SN54ABT16245中文资料
SNJ54LVTH162245WD中文资料
PACKAGING INFORMATIONOrderable Device Status (1)Package Type Package Drawing Pins Package Qty Eco Plan (2)Lead/Ball FinishMSL Peak Temp (3)5962-9678001QXA ACTIVE CFP WD 481TBD Call TI Level-NC-NC-NC 5962-9678001VXA ACTIVE CFP WD 481TBDCall TI Level-NC-NC-NC 74LVTH162245DGGRG4ACTIVE TSSOP DGG 482000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM 74LVTH162245DLRG4ACTIVE SSOP DL 481000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM 74LVTH162245GRDR ACTIVE LFBGA GRD 541000TBDSNPB Level-1-240C-UNLIM 74LVTH162245GRE4ACTIVE TSSOP DGG 482000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM 74LVTH162245ZQLR ACTIVE VFBGA ZQL 561000Green (RoHS &no Sb/Br)SNAGCU Level-1-260C-UNLIM 74LVTH162245ZRDR ACTIVE LFBGA ZRD 541000Green (RoHS &no Sb/Br)SNAGCU Level-1-260C-UNLIM SN74LVTH162245DGGR ACTIVE TSSOP DGG 482000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVTH162245DL ACTIVE SSOP DL 4825Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVTH162245DLG4ACTIVE SSOP DL 4825Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVTH162245DLR ACTIVE SSOP DL 481000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVTH162245KR ACTIVE VFBGA GQL 561000TBD SNPB Level-1-240C-UNLIM SNJ54LVTH162245WDACTIVECFPWD481TBDCall TILevel-NC-NC-NC(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in anew design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan -The planned eco-friendly classification:Pb-Free (RoHS)or Green (RoHS &no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green (RoHS &no Sb/Br):TI defines "Green"to mean Pb-Free (RoHS compatible),and free of Bromine (Br)and Antimony (Sb)based flame retardants (Br or Sb do not exceed 0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.PACKAGE OPTION ADDENDUM4-Oct-2005Addendum-Page 1元器件交易网元器件交易网元器件交易网IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,enhancements, improvements, and other changes to its products and services at any time and to discontinueany product or service without notice. Customers should obtain the latest relevant information before placingorders and should verify that such information is current and complete. All products are sold subject to TI’s termsand conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TIdeems necessary to support this warranty. Except where mandated by government requirements, testing of allparameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible fortheir products and applications using TI components. T o minimize the risks associated with customer productsand applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or processin which TI products or services are used. Information published by TI regarding third-party products or servicesdoes not constitute a license from TI to use such products or services or a warranty or endorsement thereof.Use of such information may require a license from a third party under the patents or other intellectual propertyof the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is withoutalteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproductionof this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable forsuch altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for thatproduct or service voids all express and any implied warranties for the associated TI product or service andis an unfair and deceptive business practice. TI is not responsible or liable for any such statements.Following are URLs where you can obtain information on other Texas Instruments products and applicationsolutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityTelephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2005, Texas Instruments Incorporated。
SN54LV00A中文资料
PACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)SN74LV00AD ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV00ADBLE OBSOLETE SSOP DB14TBD Call TI Call TISN74LV00ADBR ACTIVE SSOP DB142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV00ADBRG4ACTIVE SSOP DB142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV00ADE4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV00ADGVR ACTIVE TVSOP DGV142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV00ADGVRE4ACTIVE TVSOP DGV142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV00ADR ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV00ADRE4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV00ANSR ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV00ANSRG4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV00APW ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV00APWE4ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV00APWG4ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LV00APWLE OBSOLETE TSSOP PW14TBD Call TI Call TISN74LV00APWR ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV00APWRE4ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV00APWRG4ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV00APWT ACTIVE TSSOP PW14250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV00APWTG4ACTIVE TSSOP PW14250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV00ARGYR ACTIVE QFN RGY141000Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEAR(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS)or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.元器件交易网IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,enhancements, improvements, and other changes to its products and services at any time and to discontinueany product or service without notice. Customers should obtain the latest relevant information before placingorders and should verify that such information is current and complete. All products are sold subject to TI’s termsand conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TIdeems necessary to support this warranty. Except where mandated by government requirements, testing of allparameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible fortheir products and applications using TI components. T o minimize the risks associated with customer productsand applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or processin which TI products or services are used. Information published by TI regarding third-party products or servicesdoes not constitute a license from TI to use such products or services or a warranty or endorsement thereof.Use of such information may require a license from a third party under the patents or other intellectual propertyof the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is withoutalteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproductionof this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable forsuch altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for thatproduct or service voids all express and any implied warranties for the associated TI product or service andis an unfair and deceptive business practice. TI is not responsible or liable for any such statements.Following are URLs where you can obtain information on other Texas Instruments products and applicationsolutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityTelephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2005, Texas Instruments Incorporated。
SN54HCT245中文资料
PACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)5962-8550601VRA ACTIVE CDIP J201None Call TI Level-NC-NC-NC 5962-8550601VSA ACTIVE CFP W201None Call TI Level-NC-NC-NC 85506012A ACTIVE LCCC FK201None Call TI Level-NC-NC-NC 8550601RA ACTIVE CDIP J201None Call TI Level-NC-NC-NC JM38510/65553BRA ACTIVE CDIP J201None Call TI Level-NC-NC-NC JM38510/65553BSA ACTIVE CFP W201None Call TI Level-NC-NC-NC SN54HCT245J ACTIVE CDIP J201None Call TI Level-NC-NC-NC SN74HCT245DBLE OBSOLETE SSOP DB20None Call TI Call TISN74HCT245DBR ACTIVE SSOP DB202000Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMSN74HCT245DW ACTIVE SOIC DW2025Pb-Free(RoHS)CU NIPDAU Level-2-250C-1YEAR/Level-1-235C-UNLIMSN74HCT245DWR ACTIVE SOIC DW202000Pb-Free(RoHS)CU NIPDAU Level-2-250C-1YEAR/Level-1-235C-UNLIMSN74HCT245N ACTIVE PDIP N2020Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NC SN74HCT245N3OBSOLETE PDIP N20None Call TI Call TISN74HCT245NSR ACTIVE SO NS202000Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMSN74HCT245PW ACTIVE TSSOP PW2070Pb-Free(RoHS)CU NIPDAU Level-1-250C-UNLIMSN74HCT245PWLE OBSOLETE TSSOP PW20None Call TI Call TISN74HCT245PWR ACTIVE TSSOP PW202000Pb-Free(RoHS)CU NIPDAU Level-1-250C-UNLIMSN74HCT245PWT ACTIVE TSSOP PW20250Pb-Free(RoHS)CU NIPDAU Level-1-250C-UNLIM SNJ54HCT245FK ACTIVE LCCC FK201None Call TI Level-NC-NC-NC SNJ54HCT245J ACTIVE CDIP J201None Call TI Level-NC-NC-NC SNJ54HCT245W ACTIVE CFP W201None Call TI Level-NC-NC-NC (1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-May not be currently available-please check /productcontent for the latest availability information and additional product content details.None:Not yet available Lead(Pb-Free).Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green(RoHS&no Sb/Br):TI defines"Green"to mean"Pb-Free"and in addition,uses package materials that do not contain halogens, including bromine(Br)or antimony(Sb)above0.1%of total product weight.(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.元器件交易网IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,enhancements, improvements, and other changes to its products and services at any time and to discontinueany product or service without notice. Customers should obtain the latest relevant information before placingorders and should verify that such information is current and complete. All products are sold subject to TI’s termsand conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TIdeems necessary to support this warranty. Except where mandated by government requirements, testing of allparameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible fortheir products and applications using TI components. T o minimize the risks associated with customer productsand applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or processin which TI products or services are used. Information published by TI regarding third-party products or servicesdoes not constitute a license from TI to use such products or services or a warranty or endorsement thereof.Use of such information may require a license from a third party under the patents or other intellectual propertyof the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is withoutalteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproductionof this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable forsuch altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for thatproduct or service voids all express and any implied warranties for the associated TI product or service andis an unfair and deceptive business practice. TI is not responsible or liable for any such statements.Following are URLs where you can obtain information on other Texas Instruments products and applicationsolutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityTelephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2005, Texas Instruments Incorporated。
SNJ54ABT162827AWD中文资料
PACKAGING INFORMATIONOrderable Device Status (1)Package Type Package Drawing Pins Package Qty Eco Plan (2)Lead/Ball Finish MSL Peak Temp (3)74ABT162827ADGGRE4ACTIVE TSSOP DGG 562000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74ABT162827ADGGR ACTIVE TSSOP DGG 562000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74ABT162827ADGVR OBSOLETE TVSOP DGV 56Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74ABT162827ADL ACTIVE SSOP DL 5620Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74ABT162827ADLRACTIVESSOPDL561000Green (RoHS &no Sb/Br)CU NIPDAULevel-1-260C-UNLIM(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan -The planned eco-friendly classification:Pb-Free (RoHS)or Green (RoHS &no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green (RoHS &no Sb/Br):TI defines "Green"to mean Pb-Free (RoHS compatible),and free of Bromine (Br)and Antimony (Sb)based flame retardants (Br or Sb do not exceed 0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The informationprovided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.PACKAGE OPTION ADDENDUM5-Sep-2005Addendum-Page 1元器件交易网元器件交易网IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,enhancements, improvements, and other changes to its products and services at any time and to discontinueany product or service without notice. Customers should obtain the latest relevant information before placingorders and should verify that such information is current and complete. All products are sold subject to TI’s termsand conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TIdeems necessary to support this warranty. Except where mandated by government requirements, testing of allparameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible fortheir products and applications using TI components. T o minimize the risks associated with customer productsand applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or processin which TI products or services are used. Information published by TI regarding third-party products or servicesdoes not constitute a license from TI to use such products or services or a warranty or endorsement thereof.Use of such information may require a license from a third party under the patents or other intellectual propertyof the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is withoutalteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproductionof this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable forsuch altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for thatproduct or service voids all express and any implied warranties for the associated TI product or service andis an unfair and deceptive business practice. TI is not responsible or liable for any such statements.Following are URLs where you can obtain information on other Texas Instruments products and applicationsolutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityTelephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2005, Texas Instruments Incorporated。
SN54AHC16245或SN74AHC16245(中文说明书)
2. The package thermal impedance is calculated in accordance with JESD 51.
存取温度范围，Tstg . . . . . . . . . . . . . . . . . . .. . . . . . . . . . . . . .–65°C to 150°C
†强调上市以后在“绝对最大额定值”可能造成永久性损坏器件。这些压力等级和功能操作在这些或任何其他条件的器件之外，表明在“推荐工作条件”不是暗示。在绝对最大额定值条件下长时间可能影响器件的可靠性。
封装热阻抗，JA (看注2)：DGG封装. . . . . . . . . . . . . . . . . .89°C/W
DGV封装. . . . . . . . . .. . . . . . . . . . . . .93°C/W
DL封装. . . . . . . . . . . . . . . .. . . . . . . .94°C/W
#逻辑符号依照ANSI/IEEE Std 91-1984和IEC期刊617-12
逻辑框图（正逻辑）
到七个其他通道到七个其他通道
绝对最大额定值在工作温度范围（除非另有说明）†
电源电压范围，Vcc. . . . . .. . . . . . . . . . . . .–0.5 V to 7 V
输入电压范围（看注1）. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
SN54BCT244W中文资料
