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FENGHUA风华规格书

FENGHUA风华规格书

广东风华高新科技股份有限公司GUANGDONG FENGHUA ADV ANCED TECHNOLOGY HOLDING CO.,LTD.承认书APPROV AL SHEET客户名称:CUSTOMER品名:常规厚膜片式固定电阻器PARTNAME规格版本号VERSION日期DATE制造客户APPROV AL APPROV AL 拟制审核确认检验审核批准FENGHUAFENG HUA ADV ANCED TECHNOLOGY (HOLDING) CO., LTD序号 No 目 录TABLE OF CONTENTS1.0 概述Summary2.0 结构及尺寸Structure And Dimensions3.0 型号规格表示办法How To Order4.0 电气性能Performance Specification5.0 可靠性Reliability Data6.0 包装Package7.0 环保情况说明 Environmental Protection Statement 8.0 推荐使用的焊接曲线Recommended soldering profile 9.0 使用注意事项Precautions For UseRC/RS□□□□1.0概述Summary片式电阻器主要生产的型号包括01005、0201、0402、0603、0805、1206、1210、2010、2512。

其特点是:The dimension type for chip resistor including01005、 0201、0402、0603、0805、1206、1210、2010、2512, and the features are as below:*体积小、重量轻miniature and light weight*电性能稳定,可靠性高 stable electrical capability and high reliability *机械强度高、高频特性优越superior mechanical and frequency*装配成本低,并与自动贴装设备匹配low assembly cost, suit for automatic SMT *适应再流焊与波峰焊suit for re-flow and wave flow soldering .*符合ROHS指令要求Compliant with ROHS Directive*符合无卤素要求Compliant with halogen free requirement*禁止使用SS-00259中规定的1级环境管理物质*SONY指定原材料只能从绿色伙伴认定供应商处采购产品广泛应用于计算机、通讯、工业自动化、航天航空、军事、数字电视、数字音响及消费类电子等领域。

27pF贴片电容0603CG270J500NT《风华电容样品单》

27pF贴片电容0603CG270J500NT《风华电容样品单》

声明:1、本规格书是由风华高科授权代理商-南京南山半导体有限公司自风华高科官方网站下载整理,若有变更,恕不另行通知;2、本规格书没有足够的空间说明详细电性能参数,仅列明了标准规格,在订购产品之前谨请与风华高科代理商南京南山半导体有限公司确认。

|特性*具有高电容量稳定性,在-55℃~125℃工作范围内,其温度系数为0±30ppm/℃、0±60ppm/℃*独石结构,具有高可靠性。

*优良的焊接性和耐旱性,适合于回流焊和波峰焊。

|贴片电容封装代号与外形尺寸L(长)尺寸 1.6±0.1mm W(宽)尺寸0.8±0.1mm T(高)尺寸0.8±0.1mm 电极宽度wb 0.30±0.10mm 公制封装代号1608英制封装代号0603|通用型贴片电容特性曲线※贴片电容交流特性图※C0G贴片电容温度系数图※X7R贴片电容温度系数图※Y5V贴片电容温度系数图※Z5U贴片电容温度系数图※贴片电容偏压特性图※贴片电容器老化特性图贴片电感样品申请单南山联系资料总机:技术支持:客服:传真:电邮:客户基本资料公司名称网址:联系方式电话:传真:□生产型企业□贸易商收货地址生产产品姓名:职务:□技术□采购□其他联络人电话:手机:电邮:样品明细资料元器件名称型号及封装单机用量申请数量备注预计生产情况预计小批量生产日期:规模生产日期:样品申请日期:样品申请流程1、请详细、全面、真实填写上列各项。

表格不够填写,可自行复制。

Service@2、请以附件的形式将该文档通过E-mail发送,并请将此单打印盖章后,电邮至::。

3、公司将根据客户所填信息并综合相关情况,由样品小组负责确定该样品申请单是否执行及如何执行。

4、收到样品申请单并经审核通过后,南京库有现货2个工作日内发出;如需订货,交期3-4周,非常规品顺延1-2周。

5、样品免费,运费到付(一般选择顺丰快递);样品数量:单个型号5~20pcs,或根据BOM表清单按2~5套提供。

3.3nF贴片电容0603CG332J500NT《风华电容样品单》

3.3nF贴片电容0603CG332J500NT《风华电容样品单》

声明:1、本规格书是由风华高科授权代理商-南京南山半导体有限公司自风华高科官方网站下载整理,若有变更,恕不另行通知;2、本规格书没有足够的空间说明详细电性能参数,仅列明了标准规格,在订购产品之前谨请与风华高科代理商南京南山半导体有限公司确认。

|特性*具有高电容量稳定性,在-55℃~125℃工作范围内,其温度系数为0±30ppm/℃、0±60ppm/℃*独石结构,具有高可靠性。

*优良的焊接性和耐旱性,适合于回流焊和波峰焊。

|贴片电容封装代号与外形尺寸L(长)尺寸 1.6±0.1mm W(宽)尺寸0.8±0.1mm T(高)尺寸0.8±0.1mm 电极宽度wb 0.30±0.10mm 公制封装代号1608英制封装代号0603|通用型贴片电容特性曲线※贴片电容交流特性图※C0G贴片电容温度系数图※X7R贴片电容温度系数图※Y5V贴片电容温度系数图※Z5U贴片电容温度系数图※贴片电容偏压特性图※贴片电容器老化特性图贴片电感样品申请单南山联系资料总机:技术支持:客服:传真:电邮:客户基本资料公司名称网址:联系方式电话:传真:□生产型企业□贸易商收货地址生产产品姓名:职务:□技术□采购□其他联络人电话:手机:电邮:样品明细资料元器件名称型号及封装单机用量申请数量备注预计生产情况预计小批量生产日期:规模生产日期:样品申请日期:样品申请流程1、请详细、全面、真实填写上列各项。

表格不够填写,可自行复制。

Service@2、请以附件的形式将该文档通过E-mail发送,并请将此单打印盖章后,电邮至::。

3、公司将根据客户所填信息并综合相关情况,由样品小组负责确定该样品申请单是否执行及如何执行。

4、收到样品申请单并经审核通过后,南京库有现货2个工作日内发出;如需订货,交期3-4周,非常规品顺延1-2周。

5、样品免费,运费到付(一般选择顺丰快递);样品数量:单个型号5~20pcs,或根据BOM表清单按2~5套提供。

FENGHUA风华高科

FENGHUA风华高科
1206CG391J500NT
通用型系列片容
0805B/822J500NB
通用型系列片容
0603CG0R1C500NB
通用型系列片容
0805F/564M160NB
通用型系列片容
1206CG112J500NB
通用型系列片容
1812F/684Z500NT
高Q型片容
高Q型片容
0402HQ3R0B500NT
直流中高压片容
1210B/105K101NT
直流中高压片容
3035B/105K501NT
排容
6124B/102M500NT
排容
6124F/223M500NB
排容
6124B/103K101NT
排容
6124B/471M160NT
排容
6124CG220M500NT
排容
6124B/473K160NT
Y212CG560J302NB
安规片容
Y212B/681K302NT
柔性端头片容
1206CG221J501AT
柔性端头片容
1812B/223M101AT
柔性端头片容
1812B/474M101AT
柔性端头片容
2220B/225M101AT
柔性端头片容
0805B/222K501AB
开路模式片容
开路模式片容
OP10B/104K101NT
开路模式片容
OP05B/102K101NT
开路模式片容
OP10B/104M101NT
开路模式片容
OP05B/102K101NT

