5917631-6中文资料
甘露醇氯化钠琼脂培养基产品说明书
化学品安全技术说明书第一部分化学品及企业标识产品中文名称：甘露醇氯化钠琼脂培养基产品英文名称：Mannitol Salt Agar产品编号：024022企业名称：广东环凯微生物科技有限公司地址：广东省广州市黄埔区广州开发区科学城神舟路788号邮编：510663公司网址电子邮件地址：*********************传真号码：************销售热线：************-8602技术热线：************-8877/8876推荐用途和限制用途：生化研究/分析第二部分危险性概述GSH危害性类别非危险物质或混合物GSH标签要素非危险物质或混合物其它危害（健康危害、环境危害）未见报道第三部分成分/组成信息混合物化学品成分：参考培养基使用说明。
有害物质成分：无第四部分急救措施一般信息：无特殊的措施要求。
皮肤接触：立即用清水彻底清洗。
眼睛接触：立即提起眼睑，用大量流动清水冲洗15min。
如不适就医。
吸入：如果吸入，将人员移动到新鲜空气处，如果没有呼吸，进行人工呼吸操作，并联系医生。
食入：如误食，用水冲洗口腔，如不适就医。
就医信息：出示产品使用说明或者此MSDS。
第六部分 泄露应急处理个人防护： 穿个人实验服,佩戴手套和口罩,避免吸入干粉。
环境保护措施： 用湿布和地拖擦拭干净。
清洁/收集措施： 保持干燥。
迅速清洗弄脏的区域。
第七部分 操作处置与储存安全操作注意事项： 防止粉尘扬起，应提供通风设备。
储存注意事项： 贮存于避光、干燥处，用后立即旋紧瓶盖。
第八部分 接触控制/个人防护职业接触限值 没有已知的国家规定的暴露极限。
工程控制： 提供安全淋浴和洗眼设备个人保护措施 呼吸系统防护： 在通风橱里称取产品，佩戴口罩。
眼睛防护： 佩戴安全眼镜。
身体防护： 穿实验室服。
手防护： 戴防化学品手套。
其他防护： 常规的工业卫生操作，工作后及时清洗双手。
第九部分 理化特性外观： 粉末 pH 值： 无相关资料 颜色： 淡黄色 气味： 特征性 熔点： 无数据资料 沸点： 无数据资料 燃点： 无数据资料闪点：无数据资料爆炸限度 下限： 无数据资料 上限： 无数据资料 热分解： 无数据资料溶解性： 按产品使用说明上的用量比例加蒸馏水，加热煮沸至完全溶解，溶液呈红色澄清无沉淀。
六氟异丙醇产品信息
产品信息试剂名称： 六氟异丙醇(HFIP) 英文名称： 1,1,1,3,3,3-Hexafluoro-2-prop anol CAS 编号： 920-66-1 别名： 1,1,1,3,3,3六氟-2-异丙醇 Beilstein号1841007 MDL 号： M FCD00011651 分子式： C3H2F6O ；(CF3)2CHO HEINECS ：213-059-4 分子量： 168.04分子结构：产品描述产品描述：六氟异丙醇是一种特种含氟材料，密度高、粘度低、表面张力低。
其在紫外光（ <2000A ）下呈透明 , 且折射系数低。
可与水或大多数有机溶剂以任意比例互溶，但不溶于长链的烷烃。
水中溶解度:1000 g/L (25°C) 密度:1.596 闪点:4.4° 熔点:-4 °C 沸点:59 °C 折光率n20/D:1.275六氟异丙醇具有强氢键，可与大多数分子结合，并与多种的醚和胺形成稳定的、难以用分馏分离的结合物。
99.5%:外观Appearance 白色透明液体红外光谱鉴别Infrared spectrometry 和对照品匹配纯度Purity ≥99.5% (GC)水分Water <0.3 %相对密度Specific gravity (20/20°C) 1.6180 - 1.6220折光率Refractive index n20/D 1.2740 - 1.2770≥99.8%：外观Appearance Colorless Liquid红外光谱Infrared spectrum Conforms to Structure纯度Purity(GC) ≥99.80 %相对密度Specific gravity (20/20°C) 1.6180 - 1.6220折光率Refractive index n20/D 1.2740 - 1.2770for GC, ≥99.8% (G C)：外观Appearance Colorless Liquid红外光谱Infrared spectrum Conforms to Structure纯度Purity(GC) ≥99.80 %相对密度Specific gravity (20/20°C) 1.6180 - 1.6220折光率Refractive index n20/D 1.2740 - 1.2770水分water ≤0.05%蒸发残渣evapn. residue ≤0.0005%λ 1 cm path, H2O ref erenceUV absorption λ: 200 nm A: ≤0.3λ: 240 nm A: ≤0.01产品用途：酯化作用试剂,肽和肽中间体的高强溶剂。
1SMA5918BT3G中文资料
1SMA5913BT3 Series1.5 Watt PlasticSurface MountZener Voltage RegulatorsThis complete new line of 1.5 Watt Zener Diodes offers the following advantages.Features•Standard Zener Breakdown V oltage Range − 3.3 V to 68 V •ESD Rating of Class 3 (>16 kV) per Human Body Model •Flat Handling Surface for Accurate Placement •Package Design for Top Slide or Bottom Circuit Board Mounting •Low Profile Package•Ideal Replacement for MELF Packages•Pb−Free Packages are AvailableMechanical Characteristics:CASE:V oid-free, transfer-molded plasticFINISH:All external surfaces are corrosion resistant with readily solderable leadsMAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 secondsPOLARITY:Cathode indicated by molded polarity notch or cathode bandFLAMMABILITY RATING:UL 94 V−0 @ 0.125 inMAXIMUM RATINGSRating Symbol Value UnitDC Power Dissipation @ T L = 75°C, Measured Zero Lead Length (Note 1) Derate above 75°CThermal Resistance, Junction−to−LeadP DR q JL1.52050WmW/°C°C/WDC Power Dissipation @ T A = 25°C (Note 2) Derate above 25°CThermal Resistance, Junction−to−AmbientP DR q JA0.54.0250WmW/°C°C/WOperating and Storage Temperature Range T J, T stg−65 to+150°CStresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.1. 1 in square copper pad, FR−4 board.2.FR−4 Board, using ON Semiconductor minimum recommended footprint.Device Package Shipping†ORDERING INFORMATION1SMA59xxBT3SMA5000/Tape & Reel1SMA59xxBT3G SMA(Pb−Free)5000/Tape & Reel†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our T ape and Reel Packaging Specifications Brochure, BRD8011/D.See specific marking information in the device marking column of the Electrical Characteristics table on page 2 of this data sheet.DEVICE MARKING INFORMATIONELECTRICAL CHARACTERISTICS (T A = 25°C unlessotherwise noted, V F = 1.5 V Max. @ I F = 200 mA for all types)Symbol ParameterV Z Reverse Zener Voltage @ I ZT I ZT Reverse CurrentZ ZT Maximum Zener Impedance @ I ZT I ZK Reverse CurrentZ ZK Maximum Zener Impedance @ I ZK I R Reverse Leakage Current @ V R V R Reverse Voltage I F Forward Current V F Forward Voltage @ I F I ZMMaximum DC Zener CurrentELECTRICAL CHARACTERISTICS (T A = 25°C unless otherwise noted, V F = 1.5 V Max. @ I F = 200 mA for all types)Device* (Note 3)Device Marking Zener Voltage (Note 4)Zener Impedance Leakage CurrentI ZM V Z (Volts)@ I ZT Z ZT @ I ZTZ ZK @ I ZK I R @ V R Min Nom Max mA W W mA m A Volts mA(dc)1SMA5913BT3, G 813B 3.13 3.3 3.47113.610500 1.050 1.04551SMA5914BT3, G 814B 3.42 3.6 3.78104.29.0500 1.035.5 1.04171SMA5915BT3, G 815B 3.70 3.9 4.1096.17.5500 1.012.5 1.03851SMA5916BT3, G 816B 4.08 4.3 4.5287.2 6.0500 1.0 2.5 1.03491SMA5917BT3, G 817B 4.46 4.7 4.9479.8 5.0500 1.0 2.5 1.53191SMA5918BT3, G 818B 4.84 5.1 5.3673.5 4.0350 1.0 2.5 2.02941SMA5919BT3, G 819B 5.32 5.6 5.8866.9 2.0250 1.0 2.5 3.02681SMA5920BT3, G 820B 5.89 6.2 6.5160.5 2.0200 1.0 2.5 4.02421SMA5921BT3, G 821B 6.46 6.87.1455.1 2.5200 1.0 2.5 5.22211SMA5922BT3, G 822B 7.127.57.8850 3.04000.5 2.5 6.02001SMA5923BT3, G 823B 7.798.28.6145.7 3.54000.5 2.5 6.51831SMA5924BT3, G 824B 8.649.19.5641.2 4.05000.5 2.57.01651SMA5925BT3, G 825B 9.51010.537.5 4.55000.25 2.58.01501SMA5926BT3, G 826B 10.451111.5534.1 5.55500.250.58.41361SMA5927BT3, G 827B 11.41212.631.2 6.55500.250.59.11251SMA5928BT3, G 828B 12.351313.6528.87.05500.250.59.91151SMA5929BT3, G 829B 14.251515.75259.06000.250.511.41001SMA5930BT3, G 830B 15.21616.823.4106000.250.512.2941SMA5931BT3, G 831B 17.11818.920.8126500.250.513.7831SMA5932BT3, G 832B 19202118.7146500.250.515.2751SMA5933BT3, G 833B 20.92223.11717.56500.250.516.7681SMA5934BT3, G 834B 22.82425.215.6197000.250.518.2631SMA5935BT3, G 835B 25.652728.3513.9237000.250.520.6561SMA5936BT3, G 836B 28.53031.512.5267500.250.522.8501SMA5937BT3, G 837B 31.353334.6511.4338000.250.525.1451SMA5938BT3, G 838B 34.23637.810.4388500.250.527.4421SMA5939BT3, G 839B 37.053940.959.6459000.250.529.7381SMA5940BT3, G840B40.854345.158.7539500.250.532.7351SMA5941BT3, G 841B 44.654749.358.06710000.250.535.8321SMA5942BT3, G 842B 48.455153.557.37011000.250.538.8291SMA5943BT3, G 843B 53.25658.8 6.78613000.250.542.6271SMA5944BT3, G 844B 58.96265.1 6.010015000.250.547.1241SMA5945BT3, G 845B 64.66871.4 5.512017000.250.551.7223.Tolerance and Voltage Regulation Designation − The type number listed indicates a tolerance of ±5%.4.V Z limits are to be guaranteed at thermal equilibrium.*The “G” suffix indicates Pb−Free package available.Figure 1. Steady State Power DeratingFigure 2. V Z − 3.3 thru 10 VoltsT, TEMPERATURE (°C)Figure 3. V Z = 12 thru 68 VoltsP D , M A X I M U MP O W E R D I S S I P A T I O N (W A T T S )I Z , Z E N E R C U R R E N T (m A )Z Z , D Y N A M I C I M P ED A N CE (O H M S )1002468101010.1V Z , ZENER VOLTAGE (VOLTS)1001010.1010203040V Z , ZENER VOLTAGE (VOLTS)V Z , ZENER VOLTAGE (VOLTS)1001050Figure 4. Zener Voltage − 3.3 to 12 VoltsFigure 5. Zener Voltage − 12 to 68 Volts Figure 6. Effect of Zener VoltageI Z , Z E N E R C U R R E N T (m A )6070801086420−2−4V Z , ZENER VOLTAGE (VOLTS), T E M P E R A T U R E C O E F F I C I E N T (m V / C )°θV Z 10070503020101020305070100V Z , ZENER VOLTAGE (VOLTS), T E M P E R A T U R E C O E F F I C I E N T (m V / C )°θV ZPACKAGE DIMENSIONSSMACASE 403D−02ISSUE Cǒmm inchesǓSCALE 8:1*For additional information on our Pb−Free strategy and solderingdetails, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.SOLDERING FOOTPRINT*DIM A MIN NOM MAX MINMILLIMETERS1.912.16 2.410.075INCHES A10.050.100.150.002b 1.27 1.45 1.630.050c 0.150.280.410.006D 2.29 2.60 2.920.090E 4.06 4.32 4.570.160L0.761.14 1.520.0300.0850.0950.0040.0060.0570.0640.0110.0160.1030.1150.1700.1800.0450.060NOM MAX 4.83 5.21 5.590.1900.2050.220H E STYLE 1:PIN 1.CATHODE (POLARITY BAND)2.ANODENOTES:1.DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.2.CONTROLLING DIMENSION: INCH.3.403D−01 OBSOLETE, NEW STANDARD IS 403D−02.ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.PUBLICATION ORDERING INFORMATION。