元器件交易网IMPORTANT NOTICETexas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinueany product or service without notice, and advise customers to obtain the latest version of relevant informationto verify, before placing orders, that information being relied on is current and complete. All products are soldsubject to the terms and conditions of sale supplied at the time of order acknowledgement, including thosepertaining to warranty, patent infringement, and limitation of liability.TI warrants performance of its semiconductor products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extentTI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarilyperformed, except those mandated by government requirements.CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OFDEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICALAPPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, ORWARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHERCRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TOBE FULLY AT THE CUSTOMER’S RISK.In order to minimize risks associated with the customer’s applications, adequate design and operatingsafeguards must be provided by the customer to minimize inherent or procedural hazards.TI assumes no liability for applications assistance or customer product design. TI does not warrant or representthat any license, either express or implied, is granted under any patent right, copyright, mask work right, or otherintellectual property right of TI covering or relating to any combination, machine, or process in which suchsemiconductor products or services might be or are used. TI’s publication of information regarding any thirdparty’s products or services does not constitute TI’s approval, warranty or endorsement thereof.Copyright © 1998, Texas Instruments Incorporated。
SN74LVCH16245中文资料
元器件交易网IMPORTANT NOTICETexas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinueany product or service without notice, and advise customers to obtain the latest version of relevant informationto verify, before placing orders, that information being relied on is current and complete. All products are soldsubject to the terms and conditions of sale supplied at the time of order acknowledgement, including thosepertaining to warranty, patent infringement, and limitation of liability.TI warrants performance of its semiconductor products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extentTI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarilyperformed, except those mandated by government requirements.CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OFDEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICALAPPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, ORWARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHERCRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TOBE FULLY AT THE CUSTOMER’S RISK.In order to minimize risks associated with the customer’s applications, adequate design and operatingsafeguards must be provided by the customer to minimize inherent or procedural hazards.TI assumes no liability for applications assistance or customer product design. TI does not warrant or representthat any license, either express or implied, is granted under any patent right, copyright, mask work right, or otherintellectual property right of TI covering or relating to any combination, machine, or process in which suchsemiconductor products or services might be or are used. TI’s publication of information regarding any thirdparty’s products or services does not constitute TI’s approval, warranty or endorsement thereof.Copyright © 1998, Texas Instruments Incorporated。
SN54123中文资料
PRODUCTION DATA information is current as of publication date.Products conform to specifications per the terms of Texas Instrumentsstandard warranty. Production processing does not necessarily includetesting of all parameters.1POST OFFICE BOX 655303 • DALLAS, TEXAS 752652POST OFFICE BOX 655303 • DALLAS, TEXAS 752653 POST OFFICE BOX 655303 • DALLAS, TEXAS 752654POST OFFICE BOX 655303 • DALLAS, TEXAS 752655 POST OFFICE BOX 655303 • DALLAS, TEXAS 752656POST OFFICE BOX 655303 • DALLAS, TEXAS 752657 POST OFFICE BOX 655303 • DALLAS, TEXAS 752658POST OFFICE BOX 655303 • DALLAS, TEXAS 752659 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265PACKAGING INFORMATIONOrderable Device Status (1)Package Type Package DrawingPins Package Qty Eco Plan (2)Lead/Ball FinishMSL Peak Temp (3)5962-7603901VEA ACTIVE CDIP J 161None Call TI Level-NC-NC-NC 5962-7603901VFAACTIVE CFP W 161None Call TI Level-NC-NC-NC 7603901EA ACTIVE CDIP J 161None Call TI Level-NC-NC-NC 7603901FA ACTIVE CFP W 161None Call TI Level-NC-NC-NC JM38510/01203BEA ACTIVE CDIP J 161None Call TI Level-NC-NC-NC JM38510/31401B2A ACTIVE LCCC FK 201None Call TI Level-NC-NC-NC JM38510/31401BEA ACTIVE CDIP J 161None Call TI Level-NC-NC-NC JM38510/31401BFAACTIVE CFP W 161None Call TI Level-NC-NC-NC SN54122J OBSOLETE CDIP J 14None Call TI Call TISN54123J ACTIVE CDIP J 161None Call TI Level-NC-NC-NC SN54LS123J ACTIVE CDIP J 161None Call TI Level-NC-NC-NC SN74122N OBSOLETE PDIP N 14None Call TI Call TISN74123N ACTIVE PDIP N 1625Pb-Free (RoHS)CU NIPDAU Level-NC-NC-NC SN74123N3OBSOLETE PDIP N 16None Call TI Call TISN74LS122D ACTIVE SOIC D 1450Pb-Free (RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIM SN74LS122DR ACTIVE SOIC D 142500Pb-Free (RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIM SN74LS122N ACTIVE PDIP N 1425Pb-Free (RoHS)CU NIPDAU Level-NC-NC-NC SN74LS122N3OBSOLETE PDIP N 14None Call TI Call TISN74LS122NSR ACTIVE SO NS 142000Pb-Free (RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIM SN74LS123D ACTIVE SOIC D 1640Pb-Free (RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIM SN74LS123DR ACTIVE SOIC D 162500Pb-Free (RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIM SN74LS123J OBSOLETE CDIP J 16None Call TI Call TISN74LS123N ACTIVE PDIP N 1625Pb-Free (RoHS)CU NIPDAU Level-NC-NC-NC SN74LS123N3OBSOLETE PDIP N 16None Call TI Call TISN74LS123NSR ACTIVE SO NS 162000Pb-Free (RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIM SNJ54122J OBSOLETE CDIP J 14None Call TI Call TISNJ54123J ACTIVE CDIP J 161None Call TI Level-NC-NC-NC SNJ54123W ACTIVE CFP W 161None Call TI Level-NC-NC-NC SNJ54LS123FK ACTIVE LCCC FK 201None Call TI Level-NC-NC-NC SNJ54LS123J ACTIVE CDIP J 161None Call TI Level-NC-NC-NC SNJ54LS123WACTIVECFPW161NoneCall TILevel-NC-NC-NC(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.PACKAGE OPTION ADDENDUM28-Feb-2005Addendum-Page 1元器件交易网OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan -May not be currently available -please check /productcontent for the latest availability information and additional product content details.None:Not yet available Lead (Pb-Free).Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green (RoHS &no Sb/Br):TI defines "Green"to mean "Pb-Free"and in addition,uses package materials that do not contain halogens,including bromine (Br)or antimony (Sb)above 0.1%of total product weight.(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annualbasis.PACKAGE OPTION ADDENDUM 28-Feb-2005Addendum-Page 2IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. T o minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetwork Microcontrollers Security /securityTelephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2005, Texas Instruments Incorporated。
SN54HCT04中文资料
