AP6476 datasheet_V1.2_01092013
Q Sepharose Fast Flow 产品说明书
Q1126pis Rev 01/221Product InformationQ Sepharose ® Fast FlowQ1126Product DescriptionQ Sepharose ® Fast Flow is an ion exchangechromatography resin with a quaternary amine (Q) functional group [-CH 2-N +(CH 3)3] attached to Sepharose ® Fast Flow. The Q group serves as astrong anion exchanger, which is completely ionized over a broad pH range. The terms “s trong" and"weak" in ion exchange chromatography refer to the extent of ionization with pH, and not to the binding strength of the functional group to the target species. The parent Sepharose ® Fast Flow is a cross-linked derivative of Sepharose ®. The particle size range is 45-165 µm. The average bead diameter is ~90 µm. The counterion in the product is sulfate (SO 4-2). Recommended cation buffers to use with Q Sepharose ® Fast Flow include alkylamines,ammonium, ethylenediamine, imidazole, pyridine, or Tris. In terms of pH, it is suggested to operate within 0.5 pH unit of the buffer's pK a . With proteins, it is suggested to operate at least 1 pH unit above the pI of the protein, to facilitate binding. Oxidizing agents, and anionic detergents and buffers, should not be used with Q Sepharose ® Fast Flow. Likewise,extended exposure of Q1126 to pH < 4 should be avoided. Several publications 1,2 and dissertations 3-5 cite use of product Q1126 in their research.ReagentQ Sepharose ® Fast Flow is offered as a suspension in 20% ethanol.Approximate Exclusion Limit: average molecular mass of ~4 × 106 DaltonsIonic Capacity: 0.18-0.24 mmol Cl -/mL gel Binding Capacity: ~42 mg BSA per mL gel pH Stability: 2-12Working temperature: 4-40 °CPrecautions and DisclaimerFor R&D use only. Not for drug, household, or other uses. Please consult the Safety Data Sheet for information regarding hazards and safe handling practices. General Resin Preparation Procedure1. Allow the ion exchange medium and ~10 columnvolumes (CV) of buffer to equilibrate to thetemperature chosen for the chromatographic run. 2. Mix the pre-swollen suspension with startingbuffer to form a moderately thick slurry, which consists of ~75% settled gel and 25% liquid. 3. Degas the gel under vacuum at the temperatureof column operation.4. Mount the column vertically on a suitable stand,out of the way of direct sunlight or drafts, which may cause temperature fluctuations.5. Pour a small amount of buffer into the emptycolumn. Allow the buffer to flow through spaces to eliminate air pockets.6. Pour the suspension of ion exchange mediumprepared in Step 3 into the column by allowing it to flow gently down the side of the tube, to avoid bubble formation.7. For consistent flow rates and reproducibleseparations, connect a pump to the column. 8. Fill the remainder of the column to the top withbuffer. Allow ~5 CV of buffer to drain through the bed at a flow rate at least 133% of the flow rate to be used in the procedure. The bed height should have settled to a constant height.9. Using a syringe or similar instrument, apply thesample dissolved in starting buffer to the column. For isocratic separations, the sample volumeshould range from 1-5% of the column volume. If the chromatographic run involves elution with a gradient, the applied sample mass is of much greater importance than the sample volume, and the sample should be applied in a low ionicstrength medium. Ion exchange is used both to concentrate and to fractionate the sample. 10. Elution:• If only unwanted substances in the sample areadsorbed, or if sample components aredifferentially retarded under isocratic conditions, the starting buffer can also be used as the eluent.The life science business of Merck operates as MilliporeSigma in the U.S. and Canada.Merck and Sigma-Aldrich are trademarks of Merck KGaA, Darmstadt, Germany or its affiliates. All other trademarks are the property of their respective owners. Detailed information on trademarks is available via publicly accessible resources.© 2022 Merck KGaA, Darmstadt, Germany and/or its affiliates. All Rights Reserved. Q1126pis Rev 01/22 JJJ,MAM,GCY2•Normally, however, separation and elution are achieved by selectively decreasing the affinity of the molecules for the charged groups on the resin by changing the pH and/or ionic strength of the eluent. This procedure is termed gradient elution. 11. Regeneration: •Either (a) washing the column with a high ionic strength salt solution, such as 1 M NaCl, or (b) changing the pH to the tolerable low and high pH extremes, is usually sufficient to remove reversibly bound material.• When needed, lipids and precipitated proteins canbe removed by washing with 1 CV of 1-2 M NaCl, followed by 1 CV of 0.1 M NaOH in 0.5 M NaCl. • Rinse with several CV of water. Thenre-equilibrate the resin with starting buffer.• If base such as NaOH was used, adjust the pH ofthe resin to neutral before storing or using.12. Storage: Q Sepharose ® Fast Flow may be storedat 2-8 °C in water with 20% ethanol added as an antibacterial agent.General NotesCation versus Anion Exchanger• If sample components are most stable below their pI values, a cation exchanger should be used. • If sample components are most stable above their pI values, an anion exchanger should be used. •If stability is good over a wide pH range on both sides of the pI, either or both types of ion exchanger may be used.Strong versus Weak Ion Exchanger•Most proteins have pI values within the range 5.5-7.5, and can thus be separated on both strong and weak ion exchangers.•When maximum resolution occurs at an extreme pH and the molecules of interest are stable at that pH, a strong ion exchanger should be used. Choice of Buffer, pH, and Ionic Strength• The highest ionic strength which permits binding should normally be used.•The required buffer concentration varies fromsubstance to substance. Usually, an ionic strength of at least 10 mM is required to ensure adequate buffering capacity.•As salts (such as buffers) help to stabilize proteins in solution, their concentration should be highenough to prevent denaturation and precipitation.References1. López, G. et al ., Eukaryot. Cell , 14(6), 564-577(2015).2. Bhargava, V. et al ., Dev. Cell., 52(1), 38-52.e10(2020).3. Fu , Yinan, “Structure and dynamics ofPseudomonas aeruginosa ICP”. University ofGlasgow, Ph.D. dissertation, p. 126 (April 2009). 4. Redmond, Miranda , “The Role of N-TerminalAcidic Inserts on the Dynamics of the Tau Protein ”. University of Vermont, Ph.D. dissertation, p. 22 (May 2017).5. Taylor-Whiteley, Teresa Rachel , “RecapitulatingParkinson’s disease pathology in athree-dimensional neural cell culture mode ”. Sheffield Hallam University, Ph.D. dissertation, p. 58 (September 2019).NoticeWe provide information and advice to our customers on application technologies and regulatory matters to the best of our knowledge and ability, but without obligation or liability. Existing laws and regulations are to be observed in all cases by our customers. This also applies in respect to any rights of third parties. Our information and advice do not relieve ourcustomers of their own responsibility for checking the suitability of our products for the envisaged purpose. The information in this document is subject to change without notice and should not be construed as acommitment by the manufacturing or selling entity, or an affiliate. We assume no responsibility for any errors that may appear in this document.Technical AssistanceVisit the tech service page at /techservice .Standard WarrantyThe applicable warranty for the products listed in this publication may be found at /terms .Contact InformationFor the location of the office nearest you, go to /offices .。
数字多用表
®
8845A/8846A
数字多用表
用户手册
July 2006
© 2006 Fluke Corporation. All rights reserved. All product names are trademarks of their respective companies.
目 录
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概述和技术指标 ................................................................................................. 1-1 概述 ...................................................................................................................1-3 用户文件 ...........................................................................................................1-3 关于本手册 .......................................................................................................1-3 安全信息 ...........................................................................................................1-4 通用安全事项 ...............................................................................................1-4 符号和标记 ...................................................................................................1-6 仪器安全程序 ...................................................................................................1-6 易失性存储器 ...............................................................................................1-6 非易失性存储器 ...........................................................................................1-7 存储介质（仅限 8846A） ...........................................................................1-7 附件 ...................................................................................................................1-7 通用技术指标 ...................................................................................................1-9 电源 ...............................................................................................................1-9 尺寸 ...............................................................................................................1-9 显示屏 ...........................................................................................................1-9 环境 ...............................................................................................................1-9 安全 ...............................................................................................................1-9 电磁兼容（EMC） ......................................................................................1-9 触发 ...............................................................................................................1-9 存储器 ...........................................................................................................1-10 计算功能 .......................................................................................................1-10 电气 ...............................................................................................................1-10 程控接口 .......................................................................................................1-10 质量保证期 ...................................................................................................1-10 电气技术指标 ...................................................................................................1-10 直流电压技术指标 .......................................................................................1-10 交流电压技术指标 .......................................................................................1-11 电阻 ...............................................................................................................1-13 直流电流 .......................................................................................................1-15 交流电流 .......................................................................................................1-16 频率 ...............................................................................................................1-18
BF6910(BF6911)ASXX规格书
3.1 引脚图 ....................................................................................................................................................... 6 3.2 引脚描述 ................................................................................................................................................... 6
AP3426 Datasheet Rev1.01
oCPlease be aware that an Important Notice concerning availability, disclaimers, and use in critical applications of DI products is at the end of this document.laitndifnoCegThe device can operate at the standard mode I 2C bus line or the fast mode I 2C bus line. The characteristics of the I 2C bus for difference modes are as bellow.Characteristics of the SDA and SCL bus lines for I 2C bus devices(All specifications are at T ope =25°C, unless otherwise noted.)f i de nt i alNote: All dimensions are in millimeters D y naI m a ge Co nf i de nt i ae diaitnedifnoCegamIanyDdaitnedifnoCegamIanyDe dNote : The actual profile may need to be adjusted base on the actual layout. When parts are placed upside down, proper protection/support is recommended, max reflow should not exceed 3x maxImportant Notice and DisclaimerDI reserves the right to make changes to this document and its products and specifications at any time without notice. Customers should obtain and confirm the latest product information and specifications before final design, purchase or use.DI makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does DI assume any liability for application assistance or customer product design. DI does not warrant or accept any liability with products which are purchased or used for any unintended or unauthorized application.No license is granted by implication or otherwise under any intellectual property rights of DI. DI products are not authorized for use as critical components in life support devices or systems without express written approval of DI.D y naI m a ge Co nf i de nt i al。
CA6470N用户手册pdf-法国CA
5.1 测量频率的选择................................................................................................................... 24 5.3 手动设置电阻测量............................................................................................................... 24
3 自动模式................................................. 12
3.1 电阻测量 .............................................................................................................................. 12 3.1.1 2 线测量 ......................................................................................................................... 12 3.1.2 测量导线补偿 .................................................................................................................. 12
RDA5876p_datasheet_v1.11
