TLC082中文资料

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TL082中文资料——运放

TL082中文资料——运放

PACKAGING INFORMATIONOrderable Device Status (1)Package Type PackageDrawing Pins Package Qty Eco Plan (2)Lead/Ball FinishMSL Peak Temp (3)Samples(Requires Login)5962-9851501Q2A ACTIVE LCCC FK201TBD Call TI Call TI5962-9851501QPA ACTIVE CDIP JG81TBD A42N / A for Pkg Type 5962-9851503Q2A ACTIVE LCCC FK201TBD Call TI Call TI5962-9851503QCA ACTIVE CDIP J141TBD Call TI Call TI TL081ACD ACTIVE SOIC D875Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL081ACDE4ACTIVE SOIC D875Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL081ACDG4ACTIVE SOIC D875Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL081ACDR ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL081ACDRE4ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL081ACDRG4ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081ACJG OBSOLETE CDIP JG8TBD Call TI Call TITL081ACP ACTIVE PDIP P850Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type TL081ACPE4ACTIVE PDIP P850Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type TL081BCD ACTIVE SOIC D875Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL081BCDE4ACTIVE SOIC D875Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL081BCDG4ACTIVE SOIC D875Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL081BCDR ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL081BCDRE4ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL081BCDRG4ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081BCP ACTIVE PDIP P850Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type TL081BCPE4ACTIVE PDIP P850Pb-Free (RoHS)CU NIPDAU N / A for Pkg TypeAddendum-Page 1Orderable Device Status (1)Package Type PackageDrawing Pins Package Qty Eco Plan (2)Lead/Ball FinishMSL Peak Temp (3)Samples(Requires Login)TL081CD ACTIVE SOIC D875Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL081CDE4ACTIVE SOIC D875Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL081CDG4ACTIVE SOIC D875Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL081CDR ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL081CDRE4ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL081CDRG4ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081CP ACTIVE PDIP P850Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type TL081CPE4ACTIVE PDIP P850Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type TL081CPSR ACTIVE SO PS82000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL081CPSRE4ACTIVE SO PS82000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL081CPSRG4ACTIVE SO PS82000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081CPWLE OBSOLETE TSSOP PW8TBD Call TI Call TI TL081ID ACTIVE SOIC D875Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL081IDE4ACTIVE SOIC D875Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL081IDG4ACTIVE SOIC D875Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL081IDR ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL081IDRE4ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL081IDRG4ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL081IP ACTIVE PDIP P850Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type TL081IPE4ACTIVE PDIP P850Pb-Free (RoHS)CU NIPDAU N / A for Pkg TypeAddendum-Page 2Orderable Device Status (1)Package Type PackageDrawing Pins Package Qty Eco Plan (2)Lead/Ball FinishMSL Peak Temp (3)Samples(Requires Login)TL081MFKB OBSOLETE LCCC FK20TBD Call TI Call TITL081MJG OBSOLETE CDIP JG8TBD Call TI Call TITL081MJGB OBSOLETE CDIP JG8TBD Call TI Call TITL082ACD ACTIVE SOIC D875Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082ACDE4ACTIVE SOIC D875Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082ACDG4ACTIVE SOIC D875Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082ACDR ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082ACDRE4ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082ACDRG4ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082ACP ACTIVE PDIP P850Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type TL082ACPE4ACTIVE PDIP P850Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type TL082ACPSR ACTIVE SO PS82000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082ACPSRE4ACTIVE SO PS82000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082ACPSRG4ACTIVE SO PS82000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082BCD ACTIVE SOIC D875Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082BCDE4ACTIVE SOIC D875Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082BCDG4ACTIVE SOIC D875Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082BCDR ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082BCDRE4ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082BCDRG4ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMAddendum-Page 3Orderable Device Status (1)Package Type PackageDrawing Pins Package Qty Eco Plan (2)Lead/Ball FinishMSL Peak Temp (3)Samples(Requires Login)TL082BCP ACTIVE PDIP P850Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type TL082BCPE4ACTIVE PDIP P850Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type TL082CD ACTIVE SOIC D875Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082CDE4ACTIVE SOIC D875Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082CDG4ACTIVE SOIC D875Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082CDR ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082CDRE4ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082CDRG4ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CJG OBSOLETE CDIP JG8TBD Call TI Call TITL082CP ACTIVE PDIP P850Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type TL082CPE4ACTIVE PDIP P850Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type TL082CPSR ACTIVE SO PS82000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082CPSRG4ACTIVE SO PS82000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082CPW ACTIVE TSSOP PW8150Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082CPWE4ACTIVE TSSOP PW8150Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082CPWG4ACTIVE TSSOP PW8150Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082CPWLE OBSOLETE TSSOP PW8TBD Call TI Call TITL082CPWR ACTIVE TSSOP PW82000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082CPWRE4ACTIVE TSSOP PW82000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082CPWRG4ACTIVE TSSOP PW82000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMAddendum-Page 427-Apr-2012Orderable Device Status (1)Package Type PackageDrawing Pins Package Qty Eco Plan (2)Lead/Ball FinishMSL Peak Temp (3)Samples(Requires Login)TL082ID ACTIVE SOIC D875Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082IDE4ACTIVE SOIC D875Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082IDG4ACTIVE SOIC D875Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082IDR ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082IDRE4ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082IDRG4ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082IJG OBSOLETE CDIP JG8TBD Call TI Call TITL082IP ACTIVE PDIP P850Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type TL082IPE4ACTIVE PDIP P850Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type TL082IPWR ACTIVE TSSOP PW82000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082IPWRE4ACTIVE TSSOP PW82000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL082IPWRG4ACTIVE TSSOP PW82000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL082MFK OBSOLETE LCCC FK20TBD Call TI Call TITL082MFKB ACTIVE LCCC FK201TBD POST-PLATE N / A for Pkg Type TL082MJG ACTIVE CDIP JG81TBD A42N / A for Pkg Type TL082MJGB ACTIVE CDIP JG81TBD A42N / A for Pkg Type TL084ACD ACTIVE SOIC D1450Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084ACDE4ACTIVE SOIC D1450Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084ACDG4ACTIVE SOIC D1450Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084ACDR ACTIVE SOIC D142500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084ACDRE4ACTIVE SOIC D142500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIM27-Apr-2012Orderable Device Status (1)Package Type PackageDrawing Pins Package Qty Eco Plan (2)Lead/Ball FinishMSL Peak Temp (3)Samples(Requires Login)TL084ACDRG4ACTIVE SOIC D142500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084ACN ACTIVE PDIP N1425Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type TL084ACNE4ACTIVE PDIP N1425Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type TL084ACNSR ACTIVE SO NS142000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084ACNSRE4ACTIVE SO NS142000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084ACNSRG4ACTIVE SO NS142000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084BCD ACTIVE SOIC D1450Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084BCDE4ACTIVE SOIC D1450Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084BCDG4ACTIVE SOIC D1450Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084BCDR ACTIVE SOIC D142500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084BCDRE4ACTIVE SOIC D142500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084BCDRG4ACTIVE SOIC D142500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084BCN ACTIVE PDIP N1425Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type TL084BCNE4ACTIVE PDIP N1425Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type TL084CD ACTIVE SOIC D1450Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CDE4ACTIVE SOIC D1450Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CDG4ACTIVE SOIC D1450Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CDR