风华LP铝电解电容规格书

风华LP铝电解电容规格书
Internal Code 85 85 85 PET 85 PET 105
Code 81 85 8F 8E 11
Lead Foming Type
Bulk 5mm 5mmChip tape ( 4~ 6.3)2.5mm 2.5mmTape ( 4~ 6.3)3.5mm 3.5mmTape ( 4~ 8)5.0mm Lead forming 8)5mm 5mmTape 8mm orininal type(vertical)tape 5mm 5mm Lead forming C Lead forming B B lLead forming ( 4~ 5)2.5mm Lead forming 8x5 F2.5mm ( 4~
4.50
35
50
5.70
6800(682)
25 25 30 25 30 25 30
30 2.80
3.80
4.40
5.10
35
60
6.00
8200(822)
25
25 2.80
35 25 3.30 30 30 30 40 3.50 35 30 30 45 4.00 35 35 40 4.80 35 35 45 5.70 35 40 45 6.30
30 35 30 45 35 45 35 50 40 45 35 50 40 50
2.50
3.20
2700(272)
25
30
2.50
2.90
3.60
3300(332)
25
25
2.40
25 25 30 25 30 25 30 25 30 35 30 35 30 35 35
35 35 30 40 30 45 35 50 40 35 45 35 50 40 50

风华通用型COG贴片电容器规格书_nscn

风华通用型COG贴片电容器规格书_nscn

风华直接授权代理/片式无源器件整合供应商 【南京南山】



风华直接授权代理/片式无源器件整合供应商 【南京南山】



风华直接授权代理/片式无源器件整合供应商 【南京南山】



风华直接授权代理/片式无源器件整合供应商 【南京南山】



风华直接授权代理/片式无源器件整合供应商 【南京南山】



风华直接授权代理/片式无源器件整合供应商 【南京南山】



风华直接授权代理/片式无源器件整合供应商 【南京南山】



风华直接授权代理/片式无源器件整合供应商 【南京南山】



风华直接授权代理/片式无源器件整合供应商 【南京南山】



风华直接授权代理/片式无源器件整合供应商 【南京南山】


10pF贴片电容0603CG100J500NT《风华电容样品单》

10pF贴片电容0603CG100J500NT《风华电容样品单》

L(长)尺寸 W(宽)尺寸 T(高)尺寸 电极宽度 wb 公制封装代号 英制封装代号
1.6±0.1mm 0.8±0.1mm 0.8±0.1mm 0.30±0.10mm 1608 0603
声明:
1、本规格书是由风华高科授权代理商-南京南山半导体有限公司自风华高科官方网站下载整理,若有变更,恕不另行通知; 2、本规格书没有足够的空间说明详细电性能参数,仅列明了标准规格,在订购产品之前谨请与风华高科代理商南京南山半导体有限公司确认。
小批量
1pcs 起
|包装信息 包装 T(编带)
规格
最小订购单位
直径 178±2mm 4000
|特性
* 具有高电容量稳定性,在-55℃~125℃工作范围内,其温 度系数为 0±30ppm/℃、0±60ppm/℃
* 独石结构,具有高可靠性。 * 优良的焊接性和耐旱性,适合于回流焊和波峰焊。
|贴片电容封装代号与外形尺寸
【南京南山—领先的片式无源器件整合供应商】

贴片电感样品申请单
南山联系资料
总机:
技术支持:
客户基本资料
公司名称 联系方式 收货地址 生产产品
联络人
电话:
姓名: 电话:
样品明细资料
元器件名称 型号及封装
客服:
传真:
电邮:
传真:
网址: □生产型企业
□贸易商
职务: 机:
□技术 电邮:
【南京南山—领先的片式无源器件整合供应商】
0603CG100J500NT 贴片电容器选型表

10pF 贴片电容 0603CG100J500NT 主要参数:封装 0603、精度±5%,材质 C0G(NP0),耐压值为额定工作电压 50V 的 3 倍,详见风华高科贴片电容规格书。本选型表主要内容包括风华 0603CG100J500NT 电容规格参数、制造与订购信息、最 小包装量、电容材质特性、封装代号与外形尺寸对照表、通用特性曲线等。后附小批量样品申请单。

