502430-6010-C;中文规格书,Datasheet资料

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华三路由器软件升级指南

8.1 CMW710-R0106P02 版本解决问题列表 ···························································································· 10 8.2 CMW710-R0106 版本解决问题列表··································································································· 11 8.3 CMW710-R0105P12 版本解决问题列表 ···························································································· 12 8.4 CMW710-R0105P06 版本解决问题列表 ···························································································· 13 8.5 CMW710-R0105 版本解决问题列表··································································································· 13 8.6 CMW710-E0104 版本解决问题列表··································································································· 14 8.7 CMW710-E0102 版本解决问题列表··································································································· 14 8.8 CMW710-E0006P02 版本解决问题列表 ···························································································· 14 9 相关资料 ············································································································································· 14 9.1 相关资料清单······································································································································ 14 9.2 资料获取方式······································································································································ 15 10 技术支持 ··········································································································································· 15 附录 A 本版本支持的软、硬件特性列表································································································· 16 A.1 版本硬件特性 ····································································································································· 16 A.2 版本软件特性 ····································································································································· 23

整理IEC 60950中文讲义

台
2
17
网络机柜
22U （600*950*2000）
台
1
18
针式打印机
打印方式针式打印打印速度 440字/秒
纸张尺寸单页纸、单页多联表格、卡片、连续纸（单联和多联）、带标签的连续纸、信封、卷纸
接口USB1.1，IEEE-1284双向并行接口复印功能 1份原件+4份拷贝电压AC220-240尺寸350×589×167.5mm重量9.4kg
项
1
8
触摸屏
19.1寸液晶触摸一体机技术规格：全钢制数控制造、专业模具进口高级汽车烤漆颜色：银灰+黑(或全银)
显示器：专业工业级液晶显示器触摸屏：TOUCH STAR 电阻屏分辨率:4096*4096使用寿命:5000万次透光率:95%以上表面硬度:莫氏7级标准响应时间:小于8毫秒触摸精度:±1毫米触摸力度:25g主机:P43.0/512M/945P主板/80G尺寸：60*60*158CM
介质处理器:双面打印：使用可选双面打印附件自动双面打印；2个输入纸盒；1个250页容量的输出纸盒术规格
介质尺寸 :letter，legal，executive，tabloid，10号信封
彩色: 黑白A3
打印语言: PCL 5e，PCL 6 & GL/2，Postscript® level 3仿真
处理器：:300MHz处理器
连接:符合IEEE 1284标准的并行端口，2个可用的EIO插槽； 620n； 802.11内置无线打印服务器（可选）
介质类型:纸张（普通纸，信头纸，预穿孔纸，证券纸，彩纸，糙纸，牛皮纸，预印纸，再生纸），透明胶片，标签，信封以及卡片
台
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激光打印机

