PL3366C-ASEMI电源管理IC规格书

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英飞凌单片机选型

24 / 30/40
最多10 1 1 4 最多2 QFP 144 / 176
16 / 24
最多8 0 1 4 QFP 64/100 / 144 - 40°C to +125°C
16 / 24
最多6 0 1 4 QFP 100 / 144 - 40°C to +125°C
9 / 16
最多6 0 1 2 QFP 64 / 100
程序 [PSRAM]
数据 [DSRAM] 双端口[DPRAM]
SB RAM CAN ADC Standby 通道数通道数 8 最多3 最多24 最多6 0 1 最多4 可选 QFP 100 / 144 - 40°C to +125°C
112
24 2 8 3 24 8 0 1 4 2 通道 QFP 144 - 40°C to +125°C
XC874
Vector Computer
XC878
Vector Computer
52kB
XC874
Vector Computer
XC878
Vector Computer
32kB
XC886
Vector Computer
XC888
Vector Computer
XC886
XC888
Vector Computer
工作温度 (T环境)
- 40°C to +125°C
- 40°C to +125°C
-40°C to +125°C
* **
USIC: CCU:
可配置成UART, LIN, SPI/QSPI, IIC, IIS 用于PWM, D/A
04.05.2012

XLSEMI XL8002 80V 1A高效降压PWM LED常电流驱动器说明书

80V 1A High Efficiency Buck PFM LED Constant Current Driver XL8002FeaturesOperation Voltage DC 12V~80V. 0.1V current sense voltage reference. Directly drive 1~18 Series 1W/3W LED. Excellent line and load regulation.Internal Optimize Power HV-MOSFET. Built in Thermal Shutdown Function. Built in Current Limiting Function.Built in Soft-Start Circuit.Available in TO263-5L package. Up to 98% efficiency. ApplicationsLED Lighting & LED LAMP General purpose LED lightingGeneral DescriptionThe XL8002 is a monolithic high voltage switching regulator with PFM that is specifically designed to operate from a 12V~80V DC power supply.The XL8002 is a high efficiency LED driver switching regulator. The LED string is driven at DC constant current rather than constant voltage, thus providing constant light output and enhanced reliability.Figure1. Package Type of XL800280V 1A High Efficiency Buck PFM LED Constant Current Driver XL800280V 1A High Efficiency Buck PFM LED Constant Current Driver XL8002Figure4. XL8002 Typical Application80V 1A High Efficiency Buck PFM LED Constant Current Driver XL8002Figure5. Efficiency VS Output N*1W LEDFigure6. Output ILED Load Regulation VS Output N*1W LED80V 1A High Efficiency Buck PFM LED Constant Current Driver XL800280V 1A High Efficiency Buck PFM LED Constant Current Driver XL800280V 1A High Efficiency Buck PFM LED Constant Current Driver XL8002 Figure7. XL8002 System Application at VIN=60V~80V Schematic Figure8. XL8002 System Application at VIN=60V~80V Efficiency Curve80V 1A High Efficiency Buck PFM LED Constant Current Driver XL8002 Figure9. XL8002 System Application at VIN=36V~60V Schematic80V 1A High Efficiency Buck PFM LED Constant Current Driver XL8002Figure10. XL8002 System Application at VIN=36V~60V Efficiency Curve Table2: Figure9 Input VIN=36V/48V system parameters table:80V 1A High Efficiency Buck PFM LED Constant Current Driver XL8002Figure11. XL8002 System Application at VIN=12V~36V SchematicFigure12. XL8002 System Application at VIN=12V~36V Efficiency CurveTable3: Figure11 Input VIN=12V/24V system parameters table:VIN=12V VIN=24VFOSC Pout Efficiency FOSC Pout Efficiency1.01W 82.3%1.96W 90.8%2.91W 94.1%47.25K 3.80W 95.5%42.17K 4.70W 96.6%31.13K 5.61W 97.2%80V 1A High Efficiency Buck PFM LED Constant Current Driver XL8002 Figure13. XL8002 System Application at VIN=60V~80V Schematic Figure14. XL8002 System Application at VIN=60V~80V Efficiency Curve80V 1A High Efficiency Buck PFM LED Constant Current Driver XL800280V 1A High Efficiency Buck PFM LED Constant Current Driver XL8002。

SMC EX260-SEC1 -SEC2 -SEC3 -SEC4 商品说明书

<EX260-SEC1/-SEC2/-SEC3/-SEC4>InstallationConfigurationAuto-increment addressing can be used to address each slave device via its physical position in the communication ring, and not require local address setting.To configure the EX260 SI unit with the EtherCAT master, XML Device Description File is required.The technical document states detail configuration information and the XML file can be found on the SMC website (.)Output number assignmentOutput number starts at zero and refers to the solenoid position on the manifold.General instructions on installation and maintenanceConnect valve manifold to the SI unit.Connectable valve manifolds are same as for EX250 series SI unit.Refer to the EX250 series valve manifold section in the valve catalogue for valvemanifold dimension.Power supply connector layoutGround terminalConnect the ground terminal to the ground.Resistance to ground should be 100 ohms or less.SettingReplacement of the SI unit•Remove the M3 hexagon screw from the SI unit and release the SI unit from the valve manifold.•Replace the SI unit.•Tighten the screws with the specified tightening torque. (0.6 Nm)Precautions for maintenance •Be sure to switch off the power.•Check there is no foreign matter inside the SI unit.•Check there is no damage and no foreign matter being stuck to the gasket.•Be sure to tighten the screw with the specified torque.If the SI unit is not assembled properly, inside PCBs may be damaged or liquid and/or dust may enter into the unit.Connecting cablesSelect the appropriate cables to fit with the connectors mounted on the SI unit.Fieldbus interface connector layoutTroubleshootingThe technical document states detail troubleshooting information can be found on the SMC website (URL )SpecificationsConnected load: 24VDC Solenoid valve with light and surge voltage suppressor of 1.5 W or less (manufactured by SMC)Current consumption of power supply for SI unit operation: 0.1 A max.Ambient temperature for operation: -10 to 50 ℃Ambient temperature for storage: -20 to 60 ℃Pollution degree 2: (UL508)The technical document states detail specification information can be found on the SMC website (URL )Akihabara UDX 15F, 4-14-1, Sotokanda, Chiyoda-ku, Tokyo 101-0021, JAPAN Phone: +81 3-5207-8249 Fax: +81 3-5298-5362URL Outline DimensionsThe technical document states detail outline dimensions information can be foundon the SMC website (URL )AccessoriesThe technical document states detail accessories information can be found on the SMC website (URL )*2: Single flash pattern*1: Blinking patternAssembly and disassembly of the SI unit*3: Flickering patternNOTEWhen conformity to UL is necessary the SI unit must be used with a UL 1310Class2 power supply.Fieldbus deviceOperation ManualEX260 Series for EtherCATThank you for purchasing an SMC EX260 Series Fieldbus device (Hereinafter referred to as "SI unit" ).Please read this manual carefully before operating the product and make sure you understand its capabilities and limitations.Please keep this manual handy for future reference.To obtain more detailed information about operating this product,please refer to the SMC website (URL ) or contact SMC directly.These safety instructions are intended to prevent hazardous situations and/or equipment damage.These instructions indicate the level of potential hazard with the labels of"Caution", " Warning" or "Danger". They are all important notes for safety and must be followed in addition to International standards (ISO/IEC), Japan Industrial Standards (JIS) and other safety regulations.OperatorNote: Specifications are subject to change without prior notice and any obligation on the part of the manufacturer.EtherCAT ®is registered trademark and patented technology, licensed by Beckhoff Automation GmbH, Germany.© 2010 SMC Corporation All Rights ReservedPWR: M12 5-pole Plug A-coded。

LMC-PCIE-V6K3-SPI 系列激光控制卡电气使用说明书

LMC-PCIE-V6K3-SPI系列激光控制卡电气使用说明书一、概述LMC-PCIE-V6K3-SPI系列打标焊接控制卡是专门针对激光打标开发的控制卡，其通过PCIE口与电脑通讯。

二、安装尺寸PCIE主卡PCIE端子板三、外观介绍PCIE主卡PCIE端子板四、LED指示灯说明注意：在对控制卡上电后第一时间查看亮灯情况，如果异常马上断电检查接线情况。

主卡灯状态：位号说明状态三色灯绿色指示灯空闲灯黄色指示灯运行灯红色指示灯报警灯端子板灯状态位号说明LED1负向电源指示灯LED6正向电源指示灯LED8外接24V电源指示灯（IO）LED3板卡空闲指示灯LED4板卡工作中指示灯LED5板卡错误指示灯五、接口说明5.1电源接口（J1，3PIN接线端子）5.1.1振镜不通过板卡J1端口供电接线方式管脚号板卡端丝印名称方向供电电源电压电源功率1+15V输入8V~28V>5W2GND输入GND3-15V不接注：如是以上方式接线，为避免振镜或板卡损坏需将振镜电源参考地与板卡电源参考地短接。

