Surface recombination in semiconductors
光纤通信英文版常见中英对照单词表教学内容
精品文档AAbsorption coefficient 吸收系数ac alternating current 交变电流交流Acoustic phonon 声学声子Active component 有源器件AM amplitude modulation 幅度调制AM , FM , PM :幅度/频率/相位调制AON all-optical network 全光网络AOTF acoustic optic tunable filter 声光调制器APD avalanche photodiode 雪崩二极管AR coatings antireflection coatings 抗反膜ASE amplified spontaneous emission 放大自发辐射ASK amplitude shift keying 幅移键控ASK/FSK/PSK 幅/频/相移键控ATM asynchronous transfer mode 异步转移模式Attenuation coefficient 衰减系数Attenuator 衰减器Auger recombination :俄歇复合AWG arrayed-waveguide grating 阵列波导光栅BBand gap :带隙Band pass filter 带通滤波器Beam divergence 光束发散BER bit error rate 误码率BER: 误码率BH buried heterojunction 掩埋异质结Binary representation 二进制表示方法Binary 二进制Birefringence 双折射Birefringence 双折射Bitrate-distance product 比特距离的乘积Block diagram 原理图Boltzman statistics :玻尔兹曼统计分布BPF band pass filter 带通滤波器Bragg condition 布拉格条件Bragg diffraction 布拉格衍射Brillouin scattering 布里渊散射Brillouin shift 布里渊频移Broad area 宽面Buried heterostructure 掩埋异质结CC3 cleaved-coupled cavity 解理耦合腔Carrier lifetime :载流子寿命CATV common antenna cable television 有线电视CDM code division multiplexing 码分复用Characteristics temperature 特征温度Chirp 啁啾Chirped Gaussian pulse 啁啾高斯脉冲Chromatic dispersion 色度色散Chromatic dispersion 色度色散Cladding layer :包层Cladding 包层CNR carrier to noise ratio 载噪比Conduction band :导带Confinement factor 限制因子Connector 连接头Core cladding interface 纤芯包层界面Core-cladding interface 芯层和包层界面Coupled cavity 耦合腔CPFSK continuous-phase frequency-shift keying 连续相位频移键控Cross-phase modulation 交叉相位调制Cross-talk 串音CSO Composite second order 复合二阶CSR Z:载波抑制归零码Cutoff condition 截止条件CVD chemical vapour deposition 化学汽相沉积CW continuous wave 连续波Cylindrical preform :预制棒DDBR distributed Bragg reflector 分布布拉格反射DBR: distributed Bragg reflector 分布式布拉格反射器精品文档dc direct current 直流DCF dispersion compensating fiber色散补偿光纤Depressed-cladding fiber: DFB distributed feedback DFB: Distributed Feedback Differential gain 微分增益 Differential quantum efficiency Diffusion 扩散Digital hierarchy 数字体系 DIP dual in line package 双列直插 Direct bandgap :直接带隙 Directional coupler定向耦合器Dispersion compensation fiber :色散补偿光纤 Dispersion decreasing fiber:色散渐减光纤Dispersion parameter :色散参数 Dispersion shifted fiber 色散位移光纤Dispersion slope 色散斜率 Dispersion slope :色散斜率 Dispersion-flatten fiber :色散平坦光纤 Dispersion-shifted fiber :色散位移光纤 Double heterojunction 双异质结 Double heterostructure :双异质结Doubly clad :双包层DPSK differential phase-shift keying 差分相移键控Driving circuit 驱动电路 Dry fiber 无水光纤 DSF dispersion shift fiber色散位移光纤DWDM dense wavelength division multiplexing/multiplexer 密集波分复用 / 器DWDM: dense wavelength division multiplexing密集波分 复用E~GEDFA erbium doped fiber amplifier掺铒光纤激光器Edge emitting LED 边发射 LED Edge-emitting 边发射 Effective index 有效折射率 Eigenvalue equation 本征值方程 Elastic scattering 弹性散射 Electron-hole pairs 电子空穴对 Electron-hole recombination 电子空穴复合 Electron-hole recombination :电子空穴复合Electrostriction 电致伸缩效应 Ethernet 以太网 External cavity 外腔External quantum efficiency 外量子效率 Extinction ratio 消光比 Eye diagram 眼图 FBG fiber-bragg grating光纤布拉格光栅FDDI fiber distributed data interface 光纤数据分配接口 FDM frequency division multiplexing 频分复用FDM :频分复用 Fermi level 费米能级 Fermi level :费米能级Fermi-Dirac distribution :费米狄拉克分布 FET field effect transistor场效应管Fiber Manufacturing :光纤制作 Field radius 模场半径Filter 滤波器Flame hydrolysis 火焰裂解FM frequency modulation 频率调制Forward-biased :正向偏置 FP Fabry Perot 法布里 - 珀落 Free spectral range 自由光谱范围 Free - space communication自由空间光通信系统Fresnel transmissivity 菲涅耳透射率 Front end 前端Furnace 熔炉FWHM full width at half maximum 半高全宽Differential-dispersion parameter 凹陷包层光纤 分布反馈 分布式反馈微分量子效率FWHM: 半高全宽FWM four-wave mixing 四波混频Gain coefficient 增益系数Gain coupled 增益耦合Gain-guided semiconductor laser 增益波导半导体激光器Germania 锗GIOF graded index optical fiber 渐变折射率分布Graded-index fiber 渐变折射率光纤Group index 群折射率精品文档 GVD group-velocity dispersion GVD: 群速度色散 H~LHBT heterojunction-bipolar transistor 异质结双极晶体管HDTV high definition television高清晰度电视Heavy doping :重掺杂 Heavy-duty cable 重型光缆Heterodyne 外差 Heterojunction :异质结 HFC hybrid fiber-coaxial混合光纤 / 电缆Higher-order dispersion 高阶色散 Highpass filter 高通滤波器 Homodyne 零差Homojunction :同质结 IC integrated circuit 集成电路 IM/DD intensity modulation with direct detection强度调制直接探测IM/DD: 强度调制 / 直接探测 IMD intermodulation distortion 交互调制失真 Impulse 冲激Impurity 杂质 Index-guided 折射率导引 Indirect bandgap :非直接带隙 Inelastic scattering 非弹性散射 Inhomogeneous 非均匀的Inline amplifier 在线放大器 Intensity noise 强度噪声 Intermodal dispersion : 模间色散 Intermode dispersion 模间色散 Internal quantum efficiency :内量子效率 Intramodal dispersion: 模内色散 Intramode dispersion 模内色散 Intrinsic absorption 本征吸收 ISDN integrated services digital network 综合业务数字网ISI intersymbol interference码间干扰Isotropic 各向同性 Jacket 涂层 Jitter 抖动 Junction :结 Kinetic energy :动能精品文档群速度色散 Lambertian source 朗伯光源LAN local-area network 局域网Large effective-area fiber 大有效面积发光Laser threshold 激光阈值 Laser 激光器 Lateral mode 侧模 Lateral 侧向Lattice constant :晶格常数 Launched power 发射功率 LD laser diode 激光二极管 LD :激光二极管LED light emitting diode 发光二极管LED: 发光二极管 L-I light current 光电关系 Light-duty cable 轻型光缆 Linewidth enhancement factor 线宽加强因子 Linewidth enhancement factor 线宽增强因子Linewidth 线宽Longitudinal mode 纵模 Longitudinal model 纵模 Lowpass filter 低通滤波器 LPE liquid phase epitaxy 液相外延 LPE :液相外延M~NMacrobending 宏弯MAN metropolitan-area network 城域网 Material dispersion 材料色散 Material dispersion:材料色散Maxwell 's equations 麦克斯韦方程组 MBE molecular beam epitaxy 分子束外延 MBE :分子束外延MCVD Modified chemical vapor deposition相沉积MCVD :改进的化学汽相沉积 Meridional rays 子午光线 Microbending 微弯 Mie scattering 米氏散射MOCVD metal-organic chemical vapor deposition机物化学汽相沉积MOCVD :改进的化学汽相沉积 Modal dispersion 模式色散改进的化学汽金属有精品文档Mode index 模式折射率Modulation format 调制格式Modulator 调制器MONET Multiwavelength optical networkMPEG motion-picture entertainment group 小组MQW: 多量子阱MSR mode-suppression ratioMSR: Mode suppression ratioMultimode fiber 多模光纤MZ mach-Zehnder 马赫泽德NA numerical aperture 数值孔径Near infrared 近红外NEP noise-equivalent powerNF noise figure 噪声指数Nonradiative recombinationNonradiative recombinationNormalized frequency 归一化频率NRZ :非归零码NSE nonlinear Schrodinger equationNumerical aperture 数值孔径Nyquist criterion 奈奎斯特准则O P QOC optical carrier 光载波OEIC opto-electronic integrated circuit 光电集成电路OOK on-off keying 开关键控OOK :通断键控OPC optical phase conjugation 光相位共轭Optical mode 光模式Optical phase conjugation 光相位共轭Optical soliton 光孤子Optical switch 光开关Optical transmitter 光发射机Optical transmitter :光发射机OTDM optical time-division multiplexing 光时分复用OVD outside-vapor deposition 轴外汽相沉积OVD :轴外汽相沉积OXC optical cross-connect 光交叉连接Packaging 封装Packet switch 分组交换Parabolic-index fiber 抛物线折射率分布光纤Passive component 无源器件PCM pulse-code modulation 脉冲编码调制PCM :脉冲编码调制PCVD :等离子体化学汽相沉积PDF probability density function 概率密度函数PDM polarization-division multiplexing 偏振复用PDM :脉冲宽度调制Phase-matching condition 相位匹配条件Phase-shifted DFB laser 相移DFB 激光器Photon lifetime 光子寿命PMD 偏振模色散Polarization controller 偏振控制器Polarization mode dispersion :偏振模色散Polarization 偏振PON passive optical network 无源接入网Population inversion :粒子数反转Power amplifier 功率放大器Power-conversion efficiency 功率转换效率PPM :脉冲位置调制Preamplifer 前置放大器PSK phase-shift keying 相移键控Pulse broadening 脉冲展宽Quantization noise 量化噪声Quantum efficiency 量子效率Quantum limit 量子极限Quantum limited 量子极限Quantum noise 量子噪声RRA raman amplifier 喇曼放大器Raman scattering 喇曼散射Rate equation 速率方程Rayleigh scattering 瑞丽散射Rayleigh scattering 瑞利散射精品文档Receiver sensitivity 接收机灵敏度Receiver 接收机Refractive index 折射率Regenerator 再生器Repeater spacing 中继距离Resonant cavity 谐振腔ResponsibilityMPN mode-partition noise 模式分配噪声MQW multiquantum well 多量子阱MSK minimum-shift keying 最小频偏键控模式分配噪声模式抑制比等效噪声功率非辐射复合:非辐射复合NRZ non-return to zero 非归零多波长光网络视频动画专家非线性薛定额方程响应度Responsivity 响应度Ridge waveguide laser 脊波导激光器Ridge waveguide 脊波导RIN relative intensity noise 相对强度噪声RMS root-mean-square 均方根RZ return-to-zero 归零RZ: 归零码SSAGCM separate absorption, grading, charge, and multiplication 吸收渐变电荷倍增区分离APD 的一种SAGM separate absorption and multiplication 吸收渐变倍增区分离APD 的一种SAM separate absorption and multiplication 吸收倍增区分离APD 的一种Sampling theorem 抽样定理SBS 受激布里渊散射SBS stimulated Brillouin scattering 受激布里渊散射SCM subcarrier multiplexing 副载波复用SDH synchronous digital hierarchy 同步数字体系SDH :同步数字体系Self-phase modulation 自相位调制Sellmeier equation :塞米尔方程Sensitivity degradation 灵敏度劣化Sensitivity 灵敏度Shot noise 散粒噪声Shot noise 散粒噪声Single-mode condition 单模条件Sintering :烧结SIOF step index optical fiber 阶跃折射率分布SLA/SOA semiconductor laser/optical amplifier 半导体光放大器SLM single longitudinal mode 单纵模SLM: Single Longitudinal mode 单纵模Slope efficiency 斜率效率SNR signal-to-noise ratio 信噪比Soliton 孤子SONET synchronized optical network 同步光网络SONET :同步光网络Spectral density :光谱密度Spontaneous emission :自发辐射Spontaneous-emission factor 自发辐射因子SRS 受激喇曼散射SRS stimulated Raman scattering 受激喇曼散射Step-index fiber 阶跃折射率光纤Stimulated absorption :受激吸收Stimulated emission :受激发射STM synchronous transport module 同步转移模块STM :同步转移模块Stripe geometry semiconductor laser 条形激光器Stripe geometry 条形STS synchronous transport signal 同步转移信号Submarine transmission system 海底传输系统Substrate: 衬底Superstructure grating 超结构光栅Surface emitting LED 表面发射LED Surface recombination :表面复合Surface-emitting 表面发射TCP/IP transmission control protocol/internet protocol 传输控制协议/ 互联网协议TDM time-division multiplexing 时分复用TDM :时分复用TE transverse electric 横电模Ternary and quaternary compound :三元系和四元系化合物Thermal equilibrium :热平衡Thermal noise 热噪声Thermal noise 热噪声Threshold current 阈值电流Timing jitter 时间抖动TM transverse magnetic 横磁Total internal reflection 全内反射Transceiver module 收发模块精品文档Transmitter 发射机Transverse 横向Transverse mode 横模TW traveling wave 行波U ~ ZVAD vapor-axial epitaxy 轴向汽相沉积VAD :轴向沉积Valence band :价带VCSEL vertical-cavity surface-emitting laser 垂直腔表面发射激光器VCSEL: vertical cavity surface-emitting lasers 垂直腔表面发射激光器VPE vapor-phase epitaxy 汽相沉积VPE :汽相外延VSB vestigial sideband 残留边带Wall-plug efficiency 电光转换效率WAN wide-area network 广域网Waveguide dispersion 波导色散Waveguide dispersion :波导色散Waveguide imperfection 波导不完善WDMA wavelength-division multiple access 波分复用接入系统WGA waveguide-grating router 波导光栅路由器White noise 白噪声XPM cross-phase modulation 交叉相位调制YIG yttrium iron garnet 钇铁石榴石晶体Zero-dispersion wavelength 零色散波长Zero-dispersion wavelength :零色散波长。
半导体微电子专业词汇中英文对照
半导体微电子专业词汇中英文对照Accelerated testing 加速实验Acceptor 受主Acceptor atom 受主原子Accumulation 积累、堆积Accumulating contact 积累接触Accumulation region 积累区Accumulation layer 积累层Acoustic Surface Wave 声表面波Active region 有源区Active component 有源元Active device 有源器件Activation 激活Activation energy 激活能Active region 有源(放大)区A/D conversion 模拟—数字转换Adhesives 粘接剂Admittance 导纳Aging 老化Airborne 空载Allowed band 允带allowance 容限,公差Alloy-junction device合金结器件Aluminum(Aluminum)铝Aluminum – oxide 铝氧化物Aluminum Nitride 氮化铝Aluminum passivation 铝钝化Ambipolar 双极的Ambient temperature 环境温度A M light 振幅调制光,调幅光amplitude limiter 限幅器Amorphous 无定形的,非晶体的Amplifier 功放放大器Analogue(Analog) comparator 模拟比较器Angstrom 埃Anneal 退火Anisotropic 各向异性的Anode 阳极Antenna 天线Aperture 孔径Arsenide (As) 砷Array 阵列Atomic 原子的Atom Clock 原子钟Attenuation 衰减Audio 声频Auger 俄歇Automatic 自动的Automotive 汽车的Availability 实用性Avalanche 雪崩Avalanche breakdown 雪崩击穿Avalanche excitation雪崩激发Background carrier 本底载流子Background doping 本底掺杂Backward 反向Backward bias 反向偏置Ball bond 球形键合Band 能带Band gap 能带间隙Bandwidth 带宽Bar 巴条发光条Barrier 势垒Barrier layer 势垒层Barrier width 势垒宽度Base 基极Base contact 基区接触Base stretching 基区扩展效应Base transit time 基区渡越时间Base transport efficiency基区输运系数Base—width modulation基区宽度调制Batch 批次Battery 电池Beam 束光束电子束Bench 工作台Bias 偏置Bilateral switch 双向开关Binary code 二进制代码Binary compound semiconductor 二元化合物半导体Bipolar 双极性的Bipolar Junction Transistor (BJT)双极晶体管Bit 位比特Blocking band 阻带Body — centered 体心立方Body—centred cubic structure 体立心结构Boltzmann 波尔兹曼Bond 键、键合Bonding electron 价电子Bonding pad 键合点Boron 硼Borosilicate glass 硼硅玻璃Bottom-up 由下而上的Boundary condition 边界条件Bound electron 束缚电子Bragg effect 布拉格效应Breadboard 模拟板、实验板Break down 击穿Break over 转折Brillouin 布里渊FBrillouin zone 布里渊区Buffer 缓冲器Built-in 内建的Build—in electric field 内建电场Bulk 体/体内Bulk absorption 体吸收Bulk generation 体产生Bulk recombination 体复合Burn-in 老化Burn out 烧毁Buried channel 埋沟Buried diffusion region 隐埋扩散区Bus 总线Calibration 校准,检定,定标、刻度,分度Capacitance 电容Capture cross section 俘获截面Capture carrier 俘获载流子Carbon dioxide (CO2) 二氧化碳Carrier 载流子、载波Carry bit 进位位Cascade 级联Case 管壳Cathode 阴极Cavity 腔体Center 中心Ceramic 陶瓷(的)Channel 沟道Channel breakdown 沟道击穿Channel current 沟道电流Channel doping 沟道掺杂Channel shortening 沟道缩短Channel width 沟道宽度Characteristic impedance 特征阻抗Charge 电荷、充电Charge-compensation effects 电荷补偿效应Charge conservation 电荷守恒Charge drive/exchange/sharing/transfer/storage 电荷驱动/交换/共享/转移/存储Chemical etching 化学腐蚀法Chemically—Polish 化学抛光Chemically—Mechanically Polish (CMP)化学机械抛光Chemical vapor deposition (cvd)化学汽相淀积Chip 芯片Chip yield 芯片成品率Circuit 电路Clamped 箝位Clamping diode 箝位二极管Cleavage plane 解理面Clean 清洗Clock rate 时钟频率Clock generator 时钟发生器Clock flip—flop 时钟触发器Close—loop gain 闭环增益Coating 涂覆涂层Coefficient of thermal expansion 热膨胀系数Coherency 相干性Collector 集电极Collision 碰撞Compensated OP-AMP 补偿运放Common-base/collector/emitter connection 共基极/集电极/发射极连接Common—gate/drain/source connection 共栅/漏/源连接Common—mode gain 共模增益Common-mode input 共模输入Common—mode rejection ratio (CMRR) 共模抑制比Communication 通信Compact 致密的Compatibility 兼容性Compensation 补偿Compensated impurities 补偿杂质Compensated semiconductor 补偿半导体Complementary Darlington circuit 互补达林顿电路Complementary