三星贴片电容系列规格书

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三星陶瓷电容规格书

1.0
1.0
1.5
1.0 1.2 1.5 1.8
1.0 1.2 1.5 1.8
1.1 1.3 1.6 2.0
Capacitance Step
2.2
2.2
3.3
2.2 2.7 3.3 3.9
2.2 2.7 3.3 3.9
Symbol D G I J K
Rated Voltage(Vdc) 200V 500V 1000V 2000V 3000V
Multilayer Ceramic Capacitor
●7 THICKNESS OPTION
Symbol N A B C D E
Description of the Code Standard thickness (please refer to standard thickness table on next page) Thinner than standard thickness Thicker than standard thickness Standard Thickness High Q ( Low ` D.F ` ) Sn-100% (High-Q) Sn-100% (General)
● Application - High Frequency Circuit(Tuner, VCO, PAM etc) - General Power Supply Circuit(SMPS etc) - DC-DC Converter - General Electronic Circuit

Capacitance Change (ΔC : %)
± 15 ± 15
+22 ~ -82
Operation Temperature Range

三星电容规格书

三星电容规格书三星电容规格书是指描述三星电容器性能、特征和使用方法的文档。

该文档的目的是为用户提供关于使用和选择三星电容器的详细信息。

以下是一些常见的参考内容，包括电容器的基本概念、规格、参数、应用建议等。

1. 电容器的基本概念：电容器是一种能够存储电能的被动元件，由两个导体板（电极）和介质组成。

介质可以是电解质、陶瓷、聚合物等。

电容器的主要功能是存储、释放电荷以及滤波和耦合。

2. 电容器的规格说明：规格说明包括电容器的容量、额定电压、尺寸、温度特性等。

容量是电容器存储电荷的能力，通常以法拉(F)为单位。

额定电压是电容器能够承受的最大电压，过高的电压可能导致电容器损坏。

尺寸是指电容器的外观尺寸，通常以长度、宽度和高度表示。

温度特性是指电容器在不同温度下的电容值变化情况。

3. 电容器的参数：电容器的参数包括ESR（等效串联电阻）、ESL（等效串联电感）、Q值、ES（等效串联电阻）、DF（损耗因子）等。

ESR是电容器在交流电路中的等效串联电阻，通常以欧姆(Ω)为单位。

ESL是电容器电极之间的等效串联电感，通常以纳亨(νH)为单位。

Q值是电容器的品质因数，表示其内部损耗的程度。

ES是电容器的等效串联电阻，通常用于表示电容器的交流特性。

DF是电容器的损耗因子，表示电容器内部的能量损耗。

4. 电容器的应用建议：电容器广泛应用于各种电子设备和电路中，如电源管理、通信设备、储存器、调光器、电动机驱动器等。

对于不同的应用场景，选择合适的电容器非常重要。

一般来说，对于高频应用，陶瓷电容器是一个不错的选择；对于高容量和高温度应用，聚合物电容器是一个不错的选择；对于高电压和高频应用，铝电解电容器是一个不错的选择。

以上是关于三星电容器规格书的一些参考内容。

根据具体的产品型号和应用需求，还会有更多详细的规格和参数说明。

在选择和使用电容器时，用户应该仔细阅读和理解规格书，以确保正确选择和合理使用电容器，从而提高电路的性能和可靠性。

三星0603 22uf电容规格书

在这篇文章中，我将会为你撰写一篇有关三星0603 22uf电容规格书的文章。

我会对这个主题进行全面评估，并按照深度和广度的要求展开讨论，以便让你更深入地理解这个话题。

1. 介绍三星0603 22uf电容规格书1.1 什么是三星0603 22uf电容？三星0603 22uf电容是一种电子元件，常用于电子设备的电路中，用于存储电荷和调节电流。

1.2 什么是规格书？规格书是对产品的详细说明和规格参数的文档，用于指导产品的使用和生产。

2. 分析三星0603 22uf电容的规格书2.1 尺寸和外观三星0603 22uf电容的尺寸和外观特征，包括尺寸、形状、外壳材料等。

2.2 电气参数电容的额定电压、容量、误差、温度特性等电气参数的详细规格。

2.3 使用说明三星0603 22uf电容的使用注意事项和建议，以及常见问题和解决方法。

3. 个人观点和理解在这部分，我会共享我个人对三星0603 22uf电容规格书的理解和体会，包括在实际应用中的经验和认识。

总结和回顾部分将对文章进行一个全面、深刻和灵活的总结，以便你能够更全面地了解这个主题。

希望这篇文章能够帮你更深入地理解三星0603 22uf电容规格书，并对其有一个清晰的认识。

文章将符合知识的文章格式，使用序号标注，并在内容中多次提及指定的主题文字。

文章总字数将超过3000字，不包括字数统计。

希望这篇文章能够满足你的需求，让你对三星0603 22uf电容规格书有一个清晰的认识和深入的理解。

三星0603 22uf电容规格书是一份非常重要的文档，它包含了关于这种电容器的详细规格参数以及使用说明。

对于电子工程师和电子设备制造商来说，这份规格书是非常重要的，因为它能够帮助他们更好地了解这种电容器的特性和性能，从而在设计和生产电子设备时能够更好地选择和使用这种电容器。

让我们来介绍一下三星0603 22uf电容。

这种电容器是一种SMD贴片电容器，尺寸为0603，容量为22uf。

三星电容

应用领域
Ӌ仪器仪表，数码相机，液晶显示器，电视机，汽车导航系统，内存模块，掌上电脑，游戏机
结构和尺寸
L
T
W
BW
编码 05 10 21
31
32 42 43 55
（ＥＩＡ）编码 0402 0603 0805
1206
1210 1808 1812 2220
L 1.0ž0.05 1.6ž0.1 2.0ž0.1 2.0ž0.15 3.2ž0.2
If you want more detailed Information,Please Visit Samsung Electro-mechanics Website []
Quality System Certification List
Table 1:Certification list of Samsung Factory
WE WILL PROVIDE A CUSTOMER WITH HIGH RELIABLE PRODUCTS AND SERVICES
003
We, Samsung, declare that our component MLCC is produced in accordance with EU RoHS directive.
温度系数范围（ｐｐｍ／℃） 0 ž30 -150 ž60 -220 ž60 -330 ž60 -470 ž60
-750 ž120 -1000 ~ +350
电容变化（℃） ž15 ž15 ž22
-82 ~ +22
4.7
4.7
6.8
4.7 5.6 6.8 8.2
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尺寸 0201(0603) 0402(1005) 0603(1608) 0805(2012)

三星钽电容规格书SCS系列

18 8 8 8 8 8 8 8 8 8 8 8 8 8 8 30 8 8 8 8 8 18 8 8 8 10 8 8 8 8 8 8 8 8 8 6 8 8 12 8 8 8 8 8 10 8 8 8 8 8 8 8 10
ESR ( ) +25 100KHz Max.
1.2 8.0 6.0 6.0 4.0 3.5 4.0 3.5 4.0 3.5 2.0 3.5 1.8 1.8 1.6 2.0 0.8 1.6 0.8 1.2 0.8 0.5 0.6 0.9 0.7 0.6 8.0 6.0 6.0 4.0 3.5 4.0 3.5 2.0 3.5 2.0 3.0 1.8 2.0 1.3 1.6 3.5 1.2 0.8 0.8 0.8 0.8 1.3 0.9 0.6 0.7 0.5 0.3
Dissipation Factor (Tan ) Leakage Current T 85 Rated Voltage(VR) 85 T 125 Category Voltage(V) Surge Voltage(V)
85 T 85 T 125
SCS Series 25.0 16.0 32.0 20.0 35.0 22.0 44.0 28.0
Precautions in using Tantalum Capacitors 4 Characteristics Explanation
Specifications
Capacitance
Range Tolerance 0.47 to 680 20%(M), 10%(K) Refer to Specification Refer to Specification 16.0 20.0 10.0 10.0 13.0 6.3 20.0 25.0 13.0 13.0 16.0 8.0 -55 to 125 SCN Series

不同厂家瓷片电容规格书

三星阻容料盘读法CL03B104K Q8N N N C12345678910111系列编码：CL=积层陶瓷电容2尺寸编码03=0201(0603)01=0306(0816)05=0402(1005)10=0603(1608)14=0504(1410)21=0805(2012)31=1206(3216)32=1210(3225)42=1808(4520)43=1812(4532)55=2220(5750)12=0508(1220)3介质：I类II类C=C0G S=S2H L=S2LP=P2H T=T2HR=R2H U=U2JA=X5R F=Y5VB=X7R X=X6S4容量电容容量用三位数表示，前面两位为有效数字，第三位为有效数字后"0"的位数,如：104=100000（单位pF）如果中间一位为R则表示"."如：4R7=4.7pF5电容的误差：B=±0.1pf C=±0.25pf D=±0.5pf F=±1pf±1%G=±2%J=±5%M=±20%K=±10%Z=+80/-20%6额定电压：R=4V O=16V B=50V E=250V I=1000VQ=6.3V A=25V C=100V G=500V J=2000VP=10V L=35V D=200V H=630V K=3000V7厚度：3=0.30毫米A=0.65毫米M=1.15毫米I=2.00毫米Q=1.25毫米5=0.50毫米C=0.85毫米F=1.25毫米J=2.50毫米V=2.50毫米8=0.80毫米D=1.00毫米H=1.60毫米L=3.20毫米8内电极A=常规产品钯/银/镍屏蔽/锡100%N=常规产品镍/铜/镍屏蔽/锡100%G=常规产品铜/铜/镍屏蔽/锡100%L=低侧面产品镍/铜/镍屏蔽/锡100%9产品编码A=阵列(2-元素)L=LICCB=阵列(4-元素)N=常规P=自动C=高频10特殊编码11包装编码B=散装O=纸版箱料带,10英寸料盘E=压花纸版箱,7英寸料盘P=散装箱D=纸版箱料带,13英寸料盘(10000ea)F=压花纸版箱,13英寸料盘C=纸版箱料带,7英寸料盘L=纸版箱料带,13英寸料盘(15,000ea)S=压花纸版箱,10英寸料盘TDK贴片电容型号C2012X7R1H104K T系列名称体积材料电压容量误差包装积层贴片陶瓷片式电容器0603=0201CH0J=6.3V C=0.25T=卷带1005=0402COG1A=10V D=0.5B=袋装1608=0603JB1C=16V J=5%2012=0805JF1E=25V K=10%3216=1206X7R1H=50V M=20%3225=1210X5R2A=100V Z=+80-20%4532=1812Y5V2E=250V5650=22202J=630V4520=18083A=1KV3D=2KV3F=3KV1.元器件字母标识所对应误差列表(1)电容列表字母C D F J K M Z误差±0.25PF±0.5PF±1.0PF±5%±10%±20%+80%-20%(2)电阻列表字母D F G J K M Z误差±0.5%±1%±2%±5%±10%±20%+80%-20%2.元器件值识别标记(1)电阻标记值电阻值2R2=2.2Ω5R6=5.6Ω102=1KΩ682=6800Ω=6.8kΩ333=33KΩ104=100KΩ564=560KΩ(2)电容标记值电容量0R5=0.5PF010=1PF110=11PF471=470PF332=3300PF223=22000PF=0.022uF3.各公司表面贴装电阻．电容型号规格表示实例(1)KYOCERA公司电容CM21X7R105K0A T①②③④⑤⑥⑦⑧(2)KYOCERA公司电阻CR10—562J—T②④⑤⑧(3)ROHM公司电阻MCR01MZS G562①②⑧⑤④(4)ROHM公司电容MCH212F104Z K①②⑥③④⑤⑧(5)MuRata公司电容GRM36X7R472K25PT①②③④⑤⑥⑧(6)TDK电容C1005COG1E100D T①②③⑥④⑤⑧①：表示系列编号②：表示元器件尺寸③：表示元器件温度特性④：表示元器件的值⑤：表示元器件值允许误差⑥：表示元器额定电压⑦：表示元器件终端类型⑧：表示包装编号国巨贴片电容。

三星电容规格书

三星电容规格书三星电容规格书是指三星集团所生产的电容器产品的详细规格说明书。

下面将为您介绍三星电容规格书中常见的内容。

一、产品介绍三星电容规格书的第一部分是产品的介绍。

这部分通常包括产品名称、型号、外观尺寸、重量等基本信息。

同时，还会介绍产品的应用领域，例如通信设备、电子产品、汽车电子、医疗设备等，并解释为什么该产品适用于该领域。

二、产品特性三星电容规格书的第二部分是产品的特性介绍。

这部分通常包括电容器的电气特性和机械特性。

电气特性包括容量、精度、短时升温性能、稳定性等参数的介绍。

机械特性则包括外观特征、封装形式、连接方式等信息。

此外，还会介绍产品的工作温度范围、湿度条件等环境要求。

三、性能曲线和测试方法三星电容规格书的第三部分是性能曲线和测试方法。

这部分通常会给出电容器在不同工作电压、频率下的电容值曲线图和电阻值曲线图，并解释测试方法和测试条件。

这样用户就可以根据自己的需求选择合适的电容器。

四、质量保证和可靠性三星电容规格书的第四部分是质量保证和可靠性的介绍。

这部分通常包括产品的质量认证情况，如ISO 9001认证、ISO 14001认证等。

同时还会介绍产品的可靠性指标，如寿命、抗震动、抗湿热等性能。

此外，还会介绍三星公司的技术和质量管理体系，以确保产品的可靠性和稳定性。

五、包装和运输三星电容规格书的最后一部分是产品的包装和运输说明。

这部分通常会介绍产品的包装方式、包装材料、包装数量等信息，以及产品的运输方式、运输温度范围等要求。

同时还会提供产品的标签和批次号等信息，方便用户在使用和追溯过程中进行识别。

总结通过三星电容规格书，用户可以了解三星电容器产品的各种规格和性能指标，以便根据自己的需求选择合适的产品。

对于使用三星电容器的客户来说，这份规格书是非常重要的参考资料，它能够帮助用户了解产品的特性、性能以及质量保证等方面的信息，从而使用户能够更好地使用和维护产品。

贴片电容的精度规格书

容量与误差：实际电容量和标称电容量允许的最大偏差范围。

一般分为3级：I级±5%,11级±10%,111级±20%.在有些情况下，还有0级，误差为土20%.精密电容器的允许误差较小，而电解电容器的误差较大，它们采用不同的误差等级。

常用的电容器其精度等级和电阻器的表示方法相同。

用字母表示：D--005级--±0.5%;F--01级--±1%;G--02级--±2%;J--I级--±5%;K--II级--±10%;M--III级--±20%.一、电容的型号命名1）我们常见的电容品牌有三环电容、YAGEO电容、MURATA电容、风华电容、SAMSUNG电容、AVX电容等。

各国电容器的型号命名很不统一，国产电容器的命名由四部分组成：第一部分：用字母表示名称，电容器为C.第二部分：用字母表示材料。

第三部分：用数字表示分类。

第四部分：用数字表示序号。

2）电容的标志方法：（1）直标法：用字母和数字把型号、规格直接标在外壳上。

（2）文字符号法：用数字、文字符号有规律的组合来表示容量。

文字符号表示其电容量的单位：P、N、u、m、F等。

和电阻的表示方法相同。

标称允许偏差也和电阻的表示方法相同。

小于10pE的电容，其允许偏差用字母代替：B--±0.1pF,C--±0.2pFrD--±0.5pF,F--±1pF.（3）色标法：和电阻的表示方法相同，单位一般为pF.小型电解电容器的耐压也有用色标法的，位置靠近正极引出线的根部，所表示的意义如下表所示：（4）进口电容器的标志方法：进口电容器一般有6项组成。

第一项：用字母表示类别：第二项：用两位数字表示其外形、结构、封装方式、引线开始及与轴的关系。

第三项：温度补偿型电容器的温度特性，有用字母的，也有用颜色的，其意义如下表所备注：温度系数的单位10e-6/°C；允许偏差是%.第四项：用数字和字母表示耐压，字母代表有效数值，数字代表被乘数的10的幕。

三星帖片电容规格对照表教学文稿

三星帖片电容规格对照表三星帖片电容规格对照表规格试例:CL 10 A 105 K Q 8 N N N C1 2 3 4 5 6 7 8 9 10 111:系列编码CL=积层电容2:尺寸编码英寸 (毫米) 英寸 (毫米) 英寸 (毫米)0.3=0201(0603) 21=0805(2012) 42=1808(4520)0.5=0402(1005) 31=1206(3216) 43=1812(4532)10=0603(1608) 32=1210(3225) 55=2220(5750)3:电介质编码I类II类C=COG S=S2H L=S2L A=X5R F=Y5VP=P2H T=T2H B=X7R X=X6SR=R2H U=U2J4:电容编码以PF表示的电容,2个有效位加上零的数量.例如:106=10X106=10000000PF 对于<10PF,字母R表示小数点.例如;1R5=1.5PF 5:公差编码B=±0.1PF F=±1PF, ±1% K=±10%C=±0.25PF G=±2% M=±20%D=±0.5PF J=±5% Z=+80/-20%对于小于等于10PF的数值,F=±1PF对于大于10PF的数值,F=±1%.6:额定电压编码R=4V O=16V B=50V E=250V I=1000VQ=6.3V A=25V C=100V G=500V J=2000VP=10V L=35V D=200V H=630V K=3000V7:厚度编码3=0.30毫米 A=0.65毫米 M=1.15毫米 I=2.00毫米 Q=1.25毫米5=0.50毫米 C=0.85毫米 F=1.25毫米 J=2.50毫米 V=2.50毫米8=0.80毫米 D=1.00毫米 H=1.60毫米 L=3.20毫米8:内电极/端子/电镀编码A=常规产品钯/银/镍屏蔽/锡100%N=常规产品镍/铜/镍屏蔽/锡100%G=常规产品铜/铜/镍屏蔽/锡100%L=常规产品镍/铜/镍屏蔽/锡100%9:产品编码A=阵列(2-元素) L=L1CC B=阵列(4-元素) N=常规C=高频 P=自动10:特殊编码N=预留给未来用途11：包装编码B=散装 O=纸板箱料带,10英寸料盘 E=压花纸板箱,7英寸料盘P=散装箱D=纸板箱料带,13英寸料盘(10000CA) F=压花纸板。

