Presentation in PCB Process Introduce Read-Only
pcb process
一．ＰCB演变1.1 PCＢ扮演的角色PCB的功能为提供完成第一层级构装的组件与其它必须的电子电路零件接合的基地，以组成一个具特定功能的模块或成品。
所以PCＢ在整个电子产品中，扮演了整合连结总其成所有功能的角色,也因此时常电子产品功能故障时，最先被质疑往往就是PＣB。
图１.1是电子构装层级区分示意。
１．2 PＣB的演变1.早于１9０3年Mr. Ａlｂert Hａｎｓｏｎ首创利用"线路"(Ｃiｒｃuｉt)观念应用于电话交换机系统。
它是用金属箔予以切割成线路导体,将之黏着于石蜡纸上，上面同样贴上一层石蜡纸，成了现今ＰCB的机构雏型。
见图1.2ﻫ2. 至１9３６年,Dr Paul Eiｓnｅｒ真正发明了PＣB的制作技术，也发表多项专利。
而今日之ｐｒint-etch(phｏtoimaｇe tｒansfｅｒ)的技术，就是沿袭其发明而来的。
1.3 PCB种类及制法ﻫ在材料、层次、制程上的多样化以适合不同的电子产品及其特殊需求。
以下就归纳一些通用的区别办法,来简单介绍ＰCＢ的分类以及它的制造方法。
1.3．1 ＰCB种类A. 以材质分a. 有机材质ﻫ酚醛树脂、玻璃纤维/环氧树脂、Pｏlyｉmide、ＢT/Ｅpoｘy等皆属之。
b. 无机材质铝、Copper-inｖａr-copper、cerａmic等皆属之。
主要取其散热功能ﻫ B. 以成品软硬区分a. 硬板 Rｉｇiｄ PCBb.软板 Flexｉblｅ PCＢ见图1．3 ﻫc.软硬板 Rigid－Fｌex ＰＣB 见图1．4ﻫＣ. 以结构分ﻫａ.单面板见图1.5 ﻫb．双面板见图1.6ﻫ c.多层板见图１.7Ｄ. 依用途分：通信/耗用性电子／军用/计算机/半导体/电测板…,见图1．8 BGＡ.另有一种射出成型的立体ＰCB,因使用少,不在此介绍。
１.３．2制造方法介绍ﻫ A. 减除法，其流程见图１．９Ｂ. 加成法,又可分半加成与全加成法,见图1.101.1１ﻫ C. 尚有其它因应IC封装的变革延伸而出的一些先进制程，本光盘仅提及但不详加介绍,因有许多尚属机密也不易取得，或者成熟度尚不够。
PCB Process Introduction
壓 合(1)
Lamination
將內層板及P.P膠片覆蓋銅皮經預疊熱壓完成 將內層板及P.P膠片覆蓋銅皮經預疊熱壓完成
脫膜紙漿(牛皮紙
)
鋼板:：主要是均勻分佈
熱量，因各冊中之各層上 銅量分佈不均，無銅處傳 熱很慢，如果受熱不均 勻會造成數脂之硬化不 均，會造成板彎板翹
上鋼板 銅 箔 膠 內 膠 片 層 片
第一次電鍍銅(一銅 第一次電鍍銅 一銅) 一銅
(Panel plating)
整板面電鍍一次銅，銅厚約為0.4mil 整板面電鍍一次銅，銅厚約為0.4mil
整板面電鍍，所有孔亦會被電鍍上 銅(不分PTH以及NPTH) ( PTH NPTH)
外層影像轉移
乾膜 壓 膜 Dry Film
曝
光
將外層底片圖案以影像轉移到感光乾膜上
蝕刻
Copper Etching
蝕刻：蝕刻液的化學成份、溫度、氯化銅 pH 值及輸送速度 等，皆會對光阻膜的性能造成考驗。
內層蝕刻
將裸露銅面以蝕刻藥水去掉留己曝光乾膜圖案
內層線路
內
層
內層去膜
將己曝光圖案上的乾膜以去膜藥水去掉
內層線路 Inner Layer Trace 內 層
內層沖孔
內層鑽孔對位孔及鉚合孔以光學校位沖出
防焊顯影烘烤
將防焊非曝光區以顯影液去掉防焊油墨裸露圖案後烘烤
防焊圖案
化金、鍍金手指 Gold Finger
噴
錫
將裸露銅面及孔內以噴錫著附一層錫面
錫 面
Hot Air Solder Leveling
印文字 Print
以印刷方式將文字字體印在相對位對區
C11 C1
文 字 Silk Legend
2024扬州英语中考试卷
2024年江苏省扬州市中考英语考前模拟测试注意事项：1.全卷满分120分。
考试时间为100分钟。
试题包含选择题和非选择题。
考生答题全部答在答题卡上,答在本试卷上无效。
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3.答选择题必须用2B铅笔将答题卡上对应的答案标号涂黑。
如需改动,请用橡皮擦干净后,再选涂其他答案。
答非选择题必须用0.5毫米黑色墨水签字笔写在答题卡的指定位置,在其他位置答题一律无效。
第I卷（选择题共60分）一、单项选择（本题共15小题；每题1分，满分15分）在下列各题A、B、C、D四个选项中选择一个能填入题干空白处的最佳答案。
1．—________great progress Li Ming has made during the past few weeks!—Yes.That’s all because of his hard work.A．What a B．How a C．What D．How2．The astronauts of Shenzhou-18manned spaceship entered China’s space station early________April26,2024.A．in B．at C．on D．to3．The course of life never runs smoothly________it is full of ups and downs.A．though B．since C．while D．unless4．—Which of the two books will you take?—I’ll take________,science book interests me while comic book makes me relaxed.A．both B．neither C．all D．none5．What a pity!________,I believe you will succeed someday!A．Instead B．Moreover C．Anyway D．Otherwise6．—What a pity!A4-year-old boy was hit by a truck when playing by the road.—I agree that,to parents,children’s safety________be paid too much attention to.A．mustn’t B．can’t C．needn’t D．shouldn’t7．The novel was so attractive that he read it for hours________he realized it.A．before B．after C．while D．as soon as8．Lucy is not so quick,but she has a good habit of working hard,it is like a hidden________ A．tradition B．treasure C．competition D．influence9．Students should be________to form good working habits through labour education.A．forced B．encouraged C．warned D．promised10．Physical work plays an important role in developing students’view of the world and life.That’s why we need to________labour education at school.A．work on B．work out C．carry on D．carry out11．—Why are you so angry?—Look!Someone has________my parking space.A．put up B．taken up C．