MAX2644EXT+T中文资料

合集下载

MAX4614中文资料

o TTL/CMOS-Logic Compatible
Ordering Information
PART
TEMP. RANGE PIN-PACKAGE
MAX4614CUD
0°C to +70°C
14 TSSOP
MAX4614CSD
0°C to +70PD
0°C to +70°C
V+ = 5.5V; VCOM_ = 1V, 4.5V; VNO_ = VNC_= 1V, 4.5V, or floating
TSSOP/SO/DIP
INPUT LOW HIGH
SWITCH STATE OFF ON
TSSOP/SO/DIP
INPUT
LOW HIGH
SWITCH STATE
ON OFF
TSSOP/SO/DIP
INPUT LOW HIGH
NO1, NO3 OFF ON
NC2, NC4 ON OFF
Rail-to-Rail is a registered trademark of Nippon Motorola, Ltd.
14 Plastic DIP
MAX4614EUD -40°C to +85°C
14 TSSOP
MAX4614ESD
-40°C to +85°C
14 Narrow SO
MAX4614EPD
-40°C to +85°C
14 Plastic DIP
Ordering Information continued at end of data sheet.
元器件交易网
19-1501; Rev 0; 7/99
MAX4614/MAX4615/MAX4616

XMC4K Introduction update

2x
2x
2x 1x
Communication
USB SD/MMC Serial channels (UART, SPI, I2C, I2S) Ext. Memory I/F CAN
FS DEV
FS DEV
FS OTG
4x
4x
4x
6x
2x
2x
2x
3x
Touch Button

XMC4000 - 可扩展性
XMC4000家族简介
ARM® Cortex™-M4内核
一颗 “芯”,无限域 …
英飞凌微控制器产品家族–新成员
XMC4000
~ 225
180MHz
ARM® CortexTM-M4
XMC4700 XMC4200 XMC4100 XMC4400 XMC4500
~ 150
120MHz
~ 100
80MHz
Communication
Ethernet USB 2.0 OTG
Safety/Reliability Data protection through ECC/Parity CRC & Random Pattern generation
SD/MMC card I/F
External Memory I/F CAN USIC
Functional Large Pack. Pack. Flash SRAM Ethernet USB MultiCAN ADC DSD DAC USIC CCU4 CCU8 POSIF HRPWM in KB in KB Interf. Interf. Nod./Msg. Chan. Chan. Chan. Chan. Slices Slices Interf. Interf. TRAYS TRAYS TRAYS TRAYS TRAYS TRAYS TRAYS TRAYS TRAYS TRAYS TRAYS TRAYS TRAYS TRAYS TRAYS 348 450 90 450 450 450 450 450 450 360 360 360 360 360 360 1024 1024 1024 768 768 768 768 512 512 1024 1024 768 768 512 512 160 160 160 160 160 160 160 128 128 160 160 160 160 128 128 1 1 1 1 1 1 1 1 1 1 (OTG) 1 (OTG) 1 (OTG) 1 (OTG) 1 (OTG) 1 (OTG) 1 (OTG) 1 (OTG) 1 (OTG) 1 (OTG) 1 (OTG) 3 / 64 3 / 64 3 / 64 3 / 64 3 / 64 3 / 64 3 / 64 3 / 64 3 / 64 3 / 64 3 / 64 4x 8 4x 8 4x 8 4x 8 4x 8 4x 8 4x 8 4x 8 4x 8 4x 8 4x 8 4x 8 4x 8 4x 8 4x 8 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 3x 2 4x 4 2x 4 3x 2 4x 4 2x 4 3x 2 4x 4 2x 4 3x 2 4x 4 2x 4 3x 2 4x 4 2x 4 3x 2 4x 4 2x 4 3x 2 4x 4 2x 4 3x 2 4x 4 2x 4 3x 2 4x 4 2x 4 3x 2 4x 4 2x 4 3x 2 4x 4 2x 4 3x 2 4x 4 2x 4 3x 2 4x 4 2x 4 3x 2 4x 4 2x 4 3x 2 4x 4 2x 4 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 -

RX424024中文资料

V REG.-Nr. A651, Z E214025Contact dataContact configuration 2 COContact setsingle contact Type of interruption micro disconnectionRated current8ARated voltage / max.switching voltage AC 240/400VAC Maximum breaking capacity AC2000VA Limiting making capacity, max 4 s, duty factor 10%15A Contact materialAgNi 90/106AC coil> 1 x 106cycles Rated frequency of operation with / without load 6 / 600 min -1Contact ratings Type Load Cycles RX48A, 250VAC, 70°C, EN61810-14x104RX48A, 250VAC, 70°C, UL508 General purpose4x104Coil dataAC coil24...230VAC AC coiltyp 0,75VAOperative range2Coil insulation system according UL1446class FCoil versions,DC-coil Coil Rated Operate Release Coil Rated coil code voltage voltage voltage resistance powerVDC VDC VDC Ohm mW0055 3.50.550+10%5000066 4.20.668+10%529012128.4 1.2274+10%5260242416.8 2.41095+10%5260484833.6 4.84380+10%5260606042.0 6.06845+10%52611011077.011.023010+10%526All figures are given for coil without preenergization, at ambient temperature +23°CS0271-ACoil versions,AC-coil 50HzCoil Rated Operate Release Coil Rated coil code voltage voltage voltage resistance power50Hz50Hz50Hz VAC VAC VAC Ohm VA 5242418.0 3.6350+10%0.76 61511586.317.38100+15%0.76 730230172.534.532500+15%0.74 All figures are given for coil without preenergization, at ambient temperature +23°C Insulationrmsopen contact circuit1000 V rmsadjacent contact circuits2500 V rmsClearance/creepage coil-contact circuit W8 / 8 mmadjacent contact circuits W3 / 4 mmMaterial group of insulation parts W IIIaTracking index of relay base PTI 250 VInsulation to IEC 60664-1Type of insulation coil-contact circuit reinforcedopen contact circuit functionaladjacent contact circuits basicRated insulation voltage250 VPollution degree32Rated voltage system 240V400VOvervoltage category IIIOther dataRoHS - Directive 2002/95/EC compliant as per product date code 0413 Flammability class according to UL94 V-0 1)Ambient temperature range-40...+70°COperate- / release time DC coil typ 7 / 2msBounce time DC coil, NO / NC contact typ 1 / 3msVibration resistance (function) NO / NC contact20 / 4g, 10 ... 150 HzShock resistance (destruction) 100 gCategory of protection RTII - flux proof transparent version pcbMounting distance 2,5 mm 2)Resistance to soldering heat flux-proof version270°C / 10 sRelay weight14 gPackaging unit500 pcs12) Version with transparent cover: 5 mmAccessoriesFor standard version (white cover), details seeaccessories RT PCB layout / terminal assignmentBottom view on solder pinsS0163-BJDimensionsS0272-BA *) With the recommended PCB hole sizes a grid pattern from 2.5mm to 2.54mm can be used.。

MAX264中文资料及其程控滤波器电路图

MAX264中文资料及其程控滤波器电路图MAX264的结构及性能MAX264的结构MAX264的结构主要由两个独立的滤波单元、分频单元、f0逻辑单元、Q逻辑单元及模式设置单元等电路组成。

主要特性描述如下：1、滤波器设计软件化2、中心频率32阶可控3、Q值128阶可控4、Q值与f0独立可编程5、f0可达140KHz6、支持＋5V和士5V两种供电方式MAX264 的引脚说明芯片诸引脚功能如下（括号内数字为引脚号）：V+(10):供电正极, 并接旁路电容尽量靠近该脚V-(18):供电负极, 并接旁路电容尽量靠近该脚GND(19):模拟地CLKA(13):A单元元时钟输人, 该时钟在芯片内部被二分频CLKB(14):B单元时钟输人, 该时钟在芯片内部被二分频OSC OUT(20):连至晶体, 组成晶振电路(若接时钟信号时, 该脚不连)INA,INB(5,1):滤波器输人BPA,BPB(3,27): 带通输出LPA,LPB(2,28):低通输出HPA,HPB(4,26):高通、带陷、全通输出M0,M1(8,7):模式选择,+5V高，-5V低F0-F4(24,17,23,12,11):时钟与中心频率比值(FCLK/f0)编程端Q0-Q6(15,16,21,22,25,6,9):Q编程端。

对M0、M1两个管脚编程可使芯片工作于模式1、2、3、4几种方式,对应的功能如表1所示。

时钟与中心频率比值与编码对应如表2所示。

模式1:当我们要实现全极点低通或带通滤波器如切比雪夫、巴特沃斯滤波器时这种模式是很有用的, 有时该模式也用来实现带陷滤波器, 但由于相关零极点位置固定, 使得用作带陷时受到限制。

模式2:模式用于实现全极点低通和带通滤波器, 与模式1相比该模式的优点就是提高了Q值而降低了输出/f0是模式1的1/厂2（根号二分之一），这样就延宽了截止频率；噪声,该模下f clk模式3：只有该模式下可实现高通滤波器, 该模式下最高时钟频率低于模式1；模式4：只有该模式下才可以实现全通滤波器。

M A-COM AT-264 4位单控数字衰减器 0.5-2GHz 30dB 用户手册说明书

Digital Attenuator, 4 Bit, Single Control, 30 dB, 0.5 - 2.0 GHzAT-264Features• Single Control CMOS logic for each bit • Attenuation 2 dB steps to 30 dB• Low DC Power Consumtion: 50 uW •Low Cost Plastic TSSOP-16 PackageTSSOP-161Electrical Specifications: T A = +25°C1Digital Attenuator, 4 Bit, Single Control 30 dB, 0.5 - 2.0 GHzAT-264DescriptionThe M/A-COM AT-264 is a 4 bit, 2 dB step GaAs MMIC digital attenuator in a low cost TSSOP-16 surface mount plastic package. The AT-264 is ideally suited for use where high accuracy, very low power consumption and low intermodula-tion products are required. Typical applications include radio,cellular, wireless LANs, GPS equipment and other gain/level control circuits.The AT-264 is fabricated using a mature 1 micron GaAs MESFET process. The process features full chip passivation for increased performance and reliability.Ordering InformationPart Number PackageAT-264TSSOP 16-Lead Plastic AT-264TRTape and Reel11.Refer to Application Note M513 for reel size information.1.All measurements at 900 MHz in a 50Ω system unless otherwise specified. Loss varies at 0.003 dB/°C.2.For two-tone Input Power up to +5 dBm.1. Dimensions are in inches/mm..03030,90,8.17.164,04,225246,06,2.0250,620195,14,0PN 16PN 1ParameterTest ConditionsUnits Min.Typ.Max.Reference Insertion Loss 0.5 - 1.0 GHz dB 1.6 1.80.5 - 2.0 GHz dB 1.8 2.0Attenuation Accuracy 0.5 - 1.0 GHz ±(0.15 dB + 5% of Attenuation setting in dB) dB 0.5 - 2.0 GHz ±(0.3 dB + 5% of Attenuation setting in dB) dBVSWR1.0 - 1.5 GHz 1.5:10.5 -2.0 GHz1.9:1T rise , T fall T on , T offT ransients10% to 90% RF, 90% to 10% RF50% Control to 90% RF, 50% Control to 10% RF in BandµSµSmV33751 dB Compression Input Power 0.5 GHz Input Power 0.9 GHz dBm dBm 2525IP 2Measured Relative to 0.5 GHzInput Power 20.5 - 2.0 GHz dBm dBm 6571IP 3Measured Relative to 0.5 GHzInput Power 20.5 - 2.0 GHz dBm dBm 4347查询AT-264供应商捷多邦，专业PCB打样工厂，24小时加急出货Digital Attenuator, 4 Bit, Single Control, 30 dB, 0.5 - 2.0 GHzAT-264-1.5-1-0.500.511.50.511.522.53F R E Q U E N C Y (GH z)D E V I A T I O N F R O M N O M I N A L A T T E N U A T I O N (d B )30 d B A T T E N4 d B2 d B A T T E N8 d B A T T E N16 d B A T T E N-32-30-28-26-24-22-20-18-16-14-12-10-8-6-4-200.511.522.53F R E Q U E N C Y (GH z)A T T E N U A T I O N (dB )11.21.41.61.822.22.42.62.80.511.522.53F R E Q U E N C Y (GH z)V S W R16, 30 d B A T T E N2 d B A T T E NIL00.511.522.50.511.522.53F R E Q U E N C Y (GH z)I N S E R T I O N L O S S (d B )Typical Performance CurvesAttenuation Accuracy vs. FrequencyFunctional Schematic1, 2ParameterAbsolute MaximumInput Power50 MHz500 - 2000 MHz +27 dBm +34 dBm Control Voltage +8.5V, -0.5V Operating Temperature -40°C to +85°C Storage Temperature-65°C to +150°CAbsolute Maximum Ratings11.Exceeding any one or a combination of these limits may cause permanent damage.1.Blocking Caps are required on all RF ports, 39 pF used for data measurements.2.Vs = +5+ 0.2Vdc can be applied at RF1 or RF2 using a 10K or greater pull-up resistor.Insertion Loss vs. FrequencyAttenuation vs. FrequencyVSWR vs. FrequencyGND GND VC1 VC2 VC3 VC4 GND GNDRF1 GND GND GND GND GND GND RF2PIN 16PIN 116842VsVC1VC2VC3VC4Attenuation (dB)1111Reference I.L.111021101410118011116030Logic 0=0±0.2VLogic 1 = +5v @ 30 µA max. current total.Truth Table。