ACTIVE SOIC D142500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CDRE4ACTIVE SOIC D142500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIM27-Apr-2012Orderable Device Status (1)Package Type PackageDrawing Pins Package Qty Eco Plan (2)Lead/Ball FinishMSL Peak Temp (3)Samples(Requires Login)TL084CDRG4ACTIVE SOIC D142500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CJ OBSOLETE CDIP J14TBD Call TI Call TITL084CN ACTIVE PDIP N1425Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type TL084CNE4ACTIVE PDIP N1425Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type TL084CNSLE OBSOLETE SO NS14TBD Call TI Call TITL084CNSR ACTIVE SO NS142000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CNSRG4ACTIVE SO NS142000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CPW ACTIVE TSSOP PW1490Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CPWE4ACTIVE TSSOP PW1490Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CPWG4ACTIVE TSSOP PW1490Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL084CPWLE OBSOLETE TSSOP PW14TBD Call TI Call TITL084CPWR ACTIVE TSSOP PW142000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CPWRE4ACTIVE TSSOP PW142000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084CPWRG4ACTIVE TSSOP PW142000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084ID ACTIVE SOIC D1450Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084IDE4ACTIVE SOIC D1450Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084IDG4ACTIVE SOIC D1450Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084IDR ACTIVE SOIC D142500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084IDRE4ACTIVE SOIC D142500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084IDRG4ACTIVE SOIC D142500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIM27-Apr-2012Orderable Device Status (1)Package Type PackageDrawing Pins Package Qty Eco Plan (2)Lead/Ball FinishMSL Peak Temp (3)Samples(Requires Login)TL084IJ OBSOLETE CDIP J14TBD Call TI Call TITL084IN ACTIVE PDIP N1425Pb-Free (RoHS)CU NIPDAU N / A for Pkg TypeTL084INE4ACTIVE PDIP N1425Pb-Free (RoHS)CU NIPDAU N / A for Pkg TypeTL084MFK ACTIVE LCCC FK201TBD POST-PLATE N / A for Pkg TypeTL084MFKB ACTIVE LCCC FK201TBD POST-PLATE N / A for Pkg TypeTL084MJ ACTIVE CDIP J141TBD A42N / A for Pkg TypeTL084MJB ACTIVE CDIP J141TBD A42N / A for Pkg TypeTL084QD ACTIVE SOIC D1450Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084QDG4ACTIVE SOIC D1450Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084QDR ACTIVE SOIC D142500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL084QDRG4ACTIVE SOIC D142500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIM(1) The marketing status values are defined as follows:ACTIVE: Product device recommended for new designs.LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check /productcontent for the latest availability information and additional product content details.TBD: The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and27-Apr-2012 continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.OTHER QUALIFIED VERSIONS OF TL082, TL082M, TL084, TL084M :•Catalog: TL082, TL084•Automotive: TL082-Q1, TL082-Q1•Military: TL082M, TL084MNOTE: Qualified Version Definitions:•Catalog - TI's standard catalog product•Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects•Military - QML certified for Military and Defense ApplicationsTAPE AND REELINFORMATION *Alldimensions are nominal Device Package Type Package DrawingPinsSPQ Reel Diameter (mm)Reel Width W1(mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant TL081ACDR SOICD 82500330.012.4 6.4 5.2 2.18.012.0Q1TL081BCDR SOICD 82500330.012.4 6.4 5.2 2.18.012.0Q1TL081CDR SOICD 82500330.012.4 6.4 5.2 2.18.012.0Q1TL081CPSR SOPS 82000330.016.48.2 6.6 2.512.016.0Q1TL081IDR SOICD 82500330.012.4 6.4 5.2 2.18.012.0Q1TL082ACDR SOICD 82500330.012.4 6.4 5.2 2.18.012.0Q1TL082ACDR SOICD 82500330.012.4 6.4 5.2 2.18.012.0Q1TL082ACPSR SOPS 82000330.016.48.2 6.6 2.512.016.0Q1TL082BCDR SOICD 82500330.012.4 6.4 5.2 2.18.012.0Q1TL082CDR SOICD 82500330.012.4 6.4 5.2 2.18.012.0Q1TL082CDR SOICD 82500330.012.4 6.4 5.2 2.18.012.0Q1TL082CPSR SOPS 82000330.016.48.2 6.6 2.512.016.0Q1TL082CPWR TSSOPPW 82000330.012.47.0 3.6 1.68.012.0Q1TL082IDR SOICD 82500330.012.4 6.4 5.2 2.18.012.0Q1TL082IDR SOICD 82500330.012.4 6.4 5.2 2.18.012.0Q1TL082IPWR TSSOPPW 82000330.012.47.0 3.6 1.68.012.0Q1TL084ACDR SOICD 142500330.016.4 6.59.0 2.18.016.0Q1TL084ACDR SOIC D 142500330.016.4 6.59.0 14-Jul-2012DevicePackage Type Package DrawingPinsSPQ Reel Diameter (mm)Reel Width W1(mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant TL084ACNSR SONS 142000330.016.48.210.5 2.512.016.0Q1TL084BCDR SOICD 142500330.016.4 6.59.0 2.18.016.0Q1TL084CDR SOICD 142500330.016.4 6.59.0 2.18.016.0Q1TL084CNSR SONS 142000330.016.48.210.5 2.512.016.0Q1TL084CPWR TSSOPPW 142000330.012.4 6.9 5.6 1.68.012.0Q1TL084IDR SOICD 142500330.016.4 6.59.0 2.18.016.0Q1TL084QDR SOIC D 142500330.016.4 6.59.0 2.18.016.0Q1*All dimensions are nominalDevicePackage Type Package Drawing Pins SPQ Length (mm)Width (mm)Height (mm)TL081ACDRSOIC D 82500340.5338.120.6TL081BCDRSOIC D 82500340.5338.120.6TL081CDRSOIC D 82500340.5338.120.6TL081CPSRSO PS 82000367.0367.038.0TL081IDRSOIC D 82500340.5338.120.6TL082ACDRSOIC D 82500340.5338.120.6TL082ACDRSOIC D 82500367.0367.035.0TL082ACPSRSO PS 82000367.0367.038.0TL082BCDRSOIC D 82500340.5338.120.6TL082CDR SOIC D 82500340.5338.120.6 14-Jul-2012DevicePackageType Package Drawing Pins SPQ Length (mm)Width (mm)Height (mm)TL082CDRSOIC D 82500367.0367.035.0TL082CPSRSO PS 82000367.0367.038.0TL082CPWRTSSOP PW 82000367.0367.035.0TL082IDRSOIC D 82500367.0367.035.0TL082IDRSOIC D 82500340.5338.120.6TL082IPWRTSSOP PW 82000367.0367.035.0TL084ACDRSOIC D 142500333.2345.928.6TL084ACDRSOIC D 142500367.0367.038.0TL084ACNSRSO NS 142000367.0367.038.0TL084BCDRSOIC D 142500333.2345.928.6TL084CDRSOIC D 142500333.2345.928.6TL084CNSRSO NS 142000367.0367.038.0TL084CPWRTSSOP PW 142000367.0367.035.0TL084IDRSOIC D 142500333.2345.928.6TL084QDR SOIC D 142500367.0367.038.0 14-Jul-2012IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,enhancements,improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B.Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All semiconductor products(also referred to herein as“components”)are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its components to the specifications applicable at the time of sale,in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by applicable law,testing of all parameters of each component is not necessarily performed.TI assumes no liability for applications assistance or the design of Buyers’products.Buyers are responsible for their products and applications using TI components.To minimize the risks associated with Buyers’products and applications,Buyers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any patent right,copyright,mask work right,or other intellectual property right relating to any combination,machine,or process in which TI components or services are rmation published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI.Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.TI is not responsible or liable for such altered rmation of third parties may be subject to additional restrictions.Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.Buyer acknowledges and agrees that it is solely responsible for compliance with all legal,regulatory and safety-related requirements concerning its products,and any use of TI components in its applications,notwithstanding any applications-related information or support that may be provided by TI.Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures,monitor failures and their consequences,lessen the likelihood of failures that might cause harm and take appropriate remedial actions.Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications.In some cases,TI components may be promoted specifically to facilitate safety-related applications.With such components,TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements.Nonetheless,such components are subject to these terms.No TI components are authorized for use in FDA Class III(or similar life-critical medical equipment)unless authorized officers of the parties have executed a special agreement specifically governing such use.Only those TI components which TI has specifically designated as military grade or“enhanced plastic”are designed and intended for use in military/aerospace applications or environments.Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk,and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI has specifically designated certain components which meet ISO/TS16949requirements,mainly for automotive ponents which have not been so designated are neither designed nor intended for automotive use;and TI will not be responsible for any failure of such components to meet such requirements.Products ApplicationsAudio /audio Automotive and Transportation /automotiveAmplifiers Communications and Telecom /communicationsData Converters Computers and Peripherals /computersDLP®Products Consumer Electronics /consumer-appsDSP Energy and Lighting /energyClocks and Timers /clocks Industrial /industrialInterface Medical /medicalLogic Security /securityPower Mgmt Space,Avionics and Defense /space-avionics-defense Microcontrollers Video and Imaging /videoRFID OMAP Mobile Processors /omap TI E2E Community Wireless Connectivity /wirelessconnectivityMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2012,Texas Instruments Incorporated。