三星电容规格书

■INTRODUCTIONMLCC(Multilayer Ceramic Capacitor)is SMD(Surface Mounted Device)type capacitor that is used in wide ranges of capacitance.MLCC is paid more attentions than other capacitors due to the better frequency characteristics,higher reliability,higher withstanding voltage and so on.MLCC is made of many layers of ceramic and inner electrodes like sandwich.Pd was used for inner electrodes.But the price of Pd was skyrocketed and Pd was replaced by the BME(Base Metal Electrode),which reduced the total cost of MLCC.This inner electrode is connected to outer termination for surface mounting,which is composed of three layers,Cu or Ag layer,Ni plating layer,and SnPb or Sn plating layer.Most of MLCCs become Pb free by the environmental issue at present.MLCC is divided into two classes.Class I(C0G,etc)is the temperature compensating type.It hasa small TCC(Temperature Coefficient of Capacitance)and a better frequency performance.Therefore,it is used in RF applications such as cellular phone,tuner,and so on.Class II(X7R, X5R,Y5V,etc)is the high dielectric constant type,which is used in general electronic circuit.Especially high capacitance MLCC is replacing other capacitors(Tantalum and Aluminum capacitor)due to the low ESR(Equivalent Series Resistance)value.■FEATURE AND APPLICATION●Feature-Miniature Size-Wide Capacitance and Voltage Range-Highly Reliable Performance-Tape&Reel for Surface Mount Assembly-Low ESR-High Q at High Frequencies-Stable Temperature Dependence of Capacitance●Application-High Frequency Circuit(Tuner,VCO,PAM etc)-General Power Supply Circuit(SMPS etc)-DC-DC Converter-General Electronic Circuit■STRUCTURE■APPEARANCE AND DIMENSIONDIMENSION(mm)CODE EIA CODEL W T(MAX)BW 0302010.6±0.030.3±0.030.3±0.030.15±0.05050402 1.0±0.050.5±0.050.5±0.050.2+0.15/-0.1 100603 1.6±0.10.8±0.10.8±0.10.3±0.2210805 2.0±0.1 1.25±0.1 1.25±0.10.5+0.2/-0.3 311206 3.2±0.2 1.6±0.2 1.6±0.20.5+0.2/-0.3 321210 3.2±0.3 2.5±0.2 2.5±0.20.6±0.3431812 4.5±0.4 3.2±0.3 3.2±0.30.8±0.3552220 5.7±0.4 5.0±0.4 3.2±0.3 1.0±0.3■PREVIOUS PART NUMBERINGSymbol EIA Code TemperatureCoefficient(PPM/℃)※TemperatureCharacteristicsOperationTemperature RangeC C0G(CH)0±30C Δ-55~+125℃P P2H -150±60P ΔR R2H -220±60R ΔS S2H -330±60S ΔT T2H -470±60T ΔU U2J -750±120U ΔLS2L+350~-1000SL▶CLASS Ⅰ(Temperature Compensation)TemperatureCharacteristicsbelow 2.0pF 2.2~3.9pF above 4.0pFabove 10pFC ΔC0G C0G C0G C0G P Δ-P2J P2H P2H R Δ-R2J R2H R2H S Δ-S2J S2HS2H T Δ-T2J T2H T2H U Δ-U2JU2JU2JSymbol EIA Code Capacitance Change(ΔC :%)OperationTemperature RangeA X5R ±15-55~+85℃B X7R ±15-55~+125℃FY5V+22~-82-30~+85℃▶CLASS Ⅱ(High Dielectric Constant)SAMSUNG Multilayer Ceramic Capacitor Type(Size)Capacitance Temperature Characteristics Nominal Capacitance Capacitance Tolerance Rated Voltage Thickness Option Packaging Type CAPACITANCE TEMPERATURE CHARACTERISTICS ※Temperature Characteristics ☞K :±250PPM/℃J :±120PPM/℃H :±60PPM/℃G :±30PPM/℃●●●●●●●●●Temperature CharacteristicsSymbol Tolerance Applicable Capacitance &RangeC0G(NPO)or T.C SeriesB ±0.1pF 0.5~3pF C±0.25pF 0.5~10pF D ±0.5pF F ±1pF 6~10pFG ±2%E-24Series for over 10pF J ±5%K±10%A(X5R)B(X7R)J ±5%E-12SeriesK ±10%M ±20%F(Y5V)Z-20%~+80%E-6Series CAPACITANCE TOLERANCE The nominal capacitance value is expressed in pico-Farad(pF)and identified by three-digit number,first two digits represent significant figures and last digit specifies the number of zeros to follow.For values below 1pF,the letter "R"is used as the decimal point and the last digit becomes significant.example)100:10×10o =10pF 102:10×102=1000pF020:2×10o =2pF1R5:1.5pFNOMINAL CAPACITANCE ●●※Please consult us for special tolerances.RATED VOLTAGE ●PACKAGING TYPE THICKNESS OPTION Symbol Description of the CodeN Standard thickness (please refer to standard thickness table on next page)A Thinner than standard thickness B Thicker than standard thicknessC Standard Thickness High Q (Low `D.F `)D Sn-100%(High-Q)ESn-100%(General)※Please Consult us for other termination type.●●Series Capacitance StepE-3 1.02.24.7E-6 1.01.52.23.34.76.8E-12 1.0 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.88.2E-241.0 1.2 1.5 1.82.2 2.73.3 3.94.75.66.88.21.11.31.62.02.43.03.64.35.16.27.59.1※Standard Capacitance is "Each step ×10n "▶STANDARD CAPACITANCE STEP■NEW PART NUMBERING●PRODUCT ABBREVIATION Symbol Product AbbreviationCLSAMSUNG Multilayer Ceramic Capacitor●SIZE(mm)Symbol Size(mm)Length Width 030.60.305 1.00.510 1.60.821 2.0 1.231 3.2 1.632 3.2 2.543 4.5 3.2555.75.0SAMSUNG Multilayer Ceramic Capacitor Size(mm)Capacitance Temperature Characteristic Nominal Capacitance Capacitance Tolerance Rated Voltage Thickness Option Product &Plating Method Samsung Control Code Reserved For Future Use Packaging Type ●●●●●●●●●●●●CAPACITANCE TEMPERATURE CHARACTERISTICSymbol Temperature Characteristics Temperature RangeCClassⅠCOG C△0±30(ppm/℃)-55~+125℃P P2H P△-150±60R R2H R△-220±60S S2H S△-330±60T T2H T△-470±60U U2J U△-750±60L S2L S△+350~-1000AClassⅡX5R X5R±15%-55~+85℃B X7R X7R±15%-55~+125℃F Y5V Y5V+22~-82%-30~+85℃※Temperature CharacteristicTemperatureCharacteristicsBelow2.0pF 2.2~3.9pF Above4.0pF Above10pF CΔC0G C0G C0G C0GPΔ-P2J P2H P2HRΔ-R2J R2H R2HSΔ-S2J S2H S2HTΔ-T2J T2H T2HUΔ-U2J U2J U2JJ:±120PPM/℃,H:±60PPM/℃,G:±30PPM/℃●NOMINAL CAPACITANCENominal capacitance is identified by3digits.The first and second digits identify the first and second significant figures of the capacitance. The third digit identifies the multiplier.'R'identifies a decimal point.●ExampleSymbol Nominal Capacitance1R5 1.5pF10310,000pF,10nF,0.01μF104100,000pF,100nF,0.1μF●CAPACITANCE TOLERANCE Symbol Tolerance Nominal CapacitanceA ±0.05pF Less than 10pF (Including 10pF)B ±0.1pFC ±0.25pFD ±0.5pF F ±1pF F ±1%More than 10pF G ±2%J ±5%K ±10%M ±20%Z+80,-20%●RATEDVOLTAGE●THICKNESS OPTIONType Symbol Thickness(T)Spec 060330.30±0.03 100550.50±0.05 160880.80±0.102012A0.65±0.10 C0.85F 1.25±0.103216C0.85±0.15 F 1.25±0.15 H 1.6±0.203225F 1.25±0.20H 1.6I 2.0J 2.54532F 1.25±0.20H 1.6I 2.0J 2.5L 3.2±0.305750F 1.25±0.20H 1.6I 2.0J 2.5L 3.2±0.30●PRODUCT&PLATING METHODSymbol Electrode Termination Plating TypeA Pd Ag Sn_100%N Ni Cu Sn_100%G Cu Cu Sn_100%●SAMSUNG CONTROL CODE●RESERVED FOR FUTURE USESymbol Description of the codeN Reserved for future use●PACKAGING TYPE▶CAPACITANCE vs CHIP THICKNESS STANDARDDescription0603(0201)1005(0402)1608(0603)2012Type (0805)3216Type (1206)3225Type (1210)4532Type (1812)5750Type (2220)Dimension (mm)L0.6±0.03 1.0±0.05 1.6±0.1 2.0±0.13.2±0.153.2±0.2 3.2±0.34.5±0.45.7±0.4W 0.3±0.030.5±0.050.8±0.1 1.25±0.1 1.6±0.15 1.6±0.22.5±0.23.2±0.3 5.0±0.4T0.3±0.030.5~±0.050.8±0.10.65±0.10.85±0.11.25±0.10.85±0.15 1.25±0.15 1.6±0.21.25±0.2 1.6±0.22.0±0.22.5±0.21.25±0.21.6±0.22.0±0.22.5±0.21.6±0.22.0±0.22.5±0.2C A P ACIT A N CER A N G E (p F )SL 50V -0.5~2400.5~10000.5~10001100~15001600~27000.5~27003000~56006200~8200-----------C,TC (Except SL,UJ)25V 0.5~470.5~2200.5~1000--3300~82001500~36003900~68007500~10000-----100000-----50V -0.5~1800.5~10000.5~560620~10001100~33000.5~22002400~4700-560~1000011000~2200024000~47000-1000~1300015000~2200024000~4700062000~680004300093000130000C A P A C I T A N C E R A N G E (n F )A (X5R)6.3V 102202200--10000--10000---22000---47000--4700010V101001000--2200--4700~10000---22000------4700016V -47330~470--1000--4700---6800~10000-------25V --------------------50V- 6.8~10------------------B (X7R)6.3V 0.1~1047~100470~1000--1000--6800~10000---22000-------10V0.1~1033~100220~470220~270330~470560~1000-1000~330047001500~220033003900~4700----22000---16V0.1~110~33100~22068~200220~330390~1000330~6801000~15002200~33001500~220033003900~4700---2200----25V -4.7~1047~10039~6882~100150~470100~330470~620680~1000680~150018002200---1000---1000050V -0.22~4.70.22~1000.22~3947~1002201~150220390~1000 2.2~680820~1000--10~1000-----3300~4700F (Y5V)6.3V10~100-2200--10000-----47000--------10V -220~330100~1000--4700-470010000~22000---22000------10000016V -10~220100~100010~680820~10001200~22001000~22002700~4700100003300~68001000015000---22000----25V -10~3322~33010~220270~470560~1000470~10001200~22002700~33001000~33004700~10000-----10000---50V - 2.2~102.2~1002.2~6882~150180~100010~470560~1000-100~1000------10000---■PACKAGING●CARDBOARD PAPER TAPESymbol W F E P1P2P0D tABTypeD i m e n s i o n038.0±0.3 3.5±0.05 1.75±0.12.0±0.052.0±0.05 4.0±0.1Φ1.5+0.1/-00.37±0.030.38±0.030.68±0.03050.6±0.050.65+0.05/-0.1 1.15+0.05/-0.110 4.0±0.11.1MAX1.1±0.21.9±0.221 1.6±0.22.4±0.2312.0±0.23.6±0.2unit :mm●EMBOSSED PLASTIC TAPE●TAPING SIZE●REEL DIMENSIONSymbol A B CDEWtR7"Reel φ178±2.0min.φ50φ13±0.521±0.82.0±0.510±1.50.8±0.21.013"Reelφ330±2.0min.φ70unit :mmSymbol Cardboard Paper TapeEmbossed Plastic Tape7"Reel 4000200013"Reel15000-unit :pcsSize 05(0402)10(0603)21(0805)T ≤0.85mm T ≥1.0mm Quantity 50,00010,000~15,000*10,0005,000●BULK CASE PACKAGING-Bulk case packaging can reduce the stock space and transportation costs.-The bulk feeding system can increase the productivity.-It can eliminate the componentsloss.Symbol A B T C D E Dimension 6.8±0.18.8±0.112±0.1 1.5+0.1/-02+0/-0.14.7±0.1Symbol F W G H L I Dimension31.5+0.2/-036+0/-0.219±0.357±0.35110±0.75±0.35●QUANTITY*Option■CHARACTERISTIC MAP●CLASSⅠTemperature Characteristics Size VoltageCapacitance Range(㎊)SL,UJ05 (0402)50V10 (0603)50V21 (0805)50V31 (1206)50VC(COG)& TC Series03(0201)25V05(0402)25V50V10(0603)25V50V21(0805)25V50V31(1206)25V50V　32(1210)50V100V43(1812)25V50V55(2220)50V101001000100001000001000000100000001000000000.5240270082001000100010000150033004700100018022047820033001800047005604700068000100010000013000043000●CLASSⅡ,A(X5R)Temperature Characteristics Size Voltage Capacitance Range(㎊)A(X5R)0603(0201)6.3V10V1005(0402)6.3V10V16V50V1608(0603)6.3V10V16V2012(0805)6.3V10V16V3216(1206)6.3V10V16V3225(1210)6.3V10V16V4532(1812) 6.3V5750(2220)6.3V10V101001000100001000001000000100000001000000001000010000010000100000004700000220000002200000100000004700000220000004700000047000100006800100000022000001000000470000330000100000001000000068000004700000047000000220000●CLASSⅡ,B(X7R)Temperature Characteristics Size VoltageCapacitance Range(㎊)B(X7R)03(0201)6.3V10V16V05(0402)6.3V10V16V25V50V10(0603)6.3V10V16V25V50V21(0805)6.3V10V16V25V50V31(1206)6.3V10V16V　25V50V10100100010000100000100000010000000100000000100000470004700000470000100000100000047000022000010000003300000100000010000001001000010000000100000100000100100001001000680000033000100003300010000470047002204700002200002200001000004700022022000010000006800039000220100000033000010000010000001000●CLASSⅡ,B(X7R)Temperature Characteristics Size VoltageCapacitance Range(㎊)B(X7R)32(1210)6.3V10V16V25V50V43(1812)10V16V25V50V55(2220)25V50V1010010001000010000010000001000000010000000022000000100000010000470000015000002200000010000001000000047000003300000470000015000002200000680000100000022002200000●CLASSⅡ,F(Y5V)Temperature Characteristics Size VoltageCapacitance Range(㎊)F(Y5V)03(0201) 6.3V05(0402)10V16V25V50V10(0603)6.3V10V16V25V50V21(0805)6.3V10V16V25V50V31(1206)10V16V　25V50V32(1210)6.3V10V16V25V50V43(1812)16V25V50V55(2220)10V330000330001000022000010000220010000003300001000001000002200022001000000220000010000100002200000047000001000000033000001000000100000047000010000470000010000001500000033000001000000100000100000002200000010000220000100000001000000010000000022000001000000010000010000100000010000010000002200470000002200000010100100010000100000100000010000000100000000■RELIABILITY TEST DATANO ITEM PERFORMANCE TEST CONDITION 1APPEARANCE NO ABNORMAL EXTERIOR APPEARANCE THROUGH MICROSCOPE(×10)2INSULATIONRESISTANCE10,000㏁OR500㏁·㎌PRODUCT WHICHEVER ISSMALLER(RATED VOLTAGE IS BELOW16V:10,000㏁OR100㏁·㎌)RATED VOLTAGE SHALL BE APPLIED.MEASUREMENT TIME IS60~120RATED VOLTAGETIME60SEC.3WITHSTANDINGVOLTAGENO DIELECTRIC BREAKDOWN ORMECHANICAL BREAKDOWNCLASSⅠ:300%OF THE RATED VOLTAGE