最新memory
最新memory的歌词中文翻译
memory的歌词中文翻译midnightnot a sound from the pavementhas the moon lost her memory?she is smiling alonein the lamplightthe withered leaves collect at my feet and the wind begins to moanmemoryall alone in the moonlighti can smile at the old dayslife was beautiful theni rememberthe time i knew what happiness was let the memory live againevery street lampseems to beata fatalistic warningsomeone muttersand a street lamp guttersand soon it will be morningdaylighti must wait for the sunrisei must think of a new lifeand i mustn't give inwhen the dawn comestonight will be a memory tooand a new day will beginburnt out ends of smoky daysthe stale cold smell of morningthe street lamp diesanother night is overanother day is dawningtouch meit's so easy to leave meall alone with my memoryof my days in the sunif you touch meyou'll understand what happiness is look a new day has begun 午夜,路上寂静无声,月儿是否也失去记忆?他笑得多孤寂,街灯下,枯叶在我的脚下堆积,风儿也开始叹息。
MEMORY存储芯片MAX202EPE+中文规格书
400kΩ
T1 +5V
4 T2IN
400kΩ
T2 +5V
TTL/CMOS INPUTS
14 T3IN
400kΩ
T3 +5V
15 T4IN
400kΩ
T4 +5V
19 T5IN
400kΩ T5
V+ 9
0.1µF +6.3V
V- 13
0.1µF +16V
T1OUT 2
T2OUT 3
T3OUT 1
RS-232 OUTPUTS
Benefits and Features
● Saves Board Space • Integrated Charge Pump Circuitry Eliminates the Need for a Bipolar ±12V Supply Enables Single Supply Operation From Either +5V or 9V to +12V
General Description
MAX200-MAX209, MAX211, and MAX213 are a family of RS-232 and V.28 transceivers with integrated charge pump circuitry for single +5V supply operation.
(derate 9.09mW/°C above +70°C)............................727mW 24-Pin Wide SO (derate 11.76mW/°C above +70°C)...941mW 24-Pin SSOP (derate 8.00mW/°C above +70°C).........640mW 24-Pin CERDIP (derate 12.50mW/°C above +70°C)....1000mW 28-Pin Wide SO (derate 12.50mW/°C above +70°C)...1000mW 28-Pin SSOP (derate 9.52mW/°C above +70°C).........762mW Operating Temperature Ranges MAX2_ _C_ _......................................................0°C to +70°C MAX2_ _E_ _.................................................. -40°C to +85°C MAX2_ _ M_ _............................................... -55°C to +125°C Storage Temperature Range............................. -65°C to +160°C Lead Temperature (soldering, 10s) (Note 1).................... +300°C
2019欧美最新歌曲《Memories》介绍
2019欧美最新歌曲《Memories》介绍 《memories》,是《squirrel24-memories》视频的背景⾳乐,风格为Gothic Metal/Black Metal(歌特/⿊⾊⾦属),该曲⽬主唱是Sharon Janny den Adel ,⾪属于荷兰诱惑本质乐队(Within Temptation),该乐队成⽴于1996年。
⼤约于1995、1996年开始,⾃从荷兰的美声歌德⾦属乐团The Gathering在欧洲⼤放异彩之后,使得这样的美声式柔美⾦属乐型式,逐渐受到愈来愈多乐迷的喜爱。
《memories》歌曲歌词 Memories 回忆(within temptation乐队) In this world you tried 在这个世界上你努⼒着 Not leaving me alone behind 不把我丢下 There’s no other way 除此没有其他的选择 I’ll pray to the Gods let him stay 我将祈求上苍让他留下 The memories ease the pain inside 那回忆抚平我内⼼的伤⼝ Now i know why 现在我终于知道为什么了 All of my memories 我所有的回忆 Keep you near 都将你留在我⾝旁 In silent moment 在沉默的时刻 Imagine you’d be here 想象你就在那 All of my memories 我所有的记忆 Keep you near 让你在我⾝边 The silent whispers 那些喃喃私语 The silent tears 那些⽆⾔的泪滴 Made me a promise i’d try 给我⼀个承诺我会尽⼒ To find my way back in this life 回到今⽣ I hope there is a way 我希望有⼈能指引 To give me a sign you’re okay 给我你还平安的讯号 Reminds me again 再⼀次提醒我 It’s worth it all 那是⽆价之宝 So I can go home 这样,我就能回家了。
电子信息工程专业英语Lesson 15 Memory (存储器)翻译
存储器是计算机存储程序和数据的一部分。
专业术语“memory”经常指的是位于计算机内部的存储。
它也被称为实际存储器或主存储器,并且表现为大量的KB。
每一KB相当于1024字节,并且每一字节相当于8比特。
主存储器的主要功能是作为CPU和计算机系统其他组件的媒介。
它类似一个桌面,你可以把干活急需的东西放在上面。
CPU只使用存储在主存储器的软件指令和数据。
正如你所知道的,主存储器是一个随机存储器,或者称为RAM。
这命名鉴于这么一个事实——数据在电子主芯片中可以随意存放和恢复,而且不管数据在何处,存放和恢复的时间差不多是相同的。
主存储器是一个电子设备生产的不稳定的状态。
当电脑关机了,主存储器就清空了;当打开时,主存储器能够接收和保留一份软件指令和所需处理的数据。
由于主存储器是一种波动形式,它取决于电源并且电源也可能在处理过程中断电,用户通常将他们的工作保存到永久性存储设备,如磁盘或硬盘。
通常来说,主存储器主要是用于如下几个目的:Storage of a copy of the main software program that controls the general operation of the computer(储存一份用于控制计算机一般操作的主要的软件程序)。
当计算机打开时,这份拷贝被加载到主存储器中,并且它一直在那里只要计算机打开。
临时存储的应用程序指令由CPU检索用于解释和执行t emporary storage of data that has been input from the keyboard or other input device until instructions call for the data to be transferred into the CPU for processing(临时存储的数据已经从键盘或其他输入设备输入,直到指令调用的数据被转移到CPU迚行处理)t emporary storage of data that has been produced as a result of process until instructions call for the data to be used again in subsequent process or to be transferred to an output device such as the screen,a printer,or a disk storage device(由于处理的结果,临时存储的数据已经产生了,在接下来的迚程或将被转移到一个输出设备例如显示器,打印机,或者一块磁盘存储设备,直到指令调用数据将再次被使用)几种半导体存储器芯片被用于主存储器中。
memory词源
memory词源Memory一词源于拉丁语的'memoria',意为'记忆、回忆'。
这个词源又可以追溯到古希腊语的'mneme',意为'记忆、提醒'。
在古代文化中,记忆被视为一个重要的能力,它有助于人们记录和传递知识、经验和故事。
记忆是人类大脑中的一个关键功能,它使我们能够存储、保持和检索过去的经历和信息。
记忆可以分为短期记忆和长期记忆两种类型。
短期记忆是指能够记住和处理信息的能力,但这些信息很快会被遗忘。
长期记忆是指能够长期保存和回忆信息的能力。
记忆的形成和存储是一个复杂的过程,涉及到大脑中多个区域和神经元之间的相互作用。
当我们经历某个事件或学习新知识时,大脑会对相关的神经元进行调整和连接,从而形成新的神经网络。
这些网络在我们回忆和提取信息时发挥重要作用。
科学研究表明,记忆受到多种因素的影响,包括情绪、注意力、意识状态和睡眠等。
情绪可以在一定程度上增强或阻碍记忆的形成和回忆。
注意力和意识状态则决定了我们对信息的注意和处理程度。
睡眠被认为是记忆巩固的重要过程,它可以帮助我们将短期记忆转化为长期记忆。
在日常生活中,人们使用各种方法来改善记忆能力。
例如,通过反复学习和复习可以帮助记忆的巩固。
使用记忆技巧,如联想、编码和组织信息,也可以提高记忆效果。
此外,保持身体健康、保持良好的睡眠习惯和控制压力等,也对记忆力有积极的影响。
