SN3231 LED闪光灯驱动芯片 P0.2中文版

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二七二一型号LED指示灯技术数据表说明书

二七二一型号LED指示灯技术数据表说明书

27-21/GHC-YR1S2M/3C
Pb EVERLIGHT
CPN : P N: XXXXXXXXXXXXX
XXXXXXXXXXXXX QTY : XXX
LOT NO : XXXXXXXXXX
RoHS
CAT : XXX HUE : XXX REF : XXX
Reference : XXXXXXXX
Parameter
Symbol Min. Typ.
Luminous Intensity
IV
112
-----
Viewing Angle
2θ1/2 ----
130
Peak Wavelength
λp
----
518
Dominant Wavelength
λd
520
-----
Spectrum Radiation
3.Tolerance of Forward Voltage ±0.1V
Max. 285 ------535 ---3.95 50
Unit Condition
mcd
deg
nm IF=20mA
nm
nm V
μA
VR=5V
Everlight Electronics Co., Ltd. Device No:DSE-0001729
Label
Aluminum moisture-proof bag
Desiccant
Label
Everlight Electronics Co., Ltd. Device No:DSE-0001729
Prepared date: 12-Jun-2009
solder process. ․Mono-color type. ․Pb free ․The product itself will remain within RoHS compliant version

SM2315EB 可控硅调光高功率因数线性恒流 LED 驱动芯片说明书

SM2315EB 可控硅调光高功率因数线性恒流 LED 驱动芯片说明书

SM2315EB订购信息若无特殊说明,环境温度为27°C。

注:表贴产品焊接最高峰值温度不能超过260℃,温度曲线依据J-STD-020 标准、参考工厂实际和锡膏商建议由工厂自行设定。

热阻参数注:芯片要焊接在有200mm2铜箔散热的PCB板,铜箔厚度35um。

电气工作参数若无特殊说明,环境温度为25°C。

SM2315EB是一款高功率因数LED线性恒流驱动芯片,工作于分段式自动切换模式。

并支持可控硅调光,整个调光过程,LED亮度均匀变化。

芯片集成过温保护等功能,提升系统应用可靠性。

可通过外部参数调整适应不同类型可控硅。

◆过温保护当芯片内部温度高于过温保护点,芯片会自适应降低输出电流,降低功耗。

◆增大输出电流的措施SM2315EB内部有温度补偿电路,因此要增大输出电流,就必须有良好的散热措施,以降低SM2315EB芯片的温度。

1)采用铝基板PCB;2)增大SM2315EB衬底(GND)的覆铜面积;3)增大整个灯具的散热底座SM2315EB 支持芯片并联应用方案。

若系统输出功率过大导致芯片温度高时,可以采用多颗SM2315EB芯片并联的应用方案。

系统PCB图及布板注意事项铺铜散热(1)IC衬底部分进行铺铜处理,进行散热,增加可靠性,铺铜如上图所示。

(2)IC衬底焊盘漏铜距离PIN1和PIN8端口需保证1mm以上的间距。

典型应用方案图1 SM2315EB 110Vac输入下典型应用电路图2 SM2315EB 220Vac输入下典型应用电路图3 SM2315EB 220Vac输入下双芯片并联应用典型电路封装形式ESOP8。

两模式太阳能灯串芯片功能说明以及电路图

两模式太阳能灯串芯片功能说明以及电路图

ELITECHIP
ELITECHIP
EC2015-8A42太阳能两模式灯串芯片
一.功能说明
供电方式:DC3.7V 18650电池。

三路输入(光控、电源按键自锁开关、轻触开关)控制三路输出:1路太阳能充电指示灯、1路电源开关指示灯、1路负载输出。

上电工作用按键自锁开关控制电源通断,初始上电为常亮模式。

短按轻触开关转换为闪烁模式,再短按返回常亮模式,按键依次循环。

带断电记忆。

三路指示灯说明:1路太阳能指示灯,太阳能给电池充电时指示灯亮,无充电时指示灯不亮。

1路电源开关指示灯,自锁开关导通通电时指示灯亮,断开指示灯灭。

USB 充电功能:充电红灯亮充满绿灯亮。

二.电气参数(VDD=3.0V
TA=25℃)
工作电压:2.4-5V;工作电流:1mA;静态电流:6uA;
驱动电流低电平输出:80mA;驱动电流高电平输出:8mA;过VDD 极限电流:60mA;过GND 极限电流:60mA;工作温度:-10°-+85°;储存温度:-20°-+125°;三.封装脚位图(SOP-8)
2
3
1827364
5
PA3
VDD PA2PA1PA0
PA5PA4GND 管脚号符号
功能描述
1VDD 电源正2PA2悬空3PA1低电压检测4PA3触发开关5PA0光控输入6PA5灯串输出7PA4灯串输出8
GND 电源负
四.电路图参考
ELITECHIP
六.版本说明
版本
日期
描述
EC2015-8A42
2020/11/28
V01初版。

车载LED隐形闪光器(快速切换2 2)安装指南说明书

车载LED隐形闪光器(快速切换2 2)安装指南说明书

Installation Guide:Universal LED Hide-A-Way(2 x 2 Switching)©2008 Whelen Engineering Company Inc.Form No.14199 (051508)For warranty information regarding this product, visit /warranty•Proper installation of this product requires the installer to have a good understanding of automotive electronics, systems and procedures.•Whelen Engineering requires the use of waterproof butt splices and/or connectors if that connector could be exposed to moisture.•Any holes, either created or utilized by this product, should be made both air- and watertight using a sealant recommended by your vehicle manufacturer.•Failure to use specified installation parts and/or hardware will void the product warranty.•If mounting this product requires drilling holes, the installer MUST be sure that no vehicle components or other vital parts could be damaged by the drilling process. Check both sides of the mounting surface before drilling begins. Also de-burr the holes and remove any metal shards or remnants. Install grommets into all wire passage holes.•If this manual states that this product may be mounted with suction cups, magnets, tape or Velcro®, clean the mounting surface with a 50/50 mix of isopropyl alcohol and water and dry thoroughly.•Do not install this product or route any wires in the deployment area of your air bag. Equipment mounted or located in the air bag deployment area will damage or reduce the effectiveness of the air bag, or become a projectile that could cause serious personal injury or death. Refer to your vehicle owner’s manual for the air bag deployment area. The User/Installer assumes full responsibility to determine proper mounting location, based on providing ultimate safety to all passengers inside the vehicle.•For this product to operate at optimum efficiency, a good electrical connection to chassis ground must be made. The recommendedprocedure requires the product ground wire to be connected directly to the NEGATIVE (-) battery post (this does not include products that use cigar power cords).•If this product uses a remote device for activation or control, make sure that this device is located in an area that allows both the vehicle and the device to be operated safely in any driving condition.•Do not attempt to activate or control this device in a hazardous driving situation.•This product contains either strobe light(s), halogen light(s), high-intensity LEDs or a combination of these lights. Do not stare directly into these lights. Momentary blindness and/or eye damage could result.•Use only soap and water to clean the outer lens. Use of other chemicals could result in premature lens cracking (crazing) and discoloration. Lenses in this condition have significantly reduced effectiveness and should be replaced immediately. Inspect and operate this product regularly to confirm its proper operation and mounting condition. Do not use a pressure washer to clean this product.•It is recommended that these instructions be stored in a safe place and referred to when performing maintenance and/or reinstallation of this product.•FAILURE TO FOLLOW THESE SAFETY PRECAUTIONS AND INSTRUCTIONS COULD RESULT IN DAMAGE TO THE PRODUCT OR VEHICLE AND/OR SERIOUS INJURY TO YOU AND YOUR PASSENGERS!A u t o m o t i v e : Warnings to InstallersWhelen’s emergency vehicle warning devices must be properly mounted and wired in order to be effective and safe. Read and follow all of Whelen’s written instructions when installing or using this device. Emergency vehicles are often operated under high speed stressful conditions which must be accounted for when installing all emergency warning devices. Controls should be placed within convenient reach of the operator so that they can operate the system without taking their eyes off the roadway. Emergency warning devices can require high electrical voltages and/or currents. Properly protect and use caution around live electrical connections.Grounding or shorting of electrical connections can cause high current arcing, which can cause personal injury and/or vehicle damage, including fire. Many electronic devices used in emergency vehicles can create or be affected by electromagnetic interference. Therefore, after installation of any electronic device it is necessary to test all electronic equipment simultaneously to insure that they operate free of interference from other components within the vehicle. Never power emergency warning equipment from the same circuit or share the same grounding circuit with radio communication equipment. All devices should be mounted in accordance with the manufacturer’s instructions and securely fastened to vehicle elements of sufficient strength to withstand the forces applied to the device. Driver and/or passenger air bags (SRS) will affect the way equipment should be mounted. This device should be mounted by permanent installation and within the zones specified by the vehicle manufacturer, if any. Any device mounted in the deployment area of an air bag will damage or reduce the effectiveness of the air bag and may damage or dislodge the device. Installer must be sure that this device, its mounting hardware and electrical supply wiring does not interfere with the air bag or the SRS wiring or sensors. Mounting the unit inside the vehicle by a method other than permanent installation is not recommended as unit may become dislodged during swerving; sudden braking or collision. Failure to follow instructions can result in personal injury. Whelen assumes no liability for any loss resulting from the use of this warning device. PROPER INSTALLATION COMBINED WITH OPERATOR TRAINING IN THE PROPER USE OF EMERGENCY WARNING DEVICES IS ESSENTIAL TO INSURE THE SAFETY OF EMERGENCY PERSONNEL AND THE PUBLIC.Warnings to UsersWhelen’s emergency vehicle warning devices are intended to alert other operators and pedestrians to the presence and operation of emergency vehicles and personnel. However, the use of this or any other Whelen emergency warning device does not guarantee that you will have the right-of-way or that other drivers and pedestrians will properly heed an emergency warning signal. Never assume you have the right-of-way. It is your responsibility to proceed safely before entering an intersection, driving against traffic, responding at a high rate of speed, or walking on or around traffic lanes. Emergency vehicle warning devices should be tested on a daily basis to ensure that they operate properly. When in actual use, the operator must ensure that both visual and audible warnings are not blocked by vehicle components (i.e.: open trunks or compartment doors), people, vehicles, or other obstructions. It is the user’s responsibility to understand and obey all laws regarding emergency warning devices. The user should be familiar with all applicable laws and regulations prior to the use of any emergency vehicle warning device. Whelen’s audible warning devices are designed to project sound in a forward direction away from the vehicle occupants. However, because sustained periodic exposure to loud sounds can cause hearing loss, all audible warning devices should be installed and operated in accordance with the standards established by the National Fire Protection Association.Safety FirstThis document provides all the necessary information to allow your Whelen product to be properly and safely installed. Before beginning the installation and/or operation of your new product, the installation technician and operator must read this manual completely. Important information is contained herein that could prevent serious injury or damage.WARNING: This product can expose you to chemicals including Methylene Chloride which is known to the State of California to cause cancer, and Bisphenol A, which is known to the State of California to cause birth defects or other reproductive harm. For more information go to .51 Winthrop RoadChester, Connecticut 06412-0684Phone: (860) 526-9504Internet: Salese-mail:*******************CustomerServicee-mail:*******************®ENGINEERING COMPANY INC.Installation:Installation of Universal LED Hide-A-Way into a composite automotive headlight or taillight assembly:1.Follow manufacturers instructions to remove the headlight (or taillight)reflector assembly from the vehicle.2.Select the mounting location for the LED Hide-A-Way, keeping in mind thefollowing:•The LED Hide-A-Way will share the same reflector as the headlight, brake light, or signal light. Make sure the Hide-A-Way does not interfere with the operation of these lights.•There must be a minimum of one inch of space between the LED Hide-A-Way and the lens.•The LED Hide-A-Way must not be installed above the horizontal centerline of the reflector.•The LED Hide-A-Way must not be installed above any OEM supplied light.3.Choose a surface in the rear or bottom of the housing which is as flat aspossible. Using a hole saw, cut a 3/4” hole in the housing as shown (Fig. 1 &2) and de-burr the hole.4.Insert the LED lamp assembly into the reflector housing. Mark the locationfor the two mounting holes (3/32” DIA.). Remove the lamp assembly and drill the holes.5.Install the lamp assembly and gasket using the two provided #6 sheet metalscrews and secure the lamp to the reflector assembly.6.Repeat steps 1 thru 6 for the other side of the vehicle.7.Remount both headlight assemblies to the vehicle and route the connectorcable from the Hide-A-Way to the LED driver module.8.The module should be mounted in the engine compartment near the vehicleheadlight circuit. Do not mount the module onto the engine or close to the exhaust system.IMPORTANT NOTE: If the LED Hide-A-Way is being used in an area previously occupied by an S30HA light assembly, it is important to seal the mounting holes used by the previous assembly with RTV or other suitable material.NOTE: Whelen® LED Hide-A-Way systems are designed to interface with the Whelen® LED driver module. Do not connect the Whelen LED Hide-A-Way lamp directly to a battery or to a standard flasher. LED damage will result and void warranty. Detailed wiring, switching and installation instructions are enclosed with this unit.WARNING!All customer supplied wires that connect to the positive terminal of the battery must be sized to supply at least 125% of the maximum operating current and FUSED at the battery to carry that load. DO NOT USE CIRCUIT BREAKERS WITH THIS PRODUCT!Wiring & Operation:The LED driver module is powered & controlled by the 6 wires coming from the Input Connector. Locate the input connector and plug it into the LED driver module.RED: Power - Extend the RED wire to a 12 volt DC power source(******** amps)BLACK: Ground - Extend the BLACK wire to the negative terminal of the battery.BLUE: Control 1 - Extend this wire to a fused +12VDC power source. Install a SP/ST switch (customer supplied) to allow control of Outlets 1 + 3.GREEN: Control 2 - Extend this wire to a fused +12VDC power source. Install a SP/ST switch (customer supplied) to allow control of Outlets 2 + 4.GRAY: SYNC - Connect the GREY wire to other SYNC capable power supplies to synchronize their output. Cap off the wire if not used.WHITE/VIOLET: Scan-Lock™- Extend the WHT/VIO wire to a customer supplied momentary switch (Fuse @ 1 amp). See Scan-Lock™ section for operation.IMPORTANT WARNING: DO NOT ATTEMPT TO USE THE LED LIGHT-HEAD(S) WITHOUT THE LED DRIVER MODULE CONNECTED.Scan-Lock™ (WHITE/VIOLET)In order to program flash patterns, the lighthead must be on. With the appropriate lighthead(s) activated:TO CHANGE PATTERNS: To cycle forward to the next available pattern apply +12 volts to the WHT/VIO wire for less than 1 second and release.To cycle back to the previous pattern apply +12 volts to the WHT/VIO wire for more than 1 second and release.TO CHANGE THE DEFAULT PATTERN: When the desired pattern is displayed, allow it to run for more than 5 seconds. The lighthead will now display this pattern when initially activated.TO RESTORE THE FACTORY DEFAULT PATTERN:This will reset all patterns back to there default settings.Disconnect main power and apply power to the WHT/VIO wire. With power applied to the WHT/VIO wire, turn main power back on. Allow the unit to run for 3 seconds then remove power from the WHT/VIO wire.A Normally Open momentary switch should be used to control Scan-Lock operation.Flash Patterns -The following is a list of all the available flash patterns and their respective stages:Pattern Stage(s)1.SignalAlert™ 75 *1>2>3>4etFlash® 75 *1>2>3>43.DoubleFlash 75 *1>2>3>44.SingleFlash 75 *1>2>3>4Alert™ 75 *1>2>3>46.LongBurst™ 75 *1>2>3>47.PingPong™ 75 *1>2>3>48.SingleFlash 601>2>3>49.SingleFlash 901>2>3>410.SingleFlash 1201>2>3>411.SingleFlash 3001>2>3>412.DoubleFlash 1501>2>3>4Alert™ 1501>2>3>414.ActionFlash™ 501>2>3>415.ActionFlash™ 1501>2>3>416.ModuFlash™1>2>3>417.ActionScan™1>2>3>4The first half of the patterns are available in Stages 1 thru 4, while the second half are available in Stage 5 only. To better understand how the Stage of a pattern effects its appearance, refer to the following diagram.18.SignalAlert™ 75 *5etFlash® 75 *520.DoubleFlash 75 *521.SingleFlash 75 *5Alert™ 75 *523.LongBurst™ 75 *524.PingPong™ 75 *525.SingleFlash 60526.SingleFlash 90527.SingleFlash 120528.SingleFlash 300529.DoubleFlash 1505Alert™ 150531.ActionFlash™ 50532.ActionFlash™ 150533.ModuFlash™534.ActionScan™5 * = SYNC Pattern IMPORTANT! Before returning this vehicle to active service, visually confirm the proper operation of this product, as well as all vehicle components and equipment.。