FOR1~5SEC,CLASSⅡ:250%OF THE RATED VOLTAGE FOR1~5SECIS APPLIED WITH LESS THAN50㎃CURRENT4CAPACITANCECLASSⅠWITHIN THE SPECIFIEDTOLERANCECAPACITANCE FREQUENCY VOLTAGE1,000㎊ANDBELOW1㎒±10%0.5~5VrmsMORE THAN1,000㎊1㎑±10%CLASSⅡWITHIN THE SPECIFIEDTOLERANCECAPACITANCE FREQUENCY VOLTAGE10㎌AND BELOW1㎑±10% 1.0±0.2VrmsMORE THAN10㎌120㎐±20%0.5±0.1Vrms5Q CLASSⅠOVER30㎊:Q≥1,000LESS THAN30㎊:Q≥400+20C(C:CAPACITANCE)CAPACITANCE FREQUENCY VOLTAGE1,000㎊ANDBELOW1㎒±10%0.5~5VrmsMORE THAN1,000㎊1㎑±10%6TanδCLASSⅡ1.CHAR:B2.CHAR:FCAPACITANCE FREQUENCY VOLTAGE10㎌AND BELOW1㎑±10% 1.0±0.2VrmsMORE THAN10㎌120㎐±20%0.5±0.1Vrms RATED VOLTAGE DF SPEC6.3V0.05max10V0.05max16V0.035max25V0.025max50V이상0.025max6.3V10V16V25V50V1005-0.125max0.09max(C＜220nF)0.125max(C≥220nF)0.05max0.05max16080.16max0.125max0.09max0.05max(C≤100nF)0.07max(C>100nF)0.05max20120.16max0.125max0.09max0.07max0.05max32160.16max0.125max0.09max0.07max0.05max32250.16max0.125max0.09max0.07max(C≤6.8㎌)0.09max(C>6.8㎌)0.05max45320.16max0.16max0.09max--57500.125max---www.cdindustries.hk*THE INITIAL VALUE OF HIGH DIELECTRIC CONSTANT SERIES SHALL BE MEASUREDAFTER THE HEAT TREATMENT OF150+0/-10℃,1Hr AND SITTING OF48±4hr AT ROOM TEMPERATURE&ROOM HUMIDITY.NO ITEM PERFORMANCE TEST CONDITION14HUMIDITY(STEADYSTATE)APPEARANCE NO MECHANICAL DAMAGE SHALL OCCUR TEMPERATURE:40±2℃RELATIVE HUMIDITY:90~95%RHTEST TIME:500+12/-0Hr.MEASURE AT ROOM TEMPERATUREAFTER COOLING FORCLASSⅠ:24±2Hr.CLASSⅡ:48±4Hr.CAPACITANCECHARACTERISTIC CAPACITANCE CHANGECLASSⅠWITHIN±5%OR±0.5㎊WHICHEVERIS LARGERCLASSⅡA,B WITHIN±12.5%F WITHIN±30%QCLASSⅠ30㎊AND OVER:Q≥35010~30㎊:Q≥275+2.5×CLESS THAN10pF:Q≥200+10×CTanδCLASSⅡINSULATIONRESISTANCEMINIMUM INSULATION RESISTANCE:1,000㏁OR50㏁·㎌PRODUCT WHICHEVER ISSMALLER15MOISTURERESISTANCEAPPEARANCE NO MECHANICAL DAMAGE SHALL OCCUR APPLIED VOLTAGE:RATED VOLTAGETEMPERATURE:40±2℃RELATIVE HUMIDITY:90~95%RHTEST TIME:500+12/-0Hr.CURRENT APPLIED:50㎃MAX.<INITIAL MEASUREMENT>CLASSⅡSHOULD BE MEASUREDINITIAL VALUE AFTER BE HEAT-TREATEDFOR1HR IN150℃+0/-10℃AND BE LEFTFOR48±4HR AT ROOM TEMPERATURE.<LATTER MEASUREMENT>CLASSⅠSHOULD BE MEASURED AFTERLEFT FOR24±2HRS IN ROOMTEMPERATURE AND HUMIDITY.CLASSⅡSHOULD BE MEASUREDLATTER VALUE AFTER BEHEAT-TREATED FOR1HR IN150℃+0/-10℃AND BE LEFT FOR48±4HR AT ROOMTEMPERATURE.CAPACITANCECHARACTERISTIC CAPACITANCE CHANGECLASSⅠWITHIN±7.5%OR±0.75㎊WHICHEVERIS LARGERCLASSⅡA,B WITHIN±12.5%FWITHIN±30%WITHIN+30~－40%1005C>0.47μF1608C>1.0μF2012C>4.7μF3216C>10.0μF3225C>22.0μF4532C>47.0μFQCLASSⅠ30㎊AND OVER:Q≥20030㎊AND BELOW:Q≥100+10/3×CTanδCLASSⅡINSULATIONRESISTANCEMINIMUM INSULATION RESISTANCE:500㏁OR25㏁·㎌PRODUCT,WHICHEVER IS SMALLER.CHAR.25VANDOVER16V10V 6.3V4VA,B0.050.05MAX0.05MAX0.075MAX0.1MAXF0.075MAX0.1MAX(C〈1.0㎌)0.125MAX(C≥1.0㎌)0.15MAX0.195MAX0.25MAXCHAR.25VANDOVER16V10V 6.3V4VA,B0.05MAX0.05MAX0.05MAX0.075MAX0.1MAXF0.075MAX0.1MAX(C〈1.0㎌)0.125MAX(C≥1.0㎌)0.15MAX0.195MAX0.25MAX6.3VTanδ0.125MAX*ConditionCLASSⅡ(A,B)1005C≥0.22㎌1608C≥2.2㎌2012C≥4.7㎌3216C≥10.0㎌3225C≥22.0㎌4532C≥47.0㎌5750C≥100.0㎌6.3V Tanδ0.125MAX*ConditionCLASSⅡ(A,B)1005C≥0.22㎌1608C≥2.2㎌2012C≥4.7㎌3216C≥10.0㎌3225C≥22.0㎌4532C≥47.0㎌5750C≥100.0㎌NO ITEM PERFORMANCE TEST CONDITION16HIGHTEMPERATURERESISTANCEAPPEARANCE NO MECHANICAL DAMAGE SHALL OCCURAPPLIED VOLTAGE:150%,200%OF RATED VOLTAGETEST TIME:1000+48/-0Hr.CURRENT APPLIED:50㎃MAX.<INITIAL MEASUREMENT>CLASSⅡSHOULD BE MEASURED INITIALVALUE AFTER BE HEAT-TREATED FOR1HR IN150℃+0/-10℃AND BE LEFT FOR48±4HR AT ROOM TEMPERATURE.<LATTER MEASUREMENT>CLASSⅠSHOULD BE MEASURED AFTERLEFT FOR24±2HRS IN ROOMTEMPERATURE AND HUMIDITY.CLASSⅡSHOULD BE MEASURED LATTERVALUE AFTER BE HEAT-TREATED FOR1HR IN150℃+0/-10℃AND BE LEFT FOR48±4HR AT ROOM TEMPERATURE.(TWICE OF RATED VOLTAGE WILL BEAPPLIED TO ALL SERIES BUT ABOVE)**HOWEVER,A/B는1005C≥0.22㎌SEE(FIG.3)CAPACITANCECHARACTERISTIC CAP.CHANGECLASSⅠWITHIN±3%OR±0.3㎊,WHICHEVER IS LARGERCLASSⅡA,B WITHIN±12.5%FWITHIN±30%WITHIN+30~40%1005C>0.47μF1608C>1.0μF2012C>4.7μF3216C>10.0μF3225C>22.0μF4532C>47.0μFQCLASSⅠ30㎊AND OVER:Q≥35010~30㎊:Q≥275+2.5×CLESS THAN10㎊:Q≥200+10×CTanδCLASSⅡINSULATIONRESISTANCEMINIMUM INSULATION RESISTANCE:1,000㏁OR50㏁·㎌PRODUCTWHICHEVER IS SMALLER17TEMPERATURECYCLEAPPEARANCE NO MECHANICAL DAMAGE SHALL OCCUR CAPACITORS SHALL BE SUBJECTEDTO FIVE CYCLES OF THETEMPERATURE CYCLE AS FOLLOWINGSTEP TEMP.(℃)TIME(MIN)1MIN.RATEDTEMP.+0/-3302252~33MAX.RATEDTEMP.+3/-0304252~3MEASURE AT ROOM TEMPERATUREAFTER COOLING FORCLASSⅠ:24±2Hr.CLASSⅡ:48±4Hr.CAPACITANCECHARACTERISTIC CAP.CHANGECLASSⅠWITHIN±2.5%OR±0.25㎊WHICHEVER ISLARGERCLASSⅡA,B WITHIN±7.5%F WITHIN±20%QCLASSⅠ30㎊AND OVER:Q≥1000LESS THAN30㎊:Q≥400+20×CTanδCLASSⅡTO SATISFY THE SPECIFIEDINITIAL VALUEINSULATIONRESISTANCETO SATISFY THE SPECIFIEDINITIAL VALUECHAR.25VANDOVER16V10V 6.3V4VA,B0.05MAX0.05MAX0.05MAX0.075MAX0.1MAXF0.075MAX0.1MAX(C<1.0㎌)0.125MAX(C≥1.0㎌)0.15MAX0.195MAX0.25MAXCHAR.TEMP.CLASSⅠ125±3℃CLASSⅡA85±3℃B125±3℃F85±3℃*150%Authorization ConditionsCLASSⅡ(A,B,F)1005C>0.47μF1608C≥2.2㎌2012C≥4.7㎌3216C≥10.0㎌3225C≥22.0㎌4532C≥47.0㎌5750C≥100.0㎌■CHARACTERISTIC GRAPH▶CAPACITANCE CHANGE -AGING▶CAPACITANCE -DC VOLTAGE CHARACTERISTICS▶CAPACITANCE -TEMPERATURE CHARACTERISTICS●ELECTRICAL CHARACTERISTICS■APPLICATION MANUAL●Storage Condition▶Storage EnvironmentThe electrical characteristics of MLCCs were degraded by the environment of high temperature or humidity.Therefore,the MLCCs shall be stored in the ambient temperature and the relative humidity of less than40℃and70%,respectively.Guaranteed storage period is within6months from the outgoing date of delivery.▶Corrosive GasesSince the solderability of the end termination in MLCC was degraded by a chemical atmosphere such as chlorine,acid or sulfide gases,MLCCs must be avoid from these gases.▶Temperature FluctuationsSince dew condensation may occur by the differences in temperature when the MLCCs are taken out of storage,it is important to maintain the temperature-controlled environment.●Design of Land PatternWhen designing printed circuit boards,the shape and size of the lands must allow for theproper amount of solder on the capacitor.The amount of solder at the end terminations has a direct effect on the crack.The crack in MLCC will be easily occurred by the tensile stress which was due to too much amount of solder.In contrast,if too little solder is applied,the termination strength will be e the following illustrations as guidelines for proper land design.Recommendation of Land Shape and Size●AdhesivesWhen flow soldering the MLCCs,apply the adhesive in accordance with the following conditions.▶Requirements for AdhesivesThey must have enough adhesion,so that,the chips will not fall off or move during thehandling of the circuit board.They must maintain their adhesive strength when exposed to soldering temperature.They should not spread or run when applied to the circuit board.They should harden quickly.They should not corrode the circuit board or chip material.They should be a good insulator.They should be non-toxic,and not produce harmful gases,nor be harmful when touched.▶Application MethodIt is important to use the proper amount of adhesive.Too little and much adhesive will cause poor adhesion and overflow into the land,respectively.▶Adhesive hardening CharacteristicsTo prevent oxidation of the terminations,the adhesive must harden at160℃or less,within2minutes or less.●Mounting▶Mounting Head PressureExcessive pressure will cause crack to MLCCs.The pressure of nozzle will be300g maximum during mounting.▶Bending StressWhen double-sided circuit boards are used,MLCCs first are mounted and soldered onto one side of the board.When the MLCCs are mounted onto the other side,it is important to support the board as shown in the illustration.If the circuit board is not supported,the crack occur to the ready-installed MLCCs by the bending stress.●FluxAlthough the solderability increased by the highly-activated flux,increase of activity in flux may also degrade the insulation of the chip capacitors.To avoid such degradation,it is recommended that a mildly activated rosin flux(less than0.2%chlorine)be used.●SolderingSince a multilayer ceramic chip capacitor comes into direct contact with melted solder during soldering,it is exposed to potentially mechanical stress caused by the sudden temperature change.The capacitor may also be subject to silver migration,and to contamination by the flux.Because of these factors,soldering technique is critical.▶Soldering MethodsMethodClassificationReflow soldering-Overall heating-Infrared rays -Hot plate-VPS(vapor phase)-Local heating-Air heater -Laser-Light beamFlow soldering-Single wave -Double wave-*We recommend the reflow soldering method.▶Soldering ProfileTo avoid crack problem by sudden temperature change,follow the temperature profile in the adjacentgraph.30025020015010050℃Reflow Soldering 30025020015010050℃60~120sec 3~4secFlow Soldering▶Manual SolderingManual soldering can pose a great risk of creating thermal cracks in chip capacitors.The hotsoldering iron tip comes into direct contact with the end terminations,and operator's carelessnessmay cause the tip of the soldering iron to come into direct contact with the ceramic body of the capacitor.Therefore the soldering iron must be handled carefully,and close attention must be paid to the selection of the soldering iron tip and to temperature control of the tip.▶Amount ofSolder▶CoolingNatural cooling using air is recommended.If the chips are dipped into solvent for cleaning, the temperature difference(△T)must be less than100℃6-6.CleaningIf rosin flux is used,cleaning usually is unnecessary.When strongly activated flux is used, chlorine in the flux may dissolve into some types of cleaning fluids,thereby affecting the chip capacitors.This means that the cleaning fluid must be carefully selected,and should always be new.▶Notes for Separating Multiple,Shared PC Boards.A multi-PC board is separated into many individual circuit boards after soldering has been completed.If the board is bent or distorted at the time of separation,cracks may occur in the chip capacitors.Carefully choose a separation method that minimizes the bending of the circuit board.■CROSS REFERENCEP/N COMPANY SAMSUNG AVX JOHANSON KEMET KYOCERA MURATA NOVACAP PANASONIC ROHMTAIYO-YUDENTDK VITRAMON①COMPANY MODEL(MLCC)CL--C CM GRM-ECJ MCH MK C VJ②SIZE (EIA/JIS)0201(0603)03---0333-Z-0630603-0402(1005)050402R0704020536040201510510050402 0603(1608)100603R14060310539060311810716080603 0805(2012)210805R1508052140080522121220120805 1206(3216)311206R181********-6120633131632161206 1210(3225)321210S4112103242-2121043232532251210 1808(4520)421808R29180842-1808---45201808 1812(4532)431812S4318124343-21812-4343245321812 2220(5750)55--22205544-12221--5505650-③TEMPERATURE CHARACTERISTIC COG(NPO)C A N G CG COG/CH N C A C COG/CH A P2H(N150)P S--P P2H-P-P PH-R2H(N220)R1--R R2H-R-R RH-S2H(N330)S3--S S2H-S-S SH-T2H(N470)T O--T T2H-T-T TH-U2J(N750)U Z--U U2J-U UJ U UJ-S2L L Y--SL SL-G SL SL SL-X7R B C W R(X)X7R X7R B B C BJ X7R(B)Y(X) Z5U E E Z U-Z5U Z-E-Z5U U Y5V F G Y V Y5V Y5V Y F F F Y5V-④NOMINAL CAPACITANCE EX)103=10,000㎊221=220㎊225=2,200,000㎊=2.2㎌1R5=1.5㎊010=1㎊⑤CAPACITANCE TOLERANCE B:±0.1㎊C:±0.25㎊D:±0.5㎊F:±1%G:±2%J:±5%K:±10%M:±20%Z:-20~+80%⑥RATED VOLTAGE6.3V Q6-906 6.3-0J-J0J-10V P Z10081010-1A4L1A-16V O Y160416161601C3E1C J 25V A3250325252501E2T1E X 50V B5500550505001H5U1H A 100V C110111*********A1-2A B 200V D220122002002012D---C 250V E V--250250251---2E-500V G7501-500500501----E 630V H---630630----2J-1000V I A102-10001K102---3A G 2000V J G202-20002K202---3D-3000V K H302-30003K302---3F H 4000V-J-4000-402-----⑦TERMINATIONNICKEL BARRIER N T V C A(GRM)N-(MCH)--X Ag/Pd P1--B(GR)P-(MC)--F⑧PACKAGEBULK(VINYL)B9(NONE)-B PB*X-B B B PAPER TAPING C2,4T,R-T,L PT T E,V,W K,L T T C,P PLASTIC TAPING E1,3E,U-H,N PT-F,Y P,Q T-T,R BULK CASE P7--C PC-C C--G。