stayed up D．turned up12．Nearly________of the task________completed by us.We worked closely.A．three-fifth;was B．three-fifths;wasC．third-fifths;were D．third-fifth;were13．—I’ve just heard that Jackie achieved high grades in the Maths exam.—That’s no surprise.He is________,you know.A．a dark horse B．a green hand C．an early bird D．a wet blanket14．—Come on,Cathy.Just________.Nothing can beat me.—Well,to tell you the truth,you’re laid off(解雇).A．be brave B．take your time C．come to the point D．be confident15．—Paris Olympic Games will take place in July,2024.The organizer has announced________.—Oh,on the River Seine.At least600,000viewers can attend it.A．where will the opening ceremony be heldB．where the opening ceremony will be heldC．when viewers would attend the opening ceremonyD．when viewers will attend the opening ceremony二、完形填空（共15小题：每小题1分，计15分）阅读下面短文，从文后各题所给的A、B、C、D四个选项中选出一个最佳答案。
电路板业务销售的流程
电路板业务销售的流程英文回答：PCB Sales Process.The printed circuit board (PCB) sales process is amulti-step process that involves several key steps:1. Lead Generation: The first step in the PCB sales process is to generate leads. This can be done through a variety of channels, such as trade shows, online marketing, and referrals.2. Qualifying Leads: Once you have generated leads, you need to qualify them to determine which ones are mostlikely to convert into sales. This involves askingquestions to determine the lead's needs, budget, and timeline.3. Proposal Development: Once you have qualified a lead,you need to develop a proposal that outlines your solution and pricing. The proposal should be clear, concise, and persuasive.4. Negotiation: Once you have submitted your proposal, you may need to negotiate with the lead to reach an agreement on price and terms.5. Order Fulfillment: Once you have closed the deal,you need to fulfill the order by manufacturing anddelivering the PCBs.6. Customer Service: After the PCBs have been delivered, you need to provide excellent customer service to ensurethat the customer is satisfied.中文回答：PCB 销售流程。
PCB中英日全流程图片及解说
12345678910开料内层涂布内层曝光显影蚀刻去膜AOI 检查棕化组合压合将大张基板按客户资料要求尺寸裁切成所需之Working PNL.在基板表面均匀涂上一层感光油墨.利用油墨感旋旋光性,透过紫外光照射,使油墨单体变成聚合体,实现影像转移根据油墨抗酸不抗碱之特性,将未曝光之单体油墨显影掉,露出不需要部分的铜将所露出的铜用蚀刻的方式去除．利用强碱,把剩余的聚合体油墨剥离掉,得到完整的内层板扫描板子表面缺陷,以客户提供数据为母板数据与现有板作比较,如有不符,AOI会以一个缺点记录下来为了增加压合时与PP的结合力而进行的表面处理(棕化).用PP、内层板、铜箔重叠组合为了形成多层板将组合好之板进行积层热压.流程Process プロセス产品样本Product sample 制品サンプル目的Purpose目的工序图片Picture 工程写真线路板制造流程说明NO. Item.11121314151617181920钻钯捞边钻孔电镀外层压膜外层曝光外层显影电镀去膜蚀刻在压合后钻定位用的靶位孔.压合完后把基板周围不需要的部分用机器进行切割．钻孔是在基板上按客户资料，钻出所需的孔，使基板上下导通及便于上插件使用。
在基板表面及孔内按要求镀上所需的铜厚，使基板内外层线路导通。
为使图形的形成在基板表面覆盖感旋旋光性干膜．曝光就是用底片（菲林）通过UV 光或紫外线的照射将感旋旋光性干膜由单体变为聚合体，起影像转移的作用。
将曝光时未感光的感旋旋光性干膜部分用药水洗掉。
为保护经显影后所露出的铜面不被蚀刻掉,在铜面上镀上一层锡．剥膜是将残留在基板上的干膜用药水剥掉。
蚀刻是将已剥掉的干膜下的铜用药水咬蚀掉。
2122232425262728293031剥锡中测检查防焊印刷防焊曝光防焊显影文字印刷成型电测外观检查表面处理（OSP）包装最后将基板铜面上的锡用药水（剥锡液）剥掉，外层线路就显现出来了.中测检查就是用AOI及VRS机器对外层线路的质量进行检测防焊印刷就是将板面印上一层油墨，其作用为：绝缘，美观,保护线路之作用.曝光就是用底片通过UV光或紫外线的照射将油墨由单体变为聚合体，起影像转移的作用.显影就是将曝光后已硬化的防焊油墨用药水进行洗掉.为了客户在成品板上插零件时的辨别，在基板上进行与零件相对应的文字印刷.用成型机依照客户要求之规定的成型尺寸进行切割．电测就是对成品板的功能性质量进行检测，如开路,短路等.以目视的方式对成品板外观的质量进行检查确认．在成品板上的铜面上及孔内露铜部分生成一层抗氧化保护膜．包装就是将成品板用包装袋进行包装，可使成品板放置时间较长.。
PCB印制电路板工序中英文结合 PPT资料共40页
深圳市赛格瑞有限公司 SOGRACE TECHNOLOGY CO.LTD
products
Auto-Exposure Machine
before
after
01 内层线路（Inner layer）
DES显影，蚀刻，去膜连线
The so called DES are Developing,Etching,Strip
深圳市赛格瑞有限公司 SOGRACE TECHNOLOGY CO.LTD
目的：通过显影药水冲掉未发生化学反应的 干膜，利用蚀刻药液 冲掉显影后露出的铜， 利用强碱冲掉发生化学反应形成的抗蚀层， 目的都是为了显出内层电路图形
