MC10H121MELG中文资料

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MC系列多功能压力标定仪说明书

CALL TO ORDER: U.S. Phone 219 879-8000 • U.K. Phone (+44) (0)1494-461707 • Australia Phone (+61) (0) 2 4272 2055463Series MC Portable Multi-Cal Pressure Calibrator pe rforms a wide varie ty of simple and comple x pre ssure base d me asure me nt, te st, and calibration operations. Modular sensor design allows user to select pressure measurement range for application flexibility. Calibrator can accommodate up to two inte rchange able pre ssure module s (sold se parate ly be low) in any combination of range or accuracy.Simultane ously display two se parate me asure me nts on the two line ,alphanume ric display. Re adings can be displaye d in a choice of 12preprogrammed engineering units or any single user-defined unit. Calibrator features min/max recall, hi/lo alarm, percentage of full scale pressure readings,mA/voltage measurement, leak rate and pressure decay measurement, switch testing capabilities, including trip point and dead band, and velocity/volume flow rates.Quickly document calibration procedures using the data logging feature which stores up to 384 sets of pressure and time/date stamped measurements. Easily upload store d data to an IBM compatible compute r via the RS232 port.Calibrators and modules include certification to NIST traceability—ideal as a secondary standard for calibrating pressure equipment.Multi-Cal Pressure Calibrator includes utility software, test leads, protection module , adjustable hand strap, AC adapte r, two 9V batte rie s, instruction manual, and hard carrying case.APPLICATIONSPressure measurement for clean room control, filter performance monitoring,HVAC testing and setup, draft measurement, airflow measurement control,differential pressure m easurement in laminar flowhoods, paint booths, industrial ovens and fume hoods. Use as a secondary standard for calibrating pressure equipment.SPECIFICATIONSService:Clean, dry, nonconductive, noncorrosive gases.Accuracy:Differential pressure modules: ±0.06% FS; Gauge pressure modules: ±0.05% FS; Voltage input: ±0.025% FS @ 0/10 VDC, ±0.10%FS @ 0/30 VDC; Current input: ±0.03% FS @ 0/20 mA, ±0.05% FS @0/50 mA.Sensitivity:±0.002% of span with dampening 1 part in 50,000 (max).Repeatability:Ranges ≤0/2 psi: ±0.05% of span; Ranges ≥0/5 psi:±0.02% of span.Output:RS232 serial interface, 9-pin.Alarm Output:SPST form C 110 VDC, 120 VDC (max.), 1 A (max), 30W, 62.5 VA (resistive).Display:Alphanumeric LCD, 0.37˝ (9.5 mm) height per line, 2 lines, 16characters/line.Display Update:100 msec.Ambient Operating Temperature: 32 to 120°F (0 to 49°C). Storage Temperature:-4 to 158°F (-20 to 70°C).Process Connection:1/8˝ female NPT.Electrical Connections:Miniature recessed banana jacks.Power Requirements:Internal: two 9 VDC alkaline batteries; External:AC adapter 9 VDC, 500 mA.Battery Life:30 hours (approximate).Engineering Units:inH 2O, psi, inHg, kPa, mbar, cmH 2O, mmHg, and user-defined.Overpressure:Differential pressure modules: 50 psi positive direction,15 psi negative direction; Gage pressure modules: 2x range (0/5 psi to 0/1000 psi).Temperature Compensation:20 to 120°F (-7 to 49°C).Temperature Error:Maximum of ±0.004% of span per °F over compensated range for zero and span.Temperature Effect Electrical Measurement:±0.001% of span per °F over compensated range.Dampening:(Measurement averaging) programmable from 0 to 16consecutive readings.Baud Rate:300, 1200, 2400, or 9600, selectable.Housing Material:ABS plastic.Weight:Calibrator: 2.2 lb (1.3 kg); Pressure module: 0.5 lb (0.3 kg).Agency Approvals:CE.Multi-Cal Pressure Modules are interchangeable and available in a wide selection of pressure ranges and accuracies. Handheld calibrator accepts up to two pressure modules. Modules include NIST calibration certification.OPTIONSConsult factory for other pressure ranges and accuracies. FM approved models are also available.Model MC2K, Handheld Calibrator . . . . . . . . . . . . . . . . . . . .$2887.00b ACCESSORYCP40,Serial Printer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .534.00b。

HM中文说明书1

目录第一节系统说明1 引言2 电解液3 电解槽4 电解液子系统（1）KOH泵（2）KOH贮罐（3）换热器（4）KOH过滤器（5）流量开关（6）KOH温度传感器（7）KOH液位计5 给水子系统（1）给水（2）给水水质监测器（3）给水泵（4）给水控制6 气体控制和调节子系统（1）压力变送器（2）产气速率（3）预压（4）备用（5）压力释放（6）背压调节器（7）差压调节器（8）安全阀（9）排空阀（10）冷凝器和捕集器（11）纸型隔膜（12）氮气冲洗7 氢气干燥（1）干燥器（2）干燥器阀8 冷却及冷凝器冷却水子系统（1）温度调节阀（2）冷凝器冷却水及其控制9 系统安全（1）氧中氢监测器（2）电流监测器（3）氢检测器（4）停车报警10 电力和工艺控制子系统（1）DC电源（2）可编程控制器（3）工艺控制及程序（4）干燥器程序11 数据显示和工艺监控（1）触摸屏显示（2）发光二极管监控第二节发生器安装1 系统类别2 发生器安装3 设备连接（1）给水（2）冷却水（3）冷凝器冷却水（4）氢、氧排气阀（5）产品气输送（6）电力（7）氮气吹洗4电源的电连接5 外部报警连接第三节发生器运行1 前言2 初次启动3 启动模式4 运行模式5 备用模式6 常规运行7 压力释放8 停车第四节维护和校验规程1 前言2 电解液（1）电解液混和（2）电解液注入（3）电解液检查（4）电解液排放3 电解槽检查（1）外观检查（2）内部检查（3）再紧固规程4 纸型隔板更换5 渗透渗漏检查6 KOH过滤器更换7 给水过滤器更换8 KOH泵检查9 阀门和调节器维修和校验（1）电磁阀（2）差压调节器（3）背压调节器（4）止回阀和安全阀10 氧中氢监测器维修及校验（1）流量控制器（2）过滤器罐（3）温度传感器11 系统试压12 差压变速器13 KOH流量开关检查14 给水泵起动及冲洗15 给水检测器检查16 干燥器维修（1）孔板维修（2）止回阀维修（3）分子筛更换（4）气体过滤器更换17 温度调节阀检查第五节排除故障指南附录A目录系统组件图1 框架组件图号；A-12 电解槽组件图号；A-23 给水和冷却水组件图号；A-34 气体控制组件图号；A-45 控制箱组件图号；A-56 干燥器组件图号；A-6附录B目录系统图1 HM管道图图号；M141562 HM-C1D2发生器接线图图号；ES-M-009第一节系统说明1 引言HM系统的基本设备配置包括两块，即氢气发生器和电源。

Neptune MACH 10 无线电水表说明书

•Sizes 1½ ” and 2”•Extended low-flow range and accuracy •No maintenance •Accuracy sustained over meter life•Advanced ultrasonic technology •Lead free, high-copper alloy maincase •Certified to UL 327B(1 1⁄2”, 2”) for residential fire service applicationsThe MACH 10® ultrasonic water meter features solid state metrology with no degradation of accuracy over time. Combined with a corrosion-resistant, lead free, high-copper alloy maincase, the MACH 10 is built to withstand demanding service conditions and deliver sustained accuracy over the life of the meter.Be Confident withSustained Accuracy Over TimeNeptune ® MACH 10®Ultrasonic MeterNeptune Technology Group 1600 Alabama Highway 229Tallassee, AL 36078800-633-8754 f 334-283-7293© 2020 Neptune Technology Group Inc. All Rights Reserved. The trademarks, logos and service marks displayed in this document herein are the property of Neptune Technology Group Inc., its affiliates or other third parties. Availability and technical specifications are subject to change without notice. 20-004229 PS MACH10 INTERMEDIATE 05.20SpecificationsAWWA C715 Compliant NSF/ANSI 61 Certified UL 327B Certified(Optional for 1 ½”, 2”) Application•Cold water measurement of flow in potable, combination potable and fire service, and reclaim/secondary water applications.Maximum Operating Water Pressure•175 psiOperating Water Temperature Range•+33°F to +122°F (+0.5°C to +50°C)Environmental Conditions•Operating temperature:+14°F to +149°F (-10°C to +65°C)•Storage temperature:-40°F to +158°F (-40°C to +70°C)OptionsSizes•1½”•2”Units of Measure•U.S. gallons, Imperial gallons,cubic feet, cubic metres Meter Options•Potable water •Reclaim water•Residential fire service (combo or standalone meter service lines)Warranty•Neptune provides a limitedwarranty for performance,materials, and workmanship. See warranty statement for details.System Compatibility•Compatible with NeptuneR900® and CMIU. Also available as MACH 10®)R900i ™ for an integrated radio solution and MACH 10®)TC for Sensus Touch Coupler compatibility.Operating CharacteristicsMeter Size Normal Operating Range @ 100% Accuracy (+/- 1.5%)AWWA C715 Standard Type 1Extended Low Flow @ 100% Accuracy(+/- 3.0%)1½”0.80 to 125 U.S. gpm 2.0 to 100 U.S. gpm 0.30 U.S. gpm 2”1.50 to 160 U.S. gpm2.5 to 50 U.S. gpm0.50 U.S. gpmDimensionsMeter SizeLength Height Flanges 11⁄2”10”61⁄4”Oval 13”61⁄4”Oval 125⁄8”61⁄4”Internal Thread 125⁄8”61⁄4”External Thread2”10”61⁄2”Oval 151⁄4”61⁄2”Oval 17”61⁄2”Oval 151⁄4”61⁄2”Internal Thread 151⁄4”61⁄2”External ThreadRegistrationHigh Resolution (8-digit reading)1½”2”1U.S. Gallons √√1Imperial Gallons √√0.1Cubic Feet√√0.01Cubic Metres√√Pressure LossThis chart shows typical meterperformance. Individual results may vary.LCD Display9-digit display for extra resolutionon manual reads.LeakReverse Flow Forward Flow + Warning for Excessive Flow Empty Pipe Rate and Units Cumulative UnitsLowBattery。

