HLMP-3651OBB2中文资料
BP365资料
BP 365 I-V Curves
4.5 4.0 3.5 Current (A) 3.0 2.5 2.0 1.5 1.0 0.5 0.0 0 10 20 30 Voltage (V)
t=0C t=25C t=50C t=75C
Listed by Underwriter’s Laboratories for electrical and fire safety (Class C fire rating) Approved by Factory Mutual Research in NEC Class 1, Division 2, Groups C & D hazardous locations (U)
元器件交易网
BP 365
65 Watt Photovoltaic Module
High-efficiency photovoltaic module using silicon nitride coated multicrystalline silicon cells. Performance
Diodes Construction Frame
1. Module Warranty: 25-year limited warranty of 80% power output; 12-year limited warranty of 90% power output; 5-year limited warranty of materials and workmanship. See your local representative for full terms of these warranties. 2. These data represent the performance of typical BP 365 products, and are based on measurements made in accordance with ASTM E1036 corrected to SRC (STC.) 3. During the stabilization process that occurs during the first few months of deployment, module power may decrease by up to 3% from typical Pmax.
ELM365资料
The ELM365 provides all of the logic necessary for a complete security system in an 8 pin package.The circuit is capable of monitoring two normally closed input loops and one normally open panic circuit, provides a constant level and a pulsing alarm output, and the logic to drive a status LED.Internal timers are provided for alarm blocking during zone entry and exit as well as circuit resetting, should alarms go unacknowledged.Debouncing of all of the inputs is also provided internally, to allow for the direct interfacing to mechanical switches.Due to the digital techniques employed, no external support components are required for any of the timing functions, resulting in considerable cost savings over other designs.Description•Home or cottage security systems •Auto or RV security systems•Individual zone monitoring in a multizone system •High or low limit warning alarmsApplicationsBlock Diagram•Low power CMOS design - typically 1mA at 5V •Wide supply range - 3.0 to 5.5 volt operation •Simultaneous monitoring of three circuits •45 second delay for entry and exit•Automatic reset of alarm outputs after 5 minutes •Status LED output driver•High current drive outputs - up to 25 mA •Panic input for instant triggering of the alarmFeaturesOutPOutCILoopDLoopLEDAll rights reserved. Copyright ©1999 Elm Electronics.Every effort is made to verify the accuracy of information provided in this document, but no representation or warranty can be given and no liability assumed by Elm Electronics with respect to the accuracy and/or use of any products or informationdescribed in this document. Elm Electronics will not be responsible for any patent infringements arising from the use of these products or information, and does not authorize or warrant the use of any Elm Electronics product in life support devices and/or systems. Elm Electronics reserves the right to make changes to the device(s) described in this document in order to improve reliability, function, or design.V DD (pin 1)This pin is the positive supply pin, and should always be the most positive point in the circuit.Internal circuitry connected to this pin is used to provide power on reset of the microprocessor, so an external reset signal is not required. Refer to the Electrical Characteristics section for further information.OutP (pin 2)This is the (active high) pulsed alarm output.When in an alarm state, it alternates between a logic high level (V DD ) for 1.5 seconds and a low level (V SS ) for 0.5 seconds. This output automatically resets after 5 minutes.OutC (pin 3)This is the constant level alarm output. It is switched to a high level (V DD ) during an alarm condition, and is otherwise at a logic low level.This output automatically resets to a low level after 5 minutes.panic (pin 4)This active low input is debounced and used to immediately trigger an alarm from normally open inputs such as panic pushbuttons or tamper switches. If unused, this input can be left open circuited, as there is an internal pullup resistor on the pin (see the specs).LED (pin 5)This is an active low LED drive output. It will pulse rapidly to warn that the system is in a 45second delayed alarm period, or will pulse slowly (about 1.5 seconds on, 0.5 seconds off) if an alarm is in progress or has previously occurred.By adding a suitable series resistor, an LED can be directly driven from this pin.ILoop (pin 6)This pin is used for monitoring a normally closed loop, connected between the pin and V SS . To reduce the possibility of nuisance triggers, a 0.5second debounce period is provided on this input.An alarm will be initiated immediately after the loop is determined to be open, but will not retrigger an alarm if the loop remains open, after the five minute timeout. This pin is not enabled for the first 45 seconds after the system is first turned on.DLoop (pin 7)This pin is similar to pin 6, with the one exception being that the alarm is delayed by 45 seconds to allow time for entry or exit.V SS (pin 8)Circuit common is connected to this pin. This is the most negative point in the circuit.Note:Stresses beyond those listed here will likely damage the device. These values are given as a design guideline only. The ability to operate to these levels is neither inferred nor recommended.All values are for operation at 25°C and a 5V supply, unless otherwise noted. For further information, refer to note 1 below.CharacteristicMinimumTypicalMaximum ConditionsUnitsSupply Voltage, V DD 3.0 5.05.5V V DD rate of rise0.05V/msAverage Supply Current, I DD 1.02.4mA V DD = 5V, see note 3Notes:1.This integrated circuit is produced with a Microchip Technology Inc.’s PIC12C5XX as the core embedded microcontroller. For further device specifications, and possibly clarification of those given, please refer to the appropriate Microchip documentation.2.This spec must be met in order to ensure that a correct power on reset occurs. It is quite easily achieved using most common types of supplies, but may be violated if one uses a slowly varying supply voltage, as may be obtained through direct connection to solar cells, or some charge pump circuits.3.Pullup resistor currents are not included in this figure.4.The value of the internal pullup resistance is both supply and temperature dependent.5.Times are approximate. LED output can only be reset by powering down.6.Both the OutP and OutC outputs will be internally reset after this time. If a loop continues to remain open, it will not retrigger an alarm. In contrast, the panic input will always retrigger an alarm if it remains closed.Input low voltage - reset pin V SS 0.15 V DDV Input high voltage - reset pin V DD V 0.85 V DDOutput low voltage 0.6V Output high voltageVV DD - 0.7Current (sink) = 8.7mA Current (source) = 5.4mAInternal pullup resistances300500600K ΩPanic input, see note 4see note 2203050K ΩLoop inputs, see note 4Output Pulse Duration- High1.5sec OutP and LED outputs,see note 50.5sec - Low Auto Reset Time Period 5minsee note 6Figure 1. Home Security SystemFigure 1 shows the ELM365 as the controller in a typical home security system.Series connected magnetic switches monitor door positions, and connect to the delayed loop input. Several window switches are connected in series to the instant loop input, and panic switches are provided in the bedrooms to cause an alarm when pressed.Four LEDs are included in the circuit to show power on (circuit armed), alarm, and loop status. In addition to status, these LEDs also provide loop current for switch wetting, and assist with the input pullup function.Although not essential, it is recommended that the LEDs be installed.The series resistors on pins 4, 6, and 7 have been included in this design for protection from electrostatic discharge, or induced currents. Although the circuit will function correctly without them, they are recommended for the added protection that they afford.The circuit supports two outputs, and both have been included with this design. The pulsed output drives an alarm buzzer, while the constant output can drive yard lights, etc. Both outputs use a conventional transistor circuit to energize a 12V relay coil.Power for the circuit is from an AC supplied 12V DC source, with only temporary backup provided by a 9V battery. Both inputs are diode coupled, passedPulsed OutputConstant OutputOptional 9V Backup Supply。
Towa ET-6600和Geller ET-6600操作与编程手册说明书
Setting the Terminal Number..............................................................................79
Setting the Machine Number ...............................................................................79
Character Code Table............... .........................................................13
2 Setting Up
2.1 Installing the Cash Register .......
.. ............................................................... 14
4.3 Function Programming at PI pOsition ..............................................................77
4.3.1 Setting the Basic Data..............................................................................................78
2.2 Initializing Your Cash Register .......................................................................... 14
HLMP-K101-LM002中文资料
AgilentT-13/4 (5 mm), T-1 (3 mm),High Intensity, Double Heterojunction AlGaAs Red LED LampsData SheetHLMP-D101/D105, HLMP-K101/K105DescriptionThese solid state LED lamps utilize newly developed doubleheterojunction (DH) AlGaAs/GaAs material technology. This LED material has outstanding lightoutput efficiency over a wide rangeFeatures• Exceptional brightness • Wide viewing angle• Outstanding material efficiency • Low forward voltage • CMOS/MOS compatible • TTL compatible • Deep red colorApplications• Bright ambient lighting conditions • Moving message panels • Portable equipment • General useof drive currents. The color is deep red at the dominantwavelength of 637 nanometres.These lamps may be DC or pulse driven to achieve desired light output.Package DimensionsA B CSelection GuideLuminous IntensityIv (mcd) at 20 mA2θ1/2[1]Package Package Description Device HLMP-Min.Typ.Max.Degree Outline T-1 3/4 Red Tinted Diffused D10135.270.0–65AD101-J00xx35.270.0–65AD101-JK0xx35.270.0112.865AT-1 3/4 Red Untinted Non-diffused D105138.0240.0–24BD105-M00xx138.0240.0–24BD105-NO0xx200.0290.0580.024BT-1 Red Tinted Diffused K10122.045.0–60CK101-100xx22.045.0–60CK101-IJ0xx22.045.070.460CT-1 Red Untinted Non-diffused K10535.265.0–45CK105-J00xx35.265.0–45CK105-KL0xx56.4110.0180.445CNote:1. θ1/2 is the off axis angle from lamp centerline where the luminous intensity is 1/2 the on-axis value.Part Numbering SystemHLMP - x x xx - x x x xxMechanical Option00: Bulk01: Tape & Reel, Crimped Leads02: Tape & Reel, Straight LeadsA1: Right Angle Housing, Uneven Leads, T1A2: Right Angle Housing, Even Leads, T1B1: Right Angle Housing, Uneven Leads, T-1 3/4B2: Right Angle Housing, Even Leads, T-1 3/4DD, UQ: Ammo PackColor Bin Options0: Full Color Bin DistributionMaximum Iv Bin Options0: Open (no max. limit)Others: Please refer to the Iv Bin TableMinimum Iv Bin OptionsPlease refer to the Iv Bin TableLens Type01: Tinted, Diffused05: Untinted, NondiffusedColor Options1: AlGaAs RedPackage OptionsD: T-1 3/4K: T-1Absolute Maximum Ratings at T A = 25°CParameter ValuePeak Forward Current[1,2]300 mAAverage Forward Current[2]20 mADC Current[3]30 mAPower Dissipation87 mWReverse Voltage (I R = 100 µA) 5 VTransient Forward Current (10 µs Pulse)[4]500 mALED Junction Temperature110°COperating Temperature Range-20 to +100°C Storage Temperature Range-55 to +100°C Wave Soldering Temperature [1.59 mm (0.063 in.) from body]250°C for 3 seconds Lead Solder Dipping Temperature [1.59 mm (0.063 in.) from body]260°C for 5 seconds Notes:1.Maximum I PEAK at f = 1 kHz, DF = 6.7%.2.Refer to Figure 6 to establish pulsed operating conditions.3.Derate linearly as shown in Figure 5.4.The transient peak current is the maximum non-recurring peak current the device can withstand without damaging the LED die and wire bonds. It isnot recommended that the device be operated at peak currents beyond the Absolute Maximum Peak Forward Current.Electrical/Optical Characteristics at T A = 25°CSymbol Description Min.Typ.Max.Unit Test ConditionV F Forward Voltage 1.8 2.2V I F = 20 mAV R Reverse Breakdown Voltage 5.015.0V I R = 100 µAλp Peak Wavelength645nm Measurement at Peakλd Dominant Wavelength637nm Note 1∆λ1/2Spectral Line Halfwidth20nmτS Speed of Response30ns Exponential TimeConstant, e-t/T SC Capacitance30pF V F = 0, f = 1 MHzRθJ-PIN Thermal Resistance260[3]°C/W Junction to Cathode Lead210[4]290[5]ηV Luminous Efficacy80Im/W Note 2Notes:1.The dominant wavelength, λd, is derived from the CIE chromaticity diagram and represents the color of the device.2.The radiant intensity, I e, in watts per steradian, may be found from the equation I e = l V/ηV, where I V is the luminous intensity in candelas and ηV isluminous efficacy in lumens/watt.3.HLMP-D101.4.HLMP-D105.5.HLMP-K101/-K105.Figure 3. Relative luminous intensity vs. dc forward current.Figure 4. Relative efficiency vs. peak forward current.Figure 7. Relative luminous intensity vs. angular displacement. HLMP-D101.Figure 8. Relative luminous intensity vs. angular displacement. HLMP-K101.Intensity Bin LimitsIntensity Range (mcd)Color Bin Min.Max.Red I24.839.6J39.663.4K63.4101.5L101.5162.4M162.4234.6N234.6340.0O340.0540.0P540.0850.0Q850.01200.0R1200.01700.0S1700.02400.0T2400.03400.0U3400.04900.0V4900.07100.0W7100.010200.0X10200.014800.0Y14800.021400.0Z21400.030900.0Maximum tolerance for each bin limit is ± 18%.Mechanical Option MatrixMechanical Option Code Definition00Bulk Packaging, minimum increment 500 pcs/bag01Tape & Reel, crimped leads, minimum increment 1300 pcs (T-1 3/4)/1800 pcs (T-1) 02Tape & Reel, straight leads, minimum increment 1300 pcs (T-1 3/4)/1800 pcs (T-1) A1Right Angle Housing, uneven leads, minimum increment 500 pcs/bagA2Right Angle Housing, even leads, minimum increment 500 pcs/bagB1Right Angle Housing, uneven leads, minimum increment 500 pcs/bagB2Right Angle Housing, even leads, minimum increment 500 pcs/bagDD Ammo Pack, straight leads in 2K incrementUQ Ammo Pack, horizontal leads in 2K incrementNote:All categories are established for classification of products. Products may not be available in all categories. Please contact your local Agilent representative for further clarification/information./semiconductors For product information and a complete list of distributors, please go to our web site.For technical assistance call:Americas/Canada: +1 (800) 235-0312 or (916) 788-6763Europe: +49 (0) 6441 92460China: 10800 650 0017Hong Kong: (+65) 6756 2394India, Australia, New Zealand: (+65) 6755 1939 Japan: (+81 3) 3335-8152 (Domestic/Interna-tional), or 0120-61-1280 (Domestic Only) Korea: (+65) 6755 1989Singapore, Malaysia, Vietnam, Thailand, Philippines, Indonesia: (+65) 6755 2044 Taiwan: (+65) 6755 1843Data subject to change.Copyright © 2004 Agilent Technologies, Inc. Obsoletes 5968-1440ENovember 12, 20045988-2230EN。
tobii dynavox i-系列 用户手册说明书
Tobii Dynavox I-Series 用户手册I-110用户手册Tobii Dynavox I-Series版本1.008/2017版权所有。
Copyright©Tobii AB(publ)未经出版人事先书面许可，对本出版物的任何部分不得进行复制、保存于可检索系统内，也不得以任何形式或任何途径（如电子形式、复印、录制等）传播。
所主张的版权保护包括依成文法或司法规定而受版权保护的材料和信息的所有形式和事项，包括但不限于屏幕（如屏幕显示）、菜单等显示的软件程序生成的材料。
本文档中所含信息由Tobii Dynavox专有。
未经Tobii Dynavox事先书面授权，禁止复制任何部分或全部内容。
本文档内提及的产品是其相应所有者的商标和/或注册商标。
出版商和作者不对这些商标主张权利。
尽管在本文档的编写过程中采取了各种防范措施，但出版商和作者对本文档的任何错误或遗漏概不负责，对由于使用本文档所含信息或由于使用本文档随附的程序或源代码而引致的任何损失也概不负责。
无论在何种情况下，出版商和作者对本文档直接或间接导致的实际或指称的任何利润损失或其他商业损失一概无须负责。
内容若有更改，恕不另行通知。
请访问Tobii Dynavox网站查看本文档的更新版本。
制造商：Tobii Dynavox,Karlsrovagen2D,18253Danderyd, Sweden目录内容1介绍 (5)1.1关于警示语的说明 (5)1.2符号与标志 (5)1.3预期用途 (6)1.3.1便携使用 (7)1.3.2安装使用 (7)1.4包装内容 (7)1.4.1Tobii Dynavox I-Series (7)2安全性 (9)2.1避免听力损伤 (9)2.2温度 (9)2.3电源和电池 (9)2.4支架 (10)2.5紧急情况 (10)2.6电气 (10)2.7儿童安全 (11)2.8软件 (11)2.9磁场 (11)2.10第三方 (11)2.11环境控制 (11)3I-110概述 (12)3.1主要功能 (12)3.2产品布局 (12)3.2.1端口、感应器和设备按钮 (13)3.3预装软件 (14)4Tobii Dynavox I-Series内的电池 (15)4.1电池 (15)4.2为平板电脑充电 (15)4.2.1LED行为 (15)5使用Tobii Dynavox I-Series (16)5.1启动设备 (16)5.1.1首次启动 (16)5.1.2密码信息 (16)5.1.3Discover Tobii Dynavox应用程序 (16)5.2关闭Tobii Dynavox I-Series (16)5.3省电 (17)5.3.1关闭/打开屏幕 (17)5.4使用摄像头 (17)5.5调整音量 (17)5.6调整声音 (17)6产品保养 (18)6.1温度和湿度 (18)6.1.1常规使用-工作温度 (18)6.1.2运输和储存 (18)6.2清洁 (18)6.2.1扬声器的清洁 (18)6.3放置 (18)6.4运送Tobii Dynavox I-Series设备 (18)6.5Tobii Dynavox I-Series设备的处置 (18)附录A支持、保修与培训资源 (19)A1客户支持中心 (19)A2保修 (19)A3培训资源 (19)附录B合规信息 (20)B1联邦通讯委员会(FCC)声明 (20)B1.1P15B设备 (20)B1.2便携式设备 (20)B2无线电波辐射与特定吸收率(SAR)信息 (20)B3加拿大工业部声明 (20)B4CE声明 (21)B5指令与标准 (21)附录C允许温度最大值 (22)附录D技术规格 (23)D1Tobii Dynavox I-Series设备 (23)D2Battery（电池） (23)D3电源适配器 (24)附录E批准使用的配件 (25)1介绍感谢您选购Tobii Dynavox公司的Tobii Dynavox I-Series设备！为确保获得此产品的最佳性能，请仔细阅读本手册。
海林自控动态流量平衡电动二通阀产品说明书
北京海林自控科技股份有限公司 第 1页 /共 1页 服务热线：4001010003
北京市昌平区回龙观国际信息产业基地发展路9号
网址：
动态流量平衡电动二通阀说明书
产品概述
本系列产品主要用于解决暖通空调系统中的水力失调问题，是集动态平衡和电动二通于一体的产品，特点是抗干扰能力强，控制精度高，在系统负荷波动较大的变流量系统中优势明显。
产品原理 ● 通过动态平衡功能动态平衡系统的阻力，保证设备输送介质流量在一定压差范围内不受系统压力波动影响，保持恒定。
●
根据设备的输入信号对电热式开关驱动器进行动作，实现阀的开关功能。
阀体技术参数
※流量按客户需求定制
驱动器技术参数：
安装尺寸
安装注意事项
1．注意驱动器参数，根据形式、工作电压等要求进行选择。
2．产品出厂前已经进行整机测试，应尽量避免现场拆卸及损坏驱动器。
3．预留空间以方便维护调试。
4．安装时应注意保证水流方向与阀体上箭头所指方向一致。
HLMP-KW50 T-1 高精度白LED数据表说明书
