MCH0603EFS中文资料

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SMT元件大全

SMT元件大全

J
2021/9/17
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42、贴片胆电容
1.元件代号: C 2.元件名称:贴片胆电容 3.元件丝印:106D 4.是否有极性或方向:有
2021/9/17
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43、贴片电感
1.元件代号: L 2.元件名称:贴片电感 3.元件丝印:H022 4.是否有极性或方向:有
2021/9/17
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44、贴片三极管
1.元件代号: D 2.元件名称:贴片玻璃二极管 3.元件丝印: 4.是否有极性或方向:有
D
2021/9/17
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8、贴片保险管
1.元件代号: F 2.元件名称:贴片保险管 3.元件丝印:125V 4.是否有极性及方向:无
2021/9/17
8
9、贴片晶振
1.元件代号: X\Y 2.元件名称:贴片晶振 3.元件丝印:9.830 4.是否有极性或方向:无
1、排阻:82欧姆
1.元件代号: R 2.元件名称:贴片排阻 3.元件丝印:820 4.是否有极性或方向:无 5.元件阻值:82欧姆 6.元件基本单位:欧姆
2021/9/17
1
2、贴片电阻:
1.元件代号: R 2.元件名称:贴片电阻 3.元件丝印:331 4.是否有极性或方向:无 5.元件阻值:330欧姆
2021/9/17
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34、贴片电阻
1.元件代号: R 2.元件名称:贴片电阻 3.元件丝印:750 4.是否有极性或方向:无 5.元件阻值:75欧姆
R
2021/9/17
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35、贴片多层电容
1.元件代号: C 2.元件名称:贴片多层电容 3.元件丝印:无 4.是否有极性或方向:无
C
2021/9/17