RDA5876PSINGLE CHIP FOR BLUETOOTH & FM RADIO TUNERRev.1.11–08.2012GPIO2/ WLAN_ACTIVEHOST_WAKEFM_OUTR1 General DescriptionRDA5876P integrates industry-lead Bluetooth and FM radio tuner into one chip and is optimized for mobile applications. Bluetooth and FM can work simultaneously and independently, with low power consumption levels target to battery powered devices. For the highest integration level, the required board space has been minimized and customer cost has been reduced. Manufacturers can easily and fast integrate RDA5876P on their product to enable a rapid time to market. RDA5876P uses CMOS process with a compact 4*4mm 32-pin QFN package.UART_RX 1 PCM_DOUT 2 PCM_DIN 3 PCM_CLK 4 PCM_SYNC 5 VIO 6 VOUT18 7 NC8UART_TXFM_OUTLVOUT12NC26323130292827NC2524 23NC FM_IP FM_IN AGPIO1/BT_PRIORITY AGPIO0/BT_ACTIVE RF NC NCGND PAD RDA5876P 32 Pins22 21 20 19 18 17910111213141516XIN_32KI2C_SDAXEN_OUTFigure1-1. RDA5876P Top View1.1 Bluetooth FeaturesCMOS single-chip fully-integrated radio and baseband Compliant with Bluetooth 2.1 + EDR specification Bluetooth Piconet and Scatternet support ARM7-based microprocessor with on-chip ROM and RAM Meet class 1, 2 and class 3 transmitting power requirement, support class1 operation with external power amplifier Provides +10dbm transmitting power NZIF receiver with -90dBm sensitivity Battery power supply directly with internal LDO Up-to 4Mbps high speed UART HCI supportCopyright © RDA Microelectronics Inc. 2009. All rights are reserved. The information contained herein is the exclusive property of RDA and shall not be distributed, reproduced, or disclosed in whole or in part without prior written permission of RDA.Support AFH Support 3-wire WIFI Co-existence handshake signals Low power consumption Minimum external component Internal 32k LPO.LDO_ONI2C_SCLVBATXINNCRDA Microelectronics, Inc.RDA5876P Datasheet V1.111.2 FM FeaturesCMOS single-chip fully-integrated FM tuner Low power consumption Total current consumption lower than 20mA at 3.0V power supply Support worldwide frequency band 50 -115 MHz Support flexible channel spacing mode 100KHz, 200KHz, 50KHz and 25KHz Support RDS/RBDS Digital low-IF tuner Image-reject down-converter High performance A/D converter IF selectivity performed internally Fully integrated digital frequency synthesizer Fully integrated on-chip RF and IF VCO Fully integrated on-chip loop filter Autonomous search tuning Support 32.768KHz crystal oscillator Digital auto gain control (AGC) Digital adaptive noise cancellation Mono/stereo switch Soft mute High cutProgrammable de-emphasis (50/75 μs) Receive signal strength indicator (RSSI) Bass boost Volume control Line-level analog output voltage I2C control bus interface Directly support 32Ω resistance loading Integrated LDO regulator 1.8 to 5.5 V operation voltage1.3 ApplicationsMobile handset MP3,MP4 and PMP PDA Cordless phoneThe information contained herein is the exclusive property of RDA and shall not be distributed, reproduced, or disclosed in whole or in part without prior written permission of RDA. Page 2 of 22RDA Microelectronics, Inc.RDA5876P Datasheet V1.112 Table of Contents1 General Description ....................................................................................................................................1 1.1 Bluetooth Features .............................................................................................................................1 1.2 FM Features........................................................................................................................................2 1.3 Applications ........................................................................................................................................2 Table of Contents.........................................................................................................................................3 Bluetooth Section Functional Description.................................................................................................4 Bluetooth Section Features.........................................................................................................................5 Bluetooth Section Electrical Characteristics ............................................................................................6 Bluetooth Section Radio Characteristics...................................................................................................8 FM Section Functional Description .........................................................................................................10 FM Section Electrical Characteristics.....................................................................................................12 FM Section Receiver Characteristics ......................................................................................................13 Pins Description.........................................................................................................................................14 Application Circuit....................................................................................................................................17 Package Physical Dimension ....................................................................................................................17 PCB Land Pattern.....................................................................................................................................18 Change List................................................................................................................................................21 Contact Information .................................................................................................................................222 3 4 5 6 7 8 9 10 11 12 13 14 15The information contained herein is the exclusive property of RDA and shall not be distributed, reproduced, or disclosed in whole or in part without prior written permission of RDA. Page 3 of 22RDA Microelectronics, Inc.RDA5876P Datasheet V1.113 Bluetooth Section Functional DescriptionVBATDC/DCBBModemA AΦ BT_RF PLLx xRFLDOROMROMDEnvelonFM_IP LDO_ONPORRAMRAMFM_IN GPIO_FM1AHB ARM TRAP SPI2 FMGPIO_FM2 GPIO_FM3 FM_OUTRVICI2C_SDA I2C_SCLSCUFM_OUTLI2C DMA TIMER PLLXINUART_TX UART_RXUARTAPB BRIDGEAPB GPIO 32K/LPOXIN_32KFigure3-1. RDA5876P Bluetooth Block Diagram RDA5876P is designed for use in UART HCI with handset chipsets. As shown in Figure3-1, RDA5876P integrates radio unit, baseband core, ARM7 core and memory which provides a complete lower Bluetooth protocol stack including the LC, LM and HCI interface.The information contained herein is the exclusive property of RDA and shall not be distributed, reproduced, or disclosed in whole or in part without prior written permission of RDA. Page 4 of 22RDA Microelectronics, Inc.RDA5876P Datasheet V1.114 Bluetooth Section FeaturesRadio♦ ♦ ♦ ♦ ♦ ♦ ♦ Build-in TX/RX switch Fully integrated synthesizer without any external component Support external reference clock direct input Class1, 2 and class3 transmit output power supported and over 30dB dynamic control range Supports π/4 DQPSK and 8DPSK modulation High performance in receiver sensitivity and over 80dB dynamic range Integrated channel filterAuxiliary features♦ ♦ ♦ ♦ ♦ On-chip regulator to support battery power supply directly Power management support low power mode Support share handset system reference clock Support 3-wire wifi cooperation handshake protocol Support external class1 PA and antenna switchBaseband♦ ♦ ♦ ♦ ♦ Internal RAM allows fully speed data transfer, mixed voice and data, and fully piconet operation Logic for forward error correction, header error control, access code correlation, CRC, demodulation , encryption bit stream generation, whitening and transmit pulse shaping Support eSCO and AFH Support up to Bluetooth v2.1 + EDR Support A-law, μ-law and CVSD digitize audio CODEC in PCM interfaceInterface♦ ♦ ♦ ♦ Provides UART HCI interface, up-to 4Mbps Provides I2C interface for host to do configuration Provides PCM audio interface Provides 3-wire and 2-wire WIFI Co-existence handshake interfaceBluetooth Stack♦ Compliant with Bluetooth 2.1 + EDR specificationThe information contained herein is the exclusive property of RDA and shall not be distributed, reproduced, or disclosed in whole or in part without prior written permission of RDA. Page 5 of 22RDA Microelectronics, Inc.RDA5876P Datasheet V1.115 Bluetooth Section Electrical CharacteristicsTable 5-1SYMBOLDC Electrical Specification (Recommended Operation Conditions):DESCRIPTION Supply Voltage from battery or LDO Ambient Temperature CMOS Low Level Input Voltage CMOS High Level Input Voltage CMOS Threshold Voltage MIN 3.3 -20 0 0.7*VIO 0.5*VIO TYP 4.0 27 MAX 4.2 +50 0.3*VIO VIO UNIT V ℃ V V VVBAT Tamb VIL VIH VTHNotes:1. VIO=1.8~3.3VTable 5-2SYMBOLDC Electrical Specification (Absolute Maximum Ratings):DESCRIPTION Ambient Temperature Input Current Input Voltage LNA Input Level MIN -20 -10 -0.3 TYP MAX +60 +10 VIO+0.3 +5 UNIT °C mA V dBmTamb IIN VIN VlnaTable 5-3LDOPower consumption specification(VBAT = 4.0 V, VIO = 2.8V, TA = +27℃, RF 9dBm, LDO mode unless otherwise specified) STATE Headset voice Headset SNIFF HCI only active Both SCAN DeepSleep internal LDO off 1.28S cycle 26Mhz crystal off LDO_ON off INQUIRE and PAGE SCAN DESCRIPTION HV3 type 500ms cycle NO INQUIRE and PAGE SCAN Condition TYP 18 0.5 5.7 1.0 118 7 UNIT mA mA mA mA μA μAIvbat=105uA,Ivio=13uA,External 32K input Ivbat=6uA,Ivio=1uAThe information contained herein is the exclusive property of RDA and shall not be distributed, reproduced, or disclosed in whole or in part without prior written permission of RDA. Page 6 of 22RDA Microelectronics, Inc.RDA5876P Datasheet V1.116 Bluetooth Section Radio CharacteristicsTable 6-1 Receiver Characteristics ------ Basic Data Rate(VBAT = 4.0 V, TA = 27°C, unless otherwise specified) SYMBOL PARAMETER CONDITIONS MIN / 0 / F=F0 + 1MHz F=F0 - 1MHz Adjacent channel selectivity C/I F=F0 + 2MHz F=F0 - 2MHz F=F0 + 3 MHz F=F0 - 3MHz Adjacent channel selectivity C/I F=Fimage 30MHz–2000MHz Out-of-band blocking performance 2000MHz–2400MHz 2500MHz–3000MHz 3000MHz–12.5GHz Intermodulation Spurious output level / / / / / / / -10 -27 -27 -10 -35 -150 TYP -90 / +10 / / / / / / / / / / / / / MAX / / / -5 0 -33 -30 -45 -40 0 / / / / / / UNIT dBm dBm dB dB dB dB dB dB dB dB dBm dBm dBm dBm dBm dBm/HzGeneral specificationsSensitivity @0.1% BER Maximum received signal@0.1% BER C/I c-channelNotes:Table 6-2Transmit Characteristics ------ Basic Data Rate(VBAT = 4.0V, TA = 27 °C, unless otherwise specified) SYMBOL General specifications PARAMETER CONDITIONS MIN / 20 / F=F0 + 1MHz F=F0 - 1MHz F=F0 + 2MHz F=F0 - 2MHz F=F0 + 3MHz F=F0 - 3MHz F=F0 + >3MHz / / / / / / / TYP +4 / 0.9 -20 -20 -35 -35 -40 -40 / MAX +10 / / / / / / / / -46 UNIT dBm dB MHz dBm dBm dBm dBm dBm dBm dBmMaximum RF transmit power RF power control range 20dB band widthAdjacent channel transmit powerThe information contained herein is the exclusive property of RDA and shall not be distributed, reproduced, or disclosed in whole or in part without prior written permission of RDA. Page 7 of 22RDA Microelectronics, Inc.F=F0 - >3MHz △f1avg Maximum modulation △f2max Minimum modulation △f2avg/△f1avg ICFT Drift rate Drift (1 slot packet) Drift (5 slot packet) -46 / / 0.80 / / / /RDA5876P Datasheet V1.11 / 164 145 / +4 0.1 -2 -2 / / / / / / / / dBm kHz kHz / kHzkHz/50uskHz kHzNotes:Table 6-3Receiver Characteristics ------ Enhanced Data Rate(VBAT = 4.0 V, TA = 27°C, unless otherwise specified) PARAMETER CONDITIONS MIN / 0 / F=F0 + 1MHz F=F0 - 1MHz Adjacent channel selectivity C/I F=F0 + 2MHz F=F0 - 2MHz F=F0 + 3MHz F=F0 - 3MHz Adjacent channel selectivity C/I F=Fimage / / / / / / / TYP -86 / / / / / / / / / MAX / / +13 +5 0 -20 -20 -40 -40 -7 UNIT dBm dBm dB dB dB dB dB dB dB dBπ/4 DQPSK Sensitivity @0.01% BER Maximum received signal@0.1% BER C/I c-channel8DPSKSensitivity @0.01% BER Maximum received signal@0.1% BER C/I c-channelF=F0 + 1MHz F=F0 - 1MHz Adjacent channel selectivity C/I F=F0 + 2MHz F=F0 - 2MHz F=F0 + 3MHz F=F0 - 3MHz Adjacent channel selectivity C/I F=Fimage/ 0 / / / / / / / /-83 / / / / / / / / // / +18 +5 +5 -20 -20 -35 -35 0dBm dBm dB dB dB dB dB dB dB dBNotes:The information contained herein is the exclusive property of RDA and shall not be distributed, reproduced, or disclosed in whole or in part without prior written permission of RDA. Page 8 of 22RDA Microelectronics, Inc.RDA5876P Datasheet V1.11Table 6-4Transmit Characteristics ------ Enhanced Data Rate(VBAT = 4.0 V, TA = 27°C, unless otherwise specified) PARAMETER General specifications CONDITIONS MIN / / / / / / / / RMS DEVM / / / / / / / / / / / / / / 99% DEVM Peak DEVM RMS DEVM TYP +2 -1.6 +7.4 +6.7 +2.4 +7.1 +4.4 +2.7 4.7 / 8.8 4.6 / 11.3 -14.7 -15.2 -51.0 -51.2 -30 -30 / 100 MAX / / / / / / / / / 30 / / 20 / / / / / / / -32 / UNIT dBm dB kHz kHz kHz kHz kHz kHz kHz % % % % % % dBm dBm dBm dBm dBm dBm dBm %Maximum RF transmit powerRelative transmit controlπ/4 DQPSK max w0 π/4 DQPSK max wi π/4 DQPSK max |wi + w0| 8DPSK max w0 8DPSK max wi 8DPSK max |wi + w0| π/4 DQPSK Modulation Accuracy8DPSK Modulation Accuracy99% DEVM Peak DEVM F=F0 + 1MHz F=F0 - 1MHz F=F0 + 2MHzIn-band spurious emissionsF=F0 - 2MHz F=F0 + 3MHz F=F0 - 3MHz F=F0 +/- > 3MHzEDR Differential Phase CodingNotes:The information contained herein is the exclusive property of RDA and shall not be distributed, reproduced, or disclosed in whole or in part without prior written permission of RDA. Page 9 of 22RDA Microelectronics, Inc.RDA5876P Datasheet V1.117 FM Section Functional DescriptionLOUTI PGALNAP LNAN LNA +I ADCAudio DSP Coredigital filter MPX decoder stereo/mono audioL DACLimiterQ PGAQ ADCR DACROUT32.768 KHzVCO SynthesizerRDS /RBDS RSSIGPIOGPIORCLK 2.7-5.5 V VDDSCLKMCU LDOInterface Bus SDIO VIOFM ReceiverFigure 7-1. RDA5876P FM Tuner Block Diagram The PGA amplifies the mixer output IF signal and then digitized with ADCs. The DSP core finishes the channel selection, FM demodulation, stereo MPX decoder and output audio signal. The MPX decoder can autonomous switch from stereo to mono to limit the output noise. The DACs convert digital audio signal to analog and change the volume at same time. The DACs has low-pass feature and -3dB frequency is about 30 KHz. Synthesizer The frequency synthesizer generates the local oscillator signal which divide to quadrature, then be used to downconvert the RF input to a constant low intermediate frequency (IF). The synthesizer reference clock is 32.768 KHz. The synthesizer frequency is defined by bits CHAN[9:0] with the range from 50MHz to 115MHz.The receiver uses a digital low-IF architecture that avoids the difficulties associated with direct conversion while delivering lower solution cost and reduces complexity, and integrates a low noise amplifier (LNA) supporting the FM broadcast band (50 to 115MHz), a quadrature image-reject mixer, a programmable gain control (PGA), a high resolution analog-to-digital converters (ADCs), an audio DSP and a highfidelity digital-to-analog converters (DACs). The LNA has differential input ports (LNAP and LNAN) and supports any input port by set according registers bits (LNA_port_sel[1:0]). It