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联想Flex System Fabric EN4093R 10Gb可扩展交换机产品指南说明书

Lenovo Flex System Fabric EN4093R 10Gb Scalable SwitchProduct GuideThe Lenovo® Flex System Fabric EN4093R 10Gb Scalable Switch provides unmatched scalability, port flexibility, and performance. The switch also delivers innovations to help address several networking concerns today and provides capabilities that help you prepare for the future.This switch can support up to 64x 10 Gb Ethernet connections while offering Layer 2/3 switching, in addition to OpenFlow and "easy connect" modes. It installs within the I/O module bays of the Flex System™ Enterprise Chassis. This switch can help clients migrate to a 10 Gb or 40 Gb Ethernet infrastructure, offers cloud-ready virtualization features (such as Virtual Fabric and VMready®), and is Software Defined Network (SDN) ready. The EN4093R 10Gb Scalable Switch is shown in the following figure.Figure 1. Lenovo Flex System Fabric EN4093R 10Gb Scalable SwitchDid you know?The base switch configuration comes standard with 24x 10 GbE port licenses that can be assigned to internal connections or external SFP+ or QSFP+ ports with flexible port mapping. For example, this feature allows you to trade off four 10 GbE ports for one 40 GbE port (or vice versa) or trade off one external 10 GbE SFP+ port for one internal 10 GbE port (or vice versa). You then have the flexibility of turning on more ports when you need them by using Lenovo's Features on Demand upgrade licensing capabilities that provide “pay as you grow” scalability without the need to buy more hardware.The EN4093R is cloud ready with support for VM aware networking and advanced NIC virtualization technologies, such as Unified Fabric Port (UFP). In addition, the switch offers different operational modes (from "easy connect" transparent networking connectivity to Layer 3 functionality) to satisfy diverse client networking requirements.The EN4093R switch is SDN-ready with support for OpenFlow. OpenFlow is the protocol that enables the network administrator to easily configure and manage virtual networks that control traffic on a "per-flow" basis. OpenFlow creates multiple independent virtual networks and related policies without dealing with the complexities of the underlying physical network and protocols.With support for Converged Enhanced Ethernet (CEE), the EN4093R can be used as an FCoE transit device and is ideal for network-attached storage (NAS) and iSCSI environments.Click here to check for updatesFigure 2. Front panel of the Flex System Fabric EN4093R 10Gb Scalable SwitchThe front panel includes the following components:System LEDs that display the status of the switch module and the network.One mini-USB RS-232 console port that provides another means to configure the switch module.14x SFP/SFP+ ports to attach SFP/SFP+ transceivers for 1 GbE or 10 GbE connections or SFP+ DAC cables for 10 GbE connections.2x QSFP+ ports to attach QSFP+ transceivers or DAC cables for 40 GbE or 4x 10 GbE connections.1x RJ-45 10/100/1000 Mb Ethernet port for out-of-band management.The supported transceivers and cables are listed in the following table. Table 5. Supported transceivers and direct-attach cablesDescription Part number FeaturecodeMaximumquantitysupportedSerial console cablesFlex System Management Serial Access Cable Kit90Y9338A2RR1 SFP transceivers - 1 GbELenovo 1000BASE-T (RJ-45) SFP Transceiver (no 10/100 Mbps support)00FE333A5DL14 Lenovo 1000BASE-SX SFP Transceiver81Y1622326914 Lenovo 1000BASE-LX SFP Transceiver90Y9424A1PN14 SFP+ transceivers - 10 GbELenovo Dual Rate 1/10Gb SX/SR SFP+ Transceiver00MY034ATTJ14 Lenovo 10Gb SFP+ SR Transceiver (10GBASE-SR)46C3447505314 Lenovo 10GBASE-LR SFP+ Transceiver00FE331B0RJ14 Lenovo 10GBASE-T SFP+ Transceiver7G17A03130AVV114 Optical cables for 1 GbE SX SFP, 10 GbE SR SFP+, and 40 GbE SR QSFP+ BiDi transceiversLenovo 1m LC-LC OM3 MMF Cable00MN502ASR614 Lenovo 3m LC-LC OM3 MMF Cable00MN505ASR714 Lenovo 5m LC-LC OM3 MMF Cable00MN508ASR814 Lenovo 10m LC-LC OM3 MMF Cable00MN511ASR914 Lenovo 15m LC-LC OM3 MMF Cable00MN514ASRA14 Lenovo 25m LC-LC OM3 MMF Cable00MN517ASRB14 Lenovo 30m LC-LC OM3 MMF Cable00MN520ASRC14 SFP+ active optical cables - 10 GbELenovo 1m SFP+ to SFP+ Active Optical Cable00YL634ATYX14 Lenovo 3m SFP+ to SFP+ Active Optical Cable00YL637ATYY14 Lenovo 5m SFP+ to SFP+ Active Optical Cable00YL640ATYZ14 Lenovo 7m SFP+ to SFP+ Active Optical Cable00YL643ATZ014 Lenovo 15m SFP+ to SFP+ Active Optical Cable00YL646ATZ114 Lenovo 20m SFP+ to SFP+ Active Optical Cable00YL649ATZ214 SFP+ direct-attach cables - 10 GbELenovo 1m Passive SFP+ DAC Cable90Y9427A1PH14 Lenovo 1.5m Passive SFP+ DAC Cable00AY764A51N14 Lenovo 2m Passive SFP+ DAC Cable00AY765A51P14 Lenovo 3m Passive SFP+ DAC Cable90Y9430A1PJ14 Lenovo 5m Passive SFP+ DAC Cable90Y9433A1PK14 Lenovo 7m Passive SFP+ DAC Cable00D6151A3RH14 QSFP+ transceivers - 40 GbELenovo 40GBase QSFP+ Bi-Directional Transceiver00YL631ATYW2 Lenovo 40GBASE-SR4 QSFP+ Transceiver49Y7884A1DR2 Lenovo 40GBASE-iSR4 QSFP+ Transceiver00D9865ASTM2 Lenovo 40GBASE-eSR4 QSFP+ Transceiver00FE325A5U92 Lenovo 40GBASE-LR4 QSFP+ Transceiver00D6222A3NY2Optical cables for 40 GbE QSFP+ SR4/iSR4/eSR4 transceivers Lenovo 10m QSFP+ MPO-MPO OM3 MMF Cable 00VX003AT2U 2Lenovo 30m QSFP+ MPO-MPO OM3 MMF Cable00VX005AT2V 2Optical breakout cables for 40 GbE QSFP+ iSR4/eSR4 transceivers Lenovo 1m MPO-4xLC OM3 MMF Breakout Cable 00FM412A5UA 2Lenovo 3m MPO-4xLC OM3 MMF Breakout Cable 00FM413A5UB 2Lenovo 5m MPO-4xLC OM3 MMF Breakout Cable 00FM414A5UC2QSFP+ active optical cables - 40 GbELenovo 1m QSFP+ to QSFP+ Active Optical Cable 7Z57A04256AX422Lenovo 3m QSFP+ to QSFP+ Active Optical Cable 00YL652ATZ32Lenovo 5m QSFP+ to QSFP+ Active Optical Cable 00YL655ATZ42Lenovo 7m QSFP+ to QSFP+ Active Optical Cable 00YL658ATZ52Lenovo 15m QSFP+ to QSFP+ Active Optical Cable 00YL661ATZ62Lenovo 20m QSFP+ to QSFP+ Active Optical Cable 00YL664ATZ72QSFP+ active optical breakout cables - 40 GbE to 4x10 GbE Lenovo 1M QSFP+ to 4xSFP+ Active Optical Cable 00YL667ATZ82Lenovo 3M QSFP+ to 4xSFP+ Active Optical Cable 00YL670ATZ92Lenovo 5M QSFP+ to 4xSFP+ Active Optical Cable 00YL673ATZA 2QSFP+ direct-attach cables - 40 GbE Lenovo 1m Passive QSFP+ DAC Cable 49Y7890A1DP 2Lenovo 3m Passive QSFP+ DAC Cable 49Y7891A1DQ 2Lenovo 5m Passive QSFP+ DAC Cable 00D5810A2X82Lenovo 7m Passive QSFP+ DAC Cable 00D5813A2X92QSFP+ breakout cables - 40 GbE to 4x10 GbELenovo 1m Passive QSFP+ to SFP+ Breakout DAC Cable 49Y7886A1DL 2Lenovo 3m Passive QSFP+ to SFP+ Breakout DAC Cable 49Y7887A1DM 2Lenovo 5m Passive QSFP+ to SFP+ Breakout DAC Cable49Y7888A1DN2DescriptionPart number Featurecode Maximum quantity supportedThe network cables that can be used with the switch are listed in the following table.Table 6. EN4093R network cabling requirementsTransceiver Standard Cable Connector 40 Gb Ethernet40Gb SR QSFP+ BiDi (00YL631)40GBASE-SRBiDiUp to 30 m with fiber optic cables supplied by Lenovo (seeTable 5); up to 100 m with OM3 or up to 150 m with OM4multimode fiber optic cable.LC40Gb SR4 QSFP+ (49Y7884)40GBASE-SR410 m or 30 m MPO fiber optic cables supplied byLenovo (see Table 5); up to 100 m with OM3 or up to 150 mwith OM4 multimode fiber optic cable.MPO40Gb iSR4 QSFP+ (00D9865)40GBASE-SR410 m or 30 m MPO fiber optic cables or MPO-4xLCbreakout cables up to 5 m supplied by Lenovo (see Table5); up to 100 m with OM3 or up to 150 m with OM4multimode fiber optic cable.MPO40Gb eSR4 QSFP+ (00FE325)40GBASE-SR410 m or 30 m MPO fiber optic cables or MPO-4xLCbreakout cables up to 5 m supplied by Lenovo (see Table5); up to 300 m with OM3 or up to 400 m with OM4multimode fiber optic cable.MPO40Gb LR4 QSFP+(00D6222)40GBASE-LR41310 nm single-mode fiber optic cable up to 10 km.LCActive optical cable40GBASE-SR4QSFP+ to QSFP+ active optical cables up to 1 m; QSFP+to 4x SFP+ active optical break-out cables up to 5 m for 4x10 GbE SFP+ connections out of a 40 GbE port (see Table5)QSFP+Direct attach copper cable40GBASE-CR4QSFP+ to QSFP+ DAC cables up to 7 m; QSFP+ to4x SFP+ DAC break-out cables up to 5 m for 4x 10 GbESFP+ connections out of a 40 GbE port (see Table 5).QSFP+ 10 Gb Ethernet10Gb SR SFP+ (46C3447) 1/10Gb SFP+ (00MY034)10GBASE-SR Up to 30 m with fiber optic cables supplied by Lenovo (seeTable 5); up to 300 m with OM3 or up to 400 m with OM4multimode fiber optic cable.LC10Gb LR SFP+ (00FE331)10GBASE-LR1310 nm single-mode fiber optic cable up to 10 km.LC 10Gb RJ-45 SFP+(7G17A03130)10GBASE-T UTP Category 6a or 7 up to 30 meters.RJ-45 Active optical cable10GBASE-SR SFP+ active optical cables up to 20 m (see Table 5)SFP+ Direct attach copper cable10GSFP+Cu SFP+ DAC cables up to 7 m (see Table 5).SFP+ 1 Gb Ethernet1Gb RJ-45 SFP (00FE333)1000BASE-T UTP Category 5, 5E, or 6 up to 100 meters.RJ-451Gb SX SFP (81Y1622) 1/10Gb SFP+ (00MY034)1000BASE-SX Up to 30 m with fiber optic cables supplied by Lenovo (seeTable 5); 850 nm multimode fiber cable 50 µ (OM2) up to550 m or 62.5 µ (OM1) up to 220 m.LC1Gb LX SFP (90Y9424)1000BASE-LX1310 nm single-mode fiber optic cable up to 10 km.LC Management ports1 GbE management port1000BASE-T UTP Category 5, 5E, or 6 up to 100 meters.RJ-45 RS-232 management port RS-232DB-9-to-mini-USB or RJ-45-to-mini-USB console cable(comes with the optional Cable Kit, 90Y9338).Mini-USBFigure 3. Location of the I/O bays in the Flex System Enterprise ChassisThe EN4093R switches can be installed in bays 1, 2, 3, and 4 of the Enterprise chassis. A supported adapter must be installed in the corresponding slot of the compute node. Each adapter can use up to four lanes to connect to the respective I/O module bay. The EN4093R can use up to three of the four lanes.In compute nodes that have an integrated dual-port 10 GbE network interface controller (NIC), NIC ports are routed to bays 1 and 2 with a specialized periscope connector, and the adapter is not required. However, the periscope connector can be replaced with the adapter when needed. In such a case, integrated NIC is disabled. With flexible port mapping, there is no need to buy switch upgrades for 4-port and 8-port adapters if the total number of port licenses on the switch does not exceed the number of external (upstream network ports) and internal (compute node network ports) connections that are used.The following table shows compatibility information for the EN4093R and Flex System chassis.Table 7. Flex System chassis compatibilityThe midplane connections between the adapters that are installed in the compute nodes to the I/O module bays in the chassis are listed in the following table. Half-wide compute nodes support up to two adapters, and full-wide compute nodes support up to four adapters.Table 8. Adapter to I/O bay correspondenceI/O adapter slotin the compute node Port on the adapter Corresponding I/O module bay in the chassisBay 1Bay 2Bay 3Bay 4Slot 1Port 1YesPort 2YesPort 3YesPort 4YesPort 5YesPort 6YesPort 7*Port 8*Slot 2Port 1YesPort 2YesPort 3YesPort 4YesPort 5YesPort 6YesPort 7*Port 8*Slot 3(full-wide compute nodes only)Port 1YesPort 2Yes Port 3YesPort 4Yes Port 5YesPort 6Yes Port 7*Port 8*Slot 4(full-wide compute nodes only)Port 1YesPort 2Yes Port 3YesPort 4Yes Port 5YesPort 6Yes Port 7*Port 8** Ports 7 and 8 are routed to I/O bays 1 and 2 (Slot 1 and Slot 3) or 3 and 4 (Slot 2 and Slot 4), but these ports cannot be used with the EN4093R switch.The following table lists the adapters that are supported by the I/O module.Table 9. Network adaptersDescription Part number Featurecode50 Gb EthernetThinkSystem QLogic QL45212 Flex 50Gb 2-Port Ethernet Adapter7XC7A05843B2VT ThinkSystem QLogic QL45262 Flex 50Gb 2-Port Ethernet Adapter with iSCSI/FCoE7XC7A05845B2VV25 Gb EthernetThinkSystem QLogic QL45214 Flex 25Gb 4-Port Ethernet Adapter7XC7A05844B2VU10 Gb EthernetEmbedded 10Gb Virtual Fabric Adapter (2-port)†None None Flex System CN4052S 2-port 10Gb Virtual Fabric Adapter00AG540ATBT Flex System CN4052S 2-port 10Gb Virtual Fabric Adapter Advanced01CV780AU7X Flex System CN4054S 4-port 10Gb Virtual Fabric Adapter00AG590ATBS Flex System CN4054S 4-port 10Gb Virtual Fabric Adapter Advanced01CV790AU7Y1 Gb EthernetEmbedded 1 Gb Ethernet controller (2-port)*None None† The Embedded 10Gb Virtual Fabric Adapter is built into selected compute nodes.* The Embedded 1 Gb Ethernet controller is built into selected compute nodes.Network connectivityThe following table lists the 10 Gb, 25 Gb, and 40 Gb Ethernet network switches that are offered by Lenovo that can be used with the EN4093R switch in Flex System network connectivity solutions.Table 10. Network switchesDescription Part number 10 Gb Ethernet switchesLenovo ThinkSystem NE1032 RackSwitch (Rear to Front)7159A1X Lenovo ThinkSystem NE1032T RackSwitch (Rear to Front)7159B1X Lenovo ThinkSystem NE1064TO RackSwitch (Rear to Front, ONIE)7Z330O11WW Lenovo ThinkSystem NE1072T RackSwitch (Rear to Front)7159C1X Lenovo RackSwitch G8272 (Rear to Front)7159CRW25 Gb Ethernet switchesLenovo ThinkSystem NE2572 RackSwitch (Rear to Front)7159E1X Lenovo ThinkSystem NE2572O RackSwitch (Rear to Front, ONIE)7Z210O21WW Lenovo ThinkSystem NE2580O RackSwitch (Rear to Front, ONIE)7Z330O21WW 100 Gb Ethernet switches (support 40 GbE connectivity)Lenovo ThinkSystem NE10032 RackSwitch (Rear to Front)7159D1X Lenovo ThinkSystem NE10032O RackSwitch (Rear to Front, ONIE)7Z210O11WWFor more information, see the list of Product Guides in the Top-of-rack Switches category:/servers/options/switchesStorage connectivityThe following table lists the external storage systems that are currently offered by Lenovo that can be used with the EN4093R switch for external NAS or iSCSI SAN storage connectivity.Table 11. External storage systems: DE SeriesDescription Part number Worldwide JapanLenovo ThinkSystem DE2000HLenovo ThinkSystem DE2000H 10GBASE-T Hybrid Flash Array LFF (16 GB cache)7Y70A003WW7Y701001JP Lenovo ThinkSystem DE2000H 10GBASE-T Hybrid Flash Array SFF (16 GB cache)7Y71A002WW7Y711005JP Lenovo ThinkSystem DE2000H iSCSI Hybrid Flash Array LFF (16 GB cache)7Y70A004WW7Y701000JP Lenovo ThinkSystem DE2000H iSCSI Hybrid Flash Array SFF (16 GB cache)7Y71A003WW7Y711006JP Lenovo ThinkSystem DE4000HLenovo ThinkSystem DE4000H iSCSI Hybrid Flash Array 4U60 (16 GB cache)7Y77A000WW7Y771002JP Lenovo ThinkSystem DE4000H iSCSI Hybrid Flash Array LFF (16 GB cache)7Y74A002WW7Y74A002JP Lenovo ThinkSystem DE4000H iSCSI Hybrid Flash Array SFF (16 GB cache)7Y75A001WW7Y75A001JP Lenovo ThinkSystem DE4000FLenovo ThinkSystem DE4000F iSCSI All Flash Array SFF (16 GB cache)7Y76A002WW7Y76A002JP Lenovo ThinkSystem DE4000F iSCSI All Flash Array SFF (64 GB cache)7Y76A007WW7Y76A00AJP Lenovo ThinkSystem DE6000HLenovo ThinkSystem DE6000H iSCSI Hybrid Flash Array 4U60 (32 GB cache)7Y80A002WW7Y801000JP Lenovo ThinkSystem DE6000H iSCSI Hybrid Flash Array SFF (32 GB cache)7Y78A002WW7Y781000JP Lenovo ThinkSystem DE6000FLenovo ThinkSystem DE6000F iSCSI All Flash Array SFF (128 GB cache)7Y79A002WW7Y79A002JPTable 12. External storage systems: DM SeriesDescription Part number Lenovo ThinkSystem DM3000HThinkSystem DM3000H Hybrid Storage Array (2U12 LFF, CTO only)7Y42CTO1WW ThinkSystem DM3000H, 48TB (12x 4TB HDDs), 10GBASE-T, ONTAP 9.5 Fundamentals7Y421003EA* ThinkSystem DM3000H, 48TB (12x 4TB HDDs), 10GBASE-T, ONTAP 9.57Y421007EA* ThinkSystem DM3000H, 48TB (12x 4TB HDDs), 16Gb FC / 10GbE SFP+, ONTAP 9.5 Fundamentals7Y421009NA* ThinkSystem DM3000H, 48TB (12x 4TB HDDs), 16Gb FC / 10GbE SFP+, ONTAP 9.5 Fundamentals7Y421002EA* ThinkSystem DM3000H, 48TB (12x 4TB HDDs), 16Gb FC / 10GbE SFP+, ONTAP 9.57Y421006EA* ThinkSystem DM3000H, 96TB (12x 8TB HDDs), 10GBASE-T, ONTAP 9.5 Fundamentals7Y421005EA* ThinkSystem DM3000H, 96TB (12x 8TB HDDs), 10GBASE-T, ONTAP 9.57Y421001EA* ThinkSystem DM3000H, 96TB (12x 8TB HDDs), 16Gb FC / 10GbE SFP+, ONTAP 9.5 Fundamentals7Y421004EA* ThinkSystem DM3000H, 96TB (12x 8TB HDDs), 16Gb FC / 10GbE SFP+, ONTAP 9.57Y421008EA* Lenovo ThinkSystem DM5000HThinkSystem DM5000H Hybrid Storage Array (2U24 SFF, CTO only)7Y57CTO1WW ThinkSystem DM5000H, 11.5TB (12x 960GB SSDs), 10GBASE-T, ONTAP 9.5 Fundamentals7Y571004EA* ThinkSystem DM5000H, 11.5TB (12x 960GB SSDs), 10GBASE-T, ONTAP 9.57Y57100LEA* ThinkSystem DM5000H, 11.5TB (12x 960GB SSDs), 16Gb FC / 10GbE SFP+, ONTAP 9.5 Fundamentals7Y571011NA* ThinkSystem DM5000H, 11.5TB (12x 960GB SSDs), 16Gb FC / 10GbE SFP+, ONTAP 9.5 Fundamentals7Y571003EA*Description Part number ThinkSystem DM5000H, 11.5TB (12x 960GB SSDs), 16Gb FC / 10GbE SFP+, ONTAP 9.57Y57100KEA* ThinkSystem DM5000H, 14.4TB (12x 1.2TB HDDs), 10GBASE-T, ONTAP 9.5 Fundamentals7Y57100CEA*7Y57100BEA* ThinkSystem DM5000H, 14.4TB (12x 1.2TB HDDs), 16Gb FC / 10GbE SFP+, ONTAP 9.5FundamentalsThinkSystem DM5000H, 21.6TB (12x 1.8TB HDDs), 10GBASE-T, ONTAP 9.5 Fundamentals7Y57100GEA* ThinkSystem DM5000H, 21.6TB (12x 1.8TB HDDs), 16Gb FC / 10GbE SFP+, ONTAP 9.57Y57100FEA* FundamentalsThinkSystem DM5000H, 23TB (24x 960GB SSDs), 10GBASE-T, ONTAP 9.5 Fundamentals7Y571006EA* ThinkSystem DM5000H, 23TB (24x 960GB SSDs), 10GBASE-T, ONTAP 9.57Y57100NEA* ThinkSystem DM5000H, 23TB (24x 960GB SSDs), 16Gb FC / 10GbE SFP+, ONTAP 9.5 Fundamentals7Y571005EA* ThinkSystem DM5000H, 23TB (24x 960GB SSDs), 16Gb FC / 10GbE SFP+, ONTAP 9.57Y57100MEA* ThinkSystem DM5000H, 28.8TB (24x 1.2TB HDDs), 10GBASE-T, ONTAP 9.5 Fundamentals7Y57100EEA* ThinkSystem DM5000H, 28.8TB (24x 1.2TB HDDs), 10GBASE-T, ONTAP 9.57Y57100VEA*7Y57100DEA* ThinkSystem DM5000H, 28.8TB (24x 1.2TB HDDs), 16Gb FC / 10GbE SFP+, ONTAP 9.5FundamentalsThinkSystem DM5000H, 43.2TB (24x 1.8TB HDDs), 10GBASE-T, ONTAP 9.5 Fundamentals7Y57100JEA* ThinkSystem DM5000H, 43.2TB (24x 1.8TB HDDs), 10GBASE-T, ONTAP 9.57Y571002EA*7Y571010NA* ThinkSystem DM5000H, 43.2TB (24x 1.8TB HDDs), 16Gb FC / 10GbE SFP+, ONTAP 9.5Fundamentals7Y57100HEA* ThinkSystem DM5000H, 43.2TB (24x 1.8TB HDDs), 16Gb FC / 10GbE SFP+, ONTAP 9.5FundamentalsThinkSystem DM5000H, 43.2TB (24x 1.8TB HDDs), 16Gb FC / 10GbE SFP+, ONTAP 9.57Y57100ZEA* ThinkSystem DM5000H, 46TB (12x 3.84TB SSDs), 10GBASE-T, ONTAP 9.5 Fundamentals7Y571008EA* ThinkSystem DM5000H, 46TB (12x 3.84TB SSDs), 10GBASE-T, ONTAP 9.57Y57100QEA* ThinkSystem DM5000H, 46TB (12x 3.84TB SSDs), 16Gb FC / 10GbE SFP+, ONTAP 9.5 Fundamentals7Y571007EA* ThinkSystem DM5000H, 46TB (12x 3.84TB SSDs), 16Gb FC / 10GbE SFP+, ONTAP 9.57Y57100PEA* ThinkSystem DM5000H, 92TB (24x 3.84TB SSDs), 10GBASE-T, ONTAP 9.5 Fundamentals7Y57100AEA* ThinkSystem DM5000H, 92TB (24x 3.84TB SSDs), 10GBASE-T, ONTAP 9.57Y57100REA* ThinkSystem DM5000H, 92TB (24x 3.84TB SSDs), 16Gb FC / 10GbE SFP+, ONTAP 9.5 Fundamentals7Y571009EA* ThinkSystem DM5000H, 92TB (24x 3.84TB SSDs), 16Gb FC / 10GbE SFP+, ONTAP 9.57Y57100SEA* Lenovo ThinkSystem DM5000FThinkSystem DM5000F Flash Storage Array (2U24 SFF, CTO only)7Y41CTO1WW ThinkSystem DM5000F, 11.5TB (12x 960GB SSDs), 10GBASE-T, ONTAP 9.57Y411002EA* ThinkSystem DM5000F, 11.5TB (12x 960GB SSDs), 16Gb FC / 10GbE SFP+, ONTAP 9.57Y411001EA* ThinkSystem DM5000F, 23TB (24x 960GB SSDs), 10GBASE-T, ONTAP 9.57Y411004EA* ThinkSystem DM5000F, 23TB (24x 960GB SSDs), 16Gb FC / 10GbE SFP+, ONTAP 9.57Y411003EA* ThinkSystem DM5000F, 46TB (12x 3.84TB SSDs), 10GBASE-T, ONTAP 9.57Y411006EA* ThinkSystem DM5000F, 46TB (12x 3.84TB SSDs), 16Gb FC / 10GbE SFP+, ONTAP 9.57Y411005EA* ThinkSystem DM5000F, 92TB (24x 3.84TB SSDs), 10GBASE-T, ONTAP 9.57Y411007EA* ThinkSystem DM5000F, 92TB (24x 3.84TB SSDs), 16Gb FC / 10GbE SFP+, ONTAP 9.57Y411000EA* Lenovo ThinkSystem DM7000HThinkSystem DM7000H Hybrid Storage Array (3U, CTO only)7Y56CTO1WW Lenovo ThinkSystem DM7000FThinkSystem DM7000F Flash Storage Array (3U, CTO only)7Y40CTO1WW * Preconfigured models that are available only in North America (part numbers that have NA at the end) or EMEA (part numbers thatTrademarksLenovo and the Lenovo logo are trademarks or registered trademarks of Lenovo in the United States, other countries, or both. A current list of Lenovo trademarks is available on the Web athttps:///us/en/legal/copytrade/.The following terms are trademarks of Lenovo in the United States, other countries, or both:Lenovo®Flex SystemNMotion®RackSwitchThinkSystem®VMready®XClarity®The following terms are trademarks of other companies:Intel® is a trademark of Intel Corporation or its subsidiaries.Hyper-V® and Microsoft® are trademarks of Microsoft Corporation in the United States, other countries, or both. Other company, product, or service names may be trademarks or service marks of others.。

