stm32f303评估板手册

合集下载

河里基地STM32评估板用户手册说明书

User ManualRIVERDI STM32 Evaluation BoardRev. 1.4 2021-06-02R i v e r d i E v a l u a t i o n B o a r d U s e r M a n u a lREVISION RECORDREVNO. REVDATE CONTENTS REMARKS1.0 2020-08-17 Initial Release1.1 2020-11-06 CPU information updated1.2 2021-03-09 Pictures updated1.3 2021-03-31 Document adjusted into standard template1.4 2021-06-02 Corrections on description related to jumper P7,P8,P9CONTENTSREVISION RECORD (2)Target readers (4)Overview (4)Introduction (5)Board functionality test (5)Interfacing with EVE Displays (6)Using the SPI on the STM32 (10)Hardware features (11)7.2.1 Internal (11)7.2.2 External (12)Additional literature (14)Warranty limitation (14)Legal information (14)Appendix (15)Target readersThe aim of this document is to enable engineers using Riverdi STM32 Evaluation Board to get the tested Riverdi display running fast and easily. Further tests and development can be carried out shortly after Riverdi STM32 Evaluation Board is switched on for the first time.OverviewThe Riverdi evaluation board is designed as a complete demonstration and development platform for Riverdi’s EVE and IPS displays lines driver technology.The Riverdi evaluation board features an STM32F469II Cortex-M4 microcontroller with: LCD parallel interface including 8080/6800 modes, an LCD-TFT controller, Chrom-ART Accelerator™ for enhanced graphic content creation (DMA2D), secure digital input/output interface (SDIO), LTDC signals available on header P11 with additional MCU pins broken out on P12, external SDRAM, MicroSD slot for data/media storage, RiBUS FFC conn P3 featuring SPI, UART and LCD supply pins (SPI can be controlled by either STM32 or UBS serial bridge via jumper on P7/8/9) and configurable display backlight supply (EXT/INT).IntroductionRiverdi STM32 Evaluation Board is a tool designed to help get you started on working with Riverdi products. It not only supports EVE modules but also RGB displays (in combination with touch panels) by Riverdi.You have two primary options to drive external displays:1.Jumper between P7 & P8: FTDI serial/SPI bridge connected to RiBUS SPI:Use the FT232 serial to SPI bridge by connecting a micro USB cable to the connector labeled “Direct USB” and using the EVE Screen Editor to quickly generate graphical user interfaces with minimum effort .2.Jumper between P9 & P8: STM32 connected to RiBUS SPI:Use the onboard STM32F4 to develop and test firmware for driving a connected display or display controller, like the FT80x, FT81x and BT81x series.Board functionality testThere are firmware examples with which you can test your Riverdi STM32 Evaluation Board. You can also use those as a starting point for your own firmware development.Interfacing with EVE DisplaysUsing the FTDI SPI Bridge & EVE Screen EditorPrerequisites:•Riverdi STM32 Evaluation Board•EVE-enabled display•RiBUS flexible flat cable (FFC)EVE Screen Editor InstallationDownload and install the EVE screen Editor from the FTDI homepage:https:///Support/Utilities.htm#EVEScreenEditorSetup & ConfigurationTo connect the FTDI SPI bridge to the EVE display, the configuration jumpers need to be placed between P7 and P8, as in the picture below.Set the backlight jumper (placed over the backlight power configuration pins) to 5V BL on P4 (also refer to the picture below). Please see description on how to connect power for backlight in section “Hardware features”, subsection “Backlight power supply”.Start EVE Screen Editor and you will be greeted with the screen similar to the one below:On the lower right hand side of the window, click on the ”Devices” tab.On the lower left hand side, you will find 3 buttons:This button refreshes the devices list above it;This button opens a menu to select one from the preconfigured displays list;This button opens a menu to define your own display to be driven.Use a USB cable to connect the “USB Direct” port to your computer, when running the EVE Screen E ditor application. Click the “Refresh” button afterwards and your dev board should show up like in the picture below:Select "Single RS232-HS ()” entry by clicking on it and use the ‘Connect’ button to let EVE Screen Editor try and boot up your display.If everything works properly, your display should show a blue screen with some text.Hello WorldAfter connecting to Eval Board, to generate its first text message (e. g. 'Hello World'), we are going to use the EVE Screen Editor’s built-in drag & drop editor.(The drag operation is shown in green, the generated coprocessor commands are shown in the yellow box and the button to send the data to the EVE display is seen inside the red box.)What you see now is the preview of what will be drawn on the physical screen in a moment. Note that in the lower part of the window the coprocessor tab shows which EVE pre-processor commands were generated and will be sent to the EVE display shortly after.To send the commands also drawn in the preview pan to the physical display, press the button labeled “Upload RAM_G and RAM_DL”.Using the SPI on the STM32Prerequisites•Riverdi STM32 Evaluation Board•EVE enabled display•RiBUS flexible flat cable (FFC)•Your favorite tool to flash the onboard STM32 (assuming that you use STM32CubeProgrammer together with an STLink v2 compatible ISP Programmer)InstallationUse the provided source code or the pre-compiled binary file.ConfigurationIn order to connect the STM32 to the EVE display, the configuration jumpers need to be placed between P9 and P8. Check the jumper and the USB cable position (in ‘STM32 USB’ socket) in the picture below.Hardware featuresModule power supplyPossible to deliver from one of 2 USB ports on Eval Board (“Direct USB” or “STM32 USB”), in accordance with USB standard (5.0 VDC max.)Backlight power supply7.2.1InternalFor display sizes from 3.5” to 5.0”, the USB port gives enough power to get adequate backlight level. Such backlight power supply configuration (jumper is in higher position, connects BL to 5V on P4) is shown in the picture below.For 7.0” displays, USB minimal power capability needs to be 700mA @ 5V (this is a combined power of Eval Board, BT817Q board and backlight). Please make sure your USB source has enough current efficiency. If not, use external 5V power source in the way described in point 6.2.2.7.2.2ExternalAll the 10.1” (and rarely certain 7.0” displays) require external power supply for backlight, as the backlight voltage exceeds 5V and power consumption is over the USB standard. To provide adequate backlight power, set the jumper in P4 to lower position (it connects BL to EXT) – it must be placed in lower position and connect the external DC voltage source to neighboring connector (“BL PWR”). Refer to the picture and below.Caution! There is no reverse polarity protection on EXT_BL_PWR, incorrect connection will damage the backlight permanently. Proceed carefully.EVE4 BT817Q TFT series backlight power requirement summary:Display size Internal (from USB) External3.5”OK 3.3V-6.0V (optional)4.3”OK 3.3V-6.0V (optional)5.0”OK 3.3V-6.0V (optional)7.0”Ok, if USB has 700mA min. efficiency 3.3V-6.0V (optional)You can find exact currents for specific TFT in datasheet:https:///product-category/intelligent-displays/bt817q/MicrocontrollerSTM32F469II, Arm Cortex-M4 MCU @ up to 180MHzExternal SDRAMIS42S16400J, 64Mbit/WW/pdf/42-45S16400J.pdfFTDI serial to SPI bridgehttps:///Support/Documents/DataSheets/ICs/DS_FT232H.pdfMicroSD slotWhen functional microSD card is placed in this slot, after being formatted in FAT32 format, microSD card’s memory space can be used by microcontroller as the regular filesystem.RiBUS FFC-connectorSupport for FT80x, FT81x, BT81x (max SPI speed = 30MHz),https:///download/5318/FTDI app note AN312 contains c headers and example code for FT800User LEDs: 2 pcsThey can be configured by the user, from program level.Power LED indicating power to FTDI "Direct USB”FTDI input powers both rails.Power LED indicating power to STM32 "STM32 USB"STM32 powers its own rail only.User Buttons: 2 pcsThese may be used in future, they are not used now.Serial RGB bus headerPlease refer to Application Note: ST AN4861 (LCD-TFT display controller (LTDC) on STM32 MCUs).Additional literatureAll the below sources contain the data of four BT815/816 (EVE3) and BT817/BT818 (EVE4) ICsBT81x, General:https:///bt81x/BT81x, Datasheets:https:///wp-content/uploads/Support/Documentation/Datasheets/ICs/EVE/DS_BT81X.pdfBT81x, Programming guides:https:///wp-content/uploads/Support/Documentation/Programming_Guides/ICs/EVE/BRT_AN_033_BT81X_Serie s_Programming_Guide.pdfWarranty limitationEnd user is instructed how to connect external power sources to the unit, which brings the potential threats to the Eval Board and display. Riverdi cannot be held responsible for actions beyond its control and consequently the warranty DOES NOT cover the effects of reversed power supply polarity on backlight terminals. Refer to clause in red color in section 6.2.2 of this documentLegal informationThis document has been issued with professional care. Riverdi did their best to avoid any errors, but we do not grant full warrant it is 100% errors free. Please contact Riverdi if you find any mistakes or when you think some important information is missing in this Manual.It can be updated or altered without any written notice. Riverdi cannot be held responsible for not announcing any changes or issuing next revisions or versions of this document.AppendixHardware Pinouts# Pin Description MCU Peripheral25 PF7 User Led 1 (left) GPIO Output26 PF8 User Led 2 (right) GPIO Output53 PA7 User Button 1 GPIO Input (enable pull-up)50 PA4 User Button 2 GPIO Input (enable pull-up) 130 PH15 uSD Detect (hi: uSD present) GPIO Input (enable pull-up)40 PA0 STL_TX (UART) UART4 TX41 PA1 STL_RX (UART) UART4 RX95 PB15 R_MOSI (SPI2) SPI2 MOSI94 PB14 R_MISO SPI2 MISO93 PB13 R_CLK SPI2 SCK92 PB12 R_CS SPI2 NSS86 PH9 R_INT GPIO Input84 PH10 R_RST GPIO Output5 MOSI / IO.0 PI MISO Signal / QSPI data line 06 CS SPI Chip Select Signal7 INT Interrupt Signal (Out to MCU)8 RST / PD Reset / Power Down Signal9 - 14 NC NC15 RX UART RX / I2C16 TX UART TX / I2C17 BLVDD Backlight Power Supply, 5V18 BLVDD Backlight Power Supply, 5V19 BLGND Backlight Ground (GND on display)20 BLGND Backlight Ground (GND on display)GND 1 2 3.3V VCCMOSI 3 4 SCKnCS 5 6 MISOnRST 7 8 nINTNC 9 10 NCNC 11 12 NCNC 13 14 NCTX 15 16 RX5V Backlight 17 18 5V BacklightGND 19 20 GND。

STM32马达控制套件评估板技术手册(第二版)

STM32马达控制套件评估板技术手册（第二版）STM32 是基于ARM Cortex-M3内核的32位微控制器，其强大的内核及其丰富的外设使其在无刷马达控制应用领域得到了广泛的使用。

为了使用户能快速地基于STM32 开发出无刷马达控制器，我们公司推出了基于三相感应马达及PMSM马达的应用套件，该套件包含了ST马达控制软件库V2.0及相应的评估板。

基于国产第一版推出后受到网友的热捧，产品一度脱销，因此我们在参考了国外几家半导体公司的马达驱动板的设计理念后，结合网友使用第一版后提出的合理建议，我们推出了第二版，下面我们介绍第二版的基本特点：一、硬件特点：基于客户使用第一版反馈的建议，我们仍然保持控制板较大的驱动功率，但是MCU及功率板做在了一起，这是由于第二版的开发目标针对的是高精密的运动伺服控制器，所以要求驱动和采样信号尽量高速可靠的传输，减少中间容易出错及受到干扰的可能性。

根据客户的建议，MCU选择使用100脚的STM32F103VXT6芯片作为其主控芯片，功率版提供2种MOSFET选择，ST生产的75V/75A先进MOSFET，可以支持直流50V，电流到30A的低压应用，驱动功率达到600W，另一种为飞利浦生产的BUK7510，可以支持直流72V，电流到35A的低压应用，驱动功率达到800W同时高压功率驱动板正在开发中，届时将会使用600V/30A智能IPM模块或者IGBT，驱动功能将达到3KW左右。

下面是板子的硬件说明：控制电源部分：控制电源采用单独输入，目的是在使用高压驱动电源时，可以单独为控制部分供电，从而使得动力电压范围更广。

一般驱动电源在+50V以下的应用，控制和驱动可以使用同一路电源，但是高于+50V以后，建议使用单独供电，当然为了提供更大的适应不同场合的能力，我们使用特殊的高压DC BUCK芯片即使电压高达直流125V，也可以继续使用同一路电源供电，但是考虑安全因素，我们不建议您这样使用。

意法半导体stm32手册

意法半导体stm32手册意法半导体(STM32)是一款广泛应用于嵌入式系统开发的微控制器。

它具有高性能、低功耗、丰富的外设和强大的开发工具链等优点，适合用于各种应用领域，如工业控制、物联网、智能家居、汽车电子等。

本手册将介绍STM32微控制器系列的主要特性、功能模块和应用示例等内容。

一、STM32微控制器系列特性1.高性能：STM32微控制器采用ARM Cortex-M系列内核，具有高性能的运算能力和快速的响应速度，能够满足各种复杂计算和实时任务的需求。

2.低功耗：STM32微控制器采用低功耗设计，能够在满足性能要求的同时最大程度地降低能耗，延长系统的使用时间。

3.丰富的外设：STM32微控制器具有丰富的外设，包括通用IO口、定时器、串口、SPI、I2C、ADC、DAC等，能够满足各种应用的需要。

4.强大的扩展性：STM32微控制器支持多种外部总线接口，如USB、Ethernet、CAN等，可轻松实现与外部设备的通信，并支持灵活的扩展。

5.开发工具链：STM32微控制器采用意法半导体提供的开发工具链，包括开发板、调试工具和软件开发环境等，方便开发者进行嵌入式系统开发。

二、STM32微控制器功能模块1.内核模块：STM32微控制器采用ARM Cortex-M系列内核，支持多种内核版本，如Cortex-M0、Cortex-M3、Cortex-M4等，具有不同的性能和功能特点。

2.外设模块：STM32微控制器的外设模块包括通用IO口、定时器、串口、SPI、I2C、ADC、DAC等，这些外设可以通过寄存器编程或者使用开发工具链提供的API函数进行配置和控制。

