SN54ALS528中文资料 - 360文档中心

SN54ACT32中文资料

IMPORTANT NOTICETexas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those pertaining to warranty, patent infringement, and limitation of liability.TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements.CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO BE FULLY AT THE CUSTOMER’S RISK.In order to minimize risks associated with the customer’s applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards.TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used. TI’s publication of information regarding any third party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.Copyright © 1998, Texas Instruments Incorporated。

SN54283中文资料

descriptionCopyright 1988, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date.PACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)76043012A ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC7604301EA ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC7604301FA ACTIVE CFP W161TBD Call TI Level-NC-NC-NC JM38510/31202B2A ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC JM38510/31202BEA ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC JM38510/31202BFA ACTIVE CFP W161TBD Call TI Level-NC-NC-NC SN54LS283J ACTIVE CDIP J161TBD Call TI Level-NC-NC-NCSN54S283J ACTIVE CDIP J161TBD Call TI Level-NC-NC-NCSN74283N OBSOLETE PDIP N16TBD Call TI Call TISN74LS283D ACTIVE SOIC D1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS283DE4ACTIVE SOIC D1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS283DR ACTIVE SOIC D162500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS283DRE4ACTIVE SOIC D162500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS283N ACTIVE PDIP N1625Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NC SN74LS283N3OBSOLETE PDIP N16TBD Call TI Call TISN74LS283NE4ACTIVE PDIP N1625Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74LS283NSR ACTIVE SO NS162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS283NSRE4ACTIVE SO NS162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74S283D OBSOLETE SOIC D16TBD Call TI Call TISN74S283N ACTIVE PDIP N1625Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NC SN74S283N3OBSOLETE PDIP N16TBD Call TI Call TISN74S283NE4ACTIVE PDIP N1625Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NC SNJ54LS283FK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC SNJ54LS283J ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC SNJ54LS283W ACTIVE CFP W161TBD Call TI Level-NC-NC-NC SNJ54S283FK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC SNJ54S283J ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC SNJ54S283W ACTIVE CFP W161TBD Call TI Level-NC-NC-NC (1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS)or Green(RoHS&no Sb/Br)-please check/productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. T o minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetwork Microcontrollers Security /securityTelephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2005, Texas Instruments Incorporated。

SN54LS32FK中文资料

PACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)5962-9557401QCA ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC 5962-9557401QDA ACTIVE CFP W141TBD Call TI Level-NC-NC-NC 5962-9557401QDA ACTIVE CFP W141TBD Call TI Level-NC-NC-NCJM38510/30501B2A ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NCJM38510/30501B2A ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NCJM38510/30501BCA ACTIVE CDIP J141TBD Call TI Level-NC-NC-NCJM38510/30501BCA ACTIVE CDIP J141TBD Call TI Level-NC-NC-NCJM38510/30501BDA ACTIVE CFP W141TBD Call TI Level-NC-NC-NCJM38510/30501BDA ACTIVE CFP W141TBD Call TI Level-NC-NC-NCJM38510/30501SCA ACTIVE CDIP J141TBD Call TI Level-NC-NC-NCJM38510/30501SCA ACTIVE CDIP J141TBD Call TI Level-NC-NC-NCJM38510/30501SDA ACTIVE CFP W141TBD Call TI Level-NC-NC-NCJM38510/30501SDA ACTIVE CFP W141TBD Call TI Level-NC-NC-NC SN5432J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC SN5432J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC SN54LS32J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC SN54LS32J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC SN54S32J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC SN54S32J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC SN7432N ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN7432N ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NC SN7432N3OBSOLETE PDIP N14TBD Call TI Call TISN7432N3OBSOLETE PDIP N14TBD Call TI Call TISN7432NE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN7432NE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74LS32D ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS32D ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS32DBR ACTIVE SSOP DB142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS32DBR ACTIVE SSOP DB142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS32DBRE4ACTIVE SSOP DB142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS32DBRE4ACTIVE SSOP DB142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS32DE4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS32DE4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS32DG4ACTIVE SOIC D1450Green(RoHS&CU NIPDAU Level-1-260C-UNLIMOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)no Sb/Br)SN74LS32DG4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS32DR ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS32DR ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS32DRE4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS32DRE4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS32DRG4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS32DRG4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS32J OBSOLETE CDIP J14TBD Call TI Call TISN74LS32J OBSOLETE CDIP J14TBD Call TI Call TISN74LS32N ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74LS32N ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NC SN74LS32N3OBSOLETE PDIP N14TBD Call TI Call TISN74LS32N3OBSOLETE PDIP N14TBD Call TI Call TISN74LS32NE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74LS32NE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74LS32NSR ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS32NSR ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS32NSRG4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS32NSRG4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S32D ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S32D ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S32DE4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S32DE4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S32DR ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S32DR ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S32DRE4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S32DRE4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)SN74S32N ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74S32N ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NC SN74S32N3OBSOLETE PDIP N14TBD Call TI Call TISN74S32N3OBSOLETE PDIP N14TBD Call TI Call TISN74S32NE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74S32NE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74S32NSR ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S32NSR ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S32NSRE4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S32NSRE4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SNJ5432J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NCSNJ5432J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NCSNJ5432W ACTIVE CFP W141TBD Call TI Level-NC-NC-NCSNJ5432W ACTIVE CFP W141TBD Call TI Level-NC-NC-NC SNJ54LS32FK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC SNJ54LS32FK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC SNJ54LS32J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC SNJ54LS32J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC SNJ54LS32W ACTIVE CFP W141TBD Call TI Level-NC-NC-NC SNJ54LS32W ACTIVE CFP W141TBD Call TI Level-NC-NC-NC SNJ54S32FK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC SNJ54S32FK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NCSNJ54S32J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NCSNJ54S32J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NCSNJ54S32W ACTIVE CFP W141TBD Call TI Level-NC-NC-NCSNJ54S32W ACTIVE CFP W141TBD Call TI Level-NC-NC-NC (1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS)or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.元器件交易网IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,enhancements, improvements, and other changes to its products and services at any time and to discontinueany product or service without notice. Customers should obtain the latest relevant information before placingorders and should verify that such information is current and complete. All products are sold subject to TI’s termsand conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TIdeems necessary to support this warranty. Except where mandated by government requirements, testing of allparameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible fortheir products and applications using TI components. T o minimize the risks associated with customer productsand applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or processin which TI products or services are used. Information published by TI regarding third-party products or servicesdoes not constitute a license from TI to use such products or services or a warranty or endorsement thereof.Use of such information may require a license from a third party under the patents or other intellectual propertyof the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is withoutalteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproductionof this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable forsuch altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for thatproduct or service voids all express and any implied warranties for the associated TI product or service andis an unfair and deceptive business practice. TI is not responsible or liable for any such statements.Following are URLs where you can obtain information on other Texas Instruments products and applicationsolutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityTelephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2005, Texas Instruments Incorporated。