B11版110counter参数解释

计数器英文解释MC01NB_IMM_ASS_SUCC_MTMC02NB_IMM_ASS_SUCC_MOMC02A NB_IMM_ASS_SUCC_MO_LOC_UPDMC02B NB_IMM_ASS_SUCC_MO_SMSMC02C NB_IMM_ASS_SUCC_MO_SUP_SERVMC02D NB_IMM_ASS_SUCC_MO_FOLLOW_ONMC02E NB_IMM_ASS_SUCC_MO_CM_REESTMC02F NB_IMM_ASS_SUCC_MO_L3INFO_UNKNOW MC02G NB_IMM_ASS_SUCC_MO_IMSI_DETACH MC02H NB_IMM_ASS_SUCC_MO_CALL_ESTMC02I NB_IMM_ASS_SUCC_MO_LCSMC03NB_OUT_SDCCH_HO_SUCCMC04NB_IMM_ASS_PREP_FAIL_CONGMC07NB_SDCCH_DROP_OUT_HOMC10NB_INC_SDCCH_HO_SUCCMC101NB_INTRA_SDCCH_HO_PREP_FAIL_CONG MC1040NB_HO_ATPT_23_TrafHandoverMC1044NB_HO_ATPT_24_gencaptureMC1050NB_HO_22_TooShortDistanceMC1200TRX_MAX_TEMPERATUREMC1201Reserve_TRX_2MC1202Reserve_TRX_3MC1203Reserve_TRX_4MC1208TIME_PWR_RED_8PSK_1MC1209TIME_PWR_RED_8PSK_2MC1210TIME_PWR_RED_8PSK_3MC1211TIME_PWR_RED_8PSK_4MC1212TIME_PWR_RED_GMSK_1MC1213TIME_PWR_RED_GMSK_2MC1214TIME_PWR_RED_GMSK_3MC1215TIME_PWR_RED_GMSK_4MC1216TIME_PWR_RED_CTRL_1MC1217TIME_PWR_RED_CTRL_2MC1218TIME_PWR_RED_CTRL_3MC1219TIME_PWR_RED_CTRL_4MC1220TIME_8PSK_BURST_TRANSMISSIONMC1221TIME_GMSK_BURST_TRANSMISSIONMC1222TIME_CTRL_BURST_TRANSMISSIONMC1223EXTRA_PROVISION_FOR_MC_MODULE_1 MC1224EXTRA_PROVISION_FOR_MC_MODULE_2 MC1225EXTRA_PROVISION_FOR_MC_MODULE_3 MC1226EXTRA_PROVISION_FOR_MC_MODULE_4 MC1227EXTRA_PROVISION_FOR_MC_MODULE_5 MC137NB_SDCCH_DROP_EST_PHAS_BSS_PB MC138NB_SDCCH_DROP_EST_PHAS_RLFMC13A NB_TCH_NOR_ASS_QUEUEDMC13B NB_INC_EXT_TCH_HO_QUEUEDMC140A NB_TCH_NOR_ASS_REQMC140B NB_TCH_NOR_ASS_ATPTMC141AV_NB_TCH_QUEUEDMC142E NB_OUT_IDR_SUCCMC142F NB_OUT_EDR_SUCCMC144E NB_OUT_IDR_REQMC144F NB_OUT_EDR_REQMC147NB_INC_SDCCH_HO_ALLOCMC148NB_IMM_ASS_ALLOCMC149NB_IMM_ASS_EXEC_FAIL_RADIOMC14A NB_TCH_DROP_HO_PREP_EXEC_FAIL_BSS_PB MC14C NB_TCH_DROP_EST_PHAS_BSS_PBMC151NB_INC_IDR_SUCCMC153NB_INC_IDR_REQMC15A NB_INC_IDR_ALLOCMC15B NB_INC_TCH_HO_ALLOCMC161NB_DTAP_NOR_ASS_SUCCMC162NB_TCH_DROP_DTAP_EST_PHASMC170NB_CALL_TFOMC191NB_SMS_PP_CON_MT_SDCCHMC196NB_SMS_PP_CON_SUCCMC197NB_SMS_PP_CON_FAILMC24AV_NB_NOT_AVAIL_TRX_TSMC250AV_NB_AVAIL_TCHMC26AV_NB_AVAIL_SDCCHMC27AV_NB_AVAIL_CCCHMC28A AV_NB_BUSY_CS_TSMC29A NB_MAX_SIMUL_BUSY_CS_TSMC31NB_MAX_SIMUL_BUSY_SDCCHMC320A AV_NB_IDLE_TCH_INTERF_BAND1MC320B AV_NB_IDLE_TCH_INTERF_BAND2MC320C AV_NB_IDLE_TCH_INTERF_BAND3MC320D AV_NB_IDLE_TCH_INTERF_BAND4MC320E AV_NB_IDLE_TCH_INTERF_BAND5MC34TIME_ALL_AVAIL_TRX_TS_BUSYMC370A NB_TRX_FR_ALLOCMC370B NB_TRX_HR_ALLOCMC380A TIME_TRX_FR_BUSYMC380B TIME_TRX_HR_BUSYMC380C TIME_TRX_GSM_FR_BUSYMC380D TIME_TRX_GSM_HR_BUSYMC380E TIME_TRX_DCS_FR_BUSYMC380F TIME_TRX_DCS_HR_BUSYMC381TIME_TRX_TCH_BUSY_BY_MULTIBAND_MS MC390NB_TIMES_SDCCH_BUSY(110)MC400TIME_TRX_SDCCH_BUSYMC41B NB_INC_EXT_TCH_HO_PREP_FAIL_NO_TTCH MC448A NB_TCH_HO_ATPT_26_BadQualHRMC448B NB_TCH_HO_ATPT_27_GoodQualFRMC449NB_TCH_HO_ATPT_28_FastTrafficMC460A NB_TCH_EMERGENCY_HO_PRESERVATIONMC461NB_TCH_HO_ATPT_29_TFOMC462A NB_OUT_INTER_PLMN_TCH_HO_REQMC462B NB_OUT_INTER_PLMN_TCH_HO_ATPTMC462C NB_OUT_INTER_PLMN_TCH_HO_SUCCMC463A NB_INC_INTER_PLMN_TCH_HO_REQMC463B NB_INC_INTER_PLMN_TCH_HO_ATPTMC463C NB_INC_INTER_PLMN_TCH_HO_SUCCMC480NB_TCH_HO_REQ_30_ReturnCSZoneMC481NB_TCH_HO_ATPT_30_ReturnCSZoneMC482NB_TCH_HO_REQ_30_ABORTEDMC541NB_INC_EXT_TCH_HO_PREP_FAIL_R_ABISMC541A NB_INC_EXT_TCH_HO_PREP_FAIL_CONG_R_ABIS MC551NB_INC_INT_TCH_HO_PREP_FAIL_CONG_R_ABIS MC555NB_INC_IDR_PREP_FAIL_CONG_R_ABISMC561NB_INTRA_TCH_HO_EXEC_FAIL_REVMC586A NB_TCH_HO_ATPT_10_TooLowLevUpInZoneMC586B NB_TCH_HO_ATPT_11_TooLowLevDownInZoneMC586C NB_TCH_HO_ATPT_13_TooHighLevUpDownOutZone MC607NB_SDCCH_HO_20_HighLevNeigCellForcDRMC612A NB_TCH_NOR_ASS_PREP_FAIL_NO_QUEUEMC612B NB_TCH_NOR_ASS_PREP_FAIL_QUEUE_FULLMC612C NB_TCH_NOR_ASS_PREP_FAIL_T11_EXPMC612D NB_TCH_NOR_ASS_PREP_FAIL_QUEUE_REJMC621NB_TCH_DROP_OUT_HO_EXEC_TRXMC642NB_INC_EXT_HO_SUCCMC643NB_INC_EXT_HO_EXEC_FAIL_MS_ACCESSMC645A NB_OUT_EXT_REAL_HO_REQMC646NB_OUT_EXT_HO_SUCCMC647NB_OUT_EXT_HO_EXEC_FAIL_REVMC648NB_OUT_EXT_HO_EXEC_FAIL_NO_REVMC650NB_OUT_EXT_HO_ATPTMC652NB_INC_INT_HO_SUCCMC653NB_INC_INT_HO_EXEC_FAIL_MS_ACCESSMC655A NB_OUT_INT_HO_REQMC656NB_OUT_INT_HO_SUCCMC657NB_OUT_INT_HO_EXEC_FAIL_REVMC658NB_OUT_INT_HO_EXEC_FAIL_NO_REVMC660NB_OUT_INT_HO_ATPTMC662NB_INTRA_HO_SUCCMC663NB_INTRA_HO_EXEC_FAIL_NO_REVMC667NB_INTRA_HO_EXEC_FAIL_REVMC670NB_HO_2_TooLowQualUpMC671NB_HO_3_TooLowLevUpMC672NB_HO_4_TooLowLevUpMC673NB_HO_5_TooLowLevUpMC674NB_HO_6_TooLongDistanceMC675NB_HO_MSC_TRIGMC676NB_HO_15_TooHighLevInterfUpMC677NB_HO_16_TooHighLevInterfDownMC678NB_HO_12_TooLowPowBudgMC679NB_HO_21_HighLevNeigCellPrefBandMC701A NB_TCH_FR_REQMC701B NB_TCH_DR_REQMC701C NB_TCH_DR_EFR_REQMC701D NB_TCH_AMR_REQMC701E NB_TCH_DATA_REQMC701F NB_TCH_FR_EFR_REQMC701G NB_TCH_NO_FR_REQMC702A NB_TCH_NOR_FR_ALLOCMC702B NB_TCH_NOR_HR_ALLOCMC702C NB_TCH_NOR_EFR_ALLOCMC703NB_TCH_NOR_ASS_ALLOC_TRXMC704A NB_TCH_NOR_AMR_FR_ALLOCMC704B