3.存储器模块：STM32微控制器拥有多种存储器模块，包括闪存、SRAM、EEPROM等，可以满足不同应用对存储容量和读写速度的需求。

4.时钟模块：STM32微控制器具有丰富的时钟模块，包括主PLL时钟、系统时钟、外设时钟等，可以实现灵活的时钟配置和控制。

STM32F030F4数据手册

July 2013DocID024849 Rev 11/88STM32F030x4 STM32F030x6STM32F030x8Value-line ARM-based 32-bit MCU with 16 to 64-KB Flash, timers,ADC, communication interfaces, 2.4-3.6 V operationDatasheet target specificationFeaturesCore: ARM ® 32-bit Cortex™-M0 CPU, frequency up to 48 MHz Memories–16 to 64 Kbytes of Flash memory– 4 to 8Kbytes of SRAM with HW parity checking CRC calculation unitReset and power management –Voltage range: 2.4V to 3.6V–Power-on/Power down reset (POR/PDR)–Low power modes: Sleep, Stop, Standby Clock management– 4 to 32 MHz crystal oscillator–32kHz oscillator for RTC with calibration –Internal 8MHz RC with x6 PLL option –Internal 40kHz RC oscillator Up to 55 fast I/Os–All mappable on external interrupt vectors –Up to 36 I/Os with 5V tolerant capability 5-channel DMA controller1 x 12-bit, 1.0µs ADC (up to 16 channels)–Conversion range: 0 to 3.6V–Separate analog supply from 2.4 up to 3.6V Up to 10 timers–One 16-bit 7-channel advanced-control timer for 6 channels PWM output, with deadtime generation and emergency stop –One 16-bit timer, with up to 4 IC/OC, usable for IR control decoding–One 16-bit timer, with 2 IC/OC, 1 OCN, deadtime generation and emergency stop –Two 16-bit timers, each with IC/OC and OCN, deadtime generation, emergency stop and modulator gate for IR control –One 16-bit timer with 1 IC/OC–Independent and system watchdog timers –SysTick timer: 24-bit downcounterCalendar RTC with alarm and periodic wakeup from Stop/Standby Communication interfaces–Up to two I 2C interfaces: one supporting Fast Mode Plus (1Mbit/s) with 20mA current sink–Up to two USARTs supporting mastersynchronous SPI and modem control; one with auto baud rate detection–Up to two SPIs (18Mbit/s) with 4 to 16 programmable bit frame Serial wire debug (SWD)Table 1. Device summaryReferencePart numberSTM32F030x4STM32F030F4STM32F030x6STM32F030C6, STM32F030K6STM32F030x8STM32F030C8, STM32F030R8Contents1Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93Functional overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123.1ARM® CortexTM-M0 core with embedded Flash and SRAM . . . . . . . . . 123.2Memories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123.3Boot modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123.4Cyclic redundancy check calculation unit (CRC) . . . . . . . . . . . . . . . . . . . 133.5Power management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133.5.1Power supply schemes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133.5.2Power supply supervisors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133.5.3Voltage regulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133.5.4Low-power modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 143.6Clocks and startup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 143.7General-purpose inputs/outputs (GPIOs) . . . . . . . . . . . . . . . . . . . . . . . . . 163.8Direct memory access controller (DMA) . . . . . . . . . . . . . . . . . . . . . . . . . . 163.9Interrupts and events . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 163.9.1Nested vectored interrupt controller (NVIC) . . . . . . . . . . . . . . . . . . . . . . 163.9.2Extended interrupt/event controller (EXTI) . . . . . . . . . . . . . . . . . . . . . . 163.10Analog to digital converter (ADC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 173.10.1Temperature sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 173.10.2Internal voltage reference (V REFINT) . . . . . . . . . . . . . . . . . . . . . . . . . . . 173.11Timers and watchdogs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 183.11.1Advanced-control timer (TIM1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 183.11.2General-purpose timers (TIM3, TIM14..17) . . . . . . . . . . . . . . . . . . . . . . 193.11.3Basic timer TIM6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 193.11.4Independent watchdog (IWDG) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 193.11.5System window watchdog (WWDG) . . . . . . . . . . . . . . . . . . . . . . . . . . . 203.11.6SysTick timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 203.12Real-time clock (RTC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 203.13Inter-integrated circuit interfaces (I2C) . . . . . . . . . . . . . . . . . . . . . . . . . . . 213.14Universal synchronous/asynchronous receiver transmitters (USART) . . 22 2/88DocID024849 Rev 13.15Serial peripheral interface (SPI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 223.16Serial wire debug port (SW-DP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 224Pinouts and pin descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 5Memory mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 336Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 366.1Parameter conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 366.1.1Minimum and maximum values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 366.1.2Typical values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 366.1.3Typical curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 366.1.4Loading capacitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 366.1.5Pin input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 366.1.6Power supply scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 376.1.7Current consumption measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . 386.2Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 386.3Operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 406.3.1General operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 406.3.2Operating conditions at power-up / power-down . . . . . . . . . . . . . . . . . . 416.3.3Embedded reset and power control block characteristics . . . . . . . . . . . 416.3.4Embedded reference voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 416.3.5Supply current characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 426.3.6Wakeup time from low-power mode . . . . . . . . . . . . . . . . . . . . . . . . . . . 476.3.7External clock source characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 486.3.8Internal clock source characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 526.3.9PLL characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 536.3.10Memory characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 546.3.11EMC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 546.3.12Electrical sensitivity characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 566.3.13I/O current injection characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 576.3.14I/O port characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 576.3.15NRST pin characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 626.3.1612-bit ADC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 646.3.17Temperature sensor characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 676.3.18Timer characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 676.3.19Communication interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69DocID024849 Rev 13/887Package characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 747.1Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 747.2Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 837.2.1Reference document . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 837.2.2Selecting the product temperature range . . . . . . . . . . . . . . . . . . . . . . . 83 8Part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86 9Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 874/88DocID024849 Rev 1STM32F030x4 STM32F030x6 STM32F030x8List of tables List of tablesTable 1.Device summary. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Table 2.STM32F030x device features and peripheral counts. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Table 3.Temperature sensor calibration values. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Table 4.Internal voltage reference calibration values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Table 5.Timer feature comparison. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Table parison of I2C analog and digital filters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Table 7.STM32F030x I2C implementation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Table 8.STM32F030x USART implementation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Table 9.STM32F030x SPI implementation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Table 10.Legend/abbreviations used in the pinout table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Table 11.Pin definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Table 12.Alternate functions selected through GPIOA_AFR registers for port A . . . . . . . . . . . . . . . 31 Table 13.Alternate functions selected through GPIOB_AFR registers for port B . . . . . . . . . . . . . . . 32 Table 14.STM32F030x peripheral register boundary addresses. . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 Table 15.Voltage characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 Table 16.Current characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 Table 17.Thermal characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 Table 18.General operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 Table 19.Operating conditions at power-up / power-down . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 Table 20.Embedded reset and power control block characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 41 Table 21.Embedded internal reference voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 Table 22.Typical and maximum current consumption from V DD supply at VDD= 3.6 . . . . . . . . . . . 43 Table 23.Typical and maximum current consumption from the V DDA supply . . . . . . . . . . . . . . . . . . 43 Table 24.Typical and maximum V DD consumption in Stop and Standby modes. . . . . . . . . . . . . . . . 44 Table 25.Typical and maximum V DDA consumption in Stop and Standby modes. . . . . . . . . . . . . . . 44 Table 26.Typical current consumption in Run mode, code with data processingrunning from Flash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 Table 27.Switching output I/O current consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 Table 28.Low-power mode wakeup timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 Table 29.High-speed external user clock characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 Table 30.Low-speed external user clock characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49 Table 31.HSE oscillator characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 Table 32.LSE oscillator characteristics (f LSE = 32.768 kHz) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51 Table 33.HSI oscillator characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 Table 34.HSI14 oscillator characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 Table 35.LSI oscillator characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 Table 36.PLL characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 Table 37.Flash memory characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 Table 38.Flash memory endurance and data retention. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 Table 39.EMS characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55 Table 40.EMI characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56 Table 41.ESD absolute maximum ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56 Table 42.Electrical sensitivities . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56 Table 43.I/O current injection susceptibility. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57 Table 44.I/O static characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57 Table 45.Output voltage characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 Table 46.I/O AC characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61 Table 47.NRST pin characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62DocID024849 Rev 15/88List of tables STM32F030x4 STM32F030x6 STM32F030x8 Table 48.ADC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64 Table 49.R AIN max for f ADC = 14 MHz. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65 Table 50.ADC accuracy. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65 Table 51.TS characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67 Table 52.TIMx characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67 Table 53.IWDG min/max timeout period at 40 kHz (LSI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68 Table 54.WWDG min-max timeout value @48 MHz (PCLK). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68 Table 55.I2C characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69 Table 56.I2C analog filter characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70 Table 57.SPI characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71 Table 58.LQFP64 – 10 x 10 mm 64 pin low-profile quad flat package mechanical data. . . . . . . . . . 75 Table 59.LQFP48 – 7 x 7 mm, 48-pin low-profile quad flat package mechanical data . . . . . . . . . . . 77 Table 60.LQFP32 – 7 x 7mm 32-pin low-profile quad flat package mechanical data . . . . . . . . . . . . 79 Table 61.TSSOP20 – 20-pin thin shrink small outline package mechanical data . . . . . . . . . . . . . . . 81 Table 62.Package thermal characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83 Table 63.Ordering information scheme. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86 Table 64.Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87 6/88DocID024849 Rev 1STM32F030x4 STM32F030x6 STM32F030x8List of figures List of figuresFigure 1.Block diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Figure 2.Clock tree . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Figure 3.LQFP64 64-pin package pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Figure 4.LQFP48 48-pin package pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Figure 5.LQFP32 32-pin package pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Figure 6.TSSOP20 package pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Figure 7.STM32F030x memory map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 Figure 8.Pin loading conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 Figure 9.Pin input voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 Figure 10.Power supply scheme. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 Figure 11.Current consumption measurement scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 Figure 12.High-speed external clock source AC timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 Figure 13.Low-speed external clock source AC timing diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49 Figure 14.Typical application with an 8 MHz crystal. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51 Figure 15.Typical application with a 32.768 kHz crystal. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 Figure 16.TC and TTa I/O input characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59 Figure 17.Five volt tolerant (FT and FTf) I/O input characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 59 Figure 18.I/O AC characteristics definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62 Figure 19.Recommended NRST pin protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63 Figure 20.ADC accuracy characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66 Figure 21.Typical connection diagram using the ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66 Figure 22.I2C bus AC waveforms and measurement circuit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70 Figure 23.SPI timing diagram - slave mode and CPHA = 0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72 Figure 24.SPI timing diagram - slave mode and CPHA = 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72 Figure 25.SPI timing diagram - master mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73 Figure 26.LQFP64 – 10 x 10 mm 64 pin low-profile quad flat package outline . . . . . . . . . . . . . . . . . 75 Figure 27.LQFP64 recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76 Figure 28.LQFP48 – 7 x 7 mm, 48 pin low-profile quad flat package outline. . . . . . . . . . . . . . . . . . . 77 Figure 29.LQFP48 recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78 Figure 30.LQFP32 – 7 x 7mm 32-pin low-profile quad flat package outline. . . . . . . . . . . . . . . . . . . . 79 Figure 31.LQFP32 recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80 Figure 32.TSSOP20 - 20-pin thin shrink small outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81 Figure 33.TSSOP20 recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82 Figure 34.LQFP64 P D max vs. T A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85DocID024849 Rev 17/88Introduction STM32F030x4 STM32F030x6 STM32F030x8 1 IntroductionThis datasheet provides the ordering information and mechanical device characteristics ofthe STM32F030x microcontrollers.This STM32F030x4, STM32F030x6, and STM32F030x8 datasheet should be read inconjunction with the STM32F0xxxx reference manual (RM0091). The reference manual isavailable from the STMicroelectronics website .For information on the ARM Cortex™-M0 core, please refer to the Cortex™-M0 TechnicalReference Manual, available from the website at the following address:/help/index.jsp?topic=/com.arm.doc.ddi0432c/index.html.8/88DocID024849 Rev 1STM32F030x4 STM32F030x6 STM32F030x8Description 2 DescriptionThe STM32F030x microcontroller incorporates the high-performance ARM Cortex™-M0 32-bit RISC core operating at a 48 MHz frequency, high-speed embedded memories (up to64Kbytes of Flash memory and up to 8 Kbytes of SRAM), and an extensive range ofenhanced peripherals and I/Os. All devices offer standard communication interfaces (up totwo I2Cs, up to two SPIs, and up to two USARTs), one 12-bit ADC, up to 6 general-purpose16-bit timers and an advanced-control PWM timer.The STM32F030x microcontroller operates in the -40 to +85 °C temperature range, from a2.4 to3.6 V power supply. A comprehensive set of power-saving modes allows the design oflow-power applications.The STM32F030x microcontroller includes devices in four different packages ranging from20 pins to 64 pins. Depending on the device chosen, different sets of peripherals areincluded. The description below provides an overview of the complete range ofSTM32F030x peripherals proposed.These features make the STM32F030x microcontroller suitable for a wide range ofapplications such as application control and user interfaces, handheld equipment, A/Vreceivers and digital TV, PC peripherals, gaming platforms, e-bikes, consumer appliances,printers, scanners, alarm systems, video intercoms, and HVACs.DocID024849 Rev 19/88DescriptionSTM32F030x4 STM32F030x6 STM32F030x810/88DocID024849 Rev 1Table 2. STM32F030x device features and peripheral countsPeripheralSTM32F030F4STM32F030K6STM32F030C6/C8STM32F030R8Flash (Kbytes)1632326464SRAM (Kbytes)44488TimersAdvanced control1 (16-bit)General purpose 4 (16-bit)(1)4 (16-bit)(1)4 (16-bit)(1)5 (16-bit) 5 (16-bit)Basic --- 1 (16-bit)1 (16-bit)Comm. interfacesSPI1(2)1(2)1(2)22I 2C 1(3)1(3)1(3)22USART1(4)1(4)1(4)2212-bit synchronized ADC (number of channels)1(11 channels)1(12 channels)1(12 channels)1(18 channels)GPIOs15263955Max. CPU frequency 48 MHz Operating voltage 2.4 to 3.6VOperating temperature Ambient operating temperature: -40 °C to 85 °CPackagesTSSOP20LQFP32LQFP48LQFP641.TIM15 is not present.2.SPI2 is not present.3.I2C2 is not present.ART2 is not present.STM32F030x4 STM32F030x6 STM32F030x8Description1.TIMER6, TIMER15, SPI2, USART2 and I2C2 are available on STM32F030x8 devices only.DocID024849 Rev 111/88Functional overview STM32F030x4 STM32F030x6 STM32F030x8 3 Functional overview3.1 ARM® Cortex TM-M0 core with embedded Flash and SRAMThe ARM Cortex™-M0 processor is the latest generation of ARM processors for embeddedsystems. It has been developed to provide a low-cost platform that meets the needs of MCUimplementation, with a reduced pin count and low-power consumption, while deliveringoutstanding computational performance and an advanced system response to interrupts.The ARM Cortex™-M0 32-bit RISC processor features exceptional code-efficiency,delivering the high-performance expected from an ARM core in the memory size usuallyassociated with 8- and 16-bit devices.The STM32F0xx family has an embedded ARM core and is therefore compatible with allARM tools and software.Figure1 shows the general block diagram of the device family.3.2 MemoriesThe device has the following features:Up to 8 Kbytes of embedded SRAM accessed (read/write) at CPU clock speed with 0 wait states and featuring embedded parity checking with exception generation for fail-critical applications.The non-volatile memory is divided into two arrays:–16 to 64 Kbytes of embedded Flash memory for programs and data–Option bytesThe option bytes are used to write-protect the memory (with 4 KB granularity) and/orreadout-protect the whole memory with the following options:–Level 0: no readout protection–Level 1: memory readout protection, the Flash memory cannot be read from or written to if either debug features are connected or boot in RAM is selected –Level 2: chip readout protection, debug features (Cortex-M0 serial wire) and boot in RAM selection disabled3.3 Boot modesAt startup, the boot pin and boot selector option bit are used to select one of three bootoptions:Boot from User FlashBoot from System MemoryBoot from embedded SRAMThe boot loader is located in System Memory. It is used to reprogram the Flash memory byusing USART on pins PA14/PA15 or PA9/PA10.。

stm32f303cct6 用户编程技术手册

stm32f303cct6 用户编程技术手册STM32F303CCT6是一款由STMicroelectronics开发的32位微控制器，它基于ARM Cortex-M4内核，具有丰富的外设和功能。

本手册将介绍STM32F303CCT6的用户编程技术，帮助开发者深入了解该设备并学会如何编写代码来控制和使用它。

首先，我们将介绍STM32F303CCT6的主要特性和硬件架构。

该设备具有高性能的ARM Cortex-M4内核，运行频率可达到72 MHz，内置了丰富的外设包括通用定时器、通用串行接口、SPI、I2C、ADC等。

了解这些特性对于正确使用STM32F303CCT6至关重要。

接下来，我们将介绍如何设置和初始化STM32F303CCT6。

首先，我们需要设置时钟源以确保设备正常运行。

然后，我们将讨论如何配置GPIO引脚来连接外部设备。

此外，还将介绍如何初始化各种外设和中断，以及如何配置和使用中断控制器来处理中断事件。

在掌握了设置和初始化的基础上，我们将深入研究STM32F303CCT6的编程技巧。

这包括使用外设驱动程序库来快速开发应用程序，如通用定时器的配置和使用，以及使用不同的串行接口通信协议实现数据传输。

我们还会介绍如何编写中断服务子程序，以及如何使用低功耗模式来节省能源。

最后，我们将提供一些使用示例，以帮助您更好地理解STM32F303CCT6的编程技术。

这些示例将涵盖不同的应用领域，如数据采集、模拟信号处理和通信等。

通过这些示例，您将能够快速上手并开始开发自己的应用程序。

总之，本手册详细介绍了STM32F303CCT6的用户编程技术，包括设备特性、设置和初始化、编程技巧以及使用示例。

希望本手册能够帮助您轻松掌握STM32F303CCT6的编程，进而实现更多有趣和实用的应用。

祝您编程愉快！。

STM32V100评估板用户手册

引脚
ST8024 信号信号描述
对应 STM32 引脚
5V/3V
Smart card 电源选择脚
PD11
I/OUC
MCU 数据输入和输出口
PB10
XTAL1
晶振或外部时钟输入
PB12
OFF
检测 Smart Card 插入，产生中断 PE14
到 MCU
RSTIN
卡复位信号输入
PB11
CMDVCC
PE7
2.12 SD 卡接口
STM32 评估板具有 SD 卡接口，支持 SD 卡的读写。SD 卡和 STM32 接口的连接信号如下：
引脚
ＳＤ卡接口信信号描述号
对应 STM32 引脚
１
CD/DAT3
片选
PE3
２
CMD
MOSI
PA7
３
VSS
GND
４
VDD
+3V3
５
CLK
６
VSS
７
DAT0
８
DAT1
2.15 模拟输入
BNC 接头
引脚号１ 2 3
功能描述 GND GND GND
引脚号 4 5
功能描述 GND Analog input/PC1
2.16 IrDA
STM32 开发板支持红外接收，ＳTM32 评估板上的 IrDA 接收器连接到的ＵＡＲＴ３上，可以通过条线ＪＰ５来设置使能或禁止红外接收。
短接
电机电流抽样控制被使能
断开
电机电流抽样控制不被使能
短接断开
连接Reset和调试口的TRST线不连接Reset和调试口的TRST线
供电电源选择 USB短接选择USB供电

STM32开发板操作手册说明书

Resistance 100 Ω Platinum @0°C
Heavy Duty Surface Mount TC 26881
Strapon® RTD Sensors 22391, 22392 & 22393
–200°C to +760°C (–320°F to +1400°F) Leads to 480°C (900°F)
To illustrate these points Figure I shows a typical surface sensor installation. The sensor in this case is mounted on a pipe which is carrying a fluid. The point closest to the fluid where a sensor can be mounted practically is the outer wall of the pipe. If the fluid flow is adequate and the temperature fluctuations are not severe, the outer wall temperature will be very close to that of the fluid.
–200°C to +232°C (–320°F to +450°F) –200°C to260°C (–320°F to +500°F)
Thermocouple Types K, E, T or J* Grounded or Ungrounded
Resistance 100 Ω or 1000 Ω Platinum @0°C