元器件交易网IMPORTANT NOTICETexas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinueany product or service without notice, and advise customers to obtain the latest version of relevant informationto verify, before placing orders, that information being relied on is current and complete. All products are soldsubject to the terms and conditions of sale supplied at the time of order acknowledgement, including thosepertaining to warranty, patent infringement, and limitation of liability.TI warrants performance of its semiconductor products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extentTI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarilyperformed, except those mandated by government requirements.CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OFDEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICALAPPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, ORWARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHERCRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TOBE FULLY AT THE CUSTOMER’S RISK.In order to minimize risks associated with the customer’s applications, adequate design and operatingsafeguards must be provided by the customer to minimize inherent or procedural hazards.TI assumes no liability for applications assistance or customer product design. TI does not warrant or representthat any license, either express or implied, is granted under any patent right, copyright, mask work right, or otherintellectual property right of TI covering or relating to any combination, machine, or process in which suchsemiconductor products or services might be or are used. TI’s publication of information regarding any thirdparty’s products or services does not constitute TI’s approval, warranty or endorsement thereof.Copyright © 1998, Texas Instruments Incorporated。
SN54265资料
IMPORTANT NOTICETexas Instruments (TI) reserves the right to make changes to its products or to discontinue any semiconductor product or service without notice, and advises its customers to obtain the latest version of relevant information to verify, before placing orders, that the information being relied on is current.TI warrants performance of its semiconductor products and related software to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements.Certain applications using semiconductor products may involve potential risks of death, personal injury, or severe property or environmental damage (“Critical Applications”).TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED, OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES OR SYSTEMS OR OTHER CRITICAL APPLICATIONS.Inclusion of TI products in such applications is understood to be fully at the risk of the customer. Use of TI products in such applications requires the written approval of an appropriate TI officer. Questions concerning potential risk applications should be directed to TI through a local SC sales office.In order to minimize risks associated with the customer’s applications, adequate design and operating safeguards should be provided by the customer to minimize inherent or procedural hazards.TI assumes no liability for applications assistance, customer product design, software performance, or infringement of patents or services described herein. Nor does TI warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used.Copyright © 1996, Texas Instruments Incorporated。
SN54BCT541A中文资料
元器件交易网IMPORTANT NOTICETexas Instruments (TI) reserves the right to make changes to its products or to discontinue any semiconductorproduct or service without notice, and advises its customers to obtain the latest version of relevant informationto verify, before placing orders, that the information being relied on is current.TI warrants performance of its semiconductor products and related software to the specifications applicable atthe time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques areutilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of eachdevice is not necessarily performed, except those mandated by government requirements.Certain applications using semiconductor products may involve potential risks of death, personal injury, orsevere property or environmental damage (“Critical Applications”).TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED, OR WARRANTEDTO BE SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES OR SYSTEMS OR OTHERCRITICAL APPLICATIONS.Inclusion of TI products in such applications is understood to be fully at the risk of the customer. Use of TIproducts in such applications requires the written approval of an appropriate TI officer. Questions concerningpotential risk applications should be directed to TI through a local SC sales office.In order to minimize risks associated with the customer’s applications, adequate design and operatingsafeguards should be provided by the customer to minimize inherent or procedural hazards.TI assumes no liability for applications assistance, customer product design, software performance, orinfringement of patents or services described herein. Nor does TI warrant or represent that any license, eitherexpress or implied, is granted under any patent right, copyright, mask work right, or other intellectual propertyright of TI covering or relating to any combination, machine, or process in which such semiconductor productsor services might be or are used.Copyright © 1996, Texas Instruments Incorporated。
sn74lvth16245a-总线收发器
FEATURESSN54LVTH16245A...WD PACKAGESN74LVTH16245A...DGG, DGV, OR DL PACKAGE(TOP VIEW)1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 2448 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 251DIR 1B1 1B2 GND 1B3 1B4 V CC 1B5 1B6 GND 1B7 1B8 2B1 2B2 GND 2B3 2B4 V CC 2B5 2B6 GND 2B7 2B8 2DIR 1OE 1A1 1A2 GND 1A3 1A4 V CC 1A5 1A6 GND 1A7 1A8 2A1 2A2 GND 2A3 2A4 V CC 2A5 2A6 GND 2A7 2A8 2OEDESCRIPTION/ORDERING INFORMATIONSN54LVTH16245A,SN74LVTH16245A 3.3-V ABT16-BIT BUS TRANSCEIVERSWITH3-STATE OUTPUTS SCBS143R–MAY1992–REVISED NOVEMBER2006•Members of the Texas Instruments Widebus™Family•State-of-the-Art Advanced BiCMOSTechnology(ABT)Design for3.3-V Operationand Low Static-Power Dissipation•Support Mixed-Mode Signal Operation(5-VInput and Output Voltages With3.3-V V CC)•Support Unregulated Battery Operation Downto2.7V•Typical V OLP(Output Ground Bounce)<0.8Vat V CC=3.3V,T A=25°C•Distributed V CC and GND Pins MinimizeHigh-Speed Switching Noise•Flow-Through Architecture Optimizes PCBLayout•I off and Power-Up3-State Support HotInsertion•Bus Hold on Data Inputs Eliminates the Needfor External Pullup/Pulldown Resistors•Latch-Up Performance Exceeds500mA PerJESD17•ESD Protection Exceeds JESD22–2000-V Human-Body Model(A114-A)–200-V Machine Model(A115-A)The'LVTH16245A devices are16-bit(dual-octal)noninverting3-state transceivers designed for low-voltage (3.3-V)V CC operation,but with the capability to provide a TTL interface to a5-V system environment.The devices are designed for asynchronous communication between two data buses.The logic levels of the direction-control(DIR)input and the output-enable(OE)input activate either the B-port outputs or the A-port outputs or place both output ports into the high-impedance mode.The device transmits data from the A bus to the B bus when the B-port outputs are activated,and from the B bus to the A bus when the A-port outputs are activated.The input circuitry on both A and B ports is always active and must have a logic HIGH or LOW level applied to prevent excess I CC and I CCZ.Active bus-hold circuitry holds unused or undriven inputs at a valid logic e of pullup or pulldown resistors with the bus-hold circuitry is not recommended.When V CC is between0and1.5V,the devices are in the high-impedance state during power up or power down. However,to ensure the high-impedance state above1.5V,OE should be tied to V CC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.These devices are fully specified for hot-insertion applications using I off and power-up3-state.The I off circuitry disables the outputs,preventing damaging current backflow through the devices when they are powered down. The power-up3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict.Please be aware that an important notice concerning availability,standard warranty,and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.GQL OR ZQL