杜邦产品介绍
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• 杜邦產品
– 壓克力膠系列(Modified WA Acrylic)之基材 – 環亞樹脂膠系列(Modified Epoxy)之基材
• 杜邦 料號解說
– Pyralux® – Telcam®
PPT文档演模板
杜邦产品介绍
•m
軟性電路板之主要基材
• Copper Clad Laminates (銅箔基材)
PPT文档演模板
杜邦产品介绍
•m
Substrates
• Aramid Paper:
– Sold under DuPont trade name “Nomex” – Used in specialized application – Good thermal insulation material
PPT文档演模板
• Others
PPT文档演模板
杜邦产品介绍
•m
Dielectric Substrates
• Definition
– A base film on which the printed conductors are laid.
– A film which provides electrical insulation between conductors.
•Mylar •Adhesiv e •Kapton
•Adhesiv e
PPT文档演模板
杜邦产品介绍
•m
軟性電路板之主要基材
• Sheet Adhesive • PhotoImageable Coverlay (PIC)
– Dry Film – Fine-Line Application
• Camera • Automotive
PPT文档演模板
杜邦产品介绍
•m
Dielectric Substrates
• Substrates 之種類
– Polyimide – Polyester – Fluorocarbon – Aramid Paper – Composite
PPT文档演模板
杜邦产品介绍
•m
Substrates
• Polyimide:
– Popularized by DuPont under “Kapton” – Also known as PI – First choice of film in most FPC – Infusible and flame retardant – High Tg (約 260C - 280C) – Good dimensional stability
杜邦产品介绍
•m
Dielectric Substrates
•Property
Polyester Polyimide Fluorocarbon Aramid Paper Composite
•Tensile Strength
•Flexibility
•Dim. Stability •Dielectric Str. •Solderibility •C.O.T. (C) •Thermal Exp.
•Dielectric Substrate
杜邦产品介绍
•m
軟性電路板之主要基材
– Adhesive-Less C.C.L. .(無膠銅箔基材)
PPT文档演模板
•Conductor •Dielectric Substrate
杜邦产品介绍
•m
軟性電路板之主要基材
• Coverlay(覆蓋膜)
•Adhesiv •Dielectric Substrate e
•離型紙
•Adhesiv e
•Kapton
PPT文档演模板
杜邦产品介绍
•m
軟性電路板之主要基材
• Stiffner (補強材)
•Dielectric Substrate
PPT文档演模板
•Adhesive
杜邦产品介绍
•m
軟性電路板之主要基材
• Bondply
•Adhesive
•Adhesive •Dielectric Substrate
– Single-Sided C.C.L.(單面銅箔基材)
PPT文档演模板
•Conductor •Adhesive •Dielectric Substrate
杜邦产品介绍
•m
軟性電路板之主要基材
– Double-Sided C.C.L. .(雙面銅箔基材)
PPT文档演模板
•Conductor •Adhesive
– A film which provides mechanical strength of the circuit.
PPT文档演模板
杜邦产品介绍
•m
Dielectric Substrates
• 必備之特性
– Mechanical Strength – Flexibility – Dimensional Stability – Dielectric Properties – Thermal Properties – Chemical Resistance – Moisture Absorption – Cost
PPT文档演模板
杜邦产品介绍
•m
Substrates
• Polyester:
– Popularized by DuPont under “Mylar” – Also known as PET – Lowest cost dielectric material – Mostly used in low-cost consumer application – Good mechanical properties – Bad thermal properties
杜邦产品介绍
PPT文档演模板
2020/11/18
杜邦产品介绍
•m
簡報大綱
• 軟性電路板基材之介紹 • 基材的主要Composition
– Dielectric Substrates (絕緣體) – Adhesive (膠質) – Conductor (導體)
PPT文档演模板
杜邦产品介绍
•m
簡報大綱 (continue)Байду номын сангаас
Excellent Excellent
Excellent Excellent
Fair/Good Good
Good
Good
Poor Excellent
105
200-230
Low
Low
Fair
Excellent
Fair Very Good
Fair 150-180
High
Good
Good
Good Very Good Excellent
– 壓克力膠系列(Modified WA Acrylic)之基材 – 環亞樹脂膠系列(Modified Epoxy)之基材
• 杜邦 料號解說
– Pyralux® – Telcam®
PPT文档演模板
杜邦产品介绍
•m
軟性電路板之主要基材
• Copper Clad Laminates (銅箔基材)
PPT文档演模板
杜邦产品介绍
•m
Substrates
• Aramid Paper:
– Sold under DuPont trade name “Nomex” – Used in specialized application – Good thermal insulation material
PPT文档演模板
• Others
PPT文档演模板
杜邦产品介绍
•m
Dielectric Substrates
• Definition
– A base film on which the printed conductors are laid.