STM32F0DISCOVERY 开发板用户手册说明书

Open32F0-D User ManualContents1. Overview (2)1.1. What’s on board (2)2. Demo (4)2.1. 8IOs (4)2.2. 24L01 (5)2.3. ADC+DMA (5)2.4. DAC+DMA (6)2.5. FATFS V0.08A-SD Card (6)2.6. GPIO LED (7)2.7. GPIO LED JOYSTICK (7)2.8. I2C (7)2.9. I2S UDA1380 & SD_FatFS(DMA) (8)2.10. JOYSTICK (8)2.11. LCD22-picture (8)2.12. LCD22_TouchPanel (9)2.13. One-Wire (10)2.14. SPI (10)2.15. uCOS-II-V2.91 (11)2.16. uCOS-II-V2.91+LCD (11)2.17. USART (11)3. Revision history (12)1. Overview 1.1. What’s on board[ Core interface ]1. STM32F0DISCOVERY socketfor easily connecting theSTM32F0DISCOVERY2. 8I/Os + DAC + ADC interfacefor connecting accessory boards such buttons, motors, AD/DA module etc.3. USART2 interfaceeasily connects to RS232, RS485, USB TO232, etc.4. SPI1/SPI2 interface[ Other interface ]10. 5V/3.3V power input/outputusually used as power output, alsocommon-grounding with other user board11. 5V DC jack12. MCU pins connectorall the MCU I/O ports are accessible onexpansion connectors for further expansion 13. SWD interfacefor debugging/programmingeasily connects to SPI peripherals such asDataFlash (AT45DBxx), SD card, MP3 module, etc.5. LCD connectorfor connecting touch screen LCD 6.USART1 interfaceeasily connects to RS232, RS485, USB TO 232, etc.7.I2C1 / I2C2 interfaceeasily connects to I2C peripherals such as I/O expander (PCF8574), FRAM (FM24CLxx), etc. 8.I2S / I2C1 interfaceeasily connects to I2S peripherals such as audio module, etc. 9.1-WIRE interfaceeasily connects to ONE-WIRE devices (TO-92 package), such as temperature sensor (DS18B20), electronic registration number (DS2401), etc.[ Jumper/switch ] •Joystick jumpershort the jumper to connect the joystick to default I/Os used in example code;open the jumper to connect the joystick to custom I/Os via jumper wires14. Boot mode switchfor configuring BOOT0 pin.[ Component ] 15. Power switch 16. Power indicator17. Joystick: five positions2. DemoKEIL MDK Version ：4.54Programmer/Debugger: STM32F0DISCOVERY onboard SWD Programming/Debugging interface: SWDSerial port settings:2.1. 8IOs◆ Overview8bit I/Os demo◆ Hardware connectionConnect the RS232 board to the onboardUSART1 interfaceConnect the 8 Push Button to the onboard 8I/Os connector (Make sure the G pinheader is connect to the board GND pinheader)◆ Operation and result◆The below information will be printed on the serial debugging assistantSelect a proper COM portBaud rate 115200Data bits 8Stop bits 1 Parity bitsNoneFlow control None2.2. 24L01◆ OverviewNRF24L01 demo ◆ Hardware connectionConnect the RS232 board to the onboardUSART1 interfaceConnect the two NRF24L01 to the board viaSPI interface ◆ Software configurationTwo NRF24L01 are needed for this demo, configuring as below:When configuring as sending mode, enable: #define T_O_R 1, comment out: //#define T_O_R 0 When configuring as receiving mode, enable: #define T_O_R 0, comment out: //#define T_O_R 0. ◆ Operation and resultMessage will be printed on the serial debugging assistant.2.3. ADC+DMA◆ OverviewADC+DMA demo◆ Hardware connectionConnect the RS232 board to the onboardUSART1 interfaceConnect the Analog Test Board to the board via8 I/Os (ADC+DAC)◆ Operation and resultRotate the onboard potentiometer, the AD message will be printed on the serial debugging assistant:2.4. DAC+DMA◆ OverviewDAC+DMA demo◆ Hardware connectionConnect the Analog Test Board to the board via8 I/Os (ADC+DAC)Connect the 5V pinheaders on both the mainboard and the Analog Test Board via jumper wire◆ Operation and resultYou may hear sound from the Analog Test Board when press the Reset button2.5. FATFS V0.08A-SD Card◆ OverviewSD_FatFS demo ◆ Hardware connectionConnect the RS232 board to the onboardUSART1 interfaceConnect the Micro SD Storage Board to theboard via SDIO interface.Insert the SD card to the Micro SD Storage Board socketConnect the CD pin on the Micro SD StorageBoard to the board PB0 pin via Dupont wire.`◆ Operation and resultThe below information will be printed on the serial debugging assistant:2.6. GPIO LED◆ OverviewLED demo◆ Hardware connection ◆ Operation and resultThe two LEDs on the Discovery board blinking2.7. GPIO LED JOYSTICK◆ OverviewUser key demo◆ Hardware connection ◆ Operation and resultPress the User key, the LED status will change accordingly.2.8. I2C◆ OverviewI2C EEPROM demo ◆ Hardware connectionConnect the RS232 board to the onboardUSART1 interfaceConnect the AT24/FM24 Board to theI2CX connector ( connect to I2C1 or I2C2 depends on the program)◆ Operation and resultThe below information will be printed on the serial debugging assistant:2.9. I2S UDA1380 & SD_FatFS(DMA)◆ OverviewAudio file placed on SD Card (with FATFS) ◆ Hardware connectionConnect Micro SD Storage Board to the board viaSPI2 interface.Insert the SD card to the Micro SD Storage Boardsocket. Connect the CD pin of the Micro SD Storage Boardto the board PB0 pin via DuPont wire. Put “audio.wav“ file to the SD cardConnect UDA1380 Board to the board via I2Sconnector.Connect the earphone to the UDA1380 Board viaLINEOUT interface.◆ Operation and resultYou can hear music while pressing the RESET key.2.10. JOYSTICK◆ OverviewJOYSTICK demo ◆ Hardware connectionShort the JOYSTICK JMP ◆ Operation and resultThe LED status will change accordingly while press the JOYSTICK .2.11. LCD22-picture◆ OverviewLCD demoThis LCD is 2.2 inch resistive touch screen LCD, the resolution is 320x240, drive by mode of SPI, greatlyreduce the pins, MCU with little IO can also available to drive it.This demo shows dot, the drawing line, the drawing circle, character, etc displayed on the LCD. ◆ Hardware connectionConnect with 5V power via the 5VDC interface Connect ULINK2 to the board via SWD interfaceConnect the 2.2inch 320x240 Touch LCD (A) to theboard via LCD22 interface.◆ Operation and resultMessage will be displayed on the LCD.2.12. LCD22_TouchPanel◆ OverviewLCD demo1. Calibrate the touch screen by click three times, and then enter into drawing board in the touch screeninterface.2. You can draw lines freely on the drawing board. ◆ Hardware connectionConnect the 2.2inch 320x240 Touch LCD (A) to the board. ◆ Operation and resultMessage will be displayed on the LCDTouch-screen calibration interface◆ ApplicationHandheld device display2.13. One-Wire◆ OverviewOne-Wire demo◆ Hardware connectionConnect the RS232 board to the onboard USART1 interface Connect the DS18B20 to the board via One-Wire interface◆ Operation and resultThe below information will be printed on the serial debugging assistant:2.14. SPI◆ OverviewSPI demo◆ Hardware connectionConnect the AT45DBXX DataFlash Board to theboard via SPIX (to SPI1 or SPI2 depends on the program)Connect the RS232 board to the onboard USART1interface◆ Software configurationThe serial debugging assistant configuring:Launch the serial debugging assistant SSCOM32, choose related COM port, set baud rate as 115200, click to open it.◆ Operation and resultThe below information will be printed on the serial debugging assistant:2.15. uCOS-II-V2.91◆OverviewuCOSII demo◆Hardware connection◆Operation and resultThe two LED blinking.2.16. uCOS-II-V2.91+LCD◆OverviewuCOS-II-V2.91I demo◆Hardware connectionConnect the 2.2inch 320x240 Touch LCD (A) to the board◆Operation and resultMessage displayed on the LCD; LED blinking.2.17. USART◆OverviewUSART demo◆Hardware connection◆Operation and resultThe below information will be printed on the serial debugging assistant:3. Revision historyVersion Description Date AuthorV1.0 Initial revision 2014/05/17 Waveshare team。

STM32中文参考手册-stm32f103中文参考手册

STM32F10xxx参考手册参考手册小，中和大容量的STM32F101xx, STM32F102xx和STM32F103xxARM内核32位高性能微控制器导言本参考手册针对应用开发，提供关于如何使用小容量、中容量和大容量的STM32F101xx、STM32F102xx或者STM32F103xx微控制器的存储器和外设的详细信息。

在本参考手册中STM32F101xx、STM32F102xx和STM32F103xx被统称为STM32F10xxx。

STM32F10xxx系列拥有不同的存储器容量，封装和外设配置。

关于订货编号、电气和物理性能参数，请参考STM32F101xx、STM32F102xx和STM32F103xx 的数据手册。

关于芯片内部闪存的编程，擦除和保护操作，请参考STM32F10xxx闪存编程手册。

关于ARM Cortex™-M3内核的具体信息，请参考Cortex™-M3技术参考手册。

相关文档● Cortex™-M3技术参考手册，可按下述链接下载：/help/topic/com.arm.doc.ddi0337e/DDI0337E_cortex_m3_r1p1_trm.pdf下述文档可在ST网站下载(/mcu/)：● STM32F101xx、STM32F102xx和STM32F103xx的数据手册。