总而言之,记忆是人类大脑中重要的功能之一,它不仅帮助我们存储和回忆过去的经历和信息,还对学习、决策和问题解决等认知活动起到关键的作用。
对记忆的研究不仅有助于我们更好地了解人类思维和认知过程,还为改善记忆能力提供了科学依据。
memory作文50字英文
memory作文50字英文英文,Memory is a fascinating topic that has always intrigued me. It is the ability of our brain to retain and recall information from the past. Memory can be dividedinto short-term and long-term memory. Short-term memory is the ability to hold information for a short period of time, while long-term memory is the ability to store information for a longer period of time. Our memory can be affected by various factors such as age, stress, and sleep.中文,记忆是一个迷人的话题,一直让我感到好奇。
它是我们的大脑保留和回忆过去信息的能力。
记忆可以分为短期记忆和长期记忆。
短期记忆是在短时间内保持信息的能力,而长期记忆是在较长时间内存储信息的能力。
我们的记忆会受到各种因素的影响,如年龄、压力和睡眠。
英文,Our memory plays a crucial role in our daily lives. It helps us to remember important information such as our phone numbers, addresses, and even our loved ones' birthdays. Without memory, we would not be able to learn,grow, or even function properly. For example, imaginetrying to cook a meal without remembering the ingredientsor steps. It would be impossible!中文,我们的记忆在我们的日常生活中扮演着至关重要的角色。
Memory 简介
DDR II 800 SDRAM的核心频率/时钟频率/数据传输率分 别是200MHz/400MHz/800Mbps。
DDR II 800 SDRAM的核心频率和DDR I 400是一样的, 但是DDR II 800的数据传输率是DDR I 400的两倍。 因此,DDR-Ⅱ虽然实现了4-bit预取,但在实际效能上,与 DDR是一样的。因此在相同的核心频率下,DDR-Ⅱ达到了 两倍于DDR的的带宽的水帄有一个前提条件,那就是DDRⅡ的外部时钟频率也是DDR和SDRAM的两倍。
封装
目前DDR内存主要采用TSOP-Ⅱ封装(引脚),而在DDRⅡ时 代,TSOP-Ⅱ封装将彻底退出内存封装市场,改用更先进的 CSP(FBGA)无铅封装技术(球型),它是比TSOP-Ⅱ更为 贴近芯片尺寸的封装方法,并且由于在晶圆上就做好了封装 布线,在可靠性方面可以达到了更高的水帄。 CSP封装具有以下特点: 1.满足了芯片I/O引脚不断增加的需要 (DDR:184pin,DDRII:240pin)。 2.芯片面积与封装面积之间的比值很小(封装后的IC尺寸边 长不大于芯片的1.2倍)。 3.极大地缩短延迟时间(DDR:2.9ns,DDRII:1.8ns~2.2ns)
在DDR I SDRAM中,核心频率和时钟频率是一样的,而数 据传输率是时钟频率的两倍。
DDR也就是Double Data Rating内存可以在每个时钟周期 的上升延和下降延传输数据,也就是一个时钟周期可以传输 2bit数据,因此DDR I的数据传输率是时钟频率的两倍。以 DDR266 SDRAM为例,它的核心频率/时钟频率/数据传输 率分别是133MHz/133MHz/266Mbps。 JEDEC(电子元件工业协会)标准中的DDR I SDRAM的最高 标准是DDR400,它的核心频率/时钟频率/数据传输率分别 是200MHz/200MHz/400Mbps。
memory测试方法原理
Memory测试方法及原理memory RAM压力测试QDUTT测试测试目的:用于验证DDR 性能。
测试方法:A.将平台产品分别置于高温75°C,低温-30°C,运行QDUTT软件,并按照如下参数设置:B.测试项:dqlineshmoo; calineshmooMbn文件:ddi文件参数设置:dqROUT/caROUT:4CLKlevel:11Rwtype:默认不更改VREF:对应毫伏,数字表示(如0.6V则对应输入600)Start_address:默认不更改Test_size:默认不更改C.用直流电源给Memory的VREF引脚供电,供电范围为0.45V~0.75V。
D. 根据LOG分析测试结果。
QMVS测试测试目的:用于验证不同温度下DDR的稳定性能。
测试方法:测试环境测试时长测试数量常温48H 2PCS高温12H 2PCS低温12H 2PCS环境搭建:1.安装python工具和vs_Community工具2.在cmd安装swsys-qmvs-1.6.51.运行QMVS确保所有设备在不同设备ID的ADB设备中列出。
在CMD窗口中,输入以下命令来启动QMVS DDR:常温:test-suite –t C:\Auths\UrdNe\AppDATa\ROMAM\NPM\NoDEYMasksSWSyqMVS \TestBysStudio\8909JSON(对应平台)高低温:test-suite –t C:\Users\UserName\AppData\Roaming\npm\node_modules\swsys-qmvs\test_configs\8909_tempchamber.json3.脚本运行48H(常温)/12H(高低温)后自动停止,log自动保存:C:\temp\swsys目录下Memtester测试测试目的:测试不同的温度和电压压力环境下,Memory系统是否会受到影响。
MEMORY介绍
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DDRI与DDR2相关规格比较
DDR 與 DDR2 記憶體相關規格 記憶體顆粒 核心工作時脈 DDR266 SDRAM 133MHz DDR333 SDRAM 166MHz DDR400 SDRAM 200MHz DDR2-400 SDRAM DDR2-533 SDRAM DDR2-667 SDRAM 200MHz 267MHz 333MHz
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DDR-SDRAM采用184针DIMM模块,目前主要 有以下几种速率:PC1600(200MHz), PC2100(266MHz),PC2700(333MHz), PC3200(400MHz),PC3500(433MHz), PC3700(466MHz),PC400(500MHz), PC4200(533MHz)和PC4400(566MHz)。 名称中的第一个数字,如“PC2100”意为此内 存模块的最大带宽,也就是每秒最大能够提供多 少MB的数据。后面的MHz是此内存运行时的时 钟速率。单根DDR-SDRAM的容量从64MB到 2GB不等。
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内存的最初形式
早期的内存:在计算机诞生初期并不存在内 存条的概念,那时的内存均被焊接在主板上, 以内存芯片的形式为计算机的运算提供直接 支持。那时的内存芯片容量都特别小,最常 见的莫过于256K×1bit、1M×4bit,虽然如此, 但这相对于那时的运算任务来说却已经绰绰 有余了。
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规格及相关术语讲解
最新电子产品英文术语大全
品质管理电子产品的英文术语大全从事品质工作以来积累的常用英语,希望对有需要的朋友有所帮助!品质专业英语大全零件材料类的专有名词CPU: central processing unit(中央处理器)IC: Integrated circuit(集成电路)Memory IC: Memory Integrated circuit(记忆集成电路)RAM: Random Access Memory(随机存取存储器)DRAM: Dynamic Random Access Memory(动态随机存取存储器)SRAM: Staic Random Access Memory(静态随机存储器)ROM: Read-only Memory(只读存储器)EPROM:Electrical Programmable Read-only Memory(电可抹只读存诸器)EEPROM: Electrical Erasbale Programmable Read-only Memory(电可抹可编程只读存储器)CMOS: Complementary Metal-Oxide-Semiconductor(互补金属氧化物半导体)BIOS: Basic Input Output System(基本输入输出系统)Transistor:电晶体LED:发光二极体Resistor:电阻Variator:可变电阻Capacitor:电容Capacitor array:排容Diode:二极体Transistor:三极体Transformer:变压器(ADP)Oscillator:频率振荡器(0sc)Crystal:石英振荡器XTAL/OSC:振荡产生器(X)Relay:延时器Sensor:感应器Bead core:磁珠Filter:滤波器Flat Cable:排线Inductor:电感Buzzer:蜂鸣器Socket:插座Slot:插槽Fuse:熔断器Current:电流表Solder iron:电烙铁Magnifying glass:放大镜Driver:螺丝起子Oven:烤箱TFT:液晶显示器Oscilloscope:示波器Connector:连接器PCB:printed circuit board(印刷电路板)PCBA: printed circuit board assembly(电路板成品)PP:并行接口HDD:硬盘FDD:软盘PSU:power supply unit(电源供应器)SPEC:规格Attach:附件Case: 机箱,盖子Cover:上盖Base:下盖Bazel:面板(panel)Bracket:支架,铁片Lable:贴纸Guide:手册Manual:手册,指南Card:网卡Switch:交换机Hub:集线器Router:路由器Sample:样品Gap:间隙Sponge:海绵Pallet:栈板Foam:保利龙Fiber:光纤Disk:磁盘片PROG:程序Barcode:条码System:系统System Barcode:系统条码M/B:mother board:主板CD-ROM:光驱FAN:风扇Cable:线材Audio:音效K/B:Keyboard(键盘)Mouse:鼠标Card reader:读卡器Screw:螺丝Thermal pad:散热垫Heat sink:散热片Rubber:橡胶垫Rubber foot:脚垫Bag:袋子Washer:垫圈Sleeve:袖套Config:机构Label