TLV246x
TLV2543CN;TLV2543CDBR;TLV2543CDW;TLV2543IDB;TLV2543IDW;中文规格书,Datasheet资料
Terminal Functions
TERMINAL NAME AIN0 – AIN10 NO. 1 – 9, 11, 12 15 I/O I DESCRIPTION Analog input. These 11 analog-signal inputs are internally multiplexed. The driving source impedance should be less than or equal to 50 Ω for 4.1-MHz I/O CLOCK operation and capable of slewing the analog input voltage into a capacitance of 60 pF. Chip select. A high-to-low transition on CS resets the internal counters and controls and enables DATA OUT, DATA INPUT, and I/O CLOCK. A low-to-high transition disables DATA INPUT and I/O CLOCK within a setup time. Serial-data input. A 4-bit serial address selects the desired analog input or test voltage to be converted. The serial data is presented with the MSB first and is shifted in on the first four rising edges of I/O CLOCK. After the four address bits are read into the address register, I/O CLOCK clocks the remaining bits in order. Serial data output. This is the 3-state serial output for the A/D conversion result. DATA OUT is in the high-impedance state when CS is high and active when CS is low. With a valid CS, DATA OUT is removed from the high-impedance state and is driven to the logic level corresponding to the MSB/LSB value of the previous conversion result. The next falling edge of I/O CLOCK drives DATA OUT to the logic level corresponding to the next MSB / LSB, and the remaining bits are shifted out in order. End of conversion. EOC goes from a high to a low logic level after the falling edge of the last I/O CLOCK and remains low until the conversion is complete and data are ready for transfer. Ground. This is the ground return terminal for the internal circuitry. Unless otherwise noted, all voltage measurements are with respect to GND. I Input /output clock. I/O CLOCK receives the serial input and performs the following four functions: 1. It clocks the eight input data bits into the input data register on the first eight rising edges of I/O CLOCK with the multiplexer address available after the fourth rising edge. 2. On the fourth falling edge of I/O CLOCK, the analog input voltage on the selected multiplexer input begins charging the capacitor array and continues to do so until the last falling edge of I/O CLOCK. 3. It shifts the 11 remaining bits of the previous conversion data out on DATA OUT. Data changes on the falling edge of I/O CLOCK. 4. It transfers control of the conversion to the internal state controller on the falling edge of the last I/O CLOCK. Reference +. The upper reference voltage value (nominally VCC) is applied to REF+. The maximum input voltage range is determined by the difference between the voltage applied to this terminal and the voltage applied to the REF – terminal. Reference –. The lower reference voltage value (nominally ground) is applied to REF –. Positive supply voltage.
艾膈xStorage家型单相，3.6kW，4.2kWh，AC耦合，灰色 蜂窝模式，PV6说明书
Eaton XSTH1P0361UC3EV2Eaton xStorage Home single-phase, 3.6 kW, 4.2 kWh, AC coupled, Grey/Honeycomb, PV 6General specificationsEaton xStorage Home single-phase XSTH1P0361UC3EV2XST 1Ph 3.6kW 4.2kWh Grey/Honeycomb3553340100666890 mm1230 mm 220 mm 159 kgCE Marked CE LVD RoHS CompliantEN 61000-6-3 EN 61000-6-2EN 62109 (part 1:2010, part 2:2011)Product NameCatalog Number Model CodeEANProduct Length/Depth Product Height Product Width Product Weight Compliances Certifications0.99 (Grid-Tie), 0.8 (ind) - 0.8 (cap) (Grid Tie-PF regulation, Off-Grid)3,6 kW17.4 A230V97%Residual current circuit breaker (RCCB)Overload-/temperature protectionShort-circuit protectedBuilt-in batteryWith data loggingEthernetWLANEmergency power compatible3600 VA550 V20 AIP20Power metering of critical loads and PV production Eaton xstorage Home Brochure enxStorage Home BrochurexStorage Home Product team guidelinesxStorage Home Installation manualEaton xStorage Home Quick Start Guide xStorage Home User Interface Manual xStorage Home User manualEaton xStorage Home Safety GuidelinesHow to onboard xStorage Home into the Cloud xStorage Home - Technical data sheetOutput power factorPower rangeAC current - maxAC inputEfficiency (PV to grid) - max Fitted with:Nominal output powerDC voltage on PV input - max Input Current on PV Input – Max Degree of ProtectionLED indicator colorMetering capability BrochuresCase studiesManuals and user guidesMultimediaTechnical data sheetsGreen (ON): Normal status. Red (ON): Fault status. Inverter is unable to connect to the grid.Green (Blinking): Communication activitySpecial featuresThe xStorage Home system offers three different power inverter ranges.Nominal DC Operating Voltage – Max550 VCoolingNatural airflowStorage temperature - max40 °CTopologyTransformerlessBattery nominal capacity4,2 kWhProtective classIAC wiring systemsSingle phase/N/PE, TN, TT, IT (additional fuse or CB required)Relative humidity - min5 %C/D DC current - Max70 ANominal AC output current15.6 AStandby losses< 10WStorage temperature - min-10 °CDC battery voltage - min74.4 VOver voltage categoryOVC II (PV and Battery), OVC III (AC grid/load)PhaseSingle phaseOperating temperature - min0 °CRelative humidity - maxEfficiency (Battery to AC) - Max>90%Grid integrationDC and AC coupledNumber of MPPT Trackers2Noise level35 dB (indoor application)Rated MPP-voltage – min240 VMaterial coverPlasticNominal DC Operating Voltage – Min 100 VPower consumption3.6 kWOperating temperature - max30 °CHazard substance restrictionLead free, compliance with RoHS GP2Initial feeding voltage150 VProtocolHTTPAPIRESTMPPT efficiency> 99%Recommended PV power3 kWp - 7 kWpSolar DC switchYesNominal AC grid voltage230 V (Grid-Tie), 230 V ± 3 % (Off-Grid)DC battery voltage - max98.4 VEaton Corporation plc Eaton House30 Pembroke Road Dublin 4, Ireland © 2023 Eaton. All rights reserved. Eaton is a registered trademark.All other trademarks areproperty of their respectiveowners./socialmedia35 A90 V< 3%AC Synchronized operation 50 Hz / 60 Hz ± 1 Hz 2000 m Standard550 VBattery voltage rating Total Harmonic Distortion (THD)Nominal frequencyAltitude Display Rated MPP-voltage – max。
Rail to Rail 轨对轨运算放大器
Rail to Rail 轨对轨运放传统的模拟集成器件，如运放、A/D、D/A等，其模拟引脚的电压范围一般都达不到电源，以运放为例，电源为+/-15V的运放，为确保性能（首先是不损坏，其次是不反相，最后是足够的共模抑制比），输入范围一般不要超过+/-10V，常温下也不要超过+/-12V；输出范围，负载10kohm时一般只有+/-11V，小负载电阻(600ohm)时只能保证+/-10V。
这对器件的应用带来很多不便。
rail-to-rail的器件，一般都是低压器件（+/-5V 或single +5V），输入输出电压都能达到电源（输入甚至可以超过）。
其原理上的秘诀便在于电流模＋NPN/PNP互补输入结构。
rail-to-rail器件的某些设计思想，对我们自己设计电路也可以提供一些有益的思路。
现在rail-to-rail的单电源模拟器件已形成系列（如MAXIM,AD,TI等），在许多对性能（精度）要求不高的场合，我们可以考虑全部采用单+5V甚至+2.7V的模拟器件来构成我们的系统，这样模拟电路和数字电路便可以公用一个电源（不过要注意电源去耦）。
而且这类器件大量采用SOT封装，有利于设计出体积功耗都很小的产品。
rail-to-rail，即“轨至轨”，有时也称为“满摆幅”，是指输出(或输入)电压范围与电源电压相等或近似相等。
从输入方面来讲，其共模输入电压范围可以从负电源电压到正电源电压；从输出方面来讲，其输出电压范围可以从负电源电源到正电源电压。
也可以说，这是一个与供电电压密切相关的特性，对器件的输入或输出无失真动态范围有很大的影响，当ΔV 很小时(10mV--100mV)，无失真动态范围最小电压为VSS+ΔV，最大值为VCC-ΔV，具有这样动态范围的运放就叫Rail to Rail运放。
理想状态下，器件的正常工作输入与输出电压范围可同时达到运放正负电源端的电压范围。
实际上，器件很难达到真正的“轨至轨”。
比较常见的“轨至轨”表现方式有，输入rail-to-rail；输入达到或超过Vee；输出比较接近rail-to-rail；在同一器件上的输入/输出实现（或接近）rail-to-rail。
索尼数据投影仪VPL-EX246说明书
Data ProjectorVPL-EX246XGA / 3,200 lmOpticalLight Output / Color Light Output 3200 lumens (Lamp mode: High) 2200 lumens (Lamp mode: Standard) 1700 lumens (Lamp mode: Low) LCD Panels0.63”x3 BrightEra LCD Panel Panel Display Resolution XGA (1024x768 dots)Contrast Ratio 3,000:1 (Full white/full black)*1Light Source Ultra high-pressure mercury lamp 210 W type Recommended Lamp Replacement Time*2 3000H (Lamp mode: High) 5000H (Lamp mode: Standard) 7000H (Lamp mode: Low) Filter Cleaning Cycle*2 Max. 7000HSame time as the lamp replacement is recommendedProjection Lens Zoom / Focus Approx. 1.6x Manual Zoom / Manual Focus Throw Ratio 1.40:1 to 2.27:1Screen Size 30” to 300” InterfaceComputer andVideo Input/Output INPUT AMini D-sub 15-pin (RGB/Y Pb Pr)Audio: Stereo mini jack INPUT B Mini D-sub 15-pin (RGB)Audio: Stereo mini jack INPUT CHDMI (Digital RGB/Y Pb Pr, Digital Audio) (HDCP support) VIDEO IN Pin Jack Audio : Pin jack (x2) (shared with S VIDEO IN)S VIDEO IN Mini DIN 4-pinAudio : Pin jack (x2) (shared with VIDEO IN)Monitor OUT Mini D-sub 15-pin(from INPUT A and INPUT B)Audio OUT Stereo mini jack (variable out)*3 Other SignalInput/Output RS-232C D-sub 9-pin (male) LAN RJ-45, 10BASE-T/100BASE-TX USBType-A, Type-B MicrophoneinputMini jack General Speaker 16W (mono) Scanning Frequency H: 14 to 93 kHz, V: 47to 93 HzDisplayResolution Computer Signal Input Maximum display resolution : UXGA 1600x1200 dots VideoSignal InputVideo (Composite), 15k (480/60i, 575/50i), DTV (480/60p, 575/50p, 720/60p, 720/50p, 1080/60i, 1080/50i, 1080/60P, 1080/50P)Color System NTSC3.58, PAL, SECAM, NTSC4.43, PAL-M, PAL-NUPC Code0 27242 86834 2Power Requirements AC 100 V to 240 V, 3.2 A to 1.3 A, 50 Hz/60 Hz Power Consumption 315 W (AC 100 V-120 V) 305 W (AC 220 V-240 V)Standby ModePower Consumption 5.9 W (Std) / 0.5 W (Low) (AC 100V-120 V) 5.9 W (Std) / 0.5 W (Low) (AC 220V-240 V) Dimensions (WxHxD) (without protrusion) 365 x 96.2 x 252 mm14 3/8 x3 25/32 x9 29/32 ” Mass4 kg /8 lb 11 oz Optional Accessories Replacement Lamp LMP-E212 USB wireless module IFU-WLM3Service Parts Replacement Filter 4-426-702-01 (FILTER )(Filters are cleanable)Replacement Remote1-490-463-11 (RM-PJ8)Key Features*1 The value is average.