TL082C资料

TL082C资料
These devices are available in single, dual and quad operational amplifiers which are pin–compatible with the industry standard MC1741, MC1458, and the MC3403/LM324 bipolar products.
查询TL082C供应商
捷多邦,专业PCB打样工厂,24小时加急出货 Order this document by TL081C/D
JFET Input Operational
Amplifiers
These low–cost JFET input operational amplifiers combine two state–of– the–art linear technologies on a single monolithic integrated circuit. Each internally compensated operational amplifier has well matched high voltage JFET input devices for low input offset voltage. The BIFET technology provides wide bandwidths and fast slew rates with low input bias currents, input offset currents, and supply currents.
+ 10 3– 9
Inputs 3
8 Output 3
TL084 (Top View)
© Motorola, Inc. 1997

TL082CM中文资料

TL082CM中文资料

TL082Wide Bandwidth Dual JFET Input Operational AmplifierGeneral DescriptionThese devices are low cost,high speed,dual JFET input op-erational amplifiers with an internally trimmed input offset voltage (BI-FET II ™technology).They require low supply current yet maintain a large gain bandwidth product and fast slew rate.In addition,well matched high voltage JFET input devices provide very low input bias and offset currents.The TL082is pin compatible with the standard LM1558allowing designers to immediately upgrade the overall performance of existing LM1558and most LM358designs.These amplifiers may be used in applications such as high speed integrators,fast D/A converters,sample and hold cir-cuits and many other circuits requiring low input offset volt-age,low input bias current,high input impedance,high slew rate and wide bandwidth.The devices also exhibit low noise and offset voltage drift.Featuresn Internally trimmed offset voltage:15mV n Low input bias current:50pAn Low input noise voltage:16nV/√Hz n Low input noise current:0.01pA/√Hz n Wide gain bandwidth:4MHz n High slew rate:13V/µs n Low supply current: 3.6mA n High input impedance:1012ΩnLow total harmonic distortion A V =10,:<0.02%R L =10k,V O =20Vp −p,BW =20Hz−20kHzn Low 1/f noise corner:50Hzn Fast settling time to 0.01%:2µsTypical Connection Connection DiagramSimplified SchematicBI-FET II ™is a trademark of National Semiconductor Corp.DS008357-1DIP/SO Package (Top View)DS008357-3Order Number TL082CM or TL082CP See NS Package Number M08A or N08EDS008357-2April 1998TL082Wide Bandwidth Dual JFET Input Operational Amplifier©1999National Semiconductor Corporation Absolute Maximum Ratings(Note1)If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications.Supply Voltage±18V Power Dissipation(Note2) Operating Temperature Range0˚C to+70˚C T j(MAX)150˚C Differential Input Voltage±30V Input Voltage Range(Note3)±15V Output Short Circuit Duration Continuous Storage Temperature Range−65˚C to+150˚C Lead Temp.(Soldering,10seconds)260˚C ESD rating to be determined.Note1:“Absolute Maximum Ratings”indicate limits beyond which damage to the device may occur.Operating Ratings indicate conditions for which the device is functional,but do not guarantee specific performance limits.DC Electrical Characteristics(Note5)Symbol Parameter Conditions TL082C UnitsMin Typ MaxV OS Input Offset Voltage R S=10kΩ,T A=25˚C515mVOver Temperature20mV ∆V OS/∆T Average TC of Input Offset R S=10kΩ10µV/˚C VoltageI OS Input Offset Current T j=25˚C,(Notes5,6)25200pAT j≤70˚C4nA I B Input Bias Current T j=25˚C,(Notes5,6)50400pAT j≤70˚C8nA R IN Input Resistance T j=25˚C1012ΩA VOL Large Signal Voltage Gain V S=±15V,T A=25˚C25100V/mVV O=±10V,R L=2kΩOver Temperature15V/mV V O Output Voltage Swing V S=±15V,R L=10kΩ±12±13.5V V CM Input Common-Mode Voltage V S=±15V±11+15V Range−12V CMRR Common-Mode Rejection Ratio R S≤10kΩ70100dB PSRR Supply Voltage Rejection Ratio(Note7)70100dB I S Supply Current 3.6 5.6mAAC Electrical Characteristics(Note5)Symbol Parameter Conditions TL082C UnitsMin Typ Max Amplifier to Amplifier Coupling T A=25˚C,f=1Hz-−120dB20kHz(Input Referred)SR Slew Rate V S=±15V,T A=25˚C813V/µs GBW Gain Bandwidth Product V S=±15V,T A=25˚C4MHz e n Equivalent Input Noise Voltage T A=25˚C,R S=100Ω,25nV/√Hzf=1000Hzi n Equivalent Input Noise Current T j=25˚C,f=1000Hz0.01pA/√HzNote2:For operating at elevated temperature,the device must be derated based on a thermal resistance of115˚C/W junction to ambient for the N package.Note3:Unless otherwise specified the absolute maximum negative input voltage is equal to the negative power supply voltage.Note4:The power dissipation limit,however,cannot be exceeded.Note5:These specifications apply for V S=±15V and0˚C≤T A≤+70˚C.V OS,I B and I OS are measured at V CM=0.Note6:The input bias currents are junction leakage currents which approximately double for every10˚C increase in the junction temperature,T j.Due to the limited production test time,the input bias currents measured are correlated to junction temperature.In normal operation the junction temperature rises above the ambient temperature as a result of internal power dissipation,P D.T j=T A+θjA P D whereθjA is the thermal resistance from junction to e of a heat sink is recom-mended if input bias current is to be kept to a minimum.Note7:Supply voltage rejection ratio is measured for both supply magnitudes increasing or decreasing simultaneously in accordance with common practice.V S=±6V to±15V.2Typical Performance CharacteristicsInput Bias CurrentDS008357-18Input Bias CurrentDS008357-19Supply CurrentDS008357-20Positive Common-Mode Input Voltage LimitDS008357-21Negative Common-Mode InputVoltage LimitDS008357-22Positive Current LimitDS008357-23Negative Current LimitDS008357-24Voltage SwingDS008357-25Output Voltage SwingDS008357-26 3Typical Performance Characteristics(Continued)Gain BandwidthDS008357-27Bode PlotDS008357-28Slew RateDS008357-29Distortion vs FrequencyDS008357-30Undistorted Output Voltage SwingDS008357-31Open Loop Frequency ResponseDS008357-32Common-Mode Rejection Ratio DS008357-33Power Supply Rejection RatioDS008357-34Equivalent Input Noise VoltageDS008357-35 4Typical Performance Characteristics(Continued)Pulse ResponseOpen Loop VoltageGain(V/V)DS008357-36Output ImpedanceDS008357-37Inverter Setting TimeDS008357-38 Small Signal InvertingDS008357-6Small Signal Non-InvertingDS008357-7 Large Signal InvertingDS008357-8Large Signal Non-InvertingDS008357-95Pulse Response(Continued)Application HintsThese devices are op amps with an internally trimmed input offset voltage and JFET input devices (BI-FET II).These JFETs have large reverse breakdown voltages from gate to source and drain eliminating the need for clamps across the inputs.Therefore,large differential input voltages can easily be accommodated without a large increase in input current.The maximum differential input voltage is independent of the supply voltages.However,neither of the input voltages should be allowed to exceed the negative supply as this will cause large currents to flow which can result in a destroyed unit.Exceeding the negative common-mode limit on either input will cause a reversal of the phase to the output and force the amplifier output to the corresponding high or low state.Ex-ceeding the negative common-mode limit on both inputs will force the amplifier output to a high state.In neither case does a latch occur since raising the input back within the common-mode range again puts the input stage and thus the amplifier in a normal operating mode.Exceeding the positive common-mode limit on a single input will not change the phase of the output;however,if both in-puts exceed the limit,the output of the amplifier will be forced to a high state.The amplifiers will operate with a common-mode input volt-age equal to the positive supply;however,the gain band-width and slew rate may be decreased in this condition.When the negative common-mode voltage swings to within 3V of the negative supply,an increase in input offset voltage may occur.Each amplifier is individually biased by a zener reference which allows normal circuit operation on ±6V power sup-plies.Supply voltages less than these may result in lower gain bandwidth and slew rate.The amplifiers will drive a 2k Ωload resistance to ±10V over the full temperature range of 0˚C to +70˚C.If the amplifier is forced to drive heavier load currents,however,an increase in input offset voltage may occur on the negative voltage swing and finally reach an active current limit on both posi-tive and negative swings.Precautions should be taken to ensure that the power supply for the integrated circuit never becomes reversed in polarity or that the unit is not inadvertently installed backwards in a socket as an unlimited current surge through the resulting forward diode within the IC could cause fusing of the internal conductors and result in a destroyed unit.Because these amplifiers are JFET rather than MOSFET in-put op amps they do not require special handling.As with most amplifiers,care should be taken with lead dress,component placement and supply decoupling in order to ensure stability.For example,resistors from the output to an input should be placed with the body close to the input to minimize “pick-up”and maximize the frequency of the feed-back pole by minimizing the capacitance from the input to ground.A feedback pole is created when the feedback around any amplifier is resistive.The parallel resistance and capacitance from the input of the device (usually the inverting input)to AC ground set the frequency of the pole.In many instances the frequency of this pole is much greater than the expected 3dB frequency of the closed loop gain and consequently there is negligible effect on stability margin.However,if the feed-back pole is less than approximately 6times the expected 3dB frequency a lead capacitor should be placed from the out-put to the input of the op amp.The value of the added ca-pacitor should be such that the RC time constant of this ca-pacitor and the resistance it parallels is greater than or equal to the original feedback pole time constant.Current Limit (R L =100Ω)DS008357-10 6Detailed SchematicDS008357-11 Typical ApplicationsThree-Band Active Tone ControlDS008357-127Typical Applications(Continued)DS008357-13•All potentiometers are linear taper•Use the LF347Quad for stereo applicationsNote8:All controls flat.Note9:Bass and treble boost,mid flat.Note10:Bass and treble cut,mid flat.Note11:Mid boost,bass and treble flat.Note12:Mid cut,bass and treble flat.Improved CMRR Instrumentation AmplifierDS008357-14C and E are separate isolated groundsMatching of R2’s,R4’s and R5’s control CMRRWith A VT=1400,resistor matching=0.01%:CMRR=136dB•Very high input impedance•Super high CMRR8Typical Applications(Continued)Fourth Order Low Pass Butterworth FilterDS008357-15Fourth Order High Pass Butterworth FilterDS008357-169Typical Applications(Continued)Ohms to Volts ConverterDS008357-1710Physical Dimensions inches(millimeters)unless otherwise notedOrder Number TL082CMNS Package M08AOrder Number TL082CPNS Package N08E11NotesLIFE SUPPORT POLICYNATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMICONDUCTOR CORPORATION.As used herein:1.Life support devices or systems are devices or systems which,(a)are intended for surgical implant into the body,or (b)support or sustain life,and whose failure to perform when properly used in accordance with instructions for use provided in the labeling,can be reasonably expected to result in a significant injury to the user.2.A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system,or to affect its safety or effectiveness.National Semiconductor Corporation AmericasTel:1-800-272-9959Fax:1-800-737-7018Email:support@National Semiconductor EuropeFax:+49(0)180-5308586Email:europe.support@Deutsch Tel:+49(0)180-5308585English Tel:+49(0)180-5327832Français Tel:+49(0)180-5329358Italiano Tel:+49(0)180-5341680National Semiconductor Asia Pacific Customer Response Group Tel:65-2544466Fax:65-2504466Email:sea.support@National Semiconductor Japan Ltd.Tel:81-3-5639-7560Fax:81-3-5639-7507T L 082W i d e B a n d w i d t h D u a l J F E T I n p u t O p e r a t i o n a l A m p l i f i e rNational does not assume any responsibility for use of any circuitry described,no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.。