5.1.2振镜通过板卡J1端口供电接线方式管脚号板卡端丝印名称方向供电电源电压电源功率供电线径1+15V输入振镜正向电源电压（8~28V范围内）振镜功率+5W不小于0.75平方mm2GND输入GND振镜功率+5W不小于0.75平方mm 3-15V输入振镜负向电源电压（-8~-28V范围内）振镜功率+5W不小于0.75平方mm例如：鹏鼎Ⅰ、Ⅱ代振镜供电，J1端口如下接线：管脚号板卡端丝印名称方向供电电源电压电源功率供电线径1+15V输入+15V振镜功率+5W不小于0.75平方mm 2GND输入GND振镜功率+5W不小于0.75平方mm 3-15V输入-15V振镜功率+5W不小于0.75平方mm管脚号板卡端丝印名称方向供电电源电压电源功率供电线径1+15V输入+24V振镜功率+5W不小于0.75平方mm 2GND输入GND振镜功率+5W不小于0.75平方mm 3-15V输入不接5.2振镜控制接口定义（J3，DB25母头）(XY2-100协议接口定义)管脚名称说明信号方向管脚名称说明信号方向1Clk-时钟信号-输出14Clk+时钟信号+输出2Sync-同步信号-输出15Sync+同步信号+输出3X_data-X振镜信号-输出16X_data+X振镜信号+输出4Y_data-Y振镜信号-输出17Y_data+Y振镜信号+输出5X_fb-（A-）X振镜反馈-（复用，飞行A-）输入18X_fb+（A+）X振镜反馈+（复用，飞行A+）输入6Y_fb-（B-）Y振镜反馈-（复用，飞行B-）输入19Y_fb+（B+）Y振镜反馈+（复用，飞行B+）输入9/10 /22+15V振镜供电电源+15V输出，与J1的1脚直连11/23/24GND GND，电源参考点输出，与J1的2脚直连12/1 3/25-15V振镜供电电源-15V输出，与J1的3脚直连7/8/20/21NC留用5.2.1振镜控制接口（J3，DB25母头）(SL2-100协议接口定义)振镜接线（SL2-100）SCANLAB振镜接口控制卡振镜接口振镜管脚号振镜信号定义控制卡管脚号接口定义1DATA IN+16x-data+6DATA IN-3X-data-5DATA OUT+18X-FB+9DATA OUT-5X-FB-7，8GND11,23,24GND注：①振镜信号（+，-）为一对差分信号，信号线要用屏蔽双绞线，振镜信号线长度<20m.②如果振镜电源从J3供电，供电线缆线径不小于0.75平方mm。

微塞米ZL3066系列1-3通道10输入18输出线路卡时间IC产品简介说明书

ZL30661, ZL30662, ZL306631-, 2-, 3-Channel, 10-Input, 18-OutputLine Card Timing ICsProduct BriefAugust 2019 Features•One, Two or Three DPLL Channels•Programmable bandwidth, 14Hz to 470Hz•Freerun or holdover on loss of all inputs•Hitless reference switching•High-resolution holdover averaging•Per-DPLL phase adjustment, 1ps resolution•Programmable tracking range, phase-slope limiting, frequency-change limiting and otheradvanced features•Input Clocks•Accepts up to 10 differential or CMOS inputs•Any input frequency from 1kHz to 900MHz•Per-input activity and frequency monitoring•Automatic or manual reference switching•Revertive or nonrevertive switching•Any input can be a 1PPS SYNC input for REF+SYNC frequency/phase/time locking •Any input can be a clock with embedded 1PPS •Input-input phase measurement, 1ps resolution •Input-DPLL phase measurement, 1ps resolution •Per-input phase adjustment, 1ps resolution •Output Clock Frequency Generation•Any output frequency from <1Hz to 1045MHz (180MHz max for Synth0)•High-resolution fractional frequency conversion with 0ppm error•Synthesizers 1 & 2 have integer and fractional dividers to make a total of 5 frequency families •Output jitter from Synth 1 & 2 is <0.3ps RMS•Output jitter from fractional dividers is typically < 1ps RMS, many frequencies <0.5ps RMS •Each HPOUTP/N pair can be LVDS, LVPECL, HCSL, 2xCMOS, HSTL or programmable diff.•In 2xCMOS mode, the P and N pins can be different frequencies (e.g. 125MHz and 25MHz) •Four output banks each with VDDO pin; CMOS output voltages from 1.5V to 3.3V•Per-synthesizer phase adjust, 1ps resolution•Per-output programmable duty cycle•Precise output alignment circuitry and per-output phase adjustment•Per-output enable/disable and glitchlessstart/stop (stop high or low)•Local Oscillator•Operates from a single low-cost XO: 23.75-25MHz, 47.5-50MHz, 114.285-125MHz •High-stability applications can connect a TCXO or OCXO (any frequency, any output jitter) tothe OSCI pin to provide a stability reference •General Features•Automatic self-configuration at power-up from internal Flash memory•Input-to-output alignment <200ps (ext feedback) •Fast REF+SYNC locking for frequency and 1PPS phase alignment with lower-cost oscillator •Internal compensation (1ppt) for local oscillator frequency error in DPLLs and input monitors •Numerically controlled oscillator behavior in each DPLL and each fractional output divider•Easy-to-configure design requires no external VCXO or loop filter components•7 GPIO pins with many possible behaviors•SPI or I2C processor Interface• 1.8V and 3.3V core VDD voltages•Power: 1.3W for 2 inputs, 1 synth, 6 LVDS out•Easy-to-use evaluation/programming software Applications•Line card timing IC for SyncE, SyncE+1588, SONET/SDH, OTN, wireless base station andother systems carrier-grade systemOrdering InformationZL30661LFG7 1-Channel 80-lead LGA TraysZL30662LFG7 2-Channel 80-lead LGA TraysZL30663LFG7 3-Channel 80-lead LGA TraysNiAu (Pb-free)Package size: 11 x 11 mm-40︒C to +85︒C1. Block DiagramFigure 1 - Functional Block Diagram2. Application ExampleFigure 2 - Synchronous Ethernet and IEEE 1588 Line Card ApplicationFracDiv IntDiv FracDivIntDivHP Synthesizer 2low-jitterHPOUT6P HPOUT6N HPOUT7P HPOUT7NDIVREF0P DPLL0R S T _BC S _B _A S E L 0S C K _S C LS O _A S E L 1S I _S D AG P I O [8:0]Microprocessor Port SPI or I2C I/F & GPIO Pins One Diff / Two Single-Ended REF0N REF1P One Diff / Two Single-Ended REF1N REF2P One Diff / Two Single-EndedREF2NREF3P One Diff / Two Single-Ended REF3N REF4P One Diff / Two Single-EndedREF4NReference Monitors & State MachinesDPLL1DPLL2HP Synthesizer 1low-jitterGP Synthesizer 0general purpos eGPOUT0GPOUT1DIV DIVXO Optional x2O S C IO S C OMaster Clock M C L K I N _PDIVHPOUT4P HPOUT4N HPOUT5P HPOUT5N DIV DIVHPOUT0P HPOUT0N HPOUT1P HPOUT1N DIVDIV HPOUT2P HPOUT2N HPOUT3P HPOUT3NDIVDIVM C L K I N _NS R S T _BDPLL0Synth0DPLL1Synth1Synth22x 156.25MHz differential 2x 125MHz differential 25MHz CMOS 2x 155.52MHz, 161.1328125MHz or other frequencyto PHY transmitters, line card Ethernet switch IC, etc.from PHY receivers2x 156.25MHz differential 2x 125MHz differential 2x 25MHz CMOS2x 19.44MHz, 25MHzor 8kHz CMOS to central timing functionsfrom central timing functionsXO2x 19.44MHz or 25MHz CMOS1PPS CMOSoptional 2x 1PPS CMOSDPLL1 only present on ZL30662 and ZL30663 DPLL2 only present on ZL306633. Detailed Features3.1 Input Block Features•Ten input reference pins; each can accept a CMOS signal or the POS side of a differential pair; or two can be paired to accept both sides of a differential pair•Any input can be a SYNC signal for REF+SYNC frequency/phase/time locking•Any input can be a clock signal with embedded PPS signal (duty cycle distortion indicates PPS location) •Input clocks can be any frequency from 1kHz up to 900MHz (180MHz max for CMOS inputs)•Supported telecom frequencies include PDH, SDH, Synchronous Ethernet, OTN, wireless•Inputs constantly monitored by programmable frequency and single-cycle monitors•Single-cycle monitor can quickly disqualify a reference when measured period is incorrect•Frequency measurement (ppb or Hz) and monitoring (coarse, fine, and frequency-step monitors)•Optional input clock invalidation on GPIO assertion to react to LOS signals from PHYs•Input-to-input phase measurement, 1ps resolution•Input-to-DPLL phase measurement, 1ps resolution•Per-input phase adjustment, 1ps resolution3.2 DPLL Features•One, two or three full-featured DPLLs•Very high-resolution DPLL architecture•State machine automatically transitions among freerun, tracking and holdover states•Revertive or nonrevertive reference selection algorithm•Programmable bandwidth from 14Hz to 470Hz•Less than 0.1dB gain peaking•Fast frequency/phase/time lock capability for clock+1PPS input references•Programmable phase-slope limiting (PSL)•Programmable frequency rate-of-change limiting (FCL)•Programmable tracking range (i.e. hold-in range)•Truly hitless reference switching•Per-DPLL phase adjustment, 1ps resolution•High-resolution frequency and phase measurement•Fast detection of input clock failure and transition to holdover mode•High-resolution holdover frequency averaging•Time-of-Day registers: 48-bit seconds, 32-bit nanoseconds, writeable on input PPS edge3.3 Synthesizer Features•Any-to-any frequency conversion with 0ppm error•Two low-jitter synthesizers (Synth1, Synth2) with very high-resolution fractional scaling (i.e. non-integer multiplication)•Two output dividers per low-jitter synthesizer: one integer (4 to 15 plus half divides 4.5 to 7.5) and one 40-bit fractional•One general-purpose synthesizer (Synth0)• A total of five output frequency families•Easy-to-configure, completely encapsulated design requires no external VCXO or loop filter components3.4 Low-Jitter Output Clock Features•Up to 16 single-ended outputs (up to 8 differential outputs) from Synth1 and Synth2•Each output can be one differential output or two CMOS outputs•Output clocks can be any frequency from 1Hz to 1045MHz (250MHz max for CMOS and HSTL outputs) •Output jitter from Synth1 and Synth2 integer dividers is <0.3ps RMS•Output jitter from fractional dividers is <1ps RMS, many frequencies <0.5ps RMS•In CMOS mode, the HPOUTxN frequency can be an integer divisor of the HPOUTxP frequency (Example 1: HPOUT3P 125MHz, HPOUT3N 25MHz. Example 2: HPOUT2P 25MHz, HPOUT2N 1Hz)•Outputs directly interface (DC coupled) with LVDS, LVPECL, HSTL, HCSL and CMOS components •Supported telecom frequencies include PDH, SDH, Synchronous Ethernet, OTN•Can produce clock frequencies for microprocessors, ASICs, FPGAs and other components•Can produce PCIe clocks•Sophisticated output-to-output phase alignment•Per-synthesizer phase adjustment, 1ps resolution•Per-output phase adjustment•Per-output duty cycle / pulse width configuration•Per-output enable/disable•Per-output glitchless start/stop (stop high or low)3.5 General-Purpose Output Clock Features•Two CMOS outputs from Synth0•Any frequency from 1Hz to 180MHz•Output jitter is typically 20-30ps•Useful for applications where the component or system receiving the signal has low bandwidth such asa central timing IC•Can output a clock signal with embedded PPS (ePPS) (duty cycle distortion indicates PPS location) 3.6 Local Oscillator•Operates from a single low-cost XO (jitter reference for the device). Acceptable frequencies: 23.75MHz to 25MHz, 47.5MHz to 50MHz, 114.285MHz to 125MHz. Best jitter: ≥48MHz.•High stability applications can connect a TCXO or OCXO (any frequency, any output jitter) to a REF pin to provide a separate stability reference•This ability to have separate jitter and stability references greatly reduces the cost of the TCXO or OCXO (no jitter requirement, no high-frequency-requirement) and allows reuse of already-qualifiedTCXO and OCXO components3.7 General Features•Automatic self-configuration at power-up from internal Flash memory•Input-to-output alignment <200ps with external feedback•Fast REF+SYNC locking for frequency and 1PPS phase alignment with lower-cost oscillator•Generates output SYNC signals: 1PPS (IEEE 1588), 2kHz or 8kHz (SONET/SDH) or other frequency •JESD204B clocking: device clock and SYSREF signal generation with skew adjustment•Internal compensation for local oscillator frequency error in DPLLs and input monitors, 1ppt resolution •Numerically controlled oscillator (NCO) behavior allows system software to steer DPLL frequency or fractional output divider frequency with resolution better than 0.005ppt•Spread-spectrum modulation available in each fractional output divider (PCIe compliant)•Seven general-purpose I/O pins each with many possible status and control options•SPI or I2C serial microprocessor interface3.8 Evaluation Software•Simple, intuitive Windows-based graphical user interface•Supports all device features and register fields•Makes lab evaluation of the device quick and easy•Generates configuration scripts to be stored in internal Flash memory•Generates full or partial configuration scripts to be run on a system processor•Works with or without an evaluation boardMicrosemi Corporate Headquarters One EnterpriseAliso Viejo, CA 92656 USAWithin the USA: +1 (800) 713-4113 Outside the USA: +1 (949) 380-6100 Sales: +1 (949) 380-6136Fax: +1 (949) 215-4996E-mail: ***************************©2019 Microsemi Corporation. All rights reserved. Microsemi and the Microsemi logo are trademarks of Microsemi Corporation. All other trademarks and service marks are the property of their respective owners. Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for communications, defense & security, aerospace and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world’s standard for time; voice processing devices; RF solutions; discrete components; security technologies and scalable anti-tamper products; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services. Microsemi is headquartered in Aliso Viejo, Calif., and has approximately 3,400 employees globally. Learn more at .Microsemi makes no warranty, representation, or guarantee regarding the information contained herein or the suitability of its products and services for any particular purpose, nor does Microsemi assume any liability whatsoever arising out of the application or use of any product or circuit. The products sold hereunder and any other products sold by Microsemi have been subject to limited testing and should not be used in conjunction with mission-critical equipment or applications. Any performance specifications are believed to be reliable but are not verified, and Buyer must conduct and complete all performance and other testing of the products, alone and together with, or installed in, any end-products. Buyer shall not rely on any data and performance specifications or parameters provided by Microsemi. It is the Buyer’s responsibility to independently determine suitability of any products and to test and verify the same. The information provided by Microsemi hereunder is provided “as is, where is” and with all faults, and the entire risk associated with such information is entirely with the Buyer. Microsemi does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other IP rights, whether with regard to such information itself or anything described by such information. Information provided in this document is proprietary to Microsemi, and Microsemi reserves the right to make any changes to the information in this document or to any products and services at any time without notice.。

