SM39R04G1中文

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新茂SyncMOS单片机型号选型列表

SyncMOS MCU Selection Guide V e r. K 2012/1SM59RXX 系列 (RISC 1T/2T)Part No.VCC Speed FLASH RAM Size I/O Pin Package EEPROM SPI IICUART ISP&ICP WDT Power Down Wake-Up OPA PCA PWM ADC EEI&KBI RTC&MDU IRC ICE Function SM59R02A1 3.0/5 25MHZ 8KByte 256+1KB 36/40/44 P/J/Q/V Yes Yes Yes X1 ISP/ICP Yes RST/ INT/ WDT/ KBI/ LVI 16bit 4ch 10/16bit 8ch10bit 8ch KBI MDU Yes Dual DPTR SM59R03A1 3.0/5 25MHZ 12KByte 256+1KB 36/40/44 P/J/Q/V Yes Yes Yes X1 ISP/ICP Yes RST/ INT/ WDT/ KBI/ LVI 16bit 4ch 10/16bit 8ch10bit 8ch KBI MDU Yes Dual DPTR SM59R04A1 3.0/5 25MHZ 16KByte 256+1KB 36/40/44 P/J/Q/V Yes Yes Yes X1 ISP/ICP Yes RST/ INT/ WDT/ KBI/ LVI 16bit 4ch 10/16bit 8ch10bit 8ch KBI MDU Yes Dual DPTR SM59R04A2 3.0/5 25MHZ 16KByte 256+1KB 36/40/44 P/J/Q/V Yes Yes Yes X2 ISP/ICP Yes RST/ INT/ WDT/ KBI/ LVI 16bit 4ch 10/16bit 8ch10bit 8ch KBI MDU Yes Yes Dual DPTR SM59R08/16A2 3.0/5 25MHZ 32/64KB 256+2KB 48 W/U Yes Yes Yes X2 ISP/ICP Yes(2)Reset/INT/ KBI 16bit 4ch 12/16bit 4ch10bit 8ch EEI MDU Yes Yes Dual DPTR SM59R05A3 3.0/5 25MHZ 20KByte 256+2KB 38/42/46 P/J/Q/V Yes Yes Yes X2 ISP/ICP Yes RST/ INT/ WDT/ KBI/ LVI 16bit 4ch 10/16bit 8ch10bit 8ch KBI MDU Yes Yes Dual DPTR SM59R09A3 3.0/5 25MHZ 36KByte 256+2KB 38/42/46 P/J/Q/V Yes Yes Yes X2 ISP/ICP Yes RST/ INT/ WDT/ KBI/ LVI 16bit 4ch 10/16bit 8ch10bit 8ch KBI MDU Yes Yes Dual DPTR SM59R16A3 3.0/5 25MHZ 64KByte 256+2KB 38/42/46 P/J/Q/V Yes Yes Yes X2 ISP/ICP Yes RST/ INT/ WDT/ KBI/ LVI 16bit 4ch 10/16bit 8ch10bit 8ch KBI MDU Yes Yes Dual DPTR SM59R05A5 3.0/5 25MHZ 20KByte 256+2KB 38/42/46 P/J/Q/V Yes Yes Yes X2 ISP/ICP Yes RST/INT/ WDT/ KBI/ LVI/ RTC Yes 16bit 4ch 10/16bit 8ch10bit 8ch KBI RTC/MDU Yes Yes Dual DPTR SM59R09A5 3.0/5 25MHZ 36KByte 256+2KB 38/42/46 P/J/Q/V Yes Yes Yes X2 ISP/ICP Yes RST/INT/ WDT/ KBI/ LVI/ RTC Yes 16bit 4ch 10/16bit 8ch10bit 8ch KBI RTC/MDU Yes Yes Dual DPTR SM59R16A5 3.0/5 25MHZ 64KByte 256+2KB 38/42/46 P/J/Q/V Yes Yes Yes X2 ISP/ICP Yes RST/INT/WDT/KBI/LVI/RTC Yes 16bit 4ch 10/16bit 8ch10bit8ch KBIRTC/MDUYes Yes Dual DPTR SM59R05G6 2.7~5.5 25MHZ 20KByte 256+1KB 38/42/46 P/J/Q/V Yes Yes Yes X1 ISP/ICP Yes RST/ INT/ WDT/ LVI 16bit 4ch 10/16bit Yes Yes Dual DPTR SM59R09G6 2.7~5.5 25MHZ 36KByte 256+1KB 38/42/46 P/J/Q/V Yes Yes Yes X1 ISP/ICP Yes RST/ INT/ WDT/ LVI 16bit 4ch 10/16bit Yes Yes Dual DPTR SM59R16G6 2.7~5.5 25MHZ 64KByte 256+1KB 38/42/46 P/J/Q/V Yes Yes Yes X1 ISP/ICP Yes RST/ INT/ WDT/ LVI 16bit 4ch 10/16bit Yes YesDual DPTR SM59R02G1 2.7~5.5 25MHZ 8KByte 256Byte 38/42 P/J/Q/V Yes X1 ISP Yes RST/ INT/ WDT/ LVR 16bit4ch 16bitYesDual DPTRSM39RXX 系列 (RISC 1T~8T , Low Pin Count)Part No. VCC Speed FLASH RAM Size I/O Pin Package EEPROM SPI IIC UART ISP&ICP WDT Power Down Wake-Up OPA PCA PWM ADC KBI IRC ICE Function SM39R02G1 2.7~5.5 25MHZ 2KByte 256Byte 12 N(14)/O Yes Yes X1 ISP/ICP Yes RST/ INT/ WDT/ LVI Yes Yes Dual DPTR SM39R04G1 2.7~5.5 25MHZ 4KByte 256Byte 8/12 N(14)/O/M Yes Yes X1 ISP/ICP Yes RST/ INT/ WDT/ LVI Yes Yes Dual DPTR SM39R2051 2.7~5.5 25MHZ 2KByte 256Byte 18 20(N/S) Yes Yes X1 ISP/ICP Yes RST/ INT/ WDT/ LVI Yes Yes Dual DPTR/ SM39R4051 2.7~5.5 25MHZ 4KByte 256Byte 18 20(N/S) Yes Yes X1 ISP/ICP Yes RST/ INT/ WDT/ LVIYes Yes Dual DPTR/SM39R08A2 2.7~5.5 25MHZ 8KByte 256Byte 18~26 N/S/K/G Yes Yes Yes X1 ISP/ICP Yes RST/ INT/ WDT/ KBI/ LVI Yes 16bit 2ch 10/16bit 8ch10bit 4-ch KBI Yes Yes Dual DPTR SM39R12A2 2.7~5.525MHZ 12KByte 256Byte 18~26 N/S/K/G Yes Yes Yes X1 ISP/ICP Yes RST/ INT/ WDT/ KBI/ LVI Yes 16bit 2ch 10/16bit 8ch10bit 4-ch KBI Yes Yes Dual DPTR SM39R16A22.7~5.525MHZ16KByte 256Byte18~26N/S/K/GYesYesYes X1 ISP/ICP YesRST/ INT/ WDT/ KBI/ LVIYes 16bit 2ch 10/16bit 8ch10bit 4-ch KBI Yes YesDual DPTRSM59XX 系列 (12T)Part No. VCC Speed FLASH RAM Size I/O Pin Package TWSI UART ISPWDT Power Down Wake-UpSPWMPWM ADC RTC Function SM5964A 3.3/5 25/40MHZ 64KByte 256+768 Byte(1)32/36P/J/QYes X1 ISP Reset/ INT2-ch (5,8)bitVESA DDC/CISM5964 5 40MHZ 64kByte 256+768 Byte 32/36P/J/Q X1 ISP Yes(2)Reset 5-ch (5,8)-bitSM59264 5 40MHZ 64+64KB(D) 256+768 Byte(1)32/36P/J/Q Yes X1 ISP Yes Reset 4-ch (5,8)-bit VESA DDC/CI SM591285 40MHZ 128KByte 256+768 Byte(1)32/36P/J/QYesX1 ISPYes Reset 4-ch (5,8)-bitVESA DDC/CI SM79XX 系列 (12T)Part No. VCC Speed FLASH RAM Size I/O Pin Package UART WDT Power Down Wake-UpSPWM PWM ADC RTC Function SM79108 3.3/5 40MHZ 8KByte 256Byte 32/36 P/J/Q X1 Yes Reset 1-ch (5,8)-bit1-ch (5,8)bit 4-ch 8bitLCDD 4X14SM791643.3/5 25/40MHZ 64KByte 256+3840B(1) 32/36 P/J/Q X1 Yes Reset 8-ch (5,8)bitSM89XX 系列 (12T)Part No. VCC Speed FLASH RAM Size I/O Pin Package UART WDT Power Down Wake-UpSPWMPWM ADC RTC FunctionSM894051 3.3/5 25MHZ 4KByte 128Byte 15 20(P/S)X1 Yes(2) Reset LED Drive sink 20mASM8951A/52A 3.3/5 40MHZ 4/8KByte 256Byte 32/36 P/J/Q X1 Yes(2) ResetSM8954A/58A/516A3.3/5 40MHZ 16/32/64KB 256+768 Byte(1) 32/36 P/J/Q X1 Yes Reset 5-ch (5,8)-bitSM89516 3.3/5 25MHZ 64KByte 256+768 Byte 32/36 P/J/Q X1 Yes(2) ResetSM89S16R13.3/540MHZ64KByte256+768 Byte(1)32/36P/J/QX1Reset/ RTC/ INT2-ch (5,8)bit4-ch 6bitRTC(1): Expanding RAM is default disable (2): WDT Clock is from External X’talWDT Clock is from Internal X’tal define 250KHz (without (2) ) IIC =TWSI =Two-Wire Series Interface EX_INT=External Interrupt Wake-UpADC = Analog and Digital Converter (類比數位轉換器) KBI=Keyboard Interface=EEI (擴充外部中斷) RTC = Real Time Clock (時鐘裝置)MDU=Multiplication-Division unit (硬件乘除法器) PCA=Programmable Counter Array (16bit Timer 2) =capture 、compare 、clock out 、16bit PWMSM59R16A5ihhkL yymmv (yy: year ,mm: month ,v: version) i: process ( L: 3.3V C: 5V W:2.7~5.5 )hh: Max Speed (Before SM59RxxG6) or Pin Count (After SM39R & SM59RxxG6)k: package type { J:44(PLCC) M:10(MSOP-118mil) N:14/20/24/28(PDIP-300mil) O:14(SOP-150mil) {P:40(PDIP) Q:44(QFP) U:64(LQFP) V:48(LQFP) W:64(TQFP) S:20/24/28(SOP-300mil)} {K:24/28(Skinny PDIP-300mil) G:20(SSOP-150mil } L:PB Free {No text is Non-PB Free, "P" is PB Free}ＳＺ恒信宇电子有限公司ｈｔｔｐ：／／ｗｅｎｋｕ．ｂａｉｄｕ．ｃｏｍ／ｖｉｅｗ／４４ｂ３ｄ４ｄ２５０ｅ２５２４ｄｅ５１８７ｅｂ０．ｈｔｍｌ技术信息咨询：１０９１９４４０７９＠Ｑ　Ｑ．ＣＯＭ。

Moxa MGate 5134产品说明书

P/N: 1802051340010 *1802051340010*MGate 5134 Series Quick Installation GuideVersion 1.0, September 2022Technical Support Contact Information/support2022 Moxa Inc. All rights reserved.OverviewThe MGate 5134 is an industrial Ethernet gateway for ModbusRTU/ASCII/TCP and PROFINET network communications. Package ChecklistBefore installing the MGate 5134, verify that the package contains the following items:• 1 MGate 5134 gateway•Quick installation guide (printed)•Warranty cardNOTE Please notify your sales representative if any of the above items is missing or damaged.Optional Accessories (can be purchased separately)•Mini DB9F-to-TB: DB9 female to terminal block connector •WK-25: Wall-mounting kit, 2 plates, 4 screws, 25 x 43 x 2 mm Hardware IntroductionLED IndicatorsLED Color DescriptionPWR 1, PWR 2 Green Power is on. Off Power is off.Ready Off Power is off.GreenSteady: Power is on, and the MGate isfunctioning normally.Blinking (1 sec.): The MGate has beenlocated by the Moxa utility DSU Locationfunction.RedSteady: Power is on, and the MGate isbooting up.Blinking slowly (0.5 sec.): Indicates an IPconflict, or the DHCP server is notresponding properly.Flashing quickly Blinking (0.1 sec.): themicroSD card failed.PROFINET I/O Device Off No connection with PROFINET I/O controller. GreenSteady: PROFINET I/O is exchanging data,and Controller is in RUN mode.Blinking (1 sec.): PROFINET DCP flash LED. RedSteady: Incorrect slot configuration.Blinking (1sec.): One or more connectionstimed out or in STOP mode.ModbusRTU/ASCII/TCP Client Off No communication with the Modbus device. Green Steady: Normal communication in progress. RedBlinking (1 sec.): Communication error.1.The Modbus slave device returned anerror (exception).2.Received a frame error (parity error,checksum error).LED Color Description3.Timeout (the slave device does notrespond).4.TCP connection failed (only for ModbusTCP).ETH 1, ETH 2 GreenSteady ON: Ethernet link on at 100Mbps.Blinking: Data transmitting at 100Mbps. AmberSteady ON: Ethernet link on at 10Mbps.Blinking: Data transmitting at 10Mbps. Off Link is down or not connected.DimensionsReset ButtonRestore the MGate to factory default settings by using a pointed object (such as a straightened paper clip) to hold the reset button down until the Ready LED stops blinking (approximately five seconds). Hardware Installation Procedure1.Connect the power adapter. Connect the 12-48 VDC power line orDIN-rail power supply to the MGate 5134’s terminal block.e a serial cable to connect the MGate to the Modbus device.e an Ethernet cable to connect the MGate to the PROFINET I/Ocontroller.4.The MGate 5134 is designed to be attached to a DIN rail ormounted on a wall. For DIN-rail mounting, push down the springand properly attach it to the DIN rail until it “snaps” into place. For wall mounting, install the wall-mounting kit (optional) first and then screw the device onto the wall.The following figure illustrates the two mounting options:Wall- or Cabinet-mountingWe provide two metal plates to mount the unit on a wall or inside a cabinet. Attach the plates to the unit’s rear panel with screws. With the plates attached, use screws to mount the unit on thewall. The heads of the screws should be 5 to 7 mm in diameter, the shafts should be 3 to 4 mm in diameter, and the length of the screws should be over 10.5 mm.Software Installation InformationPlease download the User Manual and Device Search Utility (DSU) from Moxa’s website: For using the DSU, refer to the User’s Manual. The MGate 5134 also supports login via a web browser. Default IP address: 192.168.127.254Create your administration account and password when you log in the first time.Pin AssignmentsModbus Serial Port (Male DB9)PinRS-232RS-422/ RS-485 (4W)RS-485 (2W) 1 DCD TxD-(A) – 2 RXD TxD+(B) –3 TXD RxD+(B) Data+(B)4 DTR RxD-(A) Data-(A) 5* GND GND GND 6 DSR – – 7 RTS – – 8 CTS – – 9 – ––*Signal groundEthernet Port (RJ45) PinSignal 1 Tx+ 2 Tx- 3 Rx+ 6Rx-Power Input and Relay Output PinoutsV2+ V2-V1+ V1- DC Power Input 2 DC Power Input 2N.O.CommonN.C.DC Power Input 1DC Power Input 1SpecificationsPower Parameters Power Input12 to 48 VDC Power Consumption 455 mA max.RelaysContact Current RatingResistive load: 2 A @ 30 VDCEnvironmental Limits Operating TemperatureStandard models: -10 to 60°C (14 to 140°F)Wide temp. models: -40 to 75°C (-40 to 167°F)Storage Temperature (package included)-40 to 85°C (-40 to 185°F) Ambient Relative Humidity 5 to 95% RHPhysical Characteristics Dimensions 25 x 90 x 129.6 mm (0.98 x 3.54 x 5.1 in) Weight294 g (0.65 lb)Reliability Alert Tools Built-in buzzer and RTC MTBF 1,240,821 hrs.Hot surface label.Functional earth terminal.NOTE •This device is intended for use indoors and at altitudes up to 2,000 meters.•Pollution degree 2.NOTE Clean the device with a soft cloth, dry or with water.NOTE The power input specification complies with the requirements of SELV (Safety Extra Low Voltage), and the power supply shouldcomply with UL 61010-1 and UL 61010-2-201.For any repair or maintenance needs, please contact us.Moxa Inc.No. 1111, Heping Rd., Bade Dist., Taoyuan City 334004, Taiwan+886-03-2737575。