SN54LS245中文资料

SN54LS245, SN74LS245SN54LS245, SN74LS245PACKAGING INFORMATIONAddendum-Page 1(1) The marketing status values are defined as follows:ACTIVE: Product device recommended for new designs.LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check /productcontent for the latest availability information and additional product content details.TBD: The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)Addendum-Page 2(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device.(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.OTHER QUALIFIED VERSIONS OF SN54LS245, SN54LS245-SP, SN74LS245 :•Catalog: SN74LS245, SN54LS245•Military: SN54LS245•Space: SN54LS245-SPNOTE: Qualified Version Definitions:•Catalog - TI's standard catalog product•Military - QML certified for Military and Defense Applications•Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based applicationAddendum-Page 3TAPE AND REEL INFORMATION*All dimensions are nominalDevicePackage Type Package Drawing Pins SPQReel Diameter (mm)Reel Width W1(mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant SN74LS245DBR SSOP DB 202000330.016.48.27.5 2.512.016.0Q1SN74LS245DWR SOIC DW 202000330.024.410.813.0 2.712.024.0Q1SN74LS245NSRSONS202000330.024.48.213.02.512.024.0Q1*All dimensions are nominalDevice Package Type Package Drawing Pins SPQ Length(mm)Width(mm)Height(mm) SN74LS245DBR SSOP DB202000367.0367.038.0 SN74LS245DWR SOIC DW202000367.0367.045.0SN74LS245NSR SO NS202000367.0367.045.0IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,enhancements,improvements and other changes to its semiconductor products and services per JESD46,latest issue,and to discontinue any product or service per JESD48,latest issue.Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All semiconductor products(also referred to herein as“components”)are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its components to the specifications applicable at the time of sale,in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by applicable law,testing of all parameters of each component is not necessarily performed.TI assumes no liability for applications assistance or the design of Buyers’products.Buyers are responsible for their products and applications using TI components.To minimize the risks associated with Buyers’products and applications,Buyers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any patent right,copyright,mask work right,or other intellectual property right relating to any combination,machine,or process in which TI components or services are rmation published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI.Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.TI is not responsible or liable for such altered rmation of third parties may be subject to additional restrictions.Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.Buyer acknowledges and agrees that it is solely responsible for compliance with all legal,regulatory and safety-related requirements concerning its products,and any use of TI components in its applications,notwithstanding any applications-related information or support that may be provided by TI.Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures,monitor failures and their consequences,lessen the likelihood of failures that might cause harm and take appropriate remedial actions.Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications.In some cases,TI components may be promoted specifically to facilitate safety-related applications.With such components,TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements.Nonetheless,such components are subject to these terms.No TI components are authorized for use in FDA Class III(or similar life-critical medical equipment)unless authorized officers of the parties have executed a special agreement specifically governing such use.Only those TI components which TI has specifically designated as military grade or“enhanced plastic”are designed and intended for use in military/aerospace applications or environments.Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk,and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI has specifically designated certain components as meeting ISO/TS16949requirements,mainly for automotive use.In any case of use of non-designated products,TI will not be responsible for any failure to meet ISO/TS16949.Products ApplicationsAudio /audio Automotive and Transportation /automotiveAmplifiers Communications and Telecom /communicationsData Converters Computers and Peripherals /computersDLP®Products Consumer Electronics /consumer-appsDSP Energy and Lighting /energyClocks and Timers /clocks Industrial /industrialInterface Medical /medicalLogic Security /securityPower Mgmt Space,Avionics and Defense /space-avionics-defense Microcontrollers Video and Imaging /videoRFID OMAP Applications Processors /omap TI E2E Community Wireless Connectivity /wirelessconnectivityMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2014,Texas Instruments Incorporated。

SN54LS393中文资料

Copyright © 1988, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date.Products conform to specifications per the terms of Texas Instrumentsstandard warranty. Production processing does not necessarily includetesting of all parameters.POST OFFICE BOX 655303 • DALLAS, TEXAS 752652POST OFFICE BOX 655303 • DALLAS, TEXAS 75265POST OFFICE BOX 655303 • DALLAS, TEXAS 752654POST OFFICE BOX 655303 • DALLAS, TEXAS 75265POST OFFICE BOX 655303 • DALLAS, TEXAS 752657 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265POST OFFICE BOX 655303 • DALLAS, TEXAS 75265PACKAGING INFORMATIONOrderableDevice Status (1)Package Type Package DrawingPins Package Qty Eco Plan (2)Lead/Ball FinishMSL Peak Temp (3)7802601EA ACTIVE CDIP J 161TBD Call TI Level-NC-NC-NC 7802601FA ACTIVE CFP W 161TBD Call TI Level-NC-NC-NC 7802601FA ACTIVE CFP W 161TBD Call TI Level-NC-NC-NC JM38510/32701B2A ACTIVE LCCC FK 201TBD Call TI Level-NC-NC-NC JM38510/32701B2A ACTIVE LCCC FK 201TBD Call TI Level-NC-NC-NC JM38510/32701BEA ACTIVE CDIP J 161TBD Call TI Level-NC-NC-NC JM38510/32701BEA ACTIVE CDIP J 161TBD Call TI Level-NC-NC-NC JM38510/32702B2A ACTIVE LCCC FK 201TBD Call TI Level-NC-NC-NC JM38510/32702B2A ACTIVE LCCC FK 201TBD Call TI Level-NC-NC-NC JM38510/32702BCA ACTIVE CDIP J 141TBD Call TI Level-NC-NC-NC JM38510/32702BCA ACTIVE CDIP J 141TBD Call TI Level-NC-NC-NC JM38510/32702BDA ACTIVE CFP W 141TBD Call TI Level-NC-NC-NC JM38510/32702BDA ACTIVE CFP W 141TBD Call TI Level-NC-NC-NC JM38510/32702SCA ACTIVE CDIP J 141TBD Call TI Level-NC-NC-NC JM38510/32702SCA ACTIVE CDIP J 141TBD Call TI Level-NC-NC-NC JM38510/32702SDA ACTIVE CFP W 141TBD Call TI Level-NC-NC-NC JM38510/32702SDAACTIVE CFP W 141TBD Call TI Level-NC-NC-NC SN54393J OBSOLETE CDIP J 14TBD Call TI Call TI SN54393J OBSOLETE CDIP J 14TBD Call TI Call TISN54LS390J ACTIVE CDIP J 161TBD Call TI Level-NC-NC-NC SN54LS390J ACTIVE CDIP J 161TBD Call TI Level-NC-NC-NC SN54LS393J ACTIVE CDIP J 141TBD Call TI Level-NC-NC-NC SN54LS393J ACTIVE CDIP J 141TBD Call TI Level-NC-NC-NC SN74390N OBSOLETE PDIP N 16TBD Call TI Call TI SN74390N OBSOLETE PDIP N 16TBD Call TI Call TI SN74393N OBSOLETE PDIP N 14TBD Call TI Call TI SN74393N OBSOLETE PDIP N 14TBD Call TI Call TI SN74393N3OBSOLETE PDIP N 14TBD Call TI Call TI SN74393N3OBSOLETE PDIP N 14TBD Call TI Call TISN74LS390D ACTIVE SOIC D 1640Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS390D ACTIVE SOIC D 1640Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS390DE4ACTIVE SOIC D 1640Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS390DE4ACTIVE SOIC D 1640Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS390DR ACTIVE SOIC D 162500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS390DR ACTIVE SOIC D 162500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS390DRE4ACTIVE SOIC D 162500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS390DRE4ACTIVESOICD162500Green (RoHS &CU NIPDAULevel-1-260C-UNLIMPACKAGE OPTION ADDENDUM17-Oct-2005Addendum-Page 1元器件交易网Orderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)no Sb/Br)SN74LS390N ACTIVE PDIP N1625Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74LS390N ACTIVE PDIP N1625Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NC SN74LS390N3OBSOLETE PDIP N16TBD Call TI Call TISN74LS390N3OBSOLETE PDIP N16TBD Call TI Call TISN74LS390NE4ACTIVE PDIP N1625Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74LS390NE4ACTIVE PDIP N1625Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74LS390NSR ACTIVE SO NS162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS390NSR ACTIVE SO NS162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS390NSRE4ACTIVE SO NS162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS390NSRE4ACTIVE SO NS162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS393D ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS393D ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS393DE4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS393DE4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS393DR ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS393DR ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS393DRE4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS393DRE4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS393J OBSOLETE CDIP J14TBD Call TI Call TISN74LS393J OBSOLETE CDIP J14TBD Call TI Call TISN74LS393N ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74LS393N ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NC SN74LS393N3OBSOLETE PDIP N14TBD Call TI Call TISN74LS393N3OBSOLETE PDIP N14TBD Call TI Call TISN74LS393NE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74LS393NE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74LS393NSR ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS393NSR ACTIVE SO NS142000Green(RoHS&CU NIPDAU Level-1-260C-UNLIMOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)no Sb/Br)SN74LS393NSRE4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS393NSRE4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SNJ54393J OBSOLETE CDIP J14TBD Call TI Call TISNJ54393J OBSOLETE CDIP J14TBD Call TI Call TISNJ54393W OBSOLETE CFP W14TBD Call TI Call TISNJ54393W OBSOLETE CFP W14TBD Call TI Call TISNJ54LS390FK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC SNJ54LS390FK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC SNJ54LS390J ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC SNJ54LS390J ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC SNJ54LS390W ACTIVE CFP W161TBD Call TI Level-NC-NC-NC SNJ54LS390W ACTIVE CFP W161TBD Call TI Level-NC-NC-NC SNJ54LS393FK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC SNJ54LS393FK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC SNJ54LS393J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC SNJ54LS393J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC SNJ54LS393W ACTIVE CFP W141TBD Call TI Level-NC-NC-NC SNJ54LS393W ACTIVE CFP W141TBD Call TI Level-NC-NC-NC (1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS)or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.元器件交易网IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,enhancements, improvements, and other changes to its products and services at any time and to discontinueany product or service without notice. Customers should obtain the latest relevant information before placingorders and should verify that such information is current and complete. All products are sold subject to TI’s termsand conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TIdeems necessary to support this warranty. Except where mandated by government requirements, testing of allparameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible fortheir products and applications using TI components. T o minimize the risks associated with customer productsand applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or processin which TI products or services are used. Information published by TI regarding third-party products or servicesdoes not constitute a license from TI to use such products or services or a warranty or endorsement thereof.Use of such information may require a license from a third party under the patents or other intellectual propertyof the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is withoutalteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproductionof this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable forsuch altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for thatproduct or service voids all express and any implied warranties for the associated TI product or service andis an unfair and deceptive business practice. TI is not responsible or liable for any such statements.Following are URLs where you can obtain information on other Texas Instruments products and applicationsolutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityTelephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2005, Texas Instruments Incorporated。