r0603手册

r0603手册

r0603手册R0603是一种常用的电子元件,是通过电子线圈和片式集成电路组成的被动电子元件,常用于电子设备和电路板上。

本手册将介绍R0603的基本知识、特点、应用和使用注意事项。

第一部分:基本知识1. 什么是R0603?R0603是一种尺寸为0.6mm x 0.3mm的电子元件。

它是一种电阻器(Resistor)。

2. R0603的结构R0603由两端引线组成,它通常由金属材料制成,如镍铬合金或锡银合金。

3. R0603的工作原理R0603的工作原理是根据欧姆定律来实现电阻效果。

当电流通过R0603时,会在元件中产生电阻,从而降低电流的流动。

4. R0603的参数R0603的主要参数有:电阻值、容差、功率、工作温度范围和工作电压。

5. R0603的电阻值R0603的电阻值通常使用单位欧姆(Ω)来表示,常见的电阻值有1欧姆到1兆欧姆。

6. R0603的容差R0603的容差是指实际电阻值与标称电阻值之间的允许偏差。

常见的容差包括1%、5%、10%等。

7. R0603的功率R0603的功率是指该元件能够承受的最大功率。

常见的功率有0.063瓦特、0.1瓦特等。

8. R0603的工作温度范围R0603的工作温度范围是指该元件可以正常工作的温度范围。

常见的工作温度范围为-55°C到+155°C。

9. R0603的工作电压R0603的工作电压是指该元件可承受的最大电压。

常见的工作电压有50伏特、100伏特等。

第二部分:特点1. 尺寸小巧R0603的尺寸非常小,可以适应密集电路板的设计需求。

2. 高准确性R0603的容差通常较低,能够提供较高的准确性和稳定性。

3. 耐用性强R0603具有良好的抗震、抗振和抗湿性能,能够在恶劣环境下长时间工作。

4. 广泛应用由于R0603尺寸小巧、性能稳定,它被广泛应用于各种电子设备和电路板上,如手机、电视、电脑和汽车等。

第三部分:应用1. 电子设备R0603被广泛应用于手机、平板电脑、数码相机等电子设备中,用于电源管理、信号处理、通信和显示等功能。

RC0603中文资料

RC0603中文资料

Thick Film Chip Resistor – General PurposeFeatures• Small and light weight• Excellent heat resistance and moisture resistance• Suitable size and packaging for surface mount assembly • RoHS CompliantApplications• For general purpose applications• For laptop and notebook computer, memory module, digital camera and telecommunication equipmentAbsolute Maximum Ratings & CharacteristicsProductNumbermm TolerancePower Rating @70˚CMAX Working Voltage MAXOverload VoltageTCR ppm/℃Resistance RangeRated WorkingTemperature±200 1Ω ~ 9.76Ω±100 10Ω ~ 1M ΩRC0603 1608J: ±5%F: ±1%1/10W 50V 100V ±2001.02M Ω ~ 10M Ω-55℃~+155℃*JumperProduct NumberJumper Rated CurrentResistanceRated Working Temperature RC0603 1A 50m Ω (max.)-55℃~+155℃RC0603 Power Derating CurveFor resistors operate in the ambient temperature over 70˚C, loading power ratio will de-rate in accordance with following curve.Soldering ConditionIR Reflow soldering Wave soldering (flow soldering)RC0603Dimensions(in mm)Product Number mm L W H AB Average Weight RC060316081.60 ± 0.100.80± 0.100.45 ± 0.100.30 ± 0.200.30 ± 0.202.02 mgMarking(1) ±5% Tolerance (J): 3 digits, the first two digits are significant figures; the third digit is numberof zeros to follow. Letter “R” is as decimal point; Letter “0” for jumper.(2) ±1% Tolerance (F): E–96 marking series as in the end. (E-96 series marking code Table)Examples:3 digits marking (±5%) E-96 marking (±1%)683 = 68x103 Ω Jumper 49X = 316x10-1Ω = 68000 Ω = 68K Ω = 31.6 Ω 7R 5 = 7.5 ΩRC0603 Test and RequirementsRequirement Test Item Test Method Test Condition±1% ±5% JumperTemperature Coefficient of Resistance(T.C.R.) JIS C 5201 4.8IEC 60115-1 4.8-55°C~+155,20°C isthe referencetemperatureWithin the specificationShort Time Overload JIS C 5201 4.13IEC 60115-1 4.132.5 times RCWV or max.overload voltage for 5seconds±(1.0%+0.05Ω) ±(2.0%+0.05Ω) <50mΩInsulation Resistance JIS C 5201 4.6IEC 60115-1 4.6Max. overload voltagefor 1 minute≥10GVoltage Proof JIS C 5201 4.7IEC 60115-1 4.71.42 times RCWV(RMS) for 1 minuteno breakdown or flashoverSubstrate Bending Test JIS C 5201 4.33IEC 60115-1 4.33Bending once with 5seconds for 3 mm±(1.0%+0.05Ω) ±(1.0%+0.05Ω) <50mΩResistance to soldering heat JIS C 5201 4.18IEC 60115 4.18260±5°C for 10 seconds±(0.5%+0.05Ω) ±(1.0%+0.05Ω) <50mΩLeaching JIS C 5201 4.18IEC 60115 4.18260±5°C for 60 seconds no leachingSolderability JIS C 5201 4.17IEC 60115-1 4.17245±5°C for 3 seconds. >95% coverageEndurance at upper category temperature JIS C 5201 4.23IEC 60115-1 2.23.2at +155°C for 1000 hrs ±(1.0%+0.05Ω) ±(1.5%+0.10Ω) <50mΩRapid change of temperature JIS C 5201 4.19IEC 60115-1 4.19-55°C to +155°C, 5cycles±(0.5%+0.05Ω) ±(1.0%+0.05Ω) <50mΩDamp heat with load JIS 5201 4.2440±2°C, 90~95% R.H.or max. working voltagefor 1000 hrswith 1.5hrs “ON” and 0.5hrs “OFF”±(2.0%+0.10Ω) ±(3.0%+0.10Ω) <100mΩEndurance JIS C 5201 4.25IEC 60115-1 4.25.170±2°C, RCWV or Max.working voltage for 1000hrs with 1.5 hrs“ON” and 0.5 hrs “OFF”±(2.0%+0.10Ω) ±(3.0%+0.10Ω) <100mΩNote: RCWV:Rated Continuous Working Voltage.RCWV= √Rated power (W) × Resistance value (R)RC0603Packing Information:Carrier Tape Dimensions (in mm)TypeABWEF P0 P1 P2ψD0T RC0603 1.10±0.1 1.90±0.1 8.0±0.2 1.75±0.13.5±0.054.0±0.14.0±0.052.0±0.05 1.5+0.1/-00.70±0.1Reel Dimensions (in mm)Reel DiameterPCS per ReelABCWT7’’ 5,000 180+0/-360+1/-0 13.0±0.29.0±0.5 11.4±1 13’’ 20,000 330±1 100±1 13.0±0.29.5±0.5 13.5±1Carton InformationPCS per CartonCarton Size300,000 400X400X200 ( in mm)RC0603 Table - E-96 series marking code (±1% Tolerance)Code R value Code R value Code R value Code R value Code R value Code R value Code R value Code R value01 100 13 133 25 178 37 237 49 316 61 422 73 562 85 75002 102 14 137 26 182 38 243 50 324 62 432 74 576 86 76803 105 15 140 27 187 39 249 51 332 63 442 75 590 87 78704 107 16 143 28 191 40 255 52 340 64 453 76 604 88 80605 110 17 147 29 196 41 261 53 348 65 464 77 619 89 82506 113 18 150 30 200 42 267 54 357 66 475 78 634 90 84507 115 19 154 31 205 43 274 55 365 67 487 79 649 91 86608 118 20 158 32 210 44 280 56 374 68 499 80 665 92 88709 121 21 162 33 215 45 287 57 383 69 511 81 681 93 90910 124 22 165 34 221 46 294 58 392 70 523 82 698 94 93111 127 23 169 35 226 47 301 59 402 71 536 83 715 95 95312 130 24 174 36 232 48 309 60 412 72 549 84 732 96 976 This table shows the first two digits for the three-digit EIA-96 part marking scheme.The third character is the letter of multiplier: Y=10-2 X=10-1 A=100 B=101 C=102 D=103 E=104 F=105RC0603 How to OrderRC0603 How to contact us:。

