HLMP-KB45-F00DD中文资料

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HLMP-345X中文资料

1-101HT-13/4 (5 mm) Low Profile LED Lamps Technical DataFeatures• High Intensity• Low Profile: 5.8 mm (0.23in.) Nominal• T-13/4 Diameter Package • Diffused and Non-diffused Types• General Purpose Leads• IC Compatible/Low Current Requirements• Reliable and RuggedDescriptionThe HLMP-335X/-336X Series are Gallium Arsenide Phosphide on Gallium Phosphide HighEfficiency Red Light Emitting Diodes.The HLMP-345X/-346X Series are Gallium Arsenide Phosphide on Gallium Phosphide Yellow Light Emitting Diodes.The HLMP-355X/-356X Series are Gallium Phosphide Green Light Emitting Diodes.The Low Profile T-13/4 package provides space savings and is excellent for backlighting applications.Package DimensionsHLMP-335X Series HLMP-336X Series HLMP-345X Series HLMP-346X Series HLMP-355X Series HLMP-356X Series5964-9295E1-1021-103Electrical Specifications at T A = 25°CDevice Test Symbol Description HLMP-Min.Typ.Max.Units Conditions I VAxial Luminous Intensity3350 2.1 3.5mcdI F = 10 mA 3351 5.47.0(Figure 8)33658.610.0336613.818.02θ1/2Including Angle Between Half 335050Deg.Note 1 (Figure 11)Luminous Intensity Points335150336545336645λPEAK Peak Wavelength 635nm Measurement at Peak (Figure 1)λd Dominant Wavelength 626nm Note 2∆λ1/2Spectral Line Halfwidth 40nm τs Speed of Response 90ns C Capacitance 11pF V F = 0; f = 1 MHz R θJ-PIN Thermal Resistance 260°C/W Junction to Cathode Lead V F Forward Voltage1.92.4V I F = 10 mA (Figure 7)V R Reverse Breakdown Voltage 5.0V I R = 100 µA ηVLuminous Efficacy145lm/WNote 3High Efficiency Red HLMP-335X/-336X Series Notes:1. θ1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity.2. Dominant wavelength, λd , is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the device.3. Radiant Intensity, I e , in watts/steradian may be found from the equation I e = I v /ηv , where I v is the luminous intensity in candelas and ηv is the luminous efficacy in lumens/watt.Figure 8. Relative Luminous Intensity vs. Forward Current.Figure 7. Forward Current vs.Forward Voltage.Figure 9. Relative Efficiency(Luminous Intensity per Unit Current)vs. Peak Current.1-104Figure 10. Maximum Tolerable Peak Current vs. Pulse Duration. (I DC MAX as per MAX Ratings).Figure 11. Relative Luminous Intensity vs. Angular Displacement.Electrical Specifications at T A = 25°CDevice Test Symbol Description HLMP-Min.Typ.Max.Units Conditions I VAxial Luminous Intensity3450 2.2 4.0mcdI F = 10 mA 34515.710.0(Figure 13)3465 5.712.034669.218.02θ1/2Including Angle Between Half 345050Deg.Note 1 (Figure 16)Luminous Intensity Points345150346545346645λPEAK Peak Wavelength 583nm Measurement at Peak (Figure 1)λd Dominant Wavelength 585nm Note 2∆λ1/2Spectral Line Halfwidth 36nm τs Speed of Response 90ns C Capacitance 15pF V F = 0; f = 1 MHz R θJ-PIN Thermal Resistance 260°C/W Junction to Cathode Lead V F Forward Voltage2.02.4V I F = 10 mA (Figure 12)V R Reverse Breakdown Voltage 5.0V I R = 100 µA ηVLuminous Efficacy500lm/WNote 3Yellow HLMP-345X/-346X SeriesNotes:1. θ1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity.2. Dominant wavelength, λd , is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the device.3. Radiant Intensity, I e , in watts/steradian may be found from the equation I e = I v /ηv , where I v is the luminous intensity in candelas and ηv is the luminous efficacy in lumens/watt.1-105Figure 15. Maximum Tolerable Peak Current vs. Pulse Duration. (I DC MAX as per MAX Ratings).Figure 16. Relative Luminous Intensity vs. Angular Displacement.Figure 13. Relative Luminous Intensity vs. Forward Current.Figure 14. Relative Efficiency(Luminous Intensity per Unit Current)vs. Peak Current.Figure 12. Forward Current vs.Forward Voltage.605040302010V – FORWARD VOLTAGE – V FI – F O R W A R D C U RRE N T – m AF1-106Electrical Specifications at T A = 25°CDevice Test Symbol Description HLMP-Min.Typ.Max.Units Conditions I VAxial Luminous Intensity3553 1.6 3.2mcdI F = 10 mA 3554 6.710.0(Figure 18)35674.27.0356810.615.02θ1/2Including Angle Between Half 355350Deg.Note 1 (Figure 21)Luminous Intensity Points355450356740356840λPEAK Peak Wavelength 565nm Measurement at Peak (Figure 1)λd Dominant Wavelength 569nm Note 2∆λ1/2Spectral Line Halfwidth 28nm τs Speed of Response 500ns C Capacitance 18pF V F = 0; f = 1 MHz R θJ-PIN Thermal Resistance 260°C/W Junction to Cathode Lead V F Forward Voltage2.12.7V I F = 10 mA (Figure 17)V R Reverse Breakdown Voltage 5.0V I R = 100 µA ηVLuminous Efficacy595lm/WNote 3Green HLMP-355X/-356X SeriesNotes:1. θ1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity.2. Dominant wavelength, λd , is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the device.3. Radiant Intensity, I e , in watts/steradian may be found from the equation I e = I v /ηv , where I v is the luminous intensity in candelas and ηv is the luminous efficacy in lumens/watt.Figure 17. Forward Current vs.Forward Voltage.Figure 19. Relative Efficiency (Luminous Intensity per Unit Current) vs. Peak Current.Figure 18. Relative Luminous Intensity vs. Forward Current.1-107Figure 20. Maximum Tolerable Peak Current vs. Pulse Duration. (I DC MAX as per MAX Ratings).Figure 21. Relative Luminous Intensity vs. Angular Displacement.。

HLMP-CM26-Q0DDD中文资料

Agilent HLMP-CxxxT-13/4 (5mm) Extra Bright Precision Optical Performance InGaN LED Lamps Data SheetDescriptionThese high intensity blue and green LEDs are based on the most efficient and cost effective InGaN material technology. The 470 nm typical dominant wave–length for blue and 525 nm typical wavelength for green is well suited to color mixing in full color signs. The 505 nm typical dominant wavelength for cyan is suitable for traffic signal application.These LED lamps are untinted, non-diffused, T-13/4 packagesFeatures•Well defined spatial radiationpattern•High luminous output•Available in blue, green, and cyancolor•Viewing angle: 15°, 23°and 30°•Standoff or non-standoff leads•Superior resistance to moistureApplications•Traffic signals•Commercial outdoor advertising•Front panel backlighting•Front panel indicator incorporating second generationoptics which produce well-definedspatial radiation patterns atspecific viewing cone angles.These lamps are made with anadvanced optical grade epoxy,offering superior temperatureand moisture resistance inoutdoor signal and signapplications. The high maximumLED junction temperature limitof +110°C enables hightemperature operation in brightsunlight conditions.HLMP-CB11, HLMP-CB12, HLMP-CM11, HLMP-CM12, HLMP-CE11,HLMP-CE12, HLMP-CB26, HLMP-CB27, HLMP-CM26, HLMP-CM27,HLMP-CE26, HLMP-CE27, HLMP-CB36, HLMP-CB37, HLMP-CM36,HLMP-CM37, HLMP-CE36, HLMP-CE37CAUTION: Devices are Class I ESD sensitive. Please observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional details.Package DimensionsPackage APackage B5.80 ± 0.20(0.228 ±∅ CATHODEFLATMIN.SQ. TYP.NOTES:1. MEASURED JUST ABOVE FLANGE.2. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).3. EPOXY MENISCUS MAY EXTEND ABOUT 1 mm (0.040") DOWN THE LEADS.4. IF HEAT SINKING APPLICATION IS REQUIRED, THE TERMINAL FOR HEAT SINK IS ANODE.Device Selection GuideTypicalViewing Angle,Intensity (cd) at 20 mA PackagePart Number Color2q1/2 (Degree)Min.Max.Standoff Dimension Lens HLMP-CB11-TW0xx Blue15 2.57.2No A Clear HLMP-CB11-UVAxx Blue15 3.2 5.5No A Clear HLMP-CB12-TW0xx Blue15 2.57.2Yes B Clear HLMP-CM11-Y20xx Green159.327.0No A Clear HLMP-CM11-Z1Cxx Green1512.021.0No A Clear HLMP-CM12-Y20xx Green159.327.0Yes B Clear HLMP-CE11-X10xx Cyan157.221.0No A Clear HLMP-CE12-X10xx Cyan157.221.0Yes B Clear HLMP-CB26-SV0xx Blue23 1.9 5.5No A Clear HLMP-CB26-TUDxx Blue23 2.5 4.2No A Clear HLMP-CB27-SV0xx Blue23 1.9 5.5Yes B Clear HLMP-CM26-X10xx Green237.221.0No A Clear HLMP-CM26-YZCxx Green239.316.0No A Clear HLMP-CM27-X10xx Green237.221.0Yes B Clear HLMP-CE26-WZ0xx Cyan23 5.516.0No A Clear HLMP-CE27-WZ0xx Cyan23 5.516.0Yes B Clear HLMP-CB36-QT0xx Blue30 1.15 3.2No A Clear HLMP-CB36-RSAxx Blue30 1.5 2.5No A Clear HLMP-CB37-RU0xx Blue30 1.5 4.2Yes B Clear HLMP-CB37-RSDxx Blue30 1.5 2.5Yes B Clear HLMP-CM36-X10xx Green307.221.0No A Clear HLMP-CM36-XYCxx Green307.212.0No A Clear HLMP-CM37-X10xx Green307.221.0Yes B Clear HLMP-CM37-XYCxx Green307.212.0Yes B Clear HLMP-CM37-XYDxx Green307.212.0Yes B Clear HLMP-CE36-WZ0xx Cyan30 5.516.0No A Clear HLMP-CE37-WZ0xx Cyan30 5.516.0Yes B ClearNotes:1.Tolerance for luminous intensity measurement is ±15%.2.The luminous intensity is measured on the mechanical axis of the lamp package.3.The optical axis is closely aligned with the package mechanical axis.4.LED light output is bright enough to cause injuries to the eyes. Precautions must be taken to prevent looking directly at the LED without propersafety equipment.5. 2q1/2 is the off-axis angle where the luminous intensity is 1/2 the on-axis intensity.Part Numbering SystemHLMP-x x xx-x x x xxMechanical Options00: BulkDD: Ammo PackColor Bin Options0: Full Color Bin DistributionA: Color Bin 1 and 2C: Color Bin 3 and 4D: Color Bin 4 and 5Maximum Intensity Bin0: No Maximum Intensity Bin LimitationOthers: Refer to Device Selection GuideMinimum Intensity BinRefer to Device Selection GuideViewing Intensity Bin11: 15° Without Standoff12: 15°With Standoff26: 23°Without Standoff27: 23°With Standoff36: 30°Without standoff37: 30°With StandoffColorB: Blue 470 nmM: Green 525 nmE: Cyan 505 nmPackageC: T-13/4 (5 mm) Round LampAbsolute Maximum Rating at T A = 25°CParameters Value UnitDC Forward Current [1]30mAPeak Pulsed Forward Current[3]100mAAverage Forward Current30mAPower Dissipation120mWLED Junction Temperature110°COperating Temperature Range–40 to +85°CStorage Temperature Range–40 to +100°CWave Soldering Temperature[2]250 for 3 secs°CNotes:1.Derate linearly as shown in Figure2.2.1.59 mm (0.060 inch) below body.3.Duty factor 10%, frequency 1 KHz.Electrical/Optical CharacteristicsT A = 25o CBlue Green CyanParameters Symbol Min.Typ.Max.Min.Typ.Max.Min.Typ.Max.Units Test Condition Forward Voltage V F 3.5 4.0 3.6 4.0 3.5 4.0V I F = 20 mA Reverse Voltage[1]V R 5.0 5.0 5.0V I R = 10 µA Thermal Resistance R q J-PIN240240240o C/W LED Junction toAnode Lead Dominant l d460470480520525540490505510nm I F = 20 mA Wavelength[2]Peak Wavelength l PEAK464516501nm Peak of Wavelengthof Spectral Distribu-tion at I F = 20 mA Spectral Half Width Dl1/2233230nm Wavelength Widthat Spectral Distribu-tion Power Pointat I F = 20 mA Luminous Efficacy[3]h v74484319lm/W Emitted LuminousPower/EmittedRadiant Power Notes:1.The reverse voltage of the product is equivalent to the forward voltage of the protective chip at I R = 10 µA.2.The dominant wavelength, l d, is derived from the Chromaticity Diagram and represents the color of the lamp.3.The radiant intensity, Ie in watts/steradian, may be found from the equation Ie = Iv/h v, where Iv is the luminous intensity in candelas and h v is theluminous efficacy in lumens/watt.Figure 5. Relative intensity vs. DC forward current.Figure 4. Relative dominant wavelength vs. DC forward current.DC FORWARD CURRENT – mAR E L A T I V E D O M I N A N T W A V E L E N G T H (N O R M A L I Z E D A T 20 m A )1020301.0250.9901.0151.0201.0101.0051.0000.995GREENBLUER E L A T I V E I N T E N S I T Y (N O R M A L I Z E D A T 20 m A )FORWARD CURRENT – mAFigure 1. Relative intensity vs. wavelength.Figure 3. Forward current vs. forward voltage.Figure 2. Forward current vs. ambient temperature.WAVELENGTH – nmR E L A T I V E I N T E N S I T Y1.0000.800.600.400.20030103.0202.01.0F O R W A R D C U R R E N T – m AFORWARD VOLTAGE – V 4.0CYANGREENBLUEI F – F O R W A R D C U R R E N T – m AV F – FORWARD VOLTAGE – VOLTSFigure 6. Spatial radiation pattern for Cx11 and Cx12.R E L A T I V E L U M I N O U S I N T E N S I T Y10ANGULAR DISPLACEMENT – DEGREES0.5-90-600-30306090Figure 7. Spatial radiation pattern for Cx26 and Cx27.Figure 8. Spatial radiation pattern for Cx36 and Cx37.R E L A T I V E L U M I N O U S I N T E N S I T Y10ANGULAR DISPLACEMENT – DEGREES0.5-90-600-30306090R E L A T I V E L U M I N O U S I N T E N S I T Y10ANGULAR DISPLACEMENT – DEGREES0.5-90-600-30306090Intensity Bin Limit TableIntensity (mcd) at 20 mA Bin Min MaxN680880P8801150Q11501500R15001900S1*******T25003200U32004200V42005500W55007200X72009300Y930012000Z1200016000 11600021000 Tolerance for each bin limit is ±15%.Blue Color Bin TableBin Min Dom Max Dom Xmin Ymin Xmax Ymax 1460.0464.00.14400.02970.17660.09660.18180.09040.13740.0374 2464.0468.00.13740.03740.16990.10620.17660.09660.12910.0495 3468.0472.00.12910.04950.16160.12090.16990.10620.11870.0671 4472.0476.00.11870.06710.15170.14230.16160.12090.10630.0945 5476.0480.00.10630.09450.13970.17280.15170.14230.09130.1327 Tolerance for each bin limit is ±0.5 nm.Cyan Color Bin TableBin Min Dom Max Dom Xmin Ymin Xmax Ymax 1490.0495.00.04540.29450.11640.38890.13180.3060.02350.4127 2495.0500.00.03450.41270.10570.47690.11640.38890.00820.5384 3500.0505.00.00820.53840.10270.55840.10570.47690.00390.6548 4505.0510.00.00390.65480.10970.62510.10270.55840.01390.7502 7498.0503.00.01320.48820.10280.52730.10920.44170.00400.6104 8503.0508.00.00400.61040.10560.60070.10280.52730.00800.7153 Tolerance for each bin limit is ±0.5 nm.Green Color Bin TableBin Min Dom Max Dom Xmin Ymin Xmax Ymax 1520.0524.00.07430.83380.18560.65560.16500.65860.10600.8292 2524.0528.00.10600.82920.20680.64630.18560.65560.13870.8148 3528.0532.00.13870.81480.22730.63440.20680.64630.17020.7965 4532.0536.00.17020.79650.24690.62130.22730.63440.20030.7764 5536.0540.00.20030.77640.26590.60700.24690.62130.22960.7543 Tolerance for each bin limit is ±0.5 nm./semiconductors For product information and a complete list of distributors, please go to our web site.For technical assistance call:Americas/Canada: +1 (800) 235-0312 or (916) 788-6763Europe: +49 (0) 6441 92460China: 10800 650 0017Hong Kong: (+65) 6756 2394India, Australia, New Zealand: (+65) 6755 1939 Japan: (+81 3) 3335-8152(Domestic/Interna-tional), or 0120-61-1280(Domestic Only) Korea: (+65) 6755 1989Singapore, Malaysia, Vietnam, Thailand, Philippines, Indonesia: (+65) 6755 2044 Taiwan: (+65) 6755 1843Data subject to change.Copyright © 2004 Agilent Technologies, Inc. December 7, 20045989-1022EN。

海利普空压机变频器HLP-SK说明书

375 544 715 375
400 582 765 400
415 604 795 415
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HLP-SK 空压机专用变频器使用说明书
HLP-SK系列
2、产品通用规格
项目名称
HLP-SK
控制方式
SVPWM
输入电源
380V电源：-20% - 10% (-20% 建议降档使用)
五位数码显示及状态指示灯
HLP-AS系K系列列
4、故障及分析
72
十一、周边设施选用及配置
74
1、选件
74
2、配置
75
十二、附录
77
附录一简单应用举例
77
附录二外形及安装尺寸
81
附录三键盘外形及安装尺寸
83
附录四例HLP-SK变频器参数设置说明
84
附录五使用者记录及反馈
85
SVPWM
ห้องสมุดไป่ตู้电压空间矢量
转矩控制
可设定转矩提升，最大10.0% ，启动转矩在1.0Hz时可达150%
一般
多功能输入端
6个多功能输入端，实现8段速控制、程序运行、4段加减速切换、UP、DOWN机能、计数器、外部急停等功能
控制
多功能输出端
有5个多功能输出端，实现运转中、零速、计数器、外部异常、程序运行等指示及报警
● 在变频器输入前端接入接触器，控制变频器的起动或停止会影响变频器的寿命，一般要求通过 F OR或R E V端子来控制，在起、停较为频繁场所，应特别注意使用。
● 变频器电源，请使用独立电源，绝对避免与电焊机等强干扰设备共用同一电源，否则会引起变频器保护或变频器损坏。
2、送电中