NB_TCH_NOR_AMR_HR_ALLOCMC705NB_TCH_NOR_DATA_ALLOCMC706NB_EGSM_MS_ACCESS_EXCEPT_LUMC710NB_TCH_OUT_HO_REQ_TRXMC711NB_TCH_OUT_HO_PREP_FAIL_CONG_TRXMC712NB_TCH_OUT_HO_SUCC_TRXMC713NB_TCH_OUT_HO_FAIL_REV_TRXMC714NB_TCH_OUT_HO_FAIL_NO_REV_TRXMC717A NB_INC_IDR_SUCC_TRXMC717B NB_INC_TCH_HO_SUCC_TRXMC718NB_TCH_NOR_ASS_SUCC_TRXMC736NB_TCH_DROP_EST_PHAS_ELF_TRXMC739NB_TCH_DROP_EST_PHAS_REM_TRANS_FAIL_TRX MC746B NB_TCH_NOR_ASS_EXEC_FAIL_RADIO_TRXMC785A NB_HO_7_ConsBadSACCHmicroCellMC785D NB_HO_17_TooLowLevUpMicroCellMC785E NB_HO_18_TooLowLevDownMicroCellMC785F NB_HO_14_HighLevNeigLowCellSlowMSMC800AV_NB_AVAIL_DYN_TSMC801A AV_NB_BUSY_DYN_TCHMC801B MAX_NB_BUSY_DYN_TCHMC802A AV_NB_BUSY_DYN_SDCCHMC802B MAX_NB_BUSY_DYN_SDCCHMC803TIME_SDCCH_CONGESTIONMC804A NB_UL_SINGLE_BLOCK_SIG_RACHMC804B NB_UL_ONE_PHASE_SIG_RACHMC805A NB_CHANNEL_ASSIGN_DL_AGCHMC805B NB_CHANNEL_ASSIGN_DL_PCHMC81NB_INC_EXT_SDCCH_HO_PREP_FAIL_CONGMC812NB_TCH_NOR_ASS_PREP_FAIL_CONG_R_ABIS MC820NB_INC_EXT_HO_REQMC821NB_INC_EXT_HO_ATPTMC830NB_INC_INT_HO_REQMC831NB_INC_HO_ATPTMC850NB_MULTIBAND_MS_ACCESS_EXCEPT_LU_CELL MC870NB_INTRA_HO_REQMC871NB_INTRA_HO_ATPTMC8A NB_CELL_PAGING_CMDMC8B NB_CELL_IMM_ASS_CMDMC8C NB_CELL_CHAN_REQDMC8D NB_CELL_IMM_ASS_REJMC901NB_Suspend_reqMC902NB_Suspend_failMC903NB_Suspend_succMC91NB_INC_INT_SDCCH_HO_PREP_FAIL_CONGMC921A NB_TCH_NOR_ASS_HO_REQ_ABLE_TO_PREEMPT MC921B NB_PREEMPT_CAP_ALLOC_SUCCMC921C NB_PREEMPTED_CALLSMC921D NB_PREEMPT_CAP_OUT_DR_ALLOC_SUCCMC921E NB_TCH_NOR_ASS_HO_SUCC_PREEMPTABLEMC922A NB_INC_EXT_3G_2G_HO_REQMC922B NB_INC_EXT_3G_2G_HO_SUCCMC922C NB_INC_EXT_3G_2G_HO_EXEC_FAIL_MS_ACC MC922D NB_INC_EXT_3G_2G_HO_ATPTMC922E NB_INC_EXT_TCH_3G_2G_HO_EMERGENCY_REQMC922F NB_INC_EXT_TCH_3G_2G_HO_REQMC922G NB_INC_EXT_TCH_3G_2G_HO_PREP_FAIL_3GCONG MC922H TIME_3G_HOReject_HLMC923A NB_LCS_REQMC923B NB_LCS_SUCCMC923C NB_LCS_FAIL_LBMC923D NB_LCS_ABORTMC924A TIME_SPDCH_LIMIT_HIGH_LOADMC924B NB_2G_3G_HO_2MC924C NB_2G_3G_HO_3MC924D NB_2G_3G_HO_4MC924E NB_2G_3G_HO_5MC924F NB_2G_3G_HO_6MC924G NB_2G_3G_HO_7MC924H NB_2G_3G_HO_8MC924I NB_2G_3G_HO_9MC924J NB_2G_3G_HO_10MC924K NB_2G_3G_HO_11MC925A NB_AGCH_USEFUL_BLOCKS_SENTMC925B NB_PCH_USEFUL_BLOCKS_SENTMC925C NB_BUSY_RACH_SLOTSMC925D NB_CHANNEL_RQ_RADIOMC925E NB_ASSIGN_CMD_RECEIVED_ABISMC925F NB_ASSIGN_CMD_DISCARDEDMC925G NB_PAGING_CMD_RECEIVED_ABISMC925H NB_PAGING_CMD_DISCARDEDMC927A NB_DTM_UL_TCH_ASS_ATPTMC927B NB_DTM_DL_TCH_ASS_ATPTMC927C NB_DTM_UL_PACKET_ASS_ATPTMC927D NB_DTM_DL_PACKET_ASS_ATPTMC927E NB_DTM_UL_TCH_ASS_EXEC_FAIL_RADIOMC927F NB_DTM_DL_TCH_ASS_EXEC_FAIL_RADIOMC928A NB_TCH_DROP_CAUSE_TOO_LOW_QUALITY_ULMC928B NB_TCH_DROP_CAUSE_TOO_LOW_LEVEL_ULMC928C NB_TCH_DROP_CAUSE_TOO_LOW_QUALITY_DLMC928D NB_TCH_DROP_CAUSE_TOO_LOW_LEVEL_DLMC928E NB_TCH_DROP_CAUSE_LONG_MS_BS_DISDANCEMC928F NB_TCH_DROP_CAUSE_TOO_SHORT_MS_BS_DISTANCE MC928G NB_TCH_DROP_CAUSE_TOO_HIGH_INTERFERENCE_UPL MC928H NB_TCH_DROP_CAUSE_TOO_HIGH_INTERFERENCE_DOW MC928I NB_TCH_DROP_OTHER_CAUSESMC930NB_ABIS_PAGING_MESSAGE_RECEIVEDMC931Reserve_cell_2MC932Reserve_cell_3MC933Reserve_cell_4MC934Reserve_cell_5MC935Reserve_cell_6MC936Reserve_cell_7MC937Reserve_cell_8MC938Reserve_cell_9MC939Reserve_cell_10MC950Reserve_cell_11MC951Reserve_cell_12MC952Reserve_cell_13MC953Reserve_cell_14MC954Reserve_cell_15MC955Reserve_cell_16MC956Reserve_cell_17MC957Reserve_cell_18MC958Reserve_cell_19MC959Reserve_cell_20MC960Reserve_cell_21MC961Reserve_cell_22MC962Reserve_cell_23MC963Reserve_cell_24MC964Reserve_cell_25MC965Reserve_cell_26MC966Reserve_cell_27MC967Reserve_cell_28MC968Reserve_cell_29MC969Reserve_cell_30MC970Reserve_cell_31MC971Reserve_cell_32MC972Reserve_cell_33MC973Reserve_cell_34MC974Reserve_cell_35MC990NB_MS_REPEATED_ACCH_CAPABLEMC991NB_CALLS_RFACCH_ACTIVATEDMC992NB_CALLS_RSACCH_ACTIVATEDMC993NB_AMR_TCH_DROP_RLF_TRXMC994NB_AMR_TCH_DROP_RLF_TRX_RSACCH MC995NB_AMR_TCH_DROP_OUT_HO_TRXMC996NB_AMR_TCH_DROP_OUT_HO_TRX_RFACCH中文解释SDCCH指配成功的次数（被叫）SDCCH指配成功的次数（主叫）SDCCH指配成功的次数(非FOLLOW_ON位置更新) SDCCH指配成功的次数(短消息)SDCCH指配成功的次数(补充业务)SDCCH指配成功的次数(FOLLOW_ON位置更新) SDCCH指配成功的次数(呼叫重建)SDCCH指配成功的次数(未知消息)SDCCH指配成功的次数(IMSI分离、结合) SDCCH指配成功的次数(呼叫业务)NB_IMM_ASS_SUCC_MO_LCSSDCCH出小区切换成功次数SDCCH分配失败次数（由于拥塞）SDCCH出小区切换掉话次数SDCCH入小区切换成功次数小区内SDCCH切换失败次数（由于拥塞）切换尝试次数（TrafficHandover 