TLRMH1100B中文资料
B1100LB中文资料
B
SMB Dim Min 3.30 4.06 1.96 0.15 5.00 0.10 0.76 2.00 Max 3.94 4.57 2.21 0.31 5.59 0.20 1.52 2.62 A B C D
A
C
D
E G H
Mechanical Data
· · · · · Case: SMB, Molded Plastic Terminals: Solder Plated Terminal Solderable per MIL-STD-202, Method 208 Polarity: Cathode Band or Cathode Notch Marking: B110LB and Date Code Weight: 0.093 grams (approx.)
DS30077 Rev. A-2
1 of 2
B1100LB
4
IF, INSTANTANEOUS FWD CURRENT (A)
10
I(AV), AVERAGE FWD CURRENT (A)源自31.02
0.1
1
0 25 50 75 100 125 150
Tj - 25°C IF Pulse Width = 300µs
@ TA = 25°C unless otherwise specified
B1100LB 100 70 1.0 2.0 50 0.75 0.5 5.0 100 22 -65 to +150
Unit V V A A V mA pF K/W °C
Notes:
1. Valid provided that terminals are kept at ambient temperature. 2. Measured at 1.0MHz and applied reverse voltage of 4.0V DC.
BR1100资料
MBR1100Preferred DeviceAxial Lead Rectifier...employing the Schottky Barrier principle in a large area metal-to-silicon power diode. State-of-the-art geometry features epitaxial construction with oxide passivation and metal overlap contact. Ideally suited for use as rectifiers in low-voltage, high-frequency inverters, free wheeling diodes, and polarityprotection diodes.•Low Reverse Current•Low Stored Charge, Majority Carrier Conduction•Low Power Loss/High Efficiency•Highly Stable Oxide Passivated Junction•Guard-Ring for Stress Protection•Low Forward V oltage•150°C Operating Junction Temperature•High Surge CapacityMechanical Characteristics:•Case: Epoxy, Molded•Weight: 0.4 gram (approximately)•Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable•Lead and Mounting Surface Temperature for Soldering Purposes: 220°C Max. for 10 Seconds, 1/16″ from case•Shipped in plastic bags, 1000 per bag•Available Tape and Reeled, 5000 per reel, by adding a “RL’’ suffix to the part number•Polarity: Cathode Indicated by Polarity Band•Marking: B1100MAXIMUM RATINGSPreferred devices are recommended choices for future use and best overall value.THERMAL CHARACTERISTICS (See Note 2)ELECTRICAL CHARACTERISTICS (T= 25°C unless otherwise noted)Figure 2. Typical Reverse Current {Figure 3. Current Derating (Mounting Method 3 per Note 1)Figure 4. Power Dissipation20102.05.01.0V R , REVERSE VOLTAGE (VOLTS)609000.20.040.020.011201600T A , AMBIENT TEMPERATURE (°C)4.03.02.01.00I F(AV), AVERAGE FORWARD CURRENT (AMPS)1.004.03.02.01.02.0140i F , I N S T A N T A N E O U S F O R W A R D C U R R E N T (A M P S )I I P F (A V ), A V E R A G E P O W E R D I S S I P A T I O N (W A T T S )0.50.20.1708010203040500.10.41.020********* 3.0 4.0 5.00.050.02100, R E V E R S E C U R R E N T ( A )R m 4.02.01020100402001 K400200180, A V E R A G E F O R W A R D C U R R E N T (A M P S )F (A V ){ The curves shown are typical for the highest voltagedevice in the voltage grouping. Typical reverse current for lower voltage selections can be estimated from these same curves if V R is sufficiently below rated V R .Figure 5. Typical Capacitance2040V R , REVERSE VOLTAGE (VOLTS)150504*********C , C A P A C I T A N C E (p F )50100601001070809070609080NOTE 1 — MOUNTING DATA:Data shown for thermal resistance junction-to-ambient (R q JA) for the mounting shown is to be used as a typical guideline values for preliminary engineering or in case the tie point temperature cannot be measured.Typical Values for Rin Still AirMounting Method 1P .C. Board with 1-1/2″ x 1-1/2″copper surface.Mounting Method 3P .C. Board with 1-1/2″ x 1-1/2″copper surface.VECTOR PIN MOUNTINGMounting Method 2NOTE 2 — THERMAL CIRCUIT MODEL:(For heat conduction through the leads)Use of the above model permits junction to lead thermal resistance for any mounting configuration to be found. For a given total lead length, lowest values occur when one side of the rectifier is brought as close as possible to the heat sink.Terms in the model signify:T A = Ambient Temperature T C = Case Temperature T L = Lead Temperature T J = Junction Temperature R q S = Thermal Resistance, Heat Sink to Ambient R q L = Thermal Resistance, Lead to Heat Sink R q J = Thermal Resistance, Junction to Case P D = Power Dissipation(Subscripts A and K refer to anode and cathode sides,respectively.) V alues for thermal resistance components are:R q L = 100°C/W/in typically and 120°C/W/in maximum.R θJ = 36°C/W typically and 46°C/W maximum.NOTE 3 — HIGH FREQUENCY OPERATION:Since current flow in a Schottky rectifier is the result of majority carrier conduction, it is not subject to junction diode forward and reverse recovery transients due to minority carrier injection and stored charge. Satisfactory circuit analysis work may be performed by using a model consisting of an ideal diode in parallel with a variable capacitance. (See Figure 5)Rectification efficiency measurements show that operation will be satisfactory up to several megahertz. For example, relative waveform rectification efficiency is approximately 70 percent at 2 MHz, e.g., the ratio of dc power to RMS power in the load is 0.28 at this frequency,whereas perfect rectification would yield 0.406 for sine wave inputs. However, in contrast to ordinary junction diodes, the loss in waveform efficiency is not indicative of power loss: it is simply a result of reverse current flow through the diode capacitance, which lowers the dc output voltage.PACKAGE DIMENSIONSCASE 59-10ISSUE SAXIAL LEAD, DO-41DIM MIN MAX MIN MAX MILLIMETERSINCHES A 4.10 5.200.1610.205B 2.00 2.700.0790.106D 0.710.860.0280.034F −−− 1.27−−−0.050K25.40−−−1.000−−−NOTES:1.DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.2.CONTROLLING DIMENSION: INCH.3.59−04 OBSOLETE, NEW STANDARD 59−09.4.59−03 OBSOLETE, NEW STANDARD 59−10.5.ALL RULES AND NOTES ASSOCIATED WITH JEDEC DO−41 OUTLINE SHALL APPLY6.POLARITY DENOTED BY CATHODE BAND.7.LEAD DIAMETER NOT CONTROLLED WITHIN F DIMENSION.ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to makechanges without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others.SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer.PUBLICATION ORDERING INFORMATIONJAPAN : ON Semiconductor, Japan Customer Focus Center 2-9-1 Kamimeguro, Meguro-ku, Tokyo, Japan 153-0051Phone : 81-3-5773-3850。
TLGTE1100B资料
TOSHIBA LED LampsTLBE1100B(T11), TLGTE1100B(T11), TLEGE1100B(T11)Panel Circuit Indicator• Surface-mount devices• 3.2 (L) × 2.8 (W) × 1.9 (H) mm • Flat-top type • InGaN LEDs• High luminous intensity• Low drive current, high-intensity light emission • Colors: Blue λd=470nm(typ) Bluish Green λd=505nm(typ) Green λd=528nm(typ) • Pb free reflow soldering is possible• Applications: automotive use, message signboards, backlightingetc.• Standard embossed tape packing: T11 (2000/reel) 8-mm tape reelColor and MaterialAbsolute Maximum Ratings (Ta = 25°C)Product NameForward CurrentI F (mA)Please see Note 1Reverse VoltageV R (V)Power DissipationP D (mW)Operation Temperature T opr (°C)Storage Temperature T stg (°C)TLBE1100B 129 TLGTE1100B 135 TLEGE1100B30 4 132−40~100 −40~100 Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and thesignificant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings.Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc).Note 1: Forward current deratingTLBE1100B TLGTE1100B,TLEGE1100B Unit: mmJEDEC ―JEITA ―TOSHIBA 4-3R1 Weight: 0.035 g (typ.)Product NameColorMaterialTLBE1100B Blue TLGTE1100B Bluish green TLEGE1100B GreenInGaNI F – TaA l l o w a b l e f o r w a r d c u r r e n t I F (m A )0 403080 60 20 1002010400403080 60 20100201040 I F – TaA l l o w a b l e f o r w a r d c u r r e n t I F (m A )Electrical Characteristics (Ta = 25°C)Forward Voltage V F Reverse CurrentI RProduct NameMin Typ. Max I F Max V R TLBE1100B 2.8 3.2 4.3TLGTE1100B 3.0 3.3 4.5TLEGE1100B 2.9 3.4 4.420 10 4Unit VmAμA V Optical Characteristics–1 (Ta = 25°C)Luminous Intensity I V Product NameMin Typ. Max I FAvailable Iv rank Please see Note 2TLBE1100B 63 100 320 20 QA / RA / SATLGTE1100B 160 300 800 20 SA / TA / UATLEGE1100B 100 350 800 20 RA / SA / TA / UAUnit mcdmcdmcdmANote 2: The specification as following table is used for Iv classification of LEDs in Toshiba facility.Each reel includes the same rank LEDs. Let the delivery ratio of each rank be unquestioned.Iv rankRank symbol Min MaxQA 63 125RA 100 200SA 160 320TA 250 500UA 400 800Unit mcd mcdOptical Characteristics–2 (Ta = 25°C)Emission SpectrumPeak Emission Wavelength λp Δλ DominantWavelengthλdProduct NameMin Typ. Max Typ.Min Typ.MaxI FTLBE1100B ⎯ 468 ⎯ 25 463 470 477TLGTE1100B ⎯ 496 ⎯ 30 496 505 514TLEGE1100B ⎯ 523 ⎯ 35 518 528 53720Unit nmnmnmmANote 3: CautionESD withstand voltage according to MIL STD 883D, Method 3015.7 : ≥1000VWhen handling this LED, take the following measures to prevent the LED from being damaged or otherwise adversely affected.1) Use a conductive tablemat and conductive floor mat, and ground the workbench and floor.2) Operators handling laser diodes must be grounded via a high resistance (about 1MΩ). A conductive strap isgood for this purpose.3) Ground all tools including soldering irons.This product is designed as a general display light source usage, and it has applied the measurement standard0.110 380 60 10010.320 50.5 −20 040480 1.0360560 520 440400600R e l a t i v e l u m i n o s i t yForward voltage V F (V) I F – V FFo r w a r d c u r r e n t I F (m A )Forward current I F(mA)I V – I FL u m i n o u s i n t e n s i t y I V (m c d )Case temperature Tc (°C) IV – TcR e l a t i v e l u m i n o s i t y I VWavelength λ (nm)Relative Iv - λ351030 100(typ.)Ta = 25°CRadiation pattern(typ.)(typ.)(typ.)(typ.)0.110 380 60 1001 0.320 50.5 −20 0401.0R e l a t i v e l u m i n o s i tyForward voltage V F (V) I F – V FF o r w a r d c u r r e n t I F (m A )Forward current I F(mA)I V – I F L u m i n o u s i n t e n s i t y I V (m c d )Case temperature Tc (°C) I V – Tc R e l a t i v e l u m i n o s i t y I VWavelength λ (nm)Relative Iv - λ Ta = 25°CRadiation pattern(typ.) (typ.)(typ.) (typ.)(typ.)Relative Iv - λ0.110 380 60 1001 0.320 50.5 −20 040 150 351030100520 400600 560 480440640R e l a t i v e l u m i n o s i t yForward voltage V F (V)I F – V FFo r w a r d c u r r e n t I F (m A )Forward current I F (mA)I V – I FL u m i no u s i n t e n s i t y I V (m c d )Case temperature Tc (°C) I V– TcR e l a tiv e l u m i n o s i t y I VWavelength λ (nm)Ta = 25°CRadiation pattern2.44.2 3.8 2.6 4.63.0 3.4(typ.) (typ.)(typ.)(typ.)PackagingThese LED devices are packed in an aluminum envelope with a silica gel and a moisture indicator to avoidmoisture absorption. The optical characteristics of the devices may be affected by exposure to moisture in the air before soldering and they should therefore be stored under the following conditions:1. This moisture proof bag may be stored unopened within 12 months at the following conditions.Temperature: 5°C~30°C Humidity: 90% (max)2. After opening the moisture proof bag, the devices should be assembled within 168 hours in an environment of5°C to 30°C/60% RH or below.3. If upon opening, the moisture indicator card shows humidity 30% or above (Color of indication changes topink) or the expiration date has passed, the devices should be baked in taping with reel. After baking, use the baked devices within 72 hours, but perform baking only once. Baking conditions: 60±5°C, for 12 to 24 hours.Expiration date: 12 months from sealing date, which is imprinted on the same side as this label affixed. 4. Repeated baking can cause the peeling strength of the taping to change, then leads to trouble in mounting.Furthermore, prevent the devices from being destructed against static electricity for baking of it.5. If the packing material of laminate would be broken, the hermeticity would deteriorate. Therefore, do notthrow or drop the packed devices.Mounting MethodSoldering• Reflow soldering (example)• The products are evaluated using above reflow soldering conditions. No additional test is performed exceed thecondition (i.e. the condition more than (*)MAX values) as a evaluation. Please perform reflow soldering under the above conditions.• Please perform the first reflow soldering with reference to the above temperature profile and within 168 h ofopening the package. • Second reflow solderingIn case of second reflow soldering should be performed within 168 h of the first reflow under the above conditions.Storage conditions before the second reflow soldering: 30°C, 60% RH (max) • Make any necessary soldering corrections manually.(only once at each soldering point) Soldering iron : 25 W Temperature : 300°C or lessTime : within 3 s • If the product needs to be performed by other soldering method (ex. wave soldering), please contact Toshiba sales representative.Recommended soldering patternUnit: mmTime (s)P a c k a g e s u r f a c e t e m p e r a t u r e (°C )Temperature profile for Pb soldering (example)Time (s)P a c k a g e s u r f a c et e m p e r a t u r e (°C )Temperature profile for Pb-free soldering (example)CleaningWhen cleaning is required after soldering, Toshiba recommends the following cleaning solvents.It is confirmed that these solvents have no effect on semiconductor devices in our dipping test (under the recommended conditions). In selecting the one for your actual usage, please perform sufficient review on washing condition, using condition and etc.ASAHI CLEAN AK-225AES : (made by ASAHI GLASS)KAO CLEAN TROUGH 750H : (made by KAO)PINE ALPHA ST-100S : (made by ARAKAWA CHEMICAL) TOSHIBA TECHNOCARE : (made by GE TOSHIBA SILICONES)(FRW-17, FRW-1, FRV-100)Precautions when MountingDo not apply force to the plastic part of the LED under high-temperature conditions. To avoid damaging the LED plastic, do not apply friction using a hard material.When installing the PCB in a product, ensure that the device does not come into contact with other cmponents.Tape Specifications1. Product number formatThe type of package used for shipment is denoted by a symbol suffix after the product number. The method of classification is as below. (this method, however does not apply to products whose electrical characteristics differ from standard Toshiba specifications) (1) Tape Type: T14 (4-mm pitch) (2) Example2. Tape dimensionsUnit: mmSymbol Dimension ToleranceSymbol Dimension ToleranceD 1.5 +0.1/−0 P 2 2.0 ±0.05E 1.75 ±0.1 W 8.0 ±0.3 P 0 4.0 ±0.1 P 4.0 ±0.1 t 0.3 ±0.05 A 0 2.9 ±0.1F 3.5 ±0.05 B 0 3.7 ±0.1 D 1 1.5 ±0.1 K 0 2.3 ±0.1TLBE1100B (T11)Tape typeToshiba product No.3. Reel dimensionsUnit: mm4. Leader and trailer sections of tapeNote1: Empty trailer sectionNote2: Empty leader section5. Packing display(1) Packing quantityReel 2,000 pcs Carton 10,000 pcs(2) Packing form: Each reel is sealed in an aluminum pack with silica gel.6. Label format(1) Example: TLBE1100B (T11)P/N:TOSHIBATYPE TLBE1100BADDC(T11) Q’TY2,000 pcsLot Number Key code for TSB 32C 2000(RANK SYMBOL)Use under 5-30degC/6-%RH within 168hSEAL DATE: [[G]]/RoHS COMPATIBLE DIFFUSED IN ***** *Y3804xxxxxxxxxxxxxxxxx* ASSEMBLED IN *****(2) Label location• Reel• Carton• The aluminum package in which the reel is supplied also has the label attached to center of one side.RESTRICTIONS ON PRODUCT USE20070701-EN GENERAL •The information contained herein is subject to change without notice.•TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property.In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc.• The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his document shall be made at the customer’s own risk.•The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations.• The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patents or other rights of TOSHIBA or the third parties.• Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations.。