风华中高压贴片电容规格书

风华中高压贴片电容规格书

MULTILAYER CHIP CERAMIC CAPACITOR(:)DC Medium-voltage MLCCDC medium-voltage MLCC has good high-voltage reliability,it is made in special design that based on the MLCC technology and equipments.It is suitable for surface-mounting ,can improve the properties of circuits.New monolithic structureThe size of the capacitor is small,yet has high electrostatic capacitance,can operate at high-voltage levels.Has good solderability.Technology Parameter (refer to the picture below):DC-DC converter.The circuit filter and vibration bell of telephone,electrograph and modem.Snubber circuit for switching power supply.FeaturesApplicationsProduct Part Number Expression1206CG100J202NTWMULTILAYER CHIP CERAMIC CAPACITORCapacitance RangeOutside DimensionWMULTILAYER CHIP CERAMIC CAPACITORMULTILAYER CHIP CERAMIC CAPACITORMULTILAYER CHIP CERAMIC CAPACITOR【 南京南山半导体有限公司 — 贴片电容选型资料】MULTILAYER CHIP CERAMIC CAPACITORX7R 1808 (V)10018122225200 200 200 5001000 2000 3000 4000 100 500 1000 2000 3000 4000 100 500 1000 2000 3000 4000 5000 /250 /250 /250100PF 150PF 330PF 470PF 680PF 1000PF 1nF 2.2nF 3.3nF 4.7nF 6.8nF 10nF 12nF 15nF 22nF 27nF 33nF 39nF 47nF 56nF 68nF 100nF 120nF 150nF 220nF 270nF 330nF 470nF 680nF 1 F 2.2 F 3.3 F 10 F 22 F75【 南京南山半导体有限公司 — 贴片电容选型资料】ItemX7R Medium-voltage MLCCDielectric 1808 1812 2225 Size Rated 100 200 5001000 2000 3000 4000 100 200 500 1000 2000 3000 4000 100 200 500 1000 2000 3000 4000 5000 /250 /250 Volatage(V) /250 Capacitance 100PF 150PF 330PF 470PF 680PF 1000PF 1nF 2.2nF 3.3nF 4.7nF 6.8nF 10nF 12nF 15nF 22nF 27nF 33nF 39nF 47nF 56nF 68nF 100nF 120nF 150nF 220nF 270nF 330nF 470nF 680nF 1 F 2.2 F 3.3. F 10 F 22 F76【 南京南山半导体有限公司 — 贴片电容选型资料】MULTILAYER CHIP CERAMIC CAPACITORY5V 0603 (V) 100 100 0805 200 250 100 1206 200 250 100 1210 200 250 100 1812 200 250 100 2225 200 2501000PF 1.5nF 2.2nF 3.3nF 4.7nF 6.8nF 10nF 12nF 15nF 22nF 27nF 33nF 39nF 47nF 56nF 68nF 100nF 150nF 220nF 270nF 330nF 390nF 470nF 680nF 820nF 1 F 2.2 3.3 10 F F F77【 南京南山半导体有限公司 — 贴片电容选型资料】ItemY5V Medium-voltage MLCC 1210 100 200 250 100 1812 200 250 100 2225 200 250Dielectric 0603 0508 1206 Size Rated Volatage(V) 100 100 200 250 100 200 250 Capacitance 1000PF 1.5nF 2.2nF 3.3nF 4.7nF 6.8nF 10nF 12nF 15nF 22nF 27nF 33nF 39nF 47nF 56nF 68nF 100nF 150nF 220nF 270nF 330nF 390nF 470nF 680nF 820nF 1 2.2 3.3 10 F F F F78【 南京南山半导体有限公司 — 贴片电容选型资料】MULTILAYER CHIP CERAMIC CAPACITORCOG1-551251. 2. 3. 2 4. , , , , , 105.3 4 :HP4278A 1. 2. 5 (D.F.) 3. HP4284 25 5 :30% 75% 1.0 0.2V C<1000PF,1.0 0.1MHz; C 1000PF,1.0 0.1KHZ :10( :SF2511) >500V6I.R. 500V: , 60 5>1 5 7 >1 2 >1 21000V 1000V 2000V 2000V50mA 50mA 10mA 150+0/-10 60 55S 5S 5S824 2 -55 125 25975235 5 5 2 0.5 150+0/-10 5% 0.5PF, 10 1 D.F. 24 2 265 5 24 2 25 2.5mm/ : 25 2.5mm/ 60 524510I.R.1 2100 170120 2001 179【 南京南山半导体有限公司 — 贴片电容选型资料】Middle and high Voltage COG MLCC reliability test methodNumber 1 Item Operating Temperature Range Appearance -55 Standard 125 Test Method21.Good ceramic body color continuity. 2.The chips have no visual damages and must be very smooth. 3.No exposed innerelectrode, no cracks or holes. 4.The outer electrode should have no cracks, holes, damages or surface oxidation. 5.Outer electrode no prolongation or the prolongation is less than half of that of the termination width. Within the specified dimensions Within the specified toleranceCr 5PF 0.56% -4 5PF Cr 50PF 1.5[(150/Cr)+7] 10 Cr 50PF 0.15%Check by using microscope10.3 4Dimensions Capacitance Dissipation Factor (DF) Insulation ResistanceUsing micrometer or vernier calipers Measuring Equipment:HP4278 capacitance meter,HP4284 capacitance, Measuring Conditions: 1.Measuring Temperature:25 5 .Humidity: 30%~75%. 2.Measuring Voltage:1.0 0.2V. 3.Measuring Frequency:C<1000PF 1.0 0.1MHz C 1000PF 1.0 0.1KHz Measuring Equipment:Insulation resistance meter (such as Sf2511 insulation resistance). Measuring Method:Must measure at rated voltage, and if Ur>500V,then just use 500V,measure the IR within 60 1 seconds. Ur Max. Current Measuring Time 1000V 1000V 2000V 2000V 50mA 50mA 10mA 5S 5S 5S56C<10nF,IR 5 10 C>10nF,IR CR 500S10Withstanding Voltage 7Requirement >1.5Ur >1.2Ur >1.2Ur8Must meet the capacitor Capacitance temperature coefficient Temperature requirements within the Characteristics operating temperature range. Solderability Tin coverage 75% should be of the outer electrode covered by Tin Appearance Cap. Change ratio No defects visible 5% or 0.5PF whichever is bigger Same as original standard Same as original standardFirst, pre-heat: heat treat 60 5 minutes at 150+0/-10 , then set it for 24 2 hours at room temperature. Measure the capacitance at 55~125 or 55~85 , the capacitance change ratio comparing to that of 25 must be within the specified range. Dip the capacitor into ethanol or colophony solution, and then dip it into 235 5 eutectic solder solution for 2 0.5 seconds. Dipping speed: 25 2.5mm/second. First pre-heat: heat treat for 60 5 minutes at 150+0/-10 , then set it for 24 2 hours at room temperature. Then pre-heat the capacitance according to the following chart. Dip the capacitor into 265 5 eutectic solder solution for 10 1 seconds. Then set it for 24 2 hours at room temperature, then measure. Dipping speed: 25 2.5mm/second. Preheat conditions: Stage Temperature Time 1 2 100 170 120 200 1minutes 1minutes9 Resistance to Soldering10DFIR80【 南京南山半导体有限公司 — 贴片电容选型资料】MULTILAYER CHIP CERAMIC CAPACITOR1 10N11 10N,10 1 :1.0mm/ 11.5mm 10 D.F. 12 55Hz10 55Hz 10Hz 2 6 123 420 mmmm3mm mm mm mmmm150+0/-10 14 24 260 524 281【 南京南山半导体有限公司 — 贴片电容选型资料】NumberItem Adhesive Strength of TerminationStandard No removal of the termination or other defect shall occurTest Method Solder the capacitor to the test jig (glass epoxy resin board) shown in Fig.1 using a eutectic solder.Then apply a 10N force inthe direction shown as the arrowhead.The soldering shall be done either with an iron or using the reflow method and shall be conducted with care so that the soldering is uniform and free of defects such as heat shock,etc.11Fig.1 Vibration Resistance10N,10 1s Speed:1.0mm/s Glss epoxy resin board12Appearance No defects or Solder the capacitor to the test jig (glass epoxy resin abnormities board). The capacitor should be subjected to a simple harmonic motion having a total amplitude of 1.5mm, the Capacitance Within the frequency being varied uniformly between the specified approximate limits of 10 and 55Hz, shall be traversed tolerance range (from 10 Hz to 55 Hz then 10 Hz again) in approximately 1 minute.This motion shall be applied for a period of 2 DF Same as hours in each 3 mutually perpendicular directions original (total is 6 hours). standardFig.2 Bending Resistance No cracks or other defects shall occur Solder the capacitor to the test jig (glass epoxy resin