IP Korea化学品安全技术说明书 PHI605 INTERTHANE 990 RAL9005 J
IP Korea化学品安全技术说明书PHI605 INTERTHANE 990 RAL9005 JET BLACK PART A版本 1 版本修订日 09/08/131.化学品及企业标识 1.1.产品名称INTERTHANE 990 RAL9005 JET BLACK PART A 产品代码PHI6051.2. 纯物质或者混合物的建议用途及禁止用途拟定用途请参阅产品技术说明书仅供专业人员使用施工方法请参阅产品技术说明书1.3.安全技术说明书供应商的信息制造商IP Korea电话号码055-632-6286(研发), 055 586 2310(工厂)传真号码055 632-6287(研发), 055 587 6276(工厂)1.4.应急咨询电话055-586-2310(工厂)中毒咨询电话055-586-2310(工厂) 仅供医生及医院参考2.危险性概述 2.1.纯物质或混合物的分类Flam. Liq. 3;H226易燃液体和蒸气Acute Tox. 4;H312皮肤接触有害Acute Tox. 4;H332吸入有害Skin Irrit. 2;H315造成皮肤刺激Eye Irrit. 2;H319造成严重眼刺激Aquatic Chronic 3;H412对水生生物有害并具有长期持续影响2.2.标签要素用第11和12章列出的毒性数据，产品标签如下所示。
警告H226 易燃液体和蒸气。
H312 皮肤接触有害。
H315 造成皮肤刺激。
H319 造成严重眼刺激。
H332 吸入有害。
H412 对水生生物有害并具有长期持续影响。
[预防措施]:P210 远离热源/火花/明火/热表面。
禁止吸烟。
P260 不要吸入烟雾/蒸汽/喷雾。
P261 避免吸入粉尘/烟/气体/烟雾/蒸气/啧雾。
P262 严防进入眼中、接触皮肤或衣服。
P264 作业后彻底清洗。
P271 只能在室外或通风良好之处使用。
P273 避免释放到环境中。
P280 戴防护手套/戴防护眼罩/戴防护面具。
Nipro 产品数据册：单用途翼型肾脏细胞注射器说明书
H O S P I T A L P R O D U C T WING CATHSTERILE, SINGLE-USE WINGED CATHETER WITH INJECTION PORT FOR IV INFUSIONPRODUCT DATA SHEET2PRODUCT COMPLIANCE• CE-marked, Class IIa Medical Devices, Rule 7, MDD 93/42/EEC, UMDNS 10727• Complies with the following norms, directives, and regulations: ―ISO 594-1: 1986 ―EN 980:2008 ―EN 1041:2008 ―EN 1707:1996 ―ISO 7864:2016―ISO 9626:2016 ―EN ISO 10555-1:2013 ―EN ISO 10993-1/4/5/7/11 ―ISO 10993-10:2010 ―EN ISO 11135-1:2014―EN ISO 11607-1:2009 /AMD 2014 ―EN ISO 13485:2016 ―EN ISO 14971: 2012• Labels contain 12 languagesMANUFACTURING DETAILSLegal manufacturer: Nipro Corporation Country of origin: ThailandSTERILIZATION AND SHELF LIFESterilizationSingle-use only Indicator stickerShelf lifeEtO (Ethylene oxide)Each outer box (or shipping carton) contains a chemical indicator that indicates sterility. This indicator comes in the form of a [blue] sticker that turns[red] when sterilized.5 yearsWING CATHSTERILE, SINGLE-USE WINGED CATHETER WITH INJECTION PORT FOR IV INFUSION• Ultra sharp three-beveled needle to minimize discomfort • Radiopaque• Injection port with universal luer fitting • Flexible wings for easy grip• Color-coded wings and hub to indicate gauge• Siliconization of needle minimizes penetration and gliding force• T ransparent ETFE catheter tube for quick visualization of blood in the flashback chamber to facilitate insertion • Flashback in hub means the needle is correctly in the vein • Flashback in catheter means the catheter is correctly in the vein • Latex-free, DEHP-free, PVC-free • Available in 16-18-20-22-24 G• IV infusion duration: hours to several days • For use by healthcare professionals onlyClass IIa Medical DevicesRule 7MDD 93/42/EEC UMDNS 1072701233MATERIALS USEDDEHP-free Latex-free PVC-free PRODUCT RANGE OVERVIEWPACKAGING DETAILSLanguages12 languages on inner and outer box:English (EN), French (FR), Dutch (NL), German (DE), Spanish (ES), Italian (IT), Portuguese (PT), Greek (EL), Swedish (SV), Danish (DA), Norwegian (NO), and Finnish (FI)GlueMaterial: Acrylic resinNeedle (cannula)Material:Stainless steel SUS-304Needle hub Material:Polycarbonate (PC)Catheter hubMaterial: Polypropylene (PP)Port capMaterial: Polyethylene (PE)Catheter tubeMaterial: Ethyltetrafluoroethylene (ETFE)Cutting angleThree-beveledLuer capMaterial: Polypropylene (PP)Cap connectorMaterial: Polypropylene (PP)Caulking pinMaterial: Stainless steel SUS-304One-way valveMaterial: Silicone tubeLubricantMaterial: Silicone PolydimethylsiloxaneMembrane filterMaterial: Random micro glass filterVent fittingMaterial: Polypropylene (PP)Catheter wingMaterial: Polypropylene (PP)Nipro Medical Europe : European Headquarters, Blokhuisstraat 42, 2800 Mechelen, Belgium T: +32 (0)15 263 500 | F: +32 (0)15 263 510 |***********************| D a t a s h e e t - W i n g _C a t h - T H A - 27.N o v 2019Label detailsTransport conditionsClosed and dryStorage conditions Open the packaging only immediately before use to guarantee sterility.。
袋式除尘器用滤袋框架JB_5917—2006
袋式除尘器用滤袋框架JB_5917—2006 JB/T 5917—2006代替JB/T 5917—1991中华人民共和国机械行业标准袋式除尘器用滤袋框架Bag cag for baghouse2006-12-31 2007-07-01实施中华人民共和国国家发展和改革委员会发布- 0 -目次前言 2 1范围 3 2术语和定义 3 3滤袋框架的分类 3 4 技术要求 3 4.1支撑环间距 3 4.2纵筋间距 3 4.3焊点 3 4.4表明光洁度 3 4.5表面处理 3 4.6直径公差 4 4.7扁袋端面公差 44 4.8长度公差4 4.9滤袋框架垂直度公差5 检验规则 4 5.1支撑环间距 44 5.2纵筋间距5.3焊点牢固度检验 4 5.4表面光洁度检验 4 5.5圆袋框架直径公差检验 4 5.6扁袋框架周长公差检验 4 5.7长度公差检验 4 5.8垂直度公差检验 4 5.9载荷检验 4 5.10出厂检验 4 5.11型式检验 5 6 包装、存贮和运输条件 56.1 包装 5 6.2 贮存和运输 5- 1 -前言本标准代替JB/T5917—1991《袋式除尘器用滤袋框架技术条件》。
本标准与JB/T5917—1991相比，主要变化如下: ——对袋式除尘器用滤袋框架技术要求的技术条件、检验规则、包装要求等有关方面做了相应的修改;——在检验规则中加强了对脱焊简要的要求。
本标准有中国机械工业联合会提出。
本标准有机械工业环境保护机械标准化技术委员会归口。
本标准主要起草人:朱德生、劳以诺、丁士仁。
本标准所代替标准的历次版本发布情况: ——JB/T 5917—1991- 2 -袋式除尘器用滤袋框架 1 范围本标准规定了袋式除尘器用滤袋框架的术语和定义、技术要求、检验规则、包装贮存和运输条件。
2 术语和定义下列术语和定义适用于本标准。
2.1 滤袋框架 filtration bag cage用碳钢丝或者不锈钢丝焊接而成是滤袋在过滤及清灰状态下张紧并保持一定形状的部件。
六偏磷酸钠产品说明(TJCY)
六偏磷酸钠产品说明
货物名称（中文）：六偏磷酸钠
货物名称（英文）：SODIUM HEXAMETAPHOSPHATE
分子式：(NaPO3)6CAS NO.: 68915-31-1
4个
NaO-P-O---P-O- - -P-ONa
ONa ONa ONa
1.物理化学性质
外观为无色透明片状结晶或白色粉状。
比重2.484，熔点616℃（分解）。
吸湿性能强，露置空气中能逐渐吸取水分而呈粘胶状物。
易溶于水，不溶于有机溶剂。
1％溶液的pH值为5.5～6.5左右。
与其它聚磷酸盐一样具有水解性，直至为正磷酸盐。
2.主要用途
它的主要用途是用于水处理方面主要用作锅炉用水的软水剂、缓蚀剂、印染染浴软水剂。
用于造纸工业作扩散剂；用于洗涤剂工业作金属表面清洗剂；用于制革工业作鞣革剂和染色剂；化学纤维工业用以除去浆粕中的铁质；以及采矿、钻井等。
上述货物为一般化工品，非易燃、易爆、易腐蚀，无毒、无害、无污染，非氧化物、麻醉品，非精神类药品、非化学武器的原料，无放射性。
适合海洋运输和航空运输。
湖北兴发化工集团股份有限公司。
BFG591中文资料
150 Ts (oC) 200
Fig.2 Power derating curve.
250
handbook, halfpage
h FE
200
150
100
50
0
10 2
10 1
1
MRA749
10
10 2
IC (mA)
VCE = 12 V.
Fig.3 DC current gain as a function of collector current, typical values.
1995 Sep 04
4
元器件交易网
Philips Semiconductors
NPN 7 GHz wideband transistor
Product specification
BFG591
3.0 Ptot (W)
2.5
2.0
1.5
1.0
0.5
0 0
MGC791
50
100
SYMBOL
PARAMETER
CONDITIONS
VCBO VCEO VEBO IC Ptot Tstg Tj
collector-base voltage collector-emitter voltage emitter-base voltage collector current (DC) total power dissipation storage temperature junction temperature
open emitter open base