Metal-Oxide-SemiconductorField-Effect-Transistor(CMOS)互补金属氧化物半导体场效应晶体管Computer-aided design (CAD)/test(CAT)/manufacture(CAM)计算机辅助设计/ 测试/制造Component 元件Compound Semiconductor 化合物半导体Conductance 电导Conduction band (edge)导带(底)Conduction level/state 导带态Conductor 导体Conductivity 电导率Configuration 结构Conlomb 库仑Constants 物理常数Constant energy surface 等能面Constant-source diffusion恒定源扩散Contact 接触Continuous wave 连续波Continuity equation 连续性方程Contact hole 接触孔Contact potential 接触电势Controlled 受控的Converter 转换器Conveyer 传输器Cooling 冷却Copper interconnection system 铜互连系统Corrosion 腐蚀Coupling 耦合Covalent 共阶的Crossover 交叉Critical 临界的Cross—section 横断面Crucible坩埚Cryogenic cooling system 冷却系统Crystal defect/face/orientation/lattice 晶体缺陷/晶面/晶向/晶格Cubic crystal system 立方晶系Current density 电流密度Curvature 曲率Current drift/drive/sharing 电流漂移/驱动/共享Current Sense 电流取样Curve 曲线Custom integrated circuit 定制集成电路Cut off 截止Cylindrical 柱面的Czochralshicrystal 直立单晶Czochralski technique 切克劳斯基技术(Cz法直拉晶体J))Dangling bonds 悬挂键Dark current 暗电流Dead time 空载时间Decade 十进制Decibel (dB)分贝Decode 解码Deep acceptor level 深受主能级Deep donor level 深施主能级Deep energy level 深能级Deep impurity level 深度杂质能级Deep trap 深陷阱Defeat 缺陷Degenerate semiconductor 简并半导体Degeneracy 简并度Degradation 退化Degree Celsius(centigrade)/Kelvin 摄氏/开氏温度Delay 延迟Density 密度Density of states 态密度Depletion 耗尽Depletion approximation 耗尽近似Depletion contact 耗尽接触Depletion depth 耗尽深度Depletion effect 耗尽效应Depletion layer 耗尽层Depletion MOS 耗尽MOS Depletion region 耗尽区Deposited film 淀积薄膜Deposition process 淀积工艺Design rules 设计规则Detector 探测器Developer 显影剂Diamond 金刚石Die 芯片(复数dice)Diode 二极管Dielectric Constant 介电常数Dielectric isolation 介质隔离Difference-mode input 差模输入Differential amplifier 差分放大器Differential capacitance 微分电容Diffusion 扩散Diffusion coefficient 扩散系数Diffusion constant 扩散常数Diffusivity 扩散率Diffusion capacitance/barrier/current/furnace 扩散电容/势垒/电流/炉Digital circuit 数字电路Dimension (1)尺寸(2)量钢(3)维,度Diode 二极管Dipole domain 偶极畴Dipole layer 偶极层Direct—coupling 直接耦合Direct—gap semiconductor 直接带隙半导体Direct transition 直接跃迁Directional antenna 定向天线Discharge 放电Discrete component 分立元件Disorder 无序的Display 显示器Dissipation 耗散Dissolution 溶解Distributed capacitance 分布电容Distributed model 分布模型Displacement 位移Dislocation 位错Domain 畴Donor 施主Donor exhaustion 施主耗尽Dopant 掺杂剂Doped semiconductor 掺杂半导体Doping concentration 掺杂浓度Dose 剂量Double—diffusive MOS(DMOS)双扩散MOS Drift 漂移Drift field 漂移电场Drift mobility 迁移率Dry etching 干法腐蚀Dry/wet oxidation 干/湿法氧化Dose 剂量Dual—polarization 双偏振,双极化Duty cycle 工作周期Dual-in-line package (DIP) 双列直插式封装Dynamics 动态Dynamic characteristics 动态属性Dynamic impedance 动态阻抗Early effect 厄利效应Early failure 早期失效Effect 效应Effective mass 有效质量Electric Erase Programmable Read Only Memory(E2PROM) 电可擦除只读存储器Electrode 电极Electromigration 电迁移Electron affinity 电子亲和势Electron-beam 电子束Electroluminescence 电致发光Electron gas 电子气Electron trapping center 电子俘获中心Electron Volt (eV) 电子伏Electro—optical 光电的Electrostatic 静电的Element 元素/元件/配件Elemental semiconductor 元素半导体Ellipse 椭圆Emitter 发射极Emitter—coupled logic 发射极耦合逻辑Emitter-coupled pair 发射极耦合对Emitter follower 射随器Empty band 空带Emitter crowding effect 发射极集边(拥挤)效应Endurance test =life test 寿命测试Energy state 能态Energy momentum diagram 能量-动量(E—K)图Enhancement mode 增强型模式Enhancement MOS 增强性MOSEnteric (低)共溶的Environmental test 环境测试Epitaxial 外延的Epitaxial layer 外延层Epitaxial slice 外延片Epoxy 环氧的Equivalent circuit 等效电路Equilibrium majority /minority carriers 平衡多数/少数载流子Equipment 设备Erasable Programmable ROM (EPROM)可搽取(编程)存储器Erbium laser 掺铒激光器Error function complement 余误差函数Etch 刻蚀Etchant 刻蚀剂Etching mask 抗蚀剂掩模Excess carrier 过剩载流子Excitation energy 激发能Excited state 激发态Exciton 激子Exponential 指数的Extrapolation 外推法Extrinsic 非本征的Extrinsic semiconductor 杂质半导体Fabry—Perot amplifier 法布里-珀罗放大器Face — centered 面心立方Fall time 下降时间Fan-in 扇入Fan—out 扇出Fast recovery 快恢复Fast surface states 快表面态Feedback 反馈Fermi level 费米能级Femi potential 费米势Fiber optic 光纤Field effect transistor 场效应晶体管Field oxide 场氧化层Figure of merit 品质因数Filter 滤波器Filled band 满带Film 薄膜Fine pitch 细节距Flash memory 闪存存储器Flat band 平带Flat pack 扁平封装Flatness 平整度Flexible 柔性的Flicker noise 闪烁(变)噪声Flip-chip 倒装芯片Flip— flop toggle 触发器翻转Floating gate 浮栅Fluoride etch 氟化氢刻蚀Focal plane 焦平面Forbidden band 禁带Formulation 列式,表达Forward bias 正向偏置Forward blocking /conducting 正向阻断/导通Free electron 自由电子Frequency deviation noise 频率漂移噪声Frequency response 频率响应Function 函数Gain 增益Gallium—Arsenide(GaAs) 砷化镓Gallium Nitride 氮化镓Gate 门、栅、控制极Gate oxide 栅氧化层Gate width 栅宽Gauss(ian)高斯Gaussian distribution profile 高斯掺杂分布Generation-recombination 产生-复合Geometries 几何尺寸Germanium(Ge) 锗Gold 金Graded 缓变的Graded (gradual) channel 缓变沟道Graded junction 缓变结Grain 晶粒Gradient 梯度Graphene 石墨烯Grating 光栅Green laser 绿光激光器Ground 接地Grown junction 生长结Guard ring 保护环Guide wave 导波波导Gunn — effect 狄氏效应Gyroscope 陀螺仪Hardened device 辐射加固器件Harmonics 谐波Heat diffusion 热扩散Heat sink 散热器、热沉Heavy/light hole band 重/轻空穴带Hell — effect 霍尔效应Hertz 赫兹Heterojunction 异质结Heterojunction structure 异质结结构Heterojunction Bipolar Transistor(HBT)异质结双极型晶体High field property 高场特性High—performance MOS(H—MOS)高性能MOS器件High power 大功率Hole 空穴Homojunction 同质结Horizontal epitaxial reactor 卧式外延反应器Hot carrier 热载流子Hybrid integration 混合集成Illumination (1)照明(2)照明学Image - force 镜象力Impact ionization 碰撞电离Impedance 阻抗Imperfect structure 不完整结构Implantation dose 注入剂量Implanted ion 注入离子Impurity 杂质Impurity scattering 杂志散射Inch 英寸Incremental resistance 电阻增量(微分电阻)In—contact mask 接触式掩模Index of refraction 折射率Indium 铟Indium tin oxide (ITO)铟锡氧化物Inductance 电感Induced channel 感应沟道Infrared 红外的Injection 注入Input power 输入功率Insertion loss 插入损耗Insulator 绝缘体Insulated Gate FET(IGFET) 绝缘栅FET Integrated injection logic 集成注入逻辑Integration 集成、积分Integrated Circuit 集成电路Interconnection 互连Interconnection time delay 互连延时Interdigitated structure 交互式结构Interface 界面Interference 干涉International system of unions 国际单位制Internally scattering 谷间散射Interpolation 内插法Intrinsic 本征的Intrinsic semiconductor 本征半导体Inverse operation 反向工作Inversion 反型Inverter 倒相器Ion 离子Ion beam 离子束Ion etching 离子刻蚀Ion implantation 离子注入Ionization 电离Ionization energy 电离能Irradiation 辐照Isolation land 隔离岛Isotropic 各向同性Junction FET(JFET) 结型场效应管Junction isolation 结隔离Junction spacing 结间距Junction side—wall 结侧壁Laser 激光器Laser diode 激光二极管Latch up 闭锁Lateral 横向的Lattice 晶格Layout 版图Lattice binding/cell/constant/defect/distortion 晶格结合力/晶胞/晶格/晶格常熟/晶格缺陷/晶格畸变Lead 铅Leakage current (泄)漏电流Life time 寿命linearity 线性度Linked bond 共价键Liquid Nitrogen 液氮Liquid-phase epitaxial growth technique 液相外延生长技术Lithography 光刻Light Emitting Diode(LED) 发光二极管Linearity 线性化Liquid 液体Lock in 锁定Longitudinal 纵向的Long life 长寿命Lumped model 集总模型Magnetic 磁的Majority carrier 多数载流子Mask 掩膜板,光刻板Mask level 掩模序号Mask set 掩模组Mass — action law 质量守恒定律Master-slave D flip-flop 主从D 触发器Matching 匹配Material 材料Maxwell 麦克斯韦Mean free path 平均自由程Mean time before failure (MTBF)平均工作时间Mechanical 机械的Membrane (1)薄腊,膜片(2)隔膜Megeto — resistance 磁阻Mesa 台面MESFET-Metal Semiconductor 金属半导体FET Metalorganic Chemical Vapor Deposition MOCVD 金属氧化物化学汽相淀积Metallization 金属化Metal oxide semiconductor (MOS)金属氧化物半导体MeV 兆电子伏Microelectronic technique 微电子技术Microelectronics 微电子学Microelectromechanical System (MEMS)微电子机械系统Microwave 微波Millimeterwave 毫米波Minority carrier 少数载流子Misfit 失配Mismatching 失配Mobility 迁移率Module 模块Modulate 调制Molecular crystal 分子晶体Monolithic IC 单片MOSFET 金属氧化物半导体场效应晶体管Mount 安装Multiplication 倍增Modulator 调制Multi—chip IC 多芯片ICMulti—chip module(MCM) 多芯片模块Multilayer 多层Multiplication coefficient 倍增因子Multiplexer 复用器Multiplier 倍增器Naked chip 未封装的芯片(裸片) Nanometer 纳米Nanotechnology 纳米技术Negative feedback 负反馈Negative resistance 负阻Negative—temperature-coefficient负温度系数Nesting 套刻Noise figure 噪声系数Nonequilibrium 非平衡Nonvolatile 非挥发(易失)性Normally off/on 常闭/开Nuclear 核Numerical analysis 数值分析Occupied band 满带Offset 偏移、失调On standby 待命状态Ohmic contact 欧姆接触Open circuit 开路Operating point 工作点Operating bias 工作偏置Operational amplifier (OPAMP)运算放大器Optical photon 光子Optical quenching 光猝灭Optical transition 光跃迁Optical—coupled isolator 光耦合隔离器Organic semiconductor 有机半导体Orientation 晶向、定向Oscillator 振荡器Outline 外形Out—of—contact mask 非接触式掩模Output characteristic 输出特性Output power 输出功率Output voltage swing 输出电压摆幅Overcompensation 过补偿Over-current protection 过流保护Over shoot 过冲Over—voltage protection 过压保护Overlap 交迭Overload 过载Oscillator 振荡器Oxide 氧化物Oxidation 氧化Oxide passivation 氧化层钝化Package 封装Pad 压焊点Parameter 参数Parasitic effect 寄生效应Parasitic oscillation 寄生振荡Pass band 通带Passivation 钝化Passive component 无源元件Passive device 无源器件Passive surface 钝化界面Parasitic transistor 寄生晶体管Pattern 图形Payload 有效载荷Peak-point voltage 峰点电压Peak voltage 峰值电压Permanent—storage circuit 永久存储电路Period 周期Permeable — base 可渗透基区Phase—lock loop 锁相环Phase drift 相移Phonon spectra 声子谱Photo conduction 光电导Photo diode 光电二极管Photoelectric cell 光电池Photoelectric effect 光电效应Photonic devices 光子器件Photolithographic process 光刻工艺Photoluminescence 光致发光Photo resist (光敏)抗腐蚀剂Photo mask 光掩模Piezoelectric effect 压电效应Pin 管脚Pinch off 夹断Pinning of Fermi level 费米能级的钉扎(效应)Planar process 平面工艺Planar transistor 平面晶体管Plasma 等离子体Plane 平面的Plasma 等离子体Plate 板电路板P-N junction pn结Poisson equation 泊松方程Point contact 点接触Polarity 极性Polycrystal 多晶Polymer semiconductor 聚合物半导体Poly—silicon 多晶硅Positive 正的Potential (电)势Potential barrier 势垒Potential well 势阱Power electronic devices电力电子器件Power dissipation 功耗Power transistor 功率晶体管Preamplifier 前置放大器Primary flat 主平面Print-circuit board(PCB)印制电路板Probability 几率Probe 探针Procedure 工艺Process 工艺Projector 投影仪Propagation delay 传输延时Proton 质子Proximity effect 邻近效应Pseudopotential method 赝势法Pump 泵浦Punch through 穿通Pulse triggering/modulating 脉冲触发/调制Pulse Widen Modulator(PWM) 脉冲宽度调制Punchthrough 穿通Push—pull stage 推挽级Q Q值Quality factor 品质因子Quantization 量子化Quantum 量子Quantum efficiency 量子效应Quantum mechanics 量子力学Quasi – Fermi-level 准费米能级Quartz 石英Radar 雷达Radiation conductivity 辐射电导率Radiation damage 辐射损伤Radiation flux density 辐射通量密度Radiation hardening 辐射加固Radiation protection 辐射保护Radiative — recombination 辐照复合Radio 无线电射电射频Radio-frequency RF 射频Raman 拉曼Random 随机Range 测距Radio 比率系数Ray 射线Reactive sputtering source 反应溅射源Real time 实时Receiver 接收机Recombination 复合Recovery diode 恢复二极管Record 记录Recovery time 恢复时间Rectifier 整流器(管)Rectifying contact 整流接触Red light 红光Reference 基准点基准参考点Refractive index 折射率Register 寄存器Regulate 控制调整Relative 相对的Relaxation 驰豫Relaxation lifetime 驰豫时间Relay 中继Reliability 可靠性Remote 远程Repeatability 可重复性Reproduction 重复制造Residual current 剩余电流Resonance 谐振Resin 树脂Resistance 电阻Resistor 电阻器Resistivity 电阻率Regulator 稳压管(器) Resolution 分辨率Response time 响应时间Return signal 回波信号Reverse 反向的Reverse bias 反向偏置Ribbon 光纤带Ridge waveguide 脊形波导Ring laser 环形激光器Rotary wave 旋转波Run 运行Sampling circuit 取样电路Sapphire 蓝宝石(Al2O3)Satellite valley 卫星谷Saturated current range 电流饱和区Scan 扫描Scaled down 按比例缩小Schematic layout 示意图,简图Schottky 肖特基Schottky barrier 肖特基势垒Schottky contact 肖特基接触Screen 筛选Scribing grid 划片格Secondary flat 次平面Seed crystal 籽晶Segregation 分凝Selectivity 选择性Self aligned 自对准的Self diffusion 自扩散Semiconductor 半导体Semiconductor laser半导体激光器Semiconductor—controlled rectifier 半导体可控硅Sensitivity 灵敏度Sensor 传感器Serial 串行/串联Series inductance 串联电感Settle time 建立时间Sheet resistance 薄层电阻Shield 屏蔽Shifter 移相器Short circuit 短路Shot noise 散粒噪声Shunt 分流Sidewall capacitance 边墙电容Signal 信号Silica glass 石英玻璃Silicon 硅Silicon carbide 碳化硅Silicon dioxide (SiO2)二氧化硅Silicon Nitride(Si3N4) 氮化硅Silicon On Insulator 绝缘体上硅Silver whiskers 银须Simple cubic 简立方Simulation 模拟Single crystal 单晶Sink 热沉Sinter 烧结Skin effect 趋肤效应Slot 槽隙Slow wave 慢波Smooth 光滑的Subthreshold 亚阈值的Solar battery/cell 太阳能电池Solid circuit 固体电路Solid Solubility 固溶度Solution 溶液Sonband 子带Source 源极Source follower 源随器Space charge 空间电荷Space Craft 宇宙飞行器Spacing 间距Specific heat(PT) 比热Spectral 光谱Spectrum 光谱(复数)Speed-power product 速度功耗乘积Spherical 球面的Spin 自旋Split 分裂Spontaneous emission 自发发射Spot 斑点Spray 喷涂Spreading resistance 扩展电阻Sputter 溅射Square root 平方根Stability 稳定性Stacking fault 层错Standard 标准的Standing wave 驻波State-of-the-art 最新技术Static characteristic 静态特性Statistical analysis 统计分析Steady state 稳态Step motor 步进式电动机Stimulated emission 受激发射Stimulated recombination 受激复合Stopband 阻带Storage time 存储时间Stress 应力Stripline 带状线Subband 次能带Sublimation 升华Submillimeter 亚毫米波Substrate 衬底Substitutional 替位式的Superconductor 超导(电)体Superlattice 超晶格Supply 电源Surface mound表面安装Surge capacity 浪涌能力Switching time 开关时间Switch 开关Synchronizer 同步器,同步装置Synthetic-aperture 合成孔径System 系统Technical 技术的,工艺的Telecommunication 远距通信,电信Telescope 望远镜Terahertz 太赫兹Terminal 终端Template 模板Temperature 温度Tensor 张量Test 测试试验Thermal activation 热激发Thermal conductivity 热导率Thermal equilibrium 热平衡Thermal Oxidation 热氧化Thermal resistance 热阻Thermal sink 热沉Thermal velocity 热运动Thick— film technique 厚膜技术Thin- film hybrid IC 薄膜混合集成电路Thin-Film Transistor(TFT) 薄膜晶体Three dimension 三维Threshold 阈值Through Silicon Via 硅通孔Thyistor 晶闸管Time resolution 时间分辨率Tolerance 公差T/R module 发射/接收模块Transconductance 跨导Transfer characteristic 转移特性Transfer electron 转移电子Transfer function 传输函数Transient 瞬态的Transistor aging(stress) 晶体管老化Transit time 渡越时间Transition 跃迁Transition—metal silica 过度金属硅化物Transition probability 跃迁几率Transition region 过渡区Transmissivity 透射率Transmitter 发射机Transceiver 收发机Transport 输运Transverse 横向的Trap 陷阱Trapping 俘获Trapped charge 陷阱电荷Travelling wave 行波Trigger 触发Trim 调配调整Triple diffusion 三重扩散Tolerance 容差Tube 管子电子管Tuner 调节器Tunnel(ing) 隧道(穿)Tunnel current 隧道电流Turn - off time 关断时间Ultraviolet 紫外的Ultrabright 超亮的Ultrasonic 超声的Underfilling 下填充Undoped 无掺杂Unijunction 单结的Unipolar 单极的Unit cell 原(元)胞Unity— gain frequency 单位增益频率Unilateral-switch 单向开关Vacancy 空位Vacuum 真空Valence(value) band 价带Value band edge 价带顶Valence bond 价键Vapour phase 汽相Varactor 变容管Variable 可变的Vector 矢量Vertical 垂直的Vibration 振动Visible light 可见光Voltage 电压Volt 伏特Wafer 晶片Watt 瓦Wave guide 波导Wavelength 波长Wave-particle duality 波粒二相性Wear-out 烧毁Wetting 浸润Wideband 宽禁带Wire 引线Wire routing 布线Work function 功函数Worst-case device 最坏情况器件X-ray X射线Yield 成品率Zinc 锌。