TL082CMX中文资料

TL082CMX中文资料

MSL RatingPeak Body Temp CMaxTime (Sec)Cycles1 235304Document DateWeight (mg)Unit Type29-Dec-200770.000EachPart NumberContains Lead(Pb) and is NOT European RoHS Compliant.TL082CMXNOT China RoHS Compliant CompanyNational Semiconductor元器件交易网UseMaterialCdCrVlPbHgPBBPBDERef #Device CHIP <1<1<1<1<1<11000 COMPOUND <2<2<2<2<100<100637 EPOXY <2<5<5<1<10<1032 EXTLF <2<2149000<2NA NA 56 FRAME <2<215<2NA NA 53 WIRE <2<5<5<1<10<1075Ref #1000Analysis on 04/17/2007 by Balazs Analytical Services-Freemont CA per Report# 07-01051-0732Analysis on 05/16/2007 by ALS per Report# ATJB/3488BS/200753Analysis on 03/13/2007 by SGS per Report# LPCI/05143/0756Analysis on 04/27/2007 by SGS per Report# LPCI/07440/0775Analysis on 05/16/2007 by ALS per Report# ATJB/3490BS/2007637Analysis on 06/04/2007 by SGS per Report# LPCI/10324/07Banned Substance Monitoring* Unless otherwise noted, units are in PPM (parts-per-million)* Cd: Cadmium, CrVI: Hexavalent Chromium, Pb: Lead, Hg: Mercury, ND: Not Detected 3rd Party Analysis (available upon request, subject to a non-disclosure agreement)Document Date 29-Dec-2007Part Number TL082CMXContains Lead(Pb) and is NOT European RoHS Compliant.NOT China RoHS Compliant 元器件交易网产品名称Product Name美国国家半导体《电子信息产品污染控制管理办法》的声明China RoHS Declaration美国国家半导体的产品不会含有镉、汞、六价铬、多溴联苯(PBB)和二苯醚(PBDE)。

TL082中文资料_数据手册_参数

TL082中文资料_数据手册_参数

TL081, TL081A, TL081B, TL082, TL082A TL082B, TL084, TL084A, TL084B
SLOS081I – FEBRUARY 1977 – ontents
1 Features .................................................................. 1 2 Applications ........................................................... 1 3 Description ............................................................. 1 4 Revision History..................................................... 2 5 Pin Configuration and Functions ......................... 3 6 Specifications......................................................... 5
TL08xI ........................................................................ 6 6.6 Electrical Characteristics for TL08xM and TL084x ... 7 6.7 Operating Characteristics.......................................... 7 6.8 Dissipation Rating Table ........................................... 8 6.9 Typical Characteristics .............................................. 9 7 Parameter Measurement Information ................ 13 8 Detailed Description ............................................ 14 8.1 Overview ................................................................. 14

ERJ-S08F2432V中文资料(panasonic)中文数据手册「EasyDatasheet - 矽搜」

ERJ-S08F2432V中文资料(panasonic)中文数据手册「EasyDatasheet - 矽搜」

× Resistance Values, or Limiting Element Voltage × Power Rating or max. Overload Voltage listed above
Type
(英制)
ERJS6S (0805) ERJS6Q (0805)
PowerRating电阻
在70℃下 公差
Ambient Temperature (°C)
Type: ERJ S02,S03,S06,S08,S14中 S12中,S1D,S1T(Au类内电极型)
Type: ERJ S6S,S6Q(银钯基内电极型)
Type: ERJ U01, U02, U03, U06, U08, U14, U12,U1D,U1T(银钯基内电极型)
■ 特征
● 高抗硫化通过采用金基内电极来实现(ERJS0 / S1型)
ERJS1T ERJU1T (2512)
额定功率
在70℃下 (W) 0.05 0.1
0.1
0.125
0.25
0.5
0.75
0.75
1.0
限制 因素 电压
(V) 25 50
75
150
200
200
200
200
200
极大 超载 电压
(V) 50 100
150
200
400
400
500
500
500
抵抗性 公差
Example: 222 2.2 k, 1002 10 k
Packaging Methods
Code Packaging C 2 mPrmesspeitdchC,a1r5ri,e0r0T0appcins.g

TLC0820A中文资料

TLC0820A中文资料

2008年北京市大学生电子设计竞赛芯片资料TLC372 双路通用LinCMOSTM 差动比较器∙单电源或双电源供电∙宽电源范围供电2V~18V∙5V电源时低漏电流150μA∙TTL输入电平时快速响应时间200ns∙内置ESD保护∙高输入阻抗典型值1012Ω∙外部低输入偏置电流典型值5PA∙超稳定的低输入偏置电压∙输入失调电压在最恶劣的输入条件下变化0.23μV/月,包括第一个30天∙共模输入电压包括地∙输出兼容TTL MOS CMOS∙引脚兼容LM393引脚功能∙1IN - 1路比较器反相输入∙1IN+ 1路比较器通向输入∙1OUT 1路比较器输出∙2IN - 2路比较器反相输入∙2IN+ 2路比较器同相输入∙2OUT 2路比较器输出∙GND 电源地∙VCC 电源正∙NC 空脚,不连接这个器件由两个独立电压比较器,使用LinCMOSTM工艺制造的,支持单电源。

输出是N 沟道漏极开路,实现正逻辑连接。

完全最大的测定值运行环境范围(除非另行注释)支持电压VDD(注释1)...............................................................+18V差分输入电压VID(注释2)...........................................................±18V输入电压范围.....................................................................-0.3~18V输出电压VO (18V)输入电流II ......................................................................±5mA输出电流IO.......................................................................20mA输出短路到地持续电流.............................................................无限制注释:1、差分电压除外,全部电压相对于地。

TLC082CDR资料

TLC082CDR资料

Copyright 2000−2004 Texas Instruments Incorporated

1
元器件交易网
SLOS254D − JUNE 1999 − REVISED FEBRUARY 2004
TLC080, TLC081, TLC082, TLC083, TLC084, TLC085, TLC08xA FAMILY OF WIDEĆBANDWIDTH HIGHĆOUTPUTĆDRIVE SINGLE SUPPLY OPERATIONAL AMPLIFIERS
元器件交易网
TLC080, TLC081, TLC082, TLC083, TLC084, TLC085, TLC08xA FAMILY OF WIDEĆBANDWIDTH HIGHĆOUTPUTĆDRIVE SINGLE SUPPLY OPERATIONAL AMPLIFIERS
TLC080 and TLC081 AVAILABLE OPTIONS PACKAGED DEVICES TA 0°C to 70°C SMALL OUTLINE (D)† TLC080CD TLC081CD TLC080ID TLC081ID TLC080AID TLC081AID SMALL OUTLINE (DGN)† TLC080CDGN TLC081CDGN TLC080IDGN TLC081IDGN — — SYMBOL xxTIACW xxTIACY xxTIACX xxTIACZ — — PLASTIC DIP (P) TLC080CP TLC081CP TLC080IP TLC081IP TLC080AIP TLC081AIP
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PowerPAD is a trademark of Texas Instruments.

MSMA082资料

MSMA082资料

(4.803) (3.819) (2.717)
Note: Dimensions reflect incremental type motor. For absolute type motor dimensions, refer to the motor specification.
MFMCB«««0GET 30 - 750W (add'l brake cable)
MFMCA«««2FCT 1.2 - 5.0kW
MFMCA«««3FCT 3.0 - 5.0kW
MSMA _ _ _ A1 _ 2500p/r incremental MSMA _ _ _ C1 _ 17bit absolute for 30 - 750W
battery backup
Specifications
A
Round shaft
B
Round shaft, brake
C
Round shaft, oil seal
D Round shaft, brake & oil seal
E
Key shaft
F
Key shaft, brake
G
Key shaft, oil seal
For customer supplied cables. See the Minas A Series Accessories section
Available for absolute encoder. See the Minas A Series Accessories section
TABLE OF CONTENTS
DC24V
Optional Brake Cable MFMCA«««0EET MFMCB«««0GET MFMCA«««2FCT MFMCA«««3FCT

Analog Devices ADTL082A ADTL082J ADTL084J 双通道操作电路模

Analog Devices ADTL082A ADTL082J ADTL084J 双通道操作电路模

Rev. BInformation furnished by Analog Devices is believed to be accurate and reliable. However, noresponsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Speci cations subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. T rademarks and registered trademarks are the property of their respective owners.One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 Fax: 781.461.3113 ©2007 Analog Devices, Inc. All rights reserved.引脚配置OUT A1–IN A2+IN A3–V4+V8OUT B7–IN B6+IN B5ADTL082JTOP VIEW(Not to Scale)6275-1OUT A1–IN A2+IN A3–V4+V8OUT B7–IN B6+IN B5ADTL082ATOP VIEW(Not to Scale)6275-2OUT A1–IN A2+IN A3+V4OUT D14–IN D13+IN D12–V11+IN B5+IN C10–IN B6–IN C9OUT B7OUT C8ADTL084JTOP VIEW(Not to Scale)6275-3ADTL084A1234567–IN A+IN A+VOUT B–IN B+IN BOUT A141312111098–IN D+IN D–VOUT C–IN C+IN COUT DTOP VIEW(Not to Scale)6275-4低成本、JFET输入运算放大器ADTL082/ADTL084产品特性TL082/TL084兼容低输入偏置电流:10 pA(最大值)失调电压5.5 mV(最大值,ADTL082A/ADTL084A)9 mV(最大值,ADTL082J/ADTL084J)工作电压:±15 V低噪声:16 nV/√Hz宽带宽:5 MHz压摆率:20 V/μs共模抑制比(CMRR):80 dB(最小值)总谐波失真: 0.001%电源电流:1.2 mA(典型值)单位增益稳定应用通用放大功率控制和监测有源滤波器工业/过程控制数据采集采样保持电路积分器输入缓冲图1. 8引脚SOIC_N(R-8)图2. 8引脚MSOP(RM-8)图3. 14引脚SOIC_N(R-14)图4. 14引脚TSSOP(RU-14)概述ADTL082和ADTL084均为具有业界领先性能的JFET输入放大器,其性能优于TL08x器件。

TLC0832CP;TLC0832IP;TLC0831IP;TLC0831CD;TLC0832CD;中文规格书,Datasheet资料

TLC0832CP;TLC0832IP;TLC0831IP;TLC0831CD;TLC0832CD;中文规格书,Datasheet资料

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
description
These devices are 8-bit successive-approximation analog-to-digital converters. The TLC0831 has single input channels; the TLC0832 has multiplexed twin input channels. The serial output is configured to interface with standard shift registers or microprocessors. The TLC0832 multiplexer is software configured for single-ended or differential inputs. The differential analog voltage input allows for common-mode rejection or offset of the analog zero input voltage value. In addition, the voltage reference input can be adjusted to allow encoding any smaller analog voltage span to the full 8 bits of resolution. The operation of the TLC0831 and TLC0832 devices is very similar to the more complex TLC0834 and TLC0838 devices. Ratiometric conversion can be attained by setting the REF input equal to the maximum analog input signal value, which gives the highest possible conversion resolution. Typically, REF is set equal to VCC (done internally on the TLC0832). The TLC0831C and TLC0832C are characterized for operation from 0°C to 70°C. The TLC0831I and TLC0832I are characterized for operation from – 40°C to 85°C.