datasheet_X3100

Preliminary InformationX3100/X3101FEATURE•Software Selectable Protection Levels and Variable Protect Detection/Release Times •Integrated FET Drive Circuitry•Cell Voltage and Current Monitoring •0.5% Accurate Voltage Regulator •Integrated 4kbit EEPROM•Flexible Power Management with 1µA Sleep Mode•Cell Balancing ControlBENEFIT•Optimize protection for chosen cells to allow maximum use of pack capacity.•Reduce component count and cost •Simplify implementation of gas gauge•Accurate voltage and current measurements •Record battery history to optimize gas gauge, track pack failures and monitor system use •Reduce power to extend battery life•Increase battery capacity and improve cycle life battery lifeDESCRIPTIONThe X3100 is a protection and monitor IC for use in battery packs consisting of 4 series Lithium-Ion battery cells. The X3101 is designed to work in 3 cell applications. Both devices provide internal over-charge, over-discharge, and over-current protection circuitry, internal EEPROM memory, an internal voltage regulator, and internal drive circuitry for external FET devices that control cell charge,discharge, and cell voltage balancing.Over-charge, over-discharge, and over-current thresholds reside in an internal EEPROM memory register and are selected independently via software using a 3MHz SPI serial interface. Detection and time-out delays can also be individually varied using external capacitors. Using an internal analog multiplexer, the X3100 or X3101 allow battery parameters such as cell voltage and current (using a sense resistor) to be monitored externally by a separate microcontroller with A/D converter. Software on this microcontroller implements gas gauge and cell balancing functionality in software.The X3100 and X3101 contain a current sense ampliﬁer. Selectable gains of 10, 25, 80 and 160 allow an external 10 bit A/D converter to achieve better resolution than a more expensive 14 bit converter.An internal 4kbit EEPROM memory featuring IDLock ™ , allows the designer to partition and “lock in”written battery cell/pack data.The X3100 and X3101 are each housed in a 28 Pin TSSOP package.Preliminary 3 or 4 Cell Li-Ion Battery Protection and Monitor IC4 cell / 3 cellX3100/X3101 – Preliminary InformationPRINCIPLES OF OPERATIONThe X3100 and X3101 provide two distinct levels of functionality and battery cell protection:First, in Normal mode, the device periodically checks each cell for an over-charge and over-discharge state, while continuously watching for a pack over-current condition. A protection mode violation results from an over-charge, over-discharge, or over-current state. The thresholds for these states are selected by the user through software. When one of these conditions occur, a D ischarge FET or a Charge FET or both FETs are turned off to protect the battery pack. In an over-discharge condition, the X3100 and X3101 devices go into a low power sleep mode to conserve battery power.D uring sleep, the voltage regulator turns off, removing power from the microcontroller to further reduce pack current.Second, in Monitor mode, a microcontroller with A/D converter measures battery cell voltage and pack current via pin AO and the X3100 or X3101 on-board MUX. The user can thus implement protection, charge/discharge, cell balancing or gas gauge software algorithms to suit the speciﬁc application and characteristics of the cells used. While monitoring these voltages, all protection circuits are on continuously.In a typical application, the microcontroller is also programmed to provide an SMBus interface along with the Smart Battery System interface protocols. These additions allow an X3100 or X3101 based module to adhere to the latest industry battery pack standards.PIN NAMESPIN DESCRIPTIONSBattery Cell Voltage (VCELL1-VCELL4):These pins are used to monitor the voltage of each battery cell internally. The voltage of an individual cell can also be monitored externally at pin AO.The X3100 monitors 4 battery cells. The X3101 monitors 3 battery cells. For the X3101 device connect the VCELL4/VSS pin to ground.Pin Symbol Description1VCELL1Battery cell 1 voltage input2CB1Cell balancing FET control output 13VCELL2Battery cell 2 voltage4CB2Cell balancing FET control output 25VCELL3Battery cell 3 voltage6CB3Cell balancing FET control output 37VCELL4/VSSBattery cell 4 voltage (X3100)Ground (X3101)8CB4Cell balancing FET control output 49V SS Ground10VCS1Current sense voltage pin 111VCS2Current sense voltage pin 212OVT Over-charge detect/release time input 13UVT Over-discharge detect/release time input 14OCT Over-current detect/release time input 15AO Analog multiplexer output16 AS0Analog output select pin 017AS1Analog output select pin 118AS2Analog output select pin 219SI Serial data input20SO Serial data output21SCK Serial data clock input22CS Chip select input pin23OVP/LMONOver-charge Voltage Protection output/Load Monitor output24UVP/OCPOver-discharge protection output/Over-current protection output25RGO Voltage regulator output pin26RGC Voltage regulator control pin27RGP Voltage regulator protection pin28V CC Power supplyX3100/X3101 – Preliminary InformationCell Voltage Balancing Control (CB1-CB4):These outputs are used to switch external FETs in orderto perform cell voltage balancing control. This functioncan be used to adjust individual cell voltages (e.g.during cell charging). CB1–CB4 can be driven high(Vcc) or low (Vss) to switch external FETs ON/OFF. Whenusing the X3101, the CB4 pin can be left unconnected,or the FET control can be used for other purposes. Current Sense Inputs (VCS1–VCS2):A sense resistor (R SENSE) is connected between VCS1and VCS2 (Figure 1). R SENSE has a resistance in theorder of 20mΩ to 100mΩ, and is used to monitor current ﬂowing through the battery terminals, and protectagainst over-current conditions. The voltage at each endof R SENSE can also be monitored at pin AO.Over-charge Voltage detect Time control (OVT): This pin is used to control the delay time (T OV) associated with the detection of an over-charge condition (see section “Over-charge Protection” on page 13).Over-discharge detect/release time control (UVT): This pin is used to control the delay times associated with the detection (T UV) and release (T UVR) of an over-discharge (under-voltage) condition (see section “Over-discharge Protection” on page 15).Over-current detect/release time control (OCT): This pin is used to control the delay times associated with the detection (T OC) and release (T OCR) of an over-current condition (see section “Over-Current Protection”on page 18).Analog Output (AO):The analog output pin is used to externally monitorvarious battery parameter voltages. The voltages whichcan be monitored at AO (see section “AnalogMultiplexer Selection” on page 20) are:–Individual cell voltages–Voltage across the current sense resistor (R SENSE).This voltage is ampliﬁed with a gain set by the user inthe control register (see section “Current MonitorFunction” on page 20.)The analog select pins pins AS0–AS2 select the desiredvoltage to be monitored on the AO pin.Analog Output Select (AS0–AS2):These pins select which voltage is to be multiplexed to the output AO (see section “Sleep Control (SLP)” on page 10 and section “Current Monitor Function” on page 20)Serial Input (SI):SI is the serial data input pin. All opcodes, byte addresses, and data to be written to the device are input on this pin.Serial Output (SO):SO is a push/pull serial data output pin. During a read cycle, data is shifted out on this pin. Data is clocked out by the falling edge of the serial clock. While CS is HIGH, SO will be in a High Impedance state.Note: SI and SO may be tied together to form one line (SI/SO). In this case, all serial data communication with the X3100 or X3101 is undertaken over one I/O line. This is permitted ONL Y if no simultaneous read/write operations occur.Serial Clock (SCK):The Serial Clock controls the serial bus timing for data input and output. Opcodes, addresses, or data present on the SI pin are latched on the rising edge of the clock input, while data on the SO pin change after the falling edge of the clock input.Chip Select (CS):When CS is HIGH, the device is deselected and the SO output pin is at high impedance. CS LOW enables the SPI serial bus.Over-charge Voltage Protection/Load Monitor (OVP/LMON):This one pin performs two functions depending upon the present mode of operation of the X3100 or X3101. —Over-charge Voltage Protection (OVP)This pin controls the switching of the battery pack charge FET. This power FET is a P-channel device. As such, cell charge is possible when OVP/LMON=V SS, and cell charge is prohibited when OVP/LMON=V CC. In this conﬁguration the X3100 and X3101 turn off the charge voltage when the cells reach the over-charge limit. This prevents damage to the battery cells due to the application of charging voltage for an extended period of time (see section “Over-charge Protection” on page 13).X3100/X3101 – Preliminary Information—Load Monitor (LMON)In Over-current Protection mode, a small test current (7.5µA typ.) is passed out of this pin to sense the load resistance. The measured load resistance determines whether or not the X3100 or X3101 returns from an over-current protection mode (see section “Over-Current Protection” on page 18).Over-discharge (Under Voltage) Protection/Over-current Protection (UVP/OCP):Pin UVP/OCP controls the battery cell discharge via an external power FET. This P-channel FET allows cell discharge when UVP/OCP=Vss, and prevents cell discharge when UVP/OCP=Vcc. The X3100 and X3101 turn the external power FET off when the X3100 or X3101 detects either:—Over-discharge Protection (UVP)In this case, pin 24 is referred to as “Over-discharge (Under-Voltage) protection (UVP)” (see section “Over-discharge Protection” on page 15). UVP/OCP turns off the FET to prevent damage to the battery cells by being discharged to excessively low voltages.—Over-current protection (OCP)In this case, pin 24 is referred to as “Over-current protection (OCP)” (see section “Over-Current Protection”on page 18). UVP/OCP turns off the FET to prevent damage to the battery pack caused by excessive current drain (e.g. as in the case of a surge current resulting from a stalled disk drive).TYPICAL APPLICATION CIRCUITThe X3100 and X3101 have been designed to operate correctly when used as connected in the T ypical Application Circuit (see Figure 1 on page 5).The power MOSFET’s Q1 and Q2 are referred to as the “D ischarge FET” and “Charge FET,” respectively. Since these FETs are p-channel devices, they will be ON when the gates are at V SS, and OFF when the gates are at V CC. As their names imply, the discharge FET is used to control cell discharge, while the charge FET is used to control cell charge. Diode D1 allows the battery cells to receive charge even if the Discharge FET is OFF, while diode D2 allows the cells to discharge even if the charge FET is OFF. D1 and D2 are integral to the Power FETs. It should be noted that the cells can neither charge nor discharge if both the charge FET and discharge FET are OFF.Power to the X3100 or X3101 is applied to pin VCC via diodes D6 and D7. These diodes allow the device to be powered by the Li-Ion battery cells in normal operating conditions, and allow the device to be powered by an external source (such as a charger) via pin P+ when the battery cells are being charged. These diodes should have sufﬁcient current and voltage ratings to handle both cases of battery cell charge and discharge.The operation of the voltage regulator is described in section “Voltage Regulator” on page 21. This regulator provides a 5VD C±0.5% output. The capacitor (C1) connected from RGO to ground provides some noise ﬁltering on the RGO output. The recommended value is 0.1µF or less. The value chosen must allow V RGO to decay to 0.1V in 170ms or less when the X3100 or X3101 enter the sleep mode. If the decay is slower than this, a resistor (R1) can be placed in parallel with the capacitor.During an initial turn-on period (T PUR + T OC), V RGO has a stable, regulated output in the range of 5VDC ± 10% (see Figure 2). The selection of the microcontroller should take this into consideration. At the end of this turn on period, the X3100 and X3101 “self-tunes” the output of the voltage regulator to 5V+/-0.5%. As such, V RGO can be used as a reference voltage for the A/D converter in the microcontroller. Repeated power up operations, consistently re-apply the same “tuned” value for V RGO. Figure 1 shows a battery pack temperature sensor implemented as a simple resistive voltage divider, utilizing a thermistor (R T) and resistor (R T’). The voltage V T can be fed to the A/D input of a microcontroller and used to measure and monitor the temperature of the battery cells. R T’ should be chosen with consideration of the dynamic resistance range of R T as well as the input voltage range of the microcontroller A/D input. An output of the microcontroller can be used to turn on the thermistor divider to allow periodic turn-on of the sensor. This reduces power consumption since the resistor string is not always drawing current.D iode D3 is included to facilitate load monitoring in an Over-current protection mode (see section “Over-Current Protection” on page 18), while preventing the ﬂow of current into pin OVP/LMON during normal operation. The N-Channel transistor turns off this function during the sleep mode.Resistor R PU is connected across the gate and drain of the charge FET (Q2). The discharge FET Q1 is turned off by the X3100 or X3101, and hence the voltage at pin OVP/LMON will be (at maximum) equal to the voltage of the battery terminal, minus one forward biased diode voltage drop (V P+–V D7). Since the drain of Q2 is connected to a higher potential (V P+) a pull-up resistorX3100/X3101 – Preliminary Information Figure 1. Typical Application CircuitX3100/X3101 – Preliminary Information(R PU) in the order of 1MΩshould be used to ensure that the charge FET is completely turned OFF when OVP/ LMON=V CC.The capacitors on the V CELL1 to V CELL4 inputs are used in a ﬁrst order low pass ﬁlter conﬁguration, at the battery cell voltage monitoring inputs (VCELL1–VCELL4) of the X3100 or X3101. This ﬁlter is used to block any unwanted interference signals from being inadvertently injected into the monitor inputs. These interference signals may result from:–Transients created at battery contacts when the bat-tery pack is being connected/disconnected from the charger or the host.–Electrostatic discharge (ESD) from something/some-one touching the battery contacts.–Unﬁltered noise that exists in the host device.–RF signals which are induced into the battery pack from the surrounding environment.Such interference can cause the X3100 or X3101 to operate in an unpredictable manner, or in extreme cases, damage the device. As a guide, the capacitor should be in the order of 0.01µF and the resistor, should be in the order of 10KΩ. The capacitors should be of the ceramic type. In order to minimize interference, PCB tracks should be made as short and as wide as possible to reduce their impedance. The battery cells should also be placed as close to the X3100 or X3101 monitor inputs as possible.Resistors R CB and the associated n-channel MOSFET’s (Q6–Q9) are used for battery cell voltage balancing. The X3100 and X3101 provide internal drive circuitry which allows the user to switch FETs Q6–Q9 ON or OFF via the microcontroller and SPI port (see section “Cell Voltage Balance Control (CBC1-CBC4)” on page 11). When any of the these FETs are switched ON, a current, limited by resistor R CB, ﬂows across the particular battery cell. In doing so, the user can control the voltage across each individual battery cell. This is important when using Li-Ion battery cells since imbalances in cell voltages can, in time, greatly reduce the usable capacity of the battery pack. Cell voltage balancing may be implemented in various ways, but is usually performed towards the end of cell charging (“Top-of-charge method”). Values for R CB will vary according to the speciﬁc application.The internal 4kbit EEPROM memory can be used to store the cell characteristics for implementing such functions as gas gauging, battery pack history, charge/discharge cycles, and minimum/maximum conditions. Battery pack manufacturing data as well as serial number information can also be stored in the EEPROM array. An SPI serial bus provides the communication link to the EEPROM.A current sense resistor (R SENSE) is used to measure and monitor the current ﬂowing into/out of the battery terminals, and is used to protect the pack from over-current conditions (see section “Over-Current Protection” on page 18). R SENSE is also used to externally monitor current via a microcontroller (see section “Current Monitor Function” on page 20).FETs Q4 and Q5 may be required on general purpose I/Os of the microcontroller that connect outside of the package. In some cases, without FETs, pull-up resistors external to the pack force a voltage on the V CC pin of the microcontroller during a pack sleep condition. This voltage can affect the proper tuned voltage of the X3100/X3101 regulator. These FETs should be turned-on by the microcontroller. (See Figure 1.)POWER ON SEQUENCEInitial connection of the Li-Ion cells in the battery pack will not normally power up the battery pack. Instead, the X3100 or X3101 enters and remains in the SLEEP mode. T o exit the SLEEP mode, after the initial power up sequence, or following any other SLEEP MOD E, a minimum of 16V (X3100 V SLR) or 12V (X3101 V SLR) is applied to the VCC pin, as would be the case during a battery charge condition. (See Figure 2.)When V SLR is applied to VCC, the analog select pins (AS2-AS0) and the SPI communication pins (CS, CLK, SI, SO) must be low, so the X3100 and X3101 power up correctly into the normal operating mode. This can be done by using a power-on reset circuit.When entering the normal operating mode, either from initial power up or following the SLEEP MODE, all bits in the control register are zero. With UVPC and OVPC bits at zero, the charge and discharge FETs are off. The microcontroller must turn these on to activate the pack. The microcontroller would typically check the voltage and current levels prior to turning on the FETs via the SPI port. The software should prevent turning on the FETs throughout an initial measurement/calibration period. The duration of this period is T OV+200ms or T UV+200ms, whichever is longer.Figure 2. Power Up Timing (Initial Power Up or after Sleep Mode)CONFIGURATION REGISTERThe X3100 and X3101 can be conﬁgured for speciﬁc user requirements using the Conﬁguration Register. Table 1. Configuration Register FunctionalityTable 2. Configuration Register—Upper ByteTable 3. Configuration Register—Lower ByteOver-charge Voltage SettingsVOV1 and VOV0 control the cell over-charge level. See section “Over-charge Protection” on page 13.Table 4. Over-charge Voltage Threshold Selection Over-discharge SettingsVUV1 and VUV0 control the cell over-discharge (under voltage threshold) level. See section “Over-discharge Protection” on page 15.Over-current SettingsVOC1 and VOC0 control the pack over-current level. See section “Over-Current Protection” on page 18. Table 6. Over-Current Threshold Voltage Selection.Cell Charge Enable SettingsVCE1, VCE0 and SWCEN control the pack charge enable function. SWCEN enables or disables a circuit that prevents charging if the cells are at too low a voltage. VCE1 and VCE0 select the voltage that is recognized as too low. See section “Sleep Mode” on page 15.Table 7. Cell Charge Enable FunctionBit(s)Name Function 0-5–(don’t care)6 SWCEN Switch Cell Charge Enable threshold function ON/OFF7CELLN Set the number of Li-Ion battery cells used (3 or 4)8-9VCE1-VCE0Select Cell Charge Enable threshold10-11VOC1-VOC0Select over-current threshold12-13VUV1-VUV0Select over-discharge (under voltage) threshold14-15VOV1-VOV0Select over-charge voltage threshold15141312111098 VOV1VOV0VUV1VUV0VOC1VOC0VCE1VCE0 X3100 Default = 30H; X3101 Default = 00H.76543210 CELLN SWCEN x x x x x x X3100 Default = C0H; X3101 Default = 40H.Configuration RegisterBitsOperation VOV1VOV000V OV = 4.20V (Default)01V OV = 4.25V10V OV = 4.30V11V OV = 4.35V Table 5. Over-discharge Threshold Selection.ConfigurationRegister Bits OperationVUV1VUV0X3100X3101 00V UV=1.95VV UV=2.25V(X3101 default) 01V UV=2.05V V UV=2.35V10V UV=2.15V V UV=2.45V11V UV=2.25V(X3100 default)V UV=2.55VConfiguration Register BitsOperation VOC1VOC000V OC=0.075V (Default)01V OC=0.100V10V OC=0.125V11V OC=0.150VConfigurationRegister BitOperationSWCEN0Charge enable function: ON1Charge enable function: OFFTable 8. Cell Charging Threshold Voltage Selection.Cell Number SelectionThe X3100 is designed to operate with four (4) Li-Ion battery cells. The X3101 is designed to operate with three (3) Li-Ion battery cells. The CELLN bit of the conﬁguration register (Table 9) sets the number of cells recognized. For the X3101, the value for CELLN should always be zero.Table 9. Selection of Number of Battery Cells1The conﬁguration register consists of 16 bits of NOVRAM memory (T able 2, T able 3). This memory features a high-speed static RAM (SRAM) overlaid bit-for-bit with non-volatile “Shadow” EEPROM. An automatic array recall operation reloads the contents of the shadow EEPROM into the SRAM conﬁguration register upon power-up (Figure 3). Figure 3. Power up of Configuration RegisterThe conﬁguration register is designed for unlimited write operations to SRAM, and a minimum of 1,000,000 store operations to the EEPROM. Data retention is speciﬁed to be greater than 100 years.It should be noted that the bits of the shadow EEPROM are for the dedicated use of the conﬁguration register, and are NOT part of the general purpose 4kbit EEPROM array.T he WCFIG command writes to the conﬁguration register, see T able 30 and section “X3100/X3101 SPI Serial Communication” on page 22.After writing to this register using a WCFIG instruction, data will be stored only in the SRAM of the conﬁguration register. In order to store data in shadow EEPROM, aWREN instruction, followed by a EEWRITE to any address of the 4kbit EEPROM memory array must occur, see Figure 4. This sequence initiates an internal nonvolatile write cycle which permits data to be stored in the shadow EEPROM cells. It must be noted that even though a EEWRITE is made to the general purpose 4kbit EEPROM array, the value and address to which it is written, is unimportant. If this procedure is not followed, the conﬁguration register will power up to the last previously stored values following a power down sequence.Configuration Register BitsOperation VCE1VCE000V CE = 0.5V01V CE = 0.80V10V CE = 1.10V11V CE = 1.40VConfigurationRegister BitOperationCELLN1 4 Li-Ion battery cells (X3100 default)0 3 Li-Ion battery cells (X3100 or X3101)1.In the case that the X3100 or X3101 is configured for use withonly three Li-Ion battery cells (i.e. CELLN=0), then VCELL4 (pin7) MUST be tied to Vss (pin 9) to ensure correct operation.Figure 4. Writing to Configuration RegisterCONTROL REGISTERThe Control Register is realized as two bytes of volatile RAM (Table 10, Table 11). This register is written using the WCNTR instruction, see T able 30 and section “X3100/X3101 SPI Serial Communication” on page 22.Table 10. Control Register—Upper Byte Table 11. Control Register—Lower ByteSince the control register is volatile, data will be lost following a power down and power up sequence. The default value of the control register on initial power up or when exiting the SLEEP MOD E is 00h (for both upper and lower bytes respectively). The functions that can be manipulated by the Control Register are shown in Table 12.Table 12. Control Register FunctionalitySleep Control (SLP)Setting the SLP bit to ‘1’ forces the X3100 or X3101 into the sleep mode, if V CC < V SLP . See section “Sleep Mode” on page 15.Table 13. Sleep Mode Selection 15141312111098CBC4CBC3CBC2CBC1UVPCOVPCCSG1CSG07654321SLPxxxxxBit(s)NameFunction0-4–(don’t care)5,60, 0Reserved—write 0 to these locations.7SLP Select sleep mode.8,9CSG1,CSG0Select current sense voltage gain 10OVPC OVP control: switch pin OVP = V CC /V SS 11UVPC UVP control: switch pin UVP = V CC /V SS 12CBC1CB1 control: switch pin CB1 = V CC /V SS 13CBC2CB2 control: switch pin CB2 = V CC /V SS 14CBC3CB3 control: switch pin CB3 = V CC /V SS 15CBC4CB4 control: switch pin CB4 = V CC /V SSControl Register BitsOperationSLP0Normal operation mode 1Device enters Sleep modeCurrent Sense Gain (CSG1, CSG0)These bits set the gain of the current sense ampliﬁer. These are x10, x25, x80 and x160. For more detail, see section “Current Monitor Function” on page 20.Table 14. Current Sense Gain ControlCharge/Discharge Control (OVPC, UVPC)The OVPC and UVPC bits allow control of cell charge and discharge externally, via the SPI port. These bits control the OVP/LMON and UVP/OCP pins, which in turn control the external power FETs.Using P-channel power FETs ensures that the FET is on when the pin voltage is low (Vss), and off when the pin voltage is high (Vcc).OVP/LMON and UVP/OCP can be controlled by using the WCNTR Instruction to set bits OVPC and UVPC in the Control register (See page 10).Table 15. UVP/OVP ControlIt is possible to set/change the values of OVPC and UVPC during a protection mode. A change in the state of the pins OVP/LMON and UVP/OCP, however, will not take place until the device has returned from the protection mode.Cell Voltage Balance Control (CBC1-CBC4)This function can be used to adjust individual battery cell voltage during charging. Pins CB1–CB4 are used to control external power switching devices. Cell voltage balancing is achieved via the SPI port. Table 16. CB1—CB4 ControlCB1–CB4 can be controlled by using the WCNTR In-struction to set bits CBC1–CBC4 in the control register (T able 16).STATUS REGISTERThe status of the X3100 or X3101 can be veriﬁed by using the RDSTA T command to read the contents of the Status Register (T able 17).Table 17. Status Register.The function of each bit in the status register is shown in T able 18.Bit 0 of the status register (VRGS+OCD S) actually indicates the status of two conditions of the X3100 or X3101. Voltage Regulator Status (VRGS) is an internally generated signal which indicates that the output of the Voltage Regulator (VRGO) has reached an output of 5VD C ± 0.5%. In this case, the voltage regulator is said to be “tuned”. Before the signal VRGS goes low (i.e. before the voltage regulator is tuned), the voltage at the output of the regulator is nominally 5VDC ± 10% (See section “Voltage Regulator” on page 21.) Over-current D etection Status (OCD S) is another internally generated signal which indicates whether or not the X3100 or X3101 is in over-current protection mode.Signals VRGS and OCDS are logically OR’ed together (VRGS+OCDS) and written to bit 0 of the status register (See Table 18, T able 17 and Figure 2).Control Register BitsOperationCSG1CSG000Set current sense gain=x1001Set current sense gain=x2510Set current sense gain=x8011Set current sense gain=x160Control Register BitsOperation OVPC UVPC1x Pin OVP=V SS (FET ON)0x Pin OVP=V CC (FET OFF)x1Pin UVP=V SS (FET ON)x0Pin UVP=V CC (FET OFF)Control Register BitsOperation CBC4CBC3CBC2CBC1x x x1Set CB1=V CC (ON) x x x0Set CB1=V SS (OFF) x x1x Set CB2=V CC (ON) x x0x Set CB2=V SS (OFF) x1x x Set CB3=V CC (ON) x0x x Set CB3=V SS (OFF) 1x x x Set CB4=V CC (ON) 0x x x Set CB4=V SS (OFF)76543210 00000CCES+OVDSUVDSVRGS+OCDS。

