MEMS(数字)麦克风基本知识
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MEMS Microphone 产品简介
MEMS Microphone Presentation
1. 体积小. 2. 便于SMT安装. 3. 耐高温,稳定性好. 4. 灵活的设计应用. 5. 兼容数字化发展. 6. 自动化程度高.
MEMS Microphone
7. 适合大批量生产.
MEMS Microphone 产品简介
3.GROUND, 4.POWER
MEMS Microphone 产品简介
MEMS Microphone Structure
序号 1 2 3 4 5 6 7 8 名称 Cover Housing Wire bonding PC Board Capacitor 10pF Capacitor 33pF ASIC MEMS Die
MEMS Microphone Wafer & MEMS Die
MEMS Wafer
MEMS Die
MEMS Microphone 产品简介
MEMS Microphone Profile
4
Acoustic port hole
1
L
3
W H
PIN# FUNCTION 1.OUTPUT,
2
2.NO CONNECTION
MEMS Microphone 工作原理
MEMS麦克风是由MEMS微电容传感器、微集成转换电路 (放大器)、声腔及RF抗噪电路组成。MEMS微电容极头部分包含 接收声音的硅振膜和硅背极,硅振膜可直接将接收到的音频信号 经MEMS微电容传感器传输给微集成电路,微集成电路可将高阻 的音频电信号转换并放大成低阻的音频电信号,同时经RF抗噪电 路滤波,输出与手机前置电路相匹配的电信号.完成“声--电”转 换.
< MEMS Microphone >
MEMS Packaging
Notebook Computer, Desk-Top Computer Video Door Phone etc. Cordless Phone
MEMS Microphone 产品简介
Application of Product
MEMS Mic
MEMS Microphone
ቤተ መጻሕፍቲ ባይዱ
MEMS Microphone 产品简介
Recommended Interface Circuit
Term4
+ R2 +
R1
AAC MEMS Microphone
Term1
External Gain=-R1/R2 Term3. Term2. (Set by customer)
MEMS Mic
MEMS Microphone
List of Products
P/N Figure Dimensions [mm] Sensitivity [dB]
(Vs=2.0V)
SM0102
3.76(W)x6.15(L)x1.45(H)
-42+/-4
* SM0103
3.76(W)x4.72(L)x1.45(H)
-42+/-4
* SM0104
3.76(W)x4.72(L)x1.45(H)
-38+/-4
Wafer Expand Wafer Testing SMT/glueing Pick up and place MEMS
MEMS Microphone 产品简介
Application of Product
Cellular Phone(CDMA, GSM, PCS), Camcorder Phone, MP3 Phone, PDA Phone etc. Ear Phone MIC for Headsets, MP3, Bluetooth, etc. MEMS Wafer Fab. Camcorder, Digital Camera etc.
Vref
MEMS Microphone 产品简介
Solder Reflow Profile
Maximum solder profile: Do not exceed profile listed in this table
Stage Pro-head Solder Melt Peak Temperature Profile 170~180 ℃ Above 230 ℃ 260 ℃ Maximum Time (Maximum) 120sec. 100sec. 30sec.
MEMS Microphone 产品简介
MEMS Microphone Module Structure
Silicon diaphragm
RF Filter
GND
Silicon Back Plate
ASIC V out
MEMS Acoustic Sensor V supply
MEMS Microphone 产品简介
MEMS Microphone
Production Process
Wafer Fabrication Packaging
Incoming Inspection Wafer Foundry Wafer Inspection Wafer Sawing Packaging/Cutting Testing / Marking / Taping Shipping Inspection Packing Reliability Test Wire Bonding
MEMS Microphone 产品简介
Performance Comparison
Specification
Frequency range Sensitivity (0dB=1V/Pa @1k Hz) Output impedance Signal to noise ratio (SNR) RF-filtering capacitance Change in sensitivity(电压特性) Standard operating temperature Current consumption Supply voltage ratings 100-10,000Hz -42dB+/-3dB <100 >58dB 10pF, 33pF, both or none <1dB across voltage range -40℃ to + 100℃ 0.25mA 1.5V to 3.6V max
MEMS Microphone Presentation
1. 体积小. 2. 便于SMT安装. 3. 耐高温,稳定性好. 4. 灵活的设计应用. 5. 兼容数字化发展. 6. 自动化程度高.