Toshiba TLxH1100 SMT LEDs 数据手册
Features3.2 (L) x 2.8 (W) x 1.9 (H) mm Size Flat−top TypeInGaAlP Technology (Ultra High−Brightness Type)Low Drive Current, High Intensity Light Emission High Operating TemperatureStandard Embossed Taping 8 mm Pitch : T09 (1000 pcs/reel)Applications Automotive Use Message Signboard BacklightSeries Line−UpPart Number ColorMaterial TLOH1100Ultra Bright Orange InGaAlP TLRH1100Ultra Bright RedInGaAlP TLSH1100Ultra Bright High Efficency RedInGaAlP TLYH1100Ultra Bright YellowInGaAlPMaximum Ratings (Ta=25o C)Part Number Forward CurrentI FReverse VoltageV RPower DissipationP DOperating TemperatureT oprStorage TemperatureT stgTLOH1100504125.00−40 ~ 100−40 ~ 100TLRH1100504125.00−40 ~ 100−40 ~ 100TLSH1100504125.00−40 ~ 100−40 ~ 100TLYH1100504125.00−40 ~ 100−40 ~ 100UnitmAVmWoC oCCompany Headquarters 3 Norhway Lane North West Coast Sales Office950 South Coast Drive, Suite 265Electrical and Optical Characteristics (Ta=25o C)Part Number PWL nmλPMaterial ViewAngle2θ1/2Luminous IntensityI vForward VoltageV FRev CurrentI Rmin.typ.max.IF@min.typ.max.IF@max.VR@TLOH1100612InGaAlP114o85.00260.00−20mA− 2.10 2.5020mA504V TLRH1100644InGaAlP114o47.60130.00−20mA− 1.90 2.5020mA504V TLSH1100623InGaAlP114o85.00240.00−20mA− 2.10 2.5020mA504V TLYH1100590InGaAlP114o85.00190.00−20mA− 2.10 2.5020mA504V −nm−deg mcd−V−µA−NOTICE:TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, whenutilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property.•In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide forSemiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc..•The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer’s own risk.•Gallium arsenide (GaAs) is a substance used in the products described in this document. GaAs dust and fumes are toxic. Do not break, cut or pulverize the product, or use chemicals to dissolve them. When disposing of the products, follow the appropriate regulations. Do notdispose of the products with other industrial waste or with domestic garbage.•The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any intellectual property or other rights of TOSHIBA CORPORATION or others.•The information contained herein is subject to change without notice.•Company Headquarters 3 Norhway Lane NorthWest Coast Sales Office 950 South Coast Drive, Suite 265TLOH1100 GraphsCompany Headquarters 3 Norhway Lane North West Coast Sales Office950 South Coast Drive, Suite 265TLRH1100 GraphsCompany Headquarters 3 Norhway Lane North West Coast Sales Office950 South Coast Drive, Suite 265TLSH1100 GraphsCompany Headquarters 3 Norhway Lane North West Coast Sales Office950 South Coast Drive, Suite 265TLYH1100 GraphsCompany Headquarters 3 Norhway Lane North West Coast Sales Office950 South Coast Drive, Suite 265。
B1100B中文资料
1.0A HIGH VOLTAGE SCHOTTKY BARRIER RECTIFIERFeatures• Guard Ring Die Construction for Transient Protection• Ideally Suited for Automated Assembly• Low Power Loss, High Efficiency• Surge Overload Rating to 30A Peak• For Use in Low Voltage, High Frequency Inverters, Free Wheeling, and Polarity Protection Application• High Temperature Soldering: 260°C/10 Second at Terminal • Lead Free Finish/RoHS Compliant (Note 1)Mechanical Data• Case: SMA / SMB• Case Material: Molded Plastic. UL Flammability Classification Rating 94V-0• Moisture Sensitivity: Level 1 per J-STD-020D• Terminals: Lead Free Plating (Matte Tin Finish). Solderable per MIL-STD-202, Method 208• Polarity: Cathode Band or Cathode Notch• Marking Information: See Page 2• Ordering Information: See Page 2• Weight: SMA 0.064 grams (approximate)SMB 0.093 grams (approximate)Top View Bottom ViewMaximum Ratings@T A = 25°C unless otherwise specifiedSingle phase, half wave, 60Hz, resistive or inductive load.For capacitance load, derate current by 20%.Characteristic Symbol B170/B B180/B B190/B B1100/B UnitPeak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage V RRMV RWMV R70 80 90 100 VRMS Reverse Voltage V R(RMS)49 56 63 70 V Average Rectified Output Current @ T T = 125°C I O 1.0 A Non-Repetitive Peak Forward Surge Current 8.3msSingle Half Sine-Wave Superimposed on Rated LoadI FSM30 A Thermal CharacteristicsCharacteristic Symbol B170/B B180/B B190/B B1100/B Unit Typical Thermal Resistance Junction to Terminal (Note 2) RθJT25 °C/W Operating and Storage Temperature Range T J, T STG-65 to +150 °C Electrical Characteristics@T A = 25°C unless otherwise specifiedCharacteristic Symbol Min Typ Max Unit Test ConditionForward Voltage Drop V F- - 0.790.69VI F = 1.0A, T A = 25°CI F = 1.0A, T A = 100°CLeakage Current (Note 3) I R ----0.55.0mA@ Rated V R, T A = 25°C@ Rated V R, T A = 100°CTotal Capacitance C T- - 80 pF V R = 4V, f = 1MHz Notes: 1. EU Directive 2002/95/EC (RoHS). All applicable RoHS exemptions applied, see EU Directive 2002/95/EC Annex Notes.2. Valid provided that terminals are kept at ambient temperature.3. Short duration pulse test used to minimize self-heating effect.C , T O T A L C A P A C I T A N C E (p F )T V , DC REVERSE VOLTAGE (V)Fig. 2 Total Capacitance vs. Reverse Voltage RI ,I N S T A N T A N E O U S F O R W A R D C U R R E N T (A )F V , INSTANTANEOUS FORWARD VOLTAGE (V)Fig. 1 Typical Forward Characteristics F102030400I , 00.5255075100125150IA V E R A G E F O R W A R D C U R R E N T (A )F (A V ),T , TERMINAL TEMPERATURE (C)Fig. 3 Forward Current Derating CurveT °P E A K F O R W A R D S U R G E C U R R E N T (A )F S M NUMBER OF CYCLES AT 60 HzFig. 4 Max Non-Repetitive Peak Forward Surge CurrentOrdering Information (Note 4)Part NumberCase Packaging B1x-13-F SMA 5000/Tape & Reel B1xB-13-FSMB 3000/Tape & Reel*x = Device type, e.g. B180-13-F (SMA package); B1100B-13-F (SMB package).Notes: 4. For packaging details, go to our website at /datasheets/ap02007.pdf.Marking InformationXXX = Product type marking code, ex: B170 (SMA package) XXXX = Product type marking code, ex: B190B (SMB package) = Manufacturers’ code marking YWW = Date code markingY = Last digit of year ex: 2 for 2002 WW = Week code 01 to 52Package Outline DimensionsSuggested Pad LayoutIMPORTANT NOTICEDiodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to any product herein. Diodes Incorporated does not assume any liability arising out of the application or use of any product described herein; neither does it convey any license under its patent rights, nor the rights of others. The user of products in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on our website, harmless against all damages.LIFE SUPPORTDiodes Incorporated products are not authorized for use as critical components in life support devices or systems without the expressed writtenapproval of the President of Diodes Incorporated.SMADim Min Max A 2.29 2.92 B 4.00 4.60 C 1.27 1.63 D 0.15 0.31 E 4.80 5.59 G 0.05 0.20 H 0.76 1.52 J 2.01 2.30 All Dimensions in mmSMBDim Min Max A 3.30 3.94 B 4.06 4.57 C 1.96 2.21 D 0.15 0.31 E 5.00 5.59 G 0.05 0.20 H 0.76 1.52 J 2.00 2.62 All Dimensions in mmSMADimensionsValue (in mm)Z 6.5 1.5 G 1.7X Y2.5C4.0SMBDimensionsValue (in mm)Z 6.7 G 1.8 X 2.3Y2.5 C4.3。
cc1100中文资料
单片低成本低能耗RF收发芯片应用z极低功率UHF无线收发器z315/433/868和915MHz ISM/SRD波段系统z AMR-自动仪表读数z电子消费产品z RKE-两路远程无键登录z低功率遥感勘测z住宅和建筑自动控制z无线警报和安全系统z工业监测和控制z无线传感器网络产品介绍CC1100是一种低成本真正单片的UHF收发器，为低功耗无线应用而设计。
电路主要设定为在315、433、868和915MHz的ISM（工业，科学和医学）和SRD（短距离设备）频率波段，也可以容易地设置为300-348 MHz、400-464 MHz和800-928 MHz的其他频率。
RF收发器集成了一个高度可配置的调制解调器。
这个调制解调器支持不同的调制格式，其数据传输率可达500kbps。
通过开启集成在调制解调器上的前向误差校正选项，能使性能得到提升。
CC1100为数据包处理、数据缓冲、突发数据传输、清晰信道评估、连接质量指示和电磁波激发提供广泛的硬件支持。
CC1100的主要操作参数和64位传输/接收FIFO（先进先出堆栈）可通过SPI接口控制。
在一个典型系统里，CC1150和一个微控制器及若干被动元件一起使用。
CC1100基于0.18微米CMOS晶体的Chipcon的SmartRF 04技术。
主要特性z体积小（QLP 4×4mm封装，20脚）z真正的单片UHF RF收发器z频率波段：300-348 MHz、400-464 MHz 和800-928 MHzz高灵敏度（1.2kbps下-110dBm，1％数据包误差率）z可编程控制的数据传输率，可达500kbpsz较低的电流消耗（RX中15.6mA，2.4kbps，433MHz）z可编程控制的输出功率，对所有的支持频率可达+10dBm z优秀的接收器选择性和模块化性能z极少的外部元件：芯片内频率合成器，不需要外部滤波器或RF转换z可编程控制的基带调制解调器z理想的多路操作特性z可控的数据包处理硬件z快速频率变动合成器带来的合适的频率跳跃系统z可选的带交错的前向误差校正z单独的64字节RX和TX数据FIFOz高效的SPI接口：所有的寄存器能用一个“突发”转换器控制z 数字RSSI 输出z 与遵照EN 300 220(欧洲)和FCCCFR47 Part 15 (美国)标准的系统相配 z 自动低功率RX 拉电路的电磁波激活功能z 许多强大的数字特征，使得使用廉价的微控制器就能得到高性能的RF 系统 z 集成模拟温度传感器z 自由引导的“绿色”数据包 z 对数据包导向系统的灵活支持：对同步词汇侦测的芯片支持，地址检查，灵活的数据包长度及自动CRC 处理 z 可编程信道滤波带宽 z OOK 和灵活的ASK 整型支持 z 2-FSK ，GFSK 和MSK 支持z 自动频率补偿可用来调整频率合成器到接收中间频率z 对数据的可选自动白化处理z 对现存通信协议的向后兼容的异步透明接收/传输模式的支持 z 可编程的载波感应指示器z 可编程前导质量指示器及在随机噪声下改进的针对同步词汇侦测的保护 z 支持传输前自动清理信道访问（CCA ），即载波侦听系统z 支持每个数据包连接质量指示z1 缩写词资料中用到的缩写词如下： 2-FSK 2进制频率转换按键 ADC 模数转换器 AFC 自动频率补偿 AGC 自动增益控制 AMR 自动仪表读取 ASK 振幅转换按键 BER 位误差率CCA 清理信道评估 CRC 循环冗余检查EIRP 等价等方性的辐射功率 ESR 等价串联阻抗 FEC 前向误差校正 FIFO 先进先出堆栈 FSK 频移键控GFSK 高斯整形频率转换键控 IF 中间频率LBT 发送之前侦测 LNA 低噪声放大器 LO 局部振荡器LQI 链接质量指示器MCU 微控制器单元 MSK 最小化转换按键 PA 功率放大器 PCB 印制电路板 PD 功率降低PQI 前导质量指示器 PQT 前导质量门限 RCOSC RC 振荡器 RF 电磁波频率RSSI 接收信号长度指示器 RX 接收，接收模式 SAW 接口水波 SNR 信噪比SPI 连续外围接口 TBD 待定义TX 发送，发送模式 VCO 电压控制振荡器WOR 电磁波激活，低功率拉电路 XOSC 石英晶体振荡器 XTAL 石英晶体目录1 缩写词 (2)2 工作条件 (6)3 电气规范 (6)4 常规特性 (7)5 RF接收环节 (8)6 RF传输环节 (9)7 石英晶体振荡器 (9)8 低功率RC振荡器 (10)9 频率合成器特性 (10)10 模拟温度传感器 (11)11 直流特性 (11)12 重启功率 (11)13 引脚结构 (12)14 电路描述 (13)15 应用电路 (14)16 结构配置概述 (15)17 配置软件 (16)18 4线串行配置和数据接口 (17)18.1 芯片状态位 (17)18.2 寄存器访问 (18)18.3 命令滤波 (18)18.4 FIFO访问 (18)18.5 PATABLE访问 (19)19 微控制器接口和引脚结构 (20)19.1 配置接口 (20)19.2 常规控制和状态引脚 (20)19.3 可选通信控制特性 (21)20 数据率设计 (21)21 接收信道滤波带宽 (21)22 解调器，符号同步装置和数据决定 (22)22.1 频率便宜补偿 (22)22.2 位同步 (22)22.3 字节同步 (22)23 数据包处理和硬件支持 (23)23.1 数据白化 (23)23.2 数据包格式化 (23)23.3 接收模式下的数据包滤波 (25)23.4 传输模式下的数据包处理 (25)23.5接收模式下的数据包处理 (25)24 调制格式化 (26)24.1 频率转换按键 (26)24.2 相位转换按键 (26)24.3 振幅调制 (26)25 已接收信号质量和连接质量信息 (26)25.1 前导质量门限（PQT） (26)25.2 RSSI (26)25.3 载波感应（CS） (27)25.4 清理信道访问（CCA） (27)25.5 连接质量指示(LQI) (27)26 交错前向误差校正 (27)26.1 前向误差校正（FEC） (27)26.2 交错 (28)27 通信控制 (29)27.1 开启顺序功率 (29)27.2 晶体控制 (30)27.3 电压调节控制 (30)27.4 主动模式 (30)27.5 电磁波激活(WOR) (31)27.5.1 RC振荡器和定时 (31)27.6 定时 (32)27.7 RX终止定时器 (32)28 数据FIFO (33)29 频率控制 (34)30 VCO (34)30.1 VCO和PLL自校准 (34)31 电压调节 (34)32 输出功率调节 (35)33 晶体振荡器 (36)34 天线接口 (36)35 常规用途/测试输出控制引脚 (37)36 异步和同步连续操作 (38)36.1 异步操作 (38)36.2 同步连续操作 (39)37 配置寄存器 (39)37.1配置寄存器详情－休眠状态下带保存值的寄存器 (43)37.2配置寄存器详情－休眠状态下失去控制的寄存器 (53)37.3状态寄存器详情 (54)38 安装描述（QLP20） (56)38.1 推荐安装PCB设计（QLP20） (57)38.2 安装发热特性 (57)38.3 焊接信息 (57)38.4 盘规格 (57)38.5 载波带和轴规范 (57)39 分类信息 (58)40 总体信息 (58)40.1 文件历史 (58)40.2 产品状况定义 (58)40.3 不予承诺的内容 (58)40.4 商标 (58)40.5生命支持政策 (59)41 地址信息 (60)1 绝对最大等级任何条件下都不可违反表1给出的绝对最大等级。
Wi-Fi Weather Station Gateway Operation Manual
Wi-Fi Weather Station Gateway with Temperature,Humidity andBarometric SensorOperation ManualModel:GW1100Thank you for purchasing this GW1100Wi-Fi Weather Station Gateway,with built-in temperature,humidity and barometric sensor.It can also handle all the Ecowitt sensors developed. By upgrading firmware,future sensors developed can also be hosted,and this made the gateway an extremely flexible Ecowitt ecosystem possible.To ensure the best product performance,please re ad this manual and retain it for future reference.Table of Contents1TABLE OF CONTENTS (2)2UNPACKING (3)3OVERVIEW (5)3.1W I-F I G ATEWAY (5)3.2F EATURES (6)4SET UP GUIDE (12)4.1W I-F I G ATEWAY I NTRODUCTION (12)4.1.1LED Indicators (13)4.1.2Button functions (14)5PUBLISH TO INTERNET WEATHER SERVICES (15)5.1G ATEWAY W I-F I C ONFIGURATION (16)6REGISTER WEATHER SERVICES ACCOUNT AND VIEWING DATA ON WEATHER SERVICES WEBSITE (34)7TROUBLESHOOTING GUIDE (42)8SPECIFICATIONS (49)9WARRANTY INFORMATION (51)1UnpackingOpen your weather station box and inspect that the contents are intact(nothing broken)and complete(nothing missing).Inside you should find the following:If any component is missing from the package,or broken,please contact our Customer Service department to resolve the issue.Note:The gateway must be plugged into a USB (2.0or later)port for its power supply.The USB extension cable(USB type A-Male straight tofemale straight;included)should be used so that the gateway is sitting further from AC adapters which is a heat source as well as EMI interference source.The using of this USB extension cable will make the gateway performs better in terms of radio signal reception,and measures indoor temperature,humidity more accurate.Note:You may download the online PDF version manual of this product for better reading experience:1.Go to our website:2.Go to“Support”and click“Manual&Firmware”3.Search for“GW1100”4.Download the manual2Overview2.1Wi-Fi GatewayFigure1:Wi-Fi Gateway2.2Features•Attached temperature,humidity and atmospheric pressure3-in-1probe sensor.•Collects sensor data from various supported wireless sensors.•Additional/optional sensors:•One WH32outdoor temperature andhumidity sensor•One WH40self-emptying rain gauge sensor •One WS68wireless anemometer•Up to8WH31multi-channel temperatureand humidity sensors or8WN30multi-channel temp sensors•Up to8WH51soil moisture sensors•Up to4WH41/WH43PM2.5air qualitysensors•One WH45PM2.5/PM10/CO2/temperatureand humidity all-in-1sensor•Up to4WH55Water leak sensors•One WH57Lightning sensor•Up to8WN34Temp Sensors•Up to8WN35leaf wetness sensors •Calculates dew point for outdoor sensor (cloud upload supported)•Pushes sensor data to cloud weather services:•https://•https://•https:///•https://•Custom sites using either Wunderground or Ecowitt protocol.Contact the Customer Support department for assistance.•Mobile application(WS View)•View collected live data.•Manage sensor calibration setup.•Manage sensor selection.•Data storage service on Ecowitt server: https://•Data storing resolution:●by day:5minutes average●by week:30minutes average●by month:4hours average●by year:1day average•Stores data for past three months with5-minute intervals•Stores data for past one year at30-minuteintervals•Stores data for past two year at4-hourintervalsNote:All the optional sensors supported can be found on our website:.Make sure to select the model of the unitswith the same RF frequency as yourgateway(the frequency is different forvarious countries because of regulations). Note: hosts all the sensor supported,however,it is not necessarytrue to other data hosting services.Forexample,the Wunderground only acceptsoutdoor sensor data,therefore it will notdisplay the following sensor data on theirwebsite:•Indoor temperature and humidity(from the GW1100built-in3-in-1sensor)•Multi-channel temperature and humidity (from the WH31sensor)or Multi-channel temp(from WN30sensor)•Soil moisture(from the WH51sensor)•PM2.5data(from the WH41/43sensor).