*2 The figures are expected maintenance time and not guaranteed. They will depend on the environment or how the projector is used.*3 Works as an audio switcher function. Output from a selected channel, not available in standby.© 2013 Sony Corporation. All rights reserved. Reproduction in whole or in part without written permission is prohibited. Features and specifications are subject to change without notice. BrightEra; and the Sonymake.believe logo are trademarks of Sony. The HDMI logo and HDMI High-Definition Multimedia Interface are trademarks or registered trademarks of HDMI Licensing LLC in the United States and other countries. All other trademarks are the trademarks of their respective owners. 3/13Connector PanelsDimensions (Bottom) Unit: mm (inches) Dimensions (Front) • 3,200 lumens (ISO 21118)• Native XGA (1,024x768) resolution • High contrast ratio • BrightEra® Panel• Flexible 1.6x manual zoom standard lens • Long-lasting lampRecommended lamp replacement time 7000h (low mode) • Synchronized lamp and filter maintenance cycle • Energy efficient design- Auto power saving mode - Blank with lamp dimming - 4 lamp mode (High, Std, Low, Auto*)*Auto lamp control by picture brightness- ECO MODE key • Convenient terminals including HDMI®, RS-232C and RJ-45 • 16W Speaker • USB display• USB media viewer• PC Wireless capability (option) • Tablet Device & Smart Phone connection (wireless) For more information, visit: /projectors。
TLV-2374资料
Printed or Pin 1Pin 1PACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)TLV2370ID ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2370IDBVR ACTIVE SOT-23DBV63000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2370IDBVRG4ACTIVE SOT-23DBV63000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2370IDBVT ACTIVE SOT-23DBV6250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2370IDBVTG4ACTIVE SOT-23DBV6250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2370IDG4ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2370IDR ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2370IDRG4ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2370IP ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTLV2370IPE4ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTLV2371ID ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2371IDBVR ACTIVE SOT-23DBV53000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2371IDBVRG4ACTIVE SOT-23DBV53000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2371IDBVT ACTIVE SOT-23DBV5250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2371IDBVTG4ACTIVE SOT-23DBV5250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2371IDG4ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2371IDR ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2371IDRG4ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2371IP ACTIVE PDIP P850Pb-Free(RoHS)Call TI N/A for Pkg TypeTLV2371IPE4ACTIVE PDIP P850Pb-Free(RoHS)Call TI N/A for Pkg TypeTLV2372ID ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2372IDG4ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2372IDGK ACTIVE MSOP DGK880Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2372IDGKG4ACTIVE MSOP DGK880Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2372IDGKR ACTIVE MSOP DGK82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)TLV2372IDGKRG4ACTIVE MSOP DGK82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2372IDR ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2372IDRG4ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2372IP ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTLV2372IPE4ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTLV2373ID ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2373IDG4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2373IDGS ACTIVE MSOP DGS1080Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2373IDGSG4ACTIVE MSOP DGS1080Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2373IDGSR ACTIVE MSOP DGS102500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2373IDGSRG4ACTIVE MSOP DGS102500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2373IDR ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2373IDRG4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2373IN ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTLV2373INE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTLV2374ID ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2374IDG4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2374IDR ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2374IDRG4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2374IN ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTLV2374INE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTLV2374IPW ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2374IPWG4ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2374IPWR ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2374IPWRG4ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2375D PREVIEW SOIC D16TBD Call TI Call TIOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)TLV2375DR PREVIEW SOIC D16TBD Call TI Call TITLV2375ID ACTIVE SOIC D1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2375IDG4ACTIVE SOIC D1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2375IDR ACTIVE SOIC D162500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2375IDRG4ACTIVE SOIC D162500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2375IN ACTIVE PDIP N1625Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTLV2375INE4ACTIVE PDIP N1625Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTLV2375IPW ACTIVE TSSOP PW1690Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2375IPWG4ACTIVE TSSOP PW1690Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2375IPWR ACTIVE TSSOP PW162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2375IPWRG4ACTIVE TSSOP PW162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS),Pb-Free(RoHS Exempt),or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free(RoHS Exempt):This component has a RoHS exemption for either1)lead-based flip-chip solder bumps used between the die and package,or2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free(RoHS compatible)as defined above.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is 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TLV2460中文文档
增益带宽积（MＨｚ）
电源电压（Ｖ） 温度（℃）
大信号波动（Ｖ）
小信号波动（Ｖ）
反向大信号波动（Ｖ）
反向小信号波动（Ｖ）
参数的测量方法
TLV246X家族系列运算放大器的应用
１．驱动容性负载
输出失调电压是输入失调电压和输入偏置电流乘以相应的增益的和，下面的原理图和公式可以用来计算输出失调电压。
２．一般的连接电路
温馨提示：买家在使用该款芯片的时候最好要去当地的经销商去实地查看一下元器件的焊接掩膜封装，放置由于厂家生产的时候改动了一些实际的封装而导致该封装与实际样板上面的封装不匹配。
该图片是向消费者展示该贴片封装的芯片的实物图从不同角度观察的视图
左上角：该芯片从左下角到左上角逆时针旋转依次对应该芯片的1——8脚，芯片体的长度在工业生产中对应4.30mm到4.50mm之间，在样板上芯片整体的长度为6.20mm到6.60mm之间，芯片引脚所占的空间为0.19mm到0.30mm之间，引脚与引脚之间的间距为0.65mm，故顾客在购买该款芯片的时候有较大的考虑余地也给实际制版带来了一定的方便
ＴＬＶ２４６０／３／５为节省电池寿命有一个关断功能的便携式应用，电源电流降低至0.3μA/通道被禁用，放大器和输出置于高阻抗模式。为了使放大器，关闭终端可以悬空或拉到高。当关闭终端悬空，护理应采取措施，确保在关闭终端，寄生漏电流不不经意的地方进入关断的运算放大器。关闭终端的门槛总是引用到VDD / 2。因此，经营分割电源电压的设备（如：± 2.5 V）时，关闭终端需要拉至VDD（不接地）禁用运算放大器。
TI芯片资料
器件型号 器件功能TLC08x 宽带高输出驱动单电源运算放大器系列TLV246x 低功耗轨至轨输入家庭/输出运算放大器，带有关断OPA842ID 单位增益稳定，低噪声，电压反馈运算放大器 OPA820ID 宽带，低失真，单位增益稳定，电压反馈运算放大器THS3091D 高电压，低失真，电流反馈运算放大器TPS61087DRCT 650 kHz/1.2兆赫，18.5 V升压型DC DC变换器TPS61062DRCR 恒流LED驱动器，带有数字和PWM亮度控制 UCC38C43P 双极CMOS低功耗电流模式PWM控制器TLC04ID 巴特沃斯四阶低通开关电容滤波器INA270AIDR 电压输出，单向测量电流并联监视器DAC7811IDGS 12位，串行输入，乘法数字到模拟转换器 INA2332AIPWR 低功耗，单电源，仪表放大器 CMOSBQ24025DRCR 单芯片，锂离子电池和锂聚合物充电器，自主的USB 端口和集成电路，交流适配器电源管理TLV1544CDR 低电压10位模拟至数字转换器带串行控制和4 / 8模拟输入TLC08x宽带高输出驱动单电源运算放大器系列TLV246x低功耗轨至轨输入/输出运算放大器系列轨至轨，指器件的输入输出电压范围可以达到电源电压。
传统的模拟集成器件，如运放。
A/D.D/A等，其模拟引脚的电压范围一般都达不到电源，以运放为例，电源为+/-15V 的运放，为确保性能(首先是不损坏，其次是不反相，最后是足够的共模抑制比),输入范围一般不要超过+/-10V,常温下也不要超过+/-12V；输出范围，负载RL(10kohm)时一般只有+/-11V,小负载电阻(600ohm)时只能保证+/-10V。
这对器件的应用带来很多不便。
现在 rail-to-rail 的单电源模拟器件已形成系列(如 MAXIM,AD,TI 等),在许多对性能(精度)要求不高的场合，我们可以考虑全部采用单+5V甚至+2.7V的模拟器件来构成我们的系统，这样模拟电路和数字电路便可以公用一个电源(不过要注意电源去耦)。
低电压运放选型
低电压型运算放大器——型号列表 1制造商产品类别产品型号 产品描述 LMV321IDBVR 单路,低电压,低功耗,满幅输出运放 LMV321IDBVT单路,低电压,低功耗,满幅输出运放 LMV321IDCKR单路,低电压,低功耗,满幅输出运放 LMV321IDCKT单路,低电压,低功耗,满幅输出运放 LMV324ID四路,低电压,低功耗,满幅输出运放 LMV324IDR四路,低电压,低功耗,满幅输出运放 LMV358IDR双路,低电压,地功耗,满幅输出运放 LMV358IPW双路,低电压,地功耗,满幅输出运放 OPA2342UA低成本,低功耗,低电压,满幅运放 OPA2353UA高速,单电源,满幅运放 OPA2354AIDDA双路,高速单电源供电,满幅输入输出 CMOS运放 OPA2355DGSA/250高速带关断功能的视频 CMOS运放 OPA2356AID200MHz带宽,双路CMOS 视频运放 OPA2357AIDGST200MHz带宽,满幅输入输出,双路,带关断功能 OPA2363AIDGST1.8V,90dB CMRR,单电源供电,满幅输入输出 OPA244PA单路,低成本,微功耗,单电源供电运放 OPA244UA单路,低成本,微功耗,单电源供电运放 OPA300AID低噪声,高速, 16 BIT精度,单电源供电 CMOS运放 OPA300AIDBVT低噪声,高速, 16BIT精度,单电源供电 CMOS运放 OPA349NA/2501μA,满幅输入输出,CMOS运放 OPA349UA1μA,满幅输入输出,CMOS运放 OPA350PA高速,单电源供电,满幅输入输出运放 OPA354AIDBVT高速,单电源供电,满幅输入输 CMOS出运放 OPA355UA2.5V200MHz GBW高速视频运放 OPA356AIDBVT200 MHz 带宽,单电源供电,CMOS视频运放 OPA357AIDBVT250MHz,高速,满幅输入输出,带关断功能 OPA360AIDCKT带 6dB增益和滤波器 3V视频放大器 OPA363AID单路,低电压,低功耗运放 OPA363AIDBVT单路,低电压,低功耗运放 OPA4364AIPWT1.8V,高共模抑制比 TLV2361IDBVT低噪声,宽 GBW运放 TLV2362IP双路,低电压运放 TLV2370ID单电源满幅运放 TLV2372ID高速满幅运放 TLV2372IP高速满幅运放 TLV2374ID单电源运放 TLV2462CD低功耗,满幅度输入/输出双运放 TI公司 低电压型运算放大器 TLV2462ID 低功耗,满幅度输入/输出双运放TLV2471CP 高输出驱动能力,满幅度输入/输出单运放 TLV2472CD 高输出驱动能力,满幅度输入/输出,双运放 TLV2474CD 高输出驱动能力,满幅度输入/输出,四运放 TLV2624ID 四路满幅输出运放TLV2771ID 高转换率,具有关断功能运放TLV2772AID 2.7V高转换速率,满幅度输出带关断双运放 TLV2772ID 高转换率,具有关断功能运放TLV2772IP 高转换率,具有关断功能运放TLV2774ID 高转换率,具有关断功能运放TLV2781ID 高速满幅单运放TLV2782AID 高速满幅双运放TLV4110ID 单路低功耗,低偏置电流,300mA驱动TLV4110IP 单路低功耗,低偏置电流,300mA驱动TLV4111ID 高输出驱动,低电压,运放TLV4112CP 高驱动满幅双运放TLV4112ID 双路低功耗,低偏置电流,300mA驱动TLV4113ID 双路低功耗,低偏置电流,300mA驱动TLV4113IN 双路低功耗,低偏置电流,300mA驱动TLV4120IDGN 2.7V,差分输出,200mA输出驱动,带关断功能2。