● STM32F10xxx闪存编程手册。

* 感谢南京万利提供原始翻译文档目录1文中的缩写 161.1寄存器描述表中使用的缩写列表 161.2术语表161.3可用的外设16 2存储器和总线构架 172.1系统构架172.2存储器组织182.3存储器映像192.3.1嵌入式SRAM 202.3.2位段202.3.3嵌入式闪存 212.4启动配置23 3CRC计算单元(CRC) 253.1CRC简介253.2CRC主要特性253.3CRC功能描述253.4CRC寄存器263.4.1数据寄存器(CRC_DR) 263.4.2独立数据寄存器(CRC_IDR) 263.4.3控制寄存器(CRC_CR) 273.4.4CRC寄存器映像 27 4电源控制(PWR) 284.1电源284.1.1独立的A/D转换器供电和参考电压 284.1.2电池备份区域 294.1.3电压调节器 294.2电源管理器294.2.1上电复位(POR)和掉电复位(PDR) 294.2.2可编程电压监测器(PVD) 304.3低功耗模式304.3.1降低系统时钟 314.3.2外部时钟的控制 314.3.3睡眠模式 314.3.4停止模式 324.3.5待机模式 334.3.6低功耗模式下的自动唤醒(AWU) 344.4电源控制寄存器 354.4.1电源控制寄存器(PWR_CR) 354.4.2电源控制/状态寄存器 364.4.3PWR寄存器地址映像 37 5备份寄存器(BKP) 385.1BKP简介385.2BKP特性385.3BKP功能描述385.3.1侵入检测 385.3.2RTC校准 395.4BKP寄存器描述 395.4.1备份数据寄存器x(BKP_DRx) (x = 1 … 10) 395.4.2RTC时钟校准寄存器(BKP_RTCCR) 395.4.3备份控制寄存器(BKP_CR) 405.4.4备份控制/状态寄存器(BKP_CSR) 405.4.5BKP寄存器映像 42 6复位和时钟控制(RCC) 456.1复位456.1.1系统复位 456.1.2电源复位 456.1.3备份域复位 466.2时钟466.2.1HSE时钟 486.2.2HSI时钟 486.2.3PLL 496.2.4LSE时钟 496.2.5LSI时钟496.2.6系统时钟(SYSCLK)选择 506.2.7时钟安全系统(CSS) 506.2.8RTC时钟 506.2.9看门狗时钟 506.2.10时钟输出 506.3RCC寄存器描述 516.3.1时钟控制寄存器(RCC_CR) 516.3.2时钟配置寄存器(RCC_CFGR) 526.3.3时钟中断寄存器 (RCC_CIR) 546.3.4APB2外设复位寄存器 (RCC_APB2RSTR) 566.3.5APB1外设复位寄存器 (RCC_APB1RSTR) 586.3.6AHB外设时钟使能寄存器 (RCC_AHBENR) 606.3.7APB2外设时钟使能寄存器(RCC_APB2ENR) 616.3.8APB1外设时钟使能寄存器(RCC_APB1ENR) 626.3.9备份域控制寄存器 (RCC_BDCR) 656.3.10控制/状态寄存器 (RCC_CSR) 666.3.11RCC寄存器地址映像 68 7通用和复用功能I/O(GPIO和AFIO) 697.1GPIO功能描述697.1.1通用I/O(GPIO) 707.1.2单独的位设置或位清除 717.1.3外部中断/唤醒线 717.1.4复用功能(AF) 717.1.5软件重新映射I/O复用功能 717.1.6GPIO锁定机制 717.1.7输入配置 717.1.8输出配置 727.1.9复用功能配置 737.1.10模拟输入配置 737.2GPIO寄存器描述 757.2.1端口配置低寄存器(GPIOx_CRL) (x=A..E) 757.2.2端口配置高寄存器(GPIOx_CRH) (x=A..E) 757.2.3端口输入数据寄存器(GPIOx_IDR) (x=A..E) 767.2.4端口输出数据寄存器(GPIOx_ODR) (x=A..E) 767.2.5端口位设置/清除寄存器(GPIOx_BSRR) (x=A..E) 777.2.6端口位清除寄存器(GPIOx_BRR) (x=A..E) 777.2.7端口配置锁定寄存器(GPIOx_LCKR) (x=A..E) 777.3复用功能I/O和调试配置(AFIO) 787.3.1把OSC32_IN/OSC32_OUT作为GPIO 端口PC14/PC15 787.3.2把OSC_IN/OSC_OUT引脚作为GPIO端口PD0/PD1 787.3.3CAN复用功能重映射 797.3.4JTAG/SWD复用功能重映射 797.3.5ADC复用功能重映射 807.3.6定时器复用功能重映射 807.3.7USART复用功能重映射 817.3.8I2C 1 复用功能重映射 827.3.9SPI 1复用功能重映射 827.4AFIO寄存器描述 837.4.1事件控制寄存器(AFIO_EVCR) 837.4.2复用重映射和调试I/O配置寄存器(AFIO_MAPR) 837.4.3外部中断配置寄存器1(AFIO_EXTICR1) 867.4.4外部中断配置寄存器2(AFIO_EXTICR2) 867.4.5外部中断配置寄存器3(AFIO_EXTICR3) 877.4.6外部中断配置寄存器4(AFIO_EXTICR4) 877.5GPIO 和AFIO寄存器地址映象 88 8中断和事件 898.1嵌套向量中断控制器 898.1.1系统嘀嗒(SysTick)校准值寄存器 898.1.2中断和异常向量 898.2外部中断/事件控制器(EXTI) 918.2.1主要特性 918.2.2框图928.2.3唤醒事件管理 928.2.4功能说明 928.2.5外部中断/事件线路映像 948.3EXTI 寄存器描述 958.3.1中断屏蔽寄存器(EXTI_IMR) 958.3.2事件屏蔽寄存器(EXTI_EMR) 958.3.3上升沿触发选择寄存器(EXTI_RTSR) 968.3.4下降沿触发选择寄存器(EXTI_FTSR) 968.3.5软件中断事件寄存器(EXTI_SWIER) 978.3.6挂起寄存器(EXTI_PR) 978.3.7外部中断/事件寄存器映像 98 9DMA 控制器(DMA) 999.1DMA简介999.2DMA主要特性999.3功能描述1009.3.1DMA处理 1009.3.2仲裁器1009.3.3DMA 通道 1019.3.4可编程的数据传输宽度，对齐方式和数据大小端 1029.3.5错误管理 1039.3.6中断1039.3.7DMA请求映像 1049.4DMA寄存器1079.4.1DMA中断状态寄存器(DMA_ISR) 1079.4.2DMA中断标志清除寄存器(DMA_IFCR) 1089.4.3DMA通道x配置寄存器(DMA_CCRx)(x = 1…7) 1089.4.4DMA通道x传输数量寄存器(DMA_CNDTRx)(x = 1…7) 1109.4.5DMA通道x外设地址寄存器(DMA_CPARx)(x = 1…7) 1109.4.6DMA通道x存储器地址寄存器(DMA_CPARx)(x = 1…7) 1109.4.7DMA寄存器映像 111 10模拟/数字转换(ADC) 11310.1ADC介绍11310.2ADC主要特征11310.3ADC功能描述11410.3.1ADC开关控制 11510.3.2ADC时钟 11510.3.3通道选择 11510.3.4单次转换模式 11510.3.5连续转换模式 11610.3.6时序图11610.3.7模拟看门狗 11610.3.8扫描模式 11710.3.9注入通道管理 11710.3.10间断模式 11810.4校准11910.5数据对齐11910.6可编程的通道采样时间 12010.7外部触发转换12010.8DMA请求12110.9双ADC模式12110.9.1同步注入模式 12210.9.2同步规则模式 12310.9.3快速交替模式 12310.9.4慢速交替模式 12410.9.5交替触发模式 12410.9.6独立模式 12510.9.7混合的规则/注入同步模式 12510.9.8混合的同步规则+交替触发模式 12510.9.9混合同步注入+交替模式 12610.10温度传感器12610.11ADC中断12710.12ADC寄存器描述 12810.12.1ADC状态寄存器(ADC_SR) 12810.12.2ADC控制寄存器1(ADC_CR1) 12910.12.3ADC控制寄存器2(ADC_CR2) 13110.12.4ADC采样时间寄存器1(ADC_SMPR1) 13310.12.5ADC采样时间寄存器2(ADC_SMPR2) 13310.12.6ADC注入通道数据偏移寄存器x (ADC_JOFRx)(x=1..4) 13410.12.7ADC看门狗高阀值寄存器(ADC_HTR) 13410.12.8ADC看门狗低阀值寄存器(ADC_LRT) 13410.12.9ADC规则序列寄存器1(ADC_SQR1) 13510.12.10ADC规则序列寄存器2(ADC_SQR2) 13510.12.11ADC规则序列寄存器3(ADC_SQR3) 13610.12.12ADC注入序列寄存器(ADC_JSQR) 13610.12.13ADC 注入数据寄存器x (ADC_JDRx) (x= 1..4) 13710.12.14ADC规则数据寄存器(ADC_DR) 13710.12.15ADC寄存器地址映像 138 11数字/模拟转换(DAC) 14011.1DAC简介14011.2DAC主要特征14011.3DAC功能描述14111.3.1使能DAC通道 14111.3.2使能DAC输出缓存 14111.3.3DAC数据格式 14211.3.4DAC转换 14211.3.5DAC输出电压 14311.3.6选择DAC触发 14311.3.7DMA请求 14411.3.8噪声生成 14411.3.9三角波生成 14511.4双DAC通道转换 14511.4.1无波形生成的独立触发 14511.4.2带相同LFSR生成的独立触发 14611.4.3带不同LFSR生成的独立触发 14611.4.4带相同三角波生成的独立触发 14611.4.5带不同三角波生成的独立触发 14611.4.6同时软件启动 14711.4.7不带波形生成的同时触发 14711.4.8带相同LFSR生成的同时触发 14711.4.9带不同LFSR生成的同时触发 14711.4.10带相同三角波生成的同时触发 14711.4.11带不同三角波生成的同时触发 14811.5DAC寄存器14911.5.1DAC控制寄存器(DAC_CR) 14911.5.2DAC软件触发寄存器(DAC_SWTRIGR) 15111.5.3DAC通道1的12位右对齐数据保持寄存器(DAC_DHR12R1) 15211.5.4DAC通道1的12位左对齐数据保持寄存器(DAC_DHR12L1) 15211.5.5DAC通道1的8位右对齐数据保持寄存器(DAC_DHR8R1) 15211.5.6DAC通道2的12位右对齐数据保持寄存器(DAC_DHR12R2) 15311.5.7DAC通道2的12位左对齐数据保持寄存器(DAC_DHR12L2) 15311.5.8DAC通道2的8位右对齐数据保持寄存器(DAC_DHR8R2) 15311.5.9双DAC的12位右对齐数据保持寄存器(DAC_DHR12RD) 15411.5.10双DAC的12位左对齐数据保持寄存器(DAC_DHR12LD) 15411.5.11双DAC的8位右对齐数据保持寄存器(DAC_DHR8RD) 15411.5.12DAC通道1数据输出寄存器(DAC_DOR1) 15511.5.13DAC通道2数据输出寄存器(DAC_DOR2) 15511.5.14DAC寄存器映像 156 12高级控制定时器(TIM1和TIM8) 15712.1TIM1和TIM8简介 15712.2TIM1和TIM8主要特性 15712.3TIM1和TIM8功能描述 15812.3.1时基单元 15812.3.2计数器模式 16012.3.3重复计数器 16712.3.4时钟选择 16812.3.5捕获/比较通道 17112.3.6输入捕获模式 17312.3.7PWM输入模式 17412.3.8强置输出模式 17412.3.9输出比较模式 17512.3.10PWM模式 17612.3.11互补输出和死区插入 17812.3.12使用刹车功能 17912.3.13在外部事件时清除OCxREF信号 18012.3.14产生六步PWM输出 18112.3.15单脉冲模式 18212.3.16编码器接口模式 18312.3.17定时器输入异或功能 18512.3.18与霍尔传感器的接口 18512.3.19TIMx定时器和外部触发的同步 18712.3.20定时器同步 19012.3.21调试模式 19012.4TIM1和TIM8寄存器描述 19112.4.1控制寄存器1(TIMx_CR1) 19112.4.2控制寄存器2(TIMx_CR2) 19212.4.3从模式控制寄存器(TIMx_SMCR) 19312.4.4DMA/中断使能寄存器(TIMx_DIER) 19512.4.5状态寄存器(TIMx_SR) 19612.4.6事件产生寄存器(TIMx_EGR) 19712.4.7捕获/比较模式寄存器1(TIMx_CCMR1) 19812.4.8捕获/比较模式寄存器2(TIMx_CCMR2) 20012.4.9捕获/比较使能寄存器(TIMx_CCER) 20212.4.10计数器(TIMx_CNT) 20312.4.11预分频器(TIMx_PSC) 20412.4.12自动重装载寄存器(TIMx_ARR) 20412.4.13重复计数寄存器(TIMx_RCR) 20412.4.14捕获/比较寄存器1(TIMx_CCR1) 20512.4.15捕获/比较寄存器2(TIMx_CCR2) 20512.4.16捕获/比较寄存器3(TIMx_CCR3) 20512.4.17捕获/比较寄存器(TIMx_CCR4) 20612.4.18刹车和死区寄存器(TIMx_BDTR) 20612.4.19DMA控制寄存器(TIMx_DCR) 20812.4.20连续模式的DMA地址(TIMx_DMAR) 20812.4.21TIM1和TIM8寄存器图 209 13通用定时器(TIMx) 21113.1TIMx简介21113.2TIMx主要功能21113.3TIMx功能描述21213.3.1时基单元 21213.3.2计数器模式 21313.3.3时钟选择 22113.3.4捕获/比较通道 22313.3.5输入捕获模式 22513.3.6PWM输入模式 22513.3.7强置输出模式 22613.3.8输出比较模式 22613.3.9PWM 模式 22713.3.10单脉冲模式 22913.3.11在外部事件时清除OCxREF信号 23113.3.12编码器接口模式 23113.3.13定时器输入异或功能 23313.3.14定时器和外部触发的同步 23313.3.15定时器同步 23513.3.16调试模式 23913.4TIMx寄存器描述 24013.4.1控制寄存器1(TIMx_CR1) 24013.4.2控制寄存器2(TIMx_CR2) 24113.4.3从模式控制寄存器(TIMx_SMCR) 24213.4.4DMA/中断使能寄存器(TIMx_DIER) 24313.4.5状态寄存器(TIMx_SR) 24413.4.6事件产生寄存器(TIMx_EGR) 24513.4.7捕获/比较模式寄存器1(TIMx_CCMR1) 24613.4.8捕获/比较模式寄存器2(TIMx_CCMR2) 24913.4.9捕获/比较使能寄存器(TIMx_CCER) 25113.4.10计数器(TIMx_CNT) 25213.4.11预分频器(TIMx_PSC) 25213.4.12自动重装载寄存器(TIMx_ARR) 25213.4.13捕获/比较寄存器1(TIMx_CCR1) 25213.4.14捕获/比较寄存器2(TIMx_CCR2) 25313.4.15捕获/比较寄存器3(TIMx_CCR3) 25313.4.16捕获/比较寄存器4(TIMx_CCR4) 25313.4.17DMA控制寄存器(TIMx_DCR) 25413.4.18连续模式的DMA地址(TIMx_DMAR) 25413.4.19TIMx寄存器图 255 14基本定时器(TIM6和TIM7) 25714.1TIM6和TIM7简介 25714.2TIM6和TIM7的主要特性 25714.3TIM6和TIM7的功能 25814.3.1时基单元 25814.3.2计数模式 25914.3.3时钟源26114.3.4调试模式 26214.4TIM6和TIM7寄存器 26214.4.1控制寄存器1(TIMx_CR1) 26214.4.2控制寄存器2(TIMx_CR2) 26314.4.3DMA/中断使能寄存器(TIMx_DIER) 26314.4.4状态寄存器(TIMx_SR) 26414.4.5事件产生寄存器(TIMx_EGR) 26414.4.6计数器(TIMx_CNT) 26414.4.7预分频器(TIMx_PSC) 26514.4.8自动重装载寄存器(TIMx_ARR) 26514.4.9TIM6和TIM7寄存器图 266 15实时时钟(RTC) 26715.1RTC简介26715.2主要特性26715.3功能描述26715.3.1概述26715.3.2复位过程 26815.3.3读RTC寄存器 26815.3.4配置RTC寄存器 26915.3.5RTC标志的设置 26915.4RTC寄存器描述 27015.4.1RTC控制寄存器高位(RTC_CRH) 27015.4.2RTC控制寄存器低位(RTC_CRL) 27015.4.3RTC预分频装载寄存器(RTC_PRLH/RTC_PRLL) 27115.4.4RTC预分频器余数寄存器(RTC_DIVH / RTC_DIVL) 27215.4.5RTC计数器寄存器 (RTC_CNTH / RTC_CNTL) 27215.4.6RTC闹钟寄存器(RTC_ALRH/RTC_ALRL) 27315.4.7RTC寄存器映像 275 16独立看门狗(IWDG) 27616.1简介27616.2IWDG主要性能27616.3IWDG功能描述27616.3.1硬件看门狗 27616.3.2寄存器访问保护 27616.3.3调试模式 27616.4IWDG寄存器描述 27716.4.1键寄存器(IWDG_KR) 27716.4.2预分频寄存器(IWDG_PR) 27816.4.3重装载寄存器(IWDG_RLR) 27816.4.4状态寄存器(IWDG_SR) 27916.4.5IWDG寄存器映像 279 17窗口看门狗(WWDG) 28017.1WWDG简介28017.2WWDG主要特性 28017.3WWDG功能描述 28017.4如何编写看门狗超时程序 28117.5调试模式28217.6寄存器描述28217.6.1控制寄存器(WWDG_CR) 28217.6.2配置寄存器(WWDG_CFR) 28317.6.3状态寄存器(WWDG_SR) 28317.6.4WWDG寄存器映像 284 18灵活的静态存储器控制器(FSMC) 28518.1FSMC功能描述28518.2框图28518.3AHB接口28618.3.1支持的存储器和操作 28618.4外部设备地址映像 28718.4.1NOR和PSRAM地址映像 28818.4.2NAND和PC卡地址映像 28818.5NOR闪存和PSRAM控制器 28918.5.1外部存储器接口信号 29018.5.2支持的存储器及其操作 29118.5.3时序规则 29118.5.4NOR闪存和PSRAM时序图 29118.5.5同步的成组读 30418.5.6NOR闪存和PSRAM控制器寄存器 30818.6NAND闪存和PC卡控制器 31318.6.1外部存储器接口信号 31318.6.2NAND闪存/PC卡支持的存储器及其操作 31418.6.3NAND闪存、ATA和PC卡时序图 31418.6.4NAND闪存操作 31518.6.5NAND闪存预等待功能 31618.6.6NAND闪存的纠错码ECC计算(NAND闪存) 31718.6.7NAND闪存和PC卡控制器寄存器 31718.7FSMC寄存器地址映象 324 19SDIO接口(SDIO) 32519.1SDIO主要功能32519.2SDIO总线拓扑32519.3SDIO功能描述32819.3.1SDIO适配器 32919.3.2SDIO AHB接口 33619.4卡功能描述33619.4.1卡识别模式 33619.4.2卡复位33619.4.3操作电压范围确认 33719.4.4卡识别过程 33719.4.5写数据块 33819.4.6读数据块 33819.4.7数据流操作，数据流写入和数据流读出(只适用于多媒体卡) 33819.4.8擦除：成组擦除和扇区擦除 33919.4.9宽总线选择和解除选择 34019.4.10保护管理 34019.4.11卡状态寄存器 34219.4.12SD状态寄存器 34419.4.13SD I/O模式 34719.4.14命令与响应 34819.5响应格式35019.5.1R1(普通响应命令) 35119.5.2R1b 35119.5.3R2(CID、CSD寄存器) 35119.5.4R3(OCR寄存器) 35119.5.5R4(快速I/O) 35219.5.6R4b 35219.5.7R5(中断请求) 35219.5.8R6(中断请求) 35319.6SDIO I/O卡特定的操作 35319.6.1使用SDIO_D2信号线的SDIO I/O读等待操作 35319.6.2使用停止SDIO_CK的SDIO读等待操作 35319.6.3SDIO暂停/恢复操作 35419.6.4SDIO中断 35419.7CE-ATA特定操作 35419.7.1命令完成指示关闭 35419.7.2命令完成指示使能 35419.7.3CE-ATA中断 35419.7.4中止CMD61 35419.8硬件流控制35419.9SDIO寄存器35519.9.1SDIO电源控制寄存器(SDIO_POWER) 35519.9.2SDIO时钟控制寄存器(SDIO_CLKCR) 35519.9.3SDIO参数寄存器(SDIO_ARG) 35619.9.4SDIO命令寄存器(SDIO_CMD) 35619.9.5SDIO命令响应寄存器(SDIO_RESPCMD) 35719.9.6SDIO响应1..4寄存器(SDIO_RESPx) 35719.9.7SDIO数据定时器寄存器(SDIO_DTIMER) 35819.9.8SDIO数据长度寄存器(SDIO_DLEN) 35819.9.9SDIO数据控制寄存器(SDIO_DCTRL) 35819.9.10SDIO数据计数器寄存器(SDIO_DCOUNT) 36019.9.11SDIO状态寄存器(SDIO_STA) 36019.9.12SDIO清除中断寄存器(SDIO_ICR) 36119.9.13SDIO中断屏蔽寄存器(SDIO_MASK) 36219.9.14SDIO FIFO计数器寄存器(SDIO_FIFOCNT) 36419.9.15SDIO数据FIFO寄存器(SDIO_FIFO) 36419.9.16SDIO寄存器映像 365 20USB全速设备接口(USB) 36620.1USB简介36620.2USB主要特征36620.3USB功能描述36720.3.1USB功能模块描述 36820.4编程中需要考虑的问题 36920.4.1通用USB设备编程 36920.4.2系统复位和上电复位 36920.4.3双缓冲端点 37220.4.4同步传输 37320.4.5挂起/恢复事件 37420.5USB寄存器描述 37520.5.1通用寄存器 37520.5.2端点寄存器 38020.5.3缓冲区描述表 38220.5.4USB寄存器映像 385 21控制器局域网(bxCAN) 38721.1bxCAN简介38721.2bxCAN主要特点 38721.2.1总体描述 38821.3bxCAN工作模式 38921.3.1初始化模式 39021.3.2正常模式 39021.3.3睡眠模式(低功耗) 39021.3.4测试模式 39021.3.5静默模式 39021.3.6环回模式 39121.3.7环回静默模式 39121.4bxCAN功能描述 39221.4.1发送处理 39221.4.2时间触发通信模式 39321.4.3接收管理 39321.4.4标识符过滤 39521.4.5报文存储 39821.4.6出错管理 39921.4.7位时间特性 40021.5bxCAN中断40221.6CAN 寄存器描述 40321.6.1寄存器访问保护 40321.6.2控制和状态寄存器 40321.6.3邮箱寄存器 41121.6.4CAN过滤器寄存器 41521.6.5bxCAN寄存器列表 419 22串行外设接口(SPI) 42222.1SPI简介42222.2SPI和I2S主要特征 42222.2.1SPI特征42222.2.2I2S功能42322.3SPI功能描述42422.3.1概述42422.3.2SPI从模式 42622.3.3SPI主模式 42722.3.4单工通信 42822.3.5状态标志 42822.3.6CRC计算 42922.3.7利用DMA的SPI通信 42922.3.8错误标志 43022.3.9关闭SPI 43022.3.10SPI中断43022.4I2S功能描述43122.4.1I2S功能描述 43122.4.2支持的音频协议 43222.4.3时钟发生器 43722.4.4I2S主模式 43822.4.5I2S从模式 43922.4.6状态标志位 44022.4.7错误标志位 44122.4.8I2S中断44122.4.9DMA功能 44122.5SPI和I2S寄存器描述 44222.5.1SPI控制寄存器1(SPI_CR1)(I2S模式下不使用) 44222.5.2SPI控制寄存器2(SPI_CR2) 44322.5.3SPI 状态寄存器(SPI_SR) 44422.5.4SPI 数据寄存器(SPI_DR) 44522.5.5SPI CRC多项式寄存器(SPI_CRCPR) 44622.5.6SPI Rx CRC寄存器(SPI_RXCRCR) 44622.5.7SPI Tx CRC寄存器(SPI_TXCRCR) 44622.5.8SPI_I2S配置寄存器(SPI_I2S_CFGR) 44722.5.9SPI_I2S预分频寄存器(SPI_I2SPR) 44822.5.10SPI 寄存器地址映象 449 23I2C接口45023.1I2C简介45023.2I2C主要特点45023.3I2C功能描述45123.3.1模式选择 45123.3.2I2C从模式 45223.3.3I2C主模式 45423.3.4错误条件 45623.3.5SDA/SCL线控制 45723.3.6SMBus 45723.3.7DMA请求 45923.3.8包错误校验(PEC) 46023.4I2C中断请求46123.5I2C调试模式46223.6I2C寄存器描述46223.6.1控制寄存器1(I2C_CR1) 46223.6.2控制寄存器2(I2C_CR2) 46423.6.3自身地址寄存器1(I2C_OAR1) 46523.6.4自身地址寄存器2(I2C_OAR2) 46523.6.5数据寄存器(I2C_DR) 46523.6.6状态寄存器1(I2C_SR1) 46623.6.7状态寄存器2 (I2C_SR2) 46823.6.8时钟控制寄存器(I2C_CCR) 46923.6.9TRISE寄存器(I2C_TRISE) 47023.6.10I2C寄存器地址映象 471 24通用同步异步收发器(USART) 47224.1USART介绍47224.2USART主要特性 47224.3USART功能概述 47324.3.1USART 特性描述 47424.3.2发送器47524.3.3接收器47724.3.4分数波特率的产生 48024.3.5多处理器通信 48124.3.6校验控制 48224.3.7LIN(局域互联网)模式 48324.3.8USART 同步模式 48524.3.9单线半双工通信 48724.3.10智能卡48724.3.11IrDA SIR ENDEC 功能块 48824.3.12利用DMA连续通信 49024.3.13硬件流控制 49124.4USART中断请求 49224.5USART模式配置 49324.6USART寄存器描述 49424.6.1状态寄存器(USART_SR) 49424.6.2数据寄存器(USART_DR) 49524.6.3波特比率寄存器(USART_BRR) 49624.6.4控制寄存器1(USART_CR1) 49624.6.5控制寄存器2(USART_CR2) 49824.6.6控制寄存器3(USART_CR3) 49924.6.7保护时间和预分频寄存器(USART_GTPR) 50124.6.8USART寄存器地址映象 502 25器件电子签名 50325.1存储器容量寄存器 50325.1.1闪存容量寄存器 50325.2产品唯一身份标识寄存器(96位) 503 26调试支持(DBG) 50526.1概况50526.2ARM参考文献50626.3SWJ调试端口(serial wire and JTAG) 50626.3.1JTAG-DP和SW-DP切换的机制 50726.4引脚分布和调试端口脚 50726.4.1SWJ调试端口脚 50726.4.2灵活的SWJ-DP脚分配 50726.4.3JTAG脚上的内部上拉和下拉 50826.4.4利用串行接口并释放不用的调试脚作为普通I/O口 50826.5STM32F10xxx JTAG TAP 连接 50926.6ID 代码和锁定机制 50926.6.1微控制器设备ID编码 50926.6.2边界扫描TAP 51026.6.3Cortex-M3 TAP 51026.6.4Cortex-M3 JEDEC-106 ID代码 51126.7JTAG调试端口51126.8SW调试端口51226.8.1SW协议介绍 51226.8.2SW协议序列 51226.8.3SW-DP状态机(Reset, idle states, ID code) 51326.8.4DP和AP读/写访问 51326.8.5SW-DP寄存器 51326.8.6SW-AP寄存器 514 26.9对于JTAG-DP或SWDP都有效的AHB-AP (AHB 访问端口) 514 26.10内核调试515 26.11调试器主机在系统复位下的连接能力 515 26.12FPB (Flash patch breakpoint) 515 26.13DWT(data watchpoint trigger) 516 26.14ITM (instrumentation trace macrocell) 51626.14.1概述51626.14.2时间戳包，同步和溢出包 516 26.15MCU调试模块(MCUDBG) 51726.15.1低功耗模式的调试支持 51726.15.2支持定时器、看门狗、bxCAN和I2C的调试 51826.15.3调试MCU配置寄存器 518 26.16TPIU (trace port interface unit) 52026.16.1导言52026.16.2跟踪引脚分配 52026.16.3TPUI格式器 52226.16.4TPUI帧异步包 52226.16.5同步帧包的发送 52226.16.6同步模式 52226.16.7异步模式 52326.16.8TRACECLKIN在STM32F10xxx内部的连接 52326.16.9TPIU寄存器 52326.16.10配置的例子 524 26.17DBG寄存器地址映象 5241 文中的缩写1.1 寄存器描述表中使用的缩写列表在对寄存器的描述中使用了下列缩写：read / write (rw) 软件能读写此位。