•Lightning data(from the WH57sensor)•Water leakage condition(from the WH55 Sensor)•Water/Soil temp(from WN34sensor)•PM2.5/PM10/CO2/temperature and humidity data(from the WH45Sensor)•Leaf wetness sensor(from WN35sensor)To view and record all the sensors data remotely, we recommend you to use the Ecowitt server.Attention:Our product is continuously changing and improving,particularly online services and associated applications.To download the latest manual and additional help,please contact us at *******************or**********************(EU/UK).3Set up Guide3.1Wi-Fi Gateway IntroductionSee Figure2to help you identify elements of the gateway.Figure2:Gateway Introduction1.Factory Default Reset Button2.RF Status Indicator Light(Blue)3.Wi-Fi Status Indicator Light(Red)B Connector for system power supply5.Temperature,humidity and barometric3-in-1sensorTable2:Gateway parts identification3.1.1LED IndicatorsRF(Blue):Indicates the status of RF communication with the station.∙Flash(each):Indicates one packet of RF data from a sensor was received.∙Off(steady):Indicates none RF data received.Wi-Fi(Red):Indicates the status of the Wi-Fi connection.∙Off:Wi-Fi connection to router failed;∙On:GW1100was provisioned to router and has data sent to any one of the cloud data hosting successfully.∙Flash slowly:GW1100connected to WiFi router,but failed to publish data to any of the weather service on cloud.∙Flash rapidly:GW1100was in factory reset default state.It has never been configured for router and weather server.3.1.2Button functionsThe black button is used for the reset mode: Reset Mode:Hold the black button for about5seconds will reset the gateway to factory default reset state.All the history data,Wi-Fi settings, calibration and sensor labeling etc.are all lost and need to be set again.4Publish to Internet Weather ServicesThe supported services are shown in the below table.4.1Gateway Wi-Fi Configuration1.Power up device.2.Go to your computer’s or phone’s Network Settings page,find GW1100AP in Network Settings page or WLAN page.Figure3:Configure screen13.Connect the AP,but please note you may wait about60seconds to connect this device,it may pops up a prompt‘This WLAN network has no Internet access.Connect anyway?CANCEL| CONNECT’,see Figure4,choose CONNECT always.Figure4:Configure screen24.After connected to the AP successfully,you can see the networked state is connected.If needed(to prevent automatically switching to mobile network for some user’s case),the mobile network service should be turned off.Figure5:Configure screen3(show onphone)Figure6:Configure screen4(show oncomputer)5.Open your browser,type192.168.4.1in the browser address search bar and enter.Figure7:Configure screen5 6.See Figure8to login directly,do not enter password.Figure8:Configure screen67.Open Local Network page(Figure9), enter your Router SSID and Password and press“Apply”button to save the setting.To tell if your setting for router is succeeded, the IP address label will be updated with its newly assigned IP address,which usually is 192.168.2.110or alike.Make a note for this IP address and the MAC address displayed on this page for later use.So now there are two ways to open the device embed web page:Phone directly connects to GW1100AP, then the fixed IP address of(192.168.4.1) should be used.If GW1100has been configured and connected to the WiFi network,and your phone is on the same WLAN network,type in the IP address marked above can open the GW1100embed web page.Figure9:Configure screen7 8.Go to Live Data page,then you can seethe Live Data of device.On this page,youcan find which sensor is being connected currently.Figure10:Configure screen89.Other setting functions on left menu bar Weather Services:if you want upload data to the weather services,select Weather Services from the menu on the left,enter Station ID and Key,then click Save.Note:Before this step,you may go to weather services official web page to register account to obtain your device’s Station ID&Key.Calibration:If you need to calibrate the parameters,select Calibration from the menu bar on the left.Rain Initial Value:If you need to set the Rain for current year, month,week starting values,select Rain Totals from the menu bar on the left.You can edit the rain total for the current day, week,month,or year.This is useful when you start using this system instead of another one that has accumulated data,or simply if you know the values to be incorrect.Device Setting:you can select sensor type to match your sensor on hand.If the sensor you have is same as the one showed here, you should check this option so that gateway GW1100can interpretate correct rain and wind speed data from the sensor.Auto Time Zone:if you have set up your account on for your time zone,then the gateway will synchronize the time zone setting automatically with this setting turned on.If not,then you should set the time zone manually as listed below. Time zone and Date is important for rain calculation as the correct time and date is obtained.Upgrade:Automatically Upgrade FirmwareThis option is unchecked as a default setting, which means the device will not upgrade firmware by itself.If this option is enabled, then GW1100will upgrade firmware automatically(precondition:gatewayGW1100connected to your router with internet access from the network)Login&AP Password:If a password is set, then the same password will be applied for connecting the AP as well as the login password.Restore Default:it will erase all the settings for router setuo,password and calibration.Sensors ID:manage your sensors from here.Register(Learning):click Re-register to force gateway to search sensorsmanually.Disable(Stop):if device receives unwanted sensor data,you may tellGW1100to refuse receiving this sensortype permanently.Searching for Sensors with assigned ID:you can force GW1100to search for a particular sensor by a known ID:enter the sensor ID manually on ID setting page and Press “save”button will apply this function.Unit Settings：click Unit Settings from the menu bar on the left,select the units you want.5Register weather services account and viewing data on weather services websiteecowitt.ne t1.Register on 2.Under your account,add your device by itsMAC address,location and time zone setting.3.Setup your GW1100and enable to send datato this service.4.Open dashboard for your data viewing.5.If you want to share your station data withother users,you may use the Share option under the Menu to create a share link.6.You can set alert condition and when thealert is triggerred,an email will be sent to your registered mail address.DashboardGraph displayList displayWeather MapEmail AlertsWeather Underground1.Register on https://,2.Go to My Profile,click My Devices,add new device,complete the device information,and get Station ID&Key.3.Go to the Wi-Fi configuration web page(IPaddress:192.168.4.1),click Weather Services from the menu bar on the left,enter StationID&Key and save.WU Dashboard vs Live DataYou should be aware that the information presented on represents the latest as seen by WU(from the last successful upload),and may not be identical what is on your live data screen!Here is a short explanation of differences:Live Data is obtained by the mobile app by connecting directly to the gateway.This can only happen when your mobile device and gateway are connected to the same Wi-Fi network.It will then show up after you select“Device List”from the main settings menu.If your mobile device is in another network,no device(s)will show up in this list and you will not be able to select a device for displaying the“Live Data”screen. WU Dashboard shows the data obtained from WU server.This requires that your mobile device can reach the Internet and therefore this is possible even when you are not on your home Wi-Fi network,such as when using cellular data.Note:When the Wi-Fi configuration done,the WU Dashboard will be the default interface on the WS View e the Menu button can go to the Device List interface–select your device to jump to Live Data interface.Station SummaryPWS CURRENT CONDITIONSWeather HistoryGraphTable6Troubleshooting GuideLook through the following table and locate an issue or problem you are experiencing in the left column and read possible solutions in the right column.7SpecificationsNote:Out of range values will be displayed using“---”specificationFrequency:915/868/433MHz depending on location(North American:915MHz;Europe:868MHz; Other areas:433MHz)。
TLMS1000-GS08中文资料
Low Current 0603 SMD LEDDESCRIPTIONThe new 0603 LED series have been designed in the smallest SMD package. This innovative 0603 LED technology opens the way to• smaller products of higher performance• more design in flexibility• enhanced applicationsThe 0603 LED is an obvious solution for small-scale, high power products that are expected to work reliability in an arduous environment.PRODUCT GROUP AND PACKAGE DATA •Product group: LED•Package: SMD 0603•Product series: low current•Angle of half intensity: ± 80°FEATURES•Smallest SMD package 0603 with exceptional brightness1.6 mm x 0.8 mm x 0.6 mm (L x W x H)•High reliability lead frame based •Temperature range - 40°C to + 100°C •Footprint compatible to 0603 chipled •Wavelength 633 nm (red), 606 nm (orange), 587 nm (yellow)•AllnGaP technology•Compatible to IR reflow soldering•Viewing angle: extremely wide 160°•Grouping parameter: luminous intensity, wavelength•Available in 8 mm tape•Lead (Pb)-free device•Component in accordance to RoH S 2002/95/EC and WEEE 2002/96/EC•Preconditioning: acc. to JEDEC level 2 •Automotive qualified AEC-Q101APPLICATIONS•Backlight keypads•Navigation systems•Cellular phone displays•Displays for industrial control systems •Automotive features•Miniaturized color effects•Traffic displaysPARTS TABLEPART COLOR, LUMINOUS INTENSITY TLMS1000-GS08Red, I V = 4 mcd (typ.) TLMS1001-GS08Red, I V = (4.5 to 9) mcd (typ.) TLMO1000-GS08Soft orange, I V = 7.5 mcd (typ.) TLMY1000-GS08Y ellow, I V = 7.5 mcd (typ.)Note:1)T amb = 25°C, unless otherwise specified 2)Driving the LED in reverse direction is suitable for short term applicationNote:1)T amb = 25°C, unless otherwise specifiedNote:1) Tamb = 25°C, unless otherwise specifiedABSOLUTE MAXIMUM RATINGS 1) TLMS100., TLMO1000, TLMY1000PARAMETER TEST CONDITIONSYMBOLVALUE UNIT Reverse voltage 2)V R 12V DC Forward current T amb ≤ 95°C I F 15mA Surge forward current t p ≤ 10 µs I FSM 0.1A Power dissipation P V 40mW Junction temperature T j 120°C Operating temperature range T amb - 40 to + 100°C Storage temperature range T stg - 40 to + 100°C Soldering temperature acc. Vishay spec T sd 260°C Thermal resistance junction/ambientmounted on PC board (pad size > 5 mm 2)R thJA500K/WOPTICAL AND ELECTRICAL CHARACTERISTICS 1) TLMS100., REDPARAMETER TEST CONDITIONPART SYMBOLMIN.TYP.MAX.UNIT Luminous intensity I F = 2 mA TLMS1000I V 1.84mcd TLMS1001I V 4.59mcd Dominant wavelength I F = 2 mA λd 624628636nm Peak wavelength I F = 2 mA λp 640nm Angle of half intensity I F = 2 mA ϕ± 80degForward voltage I F = 2 mA V F 1.82.6V Reverse voltage I R = 10 µA V R 6V Junction capacitanceV R = 0, f = 1 MHzC j15pFOPTICAL AND ELECTRICAL CHARACTERISTICS 1) TLMO1000, SOFT ORANGEPARAMETER TEST CONDITIONSYMBOLMIN.TYP.MAX.UNIT Luminous intensity I F = 2 mA I V 3.557.5mcd Dominant wavelength I F = 2 mA λd 600605609nm Peak wavelength I F = 2 mA λp 610nm Angle of half intensity I F = 2 mA ϕ± 80deg Forward voltage I F = 2 mA V F 1.82.6V Reverse voltage I R = 10 µA V R 6V Junction capacitanceV R = 0, f = 1 MHzC j15pFNote:1)T amb = 25°C, unless otherwise specifiedNote:Wavelengths are tested at a current pulse duration of 25 ms and an accuracy of ± 1 nmNote:Luminous intensity is tested at a current pulse duration of 25 ms and an accuracy of ± 11 %.The above type numbers represent the order groups which include only a few brightness groups. Only one group will be shipped on each reel (there will be no mixing of two groups on each reel).In order to ensure availability, single brightness groups will not be orderable.In a similar manner for colors where wavelength groups are measured and binned, single wavelength groups will be shipped in any one reel.In order to ensure availability, single wavelength groups will not be orderable.OPTICAL AND ELECTRICAL CHARACTERISTICS 1) TLMY1000, YELLOWPARAMETER TEST CONDITIONSYMBOLMIN.TYP.MAX.UNIT Luminous intensity I F = 2 mA I V 3.557.5mcd Dominant wavelength I F = 2 mA λd 580588595nm Peak wavelength I F = 2 mA λp 591nm Angle of half intensity I F = 2 mA ϕ± 80deg Forward voltage I F = 2 mA V F 1.82.6V Reverse voltage I R = 10 μA V R 6V Junction capacitanceV R = 0, f = 1 MHzC j15pFCOLOR CLASSIFICATIONGROUPDOMINANT WAVELENGTH (nm)YELLOWORANGEMIN.MAX.MIN.MAX.25805836006033583586602605458658960460755895926066096592595LUMINOUS INTENSITY CLASSIFICATIONGROUP LUMINOUS INTENSITY (mcd)MIN.MAX.G1 1.80 2.24G2 2.24 2.80H1 2.80 3.55H2 3.55 4.50J1 4.50 5.60J2 5.607.10K17.109.00K29.0011.20L111.2014.00L214.0018.00TYPICAL CHARACTERISTICS T amb = 25 °C, unless otherwise specifiedFigure 1. Relative Luminous Intensity vs. Forward CurrentFigure 2. Forward Current vs. Forward Voltage Figure 3. Dominant Wavelength vs. Forward Current 0.010.11100.1110I F - For w ard C u rrent (mA)19127I - R e l a t i v e L u m i n o u s I n t e n s i t yV r el 0.111011.522.53V F - For w ard V oltage (V )19130I -F o r w a r d C u r r e n t (m A )F- 0.80.80.111019133- D o m i n a n t W a v e l e n g t h (n m )λ d I F - For w ard C u rrent (mA)Figure 4. Change of Dominant Wavelength vs.Ambient TemperatureFigure 5. Relative Luminous Intensity vs. Amb. TemperatureFigure 6. Forward Voltage vs. Ambient Temperature8- 20020*********T am b - Am b ient Temperat u re (°C)19136Δλd - C h a n g e o f D o m . W a v e l e n g t h (n m )0.81.8T am b - Am b ient Temperat u re (°C)19139I - R e l a t i v e L u m i n o u s I n t e n s i t yV r e l - 202004060801001.81.8- 20020406080100T am b - Am b ient Temperat u re (°C)19143V - F o r w a r d V o l t a g e (V )FFigure 7. Relative Luminous Intensity vs. Forward CurrentFigure 8. Forward Current vs. Forward Voltage Figure 9. Dominant Wavelength vs. Forward Current 0.010.11100.1110I F - For w ard C u rrent (mA)19128I - R e l a t i v e L u m i n o u s I n t e n s i t y V r el0.111011.522.53V F - For w ard V oltage (V )19131I - F o r w a r d C u r r e n t (m A )F19134- 0.80.80.1110- D o m i n a n t W a v e l e n g t h (n m )λ d I F- For w ard C u rrent (mA)Figure 10. Change of Dominant Wavelength vs. Ambient TemperatureFigure 11. Relative Luminous Intensity vs. Amb. TemperatureFigure 12. Forward Voltage vs. Ambient Temperature819137- C h a n g e o f D o m . W a v e l e n g t h (n m )Δλ d T am b - Am b ient Temperat u re (°C)- 2020406080100191410.8T am b - Am b ient Temperat u re (°C)I - R e l a t i v e L u m i n o u s I n t e n s i t yV r e l - 202004060801001.61.71.81.92.02.12.2T am b - Am b ient Temperat u re (°C)19144V - F o r w a r d V o l t ag