LG G910 说明书

常用短语 ..................... 7 1 文本信息 ...................... 71 多媒体信息 .................... 71 名片 .......................... 72 内存状态 ...................... 72
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LG-G910 用户手册
视话机软件或服务提供商而定，本手册中的部分内容可能与您的手机有所不同。
彩信 ......................... 6 5 写彩信 ........................ 65 收信箱 ........................ 66 发信箱 ........................ 67 草稿箱 ........................ 68
照相和视频点播 .............. 7 3 任意拍摄 .................... 7 3 拍摄静止图像 .................. 73 拍摄连续的静止图像 ............ 74
拍摄带相框的静止图像 .......... 75 录制视频剪辑 .................. 76

各种品牌手机中英文对照+手机缩略语

各种品牌手机中英文对照Acer:：宏基AIWA：爱华alcatel（ALC）：阿尔卡特AMOI：夏新APBW：亚太APPLE：苹果Arcoa：全虹ASUS：华硕AUX：奥克斯BenQ：明基Benten：巨腾BIRD（BRD）：波导BOSCH：博士（博世）BOSS：宝石Capitel：首信CASIO：卡西欧CECT（CEC）：中电通讯CHABRIDGE：中桥CHASE：采星COSUN：侨兴DAEWOO：大宇DATANG：大唐DAXIAN：大显DBTEL：迪比特DENSO：电送DNET：迪奈特DOEASY：多易随DOCOMO ：多科莫dopod：多普达DRAGON:东方龙EASTCOM（ETCM）：东信EMOL：易美Ericsson：爱立信fuli：富利GALAXY：银河Gionee：金立Giya：基雅GPLUS：积加Great：伟松GSL：权智（快译通）Gstar:：吉事达GVC：致福Hagenuk：汉佳诺Haier(HAR)：海尔Hisense：海信Hitachi：日立Hutel：秀特尔HYUNDAI：现代Innostream：盈讯JPG：金鹏JRC：日本无线KEJIAN(KJN)：科健Kenwood：建伍KGT：和信Konka(KON)：康佳KPT：先进电讯KYOCERA(KYEA)：京瓷LENOVO：联想LUCENT：朗讯Lucky Star：吉星Malata：万利达Maxon：美晨MiTAC：神达MITSUBISHI(Trium)：三菱Motorola：摩托罗拉NEC：日本电气NETT：雷特nintaus：金正Nixxo：尼索NOKIA（NKI）：诺基亚NOPO：星辰OKWAP：英资达OMRON：欧姆龙PALMAX：帕玛斯(仁宝) Panasonnic：松下Panda：熊猫PENESAS：天马Philips：飞利浦Photal：丰达PUTAN：普天Qualcomm：高通ROWA：乐华Sagem萨基姆Sanyo：三洋SAMSUNG：三星SED：桑达Sendo:仙都SEWON：星王SHARP：夏普Siemens：西门子SkyNet：斯加耐特Soutec：南方高科SONY：索尼SOBAO：搜豹SonyERSSION：索爱Soyea：数源Suohong：索鸿TCL：王牌TELSDA：天时达Telson:泰尔信teltron：中讯天创Tinme：天梅（天美）TLINK：神州龙TONY：天珑（天龙）TOP：托普Toplux：天诺思TOSHIBA：东芝TOYO：东洋Transasia：泛亚Ulycom：扬迪UTS：斯达康VICTOR：胜利VK：威科Vodafone：沃达丰Vtech：伟易达windows：视窗Xoceco：厦华ZTC：中天伟业ZTE：中兴**********************手机缩略语中英文对照A/D 模/数转换CELL 小区；信元AFC 自动频率控制CELLUL 蜂窝AGC 自动增益控制CHRGEN 充电器开始充电AGC PRG 闸门CHRGC 充电控制ALARM 告警CODE 代码AMPS 先进移动电话系统COVER 覆盖ANALOG 模拟CPU 中央微处理器ANT 天线CS 片选ANT SW 天线开关CUG 封闭用户群AOC 基准功率电平D/A 数/模转换ARF CH 绝对射频频道DATA 数据AUDIO 音频DATA BUS 数据总线B+ 电池正极DC IN 外接电源输入BATT+ 电池电压正端DCLKR 数据时钟BATT SER DATA 电池数据维修检测端DCS(Digital Cellular System) 工作于是800MHZ的数字蜂窝系统BCH 广播信道DCS SEL DCS 频段选择BDR 蓝激励DECODER 解码器BER 误码率DIODE 二极管BIC 总线接口DISPLAY 显示BIT 二进制数字DMCS 数据存储器片选；功放供电开启信号BKLT(Backlight) 背光DMSI SIM 卡账号BKLT EN 发光；光亮启动信号DRV 驱动，激励BIGHT 发光；亮度DSC 差动信号控制BRPAD 调整后电压DSC BUS 数字系统通信总线接口BS 基站、总线、频段开关DSP 数据信号处理BURST 短脉冲群；色同步脉冲DTXVCD DCS 频段压控振荡（器）BUS 总线EEPROM 电可擦可编程只读存储器BUZZ EN 蜂鸣器启动EL 电（致）发光CALL ACTIVE 通话激活状态EMS 音画短信CALL PROCESSOR 通话处理程序EN 使能；开启CARD 卡EPROM 要擦可编程只读存储器CDMA 码分多址ERASABLE 可擦的CE 片选或牌选使能信号MCC 滤波器ERICSSON 爱立信（公司）MC CDMA 多载波码分多址方式EXT 外部的MCIC 定向耦合器FAULT FIND 故障查找态MCLK 主时钟FDN 固定号码拨号MEMORY 存储器FDR 荧光显示板MENU 菜单FER 帧删除率，即被删除的帧数与接收到的帧数之比MICBAS 受话模块FH 跳频；行频MIN 最小（值）FLASH 闪存（存储器）MIX 送话G CAP(Global Controlled Audio and Power) 电源模块或电源管理及综合音频控制模块（摩托罗拉手机）MIXER SECOND 二次混频信号GIFSYN 中频合成模块MMS 多媒体信息服务GMSK 高斯滤波最小频移键控MNC 移动网络GPRS 通用分组无线业务（2.5G）MOBILE 移动GSM900 工作于GSM900MHZ频段的全球数字移动通信系统MODEM 调制解调器G TXVCO 发射GSM频段压控振荡（器）MOD 调制信号（器）HOOK 外接免提状态MODIN 调I信号负HS 手机MODIP 调I信号正HSINT 摘机（挂机）开关中断申请MODQN 调Q信号负HSINT(Hook Switch Int) 翻盖接听，再合上盖挂机MODQP 调Q 信号正I 同相对（水平同相）MOTOROLA 摩托罗拉（公司）ICTRL 供电电流大小控制MOU 谅解备忘录组织IF 中频MS 移动台IMEI 国际移动设备码MS INFO 手机数据信息IMQEI 手机国际移动设备MS PWR 手机功率IMSI 国际移动用户识别号MS PWR LEVEL 手机功率电平INT 中断MUC 主控单元IONS 泛欧数字式移动通信系统NC 未连接KEY 键；键控NEC 日本电气公司（日）电KEY BOARD 键盘NETWORK 网络LCD 液晶显示器Ni—G 镍镉（电池）LCM 液晶显示模块Ni—H 镍氢电池）LED 发光二极管NOKIA 诺基亚（公司）LI 锂（电池）ONSRQ 免提开关控制LIPHD 鉴相电压OSC 振荡LNA 低噪声放大（器）OVER 覆盖LO 本振PA 功率放大（器）；功放LOCK 锁定PAC 受话LOOP FLITER 锁相环滤波器PA DRV 功率放大驱动MAGI 中频电路（摩托罗拉手机）PA DRV BUZZEN 振动蜂鸣器激励MAX 最大（值）PANASONIC 松下（公司）PCS PCS1900MHZ频段PAON 功放开启PDA 掌上电脑；电子商务助理PCB 印制电路（板）PHILIPS 飞利浦（公司）PCN 个人通信PIN 个人身份识别码SAMSUNG 三星（公司）PIN2 个个身份2 SAT DET 饱和度控制、检测PLL 锁相环SAW 声表现滤波器POINT 点SF 超级滤波器POWER 电源/功率SFNSE 传感POWER TIME TEMPLATE 发射功率时间模板指标SIM GSM机身份证；用户识别卡；用户识别模块POWLEN 功放级别电平SIM RST SIM卡复位PUK（Personal Unblock Key) SIM开锁密码；个人开锁码SMS 短消息业务PUK2 个人开锁码（随SIM卡一起提供，用于修改或开启PIN2码）SMSCB 广播消息PWR 电源/功率SONY 索尼（公司）PWRSRC 供电选择SOUND 声音Q 正交支路SPEECHCODER 语言编码RADIO 无线电SPI 摩托罗拉公司独有的一种串行通信接口，即同步串行外设接口RAM 随机存储器SPI CLK SPI外围串接时钟RAMP 发射架SPI DAT SPI串行接口数据REED 干簧管SPK 话筒；扬声器REF 基准；参考SPKR 扬声器RDSET 复位SRAM 暂存存储器RF 发射频率SSCLK 软启动串行时钟RFLO 射频本振SSDR 软启动ROM 只读存储器SSDX 双向远距离软启动RPE LTP 交织及语言解码SSRST 软启动复位RSSI 接收信号强度指示START 开始；启动RST 复位STARTUP REF触发启动参考频率RTC 实时时钟STEP ATT步进衰减器RX 接收STK SIM 工具包RX ACQ 接收获得的信号SWDC 未调整电压RX EN 接收开启信号SYNCLK 频率合成器时钟RX—IFN 接收中频负SYNEN 频率合成器闸门RX—IFP 接收中频正SYNON 频率合成器开关RX—IN 接收输入；接收I信号负TCH 业务信道RX—IP 接收I信号正TDMA 时分多址RX—QN 接收Q信号负TD SDMA 时分同步码分多址RX—QP 接收Q信号正TEMP 温度检测RXVCO 接收压控振荡（器）TEMPERATURE 温度SACCH 慢速随路控制信道TP 测试点TX KEY 发射键TRST 测试点TX PWR 发射功率TX 发送TXQN 发射Q信号负TX EN 发送开启信号TXQP 发射Q信号正TX ENT 发送供电TYPE 类型TXIN 发射I信号负；发射信号输入UPHD 鉴相电压TXIP 发射I信号正V1～V4 天线收发信机间轮流接通的4种电压（摩托罗拉手机）VIBEN 振动马达开始启动VBATT 电池电压VIBRA TOR 振动器VCLKR 视频时钟VPEG 调整电压VCO 压控振荡（器）VREF 基准电压VDX 垂直驱动V SW 开关电压VT 调谐电压WAP(Wireless Application Protocol) 无线应用协议WCDMA 宽带码分多址WDG 看门狗WDT 看门狗信号WR 写XVCC 射频供电。

