CY7C1412AV18中文资料
EP1C12F144C7中文资料(Altera)中文数据手册「EasyDatasheet - 矽搜」
EP1C6
5,980 20
92,160 2
185
EP1C12
12,060 52
239,616 2
249
EP1C20 20,060
64 294,912
2 301
1
芯片中文手册,看全文,戳
气旋 FPGA系列数据手册
初稿信息
Cyclone器件在四方扁平封装(QFP),并提供节省空间
FineLine BGA 包(见
Cyclone器件提供一个全局时钟网络和多达两个PLL.全局时钟网络由八 个全局时钟线驱动整个器件.全局时钟网络可以为设备内所有资源 ,如IOEs,LE和存储器块提供时钟.
全局时钟线也可用于控制信号.旋风PLL提供通用与时钟倍频和移相,以 及外部输出高速差分I / O支持时钟.
图1
示出旋风EP1C12装置图.
M4K RAM块与4K位内存加上平价(4,608位)真正双端口存储器 块.这些块宽高达200 MHz提供专用真正双端口,简单双端口或单端 口内存最高可达36位.这些块加在器件分成列在一定LAB之间. Cyclone器件提供嵌入式RAM 60至288千位之间.
每个Cyclone器件I / O引脚由I / O单元(IOE)位于输送 围绕装置外周端部LAB行和列. I / O 引脚支持各种单端和差分I / O标准,如 66 MHz32位PCI标准,并在到LVDS I / O标准 311 Mbps.每个IOE包含一个双向I / O缓冲区和三个寄存器 用于登记输入,输出和输出使能信号.两用 DQS,DQ和DM引脚以及延时链(用于相位对齐DDR 信号)提供与外部存储器设备,诸如接口支持 DDR SDRAM和高达133兆赫(266 Mbps)FCRAM器件.
配置设备配置Cyclone器件.
C系列斜齿轮减速机
C系列斜齿轮减速机
产品简介
斜齿轮减速机,具有体积小,传递扭矩大、效率高、工作平稳、寿命长,所配电机功率范围广,传动比分级精细等特点,该样本中只列出了4极Y系列电机直联的参数和外形安装尺寸,若需要低于该样本中所列的输出转速,我们会给您提供配6极、8极电机的直联产品,或级成两级斜齿轮减速机,达到更大的速比。
请与生产厂家咨询。
C系列斜齿轮减速机安装型式
产品代号
C
C系列斜齿轮减速机选型表(0.25kW)
C系列斜齿轮减速机选型表(0.37kW)
C系列斜齿轮减速机选型表(0.55kW)
C系列斜齿轮减速机选型表(0.75kW)
C系列斜齿轮减速机选型表(1.1kW)
C系列斜齿轮减速机选型表(1.5kW)
C系列斜齿轮减速机选型表(2.2kW)
C系列斜齿轮减速机选型表(3kW)
C系列斜齿轮减速机选型表(4kW)
C系列斜齿轮减速机选型表(5.5kW)
C系列斜齿轮减速机选型表(7.5kW)
C系列斜齿轮减速机选型表(11kW)
C系列斜齿轮减速机选型表(15kW)
C系列斜齿轮减速机选型表(18.5kW)
Y系列4极电机尺寸表
C底脚安装斜齿轮减速机安装尺寸
CF法兰安装斜齿轮减速机安装尺寸。
CY7C68013A中文资料
EZ-USB FX2LP™ USB MicrocontrollerCY7C68013A/CY7C68014A CY7C68015A/CY7C68016A1.0Features (CY7C68013A/14A/15A/16A)•USB 2.0–USB-IF high speed certified (TID # 40440111)•Single-chip integrated USB 2.0 transceiver, smart SIE, and enhanced 8051 microprocessor•Fit, form and function compatible with the FX2—Pin-compatible—Object-code-compatible—Functionally-compatible (FX2LP is a superset)•Ultra Low power: I CC no more than 85 mA in any mode —Ideal for bus and battery powered applications •Software: 8051 code runs from:—Internal RAM, which is downloaded via USB —Internal RAM, which is loaded from EEPROM —External memory device (128 pin package)•16 KBytes of on-chip Code/Data RAM•Four programmable BULK/INTERRUPT/ISOCHRO-NOUS endpoints—Buffering options: double, triple, and quad•Additional programmable (BULK/INTERRUPT) 64-byte endpoint•8- or 16-bit external data interface •Smart Media Standard ECC generation •GPIF (General Programmable Interface)—Allows direct connection to most parallel interface—Programmable waveform descriptors and configu-ration registers to define waveforms—Supports multiple Ready (RDY) inputs and Control (CTL) outputs•Integrated, industry-standard enhanced 8051—48-MHz, 24-MHz, or 12-MHz CPU operation —Four clocks per instruction cycle —Two USARTS—Three counter/timers—Expanded interrupt system —Two data pointers•3.3V operation with 5V tolerant inputs•Vectored USB interrupts and GPIF/FIFO interrupts •Separate data buffers for the Set-up and Data portions of a CONTROL transfer•Integrated I 2C controller, runs at 100 or 400 kHz •Four integrated FIFOs—Integrated glue logic and FIFOs lower system cost —Automatic conversion to and from 16-bit buses —Master or slave operation—Uses external clock or asynchronous strobes —Easy interface to ASIC and DSP ICs•Available in Commercial and Industrial temperature grade (all packages except VFBGA)A d d r e s s (16)x20PLL/0.5/1.0/2.08051 Core 12/24/48 MHz,four clocks/cycleI 2CVCC1.5kD+D–A d d r e s s (16) / D a t aB u s (8)FX2LPGPIFCY Smart USB 1.1/2.0EngineUSB 2.0XCVR16 KB RAM4 kB FIFOIntegrated full- and high-speedXCVRAdditional I/Os (24)ADDR (9)CTL (6)RDY (6)8/16D a t a (8)24 MHz Ext. XTALEnhanced USB core Simplifies 8051 code “Soft Configuration”Easy firmware changes FIFO and endpoint memory (master or slave operation)Up to 96 MBytes/s burst rateGeneralprogrammable I/F to ASIC/DSP or bus standards such as ATAPI, EPP , etc.Abundant I/Oincluding two USARTS High-performance micro using standard toolswith lower-power optionsMasterFigure 1-1. Block Diagramconnected for full speedECC1.1Features (CY7C68013A/14A only)•CY7C68014A: Ideal for battery powered applications —Suspend current: 100 µA (typ)•CY7C68013A: Ideal for non-battery powered applica-tions—Suspend current: 300 µA (typ)•Available in five lead-free packages with up to 40 GPIOs —128-pin TQFP (40 GPIOs), 100-pin TQFP (40 GPIOs),56-pin QFN (24 GPIOs), 56-pin SSOP (24 GPIOs), and 56-pin VFBGA (24 GPIOs)1.2Features (CY7C68015A/16A only)•CY7C68016A: Ideal for battery powered applications—Suspend current: 100 µA (typ)•CY7C68015A: Ideal for non-battery powered applica-tions—Suspend current: 300 µA (typ)•Available in lead-free 56-pin QFN package (26 GPIOs)—2 more GPIOs than CY7C68013A/14A enabling addi-tional features in same footprintCypress Semiconductor Corporation’s (Cypress’s) EZ-USB FX2LP™ (CY7C68013A/14A) is a low-power version of the EZ-USB FX2™ (CY7C68013), which is a highly integrated, low-power USB 2.0 microcontroller. By integrating the USB 2.0 transceiver, serial interface engine (SIE), enhanced 8051 microcontroller, and a programmable peripheral interface in a single chip, Cypress has created a very cost-effective solution that provides superior time-to-market advantages with low power to enable bus powered applications.The ingenious architecture of FX2LP results in data transfer rates of over 53 Mbytes per second, the maximum-allowable USB 2.0 bandwidth, while still using a low-cost 8051 microcon-troller in a package as small as a 56 VFBGA (5mm x 5mm). Because it incorporates the USB 2.0 transceiver, the FX2LP is more economical, providing a smaller footprint solution than USB 2.0 SIE or external transceiver implementations. With EZ-USB FX2LP, the Cypress Smart SIE handles most of the USB 1.1 and 2.0 protocol in hardware, freeing the embedded microcontroller for application-specific functions and decreasing development time to ensure USB compatibility. The General Programmable Interface (GPIF) and Master/Slave Endpoint FIFO (8- or 16-bit data bus) provides an easy and glueless interface to popular interfaces such as ATA, UTOPIA, EPP, PCMCIA, and most DSP/processors. The FX2LP draws considerably less current than the FX2 (CY7C68013), has double the on-chip code/data RAM and is fit, form and function compatible with the 56-, 100-, and 128-pin FX2.Five packages are defined for the family: 56VFBGA, 56 SSOP, 56 QFN, 100 TQFP, and 128 TQFP.2.0 Applications•Portable video recorder•MPEG/TV conversion•DSL modems•ATA interface•Memory card readers•Legacy conversion devices•Cameras•Scanners•Home PNA•Wireless LAN•MP3 players•NetworkingThe “Reference Designs” section of the Cypress web site provides additional tools for typical USB 2.0 applications. Each reference design comes complete with firmware source and object code, schematics, and documentation. Please visit for more information.3.0Functional Overview3.1USB Signaling SpeedFX2LP operates at two of the three rates defined in the USB Specification Revision 2.0, dated April 27, 2000:•Full speed, with a signaling bit rate of 12 Mbps •High speed, with a signaling bit rate of 480 Mbps.FX2LP does not support the low-speed signaling mode of 1.5Mbps.3.28051 MicroprocessorThe 8051 microprocessor embedded in the FX2LP family has 256 bytes of register RAM, an expanded interrupt system,three timer/counters, and two USARTs.3.2.18051 Clock FrequencyFX2LP has an on-chip oscillator circuit that uses an external 24-MHz (±100-ppm) crystal with the following characteristics:•Parallel resonant •Fundamental mode •500-µW drive level•12-pF (5% tolerance) load capacitors.An on-chip PLL multiplies the 24-MHz oscillator up to 480MHz, as required by the transceiver/PHY , and internal counters divide it down for use as the 8051 clock. The default 8051 clock frequency is 12 MHz. The clock frequency of the 8051 can be changed by the 8051 through the CPUCS register, dynamically.The CLKOUT pin, which can be three-stated and inverted using internal control bits, outputs the 50% duty cycle 8051clock, at the selected 8051 clock frequency—48, 24, or 12MHz.3.2.2USARTSFX2LP contains two standard 8051 USARTs, addressed via Special Function Register (SFR) bits. The USART interface pins are available on separate I/O pins, and are not multi-plexed with port pins.UART0 and UART1 can operate using an internal clock at 230KBaud with no more than 1% baud rate error. 230-KBaud operation is achieved by an internally derived clock source that generates overflow pulses at the appropriate time. The internal clock adjusts for the 8051 clock rate (48, 24, 12 MHz)such that it always presents the correct frequency for 230-KBaud operation.[1]3.2.3Special Function RegistersCertain 8051 SFR addresses are populated to provide fast access to critical FX2LP functions. These SFR additions are shown in Table 3-1. Bold type indicates non-standard,enhanced 8051 registers. The two SFR rows that end with “0”and “8” contain bit-addressable registers. The four I/O ports A–D use the SFR addresses used in the standard 8051 for ports 0–3, which are not implemented in FX2LP . Because of the faster and more efficient SFR addressing, the FX2LP I/O ports are not addressable in external RAM space (using the MOVX instruction).3.3I 2C BusFX2LP supports the I 2C bus as a master only at 100-/400-KHz.SCL and SDA pins have open-drain outputs and hysteresis inputs. These signals must be pulled up to 3.3V, even if no I 2C device is connected.3.4BusesAll packages: 8- or 16-bit “FIFO” bidirectional data bus, multi-plexed on I/O ports B and D. 128-pin package: adds 16-bit output-only 8051 address bus, 8-bit bidirectional data bus.Figure 3-1. Crystal Configuration12 pf12 pf24 MHz20 × PLLC1C212-pF capacitor values assumes a trace capacitanceof 3 pF per side on a four-layer FR4 PCANote:1.115-KBaud operation is also possible by programming the 8051 SMOD0 or SMOD1 bits to a “1” for UART0 and/or UART1, respectively.3.5USB Boot MethodsDuring the power-up sequence, internal logic checks the I2C port for the connection of an EEPROM whose first byte is either 0xC0 or 0xC2. If found, it uses the VID/PID/DID values in the EEPROM in place of the internally stored values (0xC0), or it boot-loads the EEPROM contents into internal RAM (0xC2). If no EEPROM is detected, FX2LP enumerates using internally stored descriptors. The default ID values for FX2LP are VID/PID/DID (0x04B4, 0x8613, 0xAxxx where xxx = Chip revision).[2]3.6ReNumeration™Because the FX2LP’s configuration is soft, one chip can take on the identities of multiple distinct USB devices.When first plugged into USB, the FX2LP enumerates automat-ically and downloads firmware and USB descriptor tables over the USB cable. Next, the FX2LP enumerates again, this time as a device defined by the downloaded information. This patented two-step process, called ReNumeration™, happens instantly when the device is plugged in, with no hint that the initial download step has occurred.Two control bits in the USBCS (USB Control and Status) register control the ReNumeration process: DISCON and RENUM. To simulate a USB disconnect, the firmware sets DISCON to 1. To reconnect, the firmware clears DISCON to 0. Before reconnecting, the firmware sets or clears the RENUM bit to indicate whether the firmware or the Default USB Device will handle device requests over endpoint zero: if RENUM = 0, the Default USB Device will handle device requests; if RENUM = 1, the firmware will.3.7Bus-powered ApplicationsThe FX2LP fully supports bus-powered designs by enumer-ating with less than 100 mA as required by the USB 2.0 speci-fication.3.8Interrupt System3.8.1INT2 Interrupt Request and Enable RegistersFX2LP implements an autovector feature for INT2 and INT4. There are 27 INT2 (USB) vectors, and 14 INT4 (FIFO/GPIF) vectors. See EZ-USB Technical Reference Manual (TRM) for more details.3.8.2USB-Interrupt AutovectorsThe main USB interrupt is shared by 27 interrupt sources. To save the code and processing time that normally would be required to identify the individual USB interrupt source, the FX2LP provides a second level of interrupt vectoring, called Autovectoring. When a USB interrupt is asserted, the FX2LP pushes the program counter onto its stack then jumps to address 0x0043, where it expects to find a “jump” instruction to the USB Interrupt service routine.Table 3-1. Special Function Registersx8x9x Ax Bx Cx Dx Ex Fx 0IOA IOB IOC IOD SCON1PSW ACC B 1SP EXIF INT2CLR IOE SBUF12DPL0MPAGE INT4CLR OEA3DPH0OEB4DPL1OEC5DPH1OED6DPS OEE7PCON8TCON SCON0IE IP T2CON EICON EIE EIP 9TMOD SBUF0A TL0AUTOPTRH1EP2468STAT EP01STAT RCAP2LB TL1AUTOPTRL1EP24FIFOFLGS GPIFTRIG RCAP2HC TH0reserved EP68FIFOFLGS TL2D TH1AUTOPTRH2GPIFSGLDATH TH2E CKCON AUTOPTRL2GPIFSGLDATLXF reserved AUTOPTRSET-UP GPIFSGLDATLNOXTable 3-2. Default ID Values for FX2LPDefault VID/PID/DIDVendor ID0x04B4Cypress SemiconductorProduct ID0x8613EZ-USB FX2LPDevice release0xAnnn Depends on chip revision(nnn = chip revision where firstsilicon = 001)Note:2.The I2C bus SCL and SDA pins must be pulled up, even if an EEPROM is not connected. Otherwise this detection method does not work properly.The FX2LP jump instruction is encoded as follows.If Autovectoring is enabled (AV2EN = 1 in the INTSET-UP register), the FX2LP substitutes its INT2VEC byte. Therefore, if the high byte (“page”) of a jump-table address is preloaded at location 0x0044, the automatically-inserted INT2VEC byte at 0x0045 will direct the jump to the correct address out of the 27 addresses within the page.3.8.3FIFO/GPIF Interrupt (INT4)Just as the USB Interrupt is shared among 27 individual USB-interrupt sources, the FIFO/GPIF interrupt is shared among 14 individual FIFO/GPIF sources. The FIFO/GPIF Interrupt, like the USB Interrupt, can employ autovectoring. Table3-4 shows the priority and INT4VEC values for the 14 FIFO/GPIF interrupt sources.Table 3-3. INT2 USB InterruptsUSB INTERRUPT TABLE FOR INT2 Priority INT2VEC Value Source Notes1 00SUDAV Set-up Data Available2 04 SOF Start of Frame (or microframe)3 08SUTOK Set-up Token Received4 0C SUSPEND USB Suspend request5 10USB RESET Bus reset6 14HISPEED Enteredhigh speed operation7 18 EP0ACK FX2LP ACK’d the CONTROL Handshake8 1C reserved9 20 EP0-IN EP0-IN ready to be loaded with data10 24 EP0-OUT EP0-OUT has USB data11 28 EP1-IN EP1-IN ready to be loaded with data12 2C EP1-OUT EP1-OUT has USB data13 30 EP2 IN: buffer available. OUT: buffer has data14 34 EP4 IN: buffer available. OUT: buffer has data15 38 EP6 IN: buffer available. OUT: buffer has data16 3C EP8 IN: buffer available. OUT: buffer has data17 40 IBN IN-Bulk-NAK (any IN endpoint)18 44reserved19 48 EP0PING EP0 OUT was Pinged and it NAK’d20 4C EP1PING EP1 OUT was Pinged and it NAK’d21 50 EP2PING EP2 OUT was Pinged and it NAK’d22 54 EP4PING EP4 OUT was Pinged and it NAK’d23 58 EP6PING EP6 OUT was Pinged and it NAK’d24 5C EP8PING EP8 OUT was Pinged and it NAK’d25 60 ERRLIMIT Bus errors exceeded the programmed limit26 6427 68 reserved28 6C reserved29 70 EP2ISOERR ISO EP2 OUT PID sequence error30 74 EP4ISOERR ISO EP4 OUT PID sequence error31 78 EP6ISOERR ISO EP6 OUT PID sequence error32 7C EP8ISOERR ISO EP8 OUT PID sequence errorIf Autovectoring is enabled (AV4EN = 1 in the INTSET-UP register), the FX 2LP substitutes its INT4VEC byte. Therefore, if the high byte (“page”) of a jump-table address is preloaded at location 0x0054, the automatically-inserted INT4VEC byte at 0x0055 will direct the jump to the correct address out of the 14 addresses within the page. When the ISR occurs, the FX2LP pushes the program counter onto its stack then jumps to address 0x0053, where it expects to find a “jump” instruction to the ISR Interrupt service routine.3.9Reset and Wakeup3.9.1Reset PinThe input pin, RESET#, will reset the FX2LP when asserted. This pin has hysteresis and is active LOW. When a crystal is used with the CY7C680xxA the reset period must allow for the stabilization of the crystal and the PLL. This reset period should be approximately 5 ms after VCC has reached 3.0V. If the crystal input pin is driven by a clock signal the internal PLL stabilizes in 200 µs after VCC has reached 3.0V[3]. Figure3-2 shows a power-on reset condition and a reset applied during operation. A power-on reset is defined as the time reset is asserted while power is being applied to the circuit. A powered reset is defined to be when the FX2LP has previously been powered on and operating and the RESET# pin is asserted. Cypress provides an application note which describes and recommends power on reset implementation and can be found on the Cypress web site. For more information on reset imple-mentation for the FX2 family of products visit the .Table 3-4. Individual FIFO/GPIF Interrupt SourcesPriority INT4VEC Value Source Notes 180EP2PF Endpoint 2 Programmable Flag2 84 EP4PF Endpoint 4 Programmable Flag388EP6PF Endpoint 6 Programmable Flag48C EP8PF Endpoint 8 Programmable Flag590EP2EF Endpoint 2 Empty Flag694EP4EF Endpoint 4 Empty Flag798EP6EF Endpoint 6 Empty Flag89C EP8EF Endpoint 8 Empty Flag9A0 EP2FF Endpoint 2 Full Flag10A4EP4FF Endpoint 4 Full Flag11 A8EP6FF Endpoint 6 Full Flag12AC EP8FF Endpoint 8 Full Flag13 B0GPIFDONE GPIF Operation Complete14 B4GPIFWF GPIF WaveformNote:3.If the external clock is powered at the same time as the CY7C680xxA and has a stabilization wait period, it must be added to the 200 µs.3.9.2Wakeup PinsThe 8051 puts itself and the rest of the chip into a power-down mode by setting PCON.0 = 1. This stops the oscillator and PLL. When WAKEUP is asserted by external logic, the oscil-lator restarts, after the PLL stabilizes, and then the 8051receives a wakeup interrupt. This applies whether or not FX2LP is connected to the USB.The FX2LP exits the power-down (USB suspend) state using one of the following methods:•USB bus activity (if D+/D– lines are left floating, noise on these lines may indicate activity to the FX2LP and initiate a wakeup).