury in the upper respiratory tract and lungs hasbeen observed in lab animals after repeated excessive exposure toMDI/polymeric MDI aerosols.In lab animals, MDI/polymeric MDI did not cause birth defects; otherfetal effects occurred only at high doses which were toxic to themother.SECTION 12: ECOLOGICAL INFORMATIONECOLOGICAL INFORMATION: In aquatic and terrestrial environments, movement is expected to belimited by its reaction with water forming predominantly insolublepolyureas.Diphenylmethane Diisocyanate, Isomers and Homologues: Aquatic Toxicity to Fish: LC50 >1,000 mg/l. for 96 h. (zebra fish) Aquatic Toxicity to Invertebrates: EC50 >1,000 mg/l. for 24 h. (daphnia) Aquatic Toxicity to Plants: EC50 >1,640 mg/l. for 72 h. (algae)Aquatic Toxicity to Microorganisms: EC50 >100 mg/l. for 3 h. (bacteria) Toxicity to Terrestrial Organisms: NOEC=1,000 mg/kg for 14 d. (worms)No data available for Persistence and Degradability, Bioaccumulation Potential, or Mobility in Soil.Polymeric Isocyanates: No data available for Aquatic Toxicity to Fish, Invertebrates, Plants, orMicroorganisms, Toxicity to Terrestrial Organisms, Persistence andDegradability, Bioaccumulation Potential, or Mobility in Soil.Ozone Depletion Potential: This product neither contains nor is manufactured with any ingredientsknown to deplete the ozone layer.SECTION 13: DISPOSAL CONSIDERATIONSWASTE DISPOSAL METHOD: Wastes must be tested using methods described in 40 CFR 261 todetermine if it meets applicable definitions of hazardous wastes. Complywith state and local regulations for disposalRCRA HAZARD CLASS: N/ASECTION 14: TRANSPORTATION INFORMATIONDOTNot regulated as dangerous goods.IATANot regulated as dangerous goods.IMDGNot regulated as dangerous goods.SECTION 15: REGULATORY INFORMATIONU.S. FEDERAL REGULATIONSTSCA: This product and its components are listed on the TSCA 8(b)inventory.CERCLA: CERCLA Hazardous Substances (40 CFR 302)Reportable Quantity – ComponentsMethylene Bisphenol Isocyanate (MDI): 101-68-8, 5000 lbs.SARA311/312 HAZARD CATEGORIES: Fire Hazard, Acute Health Hazard, Chronic Health Hazard313 REPORTABLE INGREDIENTS: Methylene Bisphenol Isocyanate (MDI), 101-68-8, 25 – 55%Polymethylene Polyphenylene Isocyanate, 9016-87-9, 25 – 55% CALIFORNIA PROPOSITION 65: None.Other state regulations may apply. Check individual state requirements. The following components appear on one or more of the following state hazardous substances lists:Chemical Name CAS # CA MA MN NJ PA RI101-68-8 Yes Yes Yes Yes Yes Yes Methylene BisphenolIsocyanate (MDI)9016-87-9 Yes Yes Yes Yes Yes Yes Polymethylene PolyphenyleneIsocyanateMDI Mixed Isomers 26447-40-5 Yes Yes Yes Yes Yes YesSECTION 16: OTHER INFORMATIONADDITIONAL COMMENTS: NoneDATE OF PREVIOUS SDS: June 2015CHANGES SINCE PREVIOUS SDS: Name change.This information relates to the specific material designated and may not be valid for such material used on combination with any other materials or in any process. Such information is to the best of our knowledge and belief accurate and reliable as of the date compiled. However, no representation, warranty or guarantee, expressed or implied, is made as to its accuracy, reliability, or completeness. It is the user’s responsibility to satisfy himself as to the suitability and completeness of such information for his particular use. We do not accept liability for any loss or damage that may occur from the use of this information. Nothing herein shall be construed as a recommendation for uses which infringe valid patents or as extending a license of valid patents.。

f1_datasheet

Electronic flow computerfor one or two streams with integrated data logging functionThe gas-net F1 is an electronic flow computer for natural gases. The device may correct one or two streams (three streams on re-quest).S-GERG 88, AGA-8 or AGA-NX-19 are available as correction methods; the gas quality data may be parameterized as fixed values or supplied by a gas quality ana-lyser connected via DSfG or MODBUS.Alternatively, a correction with a constant compressibility ratio K is possible.The gas-net F1 also contains an integrated data logging function. The process connection of the gas meter as well as of temperature and pressure sensors is imple-mented via a multi-functional explosion-proof input board (EXMFE4). In case of dual-stream correction the device is provided with a second EXMFE4 input board for the process