COB wire_bonding原理介绍

• Tool less conversion window clamps and top plate enables fast device
Eagle
MACHINE SPECIFICATIONS (I) •Bonding System •Bonding Method Thermosonic (TS) •BQM Mode Constant Current, Voltage, Power and Normal (Programmable) •Loop Type Normal, Low, Square & J •XY Resolution 0.2 um •Z Resolution (capillary travelling motion)2.5 um •Fine Pitch Capability 35 mm pitch @ 0.6 mil wire •No. of Bonding Wires up to 1000 •Program Storage 1000 programs on Hard Disk •Multimode Transducer System Programmable profile, control and vibration modes
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PRESSURE
Ultra
Sonic
Vibration
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Formation of a first bond Base
PRESSURE
Ultra
Sonic
Vibration
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Capillary rises to loop height position
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WIRE BOND PROCESS INTRODUCTION
CONTENTS
ASSEMBLY FLOW OF PLASTIC IC Wire Bond 原理 M/C Introduction Wire Bond Process Material SPEC Calculator
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Formation of a second bond Base
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Tail length
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Disconnection of the tail
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Disconnection of the tail
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Free air ball is captured in the chamfer
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W/H ASSY
• changeover •· Fully programmable indexer & tracks •· Motorized window clamp with soft close feature •· Output indexer with leadframe jam protection feature
X Y Table
•Linear 3 phase AC Servo motor •High power AC Current Amplifier •DSP based control platform •High X-Y positioning accuracy of +/- 1 mm •Resolution of 0.2 mm
(SPT, GAISER, PECO, TOTO…)
Capillary Data
( Tip , Hole , CD , FA&OR , IC )
CAPILLARY (II)
( 1st Bond )
Gold wire
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B.PRINCIPLE
PRESSURE
VIBRATION
AL2O3
CONTAMINATION
GOLD BALL GLASS Al SiO2
MOISTURE
Si
銲接條件
HARD WELDING Pressure (Force) Amplify & Frequecy Welding Time (Bond Time) Welding Tempature (Heater)
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Formation of a first bond
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Formation of a first bond
IMPACT FORCE
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Байду номын сангаас
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Formation of a first bond Contact
•Facilities •Voltage 110 VAC (optional 100/120/200/210/ •220/230/240 VAC
Eagle
MACHINE SPECIFICATIONS (III)
•Material Handling System •Indexing Speed 200 – 250 ms @ 0.5 “ pitch •Indexer Resolution 1um •Leadframe Position Accuracy + 2 mil •Applicable Leadframe W = 17 – 75 mm @ bonding area in Y = 65mm = 17 – 90 mm @ bonding area in Y = 54mm L = 280 mm [Maximum] T = 0.075 – 0.8 mm •Applicable Magazine W = 100 mm (Maximum) L = 140 – 300 mm H = 180 mm (Maximum) •Magazine Pitch 2.4 – 10 mm (0.09” – 0.39 “) •Device Changeover < 4 minutes •Package Changeover < 5 minutes •Number of Buffer Magazine 3 (max. 435 mm)
Bonding Process
The Wire Bond Temp
PREHEAT CU L/F200+/-10 BONDSITE 200+/-10
AL L/F210+/-10
BGA 150+/-10
230+/-10
160+/-10 160+/-10 160+/-10
TFBGA150+/-10 LBGA 150+/-10
TRAJECTORY
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TRAJECTORY
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TRAJECTORY
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TRAJECTORY
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TRAJECTORY
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TRAJECTORY
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2nd Search Height
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Formation of a new free air ball
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Material
Leadfram Capillary Gold Wire
Leadfram (I)
Leadfram ( II )
CAPILLARY (I)
Capillary Manufacturer
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Capillary rises to loop height position
RH
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Formation of a loop
RD (Reverse Distance)
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Formation of a loop
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WIRE CLAMP „CLOSE‟
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Capillary rises to loop height position
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Capillary rises to loop height position
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Capillary rises to loop height position
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Capillary rises to loop height position
Calculated Wire Length
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Calculated Wire Length
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SEARCH DELAY
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TRAJECTORY
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TRAJECTORY
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TRAJECTORY
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TRAJECTORY
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NOT INCLUDE DEDICATE LINE
Free air ball is captured in the chamfer
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Free air ball is captured in the chamfer
SEARCH HEIGHT
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Free air ball is captured in the chamfer
Eagle
MACHINE SPECIFICATIONS (II) •Vision System •Pattern Recognition Time 70 ms / point •Pattern Recognition Accuracy + 0.37 um •Lead Locator Detection 12 ms / lead (3 leads/frame) •Lead Locator Accuracy + 2.4 um •Post Bond Inspection First Bond, Second Bond Wire Tracing •Max. Die Level Different 400 – 500 um
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Search Speed 2 Search Tol 2
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Search Speed 2 Search Tol 2
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Formation of a second bond
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Formation of a second bond Contact
THERMAL BONING
Thermal Compressure
Ultrasonic Energy (Power)
Bond Head ASSY
• Low impact force •Real time Bonding Force monitoring • High resolution z-axis position with 2.5 micron per step resolution • Fast contact detection • Suppressed Force vibration • Fast Force response • Fast response voice coil wire clamp
Singulation Solder Plating TRIM/ Dejunk TRIM
SURFACE MOUNTPKG THROUGH
Dejunk TRIM Solder
Packing
HOLE PKG
Plating
FORMING
Wire Bond 原理
Ball Bond Wedge Bond ( 2nd Bond )
DEFECT
封裝簡介
晶片Die
金線 Gold Wire 導線架
Lead fram
封裝流程
Wafer Grinding
Wafer Saw
Die Bonding
toaster
Wire Bonding
Die Surface Coating
Molding
Laser Mark
BGA
Solder Ball Placement