超低电阻0603封装保险丝

超低电阻0603封装保险丝

Performance SpecificationModelMarking V max(V dc)I max(A)I hold@25°C(A)I trip@25°C(A)P dTyp.(W)MaximumTime To TripResistanceCurrent(A)Time(Sec)R i min(Ω)R1max(Ω)JSMD0603-035L C 6.0500.350.70.98.00.10.15 1.0 JSMD0603-050L D 6.050.00.5 1.00.98.00.60.070.4 JSMD0603-075L F 6.050.00.75 1.5 1.08.0 1.00.040.2 JSMD0603-100L H 6.050.0 1.0 2.0 1.08.0 2.00.0250.12 JSMD0603-125L K 6.050.0 1.25 2.5 1.08.0 3.00.020.1 JSMD0603-150L L 6.050.0 1.5 3.0 1.08.0 4.00.0170.08 JSMD0603-175L N 6.050.0 1.75 3.5 1.08.0 5.00.0150.07 JSMD0603-200L S 6.050.0 2.0 4.0 1.08.0 5.00.0120.06 JSMD0603-260L T 6.050.0 2.6 5.2 1.08.0 5.00.010.05 JSMD0603-300L V 6.050.0 3.0 6.0 1.08.0 5.00.0080.04V max=Maximum operating voltage device can withstand without damage at rated current(Imax).I max=Maximum fault current device can withstand without damage at rated voltage(Vmax).I hold=Hold Current.Maximum current device will not trip in25°C still air.I trip=Trip Current.Minimum current at which the device will always trip in25°C still air.Pd=Power dissipation when device is in the tripped state in25°C still air environment at rated voltage.Ri min/max=Minimum/Maximum device resistance prior to tripping at25°C.R1max=Maximum device resistance is measured one hour post reflow.CAUTION:Operation beyond the specified ratings may result in damage and possible arcing and flame.Environmental SpecificationsTest Conditions Resistance change Passive aging+85°C,1000hrs.±5%typicalHumidity aging+85°C,85%R.H.,168hours±5%typicalThermal shock+85°C to-40°C,20times±33%typical Resistance to solvent MIL-STD-202,Method215No changeVibration MIL-STD-202,Method201No changeAmbient operating conditions:-40°C to+85°CMaximum surface temperature of the device in the tripped state is125°CAgency Approval and Environmental CompliancAgency File Number Regulation StandardUL E4868902011/65/EUTUV pending EN14582TP20~40S TP260TL217t L60~150s200150tsPreheat60~180s25t25°C to peakTimeRamp-downCritical ZoneTL to TP TsminTsmaxRamp-upThermal Derading ChartRecommended Hold Current(A)at Ambient Temperature(°C)Soldering ParametersModelAmbient OperationTemperature-40°C-20°C0°C25°C40°C50°C60°C70°C85°C JSMD0603-035L0.460.40.370.350.290.250.240.20.14 JSMD0603-050L0.660.570.530.50.410.360.340.290.2 JSMD0603-075L0.990.860.790.750.620.540.510.430.3 JSMD0603-100L 1.31 1.14 1.06 1.00.830.710.690.570.4 JSMD0603-125L 1.64 1.43 1.32 1.25 1.040.890.860.710.5 JSMD0603-150L 1.97 1.71 1.59 1.5 1.24 1.07 1.030.860.6 JSMD0603-175L 2.3 2.0 1.85 1.75 1.45 1.25 1.2 1.00.7 JSMD0603-200L 2.63 2.29 2.11 2.0 1.66 1.43 1.37 1.140.8 JSMD0603-260L 3.42 2.97 2.75 2.6 2.15 1.86 1.78 1.49 1.04 JSMD0603-300L 3.94 3.43 3.17 3.0 2.49 2.14 2.06 1.71 1.2Profile FeaturePb-Free Assembly Average Ramp-Up Rate(Ts max to T p)3℃/second mac.Preheat-Temperature Min(Ts min)-Temperature Max(Ts max)-Time(Ts min to Ts max)150℃200℃60~180seconds Time maintained above:-Temperature(TL)-Time(tL)217℃60~150seconds Peak Temperature(Tp)260℃Ramp-Down Rate6℃/second max.Time 25℃to Peak Temperature 8minutes max Storage Condition0℃~35℃,≤70%RH Recommended reflow methods:IR,vapor phase oven,hot air oven,N2environment for lead-freeRecommended maximum paste thickness is 0.25mmDevices can be cleaned using standard industry methods and solvents.Note 1:All temperature refer to topside of the package,measured on the package body surface.Note 2:If reflow temperatures exceed the recommended profile,devices may not meet the performance requirements.Physical Dimensions(mm.)Termination Pad CharacteristicsTerminal pad materials :Tin-plated Nickel-CopperTerminal pad solder ability :Meets EIA specification RS186-9E and ANSI/J-STD-002Category 3Model ABCD E Min.Max.Min.Max.Min.Max.Min.Min.JSMD0603-035L 1.45 1.850.65 1.050.30.70.150.1JSMD0603-050L 1.45 1.850.65 1.050.30.70.150.1JSMD0603-075L 1.45 1.850.65 1.050.30.70.150.1JSMD0603-100L 1.45 1.850.65 1.050.4 1.00.150.1JSMD0603-125L 1.45 1.850.65 1.050.4 1.00.150.1JSMD0603-150L 1.45 1.850.65 1.050.5 1.20.150.1JSMD0603-175L 1.45 1.850.65 1.050.5 1.20.150.1JSMD0603-200L 1.45 1.850.65 1.050.7 1.40.150.1JSMD0603-260L 1.45 1.850.65 1.050.7 1.40.150.1JSMD0603-300L1.451.850.651.050.71.40.150.1Recommended Pad Layout (mm.)Packaging QuantityTape &reel packaging per EIA481-1Tape And Reel Specifications (mm)Storage And Handling‧Storage conditions :35°C max,70%R.H.‧Devices may not meet specified performance if storage conditions are exceeded.Part Number Quantity JSMD 0603LoR Series5,000pcs/reelGoverning Specifications EIA 481-1W 8.0±0.2P0 4.0±0.10P1 4.0±0.10P2 2.0±0.05A0 1.05±0.10B0 1.85±0.10D0 1.55+0.10F 3.5±0.05E1 1.75±0.10E2min. 6.25T 0.75T1max.0.1K00.74/0.95±0.1Leader min.390Trailer min.160Reel Dimensions A max.178N min.60W19.0±0.5W212.0±0.05JSMD0603Series Surface Mount PTC Devices Part Number SystemWebsite:For additional information,please contact your local SalesRepresentative.©Copyright2016,jksemiis a registered trademark of jksemi All rights arereserved。

0603贴片灯珠规格书,0603红灯,蓝灯,黄绿,绿规格书

0603贴片灯珠规格书,0603红灯,蓝灯,黄绿,绿规格书

Package Dimensions
Hale Waihona Puke Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is .1(0.004") unless otherwise noted. 3.Specifications are subject to change without notice.
Note:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
SPEC NO: CJ568 APPROVED: Jun. Lu
REV NO: V.1 CHECKED:GEN.ZHANG
DATE: MAR/20/2006 DRAWN: Y.X.Y
PAGE: 1 OF 4
Hyper Red
300 250 200 150
Temoerature
S S
230°C Max 230°C
C Max
C/S Max C/S Max
100 50 25 0
C/S Max
0
50
100
Time
150
200
250
300
NOTES: 1. We recommend the reflow temperature 245°c(±5) The maximum soldering temperature shold be limited to 260°c 2. Don't cause stess too the epoxy resin while it is exposed to high temperature. 3. Numbe of reflow process shall be 2 time or less.

贴片保险丝0603系列型号尺寸规格书

贴片保险丝0603系列型号尺寸规格书

(a) RoHS Compliant & Halogen Free(b) Applications: All high-density boards(c) Product Features: Small surface mountable, Solid state, Faster time to trip thanstandard SMD devices, Lower resistance than standard SMD devices(d) Operation Current: 0.01A~0.20A(e) Maximum Voltage: 9V~60V DC(f) Temperature Range : -40℃to 85℃2. Agency RecognitionUL: File No. E211981TÜV: File No. R500905563. Electrical Characteristics (23℃)HI T=Trip current-minimum current at which the device will always trip at 23℃still air.V MAX=Maximum voltage device can withstand without damage at it rated current.(I MAX)I MAX= Maximum fault current device can withstand without damage at rated voltage (V MAX).Pd=Typical power dissipated-type amount of power dissipated by the device when in the tripped state in 23℃still air environment. R MIN=Minimum device resistance at 23℃prior to tripping.R1MAX=Maximum device resistance at 23℃measured 1 hour after tripping or reflow soldering of 260℃for 20 seconds. Termination pad characteristicsTermination pad materials:Pure Tin4. SMD Product Dimensions (Millimeters)5. Thermal Derating Curve6. Typical Time-To-Trip at 23℃7. Material SpecificationTerminal pad material: Pure TinSoldering characteristics: Meets EIA specification RS 186-9E, ANSI/J-std-002 Category 38. Part Numbering and Marking SystemPart Numbering System Part Marking SystemS M D □ □ □ – 0603Current RatingExampleWarning: -Operation beyond the specified maximum ratings or improper use may result in damage and possibleelectrical arcing and/or flame.-PPTC device are intended for occasional overcurrent protection. Application for repeated overcurrent condition and/or prolonged trip are not anticipated. 甲、 -Avoid contact of PPTC device with chemical solvent. Prolonged contact will damage the deviceperformance.AB=C=D=E=F=G=H=I= X=Y=Z=A=B=F=G==SMD001-0603SMD002-0603SMD003-0603SMD004-0603SMD005-0603SMD010-0603SMD012-0603SMD016-0603SMD020-0603SMD001-0603SMD002-0603SMD003-0603SMD004-0603SMD005-0603SMD010-0603SMD012-0603SMD016-0603SMD020-06039. Pad Layouts 、Solder Reflow and Rework RecommendationsThe dimension in the table below provide the recommended pad layout for each SMD 0603 deviceNote 1: All temperatures refer to of the package,measured on the package body surface.Reflow Profile。