半导体器件双语词汇
Doping profile(掺杂分布)Step junction(突变结)One-side Step junction(单边突变结)Diffussion(扩散)Graded junction (缓变结)Gradient(梯度)Net charge(净电荷)Depletion(耗尽层)Space charge region(空间电荷区)Potential barrier region(势垒区)Electric field(电场)Built-in potential(内建电场)Space charge region width(空间电荷区宽度)Quantative calculation(定量的)Qualitative(定性的)Substrate (衬底的)Forward bias(正偏)Reverse bias(反偏)Non-uniform doping(非均匀掺杂)Linearly graded junction(线性缓变结)Ideal-diode equation (理想二极管方程)Ideal pn junction model(理想pn结模型)Using boltgmann approximation(波尔兹曼近似)No generation and recombination inside the deletion layer(耗尽区内没有产生与复合)Low injection(小注入)Step junction with abrupt depletion layer approximation(突变结耗尽层近似)Mathmatical model(数学模型)Reverse saturation current(反向饱和电流)High junction(大注入)Small-signal model of pn junction(小信号)pn(结模型)Diffusion capacitance(扩散电容)Depletion layer capacitance(势垒电容)Junction capacitance(结电容)Breakdown voltage of pn junction pn(结击穿电压) Avalanche Breakdown (雪崩击穿)Tunnel Breakdown(隧道击穿)Transient of pn junction pn(结瞬态特性)Model and model parameters of pn junction diode (二极管模型和模型参数)Base width modulation and early voltage(基区宽变效应和厄利电压)Cutoff frequency(截止频率)JFET (junction field effect transistor)MESFET(metal semiconductor)Enhancement(增强型)Depletion (耗尽型)Flat band voltage(平带电压)11111。
半导体工艺中的英语词汇
AAbrupt junction 突变结Accelerated testing 加速实验Acceptor 受主Acceptor atom 受主原子Accumulation 积累、堆积Accumulating contact 积累接触Accumulation region 积累区Accumulation layer 积累层Active region 有源区Active component 有源元Active device 有源器件Activation 激活Activation energy 激活能Active region 有源(放大)区Admittance 导纳Allowed band 允带Alloy-junction device合金结器件Aluminum(Aluminium)铝Aluminum - oxide 铝氧化物Aluminum passivation 铝钝化Ambipolar 双极的Ambient temperature 环境温度Amorphous 无定形的,非晶体的Amplifier 功放扩音器放大器Analogue(Analog)comparator 模拟比较器Angstrom 埃Anneal 退火Anisotropic 各向异性的Anode 阳极Arsenic (AS)砷Auger 俄歇Auger process 俄歇过程Avalanche 雪崩Avalanche breakdown 雪崩击穿Avalanche excitation雪崩激发BBackground carrier 本底载流子Background doping 本底掺杂Backward 反向Backward bias 反向偏置Ballasting resistor 整流电阻Ball bond 球形键合Band 能带Band gap 能带间隙Barrier 势垒Barrier layer 势垒层Barrier width 势垒宽度Base 基极Base contact 基区接触Base stretching 基区扩展效应Base transit time 基区渡越时间Base transport efficiency基区输运系数Base-width modulation基区宽度调制Basis vector 基矢Bias 偏置Bilateral switch 双向开关Binary code 二进制代码Binary compound semiconductor 二元化合物半导体Bipolar 双极性的Bipolar Junction Transistor (BJT)双极晶体管Bloch 布洛赫Blocking band 阻挡能带Blocking contact 阻挡接触Body - centered 体心立方Body-centred cubic structure 体立心结构Boltzmann 波尔兹曼Bond 键、键合Bonding electron 价电子Bonding pad 键合点Bootstrap circuit 自举电路Bootstrapped emitter follower 自举射极跟随器Boron 硼Borosilicate glass 硼硅玻璃Boundary condition 边界条件Bound electron 束缚电子Breadboard 模拟板、实验板Break down 击穿Break over 转折Brillouin 布里渊Brillouin zone 布里渊区Built-in 内建的Build-in electric field 内建电场Bulk 体/体内Bulk absorption 体吸收Bulk generation 体产生Bulk recombination 体复合Burn - in 老化Burn out 烧毁Buried channel 埋沟Buried diffusion region 隐埋扩散区CCan 外壳Capacitance 电容Capture cross section 俘获截面Capture carrier 俘获载流子Carrier 载流子、载波Carry bit 进位位Carry-in bit 进位输入Carry-out bit 进位输出Cascade 级联Case 管壳Cathode 阴极Center 中心Ceramic 陶瓷(的)Channel 沟道Channel breakdown 沟道击穿Channel current 沟道电流Channel doping 沟道掺杂Channel shortening 沟道缩短Channel width 沟道宽度Characteristic impedance 特征阻抗Charge 电荷、充电Charge-compensation effects 电荷补偿效应Charge conservation 电荷守恒Charge neutrality condition 电中性条件Charge drive/exchange/sharing/transfer/storage 电荷驱动/交换/共享/转移/存储Chemmical etching 化学腐蚀法Chemically-Polish 化学抛光Chemmically-Mechanically Polish (CMP)化学机械抛光Chip 芯片Chip yield 芯片成品率Clamped 箝位Clamping diode 箝位二极管Cleavage plane 解理面Clock rate 时钟频率Clock generator 时钟发生器Clock flip-flop 时钟触发器Close-packed structure 密堆积结构Close-loop gain 闭环增益Collector 集电极Collision 碰撞Compensated OP-AMP 补偿运放Common-base/collector/emitter connection 共基极/集电极/发射极连接Common-gate/drain/source connection 共栅/漏/源连接Common-mode gain 共模增益Common-mode input 共模输入Common-mode rejection ratio (CMRR)共模抑制比Compatibility 兼容性Compensation 补偿Compensated impurities 补偿杂质Compensated semiconductor 补偿半导体Complementary Darlington circuit 互补达林顿电路Complementary Metal-Oxide-Semiconductor Field-Effect-Transistor(CMOS)互补金属氧化物半导体场效应晶体管Complementary error function 余误差函数Computer-aided design (CAD)/test(CAT)/manufacture(CAM)计算机辅助设计/ 测试/制造Compound Semiconductor 化合物半导体Conductance 电导Conduction band (edge)导带(底)Conduction level/state 导带态Conductor 导体Conductivity 电导率Configuration 组态Conlomb 库仑Conpled Configuration Devices 结构组态Constants 物理常数Constant energy surface 等能面Constant-source diffusion恒定源扩散Contact 接触Contamination 治污Continuity equation 连续性方程Contact hole 接触孔Contact potential 接触电势Continuity condition 连续性条件Contra doping 反掺杂Controlled 受控的Converter 转换器Conveyer 传输器Copper interconnection system 铜互连系统Couping 耦合Covalent 共阶的Crossover 跨交Critical 临界的Crossunder 穿交Crucible坩埚Crystal defect/face/orientation/lattice 晶体缺陷/晶面/晶向/晶格Current density 电流密度Curvature 曲率Cut off 截止Current drift/dirve/sharing 电流漂移/驱动/共享Current Sense 电流取样Curvature 弯曲Custom integrated circuit 定制集成电路Cylindrical 柱面的Czochralshicrystal 直立单晶Czochralski technique 切克劳斯基技术(Cz法直拉晶体J)DDangling bonds 悬挂键Dark current 暗电流Dead time 空载时间Debye length 德拜长度De.broglie 德布洛意Decderate 减速Decibel (dB)分贝Decode 译码Deep acceptor level 深受主能级Deep donor level 深施主能级Deep impurity level 深度杂质能级Deep trap 深陷阱Defeat 缺陷Degenerate semiconductor 简并半导体Degeneracy 简并度Degradation 退化Degree Celsius(centigrade)/Kelvin 摄氏/开氏温度Delay 延迟Density 密度Density of states 态密度Depletion 耗尽Depletion approximation 耗尽近似Depletion contact 耗尽接触Depletion depth 耗尽深度Depletion effect 耗尽效应Depletion layer 耗尽层Depletion MOS 耗尽MOSDepletion region 耗尽区Deposited film 淀积薄膜Deposition process 淀积工艺Design rules 设计规则Die 芯片(复数dice)Diode 二极管Dielectric 介电的Dielectric isolation 介质隔离Difference-mode input 差模输入Differential amplifier 差分放大器Differential capacitance 微分电容Diffused junction 扩散结Diffusion 扩散Diffusion coefficient 扩散系数Diffusion constant 扩散常数Diffusivity 扩散率Diffusion capacitance/barrier/current/furnace 扩散电容/势垒/电流/炉Digital circuit 数字电路Dipole domain 偶极畴Dipole layer 偶极层Direct-coupling 直接耦合Direct-gap semiconductor 直接带隙半导体Direct transition 直接跃迁Discharge 放电Discrete component 分立元件Dissipation 耗散Distribution 分布Distributed capacitance 分布电容Distributed model 分布模型Displacement 位移Dislocation 位错Domain 畴Donor 施主Donor exhaustion 施主耗尽Dopant 掺杂剂Doped semiconductor 掺杂半导体Doping concentration 掺杂浓度Double-diffusive MOS(DMOS)双扩散MOS.Drift 漂移Drift field 漂移电场Drift mobility 迁移率Dry etching 干法腐蚀Dry/wet oxidation 干/湿法氧化Dose 剂量Duty cycle 工作周期Dual-in-line package (DIP)双列直插式封装Dynamics 动态Dynamic characteristics 动态属性Dynamic impedance 动态阻抗EEarly effect 厄利效应Early failure 早期失效Effective mass 有效质量Einstein relation(ship)爱因斯坦关系Electric Erase Programmable Read Only Memory(E2PROM)一次性电可擦除只读存储器Electrode 电极Electrominggratim 电迁移Electron affinity 电子亲和势Electronic -grade 电子能Electron-beam photo-resist exposure 光致抗蚀剂的电子束曝光Electron gas 电子气Electron-grade water 电子级纯水Electron trapping center 电子俘获中心Electron Volt (eV)电子伏Electrostatic 静电的Element 元素/元件/配件Elemental semiconductor 元素半导体Ellipse 椭圆Ellipsoid 椭球Emitter 发射极Emitter-coupled logic 发射极耦合逻辑Emitter-coupled pair 发射极耦合对Emitter follower 射随器Empty band 空带Emitter crowding effect 发射极集边(拥挤)效应Endurance test =life test 寿命测试Energy state 能态Energy momentum diagram 能量-动量(E-K)图Enhancement mode 增强型模式Enhancement MOS 增强性MOS Entefic (低)共溶的Environmental test 环境测试Epitaxial 外延的Epitaxial layer 外延层Epitaxial slice 外延片Expitaxy 外延Equivalent curcuit 等效电路Equilibrium majority /minority carriers 平衡多数/少数载流子Erasable Programmable ROM (EPROM)可搽取(编程)存储器Error function complement (erfc)余误差函数Etch 刻蚀Etchant 刻蚀剂Etching mask 抗蚀剂掩模Excess carrier 过剩载流子Excitation energy 激发能Excited state 激发态Exciton 激子Extrapolation 外推法Extrinsic 非本征的Extrinsic semiconductor 杂质半导体FFace - centered 面心立方Fall time 下降时间Fan-in 扇入Fan-out 扇出Fast recovery 快恢复Fast surface states 快界面态Feedback 反馈Fermi level 费米能级Fermi-Dirac Distribution 费米-狄拉克分布Femi potential 费米势Fick equation 菲克方程(扩散)Field effect transistor 场效应晶体管Field oxide 场氧化层Filled band 满带Film 薄膜Flash memory 闪烁存储器Flat band 平带Flat pack 扁平封装Flicker noise 闪烁(变)噪声Flip-flop toggle 触发器翻转Floating gate 浮栅Fluoride etch 氟化氢刻蚀Forbidden band 禁带Forward bias 正向偏置Forward blocking /conducting正向阻断/导通Frequency deviation noise频率漂移噪声Frequency response 频率响应Function 函数GGain 增益Gallium-Arsenide(GaAs)砷化钾Gamy ray r 射线Gate 门、栅、控制极Gate oxide 栅氧化层Gauss(ian)高斯Gaussian distribution profile 高斯掺杂分布Generation-recombination 产生-复合Geometries 几何尺寸Germanium(Ge)锗Graded 缓变的Graded (gradual)channel 缓变沟道Graded junction 缓变结Grain 晶粒Gradient 梯度Grown junction 生长结Guard ring 保护环Gummel-Poom model 葛谋-潘模型Gunn - effect 狄氏效应HHardened device 辐射加固器件Heat of formation 形成热Heat sink 散热器、热沉Heavy/light hole band 重/轻空穴带Heavy saturation 重掺杂Hell - effect 霍尔效应Heterojunction 异质结Heterojunction structure 异质结结构Heterojunction Bipolar Transistor(HBT)异质结双极型晶体High field property 高场特性High-performance MOS.(H-MOS)高性能MOS. Hormalized 归一化Horizontal epitaxial reactor 卧式外延反应器Hot carrior 热载流子Hybrid integration 混合集成IImage - force 镜象力Impact ionization 碰撞电离Impedance 阻抗Imperfect structure 不完整结构Implantation dose 注入剂量Implanted ion 注入离子Impurity 杂质Impurity scattering 杂质散射Incremental resistance 电阻增量(微分电阻)In-contact mask 接触式掩模Indium tin oxide (ITO)铟锡氧化物Induced channel 感应沟道Infrared 红外的Injection 注入Input offset voltage 输入失调电压Insulator 绝缘体Insulated Gate FET(IGFET)绝缘栅FET Integrated injection logic集成注入逻辑Integration 集成、积分Interconnection 互连Interconnection time delay 互连延时Interdigitated structure 交互式结构Interface 界面Interference 干涉International system of unions国际单位制Internally scattering 谷间散射Interpolation 内插法Intrinsic 本征的Intrinsic semiconductor 本征半导体Inverse operation 反向工作Inversion 反型Inverter 倒相器Ion 离子Ion beam 离子束Ion etching 离子刻蚀Ion implantation 离子注入Ionization 电离Ionization energy 电离能Irradiation 辐照Isolation land 隔离岛Isotropic 各向同性JJunction FET(JFET)结型场效应管Junction isolation 结隔离Junction spacing 结间距Junction side-wall 结侧壁LLatch up 闭锁Lateral 横向的Lattice 晶格Layout 版图Lattice binding/cell/constant/defect/distortion 晶格结合力/晶胞/晶格/晶格常熟/晶格缺陷/晶格畸变Leakage current (泄)漏电流Level shifting 电平移动Life time 寿命linearity 线性度Linked bond 共价键Liquid Nitrogen 液氮Liquid-phase epitaxial growth technique 液相外延生长技术Lithography 光刻Light Emitting Diode(LED)发光二极管Load line or Variable 负载线Locating and Wiring 布局布线Longitudinal 纵向的Logic swing 逻辑摆幅Lorentz 洛沦兹Lumped model 集总模型MMajority carrier 多数载流子Mask 掩膜板,光刻板Mask level 掩模序号Mask set 掩模组Mass - action law质量守恒定律Master-slave D flip-flop主从D触发器Matching 匹配Maxwell 麦克斯韦Mean free path 平均自由程Meandered emitter junction梳状发射极结Mean time before failure (MTBF)平均工作时间Megeto - resistance 磁阻Mesa 台面MESFET-Metal Semiconductor金属半导体FETMetallization 金属化Microelectronic technique 微电子技术Microelectronics 微电子学Millen indices 密勒指数Minority carrier 少数载流子Misfit 失配Mismatching 失配Mobile ions 可动离子Mobility 迁移率Module 模块Modulate 调制Molecular crystal分子晶体Monolithic IC 单片IC MOSFET金属氧化物半导体场效应晶体管Mos. Transistor(MOST )MOS. 晶体管Multiplication 倍增Modulator 调制Multi-chip IC 多芯片ICMulti-chip module(MCM)多芯片模块Multiplication coefficient倍增因子NNaked chip 未封装的芯片(裸片)Negative feedback 负反馈Negative resistance 负阻Nesting 套刻Negative-temperature-coefficient 负温度系数Noise margin 噪声容限Nonequilibrium 非平衡Nonrolatile 非挥发(易失)性Normally off/on 常闭/开Numerical analysis 数值分析OOccupied band 满带Officienay 功率Offset 偏移、失调On standby 待命状态Ohmic contact 欧姆接触Open circuit 开路Operating point 工作点Operating bias 工作偏置Operational amplifier (OPAMP)运算放大器Optical photon =photon 光子Optical quenching光猝灭Optical transition 光跃迁Optical-coupled isolator光耦合隔离器Organic semiconductor有机半导体Orientation 晶向、定向Outline 外形Out-of-contact mask非接触式掩模Output characteristic 输出特性Output voltage swing 输出电压摆幅Overcompensation 过补偿Over-current protection 过流保护Over shoot 过冲Over-voltage protection 过压保护Overlap 交迭Overload 过载Oscillator 振荡器Oxide 氧化物Oxidation 氧化Oxide passivation 氧化层钝化PPackage 封装Pad 压焊点Parameter 参数Parasitic effect 寄生效应Parasitic oscillation 寄生振荡Passination 钝化Passive component 无源元件Passive device 无源器件Passive surface 钝化界面Parasitic transistor 寄生晶体管Peak-point voltage 峰点电压Peak voltage 峰值电压Permanent-storage circuit 永久存储电路Period 周期Periodic table 周期表Permeable - base 可渗透基区Phase-lock loop 锁相环Phase drift 相移Phonon spectra 声子谱Photo conduction 光电导Photo diode 光电二极管Photoelectric cell 光电池Photoelectric effect 光电效应Photoenic devices 光子器件Photolithographic process 光刻工艺(photo)resist (光敏)抗腐蚀剂Pin 管脚Pinch off 夹断Pinning of Fermi level 费米能级的钉扎(效应)Planar process 平面工艺Planar transistor 平面晶体管Plasma 等离子体Plezoelectric effect 压电效应Poisson equation 泊松方程Point contact 点接触Polarity 极性Polycrystal 多晶Polymer semiconductor聚合物半导体Poly-silicon 多晶硅Potential (电)势Potential barrier 势垒Potential well 势阱Power dissipation 功耗Power transistor 功率晶体管Preamplifier 前置放大器Primary flat 主平面Principal axes 主轴Print-circuit board(PCB)印制电路板Probability 几率Probe 探针Process 工艺Propagation delay 传输延时Pseudopotential method 膺势发Punch through 穿通Pulse triggering/modulating 脉冲触发/调制Pulse Widen Modulator(PWM)脉冲宽度调制punchthrough 穿通Push-pull stage 推挽级QQuality factor 品质因子Quantization 量子化Quantum 量子Quantum efficiency量子效应Quantum mechanics 量子力学Quasi - Fermi-level准费米能级Quartz 石英RRadiation conductivity 辐射电导率Radiation