SN54LS243中文资料

Copyright © 1988, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date.Products conform to specifications per the terms of Texas Instrumentsstandard warranty. Production processing does not necessarily includetesting of all parameters.1POST OFFICE BOX 655303 • DALLAS, TEXAS 752652POST OFFICE BOX 655303 • DALLAS, TEXAS 752653 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265元器件交易网IMPORTANT NOTICETexas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinueany product or service without notice, and advise customers to obtain the latest version of relevant informationto verify, before placing orders, that information being relied on is current and complete. All products are soldsubject to the terms and conditions of sale supplied at the time of order acknowledgement, including thosepertaining to warranty, patent infringement, and limitation of liability.TI warrants performance of its semiconductor products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extentTI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarilyperformed, except those mandated by government requirements.CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OFDEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICALAPPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, ORWARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHERCRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TOBE FULLY AT THE CUSTOMER’S RISK.In order to minimize risks associated with the customer’s applications, adequate design and operatingsafeguards must be provided by the customer to minimize inherent or procedural hazards.TI assumes no liability for applications assistance or customer product design. TI does not warrant or representthat any license, either express or implied, is granted under any patent right, copyright, mask work right, or otherintellectual property right of TI covering or relating to any combination, machine, or process in which suchsemiconductor products or services might be or are used. TI’s publication of information regarding any thirdparty’s products or services does not constitute TI’s approval, warranty or endorsement thereof.Copyright © 1999, Texas Instruments Incorporated。

SN54LS123J中文资料

PRODUCTION DATA information is current as of publication date.Products conform to specifications per the terms of Texas Instrumentsstandard warranty. Production processing does not necessarily includetesting of all parameters.1POST OFFICE BOX 655303 • DALLAS, TEXAS 752652POST OFFICE BOX 655303 • DALLAS, TEXAS 752653 POST OFFICE BOX 655303 • DALLAS, TEXAS 752654POST OFFICE BOX 655303 • DALLAS, TEXAS 752655 POST OFFICE BOX 655303 • DALLAS, TEXAS 752656POST OFFICE BOX 655303 • DALLAS, TEXAS 752657 POST OFFICE BOX 655303 • DALLAS, TEXAS 752658POST OFFICE BOX 655303 • DALLAS, TEXAS 752659 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265PACKAGING INFORMATIONOrderable Device Status (1)Package Type Package DrawingPins Package Qty Eco Plan (2)Lead/Ball FinishMSL Peak Temp (3)5962-7603901VEA ACTIVE CDIP J 161None Call TI Level-NC-NC-NC 5962-7603901VFAACTIVE CFP W 161None Call TI Level-NC-NC-NC 7603901EA ACTIVE CDIP J 161None Call TI Level-NC-NC-NC 7603901FA ACTIVE CFP W 161None Call TI Level-NC-NC-NC JM38510/01203BEA ACTIVE CDIP J 161None Call TI Level-NC-NC-NC JM38510/31401B2A ACTIVE LCCC FK 201None Call TI Level-NC-NC-NC JM38510/31401BEA ACTIVE CDIP J 161None Call TI Level-NC-NC-NC JM38510/31401BFAACTIVE CFP W 161None Call TI Level-NC-NC-NC SN54122J OBSOLETE CDIP J 14None Call TI Call TISN54123J ACTIVE CDIP J 161None Call TI Level-NC-NC-NC SN54LS123J ACTIVE CDIP J 161None Call TI Level-NC-NC-NC SN74122N OBSOLETE PDIP N 14None Call TI Call TISN74123N ACTIVE PDIP N 1625Pb-Free (RoHS)CU NIPDAU Level-NC-NC-NC SN74123N3OBSOLETE PDIP N 16None Call TI Call TISN74LS122D ACTIVE SOIC D 1450Pb-Free (RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIM SN74LS122DR ACTIVE SOIC D 142500Pb-Free (RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIM SN74LS122N ACTIVE PDIP N 1425Pb-Free (RoHS)CU NIPDAU Level-NC-NC-NC SN74LS122N3OBSOLETE PDIP N 14None Call TI Call TISN74LS122NSR ACTIVE SO NS 142000Pb-Free (RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIM SN74LS123D ACTIVE SOIC D 1640Pb-Free (RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIM SN74LS123DR ACTIVE SOIC D 162500Pb-Free (RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIM SN74LS123J OBSOLETE CDIP J 16None Call TI Call TISN74LS123N ACTIVE PDIP N 1625Pb-Free (RoHS)CU NIPDAU Level-NC-NC-NC SN74LS123N3OBSOLETE PDIP N 16None Call TI Call TISN74LS123NSR ACTIVE SO NS 162000Pb-Free (RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIM SNJ54122J OBSOLETE CDIP J 14None Call TI Call TISNJ54123J ACTIVE CDIP J 161None Call TI Level-NC-NC-NC SNJ54123W ACTIVE CFP W 161None Call TI Level-NC-NC-NC SNJ54LS123FK ACTIVE LCCC FK 201None Call TI Level-NC-NC-NC SNJ54LS123J ACTIVE CDIP J 161None Call TI Level-NC-NC-NC SNJ54LS123WACTIVECFPW161NoneCall TILevel-NC-NC-NC(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.PACKAGE OPTION ADDENDUM28-Feb-2005Addendum-Page 1元器件交易网OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan -May not be currently available -please check /productcontent for the latest availability information and additional product content details.None:Not yet available Lead (Pb-Free).Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green (RoHS &no Sb/Br):TI defines "Green"to mean "Pb-Free"and in addition,uses package materials that do not contain halogens,including bromine (Br)or antimony (Sb)above 0.1%of total product weight.(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annualbasis.PACKAGE OPTION ADDENDUM 28-Feb-2005Addendum-Page 2IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. T o minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetwork Microcontrollers Security /securityTelephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2005, Texas Instruments Incorporated。

