LF Deveopment for Future Needs handout
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Au: 3~9 nm (0.1~0.3µ”)
Low Cost
3-layer structure 三层结构
Pd: 20~100 nm (0.8~4µ”) Ni: 0.5~2.0 µm (20~80µ”)
Leadframe base metal
ASM Pacific Technology Ltd. © 2007
Low Cost
DFN 8L
ASM Pacific Technology Ltd. © 2007
Application Specific 特殊应用
ASM Pacific Technology Ltd. © 2007
Flip Chip Device Forecast
倒装芯片封装体的预测
Application Specific
Vs typical design 140units 与普通型比较 Density 密度: +83% Material consumption: -21% 材料耗用
Low Cost
MSOP 8L/10L (320unit)
Vs typical design 100units 与普通型比较 Density 密度: +220% Material consumption: -51% 材料耗用
Series1
Jul-05
Nov-05
Jul-06
Nov-06
Jan-05
Jan-06
Month
Series1
M onth
ASM Pacific Technology Ltd. © 2007
Jan-07
Low Cost 低成本
ASM Pacific Technology Ltd. © 2007
Open Tool Leader
Leadframe Development For Future Needs
引线框架的未来发展
ASM Pacific Technology Ltd. © 2007
Electronic Component Packaging Needs
芯片封装件的需求
Low Cost 低成本 High Performance 高性能 Application Specific 特殊应用
Low Cost
ASM Pacific Technology Ltd. © 2007
High Density Matrix
高密度矩阵
SO 8L (256unit)
Low Cost
TSSOP / MSOP 8L (320unit)
TQFP (7x7) 48L (60unit)
QFN 3L - MCD (8,816unit)
公用模具的领先者
SOJ SC70
Low Cost
TQFP 14x14 PDIP SOT23 TSSOP TQFP 14x20
TSOP(I) SOP MSOP SSOP
ASM Pacific Technology Ltd. © 2007
Open Tool Advantages
公用模具的优势
• Save cost in expensive precision tooling 节省模具的开发费用 • Low leadframe cost due to economy of scale 规模效益可降低引線框架的制造成本 • Short delivery lead time due to common parts in production 主流产品的交货周期较短 • Perfection in leadframe design as tuned by various customers 吸纳不同客户的反馈使引线框架的设计力臻 完美
Low Cost
Quality control 质量控制
Short measuring time 测量时间短 Used in routine IPQC 可用于日常的IPQC检查中使用
ASM Pacific Technology Ltd. © 2007
Thermal Devices Forecast
内脚反向打凹的产品
Using lead up-bending (reverse downset) to simulate half-material-thickness feature of etched frame 模拟腐蚀片中半腐蚀的特性，将内脚反向打凹 Increasing inquiry with diversified pkg designs 应用于不同的封装类形 TEP 5L DFN 6L
Source: The Worldwide IC Packaging Market 2007 Edition
ASM Pacific Technology Ltd. © 2007
Material Price Trend
原材wk.baidu.com格走勢
Trend of LME Copper Price
USD/MT
USD/MT
Shipment (Million Units)
Low Cost
Cumulative Production
Close to 1 billion units!