damage 辐射损伤Radiation flux density 辐射通量密度Radiation hardening 辐射加固Radiation protection 辐射保护Radiative - recombination辐照复合Radioactive 放射性Reach through 穿通Reactive sputtering source 反应溅射源Read diode 里德二极管Recombination 复合Recovery diode 恢复二极管Reciprocal lattice 倒核子Recovery time 恢复时间Rectifier 整流器(管)Rectifying contact 整流接触Reference 基准点基准参考点Refractive index 折射率Register 寄存器Registration 对准Regulate 控制调整Relaxation lifetime 驰豫时间Reliability 可*性Resonance 谐振Resistance 电阻Resistor 电阻器Resistivity 电阻率Regulator 稳压管(器)Relaxation 驰豫Resonant frequency共射频率Response time 响应时间Reverse 反向的Reverse bias 反向偏置SSampling circuit 取样电路Sapphire 蓝宝石(Al2O3)Satellite valley 卫星谷Saturated current range电流饱和区Saturation region 饱和区Saturation 饱和的Scaled down 按比例缩小Scattering 散射Schockley diode 肖克莱二极管Schottky 肖特基Schottky barrier 肖特基势垒Schottky contact 肖特基接触Schrodingen 薛定厄Scribing grid 划片格Secondary flat 次平面Seed crystal 籽晶Segregation 分凝Selectivity 选择性Self aligned 自对准的Self diffusion 自扩散Semiconductor 半导体Semiconductor-controlled rectifier 可控硅Sendsitivity 灵敏度Serial 串行/串联Series inductance 串联电感Settle time 建立时间Sheet resistance 薄层电阻Shield 屏蔽Short circuit 短路Shot noise 散粒噪声Shunt 分流Sidewall capacitance 边墙电容Signal 信号Silica glass 石英玻璃Silicon 硅Silicon carbide 碳化硅Silicon dioxide (SiO2)二氧化硅Silicon Nitride(Si3N4)氮化硅Silicon On Insulator 绝缘硅Siliver whiskers 银须Simple cubic 简立方Single crystal 单晶Sink 沉Skin effect 趋肤效应Snap time 急变时间Sneak path 潜行通路Sulethreshold 亚阈的Solar battery/cell 太阳能电池Solid circuit 固体电路Solid Solubility 固溶度Sonband 子带Source 源极Source follower 源随器Space charge 空间电荷Specific heat(PT)热Speed-power product 速度功耗乘积Spherical 球面的Spin 自旋Split 分裂Spontaneous emission 自发发射Spreading resistance扩展电阻Sputter 溅射Stacking fault 层错Static characteristic 静态特性Stimulated emission 受激发射Stimulated recombination 受激复合Storage time 存储时间Stress 应力Straggle 偏差Sublimation 升华Substrate 衬底Substitutional 替位式的Superlattice 超晶格Supply 电源Surface 表面Surge capacity 浪涌能力Subscript 下标Switching time 开关时间Switch 开关TTailing 扩展Terminal 终端Tensor 张量Tensorial 张量的Thermal activation 热激发Thermal conductivity 热导率Thermal equilibrium 热平衡Thermal Oxidation 热氧化Thermal resistance 热阻Thermal sink 热沉Thermal velocity 热运动Thermoelectricpovoer 温差电动势率Thick-film technique 厚膜技术Thin-film hybrid IC薄膜混合集成电路Thin-Film Transistor(TFT)薄膜晶体Threshlod 阈值Thyistor 晶闸管Transconductance 跨导Transfer characteristic 转移特性Transfer electron 转移电子Transfer function 传输函数Transient 瞬态的Transistor aging(stress)晶体管老化Transit time 渡越时间Transition 跃迁Transition-metal silica 过度金属硅化物Transition probability 跃迁几率Transition region 过渡区Transport 输运Transverse 横向的Trap 陷阱Trapping 俘获Trapped charge 陷阱电荷Triangle generator 三角波发生器Triboelectricity 摩擦电Trigger 触发Trim 调配调整Triple diffusion 三重扩散Truth table 真值表Tolerahce 容差Tunnel(ing)隧道(穿)Tunnel current 隧道电流Turn over 转折Turn - off time 关断时间UUltraviolet 紫外的Unijunction 单结的Unipolar 单极的Unit cell 原(元)胞Unity-gain frequency 单位增益频率Unilateral-switch单向开关VVacancy 空位Vacuum 真空Valence(value)band 价带Value band edge 价带顶Valence bond 价键Vapour phase 汽相Varactor 变容管Varistor 变阻器Vibration 振动Voltage 电压WWafer 晶片Wave equation 波动方程Wave guide 波导Wave number 波数Wave-particle duality 波粒二相性Wear-out 烧毁Wire routing 布线Work function 功函数Worst-case device 最坏情况器件Yield 成品率Zener breakdown 齐纳击穿。
太阳能电池概念及术语
太阳能电池详细总论1)太阳能电池分类1)硅(单晶硅,多晶硅,非晶硅)太阳电池2)薄膜太阳电池3)化合物太阳电池4)有机半导体太阳电池太阳能电池发展趋势为单晶硅、多晶硅、带状硅、薄膜材料(包括微晶硅基薄膜、化合物基薄膜及染料薄膜)。
从工业化发展来看,重心已由单晶向多晶方向发展,主要原因为;[1]可供应太阳电池的头尾料愈来愈少;[2]对太阳电池来讲,方形基片更合算,通过浇铸法和直接凝固法所获得的多晶硅可直接获得方形材料;[3]多晶硅的生产工艺不断取得进展,全自动浇铸(cast)炉每生产周期(50小时)可生产200公斤以上的硅锭,晶粒的尺寸达到厘米级;[4]由于近十年单晶硅工艺的研究与发展很快,其中工艺也被应用于多晶硅电池的生产。
2)硅太阳电池片构造3)硅太阳电池片工艺1)硅片清洗制绒(texturing-织纹状态)2 )扩散制PN结(diffusion)3) 蚀刻(plasma etching)4) 除去磷硅玻璃(PSG-phosphor silicate glass- remove)5) 减反射膜SiN沉积(PECVD)6) Screen print(形成金属接触)7) 烧结(dryer/sintering)8) 检测分类(testing/sorting)太阳电池术语1)太阳电池行业术语2)薄膜电池材料术语3)常用符号4)太阳能电池组件术语5)光伏发电术语太阳电池行业英语术语AA, Ampere的缩写, 安培a-Si: H, amorphous silicon的缩写, 含氢的, 非结晶性硅.Absorption, 吸收.Absorption of the photons:光吸收;当能量大于禁带宽度的光子入射时,太阳电池内的电子能量从价带迁到导带,产生电子——空穴对的作用,称为光吸收。
Absorptions coefficient, 吸收系数, 吸收强度.AC, 交流电.Ah, 安培小时.Acceptor, 接收者, 在半导体中可以接收一个电子.Alternating current, 交流电,简称“交流. 一般指大小和方向随时间作周期性变化的电压或电流. 它的最基本的形式是正弦电流. 我国交流电供电的标准频率规定为50赫兹。
半导体一些术语的中英文对照
半导体一些术语的中英文对照离子注入机ionimplanterLSS理论LindhandScharffandSchiotttheory 又称“林汉德-斯卡夫-斯高特理论”。
沟道效应channelingeffect射程分布rangedistribution深度分布depthdistribution投影射程projectedrange负性光刻胶negativephotoresist正性光刻胶positivephotoresist无机光刻胶inorganicresist多层光刻胶multilevelresist电子束光刻胶electronbeamresistX射线光刻胶X-rayresist刷洗scrubbing甩胶spinning涂胶photoresistcoating后烘postbaking光刻photolithographyX射线光刻X-raylithography电子束光刻electronbeamlithography离子束光刻ionbeamlithography深紫外光刻deep-UVlithography光刻机maskaligner投影光刻机projectionmaskaligner曝光exposure接触式曝光法contactexposuremethod接近式曝光法proximityexposuremethod光学投影曝光法opticalprojectionexposuremethod磷硅玻璃phosphorosilicateglass硼磷硅玻璃boron-phosphorosilicateglass钝化工艺passivationtechnology 多层介质钝化multilayerdielectricpassivation划片scribing电子束切片electronbeamslicing烧结sintering印压indentation热压焊thermocompressionbonding热超声焊thermosonicbonding冷焊coldwelding点焊spotwelding球焊ballbonding楔焊wedgebonding内引线焊接innerleadbonding外引线焊接outerleadbonding梁式引线beamlead装架工艺mountingtechnology附着adhesion封装packaging金属封装metallicpackagingAmbipolar双极的Ambienttemperature环境温度Amorphous无定形的,非晶体的Amplifier功放扩音器放大器Analogue(Analog)comparator模拟比较器Angstrom埃Anneal退火Anisotropic各向异性的Anode阳极Arsenic(AS)砷Auger俄歇Augerprocess俄歇过程Avalanche雪崩Avalanchebreakdown雪崩击穿Avalancheexcitation雪崩激发Backgroundcarrier本底载流子Backgrounddoping本底掺杂Backward反向Backwardbias反向偏置Ballastingresistor整流电阻Ballbond球形键合Band能带Bandgap能带间隙Barrier势垒Barrierlayer势垒层Barrierwidth势垒宽度Base基极Basecontact基区接触Basestretching基区扩展效应Basetransittime基区渡越时间Basetransportefficiency基区输运系数Base-widthmodulation基区宽度调制Basisvector基矢Bias偏置Bilateralswitch双向开关Binarycode二进制代码Binarycompoundsemiconductor二元化合物半导体Bipolar双极性的BipolarJunctionTransistor(BJT)双极晶体管Bloch布洛赫Blockingband阻挡能带Chargeconservation电荷守恒Chargeneutralitycondition电中性条件Chargedrive/exchange/sharing/transfer/storage电荷驱动/交换/共享/转移/存储Chemmicaletching化学腐蚀法Chemically-Polish化学抛光Chemmically-MechanicallyPolish(CMP)化学机械抛光Chip芯片Chipyield芯片成品率Clamped箝位Clampingdiode箝位二极管Cleavageplane解理面Clockrate时钟频率Clockgenerator时钟发生器Clockflip-flop时钟触发器Close-packedstructure密堆积结构Close-loopgain闭环增益Collector集电极Collision碰撞CompensatedOP-AMP补偿运放Common-base/collector/emitterconnection共基极/集电极/发射极连接Common-gate/drain/sourceconnection共栅/漏/源连接Common-modegain共模增益Common-modeinput共模输入Common-moderejectionratio(CMRR)共模抑制比Compatibility兼容性Compensation补偿Compensatedimpurities补偿杂质Compensatedsemiconductor补偿半导体ComplementaryDarlingtoncircuit互补达林顿电路ComplementaryMetal-Oxide-SemiconductorField-Effect-Transistor(CMOS)互补金属氧化物半导体场效应晶体管Complementaryerrorfunction余误差函数Computer-aideddesign(CAD)/test(CAT)/manufacture(CAM)计算机辅助设计/测试/制De.broglie德布洛意Decderate减速Decibel(dB)分贝Decode译码Deepacceptorlevel深受主能级Deepdonorlevel深施主能级Deepimpuritylevel深度杂质能级Deeptrap深陷阱Defeat缺陷Degeneratesemiconductor简并半导体Degeneracy简并度Degradation退化DegreeCelsius(centigrade)/Kelvin摄氏/开氏温度Delay延迟Density密度Densityofstates态密度Depletion耗尽Depletionapproximation耗尽近似Depletioncontact耗尽接触Depletiondepth耗尽深度Depletioneffect耗尽效应Depletionlayer耗尽层DepletionMOS耗尽MOSDepletionregion耗尽区Depositedfilm淀积薄膜Depositionprocess淀积工艺Designrules设计规则Die芯片(复数dice)Diode二极管Dielectric介电的Dielectricisolation介质隔离Difference-modeinput差模输入Differentialamplifier差分放大器Differentialcapacitance微分电容Diffusedjunction扩散结Diffusion扩散Diffusioncoefficient扩散系数Diffusionconstant扩散常数Diffusivity扩散率Diffusioncapacitance/barrier/current/furnace扩散电容/势垒/电流/炉Electrostatic静电的Element元素/元件/配件Elementalsemiconductor元素半导体Ellipse椭圆Ellipsoid椭球Emitter发射极Emitter-coupledlogic发射极耦合逻辑Emitter-coupledpair发射极耦合对Emitterfollower射随器Emptyband空带Emittercrowdingeffect发射极集边(拥挤)效应Endurancetest=lifetest寿命测试Energystate能态Energymomentumdiagram能量-动量(E-K)图Enhancementmode增强型模式EnhancementMOS增强性MOSEntefic(低)共溶的Environmentaltest环境测试Epitaxial外延的Epitaxiallayer外延层Epitaxialslice外延片Expitaxy外延Equivalentcurcuit等效电路Equilibriummajority/minoritycarriers平衡多数/少数载流子ErasableProgrammableROM(EPROM)可搽取(编程)存储器Errorfunctioncomplement余误差函数Etch刻蚀Etchant刻蚀剂Etchingmask抗蚀剂掩模Excesscarrier过剩载流子Excitationenergy激发能Excitedstate激发态Exciton激子Extrapolation外推法Extrinsic非本征的Extrinsicsemiconductor杂质半导体Face-centered面心立方Falltime下降时间Heatsink散热器、热沉Heavy/lightholeband重/轻空穴带Heavysaturation重掺杂Hell-effect霍尔效应Heterojunction异质结Heterojunctionstructure异质结结构HeterojunctionBipolarTransistor(HBT)异质结双极型晶体Highfieldproperty高场特性High-performanceMOS.(H-MOS)高性能MOS.Hormalized归一化Horizontalepitaxialreactor卧式外延反应器Hotcarrior热载流子Hybridintegration混合集成Image-force镜象力Impactionization碰撞电离Impedance阻抗Imperfectstructure不完整结构Implantationdose注入剂量Implantedion注入离子Impurity杂质Impurityscattering杂志散射Incrementalresistance电阻增量(微分电阻)In-contactmask接触式掩模Indiumtinoxide(ITO)铟锡氧化物Inducedchannel感应沟道Infrared红外的Injection注入Inputoffsetvoltage输入失调电压Insulator绝缘体InsulatedGateFET(IGFET)绝缘栅FETIntegratedinjectionlogic集成注入逻辑Integration集成、积分Interconnection互连Interconnectiontimedelay互连延时Interdigitatedstructure交互式结构Interface界面Interference干涉Internationalsystemofunions国际单位制Internallyscattering谷间散射Matching匹配Maxwell麦克斯韦Meanfreepath平均自由程Meanderedemitterjunction梳状发射极结Meantimebeforefailure(MTBF)平均工作时间Megeto-resistance磁阻Mesa台面MESFET-MetalSemiconductor金属半导体FETMetallization金属化Microelectronictechnique微电子技术Microelectronics微电子学Millenindices密勒指数Minoritycarrier少数载流子Misfit失配Mismatching失配Mobileions可动离子Mobility迁移率Module模块Modulate调制Molecularcrystal分子晶体MonolithicIC单片ICMOSFET金属氧化物半导体场效应晶体管Mos.Transistor(MOST)MOS.晶体管Multiplication倍增Modulator调制Multi-chipIC多芯片ICMulti-chipmodule(MCM)多芯片模块Multiplicationcoefficient倍增因子Nakedchip未封装的芯片(裸片)Negativefeedback负反馈Negativeresistance负阻Nesting套刻Negative-temperature-coefficient负温度系数Noisemargin噪声容限Nonequilibrium非平衡Nonrolatile非挥发(易失)性Normallyoff/on常闭/开Numericalanalysis数值分析Occupiedband满带Officienay功率Photoelectriccell光电池Photoelectriceffect光电效应Photoenicdevices光子器件Photolithographicprocess光刻工艺(photo)resist(光敏)抗腐蚀剂Pin管脚Pinchoff夹断PinningofFermilevel费米能级的钉扎(效应)Planarprocess平面工艺Planartransistor平面晶体管Plasma等离子体Plezoelectriceffect压电效应Poissonequation泊松方程Pointcontact点接触Polarity极性Polycrystal多晶Polymersemiconductor聚合物半导体Poly-silicon多晶硅Potential(电)势Potentialbarrier势垒Potentialwell势阱Powerdissipation功耗Powertransistor功率晶体管Preamplifier前置放大器Primaryflat主平面Principalaxes主轴Print-circuitboard(PCB)印制电路板Probability几率Probe探针Process工艺Propagationdelay传输延时Pseudopotentialmethod膺势发Punchthrough穿通Pulsetriggering/modulating脉冲触发/调制Pulse WidenModulator(PWM)脉冲宽度调制Punchthrough穿通Push-pullstage推挽级Qualityfactor品质因子Quantization量子化Schottkybarrier肖特基势垒Schottkycontact肖特基接触Schrodingen薛定厄Scribinggrid划片格Secondaryflat次平面Seedcrystal籽晶Segregation分凝Selectivity选择性Selfaligned自对准的Selfdiffusion自扩散Semiconductor半导体Semiconductor-controlledrectifier可控硅Sendsitivity灵敏度Serial串行/串联Seriesinductance串联电感Settletime建立时间Sheetresistance薄层电阻Shield屏蔽Shortcircuit短路Shotnoise散粒噪声Shunt分流Sidewallcapacitance边墙电容Signal信号Silicaglass石英玻璃Silicon硅Siliconcarbide碳化硅Silicondioxide(SiO2)二氧化硅SiliconNitride(Si3N4)氮化硅SiliconOnInsulator绝缘硅Siliverwhiskers银须Simplecubic简立方Singlecrystal单晶Sink沉Skineffect趋肤效应Snaptime急变时间Sneakpath潜行通路Sulethreshold亚阈的Solarbattery/cell太阳能电池Solidcircuit固体电路SolidSolubility固溶度Sonband子带Transistoraging(stress)晶体管老化Transittime渡越时间Transition跃迁Transition-metalsilica过度金属硅化物Transitionprobability跃迁几率Transitionregion过渡区Transport输运Transverse横向的Trap陷阱Trapping俘获Trappedcharge陷阱电荷Trianglegenerator三角波发生器Triboelectricity摩擦电Trigger触发Trim调配调整Triplediffusion三重扩散Truthtable真值表Tolerahce容差Tunnel(ing)隧道(穿)Tunnelcurrent隧道电流Turnover转折Turn-offtime关断时间Ultraviolet紫外的Unijunction单结的Unipolar单极的Unitcell原(元)胞Unity-gainfrequency单位增益频率Unilateral-switch单向开关Vacancy空位Vacuum真空Valence(value)band价带Valuebandedge价带顶Valencebond价键Vapourphase汽相Varactor变容管Varistor变阻器Vibration振动Voltage电压Wafer晶片Waveequation波动方程Waveguide波导Wavenumber波数CT:ContaminationThreshold??污染阀值Ctrl:Control控制;管理;抑制D:Die芯片DAC igitalAnalogConverter??数字转换器DSP igitalSignalProcessing数字信号处理EFO:ElevtronicFlame-Off电子打火系统FA:FaceAngle顶锥角(面锥角)FAB:FreeAirBall空气球FD:FloppyDisk软盘,软式磁碟片Frd:Forward??前进GEM:GenericHi:HightMagnification高倍率Hybd:Hybrid混合动力/混合式Impd:Impedence阻抗Ins:Inspection检查,检验L/F eadFrame框架Lo:LowMagnification低倍率PM reventiveMaintenance??PR atternRecognitionT/P:TopPlate??顶板UPH:UnitPerHour??每小时产量UTI:UltrasonicTransducerInterface超声波传感受器接口VLL:VisualLeadLocator导脚定位W/C:WireClamp??线夹W/H:WorkHolder??轨道W/S:WireSpool??线轴ESD:ElectroStaticDischarge静电释放EPa:ESDProtectedarea??静电防护区ESDS??????????????????????静电敏感设备BM:BreakdownMaintenance事后维修CM:CorrectiveMaintenance改良保养PVM:PreventiveMaintenance预防保养MP:MaintencePreventive保养预防PM:ProductionMaintenance生产保养BG:backgrinding??背部研磨DS:diesaw????将wafer切die DA:dieattach??=DB:diebond??装片WB:wirebond焊线????。
半导体器件中英名词解释
built-in electric field: An electric field due to the separation of positive and negative space charge densities in the depletion region.
increase, showing breakdown, called tunneling breakdown, also known as Zener breakdown.
隧道击穿/齐纳击穿: 对重掺杂pn结, 随着反偏电压增大, 可能使p区价带顶高于n区导带底, p区价带的电子可以通过隧道效应直接穿过禁带到达n区导带, 成为导带载流子。 当结上反偏 电压增大到一定程度,将使隧穿电流急剧增加,呈现击穿现象,称为隧道击穿,又称为齐纳 击穿。
critical electric field: The peak electric field in the space charge region at breakdown.
临界电场:发生击穿时pn结空间电荷区的最大电场强度。
varactor diode: A diode whose reactance can be varied in a controlled manner with bias voltage.
abrupt junction approximation: The assumption that there is an abrupt discontinuity in space charge density between the space charge region and the neutral semiconductor region.