connection of the second stream.An EXMFE4 board comprises two pulse inputs [EEx ib] IIC, suitable for the connection of LF and HF pulse generators. Op-tionally, a transmitter for original index readings (encoder total-izer) can be connected to the first channel.The EXMFE4 board provides a 4...20 mA analog input for the conventional connection of the pressure sensor via current in-terface. Alternatively, this input is suitable for the connection of up to four pressure and temperature sensors with HART interfaces (multi-drop).In addition, the EXMFE4 inputboard is provided with an inputfor the connection of a Pt100temperature sensor in 4-wiretechnique.Several intrinsically safe or explo-sion-proof pressure and tempera-ture sensor types can be used.The volume correction functionalityof the F1 determines the correctedvolume, the gas mass and theenergy based on the input valuesuncorrected volume, pressure /temperature at operating condi-tions and gas quality.In addition to its basic task, thecorrection, the device also moni-tors the measurement system fordisturbances. Error listing and log-book facilitate an error analysis.All gas-net flow computers containa data logging function whichrecords all important measure-ments and totalizers in definedintervals and in case of errors.The integrated data logging func-tion may file up to four archiveswith eight channels each for anymeasurement or totalizers in addi-tion to the flow correction archives.Furthermore, you may create aaudit trail archive to be able totrace system parameter changes.OutputsEach F1 contains a multi-func-tional MFA6 output board for theoutput of signals, measurementreadings and volume proportionalpulses. This board provides onerelay output for signal output, threetransistor outputs for signals orpulses as well as two analog cur-rent outputs.If the device enclosure is wideenough, further gas-net input andoutput boards can be added (seeTechnical data – process boards).Operation and indicationThe gas-net F1 contains 16 inputkeys, 12 numerical and 4 naviga-tion keys. An illuminated LCDserves for data indication.All totalizers and important pro-cess values are directly indicatedin the basic device display. In caseof dual-stream operation, themenu enables the operator toswitch between the displays of thedifferent streams.Further menus can be invoked viathe operator panel. It is, for in-stance, very easy to track downand analyse the history of an eventusing the error listing and logbook.It is also possible to view all otherarchive groups via the operatorpanel.In general, the operation of all gas-net devices can be learned easilyand performed intuitively via invo-kable menus similar to the Win-dows menus.A three-colored status LED showsat a glance in which state the sys-tem is currently in. If the LEDglows in green colour, the correc-tion runs smoothly; yellow glowingor blinking indicates an occurred orpending warning; red glowing orblinking indicates an occurred orpending alarm (i.e. an error im-pairing the correction).FLOW COMP devices are all-rounders which also provide many practical functions to perfectly monitor the system.The F1 flow computer, too, comes up to this tradition:Integrated RDTThe F1 always contains an inte-grated RDT for remote data inter-facing via telephone and modem. In order to be able to use this function you only need to connect a compatible modem (line trans-mission or GSM radio modem). Once a data connection exists you may, for instance, read out ar-chives remotely – e.g., by means of the respective GAS-WORKS software developed to this end. Signal processingThe signal processing function of the F1 facilitates the comprehen-sive monitoring of signals and ad-ditional measurements.This does not only concern digital signal input states. It is also possi-ble to monitor any measurement reading and to initiate the genera-tion of a message in case of cer-tain events - for instance, if a value violates a set limit. Any number of messages can be combined to up to eight message groups to tighten up the signal processing.A clever grouping of messages significantly simplifies the compre-hensive monitoring of the system. In this case it will be sufficient to observe the results of the mes-sage groups to get a quick over-view of the system’s state. These so-called group or general mes-sages can be relayed as a signal via digital outputs or by DSfG tele-grams.Error listing