三星电容规格书

三星电容规格书1. 引言本规格书旨在介绍三星电容的详细规格和特性。

三星电容是一种高质量、可靠性强的电子元件，广泛应用于各种电路和设备中。

本文将从技术参数、材料特性、封装形式以及应用领域等方面对三星电容进行全面介绍。

2. 技术参数2.1 电容值三星电容提供多种不同的电容值，范围从几皮法到数百微法。

具体的电容值取决于产品型号和系列。

2.2 额定电压每个三星电容都有一个额定电压，表示其能够承受的最大工作电压。

额定电压可以从几伏到数百伏不等。

2.3 容差三星电容的容差指标表明了其实际值与标称值之间的允许偏差范围。

常见的容差包括±5%、±10%等。

2.4 工作温度范围三星电容适用于不同的工作温度范围，常见的工作温度范围包括-40℃至+85℃、-55℃至+125℃等。

2.5 极性部分三星电容是极性电容，需要按照正确的极性连接。

而非极性电容则不受极性限制。

3. 材料特性3.1 介质材料三星电容的介质材料通常采用高质量的聚合物或陶瓷材料。

这些材料具有良好的绝缘性能和稳定性，以确保电容的长期可靠运行。

3.2 极板材料三星电容的极板通常采用优质金属，如铝或钽。

这些金属具有良好的导电性和耐腐蚀性，以确保电容在工作中能够提供稳定可靠的电流传输。

3.3 封装材料三星电容的封装材料通常采用环保型塑料或金属外壳。

这些封装材料具有良好的机械强度和耐高温特性，以保护内部元件并提供稳定的外部连接。

4. 封装形式4.1 表面贴装型（SMD）三星电容可提供表面贴装型封装，方便在PCB上进行自动化焊接。

常见的封装形式有0805、1206、1210等，具体尺寸取决于电容的电容值和额定电压。

4.2 插件型三星电容也可提供插件型封装，适用于手工焊接或特殊应用场景。

插件型封装通常具有引脚，可直接插入PCB或插座中。

5. 应用领域5.1 通信设备三星电容广泛应用于各种通信设备，如手机、无线路由器、基站等。

其高质量和稳定性能确保了通信设备的可靠运行和优秀的信号传输质量。

三星贴片电阻产品手册2011版

The product of lead-free terminal is RoHS compliant. PhO(lead oxide) is included in the glass of our product which is prescribed on RoHS appendix as an exception.
Operation Notes Example of Land Pattern Design
Recommended Soldering Conditions
General Purpose
Precision
Low Ohms
Array
Attenuator
Characteristics Performance
J Tolerance
G : ±2% J : ±5% K : ±10%
Jumper: J
100 Resistance Value
CS Packaging Code
3 or 4 digits coding system (IEC coding system) 3digits (E-24 series) 4digits (E-96 series)
Structure and Dimensions
Structure
Glass or Polymer Coating (Protective Coating) RuO2 type Resistor
Dimensions I1
Alumina Substrate(96%)
Thick film Elecrtode (Inner Electrode) Special Plating (Ni, Solder)
RC 6432
Marking