电子工程师常用的10款稳压元件

电子工程师常用的10款稳压元件电子产品离不开电源，电源部分主要的功能就是将外界供给的抵押直流电（DC）通过电源管理区间（PMIC）得到各个期间所需要的电压，并满足电流和纹波以及启动顺序等要求。

主要的稳压方式有两种：（1）线性稳压 - 由工作在线性状态的三极管构成可变电阻对负载进行恒流控制，得到稳定的电压输出。

这种方式结构简单、噪声抑制度很高（达到60dB也就是1000倍以上），但一般效率比较低，要满足输入电压高于输出电压一定的压差才能够稳压，只能做降压变换。

常规的线性稳压器的压差高达2.5V，因此效率比较低，LDO线性稳压器可以做到较低的压差，比如在负载高达1A的情况下压差可以降低到350mA，当然其效率取决于具体使用的输入和输出电压的情况。

（2）开关稳压 - 由工作在开关模式的三极管和储能的电感以及平滑纹波的电容构成，以PWM或PFM的方式得到稳定的输出电压。

开关方式的好处是能够降压、升压、反压，输入电压的范围可以很宽，效率可以做到很高（有的能达到95%以上），缺点是外围电路比较复杂，外围元器件的选型比较敏感，另外高频的开关信号会在电压输出上带来较大的干扰、纹波。

虽然电源技术已经日新月异，各种高效率、高集成度、高性能的器件不断推出，但根据统计，排在前10的稳压器件仍然是比较经典的一些老器件，毕竟这些器件能够满足多数的可以看成是78xx的夫妻档，经常配对使用。

78xx得到的是对地正电压，79xx得到的是对地负电压，除此之外跟78xx一样；3.LM317/LM117上面的78xx和79xx的器件输出电压是固定的，不可调整，LM317则是输出电压可以调节的线性稳压器，也有不同的封装支持不同的电流输出，最大输出电路可以高达 1.5A；也要求2.5v以上的压差才能正常稳压工作，也具备78xx一样的优点和缺点；4. 1117系列非常经典的LDO线性稳压器，相比于78xx和LM317系列的器件，它要求的输入电压和输出电压的差值为1.2V，因此可以广泛用在电池供电的便携式系统里面，比如通过4节1.25V 的电池（满电量的时候达到5V），电量不足到4.5V电压的时候依然能够通过1117-3.3得到3.3V的稳压输出供板子上的3.3V电路工作。

DDSI3366说明书(新)

第一章综合介绍 1.1 概述DDSI3366电子式单相载波电能表产品，是我公司最新设计开发及大量的现场运行经验，采用先进技术设计的新型载波电能表，具有精度高、稳定性好、布局合理、工艺先进、实用性强、功能强大、操作方便等特点，可准确、快捷地对各类电参数进行测量计算。

各项技术指标符合 GB/T 17215.322—2008《0.2S 级和0.5S 级静止式交流有功电度表》、GB/T17215.323—2008《2级和3级静止式交流无功电度表》、DL/T614—2007《多功能电能表》等国家标准以及行业标准，其通信符合DL/T645—2007《多功能电能表通信规约》的要求。

1.2 基本工作原理UU电能表工作时，单相电压、电流经取样电路取样后，送到计量芯片进行处理，CPU 将处理过的数据根据需要送至显示部分、通信部分等数据输出单元。

1.5 其他第二章仪表主要功能2.1 电能计量采用了24bit的高精度ΣΔ模数转换器，确保了采样的精度值，并保证了电能表在1000：1范围内的线性度优于0.2%。

同时对周边采样电路进行了优化设计，采用了大量的高精度高稳定性的电阻、电容、振荡器，确保电能表在-25℃至60℃的温度范围内误差偏移值优于国家相关标准。

如采用特殊工艺，电能表在10倍表的范围内可满足国标的计量要求。

a）具有正向、反向有功电能量计量功能，并可以据此设置组合有功和组合有功电能量。

b）具有分时计量功能；有功电能量应对尖、峰、平、谷等各时段电能量及总电能量分别进行累计、存储；c）具有单独计量正向有功、反向有功电能量计量功能，反向有功电能按正向有功电能单独进行计量和存储。