and logbook of the signal processing then facilitate an analysis of the precise cause and of the development of a signal state as regards time.Switching functionThe switching function in the gas-net F1 enables you to initiate anyswitching operation via a digitaloutput. This way you may switchfrom gas to oil, for instance.DSfGEach F1 is equipped with a DSfGinterface and therefore facilitatesthe networking of several devicesin a gas plant via DSfG.In combination with the integratedRDT this means that even otherdevices connected via DSfG maybe reached via telephone dataconnection.Meter proving / summationoutputsThe F1 may query information ofother flow computer entities via theDSfG interface, such as currenttotalizers or flows. Of course, theflow computers must all be con-nected to the same DSfG bus.Based on the data received a me-ter proving may be carried out formeters in line. In addition, appro-priate values can be summed upfor being transferred to outputs.MODBUS interfaceThe generally provided COM2 in-terface of the device can be usedfor the MODBUS interfacing of thegas-net F1. If this interface isneeded for the connection of themodem (integrated RDT function),however, a MSER2 input board isoptionally available for theMODBUS interfacing.●Flow correction according toSGERG-88, AGA-8, AGA-NX-19or with constant K-ratio.Gas quality as set values or im-port of online data values viaDSfG or MODBUS.Alternatively, orrifice meter cal-culation to ISO 5167-1.●Integrated data logging for re-cording of all importantmeasurements and totalizers.●Signal processing (max. 64messages, which can be com-bined to up to 8 groups withgeneral and group messages).●Minimum / maximum tracking ofmeasurements.●Switching function via digitaloutputs.●Integrated RDT function forremote data interfacing via tele-phone and modem.● 1 relay, 3 pulse and 2 currentoutputs 0/4-20mA on multi-func-tional output board (MFA6).●Expandable by further input andoutput boards, max. quantitydepends on enclosure width.●DSfG interface.●All archives and logbooks of theintegrated data logging functioncan be retrieved via DSfG orDSS interface.●Double meter proving functionfor proving of flow computersconnected via DSfG; summationoutputs.●DCF-77 interface for theconnection of a radio clock forsynchronisation of the inte-grated clock.●Time synchronisation bytelephone retrieval of the timestandard via the PTB timeserver.The GAS-WORKS program sys-tem provides the user with opti-mum support when operating gas-net devices.The basic module, GW-BASE, organizes all data created in a gas metering station (parameterization data records, archive data, access data, etc.). Besides, various GAS-WORKS modules can be inte-grated in the GW-BASE environ-ment.The survey below presents all GAS-WORKS modules that are of interest for working with the F1. GW-GNET+:Parameterization and moreThe universal parameterization program for all devices of the gas-net series is called GW-GNET+. The operation of this program can be easily learned. All parameters are combined in groups as regards content and presented for proc-essing in a list by the user inter-face. Each parameter comes with a context-sensitive help menu ex-plaining the functioning of the related setting.A parameterization data record may already be compiled in the office environment before the actual commissioning takes place. This reduces the on-site workload. The parameterization may be transferred to the gas-net device via the DSS data interface. This is possible if the calibration switch is open.Apart from the complete transfer of a parameterization data record you may also change individual parameters or parts of the pa-rameterization, an existing dataconnection provided. Parametersrelevant for the correction are thenprotected by the calibration switch.You may only change parametersthat are subject to the user lock(one combination lock for each ofthe two contract parties) if thelocks are open.The audit trail records eachchange of the parameter settingsin the device.Several additional service pro-grams are integrated in the GW-GNET+ program. For instance,service programs are available forthe gas-net F1 for setting totalizersand deleting archives (only possi-ble if the calibration switch isopen).GW-REMOTE+:Data communications anddata transferGW-REMOTE+ helps to establisha data connection to any FLOWCOMP device. This can beaccomplished regardless