Linsitinib_867160-71-2_DataSheet_MedChemExpress

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Z-Active 差分探头系列 P7313、P7380A、P7360A、P7340A 数据手册说明书

Z-Active™Differential Probe FamilyP7313•P7380A •P7360A •P7340A DataSheetFeatures &Bene ﬁtsSignal Fidelity>12.5GHz Bandwidth (P7313,Typical)>8.0GHz Bandwidth (P7380A,Typical)>6.0GHz Bandwidth (P7360A,Typical)>4.0GHz Bandwidth (P7340A,Typical)Extended Linear Dynamic Range 1.25V p-p at 5x Attenuation (P7313)4V p-p at 25x Attenuation (P7313)2V p-p at 5x Attenuation (P7380A,P7360A,P7340A)5V p-p at 25x Attenuation (P7380A,P7360A,P7340A)Low Probe Loading DC Input Resistance 100k ΩDifferential 50k ΩSingle Ended AC LoadingZ min >200Ωout to 10GHz (P7313)Z min >290Ω,4GHz to 8GHz (P7380A,P7360A,P7340A)VersatilityMake Differential or Single-ended (Ground-referenced)Measurements*1Solder-down CapabilityHandheld Probing with Variable Spacing and Compliance Fixtured Probing Interchangeable Tip-Clip™Assemblies Connect to a Variety of Devices Economical TekConnect ®InterfaceApplicationsExamples Include,but are not Limited To:PCI-Express I and II,Serial ATA II,USB 2.0,DDRII,DDRIII,Fireware 1394b,Rambus,XAUI*1For details,please see application note 60W-18344-0,“Making Single-ended Measurements with DifferentialProbes.”1981Data SheetZ-Active™Probing Architecture Leads the Way for High-speed Probing Applications Tektronix has created a revolutionary Z-Active probe architecture that sets the industry benchmark for signalﬁdelity.Tektronix active probe architecture preserves high bandwidth while providing improved connectivity with low loading.The Z-Active architecture is a hybrid approach composed of a distributed attenuator topology feeding an active probe ampliﬁer.The Z-Active probes use a tiny passive probe tip element that is separate from the ampliﬁer,extending the usable reach of the probe.In traditional active probes,adding this much length can introduce signalﬁdelity problems.However this architecture maintains high DC input resistance and presents a higher AC impedance than previous probe architectures.It accomplishes this while providing signiﬁcant length between the probe body and the probe attachment point to the DUT.This architecture provides the best of both worlds:high DC impedance like existing active probes and the stable high-frequency loading of Z0probes.Signal FidelityYou can be conﬁdent in the signalﬁdelity of your measurements because the Z-Active architecture provides:High BandwidthExcellent Step ResponseLow LoadingHigh CMRRExtended Linear Dynamic RangeExtended Linear Dynamic RangeMany of today’s logic signals and serial bus signals require the capabilityto measure up to several volts peak to peak.These voltage levels may easily be viewed with the Z-Active architecture probes(P7380A,P7360A, and P7340A)with the extended linear dynamic range.With a2.0V p-p linear dynamic input range at the5x attenuation setting,you can accurately measure DDR II and III,Firewire1394b,and PCI-Express I and II signals at reduced noise levels.In addition the25x attenuation setting’s linear dynamic input voltage range can be used up to5.0V p-p for accessing even larger signal swings found during transition times.ConnectivityThe Z-Active probe design allows the probe to easily switch between soldered,handheld,orﬁxtured applications.This family of probes uses Tip-Clip™assemblies,an interchangeable probe tip system that enables customers to conﬁgure their probe with the optimal tip for their application.These detachable assemblies make it possible to replace a tip for a fraction of the cost formerly associated with such hardware changes.The several lengths and variable spacing of the assemblies provideﬂexibility for adapting to vias and other test points of differing sizes.With Tektronix Tip-Clip assemblies,Monday’s solder-in probe can become Tuesday’s handheld tool,simply by switching tips. ValueThe combination of the Z-Active architecture and the Tip-Clip assemblies provide superior signalﬁdelity at a cost-effective price.The inexpensive Tip-Clip assemblies enable full-performance solder connections at a very low price per connection.Over the life of a probe this can add up to signiﬁcant savings in the cost of operation.Performance You Can Count OnDepend on Tektronix to provide you with performance you can count on.In addition to industry-leading service and support,this product comes backed by a one-year warranty as standard.Z-Active™Differential Probe Family—P7313•P7380A•P7360A•P7340ACharacteristicsCharacteristic P7340A P7360A P7380A P7313Bandwidth(Typical)>4GHz>6GHz>8GHz>12.5GHzRise Time(10%-90%)(Guaranteed)<100ps<70ps<55ps<40psRise Time(20%-80%)(Typical)<70ps<50ps<35ps<25psAttenuation5x or25x,user selectableDifferential Input Range±1.0V(5x)±2.5V(25x)±0.625V(5x)±2.0V(25x)Linearity Error for Differential Input Dynamic Range(Typical)±0.5%for-0.5V to+0.5V(5x)±1.0%for-0.75V to+0.75V(5x)±2.0%for-1.0V to+1.0V(5x)±0.5%for-1.5V to+1.5V(25x)±1.0%for-2.5V to+2.5V(25x)±2.0%for-3.0V to+3.0V(25x)±0.25%for-0.5V to+0.5V(5x)±0.75%for-0.625V to+0.625V(5x)±0.5%for-1.6V to+1.6V(25x)±1.0%for-2.0V to+2.0V(25x)Operating Voltage Window+5.0V to-3.0V+4.0V to-3.0V Offset Voltage Range+4.0V to-3.0VDC Input Resistance100kΩAC Loading(Differential Z min)>290Ω>200ΩNoise<31nV/√Hz(5x)<75nV/√Hz(25x)CMRR>50dB at1MHz>35dB at1GHz>20dB at4GHz >50dB at1MHz>35dB at1GHz>20dB at6GHz>50dB at1MHz>35dB at1GHz>20dB at8GHz>50dB at1MHz>35dB at1GHz>20dB at6GHz>15dB at12.5GHzNondestructive Input Range±15VInterface TekConnect®Cable Length 1.5m 1.5m 1.2m 1.2m Ordering InformationP7313>12.5GHz Z-Active Differential Probe for TekConnect®Interface. P7380A>8.0GHz Z-Active Differential Probe for TekConnect®Interface.P7360A>6.0GHz Z-Active Differential Probe for TekConnect®Interface.P7340A>4.0GHz Z-Active Differential Probe for TekConnect®Interface.All Include:One-year warranty,plus see Standard Accessories table.3Data SheetStandard AccessoriesDescriptionP7340AP7360AP7380AP7313Reorder Part NumberPouch,Nylon Carrying Case with Inserts1each 1each 1each 1each 016-1952-xx Qty 1Accessory Performance Summary and Reorder Sheet1each 1each 1each 1each 001-1389-xx Qty 1020-2640-xx Qty 1–Opt.L0020-2648-xx Qty 1–Opt.L5User Manual -Printed.Includes Reply Card and CD 1each1each1each1each040-2649-xx Qty 1–Opt.L7BNC (M)-to-Minigrabber Adapter 1each 1each 1each 1each 013-0342-xx Qty 1Anti-static Wrist Strap 1each 1each 1each 1each 006-3415-xx Qty 1Magnifying Glasses 1each 1each 1each 1each 378-0486-xx Qty 1Calibration Data Report 1each 1each 1each 1each Opt.D1Handheld Probe Adapter 1each 1each 1each1each 015-0717-xx 1eachP7313:020-2636-xx 1eachP7380A:020-2557-xx 1eachP7360A:020-2690-xx Accessory Box and Contents1each P7340A:020-2690-xx Attachment Kit1each 1each 1each 1each 016-1953-xx Qty 1Velcro Fastening Strap 10each 10each 10each 10each –Velcro Fastening Dots 10each 10each 10each 10each –Adhesive Tip-Clip Tape*2(Strip of 10)3each 3each 3each 3each –Color Band Kit (2ea.of 5colors)1each 1each 1each 1each 016-1948-xx Qty 1Short Flex,Small Resistor Tip-Clip Assembly 2each 2each 3each 3each 020-2600-xx Qty 10Medium Flex,Small Resistor Tip-Clip Assembly 2each 2each 3each 3each 020-2602-xx Qty 10Long Flex,Small Resistor Tip-Clip Assembly 2each 2each 3each 3each 020-2604-xx Qty 10Variable Spacing Tip-Clip Kit 3each 3each 3each 3each 020-2596-xx (Kit of 3)Square Pin Adapter Tip-Clip 1each 1each 1each 1each 020-2701-xx (Kit of 3)Tip-Clip Ejector*23each 3each 3each 3each –020-2639-xx Qty 10HBW Straight Flex Tip-Clip Assembly –––3each020-2657-xx Qty 5020-2638-xx Qty 10HBW Right-Angle Flex Tip-Clip Assembly –––3each 020-2656-xx Qty 5Wire Replacement Kit–––1each 020-2644-xx Qty 1Short Flex,Large Resistor 1/8W Tip-Clip Assembly––3each –020-2601-xx Qty 10Long Flex,Large Resistor 1/8W Tip-Clip Assembly––3each –020-2605-xx Qty 10Medium Flex,Large Resistor 1/8W Tip-Clip Assembly2each2each3each–020-2603-xx Qty 10*2Tip-Clip Ejectors and Tip-Clip Tape are shipped standard with the 020-xxxx-xx Tip-Clip Assembly Kits.Recommended AccessoriesDescriptionP7360P7380P7313Part NumberProbe Positioner Yes Yes Yes PPM100Probe PositionerYes Yes Yes PPM203B PPM203B,PPM100Adapter Fixture Yes Yes Yes 013-0339-xx P7340A:067-0419-xx P7360A:067-0419-xx P7380A:067-0419-xx Calibration Fixture Yes Yes YesP7313:067-1616-xxDSA8200Series TekConnect ®Probe Interface Yes Yes Yes 80A03Deskew FixtureYes Yes Yes 067-1586-xx Real-time Spectrum Analyzer TekConnect Probe AdapterYes Yes YesRTPA2AZ-Active™Differential Probe Family—P7313•P7380A•P7360A•P7340AService OptionsOpt.CA1–Single Calibration or Functional Veriﬁcation.Opt.C3–Calibration Service3Years.Opt.C5–Calibration Service5Years.Opt.D3–Calibration Data Report3Years(with Opt.C3).Opt.D5–Calibration Data Report5Years(with Opt.C5).Opt.G3–Complete Care3Years(includes loaner,scheduled calibration and more). P7360A,P7380A onlyOpt.G5–Complete Care5Years(includes loaner,scheduled calibration and more). P7360A,P7380A onlyOpt.R3–Repair Service3Years.Opt.R5–Repair Service5Years.Language OptionsOpt.L0–English Manual.Opt.L5–Japanese Manual.Opt.L7–Simpliﬁed Chinese Manual.Additional Service Products Available During Warranty (DW)or Post Warranty(PW)P7313-CA1–Single Calibration or Functional Veriﬁcation.P7313-R1PW–Repair Service Coverage1-year Post Warranty.P7313-R2PW–Repair Service Coverage2-year Post Warranty.P7313-R3DW–Repair Service Coverage3Years(includes product warranty period); 3-year period starts at time of customer instrument purchase.P7313-R5DW–Repair Service Coverage5Years(includes product warranty period); 5-year period starts at time of customer instrument purchase.P7340A-CA1–Single Calibration or Functional Veriﬁcation.P7340A-R1PW–Repair Service Coverage1-year Post Warranty.P7340A-R2PW–Repair Service Coverage2-year Post Warranty.P7340A-R3DW–Repair Service Coverage3Years(includes product warranty period);3-year period starts at time of customer instrument purchase.P7340A-R5DW–Repair Service Coverage5Years(includes product warranty period);5-year period starts at time of customer instrument purchase.P7360A-CA1–Single Calibration or Functional Veriﬁcation.P7360A-R1PW–Repair Service Coverage1-year Post Warranty.P7360A-R2PW–Repair Service Coverage2-year Post Warranty.P7360A-R3DW–Repair Service Coverage3Years(includes product warranty period);3-year period starts at time of customer instrument purchase.P7360A-R5DW–Repair Service Coverage5Years(includes product warranty period);5-year period starts at time of customer instrument purchase.P7380A-CA1–Single Calibration or Functional Veriﬁcation.P7380A-R1PW–Repair Service Coverage1-year Post Warranty.P7380A-R2PW–Repair Service Coverage2-year Post Warranty.P7380A-R3DW–Repair Service Coverage3Years(includes product warranty period);3-year period starts at time of customer instrument purchase.P7380A-R5DW–Repair Service Coverage5Years(includes product warranty period);5-year period starts at time of customer instrumentpurchase.Tektronix is registered to ISO9001and ISO14001by SRI Quality SystemRegistrar.Product(s)complies with IEEE Standard488.1-1987,RS-232-C,and with TektronixStandard Codes and Formats.5Data SheetZ-Active™Differential Probe Family—P7313•P7380A•P7360A•P7340A7Data Sheet Contact Tektronix:ASEAN/Australasia(65)63563900Austria0080022554835*Balkans,Israel,South Africa and other ISE Countries+41526753777Belgium0080022554835*Brazil+55(11)37597627Canada180********Central East Europe and the Baltics+41526753777Central Europe&Greece+41526753777Denmark+4580881401Finland+41526753777France0080022554835*Germany0080022554835*Hong Kong4008205835India0008006501835Italy0080022554835*Japan81(3)67143010Luxembourg+41526753777Mexico,Central/South America&Caribbean52(55)56045090Middle East,Asia,and North Africa+41526753777The Netherlands0080022554835*Norway80016098People’s Republic of China4008205835Poland+41526753777Portugal800812370Republic of Korea00180082552835Russia&CIS+7(495)7484900South Africa+41526753777Spain0080022554835*Sweden0080022554835*Switzerland0080022554835*Taiwan886(2)27229622United Kingdom&Ireland0080022554835*USA180*********European toll-free number.If not accessible,call:+41526753777Updated10February2011For Further Information.Tektronix maintains a comprehensive,constantly expandingcollection of application notes,technical briefs and other resources to help engineers workingon the cutting edge of technology.Please visit Copyright©Tektronix,Inc.All rights reserved.Tektronix products are covered by U.S.and foreign patents,issued and rmation in this publication supersedes that in all previously published material.Speciﬁcation and price change privileges reserved.TEKTRONIX and TEK are registered trademarks ofTektronix,Inc.All other trade names referenced are the service marks,trademarks,or registered trademarksof their respective companies.02Oct201151W-17891-12。

HS8916_V0.6_Datasheet Preliminary

QUAD-BAND GSM/GPRS/EDGE W Multi-Mode Transmit Module with Fourteen Linear TRx Switch Ports andDual-Band TD-SCDMA B34/39 and TDD LTE B39HS8916 Preliminary DatasheetVersion 0.62016-03-21HS8916 Front-end ModuleProduct Features ApplicationsG N DG N DG N DG N DG N DC P LG NDN CTRX10ANT TRX9TRX8GND GNDGND TRX11TRX12TRX13TRX14•LGA: 5.5 mm x 5.3 mm x 0.85 mm Max•Fully programmable MIPI RFFE control •Fourteen low -insertion-loss TRx ports (fiveultra-low loss) with enhanced linearity, for state-of-the-art 4G performance and GPS /•Cellular handsets encompassing Quad -Band GSM/EDGE, Dual-Band TD-SCDMA, and TDD LTE- Class 4 GSM850/900 - Class 1 DCS1800/PCS1900Product DescriptionThe HS8916 is a high-power, high-efficiency Front-End Module for GSM850/900, DCS1800, PCS1900 operation. The FEM supports Class.12 General Packet Radio Service (GPRS), EDGE multi-slot operation, and TD-SCDMA and TDD LTE linear transmission.The module provides 50 ohm impedance at input and output ports, consists of a CMOS Controller, a SP16T RF switch, a power amplifier supporting GSM850/900, DCS1800/PCS1900, TD-SCDMA bands 34/39, and TDD LTE band 39. The module integrated Tx low pass harmonic filtering can achieve best harmonic performance.The HS8916 provides high-power and high-efficiency Pout for GSM850/900, DCS1800, PCS1900 operation mode. In EDGE and TD-SCDMA / TDD LTE linear modes, VRAMP voltage and MIPI-based bias settings optimize PA linearity and efficiency.Absolute Maximum RatingsMIPI RFFE REGISTER MAP (1 OF 2)MIPI RFFE REGISTER MAP (2 OF 2)Electrical Specifications – TX GSM850/900 Band, GSMK ModeElectrical Specifications – TX GSM850/900 Band, EDGE ModeElectrical Specifications – TX DCS1800/1900 Band, GMSK ModeElectrical Specifications – TX DCS1800/1900 Band, EDGE ModeElectrical Specifications – TX TD-SCDMA B39 BandElectrical Specifications – TX TDD LTE B39 BandElectrical Specifications – TX TD-SCDMA B34 BandElectrical Specifications – Ports TRx1 to TRx14 ModePin-Out DiagramT R X 7T R X 6T R X 5G N DT R X 1T R X 2T R X 3T R X 4HS8916 Application CircuitT R X 7T R X 6T R X 5G N DR X 1T R X 2T R X 3T R X 4Package DrawingThe HS8916 is encapsulated in a 5.5×5.3×0.85mm Land Grid Array (LGA) package on a laminate substrate. The HS8916 is RoHS compliant.。