原因）切换尝试次数（捕获切换原因）切换尝试次数（TA值过小）TRX_MAX_TEMPERATUREReserve_TRX_2Reserve_TRX_3Reserve_TRX_4TIME_PWR_RED_8PSK_1TIME_PWR_RED_8PSK_2TIME_PWR_RED_8PSK_3TIME_PWR_RED_8PSK_4TIME_PWR_RED_GMSK_1TIME_PWR_RED_GMSK_2TIME_PWR_RED_GMSK_3TIME_PWR_RED_GMSK_4TIME_PWR_RED_CTRL_1TIME_PWR_RED_CTRL_2TIME_PWR_RED_CTRL_3TIME_PWR_RED_CTRL_4TIME_8PSK_BURST_TRANSMISSIONTIME_GMSK_BURST_TRANSMISSIONTIME_CTRL_BURST_TRANSMISSIONEXTRA_PROVISION_FOR_MC_MODULE_1EXTRA_PROVISION_FOR_MC_MODULE_2EXTRA_PROVISION_FOR_MC_MODULE_3EXTRA_PROVISION_FOR_MC_MODULE_4EXTRA_PROVISION_FOR_MC_MODULE_5SDCCH掉话次数（因为BSS的问题）SDCCH掉话次数（无线链路失败）TCH指配时的排队次数（发起呼叫）BSC间入切换时的排队次数NB_TCH_NOR_ASS_REQNB_TCH_NOR_ASS_ATPTTCH平均排队次数（正常分配和BSC间切换）BSC内出切换成功次数(直接重试)BSC间出切换成功次数（直接重试）BSC内出切换请求次数(直接重试)BSC间出切换请求次数（直接重试）SDCCH指配次数（入切换）SDCCH立即指配次数SDCCH立即指配失败次数切换过程中TCH掉话次数（由于BSS原因）通话过程中的TCH掉话次数（由于BSS原因）BSC内入切换成功次数(直接重试)BSC入出切换请求次数（直接重试）BSC内入小区TCH分配次数（直接重试）BSC内入小区切换TCH分配次数TCH指配成功次数（主叫和被叫）指配过程中的掉话次数（无线链路失败、bss原因、传输原因）NB_CALL_TFONB_SMS_PP_CON_MT_SDCCH点对点短消息成功次数点对点短消息失败次数平均不可用时隙数平均可用TCH数目平均可用SDCCH数目可用的CCCH信道平均数目AV_NB_BUSY_CS_TSNB_MAX_SIMUL_BUSY_CS_TSSDCCH连续忙的最大数目干扰带一TCH的平均数目干扰带二TCH的平均数目干扰带三TCH的平均数目干扰带四TCH的平均数目干扰带五TCH的平均数目TCH全忙的时间全速率TCH占用次数半速率TCH占用次数TIME_TRX_FR_BUSY半速率TCH占用时长TIME_TRX_GSM_FR_BUSYTIME_TRX_GSM_HR_BUSYTIME_TRX_DCS_FR_BUSYTIME_TRX_DCS_HR_BUSYTCH连续忙的时间（多频手机占用）NB_TIMES_SDCCH_BUSY(110)SDCCH全忙的时间BSC间入小区切换失败次数（BSC和MSC间A口信道状态不匹配）NB_TCH_HO_ATPT_26_BadQualHRNB_TCH_HO_ATPT_27_GoodQualFRNB_TCH_HO_ATPT_28_FastTrafficNB_TCH_EMERGENCY_HO_PRESERVATIONNB_TCH_HO_ATPT_29_TFONB_OUT_INTER_PLMN_TCH_HO_REQNB_OUT_INTER_PLMN_TCH_HO_ATPTNB_OUT_INTER_PLMN_TCH_HO_SUCCNB_INC_INTER_PLMN_TCH_HO_REQNB_INC_INTER_PLMN_TCH_HO_ATPTNB_INC_INTER_PLMN_TCH_HO_SUCCNB_TCH_HO_REQ_30_ReturnCSZoneNB_TCH_HO_ATPT_30_ReturnCSZoneNB_TCH_HO_REQ_30_ABORTEDBSC间入切换失败（由于拥塞或信道不匹配）BSC间入切换失败（由于拥塞）BSC内入切换失败（由于拥塞或信道不匹配）BSC内直接重试失败（由于拥塞或信道不匹配）NB_INTRA_TCH_HO_EXEC_FAIL_REV同心圆切换请求次数（内圆上行信号弱）同心圆切换请求次数（内圆下行信号弱）同心圆切换请求次数（外圆上下行信号强）SDCCH切换尝试次数（含强制直接重试）TCH拥塞次数（无队列）TCH拥塞次数（队列满）TCH拥塞次数（T11超时）TCH拥塞次数（队列拒绝）切换掉话次数BSC间入小区切换成功次数BSC间入小区切换失败次数（MS接入失败）BSC间出小区切换请求次数BSC间出小区切换成功次数BSC间出小区切换失败后返回次数BSC间出小区切换失败没有返回次数BSC间出小区切换尝试次数BSC间出小区切换成功次数BSC内入小区切换失败次数（MS接入失败）BSC内出入小区切换请求次数BSC内出入小区切换成功次数BSC内出切换失败后返回次数BSC内出小区切换失败后没有返回次数BSC内出小区切换尝试次数小区内切换成功次数小区内切换失败后没有返回次数小区内切换失败后返回次数切换尝试次数（由于上行质量差）切换尝试次数（由于上行电平差）NB_HO_4_TooLowLevUpNB_HO_5_TooLowLevUp切换尝试次数（由于TA过大）切换尝试次数（由MSC触发）小区内切换尝试次数（上行干扰过大）小区内切换尝试次数（下行干扰过大）切换尝试次数（由于PBGT原因）切换尝试次数（层间切换）NB_TCH_FR_REQNB_TCH_DR_REQNB_TCH_DR_EFR_REQNB_TCH_AMR_REQNB_TCH_DATA_REQNB_TCH_FR_EFR_REQNB_TCH_NO_FR_REQNB_TCH_NOR_FR_ALLOCNB_TCH_NOR_HR_ALLOCNB_TCH_NOR_EFR_ALLOCTCH分配次数NB_TCH_NOR_AMR_FR_ALLOCNB_TCH_NOR_AMR_HR_ALLOCNB_TCH_NOR_DATA_ALLOCMS（E-GSM band）接入次数（除位置更新）出切换请求次数出切换请求失败次数（由于拥塞）出切换成功次数出切换失败后返回次数出切换失败后没有返回的次数直接重试成功次数（BSC间入切换）入小区切换成功次数（包括BSC间直接重试）TCH分配成功次数NB_TCH_DROP_EST_PHAS_ELF_TRX通话过程高中TCH掉话次数（由于远端解码失败）TCH分配失败次数（由于MS接入失败）MICROCELL小区切换尝试次数（由于连续收到BAD SACCH) MICROCELL小区切换尝试次数（由于上行电平低）MICROCELL小区切换尝试次数（由于下行电平低）MICROCELL小区层间切换尝试次数AV_NB_AVAIL_DYN_TSAV_NB_BUSY_DYN_TCHMAX_NB_BUSY_DYN_TCHAV_NB_BUSY_DYN_SDCCHMAX_NB_BUSY_DYN_SDCCHTIME_SDCCH_CONGESTIONNB_UL_SINGLE_BLOCK_SIG_RACHNB_UL_ONE_PHASE_SIG_RACHNB_CHANNEL_ASSIGN_DL_AGCHNB_CHANNEL_ASSIGN_DL_PCHBSC间SDCCH入切换失败（由于拥塞）TCH分配失败次数（由于拥塞）BSC间入小区切换请求次数BSC间入小区切换尝试次数BSC内入小区切换请求次数NB_INC_HO_ATPT双频MS接入次数（除位置更新）小区间切换请求次数小区间切换尝试次数寻呼次数立即指配下发次数信道请求次数立即指配拒绝次数（由于拥塞）NB_Suspend_reqNB_Suspend_failNB_Suspend_succBSC内入小区SDCCH切换失败次数（由于拥塞）抢占TCH请求次数（在TCH分配以及BSC间入切换和直接重试中）抢占TCH成功次数（在分配以及BSC间入切换和直接重试中）呼叫过程中TCH抢占次数呼叫过程中TCH抢占次数(直接重试成功）可以用于抢占的TCH数（在TCH分配以及BSC间入切换和直接重试中）NB_INC_EXT_3G_2G_HO_REQNB_INC_EXT_3G_2G_HO_SUCCNB_INC_EXT_3G_2G_HO_EXEC_FAIL_MS_ACCNB_INC_EXT_3G_2G_HO_ATPTNB_INC_EXT_TCH_3G_2G_HO_EMERGENCY_REQNB_INC_EXT_TCH_3G_2G_HO_REQNB_INC_EXT_TCH_3G_2G_HO_PREP_FAIL_3GCONG TIME_3G_HOReject_HLNB_LCS_REQNB_LCS_SUCCNB_LCS_FAIL_LBNB_LCS_ABORTTIME_SPDCH_LIMIT_HIGH_LOADNB_2G_3G_HO_2NB_2G_3G_HO_3NB_2G_3G_HO_4NB_2G_3G_HO_5NB_2G_3G_HO_6NB_2G_3G_HO_7NB_2G_3G_HO_8NB_2G_3G_HO_9NB_2G_3G_HO_10NB_2G_3G_HO_11NB_AGCH_USEFUL_BLOCKS_SENTNB_PCH_USEFUL_BLOCKS_SENTNB_BUSY_RACH_SLOTSNB_CHANNEL_RQ_RADIONB_ASSIGN_CMD_RECEIVED_ABISNB_ASSIGN_CMD_DISCARDEDNB_PAGING_CMD_RECEIVED_ABISNB_PAGING_CMD_DISCARDEDNB_DTM_UL_TCH_ASS_ATPTNB_DTM_DL_TCH_ASS_ATPTNB_DTM_UL_PACKET_ASS_ATPTNB_DTM_DL_PACKET_ASS_ATPTNB_DTM_UL_TCH_ASS_EXEC_FAIL_RADIONB_DTM_DL_TCH_ASS_EXEC_FAIL_RADIONB_TCH_DROP_CAUSE_TOO_LOW_QUALITY_ULNB_TCH_DROP_CAUSE_TOO_LOW_LEVEL_ULNB_TCH_DROP_CAUSE_TOO_LOW_QUALITY_DLNB_TCH_DROP_CAUSE_TOO_LOW_LEVEL_DLNB_TCH_DROP_CAUSE_LONG_MS_BS_DISDANCENB_TCH_DROP_CAUSE_TOO_SHORT_MS_BS_DISTANCE NB_TCH_DROP_CAUSE_TOO_HIGH_INTERFERENCE_UPL NB_TCH_DROP_CAUSE_TOO_HIGH_INTERFERENCE_DOW NB_TCH_DROP_OTHER_CAUSESNB_ABIS_PAGING_MESSAGE_RECEIVEDReserve_cell_2Reserve_cell_3Reserve_cell_4Reserve_cell_5Reserve_cell_6Reserve_cell_7Reserve_cell_8Reserve_cell_9Reserve_cell_10Reserve_cell_11Reserve_cell_12Reserve_cell_13Reserve_cell_14Reserve_cell_15Reserve_cell_16Reserve_cell_17Reserve_cell_18Reserve_cell_19Reserve_cell_20Reserve_cell_21Reserve_cell_22Reserve_cell_23Reserve_cell_24Reserve_cell_25Reserve_cell_26Reserve_cell_27Reserve_cell_28Reserve_cell_29Reserve_cell_30Reserve_cell_31Reserve_cell_32Reserve_cell_33Reserve_cell_34Reserve_cell_35NB_MS_REPEATED_ACCH_CAPABLENB_CALLS_RFACCH_ACTIVATEDNB_CALLS_RSACCH_ACTIVATEDNB_AMR_TCH_DROP_RLF_TRXNB_AMR_TCH_DROP_RLF_TRX_RSACCH NB_AMR_TCH_DROP_OUT_HO_TRXNB_AMR_TCH_DROP_OUT_HO_TRX_RFACCH。

