MAX3388ECUG中文资料

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MAX13085EESA-T中文资料

MAX13085EESA-T中文资料

General DescriptionThe MAX13080E–MAX13089E +5.0V, ±15kV ESD-protect-ed, RS-485/RS-422 transceivers feature one driver and one receiver. These devices include fail-safe circuitry,guaranteeing a logic-high receiver output when receiver inputs are open or shorted. The receiver outputs a logic-high if all transmitters on a terminated bus are disabled (high impedance). The MAX13080E–MAX13089E include a hot-swap capability to eliminate false transitions on the bus during power-up or hot insertion.The MAX13080E/MAX13081E/MAX13082E feature reduced slew-rate drivers that minimize EMI and reduce reflections caused by improperly terminated cables, allowing error-free data transmission up to 250kbps. The MAX13083E/MAX13084E/MAX13085E also feature slew-rate-limited drivers but allow transmit speeds up to 500kbps. The MAX13086E/MAX13087E/MAX13088E driver slew rates are not limited, making transmit speeds up to 16Mbps possible. The MAX13089E slew rate is pin selectable for 250kbps,500kbps, and 16Mbps.The MAX13082E/MAX13085E/MAX13088E are intended for half-duplex communications, and the MAX13080E/MAX13081E/MAX13083E/MAX13084E/MAX13086E/MAX13087E are intended for full-duplex communica-tions. The MAX13089E is selectable for half-duplex or full-duplex operation. It also features independently programmable receiver and transmitter output phase through separate pins.The MAX13080E–MAX13089E transceivers draw 1.2mA of supply current when unloaded or when fully loaded with the drivers disabled. All devices have a 1/8-unit load receiver input impedance, allowing up to 256transceivers on the bus.The MAX13080E/MAX13083E/MAX13086E/MAX13089E are available in 14-pin PDIP and 14-pin SO packages.The MAX13081E/MAX13082E/MAX13084E/MAX13085E/MAX13087E/MAX13088E are available in 8-pin PDIP and 8-pin SO packages. The devices operate over the com-mercial, extended, and automotive temperature ranges.ApplicationsUtility Meters Lighting Systems Industrial Control Telecom Security Systems Instrumentation ProfibusFeatures♦+5.0V Operation♦Extended ESD Protection for RS-485/RS-422 I/O Pins±15kV Human Body Model ♦True Fail-Safe Receiver While Maintaining EIA/TIA-485 Compatibility ♦Hot-Swap Input Structures on DE and RE ♦Enhanced Slew-Rate Limiting Facilitates Error-Free Data Transmission(MAX13080E–MAX13085E/MAX13089E)♦Low-Current Shutdown Mode (Except MAX13081E/MAX13084E/MAX13087E)♦Pin-Selectable Full-/Half-Duplex Operation (MAX13089E)♦Phase Controls to Correct for Twisted-Pair Reversal (MAX13089E)♦Allow Up to 256 Transceivers on the Bus ♦Available in Industry-Standard 8-Pin SO PackageMAX13080E–MAX13089E+5.0V , ±15kV ESD-Protected, Fail-Safe, Hot-Swap, RS-485/RS-422 Transceivers________________________________________________________________Maxim Integrated Products 1Ordering Information19-3590; Rev 1; 4/05For pricing, delivery, and ordering information,please contact Maxim/Dallas Direct!at 1-888-629-4642, or visit Maxim’s website at .Selector Guide, Pin Configurations, and Typical Operating Circuits appear at end of data sheet.Ordering Information continued at end of data sheet.M A X 13080E –M A X 13089E+5.0V , ±15kV ESD-Protected, Fail-Safe, Hot-Swap, RS-485/RS-422 Transceivers 2_______________________________________________________________________________________ABSOLUTE MAXIMUM RATINGSDC ELECTRICAL CHARACTERISTICS(V CC = +5.0V ±10%, T A = T MIN to T MAX , unless otherwise noted. Typical values are at V CC = +5.0V and T A = +25°C.) (Note 1)Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.(All Voltages Referenced to GND)Supply Voltage (V CC ).............................................................+6V Control Input Voltage (RE , DE, SLR,H/F , TXP, RXP)......................................................-0.3V to +6V Driver Input Voltage (DI)...........................................-0.3V to +6V Driver Output Voltage (Z, Y, A, B).............................-8V to +13V Receiver Input Voltage (A, B)....................................-8V to +13V Receiver Input VoltageFull Duplex (A, B)..................................................-8V to +13V Receiver Output Voltage (RO)....................-0.3V to (V CC + 0.3V)Driver Output Current.....................................................±250mAContinuous Power Dissipation (T A = +70°C)8-Pin SO (derate 5.88mW/°C above +70°C).................471mW 8-Pin Plastic DIP (derate 9.09mW/°C above +70°C).....727mW 14-Pin SO (derate 8.33mW/°C above +70°C)...............667mW 14-Pin Plastic DIP (derate 10.0mW/°C above +70°C)...800mW Operating Temperature RangesMAX1308_EC_ _.................................................0°C to +75°C MAX1308_EE_ _..............................................-40°C to +85°C MAX1308_EA_ _............................................-40°C to +125°C Junction Temperature......................................................+150°C Storage Temperature Range.............................-65°C to +150°C Lead Temperature (soldering, 10s).................................+300°CMAX13080E–MAX13089E+5.0V , ±15kV ESD-Protected, Fail-Safe, Hot-Swap, RS-485/RS-422 Transceivers_______________________________________________________________________________________3DC ELECTRICAL CHARACTERISTICS (continued)(V CC = +5.0V ±10%, T A = T MIN to T MAX , unless otherwise noted. Typical values are at V CC = +5.0V and T A = +25°C.) (Note 1)M A X 13080E –M A X 13089E+5.0V , ±15kV ESD-Protected, Fail-Safe, Hot-Swap, RS-485/RS-422 Transceivers 4_______________________________________________________________________________________DRIVER SWITCHING CHARACTERISTICSMAX13080E/MAX13081E/MAX13082E/MAX13089E WITH SRL = UNCONNECTED (250kbps)(V CC = +5.0V ±10%, T A = T MIN to T MAX , unless otherwise noted. Typical values are at V CC = +5.0V and T A = +25°C.)RECEIVER SWITCHING CHARACTERISTICSMAX13080E/MAX13081E/MAX13082E/MAX13089E WITH SRL = UNCONNECTED (250kbps)(V CC = +5.0V ±10%, T A = T MIN to T MAX , unless otherwise noted. Typical values are at V CC = +5.0V and T A = +25°C.)MAX13080E–MAX13089E+5.0V , ±15kV ESD-Protected, Fail-Safe, Hot-Swap, RS-485/RS-422 Transceivers_______________________________________________________________________________________5DRIVER SWITCHING CHARACTERISTICSMAX13083E/MAX13084E/MAX13085E/MAX13089E WITH SRL = V CC (500kbps)(V CC = +5.0V ±10%, T A = T MIN to T MAX , unless otherwise noted. Typical values are at V CC = +5.0V and T A = +25°C.)RECEIVER SWITCHING CHARACTERISTICSMAX13083E/MAX13084E/MAX13085E/MAX13089E WITH SRL = V CC (500kbps)(V CC = +5.0V ±10%, T A = T MIN to T MAX , unless otherwise noted. Typical values are at V CC = +5.0V and T A = +25°C.)M A X 13080E –M A X 13089E+5.0V , ±15kV ESD-Protected, Fail-Safe, Hot-Swap, RS-485/RS-422 Transceivers 6_______________________________________________________________________________________DRIVER SWITCHING CHARACTERISTICSMAX13086E/MAX13087E/MAX13088E/MAX13089E WITH SRL = GND (16Mbps)(V CC = +5.0V ±10%, T A = T MIN to T MAX , unless otherwise noted. Typical values are at V CC = +5.0V and T A = +25°C.)RECEIVER SWITCHING CHARACTERISTICSMAX13086E/MAX13087E/MAX13088E/MAX13089E WITH SRL = GND (16Mbps)(V CC = +5.0V ±10%, T A = T MIN to T MAX , unless otherwise noted. Typical values are at V CC = +5.0V and T A = +25°C.)Note 2:∆V OD and ∆V OC are the changes in V OD and V OC , respectively, when the DI input changes state.Note 3:The short-circuit output current applies to peak current just prior to foldback current limiting. The short-circuit foldback outputcurrent applies during current limiting to allow a recovery from bus contention.MAX13080E–MAX13089E+5.0V , ±15kV ESD-Protected, Fail-Safe, Hot-Swap, RS-485/RS-422 Transceivers_______________________________________________________________________________________70.800.901.501.101.001.201.301.401.60-40-10520-253550958011065125SUPPLY CURRENT vs. TEMPERATURETEMPERATURE (°C)S U P P L Y C U R R E N T (m A )0201040305060021345OUTPUT CURRENTvs. RECEIVER OUTPUT-HIGH VOLTAGEM A X 13080E -89E t o c 02OUTPUT HIGH VOLTAGE (V)O U T P U T C U R R E N T (m A )20104030605070021345OUTPUT CURRENTvs. RECEIVER OUTPUT-LOW VOLTAGEM A X 13080E -89E t o c 03OUTPUT LOW VOLTAGE (V)O U T P U T C U R R E N T (m A )4.04.44.24.84.65.25.05.4RECEIVER OUTPUT-HIGH VOLTAGEvs. TEMPERATURETEMPERATURE (°C)O U T P U T H I G H V O L T A G E (V )-40-10520-2535509580110651250.10.70.30.20.40.50.60.8RECEIVER OUTPUT-LOW VOLTAGEvs. TEMPERATURETEMPERATURE (°C)O U T P U T L O W V O L T A G E (V )-40-10520-25355095801106512502040608010012014016012345DRIVER DIFFERENTIAL OUTPUT CURRENT vs. DIFFERENTIAL OUTPUT VOLTAGEDIFFERENTIAL OUTPUT VOLTAGE (V)D I F FE R E N T I A L O U T P U T C U R R E N T (m A )2.02.82.43.63.24.44.04.8DRIVER DIFFERENTIAL OUTPUT VOLTAGE vs. TEMPERATURED I F FE R E N T I A L O U T P U T V O L T A G E (V )-40-10520-253550958011065125TEMPERATURE (°C)40201008060120140180160200-7-5-4-6-3-2-1012354OUTPUT CURRENT vs. TRANSMITTEROUTPUT-HIGH VOLTAGEOUTPUT HIGH VOLTAGE (V)O U T P U T C U R R E N T (m A )60402080100120140160180200042681012OUTPUT CURRENT vs. TRANSMITTEROUTPUT-LOW VOLTAGEOUTPUT-LOW VOLTAGE (V)O U T P U T C U R R E N T (m A )Typical Operating Characteristics(V CC = +5.0V, T A = +25°C, unless otherwise noted.)M A X 13080E –M A X 13089E+5.0V , ±15kV ESD-Protected, Fail-Safe, Hot-Swap, RS-485/RS-422 Transceivers 8_______________________________________________________________________________________21543679810SHUTDOWN CURRENT vs. TEMPERATUREM A X 13080E -89E t o c 10S H U T D O W N C U R R E N T (µA )-40-10520-253550958011065125TEMPERATURE (°C)600800700100090011001200DRIVER PROPAGATION DELAY vs. TEMPERATURE (250kbps)D R I VE R P R O P A G A T I O N D E L A Y (n s )-40-10520-253550958011065125TEMPERATURE (°C)300400350500450550600DRIVER PROPAGATION DELAY vs. TEMPERATURE (500kbps)D R I VE R P R O P A G A T I O N D E L A Y (n s )-40-10520-253550958011065125TEMPERATURE (°C)1070302040506080DRIVER PROPAGATION DELAY vs. TEMPERATURE (16Mbps)D R I VE R P R O P A G A T I O N D E L A Y (n s )-40-10520-253550958011065125TEMPERATURE (°C)40201008060120140160180RECEIVER PROPAGATION DELAYvs. TEMPERATURE (250kpbs AND 500kbps)R E C E I V E R P R O P A G A T I O N D E L A Y (n s )-40-10520-253550958011065125TEMPERATURE (°C)40201008060120140160180RECEIVER PROPAGATION DELAYvs. TEMPERATURE (16Mbps)R EC E I V E R P R O P A G AT I O N D E L A Y (n s )-40-10520-253550958011065125TEMPERATURE (°C)2µs/div DRIVER PROPAGATION DELAY (250kbps)DI 2V/divV Y - V Z 5V/divR L = 100Ω200ns/divRECEIVER PROPAGATION DELAY(250kbps AND 500kbps)V A - V B 5V/divRO 2V/divTypical Operating Characteristics (continued)(V CC = +5.0V, T A = +25°C, unless otherwise noted.)MAX13080E–MAX13089E+5.0V , ±15kV ESD-Protected, Fail-Safe, Hot-Swap, RS-485/RS-422 Transceivers_______________________________________________________________________________________9Test Circuits and Waveforms400ns/divDRIVER PROPAGATION DELAY (500kbps)DI 2V/divR L = 100ΩV Y - V Z 5V/div10ns/div DRIVER PROPAGATION DELAY (16Mbps)DI 2V/divR L = 100ΩV Y 2V/divV Z 2V/div40ns/divRECEIVER PROPAGATION DELAY (16Mbps)V B 2V/divR L = 100ΩRO 2V/divV A 2V/divTypical Operating Characteristics (continued)(V CC = +5.0V, T A = +25°C, unless otherwise noted.)Figure 2. Driver Timing Test CircuitM A X 13080E –M A X 13089E+5.0V , ±15kV ESD-Protected, Fail-Safe, Hot-Swap, RS-485/RS-422 Transceivers 10______________________________________________________________________________________Test Circuits and Waveforms (continued)Figure 4. Driver Enable and Disable Times (t DHZ , t DZH , t DZH(SHDN))DZL DLZ DLZ(SHDN)MAX13080E–MAX13089E+5.0V , ±15kV ESD-Protected, Fail-Safe, Hot-Swap, RS-485/RS-422 TransceiversTest Circuits and Waveforms (continued)Figure 6. Receiver Propagation Delay Test CircuitM A X 13080E –M A X 13089E+5.0V , ±15kV ESD-Protected, Fail-Safe, Hot-Swap, RS-485/RS-422 TransceiversMAX13080E–MAX13089E+5.0V , ±15kV ESD-Protected, Fail-Safe, Hot-Swap, RS-485/RS-422 TransceiversMAX13080E/MAX13083E/MAX13086EMAX13081E/MAX13084E/MAX13086E/MAX13087EFunction TablesM A X 13080E –M A X 13089E+5.0V , ±15kV ESD-Protected, Fail-Safe, Hot-Swap, RS-485/RS-422 Transceivers MAX13082E/MAX13085E/MAX13088EFunction Tables (continued)MAX13089EDetailed Description The MAX13080E–MAX13089E high-speed transceivers for RS-485/RS-422 communication contain one driver and one receiver. These devices feature fail-safe circuit-ry, which guarantees a logic-high receiver output when the receiver inputs are open or shorted, or when they are connected to a terminated transmission line with all dri-vers disabled (see the Fail-Safe section). The MAX13080E/MAX13082E/MAX13083E/MAX13085E/ MAX13086E/MAX13088E/MAX13089E also feature a hot-swap capability allowing line insertion without erroneous data transfer (see the Hot Swap Capability section). The MAX13080E/MAX13081E/MAX13082E feature reduced slew-rate drivers that minimize EMI and reduce reflec-tions caused by improperly terminated cables, allowing