SN5408中文资料

Copyright © 1988, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date.PACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)JM38510/08003BCA ACTIVE CDIP J141TBD Call TI Level-NC-NC-NCJM38510/08003BDA ACTIVE CFP W141TBD Call TI Level-NC-NC-NCJM38510/08003BDA ACTIVE CFP W141TBD Call TI Level-NC-NC-NCJM38510/31004B2A ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NCJM38510/31004B2A ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NCJM38510/31004BCA ACTIVE CDIP J141TBD Call TI Level-NC-NC-NCJM38510/31004BCA ACTIVE CDIP J141TBD Call TI Level-NC-NC-NCJM38510/31004BDA ACTIVE CFP W141TBD Call TI Level-NC-NC-NCJM38510/31004BDA ACTIVE CFP W141TBD Call TI Level-NC-NC-NCJM38510/31004SCA ACTIVE CDIP J141TBD Call TI Level-NC-NC-NCJM38510/31004SCA ACTIVE CDIP J141TBD Call TI Level-NC-NC-NCJM38510/31004SDA ACTIVE CFP W141TBD Call TI Level-NC-NC-NCJM38510/31004SDA ACTIVE CFP W141TBD Call TI Level-NC-NC-NC SN54LS08J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC SN54LS08J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC SN54S08J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC SN54S08J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC SN7408N OBSOLETE PDIP N14TBD Call TI Call TISN7408N OBSOLETE PDIP N14TBD Call TI Call TISN7408N3OBSOLETE PDIP N14TBD Call TI Call TISN7408N3OBSOLETE PDIP N14TBD Call TI Call TISN74LS08D ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS08D ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS08DBR ACTIVE SSOP DB142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS08DBR ACTIVE SSOP DB142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS08DBRE4ACTIVE SSOP DB142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS08DBRE4ACTIVE SSOP DB142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS08DE4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS08DE4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS08DR ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS08DR ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS08DRE4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS08DRE4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS08J OBSOLETE CDIP J14TBD Call TI Call TIOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)SN74LS08J OBSOLETE CDIP J14TBD Call TI Call TISN74LS08N ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74LS08N ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NC SN74LS08N3OBSOLETE PDIP N14TBD Call TI Call TISN74LS08N3OBSOLETE PDIP N14TBD Call TI Call TISN74LS08NE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74LS08NE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74LS08NSR ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS08NSR ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS08NSRE4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS08NSRE4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS08NSRG4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS08NSRG4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S08D ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S08D ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S08DE4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S08DE4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S08DR ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S08DR ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S08DRE4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S08DRE4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74S08J OBSOLETE CDIP J14TBD Call TI Call TISN74S08J OBSOLETE CDIP J14TBD Call TI Call TISN74S08N ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74S08N ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NC SN74S08N3OBSOLETE PDIP N14TBD Call TI Call TISN74S08N3OBSOLETE PDIP N14TBD Call TI Call TISN74S08NE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NC SN74S08NE4ACTIVE PDIP N1425Pb-Free CU NIPDAU Level-NC-NC-NCOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)(RoHS)SN74S08NSR ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S08NSR ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S08NSRE4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S08NSRE4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SNJ54LS08FK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC SNJ54LS08FK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC SNJ54LS08J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC SNJ54LS08J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC SNJ54LS08W ACTIVE CFP W141TBD Call TI Level-NC-NC-NC SNJ54LS08W ACTIVE CFP W141TBD Call TI Level-NC-NC-NC SNJ54S08FK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC SNJ54S08FK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NCSNJ54S08J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NCSNJ54S08J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NCSNJ54S08W ACTIVE CFP W141TBD Call TI Level-NC-NC-NCSNJ54S08W ACTIVE CFP W141TBD Call TI Level-NC-NC-NC (1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS)or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.元器件交易网IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,enhancements, improvements, and other changes to its products and services at any time and to discontinueany product or service without notice. Customers should obtain the latest relevant information before placingorders and should verify that such information is current and complete. All products are sold subject to TI’s termsand conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TIdeems necessary to support this warranty. Except where mandated by government requirements, testing of allparameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible fortheir products and applications using TI components. T o minimize the risks associated with customer productsand applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or processin which TI products or services are used. Information published by TI regarding third-party products or servicesdoes not constitute a license from TI to use such products or services or a warranty or endorsement thereof.Use of such information may require a license from a third party under the patents or other intellectual propertyof the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is withoutalteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproductionof this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable forsuch altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for thatproduct or service voids all express and any implied warranties for the associated TI product or service andis an unfair and deceptive business practice. TI is not responsible or liable for any such statements.Following are URLs where you can obtain information on other Texas Instruments products and applicationsolutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityTelephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2005, Texas Instruments Incorporated。