TOP246-TOP249系列单片机开关电源应用
TOP246-TOP249系列单片开关电源应用1.高效率70W通用开关电源模块TOPSwitch GX适合制作低成本、高效率、小尺寸、全密封式开关电源模块或电源适配器（adapter）。
由TOP249Y构成的密封式70W（19V，3.6A）通用开关电源模块，电路如图1所示。
当环境温度不超过40℃时，模块的外形尺寸可减小到10.5mm×5.5mm×2.5mm。
设计的交流输入电压范围是85V～265V，这属于全世界通用的电压范围。
该电源能同时实现输入欠压保护、过压保护、从外部设定极限电流、降低最大占空比等功能，其主要技术指标为：额定输出功率PO=70W；负载调整率SI=±4％；电源效率η≥84％（当交流输入电压U=85V时，满载效率可达85％；当U=230V时，电源效率高达90％）；空载功率损耗<0.52W（U=230V时）；图1高效率70W通用开关电源模块电路输出纹波电压≤120mV（峰峰值）。
该电源共使用3片集成电路：TOP249Y型6端单片开关电源（IC1）；线性光耦合器PC817A（IC2）；可调式精密并联稳压器TL431（IC3）。
电阻R9和R10用来从外部设定功率开关管的漏极极限电流，使之略高于满载或输入欠压时的漏极峰值电流ID(PK)。
这就允许在电源起动过程中或输出负载不稳定但未出现饱和的情况下，采用较小尺寸的高频变压器。
当输入直流电压过压时。
R9和R10还能自动降低最大占空比DMAx，对最大负载功率加以限制。
R11为欠压或过压检测电阻，并能给线路提供电压前馈，以减少开关频率的波动。
取R11=2MΩ时，仅当直流输入UI电压达到100V时，电源才能起动。
TOPSwitchGX的欠压电流IUV=50μA，过压电流IOV=225μA。
有公式UUV=IUV·R11（1）UOV=IOV·R11(2）将R11=2MΩ分别代入式（1）和式（2）中得到，UUV=100V（DC），UOV=450V （DC）。
TI产品线命名规则及分类
TI产品线命名规则及分类
补充：
1、MSP430系列产品品种较多,先来了解下TI公司对MSP430的命名规则
2、TI产品命名规则
TI产品命名规则：SN54LS×××/HC/HCT/或SNJ54LS/HC/HCT中的后缀说明：
1、SN或SNJ表示TI品牌
2、SN军标，带N表示DIP封装，带J表示DIP（双列直插），带D表示表贴，带W表示宽体
3、SNJ军级，后面代尾缀F或/883表示已检验过的军级。
CD54LS×××/HC/HCT：
1、无后缀表示普军级
2、后缀带J或883表示军品级
CD4000/CD45××：
1、后缀带BCP或BE属军品
2、后缀带BF属普军级
3、后缀带BF3A或883属军品级
TL×××：
1、后缀CP普通级IP工业级后缀带D是表贴
2、后缀带MJB、MJG或带/883的为军品级
3、TLC表示普通电压TLV低功耗电压
TMS320系列归属DSP器件，MSP430F微处理器
BB产品命名规则：
前缀ADS模拟器件，后缀U表贴，P是DIP封装，带B表示工业级；前缀INA、XTR、PGA等表示高精度运放后缀U表贴，P 代表DIP，PA表示高精度。
TLC0820A中文资料
2008年北京市大学生电子设计竞赛芯片资料TLC372 双路通用LinCMOSTM 差动比较器∙单电源或双电源供电∙宽电源范围供电2V~18V∙5V电源时低漏电流150μA∙TTL输入电平时快速响应时间200ns∙内置ESD保护∙高输入阻抗典型值1012Ω∙外部低输入偏置电流典型值5PA∙超稳定的低输入偏置电压∙输入失调电压在最恶劣的输入条件下变化0.23μV/月，包括第一个30天∙共模输入电压包括地∙输出兼容TTL MOS CMOS∙引脚兼容LM393引脚功能∙1IN - 1路比较器反相输入∙1IN+ 1路比较器通向输入∙1OUT 1路比较器输出∙2IN - 2路比较器反相输入∙2IN+ 2路比较器同相输入∙2OUT 2路比较器输出∙GND 电源地∙VCC 电源正∙NC 空脚，不连接这个器件由两个独立电压比较器，使用LinCMOSTM工艺制造的，支持单电源。
输出是N 沟道漏极开路，实现正逻辑连接。
完全最大的测定值运行环境范围（除非另行注释）支持电压VDD(注释1)...............................................................+18V差分输入电压VID(注释2)...........................................................±18V输入电压范围.....................................................................-0.3~18V输出电压VO (18V)输入电流II ......................................................................±5mA输出电流IO.......................................................................20mA输出短路到地持续电流.............................................................无限制注释：1、差分电压除外，全部电压相对于地。
《北京出港国际航班时刻表(Ver.no081010)》
330
1225
1610
9
港龙航空公司
KA991 PEK-HKG
1-7
330
1330
1715
KA909 PEK-HKG
1-7
330
1620
2000
KA993 PEK-HKG
1-7
330
1820
2205
KA903 PEK-HKG
1-7
330
1930
2315
KA997 PEK-HKG
1-7
321
2055
1-7
744
1200
0839
UA850 PEK-ORD
1-7
744
1610
1604
FROM 04 JUL
UA898 PEK-IAD
1-7
744
1830
1936
FROM 04 JUL
27
斯里兰卡航空公司
UL889 PEK-BKK-CMB
357
332
1440
2140
1845到BKK
28
芬兰航空公司
AY052 PEK-HEL
1820
FROM 04 JUL
OZ338 PEK-ICN
147
321
1710
2010
OZ316 PEK-PUS
1-7
320
1330
1650
OZ314 PEK-PUS
12356
320
1740
2100
20
澳洲快达航空公司
QF192 PEK-SYD
135
333
2140
1130
21
卡塔尔航空公司
芯片命名规则
电子元器件命名- -电子元器件,又叫电子芯片,半导体集成电路,广泛应用于各种电子电器设备上.封装形式:封装形式是指安装半导体集成电路芯片用的外壳.它不仅起着安装,固定,密封,保护芯片及增强电热性能等方面的作用,而且还通过芯片上的接点用导线连接到封装外壳的引脚上,这些引脚又通过印刷电路板上的导线与其他器件相连接.衡量一个芯片封装技术先进与否的重要指标是芯片面积与封装面积之比,这个比值越接近1越好.封装大致经过了如下发展进程:结构方面:TO->DIP->LCC->QFP->BGA ->CSP;材料方面:金属,陶瓷->陶瓷,塑料->塑料;引脚形状:长引线直插->短引线或无引线贴装->球状凸点;装配方式:通孔插装->表面组装->直接安装.英文简称英文全称中文解释图片DIPDouble In-line Package双列直插式封装.插装型封装之一,引脚从封装两侧引出,封装材料有塑料和陶瓷两种.DIP是最普及的插装型封装,应用范围包括标准逻辑IC,存贮器LSI,微机电路等.PLCCPlastic Leaded Chip CarrierPLCC封装方式,外形呈正方形,32脚封装,四周都有管脚,外形尺寸比DIP封装小得多.PLCC封装适合用SMT表面安装技术在PCB上安装布线,具有外形尺寸小,可靠性高的优点.PQFPPlastic Quad Flat PackagePQFP封装的芯片引脚之间距离很小,管脚很细,一般大规模或超大规模集成电路采用这种封装形式,其引脚数一般都在100以上.SOPSmall Outline Package1968～1969年菲为浦公司就开发出小外形封装(SOP).以后逐渐派生出SOJ(J型引脚小外形封装),TSOP(薄小外形封装),VSOP(甚小外形封装),SSOP(缩小型SOP),TSSOP(薄的缩小型SOP)及SOT(小外形晶体管),SOIC(小外形集成电路)等.模拟滤波器光纤通信高速信号处理和转换无线/射频光线通讯,模拟显示支持电路高频模拟和混合信号ASIC数字转换器,接口,电源管理,电池监控DC/DC电源电压基准MAXIM前缀是"MAX".DALLAS则是以"DS"开头.MAX×××或MAX××××说明:1后缀CSA,CWA 其中C表示普通级,S表示表贴,W 表示宽体表贴.2 后缀CWI表示宽体表贴,EEWI宽体工业级表贴,后缀MJA或883为军级.3 CPA,BCPI,BCPP,CPP,CCPP,CPE,CPD,ACPA后缀均为普通双列直插.举例MAX202CPE,CPE普通ECPE普通带抗静电保护MAX202EEPE 工业级抗静电保护(-45℃-85℃) 说明E 指抗静电保护MAXIM数字排列分类1字头模拟器2字头滤波器3字头多路开关4字头放大器5字头数模转换器6字头电压基准7字头电压转换8字头复位器9字头比较器DALLAS命名规则例如DS1210N.S. DS1225Y-100IND N=工业级S=表贴宽体MCG=DIP封Z=表贴宽体MNG=DIP工业级IND=工业级QCG=PLCC封Q=QFP 下面是MAXIM的命名规则:三字母后缀:例如:MAX358CPDC = 温度范围P = 封装类型D = 管脚数温度范围:C = 0℃至70℃(商业级)I = -20℃至+85℃(工业级)E = -40℃至+85℃(扩展工业级)A = -40℃至+85℃(航空级)M = -55℃至+125℃(军品级)封装类型:A SSOP(缩小外型封装)B CERQUADC TO-220, TQFP(薄型四方扁平封装)D 陶瓷铜顶封装E 四分之一大的小外型封装F 陶瓷扁平封装H 模块封装, SBGA(超级球式栅格阵列, 5x5 TQFP) J CERDIP (陶瓷双列直插)K TO-3 塑料接脚栅格阵列L LCC (无引线芯片承载封装)M MQFP (公制四方扁平封装)N 窄体塑封双列直插P 塑封双列直插Q PLCC (塑料式引线芯片承载封装)R 窄体陶瓷双列直插封装(300mil)S 小外型封装T TO5,TO-99,TO-100U TSSOP,μMAX,SOTW 宽体小外型封装(300mil)X SC-70(3脚,5脚,6脚)Y 窄体铜顶封装Z TO-92,MQUAD/D 裸片/PR 增强型塑封/W 晶圆DSP信号处理器放大器工业用器件通信电源管理移动通信视频/图像处理器等模拟A/D D/A 转换器传感器模拟器件AD产品以"AD","ADV"居多,也有"OP"或者"REF","AMP","SMP","SSM","TMP","TMS"等开头的.后缀的说明:1,后缀中J表示民品(0-70℃),N表示普通塑封,后缀中带R表示表示表贴。
TLV2462
Pin 1Pin 1PACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)5962-0051201Q2A ACTIVE LCCC FK201TBD POST-PLATE N/A for Pkg Type 5962-0051201QHA ACTIVE CFP U101TBD A42N/A for Pkg Type 5962-0051201QPA ACTIVE CDIP JG81TBD A42N/A for Pkg Type 5962-0051202Q2A ACTIVE LCCC FK201TBD POST-PLATE N/A for Pkg Type 5962-0051202QHA ACTIVE CFP U101TBD A42N/A for Pkg Type 5962-0051202QPA ACTIVE CDIP JG81TBD A42N/A for Pkg Type 5962-0051203Q2A ACTIVE LCCC FK201TBD POST-PLATE N/A for Pkg Type 5962-0051203QHA ACTIVE CFP U101TBD A42N/A for Pkg Type 5962-0051203QPA ACTIVE CDIP JG81TBD A42N/A for Pkg Type 5962-0051204Q2A ACTIVE LCCC FK201TBD POST-PLATE N/A for Pkg Type 5962-0051204QHA ACTIVE CFP U101TBD A42N/A for Pkg Type 5962-0051204QPA ACTIVE CDIP JG81TBD A42N/A for Pkg Type 5962-0051205Q2A ACTIVE LCCC FK201TBD POST-PLATE N/A for Pkg Type 5962-0051205QHA ACTIVE CFP U101TBD A42N/A for Pkg Type 5962-0051205QPA ACTIVE CDIP JG81TBD A42N/A for Pkg Type 5962-0051206Q2A ACTIVE LCCC FK201TBD POST-PLATE N/A for Pkg Type 5962-0051206QHA ACTIVE CFP U101TBD A42N/A for Pkg Type 5962-0051206QPA ACTIVE CDIP JG81TBD A42N/A for Pkg Type 5962-0051207Q2A ACTIVE LCCC FK201TBD POST-PLATE N/A for Pkg Type 5962-0051207QCA ACTIVE CDIP J141TBD A42N/A for Pkg Type 5962-0051208Q2A ACTIVE LCCC FK201TBD POST-PLATE N/A for Pkg Type 5962-0051208QCA ACTIVE CDIP J141TBD A42N/A for Pkg Type TLV2460AIDR ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2460AIDRG4ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2460AIP ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTLV2460AIPE4ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU N/A for Pkg Type TLV2460AMFKB ACTIVE LCCC FK201TBD POST-PLATE N/A for Pkg Type TLV2460AMJGB ACTIVE CDIP JG81TBD A42N/A for Pkg Type TLV2460AMUB ACTIVE CFP U101TBD A42N/A for Pkg Type TLV2460AQD OBSOLETE SOIC D8TBD Call TI Call TITLV2460AQDR ACTIVE SOIC D82500TBD Call TI Call TITLV2460AQDRG4ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TLV2460AQPW ACTIVE TSSOP PW8150TBD CU NIPDAU Level-1-220C-UNLIM TLV2460AQPWG4ACTIVE TSSOP PW8150Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TLV2460AQPWR ACTIVE TSSOP PW82000TBD CU NIPDAU Level-1-220C-UNLIM TLV2460AQPWRG4ACTIVE TSSOP PW82000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TLV2460CD ACTIVE SOIC D875Green(RoHS&CU NIPDAU Level-1-260C-UNLIMOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)no Sb/Br)TLV2460CDBVR ACTIVE SOT-23DBV63000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2460CDBVRG4ACTIVE SOT-23DBV63000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2460CDBVT ACTIVE SOT-23DBV6250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2460CDBVTG4ACTIVE SOT-23DBV6250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2460CDG4ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2460CDR ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2460CDRG4ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2460CP ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTLV2460CPE4ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTLV2460ID ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2460IDBVR ACTIVE SOT-23DBV63000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2460IDBVRG4ACTIVE SOT-23DBV63000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2460IDBVT ACTIVE SOT-23DBV6250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2460IDBVTG4ACTIVE