HLMP-C615-M0000中文资料

DescriptionThese non-diffused lamps are designed to produce a bright light source and smooth radiationpattern. A slight tint is added to the lens for easy color identification.This lamp has been designed with aHLMP-C115, HLMP-C117, HLMP-C123, HLMP-C215, HLMP-C223,HLMP-C315, HLMP-C323, HLMP-C415, HLMP-C423, HLMP-C515,HLMP-C523, HLMP-C615, HLMP-C623Features•Very high intensity •Exceptional uniformity •Microtint lens for color identification•Consistent viewability All colors: AlGaAs RedHigh Efficiency Red Yellow Orange GreenEmerald Green •15° and 25° family•Tape and reel options available •Binned for color and intensity Applications•Ideal for backlighting front panels*•Used for lighting switches •Adapted for indoor and outdoor signsAgilentT-13/4 Super Ultra-Bright LED LampsData Sheet20mil lead frame, enhanced flange, and tight meniscus controls, making it compatible with radial lead automated insertion equipment.Selection GuidePart Number Luminous Intensity Iv (mcd) Color2θ1/2[1]Standoff Leads HLMP-Min.Max.DH AS AlGaAs15No C115290.0–C115-O00xx290.0–C115-OP0xx290.01000.0Yes C117-OP0xx290.01000.025No C12390.2–C123-L00xx90.2–Red15No C215138.0–C215-M00xx138.0–C215-MN0xx138.0400.025No C22390.2–C223-L00xx90.2–C223-MN0xx138.0400.0 Yellow15No C315147.0–C315-L00xx147.0–C315-LM0xx147.0424.025No C32396.2–C323-K00xx96.2–C323-KL0xx96.2294.0 Orange15No C415138.0–C415-M00xx138.0–C415-M0D0xx138.0–C415-MN0xx138.0400.025No C42390.2–C423-L00xx90.2–C423-LM0xx90.2276.0 Green15No C515170.0–C515-L00xx170.0C515-LM0xx170.0490.025No C52369.8–C523-J00xx69.8–C523-KL0xx111.7340.0 Emerald Green15No C61517.0–C615-G00xx17.0–25No C623 6.7–C623-E00xx 6.7–Part Numbering SystemHLMP - C x xx - x x x xxMechanical Options00: Bulk01: Tape & Reel, Crimped Leads02: Tape & Reel, Straight LeadsB2: Right Angle Housing, Even LeadsUQ: Ammo Pack, Horizontal LeadsColor Bin Options0: Full Color Bin DistributionD: Color Bins 4 & 5 onlyMaximum Iv Bin Options0: Open (No Maximum Limit)Others: Please refer to the Iv Bin TableMinimum Iv Bin OptionsPlease refer to the Iv Bin TableViewing Angle & Standoffs Options15: 15 Degree, without Standoffs17: 15 Degree, with Standoffs23: 25 Degree, without StandoffsColor Options1. AS AlGaAs Red2. High Efficiency Red3. Yellow4. Orange5. Green6. Emerald GreenPackage OptionsC: T-1 3/4 (5 mm)Absolute Maximum Ratings at T A = 25°CHighHighDH AS Efficiency Performance AlGaAs Red and Green and ParameterRed Orange Yellow Emerald Green Units DC Forward Current [1]30302030mA Transient Forward Current [2]500500500500mA (10 µsec Pulse)Reverse Voltage (Ir = 100 µA)5555V LED Junction Temperature 110110110110°C Operating Temperature Range –20 to +100–55 to +100–20 to +100°C Storage Temperature Range –55 to +100°CWave Soldering Temperature 250°C for 3 seconds [1.59 mm (0.063 in.) from body]Lead Solder Dipping Temperature 260°C for 5 seconds[1.59 mm (0.063 in.) from body]Notes:1. See Figure 5 for maximum current derating vs. ambient temperature.2. The transient current is the maximum nonrecurring peak current the device can withstand without damaging the LED die and wire bond.Package DimensionsHLMP-Cx15 and HLMP-Cx23HLMP-Cx17(0.039)NOTES:1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).2. LEADS ARE MILD STEEL, SOLDER DIPPED.3. AN EPOXY MENISCUS MAY EXTEND ABOUT 0.5 mm (0.020 in.) DOWN THE LEADS.± 0.20± 0.008)Electrical Characteristics at T A = 25°CForward Reverse Capacitance Speed of ResponseVoltage Breakdown C (pF)Thermalτs (ns)Vf (Volts)Vr (Volts)Vf = 0Resistance Time Constant@ If = 20 mA@ Ir = 100 µA f = 1 MHz RθJ-PIN e-t/τsPart Number Typ.Max.Min.Typ.(°C/W)Typ.HLMP-C115 1.8 2.253021030HLMP-C117HLMP-C123HLMP-C215 1.9 2.651121090HLMP-C223HLMP-C315 2.1 2.651521090HLMP-C323HLMP-C415 1.9 2.654210280HLMP-C423HLMP-C515 2.2 3.0518210260HLMP-C523HLMP-C615 2.2 3.0518210260HLMP-C623Optical Characteristics at T A = 25°CLuminous Color,ViewingIntensity Peak Dominant Angle LuminousIv (mcd)Wavelength Wavelength2θ1/2Efficacy@ 20 mA[1]λpeak (nm)λd[2] (nm)(Degrees)[3]ηvPart Number Min.Typ.Typ.Typ.Typ.(lm/w) HLMP-C1152906006456371180HLMP-C117HLMP-C1239020026HLMP-C215138300635626171459017023HLMP-C315146300583585175009617025HLMP-C415138300600602173809017023HLMP-C515170300568570205956917028HLMP-C61517455585602065662728Notes:1. The luminous intensity, Iv, is measured at the mechanical axis of the lamp package. The actual peak of the spatial radiation pattern may not bealigned with this axis.2. The dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the color of the device.3. 2θ1/2 is the off-axis angle where the luminous intensity is 1/2 the on-axis intensity.Figure 1. Relative intensity vs. wavelength.Figure 2. Forward current vs. forward voltage (non-resistor lamp).Figure 3. Relative luminous intensity vs. forward current.WAVELENGTH – nmR E L A T I V E I N T E N S I T Y1.00.50I F – F O R W A R DC U R R E N T – m AV F – FORWARD VOLTAGE – VI F – F O R W A R D C U R R E N T – m AV F – FORWARD VOLTAGE – VHIGH EFFICIENCY RED, ORANGE,YELLOW, AND HIGH PERFORMANCEGREEN, EMERALD GREENR E L A T I V E L U M I N O U S I N TE N S I T Y (N O R M A L I Z E D A T 20 m A )I F – DC FORWARD CURRENT – mA R E L A T I V E L U M I N O U S I N T E N S I T Y (N O R M A L I Z E D A T 20 m A )0I DC – DC CURRENT PER LED – mA10201.60.80.4515301.2250.20.61.01.4HER, ORANGE, YELLOW, AND HIGH PERFORMANCE GREEN, EMERALD GREENFigure 5. Maximum forward dc current vs. ambient temperature. Derating based on T j MAX = 110°C.Figure 4. Relative efficiency (luminous intensity per unit current) vs. peak current.Figure 6. Relative luminous intensity vs. angular displacement. 15 degree family.R E L A T I V E E F F I C I E N C Y (N O R M A L I Z E D A T 20 m A )0I PEAK – PEAK FORWARD CURRENT – mA0.60.8300201001.21.00.20.45020010DH As AlGaAs REDηP E A K – R E L A T I V E E F F I C I E N C Y (N O R M A L I Z E D A T 20 m A )I PEAK – PEAK FORWARD CURRENT – mAHER, ORANGE, YELLOW, HIGHPERFORMANCE GREEN, EMERALD GREENI F – F O R W A R D C U R R E NT – m AT A – AMBIENT TEMPERATURE – °C DH As AlGaAs REDI F – F O R W A R D C U R R E N T – m AT A – AMBIENT TEMPERATURE – °CHER, ORANGE, YELLOW, AND HIGH PERFORMANCE GREEN, EMERALD GREEN N O R M A L I Z E D L U M I N O U S I N T E N S I T Y10ANGULAR DISPLACEMENT – DEGREES0.80.60.50.70.2450.10.30.4403530252010515-5-10-15-20-25-30-35-40-450.9Figure 7. Relative luminous intensity vs. angular displacement. 25 degree family.Intensity Bin Limits Intensity Range (mcd)ColorBin Min.Max.L 101.5162.4M 162.4234.6N 234.6340.0O 340.0540.0P 540.0850.0Q 850.01200.0R 1200.01700.0Red/OrangeS 1700.02400.0T 2400.03400.0U 3400.04900.0V 4900.07100.0W 7100.010200.0X 10200.014800.0Y 14800.021400.0Z 21400.030900.0L 173.2250.0M 250.0360.0N 360.0510.0O 510.0800.0P 800.01250.0YellowQ 1250.01800.0R 1800.02900.0S 2900.04700.0T 4700.07200.0U 7200.011700.0V 11700.018000.0W18000.027000.0N O R M A L I Z E D L U M I N O U S I N T E N S I T Y10ANGULAR DISPLACEMENT – DEGREES0.80.60.50.70.2450.10.30.4403530252010515-5-10-15-20-25-30-35-40-450.9Intensity Bin Limits, continuedIntensity Range (mcd) Color Bin Min.Max.E7.612.0F12.019.1G19.130.7H30.749.1I49.178.5J78.5125.7K125.7201.1L201.1289.0 Green/M289.0417.0 Emerald Green N417.0680.0O680.01100.0P1100.01800.0Q1800.02700.0R2700.04300.0S4300.06800.0T6800.010800.0U10800.016000.0V16000.025000.0W25000.040000.0 Maximum tolerance for each bin limit is ± 18%.Color CategoriesLambda (nm)Color Category #Min.Max.6561.5564.55564.5567.5 Green4567.5570.53570.5573.52573.5576.51582.0584.53584.5587.0 Yellow2587.0589.54589.5592.05592.0593.01597.0599.52599.5602.03602.0604.5 Orange4604.5607.55607.5610.56610.5613.57613.5616.58616.5619.5 Tolerance for each bin limit is ± 0.5 nm.Mechanical Option MatrixMechanical Option Code Definition00Bulk Packaging, minimum increment 500 pcs/bag01Tape & Reel, crimped leads, minimum increment 1300 pcs/bag02Tape & Reel, straight leads, minimum increment 1300 pcs/bagB2Right Angle Housing, even leads, minimum increment 500 pcs/bagUQ Ammo Pack, horizontal leads, in 1K minimum incrementNote:All categories are established for classification of products. Products may not be available in all categories. Please contact your local Agilent representative for further clarification/information./semiconductorsFor product information and a complete list ofdistributors, please go to our web site.For technical assistance call:Americas/Canada: +1 (800) 235-0312 or(916) 788-6763Europe: +49 (0) 6441 92460China: 10800 650 0017Hong Kong: (+65) 6756 2394India, Australia, New Zealand: (+65) 6755 1939Japan: (+81 3) 3335-8152 (Domestic/Interna-tional), or 0120-61-1280 (Domestic Only)Korea: (+65) 6755 1989Singapore, Malaysia, Vietnam, Thailand,Philippines, Indonesia: (+65) 6755 2044Taiwan: (+65) 6755 1843Data subject to change.Copyright © 2004 Agilent Technologies, Inc.Obsoletes 5965-6165ENovember 11, 20045988-2149EN。

45系列轴向柱塞泵

45系列轴向柱塞泵45系列开式轴向柱塞泵产品样本45系列开式轴向柱塞泵产品样本版本信息修订历史修订记录表日期 2012年10月 2012年9月 2012年9月 2012年8月 2012年7月 2012年6月 2012年3月 2012年1月 2011年12月 2011年10月页码多页多页多页 14-15, 62 多页 17,23,44,72,92 110 多页 75 多页多页 56 108 多页 45, 50 45 多页 22, 27, 31, 41, 43, 47 34, 28 多页多页 62, 65 58-62 78, 93, 94, 95 32, 74, 75, 92 76 52, 53 27, 50, 72, 89 76 4 多页多页 50 多页 51, 52, 53 修改项目增加电控根据原中文版本及英文版本GO大幅修改多处修正增加补油泵回路，增加S5轴输入轴及辅助安装法兰O型圈尺寸变更删除各排量泵的轴承寿命表删除工作盖板尺寸图添加系统稳定性，20页，型号代码多处更改修改 A2 轴描述多处改变及修改技术规格校订，选型代码校订示意图修改花键啮合尺寸修改通篇多处修改060B最高速度3120,安装法兰修改添加065C, 075C轴承寿命参数多处校订及改变-主要修改多处小修改,添加EJ, EA控制器尺寸去掉L和K型中T2轴选项修改对LS的X口接头深度的警告添加对LS的X口接头深度的警告添加 SAE-C 2螺栓壳体 J型尺寸修改多处小修改，去掉E型S5轴选项示意图修改S2花键宽度修改（仅英制尺寸）示意图修改添加RP 和BP控制的LS设定值必须为20bar 对S2轴-6级，长37.91mm的修改 TOC的修改针对每一型号添加了LS设定范围重新布置F和E型章节，添加排量限制器信息修改负载敏感设定值-增量 bar 去掉G型，添加F型，多处修改修改示意图信息去掉H型，添加J型添加E型添加H型和G型第一次印刷版本 GP GO GN GM GL GK GJ GI GHGG GF GE GD GC GB GA FO FN FM FL FK FJ FI FH FG FG FF FF FE FD FC FB FA E D C B A A45系列开式轴向柱塞泵2011年6月 2011年5月 2011年4月 2011年3月 2011年1月 2010年11月 2010年10月 2009年10月 2009年7月 2009年5月 2009年3月 2008年10月 2008年9月 2008年6月 2008年5月 2008年4月 2008年4月 2008年4月 2008年4月 2008年3月2008年2月2007年11月2007年11月2007年9月2006年11月 2005年8月 2003年4月 2001年5月 1999年5月2012 萨澳-丹佛斯版权所有萨澳-丹佛斯对于其产品样本，手册和其它出版物中可能出现的错误不负任何责任。

罗克韦尔自动化45CRM-4LHTx-D4颜色套传感器用户手册说明书

用户手册
带 IO-Link 接口的颜色套准标记传感器
45CRM-4LHTx-D4
用户重要须知
在安装、配置、操作或维护设备之前，请仔细阅读本文档及 “ 其他资源” 部分列出的文档，了解设备的安装、配置和操作信息。除所有适用规范、法规和标准的要求外，用户还应熟悉安装和接线说明。
安装、调整、投入使用、操作、组装、拆卸和维护等活动都应由经过适当培训的人员遵照适用的实施规程执行。
注册 45CRM IODD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
检查 1734-4IOL IO-Link AOP. . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
灼伤危险：位于设备 (例如，驱动器或电机) 表面或内部的标签，提醒人们表面可能存在高温危险。弧闪危险：标签可能位于设备上或设备内（例如电机控制中心），提醒人们可能出现弧闪。弧闪将造成严重的人身伤害或死亡。请穿戴适当的个人防护设备 (PPE)。遵循所有安全工作惯例和个人防护设备 (PPE) 的规章要求。
目录
产品概述 . . . . . . . . . . . . . . . . . . . .. . . . . . . . 1
产品介绍 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 工作模式 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 特性. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 技术参数 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