HLMP-KW50T-1 Precision Optical Performance White LEDData SheetPackage DimensionsNotes :1. All dimensions are in milimetres /inches.2. Epoxy meniscus may extend about 1mm (0.040”) down the leads.CAUTION : These devices are Class 1C ESD sensitive. Please observe appropriate precautions during handling and processing. Refer to Avago Technologies Application Note AN-1142 for additional details.NOM.DescriptionThis high intensity white LED lamp is based on InGaN material technology. A blue LED die is coated by a phosphor to produce white. The typical resulting color is described by the coordinates x = 0.27, y = 0.25 using the 1931 CIE Chromaticity Diagram.This T-1 lamp is untinted, nondiffused, and incorpo-rate precise optics which produce well defined spatial radiation patterns at specific viewing cone angle.Features• Highly Luminous White Emission • Viewing Angle : 45°Applications• Indoor Electronic Signs and Signals • Small Area Illumination • Legend Backlighting • General Purpose IndicatorsBenefit• Reduced Power Consumption, Higher Reliability, and Increased Optical/Mechanical Design Flexibility Compared to Incandescent Bulbs and Other Alternative White Light SourcesDevice Selection GuidePart Number Typical Viewing Angle Min Iv (mcd) @ 20mA Max Iv (mcd) @ 20mA Typical Chromaticity Coordinates (x,y)HLMP-KW50-QS00045°115025000.27, 0.25 Notes:1. The chromaticity coordinates are derived from the CIE 1931 Chromaticity Diagram and represent the perceived color of the device.2. θ1/2 is the off-axis angle where the luminous intensity is ½ the peak intensity.3. Tolerance for intensity bin limit is +/- 15%Absolute Maximum Ratings (T A = 25°C)Parameter Value UnitsDC Forward Current [1]30mAPeak Forward Current [2]100mAPower Dissipation111mWReverse Voltage (I R = 10μA)5VLED Junction Temperature110°COperating Temperature Range-40 to +85°CStorage Temperature Range-40 to +100°CNotes:1. Derate linearly as shown in Figure 5.2. Duty factor 10%, Frequency = 1KHz.Electrical Characteristics (T A = 25°C)Forward Voltage, V F (V) @ I F = 20 mA Reverse Breakdown,VR (V) @ I R = 10μACapacitance,C (pF), V F = 0,f = 1 MHzThermal ResistanceRθJ-PIN (°C/W)Typ.Max.Min.Typ.Typ.3.2 3.7570290WAVELENGTH –nmR E L A T I V E L U M I N O U S I N T E N S I T Y3807801.00.606805804800.40.80.201.50.3R E L A T I V E L U M I N O U S I N T EN S I T YFORWARD CURRENT -mA1.20.90.6-0.0100.02500.005-0.005Y -C O O R D I N A T E SX-COORDINATES(X,Y)VALUES @20mA REFERENCE TO (0,0)0.0150.0100.020F O R W A R D C U R R E N T -m A0FORWARD VOLTAGE -V2015353051025I F M A X .-M A X I M U M F O R W A R D C U R R E N T -m AT A -AMBIENT TEMPERATURE -C4080353010206010015255200302010Figure 1. Relative Intensity vs Wavelength Figure 2. Forward Current vs Forward VoltageFigure 3. Relative Iv vs. Forward Current Figure 4. Chromaticity shift vs. currentFigure 5. Maximum Fwd. Current vs TemperatureFigure 6. Spatial Radiation Pattern00.20.40.60.81.0SPATIAL DISPLACEMENT -DEG.R E L A T I V E I N T E N S I T YIntensity Bin Limits (mcd at 20 mA) Bin Min.Max.Q11501500R15001900S1******* Tolerance for each bin limit is ± 15%.Color Bin Limit TablesRank Limits(Chromaticity Coordinates)1xy0.3300.3600.3300.3180.3560.3510.3610.3852xy0.2870. 2950.2960.2760.3300.3180.3300.3393xy0.2640.2670.2800.2480.2960.2760.2830.3054 xy0.2830.3050.2870.2950.3300.3390.3300.360Tolerance for each color bin limit is ± 0.01Color Bin Limits with Respect to CIE 1931 Chromaticity Diagram0.260.30.340.38X-COORDINATEY-COORDINATENote:1. Bin categories are established for classification of products. Products may not be available in allbin categories. Please contact your Avago representative for information on currently availableRelative Light Output vs. Junction Temperature0.1110T J-JUNCTION TEMPERATURE-°CRELATIVELIGHTOUTPUT(NORMALIZEDATTJ=25ºC)InGaN DevicePrecautions:Lead Forming:• The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering on PC board.• For better control, it is recommended to use proper tool to precisely form and cut the leads to applicable length rather than doing it manually.• If manual lead cutting is necessary, cut the leads after the soldering process. The solder connection forms a mechanical ground which prevents mechanical stress due to lead cutting from traveling into LED package. This is highly recommended for hand solder operation, as the excess lead length also acts as small heat sink.Soldering and Handling:• Care must be taken during PCB assembly and soldering process to prevent damage to the LED component. • LED component may be effectively hand soldered to PCB. However, it is only recommended under unavoidable circumstances such as rework. The closest manual soldering distance of the soldering heat source (soldering iron’s tip) to the body is 1.59mm. Soldering the LED using soldering iron tip closer than1.59mm might damage the LED.• ESD precaution must be properly applied on the soldering station and personnel to prevent ESD damage to the LED component that is ESD sensitive. Do refer to Avago application note AN 1142 for details. The soldering iron used should have grounded tip to ensure electrostatic charge is properly grounded.• Recommended soldering condition:WaveSoldering [1, 2]Manual Solder DippingPre-heat temperature 105 °C Max.-Preheat time 60 sec Max -Peak temperature 250 °C Max.260 °C Max.Dwell time3 sec Max.5 sec MaxNote:1) Above conditions refers to measurement with thermocouple mounted at the bottom of PCB.2) It is recommended to use only bottom preheaters in order to reduce thermal stress experienced by LED.• Wave soldering parameters must be set and maintained according to the recommended temperature and dwell time. Customer is advised to perform daily check on the soldering profile to ensure that it is always conforming to recommended soldering conditions.Note: Electrical connection between bottom surface of LED die and the lead frame is achieved through conductive paste.• Any alignment fixture that is being applied during wave soldering should be loosely fitted and should not apply weight or force on LED. Non metal material is recommended as it will absorb less heat during wave soldering process.• At elevated temperature, LED is more susceptible to mechanical stress. Therefore, PCB must allowed to cool down to room temperature prior to handling, which includes removal of alignment fixture or pallet.• If PCB board contains both through hole (TH) LED and other surface mount components, it is recommended that surface mount components be soldered on the top side of the PCB. If surface mount need to be on the bottom side, these components should be soldered using reflow soldering prior to insertion the TH LED.• Recommended PC board plated through holes (PTH) size for LED component leads.LED component lead sizeDiagonalPlated through hole diameter0.45 x 0.45 mm (0.018x 0.018 inch)0.636 mm (0.025 inch)0.98 to 1.08 mm (0.039 to 0.043 inch)0.50 x 0.50 mm (0.020x 0.020 inch)0.707 mm (0.028 inch)1.05 to 1.15 mm (0.041 to 0.045 inch)• Over-sizing the PTH can lead to twisted LED after clinching. On the other hand under sizing the PTH can cause difficulty inserting the TH LED.Note:1. PCB with different size and design (component density) will have different heat mass (heat capacity). This might cause a change in temperature experienced by the board if same wave soldering setting is used. So, it is recommended to re-calibrate the soldering profile again before loading a new type of PCB.2. Avago Technologies’ high brightness LED are using high efficiency LED die with single wire bond as shown below. Customer is advised to take extra precaution during wave soldering to ensure that the maximum wave temperature does not exceed 250°C and the solder contact time does not exceeding 3sec. Over-stressing the LED during soldering process might cause premature failure to the LED due to delamination.Avago Technologies LED configurationExample of Wave Soldering Temperature Profile for TH LED25020015050TIME (MINUTES)Recommended solder:Sn63(Leaded solder alloy)SAC305(Lead free solder alloy)Flux:Rosin fluxSolder bath temperature:245°C±5°C (maximum peak temperature =250°C)Dwell time:1.5sec -3.0sec (maximum =3sec)Note:Allow for board to be sufficiently cooled to room temperature before exerting mechanical force.T E M P E R A T U R E (°C )Packaging Box for Ammo PacksNote: For InGaN device, the ammo pack packaging box contains ESD logo.Packaging Label(i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box)Acronyms and Definition:BIN:(i) Color bin only or VF bin only(Applicable for part number with color bins but without VF bin OR part number with VF bins and no color bin)OR(ii) Color bin incorporated with VF Bin(Applicable for part number that have both color bin and VF bin)(ii) Avago Baby Label (Only available on bulk packaging)Example:(i) Color bin only or VF bin only BIN: 2 (represent color bin 2 only) BIN: VB (represent VF bin “VB” only)(ii) Color bin incorporate with VF BinVB: VF bin “VB”2: Color bin 2 onlyDISCLAIMER: AVAGO’S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFAC-TURED OR AUTHORIZED FOR SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CON-STRUCTION, MAINTENANCE OR DIRECT OPERATION OF A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNEC-TION WITH SUCH USE.For product information and a complete list of distributors, please go to our web site: Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries.Data subject to change. Copyright © 00 - 008 Avago Technologies Limited. All rights reserved. Obsoletes 989- 1 EN AV0 -0 EN - April 8, 008。
Magnum Cable Tracker MS6812 用户手册说明书
MS6812Cabl e Tracker User's ManualCE IntroductionThe Magnum Cable Tracker sends a tone down a wire to identify and trace wires or cables bunched in a group without damaging insulation. With this tracker, you can find and trace non-energized electrical wires, telephone lines, data cables, alarm cables, speaker wires, coax, thermostat wires and more.Set includes a Sender (MS6812-T) with two alligator clips and an RJ11 plug, Receiver (MS6812-R), user manual and two 9 volt batteries.01Di!Functions•Test the continuity of cables or wires•Find a cable in a bunch without damaging insulation•Trace the tip and ring wires in telephone lines•Identify the status (clear, busy, ringing) of working telephone linesWarningDo not use this tracker to test energized wires. Disconnect all power before tracking wires or testing continuity. If you're not sure, consult a qualified electrician.Setting tone volumeTurn the dial on the Receiver to adjust tone volumeChanging tone settingSelect a dual alternating tone or a single solid tone with the switch inside the Sender (MS6812-T)Replacing batteriesThe Sender and Receiver are battery powered. Each requires one 9 volt battery (included). To change the batteries, open the panel on the back of either component, remove the old battery and replace it with a new one.Testing Continuity Identifying the State of Working Telephone Lines When not in use, switch the Sender to OFF and store the set in a dry,。
HLMP-CW77-RSBxx中文资料
DescriptionThese high intensity white L ED lamps are based on InGaN material technology. A blue L ED die is coated by phosphor to produce white. The typical resulting color is described by the coordinates x = 0.31, y = 0.31using the 1931 CIE Chromaticity Diagram.These T-1 ¾ lamps are untinted, diffused, and incorporate precise optics which produce well-defined spatial radiation patterns at specific viewing coneangle.HLMP-CW46, HLMP-CW47. HLMP-CW76, HLMP-CW77T-1 ¾ (5mm) Extra Bright Precision Optical Performance White LED Lamps.Data SheetFeatures •Well defined spatial radiation pattern •High luminous white emission •Viewing angle: 50° and 70°.•Standoff or non-standoff leads •Superior resistance to moistureApplications •Electronic signs and signals •Small area illumination •Legend backlighting•General purpose indicatorsBenefit•Reduced power consumption, higher reliability, and increased optical/mechanical design flexibility compared to incandescent bulbs and other alternative white light sources.Part Numbering SystemPackage Dimensions Package Dimension BPackage Dimension ANotes:1.All dimensions are in millimeters /inches.2.Epoxy meniscus may extend about 1mm (0.040") down the leads.3.If heat-sinking application is required, the terminal for heat sink is anode.Mechanical Option 00: BulkDD: Ammo Pack Straight Leads Color Bin Options0: Full color bin distribution B: Color bin 2 & 3 onlyMaximum Intensity Bin0: No maximum intensity bin limitOthers: Refer to Device Selection Guide Minimum Intensity BinRefer to Device Selection Guide Viewing Angle and Standoff Option 46: 50˚ without standoff 47: 50˚ with standoff 76: 70˚ without standoff 77: 70˚ with standoffH L M P --XX X X X XXCW DIMENSION H:50°: 11.98 ± 0.25mm (0.4715 ± 0.01 inches)70°: 11.09 ± 0.25mm (0.4365 ± 0.01 inches)Device Selection GuideNotes:1.Tolerance for luminous intensity measurement is +/- 15%2.The luminous intensity is measured on the mechanical axis of the lamp package.3.The optical axis is closely aligned with the package mechanical axis.4.2θ1/2 is the off-axis angle where the luminous intensity is ½ the on axis intensity5.Part numbers in BOLD are recommended for new designs.Part Number Typical Viewing Angle,2θ ½ (Degree)Intensity (mcd) at 20 MA Standoff Package Dimension Min.Max.HLMP-CW46-PS0xx 508802500No A HLMP-CW46-QR0xx 5011501900No A HLMP-CW46-QRBxx 5011501900No A HLMP-CW46-RU0xx 5015004200No A HLMP-CW46-ST0xx 5019003200No A HLMP-CW46-STBxx 5019003200No A HLMP-CW47-PS0xx 508802500Yes B HLMP-CW47-QR0xx 5011501900Yes B HLMP-CW47-QRBxx 5011501900Yes B HLMP-CW47-RU0xx 5015004200Yes B HLMP-CW47-ST0xx 5019003200Yes B HLMP-CW47-STBxx 5019003200Yes B HLMP-CW76-NR0xx 706801900No A HLMP-CW76-PQ0xx 708801500No A HLMP-CW76-PQBxx 708801500No A HLMP-CW76-QT0xx 7011503200No A HLMP-CW76-RS0xx 7015002500No A HLMP-CW76-RSBxx 7015002500No A HLMP-CW77-NR0xx 706801900Yes B HLMP-CW77-PQ0xx 708801500Yes B HLMP-CW77-PQBxx 708801500Yes B HLMP-CW77-QT0xx 7011503200Yes B HLMP-CW77-RS0xx 7015002500Yes B HLMP-CW77-RSBxx7015002500YesBAMBIENT TEMPERATURE - ˚CI F - F O R W A R D C U R R E N T - m AFigure 3. Relative Intensity versus DC Forward CurrentFigure 1. Relative Intensity vs. WavelengthFigure 2. Forward Current vs. Ambient TemperatureElectrical/Optical Characteristics T A = 25o CNotes:1.The reverse voltage of the product is equivalent to the forward voltage of the protective chip at I R = 10 µA2.The chromaticity coordinates are derived from the CIE 1931 Chromaticity Diagram and represent the perceived color of the device.Parameters Symbol Min Typ Max Units Test Condition Forward voltage V F 3.2 4.0V I F = 20 mA Reverse Voltage [1]V R 5.0VI R = 10 µAThermal resistance R θJ-PIN 240oC/WLED Junction to anode lead Chromaticity Coordinates [2]X Y 0.310.31I F = 20 mA CapacitanceC70V F =0, f=1MHz0.00.20.40.60.81.0380480580680780WAVELENGTH - nmR E L A T I V E L U M I N O U S I N T E N S I T Y0.30.60.91.21.50102030FORWARD CURRENT - mAR E L A T I V E L U M I N O U S I N T E N S I T YNotes:1.Derate linearly as shown in figure2.2.Duty factor 10%, frequency 1KHzAbsolute Maximum Rating at T A = 25o CParameters Value Unit DC forward current [1]30mA Peak pulsed forward current [2]100mA Power dissipation 105mWLED junction temperature 110o C Operating temperature range -40 to +85o C Storage temperature range-40 to +100oCIntensity Bin Limit TableFigure 7. Spatial Radiation P attern for CW7xBin Intensity (mcd) at 20 mAMin Max N 680880P 8801150Q 11501500R15001900S 19002500T25003200U 32004200Figure 4. Chromaticity shift vs. Current *Note: (x,y) values @ 20mA reference to (0,0)Figure 5. Forward Current vs. Forward VoltageFigure 6. Spatial Radiation P attern for CW4x510152025302.0 2.2 2.4 2.6 2.83.0 3.2 3.4 3.6V F - FORWARD VOLTAGE - VOLTSI F - F O R W A R D C U R R E N T - mAX-COORDINATESY -C O O R D I N A T E S00.51-90-60-300306090ANGULAR DISPLACEMENT (˚)R E L A T I V E L U M I N O U S I N T E N S I TY00.51-90-60-30306090ANGULAR DISPLACEMENT (˚)R E L A T I V E L U M I N O U S I N T E N S I T YTolerance for each bin limit is ± 15%Color Bin Limit TableNote:1.Bin categories are established for classification of products. Products may not be availablein all bin categories. Please contact your Avago Technologies representative for information on currently available bins.Color Bin Limits with Respect to CIE 1931 Chromaticity DiagramRank Limits (Chromaticity Coordinates)1X0.3300.3300.3560.361 Y0.3600.3180.3510.385 2X0.2870.2960.3300.330 Y0.2950.2760.3180.339 3X0.2640.2800.2960.283 Y0.2670.2480.2760.305 4X0.2830.2870.3300.330 Y0.3050.2950.3390.360Y-COORDINATEX-COORDINATETolerance for each bin limit is ± 0.01Wave Soldering Manual SolderDippingPre-heat temperature 105 °C Max.−Preheat time 30 sec Max −Peak temperature 250 °C Max.260 °C Max.Dwell time3 sec Max.5 sec MaxBOTTOM SIDE OF PC BOARDTOP SIDE OF PC BOARDNOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED BEFORE EXERTING MECHANICAL FORCE.CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)PREHEAT SETTING = 150 C (100 C PCB)SOLDER WAVE TEMPERATURE = 245 C AIR KNIFE AIR TEMPERATURE = 390 C AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)AIR KNIFE ANGLE = 40SOLDER: SN63; FLUX: RMA 250200150TIME - SECONDST E M P E R A T U R E - ˚C1005030102030405060708090100LED component ead sizeDiagonal Plated through hole diameter 0.457 x 0.457mm (0.018 x 0.018inch)0.646 mm (0.025 inch)0.976 to 1.078 mm (0.038 to 0.042 inch)0.508 x 0.508mm (0.020 x 0.020inch)0.718 mm (0.028 inch)1.049 to 1.150mm (0.041 to 0.045 inch)Precautions:Lead Forming:•The leads of an L ED lamp may be preformed or cut to length prior to insertion and soldering into PC board.•If lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress induced to LED package. Otherwise, cut the leads of LED to length after soldering process at room temperature. The solder joint formed will absorb the mechanical stress of the lead cutting from traveling to the L ED chip die attach and wirebond.•It is recommended that tooling made to precisely form and cut the leads to length rather than rely upon hand operation.Soldering Condition:•Care must be taken during PCB assembly and soldering process to prevent damage to LED component.•The closest LED is allowed to solder on board is 1.59mm below the body (encapsulant epoxy) for those parts without standoff.•Recommended soldering condition:Recommended Wave Soldering ProfileNote: Refer to application note AN1027 for more information on soldering LED components.•Wave soldering parameter must be set and maintain according to recommended temperature and dwell time in the solder wave. Customer is advised to periodically check on the soldering profile to ensure the soldering profile used is always conforming to recommended soldering condition.•If necessary, use fixture to hold the L ED component in proper orientation with respect to the PCB during soldering process.•Proper handling is imperative to avoid excessive thermal stresses to LED components when heated. Therefore, the soldered PCB must be allowed to cool to room temperature, 25°C before handling.•Special attention must be given to board fabrication,solder masking, surface plating and lead holes size and component orientation to assure solderability.•Recommended PC board plated through holes size for LED component leads.For product information and a complete list of distributors, please go to our web site: Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited in the United States and other countries. Data subject to change. Copyright © 2006 Avago Technologies Pte. All rights reserved.5989-1431EN - May 29, 2006。