SOT-23DBV6250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2460IDG4ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2460IDR ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2460IDRG4ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2460IP ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTLV2460IPE4ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTLV2460MFKB ACTIVE LCCC FK201TBD POST-PLATE N/A for Pkg Type TLV2460MJG ACTIVE CDIP JG81TBD A42N/A for Pkg Type TLV2460MJGB ACTIVE CDIP JG81TBD A42N/A for Pkg Type TLV2460MUB ACTIVE CFP U101TBD A42N/A for Pkg Type TLV2460QD ACTIVE SOIC D875TBD Call TI Call TITLV2460QDR ACTIVE SOIC D82500TBD Call TI Call TITLV2460QPW ACTIVE TSSOP PW8150TBD CU NIPDAU Level-1-220C-UNLIM TLV2460QPWG4ACTIVE TSSOP PW8150Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2460QPWR ACTIVE TSSOP PW82000TBD CU NIPDAU Level-1-220C-UNLIM TLV2460QPWRG4ACTIVE TSSOP PW82000Green(RoHS&CU NIPDAU Level-1-260C-UNLIMOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)no Sb/Br)TLV2461AID ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2461AIDG4ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2461AIDR ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2461AIDRG4ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2461AIP ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTLV2461AIPE4ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU N/A for Pkg Type TLV2461AMFKB ACTIVE LCCC FK201TBD POST-PLATE N/A for Pkg Type TLV2461AMJGB ACTIVE CDIP JG81TBD A42N/A for Pkg Type TLV2461AMUB ACTIVE CFP U101TBD A42N/A for Pkg Type TLV2461AQD ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2461AQDG4ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2461AQDR ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2461AQDRG4ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TLV2461AQPWR ACTIVE TSSOP PW82000TBD CU NIPDAU Level-1-220C-UNLIM TLV2461AQPWRG4ACTIVE TSSOP PW82000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2461CD ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2461CDBVR ACTIVE SOT-23DBV51Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2461CDBVRG4ACTIVE SOT-23DBV51Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2461CDBVT ACTIVE SOT-23DBV5250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2461CDBVTG4ACTIVE SOT-23DBV5250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2461CDG4ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2461CDR ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2461CDRG4ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2461CP ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTLV2461CPE4ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTLV2461ID ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2461IDBVR ACTIVE SOT-23DBV53000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)TLV2461IDBVRG4ACTIVE SOT-23DBV53000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2461IDBVT ACTIVE SOT-23DBV5250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2461IDBVTG4ACTIVE SOT-23DBV5250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2461IDG4ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2461IDR ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2461IDRG4ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2461IP ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTLV2461IPE4ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU N/A for Pkg Type TLV2461MFKB ACTIVE LCCC FK201TBD POST-PLATE N/A for Pkg Type TLV2461MJGB ACTIVE CDIP JG81TBD A42N/A for Pkg Type TLV2461MUB ACTIVE CFP U101TBD A42N/A for Pkg Type TLV2461QD ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2461QDG4ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2461QDR ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2461QDRG4ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TLV2461QPWR ACTIVE TSSOP PW82000TBD CU NIPDAU Level-1-220C-UNLIM TLV2461QPWRG4ACTIVE TSSOP PW82000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2462AID ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2462AIDG4ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2462AIDR ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2462AIDRG4ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2462AIP ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTLV2462AIPE4ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU N/A for Pkg Type TLV2462AMFKB ACTIVE LCCC FK201TBD POST-PLATE N/A for Pkg Type TLV2462AMJG ACTIVE CDIP JG81TBD A42N/A for Pkg Type TLV2462AMJGB ACTIVE CDIP JG81TBD A42N/A for Pkg Type TLV2462AMUB ACTIVE CFP U101TBD A42N/A for Pkg Type TLV2462AQD ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2462AQDG4ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)TLV2462AQDR ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2462AQDRG4ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TLV2462AQPWR ACTIVE TSSOP PW82000TBD CU NIPDAU Level-1-220C-UNLIM TLV2462AQPWRG4ACTIVE TSSOP PW82000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2462CD ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2462CDG4ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2462CDGK ACTIVE MSOP DGK880Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2462CDGKG4ACTIVE MSOP DGK880Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2462CDGKR ACTIVE MSOP DGK82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2462CDGKRG4ACTIVE MSOP DGK82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2462CDR ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2462CDRG4ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2462CP ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTLV2462CPE4ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTLV2462ID ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2462IDG4ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2462IDGK ACTIVE MSOP DGK880Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2462IDGKG4ACTIVE MSOP DGK880Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2462IDGKR ACTIVE MSOP DGK82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2462IDGKRG4ACTIVE MSOP DGK82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2462IDR ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2462IDRG4ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2462IP ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTLV2462IPE4ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTLV2462MFKB ACTIVE LCCC FK201TBD POST-PLATE N/A for Pkg Type TLV2462MJGB ACTIVE CDIP JG81TBD A42N/A for Pkg Type TLV2462MUB ACTIVE CFP U101TBD A42N/A for Pkg Type TLV2462QD ACTIVE SOIC D875Green(RoHS&CU NIPDAU Level-1-260C-UNLIMOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)no Sb/Br)TLV2462QDG4ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2462QDR ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2462QDRG4ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TLV2462QPW ACTIVE TSSOP PW8150TBD CU NIPDAU Level-1-220C-UNLIM TLV2462QPWG4ACTIVE TSSOP PW8150Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TLV2462QPWR ACTIVE TSSOP PW82000TBD CU NIPDAU Level-1-220C-UNLIM TLV2462QPWRG4ACTIVE TSSOP PW82000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2463AIDR ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2463AIDRG4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2463AIN ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTLV2463AINE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg Type TLV2463AMFKB ACTIVE LCCC FK201TBD POST-PLATE N/A for Pkg Type TLV2463AMJ ACTIVE CDIP J141TBD A42N/A for Pkg Type TLV2463AMJB ACTIVE CDIP J141TBD A42N/A for Pkg Type TLV2463AQD ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2463AQDG4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2463AQDR ACTIVE SOIC D1475Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2463AQDRG4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TLV2463AQPWR ACTIVE TSSOP PW142000TBD CU NIPDAU Level-1-250C-UNLIM TLV2463AQPWRG4ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2463CD ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2463CDG4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2463CDGS ACTIVE MSOP DGS1080Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2463CDGSG4ACTIVE MSOP DGS1080Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2463CDGSR ACTIVE MSOP DGS102500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2463CDGSRG4ACTIVE MSOP DGS102500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2463CDR ACTIVE SOIC D142500Green(RoHS&no Sb/Br)Call TI Level-1-260C-UNLIM TLV2463CDRG4ACTIVE SOIC D142500Green(RoHS&Call TI Level-1-260C-UNLIMOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)no Sb/Br)TLV2463CN ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTLV2463CNE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTLV2463ID ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2463IDG4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2463IDGS ACTIVE MSOP DGS1080Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2463IDGSG4ACTIVE MSOP DGS1080Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2463IDGSR