•External logic asserts the WAKEUP pin •External logic asserts the PA3/WU2 pin.The second wakeup pin, WU2, can also be configured as a general purpose I/O pin. This allows a simple external R-C network to be used as a periodic wakeup source. Note that WAKEUP is by default active LOW.3.10Program/Data RAM3.10.1SizeThe FX2LP has 16 KBytes of internal program/data RAM,where PSEN#/RD# signals are internally ORed to allow the 8051 to access it as both program and data memory. No USB control registers appear in this space.Two memory maps are shown in the following diagrams:Figure 3-3 Internal Code Memory, EA = 0Figure 3-4 External Code Memory, EA = 1.3.10.2Internal Code Memory, EA = 0This mode implements the internal 16-KByte block of RAM (starting at 0) as combined code and data memory. When external RAM or ROM is added, the external read and write strobes are suppressed for memory spaces that exist inside the chip. This allows the user to connect a 64-KByte memory without requiring address decodes to keep clear of internal memory spaces.Only the internal 16 KBytes and scratch pad 0.5 KBytes RAM spaces have the following access:•USB download •USB upload •Set-up data pointer •I 2C interface boot load.3.10.3External Code Memory, EA = 1The bottom 16 KBytes of program memory is external, and therefore the bottom 16 KBytes of internal RAM is accessible only as data memory.Figure 3-2. Reset Timing PlotsV IL 0V3.3V 3.0VT RESETVCCRESET#Power on ResetT RESETVCCRESET#V IL Powered Reset3.3V0VTable 3-5. Reset Timing ValuesConditionT RESET Power-on Reset with crystal 5 msPower-on Reset with external clock200 µs + Clock stability timePowered Reset 200 µsFigure 3-3. Internal Code Memory, EA = 0Inside FX2LPOutside FX2LP7.5 KBytes USB regs and 4K FIFO buffers (RD#,WR#)0.5 KBytes RAM Data (RD#,WR#)*(OK to populate data memory here—RD#/WR#strobes are not active)40 KBytes External Data Memory (RD#,WR#)(Ok to populate data memory here—RD#/WR#strobes are not active)16 KBytes RAM Code and Data(PSEN#,RD#,WR#)*48 KBytes External Code Memory (PSEN#)(OK to populate programmemory here—PSEN# strobe is not active)*SUDPTR, USB upload/download, I 2C interface boot accessFFFFE200E1FF E0003FFF0000DataCodeFigure 3-4. External Code Memory, EA = 1Inside FX2LPOutside FX2LP7.5 KBytes USB regs and 4K FIFO buffers (RD#,WR#)0.5 KBytes RAM Data (RD#,WR#)*(OK to populatedata memory here—RD#/WR#strobes are not active)40 KBytes External Data Memory (RD#,WR#)(Ok to populate data memory here—RD#/WR#strobes are not active)16 KBytes RAM Data(RD#,WR#)*64 KBytes External Code Memory (PSEN#)*SUDPTR, USB upload/download, I 2C interface boot accessFFFFE200E1FFE0003FFF0000DataCode3.11Register Addresses3.12Endpoint RAM3.12.1Size•3× 64 bytes (Endpoints 0 and 1)•8 × 512 bytes (Endpoints 2, 4, 6, 8)3.12.2Organization•EP0•Bidirectional endpoint zero, 64-byte buffer •EP1IN, EP1OUT•64-byte buffers, bulk or interrupt •EP2,4,6,8•Eight 512-byte buffers, bulk, interrupt, or isochronous. EP4 and EP8 can be double buffered, while EP2 and 6 can be either double, triple, or quad buffered. For high-speed end-point configuration options, see Figure 3-5.3.12.3Set-up Data BufferA separate 8-byte buffer at 0xE6B8-0xE6BF holds the Set-up data from a CONTROL transfer.3.12.4Endpoint Configurations (High-speed Mode)Endpoints 0 and 1 are the same for every configuration.Endpoint 0 is the only CONTROL endpoint, and endpoint 1 can be either BULK or INTERRUPT. The endpoint buffers can be configured in any 1 of the 12 configurations shown in the vertical columns. When operating in full-speed BULK mode only the first 64 bytes of each buffer are used. For example in high-speed, the max packet size is 512 bytes but in full-speed it is 64 bytes. Even though a buffer is configured to be a 512byte buffer, in full-speed only the first 64 bytes are used. The unused endpoint buffer space is not available for other opera-tions. An example endpoint configuration would be:FFFFE800E7BF E740E73F E700E6FF E500E4FF E480E47F E400E200E1FFE000E3FF EFFF2 KBytes RESERVED64 Bytes EP0 IN/OUT 64 Bytes RESERVED 8051 Addressable RegistersReserved (128)128 bytes GPIF Waveforms512 bytes 8051 xdata RAMF000(512)Reserved (512)E78064 Bytes EP1OUT E77F 64 Bytes EP1IN E7FF E7C0 4 KBytes EP2-EP8buffers(8 x 512)EP2–1024 double buffered; EP6–512 quad buffered (column 8).3.12.5Default Full-Speed Alternate Settings3.12.6Default High-Speed Alternate Settings6464645125121024102410241024102410241024512512512512512512512512512512EP0 IN&OUTEP1 IN EP1 OUTFigure 3-5. Endpoint Configuration1024102410245125125125125125125125125125125125125125125125125125125125125125125125125125125125125125121024102410241024102410245125121024102451251251251251251251251210241024512512512512512512646464646464646464646464646464646464646464646464646464646464646464123456789101112Table 3-6. Default Full-Speed Alternate Settings [4, 5]Alternate Setting 0123ep064646464ep1out 064 bulk 64 int 64 int ep1in 064 bulk 64 int 64 int ep2064 bulk out (2×)64 int out (2×)64 iso out (2×)ep4064 bulk out (2×)64 bulk out (2×)64 bulk out (2×)ep6064 bulk in (2×)64 int in (2×)64 iso in (2×)ep8064 bulk in (2×)64 bulk in (2×)64 bulk in (2×)Notes:4.“0” means “not implemented.”5.“2×” means “double buffered.”6.Even though these buffers are 64 bytes, they are reported as 512 for USB 2.0 compliance. The user must never transfer packets larger than 64 bytes to EP1.Table 3-7. Default High-Speed Alternate Settings [4, 5]Alternate Setting 0123ep064646464ep1out 0512 bulk [6]64 int 64 int ep1in 0512 bulk [6]64 int64 intep20512 bulk out (2×)512 int out (2×)512 iso out (2×)ep40512 bulk out (2×)512 bulk out (2×)512 bulk out (2×)ep60512 bulk in (2×)512 int in (2×)512 iso in (2×)ep80512 bulk in (2×)512 bulk in (2×)512 bulk in (2×)3.13External FIFO Interface3.13.1ArchitectureThe FX2LP slave FIFO architecture has eight 512-byte blocks in the endpoint RAM that directly serve as FIFO memories, and are controlled by FIFO control signals (such as IFCLK, SLCS#, SLRD, SLWR, SLOE, PKTEND, and flags).In operation, some of the eight RAM blocks fill or empty from the SIE, while the others are connected to the I/O transfer logic. The transfer logic takes two forms, the GPIF for internally generated control signals, or the slave FIFO interface for externally controlled transfers.3.13.2Master/Slave Control SignalsThe FX2LP endpoint FIFOS are implemented as eight physi-cally distinct 256x16 RAM blocks. The 8051/SIE can switch any of the RAM blocks between two domains, the USB (SIE) domain and the 8051-I/O Unit domain. This switching is done virtually instantaneously, giving essentially zero transfer time between “USB FIFOS” and “Slave FIFOS.” Since they are physically the same memory, no bytes are actually transferred between buffers.At any given time, some RAM blocks are filling/emptying with USB data under SIE control, while other RAM blocks are available to the 8051 and/or the I/O control unit. The RAM blocks operate as single-port in the USB domain, and dual-port in the 8051-I/O domain. The blocks can be configured as single, double, triple, or quad buffered as previ-ously shown.The I/O control unit implements either an internal-master (M for master) or external-master (S for Slave) interface.In Master (M) mode, the GPIF internally controls FIFOADR[1..0] to select a FIFO. The RDY pins (two in the 56-pin package, six in the 100-pin and 128-pin packages) can be used as flag inputs from an external FIFO or other logic if desired. The GPIF can be run from either an internally derived clock or externally supplied clock (IFCLK), at a rate that transfers data up to 96 Megabytes/s (48-MHz IFCLK with 16-bit interface).In Slave (S) mode, the FX2LP accepts either an internally derived clock or externally supplied clock (IFCLK, max. frequency 48 MHz) and SLCS#, SLRD, SLWR, SLOE, PKTEND signals from external logic. When using an external IFCLK, the external clock must be present before switching to the external clock with the IFCLKSRC bit. Each endpoint can individually be selected for byte or word operation by an internal configuration bit, and a Slave FIFO Output Enable signal SLOE enables data of the selected width. External logic must insure that the output enable signal is inactive when writing data to a slave FIFO. The slave interface can also operate asynchronously, where the SLRD and SLWR signals act directly as strobes, rather than a clock qualifier as in synchronous mode. The signals SLRD, SLWR, SLOE and PKTEND are gated by the signal SLCS#.3.13.3GPIF and FIFO Clock RatesAn 8051 register bit selects one of two frequencies for the internally supplied interface clock: 30 MHz and 48 MHz. Alter-natively, an externally supplied clock of 5 MHz–48 MHz feeding the IFCLK pin can be used as the interface clock. IFCLK can be configured to function as an output clock when the GPIF and FIFOs are internally clocked. An output enable bit in the IFCONFIG register turns this clock output off, if desired. Another bit within the IFCONFIG register will invert the IFCLK signal whether internally or externally sourced. 3.14GPIFThe GPIF is a flexible 8- or 16-bit parallel interface driven by a user-programmable finite state machine. It allows the CY7C68013A/15A to perform local bus mastering, and can implement a wide variety of protocols such as ATA interface, printer parallel port, and Utopia.The GPIF has six programmable control outputs (CTL), nine address outputs (GPIFADRx), and six general-purpose ready inputs (RDY). The data bus width can be 8 or 16 bits. Each GPIF vector defines the state of the control outputs, and deter-mines what state a ready input (or multiple inputs) must be before proceeding. The GPIF vector can be programmed to advance a FIFO to the next data value, advance an address, etc. A sequence of the GPIF vectors make up a single waveform that will be executed to perform the desired data move between the FX2LP and the external device.3.14.1Six Control OUT SignalsThe 100- and 128-pin packages bring out all six Control Output pins (CTL0-CTL5). The 8051 programs the GPIF unit to define the CTL waveforms. The 56-pin package brings out three of these signals, CTL0–CTL2. CTLx waveform edges can be programmed to make transitions as fast as once per clock (20.8 ns using a 48-MHz clock).3.14.2Six Ready IN SignalsThe 100- and 128-pin packages bring out all six Ready inputs (RDY0–RDY5). The 8051 programs the GPIF unit to test the RDY pins for GPIF branching. The 56-pin package brings out two of these signals, RDY0–1.3.14.3Nine GPIF Address OUT SignalsNine GPIF address lines are available in the 100- and 128-pin packages, GPIFADR[8..0]. The GPIF address lines allow indexing through up to a 512-byte block of RAM. If more address lines are needed, I/O port pins can be used.3.14.4Long Transfer ModeIn master mode, the 8051 appropriately sets GPIF transaction count registers (GPIFTCB3, GPIFTCB2, GPIFTCB1, or GPIFTCB0) for unattended transfers of up to 232 transactions. The GPIF automatically throttles data flow to prevent under or overflow until the full number of requested transactions complete. The GPIF decrements the value in these registers to represent the current status of the transaction.。
USB控制芯片cy7c68013中文手册
■ 3.3V 工作电压,容限输入为 5V
■ 向量化 USB 中断和 GPIF/FIFO 中断
■ 16 K 字节片上代码/数据 RAM
■ 四个可编程的 BULK/INTERRUPT/ISOCHRONOUS 端点 ❐ 缓冲区大小选项:两倍,三倍,四倍
■ 附加的可编程 (BULK/INTERRUPT) 64 位端点
■ 8 位或 16 位外部数据接口
■ 可生成智能介质标准错误校正码 ECC
■ 通用可编程接口 (General Programmable Interface, GPIF) ❐ 可与大多数并行接口直接连接 ❐ 由可编程波形描述符和配置寄存器定义波形 ❐ 支持多个 Ready (RDY) 输入和 Control (CTL) 输出
4 KB8/16源自FIFO丰富的 I/O 接口包含 两个 USART
通用可编程 I/F 符合 ASIC/DSP 或 总线标准,例如 ATAPI、 EPP 等
高达 96 MB/s 突发速率
增强型 USB 核 简化 8051 代码
“软配置”容易 进行固件更换
FIFO 和端点存储器 (主控端或从属端操作)
1.1 特色 (仅限 CY7C68013A/14A)
片上 PLL 可根据收发器 /PHY 的需要将 24 MHz 振荡器倍频到 480 MHz,而内部计数器可将其分频以用作 8051 时钟。默认的 8051 时钟频率是 12 MHz。 8051 的时钟频率可以由 8051 通过 CPUCS 寄存器动态更改。
CY7C1470V33中文资料
WRITE DRIVERS
O
U
T
S E N
P U T
S
MEMORY
E
ARRAY A
M
P
S
R E G I S T E
R
S
E
O
U
T
D
P
A
U
T
T
A
B
S
U
T
F
E
F
E
E
R
R
I
S
N
G
E
INPUT REGISTER 1 E
INPUT REGISTER 0 E
DQs DQPa DQPb
OE CE1 CE2 CE3
Functional Description
The CY7C1470V33, CY7C1472V33, and CY7C1474V33 are 3.3V, 2M x 36/4M x 18/1M x 72 Synchronous pipelined burst SRAMs with No Bus Latency™ (NoBL™) logic, respectively. They are designed to support unlimited true back-to-back Read/Write operations with no wait states. The CY7C1470V33, CY7C1472V33, and CY7C1474V33 are equipped with the advanced (NoBL) logic required to enable consecutive Read/Write operations with data being transferred on every clock cycle. This feature dramatically improves the throughput of data in systems that require frequent Write/Read transitions. The CY7C1470V33, CY7C1472V33, and CY7C1474V33 are pin compatible and functionally equivalent to ZBT devices.
CY7C1041CV33-10ZXI中文资料
Industrial
100
95
Automotive-A
100
Automotive-E
Commercial/
10
10
Industrial
Automotive-A
10
Automotive-E
48-ball FBGA
(Top View)
12
3
4
5
6
CY7C1041CV33
-15
-20
Unit
15
20
ns
80
28
A6, E3, G2, H1, No Connect No Connects. This pin is not connected to the die
H6
17
G5
Input/Control Write Enable Input, active LOW. When selected LOW, a
A5 18 A6 19 A7 20 A8 21 A9 22
44 A17 43 A16 42 A15 41 OE
40 BHE 39 BLE
38 I/O15 37 I/O14 36 I/O13 35 I/O12 34 VSS 33 VCC 32 I/O11 31 I/O10 30 I/O9 29 I/O8 28 NC
WRITE is conducted. When selected HIGH, a READ is
conducted.
6
ห้องสมุดไป่ตู้B5
Input/Control Chip Enable Input, active LOW. When LOW, selects the chip.
When HIGH, deselects the chip.
CY7C1387D-167BZXI中文资料
Q0
DQD,DQPD BYTE WRITE DRIVER DQc,DQPC BYTE WRITE DRIVER DQB,DQPB BYTE WRITE DRIVER DQA,DQPA BYTE WRITE DRIVER
MEMORY ARRAY SENSE AMPS
BWC
OUTPUT REGISTERS
Shaded areas contain advance information. Please contact your local Cypress sales representative for availability of these parts. Notes: 1. For best-practices recommendations, please refer to the Cypress application note System Design Guidelines on . 2. CE3 and CE2 are for TQFP and 165 fBGA package only. 119 BGA is offered only in Single Chip Enable.
CY7C1386D CY7C1387D
100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81
DQPC DQC DQC VDDQ VSSQ DQC DQC DQC DQC VSSQ VDDQ DQC DQC NC VDD NC VSS DQD DQD VDDQ VSSQ DQD DQD DQD DQD VSSQ VDDQ DQD DQD DQPD
Cypress Semiconductor Corporation Document #: 38-05545 Rev. *A
CY7C1411AV18资料
Errata Revision: *CMay 02, 2007RAM9 QDR-I/DDR-I/QDR-II/DDR- II ErrataCY7C129*DV18/CY7C130*DV25CY7C130*BV18/CY7C130*BV25/CY7C132*BV25CY7C131*BV18 / CY7C132*BV18/CY7C139*BV18CY7C191*BV18/CY7C141*AV18 / CY7C142*AV18/CY7C151*V18 /CY7C152*V18This document describes the DOFF issue for QDRII/DDRII and the Output Buffer and JTAG issues for QDRI/DDRI/QDRII/DDRII. Details include trigger conditions, possible workarounds and silicon revision applicability.This document should be used to compare to the respective datasheet for the devices to fully describe the device functionality.Please contact your local Cypress Sales Representative for availability of the fixed devices and any other questions.Devices AffectedTable 1. List of Affected devicesProduct StatusAll of the above densities and revisions are available in sample as well as production quantities.QDR/DDR DOFF Pin, Output Buffer and JTAG Issues Errata SummaryThe following table defines the issues and the fix status for the different devices which are affected.Density & Revision Part Numbers Architecture 9Mb - Ram9(90 nm)CY7C130*DV25QDRI/DDRI 9Mb - Ram9(90 nm)CY7C129*DV18QDRII 18Mb - Ram9(90nm)CY7C130*BV18CY7C130*BV25CY7C132*BV25QDRI/DDRI18Mb - Ram9(90nm)CY7C131*BV18CY7C132*BV18CY7C139*BV18CY7C191*BV18QDRII/DDRII36Mb - Ram9(90nm)CY7C141*AV18CY7C142*AV18QDRII/DDRII 72Mb -Ram9(90nm)CY7C151*V18CY7C152*V18QDRII/DDRIIItemIssueDeviceFix Status1.DOFF pin is used for enabling/dis-abling the DLL circuitry within the SRAM. To enable the DLL circuitry, DOFF pin must be externally tied HIGH. The QDR-II/DDR-II devices have an internal pull down resistor of ~5K . The value of the external pull-up resistor should be 500 or less in order to ensure DLL is enabled.9Mb - “D” Rev - Ram918Mb - “B” Rev - Ram936Mb - “A” Rev - Ram972Mb - Ram9QDR-II/DDR-II DevicesThe fix involved removing the in-ternal pull-down resistor on the DOFF pin. The fix has been im-plemented on the new revision and is now available.ΩΩTable 2.Issue Definition and fix status for different devices1. DOFF Pin Issue•ISSUE DEFINITIONThis issue involves the DLL not turning ON properly if a large resistor is used (eg:-10K ) as an external pullup resistor to enable the DLL. If a 10K or higher pullup resistor is used externally, the voltage on DOFF is not high enough to enable the DLL.•PARAMETERS AFFECTEDThe functionality of the device will be affected because of the DLL is not turning ON properly. When the DLL is enabled, all AC and DC parameters on the datasheet are met. •TRIGGER CONDITION(S)Having a 10K or higher external pullup resistor for disabling the DOFF pin.•SCOPE OF IMPACTThis issue will alter the normal functionality of the QDRII/DDRII devices when the DLL is disabled.•EXPLANATION OF ISSUEFigure 1 shows the DOFF pin circuit with an internal 5K internal resistor. The fix planned is to disable the internal 5K leaker.•WORKAROUND2.O/P Buffer enters a locked up unde-fined state after controls or clocks are left floating. No proper read/write access can be done on the device until a dummy read is performed.9Mb - “D” Rev - Ram918Mb - “B” Rev - Ram936Mb - “A” Rev - Ram972Mb - Ram9QDR-I/DDR-I/QDR-II/DDR-II Devices The fix has been implemented onthe new revision and is now avail-able.3.The EXTEST function in the JTAG test fails when input K clock is floating in the JTAG mode.9Mb - “D” Rev - Ram918Mb - “B” Rev - Ram936Mb - “A” Rev - Ram972Mb - Ram9QDR-I/DDR-I/QDR-II/DDR-II DevicesThe fix involved bypassing the ZQ circuitry in JTAG mode. This was done by overriding the ZQ circuit-ry by the JTAG signal. The fix has been implemented on the new re-vision and is now available.Figure 1.DOFF pin with the 5K internal resistorItemIssueDeviceFix StatusΩΩΩΩΩΩThe workaround is to have a low value of external pullup resistor for the DOFF pin (recommended value is <500). When DOFF pins from multiple QDR devices are connected through the same pull-up resistors on the board, it is recommended that this DOFF pin be directly connected to Vdd due to the lower effective resistance since the "leakers" are in parallel.Figure 2 shows the proposed workaround and the fix planned.•FIXSTATUSFix involved removing the internal pull-down resistor on the DOFF pin. The fix has been implemented on the new revision and is now available. The new revision is an increment of the existing revision. The following table lists the devices affected, current revision and the new revision after the fix.Table 3.List of Affected Devices and the new revison2.Output Buffer IssueFigure 2.Proposed workaround with the 500 external pullupCurrent Revision New Revision after the FixCY7C129*DV18CY7C129*EV18CY7C131*BV18CY7C131*CV18CY7C132*BV18CY7C132*CV18CY7C139*BV18CY7C139*CV18CY7C191*BV18CY7C191*CV18CY7C141*AV18CY7C141*BV18CY7C142*AV18CY7C142*BV18CY7C151*V18CY7C151*AV18CY7C152*V18CY7C152*AV18ΩΩ•ISSUE DEFINITIONThis issue involves the output buffer entering an unidentified state when the input signals (only Control signals or Clocks) are floating during reset or initialization of the memory controller after power up. •PARAMETERS AFFECTEDNo timing parameters are affected. The device may drive the outputs even though the read operation is not enabled. A dummy read is performed to clear this condition.