AX88772B_Datasheet_亚信

FeaturesSingle chip USB 2.0 to 10/100M Fast Ethernet controllerSingle chip USB 2.0 to RMII, support HomePNAand HomePlug PHYSingle chip USB 2.0 to Reverse-RMII,supportsglueless MAC-to-MAC connectionsUSB Device InterfaceIntegrates on-chip USB 2.0 transceiver andSIE compliant to USB Spec 1.1 and 2.0Supports USB Full and High Speed modeswith Bus-Power or Self-Power capabilitySupports 4 or 6 programmable endpoints onUSB interfaceSupports AutoDetach power saving. Detachfrom USB host when Ethernet cable isunpluggedHigh performance packet transfer rate overUSB bus using proprietary burst transfermechanism (US Patent Approval)Fast Ethernet ControllerIntegrates 10/100Mbps Fast EthernetMAC/PHYIEEE 802.3 10BASE-T/100BASE-TXcompatibleIEEE 802.3 100BASE-FX compatibleSupports twisted pair crossover detection andauto-correction (HP Auto-MDIX)Embedded SRAM for RX/TX packetbufferingSupports IPv4/ IPv6 packet ChecksumOffload Engine(COE) to reduce CPU loading,including IPv4 IP/TCP/UDP/ICMP/IGMP &IPv6 TCP/UDP/ICMPv6 checksum check &generationSupports full duplex operation with IEEE802.3x flow control and half duplex operationwith back-pressure flow controlSupports 2 VLAN ID filtering, receivedVLAN Tag (4 bytes) can be stripped off orpreservedPHY loop-back diagnostic capabilitySupport Wake-on-LAN FunctionSupports Suspend Mode and Remote Wakeupvia Link-change, Magic packet, MS wakeupframe and external wakeup pinSupports Protocol Offload (ARP & NS) forWindows 7 Networking Power ManagementOptional PHY power down during SuspendModeVersatile External Media InterfaceOptional RMII interface in MAC mode allowsAX88772B to work with HomePNA andHomePlug PHYOptional Reverse-RMII interface in PHYmode allows AX88772B to support gluelessMAC-to-MAC connectionsAdvanced Power Management FeaturesSupports dynamic power management toreduce power dissipation during idle or lighttrafficSupports very low power Wake-on-LAN(WOL) mode when the system enters suspendmode and waits for network events to wake itup.Supports 256/512 bytes (93c56/93c66) of serialEEPROM (for storing USB Descriptors)Supports embedded Device Descriptors ROM and512 bytes ID-SRAM (online programmablememory for USB Device Descriptors, etc) tosave external EEPROMSupports automatic loading of Ethernet ID, USBDescriptors and Adapter Configuration fromEEPROM after power-on initializationIntegrates on-chip voltage regulator and onlyrequires a single 3.3V power supplySingle 25MHz clock input from either crystal oroscillator sourceIntegrates on-chip power-on reset circuitSmall form factor with 64-pin LQFP RoHScompliant packageOperating commercial temperature range 0°C to70°C or industriure range -40 to +85°CDocument No: AX88772B/V1.04/08/10/11Target ApplicationsPC/InternetConsumer ElectronicsFigure 1: Target ApplicationsPocketable ComputerUSB DongleDocking StationCard Reader USB KVMESwitchInternet SecurityUSB Key Port Replicatorfor Mobile ComputerUWB/802.11n/WiMAXUSB DongleMedia GatewayUMPC Portable Media Player ePianoIPTVIP STB TiVo Box Game ConsoleDVD-Recorder/DVRTypical System Block Diagramsz Hosted by USB to operate with internal Ethernet PHY onlyFigure 2: USB 2.0 to LAN Adaptor (MAC mode)zHosted by USB to operate with either internal Ethernet PHY or RMII (in MAC mode)Figure 3: USB 2.0 to Fast Ethernet and external PHYceiver Combo (MAC mode)Ethernet PHYORAX88772BEthernet PHYORzHosted by USB to operate with either internal Ethernet PHY (in MAC mode) or Reverse-RMII (in PHY mode)Figure 4: Bridging Embedded MCU to USB 2.0 Host Interface (PHY mode)Figure 5: USB 2.0 to HomePlug Adaptor (PHY mode)Ethernet PHYOREthernet PHYORCopyright © 2010-2011 ASIX Electronics Corporation. All rights reserved.DISCLAIMERNo part of this document may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopying and recording, for any purpose, without the express written permission of ASIX. ASIX may make changes to the product specifications and descriptions in this document at any time, without notice.ASIX provides this document “as is” without warranty of any kind, either expressed or implied, including without limitation warranties of merchantability, fitness for a particular purpose, and non-infringement.Designers must not rely on the absence or characteristics of any features or registers marked “reserved”, “undefined” or “NC”. ASIX reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. Always contact ASIX to get the latest document before starting a design of ASIX products.TRADEMARKSASIX, the ASIX logo are registered trademarks of ASIX Electronics Corporation. All other trademarks are the property of their respective owners.Table of Contents1 INTRODUCTION (10)1.1 G ENERAL D ESCRIPTION (10)1.2 B LOCK D IAGRAM (10)1.3 P INOUT D IAGRAM (11)2 SIGNAL DESCRIPTION (12)2.1 AX88772B64-PIN P INOUT D ESCRIPTION (12)2.2 H ARDWARE S ETTING F OR O PERATION M ODE AND M ULTI-F UNCTION P INS (15)3 FUNCTION DESCRIPTION (17)3.1 USB C ORE AND I NTERFACE (17)3.2 10/100M E THERNET PHY (17)3.3 MAC C ORE (17)3.4 C HECKSUM O FFLOAD E NGINE (COE) (18)3.5 O PERATION M ODE (18)3.6 S TATION M ANAGEMENT (STA) (21)3.7 M EMORY A RBITER (23)3.8 USB TO E THERNET B RIDGE (23)3.8.1 Ethernet/USB Frame Format Bridge (23)3.9 S ERIAL EEPROM L OADER (23)3.10 G ENERAL P URPOSE I/O (23)3.11 C LOCK G ENERATION (24)3.12 R ESET G ENERATION (25)3.13 V OLTAGE R EGULATOR (25)4 SERIAL EEPROM MEMORY MAP (26)4.1 D ETAILED D ESCRIPTION (27)4.2 I NTERNAL ROM D EFAULT S ETTINGS (30)4.2.1 Internal ROM Description (31)4.2.2 External EEPROM Description (33)5 USB CONFIGURATION STRUCTURE (34)5.1 USB C ONFIGURATION (34)5.2 USB I NTERFACE (34)5.3 USB E NDPOINTS (34)6 USB COMMANDS (35)6.1 USB S TANDARD C OMMANDS (35)6.2 USB V ENDOR C OMMANDS (36)6.2.1 Detailed Register Description (38)6.3 I NTERRUPT E NDPOINT (63)6.4 B ULK-O UT T IMER AND M ONITOR (BOTM) (64)7 EMBEDDED ETHERNET PHY REGISTER DESCRIPTION (65)7.1 PHY R EGISTER D ETAILED D ESCRIPTION (65)7.1.1 Basic Mode Control Register (BMCR) (66)7.1.2 Basic Mode Status Register (BMSR) (67)7.1.3 PHY Identifier Register 1 (PHYIDR1) (68)7.1.4 PHY Identifier Register 2 (PHYIDR2) (68)7.1.5 Auto Negotiation Advertisement Register (ANAR) (68)7.1.6 Auto Negotiation Link Partner Ability Register (ANLPAR) (69)7.1.7 Auto Negotiation Expansion Register (ANER) (69)8 STATION MANAGEMENT REGISTERS IN PHY MODE (70)8.1 PHY M ODE D ETAILED R EGISTER D ESCRIPTION (71)8.1.1 PHY Mode Basic Mode Control Register (PM_BMCR) (71)8.1.2 PHY Mode Basic Mode Status Register (PM_BMSR) (72)8.1.3 PHY Mode PHY Identifier Register 1 (PM_PHYIDR1) (73)8.1.4 PHY Mode PHY Identifier Register 2 (PM_PHYIDR2) (73)8.1.5 PHY Mode Auto Negotiation Advertisement Register (PM_ANAR) (73)8.1.6 PHY Mode Auto Negotiation Link Partner Ability Register (PM_ANLPAR) (74)8.1.7 PHY Mode Auto Negotiation Expansion Register (PM_ANER) (74)8.1.8 PHY Mode Control Register (PM_Control) (75)9 ELECTRICAL SPECIFICATIONS (76)9.1 DC C HARACTERISTICS (76)9.1.1 Absolute Maximum Ratings (76)9.1.2 Recommended Operating Condition (76)9.1.3 Leakage Current and Capacitance (77)9.1.4 DC Characteristics of 3.3V I/O Pins (77)9.1.5 DC Characteristics of 3.3V with 5V Tolerance I/O Pins (78)9.1.6 DC Characteristics of Voltage Regulator (78)9.2 T HERMAL C HARACTERISTICS (79)9.3 P OWER C ONSUMPTION (79)9.4 P OWER-UP S EQUENCE (80)9.5 AC T IMING C HARACTERISTICS (81)9.5.1. Clock Timing (81)9.5.2. Reset Timing (81)9.5.3. Serial EEPROM Timing (82)9.5.4. Station Management Timing (83)9.5.5. RMII / Reverse-RMII Timing (84)9.5.6. 10/100M Ethernet PHY Interface Timing (85)9.5.7. USB Transceiver Interface Timing (86)10 PACKAGE INFORMATION (88)10.1 AX88772B64-PIN LQFP PACKAGE (88)11 ORDERING INFORMATION (89)12 REVISION HISTORY (90)APPENDIX A. DEFAULT WAKE-ON-LAN (WOL) READY MODE (91)APPENDIX B. ETHERNET PHY POWER AND RESET CONTROL (94)APPENDIX C. EXTERNAL EEPROM / INTERNAL ROM / INTERNAL ID-SRAM OF VENDER DESCRIPTIONS SELECTION (96)List of FiguresF IGURE 1 :T ARGET A PPLICATIONS (2)F IGURE 2 :USB2.0 TO LAN A DAPTOR (MAC MODE) (3)F IGURE 3 :USB2.0 TO F AST E THERNET AND EXTERNAL PHY CEIVER C OMBO (MAC MODE) (3)F IGURE 4 :B RIDGING E MBEDDED MCU TO USB2.0H OST I NTERFACE (PHY MODE) (4)F IGURE 5 :USB2.0 TO H OME P LUG A DAPTOR (PHY MODE) (4)F IGURE 6 :AX88772B B LOCK D IAGRAM (10)F IGURE 7 :AX88772B P INOUT D IAGRAM (11)F IGURE 8 :I NTERNAL D ATA PATH D IAGRAM OF 10/100M E THERNET PHY AND RMII/R EVERSE-RMII I NTERFACES .. 17 F IGURE 9 :AX88772B RMII TO E XTERNAL PHY CHIP WITH 50MH Z OSC (19)F IGURE 10 :AX88772B RMII I NTERFACE TO E XTERNAL PHY CHIP (19)F IGURE 11 :AX88772B R EVERSE-RMII TO E XTERNAL MAC D EVICE WITH 50MH Z OSC (20)F IGURE 12 :AX88772B R EVERSE-RMII I NTERFACE TO E XTERNAL MAC D EVICE (20)F IGURE 13 :I NTERNAL C ONTROL MUX OF S TATION M ANAGEMENT I NTERFACE IN MAC MODE (21)F IGURE 14 :I NTERNAL C ONTROL MUX OF S TATION M ANAGEMENT I NTERFACE IN PHY MODE (22)F IGURE 15 :O NE EXTERNAL 1M OHM RESISTOR ON 25MH Z CRYSTAL OSCILLATOR IS NECESSARY (25)F IGURE 16 :W ATER LEVEL SETTING FOR FLOW CONTROL (29)F IGURE 17 :M ULTICAST F ILTER E XAMPLE (43)F IGURE 18 :M ULTICAST F ILTER A RRAY H ASHING A LGORITHM (44)F IGURE 19 :M ULTICAST F ILTER A RRAY B IT M APPING (44)F IGURE 20 :802.1Q VLAN P ACKET F ORMAT (54)F IGURE 21 :S TATION M ANAGEMENT F RAME FOR PHY M ODE (70)F IGURE 22 :E THERNET PHY O SCILLATOR/PLL B LOCK D IAGRAM (94)F IGURE 23 :E THERNET PHY P OWER-UP &R ESET T IMING D IAGRAM (95)F IGURE 24 :E XTERNAL EEPROM/I NTERNAL ROM/I NTERNAL ID-SRAM OF V ENDER D ESCRIPTIONS SELECTION 97List of TablesT ABLE 1 :AX88772B P INOUT D ESCRIPTION (14)T ABLE 2 :MFA_3~MFA_0 PIN CONFIGURATION (15)T ABLE 3 :AX88772B PHY_ID D EFINITION S OURCE (18)T ABLE 4 :T HE EXTERNAL 25M HZ C RYSTAL U NITS SPECIFICATIONS (24)T ABLE 5 :S ERIAL EEPROM M EMORY M AP (26)T ABLE 6 :I NTERNAL ROM M EMORY M AP (30)T ABLE 7 :I NTERNAL ROM D ESCRIPTION (31)T ABLE 8 :USB S TANDARD C OMMAND R EGISTER M AP (35)T ABLE 9 :USB V ENDOR C OMMAND R EGISTER M AP (37)T ABLE 10 :W AKE-UP F RAME A RRAY R EGISTER (WUD3~0)S TRUCTURE D EFINITION (50)T ABLE 11 :VID1,VID2 SETTING TO FILTER RECEIVED PACKET (53)T ABLE 12 :E MBEDDED E THERNET PHY R EGISTER M AP (65)T ABLE 13 :S TATION M ANAGEMENT R EGISTER M AP IN PHY M ODE (70)T ABLE 14 :P OWER CONSUMPTION (79)T ABLE 15 :R EMOTE W AKEUP T RUTH T ABLE (92)1 Introduction1.1 General DescriptionThe AX88772B Low-power USB 2.0 to 10/100M Fast Ethernet controller is a high performance and highly integrated ASIC which enables low cost, small form factor, and simple plug-and-play Fast Ethernet network connection capability for desktops, notebook PC’s, Ultra-Mobile PC’s, docking stations, game consoles, digital-home appliances, and any embedded system using a standard USB port.The AX88772B features a USB interface to communicate with a USB Host Controller and is compliant with USB specification V1.1 and V2.0. The AX88772B implements a 10/100Mbps Ethernet LAN function based on IEEE802.3, and IEEE802.3u standards with embedded SRAM for packet buffering. The AX88772B integrates an on-chip 10/100Mbps Ethernet PHY to simplify system design.The AX88772B provides an optional Multi-Function-Bus portion A and B (MFA and MFB) for external PHY or external MAC for different application purposes. The MFA/MFB can be a reduce-media-independent interface (RMII) for implementing HomePlug, HomePNA, etc. functions. The MFA/MFB can also be a Reverse Reduced-MII (Reverse-RMII) for glueless MAC-to-MAC connections to any MCU with Ethernet MAC RMII interface. In addition, the MFA/MFB can be configured as general purpose I/O. 1.2 Block DiagramFigure 6: AX88772B Block DiagramDP/DMSEEPROM Loader I/FGeneral PurposeI/O 3.3 to 1.8V RegulatorPLL Clock GeneratorsPower-On-Reset & Reset Gen.RESET_NXTL25P, XTL25N1.3 Pinout Diagramz AX88772B in 64-pin LQFP packageG N DT E S T 0T E S T 1R E S E T _NV C C 3I OT C L K _E NT C L K _0T C L K _1E E D I OE E C SE E C K G N DV C C KM F B 0M F B 1M F B 2V C C 18X T L 25X T L 25G N D 18R S E T _B V C C 3A S G N D 18R X I R X I V C C 18T X O T X O G N D 18G N V C C 3I OFigure 7: AX88772B Pinout Diagram2 Signal DescriptionThe following abbreviations apply to the following pin description table.I18 Input, 1.8V AI Analog Input I3 Input, 3.3V AO Analog Output I5 Input, 3.3V with 5V tolerant AB Analog Bi-directional I/O O3 Output, 3.3V PU Internal Pull Up (75K) B5 Bi-directional I/O, 3.3V with 5V tolerant PD Internal Pull Down (75K) P Power Pin S T Schmitt Trigger Tri-stateable Note: Every output or bi-directional I/O pin is 8mA driving strength.2.1 AX88772B 64-pin Pinout DescriptionPin NameTypePin NoPin DescriptionUSB InterfaceDP AB 56 USB 2.0 data positive pin. DM AB 57 USB 2.0 data negative pin. V_BUS I5/PD/S 50 VBUS pin input. Please connect to USB bus power. RREF AI 58 For USB PHY’s internal biasing. Please connect to analog GND through aresistor (12.1Kohm ±1%).Serial EEPROM InterfaceEECK B5/PD/T 38 EEPROM Clock. EECK is an output clock to EEPROM to provide timingreference for the transfer of EECS, and EEDIO signals. EECK only drivehigh / low when access EEPROM otherwise keep at tri-state and internal pull-down.EECS B5/PD/T 39 EEPROM Chip Select. EECS is asserted high synchronously with respect torising edge of EECK as chip select signal. EECS only drive high / low whenaccess EEPROM otherwise keep at tri-state and internal pull-down.EEDIO B5/PU/T 40 EEPROM Data In. EEDIO is the serial output data to EEPROM’s data inputpin and is synchronous with respect to the rising edge of EECK. EEDIOonly drive high / low when access EEPROM otherwise keep at tri-state and internal pull-up.Ethernet PHY