SN54ABT2245中文资料
ABT245B中文资料
PACKAGING INFORMATIONOrderableDevice Status (1)Package Type Package Drawing Pins Package Qty Eco Plan (2)Lead/Ball FinishMSL Peak Temp (3)5962-9214802Q2A ACTIVE LCCC FK 201TBD POST-PLATE N /A for Pkg Type 5962-9214802QRA ACTIVE CDIP J 201TBD A42SNPB N /A for Pkg Type 5962-9214802QSA ACTIVE CFP W 201TBD A42N /A for Pkg Type SN74ABT245BDBLE OBSOLETE SSOP DB 20TBDCall TI Call TISN74ABT245BDBR ACTIVE SSOP DB 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74ABT245BDBRG4ACTIVE SSOP DB 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74ABT245BDGVR ACTIVE TVSOP DGV 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74ABT245BDGVRE4ACTIVE TVSOP DGV 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74ABT245BDW ACTIVE SOIC DW 2025Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74ABT245BDWG4ACTIVE SOIC DW 2025Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74ABT245BDWR ACTIVE SOIC DW 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74ABT245BDWRG4ACTIVE SOIC DW 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74ABT245BGQNRACTIVEBGA MI CROSTA R JUNI OR GQN201000TBDSNPBLevel-1-240C-UNLIMSN74ABT245BN ACTIVE PDIP N 2020Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type SN74ABT245BNE4ACTIVE PDIP N 2020Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type SN74ABT245BNSR ACTIVE SO NS 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74ABT245BNSRE4ACTIVE SO NS 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74ABT245BPW ACTIVE TSSOP PW 2070Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74ABT245BPWE4ACTIVE TSSOP PW 2070Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74ABT245BPWLE OBSOLETE TSSOP PW 20TBDCall TI Call TISN74ABT245BPWR ACTIVE TSSOP PW 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74ABT245BPWRE4ACTIVE TSSOP PW 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74ABT245BRGYR ACTIVE QFN RGY 201000Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR SN74ABT245BRGYRG4ACTIVE QFN RGY 201000Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR SN74ABT245BZQNRACTIVEBGA MI CROSTA R JUNI ORZQN201000Green (RoHS &no Sb/Br)SNAGCULevel-1-260C-UNLIM6-Dec-2006Orderable Device Status (1)Package Type Package Drawing Pins Package Qty Eco Plan (2)Lead/Ball FinishMSL Peak Temp (3)SNJ54ABT245AFK ACTIVE LCCC FK 201TBD POST-PLATE N /A for Pkg Type SNJ54ABT245AJ ACTIVE CDIP J 201TBD A42SNPB N /A for Pkg Type SNJ54ABT245AWACTIVECFPW201TBDA42N /A for Pkg Type(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan -The planned eco-friendly classification:Pb-Free (RoHS),Pb-Free (RoHS Exempt),or Green (RoHS &no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1)lead-based flip-chip solder bumps used between the die and package,or 2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free (RoHS compatible)as defined above.Green (RoHS &no Sb/Br):TI defines "Green"to mean Pb-Free (RoHS compatible),and free of Bromine (Br)and Antimony (Sb)based flame retardants (Br or Sb do not exceed 0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrateinformation from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.6-Dec-2006IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and todiscontinue any product or service without notice. Customers should obtain the latest relevant informationbefore placing orders and should verify that such information is current and complete. All products are soldsubject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. Testing and other quality control techniques are used to the extentTI deems necessary to support this warranty. Except where mandated by government requirements, testingof all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsiblefor their products and applications using TI components. To minimize the risks associated with customerproducts and applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patentright, copyright, mask work right, or other TI intellectual property right relating to any combination, machine,or process in which TI products or services are used. Information published by TI regarding third-partyproducts or services does not constitute a license from TI to use such products or services or a warranty orendorsement thereof. Use of such information may require a license from a third party under the patents orother intellectual property of the third party, or a license from TI under the patents or other intellectualproperty of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is withoutalteration and is accompanied by all associated warranties, conditions, limitations, and notices.Reproduction of this information with alteration is an unfair and deceptive business practice. TI is notresponsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI forthat product or service voids all express and any implied warranties for the associated TI product or serviceand is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.Following are URLs where you can obtain information on other Texas Instruments products and applicationsolutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotive/broadbandBroadbandDSP DigitalControl /digitalcontrol Interface Military /military Logic Power Mgmt Optical Networking /opticalnetworkSecurity /security Microcontrollers Low Power Wireless /lpw Telephony /telephonyVideo & Imaging /video/wirelessWirelessMailing Address: Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright © 2007, Texas Instruments Incorporated。
SN54ABTH245中文资料
元器件交易网IMPORTANT NOTICETexas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinueany product or service without notice, and advise customers to obtain the latest version of relevant informationto verify, before placing orders, that information being relied on is current and complete. All products are soldsubject to the terms and conditions of sale supplied at the time of order acknowledgement, including thosepertaining to warranty, patent infringement, and limitation of liability.TI warrants performance of its semiconductor products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extentTI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarilyperformed, except those mandated by government requirements.CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OFDEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICALAPPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, ORWARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHERCRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TOBE FULLY AT THE CUSTOMER’S RISK.In order to minimize risks associated with the customer’s applications, adequate design and operatingsafeguards must be provided by the customer to minimize inherent or procedural hazards.TI assumes no liability for applications assistance or customer product design. TI does not warrant or representthat any license, either express or implied, is granted under any patent right, copyright, mask work right, or otherintellectual property right of TI covering or relating to any combination, machine, or process in which suchsemiconductor products or services might be or are used. TI’s publication of information regarding any thirdparty’s products or services does not constitute TI’s approval, warranty or endorsement thereof.Copyright © 1999, Texas Instruments Incorporated。
SN54HCT245中文资料
PACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)5962-8550601VRA ACTIVE CDIP J201None Call TI Level-NC-NC-NC 5962-8550601VSA ACTIVE CFP W201None Call TI Level-NC-NC-NC 85506012A ACTIVE LCCC FK201None Call TI Level-NC-NC-NC 8550601RA ACTIVE CDIP J201None Call TI Level-NC-NC-NC JM38510/65553BRA ACTIVE CDIP J201None Call TI Level-NC-NC-NC JM38510/65553BSA ACTIVE CFP W201None Call TI Level-NC-NC-NC SN54HCT245J ACTIVE CDIP J201None Call TI Level-NC-NC-NC SN74HCT245DBLE OBSOLETE SSOP DB20None Call TI Call TISN74HCT245DBR ACTIVE SSOP DB202000Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMSN74HCT245DW ACTIVE SOIC DW2025Pb-Free(RoHS)CU NIPDAU Level-2-250C-1YEAR/Level-1-235C-UNLIMSN74HCT245DWR ACTIVE SOIC DW202000Pb-Free(RoHS)CU NIPDAU Level-2-250C-1YEAR/Level-1-235C-UNLIMSN74HCT245N ACTIVE PDIP N2020Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NC SN74HCT245N3OBSOLETE PDIP N20None Call TI Call TISN74HCT245NSR ACTIVE SO NS202000Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMSN74HCT245PW ACTIVE TSSOP PW2070Pb-Free(RoHS)CU NIPDAU Level-1-250C-UNLIMSN74HCT245PWLE OBSOLETE TSSOP PW20None Call TI Call TISN74HCT245PWR ACTIVE TSSOP PW202000Pb-Free(RoHS)CU NIPDAU Level-1-250C-UNLIMSN74HCT245PWT ACTIVE TSSOP PW20250Pb-Free(RoHS)CU NIPDAU Level-1-250C-UNLIM SNJ54HCT245FK ACTIVE LCCC FK201None Call TI Level-NC-NC-NC SNJ54HCT245J ACTIVE CDIP J201None Call TI Level-NC-NC-NC SNJ54HCT245W ACTIVE CFP W201None Call TI Level-NC-NC-NC (1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-May not be currently available-please check /productcontent for the latest availability information and additional product content details.None:Not yet available Lead(Pb-Free).Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green(RoHS&no Sb/Br):TI defines"Green"to mean"Pb-Free"and in addition,uses package materials that do not contain halogens, including bromine(Br)or antimony(Sb)above0.1%of total product weight.(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.元器件交易网IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,enhancements, improvements, and other changes to its products and services at any time and to discontinueany product or service without notice. Customers should obtain the latest relevant information before placingorders and should verify that such information is current and complete. All products are sold subject to TI’s termsand conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TIdeems necessary to support this warranty. Except where mandated by government requirements, testing of allparameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible fortheir products and applications using TI components. T o minimize the risks associated with customer productsand applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or processin which TI products or services are used. Information published by TI regarding third-party products or servicesdoes not constitute a license from TI to use such products or services or a warranty or endorsement thereof.Use of such information may require a license from a third party under the patents or other intellectual propertyof the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is withoutalteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproductionof this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable forsuch altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for thatproduct or service voids all express and any implied warranties for the associated TI product or service andis an unfair and deceptive business practice. TI is not responsible or liable for any such statements.Following are URLs where you can obtain information on other Texas Instruments products and applicationsolutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityTelephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2005, Texas Instruments Incorporated。
SNJ54ABT162827AWD中文资料
PACKAGING INFORMATIONOrderable Device Status (1)Package Type Package Drawing Pins Package Qty Eco Plan (2)Lead/Ball Finish MSL Peak Temp (3)74ABT162827ADGGRE4ACTIVE TSSOP DGG 562000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74ABT162827ADGGR ACTIVE TSSOP DGG 562000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74ABT162827ADGVR OBSOLETE TVSOP DGV 56Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74ABT162827ADL ACTIVE SSOP DL 5620Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74ABT162827ADLRACTIVESSOPDL561000Green (RoHS &no Sb/Br)CU NIPDAULevel-1-260C-UNLIM(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan -The planned eco-friendly classification:Pb-Free (RoHS)or Green (RoHS &no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green (RoHS &no Sb/Br):TI defines "Green"to mean Pb-Free (RoHS compatible),and free of Bromine (Br)and Antimony (Sb)based flame retardants (Br or Sb do not exceed 0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The informationprovided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.PACKAGE OPTION ADDENDUM5-Sep-2005Addendum-Page 1元器件交易网元器件交易网IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,enhancements, improvements, and other changes to its products and services at any time and to discontinueany product or service without notice. Customers should obtain the latest relevant information before placingorders and should verify that such information is current and complete. All products are sold subject to TI’s termsand conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TIdeems necessary to support this warranty. Except where mandated by government requirements, testing of allparameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible fortheir products and applications using TI components. T o minimize the risks associated with customer productsand applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or processin which TI products or services are used. Information published by TI regarding third-party products or servicesdoes not constitute a license from TI to use such products or services or a warranty or endorsement thereof.Use of such information may require a license from a third party under the patents or other intellectual propertyof the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is withoutalteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproductionof this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable forsuch altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for thatproduct or service voids all express and any implied warranties for the associated TI product or service andis an unfair and deceptive business practice. TI is not responsible or liable for any such statements.Following are URLs where you can obtain information on other Texas Instruments products and applicationsolutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityTelephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2005, Texas Instruments Incorporated。
SN54AHC16245或SN74AHC16245(中文说明书)
2. The package thermal impedance is calculated in accordance with JESD 51.
存取温度范围，Tstg . . . . . . . . . . . . . . . . . . .. . . . . . . . . . . . . .–65°C to 150°C
†强调上市以后在“绝对最大额定值”可能造成永久性损坏器件。这些压力等级和功能操作在这些或任何其他条件的器件之外，表明在“推荐工作条件”不是暗示。在绝对最大额定值条件下长时间可能影响器件的可靠性。
封装热阻抗，JA (看注2)：DGG封装. . . . . . . . . . . . . . . . . .89°C/W
DGV封装. . . . . . . . . .. . . . . . . . . . . . .93°C/W
DL封装. . . . . . . . . . . . . . . .. . . . . . . .94°C/W
#逻辑符号依照ANSI/IEEE Std 91-1984和IEC期刊617-12
逻辑框图（正逻辑）
到七个其他通道到七个其他通道
绝对最大额定值在工作温度范围（除非另有说明）†
电源电压范围，Vcc. . . . . .. . . . . . . . . . . . .–0.5 V to 7 V
输入电压范围（看注1）. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
SN54194资料
元器件交易网IMPORTANT NOTICETexas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinueany product or service without notice, and advise customers to obtain the latest version of relevant informationto verify, before placing orders, that information being relied on is current and complete. All products are soldsubject to the terms and conditions of sale supplied at the time of order acknowledgement, including thosepertaining to warranty, patent infringement, and limitation of liability.TI warrants performance of its semiconductor products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extentTI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarilyperformed, except those mandated by government requirements.CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OFDEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICALAPPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, ORWARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHERCRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TOBE FULLY AT THE CUSTOMER’S RISK.In order to minimize risks associated with the customer’s applications, adequate design and operatingsafeguards must be provided by the customer to minimize inherent or procedural hazards.TI assumes no liability for applications assistance or customer product design. TI does not warrant or representthat any license, either express or implied, is granted under any patent right, copyright, mask work right, or otherintellectual property right of TI covering or relating to any combination, machine, or process in which suchsemiconductor products or services might be or are used. TI’s publication of information regarding any thirdparty’s products or services does not constitute TI’s approval, warranty or endorsement thereof.Copyright © 1998, Texas Instruments Incorporated。
SN54HCT04中文资料
元器件交易网IMPORTANT NOTICETexas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinueany product or service without notice, and advise customers to obtain the latest version of relevant informationto verify, before placing orders, that information being relied on is current and complete. All products are soldsubject to the terms and conditions of sale supplied at the time of order acknowledgement, including thosepertaining to warranty, patent infringement, and limitation of liability.TI warrants performance of its semiconductor products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extentTI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarilyperformed, except those mandated by government requirements.CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OFDEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICALAPPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, ORWARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHERCRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TOBE FULLY AT THE CUSTOMER’S RISK.In order to minimize risks associated with the customer’s applications, adequate design and operatingsafeguards must be provided by the customer to minimize inherent or procedural hazards.TI assumes no liability for applications assistance or customer product design. TI does not warrant or representthat any license, either express or implied, is granted under any patent right, copyright, mask work right, or otherintellectual property right of TI covering or relating to any combination, machine, or process in which suchsemiconductor products or services might be or are used. TI’s publication of information regarding any thirdparty’s products or services does not constitute TI’s approval, warranty or endorsement thereof.Copyright © 1998, Texas Instruments Incorporated。
