电子元器件封装图示大全
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电子元器件封装图示大全
LAMINATE TCSP 20L Chip Scale Package
TO18
TO220
TO247
TO252
TO263/TO268
TO264 TO3 TO5 TO52 TO71 TO72 TO78 TO8
TO92
TO93
TO99
TSOP
Thin Small Outline Package
TSSOP or TSOP II
Thin Shrink Outline Package
LAMINATE UCSP 32L
Chip Scale Package
uBGA
Micro Ball Grid Array
uBGA
Micro Ball Grid Array
VL Bus
VESA Local Bus
XT Bus
8bit
ZIP
Zig-Zag Inline Package
Gull Wing Leads
HSOP28
ISA
Industry Standard
Architecture ITO220 ITO3p
J-STD J-STD
Joint IPC / JEDEC Standards
JEP
JEP
JEDEC Publications JESD
JESD
JEDEC Standards
JLCC
LCC
LDCC
LGA
LLP 8La
LQFP
PCDIP
PCI 32bit
5V
Periphera
l
Compone
nt
Interconn
ect
PCI 64bit 3.3V Periphera l Compone nt Interconn ect
PCMCIA PDIP
PGA Plastic Pin Grid Array
PLCC PQFP
PS/2
PS/2 mouse port pinout
PSDIP DIMM 168 DIMM DDR
DIMM168 Dual In-line Memory Module
DIMM168
DIMM168
Pinout
DIMM184
For DDR
SDRAM
Dual In-line
Memory
Module
DIP
Dual Inline Package DIP-tab Dual Inline Package with Metal Heatsink
EIA
EIA
JEDEC
formulat
ed EIA
Standar
ds
EISA
Extende
d ISA FBGA
FDIP
FTO220 Flat Pack
AC'97AC'97
v2.2 specification 详细规格
AGP 3.3V Accelerated Graphics Port Specification 2.0 详细规格
AGP PRO Accelerated Graphics Port PRO Specification
1.01
详细规格
AGP Accelerated Graphics Port Specification 2.0 详细规格
AMR
Audio/Modem
Riser
AX078
AX14
C-Bend Lead
CERQUAD
Ceramic Quad Flat
Pack
CLCC
CNR
Communication and
Networking Riser
Specification
Revision 1.2
CPGA
Ceramic Pin Grid
Array
Ceramic Case
LAMINATE CSP
112L Chip Scale
Package
BGA Ball Grid Array
EBGA 680L
LBGA 160L
PBGA 217L
Plastic Ball Grid Array
CLCC CNR Communication and Networking Riser
CPGA Ceramic Pin Grid Array DIP Dual Inline Package
DIP-tab Dual Inline Package
with Metal Heatsink
FBGA FDIP FTO-220
Flat Pack HSOP-28
ITO-220 ITO-3P
JLCC LCC
LDCC LGA
LQFP PCDIP
PGA Plastic Pin Grid Array PLCC PQFP PSDIP LQFP 100L METAL QUAD 100L PQFP 100L QFP Quad Flat Package