MAX4230AUK+T,MAX4230AXK+T,MAX4230AXK+T,MAX4230AXK+T,MAX4231AXT+T,MAX4231AXT+T, 规格书,Datasheet 资料

General DescriptionThe MAX4230–MAX4234 single/dual/quad, high-output-drive CMOS op amps feature 200mA of peak output current, rail-to-rail input, and output capability from a single 2.7V to 5.5V supply. These amplifiers exhibit a high slew rate of 10V/µs and a gain-bandwidth product (GBWP) of 10MHz. The MAX4230–MAX4234 can drive typical headset levels (32Ω), as well as bias an RF power amplifier (PA) in wireless handset applications.The MAX4230 comes in a tiny 5-pin SC70 package and the MAX4231, single with shutdown, is offered in a 6-pin SC70 package and in 1.5mm x 1.0mm UCSP and thin µDFN packages. The dual op-amp MAX4233is offered in the space-saving 10-bump chip-scale pack-age (UCSP™), providing the smallest footprint area for a dual op amp with shutdown.These op amps are designed to be part of the PA con-trol circuitry, biasing RF PAs in wireless headsets. The MAX4231/MAX4233 offer a SHDN feature that drives the output low. This ensures that the RF PA is fully dis-abled when needed, preventing unconverted signals to the RF antenna.The MAX4230 family offers low offsets, wide bandwidth,and high-output drive in a tiny 2.1mm x 2.0mm space-saving SC70 package. These parts are offered over the automotive temperature range (-40°C to +125°C).ApplicationsRF PA Biasing Controls in Handset Applications Portable/Battery-Powered Audio Applications Portable Headphone Speaker Drivers (32Ω)Audio Hands-Free Car Phones (Kits)Laptop/Notebook Computers/TFT Panels Sound Ports/Cards Set-Top BoxesDigital-to-Analog Converter Buffers Transformer/Line Drivers Motor DriversFeatureso 200mA Output Drive Capability o Rail-to-Rail Input and Outputo 1.1mA Supply Current per Amplifier o 2.7V to 5.5V Single-Supply Operation o 10MHz Gain-Bandwidth Product o High Slew Rate: 10V/µso 100dB Voltage Gain (R L = 100k Ω)o 85dB Power-Supply Rejection Ratioo No Phase Reversal for Overdriven Inputso Unity-Gain Stable for Capacitive Loads to 780pF oLow-Power Shutdown Mode Reduces Supply Current to < 1µAo Available in 5-Pin SC70 Package (MAX4230)and 6-Pin, UCSP and Thin µDFN Packages (MAX4231)o Available in 10-Bump UCSP Package (MAX4233)MAX4230–MAX4234High-Output-Drive, 10MHz, 10V/µs,Rail-to-Rail I/O Op Amps with Shutdown in SC70________________________________________________________________Maxim Integrated Products 119-2164; Rev 15; 3/12Selector Guide appears at end of data sheet.Pin Configurations appear at end of data sheet.UCSP is a trademark of Maxim Integrated Products, Inc.Ordering InformationTypical Operating CircuitFor pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642,M A X 4230–M A X 4234High-Output-Drive, 10MHz, 10V/µs,Rail-to-Rail I/O Op Amps with Shutdown in SC70ABSOLUTE MAXIMUM RATINGSStresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.Supply Voltage (V DD to V SS )....................................................6V All Other Pins...................................(V SS - 0.3V) to (V DD + 0.3V)Output Short-Circuit Duration to V DD or V SS (Note 1)................10s Continuous Power Dissipation (Multilayer, T A = +70°C)5-Pin SC70 (derate 3.1mW/°C above +70°C)..............247mW 5-Pin SOT23 (derate 3.9mW/°C above +70°C)............313mW 6-Pin SC70 (derate 3.1mW/°C above +70°C)..............245mW 6-Pin SOT23 (derate 13.4mW/°C above +70°C)........1072mW 6-Pin Thin µDFN (derate 2.1mW/°C above +70°C)...170.2mW 6-Bump UCSP (derate 3.9mW/°C above +70°C).....308.3mW 8-Pin SOT23 (derate 5.1mW/°C above +70°C).........408.2mW 8-Pin µMAX ®(derate 4.8mW/°C above +70°C) .......387.8mW 10-Pin µMAX (derate 8.8mW/°C above +70°C) .......707.3mW 10-Bump UCSP (derate 5.6mW/°C above +70°C) .....448.7mW 14-Pin SO (derate 11.9mW/°C above +70°C) ..........952.4mW 14-Pin TSSOP (derate 10mW/°C above +70°C) ......796.8mW Operating Temperature Range .........................-40°C to +125°C Junction Temperature......................................................+150°C Storage Temperature Range.............................-65°C to +150°C Lead Temperature(excluding 6 and 10 UCSP, soldering, 10s)................+300°C Soldering Temperature (reflow).......................................+260°CNote 1:Package power dissipation should also be observed.DC ELECTRICAL CHARACTERISTICSµMAX is a registered trademark of Maxim Integrated Products, Inc.MAX4230–MAX4234High-Output-Drive, 10MHz, 10V/µs,Rail-to-Rail I/O Op Amps with Shutdown in SC70_______________________________________________________________________________________3DC ELECTRICAL CHARACTERISTICS (continued)(V DD = 2.7V, V SS = 0V, V CM = V DD /2, V OUT = (V DD /2), R L = ∞connected to (V DD /2), V SHDN = V DD , T A = +25°C , unless otherwise noted.) (Note 2)DC ELECTRICAL CHARACTERISTICS(V DD = 2.7V, V SS = 0V, V CM = V DD /2, V OUT = (V DD /2), R L = ∞connected to (V DD /2), V SHDN = V DD , T A = -40 to +125°C , unless other-M A X 4230–M A X 4234High-Output-Drive, 10MHz, 10V/µs,Rail-to-Rail I/O Op Amps with Shutdown in SC704_______________________________________________________________________________________Note 3:SHDN logic parameters are for the MAX4231/MAX4233 only.Note 4:Guaranteed by design.DC ELECTRICAL CHARACTERISTICS (continued)AC ELECTRICAL CHARACTERISTICS(V = 2.7V, V = 0V, V = V /2, V = (V /2), R = ∞connected to (V /2), V = V , T = +25°C , unless otherwise noted.)MAX4230–MAX4234High-Output-Drive, 10MHz, 10V/µs,Rail-to-Rail I/O Op Amps with Shutdown in SC70_______________________________________________________________________________________5GAIN AND PHASE vs. FREQUENCYFREQUENCY (Hz)0.01k 10k100k1M10M 0.1k 1k100MG A I N (d B )70-30-20-100102030605040P H A S E (D E G R E E S )120-90-60-300906030GAIN AND PHASE vs. FREQUENCY(C L = 250pF)FREQUENCY (Hz)0.01k 10k100k1M10M 0.1k 1k100MG A I N (d B )70-30-20-100102030605040-180P H A S E (D E G R E E S )120-150-120-90-60-30090603000.40.20.80.61.21.01.41.81.62.0-4002040-206080100120SUPPLY CURRENT vs. TEMPERATUREM A X 4230 t o c 05TEMPERATURE (°C)S U P P L Y C U R R E N T (m A )POWER-SUPPLY REJECTION RATIOvs. FREQUENCYFREQUENCY (Hz)0.01k10k100k1M0.1k1k10MP S R R (d B )0-100-90-80-70-60-50-40-10-20-3010001001010.10.011k100k 1M10k10MOUTPUT IMPEDANCE vs. FREQUENCYFREQUENCY (Hz)O U T P U T I M P E D A N C E (Ω)5060708090100110-400-2020406080100120TEMPERATURE (°C)S U P P L Y C U R R E N T (n A )SUPPLY CURRENT vs. TEMPERATURE(SHDN = LOW)__________________________________________Typical Operating Characteristics(V DD = 2.7V, V SS = 0V, V CM = V DD /2, V OUT = V DD /2, R L = ∞, connected to V DD /2, V SHDN = V DD , T A = +25°C, unless otherwise noted.)M A X 4230–M A X 4234High-Output-Drive, 10MHz, 10V/µs,Rail-to-Rail I/O Op Amps with Shutdown in SC706_______________________________________________________________________________________00.60.40.21.00.81.81.61.41.22.02.02.53.03.54.04.55.05.5M A X 4230 t o c 07SUPPLY VOLTAGE (V)S U P P L Y C U R R E N T (m A )SUPPLY CURRENT PER AMPLIFIERvs. SUPPLY VOLTAGE-40-2020406080100120TEMPERATURE (°C)-2-1012V O S (m V )INPUT OFFSET VOLTAGE vs. TEMPERATURE020406080100-400-2020406080100120OUTPUT SWING HIGH vs. TEMPERATURETEMPERATURE (°C)V D D - V O U T (m V )040208060120100140-40020-20406080100120OUTPUT SWING LOW vs. TEMPERATURETEMPERATURE (°C)V O U T - V S S (m V )0.20.80.60.41.01.21.42.01.50.5 1.0 2.53.0 3.54.0 4.55.0SUPPLY CURRENT PER AMPLIFIER vs. COMMON-MODE VOLTAGECOMMON-MODE VOLTAGE (V)S U P P L Y C U R R E N T (m A )-2.0-1.0-1.5-0.50.501.000.51.01.52.02.5INPUT OFFSET VOLTAGE vs. COMMON-MODE VOLTAGEM A X 4230/3 t o c 11COMMON-MODE VOLTAGE (V)I N P U T O F F S E T V O L T A G E (m V )0.20.60.41.00.81.20.51.01.52.02.5SUPPLY CURRENT PER AMPLIFIER vs. COMMON-MODE VOLTAGECOMMON-MODE VOLTAGE (V)S U P P L Y C U R R E N T (m A )0.45101001k10k100kTOTAL HARMONIC DISTORTION PLUS NOISE vs. FREQUENCY0.05FREQUENCY (Hz)T H D +N (%)0.150.250.350.300.200.1000.40TOTAL HARMONIC DISTORTION PLUS NOISE vs. PEAK-TO-PEAK OUTPUT VOLTAGEPEAK-TO-PEAK OUTPUT VOLTAGE (V)T H D +N (%)100.00014.04.24.65.00.0010.11 4.44.8____________________________Typical Operating Characteristics (continued)(V DD = 2.7V, V SS = 0V, V CM = V DD /2, V OUT = V DD /2, R L = ∞, connected to V DD /2, V SHDN = V DD , T A = +25°C, unless otherwise noted.)MAX4230–MAX4234High-Output-Drive, 10MHz, 10V/µs,Rail-to-Rail I/O Op Amps with Shutdown in SC70_______________________________________________________________________________________7400ns/div SMALL-SIGNAL TRANSIENT RESPONSE (NONINVERTING)IN50mV/divMAX4230/34 toc16OUT400ns/div SMALL-SIGNAL TRANSIENT RESPONSE (INVERTING)IN50mV/divMAX4230/34 toc17OUT400ns/divLARGE-SIGNAL TRANSIENT RESPONSE (NONINVERTING)IN1V/div MAX4230/34 toc18OUT400ns/divLARGE-SIGNAL TRANSIENT RESPONSE (INVERTING)IN1V/divMAX4230/34 toc19OUT0501501002002502.03.02.53.54.04.55.0OUTPUT CURRENT vs. OUTPUT VOLTAGE(SOURCING, V DD = 5.0V)OUTPUT VOLTAGE (V)O U T P U T C U R R E N T (m A )20103060705040801.0 1.4 1.6 1.82.01.2 2.2 2.4 2.6 2.83.0OUTPUT CURRENT vs. OUTPUT VOLTAGE(SOURCING, V DD = 2.7V)OUTPUT VOLTAGE (V)O U T P U T C U R R E N T (m A )-80-60-70-40-50-30-20-10000.40.60.20.8 1.0 1.2 1.4 1.6OUTPUT CURRENT vs. OUTPUT VOLTAGE(SINKING, V DD = 2.7V)OUTPUT VOLTAGE (V)O U T P U T C U R R E N T (m A )-250-200-100-150-5001.00.51.52.02.53.0OUTPUT CURRENT vs. OUTPUT VOLTAGE(SINKING, V DD= 5.0V)OUTPUT VOLTAGE (V)O U T P U T C U R R E N T (m A )2001001010010k 100kFREQUENCY (Hz)I N P U T V O L T A G E N O I S E (n V /√H z )1k INPUT VOLTAGE NOISE vs. FREQUENCYM A X 4230/34 t o c 24____________________________Typical Operating Characteristics (continued)(V DD = 2.7V, V SS = 0V, V CM = V DD /2, V OUT = V DD /2, R L = ∞, connected to V DD /2, V SHDN = V DD , T A = +25°C, unless otherwise noted.)M A X 4230–M A X 4234Detailed DescriptionRail-to-Rail Input StageThe MAX4230–MAX4234 CMOS operational amplifiershave parallel-connected n- and p-channel differential input stages that combine to accept a common-mode range extending to both supply rails. The n-channel stage is active for common-mode input voltages typi-cally greater than (V SS + 1.2V), and the p-channel stage is active for common-mode input voltages typi-cally less than (V DD - 1.2V).Applications InformationPackage Power DissipationWarning: Due to the high output current drive, this op amp can exceed the absolute maximum power-dissi-pation rating.As a general rule, as long as the peak cur-rent is less than or equal to 40mA, the maximum package power dissipation is not exceeded for any of the packagetypes offered. There are some exceptions to this rule,however. The absolute maximum power-dissipation rating of each package should always be verified using the fol-lowing equations. The equation below gives an approxi-mation of the package power dissipation:where:V RMS = RMS voltage from V DD to V OUT when sourcing current and RMS voltage from V OUT to V SS when sink-ing current.I RMS = RMS current flowing out of or into the op amp and the load.