HLMP-KB45-G0000中文资料

Selection GuideLuminous Intensity Iv (mcd) Part Number Package Viewing Angle Min.Max.HLMP-KB45-A00xx T-14030–HLMP-DB25-B00xx T-1 3/42540–Part Numbering SystemHLMP - x x xx - x x x xxMechanical Option00: Bulk02: Tape & Reel, Straight LeadsDD: Ammo PackColor Bin Options0: Full Color Bin DistributionMaximum Iv Bin Options0: Open (no max. limit)Minimum Iv Bin OptionsPlease refer to the Iv Bin TableViewing Angle25: 25 degrees45: 40 degreesColor OptionsB: Blue 462 nmPackage OptionsD: T-1 3/4 (5 mm)K: T-1 (3 mm)Absolute Maximum Ratings at T A = 25˚CParameter Blue UnitsPeak Forward Current70mADC Current[1]30mAReverse Voltage (I R = 100 µA)5VTransient Forward Current[2]350mA(10 µsec Pulse)LED Junction Temperature115˚COperating Temperature–20 to +80˚CStorage Temperature–30 to +100˚CLead Soldering Temperature 260°C for 5 seconds[1.6 mm (0.063 in.) from body]Notes:1.Derate linearly from 50 °C as shown in Figure 6.2.The transient peak current is the maximum non-recurring peak current that can beapplied to the device without damaging the LED die and wirebond. It is notrecommended that this device be operated at peak currents above the AbsoluteMaximum Peak Forward Current.Optical Characteristics at T A = 25˚CLuminous Color,Viewing Intensity Dominant Peak Angle I V (mcd)Wavelength Wavelength 2θ1/2[2]@ I F = 20 mAλd [1] (nm)λPEAK (nm)Degrees Part Number Typ.Typ.Typ.HLMP-DB25-B00xx 40 10046242625HLMP-KB45-A00xx 30 4546242640Min. Typ.Notes:1.The dominant wavelength, λd , is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the device.2. θ1/2 is the off-axis angle at which the luminous intensity is half of the axial luminous intensity.Electrical Characteristics at T A = 25˚CThermal Forward Reverse ResistanceVoltage Breakdown Speed Capacitance R θJ-PIN (°C/W)V F (Volts)V R (Volts)Response C (pF), V F = 0,Junction to Part@ I F = 20 mA @ I R = 100 µA τs (ns) f = 1 MHz Cathode Lead Number Typ. Max. Min. Typ.Typ.Typ.Typ.HLMP-DB25-B00xx 4.0 5.0 5.0 3050097260HLMP-KB45-A00xx4.05.05.0 3050097290Figure 1. Relative Intensity vs.Wavelength.Figure 3. Relative Intensity vs. Peak Forward Current (300 µs pulse width, 10 ms period).Figure 2. Forward Current vs.Forward Voltage.605030200351040214I F – F O R W A R D C U R R E N T – m AV F – FORWARD VOLTAGE – V 1.01.61.2R E L A T I V E L U M I N O U S I N T E N S I T Y (N O R M A L I Z E D A T 20 m A )I P – PEAK FORWARD CURRENT – mA204060801.4305070WAVELENGTH – nmR E L A T I V E I N T E N S I T Y1.00.5350550700400600450500650Soldering/CleaningCleaning agents from the ketone family (acetone, methyl ethyl ketone, etc.) and from thechlorinated hydrocarbon family (methylene chloride,trichloroethylene, carbon tetrachloride, etc.) are notrecommended for cleaning LED parts. All of these varioussolvents attack or dissolve the encapsulating epoxies used to form the package of plastic LED parts.For information on soldering LEDs, please refer to Application Note 1027.Figure 8. Relative Luminous Intensity vs. Angular Displacement for HLMP-KB45.Figure 7. Relative Luminous Intensity vs. Angular Displacement for HLMP-DB25.Figure 6. Maximum DC Forward Current vs. Ambient Temperature.Derating Based on T J Max. = 115 °C.Figure 5. Relative Luminous Intensity vs. Forward Current.Figure 4. Forward Current vs.Forward Voltage.R A T I O O F P E A K C U R R E N T T O T E M P E R A T U R E D E R A T E D D C C U R R E N TPULSE WIDTH (SECONDS)1.20.4R E L A T I V E L U M I N O U S I N T E N S I T Y (N O R M A L I Z E D A T 20 m A )I F – DC FORWARD CURRENT – mA01020350.851525300.30.20.10.50.60.70.91.01.1I F – F O R W A R D C U R R E N T – m A D C0T A – AMBIENT TEMPERATURE – °C3070352010105030805152520406090Intensity Bin LimitsIntensity Range (mcd)Bin Min.Max.A30.040.0B40.050.0C50.065.0D65.085.0E85.0110.0F110.0140.0G140.0180.0H180.0240.0J240.0310.0K310.0400.0L400.0520.0M520.0680.0N680.0880.0Color Bin Limits(nm at 20 mA)Blue nm @ 20 mABin ID Min.Max.1460.0464.02464.0468.03468.0472.04472.0476.05476.0480.0Tolerance for each bin limit will be ±0.5nm.Mechanical Option MatrixMechanical Option Code Definition00Bulk Packaging, minimum increment 500 pcs/bag02Tape & Reel, straight leads, minimum increment 1300 pcs/bagDD Ammo Pack, straight leads with minimum incrementNote:All categories are established for classification of products. Products may not be available in all categories. Please contact your local Agilent representative for further clarification/information./semiconductors For product information and a complete list of distributors, please go to our web site.For technical assistance call:Americas/Canada: +1 (800) 235-0312 or (408) 654-8675Europe: +49 (0) 6441 92460China: 10800 650 0017Hong Kong: (+65) 6756 2394India, Australia, New Zealand: (+65) 6755 1939 Japan: (+81 3) 3335-8152 (Domestic/Interna-tional), or 0120-61-1280 (Domestic Only) Korea: (+65) 6755 1989Singapore, Malaysia, Vietnam, Thailand, Philippines, Indonesia: (+65) 6755 2044 Taiwan: (+65) 6755 1843Data subject to change.Copyright © 2003 Agilent Technologies, Inc. Obsoletes 5988-2226ENMay 12, 20035988-9507EN。

uprekb-45控制与保护开关说明书

uprekb-45控制与保护开关说明书摘要：I.引言- 控制与保护开关的简介- 控制与保护开关在电力系统中的应用II.产品概述- 控制与保护开关的型号和规格- 控制与保护开关的主要功能和特点III.工作原理- 控制与保护开关的工作原理- 控制与保护开关的保护功能IV.安装与使用- 控制与保护开关的安装要求- 控制与保护开关的使用方法V.维护与保养- 控制与保护开关的维护方法- 控制与保护开关的保养建议VI.结论- 控制与保护开关在电力系统中的重要性- 控制与保护开关的未来发展趋势正文：引言控制与保护开关是电力系统中一种重要的保护装置，主要用于接通、承载和分断正常条件下的电流或电压，同时也能够接通、承载一定时间和分断规定的非正常条件下的电流或电压。

在电力系统中，控制与保护开关能够有效地保护电力设备，防止电力系统的故障，确保电力系统的稳定运行。

产品概述控制与保护开关型号为uprekb-45，具有多种规格，能够满足不同电力系统的需求。

该型号的控制与保护开关具有以下几个主要功能和特点：1.短路保护：控制与保护开关能够在短路条件下迅速切断电流，保护电力设备不受损坏。

2.过载保护：控制与保护开关能够在过载条件下自动切断电流，防止电力设备过热损坏。

3.负载控制：控制与保护开关能够根据电力系统的负载情况，自动调节电流大小，保证电力系统的稳定运行。

4.操作简单：控制与保护开关操作简单，使用方便，能够大大提高电力系统的运行效率。

工作原理控制与保护开关的工作原理是，当电力系统中的电流或电压超过设定值时，控制与保护开关会自动切断电流或电压，防止电力设备受到损坏。

控制与保护开关的保护功能能够有效地保护电力系统的安全运行。

安装与使用控制与保护开关的安装要求如下：1.控制与保护开关应安装在干燥、通风、无腐蚀气体和无爆炸危险的环境中。

2.控制与保护开关的安装位置应便于操作和维护。

3.控制与保护开关的接线应正确、牢固，并符合相关标准。

HLMP-K101-LJ000中文资料

AgilentT-13/4 (5 mm), T-1 (3 mm),High Intensity, Double Heterojunction AlGaAs Red LED LampsData SheetHLMP-D101/D105, HLMP-K101/K105DescriptionThese solid state LED lamps utilize newly developed doubleheterojunction (DH) AlGaAs/GaAs material technology. This LED material has outstanding lightoutput efficiency over a wide rangeFeatures• Exceptional brightness • Wide viewing angle• Outstanding material efficiency • Low forward voltage • CMOS/MOS compatible • TTL compatible • Deep red colorApplications• Bright ambient lighting conditions • Moving message panels • Portable equipment • General useof drive currents. The color is deep red at the dominantwavelength of 637 nanometres.These lamps may be DC or pulse driven to achieve desired light output.Package DimensionsA B CSelection GuideLuminous IntensityIv (mcd) at 20 mA2θ1/2[1]Package Package Description Device HLMP-Min.Typ.Max.Degree Outline T-1 3/4 Red Tinted Diffused D10135.270.0–65AD101-J00xx35.270.0–65AD101-JK0xx35.270.0112.865AT-1 3/4 Red Untinted Non-diffused D105138.0240.0–24BD105-M00xx138.0240.0–24BD105-NO0xx200.0290.0580.024BT-1 Red Tinted Diffused K10122.045.0–60CK101-100xx22.045.0–60CK101-IJ0xx22.045.070.460CT-1 Red Untinted Non-diffused K10535.265.0–45CK105-J00xx35.265.0–45CK105-KL0xx56.4110.0180.445CNote:1. θ1/2 is the off axis angle from lamp centerline where the luminous intensity is 1/2 the on-axis value.Part Numbering SystemHLMP - x x xx - x x x xxMechanical Option00: Bulk01: Tape & Reel, Crimped Leads02: Tape & Reel, Straight LeadsA1: Right Angle Housing, Uneven Leads, T1A2: Right Angle Housing, Even Leads, T1B1: Right Angle Housing, Uneven Leads, T-1 3/4B2: Right Angle Housing, Even Leads, T-1 3/4DD, UQ: Ammo PackColor Bin Options0: Full Color Bin DistributionMaximum Iv Bin Options0: Open (no max. limit)Others: Please refer to the Iv Bin TableMinimum Iv Bin OptionsPlease refer to the Iv Bin TableLens Type01: Tinted, Diffused05: Untinted, NondiffusedColor Options1: AlGaAs RedPackage OptionsD: T-1 3/4K: T-1Absolute Maximum Ratings at T A = 25°CParameter ValuePeak Forward Current[1,2]300 mAAverage Forward Current[2]20 mADC Current[3]30 mAPower Dissipation87 mWReverse Voltage (I R = 100 µA) 5 VTransient Forward Current (10 µs Pulse)[4]500 mALED Junction Temperature110°COperating Temperature Range-20 to +100°C Storage Temperature Range-55 to +100°C Wave Soldering Temperature [1.59 mm (0.063 in.) from body]250°C for 3 seconds Lead Solder Dipping Temperature [1.59 mm (0.063 in.) from body]260°C for 5 seconds Notes:1.Maximum I PEAK at f = 1 kHz, DF = 6.7%.2.Refer to Figure 6 to establish pulsed operating conditions.3.Derate linearly as shown in Figure 5.4.The transient peak current is the maximum non-recurring peak current the device can withstand without damaging the LED die and wire bonds. It isnot recommended that the device be operated at peak currents beyond the Absolute Maximum Peak Forward Current.Electrical/Optical Characteristics at T A = 25°CSymbol Description Min.Typ.Max.Unit Test ConditionV F Forward Voltage 1.8 2.2V I F = 20 mAV R Reverse Breakdown Voltage 5.015.0V I R = 100 µAλp Peak Wavelength645nm Measurement at Peakλd Dominant Wavelength637nm Note 1∆λ1/2Spectral Line Halfwidth20nmτS Speed of Response30ns Exponential TimeConstant, e-t/T SC Capacitance30pF V F = 0, f = 1 MHzRθJ-PIN Thermal Resistance260[3]°C/W Junction to Cathode Lead210[4]290[5]ηV Luminous Efficacy80Im/W Note 2Notes:1.The dominant wavelength, λd, is derived from the CIE chromaticity diagram and represents the color of the device.2.The radiant intensity, I e, in watts per steradian, may be found from the equation I e = l V/ηV, where I V is the luminous intensity in candelas and ηV isluminous efficacy in lumens/watt.3.HLMP-D101.4.HLMP-D105.5.HLMP-K101/-K105.Figure 3. Relative luminous intensity vs. dc forward current.Figure 4. Relative efficiency vs. peak forward current.Figure 7. Relative luminous intensity vs. angular displacement. HLMP-D101.Figure 8. Relative luminous intensity vs. angular displacement. HLMP-K101.Intensity Bin LimitsIntensity Range (mcd)Color Bin Min.Max.Red I24.839.6J39.663.4K63.4101.5L101.5162.4M162.4234.6N234.6340.0O340.0540.0P540.0850.0Q850.01200.0R1200.01700.0S1700.02400.0T2400.03400.0U3400.04900.0V4900.07100.0W7100.010200.0X10200.014800.0Y14800.021400.0Z21400.030900.0Maximum tolerance for each bin limit is ± 18%.Mechanical Option MatrixMechanical Option Code Definition00Bulk Packaging, minimum increment 500 pcs/bag01Tape & Reel, crimped leads, minimum increment 1300 pcs (T-1 3/4)/1800 pcs (T-1) 02Tape & Reel, straight leads, minimum increment 1300 pcs (T-1 3/4)/1800 pcs (T-1) A1Right Angle Housing, uneven leads, minimum increment 500 pcs/bagA2Right Angle Housing, even leads, minimum increment 500 pcs/bagB1Right Angle Housing, uneven leads, minimum increment 500 pcs/bagB2Right Angle Housing, even leads, minimum increment 500 pcs/bagDD Ammo Pack, straight leads in 2K incrementUQ Ammo Pack, horizontal leads in 2K incrementNote:All categories are established for classification of products. Products may not be available in all categories. Please contact your local Agilent representative for further clarification/information./semiconductors For product information and a complete list of distributors, please go to our web site.For technical assistance call:Americas/Canada: +1 (800) 235-0312 or (916) 788-6763Europe: +49 (0) 6441 92460China: 10800 650 0017Hong Kong: (+65) 6756 2394India, Australia, New Zealand: (+65) 6755 1939 Japan: (+81 3) 3335-8152 (Domestic/Interna-tional), or 0120-61-1280 (Domestic Only) Korea: (+65) 6755 1989Singapore, Malaysia, Vietnam, Thailand, Philippines, Indonesia: (+65) 6755 2044 Taiwan: (+65) 6755 1843Data subject to change.Copyright © 2004 Agilent Technologies, Inc. Obsoletes 5968-1440ENovember 12, 20045988-2230EN。