error-free data transmission up to 250kbps. The MAX13083E/MAX13084E/MAX13085E also offer slew-rate limits allowing transmit speeds up to 500kbps. The MAX13086E/MAX13087E/MAX13088Es’ driver slew rates are not limited, making transmit speeds up to 16Mbps possible. The MAX13089E’s slew rate is selectable between 250kbps, 500kbps, and 16Mbps by driving a selector pin with a three-state driver.The MAX13082E/MAX13085E/MAX13088E are half-duplex transceivers, while the MAX13080E/MAX13081E/ MAX13083E/MAX13084E/MAX13086E/MAX13087E are full-duplex transceivers. The MAX13089E is selectable between half- and full-duplex communication by driving a selector pin (H/F) high or low, respectively.All devices operate from a single +5.0V supply. Drivers are output short-circuit current limited. Thermal-shutdown circuitry protects drivers against excessive power dissi-pation. When activated, the thermal-shutdown circuitry places the driver outputs into a high-impedance state.Receiver Input Filtering The receivers of the MAX13080E–MAX13085E, and the MAX13089E when operating in 250kbps or 500kbps mode, incorporate input filtering in addition to input hysteresis. This filtering enhances noise immunity with differential signals that have very slow rise and fall times. Receiver propagation delay increases by 25% due to this filtering.Fail-Safe The MAX13080E family guarantees a logic-high receiver output when the receiver inputs are shorted or open, or when they are connected to a terminated transmission line with all drivers disabled. This is done by setting the receiver input threshold between -50mV and -200mV. If the differential receiver input voltage (A - B) is greater than or equal to -50mV, RO is logic-high. If (A - B) is less than or equal to -200mV, RO is logic-low. In the case of a terminated bus with all transmitters disabled, the receiv-er’s differential input voltage is pulled to 0V by the termi-nation. With the receiver thresholds of the MAX13080E family, this results in a logic-high with a 50mV minimumnoise margin. Unlike previous fail-safe devices, the-50mV to -200mV threshold complies with the ±200mVEIA/TIA-485 standard.Hot-Swap Capability (Except MAX13081E/MAX13084E/MAX13087E)Hot-Swap InputsWhen circuit boards are inserted into a hot or powered backplane, differential disturbances to the data buscan lead to data errors. Upon initial circuit board inser-tion, the data communication processor undergoes itsown power-up sequence. During this period, the processor’s logic-output drivers are high impedanceand are unable to drive the DE and RE inputs of these devices to a defined logic level. Leakage currents up to±10µA from the high-impedance state of the proces-sor’s logic drivers could cause standard CMOS enableinputs of a transceiver to drift to an incorrect logic level. Additionally, parasitic circuit board capacitance couldcause coupling of V CC or GND to the enable inputs. Without the hot-swap capability, these factors could improperly enable the transceiver’s driver or receiver.When V CC rises, an internal pulldown circuit holds DElow and RE high. After the initial power-up sequence,the pulldown circuit becomes transparent, resetting thehot-swap tolerable input.Hot-Swap Input CircuitryThe enable inputs feature hot-swap capability. At theinput there are two NMOS devices, M1 and M2 (Figure 9). When V CC ramps from zero, an internal 7µstimer turns on M2 and sets the SR latch, which alsoturns on M1. Transistors M2, a 1.5mA current sink, andM1, a 500µA current sink, pull DE to GND through a5kΩresistor. M2 is designed to pull DE to the disabledstate against an external parasitic capacitance up to100pF that can drive DE high. After 7µs, the timer deactivates M2 while M1 remains on, holding DE low against three-state leakages that can drive DE high. M1 remains on until an external source overcomes the required input current. At this time, the SR latch resetsand M1 turns off. When M1 turns off, DE reverts to a standard, high-impedance CMOS input. Whenever V CCdrops below 1V, the hot-swap input is reset.For RE there is a complementary circuit employing two PMOS devices pulling RE to V CC. MAX13080E–MAX13089E+5.0V, ±15kV ESD-Protected, Fail-Safe, Hot-Swap, RS-485/RS-422 TransceiversM A X 13080E –M A X 13089EMAX13089E ProgrammingThe MAX13089E has several programmable operating modes. Transmitter rise and fall times are programma-ble, resulting in maximum data rates of 250kbps,500kbps, and 16Mbps. To select the desired data rate,drive SRL to one of three possible states by using a three-state driver: V CC , GND, or unconnected. F or 250kbps operation, set the three-state device in high-impedance mode or leave SRL unconnected. F or 500kbps operation, drive SRL high or connect it to V CC .F or 16Mbps operation, drive SRL low or connect it to GND. SRL can be changed during operation without interrupting data communications.Occasionally, twisted-pair lines are connected backward from normal orientation. The MAX13089E has two pins that invert the phase of the driver and the receiver to cor-rect this problem. F or normal operation, drive TXP and RXP low, connect them to ground, or leave them uncon-nected (internal pulldown). To invert the driver phase,drive TXP high or connect it to V CC . To invert the receiver phase, drive RXP high or connect it to V CC . Note that the receiver threshold is positive when RXP is high.The MAX13089E can operate in full- or half-duplex mode. Drive H/F low, leave it unconnected (internal pulldown), or connect it to GND for full-duplex opera-tion. Drive H/F high for half-duplex operation. In full-duplex mode, the pin configuration of the driver and receiver is the same as that of a MAX13080E. In half-duplex mode, the receiver inputs are internally connect-ed to the driver outputs through a resistor-divider. This effectively changes the function of the device’s outputs.Y becomes the noninverting driver output and receiver input, Z becomes the inverting driver output and receiver input. In half-duplex mode, A and B are still connected to ground through an internal resistor-divider but they are not internally connected to the receiver.±15kV ESD ProtectionAs with all Maxim devices, ESD-protection structures are incorporated on all pins to protect against electro-static discharges encountered during handling and assembly. The driver outputs and receiver inputs of the MAX13080E family of devices have extra protection against static electricity. Maxim’s engineers have devel-oped state-of-the-art structures to protect these pins against ESD of ±15kV without damage. The ESD struc-tures withstand high ESD in all states: normal operation,shutdown, and powered down. After an ESD event, the MAX13080E–MAX13089E keep working without latchup or damage.ESD protection can be tested in various ways. The transmitter outputs and receiver inputs of the MAX13080E–MAX13089E are characterized for protec-tion to the following limits:•±15kV using the Human Body Model•±6kV using the Contact Discharge method specified in IEC 61000-4-2ESD Test ConditionsESD performance depends on a variety of conditions.Contact Maxim for a reliability report that documents test setup, test methodology, and test results.Human Body ModelFigure 10a shows the Human Body Model, and Figure 10b shows the current waveform it generates when dis-charged into a low impedance. This model consists of a 100pF capacitor charged to the ESD voltage of interest,which is then discharged into the test device through a 1.5k Ωresistor.IEC 61000-4-2The IEC 61000-4-2 standard covers ESD testing and performance of finished equipment. However, it does not specifically refer to integrated circuits. The MAX13080E family of devices helps you design equip-ment to meet IEC 61000-4-2, without the need for addi-tional ESD-protection components.+5.0V , ±15kV ESD-Protected, Fail-Safe, Hot-Swap, RS-485/RS-422 TransceiversThe major difference between tests done using the Human Body Model and IEC 61000-4-2 is higher peak current in IEC 61000-4-2 because series resistance is lower in the IEC 61000-4-2 model. Hence, the ESD with-stand voltage measured to IEC 61000-4-2 is generally lower than that measured using the Human Body Model. Figure 10c shows the IEC 61000-4-2 model, and Figure 10d shows the current waveform for IEC 61000-4-2 ESD Contact Discharge test.Machine Model The machine model for ESD tests all pins using a 200pF storage capacitor and zero discharge resis-tance. The objective is to emulate the stress caused when I/O pins are contacted by handling equipment during test and assembly. Of course, all pins require this protection, not just RS-485 inputs and outputs.Applications Information256 Transceivers on the BusThe standard RS-485 receiver input impedance is 12kΩ(1-unit load), and the standard driver can drive up to 32-unit loads. The MAX13080E family of transceivers has a1/8-unit load receiver input impedance (96kΩ), allowingup to 256 transceivers to be connected in parallel on one communication line. Any combination of these devices,as well as other RS-485 transceivers with a total of 32-unit loads or fewer, can be connected to the line.Reduced EMI and ReflectionsThe MAX13080E/MAX13081E/MAX13082E feature reduced slew-rate drivers that minimize EMI and reduce reflections caused by improperly terminated cables, allowing error-free data transmission up to250kbps. The MAX13083E/MAX13084E/MAX13085Eoffer higher driver output slew-rate limits, allowing transmit speeds up to 500kbps. The MAX13089E withSRL = V CC or unconnected are slew-rate limited. WithSRL unconnected, the MAX13089E error-free data transmission is up to 250kbps. With SRL connected toV CC,the data transmit speeds up to 500kbps. MAX13080E–MAX13089E+5.0V, ±15kV ESD-Protected, Fail-Safe, Hot-Swap, RS-485/RS-422 TransceiversM A X 13080E –M A X 13089ELow-Power Shutdown Mode (Except MAX13081E/MAX13084E/MAX13087E)Low-power shutdown mode is initiated by bringing both RE high and DE low. In shutdown, the devices typically draw only 2.8µA of supply current.RE and DE can be driven simultaneously; the devices are guaranteed not to enter shutdown if RE is high and DE is low for less than 50ns. If the inputs are in this state for at least 700ns, the devices are guaranteed to enter shutdown.Enable times t ZH and t ZL (see the Switching Characteristics section) assume the devices were not in a low-power shutdown state. Enable times t ZH(SHDN)and t ZL(SHDN)assume the devices were in shutdown state. It takes drivers and receivers longer to become enabled from low-power shutdown mode (t ZH(SHDN), t ZL(SHDN))than from driver/receiver-disable mode (t ZH , t ZL ).Driver Output ProtectionTwo mechanisms prevent excessive output current and power dissipation caused by faults or by bus contention.The first, a foldback current limit on the output stage,provides immediate protection against short circuits over the whole common-mode voltage range (see the Typical Operating Characteristics ). The second, a thermal-shut-down circuit, forces the driver outputs into a high-imped-ance state if the die temperature exceeds +175°C (typ).Line LengthThe RS-485/RS-422 standard covers line lengths up to 4000ft. F or line lengths greater than 4000ft, use the repeater application shown in Figure 11.Typical ApplicationsThe MAX13082E/MAX13085E/MAX13088E/MAX13089E transceivers are designed for bidirectional data commu-nications on multipoint bus transmission lines. F igures 12 and 13 show typical network applications circuits. To minimize reflections, terminate the line at both ends in its characteristic impedance, and keep stub lengths off the main line as short as possible. The slew-rate-lim-ited MAX13082E/MAX13085E and the two modes of the MAX13089E are more tolerant of imperfect termination.Chip InformationTRANSISTOR COUNT: 1228PROCESS: BiCMOS+5.0V , ±15kV ESD-Protected, Fail-Safe, Hot-Swap, RS-485/RS-422 TransceiversFigure 11. Line Repeater for MAX13080E/MAX13081E/MAX13083E/MAX13084E/MAX13086E/MAX13087E/MAX13089E in Full-Duplex Mode+5.0V, ±15kV ESD-Protected, Fail-Safe, Hot-Swap, RS-485/RS-422 TransceiversMAX13080E–MAX13089EM A X 13080E –M A X 13089E+5.0V , ±15kV ESD-Protected, Fail-Safe, Hot-Swap, RS-485/RS-422 TransceiversPin Configurations and Typical Operating CircuitsMAX13080E–MAX13089E+5.0V , ±15kV ESD-Protected, Fail-Safe, Hot-Swap, RS-485/RS-422 Transceivers______________________________________________________________________________________21Pin Configurations and Typical Operating Circuits (continued)M A X 13080E –M A X 13089E+5.0V , ±15kV ESD-Protected, Fail-Safe, Hot-Swap, RS-485/RS-422 Transceivers 22______________________________________________________________________________________Ordering Information (continued)MAX13080E–MAX13089E+5.0V , ±15kV ESD-Protected, Fail-Safe, Hot-Swap, RS-485/RS-422 Transceivers______________________________________________________________________________________23Package Information (continued)(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,go to /packages .)。