ACTIVE MSOP DGS102500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2463IDGSRG4ACTIVE MSOP DGS102500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2463IN ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTLV2463INE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg Type TLV2463MFKB ACTIVE LCCC FK201TBD POST-PLATE N/A for Pkg Type TLV2463MJB ACTIVE CDIP J141TBD A42N/A for Pkg Type TLV2463QD ACTIVE SOIC D1475Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2463QDG4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2463QDR ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2463QDRG4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TLV2463QPWR ACTIVE TSSOP PW142000TBD CU NIPDAU Level-1-250C-UNLIM TLV2463QPWRG4ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2464AID ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2464AIDG4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2464AIDR ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2464AIDRG4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2464AIN ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTLV2464AINE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTLV2464AIPW ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2464AIPWG4ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2464AIPWR ACTIVE TSSOP PW142000Green(RoHS&CU NIPDAU Level-1-260C-UNLIMOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)no Sb/Br)TLV2464AIPWRG4ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2464CD ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2464CDG4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2464CDR ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2464CDRG4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2464CN ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTLV2464CNE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTLV2464CPW ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2464CPWG4ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2464CPWR ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2464CPWRG4ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2464ID ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2464IDG4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2464IDR ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2464IDRG4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2464IN ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTLV2464INE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTLV2464IPW ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2464IPWG4ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2464IPWR ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2464IPWRG4ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2465AID ACTIVE SOIC D1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2465AIDG4ACTIVE SOIC D1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2465AIPWR ACTIVE TSSOP PW162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2465AIPWRG4ACTIVE TSSOP PW162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)TLV2465CD ACTIVE SOIC D1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2465CDG4ACTIVE SOIC D1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2465CDR ACTIVE SOIC D162500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2465CDRG4ACTIVE SOIC D162500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2465CN ACTIVE PDIP N1625Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTLV2465CNE4ACTIVE PDIP N1625Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTLV2465CPWR ACTIVE TSSOP PW162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2465CPWRG4ACTIVE TSSOP PW162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2465ID ACTIVE SOIC D1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2465IDG4ACTIVE SOIC D1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2465IDR ACTIVE SOIC D162500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2465IDRG4ACTIVE SOIC D162500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2465IN ACTIVE PDIP N1625Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTLV2465INE4ACTIVE PDIP N1625Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTLV2465IPW ACTIVE TSSOP PW1690Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2465IPWG4ACTIVE TSSOP PW1690Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2465IPWR ACTIVE TSSOP PW162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2465IPWRG4ACTIVE TSSOP PW162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS),Pb-Free(RoHS Exempt),or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free(RoHS Exempt):This component has a RoHS exemption for either1)lead-based flip-chip solder bumps used between the die and package,or2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free(RoHS compatible)as defined above.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flameretardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TIto Customer on an annual basis.OTHER QUALIFIED VERSIONS OF TLV2460,TLV2460A,TLV2460AM,TLV2460M,TLV2461,TLV2461A,TLV2461AM,TLV2461M,TLV2462, TLV2462A,TLV2462AM,TLV2462M,TLV2463,TLV2463A,TLV2463AM,TLV2463M,TLV2464A:•Automotive:TLV2460-Q1,TLV2460A-Q1,TLV2461-Q1,TLV2461A-Q1,TLV2462-Q1,TLV2462A-Q1,TLV2463-Q1,TLV2463A-Q1, TLV2464A-Q1•Enhanced Product:TLV2462A-EP,TLV2464A-EPNOTE:Qualified Version Definitions:•Automotive-Q100devices qualified for high-reliability automotive applications targeting zero defects•Enhanced Product-Supports Defense,Aerospace and Medical ApplicationsTAPE AND REEL INFORMATION*All dimensions are nominal Device Package Type Package DrawingPinsSPQ Reel Diameter (mm)Reel Width W1(mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant TLV2460AIDR SOICD 82500330.012.4 6.4 5.2 2.18.012.0Q1TLV2460CDBVR SOT-23DBV 63000180.09.0 3.15 3.2 1.4 4.08.0Q3TLV2460CDBVT SOT-23DBV 6250180.09.0 3.15 3.2 1.4 4.08.0Q3TLV2460CDR SOICD 82500330.012.4 6.4 5.2 2.18.012.0Q1TLV2460IDBVR SOT-23DBV 63000180.09.0 3.15 3.2 1.4 4.08.0Q3TLV2460IDBVT SOT-23DBV 6250180.09.0 3.15 3.2 1.4 4.08.0Q3TLV2460IDR SOICD 82500330.012.4 6.4 5.2 2.18.012.0Q1TLV2461AIDR SOICD 82500330.012.4 6.4 5.2 2.18.012.0Q1TLV2461CDBVR SOT-23DBV 51180.09.0 3.15 3.2 1.4 4.08.0Q3TLV2461CDBVT SOT-23DBV 5250180.09.0 3.15 3.2 1.4 4.08.0Q3TLV2461CDR SOICD 82500330.012.4 6.4 5.2 2.18.012.0Q1TLV2461IDBVR SOT-23DBV 53000180.09.0 3.15 3.2 1.4 4.08.0Q3TLV2461IDBVT SOT-23DBV 5250180.09.0 3.15 3.2 1.4 4.08.0Q3TLV2461IDR SOICD 82500330.012.4 6.4 5.2 2.18.012.0Q1TLV2462AIDR SOICD 82500330.012.4 6.4 5.2 2.18.012.0Q1TLV2462CDGKR MSOPDGK 82500330.012.4 5.3 3.4 1.48.012.0Q1TLV2462CDR SOICD 82500330.012.4 6.4 5.2 2.18.012.0Q1TLV2462IDGKR MSOP DGK 82500330.012.4 5.3 3.4 1.48.012.0Q1Device PackageType PackageDrawingPins SPQ ReelDiameter(mm)ReelWidthW1(mm)A0(mm)B0(mm)K0(mm)P1(mm)W(mm)Pin1QuadrantTLV2462IDR SOIC D8*******.012.4 6.4 5.2 2.18.012.0Q1 TLV2463AIDR SOIC D142500330.016.4 6.59.0 2.18.016.0Q1 TLV2463CDGSR MSOP DGS102500330.012.4 5.3 3.4 1.48.012.0Q1 TLV2463CDR SOIC D142500330.016.4 6.59.0 2.18.016.0Q1 TLV2463IDGSR MSOP DGS102500330.012.4 5.3 3.4 1.48.012.0Q1 TLV2464AIDR SOIC D142500330.016.4 6.59.0 2.18.016.0Q1 TLV2464AIPWR TSSOP PW142000330.012.47.0 5.6 1.68.012.0Q1 TLV2464CDR SOIC D142500330.016.4 6.59.0 2.18.016.0Q1 TLV2464CPWR TSSOP PW142000330.012.47.0 5.6 1.68.012.0Q1 TLV2464IDR SOIC D142500330.016.4 6.59.0 2.18.016.0Q1 TLV2464IPWR TSSOP PW142000330.012.47.0 5.6 1.68.012.0Q1 TLV2465AIPWR TSSOP PW162000330.012.47.0 5.6 1.68.012.0Q1 TLV2465CDR SOIC D162500330.016.4 6.510.3 2.18.016.0Q1 TLV2465CPWR TSSOP PW162000330.012.47.0 5.6 1.68.012.0Q1 TLV2465IDR SOIC D162500330.016.4 6.510.3 2.18.016.0Q1 TLV2465IPWR TSSOP PW162000330.012.47.0 5.6 1.68.012.0Q1*All dimensions are nominalDevice Package Type Package Drawing Pins SPQ Length(mm)Width(mm)Height(mm) TLV2460AIDR SOIC D8*******.0346.029.0Device Package Type Package Drawing Pins SPQ Length(mm)Width(mm)Height(mm) TLV2460CDBVR SOT-23DBV63000182.0182.020.0 TLV2460CDBVT SOT-23DBV6250182.0182.020.0 TLV2460CDR SOIC D8*******.0346.029.0 TLV2460IDBVR SOT-23DBV63000182.0182.020.0 TLV2460IDBVT SOT-23DBV6250182.0182.020.0 TLV2460IDR SOIC D8*******.0346.029.0 TLV2461AIDR SOIC D8*******.0346.029.0 TLV2461CDBVR SOT-23DBV51182.0182.020.0 TLV2461CDBVT SOT-23DBV5250182.0182.020.0 TLV2461CDR SOIC D8*******.0346.029.0 TLV2461IDBVR SOT-23DBV53000182.0182.020.0 TLV2461IDBVT SOT-23DBV5250182.0182.020.0 TLV2461IDR SOIC D8*******.0346.029.0 TLV2462AIDR SOIC D8*******.0346.029.0 TLV2462CDGKR MSOP DGK82500358.0335.035.0 TLV2462CDR SOIC D8*******.5338.120.6 TLV2462IDGKR MSOP DGK82500358.0335.035.0 TLV2462IDR SOIC D8*******.0346.029.0 TLV2463AIDR SOIC D142500346.0346.033.0 TLV2463CDGSR MSOP DGS102500358.0335.035.0 TLV2463CDR SOIC D142500346.0346.033.0 TLV2463IDGSR MSOP DGS102500358.0335.035.0 TLV2464AIDR SOIC D142500333.2345.928.6 TLV2464AIPWR TSSOP PW142000346.0346.029.0 TLV2464CDR SOIC D142500333.2345.928.6 TLV2464CPWR TSSOP PW142000346.0346.029.0 TLV2464IDR SOIC D142500333.2345.928.6 TLV2464IPWR TSSOP PW142000346.0346.029.0 TLV2465AIPWR TSSOP PW162000346.0346.029.0 TLV2465CDR SOIC D162500346.0346.033.0 TLV2465CPWR TSSOP PW162000346.0346.029.0 TLV2465IDR SOIC D162500346.0346.033.0 TLV2465IPWR TSSOP PW162000346.0346.029.0。