e (V )F - 2020 40 60 80 100Figure 13. Relative Luminous Intensity vs. Forward CurrentFigure 14. Forward Current vs. Forward Voltage Figure 15. Dominant Wavelength vs. Forward Current 0.010.11100.1110I F - For w ard C u rrent (mA)19129I - R e l a t i v e L u m i n o u s I n t e n s i t yV r el 0.111011.522.53V F - For w ard V oltage (V )19132I - F o r w a r d C u r r e n t (m A )F19135I F -F orw ard C u rrent (mA) 0.1110- 0.80.8- D o m i n a n t W a v e l e n g t h (n m )λ d Figure 16. Change of Dominant Wavelength vs.Ambient TemperatureFigure 17. Relative Luminous Intensity vs. Amb. TemperatureFigure 18. Forward Voltage vs. Ambient Temperature19138- C h a n g e o f D o m . W a v e l e n g t h (n m )Δλd T am b - Am b ient Temperat u re (°C)191420.81.8T am b - Am b ient Temperat u re (°C)I - R e l a t i v e L u m i n o u s I n t e n s i t yV r e l - 202004060801001.81.819145V - F o r w a r d V o l t a g e (V )F T am b - Am b ient Temperat u re (°C)- 2020 40 60 80 100REEL DIMENSIONS in millimetersTAPE DIMENSIONSin millimetersPACKAGE DIMENSIONS in millimetersSOLDERING PROFILEFigure 19. Vishay Lead (Pb)-free Reflow Soldering Profile(acc. to J-STD-020C)DRY PACKINGThe reel is packed in an anti-humidity bag to protect the devices from absorbing moisture during transportation and storage.FINAL PACKINGThe sealed reel is packed into a cardboard box. A secondary cardboard box is used for shipping purposes.RECOMMENDED METHOD OF STORAGEDry box storage is recommended as soon as the aluminium bag has been opened to prevent moisture absorption. The following conditions should be observed, if dry boxes are not available:• Storage temperature 10°C to 30°C • Storage humidity ≤ 60 % RH max.After more than 1 year under these conditions moisture content will be too high for reflow soldering.In case of moisture absorption, the devices will recover to the former condition by drying under the following condition:192 h at 40°C + 5°C/- 0°C and < 5 % RH (dry air/nitrogen) or96 h at 60°C + 5°C and < 5 % RH for all device containers or24 h at 100°C + 5°C not suitable for reel or tubes.An EIA JEDEC standard JESD22-A112 level 2 label is included on all dry bags.Example of JESD22-A112 level 2 labelESD PRECAUTIONProper storage and handling procedures should be followed to prevent ESD damage to the devices especially when they are removed from the antistatic shielding bag. Electro-static sensitive devices warning labels are on the packaging.VISHAY SEMICONDUCTORS STANDARD BAR CODE LABELSThe Vishay Semiconductors standard bar code labels are printed at final packing areas. The labels are on each packing unit and contain Vishay Semiconductors specific data.17028Ozone Depleting Substances Policy StatementIt is the policy of Vishay Semiconductor GmbH to1.Meet all present and future national and international statutory requirements.2.Regularly and continuously improve the performance of our products, processes, distribution and operatingsystems with respect to their impact on the health and safety of our employees and the public, as well as their impact on the environment.It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as ozone depleting substances (ODSs).The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs and forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban on these substances.Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the use of ODSs listed in the following documents.1.Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively.2.Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the EnvironmentalProtection Agency (EPA) in the USA.3.Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively. Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain such substances.We reserve the right to make changes to improve technical designand may do so without further notice.Parameters can vary in different applications. All operating parameters must be validated for each customer application by the customer. Should the buyer use Vishay Semiconductors products for any unintended or unauthorized application, the buyer shall indemnify Vishay Semiconductors against all claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal damage, injury or deathassociated with such unintended or unauthorized use.Vishay Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, GermanyDocument Number: 91000 Revision: 18-Jul-081DisclaimerLegal Disclaimer NoticeVishayAll product specifications and data are subject to change without notice.Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product.Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed therein, which apply to these products.No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay.The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications.Product names and markings noted herein may be trademarks of their respective owners.元器件交易网。
H1100中文资料
0,25
.050 1,27
.350 8,89
.236 5,97
.004/0,10 16 Surfaces .004 MIN 0,10
.030 to .035 0,76 0,89
0° 8°
Weight . . . . . . .0.9 grams Tube . . . . . . . . . . 45/tube Tape & Reel . . . . 600/reel
-42
-37
-33
-42
-37
-33
-42
-37
-33
-42
-37
-30
-40
-40
-40
-40
-35
-30
-42
-37
-32
-42
-37
-32
-42
-37
-32
Crosstalk (dB TYP)
30MHz -45 -45 -45 -45 -35 -45 -45 -45 -35
60MHz 100MHz
5. RoHS-6: Product does not contain 5 out of the 6 banned substances specified in the RoHS directive. Some internal connections may contain lead in high-temperature solder (solder alloys containing more than 85% lead).
4. RoHS-5: Product does not contain 5 out of the 6 banned substances specified in the RoHS directive (product contains lead in applications considered solder).
MUR1100中文资料
MUR105 THRU MUR11001 Amp Super Fast Recovery Rectifier 50 to 1000 VoltsFeatures• High Surge Capability • Low Forward Voltage Drop • High Current Capability•Super Fast Switching Speed For High EfficiencyMaximum Ratings• Operating Temperature: -50°C to +150°C • Storage Temperature: -50°C to +150°CMCC Part Number Maximum Recurrent Peak Reverse Voltage Maximum RMS Voltage Maximum DC Blocking Voltage MUR105 50V 35V 50V MUR110 100V 70V 100V MUR115 150V 105V 150V MUR120 200V 140V 200V MUR140 400V 280V 400V MUR160 600V 420V 600V MUR180 800V 560V 800V MUR11001000V700V1000VElectrical Characteristics @ 25°C Unless Otherwise SpecifiedAverage Forward CurrentI F(AV) 1 A T A = 55°C Peak Forward Surge CurrentI FSM 35A 8.3ms, half sine MaximumInstantaneousForward VoltageMUR105-115MUR120-160MUR180-1100V F .975V 1.35V 1.75V I FM = 1.0A; T A = 25°C Maximum DC Reverse Current At Rated DC Blocking VoltageI R 5µA 50µA T A = 25°CT A = 150°C Maximum Reverse Recovery Time MUR105-120 MUR140-160 MUR180-1100 T rr 45ns 60ns 75nsI F =0.5A, I R =1.0A,I rr =0.25A Typical JunctionCapacita nceC J20pF Measured at 1.0MHz, V R =4.0V *Pulse Test: Pulse Width 300µsec, Duty Cycle 1%www.mccsemi .comomp onents 21201 Itasca Street Chatsworth! "# $ % ! "#Average Forward Rectified Current - Amperes versusAmbient Temperature - °CFigure 2Forward Derating Curve25175 50 75 100 125 0.25.5 .75Single Phase, Half Wave60Hz Resistive or Inductive LoadAmps°C150 1.0 1.251.5 Junction Capacitance - pF versus Reverse Voltage - Volts Instantaneous Forward Current - Amperes versus Instantaneous Forward Voltage - VoltsFigure 1Typical Forward Characteristics 4 6 20 10 Amps.5 .7 .9 1.1 1.3 1.5.01.02 .04 .06 .1 .2 .4 .6 1225°CVoltsFigure 3Junction Capacitance .1 .2 1 .4 2 10 20 40 4 100 200 12 6 10 20 100 pFVolts60 40 4 400 1000T J =25°CMUR105-115MUR120-160MUR105 thru MUR1100MUR180-1100www.mccsemi .comSet Time Base for 20/100ns/cm25Vdc1Ω50Ω10Ω Oscilloscope Note 1PulseGenerator Note 2Notes:1. Rise Time = 7ns max.Input impedance = 1 megohm, 22pF 2. Rise Time = 10ns max. Source impedance = 50 ohms 3. Resistors are non-inductiveFigu re 6Reverse Recovery Time Characteristic And Test Circuit Diagram110040 10 20 308Figure 5Peak Forward Surge Current Peak Forward Surge Current - Amperes versus Number Of Cycles At 60Hz - CyclesAmpsCycles26102060804040 50 60Figure 4Typical Reverse Characteristics Instantaneous Reverse Leakage Current - MicroAmperes versusPercent Of Rated Peak Reverse Voltage - VoltsVolts46 20 10 µAmps 20120406080 100.01 .02 .04 .06 .1 .2.4 .6 12 T A =25°C 40 60 100 140T A =100°CT A =150°C MUR105 thru MUR110www.mccsemi .com。
IBR1100 IBR1150商品说明书
INTRODUCTIONWHAT’S IN THE BOX• Ruggedized router with integrated business-class 3G/4G modem; includes integrated mounting plate• Two meter locking power and GPIO cable (direct wire)• Quick Start Guide with warranty informationNOTE: Due to the diverse needs of customers, the COR IBR1100/IBR1150 package does not include a power adapter or antennas. See the Accessories section below for several power and antenna options.KEY FEATURESWAN• Dual-modem capable with optional IBR1100/IBR1150 Dual-Modem Dock• LP6: LTE Advanced LTE/HSPA+ (SIM-based Auto-Carrier Selection for all North American and European carriers)• LPE: 4G LTE/HSPA+/EVDO (multi-carrier)• LP3: 4G LTE/HSPA+ (Europe, EMEA, and Australia/New Zealand)• WiFi as WAN¹, with WPA2 Enterprise Authentication for WiFi-as-WAN³• Failover/Failback• Load Balancing• Advanced Modem Failure Check• WAN Port Speed Control• WAN/LAN Affinity• IP Passthrough• StandbyLAN• VLAN 802.1Q• DHCP Server, Client, Relay• DNS and DNS Proxy• DynDNS• UPnP• DMZ• Multicast/Multicast Proxy• QoS (DSCP and Priority Queuing)• MAC Address FilteringWIFI1• Dual-Band Dual-Concurrent• 802.11 a/b/g/n/ac• Up to 128 connected devices (64 per radio – 2.4 GHz and 5 GHz)• Multiple SSIDs: 2 per radio (4 total)• WPA2 Enterprise (WiFi)• Hotspot/Captive Portal• SSID-based Priority• Client Mode (5 GHz only) for faster data offloadMANAGEMENT• Cradlepoint Enterprise Cloud Manager²• Web UI, API, CLI• Active GPS support on all models• Data Usage Alerts (router and per client)• Advanced Troubleshooting (support)• Device Alerts• SNMP• SMS control• Serial Redirector• Auto APN RecoveryVPN AND ROUTING• IPsec Tunnel – up to five concurrent sessions• L2TP³• GRE Tunnel• OSPF/BGP/RIP³• Route Filters (Access Control Lists, Prefix Filters, Route Maps, Communities for BGP)• Per-Interface Routing• Routing Rules• Policy-based Routing• NAT-less Routing• Virtual Server/Port Forwarding• NEMO/DMNR³• IPv6• VRRP³• STP³• NHRP³• VTI Tunnel support• OpenVPN support• CP Secure VPN compatible• Serial PAD ModeSECURITY• RADIUS and TACACS+ support*• 802.1x authentication for Ethernet• Zscaler integration³• Certificate support• ALGs• MAC Address Filtering• Advanced Security Mode (local user management only)• Per-Client Web Filtering• IP Filtering• Content Filtering (basic)• Website Filtering• Zone-Based Object Firewall with host address (IP or FQDN), port, and mac address*-Native support for authentication. Authorization and accounting support through hotspot/captive portal services. CLOUD OPTIMIZED IP COMMUNICATIONS• Automated WAN Failover/Failback support• WAN Affinity and QoS allow prioritization of VoIP services• Advanced VPN connectivity options to HQ• SIP ALG and NAT to allow VoIP and UC communications to traverse firewall• MAC Address Filtering• 802.1p/q for LAN QoS segmentation and treatment of VoIP on LAN• Private Network support (wired and 4G WAN)• Cloud-based management²1 – WiFi-related functions are only supported on IBR1100 models2 – Enterprise Cloud Manager requires a subscription3 – Requires an Extended Enterprise LicenseSPECIFICATIONSWAN:• Dual-modem capable with optional IBR1100/IBR1150 Dual-Modem Dock• Integrated LP6 Category 6 LTE Advanced LTE modem (with DC-HSPA+ failover) or LPE 4G LTE modem (with HSPA+/ EVDO/3G and 2G failover) or LP3 4G LTE modem (with HSPA+ and 2G failover)• Three LAN/WAN switchable 10/100 Ethernet ports – one default WAN (cable/DSL/T1/satellite/Metro Ethernet)• WiFi as WAN, Metro WiFi; 2x2 MIMO “N” 2.4 GHz or 5 GHz; 802.11 a/b/g/n/ac (IBR1100 only)LAN:• Dual-band dual-concurrent WiFi; 802.11 a/b/g/n/ac (IBR1100 only)• Three LAN/WAN switchable 10/100 Ethernet ports – two default LAN• Serial console support for out-of-band management of a connected devicePORTS:• Power• 2-wire GPIO• Add three more GPIO ports with optional Serial-to-GPIO cable (see Accessories section below)• USB 2.0• Three Ethernet LAN/WAN• Two cellular antenna connectors (SMA)• One active GPS antenna connector (SMA)• Two WiFi antenna connectors (R-SMA)• Serial DE-9 (commonly called “DB-9”) connector – RS-232 (out-of-band management of an external device requires a null modem adapter/cable)TEMPERATURE:• All models: −30 °C to 70 °C (−22 °F to 158 °F) ambient air operating• All models: −40 °C to 85 °C (−40 °F to 185 °F) storage• Includes temperature sensor with options for alerts and automatic shutoffHUMIDITY (non-condensing):• 5% to 95% operating• 5% to 95% storagePOWER:• DC input steady state voltage range: 9–36 VDC (requires inline fuse for vehicle installations)• For 9–24 VDC installations, use a 3 A fuse• For > 24 VDC installations, use a 2.5 A fuse• Reverse polarity and transient voltage protection per ISO 7637-2• Ignition sensing (automatic ON and time-delay OFF)• Power consumption:• Idle: typical=400mA@12VDC (4.8W); worst case=800mA@12VDC (9.6W)4• Tx/Rx: typical=650mA@12VDC (7.8W); worst case=1300mA@12VDC (15.6W)• 12VDC 2A adapter recommendedWIFI POWER:• 2.4 GHz band: 17 dBm conducted• 5 GHz band: 15 dBm conductedSIZE: 5.3 x 4.4 x 1.4 in (134 x 112 x 35 mm)WEIGHT: 16.1 oz (457 g)CERTIFICATIONS:• FCC, CE, IC• WiFi Alliance (IBR1100 only) – 802.11a/b/g/n certified, 802.11ac supported• Safety: UL/CUL, CB Scheme, EN60950-1• Hazardous Locations: Class I, Div. 2• Shock/Vibration/Humidity: compliant with MIL STD 810G and SAEJ1455• Ingress Protection: compliant with IP64 (includes protection from dust and splashing water)• Materials: WEEE, RoHS, RoHS-2, California Prop 65• Vehicle: E-Mark, compliant with ISO 7637-2• Telecom: PTCRB/CTIA, GCF-CCGPS• GPS Protocols: TAIP and NMEA 0183 V3.0• Satellite channels: Maximum 30 channels (16 GPS, 14 GLONASS), simultaneous tracking• Concurrent standalone GPS, GLONASS, BeiDou and Galileo (LP6 models only)• 1 Hz refresh rate• Accuracy:• < 2m: 50%• < 5m: 90%• Horizontal: < 2m (50%); < 5m (90%)• Altitude: < 4m (50%); < 8m (90%)• Velocity: < 0.2 m/s• Acquisition (measured with signal strength = -135dBm):• Hot start: 1 second• Warm start: 29 seconds• Cold start: 32 seconds• Sensitivity• Tracking: −160 dBm (tracking sensitivity is the lowest GNSS signal level for which the device can still detect an in-view satellite 50% of the time when in sequential tracking mode)• Acquisition (standalone): −145 dBm (acquisition sensitivity is the lowest GNSS signal level for which the device can still detect an in-view satellite 50% of the time)• Operational limits: altitude < 6000 m or velocity < 100 m/s (either limit may be exceeded, but not both) ACCESSORIESBecause of the diversity of customer needs, the COR IBR1100/IBR1150 does NOT include a power adapter or antennasin the box (it does include a direct wire power/GPIO cable for vehicle installation). Cradlepoint