BGA焊接状况Intel分析报告(Rev6-SitkaFA)

At 5kv, 150x magnification
At 5kv, 1000x magnification
Solder ball pull down to PCB pad. No separation between BGA ball and pad.
5. METHOD OF ANALYSIS 5.1 Microscope for 500X 5.2 EDX Analysis. Test conditions follow Intel’s: a. At 5kv, 150x magnification, SE image b. At 5kv, 600x magnification, SE image c. At 5kv, 3000x magnification, SE image d. Select the dark side to do EDX Analysis at 15kev. 6. TEST RESULTS 6.1 Ti and Mg did found from the returned coupon after analysis. 6.2 Put solder ball on Pad 4 and Pad 5 and also compare each others, no separation problem. 7. SUMMARY OF ANALYSIS 7.1 20% contamination area and more will cause solder joint problem but 10 % perform well solder contact between solder ball and pad. 7.2 After review all BGA pads, it can be hardly detects the minor Mg and Ti elements at very small area on the two pads only. 8. FUTURE PLANS 8.1 Supplier would like to perform ball shear test for the suspicious pad.
No separation phenomenon found.
The EDX’s analysis for 10% contamination
4. DEFECT MAP 4.1 X-section for Pad 4 (Suspect contamination pad and both Mg and Ti compositions are more than pad 3 ) : No solder joint problem and separation found between solder ball and pad like returned photo from Intel. Pls see below.
At 5kv, 3000x magnification
At 15 Kev C, O, N, Mg, Al, Si, Pb, Sn, Ti
Pad 3 Analysis
At 5kv, 150x magnification
At 5kv, 600x magnification
Hale Waihona Puke At 5kv, 3000x magnification
Pad 3 Pad 4
Pad 3 Pad 4
Returned Coupon
Diagram 1.
2. SAMPLES SUBMITTED For RTV`s x-section (Follow Intel's indicated location: Pad 3 and 4): After EDX analysis, Supplier did find the element Mg、Ti on both pads. The SEM photo & EDX analysis as follows: At 5kv, 150x magnification At 5kv, 600x magnification
SITKA 689998-004 (CHTJD8A) U4G1 (PID) FA Update (Rev:06)
Date: 6/02/01
1. PROBLEM DESCRIPTION 1.1 Perform EDX again for returned the SITKA 689998-004 with U4G1 BGA pad because Intel indicated the error location. 1.2 Follow Intel's indication for pad 3 and pad 4. 1.3 Supplier also chooses pad 5, it is very close pad 3 and pad 4, to put solder ball on these pads and check if any separation between solder ball and BGA pad. The detail location as follows, Pad 5 Pad 5
At 5kv, 150x magnification
At 5kv, 1000x magnification
Solder ball pull down to PCB pad.
No separation between BGA ball and pad.
4.2 X-section for Pad 5 (No contamination) : No solder joint problem and separation found between solder ball and pad. Pls see below.
At 15 Kev C, O, Mg , Si, Pb, Sn, Ti
Pad 4 Analysis
3. PROCESSING CONDITIONS AT FAILURE 3.1 Ti and Mg are found on the legend ink only. Refer to Rev2_Sitka FA on May. 24. 3.2 Per report with the Rev5_Sitka FA on June. 01, the result shows 20 % contamination area and more % with the legend ink on BGA pad will cause solder joint problem. 3.3 But 10 % contamination area with both composition Ti 16.76 % and Mg 1.27 % do not cause solder joint problem. Pls refer to the photos and “ EDX`s analysis for 10% contamination area “ chart. As follows. Pad No. Ink area(%) 1 10% 2 20% 3 30% 4 50% 5 80% 6 90%