图形工作站配置参数

15
保修
厂家三年保修及人工服务
号条款为必须满足项，需提供证明文件
7
光驱
DVD-ROM
8
网卡
万兆网卡*2
9
外部接口
Realtek ALC662/前置接口：自带闪亮பைடு நூலகம்示灯,USB 3.0接口2个,灵动扩展区支持1394,eSATA/支持9合1SD读卡器/6个(其中4个USB3.0接口)/2个 PCIe 3.0 x16 插槽/1个PCIe x8 插槽/1个PCIe x4 插槽/2个5.25" 外置托架；
4
内存
16GB DDR4 RDIMM，最少支持4条内存插槽
5
硬盘
1块2TB SATA 3.5硬盘,1块2TB M.2 PCIe SSD硬盘/Raid 支持RAID 0，RAID 1，RAID 5 和RAID 10；
6
显卡
1块NVIDIA RTX A4000 16GDDR6 显卡，3条高清视频连接线；
图形工作站
图形工作站配置参数
数量：16套
序号
指标项
技术规格要求
1
品牌类型
国内知名品牌
2
显示器
24英寸LED背光，分辨率3840×2160，亮度500cd/㎡，刷新率60Hz，色数10亿，与主机同一品牌。
3
CPU
IntelXeon Skylake-W2223,4Cores,3.6GHz,8.25MB Cache,DDR4-2666, Turbo, 120W；
10
电源
950W电源
11
操作系统
正版 Windows10专业版操作系统64位
12
机箱
塔式机箱，175 x 426 x 375 mm/标配内置扬声器

联想Legion 5 15ITH6H 产品规格参考 1 of 7

OVERVIEWB 3.2 Gen 1 6.HDMI2.12.E-camera shutter switch7.Power connector3.Ethernet (RJ-45)8.Thunderbolt 44.Thunderbolt 49.Headphone / microphone combo jack (3.5mm)5.3x USB 3.2 Gen 1 (one Always On)PERFORMANCEProcessorProcessor Family11th Generation Intel® Core™ i5 / i7 ProcessorProcessor**Operating SystemOperating System**Windows® 11 Pro 64••Windows 11 Home 64Windows 10 Pro 64••Windows 10 Home 64•No operating systemGraphicsGraphics**Monitor SupportMonitor SupportSupports up to 4 independent displays (native display and 3 external monitors via HDMI® and USB-C®)• HDMI supports up to 7680x4320@60Hz• USB-C supports up to 5120x3200@60HzChipsetChipsetIntel HM570 chipsetMemoryMax Memory[1]•Up to 32GB DDR4-2933 offering•Up to 32GB DDR4-3200 offeringMemory SlotsTwo DDR4 SO-DIMM slots, dual-channel capableMemory Type**•DDR4-2933•DDR4-3200Notes:1.The max memory is based on the test results with current Lenovo® memory offerings. The system may support more memory as the technology develops.StorageStorage Support[1]Up to two drives, 2x M.2 SSD• M.2 2242 SSD up to 512GB• M.2 2280 SSD up to 1TBStorage SlotTwo M.2 slots• One M.2 2280 PCIe® Gen 3x4 slot, supports M.2 2242/2280 SSD• One M.2 2280 PCIe Gen 4x4 slot, supports M.2 2242/2280 SSDStorage Type**Notes:1.The storage capacity supported is based on the test results with current Lenovo storage offerings. The system may support larger storage as the technology develops.Removable StorageOpticalNoneCard ReaderNo card readerMulti-MediaAudio ChipHigh Definition (HD) Audio, Realtek® ALC3306 codecSpeakersStereo speakers, 2W x2, Nahimic AudioMicrophoneDual array microphoneCameraHD 720p, with E-camera shutter, fixed focusBatteryBattery**Integrated Li-Polymer 60Wh battery, supports Rapid Charge Pro (charge up to 50% in 30min)••Integrated Li-Polymer 80Wh battery, supports Rapid Charge Pro (charge up to 50% in 30min)Max Battery Life[1]MobileMark® 2018: 7.5 hrNotes:1.All battery life claims are approximate maximum and based on results using the MobileMark 2014, MobileMark 2018, JEITA 2.0, continuous 1080p video playback (with 150nits brightness and default volume level) or Google Power Load Test (PLT) battery-life benchmark tests. Actual battery life will vary and depends on many factors such as product configuration and usage, software use, wireless functionality, power management settings, and screen brightness. The maximum capacity of the battery will decrease with time and use.Power AdapterPower Adapter**[1]•230W slim tip (3-pin) AC adapter, 100-240V, 50-60Hz•300W slim tip (3-pin) AC adapter, 100-240V, 50-60HzNotes:1.AC adapter offerings depend on the country.DisplayDisplay**[1]TouchscreenNon-touchNotes:California Electronic Waste Recycling Fee1.In California, per state law, Lenovo charges an electronic waste recycling fee on this covered device at the time of sale of the product.For more information, go to https:///Electronics/ConsumerInput DeviceKeyboard**•Phantom blue model: 6-row, multimedia Fn keys, numeric keypad, black keycap•Stingray model: 6-row, multimedia Fn keys, numeric keypad, moon white keycapKeyboard Backlight**Blue backlight••White backlight•4-Zone RGB backlightTouchpadButtonless Mylar® surface multi-touch touchpad, 69 x 104 mm (2.72 x 4.09 inches)Mechanical[1]Dimensions (WxDxH)362.56 x 260.61 x 22.5-25.75 mm (14.27 x 10.26 x 0.89-1.01 inches)Weight2.4 kg (5.3 lbs)Case Color**•Phantom blue (top), shadow black (bottom)•Stingray (top), dove grey (bottom)Surface TreatmentPaintingCase MaterialPC + ABS (top), PC + ABS (bottom)System LightingNo system lightingNotes:1.The system dimensions and weight vary depending on configurations.CONNECTIVITYNetworkOnboard EthernetGigabit Ethernet, 1x RJ-45WLAN + Bluetooth®[1][2]Wi-Fi® 6, 802.11ax 2x2 Wi-Fi + Bluetooth 5.1, M.2 cardNotes:1.Bluetooth 5.2 is hardware ready but may run at a lower version due to OS limitation2.Wi-Fi 6 full features might be limited by country-level restrictions.Ports[1]Standard Ports3x USB 3.2 Gen 1••1x USB 3.2 Gen 1 (Always On)•1x Thunderbolt™ 4 / USB4® 40Gbps (support data transfer and DisplayPort™ 1.4)1x Thunderbolt 4 / USB4 40Gbps (support data transfer, Power Delivery and DisplayPort 1.4)••1x HDMI 2.1•1x Ethernet (RJ-45)•1x Headphone / microphone combo jack (3.5mm)•1x Power connectorNotes:1.The transfer speed of following ports will vary and, depending on many factors, such as the processing speed of the host device, file attributes and other factors related to system configuration and your operating environment, will be slower than theoretical speed.USB 2.0: 480 Mbit/s;USB 3.2 Gen 1 (SuperSpeed USB 5Gbps, formerly USB 3.0 / USB 3.1 Gen 1): 5 Gbit/s;USB 3.2 Gen 2 (SuperSpeed USB 10Gbps, formerly USB 3.1 Gen 2): 10 Gbit/s;USB 3.2 Gen 2x2 (SuperSpeed USB 20Gbps): 20 Gbit/s;Thunderbolt 3/4: 40 Gbit/sSECURITY & PRIVACYSecuritySecurity ChipFirmware TPM 2.0 integrated in SoCFingerprint ReaderNo fingerprint readerBIOS Security•Power-on password•Supervisor passwordHard disk password•Other SecurityE-Camera shutterSERVICEWarrantyBase Warranty**[1]•1-year depot service1-year depot with 2-year system board service (Korea only)••2-year (1-yr battery) depot service•3-year (1-yr battery) depot service•No base warrantyNotes:1.More information of warranty policy, please access https:///warrantyENVIRONMENTALOperating EnvironmentTemperature[1]•At altitudes up to 2438 m (8,000 ft)- Operating: 5°C to 35°C (41°F to 95°F)- Storage: 5°C to 43°C (41°F to 109°F)•At altitudes above 2438 m (8,000 ft)- Maximum temperature when operating under the unpressurized condition: 31.3°C (88°F)HumidityOperating: 8% to 95% at wet-bulb temperature 23°C (73°F)••Storage: 5% to 95% at wet-bulb temperature 27°C (81°F)AltitudeMaximum altitude (without pressurization): 3048 m (10,000 ft)Notes:1.When you charge the battery, its temperature must be no lower than 10°C (50°F).ACCESSORIESBundled AccessoriesBundled AccessoriesLenovo Legion™ M300 RGB Gaming Mouse (USB connector)••NoneCERTIFICATIONSGreen CertificationsGreen Certifications•ErP Lot 3•RoHS compliant•Feature with ** means that only one offering listed under the feature is configured on selected models.Lenovo reserves the right to change specifications or other product information without notice. Lenovo is not •responsible for photographic or typographical errors. LENOVO PROVIDES THIS PUBLICATION “AS IS,”WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR IMPLIED, INCLUDING THE IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE. Some jurisdictions do not allowdisclaimer of express or implied warranties in certain transactions, therefore this disclaimer may not apply to you.•The specifications on this page may not be available in all regions, and may be changed or updated without notice.。

BFG591中文资料

150 Ts (oC) 200
Fig.2 Power derating curve.
250
handbook, halfpage
h FE
200
150
100
50
0
10 2
10 1
1
MRA749
10
10 2
IC (mA)
VCE = 12 V.
Fig.3 DC current gain as a function of collector current, typical values.
1995 Sep 04
4
元器件交易网
Philips Semiconductors
NPN 7 GHz wideband transistor
Product speciﬁcation
BFG591
3.0 Ptot (W)
2.5
2.0
1.5
1.0
0.5
0 0
MGC791
50
100
SYMBOL
PARAMETER
CONDITIONS
VCBO VCEO VEBO IC Ptot Tstg Tj
collector-base voltage collector-emitter voltage emitter-base voltage collector current (DC) total power dissipation storage temperature junction temperature
open emitter open base
up to Ts = 80 °C; note 1 IC = 70 mA; VCE = 8 V IC = Ic = 0; VCE = 12 V; f = 1 MHz IC = 70 mA; VCE = 12 V; f = 1 GHz IC = 70 mA; VCE = 12 V; f = 900 MHz; Tamb = 25 °C IC = 70 mA; VCE = 12 V; f = 900 MHz; Tamb = 25 °C