Aim: remove dry film by K2CO3 remove nude copper by CuCl2 remove anti-corrosion board by NaOH
也就是说，PCB是为完成第一层次的元件和其它电子电路零件接合提供的一个 组装基地，组装成一个具特定功能的模块或产品。
PCB 印制电路板
深圳市联合益佰有限公司 SOGRACE TECHNOLOGY CO.LTD
PCB 的用途(application of PCB)
有特定功能的电子产品都需要电路板才能实现如电视机，电子玩具，收音机， 电脑, 手机，仪表器 或者一些军用的设施等 (Most electronic products requires PCB to rechieve some paticular fuctions, like televisions, electronic toys, radios,Computers, mobile phones, meters oand som military facilities)
PCB ----PCB Process Introduction 02
電路板的應用
隨著數位化工業的急速發展，刺激了PCB 的量產化，由早期的電子產品，發展到電子計 算機、電腦、筆記型電腦、電子交換機、手機 等高階的產品。 PCB用在商品上較大宗且為人知的有 大類﹕ 用在商品上較大宗且為人知的有3 PCB用在商品上較大宗且為人知的有3大類﹕ 資訊類﹕超大型電腦、微電腦、電腦輔助設計 1. 資訊類 生產系統、筆記型電腦、汽車控制系統等 通訊類﹕手機、通訊網絡系統、網際網絡、數 2. 通訊類 據機等 消費產品﹕電動玩具、電視機、錄放影機、影 3. 消費產品 印機、照像機等
PSR4000(一般)和Ciba PR77(霧面)
成品表面處理說明
面未覆蓋S/M的銅面 需要進行表面處理來保證銅面不被氧化及保 的銅面,需要進行表面處理來保證銅面不被氧化及保 成品表面未覆蓋 的銅面 證焊墊的銲錫性能,以下是幾種常見的類型 以下是幾種常見的類型: 證焊墊的銲錫性能 以下是幾種常見的類型 HASL, G/F,OSP,IMG,SSP HASL: Hot Air Solder Level, 噴錫 噴錫(Pb/Sn), 焊錫性好 環境要求不高，但表面平整度 焊錫性好, 環境要求不高，
PCB制程介紹
華通電腦（惠州） June, 2003
電路板進化史
PCB(Printed Circuit Board）中文稱為印刷 電路板，也有稱為PWB（Printed Wiring Board）印 刷線路板。它取代1940年代前，電器產品以銅線配 電的方式，使大量生產復制速度加快，產品體積得 以縮小。 早期的電路板是將金屬熔融覆蓋于絕緣板表 面，作出線路。1936年以後轉向將覆蓋有金屬的絕 緣基板以耐蝕油墨作區域選別，將不要的區域蝕刻 去除，叫做“Print & Etch”。 1960年以後，電唱機/錄音機/錄影機等產品 市場，陸續采用了“雙面貫通孔”的電路板制造技 術，于是耐熱及尺寸安定的“環氧樹脂基板”被大 量采用，至今仍為電路板的主要樹脂基材。
丝网印刷 (毕业设计论文)
南京信息职业技术学院毕业设计(论文)说明书作者赵建龙学号********系部微电子学院专业电子电路设计与工艺题目丝网印刷技术在PCB生产中应用指导教师陈和祥评阅教师完成时间：2010 年 4 月25日毕业设计(论文)中文摘要毕业设计(论文)外文摘要目录1 引言2 丝网印刷的原理3 丝网印刷的治工具3.1 网版3.2 刮刀3.3 油墨4 丝网印刷在印制电路板中的应用4.1 线路的印刷4.2 阻焊膜印刷4.3 文字印刷4.4 全自动印刷银跳线板流程4.5 全自动印刷双面板板流程5 丝网印刷常见问题及对策5.1 线路印刷常见问题5.2 阻焊膜印刷常见问题结论致谢参考文献1 引言印制电路板是指在绝缘基材上，按预定设计制成印制线路、印制元件或由两者结合而成的导电图形在绝缘基材上。
提供元器件之间电气连接的导电图形，称为印制线路。
印制电路或者印制线路的成品板称为印制电路板，英文名称是Printed ckcuit Board，缩写是PCB。
印制电路板是电子工业的重要部件之一。
印制电路板(PCB)是电子及其它一些高新技术领域中最主要的电子部件，应用非常广泛，几乎每种电子设备，小到电子手表、计算器，大到计算机、通讯电子设备、军用武器系统。
只要有集成电路等电子元器件．为了电气互连，都要使用印制板。
丝网印刷是大批量印刷电路板最常用的方法之一。
近年来，随着丝网印刷技术和设备的不断提高，使丝网印刷与电子行业的联系更为密切，从而形成了电子丝网印刷的新领域。
随着用于PCB行业的新型网印材料、网印工艺及检测设备日臻完善，使得当前的网印工艺技术也必须不断提高以适应高密度的PCB生产。
由于印制线路板和其他丝网印刷在技术和材料等方面存在很多差异，因此要充分了解丝网印刷和印制线路板的特性、掌握印刷技巧、注意故障的分析处理，才能保证印制线路板的质量。
2 丝网印刷的原理丝网印刷具有成本低、操作简单、生产效率高、印料种类多等特点，被广泛应用于印制电路和厚膜集成电路的制造中。
pcba工艺流程介绍大纲
pcba工艺流程介绍大纲英文回答：Introduction:PCBA (Printed Circuit Board Assembly) is a crucial process in the manufacturing of electronic devices. It involves the assembly of electronic components onto aprinted circuit board (PCB) to create a functionalelectronic system. The PCBA process consists of several steps, including component placement, soldering, inspection, and testing. In this article, I will provide an outline of the PCBA process.Component Placement:The first step in the PCBA process is component placement. This involves placing electronic components,such as resistors, capacitors, and integrated circuits,onto the PCB according to the design specifications. Thecomponents can be placed manually or by using automated pick-and-place machines. The goal is to ensure the accurate and precise placement of components on the PCB.Soldering:Once the components are placed on the PCB, the next step is soldering. Soldering is the process of joining the components to the PCB using solder. There are various soldering techniques, including wave soldering, reflow soldering, and hand soldering. Wave soldering is commonly used for through-hole components, while reflow soldering is used for surface mount