DK-STM32F开发板用户手册

DK-STM32F开发板⽤户⼿册UM0426User manualSTM3210B-EVALevaluation boardIntroductionThe STM3210B-EVAL is an evaluation board for STMicroelectronic’s ARM TM Cortex-M3 core-based STM32F10x 128K microcontrollers. It is designed as a complete development environment for the STM32F10x microcontrollers with full speed USB2.0, CAN2.0A/B compliant interface, two I2C channels, two SPI channels, three USART channels with smartcard support, internal 20KB SRAM and 128KB Flash, JTAG and SWD debugging. With a complete range of hardware evaluations features, the STM3210B-EVAL board is designed to help developers evaluate all device peripherals (such as USB, motor control, CAN, MicroSD card, smartcard, USART) and develop their own applications. Extension connectors make it possible to easily connect a daughter board or wrapping board for a specific application.This user manual provides information on using the STM3210B-EVAL board and its hardware features.Figure 1.STM32F10X 128K evaluation board (STM3210B-EVAL)October 2007 Rev 41/46/doc/986145873.htmlUM04262/46Features●Three 5V power supply options: power jack, USB connector or daughter board●Boot from user Flash, test Flash or SRAM●Audio play and record●64Mbyte MicroSD card●Type A and Type B smartcard support●8Mbyte serial Flash●I2C/SMBus compatible serial interface temperature sensor●Two RS232 communication channels with support for RTS/CTS handshake on one channel●IrDA transceiver●USB 2.0 full speed connection●CAN 2.0A/B compliant connection●Induction motor control connector●JTAG, SWD and trace tool support●240x320 TFT color LCD●Joystick with 4-direction control and selector●Reset, wakeup, tamper and user push buttons● 4 LEDs●RTC with backup battery●Extension connector for daughter board or wrapping boardOrder codeTo order the STM32F10x 128K evaluation board, use the order code STM3210B-EVAL. UM0426ContentsContents1Hardware layout and configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51.1LCD configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71.2Power supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91.3Boot option . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101.4Clock source . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101.5Reset source . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111.6Audio . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111.7Serial flash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111.8CAN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111.9RS232 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121.10Motor control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121.11Smartcard . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131.12MicroSD card . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131.13Temperature sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131.14Analog input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131.15IrDA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 141.16USB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 141.17Development and debug support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 141.18Display and input devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 152Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 162.1USB type B connector CN1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 162.2CAN D-type 9-pin male connector CN2 . . . . . . . . . . . . . . . . . . . . . . . . . . 162.3Analog input connector CN3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 172.4Power supply connector CN4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 172.5RS232 connector CN5 with RTS/CTS handshake support . . . . . . . . . . . 182.6RS232 connector CN6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 182.7JTAG debugging connector CN7 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 192.8Audio jack CN8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 192.9SWD debugging connector CN9 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 192.10Trace debugging connector CN10 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 203/46Contents UM04264/462.11Daughter board extension connectors CN12 and CN13 . . . . . . . . . . . . . 21 2.12Motor control connector CN14 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 2.13MicroSD connector CN15 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 2.14Smartcard connector CN16 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 263Schematics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 Appendix A STM3210B-EVAL IO assignments . . . . . . . . . . . . . . . . . . . . . . . . . . 41 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45UM0426Hardware layout and configuration 1 Hardware layout and configurationThe STM3210B-EVAL board is designed around a STM32F103VBT6 microcontroller in a100-pin LQFP package.The hardware block diagram Figure2 shows the connections between the STM32F10xmicrocontroller and peripherals (LCD, SPI Flash, USART, IrDA, USB, Audio, CAN bus, RTC,smartcard, MicroSD card and motor control).Figure3will help you locate these features on the evaluation board.5/46Hardware layout and configuration UM04266/46Figure 3.STM3210B-EVAL board layoutCN12Extension connectorCN5USART2U1STM32F103VBT6CN6USART1U11IrDACN1USBCN45V powerB1RESET B2WAKEUP CN16Smartcard B4T amper U18JoystickB3General purpose keyCN14Motor controlCN2CAN connectorCN9SWDCN10T raceCN7JT AGU17Color LCDCN8Audio jackRV1PotentiometerCN13Extension connectorCN15MicroSD cardUM0426Hardware layout and configuration7/46The following sections provide jumper settings for configuring your STM3210B-EVAL board and peripherals.Two types of jumpers are used on the STM3210B-EVAL board:●3-pin jumpers with two possible positions, for which the possible settings are presented in schematics in the following sections●2-pin jumpers with two possible settings: Fitted – the circuit is closed, and Not fitted – the circuit is open (see Figure 4.) Figure 4.Settings for two-pin jumpersconfigurationThe STM3210B-EVAL can be delivered with either one of two LCDs mounted on the MB542board, depending on the board version. These two LCDs look alike and operate in the same way, however they have different control circuits, and therefore require different software drivers. Y ou must ensure that the demonstration software pre-loaded in the flash memory of the microcontroller on the evaluation board supports the LCD that you have.If your STM3210B-EVAL product includes the MB542 board version B-01 or later , it is mounted with the LCD referenceAM240320L8TNQW-00H (from Ampire). The controller reference is ILI9320 (from ILITEK,/doc/986145873.html). The products that include this LCD have a label on the daughter board (to the left of the display) as shown in Figure5.Figure 5.LCD label on MB542 board version B-01 or laterNot fittedFittedHardware layout and configurationUM04268/46The demonstration software delivered with the evaluation boards that carry this label is STM3210B-EVAL_DEMO version 1.1 or later. It automatically detects which version of the LCD is mounted on the daughter board, and it supports both.If your STM3210B-EVAL product includes the MB542 board version B-00 or earlier , it is mounted with the LCD reference AM-240320LTNQW01H. The controller reference is HX8312-A (from Himax, /doc/986145873.html ). The products that include this LCD do not have a label on the component side of the daughter board as shown in Figure 6. The label is on the solder side, therefore not visible when the MB452 board is screwed onto the MB525 board.Figure 6.No LCD label on component side of MB542 board version B-00The demonstration software delivered with the evaluation boards that do not carry a visible label is STM3210B-EVAL_DEMO version 1.0 or earlier. This software only supports the LCD reference AM-240320LTNQW01H.Note:Y ou can download the latest version of the software demonstration from theSTmicroelectronics support site, /doc/986145873.html/mcu. The STM3210B-EVAL_DEMO software is included in the STM3210B-EVAL demonstration software user manual (UM0435)download file. STM3210B-EVAL_DEMO version 1.1 and later support both types of LCD.Table 1.LCD label on MB542 board version B-01 or laterLabel markingMeaningMB542B-0120743001LCD version B-01B PCB version B 01Version 0120743001Board IDUM0426Hardware layout and configuration9/461.2 Power supplyThe STM3210B-EVAL board is designed to be powered by 5V DC power supply and to beprotected by PolyZen U6 in case of incorrect power supply configuration. It is possible to configure the evaluation board to use any of the following sources for the power supply.●5V DC power adapter connected to CN4, the power supply jack labeled “PSU” (for Power Supply Unit) on the silkscreen ●5V DC power with 500mA limitation from CN1, the type-B USB connector on the evaluation board labeled “USB” on the silkscreen●5V DC power from both CN12 and CN13, the daughter board extension connectors labeled “DTB” (for Daughter Board) on the silkscreenThe power supply is configured by setting the related jumpers JP4, JP9 and JP11 as described in T able 2.The LED LD5 is lit when the STM3210B-EVAL board is powered correctly.Hardware layout and configuration UM042610/461.3 Boot optionThe STM3210B-EVAL board is able to boot from:●Embedded user Flash●System memory with boot loader for ISP ●Embedded SRAM for debuggingThe boot option is configured by setting the switches SW1 and SW2 as shown in Table 3.The two possible positions of these micro switches are shown in Figure 7.Figure 7.Switch positions1.4 Clock sourceTwo clock sources are available on the STM3210B-EVAL board for the STM32F10Xmicrocontroller and RTC.●X1, 32KHz crystal for embedded RTC●X2, 8MHz crystal with socket for the STM32F10X microcontroller. It can be removed from the socket when the internal RC clock is used.Table 3.Boot switchesSwitchBoot fromSwitch configurationSTM3210B-EVAL boots from user Flash when SW2 is set as shown to the right (default setting).In this configuration, the position of SW1 doesn’t affect the boot process.Boot 0 = 0, Boot 1 = XSTM3210B-EVAL boots from embedded SRAM when SW1 and SW2 are set as shown to the right. Boot 0 = 1, Boot 1 = 1 STM3210B-EVAL boots from system memory when SW1 and SW2 are set as shown to the right.Boot 0 = 1, Boot 1 = 01 <> 0Switch in position “1”Switch in position “0”1 <> 0S W 1B o o t 1S W 2B o o t 01 <> 0S W 1B o o t 1S W 2B o o t 01 <> 0S W 1B o o t 1S W 2B o o t 0UM0426Hardware layout and configuration11/461.5 Reset sourceThe reset signal of the STM3210B-EVAL board is active low and the reset sources include:●Reset button B1●Debugging tools from connector CN7, CN9 and CN10●Daughter board from CN131.6 AudioThe STM3210B-EVAL board supports both audio recording and playback. This can bedisabled or enabled by setting the jumpers JP6 and JP7. The audio volume can be adjusted using the potentiometer RV2, and the microphone amplifier gain can be adjusted using the potentiometer RV3.1.7 Serial flashA 64Mbit serial flash connected to SPI1 of the STM32F10X microcontroller shares the sameSPI port with the MicroSD card using a different chip select signal. Serial Flash Chip select is managed by the standard IO port PA4.1.8 CANThe STM3210B-EVAL board supports CAN 2.0A/B compliant CAN bus communication based on 3.3V CAN transceiver. The high-speed mode, standby mode and slope control mode are available and selected by setting JP2.Table 4.Reset jumperDescriptionJP10Enables reset of the STM32F10X microcontroller embedded JT AG T AP controllereach time a system reset occurs. JP10 connects the TRST signal from the JT AG connection with the system reset signal RESET#.Default setting: Not fittedTable 5.Audio jumpersJumper DescriptionJP6Audio power amplifier TS4871 is forced into standby mode when JP6 is not fitted. Default setting: FittedJP7Microphone pre-amplifier MAX4061 is forced into shutdown mode when JP7 is fitted. Default setting: Not fittedHardware layout and configurationUM042612/461.9 RS232Two Type D 9-pin connectors, CN6 (USART1) and CN5 (USART2) are available on the STM3210B-EVAL board. The USART1 connector is connected to the RS232 transceiver U10, and the USART2 connector with RTS/CTS handshake signal support is connected to the RS232 transceiver U9.1.10 Motor controlThe STM3210B-EVAL board supports induction motor control via a 34-pin connector, CN14,which provides all required control and feedback signals to and from a motor power-drive board. Available signals on this connector include emergency stop, motor speed, 3-phase motor current, bus voltage, heatsink temperature coming from the motor drive board and 6 channels of PWM control signals going to the motor drive circuit.Special motor current sampling operation is enabled by setting jumper JP8.Table 7.Motor control jumpersJumperDescriptionJP8Enables special motor current sampling operation when JP8 is fitted (PD2 connected to PB0). The IO pins PD2 and PB0 are disconnected and can be used by the daughter board when JP8 is not fitted.Default setting: FittedJP12JP12 must be open when the digital encoder signal comes from pin31 of CN14. It must be closed when an analog signal comes from pin31 of CN14.Default setting: Not fitted (open)UM0426Hardware layout and configuration13/461.11 SmartcardThe STMicroelectronics smartcard interface device ST8024 is used on the STM3210B-EVAL board for asynchronous 3V and 5V smartcards. It performs all supply protection and control functions based on the connections with the STM32F10X microcontroller, which are listed in Table 8.An example of smartcard is provided with the board called GSM file system sample . With this board, you can play basic commands, select a file and do simple read/write operations to become familiar with this interface and the ISO/IEC 7816-3 protocol.1.12 MicroSD cardThe 64Mbyte or 128Mbyte MicroSD card, which is connected to SPI1 of the STM32F10xmicrocontroller (shared with serial Flash), is available on the board. The MicroSD card chip selection is managed by the standard IO port PC12.1.13 Temperature sensorOne I 2C interface temperature sensor STLM75 (–55°C to +125°C), which is connected toI 2C1 of the STM32F10x microcontroller, is available on the board. Two discrete N-channel enhancement MOS-FETs are used to demonstrate how different voltage level devices can be connected to the same I 2C bus.1.14 Analog inputOne BNC connector, CN3, is connected to PC1, the ADC channel 11 of the STM32F10xmicrocontroller as an external analog input.Table 8.Connection between ST8024 and STM32F10XST8024 signals DescriptionConnect to STM32F10X5V/3V Smartcard power supply selection pin PD11I/OUC MCU data I/O linePB10XT AL1Crystal or external clock inputPB12OFF Detect presence of a card, Interrupt to MCU PE14RSTIN Card reset input from MCUPB11CMDVCCStart activation sequence input (active low)PE7Hardware layout and configuration UM042614/461.15 IrDAIrDA communication is supported by the IrDA transceiver U11, which is connected to USART3 of the STM32F10x microcontroller. It can be enabled or disabled by setting the jumper JP5.1.16 USBThe STM3210B-EVAL board supports USB2.0 compliant full-speed communication via a USB type B connector (CN1). The evaluation board can be powered by this USB connection at 5V DC with a 500mA current limitation. USB disconnect simulation can be implemented by disconnecting a 1.5K pull-up register from the USB+ line. The USB disconnect simulation feature is enabled by setting JP1.1.17 Development and debug supportThe following debug connectors are available on the STM3210B-EVAL board:●CN7, an industry standard 20-pin JTAG interface connector for connection of debugging/programming tools for ARM7 and ARM9 core-based devices.●CN9, a 10-pin SWD debug connector that supports the new Serial Wire Debug feature of ARM Cortex-M3 devices.●CN10, a 20-pin connector for legacy and future JTAG tools that are compliant with ARM CoreSight.Table 9.IrDA jumpersJumper DescriptionJP5Enables/disables the IrDA transceiver. IrDA is enabled when JP5 is fitted, and disabled when JP5 is not fitted.Default setting: FittedUM0426Hardware layout and configuration15/461.18 Display and input devicesThe 240x320 TFT color LCD (U17) and 4 general purpose LEDs (LD1, 2, 3, 4) are available as display devices. A 4-direction joystick with selection key, general purpose pushbutton (B3), wakeup button (B2) and tamper detection button (B4) are available as input devices.The STM3210B-EVAL board also supports a second optional 122x32 graphic LCD that can be mounted on the U19 connector. The graphic LCD is not provided.Table 11.LCD modulesGraphic LCD U17 (default)Character LCD U19 (optional)Pin on U17Description Pin connectionPin on U19DescriptionPin connection1CS PB21Vss GND 2SCL PB132Vcc +3.3V 3SDI PB153VO -4RS PD74CLK PB135WR PD155SID PB156RD GND 6CS PB27SDO PB147A +5V 8RESET#RESET#8KGND9VDD +3V310VCI +3V311GND GND 12GND GND 13BL_VDD +3V314BL_Control PA815BL_GND GND 16BL_GNDGNDConnectors UM0426 2 Connectors2.1 USB type B connector CN1Figure /doc/986145873.htmlB type B connector CN1 (front view)Table 12. USB type B connector (CN1)Pin number Description Pin number Description1VBUS(power)4GND2DM5, 6Shield3DP2.2 CAN D-type 9-pin male connector CN2Figure 9.CAN D-type 9-pin male connector CN2 (front view)Table 13.CAN D-type 9-pin male connector (CN2)Pin number Description Pin number Description1, 4, 8, 9NC7CANH2CANL3,5,6GND16/46UM0426Connectors17/462.3 Analog input connector CN3Figure 10.Analog input connector CN3 (top view)2.4 Power supply connector CN4The STM3210B-EVAL board can be powered from a DC 5V power supply via the external power supply jack (CN4) shown in Figure 11. The central pin of CN4 must be positive.Figure 11.Power supply connector CN4 (front view)Table 14.Analog input connector CN3Pin numberDescription Pin numberDescription1GND 4GND2GND 5Analog input/PC13GND1453 2DC +5VGNDConnectors UM0426 2.5 RS232 connector CN5 with RTS/CTS handshake support Figure 12.RS232 connector CN5 with RTS/CTS handshake support (front view)Table 15.RS232 connector CN5 with full modem control supportPin number Description Pin number Description1NC6Connect to Pin 42USART2_RXD7USART2_RTS3USART2_TXD8USART2_CTS4Connect to Pin 6 9NC5GND2.6 RS232 connector CN6Figure 13.RS232 connector CN6 (front view)Table 16.RS232 connector CN6Pin number Description Pin number Description1NC6Connect to Pin 42USART1_RXD7Connect to Pin 83USART1_TXD8Connect to Pin 74Connect to Pin 69NC5GND18/46UM0426Connectors 2.7 JTAG debugging connector CN7Table 17.JTAG debugging connectorPin number Description Pin number Description1 3.3V power2 3.3V power3TRST4GND5TDI6GND7TMS8GND9TCK10GND11RTCK12GND13TDO14GND15RESET#16GND17DBGRQ18GND19DBGACK20GND2.8 Audio jack CN8A 3.5mm mono audio jack CN8 is available on the STM3210B-EVAL board. The speaker U12 is bypassed when earphones are plugged into CN8.2.9 SWD debugging connector CN919/46。