default input common mode voltage is GND. The limiter prevents overloading and limits the amount of intermodulation products created by strong adjacent channels. The quadrature mixer down converts the LNA output differential RF signal to low-IF, it also has image-reject function.The information contained herein is the exclusive property of RDA and shall not be distributed, reproduced, or disclosed in whole or in part without prior written permission of RDA. Page 10 of 22RDA Microelectronics, Inc. Power Supply The RDA5876P FM section integrated LDO which supplies power to the chip. The external supply voltage range is 1.8-5.5 V. RESET and Control Interface select The RDA5876P FM section is RESET itself When VIO is Power up. And also support soft reset by trigger 02H BIT1 from 0 to 1. The control interface is I2C. Control Interface The I2C interface is compliant to I2C Bus Specification 2.1. It includes two pins: SCL and SDA. A I2C interface transfer begins with START condition, a command byte and data bytes, each byte has a followed ACK (or NACK) bit, and ends with STOP condition. The command byte includes a 7-bit chip address (0010000b) and a R/W bit. The ACK (or NACK) is always sent out by receiver. When in write transfer, data bytes is written out from MCU, and when in read transfer, data bytes is read out from RDA5876P. There is no visible register address in I2C interface transfers. The I2C interface has a fixed start register address (0x02h for write transfer and 0x0Ah for read transfer), and an internal incremental address counter. If register address meets the end of register file, 0x3Ah, register address will wrap back to 0x00h. For write transfer, MCU programs registers from register 0x02h high byte, then register 0x02h low byte, then register 0x03h high byte, till the last register. RDA5876P always gives out ACK after every byte, and MCU gives out STOP condition when register programming is finished. For read transfer, after command byte from MCU, RDA5876P sends out register 0x0Ah high byte, then register 0x0Ah low byte, then register 0x0Bh high byte, till receives NACK from MCU. MCU gives out ACK for data bytes besides last data byte. MCU gives out NACK for last data byte, and then RDA5876P will return the bus to MCU, and MCU will give out STOP condition. Details please refer to RDA5876P Programming Guide and RDA5802N Programming Guide and Datasheet.RDA5876P Datasheet V1.11The information contained herein is the exclusive property of RDA and shall not be distributed, reproduced, or disclosed in whole or in part without prior written permission of RDA. Page 11 of 22RDA Microelectronics, Inc.RDA5876P Datasheet V1.118 FM Section Electrical CharacteristicsTable 8-1 DC Electrical Specification (Recommended Operation Conditions): SYMBOL VBAT VIO Tamb VIL VIH VTHNotes: 1. VIO=1.8~3.3VDESCRIPTION Supply Voltage Interface Supply Voltage Ambient Temperature CMOS Low Level Input Voltage CMOS High Level Input Voltage CMOS Threshold VoltageMIN 3.3 1.5 -20 0 0.7*VIOTYP 4.0 3.0 27MAX 4.2 3.6 +75 0.3*VIO VIOUNIT V V ℃ V V V0.5*VIOTable 8-2 DC Electrical Specification (Absolute Maximum Ratings): SYMBOL VIO Tamb IIN VIN Vlna Notes: 1. For Pin: SCL, SDA DESCRIPTION Interface Supply Voltage Ambient Temperature Input Current (1) Input Voltage(1) LNA FM Input Level MIN -0.5 -40 -10 -0.3 TYP MAX +3.6 +90 +10 VIO+0.3 +10 UNIT V °C mA V dBmTable 8-3 Power Consumption Specification (VBAT = 4.0 V, VIO=1.5 to 3.6V, TA = -25 to 85 ℃, unless otherwise specified) SYMBOL IA IVIO IAPD IVIO DESCRIPTION Analog Supply Current Interface Supply Current Analog Powerdown Current Interface Powerdown Current Condition ENABLE=1 SCL and SDA inactive ENABLE=0 ENABLE=0 TYP 20 90 5 10 UNIT mA μA μA μAThe information contained herein is the exclusive property of RDA and shall not be distributed, reproduced, or disclosed in whole or in part without prior written permission of RDA. Page 12 of 22RDA Microelectronics, Inc.RDA5876P Datasheet V1.119 FM Section Receiver CharacteristicsTable 9-1 Receiver Characteristics (VBAT = 4.0 V, VIO= 3.0V, TA = 25 °C, unless otherwise specified)SYMBOL PARAMETER FM Input Frequency Range CONDITIONS Adjust BAND Register 50MHz 65MHz 88MHz 98MHz 108MHz 115MHz MIN 50 80 60 50 60 55 53 35 Single-ended Volume[3:0] =1111 Rload=1KΩ Rload=32Ω 32 Volume[3:0]=0000 1KHz=0dB ±3dB point Low Freq9TYPMAX 115UNIT MHzGeneral specificationsFin1.4 1.2 1.2 1.3 1.3 1.3 70 85 360 57 55 0.15 0.2 100 141.8 1.5 1.5 1.5 1.5 1.8 0.2 0.05 dBμV dB dB dB mV dB dB Ω % dB dB Hz μV EMFVrfSensitivity1,2,3S/N=26dBIP3inInput IP34AGCD=11,2αamS200 S400 VAFL; VAFR S/NAM Suppressionm=0.3 ±200KHz ±400KHz1,2Adjacent Channel Selectivity 400KHz Selectivity Audio L/R Output Voltage (Pins LOUT and ROUT) Maximum Signal to Noise Ratio1,2,3,5Volume [3:0] =1111 Mono2 Stereo6αSCS RLTHDStereo Channel Separation Audio Output Loading Resistance Audio Total Harmonic Distortion1,3,6αAOIRmute BWaudioAudio Output L/R Imbalance1,6 Mute Attenuation Ratio1 Audio Response160 -High FreqPins LNAN, LNAP, LOUT, ROUT and NC(22,23)Vcom_rfin Vcom Vcom_ncPinsLNAN/LNAPInputCommon Mode Voltage Audio Output Common Mode Voltage8 Pins NC ( 22,23 ) Common Mode Voltage 1.00 1.05 1.1V V VFloatingNotes:1. Fin=65 to 115MHz; Fmod=1KHz; de-emphasis=75μs; MONO=1; L=R unless noted otherwise;2. Δf=22.5KHz; 3. BAF = 300Hz to 15KHz, RBW <=10Hz; 6. Δf=75KHz,fpilot=10% 5. PRF=60dBUV; 8. At LOUT and ROUT pins 4. |f2-f1|>1MHz, f0=2xf1-f2, AGC disable, Fin=76 to 108MHz; 7. Measured at VEMF = 1 m V, f RF = 65 to 108MHz 9. AdjustableThe information contained herein is the exclusive property of RDA and shall not be distributed, reproduced, or disclosed in whole or in part without prior written permission of RDA. Page 13 of 22RDA Microelectronics, Inc.RDA5876P Datasheet V1.1110 Pins DescriptionGPIO2/ WLAN_ACTIVE HOST_WAKEFM_OUTRUART_TXFM_OUTLVOUT12323130292827NC26UART_RX 1 PCM_DOUT 2 PCM_DIN 3 PCM_CLK 4 PCM_SYNC 5 VIO 6 VOUT18 7 NC 8NC2524 23NC FM_IP FM_IN AGPIO1/BT_PRIORITY AGPIO0/BT_ACTIVE RF NC NCGND PAD RDA5876P 32 Pins22 21 20 19 18 17910111213141516XIN_32KI2C_SDAXEN_OUTFigure10-1. RDA5876P Top ViewThe information contained herein is the exclusive property of RDA and shall not be distributed, reproduced, or disclosed in whole or in part without prior written permission of RDA. Page 14 of 22LDO_ONI2C_SCLVBATXINNCRDA Microelectronics, Inc.RDA5876P Datasheet V1.11Table 10-1RDA5876P Pins DescriptionPINNO.DESCRIPTIONUART_RX PCM_DOUT PCM_DIN PCM_CLK PCM_SYNC VIO VOUT18 NC VBAT XIN_32K I2C_SDA I2C_SCL XEN_OUT XIN NC LDO_ON NC NC RF AGPIO0 AGPIO1 FM_IN FM_IP NC NC NC FM_OUTL FM_OUTR VOUT12 GPIO2 HOST_WAKE UART_TX1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32UART data input Synchronous data output Synchronous data input Synchronous data clock Synchronous data sync IO power supply Analog voltage output, connected with decouple capacitor Should be not connected Bluetooth and FM power supply 32.768K clock input I2C interface Data signal I2C interface Clock signal Clock request output For 26Mhz external clock input Should be not connected Internal LDO power on Should be not connected Should be not connected Bluetooth Radio signal Programmable I/O Also used ad bt_active when using WIFI co-existence handshake interface. Programmable I/O. Also used as bt_priority when using WIFI co-existence handshake interface. LNA input port. For single-ended input, LNAN should be connected to RFGND LNA input port. For single-ended input, LNAN should be connected to RFGND Should be not connected Should be not connected Should be not connected Left audio output Right audio output Digital voltage output, connected with decouple capacitor Programmable I/O. Also used as wl_active when using WIFI co-existence handshake interface. Output to wakeup host UART data outputThe information contained herein is the exclusive property of RDA and shall not be distributed, reproduced, or disclosed in whole or in part without prior written permission of RDA. Page 15 of 22RDA Microelectronics, Inc.RDA5876P Datasheet V1.1111 Application CircuitThe information contained herein is the exclusive property of RDA and shall not be distributed, reproduced, or disclosed in whole or in part without prior written permission of RDA. Page 16 of 22RDA Microelectronics, Inc.RDA5876P Datasheet V1.1112 Package Physical DimensionFigure12-1illustratesthepackage RoHS-compliant. details for the RDA5876P. The package is lead-free andThe information contained herein is the exclusive property of RDA and shall not be distributed, reproduced, or disclosed in whole or in part without prior written permission of RDA. Page 17 of 22RDA Microelectronics, Inc. Figure12-1. 32-Pin 4x4 Quad Flat No-Lead (QFN)RDA5876P Datasheet V1.1113 PCB Land PatternFigure13-3.Classification Reflow ProfileTable 13-1Classification Reflow ProfilesSn-Pb Eutectic Assembly 3 ℃/second max. Pb-Free Assembly 3 ℃/second max.Profile Feature Average Ramp-Up Rate (TSmax to Tp) Preheat -Temperature Min (Tsmin) -Temperature Max (Tsmax) -Time (tsmin to tsmax) Time maintained above: -Temperature (TL) -Time (tL) Peak /Classification Temperature(Tp) Time within 5 oC of actual Peak Temperature (tp) Ramp-Down Rate Time 25 oC to Peak100 ℃ 100 ℃ 60-120 seconds 183 ℃ 60-150seconds See Table 9-2 10-30 seconds 6 ℃/second max. 6 minutes max.150 ℃ 200 ℃ 60-180 seconds 217℃ 60-150 seconds See Table 9-3 20-40 seconds 6 ℃/seconds max. 8 minutes max.The information contained herein is the exclusive property of RDA and shall not be distributed, reproduced, or disclosed in whole or in part without prior written permission of RDA. Page 18 of 22RDA Microelectronics, Inc. TemperatureRDA5876P Datasheet V1.11Table 13-2 Pb-free Process – Package Peak Reflow Temperatures Package Thickness Volume mm3 <350＜2.5mm ≥2.5mm 240 + 0/-5 ℃ 225 + 0/-5 ℃Volume mm3 ≥350 225 + 0/-5 ℃ 225 + 0/-5 ℃Table 13-3 Pb-free Process – Package Classification Reflow Temperatures Package Volume mm3 Volume mm3 Volume mm3 Thickness 350-2000 ＜350 ＞2000＜1.6mm 1.6mm – 2.5mm ≥2.5mm 260 + 0 ℃ * 260 + 0 ℃ * 250 + 0 ℃ * 260 + 0 ℃ * 250 + 0 ℃ * 245 + 0 ℃ * 260 + 0 ℃ * 245 + 0 ℃ * 245 + 0 ℃ **Tolerance : The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature(this mean Peak reflow temperature + 0 ℃. For example 260+ 0 ℃ ) at the rated MSL Level. Note 1: All temperature refer topside of the package. Measured on the package body surface. Note 2: The profiling tolerance is + 0 ℃, - X ℃ (based on machine variation capability)whatever is required to control the profile process but at no time will it exceed – 5 ℃. The producer assures process compatibility at the peak reflow profile temperatures defined in Table 13-3. Note 3: Package volume excludes external terminals(balls, bumps, lands, leads) and/or non integral heat sinks. Note 4: The maximum component temperature reached during reflow depends on package the thickness and volume. The use of convection reflow processes reduces the thermal gradients between packages. However, thermal gradients due to differences in thermal mass of SMD package may sill exist. Note 5: Components intended for use in a “lead-free” assembly process shall be evaluated using the “lead free” classification temperatures and profiles defined in Table13-1, 13-2, 13-3 whether or not lead free.RoHS CompliantThe product does not contain lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (PBB) or polybrominated biphenyl ethers (PBDE), and are therefore considered RoHS compliant.ESD SensitivityIntegrated circuits are ESD sensitive and can be damaged by static electricity. Proper ESD techniques should be used when handling these devices.The information contained herein is the exclusive property of RDA and shall not be distributed, reproduced, or disclosed in whole or in part without prior written permission of RDA. Page 19 of 22。
Agilent EMC预先合规系统及配件目录说明书
1981EMC Precompliance Systemsand Accessories CatalogAgilent 84115EMEMC precompliance systemsAgilent E7402A and E7405AEMC precompliance analyzersAgilent E7415A EMCmeasurement softwareAgilent EMC precomplianceAntennas, probes, preamplifiers,and other accessories23Page Model number Description128120-1840122 centimeter coaxial cable 128449B Microwave preamplifier485115EM Preproduction evaluation systems1211500A Six foot RG-214U cable with type-N connector 1211500F150 cm cable (APC 3.5 male connectors)884115EM-11909A Preamplifier1211940A Close field probe 30 MHz to 1 GHz 1211941AClose field probe 9 KHz to 30 MHz 1184115EM-11945A Close field probe set 984115EM-11947A Transient limiter 484115EM-11955A Biconical antenna 484115EM-11956A Log periodic antenna784115EM-11966E Double-ridged waveguide horn antenna 1 GHz to 18 GHz 784115EM-11966J Horn antenna 18 GHz to 40 GHz 984115EM-11966L Coaxial cable 10 meter type-N 784115EM-11966P Broadband antenna1084115EM-11967D 10A line impedance stabilization network 884115EM-11968C Antenna tripod5E7415AEMI measurement softwareEMC Precompliance Systems and Test AccessoriesGeneral descriptionEarly evaluation of your design’s EMI performance is essential for a successful product. Whether your industry is information technology, communications,automotive, medical, or industrial equipment,your product must comply with EMC requirements before it can be introduced to the marketplace.With Agilent Technologies’ EMC precompliance solutions, you get all the features that make in-house EMC precompliance testing a simple reality:•Preprogrammed, automated measurements that require no special knowledge or training, so you can begin making EMC measurements as soon as your EMC precompliance analyzer arrives.•Interactive software that allows you to perform test from your PC, or capture measurements made directly from the front panel.•Automatic remeasure functions for consistent repeatable results.