MAX3490摘出资料(部分中文)

MAX3490摘出资料(部分中文)

MAX3488, MAX3490,MAX3491 功能,全双工通信,而 MAX3483, MAX3485, MAX3486是专为半双工通信。

单一的电源供应,没有电荷注入;具有+ 5V 逻辑电源互操作;最大偏斜为 8ns ; 2ns 低电流掉电模式;共模输入电压范围:—7〜+ 12V ,总线上允许多达 32个收发器;全双工和半双工版本;具有电流限制和热 关机驱动器过载保护驱动器具有短路电流限制和对功耗过大的保护,热关断电路,驱动器输岀置于高阻抗状态。

接收器输入具 有故障安全功能,保证逻辑高输岀,如果两个输入端开路。

选择MAX3490做RS-422,下图为 MAX3490引脚图1 ——VCC2―― RO 接收器输出 3―― DI 驱动器输入 4 ——GND 5 ---- Y 同相驱动器输出 6 ---- Z 反相驱动器输出 7 ---- B反相接收器输入8——A 同相接收器输入保证数据传输速率(Mbps ) 10电源电压(V ) to 半/全双工 全双工摆率限制 无 驱动器/接收器使 无 关断电流(NA )关断时无引脚数8频率大,高频谐波明显MAX3490没有接收器发送器使能,控制逻辑如下图Dences 宙Rhouf Receiver/Driver Enable(MAX3488/MAX349a}T^ble 3. Transmitting T^able 4. ReceivingMAX3490 (无RE 、DE 引脚)绝对最大额定值如下图:IN^UTOUTPUTSDI zY 1 D 1 □1INPUTSOUTPUTA. 6 RO *D.2V1 <-a.2v0 Inputs Open1□IP/SOE L叵叵DABSOLUTE MAXIMUM RATINGSS U P P 卜F \ 01 ^3 9 e l\/ kill ■ ■ ■ ■ ■■!■■■■■■ iri ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■■ ■ ■ ■ ■ ■ i ■ ■ ■ r ■ ■ ■ ■ ■ ■ ■Control IrpiJ ValLage (RE, D£) ............... .......... ............... -0.3V ta 7V□rtvsr Inpul Voltage (6l).............. .......... .......... ............... -0.3Vtn 7VOnvar Output VcItaQ* (A,気V, ZX - ......................... -7J5V to12.SVftccer^CF Input VaKagc |A, B) . -7.5V to )2 5VReceiver Ojtput Voltage (RO) . . -O.3Vto (Vcc * 0 3V)Gontinucus Power g$ipmTk?n (T R= +70芒|各Pin Pi/Mc DIP 忖申rate 9 09mWU above +70© 72?mW8-Pin SO (<1HW 5 aarrrtVy «bove +7C P C), 471mW14-Rn Plastic DlP(de<m© 10mW fl C above +70忙》... HOOtrMf14-Rn SO (deia1^ fl.SSmW.^C abaw +70*C> __________ UUJllMfOperating Temperalur?MAXU C .............. ......... *........ ... ..................... -.Ot:to +7[TCMAX3d_ _E__”…lh.. “一,. ,.H.…““-“,-H.⑷乜B +85\:Storage Temperafur? Range lo +16[yCbead Tempeiature [wldering lOlMC)..................................... +XD*CMAX3490驱动器的开关特性如下图:DRIVER SWITCHING CHARACTERISTICS-MAX3465h MAX14$0, and MAX3491ri^E:» 3.3M a T*w *25*CJPARAMtFER CONCilTICNS m TVP MA 9(UNITSDrrwf OHtreftfiii OdljMjt Del叩g■ Sdll, Figure 7 122M mDrvcr Wfe-oEiii Ckrlp ui T M7»C r Time hno良L * fiOtl, Flpm 71&25mEtr p临他n M■丫LCfflMCHHiah Lrvtl IpiLM R L * 37(1. F4l/*a T2235m轉、ion Delay Hl0hi&-Lew Leveli IpML R. - ZTflFiflWWE■Jr22 35tp L n - iPHitl □越g*曲m Dtt&Ff吕的却iH^ie S- IPDS R.fc• 27n, FipL<eS E mDRIVER OUTPUT ENABLEJOIS^BLE TIMES {IWS-iflS'IMLW3-431 聞切Dmw CXJtput tnable r me I Q L OW LE^el tfZL Ri= 110SL f^FLFa 10 45 M OEDiwci" OulpiJl EiwN? Trne tg High Len el S FZH Ri ■ 110(1 钿ure $ 45raDrw CMp讥04»^le Time tom Migih Level fi t* 11(X1. F»flL*t940 to POriw D・*l・ Tim from LwLwi tpLE R L* 11IMI. i&40 BO mDTM< dip Lit Errtb^A Tiffii Au墟电叭旳Lx L#v4l tm Rl ■匚如i 10<8W gm 他Qrta&r ErrtBifi Titre frw 电靜©询|a H(;h 4PCH R; - 1inni FigiLiraS®o r»MAX3490CPA(TCto +70'Q8 Ptasttc DIPMAX349OCSA(TCt口+7D B C\8 SOMAX3490C/D crcto+70e c \Dice'MAX349OEPA-4(rc to +85X8 Plastic DIPMAX349OESA■40X10+9598 SOMAX3490引脚配置与典型工作电路,如下图|l巒4e 2 MAA J4ML JWAJC3啲Pin 8 两#挪询事呵Typ"C^ uftMOTE AEANODE O 8LXF砂*师悶ZKSQW诂沖盟F训卜皿咻斥$钵自Ncrv^OfU MAX3490封装尺寸L -15^ Plastic DIPPLASTIC DU AL-IN-LINE PACKAGE(0.300 in.)DIM [HOMES MLLlWETESS MIN MAA MIN MAXA a 200A1ocn&-■"20 12& C 175 3104-iS *3 0D5& Q0» 1.402W0.01S a 022 041 OKoo^ 1 MC DQOB0 0120200 30 &1D0Q&0 09001328E0.300 0 925 A2A E10咖0 310dia7VT e OJOO■■eA D.3H)■*tB Q4P0 10 16 L 0 IU a iso 2923J1 PINSMCHES MJJME1TER3-MN NUM MNI MAXa 0 3430 w BM 891 0140^3513-6719-43 ET lir o.-«Q -B51: 911&.43 010MBS 0i1522 4B 23.24 020 101S104535742454□24 1 14H2B52S DE37 13。

MAX038中文资料

MAX038中文资料

MAX038中⽂资料
MAX038 频率⾼、精度好,因此它被称为⾼频精密函数信号发⽣器IC。

在锁相环、压控振荡器、频率合成器、脉宽调制器等电路的设计上,MAX038 都是优选的器件。

其内部电路框图如图1 所⽰。

MAX038 的性能特点:
1)能精密地产⽣三⾓波、锯齿波、矩形波(含⽅波)、正弦波信号。

2)频率范围从0.1Hz~20MHz,最⾼可达40MHz,各种波形的输出幅度均为2V(P-P)。

3)占空⽐调节范围宽,占空⽐和频率均可单独调节,⼆者互不影响,占空⽐最⼤调节范围是10%~90%。

4)波形失真⼩,正弦波失真度⼩于0.75%,占空⽐调节时⾮线性度低于2%。

5)采⽤±5V 双电源供电,允许有5%变化范围,电源电流为80mA,典型功耗400mW,⼯作温度范围为0~70℃。

6)内设2.5V 电压基准,可利⽤该电压设定FADJ、DADJ 的电压值,实现频率微调和占空⽐调节。

MAX038 采⽤DIP-20 封装形式,引脚图如下图所⽰,各管脚的功能如表1 所⽰。

表1MAX038 的管脚功能
注:表中5 个地内部不相连,需外部连接。

MA038极限参数
应⽤电路设计请点击查看: 采⽤MAX038的信号发⽣器电路图具有三种输出波形的函数信号发⽣器电路图(10Hz-10MHz)。

MAX038中文

MAX038中文

MAX038芯片中文资料及在波形发生器中的应用(1)简介:波形发生器的应用范围很广。

在分析检测设备、超声设备、医疗设备及通讯设备中广泛应用。

函数发生器作为信号激励源,其参数精度是设计时应考虑的重要因素 ...波形发生器的应用范围很广。

在分析检测设备、超声设备、医疗设备及通讯设备中广泛应用。

函数发生器作为信号激励源,其参数精度是设计时应考虑的重要因素。

常用的波形产生电路有RC震荡电路、LC震荡电路、文氏震荡电路以及由555芯片构成的震荡电路等,但这些震荡电路由于核心芯片、选频及限幅元件特性的限制,在幅频精度方面或多或少的存在着不稳定或实现电路复杂等情况。

如果需要实现波形变换、幅频大小调整以及提高幅频的稳定度,设计的外围电路将会变得更为复杂。

由MAX038设计组成的波形产生电路能够输出幅频精度很高且易于调整的波形信号,在电路参数要求苛刻的工作场合能够得到较好的应用。

1 芯片功能介绍1.1 MAX038芯片的性能特点MAX038CPP芯片采用20引脚DIP封装,引脚图如图1所示。

各引脚功能简述如下:REF:芯片内部2.5 V参考电压输出;GND:模拟地;A1,A0:输出波形选择,TTL/CMOS兼容;COSC:内部震荡器外接电容;FADJ,DADJ:输出频率、占空比调节;IIN:震荡频率控制器电流输入;PDI,PDO:内部鉴相器输入、输出;SYNC:同步信号输出,允许内部震荡器与外电路同步;DGND,DV+:内部数字电路电源;V+,V-:MAX038电源(+5 V,-5 V);OUT:波形输出端。

MAX038芯片附加少许外围电路就能够产生三角波、锯齿波、正弦波、方波、矩形脉冲波形。

该芯片具有如下的功能特点:(1)输出频率范围:0.1~20 MHz,最高可达40 MHz:(2)输出波形占空比(15%~85%)独立可调,占空比可由DADJ端调整,如果DADJ 端接地,则输出占空比为50%;(3)具有低输出阻抗的输出缓冲器,输出阻抗的典型值为0.1 Ω;(4)备有TTL兼容的独立同步信号SYNC(方波输出,固定占空比为50%),方便组建频率合成器系统;(5)低温度漂移。

MAX338ESE+中文资料

MAX338ESE+中文资料

MAX338EPE -40°C to +85°C 16 Plastic DIP
MAX338ESE -40°C to +85°C 16 Narrow SO
MAX338EJE -40°C to +85°C 16 CERDIP
MAX338MJE -55°C to +125°C 16 CERDIP**
Ordering Information continued at end of data sheet. *Contact factory for dice specifications. **Contact factory for availability.
元器件交易网
19-0272; Rev 3; 11/04
MAX338/MAX3ห้องสมุดไป่ตู้9
8-Channel/Dual 4-Channel, Low-Leakage, CMOS Analog Multiplexers
General Description
The MAX338/MAX339 are monolithic, CMOS analog multiplexers (muxes). The 8-channel MAX338 is designed to connect one of eight inputs to a common output by control of a 3-bit binary address. The dual, 4channel MAX339 is designed to connect one of four inputs to a common output by control of a 2-bit binary address. Both devices can be used as either a mux or a demux. On-resistance is 400Ω max, and the devices conduct current equally well in both directions.