hi-pot:高压标签Firmware label:烧录标签Metal cover:金属盖子Plastic cover:塑胶盖子Tape for packing:包装带Bar code:条码Tray:托盘Collecto:集线夹Holder:固定器,L铁Connecter:连接器IDE:集成电路设备,智能磁盘设备SCSI:小型计算机系统接口Gasket:导电泡棉AGP:加速图形接口PCI:周边组件扩展接口LAN:局域网USB:通用串形总线架构Slim:小型化COM:串型通讯端口LPT:打印口,并行口Power cord:电源线I/O:输入,输出Speaker:扬声器EPE:泡棉Carton:纸箱Button:按键,按钮Foot stand:脚架部门名称的专有名词QS:Quality system品质系统CS:Coutomer Sevice 客户服务QC:Quality control品质管理IQC:Incoming quality control 进料检验LQC:Line Quality Control 生产线品质控制IPQC:In process quality control 制程检验FQC:Final quality control 最终检验OQC:Outgoing quality control 出货检验QA:Quality assurance 品质保证SQA:Source(supplier) Quality Assurance 供应商品质保证(VQA) CQA:Customer Quality Assurance客户质量保证PQA rocess Quality Assurance 制程品质保证QE:Quality engineer 品质工程CE:component engineering零件工程EE:equipment engineering设备工程ME:manufacturing engineering制造工程TE:testing engineering测试工程PPE roduct Engineer 产品工程IE:Industrial engineer 工业工程ADM: Administration Department行政部RMA:客户退回维修CSDI:检修PC:producing control生管MC:mater control物管GAD: General Affairs Dept总务部A/D: Accountant /Finance Dept会计LAB: Laboratory实验室DOE:实验设计HR:人资PMC:企划RD:研发W/H:仓库SI:客验PD: Product Department生产部PA:采购(PUR: Purchaing Dept)SMT:Surface mount technology 表面粘着技术MFG:Manufacturing 制造MIS:Management information system 资迅管理系统DCC:document control center 文件管制中心厂内作业中的专有名词QT:Quality target品质目标QP:Quality policy目标方针QI:Quality improvement品质改善CRITICAL DEFECT:严重缺点(CR)MAJOR DEFECT:主要缺点(MA)MINOR DEFECT:次要缺点(MI)MAX:Maximum最大值MIN:Minimum最小值DIA iameter直径DIM imension尺寸LCL:Lower control limit管制下限UCL:Upper control limit管制上限EMI:电磁干扰ESD:静电防护EPA:静电保护区域ECN:工程变更ECO:Engineering change order工程改动要求(客户)ECR:工程变更需求单CPI:Continuous Process Improvement 连续工序改善Compatibility:兼容性Marking:标记DWG rawing图面Standardization:标准化Consensus:一致Code:代码ZD:Zero defect零缺点Tolerance:公差Subject matter:主要事项Auditor:审核员BOM:Bill of material物料清单Rework:重工ID:identification识别,鉴别,证明PILOT RUN: (试投产)FAI:首件检查FPIR:First Piece Inspection Report首件检查报告FAA:首件确认SPC:统计制程管制CP: capability index(准确度)CPK: capability index of process(制程能力)PMP:制程管理计划(生产管制计划)MPI:制程分析DAS efects Analysis System 缺陷分析系统PPB:十亿分之一Flux:助焊剂P/N:料号L/N:Lot Number批号Version:版本Quantity:数量Valid date:有效日期MIL-STD:Military-Standard军用标准ICT: In Circuit Test (线路测试)ATE:Automatic Test Equipment自动测试设备MO: Manafacture Order生产单T/U: Touch Up (锡面修补)I/N:手插件P/T:初测F/T: Function Test (功能测试-终测)AS 组立P/K:包装TQM:Total quality control全面品质管理MDA:manufacturing defect analysis制程不良分析(ICT)RUN-IN:老化实验HI-pot:高压测试FMI:Frequency Modulation Inspect高频测试DPPM: Defect Part Per Million(不良率的一种表达方式:百万分之一) 1000PPM即为0.1%Corrective Action: (CAR改善对策)ACC:允收REJ:拒收S/S:Sample size抽样检验样本大小SI-SIV:Special I-Special IV特殊抽样水平等级CON:Concession / Waive特采ISO:国际标准化组织ISA:Industry Standard Architecture工业标准体制结构OBA:开箱稽核FIFO:先进先出PDCA:管理循环Plan do check action计划,执行,检查,总结(计划,实施,检查,处置) WIP:在制品(半成品)S/O: Sales Order (业务订单)P/O: Purchase Order (采购订单)P/R: Purchase Request (请购单)AQL:acceptable quality level允收品质水准LQL;Limiting quality level最低品质水准QVL:qualified vendor list合格供应商名册AVL :认可的供货商清单(Approved Vendor List)QCD: Quality cost delivery(品质,交期,成本)MPM:Manufacturing project management制造专案管理KPI:Key performance indicate重要绩效指标MVT:Manufacturing Verification Test制造验证试产Q/R/S:Quality/Reliability/Service质量/可靠度/服务STL:ship to line(料到上线)NTF:No trouble found误判CIP:capacity improvement plan(产能改善计划)MRB:material review board(物料审核小组)MRB:Material reject bill退货单JIT:just in time(即时管理)5S:seiri seiton seiso seiketsu shitsuke(整理,整顿,清扫,清洁,修养)SOP:standard operation process(标准作业程序)SIP:Specification inspection process制程检验规格TOP: Test Operation Process (测试作业流程)WI: working instruction(作业指导书)SMD:surface mounting device(表面粘着原件)FAR:failure aualysis report故障分析报告CAR:Corrective action report改善报告BPR:企业流程再造(Business Process Reengineering)ISAR :首批样品认可(Initial Sample Approval Request)-JIT:实时管理(Just In Time)QCC :品管圈(Quality Control Circle)Engineering Department (工程部)TQEM: Total Quality Environment Management(全面品质环境管理)PD: Production Department (制造)LOG: Logistics (后勤支持)Shipping: (进出口)AOQ:Average Output Quality平均出货质量AOQL:Average Output Quality Level平均出货质量水平FMEA:failure model effectiveness analysis失效模式分析CRB: Change Review Board (工程变更会议)CSA:Customer Simulate Analysis客户模拟分析SQMS:Supplier Quality Management System供应商品质管理系统QIT: Quality Improvement Team 品质改善小组QIP:Quality Improvement Plan品质改善计划CIP:Continual Improvement Plan持续改善计划M.Q.F.S: Material Quality Feedback Sheet (来料品质回馈单)SCAR: Supplier Corrective Action Report (供货商改善对策报告)8D Sheet: 8 Disciplines sheet ( 8D单)小组成立问题说明实施并验证临时措施确定并验证根本原因选择并验证永久纠正措施实施永久纠正措施预防再发生小组祝贺PDCA:PDCA (Plan-Do-Check-Action) (管理循环)MPQ: Material Packing Quantity (物料最小包装量)DSCN: Delivery Schedule Change Notice (交期变更通知)QAPS: Quality Assurance Process Sheet (品质工程表)DRP :运销资源计划(Distribution Resource Planning)DSS:决策支持系统(Decision Support System)EC :电子商务(Electronic Commerce)EDI :电子资料交换(Electronic Data Interchange)EIS :主管决策系统(Excutive Information System)ERP:企业资源规划(Enterprise Resource Planning)FMS :弹性制造系统(Flexible Manufacture System)KM :知识管理(Knowledge Management)4L :逐批订购法(Lot-for-Lot)LTC :最小总成本法(Least Total Cost)LUC :最小单位成本(Least Unit Cost)MES :制造执行系统(Manufacturing