ISL12026中文资料
低功耗实时时钟ISL1208中文资料
INTERSIL公司产品ISL1208I2C®实时时钟日历数据手册2004年10月29日 FN8080.1带后备电池供电SRAM的低功耗实时时钟ISL1208是低功耗实时时钟带定时与晶体补偿时钟/日历电源失效指示器周期或轮询报警智能后备电池切换和后备电池供电的用户SRAM振荡器采用外部低成本32.768kHz的晶体实时时钟用独立的时分秒寄存器跟踪时间并且还带有日历寄存器用于存储日月年和星期日历精确到2099年具有闰年自动修正功能订购信息引脚排列图ISL12088引脚MSOP SOIC顶视图特性z 实时时钟日历按小时分钟和秒追踪时间星期日月年z15种可选择的频率输出z单路报警可设置为月日星期时分或秒单事件或脉冲中断模式z自动切换到后备电池或大电容z电源故障检测z片内振荡器补偿z电池后备供电的2字节用户SRAMz I2C接口400kHz的数据传输速率z400nA电池供电电流z与ST公司的M41Txx Maxim公司的DS13xx有相同的引脚输出z小型封装8引脚MSOP和SOIC封装应用z需给电表z HA VC设备z音频/视频元件z机顶盒/电视机z调制解调器z 网络路由器集线器开关桥式电路z蜂窝结构设备z无线宽带固定设备z寻呼机/PDAz POS设备z测试仪表/装置z 办公自动化复印机传真机z家用电器z计算机产品z其它工业/医用/自动化设备方框图引脚描述X1石英晶体的一个引脚电源失效时为器件供电串行数据SDA引脚是一个双向引脚用于将串行数据输入或输出器件它有一个漏极开路可以与其它的漏极开路输出或集电极开路输出线或SCL/频率输出端是多功能引脚通过配置极限参数V DD V BA T SCL SDA和IRQ引脚上的电压相对于地0.5V至7.0V+0.5V DD模式X1和X2引脚上的电压相对于地0.5V至V+0.5V BA T模式0.5V至V贮存温度65°C至+150°C引线温度焊接10秒 300°C注强度超出所列的极限参数可能导致器件的永久性损坏这些仅仅是极限参数并不意味着在极限条件下或在任何其它超出推荐工作条件所示参数的情况下器件能有效地工作延长在极限参数条件下的工作时间会影响器件的可靠性直流工作特性实时时钟温度=40°C至+85°C除非另有说明掉电时序温度=40°C至+85°C除非另有说明串行接口规格除非另有说明否则在推荐工作条件下工作串行接口规格除非另有说明否则在推荐工作条件下工作续表注1IRQ&F OUT无效2LPMODE低功耗模式位=0默认3为确保计时精确必须遵循V DD SR-规格4典型值是T=25电源电压为3.3V时的值SDA与SCL的时序关系符号表典型性能曲线图温度为25除非另有说明图1 I BAT与V BAT的关系曲线图2 I BAT与温度V BAT=3V时的关系曲线图3 I DD1与温度的关系曲线 图4 I DD1与V CC 低功耗模式激活与禁止的关系曲线图5 IDD1与F OUT V DD =3.3V 时的关系 图6 I DD1与F OUT V DD =5V 时的关系V DD =5V 时的等效交流输出负载电路图7 V DD =5.0V 时用于器件测试的标准输出负载 图8 晶体推荐连接法概述ISL1208是低功耗实时时钟带定时与晶体补偿时钟/日历电源失效指示器周期或轮询报警智能后备电池切换和后备电池供电的用户SRAM振荡器采用外部低成本32.768kHz 的晶体实时时钟用独立的时分秒寄存器跟踪时间并且还带有日历寄存器用于存储日月年和星期日历精确到2099年具有闰年自动修正功能ISL1208强大的报警功能能够被设置成任意的时钟日历值与报警相匹配例如可设置成每分钟每个星期二或者3月21日上午5:23报警报警状态可以在状态寄存器中查询或者可以设置器件通过IRQ 引脚提供一次硬件中断报警有一种重复模式允许产生每分钟每小时每天一次等的周期性中断该器件还有一个后备电源输入脚V BAT 该脚允许器件用电池或大容量电容进行后备供电可自动从V DD切换到VBA T 整个ISL1208器件的工作电压范围为2.0V 至5.5V 时钟日历部分在电压低至1.8V 时仍可工作待机模式引脚描述X1, X2X1和X2脚分别用作反相放大器的输入和输出端使用一个外部32.768kHz 的石英晶体为ISL1208实时时钟提供一个基准时间在-40到+85的工作温度范围内内部补偿电路可保证器件的高精度在工作温度范围内振荡器补偿网络在制造过程中或者在与外部温度传感器和微控制器一起使用来进行有效补偿时可以用于对晶体定时精度进行校准该器件也可以用X1引脚处32.768kHz 的晶体源驱动V BAT这个输入端为器件提供一个备用电源电压当V DD 电源失效时V BA T 为器件提供电源可将该引脚连接到电池大容量电容如果不用则应将其接地IRQ /FOUT 中断输出/频率输出这是一个双重功能引脚既可以用作中断输出也可以用作频率输出引脚通过控制/状态寄存器的频率输出控制位来选择IRQ /FOUT 模式z 中断模式引脚输出一个中断信号该信号通知主机处理器报警已经发生并请求动作它是一个低电平有效的漏极开路输出端z 频率输出模式引脚输出一个与晶体频率有关的时钟信号用户可以通过I 2C 总线来选择和激活频率输出它是一个低电平有效的漏极开路输出端串行时钟 (SCL)SCL 输入端被用作串行数据输入和输出的时钟同步信号该引脚上的输入缓冲器总是激活的未用门栅控制为使电源消耗最小V BA T 引脚的后备电源被激活时该引脚被禁止串行数据 (SDA)SDA 是一个双向引脚用于对器件输入或输出数据它是一个漏极开路输出可以与其它漏极开路或集电极开路输出端线或在正常模式下输入缓冲器总是有效未用门栅控制漏极开路输出需要使用上拉电阻输出电路使用一个斜率控制的下拉来控制输出信号的下降时间该电路是针对400kHz 速率的I 2C 接口而设计在V BA T 引脚的后备电源被激活时该引脚被禁止V DD GND芯片的电源与接地引脚器件在2.0V 到5.5V 的直流电源下工作建议在VDD 引脚和接地引脚之间外接一个0.1F 的电容功能介绍电源控制电源控制电路既接受V DD 也接受V BAT 输入许多类型的电池可以与INTERSIL 公司的实时时钟产品配套使用例如 3.0V 或3.6V 的锂电池就比较适合其现有的大小可为INTERSIL 公司的实时时钟器件供电长达10年在V DD 断电时另一种选择就是使用大容量的电容可持续供电一个月更多信息见应用部分从正常模式V DD 切换到后备电池供电模式V BAT要从V DD 过渡到V BA T 模式必须同时具备以下两个条件条件1V DD <V BA T V BA THYS 其中V BA THYS 50mV 条件2V DD <V TRIP 其中V TRIP 2.2V 从后备电池供电模式VBAT 切换到正常模式V DD在遇到以下条件之一时ISL1208会从V BA T 切换到V DD 模式条件1V DD >V BA T +V BA THYS 其中V BA THYS 50mV 条件2V DD >V TRIP +V TRIPHYS 其中V TRIPHYS 30mV这些电源控制情况如图9和图10所示图9 V BA T <V TRIP 时的电池切换 图10 V BA T >V TRIP 时的电池切换为提供更低的电源I 2C 总线在后备电池供电模式中被禁止除此之外在后备电池供电模式中实时时钟的所有功能均可实现除了SCL 和SDA 以外在后备电池供电模式中ISL1208所有的输入端和输出端均有效除非通过控制寄存器来禁止在后备电池供电模式低至2V 时用户SRAM 也可工作电源失效检测ISL1208有一个实时时钟失效位RTCF 用于检测总电源失效它在器件丢失所有电源VDD 和V BA T之后使用户可以确定器件是否已上电低功耗模式ISL1208正常的电源切换被设计成只有在丢失V DD 电源时才会进行即切换到后备电池供电模式这样可以确保在稳定地切换到后备模式后器件可接受各种电源提供的宽范围的后备电压还有一种模式称作低功耗模式可允许直接从VDD 切换到V BA T 不要求V DD 下降到V TRIP 以下因为不再需要对V DD 与V TRIP 的关系进行额外的监控该监控电路被关断这样在V DD 下工作时消耗的电能更少在V DD =5V 时可节约典型值为600nA 的电流通过控制与状态寄存器中的LPMODE 位低功耗模式位可以激活低功耗模式在V DD 总是高于V BA T 的系统中低功耗模式非常有用当V DD 下降到V BA T 以下时器件将从V DD 切换到V BA T 并且还有50mV 的滞后电压防止在切换之后器件再返回到V DD 电源在V DD =5V 并且有后备锂电池VBA T =3V 的系统中可以采用低功耗模式但是在V DD =3.3V 10%V BA T 3.0V 并且在V DD 电源线上有一定I-R 压降的系统中建议不要采用低功耗模式InterSeal TM 电池节约开关ISL1208带有InterSeal TM 电池节约开关可防止电池首次使用前的初始电池电流消耗例如带后备电池的实时时钟通常都封装在带电池的电路板内为了保留电池的使用寿命ISL1208将不会从电池电源处吸收任何电能直到器件首次以V DD 电源供电此后只要V DD 电源丢失器件就会切换到后备电池供电模式实时时钟工作实时时钟RTC 使用一个外部的32.768kHz 的石英晶体来保持内部精确的年月日星期时分秒显示RTC 具有闰年校正功能时钟对少于31日的月也能校正有一位控制24小时或上午/下午AM/PM 格式当ISL1208在V DD 和V BA T 都失掉以后再上电时时钟即停止工作直到在时钟寄存器中写入至少一个字节实时时钟的精度实时时钟的精度取决于石英晶体的频率被用作RTC 的基准时间因为晶体的谐振频率取决于温度所以RTC 的性能也取决于温度晶体的频率偏差是晶体正常频率的温度反转函数例如20ppm 的频率偏差转变为每月1分钟的精度这些参数来源于晶体生产厂家ISL1208可提供片内晶体补偿网络来调整–94ppm 至+185ppm 范围内的振荡器频率更多详细信息见应用部分单事件和中断报警模式通过ALME 位来激活通过IM 位可选择单事件或中断报警模式注意当频率输出功能被激活报警功能则被禁止标准报警允许进行包括时刻日期星期以及年的时间报警在单事件模式中当发生时间报警时IRQ引脚被拉低并且报警状态位ALM被置为1脉冲中断模式有重复报警的功能因此一旦报警被设置器件将在每当报警设置值与当前时间匹配时发出报警这样器件可能每分钟都发出报警如果时钟被设置成每过n秒就报警也可能一年进行一次报警如果时钟被设置成只有过n个月才报警在脉冲中断模式中IRQ引脚将被拉低250ms报警状态位ALM将被置为1注意ALM位可以由用户复位或者通过自动复位模式来自动清除见ARST位在后备电池供电模式中通过FOBATB位可以激活或禁止报警功能有关报警的更多信息见报警寄存器介绍频率输出模式利用IRQ/F OUT引脚ISL1208可以提供频率输出信号频率输出模式可以通过利用FO位从0Hz到32kHz中选择15个可能的输出频率值来设置在后备电池供电模式中通过FOBATB位就可以激活/禁止频率输出模式通用用户SRAMISL1208为用户提供了2字节的SRAM该SRAM在后备电池供电模式下也可以工作但是必须注意I2C总线在此模式中则被禁止I2C串行接口ISL1208有一个I2C串行总线接口通过它可以访问控制与状态寄存器及用户SRAM这个I2C串行接口可以与其它使用双向数据信号SDA和时钟信号SCL的工业I2C串行总线协议兼容振荡器补偿在制造校准或有效校准中由于晶体振荡器的温度发生变化ISL1208可以进行计时校正可能出现的总补偿通常在-94ppm到+167ppm之间以下有两种补偿方式1I SL1208用模拟微调寄存器ATR调整片内独立的数字电容达到振荡器电容微调的目的可以选择的独立数字电容的范围是9pF至40.5pF基于32.758kHz这样可以算出补偿约为-34ppm 到+80ppm见模拟微调寄存器介绍2数字微调寄存器DTR寄存器可以将计时器增加或减少60ppm见数字微调寄存器介绍切换到后备电池供电模式时ISL1208还能调整晶体电容在从VDD寄存器介绍寄存器可由后备电池供电在从地址1101111x之后可以访问并且可以读或写到地址[00h13h]地址定义和默认值如表1所示地址09h未用对09h进行读或写不会虽不会影响器件的工作但也应避免寄存器访问寄存器的内容可以通过对任意寄存器地址直接以字节写或页面写操作来修改寄存器被分成4段它们是1实时时钟7字节地址为00h至06h2控制与状态5字节地址为07h至0Bh3报警6字节地址为0Ch至11h4用户SRAM2字节地址为12h至13h没有超过13h的地址只有在WRTC位地址07h的位4被置为1时才能对实时时钟RTC寄存器00h至06h进行写操作每次只能对寄存器的一段进行多字节读或写操作对另一段访问需要一次新的操作读或写可以在该段的任何地址开始可以在任何时候任何地址对寄存器进行随机读操作这将返回那个寄存器地址的内容其它的寄存器可通过进行一次连续读操作来读出对于实时时钟和报警寄存器读指令将所有时钟寄存器的内容锁存到一个缓冲器因此时钟的更新不改变被读出的时间连续读不会导致从存储器阵列中输出数据在读操作结束时主机提供一个停止条件来终止操作并释放总线在读操作之后地址保留在先前的地址+1因而用户可以执行当前地址读并继续读下一个寄存器对控制与状态报警和用户SRAM寄存器进行写入之前不必设置WRTC位表1 寄存器的存储映射图实时时钟寄存器地址[00h06h]实时时钟寄存器RTC寄存器SC MN HR DT MO YR DW这些寄存器采用BCD码表示时间其中SC秒MN分的范围为0至59HR时可以是12时或24时制DT日期为1至31MO月为1至12YR年为0至99DW星期则为0到6星期寄存器DW提供星期状态它用三位DW2至DW0来表示一周中的7天该计数值不断地作0-1-2-3-4-5-6-0-1-2的循环数字值分配到星期中的某日是任意的可以由系统软件设计者决定缺省值定义为024小时时间如果HR寄存器中的MIL位为1则RTC使用24小时格式如果MIL位为0则RTC使用12小时格式这时H21位用作AM/PM指示器H21为1则显示PM时钟缺省为12小时格式H21=0闰年闰年加一个2月29日它是由年份数能被4除尽决定的年份数能被100除尽不是闰年除非它也能被400除尽这表明2000年是闰年而2100年不是ISL1208不会将2100年校正为闰年控制与状态寄存器地址[07h到0Bh]控制与状态寄存器包括状态寄存器中断与报警寄存器模拟微调与数字微调寄存器状态寄存器SR状态寄存器在存储器映射图中地址为07h这是一个易失性寄存器它用来控制RTC失效电池模式报警触发时钟计数器写保护晶体振荡器使能以及状态位的自动复位或者提供相应的状态报告表2 状态寄存器SR*实时时钟失效位RTCF在全部电源失效后该位被置1这是一个由硬件置位在ISL1208内部的只读位在器件失去全部电源后再上电时该位置位该位的置位与先加VDD 或VBA T无关只失去其中的一个电源并不导致RTCF位被置1整个电源失效以后向RTC的第一次有效写只要写一个字节即可将RTCF位复位为0*电池供电位BAT器件进入后备电池供电模式时该位置1它可以由用户手动复位或者通过使能自动复位位来进行自动复位见ARST位对状态寄存器中的这一位进行写操作只能将其设置为0而不是1*报警位AL这几位显示报警是否与实时时钟匹配如果相匹配则相应位被置1该位可以由用户手动复位为0或者通过使能自动复位位来进行自动复位见ARST位对状态寄存器中的这一位进行写操作只能将其设置为0而不是1注意在SR读操作期间发生的一次报警将对报警位置位则该报警位将保持置位到读操作完成之后*写RTC使能位WRTCWRTC位使能或禁止对RTC定时寄存器的写入该位的出厂缺省设置值为0在初始化或上电时WRTC必须置为1以使能RTC在完成一次有效的写操作有停止条件之后RTC开始计数在一次有效的写周期期间RTC内部1Hz的信号与停止条件同步*晶体振荡器使能位XTOSCB该位使能/禁止内部晶体振荡器当XTOSCB置为1时振荡器被禁止并且X1引脚允许外部32kHz 的信号来驱动RTC上电时XTOSCB位被清零*自动复位使能位ARST该位只能对BAT和ALM状态位的自动复位进行使能/禁止当ARST位被置为1时在对相应的状态寄存器进行一次有效的读操作有有效停止条件以后这两个状态位都复位为0若ARST被清零用户必须对BAT和ALM位进行手动复位中断控制寄存器INT表3 中断控制寄存器INT*频率输出控制位FO<30>这四位使能/禁止频率输出功能并选择IRQ/F OUT引脚的输出频率频率选择见表4在频率模式被激活时它将覆盖IRQ/F OUT引脚上的报警模式引脚的频率选择表4 FOUT*频率输出与中断位FOBATB在后备电池供电模式即V BA T 电源有效中该位使能/禁止F OUT /IRQ 引脚在后备电池供电模式中若FOBATB 位置为1则F OUT /IRQ 引脚被禁止这意味着频率输出和报警输出功能都被禁止同样在该模式中若FOBATB 位被清零F OUT /IRQ 引脚则被使能*低功耗模式位LPMODE该位激活/禁止低功耗模式LPMODE=0时器件处于正常模式并且在VDD <V BA T V BA THYS 同时V DD <V TRIP 时将采用V BA T 电源LPMODE=1时器件处于低功耗模式并且在V DD <V BA T V BA THYS时将采用VBA T 电源当V DD =5V 时若采用LPMODE=1的模式将节约600nA 左右电源电流见典型性能曲线图IDD 与V CC 低功耗模式激活与禁止的关系曲线*报警使能位ALME该位使能/禁止报警功能ALME 位置为1时报警功能被使能置为0时被禁止既可以进行单事件报警也可进行周期性中断报警见IM 位注意频率输出模式被使能时报警功能被禁止*中断/报警模式位IM该位使能/禁止报警功能的中断模式IM 位置为1时报警就会在中断模式中进行此时若RTC 按照报警寄存器0Ch 至11h 中定义的一样被这次报警触发一个低电平有效宽度为250ms 的脉冲就会出现在IRQ / F OUT 引脚上在IM 位被清零时报警在标准模式中进行此时IRQ / F OUT 引脚将保持低电平直到ALM 状态位被清零IM 位中断/报警频率0由报警设置单周期定时事件1由报警设置重复/复发定时事件模拟微调寄存器ATR*模拟微调寄存器ATR<50>图11 ATR 示意图从ATR0至ATR5六个模拟微调位调整片内负载电容的值这一电容值用于RTC 的频率补偿每一位都有一个不同的电容调节比重例如使用Citizen CFS-206晶体与不同的ATR 位组合可以对额定频率补偿提供预计从34ppm 至+80ppm 的ppm 补偿范围数字的和模拟的微调结合起来可以提供-94ppm 至+140ppm 的调整范围有效的片内串联负载电容C LOAD 的范围从4.5pF 至20.25pF 中间值为12.5pF 默认C LOAD 可以通过X1和X2引脚之间两个接地的数字控制电容器C X1和C X2改变见图11CX1和C X2的值可以通过下列公式计算出来C X =16*5b +8*b4+4*b3+2*b2+1*b1+0.5*b0+9pF 有效串联负载电容由CX1和C X2组成C LOAD =)2111(1Cx Cx +C LOAD =16*5b +8*b4+4*b3+2*b2+1*b1+0.5*b0+9/2 pF例如C LOAD ATR=00000=12.5pF C LOAD ATR100000=4.5pF C LOAD ATR011111=20.25pF 串联负载电容的整个范围从4.5pF 到20.25pF 每步调节0. 25pF 注意这些都是典型值* 电池模式ATR 选择BMATR 1:0因为晶体振荡器的精度取决于V DD /V BA T 的工作所以当器件在这两个电源之间切换时ISL1208还提供电容调整的功能数字微调寄存器DTR* 数字微调寄存器DTR<20>数字微调位DTR0DTR1和DTR2调整每秒钟的平均计数值和平均ppm 误差以获取更好的精度DTR2是一个符号位DTR2=0意味着频率补偿>0DTR2=1意味着频率补偿<0DTR1和DTR0是刻度位DTR1提供40ppm 调整DTR0提供20ppm 调整用以上三位可以表示60ppm 至+60ppm 的补偿范围见表5表5 数字微调寄存器DTR 寄存器DTR2DTR1DTR0预计频率ppm 0000默认001+20010+40011+601000101-20110-40111-60报警寄存器地址[0Ch 至11h]报警寄存器字节的设置与RTC 寄存器字节相同不同的是每个字节的最高有效位可用作使能位使能=1使能位规定哪些报警寄存器秒分等可以将报警寄存器和实时寄存器之间进行比较注意没有与年对应的报警字节报警功能起着将报警寄存器与RTC 寄存器进行比较的作用当RTC 增加时一旦报警寄存器与RTC 寄存器相匹配就会触发一次报警任意一个报警寄存器多个寄存器或者所有的寄存器都可以因一次匹配而激活有两种报警模式单事件和周期性中断模式z 通过将ALME 位置1将IM 位置0同时禁止频率输出来激活单事件模式这种模式允许报警寄存器和RTC寄存器之间的一次性匹配一旦相匹配ALM位置1IRQ输出将被拉低并且保持这种状态直到ALM位复位这可以通过手动进行或者使用自动复位功能实现z通过将ALME位置1将IM位置1同时禁止频率输出来激活中断模式每当有报警产生时IRQ输出都会经受脉冲这意味着一旦设置中断模式报警每当报警与当前时间相匹配时都会进行报警这种模式对保密照相机或供需电表读数等微处理器应用中的每小时或每天的硬件中断很便利为清除一次报警可通过写操作将状态寄存器中的ALM位置0注意如果ARST位置为1地址07h位7则在状态寄存器被读取时ALM位会自动清零以下是单事件和周期性中断模式报警的实例例1以单事件中断设置报警IM=0单事件报警将在1月1日的上午11:30发生1将报警寄存器设置如下2A LME位也可以设置成xx表示其它控制位在这些寄存器被设置以后当RTC恰好达到1月1日上午11:30时秒数从59变为00后通过将状态寄存器中的ALM位置1同时将IRQ输出拉低就可以产生一次报警例2每分钟一次的脉冲中断IM=1当秒钟寄存器处于30秒时中断以1分钟为间隔1将报警寄存设置如下2将中断寄存器设置如下xx表示其它控制位一旦寄存器被设置则可以在IRQ处看到以下波形RTC和报警寄存器都为30秒注意每当报警被触发状态寄存器的ALM位就会被置位但不需要被读取或清零用户寄存器地址[12h至13h]这些寄存器针对可由后备电池供电的2字节用户存储器I2C串行接口ISL1208支持双向总线协议该协议定义向总线发送数据的任何器件为发送器而接收数据的器件为接收器控制发送的器件称为主机而被控制的器件称为从机主机总是启动数据的传送并提供用于发送和接收操作的时钟所以ISL1208在所有的应用中用作从机通过I2C接口进行的所有通信都是从数据每个字节的最高有效位开始发送接口协议在SDA线上的数据只有当SCL为低LOW时才能改变状态当SCL为高HIGH时SDA状态的改变被当作开始START和停止STOP条件见图12对ISL1208上电时SDA引脚处于输入模式所有的I2C接口操作必须由开始条件引导开始条件是当SCL为高时SDA由高到低的变化ISL1208不断地监视SDA和SCL线上的开始条件并且在该条件被满足以前不响应任何命令见图12在上电期间开始条件被忽略所有的I2C接口操作必须由停止条件来终止停止条件是当SCL为高时SDA由低到高的变化见图12在读操作结束时或者对存储器进行写操作结束时的停止条件仅仅是将器件置于待机模式应答ACK是一个用来表示数据传送成功的软件协议发送器件无论是主机或从机在发送8位后将释放SDA总线在第九个时钟周期中接收器将SDA线拉低作为对接收到8位数据的应答见图13在识别到带有有效的标识字节的开始条件后ISL1208将用一个应答来作为响应而且在成功地接收到一个地址字节以后ISL1208将再用一个应答来作为响应在接收到写操作之后的数据字节以后ISL1208将以一个应答来作为响应而主机在接收到读操作之后的数据字节以后也必须以一个应答来响应图12 有效的数据变化开始和停止条件图13 接收器发出的应答响应图14 字节写序列。
旁路电容使用和选择
简介旁路电容常见于电子设备的每个工作部分。
大多数工程师都知道要对系统、电路甚至每个芯片进行旁路。
很多时候我们选择旁路电容是根据过往的设计经验而没有针对具体电路进行优化。
本应用指南旨在对看似简单的旁路电容的设计思路进行探讨。
在分析为什么要使用旁路电容之后,我们会介绍有关电容基础知识、等效电路、电介质所用材料和电容类型。
接下来对旁路电容的主要功能和使用场合进行区分。
与仅工作在高频的电路不同,会产生大尖峰电流的电路有不同的旁路需求。
另外还会讨论一些有针对性的问题,如,运用多个旁路电容以及电路板布局的重要性。
最后,我们给出了四个具体的示例。
这四个例子涉及了高、低电流和高、低频率。
为什么要使用旁路电容非常常见(和相当令人痛心)的是用面包板搭建一个理想配置电路时,经常会遇到电路运行不稳定或者根本就不能运行的情况(见图1)。
来自电源、内部IC 电路或邻近IC 的噪声可能被耦合进电路。
连接导线和电路连接起到了天线的作用而电源电压产生变化,电流随之不稳定。
图2所示为通过示波器所观察到的电源引脚上的信号波形。
图2. 示波器所观察到的同相放大器直流电源引脚的波形我们可以看到,直流电压附近有很多高频噪音(约10mV P-P ) 。
此外,还有之前提到的幅度超出50mVr 的周期性电压脉冲。
因假定电源为稳定值(恒定为直流电压),那么任何干扰都将被直接耦合到电路并可能因此导致电路不稳定。
电源的第一道抗噪防线是旁路电容。
通过储存电荷抑制电压降并在有电压尖峰产生时放电,旁路电容消除了电源电压的波动。
旁路电容为电源建立了一个对地低阻抗通道,在很宽频率范围内都可具有上述抗噪功能。
要选择最合适的旁路电容,我们要先回答四个问题: 1、需要多大容值的旁路电容2、如何放置旁路电容以使其产生最大功效3、要使我们所设计的电路/系统要工作在最佳状态, 应选择何种类型的旁路电容?4、隐含的第四个问题----所用旁路电容采用什么样的封装最合适?(这取决于电容大小、电路板空间以及所选电容的类型。
ISL6506中文资料
*Add “-T” suffix to part number for tape and reel packaging. NOTE: Intersil Pb-free products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
