List of Figures and Tables Figure Page
历史学毕业论文怎么写(全面分析)
历史学毕业论文怎么写(全面分析)看到"毕业论文";这几个字,同学们心里会不会感到一点点的恐惧呢?下面,给你总结出了一些写论文的基本经验,大家赶紧收藏慢慢往下看!01.历史学毕业论文基础要求第一:字体常见的统一格式是:times new roman字体,小四第二:排版1.5倍行距以及常见的或者是APA格式,Oxford格式(牛津格式)Harvard格式(哈佛格式)第三:用词不能使用的一些词汇与不用缩写的词汇。
不能使用的词汇包括:I/WE/OUR/YOU/YOUR等使用第一人称或第二人称,保持论证的客观性,否则会造成学术论文不严谨。
不能缩写的词汇包括:can"t/don' t/didn' t/wouldn' t应该写成cannot/do not/did not/would not.02.历史学毕业论文的整体结构1. 首先是CoverPage,即封面(自成一页)包括论文的题目,作者,所在学院、字校、字数、学生号和上交时间等信息,每个大学要求的格式会不一样,同字们要根据自己的老师要求来写。
2. Declaration,也就是声明(自成一页),"我声明,所有成果除了我已注释的参考目录,其他均为我自己的研究成果,没有剽窃他人的";,之后是个人签名,这里需要再次强调自己所研究的和调查是自己完成没有Copy他人成果,如果老师发现了非常相似的结果可能会直接判定为抄袭作为零分处置,在英国每一个学生提交Dissertation 必须要有一份声明,甚至你在申请学校的时候也需要一个真实材料证明。
3. Acknowledgement,写要感谢的人(自成一页),导师是必须感谢的,还可以感谢父母,感谢同学,感谢某公司提供的信息和技术等等,这几点可以根据字生的实际情况进行撰写。
4. Content,目录(自成一页),这个要两端对齐,整体格式一致,用Word中的目录索引功能自动生成。
subfigure-多图常用必备宏包文档(texlive自带)
The subfigure Package∗Steven Douglas CochranDigital Mapping Laboratory,School of Computer Science Carnegie-Mellon University,5000Forbes AvenuePittsburgh,PA15213–3890,USAsdc+@2005/03/15AbstractThis article documents the L A T E X package‘subfigure’,which provides sup-port for the inclusion of small,‘sub’,figures and tables.It simplifies the positioning,captioning and labeling of such objects within a single figure or table environment.In addition,this package allows such subcaptions to be written to a List-of-Figures or List-of-Tables if desired.The‘subfigure’package also cooperates with the‘caption’and‘caption2’packages by H.A. Sommerfeldt[1,2],the‘ccaption’and‘tocloft’packages[3,4]by Peter Wil-son,the‘hyperref’package by Sebastian Rahtz[5],the‘captcont’package [6],and should be compatible with all other packages that modify or extend the float environment or the\caption or\label commands.Contents1Introduction4 2The User Interface52.1Format Options (7)2.2Font Size and Style Options (7)2.3Caption Position Options (7)2.4Recent Changes and Backward Compatibility (11)2.5Frequently Asked Questions (13)3Three Examples143.1A Simple Example (15)3.2A More Advanced Example (16)3.3An Example Without Subcaption Text (16)4Customization184.1Changing the Layout (19)4.2Adjusting the Subcaption (19)4.3Adjusting the Subfigure and Subtable Counters (21)4.4Modifying the List-of-Figures and List-of-Tables (22)4.5Aligning Captions Above the Figure (23)4.6Adding Subfloats to New Environments (24)4.7Interaction with Other Parts of L A T E X (25)4.7.1T E X’s“Mouth” (25)4.7.2The Float Environment (25)4.7.3Interaction with Other Packages (26)4.7.4Creating a subfigure Environment (28)5The Code305.1Identification (30)5.2Check for Nasty Classes (30)5.3Check for the hyperref Package (30)5.4Initialization and Shared Constants (31)5.5Subfigure Constants (33)5.6Subtable Constants (34)5.7Declaration of Options (35)5.8Execution of Options (38)5.9The Subfigure and Subtable Commands (38)5.10Patches to the Standard Environment (43)6Acknowledgements462List of Tables1subfigure package options (6)2\subfigure calling arguments (7)3Subfigure spacing changes (12)4Default values of the Subfigure constants (32)List of Figures1Here are twofigures side-by-side (4)2First (5)3Second (5)4–17Subfigure format options.........................8–9 18Subfigure font size options (10)19Subfigure font style options (10)20Subcaption position option[FIGBOTCAP] (11)(a)First caption (11)(b)Second long,long,long,long,long,long,caption (11)21Subcaption position option:[FIGTOPCAP] (11)(a)First caption (11)(b)Second long,long,long,long,long,long caption (11)22Three subfigures (15)(a)First (15)(b)Secondfigure (15)(c)Third (15)23Two subfigures (17)23.1First (17)23.2Second (17)24A set of four subfigures (17)25Subfigure and subtable layout (20)(a)Standard layout[FIGBOTCAP]or[TABBOTCAP] (20)(b)Standard layout[FIGBOTCAP]or[TABBOTCAP]with nocaption present (20)(c)Reversed layout[FIGTOPCAP]or[TABTOPCAP] (20)(d)Reversed layout[FIGTOPCAP]or[TABTOPCAP]with nocaption present (20)26Caption position option:[figtopcap]with changing settings of \subfiguretopcap (23)(a)First caption (23)(b)Second long,long,long,long,long,long,long,long caption..2327Subfigures(a)and(b)show examples of using verbatim text in a subfigure (28)(a)First subcaption (28)(b)Second subcaption (28)3Figure1:Here are twofigures side-by-side.1IntroductionThis package provides support for the manipulation and reference of small or‘sub’figures and tables within a single figure or table environment.1It is convenient to use this package when your subfigures are to be separately captioned,referenced, or when such subcaptions are to be included in the List-of-Figures.Before using the subfigure package,consider the following to see if you really need it.If you simply want to center yourfigure,then you can use\centerline, \centering or the center environment to do so.If yourfigure has a short width or if you wrap yourfigure in a\parbox or a minipage of a short width,then you can place multiplefigures or tables side-by-side.For example,the following will put two images side-by-side in a singlefigure as shown infigure1:2 \begin{figure}%\centering\parbox{1.2in}{...figure code...}%\qquad\begin{minipage}{1.2in}%...figure code...\end{minipage}%\caption{Here are two figures side-by-side.}%\label{fig:1figs}%\end{figure}Further,if you place the caption inside the\parbox or minipage,then the width of the caption will be limited to the width of the parbox or minipage as shown in figures2and3:\begin{figure}%\centering\parbox{1.2in}{%...figure code...\caption{First.}%\label{fig:2figsA}}%\qquad\begin{minipage}{1.2in}%...figure code...\caption{Second.}%\label{fig:2figsB}%\end{minipage}%\end{figure}%Figure2:First.Figure3:Second.For more information on typesettingfigures and tables,see the document“Us-ing Imported Graphics in L A T E X2ε”by Keith Reckdahl[7].2The User InterfaceTo use this package place\usepackage[ options ]{ subfigure }in the preamble of your document.The supported options are shown in table1.Within a figure or table environment,you can use the following commands to \subfigure\subtable create a subfigure or subtable“box”with an optional subcaption underneath.\subfigure[ listentry ][ subcaption ]{ figure }If a subcaption argument is given(including the null subcaption‘[]’)then thesubfigure is labeled with a counter formatted by the command‘\thesubfigure’which returns,by default,‘(a)’,‘(b)’,etc.The counter used for labeling thesubfigures is subfigure and is incremented for each subfigure regardless of whether asubcaption was printed.The internals of the\subtable command are symmetricto those of the\subfigure command.Further,if a List-of-Figures(or List-of-Tables)is generated,then the listentry argument).If supplied by itself,the subcaption is a“moving argument”3and,therefore,any“fragile”commandscontained within it must be\protect’ed.If the listentry is.Note:since the\subfigure and\subtable commands have optional argu-ments,delimited with square brackets,before their required argument,you cannotuse the‘]’character at the top level of either the subcaption or list3See[8,§4.7and§C.1.3]for a more detailed description of“moving arguments”and“fragile”commands.5Table1:subfigure package options.OptionProvides‘normal’subcaptions,this is the default.Causes the label to be a hanging indentation to thesubcaption paragraph.(isu is a synonym for hang.)Causes each line of the paragraph to be separatelycentered.Overrides centerlast.Causes the last line only to be centered.Overridesnooneline.(anne is a synonym for centerlast.)If a subcaptionfits on one line it will,by default,be centered.This option treats a single line like amid-line of a multi-line caption.Causes the subcaption text to be raggedright.Overrides center and centerlast.scriptsize,footnotesize,small,normalsize,large,Largerm,sf,tt,md,bf,up,it,sl,sc,RM,SF,TT,MD,BF,UP,IT,SL,SCSets thefigure or table numbering based on theassumption that thefigure or table caption comesafter the subfigures or subtables.The capitalizedversion also places the subcaption after thefigure(“FIGBOTCAP”and“TABBOTCAP”are thedefault settings).Sets thefigure or table numbering based on theassumption that thefigure or table captionprecedes the subfigures or subtables.Thecapitalized version also places the subcaptionbefore thefigure(“TABTOPCAP”is the preferredtable setting,see section2.3for details).loose,tightTable2:\subfigure calling arguments.\subfigure{...fig...}\subfigure[]{...fig...}(b)..........(b)\subfigure[Subcaption.]{...fig...}(c)Subcaption....(c)Subcaption. \subfigure[][Subcaption.]{...fig...}(d)Subcaption. \subfigure[][]{...fig...}(e)\subfigure[List entry....(f)Subcaption. \subfigure[List entry....(g)(a)Short.(b)This is a long caption of gibberish:Aafas d taed gaihgghn adf irin sadf aetsetsd na.Figure4:Format option[normal].(a)Short.(b)This is a long caption of gibberish:Aafas d taed gaihgghn adf irin sadf aetsetsd na.Figure5:Format option[nooneline].(a)Short.(b)This is a long caption of gibberish:Aafas d taed gaihgghn adf irin sadf aetsetsd na.Figure6:Format option[centerlast];centerlast overrides nooneline.4(a)Short.(b)This is a long caption of gibberish:Aafas d taed gaihgghn adf irin sadfaets etsd na.Figure7:Format option[center];center overrides nooneline and centerlast.(a)Short.(b)This is a long caption of gibberish:Aafas d taed gaihgghn adf irin sadfaets etsd na.Figure8:Format option[hang].(a)Short.(b)This is a long caption of gibberish:Aafas d taed gaihgghn adf irin sadfaets etsd na.Figure9:Format options[hang,nooneline].(a)Short.(b)This is a long caption of gibberish:Aafas d taed gaihgghn adf irin sadfaets etsd na.Figure10:Subfigure format options[hang,centerlast].(a)Short.(b)This is a long caption of gibberish:Aafas d taed gaihgghn adf irin sadfaets etsd na.Figure11:Format options[hang,centerlast,nooneline].(a)Short.(b)This is a long caption of gibberish:Aafas d taed gaihgghn adf irinsadf aets etsd na.Figure12:Format options[hang,center];center overrides centerlast.(a)Short.(b)This is a long caption of gibberish:Aafas d taed gaihgghn adf irinsadf aets etsd na.Figure13:Format options[hang,center,nooneline];center overrides centerlast.(a)Short.(b)This is a long caption of gibberish:Aafas d taed gaihgghn adf irin sadfaets etsd na.Figure14:Format option[raggedright];raggedright overrides center and centerlast.(a)Short.(b)This is a long caption of gibberish:Aafas d taed gaihgghn adf irin sadfaets etsd na.Figure15:Format options[raggedright,noonelirne];raggedright overrides center and centerlast.(a)Short.(b)This is a long caption of gibberish:Aafas d taed gaihgghn adf irinsadf aets etsd na.Figure16:Format options[hang,raggedright];raggedright overrides center and cen-terlast.(a)Short.(b)This is a long caption of gibberish:Aafas d taed gaihgghn adf irinsadf aets etsd na.Figure17:Subfigure format options[hang,raggedright,nooneline];raggedright over-rides center and centerlast.9(a)Font option[scriptsize].(b)Font option[footnotesize].(c)Font option[small].(d)Font option[normalsize].(e)Font option[large].(f)Font option[Large]. Figure18:Subfigure font size options.(Default:footnotesize).(a)Subcaption label font option[rm].(b)Subcaption label font option[sf].(c)Subcaption label font option[tt].(d)Subcaption label font option[md].(e)Subcaption label font option[bf].(f)Subcaption label font option[up].(g)Subcaption label font option[it].(h)Subcaption label font option[sl].(i)Subcaption label font option[sc].(j)Subcaption font option[RM].(k)Subcaption font option[SF]. (l)Subcaption font option[TT]. (m)Subcaption font option[MD]. (n)Subcaption font option[BF]. (o)Subcaption font option[UP]. (p)Subcaption font option[IT]. (q)Subcaption font option[SL]. (r)Subcaption font option[SC].Figure19:Subfigure font style options.(Default:rm,md,up,RM,MD,UP).Note: The above single options are loaded after the default settings and multiple options are allowed,see the text,section2.2.10(a)First caption.(b)Second long,long,long,long,long,long,caption. Figure20:Subcaption position option[FIGBOTCAP].Figure21:Subcaption position option:[FIGTOPCAP].(a)First caption.(b)Second long,long,long, long,long,long caption.following shows only the subfigure-related options,but the subtable options are symmetric.Thefirst option,figbotcap tells the subfigure command that the“containing”figure’s\caption occurs after the subfigures.This information is needed to decide if the currentfigure counter shows the number for the lastfigure(figbotcap)or for the current one(figtopcap,see below).The second option,figtopcap tells the subfigure command that the“containing”figure’s\caption occurs before the subfigures.The subcaption is automatically placed below thefigure for each of these options.The third option,FIGBOTCAP,is similar tofigbotcap,except that it also forces the subcaption to be placed under thefigure.This is the default setting forfigures (and TABBOTCAP for tables)and is shown infigure20.The fourth option,FIGTOPCAP,is similar tofigtopcap,except that it forces the subcaption to be placed above thefigure box.(While not the default,it is the preferred format for tables,which uses the option TABTOPCAP.)An example of this option is shown infigure21.Note that the baseline of the subfigure is along the top of the two subfigures.See section4.5for another way of positioning the caption when captions are placed above thefigure or table.2.4Recent Changes and Backward CompatibilityThere are some significant changes in this version of the subfigure package.One of them was to pack the subfigure tighter together by removing the space at the top of the subfigure at the beginning of a page,or minipage,and to reduce the spacing around the subfigure,see table3.If you have been using an older version of the subfigure package(i.e.,version2.0or eariler)than the default(loose)setting will not cause any change in your existing documents.5Table3:Subfigure spacing changes.subfigure looseValue Option10pt5pt \subfigcapskip10pt—3pt \subfigbottomskip10pt10pt0pt \subfiglabelskip0.33emfore the table and the the subcaptions for tables should be set above the subtable. The following line is all you need in your configurationfile:1\ExecuteOptions{tight,TABTOPCAP}You could also load the subfigure package with the options with the following in your L A T E X preamble:\usepackage[tight,TABTOPCAP]{subfigure}2.5Frequently Asked QuestionsThe four most frequently asked questions about the subfigure package are:1.“My subfigures are not aligned along their bottoms.Why?”Remember!The subfigure package aligns subfigure along their baselines with the subcaption(if any)sticking out above or below.The above problem is usually due to using a minipage,tabular or array environment that,by default,places the baseline at the center of the box that it generates.If the two subfigures are different sizes,or if one subfigure is generated in some other way with its baseline not at the expected place(perhaps an \includegraphics),then the subfigures will be misaligned.One solution is to use the environment options‘[t]’or‘[b]’to move the baseline to the top or bottom rather than the center.2.“How can I get myfigures/subfigures to line up the way I want?”A similar question,but this one is caused by extra whitespace in thesource text generating spaces next to thefigures,and\par’s generated by blanklines.The main thing is be aware that extra whitespace can movefig-ures and subfigures around,sometimes a lot and sometimes just a little so that they look“wrong”.Placing too many‘%’s at the end of the lines is better than too few in thefigure and table environments.(See the discussion of“white space”in section3.)3.“I have too many subfigures for one page,How can I spread them over twoor more pages and continue the numbering?”Option1:Adjust thefigure and subfigure counters(or the table and subtable counters)as needed before and after eachfigure(or table)See,forexample Using Imported Graphics in L A T E X2ε[7,§30].Option2:Use the ccaption package by Peter Wilson[3].Option3:Use the simpler captcont package by Steven Cochran[6].All of these options work well.Of the packages,the ccaption package is bigger and offers more control over what is done(and things to do)at the expense of being a little harder to use.The captcont package is easier to use, but only provides for continuedfloats.134.“Why do I get a garbled caption or an error when I use square brackets?”\subfigure[SHIFT:‘‘register[3]$<<=$3;’’]{...figure text...} Since the\subfigure and\subtable commands have optional arguments, delimited with square brackets,before their required argument,you cannot use the‘]’character at the top level of either the subcaption or list6See chapters7and8of“The T E Xbook”[9]for details.14(a)First.(b)Secondfigure.(c)Third.Figure22:Three subfigures.Figure22contains two top‘subfigures’andfigure22(c).7To suppress significant extra whitespace,you can add some‘%’characters at the end of each line that doesn’t end with a command name.This is more thanis required,but extra‘%’usually don’t cause a problem.The other case where things are not correctly centered is when the subfigure uses only the label for the subcaption.This is often the case when the descriptionfor each subfigure is given in thefigure caption rather than in each subcaption.Inthis case,the default label has the form‘(a)’where the trailing space is definedby\subfiglabelskip.In this case the style should redefine this space as‘0pt’sothat the label is perfectly centered(see section3.3,below for an example).3.1A Simple ExampleThefirst example,shown infigure22,specifies\centering to horizontally center \subfigurethe set of subfigures,and uses\\and some horizontal space(using\qquad)tocontrol the placement of the subfigures.Note that the alignment of the top twosubfigures is along the bottom of thefigure portion of each.\begin{figure}%\centering\subfigure[First.]{...}\qquad\subfigure[Second figure.]{...}\\\subfigure[Third.]{\label{3figs-c}...}%\caption{Three subfigures.}\label{3figs}\end{figure}...Figure~\ref{3figs}contains two top‘subfigures’andfigure~\ref{3figs-c}.3.2A More Advanced ExampleA second example,shown infigure23,demonstrates how to change the subfigurelabels and have the subfigure captions printed in the List-of-Figures.Thefirst\renewcommand changes the reference to\thesubfigure to return both thefigure number and the subfigure number separated with a period.Thenext two\renewcommand’s turn offthe\p@subfigure(since it is now includedin\thesubfigure and adds the colon and space to the subfigure ter inthefile,the lofdepth is set to“2”so allow the subfigure captions to show and the\listoffigures is loaded.Finally,the figure is defined and a little followingtext is given that refers to it.\renewcommand{\thesubfigure}{\thefigure.\arabic{subfigure}}\makeatletter\renewcommand{\p@subfigure}{}\renewcommand{\@thesubfigure}{\thesubfigure:\hskip\subfiglabelskip}\makeatother...\setcounter{lofdepth}{2}\listoffigures...\begin{figure}%\centering\subfigure[First.]{%\label{fig:first}%...}%\qquad\subfigure[Second.]{%\label{fig:second}%...}%\caption{Two subfigures.}\end{figure}...See figures~\ref{fig:first}and\ref{fig:second}.3.3An Example Without Subcaption TextThe last example,shown infigure24,demonstrates a commonly required format \subref\Subref where the subfigure are just labeled and the description occurs in the main caption.This is easy to do by using the“empty”optional caption arguments“[][]”.Thiscreates a label for the subfigure in the text,but it does not show on the List-of-Figures page.However,by default the caption may not be perfectly centered,so\subfiglabelskip is reduced to zero points to ensure that there is not any extraspace hidden in the subcaption.To refer to the subfigure label within the textor the main caption,you can use the\subref command,which is similar to the16List of Figures...23Two subfigures (17)23.1First (17)23.2Second (17)...23.1:First.23.2:Second.Figure23:Two subfigures.Seefigures23.1and23.2.List of Figures...24A set of four subfigures (17)...(a)(b)(c)(d)Figure24:A set of four subfigures:(a)describes thefirst subfigure;(b)describes the second subfigure;(c)describes the third subfigure;and,(d)describes the last subfigure.The text references the mainfigure asfigure24or part of it asfigures24(a)–(c).17\ref command,but does not carry thefigure number.(The\Subref command is the same but sets it with\subcaplabelfont).\subfiglabelskip=0pt...\listoffigures...\begin{figure}%\centering\subfigure[][]{%\label{fig:ex3-a}%...figure code...}%\hspace{8pt}%\subfigure[][]{%\label{fig:ex3-b}%...figure code...}\\\subfigure[][]{%\label{fig:ex3-c}%...figure code...}%\hspace{8pt}%\subfigure[][]{%\label{fig:ex3-d}%...figure code...}%\caption[A set of four subfigures.]{A set of four subfigures:\subref{fig:ex3-a}describes the first subfigure;\subref{fig:ex3-b}describes the second subfigure;\subref{fig:ex3-c}describes the third subfigure;and,\subref{fig:ex3-d}describes the last subfigure.