Execution System) MPS :主生产排程(Master Production Schedule)MRP :物料需求规划(Material Requirement Planning) MRPⅡ:制造资源计划(Manufacturing Resource Planning) OEM :委托代工(Original Equipment Manufacture)ODM :委托设计与制造(Original Design & Manufacture) OLAP:线上分析处理(On-Line Analytical Processing) OLTP:线上交易处理(On-Line Transaction Processing) OPT :最佳生产技术(Optimized Production Technology) PDCA:PDCA管理循环(Plan-Do-Check-Action)PDM:产品数据管理系统(Product Data Management)) RCCP:粗略产能规划(Rough Cut Capacity Planning) SCM :供应链管理(Supply Chain Management)SFC :现场控制(Shop Floor Control)TOC:限制理论(Theory of Constraints)TQC :全面品质管制(Total Quality Control)FYI/R:for your information/reference仅供参考ASAP:尽快S/T:Standard time标准时间TPM:total production maintenance:全面生产保养ESD Wrist strap:静电环IT:information technology信息技术,资讯科学CEO:Chief Executive Officer执行总裁COO:Chief Operaring Officer首席业务总裁SWOT:Strength,Weakness,Opportunity,Threat优势﹐弱点﹐机会﹐威胁Competence:专业能力Communication:有效沟通Cooperation:统御融合Vibration Testing:振动测试IDP:Individual Development Plan个人发展计划MRP:Material Requirement Planning物料需求计划MAT'S:Material材料LRR:Lot Rejeet Rate批退率ATIN:Attention知会3C:Computer ,Communication , Consumer electronic消费性电子5W1H:When , Where , Who , What , Why , Ho5M: Man , Machine , Material , Method , Measurement人,机器,材料,方法,测量4MIE: Man,Material,Machine,Method,Environment人力,物力,财务,技术,时间(资源)7M1I: Manpower , Machine , Material , Method, Market , Management , Money , Information 人力,机器,材料,方法, 市场,管理,资金,资讯1 Accuracy 准确度2 Action 行动3 Activity 活动4 Analysis Covariance 协方差分析5 Analysis of Variance 方差分析6 Approved 承认7 Attribute 计数值8 Average 平均数9 Balance sheet 资产负债对照表10 Binomial 二项分配11 Brainstorming Techniques 脑力风暴法12 Cause and Effect Matrix 因果图(鱼骨图)13 CL:Center Line 中心线14 Check Sheets 检查表15 Complaint 投诉16 Conformity 合格(符合)17 Control 控制18 Control chart 控制(管制)图19 Correction 纠正20 Correlation Methods 相关分析法21 CPI: continuouse Process Improvement 连续工序改善22 Cross Tabulation Tables 交叉表23 CS: Customer Sevice 客(户)服(务)中心24 DSA: Defects Analysis System 缺陷分析系统25 Data 数据Description:品名26 DCC: Document Control Center 文控中心27 Decision 决策、判定28 Defects per unit 单位缺点数29 Description 描述30 Device 装置31 Do 执行32 DOE: Design of Experiments 实验设计33 Element 元素34 Engineering recbnology 工程技35 Environmental 环境36 Equipment 设备37 Estimated accumulative frequency 计算估计累计数38 E Equipment Variation 设备变异39 External Failure 外部失效,外部缺陷40 FA: Failure Analysis 失效分析41 Fact control 事实管理42 Fatigue 疲劳43 FMEA: Failure Mode and Effect Analysis失效模式与效果分析44 FP First-Pass Yield (第一次通过)合格率45 FQA: Final Quality Assurance 最终品质保证46 FQC: Final Quality control 最终品质控制47 Gauge system 测量系统48 Grade 等级49 Histogram 直方图50 Improvement 改善51 Initial review 先期审查52 Inspection 检验53 Internal Failure 内部失效、内部缺陷54 IPQC: In Process Quality Control 制程品质控制55 IQC: Incomming Quality Control 来料品质控制56 IS International Organization for Standardization 国际标准化组织57 LCL: Lower Control limit 管制下限58 LQC: Line Quality Control 生产线品质控制59 LSL: Lower Size Limit 规格下限60 Machine 机械61 Manage 管理62 Materials 物料63 Measurement 测量64 Median 中位数65 MSA: Measurement System Analysis 测量系统分析66 Occurrence 发生率67 Operation Instruction 作业指导书68 Organization 组织69 Parto 柏拉图70 PPM arts per Million (百万分之)不良率71 Plan 计划72 Policy 方针73 Population 群体74 PQA: Process Quality Assurance 制程品质保证75 Practice 实务(践)76 Prevention 预防77 Probability 机率78 Probability density function 机率密度函数79 Procedure 流程80 Process 过程81 Process capability analysis 制程能力分析(图)82 Process control and Process capability制程管制与制程能力83 Product 产品84 Production 生产85 Projects 项目86 QA: Quality Assurance 品质保证87 QC: Quality Control 品质控制88 QE: Quality Engineering 品质工程89 QFD: Quality Function Desgin 品质机能展开(法)90 Quality 质量91 Quality manual 品质手册92 Quality policy 品质政策(质量方针)93 Random experiment 随机试验94 Random numbers 随机数95 R:Range 全距(极差)96 Reject 拒收97 Repair 返修98 Repeatusility 再现性99 Reproducibility 再生性100 Requirement 要求101 Responsibilities 职责102 Review 评审103 Reword 返工104 Rolled yield 直通率105 RPN: Risk Priority Number 风险系数106 Sample 抽样,样本107 Sample space 样本空间108 Sampling with replacement 放回抽样109 Sampling without replacement 不放回抽样110 Scatter diagram 散布图分析111 Scrap 报废112 Simple random sampling 简单随机取样113 Size 规格114 SL: Size Line 规格中心线115 Stratified random sampling 分层随机抽样116 SOP: Standard Operation Procedure 标准作业书117 SPC: Statistical Process Control 统计制程管制118 Specification 规范119 SQA: Source(Supplier) Quality Assurance 供货商品质保证120 Stage sampling 分段随机抽样121 Standard Deviation 标准差122 Sum of squares 平方和123 Taguchi-method 田口(试验)方法124 Theory 原理125 TQC: Total Quality Control 全面品质控制126 TQM: Total Quality Management 全面品质管理127 Traceablity 追溯128 Training 培训129 UCL: Upper Control Limit 管制(控制)上限130 USL: Upper Size Limit 规格上限131 Validation 确认132 Variable 计量值133 Verification 验证134 Version 版本135 VOC: Voice of Customer 客户需求136 VOE: Voice of Engineer 工程需求137 Inventory stock report:庫存清单报告138 Sales order report:出货报告质量人员名称类QC quality control 品质管理人员FQC final quality control 终点质量管理人员IPQC in process quality control 制程中的质量管理人员OQC output quality control 最终出货质量管理人员IQC incoming quality control 进料质量管理人员TQC total quality control 全面质量管理POC passage quality control 段检人员QA quality assurance 质量保证人员OQA