0.2w led灯珠参数 -回复

0.2w led灯珠参数 -回复

0.2w led灯珠参数-回复0.2W LED灯珠参数是指一种功率为0.2瓦特的LED灯珠的技术参数和特性。

在本文中,我将一步一步回答关于这种LED灯珠的各种问题,并探讨它的应用和未来的发展。

首先,让我们了解一下LED灯珠到底是什么。

LED代表发光二极管,是一种能够将电能转化为可见光的半导体器件。

相比传统的白炽灯泡和荧光灯管,LED具有更低的能耗、更长的寿命和更高的亮度,因此被广泛应用于照明、显示和信息传递等领域。

在了解了LED灯珠的基本原理后,我们来看看0.2W LED灯珠的参数。

首先是功率,0.2瓦特的功率意味着这种LED灯珠的电能转化效率为0.2瓦特。

高效的能耗转化使得LED成为能源节约和环保的选择。

除了功率,亮度也是一个重要的参数。

0.2W的LED灯珠通常能够提供足够的亮度来照亮一个小空间,比如个人办公区域或者阅读灯。

然而,在需要更强照明需求的环境,如大型展示区域和户外照明项目中,可能需要更高功率的LED灯珠。

另一个关键特性是颜色温度。

颜色温度决定了灯光的色调,通常使用开尔文(K)度量。

0.2W LED灯珠可以提供不同的颜色温度选项,例如暖色调(低温度)、自然白色调(中温度)和冷白色调(高温度)等。

因此,用户可以根据特定的使用环境和需求选择适合的颜色温度。

此外,LED灯珠还具有较长的使用寿命。

与传统的白炽灯泡相比,0.2W LED灯珠的寿命通常更长,可以达到数千小时甚至数万小时。

这不仅降低了灯珠更换的频率,也减少了对环境的负面影响。

所以,0.2W LED灯珠有哪些应用呢?首先,它可以用于家庭照明。

由于其高效节能和较长使用寿命,LED灯珠成为了许多家庭的首选。

其次,它也可以应用于商业照明。

许多商场、办公楼和酒店都会采用LED灯珠来提供高质量的照明效果,并降低能源成本。

除了照明领域,LED灯珠还被广泛用于显示器和信息传递设备。

例如,手机、电视、电脑显示屏和室内外广告牌等都使用了LED灯珠作为背光源或显示单元。

Broadcom T-1 (3-mm) 自动插入可胶水焊接LED灯说明书

Broadcom T-1 (3-mm) 自动插入可胶水焊接LED灯说明书

Data SheetDescriptionThis Broadcom ® family of 3-mm LED lamps is capable of withstanding automatic insertion and wave soldering processes.Designed with a thick epoxy flange and soft lead frame material, it is ideal for clinch and cut operations.Applications⏹General purpose⏹High volume manufacturingFeatures⏹T-1 (3-mm) auto-insertable package ⏹High brightness light output ⏹Tinted non-diffused lens ⏹Wide viewing angle⏹Available colors: Red and AmberDevice Selection GuidePart NumberColor Package Lens Luminous Intensity, Min. Iv at 20 mAViewing Angle,2θ½aPackage DrawingHLMP-NG05AlInGaP Red Micro-tinted 90.245 A HLMP-NG07AlInGaP Red Micro-tinted 90.260 B HLMP-NL06AlInGaP AmberMicro-tinted96.260Ba.2θ½ is the off-axis angle where the luminous intensity is ½ the on-axis intensity.HLMP-NG0x, HLMP-NL06T-1 (3-mm) Auto-Insertable LED LampsPackage Dimensions Package Drawing APackage Drawing BNOTE:1.All dimensions are in millimeters (inches).2.Leads are mild steel with tin plating.3.Epoxy meniscus of 0.8 mm (0.03 in.) maximum may extend to the leads.4.For PCB hole recommendations, see the Precautions section.)Absolute Maximum Ratings at T A = 25°CElectrical Characteristics at T A = 25°COptical Characteristics at T A = 25°CParameterAlInGaP Amber and RedUnits DC Forward Current aa.See Figure 4 for maximum current derating vs. ambient temperature.30b, cb.Suggested minimum DC current:10 mA.c.Maximum Peak Pulsed Forward Current: 50 mA, 30 mA average.mA Reverse Voltage (I R = 100 µA)5V Junction Temperature, T jmax 110°C Storage Temperature Range –40 to +85°C Operating Temperature Range–40 to +85°CPart Number Forward Voltage Vf (V)Capacitance C (pF), Vf = 0, f = 1 MHzThermal Resistance R θJ-PIN (°C/W)Speed of Response τS (ns) Time Constante –t/τS Typ.Max.If (mA)Typ.Typ.HLMP-NL06a a.Contact your Broadcom Sales Representative about operating currents below 10 mA.2.02 2.4204024020HLMP-NG0x a1.902.4204024020Part Number Luminous Intensity aa.The luminous intensity, lv, is measured at the mechanical axis of the lamp package. The actual peak of the spatial radiation patternmay not be aligned with this axis.Typ. Peak Wavelength(nm)Typ. Dominant Wavelength b(nm)b.The dominant wavelength, λd , is derived from the CIE Chromaticity Diagram and represents the color of the device.Typ. Spectral Half Width (nm)Luminous Efficacy c (lm/W)c.The radiant intensity, le, in watts per steradian, may be found from the equation le = lv/ ηv, where lv is the luminous intensity incandelas and ηv is the luminous efficacy in lumens/watt.Min. (mcd)If (mA)HLMP-NG0590.22063562617150HLMP-NG0790.22063562617150HLMP-NL0696.22059259017480Figure 1: Relative Intensity vs. Peak Wavelength00.10.20.30.40.50.60.70.80.91500550600650700R E L A T I V E I N T E N S I T YWAVELENGTH – nmAlInGaP AMBER AlInGaP REDFigure 2: Forward Current vs. Forward VoltageFigure 3: Relative Luminous Intensity vs. Forward Current1020304050I F – F O R W A R D C U R R E N T – m AV F – FORWARD VOLTAGE – VR E L A T I V E L U M I N O U S I N T E N S I T Y (N O R M A L I Z E D AT 20 m A )I F – DC FORWARD CURRENT – mAFigure 4: Maximum Forward DC Current vs. Ambient TemperatureI F – F O R W A R D C U R R E N T – m AT A – AMBIENT TEMPERATURE – °CFigure 5: Representative Spatial Radiation Pattern for 45° Viewing AngleFigure 6: Representative Spatial Radiation Pattern for 60° Viewing AngleN O R M A L I Z E D I N T E N S I T Y10ANGULAR DISPLACEMENT – DEGREES0.80.60.50.70.2-900.10.30.4-80-70-60-50-40-20-10-301020304050607080900.9N O R M A L I Z E D I N T E N S I T Y10ANGULAR DISPLACEMENT – DEGREES0.80.60.50.70.2-900.10.30.4-80-70-60-50-40-20-10-301020304050607080900.9Intensity Bin LimitsMaximum tolerance for each bin limit is ± 18%.Amber Color Bin Limits Tolerance for each bin limit is ± 0.5 nm.Color Bin Intensity Range (mcd) Min.Max.Red/Orange/ Red-Orange H13.827.6 I22.044.0 J 35.270.4 K 56.4112.8 L 90.2180.4 M 138.0276.0 N 200.0400.0 O 290.0580.0 P500.01000.0 Q700.01400.0 R1000.02000.0 S1400.02800.0 T 2000.04000.0 U2900.05800.0 V4200.08400.0 W6000.012000.0 X8700.017400.0 Y12600.025200.0 Z18200.036400.0Yellow/Amber G 14.729.4H23.547.0I37.675.2J60.1120.2K96.2192.4L147.0294.0M212.0424.0N 300.0 600.0O450.0900.0P700.01400.0Q1000.02000.0R1600.03200.0S2600.05200.0T4000.08000.0U6500.013000.0V10000.020000.0W16000.030000.0Bin Name Min. Max.1584.5587.0 2587.0589.5 4589.5592.0 6592.0594.5PrecautionsLead Forming⏹The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering on PC board.⏹For better control, use the proper tool to precisely form and cut the leads to applicable length rather than doing it manually.⏹If manual lead cutting is necessary, cut the leads after the soldering process. The solder connection forms a mechanical ground that prevents mechanical stress due to lead cutting from traveling into the LED package. Use this method for the hand soldering operation,because the excess lead length also acts as small heat sink.Soldering and Handling⏹Take care during the PCB assembly and soldering process to prevent damage to the LED component. ⏹The LED component may be effectively hand soldered to the PCB. However, do this under unavoidable circumstances, such as rework. The closest manual soldering distance of the soldering heat source(soldering iron’s tip) to the body is 1.59 mm. Soldering the LED using soldering iron tip closer than 1.59 mm might damage the LED.⏹Apply ESD precautions on the soldering station and personnel to prevent ESD damage to the LEDcomponent that is ESD sensitive. Refer to Broadcom application note AN 1142 for details. The soldering iron used must have a grounded tip to ensure electrostatic charge is properly grounded.⏹Recommended soldering conditions:⏹Set and maintain wave soldering parameters according to the recommended temperature and dwell time.Perform daily checks on the soldering profile to ensure that it always conforms to the recommended soldering conditions.NOTE:1.PCBs with different size and design (componentdensity) will have a different heat mass (heat capacity). This might cause a change in temperature experienced by the board if the same wave soldering setting is used. Therefore, recalibrate the soldering profile again before loading a new type of PCB.2.Take extra precautions during wave soldering to ensurethat the maximum wave temperature does not exceed 250°C and the solder contact time does not exceed 3s. Overstressing the LED during the soldering process might cause premature failure to the LED due to delamination.⏹Loosely fit any alignment fixture that is being applied during wave soldering and do not apply weight or force on the LED. Use non-metal material because it will absorb less heat during the wave soldering process.⏹At elevated temperature, the LED is more susceptible to mechanical stress. Therefore, allow the PCB to cool down to room temperature prior to handling, which includes removal of alignment fixture or pallet.⏹If the PCB board contains both through-hole (TH) LED and other surface-mount components, solder surface-mount components on the top side of the PCB. If the surface mount must be on the bottom side, solder these components using reflow soldering prior to the insertion of the TH LED.⏹The recommended PC board plated through holes (PTH) size for LED component leads follows:⏹Oversizing the PTH can lead to a twisted LED after clinching. On the other hand, undersizing the PTH can cause difficulty inserting the TH LED.Wave Solderinga, b a.The preceding conditions refer to measurement with athermocouple mounted at the bottom of the PCB.b.Use only bottom pre-heaters to reduce thermal stressexperienced by LED.Manual SolderDipping Pre-heat Temperature 105°C max.—Pre-heat Time 30s max.—Peak Temperature 250°C max.260°C max.Dwell Time 3s max.5s max.LED Compo -nent Lead SizeDiagonal Plated Through-Hole DiameterLead size (typ.)0.45 × 0.45 mm (0.018 × 0.018 in.)0.636 mm (0.025 in.)0.98 to 1.08 mm(0.039 to 0.043 in.)Dambar shear-off area (max.)0.65 mm (0.026 in.)0.919 mm (0.036 in.)Lead size (typ.)0.50 × 0.50 mm (0.020 × 0.020 in.)0.707 mm (0.028 in.) 1.05 to 1.15 mm(0.041 to 0.045 in.)Dambar shear-off area (max.)0.70 mm (0.028 in.)0.99 mm (0.039 in.)Refer to application note AN1027 for more information about soldering and handling of TH LED lamps.Figure 7: Recommended Wave Soldering Profile25020015010050TIME (SECONDS)T E M P E R A T U R E (q C )Recommended solder: Sn63 (Leaded solder alloy)SAC305 (Lead-free solder alloy)Flux: Rosin fluxSolder bath temperature:245q C ± 5 q C (maximum peak temperature = 250q C)Dwell time: 1.5s – 3.0s (maximum = 3 seconds)Note: Allow for board to be sufficiently cooled to room temperature before you exert mechanical force.Copyright © 2014–2021 Broadcom. All Rights Reserved. The term “Broadcom” refers to Broadcom Inc. and/or its subsidiaries. For more information, go to . All trademarks, trade names, service marks, and logos referenced herein belong to their respective companies.Broadcom reserves the right to make changes without further notice to any products or data herein to improve reliability, function, or design. Information furnished by Broadcom is believed to be accurate and reliable. However, Broadcom does not assume any liability arising out of the application or use of this information, nor the application or use of any product or circuit described herein, neither does it convey any license under its patent rights nor the rights of others.。