SN5405, SN54LS05, SN54S05 TTL型反相器说明书

SN54LS05, SN54S05SN7405, SN74LS05, SN74S05HEX INVERTERS WITH OPENĆCOLLECTOR OUTPUTSSDLS030A − DECEMBER 1983 − REVISED NOVEMBER 20031POST OFFICE BOX 655303 •DALLAS, TEXAS 75265D Package Options Include PlasticSmall-Outline (D, NS), Shrink Small-Outline (DB), and Ceramic Flat (W) Packages,Ceramic Chip Carriers (FK), and Standard Plastic (N) and Ceramic (J) DIPsD Dependable Texas Instrument Quality andReliabilitySN5405, SN54LS05, SN54S05...J PACKAGESN7405...N PACKAGESN74LS05...D, DB, N, OR NS PACKAGE SN74S05...D, N, OR NS PACKAGE(TOP VIEW)12345671413121110981A 1Y 2A 2Y 3A 3Y GNDV CC 6A 6Y 5A 5Y 4A 4Y32120199101112134567818171615146Y NC 5A NC 5Y2A NC 2Y NC 3ASN54LS05, SN54S05...FK PACKAGE(TOP VIEW)1Y 1A N C 4A6A3Y G N D N C C CV 4Y NC − No internal connectionSN54LS05, SN54S05...W PACKAGE (TOP VIEW)12345671413121110981A 2Y 2A V CC 3A 3Y 4A1Y 6A 6Y GND 5Y 5A 4Ydescription/ordering informationThese devices contain six independent inverters. T o perform correctly, the open-collector outputs require pullup resistors. These devices may be connected to other open-collector outputs to implement active-low wired-OR or active-high wire-AND functions. Open-collector devices often are used to generate high V OH levels.ORDERING INFORMATIONT APACKAGE †ORDERABLE PART NUMBER TOP-SIDE MARKING SN7405NSN7405N SN74LS05N SN74LS05N PDIP − NTube SN74S05N SN74S05N TubeSN74LS05D Tape and reel SN74LS05DR LS050°C to 70°CSOIC − DTube SN74S05D Tape and reelSN74S05DR S05SN74LS05NSR 74LS05SOP − NS Tape and reel SN74S05NSR 74S05SSOP − DB Tape and reel SN74LS05DBR LS05SNJ54LS05J SNJ54LS05J CDIP − JTube SNJ54S05J SNJ54S05J SNJ54LS05W SNJ54LS05W −55°C to 125°CCDIP − W Tube SNJ54S05W SNJ54S05W SNJ54LS05FK SNJ54LS05FK LCCC − FKTubeSNJ54S05FKSNJ54S05FK†Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at /sc/package.The SN5405 is obsolete and no longer is supplied.Copyright 2003, Texas Instruments IncorporatedPRODUCTION DATA information is current as of publication date.Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.On products compliant to MILĆPRFĆ38535, all parameters are tested unless otherwise noted. On all other products, production processing does not necessarily include testing of all parameters.SN54LS05, SN54S05SN7405, SN74LS05, SN74S05HEX INVERTERS WITH OPENĆCOLLECTOR OUTPUTSSDLS030A − DECEMBER 1983 − REVISED NOVEMBER 20032POST OFFICE BOX 655303 •DALLAS, TEXAS 75265FUNCTION TABLE (each inverter)INPUT OUTPUTA YH L LHlogic diagram (positive logic)1A2A3A4A5A6A 1Y2Y3Y4Y5Y6Y1359111324681012Y = APin numbers shown are for the D, DB, J, N, and NS packages.The SN5405 is obsolete and no longer is supplied.SN54LS05, SN54S05SN7405, SN74LS05, SN74S05HEX INVERTERS WITH OPENĆCOLLECTOR OUTPUTSSDLS030A − DECEMBER 1983 − REVISED NOVEMBER 20033POST OFFICE BOX 655303 •DALLAS, TEXAS 75265schematic (each inverter)Resistor values shown are nominal.4 k ΩInputAOutput YGNDV CC1.6 k Ω1 k Ω’0520 k ΩInputAOutput YV CC8 k Ω4.5 k Ω’LS05GND2.8 k ΩOutput YV CC900 Ω500 Ω’S05InputA250 Ωabsolute maximum ratings over operating free-air temperature (unless otherwise noted)†Supply voltage, V CC (see Note 1): ’05, ’LS05, ’S05 7 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Input voltage, V I : ’05, ’S05 5.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ’LS05 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Off-state output voltage, V O 7 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Package thermal impedance, θJA (see Note 2):D package 86°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DB package 96°C/W . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . N package 80°C/W . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . NS package 76°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Storage temperature range, T stg −65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . †Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.NOTES: 1.Voltage values are with respect to network ground terminal.2.The package thermal impedance is calculated in accordance with JESD 51-7.The SN5405 is obsolete and no longer is supplied.SN54LS05, SN54S05SN7405, SN74LS05, SN74S05HEX INVERTERS WITH OPENĆCOLLECTOR OUTPUTSSDLS030A − DECEMBER 1983 − REVISED NOVEMBER 20034POST OFFICE BOX 655303 •DALLAS, TEXAS 75265recommended operating conditionsSN5405SN7405MINNOMMAX MIN NOMMAX UNIT V CC Supply voltage 4.555.54.7555.25V V IH High-level input voltage 22V V IL Low-level input voltage 0.80.8V V OH High-level output voltage 5.5 5.5V I OL Low-level output current 1616mA T AOperating free-air temperature−5512570°Celectrical characteristics over recommended operating free-air temperature range (unless otherwise noted)†SN5405SN7405PARAMETER TEST CONDITIONS MIN TYP ‡MAX MIN TYP ‡MAX UNIT V IK V CC = MIN,I I = −12 mA −1.5−1.5V I V V V IL = 0.8 V 0.25OH CC = MIN,OH = 5.5 V V IL = 0.7 V 0.25mA V OL V CC = MIN,V IH = 2 V,I OL = 16 mA0.20.40.20.4V I I V CC = MAX,V I = 5.5 V 11mA I IH V CC = MAX,V I = 2.4 V 4040µA I IL V CC = MAX,V I = 0.4 V −1.6−1.6mA I CCH V CC = MAX,V I = 0 V 612612mA I CCLV CC = MAX,V I = 4.5 V18331833mA†For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions.‡All typical values are at V CC = 5 V, T A = 25°C.switching characteristics, V CC = 5 V, T A = 25°C (see Figure 1)PARAMETERFROM (INPUT)TO (OUTPUT)TEST CONDITIONS MINTYP MAX UNIT t PLH R L = 4 k ΩL 4055t PHLAYR L = 400 ΩC = 15 pF815nsThe SN5405 is obsolete and no longer is supplied.SN54LS05, SN54S05SN7405, SN74LS05, SN74S05HEX INVERTERS WITH OPENĆCOLLECTOR OUTPUTSSDLS030A − DECEMBER 1983 − REVISED NOVEMBER 20035POST OFFICE BOX 655303 •DALLAS, TEXAS 75265recommended operating conditionsSN54LS05SN74LS05MINNOMMAX MIN NOMMAX UNIT V CC Supply voltage 4.555.54.7555.25V V IH High-level input voltage 22V V IL Low-level input voltage 0.70.8V V OH High-level output voltage 5.5 5.5V I OL Low-level output current 48mA T AOperating free-air temperature−5512570°Celectrical characteristics over recommended operating free-air temperature range (unless otherwise noted)SN54LS05SN74LS05PARAMETER TEST CONDITIONS †MIN TYP ‡MAXMIN TYP ‡MAXUNIT V IK V CC = MIN,I I = −18 mA −1.5−1.5V I OH V CC = MIN,V IL = MAX,V OH = 5.5 V0.10.1mA V V V I OL = 4 mA 0.250.40.250.4OL CC = MIN,IH = 2 V I OL = 8 mA0.350.5V I I V CC = MAX,V I = 7 V 0.10.1mA I IH V CC = MAX,V I = 2.7 V 2020µA I IL V CC = MAX,V I = 0.4 V −0.4−0.4mA I CCHV CC = MAX,V I = 0 V1.22.41.22.4mA I CCL V CC = MAX,V I = 4.5 V3.6 6.6 3.66.6mA†For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions.‡All typical values are at V CC = 5 V, T A = 25°C.switching characteristics, V CC = 5 V, T A = 25°C (see Figure 2)PARAMETERFROM (INPUT)TO (OUTPUT)TEST CONDITIONS MINTYP MAX UNIT t PLH L ΩL 1732t PHLAYR = 2 k ,C = 15 pF1528nsThe SN5405 is obsolete and no longer is supplied.SN54LS05, SN54S05SN7405, SN74LS05, SN74S05HEX INVERTERS WITH OPENĆCOLLECTOR OUTPUTSSDLS030A − DECEMBER 1983 − REVISED NOVEMBER 20036POST OFFICE BOX 655303 •DALLAS, TEXAS 75265recommended operating conditionsSN54S05SN74S05MINNOMMAX MIN NOMMAX UNIT V CC Supply voltage 4.555.54.7555.25V V IH High-level input voltage 22V V IL Low-level input voltage 0.80.8V V OH High-level output voltage 5.5 5.5V I OL Low-level output current 2020mA T AOperating free-air temperature−5512570°Celectrical characteristics over recommended operating free-air temperature range (unless otherwise noted)†SN54S05SN74S05PARAMETER TEST CONDITIONS MIN TYP ‡MAXMIN TYP ‡MAXUNIT V IK V CC = MIN,I I = −18 mA −1.2−1.2V I V V V IL = 0.8 V 0.25OH CC = MIN,OH = 5.5 V V IL = 0.7 V 0.25mA V OL V CC = MIN,V IH = 2 V,I OL = 20 mA0.50.5V I I V CC = MAX,V I = 5.5 V 11mA I IH V CC = MAX,V I = 2.7 V 5050µA I IL V CC = MAX,V I = 0.5 V −2−2mA I CCH V CC = MAX,V I = 0 V 919.8919.8mA I CCLV CC = MAX,V I = 4.5 V30543054mA†For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions.‡All typical values are at V CC = 5 V, T A = 25°C.switching characteristics, V CC = 5 V, T A = 25°C (see Figure 1)PARAMETERFROM (INPUT)TO (OUTPUT)TEST CONDITIONSMIN TYP MAX UNIT t PLH L 257.5t PHL L C = 15 pF24.57nst PLH AYR = 280 ΩL 7.5t PHLC = 50 pF7nsThe SN5405 is obsolete and no longer is supplied.SN54LS05, SN54S05SN7405, SN74LS05, SN74S05HEX INVERTERS WITH OPENĆCOLLECTOR OUTPUTSSDLS030A − DECEMBER 1983 − REVISED NOVEMBER 20037POST OFFICE BOX 655303 •DALLAS, TEXAS 75265PARAMETER MEASUREMENT INFORMATIONSERIES 54/74 AND 54S/74S DEVICESFrom Output Under TestC L(see Note A)R LTest PointV CCLOAD CIRCUIT1.5 V1.5 VHigh-LevelPulse1.5 V1.5 Vt wLow-LevelPulseVOLTAGE WAVEFORMSPULSE WIDTHSNOTES: A.C L includes probe and jig capacitance.B.In the examples above, the phase relationships between inputs and outputs have been chosen arbitrarily.C.All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, Z O = 50 Ω, and:For Series 54/74, t r ≤ 7 ns, t f ≤ 7 ns.For Series 54S/74S, t r ≤ 2.5 ns, t f ≤ 2.5 ns.D.The outputs are measured one at a time with one input transition per measurement.1.5 V1.5 VInputt PLHIn-Phase Output3 V0 V 1.5 V1.5 VV OHV OL t PHL1.5 V1.5 VV OHV OLt PHLt PLHOut-of-PhaseOutputVOLTAGE WAVEFORMS PROPAGATION DELAY TIMESFigure 1. Load Circuit and Voltage WaveformsThe SN5405 is obsolete and no longer is supplied.SN54LS05, SN54S05SN7405, SN74LS05, SN74S05HEX INVERTERS WITH OPENĆCOLLECTOR OUTPUTSSDLS030A − DECEMBER 1983 − REVISED NOVEMBER 20038POST OFFICE BOX 655303 •DALLAS, TEXAS 75265PARAMETER MEASUREMENT INFORMATIONSERIES 54LS/74LS DEVICESFrom Output Under TestC L(see Note A)R LTest PointV CCLOAD CIRCUIT1.3 V1.3 VHigh-LevelPulse1.3 V1.3 Vt wLow-LevelPulseVOLTAGE WAVEFORMSPULSE WIDTHSNOTES: A.C L includes probe and jig capacitance.B.In the examples above, the phase relationships between inputs and outputs have been chosen arbitrarily.C.All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, Z O = 50 Ω, t r ≤ 1.5 ns, t f ≤ 2.6 ns.D.The outputs are measured one at a time with one input transition per measurement.1.3 V1.3 VInputt PLHIn-Phase Output3 V0 V 1.3 V1.3 VV OHV OL t PHL1.3 V1.3 VV OHV OLt PHLt PLHOut-of-PhaseOutputVOLTAGE WAVEFORMS PROPAGATION DELAY TIMESFigure 2. Load Circuit and Voltage WaveformsThe SN5405 is obsolete and no longer is supplied.PACKAGING INFORMATIONAddendum-Page 1(1) The marketing status values are defined as follows:ACTIVE: Product device recommended for new designs.LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free".RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement.(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device.(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.Addendum-Page 2PACKAGE OPTION ADDENDUM 11-Apr-2023OTHER QUALIFIED VERSIONS OF SN54LS05, SN54S05, SN74LS05, SN74S05 :•Catalog : SN74LS05, SN74S05•Military : SN54LS05, SN54S05NOTE: Qualified Version Definitions:•Catalog - TI's standard catalog product•Military - QML certified for Military and Defense ApplicationsAddendum-Page 3 1-Jul-2023TAPE AND REEL INFORMATIONA0B0K0WDimension designed to accommodate the component length Dimension designed to accommodate the component thickness Overall width of the carrier tape Pitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONS Sprocket Holes P1*All dimensions are nominal Device Package Type Package DrawingPinsSPQ Reel Diameter (mm)Reel Width W1 (mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant SN74LS05DBR SSOPDB 142000330.016.48.35 6.6 2.412.016.0Q1SN74LS05DR SOICD 142500330.016.4 6.59.0 2.18.016.0Q1SN74LS05NSR SONS 142000330.016.48.210.5 2.512.016.0Q1SN74S05NSR SO NS 142000330.016.48.210.5 2.512.016.0Q11-Jul-2023*All dimensions are nominalDevice Package Type Package Drawing Pins SPQ Length (mm)Width (mm)Height (mm) SN74LS05DBR SSOP DB142000356.0356.035.0SN74LS05DR SOIC D142500356.0356.035.0SN74LS05NSR SO NS142000356.0356.035.0SN74S05NSR SO NS142000356.0356.035.01-Jul-2023 TUBET - Tube*All dimensions are nominalDevice Package Name Package Type Pins SPQ L (mm)W (mm)T (µm) B (mm)SN7405N N PDIP142550613.9711230 4.32SN7405N N PDIP142550613.9711230 4.32SN7405NE4N PDIP142550613.9711230 4.32SN7405NE4N PDIP142550613.9711230 4.32SN74LS05D D SOIC1450506.683940 4.32SN74LS05N N PDIP142550613.9711230 4.32SN74LS05N N PDIP142550613.9711230 4.32SN74LS05NE4N PDIP142550613.9711230 4.32SN74LS05NE4N PDIP142550613.9711230 4.32SN74S05D D SOIC1450506.683940 4.32SN74S05N N PDIP142550613.9711230 4.32SN74S05N N PDIP142550613.9711230 4.32SNJ54LS05FK FK LCCC201506.9812.062030NASNJ54LS05W W CFP141506.9826.166220NASNJ54S05FK FK LCCC201506.9812.062030NAGENERIC PACKAGE VIEWThis image is a representation of the package family, actual package may vary.Refer to the product data sheet for package details.LCCC - 2.03 mm max height FK 20LEADLESS CERAMIC CHIP CARRIER8.89 x 8.89, 1.27 mm pitchPACKAGE OUTLINECDIP - 5.08 mm max heightJ0014A CERAMIC DUAL IN LINE PACKAGENOTES:1. All controlling linear dimensions are in inches. Dimensions in brackets are in millimeters. Any dimension in brackets or parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M.2. This drawing is subject to change without notice.3. This package is hermitically sealed with a ceramic lid using glass frit.4. Index point is provided on cap for terminal identification only and on press ceramic glass frit seal only.5. Falls within MIL-STD-1835 and GDIP1-T14.EXAMPLE BOARD LAYOUTCDIP - 5.08 mm max heightJ0014A CERAMIC DUAL IN LINE PACKAGEMECHANICAL DATAMSSO002E – JANUARY 1995 – REVISED DECEMBER 2001POST OFFICE BOX 655303 •DALLAS, TEXAS 75265DB (R-PDSO-G**)PLASTIC SMALL-OUTLINE4040065/E 12/0128 PINS SHOWNGage Plane8,207,400,550,950,253812,9012,302810,50248,50Seating Plane9,907,903010,509,900,385,605,00150,2214A 28120166,506,50140,05 MIN 5,905,90DIMA MAX A MIN PINS **2,00 MAX 6,907,500,65M 0,150°–ā8°0,100,090,25NOTES: A.All linear dimensions are in millimeters.B.This drawing is subject to change without notice.C.Body dimensions do not include mold flash or protrusion not to exceed 0,15.D.Falls within JEDEC MO-150IMPORTANT NOTICE AND DISCLAIMERTI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATA SHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS.These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable standards, and any other safety, security, regulatory or other requirements.These resources are subject to change without notice. TI grants you permission to use these resources only for development of an application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these resources.TI’s products are provided subject to TI’s Terms of Sale or other applicable terms available either on or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for TI products.TI objects to and rejects any additional or different terms you may have proposed.Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265Copyright © 2023, Texas Instruments Incorporated。