MCZ33883EGR2资料

MCZ33883EGR2资料

Document Number: MC33883Rev 9.0, 1/2007Freescale Semiconductor Advance Information* This document contains certain information on a new product.Specifications and information herein are subject to change without notice.© Freescale Semiconductor, Inc., 2007. All rights reserved.H-Bridge Gate Driver ICThe 33883 is an H-bridge gate driver (also known as a full-bridge pre-driver) IC with integrated charge pump and independent high-•V CC •V CC2••••••••Figure 1. 33883 Simplified Application Diagram33883Analog Integrated Circuit Device Data33883INTERNAL BLOCK DIAGRAMINTERNAL BLOCK DIAGRAMFigure 2. 33883 Simplified Internal Block DiagramUndervolt-age/Over-voltageG_ENIN_HS1IN_LS1IN_HS2IN_LS2GATE_LS1SRC_HS1GATE_HS CP_OUTLR_OUTGATE_LS2SRC_HS2GATE_HS Pulse GeneratorV DD / V CC Level ShiftPulse GeneratorV DD / V POS Level ShiftIN OUCon-trol a nd LogicLinearReg V CC2EN GND +5.0 V+14.5 V V DDHIGH- AND LOW-SIDECharge PumpEN GNDC2V POSV CCC1V CC2V CCV CCV CC2VCC VCC2CP_OUTLR_OUT V CC, V CC2V DDC2C1BRG_ENPulse GeneratorV DD / V CC Level ShiftPulse GeneratorV DD / V POS Level ShiftGND CONTROL WITH CHARGE PUMPCP_OUTV CCOutputDriverIN OUCP_OUTV CCOutputDriverIN OULR_OUTOutputDriverIN OULR_OUTOutputDriverCon-trol a nd LogicCon-trol a nd LogicCon-trol a nd LogicBRG_ENBRG_ENBRG_ENHIGH-SIDE CHANNELLOW-SIDE CHANNELHIGH-SIDE CHANNELLOW-SIDE CHANNELGND2GND2GND1GND GND_GND2GND_AT SD 1Thermal ShutdownT SD 1T SD 1T SD 2Thermal ShutdownT SD 2T SD 2Analog Integrated Circuit Device Data 33883TERMINAL CONNECTIONSFigure 3. 33883 20-SOICW Terminal ConnectionsTable 1. 20-SOICW Terminal DefinitionsA functional description of each terminal can be found in the FUNCTIONAL TERMINAL DESCRIPTION section beginning on page 10.TerminalTerminal Name Formal Name Definition1VCC Supply Voltage 1Device power supply 1.2C2Charge Pump Capacitor External capacitor for internal charge pump.3CP_OUT Charge Pump Out External reservoir capacitor for internal charge pump.4SRC_HS1Source 1 Output High Side Source of high-side 1 MOSFET 5GATE_HS 1Gate 1 Output High Side Gate of high-side 1 MOSFET.6IN_HS1Input High Side 1 Logic input control of high-side 1 gate (i.e., IN_HS1 logic HIGH = GATE_HS1 HIGH).7IN_LS1Input Low Side 1Logic input control of low-side 1 gate (i.e., IN_LS1 logic HIGH = GATE_LS1 HIGH).8GATE_LS1Gate 1 Output Low Side Gate of low-side 1 MOSFET. 9GND1Ground 1Device ground 1.10LR_OUT Linear Regulator Output Output of internal linear regulator.11VCC2Supply Voltage 2Device power supply 2.12GND_A Analog GroundDevice analog ground.13C1Charge Pump Capacitor External capacitor for internal charge pump.14GND2Ground 2Device ground 2.15GATE_LS2Gate 2 Output Low Side Gate of low-side 2 MOSFET.16IN_LS2Input Low Side 2Logic input control of low-side 2 gate (i.e., IN_LS2 logic HIGH = GATE_LS2 HIGH). 17IN_HS2Input High Side 2 Logic input control of high-side 2 gate (i.e., IN_HS2 logic HIGH = GATE_HS2 HIGH).18GATE_HS 2Gate 2 Output High Side Gate of high-side 2 MOSFET. 19SRC_HS2Source 2 Output High Side Source of high-side 2 MOSFET.20G_ENGlobal EnableLogic input Enable control of device (i.e., G_EN logic HIGH = Full Operation, G_EN logic LOW = Sleep Mode).Analog Integrated Circuit Device Data33883ELECTRICAL CHARACTERISTICS MAXIMUM RATINGSELECTRICAL CHARACTERISTICSMAXIMUM RATINGSTable 2. Maximum RatingsAll voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent damage to the device.RatingSymbolValueUnitELECTRICAL RATINGS Supply Voltage 1V CC -0.3 to 65V Supply Voltage 2 (1)V CC2-0.3 to 35V Linear Regulator Output VoltageV LR_OUT -0.3 to 18V High-Side Floating Supply Absolute Voltage V CP_OUT -0.3 to 65V High-Side Floating Source VoltageV SRC_HS-2.0 to 65V High-Side Source Current from CP_OUT in Switch ON State I S 250mA High-Side Gate VoltageV GATE_HS -0.3 to 65V High-Side Gate Source Voltage (2)V GATE_HS - V SRC_HS -0.3 to 20V High-Side Floating Supply Gate Voltage V CP_OUT - V GATE_HS -0.3 to 65V Low-Side Gate Voltage V GATE_LS -0.3 to 17V Wake-Up Voltage V G_EN -0.3 to 35V Logic Input VoltageV IN -0.3 to 10V Charge Pump Capacitor Voltage V C1-0.3 to V LR_OUTV Charge Pump Capacitor Voltage V C2-0.3 to 65V ESD Voltage (3)Human Body Model on All Pins (V CC and V CC2 as Two Power Supplies) Machine ModelV ESD1V ESD2±1500±130VNotes1.V CC2 can sustain load dump pulse of 40 V, 400 ms,2.0 Ω.2.In case of high current (SRC_HS >100 mA) and high voltage (>20 V) between GATE_HSX and SRC_HS an external zener of 18 V isneeded as shown in Figure 14.3.ESD1 testing is performed in accordance with the Human Body Model (C ZAP =100 pF, R ZAP =1500 Ω), ESD2 testing is performed inaccordance with the Machine Model (C ZAP =200 pF, R ZAP =0Ω).Analog Integrated Circuit Device Data 33883ELECTRICAL CHARACTERISTICSMAXIMUM RATINGSPower Dissipation and Thermal Characteristics Maximum Power Dissipation @ 25°C Thermal Resistance (Junction to Ambient)Operating Junction Temperature Storage TemperatureP D R θJA T J T STG 1.25100-40 to 150-65 to 150W °C / W °C °C Peak Package Reflow Temperature During Reflow (4), (5)T PPRTNote 5°CNotes4.Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits maycause malfunction or permanent damage to the device.5.Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package ReflowTemperature and Moisture Sensitivity Levels (MSL),Go to , search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.Table 2. Maximum RatingsAll voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent damage to the device.RatingSymbolValueUnitAnalog Integrated Circuit Device Data33883ELECTRICAL CHARACTERISTICSSTATIC ELECTRICAL CHARACTERISTICSSTATIC ELECTRICAL CHARACTERISTICSTable 3. Static Electrical CharacteristicsCharacteristics noted under conditions V CC = 12 V, V CC2 = 12 V, C CP = 33 nF, G_EN = 4.5 V unless otherwise noted. Typical values noted reflect the approximate parameter means at T A = 25°C under nominal conditions unless otherwise noted.CharacteristicSymbolMinTypMaxUnitOPERATING CONDITIONSSupply Voltage 1 for Output High-Side Driver and Charge Pump V CC 5.5–55V Supply Voltage 2 for Linear Regulation V CC2 5.5–28V High-Side Floating Supply Absolute VoltageV CP_OUTV CC +4–V CC + 11 but < 65VLOGICLogic 1 Input Voltage (IN_LS and IN_HS) V IH 2.0–10V Logic 0 Input Voltage (IN_LS and IN_HS) V IL ––0.8V Logic 1 Input Current V IN = 5.0 VI IN+200–1000µAWake-Up Input Voltage (G_EN)V G_EN 4.55.0V CC2V Wake-Up Input Current (G_EN) V G_EN = 14 VI G_EN–200500µAWake-Up Input Current (G_EN) V G_EN = 28 V I G_EN2––1.5mALINEAR REGULATOR Linear RegulatorV LR_OUT @ V CC2 from 15 V to 28 V, I LOAD from 0 mA to 20 mA V LR_OUT @ I LOAD = 20 mAV LR_OUT @ I LOAD = 20 mA, V CC2 = 5.5 V, V CC = 5.5 V V LR_OUT12.5V CC2 - 1.54.0–––16.5––VCHARGE PUMPCharge Pump Output Voltage, Reference to VCC V CC = 12 V, I LOAD = 0 mA, C CP_OUT = 1.0 µF V CC = 12 V, I LOAD = 7.0 mA, C CP_OUT = 1.0 µF V CC2 = V CC = 5.5 V, I LOAD = 0 mA, C CP_OUT = 1.0 µF V CC2 = V CC = 5.5 V, I LOAD = 7.0 mA, C CP_OUT = 1.0 µF V CC = 55 V, I LOAD = 0 mA, C CP_OUT = 1.0 µF V CC = 55 V, I LOAD = 7.0 mA, C CP_OUT = 1.0 µFV CP_OUT7.57.02.31.87.57.0––––––––––––VPeak Current Through Pin C1 Under Rapidly Changing VCC Voltages (see Figure 13, page 17)I C1-2.0– 2.0AMinimum Peak Voltage at Pin C1 Under Rapidly Changing VCC Voltages (see Figure 13, page 17)V C1MIN -1.5––VAnalog Integrated Circuit Device Data 33883ELECTRICAL CHARACTERISTICSSTATIC ELECTRICAL CHARACTERISTICSSUPPLY VOLTAGEQuiescent VCC Supply Current V G_EN = 0 V and V CC = 55 V V G_EN = 0 V and V CC = 12 V IV CCSLEEP––––1010µAOperating VCC Supply Current (6)V CC = 55 V and V CC2 = 28 V V CC = 12 V and V CC2 = 12 VIV CCOP––2.20.7––mAAdditional Operating V CC Supply Current for Each Logic Input Terminal ActiveV CC = 55 V and V CC2 = 28 V (7)IV CCLOG––5.0mAQuiescent VCC2 Supply Current V G_EN = 0 V and V CC = 12 V V G_EN = 0 V and V CC = 28 V IV CC2SLEEP––––5.05.0µAOperating VCC2 Supply Current (6) V CC = 55 V and V CC2 = 28 V V CC = 12 V and V CC2 = 12 VIV CC2OP––––129.0mA Additional Operating VCC2 Supply Current for Each Logic Input Terminal ActiveV CC = 55 V and V CC2 = 28 V (7) IV CC2LOG–– 5.0mAUndervoltage Shutdown VCC UV 4.0 5.0 5.5V Undervoltage Shutdown VCC2 (8)UV2 4.0 5.0 5.5V Overvoltage Shutdown VCC OV 576165V Overvoltage Shutdown VCC2OV229.53135VOUTPUTOutput Sink Resistance (Turned Off)I discharge LSS = 50 mA , V SRC_HS = 0 V (8)R DS––22ΩOutput Source Resistance (Turned On)I charge HSS = 50 mA, V CP_OUT = 20 V (8)R DS––22ΩCharge Current of the External High-Side MOSFET Through GATE_HSn Terminal (9)I CHARGE HSS–100200mAMaximum Voltage (V GATE_HS - V SRC_HS ) INH = Logic 1, I S max = 5.0 mAVMAX––18VNotes6.Logic input terminal inactive (high impedance).7.High-frequency PWM-ing (» 20 kHz) of the logic inputs will result in greater power dissipation within the device. Care must be taken to remain within the package power handling rating.8.The device may exhibit predictable behavior between 4.0 V and 5.5 V.9.See Figure 5, page 12, for a description of charge current.Table 3. Static Electrical Characteristics (continued)Characteristics noted under conditions V CC = 12 V, V CC2 = 12 V, C CP = 33 nF, G_EN = 4.5 V unless otherwise noted. Typical values noted reflect the approximate parameter means at T A = 25°C under nominal conditions unless otherwise noted.CharacteristicSymbol Min Typ Max UnitAnalog Integrated Circuit Device Data33883ELECTRICAL CHARACTERISTICSDYNAMIC ELECTRICAL CHARACTERISTICSDYNAMIC ELECTRICAL CHARACTERISTICSTable 4. Dynamic Electrical CharacteristicsCharacteristics noted under conditions 7.0 V ≤ V SUP ≤ 18 V, -40°C ≤ T A ≤ 125°C, GND = 0.0 V unless otherwise noted. Typical values noted reflect the approximate parameter means at T A = 25°C under nominal conditions unless otherwise noted.CharacteristicSymbolMinTypMaxUnitTIMING CHARACTERISTICSPropagation Delay High Side and Low SideC LOAD = 5.0 nF, Between 50% Input to 50% Output (10) (see Figure 4) t PD–200300nsTurn-On Rise TimeC LOAD = 5.0 nF, 10% to 90% (10), (11) (see Figure 4) t R–80180ns Turn-Off Fall TimeC LOAD = 5.0 nF, 10% to 90% (10), (11) (see Figure 4)t F–80180ns10.C LOAD corresponds to a capacitor between GATE_HS and SRC_HS for the high side and between GATE_LS and ground for low side. 11.Rise time is given by time needed to change the gate from 1.0 V to 10 V (vice versa for fall time).Analog Integrated Circuit Device Data 33883TIMING DIAGRAMSTIMING DIAGRAMSFigure 4. Timing Characteristics50%50%t fIN_HS GATE_HS 50%50%t pdt pdt ror IN_LS or GATE_LSAnalog Integrated Circuit Device Data33883FUNCTIONAL DESCRIPTION INTRODUCTIONFUNCTIONAL DESCRIPTIONINTRODUCTIONThe 33883 is an H-bridge gate driver (or full-bridge pre-driver) with integrated charge pump and independent high- and low-side driver channels. It has the capability to drivelarge gate-charge MOSFETs and supports high PWM frequency. In sleep mode its supply current is very low.FUNCTIONAL TERMINAL DESCRIPTIONSUPPLY VOLTAGE TERMINALS (VCC AND VCC2)The VCC and VCC2 terminals are the power supply inputs to the device. V CC is used for the output high-side drivers and the charge pump. V CC2 is used for the linear regulation. They can be connected together or independent with different voltage values. The device can operate with V CC up to 55 V and V CC2 up to 28 V.The VCC and VCC2 terminals have undervoltage (UV) and overvoltage (OV) shutdown. If one of the supply voltage drops below the undervoltage threshold or rises above the overvoltage threshold, the gate outputs are switched LOW in order to switch off the external MOSFETs. When the supply returns to a level that is above the UV threshold or below the OV threshold, the device resumes normal operationaccording to the established condition of the input terminals.INPUT HIGH- AND LOW-SIDE TERMINALS (IN_HS1, IN_HS2, AND IN_LS1, IN_LS2)The IN_HSn and IN_LSn terminals are input control terminals used to control the gate outputs. These terminals are 5.0 V CMOS-compatible inputs with hysteresis. IN_HSn and IN_LSn independently control GATE_HSn and GATE_LSn, respectively.During wake-up, the logic is supplied from the G_EN terminal. There is no internal circuit to prevent the external high-side and low-side MOSFETs from conducting at the same time.SOURCE OUTPUT HIGH-SIDE TERMINALS (SRC_HS1 AND SRC_HS2)The SRC_HSn terminals are the sources of the external high-side MOSFETs. The external high-side MOSFETs are controlled using the IN_HSn inputs.GATE HIGH- AND LOW-SIDE TERMINALS (GATE_HS1, GATE_HS2, AND GATE_LS1, GATE_LS2)The GATE_HSn and GATE_LSn terminals are the gates of the