芯片元件组装机用粘合剂红胶TDS说明

dhesive for Chip mounting machines
芯片元件组装机用粘合剂
Seal-glo ＮＥ３０００Ｓ
□特征FEATURES
Seal-glo NE3000Ｓ是1
液加热硬化型的环氧基树脂胶，应用于芯片元件表面贴装工程，尤其适用
于钢网印胶制程，具有以下特征。

1）适用于各种芯片元件，均能获得稳定的粘合强度。

2）具有适于钢网印胶的粘度和摇变指数，能良好成形并有效避免PCB 板上的溢胶现象。

3）尽管是1
液环氧基树脂胶，却具有优良的稳定性，可长时间保存。

4）具有高度耐热性(Tg =１4８℃) 和优良的电气特性。

5）因为具有高连接力所以贴装元件时，不会发生偏差。

Seal-glo NE3000Ｓis a thermosetting, single component epoxy adhesive developed for chip
mounting machines, especially screen-printing
machines. Features include:
1) Stable adhesion can be obtained with a variety of SMD.
2) As the result of suitable viscosity and thixo ratio for screen-printing, no spreading of
printing
pattern can be obtained.
3) Convenient single component adhesives but excellent stability against long storage time.
4) Cured adhesive has excellent high heat resistance (Tg =148℃) and electrical properties.
5) High green strength prevents skewing during chip mounting.
□特性PROPERTIES
项目Characteristics
测定值Measured Values
比重Specific gravity １．３８
粘度Viscosity（25℃・５rpm）３９０Ｐa・ｓ（390,000cps）摇变性指数Thixo ratio ５．０
铜镜腐蚀Corrosion to copper 无腐蚀
４０℃×９５％RH×７２Ｈｒｓ.
玻璃转化温度（Ｔｇ）Glass transition temperature 热膨胀系数
Coefficient of thermal expansion １４８℃
４．９×10－5（under Tg）1５．０×10－5（over Tg）
体积阻抗系数
Volume insulation resistance 介电常数Dielectric constant 介电正切Dissipation factor １.８×1017Ω・ｃm
３．８（１００ＫHz）０．０２７（１００KHz）
□标准硬化条件STANDARD CURING CONDITION
粘合剂表面温度１５０℃×６０秒以上Adhesives’ surface temp. of
1５0℃×over 60 sec
粘合剂表面温度１３０℃×１２０秒以上Adhesives’ surface temp. of
130℃×over 120 sec
□粘着强度ADHESIVE STRENGTH
元件种类粘着强度
印刷面积 Kind of chip parts
Adhesion Area of printing
1608Ｃ
2125Ｃ
Mini‐mold Tr S OP IC 8ｐin 25Ｎ（2.6kgf）
38Ｎ（3.9kgf）
38Ｎ（3.9kgf）
92Ｎ（9.4kgf）
0.3×1.0mm
0.5×1.5mm
0.5×1.5mm
1.5×3.0mm
□使用注意事项PRECAUTIONARY INFORMATION
1)保存条件STORAGE CONDITION
放置于冰箱内保存，冰箱温度设定在２℃～１０℃之间。

保管时，务必盖紧容器盖。

Store at from 2℃to 10℃in refrigerator.
Preserve containers with their lids being completely closed. □包装方式PACKAGE STYLES
５００ｇｒ塑料罐装500ｇｒplastic container
２００gr圆柱筒200gr ｃａｒｔｒｉｄｇｅ。