0603红光(JCH-0603-R)0603红灯0603贴片红灯0603贴片红光

0603红光(JCH-0603-R)0603红灯0603贴片红灯0603贴片红光

ESD 静电防护 LED(特别是 InGaN 结构的蓝色、翠绿色、紫色、白色、粉红色 LED)是静电敏感元件, 静电或者 电流过载会破坏 LED 结构。LED 受到静电伤害或电流过载可能会导致性能异常,比如漏电流过大,VF 变低,或者无法点亮等等。所以请注意以下事项:
1. 接触 LED 时应佩戴防静电腕带或者防静电手套。 2. 所有的机器设备、工制具、工作桌、料架等等,应该做适当的接地保护(接地阻抗值 10Ω 以内)。 3. 储存或搬运 LED 应使用防静电料袋、防静电盒以及防静电周转箱,严禁使用普通塑料制品。 4. 建议在作业过程中,使用离子风扇来压制静电的产生。 5. 距离 LED 元件 1 英尺距离的环境范围内静电场电压小于 100V。
注: 1. 尺寸单位为毫米(mm)。 2. 尺寸公差是±0.1mm。
景创宏光电科技(深圳)有限公司
jingchuanghongOPTO-ELECTRONICS(SHENZHEN)CO, LTD.

产品规格书
Part No. : JCH-0603-R-04
版本
A.2
2.外形尺寸及建议焊盘尺寸
页码
2 of 11

Polarity

注: 1. 单位 : 毫米(mm)。 2. 公差 :如无特别标注则为±0.1 mm。
3. 建议焊接温度曲线
景创宏光电科技(深圳)有限公司
jingchuanghongOPTO-ELECTRONICS(SHENZHEN)CO, LTD.


产品规格书
Part No. : JCH-0603-R-04
版本
A.2
发布日期
2015-5-28
页码
5 of 11

自恢复保险丝SMD0603封装参数型号规格书大全

自恢复保险丝SMD0603封装参数型号规格书大全

The SMD0603 Series PTC providessurface mount over-currentprotection for applications where space is at a premium and resettable protection is desired.u RoHS compliant, Lead-Free and Halogen-Free u Fast time-to-tripu Compact design saves board space u Low resistance uLow-profileu Mobile phones - battery and port protection u Game console port protection u USB peripherals u Disk driveu PDAS / digital cameras u Power ports uGeneral electronicsHold Current Trip Current Rated Voltage Max Current Typical Power Maximum TimeTo Trip Resistance Part NumberI hold (A)I trip (A) V max (Vdc) I max (A) P dtyp. (W) Current (A) Time (Sec.) R min (Ω) R 1max (Ω) SMD0603-010 0.10 0.30 15 40 0.5 0.50 1.00 0.90 6.00 SMD0603-020 0.20 0.50 9.0 40 0.5 1.00 0.60 0.55 3.50 SMD0603-025 0.25 0.55 9.0 40 0.5 8.00 0.80 0.50 3.00 SMD0603-035 0.35 0.75 6.0 40 0.5 8.00 0.10 0.20 1.40 SMD0603-050 0.50 1.00 6.0 40 0.5 8.00 0.10 0.10 0.80 SMD0603-075 0.75 1.50 6.0 40 0.5 8.00 0.10 0.06 0.45 SMD0603-100 1.00 2.00 6.0 40 0.5 8.00 0.10 0.04 0.30I hold = Hold current: maximum current device will pass without tripping in 23°C still air. I trip = Trip current: minimum current at which the device will trip in 23°C still air. V max = Maximum voltage device can withstand without damage at rated current (I max ) I max = Maximum fault current device can withstand without damage at rated voltage (V max ) P dtyp.= Power dissipated from device when in the tripped state at 23°C still air. R min = Minimum resistance of device in initial (un-soldered) state.R 1max = Maximum resistance of device at 23°C measured one hour after tripping.Caution: Operation beyond the speci fied rating may result in damage and possible arcing and flame.Profile FeaturePb-Free Assembly Average Ramp-Up Rate (T S max to T P ) 3°C/second max. Preheat :Temperature Min (T S min) Temperature Max (T S max) Time (T S min to T S max)150°C 200°C60-180 seconds Time maintained above: Temperature(TL) Time (tL)217°C60-150 seconds Peak/Classification Temperature(T P ): 260°C Time within 5°C of actual peak: Temperature20-40 seconds Ramp-down Rate:6°C/ second max. Time 25°C to Peak Temperature8 minutes max.Note: All temperatures refer to of the package, measured on the package body surface.Solder reflowDue to “Lead Free ” nature, Temperature and Dwelling time for the soldering zone is higher than those for Regular. This may cause damage to other components.1. Recommended max past thickness > 0.25mm.2. Devices can be cleaned using standard methods and aqueous solvent.3. Rework use standard industry practices.4. Storage Environment : < 30/ 60%RH ℃Caution:1. If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.2. Devices are not designed to be wave soldered to the bottom side of the board.Terminal pad material Pure TinSoldering CharacteristicsMeets EIA specification RS 186-9E, ANSI/J-std-002 Category 3hold Ambient Temperature (°C)A B C DeviceNominalNominal Nominal 0603 Series1.000.701.00Model-40℃-20℃0℃25℃40℃50℃60℃70℃85℃SMD0603-010 0.13 0.12 0.11 0.10 0.08 0.07 0.06 0.05 0.03 SMD0603-020 0.27 0.25 0.23 0.20 0.17 0.14 0.12 0.10 0.07 SMD0603-025 0.32 0.29 0.27 0.25 0.21 0.18 0.16 0.05 0.03 SMD0603-035 0.47 0.41 0.38 0.35 0.29 0.26 0.24 0.20 0.14 SMD0603-050 0.67 0.59 0.54 0.50 0.41 0.37 0.34 0.29 0.20 SMD0603-075 0.98 0.85 0.81 0.75 0.60 0.54 0.44 0.40 0.31 SMD0603-1001.301.121.081.00 0.800.720.580.530.42Maximum ambient operating temperature(Tmao) vs. hold current (I hold)flame.u PPTC device are intended for occasional over-current protection. Application for repeated over-current condition and/or prolonged trip are not anticipated.uAvoid contact of PPTC device with chemical solvent. Prolonged contact will damage the device performance.0.33 (8.4)0.512(13.0)Arbor Hole DiameterDimensions are in inches (and millimeters)0.157 (4.0) 0.059 (1.5)Diameter Cover tape(4.0)(5.4)。