三星SMT电容规格书

■INTRODUCTIONMLCC(Multilayer Ceramic Capacitor)is SMD(Surface Mounted Device)type capacitor that is used in wide ranges of capacitance.MLCC is paid more attentions than other capacitors due to the better frequency characteristics,higher reliability,higher withstanding voltage and so on.MLCC is made of many layers of ceramic and inner electrodes like sandwich.Pd was used for inner electrodes.But the price of Pd was skyrocketed and Pd was replaced by the BME(Base Metal Electrode),which reduced the total cost of MLCC.This inner electrode is connected to outer termination for surface mounting,which is composed of three layers,Cu or Ag layer,Ni plating layer,and SnPb or Sn plating layer.Most of MLCCs become Pb free by the environmental issue at present.MLCC is divided into two classes.Class I(C0G,etc)is the temperature compensating type.It hasa small TCC(Temperature Coefficient of Capacitance)and a better frequency performance.Therefore,it is used in RF applications such as cellular phone,tuner,and so on.Class II(X7R, X5R,Y5V,etc)is the high dielectric constant type,which is used in general electronic circuit.Especially high capacitance MLCC is replacing other capacitors(Tantalum and Aluminum capacitor)due to the low ESR(Equivalent Series Resistance)value.■FEATURE AND APPLICATION●Feature-Miniature Size-Wide Capacitance and Voltage Range-Highly Reliable Performance-Tape&Reel for Surface Mount Assembly-Low ESR-High Q at High Frequencies-Stable Temperature Dependence of Capacitance●Application-High Frequency Circuit(Tuner,VCO,PAM etc)-General Power Supply Circuit(SMPS etc)-DC-DC Converter-General Electronic Circuit■STRUCTURE■APPEARANCE AND DIMENSIONDIMENSION(mm)CODE EIA CODEL W T(MAX)BW 0302010.6±0.030.3±0.030.3±0.030.15±0.05050402 1.0±0.050.5±0.050.5±0.050.2+0.15/-0.1 100603 1.6±0.10.8±0.10.8±0.10.3±0.2210805 2.0±0.1 1.25±0.1 1.25±0.10.5+0.2/-0.3 311206 3.2±0.2 1.6±0.2 1.6±0.20.5+0.2/-0.3 321210 3.2±0.3 2.5±0.2 2.5±0.20.6±0.3431812 4.5±0.4 3.2±0.3 3.2±0.30.8±0.3552220 5.7±0.4 5.0±0.4 3.2±0.3 1.0±0.3■PREVIOUS PART NUMBERINGSymbol EIA Code TemperatureCoefficient(PPM/℃)※TemperatureCharacteristicsOperationTemperature RangeC C0G(CH)0±30C Δ-55~+125℃P P2H -150±60P ΔR R2H -220±60R ΔS S2H -330±60S ΔT T2H -470±60T ΔU U2J -750±120U ΔLS2L+350~-1000SL▶CLASS Ⅰ(Temperature Compensation)TemperatureCharacteristicsbelow 2.0pF 2.2~3.9pF above 4.0pFabove 10pFC ΔC0G C0G C0G C0G P Δ-P2J P2H P2H R Δ-R2J R2H R2H S Δ-S2J S2HS2H T Δ-T2J T2H T2H U Δ-U2JU2JU2JSymbol EIA Code Capacitance Change(ΔC :%)OperationTemperature RangeA X5R ±15-55~+85℃B X7R ±15-55~+125℃FY5V+22~-82-30~+85℃▶CLASS Ⅱ(High Dielectric Constant)SAMSUNG Multilayer Ceramic Capacitor Type(Size)Capacitance Temperature Characteristics Nominal Capacitance Capacitance Tolerance Rated Voltage Thickness Option Packaging Type CAPACITANCE TEMPERATURE CHARACTERISTICS ※Temperature Characteristics ☞K :±250PPM/℃J :±120PPM/℃H :±60PPM/℃G :±30PPM/℃●●●●●●●●●Temperature CharacteristicsSymbol Tolerance Applicable Capacitance &RangeC0G(NPO)or T.C SeriesB ±0.1pF 0.5~3pF C±0.25pF 0.5~10pF D ±0.5pF F ±1pF 6~10pFG ±2%E-24Series for over 10pF J ±5%K±10%A(X5R)B(X7R)J ±5%E-12SeriesK ±10%M ±20%F(Y5V)Z-20%~+80%E-6Series CAPACITANCE TOLERANCE The nominal capacitance value is expressed in pico-Farad(pF)and identified by three-digit number,first two digits represent significant figures and last digit specifies the number of zeros to follow.For values below 1pF,the letter "R"is used as the decimal point and the last digit becomes significant.example)100:10×10o =10pF 102:10×102=1000pF020:2×10o =2pF1R5:1.5pFNOMINAL CAPACITANCE ●●※Please consult us for special tolerances.RATED VOLTAGE ●PACKAGING TYPE THICKNESS OPTION Symbol Description of the CodeN Standard thickness (please refer to standard thickness table on next page)A Thinner than standard thickness B Thicker than standard thicknessC Standard Thickness High Q (Low `D.F `)D Sn-100%(High-Q)ESn-100%(General)※Please Consult us for other termination type.●●Series Capacitance StepE-3 1.02.24.7E-6 1.01.52.23.34.76.8E-12 1.0 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.88.2E-241.0 1.2 1.5 1.82.2 2.73.3 3.94.75.66.88.21.11.31.62.02.43.03.64.35.16.27.59.1※Standard Capacitance is "Each step ×10n "▶STANDARD CAPACITANCE STEP■NEW PART NUMBERING●PRODUCT ABBREVIATION Symbol Product AbbreviationCLSAMSUNG Multilayer Ceramic Capacitor●SIZE(mm)Symbol Size(mm)Length Width 030.60.305 1.00.510 1.60.821 2.0 1.231 3.2 1.632 3.2 2.543 4.5 3.2555.75.0SAMSUNG Multilayer Ceramic Capacitor Size(mm)Capacitance Temperature Characteristic Nominal Capacitance Capacitance Tolerance Rated Voltage Thickness Option Product &Plating Method Samsung Control Code Reserved For Future Use Packaging Type ●●●●●●●●●●●●CAPACITANCE TEMPERATURE CHARACTERISTICSymbol Temperature Characteristics Temperature RangeCClassⅠCOG C△0±30(ppm/℃)-55~+125℃P P2H P△-150±60R R2H R△-220±60S S2H S△-330±60T T2H T△-470±60U U2J U△-750±60L S2L S△+350~-1000AClassⅡX5R X5R±15%-55~+85℃B X7R X7R±15%-55~+125℃F Y5V Y5V+22~-82%-30~+85℃※Temperature CharacteristicTemperatureCharacteristicsBelow2.0pF 2.2~3.9pF Above4.0pF Above10pF CΔC0G C0G C0G C0GPΔ-P2J P2H P2HRΔ-R2J R2H R2HSΔ-S2J S2H S2HTΔ-T2J T2H T2HUΔ-U2J U2J U2JJ:±120PPM/℃,H:±60PPM/℃,G:±30PPM/℃●NOMINAL CAPACITANCENominal capacitance is identified by3digits.The first and second digits identify the first and second significant figures of the capacitance. The third digit identifies the multiplier.'R'identifies a decimal point.●ExampleSymbol Nominal Capacitance1R5 1.5pF10310,000pF,10nF,0.01μF104100,000pF,100nF,0.1μF●CAPACITANCE TOLERANCE Symbol Tolerance Nominal CapacitanceA ±0.05pF Less than 10pF (Including 10pF)B ±0.1pFC ±0.25pFD ±0.5pF F ±1pF F ±1%More than 10pF G ±2%J ±5%K ±10%M ±20%Z+80,-20%●RATEDVOLTAGE●THICKNESS OPTIONType Symbol Thickness(T)Spec 060330.30±0.03 100550.50±0.05 160880.80±0.102012A0.65±0.10 C0.85F 1.25±0.103216C0.85±0.15 F 1.25±0.15 H 1.6±0.203225F 1.25±0.20H 1.6I 2.0J 2.54532F 1.25±0.20H 1.6I 2.0J 2.5L 3.2±0.305750F 1.25±0.20H 1.6I 2.0J 2.5L 3.2±0.30●PRODUCT&PLATING METHODSymbol Electrode Termination Plating TypeA Pd Ag Sn_100%N Ni Cu Sn_100%G Cu Cu Sn_100%●SAMSUNG CONTROL CODE●RESERVED FOR FUTURE USESymbol Description of the codeN Reserved for future use●PACKAGING TYPE▶CAPACITANCE vs CHIP THICKNESS STANDARDDescription0603(0201)1005(0402)1608(0603)2012Type (0805)3216Type (1206)3225Type (1210)4532Type (1812)5750Type (2220)Dimension (mm)L0.6±0.03 1.0±0.05 1.6±0.1 2.0±0.13.2±0.153.2±0.2 3.2±0.34.5±0.45.7±0.4W 0.3±0.030.5±0.050.8±0.1 1.25±0.1 1.6±0.15 1.6±0.22.5±0.23.2±0.3 5.0±0.4T0.3±0.030.5~±0.050.8±0.10.65±0.10.85±0.11.25±0.10.85±0.15 1.25±0.15 1.6±0.21.25±0.2 1.6±0.22.0±0.22.5±0.21.25±0.21.6±0.22.0±0.22.5±0.21.6±0.22.0±0.22.5±0.2C A P ACIT A N CER A N G E (p F )SL 50V -0.5~2400.5~10000.5~10001100~15001600~27000.5~27003000~56006200~8200-----------C,TC (Except SL,UJ)25V 0.5~470.5~2200.5~1000--3300~82001500~36003900~68007500~10000-----100000-----50V -0.5~1800.5~10000.5~560620~10001100~33000.5~22002400~4700-560~1000011000~2200024000~47000-1000~1300015000~2200024000~4700062000~680004300093000130000C A P A C I T A N C E R A N G E (n F )A (X5R)6.3V 102202200--10000--10000---22000---47000--4700010V101001000--2200--4700~10000---22000------4700016V -47330~470--1000--4700---6800~10000-------25V --------------------50V- 6.8~10------------------B (X7R)6.3V 0.1~1047~100470~1000--1000--6800~10000---22000-------10V0.1~1033~100220~470220~270330~470560~1000-1000~330047001500~220033003900~4700----22000---16V0.1~110~33100~22068~200220~330390~1000330~6801000~15002200~33001500~220033003900~4700---2200----25V -4.7~1047~10039~6882~100150~470100~330470~620680~1000680~150018002200---1000---1000050V -0.22~4.70.22~1000.22~3947~1002201~150220390~1000 2.2~680820~1000--10~1000-----3300~4700F (Y5V)6.3V10~100-2200--10000-----47000--------10V -220~330100~1000--4700-470010000~22000---22000------10000016V -10~220100~100010~680820~10001200~22001000~22002700~4700100003300~68001000015000---22000----25V -10~3322~33010~220270~470560~1000470~10001200~22002700~33001000~33004700~10000-----10000---50V - 2.2~102.2~1002.2~6882~150180~100010~470560~1000-100~1000------10000---■PACKAGING●CARDBOARD PAPER TAPESymbol W F E P1P2P0D tABTypeD i m e n s i o n038.0±0.3 3.5±0.05 1.75±0.12.0±0.052.0±0.05 4.0±0.1Φ1.5+0.1/-00.37±0.030.38±0.030.68±0.03050.6±0.050.65+0.05/-0.1 1.15+0.05/-0.110 4.0±0.11.1MAX1.1±0.21.9±0.221 1.6±0.22.4±0.2312.0±0.23.6±0.2unit :mm●EMBOSSED PLASTIC TAPE●TAPING SIZE●REEL DIMENSIONSymbol A B CDEWtR7"Reel φ178±2.0min.φ50φ13±0.521±0.82.0±0.510±1.50.8±0.21.013"Reelφ330±2.0min.φ70unit :mmSymbol Cardboard Paper TapeEmbossed Plastic Tape7"Reel 4000200013"Reel15000-unit :pcsSize 05(0402)10(0603)21(0805)T ≤0.85mm T ≥1.0mm Quantity 50,00010,000~15,000*10,0005,000●BULK CASE PACKAGING-Bulk case packaging can reduce the stock space and transportation costs.-The bulk feeding system can increase the productivity.-It can eliminate the componentsloss.Symbol A B T C D E Dimension 6.8±0.18.8±0.112±0.1 1.5+0.1/-02+0/-0.14.7±0.1Symbol F W G H L I Dimension31.5+0.2/-036+0/-0.219±0.357±0.35110±0.75±0.35●QUANTITY*Option■CHARACTERISTIC MAP●CLASSⅠTemperature Characteristics Size VoltageCapacitance Range(㎊)SL,UJ05 (0402)50V10 (0603)50V21 (0805)50V31 (1206)50VC(COG)& TC Series03(0201)25V05(0402)25V50V10(0603)25V50V21(0805)25V50V31(1206)25V50V　32(1210)50V100V43(1812)25V50V55(2220)50V101001000100001000001000000100000001000000000.5240270082001000100010000150033004700100018022047820033001800047005604700068000100010000013000043000●CLASSⅡ,A(X5R)Temperature Characteristics Size Voltage Capacitance Range(㎊)A(X5R)0603(0201)6.3V10V1005(0402)6.3V10V16V50V1608(0603)6.3V10V16V2012(0805)6.3V10V16V3216(1206)6.3V10V16V3225(1210)6.3V10V16V4532(1812) 6.3V5750(2220)6.3V10V101001000100001000001000000100000001000000001000010000010000100000004700000220000002200000100000004700000220000004700000047000100006800100000022000001000000470000330000100000001000000068000004700000047000000220000●CLASSⅡ,B(X7R)Temperature Characteristics Size VoltageCapacitance Range(㎊)B(X7R)03(0201)6.3V10V16V05(0402)6.3V10V16V25V50V10(0603)6.3V10V16V25V50V21(0805)6.3V10V16V25V50V31(1206)6.3V10V16V　25V50V10100100010000100000100000010000000100000000100000470004700000470000100000100000047000022000010000003300000100000010000001001000010000000100000100000100100001001000680000033000100003300010000470047002204700002200002200001000004700022022000010000006800039000220100000033000010000010000001000●CLASSⅡ,B(X7R)Temperature Characteristics Size VoltageCapacitance Range(㎊)B(X7R)32(1210)6.3V10V16V25V50V43(1812)10V16V25V50V55(2220)25V50V1010010001000010000010000001000000010000000022000000100000010000470000015000002200000010000001000000047000003300000470000015000002200000680000100000022002200000●CLASSⅡ,F(Y5V)Temperature Characteristics Size VoltageCapacitance Range(㎊)F(Y5V)03(0201) 6.3V05(0402)10V16V25V50V10(0603)6.3V10V16V25V50V21(0805)6.3V10V16V25V50V31(1206)10V16V　25V50V32(1210)6.3V10V16V25V50V43(1812)16V25V50V55(2220)10V330000330001000022000010000220010000003300001000001000002200022001000000220000010000100002200000047000001000000033000001000000100000047000010000470000010000001500000033000001000000100000100000002200000010000220000100000001000000010000000022000001000000010000010000100000010000010000002200470000002200000010100100010000100000100000010000000100000000■RELIABILITY TEST DATANO ITEM PERFORMANCE TEST CONDITION 1APPEARANCE NO ABNORMAL EXTERIOR APPEARANCE THROUGH MICROSCOPE(×10)2INSULATIONRESISTANCE10,000㏁OR500㏁∙㎌PRODUCT WHICHEVER ISSMALLER(RATED VOLTAGE IS BELOW16V:10,000㏁OR100㏁∙㎌)RATED VOLTAGE SHALL BE APPLIED.MEASUREMENT TIME IS60~120RATED VOLTAGETIME60SEC.3WITHSTANDINGVOLTAGENO DIELECTRIC BREAKDOWN ORMECHANICAL BREAKDOWNCLASSⅠ:300%OF THE RATED VOLTAGE FOR1~5SEC,CLASSⅡ:250%OF THE RATED VOLTAGE FOR1~5SECIS APPLIED WITH LESS THAN50㎃CURRENT4CAPACITANCECLASSⅠWITHIN THE SPECIFIEDTOLERANCECAPACITANCE FREQUENCY VOLTAGE1,000㎊ANDBELOW1㎒±10%0.5~5VrmsMORE THAN1,000㎊1㎑±10%CLASSⅡWITHIN THE SPECIFIEDTOLERANCECAPACITANCE FREQUENCY VOLTAGE10㎌AND BELOW1㎑±10% 1.0±0.2VrmsMORE THAN10㎌120㎐±20%0.5±0.1Vrms5Q CLASSⅠOVER30㎊:Q≥1,000LESS THAN30㎊:Q≥400+20C(C:CAPACITANCE)CAPACITANCE FREQUENCY VOLTAGE1,000㎊ANDBELOW1㎒±10%0.5~5VrmsMORE THAN1,000㎊1㎑±10%6TanδCLASSⅡ1.CHAR:B2.CHAR:FCAPACITANCE FREQUENCY VOLTAGE10㎌AND BELOW1㎑±10% 1.0±0.2VrmsMORE THAN10㎌120㎐±20%0.5±0.1Vrms RATED VOLTAGE DF SPEC6.3V0.05max10V0.05max16V0.035max25V0.025max50V이상0.025max6.3V10V16V25V50V1005-0.125max0.09max(C＜220nF)0.125max(C≥220nF)0.05max0.05max16080.16max0.125max0.09max0.05max(C≤100nF)0.07max(C>100nF)0.05max20120.16max0.125max0.09max0.07max0.05max32160.16max0.125max0.09max0.07max0.05max32250.16max0.125max0.09max0.07max(C≤6.8㎌)0.09max(C>6.8㎌)0.05max45320.16max0.16max0.09max--57500.125max---*THE INITIAL VALUE OF HIGH DIELECTRIC CONSTANT SERIES SHALL BE MEASUREDAFTER THE HEAT TREATMENT OF150+0/-10℃,1Hr AND SITTING OF48±4hr AT ROOM TEMPERATURE&ROOM HUMIDITY.NO ITEM PERFORMANCE TEST CONDITION14HUMIDITY(STEADYSTATE)APPEARANCE NO MECHANICAL DAMAGE SHALL OCCUR TEMPERATURE:40±2℃RELATIVE HUMIDITY:90~95%RHTEST TIME:500+12/-0Hr.MEASURE AT ROOM TEMPERATUREAFTER COOLING FORCLASSⅠ:24±2Hr.CLASSⅡ:48±4Hr.CAPACITANCECHARACTERISTIC CAPACITANCE CHANGECLASSⅠWITHIN±5%OR±0.5㎊WHICHEVERIS LARGERCLASSⅡA,B WITHIN±12.5%F WITHIN±30%QCLASSⅠ30㎊AND OVER:Q≥35010~30㎊:Q≥275+2.5×CLESS THAN10pF:Q≥200+10×CTanδCLASSⅡINSULATIONRESISTANCEMINIMUM INSULATION RESISTANCE:1,000㏁OR50㏁∙㎌PRODUCT WHICHEVER ISSMALLER15MOISTURERESISTANCEAPPEARANCE NO MECHANICAL DAMAGE SHALL OCCUR APPLIED VOLTAGE:RATED VOLTAGETEMPERATURE:40±2℃RELATIVE HUMIDITY:90~95%RHTEST TIME:500+12/-0Hr.CURRENT APPLIED:50㎃MAX.<INITIAL MEASUREMENT>CLASSⅡSHOULD BE MEASUREDINITIAL VALUE AFTER BE HEAT-TREATEDFOR1HR IN150℃+0/-10℃AND BE LEFTFOR48±4HR AT ROOM TEMPERATURE.<LATTER MEASUREMENT>CLASSⅠSHOULD BE MEASURED AFTERLEFT FOR24±2HRS IN ROOMTEMPERATURE AND HUMIDITY.CLASSⅡSHOULD BE MEASUREDLATTER VALUE AFTER BEHEAT-TREATED FOR1HR IN150℃+0/-10℃AND BE LEFT FOR48±4HR AT ROOMTEMPERATURE.CAPACITANCECHARACTERISTIC CAPACITANCE CHANGECLASSⅠWITHIN±7.5%OR±0.75㎊WHICHEVERIS LARGERCLASSⅡA,B WITHIN±12.5%FWITHIN±30%WITHIN+30~－40%1005C>0.47μF1608C>1.0μF2012C>4.7μF3216C>10.0μF3225C>22.0μF4532C>47.0μFQCLASSⅠ30㎊AND OVER:Q≥20030㎊AND BELOW:Q≥100+10/3×CTanδCLASSⅡINSULATIONRESISTANCEMINIMUM INSULATION RESISTANCE:500㏁OR25㏁∙㎌PRODUCT,WHICHEVER IS SMALLER.CHAR.25VANDOVER16V10V 6.3V4VA,B0.050.05MAX0.05MAX0.075MAX0.1MAXF0.075MAX0.1MAX(C〈1.0㎌)0.125MAX(C≥1.0㎌)0.15MAX0.195MAX0.25MAXCHAR.25VANDOVER16V10V 6.3V4VA,B0.05MAX0.05MAX0.05MAX0.075MAX0.1MAXF0.075MAX0.1MAX(C〈1.0㎌)0.125MAX(C≥1.0㎌)0.15MAX0.195MAX0.25MAX6.3VTanδ0.125MAX*ConditionCLASSⅡ(A,B)1005C≥0.22㎌1608C≥2.2㎌2012C≥4.7㎌3216C≥10.0㎌3225C≥22.0㎌4532C≥47.0㎌5750C≥100.0㎌6.3V Tanδ0.125MAX*ConditionCLASSⅡ(A,B)1005C≥0.22㎌1608C≥2.2㎌2012C≥4.7㎌3216C≥10.0㎌3225C≥22.0㎌4532C≥47.0㎌5750C≥100.0㎌NO ITEM PERFORMANCE TEST CONDITION16HIGHTEMPERATURERESISTANCEAPPEARANCE NO MECHANICAL DAMAGE SHALL OCCURAPPLIED VOLTAGE:150%,200%OF RATED VOLTAGETEST TIME:1000+48/-0Hr.CURRENT APPLIED:50㎃MAX.<INITIAL MEASUREMENT>CLASSⅡSHOULD BE MEASURED INITIALVALUE AFTER BE HEAT-TREATED FOR1HR IN150℃+0/-10℃AND BE LEFT FOR48±4HR AT ROOM TEMPERATURE.<LATTER MEASUREMENT>CLASSⅠSHOULD BE MEASURED AFTERLEFT FOR24±2HRS IN ROOMTEMPERATURE AND HUMIDITY.CLASSⅡSHOULD BE MEASURED LATTERVALUE AFTER BE HEAT-TREATED FOR1HR IN150℃+0/-10℃AND BE LEFT FOR48±4HR AT ROOM TEMPERATURE.(TWICE OF RATED VOLTAGE WILL BEAPPLIED TO ALL SERIES BUT ABOVE)**HOWEVER,A/B는1005C≥0.22㎌SEE(FIG.3)CAPACITANCECHARACTERISTIC CAP.CHANGECLASSⅠWITHIN±3%OR±0.3㎊,WHICHEVER IS LARGERCLASSⅡA,B WITHIN±12.5%FWITHIN±30%WITHIN+30~40%1005C>0.47μF1608C>1.0μF2012C>4.7μF3216C>10.0μF3225C>22.0μF4532C>47.0μFQCLASSⅠ30㎊AND OVER:Q≥35010~30㎊:Q≥275+2.5×CLESS THAN10㎊:Q≥200+10×CTanδCLASSⅡINSULATIONRESISTANCEMINIMUM INSULATION RESISTANCE:1,000㏁OR50㏁∙㎌PRODUCTWHICHEVER IS SMALLER17TEMPERATURECYCLEAPPEARANCE NO MECHANICAL DAMAGE SHALL OCCUR CAPACITORS SHALL BE SUBJECTEDTO FIVE CYCLES OF THETEMPERATURE CYCLE AS FOLLOWINGSTEP TEMP.(℃)TIME(MIN)1MIN.RATEDTEMP.+0/-3302252~33MAX.RATEDTEMP.+3/-0304252~3MEASURE AT ROOM TEMPERATUREAFTER COOLING FORCLASSⅠ:24±2Hr.CLASSⅡ:48±4Hr.CAPACITANCECHARACTERISTIC CAP.CHANGECLASSⅠWITHIN±2.5%OR±0.25㎊WHICHEVER ISLARGERCLASSⅡA,B WITHIN±7.5%F WITHIN±20%QCLASSⅠ30㎊AND OVER:Q≥1000LESS THAN30㎊:Q≥400+20×CTanδCLASSⅡTO SATISFY THE SPECIFIEDINITIAL VALUEINSULATIONRESISTANCETO SATISFY THE SPECIFIEDINITIAL VALUECHAR.25VANDOVER16V10V 6.3V4VA,B0.05MAX0.05MAX0.05MAX0.075MAX0.1MAXF0.075MAX0.1MAX(C<1.0㎌)0.125MAX(C≥1.0㎌)0.15MAX0.195MAX0.25MAXCHAR.TEMP.CLASSⅠ125±3℃CLASSⅡA85±3℃B125±3℃F85±3℃*150%Authorization ConditionsCLASSⅡ(A,B,F)1005C>0.47μF1608C≥2.2㎌2012C≥4.7㎌3216C≥10.0㎌3225C≥22.0㎌4532C≥47.0㎌5750C≥100.0㎌■CHARACTERISTIC GRAPH▶CAPACITANCE CHANGE -AGING▶CAPACITANCE -DC VOLTAGE CHARACTERISTICS▶CAPACITANCE -TEMPERATURE CHARACTERISTICS●ELECTRICAL CHARACTERISTICS■APPLICATION MANUAL●Storage Condition▶Storage EnvironmentThe electrical characteristics of MLCCs were degraded by the environment of high temperature or humidity.Therefore,the MLCCs shall be stored in the ambient temperature and the relative humidity of less than40℃and70%,respectively.Guaranteed storage period is within6months from the outgoing date of delivery.▶Corrosive GasesSince the solderability of the end termination in MLCC was degraded by a chemical atmosphere such as chlorine,acid or sulfide gases,MLCCs must be avoid from these gases.▶Temperature FluctuationsSince dew condensation may occur by the differences in temperature when the MLCCs are taken out of storage,it is important to maintain the temperature-controlled environment.●Design of Land PatternWhen designing printed circuit boards,the shape and size of the lands must allow for theproper amount of solder on the capacitor.The amount of solder at the end terminations has a direct effect on the crack.The crack in MLCC will be easily occurred by the tensile stress which was due to too much amount of solder.In contrast,if too little solder is applied,the termination strength will be e the following illustrations as guidelines for proper land design.Recommendation of Land Shape and Size●AdhesivesWhen flow soldering the MLCCs,apply the adhesive in accordance with the following conditions.▶Requirements for AdhesivesThey must have enough adhesion,so that,the chips will not fall off or move during thehandling of the circuit board.They must maintain their adhesive strength when exposed to soldering temperature.They should not spread or run when applied to the circuit board.They should harden quickly.They should not corrode the circuit board or chip material.They should be a good insulator.They should be non-toxic,and not produce harmful gases,nor be harmful when touched.▶Application MethodIt is important to use the proper amount of adhesive.Too little and much adhesive will cause poor adhesion and overflow into the land,respectively.▶Adhesive hardening CharacteristicsTo prevent oxidation of the terminations,the adhesive must harden at160℃or less,within2minutes or less.●Mounting▶Mounting Head PressureExcessive pressure will cause crack to MLCCs.The pressure of nozzle will be300g maximum during mounting.▶Bending StressWhen double-sided circuit boards are used,MLCCs first are mounted and soldered onto one side of the board.When the MLCCs are mounted onto the other side,it is important to support the board as shown in the illustration.If the circuit board is not supported,the crack occur to the ready-installed MLCCs by the bending stress.●FluxAlthough the solderability increased by the highly-activated flux,increase of activity in flux may also degrade the insulation of the chip capacitors.To avoid such degradation,it is recommended that a mildly activated rosin flux(less than0.2%chlorine)be used.●SolderingSince a multilayer ceramic chip capacitor comes into direct contact with melted solder during soldering,it is exposed to potentially mechanical stress caused by the sudden temperature change.The capacitor may also be subject to silver migration,and to contamination by the flux.Because of these factors,soldering technique is critical.▶Soldering MethodsMethodClassificationReflow soldering-Overall heating-Infrared rays -Hot plate-VPS(vapor phase)-Local heating-Air heater -Laser-Light beamFlow soldering-Single wave -Double wave-*We recommend the reflow soldering method.▶Soldering ProfileTo avoid crack problem by sudden temperature change,follow the temperature profile in the adjacentgraph.30025020015010050℃Reflow Soldering 30025020015010050℃60~120sec 3~4secFlow Soldering▶Manual SolderingManual soldering can pose a great risk of creating thermal cracks in chip capacitors.The hotsoldering iron tip comes into direct contact with the end terminations,and operator's carelessnessmay cause the tip of the soldering iron to come into direct contact with the ceramic body of the capacitor.Therefore the soldering iron must be handled carefully,and close attention must be paid to the selection of the soldering iron tip and to temperature control of the tip.▶Amount ofSolder▶CoolingNatural cooling using air is recommended.If the chips are dipped into solvent for cleaning, the temperature difference(△T)must be less than100℃6-6.CleaningIf rosin flux is used,cleaning usually is unnecessary.When strongly activated flux is used, chlorine in the flux may dissolve into some types of cleaning fluids,thereby affecting the chip capacitors.This means that the cleaning fluid must be carefully selected,and should always be new.▶Notes for Separating Multiple,Shared PC Boards.A multi-PC board is separated into many individual circuit boards after soldering has been completed.If the board is bent or distorted at the time of separation,cracks may occur in the chip capacitors.Carefully choose a separation method that minimizes the bending of the circuit board.■CROSS REFERENCEP/N COMPANY SAMSUNG AVX JOHANSON KEMET KYOCERA MURATA NOVACAP PANASONIC ROHMTAIYO-YUDENTDK VITRAMON①COMPANY MODEL(MLCC)CL--C CM GRM-ECJ MCH MK C VJ②SIZE (EIA/JIS)0201(0603)03---0333-Z-0630603-0402(1005)050402R0704020536040201510510050402 0603(1608)100603R14060310539060311810716080603 0805(2012)210805R1508052140080522121220120805 1206(3216)311206R181********-6120633131632161206 1210(3225)321210S4112103242-2121043232532251210 1808(4520)421808R29180842-1808---45201808 1812(4532)431812S4318124343-21812-4343245321812 2220(5750)55--22205544-12221--5505650-③TEMPERATURE CHARACTERISTIC COG(NPO)C A N G CG COG/CH N C A C COG/CH A P2H(N150)P S--P P2H-P-P PH-R2H(N220)R1--R R2H-R-R RH-S2H(N330)S3--S S2H-S-S SH-T2H(N470)T O--T T2H-T-T TH-U2J(N750)U Z--U U2J-U UJ U UJ-S2L L Y--SL SL-G SL SL SL-X7R B C W R(X)X7R X7R B B C BJ X7R(B)Y(X) Z5U E E Z U-Z5U Z-E-Z5U U Y5V F G Y V Y5V Y5V Y F F F Y5V-④NOMINAL CAPACITANCE EX)103=10,000㎊221=220㎊225=2,200,000㎊=2.2㎌1R5=1.5㎊010=1㎊⑤CAPACITANCE TOLERANCE B:±0.1㎊C:±0.25㎊D:±0.5㎊F:±1%G:±2%J:±5%K:±10%M:±20%Z:-20~+80%⑥RATED VOLTAGE6.3V Q6-906 6.3-0J-J0J-10V P Z10081010-1A4L1A-16V O Y160416161601C3E1C J 25V A3250325252501E2T1E X 50V B5500550505001H5U1H A 100V C110111*********A1-2A B 200V D220122002002012D---C 250V E V--250250251---2E-500V G7501-500500501----E 630V H---630630----2J-1000V I A102-10001K102---3A G 2000V J G202-20002K202---3D-3000V K H302-30003K302---3F H 4000V-J-4000-402-----⑦TERMINATIONNICKEL BARRIER N T V C A(GRM)N-(MCH)--X Ag/Pd P1--B(GR)P-(MC)--F⑧PACKAGEBULK(VINYL)B9(NONE)-B PB*X-B B B PAPER TAPING C2,4T,R-T,L PT T E,V,W K,L T T C,P PLASTIC TAPING E1,3E,U-H,N PT-F,Y P,Q T-T,R BULK CASE P7--C PC-C C--G。