InterfaceXTL25P I18 2 25Mhz ± 0.005% crystal or oscillator clock input. This clock is needed forthe embedded 10/100M Ethernet PHY to operate.XTL25N O18 3 25Mhz crystal or oscillator clock output. RXIP AB 9 Receive data input positive pin for both 10BASE-T and 100BASE-TX. RXIN AB 10 Receive data input negative pin for both 10BASE-T and 100BASE-TX. TXOP AB 12 Transmit data output positive pin for both 10BASE-T and 100 BASE-TX TXON AB 13 Transmit data output negative pin for both 10BASE-T and 100 BASE-TX RSET_BG AO 5 For Ethernet PHY’s internal biasing. Please connect to GND through a12.1Kohm ±1% resistor.Misc. PinsRESET_N I5/PU/S 45 Chip reset input. Active low. This is the external reset source used to resetthis chip. This input feeds to the internal power-on reset circuitry, which provides the main reset source of this chip. After completing reset, EEPROM data will be loaded automatically.EXTWAKEUP_N I5/PU/S 23 Remote-wakeup trigger from external pin. EXTWAKEUP_N should beasserted low for more than 2 cycles of 25MHz clock to be effective.GPIO_2 B5/PD 25 General Purpose Input/ Output Pin 2. GPIO_1 B5/PD 26 General Purpose Input/ Output Pin 1. This pin is default as input pin afterpower-on reset. This pin is also for Default WOL Ready Mode setting;please refer to section 2.2 Settings.GPIO_0/PME B5/PD 27 General Purpose Input/ Output Pin 0 or PME (Power Management Event).This pin is default as input pin after power-on reset. GPIO_0 also can bedefined as PME output to indicate wake up event detected. Please refer tosection 2.2 Settings.MFB7 B5/PUI5I5 28 This is a multi-function pin. Please refer to section 2.2 Settings.MFB7:RMII : RXD0Reverse_RMII : TXD0MFB6 B5/PUI5I5 29 This is a multi-function pin. Please refer to section 2.2 Settings.MFB6:RMII : RXD1Reverse_RMII : TXD1MFB5/ REF50 B5/PUB530 This is a multi-function pin. Please refer to section 2.2 Settings.MFB5:When RMII enable, The REF50 in/out direction is determined by EEPROMFlag [1] setting. Please refer to section 2.2 Settings.MFB4 B5/PUO3O3 31 This is a multi-function pin. Please refer to section 2.2 Settings.RMII : TXD0Reverse_RMII : RXD0MFB3 B5/PUO3O3 32 This is a multi-function pin. Please refer to section 2.2 Settings.RMII : TXD1Reverse_RMII : RXD1MFB2 B5/PUO3O3 33 This is a multi-function pin. Please refer to section 2.2 Settings.RMII : TXENReverse_RMII : CRSDVMFB1 B5/PUI5I5 34 This is a multi-function pin. Please refer to section 2.2 Settings.RMII : CRSDVReverse_RMII : TXENMFB0 B5/PU35 This is a GPIO pin. Please refer to section 2.2 Settings.MFA3/ PHY_NO3I5/PU21 It is a multi-function pin. The default is USB Speed indicator. When USBbus is in Full speed, this pin will tri-state continuously. When USB bus is inHigh speed, this pin drives low continuously. This pin tri-state and drive lowin turn (blinking) to indicate TX data transfer going on whenever the hostcontroller sends bulk out data transfer.MFB1~7 bus is determined by setting of this input pin when MFA2 sets 0:0: Reverse_RMII (PHY mode).1: RMII (MAC mode).Please refer to PIN configuration of MFA and MFB in section 2.2 Settings.MFA2/ RMII_NO3I5/PU19 It is a multi-function pin. The default is Link status LED indicator.This pin drives low continuously when the Ethernet link is up and drives lowand high in turn (blinking) when Ethernet PHY is in receiving ortransmitting state.MFB1~7 function is determined by setting of this input pin:0: Reverse_RMII/RMII .1: MFB bus as GPIO function.Please refer to PIN configuration of MFA and MFB in section 2.2 Settings.MFA1/ MDIOO3B5/PU18 It is a multi-function pin. The default is Ethernet speed LED indicator.This pin drives low when the Ethernet PHY is in 100BASE-TX mode anddrives high when in 10BASE-T mode.This pin can perform as MDIO when enabling Reverse_RMII/RMII.MFA0/MDCO3O3I5/PU 17 It is a multi-function pin. The default is Full Duplex and collision detectedLED indicator.This pin drives low when the Ethernet PHY is in full-duplex mode and drives high when in half duplex mode. When in half duplex mode and the Ethernet PHY detects collision, it will be driven low (or blinking).This pin can perform as MDC when enabling Reverse_RMII/RMII:RMII : Output.Reverse_RMII : Input.SD I 7 Fiber signal detectedTwisted pair operation: Please connect to GND directly or through aresistor.Fiber operation: Please connect to the fiber transceiver signal detect outputpin.TEST0 I5/S 47 Test pin. For normal operation, user should connect to ground.TEST1 I5/S 46 Test pin. For normal operation, user should connect to ground.X1 I3 62 Test pin. For normal operation, user should connect to ground.X2 O3 61 Test pin. No connectionTCLK_EN I5/PD/S 43 Test pin. For normal operation, user should keep this pin NC.TCLK_0 I5/PD 42 Test pin. For normal operation, user should keep this pin NC.TCLK_1 I5/PD 41 Test pin. For normal operation, user should keep this pin NC.On-chip Regulator PinsVCC3R3 P 52 3.3V Power supply to on-chip 3.3V to 1.8V voltage regulator.GND3R3 P 53 Ground pin of on-chip 3.3V to 1.8V voltage regulator.V18F P 51 1.8V voltage output of on-chip 3.3V to 1.8V voltage regulator.Power and Ground PinsVCCK P 20, 24, 36, 49Digital Core Power. 1.8V.VCC3IO P 16, 44 Digital I/O Power. 3.3V.GND P 15, 22, 37, 48Digital Ground.VCC33A_H P 60 Analog Power for USB transceiver. 3.3V.GND33A_H P 55 Analog Ground for USB transceiver.VCC33A_PLL P 59 Analog Power for USB PLL. 3.3V.GND33A_PLL P 54 Analog Ground for USB PLL.VCC3A3 P 6 Analog Power for Ethernet PHY bandgap. 3.3V.VCC18A P 1, 11 Analog Power for Ethernet PHY and 25Mhz crystal oscillator.1.8V.GND18A P 4, 8, 14 Analog Ground for Ethernet PHY and 25Mhz crystal oscillator. VCC18A_PLL P 64 Analog Power for USB PLL. 1.8V.GND18A_PLL P 63 Analog Ground for USB PLL.Table 1: AX88772B Pinout Description2.2 Hardware Setting For Operation Mode and Multi-Function PinsThe following hardware settings define the desired function or interface modes of operation for some multi-function pins. The logic level shown on setting pin below is loaded from the chip I/O pins during power on reset based on the setting of the pin’s pulled-up (as logic ‘1’) or pulled-down (as logic ‘0’) resister on the schematic.z Chip Operation Mode setting :Pin# 19, Pin #21 Operation Modes Remarks 1x (default) MAC mode Internal PHY The Chip Operation Mode is determined by Pin# 19(MFA2/RMII_N) and Pin #21 (MFA3/PHY_N) value of AX88772B, which is called hardware setting. 01 MAC mode RMII00 PHY mode Reverse-RMIIz EECK pin: USB force to Full Speed mode :EECK Description 0 Normal operation (default). 1 USB force to Full Speed mode. External pull-up resistor must be 4.7Kohm.z GPIO_1 pin: Determines whether this chip will go to Default WOL Ready Mode after power on reset. The WOLstands for Wake-On-LAN.GPIO_1 Description0 Normal operation mode (default, see Note 1). 1 Enable Default WOL Ready Mode. Notice that the external pulled-up resistor must be 4.7Kohm.For more details, please refer to APPENDIX A. Default Wake-On-LAN (WOL) Ready ModeNote 1: This is the default with internal pulled-down resistor and doesn’t need an external one.z EEPROM Flag [12]: Defines the multi-function pin GPIO_0 / PMEGPIO_0 is a general purpose I/O normally controlled by vendor commands. Users can change this pin to operate as a PME (Power Management Event) for remote wake up purpose. Please refer to 4.1.2 Flag of bit 12 (PME_PIN).z MFA_3 ~ MFA_0 pins: There are 4 multi-function pins for LED display purpose and as GPIO control by vendorcommand.Table 2: MFA_3 ~ MFA_0 pin configurationPIN Name Default definitionVendor Command LED_MUX Vendor CommandVMFAIORMII_N enableMFA3 LED_USB indicater Sel_LED3 MFAIO_3- MFA2 LED_Ethernet_LINK_Active Sel_LED2MFAIO_2-MFA1 LED_Ethernet_Speed Sel_LED1 MFAIO_1 MDIO MFA0 LED_Ethernet_Duplex_Collision Sel_LED0MFAIO_0MDCz PIN configuration of MFA and MFBPin# 19 MFA2/RMII_NPin #21MFA3/PHY_NDescription1: MFB7~MFB0 0: RMII 1: MAC Mode0: PHY ModePINNameFunction Pin Type1 X MFB0 MFBIO0 Bidirection, controlled by MFBIOEN01 X MFB1 MFBIO1 Bidirection, controlled by MFBIOEN11 X MFB2 MFBIO2 Bidirection, controlled by MFBIOEN21 X MFB3 MFBIO3 Bidirection, controlled by MFBIOEN31 X MFB4 MFBIO4 Bidirection, controlled by MFBIOEN41 X MFB5 MFBIO5 Bidirection, controlled by MFBIOEN51 X MFB6 MFBIO6 Bidirection, controlled by MFBIOEN61 X MFB7 MFBIO7 Bidirection, controlled by MFBIOEN71 X MFA0 Refer to MFAConfiguration1 X MFA1 Refer to MFAConfiguration1 X MFA2 Refer to MFAConfiguration1 X MFA3 Refer to MFAConfiguration0 1 MFB0 MFBIO0 Bidirection, controlled by MFBIOEN00 1 MFB1 CRSDV Input0 1 MFB2 TXEN Output0 1 MFB3 TXD1 Output0 1 MFB4 TXD0 Output0 1 MFB5 REF50 Input/Output control by EEPROM flag[1] 0 1 MFB6 RXD1 Input0 1 MFB7 RXD0 Input0 1 MFA0 MDC Output0 1 MFA1 MDIO I/O0 0 MFB0 MFBIO0 Bidirection, controlled by MFBIOEN00 0MFB1TXEN Input 0 0MFB2CRSDV Output 0 0MFB3RXD1 Output 0 0MFB4RXD0 Output 0 0 MFB5 REF50 Input/Output control by EEPROM flag[1] 0 0MFB6TXD1 Input 0 0MFB7TXD0 Input 0 0MFA0MDC Input 0 0MFA1MDIO I/O3 Function Description3.1 USB Core and InterfaceThe USB core and interface contains a USB 2.0 transceiver, serial interface engine (SIE), USB bus protocol handshaking block, USB standard command, vendor command registers, logic for supporting bulk transfer, and an interrupt transfer, etc. The USB interface is used to communicate with a USB host controller and is compliant with USB specification V1.1 and V2.0.3.2 10/100M Ethernet PHYThe 10/100M Fast Ethernet PHY is compliant with IEEE 802.3 and IEEE 802.3u standards. It contains an on-chip crystal oscillator, PLL-based clock multiplier, and a digital phase-locked loop for data/timing recovery. It providesover-sampling mixed-signal transmit drivers compliant with 10/100BASE-TX transmit wave shaping / slew rate control requirements. It has a robust mixed-signal loop adaptive equalizer for receiving signal recovery. It contains a baseline wander corrective block to compensate data dependent offset due to AC coupling transformers. It supports auto-negotiation and auto-MDIX functions.3.3 MAC CoreThe MAC core supports 802.3 and 802.3u MAC sub-layer functions, such as basic MAC frame receive and transmit, CRC checking and generation, filtering, forwarding, flow-control in full-duplex mode, and collision-detection and handling in half-duplex mode, etc. It provides a reduce-media-independent interface (RMII) for implementing Fast Ethernet and HomePNA functions.The MAC core interfaces to external RMII/Reverse-RMII interfaces and the embedded 10/100M Ethernet PHY. The selection among the interfaces is done via setting Pin# 19 (MFA2/RMII_N) and Pin #21 (MFA3/PHY_N) of AX88772B package pinout during power on reset (see 2.2) and using the USB vendor command, Software Interface Selection register . Figure 8 shows the data path diagram of 10/100M Ethernet PHY and RMII/Reverse-RMII interfaces to MAC core.Figure 8: Internal Data path Diagram of 10/100M Ethernet PHY and RMII/Reverse-RMII InterfacesREFCLK, RXD [1:0], CRSDV, TXD [1:0], TXEN RXIP/RXIN TXOP/TXON3.4 Checksum Offload Engine (COE)The Checksum Offload Engine (COE) supports IPv4, IPv6, layer 4 (TCP, UDP, ICMP, ICMPv6 and IGMP) header processing functions and real time checksum calculation in hardwareThe COE supports the following features in layer 3:z IP header parsing, including IPv4 and IPv6z IPv6 routing header type 0 supportedz IPv6 in IPv4 tunnel supportedz IPv4 header checksum check and generation (There is no checksum field in IPv6 header)z Version error detecting on RX direction for IP packets with version != 4 or 6z Detecting on RX direction for IP packets with error header checksumThe COE supports the following features in layer 4:z TCP and UDP checksum check and generation for non-fragmented packetz ICMP, ICMPv6 and IGMP message checksum check and generation for non-fragmented packetz Packet filtering or checksum error indication on RX direction for TCP/UDP/ICMP/ICMPv6/IGMP packets with error checksum3.5Operation ModeFor simple USB 2.0 to Ethernet applications, user can use the AX88772B, which operates with internal Ethernet PHY. AX88772B supports following three operation modes: (Ref. 2.2 Hardware Setting For Operation Mode AndMulti-Function Pins)1.MAC mode2.PHY modeBelow provides a detailed description for the three operation modes:z In MAC mode, the AX88772B Ethernet block is configured as an Ethernet MAC. From a system application standpoint, AX88772B can be used as a USB 2.0 to LAN Adaptor (see Figure 2) or a USB 2.0 to Fast Ethernet and HomePNA Combo (see Figure 3).In MAC mode, the AX88772B internal datapath can work with internal Ethernet PHY or RMII interface bysetting Software Interface Selection register. Note that the PHY_ID for the internal Ethernet PHY and external one are defined in below Table 3. Please refer to below Figure 9, Figure 10 for RMII example.z In PHY mode, the AX88772B Ethernet block is configured as an Ethernet PHY interface. In this case, an external microcontroller with Ethernet MAC can interface with AX88772B as if it were to interface with an Ethernet PHY chip, and AX88772B can act as a USB to Reverse-RMII bridge chip for the microcontroller to provide USB 2.0 device interface for some system applications (see Figure 4).Please refer to below Figure 11, Figure 12 for Reverse-RMII example.STA PHY_ID MAC mode PHY modeEmbedded Ethernet PHYPHY_ID [4:0]10h 10hExternal Media Interface PHY_ID [4:0] {Secondary PHY_ID[4:0]}{Secondary PHY_ID [4:1], 0}Note: The value of Secondary PHY_ID [4:0] is defined in EEPROM memory map 4.1.6 Table 3: AX88772B PHY_ID Definition Source。