offers several accessory options for dual-modem capability, power and antennas:DUAL-MODEM DOCKIBR1100/IBR1150 Dual-Modem Dock (Part # 170675-000), FirstNet/Band 14 ready integrated 4G LTE modem:• MC400L2 (FirstNet/Band 14 LTE modem)5||• MC400LP6 (North America, Europe)• MC400LP4 (AT&T, Verizon, T-Mobile and Canada)• MC400LPE-VZ (Verizon)• MC400LPE-AT (AT&T)• MC400LPE-SP (Sprint)• MC400LPE-GN (generic – for use on T-Mobile in the U.S. and Rogers, Bell, & TELUS in Canada)• MC400LP3-EU (Europe)POWERWall options• COR IBR1100/IBR1150 extended temperature (−30 °C to 70 °C) 12VDC 2A locking power adapter – requires separate line cord (Part # 170648-000)• Line cord for North America (Part # 170623-001)• Line cord for EU (Part # 170623-002)• Line cord for UK (Part # 170623-003)• COR 12VDC 2A locking power adapter with 0 °C to 40 °C temperature range – includes US, EU, and UK plugs (Part # 170584-002)NOTE:Cradlepoint primarily recommends the extended temperature adapter because it covers the COR IBR1100/IBR1150 full temperature range of −30 °C to 70 °C. Cost-sensitive customers that intend to use the IBR1100/IBR1150 in temperature-controlled office environments can order the 170584-002 adapter, but it limits the operating temperature range to 0 °C to 40 °C.Vehicle options• Vehicle locking power adapter for COR (Part # 170635-000)• Two meter locking power and GPIO cable (direct wire) for replacement – included by default (Part # 170585-000) Adapters• Barrel to 4-pin power adapter (Part # 170665-000)• Serial-to-GPIO cable (Part # 170676-000)ANTENNAS – 3G/4G Modem, WiFi, & GPS• 700 MHz – 2700 MHz Wide Band Directional Antenna (Yagi/Log- Periodic) Part #: 170588-000• 12” Mag-Mount Antenna with SMA Male Connector Part #: 170605-000• 4” Mini Mag-Mount Antenna with SMA Male Connector Part #: 170606-000• 2.4/5 GHz Dual-band Dual-concurrent WiFi Antenna Part #: 170628-000 (WiFi models only)• Universal 3G/4G/LTE Modem Antenna Part #: 170649-000• GPS Screw-Mount Antenna Part #: 170651-000• GPS Mag-Mount Antenna Part #: 170652-000• Multi-Band Omni-Directional Antenna Part #: 170668-000• Indoor/Outdoor Panel Patch Part #: 170669-000Vehicle Antennas• 3-in-1 GPS & Modem Screw-Mount Part #: 170653-000• 3-in-1 Adhesive-Mount Antenna Part #: 170653-001• 5-in-1 GPS, Modem & WiFi Screw-mount Part #: 170654-000• Low Profile 5-in-1 MIMO LTE, MIMO WiFi (2.4/5Ghz), & GPS Screw Mount Antenna with 5M Cables Part #: 170654-001See the Cradlepoint antenna accessories page for more information about antennas. Also see the Antenna Orderingand Installation Guide, available as a PDF in the Resources section of antenna and router product pages.6BUSINESS-GRADE MODEM SPECIFICATIONSCOR IBR1100/IBR1150 LP6 models include an integrated LTE Advanced Category 6 4G LTE modem. The LP6 modems support SIM-Based Auto-Carrier selection so there is only one model for all of North America. Simply insert the SIMand wait for the router to automatically detect the SIM and establish a connection.The LTE bands certified for each carrier are listed below.COR IBR1100LP6-NA, COR IBR1150LP6-NA, COR IBR1100LP6-EU• Technology: LTE Advanced, DC-HSPA+• Downlink Rates: LTE 300 Mbps, DC-HSPA+ 42.2 Mbps• Uplink Rates: LTE 50 Mbps, DC-HSPA+ 5.76 Mbps• Frequency Bands:• LTE Bands 1-5, 7, 8, 12, 13, 17, 20, 25, 26, 29, 30, 41• Verizon: 2, 4, 5, 13 (XLTE support w/carrier aggregation)• AT&T: 2, 4, 5, 12/17, 29, 30• Sprint: 25, 26, 41 (LTE Plus Support)• T-Mobile: 2, 4, 12 (T-Mobile Wideband LTE Support)• Carrier Aggregation:• 1+ 8• 2+ 2/5/12 (17 w/MFBI)/13/29• 3+ 7/20• 4+ 4/5/12 (17 w/MFBI)/13/29• 5+ 2/4/30• 7+ 3/7/20• 8+ 1• 12 (17 w/MFBI) + 2/4/30• 13+ 2/4• 20+ 3/7• 30+ 5/12 (17 w/MFBI)• 41+ 41• Fallback: WCDMA/DC-HSPA+ (42/5.76 Mbps): Bands 1, 2, 3, 4, 5, 8• Power: LTE 23 dBm +/− 1, DC-HSPA+ 23 dBm +/− 1• Antennas: two SMA male (plug), finger tighten only (maximum torque spec is 7 kgfcm)• GPS: active GPS support• SMS: SMS support• Industry Standards & Certs: CE, FCC, GCF-CC, IC, PTCRB, AT&T, Sprint, VerizonCOR IBR1100/IBR1150 LPE models include an integrated 4G LTE modem – specific model names include a specific modem (e.g., the COR IBR1100LPE-VZ includes a Verizon LTE modem).Please note that LPE models are flexible and support bands for multiple cellular providers; however, only thefrequency bands in bold below are supported by the listed provider.COR IBR1100LPE-VZ, COR IBR1150LPE-VZ – 4G LTE/HSPA+/EVDO for Verizon• Technology: LTE, HSPA+, EVDO Rev A• Downlink Rates: LTE 100 Mbps, HSPA+ 21.1 Mbps, EVDO 3.1 Mbps (theoretical)• Uplink Rates: LTE 50 Mbps, HSPA+ 5.76 Mbps, EVDO 1.8 Mbps (theoretical)• Frequency Bands:• LTE Band 2 (1900 MHz), Band 4 – AWS (1700/2100 MHz), Band 5 (850 MHz), Band 13 (700 MHz), Band 17 (700 MHz), Band 25 (1900 MHz)• HSPA+/UMTS (850/900/1900/2100 MHz, AWS)• GSM/GPRS/EDGE (850/900/1800/1900 MHz)• CDMA EVDO Rev A/1xRTT (800/1900 MHz)• Power: LTE 23 dBm +/− 1, HSPA+ 23 dBm +/− 1, EVDO 24 dBm +0.5/−1 (typical conducted)7||• Antennas: two SMA male (plug), finger tighten only (maximum torque spec is 7 kgfcm)• GPS: active GPS support• Industry Standards & Certs: FCC, VerizonCOR IBR1100LPE-AT, COR IBR1150LPE-AT – 4G LTE/HSPA+/EVDO for AT&T• Technology: LTE, HSPA+, EVDO Rev A• Downlink Rates: LTE 100 Mbps, HSPA+ 21.1 Mbps, EVDO 3.1 Mbps (theoretical)• Uplink Rates: LTE 50 Mbps, HSPA+ 5.76 Mbps, EVDO 1.8 Mbps (theoretical)• Frequency Bands:• LTE Band 2 (1900 MHz), Band 4 – AWS (1700/2100 MHz), Band 5 (850 MHz), Band 13 (700 MHz), Band 17 (700 MHz), Band 25 (1900 MHz)• HSPA+/UMTS (850/900/1900/2100 MHz, AWS)• GSM/GPRS/EDGE (850/900/1800/1900 MHz)• CDMA EVDO Rev A/1xRTT (800/1900 MHz)• Power: LTE 23 dBm +/− 1, HSPA+ 23 dBm +/− 1, EVDO 24 dBm +0.5/−1 (typical conducted)• Antennas: two SMA male (plug), finger tighten only (maximum torque spec is 7 kgfcm)• GPS: active GPS support• Industry Standards & Certs: PTCRB, FCC, IC, AT&TCOR IBR1100LPE-SP, COR IBR1150LPE-SP – 4G LTE/HSPA+/EVDO for Sprint• Technology: LTE, HSPA+, EVDO Rev A• Downlink Rates: LTE 100 Mbps, HSPA+ 21.1 Mbps, EVDO 3.1 Mbps (theoretical)• Uplink Rates: LTE 50 Mbps, HSPA+ 5.76 Mbps, EVDO 1.8 Mbps (theoretical)• Frequency Bands:• LTE Band 2 (1900 MHz), Band 4 – AWS (1700/2100 MHz), Band 5 (850 MHz), Band 13 (700 MHz), Band 17 (700 MHz), Band 25 (1900 MHz)• HSPA+/UMTS (850/900/1900/2100 MHz, AWS)• GSM/GPRS/EDGE (850/900/1800/1900 MHz)• CDMA EVDO Rev A/1xRTT (800/1900 MHz)• Power: LTE 23 dBm +/− 1, HSPA+ 23 dBm +/− 1, EVDO 24 dBm +0.5/−1 (typical conducted)• Antennas: two SMA male (plug), finger tighten only (maximum torque spec is 7 kgfcm)• GPS: active GPS support• Industry Standards & Certs: FCC, SprintCOR IBR1100LP3-EU, COR IBR1150LP3-EU – 4G LTE/HSPA+ for Europe• Technology: LTE, HSPA+• Downlink Rates: LTE 100 Mbps, HSPA+ 21.1 Mbps (theoretical)• Uplink Rates: LTE 50 Mbps, HSPA+ 5.76 Mbps (theoretical)• Frequency Bands:• LTE Band 1 (2100 MHz), Band 3 (1800 MHz), Band 7 (2600 MHz), Band 8 (900 MHz), Band 20 (800 MHz)• HSPA+/UMTS (800/850/900/1900/2100 MHz)• GSM/GPRS/EDGE Quad-Band (850/900/1800/1900 MHz)• Power: LTE Band 1/3/8/20 – 23 dBm +/− 1; LTE Band 7 – 22 dBm +/− 1, HSPA+ 23 dBm +/− 1 (typical conducted)• Antennas: two SMA male (plug), finger tighten only (maximum torque spec is 7 kgfcm)• GPS: active GPS support• Industry Standards & Certs: CE, GCF-CCCOR IBR1100LPE-GN, COR IBR1150LPE-GN – 4G LTE/HSPA+/EVDO (generic – for use on T-Mobile and U.S. Cellular inthe U.S. and Rogers, Bell, & TELUS in Canada)• Technology: LTE, HSPA+, EVDO Rev A• Downlink Rates: LTE 100 Mbps, HSPA+ 21.1 Mbps, EVDO 3.1 Mbps (theoretical)• Uplink Rates: LTE 50 Mbps, HSPA+ 5.76 Mbps, EVDO 1.8 Mbps (theoretical)• Frequency Bands:• LTE Band 2 (1900 MHz), Band 4 (AWS), Band 5 (850 MHz), Band 13 (700 MHz), Band 17 (700 MHz), Band 25 (1900 MHz)8• HSPA+/UMTS (850/900/1900/2100 MHz, AWS)• GSM/GPRS/EDGE (850/900/1800/1900 MHz)• CDMA EVDO Rev A/1xRTT (800/1900 MHz)•Power: LTE 23 dBm +/− 1, HSPA+ 23 dBm +/− 1, EVDO 24 dBm +0.5/−1 (typical conducted)•Antennas: two SMA male (plug), finger tighten only (maximum torque spec is 7 kgfcm)•GPS: active GPS support • Industry Standards & Certs: PTCRB, FCC, ICHARDWARE 3G/4G AntennaConnector (SMA)RS-232 Port (female)3G/4G Antenna Connector(SMA)Reset ButtonGPS Connector (SMA)WiFi Antenna Connector* (Reverse SMA)USB 2.0 Port 10/100 Ethernet Port (Configurable: LAN or WAN Default: WAN10/100 Ethernet Ports (Configurable: LAN or WANDefault: LAN)Power Port WiFi Antenna Connector* (Reverse SMA)* - only on IBR1100POWER The Cradlepoint IBR1100/IBR1150 must be powered using an approved 9-36 VDC power source.• Blue = Powered ON.• No Light = Not receiving power. Check the power switch and the power source connection.• Flashing Amber = Attention. Open the administration pages and check the router status.2.4GHz 5GHz WiFi BROADCAST These two LEDs indicate activity on the WiFi broadcast for both the 2.4 GHz and 5 GHz bands.• 2.4GHz (green) = 2.4 GHz WiFi is on and operating normally.• 5GHz (blue) = 5 GHz WiFi is on and operating normally.EXTERNAL USB MODEM Indicates the status of external USB modem.Both internal and external USB modems have the following LED indicators:• Green = Modem has established an active connection.• Blinking Green = Modem is connecting.• Amber = Modem is not active.• Blinking Amber = Data connection error. No modem connection possible.• Blinking Red = Modem is in the process of resetting.INTEGRATED MODEM Indicates information about the integrated modem.• Green = Connected to integrated modem.SIGNAL STRENGTH Blue LED bars indicate the active modem’s signal strength.• 4 Solid Bars = Strongest signal.• 1 Blinking Bar = Weakest signal. (A blinking bar indicates half of a bar.)ADDITIONAL LED INDICATIONS• Several different LEDs flash when the factory reset button is detected.• Two of the modem LEDs blink red in unison for 10 seconds when there is an error during firmware upgrade.SUPPORT AND WARRANTYCradleCare Support available in the US and Canada with technical support, software upgrades, and advanced hardware exchange – 1-, 3-, and 5-year options.Three-year limited hardware warranty available world-wide on IBR1100/IBR1150 series products when purchased from an approved Cradlepoint Partner or Distributor – extend warranty to 5 years.。
MIKROE-1100 mikroProg 快速USB编程器与硬件调试器支持说明书
MIKROE-1100mikroProg™ is a fast USB programmer with hardware debugger support. Smart engineering allows mikroProg™ to support all STM32® ARM® Cortex™-M3 and Cortex™-M4 microcontrollers in a single programmer.for STM32®™mikroProgNebojsa MaticGeneral ManagerThe STM32®, ARM® and Windows® logos and product names are trademarks of STMicroelectronics®, ARM® Holdings and Microsoft® in the U.S.A. and other countries.Introduction to mikroProg™ 4 Key features 5 1. D river installation 6step 1 – Start installation 7 step 2 – Accept EULA 7 step 3 – Installing the drivers 8 step 4 – Finish installation 82. Connecting to a PC 93. mikroProg Suite™ for ARM® software 104. Connecting with a target device 125. Connector Pinout 136. mikroProg™ to 20-pin JTAG connector 147. Connection schematics examples 1664-pin STM32® schematic 17 100-pin STM32® schematic 18 144-pin STM32® schematic 20 176-pin STM32® schematic 21Table of ContentsIntroduction to mikroProg™mikroProg™ for STM32® is a fast programmer and hardware debugger. Smart engineering allows mikroProg™ to support all STM32® ARM® Cortex™-M3 and Cortex™-M4 devices in a single programmer! Outstanding performance, easy operation, elegant design and low price are it’s top features. It is supported in mikroElektronika, as well as in other ARM® compilers.01 02 03 04 05 06Flat cableUSB MINIB connectorDATA transfer indication LEDACTIVE indication LEDLINK indication LEDPOWER indication LED060504030102- Hardware Debugging- No need for firmware update- N ew microcontrollers supported via latest version of mikroProg Suite™for ARM® softwareWhat you seeMake sure to disconnectmikroProg™ before installing drivers. NOTE:drivers, please extract thesetup file from the ZIParchive. You should be ableto locate the driver setupfile. Double click the setupfile to begin installation ofthe programmer drivers.step 2 – Accept EULA step 1 – Start installation01In welcome screen click the Next> button0203Click Change button to select new destination folder or use the suggested installation pathClick the Next> button010302step 3 – Installing the drivers step 4 – Finish installation040504Drivers are installed automatically05Click the Finish button to end installation process2. Connecting to a PCAfter driver installation is complete, you can connect the programmer with your PC using USB cable provided with the package. Green POWER LED should turn ON, indicating the presence of power supply. Amber-colored LINK LED will turn ON when link between mikroProg™ for STM32® and PC is established. Link can be established only when correct drivers are installed on your PC.Figure 3-1:mikroProg Suite ™ for ARM®window01 0402050306Start InstallationChoose destination folderAccept EULA and continueInstallation in progressInstall for All users or Current userFinish installationSoftware installation wizard4. Connecting with a target deviceFigure 4-1:IDC10 JTAGconnectorFor connection with a target device mikroProg™ uses IDC10 JTAG connector, as shown on Figure 4-1. In order to make proper connection with the target board it is necessary to pay attention to IDC10 connector pinout. Every pin has a different purpose and for easy orientation IDC10 connector is marked with a little knob and incision between pins number 9 and 7, Figure 5-1.Figure 5-1: Female connector pinout10080604020103050709VCC-3.3V - Power supplyGND - GroundGND - GroundTRST - JTAG resetGND - Ground020*******TMS/SWDIO - JTAG Mode Select/SWD data I/OTCK/SWCLK - JTAG Clock/SWD clockTDO - JTAG Data outputTDI - JTAG Data input#RESET - System ResetIn order to connect mikroProg to 20-pin male JTAG connector it is necessary to use appropriate adapter, such as the mikroProg ™ to ST-LINK V2 adaper , Figure 6-1. This adapter should be first placed on 2x10 male connector. Then you should plug in the mikroProg ™ into 2x5 male header, Figure 6-2.Figure 6-2:ConnectingmikroProg™programmerFigure 6-1:mikroProg™to ST-LINK V2adaperFigure 6-3: mikroProg™ to ST-Link V2 adapter connection schematics7. Connection schematics examplesFollowing examples demonstrate connections with some of the most popular supported microcontrollers. Each one is carefully selected as a representative of the entire family. All MCUs use TMS, TCK, TDO, TDI, TRST, #RESET lines for JTAG programming or SWDIO, SWCLK for SWD (Serial Wire Debug) programming. These lines are located on same microcontroller pins within a family.64-p i n S T M 32® s c h e m a t i Figure 7-1: Connection schematics for 64-pin STM32F10x/STM32L15x MCU via 2x5 male header10032Figure 7-2: Connection schematics for 100-pin STM32F10x/ STM32L15x MCU via 2x5 male header100-p i n S T M 32® s c h e m a t i cFigure 7-3: Connection schematics for 100-pin STM32F20x/STM32F40x MCU via 2x5 male header14432Figure 7-4: Connection schematics for 144-pin STM32F20x/STM32F40x MCU via 2x5 male header176-p i n S T M 32® s c h e m a t i cFigure 7-5: Connection schematics for 176-pin STM32F20x/STM32F40x MCU via 2x5 male headermikroProg for STM32 Manual ver. 1.000100000019504If you want to learn more about our products, please visit our website at If you are experiencing some problems with any of our products or just need additionalinformation, please place your ticket at /esupportIf you have any questions, comments or business proposals,do not hesitate to contact us at *****************MIKROE-1100。