MEMS Microphone
7. 适合大批量生产.
MEMS Microphone 产品简介
3.GROUND, 4.POWER
MEMS Microphone 产品简介
MEMS Microphone Structure
序号 1 2 3 4 5 6 7 8 名称 Cover Housing Wire bonding PC Board Capacitor 10pF Capacitor 33pF ASIC MEMS Die
MEMS Microphone Wafer & MEMS Die
MEMS Wafer
MEMS Die
MEMS Microphone 产品简介
MEMS Microphone Profile
4
Acoustic port hole
1
L
3
W H
PIN# FUNCTION 1.OUTPUT,
2
2.NO CONNECTION
MEMS Microphone 工作原理
MEMS麦克风是由MEMS微电容传感器、微集成转换电路 (放大器)、声腔及RF抗噪电路组成。MEMS微电容极头部分包含 接收声音的硅振膜和硅背极,硅振膜可直接将接收到的音频信号 经MEMS微电容传感器传输给微集成电路,微集成电路可将高阻 的音频电信号转换并放大成低阻的音频电信号,同时经RF抗噪电 路滤波,输出与手机前置电路相匹配的电信号.完成“声--电”转 换.
< MEMS Microphone >
MEMS Packaging
Notebook Computer, Desk-Top Computer Video Door Phone etc. Cordless Phone
MEMS Microphone 产品简介
Application of Product
MEMS Mic
MEMS Microphone
ቤተ መጻሕፍቲ ባይዱ
MEMS Microphone 产品简介
Recommended Interface Circuit
Term4
+ R2 +
R1
AAC MEMS Microphone
Term1
External Gain=-R1/R2 Term3. Term2. (Set by customer)
MEMS Mic
MEMS Microphone
List of Products
P/N Figure Dimensions [mm] Sensitivity [dB]
(Vs=2.0V)
SM0102
3.76(W)x6.15(L)x1.45(H)
-42+/-4
* SM0103
3.76(W)x4.72(L)x1.45(H)
-42+/-4
* SM0104
3.76(W)x4.72(L)x1.45(H)
-38+/-4
Wafer Expand Wafer Testing SMT/glueing Pick up and place MEMS
MEMS Microphone 产品简介
Application of Product
Cellular Phone(CDMA, GSM, PCS), Camcorder Phone, MP3 Phone, PDA Phone etc. Ear Phone MIC for Headsets, MP3, Bluetooth, etc. MEMS Wafer Fab. Camcorder, Digital Camera etc.
Vref
MEMS Microphone 产品简介
Solder Reflow Profile
Maximum solder profile: Do not exceed profile listed in this table
Stage Pro-head Solder Melt Peak Temperature Profile 170~180 ℃ Above 230 ℃ 260 ℃ Maximum Time (Maximum) 120sec. 100sec. 30sec.
MEMS Microphone 产品简介
MEMS Microphone Module Structure
Silicon diaphragm
RF Filter
GND
Silicon Back Plate
ASIC V out
MEMS Acoustic Sensor V supply
MEMS Microphone 产品简介
MEMS Microphone
Production Process
Wafer Fabrication Packaging
Incoming Inspection Wafer Foundry Wafer Inspection Wafer Sawing Packaging/Cutting Testing / Marking / Taping Shipping Inspection Packing Reliability Test Wire Bonding
MEMS Microphone 产品简介
Performance Comparison
Specification
Frequency range Sensitivity (0dB=1V/Pa @1k Hz) Output impedance Signal to noise ratio (SNR) RF-filtering capacitance Change in sensitivity(电压特性) Standard operating temperature Current consumption Supply voltage ratings 100-10,000Hz -42dB+/-3dB <100 >58dB 10pF, 33pF, both or none <1dB across voltage range -40℃ to + 100℃ 0.25mA 1.5V to 3.6V max