board) shown in Fig.3 using a eutectic solder. Then apply a force in the direction shown in Fig.4. The soldering shall be done either with an iron or using the reflow method and shall be conducted with care so that the soldering is uniform and free of defects such as heat shock, etc. mmmm13mmmm mmmmTemperature Cycle 14Appearance No defects or abnormitiesPre-treatment: Heat-treat the capacitor for 60 5 minutes at 150+0/-10 , then set it for 24 2 hours at room temperature. Perform five cycles according to the four heat treatments listed in the following table. Set it for 24 2 hours at room temperature, the measure.82【 南京南山半导体有限公司 — 贴片电容选型资料】MULTILAYER CHIP CERAMIC CAPACITOR2.5% 0.25PF, min. 14 D.F. I.R. 10000M 1 2 3 4 2 3 30 2 30 2 3 3 3 34029095 24 2500+24/-05% 0.5PF, 15 ( ) D.F. I.R. 10000M1.5 50mA ( 5% 0.5PF, 16 .) >2000V100012 24 21.2D.F. I.R. 10000M83【 南京南山半导体有限公司 — 贴片电容选型资料】NumberItems Temperature CycleStandard Cap. Change ratio 2.5% or 0.25PF whichever is larger Same as original standard More than 10000M Heat-treatment:Test MethodD.F. 14 I.R.Stage Temperature Time 1 lowest operating temperature 3 30 2 2 Room Temperature 3 Highes operating temperature 2 30 4 Room Temperature 2min. 3 3 3 3Humidity Steady State 15AppearanceNo defects or abnormities 5% or 0.5PF whichever is larger Same as original standard More than 10000M No defects or abnormities 5% or 0.5PF (whichever is larger) Same as original standard More than 10000MSet the capacitor for 500+24/-0 hours at the condition of 40 2 and 90-95% humidity. Then remove and set it for 24 2 hours at room temperature, then measure.Cap. Change ratioD.F.I.R. Life Test AppearanceCap. Change ratio 16Apply 1.5 times rated voltage to the capacitor for 1000 12 hours at the upper temperature limits, the charging current should be less than 50mA. Remove and set it for 24 2 hours at room temperature, then measure.(If Ur>2000V,apply 1.2times Ur to test)D.F.I.R.84【 南京南山半导体有限公司 — 贴片电容选型资料】MULTILAYER CHIP CERAMIC CAPACITORX7R1-551251. 2. 3. 2 4. , , , , , 105.3 4 : HP4278A HP42845(D.F.)25010-41.255:30% 75% 2. 3. : :1.0 :1.0 0.2V 0.1KHz ( :SF2511 ) >500V , 60 56I.R.C 25nF,IR 10000M C>25nF,R C 500S 500V:>1 5 7 >1 2 >1 21000V 1000V 2000V 2000V50mA 50mA 10mA5S 5S 5S150+0/-10 24 8 25 -55 125 2605235 9 75 245 5 25 2.5mm/ 2 0.5585【 南京南山半导体有限公司 — 贴片电容选型资料】General X7R MLCC reliability test methodNumber 1 Item Operating Temperature Range Appearance -55 Standard 125 Test Method21.Good ceramic body color continuity. 2.The chips have no visualdamages and must be very smooth. 3.No exposed inner- electrode, no cracks or holes. 4.The outer electrode should have no cracks, holes, damages or surface oxidation. 5.Outer electrode no prolongation or the prolongation is less than half of the termination width. Within the specified dimensions Within the specified tolerance 250 10-4Check by using microscope10 .3 4Dimensions Capacitance Dissipation Factor (DF)5Using micrometer or vernier calipers Measuring Equipments: HP4278 capacitance meter, HP4284 capacitance, Measuring Conditions: 1.Measuring Temperature: 25 5 . Humidity: 30% 75%. 2.Measuring Voltage: 1.0 0.2V. 3.Measuring Frequency:1.0 0.1KHz Measuring Equipment: Insulation resistance meter (such as Sf2511 insulation resistance). Measuring Method: Must measure at rated voltage, and measure the IR within 60 1 seconds. Ur 1000V 1000V 2000V Max. Current Measuring Time 50mA 50mA 10mA 5S 5S 5SInsulation Resistance 6C 25nF,IR 10000M C>25nF,R C 500SWithstanding Voltage 7Requirement >1.5Ur >1.2Ur >1.2Ur2000V8Capacitance Temperature CharacteristicsMust meet the capacitor character temperature coefficient requirements within the operating temperature range. 75% of the outer electrode should be covered by TinFirst, pre-heat: heat treat 60 5 minutes at 150+0/-10 ,then set it for 24 2 hours at room temperature. Measure the capacitance at -55 125 ,the capacitance change ratio comparing to that of 25 must be within the specified range. Dip the capacitor into ethanol or colophony solution,and then dip it into 245 5 eutectic solder solution for 2 0.5 seconds. Dipping speed:25 2.5mm/second.Solderability 986【 南京南山半导体有限公司 — 贴片电容选型资料】MULTILAYER CHIP CERAMIC CAPACITOR150+0/-10 10% D.F. 10 I.R. 25 : 10 1 24 2 26560 5 24522.5mm/1 2100 170120 2001 1110N11 10N,10 1 :1.0mm/ 11.5mm 10 D.F. 55Hz 55Hz 10Hz 1 2 12 6 1023 13 ( ) 487【 南京南山半导体有限公司 — 贴片电容选型资料】NumberItemStandardTest Method First pre-heat: heat treat for 60 5 minutes at 150+0/-10 , then set it for 24 2 hours at room temperature. Then pre-heat the capacitance according to the following chart. Dip the capacitor into 265 5 eutectic solder solution for 10 1s. Then set it for 24 2 hours at room temperature, then measure. Dipping speed: 25 2.5mm/second. Preheat conditions: Stage Temperature Time 1 2 100 170 120 200 1minute 1minuteResistance to Appearance No defects visible Soldering Cap. Change Within 10% ratio DF 10 IR Same as original spec. Same as original spec.Adhesive Strength of TerminationNo removal of the terminations or other defect shall occur11Solder the capacitor to the test jig (glass epoxy resin board) shown in Fig.1 using a eutectic solder. Then apply a 10N force in the direction shown as the arrowhead. The soldering shall be done either with an iron or using the reflow method and shall be conducted with care so that the soldering is uniform and free of defects such as heat shock, etc. 10N,10 1s Speed:1.0mm/s Glss epoxy resinboardFig.1 Resistance to Soldering Appearance No defects visible or abnormities Capacitance Within the specified tolerance range D.F. 12 Same as original spec.Solder the capacitor to the test jig (glass epoxy resin board). The capacitor should be subjected to a simple harmonic motion having a total amplitude of 1.5mm, the frequency being varied uniformly between the approximate limits of 10 and 55Hz, shall be traversed (from 10 Hz to 55 Hz then 10 Hz again) in approximately 1 minute. This motion shall be applied for a period of 2 hours in each 3 mutually perpendicular directions (total is 6 hours).Fig.2 Bending Resistance No cracks or other defects shall occur Solder the capacitor to the test jig (glass epoxy resin board) shown in Fig.3 using a eutectic solder. Then apply a force in the direction shown as Fig.4. The soldering shall be done either with an iron or using the reflow method and shall be conducted with care so that the soldering is uniform and free of defects such as heat shock, etc.1388【 南京南山半导体有限公司 — 贴片电容选型资料】MULTILAYER CHIP CERAMIC CAPACITOR20 mmmmmm13mmmmmmmmmin. 20% 1 2 14 D.F. I.R. 3 4 2 3 30 2 30 2 3 3 3 340 20% 15 ( ) D.F. I.R.29095 48 2500+24/-01.5 20% .) 