d）可测量有功功率、功率因数、电压、相电流、零线电流、电网频率、电表温度等运行参数。

2.2 时钟采用具有温度补偿功能的内置硬件时钟电路，具有日历、计时、闰年自动转换功能。

2.2.1 广播校时不受密码和硬件编程开关限制，对时钟误差小于或等于5分钟的电能表进行校时，每天只允许校对一次，且在午夜零点前后10分钟内不能进行广播校时。

美琴263585产品说明书

Eaton 263585Eaton Moeller series xPole - PF6/7 RCCB. PF7, 4 pole, In: 25 A, Icn: 10 kA, I ΔN: 0.1 A, Type AC, AC current sensitive, Partly surge-proof 250 A, residential and commercialGeneral specificationsEaton Moeller series xPole - PF6/7 RCCB263585PF7-25/4/01-DE401508263585580 mm 71 mm 70 mm 0.32 kg RoHS conformIEC/EN 61008Product NameCatalog Number Model Code EANProduct Length/Depth Product Height Product Width Product Weight Compliances Certifications25 AIs the panel builder's responsibility. The specifications for the switchgear must be observed.7035-35 °CMeets the product standard's requirements.Is the panel builder's responsibility. The specifications for the switchgear must be observed.DIN railQuick attachment with 2 latch positions for DIN-rail IEC/EN 6071525 ADoes not apply, since the entire switchgear needs to be evaluated.0.1 A184 V AC - 440 V ACMeets the product standard's requirements.Non-delayedIS/SPE-1TE 101911Interlocking device500 A eaton-rcd-application-guide-br019003en-en-us.pdfeaton-xpole-pf7-rccb-catalog-ca019032en-en-us.pdf eaton-xpole-pf6-rccb-catalog-ca019034en-en-us.pdfDA-DC-03_PF7eaton-circuit-breaker-xeffect-frcmm-rccb-dimensions.jpg eaton-xpole-pf6/7-rccb-3d-drawing.jpgIL019140ZUeaton-xeffect-frcmm-rccb-wiring-diagram-002.jpgRated operational current for specified heat dissipation (In) 10.11 Short-circuit ratingRAL-numberPermitted storage and transport temperature - min10.4 Clearances and creepage distances10.12 Electromagnetic compatibilityMounting MethodAmperage Rating10.2.5 LiftingRated fault current - maxTest circuit range10.2.3.1 Verification of thermal stability of enclosures Tripping timeFitted with:Rated residual making and breaking capacity Application notes Catalogs Certification reports DrawingsInstallation instructions Wiring diagramsFrequency rating50 Hz10.8 Connections for external conductorsIs the panel builder's responsibility.Fault current rating100 mATerminal protectionFinger and hand touch safe, DGUV VS3, EN 50274Special featuresMaximum operatingtemperature is 55 °C:Starting at 40 °C, the max.permissible continuouscurrent decreases by 3% forevery 1 °CTripping signal contact forsubsequent installation Z-NHK 248434Sensitivity typeAC current sensitiveAmbient operating temperature - max55 °CHeat dissipation per pole, current-dependent0 WClimatic proofing25-55 °C / 90-95% relative humidity according to IEC 60068-2Built-in depth69.5 mmShort-circuit rating63 A (max. admissible back-up fuse)FeaturesResidual current circuit breakerAdditional equipment possibleLifespan, electrical4000 operationsConnectable conductor cross section (solid-core) - min1.5 mm²10.9.3 Impulse withstand voltageIs the panel builder's responsibility.Number of polesFour-poleTerminal capacity (solid wire)1.5 mm² - 35 mm²Ambient operating temperature - min-25 °C10.6 Incorporation of switching devices and componentsDoes not apply, since the entire switchgear needs to be evaluated.Rated short-circuit strength10 kA10.5 Protection against electric shockDoes not apply, since the entire switchgear needs to be evaluated.Used withKLV-TC-4 276241 (Compact enclosure) Z-FW/LP 248296 (Remote control and automatic switching device) Z-RC/AK-4TE 101062 (sealing cover set)Residual current circuit breakersPF7Type ACKLV-TC-4 276241 (Compact enclosure)Z-FW/LP 248296 (Remote control and automatic switching device)Z-RC/AK-4TE 101062 (sealing cover set)Equipment heat dissipation, current-dependent2.8 W10.13 Mechanical functionThe device meets the requirements, provided the information in the instruction leaflet (IL) is observed.10.2.6 Mechanical impactDoes not apply, since the entire switchgear needs to be evaluated.10.9.4 Testing of enclosures made of insulating materialIs the panel builder's responsibility.Static heat dissipation, non-current-dependent0 WApplicationResidual current circuitbreaker for residential andcommercial applicationsxPole - Switchgear forresidential and commercialapplications10.3 Degree of protection of assembliesDoes not apply, since the entire switchgear needs to be evaluated.Voltage typeACTerminal capacity (stranded cable)16 mm² (2x)Leakage current typeACFrame45 mmBuilt-in width (number of units)70 mm (4 SU)Terminals (top and bottom)Open mouthed/lift terminalsHeat dissipation capacity0 WImpulse withstand currentPartly surge-proof 250 AWidth in number of modular spacings4Busbar material thickness0.8 mm - 2 mm10.2.3.2 Verification of resistance of insulating materials to normal heatMeets the product standard's requirements.10.2.3.3 Resist. of insul. mat. to abnormal heat/fire by internal elect. effectsMeets the product standard's requirements.Lifespan, mechanical20000 operationsVoltage rating230 V AC / 400 V AC10.9.2 Power-frequency electric strengthIs the panel builder's responsibility.Connectable conductor cross section (solid-core) - max35 mm²Degree of protectionIP20, IP40 with suitable enclosureIP20Rated short-time withstand current (Icw)10 kAAccessories requiredZ-HK 248432Pollution degree210.7 Internal electrical circuits and connectionsIs the panel builder's responsibility.Connectable conductor cross section (multi-wired) - min 1.5 mm²Rated impulse withstand voltage (Uimp)4 kV10.10 Temperature riseThe panel builder is responsible for the temperature rise calculation. Eaton will provide heat dissipation data for the devices.Connectable conductor cross section (multi-wired) - max 16 mm²TypePF7Residual current circuitbreakersType AC10.2.2 Corrosion resistanceMeets the product standard's requirements.10.2.4 Resistance to ultra-violet (UV) radiationMeets the product standard's requirements.10.2.7 InscriptionsMeets the product standard's requirements.Surge current capacity0.25 kAPermitted storage and transport temperature - maxEaton Corporation plc Eaton House30 Pembroke Road Dublin 4, Ireland © 2023 Eaton. All Rights Reserved. Eaton is a registered trademark.All other trademarks areproperty of their respectiveowners./socialmedia60 °C25 A gG/gL0.1 A400 V440 VAdmissible back-up fuse overload - max Rated fault current - min Rated operational voltage (Ue) - max Rated insulation voltage (Ui)。

C3360中文资料

AccessoriesAC line cable (2.4m long) ······························································································1High voltage output cable (1.5m long) terminated with SHV-P plugs E1168-19 ···········1Spare fuses ···················································································································2Subject to local technical requirements and regulations, availability of products included in this promotional material may vary. Please consult with our sales rmation furnished by HAMAMATSU is believed to be reliable. However, no responsibility is assumed for possible inaccuracies or omissions. Specifications are subject to change without notice No patent right are granted to any of the circuits described herein. © 1998 Hamamatsu Photonics K.K.-5kV Regulated Power SupplyFor MCP-PMT, Electron Multiplier, MCP, etc.Hamamatsu C3360 is a highly regulated bench-top power supply with -5kV, 1mA output. It is designed especially for operations of microchannel plate incorporated photomultipliers (MCP-PMT), electronmultipliers, and microchannel plates (MCP). The LED panel meter on the front panel allows easy and precise voltage monitoring.TACCF0078SpecificationsNOTEAt maximum output voltage and current.At maximum output voltage.Without moisture condensation.-5kV REGULATED HIGH VOLTAGE POWER SUPPLY C3360HAMAMATSU PHOTONICS K.K., Electoron Tube Center314-5, Shimokanzo, Toyooka-village, Iwata-gun, Shizuoka-ken, 438-0193, Japan, Telephone: (81)539/62-5248, Fax: (81)539/62-2205U.S.A.: Hamamatsu Corporation: 360 Foothill Road, Bridgewater. N.J. 08807-0910, U.S.A., Telephone: (1)908-231-0960, Fax: (1)908-231-1218Germany: Hamamatsu Photonics Deutschland GmbH: Arzbergerstr. 10, D-82211 Herrsching am Ammersee, Germany, Telephone: (49)8152-375-0, Fax: (49)8152-2658France: Hamamatsu Photonics France S.A.R.L.: 8, Rue du Saule Trapu, Parc du Moulin de Massy, 91882 Massy Cedex, France, Telephone: (33)1 69 53 71 00, Fax: (33)1 69 53 71 10United Kingdom: Hamamatsu Photonics UK Limted: Lough Point, 2 Gladbeck Way, Windmill Hill, Enfield, Middlesex EN2 7JA, United Kingdom, Telephone: (44)181-367-3560, Fax: (44)181-367-6384North Europe: Hamamatsu Photonics Norden AB: Färögatan 7, S-164-40 Kista Sweden, Telephone: (46)8-703-29-50, Fax: (46)8-750-58-95Italy: Hamamatsu Photonics Italia: S.R.L.: Via Della Moia, 1/E, 20020 Arese, (Milano), Italy, Telephone: (39)2-935 81 733, Fax: (39)2-935 81 741TACC1018E01JUN. 1998 SYDimensional Outline (Unit : mm)TACCA0127EA。

翠展微电子PIR产品手册说明书

PIR产品手册翠展微电子2021公司介绍翠展微电子成立于2018年4月，公司位于中国上海张江综合性国家科学中心的张江集成电路产业区内，工厂位于浙江省嘉善经济技术开发区。

作为一家中国本土的汽车级功率器件与模拟集成电路设计销售公司，公司立志打破进口垄断，实现进口替代，将翠展微电子打造成为新能源汽车半导体行业的中国品牌领军企业。

公司将聚焦中国新能源汽车行业的挑战和压力，提供有竞争力的半导体产品和服务，持续为新能源汽车客户创造价值。

公司团队由多名业内资深人员构成，成员具有平均15年国际汽车半导体公司及汽车电子行业的销售、应用、方案设计及设计研发经验，在汽车级功率器件与集成电路产品领域具有雄厚的研发实力和销售渠道。