•TRIGGER CONDITION(S)Input signals(namely RPS# for QDR-I/QDRII , WE# and LD# for DDR-I/DDRII) or Clocks (K/K# and/or C/C#) are floating during reset or initialization of the memory controller after power up.•SCOPE OF IMPACTThis issue will jeopardize any number of writes or reads which take place after the controls or clock are left floating. This can occur anywhere in the SRAM access ( all the way from power up of the memory device to transitions taking place for read/write accesses to the memory device) if the above trigger conditions are met.•EXPLANATION OF ISSUEFigure 3 shows the output register Reset circuit with an SR Latch circled. This latch has two inputs with one of them coming from some logic affected by the clock and RPS#(QDR) or WE# and LD#(DDR).The issue happens when clocks are glitching/toggling with controls floating. This will cause the SR latch to be taken into an unidentified state. The SR Latch will need to be reset by a dummy read operation if this happens. Array•WORKAROUNDThis is viable only if the customer has the trigger conditions met during reset or initialization of the memory controller after power up. In order for the workaround to perform properly, Cypress recommends the insertion of a minimum of 16 “dummy” READ operations to every SRAM device on the board prior to writing any meaningful data into the SRAM. After this one “dummy” READ operation, the device will perform properly.“Dummy” READ is defined as a read operation to the device that is not meant to retrieve required data. The “dummy” READ can be to any address location in the SRAM. Refer to Figure 4 for the dummy read implemen-tation.In systems where multiple SRAMs with multiple RPS# lines are used, a dummy read operation will have to be performed on every SRAM on the board. Below is an example sequence of events that can be performed before valid access can be performed on the SRAM.1) Initialize the Memory Controller2) Assert RPS# Low for each of the memory devicesNote:For all devices with x9 bus configuration, the following sequence needs to be performed:1) For the 72M / 36M / 18M x9 devices drive address pin A2 / A10 / A3 low respectively and perform dummyread.2) For the 72M / 36M / 18M x9 devices drive address pin A2 / A10 / A3 high respectively and perform dummyread.If the customer has the trigger conditions met during normal access to the memory then there is no workaround at this point.•FIX STATUSThe fix has been implemented on the new revision and is now available. The new revision is an increment of the existing revision. Please refer to Table 4 for the list of devices affected, current revision and the new revision after the fix.3. JTAG Mode Issue•ISSUE DEFINITIONIf the input clock (K Clock) is left floating when the device is in JTAG mode, spurious high frequency noise on this input can be interpreted by the device as valid clocks. This could cause the impedance matching circuitry (ZQ) on the QDR/DDR devices to periodically load itself with incorrect values. These incorrect values in the ZQ register could force the outputs into a High-Impedance state. The ZQ circuitry requires at least 1000 valid K clock cycles to drive the outputs from high impedance to low impedance levels.•PARAMETERS AFFECTEDThis issue only affects the EXTEST command when the device is in the JTAG mode. The normal functionality of the device will not be affected.•TRIGGER CONDITION(S)EXTEST command executed immediately after power-up without providing any K clock cycles.•SCOPE OF IMPACTThis issue only impacts the EXTEST command when device is tested in the JTAG mode. Normal functionality of the device is not affected. •EXPLANATION OF ISSUEImpedance matching circuitry (ZQ) is present on the QDR/DDR devices to set the desired impedance on the outputs. This ZQ circuitry is updated every 1000 clock cycles of K clock to ensure that the impedance of the O/P is set to valid state. However, when the device is operated in the JTAG mode immediately after power-up, high frequency noise on the input K clock can be treated by the ZQ circuitry as valid clocks thereby setting the outputs in to a high-impedance mode. If a minimum of 1000 valid K clocks are applied before performing the JTAG test, this should clear the ZQ circuitry and ensure that the outputs are driven to valid impedance levels.•WORKAROUNDElimination of the issue: After power-up, before any valid operations are performed on the device, insert a minimum of 1000 valid clocks on K input.•FIX STATUSThe fix involved bypassing the ZQ circuitry in JTAG mode. This was done by overriding the ZQ circuitry by the JTAG signal. The fix has been implemented on the new revision and is now available. The new revision is an increment of the existing revision. Please refer to Table 4 for the list of devices affected, current revision and the new revision after the fix..Table 4.List of Affected devices and the new revisionCurrent Revision New Revision after the FixCY7C129*DV18CY7C129*EV18CY7C130*DV25CY7C130*EV25CY7C130*BV18CY7C130*CV18CY7C130*BV25CY7C130*CV25CY7C132*BV25CY7C132*CV25CY7C131*BV18CY7C131*CV18CY7C132*BV18CY7C132*CV18CY7C139*BV18CY7C139*CV18CY7C191*BV18CY7C191*CV18CY7C141*AV18CY7C141*BV18CY7C142*AV18CY7C142*BV18CY7C151*V18CY7C151*AV18CY7C152*V18CY7C152*AV18ReferencesAll 90nm QDRI/DDRI/QDRII/DDRII datasheets:-Table 5.List of Datasheet spec# for the Affected devicesSpec#Part#DensityArchitecture38-05628CY7C1304DV259-MBIT QDR(TM) SRAM 4-WORD BURST 38-05632CY7C1308DV259-MBIT DDR-I SRAM 4-WORD BURST 001-00350CY7C1292DV18/1294DV189-MBIT QDR- II(TM) SRAM 2-WORD BURST 38-05621CY7C1316BV18/1916BV18/1318BV18/1320BV1818-MBIT DDR-II SRAM 2-WORD BURST 38-05622CY7C1317BV18/1917BV18/1319BV18/1321BV1818-MBIT DDR-II SRAM 4-WORD BURST 38-05623CY7C1392BV18/1393BV18/1394BV1818-MBIT DDR-II SIO SRAM 2-WORD BURST 38-05631CY7C1323BV2518-MBIT DDR-I SRAM 4-WORD BURST 38-05630CY7C1305BV25/1307BV2518-MBIT QDR(TM) SRAM 4-WORD BURST 38-05627CY7C1303BV25/1306BV2518-MBIT QDR(TM) SRAM 2-WORD BURST 38-05629CY7C1305BV18/1307BV1818-MBIT QDR(TM) SRAM 4-WORD BURST 38-05626CY7C1303BV18/1306BV1818-MBIT QDR(TM) SRAM 2-WORD BURST 38-05619CY7C1310BV18/1910BV18/1312BV18/1314BV1818-MBIT QDR - II (TM) SRAM 2-WORD BURST 38-05620CY7C1311BV18/1911BV18/1313BV18/1315BV1818-MBIT QDR - II SRAM 4-WORD BURST 38-05615CY7C1410AV18/1425AV18/1412AV18/1414AV1836-MBIT QDR-II(TM) SRAM 2-WORD BURST 38-05614CY7C1411AV18/1426AV18/1413AV18/1415AV1836-MBIT QDR(TM)-II SRAM 4-WORD BURST 38-05616CY7C1416AV18/1427AV18/1418AV18/1420AV1836-MBIT DDR-II SRAM 2-WORD BURST 38-05618CY7C1417AV18/1428AV18/1419AV18/1421AV1836-MBIT DDR-II SRAM 4-WORD BURST 38-05617CY7C1422AV18/1429AV18/1423AV18/1424AV1836-MBIT DDR-II SIO SRAM 2-WORD BURST 38-05489CY7C1510V18/1525V18/1512V18/1514V1872-MBIT QDR-II SRAM 2-WORD BURST 38-05363CY7C1511V18/1526V18/1513V18/1515V1872-MBIT QDR(TM)-II SRAM 4-WORD BURST 38-05563CY7C1516V18/1527V18/1518V18/1520V1872-MBIT DDR-II SRAM 2-WORD BURST 38-05565CY7C1517V18/1528V18/1519V18/1521V1872-MBIT DDR-II SRAM 4-WORD BURST 38-05564CY7C1522V18/1529V18/1523V18/1524V1872-MBITDDR-II SIO SRAM 2-WORD BURSTDocument History PageDocument Title: RAM9 QDR-I/DDR-I/QDR-II/DDR- II Errata Document #: 001-06217 Rev. *CREV.ECN NO.IssueDateOrig. ofChange Description of Change**419849See ECN REF New errata for Ram9 QDR2/DDR2 SRAMs.*A493936See ECN QKS Added Output buffer and JTAG mode issues, Item#2 and #3Added 9Mb QDR-II Burst of 2 and QDR-1/DDR-I part numbers.*B733176See ECN NJY Added missing part numbers in the title for Spec#’s 38-05615,38-05614,38-05363,38-05563 on Table 5 on page 7.*C1030020 See ECN TBE Updated the fix status of the three issues, and modified the description forthe Output Buffer workaround for x9 devices on page 5.。
CCS-18T14C资料
TTL
SP6T
H = 2.15 STD Model H = 2.65 TTL Model
SP5T
SP4T
SP3T
Part Numbering System for CCS-18 (Normally Open) CCS-18 N 1 5 O - T
Series Connectors Actuator Voltage Connector S: SMA Female N: N type Female T: TNC Female* Actuator Voltage 1: 28Vdc Normally Open 2: 15Vdc Normally Open 3: 12Vdc Normally Open Number of Positions 3: SP3T 4: SP4T 5: SP5T 6: SP6T Options Actuator Type Number of Switch Positions Actuator Type O: No Indicator Contacts C: Indicator Contacts Options T: TTL Drivers with Diodes R: Positive + Common TD: TTL Driver with Decoder
3000
Typical Performance
Hig
800 400
Sta nda r
nne
dN
cto
Power CW (Watts)
Typ e
rs
200
Co nne cto
rs
15
80
40
25
Return Loss
hP ow er
Co
珍贵资料-cy7c68013中文手册
CY7C68013A, CY7C68014ACY7C68015A, CY7C68016A EZ-USB FX2LP (TM) USB 微控制器高速 USB 外设控制器1. 特色 (CY7C68013A/14A/15A/16A)■USB 2.0 USB IF 高速性能且经过认证 (TID # 40460272)■单芯片集成 USB 2.0 收发器、智能串行接口引擎 (SIE) 和增强型 8051 微处理器■适用性、外观和功能均与FX2兼容❐引脚兼容❐目标代码兼容❐功能兼容(FX2LP 是超集)■超低功耗:I CC在任何模式下都不超过 85 mA❐适合总线和电池供电的应用■软件:8051 代码运行介质:❐内部 RAM,通过 USB 下载❐内部 RAM,从 EEPROM 加载❐外部存储设备(128 引脚封装)■16 K 字节片上代码/数据 RAM■四个可编程的 BULK/INTERRUPT/ISOCHRONOUS 端点❐缓冲区大小选项:两倍,三倍,四倍■附加的可编程(BULK/INTERRUPT) 64 位端点■8 位或 16 位外部数据接口■可生成智能介质标准错误校正码 ECC ■通用可编程接口 (General Programmable Interface,GPIF)❐可与大多数并行接口直接连接❐由可编程波形描述符和配置寄存器定义波形❐支持多个 Ready (RDY) 输入和 Control (CTL) 输出■符合行业标准的集成增强型 8051❐48 MHz、24 MHz 或 12 MHz CPU 操作❐每个指令周期四个时钟❐两个 USART❐三个计数器/定时器❐扩展的中断系统❐两个数据指针■3.3V 工作电压,容限输入为 5V■向量化 USB 中断和 GPIF/FIFO 中断■分离的 CONTROL 传输设置部分和数据部分数据缓冲■集成 I2C 控制器,在 100 或 400 kHz 下运行■集成的四个先进先出 (FIFO) 缓冲❐集成胶合逻辑和 FIFO 有助于降低系统成本❐与 16 位总线之间的自动转换❐可主-从操作❐使用外部时钟或异步选通脉冲❐易于与 ASIC 和 DSP IC 相连的接口■有商业和工业温度等级供选择(除 VFBGA 外的所有封装)1.1 特色(仅限 CY7C68013A/14A )■CY7C68014A :适合电池供电应用❐挂起电流:100 μA (typ)■CY7C68013A :适合非电池供电应用❐挂起电流:300 μA (typ)■有五种无铅封装供选择,可包含多达 40 个 GPIO ❐128 引脚 TQFP (40 个 GPIO )、100 引脚 TQFP (40 个 GPIO )、56 引脚 QFN (24 个 GPIO )、56 引脚 SSOP (24 个 GPIO )和 56 引脚 VFBGA (24 个 GPIO )1.2 特色(仅限 CY7C68015A/16A )■CY7C68016A :适合电池供电应用❐挂起电流:100 μA (typ)■CY7C68015A :适合非电池供电应用❐挂起电流:300 μA (typ)■采用无铅 56 引脚 QFN 封装(26 个 GPIO )❐比 CY7C68013A/14A 多 2 个 GPIO ,可在同样的空间内实现额外的功能赛普拉斯半导体公司(赛普拉斯)的 EZ-USB FX2LP ™ (CY7C68013A/14A) 是高集成、低功耗 USB 2.0 微控制器EZ-USB FX2™ (CY7C68013) 的一个低功耗版本。
CY7C1069AV33-10BAI中文资料
–8
Parameter
Description
Test Conditions
Min. Max.
VOH
Output HIGH Voltage VCC = Min.,
IOH = –4.0 mA
VOL
tDOE
OE LOW to Data Valid
tLZOE
OE LOW to Low-Z[6]
1
tHZOE
OE HIGH to High-Z[6]
tLZCE
CE1 LOW/CE2 HIGH to Low-Z[6]
2.0
–0.3 –1 –1
VCC + 0.3 0.8
+1 +1
260 260 70
50
Unit V
V
V
V µA µA mA mA mA
mA
Capacitance[2]
Parameter
Package
Description
Test Conditions
CIN
Z54
Input Capacitance
TA = 25°C, f = 1 MHz, VCC = 3.3V
Disabled
2.4
0.4
2.0 VCC + 0.3
–0.3 0.8 –1 +1 –1 +1
ICC
VCC Operating
VCC = Max., f = fMAX Commercial
300
Supply Current
= 1/tRC
Industrial
CY7C1314V18-167BZC资料
Errata Revision: [**]CY7C1312V18CY7C1314V18CONFIDENTIAL11/14/03Errata Document for CY7C1312V18 & CY7C1314V18This document describes errata for the CY7C1312V18 and CY7C1314V18. Details include errata trigger conditions,available workarounds, and silicon revision applicability. This document should be used as a suplement to the existing datasheet.Please contact your local Cypress Sales Representative if you have further questions.Part Numbers AffectedCY7C1312V18 & CY7C1314V18 Qualification StatusThese parts are currently available as Engineering Samples.The reliability report is available on our website, , QTP# 032105CY7C1312V18 & CY7C1314V18 Errata SummaryThe following table defines the errata applicability to the CY7C1312V18 and CY7C1314V18. .1. ADDRESS 7C ERRATA•PROBLEM DEFINITION In a given clock cycle:•The read address is provided on the rising edge of K •The write address is provided on the rising edge of K#•If the read and write address are the same, data is forwarded from the input port to the output port and the data from the memory array is ignored. This feature is called the data forwarding feature and it ensures that the most current data is always output from the device.In the event that address 7C is the only address that changes between the read address, and the write address in a given clock cycle, and if address 7C is changing from "1" to "0", then the data forwarding may be errone-ously activated. The data from the memory array may be ignored and the data from the input bus may be improperly forwarded.•PARAMETERS AFFECTEDThis errata impacts the integrity of the data. It does not impact any timing or operating parameters.•TRIGGER CONDITION(S)This errata can occur across all datasheet operating conditions.Part Number Architecture Confguration Clock FrequencyCY7C1312V18-133BZC QDR-II Burst of 2 1 M x 18133 MHz CY7C1312V18-167BZC QDR-II Burst of 2 1 M x 18167 MHz CY7C1314V18-133BZC QDR-II Burst of 2512 K x 36133 MHz CY7C1314V18-167BZCQDR-II Burst of 2512 K x 36167 MHzItemsCY7C1312V18CY7C1314V18Fix Status1. Address 7C Errata X X Cypress plans to fix this errata withchanges to the silicon.2. First Clock Cycle ErrataXXCypress does not plan to fix this errata. Contact your local Cypress sales office for additional information.元器件交易网CY7C1312V18CY7C1314V18CONFIDENTIALErrata Document•SCOPE OF IMPACTThis issue only applies to the burst of 2 arhcitecture only. QDR-II. Burst of 4 devices are NOT affected by this issue. This errata affects the output of the data from the device. It does not affect the data integrity in the memory array.The impact this has in an application has two components. First, it is dependent on how often the failing condition occurs. Second, it is dependent on the system’s ability to recover from the occurance of incorrect data.In applications with truly random access of the memory, it will occur at a rate of 2 PPM for the CY7C1312V18and 4 PPM for the CY7C1314V18. However, it will occur more frequently in applications where the failing conditions occur more frequently.•WORKAROUNDProhibit the failing conditions in the SRAM controller’s software.•FIX STATUSCypress has identified a change to the silicon that will eliminate this errata.2. FIRST CLOCK CYCLE ERRATA•PROBLEM DEFINITIONIn the first clock cylce seen by the device, it is possible for data to be written into the memory array incorrectly. Specificlly, the first word may be written to the second burst address and the second word may be written to the first burst address. This can only occur in the first clock cycle seen by the device and will not occur in subsequent clock cycles.To date, Cypress is unaware of any applications that have experienced this issue.•PARAMETERS AFFECTEDThis errata impacts the integrity of the data. It does not impact any timing or operating parameters.•TRIGGER CONDITION(S)This errata will only occur during the first clock cycle seen by the device. It will not occur after the second rising edges of the K and K# clocks. Therefore, if the device sees any clock cycles during power up, this errata will not occur.This errata occurs under the following conditions:(1) V DD reaches 1.7 V at t 0,(2) K# rises from low to high after t 0 + 25 ns,(3) K# rises from low to high before the first rising edge of K.A timing diagram for these trigger conditions is shown below:Timing Diagram For First Clock Cycle Errata Trigger ConditionsCONFIDENTIALErrata DocumentCY7C1312V18CY7C1314V18•SCOPE OF IMPACTThis errata only impacts the data integrity of data written during the first clock cycle seen by the device. All subsequent writes will be written correctly.To date, none of our customers have reported seeing this failure mechanism in an application.A timing diagram describing device operation after the first clock cycle errata is triggered is shown below.•WORKAROUNDThere are numerous available workarounds to this errata. These include the following:1. Wait until after the first clock cycle to write to the device.2. Ensure that K rises high before K# (Shown Below)Timing Diagram For Ensuring K Rises Before K#CY7C1312V18CY7C1314V18Errata DocumentCONFIDENTIAL© Cypress Semiconductor Corporation, 2003. The information contained herein is subject to change without notice. Cypress Semicon ductor Corporation assumes no responsibility for the use3. Bring K# input high prior to t0 + 25 ns.•FIX STATUSCypress does not have a plan to correct this errata. If your application cannot accommodate the suggestedworkarounds, please contact your Cypress FAE.References[1] Document # 38-05180,CY7C1310V18/CY7C1312V18/CY7C1314V18: 18-Mb QDR(TM)-II SRAM Two-wordBurst Architecture (Preliminary)Timing Diagram For Bringing K# High Prior to t0 + 25 ns元器件交易网CY7C1312V18CY7C1314V18CONFIDENTIALErrata DocumentDocument History PageDocument Title: CY7C1312V18 & CY7C1314V18 Errata Document Number: 38-17005REV.ECN NO.Issue Date Orig. ofChange Description of Change**13128411/14/03RCS1.New Document元器件交易网。
CY7C131中文资料