• A variety of measurement tools and accessories available with our packaged precompliance systems.Table of contentsListed by Agilent Technologies model number4The 84115EM makes ordering your EMC precom-pliance system easy. The 84115EM provides the tools and accessories you need to perform radiated and conducted emissions measurements to test your product to the major commercial regulatory agency requirements. In addition, the system provides the troubleshooting tools you need to locate emission hot spots.Agilent 84115EM preproduction evaluation systemsIncludes:E7400A Series EMC analyzerAt least three of the following options:11945A, 11955A, 11956A, 11966P, 11966E, 11966J, E7415A,11967DOptionsSelect and configure the E7400A series EMC analyzer of your choice.E7402A, 30 Hz to 3.0 GHz (default selection)E7405A, 30 Hz to 26.5 GHzSelect the EMC accessories of your choice.84115EM-11945A Close field probe set (default)84115EM-11955A Biconical antenna30 MHz to 300 MHz (default)84115EM-11956A Log periodic antenna200 MHz to 1 GHz (default)84115EM-11966P BiConiLog broadband antenna26 MHz to 2 GHz84115EM-11966E Double ridged waveguide hornantenna, 1 GHz to 18 GHz84115EM-11966J Horn antenna, 18 GHz to 40 GHz 84115EM-11968C Antenna tripod (default)84115EM-11966L 10 m type N cable (default)E7415A EMI measurement software (default)84115EM-11909A Amplifier, 9 kHz to 1 GHz84115EM-11947A Transient limiter with high-passfilter (default)84115EM-11967D Line Impedance StabilizationNetwork (LISN), NEMA (default)84115EM-11967D-001Line Impedance StabilizationNetwork (LISN), SCHUKO84115EM-11967D-002 Line Impedance StabilizationNetwork (LISN), British Recommended GPIB interface 82350B PCI GPIB card 82357AUSB/GPIB adapterEMCPrecompliance Test SystemUse the EMC analyzer with the 84115EM-11967D LISN device to test forconducted emissions.A number of antennas are available with the 84115EM system to test for RF emissions. The E7400 EMCanalyzer will also work with other third party antennas.The 11945A probe set included with the 84115EM system provides a troubleshooting tool to locate emission hot spots.Agilent EMC analyzersThe heart of the EMI precompliance measurement system is the Agilent E7400 A series portable EMC analyzer. This analyzer has all the capabilities needed to perform EMI measurements including quasi peak detectors, average detectors, and EMI bandwidths. The E7400 A series is offered in two different models to better meet your needed frequency range.Models:E7402A30 Hz to 3.0 GHzE7405A30 Hz to 26.5 GHzIncludes:E740xA-AYQ EMI detectors/FM demodE740xA-AYX Adds fast time domain sweepE740xA-1D5High stability time base(includes 1 and 3 Hz RBW)E740xA-1DS RF preamplifier (20 dB gain1 MHz to 3.0 GHz)E740xA-1DR Narrow resolution bandwidths to 10 Hz E740xA-A4H GPIB/parallel portE740xA-B72Memory extension to 10 MBE740xA-060Low emissions shieldingE740xA-UKB Low frequency extension (30 Hz3)E740xA-XXX IntuiLink connecting software Options:E740xA-1AX Replaces GPIB with RS-2321E740xA-1CP Rack mount and handle kitE740xA-1D6Time gated sweepE740xA-1DN Adds tracking generatorE740xA-A5D Adds 12 Vdc power cableE740xA-AXT Adds transit caseE740xA-AYT Adds grey soft carrying caseE740xA-UK6Commercial calibration certificateE740xA-UK9Front panel cover Agilent E7415A EMI measurement software The E7415A EMI software simplifies your testsetup. The software allows you to maintain repeatable customized test setups, capture and save data on your PC, and generate test reports. Supports Windows® 95, 98 and NT® 4.0, XP and 2000.Includes:•Supports the E7400 Series, 8590EM Series and the 8546A/42E Series of EMC analyzers •Report generation capabilityOptionsE7415A-001Post processing reporting only21.Not compatible with E7415A2.Option E7415A-001 includes only the post processing report generation to be runon a separate P.C. Excludes data acquisition capability.3.30 Hz nominal; 100 Hz specifiedEMI Precompliance Analyzer and Test Software56Agilent 84115EM-11955A biconical antennaThis economical antenna has typical antenna factors.Standard component of the84115EM EMC precompliance test system.Antennas are supplied to Agilent by ETS-Lindgren. To purchase separate-ly, see: /vipFrequency range30 MHz to 300 MHz Maximum continuous power 250 mW VSWR (average) 2.0 : 1Impedance 50 ΩConnector type N femaleMounting base1/4 inch x 20 female threadAgilent 84115EM-11956A log periodic antennaThis economical antenna has typical antenna factors.Standard component of the84115EM EMC precompliance test system.Antennas are supplied to Agilent by ETS-Lindgren. To purchase separate-ly, see: /vipFrequency range200 MHz to 2 GHz Maximum continuous power 1 kW VSWR (average) 1.2 : 1Impedance 50 ΩConnector type Type-NMounting base1/4 inch x 20 female thread7Agilent 84115EM-11966E double ridged waveguide horn antennaThis antenna covers a very broad frequency range and provides excel-lent gain and VSWR characteristics.It is suitable for receiving andtransmitting signals and can handle up to 300 watts of power.Available as an option in the84115EM EMC precompliance test system.Antennas are supplied to Agilent by ETS-Lindgren. To purchase separate-ly, see: /vipFrequency range1 GHz to 18 GHz Maximum continuous power 300 W VSWR (average)< 1.5 : 1Impedance 50 ΩConnector type N femaleMounting base1/4 inch x 20 female threadAgilent 84115EM-11966J horn antennaThe double-ridged design of this horn enables it to cover two wave-guide bands with a single antenna.Available as an option in the84115EM EMC precompliance test system.Antennas are supplied to Agilent by ETS-Lindgren. To purchase separately,see: /vipFrequency range18 GHz to 40 GHz Maximum continuous power 50 W VSWR (average)< 1.6 : 1Impedance 50 ΩConnector type K femaleMounting base 1/4 inch x 20 female threadAgilent 84115EM-11966P broadband antennaThe 11966P broadband antenna covers 30 MHz to 2 GHz. This broad-band antenna removes the need to change antennas above 200 MHzwhen making radiated EMI measure-ments. The antenna’s high power handling capability makes it ideal for immunity testing generating fields of up to 10 volts/meter.Available as an option in the84115EM EMC precompliance test system.Antennas are supplied to Agilent by ETS-Lindgren. To purchase separately,see: /vipFrequency range30 MHz to 2 GHzMaximum continuous power 1 kW (300 W below 60 MHz)VSWR (average) 2 : 1Impedance (nominal)50 ΩConnector typeN (female)Note: Tripod not included8Agilent 84115EM-11968C antenna tripodThe 11968C is a non-metallic tripod made of linen phenolic and delrin to minimize unwanted reflections in the test environment.Standard component of the84115EM EMC precompliance test system.Tripods are supplied to Agilent by ETS-Lindgren. To purchase separate-ly, see: /vipPreamplifierHeight 94 cm to 2.0 m Maximum load 11.8 kg Thread 1/4 inch x 20 female threadAntenna tripodFrequency range 9kHz to 1 GHzGain32.5 +/- 1.5 dB at 100 MHz Gain flatness 25 kHz to 800 MHz ±0.5 dBNoise figure5 MHz to 500 MHz 1.8 dB typical 500 MHz to 1 GHz 2.5 dB typicalConnector type Type NPower requirements 100, 120, 220, or 240V AC, ±10%50 Hz to 60 Hz, 10VAAgilent 84115EM-11909A amplifier (sold separately as 11909A)The amplifier improves receiver and spectrum analyzer sensitivity. It is ideally suited for use with the Agilent 11940A and Agilent 11941A close-field probes to detect low-level emissions from a device under test.Radiated emissions from measure-ments using a spectrum analyzer and antenna are improved by the increased sensitivity that this unit offers.Available as an option in the 84115EM EMC systems.9Agilent 84115EM-11966LThis 10 meter (32.8 ft) antenna cable is constructed of RG-214/U coaxial cable with type-N male connectors at both ends.Standard component of the84115EM EMC precompliance test system.Cables are supplied to Agilent by ETS-Lindgren. To purchase separately,see:/vipLimitersAgilent 84115EM-11947A transient limiter(sold separately as 11974A)In precompliance applications where a spectrum analyzer is used for measurements instead of an EMI receiver,it is always a good idea to use a transient limiter. Transient limiters protect the spectrumanalyzer input from damage caused by high-level transients from line impedance stabilization networks (LISNs) during EMI testing for conducted emissions.Standard component of the84115EM EMC precompliance test system.Frequency range 9 kHz to 200 MHz Insertion loss10 dBMaximum input levelContinuous: 2.5 W (+34 dBm)Pulse: 10 kW for 10 µsec DC: ±12 VCables10Agilent 84115EM-11967D 10 Amp line impedance stabilization networkThis V-network, two line, single phase line impedance stabilization network (LISN) meets the require-ments of the FCC, VDE, and the European Norms (ENs) for commer-cial conducted emissions testing.NEMA power outlet comes standard with the product.Standard option in the 84115EM EMC precompliance test system. LISN can be purchased separately at:/vipConducted EMI accessoriesFrequency range9 kHz to 30 MHzPower source frequency 60 Hz, or 50 Hz with Option 11967D-001 or 11967D-002Maximum current 10 AMaximum voltage 125 VAC line-to-ground250 VAC line-to-ground (Option 11967D-001 or 11967D-002)Network inductance 50 µH to 250 µH Network impedance 50 ΩConnector type BNC female StandardNEMA outlet Option 11967D-001SCHUKO outlet Option 11967D-002British outlet1184115EM EMC Precompliance Test System ComponentsMagnetic field probesAgilent 84115EM-11945A close field probe set(sold separately as 11945A)The 11945A close field probe setincludes both the 11940A and 11941A probes to provide full coverage from 9 kHz to 1 GHz. This set provides a powerful measurement tool for electrical and mechanical designers who want to search for and eliminate sources of interference from their products early in the design process.Option 11945A-E51 adds 11909A preamplifier, a 36 inch (914 mm) Type-N cable and a carrying bag to store and protect the entire set of probes, preamplifier, and cables.Included in the 84105EM standard option in the 84115EM EMC systems.Also available for purchase separately.12Agilent 8449Bmicrowave preamplifierA high-gain, low-noise preamplifier to provide additional sensitivity for MIL-STD radiated measurements.Frequency range 1 GHz to 26.5 GHz Noise figure 1.0 to 12.5 GHz 8.5 dB12.5to 22.0 GHz 12.5 dB 22.0to 26.5 GHz 14.5 dBMinimum gain 23.5 dB Gain flatness 1.0to 26.5 GHz ±4.5 dB2.0to 22.0 GHz ±3.5 dBConnector type APC–3.5 femaleAgilent 11940A and 11941A close field probesThese hand-held probes are specially designed to measure magnetic field radiation from surface currents, slots,cables, and ICs for EMC diagnostic and troubleshooting measurements. Their unique design results in a high level ofelectric field rejection. This significantly reduces errors allowing calibrated and repeatable measurements. Each probe is calibrated and comes with a two-meter,RG-223 coaxial cable, an SMA(f) to type-N(m) adapter, and an SMA(f) to BNC(m)adapter.Option 1194xA-001 adds an SMA rotary joint connector. Probes are included in the 11945A close field probe set. Additional EMC AccessoriesPreamplifiersFrequency range 11940A: 30 MHz to 1 GHz 11941A: 9 kHz to 30 MHz Maximum input power 0.5 WTemperature range Variation over 0 °C to + 40 °C Dielectric breakdown ±1 kV, typicalConnector SMA, replaceable barrelVSWR< 3 : 1, typical for 11940A onlyAntenna factor accuracyIndividually calibrated to within ±2 dB in a 377 Ωfield impedanceAgilent 11500A cableSix foot long RG-214/U cable with type-N connectors.Agilent 11500F cable150 centimeter cable with APC 3.5 male connector.8120-1840122 centimeter (48 inches) coaxial cable with type-BNC male connectors at both ends.13EMC Accessory Application GuideCommercial measurementsAgency Test Frequency range Recommended accessories FCC Part 15conducted450 kHz to 30 MHz11967D LISNradiated30 MHz to 300 MHz11955A biconical antenna200 MHz to 1 GHz11956A log periodic antennaor30 MHz to 1 GHz11966P broadband antennaVDE0871, 0875conducted10 kHz to 30 MHz11967D LISNradiated30 MHz to 300 MHz11955A biconical antenna200 MHz to 1 GHz11956A log periodic antennaCISPR22conducted150 kHz to 30 MHz11967D LISNVCCIconducted150 kHz to 30 MHz11967D LISNradiated30 MHz to 300 MHz11955A biconical antenna200 MHz to 1 GHz11956A log periodic antennaCENELEC EN 55014conducted150 kHz to 30 MHz11967D LISNradiated30 MHz to 300 MHz11955A biconical antennaEN 55022conducted150 kHz to 30 MHz11967D LISNradiated30 MHz to 300 MHz11955A biconical antenna200 MHz to 1 GHz11956A log periodic antennaEN 55011conducted150 kHz to 30 MHz11967D LISNradiated30 MHz to 300 MHz11955A biconical antenna200 MHz to 1 GHz11956A log periodic antenna 141516Online/find/emcfor additional literature information./find/notifymesubscribe online to receive test and measurement updates.LiteratureESA/EMC, Configuration Guide,Literature number 5968-3412E.EMC Precompliance Analyzers and EMI Measurement Software,Literature number 5968-2516E.EMC Analyzers , Data Sheet Literature number 5968-3662E.Cookbook for EMC Precompliance Measurements, Literature number 5968-3661E.For More Information/find/emailupdates Get the latest information on the products and applications you select.Agilent Email UpdatesAgilent Technologies’ Test and Measurement Support,Services, and AssistanceAgilent Technologies aims to maximize the value you receive, while minimizing your risk and problems. We strive to ensure that you get the test and measurement capabilities you paid for and obtain the support you need.Our extensive support resources and services can help you choose the right Agilent products for your applications and apply them successfully. Every instrument and system we sell has a global warranty. Support is available for at least five years beyond the production life of the product.Two concepts underlie Agilent ’s overall support policy:“Our Promise ” and “Your Advantage.”Our PromiseOur Promise means your Agilent test and measurement equipment will meet its advertised performance and functionality. When you are choosing new equipment, we will help you with product information, including realistic performance specifications and practical recommendations from experienced test engineers. When you use Agilent equipment, we can verify that it works properly, help with product operation, and provide basic measurement assis-tance for the use of specified capabilities, at no extra cost upon request. Many self-help tools are available.Your AdvantageYour Advantage means that Agilent offers a wide range of additional expert test and measurement services, which you can purchase according to your unique technical and business needs. Solve problems efficiently and gain a competitive edge by contracting with us for calibration,extra-cost upgrades, out-of-warranty repairs, and onsite education and training, as well as design, system integra-tion, project management, and other professional engineer-ing services. Experienced Agilent engineers and techni-cians worldwide can help you maximize your productivity,optimize the return on investment of your Agilent instru-ments and systems, and obtain dependable measurement accuracy for the life of those products.Agilent T&M Software and ConnectivityAgilent ’s Test and Measurement software and connectivity products, solutions and developer network allows you to take time out of connecting your instruments to your com-puter with tools based on PC standards, so you can focus on your tasks, not on your connections. Visit/find/connectivityfor more information.By internet, phone, or fax, get assistance with all your test & measurement needs Online Assistance:/find/assistProduct specifications and descriptions in this document subject to change without notice.© Agilent Technologies, Inc. 2001, 2002, 2004Printed in USA, April 19, 20045988-3290ENPhone or Fax United States:(tel) 800 829 4444Canada:(tel) 877 894 4414(fax) 905 282 6495China:(tel) 800 810 0189(fax) 800 820 2816Europe:(tel) (31 20) 547 2323(fax) (31 20) 547 2390Japan:(tel) (81) 426 56 7832(fax) (81) 426 56 7840Korea:(tel) (82 2) 2004 5004 (fax) (82 2) 2004 5115Latin America:(tel) (305) 269 7500(fax) (305) 269 7599Taiwan :(tel) 0800 047 866 (fax) 0800 286 331Other Asia Pacific Countries:(tel) (65) 6375 8100 (fax) (65) 6836 0252Email:*******************。