16 D.F. I.R 50mA ( >2000V100012 24 21.289【 南京南山半导体有限公司 — 贴片电容选型资料】NumberItem Bending ResistanceStandardTest Methodmmmmmm13mm mmmmTemperature CycleAppearanceNo defects or abnormities 20%Cap. Change Within ratio 14Stage Temperature Time min. 1 Min. Operating Temperature 3 30 3 2 Room Temperature 2 3 3 Max. Operating Temperature 2 30 3 4 Room Temperature 2 3D.F.Same as original Specification Same as original Specification No defects or abnormities 20% Set the capacitor for 500+24/-0 hours at the condition of 40 2 and 90-95% humidity. Then remove and set it for 48 2 hours at room temperature, then measure.I.R.Humidity Steady StateAppearanceCap. Change within ratio D.F.15 I.R. Life Test AppearanceSame as original Specification Same as original Specification No defects or abnonrmities 20% Apply 1.5 times rated voltage to the capacitor for 1000 12 hours at the upper temperature limits, the charging current should be less than 50mA. Remove and set it for 24 2 hours at room temperature, then measure.(If Ur>2000V,apply 1.2Ur to test.)Cap. Change within ratio 16 D.F.Same as original specification Same as original specificationI.R.90【 南京南山半导体有限公司 — 贴片电容选型资料】MULTILAYER CHIP CERAMIC CAPACITORY5V1-25~851. 2. 3. 2 4. 5. , , , , ,103 4 : HP4278A 1. 5 (D.F.) 500 10-4HP4284 25 5 75% 0.2V 0.1kHz:30% 2. 3. : :1.0 :1.06I.R.C 25nF,IR 40000M C>25nF,R C 500S( : ,: SF2511 60 5)7>300V >400V >500V100V 200V 250V50mA 50mA 50mA5S 5S 5S150+0/-10 8 24 -25 85 2605 25975235 25 0.52455 25 2.5mm/91【 南京南山半导体有限公司 — 贴片电容选型资料】General Y5V MLCC reliability test methodNumber 1 Item Operating Temperature Range Appearance -25 85 Standard Test Method21.Good ceramic body color continuity. 2.The chips have no visualdamages and must be very smooth. 3.No exposed inner- electrode, no cracks or holes. 4.The outer electrode should have no cracks, holes, damages or surface oxidation. 5.Outer electrode no prolongation or the prolongation is less than half of that of the termination width. Within the specified dimensions Within the specified tolerance 500 10-4Check by using microscope10.3 4Dimensions Capacitance) Dissipation Factor (DF)Using micrometer or vernier calipers Measuring Equipments: HP4278 capacitance meter, HP4284 capacitance, Measuring Conditions: 1.Measuring Temperature: 25 5 . Humidity: 30% 75%. 2.Measuring Voltage: 1.0 0.2V. 3.Measuring Frequency: 1.0 0.1KHz Measuring Equipment: Insulation resistance meter (such as Sf2511 insulation resistance). Measuring Method: Must measure at rated voltage, and measure the IR within 60 5seconds. Ur 1000V 1000V 2000V Max. Current Measuring Time 50mA 50mA 10mA 5S 5S 5S5Insulation Resistance 6C 25nF,IR 40000M C>25nF,R C 500SWithstanding Voltage 7Requirement >1.5Ur >1.2Ur >1.2Ur2000VCapacitance Temperature Characteristics 8Must meet the capacitor temperature coefficient requirements within the operating temperature range.First, pre-heat: heat treat 60 5 minutes at 150+0/-10 , then set it for 24 2 hours at room temperature. Measure the capacitance at 55 125 or 55 85 ,the capacitance change ratio comparing to that of 25 must be within the specified range. Dip the capacitor into ethanol or colophony solution,and then dip it into 235 5 (or 245 5 leadless eutectic solder solution) eutectic solder solution hanging lead for 2 0.5seconds. Dipping speed: 25 2.5mm/second.Solderability 975% of the outer electrode should be covered by Tin92【 南京南山半导体有限公司 — 贴片电容选型资料】MULTILAYER CHIP CERAMIC CAPACITOR150+0/-10 30% D.F. I.R. 10 60 5 24 22655 24 2 25 2.5mm/ :1011 2100 170120 200 11 110N11 10N,10 1 :1.0mm/ 11.5mm D.F. 10 55Hz 12 55Hz 10Hz 1 2 6 1023 ( 13 ) 493【 南京南山半导体有限公司 — 贴片电容选型资料】NumberItemStandardTest Method First pre-heat: heat treat for 60 5 minutes at 150+0/-10 , then set it for 24 2 hours at room temperature. Then pre-heat the capacitance according to the following chart. Dip the capacitor into 265 5 eutectic solder solution for 10 1s. Then set it for 24 2 hours at room temperature, then measure. Dipping speed: 25 2.5mm/second. Preheat conditions: Stage Temperature Time 1 2 100 170 120 200 1minute 1minuteResistance to Appearance No defects visible Soldering Cap. Change Z5U, Y5V: within ratio DF 10 IR30%Same as original spec. Same as original spec.Adhesive Strength of TerminationNo removal of the terminations or other defects shall occur11Solder the capacitor to the test jig (glass epoxy resin board) shown in Fig.1 using a eutectic solder. Then apply a 10N force in the direction shown as the arrowhead. The soldering shall be done either with an iron or using the reflow method and shall be conducted with care so that the soldering is uniform and free of defects such as heat shock, etc. 10N,10 1s Speed:1.0mm/s Glss epoxy resinboardFig.1 Resistance to Soldering Appearance No defects visible or abnormities Capacitance Within the specified tolerance range D.F. 12 Same as original spec.Solder the capacitor to the test jig (glass epoxy resin board). The capacitor should be subjected to a simple harmonic motion having a total amplitude of 1.5mm, the frequency being varied uniformly between the approximate limits of 10 and 55Hz, shall be traversed (from 10 Hz to 55 Hz then 10 Hz again) in approximately 1 minute. This motion shall be applied for a period of 2 hours in each 3 mutually perpendicular directions (total is 6 hours).Fig.2 Bending Resistance No cracks or other defects shall occur Solder the capacitor to the test jig (glass epoxy resin board) shown in Fig.3 using a eutectic solder. Then apply a force in the direction shown as Fig.4. The soldering shall be done either with an iron or using the reflow method and shall be conducted with care so that the soldering is uniform and free of defects such as heat shock, etc.1394【 南京南山半导体有限公司 — 贴片电容选型资料】MULTILAYER CHIP CERAMIC CAPACITOR20 mm mmmm13mm mmmmmm30%min. 1 2 3 4 3 2 30 2 30 2 3 3 3 3D.F. 14 I.R.40 30%29095 48 2500+24/-015()D.F. I.R.30% 16 D.F. I.R 48 21.5 50mA10001295【 南京南山半导体有限公司 — 贴片电容选型资料】NumberItem Bending ResistanceStandardTest Methodmmmm13mmmmmmmmTemperature CycleAppearanceNo defects or abnonrmities 2.5Cap. Change Within ratio 14Stage Temperature Time 30 1 Min. Operating Temperature 3 2 Room Temperature 2 3 Max. Operating Temperature 2 30 4 Room Temperature 2min. 3 3 3 3D.F.Same as original spec. Same as original spec. No defects or abnonrmities Set the capacitor for 500+24/-0 hours at the condition of 40 2 and 90-95% humidity. Then remove and set it for 24 2 hours at room temperature, then measure.I.R.Humidity Steady State 15AppearanceCap. Change within 30% ratio Same as D.F. original spec. I.R. Same as original spec. No defects or abnonrmities 30%Life TestAppearanceCap. Change within ratio 16 D.F.Same as original spec. Same as original spec.Apply 1.5 times rated voltage to the capacitor for 1000 12 hours at the upper temperature limits, the charging current should be less than 50mA. Remove and set it for 24 2 hours at room temperature, then measure.I.R.96。