FW246X使用手册
仿真器FW246X1基本说明FW246X仿真器用于实现控制站的仿真功能。
它可以实现控制方案的离线调试、在不外接I/O 卡件的条件下进行组态测试、图形化编程语言的调试，还可以利用它检查修改后的程序的正确性。
系统在现场正式投运后，控制程序是不允许随意更改并下载到主控制卡中的，此时如果修改控制程序，需验证其正确性，保证程序没有问题后才可以下载到主控制卡中。
因此在控制程序修改后可用仿真器检查程序的正确性，然后再下载到主控制卡，保证现场运行的安全性和可靠性。
FW246X可用作主控制卡为XP243X、FW243X和FW247的控制系统的仿真器。
2使用说明FW246X仿真器与电源连接如图 2-1所示：图 2-1仿真器与电源连接示意图为保证安全使用，必须使用随仿真器配带的5VDC电源。
（注：实物的电源接口在网口的对面，为方便观看，将其移至图示位置）仿真器具有两个互为冗余的过程控制网SCnetⅡ通讯口和7个LED状态指示灯，如下图所示。
图 2-2仿真器面版正面2.1网络端口PORT-A：通讯端口A，通过双绞线RJ-45连接器与冗余网络SCnetⅡ的A网络相连或通过对接线RJ-45连接器与工程师站的A网卡相连；PORT-B：通讯端口B，通过双绞线RJ-45连接器与冗余网络SCnetⅡ的B网络相连或通过对接线RJ-45连接器与工程师站的B网卡相连；2.2网络连接仿真器可直接接入过程控制网，也可通过RJ-45对接线直接与工程师站连接，如下图所示。
图 2-3仿真器直接接入过程控制网图 2-4仿真器直接与操作站连接2.3 LED 状态指示灯¾ FAIL ：故障报警或复位指示； ¾ RUN ：工作模块运行指示； ¾ WORK ：工作/备用指示；¾ STDBY ：准备就绪指示，备用模块运行指示； ¾ LED-A ：本模块的通讯网络端口A 的通讯状态指示灯； ¾ LED-B ：本模块的通讯网络端口B 的通讯状态指示灯；¾ SLV AE ：Slave CPU 运行指示，包括网络通信和I/O 采样运行指示。
光电二极管 运放型号
光电二极管运放型号
光电二极管是一种能够将光能转化为电能的半导体器件，常用于光通信、光电探测等领域。
为你提供部分运放型号：
- MCP6L02T-E/MS：这是一款便携式IC，常用于光电二极管放大器，其工作频率为1MHz，电流为85µA。
- RS622：采用COMS工艺设计，具有7MHz的高增益带宽乘积和0.7mV的失调电压，适合用于电池供电的指夹血氧仪等设备中。
- TSV7722：一款高精度高带宽运算放大器，可实现22MHz的增益带宽和11V/μs的圧摆率，适合在功率变换电路和光学传感器中进行高速信号调理和精确电流测量。
输入失调电压低至200µV，输入电压噪声密度低至7nV/√Hz，可以准确地测量低边电流。
输入偏置电流典型值为2pA，可以在烟火探测器等光电感测应用中准确测量光电二极管电流。
- LTA604x：高速电压反馈运算放大器，具有140MHz带宽和107 V/us的压摆率。
输出电压范围可以达到任何供电轨35mv内，适合在低电压应用。
同时，LTA604x提供极好的低谐波失真和快速稳定时间，能成为理想的ADC缓冲前端。
- JI57X：是一款集成低噪声JFET放大器的Si硅光电二极管，可采用单电压电源，具有非常低的漂移和高的动态范围。
适合于辐射测量，光谱分析以及医学诊断。
其芯片尺寸为7mm²，光谱响应范围位于400-1100nm。
在实际应用中，需要根据具体需求选择合适的运算放大器和光电二极管，以确保系统的性能和稳定性。
ASUS VA246系列液晶显示器用户指南说明书
VA246 系列液晶显示器用户指南第一版2022 年 3 月版权所有 © 2022 ASUSTeK COMPUTER INC. 保留所有权利。
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ASUS“按原样”提供本手册，不提供任何明示或隐含的担保，包括但不限于对于适销性或针对特定目的的适用性的隐含担保或条件。
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本手册中出现的产品名称和公司名称可能分别是或不是相应公司的注册商标或版权，仅用于标示或解释目的，无意侵犯其所有者的权益。
ii目录 (iii)声明 (iv)安全信息 (vi)保养和清洁 (vii)Takeback Services (viii)欧盟能源标签产品信息 (viii)TCO 认证 (ix)第 1 章：产品介绍1.1 欢迎使用！ ...................................................................................1-11.2 物品清单.........................................................................................1-11.3 显示器简介 .....................................................................................1-21.3.1 前部概览..........................................................................1-21.3.2 后部概览..........................................................................1-3第 2 章：设置2.1 安装显示器支撑臂/底座 ................................................................2-12.2 卸下支撑臂/底座（VESA 壁挂安装时） .......................................2-22.3 调整显示器 .....................................................................................2-32.4 连接线缆.........................................................................................2-42.5 打开显示器电源 ..............................................................................2-4第 3 章：一般说明3.1 OSD（屏幕显示）菜单...................................................................3-13.1.1 如何重新配置 ..................................................................3-13.1.2 OSD功能介绍.................................................................3-23.2 规格摘要.......................................................................................3-103.3 外形尺寸.......................................................................................3-123.4 故障排除（常见问题） .................................................................3-133.5 支持的运行模式 ............................................................................3-14iiiiv联邦通信委员会声明本设备符合 FCC 规则第 15 部分的要求。
tlv274
Printed or Pin 1Pin 1PACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)TLV271CD ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV271CDBVR ACTIVE SOT-23DBV53000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV271CDBVRG4ACTIVE SOT-23DBV53000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV271CDBVT ACTIVE SOT-23DBV5250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV271CDBVTG4ACTIVE SOT-23DBV5250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV271CDG4ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV271CDR ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV271CDRG4ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV271ID ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV271IDBVR ACTIVE SOT-23DBV53000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV271IDBVRG4ACTIVE SOT-23DBV53000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV271IDBVT ACTIVE SOT-23DBV5250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV271IDBVTG4ACTIVE SOT-23DBV5250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV271IDG4ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV271IP ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTLV271IPE4ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTLV272CD ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV272CDG4ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV272CDGK ACTIVE MSOP DGK880Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV272CDGKG4ACTIVE MSOP DGK880Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV272CDGKR ACTIVE MSOP DGK82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV272CDGKRG4ACTIVE MSOP DGK82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV272CDR ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV272CDRG4ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV272ID ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)TLV272IDG4ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV272IDGK ACTIVE MSOP DGK880Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV272IDGKG4ACTIVE MSOP DGK880Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV272IDGKR ACTIVE MSOP DGK82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV272IDGKRG4ACTIVE MSOP DGK82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV272IDR ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV272IDRG4ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV272IP ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTLV272IPE4ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTLV274CD ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV274CDG4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV274CDR ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV274CDRG4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV274CPW ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV274CPWG4ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV274CPWR ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV274CPWRG4ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV274ID ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV274IDG4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV274IDR ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV274IDRG4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV274IN ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTLV274INE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTLV274IPW ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV274IPWG4ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV274IPWR ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)TLV274IPWRG4ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS),Pb-Free(RoHS Exempt),or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free(RoHS Exempt):This component has a RoHS exemption for either1)lead-based flip-chip solder bumps used between the die and package,or2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free(RoHS compatible)as defined above.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.OTHER QUALIFIED VERSIONS OF TLV271,TLV272,TLV274:•Automotive:TLV271-Q1,TLV272-Q1,TLV274-Q1NOTE:Qualified Version Definitions:•Automotive-Q100devices qualified for high-reliability automotive applications targeting zero defectsTAPE AND REELINFORMATION*Alldimensions are nominalDevicePackage Type Package Drawing Pins SPQReel Diameter (mm)Reel Width W1(mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant TLV271CDBVR SOT-23DBV 53000178.09.0 3.23 3.17 1.37 4.08.0Q3TLV271CDBVT SOT-23DBV 5250178.09.0 3.23 3.17 1.37 4.08.0Q3TLV271CDR SOIC D 82500330.012.4 6.4 5.2 2.18.012.0Q1TLV271IDBVR SOT-23DBV 53000178.09.0 3.23 3.17 1.37 4.08.0Q3TLV271IDBVT SOT-23DBV 5250178.09.0 3.23 3.17 1.37 4.08.0Q3TLV272CDGKR MSOP DGK 82500330.012.4 5.3 3.4 1.48.012.0Q1TLV272CDR SOIC D 82500330.012.4 6.4 5.2 2.18.012.0Q1TLV272IDGKR MSOP DGK 82500330.012.4 5.3 3.4 1.48.012.0Q1TLV272IDR SOIC D 82500330.012.4 6.4 5.2 2.18.012.0Q1TLV274CDR SOIC D 142500330.016.4 6.59.0 2.18.016.0Q1TLV274CPWR TSSOP PW 142000330.012.4 6.9 5.6 1.68.012.0Q1TLV274IDR SOIC D 142500330.016.4 6.59.0 2.18.016.0Q1TLV274IPWRTSSOPPW142000330.012.46.95.61.68.012.0Q1PACKAGE MATERIALS INFORMATION5-Nov-2010*All dimensionsare nominal DevicePackage Type Package Drawing Pins SPQ Length (mm)Width (mm)Height (mm)TLV271CDBVRSOT-23DBV 53000180.0180.018.0TLV271CDBVTSOT-23DBV 5250180.0180.018.0TLV271CDRSOIC D 82500340.5338.120.6TLV271IDBVRSOT-23DBV 53000180.0180.018.0TLV271IDBVTSOT-23DBV 5250180.0180.018.0TLV272CDGKRMSOP DGK 82500358.0335.035.0TLV272CDRSOIC D 82500340.5338.120.6TLV272IDGKRMSOP DGK 82500358.0335.035.0TLV272IDRSOIC D 82500340.5338.120.6TLV274CDRSOIC D 142500333.2345.928.6TLV274CPWRTSSOP PW 142000346.0346.029.0TLV274IDRSOIC D 142500333.2345.928.6TLV274IPWR TSSOP PW 142000346.0346.029.0PACKAGE MATERIALS INFORMATION 5-Nov-2010Pack Materials-Page 2IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements,improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with 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红宝石尺寸表