up to Ts = 80 °C; note 1 IC = 70 mA; VCE = 8 V IC = Ic = 0; VCE = 12 V; f = 1 MHz IC = 70 mA; VCE = 12 V; f = 1 GHz IC = 70 mA; VCE = 12 V; f = 900 MHz; Tamb = 25 °C IC = 70 mA; VCE = 12 V; f = 900 MHz; Tamb = 25 °C
PEUL610Q496-02_060512パスワードなし
ML610Q496User’s ManualIssue Date: Jun 5, 2012PEUL610Q496-02NOTESNo copying or reproduction of this document, in part or in whole, is permitted without the consent of LAPIS Semiconductor Co., Ltd. The content specified herein is subject to change for improvement without notice.The content specified herein is for the purpose of introducing LAPIS Semiconductor 's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from LAPIS Semiconductor upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production.Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, LAPIS Semiconductor shall bear no responsibility for such damage.The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. LAPIS Semiconductor does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by LAPIS Semiconductor and other parties. LAPIS Semiconductor shall bear no responsibility whatsoever for any dispute arising from the use of such technical information.The Products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices).The Products specified in this document are not designed to be radiation tolerant.While LAPIS Semiconductor always makes efforts to enhance the quality and reliability of its Products, a Product may fail or malfunction for a variety of reasons.Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury, fire or any other damage caused in the event of the failure of any Product, such as derating, redundancy, fire control and fail-safe designs. LAPIS Semiconductor shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual.The Products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel-controller or other safety device). LAPIS Semiconductor shall bear no responsibility in any way for use of any of the Products for the above special purposes. If a Product is intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing.If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law.Copyright 2012 LAPIS Semiconductor Co., Ltd.PrefaceThis manual describes the operation of the hardware of the 8-bit microcontroller ML610Q496.The following manuals are also available. Read them as necessary.nX-U8/100 Core Instruction ManualDescription on the basic architecture and the each instruction of the nX-U8/100 Core.MACU8 Assembler Package User’s ManualDescription on the method of operating the relocatable assembler, the linker, the librarian, and the object converter and also on the specifications of the assembler language.CCU8 User’s ManualDescription on the method of operating the compiler.CCU8 Programming GuideDescription on the method of programming.CCU8 Language ReferenceDescription on the language specifications.DTU8 Debugger User’s ManualDescription on the method of operating the debugger DTU8.IDEU8 User’s ManualDescription on the integrated development environment IDEU8.uEASE User’s ManualDescription on the on-chip debug tool uEASE.uEASE connection Manual for ML610Q496Description about the connection between uEASE and ML610Q496.FWuEASE Flash Writer Host Program User’s ManualDescription on the Flash Writer host program.NotationClassification Notation Description♦ Numeric value xxh, xxH Indicates a hexadecimal number. x: Any value in the range of 0 to F xxb Indicates a binary number; “b” may be omitted. x: A value 0 or 1♦ Unit word, W 1 word = 16 bitsbyte, B 1 byte = 8 bitsnibble, N 1 nibble = 4 bits106Mmaga-,K210 = 1024kilo-,103 = 1000kkilo-,10-3milli-,mµ10-6micro-,10-9nano-,nsecond, s (lower case) second♦Terminology “H” level, “1” level Indicates high voltage signal levels V IH and V OH as specified by theelectrical characteristics.“L” level, “0” level Indicates low voltage signal levels V IL and V OL as specified by theelectrical characteristics.♦ Register descriptionR/W: Indicates that Read/Write attribute. “R” indicates that data can be read and “W” indicates that data can be written. “R/W” indicates that data can be read or written.Table of Contents1 Overview...............................................................................................................................................................1 1 1.1 Features........................................................................................................................................................1 1 1.2 Configuration of Functional Blocks.............................................................................................................1 51.2.1 Block Diagram of ML610Q496........................................................................................................1 5 1.3 Pins...............................................................................................................................................................1 61.3.1 Pin Layout of ML610Q496 TQFP64 Package................................................................................1 6of Pins.......................................................................................................................................1 71.3.2 List1.3.3 Description of Pins..........................................................................................................................1 91.3.4 Termination of Unused Pins.........................................................................................................1 132 CPU and Memory Space......................................................................................................................................2 1 2.1 Overview.......................................................................................................................................................2 1 2.2 Program Memory Space...............................................................................................................................2 1 2.3 Data Memory Space.....................................................................................................................................2 2 2.4 Instruction Length.......................................................................................................................................2 2 2.5 Data Type.....................................................................................................................................................2 2 2.6 Description of Registers...............................................................................................................................2 32.6.1 List of Registers...............................................................................................................................2 32.6.2 Data Segment Register (DSR)........................................................................................................2 4Function......................................................................................................................................................3 1 3 Reset3.1 