1nF贴片电容0603CG102J500NT《风华电容样品单》

1nF贴片电容0603CG102J500NT《风华电容样品单》

声明:1、本规格书是由风华高科授权代理商-南京南山半导体有限公司自风华高科官方网站下载整理,若有变更,恕不另行通知;2、本规格书没有足够的空间说明详细电性能参数,仅列明了标准规格,在订购产品之前谨请与风华高科代理商南京南山半导体有限公司确认。

|特性*具有高电容量稳定性,在-55℃~125℃工作范围内,其温度系数为0±30ppm/℃、0±60ppm/℃*独石结构,具有高可靠性。

*优良的焊接性和耐旱性,适合于回流焊和波峰焊。

|贴片电容封装代号与外形尺寸L(长)尺寸 1.6±0.1mm W(宽)尺寸0.8±0.1mm T(高)尺寸0.8±0.1mm 电极宽度wb 0.30±0.10mm 公制封装代号1608英制封装代号0603|通用型贴片电容特性曲线※贴片电容交流特性图※C0G贴片电容温度系数图※X7R贴片电容温度系数图※Y5V贴片电容温度系数图※Z5U贴片电容温度系数图※贴片电容偏压特性图※贴片电容器老化特性图贴片电感样品申请单南山联系资料总机:技术支持:客服:传真:电邮:客户基本资料公司名称网址:联系方式电话:传真:□生产型企业□贸易商收货地址生产产品姓名:职务:□技术□采购□其他联络人电话:手机:电邮:样品明细资料元器件名称型号及封装单机用量申请数量备注预计生产情况预计小批量生产日期:规模生产日期:样品申请日期:样品申请流程1、请详细、全面、真实填写上列各项。

表格不够填写,可自行复制。

Service@2、请以附件的形式将该文档通过E-mail发送,并请将此单打印盖章后,电邮至::。

3、公司将根据客户所填信息并综合相关情况,由样品小组负责确定该样品申请单是否执行及如何执行。

4、收到样品申请单并经审核通过后,南京库有现货2个工作日内发出;如需订货,交期3-4周,非常规品顺延1-2周。

5、样品免费,运费到付(一般选择顺丰快递);样品数量:单个型号5~20pcs,或根据BOM表清单按2~5套提供。

风华高科_微波片容_规格说明书

风华高科_微波片容_规格说明书

③ 标称容量 NOMINAL CAPACITANCE
表示方式
实际值
(Express Method)
(Actual Value)
R47
0.47
0R5
0.5
1R0
1.0
101
10×101
102
10×102


单位(unit):pF
注:头两位数字为有效数字,第三位数字为 0 的个数;R 为小数点。 Note: the first two digits are significant; third digit denotes number of zeros; R=decimal point.
T 编带包装(Taping Package)
四、温度系数/特性 Temperature Coefficient /Characteristics
介质种类
参考温度点
标称温度系数
工作温度范围
Dielectric Reference Temperature Point Temperature Coefficient Operation Temperature Range
三、型号规格表示方法 HOW TO ORDER
1111
RF
101
J
501 N
T




⑤⑥

※说明 NOTES:
①尺寸 DIMENSIONS
尺寸规格 Size Code
0402
长×宽 (L×W)inch
0.04×0.02
长×宽 (L×W)mm
1.00×0.50
0603 0.06×0.03 1.60×0.80
⑥ 端头材料 TERMINAL MATERIAL STYLES 端头类别 (Termination Styles)

风华电容规格书

风华电容规格书

风华电容规格书1. 引言电容器作为电子元器件的一种,广泛应用于电路中的能量存储和信号处理等方面。

风华电容器作为市场上的一款知名品牌,具备优异的性能和稳定的质量。

本文将对风华电容器的规格进行详细的介绍和分析。

2. 风华电容器的基本信息风华电容器,具有以下基本信息: - 品牌:风华 - 类型:电容器 - 产品线:风华电容器系列 - 应用领域:电子设备、通讯设备、汽车电子等 - 规格范围:从几微法到几百毫法 - 工作电压范围:从几伏到几千伏 - 温度范围:从-40℃到+125℃3. 风华电容器的特点和优势风华电容器具有以下特点和优势: ### 3.1 高质量材料 - 风华电容器采用高品质、低损耗的电介质材料,具有优异的电气性能和机械强度。

- 高质量材料保证了风华电容器的长寿命、稳定性和可靠性。

3.2 优异的电性能•风华电容器具有低固定导通损耗、高工作电压、低漏电流等优点。

•在高频率和高温度环境下,风华电容器依然保持良好的电性能,适用于各种复杂工况。

3.3 精确的尺寸和容量控制•风华电容器通过精密的制造工艺和先进的设备,保证了尺寸和容量的准确控制。

•精确的尺寸和容量控制使得风华电容器可以更好地满足不同电路的需求。

3.4 超高温型号可选•风华电容器还提供超高温型号,能够在高温环境下正常工作,并具备优异的电性能。

•超高温型号的出现,满足了某些特殊应用领域对电容器高温稳定性的需求。

4. 风华电容器的应用案例风华电容器在不同领域有着广泛的应用,以下是一些应用案例: ### 4.1 电子设备 - 电子设备中的电源滤波电路常常采用风华电容器,以提高电路的稳定性和可靠性。

- 风华电容器的高质量和优异的电性能,使其成为电子设备中不可或缺的元器件。

4.2 通讯设备•通讯设备中的射频电路需要使用高性能的电容器来实现信号的传输和处理。

•风华电容器的优异的电性能和稳定性,使其成为通讯设备制造商的首选。

4.3 汽车电子•汽车电子中的电容器需要具备高温稳定性和耐振动性能。

风华直插电容规格

风华直插电容规格

Code Lead Forming Type
0 散装品 Bulk
T
5mm 贴片编带品 5mm Chip tape
A
(Φ4~Φ6.3)2.5mm 脚距 编带品;2.5mmTape
F
(Φ4~Φ8)5mm 脚距编 带品;5mmTape
直径Φ≥Φ8mm 直脚
P 方式 编带 品 original
type(vertical) tape
meet the characteristics listed above.
4. 产品结构 PRODUCT STRUCTURE ( mm )
4. 1 外形尺寸 SHAPE AND DIMENSIONS
β
±0.5
±1.0
ΦD
5 6.3 8
10
12.5
16
18
F±0.5 2.0 2.5 3.5
5.0
7.5
6.3~100V.DC
160~450V.DC
使用温度范围 Operating Temperature Range
-40℃~+105℃
-25℃~+105℃
标称静电容量范围 Nominal Capacitance Range
0.1~22000μF
0.47~220μF
静电容量允许偏差 Capacitance Tolerance
代码 Code R22 1R0 2R2 220 221 222 223
标称容量
Nominal Capacitance 0.22uF 1uF 2.2uF 22uF 220uF 2200 22000
代码 误 差
Code Tolerance J ±5%
K ±10%
V

1nF贴片电容0603CG102J500NT《风华电容样品单》

1nF贴片电容0603CG102J500NT《风华电容样品单》

1nF贴片电容0603CG102J500NT《风华电容样品单》1nF贴片电容0603__00NT《风华电容样品单》由风华电容代理商――南京南山(代理证编号2022年07)整理发布【南京南山―领先的片式无源器件整合供应商】声明:1、本规格书是由风华高科授权代理商-南京南山半导体有限公司自风华高科官方网站下载整理,若有变更,恕不另行通知;2、本规格书没有足够的空间说明详细电性能参数,仅列明了标准规格,在订购产品之前谨请与风华高科代理商南京南山半导体有限公司确认。