太阳能电池专业英语
A1.中文:暗饱和电流英文:Dark Saturation Current解释:没有光照的条件下,将PN结反偏达到饱和时的电流。
降低暗饱和电流利于提高电池品质在以下的理想二极管公式中,I =流过二极管的总电流; I0 = “暗饱和电流”, V = 加在二极管两端的电压B1.中文:包装密度英文:Packing density解释:组件中被太阳能电池覆盖的面积对比于整个组件的面积。
它影响了组件的输出功率及工作温度2.中文:背电场英文:Back Surface Field解释:在电池背面由于重掺杂引起的电场。
该电场会排斥少数载流子以使它们远离高复合率的背表面3.中文:背面反射/底面反射英文:Rear Surface Reflection解释:穿过电池而未被吸收的长波光会被电池背面的金属或染料反射回电池,增大吸收概率4.中文:本底掺杂英文:Background Doping解释:电池衬底的掺杂浓度5.中文:表面制绒英文:Surface Texturing解释:用物理或化学的方法将平滑的硅电池表面变得粗糙,增大光捕获,减小反射6.中文:并网系统英文:Grid-connected Systems解释:并网系统指由光伏组件供电的,接入公用电网的光伏系统。
这类系统无须蓄电池7.中文:薄膜太阳能电池英文:Thin-film Solar Cells解释:薄膜太阳能电池是通过在衬底上镀光伏材料薄层制成的,厚度从几微米到几十微米不等。
成本较低但效率普遍较低8.中文:复合英文:Recommbination解释:又称为载流子复合,是指半导体中的载流子(电子和空穴)成对消失的过程。
9.中文:表面复合速率英文:Surface Recombination Velocity解释:当少子在表面消失时,由于浓度梯度,少子会从电池体流向表面。
表面复合速度表征表面复合的强弱。
C1.中文:掺杂英文:Doping解释:在本征半导体里加入施主或受主杂质(通常是磷或硼)使半导体内自由载流子浓度变高并使其具有p型或n型半导体的性质2.中文:串联电阻英文:Series Resistance解释:由电池体、电极接触等产生的分压电阻。
半导体缺陷解析及中英文术语一览
一、半导体缺陷1.位错:位错又可称为差排(英语:dislocation),在材料科学中,指晶体材料的一种内部微观缺陷,即原子的局部不规则排列(晶体学缺陷)。
从几何角度看,位错属于一种线缺陷,可视为晶体中已滑移部分与未滑移部分的分界线,其存在对材料的物理性能,尤其是力学性能,具有极大的影响。
产生原因:晶体生长过程中,籽晶中的位错、固-液界面附近落入不溶性固态颗粒,界面附近温度梯度或温度波动以及机械振动都会在晶体中产生位错。
在晶体生长后,快速降温也容易增殖位错。
(111)呈三角形;(100)呈方形;(110)呈菱形。
2.杂质条纹:晶体纵剖面经化学腐蚀后可见明、暗相间的层状分布条纹,又称为电阻率条纹。
杂质条纹有分布规律,在垂直生长轴方向的横断面上,一般成环状分布;在平行生长轴方向的纵剖面上,呈层状分布。
反映了固-液界面结晶前沿的形状。
产生原因:晶体生长时,由于重力产生的自然对流和搅拌产生的强制对流,引起固-液界近附近的温度发生微小的周期性变化,导致晶体微观生长速率的变化,或引起杂质边界厚度起伏,一截小平面效应和热场不对称等,均使晶体结晶时杂质有效分凝系数产生波动,引起杂质中杂质浓度分布发生相应的变化,从而在晶体中形成杂质条纹。
解决方案::调整热场,使之具有良好的轴对称性,并使晶体的旋转轴尽量与热场中心轴同轴,抑制或减弱熔热对流,可以使晶体中杂质趋于均匀分布。
采用磁场拉晶工艺或无重力条件下拉晶可以消除杂质条纹。
3.凹坑:晶体经过化学腐蚀后,由于晶体的局部区域具有较快的腐蚀速度,使晶体横断面上出现的坑。
腐蚀温度越高,腐蚀时间越长,则凹坑就越深,甚至贯穿。
4.空洞:单晶切断面上无规则、大小不等的小孔。
产生原因:在气氛下拉制单晶,由于气体在熔体中溶解度大,当晶体生长时,气体溶解度则减小呈过饱和状态。
如果晶体生长过快,则气体无法及时从熔体中排出,则会在晶体中形成空洞。
5.孪晶:使晶体断面上呈现金属光泽不同的两部分,分界线通常为直线。
半导体物理学名词解释 2
半导体物理学名词解释1、直接复合:电子在导带与价带间直接跃迁而引起非平衡载流子的复合。
2、间接复合:指的是非平衡载流子通过复合中心的复合。
3、俄歇复合:载流子从高能级向低能级跃迁发生电子-空穴复合时,把多余的能量传给另一个载流子,使这个载流子被激发到能量更高的能级上去,当它重新跃迁回到低能级时,多余的能量常以声子的形式放出,这种复合称为俄歇复合,显然这是一种非辐射复合。
4、施主杂质:V族杂质在硅、锗中电离时,能够施放电子而产生导电电子并形成正电中心,称它们为施主杂质或n型杂质。
5、受主杂质:Ⅲ族杂质在硅、锗中能够接受电子而产生导电空穴,并形成负点中心,所以称它们为受主杂质或p型杂质。
6、多数载流子:半导体材料中有电子和空穴两种载流子。
在N 型半导体中,电子是多数载流子, 空穴是少数载流子。
在P型半导体中,空穴是多数载流子,电子是少数载流子。
7、能谷间散射:8、本征半导体:本征半导体就是没有杂质和缺陷的半导体。
9、准费米能级:半导体中的非平衡载流子,可以认为它们都处于准平衡状态(即导带所有的电子和价带所有的空穴分别处于准平衡状态)。
对于处于准平衡状态的非平衡载流子,可以近似地引入与Fermi能级相类似的物理量——准Fermi能级来分析其统计分布;当然,采用准Fermi能级这个概念,是一种近似,但确是一种较好的近似。
基于这种近似,对于导带中的非平衡电子,即可引入电子的准Fermi能级;对于价带中的非平衡空穴,即可引入空穴的准Fermi能级。
10、禁带:能带结构中能态密度为零的能量区间。
11、价带:半导体或绝缘体中,在绝对零度下能被电子沾满的最高能带。
12、导带:导带是自由电子形成的能量空间,即固体结构内自由运动的电子所具有的能量范围。
13、束缚激子:等电子陷阱俘获载流子后成为带电中心,这一中心由于库仑作用又能俘获另一种带电符号相反的载流子从而成为定域激子,称为束缚激子。
14、浅能级杂质:在半导体中、其价电子受到束缚较弱的那些杂质原子,往往就是能够提供载流子(电子或空穴)的施主、受主杂质,它们在半导体中形成的能级都比较靠近价带顶或导带底,因此称其为浅能级杂质。
半导体微电子专业词汇中英文对照
半导体微电子专业词汇中英文对照————————————————————————————————作者:————————————————————————————————日期:半导体微电子专业词汇中英文对照Accelerated testing 加速实验Acceptor 受主Acceptor atom 受主原子Accumulation 积累、堆积Accumulating contact 积累接触Accumulation region 积累区Accumulation layer 积累层Acoustic Surface Wave 声表面波Active region 有源区Active component 有源元Active device 有源器件Activation 激活Activation energy 激活能Active region 有源(放大)区A/D conversion 模拟-数字转换Adhesives 粘接剂Admittance 导纳Aging 老化Airborne 空载Allowed band 允带allowance 容限,公差Alloy-junction device合金结器件Aluminum(Aluminum) 铝Aluminum – oxide 铝氧化物Aluminum Nitride 氮化铝Aluminum passivation 铝钝化Ambipolar 双极的Ambient temperature 环境温度A M light 振幅调制光,调幅光amplitude limiter 限幅器Amorphous 无定形的,非晶体的Amplifier 功放放大器Analogue(Analog) comparator 模拟比较器Angstrom 埃Anneal 退火Anisotropic 各向异性的Anode 阳极Antenna 天线Aperture 孔径Arsenide (As) 砷Array 阵列Atomic 原子的Atom Clock 原子钟Attenuation 衰减Audio 声频Auger 俄歇Automatic 自动的Automotive 汽车的Availability 实用性Avalanche 雪崩Avalanche breakdown 雪崩击穿Avalanche excitation雪崩激发Background carrier 本底载流子Background doping 本底掺杂Backward 反向Backward bias 反向偏置Ball bond 球形键合Band 能带Band gap 能带间隙Bandwidth 带宽Bar 巴条发光条Barrier 势垒Barrier layer 势垒层Barrier width 势垒宽度Base 基极Base contact 基区接触Base stretching 基区扩展效应Base transit time 基区渡越时间Base transport efficiency基区输运系数Base-width modulation基区宽度调制Batch 批次Battery 电池Beam 束光束电子束Bench 工作台Bias 偏置Bilateral switch 双向开关Binary code 二进制代码Binary compound semiconductor 二元化合物半导体Bipolar 双极性的Bipolar Junction Transistor (BJT)双极晶体管Bit 位比特Blocking band 阻带Body - centered 体心立方Body-centred cubic structure 体立心结构Boltzmann 波尔兹曼Bond 键、键合Bonding electron 价电子Bonding pad 键合点Boron 硼Borosilicate glass 硼硅玻璃Bottom-up 由下而上的Boundary condition 边界条件Bound electron 束缚电子Bragg effect 布拉格效应Breadboard 模拟板、实验板Break down 击穿Break over 转折Brillouin 布里渊FBrillouin zone 布里渊区Buffer 缓冲器Built-in 内建的Build-in electric field 内建电场Bulk 体/体内Bulk absorption 体吸收Bulk generation 体产生Bulk recombination 体复合Burn-in 老化Burn out 烧毁Buried channel 埋沟Buried diffusion region 隐埋扩散区Bus 总线Calibration 校准,检定,定标、刻度,分度Capacitance 电容Capture cross section 俘获截面Capture carrier 俘获载流子Carbon dioxide (CO2) 二氧化碳Carrier 载流子、载波Carry bit 进位位Cascade 级联Case 管壳Cathode 阴极Cavity 腔体Center 中心Ceramic 陶瓷(的)Channel 沟道Channel breakdown 沟道击穿Channel current 沟道电流Channel doping 沟道掺杂Channel shortening 沟道缩短Channel width 沟道宽度Characteristic impedance 特征阻抗Charge 电荷、充电Charge-compensation effects 电荷补偿效应Charge conservation 电荷守恒Charge drive/exchange/sharing/transfer/storage 电荷驱动/交换/共享/转移/存储Chemical etching 化学腐蚀法Chemically-Polish 化学抛光Chemically-Mechanically Polish (CMP) 化学机械抛光Chemical vapor deposition (cvd)化学汽相淀积Chip 芯片Chip yield 芯片成品率Circuit 电路Clamped 箝位Clamping diode 箝位二极管Cleavage plane 解理面Clean 清洗Clock rate 时钟频率Clock generator 时钟发生器Clock flip-flop 时钟触发器Close-loop gain 闭环增益Coating 涂覆涂层Coefficient of thermal expansion 热膨胀系数Coherency 相干性Collector 集电极Collision 碰撞Compensated OP-AMP 补偿运放Common-base/collector/emitter connection 共基极/集电极/发射极连接Common-gate/drain/source connection 共栅/漏/源连接Common-mode gain 共模增益Common-mode input 共模输入Common-mode rejection ratio (CMRR) 共模抑制比Communication 通信Compact 致密的Compatibility 兼容性Compensation 补偿Compensated impurities 补偿杂质Compensated semiconductor 补偿半导体Complementary Darlington circuit 互补达林顿电路Complementary Metal-Oxide-SemiconductorField-Effect-Transistor(CMOS) 互补金属氧化物半导体场效应晶体管Computer-aided design (CAD)/test(CAT)/manufacture(CAM) 计算机辅助设计/ 测试/制造Component 元件Compound Semiconductor 化合物半导体Conductance 电导Conduction band (edge) 导带(底)Conduction level/state 导带态Conductor 导体Conductivity 电导率Configuration 结构Conlomb 库仑Constants 物理常数Constant energy surface 等能面Constant-source diffusion恒定源扩散Contact 接触Continuous wave 连续波Continuity equation 连续性方程Contact hole 接触孔Contact potential 接触电势Controlled 受控的Converter 转换器Conveyer 传输器Cooling 冷却Copper interconnection system 铜互连系统Corrosion 腐蚀Coupling 耦合Covalent 共阶的Crossover 交叉Critical 临界的Cross-section 横断面Crucible坩埚Cryogenic cooling system 冷却系统Crystal defect/face/orientation/lattice 晶体缺陷/晶面/晶向/晶格Cubic crystal system 立方晶系Current density 电流密度Curvature 曲率Current drift/drive/sharing 电流漂移/驱动/共享Current Sense 电流取样Curve 曲线Custom integrated circuit 定制集成电路Cut off 截止Cylindrical 柱面的Czochralshicrystal 直立单晶Czochralski technique 切克劳斯基技术(Cz法直拉晶体J)) Dangling bonds 悬挂键Dark current 暗电流Dead time 空载时间Decade 十进制Decibel (dB) 分贝Decode 解码Deep acceptor level 深受主能级Deep donor level 深施主能级Deep energy level 深能级Deep impurity level 深度杂质能级Deep trap 深陷阱Defeat 缺陷Degenerate semiconductor 简并半导体Degeneracy 简并度Degradation 退化Degree Celsius(centigrade) /Kelvin 摄氏/开氏温度Delay 延迟Density 密度Density of states 态密度Depletion 耗尽Depletion approximation 耗尽近似Depletion contact 耗尽接触Depletion depth 耗尽深度Depletion effect 耗尽效应Depletion layer 耗尽层Depletion MOS 耗尽MOS Depletion region 耗尽区Deposited film 淀积薄膜Deposition process 淀积工艺Design rules 设计规则Detector 探测器Developer 显影剂Diamond 金刚石Die 芯片(复数dice)Diode 二极管Dielectric Constant 介电常数Dielectric isolation 介质隔离Difference-mode input 差模输入Differential amplifier 差分放大器Differential capacitance 微分电容Diffusion 扩散Diffusion coefficient 扩散系数Diffusion constant 扩散常数Diffusivity 扩散率Diffusion capacitance/barrier/current/furnace 扩散电容/势垒/电流/炉Digital circuit 数字电路Dimension (1)尺寸(2)量钢(3)维,度Diode 二极管Dipole domain 偶极畴Dipole layer 偶极层Direct-coupling 直接耦合Direct-gap semiconductor 直接带隙半导体Direct transition 直接跃迁Directional antenna 定向天线Discharge 放电Discrete component 分立元件Disorder 无序的Display 显示器Dissipation 耗散Dissolution 溶解Distributed capacitance 分布电容Distributed model 分布模型Displacement 位移Dislocation 位错Domain 畴Donor 施主Donor exhaustion 施主耗尽Dopant 掺杂剂Doped semiconductor 掺杂半导体Doping concentration 掺杂浓度Dose 剂量Double-diffusive MOS(DMOS)双扩散MOS Drift 漂移Drift field 漂移电场Drift mobility 迁移率Dry etching 干法腐蚀Dry/wet oxidation 干/湿法氧化Dose 剂量Dual-polarization 双偏振,双极化Duty cycle 工作周期Dual-in-line package (DIP)双列直插式封装Dynamics 动态Dynamic characteristics 动态属性Dynamic impedance 动态阻抗Early effect 厄利效应Early failure 早期失效Effect 效应Effective mass 有效质量Electric Erase Programmable Read Only Memory(E2PROM) 电可擦除只读存储器Electrode 电极Electromigration 电迁移Electron affinity 电子亲和势Electron-beam 电子束Electroluminescence 电致发光Electron gas 电子气Electron trapping center 电子俘获中心Electron Volt (eV) 电子伏Electro-optical 光电的Electrostatic 静电的Element 元素/元件/配件Elemental semiconductor 元素半导体Ellipse 椭圆Emitter 发射极Emitter-coupled logic 发射极耦合逻辑Emitter-coupled pair 发射极耦合对Emitter follower 射随器Empty band 空带Emitter crowding effect 发射极集边(拥挤)效应Endurance test =life test 寿命测试Energy state 能态Energy momentum diagram 能量-动量(E-K)图Enhancement mode 增强型模式Enhancement MOS 增强性MOSEnteric (低)共溶的Environmental test 环境测试Epitaxial 外延的Epitaxial layer 外延层Epitaxial slice 外延片Epoxy 环氧的Equivalent circuit 等效电路Equilibrium majority /minority carriers 平衡多数/少数载流子Equipment 设备Erasable Programmable ROM (EPROM)可搽取(编程)存储器Erbium laser 掺铒激光器Error function complement 余误差函数Etch 刻蚀Etchant 刻蚀剂Etching mask 抗蚀剂掩模Excess carrier 过剩载流子Excitation energy 激发能Excited state 激发态Exciton 激子Exponential 指数的Extrapolation 外推法Extrinsic 非本征的Extrinsic semiconductor 杂质半导体Fabry-Perot amplifier 法布里-珀罗放大器Face - centered 面心立方Fall time 下降时间Fan-in 扇入Fan-out 扇出Fast recovery 快恢复Fast surface states 快表面态Feedback 反馈Fermi level 费米能级Femi potential 费米势Fiber optic 光纤Field effect transistor 场效应晶体管Field oxide 场氧化层Figure of merit 品质因数Filter 滤波器Filled band 满带Film 薄膜Fine pitch 细节距Flash memory 闪存存储器Flat band 平带Flat pack 扁平封装Flatness 平整度Flexible 柔性的Flicker noise 闪烁(变)噪声Flip-chip 倒装芯片Flip- flop toggle 触发器翻转Floating gate 浮栅Fluoride etch 氟化氢刻蚀Focal plane 焦平面Forbidden band 禁带Formulation 列式,表达Forward bias 正向偏置Forward blocking /conducting 正向阻断/导通Free electron 自由电子Frequency deviation noise 频率漂移噪声Frequency response 频率响应Function 函数Gain 增益Gallium-Arsenide(GaAs) 砷化镓Gallium Nitride 氮化镓Gate 门、栅、控制极Gate oxide 栅氧化层Gate width 栅宽Gauss(ian)高斯Gaussian distribution profile 高斯掺杂分布Generation-recombination 产生-复合Geometries 几何尺寸Germanium(Ge) 锗Gold 金Graded 缓变的Graded (gradual) channel 缓变沟道Graded junction 缓变结Grain 晶粒Gradient 梯度Graphene 石墨烯Grating 光栅Green laser 绿光激光器Ground 接地Grown junction 生长结Guard ring 保护环Guide wave 导波波导Gunn - effect 狄氏效应Gyroscope 陀螺仪Hardened device 辐射加固器件Harmonics 谐波Heat diffusion 热扩散Heat sink 散热器、热沉Heavy/light hole band 重/轻空穴带Hell - effect 霍尔效应Hertz 赫兹Heterojunction 异质结Heterojunction structure 异质结结构Heterojunction Bipolar Transistor(HBT)异质结双极型晶体High field property 高场特性High-performance MOS(H-MOS)高性能MOS器件High power 大功率Hole 空穴Homojunction 同质结Horizontal epitaxial reactor 卧式外延反应器Hot carrier 热载流子Hybrid integration 混合集成Illumination (1)照明(2)照明学Image - force 镜象力Impact ionization 碰撞电离Impedance 阻抗Imperfect structure 不完整结构Implantation dose 注入剂量Implanted ion 注入离子Impurity 杂质Impurity scattering 杂志散射Inch 英寸Incremental resistance 电阻增量(微分电阻)In-contact mask 接触式掩模Index of refraction 折射率Indium 铟Indium tin oxide (ITO) 铟锡氧化物Inductance 电感Induced channel 感应沟道Infrared 红外的Injection 注入Input power 输入功率Insertion loss 插入损耗Insulator 绝缘体Insulated Gate FET(IGFET) 绝缘栅FET Integrated injection logic 集成注入逻辑Integration 集成、积分Integrated Circuit 集成电路Interconnection 互连Interconnection time delay 互连延时Interdigitated structure 交互式结构Interface 界面Interference 干涉International system of unions 国际单位制Internally scattering 谷间散射Interpolation 内插法Intrinsic 本征的Intrinsic semiconductor 本征半导体Inverse operation 反向工作Inversion 反型Inverter 倒相器Ion 离子Ion beam 离子束Ion etching 离子刻蚀Ion implantation 离子注入Ionization 电离Ionization energy 电离能Irradiation 辐照Isolation land 隔离岛Isotropic 各向同性Junction FET(JFET) 结型场效应管Junction isolation 结隔离Junction spacing 结间距Junction side-wall 结侧壁Laser 激光器Laser diode 激光二极管Latch up 闭锁Lateral 横向的Lattice 晶格Layout 版图Lattice binding/cell/constant/defect/distortion 晶格结合力/晶胞/晶格/晶格常熟/晶格缺陷/晶格畸变Lead 铅Leakage current (泄)漏电流Life time 寿命linearity 线性度Linked bond 共价键Liquid Nitrogen 液氮Liquid-phase epitaxial growth technique 液相外延生长技术Lithography 光刻Light Emitting Diode(LED) 发光二极管Linearity 线性化Liquid 液体Lock in 锁定Longitudinal 纵向的Long life 长寿命Lumped model 集总模型Magnetic 磁的Majority carrier 多数载流子Mask 掩膜板,光刻板Mask level 掩模序号Mask set 掩模组Mass - action law 质量守恒定律Master-slave D flip-flop 主从D 触发器Matching 匹配Material 材料Maxwell 麦克斯韦Mean free path 平均自由程Mean time before failure (MTBF) 平均工作时间Mechanical 机械的Membrane (1)薄腊,膜片(2)隔膜Megeto - resistance 磁阻Mesa 台面MESFET-Metal Semiconductor 金属半导体FET Metalorganic Chemical Vapor Deposition MOCVD 金属氧化物化学汽相淀积Metallization 金属化Metal oxide semiconductor (MOS)金属氧化物半导体MeV 兆电子伏Microelectronic technique 微电子技术Microelectronics 微电子学Microelectromechanical System (MEMS) 微电子机械系统Microwave 微波Millimeterwave 毫米波Minority carrier 少数载流子Misfit 失配Mismatching 失配Mobility 迁移率Module 模块Modulate 调制Molecular crystal 分子晶体Monolithic IC 单片MOSFET 金属氧化物半导体场效应晶体管Mount 安装Multiplication 倍增Modulator 调制Multi-chip IC 多芯片ICMulti-chip module(MCM) 多芯片模块Multilayer 多层Multiplication coefficient 倍增因子Multiplexer 复用器Multiplier 倍增器Naked chip 未封装的芯片(裸片)Nanometer 纳米Nanotechnology 纳米技术Negative feedback 负反馈Negative resistance 负阻Negative-temperature-coefficient负温度系数Nesting 套刻Noise figure 噪声系数Nonequilibrium 非平衡Nonvolatile 非挥发(易失)性Normally off/on 常闭/开Nuclear 核Numerical analysis 数值分析Occupied band 满带Offset 偏移、失调On standby 待命状态Ohmic contact 欧姆接触Open circuit 开路Operating point 工作点Operating bias 工作偏置Operational amplifier (OPAMP)运算放大器Optical photon 光子Optical quenching 光猝灭Optical transition 光跃迁Optical-coupled isolator 光耦合隔离器Organic semiconductor 有机半导体Orientation 晶向、定向Oscillator 振荡器Outline 外形Out-of-contact mask 非接触式掩模Output characteristic 输出特性Output power 输出功率Output voltage swing 输出电压摆幅Overcompensation 过补偿Over-current protection 过流保护Over shoot 过冲Over-voltage protection 过压保护Overlap 交迭Overload 过载Oscillator 振荡器Oxide 氧化物Oxidation 氧化Oxide passivation 氧化层钝化Package 封装Pad 压焊点Parameter 参数Parasitic effect 寄生效应Parasitic oscillation 寄生振荡Pass band 通带Passivation 钝化Passive component 无源元件Passive device 无源器件Passive surface 钝化界面Parasitic transistor 寄生晶体管Pattern 图形Payload 有效载荷Peak-point voltage 峰点电压Peak voltage 峰值电压Permanent-storage circuit 永久存储电路Period 周期Permeable - base 可渗透基区Phase-lock loop 锁相环Phase drift 相移Phonon spectra 声子谱Photo conduction 光电导Photo diode 光电二极管Photoelectric cell 光电池Photoelectric effect 光电效应Photonic devices 光子器件Photolithographic process 光刻工艺Photoluminescence 光致发光Photo resist (光敏)抗腐蚀剂Photo mask 光掩模Piezoelectric effect 压电效应Pin 管脚Pinch off 夹断Pinning of Fermi level 费米能级的钉扎(效应)Planar process 平面工艺Planar transistor 平面晶体管Plasma 等离子体Plane 平面的Plasma 等离子体Plate 板电路板P-N junction pn结Poisson equation 泊松方程Point contact 点接触Polarity 极性Polycrystal 多晶Polymer semiconductor 聚合物半导体Poly-silicon 多晶硅Positive 正的Potential (电)势Potential barrier 势垒Potential well 势阱Power electronic devices电力电子器件Power dissipation 功耗Power transistor 功率晶体管Preamplifier 前置放大器Primary flat 主平面Print-circuit board(PCB) 印制电路板Probability 几率Probe 探针Procedure 工艺Process 工艺Projector 投影仪Propagation delay 传输延时Proton 质子Proximity effect 邻近效应Pseudopotential method 赝势法Pump 泵浦Punch through 穿通Pulse triggering/modulating 脉冲触发/调制Pulse Widen Modulator(PWM) 脉冲宽度调制Punchthrough 穿通Push-pull stage 推挽级Q Q值Quality factor 品质因子Quantization 量子化Quantum 量子Quantum efficiency 量子效应Quantum mechanics 量子力学Quasi – Fermi-level 准费米能级Quartz 石英Radar 雷达Radiation conductivity 辐射电导率Radiation damage 辐射损伤Radiation flux density 辐射通量密度Radiation hardening 辐射加固Radiation protection 辐射保护Radiative - recombination 辐照复合Radio 无线电射电射频Radio-frequency RF 射频Raman 拉曼Random 随机Range 测距Radio 比率系数Ray 射线Reactive sputtering source 反应溅射源Real time 实时Receiver 接收机Recombination 复合Recovery diode 恢复二极管Record 记录Recovery time 恢复时间Rectifier 整流器(管)Rectifying contact 整流接触Red light 红光Reference 基准点基准参考点Refractive index 折射率Register 寄存器Regulate 控制调整Relative 相对的Relaxation 驰豫Relaxation lifetime 驰豫时间Relay 中继Reliability 可靠性Remote 远程Repeatability 可重复性Reproduction 重复制造Residual current 剩余电流Resonance 谐振Resin 树脂Resistance 电阻Resistor 电阻器Resistivity 电阻率Regulator 稳压管(器)Resolution 分辨率Response time 响应时间Return signal 回波信号Reverse 反向的Reverse bias 反向偏置Ribbon 光纤带Ridge waveguide 脊形波导Ring laser 环形激光器Rotary wave 旋转波Run 运行Sampling circuit 取样电路Sapphire 蓝宝石(Al2O3)Satellite valley 卫星谷Saturated current range 电流饱和区Scan 扫描Scaled down 按比例缩小Scattering 散射Schematic layout 示意图,简图Schottky 肖特基Schottky barrier 肖特基势垒Schottky contact 肖特基接触Screen 筛选Scribing grid 划片格Secondary flat 次平面Seed crystal 籽晶Segregation 分凝Selectivity 选择性Self aligned 自对准的Self diffusion 自扩散Semiconductor 半导体Semiconductor laser半导体激光器Semiconductor-controlled rectifier 半导体可控硅Sensitivity 灵敏度Sensor 传感器Serial 串行/串联Series inductance 串联电感Settle time 建立时间Sheet resistance 薄层电阻Shaping 成型Shield 屏蔽Shifter 移相器Short circuit 短路Shot noise 散粒噪声Shunt 