欧姆尼克 3R3 电感说明书

Dimensions: [mm]Scale - 7:1Product Marking:Marking3R3 (Inductance Code)7440404103374404041033BC74404041033T e m p e r a t u r eT pT L74404041033Cautions and Warnings:The following conditions apply to all goods within the product series of WE-LQS of Würth Elektronik eiSos GmbH & Co. KG:General:•This electronic component is designed and manufactured for use in general electronic equipment.•Würth Elektronik must be asked for written approval (following the PPAP procedure) before incorporating the components into any equipment in fields such as military, aerospace, aviation, nuclear control, submarine, transportation (automotive control, train control, ship control), transportation signal, disaster prevention, medical, public information network etc. where higher safety and reliability are especially required and/or if there is the possibility of direct damage or human injury.•Electronic components that will be used in safety-critical or high-reliability applications, should be pre-evaluated by the customer. •The component is designed and manufactured to be used within the datasheet specified values. If the usage and operation conditions specified in the datasheet are not met, the wire insulation may be damaged or dissolved.•Do not drop or impact the components, the component may be damaged.•Würth Elektronik products are qualified according to international standards, which are listed in each product reliability report. Würth Elektronik does not warrant any customer qualified product characteristics beyond Würth Elektroniks’ specifications, for its validity and sustainability over time.•The responsibility for the applicability of the customer specific products and use in a particular customer design is always within the authority of the customer. All technical specifications for standard products also apply to customer specific products.Product specific:Soldering:•The solder profile must comply with the technical product specifications. All other profiles will void the warranty.•All other soldering methods are at the customers’ own risk.•Strong forces which may affect the coplanarity of the components’ electrical connection with the PCB (i.e. pins), can damage the part, resulting in avoid of the warranty.Cleaning and Washing:•Washing agents used during the production to clean the customer application might damage or change the characteristics of the wire insulation, marking or plating. Washing agents may have a negative effect on the long-term functionality of the product.•Using a brush during the cleaning process may break the wire due to its small diameter. Therefore, we do not recommend using a brush during the PCB cleaning process.Potting:•If the product is potted in the customer application, the potting material may shrink or expand during and after hardening. Shrinking could lead to an incomplete seal, allowing contaminants into the core. Expansion could damage the components. We recommend a manual inspection after potting to avoid these effects.Storage Conditions:• A storage of Würth Elektronik products for longer than 12 months is not recommended. Within other effects, the terminals may suffer degradation, resulting in bad solderability. Therefore, all products shall be used within the period of 12 months based on the day of shipment.•Do not expose the components to direct sunlight.•The storage conditions in the original packaging are defined according to DIN EN 61760-2.•The storage conditions stated in the original packaging apply to the storage time and not to the transportation time of the components. Packaging:•The packaging specifications apply only to purchase orders comprising whole packaging units. If the ordered quantity exceeds or is lower than the specified packaging unit, packaging in accordance with the packaging specifications cannot be ensured. Handling:•Violation of the technical product specifications such as exceeding the nominal rated current will void the warranty.•Applying currents with audio-frequency signals may result in audible noise due to the magnetostrictive material properties.•The temperature rise of the component must be taken into consideration. The operating temperature is comprised of ambient temperature and temperature rise of the component.The operating temperature of the component shall not exceed the maximum temperature specified.These cautions and warnings comply with the state of the scientific and technical knowledge and are believed to be accurate and reliable.However, no responsibility is assumed for inaccuracies or incompleteness.Würth Elektronik eiSos GmbH & Co. KGEMC & Inductive SolutionsMax-Eyth-Str. 174638 WaldenburgGermanyCHECKED REVISION DATE (YYYY-MM-DD)GENERAL TOLERANCE PROJECTIONMETHODChriB002.0012023-02-28DIN ISO 2768-1mDESCRIPTIONWE-LQS SMT Semi-ShieldedPower Inductor ORDER CODE74404041033SIZE/TYPE BUSINESS UNIT STATUS PAGEImportant NotesThe following conditions apply to all goods within the product range of Würth Elektronik eiSos GmbH & Co. KG:1. General Customer ResponsibilitySome goods within the product range of Würth Elektronik eiSos GmbH & Co. KG contain statements regarding general suitability for certain application areas. These statements about suitability are based on our knowledge and experience of typical requirements concerning the areas, serve as general guidance and cannot be estimated as binding statements about the suitability for a customer application. The responsibility for the applicability and use in a particular customer design is always solely within the authority of the customer. Due to this fact it is up to the customer to evaluate, where appropriate to investigate and decide whether the device with the specific product characteristics described in the product specification is valid and suitable for the respective customer application or not.2. Customer Responsibility related to Specific, in particular Safety-Relevant ApplicationsIt has to be clearly pointed out that the possibility of a malfunction of electronic components or failure before the end of the usual lifetime cannot be completely eliminated in the current state of the art, even if the products are operated within the range of the specifications.In certain customer applications requiring a very high level of safety and especially in customer applications in which the malfunction or failure of an electronic component could endanger human life or health it must be ensured by most advanced technological aid of suitable design of the customer application that no injury or damage is caused to third parties in the event of malfunction or failure of an electronic component. Therefore, customer is cautioned to verify that data sheets are current before placing orders. The current data sheets can be downloaded at .3. Best Care and AttentionAny product-specific notes, cautions and warnings must be strictly observed. Any disregard will result in the loss of warranty.4. Customer Support for Product SpecificationsSome products within the product range may contain substances which are subject to restrictions in certain jurisdictions in order to serve specific technical requirements. Necessary information is available on request. In this case the field sales engineer or the internal sales person in charge should be contacted who will be happy to support in this matter.5. Product R&DDue to constant product improvement product specifications may change from time to time. As a standard reporting procedure of the Product Change Notification (PCN) according to the JEDEC-Standard inform about minor and major changes. In case of further queries regarding the PCN, the field sales engineer or the internal sales person in charge should be contacted. The basic responsibility of the customer as per Section 1 and 2 remains unaffected.6. Product Life CycleDue to technical progress and economical evaluation we also reserve the right to discontinue production and delivery of products. As a standard reporting procedure of the Product Termination Notification (PTN) according to the JEDEC-Standard we will inform at an early stage about inevitable product discontinuance. According to this we cannot guarantee that all products within our product range will always be available. Therefore it needs to be verified with the field sales engineer or the internal sales person in charge about the current product availability expectancy before or when the product for application design-in disposal is considered. The approach named above does not apply in the case of individual agreements deviating from the foregoing for customer-specific products.7. Property RightsAll the rights for contractual products produced by Würth Elektronik eiSos GmbH & Co. KG on the basis of ideas, development contracts as well as models or templates that are subject to copyright, patent or commercial protection supplied to the customer will remain with Würth Elektronik eiSos GmbH & Co. KG. Würth Elektronik eiSos GmbH & Co. KG does not warrant or represent that any license, either expressed or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, application, or process in which Würth Elektronik eiSos GmbH & Co. KG components or services are used.8. General Terms and ConditionsUnless otherwise agreed in individual contracts, all orders are subject to the current version of the “General Terms and Conditions of Würth Elektronik eiSos Group”, last version available at .Würth Elektronik eiSos GmbH & Co. KGEMC & Inductive SolutionsMax-Eyth-Str. 174638 WaldenburgGermanyCHECKED REVISION DATE (YYYY-MM-DD)GENERAL TOLERANCE PROJECTIONMETHODChriB002.0012023-02-28DIN ISO 2768-1mDESCRIPTIONWE-LQS SMT Semi-ShieldedPower Inductor ORDER CODE74404041033SIZE/TYPE BUSINESS UNIT STATUS PAGE。

毛斯（Moxa）UC-8200系列双核ARM Cortex-A7 1GHz IIoT网关产品说明书

UC-8200SeriesArm Cortex-A7dual-core1GHz IIoT gateways with built-in LTE Cat.4,1mini PCIe expansion slot for a Wi-Fi module,1CAN port,4DIs,4DOsFeatures and Benefits•Armv7Cortex-A7dual-core1GHz•ISASecure IEC62443-4-2Security Level2certified with Moxa IndustrialLinux3Secure•Moxa Industrial Linux with10-year superior long-term support•LTE-ready computer with Verizon/AT&T certification and industrial-grade CE/FCC/UL certifications•Dual-SIM slots•2auto-sensing10/100/1000Mbps Ethernet ports•Integrated LTE Cat.4module with US/EU/APAC band support•1CAN port supports CAN2.0A/B•microSD socket for storage expansion•-40to85°C wide temperature range and-40to70°C with LTE enabledCertificationsIntroductionThe UC-8200computing platform is designed for embedded data acquisition applications.The computer comes with dual RS-232/422/485serial ports,dual10/100/1000Mbps Ethernet ports,and one CAN port as well as dual Mini PCIe socket to support Wi-Fi/cellular modules.These versatile capabilities let users efficiently adapt the UC-8200to a variety of complex communications solutions.The UC-8200is built around a Cortex-A7dual core processor that has been optimized for use in energy monitoring systems,but is widely applicable to a variety of industrial solutions.With flexible interfacing options,this tiny embedded computer is a reliable and secure gateway for data acquisition and processing at field sites as well as a useful communications platform for many other large-scale deployments.Wide temperature LTE-enabled models are available for extended temperature applications.All units are thoroughly tested in a testing chamber, guaranteeing that the LTE-enabled computing platforms are suitable for wide-temperature applications.AppearanceUC-8210UC-8220SpecificationsComputerCPU Armv7Cortex-A7dual-core1GHzDRAM2GB DDR3LSupported OS Moxa Industrial Linux1(Debian9,kernel4.4),2027EOLMoxa Industrial Linux31(Debian11,kernel5.10),2031EOLSee /MILStorage Pre-installed8GB eMMCExpansion Slots MicroSD(SD3.0)socket x13OS is selectable via Moxa Computer Configuration System(CCS)for CTO models.For the model names,see the Ordering Information section of thedatasheet PDF file.Computer InterfaceEthernet Ports Auto-sensing10/100/1000Mbps ports(RJ45connector)x2 Serial Ports RS-232/422/485ports x2,software selectable(DB9male) CAN Ports CAN2.0A/B x1(DB9male)Digital Input DIs x4Digital Output DOs x4USB2.0USB2.0hosts x1,type-A connectorsWi-Fi Antenna Connector UC-8220Models:RP-SMA x2Cellular Antenna Connector UC-8220Models:SMA x2GPS Antenna Connector UC-8220Models:SMA x1Expansion Slots UC-8220-T-LX:mPCIe slot x2UC-8220-T-LX US/EU/AP Models:mPCIe slot x1SIM Format UC-8220Models:NanoNumber of SIMs UC-8220Models:2Buttons Programmable buttonTPM TPM v2.0Ethernet InterfaceMagnetic Isolation Protection 1.5kV(built-in)Security FunctionsHardware-based Security TPM2.0Hardware Root of Trust Secure BootIntrusion Detection Host-based Intrusion DetectionSecurity Tools Security Diagnostic ToolSecurity Event AuditingSecure UpdateDisk Protection LUKS Disk EncryptionRecovery One-step recovery to the last known secure stateDual-system design with automatic failbackReliability Network Keep AliveNetwork Failover and FailbackSerial InterfaceBaudrate300bps to921.6kbpsData Bits7,8Stop Bits1,2Parity None,Even,Odd,Space,MarkFlow Control RTS/CTS,XON/XOFFADDC(automatic data direction control)for RS-485RTS Toggle(RS-232only)Console Port1x4-pin header to DB9console portRS-232TxD,RxD,RTS,CTS,DTR,DSR,DCD,GNDRS-422Tx+,Tx-,Rx+,Rx-,GNDRS-485-2w Data+,Data-,GNDCAN InterfaceNo.of Ports1Connector DB9maleBaudrate10to1000kbpsIndustrial Protocols CAN2.0ACAN2.0BIsolation2kV(built-in)Signals CAN_H,CAN_L,CAN_GND,CAN_SHLD,CAN_V+,GNDDigital InputsConnector Screw-fastened Euroblock terminalDry Contact Off:openOn:short to GNDIsolation3K VDCSensor Type Wet contact(NPN)Dry contactWet Contact(DI to COM)On:10to30VDCOff:0to3VDCDigital OutputsConnector Screw-fastened Euroblock terminalCurrent Rating200mA per channelI/O Type SinkVoltage24VDC nominal,open collector to30VDCCellular InterfaceCellular Standards LTE Cat.4Band Options US Models:LTE Band2(1900MHz)/LTE Band4(1700MHz)/LTE Band5(850MHz)/LTE Band13(700MHz)/LTE Band17(700MHz)UMTS/HSPA850MHz/1900MHzCarrier Approval:Verizon,AT&TEU Models:LTE Band1(2100MHz)/LTE Band3(1800MHz)/LTE Band5(850MHz)/LTE Band7(2600MHz)/LTE Band8(900MHz)/LTE Band20(800MHz)UMTS/HSPA850MHz/900MHz/1900MHz/2100MHzAP Models:LTE Band1(2100MHz)/LTE Band3(1800MHz)/LTE Band5(850MHz)/LTE Band7(2600MHz)/LTE Band8(900MHz)/LTE Band28(700MHz)UMTS/HSPA850MHz/900MHz/1900MHz/2100MHzReceiver Types GPS/GLONASS/GalileoState-of-the-art GNSS solutionAccuracy Position:2.0m@CEP50Acquisition Hot starts:1.1secCold starts:29.94secSensitivity Cold starts:-145dBmTracking:-160dBmTime Pulse0.25Hz to10MHzLED IndicatorsSystem Power x2Programmable x1SIM card indicator x1Wireless Signal Strength Cellular/Wi-Fi x6Power ParametersNo.of Power Inputs Redundant dual inputsInput Voltage12to48VDCPower Consumption10WInput Current0.8A@12VDCReliabilityAlert Tools External RTC(real-time clock)Automatic Reboot Trigger External WDT(watchdog timer)Physical CharacteristicsDimensions UC-8220Models:141.5x120x39mm(5.7x4.72x1.54in)UC-8210Models:141.5x120x27mm(5.7x4.72x1.06in)141.5x120x27mm(5.7x4.72x1.06in)Weight UC-8210Models:560g(1.23lb)UC-8220Models:750g(1.65lb)Housing SECCMetalIP Rating IP30Installation DIN-rail mountingWall mounting(with optional kit)Environmental LimitsOperating Temperature-40to70°C(-40to158°F)Storage Temperature(package included)-40to85°C(-40to185°F)Ambient Relative Humidity5to95%(non-condensing)Shock IEC60068-2-27Vibration2Grms@IEC60068-2-64,random wave,5-500Hz,1hr per axis(without USB devicesattached)Standards and CertificationsEMC EN55032/35EN61000-6-2/-6-4EMI CISPR32,FCC Part15B Class AEMS IEC61000-4-2ESD:Contact:4kV;Air:8kVIEC61000-4-3RS:80MHz to1GHz:10V/mIEC61000-4-4EFT:Power:2kV;Signal:1kVIEC61000-4-6CS:10VIEC61000-4-8PFMFIEC61000-4-5Surge:Power:0.5kV;Signal:1kV Industrial Cybersecurity IEC62443-4-1IEC62443-4-2Hazardous Locations Class I Division2ATEXIECExCarrier Approvals VerizonAT&TSafety UL62368-1EN62368-1Green Product RoHS,CRoHS,WEEEMTBFTime UC-8210-T-LX-S:708,581hrsUC-8220-T-LX:650,836hrsUC-8220-T-LX-US-S/EU-S/AP-S:528,574hrs Standards Telcordia(Bellcore)Standard TR/SRWarrantyWarranty Period5yearsDetails See /warrantyPackage ContentsDevice1x UC-8200Series computerDocumentation1x quick installation guide1x warranty cardInstallation Kit1x DIN-rail kit(preinstalled)1x power jack6x M2.5mounting screws for the cellular module Cable1x console cableDimensions UC-8210UC-8220Ordering Information12UC-8210-T-LX-SDefault:MIL1(-Debian9),2027EOLOrder WithModel UC-8210-T-LX-S(CTO):MIL3(Debian11)Secure/Standard,2031EOLWith MIL3Secure1GHzDual CoreBuilt in––-40to85°CUC-8220-T-LXDefault:MIL1(-Debian9),2027EOLOrder WithModel UC-8220-T-LX(CTO):MIL3(Debian11)Secure/Standard,2031EOLWith MIL3Secure1GHzDual CoreBuilt in Reserved Reserved-40to70°CUC-8220-T-LX-US-SDefault:MIL1(-Debian9),2027EOLOrder WithModel UC-8220-T-LX-US-S(CTO):MIL3(Debian11)Secure/Standard,2031EOLWith MIL3Secure1GHzDual CoreBuilt inUS region LTEmodulepreinstalledReserved-40to70°CUC-8220-T-LX-EU-SDefault:MIL1(-Debian9),2027EOLOrder WithModel UC-8220-T-LX-EU-S(CTO):MIL3(Debian11)Secure/Standard,2031EOLWith MIL3Secure1GHzDual CoreBuilt inEurope regionLTE modulepreinstalledReserved-40to70°CUC-8220-T-LX-AP-SDefault:MIL1(-Debian9),2027EOLOrder WithModel UC-8220-T-LX-AP-S(CTO):MIL3(Debian11)Secure/Standard,2031EOLWith MIL3Secure1GHzDual CoreBuilt inAPAC regionLTE modulepreinstalledReserved-40to70°CUC-8210-T-LX-S(CTO)MIL3(Debian11)Secure orStandard,2031EOLWith MIL3Secure1GHzDual CoreBuilt in––-40to85°CUC-8220-T-LX(CTO)MIL3(Debian11)Secure orStandard,2031EOLWith MIL3Secure1GHzDual Core–Reserved Reserved-40to70°CUC-8220-T-LX-US-S (CTO)MIL3(Debian11)Secure orStandard,2031EOLWith MIL3Secure1GHzDual CoreBuilt inUS region LTEmodulepreinstalledReserved-40to70°C12UC-8220-T-LX-EU-S (CTO)MIL3(Debian11)Secure orStandard,2031EOLWith MIL3Secure1GHzDual CoreBuilt inEurope regionLTE modulepreinstalledReserved-40to70°CUC-8220-T-LX-AP-S (CTO)MIL3(Debian11)Secure orStandard,2031EOLWith MIL3Secure1GHzDual CoreBuilt inAPAC regionLTE modulepreinstalledReserved-40to70°CAccessories(sold separately)Power AdaptersPWR-12150-EU-SA-T Locking barrel plug,12VDC,1.5A,100to240VAC,EU plug,-40to75°C operating temperature PWR-12150-UK-SA-T Locking barrel plug,12VDC,1.5A,100to240VAC,UK plug,-40to75°C operating temperature PWR-12150-USJP-SA-T Locking barrel plug,12VDC1.5A,100to240VAC,US/JP plug,-40to75°C operating temperature PWR-12150-AU-SA-T Locking barrel plug,12VDC,1.5A,100to240VAC,AU plug,-40to75°C operating temperature PWR-12150-CN-SA-T Locking barrel plug,12VDC,1.5A,100to240VAC,CN plug,-40to75°C operating temperature Power WiringCBL-PJTB-10Non-locking barrel plug to bare-wire cableCablesCBL-F9DPF1x4-BK-100Console cable with4-pin connector,1mWi-Fi Wireless ModulesUC-8200-WLAN22-AC Wireless package for UC-8200V2.0or later with Wi-Fi module,2screws,2spacers,1heat sink,1pad AntennasANT-LTEUS-ASM-01GSM/GPRS/EDGE/UMTS/HSPA/LTE,1dBi,omnidirectional rubber-duck antennaANT-LTE-ASM-04BK704to960/1710to2620MHz,LTE omnidirectional stick antenna,4.5dBiANT-LTE-OSM-03-3m BK700-2700MHz,multiband antenna,specifically designed for2G,3G,and4G applications,3m cable ANT-LTE-ASM-05BK704-960/1710-2620MHz,LTE stick antenna,5dBiANT-LTE-OSM-06-3m BK MIMO Multiband antenna with screw-fastened mounting option for700-2700/2400-2500/5150-5850MHzfrequenciesANT-WDB-ARM-02022dBi at2.4GHz or2dBi at5GHz,RP-SMA(male),dual-band,omnidirectional antennaDIN-Rail Mounting KitsUC-8210DIN-rail Mounting Kit DIN-rail mounting kit for UC-8210with4M3screwsUC-8220DIN-rail Mounting Kit DIN-rail mounting kit for UC-8220with4M3screwsWall-Mounting KitsUC-8200Wall-mounting Kit Wall-mounting kit for UC-8200with4M3screws©Moxa Inc.All rights reserved.Updated Jul18,2023.This document and any portion thereof may not be reproduced or used in any manner whatsoever without the express written permission of Moxa Inc.Product specifications subject to change without notice.Visit our website for the most up-to-date product information.。