θ= phase difference between the voltage and the cur-rent. For resistive loads, COS θ= 1.P V I COS IC DISS RMS RMS ()≅θHigh-Output-Drive, 10MHz, 10V/µs,Rail-to-Rail I/O Op Amps with Shutdown in SC708_______________________________________________________________________________________For example, the circuit in Figure 1 has a package power dissipation of 196mW:where:V DC= the DC component of the output voltage.I DC= the DC component of the output current.V PEAK= the highest positive excursion of the AC com-ponent of the output voltage.I PEAK= the highest positive excursion of the AC com-ponent of the output current.Therefore:P IC(DISS)= V RMS I RMS COS θ= 196mWAdding a coupling capacitor improves the package power dissipation because there is no DC current to the load, as shown in Figure 2:Therefore:P IC(DISS)= V RMS I RMS COS θ= 15.6mWIf the configuration in Figure 1 were used with all four of the MAX4234 amplifiers, the absolute maximum power-dissipation rating of this package would be exceeded (see the Absolute Maximum Ratings section).60mW Single-Supply StereoHeadphone Driver Two MAX4230/MAX4231s can be used as a single-sup-ply, stereo headphone driver. The circuit shown in Figure 2 can deliver 60mW per channel with 1% distor-tion from a single 5V supply.The input capacitor (C IN), in conjunction with R IN, forms a highpass filter that removes the DC bias from the incoming signal. The -3dB point of the highpass filter isgiven by:MAX4230–MAX4234High-Output-Drive, 10MHz, 10V/µs, Rail-to-Rail I/O Op Amps with Shutdown in SC70_______________________________________________________________________________________9Figure 2. Circuit Example: Adding a Coupling CapacitorGreatly Reduces Power Dissipation of its PackageFigure 1. MAX4230/MAX4231 Used in Single-Supply OperationCircuit ExampleM A X 4230–M A X 4234Choose gain-setting resistors R IN and R F according to the amount of desired gain, keeping in mind the maxi-mum output amplitude. The output coupling capacitor,C OUT , blocks the DC component of the amplifier out-put, preventing DC current flowing to the load. The out-put capacitor and the load impedance form a highpass filer with the -3dB point determined by:For a 32Ωload, a 100µF aluminum electrolytic capaci-tor gives a low-frequency pole at 50Hz.Bridge AmplifierThe circuit shown in Figure 3 uses a dual MAX4230 to implement a 3V, 200mW amplifier suitable for use in size-constrained applications. This configuration elimi-nates the need for the large coupling capacitor required by the single op-amp speaker driver when sin-gle-supply operation is necessary. Voltage gain is set to 10V/V; however, it can be changed by adjusting the 82k Ωresistor value.Rail-to-Rail Input StageThe MAX4230–MAX4234 CMOS op amps have parallel-connected n- and p-channel differential input stages that combine to accept a common-mode range extend-ing to both supply rails. The n-channel stage is active for common-mode input voltages typically greater than (V SS + 1.2V), and the p-channel stage is active for common-mode input voltages typically less than (V DD -1.2V).Rail-to-Rail Output StageThe minimum output is within millivolts of ground for sin-gle-supply operation, where the load is referenced to ground (V SS ). Figure 4 shows the input voltage range and the output voltage swing of a MAX4230 connected as a voltage follower. The maximum output voltage swing is load dependent; however, it is guaranteed to be within 500mV of the positive rail (V DD = 2.7V) even with maximum load (32Ωto ground).Observe the Absolute Maximum Ratings for power dis-sipation and output short-circuit duration (10s, max)because the output current can exceed 200mA (see the Typical Operating Characteristics .)Input CapacitanceOne consequence of the parallel-connected differential input stages for rail-to-rail operation is a relatively large input capacitance C IN (5pF typ). This introduces a pole at frequency (2πR ′C IN )-1, where R ′is the parallel combi-nation of the gain-setting resistors for the inverting or noninverting amplifier configuration (Figure 5). If the pole frequency is less than or comparable to the unity-gain bandwidth (10MHz), the phase margin is reduced, and the amplifier exhibits degraded AC performance through either ringing in the step response or sustained oscilla-tions. The pole frequency is 10MHz when R ′= 2k Ω. To maximize stability, R ′<< 2k Ωis recommended.High-Output-Drive, 10MHz, 10V/µs,Rail-to-Rail I/O Op Amps with Shutdown in SC7010______________________________________________________________________________________Figure 4. Rail-to-Rail Input/Output RangeFigure 3. Dual MAX4230/MAX4231 Bridge Amplifier for 200mW at 3VIN 1V/divOUT 1V/div5µs/divV CC = 3.0V R L = 100k ΩTo improve step response when R ′> 2k Ω, connect small capacitor C f between the inverting input and out-put. Choose C f as follows:C f = 8(R / R f ) [pf]where R f is the feedback resistor and R is the gain-set-ting resistor (Figure 5).Driving Capacitive LoadsThe MAX4230–MAX4234 have a high tolerance for capacitive loads. They are stable with capacitive loads up to 780pF. Figure 6 is a graph of the stable operating region for various capacitive loads vs. resistive loads.Figures 7 and 8 show the transient response with excessive capacitive loads (1500pF), with and without the addition of an isolation resistor in series with the output. Figure 9 shows a typical noninverting capaci-tive-load-driving circuit in the unity-gain configuration.MAX4230–MAX4234Rail-to-Rail I/O Op Amps with Shutdown in SC70Figure 5. Inverting and Noninverting Amplifiers with Feedback CompensationFigure 6. Capacitive-Load Stability1µs/divV DD = 3.0V, C L = 1500pF R L = 100k Ω, R ISO = 39ΩFigure 8. Small-Signal Transient Response with Excessive Capacitive Load with Isolation Resistor1µs/divV DD = 3.0V, C L = 1500pF R L = 100k Ω, R ISO = 0ΩFigure 7. Small-Signal Transient Response with Excessive Capacitive LoadM A X 4230–M A X 4234The resistor improves the circuit’s phase margin by iso-lating the load capacitor from the op amp’s output.Power-Up and Shutdown ModesThe MAX4231/MAX4233 have a shutdown option. When the shutdown pin (SHDN ) is pulled low, supply current drops to 0.5µA per amplifier (V DD = 2.7V), the ampli-fiers are disabled, and their outputs are driven to V SS .Since the outputs are actively driven to V SS in shut-down, any pullup resistor on the output causes a cur-rent drain from the supply. Pulling SHDN high enables the amplifier. In the dual MAX4233, the two amplifiers shut down independently. Figure 10 shows the MAX4231’s output voltage to a shutdown pulse. The MAX4231–MAX4234 typically settle within 5µs after power-up. Figures 11 and 12 show I DD to a shutdown plus and voltage power-up cycle.When exiting shutdown, there is a 6µs delay before the amplifier’s output becomes active (Figure 10).Rail-to-Rail I/O Op Amps with Shutdown in SC70Figure 9. Capacitive-Load-Driving Circuit 100µs/divFigure 11. Shutdown Enable/Disable Supply Current40µs/divFigure 12. Power-Up/Down Supply Current4µs/divFigure 10. Shutdown Output Voltage Enable/Disable Selector GuideAMPS PER PACKAGE SHUTDOWN Single Single Dual Dual QuadMAX4230–MAX4234Rail-to-Rail I/O Op Amps with Shutdown in SC70Pin ConfigurationsPower Supplies and LayoutThe MAX4230–MAX4234 can operate from a single 2.7V to 5.5V supply, or from dual ±1.35V to ±2.5V sup-plies. For single-supply operation, bypass the power supply with a 0.1µF ceramic capacitor. For dual-supply operation, bypass each supply to ground. Good layout improves performance by decreasing the amount of stray capacitance at the op amps’ inputs and outputs.Decrease stray capacitance by placing external com-ponents close to the op amps’ pins, minimizing trace and lead lengths.Ordering Information (continued)M A X 4230–M A X 4234Rail-to-Rail I/O Op Amps with Shutdown in SC70Package InformationFor the latest package outline information and land patterns, go to /packages . Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status.MAX4230–MAX4234Rail-to-Rail I/O Op Amps with Shutdown in SC70Package Information (continued)For the latest package outline information and land patterns, go to /packages . Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status.M A X 4230–M A X 4234Rail-to-Rail I/O Op Amps with Shutdown in SC70Package Information (continued)For the latest package outline information and land patterns, go to /packages . Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status.MAX4230–MAX4234Rail-to-Rail I/O Op Amps with Shutdown in SC70Package Information (continued)For the latest package outline information and land patterns, go to /packages . Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status.M A X 4230–M A X 4234Rail-to-Rail I/O Op Amps with Shutdown in SC70Package Information (continued)For the latest package outline information and land patterns, go to /packages . Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status.MAX4230–MAX4234Rail-to-Rail I/O Op Amps with Shutdown in SC70Package Information (continued)For the latest package outline information and land patterns, go to /packages . Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status.M A X 4230–M A X 4234Rail-to-Rail I/O Op Amps with Shutdown in SC70Package Information (continued)For the latest package outline information and land patterns, go to /packages . Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status.MAX4230–MAX4234Rail-to-Rail I/O Op Amps with Shutdown in SC70______________________________________________________________________________________21Package Information (continued)For the latest package outline information and land patterns, go to /packages . Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status.M A X 4230–M A X 4234Rail-to-Rail I/O Op Amps with Shutdown in SC7022______________________________________________________________________________________Package Information (continued)For the latest package outline information and land patterns, go to /packages . Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status.MAX4230–MAX4234Rail-to-Rail I/O Op Amps with Shutdown in SC70______________________________________________________________________________________23Package Information (continued)For the latest package outline information and land patterns, go to /packages . Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status.M A X 4230–M A X 4234Rail-to-Rail I/O Op Amps with Shutdown in SC7024______________________________________________________________________________________Package Information (continued)For the latest package outline information and land patterns, go to /packages . Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to thepackage regardless of RoHS status.MAX4230–MAX4234Rail-to-Rail I/O Op Amps with Shutdown in SC70______________________________________________________________________________________25Package Information (continued)For the latest package outline information and land patterns, go to /packages . Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to thepackage regardless of RoHS status.M A X 4230–M A X 4234Rail-to-Rail I/O Op Amps with Shutdown in SC7026______________________________________________________________________________________Package Information (continued)For the latest package outline information and land patterns, go to /packages . Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status.MAX4230–MAX4234Rail-to-Rail I/O Op Amps with Shutdown in SC70______________________________________________________________________________________27Package Information (continued)For the latest package outline information and land patterns, go to /packages . Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status.M A X 4230–M A X 4234Rail-to-Rail I/O Op Amps with Shutdown in SC70Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time. The parametric values (min and max limits) shown in the Electrical Characteristics table are guaranteed. Other parametric values quoted in this data sheet are provided for guidance.28____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600©2012 Maxim Integrated ProductsMaxim is a registered trademark of Maxim Integrated Products, Inc.Revision History。