安捷伦 6475 三重四极杆液质联用系统说明书
IntroductionThe Agilent 6475 triple quadrupole LC/MS system delivers superior robustness, versatility, and sensitivity for targeted and routine trace-level applications. Built on a trusted ion optics platform, it contains a multitude of technological advantages, such as VacShield ion injection, an octupole ion guide, heated hyperbolic quadrupoles, a curved and tapered collision cell, and an advanced 20 kV detector assembly. This hardware is augmented by powerful and sophisticated onboard instrument intelligence, such as early maintenance feedback, intelligent reflex (iReflex) automated secondary injection, scheduled SWARM autotune/checktune, and a fully automated method optimizer. The combination of powerful hardware with sophisticated instrument intelligence will help you achieve peak analytical performance, high sample throughput, and confidence in your results.Agilent 6475 Triple QuadrupoleLC/MS SystemInstrument performance specifications2/chem/6475DE40499498This information is subject to change without notice.© Agilent Technologies, Inc. 2022Printed in the USA, May 23, 20225994-4930EN Ordering informationThe G6475AA must be ordered in conjunction with M5930AA or M5940AA depending on the need to operate on a local workstation configuration or networked workstation configuration.–Agilent 6475 triple quadrupole LC/MS system with AJS ion source and PC workstation (G6475AA)–Agilent MassHunter Workstation software for LC/TQ (M5930AA)–Agilent MassHunter Networked Workstation software for LC/TQ (M5940AA)DisclaimerPerformance and checkout at installation uses instrument detection limit (IDL), which is a meaningful and statistically relevant measurement of instrument sensitivity. The signal-to-noise (S/N) ratio specification does not predict the limit of detection (LOD) or limit of quantitation (LOQ) for the system of user application. S/N applies only to the conditions or concentrations specified and cannot be extrapolated to any other conditions or concentrations. On-site demonstration of S/N must be purchased as an add-on, and will only be carried out on newly purchased standard Agilent 1260 Infinity II Prime or 1290 Infinity II LC systems with an Ultra Clean tubing kit.Accessories and other featuresPhysical instrument specifications。
7406芯片
Hitachi CodeJEDECEIAJWeight (reference value)DP-14ConformsConforms0.97 gUnit: mmHitachi CodeJEDECEIAJWeight (reference value)FP-14DA—Conforms0.23 gUnit: mm*Dimension including the plating thickness Base material dimension° – 8°Hitachi Code JEDEC EIAJ Weight (reference value)FP-14DN Conforms Conforms0.13 gUnit: mm°– 8°*Pd platingCautions 1.Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,copyright, trademark, or other intellectual property rights for information contained in this document.Hitachi bears no responsibility for problems that may arise with third party’s rights, includingintellectual property rights, in connection with use of the information contained in this document.2.Products and product specifications may be subject to change without notice. Confirm that you havereceived the latest product standards or specifications before final design, purchase or use.3.Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,contact Hitachi’s sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,traffic, safety equipment or medical equipment for life support.4.Design your application so that the product is used within the ranges guaranteed by Hitachi particularlyfor maximum rating, operating supply voltage range, heat radiation characteristics, installationconditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as fail-safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product.5.This product is not designed to be radiation resistant.6.No one is permitted to reproduce or duplicate, in any form, the whole or part of this document withoutwritten approval from Hitachi.7.Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor products.Hitachi, Ltd.Semiconductor & Integrated Circuits.Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109Copyright ' Hitachi, Ltd., 1999. All rights reserved. Printed in Japan.Hitachi Asia Pte. Ltd.16 Collyer Quay #20-00Hitachi Tower Singapore 049318Tel: 535-2100Fax: 535-1533URL NorthAmerica : http:/Europe : /hel/ecg Asia (Singapore): .sg/grp3/sicd/index.htm Asia (Taiwan): /E/Product/SICD_Frame.htm Asia (HongKong): /eng/bo/grp3/index.htm Japan : http://www.hitachi.co.jp/Sicd/indx.htmHitachi Asia Ltd.Taipei Branch Office 3F, Hung Kuo Building. No.167, Tun-Hwa North Road, Taipei (105)Tel: <886> (2) 2718-3666Fax: <886> (2) 2718-8180Hitachi Asia (Hong Kong) Ltd.Group III (Electronic Components)7/F., North Tower, World Finance Centre,Harbour City, Canton Road, Tsim Sha Tsui,Kowloon, Hong Kong Tel: <852> (2) 735 9218Fax: <852> (2) 730 0281 Telex: 40815 HITEC HXHitachi Europe Ltd.Electronic Components Group.Whitebrook ParkLower Cookham RoadMaidenheadBerkshire SL6 8YA, United KingdomTel: <44> (1628) 585000Fax: <44> (1628) 778322Hitachi Europe GmbH Electronic components Group Dornacher Stra§e 3D-85622 Feldkirchen, Munich Germany Tel: <49> (89) 9 9180-0Fax: <49> (89) 9 29 30 00Hitachi Semiconductor(America) Inc.179 East Tasman Drive,San Jose,CA 95134Tel: <1> (408) 433-1990Fax: <1>(408) 433-0223For further information write to:。
埃森普项目器搭载兼容性信息表说明书
Epson America, Inc. 3131 Katella Ave., Los Alamitos, CA 90720
Epson Canada Limited 185 Renfrew Drive, Markham, Ontario L3R 6G3
www.epson.ca
BrightLink 475Wi/480/485Wi BrightLink Pro 1410Wi
PowerLite 570/575W/580/585W
BrightLink 575Wi/585Wi/595Wi BrightLink Pro 1420Wi/1430Wi
PowerLite 675W/680/685W/720/ 725W/750F/760W/770F/755F/
BrightLink 475Wi/480/485Wi/575Wi/585Wi/ 595Wi/685Wi/695Wi/696Ui/697Ui/710Ui/
725Wi/735Fi/760Wi/770Fi
BrightLink Pro 1410Wi/1420Wi/ 1430Wi/1450Ui/1460Ui/1470Ui
N/A
Legacy Mounts: V12H517020 (ELPMB28) – Discontinued V12H675020 (ELPMB43) – Discontinued V12H777020 (ELPMB46) – Discontinued V12H902020 (ELPMB53) – Discontinued
V12H706020 (ELPMB45) – Discontinued V12H706020 (ELPMB45) – Discontinued
PowerLite L200SX/L200SW/ L210SW/L210SF
欧美电子产品数据手册说明书
Eaton 167706Eaton Moeller series xEffect - FRCmM-NA RCCB. Residual currentcircuit breaker (RCCB), 40A, 4p, 30mA, type G/A, UL, 110VGeneral specificationsEaton Moeller series xEffect - FRCmM-NA RCCB167706FRCMM-40/4/003-G/A-NA-110401508164247280 mm71 mm70 mm0.32 kg RoHS conformUL 1053ÖVE E 8601 IEC/EN 61008 EN45545-2 IEC 61373Additionally protects against special forms of residual pulsating DC which have not been smoothed.Product Name Catalog NumberModel CodeEAN Product Length/Depth Product Height Product Width Product Weight Compliances Certifications Catalog Notes40 AIs the panel builder's responsibility. The specifications for the switchgear must be observed.7035-35 °CMeets the product standard's requirements.Is the panel builder's responsibility. The specifications for the switchgear must be observed.DIN railQuick attachment with 2 latch positions for DIN-rail IEC/EN 6071540 ADoes not apply, since the entire switchgear needs to be evaluated.0.03 A100 V AC - 210 V AC, 94 V AC - 132 V AC (UL)Meets the product standard's requirements.Short time-delayed8 ms delay at 60 Hz10 ms delay at 50 HzInterlocking device500 A eaton-rcd-application-guide-br019003en-en-us.pdfUL 1053 DIN Rail RCCBEaton's Volume 4—Circuit Protectioneaton-xeffect-industrial-switchgear-range-catalog-ca003002en-en-us.pdf eaton-xeffect-frcmm-na-rccb-catalog-ca003019en-en-us.pdfDA-DC-03_FRCmeaton-circuit-breaker-xeffect-frcmm-na-rccb-dimensions.epsMA180503312DA-CD-f9_ul1053_4pDA-CS-f9_ul1053_4pEaton Specification Sheet - 167706eaton-circuit-breaker-xeffect-frcmm-rccb-wiring-diagram-002.eps eaton-xeffect-frcmm-rccb-wiring-diagram-002.jpgRated operational current for specified heat dissipation (In) 10.11 Short-circuit ratingRAL-numberPermitted storage and transport temperature - min10.4 Clearances and creepage distances10.12 Electromagnetic compatibilityMounting MethodAmperage Rating10.2.5 LiftingRated fault current - maxTest circuit range10.2.3.1 Verification of thermal stability of enclosures Tripping timeFitted with:Rated residual making and breaking capacity Application notesBrochuresCatalogsCertification reports DrawingsInstallation instructions mCAD model Specifications and datasheets Wiring diagramsFrequency rating50 Hz / 60 Hz10.8 Connections for external conductorsIs the panel builder's responsibility.Fault current rating30 mATerminal protectionFinger and hand touch safe, DGUV VS3, EN 50274Special featuresFRCmM-NA-110Residual current circuitbreakersType G/A (ÖVE E 8601)Sensitivity typePulse-current sensitiveAmbient operating temperature - max40 °CHeat dissipation per pole, current-dependent3.275 WClimatic proofing25-55 °C / 90-95% relative humidity according to IEC 60068-2Built-in depth70.5 mmShort-circuit ratingMax. admissible back-up fuse: 63 A gG/gL, 70 A class J fuse (UL)FeaturesResidual current circuit breakerAdditional equipment possibleLifespan, electrical4000 operationsTerminal capacity (cable)M5 (with cross-recessed screw as defined in EN ISO 4757-Z2, PZ2)Connectable conductor cross section (solid-core) - min1.5 mm²Contact position indicator colorRed / green10.9.3 Impulse withstand voltageIs the panel builder's responsibility.Number of polesFour-poleTerminal capacity (solid wire)1.5 mm² - 35 mm²Ambient operating temperature - min-25 °C10.6 Incorporation of switching devices and componentsDoes not apply, since the entire switchgear needs to be evaluated.Rated short-circuit strength5 kA (UL, as per CSA)10 kA with back-up fuse10.5 Protection against electric shockDoes not apply, since the entire switchgear needs to be evaluated.Used withFRCmM-NA-110Type G/A (�VE E 8601)Residual current circuit breakersMounting positionAs requiredEquipment heat dissipation, current-dependent13.1 W10.13 Mechanical functionThe device meets the requirements, provided the information in the instruction leaflet (IL) is observed.10.2.6 Mechanical impactDoes not apply, since the entire switchgear needs to be evaluated.10.9.4 Testing of enclosures made of insulating materialIs the panel builder's responsibility.ApplicationSwitchgear for 110-V systems10.3 Degree of protection of assembliesDoes not apply, since the entire switchgear needs to be evaluated.Voltage rating (IEC/EN 60947-2)110/190 VVoltage typeACTerminal capacity (stranded cable)16 mm² (2x)Leakage current typeAFrame45 mmBuilt-in width (number of units)70 mm (4 SU)Terminals (top and bottom)Lift terminalsAmbient humdity range5 - 95 %Impulse withstand current3 kA (8/20 μs) surge-proofWidth in number of modular spacings410.2.3.2 Verification of resistance of insulating materials to normal heatMeets the product standard's requirements.10.2.3.3 Resist. of insul. mat. to abnormal heat/fire by internal elect. effectsMeets the product standard's requirements.Lifespan, mechanical10000 operationsStatus indicationWhite / blue10.9.2 Power-frequency electric strengthIs the panel builder's responsibility.Connectable conductor cross section (solid-core) - max35 mm²Degree of protectionIP20, IP40 with suitable enclosureIP20Rated short-time withstand current (Icw)10 kAOvervoltage tested - max530 VPollution degree210.7 Internal electrical circuits and connectionsIs the panel builder's responsibility.Connectable conductor cross section (multi-wired) - min 1.5 mm²Rated impulse withstand voltage (Uimp)4 kV10.10 Temperature riseThe panel builder is responsible for the temperature rise calculation. Eaton will provide heat dissipation data for the devices.FunctionsShort-time delayed trippingVoltage rating (UL)208/120 V, 60 HzConnectable conductor cross section (multi-wired) - max 16 mm²TypeCurrent test marks as perinscriptionMaximum operatingtemperature is 75 °C:Starting at 40 °C, the max.permissible continuouscurrent decreases by 2.5%for every 1 °CThe maximum operatingcurrent of back-up fuse mustnot exceed the residualcurrent circuit breaker'srated operational current10.2.2 Corrosion resistanceMeets the product standard's requirements.10.2.4 Resistance to ultra-violet (UV) radiationMeets the product standard's requirements.10.2.7 InscriptionsMeets the product standard's requirements.Eaton Corporation plc Eaton House30 Pembroke Road Dublin 4, Ireland © 2023 Eaton. All Rights Reserved. Eaton is a registered trademark.All other trademarks areproperty of their respectiveowners./socialmedia3 kA60 °C40 A gG/gL0.03 A 22 mA190 V440 VSurge current capacity Permitted storage and transport temperature - max Admissible back-up fuse overload - max Rated fault current - min Pick-up current Rated operational voltage (Ue) - max Rated insulation voltage (Ui)。
BA6246资料
Notes
No technical content pages of this document may be reproduced in any form or transmitted by any means without prior permission of ROHM CO.,LTD. The contents described herein are subject to change without notice. The specifications for the product described in this document are for reference only. Upon actual use, therefore, please request that specifications to be separately delivered. Application circuit diagrams and circuit constants contained herein are shown as examples of standard use and operation. Please pay careful attention to the peripheral conditions when designing circuits and deciding upon circuit constants in the set. Any data, including, but not limited to application circuit diagrams information, described herein are intended only as illustrations of such devices and not as the specifications for such devices. ROHM CO.,LTD. disclaims any warranty that any use of such devices shall be free from infringement of any third party's intellectual property rights or other proprietary rights, and further, assumes no liability of whatsoever nature in the event of any such infringement, or arising from or connected with or related to the use of such devices. Upon the sale of any such devices, other than for buyer's right to use such devices itself, resell or otherwise dispose of the same, no express or implied right or license to practice or commercially exploit any intellectual property rights or other proprietary rights owned or controlled by ROHM CO., LTD. is granted to any such buyer. Products listed in this document are no antiradiation design.