1K x 8 Dual-Port Static RAMCY7C130/CY7C131CY7C140/CY7C141Features•True Dual-Ported memory cells which allow simulta-neous reads of the same memory location •1K x 8 organization•0.65-micron CMOS for optimum speed/power •High-speed access: 15 ns•Low operating power: I CC = 110 mA (max.)•Fully asynchronous operation •Automatic power-down•Master CY7C130/CY7C131 easily expands data bus width to 16 or more bits using slave CY7C140/CY7C141•BUSY output flag on CY7C130/CY7C131; BUSY input on CY7C140/CY7C141•INT flag for port-to-port communication•Available in 48-pin DIP (CY7C130/140), 52-pin PLCC, 52-Pin TQFP .•Pb-Free packages availableFunctional DescriptionThe CY7C130/CY7C131/CY7C140 and CY7C141 are high-speed CMOS 1K by 8 dual-port static RAMs. Two ports are provided permitting independent access to any location in memory. The CY7C130/ CY7C131 can be utilized as either a standalone 8-bit dual-port static RAM or as a master dual-port RAM in conjunction with the CY7C140/CY7C141 slave dual-port device in systems requiring 16-bit or greater word widths. It is the solution to applications requiring shared or buffered data, such as cache memory for DSP , bit-slice, or multiprocessor designs.Each port has independent control pins; chip enable (CE), write enable (R/W), and output enable (OE). Two flags are provided on each port, BUSY and INT. BUSY signals that the port is trying to access the same location currently being accessed by the other port. INT is an interrupt flag indicating that data has been placed in a unique location (3FF for the left port and 3FE for the right port). An automatic power-down feature is controlled independently on each port by the chip enable (CE) pins.The CY7C130 and CY7C140 are available in 48-pin DIP . The CY7C131 and CY7C141 are available in 52-pin PLCC, 52-pin Pb-free PLCC, 52-pin PQFP and 52-pin Pb-free PQFP .Note:1.CY7C130/CY7C131 (Master): BUSY is open drain output and requires pull-up resistor2.Open drain outputs: pull-up resistor required.Logic Block DiagramPin Configurations131415161718192021222326272832313029333635342425GND123456789101138394044434241454847461237R/W L CE L BUSY L INT L OE L A 0L A 1L A 2L A 3L A 4L A 5L A 6L A 7L A 8L A 9L I/O 0L I/O 1L I/O 2L I/O 3L I/O 4L I/O 5L I/O 6L I/O 7L CE R R/W R BUSY R INT R OE R A 0R A 1R A 2R A 3R A 4R A 5R A 6R A 7R A 8R A 9R I/O 7R I/O 6R I/O 5R I/O 4R I/O 3R I/O 2R I/O 1R I/O 0RV CCDIP Top View7C1307C140R/W L BUSY LCE L OE LA 9L A 0LA 0RA 9R R/W R CE R OE RCE R OE R CE L OE L R/W LR/W RI/O 7L I/O 0L I/O 7R I/O 0R BUSY RINT LINT RARBITRATIONLOGIC(7C130/7C131ONLY)ANDINTERRUPT LOGICCONTROL I/O CONTROLI/O MEMORY ARRAYADDRESS DECODERADDRESS DECODER[1][2][2]Pin Configuration (continued )1V C CTop ViewPLCC OE R A 0R 8910111213141516171819204645444342414039383736353421222324252627282930313233765432525150494847A 1R A 2R A 3R A 4R A 5R A 6R A 7R A 8R A 9R NC I/O 7RA 1LA 2L A 3L A 4L A 5L A 6L A 7L A 8L A 9L I/O 0L I/O 1L I/O 2L I/O 3LI /O I /O I /O I /O I /O I /O I /O I /O I /O I /O I /O 4L 5L6L 7L0R 1R2R 3R 4R5R 6RN C G N DO E B U S Y I N T A N C R /W C E R /W B U S Y I N T N C0LL L LL L C E R R R R7C1317C14146123456789101112133938373635343332313029282714151617181920212223242526525150494847454443424140Top ViewPQFPV C CO E B U S Y I N T A N C R /W C E R /W B U S Y I N T N C0LL L LL L C E R R R ROE R A 0R A 1R A 2R A 3R A 4R A 5R A 6R A 7R A 8R A 9R NC I/O 7RA 1L A 2L A 3L A 4L A 5L A 6L A 7L A 8L A 9L I/O 0L I/O 1L I/O 2L I/O 3LI /O I /O I /O I /O I /O I /O I /O I /O I /O I /O I /O 4L 5L6L 7L0R 1R2R 3R 4R5R 6RN C G N D 7C1317C141Pin DefinitionsLeft PortRight PortDescriptionCE L CE R Chip Enable R/W L R/W R Read/Write Enable OE LOE ROutput Enable A 0L –A 11/12L A 0R –A 11/12R AddressI/O 0L –I/O 15/17L I/O 0R –I/O 15/17R Data Bus Input/Output INT L INT R Interrupt Flag BUSY L BUSY RBusy Flag V CC Power GNDGroundSelection Guide7C131-15[3]7C141-157C131-25[3]7C141-257C130-307C131-307C140-307C141-307C130-357C131-357C140-357C141-357C130-457C131-457C140-457C141-457C130-557C131-557C140-557C141-55Unit Maximum Access Time 152530354555ns Maximum Operating CurrentCom’l/Ind 190170170120120110mAMilitary 170170120Maximum Standby CurrentCom’l/Ind 756565454535mAMilitary656545Shaded areas contain preliminary information.Note:3.15 and 25-ns version available only in PLCC/PQFP packages.Maximum Ratings[4](Above which the useful life may be impaired. For user guide-lines, not tested.)Storage Temperature .................................–65°C to +150°C Ambient Temperature withPower Applied.............................................–55°C to +125°C Supply Voltage to Ground Potential(Pin 48 to Pin 24)...........................................–0.5V to +7.0V DC Voltage Applied to Outputsin High Z State...............................................–0.5V to +7.0V DC Input Voltage............................................–3.5V to +7.0V Output Current into Outputs (LOW).............................20 mA Static Discharge Voltage........................................... >2001V (per MIL-STD-883, Method 3015)Latch-Up Current.................................................... >200 mA Operating RangeRangeAmbientTemperature V CC Commercial0°C to +70°C 5V ± 10% Industrial–40°C to +85°C 5V ± 10% Military[5]–55°C to +125°C 5V ± 10%Electrical Characteristics Over the Operating Range[6]Parameter Description Test Conditions 7C131-15[3]7C141-157C130-30[3]7C131-25,307C140-307C141-25,307C130-35,457C131-35,457C140-35,457C141-35,457C130-557C131-557C140-557C141-55Unit Min.Max.Min.Max.Min.Max.Min.Max.V OH Output HIGHVoltageV CC = Min., I OH = –4.0 mA 2.4 2.4 2.4 2.4VV OL Output LOWVoltage I OL = 4.0 mA0.40.40.40.4V I OL = 16.0 mA[7]0.50.50.50.5V IH Input HIGH Voltage 2.2 2.2 2.2 2.2V V IL Input LOW Voltage0.80.80.80.8V I IX Input LeakageCurrentGND < V I < V CC–5+5–5+5–5+5–5+5µAI OZ Output LeakageCurrent GND < V O < V CC,Output Disabled–5+5–5+5–5+5–5+5µAI OS Output ShortCircuit Current[8, 9]V CC = Max.,V OUT = GND–350–350–350–350mAI CC V CC OperatingSupply Current CE = V IL,Outputs Open,f = f MAX[10]Com’l190170120110mAMil170120I SB1Standby CurrentBoth Ports,TTL Inputs CE L and CE R >V IH, f = f MAX[10]Com’l75654535mAMil6545I SB2Standby CurrentOne Port,TTL Inputs CE L or CE R > V IH,Active Port OutputsOpen,f = f MAX[10]Com’l1351159075mAMil11590I SB3Standby CurrentBoth Ports,CMOS Inputs Both Ports CE L andCE R >V CC – 0.2V,V IN > V CC – 0.2Vor V IN < 0.2V, f = 0Com’l15151515mAMil1515Shaded areas contain preliminary information.Note:4.The Voltage on any input or I/O pin cannot exceed the power pin during power-up.5.T A is the “instant on” case temperature6.See the last page of this specification for Group A subgroup testing information.7.BUSY and INT pins only.8.Duration of the short circuit should not exceed 30 seconds.9.This parameter is guaranteed but not tested.10.At f = f MAX, address and data inputs are cycling at the maximum frequency of read cycle of 1/t RC and using AC Test Waveforms input levels of GND to 3V.I SB4Standby Current One Port, CMOS InputsOne Port CE L or CE R > V CC – 0.2V,V IN > V CC – 0.2V or V IN < 0.2V, Active Port Outputs Open, f = f MAX [10]Com’l 1251058570mAMil10585Capacitance [9]Parameter DescriptionTest ConditionsMax.Unit C IN Input Capacitance T A = 25°C, f = 1 MHz, V CC = 5.0V15pF C OUTOutput Capacitance10pFElectrical Characteristics Over the Operating Range [6] (continued)Parameter Description Test Conditions 7C131-15[3]7C141-157C130-30[3]7C131-25,307C140-307C141-25,307C130-35,457C131-35,457C140-35,457C141-35,457C130-557C131-557C140-557C141-55Unit Min.Max.Min.Max.Min.Max.Min.Max.AC Test Loads and Waveforms3.0V 5V OUTPUTR1 893ΩR2347Ω30pF INCLUDING JIGAND SCOPEGND90%90%10%≤ 5ns≤5ns5V OUTPUTR1 893ΩR2347Ω5pFINCLUDING JIGAND SCOPE(a)(b)OUTPUT1.40VEquivalent to:THÉVENIN EQUIVALENT5V 281Ω30pFBUSY OR INT(CY7C130/CY7C131ONLY)10%ALL INPUT PULSES 250ΩSwitching Characteristics Over the Operating Range[6, 11]Parameter Description7C131-15[3]7C141-157C130-25[3]7C131-257C140-257C141-257C130-307C131-307C140-307C141-30Unit Min.Max.Min.Max.Min.Max.READ CYCLEt RC Read Cycle Time152530ns t AA Address to Data Valid[12]152530ns t OHA Data Hold from Address Change000ns t ACE CE LOW to Data Valid[12]152530ns t DOE OE LOW to Data Valid[12]101520ns t LZOE OE LOW to Low Z[9, 13, 14]333ns t HZOE OE HIGH to High Z[9, 13, 14]101515ns t LZCE CE LOW to Low Z[9, 13, 14]355ns t HZCE CE HIGH to High Z[9, 13, 14]101515ns t PU CE LOW to Power-Up[9]000ns t PD CE HIGH to Power-Down[9]152525ns WRITE CYCLE[15]t WC Write Cycle Time152530ns t SCE CE LOW to Write End122025ns t AW Address Set-Up to Write End122025ns t HA Address Hold from Write End222ns t SA Address Set-Up to Write Start000ns t PWE R/W Pulse Width121525ns t SD Data Set-Up to Write End101515ns t HD Data Hold from Write End000ns t HZWE R/W LOW to High Z[14]101515ns t LZWE R/W HIGH to Low Z[14]000ns Shaded areas contain preliminary information.Note:11.Test conditions assume signal transition times of 5 ns or less, timing reference levels of 1.5V, input pulse levels of 0 to 3.0V and output loading of the specifiedI OL/I OH, and 30-pF load capacitance.12.AC Test Conditions use V OH = 1.6V and V OL = 1.4V.13.At any given temperature and voltage condition for any given device, t HZCE is less than t LZCE and t HZOE is less than t LZOE.14.t LZCE, t LZWE, t HZOE, t LZOE, t HZCE and t HZWE are tested with C L = 5pF as in part (b) of AC Test Loads. Transition is measured ±500 mV from steady state voltage.15.The internal write time of the memory is defined by the overlap of CS LOW and R/W LOW. Both signals must be low to initiate a write and either signal canterminate a write by going high. The data input set-up and hold timing should be referenced to the rising edge of the signal that terminates the write.BUSY/INTERRUPT TIMING t BLA BUSY LOW from Address Match 152020ns t BHA BUSY HIGH from Address Mismatch [16]152020ns t BLC BUSY LOW from CE LOW 152020ns t BHC BUSY HIGH from CE HIGH [16]152020ns t PS Port Set Up for Priority 555ns t WB [17]R/W LOW after BUSY LOW 000ns t WH R/W HIGH after BUSY HIGH 132030ns t BDD BUSY HIGH to Valid Data152530ns t DDD Write Data Valid to Read Data Valid Note 18Note 18Note 18ns t WDD Write Pulse to Data Delay Note 18Note 18Note 18ns INTERRUPT TIMINGt WINS R/W to INTERRUPT Set Time 152525ns t EINS CE to INTERRUPT Set Time 152525ns t INS Address to INTERRUPT Set Time 152525ns t OINR OE to INTERRUPT Reset Time [16]152525ns t EINR CE to INTERRUPT Reset Time [16]152525ns t INRAddress to INTERRUPT Reset Time [16]152525nsShaded areas contain preliminary information.Note:16.These parameters are measured from the input signal changing, until the output pin goes to a high-impedance state.17.CY7C140/CY7C141 only.18.A write operation on Port A, where Port A has priority, leaves the data on Port B’s outputs undisturbed until one access time after one of the following:BUSY on Port B goes HIGH. Port B’s address is toggled. CE for Port B is toggled.R/W for Port B is toggled during valid read.Switching Characteristics Over the Operating Range [6, 11] (continued)ParameterDescription7C131-15[3]7C141-157C130-25[3]7C131-257C140-257C141-257C130-307C131-307C140-307C141-30UnitMin.Max.Min.Max.Min.Max.Switching Characteristics Over the Operating Range [6,11]Parameter Description7C130-357C131-357C140-357C141-357C130-457C131-457C140-457C141-457C130-557C131-557C140-557C141-55UnitMin.Max.Min.Max.Min.Max.READ CYCLE t RC Read Cycle Time 354555ns t AA Address to Data Valid [12]354555ns t OHA Data Hold from Address Change 0ns t ACE CE LOW to Data Valid [12]354555ns t DOE OE LOW to Data Valid [12]202525ns t LZOE OE LOW to Low Z [9, 13, 14]333ns t HZOE OE HIGH to High Z [9, 13, 14]202025ns t LZCECE LOW to Low Z [9, 13, 14]555nst HZCE CE HIGH to High Z [9, 13, 14]202025ns t PU CE LOW to Power-Up [9]0ns t PD CE HIGH to Power-Down [9]353535ns WRITE CYCLE [15]t WC Write Cycle Time 354555ns t SCE CE LOW to Write End 303540ns t AW Address Set-Up to Write End 303540ns t HA Address Hold from Write End 222ns t SA Address Set-Up to Write Start 000ns t PWE R/W Pulse Width253030ns t SD Data Set-Up to Write End 152020ns t HD Data Hold from Write End 0ns t HZWE R/W LOW to High Z [14]202025ns t LZWE R/W HIGH to Low Z [14]ns BUSY/INTERRUPT TIMINGt BLA BUSY LOW from Address Match 202530ns t BHA BUSY HIGH from Address Mismatch [16]202530ns t BLC BUSY LOW from CE LOW 202530ns t BHC BUSY HIGH from CE HIGH [16]202530ns t PS Port Set Up for Priority 555ns t WB [17]R/W LOW after BUSY LOW 000ns t WH R/W HIGH after BUSY HIGH 303535ns t BDD BUSY HIGH to Valid Data354545ns t DDD Write Data Valid to Read Data Valid Note 18Note 18Note 18ns t WDDWrite Pulse to Data DelayNote 18Note 18Note 18nsINTERRUPT TIMING t WINS R/W to INTERRUPT Set Time 253545ns t EINS CE to INTERRUPT Set Time 253545ns t INS Address to INTERRUPT Set Time 253545ns t OINR OE to INTERRUPT Reset Time [16]253545ns t EINR CE to INTERRUPT Reset Time [16]253545ns t INRAddress to INTERRUPT Reset Time [16]253545nsSwitching Characteristics Over the Operating Range [6,11] (continued)Parameter Description7C130-357C131-357C140-357C141-357C130-457C131-457C140-457C141-457C130-557C131-557C140-557C141-55Unit Min.Max.Min.Max.Min.Max.Switching WaveformsRead Cycle No. 1[19, 20]Read Cycle No. 2[19, 21]Read Cycle No. 3[20]Notes:19.R/W is HIGH for read cycle.20.Device is continuously selected, CE = V IL and OE = V IL .21.Address valid prior to or coincident with CE transition LOW.t RCt AAt OHADATA VALIDPREVIOUS DATA VALIDDATA OUTADDRESSEither Port Address Accesst ACEt LZOEt DOEt HZOEt HZCEDATA VALIDDATA OUTCE OEt LZCEt PUI CC I SBt PDEither Port CE/OE Accesst BHAt BDDVALIDt DDDt WDDADDRESS MATCHADDRESS MATCHR/W R ADDRESS RD INRADDRESS LBUSY LDOUT Lt PSt BLARead with BUSY , Master: CY7C130 and CY7C131t RCt PWEVALIDt HDWrite Cycle No. 1 (OE Three-States Data I/Os—Either Port [15, 22]Write Cycle No. 2 (R/W Three-States Data I/Os—Either Port)[16, 23]Notes:22.PWE or t HZWE + t SD to allow the data I/O pins to enter high impedanceand for data to be placed on the bus for the required t SD .23.If the CE LOW transition occurs simultaneously with or after the R/W LOW transition, the outputs remain in the high-impedance state.Switching Waveforms (continued)t AWt WCDATA VALIDHIGH IMPEDANCEt SCEt SAt PWEt HDt SDt HACER/WADDRESSt HZOEOED OUTDATA INEither Portt AWt WCt SCEt SAt PWEt HDt SDt HZWEt HAHIGH IMPEDANCEDATA VALIDt LZWEADDRESSCER/WDATA OUTDATA INBusy Timing Diagram No. 1 (CE Arbitration)Busy Timing Diagram No. 2 (Address Arbitration)Switching Waveforms (continued)ADDRESS MATCHt PSCE L Valid First:t BLCt BHCADDRESS MATCHt PSt BLCt BHCADDRESS L,RBUSY RCE LCE RBUSY LCE RCE LADDRESS L,RCE R Valid First:Left Address Valid First:ADDRESS MATCHt PSADDRESS LBUSY RADDRESS MISMATCHt RC or t WC t BLA t BHAADDRESS RADDRESS MATCHADDRESS MISMATCHt PSADDRESS LBUSY Lt RC or t WC t BLA t BHAADDRESS RRight Address Valid First:Switching Waveforms (continued)Busy Timing Diagram No. 3Write with BUSY (Slave:CY7C140/CY7C141)CEt PWER/Wt WB t WH BUSYInterrupt Timing Diagrams Switching Waveforms (continued)WRITE 3FFt INSt WCt EINSRight Side Clears INT Rt HAt SAt WINSREAD 3FF t RCt EINRt HAt INTt OINRWRITE 3FEt INSt WCt EINSt HAt SAt WINSRight Side Sets INT LLeft Side Sets INT RLeft Side Clears INT LREAD 3FE t EINRt HAt INRt OINRt RC ADDR RCE LR/W L INT LOE LADDR RR/W R CE RINT LADDR RCE RR/W R INT ROE RADDR LR/W LCE LINT RTypical DC and AC Characteristics1.41.00.44.04.55.05.56.0–55251251.21.01201008060402001.02.03.04.0O U T P U T S O U R C E C U R R E N T (m A )SUPPLY VOLTAGE (V)NORMALIZED SUPPLY CURRENTvs. SUPPLY VOLTAGENORMALIZED SUPPLY CURRENT vs. AMBIENT TEMPERATURE AMBIENT TEMPERATURE (°C)OUTPUT VOLTAGE (V)OUTPUT SOURCE CURRENT vs. OUTPUT VOLTAGE 0.00.80.80.60.6N O R M A L I Z E D I C C , I S BV CC = 5.0V V IN = 5.0V V CC = 5.0V T A = 25°C0I CC1.61.41.21.00.8–55125N O R M A L I Z E D t A ANORMALIZED ACCESS TIME vs. AMBIENT TEMPERATURE AMBIENT TEMPERATURE (°C)1.41.31.21.00.94.04.55.05.56.0N O R M A L I Z E D t A ASUPPLY VOLTAGE (V)NORMALIZED ACCESS TIME vs. SUPPLY VOLTAGE 120140*********0.01.02.03.04.0O U T P U T S I N K C U R R E N T (m A )080OUTPUT VOLTAGE (V)OUTPUT SINK CURRENT vs. OUTPUT VOLTAGE0.60.8 1.251.00.751040N O R M A L I Z E D I C C0.50NORMALIZED I CC vs. CYCLE TIME CYCLE FREQUENCY (MHz)3.02.52.01.50.501.02.03.05.0N O R M A L I Z E D t P C25.030.020.010.05.00200400600800D E L T A t A A (n s )015.00.0SUPPLY VOLTAGE (V)TYPICAL POWER-ON CURRENT vs. SUPPLY VOLTAGE CAPACITANCE (pF)TYPICAL ACCESS TIME CHANGE vs. OUTPUT LOADING4.010001.020300.20.61.2I SB30.20.4251.1V V IN = 0.5VN O R M A L I Z E D I C C , I S BI CCI SB3T A = 25°CV CC = 5.0VV CC = 5.0V T A = 25°CT A = 25°CCC = 4.5V V CC = 4.5V T A = 25°COrdering InformationSpeed(ns)Ordering Code PackageName Package TypeOperatingRange30CY7C130-30PC P2548-Lead (600-Mil) Molded DIP Commercial CY7C130-30PI P2548-Lead (600-Mil) Molded DIP Industrial 35CY7C130-35PC P2548-Lead (600-Mil) Molded DIP Commercial CY7C130-35PI P2548-Lead (600-Mil) Molded DIP Industrial CY7C130-35DMB D2648-Lead (600-Mil) Sidebraze DIP Military45CY7C130-45PC P2548-Lead (600-Mil) Molded DIP Commercial CY7C130-45PI P2548-Lead (600-Mil) Molded DIP Industrial CY7C130-45DMB D2648-Lead (600-Mil) Sidebraze DIP Military55CY7C130-55PC P2548-Lead (600-Mil) Molded DIP Commercial CY7C130-55PI P2548-Lead (600-Mil) Molded DIP Industrial CY7C130-55DMB D2648-Lead (600-Mil) Sidebraze DIP Military15CY7C131-15JC J6952-Lead Plastic Leaded Chip Carrier Commercial CY7C131-15JXC J6952-Lead Pb-Free Plastic Leaded Chip CarrierCY7C131-15NC N5252-Pin Plastic Quad FlatpackCY7C131-15JI J6952-Lead Plastic Leaded Chip Carrier Industrial CY7C131-15JXI J6952-Lead Pb-Free Plastic Leaded Chip Carrier25CY7C131-25JC J6952-Lead Plastic Leaded Chip Carrier Commercial CY7C131-25JXC J6952-Lead Pb-Free Plastic Leaded Chip CarrierCY7C131-25NC N5252-Pin Plastic Quad FlatpackCY7C131-25NXC N5252-Pin Pb-Free Plastic Quad FlatpackCY7C131-25JI J6952-Lead Plastic Leaded Chip Carrier Industrial CY7C131-25NI N5252-Pin Plastic Quad Flatpack30CY7C131-30JC J6952-Lead Plastic Leaded Chip Carrier Commercial CY7C131-30NC N5252-Pin Plastic Quad FlatpackCY7C131-30JI J6952-Lead Plastic Leaded Chip Carrier Industrial 35CY7C131-35JC J6952-Lead Plastic Leaded Chip Carrier Commercial CY7C131-35NC N5252-Pin Plastic Quad FlatpackCY7C131-35JI J6952-Lead Plastic Leaded Chip Carrier Industrial CY7C131-35NI N5252-Pin Plastic Quad Flatpack45CY7C131-45JC J6952-Lead Plastic Leaded Chip Carrier Commercial CY7C131-45NC N5252-Pin Plastic Quad FlatpackCY7C131-45JI J6952-Lead Plastic Leaded Chip Carrier Industrial CY7C131-45NI N5252-Pin Plastic Quad Flatpack55CY7C131-55JC J6952-Lead Plastic Leaded Chip Carrier Commercial CY7C131-55JXC J6952-Lead Pb-Free Plastic Leaded Chip CarrierCY7C131-55NC N5252-Pin Plastic Quad FlatpackCY7C131-55NXC N5252-Pin Pb-Free Plastic Quad FlatpackCY7C131-55JI J6952-Lead Plastic Leaded Chip Carrier Industrial CY7C131-55JXI J6952-Lead Pb-Free Plastic Leaded Chip CarrierCY7C131-55NI N5252-Pin Plastic Quad Flatpack30CY7C140-30PC P2548-Lead (600-Mil) Molded DIP Commercial CY7C140-30PI P2548-Lead (600-Mil) Molded DIP Industrial 35CY7C140-35PC P2548-Lead (600-Mil) Molded DIP Commercial CY7C140-35PI P2548-Lead (600-Mil) Molded DIP Industrial CY7C140-35DMBD2648-Lead (600-Mil) Sidebraze DIP Military 45CY7C140-45PC P2548-Lead (600-Mil) Molded DIP Commercial CY7C140-45PI P2548-Lead (600-Mil) Molded DIP Industrial CY7C140-45DMBD2648-Lead (600-Mil) Sidebraze DIP Military 55CY7C140-55PC P2548-Lead (600-Mil) Molded DIP Commercial CY7C140-55PI P2548-Lead (600-Mil) Molded DIP Industrial CY7C140-55DMBD2648-Lead (600-Mil) Sidebraze DIP Military 15CY7C141-15JC J6952-Lead Plastic Leaded Chip Carrier CommercialCY7C141-15NC N5252-Pin Plastic Quad Flatpack 25CY7C141-25JC J6952-Lead Plastic Leaded Chip Carrier Commercial CY7C141-25JXC J6952-Lead Pb-Free Plastic Leaded Chip Carrier CY7C141-25NC N5252-Pin Plastic Quad Flatpack CY7C141-25JI J6952-Lead Plastic Leaded Chip Carrier Industrial CY7C141-25NIN5252-Pin Plastic Quad Flatpack 30CY7C141-30JC J6952-Lead Plastic Leaded Chip Carrier Commercial CY7C141-30NC N5252-Pin Plastic Quad Flatpack CY7C141-30JIJ6952-Lead Plastic Leaded Chip Carrier Industrial 35CY7C141-35JC J6952-Lead Plastic Leaded Chip Carrier Commercial CY7C141-35NC N5252-Pin Plastic Quad Flatpack CY7C141-35JI J6952-Lead Plastic Leaded Chip Carrier Industrial CY7C141-35NIN5252-Pin Plastic Quad Flatpack 45CY7C141-45JC J6952-Lead Plastic Leaded Chip Carrier Commercial CY7C141-45NC N5252-Pin Plastic Quad Flatpack CY7C141-45JI J6952-Lead Plastic Leaded Chip Carrier Industrial CY7C141-45NIN5252-Pin Plastic Quad Flatpack 55CY7C141-55JC J6952-Lead Plastic Leaded Chip Carrier Commercial CY7C141-55NC N5252-Pin Plastic Quad Flatpack CY7C141-55JI J6952-Lead Plastic Leaded Chip Carrier Industrial CY7C141-55NIN5252-Pin Plastic Quad FlatpackOrdering Information (continued)Speed (ns)Ordering Code Package Name Package TypeOperating RangeMILITARY SPECIFICATIONS Group A Subgroup Testing Note:24.CY7C140/CY7C141 only.DC CharacteristicsParameterSubgroups V OH 1, 2, 3V OL 1, 2, 3V IH 1, 2, 3V IL Max.1, 2, 3I IX 1, 2, 3I OZ 1, 2, 3I CC 1, 2, 3I SB11, 2, 3I SB21, 2, 3I SB31, 2, 3I SB41, 2, 3Switching CharacteristicsParameterSubgroups READ CYCLEt RC 7, 8, 9, 10, 11t AA 7, 8, 9, 10, 11t ACE 7, 8, 9, 10, 11t DOE7, 8, 9, 10, 11WRITE CYCLEt WC 7, 8, 9, 10, 11t SCE 7, 8, 9, 10, 11t AW 7, 8, 9, 10, 11t HA 7, 8, 9, 10, 11t SA 7, 8, 9, 10, 11t PWE 7, 8, 9, 10, 11t SD 7, 8, 9, 10, 11t HD7, 8, 9, 10, 11BUSY/INTERRUPT TIMINGt BLA 7, 8, 9, 10, 11t BHA 7, 8, 9, 10, 11t BLC 7, 8, 9, 10, 11t BHC 7, 8, 9, 10, 11t PS 7, 8, 9, 10, 11t WINS 7, 8, 9, 10, 11t EINS 7, 8, 9, 10, 11t INS 7, 8, 9, 10, 11t OINR 7, 8, 9, 10, 11t EINR 7, 8, 9, 10, 11t INR7, 8, 9, 10, 11BUSY TIMINGt WB [24]7, 8, 9, 10, 11t WH 7, 8, 9, 10, 11t BDD7, 8, 9, 10, 11Package Diagrams48-Lead (600-Mil) Sidebraze DIP D26MIL-STD-1835 D-14 Config. C51-80044 **Document #: 38-06002 Rev. *DPage 18 of 19All products and company names mentioned in this document may be the trademarks of their respective holders.Package Diagrams (continued)51-85020-*A48-Lead (600-Mil) Molded DIP P2551-85042-**52-Lead Pb-Free Plastic Quad Flatpack N5252-Lead Plastic Quad Flatpack N52Document History PageDocument Title: CY7C130/CY7C131/CY7C140/CY7C141 1K x 8 Dual-Port Static RAM Document Number: 38-06002REV.ECN NO.IssueDateOrig. ofChange Description of Change**11016909/29/01SZV Change from Spec number: 38-00027 to 38-06002*A12225512/26/02RBI Power up requirements added to Maximum Ratings Information*B236751See ECN YDT Removed cross information from features section*C325936See ECN RUY Added pin definitions table, 52-pin PQFP package diagram and Pb-freeinformation*D393153See ECN YIM Added CY7C131-15JI to ordering informationAdded Pb-Free parts to ordering information:CY7C131-15JXI。