国内首款USB2.0HUB控制器芯片SL2.2sDatasheet之欧阳语创编

国内首款USB2.0HUB控制器芯片SL2.2sDatasheet之欧阳语创编

USB2.0 HUB控制器集成电路USB 2. 0 HIGH SPEED 4-PORT HUB CONTROLLERSL2. 2s数据手册Data SheetVI. 0内容目录第一章管脚分配41.1 SL2. 2S 管脚图 41.2 SL2. 2S管脚定义4第二章功能叙述52.1综述52.2指不灯52.2.1单灯方案52.2.2多灯方案52.2. 3 LED指示定义52.3过流保护5表格5:工作范52. 4充电支持5 2.5 I2C 接口 5 2. 6 EEPROM 设置 5第三章电气特性53. 1极限工作条件5 3. 2工作范围5 3.3直流电特性5 3. 4 HS/FS/LS 电气特性5 3. 5 ESD 特性 5附录一封装5 表格目录表格1:端口 LED 定义5 表格2 : ACTIVE LED 定义5表格3: EEPROM 数据结构定义 (5)表格4:最大额定值5表格6:直流电特性5插图目录图1: SSOP28管脚图4 图2:单灯方案配置5图3: 5灯方案配置图4:附录封装图.9第一章管脚分配1.1 SL2. 2s管脚图图1: SS0P28管脚图12 SL2.2s管脚定义注释:0,输出;I输入;B双向;P 电源/接地;Pu上拉;Pd下拉;NC 悬空;第二章功能叙述2. 1综述SL2. 2s是一颗高集成度,高性能,低功耗的USB2. 0集线器主控芯片;该芯片采用STT技术,单电源供电方式,芯片供电电压为5v,内部集成5V转3. 3V,只需在外部电源添加滤波电容;芯片自带复位电路,低功耗技术让他更加出众。

芯片可以使用外部晶体,也可以使用内置晶体。

如果使用内置晶体,需要将芯片的XI输入接地。

•完美支持 USB2. 0 高速(480MHz), USB2. 0 全速(12MHz), 和低速模式(1. 5MHz)•集成12M晶体振荡器•集成 12MHz-to~480MHz PPL (Phase Lock Loop)•采用 Single Transaction Translator (STT)技术,是*TT系列中最具成本和效率方案•支持自供电到总线供电的自动枚举切换•支持使用外部EEPROM自定义VID'PID信息•支持5个指示灯及单个指示灯的选择2. 2指示灯用户根据自己的产品需要,选择多种点灯方案。

CPC2123 LED驱动器 数据手册说明书

CPC2123 LED驱动器 数据手册说明书

CHIPHOMER TECHNOLOGY (SHANGHAI) LIMITED CPC2123数据手册升压型LED驱动器1 描述CPC2123是一款为LED驱动而设计的升压型DC/DC转换器。

CPC2123采用高达1.1MHz 的工作频率,允许采用小巧的外部电感和电容元件。

LED采用串联的连接形式,这样保证流过每个LED的电流相同,从而可以获得一致的亮度。

CPC2123的开关管的峰值电流可达1200mA,并且可承受高达40V的电压。

在单节锂离子电池供电情况下,CPC2123可驱动最多达30颗LED。

随着供电电压升高,CPC2123可以驱动更多LED,非常适合于中大LCD屏背光应用。

CPC2123内置软启动功能,限制启动时的浪涌电流。

CPC2123内置过流和过热保护,增强了应用的安全性。

CPC2123为PWM调光。

CPC2123采用纤小的SOT23-6L封装。

特性单节锂离子电池可驱动单串12颗白光LED单节锂离子电池可驱动10串,每串3颗白光LED高电压(10~24V)供电最多可驱动6串,每串10颗LED内置软启动功能,限制启动时浪涌电流1.1MHz开关频率PWM调光占空比支持低至1%PWM调光频率1kHz以上独创的SW沿处理技术,防止EMI干扰同时具备较高效率300mV反馈电压(CPC2120为200mV反馈电压)开关管峰值限流1200mA内置过流保护,过热保护关机电流:<1μA采用纤小的SOT23-6L封装应用•手机•平板•LCD 背光•红外LED驱动•夜视摄像头•OTG•升压输出应用•电压偏置应用2 封装引脚 2.1 封装CPC2123SOT23-6LSW 1GND 2FB 36 VIN4 SHDN5 OVPFigure 1 CPC2123 封装引脚图2.2 引脚描述名称 序号 说明SW 1 开关引脚,外部连接电感和肖特基管,设计时应注意最大限度的缩小该引脚连线的长度以降低EMI 。