Pinout
ISL6506 (SOIC) TOP VIEW
VCC 3V3AUX S3# S5# 1 2 3 4 GND 8 7 6 5 N/C 5VDLSB DLA GND
Ordering Information
PART NUMBER ISL6506CB ISL6506CBZ (Note) ISL6506ACB ISL6506ACBZ (Note) ISL6506BCB ISL6506BCBZ (Note) ISL6506BCBZA (Note) TEMP. RANGE (°C) 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 PACKAGE 8 Ld EPSOIC PKG. DWG. # M8.15C
UL标准明细大全【范本模板】
美国保险商实验所(UL)标准号标准中文名称标准英文名称摘要UL 1994—2004 低等级道路标志和照明系统(Low level path marking andlighting systems详细信息.。
UL 2085—1997 易燃和可燃液体用防护性地上贮罐(Protected abovegroundtanks for flammable andcombustible liquids详细信息.。
UL 201—1994 汽车库设备(Garage equipment 详细信息.。
.UL 6-2000 ()( Standard for Rigid MetalConduit)详细信息..。
UL 2006—1997 聚四氟乙烯1211的回收/再利用设备(Halon 1211recovery/rechargeequipment详细信息.。
.UL 1795—1999 流体按摩浴缸(Hydromassage bathtubs 详细信息。
..UL 1977—1995 数据、信号、控制和电源用元件连接器(Component connectors foruse in data,signal,controland power applications详细信息。
.UL 2127—1999 惰性气体清洁剂灭火系统标准(Standard for inert gasclean agent extinguishingsystem详细信息.。
.UL 1230—2000 业余电影灯具(Amateur movie lights 详细信息...UL60730-2—16A—2002 家用和类似用途的自动电气控制装置。
第2部分:家用和类似用途的浮动式自动电力水位控制设备的特殊要求(Automatic electricalcontrols for household andsimilar use - Part 2:Particular requirements forautomatic electrical waterlevel operating controls ofthe float type for householdand similar applications详细信息。
1202P中文资料
Document Number: 63055For any questions, contact: foil@1202Vishay Foil ResistorsBulk Metal ® Foil TechnologyPrecision Trimming Potentiometers, 1 1/4 Inch Rectilinear, RJ12 Style, Designed to Meet or Exceed The Requirements of MIL-PRF-22097, Char. FNote1.See Figures 1 and2.FEATURES•Temperature coefficient of resistance (TCR): ± 10 ppm/°C maximum 3) (- 55 °C to + 150 °C ref. at + 25 °C); through the wiper 4); ± 25 ppm/°C•Load life stability: 0.1 % typical ΔR, 0.5 %maximum ΔR under full rated power at + 85 °C for 2000 h•Settability: 0.05 % typical; 0.1 % maximum•Setting stability: 0.1 % typical; 0.5 % maximum, ΔSS •Power rating: 0.5 W at + 85 °C •Resistance range: 2 Ω to 20 k Ω•“O“-ring prevents ingress of fluids during any board cleaning operation•Electrostatic discharge: above 25 000 V •Terminal finishes available: gold platedNotes†Under full rated power of 0.5 W at + 85 °C.•Refer to page 4 for footnotes.* Pb containing terminations are not RoHS compliant, exemptions may applyTABLE 1 - MODEL SELECTION †MODELTERMINATIONSTYLE AVERAGEWEIGHT(g)POWERRATING at + 85 °C AMBIENTNO. OFTURNS1202P-In line PC pins 2.50.5 W25 ± 2Y -staggered PC pins 1)2.5L-flexible wire leads3.3LB-flexible wire leadswith bushings5.1TABLE 2 - VALUES VS. TOLERANCESSTANDARD RESISTANCE VALUES (in Ω)STANDARD TOLERANCES2, 5, 10± 10 %2), ± 20 %20, 50, 100, 200, 250, 500, 1K, 2K, 5K, 10K, 20K5 %, 10 %TABLE 3 - 1202 (RJ12) SERIES ELECTRICAL SPECIFICATIONSTemperature Coefficient of Resistance (TCR)end-to-end 3)± 10 ppm/°C maximum (- 55 °C to + 25 °C)± 10 ppm/°C maximum (+ 25 °C to + 150 °C)2 Ω, 5 Ω, 10 Ω, 20 Ωthrough the wiper 4)± 20 ppm/°C ± 25 ppm/°CStabilityload life at 2000 h †load life at 10000 h †0.1 % typical ΔR; 0.5 % maximum ΔR 0.1 % typical ΔR; 1.0 % maximum ΔR Power Rating 5)0.5 W at + 85 °CSettability 0.05 % typical; 0.1 % maximum Setting Stability0.1 % typical; 0.5 % maximum ΔSS Contact Resistance variation - CRV (noise) 3 Ω typical; 10 Ω maximum Hop-off0.25 % typical; 1.0 % maximum High-Frequency Operation Rise time Inductance Capacitanceto 100 MHz 10 ns at 1 k Ω0.08 µH typical 0.5 pF typical Operating Temperature Range- 55 °C to + 150 °CTABLE 4 - MECHANICAL SPECIFICATIONSAdjustment Turns 25 ± 2Case Material Glass fortified diallyl-phthalate (DAP); black Mechanical StopsWiper idles - no discontinuityShaft Torque 8 oz. in. maximum; 3 oz. in. typical Internal Terminations All welded - no fluxBacklash0.05 % typical1202Vishay Foil Resistors Bulk Metal® Foil Technology Precision TrimmingPotentiometers, 1 1/4 Inch Rectilinear, RJ12 Style, Designed toMeet or Exceed The Requirements of MIL-PRF-22097, Char. F Array For any questions, contact: foil@ Document Number: 63055Document Number: 63055For any questions, contact: foil@1202Bulk Metal ® Foil Technology Precision Trimming Potentiometers, 1 1/4 Inch Rectilinear, RJ12 Style, Designed to Meet or Exceed The Requirements of MIL-PRF-22097, Char. FVishay Foil Resistors1202Vishay Foil ResistorsBulk Metal ® Foil Technology Precision TrimmingPotentiometers, 1 1/4 Inch Rectilinear, RJ12 Style, Designed to Meet or Exceed The Requirements of MIL-PRF-22097, Char. F For any questions, contact: foil@Document Number: 63055Notes1.Preferred Termination style for current 1-1/4 inch rectilinear trimmers (staggered PC pins present a sturdier mounting arrangement for shock, vibration, and impact situations).2.10 W at ± 5 % available on special order.3.Maximum TCR applies to the 3 σ (sigma) limit or 99.73 % of a production lot. (Measured end-to-end with wiper off the element.)4.Measurements of TCR through the wiper are influenced more by setting stability and the percentage of the total resistance in use (at the wiper) than by fundamental resistance change due to temperature alone. The parameter shown in Table 3 is a 2 σdistribution typifying the behavior of the device when used with 40% or more of the total resistance in use.5.Derated linearly from full power at + 85 °C to zero (0) W at +150 °C. See Figure 3 in this data sheet.6.All ΔR’s are measured to the tolerance specified + 0.01 Ω.7.Whichever is greater.8.Load-Life test performed at nominal rated power, 0.5 W, at +85 °C.Special Available Options:Special markingSpecial lengths for lead wires (L, LB Style)Hooked leadsAlternate bushing and PC combinationsPower conditioning and screening operations VISHAY TRIMMERS ARE INSPECTED 100 % for:•Short-time overload (6.25 x rated power for 5 s on; and for 30 s off - 3 cycles)•Immersion•Resistance tolerance check •End resistance •Visual-mechanical•Dynamic tests for continuity, CRV By Sample for:•TCR •DWVTABLE 5 - COMPARISONMIL-PRF-22097/2 CHARACTERISTIC F 7)1202 MAXIMUM (Worst Case)TEST GROUP IVisual and mechanical Total resistanceActual effective electrical travel End resistanceContact resistance variation - CRV (noise) Dielectric withstanding voltage - DWV (atmospheric and barometric pressure) Insulation resistance Shaft torque Thermal shock No failures ± 10 %17 to 27 turns ± 2 % or 20 Ω7)± 3.0 % or 3 Ω7)Per MIL-STD-202, methods 301 and 105≥ 1000 M Ω8 oz. in. maximum± 1.0 %No failures ± 10 %25 ± 2 turns2 Ω3 Ω typical, 10 Ω maximumPer MIL-STD-202, methods 301 and 105≥ 1000 M Ω8 oz. in. maximum± 1.0 %TEST GROUP IIResistance temperature characteristic - TCR Moisture resistanceContact resistance variation - CRV (noise)± 0.01 % (± 100 ppm/°C)± 1.0 %3.0 % or 3 Ω7)± 0.001 % (± 10 ppm/°C)± 0.5 %3 Ω typical, 10 Ω maximum TEST GROUP IIIShock (specified pulse)Vibration (high-frequency)Contact resistance variation - CRV (noise)Salt spray± 1.0 %± 1.0 %± 3.0 % or 3 Ω7)No corrosion ± 0.5 %± 0.5 %3 Ω typical, 10 Ω maximumNo corrosion TEST GROUP IV Solder heatLife (1000 h at + 85 °C)8)Contact resistance variation - CRV (noise)± 1.0 %± 2.0 %± 3.0 % or 3 Ω7)± 0.05 %± 0.5 %3 Ω typical, 10 Ω maximum TEST GROUP VLow-temperature operation High-temperature exposureContact resistance variation - CRV (noise)± 1.0 %± 2.0 %± 3.0 % or 3 Ω7)± 0.5 %± 0.5 %3 Ω typical, 10 Ω maximum TEST GROUP VI Rotational lifeContact resistance variation - CRV (noise)Terminal strength ± 2.0 %± 3.0 % or 3 Ω7)2 lbs± 2.0 %3 Ω typical, 10 Ω maximum2 lbs TEST GROUP VIISolderability (excluding termination L)Immersion (excluding termination L)MIL-STD-202 method 208No continuous stream of bubblesMIL-STD-202 method 208No continuous stream of bubbles TEST GROUP VIII Fungus MIL-STD-810 method 508No mechanical damageMIL-STD-810 method 508No mechanical damageDocument Number: 63055For any questions, contact: foil@1202Bulk Metal ® Foil Technology Precision Trimming Potentiometers, 1 1/4 Inch Rectilinear, RJ12 Style, Designed to Meet or Exceed The Requirements of MIL-PRF-22097, Char. FVishay Foil Resistors Note* For non-standard requests, please contact Application Engineering.TABLE 6 - GLOBAL PART NUMBER INFORMATIONNEW GLOBAL PART NUMBER:Y5050500R000K0L (preferred part number format)DENOTES PRECISIONVALUE AER*YR = ΩK = k Ω0 = standard 1 - 999 = customPRODUCT CODE TOLERANCE PACKAGING 5050 = 1202L 0050 = 1202LB 0051 = 1202P 6050 = 1202PB 5051 = 1202Y 7050 = 1202YBJ = ± 5 %K = ± 10 %M = ± 20 %L = bulk packFOR EXAMPLE: ABOVE GLOBAL ORDER Y5050 500R000 K 0 L:TYPE: 1202L VALUE: 500.0 ΩABSOLUTE TOLERANCE: ± 10.0 %AER: standardPACKAGING: bulk packHISTORICAL PART NUMBER:1202L 500R00 K B (will continue to be used)1202L 500R00K B MODEL RESISTANCE VALUETOLERANCE PACKAGING 1202L 1202LB 1202P 1202PB 1202Y 1202YB500.0 ΩJ = ± 5 %K = ± 10 %M = ± 20 %B = bulk pack05050R 00Y 5K 00LDisclaimer Legal Disclaimer NoticeVishayAll product specifications and data are subject to change without notice.Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product.Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed therein, which apply to these products.No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay.The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications.Product names and markings noted herein may be trademarks of their respective owners.元器件交易网Document Number: 。
ISL6506ACB中文资料
Cg (OPTIONAL)
5VDUAL
Q2
Q3
9
3V3DUAL
2
元器件交易网
ISL6506, ISL6506A, ISL6506B
Absolute Maximum Ratings
Supply Voltage, V5VSB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +7.0V DLA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . GND - 0.3V to +14.5V All Other Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .+ 7.0V ESD Classification (Human Body Model) . . . . . . . . . . . . . . . . . TBD
Features
• Provides 2 ACPI-Controlled Voltages - 5VDUAL USB/Keyboard/Mouse - 3.3VDUAL/3.3VSB PCI/Auxiliary/LAN • Excellent 3.3VDUAL Regulation in S3/S4/S5 - ±2.0% over temperature - 1A Capability on ISL6506 and ISL6506A - 2A Capability on ISL6506B • Small Size; Very Low External Component Count • Over-Temperature Shutdown • Pb-Free Available (RoHS Compliant)
ISL6620IRZ资料
ISL6620, ISL6620A
Ordering Information
PART NUMBER (Note)
PART MARKING
TEMP. RANGE (°C)
PACKAGE (Pb-free)
PKG. DWG. #
ISL6620CBZ*
6620 CBZ
0 to +70
8 Ld SOIC
M8.15
• High Frequency and High Efficiency VRM and VRD
Related Literature
• Technical Brief TB363 “Guidelines for Handling and Processing Moisture Sensitive Surface Mount Devices (SMDs)”
To further enhance light load efficiency, ISL6620, ISL6620A enables diode emulation operation during PSI mode. This allows Discontinuous Conduction Mode (DCM) by detecting when the inductor current reaches zero and subsequently turning off the low side MOSFET to prevent it from sinking current.
ISL6620CRZ*
620Z
0 to +70
10 Ld 3x3 DFN
L10.3x3
ISL6620IBZ*
6620 IBZ
ISL12022MAIBZ;中文规格书,Datasheet资料