components. Hand soldering is typically done for components that cannot be soldered using automated methods. The soldering process ensures a reliable electrical and mechanical connection between the components and the PCB.Inspection:After soldering, the PCB goes through an inspection process to check for any defects or errors. This is done toensure the quality and reliability of the assembled PCB. Various inspection techniques, such as visual inspection, automated optical inspection (AOI), and X-ray inspection, can be used to detect defects such as solder bridges, missing components, or misaligned components. Any defects found during the inspection process are rectified before proceeding to the next step.Testing:Once the PCB has passed the inspection process, it undergoes testing to ensure its functionality. Testing involves applying electrical signals to the PCB and checking if the desired output is obtained. Functional testing, boundary scan testing, and in-circuit testing are some of the commonly used testing methods. The goal is to verify that the assembled PCB meets the required performance specifications.Packaging and Shipping:After the PCB has been tested and verified, it is readyfor packaging and shipping. Packaging involves protecting the PCB from physical damage during transportation. This can be done by using anti-static bags, foam inserts, or custom packaging solutions. Once packaged, the PCB is ready to be shipped to the customer or the next stage of the manufacturing process.中文回答：简介：PCBA（Printed Circuit Board Assembly，印刷电路板组装）是电子设备制造过程中的关键环节。
中英文对照PCB生产流程常用术语
中英文对照PCB生产流程常用术语A. 开料( Cut Lamination)a-1 裁板( Sheets Cutting)a-2 原物料发料(Panel)(Shear material to Size)B. 钻孔(Drilling)b-1 内钻(Inner Layer Drilling )b-2 一次孔(Outer Layer Drilling )b-3 二次孔(2nd Drilling)b-4 雷射钻孔(Laser Drilling )(Laser Ablation )b-5 盲(埋)孔钻孔(Blind & Buried Hole Drilling)C. 干膜制程( Photo Process(D/F))c-1 前处理(Pretreatment)c-2 压膜(Dry Film Lamination)c-3 曝光(Exposure)c-4 显影(Developing)c-5 蚀铜(Etching)c-6 去膜(Stripping)c-7 初检( Touch-up)c-8 化学前处理,化学研磨( Chemical Milling )c-9 选择性浸金压膜(Selective Gold Dry Film Lamination) c-10 显影(Developing )c-11 去膜(Stripping )Developing , Etching & Stripping ( DES )D. 压合Laminationd-1 黑化(Black Oxide Treatment)d-2 微蚀(Microetching)d-3 铆钉组合(eyelet )d-4 叠板(Lay up)d-5 压合(Lamination)d-6 后处理(Post Treatment)d-7 黑氧化( Black Oxide Removal )d-8 铣靶(spot face)d-9 去溢胶(resin flush removal)E. 减铜(Copper Reduction)e-1 薄化铜(Copper Reduction)F. 电镀(Horizontal Electrolytic Plating)f-1 水平电镀(Horizontal Electro-Plating) (Panel Plating) f-2 锡铅电镀( Tin-Lead Plating ) (Pattern Plating)f-3 低于1 mil ( Less than 1 mil Thickness )f-4 高于1 mil ( More than 1 mil Thickness)f-5 砂带研磨(Belt Sanding)f-6 剥锡铅( Tin-Lead Stripping)f-7 微切片( Microsection)G. 塞孔(Plug Hole)g-1 印刷( Ink Print )g-2 预烤(Precure)g-3 表面刷磨(Scrub)g-4 后烘烤(Postcure)H. 防焊(绿漆/绿油): (Solder Mask)h-1 C面印刷(Printing Top Side)h-2 S面印刷(Printing Bottom Side)h-3 静电喷涂(Spray Coating)h-4 前处理(Pretreatment)h-5 预烤(Precure)h-6 曝光(Exposure)h-7 显影(Develop)h-8 后烘烤(Postcure)h-9 UV烘烤(UV Cure)h-10 文字印刷( Printing of Legend )h-11 喷砂( Pumice)(Wet Blasting)h-12 印可剥离防焊(Peelable Solder Mask)I . 镀金Gold platingi-1 金手指镀镍金( Gold Finger )i-2 电镀软金(Soft Ni/Au Plating)i-3 浸镍金( Immersion Ni/Au) (Electroless Ni/Au)J. 喷锡(Hot Air Solder Leveling)j-1 水平喷锡(Horizontal Hot Air Solder Leveling)j-2 垂直喷锡( Vertical Hot Air Solder Leveling)j-3 超级焊锡(Super Solder )j-4. 印焊锡突点(Solder Bump)K. 