GND 2 接地引脚。

FITEL S123 Version 2 Series Fusion Splicer 产品说明书

FITEL S123 Version 2 Series Fusion Splicer 产品说明书

Features and Benefits• Illumination lamp lights up a wide area around V-grooves•Rugged and compact hand held design for demanding environmental conditions• Fast splice (13 sec) at low loss and fast heating (25 sec) for single fiber 1• Simple operation with fixed V-groove • Splicer is compatible with Seikoh Giken 2 and Diamond 3 SOCs • Internal battery charging•70 cycles for S123C/M4 V2 models with a single battery, and 160 cycles for S123M8/M12 v2 models with two batteries 4•Available for all METRO/LAN/FTTx fibers including ultra bend-insensitive fibers (e.g. EZ-Bend ® Fiber)OverviewWith its low profile and new super rugged body, the FITEL ® S123 Version 2 Series Fusion Splicer offers speedy operation for FTTx, LAN, backbone or long-haul installations. The lightweight, durable metal body frame and rubber protection corners provide robust protection, enabling use in challenging locations without compromising splicer performance. The S123 v2 Splicer is water resistant to IPX2 and dust resistant to IP5X.Product DescriptionA large battery capacity makes it possible to perform up to 70 cycles of splicing and heating for the S123C/M4 v2 models with a single battery, and 160 cycles for the S123M8/M12 v2 models with a dual battery configuration.Combining portability, power flexibility and field ruggedness, the S123 v2 Splicer delivers fast and consistent splicing with outstanding mobility and extreme ease-of-use. It also offers a splice-on-connector (SOC) solution.•Easy maintenance – Toolless electrode replacement/mirror free alignment system• Easy software upgrade via the Internet•Easily exchanged fiber holder systems (tight holder/fiber holder/SOC holder)•PC interface software to allow user management of splicing programs and results• Auto-start shrink sleeve oven feature • Improved GUI to further enhance ease-of-use• Large memory for storing data (2,000 splice data) and image (100 images)•RoHS compliantAuthorized Distributor of FITEL Products in the Americas1 By using semi-auto mode for splicing and pre-heating mode for heating2 Seikoh Giken is a registered trademark of SEIKOH GIKEN CO., LTD3 Diamond is a registered trademark of Diamond SA4By using semi-auto mode for splicing and regular mode for heatingRoHSIP525 Axis Shock2 | Under Tough EnvironmentsThe S123 v2 Fusion Splicer passed manufacturer testing based on criteria below 5 :• Drop resistant – 76 cm drops from 5 different angles• Water resistant – IPX2 rating drip proof6• Dust resistant – IP5X rating dust proof7S123C v2S123M4 v2S123M8 v2S123M12 v2Product Line-UpModel ApplicationS123C-A v2Splicing for single fiber (with soft case)S123C-B v2Splicing for single fiber (with hard case)S123M4-A v2Splicing for single to 4 ribbon fiber (with soft case)S123M4-B v2Splicing for single to 4 ribbon fiber (with hard case)S123M8 v2Splicing for single to 8 ribbon fiberS123M12 v2Splicing single to 12 ribbon fiber5 Above tests were performed at the manufacturer’s Furukawa Electric Co. Labs, and do not guarantee that the machine will be undamaged under these conditions.6 IPX2 rating drip proof means that the machine can be exposed to 3 mm/min drip from 4 different angles with 15° tilt for 2.5 min each and still functions.7 IP5X rating dust proof means that the machine can be exposed to dust particles with a diameter of 0.1 to 25 μm for 8 hours and still functions.Dust ResistantWater ResistantDrop ResistantApplicable Fibers SMF(ITU-T G.652), MMF(ITU-T G.651), DSF(ITU-T G.653), NZDSF(ITU-T G.655), BIF/UBIF (Bend insensitive fiber, ITU-T G.657)Cladding Diameter125 μmCoating Diameter250 to 900 μm for single fiber; 280 to 400 μm for ribbon (thickness) (S123M4, S124M8, S123M12) Fiber Cleave Length 5 to 10 mm (S123C); 10 mm (S123M4, S124M8, S123M12)Average Splice Loss SM: 0.05 dB, MM: 0.03 dB, DSF: 0.08 dB, NZDSF: 0.08 dBSplice Time Single fiber: 13 seconds; Ribbon fiber: 15 secondsHeat Time6Single fiber: 25 seconds (S922: 40 mm sleeve, S921: 60 mm sleeve) (Preheat mode) 7 (S123C, S124M4) Ribbon fiber: 35 seconds (S924: 40 mm sleeve) (Preheat mode) 8Splice Programs Max. 150 Heat Programs Max. 18 Automatic Heating Start Available Applicable Sleeves20/40/60 mmFiber Holding Tight holder (Loose tube applicable) or Fiber Holder System (S213C) Fiber holder system (S123M4, S124M8, S123M12)Tension Test 1.96 NReturn Loss of Splice60 dB or moreFiber Image Magnification58X (S123C), 48X (S123M4), 28X (S123M8), 20X (S123M12)Splice Memory Max. 1500 splices (S123C, S123M4); Max. 1000 splices (S123M8, S123M12)Image Capture Capacity Last 100 images to be automatically captured + Up to 24 images to be stored permanentlyDimension S123, S123M4: 127W × 199D × 81H mm (not including shock absorber) 159W × 231D × 104H mm (including shock absorber)S123M8, S123M12: 127W × 199D × 105H mm (not including shock absorber) 159W × 231D × 130H mm (including shock absorber)Weight S123C, S123M4: 1.4 kg (without battery), 1.6 kg (with S943B battery)S123M8, S123M12: 1.6 kg (without battery), 2.0 kg (with two S943B batteries)Monitor 3.5” color LCD monitorData Output USB ver.2.0 miniDisplaying Language20 languages (e.g. English, Spanish, Japanese, Chinese)Battery Capacity Typical 70 splice/heat cycles with S943B battery (S123C, S124M4) 9Typical 160 splice/heat cycles with two S943B batteries (S123M8, S124M12) 10Wind Protection Max. wind velocity of 15 m/sOperating Temperature-10 to + 50 °C (without excessive humidity)Storage Temperature-40 to +60 °C (without excessive humidity)Power Source AC Input 100 to 240 V (50/60 Hz), DC Input 11 to 17 V without any change of hardware8The first heating after turning on the power can be longer that usual heating time9 The number of the splicing and heating cycles the machine can produce using a fully charged battery at room temperature of 20° C, semi-auto mode for splicing and regular mode for heating. Depending on the condition of the batteries and operation environment, the number can vary.10T he number of the splicing and heating cycles the machine can produce using a two fully charged battery at room temperature of 20° C, semi-auto mode for splicing and regular mode for heating. Depending on the condition of the batteries and operation environment, the number can vary.S123 v2 Fusion Splicers | 3Compatible with Spice-on-Connectors (SOC)FITEL Splicer SOC PartnersCONNECTORS4 | Standard PackageItem P/N QuantityS123C-A S123C-B S123M4-A S123M4-B S123M8S123M12 1.) S123C v2 Main body S123-C-A-0001-V211————1.) S123M4 v2 Main body S123-M4-A-0003-V2——11——1.) S123M8 v2 Main body S123-M8-A-0003-V2————1—1.) S123M12 v2 Main body S123-M12-A-0003-V2—————12.) Soft Carrying Case SCC-011—1———3.) Hard Carrying Case HCC-01————113.) Hard Carrying Case HCC-02—1—1——4.) Battery Pack S943B1111 1 or 2 1 or 25.) Spare Electrodes S9691111116.) AC Adaptor for S123 v2S976A1111117.) AC Cable Cord—1111118.) Electrode Sharpener D51111111119.) Cleaning Brush VGC-0111111110.) Fiber Reformer (4)S122-X-A-0007—— 1 pair 1 pair——10.) Fiber Reformer (8/12)S122-X-A-0008———— 1 pair 1 pair User Manual—111111◆♦⌧⍓❝❝Cleaning Brush⍓Spare ElectrodesElectrode Sharpener❞❞Fiber ReformerItemP/N Quantity 1.) Soft Carrying Case SCC-0112.) Battery ChargerS958C 13.) AC Adaptor for S958C S977A 14.) Cooling Tray CTX-0115.) Angled Stand AGS-0116.) Working Belt WBT-0117.) USB CableUSB-0118.) Car Cigarette Cable CDC-0119.) Tripod AdaptorTPA-01110.) Tight Holder16 mm Cleave length 10 mm Cleave length S712T-016 S712T-010 1 pair 1 pair 11.) Fiber Holder160 μm coated fiber 250 μm coated fiber 500 μm coated fiber 900 μm coated fiberLoose Tube Fiber (left side) Loose Tube Fiber (right side)S712S-160S712S-250S712S-500S712S-900 S712S-LT-L S712S-LT-L1 pair 1 pair 1 pair 1 pair 1 pair 1 pair12.) SOC Holders <For Ferrule>Seiko Giken FC/SC connector (9 mm)Seiko Giken FC/SC connector (5 mm)Seiko Giken LC connector (9 mm)Seiko Giken LC connector (5 mm)Diamond E-2000/F-3000 connector <For Cordage>Seiko Giken Cordage (5 mm)Seiko Giken Cordage (9 mm)Diamond Cordage (5 mm)S712C-SGS9-L S712C-SGS5-L S712C-SGL9-L S712C-SGL5-L S712C-DM25-L S712C-SGC5-R S712C-SGC9-R S712C-DMC5-R 11111 11 1<Tool>Diamond Mount WTX-011 Smart FuseSoftware Interface for MachineSF-011S123 v2 Fusion Splicers | 5CategoryCodeDescriptionX Fiber Holder Type12316 mm Tight Holder S712T-01610 mm Tight Holder S712T-010Fiber Holder System Y . Number of Battery Packs (S943)01*2*Without battery pack 1 pack 2 packs* With 1 S958 battery charger and 1 S977 AC adapterAngled Stand in Action⍓Working Belt in ActionWorking Belt asShoulder Pack◆♦⌧⍓❝❞S123 v2 Fusion Splicers | 6。

ProLight PS2P -TFPE -FMR9 0.2W Power LED 技术数据表说明书

ProLight PS2P -TFPE -FMR9 0.2W Power LED 技术数据表说明书

ProLight PS2P-TFPE-FMR9 0.2W Power LED Technical Datasheet Version: 1.2Features‧High Color rendering index‧Good color uniformity‧Industry’s first lighting-class LED ‧Low Voltage DC operated‧Instant light (less than 100ns)‧No UV Main Applications‧The perfect light color for the meat counter ‧T8/T5 tube‧LED bulb‧Indoor/Outdoor Commercial and Residential ArchitecturalIntroduction‧PS2P qualifies as the JEDEC Level 1 MSL sensitivity level and suitable forSMD process, Pb_free reflow soldering capability, and full compliancewith EU Reduction of Hazardous Substances (RoHS) legislation.2016/10No. 89, Xiyuan Rd., Zhongli City, Taoyuan County 320,No. 89, Xiyuan Rd., Zhongli City, Taoyuan County 320, Notes:1. The cathode side of the device is denoted by the chamfer on the part body.2. Electrical insulation between the case and the board is required. Do not electrically connect either the anode or cathode to the slug.3. Drawing not to scale.4. All dimensions are in millimeters.5. Unless otherwise indicated, tolerances are ±0.10mm.6. Please do not solder the emitter by manual hand soldering, otherwise it will damage the emitter.7. Please do not use a force of over 0.3kgf impact or pressure on the lens of the LED, otherwise it will cause a catastrophic failure.*The appearance and specifications of the product may be modified for improvement without notice.2Emitter Mechanical DimensionsNo. 89, Xiyuan Rd., Zhongli City, Taoyuan County 320, Radiation ColorPart Number Luminous Flux ΦV (lm)CRIPattern Emitter Minimum TypicalMinimumLambertianFresh MeatPS2P-TFPE-FMR9151990●ProLight maintains a tolerance of ±7% on flux and power measurements.●ProLight maintains a tolerance of ± 2 on CRI measurements.●Please do not drive at rated current more than 1 second without proper heat sink.Flux Characteristics at 60mA, T J = 25°C3Optical Characteristics at 60mA, T J = 25°CElectrical Characteristics at 60mA, T J = 25°CColor Forward Voltage V F (V)Thermal Resistance Min.Typ.Max.Junction to Slug (°C/ W)Fresh Meat2.93.23.550●ProLight maintains a tolerance of ±0.1V for Voltage measurements.Total included Viewing Angle Angle Radiation Color Color Temperature CCT (degrees)(degrees)Pattern Min.Typ.Max.θ0.90V2 θ1/2LambertianFresh Meat3100 K-4000 K160120●ProLight maintains a tolerance of ±5% for CCT measurements.No. 89, Xiyuan Rd., Zhongli City, Taoyuan County 320, Absolute Maximum RatingsParameterFresh MeatDC Forward Current (mA)70Peak Pulsed Forward Current (mA)90 (less than 1/10 duty cycle@1KHz)ESD Sensitivity> ±500V (HBM per MIL-STD-883E Method 3015.7)LED Junction Temperature 120°C Operating Board Temperature -40°C -90°Cat Maximum DC Forward Current Storage Temperature -40°C -120°C Soldering Temperature JEDEC 020c 260°CAllowable Reflow Cycles 3Reverse VoltageNot designed to be driven in reverse bias4Photometric Luminous Flux Bin StructureColorBin CodeMinimumMaximumAvailable Photometric Flux (lm)Photometric Flux (lm)Color BinsFresh MeatM21517All N11719.4AllN219.422【1】●ProLight maintains a tolerance of ±7% on flux and power measurements.●The flux bin of the product may be modified for improvement without notice.●【1】The rest of color bins are not 100% ready for order currently. Please ask for quote and order Possibility.Forward Voltage Bin StructureColorBin CodeMinimum Voltage (V)Maximum Voltage (V)Fresh MeatB 2.9 3.0D 3.0 3.1E 3.1 3.2F 3.2 3.3G 3.3 3.4H3.43.5●ProLight maintains a tolerance of ±0.1V for Voltage measurements.Note: Although several bins are outlined, product availability in a particular bin varies by production runand by product performance. Not all bins are available in all colors.No. 89, Xiyuan Rd., Zhongli City, Taoyuan County 320, yxFresh MeatA24000 KA13100 KA3A4A05Color BinFresh Meat Binning Structure Graphical RepresentationNote:1. ProLight SmartBin is working to make the color bin smarter, by selecting that intelligence is infused into major A0bin with minor A1-A4 bins and processes that make assembly easilyNo. 89, Xiyuan Rd., Zhongli City, Taoyuan County 320, 6Color Spectrum, T J = 25°C1. Fresh MeatLight Output CharacteristicsRelative Light Output vs. Junction Temperature at 60mA020406080100120140160020406080100120R e l a t i v e L i g h t O u t p u t (%)Junction Temperature, T J (℃)Fresh Meat0.00.20.40.60.81.0350400450500550600650700750800850900R e l a t i v e S p e c t r a l P o w e r D i s t r i b u t i o nWavelength (nm)Standard Eye Response CurveFresh MeatNo. 89, Xiyuan Rd., Zhongli City, Taoyuan County 320, Forward Current Characteristics, T J = 25°C0.00.20.40.60.81.01.21020304050607080R e l a t i v e L u m i n o u s F l u xForward Current (mA)70102030405060708012345A v e r a g e F o r w a r d C u r r e n t (m A )Forward Voltage (V)010203040506070800255075100125150F o r w a r d C u r r e n t (m A )Ambient Temperature (℃)R θJ-A = 150°C/W R θJ-A = 125°C/W R θJ-A = 75°C/WR θJ-A = 100°C/W Ambient Temperature vs. Maximum Forward Current1. Fresh Meat (T JMAX = 120°C)No. 89, Xiyuan Rd., Zhongli City, Taoyuan County 320, Typical Representative Spatial Radiation PatternLambertian Radiation Pattern0102030405060708090100-100-80-60-40-2020406080100R e l a t i v e I n t e n s i t y (%)Angular Displacement (Degrees)8Soak RequirementsLevel Floor Life Standard Accelerated Environment Time Conditions Time (hours)Conditions Time (hours)Conditions1Unlimited≤30°C /168 +5/-085°C /NA NA 85% RH85% RH●The standard soak time includes a default value of 24 hours for semiconductor manufature'sexposure time (MET) between bake and bag and includes the maximum time allowed out ofthe bag at the distributor's facility.●Table below presents the moisture sensitivity level definitions per IPC/JEDEC's J-STD-020C.Soak Requirements Level Floor Life Standard Accelerated Environment Time Conditions Time (hours)Conditions Time (hours)Conditions1Unlimited≤30°C /168 +5/-085°C /NA NA 85% RH85% RH2 1 year≤30°C /168 +5/-085°C /NA NA 60% RH60% RH2a 4 weeks≤30°C /696 +5/-030°C /120 +1/-060°C / 60% RH60% RH60% RH3168 hours≤30°C /192 +5/-030°C /40 +1/-060°C / 60% RH60% RH60% RH472 hours≤30°C /96 +2/-030°C /20 +0.5/-060°C / 60% RH60% RH60% RH548 hours≤30°C /72 +2/-030°C /15 +0.5/-060°C / 60% RH60% RH60% RH5a24 hours≤30°C /48 +2/-030°C /10 +0.5/-060°C / 60% RH60% RH60% RH6Time on Label≤30°C / Time on Label30°C /NA NA (TOL)60% RH(TOL)60% RHMoisture Sensitivity Level -JEDEC Level 1No. 89, Xiyuan Rd., Zhongli City, Taoyuan County 320,9No. 89, Xiyuan Rd., Zhongli City, Taoyuan County 320, Stress TestStress Conditions Stress Duration Failure CriteriaRoom Temperature 25°C, I F = max DC (Note 1)1000 hours Note 2Operating Life (RTOL)Wet High Temperature 85°C/60%RH, I F = max DC (Note 1)1000 hours Note 2Operating Life (WHTOL)Wet High Temperature 85°C/85%RH, non-operating1000 hours Note 2Storage Life (WHTSL)High Temperature 110°C, non-operating 1000 hours Note 2Storage Life (HTSL)Low Temperature -40°C, non-operating 1000 hours Note 2Storage Life (LTSL)Non-operating-40°C to 120°C, 30 min. dwell,200 cyclesNote 2Temperature Cycle (TMCL)<5 min. transferMechanical Shock 1500 G, 0.5 msec. pulse, Note 35 shocks each 6 axis Natural Drop On concrete from 1.2 m, 3X Note 3Variable Vibration10-2000-10 Hz, log or linear sweep rate,Note 3Frequency20 G about 1 min., 1.5 mm, 3X/axisSolder Heat Resistance260°C ±5°C, 10 sec.Note 3(SHR)SolderabilitySteam age for 16 hrs., then solder dipSolder coverageat 260°C for 5 sec.on leadNotes:1. Depending on the maximum derating curve.2. Criteria for judging failureItemTest Condition Criteria for Judgement Min.Max.Forward Voltage (V F )I F = max DC --Initial Level x 1.1Luminous Flux or I F = max DC Initial Level x 0.7--Radiometric Power (ΦV )Reverse Current (I R )V R = 5V--50 μA* The test is performed after the LED is cooled down to the room temperature.3. A failure is an LED that is open or shorted.10Qualification Reliability TestingNo. 89, Xiyuan Rd., Zhongli City, Taoyuan County 320, TYPE A.11Recommended Solder Pad DesignStandard Emitter ●All dimensions are in millimeters.TYPE B.No. 89, Xiyuan Rd., Zhongli City, Taoyuan County 320, 12Reflow Soldering ConditionProfile FeatureSn-Pb Eutectic Assembly Pb-Free Assembly Average Ramp-Up Rate 3°C / second max.3°C / second max.(T Smax to T P )Preheat–Temperature Min (T Smin )100°C 150°C –Temperature Max (T Smax )150°C 200°C –Time (t Smin to t Smax )60-120 seconds 60-180 seconds Time maintained above:–Temperature (T L )183°C 217°C –Time (t L )60-150 seconds60-150 secondsPeak/Classification Temperature (T P )240°C 260°C Time Within 5°C of Actual Peak 10-30 seconds 20-40 seconds Temperature (t P )Ramp-Down Rate6°C/second max.6°C/second max.Time 25°C to Peak Temperature6 minutes max.8 minutes max.●We recommend using the M705-S101-S4 solder paste from SMIC (Senju Metal Industry Co., Ltd.) for lead-free soldering.●Do not use solder pastes with post reflow flux residue>47%. (58Bi-42Sn eutectic alloy, etc) This kind of solder pastes may cause a reliability problem to LED.●All temperatures refer to topside of the package, measured on the package body surface.●Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head soldering iron should be used. It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing.●Reflow soldering should not be done more than three times.●When soldering, do not put stress on the LEDs during heating.●After soldering, do not warp the circuit board.t 25°C to Peakt S PreheatTimeT e m p e r a t u r eCritical Zone T L to T PRamp-upRamp-downT SmaxT Smint Pt LT PT L25IPC-020cNotes:1. Drawing not to scale.2. All dimensions are in millimeters.3. Unless otherwise indicated, tolerances are ±0.10mm.13 No. 89, Xiyuan Rd., Zhongli City, Taoyuan County 320,Notes:1. Empty component pockets sealed with top cover tape.2. 3000 pieces per reel.3. Drawing not to scale.4. All dimensions are in millimeters.14 No. 89, Xiyuan Rd., Zhongli City, Taoyuan County 320,Precaution for Use●StoragePlease do not open the moisture barrier bag (MBB) more than one week. This may cause theleads of LED discoloration. We recommend storing ProLight’s LEDs in a dry box after openingthe MBB. The recommended storage conditions are temperature 5 to 30°C and humidity lessthan 40% RH. It is also recommended to return the LEDs to the MBB and to reseal the MBB.●The slug is is not electrically neutral. Therefore, we recommend to isolate the heat sink.●We recommend using the M705-S101-S4 solder paste from SMIC (Senju Metal IndustryCo., Ltd.) for lead-free soldering.●Do not use solder pastes with post reflow flux residue>47%. (58Bi-42Sn eutectic alloy, etc) Thiskind of solder pastes may cause a reliability problem to LED.●Any mechanical force or any excess vibration shall not be accepted to apply during coolingprocess to normal temperature after soldering.●Please avoid rapid cooling after soldering.●Components should not be mounted on warped direction of PCB.●Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable,a heat plate should be used. It should be confirmed beforehand whether the characteristics ofthe LEDs will or will not be damaged by repairing.●This device should not be used in any type of fluid such as water, oil, organic solvent and etc.When cleaning is required, isopropyl alcohol should be used.●When the LEDs are illuminating, operating current should be decide after considering thepackage maximum temperature.●The appearance, specifications and flux bin of the product may be modified for improvementwithout notice. Please refer to the below website for the latest datasheets./Handling of Silicone LEDsNotes for handling of silicone LEDs●Please do not use a force of over 0.3kgf impact or pressure on the silicone ,otherwise it will cause a catastrophic failure.●The LEDs should only be picked up by making contact with the sides of the LED body.●Avoid touching the silicone especially by sharp tools such as Tweezers.●Avoid leaving fingerprints on the silicone.●Please store the LEDs away from dusty areas or seal the product against dust.●When populating boards in SMT production, there are basically no restrictionsregarding the form of the pick and place nozzle, except that mechanical pressureon the silicone lens must be prevented.●Please do not mold over the silicone lens with another resin. (epoxy, urethane, etc)15 No. 89, Xiyuan Rd., Zhongli City, Taoyuan County 320,。