SN5405, SN54LS05, SN54S05 TTL型反相器说明书
SN54LS05, SN54S05SN7405, SN74LS05, SN74S05HEX INVERTERS WITH OPENĆCOLLECTOR OUTPUTSSDLS030A − DECEMBER 1983 − REVISED NOVEMBER 20031POST OFFICE BOX 655303 •DALLAS, TEXAS 75265D Package Options Include PlasticSmall-Outline (D, NS), Shrink Small-Outline (DB), and Ceramic Flat (W) Packages,Ceramic Chip Carriers (FK), and Standard Plastic (N) and Ceramic (J) DIPsD Dependable Texas Instrument Quality andReliabilitySN5405, SN54LS05, SN54S05...J PACKAGESN7405...N PACKAGESN74LS05...D, DB, N, OR NS PACKAGE SN74S05...D, N, OR NS PACKAGE(TOP VIEW)12345671413121110981A 1Y 2A 2Y 3A 3Y GNDV CC 6A 6Y 5A 5Y 4A 4Y32120199101112134567818171615146Y NC 5A NC 5Y2A NC 2Y NC 3ASN54LS05, SN54S05...FK PACKAGE(TOP VIEW)1Y 1A N C 4A6A3Y G N D N C C CV 4Y NC − No internal connectionSN54LS05, SN54S05...W PACKAGE (TOP VIEW)12345671413121110981A 2Y 2A V CC 3A 3Y 4A1Y 6A 6Y GND 5Y 5A 4Ydescription/ordering informationThese devices contain six independent inverters. T o perform correctly, the open-collector outputs require pullup resistors. These devices may be connected to other open-collector outputs to implement active-low wired-OR or active-high wire-AND functions. Open-collector devices often are used to generate high V OH levels.ORDERING INFORMATIONT APACKAGE †ORDERABLE PART NUMBER TOP-SIDE MARKING SN7405NSN7405N SN74LS05N SN74LS05N PDIP − NTube SN74S05N SN74S05N TubeSN74LS05D Tape and reel SN74LS05DR LS050°C to 70°CSOIC − DTube SN74S05D Tape and reelSN74S05DR S05SN74LS05NSR 74LS05SOP − NS Tape and reel SN74S05NSR 74S05SSOP − DB Tape and reel SN74LS05DBR LS05SNJ54LS05J SNJ54LS05J CDIP − JTube SNJ54S05J SNJ54S05J SNJ54LS05W SNJ54LS05W −55°C to 125°CCDIP − W Tube SNJ54S05W SNJ54S05W SNJ54LS05FK SNJ54LS05FK LCCC − FKTubeSNJ54S05FKSNJ54S05FK†Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at /sc/package.The SN5405 is obsolete and no longer is supplied.Copyright 2003, Texas Instruments IncorporatedPRODUCTION DATA information is current as of publication date.Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.On products compliant to MILĆPRFĆ38535, all parameters are tested unless otherwise noted. On all other products, production processing does not necessarily include testing of all parameters.SN54LS05, SN54S05SN7405, SN74LS05, SN74S05HEX INVERTERS WITH OPENĆCOLLECTOR OUTPUTSSDLS030A − DECEMBER 1983 − REVISED NOVEMBER 20032POST OFFICE BOX 655303 •DALLAS, TEXAS 75265FUNCTION TABLE (each inverter)INPUT OUTPUTA YH L LHlogic diagram (positive logic)1A2A3A4A5A6A 1Y2Y3Y4Y5Y6Y1359111324681012Y = APin numbers shown are for the D, DB, J, N, and NS packages.The SN5405 is obsolete and no longer is supplied.SN54LS05, SN54S05SN7405, SN74LS05, SN74S05HEX INVERTERS WITH OPENĆCOLLECTOR OUTPUTSSDLS030A − DECEMBER 1983 − REVISED NOVEMBER 20033POST OFFICE BOX 655303 •DALLAS, TEXAS 75265schematic (each inverter)Resistor values shown are nominal.4 k ΩInputAOutput YGNDV CC1.6 k Ω1 k Ω’0520 k ΩInputAOutput YV CC8 k Ω4.5 k Ω’LS05GND2.8 k ΩOutput YV CC900 Ω500 Ω’S05InputA250 Ωabsolute maximum ratings over operating free-air temperature (unless otherwise noted)†Supply voltage, V CC (see Note 1): ’05, ’LS05, ’S05 7 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Input voltage, V I : ’05, ’S05 5.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ’LS05 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Off-state output voltage, V O 7 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Package thermal impedance, θJA (see Note 2):D package 86°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DB package 96°C/W . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . N package 80°C/W . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . NS package 76°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Storage temperature range, T stg −65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . †Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.NOTES: 1.Voltage values are with respect to network ground terminal.2.The package thermal impedance is calculated in accordance with JESD 51-7.The SN5405 is obsolete and no longer is supplied.SN54LS05, SN54S05SN7405, SN74LS05, SN74S05HEX INVERTERS WITH OPENĆCOLLECTOR OUTPUTSSDLS030A − DECEMBER 1983 − REVISED NOVEMBER 20034POST OFFICE BOX 655303 •DALLAS, TEXAS 75265recommended operating conditionsSN5405SN7405MINNOMMAX MIN NOMMAX UNIT V CC Supply voltage 4.555.54.7555.25V V IH High-level input voltage 22V V IL Low-level input voltage 0.80.8V V OH High-level output voltage 5.5 5.5V I OL Low-level output current 1616mA T AOperating free-air temperature−5512570°Celectrical characteristics over recommended operating free-air temperature range (unless otherwise noted)†SN5405SN7405PARAMETER TEST CONDITIONS MIN TYP ‡MAX MIN TYP ‡MAX UNIT V IK V CC = MIN,I I = −12 mA −1.5−1.5V I V V V IL = 0.8 V 0.25OH CC = MIN,OH = 5.5 V V IL = 0.7 V 0.25mA V OL V CC = MIN,V IH = 2 V,I OL = 16 mA0.20.40.20.4V I I V CC = MAX,V I = 5.5 V 11mA I IH V CC = MAX,V I = 2.4 V 4040µA I IL V CC = MAX,V I = 0.4 V −1.6−1.6mA I CCH V CC = MAX,V I = 0 V 612612mA I CCLV CC = MAX,V I = 4.5 V18331833mA†For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions.‡All typical values are at V CC = 5 V, T A = 25°C.switching characteristics, V CC = 5 V, T A = 25°C (see Figure 1)PARAMETERFROM (INPUT)TO (OUTPUT)TEST CONDITIONS MINTYP MAX UNIT t PLH R L = 4 k ΩL 4055t PHLAYR L = 400 ΩC = 15 pF815nsThe SN5405 is obsolete and no longer is supplied.SN54LS05, SN54S05SN7405, SN74LS05, SN74S05HEX INVERTERS WITH OPENĆCOLLECTOR OUTPUTSSDLS030A − DECEMBER 1983 − REVISED NOVEMBER 20035POST OFFICE BOX 655303 •DALLAS, TEXAS 75265recommended operating conditionsSN54LS05SN74LS05MINNOMMAX MIN NOMMAX UNIT V CC Supply voltage 4.555.54.7555.25V V IH High-level input voltage 22V V IL Low-level input voltage 0.70.8V V OH High-level output voltage 5.5 5.5V I OL Low-level output current 48mA T AOperating free-air temperature−5512570°Celectrical characteristics over recommended operating free-air temperature range (unless otherwise noted)SN54LS05SN74LS05PARAMETER TEST CONDITIONS †MIN TYP ‡MAXMIN TYP ‡MAXUNIT V IK V CC = MIN,I I = −18 mA −1.5−1.5V I OH V CC = MIN,V IL = MAX,V OH = 5.5 V0.10.1mA V V V I OL = 4 mA 0.250.40.250.4OL CC = MIN,IH = 2 V I OL = 8 mA0.350.5V I I V CC = MAX,V I = 7 V 0.10.1mA I IH V CC = MAX,V I = 2.7 V 2020µA I IL V CC = MAX,V I = 0.4 V −0.4−0.4mA I CCHV CC = MAX,V I = 0 V1.22.41.22.4mA I CCL V CC = MAX,V I = 4.5 V3.6 6.6 3.66.6mA†For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions.‡All typical values are at V CC = 5 V, T A = 25°C.switching characteristics, V CC = 5 V, T A = 25°C (see Figure 2)PARAMETERFROM (INPUT)TO (OUTPUT)TEST CONDITIONS MINTYP MAX UNIT t PLH L ΩL 1732t PHLAYR = 2 k ,C = 15 pF1528nsThe SN5405 is obsolete and no longer is supplied.SN54LS05, SN54S05SN7405, SN74LS05, SN74S05HEX INVERTERS WITH OPENĆCOLLECTOR OUTPUTSSDLS030A − DECEMBER 1983 − REVISED NOVEMBER 20036POST OFFICE BOX 655303 •DALLAS, TEXAS 75265recommended operating conditionsSN54S05SN74S05MINNOMMAX MIN NOMMAX UNIT V CC Supply voltage 4.555.54.7555.25V V IH High-level input voltage 22V V IL Low-level input voltage 0.80.8V V OH High-level output voltage 5.5 5.5V I OL Low-level output current 2020mA T AOperating free-air temperature−5512570°Celectrical characteristics over recommended operating free-air temperature range (unless otherwise noted)†SN54S05SN74S05PARAMETER TEST CONDITIONS MIN TYP ‡MAXMIN TYP ‡MAXUNIT V IK V CC = MIN,I I = −18 mA −1.2−1.2V I V V V IL = 0.8 V 0.25OH CC = MIN,OH = 5.5 V V IL = 0.7 V 0.25mA V OL V CC = MIN,V IH = 2 V,I OL = 20 mA0.50.5V I I V CC = MAX,V I = 5.5 V 11mA I IH V CC = MAX,V I = 2.7 V 5050µA I IL V CC = MAX,V I = 0.5 V −2−2mA I CCH V CC = MAX,V I = 0 V 919.8919.8mA I CCLV CC = MAX,V I = 4.5 V30543054mA†For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions.‡All typical values are at V CC = 5 V, T A = 25°C.switching characteristics, V CC = 5 V, T A = 25°C (see Figure 1)PARAMETERFROM (INPUT)TO (OUTPUT)TEST CONDITIONSMIN TYP MAX UNIT t PLH L 257.5t PHL L C = 15 pF24.57nst PLH AYR = 280 ΩL 7.5t PHLC = 50 pF7nsThe SN5405 is obsolete and no longer is supplied.SN54LS05, SN54S05SN7405, SN74LS05, SN74S05HEX INVERTERS WITH OPENĆCOLLECTOR OUTPUTSSDLS030A − DECEMBER 1983 − REVISED NOVEMBER 20037POST OFFICE BOX 655303 •DALLAS, TEXAS 75265PARAMETER MEASUREMENT INFORMATIONSERIES 54/74 AND 54S/74S DEVICESFrom Output Under TestC L(see Note A)R LTest PointV CCLOAD CIRCUIT1.5 V1.5 VHigh-LevelPulse1.5 V1.5 Vt wLow-LevelPulseVOLTAGE WAVEFORMSPULSE WIDTHSNOTES: A.C L includes probe and jig capacitance.B.In the examples above, the phase relationships between inputs and outputs have been chosen arbitrarily.C.All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, Z O = 50 Ω, and:For Series 54/74, t r ≤ 7 ns, t f ≤ 7 ns.For Series 54S/74S, t r ≤ 2.5 ns, t f ≤ 2.5 ns.D.The outputs are measured one at a time with one input transition per measurement.1.5 V1.5 VInputt PLHIn-Phase Output3 V0 V 1.5 V1.5 VV OHV OL t PHL1.5 V1.5 VV OHV OLt PHLt PLHOut-of-PhaseOutputVOLTAGE WAVEFORMS PROPAGATION DELAY TIMESFigure 1. Load Circuit and Voltage WaveformsThe SN5405 is obsolete and no longer is supplied.SN54LS05, SN54S05SN7405, SN74LS05, SN74S05HEX INVERTERS WITH OPENĆCOLLECTOR OUTPUTSSDLS030A − DECEMBER 1983 − REVISED NOVEMBER 20038POST OFFICE BOX 655303 •DALLAS, TEXAS 75265PARAMETER MEASUREMENT INFORMATIONSERIES 54LS/74LS DEVICESFrom Output Under TestC L(see Note A)R LTest PointV CCLOAD CIRCUIT1.3 V1.3 VHigh-LevelPulse1.3 V1.3 Vt wLow-LevelPulseVOLTAGE WAVEFORMSPULSE WIDTHSNOTES: A.C L includes probe and jig capacitance.B.In the examples above, the phase relationships between inputs and outputs have been chosen arbitrarily.C.All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, Z O = 50 Ω, t r ≤ 1.5 ns, t f ≤ 2.6 ns.D.The outputs are measured one at a time with one input transition per measurement.1.3 V1.3 VInputt PLHIn-Phase Output3 V0 V 1.3 V1.3 VV OHV OL t PHL1.3 V1.3 VV OHV OLt PHLt PLHOut-of-PhaseOutputVOLTAGE WAVEFORMS PROPAGATION DELAY TIMESFigure 2. Load Circuit and Voltage WaveformsThe SN5405 is obsolete and no longer is supplied.PACKAGING INFORMATIONAddendum-Page 1(1) The marketing status values are defined as follows:ACTIVE: Product device recommended for new designs.LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free".RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement.(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device.(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.Addendum-Page 2PACKAGE OPTION ADDENDUM 11-Apr-2023OTHER QUALIFIED VERSIONS OF SN54LS05, SN54S05, SN74LS05, SN74S05 :•Catalog : SN74LS05, SN74S05•Military : SN54LS05, SN54S05NOTE: Qualified Version Definitions:•Catalog - TI's standard catalog product•Military - QML certified for Military and Defense ApplicationsAddendum-Page 3 1-Jul-2023TAPE AND REEL INFORMATIONA0B0K0WDimension designed to accommodate the component length Dimension designed to accommodate the component thickness Overall width of the carrier tape Pitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONS Sprocket Holes P1*All dimensions are nominal Device Package Type Package DrawingPinsSPQ Reel Diameter (mm)Reel Width W1 (mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant SN74LS05DBR SSOPDB 142000330.016.48.35 6.6 2.412.016.0Q1SN74LS05DR SOICD 142500330.016.4 6.59.0 2.18.016.0Q1SN74LS05NSR SONS 142000330.016.48.210.5 2.512.016.0Q1SN74S05NSR SO NS 142000330.016.48.210.5 2.512.016.0Q11-Jul-2023*All dimensions are nominalDevice Package Type Package Drawing Pins SPQ Length (mm)Width (mm)Height (mm) SN74LS05DBR SSOP DB142000356.0356.035.0SN74LS05DR SOIC D142500356.0356.035.0SN74LS05NSR SO NS142000356.0356.035.0SN74S05NSR SO NS142000356.0356.035.01-Jul-2023 TUBET - Tube*All dimensions are nominalDevice Package Name Package Type Pins SPQ L (mm)W (mm)T (µm) B (mm)SN7405N N PDIP142550613.9711230 4.32SN7405N N PDIP142550613.9711230 4.32SN7405NE4N PDIP142550613.9711230 4.32SN7405NE4N PDIP142550613.9711230 4.32SN74LS05D D SOIC1450506.683940 4.32SN74LS05N N PDIP142550613.9711230 4.32SN74LS05N N PDIP142550613.9711230 4.32SN74LS05NE4N PDIP142550613.9711230 4.32SN74LS05NE4N PDIP142550613.9711230 4.32SN74S05D D SOIC1450506.683940 4.32SN74S05N N PDIP142550613.9711230 4.32SN74S05N N PDIP142550613.9711230 4.32SNJ54LS05FK FK LCCC201506.9812.062030NASNJ54LS05W W CFP141506.9826.166220NASNJ54S05FK FK LCCC201506.9812.062030NAGENERIC PACKAGE VIEWThis image is a representation of the package family, actual package may vary.Refer to the product data sheet for package details.LCCC - 2.03 mm max height FK 20LEADLESS CERAMIC CHIP CARRIER8.89 x 8.89, 1.27 mm pitchPACKAGE OUTLINECDIP - 5.08 mm max heightJ0014A CERAMIC DUAL IN LINE PACKAGENOTES:1. All controlling linear dimensions are in inches. Dimensions in brackets are in millimeters. Any dimension in brackets or parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M.2. This drawing is subject to change without notice.3. This package is hermitically sealed with a ceramic lid using glass frit.4. Index point is provided on cap for terminal identification only and on press ceramic glass frit seal only.5. Falls within MIL-STD-1835 and GDIP1-T14.EXAMPLE BOARD LAYOUTCDIP - 5.08 mm max heightJ0014A CERAMIC DUAL IN LINE PACKAGEMECHANICAL DATAMSSO002E – JANUARY 1995 – REVISED DECEMBER 2001POST OFFICE BOX 655303 •DALLAS, TEXAS 75265DB (R-PDSO-G**)PLASTIC SMALL-OUTLINE4040065/E 12/0128 PINS SHOWNGage Plane8,207,400,550,950,253812,9012,302810,50248,50Seating Plane9,907,903010,509,900,385,605,00150,2214A 28120166,506,50140,05 MIN 5,905,90DIMA MAX A MIN PINS **2,00 MAX 6,907,500,65M 0,150°–ā8°0,100,090,25NOTES: A.All linear dimensions are in millimeters.B.This drawing is subject to change without notice.C.Body dimensions do not include mold flash or protrusion not to exceed 0,15.D.Falls within JEDEC MO-150IMPORTANT NOTICE AND DISCLAIMERTI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATA SHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS.These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable standards, and any other safety, security, regulatory or other requirements.These resources are subject to change without notice. TI grants you permission to use these resources only for development of an application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these resources.TI’s products are provided subject to TI’s Terms of Sale or other applicable terms available either on or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for TI products.TI objects to and rejects any additional or different terms you may have proposed.Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265Copyright © 2023, Texas Instruments Incorporated。
SN54265资料
IMPORTANT NOTICETexas Instruments (TI) reserves the right to make changes to its products or to discontinue any semiconductor product or service without notice, and advises its customers to obtain the latest version of relevant information to verify, before placing orders, that the information being relied on is current.TI warrants performance of its semiconductor products and related software to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements.Certain applications using semiconductor products may involve potential risks of death, personal injury, or severe property or environmental damage (“Critical Applications”).TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED, OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES OR SYSTEMS OR OTHER CRITICAL APPLICATIONS.Inclusion of TI products in such applications is understood to be fully at the risk of the customer. Use of TI products in such applications requires the written approval of an appropriate TI officer. Questions concerning potential risk applications should be directed to TI through a local SC sales office.In order to minimize risks associated with the customer’s applications, adequate design and operating safeguards should be provided by the customer to minimize inherent or procedural hazards.TI assumes no liability for applications assistance, customer product design, software performance, or infringement of patents or services described herein. Nor does TI warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used.Copyright © 1996, Texas Instruments Incorporated。
SN54BCT541A中文资料