HLMP-EL30-QRK00中文资料

T-13/4 (5 mm) Precision Optical Performance AlInGaP LED LampsData SheetFeatures• Well Defined Spatial Radiation Patterns• Viewing Angles: 6°, 15°, 23°, 30°• High Luminous Output• Colors:590 nm Amber605 nm Orange615 nm Reddish-Orange626 nm Red• High Operating Temperature: T J LED=+130°C• Superior Resistance to Moisture• Package Options:With or Without Lead Stand-OffsBenefits• Viewing Angles Match Traffic Management Sign Requirements• Colors Meet Automotive and Pedestrian Signal Specifications• Superior Performance in Outdoor Environments• Suitable for Autoinsertion onto PC Boards Applications• Traffic Management:Traffic SignalsPedestrian SignalsWork Zone Warning LightsVariable Message Signs• Commercial OutdoorAdvertising:SignsMarquees• Automotive:Exterior and Interior LightsDescriptionThese Precision Optical Perform-ance AlInGaP LEDs providesuperior light output forexcellent readability in sunlightand are extremely reliable.AlInGaP LED technologyprovides extremely stable lightoutput over long periods of time.Precision Optical Performancelamps utilize the aluminumindium gallium phosphide(AlInGaP) technology.These LED lamps are untinted,nondiffused, T-13/4 packagesincorporating second generationoptics producing well definedspatial radiation patterns atspecific viewing cone angles.SunPower SeriesHLMP-ELxxHLMP-EJxxHLMP-EHxxHLMP-EGxxThese lamps are made with anadvanced optical grade epoxy,offering superior high tempera-ture and high moistureresistance performance inoutdoor signal and signapplications. The high maximumLED junction temperature limitof +130°C enables hightemperature operation in brightsunlight conditions. The packageepoxy contains both uv-a anduv-b inhibitors to reduce theeffects of long term exposure todirect sunlight.These lamps are available in twopackage options to give thedesigner flexibility with devicemounting.Device Selection GuideTypicalViewing Color and Luminous Angle Dominant Lamps Without Standoffs Lamps With Standoffs Intensity Iv (mcd) [1,2] 2θ1/2Wavelength on Leads on Leads@ 20 mA (Deg.)[4](nm), Typ.[3] (Outline Drawing A)(Outline Drawing B)Min.Max.HLMP-EL08-VY000HLMP-EL10-VY000420012000HLMP-EL08-VYK00*420012000HLMP-EL08-VXK00*42009300HLMP-EL08-VX400**42009300HLMP-EL08-VX00042009300HLMP-EL08-WZ000HLMP-EL10-WZ000550016000 Amber 590HLMP-EL08-XZ400**720016000HLMP-EL08-XZ000720016000HLMP-EL08-XZK00*720016000HLMP-EL08-XY000720012000HLMP-EL08-XYK00*720012000HLMP-EL08-X1K00*720021000HLMP-EL08-X1000HLMP-EL10-X1000720021000 6°[5]HLMP-EJ08-WZ000HLMP-EJ10-WZ000550016000 Orange 605HLMP-EJ08-X1000HLMP-EJ10-X1000720021000HLMP-EJ08-Y2000HLMP-EJ10-Y2000930027000HLMP-EH08-UX000HLMP-EH10-UX00032009300HLMP-EH08-VY000HLMP-EH10-VY000420012000 Red-Orange 615HLMP-EH08-WZ000HLMP-EH10-WZ000550016000HLMP-EH08-X1000HLMP-EH10-X1000720021000HLMP-EH08-Y2000HLMP-EH10-Y2000930021000HLMP-EG08-VW00042007200HLMP-EG08-VY000HLMP-EG10-VY000420012000HLMP-EG08-WZ000HLMP-EG10-WZ000550016000 Red 626HLMP-EG08-X1000HLMP-EG10-X1000720021000HLMP-EG08-YZ000930016000HLMP-EG08-Y1000930021000HLMP-EG08-Y2000HLMP-EG10-Y2000930027000 Notes:1. The luminous intensity is measured on the mechanical axis of the lamp package.2. The optical axis is closely aligned with the package mechanical axis.3. The dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the color of the lamp.4. θ1/2 is the off-axis angle where the luminous intensity is one half the on-axis intensity.5.The intensity of narrow viewing angle lamps is measured at the intensity peak.Part numbers in bold are recommended for new designs.*HLMP-xLxx-xxK00 are selected to amber color bins 2 and 4 only.**HLMP-xLxx-xx400 are selected to amber color bin 4 only.Device Selection Guide (Continued)TypicalViewing Color and Luminous Angle Dominant Lamps Without Standoffs Lamps With Standoffs Intensity Iv (mcd) [1,2] 2θ1/2Wavelength on Leads on Leads@ 20 mA (Deg.)[4](nm), Typ.[3] (Outline Drawing A)(Outline Drawing B)Min.Max.HLMP-EL15-PS000HLMP-EL17-PS0008802500HLMP-EL15-QR00011501900HLMP-EL15-QRK00*11501900HLMP-EL15-QS00011502500HLMP-EL15-QS400**11502500HLMP-EL15-QSK00*11502500HLMP-EL15-QT000HLMP-EL17-QT00011503200HLMP-EL15-QTK00*11503200HLMP-EL15-RU000HLMP-EL17-RU00015004200HLMP-EL17-SV00019005500 Amber 590HLMP-EL15-TW000HLMP-EL17-TW00025007200HLMP-EL15-TWK00*25007200HLMP-EL15-TUK00*25004200 15°HLMP-EL15-TV400**25005500HLMP-EL15-UX000HLMP-EL17-UX00032009300HLMP-EL15-VY000HLMP-EL17-VY000420012000HLMP-EL15-VYK00*420012000HLMP-EL15-VX00042009300HLMP-EL15-VXK00*42009300HLMP-EL15-VX400**42009300HLMP-EL15-VW000*42007200HLMP-EL15-VWK00*42007200HLMP-EJ15-PS0008802500 Orange 605HLMP-EJ15-RU000HLMP-EJ17-RU00015004200HLMP-EJ15-SV000HLMP-EJ17-SV00019005500HLMP-EH15-QT000HLMP-EH17-QT00011503200 Red-Orange 615HLMP-EH15-RU000HLMP-EH17-RU00015004200HLMP-EH15-TW000HLMP-EH17-TW00025007200HLMP-EH15-UX000HLMP-EH17-UX00032009300 Notes:1. The luminous intensity is measured on the mechanical axis of the lamp package.2. The optical axis is closely aligned with the package mechanical axis.3. The dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the color of the lamp.4. θ1/2 is the off-axis angle where the luminous intensity is one half the on-axis intensity.5.The intensity of narrow viewing angle lamps is measured at the intensity peak.Part numbers in bold are recommended for new designs.*HLMP-xLxx-xxK00 are selected to amber color bins 2 and 4 only.**HLMP-xLxx-xx400 are selected to amber color bin 4 only.Device Selection Guide (Continued)TypicalViewing Color and Luminous Angle Dominant Lamps Without Standoffs Lamps With Standoffs Intensity Iv (mcd) [1,2] 2θ1/2Wavelength on Leads on Leads @ 20 mA (Deg.)[4](nm), Typ.[3](Outline Drawing A)(Outline Drawing B) Min.Max.HLMP-EG15-PS0008802500HLMP-EG15-QT000HLMP-EG17-QT00011503200 15°Red 626HLMP-EG15-RU000HLMP-EG17-RU00015004200HLMP-EG15-UX000HLMP-EG17-UX00032009300HLMP-EG15-TW000HLMP-EG17-TW00025007200HLMP-EL24-MQ0005201500HLMP-EL24-NR000HLMP-EL26-NR0006801900HLMP-EL24-PS000HLMP-EL26-PS0008802500HLMP-EL24-PSK00*8802500HLMP-EL24-PR400**8801900HLMP-EL24-PQK00*8801500HLMP-EL24-QR00011501900HLMP-EL24-QRK00*11501900HLMP-EL24-QS00011502500HLMP-EL24-QSK00*11502500HLMP-EL24-QS400**11502500 23°Amber 590HLMP-EL24-QT000HLMP-EL26-QT00011503200HLMP-EL24-QTK00*11503200HLMP-EL24-RU000HLMP-EL26-RU00015004200HLMP-EL24-RUK00*15004200HLMP-EL26-SV00019005500HLMP-EL24-STK00*19003200HLMP-EL24-SUK00*19004200HLMP-EL24-SU400**19004200HLMP-EL24-SV00019005500HLMP-EL24-SVK00*19005500HLMP-EL24-TW000HLMP-EL26-TW00025007200HLMP-EL24-TWK00*25007200 Notes:1. The luminous intensity is measured on the mechanical axis of the lamp package.2. The optical axis is closely aligned with the package mechanical axis.3. The dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the color of the lamp.4. θ1/2 is the off-axis angle where the luminous intensity is one half the on-axis intensity.5.The intensity of narrow viewing angle lamps is measured at the intensity peak.Part numbers in bold are recommended for new designs.*HLMP-xLxx-xxK00 are selected to amber color bins 2 and 4 only.**HLMP-xLxx-xx400 are selected to amber color bin 4 only.Device Selection Guide (Continued)TypicalViewing Color and Luminous Angle Dominant Lamps Without Standoffs Lamps With Standoffs Intensity Iv (mcd) [1,2] 2θ1/2Wavelength on Leads on Leads@ 20 mA (Deg.)[4](nm), Typ.[3] (Outline Drawing A)(Outline Drawing B)Min.Max.Orange 605HLMP-EJ24-QT000HLMP-EJ26-QT00011503200HLMP-EJ24-RU000HLMP-EJ26-RU00015004200HLMP-EH26-PS0008802500 Red-Orange 615HLMP-EH24-QT000HLMP-EH26-QT00011503200 23ºHLMP-EH24-RU000HLMP-EH26-RU00015004200HLMP-EH24-SV000HLMP-EH26-SV00019005500HLMP-EG24-PS000HLMP-EG26-PS0008802500 Red 626HLMP-EG24-QT000HLMP-EG26-QT00011503200HLMP-EG24-RU000HLMP-EG26-RU00015004200HLMP-EL30-MQ000HLMP-EL32-MQ0005201500HLMP-EL30-NR000HLMP-EL32-NR0006801900HLMP-EL30-PQ0008801500HLMP-EL30-PQK00*8801500HLMP-EL30-PR0008801900HLMP-EL30-PR400**8801900HLMP-EL30-PRK00*8801900HLMP-EL30-PS000HLMP-EL32-PS0008802500 30°Amber 590HLMP-EL30-PSK00*8802500HLMP-EL30-QRK00*11501900HLMP-EL30-QS00011502500HLMP-EL30-QS400**11502500HLMP-EL30-QT000HLMP-EL32-QT00011503200HLMP-EL30-QTK00*11503200HLMP-EL30-ST00019003200HLMP-EL30-SU00019004200HLMP-EL30-SU400**19004200HLMP-EL30-SUK00*19004200 Notes:1. The luminous intensity is measured on the mechanical axis of the lamp package.2. The optical axis is closely aligned with the package mechanical axis.3. The dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the color of the lamp.4. θ1/2 is the off-axis angle where the luminous intensity is one half the on-axis intensity.5.The intensity of narrow viewing angle lamps is measured at the intensity peak.Part numbers in bold are recommended for new designs.*HLMP-xLxx-xxK00 are selected to amber color bins 2 and 4 only.**HLMP-xLxx-xx400 are selected to amber color bin 4 only.Device Selection Guide (Continued)TypicalViewing Color and Luminous Angle Dominant Lamps Without Standoffs Lamps With Standoffs Intensity Iv (mcd) [1,2] 2θ1/2Wavelength on Leads on Leads@ 20 mA (Deg.)[4](nm), Typ.[3] (Outline Drawing A)(Outline Drawing B)Min.Max.HLMP-EL30-STK00*19003200 Amber HLMP-EL30-SV00019005500HLMP-EL30-SVK00*19005500HLMP-EL32-SV00019005500HLMP-EJ30-MQ0005201500 Orange 605HLMP-EJ30-NR000HLMP-EJ32-NR0006801900HLMP-EJ30-PS000HLMP-EJ32-PS0008802500HLMP-EH30-MQ000HLMP-EH32-MQ0005201500 30°HLMP-EH30-NR000HLMP-EH32-NR0006801900 Red-Orange 615HLMP-EH30-PS000HLMP-EH32-PS0008802500HLMP-EH30-QT000HLMP-EH32-QT00011503200HLMP-EH30-RU000HLMP-EH32-RU00015004200HLMP-EG30-KN000310880HLMP-EG30-MQ000HLMP-EG32-MQ0005201500HLMP-EG30-NQ0006801500HLMP-EG30-NR000HLMP-EG32-NR0006801900 Red 626HLMP-EG30-PQ0008801500HLMP-EG30-PR0008801900HLMP-EG30-PS000HLMP-EG32-PS0008802500HLMP-EG30-QT000HLMP-EG32-QT00011503200 Notes:1. The luminous intensity is measured on the mechanical axis of the lamp package.2. The optical axis is closely aligned with the package mechanical axis.3. The dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the color of the lamp.4. θ1/2 is the off-axis angle where the luminous intensity is one half the on-axis intensity.5.The intensity of narrow viewing angle lamps is measured at the intensity peak.Part numbers in bold are recommended for new designs.*HLMP-xLxx-xxK00 are selected to amber color bins 2 and 4 only.**HLMP-xLxx-xx400 are selected to amber color bin 4 only.Part Numbering SystemHLMP-x x xx-x x x xxMechanical Options00: Bulk PackagingDD: Ammo PackYY: Flexi-Bin; Bulk PackagingZZ: Flexi-Bin; Ammo PackColor Bin Selections0: No color bin limitation4: Amber color bin 4 onlyK: Amber color bins 2 and 4 onlyMaximum Intensity Bin0: No Iv bin limitationMinimum Intensity BinViewing Angle & Lead Stand Offs08: 6 deg without lead stand offs10: 6 deg with lead stand offs15: 15 deg without lead stand offs17: 15 deg with lead stand offs24: 23 deg without lead stand offs26: 23 deg with lead stand offs30: 30 deg without lead stand offs32: 30 deg with lead stand offsColorG: 626 nm RedH: 615 nm Red-OrangeJ: 605 nm OrangeL: 590 nm AmberPackageE: 5 mm RoundNOTES:1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).2. LEADS ARE MILD STEEL, SOLDER DIPPED.3. TAPERS SHOWN AT TOP OF LEADS (BOTTOM OF LAMP PACKAGE) INDICATE AN EPOXY MENISCUS THAT MAY EXTEND ABOUT 1 mm (0.040 in.) DOWN THE LEADS.4. RECOMMENDED PC BOARD HOLE DIAMETERS:•LAMP PACKAGE A WITHOUT STAND-OFFS: FLUSH MOUNTING AT BASE OFLAMP PACKAGE = 1.143/1.067 (0.044/0.042).•LAMP PACKAGE B WITH STAND-OFFS: MOUNTING AT LEAD STAND-OFFS= 0.965/0.889 (0.038/0.035).5. FOR DOME HEIGHTS ABOVE LEAD STAND-OFF SEATING PLANE, d, LAMP PACKAGE B, SEE TABLE.BPackage DimensionsA(0.039)(0.039)PART NO.d HLMP-XX1012.37 ± 0.25(0.487 ± 0.010)HLMP-XX1712.42 ± 0.25(0.489 ± 0.010)HLMP-XX2612.52 ± 0.25(0.493 ± 0.010)HLMP-XX3211.96 ± 0.25(0.471 ± 0.010)Electrical/Optical Characteristics at T A = 25°CParameter Symbol Min.Typ.Max.Units Test Conditions Forward VoltageI F = 20 mAAmber (λd = 590 nm) 2.02Orange (λd = 605 nm)V F1.982.4VRed-Orange (λd = 615 nm) 1.94Red (λd = 626 nm) 1.90Reverse Voltage V R520VI F = 100 µAPeak Wavelength:Peak of Wavelength of Amber (λd = 590 nm)592Spectral Distribution Orange (λd = 605 nm)λPEAK609nmat I F = 20 mARed-Orange (λd = 615 nm)621Red (λd = 626 nm)635Spectral Halfwidth∆λ1/217nmWavelength Width at Spectral Distribution 1/2 Power Point at I F = 20 mASpeed of Response τs 20ns Exponential Time Constant, e -t /τs CapacitanceC 40pF V F = 0, f = 1 MHzThermal Resistance R θJ-PIN240°C/WLED Junction-to-Cathode LeadLuminous Efficacy [1]Emitted LuminousAmber (λd = 590 nm)480Power/Emitted Radiant Orange (λd = 605 nm)ηv370lm/WPowerRed-Orange (λd = 615 nm)260Red (λd = 626 nm)150Note:1. The radiant intensity, I e , in watts per steradian, may be found from the equation I e = I v /ηv , where I v is the luminous intensity in candelas and ηv is the luminous efficacy in lumens/watt.Absolute Maximum Ratings at T A = 25°CDC Forward Current [1,2,3]..................................................................50 mA Peak Pulsed Forward Current [2,3].................................................100 mA Average Forward Current [3].............................................................30 mA Reverse Voltage (I R = 100 µA)................................................................5 V LED Junction Temperature ..............................................................130°C Operating Temperature ...................................................-40°C to +100°C Storage Temperature .......................................................-40°C to +120°C Wave Solder Temperature........................................250°C for 3 seconds [1.59 mm (0.060 in.) below body]Notes:1. Derate linearly as shown in Figure 4.2. For long term performance with minimal light output degradation, drive currentsbetween 10 mA and 30 mA are recommended. For more information on recommended drive conditions, please refer to Application Brief I-024 (5966-3087E).3. Operating at currents below 1 mA is not recommended. Please contact your local representative for further information.Figure 2. Forward Current vs. Forward Voltage.Figure 3. Relative Luminous Intensity vs.Forward Current.Figure 4. Maximum Forward Current vs. Ambient Temperature. Derating Based on T JMAX = 130°C.Figure 1. Relative Intensity vs. Peak Wavelength.Figure 5. Representative Spatial Radiation Pattern for 6° Viewing Angle Lamps.WAVELENGTH – nmR E L A T I V E I N T E N S I T YC U R R E N T – m AV F – FORWARD VOLTAGE – VR E L A T I V E L U M I N O U S I N T E N S I T Y (N O R M A L I Z E D A T 20 m A )00I F – DC FORWARD CURRENT – mA 403.02.01.51.00.520602.5I F – F O R W A R D C U R R E N T – m AT A – AMBIENT TEMPERATURE – °CR E L A T I V E I N T E N S I T Y – %1000θ – ANGULAR DISPLACEMENT – DEGREES8060507020-20-15103040-1051015202590-25-511Bin Name Min.Max.K 310400L 400520M 520680N680880P 8801150Q 11501500R 15001900S 19002500T 25003200U 32004200V42005500W 55007200X 72009300Y 930012000Z 12000160001160002100022100027000Intensity Bin Limits (mcd at 20 mA)Tolerance for each bin limit is ± 15%.Bin Name Min.Max.1584.5587.02587.0589.54589.5592.06592.0594.5Amber Color Bin Limits (nm at 20 mA)Tolerance for each bin limit is ± 0.5 nm.Note:1.Bin categories are established for classification of products. Products may not be available in all bin Figure 7. Representative Spatial Radiation Pattern for 23° Viewing Angle Lamps.Figure 8. Representative Spatial Radiation Pattern for 30° Viewing Angle Lamps.Figure 6. Representative Spatial Radiation Pattern for 15° Viewing Angle Lamps.R E L A T I V E I N T E N S I T Y – %1000θ – ANGULAR DISPLACEMENT – DEGREES806050702010304090-20-15-10510152025-25-5R E L A T I V E I N T E N S I T Y – %1000θ – ANGULAR DISPLACEMENT – DEGREES806050702010304090-20-15-10510152025-25-5R E L A T I V E I N T E N S I T Y – %1.000θ – ANGULAR DISPLACEMENT – DEGREES0.800.600.500.700.200.100.300.400.90-20-15-10510152025-25-5/semiconductors For product information and a complete list of distributors, please go to our web site.For technical assistance call:Americas/Canada: +1 (800) 235-0312 or (916) 788-6763Europe: +49 (0) 6441 92460China: 10800 650 0017Hong Kong: (+65) 6756 2394India, Australia, New Zealand: (+65) 6755 1939 Japan: (+81 3) 3335-8152 (Domestic/Interna-tional), or 0120-61-1280 (Domestic Only) Korea: (+65) 6755 1989Singapore, Malaysia, Vietnam, Thailand, Philippines, Indonesia: (+65) 6755 2044 Taiwan: (+65) 6755 1843Data subject to change.Copyright © 2004 Agilent Technologies, Inc. Obsoletes 5988-4275ENAugust 13, 2004。