Overview.......................................................................................................................................................3 13.1.1 Features...........................................................................................................................................3 13.1.2 Configuration...................................................................................................................................3 13.1.3 List of Pin.........................................................................................................................................3 2 3.2 Description of Registers...............................................................................................................................3 33.2.1 List of Registers...............................................................................................................................3 33.2.2 Reset Status Register (RSTAT).......................................................................................................3 3 3.3 Description of Operation..............................................................................................................................3 53.3.1 Operation of System Reset Mode....................................................................................................3 5Control Function.........................................................................................................................................4 1 4 MCU4.1 Overview.......................................................................................................................................................4 14.1.1 Features...........................................................................................................................................4 14.1.2 Configuration...................................................................................................................................4 1 4.2 Description of Registers...............................................................................................................................4 24.2.1 List of Registers...............................................................................................................................4 24.2.2 Stop Code Acceptor (STPACP)........................................................................................................4 34.2.3 Standby Control Register (SBYCON).............................................................................................4 44.2.4 Block Control Register 0(BLKCON0).............................................................................................4 54.2.5 Block Control Register 1(BLKCON1).............................................................................................4 74.2.6 Block Control Register 2(BLKCON2).............................................................................................4 84.2.7 Block Control Register 3(BLKCON3)...........................................................................................4 104.2.8 Block Control Register 4(BLKCON4)...........................................................................................4 114.2.9 Block Control Register 5(BLKCON5)...........................................................................................4 124.2.10 Flash Remap Register (REMAPADD)..........................................................................................4 134.2.11 Flash Remap Status Register (REMAPS)....................................................................................4 14 4.3 Description of Operation............................................................................................................................4 154.3.1 Program Run Mode.......................................................................................................................4 154.3.2 HALT Mode....................................................................................................................................4 154.3.3 STOP Mode....................................................................................................................................4 164.3.4 Block Control Function.................................................................................................................4 19function by software..........................................................................................................4 204.3.5 Remap4.3.6 Remap function by hardware (external terminal).......................................................................4 21in Use...................................................................................................................................4 224.3.7 Notes5 Interrupts (INTs)..................................................................................................................................................5 1 5.1 Overview.......................................................................................................................................................5 15.1.1 Features...........................................................................................................................................5 1 5.2 Description of Registers...............................................................................................................................5 25.2.1 List of Registers...............................................................................................................................5 25.2.2 Interrupt Enable Register 0 (IE0)..................................................................................................5 35.2.3 Interrupt Enable Register 1 (IE1)..................................................................................................5 45.2.4 Interrupt Enable Register 2 (IE2)..................................................................................................5 65.2.5 Interrupt Enable Register 3 (IE3)..................................................................................................5 75.2.6 Interrupt Enable Register 4 (IE4)..................................................................................................5 85.2.7 Interrupt Enable Register 5 (IE5)..................................................................................................5 95.2.8 Interrupt Enable Register 6 (IE6)................................................................................................5 105.2.9 Interrupt Enable Register 7 (IE7)................................................................................................5 115.2.10 Interrupt Request Register 0 (IRQ0)............................................................................................5 125.2.11 Interrupt Request Register 1 (IRQ1)............................................................................................5 145.2.12 Interrupt Request Register 2 (IRQ2)............................................................................................5 165.2.13 Interrupt Request Register 3 (IRQ3)............................................................................................5 175.2.14 Interrupt Request Register 4 (IRQ4)............................................................................................5 185.2.15 Interrupt Request Register 5 (IRQ5)............................................................................................5 195.2.16 Interrupt Request Register 6 (IRQ6)............................................................................................5 215.2.17 Interrupt Request Register 7 (IRQ7)............................................................................................5 22 5.3 Description of Operation............................................................................................................................5 245.3.1 Maskable Interrupt Processing.....................................................................................................5 265.3.2 Non-Maskable Interrupt Processing.............................................................................................5 265.3.3 Software Interrupt Processing......................................................................................................5 265.3.4 Notes on Interrupt Routine...........................................................................................................5 275.3.5 Interrupt Disable State.................................................................................................................5 30Generation Circuit.....................................................................................................................................6 1 6 Clock6.1 Overview.......................................................................................................................................................6 16.1.1 Features...........................................................................................................................................6 16.1.2 Configuration...................................................................................................................................6 16.1.3 List of Pins.......................................................................................................................................6 2 6.2 Description of Registers...............................................................................................................................6 26.2.1 List of Registers...............................................................................................................................6 26.2.2 Frequency Control Register 0 (FCON0).........................................................................................6 36.2.3 Frequency Control Register 1 (FCON1).........................................................................................6 56.2.4 Frequency Control Register 3 (FCON3).........................................................................................6 66.2.5 Frequency Status Register (FSTAT)...............................................................................................6 7 6.3 Description of Operation..............................................................................................................................6 86.3.1 Low-Speed Clock..............................................................................................................................6 86.3.2 High-Speed Clock..........................................................................................................................6 116.3.3 Switching of System Clock............................................................................................................6 16 6.4 Specifying port registers............................................................................................................................6 186.4.1 Functioning P66 (OUTCLK) as the high speed clock output......................................................6 186.4.2 Functioning P65 (LSCLK) as the low speed clock output............................................................6 196.4.3 Functioning P74/OSC0 as the external clock input.....................................................................6 207 TimeBase Counter...............................................................................................................................................7 1 7.1 Overview.......................................................................................................................................................7 17.1.1 Features...........................................................................................................................................7 17.1.2 Configuration...................................................................................................................................7 1 7.2 Description of Registers...............................................................................................................................7 37.2.1 List of Registers...............................................................................................................................7 37.2.2 Low-Speed Time Base Counter (LTBR)..........................................................................................7 47.2.3 High-Speed Time Base Counter Divide Register (HTBDR)..........................................................7 57.2.4 Low-Speed Time Base Counter Frequency Adjustment Registers L and H.................................7 67.2.5 Low-Speed Time Base Clock Output Control Register (LTBCCON).............................................7 77.2.6 Low-Speed Time Base Counter for RTC (LTBRR).........................................................................7 87.2.7 Low-Speed Time Base Counter Frequency Adjustment Registers L and H for RTC...................7 9 7.3 Description of Operation............................................................................................................................7 107.3.1 Low-Speed Time Base Counter.....................................................................................................7 107.3.2 High-Speed Time Base Counter....................................................................................................7 117.3.3 Low-Speed Time Base Counter Frequency Adjustment Function..............................................7 127.3.4 A signal generation for 16bit timer 2-3 frequency measurement mode......................................7 138 Timers...................................................................................................................................................................8 1 8.1 Overview.......................................................................................................................................................8 