OptiX Metro1100特点简介
OptiX Metro1100特点简介OptiX Metro1100特点1. 盒式结构OptiX Metro1100系统的结构采用ETSI19英寸标准盒式设计。
可方便地在多种环境下进行安装维护，用户可以方便地根据需要进行选配。
推荐安装使用的C系列集成机柜，可集成OptiX Metro1100设备、DDF（数字配线架）、ODF（光配线架）、配电柜的功能于一体，大大减少了对机房环境的要求。
2. 多种业务的接入OptiX Metro1100系统可以接入符合ITU-T G.957建议的STM-1/STM-4/STM-16 速率等级的SDH 光信号，还可以接入2Mbit/s PDH业务、10M/100M/1000M 以太网等数据业务。
3. 强大的交叉连接能力OptiX Metro1100具备88×88 VC-4 高阶交叉与1764×1764 VC-12低阶交叉的能力。
OptiX Metro1100的交叉连接支持线路与线路、线路与支路、支路与支路之间的交叉调配能力，VC-12 或VC-3、VC-4 业务可被容易地调配至线路、支路等各个方向。
4. 灵活的组网能力OptiX Metro1100基于强大的交叉功能、多ADM 集成和兼容性的设计思想，保证了设备具有灵活的组网能力。
可组成点对点、线形、树形、环形、网孔形网络，可支持两环相切、多环相交、环带链等各种复杂网络拓扑。
面对日益复杂的传输网络的需求，OptiX Metro1100配合其他OptiX 系列传输设备为用户提供经济合理的一体化传输网络解决方案，并可为未来的网络发展提供极大的再规划空间。
5. 完善的保护机制设备对交叉单元、时钟单元提供1＋1热备份保护，提高了系统的可靠性。
6. 兼容设计和平滑的扩容能力OptiX Metro1100 系统采用STM-1/STM-4/STM-16 级别全兼容设计的思想。
对设备进行STM-1/STM-4 到STM-16 或者STM-1到STM-4的升级时，可通过直接增加或更换线路接口单元完成。
Atmel 8580B TPM 电源解译应用指南说明书
Atmel-8580B-TPM-Power-Supply-Decoupling-ApplicationNote_042014APPLICATION NOTE Atmel TPM Power Supply Decoupling GuideAT97SC32041 OverviewThe following guidelines are consistent with industry-standard decoupling recommendations for all active system components. Effective decoupling of the power supply inputs to the Atmel ® Trusted Platform Module (TPM) is critical to assuring reliable component performance in a high-density printed circuit board environment. The TPM is a complex system-on-a-chip integrated circuit design containing an internal microprocessor, EEPROM, ROM, and SRAM memories, digital logic, and analog components. The TPM executes firmware operationsindependently of the external system, as well as, executing command operations received over thecommunications bus. As a result, the TPM is subjected to a wide range of frequencies. These signals must be decoupled from the TPM power supply pins to assure consistently reliable operation over the lifetime of the system.Table 1. TPM Power Supply Pins2Atmel TPM Decoupling Recommendations 2.1 Decouple the V CC PinsEffective decoupling of the V CC inputs to the Atmel TPM is critical to assure consistently reliable operation over the lifetime of the system. The Atmel recommendation for a decoupling bypass capacitor within the range of 2200pF to 4700pF is to be placed as close as possible, < 5mm, to each of the V CC pins, located between each V CC pin and the immediately adjacent GND pin. A 0.1μF decoupling bypass capacitor should be placed at the node in which these V CC traces join, which should be as close as possible, < 10mm, to the TPM. In all cases, this bypass capacitor should be closer than the next closest component. All capacitors should be of high quality, with dielectric ratings of X5R or X7R. A low-power state is automatically entered when the chip is idle. No further action is required by the system to enter low-power mode.No other component should be placed closer to the TPM V CC pin than the low frequency decoupling capacitor. Each component should be properly decoupled from the power supply signal to prevent injection of noise onto the power plane. All capacitors should have a high quality dielectric rating of X5R or X7R, depending on the system temperature requirements.2.2 Decouple the SBV3 PinIn order to decouple the SB3V pin, it is recommended that a decoupling capacitor, no smaller than 2200pF and no larger than 4700pF, be placed as near as possible to the SB3V pin, located between the SB3V pin and the immediately adjacent GND pin in order to address high frequency noise. The placement should be less than 5mm from the SB3V pin; although, best performance is achieved when the capacitor is placed directly next to the chip leads. Chip capacitors of size 0402 will fit well between board traces for the 28-pin TSSOP.A second 0.1µF decoupling bypass capacitor should be placed between the SB3V pin and the Supply rail, whichshould be as close as possible (< 10mm) to the TPM. This capacitor will address lower frequency supply noise.No other component should be placed closer to the TPM SB3V pin than the low frequency decouplingcapacitor. Each component should be properly decoupled from the power supply signal to preventinjection of noise onto the power plane. Both capacitors should have a high quality dielectric rating ofX5R or X7R, depending on the system temperature requirements.2.3 Decoupling DiagramsThe below figures illustrate power and ground pins only.Figure 2-1. 28-pin TSSOP3TPM Power Supply Decoupling Guide [APPLICATION NOTE]2Atmel-8580B-TPM-Power-Supply-Decoupling-ApplicationNote_042014。
MIK1100系列单回路数字显示控制仪简易型傻瓜式操作0
LR1100系列单回路数字显示控制仪(简易型)，傻瓜式操作,0.3级测量精度,7款外型尺寸,双四位LED显示，可支持热电偶、热电阻、电压(可开方运算)、电流(可开方运算)及变送器输入,适用温度、压力、流量、液位、湿度等工业过程量的监测。
支持2路报警功能，支持1路变送输出或支持采用标准MODBUS协议的RS485通讯接口，1路DC24V馈电输出，输入端、输出端、电源端光电隔离，100-240V AC/DC或20-29V DC开关电源供电，标准卡入式安装，工作环境温度在0-50℃，且相对湿度5-85%RH无凝结。
1 显示面板外观结构图(1) PV显示窗(测量值)(2) SV显示窗测量状态下显示输入类型等参数参数设定状态下显示设定值(3) 第一报警(AL1)、第二报警(AL2)指示灯、运行灯（RUN）和输出灯（OUT）(4) 确认键(5) 移位键(6) 减少键(7) 增加键从外壳中取出表芯的方法仪表的表芯可以从表壳中拔出，其方法是装仪表前面板两侧的锁扣向外侧拨开，然后抓住仪表的前面板向外拔，即可使表芯与表壳分离。
在回装时，将表芯插入表壳后一定要推紧，并将锁扣锁紧，以保证防护标准。
2 选型表备注:1路继电器(带有常开常闭触点) 触点容量：AC220V/3A 、DC30V/5A (阻性负载) 2路继电器(仅一组常开触点) 触点容量：AC220V/3A 、DC30V/5A (阻性负载) 规格尺寸为H 的仪表，继电器触点容量：AC220V/0.6A 、DC30V/0.6A(阻性负载) 分度号表15 热电阻BA1 BA1 -200.0～600℃55 全切换16 热电阻BA2 BA2 -200.0～600℃56 特殊规格17 0～500Ω线性电阻R0.5K 0～500Ω线性电阻3 接线注：上述接线图中在同一组端子标有不同功能的,只能选择其中一种功能。
如RS485通讯功能和变送输出功能在同一组OUT接线端子上，只能选择一种。
HSDL-1100资料
General Application Guide for the HSDL-1100 4 Mb/s Infrared TransceiverApplication Note 1112HSDL-1100 Performance CapabilityDesigned to Meet the IrDA Physical Layer Specification version 1.1•Performance is guaranteed at the 1.152 Mb/s and 4.0 Mb/sdata rates. The HSDL-1100 isalso backward compatible to2.4-115.2 kb/s data rates asrequired by the IrDA specifica-tion.•Errorless 4 Mb/s performance at link distances of 1.3-1.95meters has been verified usingthe HSDL-1100 and I/O chipssuch as the National Semicon-ductor PC87108, the VLSIVL82C147, and the SMCFDC37C957.•Nose-to-Nose (0-5 cm) error-less performance has also beenverified for an Ir link using theHSDL-1100 and I/O chips.•Sharp ASK/DASK errorless performance on the Rxd-Bchannel has been verified at38.4 kb/s using the NationalSemiconductor PC87108. Linkdistance exceeded 2 metersfor typical HSDL-1100 units.•As with the HSDL-1000, the one-piece package of theHSDL-1100 allows the Irsystem designer to easily meetall IrDA viewing anglespecifications.•Switching between IrDA datarates is effortless as data isalways present at one of tworeceiver outputs RxdA andRxdB. Rxd-A provides 2.4-115.2 kb/s data, and Rxd-Bprovides 0.5-4 Mb/s data.Capable of Receiving and Trans-mitting Sharp ASK/DASK and TVRemoteFigure 1. HSDL-1100 Application Diagram.•The Rxd-B receiver channelhas been verified to correctlyreceive Sharp ASK/DASK500 kHz carrier for data ratesof 9.6 kb/s, 19.2 kb/s, and38.4 kb/s. The NationalSemiconductor PC87108 hasASK/DASK capability on bothreceive pins IRRX1 and IRRX2.•The Rxd-A receiver channel isproven capable of receivingRXD-ARXD-BVTV Remote signals correctly.However, the sensitivity willallow only 2-3 meters oftransmit to receive distanceunless the transmit power ofthe remote signal is>100 mW/sr.•The HSDL-1100 transmitter is capable of correct Sharp ASK/DASK and TV Remote datatransmission at IrDA levels fortransmitted intensity (mW/sr). HSDL-1100 Functional DescriptionTransmitterThe transmitter uses a high speed, high efficiency TS AlGaAs LED to produce an Ir signal of intensity and speed required by IrDA. The LED drive transistor is Schottky clamped to aid in meeting the IrDA optical rise time, and pulse width specifications. The external components CX2 and R1 are recommended to obtain current peaking, which creates faster optical pulse edges. Fast optical edges will help the link meet the required IrDA power budget.LED current is set by selection of RLED. See the Transmitter Drive Requirements section.ReceiverThe receiver consists of two channels, Rxd-A (2.4-115.2 kb/s) and Rxd-B (0.5-4 Mb/s). Both channels use the same detector and pre-amplifier stage. Both channels use CX1, CX5, CX6, and R3 to filter out power supply noise.The Rxd-B channel uses anadaptive threshold circuit tominimize pulse width distortion(PWD) over the IrDA requireddynamic range. The Rxd-Bchannel also uses a squelch circuitto eliminate noise bits on Rxdwhen no Ir signal is present. Theadaptive threshold circuit makesuse of CX3 and CX4.In general, 2.4-115.2 kb/s Ir signalscreate output pulses on Rxd-A, and0.5-4 Mb/s Ir signals create outputpulses on Rxd-B. However, Irsignals in the 10 kHz - 1 MHz rangemay appear on both Rxd-A andRxd-B, depending on the Ir signalstrength. The presense of signal atboth Rxd-A and Rxd-B should notbe a problem for any properlydesigned I/O chip. The I/O chipshould be designed to look at onlyone channel at a time, dependingupon which data mode has beenselected by the software.Dynamic RangeThe dynamic range required byIrDA for a 1 meter link is 4 µW/cm2500 mW/cm2 for 2.4-115.2 kb/s, and10 µW/cm2-500 mW/cm2 for 0.5-4Mb/s. The wide dynamic rangerequires a special circuit whichadjusts to the signal level forcomparison to a threshold. Theadaptive threshold circuit quicklyadjusts to the incoming signal leveland eliminates the need for anyexternal AGC circuitry or adjust-ment.Power Supply Noise ImmunityThe HSDL-1100 receiver circuitry isspecially designed for powersupply noise immunity. The resultof the receiver design is improvedpower supply noise immunity overthat of the HSDL-1000. Table 1describes the HSDL-1100 noiseimmunity as compared to that ofthe HSDL-1000.Power Supply Noise immunity isthe maximum amount of ripple ornoise on V CC that the receiver cantolerate without generating any biterrors. Noise levels above the noiseimmunity will effectively reducethe receiver sensitivity and there-fore the Ir link distance. Withoutany infrared signal present, noiselevels above the noise immunitycould generate pulses on RxdA orRxdB. The worst case immunity isdefined as the lowest level of noiseimmunity in any frequency range.Ambient LightThe HSDL-1100 receiver designallows for the ambient light levelsof sunlight, flourescent light, andincandescent light specified in theIrDA Physical Layer Specification.As with the HSDL-1000, severaltechnologies are used in the HSDL-1100 design to reduce the effects ofinterfering ambient light. Thepackage mold compound is tintedwith dye to filter out light wave-lengths below the Ir wavelengths of850-900 nm. The lens of the detec-tor is designed to focus light withinthe IrDA viewing angle. The pre-Worst Case Immunity HSDL-1000HSDL-1100Rxd Rxd-A Rxd-BPower Supply Noise Immunity with no external20 mV90 mV70 mV V CC filter or decouplingPower Supply Noise Immunity with> 1 volt pk-pk> 1 volt pk-pk recommended V CC filter including Cx5, R3, Cx6Table 1.amplifier for both receiver chan-nels contains daylight cancellation circuitry to eliminate the ambient light portion of incoming Ir signals. Lead Bend OptionsLead bend options for the HSDL-1100 include the TOP (#X08 option), and FRONT (#X07 option). The TOP and FRONT options are similar to that shown on page 13 of the Hewlett-Packard IrDA Design Guide, and are shown in detail on the HSDL-1100 datasheet. The TOP option lies flat on the circuit board, while the FRONT stands upright on the circuit board. Implementation of the HSDL-1100Required External Components Table 2 describes the external components required for obtainingdatasheet performance (Actualvalues for the components mayvary with the I/O chip, controllerchip, EnDec chip, or buffer chipthat the HSDL-1100 interfaces to).Board Layout RequirementsProper board layout is crucial tothe noise immunity of the overall Irsystem. Compromised boardlayout may lead to reducedsesitivity, and therefore shorterachievable Ir link distance. Properboard layout is descibed in detailin page 16 of the Hewlett-PackardIrDA Design Guide.Keys aspects of proper boardlayout are:•V CC to Gnd bypass capacitorCX5 should be placed within0.5 cm of the HSDL-1100module pins 2,4, AND on thesame side of the PC board asthe HSDL-1100 module.•The PIN bypass capacitorCX1 should be <0.5 cm frompin 1 of the HSDL-1100module.• A multi-layer PC boardshould be used, and onelayer devoted to a groundplane for the HSDL-1100module. The ground planeshould be laid out as anisland, with one connectionto a clean (<20 mV noise)system ground or analogsystem ground, and sepa-rated from the groundconnection of fast switchingdevices, or noise sources.•The board underneath and1 cm in any direction aroundthe module is defined as theComponent Description Recommended ValueR1Txd input resistor for transmitter peaking.560 Ω±5%, 0.125 wattRLED (R2)LED bias resistor which sets LED current pulse 4.7 Ω±5%, 0.5 watt (See Transmitter amplitude.Drive Requirements Section)R3Power supply noise filter resistor. The higher the10-50 Ω±5%, 0.125 wattvalue, the lower the minimum filter frequency.1/(R3•CX5) is the minimum filter frequency.CX1PIN bypass capacitor to reduce noise at the PIN0.47 µF, ±10%, X7R ceramic, <0.5 cm detector.from pin 1.CX2Txd input capacitor for transmitter peaking.220 pF, ±10%, X7R ceramicCX3Adaptive threshold capacitor.1000 pF, ±10%, X7R ceramicCX4Adaptive threshold averaging capacitor.0.010 µF, ±10%, X7R ceramicCX5V CC to Gnd bypass capacitor. Should be within0.47 µF, ±20%, X7R ceramic, <0.5 cm0.5 cm of module pins 2,4.lead length, within 0.5 cm from pins2, 4.CX6V CC to Gnd bypass capacitor. 6.8 µF, Tantalum. Larger valuerecommended for noisy suppliesor environments.CX7V CC transmitter bypass capacitor0.47 µF, ceramic. Used to eliminateripple on V CC caused by the LEDcurrent during infrared transmission. Table 2.critical ground plane zone.The board layer chosen asthe ground plane islandshould be maximized in area within the ground planezone, and should include allresistor and capacitorcomponents recommendedfor use with the HSDL-1100.•The ground plane for the HSDL-1100 module shouldbe connected ONLY to theleast noisy ground nodeavailable on the PC board.