L12 LED保护芯片说明书

L12 LED保护芯片说明书

L12芯片说明书一、综述L12是一种自主设计的新型LED保护芯片,具有单颗LED损坏引起开路时能自动接通从而避免整灯不亮的功能。

在LED正常工作时,L12工作在截止状态下。

当LED损坏开路时,造成两端电压上升,当电压上升到L12的击穿触发电压时,L12自动进入导通保护模式,原来流经LED的电流将从L12通过。

在LED误反接时,电流也从L12上旁路流过,从而保护LED不被反向击穿。

1.正极Anode2.负极Cathode3.空脚NC二、特点�典型两端器件�导通压降1~1.3V�截止漏电流0.1~1uA�触发标准电压8.0V�工作电流350mA�静电防护ESD8KV(接触)15KV(空气)�抗干扰能力强�无铅封装接线图三、典型应用�大功率LED灯珠�LED路灯�LED背光模组源�开态快速短路保护四、优点�无用功耗极低;当LED正常工作时,截止漏电流极小,几乎不产生功耗。

�导通功耗很小;当LED损坏开路后,短路导通压降低,功耗很小。

�具有静电反向保护限压功能,保护LED不受静电损坏。

�防LED误反接,保护LED不受反向击穿损坏。

�采用SOT23-3标准封装,适合PCB使用。

�晶粒面积很小,便于与LED芯片集成封装。

�抗干扰能力强。

�成本低。

五、主要参数指标参数最小值典型值最大值-0.7V—12V输入电压范围Input voltage截止漏电流—0.1µA1µAOff state current7.0V8.0V9.0V击穿触发电压Breakdown voltage1.0V 1.1V 1.3V导通压降(I=350mA)On state drop out voltage50mA350mA400mA工作电流Operation current响应时间200ns500ns1us Response time8KV(接触)15KV(空气)静电防护ESDElectrostatic Discharge1.2V 1.3V 1.5V反向导通电压Reverse break-over voltage150℃结温Junction temperature-40℃85℃工作温度Operation temperature260℃(10s)焊接温度Welding temperature—646µm*570µm—晶粒尺寸Grain size六、典型IV特性曲线常温25℃下L12的典型I-V特性曲线七、典型应用电路图八、SOT23-3封装尺寸封装尺寸图九、管芯压焊点尺寸图。