三星0603 22uf电容规格书

三星0603 22uf电容规格书

三星0603 22uf电容规格书三星0603 22uf电容规格书的解读与应用一、引言在现代电子产品中,电容作为一种重要的被动元件,在电路中扮演着储存电荷、滤波、耦合等重要作用。

而三星0603 22uf电容规格书作为电容的一种,其规格书所包含的信息对于电子工程师和电子爱好者来说是至关重要的。

在本篇文章中,我们将深度解读三星0603 22uf电容规格书的内容,并探讨其在电路设计和应用中的重要性。

二、三星0603 22uf电容规格书的解读1. 产品型号:三星0603 22uf电容规格书所指代的产品型号为0603,22uf。

其中,0603代表了电容的封装尺寸,而22uf则代表了电容的容量大小。

理解这一点对于正确选型和应用至关重要。

2. 规格参数:在规格书中,通常包含了电容的电压值、容差、温度特性等重要参数。

在选型过程中,需要根据具体的电路要求和环境条件来选择合适的规格参数,以确保电路稳定性和性能。

3. 使用注意事项:在规格书中,也会包含一些使用注意事项和贮存条件,这些信息对于保证电容性能和寿命至关重要。

在使用和贮存过程中需要严格按照规格书要求进行操作。

三、三星0603 22uf电容在电路设计和应用中的重要性作为一种常见的电容型号,三星0603 22uf电容在电路设计和应用中扮演着重要的角色。

由于其封装尺寸小巧,适合于电子产品的迷你化设计,因此在手机、平板等智能设备中得到了广泛应用。

22uf的较大容量可以满足一些对电荷储存和稳压要求较高的电路,例如稳压电路、滤波电路等。

在电子产品设计中,正确选用和应用三星0603 22uf电容对于提高电路性能和稳定性具有重要意义。

四、对三星0603 22uf电容的个人观点和理解在我看来,三星0603 22uf电容作为一种电子元件,其规格书所包含的信息对于电子工程师和电子爱好者来说是非常重要的。

通过深入了解其规格书的内容,可以更好地应用于实际电路设计中,并确保电路工作的稳定性和性能。

块状非焊接用锡银合金hs编码

块状非焊接用锡银合金hs编码

块状非焊接用锡银合金hs编码
【实用版】
目录
1.锡银合金的概述
2.块状非焊接用锡银合金的特性
3.HS 编码的含义和作用
4.块状非焊接用锡银合金 HS 编码的分类
5.我国对块状非焊接用锡银合金 HS 编码的应用和管理
正文
锡银合金是由锡和银两种元素组成的一种合金,具有良好的导电性、导热性和焊接性能,广泛应用于电子、电器、通信等领域。

块状非焊接用锡银合金,顾名思义,是指不用于焊接的锡银合金,其主要用途是作为电子元器件的连接材料和电镀材料。

HS 编码,即《商品名称分类》(Harmonized Commodity Description and Coding System)的简称,是一种国际通用的商品分类编码体系。

HS 编码对各类商品进行分类和编码,方便各国进行贸易统计、监管和税收管理等。

根据我国海关的规定,块状非焊接用锡银合金的 HS 编码属于"79011090",即"其他贱金属制品"。

这一编码包括了各种非焊接用的锡银合金制品,如锡银合金棒、锡银合金板等。

我国对块状非焊接用锡银合金 HS 编码的应用和管理十分严格。

一方面,我国海关要求进口和出口的锡银合金必须按照 HS 编码进行申报,以便于监管和统计;另一方面,我国鼓励企业采用 HS 编码进行产品分类和管理,以提高企业的生产效率和管理水平。