external high- and low-side MOSFETs. The external high- and low-side MOSFETs are controlled using the IN_HSn and IN_LSn inputs.GLOBAL ENABLE (G_EN)The G_EN terminal is used to place the device in a sleep mode. When the G_EN terminal voltage is a logic LOW state, the device is in sleep mode. The device is enabled and fully operational when the G_EN terminal voltage is logic HIGH, typically 5.0 V.CHARGE PUMP OUT (CP_OUT)The CP_OUT terminal is used to connect an external reservoir capacitor for the charge pump.CHARGE PUMP CAPACITOR TERMINALS (C1 AND C2)The C1 and C2 terminals are used to connect an external capacitor for the charge pump.LINEAR REGULATOR OUTPUT (LR_OUT)The LR_OUT terminal is the output of the internal regulator. It is used to connect an external capacitor.GROUND TERMINALS (GND_A, GND1 AND GND2)These terminals are the ground terminals of the device. They should be connected together with a very low impedance connection.FUNCTIONAL DESCRIPTIONFUNCTIONAL TERMINAL DESCRIPTIONTable 5. Functional Truth TableConditions G_EN IN_HSn IN_LSn Gate_HSn Gate_LSn Comments Sleep0x x00Device is in Sleep mode. The gates are at low state.Normal11111Normal mode. The gates are controlled independently.Normal10000Normal mode. The gates are controlled independently. Undervoltage1x x00The device is currently in fault mode. The gates are atlow state. Once the fault is removed, the 33883 recoversits normal mode.Overvoltage1x x00The device is currently in fault mode. The gates are atlow state. Once the fault is removed, the 33883 recoversits normal mode.Overtemperatureon High-Side Gate Driver 11x0x The device is currently in fault mode. The high-side gateis at low state. Once the fault is removed, the 33883recovers its normal mode.Overtemperatureon Low-Side Gate Driver 1x1x0The device is currently in fault mode. The low-side gateis at low state. Once the fault is removed, the 33883recovers its normal mode.x = Don’t care.FUNCTIONAL DEVICE OPERATIONFUNCTIONAL DEVICE OPERATIONDRIVER CHARACTERISTICSFigure 5 represents the external circuit of the high-side gate driver. In the schematic, HSS represents the switch that is used to charge the external high-side MOSFET through the GATE_HS terminal. LSS represents the switch that is used to discharge the external high-side MOSFET through the GATE_HS terminal. A 180K Ω internal typical passivedischarge resistance and a 18 V typical protection zener are in parallel with LSS. The same schematic can be applied to the external low-side MOSFET driver simply by replacing terminal CP_OUT with terminal LR_OUT, terminal GATE_HS with terminal GATE_LS, and terminal SRC_HS with GND.Figure 5. High-Side Gate Driver Functional SchematicThe different voltages and current of the high-side gate driver are illustrated in Figure 6. The output driver sources a peak current of up to 1.0 A for 200 ns to turn on the gate. After 200 ns, 100 mA is continuously provided to maintain the gate charged. The output driver sinks a high current to turn off the gate. This current can be up to 1.0 A peak for a 100 nF load.Note G ATE_HS is loaded with a 100 nF capacitor in thechronograms. A smaller load will give lower peak and DC charge or discharge currents.Figure 6. High-Side Gate Driver ChronogramsHSSCP_OUTI GATE_HSI charge HSS I discharge LSSGATE_HS1LSSSRC_HS1180k Ω18VHSSpulse_IN LSS_INHSSDC_ININ_HS11.0 A Peak1.0 A Peak100 mA Typical1.0 A Peak100 mA Typical-1.0 A PeakIN_HS1HSSpulse_INHSS DC_INLSS_INI discharge LSSI GATE_HSI charge HSSFUNCTIONAL DEVICE OPERATIONOPERATIONAL MODESOPERATIONAL MODESTURN-ONFor turn-on, the current required to charge the gate source capacitor C iss in the specified time can be calculated as follows:I P = Q g / t r = 80 nC/ 80 ns ≈ 1.0 A Where Q g is power MOSFET gate charge and t r is peakcurrent for rise time.TURN-OFFThe peak current for turn-off can be obtained in the same way as for turn-on, with the exception that peak current for fall time, t f , is substituted for t r :I P = Q g / t f = 80 nC/ 80 ns ≈ 1.0 A In addition to the dynamic current required to turn off or onthe MOSFET, various application-related switching scenarios must be considered. These scenarios are presented in Figure 7. In order to withstand high dV/dt spikes, a low resistive path between gate and source is implemented during the OFF-state.Figure 7. OFF-State Driver RequirementDriver Requirement:Low Resistive Gate-Source Path DuringOFF-StateFlyback spike charges low-side gate via C rss charge current I rss up to 2.0 A. Causes increased uncon-trolled turn-on of low-sideMOSFET.C issC iss C rss C rssV BATDriver Requirement: Low Resistive Gate-Source Path During OFF-State. High Peak Sink Current CapabilityFlyback spike pulls down high-side source V GS .Delays turn-off of high-side MOSFET.C issC issC rssC rssV BATDriver Requirement:High Peak Sink CurrentCapabilityFlyback spike charges low-side gate via C rss charge current I rss up to 2.0 A.Delays turn-off of low-sideMOSFET.C issC issC rss C rssV BATDriver Requirement:Low Resistive Gate-Source Path DuringOFF-StateC issC issC rssC rssV BATFlyback spike pulls down high-side source V GS .Causes increased uncon-trolled turn-on of high-sideOFFOFFOFFOFFGATE_LSI LOADL1I LOAD L1I LOAD L1I LOAD L1I rssV GATEV GATE -V DRNGATE_HSGATE_LSGATE_HS GATE_HS GATE_LSGATE_HSGATE_LSFUNCTIONAL DEVICE OPERATION OPERATIONAL MODESLOW-DROP LINEAR REGULATORThe low-drop linear regulator is supplied by V CC2. If V CC2 exceeds 15.0 V, the output is limited to 14.5 V (typical).The low-drop linear regulator provides the 5.0 V for the logic section of the driver, the V gs_ls buffered at LR_OUT, and the +14.5 V for the charge pump, which generates theCP_OUT The low-drop linear regulator provides 4.0 mA average current per driver stage.In case of the full bridge, that means approximately16 mA —8.0 mA for the high side and 8.0 mA for the low side.Note: The average current required to switch a gate with a frequency of 100 kHz is:I CP = Q g * f PWM = 80 nC * 100 kHz = 8.0 mAIn a full-bridge application only one high side and one low side switches on or off at the same time.CHARGE PUMPThe charge pump generates the high-side driver supply voltage (CP_OUT), buffered at C CP_OUT. Figure 8 shows the charge pump basic circuit without load.Figure 8. Charge Pump Basic CircuitWhen the oscillator is in low state [(1) in Figure 8], C CP is charged through D2 until its voltage reaches V CC - V D2. When the oscillator is in high state (2), C CP is discharged though D1 in C CP_OUT, and final voltage of the charge pump, V CP_OUT, is V cc+ V LR_OUT - 2V D. The frequency of the 33883 oscillator is about 330 kHz.EXTERNAL CAPACITORS CHOICEExternal capacitors on the charge pump and on the linear regulator are necessary to supply high peak current absorbed during switching.Figure 9 represents a simplified circuitry of the high-side gate driver. Transistors Tosc1 and Tosc2 are the oscillator-switching MOSFETs. When Tosc1 is on, the oscillator is at low level. When Tosc2 is on, the oscillator is at high level. The capacitor C CP_OUT provides peak current to the high-sideFUNCTIONAL DEVICE OPERATIONOPERATIONAL MODESC CPC CP choice depends on power MOSFET characteristics and the working switching frequency. Figure 10 contains two diagrams that depict the influence of C CP value on V CP_OUT average voltage level. The diagrams represent two different frequencies for two power MOSFETs, MTP60N06HD and MPT36N06V.Figure 10. V CP_OUT Versus C CPThe smaller the C CP value is, the smaller the V CP_OUT value is. Moreover, for the same C CP value, when the switching frequency increases, the average V CP_OUT level decreases. For most of the applications, a typical value of 33 nF is recommended.C CP_OUTFigure 11 depicts the simplified C CP_OUT current and voltage waveforms. f PWM is the working switching frequency.CP_OUTWaveformsAs shown above, at high-side MOSFET turn-on V CP_OUTvoltage decreases. This decrease can be calculatedaccording to the C CP_OUT value as follows:Where Q g is power MOSFET gate charge.C LR_OUTC LR_OUT provides peak current needed by the low-sideMOSFET turn-on. V LR_OUT decrease is as follows:TYPICAL VALUES OF CAPACITORSIn most working cases the following typical values arerecommended for a well-performing charge pump:C CP = 33 nF, C CP_OUT = 470 nF, and C LR_OUT = 470 nFThese values give a typical 100 mV voltage ripple onV CP_OUT and V LR_OUT with Q g = 50 nC.g∆V CP_OUT =C CP_OUTQ g∆V LR_OUT =C LR_OUTQ gFUNCTIONAL DEVICE OPERATIONPROTECTION AND DIAGNOSTIC FEATURESPROTECTION AND DIAGNOSTIC FEATURESGATE PROTECTIONThe low-side driver is supplied from the built-in low-drop regulator. The high-side driver is supplied from the internal charge pump buffered at CP_OUT.The low-side gate is protected by the internal linear regulator, which ensures that V GATE_LS does not exceed the maximum V GS. Especially when working with the charge pump, the voltage at CP_OUT can be up to 65 V. The high-side gate is clamped internally in order to avoid a V GS exceeding 18 V.Gate protection does not include a fly-back voltage clamp that protects the driver and the external MOSFET from a fly-back voltage that can occur when driving inductive load. This fly-back voltage can reach high negative voltage values and needs to be clamped externally, as shown in Figure 12.Figure 12. Gate Protection and Flyback Voltage Clamp LOAD DUMP AND REVERSE BATTERYV CC and V CC2 can sustain load a dump pulse of 40 V and double battery of 24 V. Protection against reverse polarity is ensured by the external power MOSFET with the free-wheeling diodes forming a conducting pass from ground to V CC. Additional protection is not provided within the circuit. To protect the circuit an external diode can be put on the battery line. It is not recommended putting the diode on the ground line.TEMPERATURE PROTECTIONThere is temperature shutdown protection per each half-bridge. Temperature shutdown protects the circuitry against temperature damage by switching off the output drivers. Its typical value is 175°C with an hysteresis of 15°C.DV/DT AT V CCV CC voltage must be higher than (SRC_HS voltage minus a diode drop voltage) to avoid perturbation of the high-side driver.In some applications a large dV /d t at terminal C2 owing to sudden changes at V CC can cause large peak currents flowing through terminal C1, as shown in Figure 13.For positive transitions at terminal C2, the absolute value of the minimum peak current, I C1min, is specified at 2.0 A for a t C1min duration of 600 ns.For negative transitions at terminal C2, the maximum peak current, I C1max, is specified at 2.0 A for a t C1max duration of 600 ns. Current sourced by terminal C1 during a large dV /d t will result in a negative voltage at terminal C1 (Figure 13). The minimum peak voltage V C1min is specified at -1.5 V for a duration of t C1max = 600 ns. A series resistor with the charge pump capacitor (Ccp) capacitor can be added in order to limit the surge current.Output DriverOUTOutput Driver OUTINL1M2GATE_LSSRC_HSGATE_HSInductiveFlyback VoltageClampIND c l M1VCCCP_OUTLR_OUTV GS < 14 VUnder AllConditionsFUNCTIONAL DEVICE OPERATIONPROTECTION AND DIAGNOSTIC FEATURESFigure 13. Limits of C1 Current and Voltage with Large Values of dV/dtIn the case of rapidly changing V CC voltages, the large dV/dt may result in perturbations of the high-side driver, thereby forcing the driver into an OFF state. The addition ofcapacitors C3 and C4, as shown in Figure 14, reduces the dV/dt of the source line, consequently reducing driverperturbation. Typical values for R3 / R 4 and C3 / C 4 are 10 Ω and 10 nF, respectively.DV/DT AT V CC2When the external high-side MOSFET is on, in case of rapid negative change of V CC2 the voltage (V GATE_HS -V SRC_HS ) can be higher than the specified 18 V. In this case a resistance in the SRC line is necessary to limit the current to 5.0 mA max. It will protect the internal zener placed between GATE_HS and SRC terminals.In case of high current (SRC_HS >100 mA) and high voltage (>20 V) between GATE_HSX and SRC_HS an external zener of 18 V is needed as shown in Figure 14.t C1maxt C1minV CCI (C1+C2)I C1maxI C1minV (LR_OUT)0 VV (C1)0 AV C1minTYPICAL APPLICATIONSTYPICAL APPLICATIONSFigure 14. Application Schematic with External Protection CircuitIN_LS2IN_HS2IN_LS1IN_HS1V BAT G_ENC1C2C CPC LR_OUT C CP_OUT MCUVCC2VCC V BOOST33883M1M2M3M4R1R2470nF 470nF 50Ω50Ω50Ω50Ω33nFDC MotorR310Ω10nFC310nFC410ΩR4IN_LS2IN_HS2IN_LS1IN_HS1G_EN C1C2VCC2VCC GNDGATE_LS2SRC_HS2GATE_HS2GATE_LS1SRC_HS1GATE_HS1LR_OUT CP_OUT 18 V18 V。