ROHM BD34301EKV 32位D A转换器IC说明书

32bit D/A Converter I C ‘BD34301EKV’for Hi-Fi Audio EquipmentApril 1, 2021ROHM Co., Ltd.Marketing Communications Dept.*MUS-IC TM is a trademark or registered trademark of ROHM Co., Ltd.*Please note that this document is current as of the date of publicationROHM's first, most advanced MUS-IC TM series DAC chip enablesexpressive playback of classical musicAudio SoCSpeakersHigh Fidelity Audio Equipment and ROHM’s ApproachRadio/TV TunerRecording Media (Audio Source)Power Supply ICReleased Sep 2017We are developing a variety of products for high-fidelity audio equipmentAnalog Signal Digital Signal Control SignalMedia DecoderAmplifierAnalog DesignAudio DeviceSound Processor (Digital)MCUD/A ConverterSound Processor (Analog)Sound ProcessorReleased Oct 2016AmplifierReleased Mar 2018Digital DesignSpeakersClass D Speaker AmplifierClass AB Speaker AmpSupports high-fidelity, high-res audioSupports high-res audioSupports high-fidelity, high-res audio Supports high-fidelity, high-res audio12345Listening Evaluation ResultsConventional New ProductClarityRealityExpansionResolutionLocalizationBass feeling stereotacticDistortion feelingPowerfulnessAchieving Optimum Sound Quality Using ROHM’s Vertically Integrated Production System and Sound Quality Design TechnologyIC Layout, PhotomaskManufacturingWafer Formation ProcessDie and Lead FrameFinished IC ChipROHM’s Vertically Integrated Production SystemThe parameters in each process confirmedto have an effect on sound quality are shown belowLead FrameIC LayoutBonding WirePackageAt various steps in our vertically integrated production process, we have identified 28 parametersthat affect sound quality and adjusted them one by one to create the desired soundEx) Sound Processors for Hi-Fi AudioPlayer (Audio Source)PlayerPreamp (Volume Control)Sound ProcessorMain AmpPower AmpSpeakersIntegrated AmpMaintains information even at low volumeCheck sound quality through actual listening evaluation basedon a set of indicatorsPackageCircuit Design12 parameters6 parameters6 parameters1 parameter3 parametersVerify the sound quality in a dedicated listening room (At the Yokohama Technology Center)ROHM’s High -End Audio Device Brand: ROHM Musical Device [MUS-IC]For more information, please visit ROHM’s Musical Device ‘MUS -IC TM ’ web page.https:///mus-ic/MUS-IC TMCreated by combining the ‘Sound Quality Design Technology ’with ROHM’s corporate mission of ‘Quality First ’, ‘Vertically Integrated Production System ’, and ‘Contribution to the Musical Culture ’, MUS-IC TM (official name: ROHM Musical Device‘MUS -IC TM ’) is an audio device brand that represents the ultimate IC solutions developed by ROHM’s team of experienced and dedicated engineers.Quality FirstQ ualityContributing to Music CultureF or everyonemoved by musicSound QualityDesign TechnologyS oundVertically Integrated Production SystemC raftsmanshipDevelopment ConceptMUS-IC TMProduct OverviewROHM's first top-shelf MUS-IC TM series of DAC chips enables expressive playback of classical musicKey CharacteristicsNo. of Outputs: 2ch (stereo)Resolution: 32bitSampling Frequency: 32kHz to 768kHzS/N Ratio: 130dB (typ.)THD+N: -115dB (typ.)DSD Clock: 2.8MHz, 5.6MHz,11.2MHz, 22.4 MHzFIR Filter: Preset, Custom, External Segment We will begin selling the BD34301EKV DAC chip along with an evaluationBD34301EKV-EVK-001 Evaluation BoardEnables immediateevaluation of the soundquality of the BD34301EKV Please refer to the evaluation board user’s guide for details.The BD34301EKV delivers superior performance in audio equipment by improving sound quality in ways that cannotbe defined by numerical characteristicsDeliver sound quality characteristics that allow one to hear elementssuch as ‘spatial reverberation’, ‘quietness’, and ‘dynamic range’D/A Conversion Circuit⚫Minimizes the power supplyimpedance of each current segment ⚫Optimized wiring layout⇒Reduces the clock delay (thatdetermines the timing operation of each current segment) as much as possibleDigital Signal Processing Circuit⚫The FIR filter (a key function) isdesigned to faithfully process even the smallest signals⇒Achieves a rejection band attenuation (a filter performance index) of -150dB or lessEfforts to improve sound quality performanceBD34301EKV MUS-IC TM 32bit D/A Converter ICFeature 1: Achieves best-in-class sound quality characteristics ideal for classical musicFeature 2: Customizable digital filter allows designers to tailor the sound to audio equipment The BD34301EKV includes a customizable digital filter -a key feature of the digital signal processing circuit -supporting the creation of the ideal sound sought by audio equipmentmanufacturersFIR Filter Specifications⚫Select from preset / custom / external settings⚫The filter’s calculation coefficients and oversampling rate can alsobe customized with the program function⇒Configure unique digital filters to easily achieve different sound qualitytunings for each audio deviceCustomizable digital filters help reduce development loadand create the ideal sound sought by manufacturersReduce the power supply wiring impedance of each currentsegment as much as possibleSound quality improvement effect: Improved bass power and depth,resulting in better sound range balanceEliminating the common impedance from each current segment to the power supply pin makes it possible to align the matching characteristics of the current segments-120-110-100-90-80-70-60-50-40-30-20-100-100-90-80-70-60-50-40-30-20-10T H D +N (d B )Input Level (dBFS)THD+N vs Input LevelBD34301EKVWiring ImpedanceCurrent SegmentCurrent Segment Current SegmentMinimize clock skew and optimize slew rateSound quality improvement effect: Increased realism and resolution alongwith bassClockCurrent SegmentCurrent SegmentCurrent SegmentCurrent Segment time Level (L→H)Fastest ClockClock WaveformSlowest ClockMinimize clock skew between current segmentsMaterial of bonding wires connecting the chip to the lead frameMinimize stress on chips in IC packagesAu CuSound improvement effect: More natural reverberation , with a more delicateinstrumental toneSelect the best bonding wires material for the device because its material that connecting the device to the lead frame is affected the sound qualityBonding WireSelect the IC package and wafer processing method that minimize stress . At the same time, adopt a completelysymmetrical chip layout for the current segment circuit.Sound improvement effect: Reduced sound peculiarities, resulting in amore natural soundCurrent OutputPins Current OutputPinsChipIC PackageCompletely symmetricalLch Rch 電流セグメントLchRchCurrent Segment Examples of Sound Quality Improvement Effects Based on Sound Quality Design Tech.P . 10© 2021 ROHM Co., Ltd. Sales InformationThe BD34301EKV enables evaluation and adoption for a wide range of customerMUS-IC TM Sales⚫Supporting documents required for evaluation are now available on ROHM’s website:https:///products/audio-video/audio-converters/audio-dacs/bd34301ekv-product/documents⚫An evaluation board (BD34301EKV-EVK-001) is also available together with IC through online distributors Part No: BD34301EKVSales Launch Date: From December 2020Reference Price:$80.5 /pc. (excluding tax)Production Status: In mass production Evaluation Board Sales Part No: BD34301EKV-EVK-001Sales Launch Date: From February 2021Reference Price: Please refer to each online distributor websitePlease consider the BD34301EKV MUS-IC TM 32bit D/A converter IC for your next design Electronic Components and Parts Search | DigiKey ElectronicsSearch results for: bd34301ekv ROHM Semiconductor –Mouserbd34301ekv -Search Results | Farnell DE© 2021 ROHM Co., Ltd.Notes•The content specified herein is for the purpose of introducing ROHM’s products (hereinafter “Products”).•If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request.•Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage.•The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products.•ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties.•ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information.•If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law.•The content specified in this document is correct as of April 2021.© 2021 ROHM Co., Ltd.P. 12。

Vigor2920 系

Vigor2920 系列雙WAN安全防護路由器快速安裝手冊版本: 1.0韌體版本: V3.3.3.1日期: 19/07/2010因手冊更新無法及時通知用戶，請隨時連上居易網站，取得最新的手冊內容。

此出版物所包含資訊受版權保護。

交貨以及其他詳細資料的範圍若有變化，恕不預先通知。

商標本手冊內容使用以下商標:z Microsoft為微軟公司註冊商標z Windows視窗系列，包括Windows 95, 98, Me, NT, 2000, XP 以及其Explorer均屬微軟公司商標z Apple以及Mac OS均屬蘋果電腦公司的註冊商標z其他產品則為各自生產廠商之註冊商標安全說明和保障安全說明z在設置前請先閱讀安裝說明。

z由於路由器是複雜的電子產品，請勿自行拆除或是維修本產品。

z請勿自行打開或修復路由器。

z請勿把路由器置於潮濕的環境中，例如浴室。

z請將本產品放置在足以遮風避雨之處，適合溫度在攝氏5度到40度之間。

z請勿將本產品暴露在陽光或是其他熱源下，否則外殼以及零件可能遭到破壞。

z請勿將LAN網線置於戶外，以防電擊危險。

z請將本產品放置在小孩無法觸及之處。

z若您想棄置本產品時，請遵守當地的保護環境的法律法規。

保固自使用者購買日起二年內為保固期限，請將您的購買收據保存二年，因為它可以證明您的購買日期。

當本產品發生故障乃導因於製作及(或)零件上的錯誤，只要使用者在保固期間內出示購買證明，居易科技將採取可使產品恢復正常之修理或更換有瑕疵的產品(或零件)，且不收取任何費用。

居易科技可自行決定使用全新的或是同等價值且功能相當的再製產品。

下列狀況不在本產品的保固範圍內：(1)若產品遭修改、錯誤(不當)使用、不可抗力之外力損害，或不正常的使用，而發生的故障；(2) 隨附軟體或是其他供應商提供的授權軟體；(3) 未嚴重影響產品堪用性的瑕疵。