Fujitsu CELSIUS W580 微型台式机工作站产品说明书

Data Sheet Fujitsu CELSIUS W580Fujitsu recommends Windows 10 Pro for business.Data SheetFujitsu CELSIUS W580Mini CAD PowerhouseIf you thought you would need to sacrifice performance, expandability, price or energy efficiency in a microtower design – think again. As an industry first, the FUJITSU CELSIUS W580 desktop workstation goes far and beyond with its innovative 21-liter, space-saving microtower design.No compromise in terms of performance, expandability and priceDesigned with CAD customers in mind: performance, reliability and great flexibility - at an affordable priceChoose between the energy-efficient Intel® Core™ processors or the powerful Intel® Xeon® E-2200 processor familySupport of Windows 10 Pro64 GB DDR4 2,666 MHz memory (incl. ECC) Maximum capacity of 16 TBBoost your storage performance with super-fast PCIe SSDsIndustry’s smallest VR-ready desktop workstation Innovative space-saving design - made in EuropeAn industry first: 21-liter desktop microtower workstationNVIDIA® Quadro® RTX 4000 VR-ready graphics (with CELSIUS W580power) Optimized thermal management and cooling solutionsEnjoy a silent workplace environment, thanks to low noise emission down to 18 dB(A) (depending on configuration)Multi-monitor experienceIdeal for showrooms, control rooms, surveillance or financial services companies Up to 8 monitors with the NVIDIA® Mosaic™ technology2-in-1: Workstation and Point-of-Sales deviceYour workstation can be deployed as a traditional workstation as well as a point-of-sales device in any retail environmentConnect your cash drawer and your scanner to two serial portsSupport of 24/7 operation with reliable high-endurance and business critical drivesComponentsProcessor Intel® Xeon® processor E-2288G (8 Cores / 16 Threads, 3.70 GHz, up to 5.0 GHz, 16 MB)Intel® Xeon® processor E-2286G (6 Cores / 12 Threads, 4.00 GHz, up to 4.9 GHz, 12 MB)Intel® Xeon® processor E-2278G (8 Cores / 16 Threads, 3.40 GHz, up to 5.0 GHz, 16 MB)Intel® Xeon® processor E-2276G (6 Cores / 12 Threads, 3.80 GHz, up to 4.9 GHz, 12 MB)Intel® Xeon® processor E-2274G (4 Cores / 8 Threads, 4.00 GHz, up to 4.9 GHz, 8 MB)Intel® Xeon® processor E-2246G (6 Cores / 8 Threads, 3.60 GHz, up to 4.8 GHz, 12 MB)Intel® Xeon® processor E-2244G (4 Cores / 8 Threads, 3.80 GHz, up to 4.8 GHz, 8 MB)Intel® Xeon® processor E-2236 (6 Cores / 12 Threads, 3.40 GHz, up to 4.8 GHz, 12 MB)Intel® Xeon® processor E-2234 (4 Cores / 8 Threads, 3.60 GHz, up to 4.8 GHz, 8 MB)Intel® Xeon® processor E-2226G (6 Cores / 6 Threads, 3.40 GHz, up to 4.6 GHz, 12 MB)Intel® Xeon® processor E-2224G (4 Cores / 4 Threads, 3.50 GHz, up to 4.7 GHz, 8 MB)Intel® Xeon® processor E-2224 (4 Cores / 4 Threads, 3.40 GHz, up to 4.6 GHz, 8 MB)Intel® Xeon® processor E-2186G (6 Cores / 12 Threads, 3.80 GHz, up to 4.7 GHz, 12 MB, Intel® UHD Graphics P630) *Intel® Xeon® processor E-2174G (4 Cores / 8 Threads, 3.80 GHz, up to 4.7 GHz, 8 MB, Intel® UHD Graphics P630) *Intel® Xeon® processor E-2136 (6 Cores / 12 Threads, 3.30 GHz, up to 4.5 GHz, 12 MB) *Intel® Xeon® processor E-2134 (4 Cores / 8 Threads, 3.50 GHz, up to 4.5 GHz, 8 MB) *Intel® Xeon® processor E-2126G (6 Cores / 6 Threads, 3.30 GHz, up to 4.5 GHz, 12 MB, Intel® UHD Graphics P630) *Intel® Xeon® processor E-2124 (4 Cores / 8 Threads, 3.30 GHz, up to 4.5 GHz, 8 MB) *Intel® Core™ i9-9900 processor (8 Cores / 16 Threads, 3.10 GHz, up to 5.0 GHz, 16 GB, Intel® UHD Graphics 630)Intel® Core™ i9-9900K processor (8 Cores / 16 Threads, 3.60 GHz, up to 5.0 GHz, 16 GB, Intel® UHD Graphics 630)Intel® Core™ i7-9700 processor (8 Cores / 8 Threads, 3.00 GHz, up to 4.7 GHz, 12 MB, Intel® HD Graphics 630) *Intel® Core™ i7-9700K processor (8 Cores / 8 Threads, 3.60 GHz, up to 4.9 GHz, 12 MB, Intel® UHD Graphics 630) *Intel® Core™ i5-9600 processor (6 Cores / 6 Threads, 3.10 GHz, up to 4.6 GHz, 9 MB, Intel® UHD Graphics 630) *Intel® Core™ i5-9500 processor (6 Cores / 6 Threads, 3.00 GHz, up to 4.4 GHz, 9 MB, Intel® UHD Graphics 630) *Intel® Core™ i5-8600 processor (6 Cores / 6 Threads, 3.10 GHz, up to 4.3 GHz, 9 MB, Intel® UHD Graphics 630) *Intel® Core™ i3-9100 processor (4 Cores / 4 Threads, 3.60 GHz, up to 4.2 GHz, 6 MB, Intel® HD Graphics 630) *Intel® vPro® Platform with all Intel® Xeon® processorsNo Intel® vPro® technology with Intel® Core™ i5 and Core™ i7 processors*with Intel® Turbo Boost Technology 2.0 (clock speed and performance will vary depending on workload and othervariables)Operating system preinstalledOperating system pre-installed Windows 10 Pro for WorkstationsWindows 10 Pro. Fujitsu recommends Windows 10 Pro forbusiness.Windows 10 Home Windows 10 Pro for WorkstationsWindows 10 Pro. Fujitsu recommends Windows 10 Pro for business.Windows 10 HomeOperating system compatible Linux LinuxOperating system notes Certified for Red Hat© Enterprise LinuxCertified for SUSE Enterprise DesktopCertified for SUSE Enterprise ServerFor some configurations third party drivers are currentlynot available or configuration restrictions may apply.Windows 10 Support: After the end of the product lifeFUJITSU will continue to test and support all upcomingWindow 10 releases for a period of maximum 5 years –depending on the available extension of hardware servicesthrough FUJITSU Warranty top ups. For details please see“FUJITSU Service Statement for Windows 10 Semi-Annual-Channel Support” at .Certified for Red Hat© Enterprise LinuxCertified for SUSE Enterprise Desktop (pending) Certified for SUSE Enterprise Server (pending)For some configurations third party drivers are currently not available or configuration restrictions may apply. Windows 10 Support: After the end of the product life FUJITSU will continue to test and support all upcoming Window 10 releases for a period of maximum 5 years – depending on the available extension of hardware services through FUJITSU Warranty top ups. For details please see “FUJITSU Service Statement for Windows 10 Semi-Annual-Channel Support” at .Memory modules 4 GB (1 module(s) 4 GB) DDR4, unbuffered, non-ECC, 2,666 MT/s, UDIMM8 GB (1 module(s) 8 GB) DDR4, unbuffered, ECC, 2,666 MT/s, UDIMM8 GB (1 module(s) 8 GB) DDR4, unbuffered, non-ECC, 2,666 MT/s, UDIMM16 GB (1 module(s) 16 GB) DDR4, unbuffered, ECC, 2,666 MT/s, UDIMM16 GB (1 module(s) 16 GB) DDR4, unbuffered, non-ECC, 2,666 MT/s, UDIMMGraphics High-end 3D: NVIDIA® Quadro® RTX 4000, 8 GB, PCIe x16, 3 x DisplayPort, 1 x Virtual LinkMidrange 3D: NVIDIA® Quadro® P2200, 5 GB, PCIe x16, 4 x DisplayPortMidrange 3D: AMD Radeon™ Pro WX 5100, 8 GB, 320 stream processors, PCIe x16, 4 x DisplayPortEntry 3D: NVIDIA® Quadro® P1000, 4 GB, PCIe x16, 4 x miniDPEntry 3D: AMD Radeon™ Pro WX 3100, 4 GB, 320 stream processors, PCIe x16, 1 x DisplayPort, 2 x miniDPEntry 3D: AMD Radeon™ Pro WX 2100, 2 GB, 320 stream processors, PCIe x16, 1 x DisplayPort, 2 x miniDPEntry 3D: NVIDIA® Quadro® P620, 2 GB, PCIe x16, 4 x miniDPEntry 3D: NVIDIA® Quadro® P400 , 2 GB, PCIe x16, 3 x miniDPRemote Graphics: CELSIUS RemoteAccess Dual Card, PCIe x1, 2 x miniDP, PCoIPRemote Graphics: CELSIUS RemoteAccess Quad Card, PCIe x1, 4 x miniDP, PCoIPOthers: VGA Extension CardOthers: DP to DVI-D (single link) Adapter CableOthers: MiniDP to DP Adapter CableNotes NVIDIA® Quadro® P4000 requires CELSIUS W580power or CELSIUS W580power+.Hard disk drives (internal)SSD SATA III, 960 GB High Endurance, 1DWDP, 2.5-inchSSD SATA III, 480 GB High Endurance, 1DWDP, 2.5-inchSSD SATA III, 240 GB High Endurance, 1DWDP, 2.5-inchSSD PCIe, 2048 GB M.2 NVMe Highend moduleSSD PCIe, 1024 GB M.2 NVMe Highend moduleSSD PCIe, 512 GB M.2 NVMe Highend moduleSSD PCIe, 256 GB M.2 NVMe Highend moduleSSD PCIe, 1x 2048 GB M.2 NVMe Highend cardSSD PCIe, 1x1024 GB M.2 NVMe Highend cardSSD PCIe, 1x 512 GB M.2 NVMe Highend cardSSD PCIe, 1x 256 GB M.2 NVMe Highend cardRAID1 Bundle 2x512GB M.2 NVMe HighendRAID1 Bundle 2x256GB M.2 NVMe HighendSSD PCIe, 1024 GB M.2 NVMe moduleSSD PCIe, 512 GB M.2 NVMe moduleSSD PCIe, 256 GB M.2 NVMe moduleSSD PCIe, 1024 GB M.2 NVMe module, SEDSSD PCIe, 512 GB M.2 NVMe module, SEDSSD PCIe, 256 GB M.2 NVMe module, SEDSSD PCIe, 1x 1024 GB M.2 NVMe cardSSD PCIe, 1x 512 GB M.2 NVMe cardSSD PCIe, 1x 256 GB M.2 NVMe cardSSD SATA III, 1024 GB, 2.5-inchSSD SATA III, 512 GB, 2.5-inchSSD SATA III, 256 GB, 2.5-inchSSD SATA III, 128 GB, 2.5-inchHDD SATA III, 7,200 rpm, 4,000 GB, 3.5-inch, business criticalHDD SATA III, 7,200 rpm, 2,000 GB, 3.5-inch, business criticalHDD SATA III, 7,200 rpm, 1,000 GB, 3.5-inch, business criticalHDD SATA III, 7,200 rpm, 2,000 GB, 2.5-inch, business criticalHDD SATA III, 7,200 rpm, 1,000 GB, 2.5-inch, business criticalHDD SATA III, 7,200 rpm, 2,000 GB, 3.5-inchHDD SATA III, 7,200 rpm, 1,000 GB, 3.5-inchHard disk notes One Gigabyte equals one billion bytes, when referring to hard disk drive capacity.24/7 ready (business critical HDDs required)Up to 20 GB of HDD space is reserved for system recoverySSHD (Solid State Hard Disk, Hybrid drive)SED (Self-Encrypting Drive)SSD (Solid State Disk)Drives (optional)BD Triple Writer SATA ultra slim (tray)DVD-ROMDVD Super MultiDVD Super Multi ultra slim (tray)MultiCard Reader 24in1 USB 2.0 3.5”Base unitBase unit CELSIUS W580CELSIUS W580powerMainboardMainboard type D3617Chipset Intel® C246Processor socket LGA 1151Processor quantity maximum1Supported capacity RAM (max.)64 GBMemory slots 4 DIMM (DDR4) ECC/non-ECCMemory frequency2,666 MT/sMemory notes Dual channel supportFor dual channel performance, 2 memory modules have to be ordered. Capacity per channel has to be the same.2666 MHz may be clocked down to 2400 MHz depending on processor and memory configurationLAN10/100/1,000 MBit/s Intel® I219LMBIOS version AMI Aptio VUEFI Specification 2.6BIOS features BIOS Flash EPROM update by softwareRecovery BIOSUnified Extensible Firmware Interface (UEFI)Audio type On boardAudio codec Realtek ALC671Audio features Internal speaker supports audio playback (optional), High Definition audio, 5.1 surround soundI/O controller on boardSerial ATA total8thereof SATA III8thereof eSATA 2 (optional)Controller functions Serial ATA III (6 Gbit)NCQAHCIRAID 0/1/5/10S26361-K1446-V515 CELSIUS W580Audio: line-in1Audio: line-out1Front audio: microphone1Front audio: headphone1Internal speakers1USB 2.0 total5USB 3.1 Gen1 (USB 3.0) total3S26361-K1446-V515 CELSIUS W580USB 3.1 Gen2 total5USB front2x USB 2.0; 2x USB 3.1 (gen2), 1x USB 3.1 (gen2) Type C; optional: 1x USB 3.1 Type-C (Gen2) via add on card and frontadapter bayUSB rear2x USB 2.0; 3x USB 3.1 (Gen1); 1x USB 3.1 (Gen2); optional: additional 1x USB 3.1 Type C (Gen2) via add on card USB internal1x USB 2.0 + 1x USB A 3.1 (Gen2)VGA optional: via adapter cardDisplayPort2DVI 1 (DVI-D)Serial (RS-232) optional: serial port (9pin, 16 byte FIFO, 16550 compatible)Mouse / Keyboard (PS/2)2Ethernet (RJ-45)1Parallel 1 (optional) (25pin with EPP and ECP)eSATA 1 (optional)Interface Module notes Anytime USB charge functionality, USB Typ C connector supports up to 15WInput device / componentsInput devices (optional)KeyboardMouseKBPC PX ECOMouse M440 ECOSpace Explorer USBDrive bays total62.5-inch internal bays13.5-inch internal bays23.5-inch external bays15.25-inch external bays2Drive bay notes5,25” bays: one bay in HH format, one bay for slim optical disc drive only;internal 3.5” bays: 3.5” drive (screwless) or 2.5” drive (screws);M.2-2280 1 x on mainboard (for PCIe or SATA SSD modules), supports Intel® Optane™ technologySlotsPCI-Express 3.0 x1 2 x ( / ) Full heightPCI-Express 3.0 x4 (mech. x16) 1 x (215 mm / ) Full heightPCI-Express 3.0 x16 1 x (240 mm / ) Full heightGraphics brand name Intel® HD Graphics P630, Intel® HD Graphics 630Shared video memory up to 1,782 MBTFT resolution (VGA)1,024 x 768 pixel1,280 x 1,024 pixel1,360 x 768 pixel1,440 x 900 pixel1,600 x 900 pixel1,600 x 1,200 pixel1,680 x 1,050 pixel1,920 x 1,080 pixelTFT resolution (DVI)1,280 x 1,024 pixel1,360 x 768 pixel1,440 x 900 pixel1,600 x 900 pixel1,680 x 1,050 pixel1,920 x 1,080 pixel1,920 x 1,200 pixelTFT resolution (DisplayPort)1,280 x 1,024 pixel1,360 x 768 pixel1,440 x 900 pixel1,600 x 900 pixel1,680 x 1,050 pixel1,920 x 1,080 pixel1,920 x 1,200 pixel2,560 x 1,440 pixel2,560 x 1,600 pixel3,440 x 1,440 pixel3,840 x 2,160 pixel4,096 x 2,304 pixelGraphics features Support for up to three independent displaysDirectX® 12HDCP supportOpenCL® 2.0OpenGL® 4.4One DisplayPort connector can be converted to DVI-D or HDMI with an optional external adapterFor multi monitoring mode, graphics card and integrated graphics run in parallelDisplayPort interface supports Ver. 1.2 incl. Multi-StreamDVI-D interface supports audio output for HDMI monitorsGraphics notes up to 1 GB dedicated video memory (main memory owned and locked for graphics use)Tested resolutions, depending on display type additional resolutions and frequencies possibleShared memory depending on main memory size and operating systemResolution (color depth up to 32 Bit/pixel)For TFT we recommend using 60HzElectrical valuesPower efficiency note power supply efficiency (at 230V; 10% / 20% / 50% / 100%load) : 75% / 83% / 85% / 84%power supply efficiency at 10% / 20% / 50% / 100% load for 230V: 80% / 87% / 90% / 87%; for 115V: 80% / 87% / 90% / 87%Rated voltage range100 V - 240 V100 V - 240 V Rated frequency range50 Hz - 60 Hz50 Hz - 60 Hz Operating voltage range90 V - 264 V90 V - 264 V Operating line frequency range47 Hz - 63 Hz47 Hz - 63 Hz Max. output of single power supply280 W400 W Power factor correction/active power active activeDimension with stand (W x D x H)Dimensions (W x D x H)180 x 304 x 375 mm7.09 x 11.97 x 14.76 inchOperating position VerticalWeight approx. 10 kg approx. 12 kg Weight (lbs)approx. 30.86 lbsWeight notes Actual weight may vary depending on configurationOperating ambient temperature10 - 35 °C (50 - 95 °F)Operating relative humidity 5 - 85 % (relative humidity)Product CELSIUS W580Model MI6WGermany GS (planned)Europe CEUSA/Canada FCC Class BcTUVusGlobal RoHS (Restriction of hazardous substances)WEEE (Waste electrical and electronic equipment)Microsoft Operating Systems (HCT / HCL entry / WHQL)ENERGY STAR® in progressChina CCC (planned)CCC (depending on configuration)CEL (Chinese energy label)TPM 2.0 for China (optional)Compliance link https:///sites/certificatesAdditional SoftwareAdditional software (preinstalled)Adobe® Reader® (pdf reader)McAfee® LiveSafe™ (provides award-winning antivirus protection for your PC and much more. 30 days trial pre-installed)Microsoft Office (1 month trial for new Microsoft® Office 365 customers. Buy Microsoft Office.)Additional software (optional)Recovery DVD for Windows®Drivers & Utilities DVD (DUDVD)CyberLink PowerDVD BD (playback software for Blu-ray Disc™)CyberLink PowerDVD DVD (playback software for DVD)Nero Essentials XLMicrosoft® Office Professional 2019Microsoft® Office Home and Business 2019(A Microsoft Account is required to activate each copy of these products. For purchase and activation only in the regionin which it was acquired.)SecurityPhysical Security Kensington Lock supportEye for padlockIntegrated cabinet lock (optional)Cable Cover (optional; covers and secures the ports andcables on rear side)Kensington Lock supportEye for padlockIntegrated cabinet lock (optional)Cable Cover (optional; covers and secures the ports and cables on rear side)System and BIOS Security Embedded security (TPM 2.0)EraseDisk (optional)Credential Guard Ready and Device Guard Capable(Windows 10, v. 1809; requires 8 GB or more system RAMand SSD PCIe NVME)Boot sector virus protectionWrite protect option for the Flash EPROMControl of all USB interfacesExternal USB ports can be disabled separatelyControl of external interfaces Embedded security (TPM 2.0)EraseDisk (optional)Credential Guard Ready and Device Guard Capable (Windows 10, v. 1809; requires 8 GB or more system RAM and SSD PCIe NVME)Boot sector virus protectionWrite protect option for the Flash EPROMControl of all USB interfacesExternal USB ports can be disabled separatelyControl of external interfacesUser Security User and supervisor BIOS passwordHard disk passwordAccess protection via external SmartCard reader (optional)Access protection via internal SmartCard reader (optional)Workplace Protect (secure authentication solution)User and supervisor BIOS passwordHard disk passwordAccess protection via external SmartCard reader (optional) Access protection via internal SmartCard reader (optional) Workplace Protect (secure authentication solution)Workplace Embedded Tools Auto BIOS Update via Fujitsu ServerAuto BIOS Update via customer serverEasy PC Protection Auto BIOS Update via Fujitsu Server Auto BIOS Update via customer server Easy PC ProtectionManageability MiscellaneousKeyboard on (Special Fujitsu keyboard required) Keyboard on with one key (KBPX Eco, KB521) Keyboard on with 2 keys (CTRL+CTRL) with PS2 or special USB keyboardsKeyboard on with any key (USB)Thermal managementExtended lifetime 24/7 (limited configurations)Keyboard on (Special Fujitsu keyboard required) Thermal managementKeyboard on with one key (KBPX Eco, KB521) Keyboard on with 2 keys (CTRL+CTRL) with PS2 or special USB keyboardsKeyboard on with any key (USB)Extended lifetime 24/7 (limited configurations)WarrantyWarranty period 3 years (depending on country)Warranty type Bring-In / Onsite Service (for countries within region EMEIA, for all other countries depending on local regulations) Product Support Services - the perfect extensionRecommended Service9x5, Onsite Response Time: Next Business DaySpare Parts availability 5 years after end of product lifeRecommended AccessoriesDisplay P27-8 TS UHDThe FUJITSU Display P27-8 TS UHD is perfect for multi-monitor usescenarios with its 3840 x 2160 Ultra HD resolution and the thin bezelhousing. The monitor has a 78°/178° wide viewing angle and a 100% sRGB color space to deliver you a consistent high picture quality. Features like ECO function, the DisplayView™ IT Suite manageability software as a range of connectivity options meet the requirements of medium- and large-sized businesses.Order Code: S26361-K1610-V160ContactFujitsu Technology SolutionsAddress: x-xx-x, street, city, state, ZIP code, country Phone: xx-xxxx-xxxx Fax : xx-xxxx-xxxxEmail:********************.com Website: /[country]2021-09-06 CE-ENdelivery subject to availability. Any liability that the data and illustrations are complete, actual or correct is excluded. Designations may be trademarks and/or copyrights of the respective manufacturer, the use of which by third parties for their own purposes may infringe the rights of such ownerMore informationAll rights reserved, including intellectual property rights. Changes to technical data reserved. Delivery subject to availability. Any liability that the data and illustrations are complete, actual or correct is excluded.Designations may be trademarks and/or copyrights of the respective manufacturer, the use of which by third parties for their own purposes may infringe the rights of such owner.For further information see /terms_of_use.html Copyright © Fujitsu Technology Solutions。