•The DC-DC converter should be located as far away fromthe HSDL-1100 on the PCboard as possible (at least3 cm away). The board maythen look like Figure 2.If any of the above aspects of board layout are compromised, and it is suspected that an EMI shield over the HSDL-1100 may be necessary, Hewlett-Packard can provide EMI shields, or shielded HSDL-1100s in produc-tion volumes. The PC board should be prepared with the proper through holes, if it is suspected that an EMI shield will be necessary (see datasheets for HP part numbers HSDL-810x, or HSDL-1100#S07).Application Specific Transmitter Design:Transmitter DriveThe infrared LED in the HSDL-1100 is driven by signals present at TXD. See Figure 3.The IrDA physical layer specifica-tion requires t rise and t fall of the transmitted optical signal at4 Mb/s to be 40 ns or less. The HSDL-1100 budgets 30 ns of t rise and t fall for the LED, and 10 ns for t rise and t fall of the electrical ILED pulse. In order to reach< 30 ns t rise and t fall for the LED,MAIN GROUNDFigure 2.Figure 3.TXD PULSE HSDL-1100 PIN 7OPTICAL ILED PULSE V IHFigure 4.a peaking circuit of R1 and CX2 isrecommended. The R1•CX2 timeconstant provides overdrive forboth turn-on and turn-off of theLED, shortening the optical t riseand t fall. In order to limit theelectrical ILED pulse t rise and t fallto 5-10 ns, TXD must be drivenwith a pulse current Iih of approxi-mately ILED/125. See Figure 4.The HSDL-1100 datasheet Electri-cal Specifications show that at Vih= 4.25 V, the required Iih ≤6.6 mA.Using R1 = 560 ohms, Iih will besufficient for 5-10ns t rise and t fall ofILED, if Vih ≥4.25 V. If the chosenI/O chip, controller chip, or EnDecchip does not support Vih≥ 4.25 V at the required Iih, then R1and CX2 can be chosen to allow fora lower Vih at the required Iih value.R1 can be lowered from 560 ohmsto allow for Vih < 4.25 V. CX2should then be increased to pre-serve the peaking characteristic.If the I/O chip or controller chipcannot provide the required Iiheven at Voh = 2.4 V, then a bufferchip can be used to drive TXD ofthe HSDL-1100. The output ofthe buffer chip should be ableto source current of at leastTable 3. Recommended Minimum Iih for a chosen ILED pulse amplitude.ILED Pulse Amplitude (mA)Recommended Minimum Iih (mA)400 3.2500 4.0600 4.86605.3Minimum Vih (V)R1 (Ω)CX2 (pF)4.255602203.54203002.4220560LED Current Amplitude Maximum Pin 10 (Case) Temperature(25% duty cycle) (mA)for the HSDL-1100 (degrees C)400101.345098.450095.355092.160088.766083.0Table 4. Electrical Specifications.Table 5. LED Current IOH = 6 mA in magnitude. LS/HC241 and LS/HC244 are buffer chips that can be used to drive the TXD of the HSDL-1100.Heat Dissipation for LEDAThe PC board must be designed to dissipate heat from the HSDL-1100’s LED. The junction tempera-ture of the LED should be kept below 125°C. The thermal resis-tance of the PC board can be minimized in order to keepT junction of the LED below 125°C while operating up to 660 mA. For typical applications, the LEDA pin 10 trace should be at least 38 mm 2in area and no narrower than 2.5mm at any point. Such a trace should provide a thermal resis-tance of approximately 100°C/Watt. The HSDL-1100 evaluation board presents a thermal resis-tance of approximately 100°C/Watt for the LEDA pin 10 trace. An opening in the solder mask for the whole trace can be made to further decrease the thermal resistance.If you do not know your PCboard’s thermal resistance (deg C/Watt), then the easiest way todetermine the maximum allowable LED current is from maximum pin 10 = LEDA case temperature, see Table 5. From the LED current table you can see the maximum pin10 lead temperature on the HSDL-1100 for the #007 leadform.A thermacouple can be placed onpin10 while operating the HSDL-1100 transmitter in their PC board.If the pin 10 temperature exceeds the listed maximum temperature,the PC board thermal resistance must be reduced, or the LED current must be reduced. The PC board thermal resistance can be reduced by increasing the metal area of the pin10 trace on the PC board, and by leaving it bare (no epoxy glass over a section of that trace).For Example: If ILED = 550 mA,then the PC board should bedesigned so that the pin10 tempera-ture does not exceed 92.1°C when the PC board is enclosed in a notebook or handy terminal box.Interface to Recommended I/O Chips4 Mb/s Ir link distances of 1.3-1.95meters between transmitter and receiver have been demonstrated using typical HSDL-1100 units, and either the National Semiconductor PC87108 I/O chip, the VLSI VL82C147 I/O chip, or the SMC FDC37C957 I/O chip. In reference to the HSDL-1100 diagram on page 1 of this note, the TXD, RXD-A, and RXD-B nodes can be connected directly to the chosen I/O chip.National Semiconductor PC87108For the National Semiconductor PC87108 I/O chip, the Ir link can be realized with the following connec-tions:Connect IRTX pin 39 of thePC87108 to the I/O side of R1/CX2labeled TXD on the diagram of page 1.Connect IRRX1 pin 38 of the PC87108 to RXD-A (pin 8 of the HSDL-1100).Connect IRSLO/IRRX2 pin 37 of the PC87108 to RXD-B (pin 5 of the HSDL-1100).For Sharp ASK/DASK using the NS PC87108, the PC87108 should be configured by the ASK/DASK software to:1. Receive data from only one receive pin2. Set the receive to the AUX input IRRX2VLSI VL82C147For the VLSI VL82C147 I/O chip, the Ir link can be realized with the following connections:Connect IROUT pin 66 of theVL82C147 to the I/O side of R1/CX2 labeled TXD on the HSDL-1100 diagram.Connect SIRIN pin 67 of theVL82C147 to RXD-A (pin 8 of the HSDL-1100).Connect FIRIN pin 65 of theVL82C147 to RXD-B (pin 5 of the HSDL-1100).SMC FDC37C957For the SMC FDC37C957 I/O chip, the Ir link can be realized with the following connections:Connect IRTX pin 204 of theFDC37C957 to the 0.1 µF capacitor connected to R1/CX2 of the HSDL-1100 diagram.Connect IRRX pin 203 of theFDC37C957 to RXD-A (pin 8 of theHSDL-1100).Connect IRMODE pin 190 of theFDC37C957 to RXD-B (pin 5 of theHSDL-1100).CX3 must be 1000 pF in theapplication circuit (other I/O chipsuse 4700 pF).Note that the 0.1 µF capacitorconnected to the transmit line isnecessary since the SMC I/O chipIRTX pin could be left in a logichigh state for an indeterminateperiod of time. Connection of theIRTX directly to R1/CX2 woulddamage the HSDL-1100’s LED ifthe IRTX line was left in the logichigh state.Software RecommendationsPlease see page 24 in the Hewlett-Packard IrDA Design Guide.Microsoft (Windows 95) or PUMATechnology are the most likelyvendors to have released 4Mb/s Irsoftware.Evaluation BoardsHSDL-1100 FRONT lead formevaluation boards can be obtainedfrom your Hewlett-Packard SalesRepresentative. The evaluationboards can be plugged into astandard 6-8 pin edge connector, orhard-wired via cable to your Irsystem’s I/O chip. The connectionto the I/O chip should be as shownabove in the Interface to Recom-mended I/O Chips section of thisnote. Both V CC pins can beconnected to the same powersupply, or separate supplies asdesired. The ground pin should beconnected to the most noise freeground on the system board./go/irFor technical assistance or the location ofyour nearest Hewlett-Packard sales office,distributor or representative call:Americas/Canada: 1-800-235-0312 or(408) 654-8675Far East/Australasia: Call your local HPsales office.Japan: (81 3) 3335-8152Europe: Call your local HP sales office.Data Subject to ChangeCopyright © 1997 Hewlett-Packard Co.Printed in U.S.A. 5965-7999E (5/97)。
夜鹰CM1100多G速纤维网线模块数据表说明书
Nighthawk ® CM1OverviewNighthawk ® CM1100 Multi-Gig Speed Cable Modem by NETGEAR ® supports link aggregation todeliver true multi-gig Internet speeds. It improves your Internetconnections and provides smooth online streaming and gaming. ThisDOCSIS 3.1 cable modem is ready for any of today’s service plans and future upgrades.B U IL T F O R D OC S I S ® 3.1Multi GigINTERNETThe NETGEAR Difference - CM1100• Two (2) Gigabit Ethernet ports • DOCSIS 3.1• Supports IPv6• Secure connection • Easy installation• True Multi-Gig Experience—Linkaggregation support delivers multi-gig wireless speed to with up to 2Gbps *download speed• DOCSIS ® 3.1 Certified—Up to 10X faster download speeds than DOCSIS ® 3.0. DOCSIS ® 3.1 is OFDM 2x2+ DOCSIS ® 3.0 32x8 channel bonding• Ready for Fastest Speeds Available by Cable Service Providers—Built ready for Gigabit (and more) cable Internet service plans available today andfuture upgrades• Saves Money—Eliminate monthly cable modem rental fees and save up • Gigabit Ethernet Ports—Fastest wired speeds to connect your router orcomputer. Create two Home Networks, both capable of gigabit speeds and aggregate for the fastestmulti-gig speeds• Backward Compatible—Backward compatible to 32x8 channel bonding in DOCSIS ® 3.0 mode • Works with XFINITY ® from Comcast and Cox—Ready out of the box. You can easily self-activate without needing aservice call• Easy Installation—Trouble-free setup only takes a few quickPerformance and UseWorld‘s Fastest Internet• Delivers true Multi-Gig Internet speeds with link aggregation• DOCSIS ® 3.1 is up to 10X faster than the DOCSIS ® 3.0 standard ††• Backwards compatible with previous DOCSIS standards• Built for Gigabit cable Internet service plans available today and ready for future upgrades• Works right out of the box with XFINITY ® from Comcast and Cox ®• Save up to $120† per year by eliminating monthly cable modem rental fees†Up to $120 based on current fees.Wireless RouterCompatible Wireless Router **Link AggregationOR ORORDesktop or Laptop ComputerMulti-Gig Speed Cable Modem (CM1100)DOCSIS ® Speeds S p e e d i n M b p s1,0005,00010,000Why DOCSIS ®3.1• More Speed—supports up to 10Gbps †• Increases the uplink speed to the cloud for criticaluploads like security camera feeds and photos • Improves stability and reliability of your Internet connection • More energy efficientDOCSIS ®SpeedsThis product is not compatible with Cable bundled voice services.Cable Internet ConnectionModems Designed for Today‘s Internet Plans and Future UpgradesConnection DiagramCable Coaxial PortPower On/ OffGigabitEthernet PortsPackage Contents• Nighthawk® Multi-Gig Speed Cable Modem—DOCSIS 3.1 (CM1100)• Ethernet cable• Quick install guide• Power adapterPhysical Specifications• Dimensions: 8.8 x 3.4 x 5.9 in(224 x 86 x 150 mm)• Weight: 1.00 lb (460g)Standards• Two (2) Gigabit Ethernet ports• One (1) WAN coaxial cable connection Technical Specifications• Simple—CD-less installation• 32 downstream & 8 upstream channels• 2x2 OFDM• Memory: 128 MB NAND flash256 MB RAM• DOCSIS Quality of Service (QoS)Advanced Features• Gigabit Ethernet ports support linkaggregation for true Multi-Gig speed• Backward compatible 32x8 channelbonding in DOCSIS® 3.0 mode• Supports IPv6 - Internet standard• Gigabit Ethernet ports for fasteraccess and downloadsSupport• 24/7 Dedicated technical support forCostco Members (888) 228-4719• J oin the NETGEAR Community Forum.Visit System Requirements• Cable Broadband Internet service• Please check your Cable Internet ServiceProvider web site for data speed tiercompatibility and to ensure it providesDOCSIS® 3.1 service, otherwise thismodem will only work as a DOCSIS®3.0 modem• Not compatible with Cable bundledvoice servicesWarranty• NETGEAR 1-year limited warranty• /warranty/This product comes with a limited warranty that is valid only if purchased from a NETGEAR authorized reseller.† 10Gbps is the maximum data transfer rate in the DOCSIS® 3.1 standard. In practice, your Internet speeds will be less, as the transfer rate through the link aggregated CM1100 Gigabit Ethernet ports is limited to 2Gbps. The transfer rate may also be reduced by the volume of network traffic or your service plan.††M aximum rate is derived from DOCSIS® 3.1 specifications and actual throughput will vary depending on your Internet subscription with your provider.**Check the CM1100 product page for the Link aggregation compatible router list.NETGEAR makes no express or implied representations or warranties about this product’s compatibility with any future standards.Customer-owned modems may not be compatible with certain cable networks. Please check with your cable provider to confirm this NETGEAR modem is allowed on your cable network. This product not compatible with Cable bundled voice services.For indoor use only.NETGEAR and the NETGEAR Logo are trademarks of NETGEAR, Inc. Mac, Mac OS and the Mac logo are trademarks of Apple Inc. Any other trademarks mentioned herein are for reference purposes only. ©2018 NETGEAR, Inc.NETGEAR, Inc. 350 E. Plumeria Drive, San Jose, CA 95134-1911 USA, /support CM1100-1。
美国Eaton公司GEB1100FFG系列纤维板电路保护器说明书
Eaton GEB1100FFGEaton Series G molded case circuit breaker, EG-frame, GE,Complete breaker, Fixed thermal, fixed magnetic trip type, Single-pole, 100A, 480 Vac, 25 kAIC at 240 Vac, 18 kAIC at 415/480 Vac, Line and load, MetricGeneral specificationsEaton Series G complete molded case circuit breakerGEB1100FFG 7821169799362.99 in 5.5 in1 in 1.25 lb Eaton Selling Policy 25-000, one (1) year from the date of installation of the Product or eighteen (18) months from the date of shipment of the Product, whichever occurs first.IEC Rated Product NameCatalog Number UPCProduct Length/Depth Product Height Product Width Product Weight WarrantyCertificationsMetric25 kAIC at 240 Vac18 kAIC at 415/480 VacEGGEComplete breakerLine and load480 Vac100 AFixed thermal, fixed magnetic Single-pole Application of Tap Rules to Molded Case Breaker Terminals Application of Multi-Wire Terminals for Molded Case Circuit BreakersMulti-wire lugs product aidCircuit breaker motor operators product aidCurrent limiting molded case circuit breaker module product aidSeries G MCCB quick selectorMolded case circuit breakers providing higher levels of selective coordination product aidPlug-in adapters for molded case circuit breakers product aid StrandAble terminals product aidComprehensive circuit protection for control panel applicationsCurrent limiting molded case circuit breaker module for series G, JG and CLMotor protection circuit breakers product aidHigh performance operating handles for Series G circuit breakers product aidPower metering and monitoring with Modbus RTU product aidBreaker service centersMolded case circuit breakers catalogEaton's Volume 4—Circuit ProtectionFixed and Adjustable Thermal Trip GE Moulded Case Circuit BreakerEaton Specification Sheet - GEB1100FFGNG and ND-Frame molded case circuit breakersMOEM MCCB product selection guideMounting hardware Interrupt ratingFrameCircuit breaker type Circuit breaker frame type TerminalsVoltage rating Amperage RatingTrip TypeNumber of poles Application notesBrochuresCatalogsInstallation instructions Specifications and datasheetsEaton Corporation plc Eaton House30 Pembroke Road Dublin 4, Ireland © 2023 Eaton. All Rights Reserved. Eaton is a registered trademark.All other trademarks areproperty of their respectiveowners./socialmedia。
2012 Honda CB1100 配件用户指南说明书
REAR CARRIER
REAR CARRIER
• The weight of the cargo must not exceed the following maximum weight capacity: 17.6 lb (8.0 kg)
• Do not use a brush to clean this accessory as it may scratch the surface.