PACKAGE(TOP VIEW)J H G F E D C B A 213465KSN54LVTH16245A ,SN74LVTH16245A 3.3-V ABT 16-BIT BUS TRANSCEIVERS WITH 3-STATE OUTPUTSSCBS143R–MAY 1992–REVISED NOVEMBER 2006ORDERING INFORMATIONT APACKAGE (1)ORDERABLE PART NUMBER TOP-SIDE MARKING FBGA –GRDSN74LVTH16245AGRDR Reel of 1000LL245AFBGA –ZRD (Pb-free)SN74LVTH16245AZRDR 74LVTH16245ADL Tube of 2574LVTH16245ADLG4SSOP –DLLVTH16245A74LVTH16245ADLR Reel of 100074LVTH16245ADLRG4–40°C to 85°CSN74LVTH16245ADGGR TSSOP –DGGReel of 200074LVTH16245ADGGRE4LVTH16245A 74LVTH16245ADGGRG4SN74LVTH16245ADGVR TVSOP –DGV Reel of 2000LL245A 74LVTH16245ADGVRE4VFBGA –GQLSN74LVTH16245AGQLR Reel of 1000LL245AVFBGA –ZQL (Pb-free)74LVTH16245AZQLR –55°C to 125°C CFP –WDTubeSNJ54LVTH16245AWDSNJ54LVTH16245AWD (1)Package drawings,standard packing quantities,thermal data,symbolization,and PCB design guidelines are available at /sc/package.TERMINAL ASSIGNMENTS (1)(56-Ball GQL/ZQL Package)123456A 1DIR NC NC NC NC 1OE B 1B21B1GND GND 1A11A2C 1B41B3V CC V CC 1A31A4D 1B61B5GNDGND1A51A6E 1B81B71A71A8F 2B12B22A22A1G 2B32B4GND GND 2A42A3H 2B52B6V CC V CC 2A62A5J 2B72B8GND GND 2A82A7K2DIRNCNCNCNC2OE(1)NC –No internal connectionGRD OR ZRD PACKAGE(TOP VIEW)JH G F E D C B A 213465To Seven Other Channels 1DIR1A11B11OETo Seven Other Channels2DIR2A12B12OESN54LVTH16245A ,SN74LVTH16245A 3.3-V ABT 16-BIT BUS TRANSCEIVERSWITH 3-STATE OUTPUTSSCBS143R–MAY 1992–REVISED NOVEMBER 2006TERMINAL ASSIGNMENTS (1)(54-Ball GRD/ZRD Package)123456A 1B1NC 1DIR 1OE NC 1A1B 1B31B2NC NC 1A21A3C 1B51B4V CC V CC 1A41A5D 1B71B6GND GND 1A61A7E 2B11B8GND GND 1A82A1F 2B32B2GND GND 2A22A3G 2B52B4V CC V CC 2A42A5H 2B72B6NC NC 2A62A7J2B8NC2DIR2OENC2A8(1)NC –No internal connectionFUNCTION TABLE (1)(EACH 8-BIT SECTION)CONTROL OUTPUT CIRCUITSINPUTS OPERATIONOE DIR A PORT B PORT L L Enabled Hi-Z B data to A bus L H Hi-Z Enabled A data to B busH XHi-ZHi-ZIsolation(1)Input circuits of the data I/Os always are active.LOGIC DIAGRAM (POSITIVE LOGIC)Absolute Maximum Ratings (1)Recommended Operating Conditions (1)SN54LVTH16245A ,SN74LVTH16245A 3.3-V ABT 16-BIT BUS TRANSCEIVERS WITH 3-STATE OUTPUTSSCBS143R–MAY 1992–REVISED NOVEMBER 2006over operating free-air temperature range (unless otherwise noted)MINMAX UNIT V CC Supply voltage range –0.5 4.6V V I Input voltage range (2)–0.57V V O Voltage range applied to any output in the high-impedance or power-off state (2)–0.57V V O Voltage range applied to any output in the high state (2)–0.5V CC +0.5V SN54LVTH16245A 96I O Current into any output in the low state mA SN74LVTH16245A 128SN54LVTH16245A 48I O Current into any output in the high state (3)mA SN74LVTH16245A 64I IK Input clamp current V I <0–50mA I OKOutput clamp currentV O <0–50mADGG package 70DGV package58θJAPackage thermal impedance (4)DL package 63°C/W GQL/ZQL package 42GRD/ZRD package36T stg Storage temperature range–65150°C (1)Stresses beyond those listed under "absolute maximum ratings"may cause permanent damage to the device.These are stress ratings only,and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions"is not implied.Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.(2)The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.(3)This current flows only when the output is in the high state and V O >V CC .(4)The package thermal impedance is calculated in accordance with JESD 51-7.SN54LVTH16245ASN74LVTH16245AUNIT MINMAX MIN MAX V CC Supply voltage 2.7 3.62.73.6V V IH High-level input voltage 22V V IL Low-level input voltage 0.80.8V V I Input voltage5.5 5.5V I OH High-level output current –24–32mA I OL Low-level output current 4864mA ∆t/∆v Input transition rise or fall rate Outputs enabled1010ns/V ∆t/∆V CC Power-up ramp rate200200µs/V T A Operating free-air temperature–55125–4085°C(1)All unused control inputs of the device must be held at V CC or GND to ensure proper device operation.Refer to the TI application report,Implications of Slow or Floating CMOS Inputs ,literature number SCBA004.Electrical CharacteristicsSN54LVTH16245A,SN74LVTH16245A 3.3-V ABT16-BIT BUS TRANSCEIVERSWITH3-STATE OUTPUTS SCBS143R–MAY1992–REVISED NOVEMBER2006over recommended operating free-air temperature range(unless otherwise noted)SN54LVTH16245A SN74LVTH16245A PARAMETER TEST CONDITIONS UNITMIN TYP(1)MAX MIN TYP(1)MAXV IK V CC=2.7V,I I=–18mA–1.2–1.2V V CC=2.7V to3.6V,I OH=–100µA V CC–0.2V CC–0.2V CC=2.7V,I OH=–8mA 2.4 2.4V OH VI OH=–24mA2V CC=3VI OH=–32mA2I OL=100µA0.20.2V CC=2.7VI OL=24mA0.50.5I OL=16mA0.40.4V OL VI OL=32mA0.50.5V CC=3VI OL=48mA0.55I OL=64mA0.55V CC=3.6V,V I=V CC or GND±1±1 Controlinputs VCC=0or3.6V,V I=5.5V1010I I V I=5.5V2020µAA or BV CC=3.6V V I=V CC55 port(2)V I=0–5–5I off V CC=0,V I or V O=0to4.5V±100µAV I=0.8V7575V CC=3VA orB V I=2V–75–75I I(hold)µAport500 V CC=3.6V,(3)V I=0to3.6V–750V CC=0to1.5V,V O=0.5V to3V,I OZPU±100(4)±100µAOE=don't careV CC=1.5V to0,V O=0.5V to3V,I OZPD±100(4)±100µAOE=don't careOutputs high0.190.19 V CC=3.6V,I CC I O=0,Outputs low55mAV I=V CC or GND Outputs disabled0.190.19V CC=3V to3.6V,One input at V CC–0.6V,∆I CC(5)0.20.2mA Other inputs at V CC or GNDC i V I=3V or044pFC io V O=3V or01010pF(1)All typical values are at V CC=3.3V,T A=25°C.(2)Unused pins at V CC or GND(3)This is the bus-hold maximum dynamic current.It is the minimum overdrive current required to switch the input from one state toanother.(4)On products compliant to MIL-PRF-38535,this parameter is not production tested.(5)This is the increase in supply current for each input that is at the specified TTL voltage level,rather than V CC or GND.Switching CharacteristicsSN54LVTH16245A ,SN74LVTH16245A 3.3-V ABT 16-BIT BUS TRANSCEIVERS WITH 3-STATE OUTPUTSSCBS143R–MAY 1992–REVISED NOVEMBER 2006over recommended operating free-air temperature range,C L =50pF (unless otherwise noted)(see Figure 1)SN54LVTH16245ASN74LVTH16245A FROM TO V CC =3.3V V CC =3.3V PARAMETERV CC =2.7V V CC =2.7V UNIT(INPUT)(OUTPUT)±0.3V ±0.3V MIN MAXMINMAX MIN TYP (1)MAX MINMAX t PLH 0.5 4.5 4.6 1.5 2.3 3.3 3.7A or B B or A ns t PHL 0.5 4.4 3.9 1.3 2.1 3.3 3.5t PZH 0.5 6.5 6.6 1.5 2.8 4.5 5.3OE A or B ns t PZL 0.5 5.4 6.2 1.6 2.9 4.6 5.2t PHZ 1 6.87 2.3 3.7 5.1 5.5OEA or Bns t PLZ 16.26.32.23.55.1 5.4t sk(LH)0.50.5ns t sk(HL)0.50.5(1)All typical values are at V CC =3.3V,T A =25°C.PARAMETER MEASUREMENT INFORMATIONFrom Output Under TestC L LOAD CIRCUITOpen Data InputTiming Input2.7 V0 V2.7 V0 V2.7 V0 VInputVOLTAGE WAVEFORMS SETUP AND HOLD TIMESVOLTAGE WAVEFORMS PROPAGATION DELAY TIMESINVERTING AND NONINVERTING OUTPUTSVOLTAGE WAVEFORMS PULSE DURATIONV OHV OHV OLV OL2.7 V0 V InputOutput ControlOutput Waveform 1S1 at 6 V (see Note B)Output Waveform 2S1 at GND (see Note B)V OLV OH 3 V0 V≈0 V2.7 VVOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLINGOutputOutputt PLH /t PHL t PLZ /t PZL t PHZ /t PZHOpen 6 V GNDTEST S1NOTES: A.C L includes probe and jig capacitance.B.Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.C.All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, Z O = 50 Ω, t r ≤ 2.5 ns, t f ≤ 2.5 ns.D.The outputs are measured one at a time, with one transition per measurement.SN54LVTH16245A ,SN74LVTH16245A 3.3-V ABT 16-BIT BUS TRANSCEIVERSWITH 3-STATE OUTPUTSSCBS143R–MAY 1992–REVISED NOVEMBER 2006Figure 1.Load Circuit and Voltage WaveformsPACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)5962-9668601QXA ACTIVE CFP WD481TBD A42N/A for Pkg Type 5962-9668601VXA ACTIVE CFP WD481TBD A42N/A for Pkg Type 74LVTH16245ADGGRE4ACTIVE TSSOP DGG482000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM74LVTH16245ADGGRG4ACTIVE TSSOP DGG482000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM74LVTH16245ADGVRE4ACTIVE TVSOP DGV482000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM74LVTH16245ADGVRG4ACTIVE TVSOP DGV482000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM74LVTH16245ADLG4ACTIVE SSOP DL4825Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM74LVTH16245ADLRG4ACTIVE SSOP DL481000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LVTH16245ADGGR ACTIVE TSSOP DGG482000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LVTH16245ADGVR ACTIVE TVSOP DGV482000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LVTH16245ADL ACTIVE SSOP DL4825Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LVTH16245ADLR ACTIVE SSOP DL481000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LVTH16245AGQLR NRND BGA MICROSTAR JUNIORGQL561000TBD SNPB Level-1-240C-UNLIMSN74LVTH16245AGRDR ACTIVE BGA MICROSTAR JUNIORGRD541000TBD SNPB Level-1-240C-UNLIMSN74LVTH16245AZQLR ACTIVE BGA MICROSTAR JUNIOR ZQL561000Green(RoHS&no Sb/Br)SNAGCU Level-1-260C-UNLIMSN74LVTH16245AZRDR ACTIVE BGA MICROSTAR JUNIOR ZRD541000Green(RoHS&no Sb/Br)SNAGCU Level-1-260C-UNLIMSNJ54LVTH16245AWD ACTIVE CFP WD481TBD A42N/A for Pkg Type(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS),Pb-Free(RoHS Exempt),or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirementsfor all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free(RoHS Exempt):This component has a RoHS exemption for either1)lead-based flip-chip solder bumps used between the die and package,or2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free(RoHS compatible)as defined above.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.OTHER QUALIFIED VERSIONS OF SN54LVTH16245A,SN54LVTH16245A-SP,SN74LVTH16245A:•Automotive:SN74LVTH16245A-Q1•Enhanced Product:SN74LVTH16245A-EPNOTE:Qualified Version Definitions:•Automotive-Q100devices qualified for high-reliability automotive applications targeting zero defects•Enhanced Product-Supports Defense,Aerospace and Medical ApplicationsTAPE AND REELINFORMATION*All dimensionsare nominalDevicePackage Type Package DrawingPins SPQReel Diameter (mm)Reel Width W1(mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant SN74LVTH16245ADGGR TSSOP DGG 482000330.024.48.615.8 1.812.024.0Q1SN74LVTH16245ADGVR TVSOP DGV 482000330.016.47.110.2 1.612.016.0Q1SN74LVTH16245ADLRSSOPDL 481000330.032.411.3516.2 3.116.032.0Q1SN74LVTH16245AGQLR BGA MICROSTA R JUNI OR GQL561000330.016.44.87.31.458.016.0Q1SN74LVTH16245AGRDR BGA MICROSTA R JUNI OR GRD 541000330.016.4 5.88.3 1.558.016.0Q1SN74LVTH16245AZQLR BGA MICROSTA R JUNI OR ZQL 561000330.016.4 4.87.3 1.458.016.0Q1SN74LVTH16245AZRDR BGA MICROSTA R JUNI ORZRD 541000330.016.4 5.88.3 1.558.016.0Q1PACKAGE MATERIALS INFORMATION1-Nov-2010*Alldimensions are nominal DevicePackage Type Package Drawing Pins SPQ Length (mm)Width (mm)Height (mm)SN74LVTH16245ADGGRTSSOP DGG 482000346.0346.041.0SN74LVTH16245ADGVRTVSOP DGV 482000346.0346.033.0SN74LVTH16245ADLR SSOP DL481000346.0346.049.0SN74LVTH16245AGQLR BGA MICROSTAR JUNIOR GQL561000346.0346.033.0SN74LVTH16245AGRDR BGA MICROSTAR JUNIOR GRD541000346.0346.033.0SN74LVTH16245AZQLR BGA MICROSTAR JUNIOR ZQL561000346.0346.033.0SN74LVTH16245AZRDR BGA MICROSTARJUNIORZRD 541000346.0346.033.0PACKAGE MATERIALS INFORMATION 1-Nov-2010Pack Materials-Page 2IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements,improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right, or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI.Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.Reproduction of this information with alteration is an unfair and deceptive business practice.TI is not responsible or liable for such altered rmation of third parties may be subject to additional restrictions.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications(such as life support)where a failure of the TI product would reasonably be expected to cause severe personal injury or death,unless officers of the parties have executed an agreement specifically governing such use.Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications,and acknowledge and agree that they are solely responsible for all legal,regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications,notwithstanding any applications-related information or support that may be provided by TI.Further,Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or"enhanced plastic."Only products designated by TI as military-grade meet military specifications.Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk,and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS16949requirements.Buyers acknowledge and agree that,if they use any non-designated products in automotive applications,TI will not be responsible for any failure to meet such requirements.Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAudio /audio Communications and Telecom /communicationsAmplifiers Computers and Peripherals /computersData Converters Consumer Electronics /consumer-appsDLP®Products Energy and Lighting /energyDSP Industrial /industrialClocks and Timers /clocks Medical /medicalInterface Security /securityLogic Space,Avionics and Defense /space-avionics-defense Power Mgmt Transportation and /automotiveAutomotiveMicrocontrollers Video and Imaging /videoRFID Wireless /wireless-appsRF/IF and ZigBee®Solutions /lprfTI E2E Community Home Page Mailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2011,Texas Instruments Incorporated。
SN54LV245A中文资料
PACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)SN74LV245ADBLE OBSOLETE SSOP DB20TBD Call TI Call TISN74LV245ADBR ACTIVE SSOP DB202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV245ADBRE4ACTIVE SSOP DB202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV245ADGVR ACTIVE TVSOP DGV202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV245ADGVRE4ACTIVE TVSOP DGV202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV245ADW ACTIVE SOIC DW2025Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV245ADWE4ACTIVE SOIC DW2025Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV245ADWR ACTIVE SOIC DW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV245ADWRE4ACTIVE SOIC DW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LV245AGQNR ACTIVE VFBGA GQN201000TBD SNPB Level-1-240C-UNLIM SN74LV245ANSR ACTIVE SO NS202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV245ANSRG4ACTIVE SO NS202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV245APW ACTIVE TSSOP PW2070Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV245APWE4ACTIVE TSSOP PW2070Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LV245APWLE OBSOLETE TSSOP PW20TBD Call TI Call TISN74LV245APWR ACTIVE TSSOP PW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV245APWRE4ACTIVE TSSOP PW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV245APWRG4ACTIVE TSSOP PW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV245APWT ACTIVE TSSOP PW20250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV245APWTE4ACTIVE TSSOP PW20250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV245ARGYR ACTIVE QFN RGY201000Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARSN74LV245ARGYRG4ACTIVE QFN RGY201000Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARSN74LV245AZQNR ACTIVE VFBGA ZQN201000Green(RoHS&no Sb/Br)SNAGCU Level-1-260C-UNLIM(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS)or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.