元器件交易网IMPORTANT NOTICETexas Instruments (TI) reserves the right to make changes to its products or to discontinue any semiconductorproduct or service without notice, and advises its customers to obtain the latest version of relevant informationto verify, before placing orders, that the information being relied on is current.TI warrants performance of its semiconductor products and related software to the specifications applicable atthe time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques areutilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of eachdevice is not necessarily performed, except those mandated by government requirements.Certain applications using semiconductor products may involve potential risks of death, personal injury, orsevere property or environmental damage (“Critical Applications”).TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED, OR WARRANTEDTO BE SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES OR SYSTEMS OR OTHERCRITICAL APPLICATIONS.Inclusion of TI products in such applications is understood to be fully at the risk of the customer. Use of TIproducts in such applications requires the written approval of an appropriate TI officer. Questions concerningpotential risk applications should be directed to TI through a local SC sales office.In order to minimize risks associated with the customer’s applications, adequate design and operatingsafeguards should be provided by the customer to minimize inherent or procedural hazards.TI assumes no liability for applications assistance, customer product design, software performance, orinfringement of patents or services described herein. Nor does TI warrant or represent that any license, eitherexpress or implied, is granted under any patent right, copyright, mask work right, or other intellectual propertyright of TI covering or relating to any combination, machine, or process in which such semiconductor productsor services might be or are used.Copyright © 1996, Texas Instruments Incorporated。
SNJ54ABT16652WD中文资料
PACKAGING INFORMATIONOrderable Device Status (1)Package Type Package Drawing Pins Package Qty Eco Plan (2)Lead/Ball FinishMSL Peak Temp (3)5962-9584101QXA ACTIVE CFP WD 561TBD Call TI Level-NC-NC-NC SN74ABT16652DL ACTIVE SSOP DL 5620Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74ABT16652DLG4ACTIVE SSOP DL 5620Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74ABT16652DLR ACTIVE SSOP DL 561000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74ABT16652DLRG4ACTIVE SSOP DL 561000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SNJ54ABT16652WDACTIVECFPWD561TBDCall TILevel-NC-NC-NC(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan -The planned eco-friendly classification:Pb-Free (RoHS)or Green (RoHS &no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green (RoHS &no Sb/Br):TI defines "Green"to mean Pb-Free (RoHS compatible),and free of Bromine (Br)and Antimony (Sb)based flame retardants (Br or Sb do not exceed 0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating accordingto the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.PACKAGE OPTION ADDENDUM26-Sep-2005Addendum-Page 1元器件交易网元器件交易网IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,enhancements, improvements, and other changes to its products and services at any time and to discontinueany product or service without notice. Customers should obtain the latest relevant information before placingorders and should verify that such information is current and complete. All products are sold subject to TI’s termsand conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TIdeems necessary to support this warranty. Except where mandated by government requirements, testing of allparameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible fortheir products and applications using TI components. T o minimize the risks associated with customer productsand applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or processin which TI products or services are used. Information published by TI regarding third-party products or servicesdoes not constitute a license from TI to use such products or services or a warranty or endorsement thereof.Use of such information may require a license from a third party under the patents or other intellectual propertyof the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is withoutalteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproductionof this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable forsuch altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for thatproduct or service voids all express and any implied warranties for the associated TI product or service andis an unfair and deceptive business practice. TI is not responsible or liable for any such statements.Following are URLs where you can obtain information on other Texas Instruments products and applicationsolutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityTelephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2005, Texas Instruments Incorporated。
SN54AHCT244中文资料
PACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)5962-9678301Q2A ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC 5962-9678301QRA ACTIVE CDIP J201TBD Call TI Level-NC-NC-NC 5962-9678301QSA ACTIVE CFP W201TBD Call TI Level-NC-NC-NC SN74AHCT244DBLE OBSOLETE SSOP DB20TBD Call TI Call TISN74AHCT244DBR ACTIVE SSOP DB202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT244DBRE4ACTIVE SSOP DB202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT244DGVR ACTIVE TVSOP DGV202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT244DGVRE4ACTIVE TVSOP DGV202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT244DW ACTIVE SOIC DW2025Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT244DWE4ACTIVE SOIC DW2025Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT244DWR ACTIVE SOIC DW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT244DWRE4ACTIVE SOIC DW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT244N ACTIVE PDIP N2020Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74AHCT244NE4ACTIVE PDIP N2020Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74AHCT244NSR ACTIVE SO NS202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT244NSRG4ACTIVE SO NS202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT244PW ACTIVE TSSOP PW2070Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT244PWE4ACTIVE TSSOP PW2070Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHCT244PWLE OBSOLETE TSSOP PW20TBD Call TI Call TISN74AHCT244PWR ACTIVE TSSOP PW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT244PWRE4ACTIVE TSSOP PW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT244PWRG4ACTIVE TSSOP PW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SNJ54AHCT244FK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC SNJ54AHCT244J ACTIVE CDIP J201TBD Call TI Level-NC-NC-NC SNJ54AHCT244W ACTIVE CFP W201TBD Call TI Level-NC-NC-NC (1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS)or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.元器件交易网元器件交易网IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,enhancements, improvements, and other changes to its products and services at any time and to discontinueany product or service without notice. Customers should obtain the latest relevant information before placingorders and should verify that such information is current and complete. All products are sold subject to TI’s termsand conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TIdeems necessary to support this warranty. Except where mandated by government requirements, testing of allparameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible fortheir products and applications using TI components. T o minimize the risks associated with customer productsand applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or processin which TI products or services are used. Information published by TI regarding third-party products or servicesdoes not constitute a license from TI to use such products or services or a warranty or endorsement thereof.Use of such information may require a license from a third party under the patents or other intellectual propertyof the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is withoutalteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproductionof this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable forsuch altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for thatproduct or service voids all express and any implied warranties for the associated TI product or service andis an unfair and deceptive business practice. TI is not responsible or liable for any such statements.Following are URLs where you can obtain information on other Texas Instruments products and applicationsolutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityTelephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2005, Texas Instruments Incorporated。
SN54HCT32中文资料