Low Power RTC with Battery Backed SRAM, Integrated ±5ppm Temperature Compensation and Auto Daylight SavingISL12022MAThe ISL12022MA device is a low power real time clock (RTC) with an embedded temperature sensor and crystal. Device functions include oscillator compensation, clock/calendar, power fail and low battery monitors, brownout indicator,one-time, periodic or polled alarms, intelligent battery backup switching, Battery Reseal™ function and 128 bytes ofbattery-backed user SRAM. Backup battery current draw is less than 1.6µA over the temperature range. The device is offered in a 20Ld SOIC module that contains the RTC and an embedded 32.768kHz quartz crystal. The calibrated oscillator provides less than ±5ppm drift over the full -40°C to +85°C temperature range.The RTC tracks time with separate registers for hours, minutes, and seconds. The calendar registers track date, month, year and day of the week and are accurate through 2099, with automatic leap year correction.Daylight Savings time adjustment is done automatically, using parameters entered by the user. Power fail and battery monitors offer user-selectable trip levels. The time stamp function records the time and date of switchover from V DD to V BAT power, and also from V BAT to V DD power.The ISL12022MA features enhanced immunity to ESD per the IEC61000-4-2 standard, and also provides improved resistance to system leakage related to environmental moisture.Related Literature•See TB484 “ISL12022MA Enhanced RTC Module”•See AN1549 “Addressing Power Issues in Real Time Clock Applications”Features•Embedded 32.768kHz Quartz Crystal in the Package •20 Ld SOIC Package (for DFN version, refer to the ISL12020M)•Calendar•On-chip Oscillator Temperature Compensation •10-bit Digital Temperature Sensor Output •15 Selectable Frequency Outputs•Interrupt for Alarm or 15 Selectable Frequency Outputs •Automatic Backup to Battery or Supercapacitor •V DD and Battery Status Monitors•Battery Reseal™ Function to Extend Battery Shelf Life •Power Status Brownout Monitor •Time Stamp for Battery Switchover •128 Bytes Battery-Backed User SRAM •1.6µA Max Battery Current •I 2C Bus™•RoHS CompliantApplications•Utility Meters •POS Equipment •Printers and Copiers •Digital CamerasFIGURE 1.TYPICAL APPLICATION CIRCUITGND GND GND NC GND GND GND NC NC NC NC NC V BAT V DD GNDIRQ/F OUTNCNCSCL SDA ISL12022MA1234567891020191817161514131211SCHOTTKY DIODEBAT54BATTERY 3.0V3.3V C20.1µFC10.1µFR110k R210k R310kVDO SCLSDA GNDMCUINTERFACE IRQ/F OUTBlock DiagramPin ConfigurationISL12022MA (20 LD SOIC)TOP VIEWI 2CINTERFACECONTROL LOGIC ALARMFREQUENCYOUTRTC DIVIDERSDA BUFFER CRYSTAL OSCILLATORPORSWITCH SCL BUFFERSDA SCLV DDV BAT INTERNAL SUPPLYV TRIPSECONDSMINUTES HOURS DAY OF WEEKDATE MONTHYEARUSER SRAMCONTROL REGISTERS GNDREGISTERSTEMPERATURESENSORFREQUENCY CONTROLIRQ/F OUT+-GND NC NC GND NC NC1 234567891020 19 18 17 16 15 14 13 12 11GND NC NC V DD GND GND NC V BAT GND GND NC IRQ/F OUT SCL SDAPin DescriptionsPIN NUMBER SYMBOL DESCRIPTION4, 5, 6, 9, 10, 15, 16, 17NC No Connection . Do not connect to a signal or supply voltage.7V BATBackup Supply . This input provides a backup supply voltage to the device. VBAT supplies power to the device in the event that the VDD supply fails. This pin can be connected to a battery, a supercapacitor or tied to ground if not used. See the Battery Monitor parameter in the “” table on page 6. This pin should be tied to ground if not used.11SDASerial Data . SDA is a bi-directional pin used to transfer data into and out of the device. It has an open drain output and may be OR’ed with other open drain or open collector outputs. The input buffer is always active (not gated) in normal mode.An open drain output requires the use of a pull-up resistor. The output circuitry controls the fall time of the output signal with the use of a slope controlled pull-down. The circuit is designed for 400kHz I 2C interface speeds. It is disabled when the backup power supply on the VBAT pin is activated.12SCLSerial Clock . The SCL input is used to clock all serial data into and out of the device. The input buffer on this pin is always active (not gated). It is disabled when the backup power supply on the VBAT pin is activated to minimize power consumption.13IRQ/F OUT Interrupt Output/Frequency Output (Default 32.768kHz frequency output).This dual function pin can be used as an interrupt or frequency output pin. The IRQ/F OUT mode is selected via the frequency out control bits of the control/statusregister. Interrupt Mode. The pin provides an interrupt signal output. This signal notifies a host processor that an alarmhas occurred and requests action. It is an open drain active low output. Frequency Output Mode. The pin outputs a clocksignal, which is related to the crystal frequency. The frequency output is user selectable and enabled via the I2C bus. Itis an open drain output. The output is open drain and requires a pull-up resistor.14V DD Power Supply. Chip power supply and ground pins. The device will operate with a power supply from V DD = 2.7V to5.5VDC. A 0.1µF capacitor is recommended on the VDD pin to ground.1, 2, 3, 8, 18, 19, 20GND Ground Pin.Pin Descriptions (Continued)PIN NUMBER SYMBOL DESCRIPTION Ordering InformationPART NUMBER (Notes 2, 3)PARTMARKINGV DD RANGE(V)TEMP RANGE(°C)PACKAGE(RoHS Compliant)PKG.DWG. #ISL12022MAIBZ ISL12022MAIBZ 2.7 to 5.5-40 to +8520 Ld SOIC M20.3ISL12022MAIBZ-T (Note 1)ISL12022MAIBZ 2.7 to 5.5-40 to +8520 Ld SOIC (Tape and Reel)M20.31.Please refer to TB347 for details on reel specifications.2.These Intersil plastic packaged products employ special material sets, molding compounds and 100% matte tin plate plus anneal (e3) terminationfinish. These products do contain Pb but they are RoHS compliant by exemption 7 (Pb in high melting temperature type solders, electronic ceramic parts (e.g. piezoelectronic devices)) and exemption 5 (Pb in glass of electronic components). These Intersil RoHS compliant products are compatible with both SnPb and Pb free soldering operations. These Intersil RoHS compliant products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.3.For Moisture Sensitivity Level (MSL), please see device information page for ISL12022MA. For more information on MSL please see Tech BriefTB363.Table of ContentsBlock Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pin Configuration. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2Pin Descriptions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Ordering Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3 Absolute Maximum Ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6Thermal Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6DC Operating Characteristics RTC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6Power-Down Timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7I2C Interface Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7SDA vs SCL Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Symbol Table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Typical Performance Curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Power Control Operation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Normal Mode (V DD) to BatteryBackup Mode (V BAT). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Battery Backup Mode (V BAT) toNormal Mode (V DD). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Power Failure Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Brownout Detection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Battery Level Monitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12Real Time Clock Operation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Single Event and Interrupt . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Frequency Output Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 General Purpose User SRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 I2C Serial Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Oscillator Compensation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13Register Descriptions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Real Time Clock Registers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Addresses [00h to 06h] . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15Control and Status Registers (CSR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Addresses [07h to 0Fh]. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Power Supply Control Register (PWR_VDD). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Battery Voltage Trip Voltage Register(PWR_VBAT). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Initial AT and DT Setting Register (ITRO) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 ALPHA Register (ALPHA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 BETA Register (BETA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Final Analog Trimming Register (FATR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Final Digital Trimming Register (FDTR). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 ALARM Registers (10h to 15h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Time Stamp VDD to Battery Registers (TSV2B). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Time Stamp Battery to VDD Registers (TSB2V). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 DST Control Registers (DSTCR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 TEMP Registers (TEMP). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 NPPM Registers (NPPM). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 XT0 Registers (XT0). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24ALPHA Hot Register (ALPHAH). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 User Registers (Accessed by Using Slave Address 1010111x). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Addresses [00h to 7Fh]. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 I2C Serial Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Protocol Conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Device Addressing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Write Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Read Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Application Section. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Power Supply Considerations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Battery Backup Details. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Layout Considerations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Measuring Oscillator Accuracy. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 Temperature Compensation Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 Daylight Savings Time (DST) Example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 Device Handling Precautions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 Products . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 Package Outline Drawing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31Absolute Maximum Ratings Thermal InformationVoltage on V DD, V BAT and IRQ/F OUT pins(Respect to Ground). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 6.0V Voltage on SCL and SDA pins(Respect to Ground). . . . . . . . . . . . . . . . . . . . . . . . . . .-0.3V to V DD+0.3V ESD RatingHuman Body Model (Per JESD22-A114F) . . . . . . . . . . . . . . . . . . . . . . >3kV Machine Model (Per JESD22-A115B) . . . . . . . . . . . . . . . . . . . . . . . .>300V Charge Device Model (Per JESD22-C101D) . . . . . . . . . . . . . . . . . . . .2.2kV Latch Up (Tested per JESD-78B; Class 2, Level A) . . . . . . . . . . . . . . 