元器件交易网元器件交易网IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,enhancements, improvements, and other changes to its products and services at any time and to discontinueany product or service without notice. Customers should obtain the latest relevant information before placingorders and should verify that such information is current and complete. All products are sold subject to TI’s termsand conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TIdeems necessary to support this warranty. Except where mandated by government requirements, testing of allparameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible fortheir products and applications using TI components. T o minimize the risks associated with customer productsand applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or processin which TI products or services are used. Information published by TI regarding third-party products or servicesdoes not constitute a license from TI to use such products or services or a warranty or endorsement thereof.Use of such information may require a license from a third party under the patents or other intellectual propertyof the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is withoutalteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproductionof this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable forsuch altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for thatproduct or service voids all express and any implied warranties for the associated TI product or service andis an unfair and deceptive business practice. TI is not responsible or liable for any such statements.Following are URLs where you can obtain information on other Texas Instruments products and applicationsolutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityTelephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2005, Texas Instruments Incorporated。
中文芯片手册SN54LVTH16244
SN54LVTH16244A, SN74LVTH16244A3.3-V ABT 16-BIT BUFFERS/DRIVERSWITH 3-STATE OUTPUTS特征•德州仪器成员Widebus™系列•先进设备，在最先进的先进的BiCMOS技术（ABT）设计为3.3-V操作和低静态功耗•支持混合模式信号操作（5-V输入和输出电压3.3-V VCC）•支持非稳压电池工作电压可低至2.7 V•典型VOLP（输出地弹跳）<0.8 V在VCC = 3.3 V，TA = 25°C•的Ioff和上电三态支持热插入•在数据输入总线保持消除了需要外部上拉/下拉电阻•闭锁性能每JESD17超过500 mA•ESD保护超过JESD22- 2000-V人体模型（A114-A）- 200-V机型号（A115-A）描述/订购信息在‘LVTH16244A设备是16位缓冲器和专为低电压（3.3 V ）的VCC操作线路驱动器，且有能力提供一个TTL接口，一个5-V系统环境。
这些设备可被用作四个4位缓冲器，两个8位缓冲器，或一个16位缓冲器。
这些器件提供了真正的输出和对称低电平有效输出使能（OE）投入。
有源总线保持电路持有未使用或无驱动输入一个有效的逻辑状态。
不推荐使用上拉或下拉电阻与总线保持电路。
当VCC之间0和1.5 V ，在开机或关机时候，该设备是在高阻抗状态。
而且为了确保上述1.5 V高阻抗状态，OE应通过上拉电阻连接到VCC;电阻器的最低值是由驱动器的电流吸收能力来确定。
这些设备使用的Ioff和上电三态热插入应用程序完全指定。
该的Ioff电路禁止输出，防止损坏电流回流通过设备时，他们断电。
上电三态电路使输出在高阻抗状态在上电和断电，防止驱动器冲突。
SN54LS245中文资料
PACKAGING INFORMATIONAddendum-Page 1(1) The marketing status values are defined as follows:ACTIVE: Product device recommended for new designs.LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check /productcontent for the latest availability information and additional product content details.TBD: The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)Addendum-Page 2(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device.(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.OTHER QUALIFIED VERSIONS OF SN54LS245, SN54LS245-SP, SN74LS245 :•Catalog: SN74LS245, SN54LS245•Military: SN54LS245•Space: SN54LS245-SPNOTE: Qualified Version Definitions:•Catalog - TI's standard catalog product•Military - QML certified for Military and Defense Applications•Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based applicationAddendum-Page 3TAPE AND REEL INFORMATION*All dimensions are nominalDevicePackage Type Package Drawing Pins SPQReel Diameter (mm)Reel Width W1(mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant SN74LS245DBR SSOP DB 202000330.016.48.27.5 2.512.016.0Q1SN74LS245DWR SOIC DW 202000330.024.410.813.0 2.712.024.0Q1SN74LS245NSRSONS202000330.024.48.213.02.512.024.0Q1*All dimensions are nominalDevice Package Type Package Drawing Pins SPQ Length(mm)Width(mm)Height(mm) SN74LS245DBR SSOP DB202000367.0367.038.0 SN74LS245DWR SOIC DW202000367.0367.045.0SN74LS245NSR SO NS202000367.0367.045.0IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,enhancements,improvements and other changes to its semiconductor products and services per JESD46,latest issue,and to discontinue any product or service per JESD48,latest issue.Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All semiconductor products(also referred to herein as“components”)are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its components to the specifications applicable at the time of sale,in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by applicable law,testing of all parameters of each component is not necessarily performed.TI assumes no liability for applications assistance or the design of Buyers’products.Buyers are responsible for their products and applications using TI components.To minimize the risks associated with Buyers’products and applications,Buyers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any patent right,copyright,mask work right,or other intellectual property right relating to any combination,machine,or process in which TI components or services are rmation published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI.Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.TI is not responsible or liable for such altered rmation of third parties may be subject to additional restrictions.Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.Buyer acknowledges and agrees that it is solely responsible for compliance with all legal,regulatory and safety-related requirements concerning its products,and any use of TI components in its applications,notwithstanding any applications-related information or support that may be provided by TI.Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures,monitor failures and their consequences,lessen the likelihood of failures that might cause harm and take appropriate remedial actions.Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications.In some cases,TI components may be promoted specifically to facilitate safety-related applications.With such components,TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements.Nonetheless,such components are subject to these terms.No TI components are authorized for use in FDA Class III(or similar life-critical medical equipment)unless authorized officers of the parties have executed a special agreement specifically governing such use.Only those TI components which TI has specifically designated as military grade or“enhanced plastic”are designed and intended for use in military/aerospace applications or environments.Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk,and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI has specifically designated certain components as meeting ISO/TS16949requirements,mainly for automotive use.In any case of use of non-designated products,TI will not be responsible for any failure to meet ISO/TS16949.Products ApplicationsAudio /audio Automotive and Transportation /automotiveAmplifiers Communications and Telecom /communicationsData Converters Computers and Peripherals /computersDLP®Products Consumer Electronics /consumer-appsDSP Energy and Lighting /energyClocks and Timers /clocks Industrial /industrialInterface Medical /medicalLogic Security /securityPower Mgmt Space,Avionics and Defense /space-avionics-defense Microcontrollers Video and Imaging /videoRFID OMAP Applications Processors /omap TI E2E Community Wireless Connectivity /wirelessconnectivityMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2014,Texas Instruments Incorporated。
74FCT16245资料
DC Output Current (Maximum Sink Current/Pin) ........................–60 to +120 mA
The CY74FCT162H245T is a 24-mA balanced output part that has bus hold on the data inputs. The device retains the input’s last state whenever the input goes to high impedance. This eliminates the need for pull-up/down resistors and prevents floating inputs.