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新华三网络产品手册无线物联网H3C iBox580 G2物联网业务一体机H3C IG530物联网业务网关/业务板H3C IG4100-L室内型LoRa网关H3C IG4300-L-R室外型LoRa网关H3C IG4500-L基站型LoRa网关H3C IG4510-L基站型LoRa网关H3C IG4520-L基站型LoRa网关H3C IN4500-L物联网终端设备H3C T320系列室内型物联网网关/接入单元H3C T320系列工业级物联网接入单元H3C T300系列室内型物联网接入单元H3C T300系列室外型物联网接入单元 H3C WA5320X-L室外全融合物联网关0205081013151720222730333501WLANH3C WX5500H系列新一代企业级核心多业务无线控制器H3C WX3500H系列新一代企业级核心多业务无线控制器H3C WX2500H系列新一代企业级核心多业务无线控制器H3C WX2508H-PWR-LTE新一代企业级多业务无线控制器H3C WX1804H-PWR 新一代企业级多业务无线控制器H3C 新一代全系列无线控制业务插卡H3C WBC560多业务无线控制器H3C WBC580新一代多业务无线控制器H3C WA6600系列802.11ax无线接入设备6172 8393104114125137148H3CWA6500、6300系列802.11ax无线接入H3C WA5500系列802.11ac无线接入设备H3C WA5300系列802.11ac无线接入设备H3C UAP系列802.11ac无线接入设备H3C终结者系列无线接入设备H3C WA6600X系列室外802.11ax无线接入设备 H3C WA5600X系列室外802.11ac无线接入设备17 H3C WA5300X系列室外802.11ac无线接入设备17221423227429236837938460移动通信核心网系列H3C EPC3108演进型分组核心网H3C vEPC3200虚拟化演进型分组核心网基站系列H3C BBU3100分布式基带单元H3C BBU3120分布式基带单元H3C RRU3184分布式基带单元边缘分流网关H3C vMEGW3200移动边缘分流网关终端系列H3C CPE3200-18室外型用户终端设备4345 485053 55 5742智联接绘未来G2物联网业务一体机是新华三技术有限公司（H3C）自主研发的集成物联网设备管理及业务应用的融合式设备。

CRIO-4010 单相、三相全参数交流电量采集模块用户手册说明书

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ERG1FGS301E中文资料(PANASONIC)中文数据手册「EasyDatasheet - 矽搜」

Type L
ERG(X)12S 6.35
ERG(X)1S 9.00
ERG(X)1F
ERG(X)2S ERG(X)2F
12.00
ERG(X)3S ERG(X)3F
15.00
ERG(X)5S ERG(X)5F
24.00
外形尺寸（mm）
φD
k
2.3
30.0
2.8
30.0
4.0
30.0
φd
0.65 0.65 0.80 0.80
120 –55 °C
100
80
60 Rated Load (%)
40
20
0 –60 –40 –20 0
70 °C
ERG(X)12S
ERG(X)1S, 1F ERG(X)2S, 2F ERG(X)3S, 3F
ERG(X)5S, 5F
130 °C
235 °C
20 40 60 80 100 120 140 160 180 200 220 240
½Z type isnon standard resistance values.
Code Type Res.Tol. Res. Value Range Code Type Res.Tol. Res. Value Range
±2 % 0.1 to 0.91 12S
±5 % 0.1 to 0.18 Z
The first two digitsare significant figures of resistance and the third one denotes number of zerosfollowing. Decimal point isexpressed by (Ex.) 1R0 : 1.0

T60403-K5024-X043规格书

1) (V)
M3014
U P,eff =
3.00 kV,
2s, N1+N2 gegen / to N3+N4
2) (AQL 0,25)
L 1+2
≥ 23.00 µH
f = 10.00 kHz , UAC,eff = 100.00 mV
3) (V)
Polarität, Übersetzungsverhältnis : Toleranz ± 2%
Customer
Kd Sach Nr. :
Customers part no.
Datum : 13.07.2007
Date
Seite :
Page
1 von 3
of
Maßbild (mm):
Mechanical outline
Freimaபைடு நூலகம்toleranz DIN ISO 2768-c
General tolerances
Verpackung : Verpackung nach M3510
Packing : packing according to M3510
Hrsg. : KB-FB-FT Bearbeiter: Gr
Editor engin
KB-PM B: Pf.
freig. :
Gr.
Weitergabe sowie Vervielfältigung dieser Unterlage, Verwertung und Mitteilung ihres Inhaltes nicht gestattet, soweit nicht ausdrücklich zugestanden. Zuwiderhandlungen verpflichten zu Schadenersatz. Alle Rechte für den Fall der Patenterteilung oder GM-Eintragung vorbehalten.