100mA Shock Resistance. . . . . . . . . . . . . . . . . . . . . . . . . . .5000g, 0.3ms, 1/2 sine Vibration (Ultrasound cleaning not advised). . . . . . . . . . .20g/10-2000Hz,Thermal Resistance (Typical)θJA (°C/W)θJC (°C/W) 20 Lead SOIC (Notes 4, 5). . . . . . . . . . . . . . 7035 Storage Temperature. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to +85°C Pb-Free Reflow Profile (Note 6). . . . . . . . . . . . . . . . . . . . . . . . see link below /pbfree/Pb-FreeReflow.aspCAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and result in failures not covered by warranty.NOTES:4.θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.5.For θJC, the “case temp” location is on top of the package and measured in the center of the package between pins 6 and 15.6.The ISL12022MA Oscillator Initial Accuracy can change after solder reflow attachment. The amount of change will depend on the reflow temperatureand length of exposure. A general rule is to use only one reflow cycle and keep the temperature and time as short as possible. Changes on the order of ±1ppm to ±3ppm can be expected with typical reflow profiles.DC Operating Characteristics RTC Test Conditions: VDD = +2.7 to +5.5V, TA = -40°C to +85°C, unless otherwise stated. Boldface limits apply over the operating temperature range, -40°C to +85°C.SYMBOL PARAMETER CONDITIONSMIN(Note 7)TYP(Note 8)MAX(Note 7)UNITS NOTESV DD Main Power Supply(Note 15) 2.7 5.5VV BAT Battery Supply Voltage(Note 15) 1.8 5.5V9I DD1Supply Current. (I2C Not Active,Temperature Conversion Not Active, F OUTNot Active)V DD = 5V 4.115µA10, 11 V DD = 3V 3.514µA10, 11I DD2Supply Current. (I2C Active, TemperatureConversion Not Active, F out Not Active)V DD = 5V200500µA10, 11I DD3Supply Current. (I2C Not Active,Temperature Conversion Active, F OUT NotActive)V DD = 5V120400µA10, 11I BAT Battery Supply Current V DD = 0V, V BAT = 3V, T A=+25°C 1.0 1.6µA10V DD = 0V, V BAT = 3V 1.0 5.0µA10 I BATLKG Battery Input Leakage V DD = 5.5V, V BAT = 1.8V100nAI LI Input Leakage Current on SCL V IL = 0V, V IH = V DD-1.0±0.1 1.0µAI LO I/O Leakage Current on SDA V IL = 0V, V IH = V DD-1.0±0.1 1.0µAV BATM Battery Level Monitor Threshold-100+100mVV PBM Brownout Level Monitor Threshold-100+100mVV TRIP V BAT Mode Threshold(Note 15) 2.0 2.2 2.4VV TRIPHYS V TRIP Hysteresis30mV13 V BATHYS V BAT Hysteresis50mV13OSCILLATOR ACCURACYΔFout I Oscillator Initial AccuracyV DD = 3.3V -2+8ppm 6, 17ΔFout R Oscillator Accuracy after Reflow Cycle V DD = 3.3V ±5ppm 6, 17ΔFout T Oscillator Stability vs Temperature V DD = 3.3V ±2ppm 6, 18ΔFout V Oscillator Stability vs Voltage 2.7V ≤ V DD ≤ 5.5V -3+3ppm 19TempTemperature Sensor AccuracyV DD = V BAT = 3.3V±2°C13IRQ/F OUT (OPEN DRAIN OUTPUT)V OLOutput Low VoltageV DD = 5V, I OL = 3mA 0.4V V DD = 2.7V, I OL = 1mA0.4VDC Operating Characteristics RTCTest Conditions: VDD = +2.7 to +5.5V, TA = -40°C to +85°C, unless otherwise stated. Boldfacelimits apply over the operating temperature range, -40°C to +85°C. (Continued)SYMBOLPARAMETERCONDITIONSMIN (Note 7)TYP (Note 8)MAX (Note 7)UNITSNOTESPower-Down TimingTest Conditions: VDD = +2.7 to +5.5V, Temperature = -40°C to +85°C, unless otherwise stated. Boldface limits applyover the operating temperature range, -40°C to +85°C.SYMBOL PARAMETERCONDITIONSMIN (Note 7)TYP (Note 8)MAX (Note 7)UNITS NOTES V DDSR-V DD Negative Slew Rate10V/ms 12V DDSR+V DD Positive Slew Rate, minimum0.05V/ms16I 2C Interface SpecificationsTest Conditions: V DD = +2.7 to +5.5V, Temperature = -40°C to +85°C, unless otherwise specified. Boldfacelimits apply over the operating temperature range, -40°C to +85°C.SYMBOL PARAMETERTEST CONDITIONSMIN (Note 7)TYP (Note 8)MAX (Note 7)UNITS NOTESV IL SDA and SCL Input Buffer LOW Voltage-0.30.3 x V DD V V IH SDA and SCL Input Buffer HIGH Voltage0.7 x V DDV DD + 0.3V Hysteresis SDA and SCL Input Buffer Hysteresis0.05 x V DD V 13, 14V OL SDA Output Buffer LOW Voltage, Sinking 3mA V DD = 5V, I OL = 3mA 00.020.4V C PINSDA and SCL Pin Capacitance T A = +25°C, f = 1MHz, V DD = 5V, V IN =0V, V OUT = 0V10pF13, 14f SCL SCL Frequency400kHz t INPulse Width Suppression Time at SDA and SCL InputsAny pulse narrower than the max spec is suppressed.50nst AASCL Falling Edge to SDA Output Data ValidSCL falling edge crossing 30% of V DD , until SDA exits the 30% to 70% of V DD window.900nst BUFTime the Bus Must be Free Before the Start of a New Transmission SDA crossing 70% of V DD during a STOP condition, to SDA crossing 70% of V DD during the following START condition.1300nst LOW Clock LOW Time Measured at the 30% of V DD crossing.1300ns t HIGHClock HIGH TimeMeasured at the 70% of V DD crossing.600nst SU:STA START Condition Setup TimeSCL rising edge to SDA falling edge. Both crossing 70% of V DD .600ns t HD:STASTART Condition Hold TimeFrom SDA falling edge crossing 30% of V DD to SCL falling edge crossing 70% of V DD .600nst SU:DATInput Data Setup TimeFrom SDA exiting the 30% to 70% of V DD window, to SCL rising edge crossing 30% of V DD.100nst HD:DATInput Data Hold Time From SCL falling edge crossing 30% of V DD to SDA entering the 30% to 70% of V DD window.20900nst SU:STOSTOP Condition Setup TimeFrom SCL rising edge crossing 70% of V DD , to SDA rising edge crossing 30% of V DD .600nst HD:STO STOP Condition Hold Time From SDA rising edge to SCL falling edge.Both crossing 70% of V DD .600ns t DHOutput Data Hold TimeFrom SCL falling edge crossing 30% of V DD , until SDA enters the 30% to 70% of V DD window.nst R SDA and SCL Rise Time From 30% to 70% of V DD.20 +0.1 x Cb 300ns 13, 14t F SDA and SCL Fall TimeFrom 70% to 30% of V DD.20 +0.1 x Cb300ns 13, 14Cb Capacitive Loading of SDA or SCLTotal on-chip and off-chip 10400pF 13, 14R PUSDA and SCL Bus Pull-up Resistor Off-chipMaximum is determined by t R and t F .For Cb = 400pF, max is about 2k Ω~2.5k Ω.For Cb = 40pF, max is about 15k Ω~20k Ω1k Ω13, 14NOTES:7.Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established by characterization and are not production tested.8.Specified at +25°C.9.Temperature Conversion is inactive below V BAT = 2.7V. Device operation is not guaranteed at V BAT <1.8V.10.IRQ/F OUT inactive.11.V DD > V BAT +V BATHYS12.In order to ensure proper timekeeping, the V DD SR- specification must be followed.13.Limits should be considered typical and are not production tested.14.These are I 2C specific parameters and are not tested, however, they are used to set conditions for testing devices to validate specification.15.Minimum V DD and/or V BAT of 1V to sustain the SRAM. The value is based on characterization and it is not tested.16.To avoid EEPROM recall issues, it is advised to use this minimum power up slew rate. Not tested, shown as typical only.17.Defined as the deviation from a target oscillator frequency of 32,768.0Hz at room temperature.18.Defined as the deviation from the room temperature measured 1Hz frequency, V DD = 3.3V, at T A = -40°C to +85°C.19.Defined as the deviation at room temperature from the measured 1Hz frequency (or equivalent) at V DD = 3.3, over the range of V DD = 2.7V toV DD =5.5V.I 2C Interface SpecificationsTest Conditions: V DD = +2.7 to +5.5V, Temperature = -40°C to +85°C, unless otherwise specified. Boldfacelimits apply over the operating temperature range, -40°C to +85°C. (Continued)SYMBOL PARAMETERTEST CONDITIONSMIN (Note 7)TYP (Note 8)MAX (Note 7)UNITS NOTES。
旁路电容使用和选择
简介旁路电容常见于电子设备的每个工作部分。
大多数工程师都知道要对系统、电路甚至每个芯片进行旁路。
很多时候我们选择旁路电容是根据过往的设计经验而没有针对具体电路进行优化。
本应用指南旨在对看似简单的旁路电容的设计思路进行探讨。
在分析为什么要使用旁路电容之后,我们会介绍有关电容基础知识、等效电路、电介质所用材料和电容类型。
接下来对旁路电容的主要功能和使用场合进行区分。
与仅工作在高频的电路不同,会产生大尖峰电流的电路有不同的旁路需求。
另外还会讨论一些有针对性的问题,如,运用多个旁路电容以及电路板布局的重要性。
最后,我们给出了四个具体的示例。
这四个例子涉及了高、低电流和高、低频率。
为什么要使用旁路电容非常常见(和相当令人痛心)的是用面包板搭建一个理想配置电路时,经常会遇到电路运行不稳定或者根本就不能运行的情况(见图1)。
来自电源、内部IC 电路或邻近IC 的噪声可能被耦合进电路。
连接导线和电路连接起到了天线的作用而电源电压产生变化,电流随之不稳定。
图2所示为通过示波器所观察到的电源引脚上的信号波形。
图2. 示波器所观察到的同相放大器直流电源引脚的波形我们可以看到,直流电压附近有很多高频噪音(约10mV P-P ) 。
此外,还有之前提到的幅度超出50mVr 的周期性电压脉冲。
因假定电源为稳定值(恒定为直流电压),那么任何干扰都将被直接耦合到电路并可能因此导致电路不稳定。
电源的第一道抗噪防线是旁路电容。
通过储存电荷抑制电压降并在有电压尖峰产生时放电,旁路电容消除了电源电压的波动。
旁路电容为电源建立了一个对地低阻抗通道,在很宽频率范围内都可具有上述抗噪功能。
要选择最合适的旁路电容,我们要先回答四个问题: 1、需要多大容值的旁路电容2、如何放置旁路电容以使其产生最大功效3、要使我们所设计的电路/系统要工作在最佳状态, 应选择何种类型的旁路电容?4、隐含的第四个问题----所用旁路电容采用什么样的封装最合适?(这取决于电容大小、电路板空间以及所选电容的类型。
ILSB-1206中文资料
Monolithic Chip Inductors For technical questions, contact: magnetics@Document Number: 34029ILSB-1206Vishay DaleFEATURES•High reliability•Surface mountable•Magnetically self shielded•Nickel barrier plating virtually eliminates silver migration•100 % lead (Pb)-free and RoHS compliantMECHANICAL SPECIFICATIONSSolderability: 90 % coverage after 5 second dip in 235 °C solder following 60 second preheat at 120 °C to 150 °C and type R flux dipResistance To Solder Heat: 10 seconds in 260 °C solder after preheat and flux per above Termination: 100 % SnTerminal Strength: 0.1 kg for 30 seconds Beam Strength: 2.5 kgENVIRONMENTAL SPECIFICATIONSOperating Temperature: - 55 °C to + 125 °C Thermal Shock: - 40 °C to + 85 °CHumidity: 90 % RH at 40 °C, 1000 hours at full rated current Load Life: 85 °C for 1000 hours full rated currentSTANDARD ELECTRICAL SPECIFICATIONSINDUCTANCE (µH) ± 10 % TOLERANCETHICKNESS “D” Inches [mm] Q (Min.) TESTFREQUENCYL & Q (MHz)MIN.SELF- RESONANT FREQUENCY(MHz)MAXIMUMDCR (Ohms) RATED DC CURRENT (mA) 0.047 0.068 0.10 0.12 0.15 0.18 0.22 0.27 0.33 0.39 0.47 0.56 0.68 0.82 1.0 1.2 1.5 1.82.2 2.73.3 3.94.75.66.8 8.2 10.0 12.0 15.0 18.0 22.0 27.0 33.0± 20 % ± 20 % ± 10 % ± 10 % ± 10 % ± 10 % ± 10 % ± 10 % ± 10 % ± 10 % ± 10 % ± 10 % ± 10 % ± 10 % ± 10 % ± 10 % ± 10 % ± 10 % ± 10 % ± 10 % ± 10 % ± 10 % ± 10 % ± 10 % ± 10 % ± 10 % ± 10 % ± 10 % ± 10 % ± 10 % ± 10 % ± 10 % ± 10 %0.043 ± 0.012 [1.10 ± 0.3] 0.043 ± 0.012 [1.10 ± 0.3] 0.043 ± 0.012 [1.10 ± 0.3] 0.043 ± 0.012 [1.10 ± 0.3] 0.043 ± 0.012 [1.10 ± 0.3] 0.043 ± 0.012 [1.10 ± 0.3] 0.043 ± 0.012 [1.10 ± 0.3] 0.043 ± 0.012 [1.10 ± 0.3] 0.043 ± 0.012 [1.10 ± 0.3] 0.043 ± 0.012 [1.10 ± 0.3] 0.043 ± 0.012 [1.10 ± 0.3] 0.043 ± 0.012 [1.10 ± 0.3] 0.043 ± 0.012 [1.10 ± 0.3] 0.043 ± 0.012 [1.10 ± 0.3] 0.043 ± 0.012 [1.10 ± 0.3] 0.043 ± 0.012 [1.10 ± 0.3] 0.043 ± 0.012 [1.10 ± 0.3] 0.043 ± 0.012 [1.10 ± 0.3] 0.043 ± 0.012 [1.10 ± 0.3] 0.043 ± 0.012 [1.10 ± 0.3] 0.043 ± 0.012 [1.10 ± 0.3] 0.043 ± 0.012 [1.10 ± 0.3] 0.043 ± 0.012 [1.10 ± 0.3] 0.043 ± 0.012 [1.10 ± 0.3] 0.043 ± 0.012 [1.10 ± 0.3] 0.043 ± 0.012 [1.10 ± 0.3] 0.043 ± 0.012 [1.10 ± 0.3] 0.043 ± 0.012 [1.10 ± 0.3] 0.043 ± 0.012 [1.10 ± 0.3] 0.043 ± 0.012 [1.10 ± 0.3] 0.043 ± 0.012 [1.10 ± 0.3] 0.043 ± 0.012 [1.10 ± 0.3] 0.043 ± 0.012 [1.10 ± 0.3]20 20 20 20 20 20 20 20 20 25 25 25 25 25 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 35 35 3550 50 25 25 25 25 25 25 25 25 25 25 25 25 10 10 10 10 10 10 10 10 104 442211111368322 271 253 230 213 196 173 167 156 144 133 121 115 87 75 69 64 58 52 48 44 41 37 34 30 28 26 22 21 19 17 150.15 0.25 0.25 0.30 0.30 0.40 0.40 0.50 0.60 0.50 0.60 0.70 0.80 0.90 0.40 0.50 0.50 0.50 0.50 0.60 0.70 0.80 0.90 0.70 0.80 0.90 1.00 1.05 0.70 0.70 0.90 0.90 1.05300 300 250 250 250 250 250 250 250 200 200 150 150 150 100 100 50 50 50 50 50 50 50 25 25 25 25 15 5 5 5 5 5ILSB-1206Monolithic Chip InductorsVishay DaleDocument Number: 34029For technical questions, contact: magnetics@Disclaimer Legal Disclaimer NoticeVishayAll product specifications and data are subject to change without notice.Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product.Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed therein, which apply to these products.No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay.The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications.Product names and markings noted herein may be trademarks of their respective owners.元器件交易网Document Number: 。