成型(Profile)(Form)k-1 捞型(N/C Routing ) (Milling)k-2 模具冲(Punch)k-3 板面清洗烘烤(Cleaning & Backing)k-4 V型槽( V-Cut)(V-Scoring)k-5 金手指斜边( Beveling of G/F)L. 开短路测试(Electrical Testing) (Continuity & Insulation Testing) l-1 AOI 光学检查( AOI Inspection)l-2 VRS 目检(Verified & Repaired)l-3 泛用型治具测试(Universal Tester)l-4 专用治具测试(Dedicated Tester)l-5 飞针测试(Flying Probe)M. 终检( Final Visual Inspection)m-1 压板翘( Warpage Remove)m-2 X-OUT 印刷(X-Out Marking)m-3 包装及出货(Packing & shipping)m-4 目检( Visual Inspection)m-5 清洗及烘烤( Final Clean & Baking)m-6 护铜剂(ENTEK Cu-106A)(OSP)m-7 离子残余量测试(Ionic Contamination Test )(Cleanliness Test)m-8 冷热冲击试验(Thermal cycling Testing)m-9 焊锡性试验( Solderability Testing )N. 雷射钻孔(Laser Ablation)N-1 雷射钻Tooling孔(Laser ablation Tooling Hole)N-2 雷射曝光对位孔(Laser Ablation Registration Hole)N-3 雷射Mask制作(Laser Mask)N-4 雷射钻孔(Laser Ablation)N-5 AOI 检查及VRS ( AOI Inspection & Verified & Repaired) N-6 Blaser AOI (after Desmear and Microetching)N-7 除胶渣(Desmear)N-8 微蚀(Microetching )流程简介：开料Cut Lamination－－钻孔Drilling－－干膜制程Photo Process(D/F)－－压合Lamination－－减铜Copper Reduction－－电镀Horizontal Electrolytic Plating－－塞孔Plug Hole－－防焊(绿漆/绿油)SolderMask－－镀金Gold plating－－喷锡Hot Air Solder Leveling－－成型Profile－－开短路测试ElectricalTesting－－终检Final Visual Inspectionpcb电路板又称印制电路板、印刷线路板，简称印制板，英文简称PCB(printed circuit board )或PWB(printed wiring board)，以绝缘板为基材，切成一定尺寸，其上至少附有一个导电图形，并布有孔（如元件孔、紧固孔、金属化孔等），用来代替以往装置电子元器件的底盘，并实现电子元器件之间的相互连接。
PCB电路板步骤流程外贸英文翻译
PCB电路板步骤流程外贸英文翻译Process说明:A. 下料( Cut Lamination)a-1 裁板( Sheets Cutting)a-2 原物料发料(Panel)(Shear material to Size) B. 钻孔(Drilling) b-1 内钻(Inner Layer Drilling )b-2 一次孔(Outer Layer Drilling )b-3 二次孔(2nd Drilling)b-4 雷射钻孔(Laser Drilling )(Laser Ablation )b-5 盲(埋)孔钻孔(Blind & Buried Hole Drilling) C. 乾膜制程( Photo Process(D/F))c-1 前处理(Pretreatment)c-2 压膜(Dry Film Lamination)c-3 曝光(Exposure)c-4 显影(Developing)c-5 蚀铜(Etching)c-6 去膜(Stripping)c-7 初检( Touch-up)c-8 化学前处理,化学研磨( Chemical Milling )c-9 选择性浸金压膜(Selective Gold Dry Film Lamination)c-10 显影(Developing )c-11 去膜(Stripping )D. 压合Laminationd-1 黑化(Black Oxide Treatment)d-2 微蚀(Microetching)d-3 铆钉组合(eyelet )d-4 叠板(Lay up)d-5 压合(Lamination)d-6 后处理(Post Treatment)d-7 黑氧化( Black Oxide Removal )d-8 铣靶(spot face)d-9 去溢胶(resin flush removal)E. 减铜(Copper Reduction)e-1 薄化铜(Copper Reduction)F. 电镀(Horizontal Electrolytic Plating)f-1 水平电镀(Horizontal Electro-Plating) (Panel Plating) f-2 锡铅电镀( Tin-Lead Plating ) (Pattern Plating)f-3 低於1 mil ( Less than 1 mil Thickness )f-4 高於1 mil ( More than 1 mil Thickness)f-5 砂带研磨(Belt Sanding)f-6 剥锡铅( Tin-Lead Stripping)f-7 微切片( Microsection)G. 塞孔(Plug Hole)g-1 印刷( Ink Print )g-2 预烤(Precure)g-3 表面刷磨(Scrub)g-4 后烘烤(Postcure)H. 防焊(绿漆): (Solder Mask)h-1 C面印刷(Printing Top Side)h-2 S面印刷(Printing Bottom Side)h-3 静电喷涂(Spray Coating)h-4 前处理(Pretreatment)h-5 预烤(Precure)h-6 曝光(Exposure)h-7 显影(Develop)h-8 后烘烤(Postcure)h-9 UV烘烤(UV Cure)h-10 文字印刷( Printing of Legend )h-11 喷砂( Pumice)(Wet Blasting)h-12 印可剥离防焊(Peelable Solder Mask)I . 镀金Gold platingi-1 金手指镀镍金( Gold Finger )i-2 电镀软金(Soft Ni/Au Plating)i-3 浸镍金( Immersion Ni/Au) (Electroless Ni/Au)J. 喷锡(Hot Air Solder Leveling)j-1 水平喷锡(Horizontal Hot Air Solder Leveling)j-2 垂直喷锡( Vertical Hot Air Solder Leveling)j-3 超级焊锡(Super Solder )j-4. 印焊锡突点(Solder Bump)K. 成型(Profile)(Form)k-1 捞型(N/C Routing ) (Milling)k-2 模具冲(Punch)k-3 板面清洗烘烤(Cleaning & Backing)k-4 V型槽( V-Cut)(V-Scoring)k-5 金手指斜边( Beveling of G/F)L. 短断路测试(Electrical Testing) (Continuity & Insulation Testing) l-1 AOI 光学检查( AOI Inspection)l-2 VRS 目检(Verified & Repaired)l-3 泛用型治具测试(Universal Tester)l-4 专用治具测试(Dedicated Tester)l-5 飞针测试(Flying Probe)M. 终检( Final Visual Inspection)m-1 压板翘( Warpage Remove)m-2 X-OUT 印刷(X-Out Marking)m-3 包装及出货 (Packing & shipping)。