DS3231中文资料

DS3231中文资料

___________________________________DS3231 ӊĂ I 2C (RTC)Lj ԣ (TCXO) ă Ҫ Lj ү ă լ LjԌ դ ăDS3231 LjԳ 16 Ă300mil SO ăRTC ү Ă Ă Ă Ă Ă ă 31 Lj LjҪ ԣխă 24 AM /PM 12 ă Ӭ Ӭ Ԓ ă I 2C ăĂ ԣխ Ӕ V CC Lj Ռ Ă LjԌ Ӥ ӄ ă LjRST Ѣ Lj դ ԩ ă___________________________________ӹGPS___________________________________♦0°C +40°C ±2ppm ♦-40°C +85°C ±3.5ppm ♦ ӄ ♦ǖ0°C +70°C ǖ-40°C +85°C ♦♦ Ă Ă Ă Ă Ă Ă LjԌ 2100 ԣխ♦ ♦ Ӭ Ԓ♦ (400kHz) I 2C ♦3.3V♦ ǖ ±3°C ♦♦RST 0 ♦ү (UL)DS3231ĂI 2C Ă RTC/TCXO/______________________________________________Maxim Integrated Products1Rev 4; 10/06______________________________ăNbyjn LjNbyjn ă Lj Lj Nbyjn ăLj Nbyjn ǖxxx/nbyjn.jd/dpn/doă#ӹ RoHS Ӷ Lj Lj RoHS ăԳ JESD97 e3 Lj ă Ӷ Đ#đ ӹ RoHS Ӷ ăD S 3231ĂI 2C Ă RTC/TCXO/2ABSOLUTE MAXIMUM RATINGSRECOMMENDED DC OPERATING CONDITIONS(T A = T MIN to T MAX , unless otherwise noted.) (Notes 1, 2)Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.Voltage Range on V CC , V BAT , 32kHz, SCL, SDA, RST ,INT /SQW Relative to Ground.............................-0.3V to +6.0V Operating Temperature Range(noncondensing).............................................-40°C to +85°C Junction Temperature......................................................+125°CStorage Temperature Range...............................-40°C to +85°C Lead Temperature(Soldering, 10s).....................................................+260°C/10s Soldering Temperature....................................See the Handling,PC Board Layout, and Assembly section.ELECTRICAL CHARACTERISTICS(V CC = 2.3V to 5.5V, V CC = Active Supply (see Table 1), T A = T MIN to T MAX , unless otherwise noted.) (Typical values are at V CC =3.3V, V BAT = 3.0V, and T A = +25°C, unless otherwise noted.) (Notes 1, 2)DS3231ĂI 2C Ă RTC/TCXO/_____________________________________________________________________3ELECTRICAL CHARACTERISTICS (continued)(V CC = 2.3V to 5.5V, V CC = Active Supply (see Table 1), T A = T MIN to T MAX , unless otherwise noted.) (Typical values are at V CC =3.3V, V BAT = 3.0V, and T A = +25°C, unless otherwise noted.) (Notes 1, 2)ELECTRICAL CHARACTERISTICS(V CC = 0V, V BAT = 2.3V to 5.5V , T A = T MIN to T MAX , unless otherw.ise noted.) (Note 1)D S 3231ĂI 2C Ă RTC/TCXO/AC ELECTRICAL CHARACTERISTICS(V CC = V CC(MIN)to V CC(MAX)or V BAT = V BAT(MIN)to V BAT(MAX), V BAT > V CC , T A = T MIN to T MAX, unless otherwise noted.) (Note 1)POWER-SWITCH CHARACTERISTICS(T = T to T )DS3231ĂI 2C Ă RTC/TCXO/_____________________________________________________________________5___________________________________________________________________Ѣ___________________________________________________________________D S 3231ĂI 2C Ă RTC/TCXO/6__________________________________________________________I 2CNote 1:Limits at -40°C are guaranteed by design and not production tested.Note 2:All voltages are referenced to ground.Note 3:I CCA —SCL clocking at max frequency = 400kHz.Note 4:Current is the averaged input current, which includes the temperature conversion current.Note 5:The RST pin has an internal 50k Ω(nominal) pullup resistor to V CC .Note 6:After this period, the first clock pulse is generated.Note 7:A device must internally provide a hold time of at least 300ns for the SDA signal (referred to the V IH(MIN)of the SCL signal)to bridge the undefined region of the falling edge of SCL.Note 8:The maximum t HD:DAT needs only to be met if the device does not stretch the low period (t LOW ) of the SCL signal.Note 9: A fast-mode device can be used in a standard-mode system, but the requirement t SU:DAT ≥250ns must then be met. Thisis automatically the case if the device does not stretch the low period of the SCL signal. If such a device does stretch the low period of the SCL signal, it must output the next data bit to the SDA line t R(MAX)+t SU:DAT = 1000 + 250 = 1250ns before the SCL line is released.Note 10:C B —total capacitance of one bus line in pF.Note 11:The parameter t OSF is the period of time the oscillator must be stopped for the OSF flag to be set over the voltage range of0.0V ≤V CC ≤V CC(MAX)and 2.3V ≤V BAT ≤3.4V.Note 12:This delay applies only if the oscillator is enabled and running. If the EOSC bit is a 1, t REC is bypassed and RST immediate-ly goes high.DS3231ĂI 2C Ă RTC/TCXO/_____________________________________________________________________7______________________________________________________________________(V CC = +3.3V, T A = +25°C, unless otherwise noted.)STANDBY SUPPLY CURRENT vs. SUPPLY VOLTAGEV CC (V)I C C S (μA )5.04.03.05010015002.0SUPPLY CURRENTvs. SUPPLY VOLTAGEV BAT (V)I B A T (μA )5.04.03.00.8000.9001.0001.1001.2000.7002.0SUPPLY CURRENT vs. TEMPERATURETEMPERATURE (°C)I B A T (μA )80.060.040.020.00.0-20.00.7000.8000.9001.0000.600-40.0FREQUENCY DEVIATION vs.TEMPERATURE vs. AGING VALUECRYSTAL AGING REGISTER VALUE F R E Q U E N C Y D E V I A T I O N (p p m )966432-64-32-96-40-30-20-100102030405060-128128D S 3231ĂI 2C Ă RTC/TCXO/8_________________________________________________________________________132kHz 2V CC3INT /SQW4RST5–12N.C.13GND14V BAT15SDA 16SCLDS3231ĂI 2C Ă RTC/TCXO/_____________________________________________________________________9_____________________________________________________________________________________________________________DS3231 32kHz ԣ RTC ăTCXO Ă Ը ă -40°C +85°C LjRTC ү ±2 / ăTCXO 32kHz ăRTC / Lj Ӭ Ӭ Ԓ ăINT /SQW Ԓ ă /Ă Ă Ă Ă Ă ă 31 Lj LjԌҪ ԣխă 24 AM /PM 12 ă ԩ I 2C ăԣ Ӕ V CC Lj Ռ LjԌ Ӥ ӄ ăRST ԩѢ LjԌ ă32kHz ă ă Lj ă ԥ Lj ү ăDC ă 0.1μF 1.0μF ăԥ Lj ăԒ ă Lj 5.5V 5.5V ă Lj ү ă (0Eh) INTCN ă INTCN 0 Lj ԒLj RS2 RS1 ă INTCN 1 Lj INT /SQW ( )ă INTCN 1Lj Ԍ ăă / ă V CC V PF Ӷ ă V CC V PF LjRST Ӈ ă V CC մ V PF Ԍ t RST LjRST ԩ ă Ă Ѣ ă Ѣ ă ԩ Ӷ 50kΩ V CC ă ă Ljt REC Ӈ ӚLjRST ă ă ԩӤ ă ăӄ ă 0.1μF 1.0μF ă V BAT LjI 2C Lj ă ԥ V BAT Lj ă Lj UL Lj Ը ǖ/qa/info/ul ă/ ă I 2C / ă ă ă I 2C Lj ԧ ăD S 3231______________________________DS3231 ԩ ăѹ ǖTCXO Ă ĂѢ RTC ă ԩ ă32kHz TCXOTCXO Ҫ Ă ă Lj Փ ӹ Lj AGE Lj ă Ӱ Lj Ljԯ Ҫ AGE Ӱ ăV CC Lj 64 ăԣ V CC Ӕ ă V CC V PF Lj V CC ă V CC V PF V BAT LjDS3231 V CC ă V CC V PF Ԍ V BAT Lj V BAT ăԸ ӹ1ăү LjV BAT V CC V PF Ԍԥ Lj I 2C ă 1 ă V CC I 2C 2 Lj Ռ LjԌ ă Lj (V CC V BAT ) ү ă 64 Ռ Ԍ ăѢDS3231 RST Ѣ ă DS3231ԥ Lj RST ă Ռ ӫ LjDS3231 RST ă ԩ (PB DB ) LjDS3231 RST ă ү LjDS3231 Ռ ă Ռ Ѣ LjDS3231 RST Ԍү t RST ăRST Lj Ҵ ă V CC V PF Lj դ ԩ Ҵ LjԌ RST ă V CC մ V PF LjRST ү 250ms (t REC )Lj ă V CC (Ը ԩ )Lj t REC LjRST Ӱ ăTCXO LjRTC Ă Ă Ă Ă Ă ă 31 Lj Lj Ҫ ă 24 AM /PM 12 ăӬ Ӭ Ԓ ăINT /SQW դ Lj Ԓ ă INTCN ă_____________________________ ӹ1 DS3231 ӹă Lj (12h) Lj 00h ă I 2C START 00h Lj ă Lj ă Ճ Lj Ө ă______________________________I 2CV CC V BAT Lj I 2C ă DS3231 V CC Lj DS3231 I 2C ԥ ԧLj ǖ DS3231 ă Lj SDA SCL Lj DS3231 I 2C ă Lj SCL SDA Ljդ START ăĂI 2C Ă RTC/TCXO/10____________________________ă 1 RTC ă ă Գ lj Ӭ (B C D ) ăDS3231 12 24 ă 6 12 24 ă Lj 12 ă 12 Lj 5 AM /PM Lj PM ă 24 Lj 5 (20 23 )ă 99 00 Lj ( 7 )ăă Lj Ӥ ( Lj 1 Lj 2 Lj )ăԥ ԥ Ճ ăLj ( ) ԩ ă Lj START ԩ ԧă Lj ү ă Ճ Ө ăDS3231ĂI 2C Ă RTC/TCXO/____________________________________________________________________111.ǖ Lj ăD S 3231Lj ă DS3231 Ճ ă Lj Ө LjӤ 1 ă LjԌ Ԓ Lj 1Hz Ԓ 500ms ă___________________________________DS3231Ҫ / ă 1 07h 0Ah ă 2 0Bh 0Dh ă Ӭ ( I N T C N )Lj INT /SQW ă / 7 Ӛ (ӹ2)ă Ӛ 0 Lj /ԯ ă Ӭ Ă Ă Ă ăӹ2 ă ԥѢ ӹ Lj ԥ Ճ ăDY/DT ( / 6 ) 0 5 ă DY/DT 0Lj ă DY/DT 1Lj ăRTC Lj Ӷ 'A1F' 'A2F' 1ă 'A1IE' 'A2IE' 1LjԌ INTCN 1Lj INT /SQW ă Ռ ăĂI 2C Ă RTC/TCXO/12ӹ2. Ӛ_________________________DS3231 ( )Lj Ă Ԓ ă(0Eh)7 ǖ (EOSC)ă 0 Lj ă 1Lj DS3231 V BAT ă Lj ( 0)ă DS3231 V CC Lj EOSC Lj ү ă6 ǖ ӄ Ԓ (BBSQW)ă 1Ԍ DS3231 V BAT Lj V CC Lj Ԓ ă BBSQW 0 Lj V CC Lj INT /SQW Ӱ ă Lj ( 0)ă5 ǖ (CONV)ă 1 Lj LjԌ TCXO ă ă TCXO Ճ Lj Փ BSY ă ԥ ԩ64 ă2ms ԥ BSY ăCONV ү 1Lj CONV BSY Ӱ 0ă CONV ă4 3 ǖ (RS2 RS1)ă Ԓ Lj Ԓ ă ӹ RS Ԓ ă Lj 1 (8.192kHz)ă2 ǖ (INTCN)ă INT /SQW ăINTCN 0 LjINT /SQW ԒăINTCN 1 Lj Lj INT /SQW ( )ă Ӷ Lj INTCN ă LjINTCN 1ă1 ǖ2 (A2IE)ă 1 Lj 2Ӷ (A2F) INT /SQW ( INTCN =1 )ă A2IE 0 INTCN 0 LjA2F ԥ ă LjA2IE ( 0)ă0 ǖ 1 (A1IE)ă 1 Lj 1Ӷ (A1F) INT /SQW ( INTCN =1 )ă A1IE 0 INTCN 0 LjA1F ԥ INT /SQW ă LjA1IE ( 0)ăDS3231ĂI 2C Ă RTC/TCXO/____________________________________________________________________13ԒD S 3231(0Fh)7 ǖ Ӷ (OSF)ă 1ӹ Lj Lj ă Lj 1ă OSF ǖ1) ă2)V CC V BAT ԥ ă3) ӄ LjEOSC ӡă4) ԩ ( Ă )ă ү 1Lj 0 ă3 ǖ 32kHz (EN32kHz)ă 32kHz ă 1 Lj 32kHz LjԌ 32.768kHz Ԓ ă 0 Lj32kHz Ӱ ă Lj 1ăDS3231 ( )Lj32kHz 32.768kHz Ԓ ă2 ǖ (BSY)ă ӹ TCXO ă BSY 1ă 1 ă1 ǖ 2Ӷ (A2F)ă 2Ӷ 1 ӹ2 ă A2IE 1LjԌ INTCN 1Lj INT /SQW ă 0 A2F ă 0ă 1 Ճ ԥ Ӱ ă0 ǖ 1Ӷ (A1F)ă 1Ӷ 1 ӹ 1 ă A1IE 1LjԌ INTCN 1Lj INT /SQW ă 0 A1F ă 0ă 1 Ճ ԥ Ӱ ă_____________________________ ԣխԣխ 8 LjԌ ă 2 ԣ ă Lj LSB ă Ljԣխ ǖ ի Lj Ӕ ӰLj ( CONV ) ă Ֆ 32kHz Lj ăLj Ǘ Lj ăԥ Lj LSB Ӱ (ppm) ԥ ă - ă +25°C Lj LSB ի 0.1ppm ăĂI 2C Ă RTC/TCXO/14ԣխ(10h)___________________ (11h 12h)Գ 10 Ӭ ӹ Lj +0.25°C Ӳ Lj 11h 12h ă Ӭ 2 ԣ ă 8 11h Lj 2 12h ҙ ă Lj 0°C Lj ă ă_________________________I 2CDS3231 I 2C ă ӄ Lj ӄ ă ӄ ӄă ӄ ӄ ӄă Ӥ ӄ Lj ӄ դ (SCL)Ă Lj դ START STOP ăDS3231 I 2C ӄ ă ӄ SCL SDA I/O ă Ӷ (100kHz ) (400kHz )ăDS3231 ă ( 2)ǖ• ԯ ă•Lj Lj Ӥ ү ă Ӱ Lj Ӈ ăLj ǖǖ ү ăǖ Lj Ӱ Lj START ăǖ Lj Ӱ Lj STOP ăǖդ START Lj ү Lj ӹ ă Ӥ Ӱă ăSTART LjԌ STOP ă START STOP Lj ӄ ă Lj 9 ăǖӇ ӄӤ ă ӄӤ Lj ăӄӤ SDA Lj LjSDA ү ă Lj ү Ӥ ă ԥ ӄ ԧ դ Lj ӄ ӄ ă Lj ӄӤ ү ӄ դ STOP ăDS3231ĂI 2C Ă RTC/TCXO/____________________________________________________________________15D S 32313 4 I 2C ă R/W Lj ǖӄ ӄ ă ӄ ӄ ă ă ӄ ă (MSB) ăӄ ӄ ă ӄ ( ӄ )ă ӄ ă ӄ ӄ ă Lj ӄ ă Lj ăӄդ START ĂSTOP ă STOP START ă START Lj ԥ ă (MSB) ăDS3231 ǖӄ (DS3231 )ǖ SDA SCL ă Lj ăSTART STOP ăӄ Lj Ӽă ӄդ START Lj ӄ ă ӄ Ҫ 7 DS3231 Lj 1101000Lj (R/W )ă 0Ljӹ Ճ ă Ԍ ӄ LjDS3231 SDA ă DS3231 ӄĂI 2C Ă RTC/TCXO/162. I 2C3. ӄ ()4. ӄ ( )+ Lj ӄ DS3231ă DS3231 LjDS3231 ă ӄ 0 LjDS3231 ă Lj ă ӄդ STOP ăӄ (DS3231 )ǖ ӄ ă Lj Lj ăDS3231 SDA LjԌ SCL ăSTART STOP ă ӄ Lj Ӽă ӄդ START Lj ӄ ă ӄ Ҫ 7 DS3231 Lj 1101000Lj (R/W )ă 1Ljӹ Ճ ă ӄ LjDS3231 SDA ă DS3231 LjԌ ă Lj ăDS3231Ӥ Ճ ă___________________Ճ ĂPCB Ԧ ѠDS3231 Ҫ Ր ă - ӄLj Ӥ Lj үӨ ăӨ մ Ԓ Lj ăՍ Lj Ө ă N.C.( ) Ӥ ăչ կ Գ չҪ ăӤ Ӷ Ճ Lj ăչ (MSD) Ը IPC/JEDEC J-STD-020Ӷ ă 2 ăDS3231ĂI 2C Ă RTC/TCXO/____________________________________________________________________17D S 3231ĂI 2C Ă RTC/TCXO/18______________________________TRANSISTOR COUNT: 33,000SUBSTRATE CONNECTED TO GROUND PROCESS: CMOS______________________________Theta-JA: +73°C/W Theta-JC: +23°C/W______________________________DS3231ĂI 2C Ă RTC/TCXO/`````````````````````````````````````````````````````````````````````````````( Lj Lj /packages ă)____________________________________________________________________19D S 3231ĂI 2C RTC/TCXO/Nbyjn Nbyjn Lj ăNbyjn Ă ă20___________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600©2006 Maxim Integrated ProductsNbyjn!Joufhsbufe!Qspevdut-!Jod/ ăEbmmbt!Tfnjdpoevdups!Dpsqpsbujpo! ă____________________________________________________________________Rev 0Ǘ1/05ǖ Ԧ ăRev 1Ǘ2/05ǖ( 1Ă3 ) ±2°C ±3°C ă( 1 ) ă( 2Ă3Ă4 )T A = -40°C to +85°C T A = T MIN to T MAX ă( 8 ) ăRev 2Ǘ6/05ǖ( 1 )Đ UL đǗ ӹ Lj Ӷ S Ǘ N.C. ă( 2 )Đԥ đǗV PF MIN 2.35V 2.45V ă( 3 ) ԣխ Ӷă( 7 ) ӶTOC4ă( 8 ) ӹ X1 ă( 9 ) V CC V BAT ă( 10 ) I 2C ԩ ă( 11 ) 1ǖ Ǘ MSB LSB ă( 13 ) ӹ Ӷ ă( 14 ) Lj Ӱ ԣխ = 00h Ǘ 7 ( ԣխ )ă( 15 ) 7 ( )Ǘ I 2C ԩ ă( 17 ) J-STD-020 Ă Ճ ĂPCB Ԧ Ѡ ԩ ăRev 3Ǘ11/05ǖ( 1 ) RoHS Ӷ ăRev 4Ǘ10/06ǖ( 1 ) ԩ RST UL( 2Ă3 )ECĐV CC > V BAT đ ĐV CC = Active Supply (see Table 1)đă( 6 ) 12Lj ӹ t REC Ճ ă( 7 )TOC 1Ă2 3ă( 9 ) 32kHz ĂV CC RST ă( 10 )ӹ1ǖӶĐPowered By đ ĐActive Supply đǗ ԩ Lj Đ V CC đ ĐV CC V PF đă( 13 ) BBSQW SQW Ǘ( 5 )ǗINT /SQW Đ đă( 14 ) ԩ ԣխԩ Ǘ32kHzĐ ӹ đ Đ đăNbyjn9439 211194ǖ911!921!1421 ǖ121.732262:: ǖ121.732263::。