}% \label{fig:ex3}%\end{figure}...The text references the main figure as figure~\ref{fig:ex3}or partof it as figures~\ref{fig:ex3-a}--\subref{fig:ex3-c}.4CustomizationThe following sections describe the internal parameters used by the subfigure pack-age to define the layout of the subfigures or tables,as well as the labels and captions the accompany them.In addition,adjustments to the entries on a“List-of”page and the addition of new float environments are described.Adjusting these values allows extensive customization of the subfigure package. If you want to customize the package,an alternative to actually changing the code is to create a afile called subfigure.cfg and place it anywhere that L A T E X will look for classes or packages.Any changes placed in thefile will affect the predefined parameters and you can override the default settings.Any user options will be processed after thisfile is loaded.In order to change the major commands in the subfigure package with this configurefile,you will need to use the\AtEndOfPackage command to defer that portion of your changes until the end of the package.184.1Changing the LayoutThe layout of the\subfigure or\subtable is defined by several internal valueswhich may be changed to customize appearance of the object.The followingillustration shows the relationship of these values.Figure25(a)shows the standardlayout with the caption following thefigure.Thefigure is vertically centered with\subfigtopskip of space added above,then\subfigcapskip of space is addedbelow thefigure followed by the subcaption and,finally,\subfigbottomskip ofspace added at the bottom.The baseline is located at the bottom of thefigure.It is along this baseline that adjacent subfigure boxes are aligned.Figure25(c)shows the case where the caption precedes thefigure(ie.,\subfiguretopcaptrueor\subtabletopcaptrue).In this case the various boxes and glue are reversed,8except that the\subfigcapskip is increased by\subfigcaptopadj.The othertwo cases,figures25(b)and(d),show the cases where there is no caption.Notethat the\subfigcapskip is left out when there is no caption.Note also,for allof these cases,that the space at the top of the subfigure is automatically removedfor items that are thefirst box in a vertical list or other than thefirst box in ahorizontal list.This allows tighter packing of the subfigures and the full use of thepage or minipage.Each of these values\subfigtopskip,\subfigcapskip,and\subfigbottomskip;as well as\subfigcapmargin and\subfiglabelskip(the latter not shown infig-ure25)may be changed from their defaults(see table4)to adjust the subfigure forthe current layout style.In addition,they may all assume negative values,whichin some cases may solve problems with the layout.Even though these constantsare“skips”,only the last two(\subfigcapmargin and\subfiglabelskip)willshrink or expand since the others assume their natural size in the subfigure boxand arefixed at that size.4.2Adjusting the SubcaptionThe subfigure label has three forms.Thefirst is the one that appears in the\subref\Subref text when you use the\ref command;the second is the one that appears on the List-of-Figures page and may be used to reference individual subfigures within thefigure and subfigure captions,using the\subref or\Subref commands;and thethird is the fully formatted version used under the subfigure as the label part ofthe caption.The\ref command yields the string,saved by the\label command,composed by concatenating the value of\p@subfigure to\thesubfigure.By default theseare defined by:“\thefigure”and“(\alph{subfigure})”,respectively,whichproduces a reference of thefigure number followed by the subfigure letter in paren-theses.The label used on the List-of-Figures page may be retrieved with the\subref command(this value is saved by the\label command when the\label com-mand is used within the scope of the subfigure.This is the string defined(\subfigtopskip )subfigure or subtableBaseline\subfigcapskip←→\subfigcapmargin\subfigbottomskip (a)Standard layout [FIGBOTCAP]or [TABBOTCAP].(\subfigtopskip )subfigure or subtableBaseline \subfigbottomskip(b)Standard layout [FIGBOTCAP]or [TABBOTCAP]with no caption present. (\subfigbottomskip )←→\subfigcapmargin Baseline \subfigcapskip +\subfigcaptopadjsubfigure or subtable\subfigtopskip(c)Reversed layout [FIGTOPCAP]or [TABTOPCAP].Baseline (\subfigbottomskip )subfigure or subtable\subfigtopskip(d)Reversed layout [FIGTOPCAP]or [TABTOPCAP]with no caption present.Figure 25:Subfigure and subtable layout.20by\@@thesubfigure,which,by default,is the value“\thesubfigure”(or“(\alph{subfigure})”).The label used with the subcaption text is defined by the internal value \@thesubfigure,which,by default,has the value“\thesubfigure\hskip\subfiglabelskip”.It is prefixed by\subcapsize\subcaplabelfont and followed by the subcaptiontext which is set with\subcapfont.Note that by default\subcaplabelfont has the default value“{\familydefault \seriesdefault\shapedefault}”.The package options described in table1al-low you to set these values for your paper.If you update the\@subfigure com-mand,you should include any separator character or spacing between the labeland the start of the subcaption text.The default is\hskip\subfiglabelskipplaced after the label.Finally,the text of the subcaption is prefixed by\subcapfont which may be changed using the set of nine lower-case font options described in table1.9One other way of changing the layout of the lapel and caption is by replacingthe\@makesubfigurecaption or\@makesubtablecaption command(which bydefault are identical).4.3Adjusting the Subfigure and Subtable CountersTo create some special effects,such as continuing the subfigure numbering across \c@figure\c@table several pages as part of one long continuedfigure,you can back offthe number change from a caption with the command:\addtocounter{figure}{-1}within the figure environment.In addition,you can adjust for previous subfiguresor subtables with one of the following(here we assume that two subfigures orsubtables appeared in the previous pages:\addtocounter{subfigure}{2}or\addtocounter{subtable}{2}.Two other things that may be necessary,if you switch betweenfigures and tables in the same figure environment(e.g.,by changing\@captype,see sec-tion4.7.2),is to add the command\listsubcaptions following the last sub-figure when the subfigure is using the TOPCAP or topcap option.This is nec-essary toflush the list of subcaptions before the next subfigure or subtable.This also may be necessary if you switch between\figuretopcaptrue and\figuretopcapfalse.The other thing that may be required in some cases,isto reset the subfigure counter by entering:\setcounter{subfigure}{0}This should only be necessary if you are dynamically switching between differentsubfigure options,or changing the\@captype,within afloat environment.。
特斯拉P6产品规格说明书
PB-08482-001_v02 | August 2017 Product BriefDOCUMENT CHANGE HISTORYPB-08482-001_v02Version Date Authors Description of Change01 March 24, 2017 VK, DV Initial release02 August 31, 2017 VK, DV Removed NVIDIA Confidential informationTABLE OF CONTENTS Overview (1)Specifications (3)Product Specification (3)Design Discussion (5)Form Factor (5)MXM PCB Mounting Holes (6)Compute Mode (8)Support Information (9)Certificates and Agencies (9)Certifications (9)Agencies (9)LIST OF FIGURES Figure 1. Tesla P6 Board (2)Figure 2. Tesla P6 Board Outline (5)Figure 3. Mounting Holes (6)LIST OF TABLES Table 1. Product Specifications (3)Table 2. Memory Specifications (4)Table 3. Software Feature Specifications (4)Table 4. Thermal Specifications (4)Table 5. Tesla P6 Board Outline Specifications (6)Table 6. Mounting Holes Specifications (7)Table 7. Compute Mode Settings (8)The NVIDIA® Tesla® P6 is an MXM 3.1 Type B card with a single NVIDIA® Pascal™GP104 graphics processing unit (GPU). It has 16 GB GDDR5 video memory and a 90 Watt maximum power limit.This board is intended for accelerated graphics in virtual remote workstation and virtual desktop environments, as well as for single precision GPU compute tasks. Tesla P6 is specifically optimized for space constrained systems like blade servers.NVIDIA does not ship this board with a cooling solution attached, however NVIDIA does provide thermal specifications for OEMs to design their custom heat sinks.A main feature of the Tesla P6 board is the support of NVIDIA® GRID™ software which includes NVIDIA® GRID™ vGPU™. This technology enables the virtualization of physical GPUs into full-featured virtual GPUs providing maximum performance and scalability.For performance optimization, this board utilizes NVIDIA GPU BOOST™. By adjusting the GPU clock dynamically, maximum performance is achieved within the power cap limit (90 W).Tesla P6 supports H.264 and H.265 hardware encoding, which is particularly important for reducing round-trip latency and image quality for virtual desktops and applications.OverviewFigure 1. Tesla P6 BoardPRODUCT SPECIFICATIONTable 1 provides the product specifications for the Tesla P6 board. Table 1. Product SpecificationsSpecification DescriptionBoard SKU PG418 SKU 200Total board power 90 W (70 W optional)GPU SKU GP104-995IDs DEVID: 0x1BB4SSID: 0x11C6Form Factor MXM 3.1 Type BNVIDIA® CUDA® cores 2048GPU clocks Base 1012 MHz (TGP: 90 W) Boost 1506 MHz (TGP: 90 W)PCI Express interface P0: Gen3 16 lanes, 16.0 GbpsP8: Gen1 16 lanes, 2.5 GbpsSpecificationsTable 2 provides the memory specifications for the Tesla P6 graphics board.Table 2. Memory SpecificationsSpecification DescriptionMemory clock 3003 MHzMemory size 16 GBMemory I/O 256-bitMemory configuration 16 pcs 256M × 16 GDDR5sMemory bandwidth 192.2 GB/sTable 3 provides the software feature specifications.Table 3. Software Feature SpecificationsSpecification DescriptionEEPROM size 4 Mb Serial ROMPCI class code PCI base class: 0x03PCI sub-class: 0x02ECC support Supported (enabled by default)SMBPBI (SMBus Post Box Interface) SupportedTable 4 provides the thermal specifications for the Tesla P6 graphics board.Table 4. Thermal SpecificationsAction T j (°C)GPU shutdown temperature 94GPU slowdown temperature 91GPU maximum operating temperature 89GPU hardware slowdown amount 50%FORM FACTORTesla P6 follows the MXM 3.1 Type B mechanical specifications. For more details on the mechanical specifications, refer to the latest version of the MXM Electromechanical Specification.Figure 2. Tesla P6 Board OutlineTable 5. Tesla P6 Board Outline SpecificationsSymbolmm inchesMinimum Nominal Maximum Minimum Nominal MaximumA1 82.00 3.228A2 70.00 2.756A3 105.00 4.134A4 3.37 3.50 3.63 0.133 0.138 0.143A5 78.37 78.50 78.63 3.085 3.091 3.096A6 3.87 4.00 4.13 0.152 0.157 0.163A7 65.87 66.00 66.13 2.593 2.598 2.604A8 38.87 39.00 39.13 1.530 1.535 1.541MXM PCB MOUNTING HOLESThe module has six holes. Two are used to secure the board to the system and the other four to fasten the thermal solution to the module.Figure 3. Mounting HolesTable 6. Mounting Holes SpecificationsSymbolmm inchesMinimum Nominal Maximum Minimum Nominal MaximumB1 75.00 2.953B2 8.25 0.325B3 54.25 2.136B4 5.50 0.217B5 51.50 2.028B6 3.07 3.20 3.33 0.121 0.126 0.131 B7 3.07 3.20 3.33 0.121 0.126 0.131In contrast to Tesla M6, Tesla P6 is offered only in compute mode. Starting with Pascal-generation boards, switching between graphics and compute mode is no longerrequired. NVIDIA GRID software automatically handles most setting adjustments previously requiring the switch to graphics mode. Nevertheless, ECC must be disabledbefore running NVIDIA GRID software.Table 7 provides details of the compute mode settings.Table 7. Compute Mode SettingsSetting Value NotesClass code 3D Controller This class code indicates to operatingsystems (OS) that the GPU is not intendedfor use as a primary display device. Memory BAR 16 gigabytes Tesla GPUs expose a large memory baseaddress register (BAR) for direct access tothe frame buffer from the CPU, and otherPCI Express devices.I/O base BAR Disabled The GPU need not consume any legacy I/Oresources when used as a non-displaydevice.ECC protection Enabled Error Correcting Code (ECC) is enabled onthe GPU frame buffer to protect againstsingle- and multi-bit memory errors. ECCcan be turned off.CERTIFICATES AND AGENCIESCertifications④Windows Hardware Quality Lab (WHQL):●Certified Windows 7, Windows 8.1, and Windows 10●Certified Windows Server 2008 R2, Windows Server 2012 R2, and Windows Server2016④EU Reduction of Hazardous Substances (EU RoHS)④Joint Industry guide (J-STD) / Registration, Evaluation, Authorization, and Restriction of Chemical Substance (EU) – (JIG / REACH)④Halogen Free (HF)④EU Waste Electrical and Electronic Equipment (WEEE)Agencies④Australian Communications Authority and Radio Spectrum Management Group of New Zealand (C-Tick)④Bureau of Standards, Metrology, and Inspection (BSMI)④Conformité Européenne (CE)④Federal Communications Commission (FCC)④Industry Canada - Interference-Causing Equipment Standard (ICES)④Underwriters Laboratories (cUL, UL)④Voluntary Control Council for Interference (VCCI)NoticeThe information provided in this specification is believed to be accurate and reliable as of the date provided. However, NVIDIA Corporation (“NVIDIA”) does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information. NVIDIA shall have no liability for the consequences or use of such information or for any infringement of patents or other rights of third parties that may result from its use. This publication supersedes and replaces all other specifications for the product that may have been previously supplied.NVIDIA reserves the right to make corrections, modifications, enhancements, improvements, and other changes to this specification, at any time and/or to discontinue any product or service without notice. Customer should obtain the latest relevant specification before placing orders and should verify that such information is current and complete.NVIDIA products are sold subject to the NVIDIA standard terms and conditions of sale supplied at the time of order acknowledgement, unless otherwise agreed in an individual sales agreement signed by authorized representatives of NVIDIA and customer. NVIDIA hereby expressly objects to applying any customer general terms and conditions with regard to the purchase of the NVIDIA product referenced in this specification.NVIDIA products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of the NVIDIA product can reasonably be expected to result in personal injury, death or property or environmental damage. NVIDIA accepts no liability for inclusion and/or use of NVIDIA products in such equipment or applications and therefore such inclusion and/or use is at customer’s own risk.NVIDIA makes no representation or warranty that products based on these specifications will be suitable for any specified use without further testing or modification. Testing of all parameters of each product is not necessarily performed by NVIDIA. It is customer’s sole responsibility to ensure the product is suitable and fit for the application planned by customer and to do the necessary testing for the application in order to avoid a default of the application or the product. Weaknesses in customer’s product designs may affect the quality and reliability of the NVIDIA product and may result in additional or different conditions and/or requirements beyond those contained in this specification. NVIDIA does not accept any liability related to any default, damage, costs or problem which may be based on or attributable to: (i) the use of the NVIDIA product in any manner that is contrary to this specification, or (ii) customer product designs.No license, either expressed or implied, is granted under any NVIDIA patent right, copyright, or other NVIDIA intellectual property right under this specification. Information published by NVIDIA regarding third-party products or services does not constitute a license from NVIDIA to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property rights of the third party, or a license from NVIDIA under the patents or other intellectual property rights of NVIDIA. Reproduction of information in this specification is permissible only if reproduction is approved by NVIDIA in writing, is reproduced without alteration, and is accompanied by all associated conditions, limitations, and notices.ALL NVIDIA DESIGN SPECIFICATIONS, REFERENCE BOARDS, FILES, DRAWINGS, DIAGNOSTICS, LISTS, AND OTHER DOCUMENTS (TOGETHER AND SEPARATELY, “MATERIALS”) ARE BEING PROVIDED “AS IS.” NVIDIA MAKES NO WARRANTIES, EXPRESSED, IMPLIED, STATUTORY, OR OTHERWISE WITH RESPECT TO THE MATERIALS, AND EXPRESSLY DISCLAIMS ALL IMPLIED WARRANTIES OF NONINFRINGEMENT, MERCHANTABILITY, AND FITNESS FOR A PARTICULAR PURPOSE. Notwithstanding any damages that customer might incur for any reason whatsoever, NVIDIA’s aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the NVIDIA terms and conditions of sale for the product.TrademarksNVIDIA, the NVIDIA logo, BOOST, CUDA, GRID, Pascal, and Tesla are trademarks and/or registered trademarks of NVIDIA Corporation in the U.S. and other countries. Other company and product names may be trademarks of the respective companies with which they are associated.Copyright© 2017 NVIDIA Corporation. All rights reserved.。
ESD5V3U1U系列单方向超低电容ESD 瞬态保护扬声器说明书
ESD5V3U1U02LSE6327XTSA1ESD5V3U1U02LRHE6327XTSA1TVS DiodesTransient Voltage Suppressor DiodesESD5V3U1U SeriesUni-directional Ultra-Low Capacitance ESD / Transient Protection Diode ESD5V3U1U-02LSESD5V3U1U-02LRHData SheetRevision 1.0, 2011-05-27FinalEdition 2011-05-27Published byInfineon Technologies AG81726 Munich, Germany© 2011Infineon Technologies AGAll Rights Reserved.Legal DisclaimerThe information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party.InformationFor further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office ().WarningsDue to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office.Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.ESD5V3U1U SeriesRevision HistoryPage or Item Subjects (major changes since previous revision)Revision 1.0, 2011-05-27Trademarks of Infineon Technologies AGAURIX™, BlueMoon™, COMNEON™, C166™, CROSSAVE™, CanPAK™, CIPOS™, CoolMOS™, CoolSET™, CORECONTROL™, DAVE™, EasyPIM™, EconoBRIDGE™, EconoDUAL™, EconoPACK™, EconoPIM™, EiceDRIVER™, EUPEC™, FCOS™, HITFET™, HybridPACK™, ISOFACE™, I²RF™, IsoPACK™, MIPAQ™, ModSTACK™, my-d™, NovalithIC™, OmniTune™, OptiMOS™, ORIGA™, PROFET™, PRO-SIL™, PRIMARION™, PrimePACK™, RASIC™, ReverSave™, SatRIC™, SIEGET™, SINDRION™, SMARTi™, SmartLEWIS™, TEMPFET™, thinQ!™, TriCore™, TRENCHSTOP™, X-GOLD™, XMM™, X-PMU™, XPOSYS™.Other TrademarksAdvance Design System™ (ADS) of Agilent Technologies, AMBA™, ARM™, MULTI-ICE™, PRIMECELL™, REALVIEW™, THUMB™ of ARM Limited, UK. AUTOSAR™ is licensed by AUTOSAR development partnership. Bluetooth™ of Bluetooth SIG Inc. CAT-iq™ of DECT Forum. COLOSSUS™, FirstGPS™ of Trimble Navigation Ltd. EMV™ of EMVCo, LLC (Visa Holdings Inc.). EPCOS™ of Epcos AG. FLEXGO™ of Microsoft Corporation. FlexRay™ is licensed by FlexRay Consortium. HYPERTERMINAL™ of Hilgraeve Incorporated. IEC™ of Commission Electrotechnique Internationale. IrDA™ of Infrared Data Association Corporation. ISO™ of INTERNATIONAL ORGANIZATION FOR STANDARDIZATION. MATLAB™ of MathWorks, Inc. MAXIM™ of Maxim Integrated Products, Inc. MICROTEC™, NUCLEUS™ of Mentor Graphics Corporation. Mifare™ of NXP. MIPI™ of MIPI Alliance, Inc. MIPS™ of MIPS Technologies, Inc., USA. muRata™ of MURATA MANUFACTURING CO., MICROWAVE OFFICE™ (MWO) of Applied Wave Research Inc., OmniVision™ of OmniVision Technologies, Inc. Openwave™ Openwave Systems Inc. RED HAT™ Red Hat, Inc. RFMD™ RF Micro Devices, Inc. SIRIUS™ of Sirius Sattelite Radio Inc. SOLARIS™ of Sun Microsystems, Inc. SPANSION™of Spansion LLC Ltd. Symbian™ of Symbian Software Limited. TAIYO YUDEN™ of Taiyo Yuden Co. TEAKLITE™ of CEVA, Inc. TEKTRONIX™ of Tektronix Inc. TOKO™ of TOKO KABUSHIKI KAISHA TA. UNIX™of X/Open Company Limited. VERILOG™, PALLADIUM™ of Cadence Design Systems, Inc. VLYNQ™ of Texas Instruments Incorporated. VXWORKS™, WIND RIVER™ of WIND RIVER SYSTEMS, INC. ZETEX™ of Diodes Zetex Limited.Last Trademarks Update 2010-06-09ESD5V3U1U SeriesTable of Contents Table of ContentsTable of Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4 List of Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 List of Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 1Uni-directional Ultra-Low Capacitance ESD / Transient Protection Diode . . . . . . . . . . . . . . . . . . 7 1.1Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 1.2Application Examples . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2Product Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 3.1Electrical Characteristics at T A = 25 °C, unless otherwise specified . . . . . . . . . . . . . . . . . . . . . . . . . . 83.2Typical Characteristics at T A=25°C, unless otherwise specified . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 4Application Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 5Ordering Information Scheme (Examples) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 6Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 6.1PG-TSSLP-2-1 (mm)[3] . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 6.2PG-TSLP-2-7 (mm)[3] . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18Terminology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20ESD5V3U1U SeriesList of Figures List of FiguresFigure 1Pin Configuration and Schematic Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Figure 2Definitions of Electrical Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Figure 3Reverse current I R = f(T A) , V R = 5.3 V, from pin 1 to pin 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Figure 4Line capacitance C L = f(V R), f = 1MHz, from pin 1 to pin 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Figure 5Line capacitance C L = f(f), from pin 1 to pin 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Figure 6Line capacitance C L = f(T A), from pin 1 to pin 2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Figure 7Clamping voltage V TLP = f(I TLP), from pin 1 to pin 2[1]. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Figure 8Forward clamping voltage V TLP = f(I TLP), from pin 2 to pin 1[1] . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Figure 9IEC61000-4-2: V CL = f(t), 8 kV positive pulse from pin 1 to pin 2. . . . . . . . . . . . . . . . . . . . . . . . . . 13 Figure 10IEC61000-4-2: V CL = f(t), 8 kV negative pulse from pin 1 to pin 2 . . . . . . . . . . . . . . . . . . . . . . . . . 13 Figure 11IEC61000-4-2: V CL = f(t), 15 kV positive pulse from pin 1 to pin 2. . . . . . . . . . . . . . . . . . . . . . . . . 