欧洲合金标准目录
欧洲合金标准目录国家国家标准化组织网站欧洲合金标准目录编号中文名称英文名称CR 10316-2001 低合金钢的光辐射分析(常规法)发射光谱法的标准常规法制定指南Optical emission analysis of low alloy steels (routine method) - Guidelines for the preparation of standardroutine method for optical emission spectrometryCR 12471-2002 镍从直接和长期接触皮肤的物品的合金和镀层中释放的屏蔽试验Screening tests for nickel release from alloys and coatings in items that come into direct and prolonged contact withthe skinCR 12776-1997 铜和铜合金材料号分配和材料登记的规定和程序Copper and copper alloys - Provisions and procedures for the allocation of material numbers and registration of materialsCR 13388-1998 铜和铜合金组分和产品一览表Copper and copper alloys - Compendium of compositions and productsEN 10016-1-1994 拉制和/或冷轧用非合金钢棒第1部分:一般要求Non-alloy steel rod for drawing and/or cold rolling - Part 1: General requirementsEN 10016-2-1994 拉制和/或冷轧用非合金钢棒第2部分:一般用钢棒的特殊要求Non-alloy steel rod for drawing and/or cold rolling - Part 2: Specific requirements for general purposes rod EN 10016-3-1994 拉制和/或冷轧用非合金钢棒第3部分:沸腾和沸腾代用低碳钢棒的特殊要求Non-alloy steel rod for drawing and/or cold rolling - Part 3: Specific requirements for rimmed andrimmed substitute low carbon steel rodEN 10016-4-1994 拉制和/或冷轧用非合金钢棒第4部分:专用棒材的特殊要求Non-alloy steel rod for drawing and/or cold rolling - Part 4: Specific requirements for rod for specialapplicationsEN 10025-1993 热轧非合金结构钢制品交货技术条件Hot rolled products of non-alloy structural steels;technical delivery conditions (includes amendment A1:1993)EN 10028-2-2003 压力用途的钢板制品第2部分:具有规定的耐高温性能的非合金钢和合金钢Flat products made of steels for pressure purposes - Part 2: Non-alloy and alloy steels withspecified elevated temperature propertiesEN 10028-4-2003 压力用途的钢板制品第4部分:具有低温特性的镍合金钢Flat products made of steels for pressure purposes - Part 4: Nickel alloy steels with specified low temperaturepropertiesEN 10051-1997+A1-1997 非合金钢和合金钢连续热轧钢板材、薄板和带材规范尺寸和形状公差Continuously hot-rolled uncoated plate, sheet and strip of non-alloy and alloy steels -Tolerances on dimensions and shape (includes amendment A1:1997)EN 10083-2-1996+A1-1996 淬火钢和回火钢第2部分:非合金级钢交货技术条件Quenched and tempered steels - Part 2: Technical delivery conditions for unalloyed quality steels(includes Amendment A1:1996)EN 10090-1998 内燃机阀门用钢和合金Valve steels and alloys for internal combustion enginesEN 10095-1999 耐热钢和镍合金Heat resisting steels and nickel alloysEN 1011-4-2000 焊接金属材料焊接的推荐规范第4部分:铝和铝合金的电弧焊接Welding -Recommendations for welding of metallic materials - Part 4: Arc welding of aluminiumand aluminium alloysEN 10126-1995 半成品交货的冷轧非合金钢电工钢薄板和钢带Cold rolled electricalnon-alloyed steel sheet and strip delivered in the semi-processed stateEN 10165-1995 半成品交货的冷轧电工合金钢制薄板和带材Cold rolled electrical alloyedsteel sheet and strip delivered in the semi-processed stateEN 10210-1-1994 非合金及细晶粒结构钢的热轧结构空心型材交货技术条件Hot finished structural hollow sections of non-alloy and fine grain structural steels; part 1: technical deliveryrequirementsEN 10210-2-1997 非合金及细晶粒结构钢的热轧结构空心型材第2部分:公差、尺寸和截面特性Hot finished structural hollow sections of non-alloy and fine grain structural steels - Part 2:Tolerances, dimensions and sectional propertiesEN 10216-1-2002 压力用途的无缝钢管交货技术条件第1部分:有规定室温特性的非合金钢管Seamless steel tubes for pressure purposes - Technical delivery conditions - Part1: Non-alloy steel tubes with specified room temperature properties / Note: To beamended by EN 10216-1/prA1 (2003-07).EN 10216-2-2002 压力用途的无缝钢管交货技术条件第2部分:有规定高温特性的非合金及合金钢管Seamless steel tubes for pressure purposes - Technical delivery conditions - Part 2:Non-alloy and alloy steel tubes with specified elevated temperature properties / Note:To be amended by EN 10216-2/prA1 (2003-07).EN 10216-3-2002 压力用途的无缝钢管交货技术条件第3部分:合金细晶粒钢管Seamless steel tubes for pressure purposes - Technical delivery conditions - Part 3: Alloy fine grain steel tubes /Note: To be amended by EN 10216-3/prA1 (2003-07).EN 10216-4-2002 压力用途的无缝钢管交货技术条件第4部分:有规定低温特性的非合金及合金钢管Seamless steel tubes for pressure purposes - Technical delivery conditions -Part 4: Non-alloy and alloy steel tubes with specified low temperature properties /Note: To be amended by EN 10216-4/prA1 (2003-07).EN 10217-1-2002 压力用途的焊接钢管交货技术条件第1部分:有规定室温特性的非合金钢管Welded steel tubes for pressure purposes - Technical delivery conditions - Part1: Non-alloy steel tubes with specified room temperature propertiesEN 10217-2-2002 压力用途的焊接钢管交货技术条件第2部分:有规定高温特性的电焊非合金及合金钢管Welded steel tubes for pressure purposes - Technical delivery conditions -Part 2: Electric welded non-alloy and alloy steel tubes with specified elevatedtemperature propertiesEN 10217-3-2002 压力用途的焊接钢管交货技术条件第3部分:合金细晶粒钢管Welded steel tubes for pressure purposes - Technical delivery conditions - Part 3: Alloy fine grain steel tubesEN 10217-4-2002 压力用途的焊接钢管交货技术条件第4部分:有规定低温特性的电焊非合金钢管Welded steel tubes for pressure purposes - Technical delivery conditions - Part4: Electric welded non-alloy steel tubes with specified low temperature propertiesEN 10217-5-2002 压力用途的焊接钢管交货技术条件第5部分:有规定高温特性的埋弧焊非合金及合金钢管Welded steel tubes for pressure purposes - Technical delivery conditions –Part 5: Submerged arc welded non-alloy and alloy steel tubes with specified elevatedtemperature propertiesEN 10217-6-2002 压力用途的焊接钢管交货技术条件第6部分:有规定低温特性的埋弧焊非合金钢管Welded steel tubes for pressure purposes - Technical delivery conditions - Part6: Submerged arc welded non-alloy steel tubes with specified low temperature propertiesEN 10219-1-1997 冷成型细晶粒钢和非合金钢的焊接结构空心型材第1部分:交货技术要求Cold formed welded structural hollow sections of non-alloy and fine grain steels - Part1: Technical delivery requirementsEN 10219-2-1997 冷成型细晶粒钢和非合金钢的焊接结构空心型材第2部分:公差、尺寸和截面特性Cold formed welded structural hollow sections of non-alloy and fine grain steels- Part 2: Tolerances, dimensions and sectional propertiesEN 10223-1-1997 栅栏用钢丝和钢丝制品第1部分:镀锌和镀锌合金的有刺钢丝Steel wire and wire products for fences - Part 1: Zinc and zinc-alloy coated steel barbed wireEN 10224-2002 输送液体(包括人类生活用水)用的非合金钢管和管件交货技术条件Non-alloy steel tubes and fittings for the conveyance of aqueous liquids including water for humanconsumption - Technical delivery conditionsEN 10244-2-2001 钢丝和钢丝制品钢丝上的非黑色金属外层第2部分:锌或锌合金镀层Steel wire and wire products - Non-ferrous metallic coatings on steel wire - Part 2: Zinc or zinc alloycoatingsEN 10248-1-1995 非合金钢制热轧板堆第1部分:交货技术条件Hot rolled sheet piling of non alloy steels - Part 1: Technical delivery conditionsEN 10248-2-1995 非合金钢制热轧板堆第2部分:尺寸和形状公差Hot rolled sheet piling of non alloy steels - Part 2: Tolerances on shape and dimensionsEN 10249-1-1995 非合金钢制冷成型板堆第1部分:交货技术条件Cold formed sheet piling of non alloy steels - Part 1: Technical delivery conditionsEN 10249-2-1995 非合金钢制冷成型板堆第2部分:尺寸和形状公差Cold formed sheet piling of non alloy steels - Part 2: Tolerances on shape and dimensionsEN 10250-2-1999 一般工程用途的敞口钢模锻件第2部分:非合金钢和特殊钢Open die steel forgings for general engineering purposes - Part 2: Non-alloy quality andspecial steelsEN 10250-3-1999 一般工程用途的敞口钢模锻件第3部分:合金特殊钢Open die steel forgings for general engineering purposes - Part 3: Alloy special steelsEN 10257-1-1998 动力电缆或通信电缆铠甲用镀锌或锌合金的非合金钢电线第1部分:地面电缆Zinc or zinc alloy coated non-alloy steel wire for armouring either power cables ortelecommunication cables - Part 1: Land cablesEN 10257-2-1998 动力电缆或通信电缆铠甲用镀锌或锌合金的非合金钢电线第2部分:海底电缆Zinc or zinc alloy coated non-alloy steel wire for armouring either power cables ortelecommunication cables - Part 2: Submarine cablesEN 10264-2-2002 钢丝和钢丝制品绳用钢丝第2部分:一般用途绳用冷拔非合金钢丝Steel wire and wire products - Steel wire for ropes - Part 2: Cold drawn non alloy steel wire for ropesfor general applicationsEN 10264-3-2002 钢丝和钢丝制品绳用钢丝第3部分:重载用途圆形和成形非合金钢丝Steel wire and wire products - Steel wire for ropes - Part 3: Round and shaped non alloyed steel wire forhigh duty applicationsEN 10268-1998 冷成形用高屈服强度微合金钢的冷轧扁钢材交货一般条件Cold-rolled flat products made of high yield strength micro-alloyed steels for cold forming - General deliveryconditionsEN 10269-1999 规定高温和/或低温性能的紧固件用钢及镍合金Steels and nickel alloys forfasteners with specified elevated and/or low temperature propertiesEN 10296-1-2003 机械和一般工程用途的焊接圆形钢管交货技术条件第1部分:非合金钢管和合金钢管Welded circular steel tubes for mechanical and general engineering purposes - Technicaldelivery conditions - Part 1: Non-alloy and alloy steel tubesEN 10297-1-2003 机械和一般工程用途的无缝圆形钢管交货技术条件第1部分:非合金钢管和合金钢管Seamless circular steel tubes for mechanical and general engineering purposes- Technical delivery conditions - Part 1: Non-alloy and alloy steel tubesEN 10302-2002 抗蠕变钢、镍和钴合金Creep resisting steels, nickel and cobalt alloysEN 1057-1996 铜和铜合金在卫生和加热器中输送水和气体用无缝圆铜管Copper and copper alloys - Seamless, round copper tubes for water and gas in sanitary and heating applicationsEN 1092-3-2003 法兰及其连接按PN标注的管、阀门、配件及其附件用圆形法兰第3部分:铜合金法兰Flanges and their joints - Circular flanges for pipes, valves, fittings andaccessories PN designated - Part 3: Copper alloy flangesEN 1092-4-2002 法兰及其连接按PN标注的管、阀门、配件及其附件用圆形法兰第4部分:铝合金法兰Flanges and their joints - Circular flanges for pipes, valves, fittings and accessories, PNdesignated - Part 4: Aluminium alloy flangesEN 1172-1996 铜和铜合金建筑用薄板和带材Copper and copper alloys - Sheet and strip for building purposesEN 1173-1995 铜和铜合金原料条件或回火名称Copper and copper alloys - Material condition or temper designationEN 1179-2003 锌和锌合金初级锌Zinc and zinc alloys - Primary zincEN 12019-1997 锌和锌合金光学发射分光光度测定法Zinc and zinc alloys - Optical emission spectrometric analysisEN 12020-1-2001 铝和铝合金合金EN AW-6060和EN AW-6063的精密压制型材第1部分:检验与交货技术条件Aluminium and aluminium alloys - Extruded precision profiles in alloysEN AW-6060 and EN AW-6063 - Part 1: Technical conditions for inspection and deliveryEN 12020-2-2001 铝和铝合金合金EN AW-6060和EN AW-6063的精密压制型材第2部分:尺寸与形状公差Aluminium and aluminium alloys - Extruded precision profiles in alloys ENAW-6060 and EN AW-6063 - Part 2: Tolerances on dimensions and formEN 12060-1997 锌和锌合金取样方法规范Zinc and zinc alloys - Method of sampling - Specifications EN 1213-1999 建筑物阀门建筑物内便携式供水用的铜合金断流阀试验和要求Building valves - Copper alloy stopvalves for potable water supply in buildings - Tests and requirementsEN 12163-1998 铜和铜合金一般用途的棒材Copper and copper alloys - Rod for general purposesEN 12164-1998+A1-2000 铜和铜合金供快速切削用的棒材Copper and copper alloys - Rod for free machining purposesEN 12165-1998 铜和铜合金已加工和未加工的锻坯Copper and copper alloys - Wrought and unwrought forging stockEN 12166-1998 铜和铜合金一般用途的线材Copper and copper alloys - Wire for general purposesEN 12167-1998 铜及铜合金一般用途的型材和扁棒材Copper and copper alloys - Profiles and rectangular bar for general purposesEN 12168-1998+A1-2000 铜和铜合金用于非加工目的的空心棒材Copper and copper alloys - Hollow rod for free machining purposesEN 12258-1-1998 铝和铝合金术语和定义第1部分:通用术语Aluminium and aluminium alloys - Terms and definitions - Part 1: General termsEN 12258-3-2003 铝和铝合金术语和定义第3部分:废料Aluminium and aluminium alloys - Terms anddefinitions - Part 3: ScrapEN 12288-2003 工业用阀铜合金闸阀Industrial valves - Copper alloy gate valvesEN 12373-1-2001 铝和铝合金阳极氧化第1部分:铝上装饰和保护阳极氧化膜的测定方法Aluminium and aluminium alloys - Anodizing - Part 1: Method for specifying decorative andprotective anodic oxidation coatings on aluminiumEN 12373-10-1998 铝和铝合金阳极氧化第10部分:用磨擦喷射试验机测定阳极氧化膜的平均比耐磨性Aluminium and aluminium alloys - Anodizing - Part 10: Measurement of mean specificabrasion resistance of anodic oxidation coatings using an abrasive jet test apparatus EN 12373-11-2000 铝和铝合金阳极氧化第11部分:20°、45°、60°或85°角处测量阳极氧化膜在的镜面反射率和镜面光泽度Aluminium and aluminium alloys - Anodizing - Part 11:Measurement of specular reflectance and specular gloss of anodic oxidation coatingsat angles of 20? 