Moxa NPort S9450I系列产品说明书

P/N: 1802094500010*1802094500010*NPort S9450I Series Quick Installation GuideEdition 1.0, February 2017Technical Support Contact Information/support Moxa Americas:Toll-free: 1-888-669-2872Tel: 1-714-528-6777Fax: 1-714-528-6778 Moxa China (Shanghai office): Toll-free: 800-820-5036 Tel: +86-21-5258-9955 Fax: +86-21-5258-5505 Moxa Europe:Tel: +49-89-3 70 03 99-0Fax: +49-89-3 70 03 99-99 Moxa Asia-Pacific: Tel: +886-2-8919-1230 Fax: +886-2-8919-1231 Moxa India:Tel: +91-80-4172-9088Fax: +91-80-4132-10452017 Moxa Inc. All rights reserved.OverviewThe NPort S9450I series combines a substation-grade 4-portRS-232/422/485 serial ports device server with a full-function managed Ethernet switch by integrating a combination of fiber and copper Ethernet ports, allowing you to easily install, manage, and maintain the products and serial devices.Package ChecklistBefore installing the NPort S9450I, verify that the package contains the following items:• 1 NPort S9450I combo switch/serial device server• 1 CN20070 connection CBL: RJ45/10P/F9, 150 cm• 1 DK/DC 50x131 mm DIN-rail kit•Documentation and software CD•Quick installation guide•Warranty cardOptional Accessories (must be ordered separately) •Wall-mount kit WK-51-01Please notify your sales representative if any of the above items are missing or damaged.Hardware IntroductionThe NPort S9450I integrates five Ethernet ports and four male DB9 ports for the RS-232/422/485 serial port.The NPort S9450I-2S/NPort S9450I-2M integrates two fiber ports, three Ethernet ports, and four male DB9 ports for the RS-232/422/485 serial port.Reset Button—Hold the Reset button for five seconds to load the factory default settings: Use a pointed object, such as a straightened paper clip or toothpick, to press the reset button. This will cause the Ready LED to blink on and off. The factory defaults will be loaded once the Ready LED stops blinking (after about five seconds). At this point, you should release the reset button.LED Indicators—The NPort S9450I’s front panel contains some LED indicators as described in the following table.Type Color MeaningPW 1 Green Power 1 inputPW 2 Green Power 2 inputReady Red Steady On: Power is on, and the NPort isbooting up.Blinking: Indicates a LAN-IP conflict, or theDHCP or BOOTP server did not respondproperly.Green Steady On: Power is on, and the NPort isfunctioning normally.Blinking: The device server has been locatedby the DSU's (Device Search Utility) locationfunction.Off Power is off, or a power error condition exists. Master Green Steady On: When the NPort is the Master ofthis Turbo Ring.Blinking: When the NPort is the Ring Master ofthis Turbo Ring and the Turbo Ring isdisconnected.Coupler Green When the NPort enables the coupling functionto form a backup pathE1…E5Link Green Steady On: The Ethernet port is active.Blinking: When the Ethernet port istransmitting/receiving data.Speed Green Steady On: 100 Mbps Ethernet connection.Yellow Steady On: 10 Mbp Ethernet connection.TX1…TX4 Green The serial port is transmitting data.RX1…RX4 Amber The serial port is receiving data. Hardware Installation ProcedureSTEP 1: After removing the NPort S9450I from the box, attach the power adapter.STEP 2: Connect the NPort S9450I to a network. Use a standard straight-through Ethernet cable to connect to a hub or switch. When setting up or testing the NPort S9450I, you might find it convenient to connect it directly to your computer’s Ethernet port. In this case, use a crossover Ethernet cable.STEP 3: Connect the NPort S9450I’s serial port to a serial device. STEP 4: Mount the NPort S9450I to either a wall or DIN-rail, as described below.DIN-Rail MountingThe aluminum DIN-rail attachment plate should already be fixed to the back panel of the NPort S9450I when you take it out of the box. If you need to reattach the DIN-rail attachment plate to the NPort S9450I, makesure the stiff metal spring is situated towards the top as shown in the figures below.STEP 1: If the spring-loadedbracket is locked in place,push the recessed button torelease it. Once released, youshould feel some resistancefrom the spring as you slidethe bracket up and down a fewmillimeters in each direction.STEP 2:Insert the top of the DIN rail into the top slots on the DIN-rail attachment plate. STEP 3:The DIN-rail attachment unit will snap into place as shown in the following illustration.To remove the Moxa NPort S9450I switch from the DIN rail, use a screwdriver to push down the spring-loaded bracket until it locks in place, as shown in the following diagram. Next, rotate the bottom of the switch upwards and then remove the switch from the DIN rail.Wall Mounting (optional)For added convenience, the NPort S9450I can be wall mounted as illustrated below.STEP 1: Remove thealuminum DIN-railattachment plate from theNPort S9450I’s rear panel,and then attach thewall-mount plates with six M3screws, as shown on theright.STEP 2: Mounting the NPort S9450I to a wall requiresfour screws. Use the NPort S9450I with the wall-mountplates attached as a guide to mark the correct locationsfor the four screws. The heads of the screws should beless than 6.0 mm in diameter, and the shafts should beless than 3.5 mm in diameter, as shown on the right.NOTE Test the screw’s head and shank size by inserting the screw into one of the keyhole-shaped apertures of the wall-mounting plates before you put the screws into the wall.DO NOT screw the screws all the way in—leave a space of about 2 mm to allow room for sliding the wall-mount panel between the wall and the screws.STEP 3: After the screws are fixed into the wall, insert the four screw heads through the large opening of the keyhole-shaped apertures, and then slide the NPort S9450I downwards. Tighten the four screws for added stability. Software Installation InformationThe documentation and software CD contains the user’s manual, driver, and the Device Search Utility (DSU). Insert the CD into your computer and follow the on-screen instructions. Please refer to the user’s manual for additional details on using the Device Search Utility and driver. Pin Assignments and Cable Wiring DB9 Male RS-232/422/485 Port PinoutsPinRS-232 RS-422/485-4w RS-485-2w 1DCD TxD-(A) – 2RxD TxD+(B) – 3TxD RxD+(B) Data+(B) 4DTR RxD-(A) Data-(A) 5GND GND GND 6DSR – – 7RTS – – 8CTS – – 9 – – –Wiring the Relay ContactThe NPort S9450I has two sets of relay outputs: relay 1 and relay 2. Each relay contact consists of two contacts of the terminal block on the NPort S9450I’s top panel. Refer to the next section for detailed instructions on how to connect the wires to the terminal block connector and how to attach the terminal block connector to the terminal block receptor. The two contacts used to connect the relay contacts work as follows (seeillustration below):The fault circuit will open if1. A relay warning event is triggered, or2. The NPort S9450I is the Master of this TurboRing, and the Turbo Ring is disconnected, or3. Start-up fails.If none of these three conditions are met, the faultcircuit will remain closed. Wiring the Digital InputsThe NPort S9450I unit has two sets of digital inputs: DI 1 and DI 2. Each DI consists of two contacts of the 8-pin terminal block connector on the NPort S9450I’s top panel.Take the following steps to wire the digital inputs:1. Insert the negative (ground) or positive DI wiresinto the terminals.2. To keep the DI wires from getting loose, use asmall flat-blade screwdriver to tighten thewire-clamp screws on the front of the terminalblock connector.3. Insert the plastic terminal block connectorprongs into the terminal block receptor, which islocated on the NPort S9450I’s top panel. Wiring the Redundant Power InputsThe NPort S9450I unit has two sets of power inputs: power input 1 and power input 2.Take the following steps to wire the redundant power inputs:1. Insert the negative/positive DC wires into the N-and L+ terminals.2. To keep the DC wires from pulling loose, use asmall flat-blade screwdriver to tighten thewire-clamp screws on the front of the terminalblock connector.3. Insert the plastic terminal block connectorprongs into the terminal block receptor, which islocated on the NPort S9450I’s top panel.。

MMSZ4xxxT1G系列和SZMMSZ4xxxT1G系列零点电阻电源器件的商品说明书

MMSZ4686T1G MMSZ4686T1G.MMSZ4xxxT1G Series, SZMMSZ4xxxT1G Series Zener Voltage Regulators 500 mW, Low I ZT SOD−123 Surface MountThree complete series of Zener diodes are offered in the convenient, surface mount plastic SOD−123 package. These devices provide a convenient alternative to the leadless 34−package style.Features•500 mW Rating on FR−4 or FR−5 Board•Wide Zener Reverse V oltage Range − 1.8 V to 43 V•Low Reverse Current (I ZT) − 50 m A•Package Designed for Optimal Automated Board Assembly •Small Package Size for High Density Applications•ESD Rating of Class 3 (>16 kV) per Human Body Model•SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable•These Devices are Pb−Free and are RoHS Compliant*Mechanical Characteristics:CASE:V oid-free, transfer-molded, thermosetting plastic case FINISH:Corrosion resistant finish, easily solderableMAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 SecondsPOLARITY:Cathode indicated by polarity band FLAMMABILITY RATING:UL 94 V−0MAXIMUM RATINGSRating Symbol Max Units Total Power Dissipation on FR−5 Board,(Note 1) @ T L = 75°CDerated above 75°C P D5006.7mWmW/°CThermal Resistance, (Note 2) Junction−to−Ambient R q JA340°C/WThermal Resistance, (Note 2) Junction−to−Lead R q JL150°C/WJunction and Storage Temperature Range T J, T stg−55 to+150°CStresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected.1.FR−5 = 3.5 X 1.5 inches, using the minimum recommended footprint.2.Thermal Resistance measurement obtained via infrared Scan Method.*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.Cathode AnodeSee specific marking information in the device marking column of the Electrical Characteristics table on page 3 of this data sheet.DEVICE MARKING INFORMATIONSOD−123CASE 425STYLE 1Device Package Shipping†ORDERING INFORMATIONMARKING DIAGRAM†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our T ape and Reel Packaging Specifications Brochure, BRD8011/D.MMSZ4xxxT1G SOD−123(Pb−Free)3,000 /Tape & ReelMMSZ4xxxT3G SOD−123(Pb−Free)10,000 /Tape & Reel xx= Device Code (Refer to page 3)M= Date CodeG= Pb−Free Package(Note: Microdot may be in either location)1SZMMSZ4xxxT1G SOD−123(Pb−Free)3,000 /Tape & ReelSZMMSZ4xxxT3G SOD−123(Pb−Free)10,000 /Tape & ReelELECTRICAL CHARACTERISTICS (T A = 25°C unless otherwise noted, V F = 0.9 V Max. @ I F = 10 mA)Symbol ParameterV Z Reverse Zener Voltage @ I ZTI ZT Reverse CurrentI R Reverse Leakage Current @ V RVR Reverse VoltageI F Forward CurrentV F Forward Voltage @ I FProduct parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions.ELECTRICAL CHARACTERISTICS (T A = 25°C unless otherwise noted, V F = 0.9 V Max. @ I F = 10 mA)Device*DeviceMarkingZener Voltage (Note 3)Leakage CurrentV Z (Volts)@ I ZT I R @ V RMin Nom Max m A m A VoltsMMSZ4678T1G CC 1.71 1.8 1.89507.51 MMSZ4679T1G CD 1.90 2.0 2.105051 MMSZ4680T1G CE 2.09 2.2 2.315041 MMSZ4681T1G CF 2.28 2.4 2.525021 MMSZ4682T1G CH 2.565 2.7 2.8355011 MMSZ4683T1G CJ 2.85 3.0 3.15500.81 MMSZ4684T1G CK 3.13 3.3 3.47507.5 1.5 MMSZ4685T1G CM 3.42 3.6 3.78507.52 MMSZ4686T1G CN 3.70 3.9 4.105052 MMSZ4687T1G CP 4.09 4.3 4.525042 SZMMSZ4687T1G CG6 4.09 4.3 4.525042 MMSZ4688T1G CT 4.47 4.7 4.9450103 MMSZ4689T1G CU 4.85 5.1 5.3650103 MMSZ4690T1G/T3G CV 5.32 5.6 5.8850104 MMSZ4691T1G CA 5.89 6.2 6.5150105 MMSZ4692T1G CX 6.46 6.87.145010 5.1 MMSZ4693T1G CY7.137.57.885010 5.7 MMSZ4694T1G CZ7.798.28.61501 6.2 MMSZ4695T1G DC8.278.79.14501 6.6 MMSZ4696T1G DD8.659.19.56501 6.9 MMSZ4697T1G DE9.501010.505017.6 MMSZ4698T1G DF10.451111.55500.058.4 MMSZ4699T1G DH11.401212.60500.059.1 MMSZ4700T1G DJ12.351313.65500.059.8 MMSZ4701T1G DK13.301414.70500.0510.6 MMSZ4702T1G DM14.251515.75500.0511.4 MMSZ4703T1G†DN15.201616.80500.0512.1 MMSZ4704T1G DP16.151717.85500.0512.9 MMSZ4705T1G DT17.101818.90500.0513.6 MMSZ4706T1G DU18.051919.95500.0514.4 MMSZ4707T1G DV19.002021.00500.0115.2 MMSZ4708T1G DA20.902223.10500.0116.7 MMSZ4709T1G DX22.802425.20500.0118.2 MMSZ4710T1G DY23.752526.25500.0119.0 MMSZ4711T1G†EA25.652728.35500.0120.4 MMSZ4712T1G EC26.602829.40500.0121.2 MMSZ4713T1G ED28.503031.50500.0122.8 MMSZ4714T1G EE31.353334.65500.0125.0 MMSZ4715T1G EF34.203637.80500.0127.3 MMSZ4716T1G EH37.053940.95500.0129.6 MMSZ4717T1G EJ40.854345.15500.0132.6 3.Nominal Zener voltage is measured with the device junction in thermal equilibrium at T L = 30°C ±1°C.*Include SZ-prefix devices where applicable.†MMSZ4703 and MMSZ4711 Not Available in 10,000/Tape & ReelTYPICAL CHARACTERISTICSV Z , T E M P E R A T U R E C O E F F I C I E N T (m V /C )°θV Z , NOMINAL ZENER VOLTAGE (V)Figure 1. Temperature Coefficients (Temperature Range −55°C to +150°C)V Z , T E M P E R A T U R E C O E F F I C I E N T (m V /C )°θ100101V Z , NOMINAL ZENER VOLTAGE (V)Figure 2. Temperature Coefficients (Temperature Range −55°C to +150°C)1.21.00.80.60.40.20T, TEMPERATURE (5C)Figure 3. Steady State Power Derating P p k, P E A K S U R G E P O W E R (W A T T S )PW, PULSE WIDTH (ms)Figure 4. Maximum Nonrepetitive Surge PowerP D , P O W E R D I S S I P A T I O N (W A T T S )V Z , NOMINAL ZENER VOLTAGEFigure 5. Effect of Zener Voltage onZener ImpedanceZ Z T , D Y N A M I C I M P E D A N C E ()ΩTYPICAL CHARACTERISTICSC , C A P A C I T A N C E (p F )V Z , NOMINAL ZENER VOLTAGE (V)Figure 6. Typical Capacitance 1000100101V Z , ZENER VOLTAGE (V)1001010.10.01I Z , Z EN E R C U R R E N T (m A )V Z , ZENER VOLTAGE (V)1001010.10.01I R , L E A K A G E C U R R E N T (A )μV Z , NOMINAL ZENER VOLTAGE (V)Figure 7. Typical Leakage Current10001001010.10.010.0010.00010.00001I Z , Z E N E R C U R R E N T (m A )Figure 8. Zener Voltage versus Zener Current(V Z Up to 12 V)Figure 9. Zener Voltage versus Zener Current(12 V to 91 V)SOD−123CASE 425−04ISSUE GDATE 07 OCT 2009SCALE 5:1NOTES:1.DIMENSIONING AND TOLERANCING PER ANSIY14.5M, 1982.2.CONTROLLING DIMENSION: INCH.DIM MIN NOM MAXMILLIMETERSINCHESA0.94 1.17 1.350.037A10.000.050.100.000b0.510.610.710.020c1.600.150.055D 1.40 1.80E 2.54 2.69 2.840.100---3.680.140L0.253.860.0100.0460.0020.0240.0630.1060.1450.0530.0040.0280.0710.1120.152MIN NOM MAX3.56H E---------0.006------------GENERICMARKING DIAGRAM**For additional information on our Pb−Free strategy and solderingdetails, please download the ON Semiconductor Soldering andMounting Techniques Reference Manual, SOLDERRM/D.SOLDERING FOOTPRINT**This information is generic. Please refer to device datasheet for actual part marking. Pb−Free indicator, “G” ormicrodot “ G”, may or may not be present.XXX= Specific Device CodeM= Date CodeG= Pb−Free Package1STYLE 1:PIN 1. CATHODE2. ANODE0.910.036ǒmminchesǓSCALE 10:1------q001010°°°°(Note: Microdot may be in either location) MECHANICAL CASE OUTLINEPACKAGE DIMENSIONSON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor theON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.PUBLICATION ORDERING INFORMATIONTECHNICAL SUPPORTNorth American Technical Support:Voice Mail: 1 800−282−9855 Toll Free USA/Canada Phone: 011 421 33 790 2910LITERATURE FULFILLMENT :Email Requests to:*******************ON Semiconductor Website: Europe, Middle East and Africa Technical Support:Phone: 00421 33 790 2910For additional information, please contact your local Sales RepresentativeMMSZ4686T1G MMSZ4686T1G.。