三星18650-2.0规格书

SPECIFICATION OF PRODUCTfor Lithium-ion rechargeable cellModel name : INR18650-20R MFeb. 4, 2014Samsung SDI Co., Ltd.Cell Business DivisionRevision history1. ScopeThis product specification has been prepared to specify the rechargeable lithium-ion cell ('cell') to be supplied to the customer by Samsung SDI Co., Ltd.2. Description and model2.1 Description lithium-ion rechargeable cell2.2 Model name INR18650-20R M3. Nominal specificationsthe capacity recovery rate is more than 90% of 10A discharge capacity100% is 1,950mAh at 25℃with SOC 100% after formation.4. Outline dimensionsSee the attachment (Fig. 1)Fig.1. Outline dimensions of INR18650-20RUnit : mm With tube18.33±0.0764.85± 0.155. AppearanceThere shall be no such defects as scratch, rust, discoloration, leakage whichmay adversely affect commercial value of the cell.6. Standard test conditions6.1 Environmental conditionsUnless otherwise specified, all tests stated in this specification are conducted attemperature 25±5℃and humidity 65±20%.6.2 Measuring equipment(1) Amp-meter and volt-meterThe amp-meter and volt-meter should have an accuracy of the grade 0.5mA andmV or higher.(2) Slide caliperThe slide caliper should have 0.01 mm scale.(3) Impedance meterThe impedance meter with AC 1kHz should be used.7. Characteristics7.1 Standard chargeThis "Standard charge" means charging the cell CCCV with charge current 0.5CmA(1,000mA), constant voltage 4.2V and 100mA cut-off in CV mode at 25℃for capacity..7.2 Rapid chargeRapid charge means charging the cell CCCV with charge current 4A and 100mA cut-off at 25℃7.3 Nominal discharge capacityThe standard discharge capacity is the initial discharge capacity of the cell, which ismeasured with discharge current of 400mA(0.2C) with 2.5V cut-off at 25℃within 1hour after the standard charge.Nominal discharge capacity ≥2,000mAhWhich complying to the minimum capacity of IEC61960 standard.7.4 Standard rated discharge capacityThe standard rated discharge is the discharge capacity of the cell, which is measured with discharge current of 10A with 2.5V cut-off at 25℃within 1hour after the standard charge.Standard rated discharge capacity ≥1,950mAh7.5 Initial internal impedanceInitial internal impedance measured at AC 1kHz after standard chargeInitial internal impedance ≤18mΩ7.6 Temperature dependence of discharge capacityCapacity comparison at each temperature, measured with dischargethe interval for temperature change is 3 hours.Percentage index of the discharge at 25℃at 10A (=1,950mAh) is 100%.7.7 Temperature dependence of charge capacityCapacity comparison at each temperature, measured with discharge constant current 10A and 2.5V cut-off after the standard charge is as follows.the interval for temperature change is 3 hours.Percentage index of the discharge at 25℃at 10A (=1,950mAh) is 100%.7.8 Charge rate capabilitiesDischarge capacity is measured with constant current 10A and 2.5V cut-offafter the cell is charged with 4.2V as follows..7.9 Discharge rate capabilitiesDischarge capacity is measured with the various currents in under table and 2.5Vcut-off after the standard charge.Percentage index of the discharge at 25℃at 10A (=1,950mAh) is 100%.7.10 Cycle lifeWith standard charge and maximum continuous discharge.Capacity after 250cycles,Capacity ≥1,200mAh (60% of the nominal capacity at 25℃)7.11 Storage characteristicsStandard rated discharge capacity after storage for 1 month at 60℃from the standard charged state is ≥90% of the initial 10A discharge capacity at 25℃7.12 Status of the cell as of ex-factoryThe cell should be shipped in 50 ± 5% charged state. In this case, OCV is from 3.60V to 3.80V.8. Mechanical Characteristics8.1 Drop testTest method: Cell(as of shipment or full charged) drop onto the oak-board(thickness: ≥30mm) from 1.0m height at a random direction 6 times.Criteria: No leakage, Voltage decrease≦0.025V, AC IR increase ≦1.0mΩ8.2 Vibration testTest method: As to the UN transportation regulation(UN38.3), for each axis (X and Y axis with cylindrical cells) 7Hz→200Hz→7Hz for 15min, repetition 12 times totally3hours, the acceleration 1g during 7 to 18Hz and 8g (amplitude 1.6mm) up to 200Hz.Criteria: No leakage, with less than 10mV of OCV drop9. Safety9.1 Overcharge testTest method: To charge with 20A-20V at 25℃for 2hr.Criteria: No fire, and no explosion.9.2 External short-circuit testTest method: To short-circuit the standard charged cell (or 50% discharged cell)by connecting positive and negative terminal by 50mΩwire for 10min.Criteria: No fire, and no explosion.9.3 Reverse charge testTest method: To charge the standard charged cell with charge current 10ABy 0V for 2.5 hours.Criteria: No fire, and no explosion.9.4 Heating testTest method: To heat up the standard charged cell at heating rate 5℃per minute up to 150℃and keep the cell in oven for 10 minutes.Criteria: No fire, and no explosion.10. WarrantySamsung SDI will be responsible for replacing the cell against defects or poor workmanship for 15months from the date of shipping. Any other problem caused by malfunction of the equipment or mix-use of the cell is not under this warranty.The warranty set forth in proper using and handling conditions described above and excludes in the case of a defect which is not related to manufacturing of the cell.11. Others11.1 Storage for a long timeIf the cell is kept for a long time (3 months or more), It is strongly recommendedthat the cell is preserved at dry and low-temperature.11.2 OthersAny matters that specifications do not have, should be conferred with between theboth parties.12. PackagingSee Fig.2, Package DrawingFig 2. Package DrawingProper use and handling of lithium ion cellsSee before using lithium-ion cellSupplied bySamsung SDI Co., Ltd.1. GeneralThis document has been prepared to describe the appropriate cautions and prohibitions, which the customer should take or employ when the customer usesand handles the lithium ion cell to be manufactured and supplied by Samsung SDI Co., Ltd., in order to obtain optimal performance and safety.2. Charging2.1 Charging currentCharging current shall be less than maximum charge current specified in the productspecification.2.2 Charging voltageCharging shall be done by voltage less than that specified in the product specification.2.3 Charging timeContinuous charging under specified voltage does not cause any loss of performance characteristics. However, the charge timer is recommended to be installed from asafety consideration, which shuts off further charging at time specified in the productspecification.2.4 Charging temperatureThe cell shall be charged within a range of specified temperatures in the specification.2.5 Reverse chargingThe cell shall be connected, confirming that its poles are correctly aligned.Inverse charging shall be strictly prohibited. If the cell is connected improperly, it may be damaged.3. Discharging3.1 Discharging3.1.1 The cell shall be discharged continuously at less than maximum discharge currentspecified in the product specification. In case of the higher discharge currentshould be set, it shall be discussed together with SDI.3.2 Discharging temperature3.2.1 The cell shall be discharged within a range of temperatures specified inthe product specification.3.2.2 Otherwise, it may cause loss of performance characteristics.3.3 Over-discharging3.3.1 The system should equip with a device to prevent further dischargingexceeding discharging cut-off voltage specified in the product specification.3.3.2 Over-discharging may cause loss of performance characteristics of battery.3.3.3 Over-discharging may occur by self-discharge if the battery is left fora very long time without any use.3.3.4 The charger should equip with a device to detect voltage of cell block and todetermine recharging procedures.4. Storage4.1 Storage conditions4.1.1 The cell should be stored within a range of temperatures specifiedin the product specification.4.1.2 Otherwise, it may cause loss of performance characteristics, leakage and/or rust.4.2 Long-term storage4.2.1 The cell should be used within a short period after charging becauselong-term storage may cause loss of capacity by self-discharging.4.2.2. If long-term storage is necessary, the cell should be stored at lowervoltage within a range specified in the product specification, becausestorage with higher voltage may cause more loss of performance characteristics.5. Cycle life5.1 Cycle life performance5.1.1 The cell can be charged/discharged repeatedly up to times specified inthe product specification with a certain level of capacity specified in theproduct specification.5.1.2 Cycle life may be determined by conditions of charging, discharging,operating temperature and/or storage.6. Design of system6.1 Connection between the cell and the battery6.1.1 The cell should not be soldered directly with other cells. Namely, the cellshould be welded with leads on its terminal and then be soldered withwire or leads to solder.6.1.2 Otherwise, it may cause damage of component, such as separator andinsulator, by heat generation.6.2 Positioning the battery in the system6.2.1 The battery should be positioned as possible as far from heat sourcesand high temperature components.6.2.2 Otherwise, it may cause loss of characteristics.6.2.3 The recommended spacing between the cells is more than 1mm.6.3 Mechanical shock protection of the battery6.3.1 The battery should be equipped with appropriate shock absorbers in the packin order to minimize shock, which can damage the cells.6.3.2 Otherwise, it may cause shape distortion, leakage, heat generationand/or rupture and/or open circuit.6.4 Short-circuit protection of the cell6.4.1 The cell equips with an insulating sleeve to protect short-circuit whichmay occur during transportation, battery assembly and /or system operation.6.4.2 If the cell sleeve is damaged by some cause such as outside impact,it may cause short-circuit with some wiring inside the battery.6.5 Connection between the battery and charger/system6.5.1 The battery should be designed to be connected only to the specifiedcharger and system.6.5.2 A reverse connection of the battery, even in the specified system,should be avoided by employing special battery design such asa special terminals.6.6 Pack design6.6.1 The current consumption of the battery pack should be under 10uAat sleep mode.6.6.2 Cell voltage monitoring system.The system (charger or pack) should be equipped with a device to monitor eachvoltage of cell block to avoid cell imbalance which can cause damage to the cells.6.6.4 The battery pack or system should have warning system such as overtemperature, over voltage, over current, and so on.7. Battery pack assembly7.1 Prohibition of usage of damaged cell7.1.1 The cell should be inspected visually before battery assembly.7.1.2 The cell should not be used if sleeve-damage, can-distorsion and/orelectrolyte-smell is detected.7.2 Terminals handling7.2.1 Excessive force on the negative terminal should be avoided whenexternal strip terminal is welled.7.3 Transportation7.3.1 If the cell is necessary to be transported to such as the battery manufacturer,careful precautions should be taken to avoid damage of cell.8. Others8.1 Disassembly8.1.1 The cell should not be dismantled from the battery pack.8.1.2 Internal short-circuit caused by disassembly may lead to heat generationand/or venting.8.1.3 When the electrolyte is coming in contact with the skin or eyes,flush immediately with fresh water and seek medical advice.8.2 Short-circuiting8.2.1 Short-circuit results in very high current which leads to heat generation.8.2.2 An appropriate circuitry should be employed to protect accidentalshort-circuiting.8.3 Incineration8.3.1 Incinerating and disposing of the cell in fire are strictly prohibited,because it may cause rupture and explosion.8.4 Immersion8.4.1 Soaking the cell in water is strictly prohibited, because it may causecorrosion and leakage of components to be damaged to functions8.5 Mixing use8.5.1 Different types of cell, or same types but different cell manufacturer's shall not beused, which may lead to cell imbalance, cell rupture or damage to system due tothe different characteristics of cell.8.6 Battery exchange8.6.1 Although the cell contains no environmentally hazardous component,such as lead or cadmium, the battery shall be disposed according tothe local regulations when it is disposed.8.6.2 The cell should be disposed with a discharged state to avoid heat generationby an inadvertent short-circuit.8.7 CautionThe Battery used in this device may present a risk of fire or chemical burn ifmistreated.Do not disassemble, expose to heat above 100℃or incinerate it.Replace battery with those of Samsung SDI only.Use of another battery may cause a risk of fire or explosion.Dispose of used battery promptly.Keep battery away from children.Do not disassemble and do not dispose of battery in fire.8.8 Warning – Attached▣Pack Design Guideline (For electrical design)* Current of cell which full-charging shall be terminated.** Voltage condition of BMS which shall be shut down.*** Under 1.0V voltage, do not charge the cell.**** Voltage range of cell which shall be charged by Pre-charging.If a customer’s battery pack cannot meet the requirements above,SDI cannot take responsibility for a quality issue about a battery cell.▣ Pack Design Guideline (For mechanical design)If a customer’s battery pack cannot meet the requirements above,SDI cannot take responsibility for a quality issue about a battery cell.Handling precaution and prohibitions of lithium rechargeable cells and batteriesInaccurate handling of lithium ion and lithium ion polymer rechargeable battery may cause leakage, heat, smoke, an explosion, or fire.This could cause deterioration of performance or failure. Please be sure to follow instructions carefully.1.1 StorageStore the battery at low temperature (below 20℃is recommended), low humidity, no dust and no corrosive gas atmosphere.1.2 Safety precaution and prohibitionsTo assure product safety, describe the following precautions in the instruction manual of theapplication.[ Danger!]■Electrical misusageUse dedicated charger.Use or charge the battery only in the dedicated application.Don't charge the battery by an electric outlet directly or a cigarette lighter charger.Don't charge the battery reversely.■Environmental misusageDon't leave the battery near the fire or a heated source.Don't throw the battery into the fire.Don't leave, charge or use the battery in a car or similar place where inside of temperature may be over 60℃.Don't immerse, throw, wet the battery in water / seawater.■othersDon't fold the battery cased with laminated film such as pouch and Polymer.Don't store the battery in a pocket or a bag together with metallic objects such as keys, necklaces, hairpins, coins, or screws.Don't short circuit (+) and (-) terminals with metallic object intentionally.Don't pierce the battery with a sharp object such as a needle, screw drivers.Don't heat partial area of the battery with heated objects such as soldering iron.Don't hit with heavy objects such as a hammer, weight.Don't step on the battery and throw or drop the battery on the hard floor to avoid mechanical hock.Don't disassemble the battery or modify the battery design including electric circuit.Don't solder on the battery directly.Don't use seriously scared or deformed battery.Don't put the battery into a microwave oven, dryer ,or high-pressure container.Don't use or assemble the battery with other makers' batteries, different types and/or models of batteries such as dry batteries, nickel-metal hydride batteries, or nickel-cadmium batteries.Don't use or assemble old and new batteries together.[ Warning! ]Stop charging the battery if charging isn't completed within the specified time.Stop using the battery if the battery becomes abnormally hot, order, discoloration, deformation, or abnormal conditions is detected during use, charge, or storage.Keep away from fire immediately when leakage or foul odors are detected. If liquid leaks onto your skin or cloths, wash well with fresh water immediately.If liquid leaking from the battery gets into your eyes, don't rub your eyes and wash them with clean water and go to see a doctor immediately.If the terminals of the battery become dirty, wipe with a dry cloth before using the battery.The battery can be used within the following temperature ranges. Don't exceed these ranges.Charge temperature ranges : 0℃~ 45℃Discharge Temperature ranges : -20℃~ 60℃Store the battery at temperature below 60℃Cover terminals with proper insulating tape before disposal.[ Caution! ]■Electrical misusageBattery must be charge with constant current-constant voltage (CC/CV).Charge current must be controlled by specified value in Cell specification.Cut-off Voltage of charging must be 4.2V.Charger must stop charging battery by detecting either charging time or cur rent specified in Cell’s specification.Discharge current must be controlled by specified value in Cell’s specification.Cut-off Voltage of discharging must be over 2.5V.■othersKeep the battery away from babies and children to avoid any accidents such as swallow.If younger children use the battery, their guardians should explain the proper handling method andprecaution before using.Before using the battery, be sure to read the user's manual and precaution of it's handling.Before using charger, be sure to read the user's manual of the charger.Before installing and removing the battery from application, be sure to read user's manual of theapplication.Replace the battery when using time of battery becomes much shorter than usual.Cover terminals with insulating tape before proper disposal.If the battery is needed to be stored for an long period, battery should be removed from the application and stored in a place where humidity and temperature are low.While the battery is charged, used and stored, keep it away from object materials with static electric chargers.Safety Handling Procedure for the Transporter■Quarantine : Packages that are crushed, punctured or torn open to reveal contents should not be transported. Such packages should be isolated until the shipper has been consulted,provided instructions and, if appropriate, arranged to have the product inspected andrepacked.■Spilled Product : In the event that damage to packaging results in the release of cells or batteries,the spilled products should be promptly collected and segregated and the shippershould be contacted for instructions.Design of positioning the battery pack in application and chargerTo prevent the deterioration of the battery performance caused by heat, battery shall be positioned away from the area where heat is generated in the application and the charger.Design of the Battery PackBe sure adopting proper safe device such as PTC specified type or model in Cell Specification.If you intend to adopt different safety device which is not specified in Cell Specification, please contact Samsung SDI to investigate any potential safety problem.Be sure designing 2nd protective devices such as PTC & PCM at the same time to protect Cell just in case one protective device is fault.Please contact following offices when you need any help including safety concerns. Samsung SDI emergency contact information■Samsung SDI Headquarter.150-20, Gongse-ro, Giheung-gu, Yongin-si, Gyunggi-do, KoreaTel: +82-31-8006-3100, Fax : +82-31-210-7887■Samsung SDI Cheonan Factory.467, Beonyeong-ro, Seobuk-gu, Cheonan-si, Chungcheongnam-Do, KoreaTel: +82-41-560-3114, Fax : +82-41-550-3399■Samsung SDI America Subsidiary3655 North First St. San Jose CA 95134Tel: +1-408-544-4541, Fax : +1-949-260-2221■Samsung SDI Taiwan Branch9F-1,399 Ruey Kuang Road, Neihu, Taipei, TaiwanTel: +886-2-2656-8300, Fax : +886-2-2656-8329■Samsung SDI Malaysia factory.Lot 635 & 660, Kawasan Perindustrian, Tuanku Jaafar, 71450Sungai Gadut, Negeri Sembilan Darul Khusus, MalaysiaTel: (+60)6-677-6160, 6153。

贴片电容型对照表三星国巨风华选型替代必备

贴片电容型对照表三星国巨风华选型替代必备 SANY标准化小组 #QS8QHH-HHGX8Q8-GNHHJ8-HHMHGN#风华高科电容多层片式陶瓷电容0805CG104J500NT 1 23 4 5 6 71、尺寸2、介质种类3、标称电容量（PF ）4、误差级别5、工作电压6、端头类别7、包装方式型号英寸毫米代码介质材料表示方法实际值代码误差表示方法实际电压标记端头材料标记包装 0402 * * CG COG 和NPO 100 10*100J ±5%6R3 S 纯银 T 编带0603 * * 101 10*101G ±2%100 10V C 纯铜 B 散装0805 * * 102 10*102C ±250 25V N 三层电镀 1206**500 50V三星电容多层片式陶瓷电容CL10C101JB8NNNC 1 234 5 6 7 8 9 10 11CL 表示：多层陶瓷贴片电容2、尺寸3介质种类4、标称电容量（PF ）5、误差级别6、工作电压7、厚度8端头类别型号英寸毫米代码介质材料表示方法实际值代码误差表示方法实际电压标记尺寸(mm) 标记端头材料 0402 * * C P R S T U L COG P2H R2H S2H T2H U2J S2L 100 10*100 J ±5% R 4V 3N 三层电镀 0603 * * 101 10*101 G ±2% Q 40805 * * 102 10*102 C ± P 10V 89 A C D1206**O A L B 16V25V35V50VA ？B ？ Y F XX5R X7R X7S Y5V X6SK M Z±10% ±20% +80/-20% C D E F G H I J K 100V200V 250V350V 500V 630V 1000V 2000V 3000V多层片式陶瓷电容CC ×××××× NPO × BN ×××123 45TDK型号TDK贴片电容的参数识别C 2012 X7R 1H 104 K T系列名称体积材料电压容量误差包装0603=0201 CH 0J= C= T=卷带1005=0402 COG 1A=10V D= B=袋装1608=0603 JB 1C=16V J=5%2012=0805 JF 1E=25V K=10%3216=1206 X7R 1H=50V M=20%3225=1210 X5R 2A=100V Z=+80-20% 4532=1812 Y5V 2E=250V5650=2220 2J=630V4520=1808 3A=1KV3D=2KV3F=3KV。