pcb生产流程培训英文版
pcb生产流程培训英文版Here is the English essay on the topic of "PCB production process training" with a word count of over 1000 words:The production of printed circuit boards (PCBs) is a crucial process in the electronics industry, as these components serve as the backbone for a wide range of electronic devices, from smartphones to industrial equipment. Ensuring the proper training and understanding of the PCB production process is essential for maintaining high standards of quality and efficiency. In this essay, we will delve into the various stages of the PCB production process, providing a comprehensive overview for trainees and professionals alike.The first step in the PCB production process is the design phase. This involves the creation of a digital schematic or layout, which outlines the placement and interconnections of the various components that will be mounted on the board. The design phase requires a thorough understanding of electrical engineering principles, as well as the specific requirements and constraints of the intended application. Designers must consider factors such as component size, heat dissipation, and signal routing to ensure the PCB will function asintended.Once the design is complete, the next step is the fabrication of the PCB itself. This process begins with the creation of the base material, which is typically a thin, rigid substrate made of fiberglass or other insulating materials. The substrate is then coated with a thin layer of copper, which will serve as the conductive pathways for the electronic components. The copper layer is then etched away, leaving behind the desired circuit patterns.After the basic PCB structure has been created, the next step is the drilling process. This involves the use of specialized machinery to create the necessary holes and vias that will allow the components to be mounted and interconnected. The drilling process must be carried out with a high degree of precision, as the placement and size of these holes can have a significant impact on the overall performance and reliability of the PCB.Following the drilling process, the PCB undergoes a series of cleaning and preparation steps to ensure that the surface is ready for the next stage of production. This may include the application of a solder mask, which is a protective coating that helps to prevent short circuits and corrosion, as well as the application of a surface finish, such as gold or tin, to improve the solderability of the board.Once the PCB has been prepared, the next step is the component placement and soldering process. This involves the use of specialized equipment, such as pick-and-place machines, to accurately position the various electronic components on the board. The components are then secured in place using a process called soldering, which involves the melting of a metal alloy to create a strong, conductive bond between the component and the PCB.After the component placement and soldering process, the PCB undergoes a series of quality control checks to ensure that it meets the required standards for performance and reliability. This may include visual inspections, electrical testing, and even more advanced techniques