45? 60?or 85?国际标准分类号:25.220.2077.120.10英文标准名称:Aluminium and aluminium alloys - Anodizing - Part11: Measurement of specular reflectance and specular gloss of anodicoxidation coatings at angles of 20? 45? 60?or 85?EN 12373-12-2000 铝和铝合金阳极氧化第12部分:用积分球仪测量铝表面的反射特性Aluminium and aluminium alloys - Anodizing - Part 12: Measurement of reflectance characteristics ofaluminium surfaces using integrating-sphere instrumentsEN 12373-13-2000 铝和铝合金阳极氧化第13部分:用测角光度仪或滤色测角光度仪测量铝表面的反射特性Aluminium and aluminium alloys - Anodizing - Part 13: Measurement ofreflectance characteristics of aluminium surfaces using a goniophotometer or anabridged goniophotometerEN 12373-14-2000 铝和铝合金阳极氧化第14部分:阳极氧化膜成象清晰度的目测座标比例尺法Aluminium and aluminium alloys - Anodizing - Part 14: Visual determination of imageclarity of anodic oxidation coatings - Chart scale methodEN 12373-15-2000 铝和铝合金阳极氧化第15部分:阳极氧化膜抗形变破裂性的评定Aluminium and aluminium alloys - Anodizing - Part 15: Assessment of resistance of anodic oxidationcoatings to cracking by deformationEN 12373-16-2001 铝和铝合金阳极氧化第16部分:薄阳极氧化膜的连续性检验硫酸铜试验Aluminium and aluminium alloys - Anodizing - Part 16: Check of continuity of thinanodic oxdation coatings; Copper sulfate testEN 12373-17-2001 铝和铝合金阳极氧化第17部分:电击穿电压的测定Aluminium and aluminium alloys - Anodizing - Part 17: Determination of electric breakdown potentialEN 12373-18-2001 铝和铝合金阳极氧化第18部分:点蚀评定铝用检定系统图表法Aluminium and aluminium alloys - Anodizing - Part 18: Rating system for the evaluation of pittingcorrosion; Chart methodEN 12373-19-2001 铝和铝合金阳极氧化第19部分:点蚀评定铝用检定系统网格法Aluminium and aluminium alloys - Anodizing - Part 19: Rating system for the evaluation of pittingcorrosion; Grid methodEN 12373-2-1998 铝和铝合金阳极氧化第2部分:阳极氧化膜单位面积质量(表面密度)的测定重量分析法Aluminium and aluminium alloys - Anodizing - Part 2: Determination of mass perunit area (surface density) of anodic oxidation coatings - Gravimetric methodEN 12373-3-1998 铝和铝合金阳极氧化第3部分:阳极氧化膜厚度的测定分束显微镜无损测量Aluminium and aluminium alloys - Anodizing - Part 3: Determination of thickness ofanodic oxidation coatings - Non-destructive measurement by split-beam microscope EN 12373-4-1998 铝和铝合金阳极氧化第4部分:通过事先经酸处理的染斑试验估计封闭后阳极氧化膜吸收能力的损失Aluminium and aluminium alloys - Anodizing - Part 4: Estimation ofloss of absorptive power of anodic oxidation coatings after sealing by dye spot test withprior acid treatmentEN 12373-5-1998 铝和铝合金阳极氧化第5部分:用导纳测量法评定封闭阳极氧化膜的质量Aluminium and aluminium alloys - Anodizing - Part 5: Assessment of quality of sealed anodicoxidation coatings by measurement of admittanceEN 12373-6-1998 铝和铝合金阳极氧化第6部分:通过测量事发未经酸处理的磷酸/铬酸中浸泡后的质量损失评定封闭阳极氧化膜Aluminium and aluminium alloys - Anodizing - Part 6:Assessment of quality of sealed anodic oxidation coatings by measurement of the loss ofmass after immersion in phosphoric acid/chromic acid solution without prior acidtreatmentEN 12373-7-2002 铝和铝合金阳极氧化第7部分:通过测量事发经酸处理的磷酸/铬酸中浸泡后的质量损失评定封闭阳极氧化膜的Aluminium and aluminium alloys - Anodizing - Part 7:Assessment of quality of sealed anodic oxidation coatings by measurement of the lossof mass after immersion in phosphoric acid/chromic acid solution with prior acidtreatmentEN 12373-8-1998 铝和铝合金阳极氧化第8部分:着色阳极氧化膜可比耐紫外光和耐热色牢固度的测定Aluminium and aluminium alloys - Anodizing - Part 8: Determination of the comparativefastness to ultra-violet light and heat of coloured anodic oxidation coatingsEN 12373-9-1998 铝和铝合金阳极氧化第9部分:用磨擦轮磨损试验机测定阳极氧化膜耐磨性和耐磨系数Aluminium and aluminium alloys - Anodizing - Part 9: Measurement of wearresistance and wear index of anodic oxidation coatings using an abrasive wheel weartest apparatusEN 12384-1999 铜和铜合金带材弹性弯曲极限的测定Copper and copper alloys - Determination of spring bending limit on stripEN 12392-2000 铝和铝合金锻制品压力设备生产用制品的特殊要求Aluminium and aluminium alloys - Wrought products - Special requirements for products intended for the production ofpressure equipmentEN 12402-1999 铅和铅合金分析用取样方法Lead and lead alloys - Methods of sampling for analysis EN 12420-1999 铜和铜合金锻件Copper and copper alloys - ForgingsEN 12421-1998 镁和镁合金纯镁Magnesium and magnesium alloys - Unalloyed magnesiumEN 12438-1998 镁和镁合金铸造阳极用镁合金Magnesium and magnesium alloys - Magnesium alloys for cast anodesEN 12441-1-2001 锌和锌合金化学分析第1部分:锌合金中铝的测定滴定法Zinc and zinc alloys - Chemical analysis - Part 1: Determination of aluminium in zinc alloys; Titrimetric method EN 12441-2-2001 锌和锌合金化学分析第2部分:锌合金中镁的测定火焰原子吸收光谱法Zinc and zinc alloys - Chemical analysis - Part 2: Determination of magnesium in zinc alloys;Flame atomic absorption spectrometric methodEN 12441-3-2001 锌和锌合金化学分析第3部分:铅、镉和铜的测定火焰原子吸收光谱法Zinc und zinc alloys - Chemical analysis - Part 3: Determination of lead, cadmium and copper;Flame atomic absorption spectrometric methodEN 12441-4-2003 锌和锌合金化学分析第4部分:用分光光度法测定锌合金中的铁Zinc and zinc alloys- Chemical analysis - Part 4: Determination of iron in zinc alloys; SpectrophotometricmethodEN 12441-5-2003 锌和锌合金化学分析第5部分:用分光光度法测定原生锌中的铁Zinc and zinc alloys - Chemical analysis - Part 5: Determination of iron in primary zinc; SpectrophotometricmethodEN 12441-6-2003 锌和锌合金化学分析第6部分:用原子吸收光谱法测定铝和铁Zinc and zinc alloys - Chemical analysis - Part 6: Determination of aluminium and iron-Flame atomic absorptionspectrometric methodEN 12449-1999 铜和铜合金通用无缝圆管Copper and copper alloys - Seamless, round tubes for general purposesEN 12450-1999 铜和铜合金无缝圆铜毛细管Copper and copper alloys - Seamless, round copper capillary tubesEN 12451-1999 铜和铜合金热交换器用无缝圆管Copper and copper alloys - Seamless, round tubes for heat exchangersEN 12452-1999 铜和铜合金热交换器用轧制翅片无缝管Copper and copper alloys - Rolled, finned, seamless tubes for heat exchangersEN 12482-1-1998 铝和铝合金一般用重轧坯料第1部分:热轧重轧坯料规范Aluminium and aluminium alloys - Reroll stock for general applications - Part 1: Specifications for hot rolled rerollstockEN 12482-2-1998 铝和铝合金一般用重轧坯料第2部分:冷轧重轧坯料规范Aluminium and aluminium alloys - Reroll stock for general applications - Part 2: Specifications for cold rolled rerollstockEN 12487-2000 金属的防腐蚀铝和铝合金上清洗和非清洗的铬酸盐转化镀层Corrosion protection of metals - Rinsed and non-rinsed chromate conversion coatings on aluminium andaluminium alloysEN 12501-2-2003 金属材料的防腐泥土中可能出现的腐蚀第2部分:低合金和非合金的钢铁材料Protection of metallic materials against corrosion - Corrosion likelihood in soil - Part 2:Low alloyed and non alloyed ferrous materialsEN 12508-2000 金属和合金的防腐表面处理、金属和其它无机涂层词汇Corrosion protection of metals and alloys - Surface treatment, metallic and other inorganic coatings - Vocabulary EN 12536-2000 焊接消耗品非合金钢和抗蠕变钢气焊用焊条分类Welding consumables - Rods for gas welding of non alloy and creep-resisting steels - ClassificationEN 1254-1-1998 铜和铜合金管件第1部分:低温焊接或纤焊接到铜管上的毛细管用端头管件Copper and copper alloys - Plumbing fittings - Part 1: Fittings with ends for capillary soldering orcapillary brazing to copper tubesEN 1254-2-1998 铜和铜合金管件第2部分:铜管用压接端头管件Copper and copper alloys - Plumbing fittings - Part 2: Fittings with compression ends for use with copper tubesEN 1254-3-1998 铜和铜合金管件第3部分:塑料管用压接端头管件Copper and copper alloys - Plumbing fittings - Part 3: Fittings with compression ends for use with plastics pipesEN 1254-4-1998+AC-1999 铜和铜合金管件第4部分:带有与毛细管端接或压接端头的管件Copper and copper alloys - Plumbing fittings - Part 4: Fittings combining other end connections withcapillary or compression endsEN 1254-5-1998 铜和铜合金管件第5部分:纤焊到铜管的毛细管用短端头管件Copper and copper alloys - Plumbing fittings - Part 5: Fittings with short ends for capillary brazing to coppertubesEN 12548-1999 铅和铅合金电缆铍和护套用铅合金铸锭Lead and lead alloys - Lead alloy ingots for electric cable sheathing and for sleevesEN 12588-1999 铅和铅合金建筑物用铅轧皮Lead and lead alloys - Rolled lead sheet for building purposesEN 12659-1999 铅和铅合金铅Lead and lead alloys - LeadEN 12735-1-2001 铜和铜合金空调和制冷用无缝圆铜管第1部分:管道系统用管子Copper and copper alloys - Seamless, round copper tubes for air conditioning and refrigeration - Part 1:Tubes for piping systemsEN 12735-2-2001 铜和铜合金空调和制冷用无缝圆铜管第2部分:设备用管子Copper and copper alloys - Seamless, round copper tubes for air conditioning and refrigeration - Part 2:Tubes for equipmentEN 12844-1998 锌和锌合金铸件规范Zinc and zinc alloys - Castings - SpecificationsEN 12861-1999 铜与铜合金废料Copper and copper alloys - ScrapEN 12862-2000 可运输气瓶可移动再充式焊接铝合金气瓶的设计和结构规范Transportable gas cylinders - Specification for the design and construction of refillable transportable welded aluminiumalloy gas cylindersEN 12893-2000 铜和铜合金螺旋拉伸数的测定Copper and copper alloys - Determination of spiral elongation numberEN 12938-1999 铅锡锑合金的分析方法用原子光谱法测定合金及杂质元素含量Methods for the analysis of pewter - Determination of alloying and impurity element contents by atomicspectrometryEN 1301-1-1997 铝和铝合金拉制线材第1部分:检查和交货的技术条件Aluminium and aluminium alloys - Drawn wire - Part 1: Technical conditions for inspection and deliveryEN 1301-2-1997+AC-1998 铝和铝合金拉制线材第2部分:机械性能Aluminium and aluminium alloys - Drawn wire - Part 2: Mechanical propertiesEN 1301-3-1997 铝和铝合金拉制线材第3部分:尺寸和公差Aluminium and aluminium alloys - Drawn wire - Part 3: Tolerances on dimensionsEN 13086-2000 铅和铅合金氧化铅Lead and lead alloys - Lead oxidesEN 13147-2001 铜和铜合金窄带材边界区域中残余应力的测定Copper and copper alloys - Determination of residual stresses in the border area of slit stripEN 13148-2001 铜和铜合金热浸镀锡带材Copper and copper alloys - Hot-dip tinned stripEN 13195-1-2002 铝和铝合金海洋设备(造船、海运和海上设备)用锻造和浇铸产品Aluminium and aluminium alloys - Wrought and cast products for marine applications (shipbuilding,marine and offshore) - Part 1: SpecificationsEN 13283-2002 锌和锌合金再生锌Zinc and zinc alloys - Secondary zincEN 13347-2002 铜和铜合金焊接和黄铜焊用棒和线Copper and copper alloys - Rod andwire for welding and braze weldingEN 13348-2001 铜和铜合金医用气体或真空用无缝圆铜管Copper and copper alloys - Seamless, round copper tubes for medical gases or vacuumEN 13349-2002 铜和铜合金带实心覆盖层的预绝缘铜管Copper and copper alloys - Pre-insulated copper tubes with solid coveringEN 13599-2002 铜和铜合金电气用途的铜板、铜片和铜条Copper and copper alloys - Copperplate, sheet and strip for electrical purposesEN 13600-2002 铜和铜合金电气用途的无缝铜管Copper and copper alloys - Seamlesscopper tubes for electrical purposesEN 13601-2002 铜和铜合金常规电气用途的铜棒、铜条和铜线Copper and copper alloys -Copper rod, bar and wire for general electrical purposesEN 13602-2002 铜和铜合金用于制造导电体的拉制圆铜线Copper and copper alloys - Drawn,round copper wire for the manufacture of electrical conductorsEN 13603-2002 铜和铜合金评估电气用途拉制圆铜线上的保护锡镀层的试验方法Copper and copper alloys - Test methods for assessing protective tin coatings on drawn round copper wire forelectrical purposesEN 13604-2002 铜和铜合金电子管、半导体器件和真空设备用高导电率铜产品Copper and copper alloys - Products of high conductivity copper for electronic tubes, semiconductor devices andvacuum applicationsEN 13605-2002 铜和铜合金电气用途的铜型材和型线材Copper and copper alloys - Copperprofiles and profiled wire for electrical purposesEN 13828-2003 建筑物阀门建筑物中饮用水供水用手动铜合金及不锈钢球阀试验和要求Building valves - Manually operated copper alloy and stainless steel ball valves for potable water supply inbuildings - Test and requirementsEN 1386-1996 铝和铝合金梯级金属板规范Aluminium and aluminium alloys - Tread plate - SpecificationsEN 13920-1-2003 铝和铝合金废料第1部分:一般要求、取样和试验Aluminium and aluminium alloys - Scrap - Part 1: General requirements, sampling