联想 ThinkVision E1922s Wide 宽屏平板显示器用户指南

i目录目录........................................................................................................................................................................................................................................ i 安全信息 .............................................................................................................................................................................................................................. ii 安全和安全和维护维护维护指南指南..................................................................................................................................................................................................................iii 第1章. 入门.................................................................................................................................................................................................................... 1-1装运内容......................................................................................................................................................................................................................... 1-1产品概述......................................................................................................................................................................................................................... 1-2调整类型......................................................................................................................................................................................................................... 1-2用户控件......................................................................................................................................................................................................................... 1-2电缆锁槽......................................................................................................................................................................................................................... 1-3安装显示器 .................................................................................................................................................................................................................... 1-3连接和开启显示器 ....................................................................................................................................................................................................... 1-3注册产品......................................................................................................................................................................................................................... 1-5第2章. 调整和使用整和使用显显示器 .......................................................................................................................................................................................... 2-1舒适和易使用性 ........................................................................................................................................................................................................... 2-1安排您的工作区 ........................................................................................................................................................................................................... 2-1良好工作习惯的快速技巧 .......................................................................................................................................................................................... 2-1易使用性信息 ................................................................................................................................................................................................................ 2-2调整显示器图像 ........................................................................................................................................................................................................... 2-3使用直接操作控件 ....................................................................................................................................................................................................... 2-3使用屏幕显示（OSD ）控件 ...................................................................................................................................................................................... 2-3选择支持的显示模式 .................................................................................................................................................................................................. 2-6了解电源管理 ................................................................................................................................................................................................................ 2-6保养显示器 .................................................................................................................................................................................................................... 2-7拆除显示器支架 ........................................................................................................................................................................................................... 2-7第3章. 参考信息 ........................................................................................................................................................................................................... 3-1显示器规格 .................................................................................................................................................................................................................... 3-1故障诊断......................................................................................................................................................................................................................... 3-2手动图像设置 ................................................................................................................................................................................................................ 3-3手动安装显示器驱动程序 .......................................................................................................................................................................................... 3-4维修信息.............................................................................................................................................................................. 3-8附录A 服务与支持 ........................................................................................................................................................................................................ A-1电话技术支持 ............................................................................................................................................................................................................... A-1附录B 声明 ...................................................................................................................................................................................................................... B -1回收信息.........................................................................................................................................................................................................................B-1收集和回收废旧的联想计算机或显示器 ...............................................................................................................................................................B-1联想计算机部件的处理 ..............................................................................................................................................................................................B-2商标 .................................................................................................................................................................................................................................B-2附录C 有害物有害物质质 ......................................................................................................................................................................................... C -1 能效等级......................................................................................................................................................................................................................... C -2《废弃电器电子产品回收处理管理条例》提示性说明 ..................................................................................................................................... C -2中国环境标志产品认证提示性说明 ..................................................................................................................................... C -2 ....................................................................................................ii© 联想2014年版权所有。

技嘉 W480 VISION W 使用手册说明书

更详尽的产品相关信息，请连接至技嘉网站查询。

技嘉科技保留修改的权利。

或按单独安装您所需技嘉主板售后服务及质量保证卡亲爱的用户，感谢您选用技嘉科技的主板产品，选择技嘉——创新科技，美化生活。

为了确保您能够充分享有技嘉科技为您提供的完善售后服务支持，请您在购买技嘉科技产品后认真阅读本质量保证卡的说明并妥善保存此说明。

关于技嘉主板售后服务及质量保证卡说明如下：1. 技嘉科技的主板产品在中华人民共和国境内(不包括港澳台地区)由宁波中嘉科贸有限公司总经销。

2. 技嘉科技为主板产品在中华人民共和国境内（不包含港澳台地区）提供3年保修服务，如参加4年质保活动的，则按官网注册时间延迟保修期。

3. 技嘉主板售后服务及质量保证卡仅适用于在中华人民共和国境内(不包括港澳台地区)通过合法途径购买的技嘉主板产品。

4. 根据中华人民共和国部分商品修理更换退货责任规定(新三包法)，用户在使用本公司主板产品过程中，若主板产品出现下列情况，本公司将不承担保修义务：A. 超过技嘉提供有效保修期限的；B. 未按产品使用手册的要求使用、维护、保管而造成损坏的；C. 擅自改动、自行维修、组装不当而造成产品损坏的；D. 使用未经合法认证的软件或扩展部件而造成产品损坏的；E. 非正常的使用方式或环境造成电路板或部件划伤、扭曲、腐蚀、生锈、氧化、断裂等造成产品损坏的；F. 人为造成损坏的，如：印刷电路板撞裂、板弯、线路划断、CPU角座损坏等；G. 因不可抗力或人为之操作使用不当造成损坏的；H. 假冒和非法走私品；I. 产品序列号遗失或被涂改致无法辨认或与实际产品实物不符的；J. 以特殊测试用途为目的，对内存插槽、显卡插槽、USB接口、网口插槽等部件长时间不正当使用造成主板损坏的。