索拉特龙S系列位移传感器产品手册说明书

Since 1970Distributing Tomorrow’s Technologies For Today’s DesignsToll-Free: 1-800-777-7334/solartronDatasheet502686issue 7EDCR 18768 S-SeriesDisplacement Transducers• <0.2% Linearity FSO• 19mm Diameter Stainless Steel Body• IP 65 or IP 67 Protection• Improved measuring range to body length• AC, DC, 4-20mA and Digital output versions• Large Bore to core clearance• Wide range of instruments & signal conditioningThe S-Series of Displacement Transducers is the culmination of many years of experience gained from Solartron Metrology’s highly successful Mach One range plus careful note of market feed-back. The result is a totally new range of transducers that is better able to satisfy today’s demand-ing manufacturing and research applications.The need to transfer signals from the transducer to data acquisition and control systems reliably, quickly and cost effectively has been catered for with a complete new range of onboard or external analogue signal conditioning units and Orbit® compatible modules for Digital versions.The Stainless Steel body with improved sealing options of IP65 or IP67, coupled with new polymer guides with rigid carriers, ensure that the transducers keep working accurately and reliably, espe-cially in wet or corrosive conditions.An unusually large bore to core clearance is maintained throughout the range, even on transducers fitted with onboard signal conditioning, enabling easier installation and making the assembly more forgiving of misalignment.S IP 65S IP 67S RS ub m e r s i b l e S R I P 68A x i a l C o n n ec t o rL V D TD CO r b i t 4-20m A S c r e wM o u n tH i g hT e m p 'Measuring range 5 (total travel mm)1015203050100150200300MechanicalAxial connector Free Core Guided core Screw Mount High Temp,Display/ControllerSI 1000SI 3000SI 7000Remote DRC signal conditioning OD 2OD 4Note! High Temperature OD 5is for Transducers onlyBICM (15-0-15V)BICM (24V)Compatible TTL module Refer to Engineering OrbitNot Availablemeasuring range in mmLVDT +/- 2.5 +/- 5.0 +/- 7.5 +/- 10 +/- 15 +/- 25 +/- 50 +/- 75 +/- 100 +/- 150DC/DC & 4-20 mA 0-50-100-150-200-300-500-1000-1500-2000-300Digital 0-50-100-150-200-300-500-1000-1500-2000-300Linearity FSO0.20.25Electrical LVDT Sensitiv ity (mV/V/mm) ± 5%3V RMS at 5.0kHz into 100k ohm 145179121766021.51510.56.93.9Energising current (mA/V) ± 5%1.02.62.20.61.50.50.62.51.651.83Residual Voltage at null (%FSO)<0.5<0.5<0.5<0.5<0.5<0.5<0.5<0.5<0.5<0.5Electrical DC/DC & 4-20mA Input Voltage (DC)10-30V Output ripple (%FSO)0.02Bandwidth Hz (-3dB)500Environmental (transducer only)Storage temperature LVDT -40ºC to +120ºC Electrical Digital Storage temperature DC/DC & 4-20mA -20ºC to +85ºC Reading rate Up to 3906 readings per second Operating temperature LVDT -40ºC to +120ºC Bandwidth Up to 460 Hz Operating temperature DC/DC & 4-20mA 0ºC to +65ºC OutputSolartron Orbit ProtocolOperating temperature Digital* (probe only) -40ºC to +120ºC Sealing IP 67 or IP 65 Mechanical Options temperature coefficient (%FSO/ºC). Guided core <02 for +/-2.5mm. <.015 rest of range Spring return Shock Drop test 1m onto hard surface Connectors topple test x 10 onto hard surface Extra cable Vibration Sinusoidal Amplitude Univ ersal Joints see 10 to 50Hz 1-10 grms linear Output options ordering 50 to 1kHz 10 grmsguideMaterialBody 316 series Stainless Steel Core Nickel/Iron CableFEP0-10 V dc 10-0 V dc 4-20 mA 20-4 mA+/- 5 Vdc +/- 10 Vdc 0-5 V dc 5-0 V dcSince 1970Distributing Tomorrow’s Technologies For Today’s DesignsToll-Free: 1-800-777-7334/solartronGuided with Universal Joints‘A’ mm‘B1’ mm‘B2’ mm‘B3’ mmBody length Fully At null Retracted A/C Extended± 2.5 mm5553.2549.545.4± 5 mm74.564.255749.4± 7.5mm81.768.2559.951.2± 10 mm9679.2566.853.9± 15 mm110.497.2576.355± 25 mm131.9120.2589.157.5± 50 mm189.5178.2512469.4± 75 mm239.7249.25169.990.2± 100 mm297.2309.23201.1893.08± 150 mm412475309.5141.73 DC/DC & 4-20 mA5 mm9453.2549.545.4 10 mm113.564.255749.4 15 mm120.768.2559.951.2 20 mm13579.2566.853.9 30 mm149.497.2576.35550 mm170.9120.2589.157.5 100 mm228.5178.2512469.4 150mm278.7249.25169.990.2 200mm336.2309.23201.1893.08 300 mm450.9475309.5141.73 Guided with Universal JointsSince 1970Distributing Tomorrow’s Technologies For Today’s DesignsToll-Free: 1-800-777-7334/solartronFree core & Carrier‘A’ mm 'B' mm 'C' mm D' mmA/C body length core length at null± 2.5 mm33.516.540.547± 5 mm53294858± 7.5mm60.23450.962± 10 mm74.54057.7573± 15 mm88.937.567.391± 25 mm110.438.580.05114± 50 mm16850115172± 75 mm218.250160.9243± 100 mm275.750192.15303± 150 mm390.550300.72469DC/DC & 4-20 mA5 mm72.516.540.54710 mm9229485815 mm99.23450.96220 mm113.54057.757330 mm127.937.567.39150 mm149.438.580.05114100 mm20750115172150mm257.250160.9243200mm314.750192.15303300 mm429.550300.72469Free Core & Free Core with Carrieree Core & Free Core with CarrierSince 1970Distributing Tomorrow’s Technologies For Today’s Designs Toll-Free: 1-800-777-7334/solartronFree Core & Carrier Axial ConnectorAlso Available at Solartron MetrologyAddresses for offices worldwide United Kingdom - Head Office Solartron Metrology Steyning Way Bognor Regis West Sussex PO22 9STTel: +44 (0) 1243 833333 Fax: +44 (0) 1243 833322 ***********************************China - Shanghai Solartron Metrology Rm 912, Metro TowerNo 30 Tian Yao Qiao Road Shanghai 200030Zhong Renmin GongheguoTel: +86 21 6426 8111 Fax: +86 21 6426 7054***********************************JapanSolartron Metrology 4-5-37 Kamiosaki Shinagawa-ku GermanyAmetek GmbHSolartron Metrology Division Rudolf-Diesel-Strasse 16 40670 MeerbuschTel: +49 (0) 2159 9136 500 Fax: +49 (0) 2159 9136 505 ****************************China - Beijing Solartron Metrology Rm 912, Metro TowerNo 30 Tian Yao Qiao Road Shanghai 200030Tel: +86 21 6426 8111 Fax: +86 21 6426 7054***********************************USA915 N.New Hope Road Suite C,Gastonia, NC 28054FranceSolartron MetrologyRond-point de l’Espine des Champs Buroplus - Bat. D Elancourt 78990Tel: +33 (0)1 30 68 89 50Fax: +33 (0)1 30 68 89 59 ************************************China - ChengduAMETEK ChengDu Rep Office Room 2408, Zongfu Building 35 Zongfu RoadChengdu, Sichun, 610016Tel: +86 28 8675 8111 Fax: +86 28 8675 8141***********************************Introducing Your Partners:Taking the lead time out of Solartron Gage Probes.Visit:/solartronMichael HaasComponent Distributors Inc. Sales Engineer Phone: 303-357-2732Email: ***********************Steven RushingComponent Distributors Inc. Sales Engineer Phone: 303-357-2730Email: *************************Bob KrantzSolartron Metrology Email: *********************。

INIC3619_Datasheet_V1.00

(INIC3619_Datasheet_V1.00.odt)
Revision 1.00 August 14, 2013 Initio Corporation
Revision 1.00
Page 1 of 28
INIC-3619 Datasheet _______________________________________________________________________________
批注本地保存成功开通会员云端永久保存去开通
INIC-3619 Datasheet _______________________________________________________________________________

INIC-3619 USB 3.0 SATA Bridge Datasheet
Contents
1 Introduction.......................................................................................................................................................................4 1.1 Feature Summary.......................................................................................................................................................4 1.2 Firmware Support..........................

维泰克2客户信-clsi折点性能参数补充说明书

VITEK 2客户信编号: CSN 4757-2尊敬的生物梅里埃用户：2020年7月, 生物梅里埃发布了客户信CSN-4757通知VITEK®2用户梅里埃已经完成了气单胞菌和弧菌多个抗生素CLSI折点的验证工作。

如果您在2020年7月收到通知后已经更新了折点, 我们抱歉地通知您当时发布的客户信表2性能参数部分存在笔误。

此次客户信的表2已经进行了更新，为便于识别，更新部分用黄色高亮显示。

该客户信其它部分同此前版本保持一致。

该评估使终端用户可以在VITEK® 2软件中应用CLSI折点。

表1中的CLSI折点都已经成功验证，均满足可接受标准，可用于患者或其它菌株测试，某些情况下需要增加一些限制信息.为了应用这些折点，需要在AES中创建自定义参数。

请参考VITEK® 2软件用户手册（修改折点部分）中的详细信息。

这些折点会被整合进未来新版本VITEK® 2软件Global CLSI-based参数集。

表2提供了应用CLSI折点下这些抗菌药物的性能参数信息。

之前出版的VITEK® 2文档尚未公布这些性能参数信息。

假如您选择实施这些CLSI折点，请留存该客户信。

附录1：举例如何创建高级报告工具(BIOART)规则，用于管理该客户信5-8页中的局限。

做为我们持续改善项目的一部分，梅里埃致力于提升产品质量，功能和易用性。

感谢您选择使用VITEK® 2系统，如果您有任何问题，请随时联系您当地的生物梅里埃代表。

此致敬礼梅里埃诊断产品（上海）有限公司2022年5月10日bioMérieux (Shanghai) Company Limited/梅里埃诊断产品(上海)有限公司表1:使用更新后的CLSI折点，表格中抗菌药物性能满足要求bioMérieux (Shanghai) Company Limited/梅里埃诊断产品(上海)有限公司*以下抗生素/细菌组合的结果存在局限，需要屏蔽报告。

75176B中文资料

PACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)SN65176BD ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN65176BDE4ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN65176BDG4ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN65176BDR ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN65176BDRE4ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN65176BDRG4ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN65176BP ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeSN65176BPE4ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeSN75176BD ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN75176BDE4ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN75176BDG4ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN75176BDR ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN75176BDRE4ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN75176BDRG4ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN75176BP ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeSN75176BPE4ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeSN75176BPSR ACTIVE SO PS82000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN75176BPSRG4ACTIVE SO PS82000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS),Pb-Free(RoHS Exempt),or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free(RoHS Exempt):This component has a RoHS exemption for either1)lead-based flip-chip solder bumps used between the die andpackage,or2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free(RoHS compatible)as defined above.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.TAPE AND REEL INFORMATIONDevice Package Pins Site ReelDiameter(mm)ReelWidth(mm)A0(mm)B0(mm)K0(mm)P1(mm)W(mm)Pin1QuadrantSN65176BDR D8FMX33012 6.4 5.2 2.1812Q1 SN75176BDR D8FMX33012 6.4 5.2 2.1812Q1 SN75176BPSR PS8MLA330168.2 6.6 2.51216Q1TAPE AND REEL BOX INFORMATIONDevice Package Pins Site Length(mm)Width(mm)Height(mm)SN65176BDR D8FMX338.1340.520.64SN75176BDR D8FMX338.1340.520.64SN75176BPSR PS8MLA342.9336.628.58IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI)reserve the right to make corrections,modifications,enhancements,improvements,and other changes to its products and services at any time and to discontinue any product or service without notice.Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right,or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and isaccompanied by all associated warranties,conditions,limitations,and notices.Reproduction of this information with alteration is an unfair and deceptive business practice.TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications (such as life support)where a failure of the TI product would reasonably be expected to cause severe personal injury or death,unless officers of the parties have executed an agreementspecifically governing such use.Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications,and acknowledge and agree that they are solely responsible for all legal,regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications,notwithstanding any applications-related information or support that may be provided by TI.Further,Buyers must fully indemnify TI and itsrepresentatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic."Only products designated by TI as military-grade meet military specifications.Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk,and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949requirements.Buyers acknowledge and agree that,if they use any non-designated products in automotive applications,TI will not be responsible for any failure to meet such requirements.Following are URLs where you can obtain information on other Texas Instruments products and application solutions:ProductsApplications AmplifiersAudioDataConvertersAutomotiveDSPBroadband InterfaceDigital Control LogicMilitary Power MgmtOptical Networking MicrocontrollersSecurity RFIDTelephony Low PowerVideo &ImagingWireless Wireless Mailing Address:Texas Instruments,Post Office Box 655303,Dallas,Texas 75265Copyright ©2007,Texas Instruments Incorporated 元器件交易网。

卡林技术公司产品说明书

UL Recognized UL Standard 1077Component Recognition Program as Protectors,Supplementary (Guide QVNU2,File E75596)UL Standard 508Switches,Industrial Control (Guide NRNT2,File E148683)CSA CertifiedComponent Supplementary Protector under Class 3215 30,FIle 047848 0 000CSA Standard C22.2 No. 235VDE CertifiedEN60934,VDE 0642 under File No.10537Agency CertificationsNotes for T able A:1DC and 1Ø 277 Volt ratings are 1 or 2 poles breaking. 3Ø Ratings are 3 poles breaking.2 Requires branch circuit backup with a UL LISTED Type K5 or RK5 fuse rated 15A minimum and no more than 4 times full load amps not to exceed 150A for 250 Volt rating and 125A for 277and 480 Volt ratings.3 UL Recognition and CSA Certification at 480 Volts refers to 3 and 4 pole versions, used only in a 3Ø wye connected circuit or 2 pole versions connected with 2 poles breaking 1Ø and backedup with series fusing per note 2.Table A:Lists UL Recognized and CSA and VDE Certified configurations and performance capabilities as a Component Supplementary Protector.ElectricalCURRENT RA TINGCIRCUITMAX FULL LOAD WITH WITHOUT (Inc) WITH (Icn) WITHOUTCONFIGURA TIONRA TINGFREQUENCYPHASEAMPSBACKUP FUSEBACKUP FUSEBACKUP FUSEBACKUP FUSE65DC ---0.02 - 50 ---500050001500125/25050/60 1 and 30.02 - 50 ---3000 --- ---25050/60 1 and 30.02 - 505000 ---5000150027750/6010.02 - 505000 --- --- ---480 Y 50/60 1 and 30.02 - 305000---------65DC ---0.02 - 5025050/60 1 and 30.02 - 5027750/6010.02 - 50480 Y50/6030.02 - 30480 Y 50/6010.02 - 30SWITCH ONL Y UL / CSAVDED-SERIES TABLE A: COMPONENT SUPPLEMENTARY PROTECTORVOLT AGEINTERRUPTING CAPACITY (AMPS)SERIESDesigned for snap-on-back panel rail mounting on either a 35mm x 7.5mm, or a 35mm x 15mm Symmetrical Din Rail,allowing rapid and simple mounting and removal of the breaker.It features recessed, wire-ready, touch-proof, shock-resistant ter-minals, suitable for automatic screwdriver assembly, as well as "Dead Front" construction characteristics.Available with a Visi-Rocker two-color actuator, which can be specified to indicate either the ON or the TRIPPED/OFF mode,or solid color rocker or handle type actuators. All actuator types fit in the same industry standard panel cutouts.0.02 - 50 amps, up to 480 VAC or 65 VDC, 1 - 4 poles (Handle),1 - 3 poles (Rocker), with a choice of time delays.Number of PolesRocker Type: 1-3; Handle Type: 1-4 Internal Circuit Config. Switch Only and Series Trip with cur-rent or voltage trip coils.WeighApproximately 128 grams/pole (Approximately 4.57 ounces/pole)Standard Colors Housing - Black; Actuator - See Ordering Scheme.MountingMounts on a standard 35mmSymmetrical DIN Rail (35 x 7.5 or 35x 15mm per DIN EN5002).MechanicalElectricalPhysicalEndurance10,000 ON-OFF operations @ 6 per minute; with rated Current and Voltage.Trip FreeAll D-Series Circuit Breakers will trip on overload,even when actuator is forcibly held in the ON position.Trip IndicationThe operating actuator moves posi-tively to the OFF position when an overload causes the breaker to trip.Designed and tested in accordance with requirements of specifi-cation MIL-PRF-55629 & MIL-STD-202 as follows:Shock Withstands 100 Gs,6ms,sawtoothwhile carrying rated current per Method 213,Test Condition "I".Instantaneous and ultra-short curves tested @ 90% of rated current.Vibration Withstands 0.060" excursion from10-55 Hz,and 10 Gs 55-500 Hz,at rated current per Method 204C,Test Condition A. Instantaneous and ultra-short curves tested at 90% of rated current.Moisture Resistance Method 106D,i.e.,ten 24-hourcycles @ + 25°C to +65°C,80-98%RH.Salt Spray Method 101,Condition A (90-95%RH @ 5% NaCl Solution,96 hrs).Thermal Shock Method 107D,Condition A (Fivecycles @ -55°C to +25°C to +85°C to +25°C).Operating Temperature -40°C to +85°CEnvironmental020 0.0200250.0250300.0300500.050075 0.0750800.0800850.0852100.1002150.1502200.2002250.2502300.3002350.3502400.4002450.450250 0.5002550.5502600.6002650.6502700.7002750.7502800.8002850.850410 1.000512 1.250413 1.300414 1.400415 1.500517 1.750420 2.000522 2.250425 2.500527 2.750430 3.000532 3.250435 3.500436 3.600440 4.000445 4.500547 4.750450 5.000455 5.500460 6.000465 6.5004707.0005727.2504757.5004808.0004858.5004909.0004959.500610 10.00071010.50061111.00071111.50061212.00071212.50061313.00061414.000615 15.00061616.00061717.00061818.00061919.00062020.00062121.00062222.000623 23.00062424.00062525.00062626.00062727.00062828.00062929.00063030.00063232.00063535.00064040.00064545.00065050.000A06 6 DC, 5 DC A1212 DC, 10 DC A1818 DC, 15 DC A2424 DC, 20 DC A3232 DC, 25 DC A4848 DC, 40 DC A6565 DC, 55 DC J06 6 AC, 5 AC J1212 AC, 10 AC J1818 AC, 15 ACJ2424 AC, 20 AC J4848 AC, 40 AC K20120 AC, 65 AC L40240 AC, 130 AC10Agency Approval8Actuator Color8 ACTUATOR COLOR & LEGEND Actuator orVisi-Color Marking: Marking Color: Single Color Visi-Rocker Color:I-O ON-OFF Dual Rocker/Handle (Actuator Black)8White A B 1Black White Black C D 2White n/a Red F G 3White Red Green H J 4White Green Blue K L 5White Blue Y ellow M N 6Black Y ellow Gray P Q 7Black Gray OrangeRS8Black Orange10 AGENCY APPROVAL C UL Recognized & CSA Certified D VDE Certified, UL Recognized & CSA Certified9 MOUNTING/VOLTAGEMOUNTING STYLE VOLTAGE Threaded Insert 16-32 x 0.195 inches< 300C 96-32 X 0.195 inches ≥300 2ISO M3 x 5mm< 300D 9ISO M3 x 5mm ≥3007 TERMINAL1#10 Screw & Pressure Plate for Direct Wire Connection 2#10 Screw without Pressure Plate3 POLES 1One2Two 3Three4Four5 FREQUENCY & DELA Y 03DC 50/60Hz, Switch Only 105DC Instantaneous 11DC Ultra Short 12DC Short 14DC Medium 16DC Long20550/60Hz Instantaneous 2150/60Hz Ultra Short 2250/60Hz Short 2450/60Hz Medium2650/60Hz Long32DC, 50/60Hz Short 34DC, 50/60Hz Medium 36DC, 50/60Hz Long42650/60Hz Short, Hi-Inrush 44650/60Hz Medium, Hi-Inrush 46650/60Hz Long, Hi-Inrush 527DC, Short,Hi-Inrush 547DC,Medium, Hi-Inrush 567DC, Long, Hi-Inrush4 CIRCUITA0 Switch Only (No Coil) 4B0Series Trip (Current)C0Series Trip (Voltage)1 SERIES D6Current Rating4Circuit3Poles2Actuator9Mounting/Voltage7Terminal5Frequency & Delay1SeriesNotes:1 Handle breakers available up to four poles. Rocker breakers available up to three poles.2Actuator Code:A: Multi-pole units factory assembled with common handle tie.B: Handle location as viewed from front of breaker:2 pole - left pole3 pole - center pole4 pole - two handles at center poles3Multipole rocker breakers have one rocker per breaker, as viewed from the front of thepanel. Two pole - left pole. Three pole - center pole 4≤30A, select Current Rating code 630. 31-50A, select Current Rating code 650.5Voltage coil only available with delay codes 10 & 20.6Available to 50A max with circuit code BO only.7Available to 50A (UL/CSA), 30A (VDE) with circuit code BO only.8Color shown is visi and legend with remainder of rocker black.9≥300V: Three pole breaker 3Ø or 2 pole breaker 1Ø, UL/CSA limited to 30 FLA max.10VDE Approval requires Dual (I-O, ON-OFF) or I-O markings6 CURRENT RATING (AMPERES)OR VOLTAGE COIL (VOLTS, MIN. TRIP RATING)5P0LE 3P0LE 2P0LE 1SERIES TRIP (2 TERM'S.)LINELINEROCKER ACTUATOR INDICATE "ON"HANDLE ACTUATORSWITCH ONL Y (2 TERM'S.)#10-32 SCREW AND PRESSURE PLA TE PER TERMINAL"MULTI-POLE IDENTIFICATION SCHEMENotes:1All dimensions are in inches [millimeters].2T olerance ±.015 [.38] unless otherwise specified.3-POLE(DF3) 3-POLE(DC3)REMOVALASSEMBL YNotes:1All dimensions are in inches [millimeters].2T olerance ±.015 [.38] unless otherwise specified.3Dimensions apply to all variations shown. Notice that circuit breaker line and load termi-nal orientation on indicate OFF is opposite of indicate ON.4For pole orientation with horizontal legend, rotate front view clockwise 90°.Notes:1All dimensions are in inches [millimeters].2T olerance ±.010 [.25] unless otherwise specified.。

