MEMS(数字)麦克风基本知识
合集下载
相关主题
- 1、下载文档前请自行甄别文档内容的完整性,平台不提供额外的编辑、内容补充、找答案等附加服务。
- 2、"仅部分预览"的文档,不可在线预览部分如存在完整性等问题,可反馈申请退款(可完整预览的文档不适用该条件!)。
- 3、如文档侵犯您的权益,请联系客服反馈,我们会尽快为您处理(人工客服工作时间:9:00-18:30)。
Stage
Temperature Profile
Time (Maximum)
Pro-head
170~180 ℃
120sec.
Solder Melt
Above 230 ℃
100sec.
Peak
260 ℃ Maximum
30sec.
Production Process
Wafer Fabrication
MEMS Microphone 产品简介
MEMS Microphone Structure
序号 1 2 3 4 5 6 7 8
名称 Cover Housing Wire bonding PC Board Capacitor 10pF Capacitor 33pF ASIC MEMS Die
MEMS Microphone 产品简介
R1
R2 +
Vref
External Gain=-R1/R2 (Set by customer)
Solder Reflow Profile
MEMS Microphone 产品简介
Maximum solder profile: Do not exceed profile listed in this table
MEMS Microphone 产品简介
MEMS Microphone Module Structure
Silicon diaphragm
Silicon Back Plate MEMS Acoustic
Sensor
RF Filter
ASIC
GND V out
V supply
MEMS Microphone 产品简介
MEMS Microphone Wafer & MEMS Die
MEMS Wafer
MEMS Die
MEMS Microphone 产品简介
MEMS Microphone Profile
Acoustic port hole
W
H
4
1
L
3
2
PIN# FUNCTION 1.OUTPUT, 2.NO CONNECTION 3.GROUND, 4.POWER
MEMS Packaging
Cellular Phone(CDMA, GSM, PCS), Camcorder Phone, MP3 Phone, PDA Phone etc.
Ear Phone MIC for Headsets, MP3, Bluetooth, etc.
Camcorder, Digital Camera etc.
Current consumption
0.25mA
Supply voltage ratings
1.5V to 3.6V
MEMS Microphone 产品简介
Recommended Interface Circuit
AAC MEMS Microphone
Term4 +
Term1
Term3. Term2.
Notebook Computer, Desk-Top Computer Video Door Phone etc. Cordless Phone
Application of Product
MEMS Microphone 产品简介
MEMS Mic
MEMS Mic
List of Products
MEMS Microphone 工作原理
MEMS麦克风是由MEMS微电容传感器、微集成转换电路 (放大器)、声腔及RF抗噪电路组成。MEMS微电容极头部分包含 接收声音的硅振膜和硅背极,硅振膜可直接将接收到的音频信号 经MEMS微电容传感器传输给微集成电路,微集成电路可将高阻 的音频电信号转换并放大成低阻的音频电信号,同时经RF抗噪电 路滤波,输出与手机前置电路相匹配的电信号.完成“声--电”转 换.
Performance Comparison
Specification
MEMS Microphone
Frequency range
100-10,000Hz
Sensitivity (0dB=1V/Pa @1k Hz) -42dB+/-3dB
Output impedance
<100 Ω max
Signal to noise ratio (SNR)
MEMS Microphone
Packaging
Wafer Foundry Wafer Testing
Incoming Inspection
Wafer Inspection
Wafer Sawing
Wafer Expand
SMT/glueing
Pick up and place MEMS
Wire Bonding
-38+/-4
Packaging/Cutting
Testing / Marking / Taping
Shipping Inspection
Packing
Reliability Test
MEMS Microphone 产品简介
Application of Product
MEMS Wafer Fab. < MEMS Microphone >
>58dB
RF-filtering capacitance
10pF, 33pF, both or none
Change in sensitivity(电压特性) <1dB across voltage range
Standard operating temperature -40℃ to + 100℃
P/N SM0102
Figure
MEMS Microphone
Dimensions [mm]
Sensitivity [dB]
(Vs=2.0V)
3.76(W)x6.15(L)x1.45(H)
Leabharlann Baidu
-42+/-4
* SM0103
3.76(W)x4.72(L)x1.45(H)
-42+/-4
* SM0104
3.76(W)x4.72(L)x1.45(H)
MEMS Microphone 产品简介
MEMS Microphone Presentation
MEMS Microphone
1. 体积小. 2. 便于SMT安装. 3. 耐高温,稳定性好. 4. 灵活的设计应用. 5. 兼容数字化发展. 6. 自动化程度高. 7. 适合大批量生产.
MEMS Microphone 产品简介