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VJ0603资料

VJ0603资料

For technical questions, contact: mlcc@Document Number: 45053VJ C0G (NP0) DielectricVishay VitramonSurface Mount Multilayer Ceramic Chip Capacitorsfor Commercial ApplicationsFEATURES•C0G is an ultra-stable dielectric offering a Temperature Coefficient of Capacitance (TCC) of 0 ± 30 ppm/°C•Low Dissipation Factor (DF)•Ideal for critical timing and tuning applications •Ideal for snubber and surge suppression applications •Protective surface coating of high voltage capacitors maybe required to prevent surface arcing.•Surface mount, precious metal technology, wet build processELECTRICAL SPECIFICATIONSNote: Electrical characteristics at + 25 °C unless otherwise specifiedOperating Temperature: - 55 °C to + 125 °C Capacitance Range: 1.0 pF to 0.056 µF Voltage Rating: 10 Vdc to 1000 VdcTemperature Coefficient of Capacitance (TCC): 0 ± 30 ppm/°C from - 55 °C to + 125 °CDissipation Factor (DF):0.1 % maximum at 1.0 V rms and 1 kHz for values > 1000 pF 0.1 % maximum at 1.0 V rms and 1 MHz for values ≤ 1000 pF Aging Rate: 0 % maximum per decadeInsulation Resistance (IR):At + 25 °C and rated voltage 100 000 M Ω minimum or 1000 ΩF, whichever is lessAt + 125 °C and rated voltage 10 000 M Ω minimum or 100 ΩF, whichever is lessDielectric Withstanding Voltage (DWV):This is the maximum voltage the capacitors are tested for a 1 to 5 second period and the charge/discharge current does not exceed 50 mA≤ 200 Vdc : DWV at 250 % of rated voltage 500 Vdc: DWV at 200 % of rated voltage630/1000 Vdc: DWV at 150 % of rated voltageNotes:(1) DC voltage rating should not be exceeded in application(2) Process Code may be added with up to three digits, used to control non-standard products and/or special requirements(3) Case size designator may be replaced by a four digit drawing number used to control non-standard products and/or requirementsORDERING INFORMATIONVJ0805 A 102KX AA T### (2)CASECODE DIELECTRICCAP ACIT ANCE NOMINAL CODECAP ACIT ANCE TOLERANCETERMINA TION DC VOL T AGE RA TING (1) MARKING P ACKAGINGPROCESSCODE0402060308051206121018081812182522202225A = C0G (NP0)Expressed inpicofarads (pF).The first twodigits aresignificant, thethird is amultiplier. An “R”indicates adecimal point.Examples:102 = 1000 pF 1R8 = 1.8 pFB = ± 0.10 pFC = ± 0.25 pFD = ± 0.5 pF F = ± 1 % G = ± 2 % J = ± 5 % K = ± 10 %Note: B, C, D < 10 pF F , G, J, K ≥ 10 pF X = Ni barrier 100 % tin plated F = AgPdX = 25 V A = 50 V B = 100 V C = 200 V E = 500 V L = 630 V G = 1000 VA = Unmarked M = Marked Note: Marking is only available for 0805 and 1206T = 7" reel/plastic tape C = 7" reel/paper tape R = 11 1/4" reel/plastic tape P = 11 1/4" reel/paper tape O = 7" reel/flamed paper tape I = 11 1/4"/13" reel/flamed paper tape Note: “I” and “O” is used for “F” termination paper tapedVJ C0G (NP0) DielectricVishay VitramonSurface Mount Multilayer Ceramic Chip Capacitorsfor Commercial Applications ArrayDocument Number: 45053For technical questions, contact: mlcc@ For technical questions, contact: mlcc@Document Number: 45053VJ C0G (NP0) DielectricVishay Vitramon Surface Mount Multilayer Ceramic Chip Capacitorsfor Commercial ApplicationsNote:(1) See soldering recommendations within this data book, or visit /doc?45034•• Paper tape • Plastic tape SELECTION CHARTSTYLE VJ0402VJ0603VJ0805VJ1206VJ1210 (1)EIA TYPE 04020603080512061210VOLTAGE (Vdc)255010050100200501002005005010020050063050100200500630CAP. CODE CAP.1R0 1.0 pF ••••••••••••••••••••••••1R2 1.2 pF ••••••••••••••••••••••••1R5 1.5 pF ••••••••••••••••••••••••1R8 1.8 pF ••••••••••••••••••••••••2R2 2.2pF ••••••••••••••••••••••••2R7 2.7 pF ••••••••••••••••••••••••3R3 3.3 pF ••••••••••••••••••••••••3R9 3.9pF ••••••••••••••••••••••••4R7 4.7 pF ••••••••••••••••••••••••5R6 5.6 pF ••••••••••••••••••••••••6R8 6.8pF ••••••••••••••••••••••••8R28.2 pF ••••••••••••••••••••••••10010 pF •••••••••••••••••••••••••12012pF •••••••••••••••••••••••••15015 pF •••••••••••••••••••••••••18018 pF •••••••••••••••••••••••••22022pF •••••••••••••••••••••••••27027 pF •••••••••••••••••••••••••33033 pF •••••••••••••••••••••••••39039pF •••••••••••••••••••••••••47047 pF •••••••••••••••••••••••••56056 pF •••••••••••••••••••••••••••68068 pF •••••••••••••••••••••••••••82082 pF •••••••••••••••••••••••••••101100 pF •••••••••••••••••••••••••••121120 pF •••••••••••••••••••••••••••151150 pF •••••••••••••••••••••••••181180 pF •••••••••••••••••••••••••221220 pF •••••••••••••••••••••••••••271270 pF •••••••••••••••••••••••331330 pF •••••••••••••••••••••391390 pF •••••••••••••••••••••471470 pF •••••••••••••••••561560 pF •••••••••••••••••681680 pF •••••••••••••••••821820 pF •••••••••••••••1021000 pF ••••••••••••••1221200 pF ••••••••••1521500 pF ••••••••••1821800 pF •••••••••2222200 pF •••••••2722700 pF •••••••3323300 pF •••••••3923900 pF ••••••4724700 pF •••••5625600 pF ••••6826800 pF •••8228200 pF ••1030.010 µF ••1230.012 µF •1530.015 µF 1830.018 µF 2230.022 µF 2730.027 µF 3330.033 µF 3930.039 µF 4730.047 µF 5630.056 µFVJ C0G (NP0) DielectricSurface Mount Multilayer Ceramic Chip Capacitors for Commercial ApplicationsVishay VitramonDocument Number: 45053For technical questions, contact: mlcc@Note:(1) See soldering recommendations within this data book, or visit /doc?45034• Plastic tapeSELECTION CHARTSTYLE VJ1808 (1)VJ1812 (1)VJ1825 (1)VJ2220 (1)VJ2225 (1)EIA TYPE -18121825--VOLTAGE (Vdc)5010020050010005010020050010005010020050050100200500100050100200500CAP. CODE CAP.1R0 1.0 pF 1R2 1.2 pF 1R5 1.5 pF 1R8 1.8 pF 2R2 2.2 pF 2R7 2.7 pF 3R3 3.3 pF 3R9 3.9 pF 4R7 4.7 pF 5R6 5.6 pF 6R8 6.8 pF 8R28.2 pF 10010 pF ••12012 pF ••15015 pF ••18018 pF •••22022 pF •••27027 pF •••33033 pF •••39039 pF •••47047 pF •••56056 pF •••68068 pF ••••82082 pF ••••101100 pF •••••••121120 pF ••••••••151150 pF ••••••••181180 pF ••••••••221220 pF •••••••••••271270 pF •••••••••••331330 pF •••••••••••391390 pF •••••••••••471470 pF •••••••••••••561560 pF •••••••••••••681680 pF •••••••••••••821820 pF •••••••••••••1021000 pF ••••••••••••••••1221200 pF •••••••••••••••••1521500 pF •••••••••••••••••1821800 pF •••••••••••••••••2222200 pF ••••••••••••••••••2722700 pF •••••••••••••••••3323300 pF •••••••••••••••••3923900 pF •••••••••••••••••4724700 pF •••••••••••••••••5625600 pF ••••••••••••••••6826800 pF •••••••••••••••••8228200 pF ••••••••••••••••1030.010 µF •••••••••••••••1230.012 µF •••••••••••••1530.015 µF ••••••••••1830.018 µF •••••••••2230.022 µF •••••••••2730.027 µF •••••••3330.033 µF ••••••3930.039 µF ••••4730.047 µF ••5630.056 µF• For technical questions, contact: mlcc@Document Number: 45053VJ C0G (NP0) DielectricVishay Vitramon Surface Mount Multilayer Ceramic Chip Capacitorsfor Commercial ApplicationsDisclaimer Legal Disclaimer NoticeVishayAll product specifications and data are subject to change without notice.Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product.Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed therein, which apply to these products.No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay.The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications.Product names and markings noted herein may be trademarks of their respective owners.元器件交易网Document Number: 。