hcs12 mc9s12zvm-family 參考手冊说明书

MC9S12ZVM-Family Reference Manual HCS12MicrocontrollersTo provide the most up-to-date information, the document revision on the Internet is the most current. A printed copy may be an earlier revision. To verify you have the latest information available, refer to :.This document contains information for all constituent modules, with the exception of the S12Z CPU. For S12ZCPU information please refer to the CPU S12Z Reference Manual.S12ZVM32 and S12ZVM16 specific information is preliminary until these devices are qualified.The following revision history table summarizes changes contained in this document. The individual module sections contain revision history tables with more detailed information.Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty,representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”, must be validated for each customer application by customer’s technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or Table 0-1. Revision History DateRevision Description 12 Dec 2013 1.2 Replaced generic 8-channel TIM section with specific 4-channel TIM sectionTextual enhancements and corrections throughoutUpdated electrical parameter section and added parameters for temperataures up to 175°C- Added Table A-5- Merged Table A-8 and A-9 into Table A-9. Values updated. .- Table A-15. Parameter #2. max changed from 800uA to 1050uA- Table A-15. Inserted new C class parameter ISUPS at 85C. typ. 80uA- Appendices B,D and E. Updated parameter values based on characterization results.- Appendix C. Added parameter values for range above T=150°C- Table F-3. Merged rows 2a and 2b. Merged rows 6a and 6b.- Appendix G. Merged tables G-1 and G-2.- Tables H-1 and H-2 values updated.20 JAN 2014 1.3Updated Stop mode description for BDC enabled caseRemoved false reference to modified clock monitor assert frequencyUpdated electricals for 175°C Grade0- Removed temperature range disclaimer from electrical parameter spec.footer- Added sentence above table A-3- Table D-1. LINPHY parameters 12a and 12b replaced by 12a, 12b and 12c-- Table D-2. LINPHY wake up pulse over whole temperature range- Table E-1. FET gate charge spec. updated22 MAY2014 1.4Updated family derivative table for S12ZVML32, S12ZVM32 and S12ZVM16 devicesAdded 64KB, 32KB and 16KB derivative information to flash module chapterAdded pin routing options for S12ZVM32 and S12ZVM16 devicesAdded HV Phy information for the S12ZVM32 and S12ZVM16 derivativesUpdated Part ID assignment table and ordering information for S12ZVM32 and S12ZVM16Corrected PLL VCO maximum frequency specificationChanged V LVLSA maximum from 7V to 6.9VAdded electrical parameter for HD division ratio through the phase multiplexerCorrected preferred VRL reference from VRL_1 to VRL_0Included NVM timing parameters for the S12ZVM32 and S12ZVM16 devicesAdded GDU S12ZVM32 and S12ZVM16 specific differences and electrical specificationsAdded references to f WSTAT Added VDDX short circuit fall back current and temperature/input dependency specs.Chapter1Device Overview MC9S12ZVM-Family1.1Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 1.2Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 181.2.1MC9S12ZVM-Family Member Comparison . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 181.2.2Functional Differences Between N06E and 0N95G Masksets . . . . . . . . . . . . . . . . . . . . 191.2.3Functional Differences Between 1N95G and 0N95G Masksets . . . . . . . . . . . . . . . . . . . 20 1.3Chip-Level Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 1.4Module Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 211.4.1S12Z Central Processor Unit (CPU) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 211.4.2Embedded Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 221.4.3Clocks, Reset & Power Management Unit (CPMU) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 231.4.4Main External Oscillator (XOSCLCP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 241.4.5Timer (TIM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 241.4.6Pulse width Modulator with Fault protection (PMF) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 241.4.7Programmable Trigger Unit (PTU) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 241.4.8LIN physical layer transceiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 251.4.9Serial Communication Interface Module (SCI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 251.4.10Multi-Scalable Controller Area Network (MSCAN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 251.4.11Serial Peripheral Interface Module (SPI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 261.4.12Analog-to-Digital Converter Module (ADC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 261.4.13Supply V oltage Sensor (BATS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 261.4.14On-Chip V oltage Regulator system (VREG) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 261.4.15Gate Drive Unit (GDU) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 271.4.16Current Sense . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 271.4.17High V oltage Physical Interface (S12ZVM32, S12ZVM16) . . . . . . . . . . . . . . . . . . . . . . 27 1.5Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 1.6Device Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 291.6.1Flash Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 301.6.2Part ID Assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 1.7Signal Description and Device Pinouts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 321.7.1Pin Assignment Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 321.7.2Detailed External Signal Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 331.7.3Power Supply Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 391.7.4Package and Pinouts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 1.8Internal Signal Mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 461.8.1ADC Connectivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 471.8.2Motor Control Loop Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 481.8.3Device Level PMF Connectivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 481.8.4BDC Clock Source Connectivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 481.8.5LINPHY Connectivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 481.8.6HVPHY Connectivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 481.8.7FTMRZ Connectivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 491.8.8CPMU Connectivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49 1.9Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 491.9.1Chip Configuration Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 491.9.2Debugging Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 501.9.3Low Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 1.10Security . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 511.10.1Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 511.10.2Securing the Microcontroller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 511.10.3Operation of the Secured Microcontroller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 521.10.4Unsecuring the Microcontroller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 521.10.5Reprogramming the Security Bits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 531.10.6Complete Memory Erase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 1.11Resets and Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 541.11.1Resets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 541.11.2Interrupt Vectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 541.11.3Effects of Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57 1.12Module device level dependencies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 581.12.1CPMU COP Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 581.12.2CPMU High Temperature Trimming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 581.12.3Flash IFR Mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58 1.13Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 591.13.1ADC Calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 591.13.2SCI Baud Rate Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 591.13.3Motor Control Application Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 601.13.4BDCM Complementary Mode Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 681.13.5BLDC Six-Step Commutation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 721.13.6PMSM Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 741.13.7Power Domain Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78Chapter2Port Integration Module (S12ZVMPIMV2)2.1Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 832.1.1Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 832.1.2Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84 2.2External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84 2.3Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 882.3.1Register Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 892.3.2PIM Registers 0x0200-0x020F . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 932.3.3PIM Generic Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1012.3.4PIM Generic Register Exceptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109 2.4Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1102.4.1General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1102.4.2Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1112.4.3Pin I/O Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1122.4.4Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1132.4.5Pin interrupts and Key-Wakeup (KWU) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1142.4.6Over-Current Interrupt . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1152.5Initialization and Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1152.5.1Port Data and Data Direction Register writes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1152.5.2Over-Current Protection on EVDD1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115Chapter3Memory Mapping Control (S12ZMMCV1)3.1Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1173.1.1Glossary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1183.1.2Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1183.1.3Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1183.1.4Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1193.1.5Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119 3.2External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119 3.3Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1203.3.1Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1203.3.2Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120 3.4Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1253.4.1Global Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1253.4.2Illegal Accesses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1273.4.3Uncorrectable ECC Faults . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128Chapter4Interrupt (S12ZINTV0)4.1Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1294.1.1Glossary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1304.1.2Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1304.1.3Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1314.1.4Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131 4.2External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132 4.3Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1324.3.1Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1324.3.2Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133 4.4Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1384.4.1S12Z Exception Requests . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1384.4.2Interrupt Prioritization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1384.4.3Priority Decoder . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1394.4.4Reset Exception Requests . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1394.4.5Exception Priority . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1404.4.6Interrupt Vector Table Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 140 4.5Initialization/Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1404.5.1Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1404.5.2Interrupt Nesting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1414.5.3Wake Up from Stop or Wait Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142Chapter5Background Debug Controller (S12ZBDCV2)5.1Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1435.1.1Glossary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1435.1.2Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1445.1.3Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1445.1.4Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 146 5.2External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 147 5.3Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1475.3.1Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1475.3.2Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 148 5.4Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1525.4.1Security . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1525.4.2Enabling BDC And Entering Active BDM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1525.4.3Clock Source . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1535.4.4BDC Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1535.4.5BDC Access Of Internal Resources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1695.4.6BDC Serial Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1725.4.7Serial Interface Hardware Handshake (ACK Pulse) Protocol . . . . . . . . . . . . . . . . . . . . 1755.4.8Hardware Handshake Abort Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1775.4.9Hardware Handshake Disabled (ACK Pulse Disabled) . . . . . . . . . . . . . . . . . . . . . . . . . 1785.4.10Single Stepping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1795.4.11Serial Communication Timeout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 180 5.5Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1805.5.1Clock Frequency Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 180Chapter6S12Z Debug (S12ZDBGV2) Module6.1Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1816.1.1Glossary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1826.1.2Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1826.1.3Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1826.1.4Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1836.1.5Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 184 6.2External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1846.2.1External Event Input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1846.2.2Profiling Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 185 6.3Memory Map and Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1856.3.1Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1856.3.2Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 188 6.4Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2096.4.1DBG Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2096.4.2Comparator Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2096.4.3Events . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2136.4.4State Sequence Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2156.4.5Trace Buffer Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2166.4.6Code Profiling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2256.4.7Breakpoints . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 229 6.5Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2306.5.1Avoiding Unintended Breakpoint Re-triggering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2306.5.2Debugging Through Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2306.5.3Breakpoints from other S12Z sources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2316.5.4Code Profiling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 231Chapter7ECC Generation Module (SRAM_ECCV1)7.1Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2337.1.1Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 233 7.2Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2337.2.1Register Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2337.2.2Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 235 7.3Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2397.3.1Aligned 2 and 4 Byte Memory Write Access . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2407.3.2Other Memory Write Access . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2407.3.3Memory Read Access . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2417.3.4Memory Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2417.3.5Interrupt Handling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2417.3.6ECC Algorithm . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2427.3.7ECC Debug Behavior . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 242Chapter8S12 Clock, Reset and Power Management Unit (S12CPMU_UHV_V6)8.1Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2458.1.1Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2468.1.2Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2488.1.3S12CPMU_UHV_V6 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 251 8.2Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2538.2.1RESET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2538.2.2EXTAL and XTAL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2538.2.3VSUP — Regulator Power Input Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2538.2.4VDDA, VSSA — Regulator Reference Supply Pins . . . . . . . . . . . . . . . . . . . . . . . . . . 2538.2.5VDDX, VSSX— Pad Supply Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2538.2.6BCTL— Base Control Pin for external PNP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2548.2.7VSS1,2 — Core Ground Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2548.2.8VDD— Core Logic Supply Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2548.2.9VDDF— NVM Logic Supply Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2548.2.10API_EXTCLK — API external clock output pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2548.2.11TEMPSENSE — Internal Temperature Sensor Output V oltage . . . . . . . . . . . . . . . . . . 254。

MC10H116中文资料

VBB* When input pin with bubble goes positive it’s respective output pin with bubble goes positive. *VBB to be used to supply bias to the MC10H116 only and bypassed (when used) with 0.01 µF to 0.1 µF capacitor to ground (0 V). VBB can source < 1.0 mA. The MC10H116 is designed to be used in sensing differential signals over long lines. The bias supply (VBB) is made available to make the device useful as a Schmitt trigger, or in other applications where a stable reference voltage is necessary. Active current sources provide these receivers with excellent common–mode noise rejection. If any amplifier in a package is not used, one input of that amplifier must be connected to VBB to prevent unbalancing the current–source bias network. The MC10H116 does not have internal–input pulldown resistors. This provides high impedance to the amplifier input and facilitates differential connections. Applications: • Low Level Receiver • Voltage Level • Schmitt Trigger Interface VCC1 = Pin 1 VCC2 = Pin 16 VEE = Pin 8

MCB 101 - 通用输入输出选项模块操作指南说明书

MCB 101 - General Purpose I/O Option ModuleOperating Instructions December 2008TR200BAS-SVX28A-ENBAS-SVX28A-ENNote that warnings, cautions and notices appear at appropriate intervals throughout this manual. Warnings are provide to alert installing contractors to potential hazards that could result in personal injury or death. Cautions are designed to alert personnel to hazardous situations that could result in personal injury, while notices indicate a situation that could result in equipment or property-damage-only accidents.Your personal safety and the proper operation of this machine depend upon the strict observance of these precautions.Warnings, Cautions and Notices appear at appropriate sections throughout this literature. Read these carefully.Indicates a potentially hazardous situation which, if not avoided, could result in death or serious injury.Indicates a potentially hazardous situation which, if not avoided, could result in minor or moderate injury. It could also be used to alert against unsafe practices.NOTICEIndicates a situation that could result in equipment or property-damage only accidents.NoteIndicates something important to be noted by the reader.✮Indicates default settingIntroductionThis instruction describes the General Purpose I/O option MCB 101 for use in the TR200 expanding the number of input/output in the frequency converter.The MCB 101 option includes 3 digital inputs, 2 analog inputs, 2 digital outputs and 1 analog output.SW firmware version to be installed in the drive control card must be version 3.00 or later versions for series, and version 1.1x for TR200 series. Check par.15-43 Software Version for firmware version.Code Numbers To Be Used At Ordering The Complete Kit For UpgradesStandard version code no. 130B1125.Coated version code no. 103B1212.Illustration 1. 1: Parts for coated/non-coated code nos.Galvanic Isolation in the MCB 101Digital/analog inputs are galvanically isolated from other inputs/outputs on the MCB 101 and in the control card of the frequency converter. Digital/analog outputs in the MCB 101 are galvanically isolated from other inputs/ outputs on the MCB 101, but not from these on the control card of the drive.If the digital inputs 7, 8 or 9 are to be switched by use of the internal 24 V power supply (terminal 9) the connection between terminal 1 and 5 which is illustrated in the drawing has to be established.Digital Inputs - Terminal X30/1-4Analog Voltage Inputs - Terminal X30/10-12Digital Outputs - Terminal X30/5-7Analog Outputs - Terminal X30/5+8Mounting of Option Modules in Slot BThe power to the frequency converter must be disconnected.For A2, A3 and B3 enclosures:•Remove the keypad, the terminal cover, and the keypad frame from the frequency converter.•Fit the MCB 101 option card into slot B.•Connect the control cables and relieve the cable by the enclosed cable strips.Remove the knock out in the extended keypad frame delivered in the option set, so that the option will fit under the extended keypad frame.•Fit the extended keypad frame and terminal cover.•Fit the keypad or blind cover in the extended keypad frame.•Connect power to the frequency converter.•Set up the input/output functions in the corresponding parameters, as mentioned in this document.For A5, B1, B2, B4, C1, C2, C3, C4, D, E and F enclosures:•Remove the keypad and the keypad cradle•Fit the MCB 101 option card into slot B•Connect the control cables and relieve the cable by the enclosed cable strips•Fit the cradle•Fit the keypadA2, A3 and B3 enclosures A5, B1, B2, B4, C1, C2, C3, C4, D, E and F enclosuresMounting Guidelines - Step By StepThese step-by-step instructions describe how to mount the control cables:•The power to the frequency converter must be disconnected.•Remove the keypad, the terminal cover, and the keypad frame from the frequency converter.•Fit the MCB 101 option card into slot B.•Connect the control cables and relieve the cable by the enclosed cable strips.•Remove the knock out in the extended keypad frame, so that the option will fit under the extended keypad frame.•Fit the extended keypad frame and terminal cover.•Fit the keypad or blind cover in the extended keypad frame.•Connect power to the frequency converter.•Set up the input/output functions in the corresponding parameters, as mentioned in the Programming Guide.How To Mount CablesThe graphic below illustrates how to mount the cables.Rev. 2008-12-09130R0477MI11B102*MI11B102*Trane has a policy of continous product and product data improvement and reserves the right to change design and specifications without notice.For more information, contact your local Trane ***********************************Literature Order Number BAS-SVX28A-EN DateDecember 2008Supersedes。