STM3210E-EVAL评估板用户手册

UM0488User manualSTM3210E-EVALevaluation boardIntroductionThe STM3210E-EVAL evaluation board is designed as a complete development platform forSTMicroelectronic's ARM Cortex-M3 core-based STM32F103Z microcontroller with fullspeed USB2.0, CAN2.0A/B compliant interface, two I2S channels, two I2C channels, fiveUSART channels with smartcard support, three SPI channels, two DAC channels, FSMCinterface, SDIO, internal 64KB SRAM and 512KB Flash, JTAG and SWD debug support.The full range of hardware features on the board helps you to evaluate all peripherals (USB,motor control, CAN, MicroSD card, smartcard, USART, NOR Flash, NAND flash, SRAM)and develop your own applications. Extension headers make it possible to easily connect adaughter board or wrapping board for your specific application.Figure 1.STM3210E-EVAL evaluation boardOrder codeTo order the STM32F103Z evaluation board, use the order code STM3210E-EVAL.November 2008 Rev 31/48Contents UM0488Contents1Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31.1Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31.2Demonstration software . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32Hardware layout and configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42.1Power supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62.2Boot option . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72.3Clock source . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72.4Reset source . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72.5Audio . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82.6Serial Flash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82.7CAN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82.8RS232 connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92.9Motor control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92.10Smartcard . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102.11MicroSD card . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102.12Temperature sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112.13Analog input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112.14IrDA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112.15USB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112.16Development and debug support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122.17Display and input devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122.18SRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132.19NAND Flash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132.20NOR Flash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 143Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 153.1Motor control connector CN1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 153.2Analog input connectors CN2, CN3 and CN5 . . . . . . . . . . . . . . . . . . . . . 163.3CAN D-type 9-pin male connector CN4 . . . . . . . . . . . . . . . . . . . . . . . . . . 163.4QST connector CN6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 2/48UM0488Contents3.5Trace debugging connector CN7 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 173.6RS232 connector CN8 with RTS/CTS handshake support . . . . . . . . . . . 183.7JTAG debugging connector CN9 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 183.8Daughter board extension connectors CN10 and CN11 . . . . . . . . . . . . . 193.9RS232 connector CN12 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 253.10MicroSD connector CN13 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 253.11USB type B connector CN14 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 263.12Audio jack CN15 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 263.13TFT LCD connector CN16 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 263.14Power connector CN17 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 263.15Smartcard connector CN18 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 4Schematic diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 Appendix A STM3210E-EVAL IO assignment. . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 463/48Overview UM04884/481 Overview1.1 Features●Three 5 V power supply options: power jack, USB connector or daughter board ●Boot from user Flash, system memory or SRAM ●I2S Audio DAC, stereo audio jack ●128 Mbyte MicroSD card●Both A and B type smartcard support●64 or 128 Mbit serial Flash, 512 Kx16 SRAM, 512 Mbit or 1 Gbit NAND Flash and 128 Mbit NOR Flash●I2C/SMBus compatible serial interface temperature sensor●Two RS-232 channels with RTS/CTS handshake support on one channel ●IrDA transceiver●USB2.0 full speed connection ●CAN2.0A/B compliant connection ●Inductor motor control connector ●JTAG and trace debug support ●240x320 TFT color LCD●Joystick with 4-direction control and selector ●Reset, wakeup, tamper and user buttons ● 4 color LEDs●RTC with backup battery1.2 Demonstration softwareTo use the STM3210E-EVAL evaluation board, you must have the demonstration softwareversion 1.1 or later. If the version installed on your evaluation board is earlier than version 1.1, you must download the latest version from .2 Hardware layout and configurationThe STM3210E-EVAL evaluation board is designed around the STM32F103Zmicrocontroller in a 144-pin TQFP package. The hardware block diagram Figure2 illustratesthe connection between the STM32F103Z and peripherals (LCD, SPI Flash, USART, IrDA,USB, audio, CAN bus, smartcard, MicroSD card, NOR Flash, NAND Flash, SRAM,temperature sensor, audio DAC and motor control) and Figure3will help you locate thesefeatures on the actual evaluation board.Figure 2.Hardware block diagram5/486/482.1 PowersupplyThe STM3210E-EVAL evaluation board is designed to be powered by 5V DC power supplyand to be protected by PolyZen U15 in the event of wrong power plug-in. It is possible toconfigure the evaluation board to use any of following three sources for the power supply:●5V DC power adapter connected to CN17, the power jack on the board (PSU on silkscreen for power supply unit).●5V DC power with 500mA limitation from CN14, the type-B USB connector (USB onsilkscreen).●5V DC power from both CN10 and CN11, the extension connector for daughter board(DTB for daughter board on silkscreen).The power supply is configured by setting the related jumpers JP13, JP12 and JP1 asdescribed in T able1. The LED LD5 is lit when the STM3210E-EVAL evaluation board ispowered correctly.7/488/482.2 Boot optionThe STM3210E-EVAL evaluation board can boot from:●Embedded user Flash●System memory with boot loader for ISP ●Embedded SRAM for debuggingThe boot option is configured by setting the switches BOOT0 and BOOT1.2.3 Clock sourceTwo clock sources are available on the STM3210E-EVAL evaluation board for STM32F103and RTC.●X2, 32KHz crystal for embedded RTC.●X1, 8MHz crystal with socket for STM32F103Z microcontroller, it can be removed from socket when internal RC clock is used.2.4 Reset sourceThe reset signal of the STM3210E-EVAL evaluation board is low active and the resetsources include:●Reset button B1●Debugging tools from JT AG connector CN7 and trace connector CN9●Daughter board from CN11Table 2.Boot related switchesSwitchBoot fromSwitch configurationBOOT0BOOT1STM3210E-EVAL boots from User Flash when BOOT0 is set asshown to the right. BOOT1 is not required in this configuration.(Default setting)STM3210E-EVAL boot from Embedded SRAM when BOOT0 and BOOT1 are set as shown to the right.STM3210E-EVAL boot from System Memory when BOOT0 and BOOT1 are set as shown to the right.0 <> 1Boot 00 <> 1Boot 0Boot 10 <> 1Boot 0Boot 1Table 3.Reset related jumperJumper DescriptionJP19Enables reset of the STM32F103Z embedded JT AG TAP controller each time asystem reset occurs. JP19 connects the TRST signal from the JT AG connection with the system reset signal RESET#. Default setting: not fitted2.5 AudioThe STM3210E-EVAL evaluation board supports stereo audio play because it provides anaudio DAC AK4343 connected to both I2S port and two channels of DAC of microcontrollerSTM32F103Z. Either external slave mode or PLL slave mode (reference clock BICK orLRCK) of audio DAC can be used by setting the jumper JP18.The I2S_MCK is multiplexed with smartcard and motor control, and can be enabled bysetting the jumper JP15. Refer to Section2.9: Motor control for details. Audio DAC AK4343is in power-down mode when PDN pin is pulled-down by PG11.Flash2.6 SerialA 64 or 128Mbit serial Flash connected to SPI1of STM32F103Z, serial Flash chip select ismanaged by IO pin PB2. The SPI1_MISO is multiplexed with motor control, it can beenabled by setting the jumper JP3. Refer to Section2.9: Motor control for details.2.7 CANSTM3210E-EVAL evaluation board supports CAN2.0A/B compliant CAN buscommunication based on 3.3V CAN transceiver. The high-speed mode, standby mode andslope control mode are available and can be selected by setting JP8.9/48connectors2.8 RS232Two D-type 9-pin connectors CN12 (USART1) and CN8 (USART2) are available on theSTM3210E-EVAL evaluation board.●USART1 connector is connected to RS232 transceiver U7●USART2 connector with RTS/CTS handshake signal support is connected to RS-232transceiver U5. The USART2_CTS is multiplexed with motor control, it can be enabledby setting the jumper JP4. Refer to Section2.9: Motor control for details.control2.9 MotorThe STM3210E-EVAL evaluation board supports three-phase brushless motor control via a34-pin connector CN1, which provides all required control and feedback signals to and fromthe motor power driving board. Available signals on this connector include emergency stop,motor speed, three-phase motor current, bus voltage, heatsink temperature coming from themotor driving board and 6 channels of PWM control signals going to the motor drivingcircuit.JP 20 allows to choose between two synchronization methods for power factor correction(PFC).The I/O pins used on the motor control connector CN1 are multiplexed with someperipherals on the board; either the motor control connector or multiplexed peripherals canbe enabled by setting the jumpers JP3, JP4, JP11, JP15 and JP16 as described in Table6.10/4811/482.10 SmartcardSTMicroelectronics smartcard interface chip ST8024 is used on the STM3210E-EVAL board for asynchronous 3V and 5V smartcards. It performs all supply protection and control functions based on the connections with STM32F103Z listed in T able 7.The Smartcard_CMDVCC and Smartcard_OFF are multiplexed with motor control.They can be enabled by setting the jumpers JP15 and JP16. Refer to Section 2.9: Motor control on page 10 for details.2.11 MicroSD cardThe 128 Mbyte MicroSD card connected to SDIO of STM32F103Z is available on the board.MicroSD card detection is managed by standard IO port PF11.The MicroSD card_D3 is multiplexed with IrDA. It can be enabled by setting the jumper JP22, as explained in Section 2.14: IrDA on page 12.The MicroSD card_D0 and MicroSD card CMD are multiplexed with the motor control connector. They can be enabled by setting the jumpers JP17 and JP20.Table 7.Connection between ST8024 and STM32F103ZSignals of ST8024DescriptionConnect to STM32F10X5V/3V Smartcard power supply selection pin PB0I/OUC MCU data I/O linePB10XT AL1Crystal or external clock inputPB12OFF Detect presence of a card, interrupt to MCU, share same pin with motor controller PC7RSTIN Card reset input from MCUPB11CMDVCCStart activation sequence input (active low), share same pin with I 2S DAC and motor controlPC6Table 8.Smartcard related jumpersJumper DescriptionJP15The CMDVCC is connected to PC6 when JP15 is closed. It should be kept on open, or the SD card needs to be removed from the MicroSD card connector when PC6 is used by I 2S or motor control connector. Default setting: not fitted JP16The OFF is connected to PC7 when JP16 is closed. It has to be kept on open when PC7 is used by the motor control connector. Default setting: not fittedTable 9.MicroSD card related jumpersJumper DescriptionJP17JP17 is used to enable MicroSD card data line D0. MicroSD card D0 is enabled when JP17 is fitted. The JP17 should be kept on open when motor control connector CN1 is used. Default setting: fittedJP20JP20 is used by the motor control connector, refer to T able 6 for details. JP20 should be kept on open for MicroSD card operation. JT AG debugging is disabled when JP20 is fitted.12/482.12 Temperature sensorOne I 2C interface temperature sensor STLM75 (–55°C to +125°C) connected to I 2C ofSTM32F103Z is available on the board.2.13 Analog inputThree BNC connectors CN2,CN3 and CN5 are connected to PC3, PC2 and PC1 of theSTM32F103Z as external analog input. The 50 ohm terminal resistor can be enabled by closing the solder bridge JP23, JP24 and JP25 for each BNC connector. A low pass filter can be implemented for each BNC connector CN5, CN3 and CN2 by replacing R5 and C22, R4 and C13, R3 and C9 with the right resistor and capacitor values, depending on the requirements of your application.2.14 IrDAIrDA communication is supported by the IrDA transceiver U13 connected to USART3 of STM32F103Z. The IrDA transceiver can be enabled or disabled by setting JP21.2.15 USBSTM3210E-EVAL evaluation board support USB2.0 compliant full speed communication via a USB type B connector (CN14). The evaluation board can be powered by this USBconnection at 5V DC with 500mA current limitation. USB disconnection simulation can be implemented by disconnecting 1.5K pull-up register from USB+ line. The USB disconnection simulation feature is enabled by setting JP14.Table 10.IrDA related jumpersJumper DescriptionJP21JP21 is used to shutdown the IrDA transceiver.IrDA is enabled when JP21 is fitted while IrDA is disabled when JP21 is not fitted. Default setting: fittedJP22IrDA_RX is enabled when JP22 is closed. The IO pin PC11 is used as the data line 3 of the MicroSD card when JP22 is open. Default setting: not fitted2.16 Development and debug supportThe two debug connectors available on STM3210E-EVAL evaluation board are:●CN9, standard 20-pin JTAG interface connector, compliant with ARM7/9 debug tools.