MAX4464EXK-T中文资料

General DescriptionThe MAX4464/MAX4470/MAX4471/MAX4472/MAX4474family of micropower op amps operate from a single +1.8V to +5.5V supply and draw only 750nA of supply current. The MAX4470 family feature ground-sensing inputs and Rail-to-Rail ®output. The ultra-low supply current, low-operating voltage, and rail-to-rail output capabilities make these operational amplifiers ideal for use in single lithium ion (Li+), or two-cell NiCd or alka-line battery systems.The rail-to-rail output stage of the MAX4464/MAX4470/ MAX4471/MAX4472/MAX4474 amplifiers is capable of driving the output voltage to within 4mV of the rail with a 100k Ωload, and can sink and source 11mA with a +5V supply. These amplifiers are available in both fully com-pensated and decompensated versions. The single MAX4470, dual MAX4471, and the quad MAX4472 are unity-gain stable. The single MAX4464 and the dual MAX4474 are stable for closed-loop gain configurations of ≥+5V/V. These amplifiers are available in space-sav-ing SC70, SOT23, µMAX, and TSSOP packages.ApplicationsFeatureso Ultra-Low 750nA Supply Current Per Amplifier o Ultra-Low +1.8V Supply Voltage Operation o Ground-Sensing Input Common-Mode Range o Outputs Swing Rail-to-Railo Outputs Source and Sink 11mA of Load Current o No Phase Reversal for Overdriven Inputs o High 120dB Open-Loop Voltage Gain o Low 500µV Input Offset Voltage o 9kHz Gain-Bandwidth Product (MAX4470/MAX4471/MAX4472)o 40kHz Gain-Bandwidth Product (MAX4464/MAX4474)o 250pF (min) Capacitive Load Capability o Available in Tiny 5-Pin SC70 and 8-Pin SOT23PackagesMAX4464/MAX4470/MAX4471/MAX4472/MAX4474Single/Dual/Quad, +1.8V/750nA, SC70,Rail-to-Rail Op Amps________________________________________________________________Maxim Integrated Products 1Pin Configurations19-2021; Rev 2; 2/03For pricing, delivery, and ordering information,please contact Maxim/Dallas Direct!at 1-888-629-4642, or visit Maxim’s website at .Ordering InformationRail-to-Rail is a registered trademark of Nippon Motorola, Ltd.Selector GuideBattery-Powered SystemsPortable Instrumentation Pagers and Cellphones Micropower ThermostatsElectrometer Amplifiers Solar-Powered Systems Remote Sensor Active Badges pH MetersM A X 4464/M A X 4470/M A X 4471/M A X 4472/M A X 4474Single/Dual/Quad, +1.8V/750nA, SC70, Rail-to-Rail Op Amps 2_______________________________________________________________________________________ABSOLUTE MAXIMUM RATINGSELECTRICAL CHARACTERISTICSStresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.V DD to V SS ...............................................................-0.3V to +6V IN_+ or IN_-......................................(V SS - 0.3V) to (V DD + 0.3V)OUT_ Shorted to V SS or V DD ......................................Continuous Continuous Power Dissipation (T A = +70°C)5-Pin SC70 (derate 3.1mW/°C above +70°C)...................247mW 5-Pin SOT23 (derate 7.1mW/°C above +70°C).................571mW 8-Pin SOT23 (derate 8.9mW/°C above +70°C).................714mW 8-Pin µMAX (derate 4.5mW/°C above +70°C)..................362mW8-Pin SO (derate 5.88mW/°C above +70°C)....................471mW 14-Pin TSSOP (derate 9.1mW/°C above +70°C)...........727mW 14-Pin SO (derate 8.33mW/°C above +70°C)...............667mW Operating Temperature Range .........................-40°C to +85°C Junction Temperature .....................................................+150°C Storage Temperature Range.............................-65°C to +150°C Lead Temperature (soldering, 10s) ................................+300°CMAX4464/MAX4470/MAX4471/MAX4472/MAX4474Single/Dual/Quad, +1.8V/750nA, SC70,Rail-to-Rail Op Amps_______________________________________________________________________________________3ELECTRICAL CHARACTERISTICS (continued)ELECTRICAL CHARACTERISTICSM A X 4464/M A X 4470/M A X 4471/M A X 4472/M A X 4474Single/Dual/Quad, +1.8V/750nA, SC70, Rail-to-Rail Op Amps 4_______________________________________________________________________________________Typical Operating Characteristics(V DD = +5V, V SS = 0, V CM = 0, R L = 100k Ωto V DD /2, T A = +25°C, unless otherwise noted.)0.20.10.50.40.30.70.80.60.91.5 3.0 3.52.0 2.5 4.0 4.5 5.0 5.5 6.0SUPPLY CURRENT PER AMPLIFIER vs.SUPPLY VOLTAGEM A X 4470–74 t o c 01SUPPLY VOLTAGE (V)S U P P L Y C U R R E N T (µA )0.20.10.50.40.30.70.80.60.9-500-25255075100SUPPLY CURRENT PER AMPLIFIER vs.TEMPERATUREM A X 4470–74 t o c 02TEMPERATURE (°C)S U P P L Y C U R R E N T (µA )00.100.050.300.200.250.150.400.450.350.50-50-25255075100OFFSET VOLTAGE vs.TEMPERATUREM A X 4470–74 t o c 03TEMPERATURE (°C)O F F S E T V O L T A G E (m V )00.100.050.200.150.300.250.350.450.400.501.01.50.52.02.53.03.54.0OFFSET VOLTAGEvs. COMMON-MODE VOLTAGEM A X 4470-74 t o c 04COMMON-MODE VOLTAGE (V)O F F S E T V O L T A G E (m V )-400-350-150-250-200-300-50-1000-50-25255075100INPUT BIAS CURRENT vs.TEMPERATUREM A X 4470–74 t o c 05TEMPERATURE (°C)I N P U T B I A S C U R R E N T (p A )-90-70-80-40-50-60-20-10-3000 1.51.00.5 2.0 2.5 3.0 3.5 4.0INPUT BIAS CURRENT MON-MODE VOLTAGEM A X 4470–74 t o c 06COMMON-MODE VOLTAGE (V)I N P U T B I A S C U R R E N T (p A )0-1001010010k1kPOWER-SUPPLY REJECTION RATIO vs.FREQUENCY-80-90M A X 4470–74 t o c 07FREQUENCY (Hz)P S R R (d B )-60-70-40-30-50-20-1000.21.00.60.80.41.41.21.6-50-25255075100OUTPUT VOLTAGE SWING LOW vs.TEMPERATURETEMPERATURE (°C)V O L - V S S (m V )142356-500-25255075100OUTPUT VOLTAGE SWING HIGH vs.TEMPERATURETEMPERATURE (°C)V D D - V O H (m V )MAX4464/MAX4470/MAX4471/MAX4472/MAX4474Single/Dual/Quad, +1.8V/750nA, SC70,Rail-to-Rail Op Amps_______________________________________________________________________________________5-120-100-110-60-80-70-90-40-30-50-20-50-25255075100COMMON-MODE REJECTION RATIO vs.TEMPERATURETEMPERATURE (°C)C M R R (d B )00.40.20.80.61.21.01.4-5025-255075100MINIMUM SUPPLY VOLTAGEvs. TEMPERATUREM A X 4470-74 t o c 11TEMPERATURE (°C)M I N I M UM S U P P L Y V O L T A G E (V )607080901001101201301402.53.0 3.54.0 4.55.0A VOL vs. OUTPUT VOLTAGE SWINGOUTPUT VOLTAGE (Vp-p)A V O L (dB )11001k 10k10100kMAX4470/MAX4471/MAX4472GAIN AND PHASE vs. FREQUENCYFREQUENCY (Hz)G A I N (d B )P H A S E (d e g )80706050403020-60100-10-20-30-40-509045-1350-45-9011001k10k10100kMAX4470/MAX4471/MAX4472GAIN AND PHASE vs. FREQUENCYFREQUENCY (Hz)G A I N (d B )P H A S E (d e g )80706050403020-60100-10-20-30-40-501801359045-1350-45-90-40-140101001k 10k100kCROSSTALK vs. FREQUENCY-100-120FREQUENCY (Hz)C R O S S T A L K (d B )-80-6010.000.011010010k1kMAX4470/MAX4471/MAX4472TOTAL HARMONIC DISTORTION PLUS NOISE vs. FREQUENCYM A X 4470–74 t o c 16FREQUENCY (Hz)T H D + N (%)0.101.0010k 10101k 100100k10kVOLTAGE NOISE DENSITY vs.FREQUENCYM A X 4470–74 t o c 17FREQUENCY (Hz)1001k N O I S E (n V /√H z )100k10010k100k 1MMAX4470/MAX4471/MAX4472 STABILITY vs. CAPACITIVE AND RESISTIVE LOADSRESISTIVE LOAD (Ω)1k10kC A P A C I T I V E L O AD (p F )Typical Operating Characteristics (continued)(V DD = +5V, V SS = 0, V CM = 0, R L = 100k Ωto V DD /2, T A = +25°C, unless otherwise noted.)500µs/divMAX4470/MAX4471/MAX4472SMALL-SIGNAL STEP RESPONSEINPUT 50mV/divOUTPUT 50mV/divV DD = +5V A V = +1V/V R L = 1M Ω C L = 250pF500µs/div MAX4470/MAX4471/MAX4472SMALL-SIGNAL STEP RESPONSEINPUT 50mV/divOUTPUT 50mV/div V DD = +5V A V = +1V/V R L = 1M Ω C L = 1000pF500µs/div MAX4470/MAX4471/MAX4472LARGE-SIGNAL STEP RESPONSEV DD = +5V A V = +1V/V R L = 1M ΩC L = 12pFINPUT 500mV/divOUTPUT 