0603自恢复保险丝

0603自恢复保险丝

A.Features重要特性♦Smaller size saves board space and cost超小尺寸、节约空间和成本♦Resettable circuit protection自恢复保护、免维护♦Fast time-to-trip动作时间快♦Low resistance低内阻值♦Surface mount packaging for automated assembly贴片式封装,方便自动化生产♦Lead-free and compliant with the European Union RoHS Directive2002/95/EC 符合欧州ROHS无铅环保要求B.Application应用范围Polymer Resettable Fuse for over-current,over-temperature and short-circuit protection可恢复保险丝用于过流、温度和线路短路保护♦Computer motherboards计算机主板♦IEEE1394PortsIEEE1394通讯接口♦USB hub,ports and peripheralsUSB交换机及外围设备♦Phones电话设备♦Data communication数据交换机♦Modems/Ethernet/LAN调制解调器/以太网C.General Description简要概述Polymer resettable fuse are made of polymeric PTC materials which is a matrix of polymer containing 自恢复保险丝是聚合物高分子材料通过特殊工艺而成,dispersed conductive particles.Generally,the device has a very low resistance.If an over-current高分子粒子按一定的规律排列,自恢复保险丝器件有低内阻happened,as a response to the damage current,the resistance will immediately increase to very high,当电路中电流突然增大时,器件将会在短时间内阻值升到高阻状态、高分子膨胀从而起到减少过电流;reducing the current of the circuit to a safe value that the loading can carry.Once fault to the circuit isweed out and power is recuperated,the polymer will deflate itself ,the device will reset and isready for normal operation.一旦故障排除后,高分子将会恢复正常规则排序。

ESD Suppressor SMD 0603 产品说明书

ESD Suppressor SMD 0603 产品说明书

Artikelnummer / part number :823 56 120 100Datum / Date :2006-10-15Bezeichnung :description :0603 ESD SuppressorSMD size:0603A Mechanische Abmessungen / dimensions :SIZE(Unit : mm)B Elektrische Eigenschaften / electrical properties :TECHNICAL DATAWorking Max. ClampingTyp.Leakage ESD Pulse ESD Voltage Voltage Voltage Clamp. V Current Withstandair dischargeDC V(*1)V (*2)µA (*3)kV (*4)pF Spezifikation für Freigabe / specification for releasePart NumberKunde / customer :CapacitanceROHS Compliant823 56 120 1001260-1-+/-1510* 1 Max. Clamping Voltage at 8/20 waveformand 1 A pulse current Capacitance tolerance:+/-30%* 2 Typ. Clamping Voltage per 8 kV ESD contact discharge methodCapacitance measured at:1MHz* 3 Leakage Current at max operating voltage, the max leakage current was measured at reliability test * 4. ESD Typ. Withstands Voltage design and method guarantee this propertyWAVE FORMESD LEVEL IEC61000-4-2Severity Level Air DischargeDirect Discharge1 2 kV 2 kV 2 4 kV4 kV 38 kV 6 kV 415 kV 8 kV 5Special SpecialREFERENCE DATA Response timeT rise <1ns Operating ambientg temperature -40~+85℃Storage temperature -50~+125℃Max. temperature solder 260/10s℃OTHER DATA BodyZnO End termination Ag/Ni/Sn PackagingReelComplies with Standard IEC61000-4-2Procedure Solgel MarkingNoneD-74638 Waldenburg · Max-Eyth-Straße 1 - 3 · Germany · Telefon (+49) (0) 7942 - 945 - 0 · Telefax (+49) (0) 7942 - 945 - 400Würth Elektronik eiSos GmbH & Co.KG - Radialex departmentArtikelnummer / part number :823 56 120 100Bezeichnung :description :0603 ESD SuppressorSMD size:0603C Lötpad / soldering spec. :RECOMMENDED SOLDER PAD LAYOUT (Unit : mm)1 - The solder paste shall be printed in a thickness of 150 to 200µm.2 - The SIR test of the solder paste shall be done (Based on JIS-Z-3284)3 - IR reflow Pb Free Process suggestin profile (Based on J-STD-020-C):Spezifikation für Freigabe / specification for releaseKunde / customer :Rapid heating, partial heating or rapid cooling will easily cause defect of the component. So preheating and gradual cooling process is suggested. IR soldering has the highest yields due to controlled heating rates and solder liquidus times. Make sure that the element is notSoldering recommend paste is Sn 96.5/Ag 3.5- Preheat1.The temperature rising speed is suggested to be 2~3℃/s.2.Appropriate preheat time will be from 60 to 120 seconds.3.Temp. maintain at 175 +/-25°C 120 seconds. - Heating1.Careful about sudden rise in temperature as it may worsen the solder ability.2.Set the peak temperature in 235℃10-20s or 260°C 3-10s.- Cooling1.Ramp down rate 6°C/s max.※Perform adequate test in advance as the reflow temperature profile will vary according to the conditions of the manufacturing process, and the specification of the reflow furnace4 - Hand Soldering ProcessPreheating 150°CTemperature of soldering iron tip 380°C max. 3 to 5 secThe Varistorrs shall be cooled gradually at room ambient temperature5 - Ultrasonic cleaningFor preventing failures or damages. Frequency 29MHz max - radied Power 20W/l max - Period 5mn maxsubjected to a thermal gradient steeper than 3 degrees per second. 2 degrees per second is the ideal gradient. During the soldering process, pre- heating to within 175 degrees of the solders peak temperature is essential to minimize thermal shock.Time (mn)T e m p e r a t u r e (°C )7525Time (mn)T e m p e r a t u r e (°C )2507510012515017520022501:00:002502:00:0003:00:0004:00:00Peak Temp.260°C (3 to 10sec)Preheat.175°C 150sec max.275D-74638 Waldenburg · Max-Eyth-Straße 1 - 3 · Germany · Telefon (+49) (0) 7942 - 945 - 0 · Telefax (+49) (0) 7942 - 945 - 400Würth Elektronik eiSos GmbH & Co.KG - Radialex departmentArtikelnummer / part number :823 56 120 100Bezeichnung :description :0603 ESD SuppressorSMD size:0603D Rollenspezifikation / tape and reel specification :1 - Carrier tape and transparent cover tape should be heat-sealed to carry the products, and the reel should be usedto reel the carrier tape.2 - The adhesion of the heat-sealed cover tape shall be 40 ﹢20/ ﹣15grams.3 - Both the head and the end portion of the taping shall be empty for reel package and SMT auto-pickup machine. And a normal paper tape shall be conected in the head of taping for the operator to handle.(Unit : mm)Spezifikation für Freigabe / specification for releaseKunde / customer:TAPE SPECIFICATION(Unit : mm)Würth Elektronik eiSos GmbH & Co.KG - Radialex departmentD-74638 Waldenburg · Max-Eyth-Straße 1 - 3 · Germany · Telefon (+49) (0) 7942 - 945 - 0 · Telefax (+49) (0) 7942 - 945 - 400Artikelnummer / part number :823 56 120 100Bezeichnung :description :0603 ESD SuppressorSMD size:0603D Rollenspezifikation / tape and reel specification :(Unit : mm)Spezifikation für Freigabe / specification for releaseKunde / customer :REEL DIMENSION(Unit : mm)QUANTITY PER PACKING UNIT Freigabe erteilt /Kunde / customergeneral release:JP. PENLOU Update Clamping Voltage 06-10-15Datum / dateUnterschrift / signature JP. PENLOU High Temperature Load06-07-31Würth ElektronikJP. PENLOU New P/N06-06-02JP. PENLOU Operating temp. Range 05-11-30JP. PENLOULead free soldering 05-11-04Geprüft / checked 2006-07-31Kontrolliert / approved JP. PenlouName Änderung / modificationDatum / dateWürth Elektronik eiSos GmbH & Co.KG - Radialex departmentD-74638 Waldenburg · Max-Eyth-Straße 1 - 3 · Germany · Telefon (+49) (0) 7942 - 945 - 0 · Telefax (+49) (0) 7942 - 945 - 400。