SN54265资料

IMPORTANT NOTICETexas Instruments (TI) reserves the right to make changes to its products or to discontinue any semiconductor product or service without notice, and advises its customers to obtain the latest version of relevant information to verify, before placing orders, that the information being relied on is current.TI warrants performance of its semiconductor products and related software to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements.Certain applications using semiconductor products may involve potential risks of death, personal injury, or severe property or environmental damage (“Critical Applications”).TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED, OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES OR SYSTEMS OR OTHER CRITICAL APPLICATIONS.Inclusion of TI products in such applications is understood to be fully at the risk of the customer. Use of TI products in such applications requires the written approval of an appropriate TI officer. Questions concerning potential risk applications should be directed to TI through a local SC sales office.In order to minimize risks associated with the customer’s applications, adequate design and operating safeguards should be provided by the customer to minimize inherent or procedural hazards.TI assumes no liability for applications assistance, customer product design, software performance, or infringement of patents or services described herein. Nor does TI warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used.Copyright © 1996, Texas Instruments Incorporated。

SN54LS320中文资料

Copyright © 1988, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date.Products conform to specifications per the terms of Texas Instrumentsstandard warranty. Production processing does not necessarily includetesting of all parameters.POST OFFICE BOX 655303 • DALLAS, TEXAS 75265POST OFFICE BOX 655303 • DALLAS, TEXAS 752653 POST OFFICE BOX 655303 • DALLAS, TEXAS 752654POST OFFICE BOX 655303 • DALLAS, TEXAS 75265POST OFFICE BOX 655303 • DALLAS, TEXAS 75265元器件交易网IMPORTANT NOTICETexas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinueany product or service without notice, and advise customers to obtain the latest version of relevant informationto verify, before placing orders, that information being relied on is current and complete. All products are soldsubject to the terms and conditions of sale supplied at the time of order acknowledgement, including thosepertaining to warranty, patent infringement, and limitation of liability.TI warrants performance of its semiconductor products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extentTI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarilyperformed, except those mandated by government requirements.CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OFDEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICALAPPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, ORWARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHERCRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TOBE FULLY AT THE CUSTOMER’S RISK.In order to minimize risks associated with the customer’s applications, adequate design and operatingsafeguards must be provided by the customer to minimize inherent or procedural hazards.TI assumes no liability for applications assistance or customer product design. TI does not warrant or representthat any license, either express or implied, is granted under any patent right, copyright, mask work right, or otherintellectual property right of TI covering or relating to any combination, machine, or process in which suchsemiconductor products or services might be or are used. TI’s publication of information regarding any thirdparty’s products or services does not constitute TI’s approval, warranty or endorsement thereof.Copyright © 1999, Texas Instruments Incorporated。

SN54LS132中文资料

DC CHARACTERISTICS OVER OPERATING TEMPERATURE RANGE (unless otherwise specified)
Limits Symbol VT+ VT– VT + – VT– VIK VOH Parameter Positive-Going Threshold Voltage Negative-Going Threshold Voltage Hysteresis Input Clamp Diode Voltage 54 Output HIGH Voltage 74 54, 74 VOL IT+ IT– IIH IIL IOS ICC Output LOW Voltage 74 Input Current at Positive-Going Threshold Input Current at Negative-Going Threshold Input HIGH Current 0.1 Input LOW Current Output Short Circuit Current (Note 1) Power Supply Current Total, Output HIGH Total, Output LOW – 20 5.9 8.2 – 0.4 –100 11 14 0.35 – 0.14 – 0.18 20 0.5 V mA mA µA mA mA mA mA mA 2.7 3.4 0.25 0.4 V 2.5 Min 1.5 0.6 0.4 0.8 – 0.65 3.4 V – 1.5 Typ Max 2.0 1.1 Unit V V V V Test Conditions VCC = 5.0 V VCC = 5.0 V VCC = 5.0 V VCC = MIN, IIN = – 18 mA VCC = MIN, IOH = – 400 µA, VIN = VIL VCC = MIN, IOL = 4.0 mA, VIN = 2.0 V VCC = MIN, IOL = 8.0 mA, VIN = 2.0 V VCC = 5.0 V, VIN = VT+ VCC = 5.0 V, VIN = VT– VCC = MAX, VIN = 2.7 V VCC = MAX, VIN = 7.0 V VCC = MAX, VIN = 0.4 V VCC = MAX, VOUT = 0 V VCC = MAX, VIN = 0 V VCC = MAX, VIN = 4.5 V