HLMP资料
HLMP资料元器件交易网T-13/4 (5 mm) Precision OpticalPerformance AlInGaP LEDLampsData SheetFeaturesWell Defined SpatialRadiation PatternsViewing Angles: 6°, 15°,23°, 30°High Luminous Output Colors:590 nm Amber605 nm Orange615 nm Reddish-Orange626 nm RedHigh OperatingTemperature:TJLED=+130°CSuperior Resistance toMoisturePackage Options:With or Without Lead Stand-OffsBenefitsViewing Angles MatchTraffic Management SignRequirementsColors Meet Automotive andPedestrian SignalSpecificationsSuperior Performance inOutdoor Environments Suitable for Autoinsertiononto PC BoardsApplicationsTraffic Management:Traffic SignalsPedestrian SignalsWork Zone Warning LightsVariable Message Signs Commercial OutdoorAdvertising:SignsMarquees Automotive:Exterior and Interior LightsDescriptionThese Precision Optical Perform-ance AlInGaP LEDs providesuperior light output for excellentreadability in sunlight andareextremely reliable. AlInGaP LEDtechnology provides extremelystable light output over longperiods of time. Precision OpticalPerformance lamps utilize thealuminum indium gallium phos-phide (AlInGaP) technology.These LED lamps are untinted,nondiffused, T-13/4 packagesincorporating second generationoptics producing well definedspatial radiation patterns atspecific viewing cone angles.SunPower SeriesHLMP-ELxxHLMP-EJxxHLMP-EHxxHLMP-EGxx These lamps are made with anadvanced optical grade epoxy,offering superior high tempera-ture and high moisture resistanceperformance in outdoor signaland sign applications. The highmaximum LED junction tempera-ture limit of +130°C enables hightemperature operation in brightsunlight conditions. The packageepoxy contains both uv-a anduv-b inhibitors to reduce theeffects of long term exposure todirect sunlight.These lamps are available in twopackage options to give thedesigner flexibility with devicemounting.Device Selection GuideTypicalViewingAngle2θ1/2(Deg.)Color andDominantWavelength(nm), Typ.LuminousIntensity Iv (mcd) [1,2]@ 20 mAMin.Max.***-********-*****3600HLMP-EL10-WZ000***-********-********-*****6200HLMP-EL10-X1000HLMP-EJ10-*****MP-EJ10-X1000HLMP-EJ10-Y2000HLMP-EH10-*****MP-EH10-*****MP-EH10-*****MP-EH10-X1000HLMP-EH10-Y2000HLMP-EG10-*****MP-EG10-*****MP-EG10-X1000***-********-********-********-********-********-********-*****8000HLMP-EG10-Y20008000********-*****0**********8400********-*****0*************-*****0********-*****08300*****4100*****1000Lamps Without Standoffson Leads(Outline Drawing A)HLMP-EL08-*****MP-EL08-VYK00*HLMP-EL08-VXK00*HLMP-EL08-VX400**HLMP-EL08-*****MP-EL08-*****MP-EL08-XZ400**Lamps With Standoffson Leads(Outline Drawing B)HLMP-EL10-VY000Amber 590HLMP-EL08-*****MP-EL08-XZK00*HLMP-EL08-*****MP-EL08-XYK00*HLMP-EL08-X1K00*HLMP-EL08-X1000 6°Orange 605HLMP-EJ08-*****MP-EJ08-X1000HLMP-EJ08-Y2000HLMP-EH08-*****MP-EH08-VY000Red-Orange 615HLMP-EH08-*****MP-EH08-X1000HLMP-EH08-Y2000HLMP-EG08-*****MP-EG08-*****MP-EG08-WZ000Red 626HLMP-EG08-X1000HLMP-EG08-*****MP-EG08-Y1000HLMP-EG08-Y2000Notes:1. The luminous intensity is measured on the mechanical axis ofthe lamp package.2. The optical axis is closely aligned with the package mechanical axis.3. The dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the color of the lamp.4. θ1/2 is the off-axis angle where the luminous intensity is one half the on-axis intensity.5.The intensity of narrow viewing angle lamps is measured at the intensity peak.Part numbers in bold are recommended for new designs.*HLMP-xLxx-xxK00 are selected to amber color bins 2 and 4 only.**HLMP-xLxx-xx400 are selected to amber color bin 4 only.Device Selection Guide (Continued)TypicalViewingAngle2θ1/2(Deg.)Color andDominantWavelength(nm), Typ.Lamps Without Standoffson Leads(Outline Drawing A)HLMP-EL15-*****MP-EL15-*****MP-EL15-QRK00*HLMP-EL15-QS000Amber 590HLMP-EL15-QS400**HLMP-EL15-QSK00*HLMP-EL15-QT00015°HLMP-EL15-QTK00*HLMP-EL15-*****MP-EJ15-PS000Orange 605Red-Orange 615HLMP-EJ15-*****MP-EJ15-*****MP-EH15-*****MP-EH15-*****MP-EG15-PS000Red 626HLMP-EG15-*****MP-EG15-*****MP-EL24-*****MP-EL24-*****MP-EL24-*****MP-EL24-PSK00*HLMP-EL24-PR400**HLMP-EL24-PQK00*Amber 59023°HLMP-EL24-*****MP-EL24-QRK00*HLMP-EL24-*****MP-EL24-QSK00*HLMP-EL24-QS400**HLMP-EL24-*****MP-EL24-QTK00* HLMP-EL26-*****MP-EL26-*****MP-EL26-*****MP-EG17-*****MP-EG17-*****MP-EJ17-*****MP-EJ17-*****MP-EH17-*****MP-EH17-*****MP-EL17-*****MP-EL17-QT000Lamps With Standoffson Leads(Outline Drawing B)HLMP-EL17-PS000LuminousIntensity Iv (mcd) [1,2]@ 20 mAMin.Max.***-********-********-********-******************-*************-********-********-********-********-********-********-********-********-********-********-********-********-*****4800********-*****0********-********-*****03700 Notes:1. The luminous intensity is measured on the mechanical axis of the lamp package.2. The optical axis is closely aligned with the package mechanical axis.3. The dominant wav elength, λd, is derived from the CIE Chromaticity Diagram and represents the color of the lamp.4. θ1/2 is the off-axis angle where the luminous intensity is one half the on-axis intensity.5.The intensity of narrow viewing angle lamps is measured at the intensity peak.Part numbers in bold are recommended for new designs.*HLMP-xLxx-xxK00 are selected to amber color bins 2 and 4 only.**HLMP-xLxx-xx400 are selected to amber color bin 4 only.Device Selection Guide (Continued)TypicalViewingAngle2θ1/2(Deg.)Color andDominantWavelength(nm), Typ.Orange 605Lamps Without Standoffson Leads(Outline Drawing A)HLMP-EJ24-*****MP-EJ24-RU000Red-Orange 61523Red 626HLMP-EH24-*****MP-EH24-*****MP-EG24-*****MP-EG24-*****MP-EG24-*****MP-EL30-*****MP-EL30-*****MP-EL30-*****MP-EL30-PQK00*Amber 590HLMP-EL30-*****MP-EL30-PR400**HLMP-EL30-PRK00*HLMP-EL30-*****MP-EL30-PSK00*30°Orange 605HLMP-EJ30-*****MP-EJ30-*****MP-EJ30-*****MP-EH30-MQ000Red-Orange 615HLMP-EH30-*****MP-EH30-*****MP-EG30-*****MP-EG30-*****MP-EG30-NQ000Red 626HLMP-EG30-*****MP-EG30-*****MP-EG30-*****MP-EG30-PS000HLMP-EG32-*****MP-EG32-*****MP-EG32-*****MP-EJ32-*****MP-EJ32-*****MP-EH32-*****MP-EH32-*****MP-EH32-*****MP-EL32-PS000Lamps With Standoffson Leads(Outline Drawing B)HLMP-EJ26-*****MP-EJ26-*****MP-EH26-*****MP-EH26-*****MP-EH26-*****MP-EG26-*****MP-EG26-*****MP-EG26-*****MP-EL32-*****MP-EL32-NR000LuminousIntensity Iv (mcd) [1,2]@ 20 mAMin.Max.1000******************-********-********-********-********-********-********-*****765***-********-********-********-**********0********-*****02900*****0*****01010*****0*****0Notes:1. The luminous intensity is measured on the mechanical axis of the lamp package.2. The optical axis is closely aligned with the package mechanical axis.3. The dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the color of the lamp.4. θ1/2 is the off-axis angle where the luminous intensity is one half the on-axis intensity.5.The intensity of narrow viewing angle lamps is measured at the intensity peak.Part numbers in bold are recommended for new designs.*HLMP-xLxx-xxK00 are selected to amber color bins 2 and 4 only.**HLMP-xLxx-xx400 are selected to amber color bin 4 only.Part Numbering SystemHLMP--xxMechanical Options00: Bulk PackagingDD: Ammo Pack YY: Flexi-Bin; Bulk PackagingZZ: Flexi-Bin; Ammo PackColor Bin Selections0: No color bin limitation4: Amber color bin 4 only K: Amber color bins 2 and 4 onlyMaximum Intensity Bin0: No Iv bin limitationMinimum Intensity BinViewing Angle Lead Stand Offs08: 6 deg without lead stand offs10: 6 deg with lead stand offs15: 15 deg without lead stand offs17: 15 deg with lead standoffs24: 23 deg without lead stand offs26: 23 deg with lead stand offs30: 30 deg without lead stand offs32: 30 deg with lead stand offsColorG: 626 nm RedH: 615 nm Red-OrangeJ: 605 nm OrangeL: 590 nm AmberPackageE: 5 mm RoundPackage DimensionsAB(0.039)(0.039)NOTES:1. ALL *****ONS ARE IN *****TERS (INCHES).2. LEADS ARE MILD STEEL, SOLDER DIPPED.3. TAPERS SHOWN AT TOP OF LEADS (BOTTOM OF LAMP *****) *****E AN EPOXY *****S THAT MAY EXTEND ABOUT 1 mm (0.040 in.) DOWN THE LEADS.4. *****NDED PC BOARD HOLE *****RS: LAMP ***** A ***** STAND-OFFS: FLUSH *****G AT BASE OF LAMP ***** = 1.143/1.067 (0.044/0.042).LAMP ***** B WITH STAND-OFFS: *****G AT LEAD STAND-OFFS = 0.965/0.889 (0.038/0.035).5. FOR DOME ***** ABOVE LEAD STAND-OFF ***** PLANE, d, LAMP ***** B, SEE TABLE.PART NO.HLMP-XX10HLMP-XX26HLMP-XX32d12.37 ± 0.25 (0.487 ± 0.010)(0.489 ± 0.010)12.52 ± 0.25 (0.493 ± 0.010)11.96 ± 0.25 (0.471 ± 0.010)Absolute Maximum Ratings at TA = 25°CDC Forward Current[1,2,3] (50)mAPeak Pulsed Forward Current[2,3] (100)mAAverage Forward Current (30)mAReverse Voltage (IR = 100 A).........................................................5 VLED Junction Temperature..........................................................130°COperating Temperature..............................................-40°C to +100°CStorage Temperature..................................................-40°C to +120°CDip/Drag Soldering Temperature...........................260°C for 6 secondsThrough-the-Wave Preheat Temperature......................................145°CThrough-the-Wave Solder Temperature.................245°C for 3 seconds[1.59 mm (0.060 in.) below seating plane]Notes:1. Derate linearly as shown in Figure 4.2. For long term performance with minimal light output degradation, drive currentsbetween 10 mA and 30 mA are recommended. For more information on recommendeddrive conditions, please refer to Application Brief I-024 (5966-3087E).3. Operating at currents below 1 mA is not recommended. Please contact your localrepresentative for further information.Electrical/Optical Characteristics at TA = 25°CParameterForward VoltageAmber (λd = 590 nm)Orange (λd = 605 nm)Red-Orange (λd = 615 nm)Red (λd = 626 nm)Reverse VoltagePeak Wavelength:Amber (λd = 590 nm)Orange (λd = 605 nm)Red-Orange (λd = 615 nm)Red (λd = 626 nm)Spectral Halfwidth SymbolMin.Typ.2.021.981.941.***-********-*****17Max.UnitsTest ConditionsIF = 20 mAVFVRλPEAK λ1/252.4VVnmIF = 100 APeak of Wavelength ofSpectral Distributionat IF = 20 mAWavelength Width atSpectral Distribution1/2 Power Point atIF = 20 mAExponential TimeConstant, e-t/τsVF = 0, f = 1 MHzLED Junction-to-CathodeLeadEmitted LuminousPower/Emitted RadiantPowernmSpeed of ResponseCapacitanceThermal ResistanceLuminous EfficacyAmber (λd = 590 nm)Orange (λd = 605 nm)Red-Orange (λd = 615 nm)Red (λd = 626 nm)τsCRθJ-PIN***-*****nspF°C/Wηv***-*****0150lm/WNote:1. The radiant intensity, Ie, in watts per steradian, may be found from the equation Ie = Iv/ηv, where Iv is the luminous intensity incandelas and ηv is the luminous efficacy in lumens/watt.*****E *****TYCURRENT C mA*****GTH C nmVF C ***** ***** C VFigure 1. Relative Intensity vs. Peak Wavelength.Figure 2. Forward Current vs.Forward Voltage.3.0*****E *****S *****TY(*****ZED AT 20 mA)2.52.01.51.00.50IF C ***** ***** C mA***-*****IF C DC ***** ***** C mATA C ***** *****TURE C °CFigure 3. Relative Luminous Intensityvs. Forward Current.Figure 4. Maximum Forward Currentvs. Ambient Temperature. DeratingBased on TJMAX = 130°C.**********E *****TY C %***-********-*****0-25-20-15-10-55101520θ C ***** *****EMENT C *****Figure 5. Representative Spatial Radiation Pattern for 6° ViewingAngle Lamps.元器件交易网*****%80C *****60ETN50I *****30LER*****-25-20-15-10-5510152025θ C ***** *****EMENT C *****Figure 6. Representative Spatial Radiation Pattern for 15° ViewingAngle Lamps.*****%80C *****60ETN50I *****30LER*****-25-20-15-10-55101520θ C ***** *****EMENT C *****Figure 7. Representative Spatial Radiation Pattern for 23° ViewingAngle Lamps.*****%80C *****60ETN50I *****30LER*****-25-20-15-10-5510152025θ C ***** *****EMENT C *****Figure 8. Representative Spatial Radiation Pattern for 30° ViewingAngle Lamps.Intensity Bin Limits(mcd at 20 mA)BinNameMin.Max.K*****L*****M*****N*****P***-*****Q***-*****R***-*****S***-*****T***-*****U***-*****V***-*****W***-*****X***-*****Y***-*****0Z*************** **********Tolerance for each bin limit is ± 15%.Amber Color Bin Limits(nm at 20 mA)BinNameMin.Max.1584.5587.02587.0589.*****.5592.06592.0594.5Tolerance for each bin limit is± 0.5 nm.Note:1.Bin categories are established forclassification of products. Productsmay not be available in all bincategories.元器件交易网Data subject to change.Copyright 2001 Agilent Technologies, Inc.August 13, 2001Obsoletes 5968-4744E (11/99)5988-0524EN。
力科产品手册说明书
力科产品手册关注我们，了解更多信息:LabMaster 10 Zi-A (SDA Models)WaveMaster 8 Zi-B (SDA/DDA 8 Zi-B)带宽20 GHz to 65 GHz 4 GHz to 30 GHz 分辨率8-bit resolution,11-bit with enhanced resolution8-bit resolution,11-bit with enhanced resolution上升时间 6.5 ps to 19.3 ps15.5 ps to 95 ps通道(模拟+数字)Up to 80, 80 + 184, 4 + 18显示15.3" WXGA Touch Screen15.3" WXGA Touch Screen标配存储深度32 Mpts/Ch (64 Mpts/Ch)32 Mpts/Ch (64 Mpts/Ch)最大存储深度†Up to 1024 Mpts Up to 512 Mpts 采样率Up to 160 GS/sUp to 80 GS/sMSO 特性†(数字通道) 3 GHz, 12.5 GS/s,18 Ch3 GHz, 12.5 GS/s,18 Ch触发类型Edge, Width, Glitch, Pattern, Runt, Slew Rate,Interval (Period), Dropout, Qualified, Cascade (Sequence) Trigger,High-speed Serial Trigger †Edge, Width, Glitch, Pattern, Video, HDTV,Runt, Slew Rate, Interval (Period), Dropout, Qualified, Cascade(Sequence) Trigger, High-speed Serial Trigger †串行数据† 触发 (T) 解码 (D)测量/图形 (M)眼图 (E)仅图形 (G)物理层 (P)TD: 80-bit NRZ, 8b/10b, 64b/66b D: 64b66b, 8b/10b, ARINC 429, Audio,CAN, CAN FD, CAN FD Symbolic, DigRF 3G, DigRF v4,ENET, ENET 10G, Fibre Channel, I 2C , LIN,Manchester, MDIO, MIL-STD-1553, NRZ, PCIe, RS-232. SAS, SATA,SENT, SpaceWire, SPI, UART, UniPro, USB 1.0/1.1/2.0,USB 3.2 (Gen1, Gen2, Gen2x2)DP : D-PHY, Fibre Channel, FlexRay, M-PHYDG: AudioTD: 80-bit NRZ, 8b/10b, 64b/66b, RS-232, UARTTD or TDME: 100Base-T1, CAN, CAN FD, CAN FD Symbolic,I 2C , LIN, MIL-STD-1553, SPI,TD or TDxx: Audio (TDG), FlexRay (TDMP)D: DigRF 3G, DigRF v4, ENET, ENET 10G, Fibre Channel,Manchester, MDIO, NRZ, PCIe, SAS, SATA, SENT, SpaceWire, SPMI,UniPro, USB 2.0-HSIC, USB 3.2 (Gen1, Gen2, Gen2x2),64b / 66b, 8b/10b DP : D-PHY, M-PHYDME: ARINC 429, USB 1.0/1.1/2.0串行数据分析Eye Jitter and Noise Analysis (SDAIII-CompleteLINQ), Virtual Probe, Eye Doctor II, PAM4 Signal Analysis, Serial Data Mask,Cable De-Embedding串行数据一致性测试DDR 3/4/5, LPDDR 3/4/5, DisplayPort 1.4, eDP , Automotive Ethernet 100Base-T1, 1000Base-T1 Ethernet 10GBase-T, 10GBase-KR, HDMI 2.1/2.0/1.4b, MIPI M-PHY, PAM4-56G, PCI Express 1.0/2.0/3.0/4.0/5.0, SAS 2/3, SATA, SFI, USB 3.2 (Gen1, Gen2, Gen2x2), USB4/TBT4DDR 2/3/4/5, LPDDR 2/3/4/5, DisplayPort 1.4, eDP , Automotive Ethernet 10Base-T1S, 100Base-T1, 1000Base-T1,Ethernet 10/100/1000Base-T, Ethernet 10GBase-T, 10GBase-KR, HDMI 2.1/2.0/1.4b, MIPI D-PHY, MIPI M-PHY, MOST 50/150, PAM4-56G, PCI Express 1.0/2.0/3.0, SAS 2/3, SATA, SFI,USB 1.1/2.0, USB 3.2 (Gen1, Gen2, Gen2x2), USB4/TBT4应用软件选项Spectrum Analyzer (Single, Dual+Reference), Clock and Clock-Data Jitter Analysis, Automotive Ethernet Debug, CrossSync PHY, DDR Debug Toolkit, Switch-mode Power Supply and Device Analysis, Advanced Customization (Standard with LabMaster 10 Zi-A),EMC Pulse Parameters, Digital Filter Package, Protocol Analyzer Synch (ProtoSync), Advanced Vector Signal Analysis, Vector Signal Analysis, Advanced Optical Recording, Disk Drive Analysis, Disk Drive Measurements, Coherent Optical Analysis,Electrical Telecom Pulse Mask Test外设接口USB Host for Storage, LAN for PC, LXI for PC, GPIB for PC †函数+, -, x, /, FFT, Absolute Value, Average, Copy, Correlation, Derivative, Deskew, Envelope, Enhanced Resolution, Exponent, Floor, Histogram, Integral, Invert, Log, Phistogram, Ptrace Mean, Ptrace Range, Ptrace Sigma, Reciprocal, Rescale, Roof,Segment, Sparse, Square, Square Root, Track, Trend, Zoom尺寸 (HWD)MCM-Zi-A: 277 x 462 x 396 mm(10.9” x 18.2” x 15.6”)LabMaster 10-xxZi Acq. Module:202 x 462 x 660 mm (8.0” x 18.2” x 26”)355 x 467 x 406 mm (14” x 18.4” x 16” )重量MCM-Zi-A: 47 lbs. (21.4 kg)LabMaster 10-xxZi-A Acq. Module - 58 lbs. (24 kg)58 lbs. (26.4 kg)保修3 yr3 yrWavePro HD WaveRunner 8000HD/MDA 8000HDWaveRunner 9000/9000-MS带宽 2.5 GHz to 8 GHz 350 MHz to 2 GHz 500 MHz to 4 GHz 分辨率12-bit resolution,15-bit with enhanced resolution12-bit resolution,15-bit with enhanced resolution8-bit resolution,11-bit with enhanced resolution上升时间57.5 ps to 166 ps1 ns to 235 ps700 ps to 100 ps通道(模拟+数字)4, 4 + 168, 8 + 164, 4 + 16显示15.6” Widescreen Capacitive Touch Screen15.6” Widescreen Capacitive Touch Screen15.4” WXGA Multi-Touch Screen 标配存储深度50 Mpts/Ch 100 Mpts Interleaved50 Mpts/Ch100 / 200 Mpts Interleaved16 Mpts/Ch; M Models: 64 Mpts/Ch32 Mpts Interleaved; M Models: 128 Mpts 最大存储深度†Up to 5 Gpts Up to 5 Gpts Up to 128 Mpts 采样率Up to 20 GS/sUp 10 GS/sUp to 20 GS/s; M Models: Up to 40 GS/s MSO 特性†(数字通道)250 MHz, 1.25 GS/s16 Ch500 MHz, 2.5 GS/s16 Ch250 MHz, 1.25 GS/s,16 Ch触发类型Edge, Width, Glitch, Pattern, Runt, Slew Rate,Interval (Period), Dropout, Qualified,Edge, Width, Glitch, Pattern, Runt, Slew Rate, Interval (Period), Dropout, Qualified,Measurement, WindowEdge, Width, Glitch, Pattern, Video, HDTV, Runt, Timeout, Slew Rate, Interval (Period), Dropout, Qualified, Measurement, Window,Cascade 串行数据† 触发 (T) 解码 (D)测量/图形 (M)眼图 (E)仅图形 (G)物理层 (P)TD or TDME: 100Base-T1, CAN, CAN FD,CAN FD Symbolic, SPMI, I 3C, I 2C , LIN, MIL-STD-1553, RS-232, SENT, PMBus, SMBus, SPI, UART, USB 1.0/1.1/2.0, USB-PDTD or TDxx: Audio (TDG), FlexRay (TDMP)D: DigRF 3G, DigRF v4, ENET, Fibre Channel,Manchester, MDIO, NRZ, PCIe, SATA, SAS,SpaceWire, UniPro, USB 2.0-HSIC,USB 3.2 (Gen1), 8b/10bDP : D-PHY, M-PHY DME: ARINC 429TD or TDME: 100Base-T1, CAN, CAN FD, CAN FD Symbolic, SPMI, I 3C, I 2C , LIN, MIL-STD-1553, RS-232, SENT, PMBus,SMBus, SPI, UART, USB 1.0/1.1/2.0, USB-PD TD or TDxx: Audio (TDG), FlexRay (TDMP) D: DigRF 3G, DigRF v4, D-PHY, ENET, Manchester, MDIO, NRZ, SpaceWire, USB 2.0-HSIC, 8b/10b DME: ARINC 429TD: SATA, 8b/10bTD or TDME: 100Base-T1, CAN, CAN FD, CAN FD Symbolic, SPMI, I 3C, I 2C , LIN, MIL-STD-1553, RS-232, SENT, PMBus, SMBus, SPI, UART, USB 1.0/1.1/2.0, USB-PD TD or TDxx: Audio (TDG), FlexRay (TDMP) D: DigRF 3G, DigRF v4, ENET, Fibre Channel,Manchester, MDIO, NRZ, PCIe, SAS, SpaceWire, UniPro, USB 2.0-HSIC DP : D-PHY, M-PHY DME: ARINC 429 串行数据分析Eye Jitter and Noise Analysis (SDAIII-CompleteLINQ), Virtual Probe, Eye Doctor II,Serial Data Mask, Cable De-EmbeddingEye and Jitter Analysis (SDAIII), Virtual Probe, Eye Doctor II, Serial Data Mask, Cable De-Embedding Eye Jitter, Virtual Probe, Eye Doctor II, SerialData Mask, Cable De-Embedding 串行数据一致性测试DDR 2/3, LPDDR 2/3, Automotive Ethernet 10Base-T1S, 100Base-T1, 1000Base-T1,Ethernet 10/100/1000Base-T , MIPI D-PHY ,MOST 50/150, PCI Express 1.0, USB 1.1/2.0Automotive Ethernet 10Base-T1S, 100Base-T1,1000Base-T1, Ethernet 10/100/1000Base-T , MOST 50/150, USB 1.1/2.0DDR 2/3, LPDDR 2/3, Automotive Ethernet 10Base-T1S, 100Base-T1, 1000Base-T1, Ethernet 10/100/1000Base-T , MIPI D-PHY ,MOST 50/150, USB 1.1/2.0应用软件选项Spectrum Analyzer (Single, Dual+Reference), Clock and Clock-Data Jitter Analysis, DDRDebug Toolkit, Switch-mode Power Supplyand Device Analysis, Three-phase ElectricalPower, Harmonic, and Vector Analysis, Digital Power Management, Advanced Customization, EMC Pulse Parameters, Digital Filter Package,Protocol Analyzer Synch (ProtoSync), Vector Signal Analysis, Advanced Optical Recording, Disk Drive Analysis, Disk Drive Measurements,Electrical Telecom Pulse Mask TestSpectrum Analyzer (Single, Dual+Reference), Clock and Clock-Data Jitter Analysis, Automotive Ethernet Debug, Switch-mode Power Supply and Device Analysis, Three-phase Electrical Power, Harmonic, and Vector Analysis, Digital Power Management, Advanced Customization, EMC Pulse Parameters, Digital Filter Package, Vector Signal Analysis, Three-phase Electrical and Mechanical PowerAnalysis (included with MDA Models)Spectrum Analyzer (Single, Dual+Reference),Clock and Clock-Data Jitter Analysis, DDR Debug Toolkit, Switch-mode Power Supply and Device Analysis, Advanced Customization, EMC Pulse Parameters, Digital Filter Package, Protocol Analyzer Synch (ProtoSync), VectorSignal Analysis, Advanced Optical Recording, Disk Drive Analysis, Disk Drive Measurements,Electrical Telecom Pulse Mask Test 外设接口USB Host for Storage, USB Device for PC, LAN for PC, GPIB for PC†函数+, -, x, /, FFT, Absolute Value, Average, Copy, Correlation, Derivative, Deskew, Envelope,Enhanced Resolution, Exponent, Floor, Histogram, Integral, Invert, Log, Phistogram, Ptrace Mean, Ptrace Range, Ptrace Sigma, Reciprocal, Rescale, Roof,Segment, Sparse, Square, Square Root, Track, Trend, Zoom +, -, x, /, FFT, Absolute Value, Average, Copy, Correlation, Derivative, Deskew, Envelope,Enhanced Resolution, Exponent, Floor, Histogram, Integral, Invert, Log,Phistogram, Ptrace Mean, Ptrace Range, Ptrace Sigma, Reciprocal, Rescale, Roof, Segment, Sparse, Square, Square Root,Track, Trend, Zoom尺寸 (HWD)345 x 445 x 196 mm (13.6” H x 17.5” W x 7.7” D)345 x 445 x 196 mm (13.6” H x 17.5” W x 7.7” D)358 x 445 x 242 mm (14.1” x 17.5” x 9.5”)重量24.4 lbs (11.1kg)24.4 lbs (11.1kg)25.8 lbs. (11.7 kg)保修3 yr3 yr3 yrHDO6000B/ HDO6000B-MSHDO4000A-MS WaveSurfer 4000HD 带宽350 MHz to 1 GHz 200 MHz to 1 GHz 200 MHz to 1 GHz 分辨率12-bit resolution,15-bit with enhanced resolution12-bit resolution,15-bit with enhanced resolution12-bit resolution,15-bit with enhanced resolution上升时间 1 ns to 450 ps 1.75 ns to 450 ps1.75 ns to 450 ps通道(模拟+数字)4, 4 + 16, 4 + 16 + 244, 4 + 16, 4 + 16 + 244, 4 + 16, 4 + 16 + 24显示15.6” Widescreen Capacitive Touch Screen12.1” WXGA Multi-Touch Screen12.1” Widescreen Capacitive Touch Screen标配存储深度50 Mpts/Ch12.5 Mpts/Ch 25 Mpts Interleaved 12.5 Mpts/Ch 25 Mpts Interleaved 最大存储深度†Up to 250 Mpts Up to 50 Mpts Up to 25 Mpts 采样率Up to 10 GS/sUp to 10 GS/sUp to 5 GS/sMSO 特性†(数字通道)250 MHz, 1.25 GS/s 16 Ch 250 MHz, 1.25 GS/s 16 Ch 125 MHz, 500 MS/s16 Ch触发类型Edge, Width, Glitch, Pattern, Video, HDTV, Runt, Timeout, Slew Rate, Interval (Period), Dropout, Qualified, Measurement, Window, CascadeEdge, Width, Glitch, Pattern, Video, HDTV, Runt, Slew Rate, Interval (Period), Dropout, Qualified, Window Edge, Width, Pattern, Video, HDTV, Runt, Slew Rate, Interval (Period), Dropout, Qualified串行数据† 触发 (T) 解码 (D)测量/图形 (M)眼图 (E)仅图形 (G)物理层 (P)TD or TDME: 100Base-T1, CAN, CAN FD, CAN FD Symbolic, SPMI, I 3C, I 2C , LIN, MIL-STD-1553, RS-232, SENT, PMBus, SMBus, SPI, UART, USB-PD TD or TDxx: Audio (TDG), FlexRay (TDMP) D: DigRF 3G, DigRF v4, D-PHY, ENET, Manchester, MDIO, NRZ, SpaceWire, USB 1.0/1.1/2.0, USB-PD, USB 2.0-HSICDME: ARINC 429TD: 100Base-T1, Audio, CAN, CAN FD, FlexRay, SPMI, I 3C, I 2C , LIN, MIL-STD-1553, RS-232, SENT, PMBus, SMBus, SPI, UART,USB-PDD: ARINC 429, DigRF 3G, DigRF v4, D-PHY, ENET, Manchester, MDIO, NRZ, SpaceWire, USB 1.0/1.1/2.0, USB-PD, USB 2.0-HSIC TD: Audio, CAN, CAN FD, LIN, FlexRay, I2C,SPI, UART, RS232串行数据分析Serial Data Mask ––串行数据一致性测试Automotive Ethernet 10Base-T1S, 100Base-T1, 1000Base-T1, Ethernet 10/100/1000Base-T ,MOST 50/150––应用软件选项Spectrum Analyzer (Single, Dual+Reference), Clock and Clock-Data Jitter Analysis, Switch-mode Power Supply and Device Analysis, Three-phase Electrical Power, Harmonic, and Vector Analysis, Digital Power Management, Advanced Customization, EMC Pulse Parameters, Digital Filter Package, Vector Signal Analysis, Electrical Telecom PulseMask TestSpectrum Analyzer (Single), Switch-mode Power Supply and Device Analysis , Electrical Telecom Pulse Mask Test Spectrum Analyzer (Single), Switch-mode Power Supply and Device Analysis ,Arbitrary Waveform Generator, Digital Voltmeter (Included standard with registration)外设接口USB Host for Storage, USB Device for PCLAN for PC, GPIB for PC†函数+, -, x, /, FFT, Absolute Value, Average, Copy, Correlation, Derivative, Deskew, Envelope, Enhanced Resolution, Exponent, Floor, Histogram, Integral, Invert, Log, Phistogram, Ptrace Mean, Ptrace Range, Ptrace Sigma, Reciprocal, Rescale, Roof, Segment, Sparse, Square, Square Root, Track, Trend, Zoom +, -, x, /, FFT, Absolute Value, Average, Derivative, Deskew, Envelope, Enhanced Resolution, Floor, Integral, Invert, Reciprocal, Rescale, Roof, Square, Square Root, Trend, Zoom +, -, x, /, FFT, Absolute Value, Average, Derivative, Deskew, Envelope, Enhanced Resolution, Floor, Integral, Invert, Reciprocal, Rescale, Roof, Square, Square Root,Trend, Zoom尺寸 (HWD)352 mm x 445 mm x 170 mm (13.8” x 17.5” x 6.7”)291.7 x 399.4 x 131.31 mm (11.48”x 15.72”x 5.17“)273 x 380 x 160 mm (10.7” x 14.9” x 6.3”)重量21 lbs (9.8 kg)12.6 lbs (5.71 kg)11.7 lbs (5.3 kg)保修3 yr3 yr3 yrWaveSurfer 3000z T3DSO2000AT3DSO1000 / T3DSO1000A带宽100 MHz to 1 GHz 100 MHz to to 500 MHz100 MHz to 350 MHz 分辨率8-bit resolution,11-bit with enhanced resolution8-bit resolution,11-bit with enhanced resolution8-bit resolution,11-bit with enhanced resolution上升时间 3.5 ns to 430 ps3.5 ns to 800 ps3.5 ns to 1 ns通道(模拟+数字)4, 4+162 or 4, 2 or 4 + 16 2 or 4,2 or 4 + 16显示10.1” Capacitive Touch Screen10.1” CapacitiveTouch Screen 1024 x 6007" 800 x 480标配存储深度10 Mpts/Ch, 20 Mpts Interleaved 100 Mpts/Ch,200 Mpts interleavedT3DSO1000:7 Mpts/Ch, 14 Mpts interleaved,T3DSO1000A:14 Mpts/Ch, 28 Mpts interleaved最大存储深度†Up to 20 Mpts Up to 200 Mpts Up to 28 Mpts采样率Up to 4 GS/s100 MHz models: Up to 2 GS/sUp to 2 GS/sT3DSO1000: Up to 1 GS/s T3DSO1000A: Up to 2 GS/sMSO 特性†(数字通道)125 MHz, 500 MS/s 500 MS/s, 3.3 ns min detectable pulse width250 MHz, 1 GS/s 触发类型Edge, Width, Pattern, TV , Runt, Slew Rate, Interval (Period), Dropout, QualifiedEdge, Pulse, Pattern, Video, Runt, Slope, Interval, Dropout, Window / Zone Edge,Pulse, Pattern, Video, Runt, Slope,Interval, Dropout, Window 串行数据† 触发 (T) 解码 (D)测量/图形 (M)眼图 (E)仅图形 (G)物理层 (P)TD: Audio, CAN, CAN FD, FlexRay, I 2C , LIN,RS-232, SPI, UARTTD: I 2C, SPI, UART- RS232, CAN, LIND: CAN FD, FlexRay, I 2S,MILSTD-1553BTD: I 2C, SPI, UART-RS232, CAN, LIN串行数据分析–––串行数据一致性测试–––应用软件选项Switch-mode Power Supply and Device Analysis , Function Generator , Digital Voltmeter (Included standard withregistration)Arbitrary Waveform Generator, Switchmode Power Supply and DeviceAnalysis, Bode Plot, 10-bit mode, Mask TestArbitrary Waveform Generator, WiFi, BodePlot外设接口USB Host, USB Device, LAN, GPIB, and LXICompatibleUSB Host, USB Device, LAN USB Host, USB Device, LAN 函数+, -, x, /, FFT, Absolute Value, Average, Derivative, Envelope, Floor, Integral, Invert, Reciprocal, Rescale, Roof, SinX/x, Square,Square Root, Trend, Zoom+, -, x, /, FFT, Derivative, Integral, Square Root / Formula Editor+, -, x, /, FFT, Derivative, Integral,Square Root尺寸 (HWD)270 x 380 x 125 mm (10.63” x 14.96” x 4.92”)224 x 352 x 111 mm (8.81” x 13.86” x 4.37”)150 x 312 x 133 mm (5.91"x 12.28" x 5.94")重量10.6 lbs (4.81 kg)7.92 lbs. (3.6 kg)/ 8.6 lbs. (3.9 kg)5.72 lbs. (2.6 kg)保修3 yr3 yr3 yrMDA 8000HD 电机驱动分析仪三相电机功率分析电机驱动工程师需要了解驱动系统运行的每个部分，需要查看控制、传感器、功率器件和功率的波形，需要了解动态事件，并且需要灵活地调试任何异常，电机驱动分析仪可以完成所有工作。
OB3652N规格书
UVLO(ON)(V)
7.1 6.7 6.3 5.9 5.5 -40 -10 20 50 80 110 140
FEATURES
High precision Constant Current Regulation at Universal AC input Primary-side Sensing and Regulation Without TL431 and Opto-coupler Sense and supply without auxiliary winding inductance Low System Cost and High Efficiency Low operation current Programmable CC Regulation Built-in Primary winding inductance compensation Built-in line compensation Short Circuit Protection Open Loop Protection Cycle-by-Cycle Current Limiting Built-in Leading Edge Blanking (LEB) VDD Under Voltage Lockout with Hysteresis Latched over temperature protection (OTP)
HLMP-EL30-QRK00中文资料
T-13/4 (5 mm) Precision Optical Performance AlInGaP LED LampsData SheetFeatures• Well Defined Spatial Radiation Patterns• Viewing Angles: 6°, 15°, 23°, 30°• High Luminous Output• Colors:590 nm Amber605 nm Orange615 nm Reddish-Orange626 nm Red• High Operating Temperature: T J LED=+130°C• Superior Resistance to Moisture• Package Options:With or Without Lead Stand-OffsBenefits• Viewing Angles Match Traffic Management Sign Requirements• Colors Meet Automotive and Pedestrian Signal Specifications• Superior Performance in Outdoor Environments• Suitable for Autoinsertion onto PC Boards Applications• Traffic Management:Traffic SignalsPedestrian SignalsWork Zone Warning LightsVariable Message Signs• Commercial OutdoorAdvertising:SignsMarquees• Automotive:Exterior and Interior LightsDescriptionThese Precision Optical Perform-ance AlInGaP LEDs providesuperior light output forexcellent readability in sunlightand are extremely reliable.AlInGaP LED technologyprovides extremely stable lightoutput over long periods of time.Precision Optical Performancelamps utilize the aluminumindium gallium phosphide(AlInGaP) technology.These LED lamps are untinted,nondiffused, T-13/4 packagesincorporating second generationoptics producing well definedspatial radiation patterns atspecific viewing cone angles.SunPower SeriesHLMP-ELxxHLMP-EJxxHLMP-EHxxHLMP-EGxxThese lamps are made with anadvanced optical grade epoxy,offering superior high tempera-ture and high moistureresistance performance inoutdoor signal and signapplications. The high maximumLED junction temperature limitof +130°C enables hightemperature operation in brightsunlight conditions. The packageepoxy contains both uv-a anduv-b inhibitors to reduce theeffects of long term exposure todirect sunlight.These lamps are available in twopackage options to give thedesigner flexibility with devicemounting.Device Selection GuideTypicalViewing Color and Luminous Angle Dominant Lamps Without Standoffs Lamps With Standoffs Intensity Iv (mcd) [1,2] 2θ1/2Wavelength on Leads on Leads@ 20 mA (Deg.)[4](nm), Typ.[3] (Outline Drawing A)(Outline Drawing B)Min.Max.HLMP-EL08-VY000HLMP-EL10-VY000420012000HLMP-EL08-VYK00*420012000HLMP-EL08-VXK00*42009300HLMP-EL08-VX400**42009300HLMP-EL08-VX00042009300HLMP-EL08-WZ000HLMP-EL10-WZ000550016000 Amber 590HLMP-EL08-XZ400**720016000HLMP-EL08-XZ000720016000HLMP-EL08-XZK00*720016000HLMP-EL08-XY000720012000HLMP-EL08-XYK00*720012000HLMP-EL08-X1K00*720021000HLMP-EL08-X1000HLMP-EL10-X1000720021000 6°[5]HLMP-EJ08-WZ000HLMP-EJ10-WZ000550016000 Orange 605HLMP-EJ08-X1000HLMP-EJ10-X1000720021000HLMP-EJ08-Y2000HLMP-EJ10-Y2000930027000HLMP-EH08-UX000HLMP-EH10-UX00032009300HLMP-EH08-VY000HLMP-EH10-VY000420012000 Red-Orange 615HLMP-EH08-WZ000HLMP-EH10-WZ000550016000HLMP-EH08-X1000HLMP-EH10-X1000720021000HLMP-EH08-Y2000HLMP-EH10-Y2000930021000HLMP-EG08-VW00042007200HLMP-EG08-VY000HLMP-EG10-VY000420012000HLMP-EG08-WZ000HLMP-EG10-WZ000550016000 Red 626HLMP-EG08-X1000HLMP-EG10-X1000720021000HLMP-EG08-YZ000930016000HLMP-EG08-Y1000930021000HLMP-EG08-Y2000HLMP-EG10-Y2000930027000 Notes:1. The luminous intensity is measured on the mechanical axis of the lamp package.2. The optical axis is closely aligned with the package mechanical axis.3. The dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the color of the lamp.4. θ1/2 is the off-axis angle where the luminous intensity is one half the on-axis intensity.5.The intensity of narrow viewing angle lamps is measured at the intensity peak.Part numbers in bold are recommended for new designs.*HLMP-xLxx-xxK00 are selected to amber color bins 2 and 4 only.**HLMP-xLxx-xx400 are selected to amber color bin 4 only.Device Selection Guide (Continued)TypicalViewing Color and Luminous Angle Dominant Lamps Without Standoffs Lamps With Standoffs Intensity Iv (mcd) [1,2] 2θ1/2Wavelength on Leads on Leads@ 20 mA (Deg.)[4](nm), Typ.[3] (Outline Drawing A)(Outline Drawing B)Min.Max.HLMP-EL15-PS000HLMP-EL17-PS0008802500HLMP-EL15-QR00011501900HLMP-EL15-QRK00*11501900HLMP-EL15-QS00011502500HLMP-EL15-QS400**11502500HLMP-EL15-QSK00*11502500HLMP-EL15-QT000HLMP-EL17-QT00011503200HLMP-EL15-QTK00*11503200HLMP-EL15-RU000HLMP-EL17-RU00015004200HLMP-EL17-SV00019005500 Amber 590HLMP-EL15-TW000HLMP-EL17-TW00025007200HLMP-EL15-TWK00*25007200HLMP-EL15-TUK00*25004200 15°HLMP-EL15-TV400**25005500HLMP-EL15-UX000HLMP-EL17-UX00032009300HLMP-EL15-VY000HLMP-EL17-VY000420012000HLMP-EL15-VYK00*420012000HLMP-EL15-VX00042009300HLMP-EL15-VXK00*42009300HLMP-EL15-VX400**42009300HLMP-EL15-VW000*42007200HLMP-EL15-VWK00*42007200HLMP-EJ15-PS0008802500 Orange 605HLMP-EJ15-RU000HLMP-EJ17-RU00015004200HLMP-EJ15-SV000HLMP-EJ17-SV00019005500HLMP-EH15-QT000HLMP-EH17-QT00011503200 Red-Orange 615HLMP-EH15-RU000HLMP-EH17-RU00015004200HLMP-EH15-TW000HLMP-EH17-TW00025007200HLMP-EH15-UX000HLMP-EH17-UX00032009300 Notes:1. The luminous intensity is measured on the mechanical axis of the lamp package.2. The optical axis is closely aligned with the package mechanical axis.3. The dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the color of the lamp.4. θ1/2 is the off-axis angle where the luminous intensity is one half the on-axis intensity.5.The intensity of narrow viewing angle lamps is measured at the intensity peak.Part numbers in bold are recommended for new designs.*HLMP-xLxx-xxK00 are selected to amber color bins 2 and 4 only.**HLMP-xLxx-xx400 are selected to amber color bin 4 only.Device Selection Guide (Continued)TypicalViewing Color and Luminous Angle Dominant Lamps Without Standoffs Lamps With Standoffs Intensity Iv (mcd) [1,2] 2θ1/2Wavelength on Leads on Leads @ 20 mA (Deg.)[4](nm), Typ.[3](Outline Drawing A)(Outline Drawing B) Min.Max.HLMP-EG15-PS0008802500HLMP-EG15-QT000HLMP-EG17-QT00011503200 15°Red 626HLMP-EG15-RU000HLMP-EG17-RU00015004200HLMP-EG15-UX000HLMP-EG17-UX00032009300HLMP-EG15-TW000HLMP-EG17-TW00025007200HLMP-EL24-MQ0005201500HLMP-EL24-NR000HLMP-EL26-NR0006801900HLMP-EL24-PS000HLMP-EL26-PS0008802500HLMP-EL24-PSK00*8802500HLMP-EL24-PR400**8801900HLMP-EL24-PQK00*8801500HLMP-EL24-QR00011501900HLMP-EL24-QRK00*11501900HLMP-EL24-QS00011502500HLMP-EL24-QSK00*11502500HLMP-EL24-QS400**11502500 23°Amber 590HLMP-EL24-QT000HLMP-EL26-QT00011503200HLMP-EL24-QTK00*11503200HLMP-EL24-RU000HLMP-EL26-RU00015004200HLMP-EL24-RUK00*15004200HLMP-EL26-SV00019005500HLMP-EL24-STK00*19003200HLMP-EL24-SUK00*19004200HLMP-EL24-SU400**19004200HLMP-EL24-SV00019005500HLMP-EL24-SVK00*19005500HLMP-EL24-TW000HLMP-EL26-TW00025007200HLMP-EL24-TWK00*25007200 Notes:1. The luminous intensity is measured on the mechanical axis of the lamp package.2. The optical axis is closely aligned with the package mechanical axis.3. The dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the color of the lamp.4. θ1/2 is the off-axis angle where the luminous intensity is one half the on-axis intensity.5.The intensity of narrow viewing angle lamps is measured at the intensity peak.Part numbers in bold are recommended for new designs.*HLMP-xLxx-xxK00 are selected to amber color bins 2 and 4 only.**HLMP-xLxx-xx400 are selected to amber color bin 4 only.Device Selection Guide (Continued)TypicalViewing Color and Luminous Angle Dominant Lamps Without Standoffs Lamps With Standoffs Intensity Iv (mcd) [1,2] 2θ1/2Wavelength on Leads on Leads@ 20 mA (Deg.)[4](nm), Typ.