G3PX-220EUN AC100230;G3PX-240EUN;G3PX-260EUN;G3PX-240EC-CT10;中文规格书,Datasheet资料

■Single-phase ModelsEUN SeriesAC Power Controllers with Phase-control System Allow Precise Temperature Control Models with Base-up and Soft-start FunctionsEH SeriesPhase Control System Makes It Possible to Detect Single Heater Open Circuit (EH Series) and Multiple Heater Open Circuits (EHN Series)EC SeriesOptimum Devices for Controlling Input Power for Pure Metal Heater, andIncorporating Overcurrent Detecting and Single Heater Open Circuit Detecting Functions•OMRON’s unique design and carefully-selected materials made it possible to produce a compact and lightweight Power Controller.•Replaceable, easy-to-install Power Device Cartridge assures ease of maintenance.•Detecting component failures and operating errors.•Certified by UL and CSA.Refer to Safety Precautions for All Power Controllers.Model Number Structure■Model Number Legend1.Basic Model Name G3PX:Power Controller2.Rated Load Power Supply Voltage 2:100/110VAC and 200/230VAC3.Rated Load Current 20:20A 40:40A 60:60A4.Number of Phases E:Single5.Functions UN:Simple models H:Single heater open circuit detection function HN:Multiple heater open circuit detection function C:Constant-current function6.CT Unit TypeNote:Refer to CT Unit on page 4.G3PXG3PX Cartridge1.Basic Model Type G32X:Accessory for G3PX2.Basic Model Name A:Power Device Cartridge3.Rated Load Current 20:20A 40:40A 60:60ACT Unit1.Basic Model Type G32X:Accessory for G3PX2.Basic Model Name CT:CT Unit3.Length of Lead Wires 03:30cm 10:100 cm4.Series Blank:Series for single heater open circuit detection HN:Series for multiple heater open circuit detection C:Series for constant currentVariable Resistor1.Basic Model Type G32X:Accessory for G3PX2.Basic Model Name V3K:3-k Ω Variable Resistor V2K:2-k ΩVariable ResistorG3PXOrdering Information■List of ModelsEUN SeriesNote:1.The base-up output with a 0-mA temperature controller output (i.e. the temperature controller is OFF) differs from that with a 4-mAtemperature controller output. Refer the Base-up Characteristics on page 7.2.Contact your OMRON representative for applications to transformer loads.EH SeriesNote:1.EH- and EHN-series models are provided with a CT incorporating 30- or 100-cm-long lead wires and Power Device Cartridge. Whenordering, specify the length of the lead wires by adding a code to the model number as shown below.G3PX-2@0EH-CT03: CT with 30-cm-long lead wires G3PX-2@0EH-CT10: CT with 100-cm-long lead wires2.Adjusts the multiple heater open circuit detection sensitivity of EHN-series models. Enables single heater open circuit detection in control of a maximum of five heaters.3.Contact your OMRON representative for applications to transformer loads.EC SeriesNote:1.EC-series models are provided with a CT Unit with lead wires (30- or 100- cm in length). When ordering, specify the length of the leadwires by adding a code to the model number as shown below.G3PX-2@0EC-CT03: CT with 30-cm-long lead wires G3PX-2@0EC-CT10: CT with 100-cm-long lead wires2. A CT Unit and Power Device Cartridge are provided with the Power Controller.3.Contact your OMRON representative for applications to transformer loads.Phase Applicable loadLevel indicatorBase-up function(See note.)Soft-start timeCarry current Rated voltage ModelSingleResistive loadHeater(e.g., alloy heater or halogen lamp)(See note 2.)Y es Y esApprox. 0.5 to 10 s 20 A100/110 VAC 200/220 VACG3PX-220EUN 40 A G3PX-240EUN 60 AG3PX-260EUNPhase Applicable loadLevel indicatorSingle heater open circuit detection Multiple heater open circuit detection Carry current Rated voltage Model (See note 1.)SingleResistive load Heater(e.g., alloy heater or halogen lamp)(See note 3.)Y es Y esNo20 A 100/110 VAC 200/220 VACG3PX-220EH-CT03G3PX-220EH-CT1040 A G3PX-240EH-CT03G3PX-240EH-CT1060 AG3PX-260EH-CT03G3PX-260EH-CT10Y es (See note 2.)Y es20 A G3PX-220EHN-CT03G3PX-220EHN-CT1040 A G3PX-240EHN-CT03G3PX-240EHN-CT1060 AG3PX-260EHN-CT03G3PX-260EHN-CT10Phase Applicable loadLevel indicatorConstant-currentfunction Single heater open circuit detection Carry current Rated voltage Model (See note.)SingleResistive load Heater(e.g., alloy heat-er, pure metal heater, or halo-gen lamp) (See note 3.)Y es Y esY es20 A 100/110 VAC 200/220 VACG3PX-220EC-CT03G3PX-220EC-CT1040 A G3PX-240EC-CT03G3PX-240EC-CT1060 AG3PX-260EC-CT03G3PX-260EC-CT10G3PX■Accessories (Order Separately)CT UnitPower Device CartridgeNote:The G32X-A is a dedicated Power Device Cartridge for the G3PX.Refer to Replacement Parts on page 15.Specifications■Ratings (at an Ambient Temperature of 25°C)ControlNote:1.50/60 Hz (no selector required) (EUN Series)T erminals 18 and 19 of EHN/EC-series models must be open when the supply frequency is 50 Hz. These terminals must be short-circuited when the supply frequency is 60 Hz.e the G32X-V2K 2-k Ω Variable Resistor for external main setting on EUN, EC, and EHN (G32X-V3K 3-k Ω for EN-series models).3.Input 4 to 20 mA or 1 to 5 VDC linear input to the 4 to 20 mA current input terminal.OutputNote:The G3PX-2@@EHN (model with multiple heater open circuit detecting function) and G3PX-2@@EC (constant-current model) require 20%min. of the rated current to detect a short mode failure. EC-series models detect an open mode failure if the load current has dropped to 80% of the rated value. A short mode failure will be detected if the current has risen to 20% of the rated value.NameLength of lead wires Solderless terminals Applicable models ModelCT Unit30 cm Y esG3PX-2@@EHG32X-CT03100 cm G32X-CT1030 cm G3PX-2@@EHNG32X-CT03HN 100 cm G32X-CT10HN 30 cm G3PX-2@@EC G32X-CT03C 100 cmG32X-CT10CNameCarry currentApplicable models ModelPower Device Cartridge20 A G3PX-220E @@G32X-A2040 A G3PX-240E @@G32X-A4060 AG3PX-260E @@G32X-A60ItemG3PX-220EUN/240EUN/260EUNG3PX-220EH/240EH/260EHG3PX-220EHN/240EHN/260EHNG3PX-220EC/240EC/260ECRated voltage 100/110, 200/230 VAC Frequency 50/60 Hz (See note 1.)Inputsignal for controlExternal main setting(See note 2.) 2 k Ω (type B, 2 W min.) 3 k Ω (type B, 2W min.)2 k Ω (type B, 2 W min.)Current input 4 to 20 mA (at 1 to 5 VDC) (Input impedance: 250Ω) (See note 3.)Voltage ON/OFF input5 to 24 VDC (Input impedance: approx. 20 k Ω)External duty setting3 k Ω (type B)Relay output for alarm---SPDT: 8 A at 250 VAC/30 VDCModelApplicable loadRated load voltageLoad currentInrush current Number of phases G3PX-220E @G3PX-220E @N 100/110, 200/220 VAC (50/60 Hz)1 to 20 A (at 40°C) (See note.)220 A (60 Hz, 1 cycle)SingleG3PX-240E @G3PX-240E @N 1 to 40 A (at 40°C) (See note.)440 A (60 Hz, 1 cycle)G3PX-260E @G3PX-260E @N1 to 60 A (at 40°C) (See note.)440 A (60 Hz, 1 cycle)G3PX■CharacteristicsEU/EH SeriesNote:1.Duty setting does not complete to the OFF state (i.e. 10% remains).2.The start-up time is factory-set to 1 s on the EH Series, approx. 0.5 s on the EHN and EC Series.3.This is the initial start-up time with a 100% duty setting.4.Detection is effective when the set current is reduced by 20% or more.5.The minimum set value in the G3PX-220EHN is 6 A. If a lower value is required, increase the number of wiring turns around the CT.ItemG3PX-220EUN/240EUN/260EUNG3PX-220EH/240EH/260EHG3PX-220EHN/240EHN/260EHNOperating voltage range ±10%Operating frequency range ±1 Hz Output voltage adjustable range0% to 95%Internal duty setting range 0% to 100%10% to 100% (See note 1.)0% to 100%External duty setting range 0% to 100%10% to 100% (See note 1.)0% to 100%Start-up time (See note 2.)Approx. 0.5 to 10s (See note 3.)Approx. 0.1 to 1s (See note 3.)Approx. 0.5 to 10s (See note 3.)Base-up range0% to 90%---Multiple heater open circuit detection---20% max. (See note 4.)Min. phase detection ---Approx. 1/6 πMin. phase setting------Approx. 1/6 πMin. load current for ON er-ror detecting--- 1 A 30% max. of rated current (See note 5.)Abnormality detection time ---0.1 s max.1 s max.Voltage drop with output ON 1.6 V max. (RMS)Leakage current 10 mA max. at 100/110 VAC, 20 mA max. at 200/220 VAC Insulation resistance 100 M Ω min. (at 500 VDC)Dielectric strength 2,000 VAC, 50/60 Hz for 1 min.Vibration resistance Malfunction: 10 to 55 to 10 Hz, 100 m/s 2Shock resistance Malfunction: 300 m/s 2Ambient temperature Operating:–25°C to 65°C (with no icing or condensation)Storage:–10°C to 55°C (with no icing or condensation)Ambient humidity Operating: 45% to 85%WeightG3PX-220EUN: approx. 1.1 kg G3PX-240EUN: approx. 1.4 kg G3PX-260EUN: approx. 1.7 kgG3PX-220EH: approx. 1.1 kg G3PX-240EH: approx. 1.4 kg G3PX-260EH: approx. 1.7 kgG3PX-220EHN: approx. 1.2 kg G3PX-240EHN: approx. 1.5 kg G3PX-260EHN: approx. 1.8 kgG3PX EC SeriesItem G3PX-220EC G3PX-240EC G3PX-260EC Operating voltage range±10%Operating frequency range±1 HzOutput voltage adjustable range0% to 95%Internal duty setting range0% to 100%External duty setting range0% to 100%Start-up time Approx. 0.5 to 10sMin. load current for ON errordetecting20% max. of rated currentCurrent limit range0% to 100%Excess current detection Peak current of 110 A within1cycle Peak current of 220 A within1cyclePeak current of 330 A within1cycleConstant current±3% max. with 10-time increment of load value±3% max. with ±10% change of voltageAbnormality detection time 1 s max.Voltage drop with output ON 1.6 V max. (RMS)Leakage current10 mA max. at 100/110 VAC, 20 mA max. at 200/220 VAC Insulation resistance100 MΩ min. (at 500 VDC)Dielectric strength2,000 VAC, 50/60 Hz for 1 min.Vibration resistance Malfunction: 10 to 55 to 10 Hz, 100 m/s2Shock resistance Malfunction: 300 m/s2Ambient temperature Operating:–25°C to 65°C (with no icing or condensation)Storage:–10°C to 55°C (with no icing or condensation) Ambient humidity Operating: 45% to 85%Weight G3PX-220EC: approx. 1.1 kgG3PX-240EC: approx. 1.4 kgG3PX-260EC: approx. 1.7 kgG3PXEngineering DataThe following data is for an ambient temperature of 25°C.Output CharacteristicsDuty SettingBase-up Characteristics100%60%40%20%G3PX-EUN/EH/EHN ModelsO u t p u t v o l t a g e (%)Input current (mA)G3PX-EC ModelsG3PX-EUN/EH/EHN ModelsO u t p u t v o l t a g e (%)Input current (mA)O u t p u t v o l t a g e (%)Input current (mA)G3PX-2@0EUN ModelsO u t p u t v o l t a g e (%)Input current (mA)G3PXLoad Current vs. Ambient TemperatureOne Cycle Surge Current: Non-repetitiveG3PX-220E @ ModelsG3PX-240E @ ModelsG3PX-260E @ ModelsNote:1.Please use proper ventilation andcooling.2.Please note that derating curve above 40A is applicable under the UL standard only with forced air cooling by fan.Note:Please use proper ventilation andcooling.Note:Please use proper ventilation andcooling.G3PXNomenclatureLevel indicatorPOWER indicator CT Unit G3PX-2@0EC-CT @@POWER indicatorCT UnitLevel indicatorSHORT indicator (for short-mode failure detection)Power Device CartridgeTIME adjuster (for extended soft-start time)DUTY adjuster (for internal slope setting)ALARM adjuster (for multiple heater open circuit detection)OPEN indicator (for multiple heater open circuit detection)Single Heater Open Circuit Detection (EH-series Model)SHORT indicator (for short-mode failure detection)CT Unit OPEN indicator (for single heater open circuit detection)DUTY adjuster (for internal slope setting)TIME adjuster (for soft-start time)Constant-current Model (EC-series Model)SHORT indicator (for short-mode failure detection)OPEN indicator (for single heater open circuit CURRENT limit adjuster (for limiting current)DUTY adjuster (for internal slope setting)TIME adjuster (for extended soft-start time)G3PX Operation■Error Detecting FunctionWiringSingle-phase ModelsAll G3PX-2@0EH/EHN/EC-series models incorporate terminals 11 and 12 for the CT Unit, 13 and 14 for the external reset switch, and 16 and 17 for relay output as well as power/input terminals 1 through 10.OutputSingle-phase ModelsThe following illustrations show the condition of the G3PX LED indicators when the G3PX detects heater open circuit, a short-mode failure (ON failure of components), or overcurrent (EC-series constant-current models only). The indicator and relay output signals are reset with the internal or external reset switch provided that the error condition has been remedied.1.When EH/EHN/EC-series models detect single or multiple heateropen circuit, the OPEN indicator is lit and the SPDT relay output is ON.Note:When the G3PX detects heater open circuit, the Level indicator will be OFF regardless of the G3PX input condition. The redOPEN indicator will be lit. EHN-series models, however, willcontinue operating with level indication.2.When EH/EHN/EC-series models detect a short-mode failure, theSHORT indicator is lit and the SPDT relay output is ON.Note:When the G3PX detects a short-mode failure, all LEDs of the Level indicator and red SHORT indicator are lit. When you usea breaker to disconnect the load with the relay output, all LEDsof the Level indicator will be OFF regardless of the input to the G3PX.3.When EC-series models detect an overcurrent, the Level indicatorwill flash and the SPDT relay output is ON. The input signal will be shut off.Note:When resetting, leave power supply terminals 10 to 9 or 8 ON.With continuous load current. With load current shut off.分销商库存信息:OMRONG3PX-240EUN G3PX-260EUNG3PX-220EUNAC100/230G3PX-240EC-CT10G3PX-220EC-CT10G3PX-220EH-CT03 G3PX-220EH-CT10G3PX-220EHN-CT03G3PX-260EHN-CT10 G3PX-240EHN-CT03G3PX-240EHN-CT10G3PX-260EHN-CT03。