修防安全模块TSXPAY262数据表说明书
Product data sheetCharacteristicsTSXPAY262Preventa safety module - 24 V DC - standard format - < 5 WProduct availability : Non-Stock - Not normally stocked in distribution facilityPrice* : 847.55 USDDiscontinuedTSXPAY262 has not been replaced. Please contact your customer care center for more information.MainRange of productModicon Premium Automation platform Product or component typePreventa safety moduleComplementary[Us] rated supply voltage 24 V DC Supply voltage limits 19.2...30 V Activation threshold < 20 VShort-circuit protection 1 A gG external conforming to IEC 947-5-1 on power supply4 A gG external conforming to IEC 947-5-1 on safety relay outputs Isolation voltage 4000 V III 2Discrete input number1 double or single contact selection input conforming to IEC 1131 Type 11 feedback loop input conforming to IEC 1131 Type 11 reset PB input conforming to IEC 1131 Type 11 reset PB monitoring input conforming to IEC 1131 Type 112 emergency stop or limit switch discrete inputs conforming to IEC 1131 Type 1Discrete input logic Positive Inrush current<= 0.5 AIsolation between input and earth 500 Vrms 50/60 Hz for 60 s Power dissipation in W < 5 WSafety outputs 2 NO safety relay AGCDO gold plated volt free output System Voltage 17...127 V DC relay output 19...250 V AC relay output Rated power in VA120 VA 48 V AC-15 inductive 280 VA 110 V AC-15 inductive 550 VA 220 V AC-15 inductive 60 VA 24 V AC-15 inductive Rated power in W60 W 24 V DC-13 inductive 100 ms [Ithe] conventional enclosed thermal current<= 2.5 A Minimum output current >= 30 mA Response time on output< 12 msIsolation between output and earth 300 V conforming to DIN VDE 0110 part 21500 Vrms 50/60 Hz for 60 sSafety acquisitionMonitor external power supply of the modulei s c l a i m e r : T h i s d o c u m e n t a t i o n i s n o t i n t e n d e d a s a s u b s t i t u t e f o r a n d i s n o t t o b e u s e d f o r d e t e r m i n i n g s u i t a b i l i t y o r r e l i a b i l i t y o f t h e s e p r o d u c t s f o r s p e c i f i c u s e r a p p l i c a t i o n sRead enable inputsRead feedback loopRead the safety outputs controlRead status of the 24 inputsLocal signalling28 LEDs diagnostic of safety systemElectrical connection 1 connector removable screw terminal block 6 pins for connecting the safety output1 connector SUB-D 44 pins for connecting the safety system inputCable cross section0 in² (1.5 mm²) with cable end safety output circuit0...0 in² (0.2...2.5 mm²) without cable end safety output circuitCurrent consumption< 150 mA 5 V DC<= 200 mA 24 V DCModule format StandardProduct weight0.95 lb(US) (0.43 kg)EnvironmentAmbient air temperature for operation32...104 °F (0...40 °C) without fan32...140 °F (0...60 °C) with fan moduleAmbient air temperature for storage-13...158 °F (-25...70 °C)IP degree of protection IP20 conforming to IEC 60529Standards CSA C22.2 specific requirements (PLC)EN 954 machine safety parts of control systemsEN/IEC 60204-1 machine electrical equipmentEN/IEC 61131-2 specific requirements (PLC)EN/ISO 12100 machine electrical equipmentISO 13850 emergency stop equipmentUL 508 specific requirements (PLC)ISO 13849-1 category 4 machine safety parts of control systemsIEC 61508 SIL 3 machine safety parts of control systemsProduct certifications BGCSAULOrdering and shipping detailsCategory22558 - TSX PREMIUM, ATRIUM & PL7 PRODiscount Schedule PC22GTIN00785901621966Nbr. of units in pkg.1Package weight(Lbs) 2.21Returnability NCountry of origin FROffer SustainabilityRoHS (date code: YYWW)Compliant - since 0927 - Schneider Electric declaration of conformitySchneider Electric declaration of conformityREACh Reference not containing SVHC above the thresholdReference not containing SVHC above the thresholdProduct end of life instructions Need no specific recycling operationsCalifornia proposition 65WARNING: This product can expose you to chemicals including:- - - - - - - Substance 1Lead and lead compounds which is known to the State of California to cause cancer and birth defectsor other reproductive harm.- - - - - - - More information For more information go to Contractual warrantyWarranty period18 monthsDimensions DrawingsStandard and Extendable Racks for Modules Mounting Dimensions of Modules and Racks(1) With screw terminal block modules.(2) Maximum depth for all types of modules and their associated connectors.The Safety SystemConnection of Emergency Stop Buttons and Safety SwitchesDouble Contacts (recommended)Double contact wiring of inputs is suitable for applications requiring category 3 or 4 compliant levels of safety.Short circuits between channels are detected.ES PB or PS short circuits are detected and pinpointed.NOTE: If less than 12 double contacts are being used, the input terminals that are not in use must be bridged.Single ContactThis wiring is not suitable for applications requiring category 3 or 4 compliant levels of safety.Not all errors are detected, nor are ES PB or PS short circuits. Here, pressing this PB will not cause the safety circuits to open (loss of the safety function).NOTE: If less than 12 contacts are being used, the input terminals that are not in use must be bridged.Safety Output Wiring DiagramsFeedback Loop ConnectionThe category 4 immediate stop system design requires supply shut-off device redundancy and activation monitoring. Wiring of open contacts (K3, K4) or (K3, K4, K5, K6) allows every activation request to be checked.It is compulsory for the contacts of relays (K3, K4) or (K3, K4, K5, K6) to be mechanically linked.Category 3 wiring means:●no wiring of auxiliary contacts in the feedback loop (a strap links terminals Y1 and Y2/S33),●standard switches, with non-guided contacts, are sufficient.2-switch set-up (category 4):4-switch set-up (category 4):Connection of the Safety System Reactivation Function Wiring Diagram for Automatic ReactivationWiring Diagrams for Manual ReactivationWith Reactivation button monitoring (recommended):Without Reactivation button monitoring:Safety OutputsWiring Diagram13, 23:Independent supply inputs14, 24:Safety outputsNOTE:Wires cross-section:●with termination: 2 x 1 mm2/16 AWG or 1 x 1.5 mm2/14 AWG ●without termination: 1 x 2.5 mm2/12 AWG。
BLF647,112;中文规格书,Datasheet资料
28
120
>14.5
>55
−
28
120 (PEP) >14.5
>40
≤−26
32
150
typ. 12.5 typ. 60
−
32
150 (PEP) typ. 13
typ. 45
typ. −30
Ruggedness in class-AB operation
The BLF647 is capable of withstanding a load mismatch corresponding to VSWR = 10 : 1 through all phases under the following conditions: VDS = 28 V; f = 100 MHz at rated load power. The BLF647 is capable of withstanding abrupt source or load mismatch errors under the nominal power conditions.
UNIT K/W K/W
CHARACTERISTICS Tj = 25 °C per section unless otherwise specified.
SYMBOL
V(BR)DSS VGSth IDSS IDSX IGSS gfs RDSon Ciss
PARAMETER drain-source breakdown voltage gate-source threshold voltage drain-source leakage current drain cut-off current gate leakage current forward transconductance drain-source on-state resistance input capacitance
美国爱本电子（Eaton）产品说明书
Eaton PDG34FH400P2DJPower Defense Globally Rated, Frame 3, Four Pole, 400A-High, 25kA/480V, PXR25 LSI w/ Modbus RTU, CAM Link and Relays, Std Line Load Term (PDG3X4TA401H)Eaton Power Defense molded case circuit breakerPDG34FH400P2DJ 786679538265109.1 mm 257.1 mm 182.9 mm 7.68 kg Eaton Selling Policy 25-000, one (1) year from the date of installation of theProduct or eighteen (18) months from thedate of shipment of the Product,whichever occurs first.RoHS Compliant UL 489IEC 60947-2CCC MarkedCSAProduct NameCatalog Number UPCProduct Length/Depth Product Height Product Width Product Weight WarrantyCompliancesCertifications400A High Override Complete breaker 3Four-pole (100% N)PD3 GlobalClass APXR 25 LSIModbus RTU and CAM Link600 Vac600 V100% neutral protectionStandard Line and Load25 kAIC at 480 Vac35 kAIC @240V (UL) 10 kAIC Icu @250 Vdc Eaton Power Defense MCCB PDG34FH400P2DJ 3D drawingConsulting application guide - molded case circuit breakers Power Xpert Protection Manager x32Power Xpert Protection Manager x64StrandAble terminals product aidPower Defense technical selling bookletPower Defense molded case circuit breaker selection poster Power Defense brochureMolded case circuit breakers catalogAmperage RatingCircuit breaker frame type FrameNumber of poles Circuit breaker type ClassTrip Type CommunicationVoltage ratingVoltage rating - maxProtectionTerminalsInterrupt rating Interrupt rating range 3D CAD drawing package Application notesBrochuresCatalogsPower Xpert Release trip units for Power Defense molded case circuit breakersCertification reportsPDG3B 450A-600A CB reportPDG3 UL authorization 250-600a TMTUPDG3 CSA certification 100-400aPDG3 UL authorization 250-600a PXRPDG3 45-400A CB reportPDG3 CSA certification 250-600aPDG3 UL authorization 100-400aEU Declaration of Conformity - Power Defense molded case circuit breakersInstallation instructionsPower Defense Frame 3 interphase barrier - IL012229EN H03 Power Defense Frame 1-2-3-4 IP door barrier assembly instructions - IL012278ENPower Defense Frame 3 plug-in adapter installation instructions -IL012311ENPower Defense Frame 3 screw terminal_end cap kit, 400A, 4 pole – IL012263ENPower Defense Frame 3 finger protection assembly installation instructions - IL012279ENPower Defense Frame 3 multi-tap terminal kit Cat NumPDG3X3(2)(4)TA6006W Instructions - IL012248ENPower Defense Frame 3 Breaker Instructions (IL012107EN).pdf Power Defense Frame 2/3/4/5/6 voltage neutral sensor module wiring instructions – IL012316ENPower Defense Frame 3 terminal spreader assembly instructions -IL012301ENPower Defense Frame 3 reverse feed connector kit Cat NumPDG3X3(2)(4)TA630RF instructions - IL012253ENPower Defense Frame 3 box terminal installation instructions -IL012299ENPower Defense Frame 4 locking devices and handle block instructions - IL012151ENPower Defense Frame 3 terminal kit Cat Num PDG3X3(2)(4)TA400RF instructions - IL012251ENPower Defense Frame 3 interphase barriers 3-pole - IL012229EN H01 Power Defense Frame 4 reverse feed connector kit instructions for PDG4X3(2)(4)TA800RF instructions - IL012254ENPower Defense Frame 3 extendable shaft rotary handle mech -IL012112ENPower Defense Frame 3 adapter kit installation instructions LZM3 to PD3 - IL012227ENPower Defense Frame 3 multi wire connector kit -PDG3X3(2)(4)TA4006W and PDG3X3(2)(4)TA4003W instructions-IL012247EN H01Power Defense Frame 3 Aux, Alarm, ST and UVR Animated Instructions.rh Power Defense Frame 3 rear connection installation instructions -IL012300ENPower Defense Frame 3 Direct Rotary Handle Assy With Interlock Version Instructions (IL012139EN).pdfPower Defense Frame 4 shunt trip UVR instructions - IL012129EN Power Defense Frame 3 reverse feed connector kit Cat NumPDG3X3(2)(4)TA400HRF instructions - IL012252ENPower Defense Frame 3 screw terminal end cap kit 600A, 4 pole -IL012265ENPower Defense Frame 3 terminal cover assembly instructions -IL012281ENPower Defense Frame 3 handle mech direct rotary handle instructions - IL012111ENPower Defense Frame 3 locking devices and handle block instructions - IL012150ENPower Defense Frame 3 shunt trip UVR instructions - IL012140EN Power Defense Frame 3 trip unit replacement instructions - IL012157EN Power Defense Frame 3 multi-tap terminal kit Cat NumPDG3X3(2)(4)TA6006WSW instructions - IL012250ENInstallation videosPower Defense Frame 3 trip unit replacement animated instructions.rh Power Defense Frame 3 Shunt Trip_UVR Animated Instructions.pdf.rh Power Defense Frame 3 Locking Devices and Handle Block Animated Instructions.pdf.rhPower Defense Frame 3 Handle Mech Direct Rotary Handle Animated Instructions.rhMultimediaPower Defense Frame 3 Aux, Alarm, Shunt Trip, and UVR How-To Video Power Defense Frame 3 Trip Unit Installation How-To VideoPower Defense Frame 3 Direct Rotary Handle Mechanism Installation How-To VideoPower Defense molded case circuit breakersPower Defense Frame 2 Variable Depth Rotary Handle Mechanism Installation How-To VideoPower Defense Frame 5 Trip Unit How-To VideoPower Defense Frame 6 Trip Unit How-To VideoEaton Corporation plc Eaton House30 Pembroke Road Dublin 4, Ireland © 2023 Eaton. All Rights Reserved. Eaton is a registered trademark.All other trademarks areproperty of their respectiveowners./socialmediaPower Defense Frame 3 Variable Depth Rotary Handle Mechanism Installation How-To Video Power Defense BreakersEaton Power Defense for superior arc flash safety Eaton Specification Sheet - PDG34FH400P2DJ Power Defense time current curve Frame 3 - PD3Intelligent circuit protection yields space savings Making a better machineMolded case and low-voltage power circuit breaker healthImplementation of arc flash mitigating solutions at industrial manufacturing facilitiesIntelligent power starts with accurate, actionable data Single and double break MCCB performance revisited Molded case and low-voltage breaker health Safer by design: arc energy reduction techniquesSpecifications and datasheetsTime/current curvesWhite papers。