[3] (Outline Drawing A)(Outline Drawing B)Min.Max.Orange 605HLMP-EJ24-QT000HLMP-EJ26-QT00011503200HLMP-EJ24-RU000HLMP-EJ26-RU00015004200HLMP-EH26-PS0008802500 Red-Orange 615HLMP-EH24-QT000HLMP-EH26-QT00011503200 23ºHLMP-EH24-RU000HLMP-EH26-RU00015004200HLMP-EH24-SV000HLMP-EH26-SV00019005500HLMP-EG24-PS000HLMP-EG26-PS0008802500 Red 626HLMP-EG24-QT000HLMP-EG26-QT00011503200HLMP-EG24-RU000HLMP-EG26-RU00015004200HLMP-EL30-MQ000HLMP-EL32-MQ0005201500HLMP-EL30-NR000HLMP-EL32-NR0006801900HLMP-EL30-PQ0008801500HLMP-EL30-PQK00*8801500HLMP-EL30-PR0008801900HLMP-EL30-PR400**8801900HLMP-EL30-PRK00*8801900HLMP-EL30-PS000HLMP-EL32-PS0008802500 30°Amber 590HLMP-EL30-PSK00*8802500HLMP-EL30-QRK00*11501900HLMP-EL30-QS00011502500HLMP-EL30-QS400**11502500HLMP-EL30-QT000HLMP-EL32-QT00011503200HLMP-EL30-QTK00*11503200HLMP-EL30-ST00019003200HLMP-EL30-SU00019004200HLMP-EL30-SU400**19004200HLMP-EL30-SUK00*19004200 Notes:1. The luminous intensity is measured on the mechanical axis of the lamp package.2. The optical axis is closely aligned with the package mechanical axis.3. The dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the color of the lamp.4. θ1/2 is the off-axis angle where the luminous intensity is one half the on-axis intensity.5.The intensity of narrow viewing angle lamps is measured at the intensity peak.Part numbers in bold are recommended for new designs.*HLMP-xLxx-xxK00 are selected to amber color bins 2 and 4 only.**HLMP-xLxx-xx400 are selected to amber color bin 4 only.Device Selection Guide (Continued)TypicalViewing Color and Luminous Angle Dominant Lamps Without Standoffs Lamps With Standoffs Intensity Iv (mcd) [1,2] 2θ1/2Wavelength on Leads on Leads@ 20 mA (Deg.)[4](nm), Typ.[3] (Outline Drawing A)(Outline Drawing B)Min.Max.HLMP-EL30-STK00*19003200 Amber HLMP-EL30-SV00019005500HLMP-EL30-SVK00*19005500HLMP-EL32-SV00019005500HLMP-EJ30-MQ0005201500 Orange 605HLMP-EJ30-NR000HLMP-EJ32-NR0006801900HLMP-EJ30-PS000HLMP-EJ32-PS0008802500HLMP-EH30-MQ000HLMP-EH32-MQ0005201500 30°HLMP-EH30-NR000HLMP-EH32-NR0006801900 Red-Orange 615HLMP-EH30-PS000HLMP-EH32-PS0008802500HLMP-EH30-QT000HLMP-EH32-QT00011503200HLMP-EH30-RU000HLMP-EH32-RU00015004200HLMP-EG30-KN000310880HLMP-EG30-MQ000HLMP-EG32-MQ0005201500HLMP-EG30-NQ0006801500HLMP-EG30-NR000HLMP-EG32-NR0006801900 Red 626HLMP-EG30-PQ0008801500HLMP-EG30-PR0008801900HLMP-EG30-PS000HLMP-EG32-PS0008802500HLMP-EG30-QT000HLMP-EG32-QT00011503200 Notes:1. The luminous intensity is measured on the mechanical axis of the lamp package.2. The optical axis is closely aligned with the package mechanical axis.3. The dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the color of the lamp.4. θ1/2 is the off-axis angle where the luminous intensity is one half the on-axis intensity.5.The intensity of narrow viewing angle lamps is measured at the intensity peak.Part numbers in bold are recommended for new designs.*HLMP-xLxx-xxK00 are selected to amber color bins 2 and 4 only.**HLMP-xLxx-xx400 are selected to amber color bin 4 only.Part Numbering SystemHLMP-x x xx-x x x xxMechanical Options00: Bulk PackagingDD: Ammo PackYY: Flexi-Bin; Bulk PackagingZZ: Flexi-Bin; Ammo PackColor Bin Selections0: No color bin limitation4: Amber color bin 4 onlyK: Amber color bins 2 and 4 onlyMaximum Intensity Bin0: No Iv bin limitationMinimum Intensity BinViewing Angle & Lead Stand Offs08: 6 deg without lead stand offs10: 6 deg with lead stand offs15: 15 deg without lead stand offs17: 15 deg with lead stand offs24: 23 deg without lead stand offs26: 23 deg with lead stand offs30: 30 deg without lead stand offs32: 30 deg with lead stand offsColorG: 626 nm RedH: 615 nm Red-OrangeJ: 605 nm OrangeL: 590 nm AmberPackageE: 5 mm RoundNOTES:1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).2. LEADS ARE MILD STEEL, SOLDER DIPPED.3. TAPERS SHOWN AT TOP OF LEADS (BOTTOM OF LAMP PACKAGE) INDICATE AN EPOXY MENISCUS THAT MAY EXTEND ABOUT 1 mm (0.040 in.) DOWN THE LEADS.4. RECOMMENDED PC BOARD HOLE DIAMETERS:•LAMP PACKAGE A WITHOUT STAND-OFFS: FLUSH MOUNTING AT BASE OFLAMP PACKAGE = 1.143/1.067 (0.044/0.042).•LAMP PACKAGE B WITH STAND-OFFS: MOUNTING AT LEAD STAND-OFFS= 0.965/0.889 (0.038/0.035).5. FOR DOME HEIGHTS ABOVE LEAD STAND-OFF SEATING PLANE, d, LAMP PACKAGE B, SEE TABLE.BPackage DimensionsA(0.039)(0.039)PART NO.d HLMP-XX1012.37 ± 0.25(0.487 ± 0.010)HLMP-XX1712.42 ± 0.25(0.489 ± 0.010)HLMP-XX2612.52 ± 0.25(0.493 ± 0.010)HLMP-XX3211.96 ± 0.25(0.471 ± 0.010)Electrical/Optical Characteristics at T A = 25°CParameter Symbol Min.Typ.Max.Units Test Conditions Forward VoltageI F = 20 mAAmber (λd = 590 nm) 2.02Orange (λd = 605 nm)V F1.982.4VRed-Orange (λd = 615 nm) 1.94Red (λd = 626 nm) 1.90Reverse Voltage V R520VI F = 100 µAPeak Wavelength:Peak of Wavelength of Amber (λd = 590 nm)592Spectral Distribution Orange (λd = 605 nm)λPEAK609nmat I F = 20 mARed-Orange (λd = 615 nm)621Red (λd = 626 nm)635Spectral Halfwidth∆λ1/217nmWavelength Width at Spectral Distribution 1/2 Power Point at I F = 20 mASpeed of Response τs 20ns Exponential Time Constant, e -t /τs CapacitanceC 40pF V F = 0, f = 1 MHzThermal Resistance R θJ-PIN240°C/WLED Junction-to-Cathode LeadLuminous Efficacy [1]Emitted LuminousAmber (λd = 590 nm)480Power/Emitted Radiant Orange (λd = 605 nm)ηv370lm/WPowerRed-Orange (λd = 615 nm)260Red (λd = 626 nm)150Note:1. The radiant intensity, I e , in watts per steradian, may be found from the equation I e = I v /ηv , where I v is the luminous intensity in candelas and ηv is the luminous efficacy in lumens/watt.Absolute Maximum Ratings at T A = 25°CDC Forward Current [1,2,3]..................................................................50 mA Peak Pulsed Forward Current [2,3].................................................100 mA Average Forward Current [3].............................................................30 mA Reverse Voltage (I R = 100 µA)................................................................5 V LED Junction Temperature ..............................................................130°C Operating Temperature ...................................................-40°C to +100°C Storage Temperature .......................................................-40°C to +120°C Wave Solder Temperature........................................250°C for 3 seconds [1.59 mm (0.060 in.) below body]Notes:1. Derate linearly as shown in Figure 4.2. For long term performance with minimal light output degradation, drive currentsbetween 10 mA and 30 mA are recommended. For more information on recommended drive conditions, please refer to Application Brief I-024 (5966-3087E).3. Operating at currents below 1 mA is not recommended. Please contact your local representative for further information.Figure 2. Forward Current vs. Forward Voltage.Figure 3. Relative Luminous Intensity vs.Forward Current.Figure 4. Maximum Forward Current vs. Ambient Temperature. Derating Based on T JMAX = 130°C.Figure 1. Relative Intensity vs. Peak Wavelength.Figure 5. Representative Spatial Radiation Pattern for 6° Viewing Angle Lamps.WAVELENGTH – nmR E L A T I V E I N T E N S I T YC U R R E N T – m AV F – FORWARD VOLTAGE – VR E L A T I V E L U M I N O U S I N T E N S I T Y (N O R M A L I Z E D A T 20 m A )00I F – DC FORWARD CURRENT – mA 403.02.01.51.00.520602.5I F – F O R W A R D C U R R E N T – m AT A – AMBIENT TEMPERATURE – °CR E L A T I V E I N T E N S I T Y – %1000θ – ANGULAR DISPLACEMENT – DEGREES8060507020-20-15103040-1051015202590-25-511Bin Name Min.Max.K 310400L 400520M 520680N680880P 8801150Q 11501500R 15001900S 19002500T 25003200U 32004200V42005500W 55007200X 72009300Y 930012000Z 12000160001160002100022100027000Intensity Bin Limits (mcd at 20 mA)Tolerance for each bin limit is ± 15%.Bin Name Min.Max.1584.5587.02587.0589.54589.5592.06592.0594.5Amber Color Bin Limits (nm at 20 mA)Tolerance for each bin limit is ± 0.5 nm.Note:1.Bin categories are established for classification of products. Products may not be available in all bin Figure 7. Representative Spatial Radiation Pattern for 23° Viewing Angle Lamps.Figure 8. Representative Spatial Radiation Pattern for 30° Viewing Angle Lamps.Figure 6. Representative Spatial Radiation Pattern for 15° Viewing Angle Lamps.R E L A T I V E I N T E N S I T Y – %1000θ – ANGULAR DISPLACEMENT – DEGREES806050702010304090-20-15-10510152025-25-5R E L A T I V E I N T E N S I T Y – %1000θ – ANGULAR DISPLACEMENT – DEGREES806050702010304090-20-15-10510152025-25-5R E L A T I V E I N T E N S I T Y – %1.000θ – ANGULAR DISPLACEMENT – DEGREES0.800.600.500.700.200.100.300.400.90-20-15-10510152025-25-5/semiconductors For product information and a complete list of distributors, please go to our web site.For technical assistance call:Americas/Canada: +1 (800) 235-0312 or (916) 788-6763Europe: +49 (0) 6441 92460China: 10800 650 0017Hong Kong: (+65) 6756 2394India, Australia, New Zealand: (+65) 6755 1939 Japan: (+81 3) 3335-8152 (Domestic/Interna-tional), or 0120-61-1280 (Domestic Only) Korea: (+65) 6755 1989Singapore, Malaysia, Vietnam, Thailand, Philippines, Indonesia: (+65) 6755 2044 Taiwan: (+65) 6755 1843Data subject to change.Copyright © 2004 Agilent Technologies, Inc. Obsoletes 5988-4275ENAugust 13, 2004。
乐维顿制造公司HLC系列控制器说明书
Leviton Manufacturing Co., Inc. Global Headquarters201 N. Service Rd. Melville, NY 11747-3138 Tech Line: 1-800-824-3005 Fax: 1-800-832-9538Leviton Manufacturing Co., Inc. Energy Management, Controls and Automation.4330 Michoud Blvd., New Orleans, LA, 70129 Tel: 1-504-736-9810 Fax: 1-504-253-2954Visit our Website at: /emca©2016 Leviton Manufacturing Co., Inc. All rights reserved. Subject to change without notice.HLC Keypad Room Controllerhlc™H L C K e y p a d R o o m C o n t r o l l e rAPPLICATIONThe HLC Keypad Room Controller, available inwhite or light almond, is designed to be a room or house controller for the HLC product line, including dimmers, switches, plug-in modules, and hard-wired load controls.As a room controller, default settings are pre-programmed. Scene A provides 80% illumination in a room, B represents 60%, C represents 40%, D represents 20%, as well as on/off buttons to turn the room on or off. When the room is on, the on/off buttons can be held to brighten or dim the entire room. If a homeowner wishes to adjust the room to a custom look, they may adjust dimmers and switches to the appropriate illumination and then press the scene button five times to save. When using an Omni family controller with PC Access software, the scene buttons can be programmed for custom scenes based on activity such as homework, movie time, dinner prep, and more.This device can function as a six room house status switch if it is set up on the eighth address in a room. In that case, the top/on button controls the first room in that room group, the bottom/off button controls the second room, and the “A” through “D” buttons control the third through sixth rooms, respectively.The keypad is unique in that it can be configured as a room, house, or general purpose keypad, for scene, zone, and/or automation functionality.FEATURES AND BENEFITS• Includes pre-programmed scenes with manual customization options• Control all lights in a room or area • Custom engraving available• Leviton recommends every HLC installation include a Phase Coupler, part number 39A00-1• Manual Lock-out is perfect for kids and parties.WARRANTY INFORMATIONTwo-Year WarrantySAT-10094Leviton Manufacturing Co., Inc. Global Headquarters201 N. Service Rd. Melville, NY 11747-3138 Tech Line: 1-800-824-3005 Fax: 1-800-832-9538Leviton Manufacturing Co., Inc. Energy Management, Controls and Automation.4330 Michoud Blvd., New Orleans, LA, 70129 Tel: 1-504-736-9810 Fax: 1-504-253-2954Visit our Website at: /emca©2016 Leviton Manufacturing Co., Inc. All rights reserved. Subject to change without notice.PRODUCT DATAORDERING INFORMATIONWIRING DIAGRAMSPECIFICATIONS:Number of Backlit Pushbuttons with LED Indicators 6Dimensions 4.1 x 1.75 x 1.2Weight 3.2 oz Mounting Standard J Box Input Power 120 ± 12 VAC Standby Power < .8 Watts Input Frequency 60 ± 3 Hz Temperature-40 °F to 194 °F。
Emulex HBA Manager 应用程序 Linux 版 Release Notes说明书
Release Notes Emulex® HBA Manager Applicationfor LinuxRelease 12.8.614.12-1Purpose and Contact InformationThese release notes describe the supported operating systems, new features, resolved issues, known issues, and technical tips associated with this release of the Emulex® HBA Manager application for Linux.For the latest product source files and documentation, and for supported driver versions, go to . If you have questions or require additional information, contact an authorized Broadcom® Technical Support representative at*****************************.NOTE:The Emulex OneCommand™ Manager application has been renamed as the Emulex HBA Manager application.However, the following items within the application continue to use OneCommand:●Kit names●Script names●Directory names●Command namesNew FeaturesNo new features were introduced in this release.NOTE:This release supports the CentOS 7.7, 7.8, 7.9, 8.3, 8.4, and 8.5 operating systems. It does not support the CentOS Stream 8 operating system.Resolved Issues1.In the Emulex HBA Manager CLI, setting Strictly Local Management Mode now reenables elxhbamgrd.2.The Emulex HBA Manager GUI now resets autostart back to false when changing the management mode to StrictlyLocal Management with Daemons Disabled.3.On LPe35004 HBAs, the correct number of bytes read and written are now reported by Emulex HBA Manager portstatistics.Known Issues1.For an NVMe port, do not use the Emulex HBA Manager CLI utility to discover the host remotely. Otherwise, the porttype is displayed as FC instead of FC+NVMe.WorkaroundUse local management instead of remote management on NVMe ports.2.The online help in the release 12.8.xxx.xx Emulex HBA Manager GUI is not up to date. Refer to the Emulex HBAManager Application User Guide release 12.8 for up-to-date information about the following topics:–The correct illustration for adding a host–The instructions for installing the Emulex HBA Manager application without invoking a daemon–The description for the Function Summary area of the Host Information tab–Instructions for performing an immediate authentication–Procedures for managing firmware logging3.Revision A of the FOIT AFCT-57F3TMZ-ELX (16GFC longwave optic transceiver) does not support D_Port (also calledClearLink®) for Brocade® switches and MDS diagnostics for Cisco switches.4.Neither Revision A nor Revision B of the FOIT AFCT-57F3TMZ-ELX (16GFC longwave optic transceiver) andAFCT-57G5MZ-ELX (32GFC longwave optic transceiver) supports D_Port for Brocade switches.5.When the Emulex HBA Manager application is run on a Windows or Linux host, batch parameter update errors are notadded to the batch log.6.To perform a firmware dump on an LPe35000-series adapter on the Ubuntu 18.04 inbox driver (except on the Ubuntu18.04.3 HWE release), you cannot use the Emulex HBA Manager application. To perform a firmware dump on this driver,see Technical Tips, Item1, in these release notes.7.On LPe35000-series adapters, loopback tests are not functional on the Ubuntu 18.04 operating system (except on theUbuntu 18.04.3 HWE release).8.On LPe35000-series adapters, a host reboot is required after a firmware update on the Ubuntu 18.04 operating system(except on the Ubuntu 18.04.3 HWE release).9.The Emulex HBA Manager application GUI cannot be used to set a hash priority to a single value on an HBA port.WorkaroundUse hbacmd to set a hash priority to a single value on the HBA port. Ensure that the same hash priority value is set on the switch or authentication will fail.10.Boot from SAN is not supported if FC-SP-2 authentication (DH-CHAP) is enabled.11.Updating the NVMe BFS installation from RHEL 8.1 to a later RHEL 8.x release requires the rhel8u1_upgrade.shscript, which ensures that the NVMe BFS setup is maintained through the update process.The rhel8u1_upgrade.sh script is packaged in the nvmefc-dm--1.rhel8.tar.gz kit inside theelx-nvmefc-dm-<build>-n.tar.gz preinstallation kit. For more information about the preinstallation kit, refer to the Emulex Boot for the Fibre Channel and NVMe over FC Protocols User Guide.Technical Tips1.To perform a firmware dump on the Ubuntu 18.04 inbox driver (except on the Ubuntu 18.04.3 HWE release), perform thefollowing steps:a.Ensure that the latest Emulex HBA Manager core application kit for Linux is installed on the host.b.Download the LPe35000-series HBA FW Dump Tool from the Broadcom website at .c.Type the following commands to extract and install the tool:tar xzf elx-lpe-35000-fw-dump-tool-<version>-ds-1.tar.gzcd elx-lpe-35000-fw-dump-tool-<version>-ds-1/rpm -ivh elx-lpe-35000-fw-dump-tool-<version>.<platform>.rpmA window similar to the following is displayed.d.Type 1 and press Enter to select the port for which you want to perform the firmware dump.A window similar to the following is displayed.NOTE: A warning message appears if initiating a firmware dump on a specific port will also affect another port on the same adapter ASIC.e.Type the number of the port for which you want to perform the firmware dump, and press Enter.A window similar to the following is displayed.f.When the desired port is identified as the current port, type 2 and press Enter to initiate the firmware dump on thecurrent port.If the firmware dump is successful, the firmware dump tool closes automatically.g.Restart the elxhbamgrd service by typing the following command:service elxhbamgrd restartThis command allows such applications as the Emulex HBA Manager application to be refreshed.By default, the firmware dump file is available on the host in the /var/opt/Emulex/ocmanager/Dump/ directory after the elxhbamgrd service has been restarted.2.If you change the volatile World Wide Name (WWN) on an LPe16000-series adapter, a reboot is required.3.The Emulex HBA Manager application does not display the OS Device Name for LUNs attached to vPorts.In the LUN Information tab, under Mapping Information, the OS Device Name field displays N/A instead of the device name. All other information on the LUN Information tab is displayed correctly.4.When you install the Emulex HBA Manager application on a guest operating system, answers to the installer promptsare ignored.When you install the Emulex HBA Manager application on a guest operating system, you are presented withmanagement mode options (local only, full-management, read-only, and so on). Answers to these questions are ignored;all installations on guest operating systems are set to local only, read-only, and remote management.5. A port WWN setting configured at boot time using the BIOS tools might conflict with port WWN settings configured usingthe Emulex HBA Manager application.Some new systems allow the WWN for a port to be changed using the BIOS tools. Conflicts might occur if the WWN for the same port is permanently changed using the Emulex HBA Manager Change WWN feature. In such cases, the attempt to change the port WWN using the Change WWN feature might fail, or the port WWN configured by the BIOS tools will overwrite the setting configured by the Change WWN feature.6.Creating Secure Management users and groups after the Emulex HBA Manager application is installed in SecureManagement mode causes the GUI to fail.If the Secure Management users and groups are created after the Emulex HBA Manager application has been installed in Secure Management mode, when you attempt to start the Emulex HBA Manager application GUI as a member of a group, the application does not run. The operating system displays the following error message:-Bash: /usr/sbin/OneCommand Manager/OneCommand Manager: Permission deniedWorkaroundPerform one of the following actions:–Create the users and groups before you install the Emulex HBA Manager application in Secure Management mode.