– A film which provides electrical insulation between conductors.
•Mylar •Adhesiv e •Kapton
•Adhesiv e
PPT文档演模板
杜邦产品介绍
•m
軟性電路板之主要基材
• Sheet Adhesive • PhotoImageable Coverlay (PIC)
– Dry Film – Fine-Line Application
• Camera • Automotive
PPT文档演模板
杜邦产品介绍
•m
Dielectric Substrates
• Substrates 之種類
– Polyimide – Polyester – Fluorocarbon – Aramid Paper – Composite
PPT文档演模板
杜邦产品介绍
•m
Substrates
• Polyimide:
– Popularized by DuPont under “Kapton” – Also known as PI – First choice of film in most FPC – Infusible and flame retardant – High Tg (約 260C - 280C) – Good dimensional stability
杜邦产品介绍
•m
Dielectric Substrates
•Property
Polyester Polyimide Fluorocarbon Aramid Paper Composite
•Tensile Strength
•Flexibility
•Dim. Stability •Dielectric Str. •Solderibility •C.O.T. (C) •Thermal Exp.
•Dielectric Substrate
杜邦产品介绍
•m
軟性電路板之主要基材
– Adhesive-Less C.C.L. .(無膠銅箔基材)
PPT文档演模板
•Conductor •Dielectric Substrate
杜邦产品介绍
•m
軟性電路板之主要基材
• Coverlay(覆蓋膜)
•Adhesiv •Dielectric Substrate e
•離型紙
•Adhesiv e
•Kapton
PPT文档演模板
杜邦产品介绍
•m
軟性電路板之主要基材
• Stiffner (補強材)
•Dielectric Substrate
PPT文档演模板
•Adhesive
杜邦产品介绍
•m
軟性電路板之主要基材
• Bondply
•Adhesive
•Adhesive •Dielectric Substrate
– Single-Sided C.C.L.(單面銅箔基材)
PPT文档演模板
•Conductor •Adhesive •Dielectric Substrate
杜邦产品介绍
•m
軟性電路板之主要基材
– Double-Sided C.C.L. .(雙面銅箔基材)
PPT文档演模板
•Conductor •Adhesive
– A film which provides mechanical strength of the circuit.
PPT文档演模板
杜邦产品介绍
•m
Dielectric Substrates
• 必備之特性
– Mechanical Strength – Flexibility – Dimensional Stability – Dielectric Properties – Thermal Properties – Chemical Resistance – Moisture Absorption – Cost
PPT文档演模板
杜邦产品介绍
•m
Substrates
• Polyester:
– Popularized by DuPont under “Mylar” – Also known as PET – Lowest cost dielectric material – Mostly used in low-cost consumer application – Good mechanical properties – Bad thermal properties
杜邦产品介绍
PPT文档演模板
2020/11/18
杜邦产品介绍
•m
簡報大綱
• 軟性電路板基材之介紹 • 基材的主要Composition
– Dielectric Substrates (絕緣體) – Adhesive (膠質) – Conductor (導體)
PPT文档演模板
杜邦产品介绍
•m
簡報大綱 (continue)Байду номын сангаас
Excellent Excellent
Excellent Excellent
Fair/Good Good
Good
Good
Poor Excellent
105
200-230
Low
Low
Fair
Excellent
Fair Very Good
Fair 150-180
High
Good
Good
Good Very Good Excellent