MC200G系列说明书v2.11

目录
4.6 变频器试运行 ·····································································34 4.6.1 变频器试运行前的检查项目 ················································34 4.6.2 变频器试运行的顺序 ·························································34 4.6.3 变频器试运行的操作 ·························································35 第五章功能参数总表····························································37 第六章详细功能介绍····························································56 F0 组基本功能组 ·····································································56 F1 组电机参数组 ·····································································61 F2 组矢量控制组 ·····································································62 F3 组 V/F 控制组······································································64 F4 组输入端子组 ·····································································67 F5 组输出端子组 ·····································································77 F6 组起停控制组 ·····································································82 F7 组键盘与显示组 ··································································88 F8 组辅助功能组 ·····································································91 F9 组保护与故障组 ··································································96 FA 组 PID 功能组 ·····································································99 FB 组摆动频率运行组 ·····························································106 FC 组简易 PLC 及多段速功能组 ················································107 FD 组串行通讯功能组 ·····························································112 FE 组保留功能组····································································113 FF 组厂家参数组····································································113 FH 组用户密码组 ···································································113 第七章故障对策································································114 7.1 故障报警及对策一览表 ························································114 7.2 预警信息 ··········································································117 7.3 密码解除 ··········································································118 第八章保养、维护·····························································119 8.1 日常保养及维护 ·································································119 8.2 定期维护 ··········································································120 8.3 变频器易损器件更换 ···························································121 8.4 变频器的存贮 ····································································122

摩菲控制器MC系列说明书

说明MC 系列 Millennium 控制器是一种以微机为基础的监视、控制和数据采集系统。

MC 系列适用于机动压缩机及其它多种工业设备控制。

MC 系列作为成套控制设备的核心，可无间断地监视输入信号和设置点，并相应控制输出，以保持设备正常运行。

如果输入发生超限，控制器会显示关键的设备运行参数或停机故障信息。

除监视，停机和控制功能外，MC 系列控制器还可进行重要的设备及操作数据的本地以及远程通信。

此高级系统提供了多种远程通信选择。

对于可编程逻辑控制器、PC 和 SCADA 系统均提供了一个串行链接。

无线电和卫星通信通过 MODBUS RTU 协议提供。

设备运行时间和历史数据趋势记录为运行分析和保养提供了有效的工具。

此外，停机快照功能能让操作人员全面了解系统停机时的完整状况。

摩菲公司 (Murphy) 可为您定制设计成套控制设备，以满足您的具体规格要求。

此外，还可提供多种非常经济实惠的预设计系统。

基本组件MC 系列由一个显示模块、一个带有连接电缆的电源，以及各种扩展模块和相应电缆组成。

控制器显示 PC 模块MCH-V-M ：586 兼容处理器、100 MHz ；8MB RAM ；VFD 显示屏电源MCPS-A2：带两路模拟输出。

I/O 扩展模块C267：8 路数字输入、7 路模拟输入、电源监视、8 路数字输出。

9 – 28 伏直流，2.25 – 11.2 瓦，不包括最大 18 安的额外输出。

C277：18 路热电偶或 4 – 20 毫安电流输入。

9 至 28 伏直流，0.6 瓦C287：9 至 28 伏直流，3 – 5 瓦，包括4 – 20 毫安输出。

电缆部件MCCA72：电源线部件。

MC 系列通用规格电源输入：10 – 32 伏直流，最大 26 瓦。

操作温度：-40 至 85°C （-40 至 185°F ）底座装置及VFD 显示 -40 至 85°C （-40 到185°F ）。

Mc10遥控器说明书

Mc10遥控器说明书
一、数字式自动搜索适用机型
1、打开空调机电源。

2、将遥控器正对着空调机接收头，循环按“设置”键，直到空调机自动开启、关闭，按“确认”键。

3、设置完毕。

打开空调机电源、将遥控器对向空调机、循环按“设置”键否空调机自动开启、关是按“确认”键、自动查找代码设置完成。

二、手动设置步骤
1、从“代码表”查出你所需遥控的空调机对应的机型代码，并打开空调机电源。

2、连续（间断）按“设置”键，直至所需代码显示在窗口上并闪烁。

注：此机型代码即为您空调机所对应的代码。

3、按确认键，机型代码将停止闪烁，设置完毕，这样本遥控器就可以遥控您所选的空调机了。

MC11等级表正文管道代号及厚度(煤气化装置)

MC11等级表管道代号及厚度（煤气化装置）一、管道代号说明在煤气化装置中，MC11等级表中的管道代号采用国际通用的标识方法，以便于工程技术人员快速识别和选用。

管道代号由字母和数字组成，具体含义如下：1. 字母部分：代表管道材质。

例如，C代表碳钢，S代表不锈钢，A代表铝合金等。

2. 数字部分：代表管道公称直径。

例如，10代表公称直径为10mm，100代表公称直径为100mm。

二、管道厚度标准1. 碳钢管道（C系列）公称直径1050mm，壁厚为2.0mm；公称直径65100mm，壁厚为2.5mm；公称直径125200mm，壁厚为3.0mm；公称直径250400mm，壁厚为4.0mm。

2. 不锈钢管道（S系列）公称直径1050mm，壁厚为1.5mm；公称直径65100mm，壁厚为2.0mm；公称直径125200mm，壁厚为2.5mm；公称直径250400mm，壁厚为3.5mm。

3. 铝合金管道（A系列）公称直径1050mm，壁厚为1.2mm；公称直径65100mm，壁厚为1.6mm；公称直径125200mm，壁厚为2.0mm；公称直径250400mm，壁厚为2.8mm。

三、管道选材注意事项3. 压力等级：根据煤气化装置的设计压力，选择相应压力等级的管道，确保管道在运行过程中不会因压力过大而泄漏。

四、管道安装要求1. 管道预制：在安装前，应根据设计图纸进行管道预制，确保管道尺寸、形状符合要求。

2. 焊接质量：管道焊接是关键环节，必须由具备相应资质的焊工进行，确保焊接质量。

3. 支吊架设置：合理设置管道支吊架，保证管道在运行过程中不发生位移，减少振动。

4. 清洁度：管道安装前，应彻底清理内部杂质，确保管道内壁光滑，防止介质流动受阻。

五、管道检验与验收1. 外观检查：检查管道表面是否有划痕、凹坑等缺陷，确保管道外观完好。

2. 尺寸验收：对照设计图纸，检查管道的直径、壁厚、长度等尺寸是否符合要求。

3. 压力试验：对管道系统进行压力试验，验证管道系统的密封性能和承压能力。

MC10使用说明书

143
模拟量电流输出(AO) 测量范围负载电阻精度 4 ~ 20mA
42
＜350Ω 1%
70
适用性条件外形尺寸(mm)(适用标准DIN43700) 防护等级(适用标准GB/T4208) 重量(g) 工作温度范围温度范围工作电源功耗基本模块72(W) x 124(L) x 127(H) 显示模块72(W) x 72(W) x 57(D) IP54(显示单元前面板)， IP40(外壳) 300 基本模块： -10 ~ 60℃ 显示模块： -10 ~ 60℃ 5 ~ 95%(无结露) 85Vac ~ 276Vac/100Vdc ~ 250Vdc 2W
订货须知
详细见样本
6
7
perfect in form and function
神形合一，完美呈现
安装说明和接线
显示模块及其安装图
68 1
实测 SOE 分合闸 RESET THD 报警设置
C1 C2 C3 C4 C5 C6
C1 : ID C2 : IC C3 : IB C4 : IA C5 : AGND C6 : AGND
4 4 4 5~6 6 7~8 8 ~ 11 12 ~ 28 29 ~ 41
恒久不变的品牌理念
● ● ● ●
AEG是德国技术、德国制造的代名词，代表着性能卓越和精密设计 AEG是全球最早将艺术设计和美学引入工业设计的品牌 “Perfekt in Form und Funktion” “神形合一，完美呈现” 是AEG恒久不变的设计理念 AEG品牌旗下产品广泛，涉及你生活的多个方面，汽车、火车、电动工具、电子设备到电子仪器、核电、电力设备、电机、微电子…无不延续着品牌一贯的理念