Datasheet_RTL8671B_v04_preliminary

RTL8671B/ RTL8671BH Integrated ADSL2+ Router ControllerDatasheetRev. 0.46 May, 2008Track ID: xxxx-nnnn-nn©2003 Realtek Semiconductor Corp. All rights reserved. No part of this document may be reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language in any form or by any means without the written permission of Realtek Semiconductor Corp.DISCLAIMERRealtek provides this document “as is”, without warranty of any kind, neither expressed nor implied, including, but not limited to, the particular purpose. Realtek may make improvements and/or changes in this document or in the product described in this document at any time. This document could include technical inaccuracies or typographical errors.TRADEMARKSRealtek is a trademark of Realtek Semiconductor Corporation. Other names mentioned in this document are trademarks/registered trademarks of their respective owners. CONFIDENTIALITYThis document is confidential and should not be provided to a third-party without the permission of Realtek Semiconductor Corporation.USING THIS DOCUMENTThis document is intended for the software engineer’s reference and provides detailed programming information.Though every effort has been made to ensure that this document is current and accurate, more information may have become available subsequent to the production of this guide. In that event, please contact your Realtek representative for additional information that may help in the development process.REVISION HISTORYRevision Release Date Summary0.0 2008/01/18 First release.0.1 2008/01/23 n Correcting pin 113 as ‘OVDD’n Block diagram added0.2 2008/01/30 n Correcting pin 12 as ‘VSS’0.3 2008/01/31 n Correcting polarity of ‘U1ID’0.4 2008/05/06 n‘U1ID’ should be input only, not I/On RTL8671BH addedTable of Contents1.GENERAL DESCRIPTION (1)2.FEATURES (2)3.SYSTEM APPLICATIONS (2)4.BLOCK DIAGRAM (3)5.PIN ASSIGNMENTS (4)6.PIN DESCRIPTIONS (5)7.SYSTEM OVERVIEW (10)8.ELECTRICAL REQUIREMENTS (11)8.1.DC C HARACTERISTICS (11)8.1.1.Absolute Maximum Rating (11)8.1.2.Recommended Operation Conditions (11)8.1.3.Power Consumption (11)8.1.4.Reference Crystal (12)8.1.5.ADSL Interface Clock Input (12)8.2.AC C HARACTERISTICS (12)8.2.1.FLASH – Parallel (12)8.2.2.FLASH – Serial (13)8.2.3.SDRAM (13)8.2.3.1SDRAM Input Timing (13)8.2.3.2SDRAM Output Timing (14)8.2.3.3SDRAM Access Control Timing (15)8.2.4.AFE (16)8.2.4.1Master clock (16)8.2.4.2Transmission Interface (16)8.2.4.3Reception Interface (16)8.2.5.JTAG (16)8.2.6.Reset (18)8.2.7.V REF Timing (18)8.2.8.Power-on sequence (19)9.MECHANICAL DIMENSIONS (20)10.ORDERING INFORMATION (22)List of TablesT ABLE 1P IN D ESCRIPTIONS OF RTL8671B/RTL8671BH(128-PIN LQFP) (5)T ABLE 2A BSOLUTE M AXIMUM R ATING (11)T ABLE 3R ECOMMENDED O PERATION C ONDITIONS (11)T ABLE 4P OWER C ONSUMPTION (11)T ABLE 5R EFERENCE C RYSTAL (12)T ABLE 6ADSL I NTERFACE C LOCK I NPUT (12)T ABLE 7P ARALLEL FLASH T IMING (12)T ABLE 8SDRAM I NPUT T IMING (13)T ABLE 9SDRAM O UTPUT T IMING (14)T ABLE 10SDRAM A CCESS C ONTROL T IMING (15)T ABLE 11AFE M ASTER C LOCK (16)T ABLE 12AFE TX I NTERFACE (16)T ABLE 13AFE RX I NTERFACE (16)T ABLE 14JTAG I NTERFACE T IMING (16)T ABLE 15R ESET T IMING (18)T ABLE 16V REF T IMING (18)T ABLE 17D IMENSION OF LQFP-128 (21)List of FiguresF IGURE 1A PPLICATION D IAGRAM I (2)F IGURE 2A PPLICATION D IAGRAM II (2)F IGURE 3B LOCK D IAGRAM (3)F IGURE 4P IN-OUT D IAGRAM (4)F IGURE 5F LASH A CCESS T IMING (13)F IGURE 6SDRAM I NPUT T IMING (14)F IGURE 7SDRAM O UTPUT T IMING (14)F IGURE 8SDRAM A CCESS C ONTROL T IMING (15)F IGURE 9B OUNDARY-S CAN G ENERAL T IMING (17)F IGURE 10B OUNDARY-S CAN R ESET T IMING (17)F IGURE 11R ESET T IMING (18)F IGURE 12D RAWING OF LQFP-128 (20)1. General DescriptionThe Realtek RTL8671B/ RTL8671BH are integrated SoC featuring a RISC, an ADSL2+ Discrete Multi-tone (DMT) data-pump, a hardware-based ATM Segmentation and Reassembly (SAR), two 10/100Mbps IEEE 802.3 compliant MACs with an embedded Ethernet transceiver, and a USB PHY port. Mated with the Realtek RTL8271B (ADSL2+ Analog Front End), RTL8671B/ RTL8671BH provide a low cost integrated solution for ADSL2+ CPE modems, routers, or gateways.RTL8671B/ RTL8671BH encompass high-performance DSP technologies, optimized mix-signal designs, and an efficient architecture to provide a seamless WAN to LAN router controller. The embedded RISC network processor supports the MIPS I instruction set along with DSP extensions and achieves a 340MHz clock rate in a six-stage pipeline to support layer 2, 3, and other upper layer applications.The DMT engine supports the upstream data rate from 32kbp to above 3Mbps and the downstream data rate from 32kbps to above 24Mbps throughput, and complies with:n ANSI T1.413 Issue 2n ITU-T G.992.1 (G..dmt) Annexes A and Bn G.992.2 (G..lite) Annexes A and Bn G.992.3 ADSL2 (G.dmt.bis) Annexes A, B, I, J, L, and Mn G.992.4 ADSL2 (G.lite.bis)n G.992.5 ADSL2+The Ethernet interface offers high-speed transmission over CAT-5 UTP cable or CAT-3 UTP (10Mbps only) cable. Ethernet functions such as Crossover Detection & Auto-Correction and polarity correction are implemented to provide robust transmission and reception capability at high speeds.2. Featuresn Two-chip ADSL2+ CPE solution:RTL8671B/ RTL8671BH (ADSL2+/Network Processor SoC) + RTL8271B (ADSL2+Analog Front End).n Field proven DMT data-pump complies with ANSI T1.413 Issue 2, ITU-T G992.1,G.992.2 , G.992.3, G.992.4, G.992.5supporting Annexes A, B, I, J, L, and M.Supports S=1/3 coding.n High performance embedded RISC with MMU, TLB and DSP instruction extension. n Embedded hardware-based ATM SAR: up to 8 distinct VCs—ATM AAL5 adaptation, F4/F5 OAM cell, HEC, CRC, IP/TCP/UDP checksum offloading, and error packetfiltering— and QoS supported for CBR,UBR, rt-VBR, and nrt-VBR.n Embedded 10/100 Base-TX Ethernet MAC and transceiver supporting CrossoverDetection & Auto-Correction and polaritycorrection, IP/TCP/UDP checksum offload supported as well. n One on-chip USB PHY port supporting the host/device moden Support serial SPI interface for device controln Network device management via HTTP, SNMP, and CLI (UART).n IP layer processing, DHCP, NAT, and typical higher layer applications supported n16-bit-wide, 166MHz SDRAM support up to 256Mbn8/16-bit-wide parallel/SPI Flash support up to 128Mbn 3.3V signaling, 1.2V core voltage; a embedded linear regulator controller toreduce an external LDOn Two 32-bit timers and a watchdog timern Embedded “Dying-Gasp” detection circuit n EJTAG interfacen Package of 128-pin LQFP available3. System ApplicationsFigure 2 Application Diagram II4. Block Diagram5. Pin AssignmentsFigure 4 Pin-out DiagramV M MD13V C T D D 3V D D 1T X O T X O V S R X I R X I V D D 1V D D 1C K I V S V D D 1V D D 3R S R V D (N C R S R V D (N C V S V S U 1D U 1D U 1I U 1V B U V D D 3D G N G P A 5/S V C S I V D A F T X D A F T X D A F T X D A F T X D A F R X D A F R X D D 14M D 15W E #O V D D R A S #C A S #M C S 3#D G N D M C S 2#I V D D M A 0M A 1M A 2M A 3O V D D M A 4M A 5M A 6M A 7I V D D M A 8M A 9M A 10M A 11M A 12O V D D M A 13M A 14M A 15M A 16M A 17M A 18MD12IVDD MD11MD10OVDD MD9MD8MD7MD6SDCLK MD5IVDD MD4DGND MD3OVDD ENUSBOTGMD2MD1MD0CK25MOUTCKSEL VDD12XI XO VSS NC VDD33IBREF VSS VREFGPB7/JTDO GPB6/JTMS GPB5/JTDI GPB4/JTRST#GPB3/JTCKGPB2/URTS#/SVDO GPB1/UTXD/SVDI GPB0/URXD/SVCS#IVDDGPA7/UCTS#/SVCK6. Pin DescriptionsTable 1 Pin Descriptions of RTL8671B/ RTL8671BH (128-pin LQFP) Symbol 128 Pin# Type Description100/10 Physical LayerRXIP RXIN 78I Ethernet physical layer differentialRX pinsTXOP TXON 45O Ethernet physical layer differentialTX pinsIBREF 126 I Pull-down externally with 2.5k Ohmfor PHY referenceEthernet PHY LEDNICLED[3:0] 55, 57, 59, 61 O LED driving signals for theembedded Ethernet PHY;Pins MA[22:21] sharing withNICLED[1:0]Clock & ResetXI 121 I 25MHz crystal clock input.XO 122 O 25MHz crystal clock output. CKSEL 119 I Reference clock selection; tied to1.2 to select XO (25MHz), VSS toselect CKIN (35.328MHz) PWRRST# 41 I System reset.SPI Control InterfaceSVCS# 45 O SPI chip select pin (shared withGPB0 and URXD)SVDI 46 I SPI data in (shared with GPB1 andUTXD)SVDO 47 O SPI data out (shared with GPB2and URTS#)SVCK 48 O SPI reference clock (shared withGPA7 and UCTS#)USB InterfaceU1DP, U1DM 20, 19 I/O Differential data I/O of USB PHY 1To RTL8671BH: either host/devicemode supported; configured byU1IDTo RTL8671B: device modesupported onlyU1ID (NC) 21 I To RTL8671BH: Pull-low/high toselect PHY 1 as host/deviceTo RTL8671B: NCU1VBUS 22 I USB VBUS detect pin; used forPHY 1 configured in device mode USBLED1 54 O USB LED driver output ENUSBOTG 114 O Enable USB OTG blockAFE InterfaceAFPWDN 40 O Power down control to AFE AFRXD[3:0] 34, 33, 32, 31 I Data input from AFEAFTXD[3:0] 30, 29, 28, 27 O Data output to AFEPins AFTXD[3:2] strap into registervalues as OCCLK_SEL[1:0], whichdefines the CPU speed. ForRTL8671B/ RTL8671BH, theAFTXD[3:2] should be strictlypulled as ‘10’.[1]AFCLWD 35 I Word clock input from AFECKIN 11 I Master clock from AFEAFCTRL 37 O Control data output to AFEVREF 128 I Dying Gasp voltage detect inputMemory BusMD[15:0] 95, 96, 97, 98, 100, 101, 103, 104,105, 106, 108, 110, 112, 115, 116, 117 I/O Data for SDRAM, parallel Flash, and ROMMA[22:0] 59, 61, 62, 64, 65, 66, 67, 68, 69, 70,72, 73, 74, 75, 76, 78, 79, 80, 81, 83,84, 85, 86 O Address for SDRAM and Flash.Pins MA[10:8] strap into registervalues as OCCLK_SEL[4:2], whichdefines the CPU speed. ForRTL8671B/ RTL8671BH, theMA[10:8] should be strictly pulledas ‘001’.[1]SDCLK 107 O SDRAM clockMCS2# 88 O Bank 0 chip select SDRAM chipselect.MCS3# 90 O Bank 1 chip select SDRAM chipselectOE#/RAS# 92 O Raw address strobe for SDRAMinterface; output enable for FLASHinterfaceCAS# 91 O Column address strobeWE# 94 O Write enable for SDRAM/ FLASHinterfaceDQM[3:0] 66, 65, 68, 67 O DQM[3:0] for SDRAM; shared withAA17, AA18, AA15, AA16MCS0# 63 O ROM Bank 0 chip select for FLASHmemorySFCS# 63 O Chip select of SPI FLASH interfaceif enabled (AFPWDN pull-up onpower-on reset)SFDI 35 I Serial data in of SPI FLASHinterface if enabled; shared withAFCLWDSFDO 62 O Serial data out of SPI FLASHinterface if enabled; shared withMA20SFCK 64 O Reference clock of SPI FLASHinterface if enabled; shared withMA19GPIOGPIOA[7:5] 43, 42, 25 I/O GPIO port AGPIOB[7:0] 52, 51, 50, 49, 48, 47, 46, 45 I/O GPIO port BUARTUCTS# 43 I Clear to send; shared with GPA7and SV_CKURXD 45 I RX data; shared with GPB0 andSV_CS#UTXD 46 O TX data; shared with GPB1 andSV_DIURTS# 47 O Request to send; shared withGPB2 and SV_DOJTAG (shared with GPIOB7-3)JTCK 48 I JTAG test clock; shared with GPB3 JTMS 51 I JTAG test mode select; shared withGPB6JTDO 52 O JTAG test data output; shared withGPB7JTDI 50 I JTAG test data in; shared withGPB5JTRST# 49 I JTAG test reset; shared with GPB4POWER & GNDVDD12 3, 9, 10, 13, 120 P Analog 1.2V supplyVDD33 2, 14, 23, 125 P Analog 3.3V supplyVSS 6, 12, 17, 18, 123, 127 P Analog groundDGND 24, 58, 89, 111 P Digital groundOVDD 39, 60, 71, 82, 93, 102, 113 P 3.3V digital I/O supplyIVDD 26, 36, 44, 56, 77, 87, 99, 109 P 1.2V digital kernel supplyMiscCK25MOUT 118 O Clock output of 25MHz for possibleperipheral useVCTRL 1 O Output of the embedded regulatorcontroller to generate 1.2V VDD forthe kernel supply of the chip.Connecting to an external PNP-BJTbase if used (BJT collector outputto IVDD); leaving no connection ifnot used.DTEST 124 - No used; leaving no connection TESTMODE 38 I Test only; leaving no connectionPulled-down internally for normaloperationRSRVD(NC) 15, 16, 53 - No used; leaving no connection Notes1. MA[10:9] and AFTXD[3:2] strap into the register at the power-on reset to configure the CPU speed. The value ‘00110’ configures theCPU running at 340MHz. This is a strict setting for RTL8671B/ RTL8671BH. That is, AFTXD3 and MA8 should be pulled up via a 4.7k Ohm resistor, and AFTXD2 and MA[10:9] should be pulled low via a 4.7k Ohm resistor.7. System Overview TBD8. Electrical Requirements8.1. DC Characteristics8.1.1. Absolute Maximum RatingTable 2 Absolute Maximum RatingParameters Symbol Min Max Unit I/O supply voltage V DDIO TBD TBD V Core supply voltage V DDC TBD TBD V Storage temperature T STG TBDESD protection VESD TBD V8.1.2.Recommended Operation ConditionsTable 3 Recommended Operation ConditionsParameters Symbol Condition Min Typ Max Unit OperatingtemperatureT A Ambient TBD TBD TBD °CDigital supply for I/OringV DDR TBD 3.3 TBD VCore power supplyvoltageV DDC TBD 1.2 TBD V Input high voltage V IH TBD V Input low voltage V IL TBD V Input current V IN TBD TBD µA8.1.3. Power ConsumptionTable 4 Power ConsumptionParametes Symbol Condition Estimated Power UnitDigital supply for I/O ring (3.3V)*V DDR ADSL (ADSL2+interleaved mode),and Ethernet areactiveTBD mACore power supply voltage (1.2V) V DDC ADSL (ADSL2+interleaved mode),and Ethernet activeTBD mAPhy power supply voltage (1.2V) V DDPhy ADSL (ADSL2+interleaved mode),and Ethernet areactiveTBD mA8.1.4. Reference CrystalTable 5 Reference CrystalParameters Symbol Min Typ Max Unit Center frequency f cf25 MHz Shunt capacitance C o pF Load capacitance C L pF Crystal equivalent serial resistor C ESRΩAging ppm/yr Frequency tolerance +/-50 ppm8.1.5. ADSL Interface Clock InputTable 6 ADSL Interface Clock InputParameters Symbol Min Typ Max Unit Clock frequency f clock35.328 MHz Pulse duration high t w(HI)14.15 ns8.2. AC Characteristics8.2.1. FLASH – ParallelTable 7 Parallel FLASH TimingSymbol Parameter Min. Typ. Max. Units NotesT CS The timing interval betweenF_CS0#(or F_CS1#) and WE# Controlled by Reg.0xB9000004(MTCR0)nsT WP The timing interval for WE# topulled low (RAS# for readoperation). Controlled by Reg. 0xB9000004(MTCR0)nsFigure 5 Flash Access Timing8.2.2. FLASH – SerialTBD8.2.3. SDRAM8.2.3.1 SDRAM Input TimingTable 8 SDRAM Input TimingSymbol Parameter Min. Typ. Max. Units Notes T SETUP Input setup prior to rising edgeof clock. Inputs included in thistiming are D[31: 0] (during aread operation)TBD nsT HOLD Input hold-time after the risingedge of clock. Inputs include inthis timing are D[31: 0] (duringa read operation)TBD TBD nsFigure 6 SDRAM Input Timing8.2.3.2 SDRAM Output TimingTable 9 SDRAM Output TimingFigure 7 SDRAM Output Timing8.2.3.3SDRAM Access Control TimingTable 10 SDRAM Access Control TimingSymbolParameter Min.Typ.Max.Units Notes T REFRESH Auto-refresh timing µs T RCDThe time interval between RAS# active and CAS# activeTBD nsT RP The time interval between pre-charge and the next activeTBD nsT RAS The time interval between active and pre-chargeTBD nsT RC The time interval between active and the next activeTBD nsT RFC The time interval between auto-refresh and activeTBD nsT CAS_LATENCY The data output delay after The CAS# activeTBD nsFigure 8 SDRAM Access Control Timing8.2.4. AFE8.2.4.1 Master clockTable 11 AFE Master ClockSymbol Parameter Min. Typ. Max. Units NotesF Clock frequency 35.328 MHzT h Clock duty cycle 50 %8.2.4.2 Transmission InterfaceTable 12 AFE TX InterfaceSymbol Parameter Min. Typ. Max. Units Notes Tva r Setup time before falling edge of clock. 12 18 ns AFElatch dataat fallingedge ofclock8.2.4.3 Reception InterfaceTable 13 AFE RX InterfaceSymbol Parameter Min. Typ. Max. Units Notes3 nsT s Data setup-time prior to falling edge ofclockT h Data hold-time after falling edge of clock 3 ns8.2.5. JTAGTable 14 JTAG Interface TimingSymbol Parameter Min. Typ. Max. Units Notes T BSCL JTAG clock low time nsT BSCH JTAG clock high time nsT BSIS TDI, TMS setup time to rising edge ofnsTCKT BSIH TDI, TMS hold time from rising edge ofns TCKT BSOH TDO hold time after falling edge of TCK ns T BSOD TDO output from falling edge of TCK ns T BSR JTAG reset period nsns T BSRS TMS setup time to rising edge of JTAGresetns T BSRH TMS hold time from rising edge of JTAGresetTCKTMS, TDITDOFigure 9 Boundary-Scan General TimingFigure 10 Boundary-Scan Reset Timing8.2.6. ResetTable 15 Reset TimingTPOWERON_RESET TPUSH_RESET8.2.7. V REF TimingTable 16 V REF TimingSymbol Parameter Min. Typ. Max. Units Notes T delay Delay time from dying gaspTBD us 1 detect to ADSL dying gaspindication bit clearms T RP Required residual power sustaintimeNote1: 250*8*[(B+1)*M+R]*Tp*SEQ*D/(Lp*M)8.2.8. Power-on sequence TBD9. Mechanical DimensionsFigure 12 Drawing of LQFP-128Table 17 Dimension of LQFP-12810. Ordering Information TBD。