分流Sidewall capacitance 边墙电容Signal 信号Silica glass 石英玻璃Silicon 硅Silicon carbide 碳化硅Silicon dioxide (SiO2) 二氧化硅Silicon Nitride(Si3N4) 氮化硅Silicon On Insulator 绝缘体上硅Silver whiskers 银须Simple cubic 简立方Simulation 模拟Single crystal 单晶Sink 热沉Sinter 烧结Skin effect 趋肤效应Slot 槽隙Slow wave 慢波Smooth 光滑的Subthreshold 亚阈值的Solar battery/cell 太阳能电池Solid circuit 固体电路Solid Solubility 固溶度Solution 溶液Sonband 子带Source 源极Source follower 源随器Space charge 空间电荷Space Craft 宇宙飞行器Spacing 间距Specific heat(PT) 比热Spectral 光谱Spectrum 光谱(复数)Speed-power product 速度功耗乘积Spherical 球面的Spin 自旋Split 分裂Spontaneous emission 自发发射Spot 斑点Spray 喷涂Spreading resistance 扩展电阻Sputter 溅射Square root 平方根Stability 稳定性Stacking fault 层错Standard 标准的Standing wave 驻波State-of-the-art 最新技术Static characteristic 静态特性Statistical analysis 统计分析Steady state 稳态Step motor 步进式电动机Stimulated emission 受激发射Stimulated recombination 受激复合Stopband 阻带Storage time 存储时间Stress 应力Stripline 带状线Subband 次能带Sublimation 升华Submillimeter 亚毫米波Substrate 衬底Substitutional 替位式的Superconductor 超导(电)体Superlattice 超晶格Supply 电源Surface mound表面安装Surge capacity 浪涌能力Switching time 开关时间Switch 开关Synchronizer 同步器,同步装置Synthetic-aperture 合成孔径System 系统Technical 技术的,工艺的Telecommunication 远距通信,电信Telescope 望远镜Terahertz 太赫兹Terminal 终端Template 模板Temperature 温度Tensor 张量Test 测试试验Thermal activation 热激发Thermal conductivity 热导率Thermal equilibrium 热平衡Thermal Oxidation 热氧化Thermal resistance 热阻Thermal sink 热沉Thermal velocity 热运动Thick- film technique 厚膜技术Thin- film hybrid IC 薄膜混合集成电路Thin-Film Transistor(TFT) 薄膜晶体Three dimension 三维Threshold 阈值Through Silicon Via 硅通孔Thyistor 晶闸管Time resolution 时间分辨率Tolerance 公差T/R module 发射/接收模块Transconductance 跨导Transfer characteristic 转移特性Transfer electron 转移电子Transfer function 传输函数Transient 瞬态的Transistor aging(stress) 晶体管老化Transit time 渡越时间Transition 跃迁Transition-metal silica 过度金属硅化物Transition probability 跃迁几率Transition region 过渡区Transmissivity 透射率Transmitter 发射机Transceiver 收发机Transport 输运Transverse 横向的Trap 陷阱Trapping 俘获Trapped charge 陷阱电荷Travelling wave 行波Trigger 触发Trim 调配调整Triple diffusion 三重扩散Tolerance 容差Tube 管子电子管Tuner 调节器Tunnel(ing) 隧道(穿)Tunnel current 隧道电流Turn - off time 关断时间Ultraviolet 紫外的Ultrabright 超亮的Ultrasonic 超声的Underfilling 下填充Undoped 无掺杂Unijunction 单结的Unipolar 单极的Unit cell 原(元)胞Unity- gain frequency 单位增益频率Unilateral-switch 单向开关Vacancy 空位Vacuum 真空Valence(value) band 价带Value band edge 价带顶Valence bond 价键Vapour phase 汽相Varactor 变容管Variable 可变的Vector 矢量Vertical 垂直的Vibration 振动Visible light 可见光Voltage 电压Volt 伏特Wafer 晶片Watt 瓦Wave guide 波导Wavelength 波长Wave-particle duality 波粒二相性Wear-out 烧毁Wetting 浸润Wideband 宽禁带Wire 引线Wire routing 布线Work function 功函数Worst-case device 最坏情况器件X-ray X射线Yield 成品率Zinc 锌。
半导体微电子专业词汇中英文对照
半导体微电子专业词汇中英文对照Accelerated testing 加速实验Acceptor 受主Acceptor atom 受主原子Accumulation 积累、堆积Accumulating contact 积累接触Accumulation region 积累区Accumulation layer 积累层Acoustic Surface Wave 声表面波Active region 有源区Active component 有源元Active device 有源器件Activation 激活Activation energy 激活能Active region 有源(放大)区A/D conversion 模拟-数字转换Adhesives 粘接剂Admittance 导纳Aging 老化Airborne 空载Allowed band 允带allowance 容限,公差Alloy-junction device合金结器件Aluminum(Aluminum) 铝Aluminum – oxide 铝氧化物Aluminum Nitride 氮化铝Aluminum passivation 铝钝化Ambipolar 双极的Ambient temperature 环境温度A M light 振幅调制光,调幅光amplitude limiter 限幅器Amorphous 无定形的,非晶体的Amplifier 功放放大器Analogue(Analog) comparator 模拟比较器Angstrom 埃Anneal 退火Anisotropic 各向异性的Anode 阳极Antenna 天线Aperture 孔径Arsenide (As) 砷Array 阵列Atomic 原子的Atom Clock 原子钟Attenuation 衰减Audio 声频Auger 俄歇Automatic 自动的Automotive 汽车的Availability 实用性Avalanche 雪崩Avalanche breakdown 雪崩击穿Avalanche excitation雪崩激发Background carrier 本底载流子Background doping 本底掺杂Backward 反向Backward bias 反向偏置Ball bond 球形键合Band 能带Band gap 能带间隙Bandwidth 带宽Bar 巴条发光条Barrier 势垒Barrier layer 势垒层Barrier width 势垒宽度Base 基极Base contact 基区接触Base stretching 基区扩展效应Base transit time 基区渡越时间Base transport efficiency基区输运系数Base-width modulation基区宽度调制Batch 批次Battery 电池Beam 束光束电子束Bench 工作台Bias 偏置Bilateral switch 双向开关Binary code 二进制代码Binary compound semiconductor 二元化合物半导体Bipolar 双极性的Bipolar Junction Transistor (BJT)双极晶体管Bit 位比特Blocking band 阻带Body - centered 体心立方Body-centred cubic structure 体立心结构Boltzmann 波尔兹曼Bond 键、键合Bonding electron 价电子Bonding pad 键合点Boron 硼Borosilicate glass 硼硅玻璃Bottom-up 由下而上的Boundary condition 边界条件Bound electron 束缚电子Bragg effect 布拉格效应Breadboard 模拟板、实验板Break down 击穿Break over 转折Brillouin 布里渊 FBrillouin zone 布里渊区Buffer 缓冲器Built-in 内建的Build-in electric field 内建电场Bulk 体/体内Bulk absorption 体吸收Bulk generation 体产生Bulk recombination 体复合Burn-in 老化Burn out 烧毁Buried channel 埋沟Buried diffusion region 隐埋扩散区Bus 总线Calibration 校准,检定,定标、刻度,分度Capacitance 电容Capture cross section 俘获截面Capture carrier 俘获载流子Carbon dioxide (CO2) 二氧化碳Carrier 载流子、载波Carry bit 进位位Cascade 级联Case 管壳Cathode 阴极Cavity 腔体Center 中心Ceramic 陶瓷(的)Channel 沟道Channel breakdown 沟道击穿Channel current 沟道电流Channel doping 沟道掺杂Channel shortening 沟道缩短Channel width 沟道宽度Characteristic impedance 特征阻抗Charge 电荷、充电Charge-compensation effects 电荷补偿效应Charge conservation 电荷守恒Charge drive/exchange/sharing/transfer/storage 电荷驱动/交换/共享/转移/存储Chemical etching 化学腐蚀法Chemically-Polish 化学抛光Chemically-Mechanically Polish (CMP) 化学机械抛光Chemical vapor deposition (cvd)化学汽相淀积Chip 芯片Chip yield 芯片成品率Circuit 电路Clamped 箝位Clamping diode 箝位二极管Cleavage plane 解理面Clean 清洗Clock rate 时钟频率Clock generator 时钟发生器Clock flip-flop 时钟触发器Close-loop gain 闭环增益Coating 涂覆涂层Coefficient of thermal expansion 热膨胀系数Coherency 相干性Collector 集电极Collision 碰撞Compensated OP-AMP 补偿运放Common-base/collector/emitter connection 共基极/集电极/发射极连接Common-gate/drain/source connection 共栅/漏/源连接Common-mode gain 共模增益Common-mode input 共模输入Common-mode rejection ratio (CMRR) 共模抑制比Communication 通信Compact 致密的Compatibility 兼容性Compensation 补偿Compensated impurities 补偿杂质Compensated semiconductor 补偿半导体Complementary Darlington circuit 互补达林顿电路Complementary Metal-Oxide-SemiconductorField-Effect-Transistor(CMOS) 互补金属氧化物半导体场效应晶体管Computer-aided design(CAD)/test(CAT)/manufacture(CAM) 计算机辅助设计/ 测试 /制造Component 元件Compound Semiconductor 化合物半导体Conductance 电导Conduction band (edge) 导带(底)Conduction level/state 导带态Conductor 导体Conductivity 电导率Configuration 结构Conlomb 库仑Constants 物理常数Constant energy surface 等能面Constant-source diffusion恒定源扩散Contact 接触Continuous wave 连续波Continuity equation 连续性方程Contact hole 接触孔Contact potential 接触电势Controlled 受控的Converter 转换器Conveyer 传输器Cooling 冷却Copper interconnection system 铜互连系统Corrosion 腐蚀Coupling 耦合Covalent 共阶的Crossover 交叉Critical 临界的Cross-section 横断面Crucible坩埚Cryogenic cooling system 冷却系统Crystal defect/face/orientation/lattice 晶体缺陷/晶面/晶向/晶格Cubic crystal system 立方晶系Current density 电流密度Curvature 曲率Current drift/drive/sharing 电流漂移/驱动/共享Current Sense 电流取样Curve 曲线Custom integrated circuit 定制集成电路Cut off 截止Cylindrical 柱面的Czochralshicrystal 直立单晶Czochralski technique 切克劳斯基技术(Cz法直拉晶体J))Dangling bonds 悬挂键Dark current 暗电流Dead time 空载时间Decade 十进制Decibel (dB) 分贝Decode 解码Deep acceptor level 深受主能级Deep donor level 深施主能级Deep energy level 深能级Deep impurity level 深度杂质能级Deep trap 深陷阱Defeat 缺陷Degenerate semiconductor 简并半导体Degeneracy 简并度Degradation 退化Degree Celsius(centigrade) /Kelvin 摄氏/开氏温度Delay 延迟Density 密度Density of states 态密度Depletion 耗尽Depletion approximation 耗尽近似Depletion contact 耗尽接触Depletion depth 耗尽深度Depletion effect 耗尽效应Depletion layer 耗尽层Depletion MOS 耗尽MOS Depletion region 耗尽区Deposited film 淀积薄膜Deposition process 淀积工艺Design rules 设计规则Detector 探测器Developer 显影剂Diamond 金刚石Die 芯片(复数dice)Diode 二极管Dielectric Constant 介电常数Dielectric isolation 介质隔离Difference-mode input 差模输入Differential amplifier 差分放大器Differential capacitance 微分电容Diffraction 衍射Diffusion 扩散Diffusion coefficient 扩散系数Diffusion constant 扩散常数Diffusivity 扩散率Diffusion capacitance/barrier/current/furnace 扩散电容/势垒/电流/炉Digital circuit 数字电路Dimension (1)尺寸(2)量钢(3)维,度Diode 二极管Dipole domain 偶极畴Dipole layer 偶极层Direct-coupling 直接耦合Direct-gap semiconductor 直接带隙半导体Direct transition 直接跃迁Directional antenna 定向天线Discharge 放电Discrete component 分立元件Disorder 无序的Display 显示器Dissipation 耗散Dissolution 溶解Distribution 分布Distributed capacitance 分布电容Distributed model 分布模型Displacement 位移Dislocation 位错Domain 畴Donor 施主Donor exhaustion 施主耗尽Dopant 掺杂剂Doped semiconductor 掺杂半导体Doping concentration 掺杂浓度Dose 剂量Double-diffusive MOS(DMOS)双扩散MOS Drift 漂移Drift field 漂移电场Drift mobility 迁移率Dry etching 干法腐蚀Dry/wet oxidation 干/湿法氧化Dose 剂量Dual-polarization 双偏振,双极化Duty cycle 工作周期Dual-in-line package (DIP)双列直插式封装Dynamics 动态Dynamic characteristics 动态属性Dynamic impedance 动态阻抗Early effect 厄利效应Early failure 早期失效Effect 效应Effective mass 有效质量Electric Erase Programmable Read Only Memory(E2PROM) 电可擦除只读存储器Electrode 电极Electromigration 电迁移Electron affinity 电子亲和势Electron-beam 电子束Electroluminescence 电致发光Electron gas 电子气Electron trapping center 电子俘获中心Electron Volt (eV) 电子伏Electro-optical 光电的Electrostatic 静电的Element 元素/元件/配件Elemental semiconductor 元素半导体Ellipse 椭圆Emitter 发射极Emitter-coupled logic 发射极耦合逻辑Emitter-coupled pair 发射极耦合对Emitter follower 射随器Empty band 空带Emitter crowding effect 发射极集边(拥挤)效应Endurance test =life test 寿命测试Energy state 能态Energy momentum diagram 能量-动量(E-K)图Enhancement mode 增强型模式Enhancement MOS 增强性MOSEnteric (低)共溶的Environmental test 环境测试Epitaxial 外延的Epitaxial layer 外延层Epitaxial slice 外延片Epoxy 环氧的Equivalent circuit 等效电路Equilibrium majority /minority carriers 平衡多数/少数载流子Equipment 设备Erasable Programmable ROM (EPROM)可搽取(编程)存储器Erbium laser 掺铒激光器Error function complement 余误差函数Etch 刻蚀Etchant 刻蚀剂Etching mask 抗蚀剂掩模Excess carrier 过剩载流子Excitation energy 激发能Excited state 激发态Exciton 激子Exponential 指数的Extrapolation 外推法Extrinsic 非本征的Extrinsic semiconductor 杂质半导体Fabry-Perot amplifier 法布里-珀罗放大器Face - centered 面心立方Fall time 下降时间Fan-in 扇入Fan-out 扇出Fast recovery 快恢复Fast surface states 快表面态Feedback 反馈Fermi level 费米能级Femi potential 费米势Fiber optic 光纤Field effect transistor 场效应晶体管Field oxide 场氧化层Figure of merit 品质因数Filter 滤波器Filled band 满带Film 薄膜Fine pitch 细节距Flash memory 闪存存储器Flat band 平带Flat pack 扁平封装Flatness 平整度Flexible 柔性的Flicker noise 闪烁(变)噪声Flip-chip 倒装芯片Flip- flop toggle 触发器翻转Floating gate 浮栅Fluoride etch 氟化氢刻蚀Focal plane 焦平面Forbidden band 禁带Formulation 列式,表达Forward bias 正向偏置Forward blocking /conducting 正向阻断/导通Free electron 自由电子Frequency deviation noise 频率漂移噪声Frequency response 频率响应Function 函数Gain 增益Gallium-Arsenide(GaAs) 砷化镓Gallium Nitride 氮化镓Gate 门、栅、控制极Gate oxide 栅氧化层Gate width 栅宽Gauss(ian)高斯Gaussian distribution profile 高斯掺杂分布Generation-recombination 产生-复合Geometries 几何尺寸Germanium(Ge) 锗Gold 金Graded 缓变的Graded (gradual) channel 缓变沟道Graded junction 缓变结Grain 晶粒Gradient 梯度Graphene 石墨烯Grating 光栅Green laser 绿光激光器Ground 接地Grown junction 生长结Guard ring 保护环Guide wave 导波波导Gunn - effect 狄氏效应Gyroscope 陀螺仪Hardened device 辐射加固器件Harmonics 谐波Heat diffusion 热扩散Heat sink 散热器、热沉Heavy/light hole band 重/轻空穴带Hell - effect 霍尔效应Hertz 赫兹Heterojunction 异质结Heterojunction structure 异质结结构Heterojunction Bipolar Transistor(HBT)异质结双极型晶体High field property 高场特性High-performance MOS(H-MOS)高性能MOS器件High power 大功率Hole 空穴Homojunction 同质结Horizontal epitaxial reactor 卧式外延反应器Hot carrier 热载流子Hybrid integration 混合集成Illumination (1)照明(2)照明学Image - force 镜象力Impact ionization 碰撞电离Impedance 阻抗Imperfect structure 不完整结构Implantation dose 注入剂量Implanted ion 注入离子Impurity 杂质Impurity scattering 杂志散射Inch 英寸Incremental resistance 电阻增量(微分电阻)In-contact mask 接触式掩模Index of refraction 折射率Indium 铟Indium tin oxide (ITO) 铟锡氧化物Inductance 电感Induced channel 感应沟道Infrared 红外的Injection 注入Input power 输入功率Insertion loss 插入损耗Insulator 绝缘体Insulated Gate FET(IGFET) 绝缘栅FET Integrated injection logic 集成注入逻辑Integration 集成、积分Integrated Circuit 集成电路Interconnection 互连Interconnection time delay 互连延时Interdigitated structure 交互式结构Interface 界面Interference 干涉International system of unions 国际单位制Internally scattering 谷间散射Interpolation 内插法Intrinsic 本征的Intrinsic semiconductor 本征半导体Inverse operation 反向工作Inversion 反型Inverter 倒相器Ion 离子Ion beam 离子束Ion etching 离子刻蚀Ion implantation 离子注入Ionization 电离Ionization energy 电离能Irradiation 辐照Isolation land 隔离岛Isotropic 各向同性Junction FET(JFET) 结型场效应管Junction isolation 结隔离Junction spacing 结间距Junction side-wall 结侧壁Laser 激光器Laser diode 激光二极管Latch up 闭锁Lateral 横向的Lattice 晶格Layout 版图Lattice binding/cell/constant/defect/distortion 晶格结合力/晶胞/晶格/晶格常熟/晶格缺陷/晶格畸变Lead 铅Leakage current (泄)漏电流Life time 寿命linearity 线性度Linked bond 共价键Liquid Nitrogen 液氮Liquid-phase epitaxial growth technique 液相外延生长技术Lithography 光刻Light Emitting Diode(LED) 发光二极管Linearity 线性化Liquid 液体Lock in 锁定Longitudinal 纵向的Long life 长寿命Lumped model 集总模型Magnetic 磁的Majority carrier 多数载流子Mask 掩膜板,光刻板Mask level 掩模序号Mask set 掩模组Mass - action law 质量守恒定律Master-slave D flip-flop 主从D 触发器Matching 匹配Material 材料Maxwell 麦克斯韦Mean free path 平均自由程Mean time before failure (MTBF) 平均工作时间Mechanical 机械的Membrane (1)薄腊,膜片(2)隔膜Megeto - resistance 磁阻Mesa 台面MESFET-Metal Semiconductor 金属半导体FET Metalorganic Chemical Vapor Deposition MOCVD 金属氧化物化学汽相淀积Metallization 金属化Metal oxide semiconductor (MOS)金属氧化物半导体MeV 兆电子伏Microelectronic technique 微电子技术Microelectronics 微电子学Microelectromechanical System (MEMS) 微电子机械系统Microwave 微波Millimeterwave 毫米波Minority carrier 少数载流子Misfit 失配Mismatching 失配Mobility 迁移率Module 模块Modulate 调制Molecular crystal 分子晶体Monolithic IC 单片MOSFET 金属氧化物半导体场效应晶体管Mount 安装Multiplication 倍增Modulator 调制Multi-chip IC 多芯片ICMulti-chip module(MCM) 多芯片模块Multilayer 多层Multiplication coefficient 倍增因子Multiplexer 复用器Multiplier 倍增器Naked chip 未封装的芯片(裸片)Nanometer 纳米Nanotechnology 纳米技术Negative feedback 负反馈Negative resistance 负阻Negative-temperature-coefficient负温度系数Nesting 套刻Noise figure 噪声系数Nonequilibrium 非平衡Nonvolatile 非挥发(易失)性Normally off/on 常闭/开Nuclear 核Numerical analysis 数值分析Occupied band 满带Offset 偏移、失调On standby 待命状态Ohmic contact 欧姆接触Open circuit 开路Operating point 工作点Operating bias 工作偏置Operational amplifier (OPAMP)运算放大器Optical photon 光子Optical quenching 光猝灭Optical transition 光跃迁Optical-coupled isolator 光耦合隔离器Organic semiconductor 有机半导体Orientation 晶向、定向Oscillator 振荡器Outline 外形Out-of-contact mask 非接触式掩模Output characteristic 输出特性Output power 输出功率Output voltage swing 输出电压摆幅Overcompensation 过补偿Over-current protection 过流保护Over shoot 过冲Over-voltage protection 过压保护Overlap 交迭Overload 过载Oscillator 振荡器Oxide 氧化物Oxidation 氧化Oxide passivation 氧化层钝化Package 封装Pad 压焊点Parameter 参数Parasitic effect 寄生效应Parasitic oscillation 寄生振荡Pass band 通带Passivation 钝化Passive component 无源元件Passive device 无源器件Passive surface 钝化界面Parasitic transistor 寄生晶体管Pattern 图形Payload 有效载荷Peak-point voltage 峰点电压Peak voltage 峰值电压Permanent-storage circuit 永久存储电路Period 周期Permeable - base 可渗透基区Phase-lock loop 锁相环Phase drift 相移Phonon spectra 声子谱Photo conduction 光电导Photo diode 光电二极管Photoelectric cell 光电池Photoelectric effect 光电效应Photonic devices 光子器件Photolithographic process 光刻工艺Photoluminescence 光致发光Photo resist (光敏)抗腐蚀剂Photo mask 光掩模Piezoelectric effect 压电效应Pin 管脚Pinch off 夹断Pinning of Fermi level 费米能级的钉扎(效应)Planar process 平面工艺Planar transistor 平面晶体管Plasma 等离子体Plane 平面的Plasma 等离子体Plate 板电路板P-N junction pn结Poisson equation 泊松方程Point contact 点接触Polarity 极性Polycrystal 多晶Polymer semiconductor 聚合物半导体Poly-silicon 多晶硅Positive 正的Potential (电)势Potential barrier 势垒Potential well 势阱Power electronic devices电力电子器件Power dissipation 功耗Power transistor 功率晶体管Preamplifier 前置放大器Primary flat 主平面Print-circuit board(PCB) 印制电路板Probability 几率Probe 探针Procedure 工艺Process 工艺Projector 投影仪Propagation delay 传输延时Proton 质子Proximity effect 邻近效应Pseudopotential method 赝势法Pump 泵浦Punch through 穿通Pulse triggering/modulating 脉冲触发/调制Pulse Widen Modulator(PWM) 脉冲宽度调制Punchthrough 穿通Push-pull stage 推挽级Q Q值Quality factor 品质因子Quantization 量子化Quantum 量子Quantum efficiency 量子效应Quantum mechanics 量子力学Quasi – Fermi-level 准费米能级Quartz 石英Radar 雷达Radiation conductivity 辐射电导率Radiation damage 辐射损伤Radiation flux density 辐射通量密度Radiation hardening 辐射加固Radiation protection 辐射保护Radiative - recombination 辐照复合Radio 无线电射电射频Radio-frequency RF 射频Raman 拉曼Random 随机Range 测距Radio 比率系数Ray 射线Reactive sputtering source 反应溅射源Real time 实时Receiver 接收机Recombination 复合Recovery diode 恢复二极管Record 记录Recovery time 恢复时间Rectifier 整流器(管)Rectifying contact 整流接触Red light 红光Reference 基准点基准参考点Refractive index 折射率Register 寄存器Regulate 控制调整Relative 相对的Relaxation 驰豫Relaxation lifetime 驰豫时间Relay 中继Reliability 可靠性Remote 远程Repeatability 可重复性Reproduction 重复制造Residual current 剩余电流Resonance 谐振Resin 树脂Resistance 电阻Resistor 电阻器Resistivity 电阻率Regulator 稳压管(器)Resolution 分辨率Response time 响应时间Return signal 回波信号Reverse 反向的Reverse bias 反向偏置Ribbon 光纤带Ridge waveguide 脊形波导Ring laser 环形激光器Rotary wave 旋转波Run 运行Sampling circuit 取样电路Sapphire 蓝宝石(Al2O3)Satellite valley 卫星谷Saturated current range 电流饱和区Scan 扫描Scaled down 按比例缩小Scattering 散射Schematic layout 示意图,简图Schottky 肖特基Schottky barrier 肖特基势垒Schottky contact 肖特基接触Screen 筛选Scribing grid 划片格Secondary flat 次平面Seed crystal 籽晶Segregation 分凝Selectivity 选择性Self aligned 自对准的Self diffusion 自扩散Semiconductor 半导体Semiconductor laser半导体激光器Semiconductor-controlled rectifier 半导体可控硅Sensitivity 灵敏度Sensor 传感器Serial 串行/串联Series inductance 串联电感Settle time 建立时间Sheet resistance 薄层电阻Shaping 成型Shield 屏蔽Shifter 移相器Short circuit 短路Shot noise 散粒噪声Shunt 分流Sidewall capacitance 边墙电容Signal 信号Silica glass 石英玻璃Silicon 硅Silicon carbide 碳化硅Silicon dioxide (SiO2) 