HLMP-EL16-VXK00中文资料

SunPower Series HLMP-ELxx HLMP-EHxx HLMP-EDxxPrecision Optical Performance AlInGaP II LED Lamps Technical DataFeatures• Well Defined Spatial Radiation Patterns • Viewing Angles: 15°,23°, 30°• High Luminous Output • Colors:592 nm Amber617 nm Reddish-Orange 630 nm Red• High Operating Temperature:T JLED =+130°C• Superior Resistance to MoistureBenefits• Viewing Angles Match Traffic Management Requirements• Colors Meet Automotive and Traffic Signal Specifications • Superior Light Output Performance in Outdoor Environments• Suitable for Autoinsertion into PC BoardsApplications• Traffic Management:Traffic SignalsWork Zone Warning Lights Variable Message Signs • Commercial Outdoor Advertising:Signs Marquees • Automotive:Exterior and Interior LightsDescriptionPrecision Optical Performance AlInGaP II (aluminum indium gallium phosphide) LEDs offer superior light output for excellent readability in sunlight and dependable performance. The AlInGaP II technology provides extremely stable light output over long periods of time.These LED lamps are untinted,nondiffused, T-13/4 packages incorporating second generation optics which produce well defined radiation patterns at specific viewing cone angles.These lamps are made with an advanced optical grade epoxy offering superior high tempera-ture and high moisture resistance performance in outdoor signal and sign applications. Themaximum LED junction tempera-ture limit of +130°C enables high temperature operation in bright sunlight conditions. The epoxy contains both uv-a and uv-binhibitors to reduce the effects of long term exposure to directsunlight.Part Numbering Scheme HLMP-E(1)(2)(3)-(4)(5)(6)(7)(8)where (1) = Color“L”=592 nm Amber“H”=615 nm Reddish-orange“D”=630 nm Redwhere (2)(3) = Viewing Angle and Lead Standoffs“16”=15 degree without leadstandoffs“18”=15 degree with leadstandoffs“25”=23 degree without leadstandoffs“27”=23 degree with leadstandoffs“31”=30 degree without leadstandoffs“33”=30 degree with leadstandoffswhere (4) = MinimumIntensity Bin (refer totable on page 7)where (5) = MaximumIntensity Bin (refer totable on page 7)where (6) = Color BinSelection“0”=no color bin limitation“K”=amber color bins 2and 4 only (refer totable on page 7)“4”=amber color bin 4 only(refer to table onpage 7)where (7)(8) = Mechanicalor Packaging Option“00”=bulk packaging,minimum increment500/bag“DD”=ammo pack, minimumincrement 2000/box.Available for productsshown in BOLD inselection guide.Refer to the device selectionguides for availablecombinations.T-13/4 (5 mm) Precision Optical Performance AlInGaP II LED LampsSelection GuideTypicalViewing Color and Luminous Angle Dominant Intensity Iv (mcd) [3,4] 2θ1/2Wavelength Lamps Without Standoffs Lamps With Standoffs@ I(f) = 20 mA (Deg.)[2](nm), Typ.[1](Outline Drawing A)Outline Drawing B)Min.Max.HLMP-EL16-VW00036008300HLMP-EL16-VWK00*36008300HLMP-EL16-VX000360010700 Amber 592HLMP-EL16-VX400**360010700HLMP-EL16-VXK00*360010700 15°HLMP-EL16-VY000HLMP-EL18-VY000360013800HLMP-EL16-VYK00*360013800HLMP-EL16-WZ000HLMP-EL18-WZ000470018400 Red-Orange 615HLMP-EH16-TW000HLMP-EH18-TW00021708300HLMP-EH16-UX000HLMP-EH18-UX000275010700 Red 630HLMP-ED16-TW000HLMP-ED18-TW00021708300HLMP-ED16-UX000HLMP-ED18-UX000275010700Notes:1. Dominant Wavelength, λd, is derived from the CIEChromaticity Diagram and represents the color of the lamp.2. θ1/2 is the off-axis angle where the luminous intensity is onehalf the on-axis intensity.3. The luminous intensity is measured on the mechanical axis ofthe lamp package.4. The optical axis is closely aligned with the packagemechanical axis.Part numbers in bold are recommended for new designs.*HLMP-xLxx-xxK00 are selected to amber color bins 2 and 4 only. **HLMP-xLxx-xx400 are selected to amber color bin 4 only.T-13/4 (5 mm) Precision Optical Performance AlInGaP II Led Lamps (Continued) Selection GuideTypicalViewing Color and Luminous Angle Dominant Intensity Iv (mcd) [3,4] 2θ1/2Wavelength Lamps Without Standoffs Lamps With Standoffs@ I(f) = 20 mA (Deg.)[2](nm), Typ.[1](Outline Drawing A)Outline Drawing B)Min.Max.HLMP-EL25-ST00016503700HLMP-EL25-STK00*16503700HLMP-EL25-SU00016504800HLMP-EL25-SU400**16504800 Amber 592HLMP-EL25-SUK00*16504800HLMP-EL25-SVK00*16506300 23°HLMP-EL25-SV000HLMP-EL27-SV00016506300HLMP-EL25-TW000HLMP-EL27-TW00021708300HLMP-EL25-TWK00*21708300 Red-Orange 615HLMP-EH25-SV000HLMP-EH27-SV00016506300HLMP-EH25-TW000HLMP-EH27-TW00021708300 Red 630HLMP-ED25-SV000HLMP-ED27-SV00016506300HLMP-ED25-TW000HLMP-ED27-TW00021708300HLMP-EL31-SV000HLMP-EL33-SV00016506300HLMP-EL31-ST00016503700HLMP-EL31-STK00*16503700 Amber 592HLMP-EL31-SUK00*16504800HLMP-EL31-SU400**16504800HLMP-EL31-SU00016504800 30°HLMP-EL31-SVK00*16506300 Red-Orange 615HLMP-EH31-RU000HLMP-EH33-RU00013004800HLMP-EH31-SV000HLMP-EH33-SV00016506300HLMP-ED31-ST00016503700 Red 630HLMP-ED31-SU00016504800HLMP-ED31-RU000HLMP-ED33-RU00013004800HLMP-ED31-SV000HLMP-ED33-SV00016506300 Notes:1. Dominant Wavelength, λd, is derived from the CIEChromaticity Diagram and represents the color of the lamp.2. θ1/2 is the off-axis angle where the luminous intensity is onehalf the on-axis intensity.3. The luminous intensity is measured on the mechanical axis ofthe lamp package.4. The optical axis is closely aligned with the packagemechanical axis.Part numbers in bold are recommended for new designs.*HLMP-xLxx-xxK00 are selected to amber color bins 2 and 4 only. **HLMP-xLxx-xx400 are selected to amber color bin 4 only.Absolute Maximum Ratings at T A = 25°CDC Forward Current [1,2,3]............................................................50 mA Peak Pulsed Forward Current [2,3]..............................................100 mA Average Forward Current ............................................................30 mA Reverse Voltage (I R = 100 µA).........................................................5 V LED Junction Temperature..........................................................130°C Operating Temperature ..............................................-40°C to +100°C Storage Temperature ..................................................-40°C to +120°C Dip/Drag Solder Temperature................................260°C for 6 seconds Through-the-Wave Preheat Temperature.....................................145°C Through-the-Wave Solder Temperature.................245°C for 3 seconds[1.59 mm (0.060 in.) below seating plane]Notes:1. Derate linearly as shown in Figure 4.2. For long term performance with minimal light output degradation, drive currentsbetween 10 mA and 30 mA are recommended. For more information on recommended drive conditions, please refer to Application Brief I-024 (5966-3087E).3. Please contact your sales representative about operating currents below 10 mA.AB(0.039)CATHODEFLATPackage Dimensions (0.039)CATHODEFLATBElectrical/Optical Characteristics at T A = 25°CParameter SymbolMin.Typ.Max.UnitsTest Conditions Forward VoltageI F = 20 mAAmber (λd = 592 nm)2.15Red-Orange (λd = 617 nm)V F 2.08 2.4V Red (λd = 630 nm) 2.00Reverse Voltage V R 520VI R = 100 µAPeak Wavelength Peak of Wavelength of Amber594Spectral Distribution Red-Orange λPEAK 623nm at I F = 20 mARed639Spectral Halfwidth∆λ1/217nmWavelength Width at Spectral Distribution 1/2 Power Point at I F = 20 mASpeed of Response τs 20ns Exponential Time Constant, e -t/τCapacitanceC 40pF V F= 0, f = 1 MHzThermal Resistance R ΘJ-PIN240°C/WLED Junction-to-Cathode LeadLuminous Efficacy [1]Emitted LuminousAmber500Power/Emitted Radiant Red-Orange ηv235lm/WPower at I f = 20 mARed155Note:1. The radiant intensity, I e , in watts per steradian, may be found from the equation I e = I v /ηv , where I v is the luminous intensity in candelas and ηv is the luminous efficacy in lumens/watt.sFigure 1. Relative Intensity vs. Peak Wavelength.WAVELENGTH – nmR E L A T I V E I N T E N S I T YFigure 2. Forward Current vs.Forward Voltage.C U R R E N T – m AV F – FORWARD VOLTAGE – VFigure 6. Representative Spatial Radiation Pattern for 24° Viewing Angle Lamps.N O R M A L I Z E D I N T E N S I T Y1.000ANGULAR DISPLACEMENT – DEGREES0.800.600.500.700.20-20-150.100.300.40-105101520250.90-25-5Figure 3. Relative Luminous Intensity vs. Forward Current.Figure 4. Maximum Forward Current vs. Ambient Temperature. Derating Based on T JMAX = 130°C.I F – F O R W A R D C U R R E N T –m AT A – AMBIENT TEMPERATURE – °CR E L A T I V E L U M I N O U S I N T E N S I T Y (N O R M A L I Z E D A T 20 m A )00I F – DC FORWARD CURRENT – mA402.01.51.00.520502.51030Figure 5. Representative Spatial Radiation Pattern for 15° Viewing Angle Lamps.N O R M A L I Z E D I N T E N S I T Y1.000ANGULAR DISPLACEMENT – DEGREES0.800.600.500.700.20-20-150.100.300.40-105101520250.90-25-5Bin Name Min.Max.1584.5587.02587.0589.54589.5592.06592.0594.5Bin Name Min.Max.P 8801150Q 11501500R 15001900S 19002500T 25003200U 32004200V 42005500W 55007200X 72009300Y 930012000Z1200016000Intensity Bin Limits (mcd at 20 mA)Tolerance for each bin limit is ± 15%.HLMP-xLxx Color Bin Limits (nm at 20 mA)Tolerance for each bin limit is ± 0.5 nm.Note:1.Bin categories are established for classification of products. Products may not be available in all bin categories.N O R M A L I Z E D I N T E N S I T YANGULAR DISPLACEMENT – DEGREESFigure 7. Representative Spatial Radiation Pattern for 30° Viewing Angle Lamps. Data subject to change.Copyright © 1999 Agilent Technologies Obsoletes 5968-7180E5968-4303E (11/99)。

Agilent Sun Power Series HLMP-CB15、HLMP-CM15、HLMP-

HLMP-CB30-K0000..Agilent Sun Power SeriesHLMP-CB15, HLMP-CM15, HLMP-CB30,HLMP-CM30 T-13/4 (5 mm) Precision Optical Performance InGaN Blue and Green LampsData SheetFeatures•Well defined spatial radiation pattern •Viewing angles: 15˚ and 30˚•High luminous output •Colors: 472 nm Blue,526 nm Green•Superior resistance to moisture •UV resistant epoxy Benefits•Superior performance in outdoor environments •Wavelengths suitable for color mixing in full color (RGB) signs Applications•Commercial outdoor signs •Automotive interior lights •Front panel indicators •Front panel backlightingDescriptionThese high intensity blue and green LEDs are based on InGaN material technology. InGaN is the mostefficient and cost effective material for LEDs in the blue and greenregion of the spectrum. The 472 nm typical dominant wavelength for blue and 526 nm typical dominant wavelength for green are well suited to color mixing in full color signs.These LED lamps are untinted,nondiffused, T-13/4 packages incorporating second generation optics producing well definedspatial radiation patterns at specific viewing cone angles.CAUTION: HLMP-CBxx and HLMP-CMxx LEDs are Class 1 ESD sensitive. Please observe appropriate precautions during handling and processing. Refer to Agilent Application Note AN-1142 for additional details.These lamps are made with an advanced optical grade epoxy,offering superior hightemperature and high moisture resistance performance in outdoor signal and signapplications. The high maximum LED junction temperature limit of +130˚C enables hightemperature operation in bright sunlight conditions. The package epoxy contains both UV-A and UV-B inhibitors to reduce the effects of long term exposure to direct sunlight.These lamps are available in twoviewing angle options to give the designer flexibility with optical design.LED IndicatorsDevice Selection GuideTypical Color and Dominant Luminous Intensity,Leads with Package Part Number Viewing Angle Wavelength λd (nm) Typ.Iv (mcd) Min.Stand-Offs Drawing HLMP-CB15-P00xx15˚Blue 472880No A HLMP-CB15-R00xx15˚Blue 4721500No A HLMP-CB16-P00xx15°Blue 472880Yes B HLMP-CB30-K00xx30˚Blue 472310No A HLMP-CB30-M00xx30˚Blue 472520No A HLMP-CB31-M00xx30°Blue 472520Yes B HLMP-CM15-S00xx15˚Green 5261900No A HLMP-CM15-W00xx15˚Green 5265500No A HLMP-CM16-S00xx15°Green 5261900Yes B HLMP-CM30-M00xx30˚Green 526520No A HLMP-CM30-S00xx30˚Green 5261900No A HLMP-CM31-M00xx30°Green 526520Yes BPart Numbering SystemHLMP - X X XX - X X X XXMechanical Options00: BulkDD: Ammo PackColor Bin Selection0: Full color rangeMaximum Intensity Bin0: No maximum Iv bin limitMinimum Intensity BinRefer to device selection guideViewing Angle and Standoff Options15: 15 degree without standoff16: 15 degree with standoff30: 30 degree without standoff31: 30 degree with standoffColorB: BlueM: GreenPackageC: T-1 3/4 (5 mm) round lamp23Notes:1. Dimensions in mm.2. Tolerance ±0.1 mm unless otherwise noted.5.80 ± 0.20 (0.039)HLMP-Cx15 and HLMP-Cx30Package Dimensions5.80 ± 0.20 (0.039)HLMP-Cx16 and HLMP-Cx31HLMP-Cx16HLMP-Cx31d = 12.60 ± 0.25 (0.496 ± 0.010) d = 12.22 ± 0.50 (0.481 ± 0.020)Absolute Maximum Ratings at T A = 25˚CParameter Blue and GreenDC Forward Current[1]30 mAPeak Pulsed Forward Current100 mAAverage Forward Current30 mAReverse Voltage (I R = 100 µA) 5 VPower Dissipation120 mWLED Junction Temperature130˚COperating Temperature Range–40˚C to +80˚CStorage Temperature Range–40˚C to +100˚CSoldering Temperature260˚C for 5 secondsElectrical/Optical Characteristics at T A = 25˚CParameter Symbol Min.Typ.Max.Units Test Conditions Forward VoltageHLMP-CB1x-P0000V F 3.8 4.0V IF = 20 mAHLMP-CB15-R0000 3.5 4.0HLMP-CB3x-K0000 3.8 4.0HLMP-CB3x-M0000 3.8 4.0HLMP-CM1x-S0000 3.8 4.0HLMP-CM15-W0000 3.5 4.0HLMP-CM3x-M0000 3.8 4.0HLMP-CM30-S0000 3.5 4.0Reverse Voltage V R5I R = 100 µAPeak Wavelength Peak of Wavelength of Blue (λd = 472 nm)λpeak470nm Spectral Distribution Green (λd = 526 nm)524at I F = 20 mA Spectral Halfwidth Wavelength Width Blue (λd = 472 nm)∆λ1/235nm at Spectral Power Green (λd = 526 nm)47Point at I F = 20 mA Capacitance C43pF V F = 0, F = 1 MHz Luminous Efficacy Emitted Luminous Blue (λd = 472 nm)ηv75lm/W Power/Emitted Radiant Green (λd = 526 nm)520PowerThermal Resistance RΘJ-PIN240˚C/W LED Junction-to-Cathode Lead45Figure 1. Relative intensity vs. wavelength.Figure 2. Forward current vs. forward voltage (for HLMP-CB15-R0000, HLMP-CM15-W0000and HLMP-CM30-S0000).Figure 4. Relative luminous intensity vs.forward current.WAVELENGTH – nmR E L A T I V E I N T E N S I T Y1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.100302515102.0 3.2520 2.82.4 3.6F O R W A R D C U R R E N TFORWARD VOLTAGE2.62.23.0 3.4 3.81.50.5I N T E N S I T Y N O R M A L I Z E D A T 20 m AI F – FORWARD CURRENT – mA 0515301.0102520Figure 5. Maximum forward current vs.ambient temperature.Figure 6. Spatial radiation pattern – 15˚ lamps.Figure 7. Spatial radiation pattern – 30˚ lamps.I F – F O R W A R D C U R R E N T – m AT A – AMBIENT TEMPERATURE – °C 40804035251510206010052030N O R M A L I Z E D I N T E N S I T Y1.00ANGULAR DISPLACEMENT – DEGREES0.80.60.2-300.41020-20-100300.90.70.50.30.1N O R M A L I Z E D I N T E N S I T Y1.0ANGULAR DISPLACEMENT – DEGREES 0.80.60.2-400.41020-20-10400.90.70.50.30.1-3030D O M I N A N T W A VE L E N G T H – n mFORWARD CURRENT – mA 540525535545Figure 8. Color vs. forward current.Figure 9. Normalized Iv vs. T (green).0.881.020.90N O R M A L I Z E D I N T E N S I T YDEGREES C20601001.0040800.980.960.940.5Figure 3. Forward current vs. forward voltage (for HLMP-CB1x-P0000, HLMP-CB30-K0000,HLMP-CB3x-M0000, HLMP-CM1x-S0000 and HLMP-CM3x-M0000).2.03.4V F – FORWARD VOLTAGE – V102530 I F – F O R W A R D C U R R E N T – m A4.2515202.43.0 3.82.2 2.83.24.02.63.6Intensity Bin Limits Bin NameMin.Max.K 310400L 400520M 520680N 680880P 8801150Q 11501500R 15001900S 19002500T 25003200U 32004200V 42005500W55007200Tolerance of each minimum and maximum is± 15%.Color Bin Limits (nm at 20 mA)Blue Color Range (nm)Bin ID Min.Max.1460.0464.02464.0468.03468.0472.04472.0476.05476.0480.0Tolerance for each bin limit is ± 0.5 nm.Green Color Range (nm)Bin ID Min.Max.1520.0524.02524.0528.03528.0532.04532.0536.05536.0540.0Tolerance for each bin limit is ± 0.5 nm.Note:1.All bin categories are established for classification of products. Products may not be available in all bin categories.Please contact your Agilent represen-tatives for further information.6/semiconductors For product information and a complete list of distributors, please go to our web site.For technical assistance call:Americas/Canada: +1 (800) 235-0312 or (408) 654-8675Europe: +49 (0) 6441 92460China: 10800 650 0017Hong Kong: (+65) 6271 2451India, Australia, New Zealand: (+65) 6271 2394 Japan: (+81 3) 3335-8152(Domestic/Interna-tional), or 0120-61-1280(Domestic Only) Korea: (+65) 6271 2194Malaysia, Singapore: (+65) 6271 2054 Taiwan: (+65) 6271 2654Data subject to change.Copyright © 2003 Agilent Technologies, Inc. Obsoletes 5988-7309ENJanuary 16, 20035988-8658ENHLMP-CB30-K0000..。