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桑德森标准产品数据表（数据表16810-A）2020年1月版说明书

Technical DataTechnical DaTa 25-16810-A January 2020 SpecificationSupply Voltage 15 to 30 VdcCable size / Type 0.5mm 2 ~ 2.5mm 2 /FIRETUF, FP200 or MICC Mounting Hole Centres 50 ~ 80mm Allowable Alarm Current25mA Allowable Remote Indicator Current25mAWiring hintsEach terminal is suitable for clamping up to 2 wires. Clamping of 2 wires of very different diameters under one screw is not recommended.DO NOT USE A POWER TERMINAL DRIVER.Suitable for mounting to mounting boxes with 50-80mm fixing centres.EFXN533 DoP044818EN54-7 Point Type Smoke Detectors EFXN525DoP044618EN54-5 Point Type Heat Detectors EFXN524DoP044518EN54-5 Point Type Heat Detectors EFXN526DoP044718EN54-5 Point Type Heat Detectors EFXN632DoP044918EN54-5 Point Type Heat Detectors EN54-7 Point Type Smoke DetectorsFXN922DoP0405122831Detector InstalledDetector RemovedE n d o f L i n e M o n i t o rE n d o f L i n e R e s i s t o rGeneralIf difficulty is experienced when mounting the detector, this may be due to the following:Wiring causing an obstruction - move or shorten wires. Although the base is tolerant to uneven mounting surfaces, a very uneven surface may cause the base to deform when the mounting screws are tightened down - loosen screws to reduce this or slide base to a more flat position.WaRninG: DO NOT USE HIGH VOLTAGE TESTERS WHEN DETECTORS OR CONTROL PANEL ARE CONNECTED TO THE SYSTEM.Zener Diode Switch action eFDB800 (cDB300 & MDB800)eatonEMEA Headquarters Route de la Longeraie 71110 Morges, Switzerland Eaton.euTEL: +44 (0) 1302 321541FAX: +44 (0) 1302 303220******************************************************© 2020 EatonAll Rights ReservedEaton is a registered trademark.All trademarks are property of their respective Eaton Electrical Systems Ltd.Wheatley Hall Road Doncaster DN2 4NBTEL: +44 (0) 1302 303303 FAX: +44 (0) 1302 367155Utilising locking T a bThe Mounting base includes an optional feature to prevent the removal of the detector without the use of a tool.1. Remove the standard fit retaining clip.2. Insert the locking clip which is located at the centre of the base as shown.Mount the detector onto the base as described in Detector Installation (see over) and rotate fully clockwise until it finally clicks.The detector is now locked into position. Remove by utilising a suitable tool (eg a thin screwdriver) into the hole in the detector cover. Gently push the tool into the detector and rotate anti-clockwise.BaseOrder Codes Conventional Photoelectric Smoke Detector - Cooper EFXN520(CDBB300 / FXN520)EFDB800(CDB300 / MDB800) EFXN533 Conventional Heat Detector - Class A2R - Cooper EFXN525Conventional Heat Detector - Class BS - Cooper EFXN524Conventional Heat Detector - Class CS - CooperEFXN526Conventional Photo/Thermal - Class A2S (Heat Performance) - Cooper EFXN632Bi-Wire Programmable Conventional Photoelectric, Photo/Thermal (A2S), Heat Detector (A1R, BS or CS) - JSBEFXN520(CDBB300 / FXN520)FXN922Detector Features (Photoelectric & Photo/Thermal)All Photoelectric and Photo/Thermal detectors, automatically compensate for gradual increases in the scatter signal due to contamination e.g. dust build up.Self-check Features Of The Bi-wire DetectorThe Self-Check feature monitors for the failure of the internal primary alarm circuitry.Under this condition, the detector will still register an alarm condition via the yellow LED. Following such a failure, the yellow LED will remain on following a reset, signaling a fault at the main panel and the detector must be replaced.BiWire detectors, automatically compensate for gradual increases in the scatter signal due to contamination e.g. dust build up. If excessive dust occurs, the yellow LED will show continuously. If this occurs, the maintenance procedure should be conducted.The yellow LED will also light continuously if the detectors optical sensor signal begins to reduce below its normal level (chamber monitoring).In addition, the BiWire range has an isolator that opens if the internal power fails in the detector, giving rise to a zone fault at the main panel.When used with a BiWire compatible panel with Self Check features, the BiWireDetectors range of detectors can be instructed to blink their yellow LED every 2 seconds by a command from the main panel, to aid the search for a break in the zone cabling or an open detector isolator.Detector installationFit detector to mounting base and rotate clockwise until the detector drops into place. Continue to rotate clockwise until the detector clicks into place and no further rotation is possible. If the detectors are required to be locked into position, refer to the ‘UtilisingLocking Tab’ section.Smoke detectors are supplied fitted with dust covers for general protection against airborne contaminates.These must be removed from all detectors before the fire system is commissioned.NB. These dust covers do not provide adequate protection against quantities of dust generated by building workT estingAll detectors must be tested following installation or routine service andmaintenance. It is recommended that these tests are carried out by a competent person. Authorised personnel must be informed that the fire system will betemporarily out of service before commencing testing. To prevent unwanted alarms, ensure that the the panel is in test mode and it may be appropriate to disable some or all of the sounder circuits.. When all tests are complete, restore panel to normal operation and notify authorised personnel that the system is operational.Smoke Detectors:Subject the detector to be tested to a controlled amount of an approved synthetic smoke aerosol via a smoke detector test pole. Suitable products are available for example, from No Climb Products Ltd.Check that the red LED on the detector latches into alarm within 30 seconds. If an optional remote LED is fitted, check that this also lights.Ensure that the control panel activates into alarm.Reset the detector from the control panel unless automatically reset by the panel in test mode.This procedure will test the smoke sensing circuitry of the Photo/Thermal Detector.heat Detectors:Using a heat gun or hair dryer capable of generating temperatures of up to 95°C,direct the heat source towards the heat sensing elements, visible through the side of the outer cover, from a distance of 15 to 30cm. Care should be taken not to allow the plastic surface temperature to exceed 110°C otherwise damage may occur.When the temperature reaches the ‘Alarm Temperature’ (see Specifications above), check that the red LED on the detector latches into alarm. If an optional remote LED is fitted, check that this also lights.Ensure that the control panel activates into alarm.Reset the detector from the control panel unless automatically reset by the panel in test mode.This procedure will test the heat sensing circuitry of the Photo/Thermal Detector.MaintenanceOnly minimal maintenance can be performed on this range of detectors as they do not contain any site serviceable parts. The frequency of maintenance and will depend on the environment towhich the detector is exposed but should be at least annually. Dusty or damp environments will demand more frequent maintenance.Remove the detector from its mounting base.Use a vacuum cleaner to remove dust build up from around the smoke entryapertures of a smoke detector, or from around the heat sensing element of a heat detector.For smoke detectors, visually inspect the insect mesh for blockages. If these can not be cleared by vacuuming, the detector must be replaced.Re-fit detector to its mounting base and test as described above.Detectors that fail the testing procedure must be replaced.EFXN533EFXN525EFXN524EFXN526EFXN632FXN922Operating voltage 15 to 30 Vdc 15 to 30 Vdc 15 to 30 Vdc 15 to 30 Vdc 15 to 30 Vdc 15 to 30 Vdc Standby current (max) 30μA 30μA 30μA 30μA 30μA 80μA Start up current (max 20 sec)340μA N/A N/A N/A 340μA 340μA Alarm current (max)25mA 25mA 25mA 25mA 25mA 25mAAmbient temperature (max)60ºC45ºC60ºC75ºC45ºCOpto Mode 60ºCOpto-Heat Mode 45°CA1R Rate of Rise Mode 45°C BS Fixed Temp Mode 60°C CS Fixed Temp Mode 80°C Ambient temperature (min)-20ºC -20ºC -20ºC -20ºC -20ºC -10ºCAlarm temperature (static)N/A60ºC77ºC90ºC60ºCOpto-Heat Mode 60°CA1R Rate of Rise Mode 60°C BS Fixed Temp Mode 77°C CS Fixed Temp Mode 92°C Heat detector class –as defined by EN54-5:2000N/A A2R BS CS A2S See above Relative humidity (non-condensing)0 to 95%0 to 95%0 to 95%0 to 95%0 to 95%0 to 95%Height (without base)34mm 43mm 43mm 43mm 43mm 43mm Height (with base)47mm 56mm 56mm 56mm 56mm 56mm Diameter 100.5mm 100.5mm 100.5mm 100.5mm 100.5mm 100.5mm Weight 78g 76g 76g 76g 78g 78g Material PC/ABS PC/ABS PC/ABS PC/ABS PC/ABS PC/ABS ColourWhite White White White White White Bi-Wire compatible No No No No No Yes Self check featuresNoNoNoNoNoYes。