whetherthe device stands right in front ofyou and is connected with yourcomputer by means of a parame-terization cable or whether you calla device located far away in aplant via telephone and modem.The GW-REMOTE+ user interfaceis set up identically in both casesand very easy to operate.GW-REMOTE+ offers the follow-ing functions for flow computers inparticular, provided a data con-nection exists:·Display of the faceplate withgeneral information on theconnected device; currentdata*·Remote operation by clickingwith the mouse on the keys ofthe virtual operator panel·When calculating with fixed gasquality values, you may adjustthese values remotely*·Retrieval of all archives*GW-XL+:Viewing of archive dataThe GAS-WORKS GW-XL+ mo-dule edits archive data filed underGW-BASE and presents it clearlyformatted in a Microsoft-EXCELspreadsheet.Apart from that the archive datacan be presented in form of a dia-gram, which makes the analysis ofthe course of measurement read-ings and totalizers easier.Recommendation:The GW-BASE basic module andthe GW-GNET+ parameterizationprogram are part of the deliveryscope of each gas-net device.You may install all other GAS-WORKS modules you have to payfor in a demo version from theGAS-WORKS-CD and try themfree of charge for a period of 30days.*Also functions with flow computers ofother manufacturers, provided they sup-port the DSfG specification.Enclosure Plug-in unit in 19''-technique, 3 height units, 1/3 or 1/2 width for hinged bay mounting. Overall depth without plugs approx. 170 mm, with plugs approx. 220 mm. Process interfacing at the rear; operator panel at the front.The device may contain up to three process boards in case of 1/3 mounting width and up to 6 in case of 1/2mounting width (see below).Power supply24 VDC +/- 20%, input power up to 12 W. Optionally: 230 VAC via external power supply unit.Ambient conditions Temperature: 0 to +40 °C. Installation outside of ex-zone 2 only.Operation16 input keys: 12 for numerical entry plus 4 navigation keys.Display Illuminated LCD, 8 lines with 32 characters each; status LED for indicating mains/alarm/warning.Process boards Any 3 or 6 of the process boards listed below may be used, with the max. number depending on the enclo-sure width:Input board EXMFE4:·two pulse or signal inputs [EEx ib] IIC·analog input for sensors with an output signal of 4...20 mA, [EEx ib] IIC; alternatively suitable for the con-nection of up to 4 pressure or temperature sensors with HART interface (multi-drop)·temperature sensor input for PT100 in 4-wire technique, [EEx ib] IICUsually, one EXMFE4 each is required for the process connection of the sensors for the correction(s).Input board MFE11:·eight digital inputs, which can either be used as signal inputs 0/24V DC or as pulse inputs with a maximum input frequency of 20 Hz·three analog inputs 0/4...20 mAOutput board MFA6:·one relay output (break contact, max. 28.8 V 120 mA)·three transistor outputs (max. 28.8 VDC 90 mA) for signals or pulses of up to 25 Hz·two analog outputs 0/4...20 mAAnalog input board AE12·twelve analog inputs (0/4 ...20 mA)Digital output board DA12·twelve transistor outputs (max. 28.8 VDC 150 mA) for signals or pulses of up to 25 HzPressure sensor We recommend the use of the following pressure sensors:Rosemount, types 2088 A / 2088 A Smart, 3051 CAFLOW COMP FCP 25 or FCP 25-2Endress+Hauser Cerabar S PMC 731 or Cerabar S PMP 731Data interfaces DSS interface for the connection of the device to the COM interface of a PC for parameterization and reading out of archives.COM2 interface for the connection of a wireline or wireless modem (GSM) or for establishing a MODBUSconnection.DSfG interface according to DVGW Worksheet G485 and Technical Specification for DSfG Implementations,max. baud rate 115200 baud.DCF77 interface for the connection of a radio clock receiver.Data logging Integrated data logging function for recording billing and operating data.Parameterization Commissioning and parameterization via the GAS-WORKS PC software. The parameter data record may be stored, documented and organized under GAS-WORKS.FLOW COMP Systemtechnik GmbH Schloßstr. 95a44357 Dortmund, GermanyTel.+49 231 / 937110-0Fax+49 231 / 937110-99 www.flowcomp.de Elster Handel GmbHSteinern Straße 19-2155252 Mainz-Kastel, GermanyTel.+49 6134 / 605-0Fax+49 6134 / 605-390July 2002Subject to alterations。

Perkadox 14-40K-PD商品数据表说明书