LG KE998 用户手册说明书

用户手册用户手册恭喜您购买此款功能先进的 LG KE998 手机，它采用了最新的数字移动通信技术，专注于为您提供便利的操作。

LG KE998LG KE998 | 用户手册用户手册4设置开始了解您的手机...............8安装 SIM 卡和电池.............10存储卡 .......................12菜单图 .......................13待机屏幕触摸屏提示....................14快捷键 .......................15状态栏 .......................16快捷菜单......................17基本功能呼叫 .......................18 拨打电话 ....................18 从电话本拨打电话 ............18 接听和拒绝电话 ..............18 来电选项 ....................19 调节通话音量 ................19 快速拨号 ....................20 拨打第二个电话 ..............20 关闭双音多频 ................20 查看通话记录 ................20 使用呼叫转接 ................21 使用呼叫限制 ................21 更改常用通话设置 ............22联系人 .......................23 搜索联系人 ..................23 添加新联系人 . (23)内容联系人选项 (24)创建群组 (24)更改联系人设置 (25)查看信息 (25)号簿更新 ....................25 网络查询 . (25)信息 (26)信息 (26)发送信息 (26)输入文本 (26)T9 预测 (27)Abc 模式 (27)拼音输入法 (27)笔划输入法 (27)键盘 (28)手写识别 (28)设置电子邮件 (28)接收电子邮件 (29)使用新帐户发送电子邮件 (29)更改电子邮件设置 (30)信息文件夹 (30)管理信息 (31)使用模板 (32)使用图释 (32)更改文本信息设置 (32)更改多媒体信息设置 (33)更改其它设置 (33)网络移动梦网 (34)访问网页 (34)添加并访问书签 (34)已保存页面 (34)访问保存的页面 (35)查看浏览器记录 (35)更改网络浏览器设置 (35)将手机用作调制解调器 (35)中国移动服务 (36)无线音乐 (36)游戏社区 (36)新闻天气 (36)飞信Fetion (36)手机视频 (36)号簿管家 (36)在线理财 (36)新业务推荐 (37)我的梦网 (37)移动梦网 (37)SIM卡应用. (37)客户服务 (38)心机服务指南 (38)掌上营业厅 (38)客户服务热线 (38)客户经理 (38)我的梦网 (38)客户服务设置 (38)快讯 .......................39高级功能相机 (40)快速拍照 (40)拍照后 (40)了解取景器 (41)使用闪光灯 (42)使用快速设置 (42)调整对比度 (43)选择拍摄类型 (43)使用连拍模式 (43)拍摄全景照片 (44)使用高级设置 (44)更改图像大小 (45)选择色调 (46)查看保存的照片 (46)查看照片详细信息 (47)摄像机 (48)快速摄像 (48)拍摄视频后 (48)了解取景器 (49)调整对比度 (50)使用高级设置 (50)更改视频大小 (51)选择色调 (52)观看保存的视频 (52)在电视上观看视频 (53)5照片和视频....................54 查看照片和视频 ..............54 查看视频或照片时使用缩放 ....54 观看视频时调节音量 ..........54 从视频中拍摄图像 (54)查看视频或照片的详细信息 (55)从图片库发送照片或视频 (55)以幻灯片显示方式查看照片 (56)将照片设为墙纸 (56)编辑照片 (57)为照片添加文本 (58)为照片添加效果 (58)变形照片 (59)为照片添加颜色 (59)交换照片中的颜色 (59)多媒体 (60)我的图像 (60)“我的图像”选项菜单 (60)发送照片 (60)使用图像 (61)管理图像 (61)删除图像 (61)移动或复制图像 (62)标记或去除标记图像 (62)创建幻灯片 (62)查看内存状态 (63)我的声音 (63)内容使用声音 ....................63 我的视频 ....................63 观看视频 ....................63 暂停视频时使用选项 . (64)编辑视频剪辑 ................64 发送视频剪辑 ................64 将视频剪辑用作来电铃声 ......64 使用视频选项菜单 ............64 百宝箱 ......................65 我的应用程序 ................65 连接百宝箱 ..................65 手机证券 ....................65 音乐随身听 ..................65 飞信 .......................66 玩游戏 ......................66 快讯文件夹 ..................66 Flash 内容 ..................66 查看 SWF 文件 ...............66 查看 SWF 文件时使用选项 .....66 文档 .......................66 将文件传输到手机 ............66 查看文件 ....................67 外部存储器 ..................67 其它 .......................67 Muvee 工作室 ................67 创建电影 .. (68)音乐 .......................686LG KE998LG KE998 | 用户手册用户手册播放歌曲 (68)创建播放列表 (69)编辑播放列表 (69)删除播放列表 (70)视频播放列表 (70)语音备忘录 (71)录制语音备忘录 (71)发送语音备忘录 (71)FM收音机 (71)搜索电台 (72)编辑频道 (72)全部重设 (72)收听收音机 (73)管理功能公文包 (74)将事件添加到日程表中 (74)更改默认日历视图 (74)向任务列表添加项目 (75)更改任务项 (75)使用日期计算器 (75)设置闹钟 (76)添加备忘录 (76)使用计算器 (76)向世界时钟添加城市 (77)单位换算器 (77)电子词典 (77)PC 同步 (78)在计算机上安装 LG PC 套件 (78)连接手机和 PC (78)备份和还原手机信息 (78)在 PC 上查看手机文件 (78)同步电话本 (79)将手机用作 Mass Storage 设备 79 DivX Converter (80)设置更改屏幕设置 (82)个性化情景模式 (82)更改手机设定 (83)更改连接设置 (83)使用内存管理器 (84)使用飞行模式 (84)使用蓝牙发送和接收文件 (84)与其它蓝牙设备配对 (85)使用蓝牙耳机 (86)配件 (88)网络服务 (90)技术参数 (90)准则关于安全有效使用手机的准则 (91)7从待机屏幕选择并选择手机设定。

OMRON G3VM-41BR ER MOS FET Relays说明书

G3VM-41BR/ER Higher power, 3.5-A switching with a 40-Vload voltage, DIP package.Low 30 mΩ ON Resistance.•Continuous load current of 3.5 A. (Connection C: 7 A)•Switches minute analog signals.•Dielectric strength of 2,500 Vrms between I/O.■Application Examples■Terminal Arrangement/Internal Connections■List of Models*The AC peak and DC value are given for the load voltage.RoHS compliant Note: The actual product is marked differently from theimage shown here.•Communication equipment•Test & Measurement equipment•Security equipment•Factory Automation equipment•Power circuitOMRON logoNote: The actual product is marked differently from the image shown here. Package type Contact form TerminalsLoad voltage(peak value) *ModelMinimum package quantityNumber per stick Number per tape and reel DIP61a(SPST-NO)PCB terminals40 VG3VM-41BR50---Surface-mounting terminalsG3VM-41ERG3VM-41ER (TR)---1,50012G3VM-41BR/ERMOS FET RelaysG3VM-41BR/ER■Recommended Operating ConditionsUse the G3VM under the following conditions so that the Relay will operate properly.■Engineering Data■Safety Precautions•Refer to "Common Precautions" for all G3VM models.ItemSymbol MinimumTypical MaximumUnit Load voltage (AC peak/DC)V DD ------32V Operating LED forward current I F 51025mA Continuous load current (AC peak/DC)I O ------ 3.5AOperating temperatureTa−20 --- 65 °CLED forward current vs.Ambient temperatureContinuous load current vs.Ambient temperatureLED forward current vs.LED forward voltageContinuous load current vs.On-state voltageOn-state resistance vs.Ambient temperatureTrigger LED forward current vs. Ambient temperatureTurn ON, Turn OFF time vs.LED forward currentTurn ON, Turn OFF time vs.Ambient temperatureCurrent leakage vs.Ambient temperatureAmbient temperature Ta (°C)L E D f o r w a r d c u r r e n t I F (m A )I F - Ta03010204050-40100806040200-20I O - Ta-4010080 60 40 20-2000105Ambient temperature Ta (°C)C o n t i n u o u s l o a d c u rr e n t I O (A )I F - V FLED forward voltage V F (V)L E D f o r w a r d c u r r e n t I F (m A )0.0100.51 1.52I O - V ON-0.1-0.050.050.1-4-2-3-102134On-state voltage V ON (V)C o n t i n u o u s l o a d c u r r e nt I O (A )R ON - Ta30010204050Ambient temperature Ta (°C)O n -s t a t e r e s i s t a n c e R O N (m Ω)I FT - Ta-40-2010080604020012Ambient temperature Ta (°C)T r i g g e r L E D f o r w a r d c u r r e n t I F T (m A )t ON , t OFF - I F1011000.010.1110100LED forward current I F (mA)T u r n O N , T u r n O F F t i m e t O N , t O F F (m s )t ON , tOFF - Ta-40-20100806040200.011001010.1Ambient temperature Ta (°C)T u r n O N , T u r n O F F t i m e t O N , t O F F (m s)I LEAK - Ta-40-20100806040200.011001010.1Ambient temperature Ta (°C)C u r r e n t l e a k a g e I L E A K (n A )■Dimensions(Unit: mm) Note: The actual product is marked differently from theimage shown here.PCB Dimensions (Bottom View)Actual Mounting Pad Dimensions(Recommended Value, Top View)Note: The actual product is marked differently from the image shown here.+0.1−0.05PCB TerminalsWeight: 0.4 gSurface-mounting TerminalsWeight: 0.4 g• Application examples provided in this document are for reference only. In actual applications, confirm equipment functions and safety before using the product.• Consult your OMRON representative before using the product under conditions which are not described in the manual or applying the product to nuclear control systems, railroad systems, aviation systems, vehicles, combustion systems, medical equipment, amusement machines, safety equipment, and other systems or equipment that may have a serious influence on lives and property if used improperly. Make sure that the ratings and performance characteristics of the product provide a margin of safety for the system or equipment, and be sure to provide the system or equipment with double safety mechanisms.Cat. No. K138-E1-020412(0412)(O)Note: Do not use this document to operate the Unit. OMRON CorporationELECTRONIC AND MECHANICAL COMPONENTS COMPANY Contact: /ecb。

K9K4G08Q0M资料

GENERAL DESCRIPTION
Offered in 512Mx8bit or 256Mx16bit, the K9XXGXXXXM is 4G bit with spare 128M bit capacity. Its NAND cell provides the most cost-effective solution for the solid state mass storage market. A program operation can be performed in typical 300µs on the 2112byte(X8 device) or 1056-word(X16 device) page and an erase operation can be performed in typical 2ms on a 128K-byte(X8 device) or 64K-word(X16 device) block. Data in the data page can be read out at 50ns cycle time per byte(30ns, only X8 3.3v device) or word(X16 device). The I/O pins serve as the ports for address and data input/output as well as command input. The on-chip write controller automates all program and erase functions including pulse repetition, where required, and internal verification and margining of data. Even the write-intensive systems can take advantage of the K9XXGXXXXM′s extended reliability of 100K program/erase cycles by providing ECC(Error Correcting Code) with real time mapping-out algorithm. The K9XXGXXXXM is an optimum solution for large nonvolatile storage applications such as solid state file storage and other portable applications requiring non-volatility. An ultra high density solution having two 4Gb stacked with two chip selects is also available in standard TSOPI package.

LG-T325 使用手冊说明书

繁體中文简体中文E N G L I S H 使用手冊用户手册User GuideLG-T325P/N : MFL67010405 (1.0)Bluetooth QD ID B016937安全及有效使用準則 (4)安裝智能咭和手機電池 (9)安裝智能咭 (9)插圖 (9)手機部份 (10)使用觸控屏幕 (11)觸控屏幕提示 (11)控制觸控屏幕 (11)桌面 (12)功能表屏幕 (13)通話功能 (14)撥打電話 (14)透過通訊錄撥打電話 (14)接聽來電和拒接來電 (14)變更一般通話設定 (15)通訊錄 (15)搜尋通訊錄 (15)新增通訊錄 (16)變更通訊錄設定 ................16訊息 . (17)發送訊息 (17)輸入文字 (17)手寫識別 (17)設定您的電子郵件 (17)變更文字訊息設定 (18)變更多媒體訊息設定 (18)社交網絡服務 (SNS) (19)Facebook（SNS 續） (19)相機 (19)快速拍照 (19)拍照之後 (20)使用進階設定 (20)視像攝錄機 (21)快速製作影片 (21)製作影片之後 (21)使用進階設定 (22)音樂 (22)將音樂傳送至手機 (23)管理檔案 (23)遊戲和應用程式 (23)FM 收音機 (23)搜尋電台 (24)目錄應用程式 (24)新增事件至日曆 (24)設定鬧鐘 (24)語音備忘錄 (24)使用計算機 (24)轉換單位 (25)PC Suite (25)在電腦上安裝 LG PC Suite . (25)網絡功能 (25)存取網絡 (25)存取 Google 服務 (26)設定 (26)個人化情景模式 (26)變更手機設定 (26)變更連接設定 (26)使用藍芽發送和接收檔案 ... (26)同其他藍芽裝置配對 (27)Wi-Fi (28)軟體更新 (29)手機軟體更新 ....................29配件 . (30)技術數據 (31)疑難排解 (32)•請勿拆開此裝置。