NO. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36
型号 2 SWZ 330 M R 09 2 SXE 220 M EFC 2.5 BMB 2R2 M EFC 8X16 2.5 DMB 2R2 M EFC 8X16 2.5 DMB 30 M 16X35.5 2.5 DSA 1900 M 51X135 4 SEV 220 M 6.3X5.5 6 SW 180 M 6 SW 220 M R15 6 SXB 100 M R15 6.3 MBZ 2200 M EFC 10X20 6.3 MCZ 1500 M EFC 10X12.5 6.3 MS7 100 M EFC 5X7 6.3 MS7 220 M EFC 6.3X7 6.3 NA 220 M 6.3X11 6.3 NA 100 M 5X11 6.3 NXA 220 M EFC 6.3X11 6.3 NXA 100 M EFC 5X11 6.3 PK 1000 M EFC 8X11.5 6.3 PK 3300 M EFC 10X20 6.3 SEV 47 M 4X5.5 6.3 SEV 100 M VIT 6.3X5.5 6.3 SEV 47 M VIT 4X5.5 6.3 SEV 100 M 6.3X5.5 6.3 SEV 22 M 4X5.5 6.3 SGV 47 M 5X6.1 6.3 SGV 220 M 6.3X8 6.3 SGV 470 M 8X10.5 6.3 SGV 1000 M 10X10.5 6.3 SKV 1000 M 10X10.5 6.3 TFV 470 M 8X10.5 6.3 TWL 100 M 6.3X7 6.3 TZV 1000 M 8X10.5 6.3 TZV 330 M 6.3X8 6.3 YK 1000 M EFC 8X11.5 6.3 YK 220 M EFC 5X11
TMC246微步驱动芯片的原理与应用
TMC246微步驱动芯片的原理与应用（苏州钧信自动控制有限公司高伟）摘要：TMC246是一款双全桥驱动器IC，适用于双极步进电机控制。
用户可选择105℃高温运行或每相1.5A的大电流工作类别的产品。
该产品具有电流消耗低、效率高的特点，并提供了内部DAC，可实现微步进调节和智能控制功能，强化电机和驱动器的冷却。
该器件还能通过串行接口(SPI)或模/数输入信号进行控制，并集成了短路、过热、欠压和过压保护功能。
关键词：双全桥；SPI；PWM；DAC；1．TMC246的主要性能TMC246是一款双全桥驱动芯片，适用于双极性步进电机的驱动。
内部集成专利技术无传感器的失速检测功能可用在无需外部传感器的位置控制中；该功能还可以预测电机的超载情况，适用于需要高可靠性的场合。
芯片内部集成MOSFETs，采用独特的Low-RDS-ON技术达到低功耗，高效率性能，强化电机和驱动器的自身冷却无需外部的散热设备，即使在外部环境温度很高的情况下也可以实现1.5A的驱动电流输出。
TMC246的低功耗，高效率，体积小的设计理念使其成为嵌入式运动控制甚至电池供电设备的完美选择，内部集成的DAC功能可实现对电流的微步控制，TMC246可通过SPI串行接口或模拟/数字信号输入控制，另外该芯片还具有短路，过温，欠压，过载等保护功能。
●集成无传感器的失速探测功能（StallGuard）和负荷测量功能●通过简单便捷的SPI串行总线控制或外部模拟/数字信号控制●短路，过温，过压保护功能●内部集成4bitDAC自身可实现16倍的微步细分功能通过SPI可扩展到64倍细分●可以实现通过外部的模拟信号来实现任意的细分控制●具有实现电机平滑控制的混合衰减功能●通过单一电容或外部的时钟实现频率的编程控制●7V-34V电机驱动电压●高达1.5A的电机驱动电流，即使在外部温度105℃时也可以输出0.8A的电流● 3.3或5V的数字控制电压●低功耗，高效率的RDS-ON电源设计2．TMC246封装方式（1）IC没有按照汽车标准进行测试，但是完全可以用应在汽车行业依照其温度范围。
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Pin 1Pin 1PACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)5962-0051201Q2A ACTIVE LCCC FK201TBD POST-PLATE N/A for Pkg Type 5962-0051201QHA ACTIVE CFP U101TBD A42SNPB N/A for Pkg Type 5962-0051201QPA ACTIVE CDIP JG81TBD A42SNPB N/A for Pkg Type 5962-0051202Q2A ACTIVE LCCC FK201TBD POST-PLATE N/A for Pkg Type 5962-0051202QHA ACTIVE CFP U101TBD A42SNPB N/A for Pkg Type 5962-0051202QPA ACTIVE CDIP JG81TBD A42SNPB N/A for Pkg Type 5962-0051203Q2A ACTIVE LCCC FK201TBD POST-PLATE N/A for Pkg Type 5962-0051203QHA ACTIVE CFP U101TBD A42SNPB N/A for Pkg Type 5962-0051203QPA ACTIVE CDIP JG81TBD A42SNPB N/A for Pkg Type 5962-0051204Q2A ACTIVE LCCC FK201TBD POST-PLATE N/A for Pkg Type 5962-0051204QHA ACTIVE CFP U101TBD A42SNPB N/A for Pkg Type 5962-0051204QPA ACTIVE CDIP JG81TBD A42SNPB N/A for Pkg Type 5962-0051205Q2A ACTIVE LCCC FK201TBD POST-PLATE N/A for Pkg Type 5962-0051205QHA ACTIVE CFP U101TBD A42SNPB N/A for Pkg Type 5962-0051205QPA ACTIVE CDIP JG81TBD A42SNPB N/A for Pkg Type 5962-0051206Q2A ACTIVE LCCC FK201TBD POST-PLATE N/A for Pkg Type 5962-0051206QHA ACTIVE CFP U101TBD A42SNPB N/A for Pkg Type 5962-0051206QPA ACTIVE CDIP JG81TBD A42SNPB N/A for Pkg Type 5962-0051207Q2A ACTIVE LCCC FK201TBD POST-PLATE N/A for Pkg Type 5962-0051207QCA ACTIVE CDIP J141TBD A42SNPB N/A for Pkg Type 5962-0051208Q2A ACTIVE LCCC FK201TBD POST-PLATE N/A for Pkg Type 5962-0051208QCA ACTIVE CDIP J141TBD A42SNPB N/A for Pkg Type TLV2460AIDR ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2460AIP ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTLV2460AIPE4ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU N/A for Pkg Type TLV2460AMFKB ACTIVE LCCC FK201TBD POST-PLATE N/A for Pkg Type TLV2460AMJG ACTIVE CDIP JG81TBD A42SNPB N/A for Pkg Type TLV2460AMJGB ACTIVE CDIP JG81TBD A42SNPB N/A for Pkg Type TLV2460AMUB ACTIVE CFP U101TBD A42SNPB N/A for Pkg TypeTLV2460AQD ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-UNLIM/Level-1-235C-UNLIMTLV2460AQDR ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-UNLIM/Level-1-235C-UNLIMTLV2460AQPW ACTIVE TSSOP PW8150TBD CU NIPDAU Level-1-220C-UNLIM TLV2460AQPWR ACTIVE TSSOP PW82000TBD CU NIPDAU Level-1-220C-UNLIM TLV2460CD ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2460CDBVR ACTIVE SOT-23DBV63000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2460CDBVRG4ACTIVE SOT-23DBV63000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)TLV2460CDBVT ACTIVE SOT-23DBV6250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2460CDBVTG4ACTIVE SOT-23DBV6250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2460CDR ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2460CDRG4ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2460CP ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTLV2460CPE4ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTLV2460ID ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2460IDBVR ACTIVE SOT-23DBV63000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2460IDBVRG4ACTIVE SOT-23DBV63000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2460IDBVT ACTIVE SOT-23DBV6250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2460IDBVTG4ACTIVE SOT-23DBV6250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2460IDR ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2460IDRG4ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2460IP ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTLV2460IPE4ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU N/A for Pkg Type TLV2460MFKB ACTIVE LCCC FK201TBD POST-PLATE N/A for Pkg Type TLV2460MJG ACTIVE CDIP JG81TBD A42SNPB N/A for Pkg Type TLV2460MJGB ACTIVE CDIP JG81TBD A42SNPB N/A for Pkg Type TLV2460MUB ACTIVE CFP U101TBD A42SNPB N/A for Pkg TypeTLV2460QD ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-UNLIM/Level-1-235C-UNLIMTLV2460QDR ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-UNLIM/Level-1-235C-UNLIMTLV2460QPW ACTIVE TSSOP PW8150TBD CU NIPDAU Level-1-220C-UNLIM TLV2460QPWR ACTIVE TSSOP PW82000TBD CU NIPDAU Level-1-220C-UNLIM TLV2461AID ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2461AIDR ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2461AIDRG4ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2461AIP ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTLV2461AIPE4ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)TLV2461AMFKB ACTIVE LCCC FK201TBD POST-PLATE N/A for Pkg Type TLV2461AMJGB ACTIVE CDIP JG81TBD A42SNPB N/A for Pkg Type TLV2461AMUB ACTIVE CFP U101TBD A42SNPB N/A for Pkg TypeTLV2461AQD ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-UNLIM/Level-1-235C-UNLIMTLV2461AQDR ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-UNLIM/Level-1-235C-UNLIMTLV2461AQPW ACTIVE TSSOP PW8150TBD Call TI Call TITLV2461AQPWR ACTIVE TSSOP PW82000TBD CU NIPDAU Level-1-220C-UNLIM TLV2461CD ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2461CDBVR ACTIVE SOT-23DBV53000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2461CDBVRG4ACTIVE SOT-23DBV53000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2461CDBVT ACTIVE SOT-23DBV5250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2461CDBVTG4ACTIVE SOT-23DBV5250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2461CDR ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2461CDRG4ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2461CP ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTLV2461CPE4ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTLV2461ID ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2461IDBVR ACTIVE SOT-23DBV53000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2461IDBVRG4ACTIVE SOT-23DBV53000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2461IDBVT ACTIVE SOT-23DBV5250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2461IDBVTG4ACTIVE SOT-23DBV5250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2461IDG4ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2461IDR ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2461IDRG4ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2461IP ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTLV2461IPE4ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTLV2461MFKB ACTIVE LCCC FK201TBD POST-PLATE N/A for Pkg Type TLV2461MJGB ACTIVE CDIP JG81TBD A42SNPB N/A for Pkg Type TLV2461MUB ACTIVE CFP U101TBD A42SNPB N/A for Pkg TypeOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)TLV2461QD ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-UNLIM/Level-1-235C-UNLIMTLV2461QDR ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-UNLIM/Level-1-235C-UNLIMTLV2461QPW