760301105;中文规格书,Datasheet资料

1.1 1.02012-06-282012-04-01SStSStSStWWWürth Elektronik eiSos GmbH & Co. KGEMC & Inductive SolutionsMax-Eyth-Str. 174638 WaldenburgGermanyTel. +49 (0) 79 42 945 - 0A Dimensions: [mm]H1: Classification Reflow Profile for SMT components:H2: Classification Reflow ProfilesProfile FeaturePreheat- Temperature Min (T smin ) - Temperature Max (T smax ) - Time (t s ) from (T smin to T smax )Ramp-up rate (T L to T P )Liquidous temperature (T L )Time (t L ) maintained above T L Peak package body temperature (T p )Time within 5°C of actual peak temperature (t p )Ramp-down rate (T P to T L )Time 25°C to peak temperature Pb-Free Assembly 150°C 200°C60-180 seconds 3°C/ second max.217°C60-150 seconds See Table H320-30 seconds 6°C/ second max.8 minutes max.refer to IPC/JEDEC J-STD-020DH3: Package Classification Reflow TemperaturePB-Free Assembly PB-Free Assembly PB-Free Assembly Package Thickness< 1.6 mm 1.6 - 2.5 mm ≥ 2.5 mmVolume mm³<350260°C 260°C 250°CVolume mm³350 - 2000260°C 250°C 245°CVolume mm³>2000260°C 245°C 245°Crefer to IPC/JEDEC J-STD-020DH Soldering Specifications:I Cautions and Warnings:The following conditions apply to all goods within the product series of WE-GDTof Würth Elektronik eiSos GmbH & Co. KG:General:All recommendations according to the general technical specifications of the data sheet have to be complied with.The disposal and operation of the product within ambient conditions which probably alloy or harm the wire isolation has to be avoided.If the product is potted in customer applications, the potting material might shrink during and after hardening. Accordingly to this the product is exposed to the pressure of the potting material with the effect that the core, wire and termination is possibly damaged by this pressure and so the electrical as well as the mechanical characteristics are endanger to be affected. After the potting material is cured, the core, wire and termination of the product have to be checked if any reduced electrical or mechanical functions or destructions have occurred.The responsibility for the applicability of customer specific products and use in a particular customer design is always within the authority of the customer. All technical specifications for standard products do also apply for customer specific products.Washing varnish agent that is used during the production to clean the application might damage or change the characteristics of the wire in-sulation, the marking or the plating. The washing varnish agent could have a negative effect on the long turn function of the product.Direct mechanical impact to the product shall be prevented as the ferrite material of the core could flake or in the worst case it could break. Product specific:Follow all instructions mentioned in the datasheet, especially:•The solder profile has to be complied with according to the technical reflow soldering specification, otherwise no warranty will be sustai-ned.•Wave soldering is not applicable. Reflow soldering is recommended.•All products are supposed to be used before the end of the period of 12 months based on the product date-code, if not a 100% solderabi-lity can´t be warranted.•Violation of the technical product specifications such as exceeding the nominal rated current will result in the loss of warranty.1. General Customer ResponsibilitySome goods within the product range of Würth Elektronik eiSos GmbH & Co. KG contain statements regarding general suitability for certain application areas. These statements about suitability are based on our knowledge and experience of typical requirements concerning the are-as, serve as general guidance and cannot be estimated as binding statements about the suitability for a customer application. The responsibi-lity for the applicability and use in a particular customer design is always solely within the authority of the customer. Due to this fact it is up to the customer to evaluate, where appropriate to investigate and decide whether the device with the specific product characteristics described in the product specification is valid and suitable for the respective customer application or not.2. Customer Responsibility related to Specific, in particular Safety-Relevant ApplicationsIt has to be clearly pointed out that the possibility of a malfunction of electronic components or failure before the end of the usual lifetime can-not be completely eliminated in the current state of the art, even if the products are operated within the range of the specifications.In certain customer applications requiring a very high level of safety and especially in customer applications in which the malfunction or failure of an electronic component could endanger human life or health it must be ensured by most advanced technological aid of suitable design of the customer application that no injury or damage is caused to third parties in the event of malfunction or failure of an electronic component.3. Best Care and AttentionAny product-specific notes, warnings and cautions must be strictly observed.4. Customer Support for Product SpecificationsSome products within the product range may contain substances which are subject to restrictions in certain jurisdictions in order to serve spe-cific technical requirements. Necessary information is available on request. In this case the field sales engineer or the internal sales person in charge should be contacted who will be happy to support in this matter.5. Product R&DDue to constant product improvement product specifications may change from time to time. As a standard reporting procedure of the Product Change Notification (PCN) according to the JEDEC-Standard inform about minor and major changes. In case of further queries regarding the PCN, the field sales engineer or the internal sales person in charge should be contacted. The basic responsibility of the customer as per Secti-on 1 and 2 remains unaffected.6. Product Life CycleDue to technical progress and economical evaluation we also reserve the right to discontinue production and delivery of products. As a stan-dard reporting procedure of the Product Termination Notification (PTN) according to the JEDEC-Standard we will inform at an early stage about inevitable product discontinuance. According to this we cannot guarantee that all products within our product range will always be available. Therefore it needs to be verified with the field sales engineer or the internal sales person in charge about the current product availability ex-pectancy before or when the product for application design-in disposal is considered.The approach named above does not apply in the case of individual agreements deviating from the foregoing for customer-specific products.7. Property RightsAll the rights for contractual products produced by Würth Elektronik eiSos GmbH & Co. KG on the basis of ideas, development contracts as well as models or templates that are subject to copyright, patent or commercial protection supplied to the customer will remain with Würth Elektronik eiSos GmbH & Co. KG.8. General Terms and ConditionsUnless otherwise agreed in individual contracts, all orders are subject to the current version of the “General Terms and Conditions of Würth Elektronik eiSos Group”, last version available at .J Important Notes:The following conditions apply to all goods within the product range of Würth Elektronik eiSos GmbH & Co. KG:分销商库存信息: WURTH-ELECTRONICS 760301105。