我们有一支专业、坚韧、有活力的人才队伍，坚持以技术为导向，为客户提供个性化、系统级的产品与技术咨询服务，致力于提供优良的技术服务和高性价比的产品，驱动中国汽车电子产业快速蓬勃发展，共筑中国芯，中国梦！型号/功能描述VDD IDD（典型值@3V VDD）输出形式M9401智能型PIR信号调理芯片1.4V to3.6V 4.5µA人体移动检测，输出I/O信号测试模式下单线通信模式（兼容DOCI）M1601数字型PIR信号调理芯片1.4V to3.6V 3.0µA数字模式输出原始PIR信号及芯片温度值单总线模式，兼容DOCI方式M8601可编程数字式PIR信号调理芯片1.4V to3.6V 3.0µA人体移动检测，输出I/O信号或数字模式，输出原始PIR信号值和芯片温度值M8602内置存储单元可编程数字式PIR信号调理芯片1.4V to3.6V 3.0µA人体移动检测，输出I/O信号或数字模式，输出原始PIR信号值和芯片温度值I2C总线通信模式M9601可编程数字式PIR信号调理芯片1.4V to3.6V 3.0µA人体移动检测，输出I/O信号或数字模式，输出原始PIR信号及芯片温度值单总线通信模式兼容DOCI封装形式主要电气参数DFN8L2X2-0.55裸晶圆▪宽电压工作范围▪极低的工作电流▪自检模式可实现数字探头功能测试▪Motion输出脉宽时间128挡可调DFN8L2X2-0.55裸晶圆▪输出PIR原始信号▪超低工作电流，宽电压工作范围▪全数字信号处理方式▪片上温度传感器▪自检模式可实现数字的探头功能测试DFN8L2X2-0.55裸晶圆▪芯片数字可编程，Motion检测或数字模式▪超低工作电流，宽电压工作范围▪片上温度传感器▪自检模式可实现数字的探头功能测试▪可实现系统防误报功能DFN8L2X2-0.55裸晶圆▪内置存储单元▪芯片数字可编程，Motion检测或数字模式▪超低工作电流，宽电压工作范围▪片上温度传感器▪自检模式可实现数字的探头功能测试▪可实现系统防误报功能DFN8L2X2-0.55裸晶圆▪可实现人体存在检测或人体移动检测功能▪芯片数字可编程，Motion检测或数字模式▪超低工作电流，宽电压工作范围▪片上温度传感器▪单总线通信接口，兼容DOCI模式自检模式可实现数字的探头功能测试▪可实现系统防误报功能超低功耗热释电传感器信号调理芯片PIR Sensors-Ultra-Low Power Pyroelectric Sensor Signal Processor超低功耗热电堆信号调理芯片TPS Sensors–Ultra Low Power Thermopile Sensor Signal Processor型号/功能描述VDDIDD（典型值@3VVDD）输出形式M1801低功耗、单点式热电堆传感器信号调理芯片1.4V to3.6V10µA热电堆原始信号单总线通信接口，兼容DOCI模式M3801低功耗、单点式热电堆传感器信号调理芯片1.4V to3.6V10µA热电堆原始信号I2C总线通信接口封装形式主要电气参数DFN8L2X2-0.55裸晶圆▪输出热电堆（TPS）原始信号▪超低工作电流，宽电压工作范围▪全数字信号处理方式▪片上温度传感器实现温度补偿▪对TPS信号的分辨率可达17-位，最小0.8µV/Count▪片上温度传感器达14-位，精度可达0.02K▪单总线通信接口，兼容DOCI模式DFN8L2X2-0.55裸晶圆▪输出热电堆（TPS）原始信号▪超低工作电流，宽电压工作范围▪全数字信号处理方式▪片上温度传感器实现温度补偿▪对TPS信号的分辨率可达17-位，最小0.8µV/Count▪片上温度传感器达14-位，精度可达0.02K▪I2C总线通信接口▪DFN8L2X2-0.55▪圆晶▪DFN8L2X2-0.55▪圆晶▪数字PIR传感器▪人体入侵检测▪工业领域安防、报警▪智能楼宇、智能照明、智能家居主要特点▪可直接连接热释电（PIR）敏感元▪兼容差模、共模PIR信号输入方式▪宽电压工作范围1.4V~3.6V▪极低的工作电流，4.5µA典型值@3V ▪ADC灵敏度3.25µV/bit ▪极高的电源抑制系数(PSR)▪优良的抗RF射频干扰性能▪外部可调灵敏度▪Motion输出脉宽时间128档可应用领域封装▪数字PIR传感器▪人体入侵检测▪工业领域安防、报警▪智能楼宇、智能照明、智能家居典型应用电路智能型热释电传感器信号调理芯片|M9401主要特点▪和热释电（PIR）敏感元直接相连▪兼容差模、共模PIR信号输入方式▪宽电压工作范围1.4V~3.6V ▪极低的工作电流，3.5µA典型值@3V▪ADC灵敏度6.5µV/bit▪极高的电源抑制系数(PSR)▪内置片上温度传感器可实现温度补偿▪单线通信接口模式(DOCI)数字型热释电传感器信号调理芯片|M1601应用领域封装典型应用电路▪DFN8L2X2-0.55▪圆晶▪DFN8L2X2-0.55▪圆晶▪无线人体入侵传感器▪电池供电的智能门禁系统▪红外摄像机、打猎机▪工业领域安防、报警▪智能楼宇、智能照明、智能家居▪可编程检测机制及工作模式▪兼容差模、共模PIR信号输入方式▪宽电压工作范围1.4V~3.6V ▪极低的工作电流，3µA典型值@3V ▪ADC灵敏度6.5µV/bit ▪内置2.2V稳压电源输出▪片上温度传感器可实现温度补偿▪I2C通信接口▪内置存储单元及OTP▪无线人体入侵传感器▪电池供电的智能门禁系统▪红外摄像机、打猎机▪工业领域安防、报警▪智能楼宇、智能照明、智能家居主要特点应用领域封装典型应用电路数字可编程热释电传感器信号调理芯片|M8601▪可编程检测机制及工作模式▪兼容差模、共模PIR信号输入方式▪宽电压工作范围1.4V~3.6V▪极低的工作电流，3µA典型值@3V ▪ADC灵敏度6.5µV/bit▪内置2.2V稳压电源输出▪片上温度传感器可实现温度补偿▪可在线监控芯片供电电压主要特点内置存储单元、数字可编程型热释电传感器信号调理芯片|M8602应用领域封装典型应用电路▪无线人体入侵及人体存在监测▪池供电的智能门禁系统▪红外摄像机、打猎机▪工业领域安防、报警主要特点典型应用电路1-检测人体移动（M9601芯片外置）数字可编程热释电传感器信号调理芯片|M9601应用领域▪可编程检测机制及工作模式▪兼容差模、共模PIR信号输入方式▪宽电压工作范围1.4V~3.6V▪极低的工作电流，3µA典型值@3V▪ADC灵敏度6.5µV/bit▪内置2.2V稳压电源输出▪片上温度传感器可实现温度补偿▪可在线监控芯片供电电压典型应用电路2-检测人体存在（M9601芯片内置）▪DFN8L2X2-0.55▪圆晶▪DFN8L2X2-0.55▪圆晶▪远程非接触测温▪紧凑型耳温枪/额温抢▪红外测温仪▪可穿戴设备▪热电堆MEMS单元直接相连▪兼容差模、共模PIR信号输入方式▪宽电压工作范围1.4V~3.6V ▪极低的工作电流，最大10µA工作电流▪ADC灵敏度0.8µV/bit ▪极高的电源抑制系数(PSR)▪内置片上温度传感器可实现温度补偿▪I2C总线信接口模式▪远程非接触测温▪紧凑型耳温枪/额温抢▪红外测温仪▪可穿戴设备主要特点应用领域封装典型应用电路单通道热电堆传感器信号调理芯片|M1801主要特点▪热电堆MEMS单元直接相连▪兼容差模、共模PIR信号输入方式▪宽电压工作范围1.4V~3.6V▪极低的工作电流，最大10µA工作电流▪ADC灵敏度0.8µV/bit▪极高的电源抑制系数(PSR)▪内置片上温度传感器可实现温度补偿▪兼容单线通信接口模式(DOCI)单通道热电堆传感器信号调理芯片|M3801应用领域封装典型应用电路/上海上海市浦东新区祖冲之路2305号B 幢515室电话：************苏州江苏省苏州市工业园区金鸡湖大道1355号国际科技园二期A203-5 嘉善浙江省嘉兴市嘉善县滨江路6号2幢电话：************* 联系我们Contact us。

电源管理芯片AXP173 Datasheet

17H 38H
9.10 Host接口及中断(Host Interface and IRQ) ................................................................................... 27
18H 39H
9.11 寄存器(Registers) ........................................................................................................................பைடு நூலகம்.... 28
0H 21H
2．特性(Feature) ................................................................................................................................................ 4
目录 1．概述(Summary) ............................................................................................................................................ 3
19H 40H
10. 封装(Package) ........................................................................................................................................... 44