BZX84C18-V中文资料
Document Number Small Signal Zener DiodesFeatures•These diodes are also available in other case styles and other configurationsincluding: the SOD-123 case with type designation BZT52 series, the dual zenerdiode common anode configuration in the SOT-23case with type designation AZ23 series and the dual zener diode common cathode configuration in the SOT-23 case with type designation DZ23series.•The Zener voltages are graded according to the international E 24 standard. Standard Zener volt-age tolerance is ± 5 %. Replace "C" with "B" for ± 2 % tolerance.•Silicon Planar Power Zener Diodes •Lead (Pb)-free component•Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/ECWeight: approx. 8.8 mgPackaging Codes/Options:GS18 / 10 k per 13" reel (8 mm tape), 10 k/box GS08 / 3 k per 7" reel (8 mm tape), 15 k/boxAbsolute Maximum RatingsT amb = 25°C, unless otherwise specified1) Device on fiberglass substrate, see layout.Thermal CharacteristicsT amb = 25°C, unless otherwise specified1)Device on fiberglass substrate, see layout.ParameterT est condition Symbol Value Unit Power dissipationP tot300 1)mWParameterTest condition Symbol Value Unit Thermal resistance junction to ambient air R thJA 420 1)°C/W Junction temperature T j 150°C Storage temperature rangeT S- 65 to + 150°CElectrical CharacteristicsPartnumber MarkingCodeZenerVoltageRangeDynamic Resistance T estCurrentTemp.Coefficientof ZenerVoltageTestCurrentReverse LeakageCurrentV Z @ I ZT1r zj @ I ZT1r zj @ I ZT2I ZT1αVZ @ I ZT1I ZT2I R@ V R VΩmA10-4/°C mAµA Vmin max min maxBZX84C2V4-V Z11 2.2 2.670 (≤100)2755-9.0-4.01501 BZX84C2V7-V Z12 2.5 2.975 (≤100)300 (≤600)5-9.0-4.01201 BZX84C3V0-V Z13 2.8 3.280 (≤95)325 (≤600)5-9.0-3.01101 BZX84C3V3-V Z14 3.1 3.585 (≤95)350 (≤600)5-8.0-3.0151 BZX84C3V6-V Z15 3.4 3.885 (≤90)375 (≤600)5-8.0-3.0151 BZX84C3V9-V Z16 3.7 4.185 (≤90)400 (≤600)5-7.0-3.0131 BZX84C4V3-V Z174 4.680 (≤90)410 (≤600)5-6.0-1.0131 BZX84C4V7-V Z1 4.4550 (≤80)425 (≤500)5-5.0+2.0132 BZX84C5V1-V Z2 4.8 5.440 (≤60)400 (≤480)5-3.0+4.0122 BZX84C5V6-V Z3 5.2615 (≤40)80 (≤400)5-2.0+6.0112 BZX84C6V2-V Z4 5.8 6.6 6.0 (≤10)40 (≤150)5-1.0+7.0134 BZX84C6V8-V Z5 6.47.2 6.0 (≤15)30 (≤80)5+2.0+7.0124 BZX84C7V5-V Z677.9 6.0 (≤15)30 (≤80)5+3.0+7.0115 BZX84C8V2-V Z77.78.7 6.0 (≤15)40 (≤80)5+4.0+7.010.75 BZX84C9V1-V Z88.59.6 6.0 (≤15)40 (≤100)5+5.0+8.010.56 BZX84C10-V Z99.410.68.0 (≤20)50 (≤150)5+5.0+8.010.27 BZX84C11-V Y110.411.610 (≤20)50 (≤150)5+5.0+9.010.18 BZX84C12-V Y211.412.710 (≤25)50 (≤150)5+6.0+9.010.18 BZX84C13-V Y312.414.110 (≤30)50 (≤170)5+7.0+9.010.18 BZX84C15-V Y413.815.610 (≤30)50 (≤200)5+7.0+9.010.050.7 V Znom.BZX84C16-V Y515.317.110 (≤40)50 (≤200)5+8.0+9.510.050.7 V Znom.BZX84C18-V Y616.819.110 (≤45)50 (≤225)5+8.0+9.510.050.7 V Znom.BZX84C20-V Y718.821.215 (≤55)60 (≤225)5+8.0+1010.050.7 V Znom.BZX84C22-V Y820.823.320 (≤55)60 (≤250)5+8.0+1010.050.7 V Znom.BZX84C24-V Y922.825.625 (≤70)60 (≤250)5+8.0+1010.050.7 V Znom.BZX84C27-V Y1025.128.925 (≤80)65 (≤300)2+8.0+100.50.050.7 V Znom.BZX84C30-V Y11283230 (≤80)70 (≤300)2+8.0+100.50.050.7 V Znom.BZX84C33-V Y12313535 (≤80)75 (≤325)2+8.0+100.50.050.7 V Znom.BZX84C36-V Y13343835 (≤90)80 (≤350)2+8.0+100.50.050.7 V Znom.BZX84C39-V Y14374140 (≤130)80 (≤350)2+10+120.50.050.7 V Znom.BZX84C43-V Y15404645 (≤150)85 (≤375)2+10+120.50.050.7 V Znom.BZX84C47-V Y16445050 (≤170)85 (≤375)2+10+120.50.050.7 V Znom.BZX84C51-V Y17485460 (≤180)85 (≤400)2+10+120.50.050.7 V Znom.BZX84C56-V Y18526070 (≤200)100 (≤425)2+9.0+110.50.050.7 V Znom.BZX84C62-V Y19586680 (≤215)100 (≤450)2+9.0+120.50.050.7 V Znom.BZX84C68-V Y20647290 (≤240)150 (≤475)2+10+120.50.050.7 V Znom.BZX84C75-V Y21707995 (≤255)170 (≤500)2+10+120.50.050.7 V Znom. Document Number 85763Document Number Electrical CharacteristicsPartnumberMarking CodeZener Voltage Range Dynamic ResistanceTest CurrentT emp. Coefficient of Zener Voltage T est CurrentReverse LeakageCurrentV Z @ I ZT1r zj @ I ZT1r zj @ I ZT2I ZT1αVZ @ I ZT1I ZT2I R @ V R V ΩmA10-4/°C mAµAVminmax min max BZX84B2V4-V Z50 2.35 2.4570 (≤100)2755-9-41501BZX84B2V7-V Z51 2.65 2.7575 (≤100)300 (≤600)5-9-41201BZX84B3V0-V Z52 2.94 3.0680 (≤95)325 (≤600)5-9-31101BZX84B3V3-V Z53 3.23 3.3785 (≤95)350 (≤600)5-8-3151BZX84B3V6-V Z54 3.53 3.6785 (≤90)375 (≤600)5-8-3151BZX84B3V9-V Z55 3.82 3.9885 (≤90)400 (≤600)5-7-3131BZX84B4V3-V Z56 4.21 4.3980 (≤90)410 (≤600)5-6-1131BZX84B4V7-V Z57 4.61 4.7950 (≤80)425 (≤500)5-52132BZX84B5V1-V Z585 5.240 (≤60)400 (≤480)5-34122BZX84B5V6-V Z59 5.49 5.7115 (≤40)80 (≤400)5-26112BZX84B6V2-V Z60 6.08 6.32 6.0 (≤10)40 (≤150)5-17134BZX84B6V8-V Z61 6.66 6.94 6.0 (≤15)30 (≤80)527124BZX84B7V5-V Z627.357.65 6.0 (≤15)30 (≤80)537115BZX84B8V2-V Z638.048.36 6.0 (≤15)40 (≤80)54710.75BZX84B9V1-V Z648.929.28 6.0 (≤15)40 (≤100)55810.56BZX84B10-V Z659.810.28.0 (≤20)50 (≤150)55810.27BZX84B11-V Z6610.811.210 (≤20)50 (≤150)55910.18BZX84B12-V Z6711.812.210 (≤25)50 (≤150)56910.18BZX84B13-V Z6812.713.310 (≤30)50 (≤170)57910.18BZX84B15-V Z6914.715.310 (≤30)50 (≤200)57910.050.7 V Znom.BZX84B16-V Z7015.716.310 (≤40)50 (≤200)589.510.050.7 V Znom.BZX84B18-V Z7117.618.410 (≤45)50 (≤225)589.510.050.7 V Znom.BZX84B20-V Z7219.620.415 (≤55)60 (≤225)581010.050.7 V Znom.BZX84B22-V Z7321.622.420 (≤55)60 (≤250)581010.050.7 V Znom.BZX84B24-V Z7423.524.525 (≤70)60 (≤250)581010.050.7 V Znom.BZX84B27-V Z7526.527.525 (≤80)65 (≤300)28100.50.050.7 V Znom.BZX84B30-V Z7629.430.630 (≤80)70 (≤300)28100.50.050.7 V Znom.BZX84B33-V Z7732.333.735 (≤80)75 (≤325)28100.50.050.7 V Znom.BZX84B36-V Z7835.336.735 (≤90)80 (≤350)28100.50.050.7 V Znom.BZX84B39-V Z7938.239.840 (≤130)80 (≤350)210120.50.050.7 V Znom.BZX84B43-V Z8042.143.945 (≤150)85 (≤375)210120.50.050.7 V Znom.BZX84B47-V Z8146.147.950 (≤170)85 (≤375)210120.50.050.7 V Znom.BZX84B51-V Z82505260 (≤180)85 (≤400)210120.50.050.7 V Znom.BZX84B56-V Z8354.957.170 (≤200)100 (≤425)29110.50.050.7 V Znom.BZX84B62-V Z8460.863.280 (≤215)100 (≤450)29120.50.050.7 V Znom.BZX84B68-V Z8566.669.490 (≤240)150 (≤475)210120.50.050.7 V Znom.BZX84B75-VZ8673.576.595 (≤255)170 (≤500)210120.50.050.7 V Znom. Document Number 85763Typical Characteristics (Tamb = 25 °C unless otherwise specified)Figure 1. Forward characteristics Figure 2. Admissible Power Dissipation vs. Ambient Temperature Figure3. Pulse Thermal Resistance vs. Pulse Duration1811418115Figure 4. Dynamic Resistance vs. Zener CurrentFigure 5. Capacitance vs. Zener VoltageFigure6. Dynamic Resistance vs. Zener Current1811718118Document Number Figure 7. Dynamic Resistance vs. Zener CurrentFigure 8. Thermal Differential Resistance vs. Zener Voltage Figure9. Dynamic Resistance vs. Zener Voltage18120Figure 10. Temperature Dependence of Zener Voltage vs. ZenerVoltageFigure 11. Change of Zener Voltage vs. Junction TemperatureFigure 12. Temperature Dependence of Zener Voltage vs. ZenerVoltage18124°C18136 Document Number 85763Figure 13. Change of Zener Voltage vs. Junction TemperatureFigure 14. Change of Zener voltage from turn-on up to the point ofthermal equilibrium vs. Zener voltageFigure 15. Change of Zener voltage from turn-on up to the point ofthermal equilibrium vs. Zener voltage181261813718138Document Number Figure 16. Breakdown CharacteristicsFigure17. Breakdown Characteristics1811118112 Document Number 85763Layout for R Theta;JA testThickness: Fiberglass 0.059 in. (1.5 mm)Copper leads 0.012 in. (0.3 mm)Figure18. Breakdown Characteristics18113Package Dimensions in mm (Inches)Document Number Ozone Depleting Substances Policy StatementIt is the policy of Vishay Semiconductor GmbH to1.Meet all present and future national and international statutory requirements.2.Regularly and continuously improve the performance of our products, processes, distribution and operatingsystems with respect to their impact on the health and safety of our employees and the public, as well as their impact on the environment.It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as ozone depleting substances (ODSs).The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs and forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban on these substances.Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the use of ODSs listed in the following documents.1.Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendmentsrespectively2.Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the EnvironmentalProtection Agency (EPA) in the USA3.Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively. Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain such substances.We reserve the right to make changes to improve technical designand may do so without further notice.Parameters can vary in different applications. All operating parameters must be validated for each customer application by the customer. Should the buyer use Vishay Semiconductors products for any unintended or unauthorized application, the buyer shall indemnify Vishay Semiconductors against all claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal damage, injury or death associated with such unintended or unauthorized use.Vishay Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany Document Number 85763。
CY7C024AV-20AC中文资料
3.3V 4K/8K/16K x 16/18 Dual-Port Static RAMCY7C024AV/025AV/026AV CY7C0241AV/0251AV/036AVFeatures•True dual-ported memory cells which allowsimultaneous access of the same memory location •4/8/16K × 16 organization (CY7C024AV/025AV/026AV)•4/8K × 18 organization (CY7C0241AV/0251AV)•16K × 18 organization (CY7C036AV)•0.35-micron CMOS for optimum speed/power •High-speed access: 20 and 25 ns •Low operating power—Active: I CC = 115 mA (typical)—Standby: I SB3 = 10 µA (typical)•Fully asynchronous operation •Automatic power-down•Expandable data bus to 32/36 bits or more using Master/Slave chip select when using more than one device•On-chip arbitration logic•Semaphores included to permit software handshaking between ports•INT flag for port-to-port communication •Separate upper-byte and lower-byte control •Pin select for Master or Slave•Commercial and industrial temperature ranges •Available in 100-pin TQFPNotes:1.I/O 8–I/O 15 for x16 devices; I/O 9–I/O 17 for x18 devices.2.I/O 0–I/O 7 for x16 devices; I/O 0–I/O 8 for x18 devices.3.A 0–A 11 for 4K devices; A 0–A 12 for 8K devices; A 0–A 13 for 16K devices.4.BUSY is an output in master mode and an input in slave mode.R/W L OE LI/O 8/9L –I/O 15/17LI/O Control Address DecodeA 0L –A 11/12/13L CE L OE L R/W LBUSY L I/O ControlCE L Interrupt Semaphore ArbitrationSEM L INT L M/SUB LLB L I/O 0L –I/O 7/8LR/W R OE RI/O 8/9L –I/O 15/17RCE R UB RLB R I/O 0L –I/O 7/8RUB L LB LLogic Block DiagramA 0L –A 11/1213LTrue Dual-Ported RAM Array A 0R –A 11/12/13RCE R OE R R/W R BUSY R SEM RINT R UB R LB RAddress DecodeA 0R –A 11/12/13R[1][1][2][2][4][4]12/13/148/98/912/13/148/98/912/13/1412/13/14[3][3][3][3]Pin ConfigurationsNotes:5.A12L on the CY7C025AV.6.A12R on the CY7C025AV.Top View100-Pin TQFP100 9997989623142415960611213151416454039959417269108761127283029313235343637383367666465636268697075737472718988868785939284NCNCNCNCA5LA4LINT LA2LA0LLGNDINT RA0RA1L NCNCNCNCI/O10LI/O11LI/O15LV CCGNDI/O1RI/O2RV CC9091A3LM/SR I/O14LGNDI/O12LI/O13LA1RA2RA3RA4RNCNCNCNCI/O3RI/O4RI/O5RI/O6RNCNCNCNC18192021222324258382818079787776585756555453525143444546 47484950I/O9LI/O8LI/O7LI/O6LI/O5LI/O4LI/O3LI/O2LGNDI/O1LI/OLOELSEM LVCCCELUBLLBLNCA11LA1LA9LA8LA7LA6LI/O0RI/O7RI/O8RI/O9RI/O1RI/O11RI/O12RI/O13RI/O14RGNDI/O15RŒRRWRGNDSEMRCERUBRLBRNCA11RA1RA9RA8RA7RA6RA5RCY7C024AV (4K × 16)R/W L[5][6CY7C025AV (8K × 16)Notes:7.A 12L on the CY7C0251AV.8.A 12R on the CY7C0251AVC.Pin Configurations (continued)Top View100-Pin TQFP100 9997989623142415960611213151416454039959417269108761127283029313235343637383367666465636268697075737472718988868785939284NC NC NC NC A 5L A 4L INT L A 2L A 0L BUSY L GND INT R A 0R A 1L NC NC I/O 11L I/O 12L I/O 16L V CC GND I/O 1R I/O 2R V CC 9091A 3L M/S BUSY R I/O 15L GND I/O 13L I/O 14L A 1R A 2R A 3R A 4R NC NC NC NCI/O 3R I/O 4R I/O 5R I/O 6R NC NC18192021222324258382818079787776585756555453525143444546 47484950I /O 9LI /O 7LI /O 6LI /O 5LI /O 4LI /O 3LI /O 2LI /O 10LG N DI /O 1LI /O 0LO E LS E M LV C CC E LU B LL B LN C A 11LA 10LA 9LA 8LA 7LA 6LI/O 0R I /O 7RI /O 16RI /O 9RI /O 10RI /O 11RI /O 12RI /O 13RI /O 14RG N D I /O 15RO E RR W R G N D S E M R C E R U B R L B R N C A 11R A 10R A 9R A 8RA 7R A 6RA 5RCY7C0241AV (4K × 18)I/O 8L I/O 17L I/O 8R I/O 17RR /W L[8][7]1329291908485878688898382817678777980939495969798991005960616766646563626869707573747271NC NC NC A6L A5L A4L INTL A2L A0L GND M/S A0R A1R A1L A3L BUSYR INTR A2R A3R A4R A5R NC NC NCBUSYL 5857565554535251CY7C026AV (16K × 16)NC NC NC NC I/O10L I/O11L I/O15L I/O13L I/O14L GND I/O0R VCC I/O3R GND I/O12L I/O1R I/O2R I/O4R I/O5R I/O6R NC NC NC NCVCC 17161591012111314876451819202122232425I /O 9L I /O 8L I /O 7L I /O 6L I /O 5L I /O 4L I /O 0L I /O 2L I /O 1L V C C R W L U B L L B L G N D I /O 3L S E M L C E L A 113L A 12L A 11L A 10L A 9L A 8L A 7LO E L 3435364241394038374344455048494746A 6R A 7R A 8R A 9R A 10R A 11R C E R A 13R U B R G N D R W R G N D I /O 14R L B R A 12R O E R I /O 15R I /O 13R I /O 12R I /O 11R I /O 10R I /O 9R I /O 8R I /O 7R S E M R 3332313029282726CY7C0251AV (8K × 18)Pin Configurations (continued)Top View100-Pin TQFP 100 9997989623142415960611213151416454039959417269108761127283029313235343637383367666465636268697075737472718988868785939284NC NC NC A 5L A 4L INT L A 2L A 0L BUSY L GND INT R A 0R A 1L NC NC I/O 11L I/O 12L I/O 16L V CC GND I/O 1R I/O 2R V CC 9091A 3L R I/O 15L GND I/O 13L I/O 14L A 1R A 2R A 3R A 4R NC NC NCI/O 3R I/O 4R I/O 5R I/O 6R NC NC18192021222324258382818079787776585756555453525143444546 47484950I /O 9LI /O 7LI /O 6LI /O 5LI /O 4LI /O 3LI /O 2LI /O 10LG N DI /O 1LI /O 0LO E LS E M LV C CC E LU B LL B L A 11LA 10LA 9LA 8LA 7L A 6LI/O 0R I /O 7RI /O 16RI /O 9RI /O 10RI /O 11RI /O 12RI /O 13RI /O 14RG N D I /O 15RO E R R W R G N D S E M RC E RU B RL B RA 11RA 10RA 9R A 8RA 7RA 6RA 5RI/O 8L I/O 17L I/O 8R I/O 17RR /W LCY7C036AV (16K × 18)A 13L A 13R A 12LA 12RSelection GuideCY7C024AV/025AV/026AV CY7C0241AV/0251AV/036AV-20CY7C024AV/025AV/026AV CY7C0241AV/0251AV/036AV-25Unit Maximum Access Time 2025ns Typical Operating Current 120115mA Typical Standby Current for I SB1(Both ports TTL Level)3530mA Typical Standby Current for I SB3(Both ports CMOS Level)1010µAArchitectureThe CY7C024AV/025AV/026AV and CY7C0241AV/0251AV/ 036AV consist of an array of 4K, 8K, and 16K words of 16 and 18 bits each of dual-port RAM cells, I/O and address lines, and control signals (CE, OE, R/W). These control pins permit independent access for reads or writes to any location in memory. To handle simultaneous writes/reads to the same location, a BUSY pin is provided on each port. Two Interrupt (INT) pins can be utilized for port-to-port communication. Two Semaphore (SEM) control pins are used for allocating shared resources. With the M/S pin, the devices can function as a master (BUSY pins are outputs) or as a slave (BUSY pins are inputs). The devices also have an automatic power-down feature controlled by CE. Each port is provided with its own output enable control (OE), which allows data to be read from the device.Functional DescriptionThe CY7C024AV/025AV/026AV and CY7C0241AV/0251AV /036AV are low-power CMOS 4K, 8K, and 16K ×16/18 dual-port static RAMs. Various arbitration schemes are included on the devices to handle situations when multiple processors access the same piece of data. Two ports are provided, permitting independent, asynchronous access for reads and writes to any location in memory. The devices can be utilized as standalone 16/18-bit dual-port static RAMs or multiple devices can be combined in order to function as a 32/36-bit or wider master/slave dual-port static RAM. An M/S pin is provided for implementing 32/36-bit or wider memory applications without the need for separate master and slave devices