500mV/div500µs/divMAX4470/MAX4471/MAX4472LARGE-SIGNAL STEP RESPONSEINPUT 500mV/divOUTPUT 500mV/divV DD = +5V A V = +1V/V R L = 1M Ω C L = 1000pF052010152530010050150200250300MAX4470/MAX4471/MAX4472PERCENT OVERSHOOT vs. CAPACITIVE LOADC LOAD (pF)P E R C E N T O V E R S H O O T (%)3-71001k 10kMAX4470/MAX4471/MAX4472SMALL-SIGNAL GAIN vs. FREQUENCY-5-6FREQUENCY (Hz)G A I N (d B )-3-4-10-2123-71001k 100k10k MAX4470/MAX4471/MAX4472SMALL-SIGNAL GAIN vs. FREQUENCY-5-6FREQUENCY (Hz)G A I N (d B )-3-4-10-212M A X 4464/M A X 4470/M A X 4471/M A X 4472/M A X 4474Single/Dual/Quad, +1.8V/750nA, SC70, Rail-to-Rail Op Amps 6_______________________________________________________________________________________0128416202428323640021345I OUT vs. V OUTV OUT (V)I O U T (m A )500µs/div MAX4470/MAX4471/MAX4472SMALL-SIGNAL STEP RESPONSE V DD = +5V A V = +1V/V R L = 1M ΩC L = 12pFINPUT 500mV/divOUTPUT 500mV/div Typical Operating Characteristics (continued)(V DD = +5V, V SS = 0, V CM = 0, R L = 100k Ωto V DD /2, T A = +25°C, unless otherwise noted.)MAX4464/MAX4470/MAX4471/MAX4472/MAX4474Single/Dual/Quad, +1.8V/750nA, SC70,Rail-to-Rail Op Amps_______________________________________________________________________________________7Typical Operating Characteristics (continued)(V DD = +5V, V SS = 0, V CM = 0, R L = 100k Ωto V DD /2, T A = +25°C, unless otherwise noted.)3-71001k 10k 100k MAX4470/MAX4471/MAX4472SMALL-SIGNAL GAIN vs. FREQUENCY-5FREQUENCY (Hz)G A I N (d B )-3-112-6-4-203-71001k 10k MAX4470/MAX4471/MAX4472LARGE-SIGNAL GAIN vs. FREQUENCY-5-6FREQUENCY (Hz)G A I N (d B )-3-4-10-2123-71001k 10kMAX4470/MAX4471/MAX4472LARGE-SIGNAL GAIN vs. FREQUENCY-5-6FREQUENCY (Hz)G A I N (d B )-3-4-10-2123-71001k 10kMAX4470/MAX4471/MAX4472LARGE-SIGNAL GAIN vs. FREQUENCY-5-6FREQUENCY (Hz)G A I N (d B )-3-4-10-21280-6011k 10k100k10FREQUENCY (Hz)G A I N (d B )10100MAX4464/MAX4474GAIN AND PHASE vs. FREQUENCY7060504030200-10-20-30-40-5018013590450-45-90-135P H A S E (d e g r e e s )80-6011k 10k100k10FREQUENCY (Hz)G A I N (d B )10100MAX4464/MAX4474GAIN AND PHASE vs. FREQUENCY7060504030200-10-20-30-40-5018013590450-45-90-135P H A S E (d e g r e e s )0.0011010k1k100MAX4464/MAX4474TOTAL HARMONIC DISTORTION PLUS NOISE vs. FREQUENCY100.0110.1M A X 4464 t o c 34FREQUENCY (Hz)T H D + N (%)100,00010010k100k 1MMAX4464/MAX4474STABILITY vs. CAPACITIVE AND RESISTIVE LOADSRESISTIVE LOAD (Ω)C A P A C I T I V E L O AD (p F )100010,000OUTPUT 50mV/divINPUT 10mV/divMAX4464/MAX4474SMALL-SIGNAL STEP RESPONSE500µs/divV DD = +5V A V = +5V/V R L = 1M ΩC L = 8pFM A X 4464/M A X 4470/M A X 4471/M A X 4472/M A X 4474Single/Dual/Quad, +1.8V/750nA, SC70, Rail-to-Rail Op Amps 8_______________________________________________________________________________________OUTPUT 50mV/div INPUT 10mV/divMAX4464/MAX4474SMALL-SIGNAL STEP RESPONSEM A X 4464 t o c 37500µs/div V DD = +5V A V = +5V/V R L = 1M ΩC L = 250pFOUTPUT 50mV/div INPUT 10mV/divMAX4464/MAX4474SMALL-SIGNAL STEP RESPONSEM A X 4464 t o c 38500µs/div V DD = +5V A V = +5V/V R L = 1M ΩC L = 1000pFOUTPUT 500mV/divINPUT 100mV/divMAX4464/MAX4474LARGE-SIGNAL STEP RESPONSE500µs/divV DD = +5V A V = +5V/V R L = 1M ΩC L = 8pFOUTPUT 500mV/divINPUT 100mV/divMAX4464/MAX4474LARGE-SIGNAL STEP RESPONSE500µs/divV DD = +5V A V = +5V/V R L = 1M ΩC L = 1000pF10520152530010015050200250300MAX4464/MAX4474PERCENT OVERSHOOT vs. CAPACITIVE LOADC LOAD (pF)P E R C E N T O V E R S H O O T (%)2-7100100k10k 1k MAX4464/MAX4474SMALL-SIGNAL NORMALIZED GAINvs. FREQUENCY-4-60-23-3-51-1FREQUENCY (Hz)G A I N (d B )2-7100100k10k1kMAX4464/MAX4474SMALL-SIGNAL NORMALIZED GAINvs. FREQUENCY-4-60-23-3-51-1FREQUENCY (Hz)G A I N (d B )Typical Operating Characteristics (continued)(V DD = +5V, V SS = 0, V CM = 0, R L = 100k Ωto V DD /2, T A = +25°C, unless otherwise noted.)MAX4464/MAX4470/MAX4471/MAX4472/MAX4474Single/Dual/Quad, +1.8V/750nA, SC70,Rail-to-Rail Op Amps2-7100100k 10k 1k MAX4464/MAX4474LARGE-SIGNAL NORMALIZED GAINvs. FREQUENCY-4-60-23-3-51-1FREQUENCY (Hz)G A I N (d B )2-7100100k10k 1k MAX4464/MAX4474LARGE-SIGNAL NORMALIZED GAINvs. FREQUENCY-4-60-23-3-51-1FREQUENCY (Hz)G A I N (d B )2-7100100k 10k 1k MAX4464/MAX4474SMALL-SIGNAL NORMALIZED GAINvs. FREQUENCY-4-60-23-3-51-1FREQUENCY (Hz)G A I N (d B )2-7100100k10k 1k MAX4464/MAX4474LARGE-SIGNAL NORMALIZED GAINvs. FREQUENCY-4-60-23-3-51-1FREQUENCY (Hz)G A I N (d B )Typical Operating Characteristics (continued)(V DD = +5V, V SS = 0, V CM = 0, R L = 100k Ωto V DD /2, T A = +25°C, unless otherwise noted.)M A X 4464/M A X 4470/M A X 4471/M A X 4472/M A X 4474Single/Dual/Quad, +1.8V/750nA, SC70, Rail-to-Rail Op Amps 10______________________________________________________________________________________Figure 2. Compensation for Feedback Node CapacitanceApplications InformationGround SensingThe common-mode input range of the MAX4470 family extends down to ground, and offers excellent common-mode rejection. These devices are guaranteed not to undergo phase reversal when the input is overdriven.Power Supplies and LayoutThe MAX4470 family operates from a single +1.8V to +5.5V power supply. Bypass power supplies with a 0.1µF ceramic capacitor placed close to the V DD pin. Ground layout improves performance by decreasing the amount of stray capacitance and noise at the op amp ’s inputs and outputs. To decrease stray capacitance, mini-mize PC board lengths and resistor leads, and place external components close to the op amps ’ pins.BandwidthThe MAX4470/MAX4471/MAX4472 are internally compensated for unity-gain stability and have a typical gain-bandwidth of 9kHz. The MAX4464/MAX4474 have a 40kHz typical gain-bandwidth and are stable for a gain of +5V/V or greater.StabilityThe MAX4464/MAX4470/MAX4471/MAX4472/MAX4474maintain stability in their minimum gain configuration while driving capacitive loads. Although this product family is primarily designed for low-frequency applica-tions, good layout is extremely important because low-power requirements demand high-impedance circuits.The layout should also minimize stray capacitance at the amplifier inputs. However some stray capacitance may be unavoidable, and it may be necessary to add a 2pF to 10pF capacitor across the feedback resistor as shown in Figure 2. Select the smallest capacitor value that ensures stability.Chip InformationMAX4470/MAX4464 TRANSISTOR COUNT: 147MAX4471/MAX4474 TRANSISTOR COUNT: 293MAX4472 TRANSISTOR COUNT: 585PROCESS: BiCMOSMAX4464/MAX4470/MAX4471/MAX4472/MAX4474Rail-to-Rail Op Amps______________________________________________________________________________________11M A X 4464/M A X 4470/M A X 4471/M A X 4472/M A X 4474Rail-to-Rail Op AmpsS C 70, 5L .E P SPackage Information(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,go to /packages .MAX4464/MAX4470/MAX4471/MAX4472/MAX4474Rail-to-Rail Op AmpsPackage Information (continued)(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,go to /packages .M A X 4464/M A X 4470/M A X 4471/M A X 4472/M A X 4474Rail-to-Rail Op Amps Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses areimplied. Maxim reserves the right to change the circuitry and specifications without notice at any time.14____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600©2003 Maxim Integrated ProductsPrinted USAis a registered trademark of Maxim Integrated Products.S O I C N .E P SPackage Information (continued)(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,go to /packages .。