锂离子电池产品规格书说明书

History of specification规格书修订记录Date Contents Remarks 2018-05-12First issue A0Content/目录1.Scope/适用范围Page42.Cell Specification/电芯规格说明Page4/53.Battery/Cell performance test Criteria/电池性能标准Page6 3.1Appearance inspection by visual/外观目测Page6 3.2Environmental test condition/外界环境条件Page6 3.3Electrical characteristics/电气特性Page6 3.4Mechanical characteristics/机械特性Page73.5Safety performance/安全性能Page7/84.Cell initial Dimensions/电芯初始尺寸Page84.2Picture of assembled battery组合电池图5.Protection Circuit保护电路5.1PCM parameter PCM参数6.Circuit topology Drawing and PIN Explanation电路布线图和焊盘说明6.1PCM BOM保护板物料清单6.2Assembled cell parameters包装后电芯组参数附录Page9 Page9 Page9 Page10 Page10 Page101.Scope/适用范围2.Cell Specification/电芯产品规格No.Item项目Specification性能1Rated Capacity额定容量3000mAh,0.2C discharging2Minimum Capacity最小容量3000mAh,0.2C discharging3Normal Voltage标称电压3.70V4O.C.V出厂电压 3.80-4.2V5Charge Ending Voltage充电截止电压4.20±0.03V6Discharge Ending Voltage放电截止电压3.0V7Standard charging method标准充电方式0.5C constant current charge to 4.2V,then constantvoltage4.2V charge till charged current declines to≤0.01C,0℃～45℃8Charge current充电电流Standard charge:0.5CRapid charge:1.0C9charging Time充电时间Standard charge:5.5～6.5hRapid charge:1.5～2.5h10Max.Charging Current最大充电电流1.0C(5℃～+45℃)11Standard dischargingCurrent标准放电电流0.5C constant current discharge to3.0V.10℃～+60℃12Max.Discharging Current最大放电电流1.0C(10℃～+60℃)13Operating environment工作环境Charging:0℃-45℃,65%±25%RHDischarging:10℃-60℃,65%±25%RH14Cell Impedance单电芯内阻＜45mohm，(4.2V AC1KHz measured)15Dimension of Single Cell单电芯尺寸Thickness Max8.0mmWidth Max56.5mmHeight Max60.5mm3.Picture of single cell单体电芯图Items Description Dimension and SpecT电芯厚度Max:8.0mmW电芯宽度Max:56.5mmH电芯长度Max:60.5mmC Tab间距18±2.0mmB Tab宽度 4.0±0.1mmD顶封宽度 4.0±0.5mmA极耳胶外露Max:2.0mmE极耳长度8.0±1.5mmFig.(1)The Dimension of Single Cell图(1)单体电池尺寸图4.Picture of assembled battery组合电池图Fig.(2)The Dimension of Assembled Battery图(2)组合电池外形尺寸图厚度T 宽度W 长度L 线径Ø线型插头型号Max:8.1Max:57.0Max:63.00.9UL1007/24#XH2.54-2P备注：UNIT 单位：MM5.产品规格及电气参数Product Specification and Electrical Parameters序号Item项目Specification性能1Assembled Mode组合方式1P2Normal Capacity标称容量≥3000mAh,0.2C discharging3Normal Voltage标称电压3.7V4Impedance成品内阻＜103mohm，(100%charge AC1KHz measured)5Assembly Dimension装配尺寸Thickness Max8.1mmWidth Max57.0mmHeight Max63.0mm4.Battery/Cell performance test Criteria/电池性能标准4.1Appearance inspection by visual/外观目测There shall be no such defect as rust,leakage,which may adversely affect commercial value of battery.电池外观应没有锈渍、污渍、漏液等影响商业价值的缺陷存在。

ip5306英文规格书

ip5306英文规格书IP5306 English Specification SheetIntroduction:The IP5306 is a highly integrated power management chip designed for portable electronic devices. It provides efficient and reliable power management solutions for various applications. This article aims to provide a comprehensive English specification sheet for the IP5306, detailing its features, specifications, and application examples.1. Features:1.1 Power Input:- Wide voltage input range: 2.5V to 5.5V- Support for various power sources: USB, Li-ion battery, and external DC power1.2 Power Output:- Three adjustable buck converters (BUCK1, BUCK2, BUCK3)- Two fixed voltage linear regulators (LDO1, LDO2)- One 1.2A LDO for battery charging (LDO3)1.3 Battery Management:- Supports single-cell Li-ion/Polymer battery charging- Advanced battery protection features: over-charge, over-discharge, over-current, and short circuit protection- Automatic power path management for seamless power transfer between input and battery1.4 System Control:- Integrated I2C interface for easy control and configuration- Programmable voltage and current limits for buck converters and linear regulators - Fault and status reporting through I2C interface1.5 Safety and Reliability:- Thermal shutdown and overload protection- Under-voltage lockout (UVLO) for reliable power management- High efficiency and low standby current for power-saving operation2. Specifications:2.1 Input Parameters:- Voltage Range: 2.5V to 5.5V- Maximum Input Current: 2A- Input Ripple Rejection: 50dB2.2 Output Parameters:- BUCK1, BUCK2, BUCK3:- Output Voltage Range: 0.8V to 3.3V- Maximum Output Current: 2A each- Output Ripple: 20mV (typical)- LDO1, LDO2:- Fixed Output Voltage: 3.3V- Maximum Output Current: 150mA each- Output Ripple: 10mV (typical)- LDO3:- Output Voltage: 4.2V- Maximum Output Current: 1.2A- Output Ripple: 30mV (typical)2.3 Battery Charging:- Charging Current: 500mA (adjustable)- Charging Voltage: 4.2V (fixed)2.4 Control Interface:- I2C Bus: 1.8V or 3.3V compatible- Maximum Clock Frequency: 400kHz- Address: 7-bit slave address, programmable3. Application Examples:3.1 Mobile Devices:The IP5306 is ideal for use in smartphones, tablets, and portable media players. It provides efficient power management, allowing longer battery life and improved device performance. The adjustable buck converters and linear regulators support various voltage requirements, making it suitable for different components within a mobile device.3.2 Wearable Devices:With its compact size and battery management features, the IP5306 is suitable for wearable devices such as smartwatches, fitness trackers, and wireless earphones. The integrated battery charging circuit ensures safe and efficient charging of the built-in Li-ion/Polymer battery, while the buck converters and linear regulators provide stable power supply to the device components.3.3 Portable Audio Devices:The IP5306 can be used in portable audio devices such as Bluetooth speakers, MP3 players, and portable amplifiers. It offers multiple buck converters to power the audio amplifiers, as well as linear regulators for other components like control circuits and displays. The low standby current and high efficiency help to prolong battery life and optimize audio performance.Conclusion:The IP5306 is a highly versatile and efficient power management chip suitable for a wide range of portable electronic devices. Its comprehensive features, specifications, and application examples make it a reliable choice for product designers and developers. With its advanced battery management capabilities and flexible power output options, the IP5306 simplifies power management and enhances the performance of portable electronic devices.。

上海贝岭 XX1188 power-management IC (PMIc) 说明书

Page 1V1.1DESCRIPTIONThe XX1188 power-management IC (PMIC) is an complete, efficient, compact devices suitable for 3G cellularapplications such as wireless data cards, handsets and PDAs,. It integrates a 2MHz synchronous buck regulator, nine low-dropout linear regulators (LDOs), a RESET generator, and an 32KHZ crystal driver and buffer.XX1188 is housed in a thin QFN4x4-28pin package.APPLICATIONS●3G wireless Cards ● 3G phonesFEATURES● Buck converter for MSMC,1.2V/500mA ● LDO1 for MSME, 1.8V/300mA ● LDO2 for MSMP, 2.6V/300mA ● LDO3 for MEMA, 2.6V/300mA ● LDO4 for TCXO, 2.85V/50mA ● LDO5 for RFTX, 2.1V/300mA ● LDO6 for RFRX, 2.7V/150mA ● LDO7 for USB, 3.3V/50mA● LDO8 for URIM, 3.0v/1.8v, 50mA ● LDO9 for MMC, 3.0V/150mA● Independent ON/OFF control for LDO4,5,6,7,8,9 ● RESET generator● Inverter for 32Mhz crystal oscillator ●QFN4x4-28L packagePIN CONFIGURATIONTYPICAL APPLICATIONPage 2V1.1XX1188ABSOLUTE MAXIMUM RATINGS(Note: Exceeding these limits may damage the device. Exposure to absolute maximum rating conditions for long periods may affect device reliability.)IN1,IN2, IN3 Voltage ............................................................................................................................... .......... –0.3V to 6V EN_, REF, SEL Voltage ........................................................................................................................... .......... –0.3V to 6V LX, LDO7 Voltage ……………………………………………..……………………………………………….... –0.3V to IN1+0.3V LDO1,2,5,6,8 Voltage ………………………………………………………………………………..……… ..... –0.3V to IN1+0.3V LDO3,4,9 Voltage…………………………………………………………….…………………………………. . –0.3V to IN1+0.3V XTALI, XTALO, CLKOUT Voltage ……………………....…………………………………………………. . –0.3V to LDO2+0.3V LX to ground current ……………………………………………………..………...…...………………….…… Internally limited Maximum Power Dissipation…………………………………………………………………………………………….……….1.8W Operating Temperature Range …………………………………………………………………………………...... –40°C to 85°C Storage Temperature Range ………………………………………………………………………………..….. –55°C to 150°CELECTRICAL CHACRACTERISTICSSYSTEM CONTROL(V IN = 5V, unless otherwise specified. Typical values are at TA = 25oC.)600mA DC-DC STEP-DOWN CONVERTER(V IN = 5V, unless otherwise specified. Typical values are at TA = 25oC.)Page 3V1.1XX1188LOW DROPOUT LINEAR REGULATORS(V IN = 5V, unless otherwise specified. Typical values are at TA = 25oC.)CRYSTAL OSCILLATOR DRIVER(V IN = 5V, unless otherwise specified. Typical values are at TA = 25oC.)Page 4V1.1XX1188FUNCTIONAL DESCRIPTIONThe XX1188 power-management IC (PMIC) is an complete, efficient, compact devices suitable for 3G cellular applications such as wireless data cards,handsets and PDAs,. It integrates a 2MHz synchronous buck regulator, nine low-dropout linear regulators (LDOs), a RESET generator, and an 32KHZ crystal driver and buffer.DC-DC Step-Down ConverterThe XX1188 consists of a 2Mhz DC-DC step-down converter that is capable of delivering 600mA output current. It uses a hysteretic control scheme that provides fast switching, low output ripple, high efficiency, and fast transient response with simple setup of externalcomponents. The internal synchronous rectifier eliminates the use of external Schottky.Linear RegulatorsThe XX1188 contains nine low-dropout, low quiescent current, low-operating voltage linear regulators. The maximum output currents for OUT1, OUT2, OUT3, and OUT5 are 300mA, for OUT6 and OUT6, they are 150mA,and for OUT4, OUT7and OUT8 they are 50mA. OUT1, OUT2, OUT3 are enabled after the DC-DC reachesregulation. The rest of the LDOs have enable control pins. Output of LDO8 can also be either 3.3V or 1.8V, depends on the voltage at SEL pin.Crystal DriverThe XX1188 also provides a 32Khz crystal driver and a clock buffer that can be used for the system real time clock.ResetThe XX1188 integrates a 60ms power-on reset generator, reducing system size and cost. nRESET is an open-drain output ; connect a 10kΩ or greater pull -up resistor from nRESET to an appropriate voltage supply. nRESET asserts low upon startup and remains low until the 60ms reset timeout period expires, at which point nRESET goes high-Z.Page 5V1.1XX1188BLOCK DIAGRAMTIMING DIAGRAM*The delay between LDO1 start up after Buck power up is to set min. delay time 250us, typical 350us, max. 500us at25C. This is to guarantee enough delay time for full temperature range, as delay time is about 250us at 85C.Page 6V1.1XX1188PACKAGE OUTLINE。