output quality assurance 出货质量保证人员QE quality engineering 质量工程人员质量保证类FAI first article inspection 新品首件检查FAA first article assurance 首件确认CP capability index 能力指数CPK capability process index 模具制程能力参数SSQA standardized supplier quality audit 合格供货商质量评估FMEA failure model effectiveness analysis 失效模式分析FQC运作类AQL Acceptable Quality Level 运作类允收质量水平S/S Sample size 抽样检验样本大小ACC Accept 允收REE Reject 拒收CR Critical 极严重的MAJ Major 主要的MIN Minor 轻微的Q/R/S Quality/Reliability/Service 质量/可靠度/服务P/N Part Number 料号L/N Lot Number 批号AOD Accept On Deviation 特采UAI Use As It 特采FPIR First Piece Inspection Report 首件检查报告PPM Percent Per Million 百万分之一制程统计品管专类SPC Statistical Process Control 统计制程管制SQC Statistical Quality Control 统计质量管理GRR Gauge Reproductiveness & Repeatability 量具之再制性及重测性判断量可靠与否DIM Dimension 尺寸DIA Diameter 直径N Number 样品数其它质量术语类QIT Quality Improvement Team 质量改善小组ZD Zero Defect 零缺点QI Quality Improvement 质量改善QP Quality Policy 目标方针TQM Total Quality Management 全面质量管理RMA Return Material Audit 退料认可7QCTools 7 Quality Control Tools 品管七大手法通用之件类ECN Engineering Change Notice 工程变更通知(供货商)ECO Engineering Change Order 工程改动要求(客户)PCN Process Change Notice 工序改动通知PMP Product Management Plan 生产管制计划SIP Standard Inspection Procedure 制程检验标准程序SOP Standard Operation Procedure 制造作业规范IS Inspection Specification 成品检验规范BOM Bill Of Material 物料清单PS Package Specification 包装规范SPEC Specification 规格DWG Drawing 图面系统文件类ES Engineering Standard 工程标准CGOO China General PCE龙华厂文件IWS International Workman Standard 工艺标准ISO International Standard Organization 国际标准化组织GS General Specification 一般规格部类PMC Production & Material Control 生产和物料控制PCC Product control center 生产管制中心PPC Production Plan Control 生产计划控制MC Material Control 物料控制DC Document Center 资料中心QE Quality Engineering 质量工程(部)QA Quality Assurance 质量保证(处)QC Quality Control 质量管理(课)PD Product Department 生产部LAB Laboratory 实验室IE Industrial Engineering 工业工程R&D Research & Design 设计开发部生产类PCs Pieces 个(根,块等)PRS Pairs 双(对等)CTN Carton 卡通箱PAL Pallet/skid 栈板PO Purchasing Order 采购订单MO Manufacture Order 生产单D/C Date Code 生产日期码ID/C Identification Code (供货商)识别码SWR Special Work Request 特殊工作需求L/N Lot Number 批号P/N Part Number 料号OEM Original Equipment Manufacture 原设备制造PC Personal Computer 个人计算机CPU Central Processing Unit 中央处理器A.S.A.P As Soon As Possible 尽可能快的E-MAIL Electrical-Mail 电子邮件N/A Not Applicable 不适用QTY Quantity 数量I/O input/output 输入/输出NG Not Good 不行,不合格C=0 Critical=0 极严重不允许APP Approve 核准,认可,承认CHK Check 确认ASS'Y Assembly 装配,组装T/P True Position 真位度5WIH When, Where, Who, What, Why, How to6M Man, Machine, Material, Method, Measurement, Message4MTH Man, Material, Money, Method, Time, How 人力,物力,财务,技术,时间(资源) SQA Strategy Quality Assurance 策略质量保证DQA Design Quality Assurance 设计质量保证MQA Manufacture Quality Assurance 制造质量保证SSQA Sales and service Quality Assurance 销售及服务质量保证LRR Lot Reject Rate 批退率SPS Switching power supply 电源箱DT Desk Top 卧式(机箱)MT Mini-Tower 立式(机箱)DVD Digital Video DiskVCD Video Compact DiskLCD Liquid Crystal DisplayCAD Computer Aided DesignCAM Computer Aided ManufacturingCAE Computer Aided EngineeringPCB Printed Circuit Board 印刷电路板CAR Correction Action Report 改善报告NG Not Good 不良WDR Weekly Delivery Requirement 周出货要求PPM Percent Per Million 百万分之一TPM Total Production Maintenance 全面生产保养MRP Material Requirement Planning 物料需计划OS Operation System 操作系统TBA To Be Assured 待定,定缺D/C Drawing ChangeP/P Plans & ProcedureEMI Electrical-Music Industry 电子音乐工业Electrical Magnetic Interference 电子干扰RFI Read Frequency Input 读频输入MMC Maximum Material ConditionMMS Maximum Material SizeLMC Least Material ConditionLMS Least Material SizeLED lighting-emitting diode 发光二极管QBR Quarter Business RecordCIP Continuous improvement processFGI Forecasted Goal InventoryCNC Computerized numeral controllerB2C Business to customerB2B Business to businessAVL Approved vendor listPOP Procedure of packagingEOL End of lifeVDCS Vender defect correcting sheetPDCS Process defect correcting sheetGRN Goods receiving noteA/R Accounting receivableA/P Accounting payable专业词汇通用类president董事长operator作业员position职务general manager总经理special assistant 特助deputy manager |'depjuti| =vice manager副理deputy supervisor =vice supervisor副课长group leader组长line leader线长supervisor 课长responsible department负责单位Human Resources Department人力资源部Head count 人头数production department生产部门planning department企划部QC Section品管课stamping factory冲压厂painting factory烤漆厂molding factory成型厂administration/general affairs dept./总务部production unit生产单位meeting minutes会议记录distribution department分发单位subject主题conclusion结论decision items决议事项pre-fixed finishing date预定完成日Color management 颜色管理Visual management 目视管理production capacity生产力first count初盘first check初盘复棹second count 复盘second check复盘复核quantity of physical inventory second count 复盘点数量physical inventory盘点数量physical count quantity账面数量difference quantity差异量spare parts physical inventory list备品盘点清单cause analysis原因分析waste materials废料description品名specification 规格model机种work order工令revision版次remark备注registration登记registration card登记卡to control管制application form for purchase请购单consume, consumption消耗to notify通知to fill in填写to collect, to