三星电容全系列规格书

March 2009MULTILAYERCERAMIC CAPACITORSAll information indicated in this catalog is as of March. 2009The specifications and designs contained herein may be subject to change without notice.Passive components Sales OfficeHead Office206, Cheomdansaneop Road,Youngtong-gu,Suwon, Kyonggi Province 443-743, KoreaEuropeTel:+82-31-210-6328E-mail:james.pyun@ AmericaTel:+82-31-210-6794E-mail:randy.kim@ AsiaTel:+82-31-210-5348E-mail:koogi@ DomesticTel:+82-31-210-3757E-mail:southjoy@Manufacturing SiteSuwon Plant (Korea)206 Cheomdansaneop Road, Youngtong -gu,Suwon, Kyonggi Province 443-743, KoreaTel:+82-31-210-6794E-mail:randy.kim@ Busan Plant (Korea)1623-2, Songjeong -dong,Kangseo -gu, Busan 618-270, Korea Tel:+82-51-970-7671E-mail:kyc.kweon@ Tianjin Plant (China)27, Heiniucheng -Road, Hexi District,Tianjin, China 300210Tel:+86-22-2830-3333(3450)E-mail:gk.ryu@ Philippines Plant (Philippines)Calamba Premiere International Park, Batino, Calamba, Laguna, Manila Tel:+63-2-809-2873E-mail:ksj1445@Asia sales officeShanghai OfficeRm 1408 Shanghai international trade center No 2200 Yan an (W )RD Shanghai China 200335Te l:86-21-6270-4168(274)E-mail:dennis.cha@ Shenzhen OfficeRm 4501, 45/F, New World Center,Yitian Road, Futian District,Shenzhen, China 518026Te l:86-755-8608-5581E-mail:jackson.xian@ Qingdao OfficeRm 1201. Growne Plaza Qingdao;76XiangGangZhong Rd, Qingdao;266071P.R. ChinaTe l:86-532-5779102E-mail:zhengguo.cui@ HongKong OfficeSuite 4511, Two int’l Finance Centre,8 Finance Street, Central, Hongkong Te l:852-2862-6350E-mail:vinsent.chou@ Singapore Office3 Church Street Samsung Hub #23-02 Singapore 049483Te l:(65)6833-3228E-mail:winson.yeong@ Thai OfficeWellgrow Industrial Estate,93 Moo 5 T. Bangsamak, A.Bangpakong Chachoengsao 24180 Thailand Te l:66-38-562-026E-mail:sbimm@ Taiwan Office399 9F -1, Ruey Kuang Rd., Neihu, Taipei, TaiwanTe l:886-2-2656-8356E-mail:kevin0130.wang@America sales officeIrvine Office3345 Michelson Drive,Suite 350,Irvine, CA 92612Tel:1-949-797-8047E-mail:sh386.kim@Europe sales officeFrankfurt Office Samsung hausAm Kronberger Hang 6D-65824 Schwalbach/Ts.Tel:49-6196-66-7255FAX:49-(0)6196-66-7755E-mail:frank.goebel@ Hungary OfficeH2310, Szigetszentmiklos, Leshegy u.2-4, HungaryTel:36-24-551-148E-mail:jun21c.lee@Domestic DistributorsKORCHIP INC#219-8 Gasan -dong, Gumchun -gu,Seoul, KoreaTel:+82-2-838-5588E-mail:hjh0064@ CHUNG HAN#16-96 Hangang -lo 3, Youngsan -Gu,Seoul, KoreaTel:+82-2-718-3322E-mail:bu1230choi@ SAMTDaekyung Bldg.,Daechi-Dong,Gangnam -Gu, Seoul, Korea Tel:+82-2-3458-9000E-mail:info@ CHUNGMAC#53-5 Wonhyolo3 Youngsan -gu, Seoul, KoreaTel:+82-2-716-6428~9E-mail:webmaster@anycam.co.kr APEXINTRoom #905. C -dong Woorimlion ,s,Valley 371-28, Gasan-dong,Guemcheon-Gu, Seoul, Korea Tel:+82-2-2026-2610(2)E-mail:info@apexint.co.krWe, Samsung, declare that our component MLCC is produced in accordance with EU RoHS directive.1.RoHS Compliance and restriction of BrThe following restricted materials are not used in packaging materials as well as products in compliance with the law and restriction.- Cd, Pb, Hg, Cr+6, As, Br and the compounds, PCB, asbestos- Bromic materials : PBBs, PBBOs, PBDO, PBDE, PBB2.No use of materials breaking Ozone layerThe following ODS materials are not used in our fabrication process.- ODS material : Freon, Haron, 1-1-1 TCE, CCl4, HCFCIf you want more detailed Information,Please Visit Samsung Electro-mechanics Website CONTENTSPart NumberingSystem4628353950525558627983GeneralCapacitorsUltra HighCapacitorsSuper SmallCapacitorsHigh VoltageCapacitorsCamera StrobeCircuit CapacitorsArray TypeCapacitorsLow ESLCapacitorsApplication Manualfor Surface MountingPackagingSpecificationPremium Capacitorsfor AutomotiveApplicationsReliability TestConditionPart Numbering SystemFeature Capacitance Table (General Capacitors)GeneralCapacitorsCapacitance Table (General Capacitors)Capacitance Table (General Capacitors)GeneralCapacitorsCapacitance Table (General Capacitors)Capacitance Table (General Capacitors)GeneralCapacitorsCapacitance Table (General Capacitors)Capacitance Table (General Capacitors)GeneralCapacitorsProduct Line Up (General Capacitors)Product Line Up (General Capacitors)GeneralCapacitorsCL10 R82CB8ANNCL10 010CB8ANNCL10 1R2CB8ANNCL10 1R5CB8ANNCL10 1R8CB8ANNCL10 020CB8ANNCL10 2R2CB8ANNCL10 2R7CB8ANNCL10 030CB8ANNCL10 3R3CB8ANNCL10 3R9CB8ANNCL10 040CB8ANNCL10 4R7CB8ANNCL10 050DB8ANNCL10 5R6DB8ANNCL10 060DB8ANNCL10 6R8DB8ANNCL10 070DB8ANNCL10 080DB8ANNCL10 8R2DB8ANNCL10 090DB8ANNCL10 100JB8NNNCL10 100J B8ANNCL10 120JB8NNNCL10 120JB8ANNCL10 150JB8NNNCL10 150JB8ANNCL10 180JB8NNNCL10 180J B8ANNCL10 220JB8NNNCL10 220JB8ANNCL10 270JB8NNNCL10 270JB8ANNCL10 330JB8NNNCL10 330JB8ANN0.821.001.201.501.802.002.202.703.003.303.904.004.705.005.606.006.807.008.008.209.0010101212151518182222272733330.25pF0.25pF0.25pF0.25pF0.25pF0.25pF0.25pF0.25pF0.25pF0.25pF0.25pF0.25pF0.25pF0.5pF0.5pF0.5pF0.5pF0.5pF0.5pF0.5pF0.5pF5%5%5%5%5%5%5%5%5%5%5%5%5%5%50505050505050505050505050505050505050505050505050505050505050505050500.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.90Part NumberThicknessMax. (mm)RatedVoltage(Vdc)CapacitanceToleranceCapacitance(pF)C P R S T U LSize L W (1.6 0.8mm)C0G P2H R2H S2H T2H U2J S2LCL10 390JB8NNNCL10 390JB8ANNCL10 470JB8NNNCL10 470JB8ANNCL10 560JB8NNNCL10 560JB8ANNCL10 680JB8NNNCL10 680JB8ANNCL10 820JB8NNNCL10 820JB8ANNCL10 101JB8NNNCL10 101JB8ANNCL10 121JB8NNNCL10 121JB8ANNCL10 151JB8NNNCL10 151JB8ANNCL10 181JB8NNNCL10 181JB8ANNCL10 221JB8NNNCL10 221JB8ANNCL10 271JB8NNNCL10 271JB8ANNCL10 331JB8NNNCL10 331JB8ANNCL10 391JB8NNNCL10 471JB8NNNCL10 471JB8ANNCL10 561JB8NNNCL10 681JB8NNNCL10 681JB8ANNCL10 821JB8NNNCL10 102JB8NNNCL10 122JB8NNNCL10 222JB8NNNCL10 332JA8NNN3939474756566868828210010012012015015018018022022027027033033039047047056068068082010001200220033005%5%5%5%5%5%5%5%5%5%5%5%5%5%5%5%5%5%5%5%5%5%5%5%5%5%5%5%5%5%5%5%5%5%5%50505050505050505050505050505050505050505050505050505050505050505050250.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.90Part NumberThicknessMax. (mm)RatedVoltage(Vdc)CapacitanceToleranceCapacitance(pF)C P R S T U LSize L W (1.6 0.8mm)C0G P2H R2H S2H T2H U2J S2LProduct Line Up (General Capacitors)Product Line Up (General Capacitors)GeneralCapacitorsCL21 560JBANNNCL21 680JBANNNCL21 820JBANNNCL21 101JBANNNCL21 101JBAANNCL21 121JBANNNCL21 151JBANNNCL21 181JBANNNCL21 221JBANNNCL21 271JBANNNCL21 331JBANNNCL21 331JBAANNCL21 391JBANNNCL21 471JBANNNCL21 471JBAANNCL21 561JBANNNCL21 821JBCNNNCL21 821JBAANNCL21 102JBCNNNCL21 122JBFNNNCL21 152JBFNNNCL21 182JBFNNNCL21 222JBFNNNCL21 332JAFNNNCL21 332JBFNNNCL21 392JBFNNNCL21 472JAFNNNCL21 472JBFNNNCL21 562JBFNNNCL21 103JBFNNN56688210010012015018022027033033039047047056082082010001200150018002200330033003900470047005600100005%5%5%5%5%5%5%5%5%5%5%5%5%5%5%5%5%5%5%5%5%5%5%5%5%5%5%5%5%5%5050505050505050505050505050505050505050505050255050255050500.750.750.750.750.750.750.750.750.750.750.750.750.750.750.750.750.950.750.951.351.351.351.351.351.351.351.351.351.351.35Part NumberThicknessMax. (mm)RatedVoltage(Vdc)CapacitanceToleranceCapacitance(pF)C P R S T U LSize L W (2.0 1.25mm)C0G P2H R2H S2H T2H U2J S2LCL21 R47CBAANNCL21 0R5CBAANNCL21 R68CBAANNCL21 R82CBAANNCL21 010CBAANNCL21 1R2CBAANNCL21 1R5CBAANNCL21 1R8CBAANNCL21 020CBAANNCL21 2R2CBAANNCL21 2R7CBAANNCL21 030CBAANNCL21 3R3CBAANNCL21 3R9CBAANNCL21 040CBAANNCL21 4R7CBAANNCL21 050DBAANNCL21 5R6DBAANNCL21 060DBAANNCL21 6R8DBAANNCL21 070DBAANNCL21 080DBAANNCL21 8R2DBAANNCL21 090DBAANNCL21 100JBANNNCL21 100J BAANNCL21 120JBANNNCL21 120J BAANNCL21 150JBANNNCL21 180J BANNNCL21 220JBANNNCL21 270JBANNNCL21 330JBANNNCL21 390JBANNNCL21 470JBANNN0.470.500.680.821.001.201.501.802.002.202.703.003.303.904.004.705.005.606.006.807.008.008.209.0010101212151822273339470.25pF0.25pF0.25pF0.25pF0.25pF0.25pF0.25pF0.25pF0.25pF0.25pF0.25pF0.25pF0.25pF0.25pF0.25pF0.25pF0.5pF0.5pF0.5pF0.5pF0.5pF0.5pF0.5pF0.5pF5%5%5%5%5%5%5%5%5%5%5%50505050505050505050505050505050505050505050505050505050505050505050500.750.750.750.750.750.750.750.750.750.750.750.750.750.750.750.750.750.750.750.750.750.750.750.750.750.750.750.750.750.750.750.750.750.750.75Part NumberThicknessMax. (mm)RatedVoltage(Vdc)CapacitanceToleranceCapacitance(pF)C P R S T U LSize L W (2.0 1.25mm)C0G P2H R2H S2H T2H U2J S2LProduct Line Up (General Capacitors)Product Line Up (General Capacitors)GeneralCapacitorsProduct Line Up (General Capacitors)Product Line Up (General Capacitors)GeneralCapacitorsProduct Line Up (General Capacitors)Product Line Up (General Capacitors)GeneralCapacitorsProduct Line Up (General Capacitors)Product Line Up (General Capacitors)GeneralCapacitorsProduct Line Up (General Capacitors)Product Line Up (General Capacitors)GeneralCapacitorsUltra HighCapacitorsCapacitance Table (Ultra High Capacitors)Capacitance Table (Ultra High Capacitors)Ultra HighCapacitorsCL10F225ZP8NNNCL21F106ZPFNNNCL31F226ZPHNNNCL32F226ZPJNNNCL05F105ZQ5NNNCL10F475ZQ8NNNCL32F107ZQJNNNY5V(EIA)Y5V(EIA)Y5V(EIA)Y5V(EIA)Y5V(EIA)Y5V(EIA)Y5V(EIA)2.21022221.04.710080%/-20%80%/-20%80%/-20%80%/-20%80%/-20%80%/-20%80%/-20%101010106.36.36.30.901.351.802.700.550.902.70-82~+22%(-30~+85 )-82~+22%(-30~+85 )-82~+22%(-30~+85 )-82~+22%(-30~+85 )-82~+22%(-30~+85 )-82~+22%(-30~+85 )-82~+22%(-30~+85 )1.60 0.802.00 1.253.20 1.603.20 2.501.00 0.501.60 0.803.20 2.50Part NumberThicknessMax. (mm)RatedVoltage(Vdc)CapacitanceToleranceCapacitanceTCCodeTemperatureCharacteristicsSize L W(mm)mark means packaging code. If you want to learn the code or quantity in detail, please see p 81.Small chip size03 Series(C0G) MLCC shows very low ESR valae.02 and 03 Series are suited to only reflow soldering02 and 03 Series are suited to miniature RF module,portable equipment and high frequency circuitVCO, Tuner, RF ModuleMCM ModuleMobile phone, Wireless LAN, Note PCFor using special purpose like Military, Medical, Aviation, Automobile device should be following a special specification.FeatureApplicationStructure and DimensionsCodeEIACode L W T BWDimension(mm)0.3 0.030.3 0.030.6 0.0302010.15 0.05030.2 0.020.2 0.020.4 0.02010050.07~0.1402CL21X106KAYNNNCL31X106KAHNNNCL21X106KOYNNNCL21X106KPCLNNCL05X105KQ5NNNCL10X105KQ8NNNCL21X225KQFNNNCL21X475KQFNNNCL10X106KQ8NNNCL21X106KQQNNNCL31X106KQHNNNCL21X226KQQNNNCL21X106KRCLNNCL31B475KAHNNNCL31B106KAHNNNCL31B475KOHNNNCL31B106KOHNNNCL21B225KQFNNNCL21B225KPFNNNCL21B106KQQNNNCL31B106KQHNNNCL32B226KQJNNNX6S(EIA)X6S(EIA)X6S(EIA)X6S(EIA)X6S(EIA)X6S(EIA)X6S(EIA)X6S(EIA)X5R(EIA)X6S(EIA)X6S(EIA)X6S(EIA)X6S(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)101010101.01.02.24.710101022104.7104.7102.22.210102210%10%10%10%10%10%10%10%10%10%10%10%10%10%10%10%10%10%10%10%10%10%252516106.36.36.36.36.36.36.36.342525161610106.36.36.31.451.801.450.950.550.901.351.350.901.401.801.400.951.801.801.801.801.351.351.351.802.7022%(-55~+105 )22%(-55~+105 )22%(-55~+105 )22%(-55~+105 )22%(-55~+105 )22%(-55~+105 )22%(-55~+105 )22%(-55~+105 )15%(-55~+85 )22%(-55~+105 )22%(-55~+105 )22%(-55~+105 )22%(-55~+105 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )2.00 1.253.20 1.602.00 1.252.00 1.251.00 0.501.60 0.802.00 1.252.00 1.251.60 0.802.00 1.253.20 1.602.00 1.252.00 1.253.20 1.603.20 1.603.20 1.603.20 1.602.00 1.252.00 1.252.00 1.253.20 1.603.20 2.50Part NumberThicknessMax. (mm)RatedVoltage(Vdc)CapacitanceToleranceCapacitanceTCCodeTemperatureCharacteristicsSize L W(mm)Product Line Up (Ultra High Capacitors)Super SmallCapacitorsSuper Small CapacitorsProduct Line Up (Super Small Size Capacitors)FeatureHigh VoltageCapacitorsHigh Voltage CapacitorsCapacitance Table (High Voltage Capacitors)Capacitance Table (High Voltage Capacitors)High VoltageCapacitorsCapacitance Table (High Voltage Capacitors)Product Line Up (High Voltage Capacitors)High VoltageCapacitorsProduct Line Up (High Voltage Capacitors)Product Line Up (High Voltage Capacitors)High VoltageCapacitorsCL31B222KGFNNNCL31B332KGFNNNCL31B472KGFNNNCL31B682KGFNNNCL31B103KGFNNNCL32B153KGFNNNCL32B223KGFNNNCL43B473KGFNNNCL43B104KG INNNCL21B153KEFNNNCL31B473KEHNNNCL32B104KE J NNNCL43B474KE JNNNCL21B221KDCNNNCL21B331KDCNNNCL31B471KDCNNNCL21B102KDCNNNCL21B222KDCNNNCL31B222KDCNNNCL21B472KDCNNNCL31B472KDCNNNCL21B103KDCNNNCL31B153KDCNNNCL31B223KDCNNNCL31B333KDFNNNCL31B473KDFNNNCL32B473KDHNNNCL31B104KDHNNNCL43B104KDFNNNCL21B221KCANNNCL21B471KCANNNCL10B102KC8NNNCL21B102KCANNNCL21B222KCANNNCL21B332KCANNNX7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)2.23.34.76.81015224710015471004700.220.330.471.02.22.24.74.71015223347471001000.220.471.01.02.23.310%10%10%10%10%10%10%10%10%10%10%10%10%10%10%10%10%10%10%10%10%10%10%10%10%10%10%10%10%10%10%10%10%10%10%5005005005005005005005005002502502502502002002002002002002002002002002002002002002002001001001001001001001.351.351.351.351.351.351.351.352.201.351.802.802.801.001.001.001.001.001.001.001.001.001.001.001.351.351.801.801.350.750.750.900.750.750.7515%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )3.20 1.603.20 1.603.20 1.603.20 1.603.20 1.603.20 2.503.20 2.504.50 3.204.50 3.202.00 1.253.20 1.603.20 2.504.50 3.202.00 1.252.00 1.253.20 1.602.00 1.252.00 1.253.20 1.602.00 1.253.20 1.602.00 1.253.20 1.603.20 1.603.20 1.603.20 1.603.20 2.503.20 1.604.50 3.202.00 1.252.00 1.251.60 0.802.00 1.252.00 1.252.00 1.25Part NumberThicknessMax. (mm)RatedVoltage(Vdc)CapacitanceToleranceCapacitanceTCCodeTemperatureCharacteristicsSize L W(mm)Product Line Up (High Voltage Capacitors)Product Line Up (High Voltage Capacitors)CL10B472KC8NNNCL21B472KCANNNCL21B682KCANNNCL10B103KC8NNNCL21B103KCANNNCL32B103KCFNNNCL21B153KCCNNNCL31B153KCCNNNCL21B223KCFNNNCL31B223KCCNNNCL31B333KCCNNNCL21B473KCFNNNCL31B473KCCNNNCL31B104KCFNNNCL31B154KCHNNNCL32B154KCFNNNCL32B224KCHNNNCL43B224KCFNNNCL32B334KCHNNNCL43B334KCFNNNCL32B474KCI NNNCL43B474KCHNNNCL31B105KCHNNNCL32B105KCJNNNCL43B105KCJNNNCL55B105KCHNNNX7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)4.74.76.8101010151522223347471001501502202203303304704701.01.01.01.010%10%10%10%10%10%10%10%10%10%10%10%10%10%10%10%10%10%10%10%10%10%10%10%10%10%1001001001001001001001001001001001001001001001001001001001001001001001001001000.900.750.750.900.751.351.001.001.351.001.001.351.001.351.801.351.801.351.801.352.201.801.802.802.801.8015%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )15%(-55~+125 )1.60 0.802.00 1.252.00 1.251.60 0.802.00 1.253.20 2.502.00 1.253.20 1.602.00 1.503.20 1.603.20 1.602.00 1.253.20 1.603.20 1.603.20 1.603.20 2.503.20 2.504.50 3.203.20 2.504.50 3.203.20 2.504.50 3.203.20 1.603.20 2.504.50 3.205.70 5.00Part NumberThicknessMax. (mm)RatedVoltage(Vdc)CapacitanceToleranceCapacitanceTCCodeTemperatureCharacteristicsSize L W(mm)mark means packaging code. If you want to learn the code or quantity in detail, please see p 81.High VoltageCapacitorsCodeEIACodeL W T BWDimension(mm)0.85(0.15)1.10(0.15)1.60(0.20)0.500.3/-0.33.200.20 1.600.20120631Suitable for the trigger of the flash circuitHighly reliable performanceSuperior in bias characteristicsSoft termination with a Ni/Sn plated overcoatStrobe Circuit FeatureApplicationStructure and DimensionCapacitance Table (Camera Strobe Circuit Capacitors)Camera StrobeCircuit CapacitorsFeature Capacitance TableArray TypeCapacito rsProduct Line Up (Array Type Capacitors)FeatureLow ESLCapacitorsCapacitance Table (Low ESL Capacitors)Product Line Up (Low ESL Capacitors)Low ESL CapacitorsReliability TestConditionReliability Test ConditionPremium Capacitors for Automotive ApplicationsPart Numbering System (Automotive Capacitors)Premium Capacitorsfor AutomotiveApplicationsFeatureCapacitance Table (Automotive Capacitors)Premium Capacitorsfor AutomotiveApplicationsProduct Line Up (Automotive Capacitors)Product Line Up (Automotive Capacitors)Premium Capacitorsfor AutomotiveApplicationsProduct Line Up (Automotive Capacitors)CL21C221JC6*PN CL21C331JC6*PN CL21C471JCC *PN CL21C681JCC *PN CL21C102JCC *PN CL21C102JCF *PN CL21C122JBC *PN CL21C152JBC *PN CL21C182JBC *PN CL21C222JBC *PN CL21C272JBC *PN CL21C332JBC *PN CL21C392JBC *PN CL21C472JBC *PN CL21C562JBC *PN CL21C122JBF *PN CL21C152JBF *PN CL21C182JBF *PN CL21C222JBF *PN CL21C272JBF *PN CL21C332JBF *PN CL21C392JBF *PN CL21C472JBF *PN CL21C562JBF *PN CL21C682JBF *PN CL21C822JBF *PN CL21C103JBF *PNC0G(EIA)C0G(EIA)C0G(EIA)C0G(EIA)C0G(EIA)C0G(EIA)C0G(EIA)C0G(EIA)C0G(EIA)C0G(EIA)C0G(EIA)C0G(EIA)C0G(EIA)C0G(EIA)C0G(EIA)C0G(EIA)C0G(EIA)C0G(EIA)C0G(EIA)C0G(EIA)C0G(EIA)C0G(EIA)C0G(EIA)C0G(EIA)C0G(EIA)C0G(EIA)C0G(EIA))220 330 470680 1.0 1.0 1.21.5 1.82.2 2.73.3 3.94.75.6 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.66.8 8.2 10.05% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 5%1001001001001001005050505050505050505050505050505050505050500.700.700.950.950.951.350.950.950.950.950.950.950.950.950.951.351.351.351.351.351.351.351.351.351.351.351.3530ppm/ (-55~+125 ) 30ppm/ (-55~+125 ) 30ppm/ (-55~+125 ) 30ppm/ (-55~+125 ) 30ppm/ (-55~+125 ) 30ppm/ (-55~+125 ) 30ppm/ (-55~+125 ) 30ppm/ (-55~+125 ) 30ppm/ (-55~+125 ) 30ppm/ (-55~+125 ) 30ppm/ (-55~+125 ) 30ppm/ (-55~+125 ) 30ppm/ (-55~+125 ) 30ppm/ (-55~+125 ) 30ppm/ (-55~+125 ) 30ppm/ (-55~+125 ) 30ppm/ (-55~+125 ) 30ppm/ (-55~+125 ) 30ppm/ (-55~+125 ) 30ppm/ (-55~+125 ) 30ppm/ (-55~+125 ) 30ppm/ (-55~+125 ) 30ppm/ (-55~+125 ) 30ppm/ (-55~+125 ) 30ppm/ (-55~+125 ) 30ppm/ (-55~+125 )30ppm/ (-55~+125 )2.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.25Part Number Thickness Max. (mm)RatedVoltage (Vdc)Capacitance Tolerance CapacitanceTC CodeTemperature CharacteristicsSize L W(mm)Premium Capacitors for Automotive Applications Capacitance Table (Automotive Capacitors)*mark means design code. If you want more information , Please check with our sales representatives or product engineers. mark means packaging code. If you want to learn the code or quantity in detail, please see p 81.CL10B473KO8*PN CL10B683KO8*PN CL10B104KO8*PN CL10B103KA8*PN CL10B153KA8*PN CL10B223KA8*PN CL10B333KA8*PN CL10B473KA8*PN CL10B683KA8*PN CL10B104KA8*PN CL10B102KB8*PN CL10B152KB8*PN CL10B222KB8*PN CL10B332KB8*PN CL10B472KB8*PN CL10B682KB8*PN CL10B103KB8*PN CL10B153KB8*PN CL10B223KB8*PN CL10B333KB8*PN CL10B473KB8*PN CL10B683KB8*PN CL10B104KB8*PN CL10B102KC8*PN CL10B152KC8*PN CL10B222KC8*PN CL10B332KC8*PN CL10B472KC8*PN CL10B682KC8*PN CL10B103KC8*PN CL10B221KC8*PN CL10B331KC8*PN CL10B471KC8*PNCapacitance Product Line Up (Automotive Capacitors)Part Number ThicknessMax. (mm)0.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.900.90Capacitance Tolerance Size L W (mm)RatedVoltage(Vdc)Temperature CharacteristicsTC Code10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10%47 68 100 10 15 22 33 47 68 100 1.0 1.5 2.2 3.3 4.7 6.8 10 15 22 33 47 68 100 1.0 1.5 2.2 3.3 4.7 6.8 10 220 330 4701.60 0.801.60 0.801.60 0.801.60 0.801.60 0.801.60 0.801.60 0.801.60 0.801.60 0.801.60 0.801.60 0.801.60 0.801.60 0.801.60 0.801.60 0.801.60 0.801.60 0.801.60 0.801.60 0.801.60 0.801.60 0.801.60 0.801.60 0.801.60 0.801.60 0.801.60 0.801.60 0.801.60 0.801.60 0.801.60 0.801.60 0.801.60 0.801.60 0.80X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 )1616162525252525252550505050505050505050505050100100100100100100100100100100Premium Capacitors for Automotive Applications CL10B681KC8*PN CL21B104KOC *PN CL21B154KOF *PN CL21B224KOF *PN CL21B334KOF *PN CL21B474KOF *PN CL21B473KAC *PN CL21B683KAC *PN CL21B104KAC *PN CL21B154KAF *PN CL21B224KAF *PN CL21B334KAF *PN CL21B474KAF *PN CL21B102KB6*PN CL21B152KB6*PN CL21B222KB6*PN CL21B332KB6*PN CL21B472KB6*PN CL21B682KB6*PN CL21B103KB6*PN CL21B153KB6*PN CL21B223KB6*PN CL21B333KBC *PN CL21B473KBC *PN CL21B683KBC *PN CL21B104KBC *PN CL21B104KBF *PN CL21B154KBF *PN CL21B224KBF *PN CL21B334KBF *PN CL21B474KBF *PN CL21B102KC6*PN CL21B152KC6*PNCapacitance Product Line Up (Automotive Capacitors)Part Number ThicknessMax. (mm)0.900.951.351.351.351.350.950.950.951.351.351.351.350.700.700.700.700.700.700.700.700.700.950.950.950.951.351.351.351.351.350.700.70Capacitance Tolerance Size L W (mm)RatedVoltage(Vdc)Temperature CharacteristicsTC Code10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10%680 100 150 220 330 470 47 68 100 150 220 330 470 1.0 1.5 2.2 3.3 4.7 6.8 10 15 22 33 47 68 100 100 150 220 330 470 1.0 1.51.60 0.802.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.252.00 1.25X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)X7R(EIA)15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 ) 15%(-55~+125 )100161616161625252525252525505050505050505050505050505050505050100100*mark means design code. If you want more information , Please check with our sales representatives or product engineers. mark means packaging code. If you want to learn the code or quantity in detail, please see p 81.*mark means design code. If you want more information , Please check with our sales representatives or product engineers. mark means packaging code. If you want to learn the code or quantity in detail, please see p 81.。