Redmi 9A 手提電話規格表说明书

Product Information SheetReference:____________________手提電話 / Mobile Handset牌子/ Brand Redmi型號 / Model Redmi 9A原產地 /Place of manufacture中國 / China網絡頻率或操作頻率或頻帶 / Network frequency or operating frequency or band 4G FDD-LTE: B1 (2100 MHz), B2 (1900MHz), B3 (1800 MHz), B4 (1700 MHz), B5 (850 MHz), B7 (2600 MHz), B8 (900 MHz), B20 (800 MHz),B28(700 MHz)4G TDD-LTE: B38 (2600 MHz), B40 (2300 MHz) , B41 (2500 MHz)3G WCDMA: B1 (2100MHz), B2 (1900 MHz), B4 (1700 MHz), B5 (850 MHz), B8 (900 MHz)2G GSM: B2 (1900 MHz), B3 (1800 MHz), B5 (850 MHz), B8 (900 MHz)主要功能 / Key features ∙ 6.53吋 HD+ 水滴螢幕 3D 曲面一體設計∙5000mAh 超大容量電池支援10W快充∙1300萬像素 AI 鏡頭支援魔幻萬花筒影片模式∙三卡槽設計支援雙Sim卡 + MicroSD卡∙ 6.53” HD+ Dot Drop display 3D Unibody Design∙5000mAh (typ) High-capacity Battery 10W Fast Charge ∙13MP AI Camera Kaleidoscope Video Mode∙ 3 Card Slots Dual Sim + MicroSD作業系統 / Operating system MIUI V12 (based on Android 10)系統記憶體 / Internal memory2GB RAM + 32 GB ROMSIM card種類 / SIM card 2 Nano SIM slot + 1 Micro SD slot支援記憶卡的種類及容量/ Type and storage capacity of support memory card 種類 / Type MicroSD 最大容量 /Maximumcapacity256GB螢幕 / Display 6.53吋/ 6.53 inch數據傳輸/網絡連接制式 /Data transfer/networkconnectivity protocolGSM/GPRS/EDGE/WCDMA/HSDPA/HSUPA/LTE以像數列出的該相機鏡頭解像度 (如電話具備內置相機) / Resolution of the camera in terms of pixels (where the phone has a built-in camera)後置鏡頭 / Rear Camera：1300萬像素 / 13MP前置鏡頭 / Front Camera：500萬像素鏡頭/ 5MP Camera配套 / Packaging List 1 x 手機主機 / Handset1 x Micro-USB數據線 / Micro-USBcable 1 x 英規充電器 / USB power adaptor1 x 印刷品（內含說明書）/ User Guide 1 x SIM 插針 / SIM Insertion Tool產品價格/ Price 協議價格請參照銷售備忘錄/發票Agreed as per Sales Memo/Invoice附加費 / Additional Delivery Charge 指定地區/ 地址 (如離島) 有可能需付額外送貨附加費Additional delivery charge may be added for specific area/ location (e.g. outlying island)保修人身份 / Identity of repair service provider小米香港授權專屬服務中心保修地址 / Repair service address 小米香港授權專屬服務中心營業時間：11:00-20:00 （星期日及公眾假期休息）電話號碼：+852 3104 1078地址信息：香港九龍旺角彌敦道610號荷里活商業中心20樓03,05-06室小米香港電話客服:查詢號碼: 3001-1888服務時間 09:00-18:00 週一至週日含節假日Xiaomi Hong Kong Exclusive Service CenterBusiness hours:Mon to Sat: 11:00-20:00 (Except Sunday and Public Holidays)Hotline: +852 3104 1078Address: Room 03, 05-06, 20/F, Hollywood Plaza, 610 Nathan Road, Mongkok Xiaomi Hong Kong Customer Service Hotline:Hotline: 3001-1888Business Hours: 09:00-18:00, Mon to Sun include public holidays換貨政策 / Exchange policy 你可於銷售單日期起計7天內(如手機及配件遇到產品故障)，憑有效銷售發票之正本，非人為損壞的情況下，由小米授權服務中心檢測確定後，依據客戶的選擇，免費進行換貨或者維修服務。

Philips S399 Champagne 4G手机说明书

S399ChampagneTDD-LTE / TD-SCDMA / GSMCTS399CMPEverything’s superfast with 4GMake the most of 4G with Philips S399. It supports TDD-LTE, TD-SCDMA and GSM. Integrating a 5-inch HD screen, a 1.2GHz quad core processor and Android 4.3, it’s the perfect phone for your 4G lifestyle.Superb connectionTriple-mode(TDD, TD-SCDMA and GSM)Bright sparks, fast speeds5" HD IPS display for rich viewing detailsMaximized performance with 1.2GHz quad core processorAndroid 4.3Extras in lifeQuality shots with 8 megapixel autofocus camera with ﬂashHighlights Triple-mode (TTG)Your new Philips mobile phone keeps you simultaneously connected to the GSM and either TDD-LTE or TD-SCDMA networks. So get set to enjoy even wider mobile coverage via just one phone.5" HD IPS displayYour Philips mobile phone comes endowed with an awesome 5" high deﬁnition display that brings you truly vibrant colors and razor-sharp detail. The IPS technology ensures great viewing from any angle, while the vibrant colors and vivid images render a full-bodied viewing experience. To top it oﬀ, navigating on the wide screen is also swift and eﬀortless. Whether you are surﬁng your favorite websites or viewing your latest snapshots and videos, the 5" screen gives you an unbeatable visual treat while on the go.1.2GHz quad core processorYour Philips mobile phone now zooms alonglike never before, thanks to the powerful 1.2GHzquad core processor. This powerhouse keepsup easily with your multitasking demands at amuch faster speed. Load web pages withlightning speed, watch uninterrupted videosplus get animations fast-and we mean fast!Gaming is seamless and immersive withexceptional picture quality.Android 4.3Empowered by Android, your Philips mobilenow comes with a fully customizable mobileplatform that is open to a wide range of smartapplications and functions. Find your pocketPC, games console and telephone all rolledconveniently into one.8 MPixel AF camera with ﬂashShoot like a pro on the go with the 8 megapixelautofocus camera on your Philips mobilephone. Capture life's ﬂeeting moments - big orsmall - in crystal-clear quality and beam themto friends and family with pride. And a built-inﬂash means that you can take great photoseven in dim lighting conditions -so you won'tmiss a memorable shot, night or day.SpeciﬁcationsNetwork Features4G TD-LTE: 2600(B38), 1900(B39),2300(B40)3G: TD-SCDMAGPRS (Rx+Tx): Class 12, Class BGSM band: 1800, 1900, 900 MHz Messaging: Concatenated SMS (Long SMS), E-mail, MMS,Multimedia Message Service, Predeﬁned messages (SMS,MMS), SMS (Short Message Service), SMS multi-target,Predeﬁned SMSServices: OTA provisioning (WAP,MMS), WAP 2.0, Internet on mobileEDGEWLANWAPIOSAndroid: Android4.3Processor1.2 GHz Quad core ProcessorDimensionsAntenna: IntegratedForm Factor: Candy barHandset dimensions: 143.7x71.1x9.65mm Handset weight: 168gHandset color: ChampagnePicture/DisplayMain Display Resolution: 720X1280 pixel Main Display Technology: TFT IPSMain Display Colors: 16MTouch-sensitive screen: Touch Screen Capacity touch panelDiagonal screen size (inch): 5 inch Capacitive touchscreenStill Picture CapturingPicture resolution: 8M (3264X2448) Camera: IntegratedFlash: built-inIntegrated ﬂashImage sensor type: CMOSPreview frame rate: 30 frames/second Picture ﬁle format: JPEGWhite balance: Automatic, Cloudy, Fluorescent, Daylight, Incandescent Still Picture PlaybackPicture Compression Format: BMP, GIF, GIF(87a & 89a), JPEGRotation: 90 degree stepsSlide showSoundRingers: MP3 ringer, Polyphonic (64 tones),AMR ringerStorage MediaBuilt-in memory (RAM): 1GBMemory Card Types: Micro SDMemory management: Memory status,Dynamic memory allocationUser memory: 1100 MBMaximum memory card capacity: 32 GBBuilt-in memory (ROM): 4GBConvenienceButtons and controls: Power On/Oﬀ, Sidekeys, Soft keysCall Management: Call Forwarding, Call onHold, Call Time, Call Waiting*, Caller ID*,Conference Call, Emergency Call, Microphonemute, Missed Calls, Multi-party call, ReceivedCalls, FirewallClock/Version: Analogue, Digital, InternationalclockEase of Navigation: Touch panelEase of Use: Graphical User Interface, Handsfree mode, Hot Keys, In-ﬂight mode, KeypadLock, Vibra Alert, Dual SIM cards, BlinkingLights, Dedicated Headset plugGames and applications: Agenda, AlarmClock, Calculator, Calendar, Stopwatch,Countdown timer, Handwriting recognition,Document Viewer, Documents Reader, Motionsensor, Widget, File Manager, Photo EditorLanguage available: UI: Chinese Simpliﬁed,Chinese Traditional, EnglishOperating System: Android4.3Personalisation/Customization:Downloadable Animated GIF, DownloadablePicture, Downloadable Ringtones, Wallpaper,Ringtones, Screen SaverText input: Smart predictive inputVibratorVolume controlGPSBuilt-in GPSSupports A-GPSConnectivityModem Capabilities: GPRS, SMS, EDGE, DL100Mbps, UL 50MbpsPC Link: USB 2.0Wireless connections: Wi-Fi, BluetoothBluetooth proﬁles: A2DP, File transfer proﬁle,AVRCP, GAVDP, HSP, OPPBluetooth version: 4.0Headset: Via 3.5mm jack connectorSerial connections: USB-MicroUSB data cableAccessoriesStandard Package Includes: Battery, Charger,User Manual, USB data cableBatteries: 2040mAh* MicroSD memory card is not included.* Availability of certain features is subject to valid servicesubscription from your network operator.* All visuals provided are for reference purposes only.Actual product features such as phone colors andscreenshots may vary from those pictured.* Speciﬁcations indicated are based on an initial fullbattery charge tested in a laboratory with Bluetoothand WiFi switched oﬀ. Actual performance will dependon network service provider and usage.* Actual available memory for end user usage may varyfrom market to market due to pre-conﬁguration.* Speciﬁcations indicated are subject to change withoutprior notice.© 2022 Koninklijke Philips N.V.All Rights reserved.Speciﬁcations are subject to change without notice. Trademarks are the property of Koninklijke Philips N.V. or their respective owners.Issue date 2022‑04‑25 Version: 5.0.112 NC: 8670 001 17491 EAN: 69 31555 21232 4。

SM39R 系列 KBI 功能使用方法说明书

Specifications subject to change without notice, contact your sales representatives for the most recent information. SM39R 系列KBI 功能使用方法1 适用产品：1.1 SM39R16A2/ SM39R12A2/ SM39R08A22 KBI 使用说明：2.1 共有4个I/O 可致能为KBI 功能I/O 。

2.2 由Port 0共4个I/O ，分别对应至4个独立的旗标(KBF.0~ KBF.3)，且共享同一个中断向量位置(0x5B)。

2.3 可由程序设定为高准位或低准位触发。

2.4 当触发讯号输入至KBI 任一引脚，其对应的旗标将会被设置为”1”，并且进入中断子程序。

2.5 KBI 功能主要可做为2x2矩阵式键盘扫描，或其它应用。

Fig. Interrupts from KBI 4 inputsFig. keyboard input circuitrySpecifications subject to change without notice, contact your sales representatives for the most recent information.2.6 KBI 相关缓存器：KBI DescriptionDirect Bit 7Bit 6Bit 5Bit 4Bit 3Bit 2Bit 1Bit 0RESETKBI function KBLS KBI level selection93h - - - - KBLS3KBLS2 KBLS1 KBLS000H KBE KBI input enable 94h - - - - KBE3KBE2 KBE1 KBE0 00H KBF KBI flag95h - - - -KBF3 KBF2 KBF1 KBF0 00HKBDKBI De-bouncecontrol register 96hKBDEN- - - - - KBD1 KBD0 00HIEN1Interrupt Enable 1registerB8H EXEN2 -IEIICIELVI IEKBI IEADC IESPI IEPWM 00H IRCONInterrupt requestregisterC0H EXF2 TF2 IICIFLVIIFKBIIFADCIF SPIIF PWMIF00HMnemonic: KBLS Address: 93h7 6 5 4 3 2 1 0 Reset-- - - KBLS3 KBLS2 KBLS1 KBLS0 00HKBLS.3: 触发准位设定位 (Keyboard Line 3 level selection bit) 0 : 设定为低准位触发 1 : 设定为高准位触发KBLS.2: 触发准位设定位 (Keyboard Line 2 level selection bit)0 : 设定为低准位触发 1 : 设定为高准位触发KBLS.1: 触发准位设定位 (Keyboard Line 1 level selection bit)0 : 设定为低准位触发 1 : 设定为高准位触发KBLS.0: 触发准位设定位 (Keyboard Line 0 level selection bit)0 : 设定为低准位触发 1 : 设定为高准位触发Mnemonic: KBE Address: 94h7 6 5 4 3 2 1 0 Reset-- - - KBE3 KBE2 KBE1 KBE0 00HKBE.3: 致能位 (Keyboard Line 3 enable bit)0 : KBI 禁能，预设为一般的出入埠(GPIO)1 : KBI 致能，当触发讯号输入时，KBF.7 = 1，会触发中断KBE.2: 致能位 (Keyboard Line 2 enable bit)0 : KBI 禁能，预设为一般的出入埠(GPIO)1 : KBI 致能，当触发讯号输入时，KBF.7 = 1，会触发中断KBE.1: 致能位 (Keyboard Line 1 enable bit)0 : KBI 禁能，预设为一般的出入埠(GPIO)1 : KBI 致能，当触发讯号输入时，KBF.7 = 1，会触发中断KBE.0: 致能位 (Keyboard Line 0 enable bit)0 : KBI 禁能，预设为一般的出入埠(GPIO)1 : KBI 致能，当触发讯号输入时，KBF.7 = 1，会触发中断Specifications subject to change without notice, contact your sales representatives for the most recent information.Mnemonic: KBF Address: 95h7 6 5 4 3 2 1 0 Reset - - - - KBF3 KBF2 KBF1 KBF0 00HKBF.3: KBI 触发旗标 (Keyboard Line 3 flag)1: 当KBI3侦测到输入讯号时，KBF.3由硬件设为”1”，并产生KBI 中断； 0: 必须由软件清除为”0”KBF.2: KBI 触发旗标 (Keyboard Line 2 flag)1: 当KBI2侦测到输入讯号时，KBF.2由硬件设为”1”，并产生KBI 中断； 0: 必须由软件清除为”0”KBF.1: KBI 触发旗标 (Keyboard Line 1 flag)1: 当KBI1侦测到输入讯号时，KBF.1由硬件设为”1”，并产生KBI 中断； 0: 必须由软件清除为”0”KBF.0: KBI 触发旗标 (Keyboard Line 0 flag)1: 当KBI0侦测到输入讯号时，KBF.0由硬件设为”1”，并产生KBI 中断； 0: 必须由软件清除为”0”Mnemonic: KBD Address: 96h7 6 5 4 3 2 1 0 Reset KBDEN - - - - - KBD1 KBD0 00HKBDEN: 除弹跳功能致能位(Enable KBI de-bounce function).预设为致能(The default KBI function is enabled). KBDEN = 0, 致能除弹跳功能 KBDEN = 1, 禁能除弹跳功能KBD[1:0]: 除弹跳时间设定位. 若KBDEN = “0”，则预设为320 ms.KBD[1:0] = 00, 除弹跳时间为320 ms. KBD[1:0] = 01, 除弹跳时间为160 ms. KBD[1:0] = 10, 除弹跳时间为80 ms. KBD[1:0] = 11, 除弹跳时间为40 ms.Mnemonic: IEN1 Address: B8h7 6 5 4 3 2 1 0 Reset EXEN2 - IEIIC IELVI IEKBIIEADC IESPI IEPWM 00HIEKBI: KBI interrupt enable.IEKBI = 0 – Disable KBI interrupt. IEKBI = 1 – Enable KBI interrupt.Mnemonic: IRCON Address: C0h7 6 5 4 3 2 1 0 Reset EXF2 TF2 IICIF LVIIF KBIIFADCIF SPIIF PWMIF 00HKBIIF: KBI interrupt flag. Must be cleared by software.Specifications subject to change without notice, contact your sales representatives for the most recent information.2.7 以下是KBI 相对应的中断向量表：Table 11-1: Interrupt vectorsInterrupt Request FlagsInterrupt VectorAddress Interrupt Number *(use Keil C Tool)IE0 – External interrupt 0 0003h 0 TF0 – Timer 0 interrupt 000Bh1IE1 – External interrupt 1 0013h 2 TF1 – Timer 1 interrupt 001Bh 3 RI/TI – Serial channel interrupt 0023h 4 TF2/EXF2 – Timer 2 interrupt 002Bh 5 PWMIF – PWM interrupt 0043h 8 SPIIF – SPI interrupt004Bh 9 ADCIF – A/D converter interrupt 0053h 10 KBIIF – keyboard Interface interrupt 005Bh 11 LVIIF – Low Voltage Interrupt 0063h 12 IICIF – IIC interrupt 006Bh 13 Comparator interrupt0093h18*See Keil C about C51 User’s Guide about Interrupt Function descriptionKBI 中断应用的参考程序：Description 1. KBI I/O 全部致能，Ch.0/Ch.1 高准位侦测 Ch.2/Ch.3 低准位侦测 2. De-bounce 时间为40msC 语言//==================================================================== // S Y N C M O S T E C H N O L O G Y//==================================================================== #include "SM39R16A2.h" #include " SM39R16A2_KBI.h "#define KBI_VECTOR 11 //KBI Interrupt Vevtor #define d_KBLS 0x03 //KBI Low/High level detection selection (0~0x0F) #define d_KBEX 0x0F //KBI Input Enable (0~0x0F) #define d_KBDEN 0x00 //KBI De-bounce Function Enable#define d_KBDS 0x03 //KBD[1:0] KBI De-bounce Time Selection (0~3) #define d_KBIIE 0x01 //KBI Interrupt Enable bitvoid KBI_initialize(void) //Initialize KBI {EA=0; //Disable All Interrupt Function IEKBI=(d_KBIIE); //Enable KBI Interrupt FunctionKBD=(d_KBDEN<<7)|(d_KBDS);//Enable KBI De-bounce and De-bounce Time FunctionSpecifications subject to change without notice, contact your sales representatives for the most recent information.KBLS=(d_KBLS); //KBI Input High/Low Level Select KBE=(d_KBEX); //KBI Input Channel Enable EA=1;//Enable All Interrupt}//---------------------------------------------------------------------// void KBI_Disable(void) {IEKBI=0; //Disable KBI Interrupt KBE=0; //Disable KBI Function }//---------------------------------------------------------------------//void KBI_ISR(void) interrupt KBI_VECTOR //KBI Interrupt Subroutine {switch(KBF)//Decision Occur Channel Flag (KBF){case 0x08: //KBI Channel 3 Occur Interrupt(KBF3) P1_3=0;break;case 0x04: //KBI Channel 2 Occur Interrupt(KBF2) P1_2=0;break;case 0x02: //KBI Channel 1 Occur Interrupt(KBF1) P1_1=0;break;case 0x01: //KBI Channel 0 Occur Interrupt(KBF0) P1_0=0;break;}KBF=0;////KBIIF=0; //Hardware Clear KBI Flag }void main(void)//Main Function Start{KBI_initialize(); //Call KBI Initial Subroutine while(1); //KBI_Disable(); }Specifications subject to change without notice, contact your sales representatives for the most recent information. Description1. KBI I/O 全部致能 Ch.0~3 高准位侦测 De-bounce 时间为320ms2. 当外部触发讯号至KBI I/O 时产生中断，并将结果显示于Port1汇编//==================================================================== // S Y N C M O S T E C H N O L O G Y//==================================================================== SFR KBLS = 0x93; ;Keyboard level selector register SFR KBE = 0x94; ;Keyboard input enable register SFR KBF = 0x95; ;Keyboard interrupt flag register SFR KBD = 0x96; ;de-bounce mechanism select SFR IEN0 = 0xA8; SFR IEN1 = 0xB8; SFR IRCON = 0xC0;ORG 0000H JMP BEGIN ORG 005BH JMP KBI_INT;================================================== ;KBI INTERRUPT INIT ROUTINE;================================================== BEGIN: MOV IEN0,#80H ;EA =1 MOV IEN1,#08H ;IEKBI =1 MOV KBD,#00H ;KBI de-bounce function and set de-bounce time is 320 ms. MOV KBLS,#0FFH ;High level detect ; MOV KBLS,#00H ;Low level detect MOV KBE, #0FFH ;KBI all pin enable MOV KBF, #00H ;KBI all flag clear JMP START;================================================== ;MAIN;================================================== START:JMP START;================================================== ;KBI INTERRUPT ROUTINE;================================================== KBI_INT:MOV P1,KBF MOV KBF, #00H ANL IRCON,#08H RETI END新茂国际科技希望能为客户减少开发的时间及辛劳，故提供 “Codzard 范例程序产生器＂可于新茂网站首页>下载专区> 软件下载内下载此软件，如有任何建议，请来信告知，谢谢! 销售客服电子信箱：******************.com.tw 技术支持电子信箱：********************.com.tw。