OMEGA H12012电子比例阀说明书

ߜProgrammable Direct- or Reverse-Acting Control ߜPrecision Control is Achieved via a 10-Bit Converter Controlling a 200 Stepper Revolution MotorߜRugged Construction for Industrial Applications ߜExternal Safety Override Contacts to Open/Close ValveߜNEMA 4 (IP65) Rating for Outdoor UseߜIdeal for Liquid and Gas ApplicationsAn electronically controlledproportioning valve (ECV) will take an electrical input signal (usually 4 to 20 mA) and proportion the amount of flow through a pipe from fully closed to fully open. The OMEGA ®ECV valve features programmable direct-acting orreverse-acting control. Direct-acting means that, as the current signal rises, the valve allows more flow,while reverse-acting will decrease the flow rate with an increasing current signal.These units can also beprogrammed to sense a failure in the current loop and fully close/open the valve when the signal level drops below 3.5 mA.Dry-contact remote switches can be used in conjunction with the standard current signal to provide an alarm signal that fullycloses/opens the valve. An internal 5 Vdc signal is used to sense the state of the external switches.ELECTRONICALLY CONTROLLED PROPORTIONING VALVESThe rugged epoxy-coated aluminum package ensures NEMA 4X (IP66)protection for the powerfulmicroprocessor and servo actuator.Internally, a 10-bit A/D converter is positioning a 200 step/revolution stepper motor for precise flow.The stepper motor is directlyconnected to the valve stem without gearing, thereby eliminating backlash (hysteresis) effects. The valve can also be manually controlled with a screwdriver.Available with brass or stainless steel body.PV14-SS, $1145,shown much smallerthan actual size.WT = + 4-20BK = - 4-20R = + ExR/W = - Ex(Does not operateif 4-20 is reversed)GN to Blue = Full OpenG/W to Blue = Full ClosePV series valve (with cover removed).CANADA www.omega.ca Laval(Quebec) 1-800-TC-OMEGA UNITED KINGDOM www. Manchester, England0800-488-488GERMANY www.omega.deDeckenpfronn, Germany************FRANCE www.omega.fr Guyancourt, France088-466-342BENELUX www.omega.nl Amstelveen, NL 0800-099-33-44UNITED STATES 1-800-TC-OMEGA Stamford, CT.CZECH REPUBLIC www.omegaeng.cz Karviná, Czech Republic596-311-899TemperatureCalibrators, Connectors, General Test and MeasurementInstruments, Glass Bulb Thermometers, Handheld Instruments for Temperature Measurement, Ice Point References,Indicating Labels, Crayons, Cements and Lacquers, Infrared Temperature Measurement Instruments, Recorders Relative Humidity Measurement Instruments, RTD Probes, Elements and Assemblies, Temperature & Process Meters, Timers and Counters, Temperature and Process Controllers and Power Switching Devices, Thermistor Elements, Probes andAssemblies,Thermocouples Thermowells and Head and Well Assemblies, Transmitters, WirePressure, Strain and ForceDisplacement Transducers, Dynamic Measurement Force Sensors, Instrumentation for Pressure and Strain Measurements, Load Cells, Pressure Gauges, PressureReference Section, Pressure Switches, Pressure Transducers, Proximity Transducers, Regulators,Strain Gages, Torque Transducers, ValvespH and ConductivityConductivity Instrumentation, Dissolved OxygenInstrumentation, Environmental Instrumentation, pH Electrodes and Instruments, Water and Soil Analysis InstrumentationHeatersBand Heaters, Cartridge Heaters, Circulation Heaters, Comfort Heaters, Controllers, Meters and SwitchingDevices, Flexible Heaters, General Test and Measurement Instruments, Heater Hook-up Wire, Heating Cable Systems, Immersion Heaters, Process Air and Duct, Heaters, Radiant Heaters, Strip Heaters, Tubular HeatersFlow and LevelAir Velocity Indicators, Doppler Flowmeters, LevelMeasurement, Magnetic Flowmeters, Mass Flowmeters,Pitot Tubes, Pumps, Rotameters, Turbine and Paddle Wheel Flowmeters, Ultrasonic Flowmeters, Valves, Variable Area Flowmeters, Vortex Shedding FlowmetersData AcquisitionAuto-Dialers and Alarm Monitoring Systems, Communication Products and Converters, Data Acquisition and Analysis Software, Data LoggersPlug-in Cards, Signal Conditioners, USB, RS232, RS485 and Parallel Port Data Acquisition Systems, Wireless Transmitters and Receivers。

MC10H121FNR2G中文资料

MC10H1214−Wide OR−AND/OR−AND GateDescriptionThe MC10H121 is a basic logic building block providing the simultaneous OR−AND/OR−AND−Invert function, useful in data control and digital multiplexing applications. This MECL 10H™ part is a functional/pinout duplication of the standard MECL 10K™ family part, with 100% improvement in propagation delay, and no increase in power− supply current.Features•Propagation Delay, 1.0 ns Typical•Power Dissipation 100 mW/Gate Typical (same as MECL 10K)•Improved Noise Margin 150 mV (Over Operating V oltage and Temperature Range)•V oltage Compensated•MECL 10K Compatible•Pb−Free Packages are Available**For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.See detailed ordering and shipping information in the package dimensions section on page 3 of this data sheet.ORDERING INFORMATIONFigure 1. Logic DiagramFigure 2. Pin AssignmentV CC1A OUT A OUT A1IN A1IN A1IN A2IN V EEV CC2A4IN A4IN A4IN A3IN A3IN A2IN , A3IN A2I N161514131211109123456781513121072V EE = PIN 8643Pin assignment is for Dual −in −Line Package.Table 1. MAXIMUM RATINGSSymbol CharacteristicRating Unit V EE Power Supply (V CC = 0)−8.0 to 0Vdc V I Input Voltage (V CC = 0)0 to V EE Vdc I out Output CurrentContinuous Surge50100mA T A Operating Temperature Range 0 to +75°C T stgStorage Temperature Range PlasticCeramic−55 to +150−55 to +165°C °CMaximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,damage may occur and reliability may be affected.Table 2. ELECTRICAL CHARACTERISTICS (V EE = −5.2 V ±5%) (Note 1)0°25°75°Symbol CharacteristicMinMax MinMax MinMax Unit I E Power Supply Current 292629mA I inHInput Current HighPins 3, 4, 5, 6, 7, 911, 12, 13, 14, 15Pin 10500610295360295360m AI inL Input Current Low 0.50.50.3m A V OH High Output Voltage −1.02−0.84−0.98−0.81−0.92−0.735Vdc V OL Low Output Voltage −1.95−1.63−1.95−1.63−1.95−1.60Vdc V IH High Input Voltage −1.17−0.84−1.13−0.81−1.07−0.735Vdc V ILLow Input Voltage−1.95−1.48−1.95−1.48−1.95−1.45Vdc1.Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has beenestablished. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 linear fpm is maintained. Outputs are terminated through a 50 W resistor to −2.0 V.Table 3. AC CHARACTERISTIC0°25°75°Symbol Characteristic Min Max Min Max Min Max Unit t pd Propagation DelayPin 10 Only Exclude Pin 100.450.551.81.950.450.61.82.00.550.72.22.4nst r Rise Time0.5 1.70.5 1.80.5 1.9ns t f Fall Time0.5 1.70.5 1.80.5 1.9ns NOTE:Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declaredoperating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously.ORDERING INFORMATIONDevice Package Shipping†MC10H121FN PLLC−2046 Units / RailMC10H121FNG PLLC−20(Pb−Free)46 Units / RailMC10H121FNR2PLLC−20500 / Tape & ReelMC10H121FNR2G PLLC−20(Pb−Free)500 / Tape & ReelMC10H121L CDIP−1625 Unit / RailMC10H121M SOEIAJ−1650 Unit / RailMC10H121MG SOEIAJ−16(Pb−Free)50 Unit / RailMC10H121MEL SOEIAJ−162000 / Tape & ReelMC10H121MELG SOEIAJ−16(Pb−Free)2000 / Tape & ReelMC10H121P PDIP−1625 Unit / RailMC10H121PG PDIP−16(Pb−Free)25 Unit / Rail†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.PACKAGE DIMENSIONSSL−MS 0.010 (0.250) NST 20 LEAD PLLC CASE 775−02ISSUE ENOTES:1.DIMENSIONS AND TOLERANCING PER ANSI Y14.5M,1982.2.DIMENSIONS IN INCHES.3.DATUMS −L −, −M −, AND −N − DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE.4.DIMENSION G1, TRUE POSITION TO BE MEASURED AT DATUM −T −, SEATING PLANE.5.DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH.ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE.6.DIMENSIONS IN THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300).DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY .7.DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBARPROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBARINTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635).DIM MIN MAX MIN MAX MILLIMETERSINCHES A 0.3850.3959.7810.03B 0.3850.3959.7810.03C 0.1650.180 4.20 4.57E 0.0900.110 2.29 2.79F 0.0130.0190.330.48G 0.050 BSC 1.27 BSC H 0.0260.0320.660.81J 0.020−−−0.51−−−K 0.025−−−0.64−−−R 0.3500.3568.899.04U 0.3500.3568.899.04V 0.0420.048 1.07 1.21W 0.0420.048 1.07 1.21X 0.0420.056 1.07 1.42Y −−−0.020−−−0.50Z 2 10 2 10 G10.3100.3307.888.38K10.040−−− 1.02−−−____PACKAGE DIMENSIONSSOEIAJ −16CASE 966−01ISSUE ANOTES:1.DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.CDIP −16L SUFFIXCERAMIC DIP PACKAGECASE 620A −01NOTES:1.DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.2.CONTROLLING DIMENSION: INCH.3.DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL.4.DIMENSION F MAY NARROW TO 0.76 (0.030)WHERE THE LEAD ENTERS THE CERAMIC BODY.5THIS DRAWING REPLACES OBSOLETE CASE OUTLINE 620−10.AM0.25 (0.010)T DIM MIN MAX MIN MAX MILLIMETERSINCHES A 0.7500.78519.0519.93B 0.2400.295 6.107.49C −−−0.200−−− 5.08D 0.0150.0200.390.50E 0.050 BSC 1.27 BSC F 0.0550.065 1.40 1.65G 0.100 BSC 2.54 BSC H 0.0080.0150.210.38K 0.1250.170 3.18 4.31L 0.300 BSC 7.62 BSC M 0 15 0 15 N0.0200.0400.51 1.01____PACKAGE DIMENSIONSNOTES:1.DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.2.CONTROLLING DIMENSION: INCH.3.DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL.4.DIMENSION B DOES NOT INCLUDE MOLD FLASH.5.ROUNDED CORNERS OPTIONAL.MDIM MIN MAX MIN MAX MILLIMETERSINCHES A 0.7400.77018.8019.55B 0.2500.270 6.35 6.85C 0.1450.175 3.69 4.44D 0.0150.0210.390.53F 0.0400.70 1.02 1.77G 0.100 BSC 2.54 BSC H 0.050 BSC 1.27 BSC J 0.0080.0150.210.38K 0.1100.130 2.80 3.30L 0.2950.3057.507.74M 0 10 0 10 S0.0200.0400.51 1.01____PDIP −16P SUFFIXPLASTIC DIP PACKAGEON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.PUBLICATION ORDERING INFORMATIONMECL 10H and MECL 10K are trademarks of Motorola, Inc.。

HMC1001 HMC1002 HMC1021 HMC1022单轴双轴磁阻传感器中文说明书

在零读数时无发烫效应
HMC1001
HMC1002
最小值 600 -40 -55 -2
-60 2.5
46 3.0 3 -2800
典型值 5
850
0.1 1 0.05 0.05 2
-15
3.2 29 27 5 2.5 3900 51 1.5 3.2
-3000 -600 ±300 ±10 2500 ±3 ±0.5
垂直轴的影响和温度影响
图 2 内显示的输出响应曲线说明 S/R 脉冲的影响当置位电流脉冲 I 置位被加到 SR+引脚上时输出按照正斜率线作出响应当复位电流脉冲 I 复位被加到 SR-引脚上时输出按照反斜率线作出响应除两个偏置影响之外这些曲线是原始脉冲的镜像
在垂直轴向上图 2 内显示的电桥偏置约为-25mV 这是由于制造过程中电阻匹配不当造成的这种偏置可通过多种方法调整为零最直接的方法是在电桥的一端上加一个分流(并联)电阻强迫两个输出的电压相同这必须在零磁场环境下进行通常在零高斯室内进行
ＨＭＣ１００１－２１０２１－２单轴双轴磁阻传感器
BY 丙寅电子
上海丙寅电子有限公司是美国霍尼韦尔在中国区的特级代理。在磁阻传感器应用领域有丰富的项目支持经验。提供软硬件全套解决方案，如需要任何Honeywell 设计与技术方面的支持可与我们联系，将助您在最短的时间内设计成功。
上海丙寅电子有限公司电话：８６０２１６５０７２６７５传真：８６０２１６５０７５８７８邮箱：ｂｙ０７＠ａｎｏｔｒｏｎ．ｃｏｍ地址：中国上海市虹口区四平路１８８号上海商贸大厦８０１室公司主页：ｈｔｔｐ：／／ｗｗｗ．ｂｉｎｇｙｉｎｄｚ．ｃｏｍ
从 S/R+至 S/R-之间测量