TLC085中文资料

TLC085中文资料
TLC080 and TLC081 AVAILABLE OPTIONS PACKAGED DEVICES TA 0°C to 70°C SMALL OUTLINE (D)† TLC080CD TLC081CD TLC080ID TLC081ID TLC080AID TLC081AID SMALL OUTLINE (DGN)† TLC080CDGN TLC081CDGN TLC080IDGN TLC081IDGN — — SYMBOL xxTIACW xxTIACY xxTIACX xxTIACZ — — PLASTIC DIP (P) TLC080CP TLC081CP TLC080IP TLC081IP TLC080AIP TLC081AIP
元器件交易网
TLC080, TLC081, TLC082, TLC083, TLC084, TLC085, TLC08xA FAMILY OF WIDEĆBANDWIDTH HIGHĆOUTPUTĆDRIVE SINGLE SUPPLY OPERATIONAL AMPLIFIERS
Copyright 2000−2004 Texas Instruments Incorporated

1
元器件交易网
SLOS254D − JUNE 1999 − REVISED FEBRUARY 2004
TLC080, TLC081, TLC082, TLC083, TLC084, TLC085, TLC08xA FAMILY OF WIDEĆBANDWIDTH HIGHĆOUTPUTĆDRIVE SINGLE SUPPLY OPERATIONAL AMPLIFIERS
−40°C to 125°C
† This package is available taped and reeled. To order this packaging option, add an R suffix to the part number (e.g., TLC084CDR).

GB082BSGABNLB-V01中文资料

GB082BSGABNLB-V01中文资料

JEWEL HILL ELECTRONIC CO.,LTDJEWEL HILL ELECTRONIC CO.,LTD.SPECIFICATIONS FORLCD MODULEModule No. GB082BOffice Address: Rm. 518,5/F., 101 Shangbu Industrial District,HuaqiangNorthRoad, Shenzhen, ChinaTEL : (86)-755-83362489 83617492FAX: (86)-755-83286396 83365871E-mail: sales@jhlcd@Website: TABLE OF CONTENTSLCM NUMBER SYSTEM (2)1. GENERAL DESCRIPTION (3)2. FEATURES (3)3. MECHANICAL SPECIFICATION (3)4. MECHANICAL DIMENSION (4)5. MAXIMUM RATINGS (5)6. ELECTRICAL CHARACTERISTICS (5)7. MODULE FUNCTION DESCRIPTION (6)8. ELECTRO-OPTICAL CHARACTERISTICS (12)9. RELIABILITY (16)10. PRECAUTIONS FOR USING LCD MODULES (17)11. USING LCD MODULES (19)12. REVISION HISTORY (21)SAMPLE APPROVED REPORT (22)LCM Number SystemNUMBER OF CHAR. PER LINE F: FSTN; X: OTHER VERSION NUMBER: V00~V99IC TYPE:VIEWING DIRECTION:TEMPERATURE RANGE:BACKLIGHT TYPE:SERIAL NUMBER: A~ZGRAPHIC MODULEs: NUMBER OF COMMONs GRAPHIC MODULEs:NUMBER OF SEGMENTs COB & SMT LCMBACKLIGHT COLOR:CHARACTER MODULEs:CHARACTER MODULEs: NUMBER OF LINE G: REFLECTIVE,NONE BACKLIGHT A: TRANSFLECTIVE, EL BACKLIGHT B: TRANSMISSIVE, EL BACKLIGHT C: TRANSFLECTIVE, LED BACKLIGHT D: TRANSMISSIVE, LED BACKLIGHT E: TRANSFLECTIVE, CCFL BACKLIGHT F: TRANSMISSIVE, CCFL BACKLIGHT A: AMBER; B: BLUE; Y: YELLOW-GREEN R: RED; W: WHITE; O: THER COLOR N: NORMAL TEMPERATURE RANGE U: UPPER(12:00); D: DOWN(6:00)L: LEFT(9:00); R: RIGHT(3:00);A: BONDING IC, WITH CONTROLLER B: BONDING IC, WITHOUT CONTROLLER C: SMT IC, WITH CONTROLLER D: SMT IC, WITHOUT CONTROLLER O: OTHER TYPEW: BLACK-WHITE; O: OTHER G: GRAY; Y: YELLOW-GREEN; B: BLUE; LCD COLOR MODE:N: TN; H: HTN; S: STN LCD TYPE:S: SUPER WIDE TEMPERATURE RANGE W: WIDE TEMPERATURE RANGEM: MIDDLE TEMPERATURE RANGE1. GENERAL DESCRIPTIONThe GB082B is a 8C x 2L Character LCD module. It has a STN panel composed of 40 segments and16 commons. The LCM can be easily accessed by micro-controller via parallel interface.2. FEATURESTransflective and positiveDisplay ModeSTN(Yellow - Green) moduleDisplay Format Character 8C x 2LInput Data 8/4-bit parallel data input from MPUMultiplexing Ratio 1/16 DutyBiasBias 1/5Viewing Direction 6 O’clockBacklight LED3. MECHANICAL SPECIFICATIONItem Specifications Unit Dimensional outline 58.0 x 32.0 x 13.5(max) mmResolution 40segs x 16coms dotsActive area 27.81(W) x 11.5(H) mmChar. pitch 3.55(W) x 5.94(H) mmChar. size 2.96(W) x 5.56(H) mmDots pitch 0.6 (W)×0.7(H) mmDots size 0. 56(W)×0.66(H) mm4. MECHANICAL DIMENSION5. MAXIMUM RATINGSItem Symbol Min Max Unit NoteV DD - V ss -0.3 7.0 V Supply voltage V LCD -0.3 13.0 V Input Voltage V IN -0.3 V DD +0.3 VOperating temperature T OPR 0 +50 Storage temperature T STR -10 +60Humidity --- --- 90 %RH6. ELECTRICAL CHARACTERISTICSItem SymbolCondition Min. Typ. Max. UnitSupply Voltage Logic V DD------ 5.0 --- VH level V IH 0.8V DD --- V DDInput VoltageL levelV IL --- V SS --- 0.2V DDVCurrent Consumption(LCD DRIVER)I DDV DD =5.0V;V LCD =4.7V,T amb =25 ;--- --- 1.0 mALCD Driving Voltage V LCDBias=1/5V LCD =V DD -V O--- 4.7 --- VCurrent Consumption (With LED BackLight)I LEDV DD =5.0V;V LED =4.2V,T amb =25 ;--- --- 300 mA7. MODULE FUNCTION DESCRIPTION7.1. PIN DESCRIPTIONPin No. Symbol Description1 VSSPower supply for Ground (0V)2 VDDPower supply for positive (+5V)3 VOLCD driving voltage regulation terminal4 RSData/Command register selection; “H”: Data; “L”: Command5 R/WRead/write selection signal, ”H”: Read; ”L”: Write6 ERead/write Enable signal input pin7 DB08 DB19 DB210 DB38-bit bi-directional data bus11 DB412 DB513 DB614 DB715 LEDAPower supply for LED(Positive)16 LEDKPower supply for LED(Negative)7.2 TIMING CHARACTERISTICS1. SYSTEM BUS READ/WRITE CHARACTERISTIC7.3 APPLICATION OF LCMReference circuitCircuit Block Diagram7.4 TABLE OF COMMAND7.5 CHARACTER GENERATOR ROM8. ELECTRO-OPTICAL CHARACTERISTICSItem Symbol Condition Temp Min Typ. Max UnitsNote4.6 4.95.225 4.4 4.7 5.0 LCD driving voltageV LCD = = 050 4.2 4.5 4.8 V NOTE1Rise Time (Tr) --- --- -- Decay Time (Tf)0 --- ---- --- Rise Time (Tr) --- 225 340Decay Time (Tf) 25 --- 240 360Rise Time (Tr) --- --- -- Response TimeDecay Time (Tf)= = 0 50 --- --- --msec NOTE2Contrast Ratio Cr= = 0 255 10 --- --- NOTE4Viewing AngleRange( = 0°)(6”) = 90°(3”) =180°(12”) =270°(9”)(25 ) CR ≥245 30 20 25DegNOTE3z For panel only․Electro-Optical Characteristics Measuring Equipment(DMS501)SystemIllumination (D65)․Note 1. Definition of Driving Voltage( Vlcd) :․Note 3. Definition of Viewing Angle and :․Note 4. Definition of Contrast ratio( CR) :Brightness of Non-selected Segment (B2)Brightness of Selected Segment (B1)CR =V,maxCR,maxDriving VoltageB r i gh t n e s s (%)Brightness Curve forSelected Segment0%=90 =270Viewing Direction 6 O’clock DirectionNormal :9. RELIABILITY9.1. MTBFThe LCD module shall be designed to meet a minimum MTBF value of 50000 hours with normal. (25°C in the room without sunlight)9.2. TESTSNO. ITEM CONDITION CRITERION1 High Temperature Operating 50 120Hrs2 Low Temperature Operating 0 120Hrs3High Temperature/Humidity Non-Operating50 ,90%RH ,120 Hrs4 High TemperatureNon-Operating60 120Hrs5 Low TemperatureNon-Operating-10 120Hrs6 Temperature CyclingNon-Operating0 (30Min )↔ 50 (30Min)10 CYCLESNo Defect OfOperational Function InRoom Temperature AreAllowable.IDD of LCM inPre-and post-test shouldfollow specificationNotes: Judgments should be mode after exposure in room temperature for two hours.10. PRECAUTIONS FOR USING LCD MODULES10.1. HANDLING PRECAUTIONS(1) The display panel is made of glass. Do not subject it to a mechanical shock or impact by droppingit.(2) If the display panel is damaged and the liquid crystal substance leaks out, be sure not to get any inyour mouth. If the substance contacts your skin or clothes, wash it off using soap and water.(3) Do not apply excessive force to the display surface or the adjoining areas since this may cause thecolor tone to vary.(4) The polarizer covering the display surface of the LCD module is soft and easily scratched. Handlethis polarizer carefully.(5) If the display surface becomes contaminated, breathe on the surface and gently wipe it with a softdry cloth. If it is heavily contaminated, moisten a cloth with one of the following solvents: - Isopropyl alcohol- Ethyl alcohol(6) Solvents other than those above mentioned may damage the polarizer.Especially, do not use the following:- Water- Ketone- Aromatic solvents(7) Extra care to minimize corrosion of the electrode. Water droplets, moisture condensation or acurrent flow in a high-humidity environment accelerates corrosion of the electrode.(8) Install the LCD Module by using the mounting holes. When mounting the LCD Module, makesure it is free of twisting, warping and distortion. In particular, do not forcibly pull or bend the I/Ocable or the backlight cable.(9) Do not attempt to disassemble or process the LCD Module.(10) NC terminal should be open. Do not connect anything.(11) If the logic circuit power is off, do not apply the input signals.(12) To prevent destruction of the elements by static electricity, be careful to maintain an optimumwork environment.- Be sure to ground the body when handling he LCD Module.- Tools required for assembling, such as soldering irons, must be properly grounded.-To reduce the amount of static electricity generated, do not conduct assembling and other workunder dry conditions.-The LCD Module is coated with a film to protect the display surface. Exercise care when peeling off this protective film since static electricity may be generated.10.2. STORAGE CONDITIONSWhen storing, avoid the LCD module to be exposed to direct sunlight of fluorescent lamps. For stability, to keep it away form high temperature and high humidity environment (The best condition is : 23±5°C, 45±20%RH). ESD protection is necessary for long-term storage also.10.3. OTHERSLiquid crystals solidify under low temperature (below the storage temperature range) leading to defective orientation or the generation of air bubbles (black or white). Air bubbles may also be generated if the module is subject to a low temperature.If the LCD Module have been operating for a long time showing the same display patterns the display patterns may remain on the screen as ghost images and a slight contrast irregularity may also appear.A normal operating status can be recovered by suspending use for some time. It should be noted that this phenomenon does not adversely affect performance reliability.To minimize the performance degradation of the LCD Module resulting from destruction caused by static electricity etc. exercise care to avoid holding the following sections when handling the modules.- Exposed area of the printed circuit board.- Terminal electrode sections.11. Using LCD modules11.1 LIQUID CRYSTAL DISPLAY MODULESLCD is composed of glass and polarizer. Pay attention to the following items when handling.(1) Please keep the temperature within specified range for use and storage. Polarization degradation,bubble generation or polarizer peel-off may occur with high temperature and high humidity.(2) Do not touch, push or rub the exposed polarizers with anything harder than a HB pencil lead (glass,tweezers, etc).(3) N-hexane is recommended for cleaning the adhesives used to attach front/rear polarizers andreflectors made of organic substances, which will be damaged by chemicals such as acetone, toluene, toluene, ethanol and isopropyl alcohol.(4) When the display surface becomes dusty, wipe gently with absorbent cotton or other soft materiallike chamois soaked in petroleum ether. Do not scrub hard to avoid damaging the display surface.(5) Wipe off saliva or water drops immediately, contact with water over a long period of time maycause deformation or color fading.(6) Avoid contacting oil and fats.(7) Condensation on the surface and contact with terminals due to cold will damage, stain orpolarizers. After products are tested at low temperature they must be warmed up in a container before coming is contacting with room temperature air.(8) Do not put or attach anything on the display area to avoid leaving marks on.(9) Do not touch the display with bare hands. This will stain the display area and degrade insulationbetween terminals (some cosmetics are determinate to the polarizers).(10)As glass is fragile, it tends to become or chipped during handling especially on the edges. Pleaseavoid dropping or jarring.11.2 INSTALLING LCD MODULEAttend to the following items when installing the LCM.(1) Cover the surface with a transparent protective plate to protect the polarizer and LC cell.(2) When assembling the LCM into other equipment, the spacer to the bit between the LCM and thefitting plate should have enough height to avoid causing stress to the module surface, refer to the individual specifications for measurements. The measurement tolerance should be ±0.1mm.11.3 ELECTRO-STATIC DISCHARGE CONTROLSince this module uses a CMOS LSI, the same careful attention should be paid for electrostatic discharge as for an ordinary CMOS IC.(1) Make certain that you are grounded when handing LCM.(2) Before removing LCM from its packing case or incorporating it into a set, be sure the module andyour body have the same electric potential.(3) When soldering the terminal of LCM, make certain the AC power source for the soldering irondoes not leak.(4) When using an electric screwdriver to attach LCM, the screwdriver should be of groundpotentiality to minimize as much as possible any transmission of electromagnetic waves produced sparks coming from the commutator of the motor.(5) As far as possible, make the electric potential of your work clothes and that of the workbenches tothe ground potential.(6) To reduce the generation of electro-static discharge, be careful that the air in the work is not toodried. A relative humidity of 50%-60% is recommended.11.4 PRECAUTIONS FOR OPERATION(1) Viewing angle varies with the change of liquid crystal driving voltage (Vo). Adjust Vo to showthe best contrast.(2) Driving the LCD in the voltage above the limit will shorten its lifetime.(3) Response time is greatly delayed at temperature below the operating temperature range. However,this does not mean the LCD will be out of the order. It will recover when it returns to the specified temperature range.(4) If the display area is pushed hard during operation, the display will become abnormal. However, itwill return to normal if it is turned off and then on.(5) Condensation on terminals can cause an electrochemical reaction disrupting the terminal circuit.Therefore, this product must be used and stored within the specified condition of 23±5°C, 45±20%RH.(6) When turning the power on, input each signal after the positive/negative voltage becomes stable.11.5 SAFETY(1) It is recommended to crush damaged or unnecessary LCDs into pieces and wash them off withsolvents such as acetone and ethanol, which should later be burned.(2) If any liquid leaks out of a damaged glass cell and comes in contact with the hands, wash offthoroughly with soap and water.12. REVISION HISTORYrecord Date Version Reviseversion 05-01-011.0 Original2.0 Change specification format 05-11-193.0 Change contact mode 06-07-27SAMPLE APPROVED REPORT。