Agilent E1474A 75
Data SheetPDFINFO H 9666-01Six 1x4, 75 ΩRF MultiplexerAgilent E1474A•1-Slot, C-size, register based •Six 1x4 multiplexers•Switch signals up to 1.3 GHz•SMB male connectors for high performance •Controls the E1475A/E1473A RF expanders •Tree switching for high isolation, low VSWRAgilent E1474ADescriptionThe Agilent E1474A 75 ΩRF Multiplexer is a C-size, 1-slot,register-based VXI module.It is the ideal choice for video and telecommunications applications. The E1474A is functionally identical to the E1472A except for output impedance.The RF multiplexer can be used as six multiplexers or combined with others to form a larger tree-switchedmultiplexer or a limited stubless matrix. You can easily and inexpensively expand the E1474A via the E1475A 75ΩRF multiplexer expander or via the E1473A 50ΩRF multiplexer expander.The E1474A can easily be programmed with SCPI commands to scan multiple channels, where each channel is switched to its common, one at a time. This module is arranged as six independent banks of channels (Bank 0 through Bank 5),each acting as a 1x4 one-wire multiplexer. Only one channel in each bank can be connected to its common at any time.The multiplexer relays are arranged in a tree-switchedconfiguration, providing high isolation and low VSWR. Each channel consists of a non-latching armature relay.Refer to the Agilent Technologies Website for instrumentdriver availability and downloading instructions, as well as for recent product updates, if applicable.Agilent TechnologiesCables and ConnectorsVarious 75 Ωcables are available from Agilent for connecting to the SNB connectors on the front panel of the multiplexer. Adapters and other connectors are also available. Connectors are also available from Johnson Components:U.S.A. Tel.:1-800-247-8256Outside U.S.A. Tel.:(507) 835-6222Fax.:(507) 835-8356Product SpecificationsInputMaximum voltage (centeror shield-to-center, shieldor chassis):42 VMaximum current (per channel or common):DC: 1 AAC rms: 1 AMaximum power (per channel or common):DC:24 WAC:24 VADCMaximum thermal offset: 6 µVClosed channel resistance(typical):<1 ΩinitialInsulation resistance(between any twoterminals):>10E8 Ω≤40 °C, ≤65% RH ACNote: For AC performance, ZL=ZS=ZO, ≤40 °C, RH ≤95% for C-size, RH ≤65% for B-sizeCharacteristic impedance(Zo):75 ΩInsertion loss:<10 MHz:<0.3 dB<100 MHz:<0.4 dB<500 MHz:<0.8 dB<1.3 GHz:<1.0 dB<3 GHz (typ):n/aCrosstalk (channel-to-channel):<10 MHz:<–85 dB<100 MHz:<–75 dBCrosstalk (channel-to-channel, one channel closed orchannel-to-common) (terminated):<200 MHz:n/a<500 MHz:<–60 dB<1.3 GHz:<–42 dB<3 GHz (typ):n/aVSWR:<10 MHz:<1.05<100 MHz:<1.15<200 MHz:n/a<500 MHz:<1.35<1.3 GHz:<1.5<3 GHz:n/aRisetime:<300 psSignal delay:<3 nsCapacitance:Center-shield:n/aChassis-shield:n/aGeneral CharacteristicsRelays:Non-latching armaturePower up/down state:All openMinimum relay life:No load:5x10E6 operationsRated load:10E5 operationsGeneral SpecificationsVXI CharacteristicsVXI device type:Register based, A16, slave onlySize:CSlots:1Connectors:P1/2Shared memory:NoneVXI busses:NoneC-size compatibility:n/aConfigurationEach channel consists of a non-latching armature relay. Atpower-on or reset, channels 00, 10, ... 50 are connected toCOM 00, 10, ... 50, respectively, and all other channels areopen (unterminated).The RF multiplexer can be used as six multiplexers orcombined with others to form a larger tree-switchedmultiplexer or a limited stubless matrix as shown in theaccompanying diagram.To expand the E1474A refer to the E1475A 75ΩRFmultiplexer expander or the E1473A 50ΩRF multiplexerexpander. The E1474A can control other external relaysrequiring 5V, 12V, or 24V drive.PDFINFO H9666-02 2PDFINFO H9666-033Instrument DriversSee the Agilent Technologies Website (/find/ inst_drivers) for driver availability and downloading.Command modulefirmware:DownloadableCommand modulefirmware rev: A.02I-SCPI Win 3.1:YesI-SCPI Series 700:YesC-SCPI LynxOS:YesC-SCPI Series 700:YesPanel Drivers:YesVXI plug&play WinFramework:YesVXI plug&play Win95/NTFramework:YesVXI plug&play HP-UXFramework:NoModule CurrentI PM I DM+5 V:0.10.1+12 V:0.360.01–12 V:00+24 V:00–24 V:00–5.2 V00–2 V:00Cooling/SlotWatts/slot: 6.00∆P mm H2O:0.10Air Flow liter/s:0.50Ordering InformationDescription Product No. Six 1x4 75 ΩRF Multiplexer E1474A Service Manual E1474A 0B3Agilent E1474A front panel detail5Component Lvl Info Pkt E1472-90033PDFINFO H 9666-04Related Literature2000 Test System and VXI Catalog CD-ROM,Agilent Pub. No. 5980-0308E (detailed specifications for VXI products)2000 Test System and VXI Catalog,Agilent Pub. No. 5980-0307E (overview of VXI products )1998 Test System and VXI Products Data Book,Agilent Pub. No. 5966-2812EAgilent Technologies’ test and measurement service/support commitmentAgilent strives to maximize the value our test and measurement products give you, while minimizing your risk and service/support problems. We work to ensure that each product is realistically described in the literature, meets its stated performance and functionality, has a clearly stated global warranty, and is supported at least five years beyond its production life. Our extensive self-help tools include many online resources ().Experienced Agilent test engineers throughout the world offer practicalrecommendations for product evaluation and selection. After you purchase an Agilent product, they can provide no-charge assistance with operation verification and basic measurement setups for advertised capabilities. Toenhance the features, performance, and flexibility of your test and measurement products—and to help you solve application challenges—Agilent offers free or extra-cost product options and upgrades, and sell expert engineering,calibration, and other consulting services.OnlineInternet access for Agilent product information, services and support /find/tmdir VXI product information /find/vxi Defense Electronics Applications /find/defense_ATE Agilent Technologies VXI Channel Partners /find/vxichanpartAgilent Technologies’ HP VEE Application Website /find/veeAgilent Technologies Data Acquisition and Control Website /find/data_acqAgilent Technologies Instrument Driver Downloads /find/inst_driversAgilent Technologies Electronics Manufacturing Test Solutions /go/manufacturingor check your local phone book for the Agilent office near you.Get assistance with all your test and measurement needs at/find/assistPhone or FaxUnited States:(tel)180****4444Canada:(tel)187****4414(fax) (905) 282 6495China:(tel) 800 810 0189(fax) 800 820 2816Europe:(tel) (31 20) 547 2323(fax) (31 20) 547 2390Japan:(tel) (81) 426 56 7832(fax) (81) 426 56 7840Korea:(tel) (82 2) 2004 5004 (fax) (82 2) 2004 5115Latin America:(tel) (305) 269 7500(fax) (305) 269 7599Taiwan:(tel) 0800 047 866 (fax) 0800 286 331Other Asia Pacific Countries:(tel) (65) 6375 8100(fax) (65) 6836 0252(e-mail)*******************Data Subject to Change©Agilent Technologies, Inc. 2000Printed in the U.S.A. May 1, 20045965-9666EAgilent Technologies。
流线图lr79326安装手册说明书
Series P/N Description Data Sheet Quick Start Manual 300500 300500 DataKeep™ Explosion Proof Level Indicator Data Sheet AG12 AG12-1610, AG12-1614, AG12-1620, AG12-1624, AG12-3610, AG12-3614, AG12-3620, AG12-3624 Thermo-Flo™ with Compact Flow Controller Data Sheet Manual AG14 AG14-1610, AG14-1614, AG14-1620, AG14-1624, AG14-3610, AG14-3614, AG14-3620, AG14-3624 Thermo-Flo™ with Compact Flow Controller Data Sheet Manual AG17 AG17-1630, AG17-1634, AG17-3630, AG17-3634 Thermo-Flo™ with Compact Junction Box Data Sheet Manual AG18 AG18-1630, AG18-1634, AG18-3630, AG18-3634 Thermo-Flo™ with Compact Junction Box Data Sheet Manual AT12 AT12-1610, AT12-1614, AT12-1620, AT12-1624, AT12-3610, AT12-3614, AT12-3620, AT12-3624 Thermo-Flo™ with Compact Flow Controller Data Sh
Omega 数据记录仪产品说明书
To Order, Call
or Shop Online at SM
1
OM-CP-IFC200, Windows® software displays data in graphical or tabular format.
Real Time Recording: The device may be used with PC to monitor and record data in real-time
Memory: 1,000,000 readings; software configurable memory wrap; 330,000 readings in multiple start/stop
Wrap Around: Yes
Start Modes: • Immediate start • Delay start up to 24 months • Multiple pushbutton start/stop
Specifications
DATA LOGGER
Measurement Range:
Dry: 266 mV typical 100% Saturated: 833 mV typical
Resolution: 50 µV
Accuracy: ±0.1 mV
Specified Accuracy: Nominal range @ 25ºC
LED Functionality: Green LED Blinks: 10 second
rate to indicate logging, 15 second rate to indicate delay start mode
Red LED Blinks: 10 second rate to indicate low battery and/or full memory, 1 second rate to indicate an alarm condition
3476型号的商品说明书
Dimensiones en mm Respaldo:Alt:620Asiento:Alt:Ancho:Prof:Total:H:1190A.(s.b.):460A a.b.:720L:680Embalaje Peso:Volumen kgm³0,219,5420-550445460Acabado de serie UtilidadRespaldo Respaldo de malla, negro con apoyo lumbarregulable.El respaldo de malla evita la transpiración de la espalda y adapta el punto de apoyo a cada persona.Tapizado de confort Asiento acolchado con concavidad y grosor de50 g/dm³.Mayor comodidad durante más tiempo, ya que el alto grosor del acolchado impide su deterioro. Además, evita que se ensanchen las venas y fomenta la circulación.Columna de la silla Muelle neumático con casquillo de acero.Regulación de la altura del asiento para adaptarla a lasmás diversas estaturas.Mecanismo con regulación del peso Mecanismo sincronizado. El asiento y elrespaldo se mueven de forma sincronizada,cuando la silla está abierta sigue losmovimientos del cuerpo. El movimiento sepuede bloquear en 3 posiciones. Lacontrapresión del mecanismo se puede ajustarsin escalonamiento mediante una rueda espalda está apoyada constantemente, lo cual permite relajar la zona del vientre. Esto evita tensiones y fomenta una postura erguida, así como una distribución homogénea de la presión entre las vértebras. El movimiento sincronizado del asiento permite alcanzar un ángulo de apertura todavía mayor, lo cual tiene la ventaja de fomentar aún más la circulación. Mediante la presión, que se puede definir individualmente, se puede ajustar la silla al peso del cuerpo y así trabajar hasta 8 horas sin fatiga.Base Plástico, Ø 640 mm, negro. (Véanse también lasopciones)Gran estabilidad.Ruedas Ruedas dobles, duras.Para suelos blandos.Material del asiento Tec: Tapizado resistente de 100 % poliéster.30 000 ciclos de abrasión, 230 g/lfm. Lucia:tapizado resistente de 100 % poliéster, 100 000ciclos de abrasión y 400 g/lfmApoyo para la pelvis Ayuda a que la pelvis se mantenga en la posicióndeseada incluso durante largos periodos. De esta formase descarga tanto la musculatura como la columnavertebral.Ajuste de la profundidad del asiento Mediante asiento deslizante, 50 s personas de mayor estatura tendrán una mayorsuperficie de apoyo para los muslos.Ajuste de la inclinación del asiento El ajuste de la inclinación del asiento permite inclinarhasta 4 grados toda la superficie de asiento. Fomenta elasiento activo, de forma que la pelvis está más recta y lacolumna vertebral mantiene mejor su forma en Soriginal.Garantía 3 años de garantía de sustitución.Younico Véase continuación en la Hoja 2Dimensiones en mm Respaldo:Alt:620Asiento:Alt:Ancho:Prof:Total:H:1190A.(s.b.):460A a.b.:720L:680Embalaje Peso:Volumen kgm³0,219,5420-550445460Opciones UtilidadRuedas Ruedas dobles, blandas.Para suelos duros/universales. Base Aluminio pulido o plateado brillante Gran estabilidad, durabilidad.Reposabrazos Elección entre reposabrazos fijo en aro oreposabrazos 3D en T.Mediante los reposabrazos se descarga la musculatura del cuello y de la nuca.Younico。