ACTIVE TSSOP PW8150TBD Call TI Call TITLV2461QPWR ACTIVE TSSOP PW82000TBD CU NIPDAU Level-1-220C-UNLIM TLV2462AID ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2462AIDR ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2462AIDRG4ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2462AIP ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTLV2462AIPE4ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU N/A for Pkg Type TLV2462AMFKB ACTIVE LCCC FK201TBD POST-PLATE N/A for Pkg Type TLV2462AMJG ACTIVE CDIP JG81TBD A42SNPB N/A for Pkg Type TLV2462AMJGB ACTIVE CDIP JG81TBD A42SNPB N/A for Pkg Type TLV2462AMUB ACTIVE CFP U101TBD A42SNPB N/A for Pkg TypeTLV2462AQD ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-UNLIM/Level-1-235C-UNLIMTLV2462AQDR ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-UNLIM/Level-1-235C-UNLIMTLV2462AQPWR ACTIVE TSSOP PW82000TBD CU NIPDAU Level-1-220C-UNLIM TLV2462CD ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2462CDG4ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2462CDGK ACTIVE MSOP DGK880Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2462CDGKR ACTIVE MSOP DGK82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2462CDGKRG4ACTIVE MSOP DGK82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2462CDR ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2462CDRG4ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2462CP ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTLV2462CPE4ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTLV2462ID ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2462IDG4ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2462IDGK ACTIVE MSOP DGK880Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TLV2462IDGKR ACTIVE MSOP DGK82500Green(RoHS&CU NIPDAU Level-1-260C-UNLIMOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)no Sb/Br)TLV2462IDGKRG4ACTIVE MSOP DGK82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2462IDR ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2462IDRG4ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2462IP ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTLV2462IPE4ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU N/A for Pkg Type TLV2462MFKB ACTIVE LCCC FK201TBD POST-PLATE N/A for Pkg Type TLV2462MJG ACTIVE CDIP JG81TBD A42SNPB N/A for Pkg Type TLV2462MJGB ACTIVE CDIP JG81TBD A42SNPB N/A for Pkg Type TLV2462MUB ACTIVE CFP U101TBD A42SNPB N/A for Pkg TypeTLV2462QD ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-UNLIM/Level-1-235C-UNLIMTLV2462QDR ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-UNLIM/Level-1-235C-UNLIMTLV2462QPW ACTIVE TSSOP PW8150TBD CU NIPDAU Level-1-220C-UNLIM TLV2462QPWR ACTIVE TSSOP PW82000TBD CU NIPDAU Level-1-220C-UNLIM TLV2463AID ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2463AIDG4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2463AIDR ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2463AIDRG4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2463AIN ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTLV2463AINE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg Type TLV2463AMFKB ACTIVE LCCC FK201TBD POST-PLATE N/A for Pkg Type TLV2463AMJ ACTIVE CDIP J141TBD A42SNPB N/A for Pkg Type TLV2463AMJB ACTIVE CDIP J141TBD A42SNPB N/A for Pkg TypeTLV2463AQD ACTIVE SOIC D1450Pb-Free(RoHS)CU NIPDAU Level-2-250C-1YEAR/Level-1-235C-UNLIMTLV2463AQDR ACTIVE SOIC D1475TBD CU NIPDAU Level-1-220C-UNLIM TLV2463AQPWR ACTIVE TSSOP PW142000TBD CU NIPD Level-1-250C-UNLIM TLV2463CD ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2463CDGS ACTIVE MSOP DGS1080Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2463CDGSG4ACTIVE MSOP DGS1080Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARTLV2463CDGSR ACTIVE MSOP DGS102500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TLV2463CDGSRG4ACTIVE MSOP DGS102500Green(RoHS&CU NIPDAU Level-1-260C-UNLIMOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)no Sb/Br)TLV2463CDR ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2463CDRG4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2463CN ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTLV2463CNE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTLV2463ID ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2463IDGS ACTIVE MSOP DGS1080Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2463IDGSR ACTIVE MSOP DGS102500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2463IDGSRG4ACTIVE MSOP DGS102500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2463IN ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTLV2463INE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg Type TLV2463MFKB ACTIVE LCCC FK201TBD POST-PLATE N/A for Pkg Type TLV2463MJ ACTIVE CDIP J141TBD A42SNPB N/A for Pkg Type TLV2463MJB ACTIVE CDIP J141TBD A42SNPB N/A for Pkg TypeTLV2463QD ACTIVE SOIC D1475Pb-Free(RoHS)CU NIPDAU Level-2-250C-1YEAR/Level-1-235C-UNLIMTLV2463QDR ACTIVE SOIC D1475TBD CU NIPDAU Level-1-220C-UNLIM TLV2463QPWR ACTIVE TSSOP PW142000TBD CU NIPD Level-1-250C-UNLIM TLV2464AID ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2464AIDR ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2464AIDRG4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2464AIN ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPD N/A for Pkg TypeTLV2464AINE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPD N/A for Pkg TypeTLV2464AIPW ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2464AIPWR ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2464AIPWRG4ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2464CD ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2464CDG4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2464CDR ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)TLV2464CDRG4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2464CN ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPD N/A for Pkg TypeTLV2464CNE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPD N/A for Pkg TypeTLV2464CPW ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2464CPWG4ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2464CPWR ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2464CPWRG4ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2464ID ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2464IDG4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2464IDR ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2464IDRG4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2464IN ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPD N/A for Pkg TypeTLV2464INE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPD N/A for Pkg TypeTLV2464IPW ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2464IPWG4ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2464IPWR ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2464IPWRG4ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2465AID ACTIVE SOIC D1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2465AIDG4ACTIVE SOIC D1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2465AIPWR ACTIVE TSSOP PW162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2465AIPWRG4ACTIVE TSSOP PW162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2465CD ACTIVE SOIC D1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2465CDR ACTIVE SOIC D162500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2465CDRG4ACTIVE SOIC D162500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2465CN ACTIVE PDIP N1625Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTLV2465CNE4ACTIVE PDIP N1625Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)TLV2465CPW ACTIVE TSSOP PW1690Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2465CPWR ACTIVE TSSOP PW162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2465CPWRG4ACTIVE TSSOP PW162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2465ID ACTIVE SOIC D1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2465IDG4ACTIVE SOIC D1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2465IDR ACTIVE SOIC D162500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2465IDRG4ACTIVE SOIC D162500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2465IN ACTIVE PDIP N1625Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTLV2465INE4ACTIVE PDIP N1625Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTLV2465IPW ACTIVE TSSOP PW1690Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2465IPWR ACTIVE TSSOP PW162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTLV2465IPWRG4ACTIVE TSSOP PW162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS),Pb-Free(RoHS Exempt),or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free(RoHS Exempt):This component has a RoHS exemption for either1)lead-based flip-chip solder bumps used between the die and package,or2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free(RoHS compatible)as defined above.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TIto Customer on an annual basis.。