SN3112-12 P0.1中文版

SN3112-12 P0.1中文版

典型应用电路图
图 1 典型应用电路
注 1:REXT = 3.3kΩ 时,每路最大输出电流为 23mA。最大电流可通过外接电阻 REXT 设置,详情请见第 8 页。 注 2:PCB 布线时,芯片需远离手机天线放置,防止天线对芯片辐射造成影响。
2011.05 P0.1
1
矽恩微电子有限公司
SN3112-12
SN3112-12
12 路 LED 控制芯片
简介
SN3112-12 是一款 12 路呼吸灯驱动芯片,每路单独 256 级细腻亮度可控。单路最大输出电流可以通过一 个外部电阻设定,最大电流为 38mA。 主控器件通过 I2C 接口对 SN3112-12 进行编程控制, 通过将 SDB 脚拉低或软件设置可关断芯片, 进入低功 耗模式。SN3112-12 从地址为“1010 1000” 。 SN3112-12 使用 QFN-20(3mm × 3mm)的封装形式。 工作电压在 2.7V ~ 5.5V,可在-40°C ~ +85°C 的温度 范围下工作。
2011.05 P0.1
5
矽恩微电子有限公司
SN3112-12
图 5 地址自加方式写入 SN3112-12
寄存器定义
表格 1 寄存器功能列表 名称 关断寄存器 PWM 寄存器 LED 控制寄存器 1 LED 控制寄存器 2 LED 控制寄存器 3 数据更新寄存器 复位寄存器 关断寄存器 D7:D1 0000000 软件关断使能位 软件关断模式 标准工作模式 PWM 寄存器 D7:D0 PWM 0000 0000 D0 SSD 0 软件关断 SN3112-12 存储 12 路 LED 的 PWM 亮度值 存储 1~3 路的 LED 开关状态 存储 4~9 路的 LED 开关状态 存储 10~12 路的 LED 开关状态 更新 PWM 寄存器和 LED 控制寄存器的数据 重置所有寄存器数据为默认值 功能 表格 2 3 4 5 6 xxxx xxxx 0000 0000 默认值 地址 00h 04h~0Fh 13h 14h 15h 16h 17h 表格 2 00h 位 名称 默认值 SSD 0 1

Broadcom HSMF-C116 超小三色芯片LED说明书

Broadcom HSMF-C116 超小三色芯片LED说明书

DescriptionThis ultra-small tricolor chipLED is designed for close pitch assembly and also for portable and wearables applications. The package uses high intensity red AlInGaP die and high intensity InGaN green and blue die. To improve contrast the PCB substrate has a black surface.Applications⏹Display⏹Backlighting⏹Indicator Features⏹LED with AlInGaP and InGaN die⏹Surface mount device with ultra small 1.0 × 1.0mmfootprint⏹Suitable for application that requires small pitch size ⏹Compatible with reflow soldering⏹Taped in 8mm carrier tape on a 7 inch diameter reelHSMF-C116Ultra Small Surface Mount Tricolor ChipLEDData SheetPackage DimensionsNOTE All dimensions in millimeters. Tolerance is ±0.1 mm unless otherwise specified.CAUTION This LED is class 1A ESD sensitive per ANSI/ESDA/JEDEC JS-001. Please observe appropriate precautions during handling and processing. Refer to application note AN-1142 for additional details.PerformanceAbsolute Maximum Ratings (T J = 25 °C)NOTE1.Derate linearly as shown in Figure 7.2.1/10 duty factor and 0.1ms pulse width.Optical Characteristics (T J = 25 °C, R = 10 mA, G/B = 5 mA)NOTE3.The luminous intensity is measured at the mechanical axis of the LED package. The actual peak of the spatial radiation pattern may not be aligned with the axis.4.The dominant wavelength is derived from the CIE chromaticity diagram and represents the perceived color of the device.5.θ1/2 is the off axis angle where the luminous intensity is ½ the peak intensity.Electrical Characteristics (T J = 25 °C, R = 10 mA, G/B = 5 mA)NOTE6.Forward voltage tolerance ±0.1V.7.Reverse voltage indicates product final test. Long term reverse bias is not recommended.ParameterAlInGaP RedInGaN GreenInGaN BlueUnit DC Forward Current [1]101010mA Peak Forward Current [2]606060mA Power Dissipation 223133mW LED Junction Temperature 959595°C Operating Temperature Range –40 to 85°C Storage Temperature Range–40 to 85°CColorLuminous Intensity,Iv(mcd) [3]Peak Wavelength,λp(nm)Dominant Wavelength, λd (nm) [4]Viewing Angle, 2θ1/2 (°) [5]Min.Typ.Max.Typ.Typ.Typ.Red 63.080.0140.0631622137Green 140.0220.0315.0520528140Blue32.045.071.0466471140ColorForward Voltage, V F (V) [6]Reverse Voltage, V R (V) [7] at I R =100μAMin.Max.Min.Red 1.8 2.25Green 2.5 3.15Blue2.73.35Intensity Bins (CAT) – RedTolerance: ±15%Intensity Bins (CAT) – GreenTolerance: ±15%Intensity Bins (CAT) – Blue Tolerance: ±15%Color Bins (BIN) – RedTolerance: ±1nmColor Bins (BIN) – GreenTolerance: ±1nmColor Bins (BIN) – Blue Tolerance: ±1nmBin ID Luminous Intensity (mcd) Min.Max.P963.0100.0 Q71.0112.0 Q580.0125.0 Q790.0140.0Bin ID Luminous Intensity (mcd) Min.Max.R7140.0224.0 R9159.0250.0 S180.0280.0 S5201.0315.0Bin ID Luminous Intensity (mcd) Min.Max.N532.050.0 N736.056.0 N940.063.0 P45.071.0Bin IDDominant Wavelength (nm)Min.Max. 1615.0627.0Bin IDDominant Wavelength (nm)Min.Max.2523.0529.0 3525.0531.0 4528.0534.0 5530.0536.0 6533.0539.0Bin IDDominant Wavelength (nm)Min.Max. 6466.0471.0 7468.0473.0 8470.0475.0CAUTION1.The above optical performance specifications are valid in the case where single LED is lit up.2.The above product specifications DO NOT provide any guarantee on color mixing, color consistency over time or uniformity inluminous intensity when more than 1 LED is lit up.Figure 1 Spectral Power Dissipation Figure 2 Relative Intensity vs. Forward CurrentFigure4 Dominant Wavelength Shift vs. Forward CurrentFigure 5 Radiation Pattern Figure 6 Relative Intensity vs. TemperatureFigure7 Derating CurveFigure10 Reel DimensionsHSMF-C116Data SheetSolderingSolderingRecommended Reflow Soldering Conditions:a.Reflow soldering must not be done more than 2 times.Observe necessary precautions of handling moisturesensitive device as stated in the section below.b.Do not apply any pressure or force on the LED duringreflow and after reflow when the LED is still hot.c.Reflow soldering is the preferred method by which tosolder the LED. However, if unavoidable (eg. rework),manual hand soldering may be used under strictlycontrolled conditions as stated below:●Max soldering iron tip temperature = 310 °C●Max soldering duration = 2 sec●Max number of cycles = 1●Max soldering iron power rating = 50Wd.The soldering iron should only contact the solderingterminals. The soldering iron should not make any contact with the LED package body as it may cause damage to the LED.er is advised to confirm beforehand whether thefunctionality and performance of the LED is affected byhand soldering. Precautionary NotesHandling of moisture sensitive deviceThis product has a Moisture Sensitive Level 3 rating per JEDEC J-STD-020. Refer to Avago Application Note AN5305, Handling of Moisture Sensitive Surface Mount Devices, for additional details and a review of proper handling procedures.a.Before use●An unopened moisture barrier bag (MBB) can bestored at <40 °C/90% RH for 12 months. If the actualshelf life has exceeded 12 months and the humidityIndicator Card (HIC) indicates that baking is notrequired, then it is safe to reflow the LEDs per theoriginal MSL rating.●It is recommended that the MBB not be opened priorto assembly (e.g., for IQC).b.Control after opening the MBB●The humidity indicator card (HIC) shall be readimmediately upon opening of MBB.●The LEDs must be kept at <30 °C / 60% RH at all timesand all high temperature related processes includingsoldering, curing or rework need to be completedwithin 168 hours.c.Control for unfinished reel●Unused LEDs must be stored in a sealed MBB withdesiccant or desiccator at <5%RH.d.Control of assembled boards●If the PCB soldered with the LEDs is to be subjected toother high temperature processes, the PCB need to bestored in sealed MBB with desiccant or desiccator at<5%RH to ensure that all LEDs have not exceededtheir floor life of 168 hours.e.Baking is required if:●The HIC indicator is not blue at 10% and is pink at 5%.●The LEDs are exposed to condition of >30 °C / 60% RHat any time.●The LED floor life exceeded 168 hrs.The recommended baking condition is: 60 °C ±5 ºC for20hrs.Baking should only be done once.For product information and a complete list of distributors, please go to our web site: Broadcom, the pulse logo, Connecting everything, Avago Technologies, and the A logo are the trademarks of Broadcom in the United States, certain other countries and/or the EU.Copyright © 2015–2016 Broadcom. All Rights Reserved.The term "Broadcom" refers to Broadcom Limited and/or its subsidiaries. For more information, please visit .Broadcom reserves the right to make changes without further notice to any products or data herein to improve reliability, function, or design.Information furnished by Broadcom is believed to be accurate and reliable. However, Broadcom does not assume any liability arising out of the application or use of this information, nor the application or use of any product or circuit described herein, neither does it convey any license under its patent rights nor the rights of others.pub-005255 – June 16, 2016DISCLAIMER Avago Technologies products are not specifically designed, manufactured or authorized for sale as parts,components or assemblies for the planning, construction, maintenance or direct operation of a nuclear facility or for use in medical devices or applications. Customer is solely responsible, and waives all rights to make claims against Avago Technologies or its suppliers, for all loss, damage, expense or liability in connection with such use.。