• Never use organic solvents such as gasoline, thinner, or benzine to clean this accessory. Also do not use acid or alkaline cleaners to clean this accessory.
• Wipe up spilled brake fluid at once as it may damage the plastic surface.
HEADLIGHT CASE
• When this accessory becomes dirty, rinse it thoroughly with cool water to remove loose dirt, then wipe with a clean cloth or sponge.
• Do not use a brush to clean this accessory as it may scratch the surface.
• Never use organic solvents such as gasoline, thinner, or benzine to clean this accessory. Also do not use acid or alkaline cleaners to clean this accessory.
- 1、下载文档前请自行甄别文档内容的完整性，平台不提供额外的编辑、内容补充、找答案等附加服务。
- 2、"仅部分预览"的文档,不可在线预览部分如存在完整性等问题,可反馈申请退款(可完整预览的文档不适用该条件!)。
- 3、如文档侵犯您的权益，请联系客服反馈,我们会尽快为您处理(人工客服工作时间：9:00-18:30)。
TOSHIBA LED LampsTLRH1100B(T11), TLRMH1100B(T11), TLSH1100B(T11), TLOH1100B(T11), TLYH1100B(T11)Panel Circuit Indicator•Surface-mount devices• 3.2 (L) × 2.8 (W) × 1.9 (H) mm•Flat-top type•InGaAℓP LEDs•High luminous intensity•Low drive current, high-intensity light emission•Colors: red, orange, yellow•Pb-free reflow soldering is possible•Applications: automotive use, message signboards, backlighting etc.•Standard embossed tape packing: T11 (2000/reel)8-mm tape reelColor and MaterialUnit: mmJEDEC ―JEITA ―TOSHIBA 4-3R1 Weight: 0.035 g (typ.)Product Name Color Material TLRH1100B RedTLRMH1100B RedTLSH1100B RedTLOH1100B OrangeTLYH1100B YellowInGaAℓPMaximum Ratings (Ta = 25°C)Product Name Forward Current I F (mA)Please see Note 1Reverse VoltageV R (V)Power DissipationP D (mW)Operation Temperature T opr (°C)Storage Temperature T stg (°C)TLRH1100B TLRMH1100B TLSH1100B TLOH1100B TLYH1100B70 4 161 −40~110−40~110Note 1: Forward current deratingElectrical Characteristics (Ta = 25°C)Forward Voltage V FReverse CurrentI RProduct NameMin Typ. Max I F MaxV RTLRH1100B1.6 1.92.3 TLRMH1100B 1.6 1.9 2.3TLSH1100B 1.6 1.9 2.3 TLOH1100B 1.6 2.0 2.3 TLYH1100B 1.6 2.0 2.320 10 4 Unit V mA μA VA l l o w a b l e f o r w a r d c u r r e n t I F (m A )Ambient temperature Ta (°C))I F – Ta0 20 40 60 80 100 120 80 10020 40 60Optical Characteristics–1 (Ta = 25°C)Luminous Intensity I V Product NameMin Typ. Max I FAvailable Iv rank Please see Note 2TLRH1100B 63 150 320 20 QA / RA / SATLRMH1100B 63 150 500 20 QA / RA / SA / TATLSH1100B 160 260 800 20 SA / TA / UATLOH1100B 160 270 800 20 SA / TA / UATLYH1100B 100 220 500 20 RA / SA / TAUnit mcdmcdmcdmANote 2: The specification on the above table is used for Iv classification of LEDs in Toshiba facility.Each reel includes the same rank LEDs. Let the delivery ratio of each rank be unquestioned.Luminous Intensity I VRankMin MaxQA 63 125RA 100 200SA 160 320TA 250 500UA 400 800Unit mcd mcdOptical Characteristics–2 (Ta = 25°C)Emission SpectrumPeak Emission Wavelength λp Δλ DominantWavelengthλdProduct NameMin Typ. Max Typ.Min Typ.MaxI FTLRH1100B ⎯644 ⎯18 624 630 638TLRMH1100B ⎯636 ⎯17 620 626 634TLSH1100B ⎯ 623 ⎯ 17 607 613 621TLOH1100B ⎯ 612 ⎯ 15 599 605 613TLYH1100B ⎯ 590 ⎯ 15 581 587 59520Unit nmnmnmmAThe cautions•This visible LED lamp also emits some IR lightIf a photodetector is located near the LED lamp, please ensure that it will not be affected by the IR light.•This product is designed as a general display light source usage, and it has applied the measurement standard that matched with the sensitivity of human's eyes. Therefore, it is not intended for usage of functional application (ex.Light source for sensor , optical communication and etc) except general display light source.R e l a ti v e l u m i n o u s i n t e n s i t yI F – V FF o r wa r d c u r r e n t I F (m A )Case temperature Tc (°C)I V – TcR e l a t i v e l um i n o u s i n t e n s i t y I VWavelength λ (nm)Ta = 25°CRadiation patternForward voltage V F (V)Forward current I F (mA)I V – I FL u m i n o u s i n t e n s i t y I V (m c d )11.6 1.82.0 2.2 2.41010030311 10 100100100103033003 30 0.10.5 30.3−20 0 20 40 60 801(typ.)(typ.)(typ.)Wavelength characteristic(typ.)Ta = 25°CRadiation patternRelativeluminousintensityForward voltage V F (V)I F – V FForwardcurrentIF(mA)Forward current I F (mA)I V – I FLuminousintensityIV(mcd)Case temperature Tc (°C)I V– TcRelativeluminousintensityIVWavelength λ(nm)11.6 1.82.0 2.2 2.4101003030.10.530.3−20 0 20 40 60 80111 10 100100100103033003 30(typ.)(typ.)(typ.)Wavelength characteristic (typ.)(typ.)Ta = 25°CRadiation patternRelativeluminousintensityForward voltage V F (V)I F – V FForwardcurrentIF(mA)Forward current I F(mA)I V – I FLuminousintensityIV(mcd)Case temperature Tc (°C)I V – TcRelativeluminousintensityIVWavelength λ (nm)11.6 1.82.0 2.2 2.41010030311 10 1001001000103003033 300.10.530.3−20 0 20 40 60 801(typ.)(typ.)(typ.)Wavelength characteristic (typ.)(typ.)1.0R e l a t i v e l u m i n o u s i n t e n s i t yForward voltage V F (V) I F – V FF o r w a r d c u r r e n t I F (m A )Forward current I F (mA)I V – I FL u m i n o u s i n t e n s i t y I V (m c d )Case temperature Tc (°C)I V – TcR e l a t i v e l u m i n o u s i n t e n s i t y I VWavelength λ (nm)Ta = 25°CRadiation pattern0.10.5 30.3−20 0 20 40 60 80111.6 1.82.0 2.2 2.41010030311 10 1001000101003003033 30 (typ.)(typ.)(typ.)Wavelength characteristic(typ.)(typ.)Ta =25°CRadiation patternRelativeluminousintensityForward voltage V F (V)I F – V FForwardcurrentIF(mA)Forward current I F (mA)I V – I FLuminousintensityIV(mcd)Case temperature Tc (°C)I V– TcRelativeluminousintensityIVWavelength λ (nm)6005406406205805606600.10.530.3−20 0 20 40 60 80111.6 1.82.0 2.2 2.41010030311 101001000101003003033 30(typ.)(typ.)(typ.)Wavelength characteristic (typ.)(typ.)PackagingThese LED devices are packed in an aluminum envelope with a silica gel and a moisture indicator to avoidmoisture absorption. The optical characteristics of the devices may be affected by exposure to moisture in the air before soldering and they should therefore be stored under the following conditions:1. This moisture proof bag may be stored unopened within 12 months at the following conditions.Temperature: 5°C~30°C Humidity: 90% (max)2. After opening the moisture proof bag, the devices should be assembled within 168 hours in an environment of5°C to 30°C/60% RH or below.3. If upon opening, the moisture indicator card shows humidity 30% or above (Color of indication changes topink) or the expiration date has passed, the devices should be baked in taping with reel. After baking, use the baked devices within 72 hours, but perform baking only once. Baking conditions: 60±5°C, for 12 to 24 hours.Expiration date: 12 months from sealing date, which is imprinted on the same side as this label affixed. 4. Repeated baking can cause the peeling strength of the taping to change, then leads to trouble in mounting.Furthermore, prevent the devices from being destructed against static electricity for baking of it.5. If the packing material of laminate would be broken, the hermeticity would deteriorate. Therefore, do notthrow or drop the packed devices.Mounting MethodSoldering• Reflow soldering (example)• The products are evaluated using above reflow soldering conditions. No additional test is performed exceed thecondition (i.e. the condition more than (*)MAX values) as a evaluation. Please perform reflow soldering under the above conditions.• Please perform the first reflow soldering with reference to the above temperature profile and within 168 h ofopening the package. • Second reflow solderingIn case of second reflow soldering should be performed within 168 h of the first reflow under the above conditions.Storage conditions before the second reflow soldering: 30°C, 60% RH (max) • Make any necessary soldering corrections manually.(only once at each soldering point) Soldering iron : 25 W Temperature : 300°C or less Time : within 3 s • If the products need to be performed by other soldering method (ex. wave soldering), please contact Toshiba sales representative.Recommended soldering patternUnit: mmTime (s)P a c k a g e s u r f a c e t e m p e r a t u r e (°C )Temperature profile for Pb soldering (example)Time (s)P a c k a g e s u r f a c et e m p e r a t u r e (°C )Temperature profile for Pb-free soldering (example)CleaningWhen cleaning is required after soldering, Toshiba recommends the following cleaning solvents.It is confirmed that these solvents have no effect on semiconductor devices in our dipping test (under the recommended conditions). In selecting the one for your actual usage, please perform sufficient review on washing condition, using condition and etc.ASAHI CLEAN AK-225AES : (made by ASAHI GLASS)KAO CLEAN TROUGH 750H : (made by KAO)PINE ALPHA ST-100S : (made by ARAKAWA CHEMICAL) TOSHIBA TECHNOCARE : (made by GE TOSHIBA SILICONES)(FRW-17, FRW-1, FRV-100)Precautions when MountingDo not apply force to the plastic part of the LED under high-temperature conditions. To avoid damaging the LED plastic, do not apply friction using a hard material.When installing the PCB in a product, ensure that the device does not come into contact with other cmponents.Tape Specifications1. Product number formatThe type of package used for shipment is denoted by a symbol suffix after the product number. The method of classification is as below. (this method, however does not apply to products whose electrical characteristics differ from standard Toshiba specifications) (1) Tape Type: T14 (4-mm pitch) (2) Example2. Tape dimensionsUnit: mmSymbol Dimension ToleranceSymbol Dimension ToleranceD 1.5 +0.1/−0 P 2 2.0 ±0.05E 1.75 ±0.1 W 8.0 ±0.3 P 0 4.0 ±0.1 P 4.0 ±0.1 t 0.3 ±0.05 A 0 2.9 ±0.1F 3.5 ±0.05 B 0 3.7 ±0.1 D 1 1.5 ±0.1 K 0 2.3 ±0.1TLRH1100B (T11)Tape typeToshiba product No.3. Reel dimensionsUnit: mm4. Leader and trailer sections of tapeNote1: Empty trailer sectionNote2: Empty leader section5. Packing form(1) Packing quantityReel 2,000 pcs Carton 10,000 pcs(2) Packing form: Each reel is sealed in an aluminum pack with silica gel.6. Label format(1) Example: TLRH1100B (T11)P/N:TOSHIBATYPE TLRH1100BADDC(T11) Q’TY2,000 pcsLot Number Key code for TSB 32C 2000(RANK SYMBOL)Use under 5-30degC/60%RH within 168hSEAL DATE: [[G]]/RoHS COMPATIBLE DIFFUSED IN ***** *Y3804xxxxxxxxxxxxxxxxx* ASSEMBLED IN *****(2) Label location• Reel• Carton• The aluminum package in which the reel is supplied also has the label attached to center of one side.RESTRICTIONS ON PRODUCT USE20070701-EN •The information contained herein is subject to change without notice.•TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property.In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc.• The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his document shall be made at the customer’s own risk.•The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations.• The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patents or other rights of TOSHIBA or the third parties.•GaAs(Gallium Arsenide) is used in this product. The dust or vapor is harmful to the human body. Do not break, cut, crush or dissolve chemically.• Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations.。