and testsEN 13920-10-2003 铝和铝合金废料第10部分:由用过的铝饮料罐组成的废料Aluminium and aluminium alloys - Scrap - Part 10: Scrap consisting of use aluminium beverage cansEN 13920-11-2003 铝和铝合金废料第11部分:包括铝-铜散热器在内的废料Aluminium and aluminium alloys - Scrap - Part 11: Scrap consisting of aluminium-copper radiatorsEN 13920-12-2003 铝和铝合金废料第12部分:由单一合金组成的废料Aluminium and aluminium alloys - Scrap - Part 12: Turnings consisting of one single alloyEN 13920-13-2003 铝和铝合金废料第13部分:由两种或多种合金组成的混合切屑Aluminium and aluminium alloys - Scrap - Part 13: Mixed turnings consisting of twoor more alloysEN 13920-14-2003 铝和铝合金废料第14部分:消费品铝包装生产的废料Aluminium and aluminium alloys - Scrap - Part 14: Scrap from post-consumer aluminiumpackagingsEN 13920-15-2003 铝和铝合金废料第15部分:消费品铝包装产生的去涂层铝废料Aluminium and aluminium alloys - Scrap - Part 15: Decoated aluminium scrap frompost-consumer aluminium packagingsEN 13920-16-2003 铝和铝合金废料第16部分:由浮渣、碎屑、铸锭的金属物组成的废料Aluminium and aluminium alloys - Scrap - Part 16: Scrap consisting of skimmings, drosses, spills andmetallicsEN 13920-2-2003 铝和铝合金废料第2部分:纯铝废料Aluminium and aluminium alloys -Scrap - Part 2: Unalloyed aluminium scrapEN 13920-3-2003 铝和铝合金废料第3部分:线头和缆绳Aluminium and aluminium alloys -Scrap - Part 3: Wire and cable scrapEN 13920-4-2003 铝和铝合金废料第4部分:由单一锻压合金组成的废料Aluminium and aluminiumalloys - Scrap - Part 4: Scrap consisting of one single wrought alloyEN 13920-5-2003 铝和铝合金废料第5部分:由同一系列的两种或多种锻压合金组成的废料Aluminium and aluminium alloys - Scrap - Part 5: Scrap consisting of two or more wrought alloysof the same seriesEN 13920-6-2003 铝和铝合金废料第6部分:由两种或多种锻压合金组成的废料Aluminium and aluminium alloys - Scrap - Part 6: Scrap consisting of two or more wrought alloysEN 13920-7-2003 铝和铝合金废料第7部分:由铸锭组成的废料Aluminium and aluminiumalloys - Scrap - Part 7: Scrap consisting of castingsEN 13920-8-2003 铝和铝合金废料第8部分:由铝分离工艺必经的切岁程序中产生的非铁质材料组成的废料Aluminium and aluminium alloys - Scrap - Part 8: Scrap consisting of non-ferrousmaterials from shredding processes destined to aluminium separation processesEN 13920-9-2003 铝和铝合金废料第9部分:非铁质碎料的铝分离工艺所产生的废料Aluminium and aluminium alloys - Scrap - Part 9: Scrap from aluminium separation processes ofnon-ferrous shredded materialsEN 13957-2003 铝合及铝合金一般用途挤压圆形、蛇形管规范Aluminium and aluminium alloys - Extruded round, coiled tube for general applications - SpecificationEN 13958-2003 铝及铝合金一般用途冷拉圆形、蛇形管规范Aluminium and aluminium alloys - Cold drawn round, coiled tube for general applications - SpecificationEN 1396-1996 铝和铝合金一般用途的盘绕涂层薄板和带材规范Aluminium and aluminium alloys - Coil coated sheet and strip for general applications - SpecificationsEN 13981-1-2003 铝及铝合金铁路结构用产品,检验和交货技术条件第1部分:挤压产品Aluminium and aluminium alloys - Products for structural railway applications; Technical conditionsfor inspection and delivery - Part 1: Extruded productsEN 14057-2003 铅及铅合金废料术语和定义Lead and lead alloys - Scraps - Terms and definitions EN 1412-1995 铜和铜合金欧洲编号系统Copper and copper alloys - European numbering systemEN 14121-2003 铝及铝合金电工用铝片、铝带和铝板Aluminium and aluminium alloys - Aluminium sheet, strip and plate for electrotechnical applicationsEN 1503-4-2002 阀门阀体、阀帽和阀套用材料第3部分:欧洲标准规定的铜合金Valves - Materials for bodies, bonnets and covers - Part 4: Copper alloys specified in European StandardsEN 1559-4-1999 铸造交货的技术条件第3部分:铝合金铸件的附加要求Founding - Technicalconditions of delivery - Part 4: Additional requirements for aluminium alloy castingsEN 1559-5-1997 铸造交货的技术条件镁合金铸件的附加要求Founding - Technical conditionsof delivery - Part 5: Additional requirements for magnesium alloy castingsEN 1559-6-1998 铸造交货的技术条件锌合金铸件附加要求Founding - Technical conditions of delivery - Part 6: Additional requirements for zinc alloy castingsEN 1592-1-1997 铝和铝合金HF接缝焊接管第1部分:检验和交货技术条件Aluminium and aluminium alloys - HF seam welded tubes - Part 1: Technical conditions for inspection and delivery EN 1592-2-1997 铝和铝合金HF接缝焊接管第2部分:机械性能Aluminium and aluminiumalloys - HF seam welded tubes - Part 2: Mechanical propertiesEN 1592-3-1997 铝和铝合金HF接缝焊接管第3部分:圆形管的尺寸和形状公差Aluminium and aluminium alloys - HF seam welded tubes - Part 3: Tolerances on dimensions and formfor circular tubesEN 1592-4-1997 铝和铝合金HF接缝焊接管第4部分:方形、矩形和异形管的尺寸和形状公差Aluminium and aluminium alloys - HF seam welded tubes - Part 4: Tolerances on dimensions andform for square, rectangular and shaped tubesEN 1597-1-1997 焊料试验方法第1部分:镍和镍合金钢中完全焊接金属试验样品用试件Welding consumables - Test methods - Part 1: Test piece for all-weld metal test specimens insteel, nickel and nickel alloysEN 1652-1997 铜和铜合金一般用途的平板、薄板材、带材和圆形材Copper and copper alloys - Plate, sheet, strip and circles for general purposesEN 1653-1997+A1-200 铜和铜合金锅炉、压力容器和蓄热水器用的平板、薄板材和圆形材Copper and copper alloys - Plate, sheet and circles for boilers, pressure vessels and hot water storageunitsEN 1654-1997+AC-2003 铜和铜合金弹簧和连接器用带材Copper and copper alloys - Strip for springs and connectorsEN 1655-1997 铜和铜合金符合性声明Copper and copper alloys - Declarations of conformityEN 1668-1997 焊接耗材非合金和细晶粒钢的惰性气体保护钨极焊用焊条焊丝和熔敷分类Welding consumables - Rods, wires and deposits for tungsten inert gas welding of non alloy and finegrain steels - ClassificationEN 1669-1996 铝及铝合金试验方法薄板材和带材的耳子试验Aluminium and aluminium alloys - Test methods - Earing test for sheet and stripEN 1676-1996 铝及铝合金重熔用的合金锭规范Aluminium and aluminium alloys - Alloyed ingots for remelting - SpecificationsEN 1706-1998 铝及铝合金铸件化学成分和机械性能Aluminium and aluminium alloys - Castings - Chemical composition and mechanical propertiesEN 1715-1-1997 铝和铝合金拉制件第1部分:检验和交货的一般要求及技术条件Aluminium and aluminium alloys - Drawing stock - Part 1: General requirements and technical conditionsfor inspection and deliveryEN 1715-2-1997+AC-1998 铝和铝合金拉制坯料第2部分:电气应用的特殊要求Aluminium and aluminium alloys - Drawing stock - Part 2: Specific requirements for electrical applications EN 1715-3-1997+AC-1998 铝和铝合金拉制坯料第3部分:机械应用的特殊要求(包括焊接) Aluminium and aluminium alloys - Drawing stock - Part 3: Specific requirements for mechanical uses(excluding welding)EN 1715-4-1997 铝和铝合金拉制坯料第4部分:焊接应用的特殊要求Aluminium and aluminium alloys - Drawing stock - Part 4: Specific requirements for welding applicationsEN 1753-1997+AC-1997 镁和镁合金镁合金锭和铸件Magnesium and magnesium alloys - Magnesium alloy ingots and castingsEN 1754-1997 镁和镁合金镁和镁合金氧化极、铸锭和铸件命名体系Magnesium and magnesium alloys - Magnesium and magnesium alloy anodes, ingots and castings - Designation systemEN 1758-1997 铜及铜合金引线架用带材Copper and copper alloys - Strip for lead framesEN 1759-3-2003 法兰及其接头管材、阀门、管件及附件用已命名种类的圆形法兰第2部分:铜合金法兰Flanges and their joints - Circular flanges for pipes, valves, fittings and accessories, classdesignated - Part 3: Copper alloy flangesEN 1759-4-2003 法兰及其接头管材、阀门、管件及附件用已命名种类的圆形法兰第4部分:铝合金法兰Flanges and their joints - Circular flanges for pipes, valves, fittings and accessories, classdesignated - Part 4: Aluminium alloy flangesEN 1774-1997 锌和锌合金铸造用合金铸锭和铸液Zinc and zinc alloys - Alloys for foundry purposes - Ingot and liquid。
UL1026中文版-1995
43.5. 嵌裝式器具及墙挂式器具的冲击测试
46. 负载测试
47. 溫控器的插拔测试
48. 開關元件及控制裝置
49. 標識的永久性测试
50. 室外使用器具電源線吊牌的永久性测试
生产线测试
51. 高压测试
52. 极性及接地连续性测试
额定值
53. 電氣參數
标识
54. 细节
6.支架及外壳
6.1器具的支架及壳体应具有足够的强度及刚度,以抵抗正常使用中可能遇到的滥用。器具本身应具有一定的防 护程度,使其避免整體或局部破壞﹐從而减少间隙,造成零件的松动或移动,或產生其它严重缺陷,从而增 大火灾,电击及对人体的伤害的危险。
6.2器具外殼材料應符合特定的使用要求。外殼應將在任何條件下能起火﹐產生電擊或傷害人體的帶電體遮罩起 來﹐但電源線及 14.3﹑14.4 所述的裸露式發熱元件除外。如果器具打算永久性與電網連接﹐則外殼應帶固定 裝置﹐使其按預定方式固定﹐并提供所需的連接配件﹐如支架﹑吊钩等。
6.7外壳上的铸件及钣金件的壁厚不得低于表 6.1 中的规定的壁厚。如壁厚小于表 6.1 的規定值﹐但經檢驗判定符 合要求(如符合 6.5 及 6.8 的要求)﹐則可用。
6.8除了考慮 6.5 所提到的因素外,钣金件外殼還要根據其大小及形状、壁厚、器具的預定使用狀況來判定其合格 性。
6.9器具的电气零件(自动多士炉裸露式發熱絲的發熱部分除外),其位置應能防止意外碰到非絕緣帶電體﹐否則 要將其封裝起來(參見 22.7)。絕緣馬達電刷帽不用再加外壳。
4)马达符合阻抗保护要求。
b)孔位位于線路下方﹐除非電線符合 VW–1 火焰測試要求﹐或符合 UL1581 之垂直火焰測試要求。
c)孔位位于無外殼的开关,变压器,继电器,電磁鐵等下方,除非能証明這些元件在發生誤動作時不致引 发火灾。
Agilent 1260 液相现场培训手册
Agilent 12Agilent 1260 LC60 LCAgilent 12Agilent 12660 LC0 LC[Agilent OpenLAB 中文中文]中文中文现场培训教材现场培训教材现场培训教材现场培训教材安捷伦科技有限公司生命科学与化学分析仪器部.lsca-c 800-820-3278 Agilent OpenLAB1 Agilent 1260 液相现场培训手册一、目录二、培训目的.................................................. . (3)三、培训准备.................................................. . (3)1. 仪器准备.................................................. . (3)2. 溶剂准备.................................................. . (3)四、方法建立.................................................. . (3)1. 开机准备.................................................. . (3)2. 数据采集方法编辑.................................................. (9)G1310A 单元泵 (9)G1312X 二元泵/G1311X 四元泵 (10)G1313A 标准型自动进样器,G1329B 自动控温自动进样器 (11)G1367E 高性能自动进样器 (12)G1328A 手动进样器 (14)G1316A/C 柱温箱 (15)G1314BC/E/F 可变波长紫外检测器 (15)G1315C/D ,G4212A/B 二极管阵列检测器/ G1365C/D 多波长紫外检测器 (17)G1362A 示差检测器 (18)G1321A 荧光检测器 (19)G4218A 蒸发光散射检测器 (21)3. 数据分析方法编辑.................................................. . (22)谱图优化.................................................. .. (22)积分参数优化.................................................. (23)校正.................................................. . (25)打印报告.................................................. .. (27)光谱.................................................. . (28)4. 建立全新完整方法向导 (30)5. 进样.................................................. . (30)单针进样.................................................. .. (30)序列进样.................................................. .. (31).lsca-c 800-820-3278 Agilent OpenLAB2 Agilent 1260 液相现场培训手册五、关机.................................................. . (33)1. 关闭检测器的灯.................................................. .. (33)2. 冲洗系统.................................................. .. (33)3. 封存色谱柱.................................................. . (33)4. 关闭电脑.................................................. .. (33)5. 关闭模块.................................................. .. (33)六、RRLC 快速液相注意事项.................................................. (33)七、特殊检测器的注意事项 (35)八、Agilent 1260 常见问题解决方法.................................................. . (37)附一、维护知识.................................................. .. (39)附二、注册OpenLAB CDS 许可证的流程.................................................. (41)****注意****注意::********注意注意::? ? 本教材仅适用于现场工程师培训讲解参考之用本教材仅适用于现场工程师培训讲解参考之用,,内容为工作站现内容为工作站现本教材仅适用于现场工程师培训讲解参考之用本教材仅适用于现场工程师培训讲解参考之用,,内容为工作站现内容为工作站现场培训的一般要求,场培训的一般要求,请根据用户的仪器配置及现场用户的需求进行相请根据用户的仪器配置及现场用户的需求进行相场培训的一般要求场培训的一般要求,,请根据用户的仪器配置及现场用户的需求进行相请根据用户的仪器配置及现场用户的需求进行相应的培训内容增删。
基于TI DM8168的多路高性能Netra 视频处理方案
Up to 3x 1080P60 C674x+Cortex-A8 Up to 1.5GHz 2x 1G-Enet 2D/3D Graphics PCIe, USB DDR2/DDR3 Up to 3X Display
DM814x
• • • • • • • 1x 1080P60 C674x+Cortex-A8 Up to 1GHz 1G-Enet Switch 2D/3D Graphics PCIe, USB, CAN LPDDR/DDR2/DDR3
• SD/HD video • C64x • Multiple video ports
DM644x
DM365 • 720P • 300MHz ARM9 • Image signal processing (ISP)
DM368 • 1080P30 • 432Mhz ARM9 • Image signal processing (ISP)
基于TI DM8168的多路高性能Netra 视频处理方案
Arrow SEED FAE Luckwu
点击查看Arrow SEED各地联系方式
Agenda:
Arrow SEED简介; SEED-DVS8168方案介绍; SEED-DVS8168 CCS环境下Demo&调试; SEED-DVS8168 Linux环境下Demo&调试; SEED-DVS8168板卡灵活性; DM8168芯片开发参考网站。
SEED stands for Special Electronics Equipment & Devices, was founded in 1995, with 200 employees 13 offices in China, 9 tools distributors overseas. SEED has its own R&D center. We all have 10+ engineers to do designs based on DSP/MCU/ARM/FPGA. All of them are expertise for TI’s processors, and signal chain. SEED is the biggest tool’s supplier for China embedded marketing. Jan. 3, 2012, SEED joint officially Arrow Electronics, Inc. (NYSE:ARW), becomes dedicated business unit under Arrow-asia to strive more successes and opportunities.(Arrow SEED).