18.1.1 Features...........................................................................................................................................8 18.1.2 Configuration...................................................................................................................................8 1 8.2 Description of Registers...............................................................................................................................8 38.2.1 List of Registers...............................................................................................................................8 38.2.2 Timer 0 Data Register (TM0D).......................................................................................................8 48.2.3 Timer 1 Data Register (TM1D).......................................................................................................8 58.2.4 Timer 2 Data Register (TM2D).......................................................................................................8 68.2.5 Timer 3 Data Register (TM3D).......................................................................................................8 78.2.6 Timer 4 Data Register (TM4D).......................................................................................................8 88.2.7 Timer 5 Data Register (TM5D).......................................................................................................8 98.2.8 Timer 0 Counter Register (TM0C)................................................................................................8 108.2.9 Timer 1 Counter Register (TM1C)................................................................................................8 118.2.10 Timer 2 Counter Register (TM2C)................................................................................................8 128.2.11 Timer 3 Counter Register (TM3C)................................................................................................8 138.2.12 Timer 4 Counter Register (TM4C)................................................................................................8 148.2.13 Timer 1 Counter Register (TM5C)................................................................................................8 158.2.14 Timer 0 Control Register 0 (TM0CON0)......................................................................................8 168.2.15 Timer 1 Control Register 0 (TM1CON0)......................................................................................8 178.2.16 Timer 2 Control Register 0 (TM2CON0)......................................................................................8 188.2.17 Timer 3 Control Register 0 (TM3CON0)......................................................................................8 198.2.18 Timer 4 Control Register 0 (TM4CON0)......................................................................................8 208.2.19 Timer 5 Control Register 0 (TM5CON0)......................................................................................8 218.2.20 Timer 0 Control Register 1 (TM0CON1)......................................................................................8 228.2.21 Timer 1 Control Register 1 (TM1CON1)......................................................................................8 238.2.22 Timer 2 Control Register 1 (TM2CON1)......................................................................................8 248.2.23 Timer 3 Control Register 1 (TM3CON1)......................................................................................8 258.2.24 Timer 4 Control Register 1 (TM4CON1)......................................................................................8 268.2.25 Timer 5 Control Register 1 (TM5CON1)......................................................................................8 27 8.3 Description of Operation............................................................................................................................8 288.3.1 Timer mode operation...................................................................................................................8 288.3.2 16-bit timer frequency measurement mode operation.................................................................8 298.3.3 16-bit timer frequency measurement mode application for setting UART baud-rate................8 319 PWM.....................................................................................................................................................................9 1 9.1 Overview.......................................................................................................................................................9 19.1.1 Features...........................................................................................................................................9 19.1.2 Configuration...................................................................................................................................9 19.1.3 List of Pins.......................................................................................................................................9 2 9.2 Description of Registers...............................................................................................................................9 29.2.1 List of Registers...............................................................................................................................9 29.2.2 PWM0 Period Registers (PW0PL, PW0PH)...................................................................................9 39.2.3 PWM0 Duty Registers (PW0DL, PW0DH).....................................................................................9 49.2.4 PWM0 Counter Registers (PW0CH, PW0CL)................................................................................9 59.2.5 PWM0 Control Register 0 (PW0CON0)..........................................................................................9 69.2.6 PWM0 Control Register 1 (PW0CON1)..........................................................................................9 7 9.3 Description of Operation..............................................................................................................................9 8 9.4 Specifying port registers............................................................................................................................9 109.4.1 Functioning P23 (PWM0) as the PWM output.............................................................................9 10。
丝印591贴片三极管
-1
A
-2
A
250
mW
150
℃
Tstg
Storage Temperature
-55~150
℃
ELECTRICAL CHARACTERISTICS (Ta=25℃ unless otherwise specified)
Parameter Collector-base breakdown voltage Collector-emitter breakdown voltage
I =-200uA
B
-2
-4
-6
-8
-10
-12
COLLECTOR-EMITTER VOLTAGE V (V) CE
V
—— I
CEsat
C
(mV)
CEsat
-100
Ta=100℃
Ta=25℃
-10
(mV)
BEsat
DC CURRENT GAIN h FE
-1000
-100
-10 -1
-2000 -1000
Min.