FSFR2100XS;FSFR2100XSL;中文规格书,Datasheet资料

FSFR-XS Series — Fairchild Power Switch (FPS ™) for Half-Bridge Resonant ConverterFeatures Variable Frequency Control with 50% Duty Cycle for Half-Bridge Resonant Converter TopologyHigh Efficiency through Zero Voltage Switching (ZVS) Internal UniFET™ with Fast-Recovery Body Diode Fixed Dead Time (350ns) Optimized for MOSFETs Up to 300kHz Operating FrequencyAuto-Restart Operation for All Protections with External LV CCProtection Functions: Over-Voltage Protection (OVP), Over-Current Protection (OCP), Abnormal Over-Current Protection (AOCP), Internal Thermal Shutdown (TSD)Applications PDP and LCD TVsDesktop PCs and Servers AdaptersTelecom Power SuppliesDescriptionThe FSFR-XS series includes highly integrated power switches designed for high-efficiency half-bridge resonant converters. Offering everything necessary to build a reliable and robust resonant converter, the FSFR-XS series simplifies designs while improving productivity and performance. The FSFR-XS series combines power MOSFETs with fast-recovery type body diodes, a high-side gate-drive circuit, an accurate current controlled oscillator, frequency limit circuit, soft-start, and built-in protection functions. The high-side gate-drive circuit has common-mode noise cancellation capability, which guarantees stable operation with excellent noise immunity. The fast-recovery body diode of the MOSFETs improves reliability against abnormal operation conditions, while minimizing the effect of reverse recovery. Using the zero-voltage-switching (ZVS) technique dramatically reduces the switching losses and significantly improves efficiency. The ZVS also reduces the switching noise noticeably, which allows a small-sized Electromagnetic Interference (EMI) filter.The FSFR-XS series can be applied to resonant converter topologies such as series resonant, parallel resonant, and LLC resonant converters.Related ResourcesAN4151 — Half-bridge LLC Resonant Converter DesignUsing FSFR-Series Fairchild Power Switch (FPS TM)Ordering InformationPart Number PackageOperating Junction TemperatureR DS(ON_MAX) Maximum Output Powerwithout Heatsink(V IN =350~400V)(1,2)Maximum Output Power with Heatsink(V IN =350~400V)(1,2)FSFR2100XS 9-SIP-40 to +130°C0.51Ω 180W 400W FSFR1800XS 0.95Ω 120W 260W FSFR1700XS 1.25Ω 100W 200W FSFR1600XS 1.55Ω 80W 160W FSFR2100XSL 0.51Ω 180W 400WFigure 2. Internal Block Diagram9 HV CC This is the supply voltage of the high-side gate-drive circuit IC.10 V CTR This is the drain of the low-side MOSFET. Typically, a transformer is connected to this pin.FSFR1700XS/L T C=25°C 6.0T C=100°C 3.9FSFR1600XS/L T C=25°C 4.5T C=100°C 2.7I LK Offset Supply Leakage Current HV CC=V CTR=500V 50μAI Q HV CC QuiescentHV CC Supply Current (HV CC UV+) - 0.1V 50 120 μAI Q LV CC QuiescentLV CC Supply Current (LV CC UV+) - 0.1V 100 200 μAI O HV CC Operating HV CC Supply Current(RMS Value) f OSC=100KHz69mADead-Time Control SectionTime(7)350nsD T DeadNotes:6. This parameter, although guaranteed, is not tested in production.7. These parameters, although guaranteed, are tested only in EDS (wafer test) process.11.05d a t 25O C11.05e d a t 25O C1m a l i z e d a t 25O Cgain is inversely proportional to the switching frequency in the ZVS region. The output voltage can be regulated by modulating the switching frequency. Figure 18 shows the typical circuit configuration for the R T pin, where the opto-coupler transistor is connected to the R T pin to modulate the switching frequency. of the resonant converter progressively. Since the voltage gain of the resonant converter is inversely proportional to the switching frequency, the soft-start is implemented by sweeping down the switching frequency from an initial high frequency (f I S S) until the output voltage is established. The soft-start circuit is made byTpin, as shown in Figure 18. FSFR-XS series also has a 3ms internalFigure 19. Frequency Sweeping of Soft-Start4. Self Auto-Restart: The FSFR-XS series can restart automatically even though any built-in protections are triggered with external supply voltage. As can be seen in Figure 20 and Figure 21, once any protections are triggered, the M1 switch turns on and the V-I converter is disabled. C SS starts to discharge until V Css across C SS drops to V CssL. Then, all protections are reset, M1 turns off, and the V-I converter resumes at the same time. The FSFR-XS starts switching again with soft-start. If the protections occur while V Css is under V CssL and V CssH level, the switching is terminated immediately, V Css continues to increase until reaching V CssH, then C SS is discharged by M1.Figure 20. Internal Block of AR PinAfter protections trigger, FSFR-XS is disabled during theI Crt stop t S/S(a)P ro te ction s a re trigge re d,(b)F SF R-U S restartsFigure 21. Self Auto-Restart Operation5. Protection Circuits: The FSFR-XS series has several self-protective functions, such as Over-Current Protection (OCP), Abnormal Over-Current Protection (AOCP), Over-Voltage Protection (OVP), and Thermal Shutdown (TSD). These protections are auto-restart mode protections, as shown in Figure 22.Once a fault condition is detected, switching is terminated and the MOSFETs remain off. When LV CC falls to the LV CC stop voltage of 10V or AR signal is HIGH, the protection is reset. The FSFR-XS resumes normal operation when LV CC reaches the start voltage of 12.5V.Figure 22. Protection Blocks5.1 Over-Current Protection (OCP): When the sensing pin voltage drops below -0.58V, OCP is triggered and the MOSFETs remain off. This protection has a shutdown time delay of 1.5µs to prevent分销商库存信息:FAIRCHILDFSFR2100XS FSFR2100XSL。

QSC6010模块使用说明书解析

目录1 简介...................................................................................................................................... - 1 -1.1硬件参数 (1)1.2软件参数 (1)1.3环境参数 (1)1.4认证 (1)1.5应用范围 (1)1.6结构尺寸 (1)2 接口介绍.............................................................................................................................. -3 -2.1功能框图 (3)2.2模块接口 (4)2.3电源接口 (7)2.4天线接口 (7)2.5音频接口 (7)2.6数据接口 (7)2.7R-UIM接口 (8)2.8键盘接口 (8)2.9PCM接口 (8)2.10用户自定义接口 (8)2.11其他接口 (8)2.12软件接口 (8)3 技术参数............................................................................................................................ - 10 -3.1极限工作条件 (10)3.2推荐工作条件 (10)3.3逻辑电平特性 (10)3.4音频接口特性 (11)3.5PCM接口时序 (11)3.6可靠性参数 (12)4 机械尺寸............................................................................................................................ - 12 -4.1模块封装 (12)4.2包装 (13)4.3推荐焊盘 (13)4.4标识 (13)5 参考设计............................................................................................................................ - 14 -6 注意事项：........................................................................................................................ - 15 -1简介CDMA无线接入模块基于CDMA20001x网络（兼容IS-95A）提供语音、数据、短信等业务，可广泛应用于无线传输、固定台、无线公话、接入盒、远程监控、车载台、无线多媒体终端和无线个人终端等系统中。

W04G;W005G;W01G;W02G;W08G;中文规格书,Datasheet资料

e 3W005G - W10G1.5A GLASS PASSIVATED BRIDGE RECTIFIERFeaturesMaximum Ratings and Electrical Characteristics@ T A = 25°C unless otherwise specifiedMechanical DataSingle phase, 60Hz, resistive or inductive load. For capacitive load, derate current by 20%.Notes: 1. Thermal resistance from junction to case mounted on PC board with 13 x 13mm (0.03mm thick) land areas. 2. Per element, measured at 1.0MHz and applied reverse voltage of 4.0V DC.3. EC Directive 2002/95/EC(RoHS) revision 13.2.2003. Glass and High Temperature Solder Exemptions Applied, see EU Directive AnnexNotes 5 and 7.·Glass Passivated Die Construction·Low Forward Voltage Drop, High Current Capability ·Surge Overload Rating to 50A Peak ·Ideal for Printed Circuit Boards·Case to Terminal Isolation Voltage 1500V ·UL Listed Under Recognized Component Index, File Number E94661·Lead Free Finish, RoHS Compliant (DC 514+) (Note 3)·Case: WOG·Case Material: Molded Plastic. UL Flammability Classification Rating 94V-0·Moisture Sensitivity: Level 1 per J-STD-020C·Terminals: Finish ¾ Silver. Plated Leads Solderable per MIL-STD-202, Method 208·Polarity: As marked on Body ·Marking: Type Number·Weight: 1.3 grams (approximate)0.010.11.0100.20.6 1.0 1.4I , I N S T A N T A N E O U S F O R W A R D C U R R E N T (A )F V , INSTANTANEOUS FORWARD VOLTAGE (V)FFig. 2 Typical Forward Characteristics1020304050110100I , P E A K F O R W A R D S U R G E C U R R E N T (A )F S M NUMBER OF CYCLES AT 60 HzFig. 3 Max Non-Repetitive Surge Current110100110100C , T O T A L C A P A C I T A N C E (p F )T V , REVERSE VOLTAGE (V)R Fig. 4 Typical Total Capacitance0.010.11.01010020004080160PERCENT OF RATED PEAK REVERSE VOLTAGE (%)Fig. 5 Typical Reverse Characteristics1200.51.01.50255010012515075I , A V E R A G E F O R W A R D C U R R E N T (A )F T, AMBIENT TEMPERATURE (°C)AFig. 1 Forward Current Derating CurveOrdering Information(Note 4)IMPORTANT NOTICEDiodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to any product herein. Diodes Incorporated does not assume any liability arising out of the application or use of any product described herein; neither does it convey any license under its patent rights, nor the rights of others. The user of products in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on our website, harmless against all damages.LIFE SUPPORTDiodes Incorporated products are not authorized for use as critical components in life support devices or systems without the expressed written approval of thePresident of Diodes Incorporated.分销商库存信息:DIODESW04G W005G W01G W02G W08G W10G。