TLC084资料

TLC084资料

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PowerPAD is a trademark of Texas Instruments.
TLC080 and TLC081 AVAILABLE OPTIONS PACKAGED DEVICES TA 0°C to 70°C SMALL OUTLINE (D)† TLC080CD TLC081CD TLC080ID TLC081ID TLC080AID TLC081AID SMALL OUTLINE (DGN)† TLC080CDGN TLC081CDGN TLC080IDGN TLC081IDGN — — SYMBOL xxTIACW xxTIACY xxTIACX xxTIACZ — — PLASTIC DIP (P) TLC080CP TLC081CP TLC080IP TLC081IP TLC080AIP TLC081AIP
SLOS254D − JUNE 1999 − REVISED FEBRUARY 2004
D Wide Bandwidth . . . 10 MHz D High Output Drive D D D D D D D
− IOH . . . 57 mA at VDD − 1.5 V − IOL . . . 55 mA at 0.5 V High Slew Rate − SR+ . . . 16 V/µs − SR− . . . 19 V/µs Wide Supply Range . . . 4.5 V to 16 V Supply Current . . . 1.9 mA/Channel Ultralow Power Shutdown Mode IDD . . . 125 µA/Channel Low Input Noise Voltage . . . 8.5 nV√Hz Input Offset Voltage . . . 60 µV Ultra-Small Packages − 8 or 10 Pin MSOP (TLC080/1/2/3)