Product Data SheetPerkadox 14-40K-PD Di(tert-butylperoxyisopropyl) benzenePerkadox® 14-40K-PD is a 40% formulation on an inert carrier system (main carrier clay) in powder form.CAS number2212-81-9, 25155-25-3EINECS/ELINCS No.218-664-7TSCA statuslisted on inventoryMolecular weight338.5Active oxygen contentperoxide9.45%Concentration3.7-3.9%SpecificationsAppearance Off-white powderAssay39.0-41.0 %ApplicationsPerkadox® 14-40K-PD is a bifunctional peroxide which is used for the crosslinking of natural rubber and synthetic rubbers, as well as polyolefins. Rubber compounds containing Perkadox® 14-40K-PD have excellent scorch safety, and under certain conditions one step mixing is possible. Safe processing temperature: 135°C (rheometer ts2 > 20 min.). Typical crosslinking temperature: 175°C (rheometer t90 about 12 min.).Thermal stabilityOrganic peroxides are thermally unstable substances, which may undergo self-accelerating decomposition. The lowest temperature at which self-accelerating decomposition of a substance in the original packaging may occur is the Self-Accelerating Decomposition Temperature (SADT). The SADT is determined on the basis of the Heat Accumulation Storage Test.SADT80°CMethod The Heat Accumulation Storage Test is a recognized test method for thedetermination of the SADT of organic peroxides (see Recommendations on theTransport of Dangerous Goods, Manual of Tests and Criteria - United Nations, NewYork and Geneva).StorageDue to the relatively unstable nature of organic peroxides a loss of quality can be detected over a period of time. To minimize the loss of quality, Nouryon recommends a maximum storage temperature (Ts max. ) for each organic peroxide product.Ts Max.30°CNote When stored under the recommended storage conditions, Perkadox® 14-40K-PDwill remain within the Nouryon specifications for a period of at least 6 months afterdelivery.Packaging and transportThe standard packaging is a cardboard box for 50 lbs peroxide formulation. Both packaging and transport meet the international regulations. For the availability of other packed quantities consult your Nouryon representative. Perkadox®14-40K-PD is classified as Flammable solid, class 4. 1, UN 1325.Safety and handlingKeep containers tightly closed. Store and handle Perkadox® 14-40K-PD in a dry well-ventilated place away from sources of heat or ignition and direct sunlight. Never weigh out in the storage room. Avoid contact with reducing agents (e. g. amines), acids, alkalines and heavy metal compounds (e. g. accelerators, driers and metal soaps). Please refer to the Safety Data Sheet (SDS) for further information on the safe storage, use and handling of Perkadox® 14-40K-PD. This information should be thoroughly reviewed prior to acceptance of this product. The SDS is available at /sds-search.Major decomposition productsMethane, Acetone, tert-Butanol, Di(2-hydroxyisopropyl)benzene, Diacetylbenzene, Acetyl 2-hydroxyisopropyl benzeneAll information concerning this product and/or suggestions for handling and use contained herein are offered in good faith and are believed to be reliable.Nouryon, however, makes no warranty as to accuracy and/or sufficiency of such information and/or suggestions, as to the product's merchantability or fitness for any particular purpose, or that any suggested use will not infringe any patent. Nouryon does not accept any liability whatsoever arising out of the use of or reliance on this information, or out of the use or the performance of the product. Nothing contained herein shall be construed as granting or extending any license under any patent. Customer must determine for himself, by preliminary tests or otherwise, the suitability of this product for his purposes.The information contained herein supersedes all previously issued information on the subject matter covered. The customer may forward, distribute, and/or photocopy this document only if unaltered and complete, including all of its headers and footers, and should refrain from any unauthorized use. Don’t copythis document to a website.Perkadox® is a registered trademark of Nouryon Functional Chemicals B. V. or affiliates in one or more territories.Contact UsPolymer Specialties Americas************************Polymer Specialties Europe, Middle East, India and Africa*************************Polymer Specialties Asia Pacific************************2022-6-30© 2022Polymer crosslinking Perkadox 14-40K-PD。