SN54AS575JT中文资料

元器件交易网IMPORTANT NOTICETexas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinueany product or service without notice, and advise customers to obtain the latest version of relevant informationto verify, before placing orders, that information being relied on is current and complete. All products are soldsubject to the terms and conditions of sale supplied at the time of order acknowledgement, including thosepertaining to warranty, patent infringement, and limitation of liability.TI warrants performance of its semiconductor products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extentTI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarilyperformed, except those mandated by government requirements.CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OFDEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICALAPPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, ORWARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHERCRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TOBE FULLY AT THE CUSTOMER’S RISK.In order to minimize risks associated with the customer’s applications, adequate design and operatingsafeguards must be provided by the customer to minimize inherent or procedural hazards.TI assumes no liability for applications assistance or customer product design. TI does not warrant or representthat any license, either express or implied, is granted under any patent right, copyright, mask work right, or otherintellectual property right of TI covering or relating to any combination, machine, or process in which suchsemiconductor products or services might be or are used. TI’s publication of information regarding any thirdparty’s products or services does not constitute TI’s approval, warranty or endorsement thereof.Copyright © 1998, Texas Instruments Incorporated。

SN54AS879中文资料

元器件交易网IMPORTANT NOTICETexas Instruments (TI) reserves the right to make changes to its products or to discontinue any semiconductorproduct or service without notice, and advises its customers to obtain the latest version of relevant informationto verify, before placing orders, that the information being relied on is current.TI warrants performance of its semiconductor products and related software to the specifications applicable atthe time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques areutilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of eachdevice is not necessarily performed, except those mandated by government requirements.Certain applications using semiconductor products may involve potential risks of death, personal injury, orsevere property or environmental damage (“Critical Applications”).TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED, OR WARRANTEDTO BE SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES OR SYSTEMS OR OTHERCRITICAL APPLICATIONS.Inclusion of TI products in such applications is understood to be fully at the risk of the customer. Use of TIproducts in such applications requires the written approval of an appropriate TI officer. Questions concerningpotential risk applications should be directed to TI through a local SC sales office.In order to minimize risks associated with the customer’s applications, adequate design and operatingsafeguards should be provided by the customer to minimize inherent or procedural hazards.TI assumes no liability for applications assistance, customer product design, software performance, orinfringement of patents or services described herein. Nor does TI warrant or represent that any license, eitherexpress or implied, is granted under any patent right, copyright, mask work right, or other intellectual propertyright of TI covering or relating to any combination, machine, or process in which such semiconductor productsor services might be or are used.Copyright © 1996, Texas Instruments Incorporated。

SNJ54LS123FK中文资料

PRODUCTION DATA information is current as of publication date.Products conform to specifications per the terms of Texas Instrumentsstandard warranty. Production processing does not necessarily includetesting of all parameters.1POST OFFICE BOX 655303 • DALLAS, TEXAS 752652POST OFFICE BOX 655303 • DALLAS, TEXAS 752653 POST OFFICE BOX 655303 • DALLAS, TEXAS 752654POST OFFICE BOX 655303 • DALLAS, TEXAS 752655 POST OFFICE BOX 655303 • DALLAS, TEXAS 752656POST OFFICE BOX 655303 • DALLAS, TEXAS 752657 POST OFFICE BOX 655303 • DALLAS, TEXAS 752658POST OFFICE BOX 655303 • DALLAS, TEXAS 752659 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265PACKAGING INFORMATIONOrderable Device Status (1)Package Type Package DrawingPins Package Qty Eco Plan (2)Lead/Ball FinishMSL Peak Temp (3)5962-7603901VEA ACTIVE CDIP J 161None Call TI Level-NC-NC-NC 5962-7603901VFAACTIVE CFP W 161None Call TI Level-NC-NC-NC 7603901EA ACTIVE CDIP J 161None Call TI Level-NC-NC-NC 7603901FA ACTIVE CFP W 161None Call TI Level-NC-NC-NC JM38510/01203BEA ACTIVE CDIP J 161None Call TI Level-NC-NC-NC JM38510/31401B2A ACTIVE LCCC FK 201None Call TI Level-NC-NC-NC JM38510/31401BEA ACTIVE CDIP J 161None Call TI Level-NC-NC-NC JM38510/31401BFAACTIVE CFP W 161None Call TI Level-NC-NC-NC SN54122J OBSOLETE CDIP J 14None Call TI Call TISN54123J ACTIVE CDIP J 161None Call TI Level-NC-NC-NC SN54LS123J ACTIVE CDIP J 161None Call TI Level-NC-NC-NC SN74122N OBSOLETE PDIP N 14None Call TI Call TISN74123N ACTIVE PDIP N 1625Pb-Free (RoHS)CU NIPDAU Level-NC-NC-NC SN74123N3OBSOLETE PDIP N 16None Call TI Call TISN74LS122D ACTIVE SOIC D 1450Pb-Free (RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIM SN74LS122DR ACTIVE SOIC D 142500Pb-Free (RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIM SN74LS122N ACTIVE PDIP N 1425Pb-Free (RoHS)CU NIPDAU Level-NC-NC-NC SN74LS122N3OBSOLETE PDIP N 14None Call TI Call TISN74LS122NSR ACTIVE SO NS 142000Pb-Free (RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIM SN74LS123D ACTIVE SOIC D 1640Pb-Free (RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIM SN74LS123DR ACTIVE SOIC D 162500Pb-Free (RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIM SN74LS123J OBSOLETE CDIP J 16None Call TI Call TISN74LS123N ACTIVE PDIP N 1625Pb-Free (RoHS)CU NIPDAU Level-NC-NC-NC SN74LS123N3OBSOLETE PDIP N 16None Call TI Call TISN74LS123NSR ACTIVE SO NS 162000Pb-Free (RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIM SNJ54122J OBSOLETE CDIP J 14None Call TI Call TISNJ54123J ACTIVE CDIP J 161None Call TI Level-NC-NC-NC SNJ54123W ACTIVE CFP W 161None Call TI Level-NC-NC-NC SNJ54LS123FK ACTIVE LCCC FK 201None Call TI Level-NC-NC-NC SNJ54LS123J ACTIVE CDIP J 161None Call TI Level-NC-NC-NC SNJ54LS123WACTIVECFPW161NoneCall TILevel-NC-NC-NC(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.PACKAGE OPTION ADDENDUM28-Feb-2005Addendum-Page 1元器件交易网OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan -May not be currently available -please check /productcontent for the latest availability information and additional product content details.None:Not yet available Lead (Pb-Free).Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green (RoHS &no Sb/Br):TI defines "Green"to mean "Pb-Free"and in addition,uses package materials that do not contain halogens,including bromine (Br)or antimony (Sb)above 0.1%of total product weight.(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annualbasis.PACKAGE OPTION ADDENDUM 28-Feb-2005Addendum-Page 2IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. T o minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetwork Microcontrollers Security /securityTelephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2005, Texas Instruments Incorporated。