(华为OSN)04-第4章单板

目录第4章单板.............................................................................................................................4-14.1 单板分类说明.....................................................................................................................4-14.2 单板外形.............................................................................................................................4-34.3 STM-64光接口单元SL64...................................................................................................4-44.3.1 功能.........................................................................................................................4-44.3.2 原理.........................................................................................................................4-44.3.3 面板说明..................................................................................................................4-64.3.4 单板参数配置...........................................................................................................4-84.3.5 版本说明..................................................................................................................4-84.3.6 技术参数..................................................................................................................4-84.4 STM-16光接口单元SL16/SF16.......................................................................................4-104.4.1 功能.......................................................................................................................4-104.4.2 原理.......................................................................................................................4-104.4.3 面板说明................................................................................................................4-124.4.4 单板参数配置.........................................................................................................4-144.4.5 版本说明................................................................................................................4-144.4.6 技术参数................................................................................................................4-154.5 STM-4光接口单元SL4/SLQ4/SLD4.................................................................................4-174.5.1 功能.......................................................................................................................4-174.5.2 原理.......................................................................................................................4-184.5.3 面板说明................................................................................................................4-194.5.4 单板参数配置.........................................................................................................4-214.5.5 版本说明................................................................................................................4-214.5.6 技术参数................................................................................................................4-224.6 STM-1光接口单元SLT1/SLQ1/SL1.................................................................................4-244.6.1 功能.......................................................................................................................4-244.6.2 原理.......................................................................................................................4-254.6.3 面板说明................................................................................................................4-264.6.4 单板参数配置.........................................................................................................4-284.6.5 版本说明................................................................................................................4-284.6.6 技术参数................................................................................................................4-294.7 STM-1电接口单元SLH1/SEP1/EU08/OU08 /TSB8........................................................4-304.7.1 功能.......................................................................................................................4-314.7.2 原理.......................................................................................................................4-314.7.3 面板说明................................................................................................................4-324.7.4 单板保护配置.........................................................................................................4-344.7.5 单板参数配置.........................................................................................................4-374.7.6 版本说明................................................................................................................4-374.7.7 技术参数................................................................................................................4-37 4.8 E4/STM-1电接口单元SPQ4/MU04/TSB8.......................................................................4-394.8.1 功能.......................................................................................................................4-394.8.2 原理.......................................................................................................................4-394.8.3 面板说明................................................................................................................4-414.8.4 单板保护配置.........................................................................................................4-424.8.5 单板参数配置.........................................................................................................4-454.8.6 版本说明................................................................................................................4-454.8.7 技术参数................................................................................................................4-46 4.9 E3/T3电接口单元PL3/PL3A/PD3/C34S/D34S................................................................4-474.9.1 功能.......................................................................................................................4-474.9.2 原理.......................................................................................................................4-474.9.3 面板说明................................................................................................................4-484.9.4 单板保护配置.........................................................................................................4-504.9.5 单板参数配置.........................................................................................................4-534.9.6 版本说明................................................................................................................4-534.9.7 技术参数................................................................................................................4-53 4.10 E1/T1电接口单元PQ1/PQM/D75S/D12S/D12B............................................................4-554.10.1 功能.....................................................................................................................4-554.10.2 原理.....................................................................................................................4-554.10.3 面板说明..............................................................................................................4-574.10.4 单板保护配置.......................................................................................................4-584.10.5 单板参数配置.......................................................................................................4-604.10.6 版本说明..............................................................................................................4-604.10.7 技术参数..............................................................................................................4-61 4.11 千兆以太网接口单元EGS2.............................................................................................4-624.11.1 功能.....................................................................................................................4-624.11.2 原理.....................................................................................................................4-634.11.3 面板说明..............................................................................................................4-654.11.4 单板参数配置.......................................................................................................4-664.11.5 版本说明..............................................................................................................4-674.11.6 技术参数..............................................................................................................4-67 4.12 千兆以太网接口单元EGT2.............................................................................................4-694.12.1 功能.....................................................................................................................4-694.12.2 原理.....................................................................................................................4-704.12.3 面板说明..............................................................................................................4-714.12.4 单板参数配置.......................................................................................................4-724.12.5 版本说明..............................................................................................................4-724.12.6 技术参数..............................................................................................................4-73 4.13 快速以太网处理单元EFS4/EFS0/ETF8/EFF8/ETS8......................................................4-744.13.1 功能.....................................................................................................................4-744.13.2 原理.....................................................................................................................4-764.13.3 面板说明..............................................................................................................4-774.13.4 单板保护配置.......................................................................................................4-784.13.5 单板参数配置.......................................................................................................4-804.13.6 版本说明..............................................................................................................4-814.13.7 技术参数..............................................................................................................4-82 4.14 快速以太网处理单元EFT8..............................................................................................4-834.14.1 功能.....................................................................................................................4-834.14.2 原理.....................................................................................................................4-844.14.3 面板说明..............................................................................................................4-854.14.4 单板参数配置.......................................................................................................4-874.14.5 版本说明..............................................................................................................4-874.14.6 技术参数..............................................................................................................4-87 4.15 弹性以太环网单元EMR0/EGR2.....................................................................................4-894.15.1 功能.....................................................................................................................4-894.15.2 原理.....................................................................................................................4-914.15.3 面板说明..............................................................................................................4-934.15.4 单板参数配置.......................................................................................................4-944.15.5 版本说明..............................................................................................................4-954.15.6 技术参数..............................................................................................................4-96 4.16 ATM处理单元ADL4/ADQ1.............................................................................................4-974.16.1 功能.....................................................................................................................4-974.16.2 原理.....................................................................................................................4-984.16.3 面板说明..............................................................................................................4-994.16.4 单板参数配置.....................................................................................................4-1004.16.5 版本说明............................................................................................................4-1014.16.6 技术参数............................................................................................................4-101 4.17 ATM/IMA业务处理单元IDL4/IDQ1...............................................................................4-1034.17.1 功能...................................................................................................................4-1034.17.2 原理...................................................................................................................4-1044.17.3 面板说明............................................................................................................4-1054.17.4 单板保护配置.....................................................................................................4-1064.17.5 单板参数配置.....................................................................................................4-1074.17.6 版本说明............................................................................................................4-1074.17.7 技术参数............................................................................................................4-108 4.18 SAN业务和Vedio业务单元MST4.................................................................................4-1094.18.1 功能...................................................................................................................4-1094.18.2 原理...................................................................................................................4-1104.18.3 面板说明............................................................................................................4-1114.18.4 单板参数配置.....................................................................................................4-1134.18.5 版本说明............................................................................................................4-1134.18.6 技术参数............................................................................................................4-113 4.19 波长转换单元LWX.......................................................................................................4-1144.19.1 功能...................................................................................................................4-1144.19.2 原理...................................................................................................................4-1144.19.3 面板说明............................................................................................................4-1154.19.4 版本说明............................................................................................................4-1174.19.5 技术参数............................................................................................................4-117 4.20 双路光分插复用单元MR2A/MR2C...............................................................................4-1204.20.1 功能...................................................................................................................4-1204.20.2 原理...................................................................................................................4-1214.20.3 面板说明............................................................................................................4-1214.20.4 版本说明............................................................................................................4-1234.20.5 技术参数............................................................................................................4-123 4.21 光放大单元BA2/BPA....................................................................................................4-1244.21.1 功能...................................................................................................................4-1244.21.2 应用...................................................................................................................4-1244.21.3 原理...................................................................................................................4-1254.21.4 面板说明............................................................................................................4-1264.21.5 版本说明............................................................................................................4-1274.21.6 技术参数............................................................................................................4-127 4.22 盒式光纤放大器COA....................................................................................................4-1294.22.1 功能...................................................................................................................4-1304.22.2 应用...................................................................................................................4-1304.22.3 原理...................................................................................................................4-1314.22.4 面板说明............................................................................................................4-1324.22.5 安装位置............................................................................................................4-1354.22.6 版本说明............................................................................................................4-1364.22.7 技术参数............................................................................................................4-136 4.23 色散补偿单元DCU.......................................................................................................4-1374.23.1 功能...................................................................................................................4-1374.23.2 应用...................................................................................................................4-1374.23.3 原理...................................................................................................................4-1384.23.4 面板说明............................................................................................................4-1394.23.5 版本说明............................................................................................................4-1404.23.6 技术参数............................................................................................................4-140 4.24 交叉时钟单元GXCSA/EXCSA.....................................................................................4-1414.24.1 功能...................................................................................................................4-1414.24.2 原理...................................................................................................................4-1424.24.3 面板说明............................................................................................................4-1434.24.4 单板参数配置.....................................................................................................4-1444.24.5 版本说明............................................................................................................4-1444.24.6 技术参数............................................................................................................4-144 4.25 系统控制与通信单元GSCC..........................................................................................4-1464.25.1 功能...................................................................................................................4-1464.25.2 原理...................................................................................................................4-1474.25.3 面板说明............................................................................................................4-1494.25.4 版本说明............................................................................................................4-1514.25.5 技术参数............................................................................................................4-151 4.26 辅助接口单元AUX........................................................................................................4-1524.26.1 功能...................................................................................................................4-1524.26.2 原理...................................................................................................................4-1524.26.3 面板说明............................................................................................................4-1534.26.4 版本说明............................................................................................................4-1584.26.5 技术参数............................................................................................................4-159 4.27 公务处理单元EOW.......................................................................................................4-1604.27.1 功能...................................................................................................................4-1604.27.2 原理...................................................................................................................4-1604.27.3 面板说明............................................................................................................4-1614.27.4 版本说明............................................................................................................4-1654.27.5 技术参数............................................................................................................4-165 4.28 电源接口单元PIU.........................................................................................................4-1664.28.1 功能...................................................................................................................4-1664.28.2 原理...................................................................................................................4-1664.28.3 面板说明............................................................................................................4-1674.28.4 版本说明............................................................................................................4-1674.28.5 技术参数............................................................................................................4-167 4.29 风扇单元FANA.............................................................................................................4-1694.29.1 功能...................................................................................................................4-1694.29.2 原理...................................................................................................................4-1704.29.3 面板说明............................................................................................................4-1714.29.4 版本说明............................................................................................................4-1714.29.5 技术参数............................................................................................................4-171插图目录图4-1 OptiX OSN 7500单板外形...................................................................................4-3图4-2 SL64工作原理框图..............................................................................................4-5图4-3 SL64的面板图.....................................................................................................4-6图4-4 SL16工作原理框图............................................................................................4-11图4-5 SL16/SF16的面板图..........................................................................................4-13图4-6 SL4/SLQ4/SLD4板工作原理框图.......................................................................4-18图4-7 SL4、SLD4和SLQ4的面板图...........................................................................4-20图4-8 SLT1/SLQ1/SL1工作原理框图...........................................................................4-25图4-9 SLT1/SLQ1/SL1的面板图..................................................................................4-27图4-10 SLH1/SEP工作原理框图..................................................................................4-31图4-11 SLH1/SEP1/EU08/OU08/TSB8的面板图........................................................4-33图4-12 SLH1 1:3的TPS保护原理................................................................................4-34图4-13 SLH1板1组1:3保护时工作板和保护板的配置关系........................................4-36图4-14 SPQ4工作原理框图.........................................................................................4-40图4-15 SPQ4和MU04的面板图..................................................................................4-41图4-16 SPQ4板1:3 TPS保护原理图...........................................................................4-43图4-17 SPQ4板1:3保护时工作板和保护板的配置关系...............................................4-44图4-18 PL3/PD3板的原理框图....................................................................................4-48图4-19 PL3、PL3A、PD3、C34S和D34S的面板图....................................................4-49图4-20 PD3板1:3 TPS保护的实现原理图...................................................................4-51图4-21 PL3/PD3板1:3保护时工作板和保护板的槽位配置..........................................4-52图4-22 PQ1/ PQM板的原理框图..................................................................................4-56图4-23 PQ1、PQM、D75S、D12S和D12B的面板图..................................................4-57图4-24 PQ1板1:4 TPS保护原理.................................................................................4-59图4-25 PQ1/PQM 1:4保护时工作板和保护板的配置关系............................................4-60图4-26 EGS2板原理框图.............................................................................................4-64图4-27 EGS2的面板图................................................................................................4-65图4-28 EGT2板原理框图.............................................................................................4-70图4-29 EGT2的面板图................................................................................................4-71图4-30 EFS4/EFS0板原理框图...................................................................................4-76图4-31 EFS0、 EFS4、ETF8、ETS8和EFF8的面板图.............................................4-77图4-32 EFS0板1:1 TPS保护的实现原理图.................................................................4-79图4-33 EFS0板1:1 TPS保护时工作板和保护板的槽位配置........................................4-80图4-34 EFT8板原理框图.............................................................................................4-84图4-35 EFT8的面板图.................................................................................................4-86图4-36 EMR0/EGR2板原理框图.................................................................................4-92图4-37 EMR0/EGR2的面板图.....................................................................................4-93图4-38 ADL4和ADQ1板原理框图...............................................................................4-98图4-39 ADL4和ADQ1的面板图...................................................................................4-99图4-40 IDL4和IDQ1板原理框图................................................................................4-104图4-41 IDL4和IDQ1的面板图...................................................................................4-105图4-42 MST4板原理框图...........................................................................................4-110图4-43 MST4板的面板图...........................................................................................4-112图4-44 LWX板工作原理框图......................................................................................4-115图4-45 LWX板的面板图.............................................................................................4-116图4-46 MR2A/MR2C用作OTM站点............................................................................4-120图4-47 MR2A/MR2C与LWX实现两波上下的OADM站点............................................4-120图4-48 MR2A/MR2C工作原理框图............................................................................4-121图4-49 MR2A板的面板图...........................................................................................4-122图4-50 BA、PA在光传输系统中的位置......................................................................4-125图4-51 BA2，BPA工作原理框图................................................................................4-125。

MAX4664中文资料

元器件交易网
19-1504; Rev 0; 7/99
MAX4664/MAX4665/MAX4666
5Ω, Quad, SPST, CMOS Analog Switches
General Description
Features
The MAX4664/MAX4665/MAX4666 quad analog switches feature 5Ω max on-resistance. On-resistance is matched between switches to 0.5Ω max and is flat (0.5Ω max) over the specified signal range. Each switch can handle Rail-to-Rail® analog signals. The off-leakage current is only 5nA max at +85°C. These analog switches are ideal in low-distortion applications and are the preferred solution over mechanical relays in automatic test equipment or in applications where current switching is required. They have low power requirements, require less board space, and are more reliable than mechanical relays.
o Low On-Resistance (5Ω max) o Guaranteed RON Match Between Channels

MXT2144中文手册

1、特点z分辨率：14 bitz工作电压：3.3V电源z转换速率：可达210MHzz满量程输出电流可调整范围：2mA～20mAz输入类型：并行输入z工作模式：电流型z功耗：150mW@3.3Vz兼容AD97442、功能描述MXT2144是一种14位电流输出型、CMOS D/A转换器，最大刷新率至少可达200MSPS，工作电压支持3.3伏，在3.3伏电压下工作时功耗小于160毫瓦。

在待机模式下，其功耗约为20mW。

该D/A转换器采用了分段电流沉结构，可以有效的减小电流开关的数量，从而减小开关电流的浪涌，改善建立时间，提高转换器的精度．该D/A转换器主要应用在通讯、仪器仪表、高分辨率图像系统、波形发生器等方面。

该电路在工作时，输入的14位数字信号存放在内部寄存器，然后控制电流源阵列的电流源打开或关断，从而控制电流的增加或减小。

整个电路可以分为电压基准源、偏置电路、电流源阵列、电流开关和高速锁存器等部分。

MXT2144内部寄存器在时钟上升沿进行刷新。

如果驱动时钟或数字输入的线电阻有50Ω，为了减小反射，建议在管脚附近用50Ω电阻接地。

另外，也建议把数字电源与模拟电源，数字地与模拟地分开，以使其性能最优化。

为了减小电源噪声，最好在靠近AVDD和DVDD管脚处分别对模拟地和数字地接0.1uF的电容。

MXT2144内部带隙电压参考源为1.22V，在整个温度范围温度系数为±50ppm/℃。

管脚16 VREFLO是参考选择端，如果VREFLO接地，则为内部参考；若接模拟电源，则为使用外部参考源，由17管脚输入。

输出I OUT的电流由18管脚的FSADJ端所接的R SET来设置，满量程范围为2～20mA可调。

如果采用内部参考，则V FSADJ约为1.22V；如用外部参考，则V FSADJ约等于外参考电压。

满量程输出电流 I OUTFS=(V FSADJ/R SET) X 32当满量程电流为20mA时，输入码与输出电流的对应关系表（表1）：表1INPUT CODE(D13-D0) IOUTA(mA) IOUTB(mA)1111 11111 11111 20 01000 00000 00000 10 100000 00000 00000 0 20IOUTA与IOUTB为互补电流输出端，它们的和总是等于满量程电流减去1LSB。

MAX4410中文资料

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
80mW, DirectDrive Stereo Headphone Driver with Shutdown MAX4410
ABSOLUTE MAXIMUM RATINGS
PGND to SGND .....................................................-0.3V to +0.3V PVDD to SVDD .................................................................-0.3V to +0.3V PVSS to SVSS .........................................................-0.3V to +0.3V PVDD and SVDD to PGND or SGND .........................-0.3V to +4V PVSS and SVSS to PGND or SGND ..........................-4V to +0.3V IN_ to SGND ..........................................................-0.3V to +0.3V SHDN_ to SGND........................(SGND - 0.3V) to (SVDD + 0.3V) OUT_ to SGND ............................(SVSS - 0.3V) to (SVDD + 0.3V) C1P to PGND.............................(PGND - 0.3V) to (PVDD + 0.3V) C1N to PGND .............................(PVSS - 0.3V) to (PGND + 0.3V) Output Short Circuit to GND or VDD ...........................Continuous Continuous Power Dissipation (TA = +70°C) 14-Pin TSSOP (derate 9.1mW/°C above +70°C) ..........727mW 16-Bump UCSP (derate 15.2mW/°C above +70°C)....1212mW Junction Temperature ......................................................+150°C Operating Temperature Range ...........................-40°C to +85°C Storage Temperature Range .............................-65°C to +150°C Bump Temperature (soldering) (Note 1) Infrared (15s) ...............................................................+220°C Vapor Phase (60s) .......................................................+215°C Lead Temperature (soldering, 10s) .................................+300°C