ITEQ Corporation IT-180A BS 安全数据表说明书

ITEQ CorporationSAFETY DATA SHEET1.CHEMICAL PRODUCT AND COMPANY IDENTIFICATIONPRODUCT NAME: IT-180A BSOTHER / GENERIC NAME: Epoxy / glass composite, PREPREG , copper clad laminate,Printed circuit boards, base material.CHEMICAL FAMILY : Epoxy resin, glass fabric.MANUFACTURER:Area Address Contact Window Tel Fax E-mailEast ChinaChun Hui Rd.,Xishan Economic DevelopmentZone,Wuxi City,Jiangsu Province,ChinaJimmy Peng 86-510-2235888 86-510-8223-5889 *********************Japan AreaNo.2, Huafang Rd, Yonghe Economic Zone,Economic and Technological Development Zone,Guangzhou, Guangdong Province, ChinaStephen Wang 86-020-6286-8088 86-020-6286-8066 ****************.cnSouth China168,dongfang Road,Nanfang IndustrialPark,Beice VillageHumen Town,DongguanCity,Guangdong Province,ChinaJack Chow 86--769-5700426 86-769-8623268 ******************.cnOverseasNo.17, Daluge Rd., Xinpu Township, HsinchuCounty305, Taiwan,R.O.C.Allen Shen 886-3-588-7888 886-3-5892558 *******************.tw TaiwanNo.17, Daluge Rd., Xinpu Township, HsinchuCounty305, Taiwan,R.O.C.Allen Shen 886-3-588-7888 886-3-5892558 *******************.tw CONTACT INFORMATION : For more information: Emergency / CHEMTREC+886-3-588-7888 +886-3-589-25582.HAZARDS IDENTIFICATIONEMERGENCY OVERVIEW: Non-flammable sheet materialDust caused by machining may irritate eyes, nose, or throat.POTENTIAL HEALTH HAZARDS:SKIN: Dust may cause minor irritation.EYES: Dust may cause minor irritation. Fumes may cause irritationINHALATION: Dust may cause respiratory irritationINGESTION: None known, none anticipated with normal handing.ITEQ CorporationSAFETY DATA SHEETClassifiable or probably non-carcinogenic (Group 3 ).Ingredients found on any of OSHA’s carcinogen lists are listed below.INGREDIENT NAME: NTP STATUS: IARC STATUS: OSHA LISTNone N/A N/A N/APOSITION / INFORMATION ON INGREDIENTSINGREDIENT NAME: CAS# % w/wGlass cloth 65997-17-3 40~70%B-Stage semi-cured epoxy of Multi-function resin 026265-08-7 40~70%Fillers type SiO2 powder 14808-60-7 10~20%We don’t have PFOSFor local ”Right to Know” compliance and other reasons, trace ingredients not listed above may appear in Section 15, Regulatory Information.4.FIRST AID MEASURESSKIN: Wash promptly with soap and running water. Do not rub or scratch.If irritation persists, consult physician.Remove contaminated clothing and wash thoroughly before reuseEYES: Flush immediately with plenty of low-pressure water for at least 20Minutes.Do not rub or scratch.If irritation persists, consult physician.INHALATION: Move to fresh air.Consult physician.INGESTION: If large amounts are ingested, consult physician.ADVICE TO PHYSICIAN:Treat symptomatically5.FIRE-FIGHTING MEASURESFLASH POINT: N/AFLASH POINT METHOD: N /AAUTOIGNITION TEMP: Not determined.UPPER FLAME LIMIT: N/ALOWER FLAME LIMIT: N/AFLAME PROPAGATION RATE: UL 94 V-0ITEQ CorporationSAFETY DATA SHEETEXTINGUISHING MEDIA: Water, CO2, foam, dry chemical, Halon.UNUSUAL FIRE ANDEXPLOSION HAZARDS:May give off toxic hydrogen bromide fumes when thermallyDecomposed.SPECIAL FIRE-FIGHTINGPROCEDURES:Wear proper protective equipment and self-contained breathingApparatus.6.ACCIDENTAL RELEASE MEASURESRESPONSE TO RELEASE: If material is not contaminated, return to container for use.If material is contaminated, pick up and place in container for disposal.Material is an article. Spill or release to the environment is unlikely. 7.HANDLING AND STORAGENORMAL HANDLING: Always wear recommended personal protective equipment. STORAGE: Store in a cool dry place.8.ENGINEERING CONTROLS / PERSONAL PROTECTIONENGINEERING CONTROLS:VENTILATION: Adequate ventilation should be provided to keep dust concentrationswithin acceptable exposure limits. Discharge from the ventilationsystem should comply with applicable air pollution control regulation GENERAL: Eyewash fountains and safety showers should be easily accessible. PERSONAL PROTECTIVE EQUIPMENT:SKIN PROTECTION: Impervious gloves and clothing should be worn for prolonged orRepeated contact.EYE PROTECTION: Safety glassesRESPIRATORY PROTECTION:Atmospheric levels of fibrous glass, copper, and other dusts should bemaintained below recommended exposure guidelines.If airborne contaminant is likely to exceed acceptable limits, use aNIOSH-approved respirator.ADDITIONAL: N/ARECOMMENDATIONS: N/AEXPOSURE GUIDELINES:INGREDIENT NAME: CAS# ACGIH TLV OSHA PEL OTHER LIMITSITEQ CorporationSAFETY DATA SHEET9.PHYSICAL AND CHEMICAL CHARACTERISTICSAPPEARANCE: Amber, gold, or yellow sheets which may have copper cladding on oneor both sides.PHYSICAL STATE: Solid.ODOR: None unless heated.BOILING POINT: N/AMELTING POINT: N/AMOLECULAR WEIGHT:N/ACHEMICAL FORMULA:N/APH: N/ASOLUBILITY IN WATER:InsolubleVAPOR PRESSURE: N/AVAPOR DENSITY: N/ASPECIFIC GRAVITY: 1.6-1.9EVAPORATION RATE: N/A%VOLATILES: <1.5%10. STABILITY AND REACTIVITYNORMALLY STABLE: YES.INCOMPATIBILITIES: Not determinedHAZARDOUS: CO, CO2, HBr, aromatic or aliphatic hydrocarbons. DECOMPOSITION PRODUCTS: Laser processing may result in copper fumes.HAZARDOUSPOLYMERIZATION: None11.TOXICOLOGICAL INFORMATIONIMMEDIATE ( ACUTE )EFFECTS:Dust may cause eye, skin, and respiratory irritation. DELAYED ( SUBCHRONIC ANDCHRONIC ) EFFECTS:NTP and IARC consider respirable glass wool a possible humanCarcinogen.IARC consider continuous glass filaments unclassifiable orNon-carcinogenic ( Group 3 ).ITEQ CorporationSAFETY DATA SHEET12.ECOLOGICAL INFORMATIONNot biodegradable.13.DISPOSAL CONSIDERATIONSRCRA HAZARDOUS WASTE: No.WASTE DISPOSAL METHOD: Landfill.Do not incinerate.Recycle copper.Disposal must comply with all local, regional, and national regulations. Information supplied here is for the material as shipped. Use or alteration of the product such as mixingwith other materials such as lead solder during the printed circuit boards fabrications process maychange the RCRA classification of the mixture and require alternative disposal procedures.14.TRANSPORTATION INFORATIONUS DOT HAZARD CLASS : Not regulated.US DOT ID NUMBER: N/A15.REGULATORY INFORMATIONTSCA INVENTORY STATUS : Resin system components used in this product are on the TSCAInventory list.OTHER TSCA ISSUES: None.16. Other materialSAFETY DATA SHEETRemark : This MSDS , described as satisfactorily as possible, does not cover every case of danger . Hazard information on paint product is estimated as a mixturebased on that of individual raw materials . Additionally , your use of thisinformation is beyond our control and may be beyond our knowledge.Therefore, the information is provided without any representation orWarranty express or implied.。

X67DI1371数字输入模块数据表 V3.23说明书

X67DI13711 General informationThe module is a digital input module for 24 VDC. It has 8 inputs for sink input circuits.■For all standard sensors with M8 connectors■Extremely short cycle times■Integrated sensor supply with short circuit protection2 Order dataTable 1: X67DI1371 - Order data3 Technical dataTable 2: X67DI1371 - Technical dataTable 2: X67DI1371 - Technical data1)The power consumption of the sensors and actuators connected to the module is not permitted to exceed 12 W.4 LED status indicatorsStatus indicator 2:Left: green; Right: red5 Connection elementsDigital inputs 1 to 8X2X LinkConnector A: Input Connector B: Output24 VDC I/O power supply Connector C: SupplyConnector D: Pass through6 X2X LinkThis module is connected to X2X Link using pre-assembled cables. The connection is made using M12 circular connectors.1137 24 VDC I/O power supplyThe I/O power supply is connected via M8 connectors C and D. The I/O power supply is connected via connector C (male). Connector D (female) is used to route the I/O power supply to other modules.Information:The maximum permissible current for the I/O power supply is 8 A (4 A per connection pin)!338 PinoutX67CA0D40.xxxx:M8 sensor cable, straight①X67CA0D50.xxxx:M8 sensor cable, angled8.1 Connections X1 to X81343419 Connection example10 Input circuit diagram11 Register description11.1 General data pointsIn addition to the registers listed in the register description, the module also has other more general data points. These registers are not specific to the module but contain general information such as serial number and hardware version.These general data points are listed in section "Additional information - General data points" of the X67 system user's manual.11.2 Function model 0 - Standard11.3 Function model 254 - Bus controller1)The offset specifies the position of the register within the CAN object.11.3.1 Using the module on the bus controllerFunction model 254 "Bus controller" is used by default only by non-configurable bus controllers. All other bus controllers can use additional registers and functions depending on the fieldbus used.For detailed information, see section "Additional information - Using I/O modules on the bus controller" of the X67 user's manual (version 3.30 or later).11.3.2 CAN I/O bus controllerThe module occupies 1 digital logical slot on CAN I/O.11.4 Digital signal - Communication11.4.1 Digital inputsFilteredThe filtered status is collected with a fixed offset to the network cycle and transferred in the same cycle.11.4.1.1 Input state of digital inputs 1 to 8Name:DigitalInput01 to DigitalInput08This register indicates the input state of digital inputs 1 to 8.Bit structure:11.4.2 Reading the module IDName:asy_ModulIDThis register offers the possibility to read the module ID.11.5 Minimum cycle timeThe minimum cycle time specifies the time up to which the bus cycle can be reduced without communication errors occurring. It is important to note that very fast cycles reduce the idle time available for handling monitoring, diagnostics and acyclic commands.11.6 Minimum I/O update timeThe minimum I/O update time defines how far the bus cycle can be reduced while still allowing an I/O update to take place in each cycle.。

DU8671 PDF

DU8671QR 模式高压高精度中小功率 LED 恒流驱动器特点内置500V高压MOSFET TRUEC2闭环恒流控制技术 TRUEQR控制技术 3%系统恒流精度采样电阻开路、短路保护输出短路保护可编程输出过压保护过温保护 SOP8封装概述DU8671是一款工作于准谐振模式下的降压式恒流驱动器，主要应用于中小功率的LED恒流驱动电源系统。

采用独特的闭环恒流控制专利－TRUEC2技术，可在宽的输入、输出电压以及外围电感参数条件下实现高精度的输出电流，并保证批量生产时LED灯具亮度的一致性。

采用专利的TRUEQR技术，使得MOSFET每个周期都在真正的谷底开通，从而降低了系统的开关损耗和EMI。

DU8671集成了可编程的输出开路保护，多重的短路保护，过温保护以及各个引脚的开路、短路保护功能，从而使系统具备高可靠性。

DU8671采用SOP8封装。

应用LED 日光灯管 T5/T8/T10… LED 球泡灯 E14/E27/PAR30/PAR38… LED 吸顶灯 …典型应用图Page 1 of 6Duty-Cycle SemiconductorDS _DU8671_CN_V1.2DU8671QR 模式高压高精度中小功率 LED 恒流驱动器引脚封装SOP8 封装引脚描述引脚编号 1 2 3 4 5, 6 7, 8 引脚名称 OVS GND VCC DRA DRN CS 输出开路电压设置端芯片接地端芯片电源端内置低压 MOSFET 漏极内置高压 MOSFET 漏极电流采样端描述定购信息定购型号 DU8671 封装 SOP8 包装 2500 颗/盘编带推荐应用工作温度范围 -40℃~85℃ 最大输出电流 240mAPage 2 of 6Duty-Cycle SemiconductorDS _DU8671_CN_V1.2DU8671QR 模式高压高精度中小功率 LED 恒流驱动器极限参数(1)(2)符号 DRN OVS CS IVCC θJA Tj Tstg ESD说明:脚位 5,6 1 7,8 3 --------描述内置高压MOSFET漏极输出开路电压设置端电流采样端 VCC 最大钳位电流热阻（结温-环境）最大工作结温存储温度范围静电（人体模式）范围 -0.3~500 -0.3~6 -0.3~6 10 150 -40~150 -65~150 2单位 V V V mA ℃/W ℃ ℃ kV(1) 最大极限值是指超出该工作范围，芯片可能损坏。

Rosemount 1056双通道传感器分析仪产品数据单据说明书

Product Data SheetMay 2017LIQ-PDS-1056 Rosemount 1056 Dual Channel TransmitterMulti-parameter Transmitter for Liquid AnalysisThe Rosemount 1056 Dual Channel Transmitter displays up to two independent liquid analytical measurements. HART and Profibus DP digital communication options allow for connection to HART hosts and Profibus networks. Start-up and installation of the 1056 is easy by using Quick Start Programming.OverviewIndependent Dual Input Measurements⏹Expandable to two channels of liquid analyticalmeasurements: pH/ORP, Conductivity, Free Chlorine, Total Chlorine, Dissolved Oxygen, Ozone, and Turbidity.⏹Modular boards with auto-recognition of sensor board.⏹Large, easy to read, user customizable display of dual measurements in addition to diagnostic and temperature readings.Reduced Installation and Maintenance Time⏹Shorter installation times using Quick Start programming at initial install or after factory reset.⏹Effortlessly connect with PLCs and DCS' by choosing the HART or Profibus DP communication options.⏹Display measurements, configure alarms, and conduct maintenance with a simple to use local operator interface.⏹Efficiently manage your devices using intuitive device dashboards on AMS/475 Communicators.Accurate, Linear and Reliable Measurements of Analytical Sensors⏹Faster calibration of pH sensors using auto pH Buffer solution detection.⏹Linear conductivity measurements with on-board concentration curves for common acids and bases.⏹Built-in features to easily display accurate amperometric and turbidity measurements.ContentsOverview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21056 Dual Channel Transmitter . . . . . . . . . . . . . . . . . . . . 3Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5Product Certifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6Dimensional Drawings . . . . . . . . . . . . . . . . . . . . . . . . . . . . .71056 Dual Channel TransmitterTable 1. Rosemount 1056 Dual Channel Transmitter Ordering Information ModelTransmitter type1056Dual channel transmitterPower01115/230 Vac, 50/60 Hz no relays (1)0224 Vdc with four alarm relays0385-265 Vac switching, 50/60 Hz with four alarm relaysMeasurement 120Contacting conductivity 21Toroidal conductivity 22pH/ORP/ISE 23Flow/current input 24Chlorine 25Dissolved oxygen 26Ozone 27TurbidityMeasurement 230Contacting conductivity 31Toroidal conductivity 32pH/ORP/ISE 33Flow/current input 34Chlorine 35Dissolved oxygenRosemount 1056 Dual Channel Transmitter is a line powered device that can accept inputs from pH/ORP, ISE, flow, conductivity (contacting and toroidal), turbidity, and amperometric (dissolved oxygen, chlorine, and ozone) sensors.⏹Faster installation using Quick Start programming, auto-recognition of sensor boards and modular design.⏹At a glance view of pertinent information provided by the large customizable display.⏹Visibility of process parameters by utilizing HART or Profibus DP digital communications.Additional InformationSpecifications: see “Specifications” on page 5Certifications: see “Product Certifications” on page 6Dimensional drawings: see “Dimensional Drawings” on page 7Table 1. Rosemount 1056 Dual Channel Transmitter Ordering Information(continued)36Ozone37Turbidity38NoneCommunicationAN4-20 mA analogDP Profibus DP digital communicationHT HART® digital communicationUL Approval-CSA/FM approvalUL UL approval1.Not compatible with Turbidity Measurements.Table 2. Rosemount 1056 Dual Channel Transmitter Accessories ListPart Number Description23554-00Cable gland kit (Qty 5)23820-00 2 in. pipe mounting kit (Includes U-bolts, mounting bracket, nuts, washers, and screws)23820-01 2 in. stainless steel pipe mounting kit (Includes U-bolts, mounting bracket, nuts, washers and screws) 9240048-00Stainless steel tag (customer specified marking)SpecificationsGeneral AnalyzerEnclosureMaterial: Polycarbonate. Rating: Type 4X and IP65.Dimensions: 6.10 in. L x 6.10 in. W x 5.45 in. H (155 mm x 155 mm x 131 mm)Conduit openings: 1/2 in. or PG 13.5 conduit fittings.DisplayFeatures: User customizable, monochromatic graphic liquid crystal, back lit display.Display Resolution: 128 x 96 pixel display resolution.Dimensions: 3.8 in. (Diagonal)Ambient ConditionsTemperature: 32 to 131 °F (0 to 55 °C)Temperature for Turbidity: 32 to 122 °F (0 to 50 °C)Relative Humidity: 5 to 95% (non-condensing)Storage Temperature: -4 to 140 °F (-20 to 60 °C)Power01: 115 Vac ±15% 60 Hz ±6%, 10 W; 230 Vac ±15% 50 Hz ±6%, 10 W.02: 20 to 30 Vdc. 15 W.03: 84 to 265 Vac, 47 to 63.0 Hz. 15 W.Power option codes 02 and 03 include four programmable relays.Equipment protected by double insulation.RelaysInductive Load: 1/8 HP motor (maximum) at 115/230 Vac*Relays only available with option 02 power supply (20 - 30 Vdc) or 03 switching power supply (84 - 265 Vac)Alarm RelaysFour configurable alarm relays for process measurement as alarms or faults with interval timer settings.Terminal Wire SizesPower: 24-12 AWG Analog outputs: 26-16 AWG Relays: 24-12 AWGWeight/Shipping Weight(rounded to nearest 1 lb. or 0.5 kg)3 lb./4 lb. (1.5 kg/2.0 kg)Form C, SPDT, epoxy sealedMaximum Relay CurrentResistive28 Vdc 5.0 A 115 Vac5.0 A 230 Vac5.0 AProduct CertificationsHazardous Location Approvals (Not available for DP)Class I, Division 2, Group A, B, C, and D Class II, Division 2, Groups E, F, and G Class III T4A Tamb = 50 °CEvaluated to the ANSI/UL Standards. The 'C' and 'US' indicators adjacent to the CSA Mark signify that the product has been evaluated to the applicable CSA and ANSI/UL Standards, for use in Canada and the U.S. respectively.Class I, Division 2, Group A, B, C, and D Class II and III, Division 2, Groups E, F, and G T4A Tamb = 50 °C, Enclosure Type 4XOrdinary Locations: (only with UL ordering option)Pollution Degree 2Normally only non-conductive pollution occurs. Temporary conductivity caused by condensation possible.Altitude: 6562 ft. (2000 meter) maximumRadio Frequency Immunity/Electromagnetic Interference (RFI/EMI)EN-61326Low Voltage Directive (LVD)EN-61010-1European Directive InformationA copy of the EC Declaration of Conformity can be found at the end of the Quick Start Guide and the User's Manual. The most recent revision of the EC Declaration of Conformity can be found at /RosemountLiquidAnalysis.Dimensional DrawingsFigure 1. Panel Mount DimensionsFigure 2. Wall Mount Dimensions154.96.1154.96.1Front View152.736.0126.365.076.23.041.41.6Conduit Openings6X Ø21.83.9Bottom View126.45.027.131.1Panels Supplied By OthersMaximum Thickness .375 in (9.52 mm)4X Mounting Brackets and Screws Provided with Instrument Panel Mount GasketSide View138.43 ± .55.45 ± .02138.43 ± .55.45 ± .02Maximum Radius4X R 1.5.1Panel Cut-out154.96.11024.0Front View 4X Cover Screw1877.4154.96.171.372.845.211.880.013.2Front panelPanel & PipeMount Enclosure2 inch Pipe Mount Bracket2X Set U-Bolts For 2inch Pipein Kit PN 23820-00Conduit Openings 6X Ø21.83.9108.94.3Bottom View2329.133.51.31305.1Side View1656.52329.133.51.31305.11656.5Side View2 inch Pipe Supplied by CustomerProduct Data SheetMay 2017Rosemount 1056 Dual Channel TransmitterLIQ-PDS-1056/RosemountLiquidAnalysis/user/RosemountAnalytical/Rosemount_News Emerson Automation Solutions8200 Market Boulevard Chanhassen, MN 55317,USATel +1 800 999 9307Fax +1 952 949 7001**********************/Rosemount© 2017 Emerson Automation Solutions. All rights reserved.The Emerson logo is a trademark and service mark of Emerson Electric Co.Rosemount and the Rosemount logotype are registered trademarks of Rosemount Inc. All other marks are the property of their respective owners.The contents of this publication are presented for information purposes only, and while effort has been made to ensure their accuracy, they are not to be construed as warranties or guarantees, express or implied, regarding the products or services described herein or their use or applicability. All sales are governed by our terms and conditions, which are available on request. We reserve the right to modify or improve the designs or specifications of our products at any time without notice.。