Oct,05
Feb,05
Feb,06
Mar,05
Mar,06
May,05
May,06
Nov,05
Dec,05
Oct,06
Jan,06
Jun,06
Source: IC Packaging Materials 2006 Edition
2009
2010
ASM Pacific Technology Ltd. © 2007
Typical Plating Scheme
典型的电镀规格
3-layer structure (Ni/Pd/Au) 三层结构（镍/钯/金） Pd at min 20nm (0.8µ”) 钯厚度最少20纳米
ASM Pacific Technology Ltd. © 2007
Power Device
功率器件
较厚的原材料厚度可加快热量的扩散
Thick material (0.50mm) to enhance thermal dissipation
Application Specific
ASM Pacific Technology Ltd. © 2007
High Performance 高性能
ASM Pacific Technology Ltd. © 2007
High Pin Count QFN QFN 高腳數的QFN
Nov-05 May-05 May-06 Nov-06 Jul-05 Jan-05 Jan-06 Jul-06 Mar-05 Mar-06 Jan-07 Sep-05 Sep-06 Mar-07
Latest (4-May) : 684.8
450 400 350 300 250 200
May-05 May-06 Mar-05 Mar-06 Sep-05 Sep-06 Mar-07
Thin Pd PPF PPF
薄钯的预电镀框架
Thinner Pd for lower leadframe cost 薄钯可降低框架成本
Reduction from min 20nm to 10nm (0.8µ” to 0.4µ”)
减低钯镀层的厚度 Au: 3~9 nm (0.1~0.3µ”) Pd: 10~100 nm (0.4~4µ”) Ni: 0.5~2.0 µm (20~80µ”)
Apr,05
Apr,06
Palladium Pre-plated Frame Pre-plated
镍钯金预电镀框架
Increasing demand 渐成主流
Support green packaging (lead-free) 滿足 ’无铅’ 环保要求 Lower assembly cost due to elimination of solder plating process 省去封装过程中的镀锡工序从而进一步降低封装成本
Jul,06
Nov,06
June,05
ASM Pacific Technology Ltd. © 2007
Sep, 06
Aug,05
Aug,06
Dec,06
July,05
Sep,05
1000 900 800 700 600 500 400 300 200 100 0
Start launching to market
Trend of LME Nickel Price
60,000
8,000 7,000 6,000 5,000 4,000 3,000 2,000 1,000 May-05 May-06 Mar-05 Mar-06 Nov-05 Nov-06 Sep-05 Sep-06 Mar-07 Jan-05 Jan-06 Jan-07 Jul-05 Jul-06
Low Cost
Leadframe base metal
ASM Pacific Technology Ltd. © 2007
Thin Plating Measurement
薄钯电镀层的测量
State-of-the-art capability
顶级的测量能力 Good resolution 微细的分辨率 2.5Å (0.01µ”) Good accuracy 微细的精确度 10nm Pd at +/- 12.5Å 10 纳米厚度的钯层 VXR (精准度达 +/- 0.8纳米) Good applicability 灵活的应用范围 Measurement area 75nm, i.e. any spot on the lead surface 测量区域 > 75纳米,也就是脚表面的任何位置
TSSOP 8L (320unit)
Vs typical design 100units 与普通型比较 Density 密度: +220% Material consumption: -51% 材料耗用
ASM Pacific Technology Ltd. © 2007
Field Proven By Volume Production SO 8L 256units
散热型封装件的预测
Low Cost
Source: IC Packaging Materials 2006 Edition
ASM Pacific Technology Ltd. © 2007
Thermal Enhancement Feature
增强散热性
1.
Low Cost
Heat Spreader (expensive) 外接散热片（昂贵） MSOP (D/S 0.43mm)
Month
Series1
Month
Series1
USD / Troy Ounce 15.00
Trend of Silver Price
USD / Troy Ounce
700 650
Trend of Gold Price
13.00
Latest (4-May) :
600 550 500
11.00 9.00 7.00 5.00 3.00
ASM Pacific Technology Ltd. © 2007
New Platform For Small Package
小型封裝件的最新框架设计
Standard frame size 70x238mm, easy conversion 统一的框架外形尺寸, 方便产品转换
SO 8L (256unit)
70000 60000 50000 Units (M)
Low Cost
Leadframe Finish Forecast
Pd PPF
40000 30000 20000 10000 0 2005 2006 2007 Year 2008
Ni/Pd/Au PPF Sn/Pb Matte Tin Sn/Bi Sn/Ag/Cu Sn/Cu
Additional metal slug
LQFP (D/S 0.80mm)
2.