–Uninstall and reinstall the Emulex HBA Manager application.7.The elxhbamgrd daemon can take up to 30 seconds to stop.The behavior of the elxhbamgrd daemon is linked with the maximum timeout that the Linux kernel associates with the block BSG driver interface commands and with the Emulex HBA Manager application register for events function.8.Newly added LUNs on a storage array might not appear on the host machine Linux operating system or the Emulex HBAManager application.WorkaroundPerform one of the following actions:–Run the following script from the command shell:/usr/sbin/lpfc/lun_scan all–Reboot the host machine after the LUN has been added at the target array.9. A permanent driver parameter change fails if the system is rebooted too soon.When you make permanent driver parameter changes using the Emulex HBA Manager application, the application automatically makes the required entry in the /etc/modprobe.d/elx-lpfc.conf or equivalent file. Because the driver loads so early in the Linux machine boot sequence, the new contents of the/etc/modprobe.d/elx-lpfc.conf file must be reinserted into the Linux initial ramdisk file (using an operating system utility) for the driver to pick up the new driver parameter value on the next boot. Failure to generate a new initial ramdisk file prevents the driver from retrieving the new driver parameter value on subsequent driver loads (machine boots). The Emulex HBA Manager application automatically re-creates the initial ramdisk; however, it can take as long as 45 to 60 seconds after the driver parameter is changed for a complete initial ramdisk rebuild. If you reboot the machine immediately after the driver parameter change is made, the automatic re-creation of the initial ramdisk file by the Emulex HBA Manager application might fail to be completed. In these cases, this failure causes the driver to not obtain the new driver parameter value upon subsequent reboots.WorkaroundWait a minimum of 45 to 60 seconds after making the driver parameter change before rebooting the machine.10.A set link speed issue occurs after an SFP hot swap.LPe16000-series adapters do not support hot-swapping an SFP if the replacement SFP is not the same model as the original SFP. Two consequences occur in the Emulex HBA Manager application:–The Port Attributes tab in the Emulex HBA Manager application or the Emulex HBA Manager PortAttributes CLI command might display incorrect data for the Supported Link Speeds attribute. This issue is cosmetic.–Boot from SAN Management might be unable to set the Boot Code Link Speed parameter to 16 Gb/s.WorkaroundAfter changing the SFP, either reset the LPe16000 port or reboot the server.11.A dump command on a boot from SAN adapter might cause a system panic.When the Emulex HBA Manager application performs a dump of an adapter that is booting from a SAN and has no failover support, the operating system crashes when the adapter is taken offline to perform the boot and write the dump file to the host file system. The file system is unavailable because the adapter was taken offline.WorkaroundBefore performing a dump of an adapter, ensure that the desired adapter is not a boot from SAN adapter. Alternatively, provide failover support so that when the adapter is taken offline to perform the dump, the boot from SAN connection is maintained by the failover.12.When using Secure Management, if you belong to the ocmadmin group, you might be unable to change settings forremote adapters.WorkaroundSwitch to Full Management when changing the settings on a remote adapter.13.If the CLI (hbacmd) is used to perform a firmware download to a local adapter, and the Emulex HBA Manager applicationGUI is running while that firmware download is occurring, the Emulex HBA Manager application GUI might experience problems displaying information on various display tabs after the download completes. The value displayed for most of the fields on the affected tabs or dialogs is N/A.WorkaroundPerform one of the following actions:–Perform the firmware download using the Emulex HBA Manager application GUI instead of hbacmd.–When a firmware download has been performed by using hbacmd, if N/A is shown for most of the Emulex HBA Manager application GUI display fields, exit the GUI and then restart it. The fields are displayed correctly after doing this action.–Ensure that the Emulex HBA Manager application GUI is stopped or is not running prior to performing a firmware download using hbacmd.14.On SLES 12 SP4, initiating a firmware dump might result in an error message similar to the following:error: Invalid argument [arc/elx_lpe_35000_pci_device.app:TriggerFWDumps:510]Consider adding “iomem-relaxed” to grub cfg kernel commandline.[0x1000000090fa9483a2], [host8] [0000:01:00.0] Failed to trigger firmware dump.If this message appears, perform the following steps:a.Add the following kernel command line to the host grub configuration file:iomem=relaxedb.Reboot the host.c.Repeat the process to initiate a firmware dump.15.On Linux passthrough-only systems, the hbacmd listhba command might be slow to respond when adapters areattached to VMs.WorkaroundNone.16.Enabling and disabling a Fabric Assigned Port World Wide Name (FA-PWWN) might cause an adapter port’s WWPN tochange. The Emulex HBA Manager application discovery-tree might not display the port’s newly assigned WWPN.WorkaroundStop and restart the Emulex HBA Manager application services and daemons when prompted by the Emulex HBA Manager application.ing the Brocade Portdporttest command with the stop option causes the HBA to stop responding when runningD_Port from the switch. Disabling a port while running D_Port tests from the switch can cause the switch port to get stuck in D_Port mode.WorkaroundDo not stop D_Port tests while they are running from the switch. Do not disable a port while D_Port tests are running from the switch.If the HBA stops responding, remove the D_Port configuration from the switch port using the following commands. Refer to the Brocade switch documentation for more information.portdisable <portnumber>portcfgdport --disable <portnumber>portenable <portnumber>If the switch port is stuck in D_Port mode, use the portdporttest --exit command to clear the configuration.Copyright © 2022 Broadcom. All Rights Reserved. The term “Broadcom” refers to Broadcom Inc. and/or its subsidiaries. For more information, go to . All trademarks, trade names, service marks, and logos referenced herein belong to their respective companies.Broadcom reserves the right to make changes without further notice to any products or data herein to improve reliability, function, or design. Information furnished by Broadcom is believed to be accurate and reliable. However, Broadcom does not assume any liability arising out of the application or use of this information, nor the application or use of any product or circuit described herein, neither does it convey any license under its patent rights nor the rights of others.。
PC365中文资料
s Outline Dimensions
3.6±0.3 2.54±0.25
4
3
365
(Unit : mm)
4.4±0.2
0.1±0.1 2.6±0.2 0.2±0.05
1
Anode mark
2 0.4±0.1
Epoxy resin
5.3±0.3 45°
6°
0.5−+00..24
7.0−+00..72
Internal connection diagram
1
4
1 Anode
2 Cathode
s Applications
1. Programmable controllers 2. Facsimiles 3. Telephones
s Absolute Maximum Ratings
(Ta=25°C)
Parameter
Symbol Rating Unit
*1 Forward current IF Input *2 Peak forward current IFM
PC365
PC365
Low Input Current Photocoupler
s Features
1. Low input drive current (IF=0.5mA) 2. High sensitivity
(Darlington type, CTR:MIN.600%) 3. Mini-flat package 4. Isolation voltage (Viso (rms):3.75kV)
HLMP-2735中文资料
LED Light Bars Technical DataFeatures•Large Bright, Uniform Light Emitting Areas•Choice of Colors •Categorized for Light Output •Yellow and Green Categorized for Dominant Wavelength•Excellent ON-OFF Contrast •X-Y Stackable•Flush Mountable•Can be Used with Panel and Legend Mounts• Light Emitting Surface Suitable for Legend Attachment per Application Note 1012•HLCP-X100 Series Designed for Low Current Operation •Bicolor Devices Available Applications•Business MachineMessage Annunciators •Telecommunications Indicators•Front Panel Process Status Indicators•PC Board Identifiers•Bar Graphs DescriptionThe HLCP-X100 and HLMP-2XXXseries light bars are rectangularlight sources designed for avariety of applications where alarge bright source of light isrequired. These light bars areconfigured in single-in-line anddual-in-line packages that containeither single or segmented lightemitting areas. The AlGaAs RedHLCP-X100 series LEDs usedouble heterojunction AlGaAs ona GaAs substrate. The HERHLMP-2300/2600 and YellowHLMP-2400/2700 series LEDshave their p-n junctions diffusedinto a GaAsP epitaxial layer on aGaP substrate. The Green HLMP-2500/2800 series LEDs use aliquid phase GaP epitaxial layeron a GaP substrate. The bicolorHLMP-2900 series use acombination of HER/Yellow orHER/Green LEDs.HLCP-A100, -B100, -C100,-D100, -E100, -F100, -G100,-H100HLMP-2300, -2350, -2400,-2450, -2500, -2550, -2600,-2620, -2635, -2655, -2670,-2685, -2700, -2720, -2735,-2755, -2770, -2785, -2800,-2820, -2835, -2855, -2870,-2885, -2950, -2965Selection GuideLight Bar Part Number Corresponding Size ofPackage Panel and HLCP-HLMP-Light Emitting AreasOutlineLegend Mount Part No. HLMP-AlGaAs HER Yellow Green A1002300240025008.89 mm x 3.81 mm 1A 2599(.350 in. x .150 in.)B10023502450255019.05 mm x 3.81 mm 1B 2598(.750 in. x .150 in.)D1002600270028008.89 mm x 3.81 mm 2D 2898(.350 in. x .150 in.)E1002620272028208.89 mm x 3.81 mm 4E 2899(.350 in. x .150 in.)F100263527352835 3.81 mm x 19.05 mm 2F 2899(.150 in. x .750 in.)C1002655275528558.89 mm x 8.89 mm 1C 2898(.350 in. x .350 in.)G1002670277028708.89 mm x 8.89 mm 2G 2899(.350 in. x .350 in.)H1002685278528858.89 mm x 19.05 mm 1H 2899(.350 in. x .750 in.)295029508.89 mm x 8.89 mm Bicolor I 2898(.350 in. x .350 in.)296529658.89 mm x 8.89 mm BicolorI2898(.350 in. x .350 in.)Number of Light Emitting AreasPart Numbering SystemHLCP- xx xx-xx x xxHLMP-xx xx-xx x xxMechanical Options[1]00: No mechanical optionColor Bin Options[1,2]0: No color bin limitationB: Color bins 2 & 3 (applicable for yellow devices only)C: Color bins 3 & 4 only (applicable for green devices only)Maximum Intensity Bin[1,2]0: No maximum intensity bin limitationMinimum Intensity Bin[1,2]0: No minimum intensity bin limitationDevice Specific Configuration[1]Refer to respective data sheetColor[1]x1: AlGaAs Red (applicable for HLCP-x100 only)23: High Efficiency Red24: Yellow25: Green26: High Efficiency Red27: Yellow28: Green29: Bicolor (High Efficiency Red/Yellow) OR (High Efficiency Red/Green) Notes:1. For codes not listed in the figure above, please refer to the respective data sheet or contact your nearest Agilent representativefor details.2. Bin options refer to shippable bins for a part-number. Color and Intensity Bins are typically restricted to 1 bin per tube(exceptions may apply). Please refer to respective data sheet for specific bin limit information.Package DimensionsNOTES:1. DIMENSIONS IN MILLIMETRES (INCHES). TOLERANCES ±0.25 mm (±0.010 IN.) UNLESS OTHERWISE INDICATED.2. FOR YELLOW AND GREEN DEVICES ONLY.Internal Circuit DiagramsAbsolute Maximum RatingsHER Yellow GreenAlGaAs Red HLMP-2300/HLMP-2400/HLMP-2500/ ParameterHLCP-X1002600/29XX2700/29502800/2965Series Series Series Series Average Power Dissipated per LED Chip37 mW[1]135 mW[2]85 mW[3]135 mW[2] Peak Forward Current per LED Chip45 mA[4]90 mA[5]60 mA[5]90 mA[5] Average Forward Current per LED Chip15 mA25 mA20 mA25 mADC Forward Current per LED Chip15 mA[1]30 mA[2]25 mA[3]30 mA[2] Reverse Voltage per LED Chip 5 V 6 V[6]Operating Temperature Range–20°C to +100°C[7]–40°C to +85°C–20°C to +85°C Storage Temperature Range –40°C to +85°CWave Soldering Temperature250°C for 3 seconds1.6 mm (1/16 inch) below BodyNotes:1.Derate above 87°C at 1.7 mW/°C per LED chip. For DC operation, derate above 91°C at 0.8 mA/°C.2.Derate above 25°C at 1.8 mW/°C per LED chip. For DC operation, derate above 50°C at 0.5 mA/°C.3.Derate above 50°C at 1.8 mW/°C per LED chip. For DC operation, derate above 60°C at 0.5 mA/°C.4.See Figure 1 to establish pulsed operation. Maximum pulse width is 1.5 mS.5.See Figure 6 to establish pulsed operation. Maximum pulse width is 2 mS.6.Does not apply to bicolor parts.7.For operation below –20°C, contact your local Agilent sales representative.Electrical/Optical Characteristics at T A = 25°CAlGaAs Red HLCP-X100 SeriesParameter HLCP-Symbol Min.Typ.Max.Units Test ConditionsA100/D100/E100I V37.5mcd I F = 3 mA Luminous Intensityper Lighting Emitting B100/C100/F100/G100615mcdArea[1]H1001230mcdPeak WavelengthλPEAK645nmDominant Wavelength[2]λd637nmForward Voltage per LED V F 1.8 2.2V I F = 20 mA Reverse Breakdown Voltage per LED V R515V I R = 100 µA Thermal Resistance LED Junction-to-Pin RθJ-PIN250°C/W/LEDParameter HLMP-Symbol Min.Typ.Max.Units Test Conditions2400/2700/2720IV 620mcd IF= 20 mALuminous Intensityper Lighting Emitting2450/2735/2755/2770/2950[3]1338mcd Area[1]27852670mcdPeak WavelengthλPEAK583nmDominant Wavelength[2]λd585nmForward Voltage per LED VF 2.1 2.6V IF= 20 mAReverse Breakdown Voltage per LED[5]VR 615V IR= 100 µAThermal Resistance LED Junction-to-Pin RθJ-PIN 150°C/W/LEDHigh Efficiency Red HLMP-2300/2600/2900 SeriesParameter HLMP-Symbol Min.Typ.Max.Units Test Conditions2300/2600/2620IV 623mcd IF= 20 mALuminous Intensityper Lighting Emitting2350/2635/2655/2670/2950[3]1345mcd Area[1]2965[4]1945mcd26852280mcdPeak WavelengthλPEAK635nmDominant Wavelength[2]λd626nmForward Voltage per LED VF 2.0 2.6V IF= 20 mAReverse Breakdown Voltage per LED[5]VR 615V IR= 100 µAThermal Resistance LED Junction-to-Pin RθJ-PIN 150°C/W/LEDYellow HLMP-2400/2700/2950 SeriesHigh Performance Green HLMP-2500/2800/2965 SeriesParameter HLMP-Symbol Min.Typ.Max.Units Test Conditions2500/2800/2820IV 525mcd IF= 20 mALuminous Intensityper Lighting Emitting2550/2835/2855/28701150mcd Area[1]2965[4]2550mcd288522100mcdPeak WavelengthλPEAK565nmDominant Wavelength[2]λd572nmForward Voltage per LED VF 2.2 2.6V IF= 20 mAReverse Breakdown Voltage per LED[5]VR 615V IR= 100 µAThermal Resistance LED Junction-to-Pin RθJ-PIN 150°C/W/LEDNotes:1.These devices are categorized for luminous intensity. The intensity category is designated by a letter code on the side of the package.2.The dominant wavelength, λd , is derived from the CIE chromaticity diagram and is the single wavelength which defines the color of thedevice. Yellow and Green devices are categorized for dominant wavelength with the color bin designated by a number code on the side of the package.3.This is an HER/Yellow bicolor light bar. HER electrical/optical characteristics are shown in the HER table. Yellow electrical/opticalcharacteristics are shown in the Yellow table.4.This is an HER/Green bicolor light bar. HER electrical/optical characteristics are shown in the HER table. Green electrical/opticalcharacteristics are shown in the Green table.5.Does not apply to HLMP-2950 or HLMP-2965.Figure 1. Maximum Allowable Peak Current vs. Pulse Duration.Figure 4. Forward Current vs. Forward Voltage.Figure 5. Relative Luminous Intensity vs. DC Forward Current.AlGaAs RedFor a detailed explanation on the use of data sheet information and recommended soldering procedures,see Application Notes 1005, 1027, and 1031.HER, Yellow, GreenIntensity Bin Limits (mcd)HLMP-2300/2600/2620 Annunciators (.2 x .4 HER/AlGaAs), HLCP-A100/D100/E100IV Bin Category Min.Max.A 3.00 5.60B 4.508.20C 6.8012.10D10.1018.50E15.3027.80F22.8045.50G36.9073.80Notes:1. Minimum category A for Red L/C AlGaAs (-A100/-D100/-E100).2. Minimum category C for HER (-2300/-2600/-2620).HLMP-2350/2635/2655/2670 Annunciators (.2 x .8 HER/AlGaAs), HLCP-B100/C100/F100/G100 (.4 x .4 HER/AlGaAs)IV Bin Category Min.Max.A 5.4010.90B9.0016.00C13.1024.00D19.7036.10E29.6054.20F44.9088.80G71.90143.80Notes:1. Minimum category A for Red L/C AlGaAs (-B100/-C100/-F100/-G100).2. Minimum category C for HER (-2350/-2635/-2670).HLMP-2685/HLCP-H100 Annunciators (.4 x .8 HER/AlGaAs) IV Bin Category Min.Max.A10.8022.00B18.0027.10C22.0040.80D33.3061.10E50.0091.80F75.10150.00G121.70243.40Notes:1. Minimum category A for Red L/C AlGaAs (-H100).2. Minimum category C for HER (-2685).HLMP-2400/2700/2720 Annunciators (.2 x .4 Yellow)IV Bin Category Min.Max.C 6.1011.20D9.2016.80E13.8025.30F20.7041.40G33.6067.20HLMP-2450/2735/2755/2770 Annunciators (.2 x .8 Yellow & .4 x .4 Yellow) IV Bin Category Min.Max.C13.0022.00D18.0033.00E27.0050.00F40.5081.00G65.60131.20HLMP-2785 Annunciators (.4 x .8 Yellow)IV Bin Category Min.Max.C26.0044.40D36.0066.00E54.0099.00F81.00162.00G131.40262.80HLMP-2500/2800/2820 