ad中0603的封装电容 -回复

ad中0603的封装电容 -回复

ad中0603的封装电容-回复广告中的0603封装电容是一种非常常见的电子元件,它在电子电路中起着至关重要的作用。

本文将逐步回答以下问题:什么是0603封装电容?它的特点是什么?在电子电路中起到了什么作用?如何正确选择和使用0603封装电容?一、什么是0603封装电容?0603封装电容是一种表面贴装技术(SMT)封装的电容器。

它的尺寸为0.06英寸× 0.03英寸(1.6 mm × 0.8 mm)。

它通常由内电极和外极之间的绝缘介质组成,外极常用金属箔或者金属化的电解质涂层。

二、0603封装电容的特点有哪些?1. 尺寸小:0603封装电容体积小巧,适合在有限空间内使用,特别适用于小型电子设备。

2. 重量轻:由于其小尺寸,0603封装电容重量轻,可以减少整个电路板的重量。

3. 高频特性好:由于内电极的特殊结构设计,0603封装电容具有很好的高频特性,适用于高频电路应用。

4. 低ESR:ESR是等效串联电阻的缩写,0603封装电容的ESR通常较低,能够提供稳定的电流输出。

三、0603封装电容在电子电路中起到了什么作用?0603封装电容在电子电路中承担着存储和释放电荷的重要作用。

它可以吸收和储存电子器件中的起伏不定的电压,以便在需要时释放这些电压,以保持电路的稳定性和可靠性。

它可以用于去除电源中的噪声信号,提供稳定的电源电压。

四、如何正确选择和使用0603封装电容?1. 电容值的选择:根据电路设计的需求和性能要求选择合适的电容值。

0603封装电容的容值范围很广,一般从几皮法(pF)到几百微法(μF)。

2. 工作电压的选择:根据电路的工作电压选择合适的0603封装电容,以确保电容器的额定工作电压大于电路的最大工作电压。

3. 精度的选择:根据电路的精度要求选择合适的精度等级,一般有标准精度、高精度等级可供选择。

4. 温度系数的选择:根据应用场景的温度变化情况选择合适的温度系数等级。

在使用0603封装电容时,还需注意以下几点:1. 焊接温度:正确控制焊接温度,避免温度过高导致电容器损坏。

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entirely new level of stability and voltage ratings in chip resistors. Our MCH series of resistors meets the same high standards as our HVC series, but with the added feature of an extended temperature range.
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♦Tight Tolerances ( to 0.1% ) ♦Low TCR and VCR ♦Very Low noise

Extended Temperature Range
(-55ºC to +125ºC)
♦Custom Configurations
The usual hybrid technologies for manufacturing resistors depend upon composite materials that have limitations. Traditional thick-film methods severely limit
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Note 1: Other standard & custom case sizes are available including: 0403, 0502, 0504, 1004, 1210 & 2510 Note 2: The continuous maximum voltage applied cannot exceed the maximum power rating.
MCH Series
Military Grade High Voltage Chip Resistors
Ratings
Case Size 1
0402 0503 0603 0805 1005 1206 1505 2010 2208 2512 3512 Max. Power (W) 0.040 0.050 0.060 0.200 0.250 0.330 0.330 1.000 0.750 2.000 3.000 Max. Voltage 2 (V)
(In air)
300 350 400 600 750 1000 1200 1700 2000 2500 3500 Max. Voltage (V) (Potted) 4000 6000 6000 10K 13K 16K 19K 30K 35K 40K 50K Resistance Range (ohms)
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10K-1T
5K-1.5T
10K-2.0T
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resistors unmatched design efficiency, versatility, linearity, stability and low noise. The FineFilm method allows control of process parameters to very tight tolerances. The result is chip resistors with outstanding stability and high voltage ratings.
Using the same method, a complete line of FineFilm leaded resistors, dividers and networks are manufactured. For information on those products, please refer to the appropriate data sheets.
L = Length W = Width T = Thickness D = Pad dimension
Dimensions
Wrap-around Type B & U terminations
Case Size
?
Length (L) (mils)
Width (W) (mils)
Thickness (T) Max. (mils)
Pad (D) (mils)
0402 40 + 5 20 + 3 20 10 (+ 5) 0403 40 + 5 30 + 5 20 10 (+ 5) 0502 50 (+10,-5) 25 + 5 20 10 (+ 5) 0503 55 (+10,-5) 30+ 5 20 6 (+ 2) 0504 50 (+10,-5) 40+ 5 20 6 (+ 2) 0603 63 (+10,-5) 31 + 5 20 10 (+10,-5) 0805
79 (+10,-5) 50 + 5 25 10 (+10,-5) 1004 100 (+10,-5) 40 + 5 25 15 (+10,-5) 1005 100 (+10,-5) 50 + 5 25 15 (+10,-5) 1206 126 (+10,-5) 63 + 5 30 15 (+10,-5) 1210 126 (+10,-5) 98 + 5 30 15 (+10,-5) 1505 150 (+10,-5) 50 + 5 30 15 (+10,-5) 2010 200 (+10,-5) 100 + 5 30 20 (+10,-5) 2208 225 (+10,-5) 75 + 5 30 20(+10,-5) 2510 250 (+10,-5) 100 + 5 30 20 (+10,-5) 2512 250 (+10,-5) 125 + 5 30 20 (+10,-5) 3512
350 (+10,-5)
125 + 5
30
20 (+10,-5)
Bondable Type G & S terminations。

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