伊顿 HPW 12 信号哨用于干燥和潮湿房间的通用警报器数据表

Sifflet de signalisation HPW 12Sirène universelle pour piècessèches et humidesVue d’ensembleLe sifflet de signalisation HPW 12 est une sirène utilisée à des fins d’avertissement et d’appel. Sonboîtier robuste permet des applications dans despièces sèches et humides, et même à l’extérieur.Le dispositif est entraîné par un puissant électroaimant non polarisé doté d’un poussoir réglable qui touche la membrane 100 à 120 fois par seconde.Le boîtier du sifflet de signalisation est en thermoplastique résistant aux chocs.Le sifflet est fourni sur un raccord d’étanchéitéfileté M20 pour des diamètres de ligne de 8-12 mm.Caractéristiques• Convient également aux applications extérieures • Indice de protection IP 55• Thermoplastique résistant aux chocs•Volume : env. 108 dB(A), à une distance de 1 mPlan générique d’agencement (toutes les dimensions sont en mm)Remarque : l es spécifications, les dimensions, les poids et les tolérances sont des valeurs nominales (standard) et Eaton se réserve le droit de les modifier sans préavis. Aucune responsabilité n’est acceptée pour toute conséquence découlant de l’utilisation.FHF Funke + Huster Fernsig GmbH Gewerbeallee 15-19D-45478 Mülheim an der Ruhr Téléphone +49 (208) 82 68-0Fax +49 (208) 82 68-286https:///signalling © 2022 Eaton Tous droits réservés.Publication n o DSFH088EN/A Juillet 2022Eaton est une marque déposée.Toutes les autres marques appartiennent à leurs propriétaires respectifs. SpécificationsBoîtier Thermoplastique (ABS), résistant aux chocsCouleur GrisIndice de protection IP 55 conformément à la norme CEI 60529Classe de protection IIPresse-étoupes Raccord d’étanchéité fileté M20 pour diamètres de ligne de 8-12 mmBornes de raccordement Sections raccordables : 1,5 mm²Volume Environ 108 dB(A), à une distance de 1 mConditions de fonctionnement En intérieur et en extérieurPosition de fonctionnement Sortie sonore orientée vers le basMode de fonctionnement Fonctionnement continuPlage de températureFonctionnement Entreposage De -20 °C à +60 °C De -30 °C à +80 °CPoids 0,9 kgDonnées de commandeType Désignation Tension nominale Tolérance Courant nominal Code articleHPW 12Sifflet de signalisation 6 VCA, 50 Hz +10/-15 %3,4 A FHF 212 261 01HPW 12Sifflet de signalisation 12 VCA, 50 Hz +10/-15 %1,2 A FHF 212 261 02HPW 12Sifflet de signalisation 24 VCA, 50 Hz +10/-15 %0,65 A FHF 212 261 03HPW 12Sifflet de signalisation 42 VCA, 50 Hz +10/-15 %0,3 A FHF 212 261 04HPW 12Sifflet de signalisation 60 VCA, 50 Hz +10/-15 %0,25 A FHF 212 261 05HPW 12Sifflet de signalisation 110 VCA, 50 Hz +10/-15 %0,15 A FHF 212 261 06HPW 12Sifflet de signalisation 230 VCA, 50 Hz +10/-15 %0,07 A FHF 212 261 07HPW 12Sifflet de signalisation 120 VCA, 60 Hz +10/-15 %0,15 A FHF 212 262 06HPW 12Sifflet de signalisation 240 VCA, 60 Hz +10/-15 %0,07 A FHF 212 262 07HPW 12Sifflet de signalisation 6 VCC +10/-15 %1,0 A FHF 212 261 11HPW 12Sifflet de signalisation 12 VCC +10/-15 %0,6 A FHF 212 261 12HPW 12Sifflet de signalisation 24 VCC +10/-15 %0,3 A FHF 212 261 13HPW 12Sifflet de signalisation 48 VCC +10/-15 %0,24 A FHF 212 261 14HPW 12Sifflet de signalisation 60 VCC +10/-15 %0,15 A FHF 212 261 15HPW 12Sifflet de signalisation 110 VCC +10/-15 %0,08 A FHF 212 261 16HPW 12Sifflet de signalisation 220 VCC +10/-15 %0,05 A FHF 212 261 17Schéma de raccordement。

黑心工程BH112吉他音箱说明书

BH112 Guitar Speaker CabinetUser’s GuideVous avez notre coeur,Pyotr Belov Kevin Van Pamel Walter Hsu 2Rear Panel Connector Plate1. 75W 16 Ohm Parallel 1/4" Jacks: Connect the output of your amplifier (rated up to75W into 16 ohms) to one of these jacks using good quality (non-shielded) speaker cable. Never use (shielded) instrument cable to connect speakers to an amplifier.You can use the other jack to connect a second Blackheart BH112 speaker cabinet in parallel. This will present a total load of 8 ohms to the amplifier (maximum power input = 150 watts rms into 8 ohms).From Power Amplifier34BH112 TECHNICAL SPECIFICATIONSmpedance 16 ohmsPower Rating75 watts Cabinet Construction15-ply, 18 mm thick, void-free birch plywood Speaker SpecsCustom Designed Eminence Blackheart SpeakerBritish Voiced, 12", 1.75" voice coil diameter,38 oz magnet Inputs2 x 1/4" parallel jacks Size (H x W x D)18.6 in/473 mm (including feet) x 18.0 in/460 mm x11.0 in/280 mm Weight 29.75 lb/13.5 kgThe Blackheart BH112 Speaker Cabinet is covered with a durable fabric-backed vinyl material. Wipe it clean with a lint-free cloth. Never spray cleaning agents onto the cabinet. Avoid abrasive cleansers which would damage the finish.Crate continually develops new products, as well as improves existing ones. For this reason, the specificationsand information in this manual are subject to change without notice.“Blackheart” and “Crate” are registered trademarks of LOUD Technologies Inc. All other brand names mentionedare trademarks or registered trademarks of their respective holders and are hereby acknowledged.Service InformationIf you are having a problem with your Blackheart BH112 Speaker Cabinet, you can go to our website () and click on “Heart Surgery” for service information, or call 1-800-898-3211 during business hours (7 am to 5 pm PST, Monday-Friday). If you are out-side of the U.S., contact your local distributor for technical support and service.@2007 LOUD Technologies Inc.16220 Wood-Red Road NE • Woodinville, WA 98072Part No. 0027867 Rev. A 09/07。

M1011手持式压花机说明书

M1011 es una máquina de gofrado manual robusta para gofrar <i>in situ</i> acero inoxidable y aluminio.Oil & GasResistente al calorresistente al fríoRobustoResistente a radicación UVBeneficiosLa punzonadora integrada permite la perforación o la perforación roscada, para colocación de bridas de sujeciónResistente a la temperaturaResistente a las condiciones meteorológicasResistente al agua saladaÁmbito de usoMáquina de gofrado robusta para cintas de aluminio y acero inoxidableSistema de señalización de cables y componentesSeñalización permanente, rápida y sencilla in situPara aplicaciones a la intemperieAvisoEl número 1 no está incluida en la rueda de estampado, en este caso puede utilizarse la letra «I»M1011: Máquina de gofrado, rueda de gofrado, cinta de gofrado de aluminio sin capa adhesiva, cinta de gofrado de acero sin capa adhesiva, maletín de transporte y de protecciónDatos técnicosÚltima actualización (29.12.2021)Clasificación ETIM 5:ETIM 5.0 Class-ID: EC000610Descripción de clase ETIM 5.0: marcador de etiquetas Clasificación ETIM 6:ETIM 6.0 Class-ID: EC000610ETIM 6.0 Class-Description: marcador de etiquetasAviso:Diámetro de troquelado: 2 mmCaracteres disponibles: A-Z, 2-9, -, .General:Altura del rotulado: 4,7 mmMaterial:Acero inoxidable: 14.301 (norma EN), SAE grado 304Espesor de las cintas: 0,12 mmNotaLas fotografías e imágenes no son a escala ni deben considerarse representaciones fieles de los respectivos productos. Precios netos sin IVA ni recargos. Venta a clientes profesionales.El período de garantía es de 1 año, pero podría ampliarse con el registro de su producto en la página de DYMO®Última actualización (29.12.2021)INFORMACIÓN SOBRE EL PRODUCTOMáquina para grabado manual M1011Última actualización (29.12.2021)Product Management Puede encontrar los datos técnicos actualizados en la ficha técnica correspondiente.PN 0456 / 02_03.16Referencia Denominación Altura del rotulado en mm Anchura en mm Longitud en m Unid. de embalaje61742670Máquina de gofrado M10114,7--161742710Cinta de gofrado de aluminio sin capa adhesiva-124,8161742720Cinta de gofrado de aluminio con capa adhesiva-123,65161742700Cinta de gofrado de acero inoxidable -126,41©2021 Lapp Group - Reservado el derecho a realizar cambios técnicos。

宁波LG 121H 物性表

测试方法性能拉伸强度延伸率弯曲强度弯曲模数 Izod 1/4″,缺口冲击强度洛氏硬度热变形 18.6kg/cm2 温度维卡 5kg,50℃/nr 软化点流动系数光泽度白色度比重吸水性模具收缩率燃烧性 UL94 HB HB D955 0.3-0.5 % 0.3-0.5 % 0.3-0.5 % 220℃/10kg 45Ο 23℃ 23℃,24h D1238 青色反射率法
公制 SC 数值 500 18 800 24500 21 单位 kg/cm2 % kg/cm2 kg/cm2 Kg.cm/cm
国际标准数值 49 18 78 2402 20.6 单位 MPa % MPa MPa KJ/m2 ℃ 数值
英制单位 psi % psi psi ft-lb/in
测试条件 50mm/min 50mm/min 5mm/min 5mm/min
22 100 56 1.05 0.3
g/10min g/cm3 %
22 100
g/10min 56
22 100 1.05 0.3
g/10min 56 g/cm3 %
D792 D570
R1183 62
1.05 0.3
g/cm3 %
ASTM D638M D638M D790M D790M D256
R527 R527 178 178 R180/1A
7250 18 11760 355250 3.9
R-Scale
D785 D259
Feb-39 751.09 92
℃
-
360B
103
℃
103
℃
103
℃
1133 -
宁波LG甬兴化工有限公司 ABS HI-121H 物性指标品名： ABS 宁波LG甬兴化工有限公司

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