三星工程模式

三星Note3高通版锁定2/3/4G网络！移动/联通自由切换，打开工程模式→服务模式ServiceMode锁定2/3/4G网络。

无需ROOT（升级官方4.42后又可用了.9008亲测用联通3G）拨号盘：*#0011#→手机Menu键→Back本帖隐藏的内容→手机Menu键→Key Input 输入大写Q→手机Menu键→Key Input 输入0000然后耐心等待5到10秒钟，千万不要做任何操作，在MAIN MENU界面选择[2]UE SETTING INFO选择[1]SETTING选择[1]PROTOCOL选择[2]NAS选择[1]NETWORK CONTROL选择[4]BAND SELECTION简单设置锁定2/3/4G网络：单击选UMTS→DEBUG SCREEN→PHONE CONTROL →NETWORK CONTROL→BAND SELECTION→[2][3][4]...GSM BAND Preferencel。

好了，最后大家能看到有7个GSM频率段，选择一个，就把频率锁定了再简单一点：拨号盘：*#0011#→手机Menu键→Back→手机Menu键→Key Input 输入大写Q→手机Menu键→Key Input 输入11872然后耐心等待5到10秒钟，就出现[1][2][3]...自己选模式吧！锁4G网简单介绍：在MAIN MENU界面选择[2]UE SETTING & INFO选择[1]SETTING选择[1]PROTOCOL选择[2]NAS选择[1]NETWORK CONTROL选择[4]BAND SELECTION可以对网络参数进行设置有[WCDMA/GSM],[TDS/GSM],[LTE/WCDMA/GSM],[LTE/TDS/GSM],[LTE/TDSCDMA],[WCDMA],[GSM],[LTE],[TDSCDMA]等选项。

锁定2G,选择[3]GSM Band Preference下的ALL选项。

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本说明书如有修改，恕不另行通知，请接洽您的销售代理商以获取最新版本信息。
ISSFD-M054
6
Ver.B SM39R04G1 11/2010
寄存器
AUX S0CON S0BUF P1WE P3WE
IEN0 IP0 S0RELL P3 WDTC WDTK IEN1 IP1 S0RELH IRCON PSW P1M0 P1M1 P3M0 P3M1 ACC ISPFAH ISPFAL ISPFD ISPFC LVC SWRES B TAKEY IICS IICCTL IICA1 IICA2 IICRWD IICS2
SM39R04G1/SM39R02G1 内嵌 4KB/2KB
具有 ISP 功能的 Flash 和 256B RAM 的 8 位控制器
特征
z 工作电压:2.7V ~ 5.5V z 高速 1T 架构，最高可达 20MHz. z 1~8T 模式可使用软件编程. z 指令设置兼容 MCS-51. z 内置 RC 振荡器，频率范围为 1MHz~20MHz z 4K/2K 字节的片上闪存程序存储器 z 256 字节的标准的 8052 RAM z 一个全双工通信的串行接口.附加鲍率产生
XTAL2/P3.2 XTAL1/P3.3 VSS P3.4/SCL P3.5/SDA RESET/P3.6/#INT0/T0 P3.7/#INT1/T1 VDD
I/O
描述
I/O P3 口的位 0 & 串行接口通道接收/发送数据 & (外部中断 0 or 计时器 0 外部输入)
I/O
P3 口的位 1 &串行接口通道 0 数据传输或接收模式 0 时钟 & (外部中断 1 or 计时器 1 外部输入)
I/O P3 口的位 7 & (外部中断 1 or 计时器 1 外部输入)
I 数位电源电压
特殊功能脚可依下表配置(可于特殊功能寄存器中选择)：
特殊功能脚默认
选择 1
选择 2
#INT0
8(P3.6) 1(P3.0) 8(P3.6)
#INT1
9(P3.7) 2(P3.1) 9(P3.7)
T0
8(P3.6) 8(P3.6) 1(P3.0)
6
P3.3/#INT1
7
VSS
8
P1.0/SDA
9
P1.1/SCL
10
P3.4/T0
11
P3.5/T1
12
RESET/P3.6/#INT0/T0
13
P3.7/#INT1/T1
14
VDD
I/O
描述
I/O
P3 口的位 0 & 串行接口通道接收/发送数据 & (外部中断 0 or 计时器 0 外部输入)
X001
X010
IICA1
ISPFAL P3M0
S0RELH S0RELL
TL0 DPL
X010
X011
IICA2 ISPFD P3M1
P1WE
TL1 DPH
X011
X100
IICRWD ISPFC P1M0
P3WE
TH0 DPL1
X100
X101
IICEBT
P1M1
TH1 DPH1
X101
X110
该 SM39R04G1 是一个快速的单芯片 8 位微控制器内核.这是一个全功能的 8 位嵌入式控制器，执行所有 ASM51 指令，具有与 MCS - 51 相同的指令设置.
订货信息
SM39R04G1ihhkL yymmv i: 工艺标志{W = 2.7V ~ 5.5V} hh:封装脚位 k: 封装形式后缀{as table below } L: 无铅标志 {无文字即含铅，”P” 即无铅} yy: 年 mm: 月 v: 版本标志{ A, B,…}
Pin / Pad Configuration
Page 3 Page 3 Page 3
Contact SyncMOS : 6F, No.10-2 Li- Hsin 1st Road , SBIP, Hsinchu, Taiwan TEL: 886-3-567-1820 FAX: 886-3-567-1891
T1
9(P3.7) 9(P3.7) 2(P3.1)
当使用片上硬件复位机制时,复位脚可配置为 P3.6。
当主系统时钟源设置为使用振荡器(时钟由晶振输入脚输入)或片内 RC 振荡器,晶振输出脚可于 ICP 或 ISP 中选择配置为 P3.2。
当主系统时钟源设置为片内 RC 振荡器, 晶振输入脚可于 ICP 或 ISP 中选择配置为 P3.3。
本说明书如有修改，恕不另行通知，请接洽您的销售代理商以获取最新版本信息。
ISSFD-M054
5
Ver.B SM39R04G1 11/2010
特殊功能寄存器(SFR)
特殊功能寄存器分布图如下所示：
SM39R04G1/SM39R02G1 内嵌 4KB/2KB
具有 ISP 功能的 Flash 和 256B RAM 的 8 位控制器
本说明书如有修改，恕不另行通知，请接洽您的销售代理商以获取最新版本信息。
ISSFD-M054
1
Ver.B SM39R04G1 11/2010
各封装引脚配置
SM39R04G1/SM39R02G1 内嵌 4KB/2KB
具有 ISP 功能的 Flash 和 256B RAM 的 8 位控制器
SyncMOS
I/O P1 口的位 1 & ICE 和 ICP 功能的时钟输入
I/O P3 口的位 4 & 计时器 0 外部输入
I/O P3 口的位 5 & 计时器 1 外部输入
I/O 复位 & (P3 口的位 6 or 外部中断 0 or 计时器 0 外部输入)
I/O P3 口的位 7 & (外部中断 1 or 计时器 1 外部输入)
I/O
P3 口的位 1 &串行接口通道 0 数据传输或接收模式 0 时钟 & (外部中断 1 or 计时器 1 外部输入)
I/O 晶振输出& P1 口的位 2
I/O 晶振输入& P1 口的位 3
I/O P3 口的位 2 & 外部中断 0
I/O P3 口的位 3 & 外部中断 1
I 供电电源地
I/O P1 口的位 0 & ICE 和 ICP 功能的指令及数据输入
管脚描述
SM39R04G1/SM39R02G1 内嵌 4KB/2KB
具有 ISP 功能的 Flash 和 256B RAM 的 8 位控制器
14L PDIP/SOP
1
代号
P3.0/RXD/#INT0/T0
2
P3.1/TXD/#INT1/T1
3
XTAL2/P1.2
4
XTAL1/P1.3
5
P3.2/#INT0
ISSFD-M054
4
Ver.B SM39R04G1 11/2010
SM39R04G1/SM39R02G1 内嵌 4KB/2KB
具有 ISP 功能的 Flash 和 256B RAM 的 8 位控制器
10L MSOP
1
2
3 4 5 6 7 8 9 10
代号
P3.0/RXD/#INT0/T0
P3.1/TXD/#INT1/T1
SM39R04G1ihhNP
yymmv (14L PDIP Top View)
SyncMOS
SM39R04G1i
(14L SOP Top View)
本说明书如有修改，恕不另行通知，请接洽您的销售代理商以获取最新版本信息。
ISSFD-M054
2
Ver.B SM39R04G1 11/2010
系统方框图
产品目录
SM39R04G1W20, SM39R02G1W20
描述
原来的 8052 有 12 时钟结构. 一个机器周期需要 12 个时钟，大多数指令是一个或两个机器周期.因此，除了乘除和 DIV 指令, 8052 的每个指令使用 12 或 24 个时钟.此外，8052 中的每个周期用了两个记忆提取.在许多情况下，第二个是假的提取,和额外的时钟被浪费了.
Flash 4KBytes
ICE
ICP
Interface control
Port 1 Port 3
Port 1 Port 3
Timer 0/1
T0 T1
P1.0(Data) P1.1(clock)
本说明书如有修改，恕不另行通知，请接洽您的销售代理商以
Ver.B SM39R04G1 11/2010
SM39R04G1/SM39R02G1 内嵌 4KB/2KB
具有 ISP 功能的 Flash 和 256B RAM 的 8 位控制器
RXD0 TXD0 IIC_SCL IIC_SDA
RESET
MAX810
UART 0
IIC
XTAL2 XTAL1
SRAM 256Bytes
Watchdog Interrupt
Hex\Bi n F8 F0 E8 E0 D8 D0 C8 C0 B8 B0 A8 A0 98 90 88 80
Hex\Bi n
X000
IICS B
ACC
PSW
IRCON IEN1 P3 IEN0
S0CON P1
TCON
X000
X001
IICCTL
ISPFAH
IP1 IP0 S0BUF AUX TMOD SP
(N=0 to 4). z 片上在线仿真功能(ICE)及片上在线调试功
能(OCD). z ALE 输出选择. z 低电压中断/低电压复位(LVI/LVR ). z 管脚 ESD 性能超过 4KV. z 增强用户代码保护. z 电源管理单元空闲及掉电模式.