14 Figure 12IEC61000-4-2: V CL = f(t), 15 kV negative pulse from pin 1 to pin 2 . . . . . . . . . . . . . . . . . . . . . . . . 14 Figure 13Single line, uni-directional ESD / Transient protection[2]. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Figure 14Ordering information scheme. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Figure 15PG-TSSLP-2-1: Package overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17 Figure 16PG-TSSLP-2-1: Footprint. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Figure 17PG-TSSLP-2-1: Packing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Figure 18PG-TSSLP-2-1: Marking (example) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17 Figure 19PG-TSLP-2-7: Package Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18 Figure 20PG-TSLP-2-7: Footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Figure 21PG-TSLP-2-7: Packing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Figure 22PG-TSLP-2-7: Marking (example) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18ESD5V3U1U SeriesList of Tables List of TablesTable 1Ordering Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Table 2Maximum Rating at T A = 25 °C, unless otherwise specified. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Table 3DC Characteristics at T A = 25 °C, unless otherwise specified . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Table 4RF Characteristics at T A = 25 °C, unless otherwise specified . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Table 5ESD Characteristics at T A = 25 °C, unless otherwise specified . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9ESD5V3U1U SeriesUni-directional Ultra-Low Capacitance ESD / Transient Protection Diode1Uni-directional Ultra-Low Capacitance ESD / Transient Protection Diode1.1Features•ESD / Transient protection of high speed data lines exceeding –IEC61000-4-2 (ESD): ±20 kV (air / contact)–IEC61000-4-4 (EFT): 2.5 kV / 50 A (5/50 ns)–IEC61000-4-5 (surge): 3 A (8/20 μs)•Maximum working voltage: V RWM = 5.3 V •Ultra low capacitance: C L = 0.4 pF (typical)•Low clamping voltage, low dynamic resistance R DYN = 0.6 Ω (typical)•Very small form factor down to 0.62 x 0.32 x 0.31 mm 3•Pb-free (RoHS compliant) and halogen free package1.2Application Examples•USB 2.0, Mobile HDMI Link, MDDI, MIPI, etc.•HDMI, DisplayPort, DVI, Ethernet, Firewire, S-ATA2Product DescriptionTable 1Ordering InformationTypePackage Configuration Marking codeESD5V3U1U-02LSPG-TSSLP-2-11 line, uni-directional L ESD5V3U1U--02LRH PG-TSLP-2-7 1 line, uni-directionalE5ESD5V3U1U SeriesCharacteristics3Characteristics3.1Electrical Characteristics at T A = 25 °C, unless otherwise specifiedTable 2Maximum Rating at T A = 25 °C, unless otherwise specifiedParameterSymbolValues UnitMin.Typ.Max.ESD (air / contact) discharge 1)1)V ESD according to IEC61000-4-2V ESD ––20kV Peak pulse current (t p = 8/20 μs)2)2)I PP according to IEC61000-4-5I PP ––3A Operating temperature range T OP -55–125°C Storage temperatureT stg-65–150°CTable 3DC Characteristics at T A = 25 °C, unless otherwise specifiedParameterSymbolValues UnitNote /Test Condition Min.Typ.Max.Reverse working voltage V RWM –– 5.3V Pin 1 to Pin 2Breakdown voltage V BR 6––V I BR = 1 mA, from Pin 1to Pin 2Reverse currentI R–<10100nA V R = 5.3 V, from Pin 1to Pin 2ESD5V3U1U SeriesCharacteristicsTable 4RF Characteristics at T A = 25 °C, unless otherwise specifiedParameterSymbolValues UnitNote /Test ConditionMin.Typ.Max.Line capacitance 1)1)Total capacitance line to groundC L –0.40.6pF V R = 0 V, f = 1 MHzSerie inductanceL S–0.2–nH ESD5V3U1U-02LS –0.4–nHESD5V3U1U-02LRHTable 5ESD Characteristics at T A = 25 °C, unless otherwise specifiedParameterSymbolValues UnitNote /Test ConditionMin.Typ.Max.Clamping voltageV CL –19–V I PP = 16 A,from Pin 1 to Pin 2–28–V I PP = 30 A,from Pin 1 to Pin 2Forward clamping voltage V FC–10–V I PP = 16 A,from Pin 2 to Pin 1–17–V I PP = 30 A,from Pin 2 to Pin 1Dynamic resistance 1)1)Please refer to Application Note AN210[1]. TLP parameter: Z 0 = 50 Ω , t p = 100ns, t r = 300ps, averaging window: t 1 = 30 ns to t 2 = 60 ns, extraction of dynamic resistance using least squares fit of TLP charactertistics between I PP1 = 10 A and I PP2 = 40 A.R DYN–0.6–VPin 1 to Pin 2–0.5–V Pin 2 to Pin 13.2Typical Characteristics at T A=25°C, unless otherwise specifiedR A RL RLL ATLP TLPTLP TLPCLCLCLCLApplication Information 4Application InformationApplication_ESD5V3U1U-02xxx.vsdFigure 13Single line, uni-directional ESD / Transient protection[2]Ordering Information Scheme (Examples)5Ordering Information Scheme (Examples)Figure 14Ordering information schemeESDXX = Pin number (i.e.: 02 = 2 pins; 03 = 3 pins)YY = Package family:LS = TSSLP LRH = TSLP S = SOT363U = SC74XX = Application family :LC = Low Clamp HDMIni-/ B i-directional or R ail to R ail protection V RWM in V: (i.e.: 5V3 = 5.3V)ESD XX = Pin number (i.e.: 02 = 2 pins; 03 = 3 pins)YY = Package family:LS = TSSLP LRH = TSLPR adio F requency ApplicationsC L in pF: (i.e.: 0P1 = 0.1pF)umber of protected lines (i.e.: 1 = 1 line ; 4 = 4 lines)S tandard (>10pF), L ow (<10pF), U ltra-low (<1pF)6Package Information6.1PG-TSSLP-2-1 (mm)[3]Figure 15PG-TSSLP-2-1: Package overviewFigure 16PG-TSSLP-2-1: FootprintFigure 17PG-TSSLP-2-1: PackingFigure 18PG-TSSLP-2-1: Marking (example)TSSLP-2-1,-2-PO V05+0.010.311) Dimension applies to plated terminalmarkingBottom viewTop viewCopper Solder maskStencil aperturesTSSLP-2-1,-2-FP V026.2PG-TSLP-2-7 (mm)[3]Figure 19PG-TSLP-2-7: Package OverviewFigure 20PG-TSLP-2-7: FootprintFigure 21PG-TSLP-2-7: PackingFigure 22PG-TSLP-2-7: Marking (example)TSLP 27PO V02+0.01markingBottom view Top viewTSLP-2-7-FP V01CopperSolder mask Stencil aperturesTSLP-2-7-TP V03ESD5V3U1U SeriesTerminology TerminologyCLine capacitanceLDVI Digital Visual InterfaceEFT Electrical Fast TransientESD Electrostatic DischargeHDMI High Definition Multimedia InterfaceIEC International Electrotechnical CommissionIPeak pulse currentPPIReverse currentRIMaximum Reverse working CurrentRWMLSerial inductanceSMDDI Mobile Display Digital InterfaceMIPI Mobile Industrial Processor InterfaceRoHS Restriction of Hazardous Substances DirectiveS-ATA Serial Advanced Technology AttachmentTAmbient temperatureATOperation temperatureOPtPulse durationpTStorage temperaturestgUSB Universal Serial BusVBreakdown VoltageBRVReverse clamping voltageCLVElectrostatic discharge voltageESDVForward Clamping VoltageFCVReverse voltageRVMaximum Reverse Working VoltageRWMESD5V3U1U SeriesReferencesReferences[1]Infineon AG - Application Note AN210: Effective ESD Protection Design at System Level Using VF-TLP[2]Infineon AG - Application Note AN140: ESD Protection for Digital High-Speed Interfaces (HDMI, FireWire,...) using ESD5V3U1U)[3]Infineon AG - Recommendations for PCB Assembly of Infineon TSLP and TSSLP PackageFinal Data Sheet20Revision 1.0, 2011-05-27w w w.i n f i n e o n.c o m Published by Infineon Technologies AGESD5V3U1U02LSE6327XTSA1ESD5V3U1U02LRHE6327XTSA1。
FTDI UMFT201XB、UMFT220XB 和 UMFT230XB 数据手册说明书
UMFT201XB, UMFT220XB and UMFT230XB DatasheetVersion 1.2Document Reference No.: FT_000506 Clearance No.: FTDI# 272 Future TechnologyDevices InternationalLtdDatasheetUMFT201XB, UMFT220XB,UMFT230XB BreakoutModulesUSB to I2C/UART/FT1248 breakout modules1IntroductionUMFT201XB, UMFT220XB, and UMFT230XB breakoutmodules utilize FTDI’s FT201XQ, FT220XQ, andFT230XQ chips, respectively, to convert USB to serial or parallel interfaces. . These modules support thefollowing popular interfaces:-UMFT201XB bridges from USB to I2C IC.-UMFT220XB bridges from USB to a user chosen, parallel bit interface, FTDI’s FT1248/SPI. Note: 2out of the 4 I/0 lines are available for this module.-UMFT230XB bridges from USB to UART IC. 1.1FeaturesThis module is a breakout board with a lowprofile. It converts USB2.0 Full-Speed to aserial interface and connects the serialsignals to a 2.54mm (0.1”) pitch 10pinfemale receptacle. The boards do not use aUSB connector, but instead the modulesplug directly into the USB host connectorand the pads of the PCB makes electricalcontact with the electrical contacts of theUSB connector.All serial interfaces on these modulesoperate at +3.3V voltage levels, however allI/Os are 5V tolerant.2Driver SupportRoyalty-Free VIRTUAL COM PORT (VCP) DRIVERS for:∙Windows 8 32,64-bit∙Windows 7 32,64-bit∙Windows Vista∙Windows XP 32,64-bit∙Windows XP Embedded∙Windows 4.2 , 5.0 and 6.0 ∙MAC OS OS-X∙Linux 3.0 and greater∙Android Royalty-Free D2XX Direct Drivers (USB Drivers + DLL S/W Interface):∙Windows 8 32,64-bit∙Windows 7 32,64-bit∙Windows Vista∙Windows XP 32,64-bit∙Windows XP Embedded∙Windows 4.2, 5.0 and 6.0∙MAC OS OS-X∙Linux 3.0 and greater∙AndroidThe drivers listed above are all available to download for free from . Various 3rd Party Drivers are also available for various other operating systems - visit for details.3Ordering InformationTable of Contents1Introduction (1)1.1Features (1)2Driver Support (1)3Ordering Information (2)4Signals and Configurations (4)4.1UMFT-XB Module Pin Outs (4)4.2Signal Descriptions (4)4.3UMFT201XB CN2 Signal Descriptions (5)4.4UMFT220XB CN2 Signal Descriptions (5)4.5UMFT230XB CN2 Signal Descriptions (6)4.6CBUS Signal Options (6)4.7Configuring the MTP ROM (7)5Module Dimensions (8)6IC Package Markings (8)7UMFT-XB-WE Module Wire Connections (9)7.1UMFT201XB-WE Wire Connections (9)7.2UMFT220XB-WE Wire Connections (10)7.3UMFT230XB-WE Wire Connections (10)8Module Circuit Schematics (11)8.1UMFT201XB Schematic (11)8.2UMFT220XB Schematic (11)8.3UMFT230XB Schematic (12)9Environmental Compliances (12)10Internal MTP ROM Configuration (13)11Contact Information (14)Appendix A - List of Figures and Tables (15)Appendix B: Revision History (16)4 Signals and ConfigurationsFor all three modules, CN1 connects directly to a USB host or HUB port, or can be connected to a USB extension cable. This connects the USB data signals, 5V USB Bus power and GND. When connecting these modules to a USB host or HUB the USB signal pads should be facing upwards, and when connecting to vertical connector the USB signal pad should be facing right. If the module is plugged in the wrong way, no contact will be made between PCB and HUB, no damage will occur from plugging the module in upside down.4.1UMFT-XB Module Pin Outs4.2 Signal Descriptions4.3UMFT201XB CN2 Signal Descriptions4.4UMFT220XB CN2 Signal Descriptions4.5UMFT230XB CN2 Signal Descriptions4.6CBUS Signal OptionsFor further information on CBUS options, please refer to the relevant x-chip datasheet.* PWREN# must be used with a 10kΩ resistor pull up.**When in USB suspend mode the outputs clocks are also suspended.***The number of CBUS pins available varies for the three different modules.4.7Configuring the MTP ROMThe IC on each of the modules contains an embedded MTP memory that can be used to specify the functions of the CBUS pins, the current drive on each signal pin, current limit for the USB bus and the descriptors of the device. For details on using the MTP ROM/EEPROM programming utility FT_PROG, please see the FT_PROG User Guide.When programming the MT memory please note:i)The Max Bus Power setting of the MTP ROM should specify the maximum current to be drawn fromthe USB host/hub when enumerated. For high-powered USB devices the current limit whenenumerated is between 100mA and 500mA, for low-powered USB devices the current limit is100mA.5Module DimensionsTolerance +/-0.1mm2.3Figure 5.1 UMFT-XB Module DimensionsThe UMFT201XB, UMFT220XB and UMFT230XB modules are mechanically identical. Figure 5.1 Uses UMFT230 to illustrate the mechanical details.6IC Package MarkingsThe date code format is YYXX where XX = 2 digit week number, YY = 2 digit year number. This is followed by the revision letter.The code XXXXXXX is the manufacturing LOT code.FTDIXXXXXXXXXXFT201XQ 51YYWW-D8127UMFT-XB-WE Module Wire Connections7.1 UMFT201XB-WE Wire ConnectionsBLACKBROWN RED ORANGE YELLOW GREEN GREY PURPLE BLUE WHITEFigure 7.1 UMFT201XB-WE Wire Connections (numbers refer to pad numbers on the PCB)Figure 6.1 illustrates the –WE product as a cable. This is only for illustration purposes. The wire ended product consists of individual wires – not a cable7.2 UMFT220XB-WE Wire ConnectionsBLACKBROWN RED ORANGE YELLOW GREEN GREY PURPLE BLUE WHITEFigure 7.2 UMFT220XB-WE Wire Connections (numbers refer to pad numbers on the PCB)Figure 6.2 illustrates the –WE product as a cable. This is only for illustration purposes. The wire ended product consists of individual wires – not a cable7.3UMFT230XB-WE Wire ConnectionsBLACKBROWN RED ORANGE YELLOW GREEN GREY PURPLE BLUE WHITEFigure 7.3 UMFT230XB-WE Wire Connections (numbers refer to pad numbers on the PCB)Figure 6.3 illustrates the –WE product as a cable. This is only for illustration purposes. The wire ended product consists of individual wires – not a cable8Module Circuit Schematics 8.1UMFT201XB SchematicFigure 8.1 UMFT201XB Circuit Schematic8.2UMFT220XB SchematicFigure 8.2 UMFT220XB Circuit Schematic8.3UMFT230XB SchematicFigure 8.3 UMFT230XB Circuit Schematic9Environmental CompliancesThe UMFT-XB modules exclusively use lead free components, and are fully compliant with European Union directive 2002/95/EC.10Internal MTP ROM ConfigurationFollowing a power-on reset or a USB reset the FT-X chips will scan its internal MTP ROM and read the USB configuration descriptors stored there. The default values programmed into the internal MTP ROM in the FT201/220/230XB modules is shown in Table 10.1.The internal MTP ROM in the FT-X chip can be programmed over USB using the utility program FT_PROG. FT_PROG can be downloaded from the . Users who do not have their own USB vendor ID but who would like to use a unique Product ID in their design can apply to FTDI for a free block of unique PIDs. Contact FTDI Support(*********************)forthisservice.11Contact InformationHead Office – Glasgow, UKUnit 1, 2 Seaward Place, Centurion Business Park Glasgow G41 1HHUnited KingdomTel: +44 (0) 141 429 2777Fax: +44 (0) 141 429 2758E-mail (Sales) *******************E-mail (Support) *********************E-mail (General Enquiries) ******************* Branch Office – Taipei, Taiwan2F, No. 516, Sec. 1, NeiHu RoadTaipei 114Taiwan , R.O.C.Tel: +886 (0) 2 8797 1330Fax: +886 (0) 2 8751 9737E-mail (Sales) **********************E-mail (Support) ************************ E-mail (General Enquiries) **********************Branch Office – Hillsboro, Oregon, USA 7130 SW Fir LoopTigard, OR 97223USATel: +1 (503) 547 0988Fax: +1 (503) 547 0987E-Mail (Sales) *********************E-Mail (Support) *********************** E-Mail (General Enquiries) *********************Branch Office – Shanghai, ChinaRoom 1103, No. 666 West Huaihai Road, Shanghai, 200052ChinaTel: +86 (0)21 6235 1596Fax: +86 (0)21 6235 1595E-mail (Sales) *********************E-mail (Support) *********************** E-mail (General Enquiries) *********************Web SiteDistributor and Sales RepresentativesPlease visit the Sales Network page of the FTDI Web site for the contact details of our distributor(s) and sales representative(s) in your country.System and equipment manufacturers and designers are responsible to ensure that their systems, and any Future Technology Devices International Ltd (FTDI) devices incorporated in their systems, meet all applicable safety, regulatory and system-level performance requirements. All application-related information in this document (including application descriptions, suggested FTDI devices and other materials) is provided for reference only. While FTDI has taken care to assure it is accurate, this information is subject to customer confirmation, and FTDI disclaims all liability for system designs and for any applications assistance provided by FTDI. Use of FTDI devices in life support and/or safety applications is entirely at the u ser’s risk, and the user agrees to defend, indemnify and hold harmless FTDI from any and all damages, claims, suits or expense resulting from such use. This document is subject to change without notice. No freedom to use patents or other intellectual property rights is implied by the publication of this document. Neither the whole nor any part of the information contained in, or the product described in this document, may be adapted or reproduced in any material or electronic form without the prior written consent of the copyright holder. Future Technology Devices International Ltd, Unit 1, 2 Seaward Place, Centurion Business Park, Glasgow G41 1HH, United Kingdom. Scotland Registered Company Number: SC136640Appendix A - List of Figures and TablesList of FiguresFigure 5.1 UMFT-XB Module Dimensions (8)Figure 7.1 UMFT201XB-WE Wire Connections (numbers refer to pad numbers on the PCB) (9)Figure 7.2 UMFT220XB-WE Wire Connections (numbers refer to pad numbers on the PCB) (10)Figure 7.3 UMFT230XB-WE Wire Connections (numbers refer to pad numbers on the PCB) (10)Figure 8.1 UMFT201XB Circuit Schematic (11)Figure 8.2 UMFT220XB Circuit Schematic (11)Figure 8.3 UMFT230XB Circuit Schematic (12)List of TablesTable 4.1 Module PinOut List (4)Table 4.2 CN1 PinOut Description (4)Table 4.3 I2C Module Pin Out Description (5)Table 4.4 FT1248 Module Pin Out Description (5)Table 4.5 UART Module Pin Out Description (6)Table 4.6 CBUS Configuration Control (7)Table 10.1 Default Internal MTP ROM Configuration (13)Appendix B: Revision HistoryDocument Title: UMFT201XB, UMFT220XB and UMFT230XBDocument Reference No.: FT_000506Clearance No.: FTDI# 272Product Page: /FT-X.htmDocument Feedback: Send FeedbackVersion 1.0 Initial Datasheet Created 09/02/12 Version 1.1 Updated Photos and added Window 8 to driver support list 31/01/13 Version 1.2 Updated -01 part number 03/07/2015。
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Kirilla i Mefodiya 6, Lviv, 290005 Ukraineb Wroclaw University, Wroclaw, PolandE-mail: ...Received August 9, 2006Abstract–Crystals of the copper bromide complexes with N-allylisoquinolinium halides of the composition...Brief abstract of the paper.If more than one institution is responsible for preparation of the paper, letters should be placed after the author’s names to indicate the affiliation.The following structure of a paper is desirable: brief introduction and aim setting, the experimental section, results and discussion, resultant conclusions (obligatory) not separated into a special section, the list of references (in a separate sheet), and figures (each in a separate sheet). It is recommended to use the following sub-headings: “Experimental”, “Results and Discussion”, and “References”.(4) Do not duplicate the data (tables and figures, spectra and spectral frequencies in the text and in the tables, the same data in the general and experimental parts, and so on). It is not recommended to present as figures or tables those data that can be briefly outlined in the text (frequencies, absorption peaks, chemical shifts, etc.). It is recommended to present the spectral data in the text in the following way:IR (ν, cm–1): 1720 ν(C=O), 1640 νas (COO-), 1450 νs(COO-),1H NMR (δ, ppm): 3.18 (m, HCCl), 3.90 (t, HCCS), 7.18 (s, CH5), 8.21 (q, CH2).6The NMR data should be given according to the IUPAC recommendations (see Pure Appl. Chem., 1972, vol. 29, p. 627; 1976, vol. 45, p. 217).The chemical shifts should be given in the δ scale, the signals located in the lower field (with respect to the standard) have positive δ values. 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When a series of papers is cited, the latest publication is given as the reference.(6) For newly prepared compounds, the IUPAC name should be presented apart from the formula. The compound formulas should be written in a consistent manner throughout the whole paper. In a formula, the element oxidation state is indicated (if necessary) by Roman numerals as a superscript, e.g.,K[Fe II Fe III(CN)6]), while in the text, this is done by Roman numerals in parentheses, e.g., cobalt(II), platinum(IV), Cr(III), Ni(II). The charge of metal ions is designated by Arabic numerals as superscript, e.g., Cd2+, Co2+.In the formula of the inner coordination sphere of a complex containing one type of ligand L, the central atom (M) is written first and is followed by the ligands (L) and their number (n). The inner sphere is put in brackets: [ML n]. Theouter-sphere cations (X+) are positioned on the left of the inner sphere, while the outer-sphere anions (X-) are placed on the right: X+[ML n]– or [ML n]+ X-. If the inner coordination sphere contains ligands with unlike charges (positively charged L+, neutral L, and negatively charged L–), they are arranged in the following order: [M(L+)(L)(L–)]. Among neutral ligands L, water should follow organic ligands.(7) The cumbersome names for simple chemical compounds should better be replaced by their formulas (NaBr instead of sodium bromide, CO2 instead of carbon dioxide, CCl4 instead of carbon tetrachloride, SiCl4 instead of tetrachlorosilane, etc.). The common abbreviations should also be used: DMSO for dimethyl sulfoxide, DMF for dimethylformaide, DNPH for2,4-dinitrophenylhydrazone, DTA for differential thermal analysis, EPR for electron paramagnetic resonance, HFS for hyperfine structure, HMDS for hexamethyldisiloxane, HMPT for hexamethylphosphotriamide, NMR for nuclear magnetic resonance, NQR for nuclear quadrupole resonance, THF for tetrahydrofuran, TMS for tetramethylsilane, TLC for thin layer chromatography, Ac for acyl, Bu for butyl, Bipy for 2,2'-bipyridyl, Et for ethyl,M for metal, Me for methyl, Ph for phenyl, Pr for propyl, Py for pyridine, Ts for tosyl.(8) The elemental analysis data should be given strictly according to the rules: For C22H20CoN2O12anal. calcd, (%): C, 46.91; H, 3.58; N, 4.97; Co, 10.46.Found, (%): C, 46.81; H, 3.65; N, 4.90; Co, 10.35.The elements are given in the following order: C, H, N, O, S, Cl, and metal (M).Use relative atomic weights of elements in the 12C scale and physical units and designations accepted in the international SI system. The designations and abbreviations accepted in the journal may be used. All nonstandard designations and abbreviations used as an exception should be explained in the text.