5. 技嘉主板产品技术支持服务指导A. 如果您在使用技嘉主板产品过程中遇到问题，可以先通过查阅产品用户手册寻找答案。

B. 您也可以直接访问技嘉官方https:///或直接拨打技嘉科技800主板免费服务热线：进行咨询（未开通800电话或手机无法拨打800的地区，请拨打************）。

C480 4K高清信号输入说明书

C480快速指南⏹4K高清信号输入⏹EDID管理⏹支持8K1K、4K2K点对点输入⏹双备份输出⏹支持输入输出矩阵功能⏹三路独立任意选配输入模块目录产品简介 (2)随附配件 (3)硬件介绍 (4)前面板图示 (4)后面板图示 (6)产品使用 (7)目录 (7)菜单结构 (8)常规模式 (9)拼接模式 (14)预监模式 (19)独立输出模式 (24)高级设置模式 (25)语言/Language模式 (32)工厂复位模式 (33)使用黑场 (34)保存参数 (35)调保存参数 (36)程序升级 (37)联系信息 (45)厦门视诚科技有限公司网址：地址：厦门市火炬高新区创业园伟业楼S601-S608电话：+86-0592-*******传真：+86-0592-*******第1页共46页厦门视诚科技有限公司网址：地址：厦门市火炬高新区创业园伟业楼S601-S608电话：+86-0592-*******传真：+86-0592-*******第2页共46页产品简介C480是一款4K输入、8K拼接以及零延迟的高清无缝切换与拼接一体机。

基于市场4K输入、多进多出点对点拼接、多机级联拼接等需求上追求极致，继续在会议室、发布会、车展、舞美等不同拼接应用领域引领市场。

C480具备LOGO抓取、标准测试、EDID管理等功能，实现无缝切换。

用户可通过XPOSE软件进行远程配置和操控。

C480模块化设计，是RGBlink产品创新设计的体现之一。

它提供3路独立任意选配的输入模块，接口齐全，极大限度满足客户的需求。

C480系统连接图C480的系统连接在视诚，我们提供了独特的技术解决方案。

如果在应用中遇到问题，或者需要了解进一步的信息以及对应用问题的更详细的讨论，我们的客服工程师将很高兴为您提供所需的支持。

图为C480视频处理器的系统连接简图C480厦门视诚科技有限公司网址：地址：厦门市火炬高新区创业园伟业楼S601-S608电话：+86-0592-*******传真：+86-0592-*******第3页共46页电源线防静电袋随附配件注：电源线可选国标、美标、欧标螺丝刀颜色随机装配螺丝刀DVI线DB9转RJ11线合格证厦门视诚科技有限公司网址：地址：厦门市火炬高新区创业园伟业楼S601-S608电话：+86-0592-*******传真：+86-0592-*******第4页共46页硬件介绍前面板图示OLED 液晶面板1OLED 液晶面板用于显示设备当前状态，以及按键与通信的交互，支持中英文。

制作Mixer-BFG425W

1制作混频器—BFG425W根据例题进行单端BJT混频器的设计胡跃2011‐8‐17根据《射频电路设计‐理论与应用》第10章“振荡器和混频器”中例题10.9的原理，使用BFG425W进行单端BJT混频器的设计。

在仿真检测混频器的性能时，遵循《ADS2008射频电路设计与仿真实例》第7章“混频器设计”的部分步骤。

最终，到输入与输出的匹配电路为止，仿真结果符合要求。

但是在后续步骤中，仿真结果不符合要求，到撰写本文的日期位置，还不知道如何调试设置。

1. 设计、仿真混频器的目的 (1)2. 设计、仿真步骤依据 (1)3. 本次设计、仿真所使用的芯片“BFG425W” (1)4. Mixer设计参数 (1)5. 设计仿真结果简介 (1)6. 具体的设计、仿真步骤 (1)1) BFG425W模型的下载与安装 (1)2) 直流分析DC Tracing与偏置电路的设计 (1)3) 稳定性分析与稳定措施 (1)i. 信号稳定性分析 (1)ii. 电路稳定措施 (1)4) 加入偏置电路 (1)5) 输入端匹配与隔离 (1)i. 信号输入端匹配电路设计 (1)ii. 信号输入端隔离设计 (1)6) 输出端匹配 (1)i. 200 MHz 信号输出端匹配电路设计 (1)ii. (1)7) 频谱和噪声系数的仿真 (1)8) 本振功率对噪声系数和转换增益的影响 (1)9) 1 dB功率压缩点的仿真 (1)10) 三阶交调的仿真 (1)11) 输入端信号隔离设计 (1)1.设计、仿真混频器的目的为学习使用ADS设计、仿真混频器，根据现有实例与资料撰写此文。

2.设计、仿真步骤依据《ADS2008射频电路设计与仿真实例》第7章“混频器设计”介绍了一个BJT Gilbert 混频器的设计，但是此混频器内部结构较为复杂，无法专注混频器的原理，所以在验证混频器性能时采用此章内容的步骤，在设计时采用《射频电路设计—理论与应用》第10章“振荡器和混频器”例10.9“单端BJT混频器的设计”中的设计方案，并在此方案上略有改动。

MSI G32CQ4 Gaming Monitor说明书

See beyond the Game.Visualize your victory.Inspired by the rigorous quality testing in the production of MSI Gseries, MSI G series’ design is full of symbols of sturdiness anddurability. Additionally, to provide quality user experience, G serieshas really simple installation process and a friendly user interface,and will be the best choice for entry level gamers to step into thegame world.Picture and logosSELLING POINTSCurved Gaming display (1500R) – The best gameplay immersion.165Hz Refresh Rate – Real smooth gaming.1ms response time – eliminate screen tearing and choppy frame rates.WQHD (2560 x 1440) – Game titles will even look better, displaying more details due to the WQHD (2560 x 1440) resolution.Wide Color Gamut – Game colors and details will look more realistic and reﬁned, to push game immersion to its limits.Anti-Flicker and Less Blue Light – game even longer and prevent eye strain and fatique.Frameless design – Ultimate gameplay experience.178° wide view angle.1.5-way joystick navigator2.1x DC Jack3.2x HDMI 1.4b1x Display Port 1.2a4.5.1x Earphone out6.1x Kensington lockSPECIFICATIONBarcode Info EAN4719072720605 UPC824142220832 UCC1410824142220839Model Part No9S6-3DB51T-016 MKT Name Optix G32CQ4 MKT Spec Optix G32CQ4 SKU Number0Color ID1/Black-BlackDisplay Screen Size31.5" (80 cm)Active Display Area (mm)697.344(H) x 392.256(V)Curvature Curve 1500RPanel Type VAResolution2560x1440 (WQHD)Pixel pitch0.2724(H)X0.2724(V)Aspect Ratio16:9Dynamic Refresh Rate technology FreeSync PremiumHDR (High dynamic range)N/ASDR Brightness (nits)250Contrast Ratio3000:1DCR (Dynamic Contrast Ratio)100000000:1Signal Frequency70.56~243.38 KHz(H) / 48~165 Hz(V) Activated Range48Hz-165HzRefresh Rate165HZResponse Time (MPRT)1ms(MPRT)Response Time (Tr + Tf)TYP 14msView Angles178°(H)/178°(V)Surface Treatment Anti-glareNTSC (CIE1976 area percentage/overlap)100.1% / 86.6%NTSC (CIE1931 area percentage/overlap)85.66% / 80.30%sRGB (CIE1976 area percentage/overlap)114.8% / 97.6%sRGB (CIE1931 area percentage/overlap)120.94% / 99.4%Adobe RGB (CIE1976 area percentage/overlap)98.38% / 89.5%Adobe RGB (CIE1931 area percentage/overlap)89.64% / 83.7%DCI-P3 (CIE1976 area percentage/overlap)91.43% / 91.0%DCI-P3 (CIE1931 area percentage/overlap)89.15% / 88.9%Rec.709 (CIE1976 area percentage/overlap)114.8% / 97.6%Rec.709 (CIE1931 area percentage/overlap)120.94% / 99.4.0%Display Colors16.7MColor bit8 bitsNote_DP2560 x1440 (Up to 165Hz)Note_HDMI™2560 x 1440 (Up to 144Hz)Note_DVI N/AI/O Ports HDMI™2HDMI™ version 2.0HDMI™ HDCP version N/A DisplayPort1DisplayPort version 1.2a DisplayPort HDCP version N/A Thunderbolt version N/A Thunderbolt HDCP version N/A Headphone-out1Lock type Kensington LockI/O Ports (Front)Thunderbolt N/APower Power Supply Type External Adaptor 20V 3.25A Power Input100~240V, 50/60Hz Energy Eﬃciency Rating GAdapter's KC safety Number N/APower Cord Type N/AQC Output N/AQC Output Power N/APD Output N/APD Output Power N/AIn The Box DisplayPort Cable0 HDMI™ Cable1 DVI Cable0 USB Type A to Type B Cable0 USB Type C to Type A Cable N/A USB Type C to Type C Cable0 Thunderbolt Cable N/A VGA Cable0 3.5mm audio Cable0 3.5mm combo audio Cable0 Power Cord1 AC Adaptor1 Warranty Card1 Quick Guide1Design Adjustment (Tilt)-5° ~ 20°VESA Mounting100x100mm Frameless Design YesOuter Carton Dimension (WxDxH)Outer Carton Dimension (WxDxH) (mm)898 x 210 x 565 Outer Carton Dimension (WxDxH) (inch)35.35 x 8.27 x 22.24Product Dimension with Stand (WxDxH)Product Dimension with Stand (WxDxH) (mm)709.4 x 248.9 x 509.5 Product Dimension with Stand (WxDxH) (inch)27.93 x 9.8 x 20.06Product Dimension without Stand (WxDxH)Product Dimension without Stand (WxDxH) (mm)709.4 x 92.2 x 429.3 Product Dimension without Stand (WxDxH) (inch)27.93 x 3.63 x 16.9Stand Dimension (WxDxH)Stand Dimension (WxDxH) (mm)709.4 x 248.8 x 509.5 Stand Dimension (WxDxH) (inch)27.93 x 9.8 x 20.06Dimension & Weight Inside Carton Dimensions (WxDxH) (mm)883 x 195 x 540 Inside Carton Dimensions (WxDxH) (inch)34.76 x 7.68 x 21.26 Weight (Net kg) 6.4Weight (Gross kg)9.1Warranty Warranty36M。

多媒体电脑DIY配置清单

多媒体电脑DIY配置清单关键信息：1、 CPU 型号及参数：＿___________________________2、主板型号及参数：＿___________________________3、内存容量及类型：＿___________________________4、硬盘类型及容量：＿___________________________5、显卡型号及参数：＿___________________________6、显示器尺寸及分辨率：＿___________________________7、机箱类型及材质：＿___________________________8、电源功率及品牌：＿___________________________9、散热器类型：＿___________________________10、键盘鼠标类型：＿___________________________11 CPU 选择111 为满足多媒体处理的需求，推荐选择英特尔酷睿 i7 或 AMD 锐龙 7 系列的处理器。

这些处理器具有多核心和高主频的特点，能够轻松应对视频编辑、图形设计等多媒体任务。

112 例如，英特尔酷睿 i7-13700K 拥有 16 核心 24 线程，基础频率34GHz，最大睿频 54GHz，具备强大的计算能力。

113 AMD 锐龙 7 7700X 也是一个不错的选择，8 核心 16 线程，基础频率 45GHz，最大加速频率 54GHz，在多线程任务处理方面表现出色。

12 主板121 主板的选择应与所选的 CPU 兼容，并且具备良好的扩展性和稳定性。

122 对于英特尔平台，可以考虑华硕 PRIME Z790-P 主板，支持DDR5 内存，拥有多个 M2 接口和丰富的 USB 接口。

123 对于 AMD 平台，技嘉 AORUS B650 AERO G 主板是个不错的选择，具备强大的供电系统和优秀的散热设计。

BFG135,115;中文规格书,Datasheet资料

1995 Seemiconductors
Product specification
NPN 7GHz wideband transistor
BFG135
THERMAL RESISTANCE 30 K/W
MAX. 1
UNIT A pF pF pF GHz dB dB mV mV dB

53

dB
1995 Sep 13
3
/
NXP Semiconductors
Product specification
lfpage
BFG135
4
1
Top view
2
3
MSB002 - 1
Fig.1 SOT223. QUICK REFERENCE DATA SYMBOL VCBO VCEO IC Ptot hFE fT GUM PARAMETER collector-base voltage collector-emitter voltage DC collector current total power dissipation DC current gain transition frequency maximum unilateral power gain up to Ts = 145 C (note 1) IC = 100 mA; VCE = 10 V; Tj = 25 C IC = 100 mA; VCE = 10 V; f = 1 GHz; Tamb = 25 C IC = 100 mA; VCE = 10 V; f = 500 MHz; Tamb = 25 C IC = 100 mA; VCE = 10 V; f = 800 MHz; Tamb = 25 C Vo output voltage open base CONDITIONS open emitter 80 MIN. 130 7 16 12 850 TYP. MAX. 25 15 150 1 GHz dB dB mV UNIT V V mA W

