【NL2022732A】水平传感器和光刻设备【专利】
北京时代民芯科技有限公司 CLGA封装芯片测试夹具说明书
(19)国家知识产权局(12)实用新型专利(10)授权公告号 (45)授权公告日 (21)申请号 202122081758.0(22)申请日 2021.08.31(73)专利权人 北京时代民芯科技有限公司地址 100076 北京市丰台区东高地四营门北路2号专利权人 北京微电子技术研究所(72)发明人 李明远 闫静 姜扬 刘利新 常国义 闫兰丰 黄玉凤 吕学明 (74)专利代理机构 中国航天科技专利中心11009专利代理师 范晓毅(51)Int.Cl.G01R 1/04(2006.01)G01R 31/28(2006.01)(54)实用新型名称一种针对CLGA封装芯片的测试夹具(57)摘要本实用新型提供一种针对CLGA封装芯片的测试夹具,将夹具中传统的单一尺寸导向框改进为包括最大外形导向框和可拆装导向块的导向框组件,最大外形导向框中设有大于等于待测芯片最大外形尺寸上限的内腔,可拆装导向块安装于最大外形导向框,调整内腔的尺寸与待测芯片最大外形尺寸相匹配,实现待测芯片在所述内腔中的定位,进而利用导向框组件,测试座,探针和手测盖之间的配合,实现对待测芯片的测试。
本实用新型解决了陶瓷平面网格阵列封装器件公差较大、器件在测试夹具内定位不精准的问题,可以快速组装不同定位腔尺寸的导向框,不需要通过新制或者返修原有导向框的方法来兼容陶瓷封装器件的最大外形公差,节约了重新制作导向框的成本。
权利要求书2页 说明书4页 附图3页CN 216525901 U 2022.05.13C N 216525901U1.一种针对CLGA封装芯片的测试夹具,包括测试座(1),探针(2)和手测盖(4),其特征在于,还包括导向框组件(3);导向框组件(3)包括最大外形导向框(31)和可拆装导向块(32);所述最大外形导向框(31)设有顶部开口的内腔(311),所述内腔(311)的尺寸大于等于待测芯片最大外形的尺寸上限;待测芯片置于所述内腔(311)中,可拆装导向块(32)固定安装于最大外形导向框(31)上,实现待测芯片在所述内腔(311)中的定位;导向框组件(3)固定安装于测试座(1)上,手测盖(4)设于导向框组件(3)上方,用于测试时向待测芯片施加压力;测试座(1)和导向框组件(3)上分别设有第一针孔和第二针孔,探针(2)通过第一针孔固定安装于测试座(1)上,待测芯片受到所述压力时,探针(2)穿过第二针孔与待测芯片焊盘接触,实现对待测芯片的测试。
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© 2022732
© Α OCTROOIAANVRAAG
(2?) Aanvraagnummer: 2022732© Int. Cl.:
G03F 7/20 (2019.01)
© Aanvraag ingediend: 13 maart 2019
© Voorrang:
11 april 2018 EP 18166754.4© Aanvrager(s):ASML Netherlands B.V. te Veldhoven.© Aanvraag ingeschreven:
16 oktober 2019
(43) Aanvraag gepubliceerd:
16 oktober 2019© Uitvinder(s):Simon Reinald Huisman te Veldhoven.Marinus Petrus Reijnders te Veldhoven.
© Gemachtigde:
Ir. A.J. Maas te Veldhoven.
(54) LEVEL SENSOR AND LITHOGRAPHIC APPARATUS
(57) The invention provides a level sensor to measure a position of a surface of a substrate, comprising a projection
unit arranged to direct a beam of radiation to the surface of the substrate and a detection unit. The detection unit comprises a detection grating arranged to receive the beam of radiation reflected on the surface of the substrate, one or more detectors, one or more optical elements to direct the beam of radiation from the detection grating to the one or more detectors, and a processing unit to determine the position of the surface of the substrate on the basis of the beam of radiation received by the one or more detectors. The detection grating and the one or more optical elements are integrated in a single integrated optical element.
N L A 2022732Deze publicatie komt overeen met de oorspronkelijk ingediende
stukken.
LEVEL SENSOR AND LITHOGRAPHIC APPARATUS
5 10 15 20 25 30FIELD
[0001]The present invention relates to a level sensor and a lithographic apparatus comprising such level sensor.
BACKGROUND
[0002]A lithographic apparatus is a machine constructed to apply a desired pattern onto a substrate.A lithographic apparatus can be used,for example,in the manufacture of integrated circuits(ICs).A lithographic apparatus may,for example,project a pattern(also often referred to as“design layout”or“design”)of a patterning device(e.g.,a mask)onto a layer of radiationsensitive material(resist)provided on a substrate(e.g.,a wafer).
[0003]As semiconductor manufacturing processes continue to advance,the dimensions of circuit elements have continually been reduced while the amount of functional elements,such as transistors,per device has been steadily increasing over decades,following a trend commonly referred to as‘Moore's law’.To keep up with Moore’s law the semiconductor industry is chasing technologies that enable to create increasingly smaller features.To project a pattern on a substrate a lithographic apparatus may use electromagnetic radiation.The wavelength of this radiation determines the minimum size of features which are patterned on the substrate.Typical wavelengths currently in use are365nm(i-line),248nm,193nm and13.5nm.A lithographic apparatus,which uses extreme ultraviolet(EUV)radiation,having a wavelength within a range of4nm to20nm,for example6.7nm or13.5nm,may be used to form smaller features on a substrate than a lithographic apparatus which uses,for example,radiation with a wavelength of 193nm.
[0004]A topography measurement system,level sensor or height sensor,and which may be integrated in the lithographic apparatus,is arranged to measure a topography of a top surface of a substrate(or wafer).A map of the topography of the substrate,also referred to as height map, may be generated from these measurements indicating a height of the substrate as a function of the position on the substrate.This height map may subsequently be used to correct the position of the substrate during transfer of the pattern on the substrate,in order to provide an aerial image of the patterning device in a properly focus position on the substrate.It will be understood that。