元器件交易网IMPORTANT NOTICETexas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinueany product or service without notice, and advise customers to obtain the latest version of relevant informationto verify, before placing orders, that information being relied on is current and complete. All products are soldsubject to the terms and conditions of sale supplied at the time of order acknowledgement, including thosepertaining to warranty, patent infringement, and limitation of liability.TI warrants performance of its semiconductor products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extentTI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarilyperformed, except those mandated by government requirements.CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OFDEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICALAPPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, ORWARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHERCRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TOBE FULLY AT THE CUSTOMER’S RISK.In order to minimize risks associated with the customer’s applications, adequate design and operatingsafeguards must be provided by the customer to minimize inherent or procedural hazards.TI assumes no liability for applications assistance or customer product design. TI does not warrant or representthat any license, either express or implied, is granted under any patent right, copyright, mask work right, or otherintellectual property right of TI covering or relating to any combination, machine, or process in which suchsemiconductor products or services might be or are used. TI’s publication of information regarding any thirdparty’s products or services does not constitute TI’s approval, warranty or endorsement thereof.Copyright © 1998, Texas Instruments Incorporated。
SN54LS245中文资料
PACKAGING INFORMATIONAddendum-Page 1(1) The marketing status values are defined as follows:ACTIVE: Product device recommended for new designs.LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check /productcontent for the latest availability information and additional product content details.TBD: The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)Addendum-Page 2(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device.(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.OTHER QUALIFIED VERSIONS OF SN54LS245, SN54LS245-SP, SN74LS245 :•Catalog: SN74LS245, SN54LS245•Military: SN54LS245•Space: SN54LS245-SPNOTE: Qualified Version Definitions:•Catalog - TI's standard catalog product•Military - QML certified for Military and Defense Applications•Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based applicationAddendum-Page 3TAPE AND REEL INFORMATION*All dimensions are nominalDevicePackage Type Package Drawing Pins SPQReel Diameter (mm)Reel Width W1(mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant SN74LS245DBR SSOP DB 202000330.016.48.27.5 2.512.016.0Q1SN74LS245DWR SOIC DW 202000330.024.410.813.0 2.712.024.0Q1SN74LS245NSRSONS202000330.024.48.213.02.512.024.0Q1*All dimensions are nominalDevice Package Type Package Drawing Pins SPQ Length(mm)Width(mm)Height(mm) SN74LS245DBR SSOP DB202000367.0367.038.0 SN74LS245DWR SOIC DW202000367.0367.045.0SN74LS245NSR SO NS202000367.0367.045.0IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,enhancements,improvements and other changes to its semiconductor products and services per JESD46,latest issue,and to discontinue any product or service per JESD48,latest issue.Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All semiconductor products(also referred to herein as“components”)are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its components to the specifications applicable at the time of sale,in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by applicable law,testing of all parameters of each component is not necessarily performed.TI assumes no liability for applications assistance or the design of Buyers’products.Buyers are responsible for their products and applications using TI components.To minimize the risks associated with Buyers’products and applications,Buyers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any patent right,copyright,mask work right,or other intellectual property right relating to any combination,machine,or process in which TI components or services are rmation published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI.Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.TI is not responsible or liable for such altered rmation of third parties may be subject to additional restrictions.Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.Buyer acknowledges and agrees that it is solely responsible for compliance with all legal,regulatory and safety-related requirements concerning its products,and any use of TI components in its applications,notwithstanding any applications-related information or support that may be provided by TI.Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures,monitor failures and their consequences,lessen the likelihood of failures that might cause harm and take appropriate remedial actions.Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications.In some cases,TI components may be promoted specifically to facilitate safety-related applications.With such components,TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements.Nonetheless,such components are subject to these terms.No TI components are authorized for use in FDA Class III(or similar life-critical medical equipment)unless authorized officers of the parties have executed a special agreement specifically governing such use.Only those TI components which TI has specifically designated as military grade or“enhanced plastic”are designed and intended for use in military/aerospace applications or environments.Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk,and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI has specifically designated certain components as meeting ISO/TS16949requirements,mainly for automotive use.In any case of use of non-designated products,TI will not be responsible for any failure to meet ISO/TS16949.Products ApplicationsAudio /audio Automotive and Transportation /automotiveAmplifiers Communications and Telecom /communicationsData Converters Computers and Peripherals /computersDLP®Products Consumer Electronics /consumer-appsDSP Energy and Lighting /energyClocks and Timers /clocks Industrial /industrialInterface Medical /medicalLogic Security /securityPower Mgmt Space,Avionics and Defense /space-avionics-defense Microcontrollers Video and Imaging /videoRFID OMAP Applications Processors /omap TI E2E Community Wireless Connectivity /wirelessconnectivityMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2014,Texas Instruments Incorporated。
SN54ABT16657_08中文资料
PACKAGING INFORMATIONOrderable Device Status (1)Package Type Package Drawing Pins Package Qty Eco Plan (2)Lead/Ball Finish MSL Peak Temp (3)74ABT16657DGGRE4ACTIVE TSSOP DGG 562000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM 74ABT16657DGGRG4ACTIVE TSSOP DGG 562000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74ABT16657DGGR ACTIVE TSSOP DGG 562000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74ABT16657DL ACTIVE SSOP DL 5620Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74ABT16657DLG4ACTIVE SSOP DL 5620Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74ABT16657DLR ACTIVE SSOP DL 561000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74ABT16657DLRG4ACTIVESSOPDL561000Green (RoHS &no Sb/Br)CU NIPDAULevel-1-260C-UNLIM(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan -The planned eco-friendly classification:Pb-Free (RoHS),Pb-Free (RoHS Exempt),or Green (RoHS &no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1)lead-based flip-chip solder bumps used between the die and package,or 2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free (RoHS compatible)as defined above.Green (RoHS &no Sb/Br):TI defines "Green"to mean Pb-Free (RoHS compatible),and freeof Bromine (Br)and Antimony (Sb)based flame retardants (Br or Sb do not exceed 0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.PACKAGE OPTION ADDENDUM27-Sep-2007TAPE AND REELINFORMATION*All dimensionsare nominalDevicePackage Type Package Drawing Pins SPQReel Diameter (mm)Reel Width W1(mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant SN74ABT16657DGGR TSSOP DGG 562000330.024.48.615.6 1.812.024.0Q1SN74ABT16657DLRSSOPDL561000330.032.411.3518.673.116.032.0Q1PACKAGE MATERIALS INFORMATION11-Mar-2008*Alldimensions are nominalDevicePackage TypePackage DrawingPins SPQ Length (mm)Width (mm)Height (mm)SN74ABT16657DGGR TSSOP DGG 562000346.0346.041.0SN74ABT16657DLRSSOPDL561000346.0346.049.0PACKAGE MATERIALS INFORMATION11-Mar-2008Pack Materials-Page 2IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements,improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right, or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI.Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.Reproduction of this information with alteration is an unfair and deceptive business practice.TI is not responsible or liable for such altered rmation of third parties may be subject to additional restrictions.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications(such as life support)where a failure of the TI product would reasonably be expected to cause severe personal injury or death,unless officers of the parties have executed an agreement specifically governing such use.Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications,and acknowledge and agree that they are solely responsible for all legal,regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications,notwithstanding any applications-related information or support that may be provided by TI.Further,Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or"enhanced plastic."Only products designated by TI as military-grade meet military specifications.Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk,and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS16949requirements.Buyers acknowledge and agree that,if they use any non-designated products in automotive applications,TI will not be responsible for any failure to meet such requirements.Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers AudioData Converters AutomotiveDSP BroadbandClocks and Timers Digital ControlInterface MedicalLogic MilitaryPower Mgmt Optical NetworkingMicrocontrollers SecurityRFID TelephonyRF/IF and ZigBee®Solutions Video&ImagingWirelessMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2008,Texas Instruments Incorporated。