(9) The figures (of a relatively small size, made on a computer) are supplemented in duplicate; the authors’ names and the number of the figure are indicated overleaf. The figure captions are written in a separate page under the title “Figure Captions”. Ensu re that designations in the text and in the figures coincide. The figure captions should strictly correspond to their content.(10) Numerical data should better be presented as tables. The tables are numbered by Arabic numerals in the order they appear in the text and are printed in separate sheets. All columns in the tables and the tables should have headings; the columns should be separated by vertical lines. Words in the tables should not be abbreviated. The table rows should be separated by horizontal lines drawn by a pencil. The positions of figures and tables in the text are indicated on the margin by a graphite pencil. The editors reserve the right to mention some of the tables and figures only in the Appendix, the reader being addressed directly to the authors.(11) The references are typed in a separate sheet under the title “References”. Each reference is given in the original spelling. The references are drawn up in the following way.(a) for book references: authors' names, the title of the book, the volume, the city and the publisher, the year of publication, and the first page (if the reference is to an article from the book)/the total number of pages (if the reference is to the whole book); if the book has four authors, all of their names are indicated; if there are more than four authors, the first three names are followed by et al., e.g.Garnovsky, A.D., Vasil’chenko, I.S., and Garnovsky, D.A., Sovremennye aspekty sinteza metallokompleksov. Osnovnye ligandy i metody (Modern Aspects of the Synthesis of Metal Complexes. Key Ligands and Methods), Rostov-on-Don: LaPO, 2000, 354 pp.Bolshakov, K.A. and Sinitsyn, N.M., Khimiya i tekhnologiya neorganicheskikh proizvodstv (Chemistry and Chemical Engineering of Inorganic Processes), Mezhvuz. temat. sb., vol. 7, no. 1. Moscow: MIKhM, 1977, p. 31.(b) If the editor rather than the author is indicated, the book title is written first followed by the editor’s name.Molecular Structure, Domenikano, A. and Hargittai, I., Eds., Moscow: Mir, 1997, 671 pp.Mashiko, T. and Dolphin, D., Comprehensive Coordination Chemistry, vol. 2, Wilkinson, G., Guillard, R.D., and McCleverty, J.A., Amsterdam: Elsevier, 1989, p. 813.Zhelogovskaya, N.N., Transvliyanie v khimii koordinatsionnykh soedinenii (Trans-Effect in the Coordination Chemistry), Spitsyn, V.I., Ed., Moscow: Nauka, 1979, p. 36.(c) for journals, the authors’ names, the title of the journal, the year of publication, the volume number, the issue number, and the first page number are given.Guseva G.B., Antina, E.V., Semeikin, A.S., et al., Zh. Obshch. Khim., 2002, vol. 72, no. 8, p. 1391.Gorter, S., Engelfriet, D.W., Acta Crystallogr., Sect. B: Struct. Crystallogr. Cryst. Chem., 1981, vol. 37, no. 6, p. 1214.(d) for translated monographs, the full title of the original publication should be given.(e) for dissertations, the title of the paper is not needed but the affiliation and the total number of pages are necessary:Lukov, V.V., Doctoral Sci. (Chem.) Dissertation, Rostov-on-Don: Rostov State University, 2000, 65 pp.(f) references to meeting papers include the name of the meeting, the country (city), the year, and the first page:Akselrud, L.G., Gryn’, Yu. M., Pecharsky, V.K., et al., XIV Eur. Powder Diffraction Conf., Enschede (the Netherlands), 1992, p. 57.The numbers of references should be encountered in the text strictly in the numerical order and put in brackets. Unpublished papers should no be referred to.(12) The formulas and letter designations should be either thoroughly written by hand using ink or Indian ink or typed on a computer. The sub- and superscripts deserve special attention; subscripts should not be written in the baseline, the primes should be clearly distinguished from unity, while the unity should not resemble a comma. Avoid cumbersome designations and simplify the formulas. Duplicating designations for the same compound is not allowed.(13) The Russian names should be preceded by the initials. When foreign names are encountered in the text, the original spelling should be given in parentheses (except for the names that are spelled in the list of references).(14) The manuscripts that do not conform to these rules are not accepted for the publication. The papers sent to the authors for revision should be returned in revised form as soon as possible together with the referee’s and editor’s remarks. The original version of the paper should also be returned to the Editors.(15) The proofs are sent to the authors. No major or fundamental corrections are allowed in the proofs.(16) The manuscripts should be addressed to the Editorial office of the Russian Journal of Coordination Chemistry, Kurnakov Institute of General and Inorganic Chemistry of the RAS, Leninsky prosp. 31, 119991 GSP-1 Moscow, Russia.REQUIREMENTS TO THE PAPERS SUBMITTED IN THE ELECTRONIC FORMThe electronic version of the paper should include two files, one with the text and the other with illustrations. The files can be submitted on diskettes or sent bye-mail. In order to avoid technical failures, the disks should be tested and checked for viruses. In the case of large file sizes, the files can be compressed by common archivers (ZIP, RAR). The following guidelines should be taken into account when preparing the text:∙format the text as a Microsoft Word file;∙use standard fonts, e.g., Times New Roman;∙do not separate the lines within one paragraph by the Enter character. When preparing drawings, the following guidelines should be used: ∙format the raster drawings as TIFF files with 600 dpi resolution and 256gray levels;∙submit the vector drawings in the format in which they have been created,e.g., CorelDraw, Adobe Illustrator, FreeHand or EPS;∙use the TIFF format with at least 300 dpi resolution for photographs;∙if the software is uncommon, the files should be additionally saved in the WMF or EPS format;∙the names of graphic files should clearly indicate the paper to which they refer and the order of their arrangement.。
Tables_and_Figures_56406730
Twelve Steps to Developing Effective Tables and FiguresSan Francisco EditThe purpose of tables and figures is to report data too numerous or complicated to be described adequately in the text and/or to reveal trends or patterns in the data. Tables and figures are critical. If readers go beyond the abstract, they are likely to examine the tables and figures next.Before writing the first draft of your manuscript, it is important to organize the data you plan to present in the manuscript. By preparing the tables and figures, their titles and legends, and appropriate statistical analyses, you will be certain of your results before you need to interpret them. At this time you will also be able to determine if you have all the data you need. Before writing the first draft, it is important to plan which results answer the questions you posed in your research and which data can be left out.If you need help beginning, please read our article Twelve Steps in Developing an Effective First Draft at /newsletters.htm.1. Decide which results to present, paying attention to whether data is best presented within the text or as tables or figures.2. Limit the number of tables and figures to those that provide essential information that could not adequately be presented in the text. Reviewers frequently say that figures should be removed or combined.3. Include only results which are relevant to the questions posed in the introduction, information that supports the results.4. Design each table and figure to be understandable on its own, without reference to the text. All key information should be in the caption or in the table or figure.5. Number each figure and table in the order in which they are referred to in the text (figures and tables are numbered separately).6. The original manuscript that you send to the journal typically has the tables and figures located on separate pages that follow the Reference section, normally one per page.7. Make sure there is no page break in the middle of a table or figure if the journal wants the tables and figures integrated into the text. Do not wrap text around tables and figures.8. Be sure all figures and tables are referenced in the text of the article.9. Obtain permission from the copyright holder (usually the publisher) and acknowledge the source if you are including a table or figure that has already been published.10. Often legends do not have verbs, but if they do, write the table and figure legends in the past tense.TablesTables are used to make an article more readable by removing numeric data from the text. Tables can also be used to synthesize existing literature, to explain variables, or to present the wording of survey questions.1. Create tables with the table function (pull down menu) in Microsoft Word. Do not use tabs.2. Use column headings and table notes to simplify and clarify the table. In most cases, the meaning of each column should be apparent without reference to the text.3. Check with the journal, but most journals want the table title and table on the same page, with each table on a separate page in numerical order.FiguresFigures provide visual impact and therefore they are often the best way to communicate the primary finding. Figures are traditionally used to display trends and group results but can also be used effectively to communicate processes or to display detailed data simply.1. Label each axis including units of measurement and clearly identify the data you are displaying(e.g. label each line in a graph).2. Check with the journal, but most want the figure legends listed in numerical order on a separate page and each figure on a separate page in numerical order.3. Figures should be of high image quality, with minimal pixelization. Check with the journal on which image file type they prefer.4. Figures are usually in black and white. Color is extremely expensive to publish, and should only be used when it provides unique information. Some journals are now encouraging color figures in the electronic version of the paper on the website with black and white versions for the paper.5. Do not include experimental details in the legend; these details should be included in the methods section.6. Photographs of subjects should be used only if written, informed consent was obtained prior to the taking of the photograph.。
关于规范毕业论文英文格式的通知【模板】
关于规范毕业论文英文格式的通知各位毕业论文指导老师及毕业班的同学:我院本科毕业论文一律用英文完成最后定稿,现将英文论文的格式统一规范如下:一、基本要求与学校教务处要求一致。
二、装订要求1. Title page采用教务处统一格式(教务处主页下载)英文题目:限20字,三号TIMES NEW ROMAN 字体加粗,题目一行排不下时可排两行;作者姓名、指导导师姓名等,小三号TIMES NEW ROMAN 字体加粗;日期:TIMES NEW ROMAN 字体2. Signature Page (required) 即独创性声明(单设一页,排在封面后)3. Abstract中文摘要以活页形式夹在论文中(即不要装订在论文中),“英文摘要”小三号TIMES NEW ROMAN 字体居中,“关键词”小四号TIMES NEW ROMAN 字体,中文摘要和关键词均为小四号TIMES NEW ROMAN 字体。
英文摘要和关键词用小4号 Time New Roman,英文“关键词”用小4号Arial Black。
The abstract may not exceed 300 words. In style, the abstract should be a miniature version of the thesis. It should be a summary of the results, conclusions or main arguments presented in the thesis. The heading of the abstract must contain the word Abstract.4. Acknowledgments5. Table of Contents“Table of Contents”居中,TIMES NEW ROMAN 四号字提加粗。
格式请参考本通知的附件。
6. List of Tables, etc., if any格式请参考本通知的附件。
篇际互文视角下公司简介的批评性体裁分析--以中国世界500强公司为例
硕士学位论文篇际互文视角下公司简介的批评性体裁分析——以中国世界500强公司为例作者姓名郑蓉学科专业外国语言学及应用语言学指导教师武建国教授所在学院外国语学院论文提交日期2016年3月Critical Genre Analysis on Company Profiles from the Perspective of Interdiscursivity: A Case Study of the Chinese Companies from Fortune Global 500A ThesisSubmitted in Partial Fulfillment of the Requirementsfor the Degree of Master of Arts inLinguistics and Applied LinguisticsCandidate:Zheng RongSupervisor:Prof. Wu JianguoSouth China University of TechnologyGuangzhou, China分类号:H0 学校代号:10561 学号:201320123626华南理工大学硕士学位论文篇际互文视角下公司简介的批评性体裁分析——以中国世界500强公司为例作者姓名:郑蓉指导教师姓名、职称:武建国教授申请学位级别:文学硕士学科专业名称:外国语言学及应用语言学研究方向:话语分析论文提交日期:2016年3月24 日论文答辩日期:2016年4 月21日学位授予单位:华南理工大学学位授予日期:年月日答辩委员会成员:主席:张萍教授(华南师范大学)委员:李占喜教授(华南农业大学)邢杰副教授(广东外语外贸大学)摘要很多学者从不同的学科和角度对公司简介的语篇进行过研究,例如从经济学或金融学方向,或者是对公司简介中的财务年报、领导致辞等语篇进行研究,以探索这类语篇如何通过不同的语言策略来实现它们的交际目的。
1203 WEIGHT TRANSMITTER操作手册说明书
Rinstrum 1203 reference Manual1203WEIGHTTRANSMITTERReferenceManualFor use with SoftwareVersions 1.x1203-600 Rev 1.41. INTRODUCTION (4)1.1. Document Conventions (4)2. SPECIFICATIONS (5)3. INSTALLATION (6)3.1. Introduction (6)3.2. Power Supply (6)3.3. Load Cell Signals and Scale Build (6)3.4. Cable Shield Connection and Earthing (6)3.5. Load Cell Connection (7)Connection (7)3.5.1. 6-WireConnections (8)3.5.2. 4-Wire3.6. Intrinsic Safety (9)3.7. Serial Communication Ports (9)3.7.1. Serial 1: RS-232 Port (10)3.7.2. Serial 2: RS-485 Port (10)Networking (11)3.7.3. Multi-DropConnection (11)3.7.4. RS-232Connection (12)3.7.5. RS-4853.8. Input / Output: Setpoints (13)3.9. Input / Output: Inputs (14)3.10. Analog Output (15)3.11. LEDs (15)3.12. 1203 Viewer Software (15)4. CONTROLS (16)SETUP (17)5. DIGITAL5.1. Introduction (17)5.2. Basic Weighing Terminology (17)5.3. Direct mV/V Operation (18)5.4. Filtering Techniques (18)Filter (18)5.4.1. FIRAveraging (18)5.4.2. Digital6. CALIBRATION (19)6.1. Introduction (19)6.2. Digital Calibration with Test Weights (19)6.2.1. Digital Zero Calibration Routine (19)6.2.2. Digital Span Calibration Routine (19)6.3. Digital Direct mV/V Calibration (20)6.3.1. Digital Zero Calibration Routine (20)6.3.2. Digital Span Calibration Routine (20)6.4. Analog Output Calibration (20)6.4.1. Analog Calibration Routine (20)OUTPUTS (21)7. SERIAL7.1. Introduction (21)7.2. Automatic Weight Output (21)7.3. Networking the 1203 (21)7.3.1. RS-485Resistors (21)TerminationFUNCTIONS (22)8. EXTENDED8.1. Setpoints (22)8.1.1. Introduction (22)8.1.2. StatusIndication (22)8.1.3. Connection (22)8.1.4. Operation (22)8.1.5. Example 1: Control Level of Product in 2000kg Tank (23)8.1.6. Example 2: Control Weighing of Product Out of Silo into 100kg Drums (23)8.2. Remote Input (23)9. OPTIONS (24)9.1. Display/Keys (24)9.1.1. Installation (24)9.1.2. Setup and Calibration (24)10. COMMANDS (25)10.1. Overview (25)10.1.1. Commands and Queries (25)10.1.2. Responses (25)10.1.3. Parameters (25)10.1.4. Termination (25)10.2. Command Details (26)10.2.1. ACL: Set Automatic Temperature Calibration On/Off (26)10.2.2. ADR: Set Address (27)10.2.3. ANL: Set Analog Output (28)10.2.4. ANM: Set Analog Output Maximum and Minimum (29)10.2.5. ASF: Set Filtering (30)10.2.6. BDR: Set Baud Rate (31)10.2.7. COF: Set Output Format (32)10.2.8. ESR: Query Error Status (35)10.2.9. FCN: Execute A Function (36)10.2.10. HYS: Set Hysteresis (37)10.2.11. IAD: Set Scale Build (38)10.2.12. IDN: Set Identification (39)10.2.13. LDW: Calibrate Zero Dead Weight (40)10.2.14. LIV: Set Limit Value (41)10.2.15. LWT: Calibrate Span (42)10.2.16. MSV?: Query Measured Weight Value (43)10.2.17. RBT: Remote Button Settings (44)10.2.18. RES: Reset (46)10.2.19. SER: Set Serial Communications Settings (47)10.2.20. STP: Stop Continuous Transfer (48)10.2.21. Sxx: Select Unit (49)10.2.22. TAR: Tare (50)10.2.23. TDD: Load/Save Setup (51)11. APPENDIX (52)11.1. Glossary (52)11.2. List of Figures and Tables (52)12. INDEX (53)This is a “Table of Contents preview” for quality assuranceThe full manual can be found at /estore/catalog/ We also offer free downloads, a free keyboard layout designer, cable diagrams, free help andsupport. : the biggest supplier of cash register and scale manuals on the net。
中威模型UT513操作手册说明书
Model UT513 OPERATING MANUALTitlePage1Table of ContentsIntroductionUnpacking the Meter Safety InformationInternational Electrical Symbols Battery Saver (Sleep Mode)Battery Indication The Meter Structure DisplayKey FunctionsMeasurement Operation A. Measuring VoltagesB. Measuring Insulation Resistance a) Continuous Measurement b) Timed Measurementc) Polarization Index (PI) Measurement d) Compare Function The Use of Power Adaptor 5568889121417171920202122232242525262727272828292930Title PageUSB Interface MaintenanceA. General ServiceB. Replacing the Battery SpecificationsSafety and Compliances Physical Specifications General Specifications Feature SummaryDetailed Accuracy Specifications A. Voltage MeasurementB. Insulation Resistance MeasurementTable Title Page1. Unpacking Inspection2. International Electrical Symbols3. Battery Indication4. Meter Front Description5. Meter Side Description6. Display Description7. Key Description58810111314 List of Tables3Figure Title Page1. The Meter Front Structure2. The Meter Side Structure3. Display4. Voltages Measurement5. Insulation Resistance Measurement6. The Use of Power Adaptor7. USB Interface Connection8. Battery Replacement911121719232426 List of Figures4IntroductionUni-Trend Model UT513 insulation resistance tester (hereafter, ìthe Meterî) is a handheld instrument designed primarily to make resistance/ insulation resistance measurement.Unpacking the MeterThe Meter includes the following items:Table 1. Unpacking InspectionItem123456789DescriptionEnglish Operating ManualOne plug test lead to one alligatorclip (Black colour)One plug test lead to one alligatorclip (Green colour)Two plugs test lead to onealligator clip (Red colour)1.5V Battery (LR14)Tool BoxUSB Interface CableSoftwarePower adaptor (input voltage230V, 50/60Hz, 75mA, outputDC14V, 1.0A)(optionally, availableat extra cost)Qty1 piece1 piece1 piece1 piece8 pieces1 piece1 piece1 piece1 pieceIn the event you find any missing or damage, please contact your dealer immediately.5Safety InformationThis Meter complies with the standards IEC61010 safetymeasurement requirement: in pollution degree 2,overvoltage category (CAT. III 600V) and doubleinsulation.CAT II: Local level, appliance, PORTABLE EQUIPMENTetc., with smaller transient voltage overvoltages thanCAT. IIIUse the Meter only as specified in this operating manual,otherwise the protection provided by the Meter may beimpaired.Danger identifies conditions and actions that posehazard(s) to the user.Warning identifies avoiding electric shock.Caution identifies conditions and actions that maydamage the Meter and carrying out accuratemeasurement.International electrical symbols used on the Meter andin this Operating Manual are explained on page 8.Operating Caution identifies conditions that userneeds to take extra care during operating the Meter678International Electrical SymbolsInternational symbols on the Meter and in this manual are explained in Table 2.Table 2. International Electrical SymbolsBattery Saver (Sleep Mode)The Meter enters the Sleep Mode and blanks the display if there is no button press for 15 minutes. This is done to conserve battery power. The Meter comes out of Sleep Mode when ON/OFF button is pressed and hold for 1 second.Battery IndicationThere is a battery indicator shows on the display upper left hand corner. Below Table 3 is the explanation:Table 3. Battery Indication9The Meter StructureBelow Figure 1 and Table 4 shows the Meter front structure and descriptionFigure 1. The Meter Front StructureRed10Table 4. Meter Front DescriptionBelow Figure 2 and Table 5 shows the Meter side structure and descriptionFigure 2. The Meter Side StructureTable 5. Meter Side Description1 Safety Shutter2 Power adaptor Input Terminal3 USB Port11DisplayTable 6 and Figure 3 describe the display.Figure 3. Display12Table 6. Display DescriptionNumber 1234567891011MeaningIndicator for DC voltageIndicator for data store fullIndicator for clearingIndicator for AC voltageIndicator for timerStep symbolIndicates selected pass/fail compare valueIndicates for negative readingTimer 1 symbolTimer 2 symbolData store is onNumber12131415161718192021MeaningData recall is onIndicator for polarization indexUnit symbolsThe continuity buzzer is onCompare feature passAnalogue bar graphRisk of electric shockCompare feature failIndicator for power adaptorBattery life indicator1314Table 7. Key DescriptionKey Functions15Table 7. Key DescriptionTable 7. Key Description1617Measurement OperationA. Measuring VoltagesFigure 4. Voltages MeasurementBelow section explains how to make measurements.Press and hold ON/OFF to turn on the Meter, press again to turn off the Meter. The Meter default range is 500V insulation resistance continuous measurement when turning on.18To avoid harms to you or damages to the Meter,please do not attempt to measure voltages higher than 600V or 600V rms, although readings may be obtained.Special care should be taken when measuring high voltage.Operating CatuionTo measure voltages, set up the Meter as Figure 4 and do the following:Press DCV or ACV button to select DC voltage orAC voltage measurementInsert the red and green test lead into the testedcircuit.When measuring DC voltage, if the red test lead isnegative voltage, ì-ì symbol will show on the display.1.2.3.When voltage measurement has been completed,disconnect the connection between the testing leads and the circuit under test and remove testing leads away from the input terminals of the Meter.Note19B. Measuring Insulation ResistanceFigure 5. Insulation Resistance MeasurementOperating CautionWhen performing insulation resistance tests,remove all power from the circuit to be measured and discharge all the power.Operating the Meter must be very careful as it outputs dangerous voltage duringmeasurement. Must make sure the tested object is firmed clipped, hands are