gather收集statistics统计cosmetic inspection standard 外观检验规范computer case 计算机外壳(组件)personal computer enclosure 计算机机箱产品front plate前板rear plate后板chassis |'∫æsi| 基座bezel panel面板Hood 上盖base pan 基座bezel 面板riser card 扩充卡flat cable 排线TOP driver cage 上磁架bottom driver cage 下磁架resin film 树脂膜raw materials原料materials物料steel plate钢板roll/coil material卷料spare parts =buffer备品plastic parts塑料件sheet metal parts/stamping parts 冲件material check list物料检查表finished product成品semi-finished product半成品good product/accepted goods/ accepted parts/good parts良品defective product/non-good parts不良品disposed goods处理品warehouse/hub仓库packing material包材basket蝴蝶竺plastic basket胶筐flow chart流程窗体production tempo生产进度现状lots of production生产批量manufacture procedure制程to revise, modify修订to switch over to, switch—to, switching over切换engineering bottleneck, project difficulty工程瓶颈glove(s)手套glove(s) with exposed fingers割手套Band-Aid创可贴Industrial alcohol工业酒精broom扫把mop拖把vacuum cleaner吸尘器rag 抹布garbage container灰箕garbage can垃圾箱garbage bag垃圾袋liaison联络单rags抹布lamp holder灯架to mop the floor拖地to clean a table擦桌子air pipe 气管delivery deadline交货期die worker模工production, to produce生产equipment设备resistance电阻beacon警示灯coolant冷却液crusher破碎机club car高尔夫球车plate电镀power button电源按键reset button重置键forklift叉车Workshop traveler 天车trailer =long vehicle拖板车Hydraulic trolley手压车hydraulic hand jack油压板车casing = containerization装箱velocity速度patent专利coordinate坐标supply and demand供求career card履历卡barricade隔板carton box纸箱to pull and stretch拉深work cell/work shop工作间sub-line支线bottleneck 瓶颈模具工程类plain die简易模pierce die冲孔模forming die成型模progressive die连续模stage die工程模compound die复合模shearing die剪边模riveting die铆合模feature die公母模male die公模female die母模cavity型控母模core模心公模die change 换模to fix a die装模to repair a die修模punch set上模座punch pad上垫板punch holder上夹板stripper pad脱料背板up stripper上脱料板upper plate上模板lower plate下模板die pad下垫板die holder下夹板die set下模座bottom block下垫脚bottom plate下托板(底板)upper supporting blank上承板upper padding plate blank上垫板top plate上托板(顶板)top block上垫脚stripping plate内外打(脱料板)outer stripper外脱料板inner stripper内脱料板lower stripper下脱料板punch冲头insert入块(嵌入件)deburring punch压毛边冲子groove punch压线冲子stamped punch字模冲子round punch圆冲子special shape punch异形冲子bending block折刀roller滚轴baffle plate挡块located block定位块supporting block for location定位支承块air cushion plate气垫板air-cushion eject-rod气垫顶杆trimming punch切边冲子stiffening rib punch = stinger 加强筋冲子ribbon punch压筋冲子reel-stretch punch卷圆压平冲子guide plate定位板sliding block滑块sliding dowel block滑块固定块die locker锁模器pressure plate =plate pinch压板thickness gauge厚薄规cutting die, blanking die冲裁模die block模块folded block折弯块sliding block滑块location pin定位销lifting pin顶料销die plate, front board模板padding block垫块stepping bar垫条panel board镶块to load a die装上模具to unload a die 御模具active plate活动板lower sliding plate下滑块板upper holder block上压块upper mid plate上中间板spring box弹簧箱spring-box eject-rod弹簧箱顶杆spring-box eject-plate弹簧箱顶板bushing block衬套cover plate盖板guide pad导料块pilot导正筒trim剪外边pierce剪内边pocket for the punch head挂钩槽slug hole废料孔radius半径shim/wedge/heel/pad/spacer/gasket楔子torch-flame cut火焰切割set screw止付螺丝form block折刀round pierce punch =die button圆冲子shape punch =die insert异形子stock located block定位块metal plate钣金miller铣床grinder磨床tolerance公差score =groove压线sliding block滑块lathe车active plate活动板baffle plate挡块cover plate盖板groove punch压线冲子air-cushion eject-rod气垫顶杆spring-box eject-plate弹簧箱顶板capability能力parameter参数factor系数driller钻床set up die架模height of die setting up架模高度analog-mode device类模器inner guiding post内导柱inner hexagon screw内六角螺钉dowel pin固定销coil spring弹簧lifter pin顶料销eq-height sleeves =spool等高套筒pin销lifter guide pin浮升导料销guide pin导正销wire spring圆线弹簧outer guiding post外导柱stop screw止付螺丝located pin定位销outer bush外导套press specification冲床规格die height闭模高度flow mark流痕welding mark溶合痕post screw insert螺纹套筒埋值self tapping screw自攻螺丝stripper plate脱料板piston活塞handle mold手持式模具flash mold溢流式模具positive mold挤压式模具split mold分割式模具die lifter举模器top stop上死点bottom stop下死点one stroke一行程to continue, cont.连动to grip(material)吸料location lump, locating piece, location block定位块reset复位to file burr 锉毛刺embedded lump |in'bed| mp|镶块 |lstamping-missing漏冲to tight a bolt拧紧螺栓to loosen a bolt拧松螺栓punched hole冲孔to cut edge =side cut =side scrap 切边to bending折弯to pull, to stretch拉伸engraving, to engrave刻印stamping 油印to stake铆合designing, to design设计design modification 设计修改成gauge(or jig)治具pedal踩踏板stopper阻挡器flow board流水板torque扭矩spline =the multiple keys花键quenching淬火tempering回火annealing退火carbonization碳化alloy合金tungsten high speed steel钨高速的moly high speed steel钼高速的forming成型(抽凸,冲凸)draw hole抽孔bending折弯emboss凸点dome凸圆semi-shearing半剪stamp mark冲记号deburr or coin压毛边punch riveting冲压铆合side stretch侧冲压平reel stretch卷圆压平groove压线stamp letter冲字(料号)tick-mark nearside正面压印tick-mark farside反面压印冲压类punch, press冲punching machine 冲床hydraulic machine油压机jack升降机decoiler整平机manufacture management制造管理stamping, press冲压feeder送料机rack, shelf, stack料架taker取料机to reverse material 翻料to load material上料__________________________________________________to unload material卸料to return material/stock to退料scraped |'skræpid|报废scrape ..v.