such as automated optical inspection (AOI) and X-ray analysis.Finally, the completed PCB is packaged and prepared for shipment to the end customer. This may involve the addition of protective coatings, the installation of connectors or other hardware, and the labeling and documentation of the PCB.Throughout the entire PCB production process, it is essential that workers and trainees receive comprehensive training on the various techniques and equipment involved. This training should cover not only the practical aspects of the production process, but also the underlying principles and best practices that guide the industry. Byensuring that all personnel involved in the PCB production process are well-trained and knowledgeable, companies can ensure that their products meet the highest standards of quality and reliability.In conclusion, the PCB production process is a complex and multifaceted endeavor that requires a deep understanding of electrical engineering, materials science, and manufacturing techniques. By providing comprehensive training to all personnel involved in the process, companies can ensure that their PCBs are produced to the highest possible standards, helping to drive innovation and advancement in the electronics industry.。
pcb生产流程的理解
pcb生产流程的理解英文回答：PCB Production Process.The PCB production process involves several sequential steps, each playing a critical role in creating afunctional and reliable printed circuit board. The primary stages of the process include:1. Design: The initial phase involves designing the PCB layout using specialized software. Designers consider factors such as component placement, signal routing, and power distribution.2. Artwork Generation: Once the design is finalized, artwork files are created representing the PCB's structure. These files serve as instructions for subsequent production steps.3. Photolithography: The artwork files are used to create a photomask, which is a transparent film with opaque areas representing the copper traces on the board. The photomask is placed over a copper-coated board, and ultraviolet light is used to expose the copper through the transparent areas.4. Etching: The exposed copper is then removed using an etching process, leaving behind the desired copper traces.5. Drilling: Holes are drilled into the board for component placement and through-hole connections.6. Lamination: A solder mask is applied to prevent solder from bridging between traces, and a silkscreen is used to label components and provide other markings.7. Solder Paste Application: Solder paste is applied to the pads where components will be placed.8. Component Placement: Components are placed onto the board using a pick-and-place machine.9. Reflow Soldering: The board is heated to a temperature that melts the solder paste, forming electrical connections between the components and the PCB.10. Inspection and Testing: The finished PCB undergoes thorough inspection and testing to ensure functionality and reliability.中文回答：PCB 生产流程。
CB印刷电路板制程介绍
2. 内层线路制作(压膜)
典型多层板制作流程
3. 内层线路制作(曝光)
4. 内层线路制作(显影)
典型多层板制作流程
5. 内层线路制作(蚀刻)
6. 内层线路制作(去膜)
典型多层板制作流程
7. 迭板
LAYER 1 LAYER 2 LAYER 3 LAYER 4 LAYER 5 LAYER 6
WORKING A/W
程式带
PROGRAM
制作规 范
RUN CARD
网版制作
STENCIL
钻孔,成型机
D. N. C.
多层板内层流程
INNER LAYER PRODUCT
Blinded Via
雷射钻孔
LASER ABLATION
(2)多层板内层制作流程
裁板
LAMINATE SHEAR
MLB 内层干膜
典型多层板制作流程
15. 浸金(喷锡……)制作
干膜制作流程
基板
壓膜
壓膜後
曝光 去膜
顯影
蝕銅
COMP S0LD. COMP S0LD.