MAX4164ESD+中文资料

ELECTRICAL CHARACTERISTICS: 3V Operation
(VDD = 3V, VSS = 0, VCM = VDD/2, VOUT = VDD/2, RL tied to VDD/2, TA = -40°C to +85°C, unless otherwise noted. Typical values are at TA = +25°C.) (Note 1)
PARAMETER
SYMBOL
CONDITIONS
MIN TYP MAX UNITS
Operating Voltage Range Supply Current (Per Amplifier) Input Bias Current (Note 2)
Input Offset Voltage
________________________________________________________________ Maxim Integrated Products 1
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at 1-888-629-4642, or visit Maxim’s website at .
________________________Applications
Battery-Powered Devices pH Probes Portable Equipment Low-Power, Low-Voltage Equipment
Medical Instruments Ionization Detectors Cellular Phones

MAX9424中文资料

Applications
Data and Clock Driver and Buffer Central Office Backplane Clock Distribution DSLAM Backplane Base Station ATE
TOP VIEW
Features
o 0.24ps RMS Added Random Jitter
o Functionally Compatible with SK4426 (MAX9424) SK4430 (MAX9425) SK4436 (MAX9426) SK4440 (MAX9427)
o Integrated 50Ω Outputs (MAX9425/MAX9427)
o Integrated 100Ω Inputs (MAX9426/MAX9427)
元器件交易网
19-2390; Rev 0; 4/02
MAX9424–MAX9427
Lowest Jitter Quad PECL-to-ECL Differential Translators
General Description
The MAX9424–MAX9427 high-speed, low-skew quad PECL-to-ECL translators are designed for high-speed data and clock driver applications. These devices feature an ultra-low 0.24ps(RMS) random jitter and channel-tochannel skew is less than 90ps in asynchronous mode. The four channels can be operated synchronously with an external clock, or in asynchronous mode determined by the state of the SEL input. An enable input provides the ability to force all the outputs to a differential low state. The parts differ from one another by their input and output termination options. The input options are an open input or an internal differential 100Ω termination. The output options are an open-emitter output or a series 50Ω termination. See Ordering Information. The MAX9424–MAX9427 operate from a positive voltage supply of +2.375V to +5.5V, and a negative supply voltage of -2.375V to -5.5V and operate across the extended temperature range of -40°C to +85°C. They are offered in 32-pin 5mm x 5mm TQFP and space-saving 5mm x 5mm QFN packages.

MAX3624

MAX3624——超低抖动、四路输出时钟发生器
1.芯片概述
MAX3624是一款低抖动精密时钟发生器，用于网络设备。

器件集成了晶体振荡器和锁相环(PLL)时钟倍频器，可为以太网、光纤通道、SONET/SDH及其它网络产生高频时钟输出。

Maxim公司专有的PLL设计具有超低抖动(0.36ps RMS)和优异的电源噪声抑制特性，使网络设备的设计风险降至最低。

MAX3624具有3路LVPECL输出和1路LVCMOS输出。

可选择的输出分频器和反馈分频器能够在一定范围内设置输出频率。

2.关键特性及应用范围
1)关键特性
•晶体振荡器接口：19.375MHz至27MHz
•CMOS输入：19MHz至40.5MHz
•输出频率
▫以太网：62.5MHz、125MHz、156.25MHz、312.5MHz
▫光纤通道：106.25MHz、159.375MHz、212.5MHz、318.5MHz
▫SONET/SDH：77.76MHz、155.52MHz、311.04MHz
•低抖动
▫0.14ps RMS (1.875MHz至20MHz)
▫0.36ps RMS (12kHz至20MHz)
•优异的电源噪声抑制特性
•无需外部环路滤波电容
2)应用
•以太网网络设备
•光纤通道存储局域网
•SONET/SDH网络
3.功能框图
4.典型应用电路
5.使用注意事项
1)时钟I/O下方应铺设连续的地平面；
2)电源去耦电容应尽可能靠近电源引脚放置；
3)应保证100Ω的差分(或50Ω的单端)传输线阻抗。

关于布局布线的更多信息请参见MAX3624的数据资料。

MAX2644EXT+T;中文规格书,Datasheet资料

________________________Applicatห้องสมุดไป่ตู้ons
Bluetooth 802.11 WLAN Home RF Satellite CD Radio 2.4GHz ISM Band Radios 2.4GHz Cordless Phones Wireless Local Loop (WLL)
/
2.4GHz SiGe, High IP3 Low-Noise Amplifier MAX2644
Typical Operating Characteristics
(PRFIN = -30dBm, ZS = ZL = 50Ω, VCC = +3.0V, fRFIN = 2450MHz, RBIAS = 1.2kΩ, TA = +25°C, unless otherwise noted.)
MAX2644
The MAX2644 low-cost, high third-order intercept point (IP3) low-noise amplifier (LNA) is designed for applications in 2.4GHz WLAN, ISM, and Bluetooth radio systems. It features a programmable bias, allowing the input IP3 and supply current to be optimized for specific applications. The LNA provides up to +1dBm input IP3 while maintaining a low noise figure of 2.0dB and a typical gain of 16dB. The MAX2644 is designed on a low-noise, advanced silicon-germanium (SiGe) technology. It operates with a +2.7V to +5.5V single supply and is available in an ultra-small 6-pin SC70 package.

MAX1241中文资料datasheet

总体说明
MAX1240 / MAX1241 采用 8 引脚封装的低功耗、12 位模数转换器转换器（ADC）。 MAX1240 采用 + 2.7V 至 + 3.6V 的电源供电，MAX1241 采用单电源供电范围是+ 2.7V 至+ 5.25V。这两款设备都具有 7.5μs 的功能逐次逼近 ADC，快速跟踪/保持（1.5μs），片上时钟和高速 3 线串行接口。在 73ksps 的最大采样速度下，功耗仅为 37mW（VDD = 3V）。2μA 关断模式以较慢的吞吐率来降低功耗。 MAX1240 具有内部 2.5V 参考电压，而 MAX1241 需要外部参考电压。MAX1241 接受从 0V 到VREF 和参考信号输入范围包括正电源轨。外部的时钟从 3 线接口访问数据，它直接连接到标准微控制器的 I/O 港口。该接口与 SPI™，QSPI™和 MICROWIRE™兼容。该接卓越的交流特性和极低的功耗，易于使用和小封装尺寸，使这些转换器成为远程传感器和数据采集应用的理想之选，或者是要求降低功耗和对空间有要求的电路的最好选择。MAX1240/MAX1241 采用 8 引脚 PDIP 和 SO 封装。
兑换率
转换时间跟踪/保持采集时间转换时间吞吐率光圈抖动
tCONV
t ACQ
t APR
fSCLK=2.1MHz 图8
5.5
7.5
us
1.5
us
73
ksps
30
ns
<50
ps
模拟输入
输入电压范围输入电容
0
VREF V
16
pF
电源要求

maxim+max2644evkit+评估板+说明书

General DescriptionThe MAX2644 evaluation kit (EV kit) simplifies the evalu-ation of the MAX2644 low-noise amplifier (LNA). The kit enables testing of the device’s performance and requires no additional support circuitry. The signal input and output use SMA connectors to facilitate easy con-nection of RF test equipment.The MAX2644 EV kit is fully assembled with the MAX2644 and incorporates matching components opti-mized for a 2450MHz RF frequency operation.Featureso Easy Evaluation of MAX2644o +2.7V to +5.5V Single-Supply Operation o Matched to 50Ωat 2450MHz o Fully Assembled and TestedEvaluates: MAX2644MAX2644 Evaluation Kit19-1786; Rev 0; 3/01Ordering InformationFor pricing, delivery, and ordering information,please contact Maxim/Dallas Direct!at 1-888-629-4642, or visit Maxim’s website at .output. Connect the RF generator output to the RFIN SMA connector with a coaxial cable.3)Connect the coaxial cable from the RFOUT SMA connector to the spectrum analyzer.4)Turn on the DC supply. The supply current should read approximately 10mA (if using an ammeter).5)Activate the RF generator ’s output. A signal on the spectrum analyzer ’s display should indicate a typi-cal gain of +17dB after accounting for cable and board losses. Typical board loss is 0.6dB from input to output port.6)(Optional) Another method for determining gain is using a network analyzer. This has the advantage of displaying gain versus a swept frequency band, in addition to displaying input and output return loss.Refer to the network analyzer manufacturer ’s user manual for setup details.Checking Noise FigureNoise figure measurements on low-noise devices such as the MAX2644 are extremely sensitive to board and lab setup losses and parasitics. There are many tech-niques and precautions for measuring a low noise fig-ure. Detailed explanation of these items would exceed the scope of this document. Take into account PC-board and external-components loss when performing noise-figure measurements. The typical input losses on this EV kit are 0.3dB. For more information on how to perform this level of noise-figure measurement, refer to the noise-figure meter operating manual as well as the Agilent Technologies (formerly Hewlett Packard) appli-cation note #57-2, “Noise Figure Measurement Accuracy.”Layout ConsiderationsA good PC board layout is an essential part of an RF circuit design. The EV kit PC board can serve as a guide for laying out a board using the MAX2644.Generally, the V CC node on the PC board should have a decoupling capacitor located close to the device,and additional capacitors may be needed for long V CC lines. This minimizes supply coupling. Proper ground-ing of the GND pins is essential. Connect the GND pins to the ground plane either directly or through vias or both.E v a l u a t e s : M A X 2644MAX2644 Evaluation Kit 2_______________________________________________________________________________________Figure 1. MAX2644 EV Kit SchematicEvaluates: MAX2644Maxim cannot assume responsib ility for use of any circuitry other than circuitry entirely emb odied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600____________________3©2001 Maxim Integrated ProductsPrinted USAis a registered trademark of Maxim Integrated Products.MAX2644 Evaluation KitFigure 2. MAX2644 EV Kit Component Placement Guide—Component SideFigure 3. MAX2644 EV Kit PC Board Layout—Component SideFigure 4. MAX2644 EV Kit PC Board Layout—Solder SideFigure 5. MAX2644 EV Kit PC Board Layout—Ground PlaneLayers 2 and 3。