MSN6010F MOS管规格书

Off Characteristics
Drain-Source Breakdown Voltage
BVDSS
VGS=0V ID=250μA
600
-
-
V
Zero Gate Voltage Drain Current
IDSS
VDS=600V,VGS=0V
-
-
1
μA
Gate-Body Leakage Current On Characteristics (Note 3)
Reverse Recovery Time
Reverse Recovery Charge
VSD
VGS=0V,IS=10A
-
1.4
V
IS
-
-
10.0
A
trr
TJ = 25°C, IF = 10.0A
-
425
-
nS
Qrr
di/dt = 100A/μs(Note3)
-
4.31
-
μC
Forward Turn-On Time
IGSS
VGS=±30V,VDS=0V
-
-
±100
nA
Gate Threshold Voltage
VGS(th)
VDS=VGS,ID=250μA
3
-
4.5
V
Drain-Source On-State Resistance
RDS(ON)
VGS=10V, ID=5.0A
-
-
0.95
Ω
Forward Transconductance Dynamic Characteristics (Note4)

DPG60C200HB;中文规格书,Datasheet资料

HiPerFRED²Features / Advantages:Applications:Package:Part numberV I RRM ==20030DPG 60 C 200 HBV A 2x Backside: cathodet rr =35nsHigh Performance Fast Recovery Diode Low Loss and Soft Recovery Common Cathode● Planar passivated chips● Very low leakage current ● Very short recovery time ● Improved thermal behaviour ● Very low Irm-values● Very soft recovery behaviour● Avalanche voltage rated for reliable operation ● Soft reverse recovery for low EMI/RFI ● Low Irm reduces:- Power dissipation within the diode- Turn-on loss in the commutating switch● Antiparallel diode for high frequency switching devices ● Antisaturation diode ● Snubber diode● Free wheeling diode● Rectifiers in switch mode power supplies (SMPS)● Uninterruptible power supplies (UPS)FAVI RMS A per pin 50R thCH K/W 0.25M D Nm 1.2mounting torque 0.8T stg °C 150storage temperature-55Weight g 6Symbol DefinitionRatingstyp.max.min.Conditions RMS currentthermal resistance case to heatsink Unit I is typically limited by: 1. pin-to-chip resistance; or by 2. current capability of the chip.In case of 1, a common cathode/anode configuration and a non-isolated backside, the whole current capability can be used by connecting the backside.F CN120mounting force with clip20Ordering Delivering ModeBase Qty Code KeyStandard Part Name DPG 60 C 200 HB 506294Tube 30D P G 60C 200 HBPart numberDiodeHiPerFRED extreme fastCommon CathodeT O-247AD (3) ===DPG60C200QB DPF60C200HB DPF60C200HJ TO-3P (3)TO-247AD (3)ISOPLUS247 (3)Similar PartPackage1)1)Marking on Product DPG60C200HB 200200200Voltage ClassCurrent Rating [A]Reverse Voltage [V]====RMS分销商库存信息: IXYSDPG60C200HB。

Z系列多功能网络电力仪表新

n . 8.1 : n -无校验, 8 - 8个数据位, 1 - 1个停止位 o.8.1 : o -奇校验, 8 - 8个数据位, 1 - 1个停止位 E.8.1 : E-偶校验, 8- 8个数据位, 1- 1个停止位
0~6 1~15 End
选择所测量的电量参数中的任何一个项目以及其报警的上下限数值,经过DO模块的判断输出相应的开关通断信号。选择所测量的电量参数中的任何一个项目以及其满刻度输出对应值,经过AO模块采集运算后输出。当前密码输入新密码第一次输入新密码第二次
开关量
输出指示输入指示
diSP=5
00000000(开关量) 前四位:开关量输出(0 :关断，1 :导通) 后四位:开关量输入(0 :关断，1 :导通) 显示三相无功功率值: 左图显示: A相无功功率值: 0.000Kvarh B相无功功率值: 0.000Kvarh C相无功功率值: 0.000Kvarh 总无功功率值: 0.000Kvarh 正向有功电能值：0.09KWh
6
4.6 编程操作示例所有的仪表在第一次使用时,请检查仪表的参数同所在配电系统中参数是否一致,仪表后面的标签中都标注了仪表出厂的设置参数;如果不一致可通过面板上的四个按键自行修改仪表内部参数,使其满足配电系统中的要求。 4.2.1 设置显示方式，由diSP = 1(三相电流值)更改为 diSP = 4(三相功率因数值)
河北三石电力设备有限公司
Z系列多功能网络电力仪表使用说明书
安装和使用前请阅读此说明书
一、产品简介
1.1 引用标准引用国家标准： DL/T614-1997多功能电能表 GB/T17883-1999 0.2S级和0.5S级静止交流有功电度表 GB/T17882-1999 2级和3级静止交流无功电度表 GB/T13850-1998交流电量转换为模拟量或者数字信号的电测量变送器引用国际标准 IEC62053-22 : 2003 电量测量设备 (交流 )-特殊要求-第 22 部分：静态电度表 (0 .2S 级和 0.5S 级) IEC62053-23 : 2003 电量测量设备 (交流 )-特殊要求-第 23 部分：静态无功表 (0 .2S 级和 0.5S 级) IEC61010-1 : 2001 测量、控制以及实验室用电气设备的安全要求-第一部分：一般要求 IEC61000-2-11 电磁兼容性 (EMC)- 第2- 11部分 IEC60068-2-30环境测试-第2-30部分 1.2 产品概述 Z系列多功能网络电力仪表专门针对供配电系统的电力监控需求和设计制造。它能高精度的测量所有常用的电力参数,如三相电压、三相电流、有功功率、无功功率、频率、功率因数、四象限电能等。同时还具有电能累计、电能脉冲输出、越限报警、开关量输入输出、模拟量变送输出与网络通讯等功能,具有良好的人机操作界面。 Z系列多功能网络电力仪表具有极高的性价比,可以取代常规测量指示仪表、电能计量表、多功能电力仪表以及相关的辅助单元。作为一种先进的智能化、数字化的电网前端采集元件。该仪表可以应用于各种控制系统, 能源管理系统,变电站自动化,配电网自动化,工业自动化,智能建筑,智能配电柜,开关柜中, 具有安装方便,接线简单,维护方便,工程量小,现场可设置输入参数的特点。能够完成业界不同PLC,工业控制计算机通讯软件的组网。