away from the clips, then press TEST button to put high voltage.Do not short circuit the testing leads during high voltages output or test insulationresistance after high voltages output. This kind of incorrect operating may cause sparking and fire, which damages the Meter and harms to you.Do not measure over 10 seconds when:500V measure resistance lower than 2M 1000V measure resistance lower than 5M 2500V measure resistance lower than 10M 5000V measure resistance lower than 20M20To measure insulation resistance, set up the Meter as Figure 5 and do the following:Press IR button to select insulation resistancemeasurement.When there is no testing voltage output, pressand button to select voltages of 500V, 1000V,2500V or 5000V.When performing insulation resistance tests, removeall power from the circuit to be measured and discharged all the power.Insert the red test lead into the LINE input terminaland the black test lead into GUARD input terminal.Connect the red and black alligator clip to the circuitto be measured, negative voltage output from LINE terminal.Choose below insulation resistance measurementmode.1.2.3.4.5.6.Press TIME button to select continuousmeasurement mode, there is no timer icon on the LCD.Press and hold TEST button for 1 second to carry out continuous measurement. Outputinsulation resistance testing voltage, TEST button light up,blinks on every 0.5 seconds.Press TEST button to close the insulation resistance measurement voltage when measurement iscompleted. TEST The LCD shows the current insulation resistance measurement value.Press TIME button to select timed measurement mode, the LCD displays TIME 1 and symbols.Press and buttons to set the time (00:10~15:00).Within 1 minute, the time increment or decrement by every 5 seconds. Afterward, the time increment or decrement by every 30 seconds.21Then press and hold TEST button for 2 second to carry out timed measurement. TIME 1are displayed and blinked on the LCD on every 0.5seconds.When the set time is reached, the insulation resistance measurement voltage will be closed and the measurement will be automatically stopped.The LCD displays the insulation resistance reading.Press TIME button to select timed measurement mode, the LCD displays TIME 1 and symbols.Press and buttons to set the time (00:10~15:00).Within 1 minute, the time increment or decrement by every 5 seconds. Afterward, the time increment or decrement by every 30 seconds.Press TIME button again. TIME 2, PI and symbols appear on the LCD.Press and buttons to set the time (00:15~15:30).Within 1 minute, the time increment or decrement by every 10 seconds. Afterward, the time incrementor decrement by every 30 seconds.Then press and hold TEST button for 2 seconds to carry out timed measurement.TIME 1LCD on every 0.5 seconds before TIME 1 set time is reached.TIME 2 and are displayed and blinked on the LCD on every 0.5 seconds before TIME 2 set time is reached.When the two set time are reached, the insulation resistance measurement voltage will be closed and the measurement will be automatically stopped.The LCD displays the polarization index reading.Press , to set through the polarization index,TIME 2 insulation resistance reading and TIME 2insulation resistance reading.Information:PI = 3 minutes ~10 minutes reading / 30 seconds ~1minute readingPI Standard 4 or more The best 4~2Good 2.0~1.0Warning1.0 or less BadPress COMP button to select compare feature.COMP symbol displays on the LCD..Press and buttons to set the compare valueBelow is the list in sequence of the compare value: 10M, 20M, 30M, 40M, 50M, 60M, 70M, 80M, 90M,100M, 200M, 300M, 400M, 500M, 600M, 700M, 800M, 900M,1G, 2G, 3G, 4G, 5G, 6G, 7G, 8G, 9G, 10G,20G, 330G, 40G, 50G, 60G, 70G, 80G, 90G, 100G,200G, 300G, 400G, 500G, 600G, 700G, 800G, 900GPress and hold TEST button for 2 seconds to carry out the measurement.The NG symbol will display if the insulationresistance value is smaller than resistance value.Otherwise GOOD symbol will be displayed.22The Use of Power Adaptor23The use of power adaptor, see figure 6Open the side safey shutter, then you will see there is a power adaptor input terminal.Make sure the Meter is power off and insert the UT513 power adaptor to the input terminal.It is highly recommeded to take out all the batteries when you are using the power adaptor.Make sure the Meter is power off when youdisconnect the UT513 power adaptor from the Meter.It is highly recommeded to use Uni-Trend supplied UT513 power adaptor to avoid dangerous.1.2.3.4.5.Figure 6. The Use of Power AdaptorUSB InterfaceConnecting the USB interface, see figure 7 Figure 7. USB Interface ConnectionInstall the included software, the installation guide can be seen from the CD.Open the side safety shutter, then you will see there is a USB port.Insert the included USB cable to the Meterís USB port and the other end to the computer.1.2.3.2425MaintenanceThis section provides basic maintenance information including battery replacement instruction.WarningDo not attempt to repair or service your Meter unless you are qualified to do so and have the relevant calibration, performance test, and service information.A. General ServicePeriodically wipe the case with a damp cloth and mild detergent. Do not use abrasives or solvents.To clean the terminals with cotton bar with detergent,as dirt or moisture in the terminals can affect readings.Turn the Meter to OFF when it is not in use.Take out the battery when it is not using for a long time.Do not use or store the Meter in a place of humidity,high temperature, explosive, inflammable and strong magnetic field.If the Meter is wet, dry it before use.B. Replacing the BatteryWarningTo avoid electric shock, remove all the test leadsfrom the Meter when replacing the batteries.Operating CautionDonít mix to use old and new batteries.Be careful the polarity is correct when installingbatteries.Do not use the Meter if the battery indicator( ) shows a battery empty condition.Do you carry out measuring during the batterycompartment is open.Figure 8. Battery ReplacementFollow Figure 8 and proceed as follows to replace thebattery:Turn the Meter to OFF and remove all connectionsfrom the terminals.Remove the screw from the battery compartment,and separate the battery compartment from the casebottom.Replace with 8pcs of new 1.5V (LR14) batteries.Rejoin the case bottom and battery compartment,and reinstall the screw.26SpecificationsSafety and CompliancesPhysical Specifications27General SpecificationsFeature Summary28Detailed Accuracy SpecificationsOperating temperature: 18~28Relative humidity: 45~75%RHA. Voltage Measurement29B. Insulation Resistance MeasurementOperating CautionAt any output voltage, when the tested resistance is les than 10M, the testing time cannot exceed 10 seconds continuously.30*END*This operating manual is subject to change without notice.31All rights reserved.Manufacturer:Uni-Trend Technology (Dongguan) LimitedDong Fang Da DaoBei Shan Dong Fang Industrial Development District Hu Men Town, Dongguan CityGuang Dong ProvinceChinaPostal Code: 523 925Headquarters:Uni-Trend Group LimitedRm901, 9/F, Nanyang Plaza57 Hung To RoadKwun TongKowloon, Hong KongTel: (852) 2950 9168Fax: (852) 2950 9303Email:******************32。
研究报告的英文
contents
目录
• Introduction • Structure and Format of Chinese
Research Reports
• Structure and Format of English Research Reports
follows a strict format and structure, and is written in a formal and objective style.
Research Reports in English
In the English-speaking world, a research report is also a formal document that outlines the methods, results, and discussion of a scientific investigation. However, it tends to be more narrative and descriptive in style, with more emphasis on the story of the research and the researchers' reflections.
Citations
Chinese reports may not have a standard citation style or format, while English reports follow strict citation guidelines (e.g., APA, MLA) for proper citation of sources.
table of contents & list of figures and tables
⑦Novice researchers do not completely understand the multiple roles this powerful tool is expected to play in their project design; some of these roles can be further defined as an instructive blue print, a reliable guidance, and an explicit "thinking & cognitivizing map"(显示思维与认知轨迹图谱). ⑧Novice researchers do not know how to develop the potential of this convenient tool foe more wonderful things in their research practice.
5. Try to start writing your table of contents at the same time that you make your outline; 6. Try to produce your table of contents in a way that parallels (使平行) the production of your research plan; 7. Try hard to explore more roles a good table of contents can play in your research design.; 8. Try to explore more mechanisms to prepare a table of contents.
报告样表【英文】
Do as little manual formatting as possible when you type the text. Instead, apply the appropriate style to each paragraph (a “paragraph” is defined by a hard carriage return at its end; it may not actually be a paragraph of text).
Using Text Styles
A “style” is a set of definitions for how a heading or paragraph will look, including the font and spacing. In Microsoft Word’s styles menu, choose styles such as “Heading 1” and “Body text” to help you create a consistently formatted report. Styles also enable a table of contents to be automatically generated.
Iowa HighwayResearch Board
Iowa Department of Transportation
英文编辑之Figures and Tables
• Fig.2. Effect of dopamine on the major determinants of leftventricular circumferential endsystolic wall stress. *P<0.05, **P<0.01 vs. control by ANOVA.
数据
• 数值的个位数、小数点或“±” 等符号应 分别对齐。
The body of the table
• To indicate statistically significant differences between data, it is clearest to use symbols, such as *, after the values that are different, and then to define the symbols in a footnote (e.g. ‘*P=0.02 vs. control’).
• Fig.1. Nuclear T3-binding capacity in rabit lung during prenatal and postnatal development. Doseresponse experiments were done with isolated nuclei under optimal conditions, and data were analyzed by Scatchard analysis.
• Standard: Effect of X on Y in Z Fig.1. Effect of increasing concentrations of doxorubicin (阿霉素) on release of histamine from dog mastocytoma cells
英语论文写作Report Writing Anatomy
R eport W riting A natomyAssociate Professor Sam Zhang (msyzhang@.sg)School of Mechanical and Production Engineering, Nanyang Technological UniversityMarch 2004ForewordFrequently we face the question of how to a technical report: Lab report (spreading over all years of students), Final Y ear Project (FYP) report (graduating undergraduate students in the final year), First Y ear Report (for Master students or PhD students’ candidature confirmation), Master or PhD thesis…Frequently I find myself correcting same kind of mistakes again and again in those reports. Finally I decided to give my student a lecture on how to write technical report by highlighting the mistakes I have collected over the years. I ca ll it a “Report Writing Anatomy”. This document is a result of this lecture. Hope the students could benefit through making fewer mistakes and reviewers could benefit because they don’t have to correct the same old mistakes again and again.Comments and suggestion are always welcomeStructure:A technical report always has a more or less fixed structure. The following is a good example:1. 1.Abstract2. 2.Acknowledgements3. 3.List of Figures (if necessary)4. 4.List of T ables (if necessary)5. 5.List of Abbreviations (if necessary)6. 6.Introduction7.7.Literature Review8.8.Experimental Procedure9.9.Results, Discussion10.10.Conclusions11.11.Future Work12.12.Reference13.13.Appendix (if any)I will elaborate each of th ese items and point out do and don’ts in the following section:Abstract:An abstract is the overview of the entire report where you summarize motive, methods, key results and conclusions. Be brief and avoid waffle and spurious details. Usually I find myself writing or revising the abstract AFTER writing the whole thesis especially after writing the conclusions.Acknowledgements:This is the place where you express your gratitude to organizations or people who have helped with ideas, technical assistant, materials or finance. Keep it simple, give full names and affiliation, and avoid getting too sentimental.Introduction:A good introduction starts with ordinary things that the reader can easily relate to his/her existing knowledg e, and immediately catches reader’s attention thus making the reader wanting to read on. Then it outlines the problem and why it is worth tackling. Briefly give an account of the main contributors, summarize the status of the field when the research was started, provide any specialized information that the reader might need if he is to understand what follows; State what will be done that has not been done before (new experimental approach? new data? new model? new interpretation?); Keep it as brief as possible whilst still doing all the above mentionedLiterature Review:This is where you establish the foundation of your project: In the topic of the research you proposed, what has been accomplished and what is still lacking? It is a piece of discursive prose, not a list describing or summarizing one piece of literature after another, not a pile of arguments or sections copied from textbook or research papers. Y ou must read extensively, digest, analyze and find the logic among different researchers’ views on a topic or topics surrounding the problem or issue concerned. Organize the chapter into sections that present themes or identify trends, including relevant theories. Based on this, your topic is put up to be addressed.If you write a good literature review, you will find that in your discussion, you frequently refer the reader to the literature review chapter (particular section or formulation, diagram, etc.).Experimental Procedure:The three major elements for this chapter are equipments, materials and method. This chapter should exclusively cover what YOU do and use to carry out YOUR study for YOUR project. Description on the characterization techniques or principles should not be in this chapter but in a dedicated section in the “literature review”. Experimental parameters (e.g. deposition conditions) should be in a format that allows comparison, e.g. target power in terms of power density (watts/effective target area). Results should not be here. This chapter should dedicated to “What I use and how I’m going to measure” a particular property under what kind of conditions. Remember to put in details of equipment used, such as Model, Make, year together with detailed testing or measurement conditions, such as speed of loading, sampling frequency, voltage, current, step size, number of measurements, how the data will be obtained (mean value of 10 measurements? Fitted into straight line? etc)Results:In this chapter you present the output of the experiments, model or computations. The “output” should treated output, analyzed output, not simply the machine printout (which, in necessary, should be placed in appendix). The data should be reported without opinion or interpretations atthis stage. Define all symbols and units. Give emphasis in the text the most important aspects of the figures and tables. Give error-bars or confidence-limits for numerical or graphical data. Text should always come before a plot or diagram or micrograph is put out. Plots, tables, diagrams, micrographs should also be called for, not just pop out from nowhere and out of blue.Discussion:Here you discuss your results, extract principles, relationships, or generalizations from the results. The function of “discussion” is to describe the analysis, mechanism, models and theories and lead the reader through a comparison of these experimental or computational results. Put forward the most significant conclusions first; develop subsidiary conclusions after that. Be clear and concise, and do not waffle. Keep in mind, this is where you express YOUR opinion, YOUR argument or YOUR explanation of what is going on based on the results you presented. Therefore, combining discussion and the results you will draw conclusions in the conclusion section. The result chapter provides the basis and the discussion chapter is the argument for the conclusions you will draw.Conclusions:Based on the results and discussion, here you draw the most important results and their consequences; List any reservations or limitations. Only be conclusive when concluding anything. “Horses have four legs” is conclusive.In the conclusion section, don’t start discuss again. Y ou have done that in the “Discussion” section. Likewise, “future work” should not be mentioned in the conclusion section. Dedicate the conclusion section to concluding remarks.It is acceptable to present “conclusions” as a bullet-pointed list or numbered list. When concluding, be precise, accurate, and brief (don’t start arguing).Future Work:This chapter should only list the work to be done, and should not include or further elaborate on work that are already accomplishedAppendix:Appendix is not a place you dump all experimental data regardless of whether it is used or not used in the main chapters. Appendix should house tedious but essential derivations, data tables etc., that would disrupt the flow of ideas in the main text if not put away. All appendices should be mentioned in the main text. If not, they should not be there in the first place.That concludes the main structures. Next I will highlight some important aspect where mistakes always appear:❑❑Abbreviations:All abbreviations should be spelled out for the first time when they appear, including that in the abstract. However, if a term is not used the second time in the abstract, that termshould not be abbreviated in the abstract. If it is used in the main text more than once, then define the abbreviation there, not in the abstract.∙Use abbreviations prudently. Try not to use them if possible (don’t run wild using abbreviations)∙A list or table of symbols and abbreviations should be included for bigger size reports❑❑Figures and T ables:∙Table should be arranged such that the title of the table precedes the table itself, not at the bottom of the table.∙Figures should be arranged such that the title and figure caption come after the figure itself, i.e., at the bottom of the figure.∙All figures and tables should come in only after they have been mentioned or call upon in the text∙In figure caption, it helps to elaborate or highlight the points to be made; always consider the purpose of putting the figure there (e.g. what do the figures prove or illustrate?)(What do you want your reader to learn from this figure?) In research papers (journal papers) it is not common to highlight this in figure caption because of the page length concern. But in reports, it is usually good to put it in. This helps the authors in deciding whether it is necessary even to include that figure or not. It also helps to lead the reader to the point you want to make.∙Keys and legends should be presented such that they can be easily differentiated and recognized (On screen, one can see colors, but printed copy is usually black and white. Be considerate of this)∙When presenting micrographs, make the scale bar prominent, and drop the use of magnification (1000X, etc). It makes no sense to give a magnification (and maybe wrong) because the presentation may be on a piece of A4 sized paper or maybe on a large projection screen. In the original photo, make the scale bar according to its magnification and group it with the photo, thus enlargement or shrinkage of the photo will enlarge or shrink the scale together.∙When presenting photos or figures copied from reference materials, ensure that the quality is good; note that the quality of the photos will be compromised when being save as *.jpeg format (due to the compression method), but this can be rectified by using a suitable image processor to improve the quality before saving∙Note also the file-size of photos and figures will be large if they are save as *.bmp or improved quality *.jpeg.∙If you directly copy a photo directly from the screen and paste into word document, the file is bmp type and it results in big files. Save the photos in jpg file and then use the <insert picture> function in the word processor to insert the photos and figures. This way, the file-size of the report will be reduced drastically.❑❑Referencing:∙It is a conventional courtesy to reference the originators of key ideas, theories or models.In fact, I would not just consider referencing as a mere “courtesy”. It is a must, a demonstration of integrity: in way of recognizing other’s work and contribution. Also,proper referencing provides support to your work and also the leads for your reader to follow should he wants to.∙By-chapter listing of references is not advised (though it is okay sometimes), put all references in the end of the report.∙DO NOT cite references at the section heading--- that is very silly and demonstrate that you do not know what is all about referencing! References should be cited immediately after the specific statements, data or equations extracted∙Cite the references at caption when the figures or tables are from other people’s work∙Ensure statements extracted from the references of relevancy and significance, e.g.“sintering is one of th e most important technological processes in the powder metallurgy and ceramic industry” does not seems to require a reference∙Make sure all cited references are indispensable∙Citing references dated many years back (e.g. 1977) should be carefully considered for their relevancy at the present time❑❑Language:∙Essence of technical writings is communications∙The quality that precedes all others is clarity∙Use simple language and simple concise construction: short words rather than long;familiar words, not obscure∙Do not waffle; writing evasively on points that are already clearly known is a waste of the readers’ time∙A void clichés and weak qualifiers (e.g. rather, somewhat, quite)∙Do not overstate or over-emphasize∙Never apologize, e.g. unfortunately, there was insufficient time to complete the last sets of tests (suggests bad planning and incompetence)∙Do not patronized: the amazing perceptive comment by Lu . . .∙Do not be condescending: readers familiar with my work will know . . .∙Interjections are strictly prohibited in technical writings∙Special attention should be paid to avoid mixing of tenses∙Do not rely on the word or syntax correcting function of the word processor∙Always be wary of broken and incomprehensible sentences, grammatical and syntax errors∙Write in a way that draws attention to the sense and substance of the writing, not to the mood of the authorOthers:∙A holistic treatment with good logic and fluency of the entire report is of great importance;Stand-alone chapter beginning with its own introduction, literature review, etc., should be avoided. (That is usually resulted from ineffective integration of several published papers from the author)∙Equations will need derivation, reference or justification∙Always use S.I. units∙The emphasis (e.g. doping or synthesis parameters) of the proposed work should be madeclear from the beginning and be consistent till the end. A void switching of emphasis of your work.In compiling this document, reference has been made and some points picked from “How to Writea Paper”, 3rd Edition, by Mike Ashby, Engineering Department, Cambridge University, UK,2004. I strongly recommend that all students download and read that write-up.。