T-MAX G D S TO-264 B2FLL LFLL 产品说明书

050-7062 R e v D 6-2006MAXIMUM RATINGSAll Ratings: TC = 25°C unless otherwise specified.CAUTION: These Devices are Sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed.•Lower Input Capacitance •Increased Power Dissipation •Lower Miller Capacitance •Easier To Drive•Lower Gate Charge, QgCharacteristic / Test ConditionsDrain-Source Breakdown Voltage (V GS = 0V, I D = 250µA)Drain-Source On-State Resistance 2 (V GS = 10V, I D = 27A)Zero Gate Voltage Drain Current (V DS = 600V, V GS = 0V)Zero Gate Voltage Drain Current (V DS = 480V, V GS = 0V, T C = 125°C)Gate-Source Leakage Current (V GS = ±30V, V DS = 0V)Gate Threshold Voltage (V DS = V GS , I D = 2.5mA)Symbol V DSS I D I DM V GS V GSM P D T J ,T STGT L I AR E AR E ASParameterDrain-Source VoltageContinuous Drain Current @ T C = 25°C Pulsed Drain Current1Gate-Source Voltage Continuous Gate-Source Voltage Transient Total Power Dissipation @ T C = 25°C Linear Derating FactorOperating and Storage Junction Temperature Range Lead Temperature: 0.063" from Case for 10 Sec.Avalanche Current 1 (Repetitive and Non-Repetitive)Repetitive Avalanche Energy 1Single Pulse Avalanche Energy4UNIT Volts AmpsVolts Watts W/°C °C Amps mJSTATIC ELECTRICAL CHARACTERISTICSSymbol BV DSS R DS(on)I DSS I GSS V GS(th)UNIT VoltsOhms µA nA VoltsMINTYPMAX6000.100100500±10035APT6010B2_LFLL60054216±30±406905.52-55 to 15030054503000APT6010B2FLL APT6010LFLL APT6010B2FLL*APT6010LFLLG**G Denotes RoHS Compliant, Pb Free Terminal Finish.600V 54A 0.100ΩMicrosemi Website - 050-7062 R e v D 6-2006DYNAMIC CHARACTERISTICSAPT6010B2_LFLLZ θJ C , T H E R M A L I M P E D A N C E (°C /W )RECTANGULAR PULSE DURATION (SECONDS)FIGURE 1, MAXIMUM EFFECTIVE TRANSIENT THERMAL IMPEDANCE, JUNCTION-TO-CASE vs PULSE DURATION0.200.160.120.080.04SOURCE-DRAIN DIODE RATINGS AND CHARACTERISTICSTHERMAL CHARACTERISTICSCharacteristic / Test Conditions Continuous Source Current (Body Diode)Pulsed Source Current 1 (Body Diode)Diode Forward Voltage 2 (V GS = 0V, I S = -54A)Peak Diode Recovery dv /dt 5Reverse Recovery Time (I S = -54A, di /dt = 100A/µs)Reverse Recovery Charge (I S = -54A, di /dt = 100A/µs)Peak Recovery Current (I S = -54A, di /dt = 100A/µs)Symbol I S I SM V SDdv /dtt rr Q rr I RRMUNIT Amps Volts V/ns ns µC AmpsMINTYPMAX542161.315T j = 25°C 300T j = 125°C 600T j = 25°C 2.7T j = 125°C 7.8T j = 25°C 14T j = 125°C20Symbol R θJC R θJAMINTYPMAX0.1840UNIT °C/WCharacteristic Junction to Case Junction to AmbientSymbol C iss C oss C rss Q g Q gs Q gd t d(on)t r t d(off)t f E on E off E on E off Characteristic Input Capacitance Output CapacitanceReverse Transfer Capacitance Total Gate Charge 3Gate-Source Charge Gate-Drain ("Miller") Charge Turn-on Delay Time Rise TimeTurn-off Delay Time Fall TimeTurn-on Switching Energy 6Turn-off Switching Energy Turn-on Switching Energy 6Turn-off Switching Energy Test ConditionsV GS = 0VV DS = 25V f = 1 MHz V GS = 10VV DD = 300VI D = 54A @ 25°C RESISTIVE SWITCHINGV GS = 15VV DD = 300V I D = 54A@ 25°CR G = 0.6ΩINDUCTIVE SWITCHING @ 25°CV DD = 400V, V GS = 15V I D = 54A, R G = 5ΩINDUCTIVE SWITCHING @ 125°CV DD = 400V V GS = 15V I D = 54A, R G = 5ΩMIN TYP MAX 67101250901503075121934988597011501220UNIT pFnCnsµJ1Repetitive Rating: Pulse width limited by maximum junction temperature2Pulse Test: Pulse width < 380 µs, Duty Cycle < 2%3See MIL-STD-750 Method 34714Starting T j = +25°C, L = 2.06mH, R G = 25Ω, Peak I L = 54A5dv /dt numbers reflect the limitations of the test circuit rather than the device itself. I S ≤ -I D 54A di /dt ≤ 700A/µsV R ≤ 600VT J ≤ 150°C 6Eon includes diode reverse recovery. See figures 18, 20.050-7062 R e v D 6-2006Typical Performance CurvesAPT6010B2FLL_LFLLR D S (O N ), D R A I N -T O -S O U R C E O N R E S I S T A N C E I D , D R A I N C U R R E N T (A M P E R E S )I D , D R A I N C U R R E N T (A M P E R E S )(N O R M A L I Z E D )V G S (T H ), T H R E S H O L D V O L T A G E B V D S S , D R A I N -T O -S O U R C E B R E A K D O W N R D S (O N ), D R A I N -T O -S O U R C E O N R E S I S T A N C EI D , D R A I N C U R R E N T (A M P E R E S )(N O R M A L I Z E D )V O L T A G E (N O R M A L I Z E D )255075100125150-50-250255075100125150-50-2502550751001251501401201008060402001.401.301.201.101.000.900.801.151.101.051.000.950.901.21.11.00.90.80.70.6160140120100806040200605030201002.52.01.51.00.50.0V DS , DRAIN-TO-SOURCE VOLTAGE (VOLTS)FIGURE 2, TRANSIENT THERMAL IMPEDANCE MODEL FIGURE 3, LOW VOLTAGE OUTPUT CHARACTERISTICS V GS , GATE-TO-SOURCE VOLTAGE (VOLTS)I D , DRAIN CURRENT (AMPERES)FIGURE 4, TRANSFER CHARACTERISTICSFIGURE 5, R DS (ON) vs DRAIN CURRENTT C , CASE TEMPERATURE (°C)T J , JUNCTION TEMPERATURE (°C)FIGURE 6, MAXIMUM DRAIN CURRENT vs CASE TEMPERATUREFIGURE 7, BREAKDOWN VOLTAGE vs TEMPERATURE T J , JUNCTION TEMPERATURE (°C)T C , CASE TEMPERATURE (°C)FIGURE 8, ON-RESISTANCE vs. TEMPERATURE FIGURE 9, THRESHOLD VOLTAGE vs TEMPERATUREDissipated Power(Watts)sink to ambient, etc. Set to zero when modeling only the case to junction.050-7062 R e v D 6-2006APT6010B2FLL_LFLLV DS , DRAIN-TO-SOURCE VOLTAGE (VOLTS)V DS , DRAIN-TO-SOURCE VOLTAGE (VOLTS)FIGURE 10, MAXIMUM SAFE OPERATING AREAFIGURE 11, CAPACITANCE vs DRAIN-TO-SOURCE VOLTAGEQ g , TOTAL GATE CHARGE (nC)V SD , SOURCE-TO-DRAIN VOLTAGE (VOLTS)FIGURE 12, GATE CHARGES vs GATE-TO-SOURCE VOLTAGEFIGURE 13, SOURCE-DRAIN DIODE FORWARD VOLTAGE V G S , G A T E -T O -S O U R C E V O L T A G E (V O L T S )I D , D R A I N C U R R E N T (A M P E R E S )I D R , R E V E R S E D R A I N C U R R E N T (A M P E R E S )C , C A P A C I T A N C E (p F )220100101161284I D (A)I D (A)FIGURE 14, DELAY TIMES vs CURRENTFIGURE 15, RISE AND FALL TIMES vs CURRENT I D (A)R G , GATE RESISTANCE (Ohms)FIGURE 16, SWITCHING ENERGY vs CURRENTFIGURE 17, SWITCHING ENERGY VS. GATE RESISTANCEE o n a n d E o f f (µJ )t d (o n ) a n d t d (o f f ) (n s )S W I T C H I N G E N E R G Y (µJ )t r a n d t f (n s )050-7062 R e v D 6-2006APT6010B2_LFLLThese dimensions are equal to the TO-247 without the mounting hole.Dimensions in Millimeters and (Inches)Dimensions in Millimeters and (Inches)T-MAX TM (B2) Package OutlineTO-264 (L) Package OutlineMicrosemi’s products are covered by one or more of U.S.patents 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522 5,262,336 6,503,7865,256,583 4,748,103 5,283,202 5,231,474 5,434,095 5,528,058 and foreign patents. US and Foreign patents pending. All Rights Reserved.Figure 18, Turn-on Switching Waveforms and Definitions Figure 19, Turn-off Switching Waveforms and DefinitionsDrain CurrentDrain VoltageGate VoltageT J125°C Switching Energy10%t d(on)90%5%t r5%10%Switching EnergyDrain CurrentDrain VoltageGate VoltageT J 125°C10%0t d(off)90%t f90%I D V DSV DD APT30DF60e1SAC: Tin, Silver, Coppere1SAC: Tin, Silver, Copper。

1、下载文档前请自行甄别文档内容的完整性，平台不提供额外的编辑、内容补充、找答案等附加服务。
2、"仅部分预览"的文档,不可在线预览部分如存在完整性等问题,可反馈申请退款(可完整预览的文档不适用该条件!)。
3、如文档侵犯您的权益，请联系客服反馈,我们会尽快为您处理(人工客服工作时间：9:00-18:30)。

元器件交易网
2.4GHz SiGe, High IP3 Low-Noise Amplifier MAX2644
Typical Operating Characteristics
(PRFIN = -30dBm, ZS = ZL = 50Ω, VCC = +3.0V, fRFIN = 2450MHz, RBIAS = 1.2kΩ, TA = +25°C, unless otherwise noted.)
PARAMETER Supply Voltage RBIAS = 3.9kΩ Operating Supply Current RBIAS = 1.2kΩ, TA = +25°C RBIAS = 1.2kΩ, TA = -40°C to +85°C RBIAS = 750Ω Standby Supply Current RBIAS is unconnected, TA = +25°C, VCC = 3.3V 10.2 100 µA CONDITIONS MIN 2.7 2.7 7.0 9.7 11.0 mA TYP MAX 5.5 UNITS V
AC ELECTRICAL CHARACTERISTICS
(MAX2644 EV kit, VCC = +3.0V, fRFIN = 2450MHz, PRFIN = -30dBm, input and output are terminated to 50Ω, RBIAS = 1.2kΩ, TA = +25°C, unless otherwise noted.) (Note 2)
元器件交易网
19-1786; Rev 1; 11/03
KIT ATION EVALU E L B A AVAIL
2.4GHz SiGe, High IP3 Low-Noise Amplifier
General Description Features
o Low Noise Figure (2.0dB at 2450MHz) o High Gain: 16dB o Adjustable IP3 and Bias Current o Low-Power Standby Mode o On-Chip Output Matching o +2.7V to +5.5V Single-Supply Operation o Ultra-Small 6-Pin SC70 Package
SUPPLY CURRENT vs. SUPPLY VOLTAGE
Note 1: Devices are production tested at TA = +25°C. Minimum and maximum values are guaranteed by design and characterization over temperature and supply voltages. Note 2: Min/Max limits are guaranteed by design and characterization. Note 3: The part has been characterized at the specified frequency range. Operation outside this range is possible but not guaranteed. Note 4: Excluding PC board losses (0.3dB at the input and 0.3dB at the output of the MAX2644 EV kit). Note 5: Measured with two input tones (f1 = 2445MHz, f2 = 2455MHz) both at -30dBm per tone. Input IP3 can be improved to +1dBm with circuit shown in Figure 2. Note 6: Excluding PC board losses (0.3dB typical at the input of the MAX2644 EV kit). 2 _________________________________________________________________________________Applications
Bluetooth 802.11 WLAN Home RF Satellite CD Radio 2.4GHz ISM Band Radios 2.4GHz Cordless Phones Wireless Local Loop (WLL)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
1
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at 1-888-629-4642, or visit Maxim’s website at .
MAX2644EXT-T PART
Ordering Information
TEMP RANGE -40°C to +85°C PINPACKAGE 6 SC70 TOP MARK AAG
Typical Operating Circuit
RBIAS 1.2kΩ VCC BIAS BIAS VCC
Pin Configuration
元器件交易网
2.4GHz SiGe, High IP3 Low-Noise Amplifier MAX2644
ABSOLUTE MAXIMUM RATINGS
VCC to GND ..............................................................-0.3V to +6V RFIN, RFOUT to GND…......................................................±0.3V RFIN Power (50Ω source) ................................................+5dBm BIAS to GND ................................................................0 to +0.3V Operating Temperature Range ...........................-40°C to +85°C Maximum Junction Temperature .....................................+150°C Continuous Power Dissipation (TA = +70°C) 6-Pin SC70 (derate 3.1mW/°C above +70°C) ..............245mW Storage Temperature.........................................-65°C to +150°C Lead Temperature (soldering, 10s) .................................+300°C
DC ELECTRICAL CHARACTERISTICS
(VCC = +2.7V to +5.5V, RBIAS = 1.2kΩ, no RF signal applied, RFIN and RFOUT are AC-coupled and terminated to 50Ω, TA = -40°C to +85°C. Typical values are at VCC = +3.0V, TA = +25 °C, unless otherwise noted.) (Note 1)
MAX2644
The MAX2644 low-cost, high third-order intercept point (IP3) low-noise amplifier (LNA) is designed for applications in 2.4GHz WLAN, ISM, and Bluetooth radio systems. It features a programmable bias, allowing the input IP3 and supply current to be optimized for specific applications. The LNA provides up to +1dBm input IP3 while maintaining a low noise figure of 2.0dB and a typical gain of 16dB. The MAX2644 is designed on a low-noise, advanced silicon-germanium (SiGe) technology. It operates with a +2.7V to +5.5V single supply and is available in an ultra-small 6-pin SC70 package.