二氧化硅Silicon Nitride(Si3N4) 氮化硅Silicon On Insulator 绝缘体上硅Silver whiskers 银须Simple cubic 简立方Simulation 模拟Single crystal 单晶Sink 热沉Sinter 烧结Skin effect 趋肤效应Slot 槽隙Slow wave 慢波Smooth 光滑的Subthreshold 亚阈值的Solar battery/cell 太阳能电池Solid circuit 固体电路Solid Solubility 固溶度Solution 溶液Sonband 子带Source 源极Source follower 源随器Space charge 空间电荷Space Craft 宇宙飞行器Spacing 间距Specific heat(PT) 比热Spectral 光谱Spectrum 光谱(复数)Speed-power product 速度功耗乘积Spherical 球面的Spin 自旋Split 分裂Spontaneous emission 自发发射Spot 斑点Spray 喷涂Spreading resistance 扩展电阻Sputter 溅射Square root 平方根Stability 稳定性Stacking fault 层错Standard 标准的Standing wave 驻波State-of-the-art 最新技术Static characteristic 静态特性Statistical analysis 统计分析Steady state 稳态Step motor 步进式电动机Stimulated emission 受激发射Stimulated recombination 受激复合Stopband 阻带Storage time 存储时间Stress 应力Stripline 带状线Subband 次能带Sublimation 升华Submillimeter 亚毫米波Substrate 衬底Substitutional 替位式的Superconductor 超导(电)体Superlattice 超晶格Supply 电源Surface mound表面安装Surge capacity 浪涌能力Switching time 开关时间Switch 开关Synchronizer 同步器,同步装置Synthetic-aperture 合成孔径System 系统Technical 技术的,工艺的Telecommunication 远距通信,电信Telescope 望远镜Terahertz 太赫兹Terminal 终端Template 模板Temperature 温度Tensor 张量Test 测试试验Thermal activation 热激发Thermal conductivity 热导率Thermal equilibrium 热平衡Thermal Oxidation 热氧化Thermal resistance 热阻Thermal sink 热沉Thermal velocity 热运动Thick- film technique 厚膜技术Thin- film hybrid IC 薄膜混合集成电路Thin-Film Transistor(TFT) 薄膜晶体Three dimension 三维Threshold 阈值Through Silicon Via 硅通孔Thyistor 晶闸管Time resolution 时间分辨率Tolerance 公差T/R module 发射/接收模块Transconductance 跨导Transfer characteristic 转移特性Transfer electron 转移电子Transfer function 传输函数Transient 瞬态的Transistor aging(stress) 晶体管老化Transit time 渡越时间Transition 跃迁Transition-metal silica 过度金属硅化物Transition probability 跃迁几率Transition region 过渡区Transmissivity 透射率Transmitter 发射机Transceiver 收发机Transport 输运Transverse 横向的Trap 陷阱Trapping 俘获Trapped charge 陷阱电荷Travelling wave 行波Trigger 触发Trim 调配调整Triple diffusion 三重扩散Tolerance 容差Tube 管子电子管Tuner 调节器Tunnel(ing) 隧道(穿)Tunnel current 隧道电流Turn - off time 关断时间Ultraviolet 紫外的Ultrabright 超亮的Ultrasonic 超声的Underfilling 下填充Undoped 无掺杂Unijunction 单结的Unipolar 单极的Unit cell 原(元)胞Unity- gain frequency 单位增益频率Unilateral-switch 单向开关Vacancy 空位Vacuum 真空Valence(value) band 价带Value band edge 价带顶Valence bond 价键Vapour phase 汽相Varactor 变容管Variable 可变的Vector 矢量Vertical 垂直的Vibration 振动Visible light 可见光Voltage 电压Volt 伏特Wafer 晶片Watt 瓦Wave guide 波导Wavelength 波长Wave-particle duality 波粒二相性Wear-out 烧毁Wetting 浸润Wideband 宽禁带Wire 引线Wire routing 布线Work function 功函数Worst-case device 最坏情况器件X-ray X射线Yield 成品率Zinc 锌。
钙钛矿的表面化学和钝化
钙钛矿的表面化学和钝化英文回答:Calcium titanium oxide, also known as perovskite, is a fascinating material with a wide range of applications in various fields. Its surface chemistry plays a crucial role in determining its properties and performance. In this response, I will discuss the surface chemistry of perovskite and the methods used to passivate its surface.The surface of perovskite can undergo various chemical reactions with the surrounding environment, leading to changes in its electronic and optical properties. One important aspect of its surface chemistry is the presence of defects, such as oxygen vacancies and surface states. These defects can act as trap sites for charge carriers, affecting the material's conductivity and recombination dynamics.To improve the performance of perovskite-based devices,it is essential to passivate the surface and reduce the density of defects. One commonly used method for surface passivation is the deposition of a thin layer of a passivating material, such as organic or inorganic compounds. This passivation layer can effectively reduce the surface recombination rate and improve the charge extraction efficiency.Another approach to surface passivation is the use of surface modifiers or functional groups. These modifiers can chemically bind to the surface of perovskite, creating a protective layer that prevents the interaction of perovskite with the surrounding environment. For example, organic molecules with long alkyl chains can form self-assembled monolayers on the surface, providing a hydrophobic barrier and reducing the degradation of perovskite in the presence of moisture.In addition to passivation, surface engineering techniques can also be employed to tailor the surface properties of perovskite. For example, surface doping can be used to introduce specific impurities into theperovskite lattice, altering its electronic structure and enhancing its performance in certain applications. Surface functionalization with specific chemical groups can also enable the attachment of functional molecules or nanoparticles, allowing for the development of hybrid perovskite systems with enhanced properties.中文回答:钙钛矿,也被称为钙钛矿石英,是一种具有广泛应用的材料,可在各个领域发挥作用。
半导体一些术语的中英文对照
半导体一些术语的中英文对照离子注入机ion implanterLSS 理论Lindhand Scharff and Schiott theory 又称“林汉德-斯卡夫-斯高特理论”。
沟道效应channeling effect 射程分布range distribution 深度分布depth distribution 投影射程projected range 阻止距离stopping distance 阻止本领stopping power 标准阻止截面standard stopping cross section 退火annealing 激活能activation energy 等温退火isothermal annealing 激光退火laser annealing 应力感生缺陷stress-induced defect 择优取向preferred orientation 制版工艺mask-making technology 图形畸变pattern distortion 初缩first minification 精缩final minification 母版master mask 铭版chromium plate 干版dry plate 孚L胶版emulsion plate 透明版see-through plate高分辨率版high resolution plate, HRP超微粒干版plate for ultra-microminiaturization 掩模mask掩模对准mask alignment 对准精度alignment precision 光刻胶photoresist又称“光致抗蚀剂”。
负性光刻胶negative photoresist 正性光刻胶positive photoresist 无机光刻胶inorganic resist 多层光刻胶multilevel resist 电子束光刻胶electron beam resist X射线光刻胶X-ray resist 刷洗scrubbing 甩胶spinning 涂胶photoresist coating 后烘postbaking 光刻photolithographyX 射线光刻X-ray lithography电子束光刻U electron beam lithography离子束光刻ion beam lithography深紫外光刻deep-UV lithography光刻机mask aligner投影光刻机projection mask aligner曝光exposure接触式曝光法contact exposure method接近式曝光法proximity exposure method光学投影曝光法optical projection exposure method 电子束曝光系统electron beam exposure system 分步重复系统step-and-repeat system显影development线宽linewidth去胶stripping of photoresist氧化去胶removing of photoresist by oxidation等离子[体]去胶removing of photoresist by plasma亥U蚀etching干法刻蚀dry etching反应离子刻蚀reactive ion etching, RIE各向同性刻蚀isotropic etching各向异性刻蚀anisotropic etching反应溅射刻蚀reactive sputter etching离子铳ion beam milling又称“离子磨削”。
CR)Band Bending in Semiconductors_ Chemical and Physical Consequences at Surfaces and Interfaces
Band Bending in Semiconductors: Chemical and Physical Consequences at Surfaces and Interfaces
Zhen Zhang and John T. Yates, Jr.*
Department of Chemistry, University of Virginia, Charlottesville, Virginia 22904, United States
3.4. Surface Structure-Induced Band Bending and Photochemistry 3.4.1. Surface Reconstruction 3.4.2. Crystallographic Surface Orientation 3.5. Gas-Adsorption-Induced Band Bending and Photochemistry 3.5.1. Dual Roles of O2 in CO Oxidation 3.6. Metal/Semiconductor Band Bending and Photochemistry 3.6.1. Enhancement of Electron−Hole Separation in Semiconductors 3.6.2. Enhancement of Electron−Hole Separation in Metals 3.7. Semiconductor/Semiconductor Band Bending and Photochemistry 3.8. Band Bending in a Real Photocatalytic System 4. Summary Author Information Corresponding Author Notes Biographies Acknowledgments References U U U V W W W Z AA AB AB AB AB AB AC AC AC
(完整版)光伏行业英文词汇
光伏行业英文词汇Cell 电池Crystalline silicon 晶体硅Photovoltaic 光伏bulk properties 体特性at ambient temperature 在室温下wavelength 波长absorption coefficient 吸收系数electron-hole pairs 电子空穴对photon 光子density 密度defect 缺陷surface 表面electrode 电极p-type for hole extraction p型空穴型n-type for electron extraction n 型电子型majority carriers 多数载流子minority carriers 少数载流子surface recombination velocity (SRV)表面复合速率back surface field (BSF)背场at the heavily doped regions 重掺杂区saturation current density Jo 饱和电流密度thickness 厚度contact resistance 接触电阻concentration 浓度boron 硼Gettering techniques吸杂nonhomogeneous 非均匀的solubility 溶解度selective contacts 选择性接触insulator 绝缘体oxygen 氧气hydrogen 氢气Plasma enhanced chemical vapor deposition PECVDInterface 界面The limiting efficiency 极限效率reflection 反射light- trapping 光陷intrinsic material 本征材料bifacial cells 双面电池monocrystalline 单晶float zone material FZ-Si Czochralski silicon Cz-Si industrial cells 工业电池a high concentration of oxygen 高浓度氧Block or ribbon 块或硅带Crystal defects 晶体缺陷grain boundaries 晶界dislocation 位错solar cell fabrication 太阳能电池制造impurity 杂质P gettering effect 磷吸杂效果Spin-on 旋涂supersaturation 过饱和dead layer 死层electrically inactive phosphorus 非电活性磷interstitial 空隙the eutectic temperature 共融温度boron-doped substrate 掺硼基体passivated emitter and rear locally diffused cells PERL电池losses 损失the front surface 前表面metallization techniques 金属化技术metal grids 金属栅线laboratory cells 实验室电池the metal lines 金属线selective emitter 选择性发射极photolithographic 光刻gradient 斜度precipitate 沉淀物localized contacts 局部接触point contacts 点接触passivated emitter rear totally diffused PERTsolder 焊接bare silicon 裸硅片high refraction index 高折射系数reflectance 反射encapsulation 封装antireflection coating ARC减反射层an optically thin dielectric layer 光学薄电介层interference effects 干涉效应texturing 制绒alkaline solutions 碱溶液etch 刻蚀/腐蚀anisotropically 各向异性地plane 晶面pyramids 金字塔a few microns 几微米etching time and temperature 腐蚀时间和温度manufacturing process 制造工艺process flow 工艺流程high yield 高产量starting material 原材料solar grade 太阳级a pseudo-square shape 单晶型状saw damage removal 去除损伤层fracture 裂纹acid solutions 酸溶液immerse 沉浸tank 槽texturization 制绒microscopic pyramids 极小的金字塔size 尺寸大小hinder the formation of the contacts 阻碍电极的形成the concentration,the temperature and the agitation of the solution 溶液的浓度,温度和搅拌the duration of the bath 溶液维持时间alcohol 酒精improve 改进增加homogeneity 同质性wettability 润湿性phosphorus diffusion 磷扩散eliminate adsorbed metallic impurities 消除吸附的金属杂质quartz furnaces 石英炉quartz boats 石英舟quartz tube 石英炉管bubbling nitrogen through liquid POCL3 小氮belt furnaces 链式炉back contact cell 背电极电池reverse voltage 反向电压reverse current 反向电流amorphous glass of phospho-silicates 非晶玻璃diluted HF 稀释HF溶液junction isolation 结绝缘coin-stacked 堆放barrel-type reactors 桶状反应腔fluorine 氟fluorine compound 氟化物simultaneously 同时地high throughput 高产出ARC deposition 减反层沉积Titanium dioxide TiO2Refraction index 折射系数Encapsulated cell 封装电池Atmospheric pressure chemical vapor deposition APCVDSprayed from a nozzle 喷嘴喷雾Hydrolyze 水解Spin -on 旋涂Front contact print 正电极印刷The front metallization 前面金属化Low contact resistance to silicon 低接触电阻Low bulk resistivity 低体电阻率Low line width with high aspect ratio 低线宽高比Good mechanical adhesion 好机械粘贴solderability 可焊性screen printing 丝网印刷comblike pattern 梳妆图案finger 指条bus bars 主栅线viscous 粘的solvent 溶剂back contact print 背电极印刷both silver and aluminum 银铝form ohmic contact 形成欧姆接触warp 弯曲cofiring of metal contacts 电极共烧organic components of the paste 浆料有机成分burn off 烧掉sinter 烧结perforate 穿透testing and sorting 测试分选I-V curve I-V曲线Module 组件Inhomogeneous 不均匀的Gallium 镓Degradation 衰减A small segregation coefficient 小分凝系数Asymmetric 不对称的High resolution 高分辨率Base resistivity 基体电阻率The process flow 工艺流程Antireflection coating 减反射层Cross section of a solar cell 太阳能电池横截面Dissipation 损耗Light-generated current 光生电流Incident photons 入射光子The ideal short circuit flow 理想短路电路The depletion region 耗尽区Quantum efficiency 量子效率Blue response 蓝光效应Spectral response 光谱响应Light-generated carriers 光生载流子Forward bias 正向偏压Simulation 模拟Equilibrium 平衡Superposition 重合The fourth quadrant 第四象限The saturation current 饱和电流Io Fill factor 填充因子FF Graphically 用图象表示The maximum theoretical FF 理论上Empirically 经验主义的Normalized Voc 规范化VocThe ideality factor n-factor 理想因子Terrestrial solar cells 地球上的电池At a temperature of 25C 25度下Under AM1.5 conditions 在AM1.5环境下Efficiency is defined as ××定义为Fraction 分数Parasitic resistances 寄生电阻Series resistance 串联电阻Shunt resistance 并联电阻The circuit diagram 电路图Be sensitive to temperature 易受温度影响The band gap of a semiconductor 半导体能隙The intrinsic carrier concentration 本征载流子的浓度Reduce the optical losses 减少光损Deuterated silicon nitride 含重氢氮化硅Buried contact solar cells BCSC Porous silicon PS 多孔硅Electrochemical etching 电化学腐蚀Screen printed SP 丝网印刷A sheet resistance of 45-50 ohm/sq 45到50方块电阻The reverse saturation current density Job 反向饱和电流密度Destructive interference 相消干涉Surface textingInverted pyramid 倒金字塔Four point probe 四探针Saw damage etchAlkaline 碱的Cut groove 开槽Conduction band 导带Valence band 价带B and O simultaneously in silicon 硼氧共存Iodine/methanol solution 碘酒/甲醇溶液Rheology 流变学Spin-on dopants 旋涂掺杂Spray-on dopants 喷涂掺杂The metallic impurities 金属杂质One slot for two wafers 一个槽两片Throughput 产量A standard POCL3 diffusion 标准POCL3扩散Back-to-back diffusion 背靠背扩散Heterojunction with intrinsic thin -layer HIT电池Refine 提炼Dye sensitized solar cell 染料敏化太阳电池Organic thin film solar cell 有机薄膜电池Infra red 红外光Unltra violet 紫外光Parasitic resistance 寄生电阻Theoretical efficiency 理论效率Busbar 主栅线Kerf loss 锯齿损失Electric charge 电荷Covalent bonds 共价键The coefficient of thermal expansion (CTE) 热膨胀系数Bump 鼓泡Alignment 基准Fiducial mark 基准符号Squeegee 橡胶带Isotropic plasma texturing 各向等离子制绒Block-cast multicrystalline silicon 整铸多晶硅Parasitic junction removal 寄生结的去除Iodine ethanol 碘酒Deionised water 去离子水Viscosity 粘性Mesh screen 网孔Emulsion 乳胶Properties of light 光特性Electromagnetic radiation 电磁辐射The visible light 可见光The wavelength,denoted by R 用R 表示波长An inverse relationship between……and……given by the equation:相反关系,可用方程表示Spectral irradiance 分光照度……is shown in the figure below. Directly convert electricity into sunlight 直接将电转换成光Raise an electron to a higher energy state 电子升入更高能级External circuit 外电路Meta-stable 亚稳态Light-generated current 光生电流Sweep apart by the electric field Quantum efficiency 量子效率The fourth quadrant 第四象限The spectrum of the incident light 入射光谱The AM1.5 spectrumThe FF is defined as the ratio of ……to……Graphically 如图所示Screen-printed solar cells 丝网印刷电池Phosphorous diffusion 磷扩散A simple homongeneous diffusion 均匀扩散Blue response 蓝光相应Shallow emitter 浅结Commercial production 商业生产Surface texturing to reduce reflection 表面制绒Etch pyramids on the wafer surface with a chemical solutionCrystal orientationTitanium dioxide TiO2PasteInorganic 无机的Glass 玻璃料DopantCompositionParticle sizeDistributionEtch SiNxContact pathSintering aidAdhesion 黏合性Ag powderMorphology 形态CrystallinityGlass effect on Ag/Si interface Reference cellOrganicResin 树脂Carrier 载体Rheology 流变性Printability 印刷性Aspect ratio 高宽比Functional groupMolecular weightAdditives 添加剂Surfactant 表面活性剂Thixotropic agent 触变剂Plasticizer 可塑剂Solvent 溶剂Boiling pointVapor pressure蒸汽压Solubility 溶解性Surface tension 表面张力Solderability Viscosity 黏性Solids contentFineness of grind ,研磨细度Dried thicknessFired thicknessDrying profilePeak firing temp300 mesh screenEmulsion thickness 乳胶厚度StorageShelf life 保存期限Thinning 稀释Eliminate Al bead formation 消除铝珠Low bowingWet depositPattern design: 100um*74太阳电池solar cell单晶硅太阳电池single crystalline silicon solar cell多晶硅太阳电池so multi crystalline silicon solar cell非晶硅太阳电池amorphous silicon solar cell薄膜太能能电池Thin-film solar cell多结太阳电池multijunction solar cell 化合物半导体太阳电池compound semiconductor solar cell用化合物半导体材料制成的太阳电池带硅太阳电池silicon ribbon solar cell光电子photo-electron短路电流short-circuit current (Isc)开路电压open-circuit voltage (V oc)最大功率maximum power (Pm)最大功率点maximum power point最佳工作点电压optimum operating voltage (Vn)最佳工作点电流optimum operating current (In)填充因子fill factor(curve factor)曲线修正系数curve correction coefficient太阳电池温度solar cell temperature串联电阻series resistance并联电阻shunt resistance转换效率cell efficiency暗电流dark current暗特性曲线dark characteristic curve光谱响应spectral response(spectral sensitivity)太阳电池组件module(solar cell module)隔离二极管blocking diode旁路二极管bypass (shunt) diode组件的电池额定工作温度NOCT(nominal operating cell temperature)短路电流的温度系数temperature coefficients of Isc开路电压的温度系数temperature coefficients of V oc峰值功率的温度系数temperature coefficients of Pm组件效率Module efficiency峰瓦watts peak额定功率rated power额定电压rated voltage额定电流rated current太阳能光伏系统solar photovoltaic (PV) system并网太阳能光伏发电系统Grid-Connected PV system独立太阳能光伏发电系统Stand alone PV system太阳能控制器solar controller逆变器inverter孤岛效应islanding逆变器变换效率inverter efficiency方阵(太阳电池方阵) array (solar cell array)子方阵sub-array (solar cell sub-array)充电控制器charge controller直流/直流电压变换器DC/DC converter(inverter)直流/交流电压变换器DC/AC converter(inverter)电网grid太阳跟踪控制器sun-tracking ontroller 并网接口utility interface光伏系统有功功率active power of PV power station光伏系统无功功率reactive power of PV power station光伏系统功率因数power factor of PV power station公共连接点point of common coupling 接线盒junction box发电量power generation输出功率output power交流电Alternating current断路器Circuit breaker汇流箱Combiner box配电箱Distribution box电能表Supply meter变压器Transformer太阳能光伏建筑一体化Building-integrated PV (BIPV)辐射radiation太阳辐照度Solar radiation散射辐照(散射太阳辐照)量diffuse irradiation(diffuse insolation)直射辐照direct irradiation (direct insolation)总辐射度(太阳辐照度) global irradiance (solar global irradiance)辐射计radiometer方位角Azimuth angle倾斜角Tilt angle太阳常数solar constant大气质量(AM) air mass太阳高度角solar elevation angle标准太阳电池standard solar cell (reference solar cell)太阳模拟器solar simulator太阳电池的标准测试条件为:环境温度25±2℃,用标准测量的光源辐照度为1000W/m2 并且有标准的太阳光谱辐照度分布。
异质结光伏组件生产流程