1630地球电源接地缆用户手册说明书
®1630Earth Ground ClampPN 2729710October 2006© 2006 Fluke Corporation, All rights reserved.All product names are trademarks of their respectivecompanies.LIMITED WARRANTY AND LIMITATION OF LIABILITYEach Fluke product is warranted to be free from defects in material and workmanship under normal use and service. The warranty period is one year and begins on the date of shipment. Parts, product repairs, and services are warranted for 90 days. This warranty extends only to the original buyer or end-user customer of a Fluke authorized reseller, and does not apply to fuses, disposable batteries, or to any product which, in Fluke's opinion, has been misused, altered, neglected, contaminated, or damaged by accident or abnormal conditions of operation or handling. Fluke warrants that software will operate substantially in accordance with its functional specifications for 90 days and that it has been properly recorded on non-defective media. Fluke does not warrant that software will be error free or operate without interruption.Fluke authorized resellers shall extend this warranty on new and unused products to end-user customers only but have no authority to extend a greater or different warranty on behalf of Fluke. Warranty support is available only if product is purchased through a Fluke authorized sales outlet or Buyer has paid the applicable international price. Fluke re-serves the right to invoice Buyer for importation costs of repair/replacement parts when product purchased in one country is submitted for repair in another country.Fluke's warranty obligation is limited, at Fluke's option, to refund of the purchase price, free of charge repair, or replacement of a defective product which is returned to a Fluke authorized service center within the warranty period.To obtain warranty service, contact your nearest Fluke authorized service center to obtain return authorization information, then send the product to that service center, with a de-scription of the difficulty, postage and insurance prepaid (FOB Destination). Fluke as-sumes no risk for damage in transit. Following warranty repair, the product will be re-turned to Buyer, transportation prepaid (FOB Destination). If Fluke determines that failure was caused by neglect, misuse, contamination, alteration, accident, or abnormal condition of operation or handling, including overvoltage failures caused by use outside the prod-uct’s specified rating, or normal wear and tear of mechanical components, Fluke will pro-vide an estimate of repair costs and obtain authorization before commencing the work. Following repair, the product will be returned to the Buyer transportation prepaid and the Buyer will be billed for the repair and return transportation charges (FOB Shipping Point). THIS WARRANTY IS BUYER'S SOLE AND EXCLUSIVE REMEDY AND IS IN LIEU OF ALL OTHER WARRANTIES, EXPRESS OR IMPLIED, INCLUDING BUT NOT LIMITED TO ANY IMPLIED WARRANTY OF MERCHANTABILITY OR FITNESS FOR A PAR-TICULAR PURPOSE. FLUKE SHALL NOT BE LIABLE FOR ANY SPECIAL, INDIRECT, INCIDENTAL, OR CONSEQUENTIAL DAMAGES OR LOSSES, INCLUDING LOSS OF DATA, ARISING FROM ANY CAUSE OR THEORY.Since some countries or states do not allow limitation of the term of an implied warranty, or exclusion or limitation of incidental or consequential damages, the limitations and ex-clusions of this warranty may not apply to every buyer. If any provision of this Warranty is held invalid or unenforceable by a court or other decision-maker of competent jurisdiction, such holding will not affect the validity or enforceability of any other provision.Fluke CorporationP.O. Box 9090 Everett, WA 98206-9090 U.S.A. Fluke Europe B.V. P.O. Box 1186 5602 BD Eindhoven The Netherlands11/99To register your product online, visit Table of ContentsPage TitleIntroduction (1)Standard Accessories (1)Contacting Fluke (2)Safety Information (2)Symbols (3)Getting Acquainted with the Clamp (4)Using the Clamp (6)Ground Resistance Measurements (6)Ground Leakage Current Measurement (8)Memory and Alarm Functions (9)Using the High and Low Alarms (9)Setting the Sampling Interval (10)Logging Data (11)Reading Data Stored in Memory (12)Clearing Memory (12)Canceling Auto-Power Off (12)Maintenance (12)Cleaning the Clamp (13)Replacing the Battery (13)Specifications (14)Electrical Specifications (14)General Specification (14)Ground Loop Resistance (15)Ground Leakage Current mA (15)Ground Leakage Current A (15)i1630Users ManualiiList of TablesPage Table Title1. 1630 Earth Ground Clamp Features (4)Features (5)2. DisplayList of FiguresFigure Title Page1. 1630 Earth Ground Clamp Features (4)Features (5)2. Display3. Ground Resistance Measurement Principles (7)4. Ground Leakage Current Measurement (8)5. AlarmFunctions (9)Sampling Interval (11)6. SettingtheData Display (12)7. Storediii1630Users Manualiv1630Earth Ground ClampIntroductionThe Fluke 1630 Earth Ground Clamp (hereafter called the “the Clamp”) is ahand-held battery-operated clamp that measures the ground resistance of aground rod without using auxiliary ground rods. The Clamp can be used inmulti-grounded systems without disconnecting the ground under test.The Clamp can be used in the following applications:•Earth resistance testing of high voltage pylons, buildings, cell phonesubstations and RF transmitters•Inspection of lightning protection systemsStandard AccessoriesThe following standard accessories are provided with the Clamp:1 9-V alkaline battery (type IEC 6F22, NEDA 1604 installed)1 Resistance test/check loop1 1630 Users Manual1 Carrying Case11630Users ManualContacting FlukeTo contact Fluke, call one of the following telephone numbers:USA: 1-888-44-FLUKECanada: 1-800-363-FLUKEEurope: +31 402-675-200Japan: +81-3-3434-0181Singapore: +65-738-5655Anywhere in the world: +1-425-446-5500USA Service: 1-888-99-FLUKE (1-888-993-5853)Or, visit Fluke's Web site at To register your product, visit Safety InformationXW Read First: Safety Information To ensure safe operation and service of the 1630 EarthGround Clamp, follow these instructions:•Read the operating instructions before use and follow all safety instructions.•Use the Clamp only as specified in the operating instructions, otherwise the Clamp’s safety featuresmay not protect you.•Adhere to local and national safety codes. Individual protective equipment must be used to prevent shockand arc blast injury where hazardous live conductorsare exposed.•Before each use, inspect the Clamp. Look for cracks or missing portions of the Clamp housing or output cableinsulation. Also look for loose or weakenedcomponents. Pay particular attention to the insulationsurrounding the jaws.•Never use the Clamp on a circuit with voltages higher than 600 V CAT II or 300 V CAT III.2Earth Ground ClampSymbols3• CAT II equipment is designed to protect againsttransients from energy-consuming equipmentsupplied from the fixed installation, such as TVs,PCs, portable tools, and other householdappliances.•CAT III equipment is designed to protect againsttransients in equipment in fixed-equipmentinstallations, such as distribution panels, feedersand short branch circuits, and lighting systems inlarge buildings. • Use extreme caution when working around bareconductors or busbars. Contact with the conductorcould result in electric shock.•Use caution when working with voltages above 60 V dcor 30 V ac. Such voltages pose a shock hazard. SymbolsThe following symbols are found on the Clamp or in this manual. ,May be used on hazardous live conductors WRisk of danger. Important information. See Users Manual. XHazardous voltage. Risk of electric shock. TDouble insulation MBattery P Conforms to relevant European Union directives~ Do not dispose of this product as unsorted municipal waste.Contact Fluke or a qualified recycler for disposal.)Complies with Canadian and US Standards1630Users ManualGetting Acquainted with the ClampRefer to Figures 1 and 2 and Tables 1 and 2 to become more familiar with the Clamp’s features.Figure 1. 1630 Earth Ground Clamp FeaturesTable 1. 1630 Earth Ground Clamp FeaturesNumber DescriptionA Jaws. Used to enclose electrode or ground wire.B HOLD button. Press to hold the displayed value.C Rotary Switch for power on and function selection.D LCDE REC button. Press to start data logging.F Down arrow used to decrement value.G Up arrow used to increment value.H FUNC button. Press to select HI (high alarm), LO (low alarm),SEC (seconds), or stored memory locations.I Jaw release.4Getting Acquainted with the Clampeht02f.epsFigure 2. Display FeaturesTable 2. Display FeaturesNumber DescriptionA Indicates the Clamp will Autopower off in 4 to 6 minutes.B Low battery indicator - the batteries are low and need to bechanged.XW WarningTo avoid false readings, which could lead topossible electric shock or personal injury,replace the batteries as soon as the batteryindicator appears.C Indicates data logging is in progress.D Indicates memory location.E Indicates the jaw is not closed properly. This symbol appears onthe display.F Indicates noise present in ground electrode or ground rod.G Indicates the rotary switch is in the alarm function.H Displays current selected function or current memory location.I Displays value from 0 to 9999 with decimal point.J Indicates ohms and alarm functions.K Indicates current in mA or A.Users ManualUsing the ClampGround Resistance MeasurementsTo perform ground resistance measurements:1.Open the jaws and make sure the surfaces fit together properly andare free of dust, dirt, or any foreign substances.2.Turn the Clamp on by moving the rotary switch to the Ω function.NoteDo not attach the Clamp to a conductor or open the jaws now orduring self-calibration or calibration will be interrupted.3.After power is turned on, the Clamp self-calibrates for betteraccuracy. Wait for self-calibration to finish before makingmeasurements. During the self-calibration, the display will showCAL7, CAL6,…..CAL2, CAL1. The Clamp beeps when self-calibration iscompleted.4.Attach the Clamp to the electrode or ground rod to be measured.5.Read the value of R g (ground resistance) from the display. Figure 3illustrates the ground resistance measurement principles.Note•If self-calibration does not stop, check the jaw surfaces for dust or dirt and power up the Clamp again.•If there is more than 3 A or 30 V in the ground rod, the jaw icon and the word NOISE flash on the display and theClamp beeps. When noise is present the Clamp reading isnot valid.•If the jaw assembly is opened during measurement, the jaw icon appears on the display.Using the ClampFigure 3. Ground Resistance Measurement PrinciplesUsers ManualGround Leakage Current MeasurementTo perform a ground leakage current measurement test:1.Open the jaws and make sure the surfaces fit together properly andare free of dust, dirt, or any foreign substances.2.Turn the Clamp on by moving the rotary switch to the M orA function.3.Attach the Clamp to the electrode or ground rod to be measured.Figure 4 shows a connection for a ground leakage currentmeasurement.4.Read the value of the leakage current on the display.eht05f.eps Figure 4. Ground Leakage Current MeasurementMemory and Alarm Functions Memory and Alarm FunctionsUsing the High and Low Alarms1.Press F to select the HI or LO alarm, although this describes theohms function high and low alarms can be set in any of the otherfunctions. The current value of High or Low alarm will appear on thedisplay. Figure 5 shows alarm function displays.2.Press the E or E button to increment/decrement the value by 1 Ω.The value can be incremented or decremented from 0 Ω to1510 Ω and then OL. Hold down the up or down buttons to quicklyincrement/decrement to the desired value.3.When the value is set, press F until you return to the main display.4.When the rotary switch is set to the U position, the Clamp comparesthe current value with the high and low values. If the currentmeasurement is larger than the HI value, the Clamp beeps and showsHI-- in the upper display. If the measurement is less than the LOvalue, the Clamp will beep and LO-- appears in the upper display.Figure 5. Alarm FunctionsUsers ManualNote•If the HI value is set at OL, or the LO value is set at 0, theALARM function will be disabled.•The HI value can’t be smaller than the LO value and theLO value can’t be larger than the HI value. HI value will beadjusted to the LO value when a rollover occurs. Themaximum LO value is the HI value.•If data logging is progressing, the beeper is disabled tosave battery power but the display will still show thewarning letters HI-- or LO--.•The values of the high and low alarm are stored in memory.They are restored when the Clamp is turned on.Setting the Sampling Interval1.Press the FUNC button until SEC appears in the upper display. Figure6 shows the sampling interval display.2.The Clamp shows the current sampling interval in seconds.3.Press E or D to increment/decrement the sampling interval by 1second. The sampling interval can be incremented or decrementedfrom 0 to 255 seconds. Hold down the up or down buttons to quicklyincrement/decrement to the desired value.4.Press F until you return to the main display.Memory and Alarm Functionseht07f.eps Figure 6. Setting the Sampling IntervalLogging Data1.Press R; REC appears in the upper display.2.Data is recorded at the sampling interval you specified. Data loggingwill stop when memory is full, the Clamp detects a low battery, oryou press the R button again.NoteIf the sampling interval is set at 0 seconds, only one data point isrecorded. To record the next data point press the REC button again.The memory location is also displayed for about 1 second.Users ManualReading Data Stored in Memory1.Press F until NO. appears on the display. The current memorylocation appears on the upper display and the stored data appears onthe lower display. Figure 7 shows the stored data display.2.Press E or D to go to the next or previous memory location. Thememory location rolls over when the first or last record is reached.eht08f.epsFigure 7. Stored Data DisplayClearing MemoryTo clear the memory press and hold R and then turn the Clamp on. The letters CL appear on the display and indicate that memory is cleared.Canceling Auto-Power OffWhen the Clamp is turned on, the letters AP appear on the display and indicate that Auto-Power Off is turned on. To cancel Auto-Power Off, press F and then turn the Clamp on. The letters AP will no longer appear on the display.MaintenanceXW WarningTo avoid possible electric shock or personal injury, repairsor servicing not covered in this manual should beperformed only by qualified personnel.Maintenance Cleaning the ClampW CautionTo avoid damaging the Clamp, do not use aromatichydrocarbons or chlorinated solvents for cleaning. Thesesolutions will react with the plastics used in the Clamp.Clean the instrument case with a damp cloth and mild detergent.Replacing the BatteryXW WarningTo avoid false readings that could lead to possible electricshock or personal injury, replace the batteries as soon asthe low battery indicator (M) appears.To replace the battery:1.Turn the rotary switch to OFF.e a Phillips screw driver to remove the bottom case screws.3.Lift and remove the bottom case.4.Remove the old battery.5.Replace the battery with a new 9-V battery.6.Install the bottom case and tighten the screws.Users ManualSpecificationsElectrical SpecificationsDisplay.................................................................9999 digit liquid crystal display withspecial symbolsOperating Humidity..............................................Less than 85% RHStorage Temperature..........................................-20 °C to 60 °C (-4 °F to 140 °F) Storage Humidity.................................................Less than 75% RHReference Temperature......................................23 °C ± 5 °C (73 °F ±9 °F)Temperature Coefficient......................................0.1 % X (specified accuracy)/ °C(< 18 °C or > 28 °C) Operating Temperature.......................................0 °C to +50 °C (+32 °F to +122 °F) Protective Type...................................................IP23 according toIEC 60529/EN 60529 Category Rating..................................................300 V CAT III/pollution degree 2 and600 V CAT IIEMC (Emission)..................................................IEC 61000-4-1, IEC 61326-1 class B EMC (Immunity)..................................................IEC 61000-4-2 8 kV (air) criteria B,IEC 61000-4-3 V/m perf. Criteria A Range Selection..................................................AutoOverload Indication.............................................OLMeasurement Frequency....................................3.333 kHzPower Requirement.............................................9 V alkaline (type IEC 6F22, NEDA1604)Power Consumption............................................Approx. 40 mA (in Ω function)Low Battery Indicator...........................................MMaximum Non-destructive Current......................100 A continuous, 200 A (< 10 sec)50/60 HzAccuracy of Calibration Plate..............................+/- 0.5%Data Logging Capacity........................................116 recordsData Logging Interval..........................................1 to 255 secondsGeneral SpecificationConductor Size....................................................35 mm (1.38 in) approximately Dimensions..........................................................276 mm (L) x 100 mm (W)X 47 mm (H)10.8 in (L) x 3.9 in (W) x 1.9 in (H)Weight.................................................................750 g (1.65 lbs)Earth Ground ClampSpecifications 15Ground Loop Resistance Range Accuracy[1] (± % of reading + Ω)0.025 to 0.250 Ω ± 1.5 % + 0.02 Ω0.250 to 1.000 Ω ± 1.5 % + 0.002 Ω1.000 to 9.999 Ω ± 1.5 % + 0.01 Ω10.00 to 50.00 Ω ± 1.5 % + 0.03 Ω50.00 to 99.99 Ω ± 1.5 % + 0.5 Ω100.0 to 200.0 Ω ± 3.0 % + 1.0 Ω200.1 to 400.0 Ω ± 5.0 % + 5.0 Ω400.0 to 600.0 Ω ± 10.0 % + 10.0 Ω600.0 to 1500.0 Ω ± 20.0 %[1] Loop resistance with no inductance, external field< 200 A/m, external electrical field < 1 V/m,conductor centered.Ground Leakage Current mAAutorange 50/60 Hz, True rms, crest factor CF <3.5Range Accuracy0.300 to 1.000 mA ± 2.0 % rdg ± 0.05 mA1.00 to 10.00 mA ±2.0 % rdg ± 0.03 mA10.0 to 100.0 mA ± 2.0 % rdg ± 0.3 mA100 to 1000 mA ± 2.0 % rdg ± 3.0 mAGround Leakage Current A50/60 Hz, True rms, crest factor CF <3.5Range Accuracy0.200 to 4.000 A ± 2.0 % rdg ± 0.003 A4.00 to 35.00 A ± 2.0 % rdg ± 0.03 A1630Users Manual 16。
真蓝动力TI500静态电源逆变器安装和使用手册说明书