典型之多层板迭板及压合结构
压合机之热板
迭合用之钢板
CpOrPePpErRegFOIL 0.5 OZ
TphrienprCeogre ,FR-4
Thin Core ,FR-4 prepreg
外层干膜
OUTERLAYER IMAGE
TENTING 二次铜及锡铅电镀
PROCESS
PATTERN PLATING
蚀铜
O/L ETCHING
检查
INSPECTION
通孔电镀
E-LESS CU
电路板PCB制程说明-说课稿
印刷電路板生產流程介紹11
代號 製程名稱
作業說明
圖示
F15 外層影像 表面刷磨處理，增加乾 轉移 前處 膜附著力
理r
F15 外層貼膜 於PTH後表面刷磨清潔 產流程介紹12
代號 製程名稱
作業說明
圖示
F15 外層曝光 分以手動或自動曝光機 生產
Ａ/W
機台圖示
F15 外層顯影
6
1.2 印刷電路板介紹
於電力的應用過程，有一必要條件，即電需透過 連接各種器材(Device)或元件的迴路才可產生功能， 一個迴路中往往需連接很多不同的元件以完成我們所 需的效果。
傳統費時的接線作業被發展為印刷電路板，印刷 電路板能提供一元件與元件間線路相互連接的方法， 而基板又能做為元件與導線之支架，且易於利用機械 生產，因此許多相同線路的電路板都可以以相同的方 法製造。
F47 曝光
以底片及曝光機將影像 移轉至板面。底片明區 經由UV曝光後將聚合 反應。
機台圖示
41
印刷電路板生產流程介紹18
代號 製程名稱
作業說明
圖示
F47 顯影
以碳酸鈉溶液將板面未 聚合之油墨去除後水洗 清潔。即SMD、G/F及 Pad上之綠漆去除
F47 後烘烤
以烘箱高溫將綠漆完全 烘乾附著於板面。
錫面
機台圖示
37
印刷電路板生產流程介紹14
代號 製程名稱
作業說明
圖示
F35 外層干膜 剝膜
以氫氧化鈉溶液將板面 殘留之乾膜全部去除。
F35 外層蝕銅
將乾膜剝除後之底銅(未 被錫覆蓋)，以蝕刻液將 底銅咬蝕去除
機台圖示
38
印刷電路板生產流程介紹15
代號 製程名稱
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印刷电路板
印刷电路板简称PCB
(Printed Circuit Board)
广泛应用于家用电器、汽车、
通讯器材等各行业
印刷电路板的种类
按层数分：
单层板 • 单面有线路 • 没有通导孔 双层板 • 双面有线路 • 有通导孔连接两面线路 多层板 • 多面有线路 • 有通导孔连接多面线路
PCB板的外观
PRE - PRODUCTION
生产前工程
PLANNING 策 划 部
CAM 电脑辅助设计与制造 ARTWORK GENERATION 底片生产
MATERIAL PREPARATION 原料预备
PANEL CUTTING 裁板 EDGE GRINDING 磨边 MATERIAL BAKING 烘烤 STACKING & PINNING 定位鉆孔
PACKING 包装
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感谢你的参与
END
PHOTO IMAGING 感光影像
PRE-TREATMENT 生产前清理程序 LAMINATION 压膜 EXPOSURE 曝光 DEVELOPING 显像
PATTERN PLATING 缐路电镀
PRE-TREATMENT 生产前清理程序 ELECTROLYTIC COPPER 电解镀铜 TIN/LEAD PLATING 电镀锡/铅
STRIP/ETCH 剝除/蚀刻
STRIP PHOTO RESIST 剝除感光阻剂 ETCH COPPER 蚀刻 STRIP TIN/LEAD 剝除锡/铅
SOLDER MASK 防焊膜
PRE-TREATMENT 生产前清理程序 COATING 涂膜 EXPOSURE 曝光 DEVELOPING 显像
多层板内层流程
LAY-UP 叠板 LAMINATION 压合
DRILLING 鉆孔
DRILL PREPARATION 鉆針预备 CNC DRILLING 数值控制钻孔程序
ELECTROLESS COPPER 无电镀铜
DE-BURR 去毛头 DE- SMEAR 去胶渣 PTH 通导孔
INNER LAYER PRODUCT 多层板内层流程
PRE-TREATMENT 生产前清理程序 LAMINATION 压膜
多层板内层流程
EXPOSURE 曝光 DEVELOPING 显影
多层板内层流程
ETCHING 蚀铜 STRIPPING 去膜 AOI INSPECTION 自动光学检测 OXIDE 棕化处理
TESTING & INSPECTION 测试与检验
• ELECTRICAL TESTING 电路测试 • AOI 自动光学检验
FINAL QA 最终品质控制
• AQL INSPECTION 检验规划 • VISUAL INSPECTION (100%) 视觉检验规划
LAST PROCESS 最后程序
HOT AIR LEVELLING 喷锡
PRE-TREATMENT 生产前清理程序 HOT AIR LEVELLING 喷锡 POST-TREATMENT 生产后清理程序
ROUTING 切外型
V-CUT V型切槽 CNC ROUTING 数值控制成型 BLANKING 钢模沖切 FINAL CLEANING 最后清理程序
PCB制造流程
一、线路板基本知识 ( 5 )
PCB的概念
二．线路板生产工序
三、线路板生产常识 ( 5 )
材料预备 多层板 双层板 钻孔 无电镀铜 压合
如何阅读工艺单
PCB的作用
介绍每日记录单
PCB的分类
感光影像
CB的术语
线路电镀 剥除 / 蚀刻 防焊膜 喷锡 切外形 电子检测