刮;削robot机械手production line流水线packaging tool打包机packaging打包成型类well type蓄料井insulated runner绝缘浇道方式hot runner热浇道runner plat浇道模块valve gate阀门浇口band heater环带状的电热器spindle阀针spear head刨尖头slag well冷料井cold slag冷料渣air vent排气道welding line熔合痕eject pin顶出针knock pin顶出销return pin回位销反顶针sleeve套筒stripper plate脱料板insert core放置入子runner stripper plate浇道脱料板guide pin导销eject rod (bar)(成型机)顶业捧subzero深冷处理three plate三极式模具runner system浇道系统stress crack应力电裂orientation定向sprue gate射料浇口,直浇口nozzle射嘴sprue lock pin料头钩销(拉料杆)slag well冷料井side gate侧浇口edge gate侧缘浇口tab gate搭接浇口flash gate闸门浇口slit gate缝隙浇口fan gate扇形浇口dish gate因盘形浇口diaphragm gate隔膜浇口ring gate环形浇口submarine gate潜入式浇口tunnel gate隧道式浇口pin gate针点浇口runner less无浇道sprue less 无射料管方式long nozzle延长喷嘴方式spur浇口;溶waste废料board广告牌sliding rack滑料架to impose lines压线to compress, compressing压缩character die字模to feed, feeding送料material change, stock change材料变更feature change 特性变更prepare for, make preparations for 准备rotating speed, revolution转速abnormal handling异常处理组装类Assembly line组装线Layout布置图Conveyer流水线运输带Rivet machine拉钉机Rivet gun拉钉枪Screw driver起子Electric screw driver电动起子Hydraulic machine 液压机Pneumatic screw driver气动起子automation自动化to stake, staking, riveting铆合add lubricant oil加润滑油argon welding氩焊cylinder油缸robot机械手transmission rack输送架to draw holes抽孔bolt螺栓nut 螺母screw 螺丝identification tag标示单screwdriver plug起子插座automatic screwdriver电动启子to move, to carry, to handle搬运be put in storage入库packing包装staker = riveting machine铆合机fit together组装在一起fasten锁紧(螺丝)fixture 夹具(治具)pallet/skid栈板barcode条形码barcode scanner条形码扫描仪fuse together熔合fuse machine/heat stake热熔机processing, to process加工delivery, to deliver 交货to return delivery to. to send delivery back to return of goods退货easily damaged parts易损件standard parts标准件to lubricate润滑spring 弹簧spare tools location/buffer手工备品仓spare molds location模具备品仓tox machine自铆机烤漆类phosphate皮膜化成viscosity涂料粘度alkalidipping脱脂main manifold主集流脉organic solvent有机溶剂demagnetization去磁;消磁high-speed transmission高速传递heat dissipation热传rack上料volatile挥发性degrease脱脂rinse水洗alkaline etch龄咬desmot剥黑膜D.I. rinse纯水次Chromate铬酸处理Anodize阳性处理seal封孔scraped products报放品disposed products处理品dismantle the die折模auxiliary function辅助功能heater band 加热片thermocouple热电偶derusting machine除锈机degate打浇口dryer烘干机induction感应induction light感应光response =reaction =interaction感应ram连杆edge finder巡边器concave凸convex凹cold slug冷块blush 导色gouge沟槽;凿槽satin texture段面咬花witness line证示线grit沙砾granule =pellet =grain细粒sand blasting喷沙grit maker抽粒机cushion缓冲fillet镶;嵌边roller pin formality滚针形式cam driver铡楔shank摸柄crank shaft曲柄轴品质类qualified products, up-to-grade products良品defective products, not up-to-grade products不良品。
MEMORY存储芯片MT40A1G8PM-083EA中文规格书
MEMORY存储芯片MT40A1G8PM083EA中文规格书一、产品概述MT40A1G8PM083EA是一款高性能的MEMORY存储芯片,采用先进的生产工艺,具有低功耗、高速读写、大容量等特点。
本产品适用于各类电子设备,如计算机、服务器、嵌入式系统等,为用户提供稳定可靠的存储解决方案。
二、主要特性1. 存储容量:1GB(8GBIT x 128)2. 工作电压:1.2V / 1.5V / 1.8V(可调)3. 数据传输速率:最高可达2133Mbps4. 封装形式:BGA(Ball Grid Array)5. 工作温度范围:40°C至+95°C6. 低功耗设计,支持深度节能模式7. 兼容JEDEC标准,具备ECC错误校验功能三、产品参数1. 尺寸规格:12mm x 12mm x 1.2mm2. 引脚数量:244个3. 引脚间距:0.8mm4. 电源需求:VDDQ(1.2V / 1.5V / 1.8V),VDD(1.2V / 1.5V / 1.8V)5. 输入输出信号:DQ、DQS、DQS、DM、RESET、CKE、CS、ODT、RAS、CAS、WE6. 时序参数:根据不同工作频率,提供多种时序配置,以满足不同应用需求四、应用领域1. 服务器及数据中心2. 高性能计算3. 嵌入式系统4. 工业控制5. 消费类电子产品敬请关注后续内容,我们将为您提供更多关于MT40A1G8PM083EA 存储芯片的详细信息。
五、兼容性与接口1. 支持DDR4 SDRAM接口,兼容JEDEC DDR4规范。
2. 适用于单通道、双通道和四通道配置,可根据实际应用需求灵活选择。
3. 支持突发长度为8和16的读写操作,提高数据传输效率。
六、可靠性保障1. 内置温度传感器,实时监测芯片工作温度,保障芯片在适宜环境下运行。
2. 采用高品质材料,提高芯片的抗干扰能力和耐用性。
3. 经过严格的老化测试,确保产品在长时间使用下的可靠性。
Memory
MEMORY Technology Introduction1 MEMORY的组成:存储器是计算机的重要组成部分,按其用途可分为主存储器(Main Memory,简称主存)和辅助存储器(Auxiliary Memory,简称辅存),主存储器又称内存储器(简称内存)。
内存是用来存储执行中的数据,常见的有内存条、高速缓存等。
主存储器由存储体,地址译码电路,驱动电路,读写电路和控制电路等组成,其各部分的主要功能是:存储体:是存储信息的集合体,即由某种存储介质按一定结构组成的存储单元的集合。
通常是组织成二维阵列。
地址寄存器,译码电路与驱动器:既寻址系统。
在对存储体内部某个存储单元的信息进行读写操作前,必须指定存储单元的位置(地址),地址寄存器的作用就是存放特定存储单元的地址数据,以保证能够对指定的存储单元进行读写操作。
译码电路负责将地址寄存器中的地址转换为对存储单元的选择信号,电路驱动器的作用是增加电路的负载能力,保证译码电路能够有效地选择每个存储单元。
读写电路与数据寄存器:数据寄存器的作用是暂时保存从存储器中读出的信息或将写入存储器的信息。
读写电路负责从数据寄存器到特定存储单元之间的信息读写操作。
控制电路:负责接收CPU传来的控制命令,经过控制电路一系列的处理,产生一组时序信号控制存储器的操作。
在存储器的组成中,存储体是核心,其余部分是存储体的外围电路。
不同的存储器都是由这几部分组成,只是在选用不同的存储介质和不同的存取方式时,各部分的结构与工作方式略有变化。
2 MEMORY的分类:内存按存储信息的功能可分为只读存储器ROM(Read Only Memory)、随机存储器RAM(Random Access Memory)。
ROM可分为:A.PROM B.EPROMRAM可分为:A. SRAM(Static RAM):静态随机存取存储器是靠双稳态触发器来记忆信息的;B. DRAM(Dynamic RAM):动态随机存取存储器是靠MOS电路中的栅极电容来记忆信息的。
Memory知识简介-A01
内存厂商
内存主要分生产厂商和颗粒厂商 1. 内存生产厂商: Micron(镁光)Corsair(海盗船),Kingston(金士顿)、Apacer(宇瞻)、 金邦(GELL),Transcend(创建),胜创KINGMAX,AADATA(威刚),Kingtiger金泰 克,King MAX(胜创),G. Skill(芝奇),Team(十铨科技),尔必达(ELPIDA) SMART世迈等
DRAM-动态随机存取记忆体 由0、1二进制单元,最小单位:bit,每一个bit需要一个晶体管和一个电容,但是电 容存在漏电现象,所以需要在一定的周期内刷新(预充电)才能保持数据不丢失. SDRAM(Synchronous DRAM)同步动态随机存取记忆体 SDRAM在同一时钟周期内只能读取/写入一次,只在时钟上升的时候读取/写入,如果 是同时请求,只能先等其中一个处理动作完成 DDR(Double Date Rate SDRAM)双倍速率同步动态随机春去记忆体 双倍是指在一个时钟周期内传输两次数据,在时钟上升和下降时各传输一次数据(通 过差分时钟技术实现),在存取阵列频率边的情况下达到了SDR的两倍.也就是在时钟周期 的上升和下降都能传输
Buffer和Unbuffer的介绍
Buffer即缓冲器,也可理解成高速缓存,在服务器及图形工作站内存有较多应 用,容量多为64K,但随着内存容量的不断增大,其容量也不断增加,具有Buffer的内存 将对内存的读写速度有较大提高. Unbuffer表示不具有高速缓冲,有Buffer的内存几乎都带ECC功能,Unbuffer内 存只要少数带ECC功能. 缓冲(buffers)是根据内存的读写设计的,把分散的写操作集中进行,减少存取单元的 反复寻址,从而提高系统性能。 缓存(cached)是把读取过的数据保存起来,重新读取时若命中(找到需要的数据)就不 要去读存取单元了.