Operating Range
Range
Ambient Temperature
Industrial
–40°C to +85°C
VCC 5V ± 10%
Notes:
1. On CY74FCT162H245T these pins have bus hold. 2. H = HIGH Voltage Level. L = LOW Voltage Level. X = Don’t Care. Z = High Impedance. 3. Operation beyond the limits set forth may impair the useful life of the device. Unless otherwise noted, these limits are over the operating free-air temperature range. 4. Unused inputs must always be connected to an appropriate logic voltage level, preferably either VCC or ground.
SN74ALVC16245中文资料
元器件交易网IMPORTANT NOTICETexas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinueany product or service without notice, and advise customers to obtain the latest version of relevant informationto verify, before placing orders, that information being relied on is current and complete. All products are soldsubject to the terms and conditions of sale supplied at the time of order acknowledgement, including thosepertaining to warranty, patent infringement, and limitation of liability.TI warrants performance of its semiconductor products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extentTI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarilyperformed, except those mandated by government requirements.CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OFDEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICALAPPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, ORWARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHERCRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TOBE FULLY AT THE CUSTOMER’S RISK.In order to minimize risks associated with the customer’s applications, adequate design and operatingsafeguards must be provided by the customer to minimize inherent or procedural hazards.TI assumes no liability for applications assistance or customer product design. TI does not warrant or representthat any license, either express or implied, is granted under any patent right, copyright, mask work right, or otherintellectual property right of TI covering or relating to any combination, machine, or process in which suchsemiconductor products or services might be or are used. TI’s publication of information regarding any thirdparty’s products or services does not constitute TI’s approval, warranty or endorsement thereof.Copyright © 1998, Texas Instruments Incorporated。
SNJ54ABT162245WD中文资料
PACKAGING INFORMATIONOrderable Device Status (1)Package Type Package Drawing Pins Package Qty Eco Plan (2)Lead/Ball FinishMSL Peak Temp (3)5962-9677401QXA ACTIVE CFP WD 481TBDCall TI Level-NC-NC-NC 74ABT162245DGGRE4ACTIVE TSSOP DGG 482000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM 74ABT162245DLRG4ACTIVE SSOP DL 481000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74ABT162245DGGR ACTIVE TSSOP DGG 482000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74ABT162245DL ACTIVE SSOP DL 4825Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74ABT162245DLR ACTIVE SSOP DL 481000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SNJ54ABT162245WDACTIVECFPWD481TBDCall TILevel-NC-NC-NC(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan -The planned eco-friendly classification:Pb-Free (RoHS)or Green (RoHS &no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green (RoHS &no Sb/Br):TI defines "Green"to mean Pb-Free (RoHS compatible),and free of Bromine (Br)and Antimony (Sb)based flame retardants(Br or Sb do not exceed 0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.PACKAGE OPTION ADDENDUM26-Sep-2005Addendum-Page 1元器件交易网元器件交易网IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,enhancements, improvements, and other changes to its products and services at any time and to discontinueany product or service without notice. Customers should obtain the latest relevant information before placingorders and should verify that such information is current and complete. All products are sold subject to TI’s termsand conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TIdeems necessary to support this warranty. Except where mandated by government requirements, testing of allparameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible fortheir products and applications using TI components. T o minimize the risks associated with customer productsand applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or processin which TI products or services are used. Information published by TI regarding third-party products or servicesdoes not constitute a license from TI to use such products or services or a warranty or endorsement thereof.Use of such information may require a license from a third party under the patents or other intellectual propertyof the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is withoutalteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproductionof this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable forsuch altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for thatproduct or service voids all express and any implied warranties for the associated TI product or service andis an unfair and deceptive business practice. TI is not responsible or liable for any such statements.Following are URLs where you can obtain information on other Texas Instruments products and applicationsolutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityTelephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2005, Texas Instruments Incorporated。
SN54ABT373资料
元器件交易网IMPORTANT NOTICETexas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinueany product or service without notice, and advise customers to obtain the latest version of relevant informationto verify, before placing orders, that information being relied on is current and complete. All products are soldsubject to the terms and conditions of sale supplied at the time of order acknowledgement, including thosepertaining to warranty, patent infringement, and limitation of liability.TI warrants performance of its semiconductor products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extentTI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarilyperformed, except those mandated by government requirements.CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OFDEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICALAPPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, ORWARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHERCRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TOBE FULLY AT THE CUSTOMER’S RISK.In order to minimize risks associated with the customer’s applications, adequate design and operatingsafeguards must be provided by the customer to minimize inherent or procedural hazards.TI assumes no liability for applications assistance or customer product design. TI does not warrant or representthat any license, either express or implied, is granted under any patent right, copyright, mask work right, or otherintellectual property right of TI covering or relating to any combination, machine, or process in which suchsemiconductor products or services might be or are used. TI’s publication of information regarding any thirdparty’s products or services does not constitute TI’s approval, warranty or endorsement thereof.Copyright © 1998, Texas Instruments Incorporated。
- 1、下载文档前请自行甄别文档内容的完整性，平台不提供额外的编辑、内容补充、找答案等附加服务。
- 2、"仅部分预览"的文档,不可在线预览部分如存在完整性等问题,可反馈申请退款(可完整预览的文档不适用该条件!)。
- 3、如文档侵犯您的权益，请联系客服反馈,我们会尽快为您处理(人工客服工作时间：9:00-18:30)。
元器件交易网
IMPORTANT NOTICE
Texas Instruments (TI) reserves the right to make changes to its products or to discontinue any semiconductor
product or service without notice, and advises its customers to obtain the latest version of relevant information
to verify, before placing orders, that the information being relied on is current.
TI warrants performance of its semiconductor products and related software to the specifications applicable at
the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are
utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each
device is not necessarily performed, except those mandated by government requirements.
Certain applications using semiconductor products may involve potential risks of death, personal injury, or
severe property or environmental damage (“Critical Applications”).
TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED, OR WARRANTED
TO BE SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES OR SYSTEMS OR OTHER
CRITICAL APPLICATIONS.
Inclusion of TI products in such applications is understood to be fully at the risk of the customer. Use of TI
products in such applications requires the written approval of an appropriate TI officer. Questions concerning
potential risk applications should be directed to TI through a local SC sales office.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards should be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance, customer product design, software performance, or
infringement of patents or services described herein. Nor does TI warrant or represent that any license, either
express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property
right of TI covering or relating to any combination, machine, or process in which such semiconductor products
or services might be or are used.
Copyright © 1996, Texas Instruments Incorporated。