INSTALLATION MANUAL ANDOPERATING INSTRUCTIONSTI500-( ) SeriesStatic Electrical Power InverterTrue Blue Power® is a division of Mid-Continent Instrument Co., Inc.Mid-Continent Instrument Co., Inc.dba Mid-Continent Instruments and Avionics9400 E. 34th Street N. Manual number 9017039Wichita, KS 67226 Rev E, August 29, 2012FOREWORDThis manual provides information intended for use by persons who, in accordance with current regulatory requirements, are qualified to install this equipment. If further information is required, please contact:True Blue Powerc/o Mid-Continent Instrument Co., Inc.Attn: Customer Service Dept.9400 E. 34th St. N.Wichita, KS 67226 USAPhone 316-630-0101Fax 316-630-0723We welcome your comments concerning this manual. Although every effort has been made to keep it free of errors, some may occur. When reporting a specific problem, please describe it briefly and include the manual part number, the paragraph/figure/table number, and the page number. Send your comments to:True Blue Powerc/o Mid-Continent Instrument Co., Inc.Attn: Technical Publications9400 E. 34th St. N.Wichita, KS 67226 USAPhone 316-630-0101Fax 316-630-0723©Copyright 2012Mid-Continent Instrument Co., Inc.REVISION DETAILRev. Date Approved Detailrelease.A 02/26/10 BAW/JRC InitialB 07/06/10 BAW/MKN Update Section 2.4 to add limitation statement regarding output.C 07/20/10 MKN/BAW Update unit picture with True Blue Power label.D 02/24/11 JDS/BAW Added section 3.3.2, and figure 3.4.E 08/29/12 BMC/JDS Model name changed to TI500.TABLE OF CONTENTSSECTION 1 GENERAL DESCRIPTION1.1INTRODUCTION1.2TECHNICAL SPECIFICATIONS1.2.1ELECTRICAL ATTRIBUTES1.2.2PHYSICAL ATTRIBUTES1.2.3QUALIFICATIONSSECTION 2INSTALLATION CONSIDERATIONS2.1COOLING2.2EQUIPMENT LOCATION2.3ROUTING OF CABLES2.4LIMITATIONSSECTION 3INSTALLATION PROCEDURE3.1GENERAL INFORMATION3.2UNPACKING AND INSPECTING3.3CABLE HARNESS3.3.1WIRE GAUGE SELECTION3.3.2PIN ASSIGNMENT INFORMATION3.3.3HARNESS VERIFICATION3.4MOUNTING3.5INSTALLATION COMPLETIONSECTION 4OPERATION4.1ELECTRICAL PERFORMANCE4.2PROTECTIVE FEATURESSECTION 5CONFORMANCE5.1CONTINUED AIRWORTHINESS STATEMENT5.2ENVIRONMENTAL QUALIFICATION STATEMENT NUMBER LIST OF TABLES AND FIGURESTABLE1.1 MODELS1.2 PHYSICAL ATTRIBUTES TABLETABLE1.3 PERFORMANCEFIGUREPINOUT3.3 CONNECTOR3.3 CONNECTOR PINOUT TABLEDIAGRAMS3.4 EXAMPLEWIRING3.5 TI500 OUTLINE DRAWING FIGURE3.6 TI500 MOUNTING ADAPTER FIGUREPERFORMANCE4.1 THDSECTION 1GENERAL DESCRIPTION1.1INTRODUCTIONThe model TI500 series Static Electrical Power Inverter is a lightweight power converter that translates a 20 to 36 VDC input to a 115 VAC output at 60 Hertz and provides 500 watts (VA) of power. The alternating current output is defined as a pure sine wave with less than 3% of total harmonic distortion for clean, noise-free, harmonic-free power to supply nearly any common commercial or consumer load rated for a nominal input of 115VAC. The TI500 series Inverter, part number MD50-( ), is FAA certified to TSO C73 and tested to rigorous environmental standards and levels of RTCA DO-160. The small size and light weight in conjunction with its installation flexibility inside or outside the pressure vessel make it an ideal choice for aircraft power needs while reducing the challenges associated with other similar products. Highlighted features include short circuit protection, overload capability, low voltage shut-down, temperature monitoring, a self-resettable over-temperature disable, and a remote on/off function. The rugged extrusion that houses the unit is designed to help dissipate heat and provide mechanical strength against vibration or other possibilities of damage. Two independent fans allow for a smaller unit and provide a quieter operation while keeping the internal components cool and extending the life of the unit.1.2TECHNICAL SPECIFICATIONS1.2.1ELECTRICAL ATTRIBUTESCharacteristics:Input Voltage: Rated 28VDC nominal; 20-36VDC certifiedInput Power: 17-25 amps; 0.2A at no loadOutput Voltage: 115VAC ±3% at 60 Hertz ±0.1% (single phase)Output Power: 500 watts (500 VA at power factor = 1)Output Waveform: Pure sine wavePower Factor: -0.8 to +0.8Efficiency: 88%nominalTotal Harmonic Distortion (THD): < 3%; See Figure 4.1Table 1.11.2.2PHYSICAL ATTRIBUTESCharacteristics:Weight: 3.9poundsDimensions:(not including connector mate) 6.71 inches long (8.15 inches – mounting base) 6.34 inches wide2.74 inches highMating Connector (and cable clamp): MS3106A-18-9S or equivalent (MCI P/N 9016905-1 and -2) Mounting: Base mount – orientation not criticalTable 1.21.2.3QUALIFICATIONSSpecifications:Qualification: FAATSO-C73 Environmental Qualification: RTCA DO-160F Environmental CategoryF3(Y)S2BB(RCC1)XXXXXXZXXXXXBXXXXXAltitude: -15,000 ft to +55,000 ftTemperature: -55°C to +70°C (-67°F to +158°F); See Figure 4.2SECTION 2PRE-INSTALLATION CONSIDERATIONS2.1COOLINGNo external cooling is required. The unit is equipped with two internal brushless DC fans. Restriction to airflow can cause overheating of the unit and limit performance or reduce the expected life of the product. Make sure to provide adequate clearance on both ends of the unit with the hexagonal openings to allow for proper circulation. In general, four to six inches of clearance on both ends of the unit should be acceptable. Mounting the unit to a metal surface can also help reduce the effects of temperature within the unit but is not required.2.2EQUIPMENT LOCATIONThe TI500 Static Inverter is designed for mounting flexibility, allowing for installation inside or outside the pressure vessel with no requirement for temperature control. In addition to altitude and temperature resistance, the unit is also designed to withstand high levels of condensing humidity. However, installation locations where the unit could be subject to standing or direct water exposure should be avoided. The unit can be mounted in any orientation. Clearance should be provided for the mating connector and may require as much as four to five inches past the unit connector to allow for the backshell, access to the connector, and appropriate wire bends.2.3ROUTING OF CABLESThe wires and cable bundle associated with the unit are heavy gauge wire and carry significant power. Be aware of routing cables near other electronics or with other wire bundles that may be susceptible to high energy flow.Avoid sharp bends in cabling and routing near aircraft control cables. Also avoid proximity and contact with aircraft structures, avionics equipment, or other obstructions that could chafe wires during flight and cause undesirable effects.2.4LIMITATIONSThe TI500-( ) Series of static electric power inverters is certified to FAA TSO-C73 with the following limitations identified:1)Alternating current (AC) output is provided at 115 volts and 60 hertz in lieu of 115 volts and 400hertz as identified in the MPS of the TSO.2)Equivalent environmental qualification was verified per RTCA DO-160F in lieu of those identifiedwithin the MPS of the TSO.The conditions and tests for TSO approval of this article are minimum performance standards. Those installing this article, on or in a specific type or class of aircraft, must determine that the aircraft installation conditions are within the TSO standards, specification of the article, and deviations as listed above. TSO articles must have separate approval for installation in an aircraft. The article may be installed only according to 14 CFR part 43 or the applicable airworthiness requirements.SECTION 3INSTALLATION PROCEDURES3.1GENERAL INFORMATIONThis section contains interconnect diagrams, mounting dimensions and other information pertaining tothe installation of the TI500 Static Inverter. After installation of cabling and before installation of the equipment, ensure that power is applied only to the pins specified in the interconnect diagram.3.2UNPACKING AND INSPECTING EQUIPMENTWhen unpacking this equipment, make a visual inspection for evidence of any damage that may have incurred during shipment. The following parts should be included:a.Static Inverter – MCI P/N MD50 [or MD50-( )]b.Mating Connector (& cable clamp) – MCI P/N 9016905-1 (and 9016905-2)c.Installation Manual – MCI P/N 9017039Optional equipment available:a.Mounting Adapter Kit – MCI P/N 9017040Equipment not provided:a.Mounting Hardware – four (4) #10-32 pan head screws#10 lock washers (optional)b.Cable Harness Wire – See Section 3.3 for specification3.3CABLE HARNESSConstruct the cable harness with regards to the instructions below, and using the Connector Pinout of Figure 3.3, Figure 3.4, and Wiring Diagram of Table 3.3.Refer to Section 2: Pre-Installation Considerations in regards to routing precautions.3.3.1WIRE GAUGE SELECTIONUse of PTFE, ETFE, TFE, Teflon, or tefzel insulated wire is recommended for aircraft use. Usethe following wire gauges for each of the pins in the connector:Pin A and D – 12 AWG stranded or solidPin B and C – 16 AWG stranded or solidPin E and G – 16-24 AWG stranded or solid3.3.2PIN ASSIGNMENT INFORMATIONINPUT POWER:Pin A – Positive DC input +24 to 32 VDC. Connect to the aircraft 28 VDC bus using a 25 or30 Amp circuit breaker.Pin D – Negative DC input. Internally this pin is connected to the inverter enclosure. Connectto aircraft ground.INVERTER OUPUT :Pin B – AC Output 115VAC, 60Hz. Used for powering devices where terrestrial/utility power designations are used, pin B can be connected as “Line” or “Hot”.Pin C – AC Return 115VAC, 60Hz. Used for powering devices where terrestrial/utility power designations are used, pin C can be connected as “Neutral”.Note: Use of a circuit breaker on the AC output is optional. For the fullinverter 500VA output, a 5 Amp circuit breaker is sufficient. For convenience at each AC outlet, individual circuit breakers of 1 to 2 amps each can be used. If a single pole breaker is used, install the breaker on the wire from pin B. If a double pole breaker is installed, route both pins B and C through the circuit breaker.REMOTE ON/OFF CONTROL: (see section 4.2.1)Pin E – Remote ON/OFF Control. Connecting this pin to either DC Negative or to inverter pin G will enable the AC output of the inverter. By utilizing a switch between this pin and ground or negative, it will allow remote on/off control of the unit. When unconnected (output is OFF) this pin will have approximately 11 VDC present, internally limited to less than 1 mA. If the inverter is to be enabled at all times, pin E can be connected to pin G.Pin G – Remote ON/OFF Return. This pin is internally connected to pin D and the enclosure. Pin G can be used as the return from an ON/OFF switch or left unconnected. It is recommended that pin G not be connected directly to ground or 28V negative. Pin F – Reserved. Do not use.FIGURE 3.3 TABLE 3.3 PINOUT VIEW OF CONNECTOR PINOUTUNIT CONNECTORAD BE CF GTI500A 28VDC28VDCTI50030A30A3rd Partyequipment AA A(not supplied)110VAC Outlet(s)(not supplied)Ground Fault Indicator(not supplied)Notes:1. Wiring diagrams above represent various examples of typical installations.2. Recommended to attach case to metal aircraft structure.3. Recommended outlet protection may consist of either:A. single 5A circuit breaker for all outlet(s) (single or double pole breaker), ORB. 1-2A circuit breakers for each outlet4. For Remote On/Off operation, return line can be configured in one of three ways:1. return line connected to pin G2. return line connceted to pin D3. return line connected to aircraft ground3.3.3HARNESS VERIFICATIONWith the TI500 Static Inverter disconnected, activate the aircraft power bus that supplies theunit and use an multi-meter to verify that aircraft power and ground with appropriate voltageis on the pins within the mating harness.3.4MOUNTINGRefer to Section 2: Pre-Installation Considerations in regards to equipment location.The TI500 Static Inverter is designed for base mounting only. Four #10-32 mounting holes should be provided in the aircraft in accordance with Figure 3.5. If installing the TI500 as a replacement for legacy static inverters, an optional Mounting Adapter Kit adapter plate is available to utilize the same mounting hole locations. See figure 3.6 for mounting hole locations using the Mounting Adapter Kit and Section 3.2 for the Mounting Adapter Kit part number. Secure the unit with four #10-32 pan head phillips screws or equivalent. A lock washer under the head of each screw is recommended.3.5INSTALLATION COMPLETIONPrior to operating the unit in the aircraft, it is recommended to verify the output and functionality of the unit. In order to prevent accidental damage to other systems, it is best not attach the output to other equipment or power busses prior to verification. Verify the output of the unit at the terminating end of the cable with a multimeter to ensure proper voltage and polarity. Once verified, installation can be completed and functionality of the remote on/off feature (if used) should be checked.FIGURE 3.5TI500 OUTLINE DRAWINGFIGURE 3.6TI500 MOUNTING ADAPTERSECTION 4 OPERATION4.1 ELECTRICAL PERFORMANCEThe TI500 series Static Inverter converts a direct current (DC) voltage input to a regulated 115 volt alternating current (VAC) output. The output is controlled to a frequency of 60 Hertz and represents a pure sine wave with minimal distortion. The unit is capable of providing 500 watts to power a variety of aircraft accessories including laptops, personal electronics, onboard systems, and many others. (See Section 1.2.1 for tolerance ranges)The unit is designed as a two-stage, solid-state switch-mode power supply. The power transformation utilizes a first-stage push-pull methodology followed by an H-bridge AC forming second stage. The primary stage utilizes ‘current-mode’ control providing instantaneous load protection as an advantage over legacy designs that incorporate ‘voltage-mode’ controllers. The alternating current is frequencycontrolled using a crystal oscillator reference. Figure 4.1 Total Harmonic Distortion Performance vs Load Figure 4.2 Output Power Performance vs Temperature0.000.501.001.502.002.500200400600800T H D %output power (watts)100200300400500600‐60‐202060100o u t p u t p o w e r (w a t t s )temperature (°C)4.2PROTECTIVE FEATURES4.2.1REMOTE ON/OFFThe TI500 series Static Inverter incorporates a remote on/off feature that allows the user toenable or disable the output of the unit. By providing a ground on the appropriate pin (SeeTable 3.3) the user, via a remote mounted switch or similar method, can enable the outputof the unit. The unit can be similarly disabled by removing the ground signal (open circuit) tothe same pin.4.2.2OVER-VOLTAGEWhen the input voltage exceeds the operating range of the unit (See Section 1.2.1; absolutemaximum input of 37VDC) the unit senses an over-voltage condition and disables the output.The unit will dynamically monitor the input voltage such that if the input returns to within thenormal operating range, the output will be enabled and allow the unit to operate normally.4.2.3UNDER-VOLTAGEWhen the input voltage drops below the operating range of the unit (See Section 1.2.1;absolute minimum input of 20VDC) the unit senses an under-voltage condition and disablesthe output. The unit will dynamically monitor the input voltage such that if the input returnsto within the normal operating range, the output will be enabled and allow the unit tooperate normally.4.2.4OVER-TEMPERATUREThe TI500 incorporates an internal temperature sensing device that continually providesmonitoring and feedback to the control circuits. When the unit senses an internal conditionthat exceeds maximum temperature ratings, the output is disabled. The internal cooling fanswill continue to operate and the unit output will be enabled when the temperature returns towithin acceptable limits. This over-temperature reset occurs automatically without externalintervention required.4.2.5SHORT CIRCUIT AND OVER-CURRENTThe TI500 is capable of surviving a short circuit or over-current event without permanentdamage or effect to long-term reliability. The unit can provide over its rated power output upto 550 watts for up to 2 hours. The unit is also capable of supporting an overload conditionof 750 watts for 5 minutes with distortion of the sine wave and reduced voltage output.The unit monitors on pulse-by-pulse scenario to determine a short circuit or over-currentsituation. If detected, the output is limited by clipping the AC sine wave form, limiting thepower output. The unit will also produce an audible clicking noise, indicating that the poweroutput limit has been exceeded. When the short circuit or over-current event is removed, theunit will return to normal operation.4.2.6TEMPERATURE REGULATED COOLINGThe unit is equipped with two internal brushless DC fans for cooling to extend the powerrange and long-term life. The fans are activated at a specified point determined by thecontinuous monitoring of the internal temperature. The fans operate very quietly to reducethe audible noise in any environment. The two fans provide independent redundancy forprotection of the unit in the event that one becomes inoperative.The unit is also designed to provide 75% of the rated load continuously at temperatures upto +40°C in the event that both fans become inoperable and no cooling is available.SECTION 5 CONFORMANCE 5.1 CONTINUED AIRWORTHINESS STATEMENT No periodic scheduled maintenance or calibration is necessary for continued airworthiness of the TI500 series Static Inverter. If the unit fails to perform to specifications, the unit must be removed and serviced by Mid-Continent Instruments and Avionics or their authorized designee.5.2 ENVIRONMENTAL QUALIFICATION STATEMENT NOMENCLATURE: Static Electrical Power Inverter MODEL NUMBER: MD50-( ) TSO NUMBER: C73 MANUFACTURERS SPECIFICATIONS: Minimum Performance Specifications: Test Specification (TS) 445, Test Data Sheet (TDS) 445 QUALIFICATION STANDARD: RTCA DO-160FCONDITIONS SECTION DESCRIPTION OF TESTTemperature and Altitude Low Temperature High Temperature In-Flight Loss of Cooling Decompression Overpressure 4 4.5.1 4.5.2 4.5.5 4.6.2 4.6.3 Category F3(Y) Operating Low Temp = -55C Operating High Temp = +70C Category Y = 300 minutes, +40C, 75% Altitude = +55,000 ft -15,000 ftTemperature Variation 5 Category S2Humidity 6 Category B Operational Shock and Crash Safety7 Category B Vibration 8 Category R, Curve C, C1(RCC1)Explosion 9 Category X Waterproofness 10 Category XFluids 11 Category X Sand and Dust 12 Category XFungus 13 Category X Salt Spray 14 Category XMagnetic Effect 15 Category ZPower Input 16 Category XVoltage Spike 17 Category XAudio Frequency Conducted Susceptibility18 Category X Induced Signal Susceptibility 19 Category XRadio Frequency Susceptibility 20Category X Emission of Radio Freq Energy 21 Category BLightning Induced Transient Susceptibility22 Category X Lightning Direct Effects 23 Category XIcing 24 Category X ESD 25 Category X Flammability 26 Category X。
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Efficient Replication of XML Documents with BLOB dataCS297 ReportbyPreethi VishwanathAdvisor: Dr. Chris PollettDepartment of Computer ScienceSan Jose State UniversityDecember 2006List of Figures and TablesFigure Page1. XML Parser Main Loop62. An XML Element Representation (in an XML Tree)73. Contextual representation of XML Data74. XML Parse Tree & Linked List85. SQL Invokable User Defined Function96. Implementation of User Defined Function107. An example test XML file108. SQL Script for testing119. Output from SQL Script1110. Interface definition for a VoterManager1311. Interface definition for each Voter.1412. Output from Byzantine agreement on a boolean variable1513. Blob insight available to a particular voter1614. Populating the BLOB->Machine ID for every voter1715. Manager Iterating over all BLOBS for distributed consensus1716. Output (Truncated) of the Byzantine algorithm for BLOB mapping19 Table Page 1. BLOB to Machine Mapping for an individual voter161.IntroductionWith the advent of XML support in many databases that could be run in distributed mode, new issues in replication of XML data arise. For instance, if an XML document is used to manage several BLOBs, such as might occur in multi media applications, then in a distributed setting both the XML document and the BLOBs they contain might be replicated independently of each other. The goal of our project is to develop a replication aware algorithm for this kind of XML data and to provide an example implementation on an open source database such as Postgres.XML (Extensible Markup Language) is a W3C initiative that provides a text-based mark-up language as a means to describe data. With XML, one can specify both the grammar of the language, in terms of new element definitions, and its use, usually in the form of tree-structured records of the new elements in the same document.A distributed database is a database that presents a single logical view to its users, but one in which the underlying data is stored across multiple nodes that are connected to each other via some form of communication network.Replication is a technique which is used in distributed databases to avoid data loss in case of a catastrophe by implementing fail-safe redundancy for records by maintaining an exact replica of part or entire database over multiple nodes. Replication also helps to reduce access times by distributing queries across these nodes that exploits certain database properties such as relative distance of the data node from the query client, current load on the database and the like.Binary Large Object Binaries (BLOBS) are first class objects in database systems, much like strings (varchar) and integers (int) and is unstructured binary data stored as a single entity in a database management system [3]. This format is typically used to store streaming data like audios, videos in a database. With the advent of online video and audio websites (like Google Video, YouTube, Napster etc), the usage of BLOBS in databases is on the rise. To ensure high availability, these BLOBS are usually replicated across multiple nodes in a distributed fashion. Typically, some websites also offer playlists that are usually composed of multiple BLOBs stored in an XML document, which may also then be replicated. Clearly, there exists a need for a framework where it might be possible to merge these independent requirements into a more efficient collective framework.During the course of the semester, I had the opportunity to investigate multiple of these issues, including examining current research, summarizing the same and formulating problem statements that will be eventually used for furthering research in development of such a framework. The rest of the document summarizes the problem statements we worked on during the course of the semester, along with our solutions to the same, and how they help in our thesis work. We finally conclude with a detailed proposal that weplan to work on in the next semester.2. XML parsing in PostgreSQL2.1 GoalTo allow for intelligent replication of BLOB data contained in an XML document in an open source database (e.g. Postgres), it is essential to add XML parsing functionality to allow for discovery of BLOB metadata in an XML document. Our first