or additional discrete logic. Application areas include interprocessor/multiprocessor designs, communications status buffering, and dual-port video/graphics memory. Each port has independent control pins: Chip Enable (CE), Read or Write Enable (R/W), and Output Enable (OE). Two flags are provided on each port (BUSY and INT). BUSY signals that the port is trying to access the same location currently being accessed by the other port. The Interrupt flag (INT) permits communication between ports or systems by means of a mail box. The semaphores are used to pass a flag, or token, from one port to the other to indicate that a shared resource is in use. The semaphore logic is comprised of eight shared latches. Only one side can control the latch (semaphore) at any time. Control of a semaphore indicates that a shared resource is in use. An automatic power-down feature is controlled independently on each port by a Chip Select (CE) pin.The CY7C024AV/025AV/026AV and CY7C0241AV/0251AV/ 036AV are available in 100-pin Thin Quad Plastic Flatpacks (TQFP).Write OperationData must be set up for a duration of t SD before the rising edge of R/W in order to guarantee a valid write. A write operation is controlled by either the R/W pin (see Write Cycle No. 1 waveform) or the CE pin (see Write Cycle No. 2 waveform). Required inputs for non-contention operations are summarized in Table1.If a location is being written to by one port and the opposite port attempts to read that location, a port-to-port flowthrough delay must occur before the data is read on the output; otherwise the data read is not deterministic. Data will be valid on the port t DDD after the data is presented on the other port. Read OperationWhen reading the device, the user must assert both the OE and CE pins. Data will be available t ACE after CE or t DOE after OE is asserted. If the user wishes to access a semaphore flag, then the SEM pin must be asserted instead of the CE pin, and OE must also be asserted.Pin DefinitionsLeft Port Right Port DescriptionCE L CE R Chip Enable.R/W L R/W R Read/Write Enable.OE L OE R Output Enable.A0L–A13L A0R–A13R Address (A0–A11 for 4K devices; A0–A12 for 8K devices; A0–A13 for16K).I/O0L–I/O17L I/O0R–I/O17R Data Bus Input/Output.SEM L SEM R Semaphore Enable.UB L UB R Upper Byte Select (I/O8–I/O15 for x16 devices; I/O9–I/O17 for x18devices).LB L LB R Lower Byte Select (I/O0–I/O7 for x16 devices; I/O0–I/O8 for x18devices).INT L INT R Interrupt Flag.BUSY L BUSY R Busy Flag.M/S Master or Slave Select.V CC Power.GND Ground.NC No Connect.InterruptsThe upper two memory locations may be used for message passing. The highest memory location (FFF for the CY7C024AV/41AV, 1FFF for the CY7C025AV/51AV, 3FFF for the CY7C026AV/36AV) is the mailbox for the right port and the second-highest memory location (FFE for the CY7C024AV/ 41AV, 1FFE for the CY7C025AV/51AV, 3FFE for the CY7C026AV/36AV) is the mailbox for the left port. When one port writes to the other port’s mailbox, an interrupt is generated to the owner. The interrupt is reset when the owner reads the contents of the mailbox. The message is user defined.Each port can read the other port’s mailbox without resetting the interrupt. The active state of the busy signal (to a port) prevents the port from setting the interrupt to the winning port. Also, an active busy to a port prevents that port from reading its own mailbox and, thus, resetting the interrupt to it.If an application does not require message passing, do not connect the interrupt pin to the processor’s interrupt request input pin.The operation of the interrupts and their interaction with Busy are summarized in Table2.BusyThe CY7C024AV/025AV/026AV and CY7C0241AV/0251AV/ 036AV provide on-chip arbitration to resolve simultaneous memory location access (contention). If both ports’ CEs are asserted and an address match occurs within t PS of each other, the busy logic will determine which port has access. If t PS is violated, one port will definitely gain permission to the location, but it is not predictable which port will get that permission. BUSY will be asserted t BLA after an address match or t BLC after CE is taken LOW.Master/SlaveA M/S pin is provided in order to expand the word width by configuring the device as either a master or a slave. The BUSY output of the master is connected to the BUSY input of the slave. This will allow the device to interface to a master device with no external components. Writing to slave devices must be delayed until after the BUSY input has settled (t BLC or t BLA), otherwise, the slave chip may begin a write cycle during a contention situation. When tied HIGH, the M/S pin allows the device to be used as a master and, therefore, the BUSY line is an output. BUSY can then be used to send the arbitration outcome to a slave.Semaphore OperationThe CY7C024AV/025AV/026AV and CY7C0241AV/0251AV/ 036AV provide eight semaphore latches, which are separate from the dual-port memory locations. Semaphores are used to reserve resources that are shared between the two ports. The state of the semaphore indicates that a resource is in use. For example, if the left port wants to request a given resource, it sets a latch by writing a zero to a semaphore location. The left port then verifies its success in setting the latch by reading it. After writing to the semaphore, SEM or OE must be deasserted for t SOP before attempting to read the semaphore. The semaphore value will be available t SWRD + t DOE after the rising edge of the semaphore write. If the left port was successful (reads a zero), it assumes control of the shared resource, otherwise (reads a one) it assumes the right port has control and continues to poll the semaphore. When the right side has relinquished control of the semaphore (by writing a one), the left side will succeed in gaining control of the semaphore. If the left side no longer requires the semaphore, a one is written to cancel its request.Semaphores are accessed by asserting SEM LOW. The SEM pin functions as a chip select for the semaphore latches (CE must remain HIGH during SEM LOW). A0–2 represents the semaphore address. OE and R/W are used in the same manner as a normal memory access. When writing or reading a semaphore, the other address pins have no effect.When writing to the semaphore, only I/O0 is used. If a zero is written to the left port of an available semaphore, a one will appear at the same semaphore address on the right port. That semaphore can now only be modified by the side showing zero (the left port in this case). If the left port now relinquishes control by writing a one to the semaphore, the semaphore will be set to one for both sides. However, if the right port had requested the semaphore (written a zero) while the left port had control, the right port would immediately own the semaphore as soon as the left port released it. Table 3 shows sample semaphore operations.When reading a semaphore, all sixteen/eighteen data lines output the semaphore value. The read value is latched in an output register to prevent the semaphore from changing state during a write from the other port. If both ports attempt to access the semaphore within t SPS of each other, the semaphore will definitely be obtained by one side or the other, but there is no guarantee which side will control the semaphore.Table 1.Non-Contending Read/WriteInputs OutputsCE R/W OE UB LB SEM I/O9–I/O17I/O0–I/O8OperationH X X X X H High Z High Z Deselected: Power-DownX X X H H H High Z High Z Deselected: Power-Down L L X L H H Data In High Z Write to Upper Byte Only L L X H L H High Z Data In Write to Lower Byte Only L L X L L H Data In Data In Write to Both BytesL H L L H H Data Out High Z Read Upper Byte OnlyL H L H L H High Z Data Out Read Lower Byte OnlyL H L L L H Data Out Data Out Read Both BytesX X H X X X High Z High Z Outputs DisabledH H L X X L Data Out Data Out Read Data in Semaphore FlagX H L H H L Data Out Data Out Read Data in Semaphore FlagH X X X L Data In Data In Write D IN0 into Semaphore FlagX X H H L Data In Data In Write D IN0 into Semaphore Flag L X X L X L Not AllowedL X X X L L Not AllowedTable 2.Interrupt Operation Example (assumes BUSY L = BUSY R = HIGH)[9]Left Port Right Port Function R/W L CE L OE L A0L–13L INT L R/W R CE R OE R A0R–13R INT R Set Right INT R Flag L L X FFF[12]X X X X X L[11] Reset Right INT R Flag X X X X X X L L FFF (or 1/3FFF)H[10] Set Left INT L Flag X X X X L[10]L L X1FFE (or 1/3FFE)X Reset Left INT L Flag X L L1FFE[12]H[11]X X X X X Table 3.Semaphore Operation ExampleFunction I/O0–I/O17 Left I/O0–I/O17 Right StatusNo action11Semaphore-freeLeft port writes 0 to semaphore01Left Port has semaphore tokenRight port writes 0 to semaphore01No change. Right side has no write access to semaphore Left port writes 1 to semaphore10Right port obtains semaphore tokenLeft port writes 0 to semaphore10No change. Left port has no write access to semaphore Right port writes 1 to semaphore01Left port obtains semaphore tokenLeft port writes 1 to semaphore11Semaphore-freeRight port writes 0 to semaphore10Right port has semaphore tokenRight port writes 1 to semaphore11Semaphore freeLeft port writes 0 to semaphore01Left port has semaphore tokenLeft port writes 1 to semaphore11Semaphore-freeNotes:9.See Functional Description for specific highest memory locations by device.10.If BUSY R=L, then no change.11.If BUSY L=L, then no change.12.See Functional Description for specific addresses by device.Maximum Ratings [13](Above which the useful life may be impaired. For user guide-lines, not tested.)Storage Temperature .................................–65°C to +150°C Ambient Temperature withPower Applied.............................................–55°C to +125°C Supply Voltage to Ground Potential...............–0.5V to +4.6V DC Voltage Applied toOutputs in High-Z State..........................–0.5V to V CC + 0.5V DC Input Voltage[14]...............................–0.5V to V CC + 0.5V Output Current into Outputs (LOW).............................20 mA Static Discharge Voltage.......................................... > 2001V Latch-up Current.................................................... > 200 mA Operating RangeRange Ambient Temperature V CC Commercial0°C to +70°C 3.3V ± 300 mV Industrial[15]–40°C to +85°C 3.3V ± 300 mVElectrical Characteristics Over the Operating RangeParameter DescriptionCY7C024AV/025AV/026AVCY7C0241AV/0251AV/036AVUnit -20-25Min.Typ.Max.Min.Typ.Max.V OH Output HIGH Voltage (V CC=3.3V) 2.4 2.4V V OL Output LOW Voltage0.40.4V V IH Input HIGH Voltage 2.0 2.0V V IL Input LOW Voltage0.80.8V I OZ Output Leakage Current–1010–1010µA I IX Input Leakage Current–1010–1010µAI CC Operating Current (V CC = Max., I OUT=0mA) Outputs Disabled Com’l.120175115165mA Ind.[15]135185mAI SB1Standby Current (Both Ports TTL Level)CE L & CE R≥ V IH, f = f MAX Com’l.35453040mA Ind.[15]4050mAI SB2Standby Current (One Port TTL Level) CE L| CE R≥ V IH, f = f MAX Com’l.751106595mA Ind.[15]75105mAI SB3Standby Current (Both Ports CMOS Level)CE L & CE R≥ V CC−0.2V, f = 0Com’l.1050010500µA Ind.[15]10500µAI SB4Standby Current (One Port CMOS Level)CE L | CE R≥ V IH, f = f MAX[16]Com’l.70956080mA Ind.[15]7090mACapacitance[17]Parameter Description Test Conditions Max.UnitC IN Input Capacitance T A = 25°C, f = 1 MHz,V CC = 3.3V 10pFC OUT Output Capacitance10pF Notes:13.The Voltage on any input or I/O pin can not exceed the power pin during power-up.14.Pulse width < 20 ns.15.Industrial parts are available in CY7C026AV and CY7C036AV only.16.f MAX = 1/t RC = All inputs cycling at f = 1/t RC (except output enable). f = 0 means no address or control lines change. This applies only to inputs at CMOS level standby I SB3.17.Tested initially and after any design or process changes that may affect these parameters.AC Test Loads and Waveforms3.0V GND90%90%10%3ns3ns10%ALL INPUT PULSES(a)Normal Load (Load 1)R1=590Ω3.3VOUTPUT R2=435ΩC =30pFV TH =1.4VOUTPUTC =30pF(b)Thévenin Equivalent (Load 1)(c)Three-State Delay (Load 2)R1=590ΩR2=435Ω3.3VOUTPUTC =5pFR TH =250Ω≤≤including scope and jig)(Used for t LZ , t HZ , t HZWE , and t LZWE Switching Characteristics Over the Operating Range [18]Parameter DescriptionCY7C024AV/025AV/026AV CY7C0241AV/0251AV/036AV Unit-20-25Min.Max.Min.Max.Read Cycle t RC Read Cycle Time 2025ns t AA Address to Data Valid2025ns t OHA Output Hold From Address Change 33ns t ACE [19]CE LOW to Data Valid 2025ns t DOEOE LOW to Data Valid 1213ns t LZOE [20, 21, 22]OE Low to Low Z 33ns t HZOE [20, 21, 22]OE HIGH to High Z 1215ns t LZCE [20, 21, 22]CE LOW to Low Z 33ns t HZCE [20, 21, 22]CE HIGH to High Z 1215ns t PU [22]CE LOW to Power-Up 0ns t PD [22]CE HIGH to Power-Down 2025ns t ABE [19]Byte Enable Access Time2025nsWrite Cycle t WC Write Cycle Time 2025ns t SCE [19]CE LOW to Write End 1520ns t AW Address Valid to Write End 1520ns t HA Address Hold From Write End 00ns t SA [19]Address Set-up to Write Start 00ns t PWE Write Pulse Width 1520ns t SDData Set-up to Write End1515nsNotes:18.Test conditions assume signal transition time of 3 ns or less, timing reference levels of 1.5V, input pulse levels of 0 to 3.0V, and output loading of the specifiedI OI /I OH and 30-pF load capacitance.19.SCE time.20.At any given temperature and voltage condition for any given device, t HZCE is less than t LZCE and t HZOE is less than t LZOE .21.Test conditions used are Load 3.22.This parameter is guaranteed but not tested. For information on port-to-port delay through RAM cells from writing port to reading port, refer to Read Timingwith Busy waveform.Data Retention ModeThe CY7C024AV/025AV/ 026AV and CY7C0241AV/ 0251AV/036AV are designed with battery backup in mind. Data retention voltage and supply current are guaranteed over temperature. The following rules ensure data retention:1.Chip Enable (CE) must be held HIGH during data retention, within V CC to V CC – 0.2V.2.CE must be kept between V CC – 0.2V and 70% of V CC during the power-up and power-down transitions.3.The RAM can begin operation >t RC after V CC reaches the minimum operating voltage (3.0V).Notes:23.For information on port-to-port delay through RAM cells from writing port to reading port, refer to Read Timing with Busy waveform.24.Test conditions used are Load 2.25.t BDD is a calculated parameter and is the greater of t WDD –t PWE (actual) or t DDD –t SD (actual).26.CE = V CC , V in = GND to V CC , T A = 25°C. This parameter is guaranteed but not tested.t HDData Hold From Write Endns t HZWE [21, 22]R/W LOW to High Z 1215ns t LZWE [21, 22]R/W HIGH to Low Z3ns t WDD [23]Write Pulse to Data Delay4550ns t DDD [23]Write Data Valid to Read Data Valid 3035ns Busy Timing [24]t BLA BUSY LOW from Address Match 2020ns t BHA BUSY HIGH from Address Mismatch 2020ns t BLC BUSY LOW from CE LOW 2020ns t BHC BUSY HIGH from CE HIGH 1717ns t PS Port Set-up for Priority 55ns t WB R/W HIGH after BUSY (Slave)00ns t WH R/W HIGH after BUSY HIGH (Slave)1517ns t BDD [25]BUSY HIGH to Data Valid 2025ns Interrupt Timing [24]t INS INT Set Time 2020ns t INR INT Reset Time2020ns Semaphore Timingt SOP SEM Flag Update Pulse (OE or SEM)1012ns t SWRD SEM Flag Write to Read Time 55ns t SPS SEM Flag Contention Window 55ns t SAASEM Address Access Time2025nsSwitching Characteristics Over the Operating Range (continued)[18]Parameter DescriptionCY7C024AV/025AV/026AV CY7C0241AV/0251AV/036AV Unit -20-25Min.Max.Min.Max.TimingParameter Test Conditions [26]Max.Unit ICC DR1@ VCC DR = 2V50µAData Retention Mode3.0V3.0VV CC > 2.0VV CC to V CC –0.2VV CCCEt RCV IHSwitching WaveformsNotes:27.R/W is HIGH for read cycles.28.Device is continuously selected CE = V IL and UB or LB = V IL . This waveform cannot be used for semaphore reads.29.OE = V IL .30.Address valid prior to or coincident with CE transition LOW.31.To access RAM, CE = V IL , UB or LB = V IL , SEM = V IH . T o access semaphore, CE = V IH , SEM = V IL .t RCt AAt OHADATA VALIDPREVIOUS DATA VALIDDATA OUTADDRESSt OHARead Cycle No.1 (Either Port Address Access)[27, 28, 29]t ACEt LZOEt DOEt HZOEt HZCEDATA VALIDt LZCEt PUt PDI SBI CCDATA OUTOECE and LB or UBCURRENTRead Cycle No.2 (Either Port CE/OE Access)[27, 30, 31]UB or LBDATA OUTt RCADDRESSt AAt OHACEt LZCEt ABEt HZCEt HZCEt ACE t LZCERead Cycle No. 3 (Either Port)[27, 29, 30, 31]Notes:32.R/W must be HIGH during all address transitions.33. A write occurs during the overlap (t SCE or t PWE ) of a LOW CE or SEM and a LOW UB or LB.34.t HA is measured from the earlier of CE or R/W or (SEM or R/W) going HIGH at the end of write cycle.35.If OE is LOW during a R/W controlled write cycle, the write pulse width must be the larger of t PWE or (t HZWE + t SD ) to allow the I/O drivers to turn off and data to be placed onthe bus for the required t SD . If OE is HIGH during an R/W controlled write cycle, this requirement does not apply and the write pulse can be as short as the specified t PWE .36.To access RAM, CE = V IL , SEM = V IH .37.To access upper byte, CE = V IL , UB = V IL , SEM = V IH .T o access lower byte, CE = V IL , LB = V IL , SEM = V IH .38.Transition is measured ±500 mV from steady state with a 5-pF load (including scope and jig). This parameter is sampled and not 100% tested.39.During this period, the I/O pins are in the output state, and input signals must not be applied.40.If the CE or SEM LOW transition occurs simultaneously with or after the R/W LOW transition, the outputs remain in the high-impedance state.Switching Waveforms (continued)t AWt WCt PWE t HDt SDt HACER/WOEDATAOUTDATA INADDRESSt HZOE t SAt HZWE t LZWEWrite Cycle No.1: R/W Controlled Timing [32, 33, 34, 35][38][38][35][36, 37]NOTE 39NOTE 39t AWt WCt SCE t HDt SDt HACER/WDATA INADDRESSt SAWrite Cycle No. 2: CE Controlled Timing [32, 33, 34, 40][36, 37]Notes:41.CE = HIGH for the duration of the above timing (both write and read cycle).42.I/O 0R = I/O 0L = LOW (request semaphore); CE R = CE L = HIGH.43.Semaphores are reset (available to both ports) at cycle start.44.If t SPS is violated, the semaphore will definitely be obtained by one side or the other, but which side will get the semaphore is unpredictable.Switching Waveforms (continued)t SOPt SAAVALID ADRESS VALID ADRESSt HD DATA IN VALID DATA OUT VALIDt OHAt AWt HAt ACEt SOPt SCEt SDt SAt PWEt SWRDt DOEWRITE CYCLEREAD CYCLEOER/WI/O 0SEMA 0–A 2Semaphore Read After Write Timing, Either Side [41]MATCHt SPSA 0L –A 2LMATCHR/W L SEM LA 0R –A 2RR/W R SEM RTiming Diagram of Semaphore Contention [42, 43, 44]。
CY7C1012DV33资料
