Training Process ESEC 2009SSI Level 3 中文版

Presentation Name
company confidential
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Machine working principle 机器工作原理
特点 Single or dual wire mode Fully motorized in X, Y, Z Solder wire diameter range
Welcome to the World of
Soft Solder Process Training 2009SSI
Softsolder Technology
Time Planning
09:00AM – 09:30AM 09:30AM – 10:00AM 10:30AM – 10:45AM 10:45AM – 11:15AM 11:15PM – 12:00PM 13:30PM – 14:30PM 14:45PM – 15:00PM 15:00PM – 17:00PM
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<Name Presentaion>
Presentation Name
company confidential
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Machine Overview
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<Name Presentaion>
Presentation Name
company confidential
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Flow of Material材料流程
Leadframe 框架
Solder wire 焊锡丝
Wafer晶元
Die Bonded Leadframes Loaded in magazine 粘有芯片的框架装载 入料盒中
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<Name Presentaion>
Presentation Name
Machine Overview
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<Name Presentaion>
Presentation Name
company confidential
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Machine Overview
Dicing Die attach * Cure/Clean Wire bond
* not for soft solder
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Machine working principle 机器工作原理
Temperature
Static 静态 (轨道延迟时间10000毫秒)
Dynamic 动态 (实际生产速度)
机器默认温度设定：280；340；380；380；380；380；380；280
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<Name Presentaion>
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<Name Presentaion>
Presentation Name
company confidential
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Machine Overview
Processes 过程
Solder dispensing Dispense 下锡 Bond 装片
下焊锡
Pick抓片 Leadframe框架 Chip芯片
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<Name Presentaion>
Presentation Name
company confidential
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Machine working principle 机器工作原理
TOS
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<Name Presentaion>
Presentation Name
company confidential
Molding Back-end assembly flow Marking Plating Trim/Form Inspection Deflash
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<Name Presentaion>
Presentation Name
company confidential
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Machine Overview
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<Name Presentaion>
Presentation Name
company confidential
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LEVEL 1 Training
• Machine module instruction 机器模块介绍 • Machine working principle 机器工作原理 • D/A related material D/A有关的材料 • Cavity tool design principle 压模头设计原理 • Soft solder process principle 软焊料工艺原理
(standard 12-40 mil, 10 and 50 mil on request)
Individual programmable XY position Independent wire feed drives Automatic park – and service position Touchdown or distance mode Die side ratio of up to 2:1 Single wire mode
company confidential
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Machine Overview
Material材料
Leadframe 框架: made of copper 铜 plated with Ag银, Ni镍, or bare Cu铜 stacked in magazines 装载在料盒中 single row/matrix 单排或多排 Chip: made of silicon硅/Gallium镓 Arsenide砷 on wafers (sticky foil in a frame) chip size 1-15 mm wafer size 6“& max 12 “ Solder wire: Lead(Pb)铅 based Tin锡 Based
Increase of capillary attraction 毛细管效应力增加 Cleaning effect - reducing of oxides on L/F surface 清除效果 – 减少框架表面的氧化
Solder bleed out 焊料的溢出
T- / bleed out Increase the solder viscosity 增加焊料的粘性
Pick 抓片: remove chip from foil (careful handling of chip) 从蓝膜上抓走芯片
Bond 装片: place chip on leadframe (precise placement, defined force,Bond time) 把芯片放到框架上 （位置精度；压力设定；装片时间）
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<Name Presentaion>
Presentation Name
company confidential
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Machine working principle 机器工作原理
• TOS 进料装置 • Temperature 温度控制 • Dispenser 点锡系统 • MPPM 压模系统 • Needle and Chip Sensor 顶针与芯片感应器 • Pick Process 抓片工艺控制 • Bond Process 装片工艺控制
Temperature profile Calibration concept (Target TC1: 380°C) Tc1 = Temperature setting ± 5 °C 优化温度 TSetting = 380 °C 设定温度 TMeasure = 373 °C 实际测量温度（框架） C0Factor = 1.03 原始补偿系数 TSetting – TMeasure TSetting
C1Factor =
应补偿系数
CCalib factor = C0Factor + C1Factor
C1Factor = (380 – 373) / 380 = 0.018 ≈ 0.02 CCalib factor = 1.03 + 0.02 = 1.05
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<Name Presentaion>
Presentation Name
company confidential
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Machine working principle 机器工作原理
Temperature profile
Heating zoneБайду номын сангаас （Standard）
zone 1: 280 °C zone 2: 340 °C zone 3: 380 °C zone 4: 380 °C zone 5: 380 °C zone 6: 380 °C zone 7: 380 °C zone 8: 280 °C
Dispensing
Bonding
Temperature control
± 5 °C at DP / PP / BP
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<Name Presentaion>
Presentation Name
company confidential
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Machine working principle 机器工作原理
Training Room
2007SSI Maintenance instruction
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<Name Presentaion>
Presentation Name
company confidential
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Warning
• This training documentation is strictly company confidential! • For internal use only. • No handouts will be delivered. Please take your personal notes according.
<Name Presentaion>
Presentation Name
company confidential
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Machine working principle 机器工作原理
Dispenser
Touch Mode 接触模式
Distance Mode 长度模式
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<Name Presentaion>
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<Name Presentaion>
Presentation Name
company confidential
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LEVEL 1 Training
• Machine module instruction 机器模块介绍 • Machine working principle 机器工作原理 • D/A related material D/A有关的材料 • Cavity tool design principle 压模头设计原理 • Soft solder process principle 软焊料工艺原理
Voids 空洞
T+ / voids +
Increase the reactivity between solder and die backside 增加焊料与晶片背面的化 学反应 Dissolving the die backside metallization 溶解芯片背面的镀金层
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Training Room Training Room
Training and Machine module instruction Machine working principle Broken rest
Training Room Training Room Training Room
D/A related material Cavity tool design principle and order process Soft solder process principle Broken rest
Presentation Name
company confidential
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Machine working principle 机器工作原理
Influence of temperature on bond process 温度对装片工艺的影响
Solder backflow 焊料的回流
T+ / backflow +
Wafer晶元
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<Name Presentaion>
company confidential
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Machine Overview
Processes
Dispense 焊锡分配: Melt solder on the BondPad (defined quantity; precise pattern) 焊料熔解在框架上 （定量；精确成型）