●CN7, SAMTEC 20-pin connector FTSH-110-01-L-DV for both SWD and Trace,compliant with ARM CoreSight debug tools.2.17 Display and input devicesThe 240x320 TFT color LCD connected to bank1 NOR/PSRAM4 of FSMC interface ofSTM32F103Z and four general purpose color LEDs (LD 1,2,3,4) are available as displaydevices. A 4-direction joystick with selection key, general purpose button (B4), wakeupbutton (B2) and tamper detection button (B3) are available as input devices. The jumper JP4should be kept on open to enable the wakeup button B2 which shares the same IO withUSART2 and motor control connector.The STM3210E-EVAL evaluation board also supports a second optional 122x32 graphicLCD that can be mounted on the U18 connector. By default, the graphic LCD is not present.Table 12.LCD modulesTFT LCD CN16 (default)Graphic LCD U18 (optional)Pin on CN16Description Pin connectionPin onU18Description Pin connection1CS CS of Bank3 ofFSMC1Vss GND2RS FSMC_A02Vcc 3.3V3WR/SCL FSMC_NWE3VO-4RD FSMC_NOE4CLK P A55RESET RESET#5SID P A76PD1FSMC_D06CS PF107PD2FSMC_D17A+5V8PD3FSMC_D28K GND9PD4FSMC_D310PD5FSMC_D411PD6FSMC_D512PD7FSMC_D613PD8FSMC_D714PD10FSMC_D815PD11FSMC_D916PD12FSMC_D1017PD13FSMC_D1118PD14FSMC_D1213/4814/482.18 SRAM512Kx16 SRAM is connected to bank1 NOR/PSRAM3 of the FSMC interface and both 8-bit and 16-bit access are allowed by BLN0 and BLN1 connected to BLE and BHE of SRAM respectively.2.19 NAND FlashThe 512Mbit x8 or 1Gbit x8 NAND Flash is connected to NAND bank2 of the FSMCinterface. The ready/busy signal can be connected to either WAIT signal or FSMC_INT2 signal of STM32F103Z depending on the setting of JP7.19PD15FSMC_D1320PD16FSMC_D1421PD17FSMC_D1522BL_GND GND 23BL_control 3.3V 24VDD 3.3V 25VCI 3.3V 26GND GND 27GND GND 28BL_VDD 3.3V 29SDO P A6 via JP2630SDIP A7 via JP27Table 12.LCD modules (continued)TFT LCD CN16 (default)Graphic LCD U18 (optional)Pin on CN16Description Pin connection Pin on U18DescriptionPin connection15/482.20 NOR Flash128Mbit NOR Flash is connected to bank1 NOR/PSRAM2 of the FSMC interface. The 16-bit operation mode is selected by a pull-up resistor connected to the BYTE pin of the NORFlash. Write protection can be enabled or disabled by jumper JP5.Three different NOR 128-Mbit references can be present on the evaluation board depending on component availability.These three references are not identical in terms of ID code, speed, timing or blockprotection. The demonstration firmware and the software library delivered with the board support these three NOR Flash references. However, during the development of your application software, you must verify which NOR reference is implemented on your board (component referenced as U2 on silkscreen and schematic), and take its characteristics into account.Table 14.NOR Flash related jumpersJumperDescriptionJP5Write protection is enabled when JP5 is fitted while write protection is disabled when JP5 is not fitted.Default setting: not fittedTable 15.NOR Flash referenceReference Manufacturer M29W128GL70ZA6E NUMONYX M29W128GH70ZA6E NUMONYX S29GL128P90FFIR20SP ANSIONConnectors UM048816/483 Connectors3.1Motor control connector CN1Table 16.Motor control connector CN1Description STM32F103Zpin CN1 pin #CN1 pin #STM32F103ZpinDescriptionEmergency stop P A612GND PWM-UH PC634GND PWM-UL P A756GND PWM-VH PC778GND PWM-VL PB0910GND PWM-WH PC81112GND PWM-WL PB11314PC0Bus voltage Phase A current PC11516GND Phase B current PC21718GND Phase C current PC31920GND NTC bypass relayPB122122GND Dissipative brake PWM P A3 through0ohm resisterunfitted 2324GND+5V power +5V2526PC5Heatsink temperature PFC SYNC PB4 and PD22728 3.3V power PFC PWM PB52930GND Encoder A P A03132GNDEncoder BP A13334PA2Encoder indexUM0488Connectors17/483.2 Analog input connectors CN2, CN3 and CN5Figure 5.Analog input connector CN2, CN3 and CN5 bottom view3.3 CAN D-type 9-pin male connector CN4Figure 6.CAN D-type 9-pin male connector CN4 (front view)3.4 QST connector CN6The QST connector is designed to connect the STM3210E-EVAL to the QST evaluation board to demonstrate the QST function.Table 17.Analog input connector CN2, CN3 and CN5Pin numberDescriptionPin numberDescription1GND 4GND2GND 5Analog input PC3, PC2 and PC1 for CN2,CN3 and CN5 respectively3GND12435Table 18.CAN D-type 9-pins male connector CN4Pin number DescriptionPin number Description1,4,8,9NC 7CANH 2CANL3,5,6GNDConnectors UM0488Table 19.QST connector CN6Pin number Description Pin number Description1+5V2+5V3PB64P A55PB76P A77PB18P A69PF1110PB511P A812-13GND14GND3.5 Trace debugging connector CN7Table 20.Trace debugging connector CN7Pin number Description Pin number Description1 3.3V power2TMS/P A133GND4TCK/P A145GND6TDO/PB37KEY8TDI/P A159GND10RESET#11GND12TraceCLK/PE213GND14TraceD0/PE3 or SWO/PB315GND16TraceD1/PE4 or nTRST/PB417GND18TraceD2/PE519GND20TraceD3/PE618/48UM0488Connectors 3.6 RS232 connector CN8 with RTS/CTS handshake supportFigure 9.RS232 connector CN8 with RTS/CTS handshake support (front view)Table 21.RS232 connector CN8 with RTS/CTS handshake supportPin number Description Pin number Description1NC6Connect to Pin 42USART2_P A37USART2_P A13USART2_P A28USART2_P A04Connect to Pin 6 9NC5GND3.7 JTAG debugging connector CN9Table 22.JTAG debugging connector CN9Pin number Description Pin number Description1 3.3V power2 3.3V power3PB44GND5P A156GND7P A138GND9P A1410GND11RTCK12GND13PB314GND15RESET#16GND17DBGRQ18GND19DBGACK20GND19/48Connectors UM048820/483.8 Daughter board extension connectors CN10 and CN11Two 70-pin male headers CN10 and CN11 can be used to connect a daughter board or standard wrapping board to the STM3210E-EVAL evaluation board. All total 112 GPI/Os are available on it. The space between these two connectors and the position of power, GND and RESET pins (marked in gray in Table 23 and Table 24) are defined as a standard which allows to develop common daughter boards for several evaluations boards. The standard width between CN10 pin1 and CN11 pin1 is 2700mils (68.58mm). This standard is implemented on the majority of evaluation boards.Each pin on CN10 and CN11 can be used by a daughter board after disconnecting it from the corresponding function block on the STM3210E-EVAL evaluation board, as described in Table 23 and Table 24.Table 23.Daughter board extension connector CN10Pin #Description Alternative functionHow to disconnect from function block onSTM3210E-EVAL board1GND --3PC7MC/Smartcard Disconnect STM3210E-EVAL evaluation board from motor power drive board.Keep JP16 on open.5PC9MicroSD card Remove SD card from MicroSD card connector.7P A9UASRT1_TX-9P A0MC/Wakeup/USART2_CTS Keep JP4 on open.11---13P A12USB_DP Remove R82.15P A14Debug_TCK-17PC10IrDA_TX/MicroSDcard_D2Remove SD card from MicroSD card connector.19GND --21PD0FSMC_D2-23PE2T race_CLK/FSMC_A23-25PD2MicroSDcard_CMD/MC Disconnect STM3210E-EVAL evaluation board from motor power drive board.Remove SD card from MicroSD card connector.27PD4FSMC_OEN -29PD6FSMC_WAITN -31PD7FSMC_EBAR0Remove R22.33PG10FSMC_EBAR2Remove R15.35PG12FSMC_EBAR3Remove R77.37PG14Joystick_Left Remove R102.39GND--UM0488Connectors21/4841PB4Debug_TRST/MCDisconnect STM3210E-EVAL evaluation board from motor power drive board.Keep JP19 on open.43PB6I2C_SCL/QST Disconnect STM3210E-EVAL evaluation board from QST board.45PB8CAN_RX Remove R32.47PE0FSMC_BLN0-49D5V --51PE4T race_D1/FSMC_A20-53PE6T race_D3/FSMC_A22-55PC14 OSC32_IN Remove R135, Keep JP9 (solder bridge) on close.57PF0FSMC_A0-59GND --61PF2FSMC_A2-63PF4FSMC_A4-65PF6LD2Remove R96.67PF8LD4Remove R98.69+3V3--2PC6Smartcard/MC/I2S_MCKDisconnect STM3210E-EVAL evaluation board from motor power drive board.Keep JP15 on open.4PC8MicroSDcard_D0/MCDisconnect STM3210E-EVAL evaluation board from motor power drive board.Remove SD card from MicroSD card connector.6P A8MCO/LCD_backlight/QST Disconnect STM3210E-EVAL evaluation board from QST board.8P A10USART1_RX Remove R36.10GND --12P A11USB_DM Remove R81.14P A13Debug TMS -16P A15Debug TDI-18PC11IrDA_RX/MicroSDcard_D2Remove SD card from MicroSD card connector.Remove R89.20PC12MciroSDcard_CLK Remove SD card from MciroSD card connector.22PD1FSMC_D3-24PE1FSMC_BLN1-26PD3Joystick_DownRemove R100.Table 23.Daughter board extension connector CN10 (continued)Pin #DescriptionAlternative functionHow to disconnect from function block onSTM3210E-EVAL boardConnectors UM048822/4828PD5FSMC_WEN -30GND --32PG9FSMC_EBAR1Remove R21.34PG11--36PG13Joystick_Right Remove R103.38PG15Joystick_Up Remove R104.40PB3Debug_TDO-42PB5MC/QST/Temperature sensorDisconnect STM3210E-EVAL evaluation board from motor power drive board and QST board.Remove R46.44PB7I2C_SDA/QST Disconnect STM3210E-EVAL evaluation board from QST board.46PB9CAN_TX -483V3--50GND --52PE3T race_D0/FSMC_A19-54PE5T race_D2/FSMC_A21-56PC13Anti-tamper button Remove R111.58PC15OSC32_OUT Remove R39, Keep JP10 (solder bridge) on close.60PF1FSMC_A1-62PF3FSMC_A3-64PF5FSMC_A5-66PF7LD3Remove R97.68PF9LD5Remove R99.70GND--Table 23.Daughter board extension connector CN10 (continued)Pin #Description Alternative function How to disconnect from function block onSTM3210E-EVAL boardUM0488Connectors23/48Table 24.Daughter board extension connector CN11Pin #Description Alternative functionHow to disconnect from function block onSTM3210E-EVAL board1GND --3PG7Joystick_Select Remove R101.5PG5FSMC_A15-7PG3FSMC_A13-9PC13 Button B3--11RESET#--13PD12FSMC_A17-15PD10FSMC_D15-17PD8FSMC_D13-19D5V --21PB13I2S_CLK -23PB11Smartcard_Reset -25PE15FSMC_D12-27PE13FSMC_D10-29PE11FSMC_D8-31PD15FSMC_D1-33PE9FSMC_D6-35PE7FSMC_D4-37PG1FSMC_A11-39GND --41PF14FSMC_A8-43PF12FSMC_A6-45PB2BOOT1/SPI_NSS -47PB1MC/QST Disconnect STM3210E-EVAL evaluation board from motor power drive board and QST board.49---51PB0Smartcard_3/5V/MC Disconnect STM3210E-EVAL evaluation board from motor power drive board.53PC4Potentiometer Remove R126.55P A6MC/SPI_MISO/QST Disconnect STM3210E-EVAL evaluation board from motor power drive board and QST board.Remove R37.57P A4Audio_RIN Remove R67.59GND--Connectors UM048824/4861P A1MC/USART2_RTSDisconnect STM3210E-EVAL evaluation board from motor power drive board.63PC3MC/BNC3Disconnect STM3210E-EVAL evaluation board from motor power drive board.Disconnect analog signal from BNC3.65PC1MC/BNC1Disconnect STM3210E-EVAL evaluation board from motor power drive board.Disconnect analog signal from BNC1.67PF10LCD_CS -69+3V3--2PG8User button B4Remove R106.4PG6FSMC_INT2Keep JP7 on open.6PG4FSMC_A14-8PG2FSMC_A12-10GND --12PD13FSMC_A18-14PD11FSMC_A16-16PD9FSMC_A14-18PB15I2S_DIN -20PB14USB disconnectConnect pin1 of JP14 to pin2.22PB12Smartcard_CK/MC/I2S_CMD Disconnect STM3210E-EVAL evaluation board from motor power drive board.24PB10Smartcard_IO Remove R94.26PE14FSMC_D11-28PE12FSMC_D9-30GND --32PD14FSMC_D0-34PE10FSMC_D7-36PE8FSMC_D5-38---40PG0FSMC_A10-42PF15FSMC_A9-44PF13FSMC_A7-46PF11QST / MicroSD card detection Disconnect STM3210E-EVAL evaluation board from QST board. Remove SD card from card socket CN13.48---Table 24.Daughter board extension connector CN11 (continued)Pin #Description Alternative function How to disconnect from function block onSTM3210E-EVAL board。

STM32-参考手册-中文.pdf

STM32-参考⼿册-中⽂.pdf23 串⾏外设接⼝(SPI)⼩容量产品是指闪存存储器容量在16K ⾄32K 字节之间的STM32F101xx、STM32F102xx和STM32F103xx微控制器。

中容量产品是指闪存存储器容量在64K⾄128K字节之间的STM32F101xx、STM32F102xx和STM32F103xx微控制器。

⼤容量产品是指闪存存储器容量在256K⾄512K字节之间的STM32F101xx和STM32F103xx微控制器。

互联型产品是指STM32F105xx和STM32F107xx微控制器。

除⾮特别说明，本章描述的模块适⽤于整个STM32F10xxx微控制器系列。

23.1 SPI简介在⼤容量产品和互联型产品上，SPI接⼝可以配置为⽀持SPI协议或者⽀持I2S⾳频协议。

SPI接⼝默认⼯作在SPI⽅式，可以通过软件把功能从SPI模式切换到I2S模式。

在⼩容量和中容量产品上，不⽀持I2S⾳频协议。

串⾏外设接⼝(SPI)允许芯⽚与外部设备以半/全双⼯、同步、串⾏⽅式通信。

此接⼝可以被配置成主模式，并为外部从设备提供通信时钟(SCK)。

接⼝还能以多主配置⽅式⼯作。

它可⽤于多种⽤途，包括使⽤⼀条双向数据线的双线单⼯同步传输，还可使⽤CRC校验的可靠通信。

I2S也是⼀种3引脚的同步串⾏接⼝通讯协议。

它⽀持四种⾳频标准，包括飞利浦I2S标准，MSB 和LSB对齐标准，以及PCM标准。

它在半双⼯通讯中，可以⼯作在主和从2种模式下。

当它作为主设备时，通过接⼝向外部的从设备提供时钟信号。

警告：由于 SPI3/I2S3 的部分引脚与 JTAG 引脚共享 (SPI3_NSS/I2S3_WS 与 JTDI ，SPI3_SCK/I2S3_CK与JTDO)，因此这些引脚不受IO控制器控制，他们(在每次复位后)被默认保留为JTAG⽤途。

如果⽤户想把引脚配置给SPI3/I2S3，必须(在调试时)关闭JTAG并切换⾄SWD接⼝，或者(在标准应⽤时)同时关闭JTAG和SWD接⼝。

stm32f030c8t6手册

stm32f030c8t6手册stm32f030c8t6手册STM32F3系列微处理器大幅提升系統整合度STM32F3 系列是意法半导体ARM Cortex-M4 微处理器产品组合的入门级产品。

经市场验证的M4 处理器核心可支持DSP 指令集，内建浮点单元(FPU)作业频率高达72MHz，若再搭配意法半导体独有且基于核心耦合内存(CCM-SRAM)的程序加速(Routine Booster)功能，其马达控制等例行程序的作业速度可比原先快43%。

STM32F3 系列性能表现比STM32F1 Cortex-M3 系列更加出色，而STM32 系列的软硬件具有广泛的通用性，并提供简单易用的设计工具及开发生态系统。

微处理器，是指用一片或少数几片大规模集成电路组成的中央处理器。

与传统的中央处理器相比，微处理器具有体积小、重量轻和容易模块化等优点。

能完成取指令、执行指令，以及与外界存储器和逻辑部件交换信息等操作，是微型计算机的运算控制部分。

它可与存储器和外围电路芯片组成微型计算机。

国际上的超高速巨型计算机、大型计算机等高端计算系统也都采用大量的通用高性能微处理器建造。

自从人类1947年发明晶体管以来，50多年间半导体技术经历了硅晶体管、集成电路、超大规模集成电路、甚大规模集成电路等几代，发展速度之快是其他产业所没有的。

半导体技术对整个社会产生了广泛的影响，因此被称为“产业的种子”。

中央处理器是指计算机内部对数据进行处理并对处理过程进行控制的部件，伴随着大规模集成电路技术的迅速发展，芯片集成密度越来越高，CPU可以集成在一个半导体芯片上，这种具有中央处理器功能的大规模集成电路器件，被统称为“微处理器”。