ST TL082, TL082A, TL082B 数据手册

ST TL082, TL082A, TL082B 数据手册

March 2007 Rev 91/17TL082TL082A - TL082BGeneral purpose J-FET dual operational amplifiersFeatures■Wide common-mode (up to V CC +) and differential voltage range ■Low input bias and offset current ■Output short-circuit protection■High input impedance J–FET input stage ■Internal frequency compensation ■Latch up free operation ■High slew rate: 16V/μs (typ)DescriptionThe TL082, TL082A and TL082B are high speed J–FET input dual operational amplifiersincorporating well matched, high voltage J–FET and bipolar transistors in a monolithic integrated circuit.The devices feature high slew rates, low input bias and offset current, and low offset voltage temperature coefficient.Schematic diagram TL082 -TL082A - TL082B2/171 Schematic diagramTL082 -TL082A - TL082B Absolute maximum ratings and operating conditions3/172Absolute maximum ratings and operating conditionsTable 1.Absolute maximum ratingsSymbol ParameterTL082M, AM,BMTL082I, AI,BITL082C, AC,BCUnit V CC Supply voltage (1)±18V V i Input voltage (2)±15V V id Differential input voltage (3)±30V P totPower dissipation680mWR thjaThermal resistance junction to ambient (4)SO-8DIP8TSSOP812585120°C/WR thjcThermal resistance junction to case SO-8DIP8TSSOP8404137°C/WOutput short-circuit duration (5)Infinite T stgStorage temperature range -65 to +150°C ESDHBM: human body model (6)1kV MM: machine model (7)200V CDM: charged device model (8)1500V1.All voltage values, except differential voltage, are with respect to the zero reference level (ground) of the supply voltageswhere the zero reference level is the midpoint between V CC + and V CC -.2.The magnitude of the input voltage must never exceed the magnitude of the supply voltage or 15 volts, whichever is less.3.Differential voltages are the non-inverting input terminal with respect to the inverting input terminal.4.Short-circuits can cause excessive heating. Destructive dissipation can result from simultaneous short-circuit on allamplifiers.5.The output may be shorted to ground or to either supply. Temperature and/or supply voltages must be limited to ensurethat the dissipation rating is not exceeded 6.Human body model: 100pF discharged through a 1.5k Ω resistor between two pins of the device, done for all couples of pincombinations with other pins floating. 7.Machine model: a 200pF cap is charged to the specified voltage, then discharged directly between two pins of the devicewith no external series resistor (internal resistor < 5Ω), done for all couples of pin combinations with other pins floating.8.Charged device model: all pins plus package are charged together to the specified voltage and then discharged directly tothe ground.Table 2.Operating conditionsSymbol ParameterTL082M, AM,BMTL082I, AI, BITL082C, AC,BCUnit V CC Supply voltage6 to 36V T operOperating free-air temperature range-55 to +125-40 to +1050 to +70°CElectrical characteristics TL082 -TL082A - TL082B4/173 Electrical characteristicsTable 3.V CC = ±15V, T amb = +25°C (unless otherwise specified)SymbolParameterTL082I,M,AC,AI,AM,BC,BI,BM TL082CUnitMin.Typ.Max.Min.Typ.Max.V ioInput offset voltage (R s = 50Ω)T amb = +25°CTL082TL082A TL082BT min ≤ T amb ≤ T max TL082TL082A TL082B 3311063137531013mVDV io Input offset voltage drift 1010μV/°C I ioInput offset current (1) T amb = +25°CT min ≤ T amb ≤ T max 51004510010pA nA I ib Input bias current T amb = +25°CT min ≤ T amb ≤ T max20200202040020pA nA A vdLarge signal voltage gain (R L = 2k Ω, V o = ±10V) T amb = +25°CT min ≤ T amb ≤ T max 50252002515200V/mVSVRSupply voltage rejection ratio (R S = 50Ω)T amb = +25°CT min ≤ T amb ≤ T max 808086707086dBI CC Supply current, no load T amb = +25°CT min ≤ T amb ≤ T max1.42.52.51.42.52.5mAV icmInput common mode voltage range ±11+15-12±11+15-12VCMRCommon mode rejection ratio (R S = 50Ω)T amb = +25°CT min ≤ T amb ≤ T max 808086707086dBI osOutput short-circuit current T amb = +25°CT min ≤ T amb ≤ T max 10104060601010406060mA±V oppOutput voltage swing T amb = +25°CRL = 2k Ω RL = 10k ΩT min ≤ T amb ≤ T max RL = 2k ΩRL = 10k Ω101210121213.5101210121213.5VSRSlew rate (T amb = +25°C)V in = 10V , R L = 2k Ω, C L = 100pF , unity gain 816816V/μsTL082 -TL082A - TL082B Electrical characteristics5/17t r Rise time (T amb = +25°C)V in = 20mV , R L = 2k Ω, C L = 100pF , unity gain 0.10.1μs K ov Overshoot (T amb = +25°C)V in = 20mV , R L = 2k Ω, C L = 100pF , unity gain 1010%GBP Gain bandwidth product (T amb = +25°C)V in = 10mV , R L = 2k Ω, C L = 100pF , f= 100kHz 2.54 2.54MHz R i Input resistance10121012ΩTHD Total harmonic distortion (T amb = +25°C),f=1kHz, R L = 2k Ω,C L =100pF , A v =20dB, V o =2V pp 0.010.01%e n Equivalent input noise voltageR S = 100Ω, f = 1KHz 1515∅m Phase margin 4545degrees V o1/V o2Channel separation A v = 100120120dB1.The input bias currents are junction leakage currents which approximately double for every 10°C increase in the junctiontemperature.Table 3.V CC = ±15V, T amb = +25°C (unless otherwise specified) (continued)SymbolParameterTL082I,M,AC,AI,A M,BC,BI,BM TL082CUnitMin.Typ.Max.Min.Typ.Max.nV Hz-----------Electrical characteristicsTL082 -TL082A - TL082B6/17Figure 2.Maximum peak-to-peak outputFigure 3.Maximum peak-to-peak outputFigure 4.Maximum peak-to-peak output Figure 5.Maximum peak-to-peak outputFigure 6.Maximum peak-to-peak output Figure 7.Maximum peak-to-peak outputTL082 -TL082A - TL082BElectrical characteristics7/17Figure 8.Input bias current versus free air temperatureFigure 9.Large signal differential voltage amplification and phase shiftFigure 10.Supply current per amplifier versusFigure rge signal differential voltageFigure 12.Total power dissipation versus free Figure 13.Supply current per amplifier versusElectrical characteristicsTL082 -TL082A - TL082B8/17Figure mon mode rejection ratioFigure 15.Output voltage versus elapsed timeFigure 16.Voltage follower large signal pulseFigure 17.Equivalent input noise voltageFigure 18.Total harmonic distortion versusTL082 -TL082A - TL082B Parameter measurement information9/174 Parameter measurement informationTypical applications TL082 -TL082A - TL082B10/175 Typical applicationsTL082 -TL082A - TL082B Package information11/176 Package informationIn order to meet environmental requirements, STMicroelectronics offers these devices inECOPACK ® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an STMicroelectronics trademark. ECOPACK specifications are available at: .Package information TL082 -TL082A - TL082B 6.1 8-pin plastic DIP package mechanical data12/17TL082 -TL082A - TL082B Package information 6.2 8-pin plastic micropackage (SO8) mechanical data13/17Package information TL082 -TL082A - TL082B 6.3 8-pin TSSOP (thin shrink small outline package) mechanicaldata14/17TL082 -TL082A - TL082B Ordering information15/177 Ordering informationTable 4.Order codesPart number Temperature rangePackage Packing Marking TL082MN -55°C, + 125°CDIP8TubeTL082MN TL082MD/MDT SO8Tube or tape & reel082M TL082MPT TSSOP8 T ape & reelTL082AMN DIP8TubeTL082AMN TL082AMD/AMDT SO8Tube or tape & reel082AM TL082AMPT TSSOP8 T ape & reelTL082BMN DIP8TubeTL082BMN TL082BMD/BMDT SO8Tube or tape & reel082BM TL082BMPT TSSOP8 T ape & reelTL082IN -40°C, +105°CDIP8TubeTL082IN TL082ID/IDT SO8Tube or tape & reel082I TL082IPT TSSOP8 T ape & reelTL082AIN DIP8TubeTL082AIN TL082AID/AIDT SO8Tube or tape & reel082AI TL082AIPT TSSOP8 T ape & reelTL082BIN DIP8TubeTL082BIN TL082BID/BIDT SO8Tube or tape & reel082BI TL082BIPT TSSOP8 T ape & reelTL082CN 0°C, +70°CDIP8TubeTL082CN TL082CD/CDT SO8Tube or tape & reel082C TL082CPT TSSOP8 T ape & reelTL082ACN DIP8TubeTL082ACN TL082ACD/ACDT SO8Tube or tape & reel082AC TL082ACPT TSSOP8 T ape & reelTL082BCN DIP8TubeTL082BCN TL082BCD/BCDT SO8Tube or tape & reel082BC TL082BCPT TSSOP8T ape & reelTL082IYDT (1)-40°C, +105°CSO8(automotive grade level)Tube or tape & reel082IYTL082AIYDT (1)82AIY TL082BIYDT (1)82BIY1.Qualified and characterized according to AEC Q100 and Q003 or equivalent, advanced screening according to AEC Q001& Q 002 or equivalent.Revision history TL082 -TL082A - TL082B16/178 Revision historyDate RevisionChanges2-Apr-20011Initial release.2002-20032-7Internal revisions.30-Apr-20048Format update.6-Mar-20079Added ESD information in Table 1 on page 3.Expanded order codes table and added automotive grade order codes. See T able 4 on page 15.Added T able 2: Operating conditions on page 3.Updated package information to make it compliant with the latest JEDEC standards.TL082 -TL082A - TL082BPlease Read Carefully:Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice.All ST products are sold pursuant to ST’s terms and conditions of sale.Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein.No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein.UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST.ST and the ST logo are trademarks or registered trademarks of ST in various countries.Information in this document supersedes and replaces all information previously supplied.The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.© 2007 STMicroelectronics - All rights reservedSTMicroelectronics group of companiesAustralia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America17/17。

TLC0832中文翻译

TLC0832中文翻译

TLC0831C,TLC0831ITLC0832C,TLC0832I8 位串行控制模数转换一、综述1.1 特点·8 位分辨率·易于和微处理器接口或独立使用·满比例尺工作或用 5V 基准电压·单通道或多路器选择的双通道,可单端或差分输入选择·单 5V 供电,输入范围 0-5V·输入和输出与 TTL 和 CMOS 兼容·在 FCLOCK=250kHz 时,转换时间为 32 μs·设计成可以和国家半导体公司的 ADC0831 和 ADC0832 互换·总非调整误差± 1LSB1.2 介绍这些器件是 8 位逐次逼近模数转换器。