洛克泰X32-10i流式焊接胶水技术数据表说明书

Technical Data Sheet LOCTITE X32-10iSeptember2014PRODUCT DESCRIPTIONLOCTITE X32-10i provides the following product characteristics:Technology Liquid fluxApplication Solder fluxLOCTITE X32-10i is a no residue,halide-free flux formulated with a wider operating window.FEATURES AND BENEFITS●High speed soldering on conventional leaded and SMDcomponents,no bridges or icicles●No cleaning,reducing cost and elimates CFC usage●Wide operating window●Non-corrosive,safer than RMA flux●High surface insulation resistance,without cleaning●No residues to interfere with ATE probes,withoutcleaningTYPICAL PROPERTIESLiquid Flux Typical PropertiesColor ColorlessOdor AlcoholSolids Content,% 2.5Halide Content,%ZeroAcid Value (on liquid),mg KOH/g16Specific Gravity@25°C0.812Flash Point,Abel Cup,ºC12Thinners X732-10iISO9454classification 1.2.3ANSI/JSTD004classification PIPC classification M3CNEN29454classification 1.2.3DIRECTIONS FOR USEApplication:LOCTITE X32-10i is designed for use on consumer electronics and telecommunications applications as well as other professional applications with conformal coatings.Different solvent blends may be available to meet local conditions. This will be specified by a different suffix(e.g.,X32-10M).The Printed Circuit Board:LOCTITE X32-10i is recommended for use on copper or tin-lead coated PCBs.Specifying the use of a copper circuit preservative will ensure better soldering and excellent post-soldering cleanliness. LOCTITE X32-10i will solder satisfactorily over most rosin-based surface preservatives but the rosin residues from the preservative will reduce board cleanliness unless cleaning is employed.It is recommended that the rosin-based preservative be applied no longer than3months before soldering with LOCTITE X32-10i.LOCTITE X32-10i has been formulated to work over a wide range of solder resists.The solvent system in LOCTITE X32-10i has been designed for optimum wetting of surfaces except for polystyrene, polyvinyl chloride or polycarbonate where but prolonged contact is not recommended.Machine Preparation:Ensure the soldering machine is thoroughly cleaned,including all fingers,pallets and converyors,so that any possible contamination has been removed.It may be necessary to steam clean the equipment to remove all residues.It is recommended that MCF800Cleaner is used in the finger cleaners FluxingLOCTITE X32-10i has been formulated for use in foam,spray or wave fluxers in the same way as ordinary fluxes on standard wave soldering machines. The upper limit for flux coverage to ensure that soldered PCBs pass cleanliness tests is25 g/m²of circuit.Good soldering can be achieved at half this volume.It is important to remove excess flux from the circuit boards using the standard air knife or brushes supplied on the wave soldering machine. An air pressure of about5-7psi is recommended and the nozzle should be about25mm below the board and angled back at a few degrees,perpendicular to the plane of the board. This will ensure effective removal of excess flux without transferring droplets to the top of the following board.Sufficient space should be allowed between the foam fluxer and the air knife to prevent the air stream from disturbing the foam.Observing the following instructions will help ensure optimum foaming and soldering results:e DRY AIR.2.Keep the flux tank FULL at all times.3.The top of the foaming stone should be no more than20 mmbelow the surface of the liquid flux.A fine foaming stone is preferred and,if necessary,the level of the stone should be raised.4.The preferred width of the slot(opening)of the foam fluxer is10mm. If wider,add a strip of stainless steel or PVC across to narrow down to the preferred size. It is ideal to have a chimney for the foam which tapers towards the top.5.DO NOT use hot fixtures or pallets as these can cause the foamto deteriorate and increase,which can cause evaporation loss. 6.DO NOT use fixtures that can entrap flux.Flux ControlControl of the flux concentration is achieved by measuring the temperature and the specific gravity of the flux.A nomograph is available to show how these measurements are related to the corrective action needed.The specific gravity of the flux and thinners are similar and varies with water content.As a result,flux concentration control by measurement of the acid value ismore convenient.PreheatingLOCTITE X32-10i contains more solvent than conventional fluxes.It will be necessary to increase the preheat settings to remove the additional solvent and to ensure that the flux is properly activated.The optimum preheat temperature and time for a PCB will depend on its design and the thermal mass of the components. The cycle should be sufficient to ensure that the flux coating is not visibly wet when it contacts the wave.The combination of very low resin content and special solvent blend produce a wider operating window compared with other low solid content liquid fluxes.Conditions will vary from one machine to another. The following settings will yield good results on a number of systems.Conveyor Speed, ft/minConveyorSpeed,M/minTopsidePreheat,°CTopsidePreheat,ºF4 1.2282-83180-1835 1.5293-99200-2086 1.8399-104210-218It is advantageous to fit a topside canopy over the preheaters to produce more effective drying and activation.This will allow the use of faster conveyor speeds and improve soldering.At a speed of1.5m/min ,a contact length of38 to50 mm between the wave and the PCB is recommended.At lower speeds,this contact length should be reduced. Very slow speeds through the solder wave may produce dull solder joint.It is recommended to use a temperature profiling system to measure preheat and peak temperatures during set up of the wave soldering machine. This is also recommended for consistent process monitoring.IT IS IMPORTANT that flux solvent be removed by the preheat and that the PCB IS NOT WET when it reaches the solder wave.SoldersLOCTITE X32-10i can be used with all standard solder alloys.The recommended bath temperature is260°C.The solder bath temperature can generally be reduced compared with processes using conventional fluxes.Temperatures as low as235°C can be used for leaded alloys and this results in improved soldering and less wastage through drossing.Dwell time on the wave should be1.5 to2.5 seconds.Conveyor speed for dual wave systems should be at least 1.2m/min.Cleaning:To complete the no-clean assembly process,compatible Multicore cored solder wire and solder paste products are available.Soldering tips should be kept clean with Multicore Tip Thinner/Cleaner TTC1.LOCTITE X32-10i flux properly applied and processed leaves no discernible residues without cleaning.It is recommended that the soldering system itself be tested for cleanliness using an unfluxed board passed over the soldering machine.Suppliers should be requested to supply clean components and clean boards with good solderability.Special applications may have regulations insisting on board cleaning and in such cases MCF800cleaner may be used.This is an economic cleaner which is free from CFC compounds and may be used to remove any small accumulation of flux solids that might develop on parts of the soldering machine after prolonged use.Machine contamination will,in any case,be much less than with conventional rosin fluxes.Unlike water soluable fluxes,this product is not corrosive towards PCB-handling equipment.Special PropertiesBoards soldered with LOCTITE X32-10i pass MIL-P-28809A ionic contamination test without cleaning,provided excess flux is not applied and a clean system and components are used.LOCTITE X32-10i passes the following corrosion tests:USA Copper Mirror Test MIL-F-14256D PassUK Ministry of Defense DTD599-A PassUSA Bellcore TR-TSY-000078PassSurface Insulation ResistanceLOCTITE X32-10i surface insulation resistance test results are shown below.SPECBellcoreTR-TSY-000078BellcoreTA-NWT-000078JIS-Z-3197TempºC353540 Rel Humidity%908590 Time(hour)969696 Voltage5050NONE Test Voltage100100500 Typical SIR(ohms)6.5x1010 3.4x1011 5.2x1010DATA RANGESThe data contained herein may be reported as a typical value and/or a range. Values are based on actual test data and are verified on a periodic basis.GENERAL INFORMATIONFor safe handling information on this product,consult the Material Safety Data Sheet(MSDS).Not for Product SpecificationsThe technical information contained herein is intended for reference only.Please contact Henkel Technologies Technical Service for assistance and recommendations on specifications for this product. Conversions(°C x1.8)+32=°FkV/mm x25.4=V/milmm/25.4=inchesµm/25.4=milN x0.225=lbN/mm x5.71=lb/inN/mm²x145=psiMPa x145=psiN·m x 8.851= lb·inN·m x0.738=lb·ftN·mm x0.142=oz·inmPa·s=cPAmericas Europe Asia +1.888.943.6535 +32.1457.5611 +86.21.3898.4800For the most direct access to local sales and technical support visit:/electronicsDisclaimerNote:The information provided in this Technical Data Sheet(TDS)including the recommendations for use and application of the product are based on our knowledge and experience of the product as at the date of this TDS.The product can have a variety of different applications as well as differing application and working conditions in your environment that are beyond our control.Henkel is,therefore,not liable for the suitability of our product for the production processes and conditions in respect of which you use them,as well as the intended applications and results.We strongly recommend that you carry out your own prior trials to confirm such suitability of our product.Any liability in respect of the information in the Technical Data Sheet or any other written or oral recommendation(s)regarding the concerned product is excluded,except if otherwise explicitly agreed and except in relation to death or personal injury caused by our negligence and any liability under any applicable mandatory product liability law.In case products are delivered by Henkel Belgium NV,Henkel Electronic Materials NV,Henkel Nederland BV,Henkel Technologies France SAS and Henkel France SA please additionally note the following:In case Henkel would be nevertheless held liable,on whatever legal ground,Henkel’s liability will in no event exceed the amount of the concerned delivery.In case products are delivered by Henkel Colombiana,S.A.S.the following disclaimer is applicable:The information provided in this Technical Data Sheet(TDS)including the recommendations for use and application of the product are based on our knowledge and experience of the product as at the date of this TDS.Henkel is,therefore,not liable for the suitability of our product for the production processes and conditions in respect of which you use them,as well as the intended applications and results.We strongly recommend that you carry out your own prior trials to confirm such suitability of our product.Any liability in respect of the information in the Technical Data Sheet or any other written or oral recommendation(s)regarding the concerned product is excluded,except if otherwise explicitly agreed and except in relation to death or personal injury caused by our negligence and any liability under any applicable mandatory product liability law.In case products are delivered by Henkel Corporation,Resin Technology Group,Inc.,or Henkel Canada Corporation,the following disclaimer is applicable:The data contained herein are furnished for information only and are believed to be reliable.We cannot assume responsibility for the results obtained by others over whose methods we have no control.It is the user's responsibility to determine suitability for the user's purpose of any production methods mentioned herein and to adopt such precautions as may be advisable for the protection of property and of persons against any hazards that may be involved in the handling and use thereof.In light of the foregoing,Henkel Corporation specifically disclaims all warranties expressed or implied,including warranties of merchantability or fitness for a particular purpose, arising from sale or use of Henkel Corporation’s products.Henkel Corporation specifically disclaims any liability for consequential or incidental damages of any kind,including lost profits.The discussion herein of various processes or compositions is not to be interpreted as representation that they are free from domination of patents owned by others or as a license under any Henkel Corporation patents that may cover such processes or compositions.We recommend that each prospective user test his proposed application before repetitive use,using this data as a guide.This product may be covered by one or more United States or foreign patents or patent applications.Trademark usageExcept as otherwise noted,all trademarks in this document are trademarks of Henkel Corporation in the U.S.and elsewhere. ®denotes a trademark registered in the U.S.Patent and Trademark Office.Reference0.1Americas Europe Asia +1.888.943.6535 +32.1457.5611 +86.21.3898.4800 For the most direct access to local sales and technical support visit:/electronics。

MOLEX 5055551491卡座连接器 TYPE-C 防水USB 整理表

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503776-5010 5037766010 503776-6010 5037761010 503776-1010 5024261410 502426-1410 5024262010 502426-2010 5024262610 502426-2610 5024263010 502426-3010 5024263410 502426-3410 5024264010 502426-4010 5024264410 502426-4410 5024265010 502426-5010 5024266010 502426-6010 5024267010 502426-7010 5024301410 502430-1410 5024307010 502430-7010 5024302010 502430-2010 5024302610 502430-2610
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标准节螺栓安装指导书说明书

TC6010Tower Crane（self-erecting）Operation Instruction Manual标准节螺栓安装指导书Installation instruction of mast section bolt1、检查螺栓、螺母的配置。

标准配置的螺栓副为一栓、两母、两垫，螺栓为10.9级，螺母为10级，垫圈为300HV 钢结构用高强度平垫。

Check bolt and nuts configuration.The standard configuration bolt vice is one bolt,two nuts,two pads.the bolt is0.9grade,nut is10grade,washer is300HVsteel structure with high-strength flat pad.2、垫圈放置在螺栓头部与连接套之间和螺母与连接套之间，将连接套与螺栓、螺母隔离。

装配时垫圈内倒角的一面应对着螺栓六角头下支撑面与六角头下过渡圆弧贴合，以免出现干涉。

The washer is placed between bolt head and connected sets,between nut and connected set,Take connected set,bolt and nut isolated.3、紧固螺栓副时，应将扭矩扳手的扭矩设定为标准紧固扭矩的80%，按对角方向顺序对螺栓副进行初次紧固，然后再按对角方向顺序以4r/min的紧固速度，将螺栓副紧固到标准扭矩值。

When the bolt vice is tighten,the torque wrench should be set to standard tightening torque of80%,by diagonal direction sequence to initial tighten for bolt vice,And then according to diagonal direction sequence with4r/min of tightening speed to fasten the bolt vice to the standard torque valve.4、采用双螺母防松时，要求用80%标准紧固扭矩先拧紧防松螺母（与垫圈接触，靠近连接套的第一个螺母），在用100%标准紧扭矩拧紧紧固螺母（与第一个螺母接触，靠外的第二个螺母）；这样可使螺母与螺栓的螺纹牙紧密贴合，使两螺母充分并紧，增加有效防松摩擦力，共同达到紧固防松的目的。

某地区某公司对讲电气cad设计图

4200别墅访客对讲二层平面图二层平面图 (SYV-75-5+RVV-2x1.0) PVC25RVV-5x0.5 PVC25说明为室内对讲分机.DF5.图例:4.所有电缆均穿管暗敷在楼板内或墙内.1.所有的埋管的管径均为%%C25.99X601中第153页的要求.讲分机.2.室内对讲分机的安装位置应符合图集3.本图中的室内对讲分机为可视型室内对DF1500上11100330039002400 下上3900210011700N1500DF...... RVV-2x1.0 PVC20隔离器隔离器隔离器第(RVV-5X0.5+RVV-5x1.0) PVC25层一JB-2003电控锁四RVV-5x0.5 PVC25第二层. . . . .层十JB-2003JB-2003第JB-2003JB-2000III门口机电源电源AC220VAC220V3)当8<X<30户时,每二层共用一个电源.2)当4<X<8户时,每五层共用一个电源;(6)在竖井内,对讲系统的设备均合装在一个单元户户访客对讲系统图接线箱内.1. 系统功能2. 系统参数AC220VJB-2003JB-2003RVV-5x0.5PVC25. . . . . . . . 电源1)当X<4户时,每十层共用一个电源;设备的配用原则为(X为每层的用户数):(3)住户拿起室内分机,拔打其他住户分机(1)来访者按下相应的住户号码,室内对讲分机发出铃声,来访者听到门口机的回铃声.(2)住户拿起室内分机与来访者对讲,住户按下自动开锁键,单元楼门上的电控锁打开,来访者进门后,闭门器会自动将门关闭.(1)适用范围:普通型和大厦型楼宇,40层以(3)功耗:待机状态时小于等于300mA,工作(5)一般情况下,每层设置一个隔离器,电源号码,对方听到振铃声,拿起分机与其通话.(2)电源: AC220V,DC12V.状态时

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