联想G480详细配置

. 计算机：联想G480CPU 型号：Intel 酷睿i7-3520 主频：2.9GHz 内部缓存容量：三级缓存3MB 内存控制器带宽：25.6GB/s 独立显卡内存类型：DDR3 容量：4GB 带宽：16.56GB/s主板芯片组型号：Intel HM76 支持的内存类型：DDR3 最大容量：16GB 外部接口数量：1*LGA 2*SO-DIMM 1*USB2.0+2*USB3.0 1*VGA 1*HDMI1*耳机接口1*RJ45 1*电源接口1*读卡器卡槽共12个硬盘接口类型：SATA 串行容量：500GB 转速：5400转带宽：1.5GB/s 缓存：16MB显卡独显接口类型：PCI-E 芯片组类型：NVIDIA GeForce GT 610M 显存容量：1GB显存类型：DDR3 显存带宽：14.4GB/s显存位宽64bitG480搭载全新nVIDIA-G610M显卡，系统可按照当前处理的数据流进行显卡使用的匹配，当需要处理3D图像的时候，系统自动切换为独立显卡，性能提升50%左右；当进行简单图形处理以及日常办公应用的时候，系统自动使用处理器中内置的intel GPU，由于降低了显卡的能耗，因此续航时间可提升20%左右。

支持全高清逐行扫描信号输出，外接全高清显示器，解码全高清视频。

AMD与暴风影音共同开发的“锐•加速版本”专为用户特别开发了画质增强功能，可进行全局画质增强、拆分画质增强以及对比画质增强。

超快的USB3.0 传输接口(5Gbps)，带来理论上十倍于USB2.0的传输速率(480Mbps)，数据分享，传输及备份高速。

速度快：具备瞬间修复操作系统错误的闪电系统修复和20分钟超高速系统恢复功能。

备份方便：用户可以将磁盘镜像文件刻录到光盘或移动硬盘上，节省内置硬盘存储空间。

一键杀毒：有效减少病毒和木马的侵害。

'.。

Belden FX Ultra 12端口LC双接口蓝适配器架架说明书

Related Parts:
FX ULTRA Rack-Mount and Wall-Mount Patch Panels
Physical Characteristics (Connectivity)
Dimensions Dimensions:
Height (mm) Width (mm) Depth (mm)
General Description:
FX ULTRA FRAME, OS2, 12 PORTS, LC DUPLEX, BLUE ADAPTERS
Usage (Overall)
Suitable Applications:
FiberExpress Ultra Solutions, Backbone, Telecommunications Room, Main Distribution Room, Data Centers
Footprint/Type:
Termination Interface:
Termination Connection
Durabilities
Front
Mated Connection 500 cycles
Rear
Mated Connection 500 cycles
Connector/Hardware Retention: Plug/Connector Retention: Storage Temperature Range: Operating Temperature Range:
Transmission Characteristics (Connectivity) Notes (Overall)
Notes: For additional information please refer to product buletin PB500, or visit our web site at . Product Family

ADL QM67HDS 2nd Generation Intel Core 小型单板计算机说明书

ADLQM67HDS - 2nd Generation Intel Core, Quad/DC 2.1 - 2.5 GHzDescriptionThe ADLQM67HDS features Intel's latest embedded two-chip platform. This 2nd generation Intel Core™ processor integrates Intel’s HD Graphics 3000 engine with AVX (Advanced Vector Extensions) as well as the memory controller functions of a traditional GMCH. The QM67 Platform Controller Hub (PCH) provides PCI-Express I/O bandwidth at twice the speed (5Gbps) of previous Intel Core or Core 2 Duo plat-forms.The ADLQM67HDS is ideal for mobile and embedded applications where high pro-cessor performance is critical. It brings unparalleled performance to applications such as radar and sonar processing, image signal processing, tactical command and control, surveillance and reconnaissance, medical imaging and lab analysis, and industrial automation.In addition to the wide range of applications in which the ADLQM67HDS can excel, it also supports a broad set of features. The ADLQM67HDS has a discrete 8-bit digital I/O port as well as separate DVI-I and HDMI interfaces. The onboard DVI-I connector provides signaling for analog VGA, as well as can be configured as an HDMI with audio. The internal HDMI port can be configured to DVI-D through cabling options. The ADLQM67HDS also has 4x RS232 COM ports, 4x SATA with RAID 0, 1, 5 and 10 support. Two of the ports support up to SATA 6G while the other two support SATA 3G. 10x USB2.0 with 4x onboard connectors, two bootable Gigabit Ethernet LAN, HDA 7.1, and a 2x40-pin PCIE connector that is configurable as one x4 lane or four x1 lanes of PCI Express for addition of peripherals.NEW! ADLSST System Sensor Technology UtilityThe ADLSST System Sensor Technology v2.0 utility brings to the Linux environment the same type of CPU health monitor functions that have previously been readily available only in the Windows environment. Click here to download the drivers. ADL Embedded Solutions offers highly effective active and passive thermal solutions designed for this product. Contact your sales representative for more information.Features∙2nd Generation Intel® Core™ i7/i5, Quad/DC 2.1 GHz - 2.5 GHz ∙Intel QM67 PCH∙Up to 16GB DDR3-1333 DRAM SoDIMM204 (8GB x 2)∙PCIe 2.0 2x40 pin Bus Connector (One x4 or Four x1)∙4x SATA Ports with RAID (2x SATA 6G, 2x SATA 3G)∙2x 10/100/1000Mbit Ethernet LAN Port ∙4x RS232 COM Ports, 10x USB2.0 Ports ∙Separate Onboard DVI / VGA, HDMI / DVI ∙Dual Independent Displays ∙Hardware Monitor with API∙ADL-SST (System Sensor Technology)∙Watchdog Timer∙Windows 7, Windows 8, Windows 10, Linux Compatible ∙Discrete 8-bit GPIO Port ∙7.1 HD Audio with SPDIF In/Out∙4” x 5.8” (102mm x 147mm) 3.5-inch Form FactorOrdering InformationTechnical Specifications - ADLQM67HDS。

飞利浦 BFG31 数据手册

DATA SHEETProduct speciﬁcationSupersedes data of November 1992File under Discrete Semiconductors, SC141995 Sep 12BFG31PNP 5 GHz wideband transistor 查询BFG31供应商PNP 5 GHz wideband transistorBFG31FEATURES•High output voltage capability •High gain bandwidth product •Good thermal stability •Gold metallization ensures excellent reliability.DESCRIPTIONPNP planar epitaxial transistor mounted in a plastic SOT223envelope.It is intended for wideband amplifier applications.NPN complement is the BFG97.PINNING PINDESCRIPTION 1emitter2base 3emitter 4collectorFig.1 SOT223.page4123MSB002 - 1Top viewQUICK REFERENCE DATA LIMITING VALUESIn accordance with the Absolute Maximum System (IEC 134).Note1.T s is the temperature at the soldering point of the collector tab.SYMBOL PARAMETERCONDITIONSMIN.TYP .MAX.UNIT V CEO collector-emitter voltage open base−−−15V I C DC collector current −−−100mA P tot total power dissipation up to T s =135°C ; note 1−−1Wh FE DC current gain I C =−70mA; V CE =−10V;T amb =25°C25−−f T transition frequency I C =−70mA; V CE =−10V;f =500MHz; T amb = 25°C − 5.0−GHz G UM maximum unilateral power gainI C =−70mA; V CE =−10V;f =800MHz; T amb =25°C −12−dB V ooutput voltageI C =−100mA; V CE =−10V;R L =75Ω; T amb = 25°C −600−mVSYMBOL PARAMETERCONDITIONSMIN.MAX.UNIT V CBO collector-base voltage open emitter −−20V V CEO collector-emitter voltage open base −−15V V EBO emitter-base voltage open collector−−3V I C DC collector current −−100mA P tot total power dissipation up to T s =135°C; note 1−1W T stg storage temperature −65150°C T j junction temperature−175°CPNP 5 GHz wideband transistorBFG31THERMAL CHARACTERISTICS Note1.T s is the temperature at the soldering point of the collector tab.CHARACTERISTICST j =25°C unless otherwise speciﬁed.Notes1.G UM is the maximum unilateral power gain, assuming S 12 is zero and2.d im =−60 dB; I C =−70mA; V CE =−10V; R L =75Ω; T amb =25°C;V p =V o at d im =−60 dB; f p =850.25 MHz;V q =V o −6 dB; f q =858.25 MHz;V r =V o −6 dB;f r =860.25 MHz;measured at f (p+q −r)=848.25 MHz.3.d im =−60 dB (DIN 45004B); I C =−70mA; V CE =−10V; R L =75Ω; T amb =25°C;V p =V o =at d im =−60 dB; f p =445.25 MHz;V q =V o −6 dB; f q =453.25 MHz;V r =V o −6 dB; f r =455.25 MHz;measured at f (p+q −r)=443.25 MHz.SYMBOL PARAMETERCONDITIONSTHERMAL RESISTANCER th j-s thermal resistance from junction to soldering pointup to T s =135°C; note 140 K/WSYMBOL PARAMETERCONDITIONSMIN.TYP .MAX.UNIT V (BR)CBO collector-base breakdown voltage open emitter; I C =−10mA −20−−V V (BR)CEO collector-emitter breakdown voltage open base; I C =−10mA −18−−V V (BR)EBO emitter-base breakdown voltage open collector; I E =−0.1mA −3−−V I CBO collector cut-off current I E =0; V CB =−10V −−−1µAh FE DC current gainI C =−70mA; V CE =−10V;T amb =25°C25−−C cb collector-base capacitance I C =0; V CB =−10V; f =1MHz;− 1.8−pF C eb emitter-base capacitance I C =0; V EB =−10V; f =1MHz −5−pF C re feedback capacitance I C =0; V CE =−10V; f =1MHz;T amb =25°C− 1.6−pF f T transition frequencyI C =−70mA; V CE =−10V;f =500MHz; T amb =25°C −5−GHz G UMmaximum unilateral power gain; note 1I C =−70mA; V CE =−10V;f =500MHz; T amb =25°C −16−dB I C =−70mA; V CE =−10V;f =800MHz; T amb =25°C−12−dB V o output voltage note 2−600−mV V o output voltagenote 3−550−mVG UM 10s 2121s 112–()1s 222–()------------------------------------------------------------dB.log =PNP 5 GHz wideband transistor BFG31Fig.2 Power derating curve.handbook, halfpage 0501002000.80.60.20.4MBB344150T ( C)o sPtot (W)1.01.2Fig.3DC current gain as a function of collectorcurrent.V CE =−10V; T amb =25°C.handbook, halfpageMBB3458060200100200FEh 40I (mA)CFig.4Feedback capacitance as a function ofcollector-emitter voltage.f =1MHz;T amb =25°C handbook, halfpage6130MBB3461020C re(pF)5432V (V)CEFig.5Transition frequency as a function of collector current.V CE =−10V; T amb =25°C.handbook, halfpage0501008624MBB347(GHz)T f I (mA)CPNP 5 GHz wideband transistor BFG31Fig.6Intermodulation distortion as a function of collector current.V CE =−10V; V o =650mV; T amb =25°C;f (p+q −r)=443.25MHz.handbook, halfpageMBB348(dB)406010040654580505560d im I (mA)CFig.7Intermodulation distortion as a function of collector current.V CE =−10V; V o =550mV; T amb =25°C;f (p+q −r)=848.25MHz.handbook, halfpageMBB349(dB)40608012050100556065d im I (mA)CFig.8 Second order intermodulation distortionas a function of collector current.V CE =−10V; V o =50dBmV; T amb =25°C;f (p+q)=450MHz.handbook, halfpageMBB3501011010605040302030507090d 2(dB)I (mA)CFig.9Second order intermodulation distortion as a function of collector current.V CE =−10V; V o =50dBmV; T amb =25°C;f (p+q)=810MHz.handbook, halfpageMBB3511011010605040302030507090d 2(dB)I (mA)CPNP 5 GHz wideband transistorBFG31PACKAGE OUTLINEDimensions in mm.Fig.10 SOT223.handbook, full pagewidth6.76.30.950.852.30.800.604.63.12.93.73.37.36.7AB0.2A1.80max1616o max10o max0.100.010.320.244123MSA035 - 1(4x)0.1B M M Sseating plane0.1SoPNP 5 GHz wideband transistor BFG31DEFINITIONSData sheet statusObjective speciﬁcation This data sheet contains target or goal speciﬁcations for product development. Preliminary speciﬁcation This data sheet contains preliminary data; supplementary data may be published later. Product speciﬁcation This data sheet contains ﬁnal product speciﬁcations.Limiting valuesLimiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the speciﬁcation is not implied. Exposure to limiting values for extended periods may affect device reliability.Application informationWhere application information is given, it is advisory and does not form part of the speciﬁcation.LIFE SUPPORT APPLICATIONSThese products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.。