deliverable was to add XML parsing support to Postgres by implementing a User Defined Function (UDF). User Defined Functions are functions which permit users to add additional functionality in the form of extensions that can be called from regular SQL procedures to the database. These functions can be written in high level programming languages like C, C++, Perl, Java etc. These are compiled into a shared library (or jar files) and are loaded by the server upon first use.The ability to parse an XML document and shred it into the database is necessary for us since most real world usages of BLOBs usually embed these within an XML document, which may contain, in addition to details about the BLOB (e.g. record name, size), the details of the replicas of the BLOB as well.For this deliverable, our example XML document consists of multiple records of postal addresses, and our extension function shreds these records into individual elements of the postal address and inserts them into the database.2.2 Design and ImplementationThis deliverable [18] consists of the following parts(a)parsing of the XML document,(b)creation of the intermediate data representation and(c)Shredding of the data into the database2.2.1 XML ParserThe algorithm and implementation for parsing of the XML document has been borrowed from the open source C-XML parser, expat [2]. The parser provides for identification of XML elements and stubs for implementing callbacks when an XML element is encountered. In the code snippet below, the user implemented function callbacks startElement and endElement are invoked for every TAG (new element), while the function charHandle is invoked for the enclosed datavoid create_xml_tree(char* fname, int size){char buf[BUFSIZ];int done;XML_Parser parser = XML_ParserCreate(NULL);XML_SetElementHandler(parser, startElement, endElement);XML_SetCharacterDataHandler(parser, charHandle);fname[size] = '\0';FILE *fp = fopen(fname, "r");do {size_t len = fread(buf, 1, sizeof(buf), fp);done = len < sizeof(buf);if (!XML_Parse(parser, buf, len, done))return;} while (!done);fclose(fp);XML_ParserFree(parser);return;}Figure 1: XML Parser Main Loop2.2.2 Intermediate RepresentationWe have added stub implementations for startElement, endElement and charHandle that create an in-memory tree based representation of the XML document. For every XML element enclosed by tags, a structure of the form below is instantiated and added to the tree. At each nesting level in the document, the tree depth is increased, and the new element is added as a child to the current node being processed.struct xml_node{char* name;char* value;int depth;int nchilds;struct xml_node* prev;struct xml_node* child[MAX_CHILD];};Figure 2: An XML Element Representation (in an XML Tree)In addition, for every leaf node (an address record), a context-sensitive structure of the form below is instantiated and added to a list of address records. This allows for easy traversal for a database-style record traversal. Below is the exact match for a database-style record traversal.struct addr_rec{char* fname;char* lname;char* street;char* state;char* country;struct addr_rec* next;};Figure 3: Contextual representation of XML DataThe code snippet below with the associated global variables create the in-memory tree based representation of the XML document, in addition to creating a context sensitive linked list (of address records)struct xml_node* curr_node = NULL;struct xml_node* head_node = NULL;struct addr_rec* rec_list = NULL;struct addr_rec* head_rec_list = NULL;void startElement(void *userData, const char *name, const char **atts){struct xml_node* tmp_node = NULL;if (curr_node == NULL) {curr_node = create_node(name, 0);head_node = curr_node;} else {tmp_node = create_node(name, (curr_node->depth + 1));curr_node->child[curr_node->nchilds] = tmp_node;curr_node->nchilds ++;tmp_node->prev = curr_node;curr_node = tmp_node;}}void endElement(void *userData, const char *name){if (rec_list == NULL) {rec_list = create_addr_rec();head_rec_list = rec_list;}if (curr_node->nchilds == 0) {char* val = curr_node->value;init_rec(rec_list, val);if (rec_list->next == NULL) {rec_list->next = create_addr_rec();rec_list = rec_list->next;rec_list->fname = val;}}curr_node = curr_node->prev;}void charHandle(void *userData,const XML_Char *s,int len){char* my_val;if (is_empty((const char *)s,len)) return;my_val = (char *)malloc((len+1)*sizeof(char));memcpy(my_val, s, len);my_val[len] = '\0';curr_node->value = my_val;}Figure 4: XML Parse Tree & Linked List (Intermediate Representation)2.2.3 PostgreSQL extensionFinally, we have to invoke the XML parser functionality from within SQL statements executed on the command line. This consists of implementing an SQL based front end User Defined Function, and a backend responsible for interfacing with the XML parserand returning the XML records. The backend is implemented as a Set Returning Function (SRF) that returns XML address records one record at a time.The SQL front-end UDF is defined as below. Notice that the implementation function is included in the shared object libproj1.so and is implemented as get_xml_data CREATE OR REPLACE FUNCTION get_xml_data(IN integer,IN text,OUT f6 VARCHAR,OUT f7 VARCHAR,OUT f8 VARCHAR,OUT f9 VARCHAR,OUT f10 VARCHAR) RETURNS SETOF record AS '/home/hlthantr/proj_one/libproj1', 'get_xml_data'LANGUAGE C IMMUTABLE STRICT;Figure 5: SQL Invokable User Defined Function (PostgreSQL FrontEnd)The function get_xml_data instantiates the XML parser and creates the intermediate representation after obtaining the name of the XML file as input. It returns one XML address record for every call made to it. This is achieved by traversing the address record linked list one XML address record at a time. Note the use of first call, and iterative manner of obtaining record like data from PostgreSQL.Datum get_xml_data(PG_FUNCTION_ARGS){FuncCallContext *f_ctx;MemoryContext oldC;TupleDesc tup_desc;AttInMetadata *attinmeta;int call_cntr;int max_calls;struct addr_rec* xml_addr = NULL;text* t;int32 fsize;if (SRF_IS_FIRSTCALL()) {f_ctx = SRF_FIRSTCALL_INIT();oldC = MemoryContextSwitchTo(f_ctx->multi_call_memory_ctx);f_ctx->max_calls = PG_GETARG_UINT32(0);t = PG_GETARG_TEXT_P(1);fsize = VARSIZE(t) - VARHDRSZ;create_xml_tree((char *)VARDATA(t), fsize);attinmeta = TupleDescGetAttInMetadata(tup_desc);f_ctx->attinmeta = attinmeta;f_ctx->user_fctx = (void *)head_rec_list;MemoryContextSwitchTo(oldC);}f_ctx = SRF_PERCALL_SETUP();call_cntr = f_ctx->call_cntr;max_calls = f_ctx->max_calls;attinmeta = f_ctx->attinmeta;xml_addr = (struct addr_rec *)f_ctx->user_fctx;if (call_cntr < max_calls) {char **values;HeapTuple tuple;Datum result;values = (char **)palloc(5* sizeof(char *));update_values(xml_addr,values);tuple = BuildTupleFromCStrings(attinmeta, values);result = HeapTupleGetDatum(tuple);f_ctx->user_fctx = (void *)(xml_addr->next);SRF_RETURN_NEXT(f_ctx, result);} else {SRF_RETURN_DONE(f_ctx);}}Figure 6: Implementation of User Defined Function (PostgreSQL C Backend) 2.2.4 Test FilesThe following XML document was used for testing the newly implemented XML parser that was installed as a shared object at /home/prithari/proj_one/libproj1<address-book><entry><person><first>Basil</first><last>Elton</last></person><street>North Point Lighthouse</street><state>CA</state><country>USA</country></entry><entry><person><first>Elton</first><last>John</last></person><street>Monroe Street</street><state>NY</state><country>USA</country></entry></address-book>Figure 7: An example test XML fileThe following composite SQL script was used to test the XML parser functionalityDROP FUNCTION get_xml_data(integer, text);CREATE OR REPLACE FUNCTION get_xml_data(IN integer,IN text,OUT f6 VARCHAR,OUT f7 VARCHAR,OUT f8 VARCHAR,OUT f9 VARCHAR,OUT f10 VARCHAR) RETURNS SETOF recordAS '/home/prithari/proj_one/libproj1', 'get_xml_data'LANGUAGE C IMMUTABLE STRICT;DROP TABLE tblP;CREATE TABLE tblP(fname VARCHAR, lname VARCHAR, saddr VARCHAR, state VARCHAR, cntry VARCHAR);INSERT INTO tblP VALUES((get_xml_data(4,'/home/prithari/proj_one/test.xml')).f6, (get_xml_data(4,'/home/prithari/proj_one/test.xml')).f7,(get_xml_data(4,'/home/prithari/proj_one/test.xml')).f8,(get_xml_data(4,'/home/prithari/proj_one/test.xml')).f9,(get_xml_data(4,'/home/prithari/proj_one/test.xml')).f10);SELECT * FROM tblP;Figure 8: SQL Script for testing2.2.5 OutputThe log below represents the output (truncated) log from running proj1.sql$ psql testdbtestdb=# \i proj1.sqlDROP FUNCTIONCREATE FUNCTIONDROP TABLECREATE TABLEINSERT 0 4fname | lname | saddr | state | cntry---------+----------+------------------------+---------+-------Basil | Elton | North Point Lighthouse | CA | USAElton | John | Monroe Street | NY | USAJohn | Grisham | bailey Street | England | UKJohn R. | Legrasse | 121 Bienville St. | LA | USA(4 rows)Figure 9: Output from SQL Script(Truncated)As observed in the above example, the data (addresses) from the XML file have been shredded and inserted to the table3. A Distributed Byzantine Algorithm3.1 GoalOne of our goals is to determine an efficient mechanism to access replicated data that exists across different machines. One of the common problems is to decide which of the replicated copies to access. This can be achieved by evolving a distributed consensus, where the node in question participates in a “voting” process with several other nodes, some of which might be faulty, and all agree on a solution if a certain number of voters (7/8in our case) agree.3.2 Design and ImplementationTo implement this algorithm, we have adapted the solution for Byzantine agreement on a single node and extended it for multiple machines using Java RMI. The basic version relies on each “voter” being a subclass of the javax.swing.Timer that is instantiated with a configurable delay at the end of which each voter casts his vote for this round, and polls votes received from all other voters in the previous round to see if 7/8 voters agree. To allow for the program to converge, a biasing element is introduced that biases this voter in favor of the majority (5/8) for each successive round. Two of the voters are configured as faulty, allowing them to change their vote completely randomly, even within the same round.To extend this implementation for our purpose, we have used Java RMI methods to create voters, and for voters to poll each other. The main Manager object is responsible for creating voters, and for polling each voter to check if they have individually arrived at an agreement. The Manager exits the program when all voters have reached a Byzantine agreementThe Manager obtains a reference to a VoterManager which defines a manager interface that allows for instantiation of voters. Java RMI allows for the calling program to be completely unaware of whether the instantiation occurs locally or on a remote node. Note that the interface extends java.rmi.Remote, which is necessary for object references to be serializable, and hence be marshalled.interface VoterManager extends java.rmi.Remote{public Voter createVoter(int delay, boolean flty, String db,String user, String passwd, String tblName)throws java.rmi.RemoteException, ClassNotFoundException,java.sql.SQLException;}Figure 10: Interface definition for a VoterManager that creates voters on a host The VoterManager supplies each voter it creates with information regarding delay, the nature (faulty/non-faulty), and database related information. The VoterManagerImpl provides an implementation of the above interface. Each voter, in turn, has a well defined interface that is used by other voters to gather votes. In addition, each voter also provides methods for the Manager to initialize, start, and check for Byzantine completion. The interface definition below summarizes the methods a Byzantine voter must implementimport java.util.*;interface Voter extends java.rmi.Remote{public void initialize(ArrayList list)throws java.rmi.RemoteException,java.sql.SQLException,ClassNotFoundException;public void start() throws java.rmi.RemoteException;public boolean isDone() throws java.rmi.RemoteException;public void receiveVote(int i, Voter v)throws java.rmi.RemoteException,ClassNotFoundException,java.sql.SQLException;public int getRoundNumber() throws java.rmi.RemoteException;public int getDecision() throws java.rmi.RemoteException;}Figure 11: Interface definition for each Voter.The initialize(), start(), isDone() methods are used by the Manager to initialize voter objects that have been created, to start the Byzantine algorithm on each voter and to check for local Byzantine completion on each node respectively.The voters also vote and poll each other to check on agreement for a 0/1 value for a single variable in a Byzantine fashion. The public methods getRoundNumber, receiveVote and getDecision are meant for communication among voters to exchange individual status. We use JDBC methods to access the PostgreSQL DB that acts as the backing store to keep every vote received in every round. Every tuple in our relation is of the form <voterID, roundNumber, numVotes, headCnt, tailCnt>. Byzantine Agreement is observed on each node independently, when ALL votes in a round have been received AND 7/8 voters agree on the value of the vote.The program [19] can be configured to run on multiple nodes, with multiple voters/node, and some configurable number of faulty nodes.3.3 OutputIn each round, every voter casts a vote. If 7/8 of his votes agree, he reaches a decision., i.e. never changes his vote for future rounds. Once all the voters reach a decision the Byzantine Agreement is reached. Truncated output for the final round is shown below. Voter 0:Round : 2Decision : 0Voter 1:Round : 2Decision : 0Voter 2:Round : 3Decision : 0Voter 3:Round : 2Decision : 0Voter 4:Round : 2Decision : 0Voter 5:Round : 2Decision : 0Voter 6:Round : 2Decision : 0Voter 7:Round : 2Decision : 0Figure 12: Output (Truncated) from Byzantine agreement on a boolean variableIn round 4 Byzantine Agreement is reached, since all voters have a decision by round 3.4. Extending the Byzantine Algorithm for multiple BLOBS4.1 GoalPreviously, we implemented a Distributed Byzantine implementation where all the nodes in question arrived at a decision for a Boolean valued data. In a real world scenario, such an assumption is too simplistic. In this project, we solve the real-world problem of determining the most suitable machine in which to replicate a BLOB, where the answer is arrived at by distributed consensus between multiple voters. Consider that there are a set of BLOBS BSET = {B1, B2, B3, B4, B5, B6} and a set of machines MSET = {M1, M2, M3}, and a set of Voters VSET = {V1, V2, V3, V4 } each with partial interest in some of the BLOBs in B, and an opinion on where the BLOB should be replicated. Let’s further assume that each of the voters in VSET represent this opinion in the form of an XMLdocument, then the composite problem statement would be to uniquely determine, through consensus, a machine M that belongs to MSET for every blob B that belongs to BSET. We further introduce the notion of an “idle” voter, who votes randomly for any BLOB that he has no knowledge about (i.e. not present in his XML document). This voter, however, adopts the majority opinion for any BLOB as soon as 3/4 voters agree. The Byzantine problem statement is formulated as one of arriving at a consensus among a set of voters on one of several machines as the choice for replicating each BLOB in the set.4.2 Design and ImplementationFor the implementation of this algorithm, we extensively used our previous deliverables, the first deliverable record structures were changed for the XML representation of voter opinion. An example voter opinion in XML form is below<blob-details><machine_code>0</machine_code><blob>0</blob><machine_code>7</machine_code><blob>2</blob><machine_code>7</machine_code><blob>3</blob></blob-details>Figure 13: BLOB insight available to a particular voter (in an XML form)For this voter, the following table summarizes his opinion about different blobs.For BLOBID 1, this voter does not have a vote and will behave like an IDLE voter. Most of the basic algorithms did not change in this deliverable [20], except for additional logic that got added to the top level Manager, first for accessing the BLOB->machine mapping, and then to obtain distributed consensus between all voters one BLOB at a time. Some snippets of the code below illustrate these changes.sqlText = "SELECT machine_code, blob_id FROM " + tblConfig+ " WHERE voter_id = " + idx;ResultSet rs= sql.executeQuery(sqlText);while (rs.next()){String mName = rs.getString(1);String mBlob = rs.getString(2);Integer m_Name = new Integer(Integer.parseInt(mName));Integer m_Blob = new Integer(Integer.parseInt(mBlob));ht_blobMachine.put(m_Blob, m_Name);if(!nMachines.contains(m_Name)){nMachines.add(m_Name);}if (!nBlobs.contains(m_Blob)){nBlobs.add(m_Blob);}}rs.close();Figure 14: Populating the Blob->Machine ID for every voterfor (int i = 0; i < nBlobs.size(); i ++){// Initialize Voters to start for Blob #iinitializeVoters(vList, nMachines.size(),i);startVoters(vList);while (true){if (voterDone(vList)){System.out.println("!!!BYZANTINE REACHED FOR BLOB #" + i + "!!!");break;}}}Figure 15: Manager Iterating over all BLOBS for distributed consensusThere were a few more changes made to the Byzantine algorithm, mostly to deal with keeping counts for each machine and introducing the idea of an IDLE voter, but overall, the structure or basic consensus algorithm did not change much.4.3 OutputByzantine algorithm was run to find an agreement among every voter for every BLOB on the machine to go to for a particular BLOB. As is evident, this algorithm takes much longer to converge than a simple agreement on a Boolean variable like the one before. There are 8 set of possible values [for 8 machines], there is a notion of idle voters that act as random voters for BLOBS that they do not have a mapping for initially, and there are voters who are faulty. All these leads to very large convergence times as can be seen in the truncated output belowVTR[4]:VOTE:[0]:RND[61]Voter 4 Agreement Reached!! Agreement is 0VTR[2]:VOTE:[1]:RND[62]Voter 2 Agreement Reached!! Agreement is 0VTR[0]:VOTE:[0]:RND[62]Voter 0 Agreement Reached!! Agreement is 0VTR[1]:VOTE:[0]:RND[62]Voter 1 Agreement Reached!! Agreement is 0VTR[6]:VOTE:[0]:RND[62]Voter 6 Agreement Reached!! Agreement is 0VTR[5]:VOTE:[0]:RND[62]Voter 5 Agreement Reached!! Agreement is 0VTR[3]:VOTE:[0]:RND[62]Voter 3 Agreement Reached!! Agreement is 0VTR[7]:VOTE:[5]:RND[63]Voter 7 Agreement Reached!! Agreement is 0!!!BYZANTINE REACHED FOR BLOB #0!!!VTR[1]:VOTE:[6]:RND[14]Voter 1 Agreement Reached!! Agreement is 6VTR[6]:VOTE:[6]:RND[14]Voter 6 Agreement Reached!! Agreement is 6VTR[5]:VOTE:[6]:RND[14]Voter 5 Agreement Reached!! Agreement is 6VTR[3]:VOTE:[6]:RND[14]Voter 3 Agreement Reached!! Agreement is 6VTR[7]:VOTE:[2]:RND[15]Voter 7 Agreement Reached!! Agreement is 6VTR[2]:VOTE:[6]:RND[15]Voter 2 Agreement Reached!! Agreement is 6VTR[4]:VOTE:[6]:RND[14]Voter 4 Agreement Reached!! Agreement is 6VTR[0]:VOTE:[6]:RND[15]Voter 0 Agreement Reached!! Agreement is 6!!!BYZANTINE REACHED FOR BLOB #1!!!VTR[3]:VOTE:[3]:RND[55]Voter 3 Agreement Reached!! Agreement is 3VTR[1]:VOTE:[3]:RND[55]Voter 1 Agreement Reached!! Agreement is 3VTR[6]:VOTE:[3]:RND[55]Voter 6 Agreement Reached!! Agreement is 3VTR[7]:VOTE:[3]:RND[56]Voter 7 Agreement Reached!! Agreement is 3VTR[2]:VOTE:[1]:RND[56]Voter 2 Agreement Reached!! Agreement is 3VTR[4]:VOTE:[3]:RND[55]Voter 4 Agreement Reached!! Agreement is 3VTR[5]:VOTE:[3]:RND[56]Voter 5 Agreement Reached!! Agreement is 3VTR[0]:VOTE:[3]:RND[56]Voter 0 Agreement Reached!! Agreement is 3!!!BYZANTINE REACHED FOR BLOB #2!!!VTR[1]:VOTE:[7]:RND[15]Voter 1 Agreement Reached!! Agreement is 7VTR[6]:VOTE:[7]:RND[15]Voter 6 Agreement Reached!! Agreement is 7VTR[5]:VOTE:[7]:RND[15]Voter 5 Agreement Reached!! Agreement is 7VTR[0]:VOTE:[7]:RND[15]Voter 0 Agreement Reached!! Agreement is 7VTR[2]:VOTE:[4]:RND[16]Voter 2 Agreement Reached!! Agreement is 7VTR[7]:VOTE:[4]:RND[16]Voter 7 Agreement Reached!! Agreement is 7VTR[4]:VOTE:[7]:RND[15]Voter 4 Agreement Reached!! Agreement is 7VTR[3]:VOTE:[7]:RND[16]Voter 3 Agreement Reached!! Agreement is 7!!!BYZANTINE REACHED FOR BLOB #3!!!....DoneFigure 16: Output (Truncated) of the Byzantine algorithm for BLOB mapping5. Future WorkMy research will focus on algorithms to improve the replication designs of Binary Large Objects that are identified by an XML documentWith the explosion of applications which make use of streaming media content to be delivered directly into intelligent devices ( e.g. Cell phones, laptops, PCs, handhelds), content that is usually composed in the form of playlists (XML documents), there is renewed interest in delivery mechanisms for this content.To simplify the understanding of our setup let us take a scenario of multiple Zune devices, a Microsoft music player, within a network. These devices can communicate with each other and exchange music. There are two alternatives to obtain music: They can purchase music or they could “squirt” via bluetooth music from another Zune device in their network. However, there is one limitation when you squirt music (data); namely, users can play it only a limited number of times and after that they need to squirt the music again. Alternatively some users may even choose to just purchase their favorite music.This results in three major issues coming forth:1.There is a considerable amount of bandwidth consumed each time data is squirted2.Each time a permanent copy of music is created on the new machine, there is amonetary cost from the download service.3.There may be no device with a permanent copy of the music needed withinsquirting distance.。