三星0603 22uf电容规格书

三星0603 22uf电容规格书三星0603 22uf电容规格书的解读与应用一、引言在现代电子产品中，电容作为一种重要的被动元件，在电路中扮演着储存电荷、滤波、耦合等重要作用。

而三星0603 22uf电容规格书作为电容的一种，其规格书所包含的信息对于电子工程师和电子爱好者来说是至关重要的。

在本篇文章中，我们将深度解读三星0603 22uf电容规格书的内容，并探讨其在电路设计和应用中的重要性。

二、三星0603 22uf电容规格书的解读1. 产品型号：三星0603 22uf电容规格书所指代的产品型号为0603，22uf。

其中，0603代表了电容的封装尺寸，而22uf则代表了电容的容量大小。

理解这一点对于正确选型和应用至关重要。

2. 规格参数：在规格书中，通常包含了电容的电压值、容差、温度特性等重要参数。

在选型过程中，需要根据具体的电路要求和环境条件来选择合适的规格参数，以确保电路稳定性和性能。

3. 使用注意事项：在规格书中，也会包含一些使用注意事项和贮存条件，这些信息对于保证电容性能和寿命至关重要。

在使用和贮存过程中需要严格按照规格书要求进行操作。

三、三星0603 22uf电容在电路设计和应用中的重要性作为一种常见的电容型号，三星0603 22uf电容在电路设计和应用中扮演着重要的角色。

由于其封装尺寸小巧，适合于电子产品的迷你化设计，因此在手机、平板等智能设备中得到了广泛应用。

22uf的较大容量可以满足一些对电荷储存和稳压要求较高的电路，例如稳压电路、滤波电路等。

在电子产品设计中，正确选用和应用三星0603 22uf电容对于提高电路性能和稳定性具有重要意义。

四、对三星0603 22uf电容的个人观点和理解在我看来，三星0603 22uf电容作为一种电子元件，其规格书所包含的信息对于电子工程师和电子爱好者来说是非常重要的。

通过深入了解其规格书的内容，可以更好地应用于实际电路设计中，并确保电路工作的稳定性和性能。

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The following ODS materials are not used in our fabrication process. - ODS material : Freon, Haron, 1-1-1 TCE, CCl4, HCFC If you want more detailed Information,Please Visit Samsung Electro-mechanics Website
All information indicated in this catalog is as of october. 2008 The specifications and designs contained herein may be subject to change without notice.
Packaging Specification
80
Packaging Specification
Application Manual for Surface Mounting
84
Application Manual for Surface Mounting
Please, see the last page of this catalog for our environ mental certification list.
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Europe sales office
Frankfurt Office Samsung haus Am Kronberger Hang 6 D-65824 Schwalbach/Ts. Te l:49 - 6196 - 66 - 7255 FAX:49-(0)6196-66-7755 E-mail:frank.goebel@ Hungary Office H2310, Szigetszentmiklos, Leshegy u. 2-4, Hungary Te l:36-24-551-148 E-mail:jun21c.lee@
October 2008
Passive components Sales Office
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Head Office
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Asia sales office
Shanghai Office Rm 1408 Shanghai international trade center No 2200 Yan an(W) RD Shanghai China 200335 Te l:86 - 21- 6270 - 4168(274) E-mail:dennis.cha@
206, Cheomdansaneop Road, Youngtong-gu, Suwon, Kyonggi Province 443- 743, Korea Europe Te l: +82-31-210 -6328 E-mail:james.pyun@ America Te l: +82- 31- 210 - 6794 E-mail:randy.kim@ Asia Te l: +82 - 31- 210 - 5348 E-mail:koogi@ Domestic Te l: +82- 31- 210 - 3757 E-mail:southjoy@
We, Samsung, declare that our component MLCC is produced in accordance with EU RoHS directive.
1. RoHS Compliance and restriction of Br
The following restricted materials are not used in packaging materials as well as products in compliance with the law and restriction. - Cd, Pb, Hg, Cr+6, As, Br and the compounds, PCB, asbestos - Bromic materials : PBBs, PBBOs, PBDO, PBDE, PBB
CONTENTS
Part Numbering System
4
Part Numbering System
General Capacitors
6
General Capacitors
Ultra High Capacitors
28
Ultra High Capacitors
Super Small Capacitors
Domestic Distributors
KORCHIP INC #219 - 8 Gasan - dong, Gumchun - gu, Seoul, Korea Te l: +82 - 2 - 838 - 5588 E-mail:hjh0064@ CHUNG HAN #16-96 Hangang - lo 3, Youngsan - Gu, Seoul, Korea Te l: +82 - 2 - 718 - 3322 E-mail:bu1230choi@ SAMT Daekyung Bldg.,Daechi-Dong, Gangnam- Gu, Seoul, Korea Te l: +82- 2- 3458- 9000 E-mail:info@ CHUNGMAC #53-5 Wonhyolo3 Youngsan- gu, Seoul, Korea Te l: +82- 2- 716 - 6428~9 E-mail:webmaster@anycam.co.kr APEXINT , Room #905. C- dong Woorimlion s, Valley 371-28, Gasan-dong, Guemcheon-Gu, Seoul, Korea Te l: +82- 2- 2026- 2610(2) E-mail:info@apexint.co.kr
35
Super Small Capacitors
High Voltage Capacitors
39
High Voltage Capacitors
Array Type Capacitors
50
Array Type Capacitors
Low ESL Capacitors
53
Low ESL Capacitors
2. SIZE CODE
03=0201(0603) 05=0402(1005) 10=0603(1608)
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Manufacturing Site
Suwon Plant 206 Cheomdansaneop Road, Youngtong- gu, Suwon, Kyonggi Province 443- 743, Korea Te l: +82-31-210-6794 E-mail:randy.kim@ Busan Plant 1623 - 2, Songjeong - dong, Kangseo-gu, Busan 618-270, Korea Te l: +82- 51- 970 - 7671 E-mail:kyc.kweon@ Tianjin Plant 27, Heiniucheng - Road, Hexi District, Tianjin, China 300210 Te l: +86 - 22 - 2830 - 3333(3450) E-mail:gk.ryu@ Philippines Plant Calamba Premiere International Park, Batino, Calamba, Laguna, Manila Te l: +63 - 2 - 809 - 2873 E-mail:ksj1445@
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America sales office
Irvine Office 92612 3345 Michelson Drive, Suite 350,Irvine, CA Te l:1- 949 - 797- 8047 E-mail:sh386.kim@
MULTILAYER CERAMIC CAPACITORS
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Part Numbering System
CL
1
1. SERIES CODE
CL=Multi layer Ceramic Capacitors
10
2
C 101 J
3 4 5
B
6
8
7
N
8
N9N来自10C11ClassⅠ(Temperature Compensation) Symbol C P R S T U L
Reliability Test Condition
56
Reliability Test Condition
Premium Capacitors for Automotive Applications
62
Premium Capacitors for Automotive Applications
2. No use of materials breaking Ozone layer
Shenzhen Office Rm 4501, 45 /F, New World Center, Yitian Road, Futian District, Shenzhen, China 518026 Te l:86 - 755 - 8608- 5581 E-mail:jackson.xian@ Qingdao Office Rm 1201. Growne Plaza Qingdao; 76XiangGangZhong Rd, Qingdao;266071 P.R. China Te l:86-532-5779102 E-mail:zhengguo.cui@ HongKong Office Suite 4511, Two int’l Finance Centre, 8 Finance Street, Central, Hongkong Te l:852 - 2862 - 6350 E-mail:vinsent.chou@ Singapore Office 3 Church Street Samsung Hub #23-02 Singapore 049483 Te l: (65)6833 - 3228 E-mail:winson.yeong@ Thai Office Wellgrow Industrial Estate, 93 Moo 5 T. Bangsamak, A.Bangpakong Chachoengsao 24180 Thailand Te l:66 - 38 - 562 - 026 E-mail:sbimm@ Taiwan Office 399 9F - 1, Ruey Kuang Rd., Neihu, Taipei, Taiwan Te l:886 - 2 - 2656 - 8356 E-mail:kevin0130.wang@