第1页共3页1nF贴片电容0603__00NT《风华电容样品单》由风华电容代理商――南京南山(代理证编号2022年07)整理发布【南京南山―领先的片式无源器件整合供应商】|通用型贴片电容特性曲线※C0G贴片电容温度系数图※X7R贴片电容温度系数图※Y5V贴片电容温度系数图※Z5U贴片电容温度系数图※贴片电容偏压特性图※贴片电容器老化特性图※贴片电容交流特性图第2页共3页1nF贴片电容0603__00NT《风华电容样品单》由风华电容代理商――南京南山(代理证编号2022年07)整理发布【南京南山―领先的片式无源器件整合供应商】贴片电感样品申请单南山联系资料总机:技术支持:客服:传真:电邮:客户基本资料公司名称联系方式收货地址生产产品姓名:联络人电话:手机:电邮:职务:□技术□采购□其他电话:传真:网址:□生产型企业□贸易商样品明细资料元器件名称型号及封装单机用量申请数量备注预计生产情况预计小批量生产日期:规模生产日期:样品申请日期:样品申请流程1、请详细、全面、真实填写上列各项。

表格不够填写,可自行复制。

2、请以附件的形式将该文档通过E-mail发送,并请将此单打印盖章后,电邮至::Service@。

3、公司将根据客户所填信息并综合相关情况,由样品小组负责确定该样品申请单是否执行及如何执行。

4、收到样品申请单并经审核通过后,南京库有现货2个工作日内发出;如需订货,交期3-4周,非常规品顺延1-2周。

风华射频高Q贴片电容规格书

风华射频高Q贴片电容规格书

规格型号
英制表示 公制表示
0603
1608
0805
2012
0505
1212
1111
2828
L 1.60±0.20 2.00±0.20 1.40±0.38 2.79±0.51
尺寸(mm)
W
T
0.80±0.20 0.80±0.10
1.20±0.20 0.80±0.10
1.4±0.38 0.51~1.45
0805 250V
0505 150V
射频高 Q 多层片式陶瓷电容器
50V
100V
1111 200V
300V
500V
2
射频高 Q 多层片式陶瓷电容器
●Features
*High Q,Ultra-low ESR,Ultra-low ESL
*Temperature coefficienct 0±30ppm/℃(-55℃~+125℃)
3
射频高 Q 多层片式陶瓷电容器
●Capacitance Range
Item
Size
0603
Rated Voltage
250V
Capacitance
0.1pF 0.3pF 0.5pF 1.0pF 2.2pF 3.3pF 4.7pF 5.6pF 6.8pF 10pF 22pF 33pF 47pF 68pF 100pF 220pF 470pF 680pF 1000pF
L
1.60±0.20 2.00±0.20 1.40±0.38 2.79±0.51
Dimension(mm)
W
T
0.80±0.20 1.20±0.20 1.4±0.38 2.79±0.51
0.80±0.10 0.80±0.10 0.51~1.45 0.76~2.59

风华01005贴片电容器规格书

风华01005贴片电容器规格书

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瓷介电容_风华高科规格书

瓷介电容_风华高科规格书

产品规格表示方式Product Part Number Expression1Product Type、产品类型CC11F 253NPO 415A 63307J 8S 9P 102Voltage Code、电压代码代码Code 额定电压Rated VoltageY 400VACF50V G100V A200V K250V L500V N1KV M2KVP3KV Q4KV 3Diameter Coefficient、片径直径代码直径Code Diameter(mm)65.5-6.4…………109.5-10.41211.5-12.4…………4(EIA )、温度特性见温度系数及代码:Temperature Characteristics (Please to see temperature coefficient and EIA code):5Lead style、引线形式代号symbol12345679W 11风华高科X250VAC54.5-5.4产品类型Product Type类型代号Typ e cod eLow voltage temperature compensation capacitor High voltage temperature compensation capacitorLow voltage high dielectric constant disk ceramic capacitor High voltage high dielectric constant disk ceramic capacitor Semiconductor disk ceramic capacitor Alternating current disk ceramic capacitor低压温度补偿型高压温度补偿型低压高介电常数型高压高介电常数型半导体型电容器交流电容器CC1CC81CT1CT81CS1CT7引线形式直脚长式直脚长式()编带直脚型(b式)编带小内弯型(a式)编带大内弯型(a式)特殊直脚S 外单弯(w式)前后翘lead Style(18-28mm)b Straight lon g lead (18~28m )b Style (16-20mm)b Straight long le ad (16~20mm)b Style straight short lead(cut the feet)Tape straight lead (b Style)Tape sm all inside kink (a Style)Tape large inside kink (a Sty le)()Special Straight lead (S)Outside kink(w Style)vertical kink lead短脚切脚6Lead Spacing、脚距7Standard capacitance、标称容量1R04R7100560821102-----注:标称容量以为单位,用位数字表示。

全系列电容规格书

全系列电容规格书

SUMMARY
●Types of Dielectric Material and Capacitor ※HIGH FREQUENCY TYPE: The capacitor of this kind dielectric material is considered as ClassⅠcapacitor, including high frequency COG、COH capacitor and temperature compensating capacitor such as HG, LG, PH,
风华高科
广 东 风 华 高 新 科 技 股 份 有 限 公 司
FENGHUA
Fenghua Advanced Technology (Holding) CO. , LTD
单位(unit):V 实际值 (Actual Value) 6.3 50×100 20×101 10×102 … 表示方式 (Express Method) S C N T 编带包装(Taping Package) 标称温度系数 Temperature Coefficient 0±30 ppm/℃ 0±60 ppm/℃ -33±30 ppm/℃ -75±30 ppm/℃ -150± 60 ppm/℃ -220± 60 ppm/℃ -330± 60 ppm/℃ -470± 60 ppm/℃ -750± 120 ppm/℃ -1000~+140 ppm/℃ ±15% ±15% ±22% ±22% -56%~+22% -80%~+30% 工作温度范围 Operation Temperature Range -55℃~125℃ -55℃~125℃ -25℃~85℃ -25℃~85℃ -25℃~85℃ -25℃~85℃ -25℃~85℃ -25℃~85℃ -25℃~85℃ -25℃~85℃ -55℃~125℃ -55℃~85℃ -55℃~125℃ -55℃~105℃ 10℃~85℃ -25℃~85℃ 注: 头两位数字为有效数字, 第三位数字为 0 的个数; R 为小数点。 Note: the first two digits are significant; third digit denotes number of zeros; R=decimal point.