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正基科技股份有限公司SPECIFICATION SPEC. NO.：REV： 1.2 DATE：01. 09.2013PRODUCT NAME：AP6476AMPAKAP6476WiFi +BT4.0+FM RX +GPS SIP Module Spec SheetRevision HistoryDate Revision Content Revised By Version 2012/09/18 - Preliminary Andy 1.02012/10/22 - Pin description updated Andy 1.12013/01/09 - GPS specification updated Andy 1.2 AMPAK Technology Inc. Proprietary & Confidential Information 1ContentsContents (2)1.Introduction (3)2.Features (4)3.Deliverables (5)3.1 Deliverables (5)3.2 Regulatory certifications (5)4.General Specification (6)4.1 General Specification (6)4.2 Voltages (6)4.2.1 Absolute Maximum Ratings (6)4.2.2 Recommended Operating Rating (6)5.WiFi RF Specification (7)5.1 2.4GHz RF Specification (7)6.Bluetooth Specification (9)6.1 Bluetooth Specification (9)7.FM Specification (10)7.1 FM Specification (TBD) (10)8.GPS Specification (11)8.1 GPS Specification (11)9.Pin Assignments (12)9.1 Pin Outline (12)9.2 Pin Definition (12)10.Dimensions (14)10.1 Physical Dimensions (14)10.2 Layout Recommendation (15)11.External clock reference (16)11.1 SDIO Pin Description (16)12.Host Interface Timing Diagram (17)12.1 Power-up Sequence Timing Diagram (17)12.2 SDIO Default Mode Timing Diagram (19)12.3 SDIO High Speed Mode Timing Diagram (20)13.Recommended Reflow Profile (21)14. Package Information (22)14.1Label (22)14.2 Dimension (23)14.3 MSL Level / Storage Condition (25)1. IntroductionAMPAK Technology would like to announce a low-cost and low-power consumption module which has all of the WiFi,Bluetooth, FM receiver and GPS functionalities. The highly integrated tiny module makes the possibilities of web browsing, VoIP, Bluetooth headsets, FM radio functional applications and portable navigation applications. With seamless roaming capabilities and advanced security, also could interact with different vendors’ 802.11b/g/n Access Points in the wireless LAN.The module complies with IEEE 802.11 b/g/n standard and it could achieve up to a speed of 72.2Mbps with single stream in 802.11n draft, 54Mbps as specified in 802.11g, or 11Mbps for 802.11b to connect to the wireless LAN. The integrated module provides SDIO interface for WiFi, UART / PCM / Audio interface for Bluetooth, FM and GPS.The module introduces dual-constellation support for both GPS and GLONASS with the same receiver chain. The GPS core host-based in the module splits processing functions between the GPS device and the CPU on the host system.This compact module is a total solution for a combination of WiFi + BT + FM + GPS technologies. The module is specifically developed for Tablet, Smart phones and Portable devices.2. Features802.11b/g/n single-band radioBluetooth V4.0 with integrated Class 1.5 PA and Low Energy (BLE) support Concurrent Bluetooth, FM (RX) RDS/RBDS, and WLAN operationSimultaneous BT/WLAN receive with single antenna WLAN host interface options: - SDIO v2.0x — up to 50 MHz clock rateBT host digital interface:- UART (up to 4 Mbps)GPS able to track up to 16 satellites.FM multiple audio routing options: PCM, eSCO, A2DP IEEE Co-existence technologies are integrated die solutionSECI — serial enhanced coexistence support, ability to coordinate BT SCOtransmissions around WLAN receivesA simplified block diagram of the module is depicted in the figure below.3. Deliverables3.1 DeliverablesThe following products and software will be part of the product.Module with packagingEvaluation KitsSoftware utility for integration, performance test.Product Datasheet.Agency certified pre-tested report with the adapter board.3.2 Regulatory certificationsThe product delivery is a pre-tested module, without the module level certification. For module approval, the platform’s antennas are required for the certification.4. General Specification4.1 General Specification4.2 Voltages4.2.1 Absolute Maximum RatingsSymbol DescriptionMin. Max. Unit VBAT Input supply Voltage-0.5 6 V WL_VIO Voltage source for WiFi SDIO I/O Voltage -0.5 3.6 V BT_VIO Voltage source for WiFi & Bluetooth GPIO/UART I/O Voltage-0.52.0V4.2.2 Recommended Operating RatingThe module requires two power supplies: VBAT and VDDIO(WL_VIO; BT_VIO).Min. Typ. Max. Unit Operating Temperature-30 25 85 deg.C VBAT 3.0 3.6 4.8 V WL_VIO 1.7 3.3 3.6 V BT_VIO1.71.81.92VModel Name AP6476Product Description Support WiFi/Bluetooth/FM/GPS functionalities Dimension L x W x H: 12.0 x 12.0 x 1.5 (typical) mm WiFi Interface SDIO V2.0BT/FM/GPS Interface UART/ Audio/ PCMOperating temperature -30°C to 85°C Storage temperature -40°C to 85°CHumidity Operating Humidity 10% to 95% Non-Condensing Storage Humidity 5% to 95% Non-Condensing5. WiFi RF Specification5.1 2.4GHz RF SpecificationConditions : VBAT=3.6V ; WL_ VIO=3.3V; BT_VIO=1.8V ; Temp:25°C Feature DescriptionWLAN Standard IEEE 802.11b/g/n, WiFi compliant Frequency Range 2.400 GHz ~ 2.497 GHz (2.4 GHz ISM Band) Number of Channels 2.4GHz：Ch1 ~ Ch14Modulation 802.11b : DQPSK, DBPSK, CCK802.11 g/n : OFDM /64-QAM,16-QAM, QPSK, BPSKOutput Power 802.11b /11Mbps : 16 dBm ± 1.5 dB @ EVM ≤ -9dB 802.11g /54Mbps : 15 dBm ± 1.5 dB @ EVM ≤ -25dB 802.11n /65Mbps : 14 dBm ± 1.5 dB @ EVM ≤ -28dBReceive Sensitivity (11n,20MHz)@10% PER - MCS=0 PER @ -85 dBm, typical - MCS=1 PER @ -84 dBm, typical - MCS=2 PER @ -82 dBm, typical - MCS=3 PER @ -80 dBm, typical - MCS=4 PER @ -77 dBm, typical - MCS=5 PER @ -73 dBm, typical - MCS=6 PER @ -71 dBm, typical - MCS=7 PER @ -69 dBm, typicalReceive Sensitivity (11g) @10% PER - 6Mbps PER @ -86 dBm, typical - 9Mbps PER @ -85 dBm, typical - 12Mbps PER @ -85 dBm, typical - 18Mbps PER @ -83 dBm, typical - 24Mbps PER @ -81 dBm, typical - 36Mbps PER @ -78 dBm, typical - 48Mbps PER @ -73 dBm, typical - 54Mbps PER @ -72 dBm, typicalReceive Sensitivity (11b) @8% PER - 1Mbps PER @ -90 dBm, typical - 2Mbps PER @ -89 dBm, typical - 5.5Mbps PER @ -88 dBm, typical - 11Mbps PER @ -85 dBm, typicalData Rate 802.11b : 1, 2, 5.5, 11Mbps802.11g : 6, 9, 12, 18, 24, 36, 48, 54MbpsData Rate(20MHz ,Long GI,800ns)802.11n: 6.5, 13, 19.5, 26, 39, 52, 58.5, 65MbpsData Rate(20MHz ,short GI,400ns)802.11n : 7.2, 14.4, 21.7, 28.9, 43.3, 57.8, 65,72.2MbpsMaximum Input Level 802.11b : -10 dBm 802.11g/n : -20 dBmAntenna Reference Small antennas with 0~2 dBi peak gain6. Bluetooth Specification6.1 Bluetooth SpecificationConditions : VBAT=3.6V ; WL_ VIO=3.3V; BT_VIO=1.8V ; Temp:25°CFeature DescriptionGeneral SpecificationBluetooth Standard Bluetooth V4.0 of 1, 2 and 3 Mbps.Host Interface UARTAntenna Reference Small antennas with 0~2 dBi peak gain Frequency Band 2.400 GHz ~ 2483.5 GHzNumber of Channels 79 channelsModulation FHSS, GFSK, DPSK, DQPSKRF SpecificationMin. Typical. Max. Output Power (Class 1.5) 10Output Power (Class 2) 2Sensitivity @ BER=0.1%for GFSK (1Mbps)-86Sensitivity @ BER=0.01%for π/4-DQPSK (2Mbps)-86Sensitivity @ BER=0.01%for 8DPSK (3Mbps)-80Maximum Input Level GFSK (1Mbps):-20dBmπ/4-DQPSK (2Mbps) :-20dBm 8DPSK (3Mbps) :-20dBm7. FM Specification7.1 FM Specification (TBD)Conditions : VBAT=3.6V ; WL_VIO=3.3V; BT_VIO=1.8V ; Temp:25°CFeature DescriptionGeneral SpecificationFrequency Band 76MHz-108MHzHost Interface HCI UART, I2S/PCMChannel step 50 KHzAnalog Audio output load R L>30KΩ, C L>20pFCharacteristics Condition MIN TYP MAX UNITTransmitter(FM Tx load = 120nH, Q>30) Output Power Level dBuVAudio harmonic distortion(fmod=1KHz, △f=75KHz,Pilot △f=6.75KHz)%Audio SNR(△f=22.5KHz, I2Saudio in SNR≧57dB )MONOdBStereoReceiver(FM Tx Antenna = 120nH, Q>30) RDS Sensitivity dBmAudio harmonicdistortion(Vin=1mV, △f=75KHz)fmod=1KHz%fmod=3KHzMaximum SNR(fmod=1KHz,△f=22.5KHz,BW=300Hz to 15KHz)MONOdBStereoRF input power level dBuV8. GPS Specification8.1 GPS SpecificationConditions : VBAT=3.6V ; BT_VIO=1.8V ; Temp:25°CFeature DescriptionGeneral SpecificationFrequency Band 1575.42 MHzHost Interface HCI UARTNumber of Channels 20 ChannelsAntenna Gain 1.5~5 dBiSensitivity Cold Start -140dBm, Hot Start -150dBm,Tracking -155dBm Characteristics Condition Min TYP MAX UNIT C/N w/o LNA @ -130 dBm35Autonomous Cold Start Average TTFF@ -130 dBm 50 s Autonomous Warm Start Average TTFF@ -130 dBm 45 s Autonomous Hot Start Average TTFF @ -130 dBm 3 s9. Pin Assignments9.1 Pin Outline< TOP VIEW >9.2 Pin DefinitionNO Name Type Description1 GND －Ground connections2 WL_BT_ANT I/O RF I/O port3 GND －Ground connections4 FM_RX I FM radio RF input antenna port5 NC －Floating (Don’t connected to ground)6 BT_WAKE I HOST wake-up Bluetooth device7 BT_HOST_WAKE O Bluetooth device to wake-up HOST8 BT_VIO P BT I/O Voltage support 1.8V only9 VBAT P Main power voltage source input10 NC －Floating (Don’t connected to ground)11 NC －Floating (Don’t connected to ground)12 WL_REG_ON I Internal regulators power enable/disable13 WL_HOST_WAKE O WLAN to wake-up HOST14 SDIO_DATA_2 I/O SDIO data line 215 SDIO_DATA_3 I/O SDIO data line 316 SDIO_DATA_CMD I/O SDIO command line17 SDIO_DATA_CLK I/O SDIO CLK line18 SDIO_DATA_0 I/O SDIO data line 019 SDIO_DATA_1 I/O SDIO data line 120 GND －Ground connections21 VIN_LDO_OUT P Internal Buck voltage generation pin22 WL_VIO P SDIO I/O Voltage support 1.8V or 3.3V23 VIN_LDO P Internal Buck voltage generation pin24 LPO I External Low Power Clock input (32.768KHz)25 PCM_OUT I/O PCM Data output26 PCM_CLK I/O PCM Clock27 PCM_IN I/O PCM data input28 PCM_SYNC I/O PCM sync signal29 WL_VDD_TCXO P 1.8V supply for the TCXO driver30 TCXO_IN I 26MHz TCXO 1.8V level input31 GND －Ground connections32 GPS_RF I GPS RF input antenna port33 GND －Ground connections34 BT_RST_N I Low asserting reset for Bluetooth core35 NC －Floating (Don’t connected to ground)36 GND －Ground connections37 NC －Floating (Don’t connected to ground)38 NC －Floating (Don’t connected to ground)39 NC －Floating (Don’t connected to ground)40 NC －Floating (Don’t connected to ground)41 UART_RTS_N O Bluetooth/FM/GPS UART interface42 UART_TXD O Bluetooth/FM/GPS UART interface43 UART_RXD I Bluetooth/FM/GPS UART interface44 UART_CTS_N I Bluetooth/FM/GPS UART interface45 TP1 O FM Analog AUDIO left output46 TP2 O FM Analog AUDIO right output47 TP3 (NC) －Floating (Don’t connected to ground)10. Dimensions10.1 Physical Dimensions(Unit: mm)< TOP VIEW > < Side View >< TOP VIEW >10.2 Layout Recommendation(Unit: mm)< TOP VIEW >11. External clock referenceExternal LPO signal characteristicsParameter Specification Units Nominal input frequency 32.768 kHz Frequency accuracy 30±ppm Duty cycle 30 - 70 % Input signal amplitude 400 to 1800mV, p-p Signal type Square-wave -Input impedance >100k<5ΩpFClock jitter (integrated over 300Hz – 15KHz) <1 Hz Output high voltage 0.7Vio - Vio VExternal TCXO signal characteristicsParameter Specification Units Nominal input frequency 26 MHz Signal type Sine-wave -Input Voltage Swing 400-1900 mVp-p Input Voltage 0-1800 mV Input capacitance 6(max) pF Input Low 0-0.1VDD V Input High 0.9VDD-VDD VDuty cycle 40 - 60 % Frequency Tolerance(initial accuracy) 2±ppm Frequency Stability 5.0±ppm Aging 1±Ppm/year Phase Noise(26Mhz@1KHz carrier offset) -130(max) dBc/Hz11.1 SDIO Pin DescriptionThe module supports SDIO version 2.0 for 4-bit modes It has the ability to stop the SDIO clock and map the interrupt signal into a GPIO pin. This ‘out-of-band’ interrupt signal notifies the host when the WLAN device wants to turn on the SDIO interface. The ability to force the control of the gated clocks from within the WLAN chip is also provided.Function 0 Standard SDIO function (Max BlockSize / ByteCount = 32B)Function 1 Backplane Function to access the internal System On Chip (SOC)address space (Max BlockSize / ByteCount = 64B)Function 2 WLAN Function for efficient WLAN packet transfer through DMA (MaxBlockSize/ByteCount=512B)SDIO Pin DescriptionSDIO 4-Bit ModeDATA0 Data Line 0DATA1 Data Line 1 or InterruptDATA2 Data Line 2 or Read WaitDATA3 Data Line 3CLK ClockCMD Command Line12. Host Interface Timing Diagram12.1 Power-up Sequence Timing DiagramThe module has two signals that allow the host to control power consumption by enabling or disabling the Bluetooth/FM/GPS, WLAN and internal regulator blocks. These signals are described below.Additionally, diagrams are provided to indicate proper sequencing of the signals for carious operating states. The timing value indicated are minimum required values: longer delays are also acceptable.Note that the WL_REG_ON and BT_RST_ON are in the module. The diagrams show both signals going high at the same time (as would be the case if both REG signals were controlled by a single host GPIO). If two independent host GPIOs are used (on for WL_REG_ON and one for BT_REG_ON), then only one of the two signals needs to be high to enable the internal regulators.※ WL_REG_ON: Used by the PMU to power up the WLAN section. It is input to control the internal WLAN regulators. When this pin is high, the regulators are enabled and the WLAN section is out of reset. When this pin is low the WLAN section is in reset.※ BT_RST_ON: Used by the PMU to power up the internal Bluetooth/FM/GPS regulators. If the BT_RST_ON pins are low, the regulators are disabled.WLAN=ON, Bluetooth/FM/GPS =ONWLAN=OFF, Bluetooth/FM/GPS =OFFWLAN=ON, Bluetooth/FM/GPS=OFFWLAN=OFF, Bluetooth/FM/GPS=ON 12.2 SDIO Default Mode Timing Diagram12.3 SDIO High Speed Mode Timing Diagram13. Recommended Reflow ProfileReferred to IPC/JEDEC standard.Peak Temperature : <250°CNumber of Times : ≤2 times2.5℃/sec2.5°C/sec 40~70 sec250℃14. Package Information 14.1LabelLabel A Anti-static and humidity noticeLabel B MSL caution / Storage ConditionLabel C Inner box label .Label D Carton box label .14.2 DimensionC14.3 MSL Level / Storage Condition※NOTE : Accumulated baking time should not exceed 96hrs。