MAX3841中文资料

MAX3841中文资料

PARAMETER
SYMBOL
CONDITIONS
MIN TYP MAX UNITS
Core Supply Current Data Rate
ICC
Excluding CML termination currents
(Note 1)
65
90
mA
0
12.5 Gbps
CML Input Differential CML Input Common Mode
Termination Currents)
Ordering Information
PART
TEMP RANGE
MAX3841ETG -40°C to +85°C
PINPACKAGE
24 Thin QFN
PKG. CODE
T2444-1
Pin Configuration appears at end of data sheet.
12
dB
CML Output Differential CML Output Termination
VOUT
(Note 2) Single ended
400
500
42.5
50
600 57.5
mVP-P Ω
CML Output Transition Time Deterministic Jitter Random Jitter Propagation Delay
Note 4: Measured at 9.953Gbps using a pattern of 100 ones, 27 - 1 PRBS, 100 zeros, 27 - 1 PRBS, and at 12.5Gbps using a ±K28.5 pattern. VCC_IN = VCC_OUT = 1.8V, and VIN = 400mVP-P differential.

MAX1978中文数据手册

MAX1978中文数据手册

用于Peltier模块的集成温度控制器概论MAX1978 / MAX1979是用于Peltier热电冷却器(TEC)模块的最小, 最安全, 最精确完整的单芯片温度控制器。

片上功率FET和热控制环路电路可最大限度地减少外部元件, 同时保持高效率。

可选择的500kHz / 1MHz开关频率和独特的纹波消除方案可优化元件尺寸和效率, 同时降低噪声。

内部MOSFET的开关速度经过优化, 可降低噪声和EMI。

超低漂移斩波放大器可保持±0.001°C的温度稳定性。

直接控制输出电流而不是电压, 以消除电流浪涌。

独立的加热和冷却电流和电压限制提供最高水平的TEC保护。

MAX1978采用单电源供电, 通过在两个同步降压调节器的输出之间偏置TEC, 提供双极性±3A输出。

真正的双极性操作控制温度, 在低负载电流下没有“死区”或其他非线性。

当设定点非常接近自然操作点时, 控制系统不会捕获, 其中仅需要少量的加热或冷却。

模拟控制信号精确设置TEC 电流。

MAX1979提供高达6A的单极性输出。

提供斩波稳定的仪表放大器和高精度积分放大器, 以创建比例积分(PI)或比例积分微分(PID)控制器。

仪表放大器可以连接外部NTC或PTC热敏电阻, 热电偶或半导体温度传感器。

提供模拟输出以监控TEC温度和电流。

此外, 单独的过热和欠温输出表明当TEC温度超出范围时。

片上电压基准为热敏电阻桥提供偏置。

MAX1978 / MAX1979采用薄型48引脚薄型QFN-EP 封装, 工作在-40°C至+ 85°C温度范围。

采用外露金属焊盘的耐热增强型QFN-EP封装可最大限度地降低工作结温。

评估套件可用于加速设计。

应用光纤激光模块典型工作电路出现在数据手册的最后。

WDM, DWDM激光二极管温度控制光纤网络设备EDFA光放大器电信光纤接口ATE特征♦尺寸最小, 最安全, 最精确完整的单芯片控制器♦片上功率MOSFET-无外部FET♦电路占用面积<0.93in2♦回路高度<3mm♦温度稳定性为0.001°C♦集成精密积分器和斩波稳定运算放大器♦精确, 独立的加热和冷却电流限制♦通过直接控制TEC电流消除浪涌♦可调节差分TEC电压限制♦低纹波和低噪声设计♦TEC电流监视器♦温度监控器♦过温和欠温警报♦双极性±3A输出电流(MAX1978)♦单极性+ 6A输出电流(MAX1979)订购信息* EP =裸焊盘。

MAX3081E中文资料

MAX3081E中文资料
Operating Temperature Ranges MAX308_EC_ _ ...................................................0°C to +70°C MAX308_EE_ _ ................................................-40°C to +85°C
Ordering Information
PART MAX3080ECSD MAX3080ECPD MAX3080EESD MAX3080EEPD
TEMP. RANGE 0°C to +70°C 0°C to +70°C
-40°C to +85°C -40°C to +85°C
PIN-PACKAGE 14 SO 14 Plastic DIP 14 SO 14 Plastic DIP
o Allow Up to 256 Transceivers on the Bus
Applications
RS-422/RS-485 Communications Level Translators Transceivers for EMI-Sensitive Applications Industrial-Control Local Area Networks
Ordering Information continued at end of data sheet.
Selector Guide
Part
Half/Full Duplex
Data Rate (Mbps)
SlewRate Limited
Low- Receiver/ Quiescent Transceivers

MAX3088ESA+中文资料

MAX3088ESA+中文资料
The MAX3080–MAX3089 high-speed transceivers for RS-485/RS-422 communication contain one driver and one receiver. These devices feature fail-safe circuitry, which guarantees a logic-high receiver output when the receiver inputs are open or shorted. This means that the receiver output will be a logic high if all transmitters on a terminated bus are disabled (high impedance). The MAX3080/MAX3081/MAX3082 feature reduced slew-rate drivers that minimize EMI and reduce reflections caused by improperly terminated cables, allowing error-free data transmission up to 115kbps. The MAX3083/MAX3084/MAX3085 offer higher driver output slew-rate limits, allowing transmit speeds up to 500kbps. The MAX3086/MAX3087/MAX3088’s driver slew rates are not limited, making transmit speeds up to 10Mbps possible. The MAX3089’s slew rate is selectable between 115kbps, 500kbps, and 10Mbps by driving a selector pin with a single three-state driver.

MAX038中文资料

MAX038中文资料

高频函数信号发生器MAX038及其应用高频函数信号发生器MAX038及其应用作者:李琳来源:网络目前广泛应用的函数发生器芯片是ICL8038(国产5G8038),他的主要技术指标是最高振荡频率仅为100 kHz,而且三种输出波形从不同的引脚输出,使用很不方便。

MAX038是ICL8038的升级产品,他的最高振荡频率可达40 MHz,而且由于在芯片内采用了多路选择器,使得三种输出波形可通过编程从同一个引脚输出,输出波形的切换时间可在0.3μs内完成,使用更加方便。

1 MAX038芯片介绍MAX038是MAXIM公司生产的一个只需要很少外部元件的精密高频波形产生器,在适当调整其外部控制条件时,它可以产生准确的高频方波、正弦波、三角波、锯齿波等信号,这些信号的峰峰值精确地固定在2V,频率从0.1Hz~20MHz连续可调,方波的占空比从10%~90%连续可调。

通过MAX038的A0、A1引脚上电平的不同组合,可以选择不同的输出波形类型。

其性能特点如下:(1) 0.1 Hz~20 MHz工作频率范围;(2) 15%~85%可变的占空比;(3) 低阻抗输出缓冲器:0.1;(4) 低失真正弦波:0.75%;(5) 低温度漂移:200 ppm/℃。

MAX038引脚排列如图所示各引脚功能如图所示:Max038内部电路,如图:2 MAX038芯片使用方法2.1 波形选择MAX038可以产生正弦波、方波或三角波。

具体的输出波形由地址A0和A1的输入数据进行设置,如表1所示。

波形切换可通过程序控制在任意时刻进行,而不必考虑输出信号当时的相位。

2.2 波形调整2.2.1 输出频率的调整输出频率调整方式分为粗调和细调两种方法:粗调取决于IIN引脚的输入电流IIN,COSC引脚的电容量CF(对地)以及FADJ引脚上的电压。