Max.
0.900
1.150
0.000
0.100
0.900
1.050
0.300
0.500
0.080
0.150
2.800
3.000
1.200
1.400
2.250
2.550
0.950 TYP.
1.800
2.000
0.550 REF.
0.300
0.500
0°
8°
Dimensions In Inches
hFE(1) hFE(2) 1 hFE(3) 1 hFE(4) 1 VCE(sat)1 1 VCE(sat)2 1 VBE(sat) 1 VBE1
BA5916中文资料
4-channel BTL driver for CD players and CD-ROMs
BA5916FP-Y
The BA5916FP-Y contains a 4-channel BTL driver for CD player and CD-ROM motors and actuators and a multi-purpose operational amplifier. Perfect for compact applications with the use of the HSOP 25-pin package.
FApplications CD players, CD-ROM
FFeatures 1) 4-channel BTL driver. 2) Perfect for compact applications with the use of the HSOP 25-pin power package. 3) Wide dynamic range (3.6V (Typ.) when VCC = 5V and RL = 8Ω). 4) Internal thermal shutdown circuit.
FAbsolute maximum ratings (Ta = 25_C)
FRecommended operating conditions (Ta = 25_C)
728
元器件交易网 Optical disc ICs
FBlock diagram
BA5916FP-Y
FPin descriptions
731
元器件交易网 Optical disc ICs
FMeasurement circuits
TLP591B中文资料
35
10
30
Forward current IF (mA)
5000 3000
IFP – DR
Pulse width ≤ 100µs Ta = 25℃
1000 500 300
100
50 30
10
3
10-3
300
3
10-2
3
10-1
Duty cycle ratio DR
ISC – IF
3
100
100
50 30
· UL recognized: UL1577, file no. E67349
TLP591B
Unit in mm
Maximum Ratings (Ta = 25°C)
TOSHIBA
11−7A9
Characteristic
Symbol
Forward current
Forward current derating (Ta ≥ 25°C)
LE D
Pulse forward current (100µs pulse, 100pps)
Reverse voltage
Junction temperature
Forward current
Detector
Reverse voltage
Junction temperature
Storage temperature range
IF
Symbol
Test Condition
Min. Typ. Max. Unit
ton
IF = 20 mA, CL = 1000pF
—
0.2
—
ms
toff
消解试剂包 for the digestion of nitrogen (total) 90 dig
Millipore- 1.14963页码 1 的 11The life science business of Merck operates as MilliporeSigma in the US化学品安全技术说明书按照GB/T 16483、GB/T 17519编制版本8.1修订日期18.09.2022打印日期18.09.2022最初编制日期18.09.2022SDS 编号Millipore - 1.14963产品编号Millipore - 1.14963消解试剂包 for the digestion of nitrogen (total) 90 digestions Spectroquant®第1部分：化学品及企业标识1.1 产品标识产品名称: 消解试剂包 for the digestion of nitrogen (total) 90digestions Spectroquant®Crack Set 20 for the digestion of nitrogen(total) 90 digestions Spectroquant® 产品编号: 1.14963产品编号: 114963品牌: Millipore1.2 安全技术说明书提供者的详情制造商或供应商名称: Sigma-Aldrich (Shanghai) Trading Co.Ltd.509 Renqing RoadZhangjiang High Tech East Park, PudongSHANGHAI201201 SHANGHAICHINA西格玛奥德里奇（上海）贸易有限公司上海市浦东新区仁庆路509号10幢邮政编码：201201默克股份两合公司64271 达姆施塔特德国Millipore- 1.14963页码 2 的 11The life science business of Merck operates as MilliporeSigma in the USPhone:+49(0)6151 72-2440电话号码: +86 21 6141-5566传真: +86 21 6141-55671.3 应急咨询电话紧急联系电话: +86 532 838890901.4 物质或混合物的推荐用途和限制用途已确认的各用途: 分析用试剂这是此产品概括的物质安全资料表(SDS),如需第16项中所列的每一成分完整的物质安全资料表(SDS),请浏览我们的网站.第2部分：危险性概述2.1 GHS危险性类别氧化性液体 (类别 3), H272金属腐蚀物 (类别 1), H290急性毒性, 经口 (类别 4), H302皮肤腐蚀/刺激 (类别 1A), H314严重眼睛损伤/眼睛刺激性 (类别 1), H318呼吸过敏 (类别 1), H334皮肤过敏 (类别 1), H317特异性靶器官系统毒性（一次接触） (类别 3), 呼吸道刺激, H335急性（短期）水生危害 (类别 3), H402本部分提及的健康说明（H-)全文请见第16部分。
标签去除剂液体的化学品安全技术说明书
液体。
化学品安全技术说明书产品类型:标签去除剂化学品的推荐用途和限制用途安全技术说明书根据 GB/ T 16483-2008 和 GB/ T 17519-2013产品代码:152060GHS product identifier :Label Remover 应急咨询电话:企业标识:WEICON GmbH & Co. KG Königsberger Str. 25548157 Münster GermanyPhone: +49 251 93220Fax: +49(0)251 / 9322 - 244Internet: www.weicon.de **************:本安全技术说明书责任人的e-mail地址************/4001206011易燃液体 - 类别 2皮肤腐蚀/刺激 - 类别 2特异性靶器官毒性 一次接触 (麻醉效应) - 类别 3吸入危害 - 类别 1危害水生环境一长期危险 - 类别 2GHS危险性类别:标签要素物质或混合物的分类根据 GB13690-2009 和 GB30000-2013紧急情况概述液体。
无色。
苯类。
如误吸入： 如感觉不适，呼叫解毒中心或医生。
如误吞咽： 立即呼叫解毒中心/医生。
如发生皮肤刺激： 求医要么就诊。
有关环境保护措施，请参阅第 12 节。
H225 - 高度易燃液体和蒸气。
H304 - 吞咽及进入呼吸道可能致命。
H315 - 造成皮肤刺激。
H336 - 可能造成昏昏欲睡或眩晕。
H411 - 对水生生物有毒并具有长期持续影响。
警示词:危险危险性说明:H225 - 高度易燃液体和蒸气。
H304 - 吞咽及进入呼吸道可能致命。
H315 - 造成皮肤刺激。
H336 - 可能造成昏昏欲睡或眩晕。
H411 - 对水生生物有毒并具有长期持续影响。