CITIZEN LED灯包产品说明书

CITIZEN LED灯包产品说明书

and are trademarks or registered trademarks of CITIZEN HOLDINGS CO., LTD. JAPAN.is a trademark or a registered trademark of CITIZEN ELECTRONICS CO., LTD. JAPAN.AnodeMarking 1Cathode(Tc Measurement Point)Marking 2Marking 1 : Serial No.Marking 2 : 12 04 27 M1< Example of indication label >1. TYPE e.g. CLL020-1204A1-273M1A22. P.No. (Cutomer's P/N) e.g. 50008-010-*******M13. Lot No.- First and second letter: Last digit of the year e.g. 11 : year 2011 - Third letter: Production month e.g. 8 : August Note: October, November and December are designated - Forth letter: CE's control number e.g. 50354. QuantityCITIZEN ELECTRONICS CO.,LTD. JAPANCITILEDCLL020-1204A1-273M1A2Product 54 pcs/tray< Packing figure >CUSTOMERPASSCITIZEN ELECTRONICSTYPE P. NO Lot No Q'ty : CLL020-******-*******: ******: *******: ***---(1)---(2)---(3)---(4)(2) Countermeasure against static electricity-Handling of this product needs countermeasures against static electricitybecause this is a semiconductor product.-Please take adequate measures to prevent any static electricity being producedsuch as the wearing of a wristband or anti-static gloves when handling this product.13.5Recommended installation screw pitchCITILED8. Precautions (continued)CITIZEN ELECTRONICS CO.,LTD. JAPANSymbolCITILED Name CLL020-1204A1-273M1A2(9) Eye Safety-The International Electrical Commission (IEC) published in 2006 IEC 62471”2006 Photobiological safety of lamps and lamp systems ” which includes LEDs within its scope. When sorting single LEDs according to IEC 62471, almost all white LEDs can be classifiedas belonging to either Exempt Group (no hazard) or Risk Group 1 (low risk).-However, Optical characteristics of LEDs such as radiant flux,spectrum and light distribution are factors that affect the risk group determination of the LED, and especially a high-power LED, that emits light containing blue wavelengths,might have properties equivalent to those of Risk Group 2 (moderate risk).-Great care should be taken when directly viewing an LED that is driven at high current,has multiple uses as a module or when focusing the light with optical instruments,as these actions might greatly increase the hazard to your eyes.-It is recommended to regard the evaluation of stand-alone LED packages as a referenceand to evaluate your final product.(10) This product is not designed for usage under the following conditions.If the product might be used under the following conditions, you shall evaluate its effectand appropriate them. In places where the product might:-directly and indirectly get wet due to rain and/or at place with the fear.-be damage by seawater and/or at place with the fear-be exposed to corrosive gas (such as Cl2, H2S, NH3, SOx, NOx and so on) and/or at place with the fear. -be exposed to dust, fluid or oil and/or at place with the fear.(8) Recommended soldering Condition (This product is not adaptable to reflow process.)-For manual solderingPlease use lead-free soldering.Soldering shall be implemented using a soldering bit at a temperature lower than 350C°,and shall be finished within 3.5 seconds for one land.No external force shall be applied to resin part while soldering is implemented.Next process of soldering should be carried out after the product has return to ambient temperature.-For soldering correctionRegarding soldering correction, above conditions shall be applied.Contacts number of soldering bit should be within twice for each terminal as a correction.* Citizen Electronics cannot guarantee if usage exceeds these recommended conditions.Please use it after sufficient verification is carried out on your own risk if absolutely necessary.9. Precautions with regard to product use(1) This document is provided for reference purposes only so that CITIZEN ELECTRONICS'products are used as intended. CITIZEN ELECTRONICS neither makes warranties orrepresentations with respect to the accuracy or completeness of the information containedin this document nor grants any license to any intellectual property rights or any otherrights of CITIZEN ELECTRONICS or any third party with respect to the informationin this document.(2) All information included in this document such as product data, diagrams, charts,is current as of the date this document is issued.Such information, however, is subject to change without any prior notice.Before purchasing or using any CITIZEN ELECTRONICS' products listed in this document,please confirm the latest product information with a CITIZEN ELECTRONICS' sales office,and formal specifications must be exchanged and signed by both parties prior to mass production. (3) CITIZEN ELECTRONICS has used reasonable care in compiling the informationincluded in this document,but CITIZEN ELECTRONICS assumes no liability whatsoever for any damages incurred asa result of errors or omissions in the information included in this document.(4) Absent a written signed agreement, except as provided in the relevant terms and conditions ofsale for product, and to the maximum extent allowable by law, CITIZEN ELECTRONICSassumes no liability whatsoever, including without limitation, indirect, consequential, special,or incidental damages or loss, including without limitation, loss of profits, loss of opportunities,business interruption and loss of data, and disclaims any and all express or implied warrantiesand conditions related to sale, use of product, or information, including warrantiesor conditions of merchantability, fitness for a particular purpose, accuracy of information,or no infringement.(5) Though CITIZEN ELECTRONICS works continually to improve products' quality and reliability,products can malfunction or fail. Customers are responsible for complying with safety standardsand for providing adequate designs and safeguards to minimize risk and avoid situationsin which a malfunction or failure of a product could cause loss of human life,bodily injury or damage to property, including data loss or corruption.In addition, customers are also responsible for determining the appropriateness ofuse of any information contained in this document such as application cases not only withevaluating by their own but also by the entire system.CITIZEN ELECTRONICS assumes no liability for customers' product design or applications.(6) Please contact CITIZEN ELECTRONICS' sales office if you have any questions regardingthe information contained in this document, or if you have any other inquiries.CITIZEN Micro HumanTech is a registered trademark of Citizen Holding Co., Japan.CITILED is a registered trademark of CITIZEN ELECTRONICS CO., LTD. JapanSymbol CITILEDName CLL020-1204A1-273M1A2CITIZEN ELECTRONICS CO.,LTD. JAPAN。

Super Bright Yellow 绿色双色低功耗LED灯说明书

Super Bright Yellow 绿色双色低功耗LED灯说明书

SPEC NO: DSAC0137 APPROVED: WYNEC
REV NO: V.14B CHECKED: Allen Liu
DATE: FEB/05/2015 DRAWN: P.Cheng
PAGE: 6 OF 6 ERP: 1203002069
and electrical limits specified in the datasheet. If customer usage exceeds the specified limits, Kingbright will not be responsible for any subsequent issues. 4. The information in this document applies to typical usage in consumer electronics applications. If customer's application has special reliability requirements or have life-threatening liabilities, such as automotive or medical usage, please consult with Kingbright representative for further assistance. 5. The contents and information of this document may not be reproduced or re-transmitted without permission by Kingbright. 6. All design applications should refer to Kingbright application notes available at /application_notes
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(注释 1) (注释 1) (注释 1) (注释 1)
参数
条件 VCC = 4.2V,VFLASH = 0V VCC = 5.5V,VEN = 0V
最小值 2.7
典型值 0.6
最大值 5.5 1
单位 V mA μA µs mV °C V
550 VFLASH = VCC,RSET = 88.7kΩ VFLASH = 0V 1.4 0.4 0.3 0.1 500 500 75 75 150 50 160
特性
工作电压 2.7V ~ 5.5V 手电筒模式下,效率高达 90% 输出电流可达 750mA 自动切换电荷泵模式 较少的外围元件,无需电感 低于 1µA 的关断电流 较小的纹波和 EMI 影响 输出过压保护电路 过热保护、短路保护功能 使用 DFN-10(3mm × 3mm)封装
SN3231
闪光灯LED驱动芯片
简介
SN3231是一款用于闪光灯/手电筒等应用的LED驱动 芯片, 可为闪光灯应用和手电筒应用设置两种电流模 式。在手电筒模式下,SN3231可通过输入脉冲调节 LED的亮度。 SN3231根据输入电压来自动控制电荷 泵开关,保证输出电流。 SN3231为实现便携设备的LED驱动提供了低成本、 小尺寸的解决方案。 并且集成过热保护和短路保护功 能。 SN3231 工 作 电 压 范 围 为 2.7V ~ 5.5V , 使 用 DFN-10(3mm × 3mm)封装,可在-40°C ~ +85°C的环 境温度下工作。
VOUT 1V/Div VFB 0.2V/Div IOUT 1A/Div
VOUT 1V/Div VFB 0.2V/Div IOUT 1A/Div
图 6 Torch Mode to Flash Mode
图 7 Torch Mode to Flash Mode
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绝对最大额定范围
电源电压, VCC ---------------------------------------------------------------------------------------------------------- -0.3V ~ +6.0V 输出电流脉冲 (闪光灯模式) ------------------------------------------------------------------------------------------------------- 1A 输出电流脉冲 (手电筒模式) ----------------------------------------------------------------------------------------------------- 0.4A EN 引脚输入电压 ------------------------------------------------------------------------------------------------------------- 0V ~ 7V 接合温度, TJ ---------------------------------------------------------------------------------------------------------- -40°C ~ +150°C 焊接温度(导线处,10s) , TLEAD ---------------------------------------------------------------------------------------------- 300°C ESD HBM ---------------------------------------------------------------------------------------------------------------------------- 7kV
电流设置
LED 的电流可通过 RFB 来设置,计算如下公式(1):
I LED VFB / RFB
(1 )
在两种工作模式下,VFB 的设置方法不同。闪光灯模 式时,VFB 计算见公式(2);手电筒模式时,VFB 设 置见表格 1。
工作模式
通过设置 FLASH 引脚电平,可以分别进入 SN3231 的两种工作模式:闪光灯模式、手电筒模式。 闪光灯模式 当 FLASH 为高电平时,SN3231 工作在闪光灯模式。 : FBs µs µs µs
注释 1:设计保证。
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典型性能曲线
250
800 700 Flash Mode ILED = 700mA VOUT = 3.73V
200
Output Current(mA)
Output Current(mA)
Torch Mode ILED = 200mA VOUT = 3.45V 3. 2 3. 4 3. 6 3. 8 4 4. 2
I LED 158mV / 0.22 718mA
手电筒模式 当 FLASH 为低电平时,SN3231 工作在手电筒模式。 。 FB 电压由 EN 引脚的上升沿个数决定(见表格 1)
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回流焊接特性参数
Profile Feature Preheat & Soak Temperature min (Tsmin) Temperature max (Tsmax) Time (Tsmin to Tsmax) (ts) Average ramp-up rate (Tsmax to Tp) Liquidous temperature (TL) Time at liquidous (tL) Peak package body temperature (Tp)* Time (tp)** within 5°C of the specified classification temperature (Tc) Average ramp-down rate (Tp to Tsmax) Time 25°C to peak temperature Pb-Free Assembly 150°C 200°C 60-120 seconds 3°C/second max. 217°C 60-150 seconds Max 260°C Max 30 seconds 6°C/second max. 8 minutes max.
VOUT 1V/Div
IIN 500mA/Div
图 4 EN On (Torch Mode)
FLASH Pin VCC = 3.6V Torch Mode to Flash Mode 5V/Div
图 5 EN On (Flash Mode)
FLASH Pin VCC = 4.2V Torch Mode to Flash Mode 5V/Div
如果器件工作条件超过上述各项极限值,可能对器件造成永久性损坏。上述参数仅仅是工作条件的极限值,不建议器件工作在推 荐条件以外的情况。器件长时间工作在极限工作条件下,其可靠性及寿命可能受到影响。
电气特性
测试条件:TA = -40°C ~ +85°C,VCC = 2.7V ~ 5.5V(除非特殊说明) 。典型值测试条件为TA = 25°C,VCC = 3.6V。 符号 VCC ICC ISD tON VFB TOVP VIH VIL tLO tHI tOFF tLAT 电源电压 静态电流 关断电流 启动时间 FB 引脚参考电压 过温保护 输入高电平 输入低电平 EN 引脚低电平时间 EN 引脚高电平时间 EN 引脚关断时间 EN 引脚锁存时间
时序控制
在应用中,EN 引脚的时序控制需按照图 8 所示。tHI 和 tLO 为输入脉冲信号的高低电平持续时间。 tLAT 为数 据锁存时间,高电平信号持续 tLAT 以上, 脉冲信号才 可写入生效。tOFF 为关断时间,低电平信号持续 tOFF 以上,芯片进入关断模式。 当高电平信号未达到 tHI(min.),或低电平信号未达到 tLO(min.)时,此高低电平信号无效。
6
RSET
VFB 1.25V / RSET 11 .2 k
7 8 9 10
FB SGND PGND VOUT 散热片
电流控制反馈引脚,连接 RFB 电阻到地。LED 电流计算:
I LED VFB / RFB
内部地线。控制电路电流通过此引脚。 电源功率地线。飞跨电容电流通过此引脚。 电荷泵输出。 接地。
应用
背光 手机 相机闪光灯
典型应用电路
图 1 典型应用电路
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引脚结构
封装形式 引脚结构(俯视图)
DFN-10
引脚说明
引脚号 1 2 3 4 5 引脚名 VCC CP CN FLASH EN 电源输入。 飞跨电容正极。 飞跨电容负极。 模式控制引脚。 当 FLASH 为高电平时, 芯片工作在闪光灯模式; 当 FLASH 为低电平时,芯片工作在手电筒模式。 芯片关断和电流控制引脚。低电平关断芯片。工作在手电筒模式 时, EN 引脚的上升沿个数决定 FB 端电压(见第 6 页表格 1) 。 闪光灯模式 FB 电压控制引脚,连接 RSET 电阻到地。工作在闪光 灯模式时,FB 电压由 RSET 决定,计算如公式: 描述
600 500 400 300 200
150
100
50
100 0 3 3. 2 3. 4 3. 6 3. 8 4 4. 2
0 3
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