Richtek RT2613A 电源控制器说明书

RT2613A®Copyright 2015 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.©General DescriptionThe RT2613A is a high efficiency step-down converter and capable of delivering 3A output current over a wide input voltage range from 2.95V to 6V.The RT2613A provides accurate regulation for a variety of loads with ±3% accuracy. For reducing inductor size, it provides up to 2MHz switching frequency. The efficiency is maximized through the integrated 45m Ω MOSFETs and 550μA typical supply current.Under voltage lockout voltage of the RT2613A is 2.7V,and it also provides external setting by a resistor network on the enable pin.The RT2613A provides protections such as inductor current limit under voltage lockout and thermal shutdown.The over temperature threshold is 145°C.The RT2613A is available in WQFN-16L 3x3 package.2.95V to 6V Input, 3A Output, 2MHz, Synchronous Step-Down ConverterFeatures●Integrated 45m Ω MOSFETs ●Input Range : 2.95V to 6V●Adjustable PWM Frequency : 700kHz to 2MHz ●Output Current : 3A ●95% Efficiency●Adjustable Soft-Start ●Power Good Indicator ●Enable Control●Under Voltage Lockout ●Current Limit●Thermal ShutdownApplications●Low-Voltage, High-Density Power Systems ●Distributed Power Systems ●Point-of-Load ConversionsSimplified Application CircuitOrdering InformationNote :Richtek products are :❝ RoHS compliant and compatible with the current require-ments of IPC/JEDEC J-STD-020.❝ Suitable for use in SnPb or Pb-free soldering processes.Marking Information6Z= : Product CodeYMDNN : Date CodeRT2613AG : Green (Halogen Free and Pb Free)V OUTRT2613A©Copyright 2015 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.Function Block DiagramPin Configurations(TOP VIEW)WQFN-16L 3x3GNDGND VIN VIN SW SW SS/TRSW A G N D C O M P F B R T /S Y N CI N N O O TG O O DRT2613A©Copyright 2015 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.OperationThe RT2613A is a synchronous step-down DC/DC converter with two integrated power MOSFETs. It can deliver up to 3A output current from a 2.95V to 6V input supply. The RT2613A's current mode architecture allows the transient response to be optimized over a wider input voltage and load range. Cycle-by-cycle current limit provides protection against shorted outputs and soft-start eliminates input current surge during start-up. The RT2613A is synchronizable to an external clock with frequency ranging from 700kHz to 2MHz. The RT2613A is available in WQFN-16L 3x3 package.High side MOSFET peak current is measured by internal sensing resistor. The Current Signal is where Slope Compensator works together with sensing voltage sensing resistor. The error amplifier adjusts COMP voltage by comparing the feedback signal (V FB ) from the output voltage with the internal 0.827V reference. When the load current increases, it causes a drop in the feedback voltage relative to the reference, the COMP voltage then rises to allow higher inductor current to match the load current.EN ComparatorThe RT2613A is enable when EN pin is higher than 1.25V.It is disable when EN pin lower than 1.18V. There is an internal pull-high current source to charge the EN pin to high when the EN pin is floating.Oscillator (OSC)The internal oscillator that provides switching frequency from 700kHz to 2MHz. It is adjusted using an external timing resistor. It also can be synchronized by an external clock in the range between 700kHz and 2MHz from RT/SYNC pin.PGOOD ComparatorWhen the feedback voltage (V FB ) rises above 93% or falls below 107% of reference voltage the PGOOD open drain output will be high impedance. The PGOOD open drain output will be internally pulled low when the feedback voltage (V FB ) falls below 88% or rises above 113% of reference voltage.Soft-Start (SS)An internal current source (2.2μA) charges an external capacitor to build the soft-start ramp voltage (V SS ). The V FB voltage will track the V SS during soft-start interval.The Soft-Start setting capacitor (C SS ) for the Soft-Start time (T SS ) can be easily calculated by the following equation :Over Temperature Protection (OTP)The RT2613A implement an internal over temperature protection. When junction temperature is higher than 145°C, it will stop switching. Until the junction temperature decreases below 125°C, the RT2613A will re-soft-start from initial condition.⨯μSS SS T (ms) 2.2 (A)C (nF) =0.827 (V)RT2613A©Copyright 2015 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.Electrical Characteristics(V IN = 5V, C IN = 10μF, T A = −40°C to 85°C, unless otherwise specified)Absolute Maximum Ratings (Note 1)●Supply Input Voltage, VIN ----------------------------------------------------------------------------------------- −0.3V to 7V●Switch Node Voltage, SW ----------------------------------------------------------------------------------------- −0.3V to (V IN + 0.3V)●BOOT to SW --------------------------------------------------------------------------------------------------------- −0.3V to 7V●Other Pins ------------------------------------------------------------------------------------------------------------- −0.3V to (V IN + 0.3V)●Power Dissipation, P D @ T A = 25°CWQFN-16L 3x3-------------------------------------------------------------------------------------------------------2.128W ●Package Thermal Resistance (Note 2)WQFN-16L 3x3, θJA -------------------------------------------------------------------------------------------------47°C/W WQFN-16L 3x3, θJC -------------------------------------------------------------------------------------------------7.5°C/W ●Junction Temperature ----------------------------------------------------------------------------------------------150°C ●Lead Temperature (Soldering, 10 sec.)------------------------------------------------------------------------260°C●Storage T emperature Range -------------------------------------------------------------------------------------- −65°C to 150°C ●ESD Susceptibility (Note 3)HBM (Human Body Model)----------------------------------------------------------------------------------------2kVRecommended Operating Conditions (Note 4)●Supply Input Voltage ------------------------------------------------------------------------------------------------2.95V to 6V ●Junction T emperature Range -------------------------------------------------------------------------------------- −40°C to 125°C ●Ambient T emperature Range -------------------------------------------------------------------------------------- −40°C t o 85°CRT2613A©Copyright 2015 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.Note 1. Stresses beyond those listed “Absolute Maximum Ratings ” may cause permanent damage to the device. These arestress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions may affect device reliability.Note 2. θJA is measured at T A = 25°C on a high effective thermal conductivity four-layer test board per JEDEC 51-7. θJC ismeasured at the exposed pad of the package.Note 3. Devices are ESD sensitive. Handling precaution is recommended.Note 4. The device is not guaranteed to function outside its operating conditions.RT2613A©Copyright 2015 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.Typical Application CircuitTable 1. Recommended Component SelectionV OUTRT2613A©Copyright 2015 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.Typical Operating CharacteristicsReference Voltage vs. Temperature0.800.810.820.830.840.85-50-25255075100125Temperature (°C)R e f e r e n c e V o l t a g e (V )Frequency vs. Temperature9009209409609801000-50-25255075100125Temperature (°C)F r e q u e n c y (k H z )Frequency vs. Input Voltage0.920.930.940.950.960.970.980.991.001.011.0233.544.555.56Input Voltage (V)F r e q u e n c y (M H z )Efficiency vs. Output Current1020304050607080901000.0010.010.1110Output Current (A)E f f i c i e n c y (%)Efficiency vs. Output Current1020304050607080901000.0010.010.1110Output Current (A)E f f i c i e n c y (%)Output Voltage vs. Output Current1.801.811.821.831.841.850.511.522.53Output Current (A)O u t p u t V o l t a g e (V)RT2613A©Copyright 2015 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.Output Ripple Time (500ns/Div)I L (1A/Div)V OUT (10mV/Div)V SW(5V/Div)V IN = 3.3V, V OUT = 1.8V, I OUT = 1ACurrent Limit vs. Temperature6.06.67.27.88.49.0-50-25255075100125Temperature (°C)C u r r e n t L i m i t (A )Current Limit vs. Input Voltage6.06.57.07.58.08.59.033.544.555.56Input Voltage (V)C u r r e n t L i m i t(A )Output RippleTime (500ns/Div)I L (2A/Div)V OUT (10mV/Div)V SW (5V/Div)V IN = 3.3V, V OUT = 1.8V, I OUT = 3AUVLO vs. Temperature2.32.42.52.62.72.82.9-50-25255075100125Temperature (°C)U V L O (V)Enable Threshold Voltage vs. Temperature1.001.081.161.241.321.40-50-25255075100125Temperature (°C)E n a b l e T h r e s h o l d V o l t a g e (V )RT2613A©Copyright 2015 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.6080100120140160180200R RT (k )S w i t c h i n g F r e q u e n c y (k H z )ΩSwitching Frequency vs. R RT3004005006007008009001000R RT (k )S w i t c h i n g F r e q u e n c y (k H z )ΩLoad Transient ResponseI OUT (1A/Div)V OUT(200mV/Div)V IN = 3.3V, V OUT = 1.8V, I OUT = 0A to 3ATime (100μs/Div)Load Transient ResponseTime (100μs/Div)I OUT (1A/Div)V OUT(200mV/Div)V IN = 5V, V OUT = 3.3V, I OUT = 0A to 3ART2613A©Copyright 2015 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.Application InformationThe basic RT2613A application circuit is shown in Typical Application Circuit. External component selection is determined by the maximum load current and begins with the selection of the inductor value and operating frequency followed by C IN and C OUT . The switching frequency range from 700kHz to 2MHz. It is adjusted by using a resistor to ground on the RT/SYNC pin.Output Voltage SettingThe resistive divider allows the FB pin to sense the output voltage as shown in Figure 1.Figure 1. Setting the Output VoltageThe output voltage setting range is 0.827V to 3.6V and the set by an external resistive divider is according to the following equation :⎛⎫+ ⎪⎝⎭OUT FB R1V = V 1R2where V FB is the feedback reference voltage 0.827V (typ.).Inductor SelectionFor a given input and output voltage, the inductor value and operating frequency determine the ripple current. The ripple current ΔI L increases with higher V IN and decreases with higher inductance :⎡⎤⎡⎤∆⨯-⎢⎥⎢⎥⨯⎣⎦⎣⎦OUT OUT L OSC IN V V I =1f L V Having a lower ripple current reduces the ESR losses in the output capacitors and the output voltage ripple. Highest efficiency operation is achieved at low frequency with small ripple current. This, however, requires a large inductor. A reasonable starting point for selecting the ripple current is ΔI L = 0.4 (IMAX). The largest ripple current occurs at the highest V IN . To guarantee that the ripple current stays below a specified maximum, the inductor value should be chosen according to the following equation :⎡⎤⎡⎤⨯-⎢⎢⎥⨯∆⎣⎦⎣⎦OUT OUT OSC L(MAX)IN(MAX)V V L =1f I V Input and Output Capacitors SelectionThe input capacitance, C IN , is needed to filter the trapezoidal current at the source of the top MOSFET. A low ESR input capacitor with larger ripple current rating should be used for the maximum RMS current. RMScurrent is given by :RMS OUT(MAX)I = I This formula has a maximum at V IN = 2V OUT , where I RMS =I OUT / 2. This simple worst case condition is commonly used for design because even significant deviations do not offer much relief. Note that ripple current ratings from capacitor manufacturers are often based on only 2000hours of life, which makes it advisable to either further derate the capacitor or choose a capacitor rated at a higher temperature than required. Several capacitors may also be placed in parallel to meet size or height requirements in the design. The selection of C OUT is determined by the effective series resistance (ESR) that is required to minimize voltage ripple, load step transients, and the amount of bulk capacitance that is necessary to ensure that the control loop is stable. Loop stability can be examined by viewing the load transient response as described in a later section. The output ripple, ΔV OUT , is determined by :⎡⎤∆≤∆+⎢⎥⎣⎦OUT L OSC OUT 1V I ESR 8f C Using Ceramic Input and Output CapacitorsHigher values, lower cost ceramic capacitors are nowbecoming available in smaller case sizes. Their high ripple current, high voltage rating and low ESR make them ideal for switching regulator applications. However, care must be taken when these capacitors are used at the input and output. When a ceramic capacitor is used at the input and the power is supplied by a wall adapter through long wires, a load step at the output can induce ringing at the input, V IN . At best, this ringing can couple with the output and be mistaken as loop instability. At worst, a sudden inrush of current through the long wires can potentially cause a voltage spike at V IN large enough to damage the part.V OUT11DS2613A-01 July 2015RT2613A©Copyright 2015 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.Thermal ConsiderationsFor continuous operation, do not exceed absolute maximum junction temperature. The maximum power dissipation depends on the thermal resistance of the IC package, PCB layout, rate of surrounding airflow, and difference between junction and ambient temperature. The maximum power dissipation can be calculated by the following formula :P D(MAX) = (T J(MAX) − T A ) / θJAwhere T J(MAX) is the maximum junction temperature, T A is the ambient temperature, and θJA is the junction to ambient thermal resistance.For recommended operating condition specifications, the maximum junction temperature is 125°C. The junction to ambient thermal resistance, θJA , is layout dependent. For WQFN-16L 3x3 package, the thermal resistance, θJA , is 47°C/W on a standard JEDEC 51-7 four-layer thermal test board. The maximum power dissipation at T A = 25°C can be calculated by the following formula :P D(MAX) = (125°C − 25°C) / (47°C/W) = 2.128W for WQFN-16L 3x3 packageThe maximum power dissipation depends on the operating ambient temperature for fixed T J(MAX) and thermal resistance, θJA . The derating curve in Figure 2 allows the designer to see the effect of rising ambient temperature on the maximum power dissipation.Figure 2. Derating Curve of Maximum Power Dissipation0.00.40.81.21.62.02.40255075100125Ambient Temperature (°C)M a x i m u m P o w e r D i s s i p a t i o n (W )Layout ConsiderationsFor the best performance of the RT2613A, the following guidelines must be strictly followed.❝The input capacitor should be placed as close as possible to the device pins (VIN and GND).❝The RT/SYNC pin is sensitive. The RT resistor should be located as close as possible to the IC and minimal lengths of trace.❝The SW node is with high frequency voltage swing. It should be kept at a small area.❝Place the feedback components as close as possible to the IC and keep away from the noisy devices.❝The GND and AGND should be connected to a strong ground plane for heat sinking and noise protection.©Copyright 2015 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.12DS2613A-01 July 2015 RT2613AFigure 3. PCB Layout GuideW-Type 16L QFN 3x3 PackageRichtek Technology Corporation14F, No. 8, Tai Yuen 1st Street, Chupei CityHsinchu, Taiwan, R.O.C.Tel: (8863)5526789Richtek products are sold by description only. Richtek reserves the right to change the circuitry and/or specifications without notice at any time. Customers should obtain the latest relevant information and data sheets before placing orders and should verify that such information is current and complete. Richtek cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Richtek product. Information furnished by Richtek is believed to be accurate and reliable. However, no responsibility is assumed by Richtek or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Richtek or its subsidiaries.DS2613A-01 July 13。