SN54132中文资料

Copyright © 1988, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date.Products conform to specifications per the terms of Texas Instrumentsstandard warranty. Production processing does not necessarily includetesting of all parameters.POST OFFICE BOX 655303 • DALLAS, TEXAS 75265元器件交易网IMPORTANT NOTICETexas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinueany product or service without notice, and advise customers to obtain the latest version of relevant informationto verify, before placing orders, that information being relied on is current and complete. All products are soldsubject to the terms and conditions of sale supplied at the time of order acknowledgement, including thosepertaining to warranty, patent infringement, and limitation of liability.TI warrants performance of its semiconductor products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extentTI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarilyperformed, except those mandated by government requirements.CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OFDEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICALAPPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, ORWARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHERCRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TOBE FULLY AT THE CUSTOMER’S RISK.In order to minimize risks associated with the customer’s applications, adequate design and operatingsafeguards must be provided by the customer to minimize inherent or procedural hazards.TI assumes no liability for applications assistance or customer product design. TI does not warrant or representthat any license, either express or implied, is granted under any patent right, copyright, mask work right, or otherintellectual property right of TI covering or relating to any combination, machine, or process in which suchsemiconductor products or services might be or are used. TI’s publication of information regarding any thirdparty’s products or services does not constitute TI’s approval, warranty or endorsement thereof.Copyright © 1999, Texas Instruments Incorporated。

SN54LS38FK中文资料

Copyright © 1988, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date.PACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)JM38510/00303BCA ACTIVE CDIP J141TBD Call TI Level-NC-NC-NCJM38510/30203B2A ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NCJM38510/30203B2A ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NCJM38510/30203BCA ACTIVE CDIP J141TBD Call TI Level-NC-NC-NCJM38510/30203BCA ACTIVE CDIP J141TBD Call TI Level-NC-NC-NCJM38510/30203BDA ACTIVE CFP W141TBD Call TI Level-NC-NC-NCJM38510/30203BDA ACTIVE CFP W141TBD Call TI Level-NC-NC-NC SN5438J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC SN5438J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC SN54LS38J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC SN54LS38J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC SN54S38J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC SN54S38J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC SN7438D ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN7438D ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN7438DE4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN7438DE4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN7438DR ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN7438DR ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN7438DRE4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN7438DRE4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN7438J OBSOLETE CDIP J14TBD Call TI Call TISN7438J OBSOLETE CDIP J14TBD Call TI Call TISN7438N ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN7438N ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NC SN7438N3OBSOLETE PDIP N14TBD Call TI Call TISN7438N3OBSOLETE PDIP N14TBD Call TI Call TISN7438NE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN7438NE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN7438NSR ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN7438NSR ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN7438NSRE4ACTIVE SO NS142000Green(RoHS&CU NIPDAU Level-1-260C-UNLIMOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)no Sb/Br)SN7438NSRE4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS38D ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS38D ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS38DBRG4ACTIVE SSOP DB142000Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARSN74LS38DBRG4ACTIVE SSOP DB142000Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARSN74LS38DE4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS38DE4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS38DR ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS38DR ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS38DRE4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS38DRE4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS38N ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74LS38N ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NC SN74LS38N3OBSOLETE PDIP N14TBD Call TI Call TISN74LS38N3OBSOLETE PDIP N14TBD Call TI Call TISN74LS38NE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74LS38NE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74LS38NSR ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS38NSR ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS38NSRG4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS38NSRG4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S38D ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S38D ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S38DE4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S38DE4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S38DR ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)SN74S38DR ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S38DRE4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S38DRE4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S38N ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74S38N ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NC SN74S38N3OBSOLETE PDIP N14TBD Call TI Call TISN74S38N3OBSOLETE PDIP N14TBD Call TI Call TISN74S38NE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74S38NE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74S38NSR ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S38NSR ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S38NSRE4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S38NSRE4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SNJ5438J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NCSNJ5438J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NCSNJ5438W ACTIVE CFP W141TBD Call TI Level-NC-NC-NCSNJ5438W ACTIVE CFP W141TBD Call TI Level-NC-NC-NC SNJ54LS38FK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC SNJ54LS38FK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC SNJ54LS38J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC SNJ54LS38J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC SNJ54LS38W ACTIVE CFP W141TBD Call TI Level-NC-NC-NC SNJ54LS38W ACTIVE CFP W141TBD Call TI Level-NC-NC-NC SNJ54S38FK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC SNJ54S38FK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NCSNJ54S38J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NCSNJ54S38J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NCSNJ54S38W ACTIVE CFP W141TBD Call TI Level-NC-NC-NCSNJ54S38W ACTIVE CFP W141TBD Call TI Level-NC-NC-NC (1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS)or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.元器件交易网元器件交易网IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,enhancements, improvements, and other changes to its products and services at any time and to discontinueany product or service without notice. Customers should obtain the latest relevant information before placingorders and should verify that such information is current and complete. All products are sold subject to TI’s termsand conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TIdeems necessary to support this warranty. Except where mandated by government requirements, testing of allparameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible fortheir products and applications using TI components. T o minimize the risks associated with customer productsand applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or processin which TI products or services are used. Information published by TI regarding third-party products or servicesdoes not constitute a license from TI to use such products or services or a warranty or endorsement thereof.Use of such information may require a license from a third party under the patents or other intellectual propertyof the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is withoutalteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproductionof this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable forsuch altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for thatproduct or service voids all express and any implied warranties for the associated TI product or service andis an unfair and deceptive business practice. TI is not responsible or liable for any such statements.Following are URLs where you can obtain information on other Texas Instruments products and applicationsolutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityTelephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2005, Texas Instruments Incorporated。

SN54LS95BJ资料

Copyright © 1988, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date.Products conform to specifications per the terms of Texas Instrumentsstandard warranty. Production processing does not necessarily includetesting of all parameters.POST OFFICE BOX 655303 • DALLAS, TEXAS 752652POST OFFICE BOX 655303 • DALLAS, TEXAS 752653 POST OFFICE BOX 655303 • DALLAS, TEXAS 752654POST OFFICE BOX 655303 • DALLAS, TEXAS 752655 POST OFFICE BOX 655303 • DALLAS, TEXAS 752656POST OFFICE BOX 655303 • DALLAS, TEXAS 75265POST OFFICE BOX 655303 • DALLAS, TEXAS 75265元器件交易网IMPORTANT NOTICETexas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinueany product or service without notice, and advise customers to obtain the latest version of relevant informationto verify, before placing orders, that information being relied on is current and complete. All products are soldsubject to the terms and conditions of sale supplied at the time of order acknowledgement, including thosepertaining to warranty, patent infringement, and limitation of liability.TI warrants performance of its semiconductor products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extentTI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarilyperformed, except those mandated by government requirements.CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OFDEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICALAPPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, ORWARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHERCRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TOBE FULLY AT THE CUSTOMER’S RISK.In order to minimize risks associated with the customer’s applications, adequate design and operatingsafeguards must be provided by the customer to minimize inherent or procedural hazards.TI assumes no liability for applications assistance or customer product design. TI does not warrant or representthat any license, either express or implied, is granted under any patent right, copyright, mask work right, or otherintellectual property right of TI covering or relating to any combination, machine, or process in which suchsemiconductor products or services might be or are used. TI’s publication of information regarding any thirdparty’s products or services does not constitute TI’s approval, warranty or endorsement thereof.Copyright © 1999, Texas Instruments Incorporated。

SN54S436资料

Copyright © 1988, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date.Products conform to specifications per the terms of Texas Instrumentsstandard warranty. Production processing does not necessarily includetesting of all parameters.POST OFFICE BOX 655303 • DALLAS, TEXAS 752652POST OFFICE BOX 655303 • DALLAS, TEXAS 75265POST OFFICE BOX 655303 • DALLAS, TEXAS 75265元器件交易网IMPORTANT NOTICETexas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinueany product or service without notice, and advise customers to obtain the latest version of relevant informationto verify, before placing orders, that information being relied on is current and complete. All products are soldsubject to the terms and conditions of sale supplied at the time of order acknowledgement, including thosepertaining to warranty, patent infringement, and limitation of liability.TI warrants performance of its semiconductor products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extentTI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarilyperformed, except those mandated by government requirements.CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OFDEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICALAPPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, ORWARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHERCRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TOBE FULLY AT THE CUSTOMER’S RISK.In order to minimize risks associated with the customer’s applications, adequate design and operatingsafeguards must be provided by the customer to minimize inherent or procedural hazards.TI assumes no liability for applications assistance or customer product design. TI does not warrant or representthat any license, either express or implied, is granted under any patent right, copyright, mask work right, or otherintellectual property right of TI covering or relating to any combination, machine, or process in which suchsemiconductor products or services might be or are used. TI’s publication of information regarding any thirdparty’s products or services does not constitute TI’s approval, warranty or endorsement thereof.Copyright © 1999, Texas Instruments Incorporated。