HPWT-DD00中文资料

Device Selection GuideTotal Flux Total Included AnglePart Number LED Colorθv (mlm) @ 70 mA [1] Typ.θ0.90 V (Degrees)[2] Typ.HPWA-MH00-00000AS AlInGaP Red-Orange 150095HPWA-DH00-0000075HPWA-ML00-00000AS AlInGaP Amber75095HPWA-DL00-0000075HPWT-RD00-0000044 x 88HPWT-MD00-00000TS AlInGaP Red3000100HPWT-DD00-0000070HPWT-BD00-0000050HPWT-RH00-0000044 x 88HPWT-MH00-00000TS AlInGaP Red-Orange3750100HPWT-DH00-0000070HPWT-BH00-0000050HPWT-RL00-0000044 x 88HPWT-ML00-00000TS AlInGaP Amber1500100HPWT-DL00-0000070HPWT-BL00-0000050Super Flux LEDs Technical DataHPWA-MH00HPWA-DH00HPWA-ML00HPWA-DL00HPWT-RD00HPWT-MD00HPWT-DD00HPWT-BD00HP SunPower SeriesHPWT-RH00HPWT-MH00HPWT-DH00HPWT-BH00HPWT-RL00HPWT-ML00HPWT-DL00HPWT-BL00Benefits• Fewer LEDs Required• Lowers Lighting System CostFeatures• High Flux Output• Designed for High Current Operation• Low Thermal Resistance • Low Profile• Meets SAE/ECE/JIS Automotive Color Requirements• Packaged in Tubes for Use with Automatic Insertion EquipmentApplications• Automotive Exterior Lighting • Electronic Signs and SignalsDescriptionThis revolutionary package design allows the lighting designer to reduce the number of LEDs required and provide a more uniform and unique illuminated appearance than with other LED solutions. This is possible through the efficient optical package design and high-current capabilities.Absolute Maximum Ratings at T= 25°CNotes:1.Derate linearly as shown in Figures 4a and 4b.2.Operation at currents below 10 mA is not recommended, please contact your Hewlett-Packard sales representative.3.Detailed wave soldering instructions are available in Application Note 1149-2.Outline Drawing0.76 ± 0.10 (0.030 ± 0.004)1.55 ± 0.20 (0.061 ± 0.008)3.20 ± 0.200.69 ± 0.20 3.00 ± 0.20∅ RX00MX/DX00 ∅BX00 RX00 2.35 (0.093) NOTES: 1. DIMENSIONS ARE IN MILLIMETERS (INCHES). 2. DIMENSIONS WITHOUT TOLERANCES ARE NOMINAL.3. CATHODE LEADS ARE INDICATED WITH A "C" AND ANODE LEADS ARE INDICATED WITH AN "A".4. DENOTES SPECIAL CHARACTERISTIC.This product family employs the world’s brightest red-orange and amber LED materials, which allow designers to match the color of popular lightingapplications, such as automotivetail, stop, and turn signal lamps,and electronic signs.Optical Characteristics at T= 25°C, I = 70 mA, R = 200˚C/W1. Φv is the total luminous flux output as measured with an integrating sphere after the device has stabilized.2. The dominant wavelength is derived from the CIE Chromaticity Diagram and represents the perceived color of the device.3. θ0.90 V is the included angle at which 90% of the total luminous flux is captured.Electrical Characteristics at T A = 25°CForward Reverse CapacitanceVoltage Breakdown C (pF)Thermal Speed ofV F (Volts)V R (Volts)V F = 0,Resistance Response@ I F = 70 mA@ I R = 100 µA f = 1 MHz RθJ-PIN (°C/W)τs (ns)[1] Device Type Min.Typ.Max.Min.Typ.Typ.Typ.Typ. HPWA-XH00 1.83 2.1 2.6710204015520 HPWA-XL00 1.83 2.2 2.6710204015520 HPWT-XD00 2.15 2.5 3.0340125201020HPWT-XH00 2.15 2.5 3.0310204012520 HPWT-XL00 2.15 2.6 3.1510204012520 Note:1. τs is the time constant, e-t/τs.Figure 4b. HPWT-XX00 Maximum DC Forward Current vs. Ambient Temperature.Figure 3. HPWA/HPWT-XX00 Relative Luminous Flux vs. Forward Current.Figure 4a. HPWA-XX00 Maximum DC Forward Current vs. Ambient Temperature.Figure 5a. HPWT-RX00 Relative Luminous Intensity vs. Off Axis Angle.R E L A T I V E L U M I N O U S F L U XFORWARD CURRENT (mA)Figure 2. Forward Current vs.Forward Voltage.R E L A T I V E L U M I N O U S I N T E N S I T Y1.00OFF AXIS ANGLE (DEGREES)0.80.60.50.70.20.10.30.40.9M A X I M U M D C C U R R E N T (m A )AMBIENT TEMPERATURE (°C)M A X I M U M D C C U RR E N T (m A )AMBIENT TEMPERATURE (°C)Figure 1. Relative Intensity vs. Wavelength.WAVELENGTH (nm)R E L A T I V E I N T E N S I T Y5506006507001.00.5HPWA-XL00HPWT-XH00HPWT-XL00HPWA-XH00 AMBERRED-ORANGE HPWT-XD00REDF O R W A R D C UR R E N T (m A )FORWARD VOLTAGE (V)Figure 5d. HPWT-MX00 Relative Luminous Intensity vs.Off Axis Angle.Figure 5c. HPWA-MX00 Relative Luminous Intensity vs.Off Axis Angle.Figure 5b. HPWT-RX00 Relative Luminous Intensity vs. Off Axis Angle.Iso-Intensity Contour Plot.R E L A T I V E L U M I N O U S I N T E N S I T Y1.00OFF AXIS ANGLE (DEGREES)0.80.60.50.70.2-1000.10.30.4-80-60-40-20204060801000.9R E L A T I V E L U M I N O U S I N T E N S I T Y1.00OFF AXIS ANGLE (DEGREES)0.80.60.50.70.2-1000.10.30.4-80-60-40-20204060801000.9Figure 5e. HPWA-DX00 Relative Luminous Intensity vs. Off Axis Angle.R E L A T I V E L U M I N O U S I N T E N S I T Y-1000OFF AXIS ANGLE (DEGREES)1000.40.30.2-801.0-60600.1400.50.60.70.80.9-40-202080V E R T I C A L O F F A X I S A N G L E (D E G R E E S )-3030HORIZONTAL OFF AXIS ANGLE (DEGREES)-1002010-20Figure 5f. HPWT-DX00 Relative Luminous Intensity vs. Off Axis Angle.R E L A T I V E L U M I N O U S I N T E N S I T Y-1000OFF AXIS ANGLE (DEGREES)1000.40.30.2-801.0-60600.1400.50.60.70.80.9-40-202080For additional information about Super Flux LEDs, please refer to HP Application Note 1149. Copies of the application brief can be obtained from your local field sales engineer. You may also visit the HP web site at“./go/automotive”./go/ledFor technical assistance or the location of your nearest Hewlett-Packard sales office, distributor or representative call: Americas/Canada: 1-800-235-0312 or 408-654-8675Far East/Australasia: Call your local HP sales office.Japan: (81 3) 3335-8152Europe: Call your local HP sales office. Data subject to change.Copyright © 1998 Hewlett-Packard Co. Obsoletes 5968-1098E (8/98)5968-3379E (12/98)。

HLMP-6xxx Series中文资料

Dome PackagesThe HLMP-6xxx Series dome lamps for use as indicators use a tinted, diffused lens to provide a wide viewing angle with a high on-off contrast ratio. Highbrightness lamps use an untinted,nondiffused lens to provide a high luminous intensity within a narrow radiation pattern.Resistor LampsThe HLMP-6xxx Series 5 volt subminiature lamps with built in current limiting resistors are for use in applications where space is at a premium.Lead ConfigurationsAll of these devices are made by encapsulating LED chips on axial lead frames to form molded epoxy subminiature lamp packages. A variety of package configuration options is available. TheseFeatures• Subminiature Flat Top PackageIdeal for Backlighting and Light Piping Applications • Subminiature Dome PackageDiffused Dome for Wide Viewing AngleNondiffused Dome for High Brightness• TTL and LSTTL Compatible 5 Volt Resistor Lamps • Available in Six Colors • Ideal for Space Limited Applications • Axial Leads• Available with LeadConfigurations for Surface Mount and Through Hole PC Board MountingDescriptionFlat Top PackageThe HLMP-Pxxx Series flat top lamps use an untinted, non-diffused, truncated lens to provide a wide radiation pattern that is necessary for use in backlighting applications. The flat top lamps are also ideal for use as emitters in light pipe applications.Subminiature LED Lamps Technical DataHLMP-Pxxx Series HLMP-Qxxx Series HLMP-6xxx SeriesHLMP-70xx Seriesinclude special surface mount lead configurations, gull wing,yoke lead or Z-bend. Right angle lead bends at 2.54 mm (0.100inch) and 5.08mm (0.200 inch)center spacing are available for through hole mounting. For more information refer to Standard SMT and Through Hole Lead Bend Options for Subminiature LED Lamps data sheet.DH AS High High Device Standard AlGaAs EfficiencyPerf.Emerald Outline RedRed Red Orange Yellow Green Green Device Description [1]DrawingP105P205P405P305P505P605Untinted, Nondiffused,A Flat TopP102P202P402P302P502Untinted, Diffused,BFlat Top 6000/6001Q1016300Q40064006500Q600Tinted, Diffused Q105630564056505Untinted, Nondiffused,High Brightness Q150700070197040Tinted, Diffused, Low BCurrentQ155Nondiffused, Low Current660067006800Tinted, Diffused,Resistor, 5 V, 10 mA 662067206820Diffused, Resistor, 5 V,4 mADevice Selection GuidePart Number: HLMP-xxxxPackage D imensions(A) Flat Top Lamps2.21 1.96(0.087) (0.077)0.18 0.23(0.007) (0.009)2.08 (0.082) NOTES:1. ALL DIMENSIONS ARE IN MILLIMETRES (INCHES).2. PROTRUDING SUPPORT TAB IS CONNECTED TO CATHODE LEAD.* REFER TO FIGURE 1 FOR DESIGN CONCERNS.Package Dimensions (cont.)(B) Diffused and NondiffusedFigure 1. Proper Right Angle Mounting to a PC Board to Prevent Protruding Cathode Tab from Shorting to Anode Connection.NOTES:1. ALL DIMENSIONS ARE IN MILLIMETRES (INCHES).2. PROTRUDING SUPPORT TAB IS CONNECTED TO CATHODE LEAD.0.76 0.89(0.030) (0.035)R.0.79 (0.031) 0.53 (0.021)2.08 2.34(0.082) (0.092)2.21 1.96(0.087) (0.077)* REFER TO FIGURE 1 FOR DESIGN CONCERNS.NO. ANODE DOWN.YES. CATHODE DOWN.DH AS High High Standard AlGaAs Eff.Perf.EmeraldParameterRedRed Red Orange Yellow Green Green Units DC Forward Current [1]50303030203030m A Peak Forward Current [2]10003009090609090m A DC Forward Voltage 6666V (Resistor Lamps Only)Reverse Voltage (I R = 100 µA)5555555V Transient Forward Current [3]2000500500500500500500m A(10 µs Pulse)Operating T emperature Range:-55 to -40 to -55 to +100-40 to -20 to Non-Resistor Lamps +100+100+100+100°CResistor Lamps-40 to +85-20 to +85Storage Temperature Range °CFor Thru Hole Devices260°C for 5 SecondsWave Soldering Temperature [1.6 mm (0.063 in.) from body]For Surface Mount Devices:Convective IR 235°C for 90 Seconds Vapor Phase215°C for 3 MinutesAbsolute Maximum Ratings at T A = 25°C-55 to +100Notes:1. See Figure 5 for current derating vs. ambient temperature. Derating is not applicable to resistor lamps.2. Refer to Figure 6 showing Max. Tolerable Peak Current vs. Pulse Duration to establish pulsed operating conditions.3. The transient peak current is the maximum non-recurring peak current the device can withstand without failure. Do not operate these lamps at this high current.Electrical/Optical Characteristics, TA= 25°CStandard R edDeviceHLMP- Parameter Symbol Min.Typ.Max.Units Test Conditions6000Luminous Intensity[1]Iv 0.5 1.2mcd IF= 10 mA6001 1.3 3.2Forward Voltage VF 1.4 1.6 2.0V IF= 10 mAAll Reverse Breakdown VR 5.012.0V IR= 100 µAVoltageP005Included Angle Between125Half Intensity Points[2]2θ1/2Deg.All90OthersPeak WavelengthλPEAK655nmDominant Wavelength[3]λd640nmSpectral Line Half Width∆λ1/224nmAll Speed of Responseτs15nsCapacitance C100pF VF= 0; f = 1 MHzThermal Resistance RθJ-PIN 170°C/W Junction-to-CathodeLeadLuminous Efficacy[4]ηv65lm/WDeviceHLMP- Parameter Symbol Min.Typ.Max.Units Test Conditions P102 4.020.0P1058.630.0Q10122.045.0Q105Luminous Intensity Iv40200mcdQ150 1.0 1.8Q155 2.0 4.0Q101 1.8 2.2IF = 20 mAP205/P505Forward Voltage VF 1.8 2.2VQ101/Q105Q150/Q155 1.6 1.8IF= 1 mAAll Reverse Breakdown VR 5.015.0V IR= 100 µAVoltageP105125Q101/Q150Included Angle Between2θ1/290Deg.Half Intensity Points[2]Q105/Q15528Peak WavelengthλPEAK645nm Measured at PeakDominant Wavelength[3]λd637nmSpectral Line Half Width∆λ1/220nmAll Speed of Responseτs 30ns Exponential TimeConstant; e-t/τCapacitance C30pF VF= 0; f = 1 MHzThermal Resistance RθJ-PIN 170°C/W Junction-toCathode LeadLuminous Efficacy[4]ηv 80lm/WDH AS AlGaAs RedI F = 1 mAIF= 20 mAsDeviceHLMP-Parameter Symbol Min.Typ.Max.Units Test Conditions P202 1.0 5.0P205 1.08.06300 1.010.0IF= 10 mA 630510.040.07000Luminous Intensity[1]Iv 0.4 1.0mcd IF= 2 mA6600 1.3 5.0VF= 5.0 Volts 66200.8 2.06653 to 1.0 3.0IF = 10 mA6658All Forward Voltage VF 1.5 1.8 3.0V IF= 10 mA(Nonresistor Lamps)66009.613.0I F mA VF= 5.0 V6620 3.5 5.0All Reverse Breakdown VR 5.030.0V IR= 100 µAVoltageP2051256305Included Angle Between2θ1/228Deg.Half Intensity Points[2]All90DiffusedPeak WavelengthλPEAK635nm Measured at PeakDominant Wavelength[3]λd626nmSpectral Line Half Width∆λ1/240nmAll Speed of Responseτs90nsCapacitance C11pF VF= 0; f = 1 MHzThermal Resistance RθJ-PIN 170°C/W Junction-to-CathodeLeadLuminous Efficacy[4]ηv 145lm/WHigh Efficiency RedForward Current(Resistor Lamps)DeviceHLMP-Parameter Symbol Min.Typ.Max.Units Test Conditions P402 1.0 4.0P405Luminous Intensity Iv 1.06mcd IF= 10 mAQ400 1.08Forward Voltage VF 1.5 1.9 3.0V IF= 10 mAAll Reverse Breakdown VR 5.030.0V IR= 100 µAVoltageP405Included Angle Between125Half Intensity Points[2]2θ1/2Deg.Q40090Peak WavelengthλPEAK600nmDominant Wavelength[3]λd602nm Measured at PeakSpectral Line Half Width∆λ1/240nmAll Speed of Responseτs260nsCapacitance C4pF VF= 0; f = 1 MHzThermal Resistance RθJ-PIN 170°C/W Junction-to-CathodeLeadLuminous Efficacy[4]ηv 380lm/WOrangeYellowDeviceHLMP-Parameter Symbol Min.Typ.Max.Units Test Conditions P302 1.0 3.0P305 1.0 4.0IF = 10 mA6400 1.09.06405Luminous Intensity[1]Iv3.620mcd70190.40.6IF= 2 mA6700 1.4 5.0VF= 5.0 Volts 67200.9 2.06753 to 1.0 3.0IF = 10 mA6758All Forward Voltage VF 2.0 2.4V IF= 10 mA(Nonresistor Lamps)67009.613.0Forward Current IF m A VF= 5.0 V6720(Resistor Lamps) 3.5 5.0All Reverse Breakdown VR 5.050.0VVoltageP3051256405Included Angle Between2θ1/228Deg.Half Intensity Points[2]All90DiffusedPeak WavelengthλPEAK583nm Measured at PeakDominant Wavelength[3]λd585nmSpectral Line Half Width∆λ1/236nmAll Speed of Responseτs90nsCapacitance C15pF VF= 0; f = 1 MHzThermal Resistance RθJ-PIN 170°C/W Junction-to-CathodeLeadLuminous Efficacy[4]ηv500lm/WHigh Performance GreenDeviceHLMP-Parameter Symbol Min.Typ.Max.Units Test Conditions P502 1.0 3.0P505 1.6 6.36500 1.07.0IF= 10 mA 650510.040.07040Luminous Intensity[1]Iv 0.40.6mcd IF= 2 mA6800 1.6 5.0VF= 5.0 Volts 68200.8 2.06853 to 1.0 3.0IF = 10 mA6858All Forward Voltage VF 2.1 2.7V IF= 10 mA(Nonresistor Lamps)68009.613.0Forward Current IF m A VF= 5.0 V6820(Resistor Lamps) 3.5 5.0All Reverse Breakdown VR 5.050.0V IR= 100 µAVoltageP5051256505Included Angle Between2θ1/228Deg.Half Intensity Points[2]All90DiffusedPeak WavelengthλPEAK565nmDominant Wavelength[3]λd569nmSpectral Line Half Width∆λ1/228nmAll Speed of Responseτs500nsCapacitance C18pF VF= 0; f = 1 MHzThermal Resistance RθJ-PIN 170°C/W Junction-to-CathodeLeadLuminous Efficacy[4]ηv595lm/WNotes:1. The luminous intensity for arrays is tested to assure a2.1 to 1.0 matching between elements. The average luminous intensity for anarray determines its light output category bin. Arrays are binned for luminous intensity to allow I v matching between arrays.2. θ1/2 is the off-axis angle where the luminous intensity is half the on-axis value.3. Dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the single wavelength that defines the color ofthe device.4. Radiant intensity, Ie , in watts/steradian, may be calculated from the equation Ie=Iv/ηv, where Ivis the luminous intensity incandelas and ηvis the luminous efficacy in lumens/watt.DeviceHLMP-Parameter Symbol Min.Typ.Max.Units Test ConditionsP605Luminous Intensity Iv 1.0 1.5mcd IF= 10 mAQ600 1.0 1.5Forward Voltage VF 2.2 3.0V IF= 10 mAReverse Breakdown VR 5.0V IR= 100 µAVoltageP605Included Angle Between125Half Intensity Points[2]2θ1/2Deg.Q60090Peak WavelengthλPEAK558nmDominant Wavelength[3]λd560nm Measured at PeakSpectral Line Half Width∆λ1/224nmP605/Q600Speed of Responseτs3100nsCapacitance C35pF VF= 0; f = 1 MHzThermal Resistance RθJ-PIN 170°C/W Junction-to-CathodeLeadLuminous Efficacy[4]ηv 656lm/WEmerald Green[1]Note:1. Please refer to Application Note 1061 for information comparing standard green and emerald green light ouptut degradation.Standard Red, DH As AlGaAs Red Standard Red and DH ASAlGaAs RedHigh Efficiency Red, Orange,Yellow, and High Performance GreenHER, Orange, Yellow, and High Performance Green,and Emerald GreenLow CurrentFigure 1. Relative Intensity vs. Wavelength.Figure 2. Forward Current vs. Forward Voltage. (Non-Resistor Lamp)Figure 3. Relative Luminous Intensity vs. Forward Current. (Non-Resistor Lamp)Figure 4. Relative Efficiency (Luminous Intensity per Unit Current) vs. Peak Current (Non-Resistor Lamps).Figure 5. Maximum Forward dc Current vs. Ambient Temperature. Derating Based on T J MAX = 110°C (Non-Resistor Lamps).Figure 6. Maximum Tolerable Peak Current vs. Pulse Duration. (I DC MAX as per MAX Ratings) (Non-Resistor Lamps).Standard RedDH As AlGaAs RedStandard Red HER, Orange, Yellow, and HighPerformance GreenDH As AlGaAs RedHER, Orange, Yellow, and High Performance Green,and Emerald GreenFigure 9. Relative Intensity vs. Angular Displacement.Figure 7. Resistor Lamp Forward Current vs. Forward Voltage.Figure 8. Resistor Lamp Luminous Intensity vs.Forward Voltage. Data subject to change.Copyright © 1999 Agilent Technologies Obsoletes 5968-2537E (2/96)5968-7825E (11/99)。