Cree PLCC6 3合1表面贴装LED CLP6C-FKB产品技术数据表说明书

CLD-CT933.002Cree ® PLCC6 3 合 1 表面贴装 LED CLP6C-FKBE E .C O M /H B产品说明Cree PLCC 全彩 LED 采用行业标准封装形式，能提供高强度光输出和宽阔的视角。

它们专门针对各种环境条件工作的需要而设计，Cree PLCC 全彩 LED 适用于室内显示屏、装饰照明和娱乐等应用。

特点• 尺寸 (mm)：6.0 x 5.0 • 主波长：红 (619 - 624nm) 绿 (520 - 540nm)(460 - 480nm) • 发光强度 (mcd) 红 (560 - 1120) 绿 (1120 - 2240) 蓝 (280 - 560) • 视角：120 度• 无铅• 符合 RoHS 要求应用• 全彩显示屏• 装饰照明• 娱乐= 25°C)绝对最大额定值 (TA注： 1.单色光。

2.脉宽 ≤0.1 毫秒，周期 ≤1/10。

= 25°C)典型电气和光学特征 (TA光强分档范围 (IF= 20 mA)颜色分档范围 (IF = 20 mA)发光强度测量值的公差为 ±10%。

主波长测量值的公差为 ±1 nm。

订购代码表*注：1. 上面的套件编号代表的订购代码包含多个光强分档和颜色分档代码。

每个卷盘只发运一个光强分档代码和一个颜色分档代码。

订购单个光强分档代码和单个颜色分档代码将有数量要求。

例如，K - N 之间的任意一个光强分档指的是 Cree 将只发运一个光强分档 (K 或 M 或 N)。

例如，G7 - Ga 之间任意一个颜色分档指的是 Cree 将只发运一个颜色分档 (G7 或 G8 或 G9 或 Ga)。

2.请参阅 “Cree LED 灯可靠性测试标准” 文档了解可靠性测试条件。

3.请参阅 “Cree LED 灯焊接和处理” 文档了解如何安全地使用本 LED 产品。

图形图形外形尺寸所有尺寸的单位均为 mm。

MC33661中文资料

3
WAKE
Wake Input
A high-voltage input used to wake up the device from sleep mode.
4
TXD
Transmitter Input MCU interface to control the state of the LIN output.
33661 4
MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA
For More Information On This Product, Go to:
元器件交易网 Freescale Semiconductor, Inc.
Advance Information
LIN Enhanced Physical Interface
Local Interconnect Network (LIN) is a serial communication protocol designed to support automotive networks in conjunction with Controller Area Network (CAN). As the lowest level of a hierarchical network, LIN enables cost-effective communication with sensors and actuators when all the features of CAN are not required.
8.0 to 20
°C
Notes 1. ESD1 testing is performed in accordance with the Human Body Model (CZAP = 100 pF, RZAP = 1500 Ω). 2. ESD2 testing is performed in accordance with the Machine Model (CZAP = 220 pF, RZAP = 0 Ω). 3. Terminal soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may cause malfunction or permanent damage to the device.

纽扣电池

深圳市迈洛克实业有限公司
SHENZHEN M&LAK INDUSTRY CO., LTD.
深圳市宝安 43 区广深路新安段 247 号五楼
Tel: +86-755-27863350、351
Fax: +86-755-27863550、820、821
E-mail: battery@

Tel: +86-755-27863350、351
Fax: +86-755-27863550、820、821
E-mail: battery@

1. 范围本承认书的各种技术参数仅适用于 3V 锂锰扣式电池 CR2032，该电池由深圳市迈洛克实业有限公司生产。
表三：
序号
测试项目
测试方法
标准
用精确度大于 0.02mm 的游标卡尺测试直径 20.00(-0.20)mm
1
外形尺寸
时，为防止电池短路，卡尺的一端卡头上应贴上一层绝缘材料
高度
3.20(-0.2 0) mm
2
开路电压
万用表的精确度不低于 0.25%，内阻大于 1MΩ
≥3.20 V
3
瞬时短路电流
类别
正极
ITEM Anode
负极
Cathode
电解液
外壳
其它
Electrolyte
Rind others
成份二氧化锰石墨粉金属锂乙二醇二甲醚丙二醇碳酸酯高氯酸锂不锈钢带隔离层黑胶料
ELEMENT Manganese Dioxide Powder
Colloid Graphite Powder Lithium slice
2. 技术参数表一：项目