Exposed DAP by deep downset 深度打凹使矽座外露
Exposed DAP by Deep D/S
ASM Pacific Technology Ltd. © 2007
Lead Up-set Products Up-set
Latest (4-May): 8225.0
Latest (4-May): 52,600
50,000 40,000 30,000 20,000 10,000 Nov-05 Nov-06 Jan-05 Jul-05 Jan-06 Jul-06 Mar-05 Mar-06 Jan-07 May-05 May-06 Sep-05 Sep-06 Mar-07
Low Cost
3-layer structure 三层结构
Pd: 20~100 nm (0.8~4µ”) Ni: 0.5~2.0 µm (20~80µ”)
Leadframe base metal
ASM Pacific Technology Ltd. © 2007
Low Cost
DFN 8L
ASM Pacific Technology Ltd. © 2007
Application Specific 特殊应用
ASM Pacific Technology Ltd. © 2007
Flip Chip Device Forecast
倒装芯片封装体的预测
Application Specific
Vs typical design 140units 与普通型比较 Density 密度: +83% Material consumption: -21% 材料耗用
Low Cost
MSOP 8L/10L (320unit)
Vs typical design 100units 与普通型比较 Density 密度: +220% Material consumption: -51% 材料耗用
Series1
Jul-05
Nov-05
Jul-06
Nov-06
Jan-05
Jan-06
Month
Series1
M onth
ASM Pacific Technology Ltd. © 2007
Jan-07
Low Cost 低成本
ASM Pacific Technology Ltd. © 2007
Open Tool Leader
Leadframe Development For Future Needs
引线框架的未来发展
ASM Pacific Technology Ltd. © 2007
Electronic Component Packaging Needs
芯片封装件的需求
Low Cost 低成本 High Performance 高性能 Application Specific 特殊应用
Low Cost
ASM Pacific Technology Ltd. © 2007
High Density Matrix
高密度矩阵
SO 8L (256unit)
Low Cost
TSSOP / MSOP 8L (320unit)
TQFP (7x7) 48L (60unit)
QFN 3L - MCD (8,816unit)
公用模具的领先者
SOJ SC70
Low Cost
TQFP 14x14 PDIP SOT23 TSSOP TQFP 14x20
TSOP(I) SOP MSOP SSOP
ASM Pacific Technology Ltd. © 2007
Open Tool Advantages
公用模具的优势
• Save cost in expensive precision tooling 节省模具的开发费用 • Low leadframe cost due to economy of scale 规模效益可降低引線框架的制造成本 • Short delivery lead time due to common parts in production 主流产品的交货周期较短 • Perfection in leadframe design as tuned by various customers 吸纳不同客户的反馈使引线框架的设计力臻 完美
Low Cost
Quality control 质量控制
Short measuring time 测量时间短 Used in routine IPQC 可用于日常的IPQC检查中使用
ASM Pacific Technology Ltd. © 2007
Thermal Devices Forecast
内脚反向打凹的产品
Using lead up-bending (reverse downset) to simulate half-material-thickness feature of etched frame 模拟腐蚀片中半腐蚀的特性，将内脚反向打凹 Increasing inquiry with diversified pkg designs 应用于不同的封装类形 TEP 5L DFN 6L
Source: The Worldwide IC Packaging Market 2007 Edition
ASM Pacific Technology Ltd. © 2007
Material Price Trend
原材wk.baidu.com格走勢
Trend of LME Copper Price
USD/MT
USD/MT
Shipment (Million Units)
Low Cost
Cumulative Production
Close to 1 billion units!