National Instruments PXIe系列产品数据手册说明书

Board Assembly Part Number(s)Part Number Description159040B-01L or later NI PXIe-7846R159040B-02L or later NI PXIe-7847R159040B-03L or later NI PXIe-7856R159040B-04L or later NI PXIe-7857R159040B-05L or later NI PXIe-7858RManufacturer: National InstrumentsVolatile MemoryUser Accessible/ BatteryType Size System Accessible1Backup? Purpose Method of Clearing2(7846R/7847R/7856R/7857R)FPGA Block RAM 11,700 KB Yes/Yes No Data storage during Cycle PowerVI Execution(7858R)FPGA Block RAM 16,020 KB Yes/Yes No Data storage during Cycle PowerVI Execution (7847R/7857R/7858R)DRAM 512MB Yes/Yes No Onboard Memory Storage Cycle PowerNon-Volatile MemoryUser Accessible/ BatteryType Size System Accessible Backup? Purpose Method of Clearing(7846R/7847R/7856R/7857R)Flash 64 Mb No- Device information No/Yes Product Identification None available to user- Calibration data3No/Yes Calibration Information None available to user- Calibration metadata Yes/Yes User-defined See Clearing Notes- FPGA bitstream Yes/Yes User LV FPGA VI Bitstream See Clearing Notes(7858R)Flash 128 Mb- Device information No/Yes No Product Identification None available to user- Calibration data3No/Yes Calibration Information None available to user- Calibration metadata Yes/Yes User-defined See Clearing Notes- FPGA bitstream Yes/Yes User LV FPGA VI Bitstream See Clearing Notes1 Items are designated No for the following reason(s):a) Hardware changes or a unique software tool from National Instruments are required to modify contents of the memorylisted.b) Hardware-modifying software tools are not distributed to customers for any personal access or customization, also knownas non-normal use.2 The designation None Available to User indicates that the ability to clear this memory is not available to the user undernormal operation. The utilities required to clear the memory are not distributed by National Instruments to customers fornormal use.3 Calibration constants that are stored in device calibration memory include information for the device’s full operating range. Calibration constants do not maintain any unique data for specific configurations at which the device is used unlessotherwise specified.Media StorageUser Accessible/ BatteryType Size System Accessible Backup? Purpose Method of Clearing NONEClearing Notes:Calibration metadata: There are two items in the calibration metadata that need to be cleared:1.To clear the user-defined information, you can use the Calibration Utility to write a known value to the user stringfield.2.To clear the calibration password, you can use the Calibration Utility to change the password to a known value.FPGA bitstream: You can use the NI-RIO Device Setup utility to erase the FPGA bitstream data. For more details, visit /info and enter the infocode fpgaflashclr.Terms and DefinitionsUser Accessible Allows the user to directly write or modify the contents of the memory during normal instrument operation. System Accessible Does not allow the user to access or modify the memory during normal instrument operation. However, system accessible memory may be accessed or modified by background processes. This can be something that is not deliberate by the user and can be a background driver implementation, such as storing application information in RAM to increase speed of use.Cycle Power The process of completely removing power from the device and its components. This process includes a complete shutdown of the PC and/or chassis containing the device; a reboot is not sufficient for the completion of this process. Volatile Memory Requires power to maintain the stored information. When power is removed from this memory, its contents are lost.Non-Volatile Retains its contents when power is removed. This type of memory typically contains calibration or chip configuration information, such as power up states.。

英特尔Stratix10器件数据表说明书

器件等级
• –E1V (最快) • –E2V • –E2L • –E3V • –E3X
• –I1V • –I2V • –I2L • –I3V • –I3X
支持的速度等级
速度等级的后缀表示 Intel Stratix 10 器件中提供的功耗选项。
• V—标准静态功耗的 SmartVID。对于“V”后缀器件，VCC 和 VCCP 必须共享同一个 SmartVID 调节器。VCCL_HPS 可以共享同一个 SmartVID 调节器，或者使用一个单独的固定电压调节器。
• L—低静态功耗的 0.85 V 固定电压
• X—最低静态功耗的 0.85 V 固定电压
英特尔公司。保留所有权利。英特尔、英特尔徽标和其他英特尔标志是英特尔公司或其子公司的商标。依照英特尔的标准保证条例，英特尔保证其 FPGA 和半导体产品的性能符合当前规
格，但保留随时更改任何产品和服务的权利，恕不另行通知。英特尔概不承担因应用或使用本文中描述的任何信息、产品或服务而产生的任何责任和义务，除非得到英特尔书面上的明确同意。建议英特尔客户在信赖任何已发布的信息之前以及下单订购产品或服务之前，应先获取最新版本的器件规格。 *其他的名称和品牌可能是其他所有者的资产。
Intel® Stratix® 10 器件数据表........................................................................................................................................................ 3 电气特性.......................................................................

iw3616、3617、3630datasheet中文翻译(绝对真实)

产品特色大幅简化离线式LED驱动器设计●单级功率因数校正(PFC)与精确恒流(CC)输出相结合●输入/输出电容和变压器体积小●一次侧反馈控制，无需光耦电路，简化了电路设计●简化初级侧PWM调光接口●符合IEC61000-3-2标准高效节能和高兼容性●大幅提升效率，可达到85%以上●减少元件数量●总谐波失真<15%且PF>0.95●前沿、后沿和数字调光器●传感器和定时器精确稳定的性能●LED负载恒流精度不低于±5%●支持LED负载热插拔●1%-100%宽范围调光，调光无闪烁先进的保护及安全特性●通过自动重启动提供短路保护●开路故障检测模式●自动热关断重启动无论在PCB板上还是在封装上，都保证高压漏极引脚与其他所有信号引脚之间满足高压爬电要求应用●LED离线固态照明说明G7617 是一款的适用于LED调光控制的离线式两级交流/直流电源控制器，是适用于25W 输出功率的可调光LED 灯具的最优之选。

G7617符合电磁兼容性(EMC) IEC61000-3-2 标准，在120V AC或230V AC输入电压下其功率因数(PF) 可达到0.95 以上。

采用先进的数控技术来检测调光器的类型和相位，为调光器提供动态阻抗的同时可调节LED发光亮度，自动检测调光器类型和相位，从而实现了业内与模拟及数字调光器最广泛的兼容性。

G7617工作于准谐振工作模式，工作效率高，可工作于前沿后沿调光模式，也可工作于R 型、R-C型或R-L型调光控制模式。

G7617 符合热插拔LED 模块的固态照明行业标准Zhaga，同时还集成了调光功能的映射选项（位于白炽灯替代灯的NEMA SSL6 调光曲线内）。

G7617 系列有两个版本：针对120V AC输入应用进行优化的G7617-00 和针对230V AC 应用进行优化的G7617-01。

订购信息应用框图图1典型应用内部框图Vcc VinVcbVT CFGASU BisenseBdrvFdrvFisensePGNDAGND C O R E图2 内部框图引脚功能描述BV SENSE V IN BI SENSE B DRV CFG ASU V CCV CBV TFV SENSEFI SENSEF DRVAGNDPGND 图3. 引脚布局BV SENSE引脚：PFC电感电压反馈点，用于感知Boost电感的磁通状态。

Linsitinib_867160-71-2_DataSheet_MedChemExpress

References: [1]. Arnold, Lee D.; Cesario, Cara; Coate, Heather; Crew, Andrew Philip; Preparation of 6,6-bicyclic ring substituted heterobicyclic protein kinase inhibitors. PCT Int. Appl. (2005), 653 pp. CODEN: PIXXD2 WO 2005097800 无 [2]. [ ] Mulvihill MJ, , Cooke A, , Rosenfeld-Franklin M, , Buck E, , Foreman K, , Landfair D, , O'Connor M, , Pirritt C, Sun Y, Yao Y, Arnold Lห้องสมุดไป่ตู้, Gibson NW, Ji QS.Discovery of OSI-906: a selective and orally efficacious dual inhibitor of the IGF-1 receptor and insulin receptor.Future Med Chem. 2009 Sep;1(6):1153-71. [3]. McKinley ET, Bugaj JE, Zhao P, Guleryuz S, Mantis C, Gokhale PC, Wild R, Manning HC.18FDG-PET predicts pharmacodynamic response to OSI-906, a dual IGF-1R/IR inhibitor, in preclinical mouse models of lung cancer.Clin Cancer Res. 2011 May 15;17(10):3332-40. Epub 2011 Jan 21. [4]. Zhao H, Desai V, Wang J, Epstein DM, Miglarese M, Buck...

RSSA-9300B 3GHz谱面分析仪数据手册说明书

FEATURES...........180-4796RSSA-9300B TGFrequency Range : 9kHz ~ 3 GHz0.025ppm Frequency Stability and 1ppm Aging RateBuilt-in Preamplifier, 50dB Attenuator, and Sequence Function RBW : 1Hz ~ 1MHzSensitivity : -149dBm/Hz (@PreAmp on)Built-in AM/FM Demodulation & AnalysisBuilt-in P1dB Point, Harmonic, Channel Power, N-dB Bandwidth, OCBW, ACPR, SEM, TOI,CNR, CTB, CSO, Noise Marker, Frequency Counter, Time Domain Power, Gated Sweep Built-in Spectrogram, Topographic and Dual-View Display Modes Remote Control Software : SpectrumShot Remote Control Interface : LAN, USB, RS-232Options : Tracking Generator, GPIB Interface, Battery PackDatasheetStock number :180-47953GHz Spectrum AnalyzerRSSA-9300BENLANDVIMicro SD/SDHCPRACTICAL, AFFORDABLE AND NEVER CARELESS!Wireless communications applications are nowadays ubiquitous. Signals in the limited spectrum are getting very crowded. Therefore, the demands of signal efficiency and frequency stability are higher and stricter. To meet high precision measurement requirements, RSSA-9300B provides the frequency stability of 0.025ppm and the aging rate of 1ppm/year, which only appear in high-end T&M equipment.Engineers often face the challenge of measuring small RF signals during product development stage. RSSA-9300B built-in preamplifier provides the base noise of -149dBm. When collocating with the built-in EMI filter and the dedicated EMI near field probe, RSSA-9300B can conduct EMI tests and debugging.Frequency Stability : 0.025ppmBuilt-in PreamplifierMore Than 20 Measurement ApplicationsRSSA-9300B provides rich signal processing functions, including AM/FM modulation signal analysis, signal channel analysis, and CATV parameter test, characteristic test on signal stability,and frequency response or power linearity tests for components to substantially bring up the measurement convenience. Most competitors in the same class only offer a few test functions,and the standard built-in functions of RSSA-9300B are options for competitors.RSSA-9300B is a 3GHz spectrum analyzer to meet basic RF measurement requirements. It provides the frequency stability of 0.025ppm;the aging rate of 1ppm/year; a built-in preamplifier; the base noise of -149dBm/Hz, and more than 20 measurement applications,including AM/FM modulation signal analysis, signal channel analysis, and CATV parameter test. While collocating with TG option,RSSA-9300B can conduct frequency response or power linearity tests for components.To sum up, RSSA-9300B is a stable, light and all-purpose test equipment, which is the most ideal choice for the educational market,production line, and general signal monitoring applications, etc. Most important, the pricing of RSSA-9300B is beyond your imagination and it is the number one choice for users with budget considerations.PSSA-9300B, with its unique features, including auto wake-up, sequence function, and limit line testing, is specially designed to meet the requirements of production lines. The patent design of heat conduction allows RSSA-9300B to substantially reduce the warm-up time so as to expedite production processes. Options include tracking generator, carrying bag, battery module, rack accessories. The compact design of RSSA-9300B satisfies either field testing or the integration of automatic testing systems.For monitoring signals, RSSA-9300B provides Topographic display mode, which is capable of distinguishing continuous or random signals by using color temperature. Spectrogram mode provides a time axis on spectrum display that allows users to observe signal variations based upon the reference of time. Split window mode allows different parameter settings for each display window.Additionally,RSSA-9300B also provides user-friendly user interfaces such as display mode, help, multi-languages, and fast data logging,etc. Interfaces and software include USB/RS-232/LAN/MicroSD/GPIB (option)/DVI output and dedicated PC software IVI Driver.OPTIONAL ACCESSORIESOPTIONSFREE DOWNLOADORDERING INFORMATIONRSSA-9300B 3 GHz Spectrum AnalyzerPower Cord, Certificate of Calibration, CD-ROM (with Quick Start Guide, User Manual,Programming Manual, SpectrumShot Software, SpectrumShot Guide & IVI Driver)Opt.01Tracking GeneratorOpt.02Battery PackOpt.03GPIB InterfaceGSC-009Soft Carrying Case GRA-415Rack Adapter PanelSpectrumShot PC Software for Windows System (available on RS website)IVI Driver Supports LabVIEW/LabWindows/CVI Programming (available on NI website)Specifications subject to change without notice.to warm-up to a temperature of 20 to 30 , unless specified otherwise.℃℃ACCESSORIES。

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Product Name:
Linsitinib CAS No.:
867160-71-2Cat. No.:
HY-10191
Product Data Sheet
MWt:
421.49Formula:
C26H23N5O Purity :>98%
Solubility:DMSO ≥
81mg/mL Water y Mechanisms:Biological Activity:
Linsitinib(OSI 906)is highly potent orally efficacious and highly selective dual ATP competitive
Pathways:Protein Tyrosine Kinase/RTK; Target:IGF-1R
Pathways:Protein Tyrosine Kinase/RTK; Target:Insulin Receptor g <1.2mg/mL Ethanol <1.2mg/mL
Linsitinib(OSI-906) is highly potent, orally efficacious and highly selective, dual ATP-competitive
inhibitor of IGF-1R (IC50= 35 nM) and insulin receptor (IC50=75 nM).
IC50 value: 35 nM (IGF-1R); 75 nM (InsR) [1]
Target: IGF-1R;InsR in vitro: OSI-906 inhibits IGF-1R autophosphorylation and activation of the downstream signaling proteins Akt, ERK1/2 and S6 kinase with IC50 of 0.028 to 0.13 μM. OSI-906 enables an
intermediate conformation of the target protein through interactions with the C-helix. OSI-906
displays favorable metabolic stability in liver microsomes. OSI-906 fully inhibits both IR and IGF-1R phosphorylation at a concentration of 1 μM. OSI-906 inhibits proliferation of several tumor cell lines References:
[1]. Mulvihill MJ, et al. Discovery of OSI-906: a selective and orally efficacious dual inhibitor of the
IGF-1 receptor and insulin receptor. Future Med Chem. 2009 Sep;1(6):1153-71.[2]. McKinley ET, et al. 18FDG-PET predicts pharmacodynamic response to OSI-906, a dual IGF-p p y p
including non-small-cell lung cancer and colorectal cancer (CRC) tumor cell line with EC50 of 0.021
to 0.810 μM [1].in vivo:OSI-906 inhibits tumor growth in an IG...
1R/IR inhibitor, in preclinical mouse models of lung cancer. Clin Cancer Res. 2011 May
15;17(10):3332-40.Caution: Not fully tested. For research purposes only
Medchemexpress LLC
18 W i l k i n s o n W a y , P r i n c e t o n , N J 08540,U S A
E m a i l : i n f o @m e d c h e m e x p r e s s .c o m W e b : w w w .m e d c h e m e x p r e s s .c o m。