SN54ABT5402AFK中文资料
元器件交易网IMPORTANT NOTICETexas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinueany product or service without notice, and advise customers to obtain the latest version of relevant informationto verify, before placing orders, that information being relied on is current and complete. All products are soldsubject to the terms and conditions of sale supplied at the time of order acknowledgement, including thosepertaining to warranty, patent infringement, and limitation of liability.TI warrants performance of its semiconductor products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extentTI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarilyperformed, except those mandated by government requirements.CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OFDEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICALAPPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, ORWARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHERCRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TOBE FULLY AT THE CUSTOMER’S RISK.In order to minimize risks associated with the customer’s applications, adequate design and operatingsafeguards must be provided by the customer to minimize inherent or procedural hazards.TI assumes no liability for applications assistance or customer product design. TI does not warrant or representthat any license, either express or implied, is granted under any patent right, copyright, mask work right, or otherintellectual property right of TI covering or relating to any combination, machine, or process in which suchsemiconductor products or services might be or are used. TI’s publication of information regarding any thirdparty’s products or services does not constitute TI’s approval, warranty or endorsement thereof.Copyright © 1998, Texas Instruments Incorporated。
SN54HC244中文资料
PACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)5962-8409601VRA ACTIVE CDIP J201TBD Call TI Level-NC-NC-NC 5962-8409601VSA ACTIVE CFP W201TBD Call TI Level-NC-NC-NC 84096012A ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC 8409601RA ACTIVE CDIP J201TBD Call TI Level-NC-NC-NC 8409601SA ACTIVE CFP W201TBD Call TI Level-NC-NC-NCJM38510/65705B2A ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NCJM38510/65705BRA ACTIVE CDIP J201TBD Call TI Level-NC-NC-NCJM38510/65705BSA ACTIVE CFP W201TBD Call TI Level-NC-NC-NC SN54HC244J ACTIVE CDIP J201TBD Call TI Level-NC-NC-NC SN74HC244ADBLE OBSOLETE SSOP DB20TBD Call TI Call TISN74HC244APWLE OBSOLETE TSSOP PW20TBD Call TI Call TISN74HC244DBLE OBSOLETE SSOP DB20TBD Call TI Call TISN74HC244DBR ACTIVE SSOP DB202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74HC244DBRE4ACTIVE SSOP DB202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74HC244DW ACTIVE SOIC DW2025Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74HC244DWE4ACTIVE SOIC DW2025Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74HC244DWG4ACTIVE SOIC DW2025Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74HC244DWR ACTIVE SOIC DW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74HC244DWRE4ACTIVE SOIC DW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74HC244DWRG4ACTIVE SOIC DW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74HC244N ACTIVE PDIP N2020Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NC SN74HC244N3OBSOLETE PDIP N20TBD Call TI Call TISN74HC244NE4ACTIVE PDIP N2020Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74HC244NSG4ACTIVE SO NS2040Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74HC244NSR ACTIVE SO NS202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74HC244NSRE4ACTIVE SO NS202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74HC244NSRG4ACTIVE SO NS202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74HC244PW ACTIVE TSSOP PW2070Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74HC244PWE4ACTIVE TSSOP PW2070Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC244PWLE OBSOLETE TSSOP PW20TBD Call TI Call TISN74HC244PWR ACTIVE TSSOP PW202000Green(RoHS&CU NIPDAU Level-1-260C-UNLIMOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)no Sb/Br)SN74HC244PWRE4ACTIVE TSSOP PW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74HC244PWT ACTIVE TSSOP PW20250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74HC244PWTE4ACTIVE TSSOP PW20250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SNJ54HC244FK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC SNJ54HC244J ACTIVE CDIP J201TBD Call TI Level-NC-NC-NC SNJ54HC244W ACTIVE CFP W201TBD Call TI Level-NC-NC-NC (1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS)or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.元器件交易网IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,enhancements, improvements, and other changes to its products and services at any time and to discontinueany product or service without notice. Customers should obtain the latest relevant information before placingorders and should verify that such information is current and complete. All products are sold subject to TI’s termsand conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TIdeems necessary to support this warranty. Except where mandated by government requirements, testing of allparameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible fortheir products and applications using TI components. T o minimize the risks associated with customer productsand applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or processin which TI products or services are used. Information published by TI regarding third-party products or servicesdoes not constitute a license from TI to use such products or services or a warranty or endorsement thereof.Use of such information may require a license from a third party under the patents or other intellectual propertyof the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is withoutalteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproductionof this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable forsuch altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for thatproduct or service voids all express and any implied warranties for the associated TI product or service andis an unfair and deceptive business practice. TI is not responsible or liable for any such statements.Following are URLs where you can obtain information on other Texas Instruments products and applicationsolutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityTelephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2005, Texas Instruments Incorporated。
SN54HCT244J中文资料
PACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)5962-8513001VRA ACTIVE CDIP J201None Call TI Level-NC-NC-NC 5962-8513001VSA ACTIVE CFP W201None Call TI Level-NC-NC-NC 85130012A ACTIVE LCCC FK201None Call TI Level-NC-NC-NC 8513001RA ACTIVE CDIP J201None Call TI Level-NC-NC-NC JM38510/65755B2A ACTIVE LCCC FK201None Call TI Level-NC-NC-NC JM38510/65755BRA ACTIVE CDIP J201None Call TI Level-NC-NC-NC SN54HCT244J ACTIVE CDIP J201None Call TI Level-NC-NC-NC SN74HCT244DBLE OBSOLETE SSOP DB20None Call TI Call TISN74HCT244DBR ACTIVE SSOP DB202000Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMSN74HCT244DW ACTIVE SOIC DW2025Pb-Free(RoHS)CU NIPDAU Level-2-250C-1YEAR/Level-1-235C-UNLIMSN74HCT244DWR ACTIVE SOIC DW202000Pb-Free(RoHS)CU NIPDAU Level-2-250C-1YEAR/Level-1-235C-UNLIMSN74HCT244N ACTIVE PDIP N2020Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NC SN74HCT244N3OBSOLETE PDIP N20None Call TI Call TISN74HCT244NSR ACTIVE SO NS202000Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMSN74HCT244PW ACTIVE TSSOP PW2070Pb-Free(RoHS)CU NIPDAU Level-1-250C-UNLIMSN74HCT244PWLE OBSOLETE TSSOP PW20None Call TI Call TISN74HCT244PWR ACTIVE TSSOP PW202000Pb-Free(RoHS)CU NIPDAU Level-1-250C-UNLIMSN74HCT244PWT ACTIVE TSSOP PW20250Pb-Free(RoHS)CU NIPDAU Level-1-250C-UNLIM SNJ54HCT244FK ACTIVE LCCC FK201None Call TI Level-NC-NC-NC SNJ54HCT244J ACTIVE CDIP J201None Call TI Level-NC-NC-NC (1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-May not be currently available-please check /productcontent for the latest availability information and additional product content details.None:Not yet available Lead(Pb-Free).Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green(RoHS&no Sb/Br):TI defines"Green"to mean"Pb-Free"and in addition,uses package materials that do not contain halogens, including bromine(Br)or antimony(Sb)above0.1%of total product weight.(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it isprovided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.元器件交易网IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,enhancements, improvements, and other changes to its products and services at any time and to discontinueany product or service without notice. Customers should obtain the latest relevant information before placingorders and should verify that such information is current and complete. All products are sold subject to TI’s termsand conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TIdeems necessary to support this warranty. Except where mandated by government requirements, testing of allparameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible fortheir products and applications using TI components. T o minimize the risks associated with customer productsand applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or processin which TI products or services are used. Information published by TI regarding third-party products or servicesdoes not constitute a license from TI to use such products or services or a warranty or endorsement thereof.Use of such information may require a license from a third party under the patents or other intellectual propertyof the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is withoutalteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproductionof this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable forsuch altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for thatproduct or service voids all express and any implied warranties for the associated TI product or service andis an unfair and deceptive business practice. TI is not responsible or liable for any such statements.Following are URLs where you can obtain information on other Texas Instruments products and applicationsolutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityTelephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2005, Texas Instruments Incorporated。
SN54ABT126中文资料
PACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)SN74ABT126D ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74ABT126DBLE OBSOLETE SSOP DB14TBD Call TI Call TISN74ABT126DBR ACTIVE SSOP DB142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74ABT126DBRE4ACTIVE SSOP DB142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74ABT126DE4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74ABT126DR ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74ABT126DRE4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74ABT126N ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74ABT126NE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74ABT126NSR ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74ABT126NSRE4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74ABT126PW ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74ABT126PWE4ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74ABT126PWLE OBSOLETE TSSOP PW14TBD Call TI Call TISN74ABT126PWR ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74ABT126PWRE4ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74ABT126RGYR ACTIVE QFN RGY141000Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEAR(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS)or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.元器件交易网IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,enhancements, improvements, and other changes to its products and services at any time and to discontinueany product or service without notice. Customers should obtain the latest relevant information before placingorders and should verify that such information is current and complete. All products are sold subject to TI’s termsand conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TIdeems necessary to support this warranty. Except where mandated by government requirements, testing of allparameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible fortheir products and applications using TI components. T o minimize the risks associated with customer productsand applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or processin which TI products or services are used. Information published by TI regarding third-party products or servicesdoes not constitute a license from TI to use such products or services or a warranty or endorsement thereof.Use of such information may require a license from a third party under the patents or other intellectual propertyof the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is withoutalteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproductionof this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable forsuch altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for thatproduct or service voids all express and any implied warranties for the associated TI product or service andis an unfair and deceptive business practice. TI is not responsible or liable for any such statements.Following are URLs where you can obtain information on other Texas Instruments products and applicationsolutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityTelephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2005, Texas Instruments Incorporated。
SNJ54ABT162245WD中文资料
PACKAGING INFORMATIONOrderable Device Status (1)Package Type Package Drawing Pins Package Qty Eco Plan (2)Lead/Ball FinishMSL Peak Temp (3)5962-9677401QXA ACTIVE CFP WD 481TBDCall TI Level-NC-NC-NC 74ABT162245DGGRE4ACTIVE TSSOP DGG 482000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM 74ABT162245DLRG4ACTIVE SSOP DL 481000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74ABT162245DGGR ACTIVE TSSOP DGG 482000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74ABT162245DL ACTIVE SSOP DL 4825Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74ABT162245DLR ACTIVE SSOP DL 481000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SNJ54ABT162245WDACTIVECFPWD481TBDCall TILevel-NC-NC-NC(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan -The planned eco-friendly classification:Pb-Free (RoHS)or Green (RoHS &no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green (RoHS &no Sb/Br):TI defines "Green"to mean Pb-Free (RoHS compatible),and free of Bromine (Br)and Antimony (Sb)based flame retardants(Br or Sb do not exceed 0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.PACKAGE OPTION ADDENDUM26-Sep-2005Addendum-Page 1元器件交易网元器件交易网IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,enhancements, improvements, and other changes to its products and services at any time and to discontinueany product or service without notice. Customers should obtain the latest relevant information before placingorders and should verify that such information is current and complete. All products are sold subject to TI’s termsand conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TIdeems necessary to support this warranty. Except where mandated by government requirements, testing of allparameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible fortheir products and applications using TI components. T o minimize the risks associated with customer productsand applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or processin which TI products or services are used. Information published by TI regarding third-party products or servicesdoes not constitute a license from TI to use such products or services or a warranty or endorsement thereof.Use of such information may require a license from a third party under the patents or other intellectual propertyof the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is withoutalteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproductionof this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable forsuch altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for thatproduct or service voids all express and any implied warranties for the associated TI product or service andis an unfair and deceptive business practice. TI is not responsible or liable for any such statements.Following are URLs where you can obtain information on other Texas Instruments products and applicationsolutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityTelephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2005, Texas Instruments Incorporated。
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元器件交易网
IMPORTANT NOTICE
Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER
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BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright © 1998, Texas Instruments Incorporated。