Agilent HLMP-40xx、HLMP-08xx T-1 3 4、2 mm x 5 mm 双色

Agilent HLMP-40xx, HLMP-08xx T-1 3/4, 2 mm x 5 mm Rectangular Bicolor LED LampsData SheetDescriptionThe T-1 3/4 HLMP-40xx and 2 mm by 5 mm rectangular HLMP-08xx are three leaded bicolor light sources designed for a variety of applications where dual state illumination is required in the same package. There are two LED chips, mounted on a central common cathode lead for maximum on-axis viewability. Colors between the two chips can be generated by independently pulse width modulating the LED chips.Features•Two color operation•Three leads with one common cathode•Option of straight or spread leads configuration•Diffused, wide visibility rangeSelection GuideMin. Luminous Intensity Iv (mcd)Package Part Number Color Green Red Yellow I F (mA) T-1 3/4HLMP-4000Green/HER 4.2 2.110 HLMP-4000#xxx 4.2 2.110HLMP-4015Green/Yellow20.02020 Rectangular HLMP-0800Green/HER 2.6 2.120 HLMP-0805Green/Yellow 2.6 1.420Part Numbering System HLMP - X X X X # X X XMechanical Options002:Tape & Reel, Straight Leads010:Right Angle Housing, Even LeadsColor Options 00:High Efficiency Red (HER)/High Efficiency Green 05/15:Yellow/High Efficiency Green Package Options 40:T-1 3/4 (5 mm)08:RectangularPackage DimensionsHLMP-40xx Straight Leads HLMP-08xx Straight LeadsNotes:1. All dimensions are in millimeters (inches).2. Epoxy meniscus may extend about 1 mm (0.040") down the leads.Absolute Maximum Ratings at T A = 25°CParameter HER/Green Yellow/Green UnitsPeak Forward Current9060mAAverage Forward Current[1,2] (Total)2520mADC Current[2] (Total)3020mAPower Dissipation[3] (Total)135135mWOperating Temperature Range–20 to +100–20 to +100°CStorage Temperature Range–55 to +100–55 to +100°CReverse Voltage (I R = 100 µA)55VTransient Forward Current[4]500500mA(10 µsec Pulse)Notes:1.See Figure 5 to establish pulsed operating conditions.2.The combined simultaneous current must not exceed the maximum.3.The combined simultaneous current must not exceed the maximum.4.The transient peak current is the maximum non-recurring current that can be applied to the device without damaging the LED die and wirebond. It isnot recommended that the device be operated at peak currents beyond the peak forward current listed in the Absolute Maximum Ratings.Electrical/Optical Characteristics at T A = 25˚CHigh Efficiency Red Green YellowSymbol Parameter Min.Typ.Max.Min.Typ.Max.Min.Typ.Max.Units Test Condition l PEAK Peak635568583nm20 mA Wavelengthl d Dominant626570585nm20 mA Wavelength[1]t s Speed of9026090nsResponseC Capacitance111815pF V F = 0, f = 1 MHz V F Forward 1.9 2.6 2.2 3.0 2.1 2.6V20 mA VoltageV R Reverse555V I R = 100 µA VoltageR q J-PIN Thermal210210210°C/W Junction-to-Resistance Cathode Lead2q1/2Included Anglebetween halfluminousintensity points[2]HLMP-40xx656565degreeHLMP-08xx100100100h V Luminous145595500lm/WEfficacy[3]Notes:1.The dominant wavelength, l d, is derived from the CIE Chromaticity Diagram and represents the single wavelength which defines the color of the device.2.q1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity.3.Radiant intensity, le, in watts steradian, may be found from the equation le = Iv/h V, where Iv is the luminous intensity in candelas and h V is the luminousefficacy in lumens/watt.Figure 1. Relative intensity vs. wavelength.Figure 2. Forward current vs. forward voltage characteristics.Figure 3. Relative luminous intensity vs. DC forward current.I F – F O R W A R D C U R R E N T – m AV F – FORWARD VOLTAGE – VHIGH EFFICIENCY RED, ORANGE,YELLOW, AND HIGH PERFORMANCEGREEN, EMERALD GREEN R E L A T I V E L U M I N O U S I N T E N S I T Y (N O R M A L I Z E D A T 20 m A )0I DC – DC CURRENT PER LED – mA10201.60.80.4515301.2250.20.61.01.4HER, ORANGE, YELLOW, AND HIGH PERFORMANCE GREEN, EMERALD GREEN WAVELENGTH – nmR E L A T I V E I N T E N S I T Y1.00.50Figure 4. Relative efficiency (luminous intensity per unit current) vs. peak LED current.Figure 5. Maximum tolerable peak current vs. pulse duration. (I DC Max. as per maximum ratings.)R A T I O O F M A X I M U M T O L E R A B L E P E A K C U R R E N T T O M A X I M U M T O L E R A B L E D C C U R R E N Tt P – PULSE DURATION – µs13462I P E A K M A X .I D C M A X .ηP E A K – R E L A T I V E E F F I C I E N C Y (N O R MA L I Z E D A T 20 m A )I PEAK – PEAK SEGMENT CURRENT – mA0.40.60.81.01.3HER, ORANGE, YELLOW, HIGHPERFORMANCE GREEN, EMERALD GREEN 0.50.70.91.2Note:All categories are established for classification of products. Products may not be available in all categories. Please contact your local Agilent representative for further clarification/information.Mechanical Option Matrix Mechanical Option Code Definition002Tape & Reel, straight leads, minimum increment 1300 pcs/bag 010Right Angle Housing, even leads, minimum increment 500 pcs/bagFigure 6. Relative luminous intensity vs. angular displacement for HLMP-40xx.°90Figure 7. Relative luminous intensity vs. angular displacement for HLMP-08xx.°90Precautions Lead Forming•The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering into PC board.•If lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress induced to LED package. Otherwise, cut the leads of LED to length after soldering process at roomtemperature. The solder joint formed will absorb the mechanical stress of the lead cutting from traveling to the LED chip die attach and wirebond.•It is recommended that tooling made to preciselyform and cut the leads to length rather than rely upon hand operation.Soldering Conditions•Care must be taken during PCB assembly and soldering process to prevent damage to LED component.•The closest LED is allowed to solder on board is 1.59mm below the body (encapsulant epoxy) for those parts without standoff.•Recommended soldering conditions:•Wave soldering parameter must be set andmaintained according to recommended temperature and dwell time in the solder wave. Customer isadvised to periodically check on the soldering profile to ensure the soldering profile used is always conforming to recommended soldering condition.•If necessary, use fixture to hold the LED component in proper orientation with respect to the PCB during soldering process.•Proper handling is imperative to avoid excessive thermal stresses to LED components when heated.Therefore, the soldered PCB must be allowed to cool to room temperature, 25°C, before handling.•Special attention must be given to board fabrication,solder masking, surface plating and lead holes size and component orientation to assure solderability.•Recommended PC board plated through hole sizes for LED component leads:Manual Solder Wave Soldering Dipping Pre-heat Temperature 105 °C Max.–Pre-heat Time 30 sec Max.–Peak Temperature 250 °C Max.260 °C Max.Dwell Time3 sec Max.5 sec Max.LED Component Plated Through Lead SizeDiagonal Hole Diameter 0.457 x 0.457 mm 0.646 mm 0.976 to 1.078 mm (0.018 x 0.018 inch)(0.025 inch)(0.038 to 0.042 inch)0.508 x 0.508 mm 0.718 mm 1.049 to 1.150 mm (0.020 x 0.020 inch)(0.028 inch)(0.041 to 0.045 inch)Note: Refer to application note AN1027 for more information on soldering LED components.Figure 8. Recommended wave soldering profile.BOTTOM SIDE OF PC BOARD TIME – SECONDST E M P E R A T U R E – °CTOP SIDE OF PC BOARDCONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)PREHEAT SETTING = 150°C (100°C PCB)SOLDER WAVE TEMPERATURE = 245°C AIR KNIFE AIR TEMPERATURE = 390°C AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)AIR KNIFE ANGLE = 40°SOLDER: SN63; FLUX: RMANOTE: ALLOW FOR BOARDS TO BESUFFICIENTL Y COOLED BEFORE EXERTING MECHANICAL FORCE./semiconductors For product information and a complete list of distributors, please go to our web site.For technical assistance call:Americas/Canada: +1 (800) 235-0312 or (916) 788-6763Europe: +49 (0) 6441 92460China: 10800 650 0017Hong Kong: (+65) 6756 2394India, Australia, New Zealand: (+65) 6755 1939 Japan: (+81 3) 3335-8152(Domestic/Interna-tional), or 0120-61-1280(Domestic Only) Korea: (+65) 6755 1989Singapore, Malaysia, Vietnam, Thailand, Philippines, Indonesia: (+65) 6755 2044 Taiwan: (+65) 6755 1843Data subject to change.Copyright © 2003-2005 Agilent Technologies, Inc. Obsoletes 5989-3266ENNovember 12, 20055989-4264EN。

海尔 ORE-45P ORP 电极传感器说明书

Figure 1-1 ORE-45P Sensor Dimensions (standard, convertible-style)1.4 Important Notes 1. The ORE-45P process electrode contains glass andcan break if not handled properly. Should the electrodeever break, USE CAUTION when handling the sensorto avoid serious cuts.2. The electrode must be wetted at all times to ensureproper functionality. ORE-45P sensors are shippedwith a fluid-filled cap over the electrode to enableimmediate use (remove cap before installing, save forstorage and shipping). Electrodes that have driedout for any reason should be hydrated for 24 hours torestore full functionality.Note: Integral Mount suitablefor loop-powered versionONLYFigure 2-1 Integral Mount to ORTX-45 Monitor/AnalyzerFigure 2-2 ORE-45P Sensor StylesFigure 2-3 Cable Description, Model ORE-45PNote:Only Omega’s custom 6-wire shielded interconnect cable must be used when connecting theModel ORE-45P sensor to the analyzer.high-performance, double shielded, polyethylenejacketed cable is specially designed to provide theproper signal shielding for the sensor used in thissystem. No substitutions can be made. Substitutedcables may cause problems with systemperformance.Voltage between Terminals 9 and 10 MUST be between 16 and 35 VDC.Earth ground into Terminal 12 is optional. This connection can greatly improve stability in electrically noisy environments.Figure 2-4 Wiring Diagram, ORE-45P Sensor and ORTX-45 Monitor/AnalyzerFigure 3-1 Replacing the Saltbridge and Reference Buffer。

HLMP-CY36-UX0DD资料

HLMP-CYxxPrecision Optical Performance 5mm Round Warm White LED LampsData SheetPackage DimensionsFeatures• Well defined spatial radiation pattern • High luminous white emission • Viewing angle: 15°, 23°, 30° and 50°• Standoff or non-standoff leadsDescriptionThese high intensity white LED lamps are based on InGaN material technology. A blue LED die is coated by phosphor to produce white.The typical resulting color is described by the coordi-nates x= 0.41, y = 0.39 using the CIE 1931 Chromaticity Diagram. These T-1¾ lamps are untinted, non-diffused, and incorporate precise optics which produce well-defined spatial radiation patterns at specific viewing cone angle.DIMENSION H:15°: 12.24 ± 0.25mm (0.482 ± 0.01 inches)23°: 12.50 ± 0.25mm (0.492 ± 0.01 inches)30°: 12.00 ± 0.25mm (0.472 ± 0.01 inches)Package Dimension APackage Dimension BCaution: InGaN devices are Class 1C HBM ESD sensitive per JEDEC Standard. Please observe appropriate during handling and processing. Refer to Application Note AN-1142 for additional details.DIMENSION H:50°: 11.98 ± 0.25mm (0.4715 ± 0.01 inches)Note:1. All dimensions are in millimeters/ inches.2. Epoxy meniscus may extend about 1mm (0.040”) down the leads.3. If heat sinking application is required, the terminal for heat sink is anode.Package Dimension CHLMP-CY46/47 Package drawingPackage Dimension DDevice Selection GuidePart NumberTypicalViewing Angle (˚)Luminous Intensity (mcd) at 20mAStandoff Package DimensionMin.Max.HLMP-CY -WZ0DD 55500 6000No AHLMP-CY -WZ0DD 55500 6000Yes BHLMP-CY 6-VY0DD 34 00 000No AHLMP-CY 7-VY0DD 34 00 000Yes BHLMP-CY36-UX0DD303 009300No AHLMP-CY37-UX0DD303 009300Yes BHLMP-CY46-TW0DD50 5005500No CHLMP-CY47-TW0DD50 5005500Yes DTolerance for each intensity limit is ± 15%.Part Numbering SystemAbsolute Maximum Rating T A = 25°CParameter White Unit DC Forward Current 30mA Peak Forward Current 00[ ]mA Power Dissipation 6mW Reverse Voltage 5 (I R = 0 μA)V LED Junction Temperature 0°C Operating Temperature Range -40 to +85°C Storage Temperature Range-40 to + 00°CNotes:1. Derate linearly as shown in Figure 22. Duty Factor 10%, frequency 1kHz.Optical/ Electrical Performance at 25°CParameter Symbol Min Typ Max Units Test Condition Forward Voltage V F .8 3.3.8V I F = 0 mA Reverse Voltage V R 5.0V I R = 0 µAThermal Resistance RθJ-PIN 40˚C/WLED junction to anode lead Chromaticity CoordinateX y0.4 0.39I F = 0 mANotes:1. The reverse voltage of the product is equivalent to the forward voltage of the protective chip at IR = 10 µA2. The chromaticity coordinates are derived from the CIE 1931 Chromaticity Diagram and represent the perceived color of the device.Packaging Option DD: Ammopacks Color Bin Selection 0: Open distribution Maximum Intensity Bin 0: No maximum intensity limit Minimum Intensity BinRefer to Device Selection Guide Viewing Angle Color:Y: Warm White PackageC: 5mm round Lamps11/12: 15° package 26/27: 23° package 36/37: 30° package 46/47: 50° packageFigure 1. Relative Intensity vs. Wavelength Figure 2. Forward current vs Ambient TemperatureFigure 3. Relative Intensity vs Forward CurrentFigure 4. Chromaticity shift vs forward current0.00.20.40.60.81.0380480580680780WAVELENGTH - nmR E L A T I V E I N T E N S I TY05101520253035020406080100T A - AMBIENT TEMPERATURE - °CI F m a x . - M A X I M U M F O R W A R D C U R R E N T - m AFigure 5. Forward current vs forward voltageX-COORDINATEY -C O O R D I N A T E0510152025303501234FORWARD VOLTAGE - VF O R W A R D C U R R E N T - m A0.20.40.60.811.21.41.605101520253035DC FORWARD CURRENT - mAR E L A T I V E L U M I N O U S I N T E N S I T Y (N O R M A L I Z E D A T 20 m A )Radiation PatternFigure 6. Radiation pattern for HLMP-CY11/12Figure 7. Radiation pattern for HLMP-CY26/27Figure 8. Radiation pattern for HLMP-CY36/37Figure 9. Radiation pattern for HLMP-CY46/4700.20.40.60.810306090120150180ANGULAR DISPLACEMENT - DEGREES N O R M A L I Z E D I N T E N S I T Y00.20.40.60.810306090120150180ANGULAR DISPLACEMENT - DEGREESN O R M A L I Z E D I N T E N S I T Y00.20.40.60.81-90-60-300306090ANGULAR DISPLACEMENT - DEGREESN O R M A L I Z E D I N T E N S I TY0.20.40.60.81-90-60-30306090ANGULAR DISPLACEMENT - DEGREESN O R M A L I Z E D I N T E N S I T YIntensity Bin Limit Table at 20mABin Intensity (mcd) at 20 mAMin Max T 5003 00U 3 004 00V 4 005500W 55007 00X 7 009300Y 9300 000Z0006000Tolerance for each bin limit is ± 15%Color bin limitsRank Chromaticity Coordinates Limits X 0.36 00.39880.38 0.35450.36 0Y 0.38500.4 60.35800.34080.3850 X 0.39880.43900.4 90.38 0.3988Y 0.4 60.43 00.37 50.35800.4 63X 0.43900.49700.45880.4 90.4390Y0.43 00.44660.38380.37 50.43 0Tolerance for each bin limit is ± 0.01Avago Warm white binning on CIE 1931 Chromaticity Diagram0.3000.3500.4000.4500.5000.3000.3500.4000.4500.5000.550xyAvago Technologies LED configurationPrecautions:Lead Forming:• The leads of an LED lamp may be performed or cut to length prior to insertion and soldering on PC board.• If lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress that induced into the LED package. Otherwise, cut the leads to applicable length after soldering process at room temperature. The solder joint formed will absorb the mechanical stress, due to the lead cutting, from traveling to the LED chip die attach and wirebond. • For better control, it is recommended to use proper tool to precisely form and cut the leads to applicable length rather than doing it manually.Soldering condition:• Care must be taken during PCB assembly and soldering process to prevent damage to the LED component. • The closest manual soldering distance of the soldering heat source (soldering iron’s tip) to the body is 1.59mm. Soldering the LED closer than 1.59mm might damage the LED.• Recommended soldering condition:Wave SolderingManual Solder Dipping Pre-heat temperature 05 °C Max.-Preheat time 30 sec Max -Peak temperature50 °C Max.60 °C Max.Dwell time 3 sec Max. 5 sec Max• Wave soldering parameter must be set and maintain according to the recommended temperature and dwell time. Customer is advised to daily check on the soldering profile to ensure that the soldering profile is always conforming to recommended soldering condition.Note:1. PCB with different size and design (component density) will have different heat mass (heat capacity). This might cause a change in temperature experienced by the board if same wave soldering setting is used. So, it is recommended to re-calibrate the soldering profile again before loading a new type of PCB.2. Avago Technologies’ high brightness LED are using high efficiency LED die with single wire bond as shown below. Customer is advised to take extra precaution during wave soldering to ensure that the maximum wave temperature is not exceeding 250°C. Over-stressing the LED during soldering process might cause premature failure to the LED due todelamination.Note: Electrical connection between bottom surface of LED die and the lead frame material through conductive paste of solder.• If necessary, use fixture to hold the LED component in proper orientation with respect to the PCB during soldering process.• At elevated temperature, the LED is more susceptible to mechanical stress. Therefore, PCB must allowed to cool down to room temperature prior to handling, which includes removal of jigs, fixtures or pallet.• Special attention must be given to board fabrication, solder masking, surface platting and lead holes size and component orientation to assure the solderability.• Recommended PC board plated through holes size for LED component leads.LED component lead size Diagonal Plated through hole diameter 0.457 x 0.457 mm (0.0 8 x 0.0 8 inch)0.646 mm (0.0 5 inch)0.976 to .078 mm (0.038 to 0.04 inch)0.508 x 0.508 mm (0.0 0 x 0.0 0 inch)0.7 8 mm (0.0 8 inch).049 to . 50 mm (0.04 to 0.045 inch)• Under sizing of plated through hole can lead to twisting or improper LED placement during auto insertion. Over sizing plated through hole can lead to mechanical stress on the epoxy lens during clinching.Note: Refer to application note AN1027 for more information on soldering LED components.InGaN DeviceNote: The ammo-packs drawing is applicable for packaging option –DD & -ZZ and regardless standoff or non-standoffAmmo Packs DrawingRecommended Wave Soldering ProfileBOTTOM SIDE TOP SIDE NOTE: ALLOW FOR BOARDS TO BE CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)250200150TIME - SECONDST E M P E R A T U R E - °C1005030LEAD FREE SOLDER96.5%Sn; 3.0%Ag; 0.5% Cu SUFFICIENTLY COOLED BEFORE EXERTING MECHANICAL FORCE.OF PC BOARDOF PC BOARD PREHEAT SETTING = 150°C (100°C PCB)SOLDER WAVE TEMPERATURE = 245°C ± 5˚C AIR KNIFE AIR TEMPERATURE = 390°C AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)SOLDER: SN63; FLUX: RMA AIR KNIFE ANGLE = 40Packaging Box for Ammo PacksNote: For InGaN device, the ammo pack packaging box contain ESD logoFor product information and a complete list of distributors, please go to our web site: Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited in the United States and other countries. Data subject to change. Copyright © 007 Avago Technologies Limited. All rights reserved.AV0 -0 EN - March 9, 007。