Oct,05
Feb,05
Feb,06
Mar,05
Mar,06
May,05
May,06
Nov,05
Dec,05
Oct,06
Jan,06
Jun,06
Source: IC Packaging Materials 2006 Edition
2009
2010
ASM Pacific Technology Ltd. © 2007
Typical Plating Scheme
典型的电镀规格
3-layer structure (Ni/Pd/Au) 三层结构（镍/钯/金） Pd at min 20nm (0.8µ”) 钯厚度最少20纳米
ASM Pacific Technology Ltd. © 2007
Power Device
功率器件
较厚的原材料厚度可加快热量的扩散
Thick material (0.50mm) to enhance thermal dissipation
Application Specific
ASM Pacific Technology Ltd. © 2007
High Performance 高性能
ASM Pacific Technology Ltd. © 2007
High Pin Count QFN QFN 高腳數的QFN
Nov-05 May-05 May-06 Nov-06 Jul-05 Jan-05 Jan-06 Jul-06 Mar-05 Mar-06 Jan-07 Sep-05 Sep-06 Mar-07
Latest (4-May) : 684.8
450 400 350 300 250 200
May-05 May-06 Mar-05 Mar-06 Sep-05 Sep-06 Mar-07
Thin Pd PPF PPF
薄钯的预电镀框架
Thinner Pd for lower leadframe cost 薄钯可降低框架成本
Reduction from min 20nm to 10nm (0.8µ” to 0.4µ”)
减低钯镀层的厚度 Au: 3~9 nm (0.1~0.3µ”) Pd: 10~100 nm (0.4~4µ”) Ni: 0.5~2.0 µm (20~80µ”)
Apr,05
Apr,06
Palladium Pre-plated Frame Pre-plated
镍钯金预电镀框架
Increasing demand 渐成主流
Support green packaging (lead-free) 滿足 ’无铅’ 环保要求 Lower assembly cost due to elimination of solder plating process 省去封装过程中的镀锡工序从而进一步降低封装成本
Jul,06
Nov,06
June,05
ASM Pacific Technology Ltd. © 2007
Sep, 06
Aug,05
Aug,06
Dec,06
July,05
Sep,05
1000 900 800 700 600 500 400 300 200 100 0
Start launching to market
Trend of LME Nickel Price
60,000
8,000 7,000 6,000 5,000 4,000 3,000 2,000 1,000 May-05 May-06 Mar-05 Mar-06 Nov-05 Nov-06 Sep-05 Sep-06 Mar-07 Jan-05 Jan-06 Jan-07 Jul-05 Jul-06
Low Cost
Leadframe base metal
ASM Pacific Technology Ltd. © 2007
Thin Plating Measurement
薄钯电镀层的测量
State-of-the-art capability
顶级的测量能力 Good resolution 微细的分辨率 2.5Å (0.01µ”) Good accuracy 微细的精确度 10nm Pd at +/- 12.5Å 10 纳米厚度的钯层 VXR (精准度达 +/- 0.8纳米) Good applicability 灵活的应用范围 Measurement area 75nm, i.e. any spot on the lead surface 测量区域 > 75纳米,也就是脚表面的任何位置
TSSOP 8L (320unit)
Vs typical design 100units 与普通型比较 Density 密度: +220% Material consumption: -51% 材料耗用
ASM Pacific Technology Ltd. © 2007
Field Proven By Volume Production SO 8L 256units
散热型封装件的预测
Low Cost
Source: IC Packaging Materials 2006 Edition
ASM Pacific Technology Ltd. © 2007
Thermal Enhancement Feature
增强散热性
1.
Low Cost
Heat Spreader (expensive) 外接散热片（昂贵） MSOP (D/S 0.43mm)
Month
Series1
Month
Series1
USD / Troy Ounce 15.00
Trend of Silver Price
USD / Troy Ounce
700 650
Trend of Gold Price
13.00
Latest (4-May) :
600 550 500
11.00 9.00 7.00 5.00 3.00
ASM Pacific Technology Ltd. © 2007
New Platform For Small Package
小型封裝件的最新框架设计
Standard frame size 70x238mm, easy conversion 统一的框架外形尺寸, 方便产品转换
SO 8L (256unit)
70000 60000 50000 Units (M)
Low Cost
Leadframe Finish Forecast
Pd PPF
40000 30000 20000 10000 0 2005 2006 2007 Year 2008
Ni/Pd/Au PPF Sn/Pb Matte Tin Sn/Bi Sn/Ag/Cu Sn/Cu
Additional metal slug
LQFP (D/S 0.80mm)
2.
Exposed DAP by deep downset 深度打凹使矽座外露
Exposed DAP by Deep D/S
ASM Pacific Technology Ltd. © 2007
Lead Up-set Products Up-set
Latest (4-May): 8225.0
Latest (4-May): 52,600
50,000 40,000 30,000 20,000 10,000 Nov-05 Nov-06 Jan-05 Jul-05 Jan-06 Jul-06 Mar-05 Mar-06 Jan-07 May-05 May-06 Sep-05 Sep-06 Mar-07