1nF贴片电容0603CG102J500NT《风华电容样品单》

1nF贴片电容0603CG102J500NT《风华电容样品单》

1nF贴片电容0603CG102J500NT《风华电容样品单》【南京南山—领先的片式无源器件整合供应商】声明:2、本规格书没有足够的空间说明详细电性能参数,仅列明了标准规格,在订购产品之前谨请与风华高科代理商南京南山半导体有限公司确认。

第1页共3页【南京南山—领先的片式无源器件整合供应商】|通用型贴片电容特性曲线C0G贴片电容温度系数图某7R贴片电容温度系数图Y5V贴片电容温度系数图Z5U贴片电容温度系数图贴片电容偏压特性图贴片电容器老化特性图贴片电容交流特性图第2【南京南山—领先的片式无源器件整合供应商】贴片电感样品申请单总机:技术支持:客服:传真:电邮:姓名:联络人手机:电邮:职务:□技术□采购□其他传真:网址:□生产型企业□贸易商元器件名称型号及封装申请数量备注预计生产情况预计小批量生产日期:规模生产日期:样品申请日期:样品申请流程1、请详细、全面、真实填写上列各项。

表格不够填写,可自行复制。

4、收到样品申请单并经审核通过后,南京库有现货2个工作日内发出;如需订货,交期3-4周,非常规品顺延1-2周。

5、样品免费,运费到付(一般选择顺丰快递);样品数量:单个型号5~20pc,或根据BOM表清单按2~5套提供。

6、说明:接单后,样品小组将努力跟进,但由于原厂生产等环节存有不确定因素,我们无法保证样品数量、型号完全符合要求,也不承诺一定按期交出。

跟进记录□已中止进行□已建议生产□已发送样品/日期□客户已签收/日期□中止原因描述:第3页共3页。

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1
单位(unit):V
注:头两位数字为有效数字,第三位数字为 0 的个数; R 为小数点。 Note: the first two digits are significant; third digit denotes number of zeros; R=decimal point.
风华高科
广 东 风 华 高 新 科 技 股 份 有 限 公 司
FENGHUA
Fenghua Advanced Technology (Holding) CO. , LTD
※Y5V:The capacitor made of this kind of material is the highest dielectric constant of all ceramic capacitors. They are used over a moderate temperature range in application where high capacitance is required because of its unstable temperature coefficient, but where moderate losses and capacitance changes can be tolerated. Its capacitance and dissipation factors are sensible to measuring conditions, such as temperature and voltage, etc. ※Z5U:The capacitor made of this kind of material is considered as ClassⅡ capacitor, whose temperature characteristic is between that of X7R and Y5V. The capacitance of this kind of capacitor is unstable and sensible to temperature and voltage. Ideally suited for bypassing and decoupling application circuits operating with low DC bias in the environment approaches to room temperature. 二、结构及尺寸
RH,SH, TH, UJ, SL. The electrical properties of COG、COH capacitor are the most stable one and change invariablly with temperature, voltage and time. They are suited for applications where low-losses and high-stability are required, HG,LG,PH,RH,SH,T H,UJ,SL capacitor’ capacitance changes with temperature.They are s suited for applications where low-losses and temperature compensating circuits. ※X7R、X5R:X7R、X5R material is a kind of material has high dielectric constant. The capacitor made of this kind material is considered as Class Ⅱ capacitor whose capacitance is higher than that of class Ⅰ. These capacitors are classified as having a semi-stable temperature charac teristic and used over a wide temperature range, such in these kinds of circuits, DC-blocking, decoupling, bypassing, frequency discriminating etc. 版 本 号 FH2009-001 第 1 页 共 29 页
0805
2012
2.00±0.20
1.25±0.20
0.50±0.20
1206
3216
3.20±0.30
1.60±0.30
0.60±0.30
1210 1808 1812 2220 2225 3035
3225 4520 4532 5750 5763 7690
3.20±0.30 4.50±0.40 4.50±0.40 5.70±0.40 5.70±0.50 7.60±0.50
风华高科
广 东 风 华 高 新 科 技 股 份 有 限 公 司
FENGHUA
Fenghua Advanced Technology (Holding) CO. , LTD
※ 结构 STRUCTURE W L 序号 NO ①
T

① ② ③ ④
③ ⑤ ④ ⑤
名称 Name 陶瓷介质 Ceramic dielectric 内电极 Inner electrode 外电极 Substrate electrode 镍层 Nickel Layer 锡层 Tin Layer
备注:B、C、D 级误差适用于容量≤10pF 的产品. Note:These capacitance tolerance B, C, D are just applicable the capacitance that equals to or less than 10pF.
⑤ 额定电压 RATED VOLTAGE 表示方式 (Express Method) 6R3 500 201 102 … 实际值 (Actual Value) 6.3 50×100 20×10
风华高科
广 东 风 华 高 新 科 技 股 份 有 限 公 司
FENGHUA
Fenghua Advanced Technology (Holding) CO. , LTD
一、概述
●电容器及介质种类: ※高频类: 此类介质材料的电容器为Ⅰ类电容器,包括通用型高频 COG、COH 电容器和温度补偿型高 频 HG、LG、PH、RH、SH、TH、UJ、SL 电容器。其中 COG、COH 电容器电性能最稳定,几乎不随温 度、电压和时间的变化而变化,适用于低损耗,稳定性要求高的高频电路,HG、LG、PH、RH、SH、TH、 UJ、SL 电容器容量随温度变化而相应变化,适用于低损耗、温度补偿型电路中。
STRUCTULeabharlann E AND DIMENSIONS※ 尺寸 DIMENSIONS L L W T
WB 型号 Type 英制表示 British expression 0402 0603 公制表示 Metric expression 1005 1608 L 1.00±0.05 1.60±0.10 尺寸 W 0.50±0.05 0.80±0.10
※ X7R、X5R:此类介质材料的电容器为Ⅱ类电容器,具有较高的介电常数,容量比Ⅰ类电容器高,具 有较稳定的温度特性,适用于容量范围广,稳定性要求不高的电路中,如隔直、耦合、旁路、鉴频等电路 中。
※Y5V:此类介质材料的电容器为Ⅱ类电容器,是所有电容器中介电常数最大的电容器,但其容量稳定性 较差,对温度、电压等条件较敏感,适用于要求大容量,温度变化不大的电路中。
4.50×3.20 5.70×5.00
5.70×6.30
7.60×9.00
. ② 介质种类 DIELECTRIC STYLE 介质种类 (Dielectric Code) 介质材料 (Dielectric) 版 本 号 COG COH HG LG PH RH SH TH UJ SL X5R X7R Z5U Y5V CG CH HG LG PH RH SH TH UJ SL X B E F
WB Dimensions T 0.50±0.05 0.80±0.10 ≤0.55 0.80±0.20 1.00±0.20 1.25±0.20 0.80±0.20 1.00±0.20 1.25±0.20 1.60±0.30 ≤2.80 ≤2.20 ≤3.50 ≤3.50 ≤6.20 ≤8.10 (mm) WB 0.25±0.10 0.30±0.10
0402
0.04× 0.02
0.06× 0.03
0.08×0.05
0.12× 0.06
0.12× 0.10
0.18× 0.08
0.18×0.12 0.22×0.20
0.22×0.25
0.30×0.35
1.00× 0.50
1.60× 0.80
2.00×1.25
3.20× 1.60
3.20× 2.50
4.50× 2.00
2.50±0.30 2.00±0.20 3.20±0.30 5.00±0.40 6.30±0.50 9.00±0.50
0.80±0.30 0.80±0.30 0.80±0.30 1.00±0.40 1.00±0.40 1.00±0.40
备注:可根据客户的特殊要求设计符合客户需求的产品。 Note:We can design according to customer special requirements 版 本 号 FH2009-001 第 2 页 共 29 页
※Z5U:此类介质材料的电容器为Ⅱ类电容器,其温度特性介于 X7R 和 Y5V 之间,容量稳定性较差,对 温度、电压等条件较敏感,适用于要求大容量,使用温度范围接近于室温的旁路,耦合等,低直流偏压的 电路中。
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