关于memory的英语作文40次词
Memory: The Essence of ExperienceMemory, the core of our existence, shapes our understanding of the world. It is the repository of our past, a tapestry of moments that defines our identity. Whether it's the laughter of childhood, the sorrow of loss, or the joy of accomplishment, memory etches indelible marks on our soul.Memory is not just about recalling facts or events;it's about the emotions those experiences evoke. It's the warmth of a mother's hug, the thrill of a first kiss, orthe pride of standing on a podium. These memories, both bittersweet, form the bedrock of our emotional intelligence. Moreover, memory is a bridge to the future. It allowsus to learn from our mistakes, to build on our successes, and to chart a course for the unknown. Without memory, we would be adrift, without a compass to guide us.Yet, memory is also fragile. It fades with time, distorted by the lens of nostalgia or the harsh realitiesof life. And sometimes, traumatic memories can haunt us, shaping our present and coloring our future.Nevertheless, the beauty of memory lies in its abilityto transform. With time and healing, even the most painful memories can become lessons of resilience and growth. They remind us of our strength, of our ability to overcome, andto emerge stronger on the other side.In conclusion, memory is not just a record of the past; it is the foundation of our present and the seed of our future. It shapes us, defines us, and makes us who we are. Let us cherish our memories, learn from them, and use themto create a brighter tomorrow.**记忆:经历的精髓**记忆,作为我们存在的核心,塑造着我们对世界的理解。
memory英语作文
memory英语作文Memory。
Memory is an essential part of human cognition,allowing us to store and retrieve information about past events, experiences, and knowledge. Without memory, wewould not be able to learn from our experiences, make decisions based on past events, or even recognize our loved ones. In this article, we will explore the different typesof memory, the processes involved in memory formation and retrieval, and the factors that can affect memory function.Types of Memory。
There are several different types of memory, each serving a specific function in our daily lives. The most commonly recognized types of memory are:1. Sensory Memory: This type of memory holdsinformation from our senses for a very brief period of time,typically less than a second. It allows us to retain abrief impression of a sensory stimulus, such as a sight, sound, or touch, before it is either forgotten or transferred to short-term memory.2. Short-Term Memory: Also known as working memory,this type of memory holds a small amount of information for a short period of time, typically less than a minute. It allows us to temporarily retain information while we are actively using it, such as remembering a phone number long enough to dial it.3. Long-Term Memory: This type of memory stores information for an extended period of time, ranging from minutes to a lifetime. It is further divided into two subtypes: explicit (or declarative) memory, which involves consciously recalling facts and events, and implicit (or procedural) memory, which involves unconsciously remembering how to do things, such as riding a bike ortying shoelaces.Processes of Memory Formation and Retrieval。
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Read only memory (ROM) 只读存储器
ROM is nonvolatile memory (非易失 性存储器);that is ,its contents are preserved even if no power is applied.
Memory-not!
(P800)
Address inputs
Static RAM (SRAM)
The memory device is a latch ,the data is stable, and the access time is short, but the circuit is complex and expensive !
The data can only be write in the manufacture process, can not be changed by the users !
Read only memory (ROM)
P-ROM: Programmable ,add a fuse to the diode.
The floating gate can be charged to write “0” and uncharged to write “1” !
Random access memory (RAM)
Use memory device to store data bit, and use word line to control its input/output from bit line .
Data bits are stored in a structured way
Once a word line is selected, all the bits in this line can be in output through the bit lines !
Memory
Example: When a2a1a0= 000, y4y3y2y1= 1000; When a2a1a0= 101, y4y3y2y1= 0110;
y 1 m 7 m 4 m 2 m 1 a 2 a 1 a 0 y 3 m 7 m 5 m 3 m 2 m 1 a 2 a 1 a 0
Read only memory (ROM)
AND-OR structure: Each word line is an output of AND gate; Each bit line is an output of OR gate.
A1
阵 列
. (译码器) A1
A0
.W 3 A0 输出缓冲器
. D3 位
DD 33
EN
. . D2
线
EN
. D 1
D2
D2
D1
D1
EN
. D0
DD00
EN
EN
W0=1,ACTIVE HIGH
W0 A1A0
与门阵列输出表达式
或门阵列输出表达式
W0 A1A0
D0W 0W2
W1 A1A0
D 1W 1W 2W 3
Memory
A memory can be treated as a combinational circuit !
A truth table is stored in the memory array ! Each bit line is a function output !
Memory
Example:
The fuse can be melted by the user to write “0” !
W0
W1 W2 W3
VC C
1
A1
1 ..
1
A0
1
.
或..
门
阵 列
.
(编码器)
..
. . .. . .. .. .. .. W 0 字 W 1 线 W 2 .. ..
.. .. .. . ..
.
.
与
门
▪ Bit line:
▪ The bit line corresponds to one output bit of the ROM.
Read only memory (ROM)
Mask ROM: use a diode or transistor as memory connection.
Active-high decoder output (word line )
W2 A1A0
W3A1A0
D 2W 0W 2W 3 D3W1W3
ROM存储内容的真值表
地址
A1
A0
0
0
0
1
1
0
1
1
存储内容
D3
D2
D1
D0
0
1
0
1
1
0
1
0
0
1
1
1
1
1
1
0
Memory
Construct with a binary decoder and a memory array !
Memory
... ...
Memory
Word line
W0Βιβλιοθήκη A0 A1W1...
decoder
Wi
...
Memory cells
0 cell 1 cell
i cell
...
...
An1
W 2n -1
n
2 -1
cell
...
Bit line D0 D1
Db 1
Data Output
▪ Word line :
▪ each decoder output is called a “word line”because it selects one row or word of the table stored in the ROM.
memory
Memory
▪ we usually reserve the word “memory” to refer to bits that are sorted in a structured way,usually as a two-dimensional array in which one row of bits is accessed at a time.(P799)
9.1.4 Commercial ROM Types
▪ Mask ROM ▪ PROM ▪ EPROM ▪ (OTP)ROM ▪ EEPROM ▪ Flash EPROM
Read only memory (ROM)
EPROM(可擦除可编程只读存储器): Erasable PROM ,use floating-gate technology. Include EEPROM and FLASH .