当VFADJ=0 V时,输出的中心频率f0为:fo(MHz)=Iin(μA)÷COSC (pF)。

MAX833中文资料

MAX833中文资料

MAX830–MAX833
______________Ordering Information
PART MAX830CWE MAX831CWE MAX832CWE MAX833CWE TEMP. RANGE 0°C to +70°C 0°C to +70°C 0°C to +70°C 0°C to +70°C PIN-PACKAGE 16 Wide SO 16 Wide SO 16 Wide SO 16 Wide SO
_______________________Applications
Distributed Power from High-Voltage Buses High-Current, High-Voltage Step-Down Applications Multiple-Output Buck Converter
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

MAX038资料中文

MAX038资料中文

高频信号发生器_______________概述MAX038是一种只需极少外围电路就能实现高 频、高精度输出三角波、锯齿波、正弦波、方波 和脉冲波的精密高频函数发生器芯片。

内部提供 的2.5V 基准电压和一个外接电阻和电容可以控制 输出频率范围在0.1Hz 到20MHz 。

占空比可在较大 的范围内由一个±2.3V的线性信号控制变化,便 于进行脉冲宽度调制和产生锯齿波。

频率调整和 频率扫描可以用同样的方式实现。

占空比和频率 控制是独立的。

通过设置2个TTL 逻辑地址引脚合适的逻辑电 平,能设定正弦波,方波或三角波的输出。

所有 波形的输出都是峰-峰值为±2VP -P 的信号。

低阻 抗输出能力可以达到±20mA。

____________________________性能o 频率调节范围:0.1Hz 到20MHzo 三角波, 锯齿波, 正弦波, 方波和脉冲波 o 频率和占空比独立可调 o 频率扫描范围:350:1 o 可控占空比:15%到85% o 低阻抗输出缓冲器: 0.1Ω o 低失真正弦波: 0.75% o 低温度漂移: 200ppm/°C______________型号信息TTL 逻辑地址引脚SYNC 从内部振荡器输出占 空比固定为50%的信号,不受其它波占空比的影 响,从而同步系统中其它振荡器。

内部振荡器 允许被连接着相位检波器输入端(PDI )的外部 TTL 时钟同步。

型号 MAX038CPP MAX038CWP MAX038C/D MAX038EPP MAX038EWP工作温度 0°C 到 +70°C 0°C 到 +70°C 0°C 到 +70°C -40°C 到 +85°C -40°C 到 +85°C引脚--封装 20 Plastic DIP 20 SO Dice* 20 Plastic DIP 20 SO.__________________应用精密函数信号发生器 压控振荡器 频率调制器*Contact factory for dice specifications.__________________引脚图脉宽调制器 锁相环 频率合成器FSK 发生器(正弦波和方波)________________________________________________________________ Maxim Integrated Products1For free samples & the latest literature: , or phone 1-800-998-8800. For small orders, phone 408-737-7600 ext. 3468MAX038高频信号发生器图1. 内部结构及基本工作电路_______________ 详细说明MAX038是一种高频函数信号发生器,它可以使 用最少的外部元件而产生低失真正弦波,三角波, 锯齿波,方波(脉冲波)。

MSA338中文说明书

MSA338中文说明书

分辩带宽
3dB 带宽
设置范围
3KHz to 3MHz (1-3 步进) 和 AUTO(自动)
准确度
20% 内
选择性
1:12 (典型值,3dB: 60dB)
视频带宽
100Hz to 300KHz (1-3 步进),OFF 和 AUTO
SSB 相位噪声 -90dBc/Hz (典型值,100KHz offset, RBW: 3kHz ,VBW:100Hz
3.3GHz 频谱分析仪 MSA338
操作手册
Ver.1.1 中文
仪器使用注意事项
·使用仪器前,请阅读仪器背面的如下注意事项:
警告
仪器内部无使用者可调节的部份,相应的维修只有专业人 员可进行,使用者应了解手册中的安全指引。
注意
为得到可靠的保护,只可使用指定型号和规格的保险丝
·安全使用注意事项:
1) 发现仪器有异常的声音,气味和烟,应立即停止使用仪器,断开 AC 适配器的电池 2) 不要用湿手操作,否则可能导致仪器的损坏,失火和触电 3) 不要使用指定外的 AC 适配器,否则可能导致仪器的损坏,为防静电,尽可能使用
③ 镍络电池 MB300(详细资料参阅“6.4 安装电池”) ④ RS-232C 电缆线 M180 (详细资料参阅“23.RS-232 接口”) ⑤ PC software MAS300 软件(详细资料参阅“24. PC 软件”) ⑥ 打印机及 AC 适配器,4 节 AA 电池,一卷纸
(详细资料参阅“21.打印”) ⑦ 打印机(选件)用卷纸(10 卷) ⑧ SMA 同轴电缆 MC301(50cm),MC302(1m),MC303(1.5m)
±3%±200TKHz±1dot 内 (频率 span:2MHz to 3.3GHz,23±5℃)

MAX490ECUA-T中文资料

MAX490ECUA-T中文资料

________________________________________________________________ Maxim Integrated Products 1
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at 1-888-629-4642, or visit Maxim’s website at .
元器件交易网
MAX481E/MAX483E/MAX485E/MAX487E–MAX491E/MAX1487E
19-0410; Rev 4; 10/03
±15kV ESD-Protected, Slew-Rate-Limited, Low-Power, RS-485/RS-422 Transceivers
Ordering Information
PART MAX481ECPA MAX481ECSA MAX481EEPA MAX481EESA MAX483ECPA MAX483ECSA MAX483EEPA MAX483EESA
TEMP RANGE 0°C to +70°C 0°C to +70°C -40°C to +85°C -40°C to +85°C 0°C to +70°C 0°C to +70°C -40°C to +85°C -40°C to +85°C
These transceivers draw as little as 120µA supply current when unloaded or when fully loaded with disabled drivers (see Selector Guide). Additionally, the MAX481E, MAX483E, and MAX487E have a low-current shutdown mode in which they consume only 0.5µA. All parts operate from a single +5V supply.

MAX3387E中文资料

MAX3387E中文资料

MAX3387E
Ordering Information
PART MAX3387ECUG MAX3387EEUG TEMP. RANGE 0°C to +70°C -40°C to +85°C PIN-PACKAGE 24 TSSOP 24 TSSOP
Typical Operating Circuit
元器件交易网
3V, ±15kV ESD-Protected, AutoShutdown Plus RS-232 Transceiver for PDAs and Cell Phones MAX3387E
ABSOLUTE MAXIMUM RATINGS
VCC to GND ..............................................................-0.3V to +6V VL to GND...................................................-0.3V to (VCC + 0.3V) V+ to GND ................................................................-0.3V to +7V V- to GND .................................................................+0.3V to -7V V+ + V-(Note 1) .............................................................. +13V Input Voltages T_IN, FORCEON, FORCEOFF to GND ..................-0.3V to +6V R_IN to GND .....................................................................±25V Output Voltages T_OUT to GND...............................................................±13.2V R_OUT........................................................-0.3V to (VL + 0.3V) Short-Circuit Duration T_OUT to GND........................Continuous Continuous Power Dissipation (TA = +70°C) 24-Pin TSSOP (derate 7.8mW/°C above +70°C) ..........625mW Operating Temperature Ranges MAX3387ECUG ...................................................0°C to +70°C MAX3387EEUG ................................................-40°C to +85°C Junction Temperature ......................................................+150°C Storage Temperature Range .............................-65°C to +150°C Lead Temperature (soldering, 10sec) .............................+300°C