TLC0831 有一个输入通道。

TLC0832 有两个可多路选择的输入通道。

串行输出可配置为和标准移位寄存器或微处理器接口。

TLC0832 的多路器可用软件配置为单端或差分输入。

差分的模拟电压输入可以共模抑制和使模拟输入电压偏移值为零。

另外,输入基准电压可以调整大小,在全 8 位分辨率下允许任意小的模拟电压编码间隔。

TLC0831 、 TLC0832 的工作和更多路输入的 TLC0834 、 TLC0838 非常相似。

使 REF 端输入等于最大模拟信号输入值,可以得到满比例尺转换,获得最高的转换分辨率。

典型地, REF 端设为等于 Vcc( TLC0832内部已设定)。

TLC0831C 和 TLC0832C 的工作温度范围为 0 ~ 70 ℃。

TLC0831I 和TLC0832I 的工作温度范围为-40 ~85 ℃。

TA 封装小型( D )塑料 DIP ( P )0℃至70℃TLC0831CD TLC0832CD TLC0831CP TLC0832CP-40至85℃TLC0831ID TLC0832ID TLC0831IP TLC0832IP1.3 引脚排列TLC0831 及 TLC0832 的引脚排列如下图所示。

7-TLC0820模数转换器应用实验

7-TLC0820模数转换器应用实验

三、模数转换原理
1、双积分型(低速高精度,后面的实验再介绍) 双积分型(低速高精度,后面的实验再介绍) 2、逐次比较型
数字输出 控制
比较器 基准 DAC - + 模拟输入
以三位为例,简单说明其原理。 以三位为例,简单说明其原理。 假如基准为7V 被测模拟电压为4V9 7V, 4V9。 假如基准为7V,被测模拟电压为4V9。 那么模数转换器的逐次比较过程如下: 那么模数转换器的逐次比较过程如下: 第一次送数到数模转换器为100B 模拟输出为4V 100B, 4V, 第一次送数到数模转换器为100B,模拟输出为4V, 比较器的输出为逻辑1 则高位固定为1 比较器的输出为逻辑1,则高位固定为1; 第二次送110B 模拟输出为6V 110B, 6V, 第二次送110B,模拟输出为6V,比较器的输出为逻 则次高位固定为0 辑0,则次高位固定为0; 第三次送101B 模拟输出为5V 101B, 5V, 第三次送101B,模拟输出为5V,比较器的输出为逻 则低位固定为0 辑0,则低位固定为0; 经过逐次送数后,使最后的数字输出结果为100B 100B。 经过逐次送数后,使最后的数字输出结果为100B。 这个过程类似砝码称重。由此可见,输入4V9 4V9而转换 这个过程类似砝码称重。由此可见,输入4V9而转换 100B,即显示为4V的数字量,最大误差大约为1V 4V的数字量 1V。 为100B,即显示为4V的数字量,最大误差大约为1V。 更多位的推论同学们可以自己做一下,显而易见, 更多位的推论同学们可以自己做一下,显而易见,位 数越多精度越高。 数越多精度越高。
注1
注2
在写-读方式下 ( MODE=1 ) :伴随 变低, 伴随CS变低 变低, 在写- 作为输入信号的下降沿变换开始; 在WR作为输入信号的下降沿变换开始; 作为输入信号的下降沿变换开始 在读方式下( 在读方式下 MODE=0 ):RDY在CS的下降沿 : 在 的下降沿 变低,变换结果选通进入输出锁存器后变为高阻态。 变低,变换结果选通进入输出锁存器后变为高阻态。

TLC 产品说明书

TLC 产品说明书

Double the Dose for Severe or Chronic Problems
For severe or chronic clarity, odor, or sludge problems, use double the standard dose for one or two applicatio revert to the standard dose, and maintain standard dose thereafter. Occasionally, during severe heat or drought conditions, a month of double dosing will be effective and is highly recommended.
TLC Products Cleveland, OH 44135
Not a chemical Non-toxic Non-pathogenic 100% natural
Tips and Tricks for Dosing FarmPond Treatment
1. Know the surface area of your pond (see chart for dose) 2. Double the dose for severe problems 3. Apply most of each dose where problems are most severe
Powdered EcoSocks
EcoSocks are powdered sludge reducing bacteria and food grade nutrients. When placed into the pond, EcoSocks continuously release sludge digesting bacteria for a full month.
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FAMILY PACKAGE TABLE DEVICE TLC080 TLC081 TLC082 TLC083 TLC084 TLC085 NO. OF CHANNELS 1 1 2 2 4 4 PACKAGE TYPES MSOP 8 8 8 10 — — PDIP 8 8 8 14 14 16 SOIC 8 8 8 14 14 16 TSSOP — — — — 20 20 — Yes — Yes Refer to the EVM Selection Guide (Lit# SLOU060) SHUTDOWN Yes UNIVERSAL EVM BOARD
−40°C to 125°C
† This package isБайду номын сангаасavailable taped and reeled. To order this packaging option, add an R suffix to the part number (e.g., TLC084CDR).
2

Operational Amplifier
− +
description
The first members of TI’s new BiMOS general-purpose operational amplifier family are the TLC08x. The BiMOS family concept is simple: provide an upgrade path for BiFET users who are moving away from dual-supply to single-supply systems and demand higher ac and dc performance. With performance rated from 4.5 V to 16 V across commercial (0°C to 70°C) and an extended industrial temperature range (−40°C to 125°C), BiMOS suits a wide range of audio, automotive, industrial, and instrumentation applications. Familiar features like offset nulling pins, and new features like MSOP PowerPAD packages and shutdown modes, enable higher levels of performance in a variety of applications. Developed in TI’s patented LBC3 BiCMOS process, the new BiMOS amplifiers combine a very high input impedance, low-noise CMOS front end with a high-drive bipolar output stage, thus providing the optimum performance features of both. AC performance improvements over the TL08x BiFET predecessors include a bandwidth of 10 MHz (an increase of 300%) and voltage noise of 8.5 nV/√Hz (an improvement of 60%). DC improvements include an ensured VICR that includes ground, a factor of 4 reduction in input offset voltage down to 1.5 mV (maximum) in the standard grade, and a power supply rejection improvement of greater than 40 dB to 130 dB. Added to this list of impressive features is the ability to drive ±50-mA loads comfortably from an ultrasmall-footprint MSOP PowerPAD package, which positions the TLC08x as the ideal high-performance general-purpose operational amplifier family.
SLOS254D − JUNE 1999 − REVISED FEBRUARY 2004
TLC08x PACKAGE PINOUTS
TLC080 D, DGN, OR P PACKAGE (TOP VIEW) TLC081 D, DGN, OR P PACKAGE (TOP VIEW) TLC082 D, DGN, OR P PACKAGE (TOP VIEW)
−40°C to 125°C
† This package is available taped and reeled. To order this packaging option, add an R suffix to the part number (e.g., TLC080CDR). TLC082 and TLC083 AVAILABLE OPTIONS PACKAGED DEVICES TA SMALL OUTLINE (D)† TLC082CD TLC083CD TLC082ID TLC083ID TLC082AID TLC083AID MSOP (DGN)† TLC082CDGN — TLC082IDGN — — — SYMBOL‡ xxTIADZ — xxTIAEA — — — (DGQ)† — TLC083CDGQ — TLC083IDGQ — — SYMBOL‡ — xxTIAEB — xxTIAEC — — PLASTIC DIP (N) — TLC083CN — TLC083IN — TLC083AIN PLASTIC DIP (P) TLC082CP — TLC082IP — TLC082AIP —
Copyright 2000−2004 Texas Instruments Incorporated

1
元器件交易网
SLOS254D − JUNE 1999 − REVISED FEBRUARY 2004
TLC080, TLC081, TLC082, TLC083, TLC084, TLC085, TLC08xA FAMILY OF WIDEĆBANDWIDTH HIGHĆOUTPUTĆDRIVE SINGLE SUPPLY OPERATIONAL AMPLIFIERS
元器件交易网
TLC080, TLC081, TLC082, TLC083, TLC084, TLC085, TLC08xA FAMILY OF WIDEĆBANDWIDTH HIGHĆOUTPUTĆDRIVE SINGLE SUPPLY OPERATIONAL AMPLIFIERS
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PowerPAD is a trademark of Texas Instruments.
TLC080 and TLC081 AVAILABLE OPTIONS PACKAGED DEVICES TA 0°C to 70°C SMALL OUTLINE (D)† TLC080CD TLC081CD TLC080ID TLC081ID TLC080AID TLC081AID SMALL OUTLINE (DGN)† TLC080CDGN TLC081CDGN TLC080IDGN TLC081IDGN — — SYMBOL xxTIACW xxTIACY xxTIACX xxTIACZ — — PLASTIC DIP (P) TLC080CP TLC081CP TLC080IP TLC081IP TLC080AIP TLC081AIP
元器件交易网
TLC080, TLC081, TLC082, TLC083, TLC084, TLC085, TLC08xA FAMILY OF WIDEĆBANDWIDTH HIGHĆOUTPUTĆDRIVE SINGLE SUPPLY OPERATIONAL AMPLIFIERS
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
0°C to 70°C
−40°C to 125°C
† This package is available taped and reeled. To order this packaging option, add an R suffix to the part number (e.g., TLC082CDR). ‡ xx represents the device date code. TLC084 and TLC085 AVAILABLE OPTIONS PACKAGED DEVICES TA 0°C to 70°C SMALL OUTLINE (D)† TLC084CD TLC085CD TLC084ID TLC085ID TLC084AID TLC085AID PLASTIC DIP (N) TLC084CN TLC085CN TLC084IN TLC085IN TLC084AIN TLC085AIN TSSOP (PWP)† TLC084CPWP TLC085CPWP TLC084IPWP TLC085IPWP TLC084AIPWP TLC085AIPWP
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