异质结光伏组件生产流程From the beginning of the production process, the manufacturing of heterojunction (HJT) solar cells involves several key steps that require precision and expertise. 从生产流程的开始,异质结光伏电池的制造涉及几个关键步骤,需要精确和专业的技术。
Firstly, the production of the HJT solar cells starts with the preparation of the semiconductor materials. The selection and preparation of the semiconductor materials are crucial in ensuring the efficiency and performance of the solar cells. 首先,异质结光伏电池的生产始于半导体材料的制备。
半导体材料的选择和制备对确保太阳能电池的效率和性能至关重要。
Next, the semiconductor materials undergo the process of texturization to create a rough surface that enhances light absorption. This step involves chemical etching or plasma etching to create the desired texture on the surface of the semiconductor material. 接下来,半导体材料经历了纹理化的过程,创造出粗糙的表面,增强光吸收。
这一步骤涉及化学蚀刻或等离子蚀刻,以在半导体材料表面创建所需的纹理。
二氧化硅钝化层生产工艺流程
二氧化硅钝化层生产工艺流程The production process of silica passivation layer, also known as silica coating, is an essential step in the surface treatment of many materials, especially in the semiconductor and solar industries. 二氧化硅钝化层的生产过程,也被称为硅涂层,在许多材料的表面处理中是一个必不可少的步骤,特别是在半导体和太阳能行业。
This passivation layer serves as a protective coating that enhances the material's resistance to corrosion and improves its overall performance. 这种钝化层作为一种保护涂层,能够增强材料的抗腐蚀性,并提高其整体性能。
The production process involves several steps, including cleaning, surface preparation, and coating application. 生产过程涉及几个步骤,包括清洁、表面处理和涂层施工。
The first step is cleaning, which is crucial to ensure that the surface is free from any contaminants that could interfere with the adhesion of the passivation layer. 第一步是清洁,这一步非常关键,以确保表面没有任何可能影响钝化层附着力的污染物。
After cleaning, the surface undergoes a preparation process to improve the adhesion of the passivation layer. 清洁之后,表面经过一个准备的过程,以提高钝化层的附着力。
表面光电压测试流程
表面光电压测试流程Surface photovoltage (SPV) testing process plays an important rolein evaluating the quality of semiconductor materials and devices. 表面光电压(SPV)测试流程在评估半导体材料和器件质量方面起着重要作用。
It is a non-destructive technique that provides valuable information about carrier recombination, surface recombination, and minority carrier lifetime. 这是一种非破坏性技术,可以提供有关载流子复合、表面复合和少数载流子寿命的宝贵信息。
By measuring the SPV, researchers and engineers can gain insights into the performance and efficiencyof semiconductor materials, as well as identify any defects or impurities present in the material. 通过测量SPV,研究人员和工程师可以深入了解半导体材料的性能和效率,并识别材料中存在的任何缺陷或杂质。
The SPV testing process involves several key steps. SPV测试流程涉及几个关键步骤。
First, the semiconductor sample is prepared by cleaning and polishing its surface to ensure that it is free from any contaminants or impurities that could affect the test results. 首先,半导体样品通过清洁和抛光其表面来准备,以确保没有任何可能影响测试结果的污染物或杂质。
太阳能电池横向电流
太阳能电池横向电流## Transverse current in solar cells.### Summary.The transverse current in a solar cell is a current that flows perpendicular to the direction of the incident light. This current is caused by the diffusion of minority carriers from the illuminated region of the cell to the dark region. The transverse current can be used to improve the efficiency of a solar cell by reducing the recombination of minority carriers.### Transverse Photocurrent Suppression.The transverse current in a solar cell can be suppressed by using a variety of techniques. One common technique is to use a textured surface on the front of the cell. This texture helps to scatter the incident light and reduce the amount of light that is absorbed in the darkregion of the cell. Another technique is to use a passivated emitter and back surface (PERC) structure. This structure helps to reduce the recombination of minority carriers at the surface of the cell.### Auger Recombination Mechanism.The Auger recombination mechanism is a type of minority carrier recombination that can occur in solar cells. This mechanism involves the recombination of an electron and a hole with the simultaneous emission of a third carrier. The Auger recombination mechanism is a major source of recombination in high-efficiency solar cells.### Bulk and Surface Recombination.There are two main types of minority carrier recombination in solar cells: bulk recombination and surface recombination. Bulk recombination occurs in the bulk of the semiconductor material, while surface recombination occurs at the surface of the cell. Bulk recombination is typically the dominant recombinationmechanism in low-efficiency solar cells, while surface recombination is typically the dominant recombination mechanism in high-efficiency solar cells.### Carrier Diffusion Length.The carrier diffusion length is a measure of the average distance that a minority carrier can travel in a semiconductor material before recombining. The carrier diffusion length is an important parameter in solar cells, as it determines the efficiency of the cell. A longer carrier diffusion length will lead to a higher efficiency cell.### Dark Current.The dark current is the current that flows through a solar cell when it is not illuminated. The dark current is caused by the recombination of minority carriers in the cell. The dark current is an important parameter in solar cells, as it determines the efficiency of the cell. A lower dark current will lead to a higher efficiency cell.### Open-Circuit Voltage.The open-circuit voltage is the voltage that is developed across a solar cell when it is not connected to a load. The open-circuit voltage is determined by the bandgap of the semiconductor material and the temperature of the cell. A higher bandgap will lead to a higher open-circuit voltage, while a higher temperature will lead to a lower open-circuit voltage.### Short-Circuit Current.The short-circuit current is the current that flows through a solar cell when it is connected to a load with zero resistance. The short-circuit current is determined by the amount of light that is incident on the cell and the efficiency of the cell. A higher light intensity will leadto a higher short-circuit current, while a higherefficiency cell will lead to a higher short-circuit current.### Fill Factor.The fill factor is a measure of the squareness of the current-voltage curve of a solar cell. The fill factor is determined by the open-circuit voltage, the short-circuit current, and the maximum power point voltage and current. A higher fill factor will lead to a higher efficiency cell.### Efficiency.The efficiency of a solar cell is a measure of the amount of light that is converted into electrical energy. The efficiency of a solar cell is determined by the bandgap of the semiconductor material, the temperature of the cell, the optical losses, and the electrical losses. A higher bandgap will lead to a higher efficiency cell, while a higher temperature will lead to a lower efficiency cell. Optical losses and electrical losses will also reduce the efficiency of a solar cell.## 横向电流。
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SURFACE RECOMBINATION OF CHARGE CARRIERS SURFACE RECOMBINATION OF CHARGECARRIERS IN STRUCTURES“SILICONNANOCRYSTALS ON SILICON”E.B.KAGANOVICH,E.G.MANOILOV,E.V.BEGUN,S.V.CHYRCHYKUDC621.15 cshkarev Institute of Semiconductor Physics,Nat.Acad.Sci.of Ukraine (41,Nauky Prosp.,Kyiv03028,Ukraine;e-mail:dept_5@isp.kiev.ua)The possibility to suppress the surface recombination of charge carriers in monocrystalline silicon(c-Si)has been studied at low temperatures,and the band-edge luminescence in c-Si has been observed.The increase of the effective lifetime of minority charge carriers and its correlation with the intensity growth of the edge photoluminescence have been revealed in c-Si covered,making use of pulsed laser deposition,with SiO x films(x→2)which contain Si nanocrystals.1.IntroductionThe article is devoted to the consideration of nanocrystalline silicon(nc-Si) c-Si nanostructures (“silicon-on-silicon”)with band-edge photoluminescence (PL).They constitute the subject of a new direction of researches which deal with suppressing the surface recombination in c-Si at low temperatures and aim,in particular,at creating the emitters based on silicon with edge electroluminescence at a wavelength of 1.1µm.The reduction of the surface recombination in such emitters remains a challenging problem from the viewpoint of improving the properties of silicon-based transistors and solar cells,fabricating microelectronic elements with extremely small dimensions,and so on.In1976,in work[1],semi-insulating polycrystalline silicon(SIPOS)was suggested and successfully used for the passivation of the surface of high-voltage transistors. SIPOS was a Si layer doped with oxygen and nitrogen. In essence,it was a nanocomposite,which included Si nanoparticles as one phase and an insulator SiO2or SiN2 as the other phase.Such layers were deposited onto the c-Si surface by the chemical vapor deposition (the CVD method).According to the estimations made, the rate of surface recombination in diodes that were passivated by SIPOS layers was about200cm/s.The roles of Si nanoparticles and the CVD technology, which was used for their formation,in the reduction of recombination losses on the c-Si surface have not been clarified.In2004,in work[2],photoelectrochemical processes in GaAs and InP,with CdS nanoparticles having been deposited onto their surface from the aqueous solution, were studied.It has been shown that the enhancement of the photosensitivity of those semiconductors is connected with a decrease of recombination losses on their surface.CdS nanoparticles were considered as being deposited onto the active centers on the surface, which were created by defects,to neutralize them. These centers were assumed to be the centers of radiationless recombination of charge carriers,and the catalytic activity of nanoparticles was considered higher for smaller particles.This work aimed at studying the possibility to reduce the surface recombination in c-Si by modifying its surface.The modification consisted in depositing Si nanoparticles onto the c-Si surface at room temperature making use of the pulsed laser deposition method.2.Experimental Part and Discussion ofResultsHaving examined the literature data on the issue of modifying the c-Si surface with Si nanoparticles in order to reduce the surface recombination and to observe the band-edge luminescence in c-Si,we came to the conclusion that our researches reported below are among the pioneer ones.We studied the structures obtained by the pulse laser deposition of nanocrystalline silicon(nc-Si)films onto the(100)face of single-crystalline silicon(p-Si, 10Ω×cm).The films comprised biphase systems which contained quantum-sized Si nanocrystals in a SiO x matrix(x→2)[3,4].Hence,the investigated structures were the heterojunctions between a wide-gap low-dimensional silicon(nc-Si)and a single-crystalline silicon(c-Si).The films of two types were fabricated. The films of the first type were deposited using the high-energy stream of particles from an erosion plume,in the oxygen atmosphere,and onto a c-Si substrate,remote inr.J.Phys.2006.V.51,N7715E.B.KAGANOVICH,E.G.MANOILOV,E.V.BEGUN,S.V.CHYRCHYKBand-edge photoluminescence spectra of p-Si covered with a SiO x film(x→2),which includes Si nanocrystals and is either undoped (1)or doped with various impurities:In(2),Er(3),Fe(4),Au (5),and Al(6).The corresponding lifetimesτeffof the minority charge carriers are9(1),11(2),15(3),17(4),20(5),and27µs (6)the normal direction from the c-Si target.The films of the second type were deposited using the low-energy particles from the inverse stream,in the inert gas atmosphere,and onto the substrate located in the target plane.The beam emitted by a YAG:Nd3+ laser operating in the modulated Q-factor mode(the wavelength of1.06µm,the energy density of20J/cm2, the pulse duration of10ns,and the repetition frequency of25Hz)was used to scan either the c-Si target or the c-Si target with a metal film(Au,Ag,Cu,Al,In,and others)deposited above.The rate of surface recombination S was evaluated from the value of the effective lifetime of nonequilibrium charge carriersτeffin specimens with the thickness of the order of the charge carrier diffusion length.In its turn,the value ofτeffwas determined by analyzing the kinetics of the thermal emission decay beyond the edge of intrinsic absorption at laser excitation of the specimen [5].We also investigated the correlations between the conditions of the c-Si surface passivation by nc-Si films, the rate of surface recombination in c-Si,the intensity of edge PL in c-Si[6],and the density of boundary electron states(BESs)at the nc-Si/c-Si boundary of these structures[7–9].The BES spectra were determined by analyzing the measured temperature dependence of the condenser(surface)photovoltage.The uncovered c-Si surfaces and c-Si surfaces covered with nc-Si films of the first type were characterized by the highest values of S,S>103cm/s.The highest BES densities,N BES>1012cm−2eV−1,and the highest densities of nonequilibrium charge carrier traps were inherent to them.Edge PL in c-Si was not observed for such specimens.At the same time,the edge PL signal with the maximum at 1.09eV,provided room temperature, appeared in the structures of the second type.The reference experiments,where nc-Si films were deposited onto mica substrates,proved that PL did not result from the emission of large-size Si nanocrystals in the film, but stemmed from the emission of the c-Si substrate. Doping films with metals led to the enhancement of the PL signal(see the figure).These structures manifested a distinct correlation between the PL intensity and τeff;the values of the latter fell into the range9 27µs.The rate of surface recombination S was equal to5×102÷2×103cm/s at that.The density of defects in these structures was lowered.The most substantial reduction of N BES(down to1011cm−2eV−1)occurred when the films were doped with gold atoms.The structures with the copper-doped films also did not manifest edge PL,and the values ofτeffwere small for them.As a rule,the contamination of silicon with transition3d-metals,such as copper,leads to the degradation of the charge carrier lifetime.The acceptor (Al,In)doping of the films deposited onto p-Si,led to an increase of the PL signal,because the highest rate of surface recombination may be inherent to the surface of an intrinsic semiconductor.A promoting influence of Au atoms,which have a large electron affinity,with respect to the PL enhancement is connected with their passivation of the silicon broken bonds–the main centers of radiationless recombination.On the other hand,Au atoms reveal catalytic properties during their oxidation and assist in the formation of stoichiometric oxide SiO2with a lower defect density.The passivation of the c-Si surface by depositing Si nanocrystals onto it can be explained by the fact that Si nanocrystals become deposited onto the active centers on the c-Si surface which are formed by surface defects.Since small particles are more active catalytically,it is the deposition of quantum-sized Si nanocrystals that assists the passivation of the c-Si surface.3.ConclusionsThe correlations between the increase of the effective lifetime of minority charge carriers in c-Si,the reduction of the BES density at the nc-Si/c-Si boundary,and the increase of the edge PL intensity in c-Si at the pulsedr.J.Phys.2006.V.51,N7SURFACE RECOMBINATION OF CHARGE CARRIERSlaser deposition of SiO x films(x→2)that contain Si nanocrystals on the c-Si surface have been found.1.Matsushita T.,Aoki T.,Ohtsu T.et al.//IEEE Trans.onElectron Devices. 1976. 23,N8. P.826 830.2.Kolbasov G.A.,Volkov S.V.,Vorobets V.S.,Rusetskii I.A.//Nanosyst.Nanomater.Nanotekhnol. 2004. 2,N1.P.169 177.3.Kaganovich E.B.,Kizyak I.M.,Manoilov E.G.et al.//Ukr.Fiz.Zh. 2002. 47,N8. P.760 762.4.Kaganovich E.B.,Kizyak I.M.,Manoilov E.G.et al.//Ibid.N7. P.680 683.5.Malyutenko V.K.,Teslenko G.I.//Electron Technology.1991. 24,N3 4. P.97 101.6.Gule E.G.,Kaganovich E.B.,Kizyak I.M.et al.//Fiz.Tekhn.Polupr. 2005. 39,N4. P.430 432.7.Kaganovich E.B.,Primachenko V.E.,Manoilov E.G.et al.//Semicond.Physics,Quantum Electronics and Optoelectronics.1999. 2,N2. P.11 14.8.Kaganovich E.B.,Primachenko V.E.,Manoilov E.G.et al.//Ibid. 2002. 5,N2. P.125 132.9.Kaganovich E.B.,Primachenko V.E.,Kirillova S.I.et al.//Fiz.Tekhn.Polupr. 2002. 36,N9. P.1105 1110.Received18.11.05.Translated from Ukrainian by O.I.Voitenko ПОВЕРХНЕВАРЕКОМБIНАЦIЯНОСIЇВЗАРЯДУВСТРУКТУРАХ“НАНОКРИСТАЛИКРЕМНIЮНАКРЕМНIЇ”Е.Б.Каганович,Е.Г.Манойлов,Є.В.Бєгун,С.В.ЧирчикРезюмеДослiдженоможливiстьзменшеннянизькотемпературнимспо-собомповерхневоїрекомбiнацiїносiївзарядувмонокристалiч-номукремнiї,атакожйогокрайовулюмiнесценцiю.Виявленозбiльшенняефективногочасужиттянеосновнихносiївзарядутайогокореляцiюзiзбiльшеннямiнтенсивностiкрайовоїфо-толюмiнесценцiїприкiмнатнiйтемпературiвмонокристалiч-номукремнiїпiсляiмпульсноголазерногоосадженнянайогоповерхнюплiвокSiO x(x→2),щомiстятьSi-нанокристали.r.J.Phys.2006.V.51,N7717。