PRELIMINARY 12-Mbit (512K X 24) Static RAMCY7C1012DV33Features•Highspeed —t AA = 8 ns•Low active power—I CC = 185 mA @ 8 ns •Low CMOS standby power —I SB2 = 25 mA•Operating voltages of 3.3 ± 0.3V •2.0V data retention•Automatic power-down when deselected •TTL-compatible inputs and outputs•Available in Lead Pb-Free Standard 119-ball PBGAFunctional DescriptionThe CY7C1012DV33 is a high-performance CMOS static RAM organized as 512K words by 24 bits. Each data byte is separately controlled by the individual chip selects (CE 1, CE 2,CE 3). CE 1 controls the data on the I/O 0–I/O 7, while CE 2controls the data on I/O 8–I/O 15, and CE 3 controls the data on the data pins I/O 16–I/O 23. This device has an automaticpower-down feature that significantly reduces power consumption when deselected.Writing the data bytes into the SRAM is accomplished when the chip select controlling that byte is LOW and the write enable input (WE) input is LOW. Data on the respective input/output (I/O) pins is then written into the location specified on the address pins (A 0–A 18). Asserting all of the chip selects LOW and write enable LOW will write all 24 bits of data into the SRAM. Output enable (OE) is ignored while in WRITE mode.Data bytes can also be individually read from the device.Reading a byte is accomplished when the chip select controlling that byte is LOW and write enable (WE) HIGH while output enable (OE) remains LOW. Under these conditions, the contents of the memory location specified on the address pins will appear on the specified data input/output (I/O) pins.Asserting all the chip selects LOW will read all 24 bits of data from the SRAM.The 24 I/O pins (I/O 0–I/O 23) are placed in a high-impedance state when all the chip selects are HIGH or when the output enable (OE) is HIGH during a READ mode. For further details,refer to the truth table of this data sheet.Selection Guide–8Unit Maximum Access Time 8ns Maximum Operating Current 185mA Maximum CMOS Standby Current25mAFunctional Block Diagram1516A 1A 2A 3A 4A 5A 6A 7A 8COLUMN DECODERR O W D E C O D E RS E N S E A M P SINPUT BUFFER512K x 24ARRAYA 0A 12A 14A 13A A A 17A 18A 10A 11I/O 0–I/O 7OEI/O 8–I/O 15CE 1, CE 2, CE 3WE A 9I/O 16–I/O 23CONTROL LOGICPin Configurations[1]119 PBGATop View1234567A NC A A A A A NCB NC A A CE1A A NCC I/O12NC CE2NC CE3NC I/O0D I/O13V DD V SS V SS V SS V DD I/O1E I/O14V SS V DD V SS V DD V SS I/O2F I/O15V DD V SS V SS V SS V DD I/O3G I/O16V SS V DD V SS V DD V SS I/O4H I/O17V DD V SS V SS V SS V DD I/O5J NC V SS V DD V SS V DD V SS NCK I/O18V DD V SS V SS V SS V DD I/O6L I/O19V SS V DD V SS V DD V SS I/O7M I/O20V DD V SS V SS V SS V DD I/O8N I/O21V SS V DD V SS V DD V SS I/O9P I/O22V DD V SS V SS V SS V DD I/O10R I/O23A NC NC NC A I/O11T NC A A WE A A NCU NC A A OE A A NC Note:1.NC pins are not connected on the dieMaximum Ratings(Above which the useful life may be impaired. For user guide-lines, not tested.)Storage Temperature .................................–65°C to +150°C Ambient Temperature withPower Applied.............................................–55°C to +125°C Supply Voltage on V CC Relative to GND [2]....–0.5V to +4.6V DC Voltage Applied to Outputsin High-Z State [2]....................................–0.5V to V CC + 0.5V DC Input Voltage [2].................................–0.5V to V CC + 0.5VCurrent into Outputs (LOW).........................................20 mA Static Discharge Voltage............................................>2001V (per MIL-STD-883, Method 3015)Latch-up Current......................................................>200 mAOperating RangeRange Ambient Temperature V CC Commercial0°C to +70°C3.3V ± 0.3VDC Electrical Characteristics Over the Operating RangeParameter DescriptionTest Conditions [7]–8Unit Min.Max.V OH Output HIGH Voltage V CC = Min., I OH = –4.0 mA 2.4V V OL Output LOW Voltage V CC = Min., I OL = 8.0 mA0.4V V IH Input HIGH Voltage 2.0V CC + 0.3V V IL [2]Input LOW Voltage –0.30.8V I IX Input Leakage Current GND < V I < V CC–1+1µA I OZ Output Leakage Current GND < V OUT < V CC , Output Disabled –1+1µA I CC V CC Operating Supply Current V CC = Max., f = f MAX = 1/t RC I OUT = 0 mA CMOS levels 185mA I SB1Automatic CE Power-down Current —TTL Inputs Max. V CC , CE > V IHV IN > V IH or V IN < V IL , f = f MAX 30mA I SB2Automatic CE Power-down Current —CMOS InputsMax. V CC , CE > V CC – 0.3V,V IN > V CC – 0.3V, or V IN < 0.3V, f = 025mACapacitance [3]Parameter DescriptionTest ConditionsMax.Unit C IN Input Capacitance T A = 25°C, f = 1 MHz, V CC = 3.3V8pF C OUTI/O Capacitance10pFThermal Resistance [3]ParameterDescriptionTest ConditionsAll - PackagesUnit ΘJA Thermal Resistance (Junction to Ambient)Still Air, soldered on a 3 × 4.5 inch,four-layer printed circuit board TBD °C/W ΘJCThermal Resistance (Junction to Case)TBD°C/WAC Test Loads and Waveforms [4]90%10%3.0V GND 90%10%ALL INPUT PULSES3.3V OUTPUT5 pFINCLUDINGJIG AND SCOPE(a)(b)R1 317ΩR2351ΩRise time > 1 V/nsFall time:> 1 V/ns(c)OUTPUT50ΩZ 0= 50ΩV TH = 1.5V30 pF** Capacitive Load consists of all compo-nents of the test environment.Notes:2.V IL (min.) = –2.0V and V IH (max) = V CC + 2V for pulse durations of less than 20 ns.3.Tested initially and after any design or process changes that may affect these parameters.4.Valid SRAM operation does not occur until the power supplies have reached the minimum operating V DD (3.0V). 100 µs (t power ) after reaching the minimum operating V DD , normal SRAM operation can begin including reduction in V DD to the data retention (V CCDR , 2.0V) voltage.AC Switching Characteristics Over the Operating Range [5]Parameter Description–8Unit Min.Max.Read Cyclet power[6]V CC(typical) to the first access100µst RC Read Cycle Time8nst AA Address to Data Valid8nst OHA Data Hold from Address Change3nst ACE CE active LOW to Data Valid[7]8nst DOE OE LOW to Data Valid5nst LZOE OE LOW to Low-Z[8]1nst HZOE OE HIGH to High-Z[8]5nst LZCE CE active LOW to Low-Z[7, 8]3nst HZCE CE deselect HIGH to High-Z[7, 8]5nst PU CE active LOW to Power-up[7, 9]0nst PD CE deselect HIGH to Power-down[7, 9]8nst DBE Byte Enable to Data Valid5nst LZBE Byte Enable to Low-Z[8]1nst HZBE Byte Disable to High-Z[8]5nsWrite Cycle[10, 11]t WC Write Cycle Time8nst SCE CE active LOW to Write End[7]6nst AW Address Set-up to Write End6nst HA Address Hold from Write End0nst SA Address Set-up to Write Start0nst PWE WE Pulse Width6nst SD Data Set-up to Write End5nst HD Data Hold from Write End0nst LZWE WE HIGH to Low-Z[8]3nst HZWE WE LOW to High-Z[8]5nst BW Byte Enable to End of Write6ns Notes:5.Test conditions assume signal transition time of 3 ns or less, timing reference levels of 1.5V, input pulse levels of 0 to 3.0V. Test conditions for the read cycle useoutput loading as shown in part a) of the AC test loads, unless specified otherwise.6.t POWER gives the minimum amount of time that the power supply should be at typical V CC values until the first memory access is performed.7.CE indicates a combination of all three chip enables. When active LOW, CE indicates the CE1 2 3 1and CE2 and CE3 HIGH8.t HZOE, t HZCE, t HZWE, t HZBE, and t LZOE, t LZCE, t LZWE, t LZBE are specified with a load capacitance of 5 pF as in part (b) of AC Test Loads. Transition is measured±200 mV from steady-state voltage.9.These parameters are guaranteed by design and are not tested.10. 1 2 3LOW to initiate a write, and the transition of any of these signals can terminate the write. The input data set-up and hold timing should be referenced to the leading edge of the signal that terminates the write.11.HZWE and t SD.Data Retention Characteristics (Over the Operating Range)Parameter DescriptionConditionsMin.Typ.Max.Unit V DR V CC for Data Retention 2V I CCDR Data Retention CurrentV CC = 2V , CE 1 > V CC – 0.2V , CE 2 < 0.2V, V IN > V CC – 0.2V or V IN < 0.2V25mA t CDR [3]Chip Deselect to Data Retention Time 0ns t R [12]Operation Recovery Timet RCnsData Retention WaveformSwitching WaveformsRead Cycle No. 1[13, 14]Read Cycle No. 2 (OE Controlled)[7, 14, 15]Notes:12.Full device operation requires linear V CC ramp from V DR to V CC(min.) > 50 µs or stable at V CC(min.) > 50 µs 13.Device is continuously selected. OE, CE = V IL .14.15.3V 3V t CDRV DR >2VDATA RETENTION MODEt RCEV CC PREVIOUS DATA VALIDDATA VALIDt RCt AAt OHAADDRESSDATA OUT50%50%DATA VALIDt RCt ACEt DOEt LZOEt LZCE t PUHIGH IMPEDANCEt HZOEt HZCEt PDHIGH OECEI CC I SBIMPEDANCEADDRESSDATA OUT V CC SUPPLY CURRENTWrite Cycle No. 1 (CE Controlled)[7, 16, 17]Write Cycle No. 2 (WE Controlled, OE HIGH During Write)[16, 17]Write Cycle No. 3 (WE Controlled, OE LOW)[7, 17]Notes:16.Data I/O is high impedance if OE = V IH .17.If CE goes HIGH simultaneously with WE going HIGH, the output remains in a high-impedance state.18.During this period the I/Os are in the output state and input signals should not be applied.Switching Waveforms (continued)t WCDATA VALIDt AWt SAt PWEt HAt HDt SDt SCEt SCECEADDRESSWEDATA I/Ot HDt SDt PWEt SAt HAt AWt SCEt WCt HZOEDATA IN VALIDCEADDRESSWEDATA I/OOENOTE 18DATA VALIDt HDt SDt LZWEt PWEt SAt HAt AWt SCEt WCt HZWECEADDRESSWEDATA I/ONOTE 18Truth TableCE1CE2CE3OE WE I/O0–I/O7I/O8–I/O15I/O16–I/O23Mode PowerH H H X X High-Z High-Z High-Z Power-down Standby (I SB)L H H L H Data Out High-Z High-Z Read Active (I CC)H L H L H High-Z Data Out High-Z Read Active (I CC)H H L L H High-Z High-Z Data Out Read Active (I CC)L L L L H Full Data Out Full Data Out Full Data Out Read Active (I CC) L H H X L Data In High-Z High-Z Write Active (I CC)H L H X L High-Z Data In High-Z Write Active (I CC)H H L X L High-Z High-Z Data In Write Active (I CC)L L L X L Full Data In Full Data In Full Data In Write Active (I CC) L L L H H High-Z High-Z High-Z Selected,Outputs DisabledActive (I CC) Ordering InformationSpeed(ns)Ordering Code PackageName Package TypeOperatingRange8CY7C1012DV33-8BGXC51-85115119-ball Plastic Ball Grid Array (14 x 22 x 2.4 mm)(Pb-free)CommercialPackage Diagram119-ball PBGA (14 x 22 x 2.4 mm) (51-85115)Document #: 38-05610 Rev. *B Page 8 of 9Document History PageDocument Title: CY7C1012DV33 12-Mbit (512K X 24) Static RAM Document Number: 38-05610REV.ECN NO.Issue Date Orig. ofChange Description of Change**250650See ECN SYT New Data Sheet*A469517See ECN NXR Converted from Advance Information to PreliminaryCorrected typo in the Document TitleRemoved –10 and –12 speed bins from product offeringChanged J7 ball of BGA from DNU to NCRemoved Industrial Operating range from product offeringIncluded the Maximum ratings for Static Discharge Voltage and Latch UpCurrent on page #3Changed I CC(Max) from 220 mA to 150 mAChanged I SB1(Max) from 70 mA to 30 mAChanged I SB2(Max) from 40 mA to 25 mASpecified the Overshoot spec in footnote # 1Updated the Truth TableUpdated the ordering Information table*B499604See ECN NXR Added note# 1 for NC pinsChanged I CC spec from 150 mA to 185 mAUpdated Test Condition for I CC in DC Electrical Characteristics tableAdded note for t ACE, t LZCE, t HZCE, t PU, t PD, t SCE in AC Switching CharacteristicsTable on page# 4。
- 1、下载文档前请自行甄别文档内容的完整性,平台不提供额外的编辑、内容补充、找答案等附加服务。
- 2、"仅部分预览"的文档,不可在线预览部分如存在完整性等问题,可反馈申请退款(可完整预览的文档不适用该条件!)。
- 3、如文档侵犯您的权益,请联系客服反馈,我们会尽快为您处理(人工客服工作时间:9:00-18:30)。
PRELIMINARY36-Mbit QDR-II™ SRAM 2-WordBurst ArchitectureCY7C1425AV18CY7C1412AV18CY7C1414AV18Features•Separate Independent Read and Write data ports —Supports concurrent transactions •200-MHz clock for high bandwidth •2-Word Burst on all accesses•Double Data Rate (DDR) interfaces on both Read and Write ports (data transferred at 400 MHz) @ 200 MHz •Two input clocks (K and K) for precise DDR timing —SRAM uses rising edges only•Two output clocks (C and C) accounts for clock skew and flight time mismatching•Echo clocks (CQ and CQ) simplify data capture in high-speed systems•Single multiplexed address input bus latches address inputs for both Read and Write ports •Separate Port Selects for depth expansion •Synchronous internally self-timed writes •Available in x8, x9, x18, and x36 configurations •Full data coherency, providing most current data •CoreV DD = 1.8V (±0.1V); I/O V DDQ = 1.4V to V DD•15 × 17 × 1.4 mm 1.0-mm pitch FBGA package, 165-ball (11 × 15 matrix)•Variable drive HSTL output buffers •JTAG 1149.1 compatible test access port•Delay Lock Loop (DLL) for accurate data placementConfigurationsCY7C1410AV18 – 4M x 8CY7C1425AV18 – 4M x 9CY7C1412AV18 – 2M x 18CY7C1414AV18 – 1M x 36Functional DescriptionThe CY7C1410AV18, CY7C1425AV18, CY7C1412AV18, and CY7C1414AV18 are 1.8V Synchronous Pipelined SRAMs,equipped with QDR™-II architecture. QDR-II architecture consists of two separate ports to access the memory array.The Read port has dedicated Data Outputs to support Read operations and the Write Port has dedicated Data Inputs to support Write operations. QDR-II architecture has separate data inputs and data outputs to completely eliminate the need to “turn-around” the data bus required with common I/O devices. Access to each port is accomplished through a common address bus. The Read address is latched on the rising edge of the K clock and the Write address is latched on the rising edge of the K clock. Accesses to the QDR-II Read and Write ports are completely independent of one another. In order to maximize data throughput, both Read and Write ports are equipped with Double Data Rate (DDR) interfaces. Each address location is associated with two 8-bit words (CY7C1410AV18) or 9-bit words (CY7C1425AV18) or 18-bit words (CY7C1412AV18) or 36-bit words (CY7C1414AV18)that burst sequentially into or out of the device. Since data can be transferred into and out of the device on every rising edge of both input clocks (K and K and C and C), memory bandwidth is maximized while simplifying system design by eliminating bus “turn-arounds.”Depth expansion is accomplished with Port Selects for each port. Port selects allow each port to operate independently.All synchronous inputs pass through input registers controlled by the K or K input clocks. All data outputs pass through output registers controlled by the C or C (or K or K in a single clock domain) input clocks. Writes are conducted with on-chip synchronous self-timed write circuitry.Selection Guide250 MHz200 MHz 167 MHz Unit Maximum Operating Frequency 250200167MHz Maximum Operating CurrentTBDTBDTBDmAShaded areas contain advance information.Please contact your local Cypress Sales representative for availability of these parts.PRELIMINARYCY7C1412AV18CY7C1414AV18Logic Block Diagram (CY7C1410AV18)CLK A (20:0)Gen.KK Control LogicAddress RegisterD [7:0]R e a d A d d . D e c o d eRead Data Reg.RPS WPS Q [7:0]Control LogicAddress RegisterReg.Reg.Reg.8218168NWS [1:0]V REF W r i t e A d d . D e c o d e8A (20:0)21CC 82M x 8 Array2M x 8 ArrayWrite Reg Write Reg CQCQ 8DOFFLogic Block Diagram (CY7C1425AV18)CLK A (20:0)Gen.KK Control LogicAddress RegisterD [8:0]R e a d A d d . D e c o d eRead Data Reg.RPS WPS Q[8:0]Control LogicAddress RegisterReg.Reg.Reg.9219189BWS [0]V REF W r i t e A d d . D e c o d e9A (20:0)21CC 92M x 9 Array2M x 9 ArrayWrite Reg Write Reg CQCQ 9DOFFPRELIMINARYCY7C1412AV18CY7C1414AV18Logic Block Diagram (CY7C1412AV18)CLK A (19:0)Gen.KK Control LogicAddress RegisterD [17:0]R e a d A d d . D e c o d eRead Data Reg.RPS WPS Q [17:0]Control LogicAddress RegisterReg.Reg.Reg.1820183618BWS [1:0]V REF W r i t e A d d . D e c o d e18A (19:0)20CC 181M x 18 Array1M x 18 ArrayWrite Reg Write Reg CQCQ 18DOFFLogic Block Diagram (CY7C1414AV18)CLK A (18:0)Gen.KK Control LogicAddress RegisterD [35:0]R e a d A d d . D e c o d eRead Data Reg.RPS WPS Q [35:0]Control LogicAddress RegisterReg.Reg.Reg.3619367236BWS [3:0]V REF W r i t e A d d . D e c o d e36A (18:0)19CC 36512K x 36 Array512K x 36 ArrayWrite Reg Write Reg CQCQ 36DOFFPRELIMINARY CY7C1412AV18 CY7C1414AV18Pin ConfigurationsCY7C1410AV18 (4M × 8) – 15 × 17 FBGA2345671ABCDEFGHJKLMNP RACQNCNCNCNCDOFFNCNC/72M A NWS1KWPS NC/144MNC NCNCNCNCTDONCNCD5NCNCNCTCKNCNCA NC/288M K NWS0V SS A A ANC V SSV SS V SSV SSV DDAV SSV SSV SSV DDQ4NCV DDQNCNCNCNCQ7AV DDQ V SSV DDQ V DD V DDQ5V DDQV DDV DDQV DDV DDQ V DD V SSV DDV DDQV DDQ V SSV SS V SS V SSAACV SSA AAD4V SSNC V SSNCNCV REFV SSV DDV SSV SSAV SSCNCQ6NCD7D6V DDA891011NCA ARPS CQA NC NC Q3V SS NC NC D3NCV SS NCQ2NCNCNCV REFNCNCV DDQ NCV DDQ NC NCV DDQV DDQV DDQD1V DDQ NC Q1NCV DDQV DDQ NCV SS NC D0NCTDITMSV SSA NCANCD2NCZQNCQ0NCNCNCNCACY7C1425AV18 (4M × 9)–11 × 15 Balls (15 × 17 FBGA)2345671A B C D E F G H J K L M NP RACQNCNCNCNCDOFFNCNC/72M A NC KWPS NC/144MNC NCNCNCNCTDONCNCD6NCNCNCTCKNCNCA NC/288M K BWS0V SS A A ANC V SSV SS V SSV SSV DDAV SSV SSV SSV DDQ5NCV DDQNCNCNCNCQ8AV DDQ V SSV DDQ V DD V DDQ6V DDQV DDV DDQV DDV DDQ V DD V SSV DDV DDQV DDQ V SSV SS V SS V SSAACV SSA AAD5V SSNC V SSNCNCV REFV SSV DDV SSV SSAV SSCNCQ7NCD8D7V DDA891011Q0A ARPS CQA NC NC Q4V SS NC NC D4NCV SS NCQ3NCNCNCV REFNCNCV DDQ NCV DDQ NC NCV DDQV DDQV DDQD2V DDQ NC Q2NCV DDQV DDQ NCV SS NC D1NCTDITMSV SSA NCANCD3NCZQNCQ1NCNCD0NCAPRELIMINARY CY7C1412AV18 CY7C1414AV18Pin Configurations (continued)CY7C1412AV18 (2M × 18) – 15 × 17 FBGA2345671ABCDEFGHJKLMNP RACQNCNCNCNCDOFFNCNC/144M A BWS1KWPS NC/288MQ9D9NCNCNCTDONCNCD13NCNCNCTCKNCD10A NC K BWS0V SS A A AQ10V SSV SS V SSV SSV DDAV SSV SSV SSV DDQ11D12V DDQD14Q14D16Q16Q17AV DDQ V SSV DDQ V DD V DDQ13V DDQV DDV DDQV DDV DDQ V DD V SSV DDV DDQV DDQ V SSV SS V SS V SSAACV SSA AAD11V SSNC V SSQ12NCV REFV SSV DDV SSV SSAV SSCNCQ15NCD17D15V DDA891011Q0A NC/72MRPS CQA NC NC Q8V SS NC Q7D8NCV SS NCQ6D5NCNCV REFNCQ3V DDQ NCV DDQ NC Q5V DDQV DDQV DDQD4V DDQ NC Q4NCV DDQV DDQ NCV SS NC D2NCTDITMSV SSA NCAD7D6NCZQD3Q2D1Q1D0NCA2345671A B C D E F G H J K L M NP RACQQ27D27D28D34DOFFQ33NC/288M NC/72M BWS2KWPS BWS1Q18D18Q30D31D33TDOQ28D29D22D32Q34Q31TCKD35D19A BWS3K BWS0V SS A A AQ19V SSV SS V SSV SSV DDAV SSV SSV SSV DDQ20D21V DDQD23Q23D25Q25Q26AV DDQ V SSV DDQ V DD V DDQ22V DDQV DDV DDQV DDV DDQ V DD V SSV DDV DDQV DDQ V SSV SS V SS V SSAACV SSA AAD20V SSQ29V SSQ21D30V REFV SSV DDV SSV SSAV SSCQ32Q24Q35D26D24V DDA891011Q0A NC/144MRPS CQA D17Q17Q8V SS D16Q7D8Q16V SS D15Q6D5D9Q14V REFQ11Q3V DDQ Q15V DDQ D14Q5V DDQVDDQV DDQD4V DDQ D12Q4Q12V DDQV DDQ D11V SS D10D2Q10TDITMSV SSA Q9AD7D6D13ZQD3Q2D1Q1D0Q13ACY7C1414AV18 (1M × 36) – 15 × 17 FBGAPRELIMINARY CY7C1412AV18 CY7C1414AV18Pin DefinitionsPin Name I/O Pin DescriptionD[x:0]Input-Synchronous Data input signals, sampled on the rising edge of K and K clocks during valid write operations.CY7C1410AV18 - D[7:0]CY7C1425AV18 - D[8:0]CY7C1412AV18 - D[17:0]CY7C1414AV18 - D[35:0]WPS