芯片33886资料

芯片33886资料

8800 uµAA (each)
5.0 V RReguullaator
IN1
IN2
Gate Drivee
D1
D2
OOvver--
255 uµAA
Control Logic
tteemmppeerraattuurree
FS
Undervoltage
VPVW+ R
CSCSOeuuhvnrrorrSCeseerretiennrcCcnttuCusiLLrrierircitiecmmunuiiitttitt,,
IN2 OUT2 D1 PGND D2 AGND
© Motorola, Inc. 2004
For More Information On This Product, Go to:
Freescale Semiconductor, Inc.
CCCCPP
Charge Pump
A Fault Status output reports undervoltage, short circuit, and overtemperature conditions. Two independent inputs control the two halfbridge totem-pole outputs. Two disable inputs force the H-Bridge outputs to tri-state (exhibit high impedance).
6, 7
OUT1
H-Bridge Output 1
8, 20
DNC
Do Not Connect
9 –12 13
PGND D2
Power Ground Disable 2
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General DescriptionThe MAX3388E/MAX3389E are 2.5V-powered EI A/TI A-232 and V.28/V.24 communications interfaces with low power requirements, high data-rate capabilities, and enhanced electrostatic discharge (ESD) protection. The MAX3388E/MAX3389E have two receivers and three transmitters. All RS-232 inputs and outputs are protected to ±15kV using the I EC 1000-4-2 Air-Gap Discharge method, ±8kV using the IEC 1000-4-2 Contact Discharge method, and ±15kV using the Human Body Model.In addition to the traditional RS-232 I/O, these devices have dedicated logic-level I/O pins for additional device-to-device handshaking. During shutdown the logic-level I/O pins are active for the MAX3389E. An internal 62Ωswitch is provided to switch power to external circuitry or modules.A proprietary low-dropout transmitter output stage enables RS-232 compatible performance from a +2.35V to +3.0V supply with a dual charge pump. The charge pump requires only four small 0.1µF capacitors for oper-ation from a +2.5V supply. The MAX3388E/MAX3389E are capable of running at data rates up to 460kbps while maintaining RS-232-compatible output levels.The MAX3388E/MAX3389E have a unique V L pin that allows interoperation in mixed-logic voltage systems.Both input and output logic levels are pin programma-ble through the V L pin. The MAX3388E/MAX3389E are available in a space-saving TSSOP package.Featureso V L Pin for Compatibility with Mixed-Voltage Systemso Additional I/O for Hot-Sync Applicationso ±15kV ESD Protection on Rx Inputs, Tx Outputs,LIN, and SWINo Low 300µA Supply Current o Guaranteed 460kbps Data Rate o 1µA Low-Power Shutdowno Integrated Switch for Powering Remote Circuitry o Flow-Through Pinouto L OUT Active During Shutdown (MAX3389E)ApplicationsSubnotebook/Palmtop Computers PDAs and PDA Cradles Cell Phone Data Cables Battery-Powered Equipment Hand-Held Equipment PeripheralsMAX3388E/MAX3389E2.5V , ±15kV ESD-Protected RS-232 Transceivers for PDAs and Cell Phones________________________________________________________________Maxim Integrated Products 1Typical Operating Circuit19-1845; Rev 1; 9/01Pin ConfigurationOrdering InformationCovered by U.S Patent numbers 4,636,930; 4,679,134;4,777,577; 4,797,899; 4,809,152; 4,897,774; 4,999,761.For pricing, delivery, and ordering information,please contact Maxim/Dallas Direct!at 1-888-629-4642, or visit Maxim’s website at .M A X 3388E /M A X 3389E2.5V , ±15kV ESD-Protected RS-232Transceivers for PDAs and Cell Phones 2_______________________________________________________________________________________ABSOLUTE MAXIMUM RATINGSDC ELECTRICAL CHARACTERISTICS(V CC = V L = +2.35V to +3.0V, C1–C4 = 0.1µF, T A = T MIN to T MAX , unless otherwise noted. Typical values are at V CC = V L = +2.5V,T A = +25°C.)Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.Note 1:V+ and V- can have maximum magnitudes of 7V, but their absolute difference cannot exceed 13V.V CC to GND..............................................................-0.3V to +6V V L to GND...................................................-0.3V to (V CC + 0.3V)V+ to GND................................................................-0.3V to +7V V- to GND.................................................................+0.3V to -7V V+ + V- (Note 1)...............................................................+13V Input VoltagesT_IN, SHDN,LIN to GND.......................................-0.3V to +6V R_IN to GND.....................................................................±25V SWIN to GND...........................................-0.3V to (V CC + 0.3V)Output VoltagesT_OUT to GND...............................................................±13.2V R_OUT, SWOUT, LOUT to GND ................-0.3V to (V L + 0.3V)Short-Circuit Duration T_OUT to GND........................Continuous Continuous Power Dissipation (T A = +70°C)24-Pin TSSOP (derate 12.2mW/°C above +70°C)........975mW Operating Temperature RangesMAX338_ECUG ...................................................0°C to +70°C MAX338_EEUG.................................................-40°C to +85°C Junction Temperature......................................................+150°C Storage Temperature Range.............................-65°C to +150°C Lead Temperature (soldering, 10s).................................+300°CMAX3388E/MAX3389E2.5V , ±15kV ESD-Protected RS-232 Transceivers for PDAs and Cell Phones_______________________________________________________________________________________3(V CC = V L = +2.35V to +3.0V, C1–C4 = 0.1µF, T A = T MIN to T MAX , unless otherwise noted. Typical values are at V CC = V L = +2.5V,T= +25°C.)Note 3:Transmitter skew is measured at the transmitter zero crosspoint.DC ELECTRICAL CHARACTERISTICS (continued)(V CC = V L = +2.35V to +3.0V, C1–C4 = 0.1µF, T A = T MIN to T MAX , unless otherwise noted. Typical values are at V CC = V L = +2.5V,M A X 3388E /M A X 3389E2.5V , ±15kV ESD-Protected RS-232Transceivers for PDAs and Cell Phones 4_______________________________________________________________________________________Typical Operating Characteristics(V CC = V L = +2.5V, T A = +25°C, unless otherwise noted.)-5.0-2.52.55.0020001000300040005000TRANSMITTER OUTPUT VOLTAGEvs. LOAD CAPACITANCELOAD CAPACITANCE (pF)O U T P U T V O L T A G E (V )024681012141610002000300040005000SLEW RATE vs. LOAD CAPACITANCELOAD CAPACITANCE (pF)S L E W R A T E (V /µs )-5.0-2.52.55.0010015020025050300350400450TRANSMITTER OUTPUT VOLTAGEvs. DATA RATEDATA RATE (kbps)O U T P U T V O L T A G E (V )0201040305060020001000300040005000SUPPLY CURRENT vs. LOAD CAPACITANCELOAD CAPACITANCE (pF)S U P P L Y C U R R E N T (m A )M A X 3388E t o c 05200ns/divR PULLUP = 1k ΩMAX3388E/MAX3389E2.5V , ±15kV ESD-Protected RS-232 Transceivers for PDAs and Cell Phones_______________________________________________________________________________________5M A X 3388E /M A X 3389E2.5V , ±15kV ESD-Protected RS-232Transceivers for PDAs and Cell Phones 6_______________________________________________________________________________________Detailed DescriptionDual Charge-Pump Voltage ConverterThe MAX3388E/MAX3389E ’s internal power supply consists of a regulated dual charge pump that provides output voltages of +4.2V (doubling charge pump) and -4.2V (inverting charge pump), regardless of the input voltage (V CC ) over a +2.5V to +3.0V range. The charge pumps operate in a discontinuous mode: if the output voltages are less than 4.2V, the charge pumps are enabled; if the output voltages exceed 4.2V, the charge pumps are disabled. Each charge pump requires flying capacitors (C1, C2) and reservoir capacitors (C3, C4)to generate the V+ and V- supplies.RS-232 TransmittersThe transmitters are inverting level translators that convert CMOS-logic levels to ±3.7V EI A/TI A-232-compatible levels.The MAX3388E/MAX3389E ’s transmitters guarantee a 250kbps data rate with loads of 3k Ωin parallel with 1000pF and 460kbps data rate with loads of 3k lel with 150pF. Figure 1 shows a complete system con-nection.These RS-232 output stages are turned off (high impedance) when the devices are in shutdown mode.When the power is off, the MAX3388E/MAX3389E permit the outputs to be driven up to ±12V.The transmitter inputs do not have pullup resistors.Connect unused inputs to GND or V L .RS-232 ReceiversThe receivers convert RS-232 signals to CMOS-logic output levels. The MAX3388E/MAX3389E ’s receivers have inverting outputs. The outputs are high imped-ance in shutdown.Shutdown ModeSupply current falls to less than 1µA when the MAX3388E/MAX3389E are placed in shutdown mode (SHDN logic low). When shut down, the device ’s charge pumps are turned off, V+ decays to V CC , V- is pulled to ground, the switch is opened, and the transmitter outputs are disabled (high impedance). The time required to exitFigure 1. Interface Under Control of PMU10µs/divV CC = +2.5V C1–C4 = 0.1µFC L = 1000pF, R L = 3k ΩFigure 2. Transmitter Outputs when Exiting ShutdownMAX3388E/MAX3389E2.5V , ±15kV ESD-Protected RS-232 Transceivers for PDAs and Cell Phones_______________________________________________________________________________________7shutdown is typically 30µs, as shown in Figure 2.Connect SHDN to V CC if the shutdown mode is not used.In shutdown mode, the receiver outputs are high imped-ance (Table 1).V L Logic Supply InputUnlike other RS-232 interface devices where the receiver outputs swing between 0 and V CC , the MAX3388E/MAX3389E feature a separate logic supply input (V L )that sets V OH for the receiver outputs and sets thresh-olds for the transmitter inputs. This feature allows a great deal of flexibility in interfacing to many different types of systems with different logic levels. Connect this input to the host logic supply (1.8V ≤V L ≤V CC ).Also see the Typical PDA/Cell-Phone Application sec-tion.±15kV ESD ProtectionAs with all Maxim devices, ESD-protection structures are incorporated on all pins to protect against ESDs encoun-tered during handling and assembly. The MAX3388E/MAX3389E ’s driver outputs, receiver inputs, the hand-shaking input LI N, and the switch terminal SWI N have extra protection against static electricity. Maxim has developed state-of-the-art structures to protect these pins against an ESD of ±15kV without damage. The ESD structures withstand high ESD in all states: normal opera-tion, shutdown, and powered down. After an ESD event,Maxim ’s “E ” version devices keep working without latchup, whereas competing RS-232 products can latch and must be powered down to remove latchup. ESD pro-tection can be tested in various ways. The transmitter out-puts and receiver inputs of this product family are characterized for protection to the following limits:1)±15kV using the Human Body Model2)±8kV using the Contact Discharge method specified in IEC 1000-4-23)±15kV using I EC 1000-4-2’s Air-Gap Discharge methodESD Test ConditionsESD performance depends on a variety of conditions.Contact Maxim for a reliability report that documents test setup, methodology, and results.Human Body ModelFigure 3a shows the Human Body Model, and Figure 3b shows the current waveform it generates when dis-charged into a low impedance. This model consists of a 100pF capacitor charged to the ESD voltage of interest,which is then discharged into the test device through a 1.5k Ωresistor.IEC 1000-4-2The I EC 1000-4-2 standard covers ESD testing and performance of finished equipment; it does not specifi-cally refer to ICs. The MAX3388E/MAX3389E helps you design equipment that meets Level 4 (the highest level)of I EC 1000-4-2, without the need for additional ESD-protection components.The major difference between tests done using the Human Body Model and I EC 1000-4-2 is higher peak current in I EC 1000-4-2, because series resistance is lower in the IEC 1000-4-2 model. Hence, the ESD with-stand voltage measured to I EC 1000-4-2 is generally lower than that measured using the Human Body Model. Figure 4a shows the I EC 1000-4-2 model, and Figure 4b shows the current waveform for the ±8kV IEC 1000-4-2 Level 4 ESD Contact Discharge test.Figure 3a. Human Body ESD Test ModelFigure 3b. Human Body Current WaveformThe Air-Gap test involves approaching the device with a charged probe. The contact discharge method connects the probe to the device before the probe is energized.Machine ModelThe Machine Model for ESD tests all pins using a 200pF storage capacitor and zero discharge resis-tance. Its objective is to emulate the stress caused by contact that occurs with handling and assembly during manufacturing. All pins require this protection during manufacturing, not just RS-232 inputs and outputs.Therefore, after PC board assembly, the Machine Model is less relevant to I/O ports.__________Applications InformationCapacitor SelectionThe capacitor type used for C1–C4 is not critical for proper operation; polarized or nonpolarized capacitors can be used. The charge pump requires 0.1µF capacitors for 2.5V operation (Table 2). Do not use values smaller than those listed in Table 2. I ncreasing the capacitor values (e.g., by a factor of 2) reduces ripple on the transmitter outputs and slightly reduces power con-sumption. C2, C3, and C4 can be increased without changing C1’s value. However, do not increase C1without also increasing the values of C2, C3, and C4 to maintain the proper ratios (C1 to the other capacitors).When using the minimum required capacitor values,make sure the capacitor value does not degrade excessively with temperature. If in doubt, use capacitors with a larger nominal value. The capacitor ’s equivalent series resistance (ESR), which usually rises at low tem-peratures, influences the amount of ripple on V+ and V-.Power-Supply DecouplingI n most circumstances, a 0.1µF bypass capacitor is adequate.In applications that are sensitive to power-supply noise, decouple V CC to ground with a capacitor of the same value as charge-pump capacitor C1. Connect bypass capacitors as close to the IC as possible.Transmitter Outputs whenExiting ShutdownFigure 2 shows two transmitter outputs when exiting shutdown mode. As they become active, the two transmitter outputs are shown going to opposite RS-232levels (one transmitter input is high; the other is low).Each transmitter is loaded with 3k Ωin parallel with 1000pF. The transmitter outputs display no ringing or undesirable transients as they come out of shutdown.Note that the transmitters are enabled only when the magnitude of V- exceeds approximately 2.5V.M A X 3388E /M A X 3389E2.5V , ±15kV ESD-Protected RS-232Transceivers for PDAs and Cell Phones 8_______________________________________________________________________________________Figure 4a. IEC 1000-4-2 ESD Test ModelFigure 4b. IEC 1000-4-2 ESD Generator Current WaveformTable 2. Minimum Required Capacitor ValuesMAX3388E/MAX3389E2.5V , ±15kV ESD-Protected RS-232 Transceivers for PDAs and Cell PhonesHigh Data RatesThe MAX3388E/MAX3389E maintain RS-232-compatible transmitter output voltages even at high data rates. Figure 5 shows a transmitter loopback test circuit. Figure 6shows a loopback test result at 250kbps, and Figure 7 shows the same test at 460kbps. For Figure 6, all transmitters were driven simultaneously at 250kbps into RS-232 loads in parallel with 1000pF. For Figure 7, a single transmitter was driven at 460kbps, and all transmitters were loaded with an RS-232 receiver in parallel with 150pF.Power SwitchThe MAX3388E/MAX3389E contain an internal switch for powering external circuitry. This can be used to power hot-sync circuitry or other low-power circuitry.The switch on- resistance is typically 62Ω. The SWI N side of the switch is ESD protected to ±15kV.Logic-Level I/On addition to the traditional RS-232 I /O, the MAX3388E/MAX3389E have a logic-level transceiver from the RS-232 connector side to the CMOS-logic side. The input impedance is typically 30k Ω, and the output is open drain. The logic level I/O is active during shutdown for the MAX3389E.This I /O transceiver is useful for hot syncing or other dedicated communication capability. The input is ESD protected to ±15kV.Typical PDA/Cell-Phone ApplicationThe MAX3388E/MAX3389E designed with PDA applica-tions in mind. Two transmitters and two receivers handle standard full-duplex communication protocol, while an extra transmitter allows a ring indicator (RI) signal to alert the UART on the PC. Without the ring indicator transmit-ter, solutions for these applications would require soft-ware-intensive polling of the cradle inputs.The RI signal is generated when a PDA, cellular phone, or other “cradled ” device is plugged into its cradle. This generates a logic-low signal to RI transmitter input, creat-ing +3.7V at the ring indicate pin. The PC ’s UART RI input is the only pin that can generate an interrupt from signals arriving through the RS-232 port. The interrupt routine for this UART will then service the RS-232 full-duplex com-munication between the PDA and the PC.As cell phone design becomes more like that of PDAs,cell phones will require similar docking ability and com-munication protocol. Cell phones operate on a single lithium-ion (Li+) battery and generate a regulated out-put voltage of +2.35V to +3V from the phone connector.The baseband logic coming from the phone connector can be as low as 1.8V at the transceivers. To prevent forward biasing of a device internal to the cell phone,the MAX3388E/MAX3389E come with a logic power-supply pin (V L ) that limits the logic levels presented toFigure 5. Loopback Test Circuit1µs/divC L = 1000pFFigure 6. Loopback Test Results at 250kbps_______________________________________________________________________________________9the phone. The receiver outputs will sink to zero for low outputs, but will not exceed V L for logic highs. The input logic levels for the transmitters are also altered,scaled by the magnitude of the V L input. The devices will work with V L as low as 1.8V. This is useful with cell phones and other power-efficient devices with core logic voltage levels that go as low as 1.8V.Chip InformationTRANSISTOR COUNT: 1323M A X 3388E /M A X 3389E2.5V , ±15kV ESD-Protected RS-232Transceivers for PDAs and Cell Phones 10______________________________________________________________________________________1µs/divC L = 150pFFigure 7. Loopback Test Results at 460kbpsMAX3388E/MAX3389E 2.5V , ±15kV ESD-Protected RS-232 Transceivers for PDAs and Cell PhonesMaxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600_____________________11©2001 Maxim Integrated Products Printed USA is a registered trademark of Maxim Integrated Products.元器件交易网。

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