防范说明预防措施:P280 - 穿保护性護手套和保护性衣服和眼睛防護具或面部防護具。
羟基硅油
缩合固化• 经过缩合处理，溶剂型有机硅树脂、反应性（羟基硅油）液体和多数RTV 弹性体固化（交联）。
简单的硅醇缩合过程将会产生副产物水。
• 其他常见反应包括：≡ SiH + HOSi ≡ ≡ SiOSi ≡ + H 2≡ SiOOCCH 3 + HOSi ≡ ≡ SiOSi ≡ + CH 3COOH≡ SiONR 2 + HOSi ≡ ≡ SiOSi ≡ + R 2NOH ≡ SiOH + HOSi ≡ ≡ SiOSi ≡ + H 2O≡ Si-Cl + HOSi ≡ ≡ SiOSi ≡ + HCl ≡ Si-OR + HOSi ≡ ≡ SiOSi ≡ + ROH• 多种催化剂可引发并加速缩合固化。
胺类化合物如氨丙基硅烷衍生物、铅、锡和锌的碳酸盐均为常用催化剂，并研究了铁、钙、钡、锑、锆和镉的有机盐。
辛酸、月桂酸和油酸锡以及二丁基锡盐特别有效。
除了催化活性外，最关键因素是催化剂在有机硅聚合物结构中的溶解性。
强酸（Brønsted 和Lewis 型）和强碱影响缩合，但反应难以控制。
CH 3 CH 3HO –– Si –– O –– Si –– O –– Si –– OHCH 3CH33333“工具箱”文件号：26-1354-40ÓÉ Foxit Reader ±à¼-°æȨËùÓÐ (C) Foxit Software Company,2005-2006½öÓÃÓÚÆÀ¹À¡£有限保证信息 – 请仔细阅读此处信息是准确无误的。
然而，由于使用本公司产品的条件和方法非我们所能控制，本信息不能取代客户为确保道康宁产品安全、有效、并完全满足于特定的最终用途，而进行的测试。
安全数据表
安全数据表
MATERIAL SAFETY DATA SHEET
中文名称：氢氧化钠 、烧碱、片碱
英文名称：sodiun hydroxide
分子式：NaOH
分子量：40.01
序号：1669
CAS号：1310-73-2
理
化
性
质
外观与性状：白色不透明固体，易潮解。
熔点（℃）：318.4
沸点（℃）：1390
蚀
危
险
性
危险特性
燃烧性：本品不燃，具强腐蚀性、强刺激性，可致人体灼伤。
与酸发生中和反应并放热。遇潮时对铝、锌和锡有腐蚀性，并放出易燃易爆的氢气。本品不会燃烧, 遇水和水蒸气大量放热, 形成腐蚀性溶液。具有强腐蚀性。
禁忌物
强酸、易燃或可燃物速撤离泄漏污染区人员至安全区，并进行隔离，严格限制出入。切断火源。建议应急处理人员戴自给正压式呼吸器，穿防毒服。尽可能切断泄漏源。防止流入下水道、排洪沟等限制性空间。小量泄漏：用砂土、蛭石或其它惰性材料吸收。大量泄漏：构筑围堤或挖坑收容。用泵转移至槽车或专用收集器内，回收或运至废物处理场所处置。
储存
存储于干燥、通风、阴凉的库房。远离火源、热源。包装密闭，切勿受潮。应与可（易）燃物、酸类等分开存放，切勿混储。储区应备有合适的材料收容泄漏物。
自燃点（℃）：--
相对密度（空气=1）：--
相对密度（水=1）：2.12
闪点(℃)：--
爆炸上限%(V/V)：--
爆炸下限%(V/V)：--
溶解性：易溶于水、乙醇、甘油，不溶于丙酮。
毒
害
性
及
健
康
危
害
毒性资料
刺激性：家兔经眼：1%重度刺激。家兔经皮：50mg/24 小时，重度刺激。
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5917631-6 Product Details
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5917631-6
Active 1.27 [.050] Series I, HD, FH and J
Connectors
Always EU RoHS/ELV Compliant (Statement of Compliance)
Product Highlights:
?Connector
?Plug
?Number of Positions = 140
? 1.27 mm Centerline
?PCB Mount Style = Thru Hole
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Availability
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Documentation & Additional Information
Product Drawings:
? 1.27FHBB PLUG (V) ASS'Y PB-FREE(PDF, Japanese)
Catalog Pages/Data Sheets:
?None Available
Product Specifications:
?None Available
Application Specifications:
?None Available
Instruction Sheets:
?None Available
CAD Files: (CAD Format & Compression Information)
?2D Drawing (DXF, Version O)
?3D Model (IGES, Version O)
?3D Model (STEP, Version O)
List all Documents Additional Information:
?Product Line Information
Additional Product Images: ?Mating Configurations
?Mating Configurations
Related Products:
?Tooling
Product Features (Please use the Product Drawing for all design activity)
Product Type Features:
?Product Type = Connector
?Gender = Plug
?Number of Positions = 140
?PCB Mount Style = Thru Hole
?PCB Retention Feature = No
?PCB Mount Angle = Vertical
?Connector Type = Free Height (FH)
?PCB Polarization = Without
?Solder Peg = Without
?Color = Black
?Used For = Interconnections Requiring Variable
Stacking Heights
?Sealed Bottom = With
?Product Series = FH (Free Height)
Termination Related Features:
?Termination (Solder) Post Length (mm [in]) =
3.10 [0.122]
?Solder Tail Contact Plating = Tin
Body Related Features:
?Centerline (mm [in]) = 1.27 [0.050] Contact Related Features:
?Contact Mating Area Plating = Gold (12)
?Contact Material = Phosphor Bronze
Housing Related Features:
?Housing Temperature Rating = Standard
?Housing Material = Nylon
?Housing Flammability Rating = UL 94V-0
Industry Standards:
?RoHS/ELV Compliance = RoHS compliant, ELV
compliant
?Lead Free Solder Processes = Wave solder
capable to 240°C, Wave solder capable to 260°
C, Wave solder capable to 265°C
?RoHS/ELV Compliance History = Always was
RoHS compliant
Operation/Application:
?Application = Standard
Other:
?Brand = AMP
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