Input-Synchronous Write Port Select, active LOW. Sampled on the rising edge of the K clock. When asserted active, a Write operation is initiated. Deasserting will deselect the Write port. Deselecting the Write port will cause D[x:0] to be ignored.NWS0,NWS1Nibble Write Select 0, 1 − active LOW. (CY7C1410AV18 Only) Sampled on the risingedge of the K and K clocks during Write operations. Used to select which nibble is writteninto the device during the current portion of the Write operations.Nibbles not writtenremain unaltered. NWS0 controls D[3:0] and NWS1 controls D[7:4]. All Nibble Write Selectsare sampled on the same edge as the data. Deselecting a Nibble Write Select will causethe corresponding nibble of data to be ignored and not written into the device.BWS0, BWS1, BWS2, BWS3Input-SynchronousByte Write Select 0, 1, 2 and 3 − active LOW. Sampled on the rising edge of the K andK clocks during Write operations. Used to select which byte is written into the deviceduring the current portion of the Write operations. Bytes not written remain unaltered.CY7C1425AV18 − BWS0 controls D[8:0]CY7C1412AV18 − BWS0 controls D[8:0], BWS1 controls D[17:9].CY7C1414AV18 − BWS0 controls D[8:0], BWS1 controls D[17:9],BWS2 controls D[26:18]and BWS3 controls D[35:27].All the Byte Write Selects are sampled on the same edge as the data. Deselecting a ByteWrite Select will cause the corresponding byte of data to be ignored and not written intothe device.A Input-Synchronous Address Inputs. Sampled on the rising edge of the K (Read address) and K (Write address) clocks during active Read and Write operations. These address inputs are multiplexed for both Read and Write operations. Internally, the device is organized as 4M x 8 (2 arrays each of 2M x 8) for CY7C1410AV18, 4M x 9 (2 arrays each of 2M x 9) for CY7C1425AV18, 2M x 18 (2 arrays each of 1M x 18) for CY7C1412AV18 and 1M x 36 (2 arrays each of 512K x 36) for CY7C1414AV18. Therefore, only 21 address inputs are needed to access the entire memory array of CY7C1410AV18 and CY7C1425AV18, 20 address inputs for CY7C1412AV18 and 19 address inputs for CY7C1414AV18. These inputs are ignored when the appropriate port is deselected.Q[x:0]Outputs-Synchronous Data Output signals. These pins drive out the requested data during a Read operation. Valid data is driven out on the rising edge of both the C and C clocks during Read operations or K and K when in single clock mode. When the Read port is deselected, Q[x:0] are automatically three-stated.CY7C1410AV18 − Q[7:0]CY7C1425AV18 − Q[8:0]CY7C1412AV18 − Q[17:0]CY7C1414AV18 − Q[35:0]RPS Input-Synchronous Read Port Select, active LOW. Sampled on the rising edge of Positive Input Clock (K). When active, a Read operation is initiated. Deasserting will cause the Read port to be deselected. When deselected, the pending access is allowed to complete and the output drivers are automatically three-stated following the next rising edge of the C clock. Each read access consists of a burst of two sequential transfers.C Input-Clock Positive Output Clock Input. C is used in conjunction with C to clock out the Read data from the device. C and C can be used together to deskew the flight times of various devices on the board back to the controller. See application example for further details.C Input-Clock Negative Output Clock Input. C is used in conjunction with C to clock out the Read datafrom the device. C and C can be used together to deskew the flight times of variousdevices on the board back to the controller. See application example for further details. K Input-Clock Positive Input Clock Input. The rising edge of K is used to capture synchronous inputsto the device and to drive out data through Q[x:0] when in single clock mode. All accessesare initiated on the rising edge of K.PRELIMINARYCY7C1412AV18CY7C1414AV18Functional OverviewThe CY7C1410AV18, CY7C1425AV18, CY7C1412AV18 and CY7C1414AV18 are synchronous pipelined Burst SRAMs equipped with both a Read port and a Write port. The Read port is dedicated to Read operations and the Write port is dedicated to Write operations. Data flows into the SRAM through the Write port and out through the Read port. These devices multiplex the address inputs in order to minimize the number of address pins required. By having separate Read and Write ports, the QDR-II completely eliminates the need to “turn-around” the data bus and avoids any possible data contention, thereby simplifying system design. Each access consists of two 8-bit data transfers in the case of CY7C1410AV18, two 9-bit data transfers in the case of CY7C1425AV18,two 18-bit data transfers in the case of CY7C1412AV18 and two 36-bit data transfers in the case of CY7C1414AV18, in one clock cycle.Accesses for both ports are initiated on the rising edge of the positive Input Clock (K). All synchronous input timings are referenced from the rising edge of the input clocks (K and K)and all output timings are referenced to the rising edge of output clocks (C and C or K and K when in single clock mode).All synchronous data inputs (D [x:0]) inputs pass through input registers controlled by the input clocks (K and K). All synchronous data outputs (Q [x:0]) outputs pass through output registers controlled by the rising edge of the output clocks (C and C or K and K when in single clock mode).All synchronous control (RPS, WPS, BWS [x:0]) inputs pass through input registers controlled by the rising edge of the input clocks (K and K).CY7C1412AV18 is described in the following sections. The same basic descriptions apply to CY7C1410AV18CY7C1425AV18 and CY7C1414AV18. Read OperationsThe CY7C1412AV18 is organized internally as 2 arrays of 1Mx18. Accesses are completed in a burst of two sequential 18-bit data words. Read operations are initiated by asserting RPS active at the rising edge of the Positive Input Clock (K).The address is latched on the rising edge of the K Clock. The address presented to Address inputs is stored in the ReadK Input-Clock Negative Input Clock Input . K is used to capture synchronous inputs being presented to the device and to drive out data through Q [x:0] when in single clock mode.CQEcho ClockCQ is referenced with respect to C . This is a free running clock and is synchronized to the output clock (C) of the QDR-II. In the single clock mode, CQ is generated with respect to K. The timings for the echo clocks are shown in the AC Timing table.CQ Echo ClockCQ is referenced with respect to C . This is a free running clock and is synchronized to the output clock (C) of the QDR-II. In the single clock mode, CQ is generated with respect to K. The timings for the echo clocks are shown in the AC Timing table.ZQ InputOutput Impedance Matching Input . This input is used to tune the device outputs to the system data bus impedance. CQ, CQ, and Q [x:0] output impedance are set to 0.2 x RQ, where RQ is a resistor connected between ZQ and ground. Alternately, this pin can be connected directly to V DD , which enables the minimum impedance mode. This pin cannot be connected directly to GND or left unconnected.DOFF InputDLL Turn Off, active LOW . Connecting this pin to ground will turn off the DLL inside the device. The timings in the DLL turned off operation will be different from those listed in this data sheet. More details on this operation can be found in the application note, “DLL Operation in the QDR-II.”TDO Output TDO for JTAG .TCK Input TCK pin for JTAG .TDI Input TDI pin for JTAG .TMS Input TMS pin for JTAG .NC N/A Not connected to the die . Can be tied to any voltage level.NC/72M N/A Not connected to the die . Can be tied to any voltage level.NC/144M N/A Not connected to the die . Can be tied to any voltage level.NC/288M N/A Not connected to the die . Can be tied to any voltage level.V REF Input-Reference Reference Voltage Input . Static input used to set the reference level for HSTL inputs and Outputs as well as AC measurement points.V DD Power Supply Power supply inputs to the core of the device . V SS Ground Ground for the device .V DDQPower SupplyPower supply inputs for the outputs of the device .Pin Definitions (continued)Pin Name I/O Pin DescriptionPRELIMINARY CY7C1412AV18 CY7C1414AV18address register. Following the next K clock rise the corre-sponding lowest order 18-bit word of data is driven onto the Q[17:0] using C as the output timing reference. On the subse-quent rising edge of C, the next 18-bit data word is driven onto the Q[17:0]. The requested data will be valid 0.45 ns from the rising edge of the output clock (C and C or K and K when in single clock mode).Synchronous internal circuitry will automatically three-state the outputs following the next rising edge of the Output Clocks (C/C). This will allow for a seamless transition between devices without the insertion of wait states in a depth expanded memory.Write OperationsWrite operations are initiated by asserting WPS active at the rising edge of the Positive Input Clock (K). On the same K clock rise, the data presented to D[17:0] is latched and stored into the lower 18-bit Write Data register provided BWS[1:0] are both asserted active. On the subsequent rising edge of the Negative Input Clock (K), the address is latched and the infor-mation presented to D[17:0] is stored into the Write Data register provided BWS[1:0] are both asserted active. The 36 bits of data are then written into the memory array at the specified location. When deselected, the write port will ignore all inputs after the pending Write operations have been completed.Byte Write OperationsByte Write operations are supported by the CY7C1412AV18.A Write operation is initiated as described in the Write Opera-tions section above. The bytes that are written are determined by BWS0 and BWS1, which are sampled with each 18-bit data word. Asserting the appropriate Byte Write Select input during the data portion of a Write will allow the data being presented to be latched and written into the device. Deasserting the Byte Write Select input during the data portion of a write will allow the data stored in the device for that byte to remain unaltered. This feature can be used to simplify Read/Modify/Write opera-tions to a Byte Write operation.Single Clock ModeThe CY7C1412AV18 can be used with a single clock that controls both the input and output registers. In this mode, the device will recognize only a single pair of input clocks (K and K) that control both the input and output registers. This operation is identical to the operation if the device had zero skew between the K/K and C/C clocks. All timing parameters remain the same in this mode. To use this mode of operation, the user must tie C and C HIGH at power on. This function is a strap option and not alterable during device operation.Concurrent TransactionsThe Read and Write ports on the CY7C1412AV18 operate completely independently of one another. Since each port latches the address inputs on different clock edges, the user can Read or Write to any location, regardless of the trans-action on the other port. Also, reads and writes can be started in the same clock cycle. If the ports access the same location at the same time, the SRAM will deliver the most recent infor-mation associated with the specified address location. This includes forwarding data from a Write cycle that was initiated on the previous K clock rise.Depth ExpansionThe CY7C1412AV18 has a Port Select input for each port. This allows for easy depth expansion. Both Port Selects are sampled on the rising edge of the Positive Input Clock only (K). Each port select input can deselect the specified port. Deselecting a port will not affect the other port. All pending transactions (Read and Write) will be completed prior to the device being deselected.Programmable ImpedanceAn external resistor, RQ, must be connected between the ZQ pin on the SRAM and V SS to allow the SRAM to adjust its output driver impedance. The value of RQ must be 5x the value of the intended line impedance driven by the SRAM. The allowable range of RQ to guarantee impedance matching with a tolerance of ±15% is between 175Ω and 350Ω, with V DDQ=1.5V.The output impedance is adjusted every 1024 cycles upon power-up to account for drifts in supply voltage and temperature.Echo ClocksEcho clocks are provided on the QDR-II to simplify data capture on high-speed systems. Two echo clocks are generated by the QDR-II. CQ is referenced with respect to C and CQ is referenced with respect to C. These are free-running clocks and are synchronized to the output clock (C/C) of the QDR-II. In the single clock mode, CQ is generated with respect to K and CQ is generated with respect to K. The timings for the echo clocks are shown in the AC Timing table. DLLThese chips utilize a Delay Lock Loop (DLL) that is designed to function between 80 MHz and the specified maximum clock frequency. The DLL may be disabled by applying ground to the DOFF pin. The DLL can also be reset by slowing the cycle time of input clocks K and K to greater than 30 ns.PRELIMINARYCY7C1412AV18CY7C1414AV18Application Example [1]Truth Table [2, 3, 4, 5, 6, 7]OperationK RPS WPS DQDQWrite Cycle:Load address on the rising edge of K clock; input write data on K and K rising edges.L-HXLD(A + 0)at K(t) ↑D(A + 1) at K(t) ↑Read Cycle:Load address on the rising edge of K clock; wait one and a half cycle; read data on C and C rising edges.L-H L X Q(A + 0) at C(t + 1)↑Q(A + 1) at C(t + 2) ↑NOP: No Operation L-H H H D = XQ = High-Z D = XQ = High-Z Standby: Clock StoppedStoppedXXPrevious StatePrevious StateWrite Cycle Descriptions (CY7C1410A V18 and CY7C1412A V18)[2, 8]BWS 0/NWS 0BWS 1 / NWS 1K K CommentsLLL-H–During the Data portion of a Write sequence :CY7C1410AV18 − both nibbles (D [7:0]) are written into the device, CY7C1412AV18 − both bytes (D [17:0]) are written into the device.L L –L-H During the Data portion of a Write sequence :CY7C1410AV18 − both nibbles (D [7:0]) are written into the device, CY7C1412AV18 − both bytes (D [17:0]) are written into the device.L H L-H–During the Data portion of a Write sequence :CY7C1410AV18 − only the lower nibble (D [3:0]) is written into the device. D [7:4] will remain unaltered,CY7C1412AV18 − only the lower byte (D [8:0]) is written into the device. D [17:9] will remain unaltered.Notes:1.The above application shows four QDR-II being used.2.X = “Don't Care,” H = Logic HIGH, L= Logic LOW, ↑represents rising edge.3.Device will power-up deselected and the outputs in a three-state condition.4.“A” represents address location latched by the devices when transaction was initiated. A + 00, A + 01 represents the internal address sequence in the burst.5.“t” represents the cycle at which a Read/Write operation is started. t + 1 and t + 2 are the first and second clock cycles respectively succeeding the “t” clock cycle.6.Data inputs are registered at K and K rising edges. Data outputs are delivered on C and C rising edges, except when in single clock mode.7.charging symmetrically.8.Assumes a Write cycle was initiated per the Write Port Cycle Description Truth Table. NWS 0, NWS 1, BWS 0, BWS 1, BWS 2 and BWS 3 can be altered on different portions of a Write cycle, as long as the set-up and hold requirements are achieved.PRELIMINARYCY7C1412AV18CY7C1414AV18LH–L-H During the Data portion of a Write sequence :CY7C1410AV18 − only the lower nibble (D [3:0]) is written into the device. D [7:4] will remain unaltered,CY7C1412AV18 − only the lower byte (D [8:0]) is written into the device. D [17:9] will remain unaltered.H L L-H–During the Data portion of a Write sequence :CY7C1410AV18 − only the upper nibble (D [7:4]) is written into the device. D [3:0] will remain unaltered,CY7C1412AV18 − only the upper byte (D [17:9]) is written into the device. D [8:0] will remain unaltered.H L –L-H During the Data portion of a Write sequence :CY7C1410AV18 − only the upper nibble (D [7:4]) is written into the device. D [3:0] will remain unaltered,CY7C1412AV18 − only the upper byte (D [17:9]) is written into the device. D [8:0] will remain unaltered.H H L-H –No data is written into the devices during this portion of a Write operation. HH–L-H No data is written into the devices during this portion of a Write operation.Write Cycle Descriptions (CY7C1414A V18) [2, 8]BWS 0BWS 1BWS 2BWS 3K K CommentsL L L L L-H -During the Data portion of a Write sequence, all four bytes (D [35:0]) are written into the device.L L L L -L-H During the Data portion of a Write sequence, all four bytes (D [35:0]) are writteninto the device.L H H H L-H -During the Data portion of a Write sequence, only the lower byte (D [8:0]) is written into the device. D [35:9] will remain unaltered.L H H H -L-H During the Data portion of a Write sequence, only the lower byte (D [8:0]) is writteninto the device. D [35:9] will remain unaltered.H L H H L-H -During the Data portion of a Write sequence, only the byte (D [17:9]) is written into the device. D [8:0] and D [35:18] will remain unaltered.H L H H -L-H During the Data portion of a Write sequence, only the byte (D [17:9]) is written intothe device. D [8:0] and D [35:18] will remain unaltered.H H L H L-H -During the Data portion of a Write sequence, only the byte (D [26:18]) is written into the device. D [17:0] and D [35:27] will remain unaltered.H H L H -L-H During the Data portion of a Write sequence, only the byte (D [26:18]) is written intothe device. D [17:0] and D [35:27] will remain unaltered.H H H L L-H During the Data portion of a Write sequence, only the byte (D [35:27]) is written into the device. D [26:0] will remain unaltered.H H H L -L-H During the Data portion of a Write sequence, only the byte (D [35:27]) is written intothe device. D [26:0] will remain unaltered.H H H H L-H -No data is written into the device during this portion of a Write operation. HHHH-L-H No data is written into the device during this portion of a Write operation.Write Cycle Descriptions (CY7C1425A V18)BWS 0K K CommentsL L-H –During the Data portion of a Write sequence :CY7C1425AV18 − the single byte (D [8:0]) is written into the device L –L-H During the Data portion of a Write sequence :CY7C1425AV18 − the single byte (D [8:0]) is written into the device, H L-H –No data is written into the devices during this portion of a Write operation. H–L-HNo data is written into the devices during this portion of a Write operation.Write Cycle Descriptions (CY7C1410A V18 and CY7C1412A V18) (continued)[2, 8]BWS 0/NWS 0BWS 1 / NWS 1K KComments。