需要注意的是：微处理器本身并不等于微型计算机，仅仅是微型计算机的中央处理器。

微处理器已经无处不在，无论是录像机、智能洗衣机、移动电话等家电产品，还是汽车引擎控制，以及数控机床、导弹精确制导等都要嵌入各类不同的微处理器。

STM32微控制器产品说明书

特性可用版本•X-CUBE-CLASSB 版本 2.2.0 支持 STM32L0 系列、STM32L1系列、STM32L4系列、STM32L4+系列、STM32F0 系列、STM32F1 系列、STM32F2 系列、STM32F3 系列、STM32F4 系列，以及 STM32F7 系列•X-CUBE-CLASSB 版本 2.3.0 支持STM32G0系列、STM32G4 系列、STM32WB 系列（仅 Cortex ®‑M4 内核）和 STM32H7系列（仅 Cortex ®‑M7内核）•X-CUBE-CLASSB 版本 2.4.0 支持 STM32L5 系列•X-CUBE-CLASSB 版本 3.0.0 面向双核微控制器的扩展包，通常：–适用于两个嵌入式内核都有助于增强安全功能的情况–包括两个内核之间的安全状态交换–处理内部资源叠加事宜–获得 STM32H7x7 双核微控制器认证•X-CUBE-CLASSB 4.0.0 版本支持 STM32U5 系列,包含了特定的用户指南（UM2986）以及UL 认证版本之间的不同之处•3.0.0 以及之前版本扩展包：–均作为完整的源代码交付–基于 STM32Cube HAL –与通用用户指南（AN4435）以及通用 UL 证书有关•对于版本 4.0.0，扩展包：–与之前版本不一样的是，新版本采用与 X-CUBE-STL （ST 工业安全库）相似的架构–以编译后的目标文件格式交付（配置和集成过程除外），这使其独立于工具、编译器和任何其他意法半导体固件–与专门的用户手册（UM2986）和特定的 UL 证书有关通用版本特性•使用 STM32Cube 包，优化了不同微控制器之间的可移植性•对于时序要求严格的测试，使用了汇编代码进行部分优化•支持与 IAR Systems ® IAR 编译器®、Keil ® MDK-ARM 有关的编译器，以及基于GCC 编译器的集成开发环境（比如意法半导体 STM32CubeIDE 或SW4STM32•通过 UL® 认证•覆盖世界标准（IEC 、UL 、CSA ）安全特性STM32自检库X-CUBE-CLASSB 通过STM32实现B 类标准客户开发S TM32Cube 软件扩展，B 类 60730-1 和 60335-1 功能安全包X-CUBE-CLASSB数据摘要1说明IEC 60730-1和IEC 60335-1安全标准定义了能够有效检测随机硬件故障的测试和诊断方法，以确保在电子可编程设备控制的家用电器中内嵌的硬件和软件的安全运行。

stm32030 标准库编程手册

STM32F030标准库编程手册第一章：概述1.1 介绍STM32F030是STMicroelectronics推出的一款面向嵌入式系统的32位微控制器，拥有丰富的外设和强大的性能。

本手册将介绍如何使用STM32F030标准库进行编程，帮助开发人员充分发挥其潜力。

1.2 目的本手册的目的是为了帮助开发人员快速了解STM32F030的标准库编程方法，以便能够更高效地进行嵌入式系统开发。

第二章：环境搭建2.1 开发工具在使用STM32F030标准库进行编程之前，首先需要搭建相应的开发环境。

推荐使用Keil、IAR或者GCC等开发工具，并安装好相应的开发包和驱动程序。

2.2 硬件连接将STM32F030与开发板连接，并确认连接无误。

同时需要连接好调试工具，如JTAG或SWD。

第三章：基础知识3.1 寄存器配置在进行STM32F030标准库编程时，常常需要对芯片内部的寄存器进行配置。

了解寄存器的功能和配置方法对于正确地使用标准库至关重要。

3.2 中断处理STM32F030支持多种中断类型，了解中断的类型和处理机制对于实现复杂的功能非常重要。

本章将介绍如何使用标准库进行中断处理。

第四章：标准库函数4.1 GPIO操作GPIO是嵌入式系统中最基础的外设之一，也是最常用的外设之一。

本章将介绍如何使用标准库函数对GPIO进行配置和控制。

4.2 定时器控制定时器是嵌入式系统中常用的外设，可用于生成精确的定时信号或者进行定时中断处理。

本章将介绍如何使用标准库函数对定时器进行控制。

4.3 串口通信串口通信是嵌入式系统中最常用的通信方式之一，本章将介绍如何使用标准库函数实现串口通信功能。

第五章：高级应用5.1 外设驱动除了基础的GPIO、定时器和串口外，STM32F030还支持多种其他外设，如I2C、SPI等。

本章将介绍如何使用标准库函数对这些外设进行驱动。

5.2 电源管理在嵌入式系统中，电源管理是至关重要的。

本章将介绍如何使用标准库函数对电源进行管理，以提高系统的能效。

stm32f303cct6 用户编程技术手册

stm32f303cct6 用户编程技术手册一、引言STM32F303CCT6是一款功能强大的微控制器，广泛应用于嵌入式系统中。

本文将详细介绍STM32F303CCT6的用户编程技术手册，帮助读者深入了解该芯片的编程技术与应用。

二、硬件概述2.1 芯片架构STM32F303CCT6采用ARM Cortex-M4内核，具有高性能和低功耗的特点。

该芯片集成了丰富的外设，包括多个计时器、通信接口和模拟模块等。

2.2 引脚定义STM32F303CCT6的引脚定义如下：（这里省略具体的引脚定义表格，以减少篇幅）2.3 外设模块STM32F303CCT6内置多个外设模块，包括：- GPIO：用于控制通用输入输出引脚。

- USART：用于异步串行通信。

- SPI：用于高速的串行外设接口。

- I2C：用于短距离通信和外设控制。

- ADC：用于模拟信号的采集和转换。

- DMA：用于高效的数据传输。

三、编程环境准备3.1 开发工具选择在进行STM32F303CCT6的编程之前，首先需要选择合适的开发工具。

常用的开发工具有Keil MDK、IAR Embedded Workbench和STM32CubeIDE等。

根据个人需求和开发经验，选择适合自己的开发工具。

3.2 下载与安装根据选择的开发工具，前往官方网站下载并安装相应版本的开发环境。

安装过程中需注意选择适合STM32F303CCT6的开发包和驱动程序。

四、软件开发指南4.1 寄存器配置在进行STM32F303CCT6的编程时，可以通过寄存器配置实现对外设的控制。

通过读取和写入特定的寄存器值，可以实现对外设的初始化、中断配置和数据传输等功能。

4.2 外设初始化在编程中，首先需要对所需外设进行初始化。

通过设置相应的寄存器值，可以配置外设的工作模式、引脚映射、时钟源和中断等。

4.3 数据传输STM32F303CCT6通过DMA（Direct Memory Access）模块实现高效的数据传输。

stm32f030c8t6手册

stm32f030c8t6手册STM32F030C8T6概述基于ARM？的32位ARM STM32 Cortex-M单片机？皮质？-M 处理器，给MCU用户带来更多的自由。

该系列32位产品集成了高性能、实时功能、数字信号处理、低功耗、低电压运行，同时保持了完全集成和易于开发的功能。

这些不同的STM32设备具有无与伦比的性能，并且建立在行业标准的核心之上，并提供各种工具和软件供您选择。

这一系列产品是小型项目和整个平台的理想选择。

stm32f03系列微处理器、stm32f0系列微控制器是基于STM微电子公司的Arm Cortex-M0 Arm，包括入门级Arm Cortex？M0 32位RISC核心。

Stm32f030提供高速嵌入式存储器和各种增强型外围设备和I/O，具有I2C、SPI和USART等通信接口，以及12位ADC、16位定时器和高级控制PWM定时器。

ST公司的stm32f0 MCU高级体系结构与STM32平台相结合，可以实现低功耗的应用设计，提供不同的封装类型。

手臂皮质？-M0核心处理器与嵌入式闪存和SRAM兼容所有ARM 工具和软件。

Stm32f030 ARM处理器微控制器（MCU）适用于多种应用，包括应用程序控制和用户界面、手持设备、a/V接收器、PC外围设备、游戏平台、消费类电器、打印机、报警系统和HVAC。

频率：48MHz CPU闪存：高达64 KBSRAM：最高8 KB电源：2.4至3.6 V温度范围：-40至+85°CSTM32F0系列32位ARM？皮质？-M0微控制器，STMicroelectronicsSTM32F0系列32位闪存微控制器（MCU）是否基于ARM cortex？-M0内核，专为嵌入式应用开发。

STM32手臂皮质？ST的M处理器受益于Cortex-M0架构的增强，包括数字信号处理、实时性能、低电压和低功耗。

主流系列的圣臂？STM32 F0提供32位性能，特别适用于具有易于使用功能的小型项目或平台决策。

stm32f103c8t6英文手册

一、概述1.1 简介STMicroelectronics的stm32f103c8t6是一款功能强大的高性能微控制器单片机（MCU），广泛应用于工业控制、汽车电子、家居电器等多个领域。

1.2 目的本手册旨在为用户提供stm32f103c8t6的详细英文说明，包括功能特性、引脚定义、寄存器描述、编程规范等内容，以帮助用户更好地理解和应用该产品。

二、产品概述stm32f103c8t6是一款32位ARM Cortex-M3内核的微控制器，主要特性包括但不限于：2.1 高性能采用ARM Cortex-M3内核，主频为72MHz，具有丰富的外设和功能模块，支持高速数据处理和精密控制。

2.2 丰富的外设包括多个定时器、通用串行总线（USART、SPI、I2C）、模拟数字转换器（ADC）、数字模拟转换器（DAC）等，满足不同应用场景的需求。

2.3 低功耗设计支持多种低功耗模式，可延长电池寿命和减少能源消耗。

2.4 丰富的内部存储包括闪存和RAM，支持多种存储器接口，满足不同应用的存储需求。

2.5 强大的外部接口包括GPIO、SDIO、USB等，支持丰富的外部设备连接和数据交换。

三、产品规格3.1 器件参数- 工作电压范围：2.0V-3.6V- 工作温度范围：-40℃~85℃- 封装类型：LQFP483.2 性能参数- 内核类型：ARM Cortex-M3- 主频：72MHz- 存储器：64KB闪存，20KB RAM- 外设：定时器、串口、ADC、DAC等3.3 接口特性- GPIO：32个通用I/O口- 通信接口：USART、SPI、I2C等- 存储器接口：支持多种外部存储器- USB接口- SDIO接口四、引脚定义4.1 封装类型stm32f103c8t6采用LQFP48封装，具有丰富的引脚功能定义。

4.2 引脚描述- 供电引脚：VDD、VSS- 时钟引脚：XTAL1、XTAL2- 外设引脚：PA0-PA15、PB0-PB15等- 通信引脚：USART1_TX、USART1_RX等- 中断引脚：IRQ0-IRQn等4.3 引脚布局详细的引脚布局图和引脚功能描述，请参考产品手册附录。

gd32f303rc的固件库使用手册

一、简介gd32f303rc是一款基于ARM Cortex-M4内核的高性能微控制器，具有丰富的外设和功能，适用于各种嵌入式系统的开发。

gd32f303rc 的固件库是为了方便开发者进行应用程序开发而设计的，提供了丰富的驱动和API接口，简化了开发流程，降低了开发成本。

本手册将详细介绍gd32f303rc的固件库的使用方法和注意事项。

二、固件库的安装1. 下载固件库首先需要从冠方全球信息站上下载gd32f303rc的固件库，可以选择适合自己开发环境的版本进行下载。

固件库通常是一个压缩文件，下载后需要解压缩到本地目录。

2. 配置开发环境在使用固件库之前，需要先配置好开发环境，包括搭建好开发工具链（如Keil、IAR等）、安装好相应的编译器和调试工具。

3. 导入固件库将下载好的固件库文件夹拷贝到项目的目录下，并在开发工具中添加该文件夹到项目的包含路径中，以便后续对固件库的调用。

三、固件库的基本结构和功能gd32f303rc的固件库包含了丰富的驱动程序和API接口，用于对芯片的外设进行配置和控制。

固件库的基本结构如下：1. 核心库核心库包含了与ARM Cortex-M4内核相关的文件，如启动文件、中断向量表等。

开发者通常不需要修改这部分的内容，只需要包含到项目中即可。

2. 外设库外设库包含了各种外设的驱动程序和API接口，如GPIO、USART、SPI、I2C等。

开发者可以通过调用这些接口来配置和控制芯片的外设。

3. 实例库实例库包含了一些典型的应用实例，如LED闪烁、串口通讯等。

开发者可以参考这些实例来加快自己的开发进度。

四、固件库的使用方法1. 包含头文件在需要使用固件库的源文件中，首先需要包含相应的头文件。

以使用GPIO为例，需要包含gpio.h头文件。

```c#include "gd32f30x_gpio.h"```2. 初始化外设在使用外设之前，需要进行相应的初始化配置。

1、下载文档前请自行甄别文档内容的完整性，平台不提供额外的编辑、内容补充、找答案等附加服务。
2、"仅部分预览"的文档,不可在线预览部分如存在完整性等问题,可反馈申请退款(可完整预览的文档不适用该条件!)。
3、如文档侵犯您的权益，请联系客服反馈,我们会尽快为您处理(人工客服工作时间：9:00-18:30)。

For further information contact your local STMicroelectronics sales office.July 2016DocID023596 Rev 41/4STM32F3DISCOVERYDiscovery kit with STM32F303VC MCUData briefFeatures∙STM32F303VCT6 microcontroller featuring 256-Kbyte Flash memory, 48-Kbyte RAM in an LQFP100 package ∙On-board ST-LINK/V2 for PCB version A or B or ST-LINK/V2-B for PCB version C and newer ∙USB ST-LINK functions:–Debug port–Virtual COM port with ST-LINK/V2-B only –Mass storage with ST-LINK/2-B only ∙Board power supply: through USB bus or from an external 3V or 5V supply voltage ∙External application power supply: 3V and 5V ∙L3GD20, ST MEMS motion sensor, 3-axis digital output gyroscope ∙LSM303DLHC, ST MEMS system-in-package featuring a 3D digital linear acceleration sensor and a 3D digital magnetic sensor ∙Ten LEDs:–LD1 (red) for 3.3V power on–LD2 (red/green) for USB communication –Eight user LEDs: LD3/10 (red), LD4/9 (blue), LD5/8 (orange) and LD6/7 (green)∙Two push-buttons (user and reset)∙USB USER with Mini-B connector∙Extension header for all LQFP100 I/Os for quick connection to prototype board and easy probing ∙Comprehensive free software including a variety of examples, part of STM32CubeF3 package or STSW-STM32118 for legacy Standard Library usage1.Picture not contractual.DescriptionThe STM32F3DISCOVERY allows users to easily develop applications with the STM32F3 Series based on ARM ® Cortex ®-M4 mixed-signal MCU. It includes everything required for beginners and experienced users to get started quickly.Based on the STM32F303VCT6, it includes an ST-LINK/V2 or ST-LINK/V2-B embedded debug tool, accelerometer, gyroscope and e-compass ST MEMS, USB connection, LEDs and push-buttons.The STM32F3DISCOVERY discovery board does not support the STM32F313xx MCUs (1.65V to 1.95V power supply).System requirements STM32F3DISCOVERY2/4DocID023596 Rev 4System requirements∙Windows ® OS (XP , 7, 8)∙USB Type-A to Mini-B cableDevelopment toolchains∙IAR ® EWARM (IAR Embedded Workbench ®)∙Keil ® MDK-ARM ™∙GCC-based IDEs (free AC6: SW4STM32, Atollic ® TrueSTUDIO ®,...)Demonstration softwareThe demonstration software is preloaded in the board Flash memory. It uses the USER push-button to switch the operation of the eight LEDs into different modes from simpleblinking mode, to indicate the gyroscope movements, or the direction of the North Pole. The latest version of the demonstration source code together with the associated documentation can be downloaded from the /stm32f3discovery webpage.Ordering informationTo order the Discovery kit for the STM32F303 line of microcontrollers, refer to Table 1.Table 1. List of the order codesOrder code ST-LINK versionSTM32F3DISCOVERYST-LINK/V2 for PCB version A or B ST-LINK/V2-B for PCB version C and newerSTM32F3DISCOVERY Revision history Revision historyTable 2. Document revision historyDate Revision Changes03-Sep-20121Initial release.11-Mar-20132Modified title and added Ordering information. Added information on STM32F313xx MCUs in Description.24-Oct-20143Updated features list.Updated Section: Development toolchains.19-Jul-20164Updated Features list to introduce the information that boards come with ST-LINK/V2 or ST-LINK/V2-B.DocID023596 Rev 43/4STM32F3DISCOVERYIMPORTANT NOTICE – PLEASE READ CAREFULLYSTMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement.Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products.No license, express or implied, to any intellectual property right is granted by ST herein.Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners.Information in this document supersedes and replaces information previously supplied in any prior versions of this document.© 2016 STMicroelectronics – All rights reserved4/4DocID023596 Rev 4。