Annunciators (.2 x .4 Yellow)IV Bin Category Min.Max.C 5.6010.20D8.4015.30E12.6023.10F18.9037.80G30.6061.20H49.5097.90I80.10158.40HLMP-2550/2835/2855/2870 Annunciators (.2 x .8/.4 x .4 Green) IV Bin Category Min.Max.C11.3020.60D17.0031.00E25.4046.50F38.1076.20G61.60123.20H99.81197.67I161.73320.21HLMP-2885 Annunciators (.4 x .8 Green)IV Bin Category Min.Max.C22.2040.80D33.4061.20E50.1091.90F75.10150.30G121.10242.20H196.10383.50I313.70613.60HLMP-2950 Bi-Color Annunciators (.4 x .4 HER/Yellow) IV Bin Category Min.Max.Red Iv CategoriesC11.3020.60D17.0031.00E25.4046.50F38.1076.20G61.60123.20Yellow Iv CategoriesC13.0022.00D18.0033.00E27.0050.00F40.5081.00G65.60131.20HLMP-2965 Bi-Color Annunciators (.4 x .4/.2 x .8 HER/Green) IV Bin Category Min.Max.Red Iv CategoriesD19.7036.10E29.6054.20F44.9088.80G71.90143.80Green Iv CategoriesB7.5013.90C11.3020.60D17.0031.00E25.4046.50F38.1076.20G61.60123.20H100.00200.00Notes:1. Minimum category D for LPE Green (-2965).2. In green mode, the devices are to be color binned into standard color bins, perTable 2. (-2685).Color CategoriesNote:All categories are established for classification of products. Products may not be available in all categories. Please contact your local Agilent representatives for further clarification/information.I AVG I v TIME AVG =I TESTwhere:I TEST =3 mA for AlGaAs Red(HLMP-X000 series)20 mA for HER,Yellow and Green (HLMP-2XXX series)Example:For HLMP-2735 series ηI PEAK = 1.18 at I PEAK = 48 mA12 mA I v TIME AVG =20 mA= 25 mcd[][]ElectricalThese light bars are composed of two, four, or eight light emitting diodes, with the light from each LED optically scattered to form an evenly illuminated light emitting surface.The anode and cathode of each LED is brought out by separate pins. This universal pinoutarrangement allows the LEDs to be connected in three possible configurations: parallel, series, or series parallel. The typical forward voltage values can be scaled from Figures 4 and 9.These values should be used to calculate the current limiting resistor value and typical power consumption. Expected maximum V F values for driver circuit design and maximum power dissipation,may be calculated using the following V F MAX models:AlGaAs Red HLCP-X100 series V F MAX = 1.8 V + I Peak (20 Ω)For: I Peak ≤ 20 mAV F MAX = 2.0 V + I Peak (10 Ω)For: 20 mA ≤ I Peak ≤ 45 mA HER (HLMP-2300/2600/2900),Yellow (HLMP-2400/2700/2900)and Green (HLMP-2500/2800/2900) seriesV F MAX = 1.6 + I Peak (50 Ω)For: 5 mA ≤ I Peak ≤ 20 mA V F MAX = 1.8 + I Peak (40 Ω)For: I Peak ≥ 20 mAThe maximum power dissipation can be calculated for any pulsed or DC drive condition. For DC operation, the maximum powerdissipation is the product of the maximum forward voltage and the maximum forward current. For pulsed operation, the maximum power dissipation is the product of the maximum forward voltage at the peak forward current times the maximum average forward current. Maximum allowable power dissipation for any given ambient temperature and thermal resistance (R θJ-A ) can be deter-mined by using Figure 2 or 7. The solid line in Figure 2 or 7 (R θJ-A of 600/538 C/W) represents a typical thermal resistance of a device socketed in a printed circuitboard. The dashed lines represent achievable thermal resistances that can be obtained through improved thermal design. Once the maximum allowable power dissipation is determined, the maximum pulsed or DC forward current can be calculated.OpticalSize of Light Surface Area Emitting Area Sq. Metres Sq. Feet 8.89 mm x 8.89 mm 67.74 x 10–6729.16 x 10–68.89 mm x 3.81 mm 33.87 x 10–6364.58 x 10–68.89 mm x 19.05 mm 135.48 x 10–61458.32 x 10–63.81 mm x 19.05 mm72.85 x 10–6781.25 x 10–6The radiation pattern for these light bar devices is approximately Lambertian. The luminoussterance may be calculated using one of the two following formulas:I v (cd)L v (cd/m 2) =A (m 2)πI v (cd)L v (footlamberts) =A (ft 2)Refresh rates of 1 kHz or faster provide the most efficientoperation resulting in the maxi-mum possible time average luminous intensity.The time average luminousintensity may be calculated using the relative efficiency character-istic of Figure 3 or 8, ηI PEAK , and adjusted for operating ambient temperature. The time average luminous intensity at T A = 25°C is calculated as follows:(ηI PEAK ) (I v Data Sheet)(1.18) (35 mcd)The time average luminous intensity may be adjusted for operating ambient temperature by the following exponential equation:I v (T A) = I V (25°C)e[K (T –25°C)]Color KAlGaAs Red–0.0095/°CHER–0.0131/°C Yellow–0.0112/°C Green–0.0104/°CExample:I v (80°C) = (25 mcd)e[-0.0112 (80-25)] = 14 mcd.MechanicalThese light bar devices may beoperated in ambient temperaturesabove +60°C without deratingwhen installed in a PC boardconfiguration that provides athermal resistance pin to ambientvalue less than 280°C/W/LED. SeeFigure 2 or 7 to determine themaximum allowed thermalresistance for the PC board,RθPC-A, which will permitnonderated operation in a givenambient temperature.To optimize device opticalperformance, specially developedplastics are used which restrictthe solvents that may be used forcleaning. It is recommended thatonly mixtures of Freon (F113)and alcohol be used for vaporcleaning processes, with animmersion time in the vapors ofless than two (2) minutesmaximum. Some suggested vaporcleaning solvents are Freon TE,Genesolv DES, Arklone A or K. A60°C (140°F) water cleaningprocess may also be used, whichincludes a neutralizer rinse (3%ammonia solution or equivalent),a surfactant rinse (1% detergentsolution or equivalent), a hotwater rinse and a thorough airdry. Room temperature cleaningmay be accomplished with FreonT-E35 or T-P35, Ethanol,Isopropanol or water with a milddetergent.For further information onsoldering LEDs please refer toApplication Note 1027.A/semiconductorsFor product information and a complete list ofdistributors, please go to our web site.For technical assistance call:Americas/Canada: +1 (800) 235-0312 or(916) 788-6763Europe: +49 (0) 6441 92460China: 10800 650 0017Hong Kong: (+65) 6756 2394India, Australia, New Zealand: (+65) 6755 1939Japan: (+81 3) 3335-8152 (Domestic/Interna-tional), or 0120-61-1280 (Domestic Only)Korea: (+65) 6755 1989Singapore, Malaysia, Vietnam, Thailand,Philippines, Indonesia: (+65) 6755 2044Taiwan: (+65) 6755 1843Data subject to change.Copyright © 2004 Agilent Technologies, Inc.Obsoletes 5962-7197EJuly 8, 20045988-2221EN。
Tube-Tech CL 1B压力器说明书
TUBE-TECH CL1BCompressorDESCRIPTION.The TUBE-TECH compressor CL1B differs from many other compressors,in that the gain-reduction element is made from a non-semiconductor element,which in itself has a very low harmonic distortion and none of the non-linearity problems involved when using most semiconductor elements.Furthermore there is no long-term degradation of the element thus giving it almost infinite life.This element is placed after the input-transformer of the compressor and followed by an all tube-based amplifier with a gain of-∞dB to+30dB.Thus the signal is not fed through any semiconductor circuitry on its way to the output.The amplifier consists of two tubes(valves)in push-pull configuration(one ECC83as thepre-amp and phase splitter,and one ECC82as the output stage),and an output transformer. The power supply for the pre-amp and phase splitter are stabilized and the heaters of both tubes(valves)are fed with a stabilized DC voltage.The whole amplifier(including input and output transformer)and the power supplies are placed on one PC-board.Both input and output are balanced(600Ω)and fully floating.The in/out key switches the compressor in and out without clicks.THE SIDECHAIN:The side chain is the only part of the compressor that contains semiconductors.They are used for three reasons:First they do not affect the sound reproduction,second they have a high slew rate,which is of importance for the performance of the compressor and third they don't take up much room.It contains two J-FET quad op-amps,one npn-transistor and one FET-transistor,which handles the signal for the gain-reduction element.The compressor contains two time constants circuits:1.Fixed attack and release times2.Variable attack and release timesThe attack/release select switch makes it possible to use these two circuits separately or combine their functions.This gives a feature not normally obtained in other compressors:In the combined(fix./man.)state the attack-and release controls makes it possible toobtain a complex release-time slope.(See page4)(980112)COMPRESSOR INTERCONNECTION:The side chain sockets for interconnection of several compressors are located on the rear panel.A switch(BUS SELECT)on the front selects which compressors are interconnected,and on which bus they are connected.If you e.g.have10compressors in a rack,you can select compressor1,5,7and8on bus1,and compressor2,3,6and9on bus2,leaving compressor4 and6in the off position.Compressors1,5,7,8are now interconnected and all four will perform the exact same compression.This applies to compressor2,3,6and9as pressor4and6are independent.The interconnection implies,that the unit,which performs the most compression,is controlling the others.To choose which one you want to control,select the attack/release time,the threshold and the ratio on that unit,and turn the threshold fully counter clockwise on the reminding compressors. It is of course possible to have all the interconnected compressors control each other simultaneously.NB:Remember to set the ratio control and the gain control in the same position on the "slaves".Otherwise the stereo image could be shifted during compression.Theattack/release-control on the slaves will have no effect.The input/output capability of the side chain-circuit allows up to ten compressors to be linked together.They are connected in parallel with a standard1/4"stereo jack/-jack cord(tip:bus1,ring:bus 2).The two jack socket on the rear panel is connected in parallel and both are input/output.(980112)CONTROLS:GAIN:The gain control is used to"make up"for the gain loss,which takes place when the unit is compressing.It is placed after the gain-reduction circuitand therefore has no influence on the threshold setting.The gain-control iscontinuously variable from off to+30dB.RATIO:The ratio control varies the ratio by which the input signal is compressed.If the ratio selected is to2:1,and the input signal increases10dB,theoutput signal is only increased by5db.The ratio control is continuouslyvariable from2:1to10:1.THRESHOLD:The threshold is the point where the compressor begins its action.It isdefined as the point where the gain is reduced by1dB.The threshold is continuously variable from+20dBU to-40dBU. METER:The VU-meter switch has three positions:1.Input The meter is reading the level at the input socket.pressionThe VU-meter is reading gain reduction.Its rest position is"0VU",and the amount ofcompression is shown as a decreasing deflection indB.3.Output The VU-meter is reading the level at the output socket."0VU"is equivalent to+4dBU.NB:Leave the meter switch in position compression as it mightintroduce distortion if left in the input or output position.IN/OUT:This leverswitch switches the compressor in and out of the signal path.The out position bypasses the entire compressor.ATTACK:The attack control chooses how fast/slow the compressor responds to an increase in the input signal.The attack control is continuously variable from0.5to300milliseconds. RELEASE:The release control chooses how fast/slow the compressor responds to a decrease in the input signal.The release control is continuously variable from0,05to10seconds.(980112)ATTACK/RELEASE SELECT:This switch selects how the compressor reacts to an increase(attack)ordecrease(release)of the input signal.There are three settings of the switch:1.Fixed.Attack time:1msecRelease time:50msec2.Manual.Attack time:from0.5msec to300msecRelease time:from0.05sec to10sec3.Fix/man.This setting combines the release times of fixed and manualmode.The attack time is as in the fixed mode.The fix/man mode always has a fast attack,but it is possible to obtain a release time depending on the input signal,e.g.get a fast release when the peak disappears,then superseded shortly thereafter by the release time selected by the release control.From the time the peak disappears,until the selected release time takes over,is dependent upon the setting of the attack control.That is,the attack control changes function from a pure attack control,to a control of delay with the same time range.The more CW the attack control is turned,the longer time before the release controltakes over.The more CCW the attack control is turned,the shorter time before the release control takes over.This function is valid only if the time of the peak is shorter than the setting of the attack control. If the peak of the program is longer than the setting of the attack control,or if the attack control has reached the full CCW position,it will respond as in the manual mode.The fix/man mode acts as an automatic release function with a constant fast attack time and fast release time for short peaks and a longer release times for longer peaks.This setting is mainly intended for use on program material(overall compression).BUS SELECT:Interconnects several compressors on bus1or bus2.If the compressor is left in the off position,it works entirely independently.(980112)SUGGESTED APPLICATIONSOFTUBE-TECH COMPRESSOR CL1BIn the following,you will find suggestions on various applications of the TUBE-TECH compressorCL1B.They are given as a convenient guide to enable you to familiarise yourself with the different aspects of using the compressor.We have not mentioned specific settings of gain and threshold as they are dependent upon input levels.Instead we have specified how much compression in dB,we feel,is needed for the various examples.OVERALL COMPRESSION:FINAL MIXCOMPRESSION NEEDED:3-4dBAttack/release select:Fix/manAttack:2o'clockRelease:10o'clockRatio:9o'clockSTANDARD COMPRESSION:BASS,PIANO,GUITAR,KEYBOARDS AND VOCALSCOMPRESSION NEEDED:4-5dBAttack/release select:ManualAttack:2o'clockRelease:10o'clockRatio:10-2o'clockHEAVY COMPRESSION ON INSTRUMENTS:LINE GUITAR AND PIANOCOMPRESSION NEEDED:10dBAttack/release select:ManualAttack:7o'clockRelease:1o'clockRatio:3o'clockCOMPRESSION OF DRUMS:SNARE AND BASS DRUMCOMPRESSION NEEDED:2-3dBAttack/release select:FixedRatio:9-12o'clock(980112)ADJUSTMENT PROCEDURE:CAUTION:Before making any adjustment let the unit heat-up at least15min.Observe that the offset-voltage measured at the side chain jack socket,when the THRESHOLD is off,is not greater than+/-15mV DC in both position"fixed"and "manual".(tip is bus1and ring is bus2).If the voltage exceeds this value,replace either IC1or IC2.THE GRE SHALL BE MARKED BETWEEN1.225-1.285ADJUSTMENT OF BASIC GAIN:1)Apply a signal of1kHz,-30,0dBU into the input of the compressor.2)Turn the GAIN-control fully clockwise.3)Set the RATIO-control at2:14)Adjust the pre-set GAIN(located on amp/psu PCB)to an output-reading of0,0dBU.ADJUSTMENT OF COMPRESSION TRACKING:1)Turn the THRESHOLD-control fully counter-clockwise.2)Set the RATIO-control at2:1.3)Set the BUS-select-switch at1.4)Apply a signal of1kHz,0,0dBU into the input of the compressor.5)Adjust the GAIN-control to an output-reading of0,0dBU.6)Apply a DC-voltage of+250,0mV into the side chain jack socket(tip)and observe thatthe output level has dropped to-10,0dB.7)If this is not the case,adjust the level with P2(P1)*,to obtain a drop of exactly-10,0dB. *The trimpots in parenthesis refers to PCB870316-0,1,2(980810)ADJUSTMENT OF THE VU METER READING"COMPRESSION":1)Turn the THRESHOLD-control fully counter-clockwise.2)Switch the METER-selector to Compression.3)Set the RATIO-control at2:14)Apply a signal of1kHz,0,0dBU into the input of the compressor.5)Adjust the GAIN-control to an output-reading of0,0dBU.6)Adjust P4(P2)*until the meter is reading0VU.7)Apply a DC-voltage of+250,0mV into the side chain jack socket and observe that theoutput level has dropped to-10,0dBU.If this is not the case,adjust the compressiontracking(see above)8Adjust P3until the meter is reading-10,0VU.9)Remove the DC-voltage from the side chain jack socket.10)Repeat step6-9.NB:The VU-meter accuracy should be within+/-0,5dB when reading compression. ADJUSTMENT OF THE RELEASE CONTROL:1)Set the METER switch in position compression.2)Set the attack/release SELECT switch in position manual.3)Apply a signal of1kHz,0,0dBU into the input of the compressor.4)Adjust the THRESHOLD-control to a reading of-10VU of the VU-meter5)Set the ATTACK-control at fast.6)Set the RELEASE-control at slow.7)Switch off the1kHz and observe that the VU meter moves to0VU in approx.10sec.8)If this is not the case,adjust P1(P5)*,to obtain a release time of approximately10sec. *The trimpots in parenthesis refers to PCB870316-0,1,2(950119)Over view of the sidechain PCBPCB870316-0,1,2P2P3P1P50VU-10VU-10dB Rel.10Sec.PCB870316-3P4P3P2P10VU-10VU-10dB Rel10Sec.101115TECHNICAL SPECIFICATIONS CL1B:Input impedance:600OhmsOutput impedance:<60OhmsFrequency-response:5Hz-25kHz+0.5/-3dB Distortion THD@40Hz:0dBU:<0,15%10dBU:<0,15%maximum output(1%THD):+26,0dBUmaximum input(1%THD):+21,0dBUNoise Rg=200Ohm:Output Gain0dB+30dB Unweighted-85,0dBU-75,0dBUCCIR468-3-75,0dBU-65,0dBUCMRR@10KHz<-60dBGain:off to+30dBCompressorRatio:2:1to10:1Threshold:off to-40dBUAttack:0,5mS to300mSRelease:0,05S to10STracking between interconnected compressors:(0to30dB compression):<+/-1dBTubesECC821ECC831DimensionsHeight:3units132m m/5,2”Width:483m m/19”Depth:170m m/6,7”WeightNet:4,1Kg/9,0lbsShipping:5,9Kg/13,0lbsPower requirements@115V/230V AC,50-60Hz30-40WAll specifications at RL=600Lydkraft reserves the right to alter specifications without prior notice(051018jgp)。
杰恩-马里·布雷西集团新版产品说明书
d l d d l’ une ou
ans
’
au tre
e ces
eux m a
Байду номын сангаас
i[ d n zeres
e ra an n er
je ne pouvais
p 5 g uere m an quer de de la ire a ux u ns
’
M a ux autres .