ISL12026_chi
VDD有最大斜率
否
4 个 可 用 的 复 位 门 限 , 具 有 ±2.5% 的 精 度 5个可用的复位门限,具有±1.5%的精度 否
(旧器件是浮栅基准)
(更精确的带隙)
门限值可用复杂的模拟电压设置程序调节
门限值可用EEPROM寄存器编程(1 of 否 5)
器件可以工作,只要VBAT>VDD>VRESET 无复位,无I2C通信
旧的X1228
新的ISL12028
影响软件?
一旦VCC<VBAT,器件就转换到电池模式
当1)VCC<VBAT且2)VCC<VTRIP,具有工 否 作在旧模式的选项(称为“LP模式”)
时,器件转换到电池模式
仅在迟滞模式下,VDD的负极传输有迟滞
VDD的负极和正极传输均有迟滞
否
1.25µA备用电池电流
800nA备用电池电流
仅有两个变化影响应用程序或软件。一个是通用 EEPROM 存储器的页面大小由 64 字节变为 16 字节,就需要 改变存储器的写入程序。另一个是 RTC 寄存器要求一次写入 整个页面,而不允许写入单个字节。向 RTC 写入单个字节将 不会更新寄存器内容。
1
入
注意 ISL12027 的寄存器增添了附加状态和控制位,它们 的功能也要检查。在用 ISL12027 替换 X1227 之前要详细了解 它们的功能。表 2 列出了完整的硬件和寄存器变动情况。如 果不需要附加功能,ISL12026 默认的出厂设置也模拟了旧器 件的功能。
仅有两个变化影响应用程序或软件。一个是通用 EEPROM 存储器的页面大小由 64 字节变为 16 字节,就需要 改变存储器的写入程序。另一个是 RTC 寄存器要求一次写入 整个页面,而不允许写入单个字节。向 RTC 写入单个字节将 不会更新寄存器内容。
ISL6520ACB-T资料
2
FN9016.5
March 28, 2007
元器件交易网
Block Diagram
SAMPLE AND HOLD
ISL6520A
+ -
OC
COMPARATOR
VCC
POR AND SOFTSTART
INHIBIT
+
0.8V -
FB COMP/OCSET
20μA
Typical Application
0 to +70
16 Ld 4x4mm QFN
L16.4x4
ISL6520ACRZ* (Note)
65 20ACRZ
0 to +70
16 Ld 4x4mm QFN (Pb-free)
L16.4x4
ISL6520AIR*
65 20AIR
-40 to +85
16 Ld 4x4mm QFN
L16.4x4
ISL6520AIRZ * (Note)
• QFN Package: - Compliant to JEDEC PUB95 MO-220 QFN - Quad Flat No Leads - Package Outline - Near Chip Scale Package footprint, which improves PCB efficiency and has a thinner profile
All other trademarks mentioned are the property of their respective ownerdering Information
PART NUMBER
PART MARKING
ISL1209IU10资料
®
ISL1209
Real Time Clock/Calendar with Event Detection
Data Sheet September 27, 2005 FN6109.1
Low Power RTC with Battery Backed SRAM and Event Detection
Features
• Real Time Clock/Calendar - Tracks Time in Hours, Minutes, and Seconds - Day of the Week, Day, Month, and Year • Security and Event Functions - Tamper detection with Time Stamp - Event Detection During Battery Packed or Normal Modes - Selectable Event Input Sampling Rates Allows Low Power Operation - Selectable Glitch Filter on Event Input Monitor • 15 Selectable Frequency Outputs
7 6
EVIN
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright Intersil Americas Inc. 2005. All Rights Reserved All other trademarks mentioned are the property of their respective owners.
ISL6721资料
ISL6721
SL O PE UV R5 R6 D2 TP5 OV RT CT ISET
VREF LG ND SS CO M P VFB R27 R26
R14
T P4
Q3
C12 R8 R10 C7 R7 R9
C11 C9
VR1
C8 R11 R12 R13
C10
3
元器件交易网
Pinout
ISL6721 (SOIC, TSSOP) TOP VIEW
GATE 1 16 VC 15 PGND 14 VCC 13 VREF 12 LGND 11 SS 10 COMP 9 FB
ISENSE 2 SYNC 3 SLOPE 4 UV 5 OV 6
RTCT 7 ISET 8
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 321-724-7143 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright © Intersil Americas Inc. 2003-2004. All Rights Reserved. All other trademarks mentioned are the property of their respective owners.
• 1% Tolerance voltage Reference • Pb-free available
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®Preliminary Replacing the X1226, X1227 or X1228 RTC with the ISL12026, ISL12027 or ISL12028IntroductionIntersil has recently introduced a new family of Real Time Clock (RTC) devices (the “ISL1202x” family) which include 4k of EEPROM. These devices are pin for pin compatible and include enhancements over an older family of devices (the “X122x” family). These enhancements include:•Lower supply and battery backup current•Reliable battery switchover•Accurate Reset voltage trip points•Oscillator functionality detectionOther enhancements are detailed in the data sheets. This Application note provides information for an engineer wishing to use the new devices to replace the older devices in their system.Replacing the X1226 with the ISL12026The ISL12026 is an RTC device with 4k of EEPROM and includes an Fout/IRQ- pin for outputting an alarm interrupt or constant frequency clock. The ISL12026 can drop into anX1226 socket with no hardware changes required, but certain changes to the battery switchover and battery operation should be reviewed. See the ISL12026 data sheet for more details. There are only two changes that affect microcode or software. First, the change in general purpose EEPROM memory page size from 64 bytes to 16 bytes will require changes to the memory writing procedure. Second, the RTC registers require a full page write at a time instead of allowing a single byte write. A single byte write to the RTC registers will result in no update to those registers at all.Note that there are additional status and control bits added to the registers of the ISL12026. Review their function thoroughly before subsituting the ISL12026 for the X1226. T able 1 lists the complete hardware and register changes. If the additional functionality is not needed, however, the ISL12026 default factory setting emulates the older device functionality. Replacing the X1227 with the ISL12027The ISL12027 is an RTC device with 4k of EEPROM and includes a RESET- pin for outputting a hardware Reset signal for microcontroller or logic system reset, or a watchdog timer reset. The Reset function was improved in the ISL12027 to perform a Reset even if the oscillator has not started or has been stopped. The X1227 device would not issue a Reset with a stopped oscillator. The ISL12027 can drop into an X1227 socket with no hardware changes required, but certain changes to the battery switchover and battery operation should be reviewed. See the ISL12027 data sheet for more details.There are only two changes that affect microcode or software. First, the change in general purpose EEPROM memory page size from 64 bytes to 16 bytes will require changes to the memory writing procedure. Second, the RTC registers require a full page write at a time instead of allowing a single byte write. A single byte write to the RTC registers will result in no update to those registers at all.Note that there are additional status and control bits added to the registers of the ISL12027, and their function should be reviewed as well. Review their function thoroughly before subsituting the ISL12027 for the X1227. Table 2 lists the complete hardware and register changes. If the additional functionality is not needed, however, the device default setting from the factory emulates the older device functionality.Replacing the X1228 with the ISL12028The ISL12028 is an RTC device with 4k of EEPROM and includes an Fout/IRQ- pin for outputting an alarm interrupt or constant frequency clock, and a RESET- pin for outputting a hardware Reset signal for microcontroller or logic system reset or a watchdog timer reset. The Reset function was improved in the ISL12028 to perform a Reset even if the oscillator has not started or has been stopped. The X1228 device would not issue a Reset with a stopped oscillator. The ISL12028 can drop into an X1228 socket with no hardware changes required, but certain changes to the battery switchover and battery operation should be reviewed. See the ISL12028 data sheet for more details.There are only two changes that affect microcode or software. First, the change in general purpose EEPROM memory page size from 64 bytes to 16 bytes will require changes to the memory writing procedure. Second, the RTC registers require a full page write at a time instead of allowing a single byte write. A single byte write to the RTC registers will result in no update to those registers at all. Note that there are additional status and control bits added to the registers of the ISL12027, and their function should be reviewed as well. Review their function thoroughly before subsituting the ISL12028 for the X1228. Table 3 lists the complete hardware and register changes. If the additional functionality is not needed, however, the device default setting from the factory emulates the older device functionality.Note that the ISL12029 device has been introduced as well, and is the same as the ISL12028 in all respects except for an open drain IRQ-/Fout pin instead of the CMOS output pin found on the ISL12028. This change will reduce battery current drain in applications where the circuitry that connect to this pin is powered down in battery backup mode.FUNCTION OLD X1226NEW ISL12026SOFTWARE?Battery Switchover Device switches to battery mode onceV CC<V BAT Device switches to battery when 1) V CC<V BAT AND2) V CC<V TRIP with option to work the oldway (called "LP Mode")NOBattery Switchover Hysteresis on V DD negative transistiononly in legacy mode Hysteresis on both V DD negative and positive transistionsNOBattery Current 1.25µA battery backup current800nA battery backup current NO Power Supply Min rise/fall times for V CC only Max slew rate for V DD NOI2C Operation with Battery Device could work in battery backup aslong as V BAT>V TRIP and V BAT>V CC Selectable operation whether I2C is active in battery backup, or will not be active ifV BAT>V DDNOEEPROM64-byte page write16-byte page write YESStatus Register(None)Status bit to indicate oscillator stopped NO - Optional additionalfunctionalityStatus Register Legacy switchover only BSW mode bit to change from legacy tostandard mode for battery switchover NO - Optional additional functionalityControl Registers(None)Memory map to expand slightly from additionof bits NO - Optional additional functionalityRTC Registers Byte write or page write Page write ONLY YES Pin Names IRQ-/PHZ IRQ/Fout NO Pin Names V BACK V BAT NO Pin Names V CC V DD NO Clock Inputs External clocking on X1 with special input No external clocking NOFUNCTION OLD X1227NEW ISL12027SOFTWARE?Battery Switchover Device switches to battery mode onceV CC<V BAT Device switches to battery when 1) V CC<V BAT AND2) V CC<V RESET with option to work theold way (called "LP Mode")NOBattery Switchover Hysteresis on V DD negative transistiononly in legacy mode Hysteresis on both V DD negative and positive transistionsNOBattery Current 1.25µA battery backup current800nA battery backup current NO Power Supply Min rise/fall times for V CC only Max slew rate for V DD NOReset Trip Voltages 4 available reset thresholds with ±2.5%accuracy (old floating gate reference)5 available reset thresholds with ±1.5%accuracy (more accurate bandgap)NOReset Trip Voltages Thresholds adjusted using complicatedanalog voltage setting procedure Thresholds programmed (1 of 5) usingEEPROM registerNOI2C Operation with Battery Device could work as long asV BAT>V DD>V RESET Selectable operation whether I2C is active in battery backupNOOperation with NO Oscillator No reset, no I2C communication Reset will occur with no battery, I2C cancommunicateNOEEPROM64-byte page write16-byte page write YESStatus Register(None)Status bit to indicate oscillator stopped NO - Optional additionalfunctionalityStatus Register Legacy switchover only BSW mode bit to change from legacy tostandard mode for battery switchover NO - Optional additional functionalityControl Registers(None)Memory map to expand slightly from additionof bits NO - Optional additional functionalityRTC Registers Byte write or page write Page write ONLY - No single byte writes tosetup RTC registersYES Pin Names V BACK V BAT NO Pin Names V CC V DD NO Clock Inputs External clocking on X1 with special input No external clocking NOIntersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that the Application Note or Technical Brief is current before proceeding.For information regarding Intersil Corporation and its products, see FUNCTIONOLD X1228NEW ISL12028SOFTWARE?Battery SwitchoverDevice switches to battery mode once V CC <V BATDevice switches to battery when 1) V CC <V BAT AND 2) V CC <V RESET with option to work the old way (called "LP Mode")NO Battery Switchover Hysteresis on V DD negative transistion only in legacy modeHysteresis on both V DD negative and positive transistionsNO Battery Current 1.25µA battery backup current 800nA battery backup current NO Power Supply Min rise/fall times for V CC only Max slew rate for V DDNO Reset Trip Voltages 4 available reset thresholds with ±2.5% accuracy (old floating gate reference) 5 available reset thresholds with ±1.5% accuracy (more accurate bandgap)NO Reset Trip VoltagesThresholds adjusted using complicated analog voltage setting procedureThresholds programmed (1 of 5) using EEPROM registerNO I 2C Operation with Battery Device could work as long as V BAT >V DD >V RESETSelectable operation whether I 2C is active in battery backupNO Operation with NO Oscillator No reset, no I 2C communication Reset will occur with no battery, I 2C can communicateNO EEPROM 64-byte page write 16-byte page writeYESStatus Register (None)Status bit to indicate oscillator stopped NO - Optional additional functionalityStatus Register Legacy switchover only BSW mode bit to change from legacy to standard mode for battery switchoverNO - Optional additional functionalityControl Registers (None)Memory map to expand slightly from addition of bits NO - Optional additional functionality RTC Registers Byte write or page write Page write ONLY - No single byte writes to setup RTC registers YES Pin Names IRQ-/PHZ IRQ/Fout NO Pin Names V BACK V BAT NO Pin Names V CCV DDNO Clock InputsExternal clocking on X1 with special input No external clockingNO。