MDP45资料

For technical questions contact: ff2aresistors@Document Number: 31512MDP 45, 46Vishay DaleFEATURES•0.190" [4.83 mm] maximum seated height •Rugged, molded case construction•Low temperature coefficient (- 55 °C to + 125 °C),MDP 1645: ± 100 ppm/°C, MDP 1646: ± 250 ppm/°C •Compatible with automatic insertion equipment •Thick film resistive elements•Reduces PC board space and reduces total assembly costs•Available in tube pack•Lead (Pb)-free version is RoHS compliant* Pb containing terminations are not RoHS compliant, exemptions may apply STANDARD ELECTRICAL SPECIFICATIONSGLOBAL MODEL/PIN NO.RESISTOR POWER RATING Max. AT 70 °CWPACKAGE POWER RATING Max. AT 70 °CWSTANDARD TOLERANCE± %TEMPERATURE COEFFICIENT (- 55 °C to + 125 °C)ppm/°CTEMPERATURE COEFFICIENT TRACKING ppm/°CWEIGHTg MDP16450.1252.02± 100T ypical ± 150 1.5MDP16460.125 2.05± 250T ypical± 1501.5Document Number: 31512For technical questions contact: ff2aresistors@MDP 45, 46Thick Film Resistor Networks, Dual-In-Line, Molded DIPVishay DaleDIMENSIONS in inches [millimeters]TECHNICAL SPECIFICATIONSPARAMETERUNIT MDP Series Maximum Operating VoltageVDC 100Voltage Coefficient of Resistance (T ypical)V eff < 50 ppm/°C Operating Temperature Range °C - 55 to + 125Storage T emperature Range°C- 55 to + 150MECHANICAL SPECIFICATIONSMarking Resistance to Solvents:Permanency testing per MIL-STD-202, Method 215 Solderability:Per MIL-STD-202, Method 208E Terminals: Copper alloy, solder plated Body: Molded epoxy Weight:1.5 gramsPERFORMANCETESTCONDITIONSMAX. ΔR (Typical Test Lots)Thermal Shock 5 cycles between - 65 °C and + 125 °C ± 0.50 % ΔR Short Time Overload 2.5 x rated working voltage 5 seconds± 0.25 % ΔR Low T emperature Operation 45 minutes at full rated working voltage at - 65 °C ± 0.25 % ΔR Moisture Resistance 240 hours with humidity ranging from 80 % RH to 98 % RH± 0.50 % ΔR Resistance to Soldering Heat Leads immersed in + 260 °C solder to within 1/16" of body for 10 seconds ± 0.25 % ΔR Shock T otal of 18 shocks at 100 g's± 0.25 % ΔR Vibration 12 hours at maximum of 20 g's between 10 and 2000 Hz± 0.2 5% ΔR Load Life 1000 hours at + 70 °C, rated power applied 1.5 hours “ON”, 0.5 hour “OFF” for full 1000 hour period. Derated according to the curve.± 0.50 % ΔR Terminal Strength 4 1/2 pound pull for 30 seconds ± 0.25 % ΔRInsulation Resistance10 000 Megohm (minimum)-Dielectric Withstanding VoltageNo evidence of arcing or damage (200 V RMS for 1 minute)-Disclaimer Legal Disclaimer NoticeVishayAll product specifications and data are subject to change without notice.Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product.Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed therein, which apply to these products.No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay.The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications.Product names and markings noted herein may be trademarks of their respective owners.元器件交易网Document Number: 。

HLMP-HD57资料

DescriptionThis Precision Optical Performance Oval LED is specifi-cally designed for Full Color/Video and Passenger Infor-mation Signs. The Oval shaped radiation pattern and high luminous intensity ensure that this device is excellent for wide field of view outdoor applications where a wide viewing angle and readability in sunlight are essential. This lamp has very smooth, matched radiation patterns ensuring consistent color mixing in full color applica-tions, message uniformity across the viewing angle of the sign. High efficiency LED material is used in this lamp: Aluminium Indium Gallium Phosphide (AlInGaP) for Red Color. The higher performance AlInGaP II is used.The package epoxy contains both UV-A and UV-B inhibi-tors to reduce the effects of long term exposure to direct sunlight.Features• Well defined spatial radiation pattern • High brightness material • Red AlInGaP 630 nm • Tinted and diffused• Typical viewing angle 40°x100°Benefits• Viewing angle designed for wide field of viewapplications • Superior performance for outdoor environmentsApplications• Full color signs• Commercial outdoor advertisingPackage DimensionsHLMP-HD575 mm Standard OvalPrecision Optical Performance Red LEDData SheetNOTES:1. DIMENSIONS IN MILLIMETERS (INCHES).2. TOLERANCE ± 0.25 mm UNLESS OTHERWISE NOTED.Device Selection GuideColor and Luminous LuminousDominant Intensity IntensityWavelength Iv (mcd) at Iv (mcd) at Tinting Part Number λd (nm) Typ. 20 mA Min. 20 mA Max. Type HLMP-HD57-NR0xx Red 630 680 1900 Red Notes:1. The luminous intensity is measured on the mechanical axis of the lamp package.. The optical axis is closely aligned with the package mechanical axis.3. The dominant wavelength, λd, is derived from the Chromaticity Diagram and represents the color of the lamp.4. Tolerance for luminous intensity is ± 15%.Part Numbering SystemH L M P-x x x x-x x x x xMechanical Options00: Bulk Packagingzz: Flexi-bin; Ammo PacksColor Bin Selections0: No Color Bin LimitationMaximum Intensity Bin0: No Iv Bin LimitationMinimum Intensity BinRefer to Device Selection GuideColorD: 630 nm RedPackageH: 5 mm Oval 40º x 100ºNote: Please refer to AB 5337 for complete information about part numbering system.Absolute Maximum Ratings at T A = 25˚CParameter ValueDC Forward Current[1]50 mAPeak Pulsed Forward Current [ ]100 mAAverage Forward Current 30 mAPower Dissipation 1 0 mWReverse Voltage 5 V (I R = 100 µA)LED Junction Temperature 130˚COperating Temperature Range –40˚C to +100˚CStorage Temperature Range –40˚C to +1 0˚CNotes:1. Derate linearly as shown in Figure 3.. Duty Factor 30%, Frequency 1 KHz.Electrical/Optical Characteristics T A = 25˚CParameter Symbol Min.Typ. Max. Units Test Conditions Forward Voltage V F . .4 V I F = 0 mA Reverse Voltage V R 5 I R = 100 µACapacitance C 40 pF V F = 0, f = 1 MHzThermal Resistance R θJ-PIN 40 ˚C/W LED Junction-to-Cathode LeadDominant Wavelength [1] λd 6 630 634 nm I F = 0 mAPeak Wavelength λp 639 nm Peak of Wavelength of Spectral Distribution at I F = 0 mASpectral Halfwidth ∆λ1/ 17 nm Wavelength Width atSpectral Distribution 1/ PowerPoint at I F = 0 mALuminous Efficacy [ ] ηv 155 lm/W Emitted luminous power/Emitted radiant power Luminous Flux j V 1300 mlm I F = 0 mALuminous Efficiency [3] ηe 30 lm/W Luminous Flux/Electrical PowerI F = 0 mANotes:1. The dominant wavelength is derived from the Chromaticity Diagram and represents the color of the lamp.. The radiant intensity, Ie in watts per steradian, may be found from the equation Ie = Iv/ηv where Iv is the luminous intensity in candelas and ηv is the luminous efficacy in lumens/watt.3. ηe = j V / I F x V F , where j V is the emitted luminous flux, IF is electrical forward current and VF is the forward voltage.Figure 1. Relative intensity vs. wavelength.Figure 2. Relative luminous intensity vs. forward current.Figure 3. Forward current vs. ambient temperature.WAVELENGTH – nm R E L A T I V E I N T E N S I T Y1.00.50600700650550R E L A T I V E I N T E N S I T Y (N O R M A L I Z E D A T 20 m A )00FORWARD CURRENT – mA20402.01.0500.51.52.53010020406080100T A - AMBIENT TEMPERATURE -o CI F M A X . - M A X I M U M F O R W A R D C U R R E N T - m AFigure 6. Spatial radiation pattern-major axis.Intensity Bin Limits(mcd at 20 mA)Bin Name Min. Max.N 680 880P 880 1150Q 1150 1500R15001900Tolerance will be ± 15% of these limits.Note:1. Bin categories are established for classifi-cation of products. Products may not be available in all bin categories.R E L A T I V E I N T E N S I T Y1.00ANGLE – DEGREES0.5-90-50-30105090-1030-7070Figure 7. Relative Light Output vs Junction TemperatureFigure 4. Forward current vs. forward voltage.Figure 5. Spatial radiation pattern-minor axis.4020I F – F O R W A R D C U R R E N T – m AV F – FORWARD VOLTAGE – VHLMP-HD57 fig 4103050R E L A T I V E I N T E N S I T Y1.00ANGLE – DEGREES0.5-90-50-30105090-1030-70700.1110-40-20020406080100120T J - JUNCTION TEMPERATURE - °CR E L A T I V E L I G H T O U T P U T (N O R M A L I Z E D A T T J = 25°CPrecautions:Lead Forming:•The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering on PC board.•For better control, it is recommended to use proper tool to precisely form and cut the leads to applicable length rather than doing it manually.•If manual lead cutting is necessary, cut the leads after the soldering process. The solder connection forms a mechanical ground which prevents mechanical stress due to lead cutting from traveling into LED package. This is highly recommended for hand solder operation, as the excess lead length also acts as small heat sink. Soldering and Handling:•Care must be taken during PCB assembly and soldering process to prevent damage to the LED component. •LED component may be effectively hand soldered to PCB. However, it is only recommended under unavoidable circumstances such as rework. The closest manual soldering distance of the soldering heat source (soldering iron’s tip) to the body is 1.59mm. Soldering the LED using soldering iron tip closer than 1.59mm might damage the LED.Note:1. PCB with different size and design (component density) will havedifferent heat mass (heat capacity). This might cause a change in temperature experienced by the board if same wave soldering setting is used. So, it is recommended to re-calibrate the soldering profile again before loading a new type of PCB.. Avago Technologies’ high brightness LED are using high efficiency LED die with single wire bond as shown below. Customer is advised to take extra precaution during wave soldering to ensure that the maximum wave temperature does not exceed 50°C and the solder contact time does not exceeding 3sec. Over-stressing the LED during soldering process might cause premature failure to the LED due to delamination.Avago Technologies LED configuration •ESD precaution must be properly applied on thesoldering station and personnel to prevent ESDdamage to the LED component that is ESD sensitive.Do refer to Avago application note AN 114 for details.The soldering iron used should have grounded tip toensure electrostatic charge is properly grounded.•Recommended soldering condition:Wave Soldering [1, 2]Manual Solder DippingPre-heat temperature105 °C Max.-Preheat time60 sec Max-Peak temperature250 °C Max.260 °C Max.Dwell time 3 sec Max. 5 sec MaxNote:1) Above conditions refers to measurement with thermocouplemounted at the bottom of PCB.) It is recommended to use only bottom preheaters in order to reduce thermal stress experienced by LED.•Wave soldering parameters must be set and maintained according to the recommended temperature and dwell time. Customer is advised to perform daily check on the soldering profile to ensure that it is always conforming to recommended soldering conditions.Note: Electrical connection between bottom surface of LED die and the lead frame is achieved through conductive paste.•Any alignment fixture that is being applied during wave soldering should be loosely fitted and should not apply weight or force on LED. Non metal material is recommended as it will absorb less heat during wave soldering process.•At elevated temperature, LED is more susceptible to mechanical stress. Therefore, PCB must allowed to cool down to room temperature prior to handling, which includes removal of alignment fixture or pallet.•If PCB board contains both through hole (TH) LED and other surface mount components, it is recommended that surface mount components be soldered on the top side of the PCB. If surface mount need to be on the bottom side, these components should be soldered using reflow soldering prior to insertion the TH LED.•Recommended PC board plated through holes (PTH) size for LED component leads.LED componentlead size DiagonalPlated throughhole diameter0.45 x 0.45 mm(0.018x 0.018 inch)0.636 mm(0.025 inch)0.98 to 1.08 mm(0.039 to 0.043 inch)0.50 x 0.50 mm(0.020x 0.020 inch)0.707 mm(0.028 inch)1.05 to 1.15 mm(0.041 to 0.045 inch)•Over-sizing the PTH can lead to twisted LED after clinching. On the other hand under sizing the PTH can cause difficulty inserting the TH LED.Ammo Packs DrawingALL DIMENSIONS IN MILLIMETERS (INCHES).Note: The ammo-packs drawing is applicable for packaging option -DD & -ZZ and regardless of standoff or non-standoff.Example of Wave Soldering Temperature Profile for TH LED0 10 20 30 40 50 60 70 80 90 10025020015010050TIME (MINUTES)Recommended solder: Sn63 (Leaded solder alloy)SAC305 (Lead free solder alloy)Flux: Rosin fluxSolder bath temperature: 245°C± 5°C (maximum peak temperature = 250°C)Dwell time: 1.5 sec - 3.0 sec (maximum = 3sec)Note: Allow for board to be sufficiently cooled to room temperature before exerting mechanical force.Refer to application note AN5334 for more information about soldering and handling of high brightness TH LED lamps.Packaging Label(i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box)For product information and a complete list of distributors, please go to our website: Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries.Data subject to change. Copyright © 2006 Avago Technologies Limited. All rights reserved. Obsoletes 5989-4176EN AV02-0387EN - July 3, 2007Acronyms and Definition:BIN:(i) Color bin only or VF bin only(Applicable for part number with color bins but without VF bin OR part number with VF bins and no color bin)OR(ii) Color bin incorporated with VF Bin(Applicable for part number that have both color bin and VF bin)(ii) Avago Baby Label (Only available on bulk packaging)Example:(i) Color bin only or VF bin only BIN: (represent color bin only) BIN: VB (represent VF bin “VB” only)(ii) Color bin incorporate with VF BinVB: VF bin “VB”: Color bin onlyDISCLAIMERAVAGO’S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AUTHORIZED FOR SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR DIRECT OPERATION OF A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE.。

454MFTB说明书(KURZ)

流向标 NPT卡套焊接头传感器探头
流体流向图一、 454FTB 插入式流量计卡套安装方式示意图
2．现场接线
DAPRO Corpration U.S.A
对于 MFTB 系列的流量变送器在接线时要注意 6 个问题：
l
安全接地和加装防爆电缆密封接头（现场需防爆场合）。
（ 1）与订货合同型号相符的流量计本体
（ 2）制造厂出具的流量计标定证书（ 3）一张 CD 光盘（含原文操作说明书、流量计标定数据及相关软件）
（ 4）安装配件（供选配）
2. 仪表检查：
仪表外观检查及开箱检查确认无误后，在安装前应先做静态通电检查，确保仪表在
(1). 一体式安装（TA 型）
454FTB 系列插入式质量流量变送器安装方式如图 1 所示。 NPT 螺纹可与配套球阀或配套法兰连接。
※ 注意！假如在工艺管线上有阀门等节流元件动作则会干扰流体的流动状态，为
保证仪表获得最佳的测量效果，流量计安装点应与节流元器件保持一定的距离。单点插入式流量计为保证其测量精度在 1%之内，前后大致需要 30 个 D 的直管段。现场条件无法达到直管段要求的情况下可选择增加测点、选用多点 K BAR－ 2000B 系列产品，或进行现场流量/流速校准等方式也可以达到最佳的测量精度。
3．引导菜单
在编程模式下，任何时刻只要按 P 键，则子菜单程序会进到下一个子菜单程序。连续地按 P 键，可回到初始菜单。如错过所需设置的子菜单程序，可按（∨）键后退，也可用（∧）键前移。如需进入显示的子菜单，可按 E 键确认；如需退出返回到显示模式，可按一次或二次 “ C” 键即可返回。