ais des deux côtés le
u
c es
[aix
f f que n ous voyons con lamm ent oÉ efi
h p vées dans tous les ,
én om enes
d i q p p ue nous ne ouvons
as
outer qu
,
f j j£ ne
oient celles
que
E l’ tre
J Ç p i ’ a
été
atta qué
d ar ces
eux e ae-æ
J
f ces de P kila aplzes j t rouvé que e
p par ceux
ui ont
t rop va air les
fl ceux qu i ont
p { d ’ as a e
e cas
fl un e cle
immodére’ qu
f C f ont.
eux ci ont voulu per d ua er que
j e clzerclzais
détruire les preuves de
j D l’eàci lence de
LP365资料
TL H 5023LP265 LP365Micropower Programmable Quad ComparatorDecember 1994LP265 LP365Micropower Programmable Quad ComparatorGeneral DescriptionThe LP365consists of four independent voltage compara-tors The comparators can be programmed four at the same time for various supply currents input currents re-sponse times and output current drives This is accom-plished by connecting a single resistor between the V CC and I SET pinsThese comparators can be operated from split power sup-plies or from a single power supply over a wide range of voltages The input can sense signals at ground level even with single supply operation The unique output NPN tran-sistor stages are uncommitted to either power supply They can be connected directly to various logic system supplies so that they are highly flexible to interface with various logic familiesApplication areas include battery power circuits threshold detectors zero crossing detectors simple serial A D con-verters VCO multivibrators voltage converters power se-quencers and high performance V F converters and RTD linearizationFeaturesYSingle programming resistor to tailor power consump-tion input current speed and output current drive capabilityYWide single supply voltage range or dual supplies (4V DC to 36V DC or g 2 0V DC to g 18V DC )YLow supply current drain (10m A)and low power consumption (10m W comparator) I SET e 0 5m A V CC e 5VDCY Uncommitted output stage selectable output levels YOutput directly compatible with DTL TTL CMOS MOS or other special logic familiesY Input common-mode range includes groundYDifferential input voltage equal to the power supply voltageTypical Connection TL H 5023–1Programming EquationI SET e(V a )b (V b )b 1 3VR SETI SUPPLY 22c I SET Connection DiagramDual-In-Line PackageTL H 5023–2Order Number LP365M LP365AN or LP365N See NS Package Numbers M16A or N16AC 1995National Semiconductor Corporation RRD-B30M115 Printed in U S AAbsolute Maximum RatingsIf Military Aerospace specified devices are required please contact the National Semiconductor Sales Office Distributors for availability and specifications Supply Voltage36V DC or g18V DC Differential Input Voltage g36V DC Input Voltage(Note1)b0 3V to a36V DC Output Short Circuit to V E(Note2)Continuous V OUT with Respect to V E V E b7V s V OUT s V E a36V ESD Tolerance(Note10)2000VM Package N Package Power Dissipation(Note3)500mW500mW T j Max115 C115 C i jA115 C W90 C W Lead Temp(Soldering 10sec )260 C (Vapor Phase 60sec )215 C(Infrared 15sec )220 COperating Temp Range LP365 0 C s T A s a70 C Storage Temp Range b40 C s T A s a150 CElectrical Characteristics(Note4)Low power V S e5V I SET e10m ALP365A LP365Symbol Parameter ConditionsTested Design Tested Design Units Typ Limit Limit Typ Limit Limit(Limit) (Note5)(Note6)(Note5)(Note6)V OS Input Offset V CM e OV136369mVVoltage R S e100(Max)I OS Input Offset V CM e0V2205042575nACurrent LP265425150(Max)I B Input Bias V CM e0V10501251575200nACurrent LP2651575300(Max)A VOL Large Signal R L e100k50050503002525V mVVoltage Gain(Min)V CM Input Common-0000VMode Voltage(Max)Range3333V (Min)CMRR Common-Mode0s V CM s3V857570807570dBRejection Ratio(Min)PSRR Supply Voltage g2 5V s V S756565706565dBRejection Ratio s g3 5V(Min)I S Supply Current All Inputs e0V215250300225275300m AR L e%(Max) V OH Output Voltage V C e5VV High V E e0V 4 94 54 94 5(Min)R L e100kV OL Output Voltage V E e0V0 40 40 40 4VLow(Max)I SINK Output Sink V E e0V2 41 20 62 00 80 4mACurrent V O e0 4V(Min)I LEAK Output Leakage V C e5V250500021005000nACurrent V E e0V(Max)t R Response Time V CC e5VV E e0VR L e5k 44m sC L e10pF(Note7)2Electrical Characteristics(Continued)(Note8)High power V S e g15V I SET e100m ALP365A LP365Symbol Parameter Conditions Tested Design Tested Design UnitsTyp Limit Limit Typ Limit Limit(Limit) (Note5)(Note6)(Note5)(Note6)V OS Input Offset V CM e0V136369mVVoltage R S e100(Max)I OS Input Offset V CM e0V5501001090200nACurrent LP2651090500(Max)I B Input Bias V CM e0V6020050080300500nACurrent LP26580300800(Max)A VOL Large Signal R L e15k500100100500100100V mVVoltage Gain(Min)V CM Input Common-b15b15b15b15VMode Voltage(Max)Range13131313V (Min)CMRR Common-Mode b15V s V CM857570807570dBRejection Ratio s13V(Min)PSRR Supply Voltage g10V s V S807070757070dBRejection Ratio s g15V(Min)I S Supply Current All Inputs e0V 2 633 32 83 53 7mAR L e% LP2652 83 54 3(Max) V OH Output Voltage V C e5VV High V E e0V 4 94 54 94 5(Min)R L e100kV OL Output Voltage V E e0V0 40 40 40 4VLow(Max)I SINK Output Sink V E e0V1085 57 564mACurrent V O e0 4V(Min)I LEAK Output Leakage V C e15V55050005505000nACurrent V E eb15V(Max)t R Response Time V CC e5VV E e0VR L e5k 1 01 0m sC L e10pF(Note7)Note1 The input voltage is not allowed to go0 3V above V a or b0 3V below V b as this will turn on a parasitic transistor causing large currents to flow through the deviceNote2 Short circuits from the output to V a may cause excessive heating and eventual destruction The current in the output leads and the V E lead should not be allowed to exceed30mA The output should not be shorted to V b if V E s(V b)a7VNote3 For operating at elevated temperatures these devices must be derated based on a thermal resistance of i jA and T j max T j e T A a i jA P DNote4 Boldface numbers apply at temperature extremes All other numbers apply at T A e T j e25 C V a e5V V b e0V I SET e10m A R L e100k and V C e5V as shown in the Typical Connection diagramNote5 Guaranteed and100%production testedNote6 Guaranteed(but not100%production tested)over the operating temperature and supply voltage ranges These limits are not used to calculate out-going quality levelsNote7 The response time specified is for a100mV input step with5mV overdriveNote8 Boldface numbers apply at temperature extremes All other numbers apply at T A e T j e25 C V a e a15V V b eb15V I SET e100m A R L e100k and V C e5V as shown in the Typical Connection diagramNote9 See AN-450‘‘Surface Mounting Methods and Their Effect on Product Reliability’’for other methods of soldering surface mount devicesNote10 Human body model 1 5k X in series with100pF3Typical Performance CharacteristicsSupply Current vs I SET Supply Current vs SupplyVoltageSupply Current vsTemperatureInput Bias Current vs I SET Output Saturation Voltage Voltage Gain vs I SETResponse Time Negative Transition Response Time Positive TransitionResponse Time Negative TransitionResponse TimePositive TransitionTL H 5023–3 4Typical ApplicationsGated4-Phase OscillatorTL H 5023–4 f e20kHzf e11 6 R t C tAll four phases run when X is low When X is high oscillation stops and power drain is zero‘‘Voting’’ComparatorTL H 5023–5 If V E e0 25V then V OUT will be low if1of the3other outputs are low Choice of V E e0 50V causes V OUT to be low if2of the3other outputs are low V E e0 75V will cause V OUT to be low if all3other outputs are low5Typical Applications(Continued)Ordinary HysteresisTL H 5023–6 It is a good practice to add a few millivolts of positive feedback to prevent oscillation when the input voltage is near the thresholdHysteresis from EmitterTL H 5023–7 Positive feedback from the emitter can also prevent oscillations when V IN is near the thresholdBar-Graph DisplayTL H 5023–8 The positive feedback from pin16provides hysteresisLevel-Sensitive StrobeTL H 5023–9 Comparators B C and D do not respond until activated by the signal applied to comparator A6Typical Applications(Continued)Slow Op Amp(Inverter)TL H 5023–10 R B e V a 20m AUnlike most comparators the LP365can be used as an op amp if suitable R-C damping networks are usedSlow Op Amp(Unity-Gain Follower)TL H 5023–11 R B e V a 20m AThe LP365can also be used as a high-input-impedance follower-amplifier with the damping components shownChopping OutputsTL H 5023–12 Chopping the outputs by modulating the I SET current allows data to be trans-mitted via opto-couplers transformers etcLow Battery DetectorTL H 5023–13I S 6V e45m AI S 3 8V e1m Af e3kHzComparator A detects when the supply voltage drops to4V and enables comparator B to drive a piezoelectric alarm7Simplified SchematicTL H 5023–14 Current sources are programmed by I SETV E is common to all4comparators8Physical Dimensions inches(millimeters)Plastic Surface-Mount Package(M)Order Number LP365MNS Package Number M16A9L P 265 L P 365M i c r o p o w e r P r o g r a m m a b l e Q u a d C o m p a r a t o rPhysical Dimensions inches (millimeters)(Continued)Molded Dual-In-Line Package (N)Order Number LP365AN or LP365NNS Package Number N16ALIFE SUPPORT POLICYNATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMICONDUCTOR CORPORATION As used herein 1 Life support devices or systems are devices or 2 A critical component is any component of a life systems which (a)are intended for surgical implant support device or system whose failure to perform can into the body or (b)support or sustain life and whose be reasonably expected to cause the failure of the life failure to perform when properly used in accordance support device or system or to affect its safety or with instructions for use provided in the labeling can effectivenessbe reasonably expected to result in a significant injury to the userNational Semiconductor National Semiconductor National Semiconductor National Semiconductor CorporationEuropeHong Kong LtdJapan Ltd1111West Bardin RoadFax (a 49)0-180-530858613th Floor Straight Block Tel 81-043-299-2309。
- 1、下载文档前请自行甄别文档内容的完整性，平台不提供额外的编辑、内容补充、找答案等附加服务。
- 2、"仅部分预览"的文档,不可在线预览部分如存在完整性等问题,可反馈申请退款(可完整预览的文档不适用该条件!)。
- 3、如文档侵犯您的权益，请联系客服反馈,我们会尽快为您处理(人工客服工作时间：9:00-18:30)。
T-13/4 (5 mm), T-1 (3 mm),5 V olt, 12 Volt, Integrated Resistor LED Lamps Technical DataFeatures• Integral Current Limiting Resistor• TTL CompatibleRequires no External Current Limiter with 5 Volt/12 Volt Supply• Cost EffectiveSaves Space and Resistor Cost • Wide Viewing Angle • Available in All Colors Red, High Efficiency Red,Yellow, and High Performance Green in T-1 and T-13/4PackagesDescriptionThe 5 volt and 12 volt serieslamps contain an integral current limiting resistor in series with the LED. This allows the lamp to be driven from a 5 volt/12 volt source without an externalcurrent limiter. The red LEDs are made from GaAsP on a GaAs substrate. The High Efficiency Red and Yellow devices use GaAsP on a GaP substrate.The green devices use GaP on a GaP substrate. The diffused lamps provide a wide off-axis viewing angle.The T-13/4 lamps are provided with sturdy leads suitable for wire wrap applications. The T-13/4lamps may be front panelmounted by using the HLMP-0103clip and ring.Figure A. T-1 Package.Figure B. T-13/4 Package.Package DimensionsHLMP-1600, HLMP-1601HLMP-1620, HLMP-1621HLMP-1640, HLMP-1641HLMP-3600, HLMP-3601HLMP-3650, HLMP-3651HLMP-3680, HLMP-3681Note:1. θ1/2 is the off-axis angle at which the luminous intensity is 1/2 the axial luminous intensity.Part Numbering SystemHLMX-X6X X X X X XXMechanical Option00: Bulk01: Tape & Reel, Crimped Leads02: Tape & Reel, Straight LeadsA1,B1: Right Angle Housing, Uneven LeadsA2,B2: Right Angle Housing, Even LeadsColor Bin Options0: Full color bin distributionB: Color bin 2&3 onlyD: Color bin 4&5 onlyMaximum Iv Bin Options0: Open (No. max. limit)Others: Please refer to the Iv bin TableMinimum Iv Bin OptionsPlease refer to the Iv bin TableOperating Voltage0: 5 V1: 12 VColor Options0: GaP HER2,5: GaP Yellow4,8: GaP GreenPackage Options3: T-13/4 (5 mm)1: T-1 (3 mm)Notes:2. Derate from T A = 50°C at 0.071 V/°C, see Figure3.3. Derate from T A = 50°C at 0.086 V/°C, see Figure4.Electrical/Optical Characteristics at T A = 25°CHighEfficiency Red Yellow GreenTest Symbol Description Min.Typ.Max.Min.Typ.Max.Min.Typ.Max.Unit Condition λP Peak635583565nm Wavelengthλd Dominant626585569nm Note 4 Wavelength∆λ1/2Spectral Line403628nm HalfwidthRθJ-PIN Thermal290290290°C/W Junction to Resistance Cathode Lead(Note 6) RθJ-PIN Thermal210210210°C/W Junction to Resistance Cathode Lead(Note 7)I F Forward132013201320mA V F = 12 VCurrent12 V DevicesI F Forward101510151015mA V F = 5 VCurrent5 V DevicesηV Luminous145500595lumen Note 2 Efficacy/Watt V R Reverse 5.0 5.0 5.0V I R = 100 µA BreakdownVoltageNotes:4.The dominant wavelength, λd, is derived from the CIE chromaticity diagram and represents the single wavelength which defines thecolor of the device.5. Radiant intensity, I e, in watts/steradian, may be found from the equation I e = l V/ηV, where l V is the luminous intensity in candelas and ηV is the luminous efficacy in lumens/Watt.6. For Figure A package type.7. For Figure B package type.Figure 5. Relative Luminous Intensity vs. Angular Displacement for T-13/4 Package.Figure 4. Relative Luminous Intensity vs. Angular Displacement for T-1 Package.Figure 1. Forward Current vs. Applied Forward Voltage.5 Volt Devices.Figure 2. Forward Current vs. Applied Forward Voltage.12 Volt Devices.Figure 7. Relative Luminous Intensity vs. Applied Forward Voltage. 12 Volt Devices.Figure 6. Relative Luminous Intensity vs. Applied Forward Voltage. 5 Volt Devices.7Maximum tolerance for each bin limit is ±18%.Tolerance for each bin limit is ±0.5 nm.Mechanical Option MatrixMechanical Option Code Definition00Bulk Packaging, minimum increment 500 pcs/bag01Tape & Reel, crimped leads, minimum increment 1300 pcs/bag02Tape & Reel, straight leads, minimum increment 1300 pcs/bagA1T-1, Right Angle Housing, uneven leads, minimum increment 500 pcs/bagA2T-1, Right Angle Housing, even leads, minimum increment 500 pcs/bagB1T-13/4 Angle Housing, uneven lead, minimum increment 500 pcs/bagB2T-13/4 Angle Housing, even leads, minimum increment 500 pcs/bagNote: All categories are established for classification of products. Products may not be available in all categories. Please contact yourlocal Agilent representative for further clarification/information.Data subject to change.Copyright © 2001 Agilent Technologies, Inc.November 20, 2001Obsoletes 5988-2148EN5988-4732EN。