GEFLEX GFX-M1 GFX-S1 GFX-E1 模块化温控区域电源控制器说明书

GEFLEX GFX-M1 / GFX-S1 /GFX-E1MODULAR POWER CONTROLLER FOR TEMPERATURE CONTROLLED ZONESMain applications•Plastic extruders•Plastic injection presses •Blowers•Plastic and rubber processing machines•Wrapping machines •Packaging machines •Thermal processes with electric heating Main features•Three versions:MASTER - independent temperature control and communication unitSLAVE - independent temperature control unitEXPANSION - for three-phase loads •SSR (Solid State Relay) zero crossing •Rated voltage:480Vac rms, 50-50Hz•Rated current (AC1): 25A, 40A,60A, 75A, 90A, 120A•Protection: IP20•Installation: DIN bar and panel •Universal temperature input,accuracy 0.2%•Configurable digital input•Logic output or "cooling" relay•Load current detection with integrated CT •Heat/cool PID, selection of cooling fluid, self-tuning,auto-tuning, soft-start• 4 generic alarms, LBA and HB alarms • 2 configurable relay outputs•Field bus for Master:std: “Modbus RTU” with Serial RS485 opticallyopt: “PROFIBUS DP”, “CANopen”,“DeviceNet”PROFILEAn innovative, integrated system to con-trol power and temperature, designed for industrial electric heating processes.The system architecture is optimized for temperature control of multizone plants. It consists of a control unit, i.e., the PID microprocessor controller plus load control device (AT and VT), and a power module (SSR) with aluminum heat sink. The system is compact and easy to install and use.Models and communicationThe system has high communication capacity and interfaces without limitation with the automation environment.Three standard protocols are available: Modbus RTU, Profibus DP and CANopen implemented in the Geflex "master," which in turn communicates with up to nine Geflex "slaves" by means of an internal bus.Every Geflex can tune to the network communication speed (baud) with a self-learning sequence. In addition to connec-ting to PLCs, terminals, and PCs, the "master" is able to control a control loop. PowerFive current levels are offered: 25, 40, 60, 75, 90 and 120A, all with rated voltage of 480V, single phase.To control three-phase loads, the system uses a connection with 3 Geflex units: a "master" unit that performs the PID controland transmits (via internal bus) the powercommand to two other "expansion" unitsequipped with SSR module only.The power control has double SCR inantiparallel, zero crossing switching princi-ple, with configurable proportional cycletime.The electrical connections for power andcontrol are completely separate to increa-se electrical safety and reduce electroma-gnetic interference.MechanicsThe mechanical elements have beencarefully designed and tested for maxi-mum ease of installation and to guaranteehigh resistance to vibration and thermalstress.Diagnostic LEDsThe lower section has 3 LEDs that indica-te the operating state of the field bus, tem-perature sensor errors, and the conduc-ting state of the power unit.Temperature inputThe temperature input is universal and canbe connected to a wide variety of signaltypes: thermocouples, resistance thermo-meters, input from 4...20mA transmitters,definable only by software, without theneed for external adapter shunts.Accuracy of 0.2% guarantees excellentcontrol of the heat process.PIDThe control algorithm adapts to every typeof heat process.Up to 14 different control modes are avai-lable: from simple ON/OFF control to sin-gle or double action heat/cool PID; forcooling, simply indicate the fluid beingused.Sophisticated and efficient algorithms forautomatic tuning of control parametersprovide precise process control withoutuser intervention.Outputs and digital inputThe instrument can have up to 3 outputs:a cooling (3A, 250V) or logic (24Vdc,35mA) relay and two optional alarm relayoutputs (3A, 250V).The outputs are freely configurable viasoftware.By means of internal bus, each "slave"can activate the two relay outputs on the"master" following alarm conditions tocreate electrical clearance or block signalsset to assure safe operation of technologi-cal systems.This further reduces electromechanicalwiring.At the logic level, there are 4 genericalarms configurable as: absolute, devia-tion, direct, reverse, window, in latching ornon-latching mode, disabled at power-up.With the isolated digital input always avai-lable, you can select one of the two pre-POWER MODULEDISSIPATION CURVESCONNECTION EXAMPLESWe advise you to connect a 120Ω1/4W resistance between the "CAN_L" and "CAN_H" signals at both ends of the DeviceNet network.GEFRAN spa reserves the right to make aesthetic or functional changes at any time and without notice.GEFRAN spa via Sebina, 74 - 25050 Provaglio d’Iseo (BS)Tel.03098881 - fax 0309839063Internet: DTS_GFX_0408_ENG。

thinkpad480s快充协议(一)

thinkpad480s快充协议(一)协议模板 - ThinkPad 480s 快充背景随着移动办公的普及，笔记本电脑的续航时间成为用户关注的重点。

ThinkPad 480s 快充技术的引入，能够显著提升设备的充电速度，为用户提供更加高效的使用体验。

目的本协议旨在明确厂商与用户之间关于 ThinkPad 480s 快充技术使用的规定，以保障双方权益并促进合作。

范围本协议适用于所有购买并使用 ThinkPad 480s 快充技术的用户。

条款1.定义 1.1. ThinkPad 480s 快充技术是指该设备配备的一种快速充电技术，能够在有限的时间内提供更多的电池电量。

1.2. 用户是指购买并使用 ThinkPad 480s 快充技术的个人或实体。

2.快充特性 2.1. ThinkPad 480s 快充技术的具体特性为每小时充电XXX小时的电量，快充时间可能因设备状态和其他因素有所变化。

3.责任与义务 3.1. 厂商有责任确保 ThinkPad 480s快充技术的正常运作，并提供技术支持和相关维护服务。

3.2.用户有责任合理使用 ThinkPad 480s 快充技术，并按照厂商指示正确连接电源适配器。

3.3. 若经厂商鉴定，因设备质量问题导致快充技术失效，厂商将承担设备维修或更换的责任。

3.4.用户不得私自修改设备硬件、软件或固件，以免造成设备故障或失去厂商提供的快充技术保障。

4.保密条款 4.1. 双方应对协议中约定的技术、商业机密信息予以保密。

4.2. 任何使用、访问、披露或传播这些保密信息的行为，应获得双方明确的书面同意。

5.终止 5.1. 用户有权在合理事先通知厂商的情况下终止本协议。

5.2. 厂商有权在发现用户违反本协议时，终止用户对 ThinkPad 480s 快充技术的使用权。

6.适用法律与争议解决 6.1. 本协议适用中华人民共和国法律。

6.2. 对于因本协议产生的争议，双方应首先通过友好协商解决。

Lenovo B580 和 B480 安装说明说明书

B5802P/N: 148501490Lenovo B480和 B580 V2.0打开包装计算机电池组交流电源适配器电源线*光盘驱动器*出版物* 电源线因国家/地区而异。

* 只有某些型号提供了光盘驱动器。

某些型号可能包含未列出的部件。

如果缺少任何部件或有任何部件受损，请与您的零售商联系。

尽早使用 Lenovo ® OneKey ® Recovery Pro 程序创建 Windows ® 系统恢复光盘。

如果计算机因系统故障而无法启动，则可使用恢复光盘将系统恢复到出厂缺省状态。

访问 Lenovo 支持 Web 站点/support 获得所需服务，如下载预装应用程序、最新设备驱动程序，和补丁；为产品注册保修；以及获得技术支持。

Lenovo 、Lenovo 徽标和 OneKey 是 Lenovo 在美国和/或其他国家或地区的商标。

Windows 是 Microsoft 公司集团的商标或注册商标。

要访问《用户指南》，请单击开始帮助和支持。

然后单击 Lenovo User Guide 并按照屏幕说明操作。

要获得其他出版物，请访问：/UserManuals 。

然后按照屏幕上的指示信息进行操作。

如果计算机带有指纹读取器，您可以使用指纹快速登录 Windows 操作系统或 Web 站点，快速启动应用程序，还可以加密私有数据。

有关更多信息，请参阅指纹软件程序的联机帮助信息系统。

-《安装说明书》（本页）-《安全与保修指南》- 其他补充说明文件或宣传单注：您的计算机可能与此说明书中的插图不同。

连接电源。

注意：按电源按键可开启计算机。

按照屏幕说明配置操作系统以完成初始设置。

此过程将占用您几分钟。

将电源线牢固连接到交流电源适配器。

连接不牢固可能会损坏交流电源适配器。

使用计算机之前，请阅读随附的手册中的安全声明和重要提示。

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handbook, halfpage
BFG480W
PINNING PIN 1 2 3 4 emitter base emitter collector DESCRIPTION
3
4
APPLICATIONS RF front end with high linearity system demands (CDMA) Common emitter class AB driver. DESCRIPTION NPN double polysilicon wideband transistor with buried layer for low voltage applications in a 4-pin dual-emitter SOT343R plastic package. QUICK REFERENCE DATA SYMBOL VCEO IC Ptot fT Gmax F Gp C PARAMETER collector-emitter voltage open base collector current (DC) total power dissipation transition frequency maximum gain noise figure power gain collector efficiency Ts 60 C CONDITIONS 80 IC = 80 mA; VCE = 2 V; f = 2 GHz; Tamb = 25 C 21 IC = 80 mA; VCE = 2 V; f = 2 GHz; Tamb = 25 C 16 IC = 8 mA; VCE = 2 V; f = 2 GHz; S = opt Pulsed; class-AB; < 1 : 2; tp = 5 ms; VCE = 3.6 V; f = 2 GHz; PL = 100 mW Pulsed; class-AB; < 1 : 2; tp = 5 ms; VCE = 3.6 V; f = 2 GHz; PL = 100 mW CAUTION This product is supplied in anti-static packing to prevent damage caused by electrostatic discharge during transport and handling. 1.8 13.5 45 TYP. MAX. 4.5 250 360 V mA mW GHz dB dB dB % UNIT
CONDITIONS IC = 50 A; IE = 0 IE = 100 A; IC = 0 VCE = 5 V; VBE = 0 IC = 80 mA; VCE = 2 V; see Fig.3 IE = ie = 0; VCB = 2 V; f = 1 MHz IC = ic = 0; VEB = 0.5 V; f = 1 MHz IC = 0; VCB = 2 V; f = 1 MHz; see Fig.4 IC = 80 mA; VCE = 2 V; f = 2 GHz; Tamb = 25 C; see Fig.5 IC = 80 mA; VCE = 2 V; f = 2 GHz; Tamb = 25 C; see Figs 7 and 8 IC = 80 mA; VCE = 2 V; f = 2 GHz; Tamb = 25 C; see Fig.8 IC = 8 mA; VCE = 2 V; f = 900 MHz; S = opt; see Fig.13 IC = 8 mA; VCE = 2 V; f = 2 GHz; S = opt; see Fig.13
104
VCE = 2 V; f = 2 GHz.
IC = 80 mA; VCE = 2 V.
MIN. 14.5 4.5 1 40
TYP. 60 1.4 2.2 340 21 16 12 1.2 1.8 20 28
MAX. 70 100
UNIT V V V nA pF pF fF GHz dB dB dB dB dBm dBm
BFG480W
MAX. 14.5 4.5 1 250 360 +150 150 V V V
UNIT
mA mW C C
UNIT K/W
handbook, halfpage
500 Ptot 400
MGR623(mW)来自300200100
0 0 40 80 120 Ts (°C) 160
Fig.2 Power derating curve.
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VCBO VCEO VEBO IC Ptot Tstg Tj Note 1. Ts is the temperature at the soldering point of the emitter pins. THERMAL CHARACTERISTICS SYMBOL Rth j-s PARAMETER thermal resistance from junction to soldering point VALUE 250 PARAMETER collector-base voltage collector-emitter voltage emitter-base voltage collector current (DC) total power dissipation storage temperature operating junction temperature Ts 60 C; note 1; see Fig.2 open base open collector CONDITIONS open emitter 65 MIN.
Fig.4
Feedback capacitance as a function of collector-base voltage; typical values.
handbook, halfpage
30
MGR626
MGR627
handbook, halfpage
30
fT (GHz) 20
gain (dB) 20
2
BFG480W
PARAMETER collector-base breakdown voltage emitter-base breakdown voltage collector-base leakage current DC current gain collector capacitance emitter capacitance feedback capacitance transition frequency maximum power gain; note 1 insertion power gain noise figure
2 Top view
Marking code: P6.
1
MSB842
Fig.1 Simplified outline SOT343R.
1998 Oct 21
2
/
NXP Semiconductors
Product specification
NPN wideband transistor
1998 Oct 21
3
/
NXP Semiconductors
Product specification
NPN wideband transistor
CHARACTERISTICS Tj = 25 C unless otherwise specified. SYMBOL V(BR)CBO V(BR)CEO V(BR)EBO ICBO hFE Cc Ce Cre fT Gmax S 21 F
Fig.6
Gain as a function of collector current; typical values.
1998 Oct 21
5
/
NXP Semiconductors
Product specification
NPN wideband transistor
1. Gmax is the maximum power gain, if K > 1. If K < 1 then Gmax = MSG; see Figs 6, 7 and 8. 2. ZS is optimized for noise; ZL is optimized for gain.
1998 Oct 21
DISCRETE SEMICONDUCTORS
DATA SHEET
M3D124
BFG480W NPN wideband transistor
Product specification Supersedes data of 1998 Jul 09 1998 Oct 21
/
collector-emitter breakdown voltage IC = 5 mA; IB = 0
PL1 ITO Notes
output power at 1 dB gain compression third order intercept point
Class-AB; < 1 : 2; tp = 5 ms; VCE = 3.6 V; ICQ = 1 mA; f = 2 GHz IC = 80 mA; VCE = 2 V; f = 2 GHz; ZS = ZS opt; ZL = ZL opt; note 2
4
/
NXP Semiconductors
Product specification
NPN wideband transistor